Application Note Assembly And Maintenance Manual for Telink BLE 1x1 Test System 2.1 AN-16052600-E3 Ver 1.2.0 2016/9/26 Brief This document is the assembly and maintenance guide for Telink BLE 1x1 Test System 2.1. T E L I N K S E M I C O N D U C T O R Telink for customer Assembly And Maintenance Manual for Telink BLE 1x1 Test System 2.1 Published by Telink Semiconductor Bldg 3, 1500 Zuchongzhi Rd, Zhangjiang Hi-Tech Park, Shanghai, China Telink Semiconductor All Right Reserved Legal Disclaimer Telink Semiconductor reserves the right to make changes without further notice to any products herein to improve reliability, function or design. Telink Semiconductor disclaims any and all liability for any errors, inaccuracies or incompleteness contained herein or in any other disclosure relating to any product. Telink Semiconductor does not assume any liability arising out of the application or use of any product or circuit described herein; neither does it convey any license under its patent rights, nor the rights of others The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. Customers using or selling Telink Semiconductor products not expressly indicated for use in such applications do so entirely at their own risk and agree to fully indemnify Telink Semiconductor for any damages arising or resulting from such use or sale. Information:
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telinkcnsales@telink-semi.com telinkcnsupport@telink-semi.com AN-16052600-E3 1 Ver 1.2.0 Telink for customer Assembly And Maintenance Manual for Telink BLE 1x1 Test System 2.1 Revision History Version Major Changes Date Author 1.0.0 Initial release 2016/5 H.Z.F., L.X., Cynthia Updated buzzer related contents, including: buzzer module photo, cable connection between buzzer and EVK daughter board, cable connection chart, test system photo, Amic test item, buzzer spec in hardware list, and dimension chart of buzzer board. Updated the spec column in hardware list. 1.1.0 1.2.0 2016/8 T.J.B., Cynthia 2016/9 H.Z.F., Cynthia AN-16052600-E3 2 Ver 1.2.0 Telink for customer Assembly And Maintenance Manual for Telink BLE 1x1 Test System 2.1 Table of contents 1 Overall Architecture Of 1x1 Test System 2.1 .......................................................... 5 2 Hardware Platform Building ................................................................................... 7 2.1 Check External Antenna ................................................................................... 7 2.2 Cable connection ............................................................................................. 8 2.2.1 Connection points on EVK daughter board .............................................. 8 2.2.2 Cable connection between EVK daughter board and PCB antenna ......... 9 2.2.3 Cable connection between EVK daughter board and buzzer ................... 9 2.2.4 Cable connection between EVK daughter board and Mechanical structure ................................................................................................................. 9 2.2.5 Cable connection between EVK daughter board and DUT ..................... 10 2.2.6 Other cable connection .......................................................................... 11 3 Firmware Burning For EVK Daughter Board ......................................................... 12 3.1 Folder structure for Test Bench Firmware ..................................................... 12 3.2 Firmware burning for EVK daughter board ................................................... 15 4 Observe Test Result Via PC Software EvkMonitor ............................................... 18 5 Update PCBA (DUT) Firmware .............................................................................. 21 Appendix 1 Test Item List On PC Software EvkMonitor ...................................... 23 Appendix 2Hardware List ......................................................................................... 26 Appendix 3Dimension chart of EVK daughter board and buzzer board .................. 27 AN-16052600-E3 3 Ver 1.2.0 Telink for customer Assembly And Maintenance Manual for Telink BLE 1x1 Test System 2.1 Table of figures Figure 1 EVK daughter board ............................................................................... 5 Figure 2 PCB antenna board and RF cable .......................................................... 5 Figure 3 Buzzer module ....................................................................................... 6 Figure 4 System connection chart ....................................................................... 6 Figure 5 Telink PCB antenna board ...................................................................... 7 Figure 6 Telink PCB antenna dimensions ............................................................. 7 Figure 7 Connection points on EVK daughter board ........................................... 8 Figure 8 Cable connection chart ........................................................................ 10 Figure 9 BLE 1x1 Test System 2.1 ....................................................................... 11 Figure 10 Connection chart between EVK daughter board and PC .................... 15 Figure 11 Firmware burning interface 1 for EVK daughter board ....................... 16 Figure 12 Firmware burning interface 2 for EVK daughter board ....................... 16 Figure 13 EvkMonitor tool interface ................................................................... 18 Figure 14 Dimension chart of EVK daughter board ............................................. 27 Figure 15 Dimension chart of buzzer board ........................................................ 28 AN-16052600-E3 4 Ver 1.2.0 Telink for customer Assembly And Maintenance Manual for Telink BLE 1x1 Test System 2.1 1 Overall Architecture Of 1x1 Test System 2.1 Telink BLE 1x1 Test System 2.1 consists of test bench and mechanical structure. The test bench includes hardware platform and firmware folder, and its provided by Telink; while customer needs to make the mechanical structure suitable for DUT
(Device Under Test), and connect cables according to the guide in this document. A set of 1x1 Test Bench mainly contains the following hardware resources. 1) An EVK daughter board provided by Telink. The EVK board should be burned with the EVK firmware for test bench. Figure 1 EVK daughter board 3) A buzzer module (Dimension: 50.2x16mm): The buzzer is connected to corresponding GPIO and 3V3DUT of the EVK daughter board via Dupont cables. AN-16052600-E3 5 Ver 1.2.0 Assembly And Maintenance Manual for Telink BLE 1x1 Test System 2.1 The buzzer module is used for Amic test, and it should be placed as close to Amic as possible. Note: Do not contact buzzer board with Amic directly, and there should be no obstacle between them. Figure 3 Buzzer module 4) A PC. On PC side, the EvkMonitor tool can be used to burn firmware for EVK daughter board (refer to Section 3), and user can also observe test result via the EvkMonitor (refer to Section 4). Figure below shows the system connection chart. Figure 4 System connection chart AN-16052600-E3 6 Ver 1.2.0 EVKDUTGPIOSWirePowerDisplayLED1LED2LED3LED4BUTTONPCBAntennaANTDigital buzzer GPIOPowerPCUSB Assembly And Maintenance Manual for Telink BLE 1x1 Test System 2.1 2.2 Cable connection 2.2.1 Connection points on EVK daughter board Figure 7 marks connection points on EVK daughter board to be connected with DUT, PCB antenna and mechanical structure in any application. RF PIN45 PIN48 SWM 3V3DUT GND GND LED4 RED LED1 Green LED2 Yellow LED3 White Button GND Figure 7 Connection points on EVK daughter board AN-16052600-E3 8 Ver 1.2.0 Assembly And Maintenance Manual for Telink BLE 1x1 Test System 2.1 2.2.2 Cable connection between EVK daughter board and PCB antenna The connection point RF on EVK daughter board should be connected with PCB antenna board via an RF cable. 2.2.3 Cable connection between EVK daughter board and buzzer Table 1 shows the connection correspondence between EVK daughter board and buzzer board. Table 1 Cable connection between EVK and buzzer Connection points on EVK daughter board Connection points on buzzer board PIN48 3V3DUT GND VCC 3V3B GND 2.2.4 Cable connection between EVK daughter board and Mechanical structure Table 2 shows the connection correspondence between EVK daughter board and Mechanical structure. Table 2 Cable connection between EVK and Mechanical structure Connection points on EVK daughter board Connection points on Mechanical structure LED1 Green LED2 Yellow LED3 White LED4 RED Button GND Green LED+
Yellow LED+
White LED+
Red LED+
Button+
Green LED-, Yellow LED-, White LED-, Red LED-, Button-
AN-16052600-E3 9 Ver 1.2.0 Assembly And Maintenance Manual for Telink BLE 1x1 Test System 2.1 2.2.5 Cable connection between EVK daughter board and DUT Table 3 shows the connection correspondence between EVK daughter board and DUT. Table 3 Cable connection between EVK and DUT Connection points on EVK daughter board Connection points on DUT 3V3DUT GND SWM BAT+
BAT-
SWS (DUT) If the DUT is a remote control board, its also needed to connect wakeup pin of the DUT with PIN45 of the EVK board. Figure 8 Cable connection chart AN-16052600-E3 10 Ver 1.2.0 EVKMechanical StructureButton+-Red LED+-White LED+-Yellow LED+-Green LED+-PIN48GNDGNDBuzzer3V3BVCCGND Assembly And Maintenance Manual for Telink BLE 1x1 Test System 2.1 3 Firmware Burning For EVK Daughter Board 3.1 Folder structure for Test Bench Firmware Telink test bench firmware folder is generally named as BLE_System_V3.0_xxx. The structure of the BLE_System_V3.0_xxx folder is shown as below:
DB: This folder contains db files. Sch: This folder contains schematics, cable connection illustration, and etc. The structure of the Script folder is shown as below:
4 1 3 2 1) platform: This folder contains project files. E.g. AN-16052600-E3 12 Ver 1.2.0 Assembly And Maintenance Manual for Telink BLE 1x1 Test System 2.1 Double click tlsr8266f512et32_1x1Jig_2in1 to open the following interface. test.tls: Jig test script to determine PCBA test items. product.ini: EVK product information to determine PCBA RF test frequency point and ID. boot.bin: Image file to download into PCBA finally. 2) uart: Double click uart.bat to open uart window and display real-time log for the convenience of test status check. Only one uart window is allowed at the same time. 3) conti_test_uart.bat: Double click the file, a uart window will pop up; data wont be available on the window, but only saved in log.txt under this directory for convenience of analysis. AN-16052600-E3 13 Ver 1.2.0 Assembly And Maintenance Manual for Telink BLE 1x1 Test System 2.1 4) Monitor: This folder contains the EvkMonitor tool on PC side. AN-16052600-E3 14 Ver 1.2.0 Assembly And Maintenance Manual for Telink BLE 1x1 Test System 2.1 3.2 Firmware burning for EVK daughter board EVK daughter board should be burned with firmware before its ready for use. First connect the EVK daughter board with PC via an USB cable, as shown in Figure 10. EVK Connect EVK with PC via USB cable Figure 10 Connection chart between EVK daughter board and PC Then double click the EvkMonitor.exe under the BLE_System_V3.0_xxx\Script\Monitor folder. Click download under the menu Evk to open the burning interface. AN-16052600-E3 15 Ver 1.2.0 Assembly And Maintenance Manual for Telink BLE 1x1 Test System 2.1 Figure 11 Firmware burning interface 1 for EVK daughter board First click the Select Project Folder button and select the target project folder
(i.e. the project under platform) in the pop-out window. The selected project path will be available in the box next to the Select Project Folder button; test script and product configuration information files will be available in the test.tls and product.ini editing window, respectively. test.tls product.ini Figure 12 Firmware burning interface 2 for EVK daughter board AN-16052600-E3 16 Ver 1.2.0 Assembly And Maintenance Manual for Telink BLE 1x1 Test System 2.1 During first time of firmware burning, its needed to configure product information (product.ini) for the EVK daughter board. Tick the USB Id box and set Evk number as 0 (always). Then click the Download button to start burning. The log window keeps scrolling until its as shown in the figure below. Now the EVK daughter board is already burned with evk_testbench.bin, test.tls, product.ini, id and other bin files in the folder. After power cycle, the EVK daughter board is ready for use. AN-16052600-E3 17 Ver 1.2.0 Assembly And Maintenance Manual for Telink BLE 1x1 Test System 2.1 4 Observe Test Result Via PC Software EvkMonitor Double click the Monitor folder under BLE_System_V3.0_xxx\Script. Double click the EvkMonitor.exe to open the software interface. If a prompt information of NO usb device pops up as shown below, it indicates communication problem such as USB cable connection with the EVK and PC; though software interface still pops up, user must check and make sure the connection is OK, then restart the software. After the software is started properly, the interface is shown as below:
5 3 4 1 6 7 8 2 Figure 13 EvkMonitor tool interface AN-16052600-E3 18 Ver 1.2.0 Assembly And Maintenance Manual for Telink BLE 1x1 Test System 2.1 show log: Tick the show log box (as shown in mark 1 of Figure 13) to enable the log window to display dynamic information. log window: As shown in mark 2 of Figure 13, its the area to display dynamic information. Stop: As shown in mark 3 of Figure 13, the software is in the state of stop by default. File: Click open under the File menu (as shown in mark 4 of Figure 13), a window to set the storage path for database files will pop up. Select the storage path as needed, input file name and then click the Open button. Test result will be automatically stored under the directory by the software. NoteOnly storage path and file name in English are allowed, otherwise it will invalidate the database creation. start: Click the start icon (as shown in mark 5 of Figure 13), the software enters the state waiting for receiving the test result. Run: Click the Run icon (as shown in mark 6 of Figure 13) to start testing. AN-16052600-E3 19 Ver 1.2.0 Assembly And Maintenance Manual for Telink BLE 1x1 Test System 2.1 status: As shown in mark 7 of Figure 13, it serves to display running state of the EVK. The figure above indicates the state of Ongoing. The figure above indicates the state of Success. The figure above indicates the state of Failure. For convenience of subsequent maintenance, its highly recommended to mark the error items and classify them. data: As shown in mark 8 of Figure 13, it serves to display test result. Please refer to Appendix 1 Test Item List On PC Software EvkMonitor for details about test items and corresponding maintenance suggestions. AN-16052600-E3 20 Ver 1.2.0 Assembly And Maintenance Manual for Telink BLE 1x1 Test System 2.1 5 Update PCBA (DUT) Firmware Connect the EVK daughter board with PC via an USB cable. Double click the EvkMonitor.exe under the folder BLE_System_V3.0_20160316\Script\Monitor. Click download under the menu Evk to open the burning interface. To update firmware only, its not needed to modify test.tls and product.ini for the EVK daughter board. 1. Tick the box in front of Burning file. Then click the Burning file button and select the target bin file (no limitation to the file name) in the pop-out window. The path of the selected bin file will be available in the box behind the Burning file button. The MD5 code calculated by the bin file will be available in the box AN-16052600-E3 21 Ver 1.2.0 Assembly And Maintenance Manual for Telink BLE 1x1 Test System 2.1 next to the MD5. 2. Click the Download button. The target bin file automatically replaces the previous boot.bin under the project directory, and it will be burned into the EVK daughter board. After firmware is burned, user can check if the firmware is successfully updated in the EVK daughter board by clicking the Check boot.bin button. The result will be available in the log window and the box next to the Check boot.bin button. Firmware update success Firmware update failure After the firmware is successfully updated, power cycle the EVK daughter board, then its ready for use. AN-16052600-E3 22 Ver 1.2.0 Assembly And Maintenance Manual for Telink BLE 1x1 Test System 2.1 0 1 2 3 4 5 6 7 8 9 Appendix 1 Test Item List On PC Software EvkMonitor Index Name Description Parameter CurProtection current protection:
test DUT current GpioShort test if there is any GPIO pins short wired current value show the two pins if there is a short;
if not, its value will be 0 TpHigh TpLow TxHiCnt TxHiPower TxHiFreoffset TxHiCurrent TxLoCnt TxLoPower TP high/ low frequency test:
Tx modulation Carry out calibration to ensure RF Tx quality frequency counting tx high value/power/frequency offset/current test:
packets EVK receives transmitted by DUT at high frequency point, and thus to test DUT Tx performance at high frequency point. Test parameters are DUT Tx packet number, DUT Tx power, DUT Tx frequency offset and DUT Tx current, successively. low frequency counting tx value/power/frequency offset/current test:
packets EVK receives low transmitted by DUT at frequency point, and thus to test DUT Tx performance at low frequency point. Test parameters are DUT Tx packet number, DUT Tx power, DUT Tx frequency offset and DUT Tx current, successively. cap value cap value cnt num rf energy frequency offset current value cnt num rf energy frequency offset current value 10 TxLoFreoffset 11 TxLoCurrent Maintenance Suggestion soldering Maybe problem. Re-solder IC. again;
RF related. Test if failed, temporarily mark it as rejected product, and wait for subsequent analysis. AN-16052600-E3 23 Ver 1.2.0 Assembly And Maintenance Manual for Telink BLE 1x1 Test System 2.1 Index Name Description Parameter Maintenance Suggestion 12 RxLoCnt 13 RxLoPower 14 RxLoCurrent 15 RxHiCnt 16 RxHiPower 17 RxHiCurrent low receives frequency counting rx value/power/current test:
DUT packets transmitted by EVK at low frequency point, and thus to test DUT Rx performance at low frequency point. Test parameters are EVK Tx packet number, EVK Tx power EVK and current, successively. Tx receives frequency counting rx high value/power/current test:
DUT packets transmitted by EVK at high frequency point, and thus to test DUT Rx performance at high frequency point. Test parameters are EVK Tx packet number, EVK Tx power and current, EVK successively. Tx 18 CancleFlashProtection 19 20 21 22 23 FlashZero FlashErase DsSlpCur DsSlpWkp SuspendCur 24 SuspendWkp cancel flash protection:
Cancel DUT flash write protection for following flash erase and test. set flash as 0/ 0xff:
Write DUT flash with all 0 or all 1 to test flash write operation. deep sleep current/wakeup, suspend current/wakeup test:
low-power Make DUT enter mode
(deep sleep/suspend) and then wake it up via EVK, thus to test current in deep sleep mode, wakeup function from deep sleep mode, current in suspend mode and wakeup function from suspend mode. cnt num rf energy current value cnt num rf energy current value 0, always size size current value reg value current value reg value again;
RF related. Test if failed, temporarily mark it as rejected product, and wait for subsequent analysis. Flash related. Maybe soldering problem, re-solder pins to Flash. related bad Maybe with contact if thimble. Check enough theres solder paste for the test points of thimble and PCBA. AN-16052600-E3 24 Ver 1.2.0 Assembly And Maintenance Manual for Telink BLE 1x1 Test System 2.1 Index Name Description Parameter 25 IRCur 26 Amic IR current test:
Make DUT enter IR state via EVK and test the current at IR state. Amic test:
3V3DUT of EVK supplies power for buzzer, while PIN48 outputs high level to make buzzer board generate square wave signal which drives buzzer to beep. Test DUT register value at this state. Maintenance Suggestion current IR problem. Check IR circuit. current value register value Detect Amic circuit 27 FlashWrite write flash:
write bin file into DUT flash If err, err address;
if ok its 0 28 WriteID 29 WriteBytes 30 FlashProtect 31 FlashWriteLarger write id(part of ieee id):
write ID information into DUT flash write bytes (part of ieee id):
write specific information into DUT flash id id protect flash:
carry operation for DUT flash out write protect 1, always write flash:
check DUT flash content to ensure burning operation correct If err, err address;
if ok its 0 32 Load load status:
test connection between EVK and DUT No para Flash related. Maybe soldering problem, re-solder pins to Flash. related to IEEE address verify Jig status. Index 27 is fixed value;
Index 28 dynamically increasing value is Flash related. soldering Maybe problem, re-solder pins to Flash. related Contact problem. Check contact thimble between and PCBA. AN-16052600-E3 25 Ver 1.2.0 Assembly And Maintenance Manual for Telink BLE 1x1 Test System 2.1 Appendix 2Hardware List Type Number Spec BLE EVK daughter board Buzzer board Long RF cable Dupont cable 1 1 1 Several C1T42A20_V3.3 C1T64A3_V2.0 SMA-MMCX dual-shielded cable -30cm Mini USB cable 1 USB2.0/28AWG/30cm, 30V/80/A3-B AN-16052600-E3 26 Ver 1.2.0 Assembly And Maintenance Manual for Telink BLE 1x1 Test System 2.1 Appendix 3Dimension chart of EVK daughter board and buzzer board Figure 14 Dimension chart of EVK daughter board AN-16052600-E3 27 Ver 1.2.0 Assembly And Maintenance Manual for Telink BLE 1x1 Test System 2.1 Figure 15 Dimension chart of buzzer board FCC COMPLIANCE STATEMENT:
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. AN-16052600-E3 28 Ver 1.2.0