SPZB260 ZigBee module Description SPZB260 is a low power consumption ZigBee module optimized for embedded applications. It enables OEMs to easily add wireless capability to electronic devices. The module is based on SN260 ZigBee Network Processor which integrates a 2.4GHz, IEEE 802.15.4-compliant transceiver as well as IEEE 802.15.4 PHY and MAC. 24 MHz high stability Xtal is available aboard the module to perform the timing requirements as per ZigBee specifications. A single supply voltage is requested to power the module. An integrated 2.5 GHz specific Murata antenna is aboard. The voltage supply also determines the I/O ports level allowing an easy interface with the host system. The module is controlled by means of a standard serial interface (SPI) allowing the connections to a variety of Host microcontrollers.
( for other information and details, please refer to SN260 Datasheet available at www.st.com ) Features Integrated 2.4GHz ,IEEE 802,15,4-compliant transceiver:
0 dBm nominal TX output power
-92 dBm RX sensitivity
+ 2 dBm in boost mode RX filtering for co-existence with IEEE 802.11g and Bluetooth devices Integrated VCO and loop filter Integrated IEEE 802.15.4 PHY and MAC Controlled by a Standard Serial Line for an easy interface of host microcontrollers (SPI) Embedded flash and integrated RAM for program and data storage On board 24 MHz stable Xtal Integrated RC oscillator ( typ 10KHz) for low power operation 1 A power consumption in Deep sleep mode Watchdog timer and power on reset Pins available for Non-intrusive debug interface (SIF) Single supply voltage 2.1 to 3.6 Vdc. Available Link and Activity outputs for external Indication / monitor CE compliant FCC compliant ( FCC ID:S9NZB260A ) Applications Industrial controls Sensor networking Monitoring of remote systems Home applications Security systems Lighting controls September 2007 Rev 1 1/14 www.st.com 14 Contents Contents SPZB260 1 2 3 4 5 Block diagram . 3 Pin settings . 3 Pin connections . 3 2.1 2.2 Pin description . 4 Maximum ratings . 5 Absolute maximum ratings . 5 3.1 3.2 Operating ranges . 5 Electrical characteristics . 6 DC electrical characteristics . 6 4.1 DC I/O specification . 6 4.2 4.3 RF electrical characteristics . 7 Mechanical dimensions . 8 Appendix A FCC statement . 10 Label instruction . 11 Special requirement for Modular application . 11 A.1 A.2 6 Revision history . 13 2/14 SPZB260 Block diagram 1 Block diagram Figure 1. Block diagram Vdd SIF C ONTR SIGN SPI 2 Pin settings 2.1 Pin connections Figure 2. Pin connection diagram 24 MHz XTAL SN 260 Tranceiver RF antenna Balun Filter 3/14 Pin settings 2.2 Pin description SPZB260 Table 1. Pin description Pin n Pin name Direction Description 1 2 3 4 5 6 7 8 9 RSTB HOST_INT SPI_SSEL SPI MOSI SPI MISO SPI_CLK GND VDD SIF_CLK 10 SIF_MISO I O I I O I
I O 11 SIF_MOSI I 12 SIF_LOADB I/O 13 14 15 16 17 PTI_EN PTI_DATA WAKE ACTIVITY SDBG O O I O O Active low reset ( an internal pull-up of 30 kohm typ is provided) Host Interrupt Signal ( from ZB Module to Host) SPI Slave Select ( from Host to ZB Module) SPI Data , Master Out / Slave In ( from host to ZB Module) SPI Data , Master In / Slave Out ( from ZB Module to host) SPI clock Ground Input power supply Non-intrusive debug Interface Serial interface Clock Signal ( internal pulldown) Non-intrusive debug Interface Serial interface Master IN/ Slave Out Non-intrusive debug Interface Serial interface Master Out/ Slave In To guarantee a proper signal level when in deep sleep mode connect a 10k resistor to GND Non-intrusive debug Interface Serial interface Load strobe ( Open collector with internal pull-up) To improve noise immunity connect a 10k resistor to VDD Frame Signal of Packet Trace Interface (PTI) Data Signal of Packet Trace Interface (PTI) Wake Interrupt Signal from Host to ZB Module Activity signal for application debug /monitor 4/14 SPZB260 Maximum ratings 3 Maximum ratings 3.1 Absolute maximum ratings Table 2. Absolute maximum ratings Symbol Parameter VDD VIN Tstg Tsold Module supply voltage Input voltage on any digital pin Storage temperature Soldering temperature < 10s 3.2 Operating ranges Table 3. Operating ranges Values Min
-0.3
-0.3
-40 Max 3.6 Vdd+0.3
+85 240 Unit V V C Symbol Parameter Conditions VDD Tstg Module supply voltage
- 20C < T < 70 C Operating ambient temperature Values Min Typ Max 2.1
-20 3.3 3.6
+70 Unit V C 5/14 Electrical characteristics SPZB260 4 Electrical characteristics 4.1 DC electrical characteristics Table 4. DC electrical characteristics Symbol Parameter Conditions IRX IRX ITX ITX IDS RX current ( boost mode) Vdd = 3.0 V, T = 25 C RX current ( normal mode) Vdd = 3.0 V, T = 25 C TX current ( boost mode) Vdd = 3.0 V, T = 25 C TX current (normal mode) Vdd = 3.0 V, T = 25 C Deep sleep current 2.1 < Vdd < 3.6 V T = 25C Values Min Typ Max 38 36 42 36 1 4.2 DC I/O specification Table 5. DC Input / Output specification Symbol Parameter Conditions Values Min 0 Typ Max 0.2 x Vdd VIL VIH Iil Iih Ripu Ripd VOL VOH Low Level Input Voltage 2.1 < Vdd < 3.6 V High level input voltage Input current for logic 0 Input current for logic 1 Input pull-up resistor Input pull-down resistor Low level output voltage High level output voltage 2.1 < Vdd < 3.6 V 0.8 x Vdd 2.1 < Vdd < 3.6 V 2.1 < Vdd < 3.6 V Vdd
-0.5 0.5 30 30 0 0.82 x Vdd 0.18 x Vdd Vdd IOHS Output source current IOLS Output sink current IOHH Output source current (pin 15,16,17) IOLH IOTot Output sink current (pin 15,16,17) Total output current for I/O 4 4 8 8 40 6/14 Unit mA mA mA mA A Unit V V mA mA k k V V mA mA mA mA mA SPZB260 Electrical characteristics 4.3 RF electrical characteristics Table 6. RF electrical characteristics Symbol Parameter Conditions Values Min Typ Max Unit Frequency range 2.1 < Vdd < 3.6 V 2405 2480 MHz TX RX Output power Sensitivity Vdd = 3.0V, 1% PER CFE Carrier frequency error Vdd=3.0V -20 / + 70 C
-40 Error Vector magnitude Normal / boost mode Adjacent channel rejection
+/- 5 MHz
+/- 10 MHZ 0
-92 15 35 40 dBm dBm ppm
dBm 40 25 7/14 Mechanical dimensions SPZB260 5 Mechanical dimensions In order to meet environmental requirements, ST offers these devices in ECOPACK packages. These packages have a Lead-free second level interconnect . The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. Figure 3. Mechanical dimensions 8/14 SPZB260 Mechanical dimensions Figure 4. Solder pad layout 9/14 FCC statement SPZB260 Appendix A FCC statement This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Note:
This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:
Reorient or relocate the receiving antenna Increase the separation between the equipment and receiver Connect the equipment into an outlet on a circuit different from that to which the receiver is connected Consult the dealer or an experienced radio/TV technician for help. Antenna Our module type SPZB260 is for OEM integrations only. The end-user product will be professionally installed in such a manner that only the authorized antennas are used. Caution Any changes or modifications not expressed approved by the part responsible for compliance could cause the module to cease to comply with FCC rules part 15, and thus void the users authority to operate the equipment. 10/14 SPZB260 FCC statement A.1 Label instruction Instruction manual for FCC ID labeling Module type:
ZigBee module SPZB260 FCC-ID:
S9NZB260A This intends to inform you how to specify the FCC ID of our ZigBee module SPZB260 on your final product. Based on the Public Notice from FCC, the product into which our transmitter module is installed must display a label referring to the enclosed module. The label should use wording such as Contains Transmitter module FCC ID: S9NZB260A or Contains FCC ID: S9NZB260A , any similar wording that expressed the same meaning may be use. It shows an example below Contains FCC ID: S9NZB260A A.2 Special requirement for Modular application The following requirements are fulfilled:
1. The modular transmitter must have its own RF shielding:
The RF module used on the board fulfils the emission requirements of the FCC rules without additional shielding. 2. The modular transmitter must have buffered modulation/data inputs:
The module has a memory management unit inside of the IC. The processor interfacing with the external application by means general purpose I/O ( GPIO) , Uart, SPI. The processor interfaces also the RF part of the module exchanging data and command with it. Inside the processor a flash memory is available to download the customer application and the ZigBee profiles. 3. The modular transmitter must have its own power supply regulation:
The IC contains an own voltage regulation. In case of changes in the supply voltage VCC (for example caused by temperature changes or other effects), the internal voltage will be stabilized. 4. The modular transmitter must comply with the antenna requirements of Section 15.203 and 15.204:
The RF module is for OEM (Original Equipment Manufacturer) integration only. The end-user product will be professionally installed in such a manner that only the authorized antenna is used. 5. The modular transmitter must be tested in a stand-alone configuration:
The RF module was tested in a stand-alone configuration. 6. The modular transmitter must be labelled with its own FCC ID number:
The RF module will be labelled with its own FCC ID number. When the module is installed inside the end-product, the label is not visible. The OEM manufacturer is instructed how to apply the exterior label. 11/14 FCC statement SPZB260 7. The modular transmitter must comply with any specific rule or operating requirements applicable to the transmitter and the manufacturer must provide adequate instructions along with the module to explain any such requirements:
The EUT is compliant with all applicable FCC rules. Detail instructions are given in the product Users Guide. 8. The modular transmitter must comply with any applicable RF exposure requirements. Maximum measured power output: 3,08 mW Maximum antenna gain: 0,6 dBi = numeric gain 1,148 (see also FCC test report) Maximum permissible exposure defined in 47 CFR 1.1310: 1 mW/cm. The RF module operates at low power level so it does not exceed the Commissions RF exposure guidelines limits; furthermore, Spread spectrum transmitters operate according to the Section 15.247 are categorically excluded from routine environmental evaluation. 12/14 SPZB260 Revision history 6 Revision history Table 7. Document revision history Date Revision Changes 07-Sep-2007 1 First release 13/14 SPZB260 Please Read Carefully:
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