EVM Users Guide CC3100MOD Boosterpack (Evaluation board) User Guide ECS Applications Table 1. Document Change Log Date (Version) Author Approved by Description Initial Release TI Confidential Strictly Private 2 Contents EVM Users Guide 2.1 Block Diagram 2.2 Hardware Features of the evaluation board 2.3 Connector and jumper descriptions 2.3.1 Push buttons and LEDs 2.3.2 Jumper settings 2.3.3 2x20 pin connector assignment 2.4 Power Getting Started .......................................................................................................................... 4 Introduction ....................................................................................................................... 4 1 1.1 CC3100MOD BOOST 4 4 1.2 CC3100MOD Module 2 Hardware description ........................................................................................................ 5 6 6 7 7 7 9 10 3 Connecting to the PC using EMUBOOST ...................................................................... 11 11 12 12 4 Connecting to a Launchpad .......................................................................................... 14 4.1 Launchpad current limitation 14 PCB information .............................................................................................................. 15 15 5.1 Layout information 17 5.2 Antenna pattern 18 5.3 Schematics 5.4 Bill of materials 20 3.1 CC31XXEMUBOOST 3.2 Mating the boards 3.3 Jumper settings on the EMUBOOST 5 TI Confidential Strictly Private 3 EVM Users Guide Getting Started 1 Introduction 1.1 CC3100MOD BOOST Introducing the CC3100MOD Booster pack compatible with all TI Launchpads for adding WIFI capability to embedded systems. The CC3100MODBOOST Booster Pack is an easy-to-use evaluation module for the CC3100 WIFI device. It contains everything needed to start developing a WIFI solution on TI Launchpad. This board is also designed to interface with another board named CC3100EMUBOOST (FTDI based Emulation and debug board) to provide an interface to the PC for development using SimpleLink Studio (TI provided application and source code to develop WIFI based software on a PC) The CC3100MOD module integrates the complete RF, digital baseband, and power management needed to provide WIFI access to any embedded system using a 8,16 ot 32 bit Microcontrollers. Rapid prototyping is a snap thanks to the 40-pin headers and a wide variety of Launchpads available. These connectors provide stackability to ensure that other booster-packs like Audio, LCD, sensors etc. can be mounted on top or bottom of this booster-pack. 1.2 CC3100MOD Module The CC3100MOD module is a second-generation SimpleLink Wi-Fi self-contained network processor module that dramatically simplifies the implementation of Internet connectivity. The CC3100MOD module is an ideal solution for embedded applications using low-cost and low-power microcontrollers with reduced board space and faster development times. Fully integrated module with serial flash, Crystal and RF filter. Only needs power supply and a serial interface to operate. IPv4 TCP/IP Stack 802.11 b/g/n Station With Fully Integrated Radio, Baseband, and MAC 802.11 Transceiver Mode 8 Simultaneous TCP, UDP, or RAW Sockets ARP, ICMP, DHCP, DNS, mDNS TLS 1.2/SSL 3.0 With On-Chip Accelerators Throughput UDP: 16 Mbps, TCP: 12 Mbps Interfaces With 8-, 16-, and 32-bit MCU over an SPI Interface with up to 24-MHz Clock TI Confidential Strictly Private 4 EVM Users Guide nRESET
(Optional) 20 pin LP Connector 2 Hardware description Chip Antenna U.FL Conn OOB 20 pin LP Connector nHIB CC3100 CC3100MOD PWR SEL 3.3V Dc/Dc Micro USB Conn
(Power only) Figure 1 : CC3100MODBOOST evaluation board with the CC3100MOD Module TI Confidential Strictly Private 5 2.1 Block Diagram EVM Users Guide Chip Antenna Murata Conn U.FL Conn CC3100MOD Current Meas J6 LED Indicators SPI/UART/GPIO 2 x 2 0 h e a d e r s Vcc 5V Push Buttons J8 Jumper 3.3V 3.3V LDO Diode Mux 5V Micro USB Figure 2 : CC3100MODBOOST Block diagram 2.2 Hardware Features of the evaluation board CC3100MOD module with fully integrated solution. 2x20 pin stackable connectors On-board chip antenna with option for U.FL based conducted testing. Power from on-board LDO using USB OR 3.3V from MCU Launchpad Push buttons (3x), LEDs (2x) Jumper for current measurement with provision to mount 0.1R resistor for measurement with voltmeter 2 Layer PCB with 6mil spacing and track width. TI Confidential Strictly Private 6 EVM Users Guide 2.3 Connector and jumper descriptions 2.3.1 Push buttons and LEDs Push buttons Reference Usage Comments SW1 SW2 OOB Demo RESET This is used as an input for the OOB demo. The use of this pin is optional. This is used to reset the CC3100 device which can also be accomplished using the nHIB button. The RESET completely erases the CC3100 RAM including the time. LEDs Reference D5 D1 D6 Colour RED Yellow Usage Comments PWR Indication Glows when the 3.3V power is provided to the board nRESET This LED is used to indicate the stated of nRESET pin. If this LED is glowing, the device is functional. This LED indicates the stated of nHIB pin. When the LED is OFF, the device is in hibernate state. Green nHIB 2.3.2 Jumper settings Reference Usage Comments J21 J8 USB connector For powering the booster pack when mated with a Launchpad. This is mandatory to use when using Z devices. For e.g. CC3100HZ Power selection Choose the power supply from the TI Confidential Strictly Private 7 J6 Current measurement J5 OOB Demo EVM Users Guide Lauchpad or the on-board USB. J8 (1-2) power from MCU Launchpad J8 (2-3) power from on-board USB using 3.3V LDO For Hibernate and LPDS currents connect a ammeter across J26 : Range
(< 500uA) For Active current, mount a 0.1 Ohm resistor on R42 and measure the voltage across the 0.1 Ohm resistor using a voltmeter. Range (< 50mV peak-peak) Closed : GPIO_12 is hard pulled to Vcc Open : GPIO_12 is pulled to GND using 33K resistor. J10, J9 Booster pack header 2x10 pins each connected to the Launchpad. J3 J2 RF Test RF Test Murata connector (MM8030-2610) for production line tests. U.FL connector for conducted testing in the lab. TI Confidential Strictly Private 8 2.3.3 2x20 pin connector assignment The signal assignment on the 2x20 pin connector is shown below. The convention of J1..J4 is replaced with P1P4 to avoid confusion with the actual board reference. EVM Users Guide P1 VCC(3.3V) UN-USED UART1_TX UART1_RX nHIB UNUSED SPI_CLK UN-USED UN-USED UN-USED P3
+5V GND NC NC NC NC NC NC NC NC P1 P3 P4 P2 P2 P4 GND NC IRQ NC SPI_CS NC NC UART1_CTS nRESET UART1_RTS SPI_MOSI NC NWP_LOG_TX SPI_MISO WLAN_LOG_TX NC NC NC NC NC Outer row connectors Pin No P1.1 P1.2 P1.3 P1.4 P1.5 P1.6 P1.7 P1.8 P1.9 P1.10 Signal Name VCC(3.3V) UN-USED UART1_TX UART1_RX nHIB UNUSED SPI_CLK UN-USED UN-USED UN-USED Direction IN NA OUT IN IN NA IN NA NA NA TI Confidential Strictly Private Pin No P2.1 P2.2 P2.3 P2.4 P2.5 P2.6 P2.7 P2.8 P2.9 P2.10 Signal Name GND IRQ SPI_CS UN-USED nRESET SPI_MOSI SPI_MISO UN-USED UN-USED UN-USED Direction IN OUT IN NA IN IN OUT NA NA NA 9 Inner row connectors Pin No P3.1 P3.2 P3.3 P3.4 P3.5 P3.6 P3.7 P3.8 P3.9 P3.10 Signal Name
+5V GND UN-USED UN-USED UN-USED UN-USED UN-USED UN-USED UN-USED UN-USED Direction IN IN NA NA NA NA NA NA NA NA EVM Users Guide Pin No P4.1 P4.2 P4.3 P4.4 P4.5 P4.6 P4.7 P4.8 P4.9 P4.10 Direction Signal Name OUT UN-USED OUT UN-USED NA UN-USED IN UART1_CTS OUT UART1_RTS NA UN-USED NWP_LOG_TX OUT WLAN_LOG_TX OUT UN-USED UN-USED IN OUT Note :
All signals are 3.3V COMS logic levels and is referred w.r.t. CC3100MOD. For e.g. UART1_TX is an output from the CC3100MOD. For the SPI lines, the CC3100MOD always acts like a slave. 2.4 Power The board is designed to accept power from a mated Launchpad or from the CC3100EMUBOOST board. Some of the launchpads are not capable of sourcing the peak current requirements of the WIFI. In such a case the USB connector on the CC3100MODBOOST can be used to aid the peak current. The use of schottky diodes ensure that the load sharing happens between the USB connectors on the Launchpad and the Boosterpack without any board modifications. Also the 3.3V power can be sourced from the Launchpad or from the 3.3V LDO on the board. This is done by using the jumper J8. In the case where the Launchpad is not able to source the 3.3V upto 350mA, then the J8 needs to be configured to work from the on-
board LDO 2.4.1 Power from the Launchpad or CC3100EMUBOOST The most common scenario will be to power the CC3100MODBOOST from the mated Launchpad. In this case the Launchpad provides 3.3V to the Booster-pack for its operation. In addition to the 3.3V the Launchpad provides a 5V from the USB which is used to drive a 3.3V LDO on the Booster-pack. This LDO sources the 3.3V used for the top die flash used on development models. TI Confidential Strictly Private 10 EVM Users Guide 3 Connecting to the PC using EMUBOOST 3.1 CC31XXEMUBOOST 3.1.1 Overview The CC31XXEMUBOOST is designed to connect the CC3100MODBOOST pack to a PC using USB connection. This is used to update the firmware on the BP using the SL_Prog utility and also in software development using SL_Studio. 3.1.2 Hardware details The board has two FTDI ICs to enumerate multiple COM and D2XX ports. The details of the ports are given below Ports available on J6 Port No 1 Usage SPI port for SL Studio Comments Port Type D2XX 2 3 4 D2XX GPIO for SL Studio Control the nRESET, nHIB, IRQ VCP VCP COM port for flash programming NWP Network processor logger TI Confidential Strictly Private 11 EVM Users Guide output. TX only Note : On the PC only two of the four ports would be visible on the Device Manager. The D2XX ports are not listed under the Ports tab. The first COM port in the list usually is used for the flash programming. Ports available on J5 Port No 1 Port Type VCP Usage RT3 Comments Used for TI internal debug only. 2 VCP MAC logger MAC logger output. TX only 3.1.3 Driver requirements The FTDI Debug board requires the user to install the associated drivers on a PC. This package is available as part of the SDK release and would be located at [Install-
Path]\cc3100-sdk\tools\cc31xx_board_drivers\. The install path is usually C:\ti\cc3100SDK 3.2 Mating the boards The image above shows the connection of the CC3100MODBOOST to the CC3100EMUBOOST Board. The connectors should be aligned carefully considering that it does not have a polarity protection. The pin-1 of the connectors are marked on the board using a small triangle marking and these should be aligned while mating. Caution :
Align the pin-1 of the boards together using the triangle marking on the PCB. An incorrect mating can destroy the boards permanently. Ensure that none of the header pins are bent before mating the two boards. Jumper settings on the CC3100BOOST 3.3 Jumper settings on the EMUBOOST The following table specifies the jumpers to be installed while mating with the FTDI board. No 1 Jumper settings Notes J4 (short) Provide 3.3V to the Booster pack TI Confidential Strictly Private 12 EVM Users Guide 2 3 J22 (short) J3 (1-2) Provide 5.0V to the Booster pack Route the NWP logs to the Dual port also The rest of the jumpers can remain open. With these done, the EMUBOOST would resemble the board in the next section TI Confidential Strictly Private 13 EVM Users Guide 4 Connecting to a Launchpad The CC3100MOD Booster pack can be directly connected to a compatible Launchpad using the standard 2x20 pin connectors. The jumper settings needed for this connection is the same as that needed for the EMUBOOST board as described in the previous section. Please ensure that the Pin1 of the 2x20 pins are aligned correctly before mating. The mated setup is as per the picture below. (Note the USB cable is connected to the Booster Pack directly to power it only. For debugging, the USB cable on the Launchpad is also required) 4.1 Launchpad current limitation Some of the launchpads including the MSP430FRAM launchpads do not provide enough current to power the CC3100MOD booster pack. The booster pack can consume upto 400mA peak from the 3.3V and hence it may be needed to power is separately. For this a USB connector is provided on the Booster Pack to provide the 3.3V separately. The power supply jumpers shall be configured as below when the power is supplied from the on-board USB connector. Important: Since there are two power sources in this setup it is important to follow the power-up sequence. Note : Always power the Booster Pack before powering the Launchpad. Failure to follow this sequence may end up damaging the booster-pack permanently. TI Confidential Strictly Private 14 EVM Users Guide 5 PCB information 5.1 Layout information Figure 3 : Layer-1 TI Confidential Strictly Private 15 EVM Users Guide Figure 4 : Layer-2 TI Confidential Strictly Private 16 5.2 Antenna pattern The antenna used on the evaluation platform is a chip antenna from Taiyo Yuden
(AH316M245001-T). The below figures depict the radiation patter from this chip antenna. Note that the radiation pattern is influenced by presence of any metal parts nearby. EVM Users Guide TI Confidential Strictly Private 17 5.3 Schematics EVM Users Guide TI Confidential Strictly Private 18 EVM Users Guide TI Confidential Strictly Private 19 Manufacturer Murata Yageo Yageo Yageo MURATA Yageo MURATA WALSIN WALSIN TA-I FOXCONN Yageo MURATA MURATA Taiyo_Yuden TA-I MURATA MURATA TDK MURATA WALSIN Yageo/Phycomp. TA-I TAIYO Yageo/Phycomp. TA-I TA-I WALSIN CHILISIN CVILUX FOXCONN TI DIODES Samtec CVILUX CVILUX LITEON LITEON LITEON POWERWAY Mfr. PN GRM155R61A104KA01D RC0402JR-070RL RC0402JR-07100RL RC0402FR-07100KL GRM32ER60J107ME20L RC0402FR-0710KL GRM155R71H103KA88D 0402N100C500LT 0402N1R0C500LT RM04FTN1503 1BT002-0120L-7H RC0402FR-071KL GRM155R60J105KE19D LQH3NPN1R0MM0L AH316M245001-T RM04JTN245 GRM1555C1H220JA01D GRM21BR60J226ME39L C2012X5R0J226MT GRM21BR71C225KA12L 0805B225K160CT RC0402JR-07270RL RM04JTN332 HK10053N6S-T RC0402FR-07330RL RM04FTN3302 RM04FTN3902 WR04X4303FTL UPB160808T-600Y-N CH31032V200 KK23017-01-7F TLV62090RGTR B240A-13-F SSQ-110-03-G-D CH81062V200 CH31022V202 LTST-C190KGKT LTST-C190KFKT LTST-C190KRKT SUA-160M3B-L2E-TR1 MM8030-2610RJ3 BSS138LT3G SJ2520H-A0 MURATA On Semi FOXCONN ZHENDING/APCB 307.00587.025 FOXCONN KOKI KOKI T77H533.00 S3X58-M500 S01X7C58-M500 Part Number 202.00008.015 251.00681.025 251.00004.005 261.00840.025 205.00025.005 261.00839.035 202.01141.015 202.00035.005 202.00021.005 261.00013.005 182.00083.005 261.00835.025 202.00059.035 132.00816.005 JSAH316M245001 251.00691.005 202.01137.035 204.00611.005 204.00621.005 204.00625.015 204.00625.005 251.00025.025 251.00027.005 130.01491.005 261.00040.025 261.01048.005 261.00868.005 261.01419.005 151.00402.005 341.00543.005 341.00021.005 029.00431.005 112.00010.005 JSSSQ-110-03-G 341.00544.005 341.00391.005 123.00170.005 123.00171.005 123.00172.005 342.00757.005 341.00454.005 104.00459.005 340.00013.005 307.00587.025 T77H533.00 591.00046.005 591.00056.005 5.4 Bill of materials Qty Description 2 CAP CER 100nF 10% 10V SMD 0402 GP/HF X5R 0.5mm 14 RES C SMD 0402 0ohm 5% GP/HF 1 RES C SMD 0402 100ohm 5% GP/HF 6 RES C SMD 0402 100Kohm 1% GP/HF 2 CAP CER 100uF 20% 6.3V SMD 1210 GP/HF X5R 2.5mm 3 RES C SMD 0402 10Kohm 1% GP/HF 2 CAP CER 10nF 10% 50V SMD 0402 GP/HF X7R T=0.5mm 1 CAP CER 10pF +-0.25pF 50V SMD 0402 GP/HF NPO 0.5mm 1 CAP CER 1.0pF +-0.25pF 50V SMD 0402 GP/HF NPO T=0.55mm 1 EU-GP RES C SMD 0402 150Kohm 1% GP/HF 3 SW TACT 50mA 12V SMD ST GP/HF 2 RES C SMD 0402 1Kohm 1% GP/HF 1 CAP CER 1uF 10% 6.3V SMD 0402 GP/HF X5R 0.5mm 1 CN-GP IND WW 1uH 20% 1.4A 0.044ohm SMD GP/
1 2.4G WIFI chip antenna PCB Footprint C-0402S0 C-0402S0 R-0402S0 r-0402s0 C-1210 r-0402s0 C-0402S0 C-0402S0 C-0402S0 r-0402s0 SW-1BT002S1 r-0402s0 C-0402S0 L-S3X3A ANT-S3_2X1_6-2A R-0402S0 C-0402S0 C-0805 C-0805 C-0805 C-0805 R-0402S0 r-0402s0 l-0402s0 R-0402S0 R-0402S0 R-0402S0 R-0402S0 L-0603S0 CN-3X1-2_54 CJ-RF-S3_1X3-3 tqfn-3x3-16eshs1 M-D-SMAH2_3 cn-10x2-2_54c cn-D3x2-2_54HD CN-D2X1-2_54S0 1 RES C SMD 0402 2.4Mohm 5% GP/HF 1 CN-GP CAP CER 22pF 5% 50V SMD 0402 GP/HF N 1 CN-GP CAP CER 22uF 20% 6.3V SMD 0805 GP/HF 0 CN-GP CAP CER 22uF 20% 6.3V SMD 0805 GP/HF 1 CAP CER 2.2uF 10% 16V SMD 0805 GP/HF X7R T=1.25mm 0 CAP CER 2.2uF 10% 16V SMD 0805 GP/HF X7R T=1.25mm 2 RES C SMD 0402 270ohm 5% GP/HF 1 RES C SMD 0402 3.3Kohm 5% GP/HF 1 IND C 3.6nH 0.3nH 300mA 0.2ohm Q=8 SMD 0402 GP/HF 1 RES C SMD 0402 330ohm 1% GP/HF 2 RES C SMD 0402 33Kohm 1% GP/HF 1 EU-GP RES C SMD 0402 39Kohm 1% GP/HF 1 RES C SMD 0402 430Kohm 1% GP 1 BEAD C 60ohm 25% 4A 0.02ohm SMD 0603 GP/HF 1 HEADER PIN 3P 2.54mm DIP MALE ST GP 1 HEADER RF 1*1PORT D0.5/D2.0mm SMD MALE ST GP/HF 1 IC DC-DC 2.5~5.5V SMD QFN16 GP TLV62090RGTR 3 DIODE SBD 40V 2A SMD SMA GP B240A-13-F DIODES 2 1 HEADER PIN 2*3P 2.54mm DIP MALE ST GP 2 HEADER PIN 1*2P 2.54mm DIP MALE ST GP 1 LED CHIP 35mcd G 571nm 2P SMD 1.6*0.8mm GP/HF LTST-C190KG LD-0603S0 1 LED CHIP 60mcd O 605nm 2P SMD 1.6*0.8mm GP/HF LTST-C190KFLD-0603A LD-0603S0 1 LED CHIP 45~180mcd R 624~638nm 2P SMD 1.6*0.8mm GP/HF CJ-USBSUA-160M3B-L2AT 1 CONN MICRO USB B 5PIN 0.65mm SMD FEMALE RT GP CN-MM8030S0 1 HEADER RF 1*1PORT D=0.5/1.35mm SMD FEMALE ST GP 2 MOSFET N-CH 50V 200MA SOT-23 sot-23b 5 CONN JUMPER 2P 2.54mm FEMALE RT GP 1 PCB 2L OSP REV.025 8PCS GP/HF 43.18*50.8mm 95.1200T00 1 Module, 802.11bgn 1x1, 17.5mmx20.5mm LGA 0.2 CN-GP SOLDER PASTE S3X58 M500 GP/HF 0 CN-GP SOLDER PASTE S01X7C58-M500 GP/HF TI Confidential Strictly Private EVM Users Guide Part Reference C15 C27 R15 R22 R29 R36 R37 R38 R44 R46 R48 R65 R66 R73 R81 R82 R12 R4 R6 R7 R75 R80 R111 C65 C66 R8 R209 R210 C3 C7 C67 C64 R13 SW1 SW2 SW3 R9 R20 C47 L1 ANT1 R11 C23 C4 C4 C17 C17 R71 R72 R78 L4 R205 R77 R84 R21 R5 FB17 J8 J2 U1 D3 D4 D8 J9 J10 J4 J5 J6 D6 D1 D5 J7 J3 Q7 Q8 PCB U11 20 EVM Users Guide STANDARD TERMS AND CONDITIONS FOR EVALUATION MODULES 1. Delivery: TI delivers TI evaluation boards, kits, or modules, including any accompanying demonstration software, components, or documentation (collectively, an EVM or EVMs) to the User (User) in accordance with the terms and conditions set forth herein. Acceptance of the EVM is expressly subject to the following terms and conditions 1.1 EVMs are intended solely for product or software developers for use in a research and development setting to facilitate feasibility evaluation, experimentation, or scientific analysis of TI semiconductors products. EVMs have no direct function and are not finished products. EVMs shall not be directly or indirectly assembled as a part or subassembly in any finished product. For clarification, any software or software tools provided with the EVM (Software) shall not be subject to the terms and conditions set forth herein but rather shall be subject to the applicable terms and conditions that accompany such Software 1.2 EVMs are not intended for consumer or household use. EVMs may not be sold, sublicensed, leased, rented, loaned, assigned, or otherwise distributed for commercial purposes by Users, in whole or in part, or used in any finished product or production system. 2 Limited Warranty and Related Remedies/Disclaimers:
2.1 These terms and conditions do not apply to Software. The warranty, if any, for Software is covered in the applicable Software License Agreement. 2.2 TI warrants that the TI EVM will conform to TI's published specifications for ninety (90) days after the date TI delivers such EVM to User. Notwithstanding the foregoing, TI shall not be liable for any defects that are caused by neglect, misuse or mistreatment by an entity other than TI, including improper installation or testing, or for any EVMs that have been altered or modified in any way by an entity other than TI. Moreover, TI shall not be liable for any defects that result from User's design, specifications or instructions for such EVMs. Testing and other quality control techniques are used to the extent TI deems necessary or as mandated by government requirements. TI does not test all parameters of each EVM. 2.3 If any EVM fails to conform to the warranty set forth above, TI's sole liability shall be at its option to repair or replace such EVM, or credit User's account for such EVM. TI's liability under this warranty shall be limited to EVMs that are returned during the warranty period to the address designated by TI and that are determined by TI not to conform to such warranty. If TI elects to repair or replace such EVM, TI shall have a reasonable time to repair such EVM or provide replacements. Repaired EVMs shall be warranted for the remainder of the original warranty period. Replaced EVMs shall be warranted for a new full ninety (90) day warranty period. 3 Regulatory Notices:
3.1 United States 3.1.1 Notice applicable to EVMs not FCC-Approved:
This kit is designed to allow product developers to evaluate electronic components, circuitry, or software associated with the kit to determine whether to incorporate such items in a finished product and software developers to write software applications for use with the end product. This kit is not a finished product and when assembled may not be resold or otherwise marketed unless all required FCC equipment authorizations are first obtained. Operation is subject to the condition that this product not cause harmful interference to licensed radio stations and that this product accept harmful interference. Unless the assembled kit is designed to operate under part 15, part 18 or part 95 of this chapter, the operator of the kit must operate under the authority of an FCC license holder or must secure an experimental authorization under part 5 of this chapter. 3.1.2 For EVMs annotated as FCC FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant:
CAUTION This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. FCC Interference Statement for Class A EVM devices NOTE: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instruction manual, may cause harmful interference to radio communications. Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to correct the interference at his own expense. FCC Interference Statement for Class B EVM devices NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:
Reorient or relocate the receiving antenna. Increase the separation between the equipment and receiver. Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. Consult the dealer or an experienced radio/TV technician for help. TI Confidential Strictly Private 21 EVM Users Guide 3.2 Canada 3.2.1 For EVMs issued with an Industry Canada Certificate of Conformance to RSS-210 Concerning EVMs Including Radio Transmitters:
This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to the following two conditions:
(1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device. Concernant les EVMs avec appareils radio:
Le prsent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorise aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radiolectrique subi, mme si le brouillage est susceptible d'en compromettre le fonctionnement. Concerning EVMs Including Detachable Antennas:
Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser) gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for successful communication. This radio transmitter has been approved by Industry Canada to operate with the antenna types listed in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated. Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited for use with this device. Concernant les EVMs avec antennes dtachables Conformment la rglementation d'Industrie Canada, le prsent metteur radio peut fonctionner avec une antenne d'un type et d'un gain maximal (ou infrieur) approuv pour l'metteur par Industrie Canada. Dans le but de rduire les risques de brouillage radiolectrique l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope rayonne quivalente (p.i.r.e.) ne dpasse pas l'intensit ncessaire l'tablissement d'une communication satisfaisante. Le prsent metteur radio a t approuv par Industrie Canada pour fonctionner avec les types d'antenne numrs dans le manuel dusage et ayant un gain admissible maximal et l'impdance requise pour chaque type d'antenne. Les types d'antenne non inclus dans cette liste, ou dont le gain est suprieur au gain maximal indiqu, sont strictement interdits pour l'exploitation de l'metteur 3.3 Japan 3.3.1 Notice for EVMs delivered in Japan: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page 3.3.2 Notice for Users of EVMs Considered Radio Frequency Products in Japan: EVMs entering Japan are NOT certified by TI as conforming to Technical Regulations of Radio Law of Japan. If User uses EVMs in Japan, User is required by Radio Law of Japan to follow the instructions below with respect to EVMs:
1. Use EVMs in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal Affairs and Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministrys Rule for Enforcement of Radio Law of Japan, 2. Use EVMs only after User obtains the license of Test Radio Station as provided in Radio Law of Japan with respect to EVMs, or 3. Use of EVMs only after User obtains the Technical Regulations Conformity Certification as provided in Radio Law of Japan with respect to EVMs. Also, do not transfer EVMs, unless User gives the same notice above to the transferee. Please note that if User does not follow the instructions above, User will be subject to penalties of Radio Law of Japan. SPACER 1. 61118328173 2. 3. 3.3.3 Notice for EVMs for Power Line Communication: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page SPACER 4 EVM Use Restrictions and Warnings:
4.1 EVMS ARE NOT FOR USE IN FUNCTIONAL SAFETY AND/OR SAFETY CRITICAL EVALUATIONS, INCLUDING BUT NOT LIMITED TO EVALUATIONS OF LIFE SUPPORT APPLICATIONS. 4.2 User must read and apply the user guide and other available documentation provided by TI regarding the EVM prior to handling TI Confidential Strictly Private 22 EVM Users Guide or using the EVM, including without limitation any warning or restriction notices. The notices contain important safety information related to, for example, temperatures and voltages. 4.3 Safety-Related Warnings and Restrictions:
4.3.1 User shall operate the EVM within TIs recommended specifications and environmental considerations stated in the user guide, other available documentation provided by TI, and any other applicable requirements and employ reasonable and customary safeguards. Exceeding the specified performance ratings and specifications (including but not limited to input and output voltage, current, power, and environmental ranges) for the EVM may cause personal injury or death, or property damage. If there are questions concerning performance ratings and specifications, User should contact a TI field representative prior to connecting interface electronics including input power and intended loads. Any loads applied outside of the specified output range may also result in unintended and/or inaccurate operation and/or possible permanent damage to the EVM and/or interface electronics. Please consult the EVM user guide prior to connecting any load to the EVM output. If there is uncertainty as to the load specification, please contact a TI field representative. During normal operation, even with the inputs and outputs kept within the specified allowable ranges, some circuit components may have elevated case temperatures. These components include but are not limited to linear regulators, switching transistors, pass transistors, current sense resistors, and heat sinks, which can be identified using the information in the associated documentation. When working with the EVM, please be aware that the EVM may become very warm. 4.3.2 EVMs are intended solely for use by technically qualified, professional electronics experts who are familiar with the dangers and application risks associated with handling electrical mechanical components, systems, and subsystems. User assumes all responsibility and liability for proper and safe handling and use of the EVM by User or its employees, affiliates, contractors or designees. User assumes all responsibility and liability to ensure that any interfaces (electronic and/or mechanical) between the EVM and any human body are designed with suitable isolation and means to safely limit accessible leakage currents to minimize the risk of electrical shock hazard. User assumes all responsibility and liability for any improper or unsafe handling or use of the EVM by User or its employees, affiliates, contractors or designees. 4.4 User assumes all responsibility and liability to determine whether the EVM is subject to any applicable international, federal, state, or local laws and regulations related to Users handling and use of the EVM and, if applicable, User assumes all responsibility and liability for compliance in all respects with such laws and regulations. User assumes all responsibility and liability for proper disposal and recycling of the EVM consistent with all applicable international, federal, state, and local requirements. 5. Accuracy of Information: To the extent TI provides information on the availability and function of EVMs, TI attempts to be as accurate as possible. However, TI does not warrant the accuracy of EVM descriptions, EVM availability or other information on its websites as accurate, complete, reliable, current, or error-free.PACER 6. Disclaimers:
6.1 EXCEPT AS SET FORTH ABOVE, EVMS AND ANY WRITTEN DESIGN MATERIALS PROVIDED WITH THE EVM (AND THE DESIGN OF THE EVM ITSELF) ARE PROVIDED "AS IS" AND "WITH ALL FAULTS." TI DISCLAIMS ALL OTHER WARRANTIES, EXPRESS OR IMPLIED, REGARDING SUCH ITEMS, INCLUDING BUT NOT LIMITED TO ANY IMPLIED WARRANTIES OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF ANY THIRD PARTY PATENTS, COPYRIGHTS, TRADE SECRETS OR OTHER INTELLECTUAL PROPERTY RIGHTS. 6.2 EXCEPT FOR THE LIMITED RIGHT TO USE THE EVM SET FORTH HEREIN, NOTHING IN THESE TERMS AND CONDITIONS SHALL BE CONSTRUED AS GRANTING OR CONFERRING ANY RIGHTS BY LICENSE, PATENT, OR ANY OTHER INDUSTRIAL OR INTELLECTUAL PROPERTY RIGHT OF TI, ITS SUPPLIERS/LICENSORS OR ANY OTHER THIRD PARTY, TO USE THE EVM IN ANY FINISHED END-USER OR READY-TO-USE FINAL PRODUCT, OR FOR ANY INVENTION, DISCOVERY OR IMPROVEMENT MADE, CONCEIVED OR ACQUIRED PRIOR TO OR AFTER DELIVERY OF THE EVM. 7. USER'S INDEMNITY OBLIGATIONS AND REPRESENTATIONS. USER WILL DEFEND, INDEMNIFY AND HOLD TI, ITS LICENSORS AND THEIR REPRESENTATIVES HARMLESS FROM AND AGAINST ANY AND ALL CLAIMS, DAMAGES, LOSSES, EXPENSES, COSTS AND LIABILITIES (COLLECTIVELY, "CLAIMS") ARISING OUT OF OR IN CONNECTION WITH ANY HANDLING OR USE OF THE EVM THAT IS NOT IN ACCORDANCE WITH THESE TERMS AND CONDITIONS. THIS OBLIGATION SHALL APPLY WHETHER CLAIMS ARISE UNDER STATUTE, REGULATION, OR THE LAW OF TORT, CONTRACT OR ANY OTHER LEGAL THEORY, AND EVEN IF THE EVM FAILS TO PERFORM AS DESCRIBED OR EXPECTED. 8. Limitations on Damages and Liability:
8.1 General Limitations. IN NO EVENT SHALL TI BE LIABLE FOR ANY SPECIAL, COLLATERAL, INDIRECT, PUNITIVE, INCIDENTAL, CONSEQUENTIAL, OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF THESE TERMS ANDCONDITIONS OR THE USE OF THE EVMS PROVIDED HEREUNDER, REGARDLESS OF WHETHER TI HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. EXCLUDED DAMAGES INCLUDE, BUT ARE NOT LIMITED TO, COST OF REMOVAL OR REINSTALLATION, ANCILLARY COSTS TO THE PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES, RETESTING, OUTSIDE COMPUTER TIME, LABOR COSTS, LOSS OF GOODWILL, LOSS OF PROFITS, LOSS OF SAVINGS, LOSS OF USE, LOSS OF DATA, OR BUSINESS INTERRUPTION. NO CLAIM, SUIT OR ACTION SHALL BE BROUGHT AGAINST TI MORE THAN ONE YEAR AFTER THE RELATED CAUSE OF ACTION HAS OCCURRED. 8.2 Specific Limitations. IN NO EVENT SHALL TI'S AGGREGATE LIABILITY FROM ANY WARRANTY OR OTHER OBLIGATION ARISING OUT OF OR IN CONNECTION WITH THESE TERMS AND CONDITIONS, OR ANY USE OF ANY TI EVM TI Confidential Strictly Private 23 EVM Users Guide PROVIDED HEREUNDER, EXCEED THE TOTAL AMOUNT PAID TO TI FOR THE PARTICULAR UNITS SOLD UNDER THESE TERMS AND CONDITIONS WITH RESPECT TO WHICH LOSSES OR DAMAGES ARE CLAIMED. THE EXISTENCE OF MORE THAN ONE CLAIM AGAINST THE PARTICULAR UNITS SOLD TO USER UNDER THESE TERMS AND CONDITIONS SHALL NOT ENLARGE OR EXTEND THIS LIMIT. 9. Return Policy. Except as otherwise provided, TI does not offer any refunds, returns, or exchanges. Furthermore, no return of EVM(s) will be accepted if the package has been opened and no return of the EVM(s) will be accepted if they are damaged or otherwise not in a resalable condition. If User feels it has been incorrectly charged for the EVM(s) it ordered or that delivery violates the applicable order, User should contact TI. All refunds will be made in full within thirty (30) working days from the return of the components(s), excluding any postage or packaging costs. 10. Governing Law: These terms and conditions shall be governed by and interpreted in accordance with the laws of the State of Texas, without reference to conflict-of-laws principles. User agrees that non-exclusive jurisdiction for any dispute arising out of or relating to these terms and conditions lies within courts located in the State of Texas and consents to venue in Dallas County, Texas. Notwithstanding the foregoing, any judgment may be enforced in any United States or foreign court, and TI may seek injunctive reliefin any United States or foreign court. Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright 2014, Texas Instruments Incorporated spacer TI Confidential Strictly Private 24