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User Manual | Users Manual | 3.52 MiB | December 06 2021 | |||
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External photos | External Photos | 1.95 MiB | December 06 2021 | |||
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Label and location | ID Label/Location Info | 83.23 KiB | December 06 2021 | |||
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Agent Authorization Rev 1.0 | Cover Letter(s) | 51.55 KiB | December 06 2021 | |||
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Difference Description | Cover Letter(s) | 220.78 KiB | December 06 2021 | |||
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FCC Modular Approval Request Rev 3.0 | Cover Letter(s) | 179.64 KiB | December 06 2021 | |||
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FCC Short & Long Term Confidentiality Request Rev4.1 | Cover Letter(s) | 123.85 KiB | December 06 2021 | |||
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RF Exposure | RF Exposure Info | 682.24 KiB | December 06 2021 | |||
1 2 | Test Report | 3.71 MiB | December 06 2021 | |||||
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Test setup photo | Test Setup Photos | 498.94 KiB | December 06 2021 |
1 2 | User Manual | Users Manual | 3.52 MiB | December 06 2021 |
Features Supports Bluetooth 5.2 dual-mode (BDR/EDR/ BLE) specifications Support ProfileA2DP1.3, AVRCP1.6,HFP1.8,HSP1.2 SPP1.2 ,DID1.3, ARM Cortex-M4 with Floating Point Unit (FPU) application processor BMS002 BT5.2 LE Audio Module Product Specification Qualifie MT2822A to 52MHz to 3.4Mbps maximum speed 208MHz Maximum speed: 208MHz Maximum speed: 416MHz
(This Photos are for reference only) 42dBm (BLE1M/2M) Antenna gain3.8dBi (peak) low latency 400kB system RAM (SYSRAM) with Cadence HiFi Mini Audio Engine DSP coprocessor Support maximum three UART interface Up to 3Mbps Support maximum three SPI master interface, Clock up USB 2.0 device Support maximum three I2C Master mode 400kbps Up RF/Analog Frequency spectrum: 2.402 GHz to 2.480 GHz Receive sensitivity: -95 dBm (2 Mbps EDR) Crystal : 26MHZ 20PPM@-20~+70 Output Power82dBm (BDR) , 62dBm (EDR) EMMC/SDIO v2.0, up to 48MHz, 1-bit/4-bit mode eMMC4.41 , Stand-alone module with on-board PWB antenna and Bluetooth stack Supports high resolution up to 24-bit, 192 kHz audio data format Supports maximum three I2S interface Supports to connect max three hosts with HFP/A2DP profiles simultaneously Supports smart phone applications by Bluetooth SPP or BLE link Supports firmware field upgrade by USB/OTA Supports five microphones Compact surface mount module:28.28 * 15.60 * 4.0 mm LGA package 122pin, Flatness is less than 0.05mm RoHS compliant Ideal for portable battery operated devices Internal battery regulator circuitry DSP Audio Processing Support for single SCO or Esco link with CVSD/mSBC coding. Confidential-Release to Stsapp from Sunitec on 20211110 Peripherals Built-in lithium-ion and lithium-polymer battery charger (up to 1A) Integrated 1.8V and 3V configurable switching regulator and low-dropout (LDO) regulator Built-in ADC for battery monitoring and voltage sense Built-in ADC for charger thermal protection Built-in under voltage protection (UVP) An AUX-In port for external audio input Multiple I/O pins for control and status MAC/Baseband Processor Supports Bluetooth 5.2 dual-mode BDR/EDR transport for audio, voice, and SPP data exchange BLE transport for proprietary transparent service and Apple Notification Center Service (ANCS) data exchange Audio Codec SBC,AAC, LDAC 24-bit digital-to-analog converter (DAC) with 105dB SNR 24-bit analog-to-digital converter (ADC) with 95dB SNR Supports up to 24-bit, 192 kHz I2S digital audio Description The BMS002 LE Audio module is made in China, a fully qualified Bluetooth 5.2 dual-mode (BDR/EDR/BLE) module for designers to add wireless audio and voice applications to their products. The BMS002 products is a Bluetooth module that provides a complete wireless solution with Bluetooth stack, integrated PWB antenna, and worldwide radio certifications in a compact surface-mount package. Operating Condition Operating voltage: 3.2V to 4.6V Operating temperature: -20C to +70C HCI Interface High-speed HCI-UART interface (supports up to 3M bps) Spec-BMS002-V1.7 Page 1 of 26 Applications Soundbar and Subwoofer (FW dependent) Bluetooth portable speaker phone Multi-speaker (FW dependent) Bluetooth headset www.sunitec-cn.com Product Specification BMS002 BT5.2 LE Audio Module Featrue......................................................................................... 1 1. DEVICE OVERVIEW .................................................................................................................... 3 1.1 BMS002 Module series.......................................................................................................... 3 2. AUDIO CODEC..............................................................................................................................4 2.1 Auxiliary ADC Block description.......................................................................................... 4 2.2 Audio uplink (Analog part) .................................................................................................. 4 2.3 Audio downlink (Analog part) ..............................................................................................5 2.4 Digital controller for class-G amplifier ............................................................................... 6 3. Power-on/off sequence..................................................................................................................... 6 3.1 Pulling PWRKEY low (User presses PWRKEY.)............................................................... 6 3.2 Valid charger plug-in ............................................................................................................6 3.3 ALARM (RTC mode only) ..................................................................................................... 4. Battery charge specification revision 1.2 (BC1.2)............................................................................8 4.1 Feature and description ..........................................................................................................8 4.2 Functional block .................................................................................................................... 8 4.3 Linear Battery Charging ........................................................................................................ 8 5. Bluetooth RF Subsystem................................................................................................................ 9 5.1 Bluetooth description..............................................................................................................9 5.2 Functional specifications........................................................................................................ 9 5.3 Basic data rate Receiver & Transmitter specifications.....................................................10 5.4 Enhanced data rate Receiver & Transmitter specifications...............................................10 5.5 Bluetooth LE Receiver & Transmitter specifications........................................................10 6. Module Description........................................................................................................................ 11 6.1 BMS002 module structure....................................................................................................11 6.2 BMS002 module pin assignment and pin description......................................................... 11 7. Antenna of BMS002....................................................................................................................... 18 7.1 Recommended for PWB Antenna design............................................................................ 18 7.2 Module Placement Guidelines..............................................................................................18 8. Electrical Characteristics................................................................................................................ 20 8.1 Module Power Consumption (Vcore =0.7-1.1V)................................................................. 20 8.2 Module Power Supply.......................................................................................................... 21 9. Recommended Reflow Temperature Profile:................................................................................. 22 10. QR code label information:.......................................................................................................... 22 11. Certification.................................................................................................................................. 23 11.1 BQB Certification QDID...................................................................................................23 11.2 EMC Certification............................................................................................................. 23 12. Standard Packing Information...................................................................................................... 23 13. Document History.........................................................................................................................26 Spec-BMS002-V1.7 Page 2 of 26 www.sunitec-cn.com 1. DEVICE OVERVIEW Product Specification The BMS002 LEAudio modules are built around AIROHA Technology MT2822A SoCs respectively. The MT2822A SoC integrates the Bluetooth 5.0 dual- mode radio transceiver, Power Management Unit (PMU), a crystal and DSP. Users can configure the BMS002 module by using the UI tool and DSP tool, a Windows-based utility. The BMS002 is a BT5.2 Bluetooth sub-system using MT2822A chipset from Bluetooth chipset supplier AIROHA. BMS002 interfaces up to 256Mbit extra serial flash, it provides a fully compliant Bluetooth system to v5.2 of the specification for data and voice communications, The module and device firmware is fully compliant with the Bluetooth specification V5.2. Its the master crystal frequency is 26MHz. 1.1BMS002 Module series Spec-BMS002-V1.7 Page 3 of 26 www.sunitec-cn.com 2. AUDIO CODEC 2.1 Auxiliary ADC Block description Product Specification 2.2 Audio uplink (Analog part) The auxiliary ADC includes the following functional blocks:
temperature, are monitored and translated to the voltage domain. 12-bit A/D converter- Converts the multiplexed input signal to 12-bit digital data. The block diagram of audio uplink is illustrated below Figure 2.2-2. Audio uplink path is composed of PGA and Analog multiplexer- Selects signal from one of the eight auxiliary input pins. Real-world messages, such as audio ADC. The PGA gain range is the 0~30dB per 6dB step. There are six input pairs of the uplink path. The six input pairs also configuration as DMIC and AMIC. If no use the AMIC function, the six pairs input (VIN0 and VIN5) can be as one-wire DMIC function. Besides, the uplink front-end to PGA can be configured as ACC or DCC type. The necessary MIC bias voltages (MICBIAS0/1) are also provided by this completed audio codec. Relative Specification is as Table 2.2-2. Confidential-Release to Stsapp from Sunitec on 20211110 Six channel PGA and ADC analog MIC input VIN0P/N and VIN5P/N can be configuration as DMIC in/out Analog Gain Range is 0dB to 30dB and gain step is 6dB. Spec-BMS002-V1.7 Page 4 of 26 www.sunitec-cn.com Product Specification 2.3 Audio downlink (Analog part) Low-power MT2822A audio downlink includes stereo DACs and audio Class-G/D amplifiers for audio playback is shown in Figure 2.3-1. The amplifiers is implemented with class-D and class-G mode The digital Class-G controller preview the maximum signal level of input digital LCH and RCH signals, and then adjust the power level up or down in advance before the signal is played. The fully differential headphone amplifiers can deliver up to 38mW into 16Ohm load. The class-G gain range of amplifier is -22dB to +8dB, 1dB/step,The class-D gain range of amplifier is -6dB to
+6dB, 3dB/step. The 1.5V and 2.4V Capless LDOs are embedded in the audio downlink to enhance the power supply rejection ratio (PSRR). Confidential-Release to Stsapp from Sunitec on 20211110 38mW Stereo HP driver diff. output into 16Ohm Low-power music playback with Class-G Operation Ultra Low-power music playback with Class-D Operation Click-and-pop noise suppression of Class-G amplifiers <-80dBVpp Click-and-pop noise suppression of Class-D amplifiers <-70dBVpp Low output DC offset < 300uV The proposed downlink path supports the following features:
The data precisions in the downlink path are 24-bit data width. The supported input sample rates for downlink:
8K/11.025K/12K/16K/22.05K/24K/32K/44.1K/48K/96K/192K Spec-BMS002-V1.7 Page 5 of 26 www.sunitec-cn.com 2.4 Digital controller for class-G amplifier Product Specification The Class-G amplifier is used for power saving of playback, and it can adjust the HP amplifier power rail according the audio content. The Class-G digital controller detects audio signal amplify and sends a control signal to buck converter through GPIO. When source swing goes high, the digital controller makes the Class-G amplifier change the DAC output from low-voltage to high-voltage state to avoid signal clipping. When source swing goes low, it has a configurable hold time control to prevent the Class-G amplifier from frequently adjusting the voltage. If the signal stays in a low state after a specific hold time, the digital controller sends a request to make the Class-G amplifier change the output from a high-voltage state to a low-voltage state. Otherwise, the output stays in a high-voltage state. Figure 2.4-1 shows the block diagram of the Class-G digital controller. The audio digital Class-G path includes the following blocks: Preview FIFO, Frame Preview, EN-FSM, Hold Time control and DA signal generator. The EN-
FSM module enables each voltage level in Class G. The Class-G input source is from the O_08 and O_09 (the same as downlink), which is defined in the audio interconnection. The output of DA Generator is sent to the analog DAC. The Class-G digital controller supports the following features:
Support for the independent selection for Class-G amplifier high-voltage and low-voltage levels. Support for programmable high-voltage and low-voltage thresholds in the digital controller. Support for a programmable hold time in the digital controller to prevent frequently voltage switching. Built-in signal generator hardware for the DA signal request to the Class-G amplifier. 3. Power-on/off sequence PMIC manages the power-on and power-off of the handset. If the battery voltage is neither in the UVLO state nor in the thermal condition, there are three methods to power on the handset system. 3.1 Pulling PWRKEY low (User presses PWRKEY.) Pushing PWRKEY (pulling the PWRKEY pin to low level) Pulling PWRKEY low is a typical method to turn on the handset. The system reset ends at the moment when all default-on regulators are sequentially turned on. After that, the MCU will send the PWRHOLD signal back to PMIC for acknowledgement. To successfully power on the handset, PWRKEY should be kept low until PMIC receives PWRHOLD from the MCU.( shown in Figure 3.3-1) 3.2 Valid charger plug-in Valid charger plug-in (CHRIN voltage within valid range) The charger plug-in will also turn on the handset if the charger is valid and VSYS > UVLO, the handset will also be powered on.( shown in Figure 3.2-1) Spec-BMS002-V1.7 Page 6 of 26 www.sunitec-cn.com Confidential-Release to Stsapp from Sunitec on 20211110 Product Specification Spec-BMS002-V1.7 Page 7 of 26 www.sunitec-cn.com Confidential-Release to Stsapp from Sunitec on 20211110 Product Specification 4. Battery charge specification revision 1.2 (BC1.2) 4.1Feature and description USB charging port detection:
MT2822A BC1.2 charger detector is used to distinguish the different types of charger. This BC1.2 detector provide a capable to determine several types of charging port which including Standard Downstream Ports (SDP), Charging Downstream Ports (CDP), Dedicated Charger Ports (DCP), Apple charger, non-standard charger. Typically, BC1.2 detection will execute right after the charger is plugged-in for charger input current limit configuration (The current limit setting please refer to the Chargers Datasheet). 4.2Functional block Figure 4.2-1 shows BC1.2 function block diagram. 4.3 Linear Battery Charging Input current limit: 1.0A Power Path Management for Powering the System and Charging the Battery 24V Maximum Rating for VBUS Power JEITA Charge Protection NTC Thermistor Input Supports up to 0.5-A Charge Current with Current Monitoring Output (ISET) Programmable fast charging mode Spec-BMS002-V1.7 Page 8 of 26 www.sunitec-cn.com Confidential-Release to Stsapp from Sunitec on 20211110 5. Bluetooth RF Subsystem 5.1 Bluetooth description Product Specification The MT2822A series Bluetooth (BT) RF subsystem (as shown in Figure 5.1-1) consists of a highly integrated transceiver with tunable on-chip RF band pass filter (BPF) and BT TRX co-matching network.MT2822A series adopts a low intermediate frequency (LIF) receiver architecture. The receiver, including the on-chip RF BPF and TRX co-
matching network, consists of a LNA and single balanced passive mixer, a complex BPF and a pair of 10-bit SAR ADCs. The MT2822A series BT receiver has best-in-class out-of-band blocking performance without the need of any external RF BPF. The direct conversion transmitter consists of a pair of 9-bit current DACs and passive LPFs, an active IQ modulator (IQM) and a Class AB push-pull PA. This PA is capable of transmitting +5dBm power for enhanced data rate (EDR) and +8dBm for basic data rate (BDR). The Class AB push-pull PA, together with on-chip RF BPF and TRX co-matching network, minimizes TX harmonic distortion products significantly, eliminating the need for an external RF BPF. The - fractional-N RF synthesizer is phase locked to 26MHz reference clock to generate the RF LO frequency. The BBPLL generates sampling clock for ADC and DAC as well as digital clock to BT modem.MT2822A series implements various automatic calibration schemes to minimize changes in RF performance from chip-to-chip and temperature variations. No additional RF factory calibration is necessary. 5.2 Functional specifications conditions,unless stated otherwise. Typical RF performances are specified for mid. channel, TA = +25, and under recommended operating Spec-BMS002-V1.7 Page 9 of 26 www.sunitec-cn.com Confidential-Release to Stsapp from Sunitec on 20211110 5.3 Basic data rate Receiver & Transmitter specifications Items Frequency Range RF Maximum Output Power RF Maximum Power Control gain step Range RF Maximum Receiver Sensitivity@ BER0.1%
Maximum detectable input power @ BER0.1%
Crystal Frequency Calibration Modulation CharacteristicsDelta F1 Avg Carrier Frequency Drift 5.4Enhanced data rate Receiver & Transmitter specifications Items Frequency Range RF Maximum Output Power RF Maximum Power Control gain step Range RF Maximum Receiver Sensitivity@ BER0.01%
Maximum detectable input power @ BER0.01%
Crystal Frequency Calibration(Delta F1 Avg) Modulation Characteristics Carrier Frequency Drift 5.5Bluetooth LE Receiver & Transmitter specifications Items Frequency Range Maximum Output Power Maximum Receiver Sensitivity@ BER30.8%
Maximum detectable input power @ BER30.8%
Crystal Frequency Calibration Modulation Characteristics(Delta F1 Avg) Carrier Frequency Drift Product Specification Rate Units Min Typ Max MHZ 2402 Rate Units Min Typ Max
DH5 DH5 DH5 DH5
DH5
2DH5 3DH5 2DH5 3DH5 2DH5 3DH5 2DH5 3DH5
1M 2M 1M 2M 1M 2M
dBm dBm dBm dBm KHz KHz KHz MHZ dBm dBm dBm dBm dBm dBm dBm dBm KHz KHz KHz 6 2
-96
-20
-5 140
-40 2402 4 4 2 2
-96
-91
-20
-20
-5 140 140 MHZ 2402 dBm dBm dBm dBm dBm dBm KHz KHz KHz 2 2
-99
-96
-10
-10
-5 2135
-50
8 4
-95
-5 0 158 0
6 6 4 4
-95
-89
-5
-5 0 158 158
4 4
-98
-985
-5
-5 0 250 5 2480 10 8
-70
5 175 40 2480 8 8 8 8
-70
-70 5 175 175 2480 6 6
-70
-70
5 265 50 Rate Units Min Typ Max Spec-BMS002-V1.7 Page 10 of 26 www.sunitec-cn.com Confidential-Release to Stsapp from Sunitec on 20211110 6. Module Description 6.1 BMS002 module structure Product Specification 6.2BMS002 module pin assignment and pin description Spec-BMS002-V1.7 Page 11 of 26 www.sunitec-cn.com Confidential-Release to Stsapp from Sunitec on 20211110 Pull-Type
Table 6.1-1 Pin No. 1 2 3 4 5 6 7 8 9 10 11 12 13 15 16 17 18 19 20 21 22 27 28 41 42 43 48 49 50 55 56 57 62 63 64 69 70 71 76 77 78 Pin Type P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P P 14 AI
Power domain
Product Specification Description Ground reference Ground reference Ground reference Ground reference Ground reference Ground reference Ground reference Ground reference Ground reference Ground reference Ground reference Ground reference Ground reference Ground reference Ground reference Ground reference Ground reference Ground reference Ground reference Ground reference Ground reference Ground reference Ground reference Ground reference Ground reference Ground reference Ground reference Ground reference Ground reference Ground reference Ground reference Ground reference Ground reference Ground reference Ground reference Ground reference Ground reference Ground reference Ground reference Ground reference Ground reference Bluetooth 50 ohm transmitter output and receiver input Pin Name GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND BT_RFIN 36 DIO PD DVDD_IO_0 GPIO0 40 DIO PD DVDD_IO_0 GPIO1 23 DIO PD DVDD_IO_0 GPIO2 32 47 DIO PD DVDD_IO_0 GPIO3 DIO PD DVDD_IO_0 GPIO4 General purpose input/output, Pin 0 Alternate Pin Functions:
UART (0) Audio_EXT_SYNC_ General purpose input/output, Pin 1 Alternate Pin Functions:
UART (0) SRCLKENAI_FREF General purpose input/output, Pin 2 Alternate Pin Functions:
General purpose input/output, Pin 3 Alternate Pin Functions:
UART (0) DMIC(0) UART(2) SPI Master(2) General purpose input/output, Pin 4 DMIC (0) RESETB_OUT Spec-BMS002-V1.7 Page 12 of 26 www.sunitec-cn.com Confidential-Release to Stsapp from Sunitec on 20211110 Product Specification 54 DIO PD DVDD_IO_0 GPIO5 60 DIO PD DVDD_IO_0 GPIO6 67 DIO PD DVDD_IO_0 GPIO7 82 DIO PD DVDD_IO_0 GPIO8 81 DIO PD DVDD_IO_0 GPIO9 68 DIO PD DVDD_IO_0 GPIO10 75 DIO PD DVDD_IO_0 GPIO11 I2C (1) DMIC(1) PWM(4) CLKO3 I2C (1) UART(1) DMIC(1) PWM(3) UART(2) I2C(2) I2S Master(1) SPI Master(1) SPI Slave(0) AUXADC UART(1) I2C(2) I2S Master(0) PWM(0) SPI Master(1) SPI Slave(0) AUXADC Alternate Pin Functions:
General purpose input/output, Pin 5 Alternate Pin Functions:
General purpose input/output, Pin 6 Alternate Pin Functions:
General purpose input/output, Pin 7 Alternate Pin Functions:
General purpose input/output, Pin 8 Alternate Pin Functions:
General purpose input/output, Pin 9 Alternate Pin Functions:
General purpose input/output, Pin 10 Alternate Pin Functions:
I2C(0) I2S Master(0) I2S Slave(0) CLKO0 SPI Master(1) SPI Slave(0) AUXADC I2C(0) I2S Master(0) I2S Slave(0) UART(0) SPI Master(1) SPI Slave(0) AUXADC I2C(1) I2S Master(0) I2S Slave(0) UART(0) SPI Master(1) SPI Slave(0) AUXADC I2C(1) I2S Master(0) I2S Slave(0) UART(1) SPI Master(1) SPI Slave(0) AUXADC General purpose input/output, Pin 11 Alternate Pin Functions:
General purpose input/output, Pin 12 Alternate Pin Functions:
I2C(1) I2S Master(0) 74 DIO PD DVDD_IO_0 GPIO12 Spec-BMS002-V1.7 Page 13 of 26 www.sunitec-cn.com Confidential-Release to Stsapp from Sunitec on 20211110 Product Specification 111 DIO Hi-Z DVDD_IO_1 GPIO13 24 DIO PD DVDD_IO_1 GPIO14 119 DIO PD DVDD_IO_1 GPIO15 46 DIO PD DVDD_IO_1 GPIO16 39 DIO PD DVDD_IO_1 GPIO17 35 DIO PD DVDD_IO_1 GPIO18 31 DIO HIGH DVDD_IO_1 GPIO19 53 DIO PD DVDD_IO_0 GPIO20 PWM(2) I2S Master(1) I2S Slave(1) PWM(1) I2S Master(1) I2S Slave(1) I2C(0) I2S Master(2) I2S Slave(2) I2S Slave(0) UART(1) UART(2) AUXADC General purpose input/output, Pin 13 Alternate Pin Functions:
MSDC(0) DMIC(0) General purpose input/output, Pin 14 Alternate Pin Functions:
MSDC(0) DMIC(0) UART(0) General purpose input/output, Pin 15 Alternate Pin Functions:
I2S Master(2) I2S Master(1) I2S Slave(1) MSDC(0) DMIC(1) SPI Master(0) UART(2) General purpose input/output, Pin 16 Alternate Pin Functions:
MSDC(0) DMIC(1) SPI Master(0) UART(1) General purpose input/output, Pin 17 Alternate Pin Functions:
MSDC(0) General purpose input/output, Pin 18 Alternate Pin Functions:
I2S Master(1) I2S Master(2) I2S Slave(2) MSDC(0) General purpose input/output, Pin 19 Alternate Pin Functions:
I2S Master(0) I2S Master(2) I2S Slave(2) MSDC(0) General purpose input/output, Pin 20 Alternate Pin Functions:
I2C(0) I2C(1) I2S Master(2) SPI Master(0) UART(1) I2C(0) I2S Master(2) I2S Slave(2) SPI Master(0) UART(2) SPI Master(0) UART(2) SPI Master(0) UART(1) Spec-BMS002-V1.7 Page 14 of 26 www.sunitec-cn.com Confidential-Release to Stsapp from Sunitec on 20211110 Product Specification 61 DIO PD DVDD_IO_0 GPIO21 37 DIO PD DVDD_IO_0 GPIO22 44 DIO PD DVDD_IO_0 GPIO23 30 DIO PD DVDD_IO_0 GPIO24 51 DIO PD DVDD_IO_0 GPIO25 58 DIO PD DVDD_IO_0 GPIO26 93 DIO PD DVDD_IO_0 GPIO27 97 DIO PD DVDD_MC0 GPIO28 I2C(0) I2C(1) I2S Master(1) I2S Slave(1) SPI Master(2) UART(1) General purpose input/output, Pin 21 Alternate Pin Functions:
General purpose input/output, Pin 22 Alternate Pin Functions:
I2S Master(1) I2S Slave(1) DMIC(1) SPI Master(2) UART(1) General purpose input/output, Pin 23 Alternate Pin Functions:
I2S Master(2) I2S Slave(2) DMIC(1) SPI Master(2) UART(1) General purpose input/output, Pin 24 Alternate Pin Functions:
I2S Master(2) I2S Slave(2) DMIC(0) SPI Master(0) UART(1) General purpose input/output, Pin 25 Alternate Pin Functions:
General purpose input/output, Pin 26 Alternate Pin Functions:
General purpose input/output, Pin 27 Alternate Pin Functions:
General purpose input/output, Pin 28 Alternate Pin Functions:
General purpose input/output, Pin 29 Alternate Pin Functions:
I2C(1) I2C(0) I2S Master(0) I2S Slave(0) DMIC(0) SPI Master(0) SPI Master(1) UART(0) I2C(2) I2S Master(2) I2S Slave(2) DMIC(0) SPI Master(2) SPI Master(0) I2C(2) I2S Master(2) I2S Slave(2) SPI Master(2) SPI Master(0) PWM(2) I2C(1) I2C(0) I2S Master(0) I2S Slave(0) DMIC(0) I2C(2) CLKO0 I2S Master(0) I2S Slave(0) 110 DIO PD DVDD_IO_1 GPIO29 Spec-BMS002-V1.7 Page 15 of 26 www.sunitec-cn.com Confidential-Release to Stsapp from Sunitec on 20211110 Product Specification 89 DIO PD DVDD_IO_0 GPIO30 65 DIO PD DVDD_IO_0 GPIO31 72 DIO PD DVDD_IO_0 GPIO32 79 DIO PD DVDD_MC0 GPIO33 83 DIO PD DVDD_IO_0 GPIO34 33 DIO PD DVDD_IO_0 GPIO35 29 DIO PD DVDD_IO_0 GPIO36 25 DIO PD DVDD_IO_0 GPIO37 26 DIO PD DVDD_IO_0 GPIO38 SPI Master(0) SPI Master(1) UART(0) I2C(0) I2S Master(2) I2S Slave(2) SPI Master(2) I2C(0) I2S Master(2) I2S Slave(2) DMIC(1) SPI Master(2) UART(0) I2C(2) I2S Master(0) I2S Slave(0) DMIC(1) SPI Master(0) SPI Master(1) UART(0) General purpose input/output, Pin 30 Alternate Pin Functions:
General purpose input/output, Pin 31 Alternate Pin Functions:
General purpose input/output, Pin 32 Alternate Pin Functions:
General purpose input/output, Pin 33 Alternate Pin Functions:
I2S Master(2) I2S Slave(2) SPI Master(2) UART(1) General purpose input/output, Pin 34 Alternate Pin Functions:
I2S Master(2) I2S Slave(2) SPI Master(2) SPI Slave(0) UART(1) General purpose input/output, Pin 35 Alternate Pin Functions:
I2S Master(1) I2S Slave(1) PWM(0) SPI Slave(0) UART(1) UART(2) General purpose input/output, Pin 36 Alternate Pin Functions:
I2S Master(1) I2S Slave(1) PWM(1) SPI Slave(0) UART(1) UART(2) General purpose input/output, Pin 37 Alternate Pin Functions:
MSDC(0) UART(2) General purpose input/output, Pin 38 Alternate Pin Functions:
I2C(0) I2S Master(1) I2S Slave(1) SPI Slave(0) I2C(0) I2S Master(1) I2S Slave(1) Spec-BMS002-V1.7 Page 16 of 26 www.sunitec-cn.com Confidential-Release to Stsapp from Sunitec on 20211110 85 DIO PD DVDD_IO_0 GPIO39 Hi-Z Hi-Z Hi-Z
98 99 90 86 115 113 114 34 38 45 52 73 80 59 66 84 88 92 96 120 121 122 109 108 87 107 95 91 112 100 94 101 102 103 105 106 116 117 118 104 DIO DIO DIO AI DI AO P AO AO AO AO AI AI AI AI AI AI AI AI AI AI AI AI AO AO AO AO AO P I AI P P P AO P P AIO AIO NC VDIG18 VDIG18 VDIG18 VSYS VIO18 AVDD18_AU D_DRV
AVDD18_AU D_DRV AVDD18_AU D_DRV AVDD18_AU D_DRV AVDD18_AU D_DRV
AVDD33_MB AVDD33_MB AVDD33_MB AVDD33_MB AVDD33_MB
BAT VSYS
VSYS
VDD33 VDD33
Product Specification SPI Slave(0) MSDC(0) UART(2) General purpose input/output, Pin 39 Alternate Pin Functions:
I2S Master(0) I2S Master(1) I2S Master(2) SPI Master2 SPI Slave(0) PWM(4) CLKO2 RTC GPIO 0 RTC GPIO 1 RTC GPIO 2 PWRKEY Button SYSRSTB Button Headphone L-ch P-side Battery connection. Connect VBAT to the positive terminal of battery. RTC_GPIO0 RTC_GPIO1 RTC_GPIO2 PWRKEY SYSRSTB LED1 LED0 AU_HPLP AU_HPLN AU_HPRN AU_HPRP Headphone L-ch P-side Headphone L-ch N-side Headphone R-ch N-side Headphone R-ch P-side AU_VIN0_P AU_VIN0_N AU_VIN1_P AU_VIN1_N AU_VIN2_P AU_VIN2_N AU_VIN3_N AU_VIN3_P AU_VIN4_P AU_VIN4_N AU_VIN5_P AU_VIN5_N Audio input CH0 P-side Audio input CH0 N-side Audio input CH1 P-side Audio input CH1 N-side Audio input CH2 P-side Audio input CH2 N-side Audio input CH3 N-side Audio input CH3 P-side Audio input CH4 P-side Audio input CH4 N-side Audio input CH5 P-side Audio input CH5 N-side AU_MICBIAS0 Analog mic phone bias0 AU_MICBIAS1 Analog mic phone bias1 AU_MICBIAS2 Analog mic phone bias2 AU_MICBIAS3 Analog mic phone bias3 AU_MICBIAS4 Analog mic phone bias4 VBAT BATSNS CHR_THM VSYS DVDD_IO_0 DVDD_IO_1 VDD33 VIO18 VBUS USB_DP USB_DM NC for battery's charging current Battery connection. Connect VBAT to the positive terminal of battery. Negative terminal sensing resistor Thermistor (BATON) for battery temperature. System load connection. Connect VSYS to system load. Power input of GPIO group 0 Power input of GPIO group 1 VLDO33 output voltage Buck VIO18, 1V8 power output, max200mA. Charger power input. USB signal DP USB signal DN NC Spec-BMS002-V1.7 Page 17 of 26 www.sunitec-cn.com Confidential-Release to Stsapp from Sunitec on 20211110 7. Antenna of BMS002 7.1 Recommended for PWB Antenna design See Figure 7.2-1 Product Specification Around of the PWB Antenna should keep out of metal over 15mm, So that RF have a good performance , 7.2Module Placement Guidelines For a Bluetooth-enabled product, the antenna placement affects the overall performance of the system. The antenna requires free space to radiate RF signals and it must not be surrounded by the ground plane. Recommend that the areas underneath the antenna on the host PWB must not contain copper on top, inner, or bottom layers, as illustrated in Figure 7.2-1. A low-impedance ground plane will ensure the best radio performance (best range, lowest noise). The ground plane can be extended beyond the minimum recommendation, as required for the main PWB EMC noise reduction. For the best range performance, keep all external metal at least 15 mm away from the on-board PWB trace antenna. Figure 7.3-1 and Figure 7.3-2 and Figure 7.3-3 illustrate examples of good and poor placement of the BMS002 module on a host board with GND plane. Spec-BMS002-V1.7 Page 18 of 26 www.sunitec-cn.com Confidential-Release to Stsapp from Sunitec on 20211110 Product Specification Spec-BMS002-V1.7 Page 19 of 26 www.sunitec-cn.com Confidential-Release to Stsapp from Sunitec on 20211110 Product Specification 8. Electrical Characteristics This section provides an overview of the BMS002 LEAudio module electrical characteristics. Additional information will be provided in future revisions of this document as it becomes available. Absolute maximum ratings for the BMS002 module are listed below. Exposure to these maximum rating conditions for extended periods may affect device reliability. Functional operation of the device at these or any other conditions, above the parameters indicated in the operation listings of this specification is not implied. 8.1 Module Power Consumption (Vcore =0.7-1.1V) TABLE 8-1 ConditionTA = +25 , Vcore=0.7 1.1V (not fixed) Module base on Sunitec BMS002 EVB Mode Power Consumption (mA) BT Pairing mode Connected mode Sleep mode Send power OFF command BT SBC streaming mode Play silence tone AUX in mode Call active Disconnect mode Reconnecting mode Max. Avg. Min. Max. Avg. Min. Max. Avg. Min. Max. Avg. Min. Max. Avg. Min. Max. Avg. Min. Max. Avg. Min. Max. Avg. Min. 3.57 1.37 0.84 7.29 3.25 0.75 1.35 0.54 0.38 5.64 4.97 4.70 5.25 5.18 4.68 7.34 6.91 6.71 3.66 3.34 0.40 8.66 3.26 0.75 Note:
1. BT Firmware : FW_MT2822A_ER3_ADC_OUT_MAX_0Db 2. BT Codec SBC 3. The current consumption values are measured with the BMS002 EVB as test platform, with BAT_IN = 3.89V. The Distance between the smartphone and BMS002 EVB is 30cm, and the speaker is without loading. Spec-BMS002-V1.7 Page 20 of 26 www.sunitec-cn.com Confidential-Release to Stsapp from Sunitec on 20211110 8.2Module Power Supply TABLE 8-3-1 Recommended Operating Conditions Operating Temperature Range Supply Voltage, (VBAT) VSYS Voltage (VSYS) Supply Voltage,(VIO) Supply Voltage,(DVDD_IO_0-2) Supply Voltage, (VBUS) Power key SYRSTB Product Specification Min
-20C 3.0V 3.0V
+1.62V
+1.62V 4.1V 0.7 * VBAT 0.7 * VIO
Max
+70C
+5.5V
+5.5V
+3.63V
+3.63V
+23V
0.3 * VBAT 0.3 * VIO Spec-BMS002-V1.7 Page 21 of 26 www.sunitec-cn.com Confidential-Release to Stsapp from Sunitec on 20211110 Product Specification 9. Recommended Reflow Temperature Profile:
Key features of the profile:
-Initial Ramp=1-2.5/sec to 175 equilibrium
-Equilibrium time=60 to 90 seconds
-Ramp to Maximum temperature (250)=3/sec Max
-Time above liquidus temperature (217): 70 - 90 seconds
-Device absolute maximum reflow temperature: 250
-TAMURA solder paster 10.QR code label information:
Label MAC IDXXXXXX (last 6 digits) FW Ver: Vxx.xx (V17.03) Customer part NO: 07GBTMS00-1BXBH4-N 07GBTMS00-1BXBM4-N 07GBTMS00-1BXBL4-N
(These Photos are for reference only) Spec-BMS002-V1.7 Page 22 of 26 www.sunitec-cn.com Confidential-Release to Stsapp from Sunitec on 20211110 Product Specification 11.Certification 11.1 BQB Certification QDID 11.2 EMC Certification TBD The BMS002 module has received the regulatory approval for following countries:
No Country Certification STANDARD Certification ID/No. 1 2 3 United States Canada Europe 4 Argentina 5 Japan 6 Malaysia 7 UAE 8 Mexico Peru 9 The component does not contain any prohibited substance specified in SS-00259. If using recycled plastic or sheathed wire as customer-classified, it shall be procured from a Sony green partner. 12.Standard Packing Information Module packing Box (Max 2100pcs module per box) 35pcs per tray, 10trays per ESD bag, vacuum packing sealed in ESD PE bag. Maximum modules per ESD bag is 350pcs Module packing bag dimension: 290*160*6.5mm Delivering carton box To hold of module carton box for shipment, 6bags per box (Max 2100pcs modules per box) Delivery Carton Box dimension: 310.0mm x 340.0mm x 340.0mm (W x D x H) ESD tray dimension: 290*160*6.5mm Spec-BMS002-V1.7 Page 23 of 26 www.sunitec-cn.com Confidential-Release to Stsapp from Sunitec on 20211110 Product Specification plastic tray size :290mm*160mm*6.5mmqty :35 pcs/ tray 10 trays / package bag carton size 310mm*340mm*340mm6 bags / carton , total :2100pcs/carton The actual photo plastic tray photo :35 pcs/ tray Spec-BMS002-V1.7 Page 24 of 26 www.sunitec-cn.com Confidential-Release to Stsapp from Sunitec on 20211110 Product Specification ESD PE bag dimension Vacuum packing 10trays per ESD bag) Carton box (6bags in per carton box) Spec-BMS002-V1.7 Page 25 of 26 www.sunitec-cn.com Confidential-Release to Stsapp from Sunitec on 20211110 Product Specification 13.Document History Revision V1.0 V1.1 V1.2 Date 2021-02-18 2021-02-25 2021-03-02 History First release Updated pin description Updated BMS002 module structure/packaging V1.3 V1.4 V1.5 V1.6 V1.7 2021-03-25 2021-08-05 2021-09-08 2021-10-08 2021-10-18 Add profile information and add in module RF performance data Add power consumption data and updated RF Antenna Design Guidelines Updated to Crystal : 26MHZ 20PPM@-20~+70 Removed 64Mbit flash party number BLE 1M/2M RF output power change to 4dBm from 6dBm for CE certification Contact Information Sunitec Enterprise Co., Ltd. China Factory:
Building C No.725 , WeiXiangTai Industrial Zone, FuCheng Street , LongHua District , ShenZhen ,Guangdong , China Tel: 86-755-28016180 Fax: 86-755-28016097 E-mail: sales16@sunitec-cn.com or manager@sunitec-cn.com Http://www.sunitec-cn.com Confidential-Release to Stsapp from Sunitec on 20211110 Spec-BMS002-V1.7 Page 26 of 26 www.sunitec-cn.com IC Warning This device complies with Industry Canada licence-exempt RSS standard(s). Operation is subject to the following two conditions:
(1) This device may not cause interference, and
(2) This device must accept any interference, including interference that may cause undesired operation of the device. The modular can be installed or integrated in mobile or fix devices only. This modular cannot be installed in any portable device. For a host manufacture's using a certified modular, if (1) the module's IC number is not visible when installed in the host, or (2) if the host is marketed so that end users do not have straightforward commonly used methods for access to remove the module so that the IC number of the module is visible; then an additional permanent label referring to the enclosed module: "Contains Transmitter Module IC: 23011-BMS002" or "Contains IC: 23011-BMS002"
must be used. Le prsent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorise aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radiolectrique subi, mme si le brouillage est susceptible d'en compromettre le fonctionnement Le modular peut tre install ou intgr dans un mobile ou rparer une seule chose Installation dans nimporte quell appareil portable. Pour un hte, on utilise un modular, si (1) le numro de module est non visible Quand on est install dans le serveur, or (2) si le propritaire est commercialis Straightforward commonly used for the access to remove travail so that the number IC en vue Le module est visible;Ensuite, le label permanent a t attribu au module: "Contient le Module IC:
23011-BMS002" " ou "contenu IC: 23011-BMS002" doit be used. Radiation Exposure Statement This modular complies with RF radiation exposure limits set forth for an uncontrolled environment. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter except in accordance with multi-transmitter product procedures. This modular must be installed and operated with a minimum distance of 20 cm between the radiator and user body. Dclaration d'exposition aux rayonnements Ce module est conforme aux limites d'exposition aux rayonnements RF dfinies pour un environnement non contrl. Cet metteur ne doit pas tre co-localis ou fonctionner en conjonction avec une autre antenne ou metteur, sauf conformment aux procdures du produit multi-metteur. Ce modulaire doit tre install et exploit avec une distance minimale de 20 cm entre le radiateur et le corps de l'utilisateur. FCC Statement following two conditions:
This device complies with part 15 of the FCC Rules. Operation is subject to the
(1) This device may not cause harmful interference, and
(2) this device must accept any interference received, including interference that may cause undesired operation. Any Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. If the FCC identification number is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. This exterior label can use wording such as the following: Contains Transmitter Module FCC ID: 2AMX3BMS002 Or Contains FCC ID:
2AMX3BMS002 below warning statements;
When the module is installed inside another device, the user manual of the host must contain 1. This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:
(1) This device may not cause harmful interference.
(2) This device must accept any interference received, including interference that may cause undesired operation. 2. Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. The devices must be installed and used in strict accordance with the manufacturer's instructions as described in the user documentation that comes with the product. Any company of the host device which install this modular with Limited Single modular approval should perform the test of radiated emission and spurious emission according to FCC part 15C :
15.247 and 15.209 requirement, Only if the test result comply with FCC part 15C : 15.247 and 15.209 requirementthen the host can be sold legally. Requirement per KDB996369 D03 2.2 List of applicable FCC rules List the FCC rules that are applicable to the modular transmitter. These are the rules that specifically establish the bands of operation, the power, spurious emissions, and operating fundamental frequencies. DO NOT list compliance to unintentional-radiator rules (Part 15 Subpart B) since that is not a condition of a module grant that is extended to a host manufacturer. See also Section 2.10 below concerning the need to notify host manufacturers that further testing is required.3 Explanation: This module meets the requirements of FCC part 15.247. 2.3 Summarize the specific operational use conditions Describe use conditions that are applicable to the modular transmitter, including for example any limits on antennas, etc. For example, if point-to-point antennas are used that require reduction in power or compensation for cable loss, then this information must be in the instructions. If the use condition limitations extend to professional users, then instructions must state that this information also extends to the host manufacturers instruction manual. In addition, certain information may also be needed, such as peak gain per frequency band and minimum gain, specifically for master devices in 5 GHz DFS bands. Explanation: The EUT has a PCB Antenna, and the antenna use a permanently attached antenna which is not replaceable. 2.4 Limited module procedures If a modular transmitter is approved as a limited module, then the module manufacturer is responsible for approving the host environment that the limited module is used with. The manufacturer of a limited module must describe, both in the filing and in the installation instructions, the alternative means that the limited module manufacturer uses to verify that the host meets the necessary requirements to satisfy the module limiting conditions. A limited module manufacturer has the flexibility to define its alternative method to address the conditions that limit the initial approval, such as: shielding, minimum signaling amplitude, buffered modulation/data inputs, or power supply regulation. The alternative method could include that the limited module manufacturer reviews detailed test data or host designs prior to giving the host manufacturer approval. This limited module procedure is also applicable for RF exposure evaluation when it is necessary to demonstrate compliance in a specific host. The module manufacturer must state how control of the product into which the modular transmitter will be installed will be maintained such that full compliance of the product is always ensured. For additional hosts other than the specific host originally granted with a limited module, a Class II permissive change is required on the module grant to register the additional host as a specific host also approved with the module. Explanation: The module is a limited module, limited used in speaker. 2.5 Trace antenna designs For a modular transmitter with trace antenna designs, see the guidance in Question 11 of KDB Publication 996369 D02 FAQ Modules for Micro-Strip Antennas and traces. The integration information shall include for the TCB review the integration instructions for the following aspects: layout of trace design, parts list (BOM), antenna, connectors, and isolation requirements. a) Information that includes permitted variances (e.g., trace boundary limits, thickness, length, width, shape(s), dielectric constant, and impedance as applicable for each type of antenna);
b) Each design shall be considered a different type (e.g., antenna length in multiple(s) of frequency, the wavelength, and antenna shape (traces in phase) can affect antenna gain and must be considered);
c) The parameters shall be provided in a manner permitting host manufacturers to design the printed circuit (PC) board layout;
d) Appropriate parts by manufacturer and specifications;
e) Test procedures for design verification; and f) Production test procedures for ensuring compliance. The module grantee shall provide a notice that any deviation(s) from the defined parameters of the antenna trace, as described by the instructions, require that the host product manufacturer must notify the module grantee that they wish to change the antenna trace design. In this case, a Class II permissive change application is required to be filed by the grantee, or the host manufacturer can take responsibility through the change in FCC ID (new application) procedure followed by a Class II permissive change application. Explanation: Yes, The module with trace antenna designs, and This manual has been shown the layout of trace design, antenna, connectors, and isolation requirements. 2.6 RF exposure considerations It is essential for module grantees to clearly and explicitly state the RF exposure conditions that permit a host product manufacturer to use the module. Two types of instructions are required for RF exposure information: (1) to the host product manufacturer, to define the application conditions (mobile, portable xx cm from a persons body); and (2) additional text needed for the host product manufacturer to provide to end users in their end-product manuals. If RF exposure statements and use conditions are not provided, then the host product manufacturer is required to take responsibility of the module through a change in FCC ID (new application). Explanation: This module complies with FCC RF radiation exposure limits set forth for an uncontrolled environment, This equipment should be installed and operated with a minimum distance of 20 centimeters between the radiator and your body." This module is designed to comply with the FCC statement, FCC ID is: 2AMX3BMS002. 2.7 Antennas A list of antennas included in the application for certification must be provided in the instructions. For modular transmitters approved as limited modules, all applicable professional installer instructions must be included as part of the information to the host product manufacturer. The antenna list shall also identify the antenna types
(monopole, PIFA, dipole, etc. (note that for example an omni-directional antenna is not considered to be a specific antenna type)). For situations where the host product manufacturer is responsible for an external connector, for example with an RF pin and antenna trace design, the integration instructions shall inform the installer that unique antenna connector must be used on the Part 15 authorized transmitters used in the host product. The module manufacturers shall provide a list of acceptable unique connectors. Explanation: The EUT has a PCB Antenna, and the antenna use a permanently attached antenna which is unique. 2.8 Label and compliance information Grantees are responsible for the continued compliance of their modules to the FCC rules. This includes advising host product manufacturers that they need to provide a physical or e-label stating Contains FCC ID with their finished product. See Guidelines for Labeling and User Information for RF Devices KDB Publication 784748. Explanation: The host system using this module, should have label in a visible area indicated the following texts: Contains FCC ID: 2AMX3BMS002, Contains IC:
23011-BMS002 2.9 Information on test modes and additional testing requirements5 Additional guidance for testing host products is given in KDB Publication 996369 D04 Module Integration Guide. Test modes should take into consideration different operational conditions for a stand-alone modular transmitter in a host, as well as for multiple simultaneously transmitting modules or other transmitters in a host product. The grantee should provide information on how to configure test modes for host product evaluation for different operational conditions for a stand-alone modular transmitter in a host, versus with multiple, simultaneously transmitting modules or other transmitters in a host. Grantees can increase the utility of their modular transmitters by providing special means, modes, or instructions that simulates or characterizes a connection by enabling a transmitter. This can greatly simplify a host manufacturers determination that a module as installed in a host complies with FCC requirements. Explanation: Top band can increase the utility of our modular transmitters by providing instructions that simulates or characterizes a connection by enabling a transmitter. 2.10 Additional testing, Part 15 Subpart B disclaimer The grantee should include a statement that the modular transmitter is only FCC authorized for the specific rule parts (i.e., FCC transmitter rules) listed on the grant, and that the host product manufacturer is responsible for compliance to any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. If the grantee markets their product as being Part 15 Subpart B compliant
(when it also contains unintentional-radiator digital circuity), then the grantee shall provide a notice stating that the final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed. Explanation: The module without unintentional-radiator digital circuity, so the module does not require an evaluation by FCC Part 15 Subpart B. The host shoule be evaluated by the FCC Subpart B.
1 2 | Agent Authorization Rev 1.0 | Cover Letter(s) | 51.55 KiB | December 06 2021 |
Sunitec Enterprise Co., Ltd Agent Authorization Company: Sunitec Enterprise Co., Ltd Address: Building C No.725,WeixiangTai Industrial Zone,FuCheng Street,LongHua District,ShenZhen,Guangdong,China. Product Name: Bluetooth module Model Number(s): BMS002 Product Description: Bluetooth module We authorize MiCOM Labs Inc., 575 Boulder Court, Pleasanton, California 94566, USA, to act on our behalf on all matters concerning the certification of above named equipment. We declare that MiCOM Labs Inc. is allowed to forward all information related to the approval and certification of equipment to the regulatory agencies as required and to discuss any issues concerning the approval application. Any and all acts carried out by MiCOM Labs on our behalf shall have the same effect as acts of our own. Signature:
Date: 2021.11.23 Name:
Liyuanshun Title:
General manager Company: Sunitec Enterprise Co., Ltd
1 2 | Difference Description | Cover Letter(s) | 220.78 KiB | December 06 2021 |
Differences Description We Sunitec Enterprise Co., Ltd state:
Product Bluetooth module Model Name BMS002 Brand Name Sunitec FCC ID 2AMX3BMS002 IC 23011-BMS002 This module has a variety of combinations due to differences in components. See next page for details. For different type, SPI Flash & Switching CON & 2nd source have different combinations. SPI Flash use 128M or 256M; Switching CON with or without ANT connector; Filter and 26M Crystal have or not have 2nd source (Alternative)the technical specifications are identical. Sincerely, Company: Sunitec Enterprise Co., Ltd Title: General Manager E-mail: yuanshun@sunitec-cn.com Name: Liyuanshun Signature
1 2 | FCC Modular Approval Request Rev 3.0 | Cover Letter(s) | 179.64 KiB | December 06 2021 |
Sunitec Enterprise Co., Ltd Federal Communications Commission Equipment Authorization Division 7435 Oakland Mills Road Columbia, MD 21046 USA Date:
Subject; Modular Transmitter Application Company name: Sunitec Enterprise Co., Ltd FCC ID: 2AMX3BMS002 Dear Sir/Madam, This letter includes the FCC application requirements for Modular Transmitter Approval Request for;-
FCC KDB 996369 D01 Module Certification Guide v02; and FCC KDB 996369 D03 OEM Manual v01 In accordance with 47CFR 15.212 Modular Transmitters and KDB 996369 D01 Module Equip Auth Guide v02. FCC ID 2AMX3BMS002 has been examined against the following requirements. Requirement per 15.212 and KDB 996369 D01 The radio elements must have the radio frequency circuitry shielded. Physical components and tuning capacitor(s) may be located external to the shield, but must be on the module assembly. The module must have buffered modulation/data inputs to ensure that the device will comply with Part 15 requirements with any type of input signal. The module must contain power supply regulation on the module. The module must contain a permanently attached antenna, or contain a unique antenna connector, and be marketed and operated only with specific antenna(s), per 15.203, 15.204(b), 15.204(c), 15.212(a), 2.929(b). The module must demonstrate compliance in a stand-alone configuration. The module must be labeled with its permanently affixed FCC ID label, or use an electronic display (see KDB Publication 784748). The module must comply with all specific rules applicable to the transmitter, including all the conditions provided in the integration instructions by the grantee. Explanation from Grantee
(do not write yes/no, but explain why product complies/how it is achieved) No, without shielded Yes , All inputs to the modules are buffered through logic or microprocessor inputs. Yes, A low drop out regulator is used for modular power supply regulation. Yes, Device is equipped with Integral antenna. Yes, distance between modular and all AEs are longer than 20cm refer to setup photo. Yes ,The modular has a permanent fixed label, and below statement was listed in the User Manual; The host device must be labeled to display the FCCID of the module Contains FCC ID: 2AMX3BMS002 Yes ,The module comply with all specific rules applicable to the transmitter including all the conditions provided in the integration instructions by the grantee, Refer to test report and user manual FCC Modular Approval Request Rev 3.0 Sunitec Enterprise Co., Ltd The module must comply with RF exposure requirements Yes , Transmitter meets MPE calculation of 47 CFR 1.1307 . Refer to MPE Reports and Refer to modular installation manual Integration Instructions for host product manufacturers The following items are submitted in support of application for Modular Transmitter FCC ID as noted above as required by the FCC KDB 996369 D03 OEM Manual v01. These items are provided as integration instructions for host product manufacturers (e.g., OEM instruction manual) to use when integrating a module in a host product. Any requirements that are not applicable to the Module are as indicated below. Summary of requirements and Checklist. Refer to the KDB for description of the complete requirements;
User Manual Page Number KDB reference Ref Sect 2.2 2.3 2.4 2.5 2.6 2.7 2.8 2.9 List of applicable FCC rules Summarize the specific operational use conditions Limited module procedures Trace antenna designs RF exposure considerations Antennas Label and compliance information Information on test modes and additional testing requirements Additional testing, Part 15 Subpart B disclaimer Requirements of KDB 996369 D03 2.10 Name: Liyuanshun Date: 2021.11.30 Title: General manager Signature of applicant:
FCC Modular Approval Request Rev 3.0
1 2 | FCC Short & Long Term Confidentiality Request Rev4.1 | Cover Letter(s) | 123.85 KiB | December 06 2021 |
Sunitec Enterprise Co., Ltd Office of Engineering Technology Federal Communications Commission 7435 Oakland Mills Road Columbia, MD 21046 USA Date: 2021.11.23 Subject; Request for Confidentiality FCC ID: 2AMX3BMS002 To Whom It May Concern, Pursuant to the provisions of the Commissions rules Title 47 Sections 0.457 and 0.459, we are requesting the Commission to withhold the following attachment(s) as confidential documents from public disclosure indefinitely. These documents contain detailed system and equipment descriptions and are considered as proprietary information in operation of the equipment. The public disclosure of these documents might be harmful to our company and would give competitors an unfair advantage in the market. Schematic Diagram Block Diagram Parts List Operational Description Tune-up Procedure SOFTWARE SECURITY REQUIREMENTS FOR U-NII DEVICES In additional to above mentioned documents, in order to comply with the marketing regulations in Title 47 CFR 2.803 and the importation rules in Title 47 CFR 2.1204, while ensuring that business sensitive information remains confidential until the actual marketing of newly authorized devices, we request Short Term Confidentiality of the following attachment(s);
External Photos Test Setup Photos Internal Photos User Manual For 45 days, pursuant to Public Notice DA 04-1705. OR For 180 days pursuant to KDB 726920 D01. It is our understanding that all measurement test reports, FCC ID label format and correspondence during the certification review process cannot be granted as confidential documents and this information will be available for public review once the grant of equipment authorization is issued. Sincerely, Signature:
Name: Liyuanshun Title: General manager
frequency | equipment class | purpose | ||
---|---|---|---|---|
1 | 2021-12-06 | 2402 ~ 2480 | DSS - Part 15 Spread Spectrum Transmitter | Original Equipment |
2 | 2402 ~ 2480 | DTS - Digital Transmission System |
app s | Applicant Information | |||||
---|---|---|---|---|---|---|
1 2 | Effective |
2021-12-06
|
||||
1 2 | Applicant's complete, legal business name |
Sunitec Enterprise Co., Ltd
|
||||
1 2 | FCC Registration Number (FRN) |
0026685073
|
||||
1 2 | Physical Address |
Building C No.725, WeiXiangTai Industrial Zone, FuCheng Street, LongHua District
|
||||
1 2 |
Building C No.725, WeiXiangTai Industrial Zone
|
|||||
1 2 |
Shenzhen, Guangdong, N/A
|
|||||
1 2 |
China
|
|||||
app s | TCB Information | |||||
1 2 | TCB Application Email Address |
c******@micomlabs.com
|
||||
1 2 | TCB Scope |
A4: UNII devices & low power transmitters using spread spectrum techniques
|
||||
app s | FCC ID | |||||
1 2 | Grantee Code |
2AMX3
|
||||
1 2 | Equipment Product Code |
BMS002
|
||||
app s | Person at the applicant's address to receive grant or for contact | |||||
1 2 | Name |
y****** L********
|
||||
1 2 | Title |
General manager
|
||||
1 2 | Telephone Number |
+86-7********
|
||||
1 2 | Fax Number |
+86-7********
|
||||
1 2 |
y******@sunitec-cn.com
|
|||||
app s | Technical Contact | |||||
1 2 | Firm Name |
Sunitec Enterprise Co., Ltd
|
||||
1 2 | Physical Address |
China
|
||||
1 2 |
y******@sunitec-cn.com
|
|||||
app s | Non Technical Contact | |||||
n/a | ||||||
app s | Confidentiality (long or short term) | |||||
1 2 | Does this application include a request for confidentiality for any portion(s) of the data contained in this application pursuant to 47 CFR § 0.459 of the Commission Rules?: | Yes | ||||
1 2 | Long-Term Confidentiality Does this application include a request for confidentiality for any portion(s) of the data contained in this application pursuant to 47 CFR § 0.459 of the Commission Rules?: | No | ||||
if no date is supplied, the release date will be set to 45 calendar days past the date of grant. | ||||||
app s | Cognitive Radio & Software Defined Radio, Class, etc | |||||
1 2 | Is this application for software defined/cognitive radio authorization? | No | ||||
1 2 | Equipment Class | DSS - Part 15 Spread Spectrum Transmitter | ||||
1 2 | DTS - Digital Transmission System | |||||
1 2 | Description of product as it is marketed: (NOTE: This text will appear below the equipment class on the grant) | Bluetooth module | ||||
1 2 | Related OET KnowledgeDataBase Inquiry: Is there a KDB inquiry associated with this application? | No | ||||
1 2 | Modular Equipment Type | Limited Single Modular Approval | ||||
1 2 | Purpose / Application is for | Original Equipment | ||||
1 2 | Composite Equipment: Is the equipment in this application a composite device subject to an additional equipment authorization? | Yes | ||||
1 2 | Related Equipment: Is the equipment in this application part of a system that operates with, or is marketed with, another device that requires an equipment authorization? | No | ||||
1 2 | Grant Comments | Limited Modular Approval. Output power listed is conducted power. The antenna used with this transmitter must be installed to provide a minimum separation distance of at least 20 cm from all persons and must not be co-located or operating in conjunction with any other antenna or transmitter, except in accordance with FCC multi- transmitter product procedures. End-users must be provided with operating procedures for satisfying RF exposure compliance. OEM integrators and end-users must be provided with transmitter operation conditions for satisfying RF exposure compliance. Only the antenna tested with the device or similar antennas with equal or lesser gain may be used with this transmitter. | ||||
1 2 | Is there an equipment authorization waiver associated with this application? | No | ||||
1 2 | If there is an equipment authorization waiver associated with this application, has the associated waiver been approved and all information uploaded? | No | ||||
app s | Test Firm Name and Contact Information | |||||
1 2 | Firm Name |
SHENZHEN STS TEST SERVICES CO.,LTD.
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1 2 | Name |
B******** Y****
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1 2 | Telephone Number |
+86 7********
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1 2 |
B******@stsapp.com
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Equipment Specifications | |||||||||||||||||||||||||||||||||||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Line | Rule Parts | Grant Notes | Lower Frequency | Upper Frequency | Power Output | Tolerance | Emission Designator | Microprocessor Number | |||||||||||||||||||||||||||||||||
1 | 1 | 15C | CC | 2402.00000000 | 2480.00000000 | 0.0070000 | |||||||||||||||||||||||||||||||||||
Line | Rule Parts | Grant Notes | Lower Frequency | Upper Frequency | Power Output | Tolerance | Emission Designator | Microprocessor Number | |||||||||||||||||||||||||||||||||
2 | 1 | 15C | CC | 2402.00000000 | 2480.00000000 | 0.0030000 |
some individual PII (Personally Identifiable Information) available on the public forms may be redacted, original source may include additional details
This product uses the FCC Data API but is not endorsed or certified by the FCC