FCC ID: RI7LM960 LM960

LM960 HW Design Guide 1VV0301485 Rev.3 2018-12-14

]

7 1 0 2

. 1 0

[

Mod.0818 2017-01 Rev.0 LM960 HW Design Guide SPECIFICATIONS ARE SUBJECT TO CHANGE WITHOUT NOTICE NOTICE While reasonable efforts have been made to assure the accuracy of this document, Telit assumes no liability resulting from any inaccuracies or omissions in this document, or from use of the information obtained herein. The information in this document has been carefully checked and is believed to be reliable. However, no responsibility is assumed for inaccuracies or omissions. Telit reserves the right to make changes to any products described herein and reserves the right to revise this document and to make changes from time to time in content hereof with no obligation to notify any person of revisions or changes. Telit does not assume any liability arising out of the application or use of any product, software, or circuit described herein; neither does it convey license under its patent rights or the rights of others. It is possible that this publication may contain references to, or information about Telit products (machines and programs), programming, or services that are not announced in your country. Such references or information must not be construed to mean that Telit intends to announce such Telit products, programming, or services in your country. COPYRIGHTS This instruction manual and the Telit products described in this instruction manual may be, include or describe copyrighted Telit material, such as computer programs stored in semiconductor memories or other media. Laws in the Italy and other countries preserve for Telit and its licensors certain exclusive rights for copyrighted material, including the exclusive right to copy, reproduce in any form, distribute and make derivative works of the copyrighted material. Accordingly, any copyrighted material of Telit and its licensors contained herein or in the Telit products described in this instruction manual may not be copied, reproduced, distributed, merged or modified in any manner without the express written permission of Telit. Furthermore, the purchase of Telit products shall not be deemed to grant either directly or by implication, estoppel, or otherwise, any license under the copyrights, patents or patent applications of Telit, as arises by operation of law in the sale of a product. COMPUTER SOFTWARE COPYRIGHTS The Telit and 3rd Party supplied Software (SW) products described in this instruction manual may include copyrighted Telit and other 3rd Party supplied computer programs stored in semiconductor memories or other media. Laws in the Italy and other countries preserve for Telit and other 3rd Party supplied SW certain exclusive rights for copyrighted computer programs, including the exclusive right to copy or reproduce in any form the copyrighted computer program. Accordingly, any copyrighted Telit or other 3rd Party supplied SW computer programs contained in the Telit products described in this instruction manual may not be copied (reverse engineered) or reproduced in any manner without the express written permission of Telit or the 3rd Party SW supplier. Furthermore, the purchase of Telit products shall not be deemed to grant either directly or by implication, estoppel, or otherwise, any license under the copyrights, patents or patent applications of Telit or other 3rd Party supplied SW, except for the normal non-exclusive, royalty free license to use that arises by operation of law in the sale of a product. 1VV0301485 Rev. 3 Page 2 of 74 2018-12-14 LM960 HW Design Guide USAGE AND DISCLOSURE RESTRICTIONS I. License Agreements The software described in this document is the property of Telit and its licensors. It is furnished by express license agreement only and may be used only in accordance with the terms of such an agreement. II. Copyrighted Materials Software and documentation are copyrighted materials. Making unauthorized copies is prohibited by law. No part of the software or documentation may be reproduced, transmitted, transcribed, stored in a retrieval system, or translated into any language or computer language, in any form or by any means, without prior written permission of Telit III. High Risk Materials Components, units, or third-party products used in the product described herein are NOT fault-tolerant and are NOT designed, manufactured, or intended for use as on-line control equipment in the following hazardous environments requiring fail-safe controls: the operation of Nuclear Facilities, Aircraft Navigation or Aircraft Communication Systems, Air Traffic Control, Life Support, or Weapons Systems (High Risk Activities"). Telit and its supplier(s) specifically disclaim any expressed or implied warranty of fitness for such High Risk Activities. IV. Trademarks TELIT and the Stylized T Logo are registered in Trademark Office. All other product or service names are the property of their respective owners. V. Third Party Rights The software may include Third Party Right software. In this case you agree to comply with all terms and conditions imposed on you in respect of such separate software. In addition to Third Party Terms, the disclaimer of warranty and limitation of liability provisions in this License shall apply to the Third Party Right software. TELIT HEREBY DISCLAIMS ANY AND ALL WARRANTIES EXPRESS OR IMPLIED FROM ANY THIRD PARTIES REGARDING ANY SEPARATE FILES, ANY THIRD PARTY MATERIALS INCLUDED IN THE SOFTWARE, ANY THIRD PARTY MATERIALS FROM WHICH THE SOFTWARE IS DERIVED (COLLECTIVELY OTHER CODE), AND THE USE OF ANY OR ALL THE OTHER CODE IN CONNECTION WITH THE SOFTWARE, INCLUDING

(WITHOUT LIMITATION) ANY WARRANTIES OF SATISFACTORY QUALITY OR FITNESS FOR A PARTICULAR PURPOSE. NO THIRD PARTY LICENSORS OF OTHER CODE SHALL HAVE ANY LIABILITY FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING WITHOUT LIMITATION LOST PROFITS), HOWEVER CAUSED AND WHETHER MADE UNDER CONTRACT, TORT OR OTHER LEGAL THEORY, ARISING IN ANY WAY OUT OF THE USE OR DISTRIBUTION OF THE OTHER CODE OR THE EXERCISE OF ANY RIGHTS GRANTED UNDER EITHER OR BOTH THIS LICENSE AND THE LEGAL TERMS APPLICABLE TO ANY SEPARATE FILES, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. 1VV0301485 Rev. 3 Page 3 of 74 2018-12-14 LM960 HW Design Guide Applicability Table PRODUCTS LM960 1VV0301485 Rev. 3 Page 4 of 74 2018-12-14 LM960 HW Design Guide Contents NOTICE 2 COPYRIGHTS .................................................................................................. 2 COMPUTER SOFTWARE COPYRIGHTS ....................................................... 2 USAGE AND DISCLOSURE RESTRICTIONS ................................................ 3 APPLICABILITY TABLE .................................................................................. 4 CONTENTS ...................................................................................................... 5 1. 2. 2.2.1. 2.8.1. 2.8.2. 2.9.1. 2.9.2. 3. INTRODUCTION ............................................................................ 9 Scope ............................................................................................. 9 Audience ........................................................................................ 9 Contact Information, Support ......................................................... 9 Text Conventions ......................................................................... 11 Related Documents ...................................................................... 12 GENERAL PRODUCT DESCRIPTION ........................................ 13 Overview ...................................................................................... 13 Product Variants and Frequency Bands ....................................... 13 RF Bands per Regional Variant .................................................... 13 Target market ............................................................................... 16 Main features ................................................................................ 16 Block Diagram .............................................................................. 18 TX Output Power .......................................................................... 18 RX Sensitivity ............................................................................... 19 Mechanical specifications ............................................................. 20 Dimensions ................................................................................... 20 Weight .......................................................................................... 20 Environmental Requirements ....................................................... 21 Temperature Range ..................................................................... 21 RoHS Compliance ........................................................................ 21 PINS ALLOCATION .................................................................... 22 Pin-out .......................................................................................... 22 LM960 Signals That Must Be Connected ..................................... 26 Pin Layout .................................................................................... 27 1VV0301485 Rev. 3 Page 5 of 74 2018-12-14 LM960 HW Design Guide 4. 4.3.1. 4.3.1.1. 4.3.2. 4.3.3. 5. POWER SUPPLY ........................................................................ 28 Power Supply Requirements ........................................................ 28 Power Consumption ..................................................................... 28 General Design Rules .................................................................. 29 Electrical Design Guidelines ......................................................... 29

+ 5V Input Source Power Supply Design Guidelines ................ 29 Thermal Design Guidelines .......................................................... 30 Power Supply PCB layout Guidelines .......................................... 31 RTC .............................................................................................. 31 Reference Voltage ........................................................................ 31 Internal LDO for GNSS bias ......................................................... 32 ELECTRICAL SPECIFICATIONS ................................................ 33 Absolute Maximum Ratings Not Operational ............................. 33 Recommended Operating Conditions .......................................... 33 6. 6.2.1. 6.4.1. 6.4.2. 6.1.1. 6.1.2. 6.1.3. 6.1.4. 6.1.5. DIGITAL SECTION ...................................................................... 34 Logic Levels ................................................................................. 34 1.8V Pins Absolute Maximum Ratings ...................................... 34 1.8V Standard GPIOs ................................................................... 34 1.8V SIM Card Pins ...................................................................... 35 2.85V Pins Absolute Maximum Ratings .................................... 35 SIM Card Pins @2.85V ................................................................ 35 Power On ..................................................................................... 36 Initialization and Activation State .................................................. 36 Power Off ..................................................................................... 37 Reset ............................................................................................ 38 Graceful Reset ............................................................................. 38 Unconditional Hardware Reset ..................................................... 39 Communication ports ................................................................... 39 USB Interface ............................................................................... 40 6.5.1. PCIe Interface .............................................................................. 42 6.5.2. SIM Interface ................................................................................ 44 6.5.3. SIM Schematic Example .............................................................. 44 6.5.3.1. 6.5.4. Control Signals ............................................................................. 45 6.5.4.1. W_DISABLE_N ............................................................................ 45 6.5.4.2. WAN_LED_N ............................................................................... 45 General Purpose I/O .................................................................... 46 6.5.5. 6.5.5.1. Using a GPIO Pin as Input ........................................................... 46 1VV0301485 Rev. 3 Page 6 of 74 2018-12-14 LM960 HW Design Guide 6.5.5.2. 6.5.6. 7. 7.4.1. 7.5.1. 7.5.2. 7.5.3. 7.5.4. 8. 9. 10. 11. 12. Using a GPIO Pin as Output ........................................................ 47 I2C Inter-integrated circuit ......................................................... 47 Using the Temperature Monitor Function ..................................... 48 RF SECTION ................................................................................ 49 Antenna requirements .................................................................. 49 Primary Antenna Requirements ................................................... 49 Secondary Antenna Requirements............................................... 49 GNSS Receiver ............................................................................ 50 GNSS RF Front End Design......................................................... 51 Antenna connection ...................................................................... 51 Support bands in antenna port ..................................................... 51 Antenna Connector ...................................................................... 52 Antenna Cable .............................................................................. 52 Antenna Installation Guidelines .................................................... 52 AUDIO SECTION ......................................................................... 54 Audio Interface ............................................................................. 54 Digital Audio ................................................................................. 54 MECHANICAL DESIGN............................................................... 55 General ......................................................................................... 55 Finishing & Dimensions ................................................................ 55 Drawing ........................................................................................ 55 APPLICATION GUIDE ................................................................. 56 Debug of the LM960 Module in Production .................................. 56 Bypass Capacitor on Power Supplies .......................................... 56 EMC Recommendations .............................................................. 57 PACKAGING ............................................................................... 60 Tray .............................................................................................. 60 CONFORMITY ASSESSMENT ISSUES ..................................... 62 Approvals ..................................................................................... 62 Declaration of Conformity ............................................................. 62 FCC certificates ............................................................................ 62 IC certificates ................................................................................ 62 FCC/IC Regulatory notices ........................................................... 62 RED Regulatory notices ............................................................... 65 13. SAFETY RECOMMENDATIONS ................................................. 67 1VV0301485 Rev. 3 Page 7 of 74 2018-12-14 LM960 HW Design Guide READ CAREFULLY ..................................................................... 67 REFERENCE TABLE OF RF BANDS CHARACTERISTICS ..... 68 ACRONYMS ................................................................................ 71 DOCUMENT HISTORY ................................................................ 73 14. 15. 16. 1VV0301485 Rev. 3 Page 8 of 74 2018-12-14 LM960 HW Design Guide 1. INTRODUCTION Scope introduces This document the Telit LM960 module and presents possible and recommended hardware solutions for developing a product based on the LM960 module. All the features and solutions detailed in this document are applicable to all LM960 variants, where LM960 refers to the variants listed in the Applicability Table. If a specific feature is applicable to a specific product only, it will be clearly marked. Information LM960 refers to all modules listed in the Applicability Table. This document takes into account all the basic functions of a wireless module; a valid hardware solution is suggested for each function, and incorrect solutions and common errors to be avoided are pointed out. Obviously, this document cannot embrace every hardware solution or every product that can be designed. Where the suggested hardware configurations need not be considered mandatory, the information given should be used as a guide and a starting point for properly developing your product with the Telit LM960 module. Information The integration of the WCDMA/HSPA+/LTE LM960 cellular module within a user application must be done according to the design rules described in this manual. Audience This document is intended for Telit customers, especially system integrators, about to implement their applications using the Telit LM960 module. Contact Information, Support For general contact, documentation errors contact Telit Technical Support at:

technical support services, technical questions and report TS-EMEA@telit.com TS-AMERICAS@telit.com TS-APAC@telit.com TS-SRD@telit.com 1VV0301485 Rev. 3 Page 9 of 74 2018-12-14 LM960 HW Design Guide For detailed information about where you can buy the Telit modules or for recommendations on accessories and components visit:

http://www.telit.com To register for product news and announcements or for product questions contact Telits Technical Support Center (TTSC). Our aim is to make this guide as helpful as possible. Keep us informed of your comments and suggestions for improvements. Telit appreciates feedback from the users of our information. 1VV0301485 Rev. 3 Page 10 of 74 2018-12-14 LM960 HW Design Guide Text Conventions Danger This information MUST be followed or catastrophic equipment failure or bodily injury may occur. Caution or Warning Alerts the user to important points about integrating the module, if these points are not followed, the module and end user equipment may fail or malfunction. Tip or Information Provides advice and suggestions that may be useful when integrating the module. All dates are in ISO 8601 format, i.e. YYYY-MM-DD. 1VV0301485 Rev. 3 Page 11 of 74 2018-12-14 LM960 HW Design Guide Related Documents LM960 SW User Guide, 1VV0301477 LM960 AT Commands Reference Guide, 80568ST10869A Generic EVB HW User Guide, 1VV0301249 LM960 Interface Board HW User Guide, 1VV0301502 SIM Integration Design Guide Application Note Rev10, 80000NT10001A 1VV0301485 Rev. 3 Page 12 of 74 2018-12-14 LM960 HW Design Guide 2. GENERAL PRODUCT DESCRIPTION Overview The aim of this document is to present possible and recommended hardware solutions useful for developing a product with the Telit LM960 Mini PCIe module. LM960 is Telits platform for Mini PCIe module for applications, such as M2M applications and industrial IoT device platforms, based on the following technologies:

LTE / WCDMA networks for data communication Designed for industrial grade quality In its most basic use case, LM960 can be applied as a wireless communication front-end for mobile products, offering mobile communication features to an external host CPU through its rich interfaces. LM960 can further support customer software applications and security features. LM960 provides a software application development environment with sufficient system resources for creating rich on-board applications. Thanks to a dedicated application processor and embedded security resources, product developers and manufacturers can create products that guarantee fraud prevention and tamper evidence without extra effort for additional security precautions. LM960 is available in hardware variants as listed in Applicability Table The designated RF band sets per each variant are detailed in Section 2.2, Product Variants and Frequency Bands. Product Variants and Frequency Bands The operating frequencies in LTE & WCDMA modes conform to the 3GPP specifications. RF Bands per Regional Variant 2.2.1. This table summarizes the LM960, showing the supported band sets and the supported band pairs and triple for carrier aggregation. RF Bands and Carrier Aggregation Bands LTE FDD LTE TDD HSPA+

1, 2, 3, 4, 5, 7, 8, 12, 13, 14, 17, 18, 19, 20, 25, 26, 28, 29, 30, 32, 66, 71 38, 39, 40, 41, 42, 43, 46, 48 1, 2, 4, 5, 8, 9, 19 GNSS GPS, GLONASS, BeiDou, Galileo LTE 2DL carrier aggregation combinations AT & T CA_[2A]-[2A], CA_[2A]-[4A], CA_2A-5A, CA_2A-12A, CA_2A-14A, CA_2A-29A, CA_2A-

30A, CA_[2A]-46A, CA_[2A]-[66A], CA_2C, CA_[4A]-[4A], CA_4A-5A, CA_4A-12A, CA_4A-29A, CA_4A-30A, CA_[4A]-46A, CA_5A-30A , CA_5A-66A, CA_5B, CA_12A-

30A, CA_12A-66A, CA_12B, CA_14A-30A, CA_14A-66A, CA_29A-30A, CA_29A-66A, CA_30A-66A, CA_[66A]-[66A], CA_66B, CA_66C 1VV0301485 Rev. 3 Page 13 of 74 2018-12-14 LM960 HW Design Guide Verizon Sprint Generic CA_[2A]-[2A], CA_[2A]-[4A], CA_[2A]-5A, CA_[2A]-13A, CA_[2A]-[66A], CA_[4A]-[4A], CA_[4A]-5A, CA_[4A]-13A, CA_5A-[66A], CA_5B, CA_13A-[66A], CA_[66A]-[66A], CA_[66B], CA_[66C], CA_[2A]-48A, CA_13A-48A, CA_48A-[66A]

CA_[25A]-[25A], CA_[25A]-26A, CA_25A-41A, CA_26A-[41A], CA_[41A]-[41A], CA_[41C]

CA_1C, CA_[2C], CA_3C, CA_7C, CA_12B, CA_38C, CA_39C, CA_40C, CA_[41C], CA_42C, CA_48C, CA_[66B], CA_[66C], CA_[2A]-[2A], CA_3A-3A, CA_[4A]-[4A], CA_7A-7A, CA_48A-48A, CA_[66A]-[66A], CA_1A-3A, CA_1A-5A, CA_1A-7A, CA_1A-

18A, CA_1A-19A, CA_1A-20A, CA_1A-26A, CA_1A-28A, CA_1A-41A, CA_[2A]-[4A], CA_[2A]-5A, CA_2A-7A, CA_[2A]-12A, CA_[2A]-28A, CA_[2A]-46A, CA_[2A]-48A, CA_[2A]-[66A], CA_[2A]-71A, CA_3A-5A, CA_3A-7A, CA_3A-8A, CA_3A-19A, CA_3A-

20A, CA_3A-26A, CA_3A-28A, CA_3A-38A, CA_[4A]-5A, CA_4A-7A, CA_[4A]-12A, CA_[4A]-28A, CA_[4A]-46A, CA_5A-7A, CA_7A-12A, CA_7A-20A, CA_7A-28A, CA_12A-[66A], CA_20A-32A, CA_26A-[41A], CA_39A-41A, CA_46A-[66A], CA_48A-

[66A], CA_[66A]-71A LTE 2UL carrier aggregation combinations AT & T CA_2A-12A, CA_2A-5A, CA_4A-12A, CA_5A-66A, CA_5B, CA_12A-66A Verizon CA_2A-13A, CA_4A-13A Sprint CA_41C Generic CA_3C, CA_7C, CA_38C, CA_40C, CA_42C, CA_1A-7A, CA_1A-8A, CA_1A-28A, CA_3A-7A, CA_3A-8A, CA_3A-20A, CA_3A-28A LTE 3DL carrier aggregation combinations AT & T Verizon CA_2A-2A-5A, CA_[2A]-2A-12A, CA_2A-2A-14A, CA_2A-2A-30A, CA_2A-2A-66A, CA_[2A]-4A-4A, CA_2A-[4A]-[4A], CA_[2A]-4A-5A, CA_2A-[4A]-5A, CA_[2A]-4A-12A, CA_2A-[4A]-12A, CA_2A-4A-30A, CA_2A-5A-30A, CA_[2A]-5A-66A, CA_2A-5A-[66A], CA_2A-12A-30A, CA_[2A]-12A-66A, CA_2A-12A-[66A], CA_2A-14A-30A, CA_2A-14A-

66A, CA_2A-29A-30A, CA_2A-30A-66A, CA_2A-46C, CA_2A-66A-66A, CA_[4A]-4A-

5A, CA_[4A]-4A-12A, CA_4A-4A-30A, CA_4A-5A-30A, CA_4A-12A-30A, CA_4A-12B, CA_4A-29A-30A, CA_5A-30A-66A, CA_5A-66A-66A, CA_5A-66C, CA_12A-30A-66A, CA_12A-[66A]-66A, CA_14A-30A-66A, CA_14A-66A-66A, CA_29A-30A-66A, CA_29A-

66A-66A, CA_30A-66A-66A CA_[2A]-2A-5A, CA_[2A]-2A-13A, CA_[2A]-2A-66A, CA_2A-2A-[66A], CA_[2A]-4A-5A, CA_2A-[4A]-5A, CA_[2A]-4A-13A, CA_2A-[4A]-13A, CA_[2A]-5A-66A, CA_2A-5A-[66A], CA_[2A]-13A-66A, CA_2A-13A-[66A], CA_[2A]-66A-66A, CA_2A-[66A]-66A, CA_[2A]-

[66B], CA_[2A]-[66C], CA_[4A]-4A-5A, CA_[4A]-4A-13A, CA_5A-[66A]-66A, CA_5A-

[66B], CA_5A-[66C], CA_13A-[66A]-66A, CA_13A-[66B], CA_13A-[66C], CA_[66A]-

[66C], CA_[66D], CA_[2A]-48A-48A, CA_[2A]-48A-66A, CA_2A-48A-[66A], CA_[2A]-

48C, CA_13A-48A-48A, CA_13A-48A-[66A], CA_13A-48C, CA_48A-48A-[66A], CA_48A-[66A]-66A, CA_48A-[66B], CA_48C-[66A]

Sprint CA_[25A]-25A-26A, CA_26A-[41C], CA_[41A]-[41C], CA_[41D], CA_25A-41C 1VV0301485 Rev. 3 Page 14 of 74 2018-12-14 LM960 HW Design Guide Generic AT & T Verizon Sprint Generic CA_1A-3A-7A, CA_1A-3A-19A, CA_1A-3A-20A, CA_1A-3A-28A, CA_1A-3A-38A, CA_1A-7A-20A, CA_1A-7A-28A, CA_1A-7C, CA_1A-40C, CA_1A-41C, CA_1A-42C, CA_1A-46C, CA_[2A]-2A-12A, CA_2A-[2A]-12A, CA_[2A]-2A-66A, CA_2A-[2A]-66A, CA_2A-2A-[66A], CA_[2A]-2A-71A, CA_2A-[2A]-71A, CA_[2A]-4A-4A, CA_2A-[4A]-4A, CA_2A-4A-[4A], CA_[2A]-4A-5A, CA_2A-[4A]-5A, CA_[2A]-4A-12A, CA_2A-[4A]-12A, CA_[2A]-4A-29A, CA_2A-[4A]-29A, CA_[2A]-4A-71A, CA_2A-[4A]-71A, CA_2A-7A-12A, CA_[2A]-12A-66A, CA_2A-12A-[66A], CA_[2A]-12B, CA_[2A]-46A-46A, CA_[2A]-46A-

66A, CA_2A-46A-[66A], CA_[2A]-46C, CA_[2A]-48A-48A, CA_[2A]-48A-66A, CA_2A-

48A-[66A], CA_[2A]-48C, CA_[2A]-66A-66A, CA_2A-[66A]-66A, CA_2A-66A-[66A], CA_[2A]-66A-71A, CA_2A-[66A]-71A, CA_[2A]-[66C], CA_[2A]-66C, CA_2A-[66C], CA_3A-7A-20A, CA_3A-7A-28A, CA_3A-7C, CA_3A-40C, CA_3A-42C, CA_3A-46C, CA_3C-5A, CA_3C-7A, CA_3C-20A, CA_3C-28A, CA_4A-4A-7A, CA_[4A]-4A-12A, CA_4A-[4A]-12A, CA_[4A]-4A-71A, CA_4A-[4A]-71A, CA_4A-7A-12A, CA_[4A]-12B, CA_[4A]-46A-46A, CA_[4A]-46C, CA_7A-46C, CA_7C-28A, CA_12A-[66A]-66A, CA_12A-66A-[66A], CA_12A-[66C], CA_19A-42C, CA_28A-40C, CA_40D, CA_46C-

[66A], CA_48A-48A-[66A], CA_48A-48C, CA_48C-[66A], CA_48D, CA_[66A]-66A-71A, CA_66A-[66A]-71A LTE 4DL carrier aggregation combinations CA_2A-2A-5A-30A, CA_2A-2A-5A-66A, CA_2A-2A-12A-30A, CA_2A-2A-12A-66A, CA_2A-2A-14A-66A, CA_2A-2A-29A-30A, CA_2A-2A-66A-66A, CA_2A-4A-4A-12A, CA_2A-4A-5A-30A, CA_2A-4A-12A-30A, CA_2A-5A-30A-66A, CA_2A-5A-66A-66A, CA_2A-5B-30A, CA_2A-5B-66A, CA_2A-12A-30A-66A, CA_2A-12A-66A-66A, CA_2A-

14A-30A-66A, CA_2A-14A-66A-66A, CA_2A-29A-30A-66A, CA_[2A]-46D, CA_[4A]-

46D, CA_4A-4A-12A-30A, CA_5A-30A-66A-66A, CA_5B-30A-66A, CA_5B-66A-66A, CA_12A-30A-66A-66A, CA_14A-30A-66A-66A, CA_29A-30A-66A-66A, CA_46D-[66A]

CA_2A-48A-48A-66A, CA_[2A]-48D, CA_13A-48A-48A-66A, CA_13A-48A-48C, CA_13A-48C-[66A], CA_13A-48D, CA_48A-48A-66A-66A, CA_48A-48A-[66B], CA_48A-48A-[66C], CA_48A-48C-[66A], CA_48D-[66A]

CA_25A-41D, CA_25A-41D, CA_[41C]-41C, CA_[41A]-41D, CA_41E CA_1A-3A-7A-20A, CA_1A-3A-7A-28A, CA_1A-3A-7C, CA_1A-3A-42C, CA_1A-3C-5A, CA_1A-3C-7A, CA_1A-46D, CA_2A-2A-12A-66A, CA_2A-2A-66A-66A, CA_[2A]-2A-

66C, CA_2A-[2A]-66C, CA_2A-2A-[66C], CA_2A-4A-7A-12A, CA_2A-12A-66A-66A, CA_2A-46A-46A-66A, CA_[2A]-46A-46C, CA_[2A]-46C-66A, CA_2A-46C-[66A], CA_[2A]-46D, CA_[2C]-66A-66A, CA_2C-[66A]-66A, CA_2C-66A-[66A], CA_3A-5A-7A-

7A, CA_3C-7A-20A, CA_3C-7A-28A, CA_3A-7C-28A, CA_3A-28A-40C, CA_3A-40D, CA_3A-46D, CA_3C-7C, CA_[4A]-46A-46C, CA_[4A]-46D, CA_7A-46D, CA_28A-46D, CA_40E, CA_[41C]-42C, CA_46A-46C-[66A], CA_46D-[66A], CA_48D-[66A], CA_48E LTE 5DL carrier aggregation combinations AT & T CA_2A-2A-46D, CA_2A-5B-30A-66A, CA_2A-5B-66A-66A, CA_2A-46D-66A, CA_5B-

30A-66A-66A, CA_46D-66A-66A Verizon CA_2A-48E, CA_13A-48A-48C-66A, CA_13A-48C-48C, CA_13A-48D-66A, CA_13A-

48E, CA_48A-48C-66B, CA_48A-48C-66C, CA_48C-48C-66A, CA_48E-66A Sprint Generic CA_1A-3A-7C-28A, CA_1A-3C-7C, CA_2A-46A-46C-66A, CA_2A-46D-66A, CA_3A-

28A-40D, CA_3A-40E, CA_3C-7C-28A

-

[ ] mean that 4*4 MIMO is supported 1VV0301485 Rev. 3 Page 15 of 74 2018-12-14 LM960 HW Design Guide Refer to Chapter 14 for details information about frequencies and bands. Target market LM960 can be used for telematics applications where tamper-resistance, confidentiality, integrity, and authenticity of end-user information are required, for example:

Industrial equipment Home network Internet connectivity Main features The LM960 family of industrial grade cellular modules features LTE and multi-RAT module together with an on-chip powerful application processor and a rich set of interfaces. The major functions and features are listed below. Main Features Function Features Module Multi-RAT cellular module for data communication o LTE FDD/TDD Cat18(DL)/13(UL) (1.2 Gbps/150 Mbps) o WCDMA up to DC HSPA+, Rel.10 Support for GPS, GLONASS, BeiDou and Galileo Audio subsystem Two USIM ports dual voltage Application processor Support digital audio interface (optional) Support for dual SIM Class B and Class C support Clock rates up to 4 MHz Application processor to run customer application code 32 bit ARM Cortex-A7 up to 1.4 GHz running the Linux operating system 4Gbit NAND Flash + 2Gbit LPDDR2 MCP is supported to allow for customers own software applications Interfaces Rich set of interfaces, including:

USB3.0 USB port is typically used for:

o Flashing of firmware and module configuration o Production testing 1VV0301485 Rev. 3 Page 16 of 74 2018-12-14 LM960 HW Design Guide Function Features o Accessing the Application Processors file system o AT command access o High-speed WWAN access to external host o Diagnostic monitoring and debugging o Communication between Java application environment and an external host CPU o NMEA data to an external host CPU PCIe(Optional) Peripheral Ports GPIOs Advanced security features o Boot integrity of firmware up to customer applications o Disable/secure re-enable of debug o Embedded security FOTA (optional) Telit Unified AT command set Major software features Form factor Mini PCIe Form factor (50.95x30x2.7mm), accommodating the multiple RF bands Environment and quality requirements Single supply module The entire module is designed and qualified by Telit for satisfying the environment and quality requirements for use in applications. The module generates all its internal supply voltages. RTC The real-time clock is supported. Operating temperature Range -40 C to +85 C

(conditions as defined in Section 2.9.1, Temperature Range) 1VV0301485 Rev. 3 Page 17 of 74 2018-12-14 LM960 HW Design Guide Block Diagram Below figure shows an overview of the internal architecture of the LM960 module. LM960 Block Diagram It includes the following sub-functions:

Application processor, Module subsystem and Location processing with their external interfaces. These three functions are contained in a single SOC. RF front end Rich IO interfaces. Depending on which LM960 software features are enabled, some of its interfaces that are exported through multiplexing may be used internally and thus may not be usable by the application. PMIC with the RTC function inside TX Output Power Band 3G WCDMA LTE All Bands LTE Band 41 supports HPUE Power class Class 3 (0.2W) Class 3 (0.2W) Class 2 (0.4W) 1VV0301485 Rev. 3 Page 18 of 74 2018-12-14 LM960 HW Design Guide RX Sensitivity Below the 3GPP measurement conditions used to define the RX sensitivity:

Technology 4G LTE 3G WCDMA 3GPP Compliance Throughput >95% 10MHz Dual Receiver BER <0.1% 12.2 Kbps Dual Receiver Product Band Typical Rx Sensitivity (dBm) * / **

(BW = 10 MHz / B46 BW = 20 MHz) LM960 LTE FDD B1 LTE FDD B2 LTE FDD B3 LTE FDD B4 LTE FDD B5 LTE FDD B7 LTE FDD B8 LTE FDD B12 LTE FDD B13 LTE FDD B14 LTE FDD B17 LTE FDD B18 LTE FDD B19 LTE FDD B20 LTE FDD B25 LTE FDD B26 LTE FDD B28 LTE FDD B29 (DL Only) LTE FDD B30 LTE FDD B32 LTE FDD B66 LTE TDD B38 LTE TDD B39 LTE TDD B40

-100.0 dBm

-100.0 dBm

-100.0 dBm

-100.5 dBm

-101.0 dBm

-100.0 dBm

-100.5 dBm

-101.0 dBm

-100.5 dBm

-100.0 dBm

-101.0 dBm

-101.0 dBm

-100.0 dBm

-100.5 dBm

-100.0 dBm

-100.0 dBm

-100.5 dBm

-100.0 dBm

-100.0 dBm

-100.0 dBm

-100.0 dBm

-99.0 dBm

-100.0 dBm

-100.0 dBm 1VV0301485 Rev. 3 Page 19 of 74 2018-12-14 LM960 HW Design Guide LM960 LTE TDD B41 LTE TDD B42 LTE TDD B43 LTE TDD B46 (DL Only) LTE TDD B48 LTE FDD B71 WCDMA FDD B1 WCDMA FDD B2 WCDMA FDD B4 WCDMA FDD B5 WCDMA FDD B8 WCDMA FDD B9 WCDMA FDD B19

-99.0 dBm

-100.0 dBm

-100.0 dBm

-95.0 dBm

-100.0 dBm

-99.5 dBm

-111.0 dBm

-110.0 dBm

-111.0 dBm

-111.0 dBm

-110.0 dBm

-110.0 dBm

-111.0 dBm

* LTE Rx Sensitivity shall be verified by using both (all) antenna ports simultaneously.

** 3.3 Voltage / Room temperature 2.8.1. The LM960 modules overall dimensions are:

Mechanical specifications Dimensions Length: 50.95 mm, +/- 0.15 mm tolerance Width: 30.00 mm, +/- 0.15 mm tolerance Thickness: 2.70 mm, +/- 0.15 mm tolerance 2.8.2. Weight The nominal weight of the LM960 module is 10.1 grams. 1VV0301485 Rev. 3 Page 20 of 74 2018-12-14 LM960 HW Design Guide 2.9.1. Environmental Requirements Temperature Range Note Operating Temperature Range 20C ~ +55C This range is defined by 3GPP (the global standard for wireless mobile communication). Telit guarantees its modules to comply with all the 3GPP requirements and to have full functionality of the module with in this range. to range relative 40C ~ +85C Telit guarantees full functionality within this range as well. However, there may possibly be some performance deviations in this extended 3GPP requirements, which means that some RF parameters may deviate from the 3GPP specification in the order of a few dB. For example: receiver sensitivity or maximum output power may be slightly degraded. Even so, all the functionalities, such as call connection, SMS, USB communication, UART activation etc., will be maintained, and the effect of such degradations will not lead to malfunction. 40C ~ +85C Storage and non-

operating Temperature Range RoHS Compliance 2.9.2. As a part of the Telit corporate policy of environmental protection, the LM960 complies with the RoHS (Restriction of Hazardous Substances) directive of the European Union

(EU directive 2011/65/EU). 1VV0301485 Rev. 3 Page 21 of 74 2018-12-14 LM960 HW Design Guide 3. PINS ALLOCATION Pin-out LM960 Pin-out Pin Signal I/O Function Type Comment USB HS 2.0 Communication Port 38 36 USB_D+

I/O USB 2.0 Data Plus Analog USB_D-

I/O USB 2.0 Data Minus Analog USB SS 3.0 Communication and PCIe Port 25 23 33 31 USB_TX_P PCIE_TX_P USB_TX_M PCIE_TX_M USB_RX_P PCIE_RX_P USB_RX_M PCIE_RX_M O O I I USB 3.0 super-

speed/PCIe transmit plus USB 3.0 super-

speed/PCIe transmit minus USB 3.0 super-

speed/PCIe receive plus USB 3.0 super-

speed/PCIe receive minus Analog Analog Analog Analog Peripheral Component Interconnect Express 7 PCIE_CLKREQ_N I/O PCIE reference clock request signal. 1.8V 11 PCIE_REFCLK_M 13 PCIE_REFCLK_P I I PCI Express differential reference clock minus PCI Express differential reference clock plus 1VV0301485 Rev. 3 Page 22 of 74 2018-12-14 LM960 HW Design Guide 22 PCIE_RESET_N I Functional reset to the PCIe bus 1.8V SIM Card Interface 1 8 10 12 14 SIMVCC1 SIMIO1 SIMCLK1 SIMRST1 SIM Card Interface 2 16 19 17 6 SIMVCC2 SIMIO2 SIMCLK2 SIMRST2 Digital I/O (GPIOs) 3 5 SIMIN1/GPIO_01 SIMIN2/GPIO_02 O Supply output for an external UIM1 card I/O Data connection with an external UIM1 card O O Clock output to an external UIM1 card Reset output to an external UIM1 card 1.8V /

2.85V 1.8V /

2.85V 1.8V /

2.85V 1.8V /

2.85V Power O Supply output for an external UIM2 card 1.8 / 2.85V Power I/O Data connection with 1.8 / 2.85V an external UIM2 card O O Clock output to an external UIM2 card 1.8 / 2.85V Reset output to an external UIM2 card 1.8 / 2.85V I/O General purpose I/O Can be used as SIMIN1 I/O General purpose I/O Can be used as SIMIN2 1.8V 1.8V 44 GPIO_03 I/O General purpose I/O 1.8V 1VV0301485 Rev. 3 Page 23 of 74 2018-12-14 LM960 HW Design Guide 46 GPIO_04 I/O General purpose I/O 1.8V Control Signal 1 20 42 PCIE_WAKE_N W_DISABLE_N WAN_LED_N Miscellaneous Functions O I O PCIe wake-up 1.8V RF disable Open-drain Internal VBATT Pull-up LED control Open-drain VREG_L6_1P8 O Reference Voltage 1.8V Power SYSTEM_RESET_N I Reset Input 1.8V 28 48 Digital Audio Interface 45 47 49 51 DVI _CLK DVI _TX DVI _RX DVI _WAO I2C Interface 30 32 I2C_SCL I2C_SDA Power Supply 2 24 39 VBATT VBATT VBATT 1VV0301485 Rev. 3 O O I O O I/O I I I PCM Clock PCM Data Out PCM Data In PCM Frame Sync I2C Clock I2C Data 1.8V 1.8V 1.8V 1.8V 1.8V 1.8V Power supply Power Power supply Power Power supply Power Page 24 of 74 2018-12-14 LM960 HW Design Guide 41 52 VBATT VBATT GROUND I I

-

-

-

-

-

-

-

-

-

-

-

-

-

-

Power supply Power Power supply Power Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground GND GND GND GND GND GND GND GND GND GND GND GND GND GND Information If the DVI and I2C interface are not used, the signals can be left floating. 1VV0301485 Rev. 3 Page 25 of 74 2018-12-14 4 9 15 18 21 26 27 29 34 35 37 40 43 50 LM960 HW Design Guide Information Unless otherwise specified, RESERVED pins must be left unconnected (Floating). LM960 Signals That Must Be Connected Below table specifies the LM960 signals that must be connected for a debugging purpose even if not used by the end application:

Mandatory Signals Pin 2, 24, 39, 41, 52 Signal VBATT 4, 9, 15, 18, 21, 26, 27, 29, 34, 35, 37, 40, 43, 50 GND Notes 38 36 USB_D+

If not used, connect to a test point or an USB connector USB_D-

If not used, connect to a test point or an USB connector 1VV0301485 Rev. 3 Page 26 of 74 2018-12-14 LM960 HW Design Guide Pin Layout LM960 Pin Layout Top side

- Odd pins Bottom side

- Even pins 2 4 6 8 10 12 14 16 VBATT GND SIMRST2 SIMVCC1 SIMIO1 SIMCLK1 SIMRST1 SIMVCC2 18 20 22 24 26 28 30 32 34 36 38 40 42 44 46 48 50 52

<Bottom View>

54 GND W_DISABLE_N PCIE_RESET_N VBATT GND VREG_L6M I2C_SCL I2C_SDA GND USB_D-

USB_D+

GND WAN_LED_N GPIO_03 GPIO_04 SYSTEM_RESET_N GND VBATT PCIE_WAKE_N GPIO_01 GPIO_02 PCIE_CLKREQ_N GND PCIE_REFCLK_M PCIE_REFCLK_P GND SIMCLK2 SIMIO2 GND USB/PCIE_TX_M USB/PCIE_TX_P GND GND USB/PCIE_RX_M USB/PCIE_RX_P GND GND VBATT VBATT GND DVI_CLK DVI_TX DVI_RX DVI_WAO 1 3 5 7 9 11 13 15 17 19 21 23 25 27 29 31 33 35 37 39 41 43 45 47 49 51

<Top View>

1VV0301485 Rev. 3 Page 27 of 74 2018-12-14 LM960 HW Design Guide 4. POWER SUPPLY The power supply circuitry and board layout are very important parts of the full product design, with critical impact on the overall product performance. Read the following requirements and guidelines carefully to ensure a good and proper design. Power Supply Requirements The LM960 power requirements are as follows:

Power Supply Requirements Nominal supply voltage Supply voltage range 3.3V 3.10V 3.6V Maximum ripple on module input supply 30 mV Power Consumption Below table provides typical current consumption values of LM960 for various operation modes. LM960 Current Consumption Mode Average [Typ.]

Mode Description IDLE Mode CFUN=1 20mA No call connection USB3.0 is connected to a host Power Saving Mode (PSMWDISACFG=1, W_DISABLE_N:Low) CFUN=4 WCDMA LTE 2.5mA 3mA 3.3mA Operative Mode (LTE) Non-CA mode

(1DL / 1UL) 2DL CA with 2x2 MIMO / 2UL CA 600mA 900mA 5DL CA with 2x2 MIMO / 1UL 1000mA Tx and Rx are disabled; module is not registered on the network (Flight mode) DRx7 (1.28 sec DRx cycle) Paging cycle #128 frames (1.28 sec DRx cycle) Non-CA, Band 2, Single carrier, BW 5MHz, 23dBm, 1RB CA_2A-5A, 2x2 MIMO, Full RB, 256QAM DL /

64QAM UL (FDD 300Mbps DL / 150Mbps UL) CA_2A-5B-66A-66A, 2x2 MIMO, Full RB, 256QAM DL / 64QAM UL (FDD 1Gbps DL /

75Mbps UL) 1VV0301485 Rev. 3 Page 28 of 74 2018-12-14 LM960 HW Design Guide Mode Average [Typ.]

Mode Description 3DL CA with 4x4 MIMO / 1UL 1200mA CA_2A-66C, 4x4 MIMO, Full RB, 256QAM DL

/ 64QAM UL (FDD 1.2Gbps DL / 75Mbps UL) Operative Mode (WCDMA) WCDMA Voice 750 mA WCDMA voice call (Tx = 23 dBm) WCDMA HSPA

(22 dBm) 650 mA WCDMA data call (DC-HSDPA up to 42 Mbps, Max Throughput)

* Worst/best case current values depend on network configuration - not under module control.

** Loop-back mode in call equipment

*** 3.3 voltage / room temperature Information The electrical design for the power supply must ensure a peak current output of at least 2A. General Design Rules The principal guidelines for the Power Supply Design embrace three different design steps:

Electrical design Thermal design PCB layout Electrical Design Guidelines 4.3.1. The electrical design of the power supply depends strongly on the power source where this power is drained. 4.3.1.1.

+ 5V Input Source Power Supply Design Guidelines The desired output for the power supply is 3.3V. So, the difference between the input source and the desired output is not big, and therefore a linear regulator can be used. A switching power supply is preferred to reduce power consumption. When using a linear regulator, a proper heat sink must be provided to dissipate the power generated. A bypass low ESR capacitor of adequate capacity must be provided to cut the current absorption peaks close to the LM960 module. A 100 F tantalum capacitor is usually suitable on VBATT. Make sure that the low ESR capacitor on the power supply output (usually a tantalum one) is rated at least 10V. A protection diode must be inserted close to the power input to protect the LM960 module from power polarity inversion. 1VV0301485 Rev. 3 Page 29 of 74 2018-12-14 LM960 HW Design Guide Thermal Design Guidelines 4.3.2. The thermal design for the power supply heat sink must be done with the following specifications:

Average current consumption during RF transmission @PWR level max in LM960 as shown in Section 4.2, Power Consumption table. Information The average consumption during transmission depends on the power level at which the device is requested to transmit via the network. Therefore, the average current consumption varies significantly. Information The thermal design for the power supply must be made keeping an average consumption at the maximum transmitting level during calls of LTE/HSPA. Considering the very low current during Idle, especially if the Power Saving function is enabled, it is possible to consider from the thermal point of view that the device absorbs significant current only during Data session. In LTE/WCDMA/HSPA mode, the LM960 emits RF signals continuously during transmission. Therefore, you must pay special attention how to dissipate the heat generated. While designing the application board, the designer must make sure that the LM960 module is located on a large ground area of the application board for effective heat dissipation. Information The LM960 must be connected to the ground and metal chassis of the host board for best RF performance and thermal dispersion as well as to have module fixed. The two holes at the top of the module and the main ground of the host board must be fastened together. The shield cover of the module and the main board of the host board or the metal chassis of the host device should be connected with conductive materials. 1VV0301485 Rev. 3 Page 30 of 74 2018-12-14 LM960 HW Design Guide Power Supply PCB layout Guidelines 4.3.3. As seen in the electrical design guidelines, the power supply must have a low ESR capacitor on the output to cut the current peaks and a protection diode on the input to protect the supply from spikes and polarity inversion. The placement of these components is crucial for the correct operation of the circuitry. A misplaced component can be useless or can even decrease the power supply performances. The bypass low ESR capacitor must be placed close to the LM960 power input pins, or if the power supply is of a switching type, it can be placed close to the inductor to cut the ripple, as long as the PCB trace from the capacitor to LM960 is wide enough to ensure a drop-less connection even during the 2A current peaks. The protection diode must be placed close to the input connector where the power source is drained. The PCB traces from the input connector to the power regulator IC must be wide enough to ensure that no voltage drops occur during the 2A current peaks. The PCB traces to LM960 and the bypass capacitor must be wide enough to ensure that no significant voltage drops occur when the 2A current peaks are absorbed. This is needed for the same above-mentioned reasons. Try to keep these traces as short as possible. The PCB traces connecting the switching output to the inductor and the switching diode must be kept as short as possible by placing the inductor and the diode very close to the power switching IC (only for the switching power supply). This is done to reduce the radiated field (noise) at the switching frequency (usually 100-

500 kHz). Use a good common ground plane. Place the power supply on the board in a way to guarantee that the high current return paths in the ground plane do not overlap any noise sensitive circuitry, such as the microphone amplifier/buffer or earphone amplifier. The power supply input cables must be kept separate from noise sensitive lines, such as microphone/earphone cables. RTC The RTC within the LM960 module does not have a dedicated RTC supply pin. The RTC block is supplied by the VBATT supply. If VBATT power is removed, RTC is not maintained so if maintaining an internal RTC is needed, VBATT must be supplied continuously. Reference Voltage 1.8V regulated power supply output is provided as the reference voltage to a host board. This output is active when the module is ON and goes OFF when the module is shut down. This table lists the VREG_L6_1P8 signal of LM960. LM960 Reference Voltage 1VV0301485 Rev. 3 Page 31 of 74 2018-12-14 LM960 HW Design Guide PIN Signal I/O Function Type Comment 28 VREG_L6_1P8 O Reference Voltage power 1.8V Internal LDO for GNSS bias The LDO for GNSS bias is applied inside the LM960 model. The voltage supply come from LM960s LDO to GNSS active antenna. This table lists the LDO for GNSS bias of LM960. LM960 Reference Voltage when VBATT is 3.3 Symbol Parameter Min Typ Max Unit VGNSS DC bias Voltage of Internal LDO for GNSS bias 2.9 3.1 3.15

[V]

IGNSS DC bias Current of Internal LDO for GNSS bias

-

-

100

[mA]

1VV0301485 Rev. 3 Page 32 of 74 2018-12-14 LM960 HW Design Guide 5. ELECTRICAL SPECIFICATIONS Absolute Maximum Ratings Not Operational Caution A deviation from the value ranges listed below may harm the LM960 module. Absolute Maximum Ratings Not Operational Symbol Parameter VBATT Battery supply voltage on pin VBATT Min

-0.5 Max

+4.2 Unit

[V]

Recommended Operating Conditions Recommended Operating Conditions Symbol Parameter Min Typ Max Unit Tamb Ambient temperature

-40

+25

+85

[C]

VBATT Battery supply voltage on pin VBATT 3.1 3.3 3.6

[V]

IVBATT +

IVBATT_PA Peak current to be used to dimension decoupling capacitors on pin VBATT

-

80 2500

[mA]

1VV0301485 Rev. 3 Page 33 of 74 2018-12-14 LM960 HW Design Guide 6. DIGITAL SECTION Logic Levels Unless otherwise specified, all the interface circuits of the LM960 are 1.8V CMOS logic. Only USIM interfaces are capable of dual voltage I/O. The following tables show the logic level specifications used in the LM960 interface circuits. The data specified in the tables below is valid throughout all drive strengths and the entire temperature ranges. Caution Do not connect LM960s digital logic signal directly to OEMs digital logic signal with a level higher than 2.3V for 1.8V CMOS signals. 6.1.1. Absolute Maximum Ratings Not Functional 1.8V Pins Absolute Maximum Ratings Parameter Min Max Input level on any digital pin when on Input voltage on analog pins when on

--

--

+2.16V

+2.16 V 6.1.2. Operating Range Interface Levels (1.8V CMOS) 1.8V Standard GPIOs Parameter Min Max Unit Comment VIH VIL Input high level Input low level VOH Output high level VOL Output low level IIL IIH Low-level input leakage current High-level input leakage current IILPU Low-level input leakage current 1.17V

-0.3V 1.35V 0V

-1

--

2.1V 0.63V 1.8V 0.45V

--

1

[V]

[V]

[V]

[V]

[uA]

No pull-up

[uA]

No pull-down

-97.5

-27.5

[uA] With pull-up 1VV0301485 Rev. 3 Page 34 of 74 2018-12-14 LM960 HW Design Guide Parameter Min Max Unit Comment IIHPD High-level input leakage current 27.5 97.5

[uA] With pull-down CI/o I/O capacitance

--

5

[pF]

6.1.3. Operating Range SIM Pins Working at 1.8V 1.8V SIM Card Pins Parameter Min Max Unit Comment VIH Input high level VIL Input low level VOH Output high level VOL Output low level Low-level input leakage current High-level input leakage current IIL IIH 1.26V

-0.3V 1.44V 0V

--

-20 2.1V 0.36V 1.8V 0.4V 1000

[V]

[V]

[V]

[V]

[uA]

No pull-up 20

[uA]

No pull-down 6.1.4. Absolute Maximum Ratings Not Functional 2.85V Pins Absolute Maximum Ratings Parameter Min Max Input level on any digital pin when on Input voltage on analog pins when on

--

--

+3.42V

+3.42 V 6.1.5. Operating Range For SIM Pins Operating at 2.85V SIM Card Pins @2.85V Parameter Min Max Unit Comment VIH VIL Input high level Input low level VOH Output high level VOL Output low level 1VV0301485 Rev. 3 1.995V 3.15V

-0.3V 2.28V 0V 0.57V 2.85V 0.4V

[V]

[V]

[V]

[V]

Page 35 of 74 2018-12-14 LM960 HW Design Guide Parameter Min Max Unit Comment Low-level input leakage current High-level input leakage current IIL IIH Power On

--

1000

[uA]

No pull-up

-20 20

[uA]

No pull-down The LM960 is automatically turning on when the VBATT is supplied. Information To turn on the LM960 module, the SYSTEM_RESET_N pin must not be asserted low. Initialization and Activation State 6.2.1. After turning on the LM960 module, the LM960 is not yet activated because the SW initialization process of the LM960 module is still in process internally. It takes some time to fully complete the HW and SW initialization of the module. For this reason, it is impossible to access LM960 during the Initialization state. As shown in below figure, the LM960 becomes operational (in the Activation state) at least 30 seconds after the VBATT is supplied. LM960 Initialization and Activation Information To check if the LM960 has completely powered on, LM960 and the host must be connected via USB. When USB driver completely loaded, the module has completely powered on and is ready to accept AT commands. Information Active low signals are labeled with a name that ends with _N 1VV0301485 Rev. 3 Page 36 of 74 2018-12-14 LM960 HW Design Guide Information To avoid a back-powering effect, it is recommended to avoid having any HIGH logic level signal applied to the digital pins of the module when it is powered OFF or during an ON/OFF transition. Power Off To turn off the LM960, SYSTEM_RESET_N pad must be asserted low more than 1 seconds and then it should be kept low. When the SYSTEM_RESET_N is asserted low more than 1 seconds, LM960 goes into the finalization state and after the end of the finalization process VREG_L6_1P8 will go to low. Usually, it takes LM960 less than 200 milliseconds from asserting SYSTEM_RESET_N until reaching a complete shutdown. The DTE should monitor the status of VREG_L6_1P8 to observe the actual power-off. Information To completely shut down the LM960 module, the SYSTEM_RESET_N pin must be asserted and kept low. Otherwise, the LM960 will turn on again after shut down. Information To avoid a back-powering effect, it is recommended to avoid having any HIGH logic level signal applied to the digital pins of the module when it is powered OFF or during an ON/OFF transition. Warning Not following the recommended shut-down procedures might damage the device and consequently void the warranty. 1VV0301485 Rev. 3 Page 37 of 74 2018-12-14 LM960 HW Design Guide Shutdown by SYSTEM_RESET_N Pad Below figure shows a simple circuit for this action. Circuit for Shutdown by SYSTEM_RESET_N Reset Reset the device can be done in two different ways:

Graceful Reset by USB AT command AT#REBOOT Unconditional Reset using the SYSTEM_RESET_N Graceful Reset 6.4.1. To gracefully restart the LM960 module, AT#REBOOT AT command must be sent via a USB communication. Graceful Reset by AT#REBOOT 1VV0301485 Rev. 3 Page 38 of 74 2018-12-14 LM960 HW Design Guide Unconditional Hardware Reset 6.4.2. To unconditionally restart the LM960 module, the SYSTEM_RESET_N pin must be asserted low more than 1 seconds and then released. Unconditional Hardware Reset by SYSTEM_RESET_N Pad Information The Unconditional Hardware Reset must be used only as an emergency exit procedure, and not as a normal power-off operation. Information Do not use any pull-up resistor on the RESET_N line or any totem pole digital output. Using a pull-up resistor may cause latch-

up problems on the LM960 power regulator and improper functioning of the module. The RESET_N line must be connected only in an open-

collector configuration. Communication ports Below table summarizes all the hardware interfaces of the LM960 module. LM960 Hardware Interfaces Interface LM960 USB PCIe USIM Super-speed USB3.0 with high-speed USB2.0 Peripheral Component Interconnect Express x2, dual voltage each (1.8V/2.85V) Control Signals W_DISABLE_N, WAKE_N, WAN_LED_N GPIO X4, GPIO 1VV0301485 Rev. 3 Page 39 of 74 2018-12-14 LM960 HW Design Guide I2C Audio I/F I2C (optional) PCM (optional) Antenna ports 4 for Cellular, 1 for GNSS USB Interface 6.5.1. The LM960 module includes super-speed USB3.0 with high-speed USB2.0 backward compatibility. It is compliant with Universal Serial Bus Specification, Revision 3.0 and can be used for control and data transfers as well as for diagnostic monitoring and firmware update. The USB port is typically the main interface between the LM960 module and OEM hardware. USB 3.0 needs series capacitors on the TX lines in both directions for AC coupling. In order to interface USB3.0 with an application board of customer, 0.1uF capacitors should be installed on USB_SS_RX_P/M lines of the LM960. There are already series capacitors on USB_SS_TX_P/M lines inside LM960 module. The USB interface suggested connection is the following:

Connection for USB Interface Information The USB signal traces must be routed carefully. Minimize trace lengths, number of vias, and capacitive loading. The impedance value should be as close as possible to 90 Ohms differential. 1VV0301485 Rev. 3 Page 40 of 74 2018-12-14 LM960 HW Design Guide Warning At power-up, LM960 success to enumerate SS_USB interface. But if a hot-plug is attempted in case of SS_USB, then LM960 may fail to enumerate SS_USB. Information According to the mini PCIe standard, TX/RX of SS USB and PCIe share the same pin (Pin 23, 25, 31, 33) so that can not be used at the same time. Currently PCIe interface is not supported but will be enabled soon. Below table lists the USB interface signals. USB Interface Signals PIN Signal 38 36 33 31 25 23 USB_D+

USB_D-

USB_SS_RX_P USB_SS_RX_M USB_SS_TX_P USB_SS_TX_M I/O I/O I/O I I O O Function Type Comment USB 2.0 Data Plus USB 2.0 Data Minus USB 3.0 super-speed receive plus USB 3.0 super-speed receive minus USB 3.0 super-speed transmit plus USB 3.0 super-speed transmit minus Analog Analog Analog Analog Analog Analog Information Even if USB communication is not used, it is still highly recommended to place an optional USB connector on the application board. At least test points of the USB signals are required since the USB physical communication is needed in the case of SW update. 1VV0301485 Rev. 3 Page 41 of 74 2018-12-14 LM960 HW Design Guide Information Consider placing a low-capacitance ESD protection component to protect LM960 against ESD strikes If an ESD protection should be added, the suggested connectivity is as follows:

ESD Protection for USB2.0 ESD Protection for USB3.0 PCIe Interface 6.5.2. The LM960 will support PCIe interface Below table lists the PCIe interface signals. PCIe Interface Signals 1VV0301485 Rev. 3 Page 42 of 74 2018-12-14 LM960 HW Design Guide PIN Signal I/O Function Type Comment 1 7 11 13 22 23 25 31 33 PCIE_WAKE_N PCIE_CLKREQ_N PCIE_REFCLK_M PCIE_REFCLK_P PCIE_RESET_N PCIE_TX_M PCIE_TX_P PCIE_RX_M PCIE_RX_P I I I O O I I PCIe wake-up O I/O PCIe reference clock request PCIe differential reference signal clock minus PICe differential reference colock plus Analog Analog Analog Analog Functional reset to the card Analog PCIe transmit minus PCIe transmit plus PCIe receive minus PCIe receive plus Analog Analog Analog Analog Information According to the mini PCIe standard, TX/RX of SS USB and PCIe share the same pin (Pin 23, 25, 31, 33) so that can not be used at the same time. Currently PCIe interface is not supported but will be enabled soon. 1VV0301485 Rev. 3 Page 43 of 74 2018-12-14 LM960 HW Design Guide SIM Interface 6.5.3. The LM960 supports two external SIM interfaces (1.8V or 2.85V). Below table lists the SIM interface signals. SIM Interface Signals PIN Signal I/O Function Type Comment SIM Card Interface 1 SIMVCC1 O Supply output for an external UIM1 card 1.8V / 2.85V Power SIMIO1 I/O Data connection with an SIMCLK1 SIMRST1 O O external UIM1 card Clock output to an external UIM1 card Reset output to an external UIM1 card 1.8V / 2.85V 1.8V / 2.85V 1.8V / 2.85V SIMVCC2 O Supply output for an external UIM2 card 1.8 / 2.85V Power SIMIO2 SIMCLK2 SIMRST2 I/O Data connection with an external UIM2 card Clock output to an external UIM2 card Reset output to an external UIM2 card 1.8 / 2.85V 1.8 / 2.85V 1.8 / 2.85V 8 10 12 14 16 19 17 6 SIM Card Interface 2 O O I I Digital I/O (GPIOs) 3 5 GPIO_01 GPIO_02 UIM1 Card Present Detect UIM2 Card Present Detect 1.8V 1.8V GPIO_01 can be used as SIMIN1 GPIO_02 can be used as SIMIN2 6.5.3.1. The following Figures illustrate in particular how the application side should be designed. SIM Schematics SIM Schematic Example 1VV0301485 Rev. 3 Page 44 of 74 2018-12-14 LM960 HW Design Guide Information LM960 contains an internal pull-up resistor on SIMIO. It is not necessary to install external pull up resistor. 6.5.4. The LM960 supports the following control signals:

Control Signals W_DISABLE_N PCIE_WAKE_N WAN_LED_N Below table lists the control signals of LM960. Module Control Signal PIN Signal 20 1 42 W_DISABLE_N PCIE_WAKE_N WAN_LED_N I/O I I/O O Function Type RF disable

(airplane mode) PCIe wake-up LED control Open-drain 1.8V Open-drain Comment Internal VBATT Pull-up 6.5.4.1. W_DISABLE_N The W_DISABLE_N signal is provided to make the LM960 goes into the airplane mode:

Enter into the airplane mode: Low Normal operating mode: High or Leave the W_DISABLE_N not connected LM960 contains an internal VBATT(Nominal 3.3V) pull-up resistor on W_DISABLE_N. 6.5.4.2. WAN_LED_N The WAN_LED_N signal drives the LED output. 1VV0301485 Rev. 3 Page 45 of 74 2018-12-14 LM960 HW Design Guide The recommended WAN_LED_N connection is the following:

Recommended WAN_LED_N connection 6.5.5. The general-purpose I/O pins can be configured to act in three different ways:

General Purpose I/O Input Output Dedicate Function (Customer Requirement) Input pins can only be read and report digital values (high or low) present on the pin at the read time. Output pins can only be written or queried and set the value of the pin output. The following GPIOs are always available as a primary function on the LM960. Below table lists the GPIO signals of LM960. GPIOs Pin no. Signal I/O Function Type 3 5 44 46 GPIO_01 GPIO_02 GPIO_03 GPIO_04 I/O Configurable GPIO I/O Configurable GPIO I/O Configurable GPIO I/O Configurable GPIO Pull-Down 1.8V Pull-Down 1.8V Pull-Down 1.8V Pull-Down 1.8V Drive Strength 2-16 mA 2-16 mA 2-16 mA 2-16 mA Using a GPIO Pin as Input 6.5.5.1. GPIO pins, when used as inputs, can be tied to a digital output of another device and report its status, provided the device interface levels are compatible with the GPIO 1.8V CMOS levels. If a digital output of a device is tied to GPIO input, the pin has interface levels different than 1.8V CMOS. It can be buffered with an open collector transistor with a 47 k pull-up resistor to 1.8V. 1VV0301485 Rev. 3 Page 46 of 74 2018-12-14 LM960 HW Design Guide Using a GPIO Pin as Output 6.5.5.2. GPIO pins, when used as outputs, can drive 1.8V CMOS digital devices or compatible hardware. When set as outputs, the pins have a push-pull output, and therefore the pull-

up resistor can be omitted. GPIO Output Pin Equivalent Circuit I2C Inter-integrated circuit 6.5.6. The LM960 supports an I2C interface on the following pins:

Below table lists the I2C signals of LM960. Module I2C Signal Signal I2C_SCL I2C_SDA PIN 30 32 The I2C interface is used for controlling peripherals inside the module (such as codec, etc.). CMOS 1.8V CMOS 1.8V I2C Clock I2C Data I/O O I/O Function Type Comment Information I2C is supported only on from Modem side as SW emulation of I2C on GPIO lines. Please contact us if you use it. Information If the I2C interface is not used, the signals can be left floating. 1VV0301485 Rev. 3 Page 47 of 74 2018-12-14 LM960 HW Design Guide Using the Temperature Monitor Function The Temperature Monitor permits to monitor the modules internal temperature and, if properly set (see the #TEMPSENS command in LM960 AT Commands Reference Guide

), raises a GPIO to High Logic level when the maximum temperature is reached. 1VV0301485 Rev. 3 Page 48 of 74 2018-12-14 LM960 HW Design Guide 7. RF SECTION Antenna requirements The antenna connection is one of the most important aspect in the full product design as it strongly affects the product overall performance. Hence read carefully and follow the requirements and the guidelines for a proper design. The LM960 is provided with five RF connectors. The available connectors are:

Primary RF antenna #0: Tx and Rx path for low bands and middle bands / 4x4 MIMO path of band41. Primary RF antenna #0: Tx and Rx path for high bands, ultra high bands and band32 / 4x4 MIMO path of band2(band25) and band4(band66) Secondary RF antenna #0: Secondary RF antenna #0: Rx Diversity path for low bands, middle bands / 4x4 MIMO path of band41 / GNSS path Secondary RF antenna #1: Secondary RF antenna #1: Rx Diversity path for high bands, ultra high bands and band32 / 4x4 MIMO path of band2(band25) and band4(band66) GNSS antena: Dedicated GNSS path Primary Antenna Requirements The antenna for the LM960 device must meet the following requirements:

WCDMA / LTE Antenna Requirements Frequency range Depending by frequency band(s) provided by the network operator, the customer shall use the most suitable antenna for that/those band(s) The bands supported by the LM960 is provided in Section 2.2, Product Variants and Frequency Bands. Impedance Input power 50 Ohm

> 24 dBm average power in WCDMA & LTE VSWR absolute max

<= 10:1 VSWR recommended <= 2:1 Secondary Antenna Requirements This product includes an input for a second Rx antenna to improve radio sensitivity. The function is called Antenna Diversity. 1VV0301485 Rev. 3 Page 49 of 74 2018-12-14 LM960 HW Design Guide Antenna Diversity Requirements Frequency range Depending by frequency band(s) provided by the network operator, the customer shall use the most suitable antenna for that/those band(s) The bands supported by the LM960 is provided in Section 2.2, Product Variants and Frequency Bands. Impedance 50 VSWR recommended 2:1 The second Rx antenna should not be located in the close vicinity of main antenna. In order to improve Diversity Gain, Isolation and reduce mutual interaction, the two antennas should be located at the maximum reciprocal distance possible, taking into consideration the available space into the application. For the same reason, the Rx antenna should also be cross-polarized with respect to the main antenna. Isolation between main antenna and Rx antenna must be at least 10 dB in all uplink frequency bands. Envelope Correlation Coefficient (ECC) value should be as close as possible to zero, for best diversity performance. ECC values below 0.5 on all frequency bands are recommended. GNSS Receiver The LM960 integrates a GNSS receiver that could be used in Standalone mode and in A-

GPS (assisted GPS), according to the different configurations. LM960 supports an active antenna. Frequency range Wide-band GNSS:

15591606 MHz recommended GPS:

2.046 MHz BW NB GPS (centered on 1575.42 MHz) Glonass (GLO):

~ 8.3 MHz BW (15971606 MHz) BeiDou (BDS):

4.092 MHz BW (1559.05 1563.14 MHz) Galileo (GAL):

4.092 MHz BW (centered on 1575.42 MHz) Gain 1.5 dBi < Gain < 3 dBi Impedance 50 Ohm Amplification 18 dB < Gain < 21 dB Supply Voltage 3.1 V Current consumption 20 mA Typical 1VV0301485 Rev. 3 Page 50 of 74 2018-12-14 LM960 HW Design Guide 7.4.1. GNSS RF Front End Design The LM960 contains an integrated LNA and pre-select SAW filter. This allows the module to work well with a passive GNSS antenna. If the antenna cannot be located near the LM960, then an active antenna (that is, an antenna with a low noise amplifier built in) can be used with an external dedicated power supply circuit. GNSS rescive path uses either the dedicated GNSS connector or the shared Secondary

#0 antenna connector. NOTE Please refer to the LM960 AT Commands Reference Guide, 80568ST10869A for detailed information about GNSS operating modes and GNSS Antenna selection. Antenna connection Support bands in antenna port 7.5.1. The LM960 has an assigned band depending on the antenna port. The supported bands are:

Primary RF antenna #0: B1, B2(B25), B3, B4(B66), B5(B26,B18,B19), B8, B12(B17), B13, B14, B20, B28, B29, B39, B71, B41 for 4 x 4 MIMO Primary RF antenna #1: B7, B30, B32, B38, B40, B41, B42, B43, B46, B48, B2(B25) for 4 x 4 MIMO, B4(B66) for 4 x 4 MIMO Secondary RF antenna #0: B1, B2(B25), B3, B4(B66), B5(B26,B18,B19), B8, B12(B17), B13, B14, B20, B28, B29, B39, B71, B41 for 4 x 4 MIMO / GNSS Secondary RF antenna #1: B7, B30, B32, B38, B40, B41, B42, B43, B46, B48, B25(B2) for 4 x 4 MIMO, B66(B4) for 4 x 4 MIMO GNSS antenna: Dedicated GNSS See the picture on the below for their position on the interface. 1VV0301485 Rev. 3 Page 51 of 74 2018-12-14 LM960 HW Design Guide Antenna Connector 7.5.2. The LM960 is equipped with a set of 50 RF MHF4 connectors from I-PEX 20449-001. For more information about mating connectors visit the website https://www.i-pex.com Antenna Cable 7.5.3. Connecting cables between the module and the antenna must have 50 impedance. If the impedance of the module is mismatched, RF performance is reduced significantly. If the host device is not designed to use the modules GNSS antenna, terminate the interface with a 50 load. Minimize Antenna Cable Requirements Impedance 50 Ohm Max cable loss Less than 0.5 dB Avoid coupling with other signals. Antenna Installation Guidelines 7.5.4. The antenna must be installed such that it provides a separation distance of at Install the antenna in a location with access to the network radio signal. least 20 cm from all persons and must not be co-located or operating in conjunction with any other antenna or transmitter. The antenna must not be installed inside metal cases. The antenna must be installed according to the antenna manufacturers instructions. Furthermore, if the device is developed for the US and/or Canada market, it must comply with the FCC and/or IC approval requirements. 1VV0301485 Rev. 3 Page 52 of 74 2018-12-14 LM960 HW Design Guide Information This device is to be used only for mobile and fixed application. The antenna(s) used for this transmitter must be installed to provide a separation distance of at least 20 cm from all persons and must not be co-located or operating in conjunction with any other antenna or transmitter. End-Users must be provided with transmitter operation conditions for satisfying RF exposure compliance. OEM integrators must ensure that the end user has no manual instructions to remove or install the LM960 module. Antennas used for this OEM module must not exceed gain of below table for mobile and fixed operating configurations. In the event that these conditions cannot be met (for example certain laptop configurations or co-location with another transmitter), then the FCC/IC authorization is no longer considered valid and the FCC/IC ID cannot be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product

(including the transmitter) and obtaining a separate FCC/IC authorization. Manual Information to the End User The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the users manual of the end product which integrates this module. The end user manual regulatory include all information/warning as show in this manual. required shall 1VV0301485 Rev. 3 Page 53 of 74 2018-12-14 LM960 HW Design Guide 8. AUDIO SECTION Audio Interface The LM960 module supports digital audio interfaces. Digital Audio The LM960 module can be connected to an external codec through the digital interface. The product provides a single Digital Audio Interface on the following pins:

Digital Audio Interface Signals Pin no. Signal I/O Function Type COMMENT 51 49 47 45 DVI_WAO DVI_RX DVI _TX DVI _CLK O I O O PCM Frame Sync B-PD 1.8V PCM Data In B-PD 1.8V PCM Data Out B-PD 1.8V PCM Clock B-PD 1.8V LM960 PCM has the following characteristics:

PCM Master mode using short or long frame sync modes 16 bit linear PCM format PCM clock rates of 256 kHz, 512 kHz, 1024 kHz and 2048 kHz (Default) Frame size of 8, 16, 32, 64, 128 & 256 bits per frame Sample rates of 8 kHz and 16 kHz NOTE If the Digital Audio Interface is not used, the signals can be left floating. 1VV0301485 Rev. 3 Page 54 of 74 2018-12-14 LM960 HW Design Guide 9. MECHANICAL DESIGN General The LM960 module was designed to be compliant with a standard lead-free SMT process. Moreover, it is compatible with the Mini PCIe card 52-pin card edge-type connector. Finishing & Dimensions The LM960 modules overall dimensions are:

50.95 mm Length:

30.00 mm Width:

Thickness: 2.70 mm The module complies with the standard dimensions specified in the PCI Express Mini Card Electromechanical Specification Revision 1.1 Drawing This figure shows the mechanical dimensions of the LM960 module. 1VV0301485 Rev. 3 Page 55 of 74 2018-12-14 LM960 HW Design Guide 10. APPLICATION GUIDE Debug of the LM960 Module in Production To test and debug the mounting of the LM960 module, we strongly recommend to add several test pins on the host PCB for the following purposes:

Checking the connection between the LM960 itself and the application Testing the performance of the module by connecting it with an external computer Depending on the customer application, these test pins include, but are not limited to the following signals:

SYSTEM_RESET_N, W_DISABLE_N, PCIE_WAKE_N VBATT, GND VREG_L6_1P8 USB_D-, USB_D+

USB_SS_TX_M, USB_SS_TX_P, USB_SS_RX_M, USB_SS_RX_P PCIE_TX_M, PCIE_TX_P, PCIE_RX_M, PCIE_RX_P In addition, the following signals are also recommended (but not mandatory):

WAN_LED_N GPIO_01, GPIO_02, GPIO_03, GPIO_04 Bypass Capacitor on Power Supplies When a sudden voltage step is asserted to or a cut from the power supplies, the steep transition causes some reactions such as overshoot and undershoot. This abrupt voltage transition can affect the device causing it to not operate or to malfunction. Bypass capacitors are needed to alleviate this behavior. The behavior can appear differently depending on the various applications. Customers must pay special attention to this issue when they design their application board. The length and width of the power lines must be considered carefully, and the capacitance of the capacitors must be selected accordingly. The capacitor will also prevent ripple of the power supplies and the switching noise caused in TDMA systems such as GSM. Especially, a suitable bypass capacitor must be mounted on the following lines on the application board:

VBATT Recommended values are:

100uF for VBATT Customers must still consider that the capacitance mainly depends on the conditions of their application board. Generally, more capacitance is required when the power line is longer. And if customers use the fast power down function, then more bypass capacitors should be mounted on the application board. 1VV0301485 Rev. 3 Page 56 of 74 2018-12-14 LM960 HW Design Guide EMC Recommendations EMC protection on the pins in the table below should be designed by application side according to the customers requirement. EMC Recommendations Pin Signal I/O Function Type Comment USB HS 2.0 Communication Port 38 36 USB_D+

I/O USB 2.0 Data Plus Analog USB_D-

I/O USB 2.0 Data Minus Analog USB SS 3.0 Communication and PCIe Port 33 USB/PCIE_RX_P 31 USB/PCIE_RX_M I I 25 USB/PCIE_TX_P O 23 USB/PCIE_TX_M O SIM Card Interface 1 USB 3.0 super-

speed/PCIe receive plus USB 3.0 super-

speed/PCIe receive minus USB 3.0 super-

speed/PCIe transmit plus USB 3.0 super-

speed/PCIe transmit minus Analog Analog Analog Analog 14 12 SIMRST1 SIMCLK1 O O Reset output to an external UIM1 card 1.8 / 2.85V Clock output to an external UIM1 card 1.8 / 2.85V 1VV0301485 Rev. 3 Page 57 of 74 2018-12-14 LM960 HW Design Guide 10 8 SIMIO1 I/O Data connection with 1.8 / 2.85V an external UIM1 card SIMVCC1 O Supply output for an external UIM1 card 1.8 / 2.85V Power SIM Card Interface 2 6 17 19 16 SIMRST2 SIMCLK2 SIMIO2 O O Reset output to an external UIM2 card 1.8 / 2.85V Clock output to an external UIM2 card 1.8 / 2.85V I/O Data connection with 1.8 / 2.85V an external UIM2 card SIMVCC2 O Supply output for an external UIM2 card 1.8 / 2.85V Power Digital I/O (GPIOs) 3 5 44 46 1 42 GPIO_01 I/O General purpose I/O 1.8V GPIO_02 I/O General purpose I/O 1.8V GPIO_03 I/O General purpose I/O 1.8V GPIO_04 I/O General purpose I/O 1.8V PCIE_WAKE_N I/O PCIe wake-up 1.8V Active Low WAN_LED_N O LED control Open-drain Active Low Power ON/OFF Reset IN/OUT 20 W_DISABLE_N I RF ON/OFF Control Open-drain Active Low

(internal VBATT pull up) 1VV0301485 Rev. 3 Page 58 of 74 2018-12-14 LM960 HW Design Guide 22 48 PCIE_RESET_N SYSTEM_RESET_N I I PCIe Reset Input Reset Input 1.8V 1.8V Active Low Active Low 1.8V Voltage Regulator 28 VREG_L6_1P8 O LDO out for 1.8V Power All other pins have the following characteristics:

Human Body Model (HBM): 1000 V Charged Device Model (CDM) JESD22-C101-C: 250 V All Antenna pins up to 4 kV Warning Do not touch without proper electrostatic protective equipment. The product must be handled with care, avoiding any contact with the pins because electrostatic discharge may damage the product itself. 1VV0301485 Rev. 3 Page 59 of 74 2018-12-14 LM960 HW Design Guide 11. PACKAGING Tray The LM960 modules are packaged on trays of 20 pieces each. These trays can be used in SMT processes for pick & place handling. 1VV0301485 Rev. 3 Page 60 of 74 2018-12-14 LM960 HW Design Guide 1VV0301485 Rev. 3 Page 61 of 74 2018-12-14 LM960 HW Design Guide 12. CONFORMITY ASSESSMENT ISSUES Approvals Fully type approved confirming with RE Directive (Directive 2014/53/EU) CE, GCF FCC, IC, PTCRB RoHS and REACH Approvals for major Mobile Network Operators Declaration of Conformity The DoC is available here: www.telit.com/RED/

FCC certificates The FCC Certifcate is available here: www.fcc.gov/oet/ea/fccid IC certificates The IC Certifcate is available here:

https://sms-sgs.ic.gc.ca/equipmentSearch/searchRadioEquipments?execution=e1s1&lang=en FCC/IC Regulatory notices Modification statement Telit has not approved any changes or modifications to this device by the user. Any changes or modifications could void the users authority to operate the equipment. Telit napprouve aucune modification apporte lappareil par lutilisateur, quelle quen soit la nature. Tout changement ou modification peuvent annuler le droit dutilisation de lappareil par lutilisateur. Interference statement This device complies with Part 15 of the FCC Rules and Industry Canada licence-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device. Le prsent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorise aux deux conditions suivantes : (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout 2018-12-14 1VV0301485 Rev. 3 Page 62 of 74 LM960 HW Design Guide brouillage radiolectrique subi, mme si le brouillage est susceptible d'en compromettre le fonctionnement. RF exposure This equipment complies with FCC and ISED radiation exposure limits set forth for an uncontrolled environment. The antenna should be installed and operated with minimum distance of 20 cm between the radiator and your body. Antenna gain must be below:

Cet appareil est conforme aux limites d'exposition aux rayonnements de lISED pour un environnement non contrl. L'antenne doit tre install de faon garder une distance minimale de 20 centimtres entre la source de rayonnements et votre corps. Gain de l'antenne doit tre ci-dessous:

This radio transmitter FCCID: RI7LM960 has been approved by FCC to opeate with the antenna types listed below with the maximum permissible gain and required antenna impedance for each antenna type indicated. Antenna types not included in this list, having a gain greater than the maximum gain indicated for type, are strictly prohibited for use with this device. This radio transmitter IC: 5131A-LM960 has been approved by Industry Canada to opeate with the antenna types listed below with the maximum permissible gain and required antenna impedance for each antenna type indicated. Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited for use with this device. Cet metteur radio IC: 5131A-LM960 a t approuv par Industrie Canada pour fonctionner avec les types d'antennes numrs ci-dessous avec le gain maximal admissible et impdance d'antenne requise pour chaque type d'antenne indiqu. Types d'antennes nest pas inclus dans cette liste, ayant un gain suprieur au gain maximal indiqu pour ce type, sont strictement interdits pour une utilisation avec cet appareil. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. L'metteur ne doit pas tre colocalis ni fonctionner conjointement avec autre antenne ou autre metteur. 1VV0301485 Rev. 3 Page 63 of 74 2018-12-14 LM960 HW Design Guide Antenna List No. Manufacturer Part No. Antenna Type Peak Gain 1 HNS WE14-LF-07 Dipole 3.5 dBi for 1420 ~ 2200 MHz 1.5 dBi for 617 ~ 960 MHz HNS WE14-S3-1 Dipole 3 dBi for 2300 ~ 2690 MHz 4 dBi for 1420 ~ 2200 MHz 1 dBi for 2300 ~ 2400 MHz 3 dBi for 2498 ~ 2690 MHz 3 dBi for 5150 ~ 5928 MHz HNS WE14-S3-2 Dipole 1 dBi for CBRS(3550 ~ 3700 MHz) 2 3 Note: The antenna connector is SMA(Male) type. FCC Class B digital device notice This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

Reorient or relocate the receiving antenna. Connect the equipment into an outlet on a circuit different from that to which the Increase the separation between the equipment and receiver. receiver is connected. Consult the dealer or an experienced radio/TV technician for help. 1VV0301485 Rev. 3 Page 64 of 74 2018-12-14 LM960 HW Design Guide Labelling Requirements for the Host device The host device shall be properly labelled to identify the modules within the host device. The certification label of the module shall be clearly visible at all times when installed in the host device, otherwise the host device must be labelled to display the FCC ID and ISED of the module, preceded by the words "Contains transmitter module", or the word "Contains", or similar wording expressing the same meaning, as follows:

L'appareil hte doit tre tiquet comme il faut pour permettre l'identification des modules qui s'y trouvent. L'tiquette de certification du module donn doit tre pose sur l'appareil hte un endroit bien en vue en tout temps. En l'absence d'tiquette, l'appareil hte doit porter une tiquette donnant le FCC ID et lISED du module, prcd des mots Contient un module d'mission , du mot Contient ou d'une formulation similaire exprimant le mme sens, comme suit :

LM960 Contains FCC ID: RI7LM960 Contains IC: 5131A-LM960 CAN ICES-3 (B) / NMB-3 (B) This Class B digital apparatus complies with Canadian ICES-003. Cet appareil numrique de classe B est conforme la norme canadienne ICES-003. RED Regulatory notices RF Exposure Information (MPE) This device has been tested and meets applicable limits for Radio Frequency (RF) exposure. To comply with the RF exposure requirements, this module must be installed in a host platform that is intended to be operated in a minimum of 20 cm separation distance to the user. OEM/Host manufacturer responsibilities OEM/Host manufacturers are ultimately responsible for the compliance of the Host and Module. The final product must be reassessed against all the essential requirements of the RED before it can be placed on the EU market. This includes reassessing the transmitter module for compliance with the Radio and EMF essential requirements of the RED. This 1VV0301485 Rev. 3 Page 65 of 74 2018-12-14 LM960 HW Design Guide module must not be incorporated into any other device or system without retesting for compliance as multi-radio and combined equipment. The allowable Antenna Specipication In all cases assessment of the final product must be met against the Essential requirements of the RE Directive Articles 3.1(a) and (b), safety and EMC respectively, as well as any relevant Article 3.3 requirements. 1. The following antenna was verified in the conformity testing, and for compliance the antenna shall not be modified. A separate approval is required for all other operating configurations, including different antenna configurations. 2. If any other simultaneous transmission radio is installed in the host platform together with this module, or above restrictions cannot be kept, a separate RF exposure assessment and CE equipment certification is required. Waste Electrical and Electronic Equipment (WEEE) This symbol means that according to local laws and regulations your product and/or its battery shall be disposed of separately from household waste. When this product reaches its end of life, take it to a collection point designated by local authorities. Proper recycling of your product will protect human health and the environment. 1VV0301485 Rev. 3 Page 66 of 74 2018-12-14 LM960 HW Design Guide 13. SAFETY RECOMMENDATIONS READ CAREFULLY Be sure the use of this product is allowed in the country and in the environment required. The use of this product may be dangerous and has to be avoided in the following areas:

Where it can interfere with other electronic devices in environments such as hospitals, airports, aircrafts, etc. Where there is risk of explosion such as gasoline stations, oil refineries, etc. It is the responsibility of the user to enforce the country regulation and the specific environment regulation. Do not disassemble the product; any mark of tampering will compromise the warranty validity. We recommend following the instructions of the hardware user guides for correct wiring of the product. The product has to be supplied with a stabilized voltage source and the wiring has to be conformed to the security and fire prevention regulations. The product has to be handled with care, avoiding any contact with the pins because electrostatic discharges may damage the product itself. Same cautions have to be taken for the SIM, checking carefully the instruction for its use. Do not insert or remove the SIM when the product is in power saving mode. The system integrator is responsible for the functioning of the final product; therefore, care has to be taken to the external components of the module, as well as any project or installation issue, because the risk of disturbing the LTE & WCDMA network or external devices or having impact on the security. Should there be any doubt, please refer to the technical documentation and the regulations in force. Every module has to be equipped with a proper antenna with specific characteristics. The antenna has to be installed with care in order to avoid any interference with other electronic devices and has to guarantee a minimum distance from the body (20 cm). In case this requirement cannot be satisfied, the system integrator has to assess the final product against the SAR regulation. The European Community provides some Directives for the electronic equipment introduced on the market. All of the relevant information is available on the European Community website:

https://ec.europa.eu/commission/index_en The text of the Directive 2014/35/EU regarding telecommunication equipment is available, while the applicable Directives (Low Voltage and EMC) are available at:

http://ec.europa.eu/enterprise/sectors/electrical/

1VV0301485 Rev. 3 Page 67 of 74 2018-12-14 LM960 HW Design Guide 14. RF Bands Characteristics REFERENCE TABLE OF RF BANDS CHARACTERISTICS Mode Freq. Tx

(MHz) Freq. Rx

(MHz) Channels WCDMA 2100 B1 WCDMA 1900 B2 WCDMA AWS B4 1920 ~ 1980 2110 ~ 2170 1850 ~ 1910 1930 ~ 1990 1710 ~ 1755 2110 ~ 2155 WCDMA 850 B5 824 ~ 849 869 ~ 894 WCDMA 900 B8 880 ~ 915 925 ~ 960 Tx: 9612 ~ 9888 Rx: 10562 ~ 10838 Tx: 9262 ~ 9538 Rx: 9662 ~ 9938 Tx: 1537 ~ 1738 Rx: 1312 ~ 1513 Tx: 4132 ~ 4233 Rx: 4357 ~ 4458 Tx: 2712 ~ 2863 Rx: 2937 ~ 3088 WCDMA 1800 Japan B9 WCDMA 800 Japan B19 1750 ~ 1784.8 1845 ~ 1879.8 Tx: 8762 ~ 8912 Rx: 9237 ~ 9387 830 ~ 845 875 ~ 890 LTE 2100 B1 1920 ~ 1980 2110 ~ 2170 LTE 1900 B2 1850 ~ 1910 1930 ~ 1990 LTE 1800+ B3 1710 ~ 1785 1805 ~ 1880 LTE AWS-1 B4 1710 ~ 1755 2110 ~ 2155 LTE 850 B5 824 ~ 849 869 ~ 894 LTE 2600 B7 2500 ~ 2570 2620 ~ 2690 Tx: 312 ~ 363 Rx: 712 ~ 763 Tx: 18000 ~ 18599 Rx: 0 ~ 599 Tx: 18600 ~ 19199 Rx: 600 ~ 1199 Tx: 19200 ~ 19949 Rx: 1200 ~ 1949 Tx: 19950 ~ 20399 Rx: 1950 ~ 2399 Tx: 20400 ~ 20649 Rx: 2400 ~ 2649 Tx: 20750 ~ 21449 Rx: 2750 ~ 3449 Tx-Rx Offset 190 MHz 80 MHz 400 MHz 45 MHz 45 MHz 95 MHz 45 MHz 190 MHz 80 MHz 95 MHz 400 MHz 45 MHz 120 MHz LTE 900 B8 880 ~ 915 925 ~ 960 Tx: 21450 ~ 21799 Rx: 3450 ~ 3799 45 MHz 1VV0301485 Rev. 3 Page 68 of 74 2018-12-14 LM960 HW Design Guide Mode Freq. Tx

(MHz) Freq. Rx

(MHz) Channels LTE 700a B12 699 ~ 716 729 ~ 746 LTE 700c B13 777 ~ 787 746 ~ 756 LTE 700PS B14 788 ~ 798 758 ~ 768 LTE 700b B17 704 ~ 716 734 ~ 746 LTE 800 Lower B18 LTE 800 Upper B19 815 ~ 830 860 ~ 875 830 ~ 845 875 ~ 890 LTE 800 B20 832 ~ 862 791 ~ 821 LTE 1900+ B25 1850 ~ 1915 1930 ~ 1995 LTE 850+ B26 814 ~ 849 859 ~ 894 LTE 700 APT B28 703 ~ 748 758 ~ 803 Tx : 23010 ~ 23179 Rx : 5010 ~ 5179 Tx : 27210 ~ 27659 Rx : 9210 ~ 9659 Tx : 23280 ~ 23379 Rx : 5280 ~ 5379 Tx: 23730 ~ 23849 Rx: 5730 ~ 5849 Tx: 23850 ~ 23999 Rx: 5850 ~ 5999 Tx: 24000 ~ 24149 Rx: 6000 ~ 6149 Tx: 24150 ~ 24449 Rx: 6150 ~ 6449 Tx: 8040 ~ 8689 Rx: 26040 ~ 26689 Tx: 8690 ~ 9039 Rx: 26690 ~ 27039 Tx: 9210 ~ 9659 Rx: 27210 ~ 27659 Tx-Rx Offset 30 MHz

-31 MHz

-30 MHz 30 MHz 45 MHz 45 MHz

-41 MHz 80 MHz 45 MHz 55 MHz LTE 700 d B29 Downlink only 717 ~ 728 Rx: 9660 ~ 9769 LTE 2300 WCS B30 LTE 1500 L-band B32 2305 ~ 2315 2350 ~ 2360 Tx: 9770 ~ 9869 Rx: 27660 ~ 27759 45 MHz Downlink only 1452 ~ 1496 Rx: 9920 ~ 10359 LTE AWS-3 B66 1710 ~ 1780 2110 ~ 2200 LTE 600 B71 663 ~ 698 617 ~ 652 Tx: 66436 ~ 67335 Rx: 131972 ~ 132671 400 MHz Tx: 133122 ~ 133471 Rx: 68586 ~ 68935

-46 MHz 1VV0301485 Rev. 3 Page 69 of 74 2018-12-14 LM960 HW Design Guide Mode Freq. Tx

(MHz) Freq. Rx

(MHz) Channels Tx-Rx Offset 2570 ~ 2620 1880 ~ 1920 2300 ~ 2400 2496 ~ 2690 3400 ~ 3600 3600 ~ 3700 T/Rx: 37750 ~ 38250 T/Rx: 38250 ~ 38649 T/Rx: 38650 ~ 39650 T/Rx: 39650 ~ 41589 T/Rx: 41590 ~ 43589 T/Rx: 43590 ~ 45589 Downlink only 5150 ~ 5925 Rx: 46790 ~ 54539 3550 ~ 3700 T/Rx: 55240 ~ 56739 LTE TDD 2600 B38 LTE TDD 1900+

B39 LTE TDD 2300 B40 LTE TDD 2500 B41 LTE TDD 3500 B42 LTE TDD 3700 B43 LTE TDD Unlicensed B46 LTE TDD 3600 B48 1VV0301485 Rev. 3 Page 70 of 74 2018-12-14 LM960 HW Design Guide ACRONYMS 15. TTSC USB HS DTE UMTS WCDMA HSDPA HSUPA UART HSIC SIM SPI ADC DAC I/O GPIO CMOS MOSI MISO CLK MRDY Telit Technical Support Centre Universal Serial Bus High Speed Data Terminal Equipment Universal Mobile Telecommunication System Wideband Code Division Multiple Access High Speed Downlink Packet Access High Speed Uplink Packet Access Universal Asynchronous Receiver Transmitter High Speed Inter Chip Subscriber Identification Module Serial Peripheral Interface Analog Digital Converter Digital Analog Converter Input Output General Purpose Input Output Complementary Metal Oxide Semiconductor Master Output Slave Input Master Input Slave Output Clock Master Ready 1VV0301485 Rev. 3 Page 71 of 74 2018-12-14 LM960 HW Design Guide SRDY CS RTC PCB ESR VSWR VNA FDD I2C LTE SOC Slave Ready Chip Select Real Time Clock Printed Circuit Board Equivalent Series Resistance Voltage Standing Wave Radio Vector Network Analyzer Frequency division duplex Inter-integrated circuit Long term evolution System-on-Chip 1VV0301485 Rev. 3 Page 72 of 74 2018-12-14 LM960 HW Design Guide 16. DOCUMENT HISTORY Revision Date Changes 2018-2-09 First Draft 0 1 2 2018-5-30 2018-7-05 3 2018-12-14 Sec 1.5 Some of Docs Referrence Number Is Updated Sec 3.3 Pin Layout Updated Sec 4.2 Current Consumption Updated Sec 6 Power On, Power Off, Reset Updated Sec 2.2.1 RF Bands per Regional Variant Upda ted Sec 2.6 Tx output power Updated Sec 2.7 Rx sensitivity Updated Sec 2.8.2 Weight Updated Sec 4.2 Current Consumption Updated Sec 6.5.1 USB Block Diagram Updated Sec 6.5.2 PCIe Block Diagram Updated Sec 6.5.4 PCIE_WAKE_N Section Deleted Sec 7.1 Antenna Requirements Updated Sec 9.3 Drawing Updated Sec 12.5 FCC/IC Regulatory notices Updated Sec 14 Reference Table of RF Bands Characteristic Updated Sec 2 General product description Updated Sec 2.2.1 RF Bands per Regional Variant Upda ted 1VV0301485 Rev. 3 Page 73 of 74 2018-12-14

]

7 1 0 2

. 1 0

[

Mod.0818 2017-01 Rev.0

LM960 HW Design Guide 1VV0301485 Rev.1 2018-05-31

]

7 1 0 2

. 1 0

[

Mod.0818 2017-01 Rev.0 LM960 HW Design Guide SPECIFICATIONS ARE SUBJECT TO CHANGE WITHOUT NOTICE NOTICE While reasonable efforts have been made to assure the accuracy of this document, Telit assumes no liability resulting from any inaccuracies or omissions in this document, or from use of the information obtained herein. The information in this document has been carefully checked and is believed to be reliable. However, no responsibility is assumed for inaccuracies or omissions. Telit reserves the right to make changes to any products described herein and reserves the right to revise this document and to make changes from time to time in content hereof with no obligation to notify any person of revisions or changes. Telit does not assume any liability arising out of the application or use of any product, software, or circuit described herein; neither does it convey license under its patent rights or the rights of others. It is possible that this publication may contain references to, or information about Telit products (machines and programs), programming, or services that are not announced in your country. Such references or information must not be construed to mean that Telit intends to announce such Telit products, programming, or services in your country. COPYRIGHTS This instruction manual and the Telit products described in this instruction manual may be, include or describe copyrighted Telit material, such as computer programs stored in semiconductor memories or other media. Laws in the Italy and other countries preserve for Telit and its licensors certain exclusive rights for copyrighted material, including the exclusive right to copy, reproduce in any form, distribute and make derivative works of the copyrighted material. Accordingly, any copyrighted material of Telit and its licensors contained herein or in the Telit products described in this instruction manual may not be copied, reproduced, distributed, merged or modified in any manner without the express written permission of Telit. Furthermore, the purchase of Telit products shall not be deemed to grant either directly or by implication, estoppel, or otherwise, any license under the copyrights, patents or patent applications of Telit, as arises by operation of law in the sale of a product. COMPUTER SOFTWARE COPYRIGHTS The Telit and 3rd Party supplied Software (SW) products described in this instruction manual may include copyrighted Telit and other 3rd Party supplied computer programs stored in semiconductor memories or other media. Laws in the Italy and other countries preserve for Telit and other 3rd Party supplied SW certain exclusive rights for copyrighted computer programs, including the exclusive right to copy or reproduce in any form the copyrighted computer program. Accordingly, any copyrighted Telit or other 3rd Party supplied SW computer programs contained in the Telit products described in this instruction manual may not be copied (reverse engineered) or reproduced in any manner without the express written permission of Telit or the 3rd Party SW supplier. Furthermore, the purchase of Telit products shall not be deemed to grant either directly or by implication, estoppel, or otherwise, any license under the copyrights, patents or patent applications of Telit or other 3rd Party supplied SW, except for the normal non-exclusive, royalty free license to use that arises by operation of law in the sale of a product. 1VV0301485 Rev. 1 Page 2 of 73 2018-05-31 LM960 HW Design Guide USAGE AND DISCLOSURE RESTRICTIONS I. License Agreements The software described in this document is the property of Telit and its licensors. It is furnished by express license agreement only and may be used only in accordance with the terms of such an agreement. II. Copyrighted Materials Software and documentation are copyrighted materials. Making unauthorized copies is prohibited by law. No part of the software or documentation may be reproduced, transmitted, transcribed, stored in a retrieval system, or translated into any language or computer language, in any form or by any means, without prior written permission of Telit III. High Risk Materials Components, units, or third-party products used in the product described herein are NOT fault-tolerant and are NOT designed, manufactured, or intended for use as on-line control equipment in the following hazardous environments requiring fail-safe controls: the operation of Nuclear Facilities, Aircraft Navigation or Aircraft Communication Systems, Air Traffic Control, Life Support, or Weapons Systems (High Risk Activities"). Telit and its supplier(s) specifically disclaim any expressed or implied warranty of fitness for such High Risk Activities. IV. Trademarks TELIT and the Stylized T Logo are registered in Trademark Office. All other product or service names are the property of their respective owners. V. Third Party Rights The software may include Third Party Right software. In this case you agree to comply with all terms and conditions imposed on you in respect of such separate software. In addition to Third Party Terms, the disclaimer of warranty and limitation of liability provisions in this License shall apply to the Third Party Right software. TELIT HEREBY DISCLAIMS ANY AND ALL WARRANTIES EXPRESS OR IMPLIED FROM ANY THIRD PARTIES REGARDING ANY SEPARATE FILES, ANY THIRD PARTY MATERIALS INCLUDED IN THE SOFTWARE, ANY THIRD PARTY MATERIALS FROM WHICH THE SOFTWARE IS DERIVED (COLLECTIVELY OTHER CODE), AND THE USE OF ANY OR ALL THE OTHER CODE IN CONNECTION WITH THE SOFTWARE, INCLUDING

(WITHOUT LIMITATION) ANY WARRANTIES OF SATISFACTORY QUALITY OR FITNESS FOR A PARTICULAR PURPOSE. NO THIRD PARTY LICENSORS OF OTHER CODE SHALL HAVE ANY LIABILITY FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING WITHOUT LIMITATION LOST PROFITS), HOWEVER CAUSED AND WHETHER MADE UNDER CONTRACT, TORT OR OTHER LEGAL THEORY, ARISING IN ANY WAY OUT OF THE USE OR DISTRIBUTION OF THE OTHER CODE OR THE EXERCISE OF ANY RIGHTS GRANTED UNDER EITHER OR BOTH THIS LICENSE AND THE LEGAL TERMS APPLICABLE TO ANY SEPARATE FILES, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. 1VV0301485 Rev. 1 Page 3 of 73 2018-05-31 LM960 HW Design Guide Applicability Table PRODUCTS LM960 1VV0301485 Rev. 1 Page 4 of 73 2018-05-31 LM960 HW Design Guide Contents NOTICE 2 COPYRIGHTS .................................................................................................. 2 COMPUTER SOFTWARE COPYRIGHTS ....................................................... 2 USAGE AND DISCLOSURE RESTRICTIONS ................................................ 3 APPLICABILITY TABLE .................................................................................. 4 CONTENTS ...................................................................................................... 5 1. 2. 2.2.1. 2.8.1. 2.8.2. 2.9.1. 2.9.2. 3. INTRODUCTION ............................................................................ 9 Scope ............................................................................................. 9 Audience ........................................................................................ 9 Contact Information, Support ......................................................... 9 Text Conventions ......................................................................... 11 Related Documents ...................................................................... 12 GENERAL PRODUCT DESCRIPTION ........................................ 13 Overview ...................................................................................... 13 Product Variants and Frequency Bands ....................................... 13 RF Bands per Regional Variant .................................................... 13 Target market ............................................................................... 15 Main features ................................................................................ 15 Block Diagram .............................................................................. 17 TX Output Power .......................................................................... 17 RX Sensitivity ............................................................................... 18 Mechanical specifications ............................................................. 19 Dimensions ................................................................................... 19 Weight .......................................................................................... 19 Environmental Requirements ....................................................... 19 Temperature Range ..................................................................... 19 RoHS Compliance ........................................................................ 20 PINS ALLOCATION .................................................................... 21 Pin-out .......................................................................................... 21 LM960 Signals That Must Be Connected ..................................... 25 Pin Layout .................................................................................... 26 1VV0301485 Rev. 1 Page 5 of 73 2018-05-31 LM960 HW Design Guide 4. 4.3.1. 4.3.1.1. 4.3.2. 4.3.3. 5. POWER SUPPLY ........................................................................ 27 Power Supply Requirements ........................................................ 27 Power Consumption ..................................................................... 27 General Design Rules .................................................................. 28 Electrical Design Guidelines ......................................................... 28

+ 5V Input Source Power Supply Design Guidelines ................ 28 Thermal Design Guidelines .......................................................... 29 Power Supply PCB layout Guidelines .......................................... 30 RTC .............................................................................................. 30 Reference Voltage ........................................................................ 31 Internal LDO for GNSS bias ......................................................... 31 ELECTRICAL SPECIFICATIONS ................................................ 32 Absolute Maximum Ratings Not Operational ............................. 32 Recommended Operating Conditions .......................................... 32 6. 6.2.1. 6.4.1. 6.4.2. 6.1.1. 6.1.2. 6.1.3. 6.1.4. 6.1.5. DIGITAL SECTION ...................................................................... 33 Logic Levels ................................................................................. 33 1.8V Pins Absolute Maximum Ratings ...................................... 33 1.8V Standard GPIOs ................................................................... 33 1.8V SIM Card Pins ...................................................................... 34 2.85V Pins Absolute Maximum Ratings .................................... 34 SIM Card Pins @2.85V ................................................................ 34 Power On ..................................................................................... 35 Initialization and Activation State .................................................. 35 Power Off ..................................................................................... 36 Reset ............................................................................................ 37 Graceful Reset ............................................................................. 37 Unconditional Hardware Reset ..................................................... 38 Communication ports ................................................................... 38 USB Interface ............................................................................... 39 6.5.1. PCIe Interface .............................................................................. 41 6.5.2. SIM Interface ................................................................................ 43 6.5.3. SIM Schematic Example .............................................................. 43 6.5.3.1. 6.5.4. Control Signals ............................................................................. 44 6.5.4.1. W_DISABLE_N ............................................................................ 44 6.5.4.2. PCIE_WAKE_N ............................................................................ 45 6.5.4.3. WAN_LED_N ............................................................................... 45 6.5.5. General Purpose I/O .................................................................... 45 1VV0301485 Rev. 1 Page 6 of 73 2018-05-31 LM960 HW Design Guide 6.5.5.1. 6.5.5.2. 6.5.6. 7. 7.4.1. 7.5.1. 7.5.2. 7.5.3. 7.5.4. 8. 9. 10. 11. 12. Using a GPIO Pin as Input ........................................................... 46 Using a GPIO Pin as Output ........................................................ 46 I2C Inter-integrated circuit ......................................................... 47 Using the Temperature Monitor Function ..................................... 47 RF SECTION ................................................................................ 48 Antenna requirements .................................................................. 48 Primary Antenna Requirements ................................................... 48 Secondary Antenna Requirements............................................... 48 GNSS Receiver ............................................................................ 49 GNSS RF Front End Design......................................................... 49 Antenna connection ...................................................................... 50 Support bands in antenna port ..................................................... 50 Antenna Connector ...................................................................... 50 Antenna Cable .............................................................................. 50 Antenna Installation Guidelines .................................................... 51 AUDIO SECTION ......................................................................... 53 Audio Interface ............................................................................. 53 Digital Audio ................................................................................. 53 MECHANICAL DESIGN............................................................... 54 General ......................................................................................... 54 Finishing & Dimensions ................................................................ 54 Drawing ........................................................................................ 54 APPLICATION GUIDE ................................................................. 55 Debug of the LM960 Module in Production .................................. 55 Bypass Capacitor on Power Supplies .......................................... 55 EMC Recommendations .............................................................. 56 PACKAGING ............................................................................... 59 Tray .............................................................................................. 59 CONFORMITY ASSESSMENT ISSUES ..................................... 61 Approvals ..................................................................................... 61 Declaration of Conformity ............................................................. 61 FCC certificates ............................................................................ 61 IC certificates ................................................................................ 61 FCC/IC Regulatory notices ........................................................... 61 RED Regulatory notices ............................................................... 64 1VV0301485 Rev. 1 Page 7 of 73 2018-05-31 LM960 HW Design Guide 13. 14. 15. 16. SAFETY RECOMMENDATIONS ................................................. 66 READ CAREFULLY ..................................................................... 66 REFERENCE TABLE OF RF BANDS CHARACTERISTICS ..... 67 ACRONYMS ................................................................................ 70 DOCUMENT HISTORY ................................................................ 72 1VV0301485 Rev. 1 Page 8 of 73 2018-05-31 LM960 HW Design Guide 1. INTRODUCTION Scope introduces This document the Telit LM960 module and presents possible and recommended hardware solutions for developing a product based on the LM960 module. All the features and solutions detailed in this document are applicable to all LM960 variants, where LM960 refers to the variants listed in the Applicability Table. If a specific feature is applicable to a specific product only, it will be clearly marked. Information LM960 refers to all modules listed in the Applicability Table. This document takes into account all the basic functions of a wireless module; a valid hardware solution is suggested for each function, and incorrect solutions and common errors to be avoided are pointed out. Obviously, this document cannot embrace every hardware solution or every product that can be designed. Where the suggested hardware configurations need not be considered mandatory, the information given should be used as a guide and a starting point for properly developing your product with the Telit LM960 module. Information The integration of the WCDMA/HSPA+/LTE LM960 cellular module within a user application must be done according to the design rules described in this manual. Audience This document is intended for Telit customers, especially system integrators, about to implement their applications using the Telit LM960 module. Contact Information, Support For general contact, documentation errors contact Telit Technical Support at:

technical support services, technical questions and report TS-EMEA@telit.com TS-AMERICAS@telit.com TS-APAC@telit.com TS-SRD@telit.com 1VV0301485 Rev. 1 Page 9 of 73 2018-05-31 LM960 HW Design Guide For detailed information about where you can buy the Telit modules or for recommendations on accessories and components visit:

http://www.telit.com To register for product news and announcements or for product questions contact Telits Technical Support Center (TTSC). Our aim is to make this guide as helpful as possible. Keep us informed of your comments and suggestions for improvements. Telit appreciates feedback from the users of our information. 1VV0301485 Rev. 1 Page 10 of 73 2018-05-31 LM960 HW Design Guide Text Conventions Danger This information MUST be followed or catastrophic equipment failure or bodily injury may occur. Caution or Warning Alerts the user to important points about integrating the module, if these points are not followed, the module and end user equipment may fail or malfunction. Tip or Information Provides advice and suggestions that may be useful when integrating the module. All dates are in ISO 8601 format, i.e. YYYY-MM-DD. 1VV0301485 Rev. 1 Page 11 of 73 2018-05-31 LM960 HW Design Guide Related Documents LM960 SW User Guide, 1VV0301477 LM960 AT Commands Reference Guide, 80568ST10869A Generic EVB HW User Guide, 1VV0301249 LM960 Interface Board HW User Guide, 1VV0301502 SIM Integration Design Guide Application Note Rev10, 80000NT10001A 1VV0301485 Rev. 1 Page 12 of 73 2018-05-31 LM960 HW Design Guide 2. GENERAL PRODUCT DESCRIPTION Overview The aim of this document is to present possible and recommended hardware solutions useful for developing a product with the Telit LM960 Mini PCIe module. LM960 is Telits platform for Mini PCIe module for applications, such as M2M applications, industrial mobile router and table PC, based on the following technologies:

LTE / WCDMA networks for data communication Designed for industrial grade quality In its most basic use case, LM960 can be applied as a wireless communication front-end for mobile router products, offering mobile communication features to an external host CPU through its rich interfaces. LM960 can further support customer software applications and security features. LM960 provides a software application development environment with sufficient system resources for creating rich on-board applications. Thanks to a dedicated application processor and embedded security resources, product developers and manufacturers can create products that guarantee fraud prevention and tamper evidence without extra effort for additional security precautions. LM960 is available in hardware variants as listed in Applicability Table The designated RF band sets per each variant are detailed in Section 2.2, Product Variants and Frequency Bands. Product Variants and Frequency Bands The operating frequencies in LTE & WCDMA modes conform to the 3GPP specifications. RF Bands per Regional Variant 2.2.1. This table summarizes the LM960, showing the supported band sets and the supported band pairs and triple for carrier aggregation. RF Bands and Carrier Aggregation Bands LTE FDD LTE TDD HSPA+

1, 2, 3, 4, 5, 7, 8, 12, 13, 14, 17, 18, 19, 20, 25, 26, 28, 29, 30, 32, 66, 71 38, 39, 40, 41, 42, 46, 48 1, 2, 4, 5, 8, 9, 19 GNSS GPS, GLONASS, BeiDou, Galileo LTE 2DL carrier aggregation combinations AT & T CA_12A-30A, CA_12A-66A, CA_14A-30A, CA_14A-66A, CA_29A-30A, CA_29A-66A, CA_2A-12A, CA_2A-14A, CA_2A-29A, CA_[2A]-[2A], CA_2A-30A, CA_[2A]-46A, CA_[2A]-[4A], CA_2A-5A, CA_[2A]-[66A], CA_30A-66A, CA_4A-12A, CA_4A-29A, CA_4A-30A, CA_[4A]-46A, CA_[4A]-[4A], CA_4A-5A, CA_5A-30A, CA_5A-66A, CA_5B, CA_[66A]-

[66A], CA_66B, CA_66C, CA_2C, CA_12B 1VV0301485 Rev. 1 Page 13 of 73 2018-05-31 LM960 HW Design Guide Verizon CA_[2A]-[2A], CA_[2A]-[4A], CA_[2A]-5A, CA_[2A]-13A, CA_[2A]-[66A], CA_[4A]-[4A], CA_[4A]-5A, CA_[4A]-13A, CA_5A-[66A], CA_5B, CA_13A-

[66A], CA_[66A]-[66A], CA_[66B], CA_[66C]

Sprint CA_25A-25A, CA_25A-26A, CA_26A-41A, CA_41A-41A, CA_41C LTE 2UL carrier aggregation combinations CA_2A-5A, CA_2A-12A, CA_2A-13A, CA_4A-5A, CA_4A-7A, CA_4A-12A, CA_4A-13A, CA_5A-66A, CA_5B, CA_7C, CA_12A-66A, CA_38C, CA_41C AT & T Verizon LTE 3DL carrier aggregation combinations CA_12A-30A-66A, CA_12A-[66A]-66A, CA_14A-30A-66A, CA_14A-66A-

66A, CA_29A-30A-66A, CA_29A-66A-66A, CA_2A-12A-30A, CA_[2A]-

12A-66A, CA_2A-12A-[66A], CA_2A-14A-66A, CA_2A-14A-30A, CA_2A-

29A-30A, CA_[2A]-2A-12A, CA_2A-2A-30A, CA_2A-2A-5A, CA_2A-2A-

66A, CA_2A-30A-66A, CA_2A-46C, CA_[2A]-4A-12A, CA_2A-[4A]-12A, CA_2A-4A-30A, CA_[2A]-4A-4A, CA_2A-[4A]-4A, CA_[2A]-4A-5A, CA_2A-

[4A]-5A, CA_2A-5A-30A, CA_[2A]-5A-66A, CA_2A-5A-[66A], CA_2A-66A-

66A, CA_30A-66A-66A, CA_4A-12A-30A, CA_4A-12B, CA_4A-29A-30A, CA_[4A]-4A-12A, CA_[4A]-4A-5A, CA_4A-4A-30A, CA_4A-5A-30A, CA_5A-30A-66A, CA_5A-66A-66A, CA_5A-66C CA_[2A]-2A-5A, CA_[2A]-2A-13A, CA_[2A]-2A-66A, CA_2A-2A-[66A], CA_[2A]-4A-5A, CA_2A-[4A]-5A, CA_[2A]-4A-13A, CA_2A-[4A]-13A, CA_[2A]-5A-66A, CA_2A-5A-[66A], CA_[2A]-13A-66A, CA_2A-13A-[66A], CA_[2A]-66A-66A, CA_2A-[66A]-66A, CA_[2A]-[66B], CA_[2A]-[66C], CA_[4A]-4A-5A, CA_[4A]-4A-13A, CA_5A-[66A]-66A, CA_5A-[66B], CA_5A-[66C], CA_13A-[66A]-66A, CA_13A-[66B], CA_13A-[66C], CA_[66A]-[66C], CA_[66D]

Sprint CA_26A-41C, CA_41A-41C, CA_41D LTE 4DL carrier aggregation combinations AT & T CA_12A-30A-66A-66A, CA_2A-12A-30A-66A, CA_2A-12A-66A-66A, CA_2A-29A-30A-66A, CA_2A-2A-12A-30A, CA_2A-2A-12A-66A, CA_2A-

2A-29A-30A, CA_2A-2A-5A-30A, CA_2A-2A-5A-66A, CA_2A-2A-66A-66A, CA_[2A]-46D, CA_2A-4A-12A-30A, CA_2A-4A-4A-12A, CA_2A-4A-5A-

30A, CA_2A-5A-30A-66A, CA_2A-5A-66A-66A, CA_2A-5B-30A, CA_2A-

5B-66A, CA_[4A]-46D, CA_4A-4A-12A-30A, CA_5A-30A-66A-66A, CA_5B-30A-66A, CA_5B-66A-66A, CA_29A-30A-66A-66A, CA_46D-[66A]

LTE 5DL carrier aggregation combinations AT & T CA_2A-5B-30A-66A, CA_2A-5B-66A-66A, CA_5B-30A-66A-66A

[ ] mean that 4*4 MIMO is supported LTE B40, B42, B48 : Disabled by S/W Refer to Chapter 14 for details information about frequencies and bands. 1VV0301485 Rev. 1 Page 14 of 73 2018-05-31 LM960 HW Design Guide Target market LM960 can be used for telematics applications where tamper-resistance, confidentiality, integrity, and authenticity of end-user information are required, for example:

Industrial equipment Mobile router Home network Internet connectivity Main features The LM960 family of industrial grade cellular modules features LTE and multi-RAT module together with an on-chip powerful application processor and a rich set of interfaces. The major functions and features are listed below. Main Features Function Features Module Multi-RAT cellular module for data communication o LTE FDD/TDD Cat18(DL)/13(UL) (1.2 Gbps/150 Mbps) o WCDMA up to DC HSPA+, Rel.10 Support for GPS, GLONASS, BeiDou and Galileo Audio subsystem Two USIM ports dual voltage Application processor Support digital audio interface (optional) Support for dual SIM Class B and Class C support Clock rates up to 4 MHz Application processor to run customer application code 32 bit ARM Cortex-A7 up to 1.4 GHz running the Linux operating system 4Gbit NAND Flash + 2Gbit LPDDR2 MCP is supported to allow for customers own software applications Interfaces Rich set of interfaces, including:

USB3.0 USB port is typically used for:

o Flashing of firmware and module configuration o Production testing o Accessing the Application Processors file system o AT command access 1VV0301485 Rev. 1 Page 15 of 73 2018-05-31 LM960 HW Design Guide Function Features o High-speed WWAN access to external host o Diagnostic monitoring and debugging o Communication between Java application environment and an external host CPU o NMEA data to an external host CPU PCIe(Optional) Peripheral Ports GPIOs Advanced security features o Boot integrity of firmware up to customer applications o Disable/secure re-enable of debug o Embedded security FOTA (optional) Telit Unified AT command set Major software features Form factor Mini PCIe Form factor (50.95x30x2.7mm), accommodating the multiple RF bands Environment and quality requirements Single supply module The entire module is designed and qualified by Telit for satisfying the environment and quality requirements for use in applications. The module generates all its internal supply voltages. RTC The real-time clock is supported. Operating temperature Range -40 C to +85 C

(conditions as defined in Section 2.9.1, Temperature Range) 1VV0301485 Rev. 1 Page 16 of 73 2018-05-31 LM960 HW Design Guide Block Diagram Below figure shows an overview of the internal architecture of the LM960 module. LM960 Block Diagram It includes the following sub-functions:

Application processor, Module subsystem and Location processing with their external interfaces. These three functions are contained in a single SOC. RF front end Rich IO interfaces. Depending on which LM960 software features are enabled, some of its interfaces that are exported through multiplexing may be used internally and thus may not be usable by the application. PMIC with the RTC function inside TX Output Power Band 3G WCDMA LTE All Bands Power class Class 3 (0.2W) Class 3 (0.2W) 1VV0301485 Rev. 1 Page 17 of 73 2018-05-31 LM960 HW Design Guide RX Sensitivity Below the 3GPP measurement conditions used to define the RX sensitivity:

Technology 4G LTE 3G WCDMA 3GPP Compliance Throughput >95% 10MHz Dual Receiver BER <0.1% 12.2 Kbps Dual Receiver Product Band Typical Rx Sensitivity (dBm) * / **

(BW = 10 MHz / B46 BW = 20 MHz) LM960 LTE FDD B1 LTE FDD B2 LTE FDD B3 LTE FDD B4 LTE FDD B5 LTE FDD B7 LTE FDD B8 LTE FDD B12 LTE FDD B13 LTE FDD B14 LTE FDD B17 LTE FDD B18 LTE FDD B19 LTE FDD B20 LTE FDD B25 LTE FDD B26 LTE FDD B28 LTE FDD B29 (DL Only) LTE FDD B30 LTE FDD B32 (DL Only) LTE FDD B66 LTE TDD B38 LTE TDD B39 LTE TDD B41

-100.0 dBm

-100.0 dBm

-100.0 dBm

-100.5 dBm

-101.0 dBm

-100.0 dBm

-100.5 dBm

-101.0 dBm

-100.5 dBm

-100.0 dBm

-101.0 dBm

-101.0 dBm

-100.0 dBm

-100.5 dBm

-100.0 dBm

-100.0 dBm

-100.5 dBm

-100.0 dBm

-100.0 dBm

-100.0 dBm

-100.0 dBm

-99.0 dBm

-100.0 dBm

-99.0 dBm 1VV0301485 Rev. 1 Page 18 of 73 2018-05-31 LM960 HW Design Guide LM960 LTE TDD B46 (DL Only) LTE FDD B71 WCDMA FDD B1 WCDMA FDD B2 WCDMA FDD B4 WCDMA FDD B5 WCDMA FDD B8 WCDMA FDD B9 WCDMA FDD B19

-95.0 dBm

-99.5 dBm

-111.0 dBm

-110.0 dBm

-111.0 dBm

-111.0 dBm

-110.0 dBm

-110.0 dBm

-111.0 dBm

* LTE Rx Sensitivity shall be verified by using both (all) antenna ports simultaneously.

** 3.3 Voltage / Room temperature 2.8.1. The LM960 modules overall dimensions are:

Mechanical specifications Dimensions Length: 50.95 mm, +/- 0.15 mm tolerance Width: 30.00 mm, +/- 0.15 mm tolerance Thickness: 2.70 mm, +/- 0.15 mm tolerance 2.8.2. Weight The nominal weight of the LM960 module is 10.1 grams. Environmental Requirements 2.9.1. Temperature Range Note Operating Temperature Range 20C ~ +55C This range is defined by 3GPP (the global standard for wireless mobile communication). Telit guarantees its modules to comply with all the 3GPP requirements and to have full functionality of the module with in this range. 40C ~ +85C Telit guarantees full functionality within this range as well. However, there may possibly be some performance deviations in this extended 3GPP requirements, which means that some RF 2018-05-31 Page 19 of 73 relative range to 1VV0301485 Rev. 1 LM960 HW Design Guide Note parameters may deviate from the 3GPP specification in the order of a few dB. For example: receiver sensitivity or maximum output power may be slightly degraded. Even so, all the functionalities, such as call connection, SMS, USB communication, UART activation etc., will be maintained, and the effect of such degradations will not lead to malfunction. 40C ~ +85C Storage and non-

operating Temperature Range RoHS Compliance 2.9.2. As a part of the Telit corporate policy of environmental protection, the LM960 complies with the RoHS (Restriction of Hazardous Substances) directive of the European Union

(EU directive 2011/65/EU). 1VV0301485 Rev. 1 Page 20 of 73 2018-05-31 LM960 HW Design Guide 3. PINS ALLOCATION Pin-out LM960 Pin-out Pin Signal I/O Function Type Comment USB HS 2.0 Communication Port 38 36 USB_D+

I/O USB 2.0 Data Plus Analog USB_D-

I/O USB 2.0 Data Minus Analog USB SS 3.0 Communication and PCIe Port 25 23 33 31 USB_TX_P PCIE_TX_P USB_TX_M PCIE_TX_M USB_RX_P PCIE_RX_P USB_RX_M PCIE_RX_M O O I I USB 3.0 super-

speed/PCIe transmit plus USB 3.0 super-

speed/PCIe transmit minus USB 3.0 super-

speed/PCIe receive plus USB 3.0 super-

speed/PCIe receive minus Analog Analog Analog Analog Peripheral Component Interconnect Express 7 PCIE_CLKREQ_N I/O PCIE reference clock request signal. 1.8V 11 PCIE_REFCLK_M 13 PCIE_REFCLK_P I I PCI Express differential reference clock minus PCI Express differential reference clock plus 1VV0301485 Rev. 1 Page 21 of 73 2018-05-31 LM960 HW Design Guide 22 PCIE_RESET_N I Functional reset to the card 1.8V SIM Card Interface 1 8 10 12 14 SIMVCC1 SIMIO1 SIMCLK1 SIMRST1 SIM Card Interface 2 16 19 17 6 SIMVCC2 SIMIO2 SIMCLK2 SIMRST2 Digital I/O (GPIOs) 3 5 SIMIN1/GPIO_01 SIMIN2/GPIO_02 O Supply output for an external UIM1 card I/O Data connection with an external UIM1 card O O Clock output to an external UIM1 card Reset output to an external UIM1 card 1.8V /

2.85V 1.8V /

2.85V 1.8V /

2.85V 1.8V /

2.85V Power O Supply output for an external UIM2 card 1.8 / 2.85V Power I/O Data connection with 1.8 / 2.85V an external UIM2 card O O Clock output to an external UIM2 card 1.8 / 2.85V Reset output to an external UIM2 card 1.8 / 2.85V I/O General purpose I/O Can be used as SIMIN1 I/O General purpose I/O Can be used as SIMIN2 1.8V 1.8V 44 GPIO_03 I/O General purpose I/O 1.8V 1VV0301485 Rev. 1 Page 22 of 73 2018-05-31 LM960 HW Design Guide 46 GPIO_04 I/O General purpose I/O 1.8V Control Signal PCIE_WAKE_N I/O PCIe wake-up 1.8V 1 20 42 28 48 W_DISABLE_N WAN_LED_N I O RF disable Open-drain Internal VBATT Pull-up LED control Open-drain Miscellaneous Functions VREG_L6_1P8 O Reference Voltage 1.8V Power SYSTEM_RESET_N I Reset Input 1.8V Digital Audio Interface 45 47 49 51 DVI _CLK DVI _TX DVI _RX DVI _WAO I2C Interface 30 32 I2C_SCL I2C_SDA Power Supply 2 24 39 VBATT VBATT VBATT 1VV0301485 Rev. 1 O O I O O I/O I I I PCM Clock PCM Data Out PCM Data In PCM Frame Sync I2C Clock I2C Data 1.8V 1.8V 1.8V 1.8V 1.8V 1.8V Power supply Power Power supply Power Power supply Power Page 23 of 73 2018-05-31 LM960 HW Design Guide 41 52 VBATT VBATT GROUND I I

-

-

-

-

-

-

-

-

-

-

-

-

-

-

Power supply Power Power supply Power Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground GND GND GND GND GND GND GND GND GND GND GND GND GND GND Information If the DVI and I2C interface are not used, the signals can be left floating. 1VV0301485 Rev. 1 Page 24 of 73 2018-05-31 4 9 15 18 21 26 27 29 34 35 37 40 43 50 LM960 HW Design Guide Information Unless otherwise specified, RESERVED pins must be left unconnected (Floating). LM960 Signals That Must Be Connected Below table specifies the LM960 signals that must be connected for a debugging purpose even if not used by the end application:

Mandatory Signals Pin 2, 24, 39, 41, 52 Signal VBATT 4, 9, 15, 18, 21, 26, 27, 29, 34, 35, 37, 40, 43, 50 GND Notes 38 36 USB_D+

If not used, connect to a test point or an USB connector USB_D-

If not used, connect to a test point or an USB connector 1VV0301485 Rev. 1 Page 25 of 73 2018-05-31 LM960 HW Design Guide Pin Layout LM960 Pin Layout Top side

- Odd pins Bottom side

- Even pins 2 4 6 8 10 12 14 16 VBATT GND SIMRST2 SIMVCC1 SIMIO1 SIMCLK1 SIMRST1 SIMVCC2 18 20 22 24 26 28 30 32 34 36 38 40 42 44 46 48 50 52

<Bottom View>

54 GND W_DISABLE_N PCIE_RESET_N VBATT GND VREG_L6M I2C_SCL I2C_SDA GND USB_D-

USB_D+

GND WAN_LED_N GPIO_03 GPIO_04 SYSTEM_RESET_N GND VBATT PCIE_WAKE_N GPIO_01 GPIO_02 PCIE_CLKREQ_N GND PCIE_REFCLK_M PCIE_REFCLK_P GND SIMCLK2 SIMIO2 GND USB/PCIE_TX_M USB/PCIE_TX_P GND GND USB/PCIE_RX_M USB/PCIE_RX_P GND GND VBATT VBATT GND DVI_CLK DVI_TX DVI_RX DVI_WAO 1 3 5 7 9 11 13 15 17 19 21 23 25 27 29 31 33 35 37 39 41 43 45 47 49 51

<Top View>

1VV0301485 Rev. 1 Page 26 of 73 2018-05-31 LM960 HW Design Guide 4. POWER SUPPLY The power supply circuitry and board layout are very important parts of the full product design, with critical impact on the overall product performance. Read the following requirements and guidelines carefully to ensure a good and proper design. Power Supply Requirements The LM960 power requirements are as follows:

Power Supply Requirements Nominal supply voltage Supply voltage range 3.3V 3.10V 3.6V Maximum ripple on module input supply 30 mV Power Consumption Below table provides typical current consumption values of LM960 for various operation modes. LM960 Current Consumption Mode Average [Typ.]

Mode Description IDLE Mode CFUN=1 20mA No call connection USB3.0 is connected to a host Power Saving Mode (PSMWDISACFG=1, W_DISABLE_N:Low) CFUN=4 WCDMA LTE 2.5mA 3mA 3.3mA Operative Mode (LTE) LTE (23 dBm) 600mA 2DL CA with 2x2 MIMO / 2UL CA 900mA Tx and Rx are disabled; module is not registered on the network (Flight mode) DRx7 (1.28 sec DRx cycle) Paging cycle #128 frames (1.28 sec DRx cycle) LTE data call (Band 2, Single carrier, Non-

CA, BW 5MHz, RB=1) LTE data call (CA_2A-5A, 2x2 MIMO, Full RB, 256QAM DL / 64QAM UL, FDD 300Mbps DL / 150Mbps UL) 1VV0301485 Rev. 1 Page 27 of 73 2018-05-31 LM960 HW Design Guide Mode Average [Typ.]

Mode Description 5DL CA with 2x2 MIMO / 1UL 1000mA 3DL CA with 4x4 MIMO / 1UL 1200mA Operative Mode (WCDMA) LTE data call (CA_2A-5B-66A-66A, 2x2 MIMO, Full RB, 256QAM DL / 64QAM UL, FDD 1Gbps DL / 75Mbps UL) LTE data call (CA_2A-66C, 4x4 MIMO, Full RB, 256QAM DL / 64QAM UL, FDD 1.2Gbps DL / 75Mbps UL) WCDMA Voice 750 mA WCDMA voice call (Tx = 23 dBm) WCDMA HSPA

(22 dBm) 650 mA WCDMA data call (DC-HSDPA up to 42 Mbps, Max Throughput)

* Worst/best case current values depend on network configuration - not under module control.

** Loop-back mode in call equipment

*** 3.3 voltage / room temperature Information The electrical design for the power supply must ensure a peak current output of at least 2A. General Design Rules The principal guidelines for the Power Supply Design embrace three different design steps:

Electrical design Thermal design PCB layout Electrical Design Guidelines 4.3.1. The electrical design of the power supply depends strongly on the power source where this power is drained. 4.3.1.1.

+ 5V Input Source Power Supply Design Guidelines The desired output for the power supply is 3.3V. So, the difference between the input source and the desired output is not big, and therefore a linear regulator can be used. A switching power supply is preferred to reduce power consumption. When using a linear regulator, a proper heat sink must be provided to dissipate the power generated. A bypass low ESR capacitor of adequate capacity must be provided to cut the current absorption peaks close to the LM960 module. A 100 F tantalum capacitor is usually suitable on VBATT. 1VV0301485 Rev. 1 Page 28 of 73 2018-05-31 LM960 HW Design Guide Make sure that the low ESR capacitor on the power supply output (usually a tantalum one) is rated at least 10V. A protection diode must be inserted close to the power input to protect the LM960 module from power polarity inversion. Thermal Design Guidelines 4.3.2. The thermal design for the power supply heat sink must be done with the following specifications:

Average current consumption during RF transmission @PWR level max in LM960 as shown in Section 4.2, Power Consumption table. Information The average consumption during transmission depends on the power level at which the device is requested to transmit via the network. Therefore, the average current consumption varies significantly. Information The thermal design for the power supply must be made keeping an average consumption at the maximum transmitting level during calls of LTE/HSPA. Considering the very low current during Idle, especially if the Power Saving function is enabled, it is possible to consider from the thermal point of view that the device absorbs significant current only during Data session. In LTE/WCDMA/HSPA mode, the LM960 emits RF signals continuously during transmission. Therefore, you must pay special attention how to dissipate the heat generated. While designing the application board, the designer must make sure that the LM960 module is located on a large ground area of the application board for effective heat dissipation. 1VV0301485 Rev. 1 Page 29 of 73 2018-05-31 LM960 HW Design Guide Information The LM960 must be connected to the ground and metal chassis of the host board for best RF performance and thermal dispersion as well as to have module fixed. The two holes at the top of the module and the main ground of the host board must be fastened together. The shield cover of the module and the main board of the host board or the metal chassis of the host device should be connected with conductive materials. Power Supply PCB layout Guidelines 4.3.3. As seen in the electrical design guidelines, the power supply must have a low ESR capacitor on the output to cut the current peaks and a protection diode on the input to protect the supply from spikes and polarity inversion. The placement of these components is crucial for the correct operation of the circuitry. A misplaced component can be useless or can even decrease the power supply performances. The bypass low ESR capacitor must be placed close to the LM960 power input pins, or if the power supply is of a switching type, it can be placed close to the inductor to cut the ripple, as long as the PCB trace from the capacitor to LM960 is wide enough to ensure a drop-less connection even during the 2A current peaks. The protection diode must be placed close to the input connector where the power source is drained. The PCB traces from the input connector to the power regulator IC must be wide enough to ensure that no voltage drops occur during the 2A current peaks. The PCB traces to LM960 and the bypass capacitor must be wide enough to ensure that no significant voltage drops occur when the 2A current peaks are absorbed. This is needed for the same above-mentioned reasons. Try to keep these traces as short as possible. The PCB traces connecting the switching output to the inductor and the switching diode must be kept as short as possible by placing the inductor and the diode very close to the power switching IC (only for the switching power supply). This is done to reduce the radiated field (noise) at the switching frequency (usually 100-

500 kHz). Use a good common ground plane. Place the power supply on the board in a way to guarantee that the high current return paths in the ground plane do not overlap any noise sensitive circuitry, such as the microphone amplifier/buffer or earphone amplifier. The power supply input cables must be kept separate from noise sensitive lines, such as microphone/earphone cables. RTC The RTC within the LM960 module does not have a dedicated RTC supply pin. The RTC block is supplied by the VBATT supply. 1VV0301485 Rev. 1 Page 30 of 73 2018-05-31 LM960 HW Design Guide If VBATT power is removed, RTC is not maintained so if maintaining an internal RTC is needed, VBATT must be supplied continuously. Reference Voltage 1.8V regulated power supply output is provided as the reference voltage to a host board. This output is active when the module is ON and goes OFF when the module is shut down. This table lists the VREG_L6_1P8 signal of LM960. LM960 Reference Voltage PIN Signal I/O Function Type Comment 28 VREG_L6_1P8 O Reference Voltage power 1.8V Internal LDO for GNSS bias The LDO for GNSS bias is applied inside the LM960 model. The voltage supply come from LM960s LDO to GNSS active antenna. This table lists the LDO for GNSS bias of LM960. LM960 Reference Voltage when VBATT is 3.3 Symbol Parameter Min Typ Max Unit VGNSS DC bias Voltage of Internal LDO for GNSS bias 2.9 3.1 3.15

[V]

IGNSS DC bias Current of Internal LDO for GNSS bias

-

-

100

[mA]

1VV0301485 Rev. 1 Page 31 of 73 2018-05-31 LM960 HW Design Guide 5. ELECTRICAL SPECIFICATIONS Absolute Maximum Ratings Not Operational Caution A deviation from the value ranges listed below may harm the LM960 module. Absolute Maximum Ratings Not Operational Symbol Parameter VBATT Battery supply voltage on pin VBATT Min

-0.5 Max

+4.2 Unit

[V]

Recommended Operating Conditions Recommended Operating Conditions Symbol Parameter Min Typ Max Unit Tamb Ambient temperature

-40

+25

+85

[C]

VBATT Battery supply voltage on pin VBATT 3.1 3.3 3.6

[V]

IVBATT +

IVBATT_PA Peak current to be used to dimension decoupling capacitors on pin VBATT

-

80 2500

[mA]

1VV0301485 Rev. 1 Page 32 of 73 2018-05-31 LM960 HW Design Guide 6. DIGITAL SECTION Logic Levels Unless otherwise specified, all the interface circuits of the LM960 are 1.8V CMOS logic. Only USIM interfaces are capable of dual voltage I/O. The following tables show the logic level specifications used in the LM960 interface circuits. The data specified in the tables below is valid throughout all drive strengths and the entire temperature ranges. Caution Do not connect LM960s digital logic signal directly to OEMs digital logic signal with a level higher than 2.3V for 1.8V CMOS signals. 6.1.1. Absolute Maximum Ratings Not Functional 1.8V Pins Absolute Maximum Ratings Parameter Min Max Input level on any digital pin when on Input voltage on analog pins when on

--

--

+2.16V

+2.16 V 6.1.2. Operating Range Interface Levels (1.8V CMOS) 1.8V Standard GPIOs Parameter Min Max Unit Comment VIH VIL Input high level Input low level VOH Output high level VOL Output low level IIL IIH Low-level input leakage current High-level input leakage current IILPU Low-level input leakage current 1.17V

-0.3V 1.35V 0V

-1

--

2.1V 0.63V 1.8V 0.45V

--

1

[V]

[V]

[V]

[V]

[uA]

No pull-up

[uA]

No pull-down

-97.5

-27.5

[uA] With pull-up 1VV0301485 Rev. 1 Page 33 of 73 2018-05-31 LM960 HW Design Guide Parameter Min Max Unit Comment IIHPD High-level input leakage current 27.5 97.5

[uA] With pull-down CI/o I/O capacitance

--

5

[pF]

6.1.3. Operating Range SIM Pins Working at 1.8V 1.8V SIM Card Pins Parameter Min Max Unit Comment VIH Input high level VIL Input low level VOH Output high level VOL Output low level Low-level input leakage current High-level input leakage current IIL IIH 1.26V

-0.3V 1.44V 0V

--

-20 2.1V 0.36V 1.8V 0.4V 1000

[V]

[V]

[V]

[V]

[uA]

No pull-up 20

[uA]

No pull-down 6.1.4. Absolute Maximum Ratings Not Functional 2.85V Pins Absolute Maximum Ratings Parameter Min Max Input level on any digital pin when on Input voltage on analog pins when on

--

--

+3.42V

+3.42 V 6.1.5. Operating Range For SIM Pins Operating at 2.85V SIM Card Pins @2.85V Parameter Min Max Unit Comment VIH VIL Input high level Input low level VOH Output high level VOL Output low level 1VV0301485 Rev. 1 1.995V 3.15V

-0.3V 2.28V 0V 0.57V 2.85V 0.4V

[V]

[V]

[V]

[V]

Page 34 of 73 2018-05-31 LM960 HW Design Guide Parameter Min Max Unit Comment Low-level input leakage current High-level input leakage current IIL IIH Power On

--

1000

[uA]

No pull-up

-20 20

[uA]

No pull-down The LM960 is automatically turning on when the VBATT is supplied. Information To turn on the LM960 module, the SYSTEM_RESET_N pin must not be asserted low. Initialization and Activation State 6.2.1. After turning on the LM960 module, the LM960 is not yet activated because the SW initialization process of the LM960 module is still in process internally. It takes some time to fully complete the HW and SW initialization of the module. For this reason, it is impossible to access LM960 during the Initialization state. As shown in below figure, the LM960 becomes operational (in the Activation state) at least 30 seconds after the VBATT is supplied. LM960 Initialization and Activation Information To check if the LM960 has completely powered on, LM960 and the host must be connected via USB. When USB driver completely loaded, the module has completely powered on and is ready to accept AT commands. Information Active low signals are labeled with a name that ends with _N 1VV0301485 Rev. 1 Page 35 of 73 2018-05-31 LM960 HW Design Guide Information To avoid a back-powering effect, it is recommended to avoid having any HIGH logic level signal applied to the digital pins of the module when it is powered OFF or during an ON/OFF transition. Power Off To turn off the LM960, SYSTEM_RESET_N pad must be asserted low more than 1 seconds and then it should be kept low. When the SYSTEM_RESET_N is asserted low more than 1 seconds, LM960 goes into the finalization state and after the end of the finalization process VREG_L6_1P8 will go to low. Usually, it takes LM960 less than 200 second from asserting SYSTEM_RESET_N until reaching a complete shutdown. The DTE should monitor the status of VREG_L6_1P8 to observe the actual power-off. Information To completely shut down the LM960 module, the SYSTEM_RESET_N pin must be asserted and kept low. Otherwise, the LM960 will turn on again after shut down. Information To avoid a back-powering effect, it is recommended to avoid having any HIGH logic level signal applied to the digital pins of the module when it is powered OFF or during an ON/OFF transition. Warning Not following the recommended shut-down procedures might damage the device and consequently void the warranty. 1VV0301485 Rev. 1 Page 36 of 73 2018-05-31 LM960 HW Design Guide Shutdown by SYSTEM_RESET_N Pad Below figure shows a simple circuit for this action. Circuit for Shutdown by SYSTEM_RESET_N Reset Reset the device can be done in two different ways:

Graceful Reset by USB AT command AT#REBOOT Unconditional Reset using the SYSTEM_RESET_N Graceful Reset 6.4.1. To gracefully restart the LM960 module, AT#REBOOT AT command must be sent via a USB communication. Graceful Reset by AT#REBOOT 1VV0301485 Rev. 1 Page 37 of 73 2018-05-31 LM960 HW Design Guide Unconditional Hardware Reset 6.4.2. To unconditionally restart the LM960 module, the SYSTEM_RESET_N pin must be asserted low more than 1 seconds and then released. Unconditional Hardware Reset by SYSTEM_RESET_N Pad Information The Unconditional Hardware Reset must be used only as an emergency exit procedure, and not as a normal power-off operation. Information Do not use any pull-up resistor on the RESET_N line or any totem pole digital output. Using a pull-up resistor may cause latch-

up problems on the LM960 power regulator and improper functioning of the module. The RESET_N line must be connected only in an open-

collector configuration. Communication ports Below table summarizes all the hardware interfaces of the LM960 module. LM960 Hardware Interfaces Interface LM960 USB PCIe USIM Super-speed USB3.0 with high-speed USB2.0 Peripheral Component Interconnect Express x2, dual voltage each (1.8V/2.85V) Control Signals W_DISABLE_N, WAKE_N, WAN_LED_N GPIO X4, GPIO 1VV0301485 Rev. 1 Page 38 of 73 2018-05-31 LM960 HW Design Guide I2C Audio I/F I2C (optional) PCM (optional) Antenna ports 4 for Cellular, 1 for GNSS USB Interface 6.5.1. The LM960 module includes super-speed USB3.0 with high-speed USB2.0 backward compatibility. It is compliant with Universal Serial Bus Specification, Revision 3.0 and can be used for control and data transfers as well as for diagnostic monitoring and firmware update. The USB port is typically the main interface between the LM960 module and OEM hardware. USB 3.0 needs series capacitors on the TX lines in both directions for AC coupling. In order to interface USB3.0 with an application board of customer, 0.1uF capacitors should be installed on USB_SS_RX_P/M lines of the LM960. There are already series capacitors on USB_SS_TX_P/M lines inside LM960 module. The USB interface suggested connection is the following:

Connection for USB Interface Information The USB signal traces must be routed carefully. Minimize trace lengths, number of vias, and capacitive loading. The impedance value should be as close as possible to 90 Ohms differential. 1VV0301485 Rev. 1 Page 39 of 73 2018-05-31 LM960 HW Design Guide Warning At power-up, LM960 success to enumerate SS_USB interface. But if a hot-plug is attempted in case of SS_USB, then LM960 may fail to enumerate SS_USB. Information According to the mini PCIe standard, TX/RX of SS USB and PCIe share the same pin (Pin 23, 25, 31, 33) so that can not be used at the same time. Currently PCIe interface is not supported but will be enabled soon. Below table lists the USB interface signals. USB Interface Signals PIN Signal 38 36 33 31 25 23 USB_D+

USB_D-

USB_SS_RX_P USB_SS_RX_M USB_SS_TX_P USB_SS_TX_M I/O I/O I/O I I O O Function Type Comment USB 2.0 Data Plus USB 2.0 Data Minus USB 3.0 super-speed receive plus USB 3.0 super-speed receive minus USB 3.0 super-speed transmit plus USB 3.0 super-speed transmit minus Analog Analog Analog Analog Analog Analog Information Even if USB communication is not used, it is still highly recommended to place an optional USB connector on the application board. At least test points of the USB signals are required since the USB physical communication is needed in the case of SW update. 1VV0301485 Rev. 1 Page 40 of 73 2018-05-31 LM960 HW Design Guide Information Consider placing a low-capacitance ESD protection component to protect LM960 against ESD strikes If an ESD protection should be added, the suggested connectivity is as follows:

ESD Protection for USB2.0 ESD Protection for USB3.0 PCIe Interface 6.5.2. The LM960 will support PCIe interface Below table lists the PCIe interface signals. PCIe Interface Signals 1VV0301485 Rev. 1 Page 41 of 73 2018-05-31 LM960 HW Design Guide PIN Signal I/O Function Type Comment 1 7 11 13 22 23 25 31 33 PCIE_WAKE_N PCIE_CLKREQ_N PCIE_REFCLK_M PCIE_REFCLK_P PCIE_RESET_N PCIE_TX_M PCIE_TX_P PCIE_RX_M PCIE_RX_P I I I O O I I PCIe wake-up I/O I/O PCIe reference clock request PCIe differential reference signal clock minus PICe differential reference colock plus Analog Analog Analog Analog Functional reset to the card Analog PCIe transmit minus PCIe transmit plus PCIe receive minus PCIe receive plus Analog Analog Analog Analog 1VV0301485 Rev. 1 Information According to the mini PCIe standard, TX/RX of SS USB and PCIe share the same pin (Pin 23, 25, 31, 33) so that can not be used at the same time. Currently PCIe interface is not supported but will be enabled soon. Page 42 of 73 2018-05-31 LM960 HW Design Guide SIM Interface 6.5.3. The LM960 supports two external SIM interfaces (1.8V or 2.85V). Below table lists the SIM interface signals. SIM Interface Signals PIN Signal I/O Function Type Comment SIM Card Interface 1 SIMVCC1 O Supply output for an external UIM1 card 1.8V / 2.85V Power SIMIO1 I/O Data connection with an SIMCLK1 SIMRST1 O O external UIM1 card Clock output to an external UIM1 card Reset output to an external UIM1 card 1.8V / 2.85V 1.8V / 2.85V 1.8V / 2.85V SIMVCC2 O Supply output for an external UIM2 card 1.8 / 2.85V Power SIMIO2 SIMCLK2 SIMRST2 I/O Data connection with an external UIM2 card Clock output to an external UIM2 card Reset output to an external UIM2 card 1.8 / 2.85V 1.8 / 2.85V 1.8 / 2.85V 8 10 12 14 16 19 17 6 SIM Card Interface 2 O O I I Digital I/O (GPIOs) 3 5 GPIO_01 GPIO_02 UIM1 Card Present Detect UIM2 Card Present Detect 1.8V 1.8V GPIO_01 can be used as SIMIN1 GPIO_02 can be used as SIMIN2 6.5.3.1. The following Figures illustrate in particular how the application side should be designed. SIM Schematics SIM Schematic Example 1VV0301485 Rev. 1 Page 43 of 73 2018-05-31 LM960 HW Design Guide Information LM960 contains an internal pull-up resistor on SIMIO. It is not necessary to install external pull up resistor. 6.5.4. The LM960 supports the following control signals:

Control Signals W_DISABLE_N PCIE_WAKE_N WAN_LED_N Below table lists the control signals of LM960. Module Control Signal PIN Signal 20 1 42 W_DISABLE_N PCIE_WAKE_N WAN_LED_N I/O I I/O O Function Type RF disable

(airplane mode) PCIe wake-up LED control Open-drain 1.8V Open-drain Comment Internal VBATT Pull-up 6.5.4.1. W_DISABLE_N The W_DISABLE_N signal is provided to make the LM960 goes into the airplane mode:

Enter into the airplane mode: Low Normal operating mode: High or Leave the W_DISABLE_N not connected LM960 contains an internal VBATT(Nominal 3.3V) pull-up resistor on W_DISABLE_N. 1VV0301485 Rev. 1 Page 44 of 73 2018-05-31 LM960 HW Design Guide PCIE_WAKE_N 6.5.4.2. The PCIE_WAKE_N signal is provided to supports wakeup or the OBFF function. LM960 contains an internal 1.8V pull-up resistor on PCIE_WAKE_N. Recommended PCIE_WAKE_N connection is the following:

Recommended PCIE_WAKE_N connection 6.5.4.3. WAN_LED_N The WAN_LED_N signal drives the LED output. The recommended WAN_LED_N connection is the following:

Recommended WAN_LED_N connection 6.5.5. The general-purpose I/O pins can be configured to act in three different ways:

General Purpose I/O Input Output Dedicate Function (Customer Requirement) Input pins can only be read and report digital values (high or low) present on the pin at the read time. Output pins can only be written or queried and set the value of the pin output. The following GPIOs are always available as a primary function on the LM960. Below table lists the GPIO signals of LM960. GPIOs 1VV0301485 Rev. 1 Page 45 of 73 2018-05-31 LM960 HW Design Guide Pin no. Signal I/O Function Type 3 5 44 46 GPIO_01 GPIO_02 GPIO_03 GPIO_04 I/O Configurable GPIO I/O Configurable GPIO I/O Configurable GPIO I/O Configurable GPIO Pull-Down 1.8V Pull-Down 1.8V Pull-Down 1.8V Pull-Down 1.8V Drive Strength 2-16 mA 2-16 mA 2-16 mA 2-16 mA Using a GPIO Pin as Input 6.5.5.1. GPIO pins, when used as inputs, can be tied to a digital output of another device and report its status, provided the device interface levels are compatible with the GPIO 1.8V CMOS levels. If a digital output of a device is tied to GPIO input, the pin has interface levels different than 1.8V CMOS. It can be buffered with an open collector transistor with a 47 k pull-up resistor to 1.8V. 6.5.5.2. GPIO pins, when used as outputs, can drive 1.8V CMOS digital devices or compatible hardware. When set as outputs, the pins have a push-pull output, and therefore the pull-

up resistor can be omitted. GPIO Output Pin Equivalent Circuit Using a GPIO Pin as Output 1VV0301485 Rev. 1 Page 46 of 73 2018-05-31 LM960 HW Design Guide I2C Inter-integrated circuit 6.5.6. The LM960 supports an I2C interface on the following pins:

Below table lists the I2C signals of LM960. Module I2C Signal Signal I2C_SCL I2C_SDA PIN 30 32 The I2C interface is used for controlling peripherals inside the module (such as codec, etc.). CMOS 1.8V CMOS 1.8V I2C Clock I2C Data I/O O I/O Function Type Comment Information I2C is supported only on from Modem side as SW emulation of I2C on GPIO lines. Please contact us if you use it. Information If the I2C interface is not used, the signals can be left floating. Using the Temperature Monitor Function The Temperature Monitor permits to monitor the modules internal temperature and, if properly set (see the #TEMPSENS command in LM960 AT Commands Reference Guide

), raises a GPIO to High Logic level when the maximum temperature is reached. 1VV0301485 Rev. 1 Page 47 of 73 2018-05-31 LM960 HW Design Guide 7. RF SECTION Antenna requirements The antenna connection is one of the most important aspect in the full product design as it strongly affects the product overall performance. Hence read carefully and follow the requirements and the guidelines for a proper design. The LM960 is provided with five RF connectors. The available connectors are:

Primary RF antenna #0 and #1: TX/RX path Secondary RF antenna #0: Combined Rx Diversity and GNSS path Secondary RF antenna #1: Rx Diversity path GNSS antenna: Dedicated GNSS path Primary Antenna Requirements The antenna for the LM960 device must meet the following requirements:

WCDMA / LTE Antenna Requirements Frequency range Depending by frequency band(s) provided by the network operator, the customer shall use the most suitable antenna for that/those band(s) The bands supported by the LM960 is provided in Section 2.2, Product Variants and Frequency Bands. Impedance Input power 50 Ohm

> 24 dBm average power in WCDMA & LTE VSWR absolute max

<= 10:1 VSWR recommended <= 2:1 Secondary Antenna Requirements This product includes an input for a second Rx antenna to improve radio sensitivity. The function is called Antenna Diversity. Antenna Diversity Requirements Frequency range Depending by frequency band(s) provided by the network operator, the customer shall use the most suitable antenna for that/those band(s) The bands supported by the LM960 is provided in Section 2.2, Product Variants and Frequency Bands. Impedance 50 VSWR recommended 2:1 1VV0301485 Rev. 1 Page 48 of 73 2018-05-31 LM960 HW Design Guide The second Rx antenna should not be located in the close vicinity of main antenna. In order to improve Diversity Gain, Isolation and reduce mutual interaction, the two antennas should be located at the maximum reciprocal distance possible, taking into consideration the available space into the application. For the same reason, the Rx antenna should also be cross-polarized with respect to the main antenna. Isolation between main antenna and Rx antenna must be at least 10 dB in all uplink frequency bands. Envelope Correlation Coefficient (ECC) value should be as close as possible to zero, for best diversity performance. ECC values below 0.5 on all frequency bands are recommended. GNSS Receiver The LM960 integrates a GNSS receiver that could be used in Standalone mode and in A-

GPS (assisted GPS), according to the different configurations. LM960 supports an active antenna. Frequency range Wide-band GNSS:

15591606 MHz recommended GPS:

2.046 MHz BW NB GPS (centered on 1575.42 MHz) Glonass (GLO):

~ 8.3 MHz BW (15971606 MHz) BeiDou (BDS):

4.092 MHz BW (1559.05 1563.14 MHz) Galileo (GAL):

4.092 MHz BW (centered on 1575.42 MHz) Gain 1.5 dBi < Gain < 3 dBi Impedance 50 Ohm Amplification 18 dB < Gain < 21 dB Supply Voltage 3.1 V Current consumption 20 mA Typical 7.4.1. GNSS RF Front End Design The LM960 contains an integrated LNA and pre-select SAW filter. This allows the module to work well with a passive GNSS antenna. If the antenna cannot be located near the LM960, then an active antenna (that is, an antenna with a low noise amplifier built in) can be used with an external dedicated power supply circuit. GNSS rescive path uses either the dedicated GNSS connector or the shared Secondary

#0 antenna connector. 1VV0301485 Rev. 1 Page 49 of 73 2018-05-31 LM960 HW Design Guide NOTE Please refer to the LM960 AT Commands Reference Guide, 80568ST10869A for detailed information about GNSS operating modes and GNSS Antenna selection. Antenna connection Support bands in antenna port 7.5.1. The LM960 has an assigned band depending on the antenna port. The supported bands are:

Primary RF antenna #0: B1, B2(B25), B3, B4(B66), B5(B26,B18,B19), B8, B12(B17), B13, B14, B20, B28, B29, B39, B71, B41 for 4 x 4 MIMO Primary RF antenna #1: B7, B30, B32, B38, B40, B41, B42, B46, B48, B2(B25) for 4 x 4 MIMO, B4(B66) for 4 x 4 MIMO Secondary RF antenna #0: B1, B2(B25), B3, B4(B66), B5(B26,B18,B19), B8, B12(B17), B13, B14, B20, B28, B29, B39, B71, B41 for 4 x 4 MIMO / GNSS Secondary RF antenna #1: B7, B30, B38, B40, B41, B42, B46, B48, B25(B2) for 4 x 4 MIMO, B66(B4) for 4 x 4 MIMO GNSS antenna: Dedicated GNSS LTE B40, B42, B48 : Disabled by S/W See the picture on the below for their position on the interface. Antenna Connector 7.5.2. The LM960 is equipped with a set of 50 RF MHF4 connectors from I-PEX 20449-001. For more information about mating connectors visit the website https://www.i-pex.com Antenna Cable 7.5.3. Connecting cables between the module and the antenna must have 50 impedance. If the impedance of the module is mismatched, RF performance is reduced significantly. 1VV0301485 Rev. 1 Page 50 of 73 2018-05-31 LM960 HW Design Guide If the host device is not designed to use the modules GNSS antenna, terminate the interface with a 50 load. Minimize Antenna Cable Requirements Impedance Max cable loss 50 Ohm 0.5 dB Avoid coupling with other signals. Antenna Installation Guidelines 7.5.4. The antenna must be installed such that it provides a separation distance of at Install the antenna in a location with access to the network radio signal. least 20 cm from all persons and must not be co-located or operating in conjunction with any other antenna or transmitter. The antenna must not be installed inside metal cases. The antenna must be installed according to the antenna manufacturers instructions. Furthermore, if the device is developed for the US and/or Canada market, it must comply with the FCC and/or IC approval requirements. Information This device is to be used only for mobile and fixed application. The antenna(s) used for this transmitter must be installed to provide a separation distance of at least 20 cm from all persons and must not be co-located or operating in conjunction with any other antenna or transmitter. End-Users must be provided with transmitter operation conditions for satisfying RF exposure compliance. OEM integrators must ensure that the end user has no manual instructions to remove or install the LM960 module. Antennas used for this OEM module must not exceed gain of below table for mobile and fixed operating configurations. In the event that these conditions cannot be met (for example certain laptop configurations or co-location with another transmitter), then the FCC/IC authorization is no longer considered valid and the FCC/IC ID cannot be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product

(including the transmitter) and obtaining a separate FCC/IC authorization. 1VV0301485 Rev. 1 Page 51 of 73 2018-05-31 LM960 HW Design Guide Manual Information to the End User The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the users manual of the end product which integrates this module. The end user manual include all regulatory information/warning as show in this manual. required shall 1VV0301485 Rev. 1 Page 52 of 73 2018-05-31 LM960 HW Design Guide 8. AUDIO SECTION Audio Interface The LM960 module supports digital audio interfaces. Digital Audio The LM960 module can be connected to an external codec through the digital interface. The product provides a single Digital Audio Interface on the following pins:

Digital Audio Interface Signals Pin no. Signal I/O Function Type COMMENT 51 49 47 45 DVI_WAO DVI_RX DVI _TX DVI _CLK O I O O PCM Frame Sync B-PD 1.8V PCM Data In B-PD 1.8V PCM Data Out B-PD 1.8V PCM Clock B-PD 1.8V LM960 PCM has the following characteristics:

PCM Master mode using short or long frame sync modes 16 bit linear PCM format PCM clock rates of 256 kHz, 512 kHz, 1024 kHz and 2048 kHz (Default) Frame size of 8, 16, 32, 64, 128 & 256 bits per frame Sample rates of 8 kHz and 16 kHz NOTE If the Digital Audio Interface is not used, the signals can be left floating. 1VV0301485 Rev. 1 Page 53 of 73 2018-05-31 LM960 HW Design Guide 9. MECHANICAL DESIGN General The LM960 module was designed to be compliant with a standard lead-free SMT process. Moreover, it is compatible with the Mini PCIe card 52-pin card edge-type connector. Finishing & Dimensions The LM960 modules overall dimensions are:

50.95 mm Length:

30.00 mm Width:

Thickness: 2.70 mm The module complies with the standard dimensions specified in the PCI Express Mini Card Electromechanical Specification Revision 1.1 Drawing This figure shows the mechanical dimensions of the LM960 module. 1VV0301485 Rev. 1 Page 54 of 73 2018-05-31 LM960 HW Design Guide 10. APPLICATION GUIDE Debug of the LM960 Module in Production To test and debug the mounting of the LM960 module, we strongly recommend to add several test pins on the host PCB for the following purposes:

Checking the connection between the LM960 itself and the application Testing the performance of the module by connecting it with an external computer Depending on the customer application, these test pins include, but are not limited to the following signals:

SYSTEM_RESET_N, W_DISABLE_N, PCIE_WAKE_N VBATT, GND VREG_L6_1P8 USB_D-, USB_D+

USB_SS_TX_M, USB_SS_TX_P, USB_SS_RX_M, USB_SS_RX_P PCIE_TX_M, PCIE_TX_P, PCIE_RX_M, PCIE_RX_P In addition, the following signals are also recommended (but not mandatory):

WAN_LED_N GPIO_01, GPIO_02, GPIO_03, GPIO_04 Bypass Capacitor on Power Supplies When a sudden voltage step is asserted to or a cut from the power supplies, the steep transition causes some reactions such as overshoot and undershoot. This abrupt voltage transition can affect the device causing it to not operate or to malfunction. Bypass capacitors are needed to alleviate this behavior. The behavior can appear differently depending on the various applications. Customers must pay special attention to this issue when they design their application board. The length and width of the power lines must be considered carefully, and the capacitance of the capacitors must be selected accordingly. The capacitor will also prevent ripple of the power supplies and the switching noise caused in TDMA systems such as GSM. Especially, a suitable bypass capacitor must be mounted on the following lines on the application board:

VBATT Recommended values are:

100uF for VBATT Customers must still consider that the capacitance mainly depends on the conditions of their application board. Generally, more capacitance is required when the power line is longer. And if customers use the fast power down function, then more bypass capacitors should be mounted on the application board. 1VV0301485 Rev. 1 Page 55 of 73 2018-05-31 LM960 HW Design Guide EMC Recommendations EMC protection on the pins in the table below should be designed by application side according to the customers requirement. EMC Recommendations Pin Signal I/O Function Type Comment USB HS 2.0 Communication Port 38 36 USB_D+

I/O USB 2.0 Data Plus Analog USB_D-

I/O USB 2.0 Data Minus Analog USB SS 3.0 Communication and PCIe Port 33 USB/PCIE_RX_P 31 USB/PCIE_RX_M I I 25 USB/PCIE_TX_P O 23 USB/PCIE_TX_M O SIM Card Interface 1 USB 3.0 super-

speed/PCIe receive plus USB 3.0 super-

speed/PCIe receive minus USB 3.0 super-

speed/PCIe transmit plus USB 3.0 super-

speed/PCIe transmit minus Analog Analog Analog Analog 14 12 SIMRST1 SIMCLK1 O O Reset output to an external UIM1 card 1.8 / 2.85V Clock output to an external UIM1 card 1.8 / 2.85V 1VV0301485 Rev. 1 Page 56 of 73 2018-05-31 LM960 HW Design Guide 10 8 SIMIO1 I/O Data connection with 1.8 / 2.85V an external UIM1 card SIMVCC1 O Supply output for an external UIM1 card 1.8 / 2.85V Power SIM Card Interface 2 6 17 19 16 SIMRST2 SIMCLK2 SIMIO2 O O Reset output to an external UIM2 card 1.8 / 2.85V Clock output to an external UIM2 card 1.8 / 2.85V I/O Data connection with 1.8 / 2.85V an external UIM2 card SIMVCC2 O Supply output for an external UIM2 card 1.8 / 2.85V Power Digital I/O (GPIOs) 3 5 44 46 1 42 GPIO_01 I/O General purpose I/O 1.8V GPIO_02 I/O General purpose I/O 1.8V GPIO_03 I/O General purpose I/O 1.8V GPIO_04 I/O General purpose I/O 1.8V PCIE_WAKE_N I/O PCIe wake-up 1.8V Active Low WAN_LED_N O LED control Open-drain Active Low Power ON/OFF Reset IN/OUT 20 W_DISABLE_N I RF ON/OFF Control Open-drain Active Low

(internal VBATT pull up) 1VV0301485 Rev. 1 Page 57 of 73 2018-05-31 LM960 HW Design Guide 22 48 PCIE_RESET_N SYSTEM_RESET_N I I PCIe Reset Input Reset Input 1.8V 1.8V Active Low Active Low 1.8V Voltage Regulator 28 VREG_L6_1P8 O LDO out for 1.8V Power All other pins have the following characteristics:

Human Body Model (HBM): 1000 V Charged Device Model (CDM) JESD22-C101-C: 250 V All Antenna pins up to TBD Warning Do not touch without proper electrostatic protective equipment. The product must be handled with care, avoiding any contact with the pins because electrostatic discharge may damage the product itself. 1VV0301485 Rev. 1 Page 58 of 73 2018-05-31 LM960 HW Design Guide 11. PACKAGING Tray The LM960 modules are packaged on trays of 20 pieces each. These trays can be used in SMT processes for pick & place handling. 1VV0301485 Rev. 1 Page 59 of 73 2018-05-31 LM960 HW Design Guide 1VV0301485 Rev. 1 Page 60 of 73 2018-05-31 LM960 HW Design Guide 12. CONFORMITY ASSESSMENT ISSUES Approvals Fully type approved confirming with RE Directive (Directive 2014/53/EU) CE, GCF FCC, IC, PTCRB RoHS and REACH Approvals for major Mobile Network Operators Declaration of Conformity The DoC is available here: www.telit.com/RED/

FCC certificates The FCC Certifcate is available here: www.fcc.gov/oet/ea/fccid IC certificates The IC Certifcate is available here:

https://sms-sgs.ic.gc.ca/equipmentSearch/searchRadioEquipments?execution=e1s1&lang=en FCC/IC Regulatory notices Modification statement Telit has not approved any changes or modifications to this device by the user. Any changes or modifications could void the users authority to operate the equipment. Telit napprouve aucune modification apporte lappareil par lutilisateur, quelle quen soit la nature. Tout changement ou modification peuvent annuler le droit dutilisation de lappareil par lutilisateur. Interference statement This device complies with Part 15 of the FCC Rules and Industry Canada licence-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device. Le prsent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorise aux deux conditions suivantes : (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout 2018-05-31 1VV0301485 Rev. 1 Page 61 of 73 LM960 HW Design Guide brouillage radiolectrique subi, mme si le brouillage est susceptible d'en compromettre le fonctionnement. RF exposure This equipment complies with FCC and ISED radiation exposure limits set forth for an uncontrolled environment. The antenna should be installed and operated with minimum distance of 20 cm between the radiator and your body. Antenna gain must be below:

Cet appareil est conforme aux limites d'exposition aux rayonnements de lISED pour un environnement non contrl. L'antenne doit tre install de faon garder une distance minimale de 20 centimtres entre la source de rayonnements et votre corps. Gain de l'antenne doit tre ci-dessous:

This radio transmitter FCCID: RI7LM960 has been approved by FCC to opeate with the antenna types listed below with the maximum permissible gain and required antenna impedance for each antenna type indicated. Antenna types not included in this list, having a gain greater than the maximum gain indicated for type, are strictly prohibited for use with this device. This radio transmitter IC: 5131A-LM960 has been approved by Industry Canada to opeate with the antenna types listed below with the maximum permissible gain and required antenna impedance for each antenna type indicated. Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited for use with this device. Cet metteur radio IC: 5131A-LM960 a t approuv par Industrie Canada pour fonctionner avec les types d'antennes numrs ci-dessous avec le gain maximal admissible et impdance d'antenne requise pour chaque type d'antenne indiqu. Types d'antennes nest pas inclus dans cette liste, ayant un gain suprieur au gain maximal indiqu pour ce type, sont strictement interdits pour une utilisation avec cet appareil. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. L'metteur ne doit pas tre colocalis ni fonctionner conjointement avec autre antenne ou autre metteur. 1VV0301485 Rev. 1 Page 62 of 73 2018-05-31 LM960 HW Design Guide Antenna List No. Manufacturer Part No. Antenna Type Peak Gain 1 HNS WE14-LF-07 Dipole 3.5 dBi for 1420 ~ 2200 MHz 1.5 dBi for 617 ~ 960 MHz 2 HNS WE14-S3-1 Dipole 3 dBi for 2300 ~ 2690 MHz 4 dBi for 1420 ~ 2200 MHz 1 dBi for 2300 ~ 2400 MHz 3 dBi for 2498 ~ 2690 MHz 3 dBi for 3400 ~ 5928 MHz Note: The antenna connector is SMA(Male) type. FCC Class B digital device notice This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

Reorient or relocate the receiving antenna. Connect the equipment into an outlet on a circuit different from that to which the Increase the separation between the equipment and receiver. receiver is connected. Consult the dealer or an experienced radio/TV technician for help. Labelling Requirements for the Host device 1VV0301485 Rev. 1 Page 63 of 73 2018-05-31 LM960 HW Design Guide The host device shall be properly labelled to identify the modules within the host device. The certification label of the module shall be clearly visible at all times when installed in the host device, otherwise the host device must be labelled to display the FCC ID and ISED of the module, preceded by the words "Contains transmitter module", or the word "Contains", or similar wording expressing the same meaning, as follows:

L'appareil hte doit tre tiquet comme il faut pour permettre l'identification des modules qui s'y trouvent. L'tiquette de certification du module donn doit tre pose sur l'appareil hte un endroit bien en vue en tout temps. En l'absence d'tiquette, l'appareil hte doit porter une tiquette donnant le FCC ID et lISED du module, prcd des mots Contient un module d'mission , du mot Contient ou d'une formulation similaire exprimant le mme sens, comme suit :

LM960 Contains FCC ID: RI7LM960 Contains IC: 5131A-LM960 CAN ICES-3 (B) / NMB-3 (B) This Class B digital apparatus complies with Canadian ICES-003. Cet appareil numrique de classe B est conforme la norme canadienne ICES-003. RED Regulatory notices RF Exposure Information (MPE) This device has been tested and meets applicable limits for Radio Frequency (RF) exposure. To comply with the RF exposure requirements, this module must be installed in a host platform that is intended to be operated in a minimum of 20 cm separation distance to the user. OEM/Host manufacturer responsibilities OEM/Host manufacturers are ultimately responsible for the compliance of the Host and Module. The final product must be reassessed against all the essential requirements of the RED before it can be placed on the EU market. This includes reassessing the transmitter module for compliance with the Radio and EMF essential requirements of the RED. This module must not be incorporated into any other device or system without retesting for compliance as multi-radio and combined equipment. Page 64 of 73 1VV0301485 Rev. 1 2018-05-31 LM960 HW Design Guide The allowable Antenna Specipication In all cases assessment of the final product must be met against the Essential requirements of the RE Directive Articles 3.1(a) and (b), safety and EMC respectively, as well as any relevant Article 3.3 requirements. 1. The following antenna was verified in the conformity testing, and for compliance the antenna shall not be modified. A separate approval is required for all other operating configurations, including different antenna configurations. 2. If any other simultaneous transmission radio is installed in the host platform together with this module, or above restrictions cannot be kept, a separate RF exposure assessment and CE equipment certification is required. Waste Electrical and Electronic Equipment (WEEE) This symbol means that according to local laws and regulations your product and/or its battery shall be disposed of separately from household waste. When this product reaches its end of life, take it to a collection point designated by local authorities. Proper recycling of your product will protect human health and the environment. 1VV0301485 Rev. 1 Page 65 of 73 2018-05-31 LM960 HW Design Guide 13. SAFETY RECOMMENDATIONS READ CAREFULLY Be sure the use of this product is allowed in the country and in the environment required. The use of this product may be dangerous and has to be avoided in the following areas:

Where it can interfere with other electronic devices in environments such as hospitals, airports, aircrafts, etc. Where there is risk of explosion such as gasoline stations, oil refineries, etc. It is the responsibility of the user to enforce the country regulation and the specific environment regulation. Do not disassemble the product; any mark of tampering will compromise the warranty validity. We recommend following the instructions of the hardware user guides for correct wiring of the product. The product has to be supplied with a stabilized voltage source and the wiring has to be conformed to the security and fire prevention regulations. The product has to be handled with care, avoiding any contact with the pins because electrostatic discharges may damage the product itself. Same cautions have to be taken for the SIM, checking carefully the instruction for its use. Do not insert or remove the SIM when the product is in power saving mode. The system integrator is responsible for the functioning of the final product; therefore, care has to be taken to the external components of the module, as well as any project or installation issue, because the risk of disturbing the LTE & WCDMA network or external devices or having impact on the security. Should there be any doubt, please refer to the technical documentation and the regulations in force. Every module has to be equipped with a proper antenna with specific characteristics. The antenna has to be installed with care in order to avoid any interference with other electronic devices and has to guarantee a minimum distance from the body (20 cm). In case this requirement cannot be satisfied, the system integrator has to assess the final product against the SAR regulation. The European Community provides some Directives for the electronic equipment introduced on the market. All of the relevant information is available on the European Community website:

https://ec.europa.eu/commission/index_en The text of the Directive 2014/35/EU regarding telecommunication equipment is available, while the applicable Directives (Low Voltage and EMC) are available at:

http://ec.europa.eu/enterprise/sectors/electrical/

1VV0301485 Rev. 1 Page 66 of 73 2018-05-31 LM960 HW Design Guide 14. RF Bands Characteristics REFERENCE TABLE OF RF BANDS CHARACTERISTICS Mode Freq. Tx

(MHz) Freq. Rx

(MHz) Channels WCDMA 2100 B1 WCDMA 1900 B2 WCDMA AWS B4 1920 ~ 1980 2110 ~ 2170 1850 ~ 1910 1930 ~ 1990 1710 ~ 1755 2110 ~ 2155 WCDMA 850 B5 824 ~ 849 869 ~ 894 WCDMA 900 B8 880 ~ 915 925 ~ 960 Tx: 9612 ~ 9888 Rx: 10562 ~ 10838 Tx: 9262 ~ 9538 Rx: 9662 ~ 9938 Tx: 1537 ~ 1738 Rx: 1312 ~ 1513 Tx: 4132 ~ 4233 Rx: 4357 ~ 4458 Tx: 2712 ~ 2863 Rx: 2937 ~ 3088 WCDMA 1800 Japan B9 WCDMA 800 Japan B19 1750 ~ 1784.8 1845 ~ 1879.8 Tx: 8762 ~ 8912 Rx: 9237 ~ 9387 830 ~ 845 875 ~ 890 LTE 2100 B1 1920 ~ 1980 2110 ~ 2170 LTE 1900 B2 1850 ~ 1910 1930 ~ 1990 LTE 1800+ B3 1710 ~ 1785 1805 ~ 1880 LTE AWS-1 B4 1710 ~ 1755 2110 ~ 2155 LTE 850 B5 824 ~ 849 869 ~ 894 LTE 2600 B7 2500 ~ 2570 2620 ~ 2690 LTE 900 B8 880 ~ 915 925 ~ 960 Tx: 312 ~ 363 Rx: 712 ~ 763 Tx: 18000 ~ 18599 Rx: 0 ~ 599 Tx: 18600 ~ 19199 Rx: 600 ~ 1199 Tx: 19200 ~ 19949 Rx: 1200 ~ 1949 Tx: 19950 ~ 20399 Rx: 1950 ~ 2399 Tx: 20400 ~ 20649 Rx: 2400 ~ 2649 Tx: 20750 ~ 21449 Rx: 2750 ~ 3449 Tx: 21450 ~ 21799 Rx: 3450 ~ 3799 Tx-Rx Offset 190 MHz 80 MHz 400 MHz 45 MHz 45 MHz 95 MHz 45 MHz 190 MHz 80 MHz 95 MHz 400 MHz 45 MHz 120 MHz 45 MHz 1VV0301485 Rev. 1 Page 67 of 73 2018-05-31 LM960 HW Design Guide Mode Freq. Tx

(MHz) Freq. Rx

(MHz) Channels LTE 700a B12 699 ~ 716 729 ~ 746 LTE 700c B13 777 ~ 787 746 ~ 756 LTE 700PS B14 788 ~ 798 758 ~ 768 LTE 700b B17 704 ~ 716 734 ~ 746 LTE 800 Lower B18 LTE 800 Upper B19 815 ~ 830 860 ~ 875 830 ~ 845 875 ~ 890 LTE 800 B20 832 ~ 862 791 ~ 821 LTE 1900+ B25 1850 ~ 1915 1930 ~ 1995 LTE 850+ B26 814 ~ 849 859 ~ 894 LTE 700 APT B28 703 ~ 748 758 ~ 803 Tx : 23010 ~ 23179 Rx : 5010 ~ 5179 Tx : 27210 ~ 27659 Rx : 9210 ~ 9659 Tx : 23280 ~ 23379 Rx : 5280 ~ 5379 Tx: 23730 ~ 23849 Rx: 5730 ~ 5849 Tx: 23850 ~ 23999 Rx: 5850 ~ 5999 Tx: 24000 ~ 24149 Rx: 6000 ~ 6149 Tx: 24150 ~ 24449 Rx: 6150 ~ 6449 Tx: 8040 ~ 8689 Rx: 26040 ~ 26689 Tx: 8690 ~ 9039 Rx: 26690 ~ 27039 Tx: 9210 ~ 9659 Rx: 27210 ~ 27659 Tx-Rx Offset 30 MHz

-31 MHz

-30 MHz 30 MHz 45 MHz 45 MHz

-41 MHz 80 MHz 45 MHz 55 MHz LTE 700 d B29 Downlink only 717 ~ 728 Rx: 9660 ~ 9769 LTE 2300 WCS B30 LTE 1500 L-band B32 2305 ~ 2315 2350 ~ 2360 Tx: 9770 ~ 9869 Rx: 27660 ~ 27759 45 MHz Downlink only 1452 ~ 1496 Rx: 9920 ~ 10359 LTE AWS-3 B66 1710 ~ 1780 2110 ~ 2200 LTE 600 B71 663 ~ 698 617 ~ 652 Tx: 66436 ~ 67335 Rx: 131972 ~ 132671 400 MHz Tx: 133122 ~ 133471 Rx: 68586 ~ 68935

-46 MHz 1VV0301485 Rev. 1 Page 68 of 73 2018-05-31 LM960 HW Design Guide Mode Freq. Tx

(MHz) Freq. Rx

(MHz) Channels Tx-Rx Offset LTE TDD 2600 B38 LTE TDD 2300 B40 LTE TDD 1900+

B39 LTE TDD 2500 B41 LTE TDD 3500 B42 LTE TDD Unlicensed B46 LTE TDD 3600 B48 2570 ~ 2620 2300 ~ 2400 1880 ~ 1920 2496 ~ 2690 3400 ~ 3600 T/Rx: 37750 ~ 38250 T/Rx: 38650 ~ 39650 T/Rx: 38250 ~ 38649 T/Rx: 39650 ~ 41589 T/Rx: 41590 ~ 43589 Downlink only 5150 ~ 5925 3550 ~ 3700 T/Rx: 55240 ~ 56739 LTE B40, B42, B48 : Disabled by S/W 1VV0301485 Rev. 1 Page 69 of 73 2018-05-31 LM960 HW Design Guide 15. TTSC USB HS DTE UMTS WCDMA HSDPA HSUPA UART HSIC SIM SPI ADC DAC I/O GPIO CMOS MOSI MISO CLK MRDY ACRONYMS Telit Technical Support Centre Universal Serial Bus High Speed Data Terminal Equipment Universal Mobile Telecommunication System Wideband Code Division Multiple Access High Speed Downlink Packet Access High Speed Uplink Packet Access Universal Asynchronous Receiver Transmitter High Speed Inter Chip Subscriber Identification Module Serial Peripheral Interface Analog Digital Converter Digital Analog Converter Input Output General Purpose Input Output Complementary Metal Oxide Semiconductor Master Output Slave Input Master Input Slave Output Clock Master Ready 1VV0301485 Rev. 1 Page 70 of 73 2018-05-31 LM960 HW Design Guide SRDY CS RTC PCB ESR VSWR VNA FDD I2C LTE SOC Slave Ready Chip Select Real Time Clock Printed Circuit Board Equivalent Series Resistance Voltage Standing Wave Radio Vector Network Analyzer Frequency division duplex Inter-integrated circuit Long term evolution System-on-Chip 1VV0301485 Rev. 1 Page 71 of 73 2018-05-31 LM960 HW Design Guide 16. DOCUMENT HISTORY Revision Date Changes 2018-2-09 First Draft 2018-5-31 Sec 1.5 Some of Docs Referrence Number Is Updated Sec 3.3 Pin Layout Updated Sec 4.2 Current Consumption Updated Sec 6 Power On, Power Off, Reset Updated Sec 2.2.1 RF Bands per Regional Variant Updated Sec 2.7 RX Sesitivity Updated Sec 4.2 Power Consumption Updated Sec 9.3 Drawing Updated 0 1 2 3 1VV0301485 Rev. 1 Page 72 of 73 2018-05-31

]

7 1 0 2

. 1 0

[

Mod.0818 2017-01 Rev.0