User manual AN-16052600-E3 Ver 1.2.0 2016/9/26 Brief This document is the assembly and maintenance guide for Telink Test System 2.1. T E L I N K S E M I C O N D U C T O R Assembly And Maintenance Manual for Telink Test System 2.1 Published by Telink Semiconductor Bldg 3, 1500 Zuchongzhi Rd, Zhangjiang Hi-Tech Park, Shanghai, China Telink Semiconductor All Right Reserved Legal Disclaimer Telink Semiconductor reserves the right to make changes without further notice to any products herein to improve reliability, function or design. Telink Semiconductor disclaims any and all liability for any errors, inaccuracies or incompleteness contained herein or in any other disclosure relating to any product. Telink Semiconductor does not assume any liability arising out of the application or use of any product or circuit described herein; neither does it convey any license under its patent rights, nor the rights of others The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. Customers using or selling Telink Semiconductor products not expressly indicated for use in such applications do so entirely at their own risk and agree to fully indemnify Telink Semiconductor for any damages arising or resulting from such use or sale. Information:
For further information on the technology, product and business term, please contact Telink Semiconductor Company (www.telink-semi.com). For sales or technical support, please send email to the address of:
telinkcnsales@telink-semi.com telinkcnsupport@telink-semi.com AN-16052600-E3 1 Ver 1.2.0 Assembly And Maintenance Manual for Telink Test System 2.1 Revision History Version Major Changes Date Author 1.0.0 Initial release 2016/5 H.Z.F., L.X., Cynthia 1.1.0 2016/8 T.J.B., Cynthia Updated buzzer related contents, including: buzzer module photo, cable connection between buzzer and EVK daughter board, cable connection chart, test system photo, Amic test item, buzzer spec in hardware list, and dimension chart of buzzer board. Updated the spec column in 1.2.0 hardware list. 2016/9 H.Z.F., Cynthia AN-16052600-E3 2 Ver 1.2.0 Assembly And Maintenance Manual for Telink Test System 2.1 Table of contents 1 Overall Architecture Of 1x1 Test System 2.1 .......................................................... 5 2 Hardware Platform Building ................................................................................... 7 2.1 Check External Antenna ................................................................................... 7 2.2 Cable connection ............................................................................................. 8 2.2.1 Connection points on EVK daughter board .............................................. 8 2.2.2 Cable connection between EVK daughter board and PCB antenna ......... 9 2.2.3 Cable connection between EVK daughter board and buzzer ................... 9 2.2.4 Cable connection between EVK daughter board and Mechanical structure ................................................................................................................. 9 2.2.5 Cable connection between EVK daughter board and DUT ..................... 10 2.2.6 Other cable connection .......................................................................... 11 3 Firmware Burning For EVK Daughter Board ......................................................... 12 3.1 Folder structure for Test Bench Firmware ..................................................... 12 3.2 Firmware burning for EVK daughter board ................................................... 15 4 Observe Test Result Via PC Software EvkMonitor ............................................... 18 5 Update PCBA (DUT) Firmware .............................................................................. 21 Appendix 1 Test Item List On PC Software EvkMonitor ...................................... 23 Appendix 2Hardware List ......................................................................................... 26 Appendix 3Dimension chart of EVK daughter board and buzzer board .................. 27 AN-16052600-E3 3 Ver 1.2.0 Assembly And Maintenance Manual for Telink Test System 2.1 Table of figures Figure 1 EVK daughter board ............................................................................... 5 Figure 2 PCB antenna board and RF cable .......................................................... 5 Figure 3 Buzzer module ....................................................................................... 6 Figure 4 System connection chart ....................................................................... 6 Figure 5 Telink PCB antenna board ...................................................................... 7 Figure 6 Telink PCB antenna dimensions ............................................................. 7 Figure 7 Connection points on EVK daughter board ........................................... 8 Figure 8 Cable connection chart ........................................................................ 10 Figure 9 Test System 2.1 .................................................................................... 11 Figure 10 Connection chart between EVK daughter board and PC .................... 15 Figure 11 Firmware burning interface 1 for EVK daughter board ....................... 16 Figure 12 Firmware burning interface 2 for EVK daughter board ....................... 16 Figure 13 EvkMonitor tool interface ................................................................... 18 Figure 14 Dimension chart of EVK daughter board ............................................. 27 Figure 15 Dimension chart of buzzer board ........................................................ 28 AN-16052600-E3 4 Ver 1.2.0 Assembly And Maintenance Manual for Telink Test System 2.1 1 Overall Architecture Of 1x1 Test System 2.1 Telink Test System 2.1 consists of test bench and mechanical structure. The test bench includes hardware platform and firmware folder, and its provided by Telink;
while customer needs to make the mechanical structure suitable for DUT (Device Under Test), and connect cables according to the guide in this document. A set of 1x1 Test Bench mainly contains the following hardware resources. 1) An EVK daughter board provided by Telink. The EVK board should be burned with the EVK firmware for test bench. 2) A PCB Antenna board provided by Telink, as shown in Figure 2. 3) A buzzer module (Dimension: 50.2x16mm): The buzzer is connected to corresponding GPIO and 3V3DUT of the EVK daughter board via Dupont cables. AN-16052600-E3 5 Ver 1.2.0 Assembly And Maintenance Manual for Telink Test System 2.1 The buzzer module is used for Amic test, and it should be placed as close to Amic as possible. obstacle between them. Note: Do not contact buzzer board with Amic directly, and there should be no 4) A PC. On PC side, the EvkMonitor tool can be used to burn firmware for EVK daughter board (refer to Section 3), and user can also observe test result via the EvkMonitor (refer to Section 4). Figure below shows the system connection chart. Figure 4 System connection chart AN-16052600-E3 6 Ver 1.2.0 EVKDUTGPIOSWirePowerDisplayLED1LED2LED3LED4BUTTONPCBAntennaANTDigital buzzerGPIOPowerPCUSB Assembly And Maintenance Manual for Telink Test System 2.1 2 Hardware Platform Building 2.1 Check External Antenna Telink test bench adopts external antenna for RF test. Customer needs to check the antenna consistency of various jigs. Figure 5 shows the PCB antenna supplied by Telink. Figure 5 Telink PCB antenna board Figure 6 shows dimensions in mm of the PCB antenna supplied by Telink. Figure 6 Telink PCB antenna dimensions AN-16052600-E3 7 Ver 1.2.0 Assembly And Maintenance Manual for Telink Test System 2.1 2.2 Cable connection 2.2.1 Connection points on EVK daughter board Figure 7 marks connection points on EVK daughter board to be connected with DUT, PCB antenna and mechanical structure in any application. RF PIN45 PIN48 SWM 3V3DUT GND GND LED4 RED LED1 Green LED2 Yellow LED3 White Button GND Figure 7 Connection points on EVK daughter board AN-16052600-E3 8 Ver 1.2.0 Assembly And Maintenance Manual for Telink Test System 2.1 2.2.2 Cable connection between EVK daughter board and PCB antenna The connection point RF on EVK daughter board should be connected with PCB antenna board via an RF cable. 2.2.3 Cable connection between EVK daughter board and buzzer Table 1 shows the connection correspondence between EVK daughter board Table 1 Cable connection between EVK and buzzer Connection points on buzzer board 2.2.4 Cable connection between EVK daughter board and Mechanical structure Table 2 shows the connection correspondence between EVK daughter board Table 2 Cable connection between EVK and Mechanical structure Connection points on Mechanical structure and buzzer board. Connection points on EVK daughter board PIN48 3V3DUT GND and Mechanical structure. Connection points on EVK daughter board LED1 Green LED2 Yellow LED3 White LED4 RED Button GND VCC 3V3B GND Green LED+
Yellow LED+
White LED+
Red LED+
Button+
Green LED-, Yellow LED-, White LED-, Red LED-, Button-
AN-16052600-E3 9 Ver 1.2.0 Assembly And Maintenance Manual for Telink Test System 2.1 2.2.5 Cable connection between EVK daughter board and DUT Table 3 shows the connection correspondence between EVK daughter board and DUT. Table 3 Cable connection between EVK and DUT Connection points on EVK daughter board Connection points on DUT 3V3DUT GND SWM BAT+
BAT-
SWS (DUT) If the DUT is a remote control board, its also needed to connect wakeup pin of the DUT with PIN45 of the EVK board. Figure 8 Cable connection chart AN-16052600-E3 10 Ver 1.2.0 EVKMechanical StructureButton+-Red LED+-White LED+-Yellow LED+-Green LED+-PIN48GNDPCB AntennaGNDBuzzer3V3BVCCGND Assembly And Maintenance Manual for Telink Test System 2.1 2.2.6 Other cable connection EVK daughter board should be connected with PC via an USB cable. User can burn firmware for the EVK daughter board and observe test result via the EvkMonitor tool on PC side (refer to Section 3 and Section 4). DUT PCB Antenna Buzzer EVK Figure 9 Test System 2.1 AN-16052600-E3 11 Ver 1.2.0 Assembly And Maintenance Manual for Telink Test System 2.1 3 Firmware Burning For EVK Daughter Board 3.1 Folder structure for Test Bench Firmware Telink test bench firmware folder is generally named as System_V3.0_xxx. The structure of the System_V3.0_xxx folder is shown as below:
DB: This folder contains db files. Sch: This folder contains schematics, cable connection illustration, and etc. The structure of the Script folder is shown as below:
4 1 3 2 1) platform: This folder contains project files. E.g. AN-16052600-E3 12 Ver 1.2.0 Assembly And Maintenance Manual for Telink Test System 2.1 Double click tlsr8266f512et32_1x1Jig_2in1 to open the following interface. test.tls: Jig test script to determine PCBA test items. product.ini: EVK product information to determine PCBA RF test frequency point boot.bin: Image file to download into PCBA finally. 2) uart: Double click uart.bat to open uart window and display real-time log for the convenience of test status check. Only one uart window is allowed at the and ID. same time. 3) conti_test_uart.bat: Double click the file, a uart window will pop up; data wont be available on the window, but only saved in log.txt under this directory for convenience of analysis. AN-16052600-E3 13 Ver 1.2.0 Assembly And Maintenance Manual for Telink Test System 2.1 4) Monitor: This folder contains the EvkMonitor tool on PC side. AN-16052600-E3 14 Ver 1.2.0 Assembly And Maintenance Manual for Telink Test System 2.1 3.2 Firmware burning for EVK daughter board EVK daughter board should be burned with firmware before its ready for use. First connect the EVK daughter board with PC via an USB cable, as shown in Figure 10. EVK Connect EVK with PC via USB cable Figure 10 Connection chart between EVK daughter board and PC Then double click the EvkMonitor.exe under the System_V3.0_xxx\Script\Monitor folder. Click download under the menu Evk to open the burning interface. AN-16052600-E3 15 Ver 1.2.0 Assembly And Maintenance Manual for Telink Test System 2.1 Figure 11 Firmware burning interface 1 for EVK daughter board First click the Select Project Folder button and select the target project folder
(i.e. the project under platform) in the pop-out window. The selected project path will be available in the box next to the Select Project Folder button; test script and product configuration information files will be available in the test.tls and product.ini editing window, respectively. test.tls product.ini Figure 12 Firmware burning interface 2 for EVK daughter board AN-16052600-E3 16 Ver 1.2.0 Assembly And Maintenance Manual for Telink Test System 2.1 During first time of firmware burning, its needed to configure product information (product.ini) for the EVK daughter board. Tick the USB Id box and set Evk number as 0 (always). Then click the Download button to start burning. The log window keeps scrolling until its as shown in the figure below. Now the EVK daughter board is already burned with evk_testbench.bin, test.tls, product.ini, id and other bin files in the folder. After power cycle, the EVK daughter board is ready for use. AN-16052600-E3 17 Ver 1.2.0 Assembly And Maintenance Manual for Telink Test System 2.1 4 Observe Test Result Via PC Software EvkMonitor Double click the Monitor folder under System_V3.0_xxx\Script. Double click the EvkMonitor.exe to open the software interface. If a prompt information of NO usb device pops up as shown below, it indicates communication problem such as USB cable connection with the EVK and PC; though software interface still pops up, user must check and make sure the connection is OK, then restart the software. After the software is started properly, the interface is shown as below:
5 3 4 1 6 7 8 2 Figure 13 EvkMonitor tool interface AN-16052600-E3 18 Ver 1.2.0 Assembly And Maintenance Manual for Telink Test System 2.1 show log: Tick the show log box (as shown in mark 1 of Figure 13) to enable the log window to display dynamic information. log window: As shown in mark 2 of Figure 13, its the area to display dynamic Stop: As shown in mark 3 of Figure 13, the software is in the state of stop by information. default. File: Click open under the File menu (as shown in mark 4 of Figure 13), a window to set the storage path for database files will pop up. Select the storage path as needed, input file name and then click the Open button. Test result will be automatically stored under the directory by the NoteOnly storage path and file name in English are allowed, otherwise it will software. invalidate the database creation. start: Click the start icon (as shown in mark 5 of Figure 13), the software enters the state waiting for receiving the test result. Run: Click the Run icon (as shown in mark 6 of Figure 13) to start testing. AN-16052600-E3 19 Ver 1.2.0 Assembly And Maintenance Manual for Telink Test System 2.1 status: As shown in mark 7 of Figure 13, it serves to display running state of the EVK. The figure above indicates the state of Ongoing. The figure above indicates the state of Success. The figure above indicates the state of Failure. For convenience of subsequent maintenance, its highly recommended to mark the error items and classify them. data: As shown in mark 8 of Figure 13, it serves to display test result. Please refer to Appendix 1 Test Item List On PC Software EvkMonitor for details about test items and corresponding maintenance suggestions. AN-16052600-E3 20 Ver 1.2.0 Assembly And Maintenance Manual for Telink Test System 2.1 5 Update PCBA (DUT) Firmware Connect the EVK daughter board with PC via an USB cable. Double click the EvkMonitor.exe under the folder System_V3.0_20160316\Script\Monitor. Click download under the menu Evk to open the burning interface. To update firmware only, its not needed to modify test.tls and product.ini for the EVK daughter board. 1. Tick the box in front of Burning file. Then click the Burning file button and select the target bin file (no limitation to the file name) in the pop-out window. The path of the selected bin file will be available in the box behind the Burning file button. The MD5 code calculated by the bin file will be available in the box AN-16052600-E3 21 Ver 1.2.0 Assembly And Maintenance Manual for Telink Test System 2.1 2. Click the Download button. The target bin file automatically replaces the previous boot.bin under the project directory, and it will be burned into the EVK next to the MD5. daughter board. After firmware is burned, user can check if the firmware is successfully updated in the EVK daughter board by clicking the Check boot.bin button. The result will be available in the log window and the box next to the Check boot.bin button. Firmware update success Firmware update failure After the firmware is successfully updated, power cycle the EVK daughter board, then its ready for use. AN-16052600-E3 22 Ver 1.2.0 Assembly And Maintenance Manual for Telink Test System 2.1 Appendix 1 Test Item List On PC Software EvkMonitor Index Name Description Parameter CurProtection current protection:
test DUT current GpioShort test if there is any GPIO pins short wired current value show the two pins if there is a short;
if not, its value will be 0 Maintenance Suggestion soldering Maybe problem. Re-solder IC. TpHigh TpLow TxHiCnt TxHiPower TxLoCnt TxLoPower cap value cap value cnt num rf energy cnt num rf energy TP high/ low frequency test:
Tx modulation Carry out calibration to ensure RF Tx quality frequency counting tx high value/power/frequency offset/current test:
packets receives EVK transmitted by DUT at high frequency point, and thus to test DUT Tx performance at high frequency point. Test parameters are DUT Tx packet number, DUT Tx power, DUT Tx frequency offset and DUT Tx current, successively. low frequency counting tx value/power/frequency offset/current test:
packets EVK receives low transmitted by DUT at frequency point, and thus to test DUT Tx performance at low frequency point. Test parameters are DUT Tx packet number, DUT Tx power, DUT Tx frequency offset and DUT Tx current, successively. 10 TxLoFreoffset frequency offset 11 TxLoCurrent current value TxHiFreoffset frequency offset TxHiCurrent current value again;
RF related. Test if failed, temporarily mark it as rejected product, and wait for subsequent analysis. 0 1 2 3 4 5 6 7 8 9 AN-16052600-E3 23 Ver 1.2.0 Assembly And Maintenance Manual for Telink Test System 2.1 Index Name Description Parameter Maintenance Suggestion 12 RxLoCnt cnt num 13 RxLoPower rf energy 14 RxLoCurrent current value low frequency counting rx value/power/current test:
DUT receives packets low transmitted by EVK at frequency point, and thus to test DUT Rx performance at low frequency point. Test parameters are EVK Tx packet number, EVK Tx power current, EVK and successively. Tx frequency counting rx high value/power/current test:
DUT packets receives transmitted by EVK at high frequency point, and thus to test DUT Rx performance at high frequency point. Test parameters are EVK Tx packet number, EVK Tx power and current, EVK successively. Tx cancel flash protection:
Cancel DUT flash write protection for following flash erase and test. set flash as 0/ 0xff:
Write DUT flash with all 0 or all 1 to test flash write operation. deep sleep current/wakeup, suspend current/wakeup test:
low-power Make DUT enter mode
(deep sleep/suspend) and then wake it up via EVK, thus to test current in deep sleep mode, wakeup function from deep sleep mode, current in suspend mode and wakeup function from suspend mode. cnt num rf energy size size current value reg value current value again;
RF related. Test if failed, temporarily mark it as rejected product, and wait subsequent for analysis. Flash related. Maybe soldering problem, re-solder pins to related Flash. bad Maybe with contact if thimble. Check enough theres solder paste for the test points of thimble and PCBA. 15 RxHiCnt 16 RxHiPower 19 20 21 22 23 FlashZero FlashErase DsSlpCur DsSlpWkp SuspendCur 17 RxHiCurrent current value 18 CancleFlashProtection 0, always 24 SuspendWkp reg value AN-16052600-E3 24 Ver 1.2.0 Assembly And Maintenance Manual for Telink Test System 2.1 Index Name Description Parameter 25 IRCur current value IR current test:
Make DUT enter IR state via EVK and test the current at IR state. Amic test:
3V3DUT of EVK supplies power for buzzer, while PIN48 outputs level to make buzzer high board generate square wave signal which drives buzzer to beep. Test DUT register value at this state. 26 Amic register value Detect Amic circuit 27 FlashWrite write flash:
write bin file into DUT flash If err, err address;
if ok its 0 28 WriteID 29 WriteBytes write id(part of ieee id):
write ID information into DUT flash write bytes (part of ieee id):
write specific information into DUT flash id id protect flash:
carry operation for DUT flash out write write flash:
check DUT flash content to ensure burning correct operation 30 FlashProtect protect 1, always 31 FlashWriteLarger If err, err address;
if ok its 0 32 Load load status:
test connection between EVK and DUT No para Maintenance Suggestion current IR problem. Check IR circuit. Flash related. Maybe soldering problem, re-solder pins to related Flash. to IEEE address verify Jig status. Index 27 is fixed value;
Index 28 dynamically increasing value is Flash related. soldering Maybe problem, re-solder pins to related Flash. Contact problem. Check contact thimble between and PCBA. AN-16052600-E3 25 Ver 1.2.0 Assembly And Maintenance Manual for Telink Test System 2.1 Appendix 2Hardware List Type EVK daughter board External antenna board Buzzer board Long RF cable Dupont cable Number 1 1 1 1 Several Mini USB cable 1 Spec C1T42A20_V3.3 ANT_01 C1T64A3_V2.0 SMA-MMCX dual-shielded cable -30cm USB2.0/28AWG/30cm, 30V/80/A3-B AN-16052600-E3 26 Ver 1.2.0 Assembly And Maintenance Manual for Telink Test System 2.1 Appendix 3Dimension chart of EVK daughter board and buzzer board Figure 14 Dimension chart of EVK daughter board AN-16052600-E3 27 Ver 1.2.0 Assembly And Maintenance Manual for Telink Test System 2.1 Figure 15 Dimension chart of buzzer board AN-16052600-E3 28 Ver 1.2.0 FCC Statement Any Changes or modifications not expressly approved by the party responsible for compliance could void the users authority to operate the equipment. This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions:
(1) This device may not cause harmful interference,and (2) this device must accept any interference received, including interference that may cause undesired operation. Note: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However,there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:
Reorient or relocate the receiving antenna. Increase the separation between the equipment and receiver. Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. Consult the dealer or an experienced radio/TV technician for help.