FCC ID: 2APDW0037 ESP Module

by: Syrp Limited latest update: 2018-05-22 model: 0037

One grant has been issued under this FCC ID on 05/22/2018 (this is the only release in 2018 for this grantee). Public details available include frequency information, manuals, and internal & external photos. some products also feature user submitted or linked troubleshooting guides, instructions, password defaults, warrantee terms, & drivers.

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all	frequencies		exhibits	applications
		manual

all exhibits 11
1 ~ 2018-05-22 11

app s				submitted / available
1	User Manual	Users Manual	pdf	1.78 MiB
1		Cover Letter(s)	pdf
1		External Photos	pdf
1		ID Label/Location Info	pdf
1		Cover Letter(s)	pdf
1		RF Exposure Info	pdf
1		Test Report	pdf
1		Test Report	pdf
1		Internal Photos	pdf
1		Test Setup Photos	pdf
1		Cover Letter(s)	pdf

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User Manual

Users Manual

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1.78 MiB

User manual Product Name:ESP Module Model Name:0037 Manufacture:Syrp Limited Page 1 www.Syrp.co.nz Contents 1, Overview ............................................................................................................................................. 3 2 Pin Definitions ..................................................................................................................................... 4 2.1 Pin Layout ...................................................................................................................................... 4 2.2 Pin Description .............................................................................................................................. 5 2.3 Strapping Pins ............................................................................................................................... 5 3 functional Description ......................................................................................................................... 7 3.1 CPU and Internal Memory ............................................................................................................ 7 3.2 External Flash and SRAM .............................................................................................................. 7 3.3 Crystal Oscillators .......................................................................................................................... 7 3.4 RTC and Low-Power Management ............................................................................................... 7 4. Peripherals and Sensors ..................................................................................................................... 9 4.1 Peripherals and Sensors Description ............................................................................................ 9 5. Electrical Characteristics .................................................................................................................. 14 5.1 Absolute Maximum Ratings ........................................................................................................ 14 5.2 Wi-Fi Radio .................................................................................................................................. 14 5.3 BLE Radio ..................................................................................................................................... 15 5.3.1 Receiver .................................................................................................................................... 15 5.3.2 Transmitter .............................................................................................................................. 15 5.4 Reflow Profile .............................................................................................................................. 16 6. ESP32-PICO-D4 Schematics .............................................................................................................. 17 7. ESP32-0031-7002 Schematics .......................................................................................................... 18 8. Peripheral Schematics ...................................................................................................................... 19 9 Learning Resources ............................................................................................................................ 20 9.1 Must-Read Documents ............................................................................................................... 20 9.2 Must-Have Resources ................................................................................................................. 20 Page 2 www.Syrp.co.nz 1, Overview ESP32-0037-7002 is a wireless product, which mainly includes an ESP32-PICO-D4, a 32768Hz crystal and a 2.4GHz antenna. See the block diagram as Figure 1. 0037-7002 provides the WIFI and Blue Tooth (BLE) functions. The ESP32-PICO-D4 is a System-in-Package (SIP) module that is based on ESP32, providing complete Wi-Fiand Bluetooth functionalities. The module integrates a 4-MB SPI flash. At the core of this module is the ESP32 chip, which is a single 2.4 GHz Wi-Fi and Bluetooth combo chip. ESP32-PICO-D4 integrates all peripheral components seamlessly, including a crystal oscillator, flash, filter capacitors and RF matching links in one single package. Figure 1 Block diagram of ESP32-0037-7002 Page 3 www.Syrp.co.nz 2 Pin Definitions 2.1 Pin Layout Pin 30 Pin 29 Pin 28 Pin 27 Pin 26 Pin 25 Pin 24 Pin 23 Pin 22 Figure 2 Pin Layout of ESP32-0037-7002 Pi n 10 Pi n 11 Pi n 12 Pi n 13 Pi n 14 Pi n 15 Pi n 16 Pi n 17 Pi n 18 Pi n 19 Pi n 20 Pi n 21 Pin 1 Pin 2 Pin 3 Pin 4 Pin 5 Pin 6 Pin 7 Pin 8 Pin 9 Page 4 www.Syrp.co.nz 2.2 Pin Description Table 2: Pin Description Name EN Type I Function Chip-enable signal. Active high. IO34 IO35 IO25 IO26 IO27 IO14 IO12 GND VDD IO13 IO15 IO2 IO0 IO4 IO21 IO22 IO5 IO18 IO23 GND VDD VDD IO19 NC U0RXD U0TXD NC VDD GND I I I/O I/O I/O I/O I/O P P I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O P P P I/O

I/O I/O

P P GPIO34, ADC1_CH6, RTC_GPIO4 GPIO35, ADC1_CH7, RTC_GPIO5 GPIO25, DAC_1, ADC2_CH8, RTC_GPIO6, EMAC_RXD0 GPIO26, DAC_2, ADC2_CH9, RTC_GPIO7, EMAC_RXD1 GPIO27, ADC2_CH7, TOUCH7, RTC_GPIO17, EMAC_RX_DV GPIO14, ADC2_CH6, TOUCH6, RTC_GPIO16, MTMS, HSPICLK,HS2_CLK, SD_CLK, EMAC_TXD2 GPIO12, ADC2_CH5, TOUCH5, RTC_GPIO15, MTDI, HSPIQ, HS2_DATA2, SD_DATA2, EMAC_TXD3 Ground Power supply (2.3V ~ 3.6V) GPIO13, ADC2_CH4, TOUCH4, RTC_GPIO14, MTCK, HSPID, HS2_DATA3, SD_DATA3, EMAC_RX_ER GPIO15, ADC2_CH3, TOUCH3, MTDO, HSPICS0, RTC_GPIO13,HS2_CMD, SD_CMD, EMAC_RXD3 GPIO2, ADC2_CH2, TOUCH2, RTC_GPIO12, HSPIWP, HS2_DATA0, SD_DATA0 GPIO0, ADC2_CH1, TOUCH1, RTC_GPIO11, CLK_OUT1, EMAC_TX_CLK GPIO4, ADC2_CH0, TOUCH0, RTC_GPIO10, HSPIHD, HS2_DATA1, SD_DATA1, EMAC_TX_ER GPIO21, VSPIHD, EMAC_TX_EN GPIO22, VSPIWP, U0RTS, EMAC_TXD1 GPIO5, VSPICS0, HS1_DATA6, EMAC_RX_CLK GPIO18, VSPICLK, HS1_DATA7 GPIO23, VSPID, HS1_STROBE Ground Power supply (2.3V ~ 3.6V) Power supply (2.3V ~ 3.6V) GPIO19, VSPIQ, U0CTS, EMAC_TXD0 Not Connected GPIO3, U0RXD, CLK_OUT2 GPIO1, U0TXD, CLK_OUT3, EMAC_RXD2 Not connected Power supply (2.3V ~ 3.6V) Ground No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 2.3 Strapping Pins ESP32 has five strapping pins, which can be seen in Section 5 Schematics:

MTDI GPIO0 GPIO2 MTDO GPIO5 Software can read the value of these five bits from the register GPIO_STRAPPING. During the chip power-on reset, the latches of the strapping pins sample the voltage level as strapping bits of 0 or 1, and hold these bits until the chip is powered down or shut down. The strapping bits configure the device boot mode, the operating voltage of VDD_SDIO and other system initial settings. Page 5 www.Syrp.co.nz Each strapping pin is connected with its internal pull-up/pull-down during the chip reset. Consequently, if a strapping pin is unconnected or the connected external circuit is high-impendence, the internal weak pull-up/pull-down will determine the default input level of the strapping pins. To change the strapping bit values, users can apply the external pull-down/pull-up resistances, or apply the host MCUs GPIOs to control the voltage level of these pins when powering on ESP32. After reset, the strapping pins work as the normal functions pins. Refer to Table 3 for detailed boot modes configuration by strapping pins. Table 3: Strapping Pins Page 6 www.Syrp.co.nz 3 functionalDescription This chapter describes the modules integrated in ESP32-0037-7002, and their functions. 3.1 CPU and Internal Memory ESP32 contains two low-power Xtensa 32-bit LX6 microprocessors. The internal memory includes:

448 KB of ROM for booting and core functions. 520 KB (8 KB RTC FAST Memory included) of on-chip SRAM for data and instruction. 8 KB of SRAM in RTC, which is called RTC FAST Memory and can be used for data storage; it is accessed by the main CPU during RTC Boot from the Deep-sleep mode. 8 KB of SRAM in RTC, which is called RTC SLOW Memory and can be accessed by the co-

processor during the Deep-sleep mode. 1 kbit of eFuse, of which 256 bits are used for the system (MAC address and chip configuration) and the remaining 768 bits are reserved for customer applications, including Flash-Encryption and Chip-ID. 3.2 External Flash and SRAM The ESP32-PICO-D4 module integrates 4 MB of external SPI flash. The 4-MB SPI flash can be memory-mapped onto the CPU code space, supporting 8, 16 and 32-bit access. Code execution is supported. 3.3 Crystal Oscillators ESP32-PICO-D4 integrates a 40 MHz crystal oscillator. 3.4 RTC and Low-Power Management With the use of advanced power-management technologies, ESP32 can switch between different power modes (see Table 5). Power modes Active mode: The chip radio is powered on. The chip can receive, transmit, or listen. Modem-sleep mode: The CPU is operational and the clock is configurable. The Wi-

Fi/Bluetooth baseband and radio are disabled. Light-sleep mode: The CPU is paused. The RTC memory and RTC peripherals, as well as the ULPcoprocessor are running. Any wake-up events (MAC, host, RTC timer, or external interrupts) will wake up the chip. Deep-sleep mode: Only RTC memory and RTC peripherals are powered on. Wi-Fi and Bluetooth connection data are stored in RTC memory. The ULP-coprocessor can work. Hibernation mode: The internal 8-MHz oscillator and ULP-coprocessor are disabled. The RTC recovery memory is powered down. Only one RTC timer on the slow clock and some RTC GPIOs are active. The RTC timer or the RTC GPIOs can wake up the chip from the Hibernation mode. Sleep Patterns Association sleep pattern: The power mode switches between the Active mode, Modem-

and Lightsleep mode, during this sleep pattern. The CPU, Wi-Fi, Bluetooth, and radio are woken up at predetermined intervals to keep Wi-Fi/BT connections alive. ULP sensor-monitored pattern: The main CPU is in the Deep-sleep mode. The ULP-

coprocessor takes sensor measurements and wakes up the main system, based on the data collected from sensors. Page 7 www.Syrp.co.nz The power consumption varies with different power modes/sleep patterns and work statuses of functional modules.Please see Table 6 for details. Page 8 www.Syrp.co.nz 4. Peripherals and Sensors 4.1 Peripherals and Sensors Description Table 7: Peripherals and Sensors Description Page 9 www.Syrp.co.nz Page 10 www.Syrp.co.nz Page 11 www.Syrp.co.nz Page 12 www.Syrp.co.nz Page 13 www.Syrp.co.nz 5. Electrical Characteristics Note: The specifications in this chapter have been tested under the following general condition: VDD = 3.3V, TA =

27C, unless otherwise specified. 5.1 Absolute Maximum Ratings Table 8: Absolute Maximum Ratings 5.2 Wi-Fi Radio Table 9: Wi-Fi Radio Characteristics Page 14 www.Syrp.co.nz 5.3 BLE Radio 5.3.1 Receiver Table 10: Receiver Characteristics BLE 5.3.2 Transmitter Table 11: Transmitter Characteristics BLE Page 15 www.Syrp.co.nz 5.4 Reflow Profile Page 16 6. ESP32-PICO-D4 Schematics www.Syrp.co.nz Figure 3: ESP32-PICO-D4 Schematics Page 17 7. ESP32-0031-7002 Schematics www.Syrp.co.nz Figure 4: ESP32-0031-7002 Schematics Page 18 8. Peripheral Schematics www.Syrp.co.nz Figure 4: ESP32-0031-7002 Peripheral Schematics Page 19 www.Syrp.co.nz 9 Learning Resources 9.1 Must-Read Documents The following link provides related documents of ESP32. ESP32 Datasheet This document provides introduction to the specifications of the ESP32 hardware, including overview, pin definitions, functional description, peripheral interface, electrical characteristics, etc. ESP32-PICO-D4 Datasheet ESP32 Technical Reference Manual The manual provides detailed information on how to use the ESP32 memory and peripherals. ESP32 Hardware Resources The zip files include the schematics, PCB layout, Gerber and BOM list of ESP32 modules and development boards. ESP32 Hardware Design Guidelines The guidelines outline recommended design practices when developing standalone or add-on systems based on the ESP32 series of products, including ESP32, the ESP-WROOM-32 module, and ESP32-

DevKitCthe development board. ESP32 AT Instruction Set and Examples This document introduces the ESP32 AT commands, explains how to use them and provides examples of several common AT commands. 9.2 Must-Have Resources Here are the ESP32-related must-have resources. ESP32 BBS This is an Engineer-to-Engineer (E2E) Community for ESP32 where you can post questions, share knowledge, explore ideas, and help solve problems with fellow engineers. ESP32 Github ESP32 development projects are freely distributed under Espressifs MIT license on Github. It is established to help developers get started with ESP32 and foster innovation and the growth of general knowledge about the hardware and software surrounding ESP32 devices. ESP32 Tools This is a web-page where users can download ESP32 Flash Download Tools and the zip file ESP32 Certification and Test. ESP32 IDF This web-page links users to the official IoT development framework for ESP32. ESP32 Resources This webpage provides the links to all the available ESP32 documents, SDK and tools. Page 20 FCC Statement This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Any Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. The modular can be installed or integrated in mobile or fix devices only. This modular cannot be installed in any portable device. FCC Radiation Exposure Statement This modular complies with FCC RF radiation exposure limits set forth for an uncontrolled environment. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. This modular must be installed and operated with a minimum distance of 20 cm between the radiator and user body. If the FCC identification number is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. This exterior label can use wording such as the following:

Contains Transmitter Module FCC ID: 2APDW0037 Or ContainsFCC ID: 2APDW0037 When the module is installed inside another device, the user manual of the host must contain below warning statements;

1. This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:

(1) This device may not cause harmful interference.

(2) This device must accept any interference received, including interference that may cause undesired operation. 2. Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. The devices must be installed and used in strict accordance with the manufacturer's instructions as described in the user documentation that comes with the product. Any company of the host device which install this modular with Single modular approval should perform the test of radiated emissionand spurious emission according to FCC part 15C : 15.247 requirement,Only if the test result comply with FCC part 15C : 15.247 requirementthen the host can be sold legally. IC statement This device complies with Industry Canadas licence-exempt RSSs. Operation is subject to the following two conditions:

(1) This device may not cause interference; and

(2) This device must accept any interference, including interference that may cause undesired operation of the device. Cet appareil est conforme aux CNR exemptes de licence d'Industrie Canada . Son fonctionnement est soumis aux deux conditions suivantes :

( 1 ) Ce dispositif ne peut causer d'interfrences ; etc

( 2 ) Ce dispositif doit accepter toute interfrence , y compris les interfrences qui peuvent causer un mauvais fonctionnement de l'appareil. A separation distance of at least 20 cm is maintained between the transmitter's radiating structure(s) and the body of the user or nearby persons. Une distance de sparation d'au moins 20 cm est maintenue entre l'metteur rayonnant structure (s) et le corps de l'utilisateur ou des personnes proximit. For a host manufacture's using a certified modular, if (1) the module's IC number is not visible when installed in the host, or (2) if the host is marketed so that end users do not have straightforward commonly used methods for access to remove the module so that the IC number of the module is visible; then an additional permanent label referring to the enclosed module:

"Contains Transmitter Module IC: " 23768-0037" or "Contains IC: 23768-0037" must be used.

		frequency	equipment class	purpose
1	2018-05-22	2412 ~ 2462	DTS - Digital Transmission System	Original Equipment

Application Forms

app s	Applicant Information
1	Effective	2018-05-22
1	Applicant's complete, legal business name	Syrp Limited
1	FCC Registration Number (FRN)	0027397959
1	Physical Address	32 Crummer Road,Ponsonby,Auckland,New Zealand 1021
1		Auckland, N/A
1		New Zealand

app s	TCB Information
1	TCB Application Email Address	j******@metlabs.com
1	TCB Scope	A4: UNII devices & low power transmitters using spread spectrum techniques

app s	FCC ID
1	Grantee Code	2APDW
1	Equipment Product Code	0037

app s	Person at the applicant's address to receive grant or for contact
1	Name	C****** T****
1	Telephone Number	+64 9********
1	Fax Number	+64 9********
1	E-mail	C******@syrp.co.nz

app s	Technical Contact
1	Firm Name	Shenzhen STS Test Services Co., Ltd.
1	Name	B****** Y****
1	Physical Address	1/F., Building B, Zhuoke Science Park, No.190
1		Shenzhen, Guangdong
1		China
1	Telephone Number	86-07********
1	Fax Number	86-07********
1	E-mail	b******@stsapp.com

app s	Non Technical Contact
		n/a

app s	Confidentiality (long or short term)
1	Does this application include a request for confidentiality for any portion(s) of the data contained in this application pursuant to 47 CFR § 0.459 of the Commission Rules?:	Yes
1	Long-Term Confidentiality Does this application include a request for confidentiality for any portion(s) of the data contained in this application pursuant to 47 CFR § 0.459 of the Commission Rules?:	No
	if no date is supplied, the release date will be set to 45 calendar days past the date of grant.

app s	Cognitive Radio & Software Defined Radio, Class, etc
1	Is this application for software defined/cognitive radio authorization?	No
1	Equipment Class	DTS - Digital Transmission System
1	Description of product as it is marketed: (NOTE: This text will appear below the equipment class on the grant)	ESP Module
1	Related OET KnowledgeDataBase Inquiry: Is there a KDB inquiry associated with this application?	No
1	Modular Equipment Type	Single Modular Approval
1	Purpose / Application is for	Original Equipment
1	Composite Equipment: Is the equipment in this application a composite device subject to an additional equipment authorization?	No
1	Related Equipment: Is the equipment in this application part of a system that operates with, or is marketed with, another device that requires an equipment authorization?	No
1	Grant Comments	Single modular approval. Output Power listed is conducted aggregated. The antenna(s) used for this transmitter must be installed to provide a separation distance of at least 20 cm from all persons and not be co-located with any other transmitters except in accordance with multi-transmitter product procedures. This device supports 20MHz and 40MHz bandwidth.
1	Is there an equipment authorization waiver associated with this application?	No
1	If there is an equipment authorization waiver associated with this application, has the associated waiver been approved and all information uploaded?	No

app s	Test Firm Name and Contact Information
1	Firm Name	Shenzhen STS Test Services Co., Ltd.
1	Name	B**** Y******
1	Telephone Number	+86 7********
1	E-mail	B******@stsapp.com

Equipment Specifications
	Line	Rule Parts	Grant Notes	Lower Frequency	Upper Frequency	Power Output	Tolerance	Emission Designator	Microprocessor Number
1	1	15C		2412	2462	0.0152
1	2	15C		2402	2480	0.000164

some individual PII (Personally Identifiable Information) available on the public forms may be redacted, original source may include additional details

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