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User manual 1 - | Users Manual | 5.94 MiB | March 10 2019 / April 10 2019 | |||
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User manual 2 - | Users Manual | 750.08 KiB | March 10 2019 / April 10 2019 | |||
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User manual 3 - | Users Manual | 5.85 MiB | March 10 2019 / April 10 2019 | |||
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ID Label Location Information - | ID Label/Location Info | 547.91 KiB | March 10 2019 / April 10 2019 | |||
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Confidential Request - | Cover Letter(s) | 230.45 KiB | March 10 2019 / April 10 2019 | |||
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Cover letter - Agent Authorization Letter - | Cover Letter(s) | 181.50 KiB | March 10 2019 / April 10 2019 | |||
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Operational Description - | Operational Description | 670.52 KiB | March 10 2019 / April 10 2019 | |||
1 | Test Report | March 10 2019 / April 10 2019 | ||||||
1 | Test Setup Photos | March 10 2019 / April 10 2019 |
1 | User manual 1 - | Users Manual | 5.94 MiB | March 10 2019 / April 10 2019 |
UM2535 User manual Evaluation boards with STM32MP157 MPUs Introduction The STM32MP157C-EV1 and STM32MP157A-EV1 Evaluation boards (STM32MP157x-EV1) are designed as complete demonstration and development platforms for STMicroelectronics Arm-based dual -A7 32 bits and Cortex-M4 32 bits MPUs in the STM32MP1 Series. They leverage the capabilities of STM32MP1 Series microprocessors for the user to develop applications, using STM32 MPU OpenSTLinux Distribution software for the main processor, and STM32CubeMP1 software for the co-processor. They include an ST-LINK embedded debug tool, LEDs, push-buttons, one joystick, 1-Gbps Ethernet, CAN FD, one USB OTG Micro-AB connector, four USB Host Type-A connectors, LCD display with touch panel, camera, stereo headset jack with analog microphone input, four digital microphones, one SPDIF Rx/Tx, Smartcard, microSD card, and eMMC, NOR and NAND Flash memories. STM32MP157x-EV1, shown in Figure 1 and Figure 2, is used as the reference design for user application development, although it is not considered as final application. To expand the functionality of the STM32MP157C-EV1 and STM32MP157A-EV1 Evaluation boards, two GPIO expansion connectors are also available for motor control and Raspberry Pi shields. An ST-LINK/V2-1 is integrated on the board, as embedded in-circuit debugger and programmer for the STM32 MPU and the USB Virtual COM port bridge. Figure 1. STM32MP157x-EV1 top view Figure 2. STM32MP157x-EV1 bottom view Pictures are not contractual. UM2535 - Rev 2 - August 2019 For further information contact your local STMicroelectronics sales office. www.st.com
1 | User manual 2 - | Users Manual | 750.08 KiB | March 10 2019 / April 10 2019 |
UM2535 Features 1 Features STM32MP157 Arm-based dual Cortex-A7 32 bits + Cortex-M4 32 bits MPU in LFBGA448 package ST PMIC STPMIC1 2 4-Gbit DDR3L, 16 bits, 533 MHz 2 512-Mbit Quad-SPI Flash 32-Gbit eMMC v5.0 8-Gbit SLC NAND, 8 bits, 8-bit ECC, 4-KB PS 1-Gbit/s Ethernet (RGMII) compliant with IEEE-802.3ab USB Host 4-port hub USB OTG HS CAN FD 5.5" TFT 7201280 pixels with LED backlight, MIPI DSISM interface, and capacitive touch panel SAI audio codec 5-megapixel, 8-bit camera 4 ST-MEMS digital microphones Smartcard microSD card 2 user LEDs 2 user and reset push-buttons, 1 wake-up button 4-direction joystick with selection button 5 V / 4 A power supply Board connectors:
Ethernet RJ45 4 USB Host Type-A USB OTG Micro-AB SPDIF RCA input and output CAN FD Stereo headset jack including analog microphone input Audio jack for external speakers Motor control External I2C LTDC Trace, JTAG, RS-232 GPIO expansion connector (Raspberry Pi shields capability) MEMS-microphone daughterboard expansion connector On-board ST-LINK/V2-1 debugger/programmer with USB re-enumeration capability: Virtual COM port and debug port STM32CubeMP1 and full mainline open-source Linux STM32 MPU OpenSTLinux distribution (such as STM32MP1Starter) software and examples Support of a wide choice of Integrated Development Environments (IDEs) including IAR, Keil, GCC-
based IDEs Note:
STM32 Arm Cortex MPUs are based on the Arm Cortex-A and Cortex-M processors. Arm is a registered trademark of Arm Limited (or its subsidiaries) in the US and/or elsewhere. UM2535 - Rev 2 page 2/59 UM2535 Ordering information 2 Ordering information To order an STM32MP157 Eval board, refer to Table 1. List of available products. Additional information is available from the datasheet and reference manual of the target STM32. Table 1. List of available products Order code STM32MP157A-EV1 STM32MP157C-EV1 Board reference MB1262: mother board MB1263: MPU subsystem daughterboard MB1230: DSI display board MB1379: camera board Target STM32 STM32MP157AAA3 Differentiating feature Basic security. STM32MP157CAA3 Secure Boot and cryptography. 2.1 Product marking Evaluation tools marked as ES or E are not yet qualified and therefore not ready to be used as reference design or in production. Any consequences deriving from such usage will not be at ST charge. In no event, ST will be liable for any customer usage of these engineering sample tools as reference design or in production. E or ES marking examples of location:
On the targeted STM32 that is soldered on the board (for illustration of STM32 marking, refer to the STM32 datasheet Package information paragraph at the www.st.com website). Next to the evaluation tool ordering part number that is stuck or silk-screen printed on the board. Codification 2.2 The meaning of the codification is explained in Table 2. STM32MP1XXY-EVZ Description Table 2. Codification explanation STM32MP1 XX Y EVZ MPU series in STM32MP1 32-bit MPUs MPU product line in the series Security option:
Eval board configuration A: basic security C: Secure Boot and cryptography EV1: with PMIC Example: STM32MP157C-EV1 STM32MP1 Series STM32MP157 line Secure Boot and cryptography PMIC The order code is mentioned on a sticker placed on the top side of the board. UM2535 - Rev 2 page 3/59 UM2535 Development environment 3 3.1 Note:
3.2 Note:
3.3 Development environment System requirements Windows OS (7, 8 and 10), Linux 64-bit, or macOS USB Type-A to Micro-B cable macOS is a trademark of Apple Inc. registered in the U.S. and other countries. Development toolchains Keil MDK-ARM (see note) IAR EWARM (see note) GCC-based IDEs GCC On Windows only. Demonstration software The STM32 MPU OpenSTLinux distribution and STM32CubeMP1 base demonstration software is preloaded in the microSD for easy demonstration of the device peripherals in standalone mode. The latest versions of the demonstration source code and associated documentation can be downloaded from www.st.com. UM2535 - Rev 2 page 4/59 UM2535 Conventions 4 Conventions Table 3 provides the conventions used for the ON and OFF settings in the present document. Convention Jumper JPx ON Jumper JPx OFF Jumper JPx [1-2]
Solder bridge SBx ON Solder bridge SBx OFF Resistor Rx ON Resistor Rx OFF Table 3. ON/OFF convention Definition Jumper fitted Jumper not fitted Jumper should be fitted between Pin 1 and Pin 2 SBx connections closed by 0 resistor SBx connections left open Resistor soldered Resistor not soldered UM2535 - Rev 2 page 5/59 UM2535 Delivery recommendations 5 Delivery recommendations Before the first use, make sure that, no damage occurred to the board during shipment and no socketed components are loosen in their sockets or fallen into the plastic bag. In particular, pay attention to the following components:
1. MB1263 daughterboard connected to the MB1262 mother board 2. microSD card in its MB1263/CN9 receptacle 3. 4. For product information related with STM32MP157xAA3 microcontroller, visit www.st.com website. LCD MB1230 daughterboard in MB1262/CN19 DSI connector, and screw, spacer and nut are in place Camera module MB1379 board in MB1262/CN7 connector, and screw, spacer and nut are in place UM2535 - Rev 2 page 6/59 UM2535 Hardware layout and configuration 6 Hardware layout and configuration The STM32MP157x-EV1 Evaluation board is designed around the STM32MP157xAA3 target microcontroller in LFBGA 448-pin package. Figure 3 illustrates the STM32MP157x-EV1 hardware block diagram. Figure 4 shows the location of main components on the Evaluation board. UM2535 - Rev 2 page 7/59 UM2535 Hardware layout and configuration Figure 3. STM32MP157x-EV1 hardware block diagram STM32MP157xAA3 32 kHz crystal 24 MHz crystal DDR3L eMMC NAND Quad-SPI NOR Flash 5.5" TFT 720*1280 Capacitive touch screen HUB: 4x USB A USB OTG Micro-AB Gigabit Ethernet FDCAN connector RS232 DB9 connector ST-LINK/V2.1 USB Micro-B JTAG connector MICTOR-38 connector RTC HSI DDR SDMMC FMC Quad-SPI DSI I2C USB HOST HS USB OTG HS RGMII FDCAN UART JTAG/
SWD ETM UM2535 - Rev 2 5V_VIN STPMIC1 Wake-up button microSD card connector 2 USER LEDs 2 USER buttons RESET button Joystick MFX IO expander LTDC connector Camera I2C SDMMC GPIO LTDC DCMI SAI Audio Codec DFSDM SPDIF TX/RX Smartcard I2C GPIOs Shared GPIOs ADC/DAC Stereo Jack Line Out / MIC_IN MEMS microphones SPDIF TX/RX Smartcard connector I2C EXT connector GPIO 40- pin connector Motor-control connector ADC/DAC connector MSv62134V2 page 8/59 UM2535 Hardware layout and configuration Figure 4. STM32MP157x-EV1 board overview Note:
Numbers in yellow refer to positions explained in Table 4, Table 5, and Table 6. UM2535 - Rev 2 page 9/59 UM2535 Hardware layout and configuration Position Description Table 4. STM32MP157x-EV1 overview 1 2 3 4 5 MB1262 mother board MB1263 daughterboard MB1230 DSI (MIPI standard) 720p display MB1379 daughterboard camera microSD card Table 5. MB1263 daughterboard overview Position Description 50 (B1) 51 (LD2) 52 (B2) 53 (LD3) 54 (B3) 55 (LD5) 56 (LD4) 57 (B4) 58 (LD1) Reset button User LED (red) User button (PA13) User LED (green) User button (PA14) User LED (blue) User LED (orange) Wakeup button Power LED (green) Position 59 (CN1) 60 (SW1) 61 (U3) 62 (LD6) 63 (CN4) 64 (U4) 65 (U5) 66 (U6/U7) 67 (SD) Description MB1263 power 5 V-3 A Boot mode selection PMIC (STPMIC1A) ST-Link LED (bicolor) USB micro-B (ST-Link V2-1) STM32MP157xAA3 LFBGA448 eMMC 2 x DDR3L 16 bits microSD 3.0 card (back side slot) Position Description Position Description Table 6. MB1262 mother board overview Ethernet Speaker audio output Audio codec (Wolfson WM8994) SPDIF TX Ethernet LED (green) Trace connector RS232 (UART4) USB micro-AB (USB OTG) USB Type-A port LED (red) JTAG connector 2 USB Type-A port (host) Reset button Motor control connector Camera sensor connector 10 (CN3) 12 (CN4) 14 (U8) 16 (CN2) 18 (LD1) 20 (U10) 22 (CN12) 24 (CN16) 26 (LD3) 28 (CN14) 30 (CN18) 32 (B2) 34 (CN22) 4 (CN7) 11 (CN8) 13 (CN5) 15 (CN1) 17 (U5) 19 (CN6) 21 (CN11) 23 (CN13) 25 (LD2) 27 (CN17) 29 (CN15) 31 (CN20) 33 (B1) 35 (CN21)
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Microphone MEMS daughterboard connector Headset audio output SPDIF RX Smartcard (back side slot) Ethernet daughterboard connector LTDC LCD TFT Display Controller (STM32 specific) connector External E2P connector USB OTG LED (green) MFX header 4 pins CAN FD 2 USB Type-A port (host) Joystick GPIO expansion connector
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UM2535 - Rev 2 page 10/59 UM2535 Power supply management 6.1 6.1.1 Power supply management 5 V power supply STM32MP157x-EV1 Evaluation board is designed to be powered from the 5 V DC power supply provided in the package. MB1263/LD1 Green LED turns on when this power supply is connected to the power jack MB1263/CN1. Figure 5. 5 V power supply connector: MB1263/CN1 6.1.2 Platform power tree All supply lines required for the operation of the components on STM32MP157x-EV1 are derived from the 5 V power source. Indeed this 5 V power source is the input supply of the STPMIC1 that distributes then all the supplies to the sub-systems as described in the power tree Figure 6. UM2535 - Rev 2 page 11/59 UM2535 Power supply management Figure 6. STM32MP157x-EV1platform power tree 5V DC 3A POWER JACK Protection VDD_DDR STPMIC1A VIN 10uF 10uF 10uF 10uF BUCK2IN BUCK2 VREF BUCK1IN BUCK1 0.725-1.5V,1.5A BUCK3IN BUCK3 1.0-3.4V, 0.5A VLX2 VOUT2 VREF VLX1 VOUT1 VLX3 VOUT3 LDO3IN LDO3 LDO3OUT VTT_DDR (0.675V) 10uF 1uH VDD_DDR (1.35V) 22uF VDDQ VDD termination 2x DDR3L DDR3 x16 4Gb / 16-bits /
VREFDQ VREFCA 1066Mbps VREF_DDR (0.675V) 1uF 1uH VDDCORE (1.2V) 22uF VDD (3.3V) LC LowPass 1uH 22uF VDDQ_DDR DDR_VREF VDDCORE NRST_CORE VDDA VREF+
VREF-
VSSA VBAT PDR_ON PDR_ON_CORE VDD_OTP VDD_PLL VDD_ANA VDD VDD_DSI VDD1V2_DSI_REG VDD1V2_DSI_PHY VDDA1V8_DSI VDDA1V8_REG BYPASS_REG1V8 VIN 4.7uF PWR MUX Vin_max INTLDO LDO4 3.3V,50mA INTLDO LDO4OUT 4.7uF VDD_USB (3.3V) 4.7uF VBUSOTG_SW 0.5A
(w/ OCP and VBUSdet) VBUSOT G BYPASS_SW 1uH 10uF VLXB1 BOOST (5V) 5.2V,1A BOUT SWIN PWR_SW 1A
(w/ OCP and VBUSdet) SWOUT VDD VIO BUCK4IN LDO16IN LDO25IN 10uF 3V3 3V3 1uF 1uF SDA SCL INT1 RSTn PWREN WAKEUP PONKEY Logic / Control BUCK4 0.6-3.9V,2A LDO1 1.7-3.3V,350mA LDO6 0.9-3.3V,100mA LDO2 1.7-3.3V,350mA LDO5 1.7-3.9V,400mA VLX4 VOUT4 LDO1OUT LDO6OUT LDO2OUT LDO5OUT MB1263 MB1262 VBUS_OTG 4.7uF BST_OUT 22uF VBUS_SW 220uF WAKE-UP PUSH BUTTON 3V3 1uH 22uF 1V8 VDDA 2V8 4.7uF 4.7uF 4.7uF VDD_SD (2.9V) 4.7uF VDD s r o VIN t c e n n o C d e e p S h g H x 2 i VBUS_SW 3V3 VBUS_OTG VDD 1V8 2V8 VDDA1V1_REG VDD3V3_USBHS VDD3V3_USBFS VBUS PZ5 (I2C4_SDA) PZ4 (I2C4_SCL) PA0 (WKUP1) NRST PWR_ON PWR_LP PC13 (RTC_OUT1) STM32MP157xAA3 NC Embedded STLINK V2.1 TYPE-B RESET PUSH BUTTON VIN 3V3 VDD VCC VCCQ eMMC
-SD card NAND VCC Q-SPI NOR VCC MFX IO Expander CAN_FD SN65HVD230 DSI LCD Audio CODEC SPDIF x4 MEMS micro Gigabit Ethernet USB HOST type A x4 USB OTG TYPE-AB CAMERA MotorC conn. GPIO 40 pins conn. Smart Card RS232 JTAG &
Trace connectors MSv62137V1 6.1.3 STPMIC1 For general information concerning the STPMIC1, please refer to STPMIC1 datasheet at the www.st.com website. UM2535 - Rev 2 page 12/59 6.2 Clocks UM2535 Clocks 6.2.1 6.2.2 6.3 6.4 6.5 External 32.768 kHz crystal Two clocks are available on STM32MP157x-EV1 for STM32MP157xAA3 target microcontroller. LSE clock HSE clock Reset sources External 24 MHz crystal Two reset buttons MB1263/B1 and MB1262/B2 (BLACK buttons) STM32MP157xAA3: internal voltage monitor, SW request or Watchdog STPMIC1 JTAG/SWD connector MB1262/CN14 ETM Trace Mictor-38 connector MB1262/U10 Embedded ST-LINK/V2-1 The reset signal of the STM32MP157x-EV1 platform is active low. Sources of the platform reset are:
The STM32MP157xAA3 also drives a sub system reset, SUB_NRST signal on PD10 IO, to the peripherals: USB Host Hub, MFX, Ethernet, and RGB_LTDC connector. User buttons and LEDs The Table 7 describes the HW configuration for the user buttons and LEDs Table 7. HW configuration for the user buttons and LEDs IO LED color and label Button label PD8 is connected to the ORANGE LD4. Active High PD9 is connected to the BLUE LD5. Active High PA13 is connected to RED LD2. Active Low MFX_IO13 is connected to ORANGE LED LD7. Active Low PD8 PD9 PA13 PA14 Physical input devices: buttons
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User PA13 User PA14 The STM32MP157x-EV1 board provides a number of input devices for physical human control. These are:
Two Reset buttons (MB1263/B1 and MB1262/B2) Four-way joystick controller with select key (MB1262/B1) Wake-up button (MB1263/B4) Table 8. Physical user devices: buttons Devices Purpose/IO Wakeup button (MB1263/B4) Reset buttons (MB1263/B1 or MB1262/B2) JOY_CENTER: Joystick select key (MB1262/B1 pin2) JOY_DOWN: Joystick down direction (MB1262/B1 pin3) Awakes the platform from low-power modes. Connected to STPMIC1A PONKEY, which generates a wake-up signal on STM32MP1 PA0 NRST signal MFX_IO0 MFX_IO1 UM2535 - Rev 2 page 13/59 UM2535 Boot options Devices Purpose/IO JOY_LEFT: Joystick left direction (MB1262/B1 pin1) JOY_RIGHT: Joystick right direction (MB1262/B1 pin6) JOY_UP: Joystick up direction (MB1262/B1 pin4) Boot options 6.6 MFX_IO2 MFX_IO3 MFX_IO4 The STM32MP157x-EV1 board may boot from different sources as described in Table 9. Table 9. HW configuration for the BOOT mode MB1263/SW1 Boot Mode BOOT2 BOOT1 BOOT0 Serial-NOR uSD card eMMC NAND UART and USB Reserved 0 1 0 0 0 1 1 0 0 1 1 0 1 0 1 1 0 1 0 0 0 The boot related switches (MB1263/SW1) must be configured as illustrated by one of the following pictures:
UM2535 - Rev 2 page 14/59 UM2535 Embedded ST-LINK/V2-1 Figure 7. STM32MP157x-EV1 boot related switch configuration 6.7 Embedded ST-LINK/V2-1 The STLINK-V2.1 programming and debugging tool is integrated in the STM32MP157x-EV1 Evaluation board. The embedded STLINK-V2.1 supports JTAG, SWD and VCP for the target STM32 MPU devices. UM2535 - Rev 2 page 15/59 UM2535 Embedded ST-LINK/V2-1 For information about debugging and programming features refer to STLINK-V2.1 in-circuit debugger/
programmer, User manual (UM1075) available on www.st.com, which describes in details all the STLINK-V2.1 features. Figure 8 shows the STLINK USB B connector pinout MB1263/CN4. Figure 8. STLINK USB B connector pinout MB1263/CN4 MSv46073V1 Table 10 describes STLINK USB B connector pinout MB1263/CN4. Table 10. STLINK USB B connector pinout MB1263/CN4 Pin Board function STLINK STM32 pin 1 2 3 4 5 VBUS Power DM DP ID GND
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PA11 PA12 GND GND As current consumption of the EVAL exceeds permissible current on USB, it is not possible to power the boards through the STLINK-V2.1 USB. To use the STLINK-V2.1 for programming and debugging, it is mandatory to power the board first using the 5V power supply, then connect the STLINK-V2.1 USB cable to the PC. Proceeding this way the USB enumeration succeed thanks to the external power source. The user must respect the following power sequence procedure:
1. Check that MB1263/JP1 is OFF, MB1263/JP4 [2-3] and JP5 [2-3] are ON to connect UART4 as STLINK VCP. Connect the 5 V power source, MB1263/LD1 LED turns green, MB1263/LD6 flashes red. Connect the PC to USB connector MB1263/CN4, MB1263/LD6 is red and becomes green once the connection with the STLINK is established. 2. 3. 6.7.1 Drivers Before connecting STM32MP157x-EV1 to a Windows (XP, 7, 8 10) PC via USB, a driver for ST-LINK/V2-1 must be installed. It may be downloaded from www.st.com. In case the STM32MP157x-EV1 Evaluation board is connected to the PC before installing the driver, the Windows device manager may report some USB devices found on STM32MP157x-EV1as Unknown. To recover from this situation, after installing the dedicated driver downloaded from www.st.com, the association of Unknown USB devices found on STM32MP157x-EV1 to this dedicated driver must be updated in the device manager manually. It is recommended to proceed using USB Composite Device line, as shown in Figure 9. UM2535 - Rev 2 page 16/59 UM2535 ETM TRACE Mictor-38 connector Figure 9. USB composite device 6.7.2 6.8 ST-LINK/V2-1 firmware upgrade For its own operation, ST-LINK/V2-1 employs a dedicated MCU with Flash memory. Its firmware determines ST-
LINK/V2-1 functionality and performance. The firmware may evolve during the life span of STM32MP157x-EV1 to include new functionality, fix bugs or support new target microcontroller families. It is therefore recommended to keep ST-LINK/V2-1 firmware up to date. The latest version is available from www.st.com. ETM TRACE Mictor-38 connector The Mictor-38 connector MB1262/U10 may output trace signals used for debug, as well as JTAG signals. Table 11 describes the HW configuration for the TRACE function. Table 11. HW configuration for the TRACE connector MB1262/U10 IO Bridge Setting(1) Comment PI14 SB38 PI12 SB43 PI13 SB42 PJ5 SB36 PJ6 SB41 PK1 SB40 ON OFF ON OFF ON OFF ON OFF ON OFF ON OFF PI14 may be used for the trace function TRACE CLK PI14 is not connected to Trace PI14 may be used for LTDC CLK PI12 may be used for the trace function TRACE_D0 PI12 is not connected to Trace PI12 may be used for LTDC HSYNC PI13 may be used for the trace function TRACE_D1 PI13 is not connected to Trace PI13 may be used for LTDC VSYNC PJ5 may be used for the trace function TRACE_D2 PJ5 is not connected to Trace PJ5 may be used forLTDC_R6 PJ6 be used for the trace function TRACE_D3 PJ6 is not connected to Trace PJ6 may be used for LTDC_R7 PK1 may be used for the trace function TRACE_D4 PK1 is not connected to Trace PK1 may be used for LTDC_G6 UM2535 - Rev 2 page 17/59 UM2535 ETM TRACE Mictor-38 connector IO Bridge Setting(1) Comment PK2 SB39 PK5 SB49 PK6 SB35 PJ0 SB34 PJ1 SB37 PJ2 SB48 PJ3 SB47 PJ4 SB46 PJ7 SB45 PJ8 SB44 PJ9 SB50 ON OFF ON OFF ON OFF ON OFF ON OFF ON OFF ON OFF ON OFF ON OFF ON OFF ON OFF 1. Default configuration is shown in bold Figure 10 shows the TRACE Mictor-38 connector PK2 may be used for the trace function TRACE_D5 PK2 is not connected to Trace PK2 may be used for LTDC_G7 PK5 may be used for the trace function TRACE_D6 PK5 is not connected to Trace PK5 may be used for LTDC_B6 PK6 may be used for the trace function TRACE_D7 PK6 is not connected to Trace PK6 may be used for LTDC_B7 PJ0 may be used for the trace function TRACE_D8 PJ0 is not connected to Trace PJ0 may be used for LTDC_R1 PJ1 may be used for the trace function TRACE_D9 PJ1 is not connected to Trace PJ1 may be used for LTDC_R2 PJ2 may be used for the trace function TRACE_D10 PJ2 is not connected to Trace PJ2 may be used for LTDC_R3 PJ3 may be used for the trace function TRACE_D11 PJ3 is not connected to Trace PJ3 may be used for LTDC_R4 PJ4 may be used for the trace function TRACE_D12 PJ4 is not connected to Trace PJ4 may be used for LTDC_R5 PJ7 may be used for the trace function TRACE_D13 PJ7 is not connected to Trace PJ7 may be used for LTDC_G0 PJ8 may be used for the trace function TRACE_D14 PJ8 is not connected to Trace PJ8 may be used for LTDC_G1 PJ9 may be used for the trace function TRACE_D15 PJ9 is not connected to Trace PJ9 may be used for LTDC_G2 UM2535 - Rev 2 page 18/59 UM2535 JTAG connector Figure 10. TRACE Mictor-38 connector: MB1262/U10 Table 12 describes the MICTOR-38 connector pinout for TRACE and JTAG signals. Table 12. TRACE MICTOR-38 connector pinout: MB1262/U10 Board function NC NC GND Pulldown NRST TDO/SWO Pulldown TCK/SWCLK TMS/SWDIO TDI NJTRST TRACE_D15 TRACE_D14 TRACE_D13 TRACE_D12 TRACE_D11 TRACE_D10 TRACE_D9 TRACE_D8 JTAG connector 6.9 Pin 1 3 5 7 9 11 13 15 17 19 21 23 25 27 29 31 33 35 37 Pin 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32 34 36 38 Board function NC NC TRACE_CLK Pulldown Pulldown VDD VDD TRACE_D7 TRACE_D6 TRACE_D5 TRACE_D4 TRACE_D3 TRACE_D2 TRACE_D1 GND GND VDD GND TRACE_D0 A JTAG/Serial Wire Debug 20 pins IDC connector (ARM JTAG 20, IDC 2.54mm) MB1262/CN14 outputs the JTAG signals. The JTAG function is a dedicated interface of STM32MP157XAA3. Table 13 describe the JTAG connector pinout. UM2535 - Rev 2 page 19/59 UM2535 DDR3L Table 13. MB1262/CN14 JTAG connector pinout Pin 1 3 5 7 9 11 13 15 17 19 Pin 2 4 6 8 10 12 14 16 18 20 Board function Power GND GND GND GND GND GND GND GND GND Board function Power NJTRST JTDI JTMS/SWDIO JTCK/SWCLK Pull down JTDO/SWO NRST Pull down Pull down DDR3L Two 16-bit DDR3L NT5CC256M16ER-EK of 4 Gbytes are implemented in flyby topology in MB1263/U6 and U7 positions. They are connected to the dedicated DDR interface of STM32MP157xAA3. For detailed information concerning the DDR HW design implementation, please refer to the application note AN5122 available on the www.st.com website. eMMC The STM32MP157xAA3 SDMMC2 in 8-bit wide bus mode drives a THGBMNG5D1LBAIL 32 Gbits eMMC in MB1263/U5 position. eMMC IO interface Table 14 HW configuration for the eMMC interface. Table 14. HW configuration for the Quad-SPI interface 6.10 6.11 6.11.1 IO PB14 PB15 PB3 PB4 PA8 PA9 PE5 PD3 PE3 PG6 Configuration(1) SDMMC2_D0 connected to MB1263/U5 DAT0 SDMMC2_D1 connected to MB1263/U5 DAT1 SDMMC2_D2 connected to MB1263/U5 DAT2 SDMMC2_D3 connected to MB1263/U5 DAT3 SDMMC2_D4 connected to MB1263/U5 DAT4 SDMMC2_D5 connected to MB1263/U5 DAT5 SDMMC2_D6 connected to MB1263/U5 DAT6 SDMMC2_D7 connected to MB1263/U5 DAT7 SDMMC2_CK connected to MB1263/U5 CLK SDMMC2_CMD connected to MB1263/U5 CMD 6.12 1. Minimum set of signals required by the boot ROM during eMMC boot in bold NAND Flash The STM32MP157xAA3 FMC interface is connected to an 8 Gbits SLC NAND, 8-bit, 8-bit ECC, and 4 KBytes PS MT29F8G08ABACAH4 in MB1262/U11 position. UM2535 - Rev 2 page 20/59 UM2535 Quad-SPI NOR Flash 6.12.1 NAND IO interface Table 15 features the HW configuration for the NAND interface. Table 15. HW configuration for the Quad-SPI interface IO Configuration(1) PD6 PD11 PD12 PG9 PD5 PD4 PD14 PD15 PD0 PD1 PE7 PE8 PE9 PE10 NAND_NWAIT connected to MB1262/U11 R/B#
NAND_CLE connected to MB1262/U11 CLE NAND_ALE connected to MB1262/U11 ALE NAND_NCE connected to MB1262/U11 CE#
NAND_NWE connected to MB1262/U11 WE#
NAND_NOE connected to MB1262/U11 RE#
NAND_D0 connected to MB1262/U11 IO0 NAND_D1 connected to MB1262/U11 IO1 NAND_D2 connected to MB1262/U11 IO2 NAND_D3 connected to MB1262/U11 IO3 NAND_D4 connected to MB1262/U11 IO4 NAND_D5 connected to MB1262/U11 IO5 NAND_D6 connected to MB1262/U11 IO6 NAND_D7 connected to MB1262/U11 IO7 6.13 6.13.1 1. Minimum set of signals required by the boot ROM during NAND boot in bold Quad-SPI NOR Flash The STM32MP157xAA3 Quad-SPI interface is in dual-Serial mode to interface with two NOR Flash memories in parallel. Two MX25L51245G-XD, 3V3/512-Mbit each, are fitted on the STM32MP157x-EV1 MB1262, in MB1262/U14 and MB1262/U15 positions. Quad-SPI IO interface Table 16 describes the HW configuration for the Quad-SPI interface Table 16. HW configuration for the Quad-SPI interface IO PF8 PF9 PF7 PF6 PB6 PH2 PH3 PG10 PG7 PC0 PF10 Configuration(1) QSPI_BK1_IO0 connected to MB1262/U14 SIO0 QSPI_BK1_IO1 connected to MB1262/U14 SIO1 QSPI_BK1_IO2 connected to MB1262/U14 SIO2 QSPI_BK1_IO3 connected to MB1262/U14 SIO3 QSPI_BK1_NCS connected to MB1262/U14 CS#
QSPI_BK2_IO0 connected to MB1262/U15 SIO0 QSPI_BK2_IO1 connected to MB1262/U15 SIO1 QSPI_BK2_IO2 connected to MB1262/U15 SIO2 QSPI_BK2_IO3 connected to MB1262/U15 SIO3 QSPI_BK2_NCS connected to MB1262/U15 CS#
QSPI_CLK connected to MB1262/U14 SCLK and MB1262/U15 SCLK 1. Minimum set of signals required by the boot ROM during dual-serial NOR boot in bold UM2535 - Rev 2 page 21/59 UM2535 microSD card 6.14 microSD card 6.14.1 The MB1263/CN9 slot for microSD card is routed to STM32MP157xAA3 SDMMC1 port. This SD card interface is compliance with SD Memory Card Specification Version 3.01, UHS-I, all operation modes up to SDR104 and DDR50. The SD card interface is compatible with 1.8 V or 2.9 V signal levels. SD card interface The SD card interface, SDMMC1, is 4-bit wide with level shifter support, in order to connect to an SD 3.0-
compliant bidirectional dual voltage level translator, interfacing with the memory card inserted in the SDCARD connector. Table 17 describes the IO for the SDMMC1 interface. Table 17. IO configuration for the SDIO interface IO Signal(1) PC12 PE4 PD2 PB9 PC8 PC9 PC10 PC11 PF2 PC7 PF14 SDMMC1_CK SDMMC1_CKIN SDMMC1_CMD SDMMC1_CDIR SDMMC1_D0 SDMMC1_D1 SDMMC1_D2 SDMMC1_D3 SDMMC1_D0DIR SDMMC1_D123DIR uSD_LDO_SEL 1. Minimum set of signals required by the boot ROM during SD card boot in bold Figure 11 shows the SDCARD connector pinout MB1263/CN9. Figure 11. SDCARD connector pinout MB1263/CN9 Table 18 describes the SDCARD connector pinout MB1263/CN9. UM2535 - Rev 2 page 22/59 UM2535 Audio Table 18. SDCARD connector pinout MB1263/CN9 Pin Board function 1 2 3 4 5 6 7 8 9 10 Audio DATA2_SD DATA3_SD CMD_SD VDD_SD CLK_SD GND DATA0_SD DATA1_SD GND SDCARD_DETECT active LOW A codec WM8994ECS/R connected to an SAI of STM32MP157xAA3 supports TDM feature of the SAI port. TDM feature offers to STM32MP157xAA3 the capability to stream stereo audio channels. There are four digital microphones on STM32MP157x-EV1 board. STM32MP157x-EV1 also offers the possibility to connect a MEMS extension module. Audio codec interface The audio codec has two supplies 3V3 and 1V8 provided by STPMIC1. The audio codec interfaces to the MPU are SAI2 and I2C2. Audio interrupt is connected to the IO-expander MFX. SAI2A as Tx and SAI2B as Rx are connected to two different analog interfaces of the codec, to independently playback and record. SAI2 is connected by default to the audio codec, and may be shared via solder bridge configuration with the expansion GPIO connector (refer to paragraph 6.28). I2C2 is shared with all the peripherals: Audio codec, DSI LCD, RGB LTDC, Camera, and USB Hub. The audio codec IC address is 0x36 Table 19. IO configuration for the Audio Codec interface IO Board function 6.15 6.15.1 PI5 PI7 PI6 PF11 PE12 PE13 PE0 PE14 PH5 PH4 MFX_IO5 SAI2_SCKA SAI2_FSA SAI2_SDA SAI2_SDB SAI2_SCK_B SAI2_FS_B SAI2_MCLKA SAI2_MCLKB I2C2_SDA I2C2_SCL AUDIO_INT 6.15.2 Digital microphones MB1262/U1, U2, U3 and U4 are four MP34DT01TR MEMS digital omnidirectional microphones providing PDM
(pulse density modulation) outputs. The implementation allows the beam forming. UM2535 - Rev 2 page 23/59 UM2535 Audio Those 4 digital microphones support two stereo inputs connected either to the audio Codec or, by default, connected on two DFSDM odd channels of STM32MP157xAA3: DFSDM_DATA1 and DFSDM_DATA3 synchronized on DFSDM_CKOUT. The STM32MP157xAA3 DFSDM interface is shared between the 4 embedded digital microphones and the extension module on connector MB1262/CN8. Table 20 describes the HW configuration for the digital microphones. Table 20. HW configuration for the digital microphones Jumpers HW Setting Configuration(1) MB1262/JP1 MB1262/JP2 U1/U3 stereo output selection U2/U4 stereo output selection MB1262/JP3 U1/U2/U3/U4 CLK selection MB1262/JP4 U1/U2/U3/U4 VDD selection JP1[1-2]
JP1[2-3]
JP2[1-2]
JP2[2-3]
JP3[1-2]
JP3[2-3]
JP4[1-2]
JP1[2-3]
Connected to codec DMICDAT2 Connected to STM32MP157xAA3 DFSDM_DATA3 Connected to codec DMICDAT1 Connected to STM32MP157xAA3 DFSDM_DATA1 Connected to STM32MP157xAA3 DFSDM_CKOUT Connected to codec DMICCLK 3V3 Codec MICBIAS1 6.15.3 1. Default configuration in bold Analog microphone and audio jack headphone A headset including an analog microphone and a stereo headphone may be connected to the black 3.5 mm headset jack MB1262/CN5. Figure 12. Audio jack connector MB1262/CN5 Table 21. Audio jack connector pinout MB1262/CN5 Pin Board function 2 3 4 5 6 7 MIC_IN GND OUT_RIGHT N/A OUT_LEFT N/A UM2535 - Rev 2 page 24/59 6.15.4 Audio speaker out The codec stereo speaker output is connected to a green 3.5 mm Speaker_out jack MB1262/CN4. Figure 13. Audio jack connector MB1262/CN4 UM2535 Audio Table 22. Audio jack connector pinout MB1262/CN4 Pin Board function 2 3 4 5 6 7 GND GND OUT_RIGHT N/A OUT_LEFT N/A 6.15.5 SPDIF input and output An RCA (white) connector MB1262/CN1 followed by an amplifier/filter stage is connected to the STM32MP157xAA3 SPDIF RX_IN. The STM32MP157xAA3 SAI4_SDA port provides SPDIF_TX data to a RCA (yellow) connector MB1262/CN2. UM2535 - Rev 2 page 25/59
1 | User manual 3 - | Users Manual | 5.85 MiB | March 10 2019 / April 10 2019 |
Figure 14. SPDIF input MB1262/CN1 and output MB1262/CN2 connectors UM2535 DSI LCD 6.15.6 6.16 IO restriction to other features Due to the share of some IO of STM32MP157xAA3 by multiple peripherals, the following limitations apply in using the audio features:
The SAI AUDIO CODEC must not be operated simultaneously with expansion connector MB1262/CN21. The MEMS DFSDM must not be operated simultaneously with DFSDM of EXT MEMS module MB1262/CN8. DSI LCD 6.16.1 3V3: for the LCD module (VDD_LCD and VIO_LCD) and Touch screen VIN: for the LED backlight of the LCD Through the MB1262/CN19 connector, a DSI LCD mounted on a daughterboard MB1230 is provided. MB1230 is a 5.5" TFT 720*1280 pixels with LED backlight, MIPI DSI interface and capacitive touch panel based on RK055AHD042-CT module embedding the LCD driver IC RM68200 and a touch screen controller GT9147. 3V3 and VIN supply MB1230:
DSI LCD interface MB1230 is connected to the STM32MP157xAA3 through the DSI interface, I2C to control the GT9147, and LCD_BL_CTRL. LCD_INT signal is connected to MFX. The I2C is I2C2 that is shared with all the peripherals: audio codec, MFX, RGB LTDC, camera, and USB hub. The GT9147 I2C address is 0xBB. Table 23 describes the IO configuration for the LCD interface. IO PH4 PH5 DSI_D0P DSI_D0N Table 23. IO configuration for the LCD interface Configuration I2C2_SCL I2C2_SDA DSI_D0_P is used as MIPI-DSI data Lane 0 positive DSI_D0_N is used as MIPI-DSI data Lane 0 negative UM2535 - Rev 2 page 26/59 UM2535 Camera IO DSI_D1P DSI_D1N DSI_CKP DSI_DKN PD13 PF15 PC6 MFX_IO14 Camera Configuration DSI_D1_P is used as MIPI-DSI data Lane 1 positive DSI_D1_N is used as MIPI-DSI data Lane 0 negative DSI_CKP is used as clock Lane positive DSI_DKN is used as clock Lane negative LCD_BL_CTRL Backlight Control DSI_RESET DSI_TE Tearing Effect LCD_INT - interruption Through the MB1262/CN7 connector, a camera module mounted on a daughterboard MB1379 is provided. MB1379 is a 5 Mpixels, 8-bit color camera module based on OV5640 image sensor, clocked from a 24 MHz crystal (MB1379/X1). It is supplied by 2V8. Camera interface MB1379 is connected to the STM32MP157xAA3 through DCMI and I2C interfaces. RSTI, XSDN, PLUG signals are connected to MFX. The I2C is I2C2 that is shared with all the peripherals: audio codec, MFX, RGB LTDC, DSI LCD, and USB hub. The camera IC address is 0x3C. Table 24 describes the IO configuration for the camera interface. Table 24. IO configuration for the camera interface IO Configuration 6.17 6.17.1 PH4 PH5 PH9 PH10 PH11 PH12 PH14 PI4 PB8 PE6 PI1 PH7 PI3 I2C2_SCL I2C2_SDA DCMI_D0 DCMI_D1 DCMI_D2 DCMI_D3 DCMI_D4 DCMI_D5 DCMI_D6 DCMI_D7 DCMI_D8(1) DCMI_D9(1) DCMI_D10(1) PH15 PB7 PH8 PA6 MFX_IO12 MFX_O3 DCMI_D11(1) DCMI_VSYNC DCMI_HSYNC DCMI_PIXCLK Camera PLUG detection RSTI - Camera RESETB, active low UM2535 - Rev 2 page 27/59 UM2535 1 Gbps Ethernet IO MFX_O2 XSDN Camera PWDN, active high Configuration 6.18 1. Available on the MB1262/CN7 connector, but not used in the MB1379 module 1 Gbps Ethernet The STM32MP157x-EV1 board provides a 1 Gbps Ethernet feature thanks to an external physical interface device (PHY), RTL8211EG-VB-CG. This PHY is connected to the STM32MP157xAA3 Gigabit reduced medium-
independent interface (RGMII), and is clocked from a 25 MHz Crystal (X1). The Ethernet PHY is supplied by 3V3. It generates its own supply 1V05 and Digital/Analog 3V3. LD1 LED is blinking to indicate the data transmission. The Ethernet module connector MB1262/CN6 is for STMicroelectronics internal use only. RGMII interface Table 25 describes the IO configuration for the Ethernet interface. 6.18.1 Table 25. IO configuration for the Ethernet interface IO Configuration PD10 PA2 PG0 PC1 PA7 PC4 PC5 PB0 PB1 PB11 PG13 PG14 PC2 PE2 PA1 PG4 PG5 PD10 (SUB_NRST) is used as PHY_NRST active Low PA2 is used as ETH_MDIO PG0 is used as ETH_MDINT PB11 is used as ETH_MDC PA7 is used as ETH_RX_DV(PHY_AD2) PC4 is used as ETH_RXD0 PC5 is used as ETH_RXD1 PB0 is used as ETH_RXD2 PB1 is used as ETH_RXD3 PB11 is used as ETH_TX_EN PG13 is used as ETH_TXD0 PG14 is used as ETH_TXD1 PB11 is used as ETH_TXD2 PE2 is used as ETH_TXD3 PA1 is used as ETH_RX_CLK PG4 is used as ETH_GTX_CLK PG5 is used as ETH_CLK125 UM2535 - Rev 2 page 28/59 UM2535 USB OTG HS Figure 15. Ethernet connector MB1262/CN3 Table 26. Ethernet connector pinout MB1262/CN3 Pin name Function First Bidirectional pair to transmit and receive data Second Bidirectional pair to transmit and receive data Common connected to GND Common connected to GND Third Bidirectional pair to transmit and receive data Fourth Bidirectional pair to transmit and receive data Green Led anode Green Led cathode Yellow Led anode Yellow Led cathode GND GND Pin number 1 TX1+
2 TX1-
3 TX2+
4 TX2-
5 CT1 6 CT2 7 TX3+
8 TX3-
9 TX4+
10 TX4-
11 GA 12 GC 13 YA 14 YC 15 GND 16 GND USB OTG HS The STM32MP157x-EV1 board supports USB OTG high speed communication via a USB Micro-AB connector MB1262/CN16. OTG VBUS supply is managed by the STPMIC1. MB1262/LD2 turns green when USB OTG connection is established. USB OTG interface Table 27 describes the IO configuration for the USB OTG interface. Table 27. IO configuration for the USB OTG interface IO PA10 OTG_VBUS Configuration OTG_ID line detection OTG_VBUS sensing 6.19 6.19.1 UM2535 - Rev 2 page 29/59 UM2535 USB host IO USB_DP2 USB_DM2 Configuration USB_DP2 USB_DM2 Figure 16. USB OTG Type Micro-AB connector MB1262/CN16 6.20 6.20.1 Table 28. USB OTG Type Micro-AB connector pinout MB1262/CN16 Pin name Signal name Function OTG VBUS DM DP ID VBUS VBUS supply and sensing USB_DM2 USB_DP2 ID GND Pin CN16 1 2 3 4 5 USB host VBUS D-
D+
ID GND The STM32MP157x-EV1 board provides 4 USB host port (2 dual USB Type A connectors MB1262/CN18 and CN20) thanks to a USB hub USB2514B-AEZC. The USB2514B have a full power management for each USB host port. The default configuration of USB2514B is done in HW, thus I2C is not needed by default. However, if required for a specification application, I2C may be accessed through MB1262/SB71 and SB68 to I2C2 as described in Table 29. USB host interface Table 29 describes the IO configuration for the USB host interface. Table 29. IO configuration for the USB Host interface IO SB Setting Configuration(1) MB1262/SB71 PH5 MB1262/SB68 PH4
-
PD10 USB_DP1
-
USB_DM1 -
1. Default configuration in bold OFF OFF
-
-
-
PH5 is not used as I2C2_SDA PH4 is not used as I2C2_SCL SUB_NRST USB1_P USB1_N UM2535 - Rev 2 page 30/59 UM2535 RS-232 port Figure 17. Dual USB TYPE A connector MB1262/CN18 and CN20 Table 30. USB Host connector pinout MB1262/CN18 Pin CN18 Pin name Function T1 T2 T3 T4 B1 B2 B3 B4 Pin CN20 T1 T2 T3 T4 B1 B2 B3 B4 RS-232 port 6.21 T1 T2 T3 T4 B1 B2 B3 B4 T1 T2 T3 T4 B1 B2 B3 B4 VBUS DM DP GND VBUS DM DP GND Table 31. USB Host connector pinout MB1262/CN20 Pin name Function VBUS DM DP GND VBUS DM DP GND The STM32MP157x-EV1 board offers one RS-232 communication port. The RS-232 communication port uses the DB9 male connector MB1262/CN12. UM2535 - Rev 2 page 31/59 UM2535 RS-232 port 6.21.1 RS-232 interface The RS-232 transceiver MB1262/U12 supply is 3V3. The RS-232 interface is connected to the STM32MP157xAA3 UART4 that is shared exclusively with the USB micro-B/ST-LINK v2-1 VCP as described in Table 32. Table 32. HW configuration for the RS-232 interface Jumpers IO Setting Configuration(1) MB1263/JP4 UART4_TX MB1263/JP5 UART4_RX 1. Default configuration in bold JP4[1-2]
JP4[2-3]
JP5[1-2]
JP5[2-3]
connected to RS232 CN12 Connected to ST-Link V2-1 VCP RX connected to RS232 CN12 Connected to ST-Link V2-1 VCP TX Figure 18. HW configuration for the RS-232 interface Figure 19. RS-232 connector pinout MB1262/CN12 Table 33 RS-232 connector pinout MB1262/CN12 Table 33. RS-232 connector pinout MB1262/CN12 Board function Pin Pin Board function NC RXD TXD 1 2 3 6 7 8 DSR NC CTS UM2535 - Rev 2 page 32/59 UM2535 FDCAN Board function Pin Pin Board function NC GND 4 5 9
-
NC IO restriction to other features The RS-232 must not be operated simultaneously with the STLINK-VCP. FDCAN The STM32MP157x-EV1 board supports one FDCAN compliant with ISO-11898-1 version 2.0 part A, B. The MB1262/CN15 DB9 male connector is available as FDCAN interface. Operating voltage A 5V/3v3 IO compliant high speed FDCAN transceiver is fitted between the MB1262/CN15 connector and the CAN controller port of STM32MP157xAA3. FDCAN interface Table 34 describes the IO for the CAN interface. 6.21.2 6.22 6.22.1 6.22.2 Table 34. IO configuration for the SDIO interface IO PG3 PH13 PI9 Signal CAN_STBY CAN_TX CAN_RX Figure 20 shows the FDCAN connector pinout MB1262/CN15. Figure 20. FDCAN connector pinout CN15 Table 35 describes the FDCAN interface and connector pinout CN17. Table 35. FDCAN interface and connector pinout CN17 CAN transceiver
-
CANL GND
-
-
Board function NC CANL GND NC GND Pin 1 2 3 4 5 Pin 6 7 8 9
-
Board function GND CANH NC NC CAN transceiver
-
CANH
-
-
UM2535 - Rev 2 page 33/59 UM2535 Smartcard 6.23 Smartcard 6.23.1 The STM32MP157x-EV1 board supports one Smartcard interface. The MB1262/CN23 Smartcard connector is used as card reader. Smartcard interface A 3V3 Smartcard interface MB1262/U5 is used between the card reader connector MB1262/CN23 and the Smartcard controller port of STM32MP157xAA3. The Smartcard interface is connected for some IO to the STM32MP157xAA3 and for other IO to the MFX IO expander. Table 36. HW configuration for the Smartcard interface IO PZ7 PZ6 MFX_IO6 MFX_IO7 MFX_IO8 MFX_IO9 Configuration PZ7 is connected to Smartcard interface as SMARTCARD_IO PZ6 is connected to Smartcard interface as SMARTCARD_CLK MFX_IO6 used as SMARTCARD_3/5V MFX_IO7 used as SMARTCARD_OFF MFX_IO8 used as SMARTCARD_RST MFX_IO9 used as SMARTCARD_CMDVCC Figure 21. Smartcard connector pinout MB1262/CN23 Table 37 describes the Smartcard interface MB1262/U5 and connector pinout MB1262/CN23. Table 37. Smartcard interface MB1262/U5 and connector pinout MB1262/CN23 Pin C1 C2 C3 C4 C5 C6 Board function VCC: Card supply RST: Card Reset CLK: Card CLK NC GND: CARD GND SWIO U5 Smartcard interface pin U5-17 U5-16 U5-15 U5-13 U5-14
-
UM2535 - Rev 2 page 34/59 UM2535 ADC/DAC 6.24 6.24.1 6.24.2 6.24.3 Board function I/O CARD DATA NC GND: CAR GND DETECT: CARD-Detect (LOW) Pin C7 C8 S1 S2 ADC/DAC U5 Smartcard interface pin U5-11 U5-12 GND U5-9 2x ADC/DAC 2x Fast ADC 1x Slow ADC The STM32MP157x-EV1 provides some on-board analog-to-digital converters ADC and digital-to-analog converters DAC:
ADC/DAC IO interface The STM32MP157xAA3 port PA4 may be configured to operate either as ADC input or as DAC output. PA4 is routed to two-way headers MB1263/JP11, to fetch signals to or from MB1263/JP11, or grounded it by fitting a jumper into MB1263/JP11. Same situation for PA5 and its related MB1263/JP10 header. Parameters of the ADC/DAC low-pass filters formed with MB1263/R24, C31, R19 for PA4 and MB1263/R25, C32, R20 for PA5 may be modified by replacing these components according to application requirements (Default configuration is: R24/R19/R25/R20=0 Ohm, C31/C32 not fitted). Fast ADC ANA0 may be configured as a fast ADC channel routed to MB1263/JP8. MB1263/SB6, closed by default, should be opened. ANA1 may be configured as a fast ADC channel routed to MB1263/JP9. MB1263/SB7, closed by default, must be opened. Parameters of the low-pass filters formed with MB1263/R22, C29, and R17 for ANA0 and MB1263/R23, C30 and R18 for ANA1 may be modified by replacing these components according to application requirements (Default configuration is: R22/R17/R23/R18=0 Ohm, C29/C30 not fitted). Slow ADC The port PF12 may be configured as slow ADC channel, routed to MB1263/JP7. MB1263/SB5, closed by default, must be opened. Parameters of the low-pass filters formed with MB1263/R21, C28, and R16 may be modified to application requirements (Default configuration is R21/R16=0 Ohm, C28 not fitted). The VREF+ terminal of STM32MP157xAA3 is used as reference voltage for both ADC and DAC. By default, it is connected on board to VDDA through MB1263/R96, which may be removed to apply directly an external voltage to VREF+ for specific purposes. Figure 22 ADC/DAC connectors MB1263/JP7, JP8, JP9, JP10, and JP11 Figure 22. ADC/DAC connectors MB1263/JP7, JP8, JP9, JP10, and JP11 UM2535 - Rev 2 page 35/59 UM2535 I2C_EXT connector Table 38. ADC/DAC connectors JP7/JP8/JP9/JP10/JP11 pinout Signal name Pin Pin Signal name ADC/DAC 1 2 GND 6.24.4 6.25 6.25.1 Limitations Due to the share of some IO of STM32MP157xAA3 by multiple peripherals, the following limitations apply in using the PMOD Button features:
The fast ADC ANA0/ANA1 and slow ADC PF12 may not be operated simultaneously with motor control function. I2C_EXT connector I2C_EXT connector MB1262/CN13 may be connected to IC bus daughterboard. CN13 connector pin 5 is connected to 3V3, so external module must be compliant with 3V3. MFX_GPIO0 of MFX MCU provides EXT_RESET. I2C_EXT IO interface Table 39. HW configuration for the I2C_EXT interface IO Bridge Setting(1) Comment PA11 PA12 MB1262/
SB51 MB1262/
SB54 MFX_GPIO0
-
ON OFF ON OFF
-
PA11 ,used as I2C5_SCL, is connected to EXT_SCL PA11 is not connected to EXT_SCL PA11 may be connected to the GPIO expansion connector through MB1262/
SB52 PA12 ,used as I2C5_SDA, is connected to EXT_SDA PA12 is not connected to EXT_SDA PA12 may be connected to the GPIO expansion connector through MB1262/
SB55 Connected to EXT_RESET 1. Default configuration is shown in bold Figure 23 shows the I2C_EXT connector pinout MB1262/CN13. Figure 23. I2C_EXT connector pinout MB1262/CN13 Table 40 describes the I2C_EXT connector pinout MB1262/CN13. UM2535 - Rev 2 page 36/59 UM2535 MFX MCU Table 40. I2C_EXT connector pinout MB1262/CN13 Pin 1 3 5 7 Pin 2 4 6 8 Signal name NC EXT_RST NC NC Signal name EXT_SDA EXT_SCL 3V3 GND MFX MCU The MFX: Multi-Function eXpander MCU is used as a GPIO expander, in position MB1262/U20. MFX IO expander Supplied by 3V3. The communication interface between MFX and STM32MP157xAA3 is I2C bus, and an IRQOUT pin. The I2C is I2C2 that is shared with all the peripherals: Audio codec, DSI LCD, RGB LTDC, Camera, and USB Hub. The MFX IC address is 0x42h. 6.26 6.26.1 Table 41. HW configuration for the MFX interface IO PI8 PH5 PH4 PD10 SB R127 R124 R125
-
Setting ON ON ON
-
1. Default configuration in bold Configuration(1) MFX_IRQ_OUT is connected to PI8 PH5 is used as I2C2_SDA PH4 is used as I2C2_SCL SUB_NRST Table 42. IO signals driven by the MFX Pin number Pin name Signal name 18 19 20 39 40 15 16 17 29 30 31 32 33 26 27 GPIO0 GPIO1 GPIO2 GPIO3 GPIO4 GPIO5 GPIO6 GPIO7 GPIO8 GPIO9 GPIO10 GPIO11 GPIO12 GPIO13 GPIO14 JOY_CENTER JOY_DOWN JOY_LEFT JOY_RIGHT JOY_UP Audio_INT SMARTCARD_3V/5V SMARTCARD_OFF SMARTCARD_RST SMARTCARD_CMDVCC MIC_MEMS_LED
-
CAMERA_PLUG
-
LCD_INT Function MB1262/B1 Joystick selection MB1262/B1 Joystick down direction MB1262/B1 Joystick left direction MB1262/B1 Joystick right direction MB1262/B1 Joystick up direction MB1262/U8 audio codec interrupt MB1262/U5 Smart card 3 V 5 V selection MB1262/U5 Smart Card OFF MB1262/U5 Smart Card RESET MB1262/U5 smartcard VCC command MB1262/CN8 pin12
-
Camera plug detection
-
DSI or LTDC interrupt UM2535 - Rev 2 page 37/59 UM2535 Motor control Pin number Pin name Signal name Function 6.27 GPIO15 28 Motor control
-
-
The STM32MP157x-EV1 board supports both asynchronous and synchronous 3-phase brushless motor control via a 34-pin connector MB1262/CN22, which provides all required control and feedback signals, to and from motor power-driving board. Available signals on this connector includes emergency stop, motor speed, 3-phase motor current, bus voltage, heatsink temperature coming from the motor driving board and 6 channels of PWM control signal (MC-xH/L) going to the motor driving circuit. Motor control IO interface Because of IO consuming limitation, the motor control IO interface is not enabled by default. As described below, some board modifications are needed to connect the motor control interface. Table 43 describes the assignment of the MB1262/CN22 motor control interface and the IO function associated from the STM32MP157xAA3. 6.27.1 Table 43. Motor control terminal and IO function assignment Motor Control connector CN22 STM32MP157xAA3 microcontroller Terminal Terminal name Port name PA6
-
PI5
-
PH13
-
Function TIM8_BKIN
-
Alternate function DCMI_PIXCLK
-
TIM8_CH1 SAI_2_SCK_A
-
TIM8_CH1N
-
-
CAN_1_TX
-
PI6 TIM8_CH2 SAI_2_SD_A
-
PH14
-
-
TIM8_CH2N
-
-
DCMI_D4
-
Emergency Stop GND MC_UH GND MC_UL GND MC_VH GND MC_VL GND MC_WH PI7 TIM8_CH3 SAI_2_FS_A GND MC_WL Bus Voltage PhaseA current GND PhaseB current GND PhaseC current GND NTC Bypass
-
PH15 PA3 PF12
-
ANA0
-
ANA1
-
PF3
-
TIM8_CH3N ADC_1_IN15 ADC_1_IN6
-
ADC_1_IN0
-
ADC_2_IN1
-
GPIO
-
DCMI_D11 GPIO6_TIM2_CH4
-
-
ADC_2_IN0
-
-
-
GPIO7 Board configurations to enable Motor Control Close MB1262/SB22
-
Close MB1262/SB67 Open MB1262/SB9 and SB66
-
Close MB1262/SB76
-
Close MB1262/SB75 Open MB1262/SB10 and SB73
-
Close MB1262/SB21
-
Close MB1262/SB65 Open MB1262/SB11 and SB63
-
Close MB1262/SB33 Close MB1262/SB14 Close MB1262/SB20
-
Close MB1262/SB12
-
Close MB1262/SB13
-
Close MB1262/SB19 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 UM2535 - Rev 2 page 38/59 UM2535 GPIO 40-pin expansion connector Motor Control connector CN22 STM32MP157xAA3 microcontroller 22 23 24 25 26 27 28 29 30 31 32 33 34 Terminal Terminal name GND Port name
-
Function
-
Dissipative Brake PH6 TIM12_CH1 GND 5V
-
-
-
-
Alternate function
-
GPIO12_TIM12_CH 1
-
-
Heatsink Temp. PF11 ADC_1_IN2 SAI_2_SD_B PFC Sync PE0 TIM4_ETR SAI_2_MCLK_A 3V3 PFC PWM GND Encoder A GND Encoder B Encoder Index
-
PB8
-
PH10
-
PH11 PH12
-
TIM4_CH3
-
TIM5_CH1
-
TIM5_CH2 TIM5_CH3
-
DCMI_D6
-
DCMI_D1
-
DCMI_D2 DCMI_D3 Figure 24. Motor control connector MB1262/CN22 Board configurations to enable Motor Control
-
Close MB1262/SB29
-
-
Close MB1262/SB70 Open MB1262/SB8 and SB69 Close MB1262/SB53 Open MB1262/SB7
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Close MB1262/SB24
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Close MB1262/SB28
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Close MB1262/SB30 Close MB1262/SB26 6.27.2 6.28 Limitations Due to the share of some IO of STM32MP157xAA3 by multiple peripherals, the following limitations apply in using the Motor control features:
The Motor control may not be operated simultaneously with the camera, audio Codec, CAN and GPIO expansion (GPIO6, 7 and 12). GPIO 40-pin expansion connector A 2x20-pin, 2.54 mm, GPIO connector is implemented on MB1262/CN21. 28 pins are GPIO, 8 are GND, 2x 5V DC and 2x 3V3 DC are provided on this connector. This GPIO 40-pin expansion connector has a Raspberry Pi shields support capability. Figure 25. MB1262/CN21 connector Please note the pin1 position that is on the bottom right on MB1262/CN21. UM2535 - Rev 2 page 39/59 UM2535 GPIO 40-pin expansion connector Table 44 describes the MB1262/CN21 connector pinout. STM32 pin Board function Pin Pin Board function STM32 pin Table 44. MB1262/CN21 connector pinout
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PA12 PA11 PI11
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PG8 PD7 PG15
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PZ2 PZ1 PZ0
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PH5 PG2 PA3 PI2 PI7 PF5
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3V3 I2C5_SDA I2C5_SCL MCO1 GND USART3_RTS SDMMC3_D3 SDMMC3_CK 3V3 SPI1_MOSI SPI1_MISO SPI1_SCK GND I2C2_SDA MCO2 TIM2_CH4 TIM8_CH4 SAI2_FSA SDMMC3_D2 GND 1 3 5 7 9 11 13 15 17 19 21 23 25 27 29 31 33 35 37 39 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32 34 36 38 40 5V 5V GND USART3_TX USART3_RX SAI2_SCKA GND SDMMC3_CMD SDMMC3_D0 GND SDMMC3_D1 SPI1_NSS GPIO I2C2_SCL GND TIM12_CH1 GND USART3_CTS SAI2_SDA SAI2_SDB
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PB10 PB12 PI5 GND PF1 PF0 GND PF4 PZ3
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PH4
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PH6
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PI10 PI6 PF11 SAI2 on the GPIO connector supports PCM signals. SAI2 is shared between the audio codec and this GPIO expansion connector. By default, SAI2 is connected to the audio codec. I2C5 is connected by default to the I2C_EXT connector. The following HW board modifications are needed to enable SAI2 and I2C5 on the GPIO expansion connector, as described in Table 45. Table 45. HW configurations to enable SAI2 on the GPIO connector Board function Board modifications to enable SAI2 on the GPIO connector SAI2_SCKA SAI2_FSA SAI2_SDA SAI2_SDB I2C5_SDA I2C5_SCL Open MB1262/SB9 and SB67. Close MB1262/SB66 Open MB1262/SB11 and SB65. Close MB1262/SB63 Open MB1262/SB10 and SB75. Close MB1262/SB73 Open MB1262/SB8 and SB70. Close MB1262/SB69 Open MB1262/SB54. Close MB1262/SB55 Open MB1262/SB51. Close MB1262/SB52 STM32 pin PI5 PI7 PI6 PF11 PA12 PA11 UM2535 - Rev 2 page 40/59 UM2535 RGB LTDC connector 6.29 RGB LTDC connector A 2x30-pin RGB LTDC connector is implemented on MB1262/CN11. Figure 26. MB1262/CN11 connector A 24-bit RGB interface, LCD control signals (INT, Backlight BL_CTRL, LCD_RESET, I2C), HDMI_CEC and SPDIF_TX are available as described in the connector pinout Section 6.29 . Table 46. MB1262/CN21 connector pinout IO Board function Pin PK7
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PJ4 PI12
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MFX_O1
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PJ0
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PJ2 PK0 PJ4 PK3 PJ6 PK5 PJ8
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PJ10 PJ12 PJ14
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LTDC_DE
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LTDC_R5 LTDC_HSYNC
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HDMI_PD
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LTDC_R1
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LTDC_R3 LTDC_G5 LTDC_R5 LTDC_B4 LTDC_R7 LTDC_B6 LTDC_G1
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LTDC_G3 LTDC_B0 LTDC_B2
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1 3 5 7 9 11 13 15 17 19 21 23 25 27 29 31 33 35 37 39 41 43 Pin 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32 34 36 38 40 42 44 Board function IO LTDC_R7 LCD_INT LTDC_B7
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LTDC_VSYNC
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LTDC_R0
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LTDC_R2
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LTDC_R4 LTDC_G6 LTDC_R6 LTDC_B5 LTDC_G0
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LTDC_G2
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LTDC_G4 LTDC_B1 LTDC_B3
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PJ6 MFX_IO14 PK6
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PI13
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PI15
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PJ1
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PJ3 PK1 PJ5 PK4 PJ7
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PJ9
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PJ11 PJ13 PJ15
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UM2535 - Rev 2 page 41/59 UM2535 RGB LTDC connector IO Board function Pin
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PK2 PA15 PH4 PH5
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3V3 LTDC_G7 HDMI_CEC I2C2_SCL I2C2_SDA LCD_BL_CTRL
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45 47 49 51 53 55 57 59 Pin 46 48 50 52 54 56 58 60 Board function IO LCD_RESET (SUB_NRST) PD10 5V GND
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SPDIF_TX GND LTDC_CLK GND
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PB5
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PI14
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6.29.1 Limitations LCD_INT, LCD_BL_CTRL are shared exclusively with the DSI. UM2535 - Rev 2 page 42/59 UM2535 STM32MP157x-EV1 jumper summary Appendix A STM32MP157x-EV1 jumper summary Figure 27 summarizes the jumper default setting of the STM32MP157x-EV1. Figure 27. Jumper default setting of the STM32MP157x-EV1 MB1262/JP3[1-2]:FITTED MB1262/JP1[2-3]:
FITTED MB1262/JP2[2-3]:
FITTED MB1262/JP4[1-2]:FITTED MB1263/JP1[-]: NOT FITTED MB1263/JP6[-], MB1263/JP7[-], MB1263/JP8[-], MB1263/JP9[-], MB1263/JP10[-], MB1263/JP11[-]:
NOT FITTED MB1262/JP5[-]:
NOT FITTED MB1262/JP7[1-2]:
FITTED MB1230/W1[2-3]:
FITTED MB1263/JP3[1-2], MB1263/JP4[1-2], MB1263/JP5[1-2]:
FITTED MB1262/JP6[-]:
NOT FITTED UM2535 - Rev 2 page 43/59 UM2535 STM32MP157x-EV1 I/O Assignment Appendix B STM32MP157x-EV1 I/O Assignment LFBGA448 ball AA3 V4 AB2 T4 V6 U5 W9 Y9 B13 A11 Y17 Y16 W16 W3 R3 E11 AB5 AA5 V13 A12 C13 AA8 W13 F11 AB8 F12 V9 Y5 AA7 V10 A13 B12 U10 AB3 Y1 U3 AB6 IO Port PA0 PA1 PA2 PA3 PA4 PA5 PA6 PA7 PA8 PA9 PA10 PA11 PA12 PA13 PA14 PA15 PB0 PB1 PB2 PB3 PB4 PB5 PB6 PB7 PB8 PB9 PB10 PB11 PB12 PB13 PB14 PB15 PC0 PC1 PC2 PC3 PC4 Table 47. STM32MP157x-EV1 I/O Assignment Main function Motor Control connector WAKE_UP ETH_RX_CLK ETH_MDIO TIM2_CH4 ADC1_IN18_DACOUT1 ADC1_IN19_DACOUT2 DCMI_PIXCLK ETH_RX_DV SDMMC2_D4 SDMMC2_D5 OTG_ID I2C5_SCL I2C5_SDA PA13 GPIO PA14 GPIO HDMI_CEC ETH_RXD2 ETH_RXD3 UART4_RX SDMMC2_D2 SDMMC2_D3 SPDIF_TX QSPI_BK1_NCS DCMI_VSYNC DCMI_D6 SDMMC1_CDIR USART3_TX ETH_TX_EN USART3_RX DFSDM_CKOUT SDMMC2_D0 SDMMC2_D1 QSPI_BK2_NCS ETH_MDC ETH_TXD2 DFSDM_DATA1 ETH_RXD0
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Bus Voltage
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Emergency Stop
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PFC PWM
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UM2535 - Rev 2 page 44/59 UM2535 STM32MP157x-EV1 I/O Assignment Main function Motor Control connector ETH_RXD1 DSI_TE SDMMC1_D123DIR SDMMC1_D0 SDMMC1_D1 SDMMC1_D2 SDMMC1_D3 SDMMC1_CK PMIC_WAKEUP LSE_IN LSE_OUT NAND_D2 NAND_D3 SDMMC1_CMD SDMMC2_D123DIR NAND_NOE NAND_NWE NAND_NWAIT SDMMC3_D3 NAND_D13 NAND_D14 NAND_D15 NAND_CLE NAND_ALE LCD_BL_CTRL NAND_D0 NAND_D1 SAI2_MCLKA
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ETH_TXD3 SDMMC2_CK SDMMC1_CKIN SDMMC2_D6 DCMI_D7 NAND_D4 NAND_D5 NAND_D6 NAND_D7 uSD_LS_EN SAI2_SCKB
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PFC Sync
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LFBGA448 ball AA6 E13 D13 E14 D14 F14 D15 E12 N2 P1 P2 C10 B10 D12 B11 C9 A9 L3 F10 M1 M2 A8 AB9 W12 V14 M3 L1 C5 D7 Y2 A10 F15 C12 E9 W10 Y12 W11 W14 D5 E4 IO Port PC5 PC6 PC7 PC8 PC9 PC10 PC11 PC12 PC13 PC14 PC15 PD0 PD1 PD2 PD3 PD4 PD5 PD6 PD7 PD8 PD9 PD10 PD11 PD12 PD13 PD14 PD15 PE0 PE1 PE2 PE3 PE4 PE5 PE6 PE7 PE8 PE9 PE10 PE11 PE12 UM2535 - Rev 2 page 45/59 UM2535 STM32MP157x-EV1 I/O Assignment Main function Motor Control connector SAI2_FSB SAI2_MCLKB
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SDMMC3_D0 SDMMC3_CMD SDMMC1_D0DIR GPIO SDMMC3_D1 SDMMC3_D2 QSPI_BK1_IO3 QSPI_BK1_IO2 QSPI_BK1_IO0 QSPI_BK1_IO1 QSPI_CLK SAI_2_SDB SLOW ADC DFSDM_DATA3 uSD_LDO_SEL DSI_RESET ETH_MDINT uSD_DETECT MCO2 CAN_STBY ETH_GTX_CLK ETH_CLK125 SDMMC2_CMD QSPI_BK2_IO3 USART3_RTS NAND_NCE QSPI_BK2_IO2 UART4_TX SPDIF_RX ETH_TXD0 ETH_TXD1 SDMMC3_CK HSE_IN HSE_OUT QSPI_BK2_IO0 QSPI_BK2_IO1 I2C2_SCL
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NTC Bypass
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Heatsink Temp. PhaseA current
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LFBGA448 ball A4 B4 C4 E10 B9 F13 V3 F9 D9 AA11 AA10 AB10 AB11 V12 W8 V8 W7 V7 W6 W5 Y4 W4 U4 AB4 U8 D11 Y11 Y8 W15 AA9 U11 J4 AA1 AA2 D10 T1 T2 AB7 Y6 A3 IO Port PE13 PE14 PE15 PF0 PF1 PF2 PF3 PF4 PF5 PF6 PF7 PF8 PF9 PF10 PF11 PF12 PF13 PF14 PF15 PG0 PG1 PG2 PG3 PG4 PG5 PG6 PG7 PG8 PG9 PG10 PG11 PG12 PG13 PG14 PG15 PH0 PH1 PH2 PH3 PH4 UM2535 - Rev 2 page 46/59 UM2535 STM32MP157x-EV1 I/O Assignment Main function Motor Control connector I2C2_SDA TIM12_CH1 DCMI_D9 DCMI_HSYNC DCMI_D0 DCMI_D1 DCMI_D2 DCMI_D3 CAN_TX DCMI_D4 DCMI_D11
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DCMI_D8 TIM8_CH4 DCMI_D10 DCMI_D5 SAI2_SCKA SAI2_SDA SAI2_FSA MFX_IRQ_OUT CAN_RX USART3_CTS MCO1 LTDC_HSYNC LTDC_VSYNC LTDC_CLK LTDC_R0 LTDC_R1 LTDC_R2 LTDC_R3 LTDC_R4 LTDC_R5 LTDC_R6 LTDC_R7 LTDC_G0 LTDC_G1 LTDC_G2 LTDC_G3 LTDC_G4 LTDC_B0
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Dissipative Brake
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Encoder A Encoder B Encoder Index MC_UL MC_VL MC_WL
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MC_UH MC_VH MC_WH
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TRACE_D0 TRACE_D1 TRACE_CLK
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TRACE_D8 TRACE_D9 TRACE_D10 TRACE_D11 TRACE_D12 TRACE_D2 TRACE_D3 TRACE_D13 TRACE_D14 TRACE_D15
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LFBGA448 ball A2 V11 W2 D6 E6 B1 B3 F5 D3 C2 C1 D1 E2 E1 E3 J6 F2 G5 F1 N1 J5 W1 T3 H2 H1 D2 F3 J2 L6 K4 J1 K2 K1 L5 L4 H6 L2 J3 K6 B8 IO Port PH5 PH6 PH7 PH8 PH9 PH10 PH11 PH12 PH13 PH14 PH15 PI0 PI1 PI2 PI3 PI4 PI5 PI6 PI7 PI8 PI9 PI10 PI11 PI12 PI13 PI14 PI15 PJ0 PJ1 PJ2 PJ3 PJ4 PJ5 PJ6 PJ7 PJ8 PJ9 PJ10 PJ11 PJ12 UM2535 - Rev 2 page 47/59 UM2535 STM32MP157x-EV1 I/O Assignment Main function Motor Control connector LTDC_B1 LTDC_B2 LTDC_B3 LTDC_G5 LTDC_G6 LTDC_G7 LTDC_B4 LTDC_B5 LTDC_B6 LTDC_B7 LTDC_DE SPI1_SCK SPI1_MISO SPI1_MOSI SPI1_NSS I2C4_SCL I2C4_SDA SMARTCARD_CLK SMARTCARD_IO
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TRACE_D4 TRACE_D5
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TRACE_D6 TRACE_D7
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LFBGA448 ball A7 B7 C7 D8 E7 E8 B6 A6 C6 A5 B5 G2 H5 K5 F4 G1 H4 G3 H3 IO Port PJ13 PJ14 PJ15 PK0 PK1 PK2 PK3 PK4 PK5 PK6 PK7 PZ0 PZ1 PZ2 PZ3 PZ4 PZ5 PZ6 PZ7 UM2535 - Rev 2 page 48/59 UM2535 Federal Communications Commission (FCC) and Industry Canada (IC) Compliance Statements Appendix C Federal Communications Commission (FCC) and Industry Canada (IC) Compliance Statements C.1 FCC Compliance Statement Part 15.19 This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Part 15.21 Any changes or modifications to this equipment not expressly approved by STMicroelectronics may cause harmful interference and void the user's authority to operate this equipment. Part 15.105 This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instruction manual, may cause harmful interference to radio communications. Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to correct the interference at his own expense. FCC ID FCC ID: YCP-MB1263-000. IC Compliance Statement This device complies with FCC and Industry Canada RF radiation exposure limits set forth for general population for mobile application (uncontrolled exposure). This device must not be collocated or operating in conjunction with any other antenna or transmitter. Compliance Statement Notice: This device complies with Industry Canada licence-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device. Industry Canada ICES-003 Compliance Label: CAN ICES-3 (A)/NMB-3(A). Dclaration de conformit Avis: Le prsent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorise aux deux conditions suivantes : (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radiolectrique subi, mme si le brouillage est susceptible d'en compromettre le fonctionnement. tiquette de conformit la NMB-003 d'Industrie Canada: CAN ICES-3 (A)/NMB-3(A). C.2 UM2535 - Rev 2 page 49/59 UM2535 CE conformity D.1 Warning Appendix D CE conformity EN 55032 / CISPR32 (2012) Class A product Warning: this device is compliant with Class A of EN55032 / CISPR32. In a residential environment, this equipment may cause radio interference. Avertissement : cet quipement est conforme la Classe A de la EN55032 / CISPR 32. Dans un environnement rsidentiel, cet quipement peut crer des interfrences radio. Simplified declaration of conformity Hereby, STMicroelectronics declares that the radio equipment types STM32MP157A-EV1 and STM32MP157C-
EV1 are in compliance with Directive 2014/53/EU. D.2 UM2535 - Rev 2 page 50/59 UM2535 Safety instructions Appendix E Safety instructions E.1 Safety instructions The STM32MP157x-EV1 Evaluation board is designed to be powered from the 5 V DC power supply unit provided in the package. The power supply acting as a disconnection device must remain easily accessible in case of issue. Marking observed on the power supply unit:
Marking for Class II product. Such product does not require a safety connection to electrical earth. For indoor use only. This marking indicates that the product operates with an alternating current (AC) source (mains). It is completed by afferent values (voltage, frequency and max current). This marking indicates that the terminal is suitable for direct current (DC) only. It is completed by afferent values (voltage and max current). The associated symbol means that WEEE and waste batteries must not be thrown away but collected separately and recycled. Do not expose it to heat from any source. Do not expose it to water, moisture or place on a conductive surface while in operation. UM2535 - Rev 2 page 51/59 UM2535 Sicherheitshinweise E.2 Sicherheitshinweise Das Evaluierungsboard STM32MP157x-EV1 ist ausgelegt fr den Betrieb mit dem im Lieferumfang enthaltenen 5V DC Netzteil. Das Netzteil muss frei zugnglich sein damit es jederzeit im Fall einer Gefahr oder einer Strung vom Netz getrennt werden kann. Kennzeichnung am Netzteil beachtet:
Kennzeichnung fr Produkte der Klasse II. Fr ein solches Produkt ist keine Erdung erforderlich. Nur fr den Innengebrauch. Diese Markierung zeigt an, dass das Produkt nur mit einer Wechselspannung (Netz) betrieben werden darf. Diese Markierung zeigt an, dass das Terminal nur fr Gleichstrom (DC) geeignet ist. Das Netzteil versorgt das Terminal mit der angepassten Spannung. Das zugehrige Symbol bedeutet, dass Elektro- und Elektronik-Altgerte nicht weggeworfen, sondern getrennt gesammelt und recycelt werden mssen. Setzen Sie es keiner Wrmequelle aus. Setzen Sie es whrend des Betriebs weder Wasser noch Feuchtigkeit aus und legen Sie es nicht auf eine leitfhige Oberflche. UM2535 - Rev 2 page 52/59 UM2535 Revision history Table 48. Document revision history Date 20-Feb-2019 22-Aug-2019 Version 1 2 Changes Initial release. Added certification appendices Federal Communications Commission (FCC) and Industry Canada (IC) Compliance Statements, CE conformity, and Safety instructions. UM2535 - Rev 2 page 53/59 UM2535 Contents Contents 1 2 3 4 5 6 Platform power tree. 11 Features. 2 Ordering information . 3 2.1 Product marking . 3 2.2 Codification . 3 Development environment . 4 3.1 System requirements . 4 3.2 Development toolchains . 4 3.3 Demonstration software . 4 Conventions. 5 Delivery recommendations . 6 Hardware layout and configuration. 7 6.1 Power supply management . 10 6.1.1 5 V power supply . 11 6.1.2 6.1.3 STPMIC1 . 12 Clocks. 12 6.2.1 LSE clock . 13 6.2.2 HSE clock . 13 Reset sources . 13 User buttons and LEDs . 13 Physical input devices: buttons . 13 Boot options. 14 Embedded ST-LINK/V2-1. 15 6.7.1 Drivers . 16 6.7.2 ST-LINK/V2-1 firmware upgrade . 17 6.8 ETM TRACE Micto-38 connector . 17 6.9 JTAG connector. 19 6.10 DDR3L . 20 6.11 eMMC . 20 6.3 6.4 6.5 6.6 6.7 6.2 UM2535 - Rev 2 page 54/59 UM2535 Contents 6.15.1 6.15.2 6.15.3 6.15.4 6.15.5 6.15.6 6.11.1 6.12.1 eMMC IO interface . 20 6.12 NAND Flash. 20 NAND IO interface . 20 6.13 Quad-SPI NOR Flash . 21 6.13.1 Quad-SPI IO interface. 21 6.14 microSD card. 22 SD card interface . 22 6.15 Audio. 23 Audio codec interface . 23 6.14.1 Digital microphones. 23 Analog microphone and audio jack headphone. 24 Audio speaker out . 24 SPDIF input and output. 25 6.18 6.19.1 6.16.1 IO restriction to other features. 26 6.16 DSI LCD . 26 DSI LCD interface . 26 6.17 Camera. 27 6.17.1 Camera interface . 27 1 Gbps Ethernet . 28 6.18.1 RGMII interface. 28 6.19 USB OTG HS. 29 USB OTG interface . 29 6.20 USB host . 30 USB host interface . 30 6.21 RS-232 port . 31 RS-232 interface . 31 6.21.1 6.21.2 IO restriction to other features. 33 FDCAN . 33 6.22.1 Operating voltage . 33 6.22.2 FDCAN interface. 33 6.23 Smartcard. 33 Smartcard interface. 34 6.20.1 6.23.1 6.22 UM2535 - Rev 2 page 55/59 UM2535 Contents 6.25 6.29.1 Slow ADC . 35 Fast ADC . 35 6.24 ADC/DAC . 35 ADC/DAC IO interface . 35 6.24.1 6.24.2 6.24.3 6.24.4 Limitations. 36 I2C_EXT connector. 36 6.25.1 I2C_EXT IO interface . 36 6.26 MFX MCU . 37 6.26.1 MFX IO expander . 37 6.27 Motor control . 38 6.27.1 Motor control IO interface . 38 6.27.2 Limitations. 39 6.28 GPIO 40-pin expansion connector . 39 6.29 RGB LTDC connector . 40 Limitations. 42 Appendix A STM32MP157x-EV1 jumper summary. 43 Appendix B STM32MP157x-EV1 I/O Assignment . 44 Appendix C Federal Communications Commission (FCC) and Industry Canada (IC) Compliance Statements. 49 C.1 FCC Compliance Statement . 49 C.2 IC Compliance Statement . 49 Appendix D CE conformity . 50 D.1 Warning . 50 D.2 Simplified declaration of conformity . 50 Appendix E Safety instructions. 51 Safety instructions. 51 Sicherheitshinweise . 52 Revision history . 53 Contents . 54 List of tables . 57 List of figures. 58 E.1 E.2 UM2535 - Rev 2 page 56/59 UM2535 List of tables List of tables Table 1. List of available products. 3 Table 2. Codification explanation . 3 Table 3. ON/OFF convention . 5 Table 4. STM32MP157x-EV1 overview . 10 Table 5. MB1263 daughterboard overview. 10 Table 6. MB1262 mother board overview . 10 Table 7. HW configuration for the user buttons and LEDs . 13 Table 8. Physical user devices: buttons. 13 Table 9. HW configuration for the BOOT mode MB1263/SW1 . 14 Table 10. STLINK USB B connector pinout MB1263/CN4 . 16 Table 11. HW configuration for the TRACE connector MB1262/U10 . 17 Table 12. TRACE MICTOR-38 connector pinout: MB1262/U10 . 19 Table 13. MB1262/CN14 JTAG connector pinout . 20 Table 14. HW configuration for the Quad-SPI interface . 20 Table 15. HW configuration for the Quad-SPI interface . 21 Table 16. HW configuration for the Quad-SPI interface . 21 Table 17. IO configuration for the SDIO interface . 22 Table 18. SDCARD connector pinout MB1263/CN9 . 23 Table 19. IO configuration for the Audio Codec interface . 23 Table 20. HW configuration for the digital microphones . 24 Table 21. Audio jack connector pinout MB1262/CN5. 24 Table 22. Audio jack connector pinout MB1262/CN4. 25 Table 23. IO configuration for the LCD interface. 26 Table 24. IO configuration for the camera interface. 27 Table 25. IO configuration for the Ethernet interface . 28 Table 26. Ethernet connector pinout MB1262/CN3 . 29 Table 27. IO configuration for the USB OTG interface . 29 Table 28. USB OTG Type Micro-AB connector pinout MB1262/CN16 . 30 Table 29. IO configuration for the USB Host interface . 30 Table 30. USB Host connector pinout MB1262/CN18 . 31 Table 31. USB Host connector pinout MB1262/CN20 . 31 Table 32. HW configuration for the RS-232 interface. 32 Table 33. RS-232 connector pinout MB1262/CN12. 32 Table 34. IO configuration for the SDIO interface . 33 Table 35. FDCAN interface and connector pinout CN17 . 33 Table 36. HW configuration for the Smartcard interface. 34 Table 37. Smartcard interface MB1262/U5 and connector pinout MB1262/CN23 . 34 Table 38. ADC/DAC connectors JP7/JP8/JP9/JP10/JP11 pinout . 36 Table 39. HW configuration for the I2C_EXT interface . 36 Table 40. I2C_EXT connector pinout MB1262/CN13. 37 Table 41. HW configuration for the MFX interface. 37 Table 42. IO signals driven by the MFX. 37 Table 43. Motor control terminal and IO function assignment . 38 Table 44. MB1262/CN21 connector pinout
. 40 Table 45. HW configurations to enable SAI2 on the GPIO connector . 40 Table 46. MB1262/CN21 connector pinout
. 41 Table 47. STM32MP157x-EV1 I/O Assignment . 44 Table 48. Document revision history . 53 UM2535 - Rev 2 page 57/59 UM2535 List of figures List of figures Figure 1. STM32MP157x-EV1 top view . 1 Figure 2. STM32MP157x-EV1 bottom view . 1 Figure 3. STM32MP157x-EV1 hardware block diagram. 8 Figure 4. STM32MP157x-EV1 board overview . 9 Figure 5. 5 V power supply connector: MB1263/CN1 . 11 Figure 6. STM32MP157x-EV1platform power tree . 12 Figure 7. STM32MP157x-EV1 boot related switch configuration . 15 Figure 8. STLINK USB B connector pinout MB1263/CN4. 16 Figure 9. USB composite device. 17 Figure 10. TRACE Mictor-38 connector: MB1262/U10. 19 Figure 11. SDCARD connector pinout MB1263/CN9. 22 Figure 12. Audio jack connector MB1262/CN5 . 24 Figure 13. Audio jack connector MB1262/CN4 . 25 Figure 14. SPDIF input MB1262/CN1 and output MB1262/CN2 connectors . 26 Figure 15. Ethernet connector MB1262/CN3 . 29 Figure 16. USB OTG Type Micro-AB connector MB1262/CN16 . 30 Figure 17. Dual USB TYPE A connector MB1262/CN18 and CN20. 31 Figure 18. HW configuration for the RS-232 interface . 32 Figure 19. RS-232 connector pinout MB1262/CN12 . 32 Figure 20. FDCAN connector pinout CN15 . 33 Figure 21. Smartcard connector pinout MB1262/CN23 . 34 Figure 22. ADC/DAC connectors MB1263/JP7, JP8, JP9, JP10, and JP11 . 35 Figure 23. I2C_EXT connector pinout MB1262/CN13 . 36 Figure 24. Motor control connector MB1262/CN22 . 39 Figure 25. MB1262/CN21 connector. 39 Figure 26. MB1262/CN11 connector . 41 Figure 27. Jumper default setting of the STM32MP157x-EV1. 43 UM2535 - Rev 2 page 58/59 UM2535 IMPORTANT NOTICE PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (ST) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to STs terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. For additional information about ST trademarks, please refer to www.st.com/trademarks. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. 2019 STMicroelectronics All rights reserved UM2535 - Rev 2 page 59/59
1 | Internal Photos - | Internal Photos | 1.01 MiB | March 10 2019 / April 10 2019 |
LCIE SUD EST Laboratoire de Moirans Z.I. CentrAlp 170, Rue de Chatagnon 38430 MOIRANS France FCCID:
YCP-MB1263-000 INTERNAL PHOTOS OF EQUIPMENT Page 1/7 LCIE SUD EST Laboratoire de Moirans Z.I. CentrAlp 170, Rue de Chatagnon 38430 MOIRANS France Page 2/7 LCIE SUD EST Laboratoire de Moirans Z.I. CentrAlp 170, Rue de Chatagnon 38430 MOIRANS France Page 3/7 LCIE SUD EST Laboratoire de Moirans Z.I. CentrAlp 170, Rue de Chatagnon 38430 MOIRANS France Page 4/7 LCIE SUD EST Laboratoire de Moirans Z.I. CentrAlp 170, Rue de Chatagnon 38430 MOIRANS France Page 5/7 LCIE SUD EST Laboratoire de Moirans Z.I. CentrAlp 170, Rue de Chatagnon 38430 MOIRANS France Page 6/7 LCIE SUD EST Laboratoire de Moirans Z.I. CentrAlp 170, Rue de Chatagnon 38430 MOIRANS France Page 7/7
1 | External Photos - | External Photos | 612.17 KiB | March 10 2019 / April 10 2019 |
LCIE SUD EST Laboratoire de Moirans Z.I. CentrAlp 170, Rue de Chatagnon 38430 MOIRANS France FCCID:
YCP-MB1263-000 EXTERNAL PHOTOS OF EQUIPMENT Page 1/3 LCIE SUD EST Laboratoire de Moirans Z.I. CentrAlp 170, Rue de Chatagnon 38430 MOIRANS France Page 2/3 LCIE SUD EST Laboratoire de Moirans Z.I. CentrAlp 170, Rue de Chatagnon 38430 MOIRANS France Page 3/3
1 | ID Label Location Information - | ID Label/Location Info | 547.91 KiB | March 10 2019 / April 10 2019 |
LCIE SUD EST Laboratoire de Moirans Z.I. CentrAlp 170, Rue de Chatagnon 38430 MOIRANS - FRANCE PRODUCT LABELING YCP-MB1263-000 FCCID:
Dimensions:
Emplacement on product:
50mm*110mm Photo provided Page 1/2 LCIE SUD EST Laboratoire de Moirans Z.I. CentrAlp 170, Rue de Chatagnon 38430 MOIRANS - FRANCE Page 2/2
1 | Confidential Request - | Cover Letter(s) | 230.45 KiB | March 10 2019 / April 10 2019 |
CONFIDENTIALITY REQUEST Curtis-Straus LLC One Distribution Center Circle #1 Littleton, MA 01460 USA September 27, 2019 Re:
FCC ID:
Confidentiality request YCP-MB1263-000 Gentlemen, STMicroelectronics requests, pursuant to 47CFR 0.457(d) and 0.459, post grant confidentiality for portions of the material contained in this application. The following document regarding this submission for FCC ID: YCP-MB1263-000 shall be kept confidential:
LONG-TERM CONFIDENTIALITY:
1. Block Diagram description of the equipment (file: Block Diagram - YCP-MB1263-000.pdf) Specifically, these exhibits contain information relating to circuit function and complexity that could be of benefit to competitors. The material contains trade secrets and confidential information that STMicroelectronics does not customarily release to the public and which is otherwise not generally available to the public. Regards, Responsible party:
Title:
Signature:
Joel HULOUX Director Lobbying & Standardization
1 | Cover letter - Agent Authorization Letter - | Cover Letter(s) | 181.50 KiB | March 10 2019 / April 10 2019 |
September 27, 2019 Letter of Agency To:
Federal Communications Commission 7435 Oakland Mills Road Columbia, MD 21046-1609 Curtis-Straus LLC TCB One Distribution Center Circle #1 Littleton, MA 01460 We, the undersigned STMicroelectronics hereby authorize Anthony MERLIN, LCIE SUD EST, to act on our behalf in all matters relating to all processes required for FCC certification of our devices. Any and all acts carried out by the above agent on our behalf shall have the same effects as acts of our own. This authorization is valid until: December 1st, 2019 If you have any questions regarding this authorization, let us know please. Sincerely, Joel HULOUX Signature
1 | Operational Description - | Operational Description | 670.52 KiB | March 10 2019 / April 10 2019 |
LCIE SUD EST Laboratoire de Moirans Z.I. CentrAlp 170, Rue de Chatagnon 38430 MOIRANS - FRANCE GENERAL INFORMATION FCCID:
YCP-MB1263-000 1.1. Product description LCIE SUD EST Laboratoire de Moirans Z.I. CentrAlp 170, Rue de Chatagnon 38430 MOIRANS - FRANCE Data sheet of equipment LCIE SUD EST Laboratoire de Moirans Z.I. CentrAlp 170, Rue de Chatagnon 38430 MOIRANS - FRANCE 1.2. Tested System Details LCIE SUD EST Laboratoire de Moirans Z.I. CentrAlp 170, Rue de Chatagnon 38430 MOIRANS - FRANCE LCIE SUD EST Laboratoire de Moirans Z.I. CentrAlp 170, Rue de Chatagnon 38430 MOIRANS - FRANCE 1.3. Test Methodology Both conducted and radiated testing were performed according to the procedures in ANSI C63.4 or ANSI C63.10, FCC Part 15 Subpart B. Radiated testing was performed at an antenna to EUT distance of 10 meters. During testing, all equipments and cables were moved relative to each other in order to identify the worst case set-up. 1.4. Test facility Tests have been performed: December 20, 2018 and February 25, 2019 This test facility has been fully described in a report and accepted by FCC as compliant with the radiated and AC line conducted test site criteria in ANSI C63.4 and ANSI C63.10. This test facility has also been accredited by COFRAC (French accreditation authority for European Union test lab accreditation organization) according to NF EN ISO/IEC 17025, as compliant with test site criteria and competence in 47 CFR Part 15/ANSI C63.4 and EN55022/CISPR22 norms for 89/336/EEC European EMC Directive application. All pertinent data for this test facility remains unchanged.
frequency | equipment class | purpose | ||
---|---|---|---|---|
1 | 2019-10-04 | JBP - Part 15 Class B Computing Device Peripheral | Original Equipment |
app s | Applicant Information | |||||
---|---|---|---|---|---|---|
1 | Effective |
2019-10-04
|
||||
1 | Applicant's complete, legal business name |
STMicroelectronics SAS
|
||||
1 | FCC Registration Number (FRN) |
0019756717
|
||||
1 | Physical Address |
190 Avenue Celestin Coq
|
||||
1 |
13106
|
|||||
1 |
Rousset
|
|||||
1 |
France
|
|||||
app s | TCB Information | |||||
1 | TCB Application Email Address |
t******@us.bureauveritas.com
|
||||
1 | TCB Scope |
A1: Low Power Transmitters below 1 GHz (except Spread Spectrum), Unintentional Radiators, EAS (Part 11) & Consumer ISM devices
|
||||
app s | FCC ID | |||||
1 | Grantee Code |
YCP
|
||||
1 | Equipment Product Code |
MB1263-000
|
||||
app s | Person at the applicant's address to receive grant or for contact | |||||
1 | Name |
J****** H******
|
||||
1 | Title |
Director Lobbying & Standardization
|
||||
1 | Telephone Number |
+3344********
|
||||
1 | Fax Number |
+33 4********
|
||||
1 |
j******@st.com
|
|||||
app s | Technical Contact | |||||
n/a | ||||||
app s | Non Technical Contact | |||||
n/a | ||||||
app s | Confidentiality (long or short term) | |||||
1 | Does this application include a request for confidentiality for any portion(s) of the data contained in this application pursuant to 47 CFR § 0.459 of the Commission Rules?: | Yes | ||||
1 | Long-Term Confidentiality Does this application include a request for confidentiality for any portion(s) of the data contained in this application pursuant to 47 CFR § 0.459 of the Commission Rules?: | No | ||||
if no date is supplied, the release date will be set to 45 calendar days past the date of grant. | ||||||
app s | Cognitive Radio & Software Defined Radio, Class, etc | |||||
1 | Is this application for software defined/cognitive radio authorization? | No | ||||
1 | Equipment Class | JBP - Part 15 Class B Computing Device Peripheral | ||||
1 | Description of product as it is marketed: (NOTE: This text will appear below the equipment class on the grant) | Electronic Evaluation Board | ||||
1 | Related OET KnowledgeDataBase Inquiry: Is there a KDB inquiry associated with this application? | No | ||||
1 | Modular Equipment Type | Does not apply | ||||
1 | Purpose / Application is for | Original Equipment | ||||
1 | Composite Equipment: Is the equipment in this application a composite device subject to an additional equipment authorization? | No | ||||
1 | Related Equipment: Is the equipment in this application part of a system that operates with, or is marketed with, another device that requires an equipment authorization? | No | ||||
1 | Is there an equipment authorization waiver associated with this application? | No | ||||
1 | If there is an equipment authorization waiver associated with this application, has the associated waiver been approved and all information uploaded? | No | ||||
app s | Test Firm Name and Contact Information | |||||
1 | Firm Name |
LCIE Etablissement Sud-Est
|
||||
1 | Name |
A**** M******
|
||||
1 | Telephone Number |
00-33********
|
||||
1 | Fax Number |
00-33********
|
||||
1 |
a******@lcie.fr
|
|||||
Equipment Specifications | |||||||||||||||||||||||||||||||||||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Line | Rule Parts | Grant Notes | Lower Frequency | Upper Frequency | Power Output | Tolerance | Emission Designator | Microprocessor Number | |||||||||||||||||||||||||||||||||
1 | 1 | 15B |
some individual PII (Personally Identifiable Information) available on the public forms may be redacted, original source may include additional details
This product uses the FCC Data API but is not endorsed or certified by the FCC