FCC ID: QIPPLS63-X Module

Cinterion PLS63-X Hardware Interface Overview Version:

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00.860 PLS63-X_HIO_v00.860 Cinterion PLS63-X Hardware Interface Overview Page 2 of 61 2 Document Name: Cinterion PLS63-X Hardware Interface Overview Version:

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Status 2021-02-22 PLS63-X_HIO_v00.860 Confidential / Preliminary GENERAL NOTE THE USE OF THE PRODUCT INCLUDING THE SOFTWARE AND DOCUMENTATION (THE "PROD-

UCT") IS SUBJECT TO THE RELEASE NOTE PROVIDED TOGETHER WITH PRODUCT. IN ANY EVENT THE PROVISIONS OF THE RELEASE NOTE SHALL PREVAIL. THIS DOCUMENT CONTAINS INFORMATION ON THALES DIS AIS DEUTSCHLAND GMBH (THALES) PRODUCTS. THE SPECIFI-

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tents and communication thereof to others without express authorization are prohibited. Offenders will be held liable for payment of damages. All rights created by patent grant or registration of a utility model or design patent are reserved. Copyright 2021, THALES DIS AIS Deutschland GmbH Trademark Notice Thales, the Thales logo, are trademarks and service marks of Thales and are registered in certain coun-

tries. Microsoft and Windows are either registered trademarks or trademarks of Microsoft Corporation in the United States and/or other countries. All other registered trademarks or trademarks mentioned in this document are property of their respective owners. t PLS63-X_HIO_v00.860 Confidential / Preliminary 2021-02-22 Cinterion PLS63-X Hardware Interface Overview Contents 61 Page 3 of 61 Contents 1 2 3 4 5 6 Introduction ................................................................................................................. 7 Product Variants ................................................................................................ 7 1.1 Key Features at a Glance .................................................................................. 7 1.2 PLS63-X System Overview.............................................................................. 11 1.3 Interface Characteristics .......................................................................................... 12 Application Interface ........................................................................................ 12 2.1 2.1.1 USB Interface...................................................................................... 12 Serial Interface ASC0 ......................................................................... 13 2.1.2 2.1.3 Serial Interface ASC1 ......................................................................... 14 2.1.4 UICC/SIM/USIM Interface................................................................... 15 2.1.4.1 SIM_SWITCH Line.............................................................. 17 2.1.5 GPIO Interface .................................................................................... 18 2.1.6 Digital Audio Interface......................................................................... 18 2.1.6.1 Pulse Code Modulation Interface ........................................ 18 Inter-IC Sound Interface (TBD) ........................................... 19 2.1.6.2 2.1.7 Control Signals.................................................................................... 20 2.1.7.1 Status LED .......................................................................... 20 2.1.7.2 Power Indication.................................................................. 21 RF Antenna Interface....................................................................................... 22 2.2.1 Antenna Installation ............................................................................ 23 2.2.2 RF Line Routing Design...................................................................... 24 2.2.2.1 Line Arrangement Examples ............................................... 24 2.2.2.2 Routing Example................................................................. 29 GNSS Antenna Interface ................................................................................. 30 2.3.1 GNSS Antenna Diagnostic.................................................................. 31 2.2 2.3 Operating Characteristics ........................................................................................ 32 Power Supply................................................................................................... 32 3.1 Mechanical Dimensions, Mounting and Packaging............................................... 33 Mechanical Dimensions of PLS63-X................................................................ 33 4.1 Regulatory and Type Approval Information ........................................................... 37 Directives and Standards................................................................................. 37 5.1 SAR requirements specific to portable mobiles ............................................... 38 5.2 Reference Equipment for Type Approval ......................................................... 39 5.3 Compliance with FCC/IC/ISED Rules and Regulations ................................... 40 5.4 Document Information.............................................................................................. 42 Revision History ............................................................................................... 42 6.1 Related Documents ......................................................................................... 42 6.2 Terms and Abbreviations ................................................................................. 42 6.3 Safety Precaution Notes .................................................................................. 46 6.4 t PLS63-X_HIO_v00.860 Confidential / Preliminary 2021-02-22 Cinterion PLS63-X Hardware Interface Overview Contents 61 Page 4 of 61 7 Appendix.................................................................................................................... 47 List of Parts and Accessories........................................................................... 47 7.1 t PLS63-X_HIO_v00.860 Confidential / Preliminary 2021-02-22 Cinterion PLS63-X Hardware Interface Overview Tables Page 5 of 61 Tables Table 1:

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Signals of the SIM interface (SMT application interface) ............................... 15 GPIO lines and possible alternative assignment............................................ 18 Overview of PCM pin functions ...................................................................... 19 Overview of I2S pin functions ......................................................................... 20 Return loss in the active band........................................................................ 22 Sample ranges of the GNSS antenna diagnostic measurements and their possible meaning ........................................................................................... 31 Standards of North American type approval .................................................. 37 Requirements of quality ................................................................................. 37 Standards of the Ministry of Information Industry of the Peoples Republic of China ............................................................................ 38 Antenna gain limits for FCC and ISED........................................................... 40 List of parts and accessories.......................................................................... 48 Molex sales contacts (subject to change) ...................................................... 49 t PLS63-X_HIO_v00.860 Confidential / Preliminary 2021-02-22 Cinterion PLS63-X Hardware Interface Overview Figures Page 6 of 61 Figures Figure 1:

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PLS63-X system overview ............................................................................. 11 USB circuit ..................................................................................................... 12 Serial interface ASC0..................................................................................... 13 Serial interface ASC1..................................................................................... 14 Modules two UICC/SIM/USIM interfaces ...................................................... 16 UICC/SIM/USIM interfaces connected........................................................... 16 External UICC/SIM/USIM switch.................................................................... 17 Sample circuit for SIM interface connection via SIM switch........................... 17 Status signaling with LED driver .................................................................... 20 Power indication signal .................................................................................. 21 Antenna pads (bottom view) .......................................................................... 23 Embedded Stripline with 65m prepreg (1080) and 710m core .................. 24 Micro-Stripline on 1.0mm standard FR4 2-layer PCB - example 1 ................ 25 Micro-Stripline on 1.0mm Standard FR4 PCB - example 2............................ 26 Micro-Stripline on 1.5mm Standard FR4 PCB - example 1............................ 27 Micro-Stripline on 1.5mm Standard FR4 PCB - example 2............................ 28 Routing to applications RF connector ........................................................... 29 PLS63-X evaluation board layer table............................................................ 29 Supply voltage for active GNSS antenna....................................................... 30 ESD protection for passive GNSS antenna ................................................... 31 Decoupling capacitor(s) for BATT+................................................................ 32 PLS63-X top and bottom view for X variant ................................................. 34 Dimensions of (all dimensions in mm) .......................................................... 35 Dimensions of PLS63-X (all dimensions in mm) ............................................ 35 Dimensions of PLS63-X (keepout area recommended)................................. 36 Reference equipment for Type Approval ....................................................... 39 t PLS63-X_HIO_v00.860 Confidential / Preliminary 2021-02-22 Cinterion PLS63-X Hardware Interface Overview 1 Introduction 11 Page 7 of 61 1 Introduction This document1 describes the hardware of the Cinterion PLS63-X module. It helps you quickly retrieve interface specifications, electrical and mechanical details and information on the re-

quirements to be considered for integrating further components. 1.1 Product Variants This document applies to the following Thales module variants:

CinterionPLS63-X Module 1.2 Key Features at a Glance Feature General Implementation Frequency bands PLS63-X integrates all the bands required to have a global coverage across the world (NORAM / LATAM / EMEA /APAC). GSM class Small MS Output power (according to release 99) Class 4 (+33dBm 2dB) for GSM850 Class 4 (+33dBm 2dB) for GSM900 Class 1 (+30dBm 2dB) for GSM1800 Class 1 (+30dBm 2dB) for GSM1900 Class E2 (+27dBm 3dB) for GSM 850 8-PSK Class E2 (+27dBm 3dB) for GSM 900 8-PSK Class E2 (+26dBm +3 /-4dB) for GSM 1800 8-PSK Class E2 (+26dBm +3 /-4dB) for GSM 1900 8-PSK Output power (according to Release 99) Class 3 (+24dBm +1/-3dB) for UMTS 850, WCDMA FDD BdV Class 3 (+24dBm +1/-3dB) for UMTS 1900, WCDMA FDD BdII Class 3 (+24dBm +1/-3dB) for UMTS 2100, WCDMA FDD BdIV Output power (according to Release 8) Class 3 (+23dBm 2dB) for LTE 600, LTE FDD Bd71 Class 3 (+23dBm 2dB) for LTE 700, LTE FDD Bd12 Class 3 (+23dBm 2dB) for LTE 700, LTE FDD Bd13 Class 3 (+23dBm 2dB) for LTE 700, LTE FDD Bd14 Class 3 (+23dBm 2dB) for LTE 850, LTE FDD Bd26 Class 3 (+23dBm 2dB) for LTE 850, LTE FDD Bd5 Class 3 (+23dBm 2dB) for LTE 1900, LTE FDD Bd2 Class 3 (+23dBm 2dB) for LTE 1900, LTE FDD Bd25 Class 3 (+23dBm 2dB) for LTE 2100, LTE FDD Bd4 Class 3 (+23dBm 2dB) for LTE 2100, LTE FDD Bd66 Power supply Normal operation:

3.0V < VBATT+ < 4.5V Typ value is 3.8V Extended operation: TBD 1. The document is effective only if listed in the appropriate Release Notes as part of the technical docu-

mentation delivered with your Thales product. t PLS63-X_HIO_v00.860 Confidential / Preliminary 2021-02-22 Physical RoHS LTE features HSPA feature 3GPP Release 7 UMTS features 3GPP Release 4 GSM/GPRS/EGPRS features Data transfer Cinterion PLS63-X Hardware Interface Overview 1.2 Key Features at a Glance 11 Page 8 of 61 Feature Implementation Operating temperature

(board temperature) Normal operation: -30C to +85C Extended operation: -40C to -30C, +85C to +90C Dimensions: 33mm x 29mm x 2.5mm Weight: approx. 4.8g All hardware components fully compliant with EU RoHS Directive 3GPP Release 10 UE CAT 1 for PLS63 (DL 10Mbps, UL 5Mbps) UE CAT. 8, 6 for PLS63 HSDPA DL 7.2Mbps HSUPA UL 5.7Mbps Compressed mode (CM) supported according to 3GPP TS25.212 PS data rate 384 kbps DL / 384 kbps UL CS data rate 64 kbps DL / 64 kbps UL EDGE E2 power class for 8 PSK GPRS:

Multislot Class 12 Mobile Station Class B Coding Scheme 1 4 EGPRS:

Multislot Class 12 Downlink coding schemes CS 1-4, MCS 1-9 Uplink coding schemes CS 1-4, MCS 1-9 SRB loopback and test mode B 8-bit, 11-bit RACH 1 phase/2 phase access procedures Link adaptation and IR NACC, extended UL TBF Mobile Station Class B Point-to-point MT and MO Cell broadcast Text and PDU mode Storage: SIM card plus SMS locations in mobile equipment GNSS Features NMEA SMS Protocol Modes General Software Standalone GNSS (GPS, GLONASS, Beidou, Galileo) Automatic power saving modes. DC feed bridge and control of power supply for active antenna AT commands Hayes 3GPP TS 27.007, TS 27.005, Thales t PLS63-X_HIO_v00.860 Confidential / Preliminary 2021-02-22 Cinterion PLS63-X Hardware Interface Overview 1.2 Key Features at a Glance 11 Page 9 of 61 Feature Implementation SIM Application Toolkit Default (Network) bearer support for BIP Firmware update Generic update from host application over USB modem Interfaces Module interface USB 2 serial interfaces 2 UICC interfaces

(switchable) GPIO interface I2C interface Digital audio interface Power on/off, Reset Power on/off Reset Special features Surface mount device with solderable connection pads (SMT application interface). Land grid array (LGA) technology ensures high solder joint reli-

ability and allows the use of an optional module mounting socket. For more information on how to integrate SMT modules see also [4].This application note comprises chapters on module mounting and application layout issues as well as on additional SMT application development equip-

ment. USB 2.0 High Speed (480Mbit/s) device interface. Full Speed (12Mbit/s) compliant. ASC0 (in parts shared with GPIO lines):

8-wire modem interface with status and control lines, unbalanced, asyn-

chronous Fixed baud rates: 300bps to 921,600bps Supports RTS0/CTS0 hardware flow control. ASC1 (shared with GPIO lines):

4-wire, unbalanced asynchronous interface Fixed baud rates: 300bps to 921,600bps and 3Mbps Supports RTS1/CTS1 hardware flow control Audio 1 digital interface (PCM), shared with GPIO lines Supported chip cards: UICC/SIM/USIM 3V, 1.8V 22 GPIO lines comprising:

13 lines shared with ASC0, ASC1 lines, with network status indication, fast shutdown and SIM switch 4 GPIO lines shared with PCM interface 9 GPIO lines not shared Supports I2C serial interface. 1 digital interface can be configured as PCM or I2S(TBD). RING0 Support RING0 to wake up host from power down modes Antenna interface pads 50. UMTS/GSM/LTE main antenna, UMTS/LTE Rx Diversity antenna, GNSS antenna. ADC inputs Analog-to-Digital Converter with unbalanced analog inputs, for example, for the (external) antenna diagnosis Switch on by hardware signal IGT Switch off by AT command Switch off by hardware signal FST_SHDN instead of AT command Automatic switch off in case of critical temperature or voltage conditions Orderly reset by AT command Reset by emergency reset signal EMERG_RST. Real time clock Timer functions via AT commands. t PLS63-X_HIO_v00.860 Confidential / Preliminary 2021-02-22 Cinterion PLS63-X Hardware Interface Overview 1.2 Key Features at a Glance 11 Page 10 of 61 Implementation Feature Evaluation kit LGA DevKit DSB-mini DSB75 LGA DevKit designed to test Thales LGA modules. Evaluation module PLS63-X module soldered onto a dedicated PCB that can be connected to an adapter in order to be mounted onto the DSB75 or DSB mini. DSB-mini Development Support Board designed to test and type approve. It is the cost optimized development board alternative to DSB75. DSB75 Development Support Board designed to test and type approve Thales modules and provide a sample configuration for application engi-

neering. A special adapter is required to connect the PLS63-X evaluation module to the DSB75. t PLS63-X_HIO_v00.860 Confidential / Preliminary 2021-02-22 Cinterion PLS63-X Hardware Interface Overview 1.3 PLS63-X System Overview 11 1.3 PLS63-X System Overview Page 11 of 61 Application Module GPIO Digital Audio STATUS SIM_SWITCH FST_SHDN ASC1/GPIO ASC0/GPIO PWR_IND ASC0/GPIO I2C USB ADC SIM1 interface(with SIM card detection) SIM2 interface(with SIM card detection) CONTROL Power Supply RF_Main_Path Diversity_RX GNSS_Path 2 9 1 1 1 4 4 1 4 2 3 3 3 1 5 1 5 1 1 1 1 1 1 1 1 GPIO PCM/GPIO STATUS/GPIO SIM_SWITCH/GPIO Fast Shutdown/GPIO Serial Interface/GPIO Serial Interface/GPIO Power Indicator Serial Interface 0 I2C USB ADC SIM1 Card SIM2 Card IGT EMERG_RST VGNSS Base Band Power RF Power Main Antenna Diversity Antenna GNSS Antenna Digital Audio PCM(I2S) Interface&MCLK 1 GNSS_DC Figure 1: PLS63-X system overview t PLS63-X_HIO_v00.860 Confidential / Preliminary 2021-02-22 Cinterion PLS63-X Hardware Interface Overview 2 Interface Characteristics 31 2 Interface Characteristics Page 12 of 61 PLS63-X is equipped with an SMT application interface that connects to the external applica-

tion. The SMT application interface incorporates the various application interfaces as well as the RF antenna interface. 2.1 Application Interface 2.1.1 USB Interface PLS63-X supports a USB 2.0 High Speed (480Mbit/s) device interface that is Full Speed

(12Mbit/s) compliant. The USB I/O pins are capable of driving the signal at min 3.0V. The im-

pedances, serial and pull up resistors are implemented according to Universal Serial Bus Specification Revision 2.01, No further additional components are required. The external application is responsible for supplying the VUSB_IN line. This line is used for ca-

ble detection only. The USB part (driver and transceiver) is supplied by means of BATT+. This is because PLS63-X is designed as a self-powered device compliant with the Universal Serial Bus Specification Revision 2.0. Module SMT VREG (3V075) lin. reg. USB part1) VBUS DP DN Detection only RS RS BATT+

GND VUSB_IN USB_DP2) USB_DN2) 1) All serial (including RS) and pull-up resistors for data lines are implemented. 2) If the USB interface is operated in High Speed mode (480MHz), it is recommended to take special care routing the data lines USB_DP and USB_DN. Application layout should in this case implement a differential impedance of 90 ohms for proper signal integrity. Figure 2: USB circuit To properly connect the module's USB interface to the external application, a USB 2.0 compat-

ible connector and cable or hardware design is required. For more information on the USB re-

lated signals see Table 3. Furthermore, the USB modem driver distributed with PLS63-X needs to be installed. 1. The specification is ready for download on http://www.usb.org/developers/docs/

t PLS63-X_HIO_v00.860 Confidential / Preliminary 2021-02-22 Cinterion PLS63-X Hardware Interface Overview 2.1 Application Interface 31 Page 13 of 61 While a USB connection is active, the module will never switch to SLEEP mode. Only if the USB interface is in Suspend mode, the module is able to switch to SLEEP mode. 2.1.2 Serial Interface ASC0 PLS63-X offers an 8-wire unbalanced, asynchronous modem interface ASC0 conforming to ITU-T V.24 protocol DCE signaling. The electrical characteristics do not comply with ITU-T V.28. The significant levels are 0V (for low data bit or active state) and 1.8V (for high data bit or inactive state). For electrical characteristics please refer to Table 3. PLS63-X is designed for use as a DCE. Based on the conventions for DCE-DTE connections it communicates with the customer application (DTE) using the following signals:

Port TXD @ application sends data to the modules TXD0 signal line Port RXD @ application receives data from the modules RXD0 signal line Figure 3: Serial interface ASC0 Features:

Includes the data lines TXD0 and RXD0, the status lines RTS0 and CTS0 and, in addition, the modem control lines DTR0, DSR0, DCD0 and RING0. The RING0 signal serves to indicate incoming calls and other types of URCs (Unsolicited Result Code). It can also be used to send pulses to the host application, for example to wake up the application from power saving state. Configured for 8 data bits, no parity and 1 stop bit. ASC0 can be operated at fixed bit rates from 300bps up to 921600bps. Supports RTS0/CTS0 hardware flow control. The hardware hand shake line RTS0 has an internal pull down resistor causing a low level signal, if the line is not used and open. Although hardware flow control is recommended, this allows communication by using only RXD and TXD lines. Note: The ASC0 modem control lines DTR0, DCD0, DSR0 and RING0 can also be configured as GPIO lines. If configured as GPIO lines, these GPIO lines are assigned as follows:

GPIO1-->DTR0 GPIO2-->DCD0 GPIO3-->DSR0 GPIO24-->RING0 t PLS63-X_HIO_v00.860 Confidential / Preliminary 2021-02-22 Cinterion PLS63-X Hardware Interface Overview 2.1 Application Interface 31 Page 14 of 61 Configuration is done by AT command (see [1]). The configuration is non-volatile and becomes active after a module restart. Notes: No data must be sent over the ASC0 interface before the interface is active and ready to receive data (see Section 3.1.1). 2.1.3 Serial Interface ASC1 Four PLS63-X GPIO lines can be configured as ASC1 interface signals to provide a 4-wire un-

balanced, asynchronous modem interface ASC1 conforming to ITU-T V.24 protocol DCE sig-

nalling. The electrical characteristics do not comply with ITU-T V.28. The significant levels are 0V (for low data bit or active state) and 1.8V (for high data bit or inactive state). For electrical characteristics please refer to Table 3. PLS63-X is designed for use as a DCE. Based on the conventions for DCE-DTE connections it communicates with the customer application (DTE) using the following signals:

Port TXD @ application sends data to modules TXD1 signal line Port RXD @ application receives data from the modules RXD1 signal line Figure 4: Serial interface ASC1 Features Includes only the data lines TXD1 and RXD1 plus RTS1 and CTS1 for hardware hand-

shake. On ASC1 no RING line is available. Configured for 8 data bits, no parity and 1 or 2 stop bits. ASC1 can be operated at fixed bit rates from 300 bps to 921,600bps and 3Mbps Supports RTS1/CTS1 hardware flow. The hardware hand shake line RTS0 has an internal pull down resistor causing a low level signal, if the line is not used and open. Although hard-

ware flow control is recommended, this allows communication by using only RXD and TXD lines. Notes: The ASC1 interface lines are originally available as GPIO lines. If configured as ASC1 lines, the GPIO lines are assigned as follows:

GPIO16-->RXD1 GPIO17-->TXD1 GPIO18-->RTS1 GPIO19-->CTS1 Configuration is done by AT command (see [1]). The configuration is non-volatile and becomes active after a module restart. t PLS63-X_HIO_v00.860 Confidential / Preliminary 2021-02-22 Cinterion PLS63-X Hardware Interface Overview 2.1 Application Interface 31 2.1.4 UICC/SIM/USIM Interface Page 15 of 61 PLS63-X has two UICC/SIM/USIM interfaces (includes eSIM interface) compatible with the 3GPP 31.102 and ETSI 102 221. These are wired to the host interface in order to be connected to an external SIM card holder. Five pads on the SMT application interface are reserved for each of the two SIM interfaces. The UICC/SIM/USIM interface supports 3V and 1.8V SIM cards. Please refer to Table 1 for electrical specifications of the UICC/SIM/USIM interface lines depending on whether a 3V or 1.8V SIM card is used. The CCINx signal serves to detect whether a tray (with SIM card) is present in the card holder. Using the CCINx signal is mandatory for compliance with the GSM 11.11 recommendation if the mechanical design of the host application allows the user to remove the SIM card during operation. Table 1: Signals of the SIM interface (SMT application interface) Signal Description Ground connection for SIM interfaces. Optionally a separate SIM ground line using e.g., pad N11, may be used to improve EMC. Chipcard clock lines for 1st and 2nd SIM interface. SIM supply voltage lines for 1st and 2nd SIM interface. Serial data lines for 1st and 2nd SIM interface, input and output. Chipcard reset lines for 1st and 2nd SIM interface. Input on the baseband processor for detecting a SIM card tray in the holder. If the SIM is removed during operation the SIM interface is shut down immediately to prevent destruc-

tion of the SIM. The CCINx signal is active low. The CCINx signal is mandatory for applications that allow the user to remove the SIM card during operation. The CCINx signal is solely intended for use with a SIM card. It must not be used for any other purposes. Failure to comply with this requirement may invalidate the type approval of PLS63-X. Note: No guarantee can be given, nor any liability accepted, if loss of data is encountered after removing the SIM card during operation. Also, no guarantee can be given for properly initializ-

ing any SIM card that the user inserts after having removed the SIM card during operation. In this case, the application must restart PLS63-X. By default, only the modules 1st SIM interface is available and can be used. The usage of the modules 2nd SIM interface has to be configured by AT command. As an alternative to connecting the modules two SIM interfaces and switching between these via AT command, it is possible to connect the first of the modules SIM interfaces via an external SIM switch that in turn provides access to a further SIM interface. For details see Section 2.1.4.1. GND CCCLK1 CCCLK2 CCVCC1 CCVCC2 CCIO1 CCIO2 CCRST1 CCRST2 CCIN1 CCIN2 t PLS63-X_HIO_v00.860 Confidential / Preliminary 2021-02-22 Cinterion PLS63-X Hardware Interface Overview 2.1 Application Interface 31 Page 16 of 61 Module 1st SIMinterface 2nd SIMinterface SIM1 SIM2

. Figure 5: Modules two UICC/SIM/USIM interfaces Figure 6: UICC/SIM/USIM interfaces connected The total cable length between the SMT application interface pads on PLS63-X and the pads of the external SIM card holder must not exceed 100mm in order to meet the specifications of 3GPP TS 51.010-1 and to satisfy the requirements of EMC compliance. To avoid possible cross-talk from the CCCLKx signal to the CCIOx signal be careful that both lines are not placed closely next to each other. A useful approach is using the GND line to shield the CCIOx line from the CCCLKx line. t PLS63-X_HIO_v00.860 Confidential / Preliminary 2021-02-22 Cinterion PLS63-X Hardware Interface Overview 2.1 Application Interface 31 2.1.4.1 SIM_SWITCH Line Page 17 of 61 As an alternative to connecting the modules two SIM interfaces and switching between these interfaces by means of AT command, it is possible to connect the first of the modules SIM in-

terfaces via an external SIM switch that in turn provides access to a further SIM interface. Module 1st SIMinterface GPIO26/

SIM_SWITCH Switch SIM1A SIM1B Figure 7: External UICC/SIM/USIM switch The modules GPIO26 line can in this case be configured as SIM_SWITCH line in order to con-

trol the external SIM switch as shown in the sample circuit in Figure 8. A low state would then indicate the usage of the first SIM interface (SIM1A), a high state would indicate the usage of the second interface (SIM1B). The configuration of the SIM_SWITCH (GPIO26) line is done via AT command, is non-volatile, and available after the next module restart. External Application Module SIM1A ESD protection IF1 Sim Switch COMMON SIMSELECT FSA2567 ESD protection IF2 SIM1B VBAT 10k 22k 100k VSIM1 CCCLK1 CCIO1 CCRST1 SIM_ SWITCH CCIN1 Figure 8: Sample circuit for SIM interface connection via SIM switch t PLS63-X_HIO_v00.860 Confidential / Preliminary 2021-02-22 GPIO GPIO1 GPIO2 GPIO3 GPIO4 GPIO5 GPIO6 GPIO7 GPIO8 GPIO11 GPIO12 GPIO13 GPIO14 GPIO15 GPIO16 GPIO17 GPIO18 GPIO19 GPIO20 GPIO21 GPIO24 GPIO25 GPIO26 Cinterion PLS63-X Hardware Interface Overview 2.1 Application Interface 31 Page 18 of 61 2.1.5 GPIO Interface The following table shows the configuration variants for the GPIO pads. All variants are mutu-

ally exclusive, i.e. a pad configured for instance as Status LED is locked for alternative usage. Table 2: GPIO lines and possible alternative assignment Fast Shutdown Status LED ASC0 ASC1 SIM SWITCH DAI DTR0 DCD0 DSR0 FST_SHDN Status LED RXD1 TXD1 RTS1 CTS1 RING0 DOUT DIN SIM_SWITCH 2.1.6 Digital Audio Interface PLS63-X supports one digital audio interface that can be deployed as PCM. Inter_IC Sound

(I2S) interface is under development. 2.1.6.1 Pulse Code Modulation Interface PLS63-Xs PCM interface can be used to connect audio devices capable of pulse code modulation. The PCM functionality is limited to the use of wideband codec with 16kHz sample rate only. The PCM interface runs at 16kHz sample rate (62.5s frame length), while the signal processing maintains this rate in a wideband AMR call or samples automatically down t PLS63-X_HIO_v00.860 Confidential / Preliminary 2021-02-22 Cinterion PLS63-X Hardware Interface Overview 2.1 Application Interface 31 Page 19 of 61 to 8kHz in a narrowband call. Therefore, the PCM sample rate is independent of the audio bandwidth of the call. The PCM interface has the following characteristics:

Master mode Table 3 lists the available PCM interface signals. Long frame synchronization 16kHz/8kHz sample rate 512 kHz bit clock at 16kHz sample rate 256 kHz bit clock at 8kHz sample rate Table 3: Overview of PCM pin functions Signal name Signal direction master Description DOUT DIN FSC BCLK MCLK O I O O

PCM Data from PLS63-X to external codec. PCM Data from external codec to PLS63-X. Frame synchronization signal to external codec. Bit clock to external codec. Note: If the BCLK2 signal is permanently provided (AT^SAIC parameter <clk_mode> = 0), the module will no longer enter its power save (SLEEP) state. Audio master clock. Be synchronous to BCLK to use in external codec. Can be switched on and off. Note: PCM data is always formatted as 16-bit uncompressed twos complement. Also, all PCM data and frame synchronization signals are written to the PCM bus on the rising clock edge and read on the falling edge. 2.1.6.2 Inter-IC Sound Interface (TBD) The I2S Interface is a standardized bidirectio zonal I2S based digital audio interface for trans-

mission of mono voice signals for telephony services. The I2S properties and capabilities comply with the requirements lay out in the Phillips I2S Bus Specifications, revised June 5, 1996. The I2S interface has the following characteristics:

Bit clock mode: Master Sampling rate: 8kHz (narrowband), 16kHz (wideband) 256kHz bit clock at 8kHz sample rate 512kHz bit clock at 16kHz sample rate t PLS63-X_HIO_v00.860 Confidential / Preliminary 2021-02-22 Cinterion PLS63-X Hardware Interface Overview 2.1 Application Interface 31 Page 20 of 61 Table 4 lists the available I2S interface signals Table 4: Overview of I2S pin functions Signal name on SMT application interface Signal configura-

tion inactive Signal direction Master Description I2S data from PLS63-X to external codec I2S data from external codec to PLS63-X Frame synchronization signal to/

from external codec Word align-

ment (WS) Bit clock to external codec. BCLK signal low/high time varies between 45% and 55% of its clock period. DOUT DIN FSC BCLK PD PD PD PU O I O O 2.1.7 Control Signals 2.1.7.1 Status LED The GPIO5 interface line can be configured to drive a status LED that indicates different oper-

ating mode (for GPIOs see 2.1.5). GPIO and LED functionality are mutually exclusive. To take advantage of this function connect an LED to the GPIO5/STATUS line as shown in Figure 9 VCC LED R3 STATUS R1 R2 GND GND Figure 9: Status signaling with LED driver t PLS63-X_HIO_v00.860 Confidential / Preliminary 2021-02-22 Cinterion PLS63-X Hardware Interface Overview 2.1 Application Interface 31 Page 21 of 61 2.1.7.2 Power Indication The power indication signal PWR_IND notifies the on/off state of the module. High state of PWR_IND indicates that the module is switched off. The state of PWR_IND immediately changes to low when IGT is pulled low. For state detection an external pull-up resistor is re-

quired. Module Power supply On/Off

(open drain driver) e.g. BATT+

e c a f r e t n i T M S PWR_IND Figure 10: Power indication signal t PLS63-X_HIO_v00.860 Confidential / Preliminary 2021-02-22 Cinterion PLS63-X Hardware Interface Overview 2.2 RF Antenna Interface 31 2.2 RF Antenna Interface Page 22 of 61 The PLS63-X GSM/UMTS/LTE antenna interface comprises a GSM/UMTS/LTE main antenna as well as a UMTS/LTE Rx diversity antenna to improve signal reliability and quality1. The RF interface has an impedance of 50. PLS63-X is capable of sustaining a total mismatch at the antenna line without any damage, even when transmitting at maximum RF power. The external antenna must be matched properly to achieve best performance regarding radi-

ated power, modulation accuracy and harmonic suppression. Antenna matching networks are not included on the PLS63-X module and should be placed in the host application if the antenna does not have an impedance of 50. Regarding the return loss PLS63-X provides the following values in the active band:

Table 5: Return loss in the active band State of module Return loss of module Recommended return loss of application Receive Transmit

> 8dB not applicable

> 12dB

> 12dB 1. By delivery default the UMTS/LTE Rx diversity antenna is configured as available for the module since its usage is mandatory for LTE. Please refer to [1] for details on how to configure antenna settings. t PLS63-X_HIO_v00.860 Confidential / Preliminary 2021-02-22 Cinterion PLS63-X Hardware Interface Overview 2.2 RF Antenna Interface 31 2.2.1 Antenna Installation Page 23 of 61 The antenna is connected by soldering the antenna pads (ANT_MAIN, ANT_DRX and ANT_GNSS) and their neighboring ground pads directly to the applications PCB. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 K ANT_ MAIN GND GND GND E ANT_ GNSS GND P N M L J H G F D C B A GND ANT_ DRX GND Figure 11: Antenna pads (bottom view) The distance between the antenna pads and their neighboring GND pads has been optimized for best possible impedance. To prevent mismatch, special attention should be paid to these pads on the application PCB. The wiring of the antenna connection, starting from the antenna pad to the applications anten-

na should result in a 50 line impedance. Line width and distance to the GND plane need to be optimized with regard to the PCBs layer stack. Some examples are given in Section 2.2.2. To prevent receiver desensitization due to interferences generated by fast transients like high speed clocks on the external application PCB, it is recommended to realize the antenna con-

nection line using embedded Stripline rather than Micro-Stripline technology. Please see Sec-

tion 2.2.2 for examples of how to design the antenna connection in order to achieve the required 50 line impedance. For type approval purposes, the use of a 50 coaxial antenna connector (U.FL-R-SMT) might be necessary. In this case the U.FL-R-SMT connector should be placed as close as possible to PLS63-Xs antenna pad. t PLS63-X_HIO_v00.860 Confidential / Preliminary 2021-02-22 Cinterion PLS63-X Hardware Interface Overview 2.2 RF Antenna Interface 31 2.2.2 RF Line Routing Design 2.2.2.1 Line Arrangement Examples Page 24 of 61 Several dedicated tools are available to calculate line arrangements for specific applications and PCB materials - for example from http://www.polarinstruments.com/ (commercial software) or from http:www.awr.com/awr-software/options/tx-line/ (free software). Embedded Stripline This figure below shows a line arrangement example for embedded stripline with 65m FR4 prepreg (type: 1080) and 710m FR4 core (4-layer PCB). Figure 12: Embedded Stripline with 65m prepreg (1080) and 710m core t PLS63-X_HIO_v00.860 Confidential / Preliminary 2021-02-22 Cinterion PLS63-X Hardware Interface Overview 2.2 RF Antenna Interface 31 Page 25 of 61 Micro-Stripline This section gives two line arrangement examples for micro-stripline. Micro-Stripline on 1.0mm Standard FR4 2-Layer PCB The following two figures show examples with different values for D1 (ground strip separa-

tion). Application board Ground line Antenna line Ground line Figure 13: Micro-Stripline on 1.0mm standard FR4 2-layer PCB - example 1 t PLS63-X_HIO_v00.860 Confidential / Preliminary 2021-02-22 Cinterion PLS63-X Hardware Interface Overview 2.2 RF Antenna Interface 31 Page 26 of 61 Application board Ground line Antenna line Ground line Figure 14: Micro-Stripline on 1.0mm Standard FR4 PCB - example 2 t PLS63-X_HIO_v00.860 Confidential / Preliminary 2021-02-22 Cinterion PLS63-X Hardware Interface Overview 2.2 RF Antenna Interface 31 Page 27 of 61 Micro-Stripline on 1.5mm Standard FR4 2-Layer PCB The following two figures show examples with different values for D1 (ground strip separa-

tion). Application board Ground line Antenna line Ground line Figure 15: Micro-Stripline on 1.5mm Standard FR4 PCB - example 1 t PLS63-X_HIO_v00.860 Confidential / Preliminary 2021-02-22 Cinterion PLS63-X Hardware Interface Overview 2.2 RF Antenna Interface 31 Page 28 of 61 Application board Ground line Antenna line Ground line Figure 16: Micro-Stripline on 1.5mm Standard FR4 PCB - example 2 t PLS63-X_HIO_v00.860 Confidential / Preliminary 2021-02-22 Cinterion PLS63-X Hardware Interface Overview 2.2 RF Antenna Interface 31 Page 29 of 61 2.2.2.2 Routing Example Interface to RF Connector Figure 17 shows a sample connection of a modules antenna pad at the bottom layer of the module PCB with an application PCBs coaxial antenna connector. Line impedance depends on line width, but also on other PCB characteristics like dielectric, height and layer gap. The sample stripline width of 0.33mm is recommended for an application with a PCB layer stack resembling the one of the PLS63-X evaluation board shown in Figure 18. For different layer stacks the stripline width will have to be adapted accordingly. G N D G N D e.g. ANT_ MAIN Stripline (50 ohms) on top layer of evaluation board from antenna pad to module edge Width = 0.33 mm Ground connection Edge of module PCB 50 ohms microstrip line E.g., U.FL antenna connector G N D G N D Figure 17: Routing to applications RF connector Figure 18: PLS63-X evaluation board layer table t PLS63-X_HIO_v00.860 Confidential / Preliminary 2021-02-22 Cinterion PLS63-X Hardware Interface Overview 2.3 GNSS Antenna Interface 31 2.3 GNSS Antenna Interface Page 30 of 61 In addition to the RF antenna interface PLS63-X also has a GNSS antenna interface. The GNSS pads shape is the same as for the RF antenna interface (see Section 2.2.1). It is possible to connect active or passive GNSS antennas. In either case they must have 50 impedance. The simultaneous operation of GSM/UMTS/LTE and GNSS is implemented. PLS63-X provides the signal VGNSS to enable an active GNSS antenna power supply. Figure 19 shows the flexibility in realizing the power supply for an active GNSS antenna by giving a sample circuit realizing the supply voltage for an active GNSS antenna. Module Application:

GNSS Receiver Antenna Matching ANT_GNSS ANT_GNSS_DC RF DC DC LNA Active GNSS Antenna BATT+

VGNSS

(3.2V) VGNSS IN OUT EN LDO LP3985IM5-3.2 Rs Is 1R0 Rv 100

Io Current Sensor FAN4010 Io Rg 3k3 ADCx_IN Si1023X_1 10k 1u ESD Protection Si1023X_2 10k Ug Figure 19: Supply voltage for active GNSS antenna t PLS63-X_HIO_v00.860 Confidential / Preliminary 2021-02-22 Cinterion PLS63-X Hardware Interface Overview 2.3 GNSS Antenna Interface 31 Page 31 of 61 Figure 20 shows a sample circuit realizing ESD protection for a passive GNSS antenna. Con-

necting the input ANT_GNSS_DC to GND prevents ESD from coupling into the module. Module SMT interface VGNSS Not used 100nF 22p+

100n ANT_GNSS_DC 10nH ANT_GNSS To GNSS receiver

(Optional) ESD protection 0R Passive GNSS antenna Figure 20: ESD protection for passive GNSS antenna 2.3.1 GNSS Antenna Diagnostic GNSS antenna diagnosis does require an external detection circuit. The antenna DC supply current can be measured via ADCx_IN. The ADCx_IN input voltage (Ug) may be generated by a sample circuit shown in Figure 19. The circuit allows to check the presence and the connec-

tion status of an active GNSS antenna. Passive GNSS antennas cannot be detected. There-

fore, GNSS antenna detection is only available in active GNSS antenna mode. This mode is configured by the AT command: AT^SGPSC (for details see [1]) Having enabled the active GNSS antenna mode the presence and connection status of an ac-

tive GNSS antenna can be checked using the AT command AT^SRADC to monitor ADCx_IN. The following table lists sample current ranges for possible antenna states as well as sample voltage ranges as possible decision thresholds to distinguish between the antenna connection states. Please refer to [1] for more information on the command AT^SRADC. Table 6: Sample ranges of the GNSS antenna diagnostic measurements and their possible meaning Antenna connection status Antenna not connected Decision threshold Antenna connected Decision threshold Current ranges (IS)1

<1.4mA Voltage ranges (UG) 2.2mA...20mA 59mV 20%

825mV 20%

Antenna short circuited to ground

>30mA GNSS antenna detection is not possible because GNSS antenna power supply is switched off.

1. Please note that the mA ranges 1.4mA...2.2mA and 20mA...30mAare tolerance ranges. The decision threshold should be defined within these ranges. t PLS63-X_HIO_v00.860 Confidential / Preliminary 2021-02-22 Cinterion PLS63-X Hardware Interface Overview 3 Operating Characteristics 32 3 Operating Characteristics 3.1 Power Supply Page 32 of 61 PLS63-X needs to be connected to a power supply at the SMT application interface - 4 lines BATT+, and GND. There are two separate voltage domains for BATT+:

BATT+BB with two lines for the general power management. BATT+RF with two lines for the RF. Please note that throughout the document BATT+ refers to both voltage domains and power supply lines - BATT+BB and BATT+RF. The main power supply from an external application has to be a single voltage source and has to be expanded to sub paths (star structure). 150F capacitors should be placed as close as possible to the BATT+ pads. Figure 21 shows a sample circuit for decoupling capacitors for BATT+. Module SMT interface BATT+BB BATT+RF 2 2 150F low ESR capacitors BATT+

GND Figure 21: Decoupling capacitor(s) for BATT+

The power supply of PLS63-X must be able to provide the peak current during the uplink trans-

mission. All the key functions for supplying power to the device are handled by the power management section of the analog controller. This IC provides the following features:

Stabilizes the supply voltages for the baseband using low drop linear voltage regulators and DC-DC step down switching regulators. Switches the module's power voltages for the power-up and -down procedures. SIM switch to provide SIM power supply. t PLS63-X_HIO_v00.860 Confidential / Preliminary 2021-02-22 Cinterion PLS63-X Hardware Interface Overview 4 Mechanical Dimensions, Mounting and Packaging 36 Page 33 of 61 4 Mechanical Dimensions, Mounting and Packaging 4.1 Mechanical Dimensions of PLS63-X Figure 22 shows the top and bottom view of PLS63-X and provides an overview of the board's mechanical dimensions. For further details see Figure 22. t PLS63-X_HIO_v00.860 Confidential / Preliminary 2021-02-22 Cinterion PLS63-X Hardware Interface Overview 4.1 Mechanical Dimensions of PLS63-X 36 Page 34 of 61 Top view Bottom View Figure 22: PLS63-X top and bottom view for X variant t PLS63-X_HIO_v00.860 Confidential / Preliminary 2021-02-22 Cinterion PLS63-X Hardware Interface Overview 4.1 Mechanical Dimensions of PLS63-X 36 Page 35 of 61 Figure 23: Dimensions of (all dimensions in mm) Figure 24: Dimensions of PLS63-X (all dimensions in mm) t PLS63-X_HIO_v00.860 Confidential / Preliminary 2021-02-22 Cinterion PLS63-X Hardware Interface Overview 4.1 Mechanical Dimensions of PLS63-X 36 Page 36 of 61 Figure 25: Dimensions of PLS63-X (keepout area recommended) t PLS63-X_HIO_v00.860 Confidential / Preliminary 2021-02-22 Cinterion PLS63-X Hardware Interface Overview 5 Regulatory and Type Approval Information 41 Page 37 of 61 5 Regulatory and Type Approval Information 5.1 Directives and Standards PLS63-X is designed to comply with the directives and standards listed below. It is the responsibility of the application manufacturer to ensure compliance of the final product with all provisions of the applicable directives and standards as well as with the technical spec-

ifications provided in the "PLS63-X Hardware Interface Description.1 Table 7: Standards of North American type approval CFR Title 47 Code of Federal Regulations, Part 22, Part 24; US Equipment Authorization FCC OET Bulletin 65

(Edition 97-01) Evaluating Compliance with FCC Guidelines for Human Exposure to Radiofrequency Electromagnetic Fields UL 60 950-1 Product Safety Certification (Safety requirements) NAPRD.03 V6.1 Overview of PCS Type certification review board Mobile Equipment Type Certification and IMEI control PCS Type Certification Review board (PTCRB) RSS132 (Issue2) RSS133 (Issue5) Canadian Standard Table 8: Requirements of quality IEC 60068 Environmental testing DIN EN 60529 IP codes EN 62311:2008 Assessment of electronic and electrical equipment related to human expo-

sure restrictions for electromagnetic fields (0 Hz - 300 GHz) 1. Manufacturers of applications which can be used in the US shall ensure that their applications have a PTCRB approval. For this purpose they can refer to the PTCRB approval of the respective module. t PLS63-X_HIO_v00.860 Confidential / Preliminary 2021-02-22 Cinterion PLS63-X Hardware Interface Overview 5.2 SAR requirements specific to portable mobiles 41 Page 38 of 61 5.2 SAR requirements specific to portable mobiles Mobile phones, PDAs or other portable transmitters and receivers incorporating a GSM/UMTS module must be in accordance with the guidelines for human exposure to radio frequency en-

ergy. This requires the Specific Absorption Rate (SAR) of portable PLS63-X based applications to be evaluated and approved for compliance with national and/or international regulations. Since the SAR value varies significantly with the individual product design manufacturers are advised to submit their product for approval if designed for portable use. For European/US/Aus-

tralian-markets the relevant directives are mentioned below. It is the responsibility of the man-

ufacturer of the final product to verify whether or not further standards, recommendations or directives are in force outside these areas. Products intended for sale on US markets ES 59005/ANSI C95.1 Considerations for evaluation of human exposure to Electromagnetic Fields (EMFs) from Mobile Telecommunication Equipment (MTE) in the frequency range 30MHz - 6GHz Please note that SAR requirements are specific only for portable devices and not for mobile devices as defined below:

Portable device:

A portable device is defined as a transmitting device designed to be used so that the radi-

ating structure(s) of the device is/are within 20 centimeters of the body of the user. Mobile device:

A mobile device is defined as a transmitting device designed to be used in other than fixed locations and to generally be used in such a way that a separation distance of at least 20 centimeters is normally maintained between the transmitter's radiating structure(s) and the body of the user or nearby persons. In this context, the term ''fixed location'' means that the device is physically secured at one location and is not able to be easily moved to another location. t PLS63-X_HIO_v00.860 Confidential / Preliminary 2021-02-22 Cinterion PLS63-X Hardware Interface Overview 5.3 Reference Equipment for Type Approval 41 Page 39 of 61 5.3 Reference Equipment for Type Approval The Thales reference setup submitted to type approve PLS63-X (including a special approval adapter for the DSB75) is shown in the following figure1:

LTE/GPRS/UMTS BaseStation Diversity Antenna Main Antenna USB ASC0 PC Power Supply AH6Adapter SIMCard SMA SMA SMA USB DSB75 Eval_Board Eval_Board PLSx3 PLSx3 Figure 26: Reference equipment for Type Approval 1. For RF performance tests a mini-SMT/U.FL to SMA adapter with attached 6dB coaxial attenuator is cho-

sen to connect the evaluation module directly to the GSM/UMTS test equipment instead of employing the SMA antenna connectors on the PLS63-X-DSB75 adapter as shown in Figure 26. The following prod-

ucts are recommended:

Hirose SMA-Jack/U.FL-Plug conversion adapter HRMJ-U.FLP(40)

(for details see http://www.hirose-connectors.com/ or http://www.farnell.com/

Aeroflex Weinschel Fixed Coaxial Attenuator Model 3T/4T

(for details see http://www.aeroflex.com/ams/weinschel/pdfiles/wmod3&4T.pdf) t PLS63-X_HIO_v00.860 Confidential / Preliminary 2021-02-22 Cinterion PLS63-X Hardware Interface Overview 5.4 Compliance with FCC/IC/ISED Rules and Regulations 41 Page 40 of 61 5.4 Compliance with FCC/IC/ISED Rules and Regulations The Equipment Authorization Certification for the Thales reference application described in Section 5.3 will be registered under the following identifiers:

FCC Identifier: QIPPLS63-X ISED Certification Number: 7830A-PLS63X Granted to THALES DIS AIS Deutschland GmbH Manufacturers of mobile or fixed devices incorporating PLS63-X modules are authorized to use the FCC Grants and ISED Certificates of the PLS63-X modules for their own final products ac-

cording to the conditions referenced in these documents. In this case, an FCC/IC label of the module shall be visible from the outside, or the host device shall bear a second label stating

"Contains FCC ID: QIPPLS63-X, and accordingly Contains IC: 7830A-PLS63X. The integra-

tion is limited to fixed or mobile categorized host devices, where a separation distance between the antenna and any person of min. 20cm can be assured during normal operating conditions. For moble and fixed operation configurations the antenna gain, including cable loss, must not exceed the limits listed in the following Table 10 for FCC and ISED Table 10: Antenna gain limits for FCC and ISED Operation band FCC limit ISED limit Unit Maximum gain in WCDMA Band 2 Maximum gain in WCDMA Band 4 Maximum gain in WCDMA Band 5 Maximum gain in LTE Band 2 Maximum gain in LTE Band 4 Maximum gain in LTE Band 5 Maximum gain in LTE Band 12 Maximum gain in LTE Band 13 Maximum gain in LTE Band 14 Maximum gain in LTE Band 25 Maximum gain in LTE Band 26 Maximum gain in LTE Band 66 Maximum gain in LTE Band 71 8.01 5.00 9.40 8.01 5.00 9.40 8.70 9.16 9.23 8.01 9.30 5.00 8.48 8.01 5.00 6.10 8.01 5.00 6.10 5.61 5.93 N.A. 8.01 6.10 5.00 5.45 dBi dBi dBi dBi dBi dBi dBi dBi dBi dBi dBi dBi dBi IMPORTANT:

Manufacturers of portable applications incorporating PLS63-X modules are required to have their final product certified and apply for their own FCC Grant related to the specific portable mobile. This is mandatory to meet the SAR requirements for portable mobiles (see Section 5.2 for detail). Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. Note: This equipment has been tested and found to comply with the limits for a Class B digital t PLS63-X_HIO_v00.860 Confidential / Preliminary 2021-02-22 Cinterion PLS63-X Hardware Interface Overview 5.4 Compliance with FCC/IC/ISED Rules and Regulations 41 Page 41 of 61 device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

Reorient or relocate the receiving antenna. Connect the equipment into an outlet on a circuit different from that to which the receiver is Increase the separation between the equipment and receiver. connected. Consult the dealer or an experienced radio/TV technician for help. This Class B digital apparatus complies with Canadian ICES-003. FCC Part 15.19 Warning Statement THIS DEVICE COMPLIES WITH PART 15 OF THE FCC RULES. OPERATION IS SUBJECT TO THE FOLLOWING TWO CONDITIONS: (1) THIS DEVICE MAY NOT CAUSE HARMFUL INTERFERENCE, AND (2) THIS DEVICE MUST ACCEPT ANY INTERFERENCE RECEIVED, INCLUDING INTERFER-

ENCE THAT MAY CAUSE UNDESIRED OPERATION. If Canadian approval is requested for devices incorporating PLS63-X modules the below notes will have to be provided in the English and French language in the final user documentation. Manufacturers/OEM Integrators must ensure that the final user documentation does not con-

tain any information on how to install or remove the module from the final product. Notes (IC):

(EN) This Class B digital apparatus complies with Canadian ICES-003 and RSS-210. Opera-

tion is subject to the following two conditions: (1) this device may not cause interference, and

(2) this device must accept any interference, including interference that may cause undesired operation of the device.

(FR) Cet appareil numrique de classe B est conforme aux normes canadiennes ICES-003 et RSS-210. Son fonctionnement est soumis aux deux conditions suivantes: (1) cet appareil ne doit pas causer d'interfrence et (2) cet appareil doit accepter toute interfrence, notamment les interfrences qui peuvent affecter son fonctionnement.

(EN) Radio frequency (RF) Exposure Information The radiated output power of the Wireless Device is below the Industry Canada (IC) radio fre-

quency exposure limits. The Wireless Device should be used in such a manner such that the potential for human contact during normal operation is minimized. This device has also been evaluated and shown compliant with the IC RF Exposure limits un-

der mobile exposure conditions. (antennas at least 20cm from a persons body).

(FR) Informations concernant l'exposltion aux frquences radio (RF) La puissance de sortie mise par l'appareil de sans fiI est infrieure la limite d'exposition aux frquences radio dIndustry Canada (IC). Utilisez l'appareil de sans fil de faon minimiser les contacts humains lors du fonctionnement normal. Ce priphrique a galement t valu et dmontr conforme aux limites d'exposition aux RF d'IC dans des conditions d'exposition des appareils mobiles (les antennes se situent moins de 20cm du corps d'une personne). t PLS63-X_HIO_v00.860 Confidential / Preliminary 2021-02-22 Cinterion PLS63-X Hardware Interface Overview 6 Document Information 47 6 Document Information Page 43 of 61 New document: "Cinterion PLS63-X Hardware Interface Overview" Version 00.860 6.1 Revision History Chapter What is new

Initial document setup. 6.2 Related Documents

[1] PLS63-X AT Command Set

[2] PLS63-X Release Note

[3] Universal Serial Bus Specification Revision 2.0, April 27, 2000

[4] Application Note 48: SMT Module Integration

[5] Differences between Selected Cinterion Modules, Hardware Migration Guide ASC0/ASC1 Asynchronous Controller. Abbreviations used for first and second serial interface of PLS63-X 6.3 Terms and Abbreviations Abbreviation Description Analog-to-digital converter Automatic Gain Control American National Standards Institute ARFCN Absolute Radio Frequency Channel Number ARP Antenna Reference Point CB or CBM Cell Broadcast Message Conformit Europene (European Conformity) Challenge Handshake Authentication Protocol Thermistor Constant Bit Error Rate Bearer Independent Protocol Base Transceiver Station Central Processing Unit Coding Scheme Circuit Switched Data Clear to Send Digital-to-Analog Converter ADC AGC ANSI B BER BIP BTS CE CHAP CPU CS CSD CTS DAC dBm0 Digital level, 3.14dBm0 corresponds to full scale, see ITU G.711, A-law t PLS63-X_HIO_v00.860 Confidential / Preliminary 2021-02-22 Cinterion PLS63-X Hardware Interface Overview 6.3 Terms and Abbreviations 47 Page 44 of 61 Abbreviation Description Data Communication Equipment (typically modems, e.g. Thales module) DCE DRX DSB DSP DSR DTR DTX EFR EIRP EMC ERP ESD ETS ETSI FCC FDMA FR GMSK GPIO HiZ HR I/O IC IMEI ISO ITU kbps LED LPM Mbps MMI MO MS Discontinuous Reception Development Support Box Digital Signal Processor Data Set Ready Data Terminal Ready Discontinuous Transmission Enhanced Full Rate Equivalent Isotropic Radiated Power Electromagnetic Compatibility Effective Radiated Power Electrostatic Discharge European Telecommunication Standard European Telecommunication Standards Institute Federal Communications Commission (U.S.) Frequency Division Multiple Access Full Rate Gaussian Minimum Shift Keying General Purpose Input/Output High Impedance Half Rate Input/Output Integrated Circuit International Mobile Equipment Identity International Standards Organization International Telecommunications Union kbits per second Light Emitting Diode Lithium-Ion Link Power Management Mbits per second Man Machine Interface Mobile Originated Li-Ion/Li+

Li battery Rechargeable Lithium Ion or Lithium Polymer battery Mobile Station ( module), also referred to as TE MSISDN Mobile Station International ISDN number MT Mobile Terminated t PLS63-X_HIO_v00.860 Confidential / Preliminary 2021-02-22 Cinterion PLS63-X Hardware Interface Overview 6.3 Terms and Abbreviations 47 Page 45 of 61 Abbreviation Description Negative Temperature Coefficient Original Equipment Manufacturer Power Amplifier Password Authentication Protocol PBCCH Packet Switched Broadcast Control Channel Radio and Telecommunication Terminal Equipment Restriction of the use of certain hazardous substances in electrical and electronic equipment. NTC OEM PA PAP PCB PCL PDU PLL PPP PSK PSU PWM R&TTE RAM RF RLS RMS RoHS ROM RTC RTS Rx SAR SAW SELV SIM SMD SMS SMT SPI SRAM TA TDMA TE TLS Tx Printed Circuit Board Power Control Level Protocol Data Unit Phase Locked Loop Point-to-point protocol Phase Shift Keying Power Supply Unit Pulse Width Modulation Random Access Memory Radio Frequency Radio Link Stability Root Mean Square (value) Read-only Memory Real Time Clock Request to Send Receive Direction Specific Absorption Rate Surface Accoustic Wave Safety Extra Low Voltage Subscriber Identification Module Surface Mount Device Short Message Service Surface Mount Technology Serial Peripheral Interface Static Random Access Memory Terminal adapter (e.g. module) Time Division Multiple Access Terminal Equipment, also referred to as DTE Transport Layer Security Transmit Direction t PLS63-X_HIO_v00.860 Confidential / Preliminary 2021-02-22 Cinterion PLS63-X Hardware Interface Overview 6.3 Terms and Abbreviations 47 Page 46 of 61 Abbreviation Description UART URC USSD VSWR Universal asynchronous receiver-transmitter Unsolicited Result Code Unstructured Supplementary Service Data Voltage Standing Wave Ratio t PLS63-X_HIO_v00.860 Confidential / Preliminary 2021-02-22 Cinterion PLS63-X Hardware Interface Overview 6.4 Safety Precaution Notes 47 6.4 Safety Precaution Notes Page 47 of 61 The following safety precautions must be observed during all phases of the operation, usage, service or repair of any cellular terminal or mobile incorporating PLS63-X. Manufacturers of the cellular terminal are advised to convey the following safety information to users and operating personnel and to incorporate these guidelines into all manuals supplied with the product. Fail-

ure to comply with these precautions violates safety standards of design, manufacture and in-

tended use of the product. Thales assumes no liability for customers failure to comply with these precautions. When in a hospital or other health care facility, observe the restrictions on the use of mobiles. Switch the cellular terminal or mobile off, if instructed to do so by the guide-

lines posted in sensitive areas. Medical equipment may be sensitive to RF energy. The operation of cardiac pacemakers, other implanted medical equipment and hear-

ing aids can be affected by interference from cellular terminals or mobiles placed close to the device. If in doubt about potential danger, contact the physician or the manufac-

turer of the device to verify that the equipment is properly shielded. Pacemaker patients are advised to keep their hand-held mobile away from the pacemaker, while it is on. Switch off the cellular terminal or mobile before boarding an aircraft. Make sure it can-

not be switched on inadvertently. The operation of wireless appliances in an aircraft is forbidden to prevent interference with communications systems. Failure to observe these instructions may lead to the suspension or denial of cellular services to the offender, legal action, or both. Do not operate the cellular terminal or mobile in the presence of flammable gases or fumes. Switch off the cellular terminal when you are near petrol stations, fuel depots, chemical plants or where blasting operations are in progress. Operation of any elec-

trical equipment in potentially explosive atmospheres can constitute a safety hazard. Your cellular terminal or mobile receives and transmits radio frequency energy while switched on. Remember that interference can occur if it is used close to TV sets, radios, computers or inadequately shielded equipment. Follow any special regulations and always switch off the cellular terminal or mobile wherever forbidden, or when you suspect that it may cause interference or danger. Road safety comes first! Do not use a hand-held cellular terminal or mobile when driv-

ing a vehicle, unless it is securely mounted in a holder for speakerphone operation. Before making a call with a hand-held terminal or mobile, park the vehicle. Speakerphones must be installed by qualified personnel. Faulty installation or opera-

tion can constitute a safety hazard. IMPORTANT!

Cellular terminals or mobiles operate using radio signals and cellular networks. Because of this, connection cannot be guaranteed at all times under all conditions. Therefore, you should never rely solely upon any wireless device for essential com-

munications, for example emergency calls. Remember, in order to make or receive calls, the cellular terminal or mobile must be switched on and in a service area with adequate cellular signal strength. Some networks do not allow for emergency calls if certain network services or phone features are in use (e.g. lock functions, fixed dialing etc.). You may need to deactivate those features before you can make an emergency call. Some networks require that a valid SIM card be properly inserted in the cellular termi-

nal or mobile. t PLS63-X_HIO_v00.860 Confidential / Preliminary 2021-02-22 Cinterion PLS63-X Hardware Interface Overview 7 Appendix 49 Page 48 of 61 7 Appendix 7.1 List of Parts and Accessories Table 11: List of parts and accessories Description PLS63-X Supplier Ordering information Thales Thales Thales Thales Standard module Thales IMEI:

Packaging unit (ordering) number: L30960-N6500-A100 Module label number: S30960-S6500-A100-11 PLS63-X Evaluation Module Thales Ordering number: L30960-N6501-A100 DSB-mini Ordering number: L30960-N0030-A100 DSB75 Evaluation Kit Ordering number: L36880-N8811-A100 Ordering number: L30960-N0100-A100 EVAL DSB Adapter for mounting PLSx3 evaluation modules onto DSB75 LGA DevKit Thales LGA DevKit consists of Cinterion LGA DevKit L Base PCB:

Ordering number: L30960-N0112-A100 Cinterion LGA DevKit Socket SML:

Ordering number: L30960-N0110-A100 1. Note: At the discretion of Thales, module label information can either be laser engraved on the modules shielding or be printed on a label adhered to the modules shielding. t PLS63-X_HIO_v00.860 Confidential / Preliminary 2021-02-22 Cinterion PLS63-X Hardware Interface Overview 7.1 List of Parts and Accessories 49 Page 49 of 61 Table 12: Molex sales contacts (subject to change) Molex For further information please click:

http://www.molex.com Molex China Distributors Beijing, Room 1311, Tower B, COFCO Plaza No. 8, Jian Guo Men Nei Street, 100005 Beijing P.R. China Phone: +86-10-6526-9628 Fax: +86-10-6526-9730 Molex Deutschland GmbH Otto-Hahn-Str. 1b 69190 Walldorf Germany Phone: +49-6227-3091-0 Fax: +49-6227-3091-8100 Email: mxgermany@molex.com Molex Singapore Pte. Ltd. 110, International Road Jurong Town, Singapore 629174 American Headquarters Lisle, Illinois 60532 U.S.A. Phone: +1-800-78MOLEX Fax: +1-630-969-1352 Molex Japan Co. Ltd. 1-5-4 Fukami-Higashi, Yamato-City, Kanagawa, 242-8585 Japan Phone: +65-6-268-6868 Fax: +65-6-265-6044 Phone: +81-46-265-2325 Fax: +81-46-265-2365 t PLS63-X_HIO_v00.860 Confidential / Preliminary 2021-02-22 50 THALES DIS AIS Deutschland GmbH Werinherstrasse 81 81541 Munich Germany i

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Telit Cinterion Deutschland GmbH Siemensdamm 50 13629 Berlin - Germany Telit Cinterion Deutschland GmbH Federal Communications Commission Equipment Authorization Division, Application Processing Branch 7435 Oakland Mills Road Columbia MD 21046 USA Siemensdamm 50 13629 Berlin Germany Contact person: Leandro Wan-Dall Office Phone: +49 30 166355178 Email Address: leandro.wan-dall@telit.com August 7, 2023 Ref: Attestation Statements Part 2.911(d)(5)(i) Filing FCC ID Number Product QIPPLS63-X Title/Model PLS63-X Telit Cinterion Deutschland GmbH (the applicant) certifies that the equipment for which authorization is sought is not covered equipment prohibited from receiving an equipment authorization pursuant to section 2.903 of the FCC rules. Sincerely, X Leandro Wan-Dall Head of Certification Management Telit Cinterion Deutschland GmbH Registered Office: Mnchen - Amtsgericht Mnchen, HRB 172715 WEEE-Reg.-Nr. DE 58893809 Managing Directors: Christoph Caselitz, Eyal Shefer telit.com/contact-us

Telit Cinterion Deutschland GmbH Siemensdamm 50 13629 Berlin - Germany Federal Communications Commission Equipment Authorization Division, Application Processing Branch Mills Road 7435 Oakland Columbia MD 21046 USA Telit Cinterion Deutschland GmbH Siemensdamm 50 13629 Berlin Germany Contact person: Leandro Wan-Dall Office Phone: +49 30 166355178 Email Address: leandro.wan-dall@telit.com August 29, 2023 Ref: Attestation Statements Part 2.911(d)(5)(ii) Filing FCC ID Number Product QIPPLS63-X Title/Model PLS63-X Telit Cinterion Deutschland GmbH (the applicant) certifies that, as of the date of the filing of the application, the applicant is not identified on the Covered List (as a specifically named entity or any of its subsidiaries or affiliates) as an entity producing covered equipment. Best regards. Telit Cinterion Deutschland GmbH X Leandro Wan-Dall Head of Certification Management Telit Cinterion Deutschland GmbH Registered Office: Mnchen - Amtsgericht Mnchen, HRB 172715 WEEE-Reg.-Nr. DE 58893809 Managing Directors: Eyal Shefer, Jrg Erdmann telit.com/contact-us

Telit Cinterion Deutschland GmbH Siemensdamm 50 13629 Berlin - Germany Federal Communications Commission Equipment Authorization Division, Application Processing Branch Mills Road 7435 Oakland Columbia MD 21046 USA Telit Cinterion Deutschland GmbH Siemensdamm 50 13629 Berlin Germany Contact person: Leandro Wan-Dall Office Phone: +49 30 166355178 Email Address: leandro.wan-dall@telit.com August 14, 2023 Request for a Class II Permissive Change Dear Madam or Sir, This is to request a Class II permission change to the following product:

FCC ID Number Product QIPPLS63-X Title/Model PLS63-X This request is to add eSIM variant, which the only change is that add one eSIM component on the PCB and update the FW with eSIM function. Telit Cinterion Deutschland GmbH attests there is no changes to the transmitter, modulation or filtering circuitry or any circuitry that may adversely affect PLS63-X device output and EMC compliance has occurred. For detailed software update, please refer to documents:

plsx3_rev01200_to_rev01202_delta_v01 plsx3_rev01202_to_rev02100_delta_v01 plsx3_rev02100_to_rev02110_delta_v01 In addition, due to the change of the applicant's company name, we intend to update the new company information to the report. Telit Cinterion Deutschland GmbH Registered Office: Mnchen - Amtsgericht Mnchen, HRB 172715 WEEE-Reg.-Nr. DE 58893809 Managing Directors: Christoph Caselitz, Eyal Shefer telit.com/contact-us If you have any questions, please feel free to contact us at the address shown above. Best regards. Telit Cinterion Deutschland GmbH X Leandro Wan-Dall Head of Certification Management Telit Cinterion Deutschland GmbH Registered Office: Mnchen - Amtsgericht Mnchen, HRB 172715 WEEE-Reg.-Nr. DE 58893809 Managing Directors: Christoph Caselitz, Eyal Shefer telit.com/contact-us

Telit Cinterion Deutschland GmbH Siemensdamm 50 13629 Berlin - Germany Telit Cinterion Deutschland GmbH Federal Communications Commission Equipment Authorization Division, Application Processing Branch 7435 Oakland Mills Road Columbia MD 21046 USA Siemensdamm 50 13629 Berlin Germany Contact person: Leandro Wan-Dall Office Phone: +49 30 166355178 Email Address: leandro.wan-dall@telit.com August 7, 2023 LONG-TERM CONFIDENTIALITY REQUEST Pursuant to Paragraphs 0.457 and 0.459 of the Commissions Rules (47 C.F.R.) and Section 552(b)(4) of the Freedom of Information Act, Telit Cinterion Deutschland GmbH requests confidentiality for the following product:

FCC ID Number Product QIPPLS63-X Title/Model PLS63-X For the product stated above, we request that the following information be held confidential:

1. Operational Description These items contain detailed system and equipment description and related information about the product which Telit Cinterion Deutschland GmbH considers to be proprietary, confidential and a custom design which otherwise would only be released to qualified tech and is not released to the general public. Since this design is a basis from which future technological product will evolve, Telit Cinterion Deutschland GmbH also feels that this information would be of benefit to its competitors, and that the disclosure of the information in these exhibits would give our competitors an unfair advantage in the market. Sincerely, X Leandro Wan-Dall Head of Certification Management Telit Cinterion Deutschland GmbH Registered Office: Mnchen - Amtsgericht Mnchen, HRB 172715 WEEE-Reg.-Nr. DE 58893809 Managing Directors: Christoph Caselitz, Eyal Shefer telit.com/contact-us

Telit Cinterion Deutschland GmbH Siemensdamm 50 13629 Berlin - Germany Telit Cinterion Deutschland GmbH Federal Communications Commission Equipment Authorization Division, Application Processing Branch 7435 Oakland Mills Road Columbia MD 21046 USA Siemensdamm 50 13629 Berlin Germany Contact person: Leandro Wan-Dall Office Phone: +49 30 166355178 Email Address: leandro.wan-dall@telit.com August 7, 2023 Ref: Agent letter for FCC ID: QIPPLS63-X We, hereby authorize Telit Cinterion Deutschland GmbH Siemensdamm 50 13629 Berlin Germany Shenzhen UnionTrust Quality and Technology Co., Ltd. Add: Unit D/E of 9/F and 16/F, Block A, Building 6, Baoneng science and technology park, Longhua New District, Shenzhen, China Billy Li Tel: +86-755-28230888 to act as our agent in the preparation of this application for equipment certification, including the signing of all documents relating to these matters. The present authorization considers the development of documents on behalf of the client, written under his own letterhead and related to the necessary information to be provided on his behalf to complete the certification process. We declare that our authorized agent is allowed to forward all information related to the approval and certification of equipment to the regulatory agencies as required and to discuss any issues concerning the approval application. Any and all acts carried out by our authorized agent on our behalf shall have the same effect as acts of our own. Telit Cinterion Deutschland GmbH Registered Office: Mnchen - Amtsgericht Mnchen, HRB 172715 WEEE-Reg.-Nr. DE 58893809 Managing Directors: Christoph Caselitz, Eyal Shefer telit.com/contact-us This agreement expires one year from the current date. Sincerely, X Leandro Wan-Dall Head of Certification Management Telit Cinterion Deutschland GmbH Registered Office: Mnchen - Amtsgericht Mnchen, HRB 172715 WEEE-Reg.-Nr. DE 58893809 Managing Directors: Christoph Caselitz, Eyal Shefer telit.com/contact-us

Federal Communications Commission Equipment Authorization Division, Application Processing Branch Mills Road 7435 Oakland Columbia MD 21046 USA Telit Cinterion Deutschland GmbH Siemensdamm 50 13629 Berlin Germany Berlin, 2023.08.16 U.S. AGENT FOR SERVICE OF PROCESS - LETTER OF ATTESTATION U.S. Designated Agent:

Company Name:

Mobilogix Inc. FRN:

0025512666 Contact Name:

Ramy Mourad, R&D Director Company Address:

5500 Trabuco Rd Suite 150 - Irvine CA - United States Telephone No.:

+1 949 540 1276 E-mail:

ramy.mourad@telit.com This letter is to confirm that we designate the above U.S. representative as agent for service of process for Telit Cinterion Deutschland GmbH as noted below, for all the future FCC submissions. Telit Cinterion Deutschland GmbH and Mobilogix Inc. are companies belonging to the same group Telit IoT Solutions Holding LTD. The applicant accepts and acknowledges the obligation to maintain an agent for no less than one year after the grantee has terminated all marketing and importation or the conclusion of any Commission-related proceeding involving the equipment. The agent is not affiliated with a test lab or TCB. Applicant:

Company Name:

Grantee Code:

FRN:

Company Address:

Contact Name:

Telephone No.:

E-mail:

Telit Cinterion Deutschland GmbH QIP 0007412448 Siemensdamm 50, Berlin 13629, Germany Leandro Wan-Dall

+49 30 166355178 leandro.wan-dall@telit.com Best Regards, ___________________________ Leandro Wan-Dall _______________________ Ramy Mourad Telit Cinterion Deutschland GmbH Registered Office: Mnchen - Amtsgericht Mnchen, HRB 172715 WEEE-Reg.-Nr. DE 58893809 Managing Directors: Eyal Shefer, Jrg Erdmann DocuSign Envelope ID: 358D879A-301D-47CC-BF5C-819911B3BEA3

THALES DIS AIS Deutschland GmbH Siemensdamm 50 13629 Berlin Germany Federal Communications Commission Equipment Authorization Division, Application Processing Branch 7435 Oakland Mills Road Columbia MD 21046 USA THALES DIS AIS Deutschland GmbH Siemensdamm 50 13629 Berlin Germany Contact person: Axel Heike E-mail: axel.heike@thalesgroup.com Tel: +49 30 31102-8146 04 November 2020 Ref: Agent letter for FCC ID: QIPPLS63-X We, THALES DIS AIS Deutschland GmbH Siemensdamm 50 13629 Berlin Germany hereby authorize Shenzhen UnionTrust Quality and Technology Co., Ltd. Add: 161F, Block A, Building 6, Baoneng Science and Technology Park, Qingxiang Road No.1, Longhua New District, Shenzhen, China Billy Li Tel: +86-755-28230888 to act as our agent in the preparation of this application for equipment certification, including the sign-

ing of all documents relating to these matters. The present authorization considers the development of documents on behalf of the client, written un-

der his own letterhead and related to the necessary information to be provided on his behalf to com-

plete the certification process. We declare that our authorized agent is allowed to forward all information related to the approval and certification of equipment to the regulatory agencies as required and to discuss any issues concerning the approval application. Any and all acts carried out by our authorized agent on our behalf shall have the same effect as acts of our own. This agreement expires one year from the current date. Sincerely, 14.01.2021 14/01/2021 X HEIKE Axel Certification Project Manager Signed by: HEIKE Axel THALES DIS AIS Deutschland GmbH Registered Office: M nchen - Amtsgericht M nchen, HRB 172715 WEEE-Reg.-Nr. DE 58893809 Managing Director: Andreas Haegele X Leandro Wan-Dall Head of Certification Management Signed by: WAN-DALL Leandro

THALES DIS AIS Deutschland GmbH Siemensdamm 50 13629 Berlin Germany Federal Communications Commission Equipment Authorization Division, Application Processing Branch 7435 Oakland Mills Road Columbia MD 21046 USA THALES DIS AIS Deutschland GmbH Siemensdamm 50 13629 Berlin Germany Contact person: Axel Heike E-mail: axel.heike@thalesgroup.com Tel: +49 30 31102-8146 04 November 2020 LONG-TERM CONFIDENTIALITY REQUEST TO WHOM lT MAY CONCERN Pursuant to Paragraphs 0.457 and 0.459 of the Commissions Rules (47 C.F.R.) and Section 552(b)(4) of the Freedom of Information Act, THALES DIS AIS Deutschland GmbH requests confi-

dentiality for the following product:

FCC ID Number Product Title/Model QIPPLS63-X PLS63-X For the product stated above, we request that the following information be held confidential:

1. Block Diagram 2. Schematic Diagram 3. Part List / Tune Up Procedure 4. Operational Description These items contain detailed system and equipment description and related information about the product which THALES DIS AIS Deutschland GmbH considers to be proprietary, confidential and a custom design which otherwise would only be released to qualified tech and is not released to the general public. Since this design is a basis from which future technological product will evolve, THA-

LES DIS AIS Deutschland GmbH also feels that this information would be of benefit to its competitors, and that the disclosure of the information in these exhibits would give our competitors an unfair ad-

vantage in the market. Sincerely, X HEIKE Axel Certification Project Manager Signed by: HEIKE Axel 14.01.2021 14/01/2021 X Leandro Wan-Dall Head of Certification Management Signed by: WAN-DALL Leandro THALES DIS AIS Deutschland GmbH Registered Office: M nchen - Amtsgericht M nchen, HRB 172715 WEEE-Reg.-Nr. DE 58893809 Managing Director: Andreas Haegele

THALES DIS AIS Deutschland GmbH Siemensdamm 50 13629 Berlin Germany Federal Communications Commission Equipment Authorization Division, Application Processing Branch 7435 Oakland Mills Road Columbia MD 21046 USA THALES DIS AIS Deutschland GmbH Siemensdamm 50 13629 Berlin Germany Contact person: Axel Heike E-mail: axel.heike@thalesgroup.com Tel: +49 30 31102-8146 04 November 2020 Ref: FCC Modular approval letter for FCC ID: QIPPLS63-X TO WHOM lT MAY CONCERN The following attestation addresses the requirements to support modular approval pursuant to 15.212 of the Commissions Rules:

Modular approval requirement

(i) The radio elements of the modular transmitter must have their own shielding. The physical crystal and tuning capacitors may be located external to the shielded radio elements.

(ii) The modular transmitter must have buffered modulation/data inputs (if such in-

puts are provided) to ensure that the module will comply with part 15 requirements under conditions of excessive data rates or over-modulation.

(iii) The modular transmitter must have its own power supply regulation.

(iv) The modular transmitter must comply with the antenna and transmission system requirements of 1 5.203, 1 5.204(b) and 15.204(c). The antenna must either be permanently attached or employ a unique antenna coupler (at all connections be-

tween the module and the antenna, including the cable). The professional installa-

tion provision of 1 5.203 is not applicable to modules but can apply to limited mod-

ular approvals under paragraph (b) of this section.

(v) The modular transmitter must be tested in a stand-alone configuration, i.e., the module must not be inside another device during testing for compliance with part 15 requirements. Unless the transmitter module will be battery powered, it must comply with the AC line conducted requirements found in 1 5.207. AC or DC power lines and data input/output lines connected to the module must not contain ferrites, unless they will be marketed with the module (see 15.27(a)). The length of these lines shall be the length typical of actual use or, if that length is unknown, at least 10 cen-

timeters to insure that there is no coupling between the case of the module and sup-

porting equipment. Any accessories, peripherals, or support equipment connected to Yes No*

X X X X X THALES DIS AIS Deutschland GmbH Registered Office: M nchen - Amtsgericht M nchen, HRB 172715 WEEE-Reg.-Nr. DE 58893809 Managing Director: Andreas Haegele the module during testing shall be unmodified and commercially available (see 15.31(i)).

(vi) The modular transmitter must be equipped with either a permanently affixed la-

bel or must be capable of electronically displaying its FCC identification number.

(vii) The modular transmitter must comply with any specific rules or operating re-

quirements that ordinarily apply to a complete transmitter and the manufacturer must provide adequate instructions along with the module to explain any such re-

quirements. A copy of these instructions must be included in the application for equipment authorization.

(viii) The modular transmitter must comply with any applicable RF exposure require-

ments in its final configuration.

* Shall provide a detailed explanation if the answer is No. If you have any questions, please feel free to contact us at the address shown above. X X X Sincerely, X HEIKE Axel Certification Project Manager Signed by: HEIKE Axel 14.01.2021 14/01/2021 X Leandro Wan-Dall Head of Certification Management Signed by: WAN-DALL Leandro

THALES DIS AIS Deutschland GmbH Siemensdamm 50 13629 Berlin Germany Federal Communications Commission Equipment Authorization Division, Application Processing Branch 7435 Oakland Mills Road Columbia MD 21046 USA THALES DIS AIS Deutschland GmbH Siemensdamm 50 13629 Berlin Germany Contact person: Axel Heike E-mail: axel.heike@thalesgroup.com Tel: +49 30 31102-8146 05 November 2020 SHORT-TERM CONFIDENTIALITY REQUEST TO WHOM IT MAY CONCERN Pursuant to Paragraphs 0.457 and 0.459 of the Commissions Rules (47 C.F.R.) and Section 552(b)(4) of the Freedom of Information Act, THALES DIS AIS Deutschland GmbH requests confi-

dentiality for the following product:

For the product stated above, we request that the following information be held confidential:

FCC ID Number Product Title/Model QIPPLS63-X PLS63-X 1. External and Internal Photographs 2. Test Setup Photos 3. User Manual THALES DIS AIS Deutschland GmbH requests this confidentiality on the basis of ensuring that busi-

ness sensitive information remains confidential until the actual marketing of our new device, which is planned tor 30th of April 2021. If you have any questions, please feel free to contact us at the address shown above. Sincerely, X HEIKE Axel Certification Project Manager Signed by: HEIKE Axel 14.01.2021 14/01/2021 X Leandro Wan-Dall Head of Certification Management Signed by: WAN-DALL Leandro THALES DIS AIS Deutschland GmbH Registered Office: M nchen - Amtsgericht M nchen, HRB 172715 WEEE-Reg.-Nr. DE 58893809 Managing Director: Andreas Haegele