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Users Manual | Users Manual | 356.56 KiB | April 08 2016 | |||
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| 1 | Cover Letter(s) | April 08 2016 | ||||||
| 1 | External Photos | April 08 2016 | ||||||
| 1 | ID Label/Location Info | April 08 2016 | ||||||
| 1 | Internal Photos | April 08 2016 | ||||||
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| 1 | RF Exposure Info | |||||||
| 1 | Cover Letter(s) | April 08 2016 | ||||||
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| 1 | Test Report | April 08 2016 | ||||||
| 1 | Test Report | April 08 2016 | ||||||
| 1 | Test Setup Photos | April 08 2016 | ||||||
| 1 | Test Setup Photos | April 08 2016 |
| 1 | Users Manual | Users Manual | 356.56 KiB | April 08 2016 |
CC2650MOD SimpleLink Multistandard Wireless MCU Module 1 Device Overview CC2650MOD SWRS187 AUGUST 2016 1.1 Features Microcontroller 1 Powerful ARM Cortex-M3 EEMBC CoreMark Score: 142 Up to 48-MHz Clock Speed 128KB of In-System Programmable Flash 8KB of SRAM for Cache 20KB of Ultra-Low Leakage SRAM 2-Pin cJTAG and JTAG Debugging Supports Over-The-Air Upgrade (OTA) Ultra-Low Power Sensor Controller Can Run Autonomous From the Rest of the System Data 16-Bit Architecture 2KB of Ultra-Low Leakage SRAM for Code and Efficient Code Size Architecture, Placing Drivers, Bluetooth low energy Controller, IEEE 802.15.4 MAC, and Bootloader in ROM Integrated Antenna Peripherals Any GPIO All Digital Peripheral Pins Can Be Routed to Four General-Purpose Timer Modules (8 16-
Bit or 4 32-Bit Timer, PWM Each) 12-Bit ADC, 200-ksamples/s, 8-Channel Analog MUX Continuous Time Comparator Ultra-Low Power Analog Comparator Programmable Current Source UART 2 SSI (SPI, MICROWIRE, TI) I2C I2S Real-Time Clock (RTC) AES-128 Security Module True Random Number Generator (TRNG) 15 GPIOs Support for Eight Capacitive Sensing Buttons Integrated Temperature Sensor External System On-Chip internal DC-DC Converter No External Components Needed, Only Supply Version With CC2592 Range Extender Available Voltage Low Power Wide Supply Voltage Range Operation from 1.8 to 3.8 V Active-Mode RX: 6.1 mA Active-Mode TX at 0 dBm: 6.1 mA Active-Mode TX at +5 dBm: 9.1 mA Active-Mode MCU: 61 A/MHz Active-Mode MCU: 48.5 CoreMark/mA Active-Mode Sensor Controller: 8.2 A/MHz Standby: 1 A (RTC Running and RAM/CPU Shutdown: 100 nA (Wake Up on External Retention) Events) RF Section 2.4-GHz RF Transceiver Compatible With Bluetooth low energy (BLE) 4.1 Specification and IEEE 802.15.4 PHY and MAC Excellent Receiver Sensitivity (97 dBm for Bluetooth low energy and 100 dBm for 802.15.4), Selectivity, and Blocking Performance Programmable Output Power up to +5 dBm Integrated Antenna Pre-Certified for Compliance With Worldwide Radio Frequency Regulations ETSI (Europe) IC (Canada) FCC (USA) ARIB STD-T66 (Japan) Tools and Development Environment Full-Feature and Low-Cost Development Kits Multiple Reference Designs for Different RF Configurations Packet Sniffer PC Software Sensor Controller Studio SmartRF Studio SmartRF Flash Programmer 2 IAR Embedded Workbench for ARM Code Composer Studio 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCT PREVIEW Information. Product in design phase of development. Subject to change or discontinuance without notice. PRODUCT PREVIEWProductFolderSample &BuyTechnicalDocumentsTools &SoftwareSupport &Community CC2650MOD SWRS187 AUGUST 2016 1.2 Applications Consumer Electronics Mobile Phone Accessories Sports and Fitness Equipment HID Applications Home and Building Automation Lighting Control 1.3 Description www.ti.com Alarm and Security Proximity Tags Medical Remote Controls Wireless Sensor Networks The CC2650MOD device is a SimpleLink wireless MCU module that targets Bluetooth Smart, ZigBee and 6LoWPAN, and ZigBee RF4CE remote control applications. The module is based on the CC2650 Wireless MCU, a member of the CC26xx family of cost-effective, ultra-low power, 2.4-GHz RF devices. Very low active RF and MCU current and low-power mode current consumption provide excellent battery lifetime and allow for operation on small coin cell batteries and in energy-harvesting applications. The CC2650MOD contains a 32-bit ARM Cortex-M3 processor that runs at 48 MHz as the main processor and a rich peripheral feature set that includes a unique ultra-low power sensor controller. This sensor controller is ideal for interfacing external sensors or for collecting analog and digital data autonomously while the rest of the system is in sleep mode. Thus, the CC2650MOD device is ideal for applications within a whole range of products including industrial, consumer electronics, and medical devices. The CC2650MOD is precertified for operation under the regulations of the FCC, IC, ETSI and ARIB. These certifications save significant cost and effort for customers when integrating the module into their products. The Bluetooth low energy controller and the IEEE 802.15.4 MAC are embedded in the ROM and are partly running on a separate ARM Cortex-M0 processor. This architecture improves overall system performance and power consumption and makes more flash memory available. The Bluetooth Smart and ZigBee stacks are available free of charge from www.ti.com. PART NUMBER CC2650MODAMOH Device Information(1) PACKAGE MOH (Module) BODY SIZE 16.90 mm 11.00 mm
(1) For more information, see Section 9, Mechanical Packaging and Orderable Information. 2 Device Overview Copyright 2016, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC2650MOD PRODUCT PREVIEW www.ti.com 1.4 Functional Block Diagram Figure 1-1 is a block diagram for the CC2650MOD device. CC2650MOD SWRS187 AUGUST 2016 Figure 1-1. CC2650MOD Block Diagram Copyright 2016, Texas Instruments Incorporated Device Overview 3 Submit Documentation Feedback Product Folder Links: CC2650MOD PRODUCT PREVIEWMain CPU:128KBFlashSensor ControllercJTAG 20KBSRAMROMARMCortex-M3 DC/DC converterRF coreARMCortex-M0DSP Modem4KB SRAMROMSensor Controller Engine2 Analog Comparators12-bit ADC, 200ks/sConstant Current SourceSPI / I2C Digital Sensor IF2KB SRAMTime to Digital ConverterGeneral Peripherals / Modules4 32-bit Timers2 SSI (SPI, Wire,TI)Watchdog TimerTemp. / Batt. MonitorRTC I2CUART I2S10 / 15 / 31 GPIOsAES32 ch. DMAADCADCDigital PLLSimpleLinkTM CC2650MOD Wireless MCU ModuleTRNG8KBCache24MHz Crystal Oscillator32.768kHz Crystal OscillatorRF BalunCopyright 2016, Texas Instruments Incorporated CC2650MOD SWRS187 AUGUST 2016 Table of Contents www.ti.com 5 1.1 1.2 1.3 1.4 1 Device Overview ......................................... 1 Features .............................................. 1 Applications........................................... 2 Description............................................ 2 Functional Block Diagram ............................ 3 2 Revision History ......................................... 4 3 Device Comparison ..................................... 5 Terminal Configuration and Functions.............. 6 4 4.1 Module Pin Diagram.................................. 6 Pin Functions......................................... 7 4.2 Specifications ............................................ 8 Absolute Maximum Ratings .......................... 8 5.1 ESD Ratings.......................................... 8 5.2 Recommended Operating Conditions................ 8 5.3 Power Consumption Summary....................... 9 5.4 General Characteristics .............................. 9 5.5 Antenna ............................................. 10 5.6 1-Mbps GFSK (Bluetooth low energy) RX ........ 10 5.7 1-Mbps GFSK (Bluetooth low energy) TX ........ 11 5.8 2-Mbps GFSK (Bluetooth low energy) RX ........ 11 5.9 5.10 2-Mbps GFSK (Bluetooth low energy) TX ........ 12 5.11 IEEE 802.15.4 (Offset Q-PSK DSSS, 250 kbps) RX ................................................... 12 5.12 IEEE 802.15.4 (Offset Q-PSK DSSS, 250 kbps) TX ................................................... 13 5.13 24-MHz Crystal Oscillator (XOSC_HF) ............. 13 5.14 32.768-kHz Crystal Oscillator (XOSC_LF).......... 13 5.15 48-MHz RC Oscillator (RCOSC_HF) ............... 13 5.16 32-kHz RC Oscillator (RCOSC_LF)................. 13 5.17 ADC Characteristics................................. 14 5.18 Temperature Sensor ................................ 15 5.19 Battery Monitor...................................... 15 5.20 Continuous Time Comparator....................... 15 5.21 Low-Power Clocked Comparator ................... 15 5.22 Programmable Current Source ..................... 16 5.23 DC Characteristics .................................. 16 5.24 Thermal Resistance Characteristics for MOH Package ............................................. 17 5.25 Timing Requirements ............................... 17 5.26 Switching Characteristics ........................... 17 5.27 Typical Characteristics .............................. 20 6 Detailed Description ................................... 25 Overview ............................................ 25 6.1 Functional Block Diagram........................... 25 6.2 6.3 Main CPU ........................................... 26 RF Core ............................................. 26 6.4 Sensor Controller ................................... 27 6.5 6.6 Memory.............................................. 28 Debug ............................................... 28 6.7 Power Management................................. 29 6.8 Clock Systems ...................................... 30 6.9 6.10 General Peripherals and Modules .................. 30 6.11 System Architecture................................. 32 6.12 Certification.......................................... 32 6.13 End Product Labeling ............................... 33 6.14 Manual Information to the End User ................ 33 7 Application, Implementation, and Layout ......... 34 Application Information.............................. 34 8 Device and Documentation Support ............... 35 Device Nomenclature ............................... 35 8.1 Tools and Software ................................. 36 8.2 Documentation Support ............................. 37 8.3 Texas Instruments Low-Power RF Website ........ 37 8.4 Low-Power RF eNewsletter......................... 37 8.5 Community Resources.............................. 38 8.6 Additional Information............................... 38 8.7 Trademarks.......................................... 38 8.8 Electrostatic Discharge Caution..................... 39 8.9 8.10 Export Control Notice ............................... 39 8.11 Glossary............................................. 39 Information .............................................. 39 Packaging Information .............................. 39 9.1 9 Mechanical Packaging and Orderable 7.1 2 Revision History DATE August 2016 REVISION
*
NOTES Initial Release 4 Revision History Copyright 2016, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC2650MOD PRODUCT PREVIEW www.ti.com 3 Device Comparison CC2650MOD SWRS187 AUGUST 2016 Table 3-1. Device Family Overview DEVICE CC2650MODAMOH PHY SUPPORT Multiprotocol FLASH
(KB) 128 RAM (KB) GPIO PACKAGE 20 15 MOH Copyright 2016, Texas Instruments Incorporated Device Comparison 5 Submit Documentation Feedback Product Folder Links: CC2650MOD PRODUCT PREVIEW CC2650MOD SWRS187 AUGUST 2016 4 Terminal Configuration and Functions 4.1 Module Pin Diagram www.ti.com
(1) The following I/O pins marked in bold in the pinout have high-drive capabilities:
DIO 2 DIO 3 DIO 4 JTAG_TMS DIO 5/JTAG_TDO DIO 6/JTAG_TDI
(2) The following I/O pins marked in italics in the pinout have analog capabilities:
DIO 7 DIO 8 DIO 9 DIO 10 DIO 11 DIO 12 DIO 13 DIO 14 Figure 4-1. MOH Package
(16.9-mm 11-mm) Module Pinout 6 Terminal Configuration and Functions Copyright 2016, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC2650MOD PRODUCT PREVIEW CC2650MOD (Exposed GND Pads) 31245671921201817232210111213141516AntennaGNDDIO 0DIO 1DIO 2DIO 3DIO 4JTAG_TMSVDDVDDDIO 14DIO 13DIO 12DIO 11DIO 10JTAG_TCKDIO 5/JTAG_TDODIO 6/JTAG_TDInRESETDIO 7DIO 8DIO 9892524GNDGNDG1G2G3G4NCNC www.ti.com 4.2 Pin Functions PIN NAME DIO_0 DIO_1 DIO_2 DIO_3 DIO_4 DIO_5/JTAG_TDO DIO_6/JTAG_TDI DIO_7 DIO_8 DIO_9 DIO_10 DIO_11 DIO_12 DIO_13 DIO_14 EGP GND JTAG_TCKC JTAG_TMSC NC RESET_N VDDS CC2650MOD SWRS187 AUGUST 2016 Table 4-1. Signal Descriptions MOH Package PIN TYPE Digital I/O Digital I/O Digital I/O Digital I/O Digital I/O Digital I/O Digital I/O Digital I/O, Analog I/O Digital I/O, Analog I/O Digital I/O, Analog I/O Digital I/O, Analog I/O Digital I/O, Analog I/O Digital I/O, Analog I/O Digital I/O, Analog I/O Digital I/O, Analog I/O PIN NO. 4 5 6 7 8 11 12 14 15 16 17 18 19 20 21 G1, G2, G3, G4 Power 1, 25 10 9 Digital I/O Digital I/O 2, 24 13 22, 23 NC Digital input Power DESCRIPTION GPIO, Sensor Controller GPIO, Sensor Controller GPIO, Sensor Controller, high-drive capability GPIO, Sensor Controller, high-drive capability GPIO, Sensor Controller, high-drive capability GPIO, high-drive capability, JTAG_TDO GPIO, high-drive capability, JTAG_TDI GPIO, Sensor Controller, analog GPIO, Sensor Controller, analog GPIO, Sensor Controller, analog GPIO, Sensor Controller, analog GPIO, Sensor Controller, analog GPIO, Sensor Controller, analog GPIO, Sensor Controller, analog GPIO, Sensor Controller, analog Ground Exposed ground pad Ground JTAG TCKC JTAG TMSC, high-drive capability Not ConnectedTI recommends that these pins are left floating Reset, active low. No internal pullup 1.8-V to 3.8-V main chip supply Copyright 2016, Texas Instruments Incorporated Terminal Configuration and Functions 7 Submit Documentation Feedback Product Folder Links: CC2650MOD PRODUCT PREVIEW CC2650MOD SWRS187 AUGUST 2016 5 Specifications www.ti.com 5.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted)(1)(2) VDDS Supply voltage Voltage on any digital pin(3) Vin Voltage on ADC input Voltage scaling enabled Voltage scaling disabled, internal reference Voltage scaling disabled, VDDS as reference MIN 0.3 0.3 0.3 0.3 0.3 MAX 4.1 VDDS + 0.3, max 4.1 VDDS 1.49 VDDS / 2.9 UNIT V V V Input RF level Storage temperature dBm C Tstg
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 5 85 40
(2) All voltage values are with respect to ground, unless otherwise noted.
(3) Including analog capable DIO. 5.2 ESD Ratings VESD Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS001(1) Charged device model (CDM), per JESD22-C101(2) All pins RF pins Non-RF pins UNIT V VALUE 2500 750 750
(1)
(2) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 5.3 Recommended Operating Conditions Ambient temperature Operating supply voltage (VDDS) For operation in battery-powered and 3.3-V systems
(internal DC-DC can be used to minimize power consumption) MIN 40 1.8 MAX 85 UNIT C 3.8 V 8 Specifications Copyright 2016, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC2650MOD PRODUCT PREVIEW www.ti.com 5.4 Power Consumption Summary Tc = 25C, VDDS = 3.0 V with internal DC-DC converter, unless otherwise noted PARAMETER TEST CONDITIONS MIN Icore Core current consumption Reset. RESET_N pin asserted or VDDS below Power-on-Reset threshold Shutdown. No clocks running, no retention Standby. With RTC, CPU, RAM and (partial) register retention. RCOSC_LF Standby. With RTC, CPU, RAM and (partial) register retention. XOSC_LF Standby. With Cache, RTC, CPU, RAM and
(partial) register retention. RCOSC_LF Standby. With Cache, RTC, CPU, RAM and
(partial) register retention. XOSC_LF Idle. Supply systems and RAM powered. Active. Core running CoreMark Radio RX Radio TX, 0-dBm output power Radio TX, 5-dBm output power Peripheral Current Consumption (Adds to core current Icore for each peripheral unit activated)(1) Peripheral power domain Serial power domain Iperi RF Core DMA Timers I2C I2S SSI UART Delta current with domain enabled Delta current with domain enabled Delta current with power domain enabled, clock enabled, RF Core Idle Delta current with clock enabled, module idle Delta current with clock enabled, module idle Delta current with clock enabled, module idle Delta current with clock enabled, module idle Delta current with clock enabled, module idle Delta current with clock enabled, module idle CC2650MOD SWRS187 AUGUST 2016 TYP 100 150 1 1.2 2.5 2.7 550 1.45 mA +
31 A/MHz 6.1 6.1 9.1 20 13 237 130 113 12 36 93 164 MAX UNIT nA A mA A A A A A A A A A
(1) Iperi is not supported in Standby or Shutdown. 5.5 General Characteristics Tc = 25C, VDDS = 3.0 V, unless otherwise noted PARAMETER TEST CONDITIONS FLASH MEMORY Supported flash erase cycles before failure Flash page/sector erase current Flash page/sector erase time(1) Flash page/sector size Flash write current Flash write time(1)
(1) This number is dependent on Flash aging and will increase over time and erase cycles Average delta current, 4 bytes at a time 4 bytes at a time Average delta current MIN 100 TYP MAX UNIT 12.6 8 4 8.15 8 k Cycles mA ms KB mA s Copyright 2016, Texas Instruments Incorporated Specifications 9 Submit Documentation Feedback Product Folder Links: CC2650MOD PRODUCT PREVIEW CC2650MOD SWRS187 AUGUST 2016 www.ti.com 5.6 Antenna Tc = 25C, VDDS = 3.0 V, unless otherwise noted. PARAMETER TEST CONDITIONS MIN Polarization Peak Gain Efficiency 2450 MHz 2450 MHz TYP Linear 1.26 56.9 MAX UNIT dBi
%
1-Mbps GFSK (Bluetooth low energy) RX 5.7 RF performance is specified in a single ended 50- reference plane at the antenna feeding point with Tc = 25C, VDDS = 3.0 V, fRF = 2440 MHz, unless otherwise noted. PARAMETER Receiver sensitivity Receiver saturation Frequency error tolerance Data rate error tolerance Co-channel rejection(1) Selectivity, 1 MHz(1) Selectivity, 2 MHz(1) Selectivity, 3 MHz(1) TEST CONDITIONS BER = 103 BER = 103 Difference between center frequency of the received RF signal and local oscillator frequency. MIN 350 750 Wanted signal at 67 dBm, modulated interferer in channel, BER = 103 Wanted signal at 67 dBm, modulated interferer at 1 MHz, BER = 103 Wanted signal at 67 dBm, modulated interferer at 2 MHz, BER = 103 Wanted signal at 67 dBm, modulated interferer at 3 MHz, BER = 103 Wanted signal at 67 dBm, modulated interferer at 4 MHz, BER = 103 BER = 103 Selectivity, 4 MHz(1) Selectivity, 5 MHz or more(1) Wanted signal at 67 dBm, modulated interferer at 5 MHz, Selectivity, Image frequency(1) Wanted signal at 67 dBm, modulated interferer at image Selectivity, Image frequency 1 MHz(1) Out-of-band blocking(3) Out-of-band blocking Out-of-band blocking Out-of-band blocking frequency, BER = 103 Wanted signal at 67 dBm, modulated interferer at 1 MHz from image frequency, BER = 103 30 MHz to 2000 MHz 2003 MHz to 2399 MHz 2484 MHz to 2997 MHz 3000 MHz to 12.75 GHz Wanted signal at 2402 MHz, 64 dBm. Two interferers at 2405 and 2408 MHz respectively, at the given power level Conducted measurement in a 50- single-ended load. Suitable for systems targeting compliance with EN 300 328, EN 300 440 class 2, FCC CFR47, Part 15 and ARIB STD-T-66 Conducted measurement in a 50- single-ended load. Suitable for systems targeting compliance with EN 300 328, EN 300 440 class 2, FCC CFR47, Part 15 and ARIB STD-T-66 Intermodulation Spurious emissions, 30 MHz to 1000 MHz Spurious emissions, 1 GHz to 12.75 GHz RSSI dynamic range RSSI accuracy
(1) Numbers given as I/C dB
(2) X / Y, where X is +N MHz and Y is N MHz
(3) Excluding one exception at Fwanted / 2, per Bluetooth Specification TYP 97 4 6 7 / 3(2) 34 / 25(2) 38 / 26(2) 42 / 29(2) 32 25 3 / 26(2) 20 5 8 8 34 71 62 70 4 MAX UNIT dBm dBm 350 750 kHz ppm dB dB dB dB dB dB dB dB dBm dBm dBm dBm dBm dBm dBm dB dB 10 Specifications Copyright 2016, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC2650MOD PRODUCT PREVIEW www.ti.com CC2650MOD SWRS187 AUGUST 2016 1-Mbps GFSK (Bluetooth low energy) TX 5.8 RF performance is specified in a single ended 50- reference plane at the antenna feeding point with Tc = 25C, VDDS = 3.0 V, fRF = 2440 MHz, unless otherwise noted. PARAMETER Output power, highest setting Output power, lowest setting Spurious emission conducted measurement(1) TEST CONDITIONS MIN f < 1 GHz, outside restricted bands f < 1 GHz, restricted bands ETSI f < 1 GHz, restricted bands FCC f > 1 GHz, including harmonics TYP 5 21 43 65 76 46 MAX UNIT dBm dBm dBm dBm dBm dBm
(1) Suitable for systems targeting compliance with worldwide radio-frequency regulations ETSI EN 300 328 and EN 300 440 Class 2
(Europe), FCC CFR47 Part 15 (US), and ARIB STD-T66 (Japan) 2-Mbps GFSK (Bluetooth low energy) RX 5.9 RF performance is specified in a single ended 50- reference plane at the antenna feeding point with Tc = 25C, VDDS = 3.0 V, fRF = 2440 MHz, unless otherwise noted. PARAMETER TEST CONDITIONS MIN 300 1000 Receiver sensitivity Receiver saturation Frequency error tolerance Data rate error tolerance Co-channel rejection (1) Selectivity, 2 MHz (1) Selectivity, 4 MHz (1) Selectivity, 6 MHz (1) Alternate channel rejection, 7 MHz(1) Selectivity, Image frequency(1) Selectivity, Image frequency 2 MHz(1) Out-of-band blocking (3) Out-of-band blocking Out-of-band blocking Out-of-band blocking Intermodulation Differential mode. Measured at the CC2650EM-5XD SMA connector, BER = 103 Differential mode. Measured at the CC2650EM-5XD SMA connector, BER = 103 Difference between the incoming carrier frequency and the internally generated carrier frequency Difference between incoming data rate and the internally generated data rate Wanted signal at 67 dBm, modulated interferer in channel, BER = 103 Wanted signal at 67 dBm, modulated interferer at 2 MHz, Image frequency is at 2 MHz BER = 103 Wanted signal at 67 dBm, modulated interferer at 4 MHz, BER = 103 Wanted signal at 67 dBm, modulated interferer at 6 MHz, BER = 103 Wanted signal at 67 dBm, modulated interferer at 7 MHz, BER = 103 Wanted signal at 67 dBm, modulated interferer at image frequency, BER = 103 Note that Image frequency + 2 MHz is the Co-
channel. Wanted signal at 67 dBm, modulated interferer at 2 MHz from image frequency, BER = 103 30 MHz to 2000 MHz 2003 MHz to 2399 MHz 2484 MHz to 2997 MHz 3000 MHz to 12.75 GHz Wanted signal at 2402 MHz, 64 dBm. Two interferers at 2405 and 2408 MHz respectively, at the given power level
(1) Numbers given as I/C dB.
(2) X / Y, where X is +N MHz and Y is N MHz.
(3) Excluding one exception at Fwanted / 2, per Bluetooth Specification. TYP 91.7 4 7 8 / 4(2) 31 / 26(2) 37 / 38(2) 37 / 36(2) 4 7 / 26(2) 33 15 12 10 45 MAX UNIT dBm dBm 500 kHz 1000 ppm dB dB dB dB dB dB dB dBm dBm dBm dBm dBm Copyright 2016, Texas Instruments Incorporated Specifications 11 Submit Documentation Feedback Product Folder Links: CC2650MOD PRODUCT PREVIEW CC2650MOD SWRS187 AUGUST 2016 www.ti.com 5.10 2-Mbps GFSK (Bluetooth low energy) TX RF performance is specified in a single ended 50- reference plane at the antenna feeding point with Tc = 25C, VDDS = 3.0 V, fRF = 2440 MHz, unless otherwise noted. PARAMETER TEST CONDITIONS MIN TYP MAX UNIT Output power, highest setting Output power, highest setting Output power, lowest setting Spurious emission conducted measurement(1) Differential mode, delivered to a single-ended 50- load through a balun Measured on CC2650EM-4XS, delivered to a single-ended 50- load Delivered to a single-ended 50- load through a balun f < 1 GHz, outside restricted bands f < 1 GHz, restricted bands ETSI f < 1 GHz, restricted bands FCC f > 1 GHz, including harmonics 5 2 21 43 65 76 46 dBm dBm dBm dBm dBm dBm dBm
(1) Suitable for systems targeting compliance with worldwide radio-frequency regulations ETSI EN 300 328 and EN 300 440 Class 2
(Europe), FCC CFR47 Part 15 (US), and ARIB STD-T66 (Japan). 5.11 IEEE 802.15.4 (Offset Q-PSK DSSS, 250 kbps) RX RF performance is specified in a single ended 50- reference plane at the antenna feeding point with Tc = 25C, VDDS = 3.0 V, unless otherwise noted. PARAMETER Receiver sensitivity Receiver saturation Adjacent channel rejection Alternate channel rejection Channel rejection, 15 MHz or more Blocking and desensitization, 5 MHz from upper band edge Blocking and desensitization, 10 MHz from upper band edge Blocking and desensitization, 20 MHz from upper band edge Blocking and desensitization, 50 MHz from upper band edge Blocking and desensitization, 5 MHz from lower band edge Blocking and desensitization, 10 MHz from lower band edge Blocking and desensitization, 20 MHz from lower band edge Blocking and desensitization, 50 MHz from lower band edge Spurious emissions, 30 MHz to 1000 MHz Spurious emissions, 1 GHz to 12.75 GHz Frequency error tolerance RSSI dynamic range RSSI accuracy 12 Specifications TEST CONDITIONS MIN PER = 1%
PER = 1%
Wanted signal at 82 dBm, modulated interferer at 5 MHz, PER = 1%
Wanted signal at 82 dBm, modulated interferer at 10 MHz, PER = 1%
Wanted signal at 82 dBm, undesired signal is IEEE 802.15.4 modulated channel, stepped through all channels 2405 to 2480 MHz, PER = 1%
Wanted signal at 97 dBm (3 dB above the sensitivity level), CW jammer, PER = 1%
Wanted signal at 97 dBm (3 dB above the sensitivity level), CW jammer, PER = 1%
Wanted signal at 97 dBm (3 dB above the sensitivity level), CW jammer, PER = 1%
Wanted signal at 97 dBm (3 dB above the sensitivity level), CW jammer, PER = 1%
Wanted signal at 97 dBm (3 dB above the sensitivity level), CW jammer, PER = 1%
Wanted signal at 97 dBm (3 dB above the sensitivity level), CW jammer, PER = 1%
Wanted signal at 97 dBm (3 dB above the sensitivity level), CW jammer, PER = 1%
Wanted signal at 97 dBm (3 dB above the sensitivity level), CW jammer, PER = 1%
Conducted measurement in a 50- single-ended load. Suitable for systems targeting compliance with EN 300 328, EN 300 440 class 2, FCC CFR47, Part 15 and ARIB STD-T-
66 Conducted measurement in a 50- single-ended load. Suitable for systems targeting compliance with EN 300 328, EN 300 440 class 2, FCC CFR47, Part 15 and ARIB STD-T-
66 Difference between center frequency of the received RF signal and local oscillator frequency TYP 100
+4 MAX UNIT dBm dBm 39 52 57 64 64 65 68 63 63 65 67 71 62
>200 100 4 dB dB dB dB dB dB dB dB dB dB dB dBm dBm ppm dB dB Submit Documentation Feedback Product Folder Links: CC2650MOD Copyright 2016, Texas Instruments Incorporated PRODUCT PREVIEW www.ti.com CC2650MOD SWRS187 AUGUST 2016 5.12 IEEE 802.15.4 (Offset Q-PSK DSSS, 250 kbps) TX RF performance is specified in a single ended 50- reference plane at the antenna feeding point with Tc = 25C, VDDS = 3.0 V, unless otherwise noted. PARAMETER Output power, highest setting Output power, lowest setting Error vector magnitude Spurious emission conducted measurement(1) TEST CONDITIONS MIN At maximum output power f < 1 GHz, outside restricted bands f < 1 GHz, restricted bands ETSI f < 1 GHz, restricted bands FCC f > 1 GHz, including harmonics MAX UNIT dBm dBm dBm TYP 5 21 2%
43 65 76 46
(1) Suitable for systems targeting compliance with worldwide radio-frequency regulations ETSI EN 300 328 and EN 300 440 Class 2
(Europe), FCC CFR47 Part 15 (US), and ARIB STD-T66 (Japan) 5.13 24-MHz Crystal Oscillator (XOSC_HF)(1) Tc = 25C, VDDS = 3.0 V, unless otherwise noted PARAMETER TEST CONDITIONS MIN Crystal frequency Crystal frequency tolerance(2) Start-up time(3)
(1) Probing or otherwise stopping the XTAL while the DC-DC converter is enabled may cause permanent damage to the device.
(2) Includes initial tolerance of the crystal, drift over temperature, aging and frequency pulling due to incorrect load capacitance. As per Bluetooth and IEEE 802.15.4 specification 150 40 40
(3) Kick-started based on a temperature and aging compensated RCOSC_HF using precharge injection TYP 24 MAX UNIT MHz ppm s 5.14 32.768-kHz Crystal Oscillator (XOSC_LF) Tc = 25C, VDDS = 3.0 V, unless otherwise noted PARAMETER TEST CONDITIONS Crystal frequency Crystal frequency tolerance, Bluetooth low energy applications 5.15 48-MHz RC Oscillator (RCOSC_HF) Tc = 25C, VDDS = 3.0 V, unless otherwise noted TYP 32.768 MIN 250 MAX 250 UNIT kHz ppm PARAMETER TEST CONDITIONS MIN Frequency Uncalibrated frequency accuracy Calibrated frequency accuracy(1) Start-up time
(1) Accuracy relatively to the calibration source (XOSC_HF). 5.16 32-kHz RC Oscillator (RCOSC_LF) Tc = 25C, VDDS = 3.0 V, unless otherwise noted PARAMETER TEST CONDITIONS MIN Calibrated frequency Temperature coefficient TYP 48 1%
0.25%
5 MAX UNIT MHz s TYP 32.8 50 MAX UNIT kHz ppm/C Copyright 2016, Texas Instruments Incorporated Specifications 13 Submit Documentation Feedback Product Folder Links: CC2650MOD PRODUCT PREVIEW CC2650MOD SWRS187 AUGUST 2016 www.ti.com 5.17 ADC Characteristics(1) Tc = 25C, VDDS = 3.0 V and voltage scaling enabled, unless otherwise noted PARAMETER Input voltage range Resolution Sample rate Offset Gain error Differential nonlinearity Integral nonlinearity DNL(3) INL(4) ENOB Effective number of bits THD Total harmonic distortion SINAD and SNDR Signal-to-noise and distortion ratio SFDR Spurious-free dynamic range TEST CONDITIONS MIN 0 Internal 4.3-V equivalent reference(2) Internal 4.3-V equivalent reference(2) Internal 4.3-V equivalent reference(2), 200 ksps, 9.6-kHz input tone VDDS as reference, 200 ksps, 9.6-kHz input tone Internal 1.44-V reference, voltage scaling disabled, 32 samples average, 200 ksps, 300-Hz input tone Internal 4.3-V equivalent reference(2), 200 ksps, 9.6-kHz input tone VDDS as reference, 200 ksps, 9.6-kHz input tone Internal 1.44-V reference, voltage scaling disabled, 32 samples average, 200 ksps, 300-Hz input tone Internal 4.3-V equivalent reference(2), 200 ksps, 9.6-kHz input tone VDDS as reference, 200 ksps, 9.6-kHz input tone Internal 1.44-V reference, voltage scaling disabled, 32 samples average, 200 ksps, 300-Hz input tone Internal 4.3-V equivalent reference(2), 200 ksps, 9.6-kHz input tone VDDS as reference, 200 ksps, 9.6-kHz input tone Internal 1.44-V reference, voltage scaling disabled, 32 samples average, 200 ksps, 300-Hz input tone Conversion time Serial conversion, time-to-output, 24-MHz clock Current consumption Current consumption Reference voltage Reference voltage Reference voltage Reference voltage Input Impedance Internal 4.3-V equivalent reference(2) VDDS as reference Equivalent fixed internal reference (input voltage scaling enabled). For best accuracy, the ADC conversion should be initiated through the TI-RTOS API in order to include the gain or offset compensation factors stored in FCFG1. Fixed internal reference (input voltage scaling disabled). For best accuracy, the ADC conversion should be initiated through the TI-RTOS API in order to include the gain or offset compensation factors stored in FCFG1. This value is derived from the scaled value (4.3 V) as follows: Vref = 4.3 V 1408 / 4095 VDDS as reference (Also known as RELATIVE) (input voltage scaling enabled) VDDS as reference (Also known as RELATIVE) (input voltage scaling disabled) 200 ksps, voltage scaling enabled. Capacitive input, input impedance depends on sampling frequency and sampling time TYP 12 2 2.4
>1 3 9.8 10 11.1 65 69 71 60 63 69 67 72 73 50 0.66 0.75 4.3(2)(5) 1.48 VDDS VDDS /
2.82(5)
>1 MAX UNIT VDDS 200 V Bits ksps LSB LSB LSB LSB Bits dB dB dB clock-
cycles mA mA V V V V M Input signal scaled down internally before conversion, as if voltage range was 0 to 4.3 V.
(1) Using IEEE Std 1241-2010 for terminology and test methods.
(2)
(3) No missing codes. Positive DNL typically varies from +0.3 to +3.5 depending on device, see Figure 5-24.
(4) For a typical example, see Figure 5-25.
(5) Applied voltage must be within absolute maximum ratings (Section 5.1) at all times. 14 Specifications Copyright 2016, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC2650MOD PRODUCT PREVIEW www.ti.com 5.18 Temperature Sensor Tc = 25C, VDDS = 3.0 V, unless otherwise noted PARAMETER TEST CONDITIONS Resolution Range Accuracy Supply voltage coefficient(1)
(1) Automatically compensated when using supplied driver libraries. 5.19 Battery Monitor Tc = 25C, VDDS = 3.0 V, unless otherwise noted PARAMETER TEST CONDITIONS Resolution Range Accuracy 5.20 Continuous Time Comparator Tc = 25C, VDDS = 3.0 V, unless otherwise noted PARAMETER TEST CONDITIONS Input voltage range External reference voltage Internal reference voltage Offset Hysteresis Decision time Current consumption when enabled(1)
(1) Additionally the bias module needs to be enabled when running in standby mode. Step from 10 mV to +10 mV DCOUPL as reference 5.21 Low-Power Clocked Comparator Tc = 25C, VDDS = 3.0 V, unless otherwise noted PARAMETER TEST CONDITIONS Input voltage range Clock frequency Internal reference voltage, VDDS / 2 Internal reference voltage, VDDS / 3 Internal reference voltage, VDDS / 4 Internal reference voltage, DCOUPL / 1 Internal reference voltage, DCOUPL / 2 Internal reference voltage, DCOUPL / 3 Internal reference voltage, DCOUPL / 4 Offset Hysteresis Decision time Current consumption when enabled Step from 50 mV to +50 mV CC2650MOD SWRS187 AUGUST 2016 MIN 40 MIN 1.8 MIN 0 0 MAX 85 MAX 3.8 MAX VDDS VDDS TYP 4 5 3.2 TYP 50 13 TYP 1.27 3
<2 0.72 8.6 MIN 0 TYP MAX VDDS 32 1.49 1.51 1.01 1.03 0.78 0.79 1.25 1.28 0.63 0.65 0.42 0.44 0.33 0.34
<2
<5
<1 362 UNIT C C C C/V UNIT mV V mV UNIT V V V mV mV s A UNIT V kHz V V V V V V V mV mV clock-cycle nA Copyright 2016, Texas Instruments Incorporated Specifications 15 Submit Documentation Feedback Product Folder Links: CC2650MOD PRODUCT PREVIEW CC2650MOD SWRS187 AUGUST 2016 5.22 Programmable Current Source Tc = 25C, VDDS = 3.0 V, unless otherwise noted. www.ti.com PARAMETER TEST CONDITIONS MIN Current source programmable output range Resolution Current consumption(1) Including current source at maximum programmable output
(1) Additionally, the bias module must be enabled when running in standby mode. 5.23 DC Characteristics TYP 0.2520 0.25 23 MAX UNIT A A A PARAMETER TA = 25C, VDDS = 1.8 V GPIO VOH at 8-mA load GPIO VOL at 8-mA load GPIO VOH at 4-mA load GPIO VOL at 4-mA load GPIO pullup current GPIO pulldown current GPIO high/low input transition, no hysteresis GPIO low-to-high input transition, with hysteresis GPIO high-to-low input transition, with hysteresis GPIO input hysteresis TA = 25C, VDDS = 3.0 V GPIO VOH at 8-mA load GPIO VOL at 8-mA load GPIO VOH at 4-mA load GPIO VOL at 4-mA load TA = 25C, VDDS = 3.8 V GPIO pullup current GPIO pulldown current GPIO high/low input transition, no hysteresis GPIO low-to-high input transition, with hysteresis GPIO high-to-low input transition, with hysteresis GPIO input hysteresis TA = 25C VIH VIL TEST CONDITIONS MIN TYP MAX UNIT IOCURR = 2, high-drive GPIOs only IOCURR = 2, high-drive GPIOs only IOCURR = 1 IOCURR = 1 Input mode, pullup enabled, Vpad = 0 V Input mode, pulldown enabled, Vpad = VDDS IH = 0, transition between reading 0 and reading 1 IH = 1, transition voltage for input read as 0 1 IH = 1, transition voltage for input read as 1 0 IH = 1, difference between 0 1 and 1 0 points IOCURR = 2, high-drive GPIOs only IOCURR = 2, high-drive GPIOs only IOCURR = 1 IOCURR = 1 Input mode, pullup enabled, Vpad = 0 V Input mode, pulldown enabled, Vpad = VDDS IH = 0, transition between reading 0 and reading 1 IH = 1, transition voltage for input read as 0 1 IH = 1, transition voltage for input read as 1 0 IH = 1, difference between 0 1 and 1 0 points 1.32 1.32 0.32 0.32 1.54 0.26 1.58 0.21 71.7 21.1 0.88 1.07 0.74 0.33 2.68 0.33 2.72 0.28 277 113 1.67 1.94 1.54 0.4 V V V V A A V V V V V V V V A A V V V V Lowest GPIO input voltage reliably interpreted as a High Highest GPIO input voltage reliably interpreted as a Low 0.2 0.8 VDDS(1) VDDS(1)
(1) Each GPIO is referenced to a specific VDDS pin. See the technical reference manual listed in Section 8.3 for more details. 16 Specifications Copyright 2016, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC2650MOD PRODUCT PREVIEW www.ti.com CC2650MOD SWRS187 AUGUST 2016 AIR FLOW (m/s)(3) 5.24 Thermal Resistance Characteristics for MOH Package NAME RJC RJB RJA RJMA PsiJT PsiJB
(1)
(2) These values are based on a JEDEC-defined 2S2P system (with the exception of the Theta JC [RJC] value, which is based on a DESCRIPTION Junction-to-case Junction-to-board Junction-to-free air Junction-to-moving air Junction-to-package top Junction-to-board C/W = degrees Celsius per watt. 20.0 15.3 29.6 25.0 8.8 14.8 C/W(1) (2) 0 1 0 0 JEDEC-defined 1S0P system) and will change based on environment as well as application. For more information, see these EIA/JEDEC standards:
Power dissipation of 2 W and an ambient temperature of 70C is assumed. JESD51-2, Integrated Circuits Thermal Test Method Environmental Conditions - Natural Convection (Still Air) JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages JESD51-9, Test Boards for Area Array Surface Mount Package Thermal Measurements
(3) m/s = meters per second. 5.25 Timing Requirements Rising supply-voltage slew rate Falling supply-voltage slew rate Falling supply-voltage slew rate, with low-power flash settings(1) Positive temperature gradient in standby(2) CONTROL INPUT AC CHARACTERISTICS(3) RESET_N low duration SYNCHRONOUS SERIAL INTERFACE (SSI) (4) MIN 0 0 1 12 No limitation for negative temperature gradient, or outside standby mode SSIClk period NOM MAX UNIT 100 mV/s 20 mV/s 3 mV/s 5 C/s s 65024 system clocks tclk_per tclk_per S1 (SLAVE) (5) tclk_per tclk_high tclk_low S2 (5) S3(5)
(1) For smaller coin cell batteries, with high worst-case end-of-life equivalent source resistance, a 22-F VDDS input capacitor (see SSIClk high time SSIClk low time 0.5 0.5 Section 7.1.1) must be used to ensure compliance with this slew rate.
(2) Applications using RCOSC_LF as sleep timer must also consider the drift in frequency caused by a change in temperature (see Section 5.16).
(3) TA = 40C to +85C, VDDS = 1.7 V to 3.8 V, unless otherwise noted.
(4) Tc = 25C, VDDS = 3.0 V, unless otherwise noted. Device operating as SLAVE. For SSI MASTER operation, see Section 5.26.
(5) Refer to SSI timing diagrams Figure 5-1, Figure 5-2, and Figure 5-3. 5.26 Switching Characteristics Measured on the TI CC2650EM-5XD reference design with Tc = 25C, VDDS = 3.0 V, unless otherwise noted. PARAMETER TEST CONDITIONS MIN TYP MAX UNIT WAKEUP AND TIMING Idle Active Standby Active Shutdown Active SYNCHRONOUS SERIAL INTERFACE (SSI) (1) S1 (TX only)(2) tclk_per (SSIClk period) One-way communication to SLAVE S1 (TX and RX)(2) tclk_per (SSIClk period) Normal duplex operation
(1) Device operating as MASTER. For SSI SLAVE operation, see Section 5.25.
(2) Refer to SSI timing diagrams Figure 5-1, Figure 5-2, and Figure 5-3. Copyright 2016, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC2650MOD 14 151 1015 s s s 4 8 65024 65024 system clocks system clocks Specifications 17 PRODUCT PREVIEW CC2650MOD SWRS187 AUGUST 2016 www.ti.com Switching Characteristics (continued) Measured on the TI CC2650EM-5XD reference design with Tc = 25C, VDDS = 3.0 V, unless otherwise noted. PARAMETER S2 (2) tclk_high (SSIClk high time) S3 (2) tclk_low(SSIClk low time) TEST CONDITIONS MIN TYP 0.5 0.5 MAX UNIT tclk_per tclk_per Figure 5-1. SSI Timing for TI Frame Format (FRF = 01), Single Transfer Timing Measurement Figure 5-2. SSI Timing for MICROWIRE Frame Format (FRF = 10), Single Transfer 18 Specifications Copyright 2016, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC2650MOD PRODUCT PREVIEW0SSIClkSSIFssSSITxSSIRxMSBLSBMSBLSBS2S3S18-bitcontrol4to16bitsoutputdataSSIClkSSIFssSSITxSSIRxMSBLSBS2S3S14to16bits www.ti.com CC2650MOD SWRS187 AUGUST 2016 Figure 5-3. SSI Timing for SPI Frame Format (FRF = 00), With SPH = 1 Copyright 2016, Texas Instruments Incorporated Specifications 19 Submit Documentation Feedback Product Folder Links: CC2650MOD PRODUCT PREVIEWSSIClk(SPO = 1)SSITx(Master)SSIRx(Slave)LSBSSIClk(SPO = 0)S2S1SSIFssLSBS3MSBMSB CC2650MOD SWRS187 AUGUST 2016 5.27 Typical Characteristics www.ti.com Figure 5-4. Bluetooth low energy Sensitivity vs Temperature Figure 5-5. IEEE 802.15.4 Sensitivity vs Temperature Figure 5-6. Bluetooth low energy Sensitivity vs Supply Voltage
(VDDS) Figure 5-7. IEEE 802.15.4 Sensitivity vs Supply Voltage (VDDS) Figure 5-8. IEEE 802.15.4 Sensitivity vs Channel Frequency Figure 5-9. Bluetooth low energy Sensitivity vs Channel Frequency 20 Specifications Copyright 2016, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC2650MOD PRODUCT PREVIEWFrequency (MHz)Sensitivity Level (dBm)240024102420243024402450246024702480-101-100-99-98-97-96-95D008SensitivityFrequency (MHz)Sensitivity Level (dBm)240024102420243024402450246024702480-99-98.5-98-97.5-97-96.5-96-95.5-95D009SensitivityVDDS (V)Sensitivity (dBm)1.82.32.83.33.8-101-100-99-98-97-96-95D006BLE SensitivityVDDS (V)Sensitivity (dBm)1.92.42.93.43.8-101-100-99-98-97-96-95D007IEEE 802.15.4 SensitivityTemperature (qC)Sensitivity (dBm)-40-30-20-1001020304050607080-99-98-97-96-95-94-93D004SensitivityTemperature (qC)Sensitivity (dBm)-40-30-20-1001020304050607080-103-102-101-100-99-98-97-96-95D005Sensitivity www.ti.com Typical Characteristics (continued) CC2650MOD SWRS187 AUGUST 2016 Figure 5-10. TX Output Power vs Temperature Figure 5-11. TX Output Power vs Supply Voltage (VDDS) Figure 5-12. TX Output Power vs Channel Frequency Figure 5-13. TX Current Consumption vs Supply Voltage (VDDS) Figure 5-14. RX Mode Current vs Supply Voltage (VDDS) Figure 5-15. RX Mode Current Consumption vs Temperature Copyright 2016, Texas Instruments Incorporated Specifications 21 Submit Documentation Feedback Product Folder Links: CC2650MOD PRODUCT PREVIEWVoltage (V)Current Consumption (mA)1.7522.252.52.7533.253.53.7544.254.54.555.566.577.588.599.51010.5D014Temperature (qC)RX Current (mA)-40-30-20-10010203040506070805.55.65.75.85.966.16.26.36.46.56.66.76.86.97D015RX CurrentFrequency (MHz)Output Power (dBm)240024102420243024402450246024702480-1012345678D0125-dBm settingVDDS (V)TX Current (mA)1.822.22.42.62.833.23.43.63.845678910111213141516D0135-dBm SettingTemperature (qC)Output Power (dBm)-40-30-20-10010203040506070800123456D0105-dBm SettingVDDS (V)Output power (dBm)1.82.32.83.33.80123456D0115-dBm Setting CC2650MOD SWRS187 AUGUST 2016 Typical Characteristics (continued) www.ti.com Figure 5-16. TX Mode Current Consumption vs Temperature Figure 5-17. Active Mode (MCU Running, No Peripherals) Current Consumption vs Temperature Figure 5-18. Active Mode (MCU Running, No Peripherals) Current Consumption vs Supply Voltage (VDDS) Figure 5-19. Standby Mode Current Consumption With RCOSC RTC vs Temperature Figure 5-20. SoC ADC Effective Number of Bits vs Input Frequency (Internal Reference, No Scaling) Figure 5-21. SoC ADC Output vs Supply Voltage (Fixed Input, Internal Reference, No Scaling) 22 Specifications Copyright 2016, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC2650MOD PRODUCT PREVIEWInput Frequency (Hz)Effective Number of Bits20030050010002000500010000200001000009.49.69.81010.210.410.610.81111.211.4D009Fs= 200 kHz, No AveragingFs= 200 kHz, 32 samples averagingVDDS (V)ADC Code1.82.32.83.33.81004.810051005.21005.41005.61005.810061006.21006.4D012VDDS (V)Current Consumption (mA)1.82.32.83.33.822.533.544.55D007Active Mode CurrentTemperature (qC)Current (uA)-20-100102030405060708000.511.522.533.54D008Standby Mode CurrentTemperature (qC)Active Mode Current Consumpstion (mA)-40-30-20-10010203040506070802.852.92.9533.053.1D006Active Mode CurrentTemperature (qC)TX Current (mA)-40-30-20-1001020304050607080024681012D0165-dBm Setting www.ti.com Typical Characteristics (continued) CC2650MOD SWRS187 AUGUST 2016 Figure 5-22. SoC ADC Output vs Temperature (Fixed Input, Internal Reference, No Scaling) Figure 5-23. SoC ADC ENOB vs Sampling Frequency
(Input Frequency = FS / 10) Figure 5-24. SoC ADC DNL vs ADC Code (Internal Reference, No Scaling) Copyright 2016, Texas Instruments Incorporated Specifications 23 Submit Documentation Feedback Product Folder Links: CC2650MOD PRODUCT PREVIEWADC CodeDNL020040060080010001200140016001800200022002400260028003000320034003600380040004200-1.5-1-0.500.511.522.533.5D010Temperature (qC)ADC Code-40-30-20-10010203040506070801004.510051005.510061006.510071007.5D013Sampling Frequency (Hz)ENOB9.69.79.89.91010.110.210.310.410.51k10k100k200kD009AENOB Internal Reference (No Averaging)ENOB Internal Reference (32 Samples Averaging) CC2650MOD SWRS187 AUGUST 2016 Typical Characteristics (continued) www.ti.com Figure 5-25. SoC ADC INL vs ADC Code (Internal Reference, No Scaling) 24 Specifications Copyright 2016, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC2650MOD PRODUCT PREVIEWADC CodeINL020040060080010001200140016001800200022002400260028003000320034003600380040004200-4-3-2-10123D011 www.ti.com 6 Detailed Description 6.1 Overview Section 6.2 shows the core modules of the CC2650MOD device. 6.2 Functional Block Diagram CC2650MOD SWRS187 AUGUST 2016 Copyright 2016, Texas Instruments Incorporated Detailed Description 25 Submit Documentation Feedback Product Folder Links: CC2650MOD PRODUCT PREVIEWMain CPU:128KBFlashSensor ControllercJTAG 20KBSRAMROMARMCortex-M3 DC/DC converterRF coreARMCortex-M0DSP Modem4KB SRAMROMSensor Controller Engine2 Analog Comparators12-bit ADC, 200ks/sConstant Current SourceSPI / I2C Digital Sensor IF2KB SRAMTime to Digital ConverterGeneral Peripherals / Modules4 32-bit Timers2 SSI (SPI, Wire,TI)Watchdog TimerTemp. / Batt. MonitorRTC I2CUART I2S10 / 15 / 31 GPIOsAES32 ch. DMAADCADCDigital PLLSimpleLinkTM CC2650MOD Wireless MCU ModuleTRNG8KBCache24MHz Crystal Oscillator32.768kHz Crystal OscillatorRF BalunCopyright 2016, Texas Instruments Incorporated CC2650MOD SWRS187 AUGUST 2016 6.3 Main CPU www.ti.com The SimpleLink CC2650MOD Wireless MCU contains an ARM Cortex-M3 (CM3) 32-bit CPU, which runs the application and the higher layers of the protocol stack. The CM3 processor provides a high-performance, low-cost platform that meets the system requirements of minimal memory implementation, and low-power consumption, while delivering outstanding computational performance and exceptional system response to interrupts. CM3 features include:
Outstanding processing performance combined with fast interrupt handling ARM Thumb-2 mixed 16- and 32 bit instruction set delivers the high performance expected of a 32-bit ARM core in a compact memory size usually associated with 8- and 16-bit devices, typically in the range of a few kilobytes of memory for microcontroller-class applications:
Single-cycle multiply instruction and hardware divide Atomic bit manipulation (bit-banding), delivering maximum memory use and streamlined peripheral 32-bit ARM Cortex-M3 architecture optimized for small-footprint embedded applications control Unaligned data access, enabling data to be efficiently packed into memory Fast code execution permits slower processor clock or increases sleep mode time Harvard architecture characterized by separate buses for instruction and data Efficient processor core, system, and memories Hardware division and fast digital-signal-processing oriented multiply accumulate Saturating arithmetic for signal processing Deterministic, high-performance interrupt handling for time-critical applications Enhanced system debug with extensive breakpoint and trace capabilities Serial wire trace reduces the number of pins required for debugging and tracing Migration from the ARM7 processor family for better performance and power efficiency Optimized for single-cycle flash memory use Ultra-low power consumption with integrated sleep modes 1.25 DMIPS per MHz 6.4 RF Core The RF Core contains an ARM Cortex-M0 processor that interfaces the analog RF and base-band circuitries, handles data to and from the system side, and assembles the information bits in a given packet structure. The RF core offers a high level, command-based API to the main CPU. The RF core is capable of autonomously handling the time-critical aspects of the radio protocols (802.15.4 RF4CE and ZigBee, Bluetooth low energy) thus offloading the main CPU and leaving more resources for the user application. The RF core has a dedicated 4KB SRAM block and runs initially from separate ROM memory. The ARM Cortex-M0 processor is not programmable by customers. 26 Detailed Description Copyright 2016, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC2650MOD PRODUCT PREVIEW www.ti.com 6.5 Sensor Controller CC2650MOD SWRS187 AUGUST 2016 The Sensor Controller contains circuitry that can be selectively enabled in standby mode. The peripherals in this domain may be controlled by the Sensor Controller Engine, which is a proprietary power-optimized CPU. This CPU can read and monitor sensors or perform other tasks autonomously, thereby significantly reducing power consumption and offloading the main CM3 CPU. The Sensor Controller is set up using a PC-based configuration tool, called Sensor Controller Studio, and typical use cases may be (but are not limited to):
Analog sensors using integrated ADC Digital sensors using GPIOs and bit-banged I2C or SPI UART communication for sensor reading or debugging Capacitive sensing Waveform generation Pulse counting Keyboard scan Quadrature decoder for polling rotation sensors Oscillator calibration The peripherals in the Sensor Controller include the following:
The low-power clocked comparator can be used to wake the device from any state in which the comparator is active. A configurable internal reference can be used in conjunction with the comparator. The output of the comparator can also be used to trigger an interrupt or the ADC. Capacitive sensing functionality is implemented through the use of a constant current source, a time-
to-digital converter, and a comparator. The continuous time comparator in this block can also be used as a higher-accuracy alternative to the low-power clocked comparator. The Sensor Controller will take care of baseline tracking, hysteresis, filtering and other related functions. The ADC is a 12-bit, 200 ksamples/s ADC with eight inputs and a built-in voltage reference. The ADC the analog I/O pins, software, including timers, can be triggered by many different sources, comparator, and the RTC. The Sensor Controller also includes a SPI/I2C digital interface. The analog modules can be connected to up to eight different GPIOs. The peripherals in the Sensor Controller can also be controlled from the main application processor. Copyright 2016, Texas Instruments Incorporated Detailed Description 27 Submit Documentation Feedback Product Folder Links: CC2650MOD PRODUCT PREVIEW CC2650MOD SWRS187 AUGUST 2016 www.ti.com Table 6-1. GPIOs Connected to the Sensor Controller(1) ANALOG CAPABLE 16.9 11 MOH DIO NUMBER Y Y Y Y Y Y Y Y N N N N N 14 13 12 11 9 10 8 7 4 3 2 1 0 6.6 Memory
(1) Up to 13 pins can be connected to the Sensor Controller. Up to eight of these pins can be connected to analog modules The flash memory provides nonvolatile storage for code and data. The flash memory is in-system programmable. The SRAM (static RAM) can be used for both storage of data and execution of code and is split into two 4KB blocks and two 6KB blocks. Retention of the RAM contents in standby mode can be enabled or disabled individually for each block to minimize power consumption. In addition, if flash cache is disabled, the 8KB cache can be used as a general-purpose RAM. The ROM provides preprogrammed embedded TI-RTOS kernel, Driverlib and lower layer protocol stack software (802.15.4 MAC and Bluetooth low energy Controller). The ROM also contains a bootloader that can be used to reprogram the device using SPI or UART. 6.7 Debug The on-chip debug support is done through a dedicated cJTAG (IEEE 1149.7) or JTAG (IEEE 1149.1) interface. 28 Detailed Description Copyright 2016, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC2650MOD PRODUCT PREVIEW www.ti.com 6.8 Power Management CC2650MOD SWRS187 AUGUST 2016 To minimize power consumption, the CC2650MOD device supports a number of power modes and power management features (see Table 6-2). Table 6-2. Power Modes SOFTWARE CONFIGURABLE POWER MODES STANDBY SHUTDOWN MODE CPU Flash SRAM Radio Supply System Current Wake-up time to CPU active(1) Register retention SRAM retention High-speed clock Low-speed clock ACTIVE Active On On Available On 1.45 mA + 31 A/MHz Full Full IDLE Off Available On Available On 550 A 14 s Full Full RESET PIN HELD Off Off Off Off Off Off Off Off Off Off 0.15 A 1015 s 0.1 A 1015 s No No Off Off No No Off Off Off Off On Off Duty Cycled 1 A 151 s Partial Full Off XOSC_LF or RCOSC_LF XOSC_HF or RCOSC_HF XOSC_LF or RCOSC_LF Available Available Available Available Available Active Active XOSC_HF or RCOSC_HF XOSC_LF or RCOSC_LF Available Available Available Available Available Active Active Peripherals Sensor Controller Wake up on RTC Wake up on pin edge Wake up on reset pin Brown Out Detector (BOD) Power On Reset (POR)
(1) Not including RTOS overhead
(2) The Brown Out Detector is disabled between recharge periods in STANDBY. Lowering the supply voltage below the BOD threshold Available Available Available Available Available Available Duty Cycled(2) Off Off Off Off Off Off Off N/A N/A Active Active Off Off Available between two recharge periods while in STANDBY may cause the BOD to lock the device upon wake-up until a Reset or POR releases it. To avoid this, it is recommended that STANDBY mode is avoided if there is a risk that the supply voltage (VDDS) may drop below the specified operating voltage range. For the same reason, it is also good practice to ensure that a power cycling operation, such as a battery replacement, triggers a Power-on-reset by ensuring that the VDDS decoupling network is fully depleted before applying supply voltage again (for example, inserting new batteries). In active mode, the application CM3 CPU is actively executing code. Active mode provides normal operation of the processor and all of the peripherals that are currently enabled. The system clock can be any available clock source (see Table 6-2). In idle mode, all active peripherals can be clocked, but the Application CPU core and memory are not clocked and no code is executed. Any interrupt event will bring the processor back into active mode. In standby mode, only the always-on domain (AON) is active. An external wake event, RTC event, or sensor-controller event is required to bring the device back to active mode. MCU peripherals with retention do not need to be reconfigured when waking up again, and the CPU continues execution from where it went into standby mode. All GPIOs are latched in standby mode. In shutdown mode, the device is turned off entirely, including the AON domain and the Sensor Controller. The I/Os are latched with the value they had before entering shutdown mode. A change of state on any I/O pin, defined as a wake from Shutdown pin, wakes up the device and functions as a reset trigger. The CPU can differentiate between a reset in this way, a reset-by-reset pin, or a power-on-reset by reading the reset status register. The only state retained in this mode is the latched I/O state and the Flash memory contents. Copyright 2016, Texas Instruments Incorporated Detailed Description 29 Submit Documentation Feedback Product Folder Links: CC2650MOD PRODUCT PREVIEW CC2650MOD SWRS187 AUGUST 2016 www.ti.com The Sensor Controller is an autonomous processor that can control the peripherals in the Sensor Controller independently of the main CPU, which means that the main CPU does not have to wake up, for example, to execute an ADC sample or poll a digital sensor over SPI. The main CPU saves both current and wake-up time that would otherwise be wasted. The Sensor Controller Studio enables the user to configure the sensor controller and choose which peripherals are controlled and which conditions wake up the main CPU. 6.9 Clock Systems The CC2650MOD device supports two external and two internal clock sources. A 24-MHz crystal is required as the frequency reference for the radio. This signal is doubled internally to create a 48-MHz clock. is optional. Bluetooth low energy requires a slow-speed clock with better than The 32-kHz crystal 500-ppm accuracy if the device is to enter any sleep mode while maintaining a connection. The internal 32-kHz RC oscillator can in some use cases be compensated to meet the requirements. The low-speed crystal oscillator is designed for use with a 32-kHz watch-type crystal. The internal high-speed oscillator (48 MHz) can be used as a clock source for the CPU subsystem. The internal oscillator is not used. The 32-kHz clock source can be used as external clocking reference through GPIO. low-speed oscillator (32.768 kHz) can be used as a reference if the low-power crystal 6.10 General Peripherals and Modules The I/O controller controls the digital I/O pins and contains multiplexer circuitry to allow a set of peripherals to be assigned to I/O pins in a flexible manner. All digital I/Os are interrupt and wake-up capable, have a programmable pullup and pulldown function and can generate an interrupt on a negative or positive edge
(configurable). When configured as an output, pins can function as either push-pull or open-drain. Five GPIOs have high-drive capabilities (marked in bold in Section 4). The SSIs are synchronous serial synchronous serial interfaces. The SSIs support both SPI master and slave up to 4 MHz. The UART implements a universal asynchronous receiver/transmitter function. It supports flexible baud-
rate generation up to a maximum of 3 Mbps . interfaces that are compatible with SPI, MICROWIRE, and TI's 30 Detailed Description Copyright 2016, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC2650MOD PRODUCT PREVIEW www.ti.com CC2650MOD SWRS187 AUGUST 2016 Timer 0 is a general-purpose timer module (GPTM), which provides two 16-bit timers. The GPTM can be configured to operate as a single 32-bit timer, dual 16-bit timers or as a PWM module. Timer 1, Timer 2, and Timer 3 are also GPTMs. Each of these timers is functionally equivalent to Timer 0. In addition to these four timers, the RF core has its own timer to handle timing for RF protocols; the RF timer can be synchronized to the RTC. The I2C interface is used to communicate with devices compatible with the I2C standard. The I2C interface is capable of 100-kHz and 400-kHz operation, and can serve as both I2C master and I2C slave. The TRNG module provides a true, nondeterministic noise source for the purpose of generating keys, initialization vectors (IVs), and other random number requirements. The TRNG is built on 24 ring oscillators that create unpredictable output to feed a complex nonlinear combinatorial circuit. The watchdog timer is used to regain control if the system fails due to a software error after an external device fails to respond as expected. The watchdog timer can generate an interrupt or a reset when a predefined time-out value is reached. The device includes a direct memory access (DMA) controller. The DMA controller provides a way to offload data transfer tasks from the CM3 CPU, allowing for more efficient use of the processor and the available bus bandwidth. The DMA controller can perform transfer between memory and peripherals. The DMA controller has dedicated channels for each supported on-chip module and can be programmed to automatically perform transfers between peripherals and memory as the peripheral is ready to transfer more data. Some features of the DMA controller include the following (this is not an exhaustive list):
Highly flexible and configurable channel operation of up to 32 channels Transfer modes: memory-to-memory, memory-to-peripheral, peripheral-to-memory, and peripheral-to-
peripheral Data sizes of 8, 16, and 32 bits The AON domain contains circuitry that is always enabled, except for in Shutdown (where the digital supply is off). This circuitry includes the following:
The RTC can be used to wake the device from any state where it is active. The RTC contains three compare and one capture registers. With software support, the RTC can be used for clock and calendar operation. The RTC is clocked from the 32-kHz RC oscillator or crystal. The RTC can also be compensated to tick at the correct frequency even when the internal 32-kHz RC oscillator is used instead of a crystal. The battery monitor and temperature sensor are accessible by software and give a battery status indication as well as a coarse temperature measure. Copyright 2016, Texas Instruments Incorporated Detailed Description 31 Submit Documentation Feedback Product Folder Links: CC2650MOD PRODUCT PREVIEW CC2650MOD SWRS187 AUGUST 2016 6.11 System Architecture www.ti.com Depending on the product configuration, CC26xx can function either as a Wireless Network Processor
(WNPan IC running the wireless protocol stack, with the application running on a separate MCU), or as a System-on-Chip (SoC), with the application and protocol stack running on the ARM CM3 core inside the device. In the first case, the external host MCU communicates with the device using SPI or UART. In the second case, the application must be written according to the application framework supplied with the wireless protocol stack. 6.12 Certification The CC2650MODA module is certified to the standards listed in Table 6-3 (with IDs where applicable):
Table 6-3. CC2650MODA List of Certifications ID (if applicable) FCC ID: ZAT26M1 ID: 451H-26M1 Regulatory Body FCC (USA) IC (Canada) ETSI/CE (Europe) Japan MIC Specification Part 15C:2015+MPE FCC 1.1307 RF Exposure (Bluetooth) Part 15C:2015+MPE FCC 1.1307 RF Exposure (802.15.4) RSS-247 (Bluetooth) RSS-247 (802.15.4) EN300328 v1.9.1 (Bluetooth) EN300328 v1.9.1 (802.15.4) IEC/EN62479:Ver 2010 (MPE) (replacing EN50371) EN301489-1 v1.9.2:2011 EN301489-3 v1.6.1:2013 EN301489-17 v2.2.1:2012 (EMC) EN55022:2010+AC:2011 EN55024:2011 EN60950-1: A2/2013 JRF-STD-66 JATE 6.12.1 Federal Communications Commission Statement You are cautioned that changes or modifications not expressly approved by the part responsible for compliance could void the users authority to operate the equipment. This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:
1. This device may not cause harmful interference and 2. This device must accept any interference received, including interference that may cause undesired operation of the device. FCC RF Radiation Exposure Statement:
This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. End users must follow the specific operating instructions for satisfying RF exposure limits. This transmitter must not be colocated or operating in conjunction with any other antenna or transmitter. 32 Detailed Description Copyright 2016, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC2650MOD PRODUCT PREVIEW www.ti.com 6.12.2 Canada, Industry Canada (IC) CC2650MOD SWRS187 AUGUST 2016 This device complies with Industry Canada licence-exempt RSS standard(s). Operation is subject to the following two conditions:
1. This device may not cause interference, and 2. This device must accept any interference, including interference that may cause undesired operation of the device Le prsent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence L'exploitation est autorise aux deux conditions suivantes:
1. 2. l'appareil ne doit pas produire de brouillage, et l'utilisateur de l'appareil doit accepter tout brouillage radiolectrique subi, mme si le brouillage est susceptible d'en compromettre le fonctionnement. IC RF Radiation Exposure Statement:
To comply with IC RF exposure requirements, this device and its antenna must not be co-located or operating in conjunction with any other antenna or transmitter. Pour se conformer aux exigences de conformit RF canadienne l'exposition, cet appareil et son antenne ne doivent pas tre co-localiss ou fonctionnant en conjonction avec une autre antenne ou transmetteur. 6.13 End Product Labeling This module is designed to comply with the FCC statement, FCC ID : ZAT26M1. The host system using this module must display a visible label indicating the following text:
"Contains FCC ID: ZAT26M1"
This module is designed to comply with the IC statement, IC : 451H-26M1. The host system using this module must display a visible label indicating the following text:
"Contains IC: 451H-26M1"
6.14 Manual Information to the End User The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the users manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as shown in this manual. Copyright 2016, Texas Instruments Incorporated Detailed Description 33 Submit Documentation Feedback Product Folder Links: CC2650MOD PRODUCT PREVIEW CC2650MOD SWRS187 AUGUST 2016 7 Application, Implementation, and Layout www.ti.com Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI's customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality. NOTE 7.1 Application Information 7.1.1 Typical Application Circuit No external components are required for the operation of the CC2650MOD device. Figure 7-1 shows the application circuit. Figure 7-1. CC2650MOD Application Circuit 34 Application, Implementation, and Layout Copyright 2016, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC2650MOD PRODUCT PREVIEWnResetJTAG-TCKJTAG-TMSDIO0DIO1DIO2DIO3DIO4DIO5DIO6DIO7DIO8DIO9DIO10DIO11DIO12DIO13DIO14VDDSVDDSCC2650MODAMOHU1NC_22DIO_04DIO_15DIO_26DIO_37DIO_48DIO_5/JTAG_TDO11DIO_6/JTAG_TDI12DIO_714DIO_815DIO_916DIO_1017DIO_1118DIO_1219DIO_1320DIO_1421VDDS22nRESET13JTAG_TMSC9JTAG_TCKC10VDDS23NC_2424GND1GND3GND25EGP26EGP27EGP28EGP29R28100kCopyright 2016,Texas Instruments Incorporated www.ti.com 8 Device and Documentation Support 8.1 Device Nomenclature CC2650MOD SWRS187 AUGUST 2016 P To designate the stages in the product development cycle, TI assigns prefixes to all part numbers and/or date-code. Each device has one of three prefixes/identifications: X, P, or null (no prefix) (for example, CC2650MOD is in production; therefore, no prefix/identification is assigned). Device development evolutionary flow:
X Experimental device that is not necessarily representative of the final device's electrical specifications and may not use production assembly flow. Prototype device that is not necessarily the final silicon die and may not necessarily meet final electrical specifications. Production version of the silicon die that is fully qualified. null Production devices have been characterized fully, and the quality and reliability of the device have been demonstrated fully. TI's standard warranty applies. Predictions show that prototype devices (X or P) have a greater failure rate than the standard production devices. Texas Instruments recommends that these devices not be used in any production system because their expected end-use failure rate still is undefined. Only qualified production devices are to be used. TI device nomenclature also includes a suffix with the device family name. This suffix indicates the package type (for example, MOH). For orderable part numbers of CC2650MOD devices in the MOH package type, see the Package Option Addendum of this document, the TI website (www.ti.com), or contact your TI sales representative. Figure 8-1. Device Nomenclature Copyright 2016, Texas Instruments Incorporated Device and Documentation Support 35 Submit Documentation Feedback Product Folder Links: CC2650MOD PRODUCT PREVIEWSimpleLinkMultistandardWireless MCUDEVICE FAMILYPREFIXCC2650 MODX = Experimental deviceBlank = Qualified deviceMOHAROM version 1Flash = 128KBDEVICEPACKAGE DESIGNATORMOH = 29-pin ModuleMOD = Module CC2650MOD SWRS187 AUGUST 2016 www.ti.com 8.2 Tools and Software TI offers an extensive line of development tools, including tools to evaluate the performance of the processors, generate code, develop algorithm implementations, and fully integrate and debug software and hardware modules. The following products support development of the CC2650MOD device applications:
Software Tools:
SmartRF Studio 7:
SmartRF Studio is a PC application that helps designers of radio systems to easily evaluate the RF-IC at an early stage in the design process. Test functions for sending and receiving radio packets, continuous wave transmit and receive Evaluate RF performance on custom boards by wiring it to a supported evaluation board or debugger Can also be used without any hardware, but then only to generate, edit and export radio configuration settings Can be used in combination with several development kits for TI's CCxxxx RF-ICs Sensor Controller Studio:
Sensor Controller Studio provides a development environment for the CC26xx Sensor Controller. The Sensor Controller is a proprietary, power-optimized CPU in the CC26xx, which can perform simple background tasks autonomously and independent of the System CPU state. Allows for Sensor Controller task algorithms to be implemented using a C-like programming language Outputs a Sensor Controller Interface driver, which incorporates the generated Sensor Controller machine code and associated definitions Allows for rapid development by using the integrated Sensor Controller task testing and debugging functionality. This allows for live visualization of sensor data and algorithm verification. Integrated development environment with project management tools and editor IDEs and Compilers:
Code Composer Studio:
Code Composer Studio (CCS) 6.1 and later has built-in support for the CC26xx device family Best support for XDS debuggers; XDS100v3, XDS110 and XDS200 High integration with TI-RTOS with support for TI-RTOS Object View IAR Embedded Workbench for ARM Broad debugger support, supporting XDS100v3, XDS200, IAR I-Jet and Segger J-Link RTOS plugin is available for TI-RTOS For a complete listing of development-support the Texas Instruments website at www.ti.com. For information on pricing and availability, contact the nearest TI field sales office or authorized distributor. Integrated development environment with project management tools and editor IAR EWARM 7.30.3 and later has built-in support for the CC26xx device family Integrated development environment with project management tools and editor tools for the CC2650MOD platform, visit 36 Device and Documentation Support Copyright 2016, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC2650MOD PRODUCT PREVIEW www.ti.com 8.3 Documentation Support CC2650MOD SWRS187 AUGUST 2016 The following documents describe the CC2650MOD device. Copies of these documents are available on the Internet at www.ti.com. CC26xx SimpleLink Wireless MCU Technical Reference Manual CC26xx SimpleLink Wireless MCU Errata 8.3.1 Community Resources The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views;
see TI's Terms of Use. TI E2E Online Community TI's Engineer-to-Engineer
(E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. TI Embedded Processors Wiki Texas Instruments Embedded Processors Wiki. Established to help developers get started with Embedded Processors from Texas Instruments and to foster innovation and growth of general knowledge about the hardware and software surrounding these devices. 8.4 8.5 Texas Instruments Low-Power RF Website TI's Low-Power RF website has all the latest products, application and design notes, FAQ section, news and events updates. Go to www.ti.com/lprf. Low-Power RF eNewsletter The Low-Power RF eNewsletter is up-to-date on new products, news releases, developers news, and other news and events associated with low-power RF products from TI. The Low-Power RF eNewsletter articles include links to get more online information. Sign up at: www.ti.com/lprfnewsletter Copyright 2016, Texas Instruments Incorporated Device and Documentation Support 37 Submit Documentation Feedback Product Folder Links: CC2650MOD PRODUCT PREVIEW CC2650MOD SWRS187 AUGUST 2016 8.6 Community Resources www.ti.com The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views;
see TI's Terms of Use. TI E2E Online Community TI's Engineer-to-Engineer
(E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. TI Embedded Processors Wiki Texas Instruments Embedded Processors Wiki. Established to help developers get started with Embedded Processors from Texas Instruments and to foster innovation and growth of general knowledge about the hardware and software surrounding these devices. Low-Power RF Online Community Wireless Connectivity Section of the TI E2E Support Community Forums, videos, and blogs RF design help E2E interaction Join here. Low-Power RF Developer Network Texas Instruments has launched an extensive network of low-power RF development partners to help customers speed up their application development. The network consists of recommended companies, RF consultants, and independent design houses that provide a series of hardware module products and design services, including:
RF circuit, low-power RF, and ZigBee design services RF certification services and RF circuit manufacturing For help with modules, engineering services or development tools:
Search find www.ti.com/lprfnetwork Low-power RF and ZigBee module solutions and development tools Low-Power RF Developer Network suitable partner. the to a 8.7 Additional Information Texas Instruments offers a wide selection of cost-effective, low-power RF solutions for proprietary and standard-based wireless applications for use in industrial and consumer applications. The selection includes RF transceivers, RF transmitters, RF front ends, and Systems-on-Chips as well as various software solutions for the sub-1-GHz and 2.4-GHz frequency bands. In addition, Texas Instruments provides a large selection of support collateral such as development tools, technical documentation, reference designs, application expertise, customer support, third-party and university programs. The Low-Power RF E2E Online Community provides technical support forums, videos and blogs, and the chance to interact with engineers from all over the world. With a broad selection of product solutions, end-application possibilities, and a range of technical support, Texas Instruments offers the broadest low-power RF portfolio. Trademarks IAR Embedded Workbench is a registered trademark of IAR Systems AB. SmartRF, Code Composer Studio, SimpleLink, TI-RTOS, E2E are trademarks of Texas Instruments. ARM7 is a trademark of ARM Limited. ARM, Cortex are registered trademarks of ARM Limited (or its subsidiaries). ARM Thumb is a registered trademark of ARM Limited. Bluetooth is a registered trademark of Bluetooth SIG, Inc. CoreMark is a registered trademark of Embedded Microprocessor Benchmark Consortium. IEEE Std 1241 is a trademark of Institute of Electrical and Electronics Engineers, Incorporated. ZigBee is a registered trademark of ZigBee Alliance, Inc. 8.8 38 Device and Documentation Support Copyright 2016, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: CC2650MOD PRODUCT PREVIEW www.ti.com 8.9 Electrostatic Discharge Caution CC2650MOD SWRS187 AUGUST 2016 This integrated circuit can be damaged by ESD. Texas Instruments recommends that all appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. integrated circuits be handled with 8.10 Export Control Notice Recipient agrees to not knowingly export or re-export, directly or indirectly, any product or technical data
(as defined by the U.S., EU, and other Export Administration Regulations) including software, or any controlled product restricted by other applicable national regulations, received from Disclosing party under this Agreement, or any direct product of such technology, to any destination to which such export or re-
export is restricted or prohibited by U.S. or other applicable laws, without obtaining prior authorization from U.S. Department of Commerce and other competent Government authorities to the extent required by those laws. 8.11 Glossary SLYZ022 TI Glossary. This glossary lists and explains terms, acronyms and definitions. 9 Mechanical Packaging and Orderable Information 9.1 Packaging Information The following pages include mechanical packaging and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. Copyright 2016, Texas Instruments Incorporated Mechanical Packaging and Orderable Information 39 Submit Documentation Feedback Product Folder Links: CC2650MOD PRODUCT PREVIEW IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as components) are sold subject to TIs terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TIs terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TIs goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. Only those TI components which TI has specifically designated as military grade or enhanced plastic are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of non-designated products, TI will not be responsible for any failure to meet ISO/TS16949. Products Audio Amplifiers Data Converters DLP Products DSP Clocks and Timers Interface Logic Power Mgmt Microcontrollers RFID OMAP Applications Processors Wireless Connectivity www.ti.com/audio amplifier.ti.com dataconverter.ti.com www.dlp.com dsp.ti.com www.ti.com/clocks interface.ti.com logic.ti.com power.ti.com microcontroller.ti.com www.ti-rfid.com www.ti.com/omap www.ti.com/wirelessconnectivity Applications Automotive and Transportation www.ti.com/automotive Communications and Telecom www.ti.com/communications Computers and Peripherals Consumer Electronics Energy and Lighting Industrial Medical Security Space, Avionics and Defense Video and Imaging www.ti.com/computers www.ti.com/consumer-apps www.ti.com/energy www.ti.com/industrial www.ti.com/medical www.ti.com/security www.ti.com/space-avionics-defense www.ti.com/video TI E2E Community e2e.ti.com Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright 2016, Texas Instruments Incorporated
| frequency | equipment class | purpose | ||
|---|---|---|---|---|
| 1 | 2016-08-17 | 2405 ~ 2480 | DTS - Digital Transmission System | Original Equipment |
| app s | Applicant Information | |||||
|---|---|---|---|---|---|---|
| 1 | Effective |
2016-08-17
|
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| 1 | Applicant's complete, legal business name |
Texas Instruments Inc.
|
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| 1 | FCC Registration Number (FRN) |
0020623971
|
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| 1 | Physical Address |
12500 TI Boulevard
|
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| 1 |
DALLAS, Texas 75243
|
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| 1 |
United States
|
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| app s | TCB Information | |||||
| 1 | TCB Application Email Address |
c******@telefication.com
|
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| 1 | TCB Scope |
A4: UNII devices & low power transmitters using spread spectrum techniques
|
||||
| app s | FCC ID | |||||
| 1 | Grantee Code |
ZAT
|
||||
| 1 | Equipment Product Code |
26M1
|
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| app s | Person at the applicant's address to receive grant or for contact | |||||
| 1 | Name |
M******** W********
|
||||
| 1 | Title |
Tools Manager
|
||||
| 1 | Telephone Number |
+4722********
|
||||
| 1 | Fax Number |
+4722********
|
||||
| 1 |
m******@ti.com
|
|||||
| app s | Technical Contact | |||||
| 1 | Firm Name |
SGS Taiwan Ltd.
|
||||
| 1 | Name |
W******** C******
|
||||
| 1 | Physical Address |
134, Wu Kung Road, Wuku Industrial Zone
|
||||
| 1 |
Taiwan
|
|||||
| 1 | Telephone Number |
886-2********
|
||||
| 1 | Fax Number |
886-2********
|
||||
| 1 |
W******@sgs.com
|
|||||
| app s | Non Technical Contact | |||||
| 1 | Firm Name |
SGS Taiwan Ltd.
|
||||
| 1 | Name |
C******** C******
|
||||
| 1 | Physical Address |
134, Wu Kung Road, Wuku Industrial Zone
|
||||
| 1 |
Taiwan
|
|||||
| 1 | Telephone Number |
886-2********
|
||||
| 1 | Fax Number |
886-2********
|
||||
| 1 |
W******@sgs.com
|
|||||
| app s | Confidentiality (long or short term) | |||||
| 1 | Does this application include a request for confidentiality for any portion(s) of the data contained in this application pursuant to 47 CFR § 0.459 of the Commission Rules?: | No | ||||
| 1 | Long-Term Confidentiality Does this application include a request for confidentiality for any portion(s) of the data contained in this application pursuant to 47 CFR § 0.459 of the Commission Rules?: | No | ||||
| if no date is supplied, the release date will be set to 45 calendar days past the date of grant. | ||||||
| app s | Cognitive Radio & Software Defined Radio, Class, etc | |||||
| 1 | Is this application for software defined/cognitive radio authorization? | No | ||||
| 1 | Equipment Class | DTS - Digital Transmission System | ||||
| 1 | Description of product as it is marketed: (NOTE: This text will appear below the equipment class on the grant) | BLE and 802.15.4 module | ||||
| 1 | Related OET KnowledgeDataBase Inquiry: Is there a KDB inquiry associated with this application? | No | ||||
| 1 | Modular Equipment Type | Single Modular Approval | ||||
| 1 | Purpose / Application is for | Original Equipment | ||||
| 1 | Composite Equipment: Is the equipment in this application a composite device subject to an additional equipment authorization? | No | ||||
| 1 | Related Equipment: Is the equipment in this application part of a system that operates with, or is marketed with, another device that requires an equipment authorization? | No | ||||
| 1 | Grant Comments | Single Modular Approval. Power listed is conducted. This grant is valid only when the module is sold to OEM integrators and must be installed by the OEM or OEM integrators. The antenna(s) used for this transmitter must not be collocated or operating in conjunction with any other antenna or transmitter within a host device, except in accordance with FCC multi-transmitter product procedures. | ||||
| 1 | Is there an equipment authorization waiver associated with this application? | No | ||||
| 1 | If there is an equipment authorization waiver associated with this application, has the associated waiver been approved and all information uploaded? | No | ||||
| app s | Test Firm Name and Contact Information | |||||
| 1 | Firm Name |
SGS Taiwan Ltd. Electronics & Communication Lab
|
||||
| 1 | Name |
R**** W********
|
||||
| 1 | Telephone Number |
+886-******** Extension:
|
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| 1 | Fax Number |
+886-********
|
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| 1 |
r******@sgs.com
|
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| Equipment Specifications | |||||||||||||||||||||||||||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Line | Rule Parts | Grant Notes | Lower Frequency | Upper Frequency | Power Output | Tolerance | Emission Designator | Microprocessor Number | |||||||||||||||||||||||||||||||||
| 1 | 1 | 15C | 2402 | 2480 | 0.0033 | ||||||||||||||||||||||||||||||||||||
| 1 | 2 | 15C | 2405 | 2480 | 0.0032 | ||||||||||||||||||||||||||||||||||||
some individual PII (Personally Identifiable Information) available on the public forms may be redacted, original source may include additional details
This product uses the FCC Data API but is not endorsed or certified by the FCC