Application:
WLAN, 802.11b/g, Bluetooth, WLAN, etc Features SMD, high reliability, ultra Impact, Omni-directional Part number Information RANT 2012
(A)
(B) F
(C) 245
(D) C
(E) 07
(F)
(A)Product Type Chip Antenna
(B) Size Code
(C) Material
(D) Frequency 2.0x1.2mm(+-0.2mm) High K material 2.4 ~ 2.5GHz
(E) Feeding mode PIFA & Single Feeding
(F) Antenna type Type=06 Electrical Specification Working Frequency Range 2400 ~2484 MHz Bandwidth Peak Gain Impedance Return loss Polarization Azimuth Beamwidth Operation Temperature() Resistance to Soldering Heats Termination The specification is defined on EVB. 84 (Min.) 1.95dBi (Typ.) 50 Ohm 10 dB ( Min) Linear Omni-directional
-40 ~85 10sec. ( @ 280) Ni / Au (Leadless) Dimension and Terminal Configuration Dimension (mm) No. Terminal Name L W T 2.05+-0.15 1.20+-0.15 0.85+-0.10 1 2 Feeding/GNG GND RAIN International Technology Co., Ltd. TEL: 13530576606 2.4GHz 2012 Chip Antenna: RANT2012F245C07 Evaluation Board Reference PCB Dimension Antenna Layout Reference Unit :mm Electrical Characteristics Return Loss Return Loss & Radiation 1 Radiation Frequency(MHz) 2400 2450 2484 S11 (dB)
-10.77
-24.81
-10.243 Z Y X 2400MHz 2450MHz 2500MHz Efficiency 70.56%
75.25%
71.01%
Peak Gain 1.72 dBi 1.95 dBi 1.69 dBi Directivity 2.26 dBi 2.69 dBi 2.11 dBi 2.4GHz 2012 Chip Antenna: RANT2012F245C07 Taping Specifications Reel Specification Reel and Taping Specification TYPE SIZE A B C D 2012 7 5K/Reel 9.00.5 602 13.50.5 1782 Tapping Specification Packaging Type A B W E F G H T D P Paper Type 2012 1.500.20 2.300.20 8.00.20 1.750.10 3.50.05 4.00.10 2.00.05 0.750.10 1.570.10 4.00.1 2.4GHz 2012 Chip Antenna: RANT2012F245C07 Reliability Table Test Item Electrical Characterization Thermal Shock Temperature Cycling High Temperature Exposure Low Temperature Storage Solderability
(SMD Bottom Side) Soldering Heat Resistance
(RSH) Vibration Mechanical Shock Procedure 1. Preconditioning:
50 10 / 1 hr , then keep for 24 1 hrs at room temp. 2. Initial measure: Spec: refer Initial spec. 3. Rapid change of temperature test:
-30 to +85; 100 cycles;
15 minutes at Lower category temperature;
15 minutes at Upper category temperature. 1. Initial measure: Spec: refer Initial spec. 2. 100 Cycles (-30 to +85), Soak Mode=1(2 Cycle/hours). 3. Measurement at 24 2Hours after test condition. 1. Initial measure: Spec: refer Initial spec. 2. Unpowered; 500hours @ T=+85. 3. Measurement at 24 2 hours after test. 1. Initial measure: Spec: refer Initial spec. 2. Unpowered: 500hours @ T= -30. 3. Measurement at 24 2 hours after test. Dipping method:
a. Temperature: 235 5C b. Dipping time: 3 0.5s Preheating temperature: 150 10C. Preheating time: 1~2 min. Solder temperature: 260 5C. Dipping time: 5 0.5s 5g's for 20 min., 12 cycles each of 3 orientations Note: Use 8"X5" PCB .031" thick 7 secure points on, one long side and 2 secure points at corners of opposite sides. Parts mounted within 2" from any secure point. Test from 10-2000 Hz. Three shocks in each direction shall be applied along the three mutually perpendicular axes of the test specimen (18 shocks) Peak value: 1,500gs Duration: 0.5ms Velocity change: 15.4 ft/s Waveform: Half-sine Requirements Ceramic Type Fulfill the electrical specification No Visible Damage. Fulfill the electrical specification. Remark
(Reference) User Spec. MIL-STD-202 107 No Visible Damage. Fulfill the electrical specification. No Visible Damage. Fulfill the electrical specification. No Visible Damage. Fulfill the electrical specification. The solder should cover over 95% of the critical area of bottom side. No Visible Damage. JESD22 JA104 MIL-STD-202 108 MIL-STD-202 108 IEC 60384-21/22 4.10 IEC 60384-21/22 4.10 No Visible Damage. MIL-STD-202 Method 204 No Visible Damage. MIL-STD-202 Method 213 Humidity Bias 1. Humidity: 85% R.H., Temperature: 85 2C. 2. Time: 500 24 hours. 3. Measurement at 24 2hrs after testcondition. No Visible Damage. Fulfill the electrical specification. MIL-STD-202 Method 106 2.4GHz 2012 Chip Antenna: RANT2012F245C07 2.4GHz 2012 Chip Antenna: RANT2012F245C07 Board Flex
(SMD) 1. Mounting method:
No Visible Damage. IR-Reflow. PCB Size (L:100 W:40 T:1.6mm) 2. Apply the load in direction of the arrow until bending reaches 2 mm. _ AEC-Q200 005 Adhesion Force of 1.8Kg for 60 seconds. AEC-Q200 006 No Visible Damage Magnification of 20X or greater may be employed for inspection of the mechanical integrity of the device body terminals and body/terminal junction. Physical Dimension Any applicable method using x10 magnification, micrometers, calipers, gauges, contour projectors, or other measuring equipment, capable of determining the actual specimen dimensions. In accordance with specification. JESD22 JB100 Revision History Revision Date Content 1 2020/10/15 New Datasheet 2.4GHz 2012 Chip Antenna: RANT2012F245C06