Taisync WLN210-BM 1 Contents 1. Package Contents............................................................................. 3 2. Hardware Description.......................................................................4 2.1. System block diagram............................................................4 2.2. Connecter............................................................................... 5 2.3. Debug.....................................................................................6 Interface board....................................................................... 7 2.4. 3. Other structure..................................................................................9 3.1. ETH module (WLN210-BM-a)............................................. 9 3.2. HDMI-in module (WLN210-BM-b)...................................10 3.3. HDMI -out module(WLN210-BM-c/ WLN210-BM-d)......11 4. Unit combination............................................................................12 4.1. Air unit.................................................................................12 4.2. Ground unit.......................................................................... 13 4.3. System setup........................................................................ 13 5. Software Program...........................................................................13 5.1. Transmission board..............................................................13 Interface board..................................................................... 13 5.2. 2 1. Package Contents Model:WLN210-BM 40-pin connector Fan interface Debug Serial port RF PORT RF PORT Antenna WLN210-BM-c
(2dbi)
(5dbi) Note: We provide different shielding structures according to different environment, so the WLN210-BM series contains three different types of structures currently. We number it WLN210-BM-a/b/c/d, there are supplementary pictures in the back. 3 2. Hardware Description Taisync RF Transmission board is FPGA based Architecture. The system is able to integrate the like orthogonal frequency division multiplex latest advanced communication technologies,
(OFDM) modulation, Multiple Input Multiple Output (MIMO), low density parity check
(LDPC)code, etc. and has the ability to keep evolving to accommodate future applications. 2.1.System block diagram Parameters Radio Frequency Bandwidth Specifications 2.4GHz 10Mhz, 2.5MHz Max. Transmission Power 28dbm(FCC), 20dbm(CE) LOS Range Modulation FEC Duplex
>12km(28dbm) OFDM LDPC TDD 4 Data Input RF interface Dimensions (mm) Power Input Max. Power Consumption Ethernet MII (or 100Base-TX) MMCX 75mmX45mm 5.0V/1.5A 5.5W 2.2.Connecter Pin definition on 40-Pin connector Part number: DF12B-40Ds-0p5V_86, Manufacture: HRS Description FPGA_DONE MCU_UART2_RX FPGA_GPIO1 MCU_UART2_TX MII_RXC MII_TXC (ETH_TDP) MII_RXD0 MII_TXEN (ETH_TDN) MII_RXD1 Level Pin Net LVCMOS(3.3V) 1 LVCMOS(3.3V) UART2 2 LVCMOS(3.3V) GPIO 3 LVCMOS(3.3V) UART2 4 LVCMOS(3.3V) 5 LVCMOS(3.3V) 6 LVCMOS(3.3V) 7 LVCMOS(3.3V) 8 LVCMOS(3.3V) 9 LVCMOS(3.3V) 10 MII_TXD0 (ETH_RDP) LVCMOS(3.3V) 11 MII_RXD2 LVCMOS(3.3V) 12 MII_TXD1 (ETH_RDN) 13 MII_RXD3 LVCMOS(3.3V) 14 MII_TXD2 (ETH_ACTLED) LVCMOS(3.3V) FPGA_MII
(or 100BASE-TX) 15 MII_RXDV 16 MII_TXD3(ETH_LNKLED) LVCMOS(3.3V) LVCMOS(3.3V) 5 SBUS_PPM CAN_TX FPGA_GPIO2 CAN_RX FPGA_GPIO3 FPGA_SPI_SCK FPGA_GPIO4 FPGA_SPI_MOSI FPGA_PROG FPGA_SPI_CS 17 18 19 20 21 22 23 24 25 26 27 MCU_RST 28 29 30 31 32 33 34 35 36 37 38 39 40 FPGA_SPI_MISO FPGA_GPIO5 GND GND GND GND VCC_IN5V VCC_IN5V VCC_IN5V GND VCC_IN5V GND VCC_IN5V SPI SPI SPI LVCMOS(3.3V) Remote signal LVCMOS(3.3V) CAN LVCMOS(3.3V) GPIO LVCMOS(3.3V) CAN LVCMOS(3.3V) GPIO LVCMOS(3.3V) LVCMOS(3.3V) GPIO LVCMOS(3.3V) LVCMOS(3.3V) LVCMOS(3.3V) LVCMOS(3.3V) MCU_RST LVCMOS(3.3V) LVCMOS GROUND GROUND GROUND GROUND POWER@0.3A POWER@0.3A POWER@0.3A GROUND POWER@0.3A GROUND POWER@0.3A SPI GPIO POWER 2.3.Debug This is a 12PIN side mount, mainly used for debugging MCU and FPGA, and provides a debugging serial port. Type: SH-1X12P_1P0MM. 6 Pin Signal name Signal description 1 2 3 4 5 6 7 8 9 10 11 12 MCU1_JTMS-SWDIO MCU1_JTCK-SWCLK NRST#
GND 3.3V JTAG_TCK JTAG_TMS JTAG_TDO JTAG_TDI MCU_DEBUG MCU_RST Ground Power source FPGA_JTAG MCU1_USART1_RX MCU1_USART1_TX debugging serial port GND Ground Level attributes -
Remarks LVCMOS(3.3V) LVCMOS(3.3V) LVCMOS(3.3V) POWER POWER LVCMOS(3.3V) LVCMOS(3.3V) LVCMOS(3.3V) LVCMOS(3.3V) LVCMOS(3.3V) LVCMOS(3.3V) POWER 2.4.Interface board We also provide a test broad that can be used with this wireless module(WLN210-BM). There are MB_LAN board, MB_HDMI&USB-OUT board, MB_HDMI-IN board,which can support different external communication interfaces. Micro USBupgradeport Transmission boards with any interface board provide a microUSB interface. Lan port This interface will only be provided with the LAN board. UART port Transmission boards with any interface board provide a UART interface. HDMI port(in & out) 7 MB_HDMI&USB-OUT Supports a HDMI video onput interface. MB_HDMI-IN Supports a HDMI video input interface. PPM/S.bus port(in & out) Interface definition and line order: G V+ G L H(PPM/SBUS, GND, POWER(3.3V), GND, CAN_L, CAN_H). Can bus is not supported now. USB port This port supports connecting mobile phone to output video. Power port Power supply port for the whole module. 8 3. Other structure 3.1.ETH module (WLN210-BM-a) 9 3.2.HDMI-in module (WLN210-BM-b) 10 3.3.HDMI -out module(WLN210-BM-c/ WLN210-BM-d) WLN210-BM-c 11 WLN210-BM-d 4. Unit combination 4.1.Air unit Air unit(video input with HDMI port): transmission board, MB_HDMI-IN board. Air unit(video input with LAN port): transmission board, MB_LAN board. 12 4.2.Ground unit Ground unit(video output with HDMI&USB port): transmission board, MB_HDMI&USB-OUT board. Ground unit(video output with LAN port): transmission board, MB_LAN board. 4.3.System setup Any combination of the air unit and the ground unit can setup communication. Choose different combinations according to different application scenarios. 5. Software Program 5.1.Transmission board Tranmission board needs to program baseband and MCU1 firmware. Tranmission board can be programed for air unit or ground unit. 5.2.Interface board MB_LAN board can be programed for air unit or ground unit. MB_HDMI-IN board can only be programed for air unit. MB_HDMI&USB-OUT board can only be programed for ground unit. Federal Communications Commission (FCC) Interference Statement This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. 13 These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generate, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one of the following measures:
Reorient or relocate the receiving antenna. Increase the separation between the equipment and receiver. Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. Consult the dealer or an experienced radio/TV technician for help. with This the
(1) must cause complies device two following device This accept any undesired conditions:
not interference operation. may Part 15 of the FCC Rules. Operation is subject to harmful cause received, interference, and interference including
(2) that may this device FCC party this Caution:
Any responsible equipment. changes for compliance modifications void could or not the expressly users authority to approved by the operate exposure equipment RF This uncontrolled accordance transmitter all cm with other warning complies environment. provided with must be persons with This instructions to installed provide must and be not transmitter. antenna or FCC equipment and a from any radiation exposure be must the separation antenna(s) for limits installed forth an set operated in and for used of distance 20 at conjunction in operating this least collocated or 14
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(cid:0) OEM Integration Instructions This device is intended only for OEM integrators under the following conditions The module can be used to installation in other host. The antenna must be installed such that 20 cm is maintained between the antenna and users, and the transmitter module may not be co-
located with any other transmit or antenna. The module shall be only used with the integral antenna(s) that has been originally tested and certified with this module. As long as 3 conditions above are met, further transmitter test will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirement with this module installed (for example, digital device emission, PC peripheral requirements, etc.) IMPORTANT NOTE In the event that these conditions cannot be met (for example certain laptop configuration or co-
location with another transmitter), then the FCC authorization for this module in combination with the host equipment is no longer considered valid and the FCC ID of the module cannot be used on the final product. In these and circumstance, the OEM integrator will be responsible for re-evaluating. The end product (including the transmitter) and obtaining a separate FCC authorization. The final end product must be labeled in a visible area with the following:
Contains Transmitter Module FCC ID: 2AQVB-T19V0628 or Contains FCC ID: 2AQVB-T19V0628. Antenna Specification:
Antenna Name RP-SMA Antenna (Ant 1) Frequency Band
(GHz) 2.4 ~ 2.5 TX Paths Max Peak Gain
(dBi) 1 5.0 PCB Antenna (Ant 2) Note: The device can only use the Ant 1 When it is working at 2.5MHz Bandwidth. 2.4 ~ 2.5 1 2.0 15