FCC ID: 2AGPMHJ-131IMH Bluetooth 5.1 ultra-low power module

HJ-131IMH HJ-131IMH Ultra-small chip level (4mm * 4mm, include ANT) ,ultra low power Bluetooth 5.1 module DataSheet DataSheet version: V2.0 TangShanHongJia Electronic Technology Co., Ltd. http://www.tshjdz.com HJ-131IMH CATALOG 1Version History .............................................................................................................................................. - 1 -

2Overview ........................................................................................................................................................ - 2 -

2.1 Characteristics ........................................................................................................................................... - 2 -

3Hardware specification .................................................................................................................................. - 4 -

3.1Package and dimensions ............................................................................................................................ - 4 -

3.2Pin Definition .............................................................................................................................................. - 5 -

3.3Internal Structure ....................................................................................................................................... - 7 -

3.4Reference Design ........................................................................................................................................ - 7 -

3.4.1Low Voltage Mode (Can be powered byonesingle AA size battery, voltage range: 1.05-1.7V) .......... - 7 -

3.4.2HighVoltage Mode (Voltage range: 1.8-3.6V) ..................................................................................... - 8 -

3.4.3 Using the built-in antenna of the module .......................................................................................... - 8 -

3.4.4Notice for Hardware Design ................................................................................................................ - 9 -

3.4.5Matters needing attention in the use of products .............................................................................. - 9 -

4Electrical Parameters ................................................................................................................................... - 10 -

4.1Absolute Maximum Range ....................................................................................................................... - 10 -

4.2Recommended Operating Conditions ...................................................................................................... - 10 -

4.3I/O DC Characteristics ............................................................................................................................... - 10 -

4.4RF Features ............................................................................................................................................... - 11 -

4.5Power Dissipation ..................................................................................................................................... - 11 -

5Reflow Soldering Information ..................................................................................................................... - 12 -

6Notices for Ultrasound Welding .................................................................................................................. - 13 -

7Supply Information ...................................................................................................................................... - 14 -

7.1Model Definition....................................................................................................................................... - 14 -

7.2 Development Kit Board ........................................................................................................................... - 15 -

7.3Packaging method .................................................................................................................................... - 15 -

8 FCC Warning ................................................................................................................................................... - 16 -

TangShanHongJia Electronic Technology Co., Ltd. http://www.tshjdz.com HJ-131IMH 1Version History No. Version Number Release Time Table 1-1 Revision History Reviser Checker Description 1 2 3 4 V1.2 V1.31 V1.5 V1.7 20191109 20200101 20200206 20200512 LMY LMY LMY LMY LJH ZYP LJH ZYP First edition UpadateParemeters Redefine pin functions Add Development Kit board TangShanHongJia Electronic Technology Co., Ltd. http://www.tshjdz.com

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HJ-131IMH 2Overview 2.1 Characteristics Memories

- 32KB of OTP

- 48KB of RAM

- 4KB of EEPROM Functions Supply voltage range: High Voltage Mode 1.8V~3.6V;Low Voltage Mode 1.05V~1.7V It can be powered by asingle AA size battery or a zinc air battery at 1.5V. After voltage regulation,it can also be powered by 2 pcs AA size batteries or lithium cells. GPIO max: 6 4mm * 4mm volume includes built-in high-performance antenna(External antenna can also be used)

- External 512Kb EEPROM or 1Mb EEPROM can be used to store user programs and OTA

- Support BLE 5.1, embedded low energyBluetooth protocol stack and GATT service

- Support BLE master-slave integration (Support 1 slave 1 master or 3 slaves, master and slave work at the same time without affecting each other)

- Built-in standard firmware supports 1 slave, supports multiple instructions to configure BLE module(Refer to "HJ-131IMH Built-in Firmware Software Function Document")

- Built-in standard firmware supports transparent transmission,support WeChat, or no program module for customers to develop firmware by themselves RF Features

- Operating Frequency:2.4GHz, Support ISM free Frequency band

- Transmitting Power: -19.5dBm ~ +2.5dBm

-Receiver sensitivity: -94dBm

- TX peak current < 3.5mA ; RX peak current < 2.2mA

- When using the On-board antenna in an open area, the transmission distance of wireless signal can spread more than 5metres and less than 10metres.

-When using an external antenna in an open area, the transmission distance of wireless signal can TangShanHongJia Electronic Technology Co., Ltd. http://www.tshjdz.com

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HJ-131IMH spread more than 40 metres and less than 80 metres. Low Power Dissipation

- Sleep current <2A

- One second broadcast current: 7A(0dBm)

- Two second broadcast current: 3.8A(0dBm)

-20ms connection gap current 65uA (0dBm)

-1000ms connection gap current 6.8uA(0dBm) Applications

-Tiny medical applications

-Beacons

-Smart toys

-Smar locks

-Remote controls

-Industrial smart devices Package: LGA17, pad spacing: 0.8mm, pad size:0.5*0.5mm Size: 4mm*4mm*1.3mm(Built-in antenna inside) Weight: 0.5g Operating temperature range:-40 ~ +85(Maximum temperate up to +120) BQB FCC CE KC SRRC REACH RoHS compliant TangShanHongJia Electronic Technology Co., Ltd. http://www.tshjdz.com

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3Hardware specification 3.1Package and dimensions shown in the figure 3-1, 3-2, 3-3, 3-4. The package of HJ-131IMH is LGA17, welding pad spacing is 0.8 mm. Detailed dimensions are HJ-131IMH Figure 3-1 Top view Figure3-2Side view Figure3-3Bottom view TangShanHongJia Electronic Technology Co., Ltd. http://www.tshjdz.com

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HJ-131IMH Figure3-4 Dimensions picture 3.2Pin Definition TangShanHongJia Electronic Technology Co., Ltd. http://www.tshjdz.com

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HJ-131IMH 1 2 3 4 5 6 7 8 9 Table3-1Pin definition table Pin Name Type Description VCC_LOW VCC_HIG H V_HJ Low Power In High Power In Low voltage power inputport High voltage powerinputport

(customized / transparenttransmission) function LowVoltage Mode input : 1.1-1.65V High Voltage Mode input : 1.8-3.6V Internal EEPROM power supply pin Power supply range 1.7-3.6V, please connect with VCC_HIGH if needed Internal EEPROM SDA pin If needed, please connect with P03 General purposedGPIO If you need to use internal EEPROM, please connect with HJD If needed, please connect with P04 HongJia Reserve HongJia Reserve IO HongJia Reserve IO HJD P03 HJC P04 Internal EEPROM SCL pin General purposedGPIO General purposedGPIO P05/W UART TX BLE serial prots TX pin P02/C WAKEUP/U ART RX Wake-up Pin / UART Pin If you need to use internal EEPROM, please connect with HJC Wake-up function and BLE serial RX

(Under low power consumption, the pin defaults to the wake-up pin. If the external high level is increased for more than 1ms, BLE can be woken up. After waking up, this pin becomes the UART RX function, which can perform normal data transmission and reception;) High-level reset; floating or low-level normal operation 10 P00/R I/RST Reset Pin 11 P01 O Connection status (connection = 1; disconnect = 0) Connection Status Pin 12 ANT_OUT RF OUT RF Output RF output, can be used with external antenna 13 BOARD_A NT Onboard ANT Onboard antenna input port Internal integrated matching circuit. If an internal antenna is used, short circuit the 12 and 13 pins directly. 14 GND Ground Power Input GND Power Negative GND TangShanHongJia Electronic Technology Co., Ltd. http://www.tshjdz.com

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3.3Internal Structure HJ-131IMH Figure3-5 HJ-131IMH internal structure frame 3.4Reference Design range: 1.05-1.7V) 3.4.1Low Voltage Mode (Can be powered byonesingle AA size battery, voltage Figure 3-6 Low Voltage Supply Mode TangShanHongJia Electronic Technology Co., Ltd. http://www.tshjdz.com

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3.4.2HighVoltage Mode (Voltage range: 1.8-3.6V) HJ-131IMH Figure 3-7HighVoltage Supply Mode 3.4.3 Using the built-in antenna of the module TangShanHongJia Electronic Technology Co., Ltd. http://www.tshjdz.com

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HJ-131IMH 3.4.4Notice for Hardware Design A. All I/Os can be used. B. PI filter is added to the power input. L? Can choose resistance or inductance. If the space is limited, it can also be omitted, and a 475-106 ceramic capacitor in 0603 package or 0402 package can be directly connected in parallel.C. The TP? is the test points, if necessary, add it. C. When using an external antenna, be sure to contact us to let us confirm whether your external PCB antenna or IPEX lead-out antenna PCB design is reasonable. 3.4.5Matters needing attention in the use of products A. The module should not be placed in a metal-based enclosure. If a metal enclosure is required, the antenna must be lead out. B. Among the products that need to install this wireless module, some metal materials such as screws, inductors, etc. should be kept away from the RF antenna part of the wireless module. C. On the wireless module antenna, Do not place other components. Because other components can degrade wireless performance. D. Place the wireless module on the peripheral edge of the motherboard as much as possible.The antenna part should be close to the side or corner of the motherboard. The motherboard PCB under the module antenna should be hollowed out with the keepout layer.If hollowing is prohibited, copper or wiring is not allowed under the antenna. Otherwise it will affect RF performance. E. Please pay attention to the pin diagram for all pins. Please pay attention to the IO mode and status of the IO connected to it. F. GND must be sound grounding. supply. G. It is recommended that magnetic beads or inductance filters be applied to the input power TangShanHongJia Electronic Technology Co., Ltd. http://www.tshjdz.com

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HJ-131IMH 4Electrical Parameters 4.1Absolute Maximum Range Table 4-1 Absolute maximum ratings Parameter Power Supply Voltage (VCC) IO Supply Voltage Operating Temperature Storage Temperature MIN 1.05 0

-45

-55 MAX 3.7 VCC

+120

+135 Unit V V 4.2Recommended Operating Conditions 4.3I/O DC Characteristics Parameter Power Supply Voltage (VCC) Table 4-2 Recommended operating conditions MIN 1.8(1.05

) TYP 3.3(1.5) MAX 3.6(1.8) V Unit IO Supply Voltage Dormant working current Maximum Operating Current Operating Temperature 0

-40 3.3(1.8) VCC

<2 5

+25

+85 V A mA Table 4-3 I/O DC Characteristics Driving Capability MIN 0 I/O Pin Input low voltage Input high voltage Output low voltage Output high voltage 5mA 5mA MAX 0.4 VCC 0.6 VCC Unit V V V V 0.7 0 3.3 TangShanHongJia Electronic Technology Co., Ltd. http://www.tshjdz.com

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HJ-131IMH 4.4RF Features Attribute Modulation Frequency range Number of channels Air speed RF Port Impedance Transmit Power TX Current consumption RX Current consumption Receive sensitivity Antenna 4.5Power Dissipation Table 4-4 RF Features Value Remarks 2.402 ~ 2.480Ghz Bandwidth: 2Mhz GFSK 40 1Mbps 50 MAX: +2.5dbm TYP: 3.5mA TYP: 2.2mA TYP: -94dbm, MAX: -95dbm Onboard PCB Antenna External antenna can be used Table 4-5 Power Dissipation Test conditions Dormancy mode 20ms Interval Broadcasting in Slave Mode 1S Interval Broadcasting in Slave Mode 20ms Connection Gap Holding Connection in Slave Mode 7.5ms Connection Gap Holding Connection in Slave Mode 110 Scanning in Host Mode 20ms Connection Gap Holding Connection in Host Mode TYP Unit

<2 180 7.0 65 2.3 78 A A A A A mA A TangShanHongJia Electronic Technology Co., Ltd. http://www.tshjdz.com

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5Reflow Soldering Information HJ-131IMH Reflow soldering is recommended for welding. HJ-131IMHmodule use high temperature resistant materials, manufacturing by Lead-free Process. The maximum temperature resistance is 265. Ten continuous reflow soldering has no effect on properties and strength. Specific parameters as shown in Table 5-1. Table 5-1 Reflow soldering parameters Parameter Value Features Average ramp up rate(TSMAX to Tp) Temperature Min(TSmin) Temperature Max(TSmax) Preheat time (Min to Max) (tS) Peak Temperature (TP) Ramp-down Rate Time 25 to Peak Temp (TP) Lead-free process 3/sec. max 150 200 80~100sec. 2505 6/sec. max 8 min. max Figure5-1 Temperature Curve of Reflow Welding TangShanHongJia Electronic Technology Co., Ltd. http://www.tshjdz.com

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HJ-131IMH 6Notices for Ultrasound Welding Warning:Please carefully consider using ultrasonic welding technology. If it is necessary to use ultrasonic welding technology, please use 40KHz high frequency ultrasound welding technology. Keep the module away from the ultrasonic soldering line and the fixing column during the design method to prevent damage to the module!

For specific ultrasonic welding matters, please contact our company for technical consultation. TangShanHongJia Electronic Technology Co., Ltd. http://www.tshjdz.com

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HJ-131IMH 7Supply Information 7.1Model Definition Table 7-1 Model Definition Type Standard Edition of uarttransparent transmission Model HJ-131IMH_SPPv2 Description Include UART port transparent transmission firmware, the firmware module is a bridge between the Bluetooth device or the mobile phone and the MCU. The Customer does not need to understand the BLE protocol stack, and control the UART port command operation and the UART port data, and the operation is simple,short Development cycle to speed up product launch. This version supports custom firmware, the customer proposes functions according to the product requirements, and we will customize the module with the special version firmware to supply the customer. This version of the module has no built-in firmware, customer can develop their own firmware according to the Dialog official chip datasheet and support documents, and only need to provide firmware for us to burn. Custom version HJ-131IMH_CUSv2 Customer development Version HJ-131IMH_EMP TangShanHongJia Electronic Technology Co., Ltd. http://www.tshjdz.com

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HJ-131IMH 7.2 Development Kit Board We have specially prepared an Kit board for developers. The Kit board leads all GPIOs, and onboard USB TO TTL is convenient for debugging and testing with the computer. At the same time we also provide test documents, please contact our sales for details. 7.3Packaging method Packaging with tapes and reel. Sealed with chip-level anti-static aluminum foil bag, each bag contains desiccant, use industrial grade vacuum machine to ensure airtight, moisture-proof, waterproof and dustproof (IP65).The actual packing effect is shown in Figure 7-1. TangShanHongJia Electronic Technology Co., Ltd. http://www.tshjdz.com

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HJ-131IMH Figure 7-1 External Packing Image All packages will be labeled with goods information.All packages will be marked with the cargo information, including ROHS and anti-static signs. The production batch information in the item number is 15 bits. TangShanHongJia Electronic Technology Co., Ltd. HJ-131IMH_SPPv2 Pb Free Reflow(260) DATE CODE:P16aI15bS17c001 QTY:500PCS SEAL DATE:20170504 Remarks: P16a I15b S17c001 represents PCB production in January 2016, IC production in February 2015, and SMT patch in the first time in March 2017. Figure7-2 Label Sample Diagram Integration instructions for host product manufacturers according to KDB 996369 D03 OEM Manual v01 8 FCC Warning 2.2 List of applicable FCC rules FCC Part 15.247 2.3 Specific operational use conditions TangShanHongJia Electronic Technology Co., Ltd. http://www.tshjdz.com

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HJ-131IMH his transmitter/module and its antenna(s) must not be co-located or operating in conjunction with any transmitter. This information also extends to the host manufacturers instruction manual. 2.4 Limited module procedures not applicable 2.5 Trace antenna designs It is not applicable as trace antenna which is not used on the module. 2.6 RF exposure considerations This equipment complies with FCC RF radiation exposure limits set forth for an uncontrolled environment. This compliance to FCC radiation exposure limits for an uncontrolled environment, and minimum of 20cm separation between antenna and body. The host product manufacturer would provide the above information to end users in their end-product manuals. 2.7 Antennas Chip antenna; 3.5dBi; 2.402 GHz2.480GHz 2.8 Label and compliance information The end product must carry a physical label or shall use e-labeling followed KDB784748D01 and KDB 784748 stating Contains Transmitter Module FCC ID:2AGPMHJ-131IMH. 2.9 Information on test modes and additional testing requirements For more information on testing, please contact the manufacturer. 2.10 Additional testing, Part 15 Subpart B disclaimer The modular transmitter is only FCC authorized for the specific rule parts (FCC Part 15.247) listed on the grant, and that the host product manufacturer is responsible for compliance to any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. The final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed when contains digital circuity. FCC Statements

(OEM) Integrator has to assure compliance of the entire end-product incl. the integrated RF Module. For 15 B (15.107 and if applicable 15.109) compliance, the host manufacturer is required to show compliance with 15 while the module is installed and operating. Furthermore the module should be transmitting and the evaluation should confirm that the module's intentional emissions (15C) are compliant (fundamental / out-of-band). Finally the integrator has to apply the appropriate equipment authorization (e.g. Verification) for the new host device per definition in 15.101. Integrator is reminded to assure that these installation instructions will not be made available to the end-user TangShanHongJia Electronic Technology Co., Ltd. http://www.tshjdz.com

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HJ-131IMH of the final host device. The final host device, into which this RF Module is integrated" has to be labeled with an auxiliary label stating the FCC ID of the RF Module, such as "Contains FCC ID:2AGPMHJ-131IMH

"This device complies with part 15 of the FCC rules. Operation is subject to the following two conditions:

(1)this device may not cause harmful interference, and

(2)this device must accept any interference received, including interference that may cause undesired operation."

"Changes or modifications to this unit not expressly approved by the party responsible for compliance could void the users authority to operate the equipment."

the Integrator will be responsible to satisfy SAR/ RF Exposure requirements, when the module integrated into the host device. Module statement The single-modular transmitter is a self-contained, physically delineated, component for which compliance can be demonstrated independent of the host operating conditions, and which complies with all eight requirements of 15.212(a)(1) as summarized below. 1) The radio elements have the radio frequency circuitry shielded. 2) The module has buffered modulation/data inputs to ensure that the device will complywith Part 15 requirements with any type of input signal. 3) The module contains power supply regulation on the module. 4) The module contains a permanently attached antenna. 5) The module demonstrates compliance in a stand-alone configuration. 6) The module is labeled with its permanently affixed FCC ID label. 7) The module complies with all specific rules applicable to the transmitter, including all the conditions provided in the integration instructions by the grantee. 8) The module complies with RF exposure requirements. NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no TangShanHongJia Electronic Technology Co., Ltd. http://www.tshjdz.com

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HJ-131IMH le CI du module RF, danslequelce module RF estintgr tel que" Contient

"doittretiquet le module metteur guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

- Reorient or relocate the receiving antenna.

- Increase the separation between the equipment and receiver.

-Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.

-Consult the dealer or an experienced radio/TV technician for help IC Statements The final host device, into which this RF Module is integrated" has to be labeled with an auxiliary label stating the IC of the RF Module, such as" Contains transmitter module IC: 26719-HJ131IMH Le final, priphriquehte unetiquetteauxiliaireindiquant 26719-HJ131IMH This device contains licence-exempt transmitter(s)/receiver(s) that comply with Innovation, Science and Economic Development Canadas licence-exempt RSS(s). Operation is subject to the following two conditions:

(1) This device may not cause interference.

(2) This device must accept any interference, including interference that may cause undesired operation of the device. Lmetteur/rcepteur exempt de licencecontenudans le prsentappareilestconforme aux CNR dInnovation, Sciences et Dveloppementconomique Canada applicables aux appareils radio exempts de licence. Lexploitationestautorise aux deux conditions suivantes :

(1) L' appareil ne doit pas produire de brouillage;

(2) L' appareildoit accepter tout brouillageradiolectriquesubi, mmesi le brouillageest susceptible d'

encompromettre le fonctionnement. RF Exposure Warning Statements:

This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment shall be installed and operated with minimum distance 20cm between the radiator & body. avec IC:

TangShanHongJia Electronic Technology Co., Ltd. http://www.tshjdz.com

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HJ-131IMH Radio Frequency Exposure Statement for IC:

The device has been evaluated to meet general RF exposure requirements. The device can be used in mobile exposure conditions. The min separation distance is 20cm. Dclaration d'exposition aux radiofrquences pour IC:

L'appareil a t valu pour rpondre aux exigences gnrales en matire d'exposition aux RF. L'appareil peut tre utilis dans des conditions d'exposition mobiles. La distance de sparation minimale est de 20 cm. TangShanHongJia Electronic Technology Co., Ltd. http://www.tshjdz.com

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FCC ID and IC Label Location 4mm*4mm FCC ID: 2AGPMHJ-131IMH IC: 26719-HJ131IMH HVIN: HJ-131IMH 4mm*4mm FCC ID: 2AGPMHJ-131IMH IC: 26719-HJ131IMH HVIN: HJ-135IMH

352 No. 2 # building power springs in Qianxi County, Tangshan City, Hebei Province, Tangshan HongJia electronic technology co., LTD. China Agent Authorization Company: Tangshan HongJia electronic technology co., LTD. Address: 352 No. 2 # building power springs in Qianxi County, Tangshan City, Hebei Province, China Product Name: Bluetooth 5.1 ultra-low power module Model Number(s): HJ-131IMH, HJ-130IMH, HJ-132IMH, HJ-133IMH, HJ-135IMH Product Description: Bluetooth 5.1 ultra-low power module We authorize MiCOM Labs Inc., 575 Boulder Court, Pleasanton, California 94566, USA, to act on our behalf on all matters concerning the certification of above named equipment. We declare that MiCOM Labs Inc. is allowed to forward all information related to the approval and certification of equipment to the regulatory agencies as required and to discuss any issues concerning the approval application. Any and all acts carried out by MiCOM Labs on our behalf shall have the same effect as acts of our own. Signature:

Name:

Liu Ying Title:

General Manager Date: Nov. 30, 2020 Company: Tangshan HongJia electronic technology co., LTD.

Pe. Neen eee eee a eae ee eee eee eee o- 4 ee - -* a

Tangshan HongJia electronic technology co., LTD. 352 No. 2 # building power springs in Qianxi County, Tangshan City, Hebei Province, China Office of Engineering Technology Federal Communications Commission 7435 Oakland Mills Road Columbia, MD 21046 USA Date: Nov. 30, 2020 Subject; Request for Confidentiality FCC ID: 2AGPMHJ-131IMH To Whom It May Concern, Pursuant to the provisions of the Commission's rules Title 47 Sections 0.457 and 0.459, we are requesting the Commission to withhold the following attachment(s) as confidential documents from public disclosure indefinitely. These documents contain detailed system and equipment descriptions and are considered as proprietary information in operation of the equipment. The public disclosure of these documents might be harmful to our company and would give competitors an unfair advantage in the market.

&] Schematic Diagram

&] Block Diagram

&] Operational Description _) Parts List Tune-up Procedure In additional to above mentioned documents, in order to comply with the marketing regulations in Title 47 CFR 2.803 and the importation rules in Title 47 CFR 2.1204, while ensuring that business sensitive information remains confidential until the actual marketing of newly authorized devices, we request Short Term Confidentiality of the following attachment(s);

&] External Photos

&] Test Setup Photos

&] Internal Photos

&] User Manual

(J For 45 days, pursuant to Public Notice DA 04-1705. OR

(] For 180 days pursuant to KDB 726920 D01. It is our understanding that all measurement test reports, FCC ID label format and correspondence during the certification review process cannot be granted as confidential documents and this information will be available for public review once the grant of equipment authorization is issued. Sincerely, Signature: Lia i h Name: Liu Ying Title: General Manager

Shenzhen Feasycom Technology Co., Ltd. Room 2004A, 20th Floor, Huichao Technology Building, Jinhai Road, Xixiang, Baoan District, Shenzhen 518101, China RE FCC ID: 2AGPMHJ-131IMH To the certification reviewer:

We are hereby applying for [full] modular approval of the above-referenced FCC ID, based on compliance with [all] of the criteria as detailed below. Sincerely,

[Liu Ying]

[General Manager]

Part 15 Unlicensed Single Modular Transmitter Approval Justification per 15.212 reference Shielding is provided by a metal cover over the circuitry. All modulation and data inputs are buffered by circuitry on the transmitter chip. Power supply regulation is provided by circuitry on the transmitter chip. The antenna is fixed. Testing was performed in a stand-alone configuration as shown in the test setup photos. A sample of the host label is provided as an exhibit, showing the FCC identifier of the module.

(i)

(ii) Requirement per 15.212 radio elements of the modular their own RF The transmitter must have shielding. The modular transmitter must have buffered modulation/data inputs (if such inputs are provided.

(iii) The modular transmitter must have its own power supply regulation. transmission

(iv) The modular transmitter must comply with the antenna and system requirements of 15.203, 15.204(b) and 15.204(c). The modular transmitter must be tested in a stand-alone configuration, i.e., the module must not be inside another device during testing for compliance with Part 15 parameters.

(v)

(vi) The modular transmitter must be equipped with either a permanently affixed label or must be capable of electronically displaying its FCC identification number. If the FCC ID is not visible when the module is installed inside another device, then the outside of the device into which the module is label referring to the enclosed module. installed must also display a Shenzhen Feasycom Technology Co., Ltd. Room 2004A, 20th Floor, Huichao Technology Building, Jinhai Road, Xixiang, Baoan District, Shenzhen 518101, China

(vii) The modular transmitter must comply with any specific rules or operating requirements that ordinarily apply to a complete transmitter and the manufacturer must provide adequate instructions along with the module to explain any such requirements. A copy of these instructions must be included in the application for equipment authorization.

(viii) The modular transmitter must comply with any applicable RF exposure requirements in its final configuration. The modular is comply with all applicable FCC rules. Any modifications, not expressly approved by the manufacturer could void the authority to operate in these regions. This module compliance with RF Exposure requirements, please refer to MPE Report.

Tangshan HongJia electronic technology co., LTD. 352 No. 2 # building power springs in Qianxi County, Tangshan City, Hebei Province, China Nov. 30, 2020 Office of Engineering Technology Federal Communications Commission 7435 Oakland Mills Road Columbia, MD 21046 USA Subject: Explanation of differences between product types 135IMH To Whom It May Concern:

FCC ID: 2AGPMHJ-131IMH Models: HJ-131IMH, HJ-130IMH, HJ-132IMH, HJ-133IMH, HJ-

We, The Tangshan HongJia electronic technology co., LTD. hereby declare that the model : HJ-130IMH, HJ-132IMH, HJ-133IMH, HJ-

135IMH is identical with the model : HJ-131IMH, except the model name. Except for the different above, no other modification is performed. Sincerely, Tangshan HongJia electronic technology co., LTD. Signature:

[Liu Ying, General Manager]