FCC ID: X8U0003 RF MCU Evaluation Kit

TESSERA TECHNOLOGY INC. Document no.: TS-TUM09735 EB-RE01B Hardware Manual Ver 1.04 (2021/8/3) 1 / 48 TESSERA TECHNOLOGY INC. Change history Version Date Description 1.00 1.01 1.02 1.03 2021/1/28 Initial version 2021/3/17 Changed P4, P7 2021/3/22 Power supply setting explanations are added 2021/6/11 Power line configuration diagram added Signal wiring diagram added Other material updates 1.04 2021/8/3 Comply with overseas certifications Cautionary Notes:

The contents of this document are subject to change without notice. Reproduction of this document in any format is prohibited without written permission from Tessera Technology Inc. (herein the Company). This product was designed and fabricated for design engineers for the purpose of evaluation and becoming familiar with product safety and reliability characteristics. The company shall not be liable for the infringement of third party patent, copyrights, or other intellectual property rights arising from the use of Tessera Technology products in listed in this document. The company does not grant any rights concerning Tessera Technology or third party patents, copyrights, or other intellectual property rights based on this material. Circuitry, software or related information included in this document is provided as semiconductor product operation examples and application examples. The user is responsible for the appropriate application of the circuitry, software or related information when designing equipment. The company shall not be liable for loss or damage incurred by the user or other third party based on the use of this circuitry, software or related information. Please handle this product as you would a CMOS device. The user should be particularly careful to protect himself/herself from accumulated static electricity when using this product. Make sure all test and measurement equipment, including the work station, are properly grounded. The user should wear an ESD wrist strap to prevent any buildup of static electricity. Do not touch connectors or device pins with bare hands 2 / 48 TESSERA TECHNOLOGY INC.

[ COMMON WARNING & NOTICE ]

ESD warning (Electrostatic sensitive) This equipment should be handled like a CMOS semiconductor device. The user must take all precautions to avoid build-up of static electricity while working with this equipment. All test and measurement tool including the workbench must be grounded. The user/operator must be grounded using the wrist strap. The connectors and/or device pins should not be touched with bare hands.

[ FCC WARNING & NOTICE ]

FCC Part15 compliance information This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:

1. This device may not cause harmful interference. 2. This device must accept any interference received, including interference that may cause undesired operation. Class B statement NOTE:

This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

Reorient or relocate the receiving antenna. Increase the separation between the equipment and receiver. Connect the equipment into an outlet on a circuit different from that to which the 3 / 48 receiver is connected. Consult the dealer or an experienced radio/TV technician for help. TESSERA TECHNOLOGY INC. Modifications Any modifications made to this device may void the authority granted to the user by the FCC to operate this equipment.

[ ISED WARNING & NOTICE ]

ICES-003 Class B Notice - Avis NMB-003, Classe B This Class B digital apparatus complies with Canadian ICES-003. Cet appareil numrique de la classe B est conforme la norme NMB-003 du Canada. Innovation, Science and Economic Development Canada (ISED) compliance information This device contains licence-exempt transmitter/receiver that comply with Innovation, Science and Economic Development Canadas licence-exempt RSS(s). Operation is subject to the following two conditions:

(1) This device may not cause interference

(2) This device must accept any interference, including interference that may cause undesired operation of the device. Innovation, des Sciences et du dveloppement conomique (ISED) conformit Renseignements Lmetteur exempt de licence contenu dans le prsent appareil est conforme aux CNR dInnovation, Sciences et Dveloppement conomique Canada applicables aux appareils radio exempts de licence. Lexploitation est autorise aux deux conditions suivantes :

(1) Lappareil ne doit pas produire de brouillage;

(2) Lappareil doit accepter tout brouillage radiolectrique subi, mme si le brouillage est susceptible den compromettre le fonctionnement.

[ CE, European Union WARNING & NOTICE ]

Information and notification for safety use This kit intends to use for develop a wireless communication software or evaluate RF characteristics. Be careful with the handling of the kit, the projections possibly hurt your body. The board is an open PCB without any casing as it is quite common in development and 4 / 48 TESSERA TECHNOLOGY INC. evaluation environment. such equipment is likely to be damaged by ESD. Please use this product only ESD-safe environment, same as a semiconductor. Please use the built in antennas for radio communication. This kit has acquired CE certification, using the dedicated software made by Renesas. Please note that the use of software other than the dedicated software made by Renesas, or the operation by software modification will not conform to the certification. WEEE The WEEE (Waste Electrical and Electronic Equipment) regulations put responsibilities on producers for the collection and recycling or disposal of electrical and electronic waste. Return of WEEE under these regulations is applicable in the European Union only. This equipment (including all accessories) is not intended for household use. After use the equipment cannot be disposed of as household waste, and the WEEE must be treated, recycled and disposed of in an environmentally sound manner. Renesas Electronics Europe GmbH can take back end of life equipment, register for this service at http://www.renesas.eu/weee 5 / 48 TESSERA TECHNOLOGY INC. Contents 1. Board overview ................................................................................................. 7 1.1. purpose ...................................................................................................... 7 1.2. Included items ............................................................................................. 7 1.3. Board appearance ........................................................................................ 8 1.4. Component placement .................................................................................. 9 1.5. Factory pin settings .................................................................................... 10 2. Specification ................................................................................................... 11 2.1. Connection relationships inside the board ...................................................... 12 3. Description of the power supply ......................................................................... 19 3.1. VCC-IN Supply Normal Power Supply Operation ............................................. 21 3.2. USB-Pass Power Supply Normal Power Supply Operation ................................ 23 3.3. Emulator E2 Supply Normal Power Operation................................................. 25 3.4. Emulator J-Link/I-jet Supply Normal Power Operation .................................... 28 3.5. EH (Energy Harvest) Power Operating Mode .................................................. 30 4. Boot mode ...................................................................................................... 33 4.1. Normal boot mode operation description ....................................................... 34 4.2. Serial Wire Debugging (SWD) Mode Operation Description .............................. 34 4.3. Energy Harvest Launch Mode ...................................................................... 36 4.4. SCI boot mode .......................................................................................... 36 5. Description of each part .................................................................................... 41 5.1. LED .......................................................................................................... 41 5.2. Switch ...................................................................................................... 41 5.3. External clock description ............................................................................ 41 5.4. I/F Connector ............................................................................................ 42 5.5. Current measurement ................................................................................ 45 6. Schematics ..................................................................................................... 46 7. Notes on construction design certification ........................................................... 48 6 / 48 TESSERA TECHNOLOGY INC. 1. Board overview The EB-RE01B board provides an environment for the evaluation of the RE01B microcomputer including its energy harvest control function with Ultra-low current consumption operation and also allows for the evaluation of the on-chip Bluetooth Low EnergyBLEfunction. 1.1. purpose The EB-RE01B board is an evaluation board for RE01B MCU operating at ultra-low supply current. It provides for the evaluation if the Energy harvest control function, Bluetooth Low Energy (BLE) evaluation, current consumption measurement, and allows for the development of user software. 1.2. Included items The contents of this evaluation board is shown in Table 1-1. Debuggers (e.g. E2, J-link) used in software development, energy harvesting elements (such as solar panels) and secondary batteries or super capacitors used as power storage elements for evaluating energy harvest solutions are not included. No Included items 1 Main board 2 3 spacers 5, screws 5, Notes Table 1-1 Bundles Model No. EB-RE01B Table 1-2: What needs to be prepared separately. No Things that need to be prepared separately 1 USB cable 1 Used for powering or writing the Renesas Flash Programmer (RFP) 2 Energy Harvest Elements Used in Energy Harvest Evaluation

(solar panels, etc.) 3 wires with alligator clip 2 Used to connect energy harvest elements to 4 Super capacitor / Secondary Used in Energy Harvest Evaluation evaluation boards Battery 5 emulator Used in debug evaluation For component selection in energy harvesting evaluations, please refer to RE01 1500KB, 256KB Group Battery Maintenance Free Energy Harvesting System Power Management

(R01NA4837). 7 / 48 TESSERA TECHNOLOGY INC. 1.3. Board appearance The EB-RE01B appearance diagram is shown in Figures 1-1 and 1-2. The size of the board is 110.0mm in height and 156mm in width. Figure 1-1: Board Appearance (TOP) Figure1-2: Board Appearance (Bottom) 8 / 48 p TESSERA TECHNOLOGY INC. 1.4. Component placement The mounted components are shown in Figure 1-3. JP2 JP3 JP4 JP5 JP1 C2 SW5 SW2 PMOD2 SW1 JP13 JP12 JP11 JP10 CN4 CN1 SW6 SW4 SW3 PMOD1 JP9 JP7 JP8 Figure 1-3: Component placement 9 / 48 TESSERA TECHNOLOGY INC. 1.5. Factory pin settings The component layout of the EB-RE01B board as shipped from the factory is shown in Figure 1-4 and the configuration in Table 1-2. Figure 1-4 Factory Part Placement and Settings (Board) Table 1-2 : Factory Part Placement and Settings (Table) Reference function SW3 SW4 JP1 JP2 JP3 JP4 JP5 JP7 JP8 JP9 JP10 JP11 JP12 JP13 Operating mode settings Operating mode settings Operating mode settings MCU power line BLE Power Line Settings S_Chip Normal Close Close Close Single Chip Mode Normal operation Normal operation Power applied Power applied Operating mode settings 2-3 short Regulator Out Operating mode settings 1-2 short USB Operating mode settings 1-2 short Normal operation Operating mode settings 1-2 short Normal operation Operating mode settings 1-2 short Normal operation RFP/UART switching RFP/UART switching UART CTS/RTS Switching Operating mode settings 2-3 short 2-3 short Open Close UART settings UART settings Not set UART available 10 / 48 TESSERA TECHNOLOGY INC. 2. Specification The board specifications are given in Table 2-1. MCU RE01B 64pin, Flash1.5MB, RAM256KBR7F0E01BD2DNB Table 2-1: Evaluation Board Specification Table MCU voltage VCC 1.623.6V VCC_RF 1.83.6V Internal voltage regulator Output voltage 3.3V (USB CN4, SWD CN1 (11/13Pin) supply) Main external oscillator 32MHz Crystal oscillator Sub-external oscillator 32.768kHz Crystal oscillator BLE external oscillator 32MHz Crystal oscillator I/F USB connector (USB-Serial conversion, general purpose UART/programming) SWD 20pin 1.27mm Pitch Connector (19pin Cortex-M) pmodTM connector x2 PMOD1(12Pin SPI), PMOD2 (12Pin UART) switch Reset switch 1 LED General Purpose Momentary Switch 1 2 MCU mode configuration switches 2 power discharge switches Power supply LED 1 General Purpose LED 1 Two USB-Serial LED Radio standards Bluetooth 5.0 Low Energy single mode compliant Radio Law Standards 2.4GHz Band Advanced Low Power Data Communication System Output frequency 2402MHz2480MHz Transmit power Approx. +4dBm antenna Dielectric chip antenna For more information about MCUs, see Hardware Annual, RE01B Group (Products with 1.5M Byte Flash Memory) User's Manual Hardware Edition (R01UH0903). 11 / 48 TESSERA TECHNOLOGY INC. 2.1. Connection relationships inside the board The connection between the components of the EB-RE01B board and the RE01B is shown in Figure 2-1. A list of the connection terminals is shown in Table 2-2 to Table 2-8. Figure 2-1: Connection relationships on board 12 / 48 RRE01B IOVCCIOVCC1IOVCC2IOVCC3SWCLK/P411/SCK3_A/TXDSP,SWDIO/CTS3_A/RTS3_A/SS3_A/RXDSPP609/TXD2_C/SSDA2_C/MOSI2_C/MOSIB_B,P608/RXD2_C/SSCL2_C/MISO2_C/MISOB_B,P607/CTS2_C/RTS2_C/SS2_C/RSPCKB_BP300,P301,P305, P704P606/SCK2_C/SSLB2_BP107, P112/SSLB3_A, P113/SSLB2_AP012/AN003P505/AN027P506/AN028RES#: Signal Line: ResistorP413/TXD3_A/SSDA3_A/MOSI3_A,P412/RXD3_A/SSCL3_A/MISO3_A,P411/SCK3_A/TXDSP,P207/CTS3_A/RTS3_A/SS3_A/RXDSPAVCC0P704/TMCI1, P701/SCL1,P700/SDA1, P301/TMRI0_B,P300/TMO0_B, P305,P102/TXD2_A/SSD2_A/MOSI2_AP500/AN022,P003/AN002,P002,P001/AN001,P000/AN000RRRRRRRRRRRSWD SCIRESIOIOTH3TH2USB-UART Circuit USB-UART IC (IC3)Micro-B ConnectorUSB(CN4)PMOD1 SPI(CN3)User LEDS (LED2)User Switch (SW2)Emulator Connector (CN1)PMOD2-UART(CN7)TH1TH4 TESSERA TECHNOLOGY INC. Table 2-2: List of connection terminals with each function (1/2) classification function CLOCK EXTAL XTAL XCIN XCOUT XTAL2_RF XTAL1_RF SWITCH SW1 (RES#) SW2 SW3 (MD) SW4 (EHMD) RE01B board port pin header number pin P412 P413 8 7 5 4 44 45 16 P505 52 P201 17 12 power domain IOVCC IOVCC IOVCC IOVCC IOVCC IOVCC3 IOVCC IOVCC LED LED2 P506 51 IOVCC3 PMOD1 SPI SS (SCK2_C/SSLB2_B) P606 36 CN3-1 ICVCC1 33 34 35 31 30 27 CN3-2 IOVCC1 CN3-3 ICVCC1 CN3-4 IOVCC1 CN3-7 IOVCC1 CN3-8 IOVCC1 CN3-9 IOVCC1 P300 P301 P305 P704 24 CN3-10 IOVCC1 MOSI (TXD2_C/SSDA2_C/MOSI2_C/MOSIB_B) P609 MISO (RXD2_C/SSCL2_C/MISO2_C/MISOB_B) P608 SCK (CTS2_C/RTS2_C/SS2_C/RSPCKB_B) P607 GPIO (P300 has low initial output) GPIO (P301 has an initial low output) GPIO GPIO 13 / 48 TESSERA TECHNOLOGY INC. Table 2-3: List of connection terminals with each function (2/2) classification function RE01B board port pin header number pin power domain PMOD2 UART RTS/CTS (CTS2_C/RTS2_C/SS2_C/RSPCKB_B) P607 TXD (TXD2_C/SSDA2_C/MOSI2_C/MOSIB_B) P609 RXD (RXD2_C/SSCL2_C/MISO2_C/MISOB_B) P608 GPIO (SCK2_C/SSLB2_B) GPIO (IRQ7_A) GPIO (SSLB3_A) GPIO (SSLB2_A) GPIO USB-Serial TXD2_C/SSDA2_C/MOSI2_C/MOSIB_B P606 P107 P112 P113 P012 P609 RXD2_C/SSCL2_C/MISO2_C/MISOB_B P608 SWD I/F SWDIO/CTS3_A/RTS3_A/SS3_A/RXDSP P207 SWCLK/SCK3_A/TXDSP P411 RES #

35 33 34 36 42 39 38 56 33 34 15 11 16 CN7-1 IOVCC1 CN7-2 IOVCC1 CN7-3 IOVCC1 CN7-4 IOVCC1 CN7-7 IOVCC2 CN7-8 IOVCC2 CN7-9 IOVCC2 CN7-10 IOVCC3 CN4-2 IOVCC1 CN4-3 ICVCC1 CN1-2 IOVCC CN1-4 IOVCC CN1-10 IOVCC 14 / 48 classification function TH1 VSS IOVCC0 VCLH D_GND D_GND VSS TESSERA TECHNOLOGY INC. Table 2-4: Test Pins (TH1) port RE01B board power Pin number Header pin domain

P413 P412

P411

1 2 3

6 7 8 9 10 11 12 13 14 15 16

TH1-1 TH1-2 TH1-3 TH1-4 TH1-5 TH1-6 TH1-7 IOVCC TH1-8 IOVCC TH1-9 TH1-10 TH1-11 IOVCC TH1-12 TH1-13 TH1-14 TH1-15 IOVCC TH1-16 IOVCC TH1-17 TH1-18 TXD3_A/SSDA3_A/MOSI3_A RXD3_A/SSCL3_A/MISO3_A VCC/IOVCC VCL SCK3_A/TXDSP EHMD VBN VBP CTS3_A/RTS3_A/SS3_A/RXDSP P207 RES #

D_GND D_GND

15 / 48 TESSERA TECHNOLOGY INC. Table 2-5: Test Pins (TH2) port P201 P200

P704 P701 P700 P305

P301 P300

RE01B board power Pin number Header pin domain 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31

TH2-1 IOVCC TH2-2 IOVCC TH2-3 TH2-4 TH2-5 TH2-6 TH2-7 TH2-8 TH2-9 IOVCC1 IOVCC1 TH2-10 IOVCC1 TH2-11 IOVCC1 TH2-12 TH2-13 TH2-14 IOVCC1 TH2-15 IOVCC1 TH2-16 TH2-17 TH2-18 classification function TH2 TMRI0_A TMO0_A VSS VCC_SU VBAT_EHC VSC_VCC VSS TMCI1 SCL1 SDA1 P305 IOVCC1 VSS TMRI0_B TMO0_B D_GND D_GND D_GND 16 / 48 TESSERA TECHNOLOGY INC. classification function Table 2-6: Test Pins (TH3) RE01B port Pin number board power Header pin domain TH3 TXD2_C/SSDA2_C/MOSI2_C/MOSIB_B P609 33 TH3-1 IOVCC1 RXD2_C/SSCL2_C/MISO2_C/MISOB_B P608 34 TH3-2 IOVCC1 CTS2_C/RTS2_C/SS2_C/RSPCKB_B P607 35 TH3-3 IOVCC1 SCK2_C/SSLB2_B P606 36 TH3-4 IOVCC1 D_GND SSLB2_A SSLB3_A IOVCC2 VSS P107

TH3-5 P113 38 TH3-6 IOVCC2 P112 39 TH3-7 IOVCC2

40

TH3-8 TH3-9 P107 42 TH3-10 IOVCC2 P102/TXD2_A/SSD2_A/MOSI2_A P102 43 TH3-11 IOVCC2 D_GND D_GND AVCC_RF D_GND VCCRF D_GND D_GND

46

48

TH3-12 TH3-13 TH3-14 TH3-15 TH3-16 TH3-17 TH3-18 17 / 48 TESSERA TECHNOLOGY INC. Table 2-7: Test Pins (TH4) port

P506 P505 P500

P012 P003 P002

P001 P000

RE01B board power Pin number Header pin domain

51 52 53 54

56 57 58

60 61 62 63 64

TH4-1 TH4-2 TH4-3 IOVCC3 TH4-4 IOVCC3 TH4-5 IOVCC3 TH4-6 TH4-7 TH4-8 IOVCC3 TH4-9 AVCC0 TH4-10 AVCC0 TH4-11 TH4-12 AVCC0 TH4-13 AVCC0 TH4-14 TH4-15 TH4-16 TH4-17 TH4-18 classification function TH4 D_GND D_GND AN028 AN027 AN022 IOVCC3 VSS AN003 AN002 P002 VREFL0 AN001 AN000 VREFH0 AVCC0 AVSS0 D_GND D_GND Table 2-8: Terminals with initial output Terminal name P300 P301 P704 Initial value Low output Low output High output 18 / 48 TESSERA TECHNOLOGY INC. 3. Description of the power supply Table Table 3-1 shows the various ways that power can be supplied to the board. There is a normal power supply operation mode that supplies the board's internal power supply and an EH (Energy Harvest) power supply operating mode that uses the Energy Harvest Control Circuit (EHC) to supply the MCU VCC from the power generation element. The EHC enables the MCU to be activated with a very small input current and provides protection against secondary battery overcharging and over discharge. For more information about EHC functionality, see Chapter 13 of the RE01B Group (1.5M Flash Memory Products) User's Manual Hardware Edition (R01UH0903). power power explanation Table 3-1: How to Supply Power Operating Supply source mode Normal External power The power supply inside the board is supplied power supply supply (VCC-IN directly from the stabilized power supply, etc. terminal) behavior USB Generates internal power on the board using USB bus power Emulator E2 Power the inside of the board directly from the E2 emulator Emulator J-Link Generate the internal power supply of the board using the power supplied by the J-Link emulator, etc. EH Power Power Generation Supply MCU VCC from power generation elements behavior Elements (VSC_VDD) via EHC 19 / 48 The block diagram and power wiring Figure 3-1 TESSERA TECHNOLOGY INC. Figure 3-1: Block diagrams and power wiring 20 / 48

: Power LineR: Resistor: Jumper switchTH: Through holeTP: Test PinRE01BMCUEHCTP1USB(CN4)LDO(IC2)IOVCC0IOVCCIOVCC1IOVCC2VREFH0IOVCC3AVCC0BLEVCC_RFAVCC_RFJP5JP4JP1JP2JP3RRRRRRRTP9TP11RRJP8JP7VBAT_EHCVSC_VCCVCC/IOVCCD_GNDVCC/IOVCCVCC/IOVCCPMOD1PMOD2TH1TH4TH3TH25.0V3.3VSWD I/F(CN1)5.0V3.3VVCC_SUJP9VCC/IOVCCD_GND100uF TESSERA TECHNOLOGY INC. 3.1. VCC-IN Supply Normal Power Supply Operation The power supply inside the board is supplied directly from the stabilized power supply, etc. The supply lines on the power supply are shown in Figure 3-2 1.62V to 3.6V (when BLE is not used) 1.8V to 3.6V (with BLE) Figure 3-2: Power Lines supplied by VCC-IN 21 / 48

: Power LineR: Resistor: Jumper switchTP: Test PinRE01BMCUEHCTP1USB(CN4)LDO(IC2)IOVCC0IOVCCIOVCC1IOVCC2VREFH0IOVCC3AVCC0BLEVCC_RFAVCC_RFJP5JP4JP1JP3JP2RRRRRRRTP9TP11RRJP8JP7VBAT_EHCVSC_VCCVCC/IOVCCD_GNDVCC/IOVCCVCC/IOVCC5.0V3.3VSWD I/F(CN1)5.0V3.3VVCC_SUJP9VCC/IOVCCD_GND100uF1.62V~3.6V Set the jumper pin switch as Table 3-2, Figure 3-3, and add the voltage to supply the MCU, etc. to TP1(+) TP2(-). TESSERA TECHNOLOGY INC. Table 3-2: VCC-IN supply (table) reference establishment reference establishment SW3 SW4 S_ChipSingle chip mode Normal JP1 JP2 JP3 JP4 JP5 JP7 JP8 JP9 JP10 JP11 JP12 JP13 Close Close Close 1-2VCC-IN Open 1-2Normal mode 1-2Normal mode 1-2Normal mode

-Dont care

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-Dont care Figure 3-3: Settings supplied by VCC-IN (Board) 22 / 48 TESSERA TECHNOLOGY INC. 3.2. USB-Pass Power Supply Normal Power Supply Operation USB-Pass power is used to generate the internal power supply of the board. The supply lines on the power wiring Figure 3-4 Figure 3-4: Power lines with USB supply 23 / 48

: Power LineR: Resistor: Jumper switchTP: Test PinRE01BMCUEHCTP1USB(CN4)LDO(IC2)IOVCC0IOVCCIOVCC1IOVCC2VREFH0IOVCC3AVCC0BLEVCC_RFAVCC_RFJP5JP4JP1JP3JP2RRRRRRRTP9TP11RRJP8JP7VBAT_EHCVSC_VCCVCC/IOVCCD_GNDVCC/IOVCCVCC/IOVCC5.0V3.3VSWD I/F(CN1)5.0V3.3VVCC_SUJP9VCC/IOVCCD_GND100uF TESSERA TECHNOLOGY INC. Set the jumper pin and switch as shown Table 3-3, Figure 3-5 and connect the USB cable to the USB connector (CN4). Table 3-3: settings with USB supply (table) reference establishment reference establishment SW3 SW4 S_ChipSingle chip mode Normal JP1 JP2 JP3 JP4 JP5 JP7 JP8 JP9 JP10 JP11 JP12 JP13 Close Close Close 2-3Regulator Out 1-2USB 1-2Normal mode 1-2Normal mode 1-2Normal mode

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-Dont care Figure 3-5: Settings with USB Supply (Board) 24 / 48 TESSERA TECHNOLOGY INC. 3.3. Emulator E2 Supply Normal Power Operation Power inside the board is supplied directly from the E2 emulator (E2 emulator Lite). The supply lines on the power are shown in Figure 3-6. Figure 3-6: Emulator E2 Supply 25 / 48

: Power LineR: Resistor: Jumper switchTP: Test PinRE01BMCUEHCTP1USB(CN4)LDO(IC2)IOVCC0IOVCCIOVCC1IOVCC2VREFH0IOVCC3AVCC0BLEVCC_RFAVCC_RFJP5JP4JP1JP3JP2RRRRRRRTP9TP11RRJP8JP7VBAT_EHCVSC_VCCVCC/IOVCCD_GNDVCC/IOVCCVCC/IOVCC5.0V3.3VSWD I/F(CN1)5.0V3.3VVCC_SUJP9VCC/IOVCCD_GND100uF Set the jumper pin and switch as shown Table 3-4, Figure 3-7 and connect the E2 emulator to SWD I/F (CN1). TESSERA TECHNOLOGY INC. Table 3-4: Settings in Emulator E2 Supply (Table) reference establishment reference establishment SW3 SW4 S_ChipSingle chip mode Normal JP1 JP2 JP3 JP4 JP5 JP7 JP8 JP9 JP10 JP11 JP12 JP13 Close Close Close Open Open 1-2Normal mode 1-2Normal mode 1-2Normal mode

-Dont care

-Dont care Open

-Dont care Figure 3-7: Settings in EmulatorE2 Supply (Board) 26 / 48 Please set the power supply of "e2 studio" to output 3.3V from the E2 emulator as shown in Figure 3-8. TESSERA TECHNOLOGY INC. Figure 3-8: "e2 studio" power supply setting screen 27 / 48 TESSERA TECHNOLOGY INC. 3.4. Emulator J-Link/I-jet Supply Normal Power Operation The board's internal power supply is generated using the power supplied by the J-Link and I-jet emulators. The supply lines on the power supply wiring are shown in Figure 3-9. Figure 3-9: supplied by Emulator J-link 28 / 48

: Power LineR: Resistor: Jumper switchTP: Test PinRE01BMCUEHCTP1USB(CN4)LDO(IC2)IOVCC0IOVCCIOVCC1IOVCC2VREFH0IOVCC3AVCC0BLEVCC_RFAVCC_RFJP5JP4JP1JP3JP2RRRRRRRTP9TP11RRJP8JP7VBAT_EHCVSC_VCCVCC/IOVCCD_GNDVCC/IOVCCVCC/IOVCC5.0V3.3VSWD I/F(CN1)5.0V3.3VVCC_SUJP9VCC/IOVCCD_GND100uF TESSERA TECHNOLOGY INC. Set the jumper pin Table 3-5Figure 3-10-10 and connect the J-Link emulator, etc. to SWD I/F (CN1) via"19Pin J-Link Adapter". Generate the board's internal power supply using 5.0V supplied to CN1 11 pin and 13 pin from J-Link emulators, etc. Table 3-5: Settings for Emulator J-link/I-jet Supply (Table) reference establishment reference establishment SW3 SW4 S_ChipSingle chip mode Normal JP1 JP2 JP3 JP4 JP5 JP7 JP8 JP9 JP10 JP11 JP12 JP13 Close Close Close 2-3Regulator Out 2-3Emulator 1-2Normal mode 1-2Normal mode 1-2Normal mode

-Dont care

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-Dont care Figure 3-10: Jumper pin and switch settings for Emulator J-link/I-jet supply (board) 29 / 48 3.5. EH (Energy Harvest) Power Operating Mode TESSERA TECHNOLOGY INC. 3.5.1. Hardware settings Power is supplied from the power generation element to the MCU VCC via the Energy Harvesting Controller (EHC). The supply lines on the power are shown in Figure 3-11. Figure 3-11: EH Power Supplies 30 / 48

: Power LineR: Resistor: Jumper switchTP: Test PinRE01BMCUEHCTP1USB(CN4)LDO(IC2)IOVCC0IOVCCIOVCC1IOVCC2VREFH0IOVCC3AVCC0BLEVCC_RFAVCC_RFJP5JP4JP1JP3JP2RRRRRRRTP9TP11RRJP8JP7VBAT_EHCVSC_VCCVCC/IOVCCD_GNDVCC/IOVCCVCC/IOVCC5.0V3.3VSWD I/F(CN1)5.0V3.3VVCC_SUJP9VCC/IOVCCD_GND100uF TESSERA TECHNOLOGY INC. Set the jumper pins/switches as shown below and connect a generator element etc. to TP11 (+) TP12 (-) (VSC_VCC). Table 3-6: Settings for EH Power Supply (Table) reference establishment reference establishment SW3 SW4 S_ChipSingle chip mode EHC JP1 JP2 JP3 JP4 JP5 JP7 JP8 JP9 JP10 JP11 JP12 JP13 Open Close Close Open Open 2-3EHC mode 2-3EHC mode 2-3EHC mode Open Open Open Open Figure 3-12: Settings for EH Power Supply (Board) 31 / 48 TESSERA TECHNOLOGY INC. Connect a VBAT_EHC or electric double-layer capacitor to the EHC's battery

(TP9(+)TP10 (-). Connect MCU_VCC (10F) supplied with C2 (10F). The supply VSC_VCC EHC(EHC) is limited to 4.0V/10mA or less. The EHC' VCC_SU" (storage capacitor) is connected to a capacitor of about 100F. For more information on starting up using EHC, see section 4.3 Energy harvesting start-

up mode. 3.5.2. Software settings The firmware definition expression SYSTEM_CFG_EHC_MODE must be set to 1 (EHC mode). This definition expression is defined in the r_core_cfg.h file. The location of the r_core_cfg.h file can be found, for example, in the sample code RE01B Group Bluetooth Low Energy sample code (using CMSIS Driver Package) AN5606 published by Renesas Electronics, It is stored under Device > Config. Figure 3-13 r_core_cfg.h File EH Settings 32 / 48 TESSERA TECHNOLOGY INC. 4. Boot mode The start-up modes are shown in Table 4-1. 4 different start-up modes are available. The starting mode can be selected using the EHMD switch (SW4) and the MD switch (SW3) as shown in Figure 4-1. Boot mode Table 4-1: Four Startup Modes Switch settings EHMD

(SW4) MD

(SW3) explanation Normal start-up SWD Debugging Normal

(Low) Energy Harvest EHC Launch SCI boot mode

(High) Dont Care User programs written to code flash memory Stand-alone execution. S_Chip Make emulator connections using the SWD

(Low) interface. Mode used when operating with EHC. Boot

(High) Using the Renesas Flash Programmer (RFP), Program the flash memory with a USB connection. Figure 4-11: EHMD switch (SW4) and MD switch (MD3) on the boat 33 / 48 4.1. Normal boot mode operation description TESSERA TECHNOLOGY INC. When the switch is set as shown below and the reset is released, the user program written in the code flash memory is executed. Set the switch as shown in Table 4-2 and use in normal power supply operation mode. Table 4-2 : Normal Boot Mode Switch Settings reference establishment MDSW3 EHMDSW4 S_ChipSingle chip mode

(Low) Normal

(Low) 4.2. Serial Wire Debugging (SWD) Mode Operation Description When the switch is set as follows and an emulator etc. is connected to "SWD I/F (CN1)", the emulator connection using the SWD interface is possible. Set the switch as shown in Table 4 3 and use it in normal power supply operation mode. It is possible to connect E2 Emulator, E2 Emulator Lite, IAR I-jet and SEGGER J-Link as emulator. Table 4-3: SWD Mode Switch Settings (Table) reference establishment reference establishment MD (SW3) S_Chip (Low) EHMD (SW4) Normal (Low) JP1 JP2 JP3 JP4 JP5 JP7 JP8 JP9 JP10 JP11 JP12 JP13 Close Close Close 2-3 Regulator Out 2-3 Emulator for E2/E2 lite Open for J-link I-jet 1-2Normal mode 1-2Normal mode 1-2Normal mode Dont care Dont care Open Dont care 34 / 48 TESSERA TECHNOLOGY INC. Figure 4-2 : SWD Mode Jumper Pin Switch Settings (Board) The device must be able to transition to the On-Chip Debug (OCD) mode, but there are some modes in which the device cannot directly transition to the OCD mode, such as EXFPWON NORMAL, MINPWON NORMAL and VBB. In order to debug in EXFPWON, NORMAL, MINPWON NORMAL or VBB, please make transition to OCD mode while operating in ALLPWON NORMALL, and then transition to EXFPWON NORMAL, MINPWON NORMAL or VBB. For more details, please refer to 2.7.2 "Limitation of emulator connection" of RE01B group (product with 1.5M byte flash memory) User's Manual Hardware Edition (R01UH0903). 35 / 48 4.3. Energy Harvest Launch Mode TESSERA TECHNOLOGY INC. This mode is used when the EHC is used for operation. See section "3.5EH (Energy Harvesting) Power Supply Mode" for jumper pin and switch settings for EH power supply mode. After charging the VCC_SU capacitor from the generator connected to VSC_VCC, the EHC will start to supply power to VCC. When the reset is released by a power-on reset, the back bias voltage control (VBBC) circuit is initialized, and the user program written in the code flash memory is executed. Table 4-4 : Energy Harvest Start Mode Switch Settings reference establishment MDSW3 EHMDSW4 S_ChipSingle chip mode

(Low) EHC

(High) 4.4. SCI boot mode 4.4.1. SCI boot mode settings Serial programming of flash memory is possible by using RFP (Renesas Flash Programmer). There are two ways to send the data to be written to the flash memory, one is through USB (CN4) and the other is through E2 emulator (CN1). 4.4.2. SCI boot mode settings (via USB) Connect the USB cable to the USB connector (CN4). Make the switch and jumper settings as shown in Table 4-5 and use the device in normal power supply operation mode. 36 / 48 TESSERA TECHNOLOGY INC. Table 4-5: SCI boot (via USB) Jumper Pin Switch Settings (Table) reference Establishment reference establishment SW3 SW4 BootSCI boot mode

-Dont care JP1 JP2 JP3 JP4 JP5 JP7 JP8 JP9 JP10 JP11 JP12 JP13 Close Close Close 2-3 Regulator Out 1-2USB 1-2Normal mode 1-2Normal mode 1-2Normal mode 1-2RFP 1-2RFP Open Close RFP connection If connection is not possible using the normal procedure, please follow the steps below. 1. make the connections in Table 4 5. Connect the USB port (CN4) of the EB-RE01B board to the PC with a USB cable. (Power will be supplied via USB). 2. start RFP on the PC. 3. go to File > Create New Project, select Microcontroller as RE, name the project and make sure that "USB Serial Port" is selected in Tools. 4. press SW1 on the EB-RE01B board once. (Board reset) 5. select "Connect" on the RFP. 6. 6. the RFP will display "Operation successful." is displayed on the RFP. 7. Press SW1 on the EB-RE01B board once. (Board reset) 8. select the program file to be written. 9. Press the "Start" button on the RFP. 10. When writing is completed on the RFP, the message "Operation successful. is displayed on the RFP. 37 / 48 TESSERA TECHNOLOGY INC. Figure 4-3: Sci boot (via USB) Jumper Pin Switch Settings (Board) Figure 4-4: SCI boot (via USB) Power and Signal Lines 38 / 48

: Power LineR: Resistor: Jumper switchJP11USB-UART Circuit USB-UART IC (IC3)Micro-B ConnectorUSB(CN4)JP10JP12RXDTXDCTSRTSRE01BSWCLKP609SWDIOP608P607RRRR: SignalLineJP13Ext_VCC (3.3V)USB_3V3USB_3V3131313 TESSERA TECHNOLOGY INC. 4.4.3. SCI boot mode settings (via E2 emulator) Connect the E2 emulator to the connector for the emulator (CN 1). Switch settings be selected as shown in Table 4-6 and are typically used in power operating mode. Table 4-6: SWD Mode (via Emulator) Switch Settings (Table) reference establishment reference establishment SW3 SW4 BootSCI boot mode

-Dont care JP1 JP2 JP3 JP4 JP5 JP7 JP8 JP9 JP10 JP11 JP12 JP13 Close Close Close Open Open 1-2Normal mode 1-2Normal mode 1-2Normal mode Dont care Dont care Open Open RFP connection If the connection cannot be made using the normal procedure, please follow the steps below. 1. Make the connection as shown in Table 4-6, Figure 4-5, Connect the emulator connector (CN4) of the EB-RE01B board to the PC with an emulator. 2. start RFP on the PC. 3. 3. go to File > Create New Project, select Microcontroller as RE, name the project and select "E2 emulator" in Tools. Make sure that 3.3V is selected in the tool details. See Figure 4-6. 4. select "Connect" on the RFP. 5. the RFP will show "Operation successful. is displayed on the RFP. 6. select the program file to be written. 7. Press the "Start" button on the RFP. 8. When the RFP has completed writing, the message "Operation successful. is displayed on the RFP. 39 / 48 TESSERA TECHNOLOGY INC. Figure 4-5: SCI boot (via E2 emulator) Jumper pin switch settings (board) Figure 4-6: Select 3.3V in the tool details on the RFP screen 40 / 48 TESSERA TECHNOLOGY INC. 5. Description of each part 5.1. LED Reference connection explanation name LED1 LED2 LED3 LED4 CPU_VIN Lights up when the MCU is supplied with an internal voltage. MCU P506 General purpose LED. Low output from P506 lights up. FT232RL Tx Flashes when the USBconnector (CN4) communicates to USB-

FT232RL Rx Serial. 5.2. Switch 5.2.1. Mode setting switch Reference connection explanation name SW3 SW4 MD/P201 Toggle Single Chip Mode / SCI boot mode. EHMD Switch between Normal Mode / EHC Mode. 5.2.2. Momentary Switch Reference connection explanation name SW1 SW2 SW5 SW6 RES #

MCU reset. P505/IRQ1_C General purpose push switch. Connect to GND when pressed.

(MCU_VCC) MCU_VCC discharges the battery.

(VCC_SU) VCC_SU discharges the battery. 5.3. External clock description Reference connection explanation name XTAL1 XTAL2 XTAL3 Main Clock Oscillator(MOSC) 32MHz Crystal Resynthes Subclock oscillator(SOSC) 32.768kHz Crystal Resynthes Bluetooth Oscillator (BLELK) 32MHz Crystal Resynthes The subclock oscillator drive capability (SODRV, SODRV0) should be set to "low CL4" as follows. SODRV = 1 SODRV0 = 0 41 / 48 TESSERA TECHNOLOGY INC. 5.4. I/F Connector 5.4.1. SWD I/FCN1 Connect E2 emulator, E2emulatorLite, IAR I-jet, SEGGER J-Link, and debugger in SWD debug mode. A 20pin 1.27mm Pitch connector is implemented.

"19pin Cortex-M Adapter" etc. may be required. Please do not set JP10 and JP11 to "1-2 (RFP)" when using the I/F connector. Connector signal connection Pin connection Pin connection 1 3 5 7 9 11 13 VCC (internal voltage) GND GND

GND 2 4 6 8 SWDIO SWCLK Pull-Up N.C. 10 RESET 5V (Voltage regulator input) 12 Pull-Down 5V (Voltage regulator input) 14 N.C. 15 GND 17 GND 19 GND 16 N.C. 18 N.C. 20 N.C. 5.4.2. USB Connector (CN4) It is connected to a USB-Serial conversion IC and is recognized by the PC as a virtual COM port. The USB driver can be downloaded from the following URL. URL http://www.ftdichip.com/

Normally, the USB driver is installed automatically when connected to a Windows PC. Serial programming in general-purpose UART and SCI boot modes is possible. Please connect JP13 when using. 42 / 48 TESSERA TECHNOLOGY INC. When serial programming in SCI boot mode, set it as follows. Reference name establishment JP10 JP11 JP12 JP13 1-2RFP 1-2RFP Open Close Do not connect the emulator to SWD I/F (CN1) when using in SCI boot mode (via USB). When serial communication is performed using UART, set it as follows. Reference name establishment connection JP10 JP11 JP12 JP13 2-3UART P609TXD2_C 2-3UART P608RXD2_C 1-2CTS 2-3RTS Close P607 Do not connect anything to the PmodTM connector (CN3, CN7) when used with UART connections. Figure 4-7: Wiring connections for JP10, 11, 12 and 13 43 / 48

: Power LineR: Resistor: Jumper switchJP11USB-UART Circuit USB-UART IC (IC3)Micro-B ConnectorUSB(CN4)JP10JP12RXDTXDCTSRTSRE01BSWCLKP609SWDIOP608P607RRRR: SignalLineJP13Ext_VCC (3.3V)USB_3V3USB_3V3131313 TESSERA TECHNOLOGY INC. 5.4.3. PmodTM Connector (CN3) This is a Digilent PmodTM compatible connector with 12Pin SPI connection. When using it, please set JP10 and JP11 to Open and do not connect anything to the PmodTM connector (CN7). Pin connection Pin 1 2 3 4 5 6 P606 P609 P608 P607 D_GND IOVCC1 7 8 9 10 11 12 P300 P301 P305 P704 D_GND IOVCC1 5.4.4. PmodTM Connector (CN7) Digilent PmodTM compatible connector with 12Pin UART connection. Set JP10 and JP11 to Open and do not connect anything to the Pmod TM connector (CN3). Pin connection Pin connection 1 2 3 4 5 6 P607 P609 P608 P606 D_GND IOVCC1 7 8 9 10 11 12 P107 P112 P113 P012 D_GND IOVCC1 44 / 48 TESSERA TECHNOLOGY INC. 5.5. Current measurement Current measurement of Microcontroller is possible, excluding the current consumed but other circuitry around the board. By connecting a current-meter between the TP3-TP4 and setting JP2 to open, it is possible to measure the current of the microcomputer (other than BLE). By connecting a current-meter between the TP7-TP8 and setting JP3 to open, it is possible to measure the current of the microcomputer (BLE only). Operate Microcontroller on its operating unit and power it from a USB or VCC-IN terminal. At 3.5EH (Energy Harvest) Power Operating Mode, Current consumption cannot be evaluated correctly. Jumper pin switch settings reference establishment reference establishment SW3 SW4 S_ChipSingle chip mode Normal JP1 JP2 JP3 JP4 JP5 JP7 JP8 JP9 JP10 JP11 JP12 JP13 Close Open Open 1-2(VCC-IN) or 2-3(USB) 1-2USB 1-2Normal mode 1-2Normal mode 1-2Normal mode Open Open Open Open 45 / 48 6. Schematics TESSERA TECHNOLOGY INC. 46 / 48 RES#R240R12P609VCLHVCC_SUAVCC0RF_GNDIOVCC2P012RF_GNDVCC_RFR6710k12P102C3847pF12IOVCC1SWCLK/P411/TXD9_ARF_GNDP201VBNVREFH0AVCC_RFP609P301SWCLKP701C72.2uF12C130.1uF12C31DNF12P113P505P001IOVCC1D_GNDP500D_GNDIC1R7F0E01BD2DNBVSS11IOVCC02VCLH3XCOUT4XCIN5VSS26XTAL/P4137EXTAL/P4128VCC/IOVCC9VCL10SWCLK/P411/TXDSP11EHMD12VBN13VBP14SWDIO/P207/RXDSP15RES#16MD/P20117P200/NMI18VSS319VCC_SU20VBAT_EHC21VSC_VCC22VSC_GND23P70424P70125P70026P30527IOVCC128VSS529P30130P30031VSS_RF32P609/TXD2_C/MOSIB_B33P608/RXD2_C/MISOB_B34P607/CTS2_C/RSPCKB_B35P606/SCK2_C/SSLB2_B36ANT37P11338P11239IOVCC240VSS641P10742P10243XTAL2_RF44XTAL1_RF45AVCC_RF46DCLOUT47VCC_RF48DCLIN_D49DCLIN_A50P50651P50552P50053IOVCC354VSS755P01256P00357P00258VREFL059P00160P00061VREFH062AVCC063AVSS064PAD65P606/SCK2_C/SSLB2_BEXTAL/P412P300VCC/IOVCCTitleSizeDocument NumberRevDate:SheetofTS-TCS09443E1.3EB-RE01BA323Tuesday, December 22, 2020D_GNDP413D_GNDD_GNDSWDIOP506VCC_SURES#R48DNF12C276pF12C82.2uF12R49DNF12EHMDEHMDP003L110uH12TH4FFC-18BMEP1123456789101112131415161718P500P000AVCC_RFP112AVCC0VCC/IOVCCVSSXTAL1HC-49/S3-32MHz12EHMDNo.2 Position :Normal (Low)No.3 Position :EHC (High)VCLVBAT_EHCIOVCC2RF_GNDIOVCC3VCLRF_GNDP608/RXD2_C/MISOB_BP506(Shield)P700C390.5pF12VSSC64.7uF12P413C150.1uF12R270R12P301P107P608P700P107P003VBPP000D_GNDP608L55.8nHVBNXTAL2SC-20S12C32DNF12L20R12C180.1uF12R410k12C293pF12C190.1uF12VCC/IOVCCD_GNDD_GNDP607/CTS2_C/RSPCKB_BD_GNDP300VREFL0P606P200/NMIP412P700P300P113P102P002VCC_SUSW4SM-0320102123RF_GNDD_GNDD_GND (DCLIN_D)VSSP002TH3FFC-18BMEP1123456789101112131415161718R2100k12C400.8pF12D_GND (XTAL2_RF)P003P701IOVCC0P201C200.1uF12P305P012P412P112VSC_VCCAVCC_RFIOVCC3RF_GNDthe characteristic impedance of 50ohm for RF lineVCLHRF_GNDVCC/IOVCCD_GNDD_GND (ANT)VSSL71.5nHD_GND (ICGND)P701VBNP505D_GNDD_GND (XTAL1_RF)(Shield)P301P607D_GNDEHMDXTAL3NX1612SA_32MHz1234P200RF_GNDC54.7uF12C410.2pF12P607VBAT_EHCVCC/IOVCCP002D_GNDD_GNDD_GNDP012MD/P201VCLP102RF_GNDAVCC0P001D_GNDP305L36.2nH12C170.1uF12C302pF12P200P001TH1FFC-18BMEP1123456789101112131415161718P112P606TH2FFC-18BMEP1123456789101112131415161718IOVCC2VSSVSSL62.7nHP000IOVCC0VCC_RFVREFH0IOVCC1RF_GNDVSSD_GNDRES#D_GND (DCLIN_A)P305D_GNDC160.1uF12L41.1nH12SWDIO/P207/RXD9_AR51DNF12C101uF12P704SW3SM-0320102123P506VSC_VCCP107IOVCC3P704VCLHANT1AM03DP-ST011P704P500VBPC111uF12R260R12C140.1uF12C286pF12R50DNF12VCC/IOVCCD_GND (DCLOUT)D_GNDD_GNDP609/TXD2_C/MOSIB_BVBAT_EHCD_GND (XCIN)C310uF12SWDIOMDNo.2 Position :Single chip mode (High)No.3 Position :SCI boot mode (Low)VREFH0AVSS0VCCRF(Shield)XTAL/P413VBPCN2MS-156CCAFG1FG2IOVCC0R47DNF12R250R12P113D_GNDSWCLKP505D_GND (XCOUT)VSC_VCCR1100k12 TESSERA TECHNOLOGY INC. 47 / 48 R310R12JP4FFC-3AMEP1123D_GNDD_GNDSW1HP03-15AFKP41234SWD I/F(1-2) ONP012EML_5VVCC_RFTP6D_GND1TgtPwrD_GNDSWCLKGNDUSB_3V3JP3FFC-2AMEP112R20200R12Rechargeable BatteryR510k12R6310k12SMH-106-02-L-DAVCC0VCC_SUTP13D_GND1TRACEDATA[1]P301P113D_GNDLED4SML-D12M8WAKJP7FFC-3AMEP1123R6810k12C220.1uF12IOVCC0IOVCC1D_GNDTP14D_GND1VTrefGNDIOVCC1IOVCC1CN7SMH-106-02-L-D123456789101112(1-2) ONR360R12R23100R12VCCUARTR101k12C121uF12IC3FT232RLTXD1DTR#2RTS#3VCCIO4RXD5RI#6GND17NC18DSR#9DCD#10CTS#11CBUS412CBUS213CBUS314USBDP15USBDM163V3OUT17GND218RESET#19VCC20GND321CBUS122CBUS023NC224AGND25TEST26OSCI27OSCO28Ext_VCCBe Careful with the power supply source.USB_3V3D_GNDTP15D_GND1D_GNDelectricity generating deviceD_GNDIOVCC1P505/IRQ1_CGNDTXD2_CNormal modeModeLED2SML-E12D8WAKTP3MCU_ICC_P1R6410k12TP11Ext_VSC_VCC_P1VCC/IOVCCAVCC_RFVCCUARTTP16D_GND1MISOBRXD2_CP505SWO/TDOR111k12SLC-22-G(Red)Normal modeJP13FFC-2AMEP112C210.1uF12R340R12R590R12R810k12JP8USB_5VIC5ASN74LVC2G07DCK1652SLC-22-G(Black)IC2ISL9007IUNZ-TVO1NC2NC3NC4GND5SD6VIN7VIN8P300D_GNDD_GNDSWDIOP608P305C36DNF12RSPCKBUSB-SerialC4233uF12JP9FFC-3AMEP1123(C2)10uF12JP11FFC-3AMEP1123TP4MCU_ICC_M1TP8RF_ICC_M1IOVCC3IOVCC1R15200R12R550R12MOSIBC450.1uF12SSLB2PMOD 1(3-2) ONR350R12R300R12SLC-22-G(Black)R280R12VCC/IOVCCR560R12D_GNDR330R12D_GNDR91k12R400R12CN3SMH-106-02-L-D123456789101112GNDR440R12R290R12IOVCC1D_GNDModeIC5BSN74LVC2G07DCK3452Normal modeP107USB_3V3IC4BSN74LVC2G07DCK3452USB_3V3IOVCC1D_GNDFB1BLM18PG471SN112R610k12TDIP301P506P012C460.1uF12C4333uF12P608R320R12R450R12JP9R380R12IOVCC3TP17RF_GND1TRACEDATA[3]P607TgtPwrP704PMOD 2TP7RF_ICC_P1(3-2) ONJP8FFC-3AMEP1123R6510k12LED3SML-E12U8WAKJP13VCCUARTR6910k12TP12Ext_VSC_VCC_M1R570R12RESETD_GNDTRACEDATA[0]D_GNDD_GNDP609P606R16200R12IC4ASN74LVC2G07DCK1652C410uF12(3-2) ONR3100k12C260.047uF12R14200R12TransmitR13200R12JP7VSC_VCCD_GNDRF VCCP609D_GNDD_GNDTRACECLKP704IOVCC1VCCUARTC4433uF12(1-2) ONVCC_SU pin settingCN1FTSH-110-01-L-DV-007-K123456891011121314151617181920P112SLC-22-G(Black)RF_GNDVCC/IOVCCPower Supply1-2 :VCC-IN2-3 :Regulator OutMCU VCCSLC-22-G(Black)D_GNDD_GNDGNDD_GNDP305R21100R/3W12P606SLC-22-G(Red)C92.2uF12R22100R/3W12D11N4148W-7-FAKR600R12VCC/IOVCCUSB_3V3VCC/IOVCCUSB_5VR580R12TRACEDATA[2]D_GNDP606FB3DLW21SN900SQ24321nRESETRegulator Input1-2 :USB2-3 :EmulatorTP5CPU_VIN1C2SIA-03-GT123R6610k12VCC-INUSB_3V3R610R12D_GNDD_GNDIOVCC3D_GNDD_GNDD_GNDJP10/JP111-2 :RFP2-3 :UARTR121k12R18200R12EHC modeR17200R12LED1SML-E12D8WAKSW2HP03-15AFKP41234Ext_VCCFB2BLM18PG471SN112R370R12R620R12D_GNDD_GNDPowerD_GNDRES#USB_5VP112D_GNDTP9Ext_VBAT_EHC_P1EML_5VTP2GND1TitleSizeDocument NumberRevDate:SheetofTS-TCS09443E1.3EB-RE01BA333Tuesday, December 22, 2020P113SLC-22-G(Red)JP10FFC-3AMEP1123EML_5VDischarge VCC_SUVCCUARTVBAT_EHCCN4ZX62-B-5PA(33)VBUS1D-2D+3ID4GND5FG1FG1FG2FG2FG3FG3FG4FG4FG5FG5FG6FG6R19200R12R410R12D_GNDCTS2_CC230.1uF12EHC modeJP2FFC-2AMEP112C37DNF12VREFH0P607VCC/IOVCCJP12FFC-3AMEP1123Discharge MCU VCCD_GNDR420R12R390R12RF_GNDR460R12D_GNDP300IRQ7_AVCCUARTSW6SKRPACE0101234SWCLK/TCKSLC-22-G(Black)VBAT_EHC pin settingUSB_3V3ModeTP1VIN1TP10Ext_VBAT_EHC_M1IOVCC2R710k12Power LineClose :NormalOpen :EHC_modeD_GNDC240.1uF12SWDIO/TMSJP7/JP8/JP91-2 :Normal mode2-3 :EHC modeP506GNDD_GNDVSC_VCC pin settingSW5SKRPACE0101234EHC modeSLC-22-G(Red)ReceiveR430R12C250.1uF12JP1FFC-2AMEP112VCC/IOVCCJP5FFC-3AMEP1123 TESSERA TECHNOLOGY INC. TESSERA TECHNOLOGY INC. 7. Notes on construction design certification When using this product, please use the built-in antenna. Please note that the use of software other than the dedicated software made by Renesas, or the operation by software modification will not conform to the construction design certification. 48 / 48

EB-RE01B Label & Label locations

TOP side

TESSERA TECHNOLOGY INC.

1 / 2

TESSERA TECHNOLOGY INC.

Bottom side

Manufacturer’s name

Model number

FFCID

IC

HVIN

p

⚫ This label and adhesive will last the lifetime of the product.

2 / 2

SGS North America Inc. i i 620 Old Peachtree Road Applicant Declaration SUITE 100 Suwanee, Georgia 30024 United States Applicant Legal Business Name TESSERA TECHNOLOGY INC. Address 6F, 2-15-10, Kitasaiwai, Nishi-ku, Yokohama-shi, Kanagawa, 220-0004 JAPAN Grantee Code X8U FCC ID X8U0003 Authorized Contact Name | ODA Chihiro Contact Email chihiro-oda@tessera.co.jp Contact Phone | +81-45-595-9533

|, the undersigned, certify that | am an authorized signatory for the Applicant and therefore declare;

a) in accordance with 47CFR2.911(d), all of the statements herein and the exhibits attached hereto are true and correct to the best of my knowledge and belief. b) in accepting a Grant of Equipment Authorization issued by a TCB, under the authority of the FCC, as a result of the representations made in this application, the Applicant is responsible for:

(1) labeling the equipment with the exact FCC ID as specified in this application,

(2) compliance statement labeling pursuant to the applicable rules,

(3) compliance of the equipment with the applicable technical rules, c) _ if the Applicant is not the actual manufacturer of the equipment, appropriate arrangements have been made with the manufacturer to ensure that production units of this equipment will continue to comply with the FCCs technical requirements. d) in accordance with 47 CFR 2.909 and KDB394321, the Applicant has read, understood and agrees to accept that they are the responsible party and agree to abide by their responsibilities as specified under 47 CFR 2.909 and KDB394321. e) in accordance with ISO17065, FCC KDB641163, FCC KDB610077, KDB394321 and RSP-100, the Applicant has read, understood, accepts and agrees to abide by the post market surveillance requirements.

(1) the Applicant understands, accepts and agrees that a sample may be requested for surveillance testing.

(2) the Applicant shal/ make provisions to always have a production sample available upon request by SGS, FCC and/or ISED.

(3) the Applicant shal/, upon request by SGS, at the Applicant's expense, provide a production sample of the requested product to SGS, FCC and/or ISED as instructed. The sample shall include all support devices, cables, software, accessories or other hardware or software required for evaluation, review, certification and audit surveillance of products certified by SGS. f) neither the Applicant nor any party to the application is subject to a denial of Federal benefits, that includes FCC benefits, pursuant to Section 5301 of the Anti-Drug Abuse Act of 1988, 21 U.S.C. 862 because of a conviction for possession or distribution of a controlled substance. See 47CFR 1.2002(b) for the definition of a party for these purposes. g) the Applicant has read, understood, accepts and agrees to abide by the SGS North America, Inc.(TCB) terms and conditions. Link to CFRs: https://www.fcc.gov/wireless/bureau-divisions/technologies-systems-

Link to KDBs: https://apps.fcc.gov/oetcf/kdb/index.cfm Link to RSP-100: https://www.ic.gc.ca/eic/site/smt-gst.nsf/eng/sf01130.html d-innovation-division/rules-requlations-title-47 Applicant Signature: Date:

BL A PK aA 3rd Aug 2021 Print Name: Masaaki Suzuki Applicant Declaration Rev:0.0

To: Federal Communications Commission Authorization & Evaluation Division 7435 Oakland Mills Road Columbia, MD 21406 From: TESSERA TECHNOLOGY INC. 6F, 2-15-10, Kitasaiwai, Nishi-ku TSSR Yokohama-shi, Kanagawa, 220-0004 JAPAN om 16th/June/2021 Regarding: Confidentiality Request regarding application for FCC ID X8U0003 LONG TERM CONFIDENTIALITY Pursuant to 47 CFR Section 0.457 and 0.459 of the commissions rules, the applicant hereby request confidential treatment of the documents listed below, associated with the certification application referenced above.

* Schematic(s)

* Block Diagrams

* Operational Descriptions The documents above contain proprietary information not released to the public. Public disclosure of this information may prove harmful to the business of the applicant. SHORT TERM CONFIDENTIALITY Additionally, the applicant requests the following documents be held confidential until the device is marketed or 90 days from the grant date, whichever is less. If the device is marketed within 90 days of the Grant Date, the applicant will notify the TCB per FCC KDB 726920 DO1 Confidentiality Request Procedures.

* Internal Photos

* External Photos

* User manual

* Test Setup Photo

* User manual(s) Sincerely, Signature: Ba 7K WZ af Printname : Masaaki Suzuki Title : Manager TESSERA TECHNOLOGY INC.

333 TESSERA TECHNOLOGY INC. lt Neh 6F, 2-15-10, Kitasaiwai, Nishi-ku TSSR Yokohama-shi, Kanagawa, 220-0004 JAPAN 16th/June/2021 TO! Federal Communication Commission Equipment Authorization Branch 7435 Oakland Mills Road Columbia, MID 21046 Regarding: EB-REO1B, FCC ID: X8U0003 To whom it may concern:

We, the undersigned, hereby authorize SGS Japan Inc. to act on our behalf in all manners relating to application for equipment authorization with respect to the FCC ID above, including signing of all documents relating to these matters. Any and all acts carried out by the agent on our behalf shall have the same effect as acts of our own. We, the undersigned, hereby certify that we are not subject to a denial of federal benefits, that includes FCC benefits, pursuant to Section 5301 of the Anti-Drug Abuse Act of 1988, 21 U.S.C. 853(a). Where our agent signs the application for certification on our behalf, | acknowledge that all responsibility for complying with the terms and conditions for Certification, as specified by SGS North America, Inc., still resides with TESSERA TECHNOLOGY INC. This authorization is valid until further written notice from the applicant. ye L Signature : Afi AR A 8 Printname : Masaaki Suzuki Title : Manager On behalf of : TESSERA TECHNOLOGY INC.