FCC ID: 2AJYU-8XN0002 Wi-Fi Module

W82 Hardware Design WIFI Module SIMCom Wireless Solutions Limited SIMCom Headquarters Building, Building 3, No. 289 Linhong Road, Changning District, Shanghai P.R. China Tel: 86-21-31575100 support@simcom.com www.simcom.com W82 Hardware Design V1.02 Document Title:

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GENERAL NOTES W82 Hardware Design 1.02 2022-12-07 Release SIMCOM OFFERS THIS INFORMATION AS A SERVICE TO ITS CUSTOMERS, TO SUPPORT APPLICATION AND ENGINEERING EFFORTS THAT USE THE PRODUCTS DESIGNED BY SIMCOM. THE INFORMATION PROVIDED IS BASED UPON REQUIREMENTS SPECIFICALLY PROVIDED TO SIMCOM BY THE CUSTOMERS. SIMCOM HAS NOT UNDERTAKEN ANY INDEPENDENT SEARCH FOR ADDITIONAL RELEVANT INFORMATION, INCLUDING ANY INFORMATION THAT MAY BE IN THE CUSTOMERS POSSESSION. FURTHERMORE, SYSTEM VALIDATION OF THIS PRODUCT DESIGNED BY SIMCOM WITHIN A LARGER ELECTRONIC SYSTEM REMAINS THE RESPONSIBILITY OF THE CUSTOMER OR THE CUSTOMERS SYSTEM INTEGRATOR. ALL SPECIFICATIONS SUPPLIED HEREIN ARE SUBJECT TO CHANGE. COPYRIGHT IS THE THIS DOCUMENT CONTAINS PROPRIETARY TECHNICAL PROPERTY OF SIMCOM WIRELESS SOLUTIONS LIMITED COPYING, TO OTHERS AND USING THIS DOCUMENT, ARE FORBIDDEN WITHOUT EXPRESS AUTHORITY BY SIMCOM. OFFENDERS ARE LIABLE TO THE PAYMENT OF INDEMNIFICATIONS. ALL RIGHTS RESERVED BY SIMCOM IN INFORMATION INCLUDING BUT NOT LIMITED TO THE PROPRIETARY TECHNICAL REGISTRATION GRANTING OF A PATENT , A UTILITY MODEL OR DESIGN. ALL SPECIFICATION SUPPLIED HEREIN ARE SUBJECT TO CHANGE WITHOUT NOTICE AT ANY TIME. INFORMATION WHICH SIMCom Wireless Solutions Limited SIMCom Headquarters Building, Building 3, No. 289 Linhong Road, Changning District, Shanghai P.R. China Tel: +86 21 31575100 Email: simcom@simcom.com For more information, please visit:

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https://www.simcom.com/ask/ or email to: support@simcom.com Copyright 2021 SIMCom Wireless Solutions Limited All Rights Reserved. www.simcom.com 2 / 36 W82 Hardware Design V1.02 Version History Date Version Description of change 2021-11-12 1.00 First edition 2022-06-13 1.01 2022-12-07 1.02 1.change Table 4 Power on timing and electronic characteristic 2.change Table 6 Sleep clock 3.change Figure2 and Table2 PIN67 to RESERVED 4.change Figure15 5.Modify the content of baking in chapter 5.7 6.Update some RF parameters in Table14,Table15, Table16 test report 1.Add VPH shutdown leakage current 2.Change the power supply pin name and typical values the 3.Add documents 4.Update some RF parameters in Table14,Table15, Table16,Table17 5.Change Table1 Transmitting power 6.Add power supply, PCle and RF layout guidelines list of appendix the to Author Zhengyin Wang Wangyaling Rui.Chen Zhongxi.Xiang Rui Chen www.simcom.com 3 / 36 W82 Hardware Design V1.02 Contents 1 2 3 4 Introduction ............................................................................................................................ 7 Product Outline .......................................................................................................................... 7 1.1 1.2 WCN Key features ..................................................................................................................... 7 1.3 Hardware Interface Overview .................................................................................................... 7 1.4 Hardware Block Diagram ........................................................................................................... 8 1.5 Feature Overview ....................................................................................................................... 8 1.6 W82 and SIM8260 Series Connect Diagram ........................................................................... 10 Package Information ............................................................................................................ 11 2.1 Pin Assignment Overview .........................................................................................................11 2.2 Mechanical Dimensions ........................................................................................................... 12 Interface Application ............................................................................................................ 13 3.1 Power Supply ........................................................................................................................... 13 3.2 Clock Interface ......................................................................................................................... 16 3.3 PCIe Interface .......................................................................................................................... 16 Antenna Interface ..................................................................................................................... 18 3.4 Frequency band ............................................................................................................ 18 Reference design for RF ............................................................................................... 18 Requirement for antenna installation ............................................................................ 20 3.4.1 3.4.2 3.4.3 Electrical Specifications ...................................................................................................... 20 4.1 Absolute Maximum Ratings ..................................................................................................... 20 4.2 Operating Conditions ............................................................................................................... 21 4.3 RF Characteristics.................................................................................................................... 21 4.4 ESD .......................................................................................................................................... 22 5 Manufacturing ...................................................................................................................... 24 5.1 Top and Bottom View of W82 .................................................................................................. 24 5.2 5.3 5.4 5.5 5.6 5.7 Label Description Information .................................................................................................. 24 Recommended PCB Footprint ................................................................................................. 25 Recommended SMT Stencil .................................................................................................... 27 Recommended SMT Reflow Profile ......................................................................................... 28 Moisture Sensitivity Level (MSL) ............................................................................................. 28 Baking Requirements ............................................................................................................... 29 6 7 Packaging ............................................................................................................................. 30 Appendix ............................................................................................................................... 32 7.1 Related Documents ................................................................................................................. 32 7.2 Terms and Abbreviations ......................................................................................................... 32 7.3 Safety Caution .......................................................................................................................... 33 www.simcom.com 4 / 36 W82 Hardware Design V1.02 Table Index Table 1Key features .................................................................................................................................. 8 Table 3: Power electronic characteristics ................................................................................................... 13 Table 4: Power on timing and electronic characteristic .............................................................................. 14 Table 5: Power off timing and electronic characteristic .............................................................................. 15 Table 6Sleep clock .................................................................................................................................. 16 Table 7PCIe Interface ............................................................................................................................. 17 Table 8Frequency band .......................................................................................................................... 18 Table 9Requirement for antenna installation .......................................................................................... 20 Table 10Absolute maximum ratings ....................................................................................................... 20 Table 11Power recommended operating ratings .................................................................................... 21 Table 121.8V digital I/O characteristics .................................................................................................. 21 Table 14Receive Sensitivity at 2.4G for 1X1 configuration .................................................................... 21 Table 15Receive Sensitivity at 5G for 1X1 configuration ....................................................................... 21 Table 16Receive Sensitivity at 6G for 1X1 configuration ....................................................................... 22 Table 17The ESD performance measurement table (Temperature25humidity45%) .............. 22 Table 18Label description of module information ................................................................................... 25 Table 19MSL ratings summary ............................................................................................................... 28 Table 20Baking requirements ................................................................................................................. 29 Table 21Tray size .................................................................................................................................... 31 Table 22Small carton size ....................................................................................................................... 31 Table 23Big carton size .......................................................................................................................... 31 Table 24Related documents ................................................................................................................... 32 Table 25Terms and abbreviations ........................................................................................................... 32 Table 26Safety caution ........................................................................................................................... 33 www.simcom.com 5 / 36 W82 Hardware Design V1.02 Figure Index Figure 1W82 hardware block diagram ..................................................................................................... 8 Figure 2W82 and SIM8260 Series connect diagram ............................................................................. 10 Figure 3Pin assignment ...........................................................................................................................11 Figure 4Dimensions of W82 (Unit: mm) ................................................................................................. 12 Figure 5Timing of power on .................................................................................................................... 14 Figure 6Timing of power off .................................................................................................................... 15 Figure 7Timing of 32KHz ........................................................................................................................ 16 Figure 9PCIe interface reference circuit ................................................................................................. 17 Figure 10Reference design of RF .......................................................................................................... 18 Figure 11Top and bottom view of W82 .................................................................................................. 24 Figure 12Label description of module .................................................................................................... 24 Figure 13Recommended PCB footprint ................................................................................................. 26 Figure 14Recommended SMT stenci ..................................................................................................... 27 Figure 15The ramp-soak-spike reflow profile of module ........................................................................ 28 Figure 16Packaging diagram.................................................................................................................. 30 Figure 17Tray drawing ............................................................................................................................ 30 Figure 18Small carton drawing ............................................................................................................... 31 Figure 19Big carton drawing................................................................................................................... 31 www.simcom.com 6 / 36 W82 Hardware Design V1.02 1 Introduction This document describes the electronic specifications, RF specifications, interfaces, mechanical characteristics and testing results of the W82 module. With the help of this document, in combination with our application manual and user guide, customers can quickly apply W82 module into wireless applications. 1.1 Product Outline The W82 is a small, low-power, low-cost Wi-Fi and Bluetooth module based on Qualcomm WCN6856 chipset. The module can be used in wireless routing, and other wireless terminals. The module is designed to be used together with SIMCom SIM8260 Series modules to establish WLAN and Bluetooth connections. 1.2 WCN Key features WCN Key features Compliant with IEEE 802.11a/b/g/n/ac/ax Supports 2x2 Multi-User Multiple-Input Multiple-Output (MU-MIMO) Dual Band Simultaneous (DBS), up to 3.6 Gbps data rate (2x2+2x2 11ax DBS) Tri-band 2.4 GHz/5 GHz/6 GHz support 20 MHz/40 MHz channel bandwidth for 2.4 GHz and 20 MHz/40 MHz/80 MHz/160 MHz channel bandwidth for 5 GHz/6 GHz Dynamic Frequency Selection (DFS, radar detection) Offloading traffic for minimal host utilization at 802.11ac/ax speeds Low-power PCIe (with L1 substate) interface Integrated close-loop power detector 1.3 Hardware Interface Overview W82 support the following interfaces:

Power supply One I2S interface One PCIe *1 lane interface www.simcom.com 7 / 36 W82 Hardware Design V1.02 One COEX_UART interface One 32KHz clock input interface Two WLAN antenna interfaces LAA/N79 control interfaces GPIOs NOTE 1. If unused I2S feature, please keep open. 1.4 Hardware Block Diagram The following figure shows the hardware block diagram of W82:

Figure 1W82 hardware block diagram 1.5 Feature Overview Table 1Key features Feature Power Supply Implementation VPH : 3.3~4.4 V VDD_VM: 1.22~1.42 V VDD_VL: 0.82~1.0 V VDD_VH: 1.8~2.1 V www.simcom.com 8 / 36 802.11a/b/g/n/ac/ax2.4GPA+Switch5G-6GPA+Switch76.8MHzXTALTxTxRxRxPowerLAA/N79WL_ENPCIe32KHzCOEX_UARTANT0ANT1GPIODIPLEXERDIPLEXER W82 Hardware Design V1.02 VDD_IO : 1.71~2.0 V 802.11b1,2,5.5,11Mbps 802.11g\a6,9,12,18,24,36,48,54Mbps 802.11n_HT20MCS0~MCS7 802.11n_HT40MCS0~MCS7 802.11ac_HT20: MCS0~MCS8 802.11ac_HT40: MCS0~MCS9 802.11ac_HT80: MCS0~MCS9 802.11ax_HT20: MCS0~MCS11 802.11ax_HT40: MCS0~MCS11 802.11ax_HT80: MCS0~MCS11 802.11ax_HT160:MCS0~MCS11 802.11b/11Mbps17dBm 802.11a/g/54Mbps17dBm 802.11n_HT20/MCS717dBm 802.11n_HT40/MCS717dBm 802.11ac_HT20/MCS817dBm 802.11ac_HT40/MCS917dBm 802.11ac_HT80/MCS917dBm 802.11ax_HT20/MCS1114dBm 802.11ax_HT40/MCS1114dBm 802.11ax_HT80/MCS1114dBm 802.11ax_HT160/MCS1114dBm IEEE 802.11a/b/g/n/ac/ax DSSS (1/2Mbps)CCK(1/2/5.5/11Mbps)OFDMA,OFDM 6/9/12/18/24/36/48/54Mbps,OFDM technology combined with BPSK, QPSK, 16-qam , 64-qam, 256-qam, 1024-qam; 4k-qam 820.11b adopts CCK and DSSS modulation technology Date Rate Transmitting power WLAN Standard Modulation Method PCIe Interface One lane PCIe interface, support PCIe Gen 3.0 UART Interface I2S Interface Antenna Interface Physical characteristics Temperature range One UART interface Data rate up to 3.2 Mbps One I2S interface, the I2S also can be configured as PCM 2X2+2X2 Size24.0mm*17.0mm*2.6mm Weight2.1g Normal operation-30C ~ +70C Storage temperature-40C ~ +90C NOTE 1. For detailed data, please refer to the test report in the related documents in the appendix 2. I2S Interface default software does not support www.simcom.com 9 / 36 W82 Hardware Design V1.02 1.6 W82 and SIM8260 Series Connect Diagram The following figure shows the connect diagram of W82 and SIM8260 Series, the details please refer the SIM8260 Series reference design. Figure 2W82 and SIM8260 Series connect diagram NOTE 1. Gray network to be confirmed after debugging www.simcom.com 10 / 36 PCIe_TX0_MPCIe_TX0_PPCIe_RX0_PPCIe_RX0_MPCIe_REFCLK_MPCIe_REFCLK_PPCIe_WAKEPCIe_RSTPCIe_CLKREQWL_VDD_VMWL_VDD_VLWL_VDD_VHVDD_EXTPCIe_RXMPCIe_RXPPCIe_TXPPCIe_TXMPCIe_CLKMPCIe_CLKPPCIe_WAKEPCIe_RSTPCIe_CLKREQVDD_VMVDD_VLVDD_VHVDD_IOModuleW82VPHVBATCLK_IN_32KSLEEP_CLKCOEX_UART_TXCOEX_UART_RXWL_LAA_TX_ENWL_TX_ENWL_SW_CTRLWL_LAA_RXWL_PA_MUTINGWL_LAA_ASWLAN_ENWL_TXEN_TO_N79N79_TO_WL_TXENCOEX_UART_RXDCOEX_UART_TXDLAA_TXENWL_TXEN_LAASW_CTRLLAA_RXPA_MUTELAA_AS_ENWL_ENWLTXEN_TO_N79N79_TO_WLTXEN W82 Hardware Design V1.02 2 Package Information 2.1 Pin Assignment Overview All functions of the W82 will be provided through 90 pins that will be connected to the customers platform. The following figure the pin assignment of the W82. Figure 3Pin assignment www.simcom.com 11 / 36 RESERVED14131211109876543213637383940414243444546474849151617181920212223242526272829303132333435706968676665646362616059585756555453525150RESERVEDGNDGNDANT0GNDGNDGNDGNDANT1GNDGNDGNDGNDVPHVPHLAA_TX_ENGNDWL_TXEN_LAALAA_RXLAA_AS_ENPA_MUTEWL_ENRESERVEDVDD_VHGNDVDD_VMGNDVDD_VLVDD_IOGNDPCIe_RXMPCIe_RXPGNDPCIe_CLKMPCIe_CLKPGNDPCIe_TXPPCIe_TXMGNDPCIe_CLKREQPCIe_WAKEPCIe_RSTGNDRESERVEDSW_CTRLN79_TO_WLTXENCOEX_UART_TXDGNDUART_TXDCOEX_UART_RXDUART_CTSUART_RXDGNDUART_RTSI2S_CLKI2S_DINI2S_DOUTI2S_WSCLK_IN_32KGNDGND7372717874777675878386858490898880827981RESERVEDRESERVEDRESERVEDRESERVEDRESERVEDRESERVEDRESERVEDWLTXEN_TO_N79RESERVEDRESERVEDRESERVEDGNDGNDGNDGNDGNDGNDGNDGNDGNDGNDGNDGNDRESERVEDGNDRESERVEDRESERVEDRESERVED W82 Hardware Design V1.02 2.2 Mechanical Dimensions The following figure shows the mechanical dimensions of W82. Figure 4Dimensions of W82 (Unit: mm) www.simcom.com 12 / 36 W82 Hardware Design V1.02 3 Interface Application 3.1 Power Supply Ensure the module works properly, all power and GND pins should be connected; when all powers are supplied W82 will work well together with SIM8260 Series modules. When W82 and SIM8260 Series modules are actually used together, the following current consumption data in Table 3 is measured:

Table 2: Power electronic characteristics Symbol Description Min. Typ. Max. Unit VPH Module VPH current in power off mode Module VPH power supply voltage. Module VPH peak current. 3.3

3.8 55

Module VDD_VM power supply voltage. 1.22 1.35 Module VDD_VM peak current.

Module VDD_VL power supply voltage. 0.82 0.95 Module VDD_VL peak current. Module VDD_VH power supply voltage. Module VDD_VH peak current. Module VDD_IO power supply voltage. Module VDD_IO peak current.

1.8

1.71

1.95

1.8

VDD_VM VDD_VL VDD_VH VDD_IO NOTE 4.4

1.2 1.42 0.6 1.0 1.7 2.1 0.6 2.0 10 V uA A V A V A V A V mA Test conditions:

1. The mounting capacitance on the VPH network is 10uF+100nF+33pF. 2. The mounting capacitance on the VDD_VM network is 10uF+1uF +100nF. 3. The mounting capacitance on the VDD_VL network is 10uF+1uF +100nF. 4. The mounting capacitance on the VDD_VH network is 10uF+1uF+100nF. 5. The mounting capacitance on the VDD_IO network is 1uF +100nF. 6. VDD_VL layout PCB ESR<5m www.simcom.com 13 / 36 W82 Hardware Design V1.02 Power supply layout guidelines:

The closer the WIFI module and 5G module are placed, the shorter the power be route, the smaller the DC ESR and DC voltage drop of the power will be. At the same time, the influence of the close distance between WIFI module and 5G module on the thermal design should also be considered. The width of the VPH power supply trace of the WIFI module needs to be greater than 1.5MM. The VDD_VM (10uF+1uF +100nF) capacitor are placed close to the WIFI module, and the trace width is greater than 0.6mm. The VDD_VL (10uF+1uF +100nF) capacitors are placed close to the WIFI module, the trace width is greater than 2mm, PCB_route requires DC ESR<5m. The VDD_VH (10uF+1uF +100nF) capacitor are placed close to the WIFI module, and the trace width is greater than 0.6mm. Timing of power on Figure 5Timing of power on Table 3: Power on timing and electronic characteristic Symbol Parameter Min Typ Max Unit T1 T2 T3 T4 T5 The time from power-on action to VDD_VH, The time from power-on action to VDD_VM ready. The time from power-on action to VDD_VL ready. The time from power-on action to VDD_IO, The time from power-on action to SLEEP_CLOCK ready. The time of W82 initialize. The time from power-on action to W82 initialize. The time from power-on action to WLAN enable.

8.40 ms 9.48 ms 9.80 ms 11.45 ms 16.00 ms 13 6.6 7.3

ms s s NOTE www.simcom.com 14 / 36 WL_ENT1T2T4T5T3PWRKEYVPHVDD_VHVDD_VL/VDD_VM/VDD_IOSLEEP_CLOCK W82 Hardware Design V1.02 1.The PWRKEY is the control signal of SIM8260 Series series modules. 2. The T3, T4 and T5 time sequence are based on the data tested by the SIM8260C standard software version. The time sequence may vary with different software versions. Timing of power off Figure 6Timing of power off Table 4: Power off timing and electronic characteristic Symbol Parameter Min. Typ. Max. Unit T1 T2 T3 The time from power-off action to W82 disable. The time from power-off action to VDD_IO, SLEEP_CLOCK close. The time from power-off action to VDD_VH, VDD_VL, VDD_VM close.

3.5 6 6.2

s s s NOTE 1. The PWRKEY is the control of SIM8260 Series series modules. 2. The T1, T2, T3 time sequence are based on the data tested by the SIM8260C standard software version. The time sequence may vary with different software versions. www.simcom.com 15 / 36 WL_ENPWRKEYT2T1T3VDD_VHVDD_VL/VDD_VM/VPHVDD_IOSLEEP_CLOCK W82 Hardware Design V1.02 3.2 Clock Interface The 32KHz clock is for sleep mode of Bluetooth, the routing line of it should be as short as possible and also need GND protection, and keep it away from interference sources such as power, RF and high-speed signals. Figure 7Timing of 32KHz Table 5Sleep clock Symbol Parameter T(xoh) T(xol) T F Sleep clock logic high Sleep clock logic low Sleep clock period Sleep clock frequency Min. 4.58 4.58 30.508 32.758 Typ. 15.259 15.259 30.518 32.768 Max. 25.94 25.94 30.527 Unit us us us 32.778 KHz Vpp Peak-to-peak voltage 1.7 1.8 1.95 V 3.3 PCIe Interface PCIe is for communication with SIM8260 Series modules, which required differential trace impedance is 8510%, and the following figure is the PCIe reference circuit:

www.simcom.com 16 / 36 TxohTxolTVppAverage(DC component) W82 Hardware Design V1.02 Figure 8PCIe interface reference circuit Table 6PCIe Interface Pin name PCIe_RXM PCIe_RXP PCIe_CLKM PCIe_CLKP PCIe_TXM PCIe_TXP PCIe_RST PCIe_CLKREQ PCIe_WAKE Pin number 38 I/O

Description PCIe receive minus Comment 39 41 42 44 45 49 47 48

DI DO DO PCIe receive plus PCIe reference clock minus PCIe reference clock plus Required 85 differential impedance PCIe transmit minus PCIe transmit plus PCIe reset. PCIe clock request. PCIe wake-up These pins have been pulled up to 1.8V internally The PCIe layout guidelines:

All high-speed or sensitive signals shall be far away from PCIE to prevent interference. PCIE_RX0_P/M, PCIE_RX1_P/M, PCIE_TX0_P/M, PCIE_TX1_P/M, PCIE_REFCLK_P/M 5 groups of respective difference 85 impedance control, and the differential line intralane match is less than 0.5mm, trace length <200mm. In the case of serpentines, one line of a differential pair must be routed to make up a length delta, then it must be routed at the source (breakout) this ensures that lines stay differential thereafter. PCIE_RX0_P/M, PCIE_RX1_P/M, equal-length control is required only for 2 groups to use at the same time, the intra-lane length mismatch is less than 1mm; PCIE_TX0_P/M, PCIE_TX1_P/M, equal-length control is required only for 2 groups to use at the same time, the intra-lane length www.simcom.com 17 / 36 SIM8260X SeriesW82 Module220nFPCIE_REFCLK_MPCIE_REFCLK_PHST_PCIE_WAKEHST_PCIE_RSTHST_PCIE_CLKREQHST_PCIE_RXMHST_PCIE_RXPHST_PCIE_CLKMHST_PCIE_CLKP10K10KPCIE_WAKEPCIE_RSTPCIE_CLKREQPCIE_TX0_MPCIE_TX0_PPCIE_RX0_MPCIE_RX0_PHST_PCIE_TXMHST_PCIE_TXP220nF220nF220nF+1.8V W82 Hardware Design V1.02 mismatch is less than 1mm. Equal length control is not required between PCIE_TX, PCIE_RX PCIE_REFCLK groups. The AC capacitor of PCIE in series shall be close to the output terminal to ensure signal integrity. The two AC capacitors on the same pair of differential lines should be placed in close parallel, otherwise it may affect the signal integrity and cause EMI problems. The line distance between PCIE differential pairs and other signal lines shall not be less than 4x line width. The differential signal shall first route in the inner layer and be surrounded by GND to ensure continuous reference plane and avoid impedance discontinuity. To maintain impedance balance, maintain positive and negative traces as balanced as possible in terms of the signal and its return path. 3.4 Antenna Interface Pin7 and pin12 are for antenna, the characteristic impedance is 50. 3.4.1 Frequency band Table 7Frequency band Parameter Frequency range Value 2412~2462 5180~5320 5500~5700 5745~5825 5995~7115 Unit MHz MHz MHz MHz MHz 3.4.2 Reference design for RF Figure 9Reference design of RF www.simcom.com 18 / 36 W82 Hardware Design V1.02 W82 provides two RF welding disc interfaces for connecting external antennas. The RF wiring connected to the module RF antenna welding disc is made with a micro-strip line or other type impedance line. The impedance must be controlled at about 50, and the routing line is as short as possible. In order to obtain better RF performance, two GND pads on each side of the RF interface are needed. Figure 10 Impedance Calculation Figure 11 50ohm impedance line Use an impedance simulation tool to accurately control the characteristic impedance of RF traces to 50 GND pins adjacent to RF pins should not be designed as thermal relief pads, and should be fully connected to ground. Clearance between RF pins and RF connector should be as short as possible, and all right-angle

(90) traces should be changed to the ones with the angle of 135. There should be clearance under the signal pin of the antenna connector or solder joint. The reference ground of RF traces should be complete. Meanwhile, ground vias around RF traces and the reference ground can improve RF performance. The clearance between ground vias and R traces should be at least twice the width of RF signal traces (2 x W). Keep RF traces away from interference sources, and avoid intersection and paralleling between any traces on adjacent layers. www.simcom.com 19 / 36 W82 Hardware Design V1.02 3.4.3 Requirement for antenna installation Table 8Requirement for antenna installation Parameter Frequency range SWR Line loss GaindBi Input impedance Direction Requirement 2412~2462MHz 5180~5320MHz 5500~5700MHz 5745~5825MHz 5995~7115MHz 2:1

<1dB 3.99 50 Vertical The EUT have two RF welding disc interfaces for connecting external antennas and contain the two unique antenna connectors. Antenna type is Sector Glue Stick Antenna; Two antenna ports use same antennas. The max antenna gain is 2.4G: 2.97dBi, UNII 1: 3.50dBi, UNII 2C: 3.94dBi, UNII 3: 3.52dBi, UNII 5: 3.99dBi, UNII 6: 3.29dBi, UNII 7: 3.95dBi, UNII 8: 3.82dBi. 4 Electrical Specifications 4.1 Absolute Maximum Ratings Table 9Absolute maximum ratings Parameter VPH Description Power for PA VDD_VM VDD_VL VDD_VH VDD_IO Power for PCIe and RFA Power for RFA and others Power for PCIe and RFA Power for IO Min

Type Max

4.8 Unit V

1.5 1.1 2.1 2.0 V V V V www.simcom.com 20 / 36 W82 Hardware Design V1.02 4.2 Operating Conditions Table 10Power recommended operating ratings Parameter VPH Description Power for PA VDD_VM VDD_VL VDD_VH VDD_IO Power for PCIe and RFA Power for RFA and others Power for PCIe and RFA Power for IO Min 3.3 1.22 0.82 1.8 1.71 Type Max 3.8 4.4 Unit V 1.35 0.95 1.95 1.8 1.42 1.0 2.1 2.0 V V V V Table 111.8V digital I/O characteristics Parameter VIH VIL VOH VOL Description Input high level Input low level Output high level Output low level Min 1.26 0 1.35 0 Type Max

2.1 0.54 1.8 0.45 Unit V V V V 4.3 RF Characteristics Table 12Receive Sensitivity at 2.4G for 1X1 configuration Band 2.4G 11b@11 Mbps 2.4G 11g@6Mbps 2.4G 11g@54Mbps 2.4G 11n/ac@HT20-MCS0 2.4G 11n/ac@HT20-MCS7 2.4G 11n/ac@HT40-MCS0 2.4G 11n/ac@HT40-MCS7 2.4G 11ax@HE20-MCS0 2.4G 11ax@HE20-MCS11 2.4G 11ax@HE40-MCS0 2.4G 11ax@HE40-MCS11 Type

-89.4

-93.6

-75.8

-93.7

-74.6

-89.7

-70.2

-96.7

-65.4

-93.6

-63.4 Table 13Receive Sensitivity at 5G for 1X1 configuration Band 5G 11a@6Mbps 5G 11a@54Mbps Type

-96.3

-78.8 Unit dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm Unit dBm dBm www.simcom.com 21 / 36 W82 Hardware Design V1.02 5G 11n@HT20-MCS0 5G 11n@HT20-MCS7 5G 11n@HT40-MCS0 5G 11n@HT40-MCS7 5G 11ac@VHT20-MCS8 5G 11ac@VHT40-MCS9 5G 11ac@VHT80-MCS9 5G 11ax@HE20-MCS0 5G 11ax@HE20-MCS11 5G 11ax@HE40-MCS0 5G 11ax@HE40-MCS11 5G 11ax@HE80-MCS0 5G 11ax@HE80-MCS11 5G 11ax@HE160-MCS0 5G 11ax@HE160-MCS11

-95.7

-76.7

-92

-73.5

-72.5

-67.9

-68

-97

-65

-93

-63

-90

-61

-89

-59 Table 14 Receive Sensitivity at 6G for 1X1 configuration Band 6G 11ax@HE20-MCS0 6G 11ax@HE20-MCS11 6G 11ax@HE40-MCS0 6G 11ax@HE40-MCS11 6G 11ax@HE80-MCS0 6G 11ax@HE80-MCS11 6G 11ax@HE160-MCS0 6G 11ax@HE160-MCS11 4.4 ESD Type

-97.4

-65.4

-93

-65.1

-89.5

-65.3

-87

-56.2 dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm Unit dBm dBm dBm dBm dBm dBm dBm dBm Module is sensitive to ESD in the process of storage, transporting, and assembling. When Module is mounted on the customers main board, the ESD components should be placed beside the connectors which human body may touch, such as switches, USB interface, etc. The following table shows the Module ESD measurement performance. Table 15The ESD performance measurement table (Temperature25humidity45%) Parameter GND Power Antenna PCIe Connectkv 3 2 2 2 Airkv 6 5 5 4 www.simcom.com 22 / 36 W82 Hardware Design V1.02 2 2 2 4 4 4 I2S UART Other PADs NOTE Test conditions:

1. Test conditions: the external of the module has surge protection diodes and ESD protection diodes 2. The data in Table 18 were tested using SIMCom EVB. www.simcom.com 23 / 36 W82 Hardware Design V1.02 5 Manufacturing 5.1 Top and Bottom View of W82 Figure 10Top and bottom view of W82 5.2 Label Description Information A B D C E Figure 11Label description of module www.simcom.com 24 / 36 W82 Hardware Design V1.02 Table 16Label description of module information No. A B C D E NOTE Description LOGO Project name Product code Serial number QR code Figure 11 and Figure 12 are the effect diagrams of the module, for reference only. Please refer to the actual product for appearance. 5.3 Recommended PCB Footprint The following figure shows the PCB footprint of W82. www.simcom.com 25 / 36 W82 Hardware Design V1.02 Figure 12Recommended PCB footprint NOTE FDRBIDDEN AREA requires that the TOP layer cannot be layout. See W82 module recommended package for details www.simcom.com 26 / 36 W82 Hardware Design V1.02 5.4 Recommended SMT Stencil The following figure shows the SMT stencil of W82. Figure 13Recommended SMT stenci www.simcom.com 27 / 36 W82 Hardware Design V1.02 5.5 Recommended SMT Reflow Profile SIMCom provides a typical soldering profile. Therefore, the soldering profile shown below is only a generic recommendation and should be adjusted to the specific application and manufacturing constraints. Figure 14The ramp-soak-spike reflow profile of module 5.6 Moisture Sensitivity Level (MSL) Module is susceptible to damage induced by absorbed moisture and high temperature. A packages moisture-sensitivity level (MSL) indicates its ability to withstand exposure after it is removed from its shipment bag, while it is on the factory floor awaiting PCB installation. A low MSL rating is better than a high rating; a low MSL device can be exposed on the factory floor longer than a high MSL device. All pertinent MSL ratings are summarized in Table 20. Table 17MSL ratings summary MSL Out-of-bag floor life 1 2 2a 3 4 5 5a Unlimited 1 year 4 weeks 168 hours 72 hours 48 hours 24 hours Comments

+30 /85% RH

+30 /60% RH

+30 /60% RH

+30 /60% RH

+30 /60% RH

+30 /60% RH

+30 /60% RH www.simcom.com 28 / 36 W82 Hardware Design V1.02 6 Mandatory bake before use. After bake, it must be reflowed within the time limit specified on the label.

+30 /60% RH Module is qualified to Moisture Sensitivity Level (MSL) 3 in accordance with JEDEC J-STD-033. NOTE IPC / JEDEC J-STD-033 standard must be followed for production and storage. 5.7 Baking Requirements Module is vacuum packed. Under ambient conditions of temperature <40 degrees and relative humidity

<90%. Shelf life is 6 months when unopened and the vacuum bag is not leaking. If any of the following three conditions are met, the module should be fully baked before reflow soldering, otherwise the module may cause permanent damage during the reflow soldering process. The vacuum packaging is damaged or leaked In the case of vacuum packaging in good condition. When the vacuum packaging is opened, the storage time has exceeded 6 months (from the date of packaging) In the case of vacuum packaging in good condition. When the vacuum packaging is opened, the storage time does not exceed 6 months (calculated from the date of packaging), but after opening the packaging, the storage time in the workshop with temperature <30 degrees and relative humidity <60%

exceeds 168 hours. If the module exceeds the specified time limit, it must be baked. The baking conditions are as follows Table 21. Special attention that plastic tray is not heat-resistant, and only can be baked at 45 C. When the baking temperature is 120 degrees, the original tray of the module cannot be used, otherwise baking will damage the tray. Table 18Baking requirements Baking conditions options 40C5C, <5% RH 120C5C, <5% RH Duration 192 hours 8 hours Remark The original tray cannot be used www.simcom.com 29 / 36 W82 Hardware Design V1.02 6 Packaging Module support tray packaging. The packaging process is shown in the following figures. Module tray drawing Figure 15Packaging diagram Figure 16Tray drawing www.simcom.com 30 / 36 W82 Hardware Design V1.02 Table 19Tray size Length3mm 242.0 Small carton drawing Width3mm 161.0 Number 25 Table 20Small carton size Figure 17Small carton drawing Length10mm Width10mm 270 Big carton drawing 180 Height10mm Number 25*20=500 120 Table 21Big carton size Figure 18Big carton drawing Length10mm Width10mm 380 280 Height10mm Number 280 500*4=2000 www.simcom.com 31 / 36 W82 Hardware Design V1.02 7 Appendix 7.1 Related Documents Table 22Related documents NO Title Description

[1]

[2]

[3]

[4]

SIM8260 Series-LGA_KDL W82 Hardware Baseband Test Report W82 Hardware RF Test Report W82 Hardware Data Transmission Test Report W82 and SIM8260 Series reference design W82 Hardware Baseband Test Report W82 Hardware RF Test Report W82 Hardware Data Transmission Test Report 7.2 Terms and Abbreviations Table 23Terms and abbreviations Abbreviation Description BPSK B CCK DSSS NC ESD I/O Mbps MCS OFDM QAM QPSK RF RX TX VSWR Binary Phase Shift Keying Bidirectional digital input Complementary Code Keying Direct Sequence Spread Spectrum Not connect Electrostatic Discharge Input/Output Million Bits Per Second Modulation and Coding Scheme Orthogonal Frequency Division Multiplexing Quadrature Amplitude Modulation Quadrature Phase Shift Keying Radio Frequency Receive Direction Transmitting Direction Voltage Standing Wave Ratio www.simcom.com 32 / 36 W82 Hardware Design V1.02 WLAN LAA MIMO I2S PCIe UART Wireless Local Area Networks Limited Access Authorization Multiple Input Multiple Output Inter-IC Sound Peripheral Component Interface Express Universal Asynchronous Receiver Transmitter 7.3 Safety Caution Table 24Safety caution Marks Requirements When in a hospital or other health care facility, observe the restrictions about the use of mobiles. Switch the cellular terminal or mobile off, medical equipment may be sensitive and not operate normally due to RF energy interference. Switch off the cellular terminal or mobile before boarding an aircraft. Make sure it is switched off. The operation of wireless appliances in an aircraft is forbidden to prevent interference with communication systems. Forgetting to think much of these instructions may impact the flight safety, or offend local legal action, or both. Do not operate the cellular terminal or mobile in the presence of flammable gases or fumes. Switch off the cellular terminal when you are near petrol stations, fuel depots, chemical plants or where blasting operations are in progress. Operation of any electrical equipment in potentially explosive atmospheres can constitute a safety hazard. Your cellular terminal or mobile receives and transmits radio frequency energy while switched on. RF interference can occur if it is used close to TV sets, radios, computers or other electric equipment. Road safety comes first! Do not use a hand-held cellular terminal or mobile when driving a vehicle, unless it is securely mounted in a holder for hands free operation. Before making a call with a hand-held terminal or mobile, park the vehicle. GSM cellular terminals or mobiles operate over radio frequency signals and cellular networks and cannot be guaranteed to connect in all conditions, especially with a mobile fee or an invalid SIM card. While you are in this condition and need emergent help, please remember to use emergency calls. In order to make or receive calls, the cellular terminal or mobile must be switched on and in a service area with adequate cellular signal strength. Some networks do not allow for emergency call if certain network services or phone features are in use (e.g. lock functions, fixed dialing etc.). You may have to deactivate those features before you can make an emergency call. Also, some networks require that a valid SIM card be properly inserted in the cellular terminal or mobile. www.simcom.com 33 / 36 W82 Hardware Design V1.02 The following warning statements:

This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and

(2) this device must accept any interference received, including interference that may cause undesired operation. Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

-- Reorient or relocate the receiving antenna.

-- Increase the separation between the equipment and receiver.

-- Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.

-- Consult the dealer or an experienced radio/TV technician for help. FCC regulations restricted the operation of this device to indoor use only. List of applicable FCC rules. This module has been tested for compliance with FCC Part 15 Subpart C (15.247) and Subpart E

(15.407). Limited module procedures This device is only authorized for use with the specific antennas used for the DFS compliance tests. The antennas information, see the section 3.4.3. Exposure to Radio Frequency Radiation. This equipment must be installed and operated in accordance with provided instructions, and the antenna(s) used for this transmitter must be installed to provide a separation distance of at least 20 cm from all persons and must not be collocated or operating in conjunction with any other antenna or transmitter. End-users and installers must be provided with antenna installation instructions and transmitter operating conditions for satisfying RF exposure compliance. This Modular Approval is limited to OEM installation for mobile and fixed applications only. www.simcom.com 34 / 36 W82 Hardware Design V1.02 The antenna installation and operating configurations of this Modular, including any applicable source-based time averaging duty factor, antenna gain and cable loss must satisfy MPE categorical Exclusion Requirements of 2.1091. if the host is marketed so that end users do not have straight forward commonly used methods for access to remove the module so that the FCC ID of the module is visible; then an additional permanent label referring to the enclosed module: Contains Transmitter Module FCC ID: 2AJYU-8XN0002 or Contains FCC ID: 2AJYU-8XN0002 must be used. Operation of transmitter is in the 5925-7125MHz band is prohibited for control of or communications with unmanned aircraft systems. Operation of device is prohibited on oil platforms, cars, trans, boats and aircraft except that operation of this device is permitted in large aircraft while flying above 10,000 feet. RF Soft restrictions for UNII 5/6/7/8 a. Contention-Based Protocol, as demonstrated in the test report, is permanently embedded in the module and is not host-dependent. b. The device will only associate and connect with a low-power indoor access point or subordinate device and never directly connect to other client devices. c. This device will always initiate transmission under the control of a low-power indoor AP or subordinate except for brief transmissions before joining a network. These short messages will only occur if the client has detected an indoor AP or subordinate operating on a channel. These brief messages will have a time-out mechanism such that if it does not receive a response from an AP it will not continually repeat the request. d. Transmissions will be lower or equal to the power advertised by the indoor low-power access point or subordinate and never above the maximum output power allowed by the FCC grant for equipment class 6XD. Part 15 Subpart B disclaimer This transmitter module is tested as a subsystem and its certification does not cover the FCC Part 15 Subpart B rule requirement applicable to the final host. The final host will still need to be reassessed for compliance to this portion of rule requirements if applicable. As long as all conditions above are met, further transmitter test will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed. Manual Information to the End User The end user manual shall include all required regulatory information/warning as shown in this document. The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the users manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as www.simcom.com 35 / 36 W82 Hardware Design V1.02 show in this manual. The host integrator must follow the integration instructions provided in this document and ensure that the composite-system end product complies with the requirements by a technical assessment or evaluation to the rules and to KDB Publication 996369. The host integrator installing this module into their product must ensure that the final composite product complies with the requirements by a technical assessment or evaluation to the rules, including the transmitter operation and should refer to guidance in KDB 996369. OEM/Host manufacturer responsibilities OEM/Host manufacturers are ultimately responsible for the compliance of the Host and Module. The final product must be reassessed against all the essential requirements of the FCC rule such as FCC Part 15 Subpart B before it can be placed on the US market. This includes reassessing the transmitter module for compliance with the Radio and EMF essential requirements of the FCC rules. This module must not be incorporated into any other device or system without retesting for compliance as multi-radio and combined equipment. www.simcom.com 36 / 36

W82_V2.0_220928 1.37mm 21.4mm 14.4mm 0.2mm 0.3mm

:SX0307000204 9.6mm W82 S2-xxxxx Sn:xxxxxxxxxxxxxxx FCC ID:2AJYU-8XN0002 W82 S2-xxxxx Sn:xxxxxxxxxxxxxxx FCC ID:2AJYU-8XN0002 1:1 4mm 0.5mm 0.5mm 1.5mm 2.5mm 6mm 1mm 6mm 2mm 1mm 4mm 4mm lable location

CERTIFICATION DESIGNATING A U.S. AGENT FOR SERVICE OF PROCESS Date:23/05/2023 Federal Communications Commission Authorization and Evaluation Division 7435 Oakland Mills Road Columbia, Maryland 21046 FCC ID:

To Whom It May Concern:

As required by section 2.911(d)(7), we [SIMCom Wireless Solutions Limited, 0025948449

] certifies that we acknowledge the designation of a contact located in the United States for purposes of acting as the applicants agent for service of process. We [SIMCom Wireless Solutions Limited] accepts to maintain an agent for no less than one year after the grantee has terminated all marketing and importation or the conclusion of any Commission-related proceeding involving the equipment. As required by section 2.911(d)(7), we [Lucky Cowboy Global Sercices,LLC, 2213 S.Braeawood BLVD.#12E Houston,TX 77030 USA,0033510934]] certifies that we acknowledge our obligation acting as the applicants agent for service of process for the above referenced FCC ID. We [Lucky Cowboy Global Sercices,LLC ] confirm that we are not associated with or part of any TCB or FCC recognised test lab. Thank you for your attention to this matter. Sincerely yours, Signature by applicant Yoaleng Printed Name:Yongsheng Li Company:SIMCom Wireless Solutions Limited Signature by designated agent (if different from applicant) louie Ga _|

Printed Name:Louie Liu Company:Lucky Cowboy Global Sercices,LLC FRN:0033510934 Job Title:Manager Email:info@luckycowboyglobalservices.com _|

Telephone: +1(713)992-3369 Job Title: Manager Email:Yongsheng Li@simcom.com Telephone:86 21 3157 5100 FHS REE

SIMCom Wireless Solutions Limited CERTIFICATIONS CONCERNING COVERED EQUIPMENT Date:23/05/2023 Federal Communications Commission Authorization and Evaluation Division 7435 Oakland Mills Road Columbia, Maryland 21046 FCC ID:2AJYU-8XN0002 To Whom It May Concern:

As required by section 2.911(d)(5)(i), [SIMCom Wireless Solutions Limited] (the applicant) certifies that the equipment for which authorization is sought is not covered equipment prohibited from receiving an equipment authorization pursuant to section 2.903 of the FCC rules. As required by section 2.911(d)(5)(ii), [SIMCom Wireless Solutions Limited] (the applicant) certifies that, as of the date of the filing of the application, the applicant [is not ] identified on the Covered List as an entity producing covered equipment. Thank you for your attention to this matter. Sincerely yours, Signature Printed Name:Yongsheng Li Company:SIMCom Wireless Solutions Limited Job Title:manager Email:Yongsheng Li@simcom.com Telephone: 86 21 3157 5100

SIMCom Wireless Solutions Limited LETTER OF AGENCY Date: 05/06/2023 Element Materials Technology 100 Frobisher Business Park Malvern Worcestershire WR14 1BX UK FCC ID: 2AJYU-8XN0002 To Whom It May Concern:

We certify that we are not subject to denial of federal benefits, that includes FCC benefits, pursuant to Section 5301 of the Anti-Drug Abuse ACT of 1988, U.S.C. 862. Further, no party, as defined in 47 CFR 1.2002(b), to the application, is subject to denial of federal benefits, that includes FCC benefits. Thank you for your attention to this matter. Yours faithfully company Signature Printed Name:Yongshengli, Company:SIMCom Wireless Solutions Limited Job Title:manager Email:Yongsheng Li@simcom.com Telephone: 86 21 3157 5100

Sample Request for Confidentiality Letter-FCC SIMCom Wireless Solutions Limited Date 03/02/2023 Federal Communications Commission Authorization and Evaluation Division 7435 Oakland Mills Road Columbia, Maryland 21046 Re: Request for confidentiality FCC ID: 2AJYU-8XN0002 To whom it may concern, We hereby respectfully request that under the provision of 47 CFR 0.459 and 0.457(d) the documents listed below and attached with this application for certification be provided with confidential status. Schematics.pdf Operational Description.pdf Frequency Block Diagrams.pdf FCC SW SECURITY DESCRIPTION letter Any exhibit / information for which we have requested confidentiality, but which may not be accorded such treatment by the FCC, should be returned to us. The documents listed above contain trade secrets that are treated as confidential by us. Substantial competitive harm to us could result should they be made available to the public. Sincerely, Name Yongshengli Job Title manager

SIMCom Wireless Solutions Limited LETTER OF AGENCY Date: 05/06/2023 Element Materials Technology 100 Frobisher Business Park Malvern Worcestershire WR14 1BX UK FCC ID: 2AJYU-8XN0002 To Whom It May Concern:

We certify that we are not subject to denial of federal benefits, that includes FCC benefits, pursuant to Section 5301 of the Anti-Drug Abuse ACT of 1988, U.S.C. 862. Further, no party, as defined in 47 CFR 1.2002(b), to the application, is subject to denial of federal benefits, that includes FCC benefits. Thank you for your attention to this matter. Yours faithfully company Signature Printed Name:Yongshengli, Company:SIMCom Wireless Solutions Limited Job Title:manager Email:Yongsheng Li@simcom.com Telephone: 86 21 3157 5100

MODULAR APPROVAL LETTER

[SIMCom Wireless Solutions Limited]

[05/06/2023]

Dear Application Examiner:

[SIMCom Wireless Solutions Limited, W82, 2AJYU-8XN0002] is seeking a limited modular approval. The radio does not meet all requirements for modular approval as detailed in FCC 15.212. Compliance to each of the requirements is described below:

1. 2. 3. 4. 5. 6. 7. The modular transmitter must have its own RF shielding. The radio portion of the module is contained in its own RF shielding. The shielding is installed at the factory. Please see the Internal Photos exhibit. The modular transmitter must have buffered modulation/data inputs. The EUT has buffered data inputs to insure compliance with Part 15 requirements under conditions of excessive data rates or over-modulation. Please see the Schematics exhibit. The modular transmitter must have its own power supply regulation. The EUT has its own power supply regulation to insure compliance with Part 15 requirements regardless of the quality or level of external DC supplying the module from the host unit. Please see Schematics exhibit. Also, the technical report exhibit contains AC power line conducted emissions data taken with the EUT powered from a linear power supply that contains no EMC suppression components. The modular transmitter must comply with the antenna requirements of Section 15.203 and 15.204(c). The EUT have two RF welding disc interfaces for connecting external antennas and contain the two unique antenna connectors. Antenna type is Sector Glue Stick Antenna (External Detachable); The more information see the user manual and antenna specification.. The modular transmitter must be tested in a stand-alone configuration. The EUT was tested in a stand-alone configuration. The module was greater than 10 cm from the host device. Please see test setup photos exhibit and technical report exhibit. The modular transmitter must be labeled with its own FCC ID number. The EUT is labeled with its own FCC ID number. Please see FCC ID label & location exhibit. If the FCC ID number will not be visible when the module is installed inside a host device, another label with the FCC ID will be applied to the exterior of the host device. The modular transmitter must comply with any specific rule or operating requirements applicable to the transmitter and the manufacturer must provide adequate instructions along with the module to explain any such requirements. The EUT is compliant with all applicable FCC rules. Detail instructions for maintaining compliance are given in the User Manual. 8. The modular transmitter must comply with any applicable RF exposure requirements. The EUT is compliant with all applicable RF exposure requirements. Please see RF Exposure Exhibit. Please contact me if you have additional questions. Your attention to this matter is greatly appreciated. Best regards, Printed Name:Yongsheng Li Company:SIMCom Wireless Solutions Limited Job Title:manager Email:Yongsheng Li@simcom.com Telephone:86 21 3157 5100