FCC ID: QIPPLS83-X3 Cinterion PLS83-X3

 

Cinterion PLSx3 Hardware Interface Description Version:

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01.003 PLSx3_HID_v01.003 Cinterion PLSx3 Hardware Interface Description Page 2 of 121 2 Document Name: Cinterion PLSx3 Hardware Interface Description Version:

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Status 2021-03-12 PLSx3_HID_v01.003 Public / Released GENERAL NOTE THIS DOCUMENT CONTAINS INFORMATION ON THALES DIS AIS DEUTSCHLAND GMBH

(THALES) PRODUCTS. THALES RESERVES THE RIGHT TO MAKE CHANGES TO THE PROD-

UCTS DESCRIBED HEREIN. THE SPECIFICATIONS IN THIS DOCUMENT ARE SUBJECT TO CHANGE AT THE DISCRETION OF THALES. THE PRODUCT AND THIS DOCUMENT ARE PRO-

VIDED ON AN "AS IS" BASIS ONLY AND MAY CONTAIN DEFICIENCIES OR INADEQUACIES. THALES DOES NOT ASSUME ANY LIABILITY FOR INFORMATION PROVIDED IN THE DOCUMENT OR ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT DESCRIBED HEREIN. THALES GRANTS A NON-EXCLUSIVE RIGHT TO USE THE DOCUMENT. THE RECIPIENT SHALL NOT COPY, MODIFY, DISCLOSE OR REPRODUCE THE DOCUMENT EXCEPT AS SPECIFICALLY AUTHORIZED BY THALES. Copyright 2021, THALES DIS AIS Deutschland GmbH Trademark Notice Thales, the Thales logo, are trademarks and service marks of Thales and are registered in certain coun-

tries. Microsoft and Windows are either registered trademarks or trademarks of Microsoft Corporation in the United States and/or other countries. All other registered trademarks or trademarks mentioned in this document are property of their respective owners. t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description Contents 122 Page 3 of 122 Contents 1 2 Introduction ................................................................................................................. 8 Product Variants ................................................................................................ 8 1.1 Key Features at a Glance .................................................................................. 8 1.2 1.2.1 Supported Frequency Bands .............................................................. 13 PLSx3 System Overview ................................................................................. 15 Circuit Concept ................................................................................................ 16 1.3 1.4 Interface Characteristics .......................................................................................... 17 Application Interface ........................................................................................ 17 2.1 Pad Assignment.................................................................................. 17 2.1.1 Signal Properties................................................................................. 21 2.1.2 2.1.2.1 Absolute Maximum Ratings ................................................ 26 2.1.3 USB Interface...................................................................................... 27 2.1.3.1 Reducing Power Consumption............................................ 28 Serial Interface ASC0 ......................................................................... 29 2.1.4 2.1.5 Serial Interface ASC1 ......................................................................... 30 2.1.6 UICC/SIM/USIM Interface................................................................... 31 2.1.6.1 Enhanced ESD Protection for SIM Interface ....................... 33 2.1.6.2 SIM_SWITCH Line.............................................................. 34 2.1.7 GPIO Interface .................................................................................... 35 2.1.8 Digital Audio Interface......................................................................... 35 2.1.8.1 Pulse Code Modulation Interface ........................................ 36 2.1.8.2 Inter-IC Sound Interface...................................................... 36 2.1.9 Analog-to-Digital Converter (ADC)...................................................... 37 2.1.10 Control Signals.................................................................................... 37 2.1.10.1 Status LED .......................................................................... 37 2.1.10.2 Power Indication.................................................................. 38 2.1.10.3 Fast Shutdown .................................................................... 39 2.1.10.4 Remote Wakeup.................................................................. 40 RF Antenna Interface....................................................................................... 41 2.2.1 Antenna Interface Specifications ........................................................ 42 Antenna Installation ............................................................................ 52 2.2.2 2.2.3 RF Line Routing Design...................................................................... 53 2.2.3.1 Line Arrangement Examples ............................................... 53 2.2.3.2 Routing Example................................................................. 55 GNSS Antenna Interface ................................................................................. 57 2.3.1 GNSS Antenna Diagnostic.................................................................. 58 Sample Application .......................................................................................... 59 2.2 2.3 2.4 3 Operating Characteristics ........................................................................................ 61 Operating Modes ............................................................................................. 61 3.1 Power Up/Power Down Scenarios ................................................................... 62 3.2 3.2.1 Turn on PLSx3 .................................................................................... 62 3.2.2 Restart PLSx3..................................................................................... 62 t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description Contents 122 Page 4 of 122 3.3 3.4 3.5 3.6 4 3.2.5 3.2.3 3.2.4 3.2.2.1 Restart PLSx3 Using Restart Command............................. 62 3.2.2.2 Restart PLSx3 Using EMERG_RST.................................... 63 Signal States after Startup .................................................................. 64 Turn off PLSx3 .................................................................................... 65 3.2.4.1 Switch off PLSx3 Using AT Command ................................ 65 Automatic Shutdown ........................................................................... 65 Thermal Shutdown .............................................................. 65 3.2.5.1 3.2.5.2 Undervoltage Shutdown...................................................... 67 3.2.5.3 Overvoltage Shutdown........................................................ 67 3.2.5.4 Deferred Shutdown at Extreme Temperature Condition...... 68 Power Saving................................................................................................... 68 Power Saving while Attached to GSM Networks ................................ 68 3.3.1 Power Saving while Attached to WCDMA Networks .......................... 69 3.3.2 3.3.3 Power Saving while Attached to LTE Networks .................................. 70 3.3.4 Wake-up via RTS0.............................................................................. 71 Power Supply................................................................................................... 72 Power Supply Ratings......................................................................... 73 3.4.1 3.4.2 Minimizing Power Losses ................................................................... 81 3.4.3 Monitoring Power Supply by AT Command ........................................ 81 Operating Temperatures.................................................................................. 82 Electrostatic Discharge .................................................................................... 82 Mechanical Dimensions, Mounting and Packaging............................................... 83 Mechanical Dimensions of PLSx3 ................................................................... 83 4.1 Mounting PLSx3 onto the Application Platform................................................ 87 4.2 SMT PCB Assembly ........................................................................... 87 4.2.1 Land Pattern and Stencil..................................................... 87 4.2.1.1 4.2.1.2 Board Level Characterization.............................................. 89 4.2.2 Moisture Sensitivity Level ................................................................... 89 Soldering Conditions and Temperature .............................................. 90 4.2.3 4.2.3.1 Reflow Profile ...................................................................... 90 4.2.3.2 Maximum Temperature and Duration .................................. 91 4.2.4 Durability and Mechanical Handling.................................................... 92 4.2.4.1 Storage Conditions.............................................................. 92 4.2.4.2 Processing Life.................................................................... 93 4.2.4.3 Baking ................................................................................. 93 4.2.4.4 Electrostatic Discharge ....................................................... 93 Packaging ........................................................................................................ 94 Tape and Reel .................................................................................... 94 4.3.1 4.3.1.1 Orientation........................................................................... 94 4.3.1.2 Barcode Label ..................................................................... 95 Shipping Materials .............................................................................. 96 4.3.2.1 Moisture Barrier Bag ........................................................... 96 Transportation Box .............................................................. 99 4.3.2.2 4.3.2 4.3 t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description Contents 122 Page 5 of 122 5 6 7 Regulatory and Type Approval Information ......................................................... 100 Directives and Standards............................................................................... 100 5.1 IEC 62368-1 Classification................................................................ 102 5.1.1 SAR requirements specific to portable mobiles ............................................. 104 Reference Equipment for Type Approval ....................................................... 105 Compliance with FCC and ISED Rules and Regulations............................... 106 Compliance with Japanese Rules and Regulations ....................................... 109 5.2 5.3 5.4 5.5 Document Information............................................................................................ 110 Revision History ............................................................................................. 110 6.1 Related Documents ....................................................................................... 112 6.2 Related Documents ....................................................................................... 112 6.3 Terms and Abbreviations ............................................................................... 112 6.4 Safety Precaution Notes ................................................................................ 116 6.5 Appendix.................................................................................................................. 117 List of Parts and Accessories......................................................................... 117 7.1 Module Label Information .............................................................................. 120 7.2 t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description Tables Page 6 of 122 Tables Table 1:

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Supported frequency bands for each PLSx3 variant...................................... 13 Overview: Pad assignments........................................................................... 18 Signal properties ............................................................................................ 21 Absolute maximum ratings............................................................................. 26 Signals of the SIM interface (SMT application interface) ............................... 31 GPIO lines and possible alternative assignment............................................ 35 Overview of PCM pin functions ...................................................................... 36 Overview of I2S pin functions ......................................................................... 37 Remote wakeup lines..................................................................................... 40 Return loss in the active band........................................................................ 41 RF Antenna interface GSM/UMTS/LTE ......................................................... 42 RF Antenna interface LTE for -J variant (at operating temperature range).... 51 Sample ranges of the GNSS antenna diagnostic measurements and their possible meaning ........................................................................................... 58 Overview of operating modes ........................................................................ 61 Pull-up and Pull-down Values ........................................................................ 64 Temperature associated URCs...................................................................... 66 Supply Ratings ............................................................................................... 73 Current Consumption Ratings -GSM ............................................................. 74 Current Consumption Ratings - UMTS .......................................................... 78 Current Consumption Ratings - LTE .............................................................. 80 Board Temperature ........................................................................................ 82 Electrostatic values ........................................................................................ 82 Reflow temperature ratings ............................................................................ 90 Storage conditions ......................................................................................... 92 VP Box label information................................................................................ 99 Directives ..................................................................................................... 100 Standards of North American type approval ................................................ 100 Standards of European type approval.......................................................... 101 Requirements of quality ............................................................................... 101 Standards of the Ministry of Information Industry of the Peoples Republic of China .......................................................................... 101 Toxic or hazardous substances or elements with defined concentration limits ............................................................................................................. 102 IEC 62368-1 Classification........................................................................... 103 Antenna gain limits for FCC and ISED (for W and EP variants) .................. 107 Antenna gain limits for FCC and ISED (for X, X2, X3, X4 variants) ............. 107 List of parts and accessories........................................................................ 118 Molex sales contacts (subject to change) .................................................... 120 PLSx3 label information ............................................................................... 121 Date code table ............................................................................................ 121 t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description Figures Page 7 of 122 Figures Figure 1:

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PLSx3 system overview ................................................................................. 15 PLSx3 block diagram ..................................................................................... 16 PLSx3 bottom view: Pad assignments........................................................... 19 PLSx3 top view: Pad assignments................................................................. 20 USB circuit ..................................................................................................... 27 Serial interface ASC0..................................................................................... 29 Serial interface ASC1..................................................................................... 30 Modules two UICC/SIM/USIM interfaces ...................................................... 32 UICC/SIM/USIM interfaces connected........................................................... 32 SIM interface - enhanced ESD protection...................................................... 33 External UICC/SIM/USIM switch.................................................................... 34 Sample circuit for SIM interface connection via SIM switch........................... 34 Status signaling with LED driver .................................................................... 37 Power indication signal .................................................................................. 38 Fast shutdown timing ..................................................................................... 39 Antenna pads (bottom view) .......................................................................... 52 Embedded stripline arrangement example .................................................... 53 Micro-Stripline arrangement example ............................................................ 54 Routing to applications RF connector ........................................................... 55 Routing Detail................................................................................................. 56 Supply voltage for active GNSS antenna....................................................... 57 ESD protection for passive GNSS antenna ................................................... 58 Schematic diagram of PLSx3 sample application .......................................... 60 IGT timing....................................................................................................... 62 Power saving and paging in GSM networks .................................................. 69 Power saving and paging in WCDMA networks............................................. 69 Power saving and paging in LTE networks .................................................... 70 Wake-up via RTS0 ......................................................................................... 71 Decoupling capacitor(s) for BATT+................................................................ 72 Power supply limits during transmit burst....................................................... 81 PLSx3 top and bottom view ......................................................................... 84 Dimensions of PLSx3 (all dimensions in mm)................................................ 85 Dimensions of PLSx3 (keepout area recommended) .................................... 86 Land pattern (top view) .................................................................................. 87 Recommended design for 110 micron thick stencil (top view) ....................... 88 Recommended design for 150 micron thick stencil (top view) ....................... 88 Reflow Profile ................................................................................................ 90 Carrier tape .................................................................................................... 94 Reel direction ................................................................................................. 94 Barcode label on tape reel ............................................................................. 95 Barcode label on tape reel - layout ................................................................ 95 Moisture barrier bag (MBB) with imprint......................................................... 96 Moisture Sensitivity Label .............................................................................. 97 Humidity Indicator Card - HIC ........................................................................ 98 Sample of VP box label.................................................................................. 99 Reference equipment for Type Approval ..................................................... 105 JATE/TELEC mark for -J.............................................................................. 109 JATE/TELEC mark for -W ............................................................................ 109 PLSx3 Label................................................................................................. 120 t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 1 Introduction 16 Page 8 of 122 1 Introduction This document1 describes the hardware of the Cinterion PLSx3 module. It helps you quickly retrieve interface specifications, electrical and mechanical details and information on the re-

quirements to be considered for integrating further components. Note: This Hardware Interface Description is a preliminary version and as such subject to change depending on further implementation and measurements. 1.1 Product Variants This document applies to the following Thales module variants:

Cinterion PLS63-W Module Cinterion PLS63-EP Module Cinterion PLS63-LA Module Cinterion PLS63-J Module CinterionPLS63-X Module CinterionPLS63-X2 Module CinterionPLS63-X3 Module CinterionPLS63-X4 Module CinterionPLS63-I Module Cinterion Cinterion Cinterion Cinterion Cinterion Cinterion Cinterion Cinterion Cinterion PLS83-W Module PLS83-EP Module PLS83-LA Module PLS83-J Module PLS83-X Module PLS83-X2 Module PLS83-X3 Module PLS83-X4 Module PLS83-I Module Note: The PLSx3 variants differ in the fact that PLS63 supports UE CAT 1 (DL 10Mbps, UL 5Mbps) whereas PLS83 supports UE CAT 4(DL 150Mbps, UL 50Mbps). Wherever necessary a note is made to differentiate between the product variants. 1.2 Key Features at a Glance Feature General Frequency bands Implementation PLSx3 integrates all the bands required to have a global coverage across the world (NORAM / LATAM / EMEA /APAC). Please refer to Section 1.2.1 for an overview of the frequency bands supported by each PLSx3 product variant. 1. The document is effective only if listed in the appropriate Release Notes as part of the technical docu-

mentation delivered with your Thales product. t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 1.2 Key Features at a Glance 16 Page 9 of 122 Feature GSM class Implementation Small MS Output power (according to release 99) Output power (according to Release 99) Output power (according to Release 8) Class 4 (+33dBm 2dB) for GSM850 Class 4 (+33dBm 2dB) for GSM900 Class 1 (+30dBm 2dB) for GSM1800 Class 1 (+30dBm 2dB) for GSM1900 Class E2 (+27dBm 3dB) for GSM 850 8-PSK Class E2 (+27dBm 3dB) for GSM 900 8-PSK Class E2 (+26dBm +3 /-4dB) for GSM 1800 8-PSK Class E2 (+26dBm +3 /-4dB) for GSM 1900 8-PSK Class 3 (+24dBm +1/-3dB) for UMTS 850, WCDMA FDD BdXIX Class 3 (+24dBm +1/-3dB) for UMTS 850, WCDMA FDD BdVI Class 3 (+24dBm +1/-3dB) for UMTS 850, WCDMA FDD BdV Class 3 (+24dBm +1/-3dB) for UMTS 900, WCDMA FDD BdVIII Class 3 (+24dBm +1/-3dB) for UMTS 1700, WCDMA FDD BdIII Class 3 (+24dBm +1/-3dB) for UMTS 1900, WCDMA FDD BdII Class 3 (+24dBm +1/-3dB) for UMTS 2100, WCDMA FDD BdIV Class 3 (+24dBm +1/-3dB) for UMTS 2100, WCDMA FDD BdI Class 3 (+23dBm 2dB) for LTE 600, LTE FDD Bd71 Class 3 (+23dBm 2dB) for LTE 700, LTE FDD Bd12 <MFBI Bd17>

Class 3 (+23dBm 2dB) for LTE 700, LTE FDD Bd13 Class 3 (+23dBm 2dB) for LTE 700, LTE FDD Bd14 Class 3 (+23dBm+2/-2.5dB) for LTE 700, LTE FDD Bd28 Class 3 (+23dBm 2dB) for LTE 850, LTE FDD Bd26 Class 3 (+23dBm 2dB) for LTE 850, LTE FDD Bd18 Class 3 (+23dBm 2dB) for LTE 850, LTE FDD Bd19 Class 3 (+23dBm 2dB) for LTE 800, LTE FDD Bd20 Class 3 (+23dBm 2dB) for LTE 850, LTE FDD Bd5 Class 3 (+23dBm 2dB) for LTE 900, LTE FDD Bd8 Class 3 (+23dBm 2dB) for LTE 1800, LTE FDD Bd3 Class 3 (+23dBm 2dB) for LTE 1900, LTE FDD Bd2 Class 3 (+23dBm 2dB) for LTE 1900, LTE FDD Bd25 Class 3 (+23dBm 2dB) for LTE 2100, LTE FDD Bd1 Class 3 (+23dBm 2dB) for LTE 2100, LTE FDD Bd4 Class 3 (+23dBm 2dB) for LTE 2100, LTE FDD Bd66 Class 3 (+23dBm 2dB) for LTE 2600, LTE FDD Bd7 Class 3 (+23dBm 2dB) for LTE 2300, LTE TDD Bd40 Class 3 (+23dBm 2dB) for LTE 2500, LTE TDD Bd41 Class 3 (+23dBm 2dB) for LTE 2600, LTE TDD Bd38 Power supply

(see Section 2.1.2, and Section 3.4) Normal operation:

3.0V < VBATT+ < 4.5V Typ value is 3.8V Operating temperature

(board temperature)

(see Section 3.5) Normal operation: -30C to +85C Extended operation: -40C to -30C, +85C to +95C;

Dimensions: 33mm x 29mm x 2.5mm Weight: approx. 4.8g All hardware components fully compliant with EU RoHS Directive UE CAT 1 for PLS63 (DL 10Mbps, UL 5Mbps) UE CAT 4 for PLS83 (DL 150Mbps, UL 50Mbps) Physical

(see Section 4.1) RoHS

(see Section 5.1) LTE features 3GPP Release 10 HSPA feature t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 1.2 Key Features at a Glance 16 Page 10 of 122 Feature Implementation 3GPP Release 7 UE CAT. 8, 6 for PLS63 HSDPA DL 7.2Mbps HSUPA UL 5.7Mbps UE CAT. 14, 6 for PLS83 HSPA+ DL 21Mbps HSUPA UL 5.7Mbps UMTS features 3GPP Release 4 GSM/GPRS/EGPRS features Data transfer Compressed mode (CM) supported according to 3GPP TS25.212 PS data rate 384 kbps DL / 384 kbps UL CS data rate 64 kbps DL / 64 kbps UL EDGE E2 power class for 8 PSK GPRS:

Multislot Class 12 Mobile Station Class B Coding Scheme 1 4 EGPRS:

Multislot Class 12 Downlink coding schemes CS 1-4, MCS 1-9 Uplink coding schemes CS 1-4, MCS 1-9 SRB loopback and test mode B 8-bit, 11-bit RACH 1 phase/2 phase access procedures Link adaptation and IR NACC, extended UL TBF Mobile Station Class B SMS Point-to-point MT and MO Cell broadcast Text and PDU mode Storage: SIM card plus SMS locations in mobile equipment GNSS Features Protocol NMEA Modes

(see Section 2.3) General Software Standalone GNSS (GPS, GLONASS, Beidou, Galileo) Automatic power saving modes. DC feed bridge and control of power supply for active antenna AT commands Hayes 3GPP TS 27.007, TS 27.005, Thales SIM Application Toolkit Default (Network) bearer support for BIP Firmware update Generic update from host application over USB modem t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 1.2 Key Features at a Glance 16 Page 11 of 122 Feature Interfaces Module interface Implementation USB

(see Section 2.1.3) USB 2.0 High Speed (480Mbit/s) device interface. Full Speed (12Mbit/s) compliant. Surface mount device with solderable connection pads (SMT application interface). Land grid array (LGA) technology ensures high solder joint reli-

ability and allows the use of an optional module mounting socket. For more information on how to integrate SMT modules see also [4].This application note comprises chapters on module mounting and application layout issues as well as on additional SMT application development equip-

ment. ASC0 (in parts shared with GPIO lines):

8-wire modem interface with status and control lines, unbalanced, asyn-

chronous Fixed baud rates: 300bps to 921,600bps Supports RTS0/CTS0 hardware flow control. ASC1 (shared with GPIO lines):

4-wire, unbalanced asynchronous interface Fixed baud rates: 300bps to 921,600bps and 3Mbps Supports RTS1/CTS1 hardware flow control Supported chip cards: UICC/SIM/USIM 3V, 1.8V 22 GPIO lines comprising:

13 lines shared with ASC0, ASC1 lines, with network status indication, fast shutdown and SIM switch 9 GPIO lines not shared Supports I2C serial interface. 1 digital interface can be configured as PCM or I2S. RING0 Support RING0 to wake up host from power saving state. Antenna interface pads

(see Section 2.1) 50. UMTS/GSM/LTE main antenna, UMTS/LTE Rx Diversity antenna, GNSS antenna. ADC inputs

(see Section 2.1.9) Analog-to-Digital Converter with unbalanced analog inputs, for example, for the (external) antenna diagnosis Switch on by hardware signal IGT Switch off by AT command Switch off by hardware signal FST_SHDN instead of AT command Automatic switch off in case of critical temperature or voltage conditions Orderly reset by AT command Reset by emergency reset signal EMERG_RST. Real time clock Timer functions via AT commands. LGA DevKit designed to test Thales LGA modules. t PLSx3_HID_v01.003 2021-03-12 Public / Released 2 serial interfaces

(see Section 2.1.4, and Section 2.1.5) 2 UICC interfaces

(switchable)

(see Section 2.1.6) GPIO interface

(see Section 2.1.7) I2C interface Digital audio interface

(see Section 2.1.8) Power on/off, Reset Power on/off Reset Special features Evaluation kit LGA DevKit Cinterion PLSx3 Hardware Interface Description 1.2 Key Features at a Glance 16 Page 12 of 122 Feature Implementation Evaluation module PLSx3 module soldered onto a dedicated PCB that can be connected to an adapter in order to be mounted onto the DSB75 or DSB mini. DSB-mini DSB75 DSB-mini Development Support Board designed to test and type approve. It is the cost optimized development board alternative to DSB75. DSB75 Development Support Board designed to test and type approve Thales modules and provide a sample configuration for application engi-

neering. A special adapter is required to connect the PLSx3 evaluation module to the DSB75. t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 1.2 Key Features at a Glance 16 1.2.1 Supported Frequency Bands Page 13 of 122 The following table lists the supported frequency bands for each of the PLSx3 product variants mentioned in Section 1.1. Table 1: Supported frequency bands for each PLSx3 variant Band PLSx3-W PLSx3-X PLSx3-EP PLSx3-LA PLSx3-J PLSx3-X2 PLSx3-X3 PLSx3-X4 PLSx3-I GSM/GPRS/EDGE 850MHz 900MHz 1800MHz 1900MHz WCDMA Bd.1 (2100MHz) Bd.2 (1900MHz) Bd.3 (1800MHz) Bd.4 (2100MHz) Bd.5 (850MHz) Bd.6 (850MHz) Bd.8 (900MHz) Bd.19 (850MHz) LTE-FDD Bd.1 (2100MHz) Bd.2 (1900MHz) Bd.3 (1800MHz) Bd.4 (2100MHz) Bd.5 (850MHz) t x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x PLSx3_HID_v01.003 Public / Released x x x x x x x x x x x x x Cinterion PLSx3 Hardware Interface Description 1.2 Key Features at a Glance 16 Table 1: Supported frequency bands for each PLSx3 variant Page 14 of 122 Band PLSx3-W PLSx3-X PLSx3-EP PLSx3-LA PLSx3-J PLSx3-X2 PLSx3-X3 PLSx3-X4 PLSx3-I Bd.7 (2600MHz) Bd.8 (900MHz) Bd.12 (700MHz) Bd.13 (700MHz)1 Bd.14(700MHz) Bd.17 (700 MHz) Bd.18 (850MHz) Bd.19 (850MHz) Bd.20 (800MHz) Bd.25(1900MHz) Bd.26 (850MHz) Bd.28 (700MHz) Bd.66(2100MHz) Bd.71(600MHz) LTE-TDD Bd.38 (2600MHz) Bd.40 (2300MHz) Bd.41 (2500MHz) x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x 1. For -W variant module, a sensitivity issue will occur in GNSS when transmitting in band 13, to avoid this issue, it is suggested to use -X variant module. t PLSx3_HID_v01.003 Public / Released Cinterion PLSx3 Hardware Interface Description 1.3 PLSx3 System Overview 16 1.3 PLSx3 System Overview Page 15 of 122 Application Module GPIO Digital Audio STATUS SIM_SWITCH FST_SHDN ASC1/GPIO ASC0/GPIO PWR_IND ASC0/GPIO I2C USB ADC SIM1 interface(with SIM card detection) SIM2 interface(with SIM card detection) CONTROL Power Supply RF_Main_Path Diversity_RX GNSS_Path 2 9 1 1 1 4 4 1 4 2 3 3 3 1 5 1 5 1 1 1 1 1 1 1 1 GPIO PCM(I2S)/GPIO STATUS/GPIO SIM_SWITCH/GPIO Fast Shutdown/GPIO Serial Interface/GPIO Serial Interface/GPIO Power Indicator Serial Interface 0 I2C USB ADC SIM1 Card SIM2 Card IGT EMERG_RST VGNSS Base Band Power RF Power Main Antenna Diversity Antenna GNSS Antenna Digital Audio PCM(I2S) Interface&MCLK 1 GNSS_DC Figure 1: PLSx3 system overview t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 1.4 Circuit Concept 16 Page 16 of 122 1.4 Circuit Concept Figure 2 shows block diagrams of the PLSx3 module and illustrate the major functional com-

ponents:

BATT+BB EMERG_RST IGT ADC_IN XTAL STATUS MCLK SIM_SWITCH FAST_SHDN USB ASC0 ASC1 GPIO PWR_IND I2C I2S/PCM UIM1 UIM2 PMU VGNSS V180 C o n tro l P o w e r Power BUS Control Memory SOC ANT RF Figure 2: PLSx3 block diagram t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 2 Interface Characteristics 60 2 Interface Characteristics Page 17 of 121 PLSx3 is equipped with an SMT application interface that connects to the external application. The SMT application interface incorporates the various application interfaces as well as the RF antenna interface. 2.1 Application Interface 2.1.1 Pad Assignment The SMT application interface on the PLSx3 provides land grid array pads to integrate the mod-

ule into external applications. Table 2 lists the pad assignment. Figure 3 shows the pin mapping on the LGA footprint. Please note that a number of connecting pads are marked as reserved for future use (rfu) and further qualified as either (dnu), (GND) or (nc):

Pads marked "rfu" and qualified as "dnu" (do not use) shall be soldered but electrically not connected. Pads marked "rfu" and qualified as "nc" (not connected) are internally not connected with PLSx3 modules, but shall be soldered. Thales strongly recommends to solder all connecting pads for mechanical stability and heat dissipation. t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 2.1 Application Interface 60 Page 18 of 121 ANT_DRX Signal Name Table 2: Overview: Pad assignments Pad No. rfu (nc) A4 GND A5 A6 GND A7 GND GND A8 A9 GND A10 GND A11 GND A12 A13 GND rfu (nc) B3 B4 GND B5 GND GND B6 B7 GND B8 GND GND B9 B10 GND B11 GND B12 GND B13 GND B14 GPIO5/STATUS C2 GND GND C3 C4 GND C5 GND GND C6 C7 GND GND C8 C9 GND C10 GND C11 GND C12 C13 C14 C15 GND GND D1 GND D2 GND D3 GND D4 ANT_GNSS_DC D5 GND D6 GND D7 GND D8 D9 GND D10 GND D11 GND D12 D13 D14 D15 D16 E1 CCIN2 rfu (nc) CCCLK2 rfu (dnu) rfu (dnu) ANT_GNSS rfu (nc) rfu (dnu) rfu (dnu) Signal Name GND GND GND GND GND GND GND GND rfu (dnu) Pad No. E2 E3 E4 E5 E12 CCIO2 E13 CCRST2 rfu (nc) E14 rfu (dnu) E15 rfu (dnu) E16 GND F1 GND F2 GND F3 F4 GND F13 GND I2CCLK F14 I2CDAT F15 F16 GPIO25 G1 G2 G3 G4 G13 G14 GPIO7 G15 GPIO8 G16 GPIO11 H1 H2 H3 H4 H13 H14 GPIO4/FST_SHDN H15 GPIO12 H16 GPIO6 GND J1 GND J2 GND J3 J4 GND J13 GND J14 GPIO15 J15 GPIO14 J16 GPIO13 K1 K2 K3 K4 K5 K12 K13 K14 CCIO1 K15 CCVCC1 K16 L1 ANT_MAIN GND GND GND GND rfu (nc) rfu (dnu) GND GND GND GND rfu (dnu) VGNSS GND Pad No. L2 L3 L4 L5 L6 L7 L8 L9 L10 L11 L12 L13 L14 L15 L16 M2 M3 M4 M5 M6 M7 M8 M9 M10 M11 M12 M13 M14 M15 N3 N4 N5 N6 N7 N8 N9 N10 N11 N12 N13 N14 P4 P5 P6 P7 P8 P9 P10 P11 P12 P13 Signal Name GND GND GND rfu (nc) CCVCC2 MCLK rfu (nc) rfu (nc) rfu (nc) SIM_SWITCH/GPIO26 rfu (nc) rfu (dnu) CCRST1 CCCLK1 IGT GND GND PWR_IND V180 GND GPIO21/DIN BCLK FSC GPIO20/DOUT ADC3_IN ADC2_IN ADC1_IN CCIN1 rfu (nc) BATT+RF BATT+RF VUSB_IN GPIO19/CTS1 GPIO18/RTS1 CTS0 DCD0/GPIO2 RTS0 GND rfu (dnu) BATT+BB EMERG_RST USB_DP USB_DN GPIO16/RXD1 GPIO17/TXD1 DTR0/GPIO1 DSR0/GPIO3 RING0/GPIO24 RXD0 TXD0 BATT+BB t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 2.1 Application Interface 60 Page 19 of 121 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 USB_DP USB_DN GPIO16

/RXD1 GPIO17

/TXD1 DTR0

/GPIO1 DSR0

/GIPO3 RXD0 TXD0 BATT+BB RING0

GPIO24 BATT+RF BATT+RF VUSB_ IN GPIO19

/CTS1 GPIO18

/RTS1 CTS0 DCD0

/GPIO2 RTS0 GND rfu

(dnu) BATT+BB EMERG_ RST GND GND PWR_IND V180 GND BCLK FSC GPIO21

/DIN GPIO20

/DOUT ADC3_ IN ADC2_ IN ADC1_ IN CCIN1 rfu

(nc) GND GND GND GND rfu (nc) CCVC C2 MCLK rfu

(nc) rfu

(nc) rfu

(nc) K ANT_ MAIN GND GND GND GND SIM_ SWITCH

/GPIO26 rfu

(nc) rfu

(nc) rfu

(dnu) rfu

(dnu) CCRST1 CCCLK1 IGT CCIO1 CCVCC1 VGNSS GND GND GND GND GND GPIO15 GPIO14 GPIO13 GND GND GND GND GPIO12 GPIO6 GND GND GND GND GPIO7 GPIO8 GPIO11 GND GND GND GND GND I2CCLK I2CDAT GPIO25 E ANT_ GNSS GND GND GND GND rfu: Reserved for future use (should not be connected to external application)

(nc): Internally not connected (may be ar-

bitrarily connected to external GND)

(dnu): Do not use GPIO4

FST_SH DN rfu

(dnu) rfu

(dnu) CCIO2 CCRST2 rfu

(nc) rfu

(nc) rfu

(nc) rfu

(dnu) rfu

(dnu) GPIO5

/STATUS rfu

(dnu) rfu

(dnu) rfu

(dnu) rfu

(dnu) GND rfu

(nc) GND GND GND GND GND GND GND GND GND GND rfu

(nc) GND GND GND GND GND GND GND GND ANT_ DRX P N M L J H G F D C B A GND GND GND GND GND GND GND GND GND GND CCIN2 CCCLK2 ANT_GN SS_DC GND GND GND GND GND GND GND GND GND GND For internal use:

Not to be soldered Figure 3: PLSx3 bottom view: Pad assignments PLSx3_HID_v01.003 Public / Released 2021-03-12 Position marker t Cinterion PLSx3 Hardware Interface Description 2.1 Application Interface 60 Page 20 of 121 P N M L K J H G F E D C A For internal B use: Not to be soldered t 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 BATT+BB TXD0 RXD0 GPIO17

/TXD1 GPIO16

/RXD1 USB_DN USB_DP RING0

GPIO24 DSR0

/GPIO3 DCD0

/GPIO2 DTR0

/GPIO1 CTS0 EMERG_ RST BATT+BB rfu

(dnu) GND RTS0 GPIO18

/RTS1 GPIO19

/CTS1 VUSB_ IN BATT+RF BATT+RF rfu

(nc) CCIN1 ADC1_ IN ADC2_ IN ADC3_ IN GPIO20/

DOUT GPIO21

/DIN FSC BCLK GND V180 PWR_IND GND GND IGT CCCLK1 CCRST1 rfu

(dnu) rfu

(nc) SIM_SWITC H//GPIO26 rfu

(nc) rfu

(nc) rfu

(nc) MCLK CCVC C2 rfu

(nc) GND GND GND GND VNGSS CCVCC1 CCIO1 rfu

(dnu) rfu

(nc) GND GND GND GND ANT_ MAIN GPIO13 GPIO14 GPIO15 GND GND GND GND GND GPIO6 GPIO12 GPIO4/

FST_SHD N GPIO11 GPIO8 GPIO7 rfu

(dun) rfu

(dnu) GPIO25 I2CDAT I2CCLK GND GND GND GND GND GND GND GND GND GND GND GND GND rfu

(dnu) rfu

(dnu) rfu

(nc) CCRST2 CCIO2 GND GND GND GND ANT_ GNSS rfu

(dnu) rfu

(dnu) rfu

(nc) CCCLK2 CCIN2 GND GND GND GND GND GND GND GND GND GND ANT_GN SS_DC rfu: Reserved for future use (should not be connected to external application)

(nc): Internally not connected (may be ar-

bitrarily connected to external GND)

(dnu): Do not use GND rfu

(dnu) rfu

(dnu) rfu

(nc) GND GND GND GND GND GND GND GND GND GND Position marker GPIO5/

STATUS GND GND GND GND GND GND GND GND GND GND GND ANT_ DRX GND GND GND GND GND GND GND rfu

(nc) rfu

(nc) Figure 3: PLSx3 top view: Pad assignments PLSx3_HID_v01.003 Public / Released 2021-03-12 Cinterion PLSx3 Hardware Interface Description 2.1 Application Interface 60 Page 21 of 121 Function Signal name IO Signal form and level Comment 2.1.2 Signal Properties Table 3: Signal properties (Sheet 1 of 5) Power supply BATT+BB BATT+RF I GSM activated:

VImax = 4.5V VInorm = 3.8V VImin = 3.0V Imax= see Table 18 ___||____________||___ n Tx = n x 577s peak current every 4.616ms WCDMA activated:

VImax = 4.5V VInorm = 3.8V VImin = 3.0V during Transmit active. Imax = see Table 19 LTE activated:

VImax = 4.5V VInorm = 3.8V VImin = 3.0V during Transmit active. Imax = see Table 20 V180 O Normal operation:

External supply voltage VOnorm = 1.80V 2%

IOmax = 10mA SLEEP mode Operation:

VOSleep = 1.80V 4%

IOmax = 10mA CImax = 100nF VGNSS O CLmax=2.2 VO=3V2%@IO =-10mA IOmax = 10mA VImax_6V The input current has to be limited to 50mA(antenna short circuit protection) ANT_GNS-

S_DC I Supply volt-

age for active GNSS antenna Lines of BATT+ and GND must be connected in par-

allel for supply purposes because higher peak cur-

rents may occur. Minimum voltage must not fall below 3.0V including drop, ripple, spikes and not rise above 4.5V. BATT+BB and BATT+RF require an ultra low ESR capacitor respectively of 150F. If using Multilayer Ceramic Chip Capacitors

(MLCC) please take DC-

bias into account. Note that minimum ESR value is advised at <70m. Note: The modules nor-

mal voltage range for oper-

ation lies between 3.0V and 4.5V. For USB opera-

tion, 3.0V-4.5V is also rec-

ommended. V180 should be used to supply level shifters at the interfaces. Note: V180 is not back powering protected. Wrong usage may back power the module which is forbidden. If unused keep line open. Test point recommended. Available when GNSS antenna DC power is enabled. If unused connect to GND t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 2.1 Application Interface 60 Page 22 of 121 Table 3: Signal properties (Sheet 2 of 5) Ignition IGT I Function Signal name IO Signal form and level Comment Do not add any voltage on it. There is a built-in pull up resister, you can test about 0.8V voltage on it.

|___| low impulse width > 300ms This signal switches the module on. The IGT signal characteristic is:

Power on triggered and low level triggered. Fall time should be <1ms. Note: To turn on the mod-

ule please use an open-

drain/collector circuit. Test point recommended. If unused keep line open. This line must be driven low by an open drain or open collector driver con-

nected to GND. If unused keep line open. Test point recommended. This line must be driven low. If unused keep line open. Note that the fast shut-

down line is originally available as GPIO line. If configured as fast shut-

down, the GPIO line is assigned as follows:

GPIO4 --> FST_SHDN All electrical characteris-

tics according to USB Implementers' Forum, USB 2.0 Specification. If unused keep lines open. Test points recommended. Status signaling STATUS Emer-

gency reset EMERG_RST I O VOImax = 0.45V at I = 1mA VOHmin = 1.35V at I = 1mA VOHmax = 1.8V Do not add any voltage on it. There is a built-in pull up resistor to pull to GND when Reset.

|___| low impulse width > 200ms Fast shut-

down FST_SHDN I VILmax = 0.63V VIHmin = 1.17V VIHmax = 1.8V

|___| low impulse width > 1ms USB VUSB_IN I VINmin = 3V VINmax = 5.25V Active and suspend current:

Imax<100A USB_DN I/O Full and high speed signal characteris-

USB_DP tics according to USB 2.0 Specifica-

tion. t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 2.1 Application Interface 60 Page 23 of 121 Table 3: Signal properties (Sheet 3 of 5) Function Signal name IO Signal form and level Comment Serial Interface ASC0 O VOLmax = 0.45V VOHmin = 1.35V If unused keep lines open. Test points recommended for RXD0, TXD0, RTS0, and CTS0. RXD0 CTS0 DSR0 DCD0 RING0 TXD0 RTS0 DTR0 RXD1 CTS1 TXD1 RTS1 CCIN Serial Inter-

face ASC1 SIM card detection I I I I I I VILmax = 0.63V VIHmin = 1.17V VILmax = 0.63V VIHmin = 1.17V VILmax = 0.63V VIHmin = 1.17V O VOLmax = 0.45V VOHmin = 1.35V O VILmax = 0.63V VIHmin = 1.17V VILmax = 0.63V VIHmin = 1.17V VIHmin = 1.17V VIHmax = 1.97V VILmax = 0.63V 3V SIM Card Inter-

face CCRST1 CCRST2 O VOLmax = 0.4V VOHmin = 2.2V VOHmax = 3.04V CCIO1 CCIO2 CCCLK1 CCCLK2 CCVCC1 CCVCC2 I/O VILmax = 0.55V VIHmin = 2.128V VIHmax = 3.05V VOLmax = 0.4V VOHmin = 2.2V VOHmax = 3.04V O VOLmax = 0.4V VOHmin = 2.2V VOHmax = 3.04V O VOmin = 2.75V VOtyp = 2.85V VOmax = 3.04V IOmax = -30mA If unused keep lines open Test points recommended for RXD1, TXD1, RTS1, and CTS1. CCIN = low, SIM card inserted. CCIN= high, SIM card removed. If unused keep line open. Maximum cable length or copper track to SIM card holder should not exceed 100mm. CCIO2 should add 10k pull-up to CCVCC2 t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 2.1 Application Interface 60 Page 24 of 121 Table 3: Signal properties (Sheet 4 of 5) Function Signal name IO Signal form and level Comment 1.8V SIM Card Inter-

face CCRST1 CCRST2 O VOLmax = 0.4V VOHmin = 1.36V VOHmax = 1.93V Maximum cable length or copper track to SIM card holder should not exceed 100mm. CCIO2 should add 10k pull-up to CCVCC2 CCIO1 CCIO2 CCCLK1 CCCLK2 CCVCC1 CCVCC2 I/O VILmax = 0.334V VIHmin = 1.351V VIHmax = 1.97V VOLmax = 0.4V VOHmin = 1.336V VOHmax = 1.93V O VOLmax = 0.4V VOHmin = 1.336V VOHmax = 1.93V O VOmin = 1.67V VOtyp = 1.80V VOmax = 1.93V IOmax = -30mA GPIO interface GPIO1-

GPIO8, GPIO11-

GPIO21 GPIO24-

GPIO26 IO VILmax = 0.334V VIHmin = 1.351V VIHmax = 1.97V VOLmax = 0.4V VOHmin = 1.336V VOHmax = 1.93V Digital Audio Interface BCLK DIN DOUT FSC O I O O VOLmax = 0.45V VOHmin = 1.35V VOHmax = 1.8V VILmax = 0.63V VIHmin = 1.17V VIHmax = 1.8V MCLK O Freq=12.288MHz I2C I2CCLK I2CDAT O Internal no pull up Resistors Open Drain Output. IO VOLmax = 0.36V@2mA VILmax = 0.54V VIHmin = 1.26V External pull-up resistors is required. The maximum load is 680Ohm. If lines are unused keep lines open. If unused keep line open. Please note that most GPIO lines can be config-

ured by AT command for alternative functions or are by default configured with an alternative functionality:

GPIO4: Fast Shut Down

(Input) GPIO5: LED status GPIO26: SIM switch If unused keep line open. t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 2.1 Application Interface 60 Page 25 of 121 Table 3: Signal properties (Sheet 5 of 5) Function Signal name IO Signal form and level Comment ADC_IN

(Analog-to-

Digital Con-

verter) ADC1 ADC2 ADC3 I RI = 10Mohm VI = 0.1V ... 1.7V (valid range) VIH max = 1.7V If unused keep line open. GPO Inter-

face ANT_SW O VOLmax = 0.4 If unused keep line open. SIM Switch SIM_SWITCH O VOLmax = 0.4V If unused keep line open. Resolution 15 Bits Offset error 1%

VOHmin = 1.336V VOHmax = 1.93V VOHmin = 1.336V VOHmax = 1.93V Power indicator PWR_IND O VIHmax = 5.5V VOLmax = 0.4V at Imax = 2mA PWR_IND (Power Indica-

tor) notifies the modules on/off state (see Section 2.1.10). PWR_IND is an open col-

lector that needs to be connected to an external pullup resistor. Low state of the open collector indi-

cates that the module is on. Vice versa, high level notifies the power-down mode. Therefore, the sig-

nal may be used to enable external voltage regulators which supply an external logic for communication with the module, e.g. level converters. Do not connect to V180. t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 2.1 Application Interface 60 2.1.2.1 Absolute Maximum Ratings Page 26 of 121 The absolute maximum ratings stated in Table 4 are stress ratings under any conditions. Stresses beyond any of these limits will cause permanent damage to PLSx3. Voltage at digital pins 1.8V domain in normal operation V180 + 0.2 V Table 4: Absolute maximum ratings Parameter Supply voltage BATT+ (no service) Voltage at all digital pins in POWER DOWN mode Voltage at SIM interface, CCVCC 1.8V in normal Operation Voltage at SIM interface, CCVCC 2.85V in normal Operation Current at SIM interface in 1.8V and 2.85V operation Voltage at ADC pin in normal operation V180 in normal operation USB-Pins Min

-0.3

-0.3

-0.2 0 0 0.1

+1.7

-0.3 Max

+5.5

+0.3

+2.16

+3.25

-145

+1.7*

+1.9 3.63 Unit V V V V V V V mA t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 2.1 Application Interface 60 Page 27 of 121 2.1.3 USB Interface PLSx3 supports a USB 2.0 High Speed (480Mbit/s) device interface that is Full Speed (12Mbit/

s) compliant. The impedances, serial and pull up resistors are implemented according to Uni-

versal Serial Bus Specification Revision 2.01, No further additional components are required. The external application is responsible for supplying the VUSB_IN line. This line is used for ca-

ble detection only. The USB part (driver and transceiver) is supplied by means of BATT+. This is because PLSx3 is designed as a self-powered device compliant with the Universal Serial Bus Specification Revision 2.0. Module SMT VREG (3V075) lin. reg. USB part1) VBUS DP DN Detection only RS RS BATT+

GND VUSB_IN USB_DP2) USB_DN2) 1) All serial (including RS) and pull-up resistors for data lines are implemented. 2) If the USB interface is operated in High Speed mode (480MHz), it is recommended to take special care routing the data lines USB_DP and USB_DN. Application layout should in this case implement a differential impedance of 90 ohms for proper signal integrity. Figure 4: USB circuit To properly connect the module's USB interface to the external application, a USB 2.0 compat-

ible connector and cable or hardware design is required. For more information on the USB re-

lated signals see Table 3. Furthermore, the USB modem driver distributed with PLSx3 needs to be installed. While a USB connection is active, the module will never switch to SLEEP mode. Only if the USB interface is in Suspend mode, the module is able to switch to SLEEP mode. 1. The specification is ready for download on http://www.usb.org/developers/docs/

t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 2.1 Application Interface 60 2.1.3.1 Reducing Power Consumption Page 28 of 121 While a USB connection is active, the module will never switch into SLEEP mode. Only if the USB interface is in Suspended state or Detached (i.e., VUSB_IN = 0) is the module able to switch into SLEEP mode thereby saving power. There are two possibilities to enable power re-

duction mechanisms:

Recommended implementation of USB Suspend/Resume/Remote Wakeup:

The USB host should be able to bring its USB interface into the Suspended state as described in the Universal Serial Bus Specification Revision 2.01. For this functionality to work, the VUSB_IN line should always be kept enabled. On incoming calls and other events PLSx3 will then generate a Remote Wakeup request to resume the USB host controller. See also [3] (USB Specification Revision 2.0, Section 10.2.7, p.282):

"If USB System wishes to place the bus in the Suspended state, it commands the Host Con-

troller to stop all bus traffic, including SOFs. This causes all USB devices to enter the Sus-

pended state. In this state, the USB System may enable the Host Controller to respond to bus wakeup events. This allows the Host Controller to respond to bus wakeup signaling to restart the host system."

Implementation for legacy USB applications not supporting USB Suspend/Resume:

As an alternative to the regular USB suspend and resume mechanism it is possible to employ the RING0 line to wake up the host application in case of incoming calls or events signalized by URCs while the USB interface is in Detached state (i.e., VUSB_IN = 0). Every wakeup event will force a new USB enumeration. Therefore, the external application has to carefully consider the enumeration timings to avoid loosing any signaled events. For details on this host wakeup functionality see Section 2.1.10.4. To prevent existing data call con-

nections from being disconnected while the USB interface is in detached state (i.e., VUS-

B_IN=0) it is possible to call AT&D0, thus ignoring the status of the DTR line (see also [1]). 1. The specification is ready for download on http://www.usb.org/developers/docs/

t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 2.1 Application Interface 60 2.1.4 Serial Interface ASC0 Page 29 of 121 PLSx3 offers an 8-wire unbalanced, asynchronous modem interface ASC0 conforming to ITU-

T V.24 protocol DCE signaling. The electrical characteristics do not comply with ITU-T V.28. The significant levels are 0V (for low data bit or active state) and 1.8V (for high data bit or in-

active state). For electrical characteristics please refer to Table 3. PLSx3 is designed for use as a DCE. Based on the conventions for DCE-DTE connections it communicates with the customer application (DTE) using the following signals:

Port TXD @ application sends data to the modules TXD0 signal line Port RXD @ application receives data from the modules RXD0 signal line Figure 5: Serial interface ASC0 Features:

Includes the data lines TXD0 and RXD0, the status lines RTS0 and CTS0 and, in addition, the modem control lines DTR0, DSR0, DCD0 and RING0. The RING0 signal serves to indicate incoming calls and other types of URCs (Unsolicited Result Code). It can also be used to send pulses to the host application, for example to wake up the application from power saving state. Configured for 8 data bits, no parity and 1 stop bit. ASC0 can be operated at fixed bit rates from 300bps up to 921600bps. Supports RTS0/CTS0 hardware flow control. The hardware hand shake line RTS0 has an internal pull down resistor causing a low level signal, if the line is not used and open. Although hardware flow control is recommended, this allows communication by using only RXD and TXD lines. Wake up from SLEEP mode by RTS0 activation (high to low transition; see Section 3.3.4) Note: The ASC0 modem control lines DTR0, DCD0, DSR0 and RING0 can also be configured as GPIO lines. If configured as GPIO lines, these GPIO lines are assigned as follows:

GPIO1-->DTR0 GPIO2-->DCD0 GPIO3-->DSR0 GPIO24-->RING0 Configuration is done by AT command (see [1]). The configuration is non-volatile and becomes active after a module restart. t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 2.1 Application Interface 60 Page 30 of 121 Notes: No data must be sent over the ASC0 interface before the interface is active and ready to receive data (see Section 3.2.1). 2.1.5 Serial Interface ASC1 Four PLSx3 GPIO lines can be configured as ASC1 interface signals to provide a 4-wire unbal-

anced, asynchronous modem interface ASC1 conforming to ITU-T V.24 protocol DCE signal-

ling. The electrical characteristics do not comply with ITU-T V.28. The significant levels are 0V

(for low data bit or active state) and 1.8V (for high data bit or inactive state). For electrical char-

acteristics please refer to Table 3. PLSx3 is designed for use as a DCE. Based on the conventions for DCE-DTE connections it communicates with the customer application (DTE) using the following signals:

Port TXD @ application sends data to modules TXD1 signal line Port RXD @ application receives data from the modules RXD1 signal line Figure 6: Serial interface ASC1 Features Includes only the data lines TXD1 and RXD1 plus RTS1 and CTS1 for hardware hand-

shake. On ASC1 no RING line is available. Configured for 8 data bits, no parity and 1 or 2 stop bits. ASC1 can be operated at fixed bit rates from 300 bps to 921,600bps. Supports RTS1/CTS1 hardware flow. The hardware hand shake line RTS1 has an internal pull down resistor causing a low level signal, if the line is not used and open. Although hard-

ware flow control is recommended, this allows communication by using only RXD and TXD lines. Notes: The ASC1 interface lines are originally available as GPIO lines. If configured as ASC1 lines, the GPIO lines are assigned as follows:

GPIO16-->RXD1 GPIO17-->TXD1 GPIO18-->RTS1 GPIO19-->CTS1 Configuration is done by AT command (see [1]). The configuration is non-volatile and becomes active after a module restart. t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 2.1 Application Interface 60 2.1.6 UICC/SIM/USIM Interface Page 31 of 121 PLSx3 has two UICC/SIM/USIM interfaces (includes eSIM interface) compatible with the 3GPP 31.102 and ETSI 102 221. These are wired to the host interface in order to be connected to an external SIM card holder. Five pads on the SMT application interface are reserved for each of the two SIM interfaces. The UICC/SIM/USIM interface supports 3V and 1.8V SIM cards. Please refer to Table 3 for electrical specifications of the UICC/SIM/USIM interface lines depending on whether a 3V or 1.8V SIM card is used. The CCINx signal serves to detect whether a tray (with SIM card) is present in the card holder. Using the CCINx signal is mandatory for compliance with the GSM 11.11 recommendation if the mechanical design of the host application allows the user to remove the SIM card during operation. To take advantage of this feature, an appropriate SIM card detect switch is required on the card holder. See Chapter 7.1 as example for a card holder with an internal switch. Table 5: Signals of the SIM interface (SMT application interface) Signal Description Ground connection for SIM interfaces. Optionally a separate SIM ground line using e.g., pad N11, may be used to improve EMC. Chipcard clock lines for 1st and 2nd SIM interface. SIM supply voltage lines for 1st and 2nd SIM interface. Serial data lines for 1st and 2nd SIM interface, input and output. Chipcard reset lines for 1st and 2nd SIM interface. Input on the baseband processor for detecting a SIM card tray in the holder. If the SIM is removed during operation the SIM interface is shut down immediately to prevent destruc-

tion of the SIM. The CCINx signal is active low. The CCINx signal is mandatory for applications that allow the user to remove the SIM card during operation. The CCINx signal is solely intended for use with a SIM card. It must not be used for any other purposes. Failure to comply with this requirement may invalidate the type approval of PLSx3. Note: No guarantee can be given, nor any liability accepted, if loss of data is encountered after removing the SIM card during operation. Also, no guarantee can be given for properly initializ-

ing any SIM card that the user inserts after having removed the SIM card during operation. In this case, the application must restart PLSx3. By default, only the modules 1st SIM interface is available and can be used. The usage of the modules 2nd SIM interface has to be configured by AT command. As an alternative to connecting the modules two SIM interfaces and switching between these via AT command, it is possible to connect the first of the modules SIM interfaces via an external SIM switch that in turn provides access to a further SIM interface. For details see Section 2.1.6.2. GND CCCLK1 CCCLK2 CCVCC1 CCVCC2 CCIO1 CCIO2 CCRST1 CCRST2 CCIN1 CCIN2 t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 2.1 Application Interface 60 Page 32 of 121 Module 1st SIMinterface 2nd SIMinterface SIM1 SIM2

. Figure 7: Modules two UICC/SIM/USIM interfaces Figure 8: UICC/SIM/USIM interfaces connected The total cable length between the SMT application interface pads on PLSx3 and the pads of the external SIM card holder must not exceed 100mm in order to meet the specifications of 3GPP TS 51.010-1 and to satisfy the requirements of EMC compliance. To avoid possible cross-talk from the CCCLKx signal to the CCIOx signal be careful that both lines are not placed closely next to each other. A useful approach is using the GND line to shield the CCIOx line from the CCCLKx line. t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 2.1 Application Interface 60 Page 33 of 121 2.1.6.1 Enhanced ESD Protection for SIM Interface To optimize ESD protection for the SIM interface it is possible to add ESD diodes (eg. NUP4114) to the SIM interface lines as shown in the example given in Figure 9. Please place the ESD protection close to the SIM connector. It is suggested that the cload of diode be less than 3pF. The example was designed to meet ESD protection according ETSI EN 301 489-1/7: Contact discharge: 4kV, air discharge: 8kV. Module CCRST CCVCC CCIO CCCLK CCIN SIM_RST SIM_VCC SIM_IO 6 5 4 1 2 3 GND SIM_CLK SIM_DET Keep SIM lines low capacitative Figure 9: SIM interface - enhanced ESD protection t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 2.1 Application Interface 60 Page 34 of 121 2.1.6.2 SIM_SWITCH Line As an alternative to connecting the modules two SIM interfaces and switching between these interfaces by means of AT command, it is possible to connect the first of the modules SIM in-

terfaces via an external SIM switch that in turn provides access to a further SIM interface. Module 1st SIMinterface GPIO26/

SIM_SWITCH Switch SIM1A SIM1B Figure 10: External UICC/SIM/USIM switch The modules GPIO26 line can in this case be configured as SIM_SWITCH line in order to con-

trol the external SIM switch as shown in the sample circuit in Figure 11. A low state would then indicate the usage of the first SIM interface (SIM1A), a high state would indicate the usage of the second interface (SIM1B). The configuration of the SIM_SWITCH (GPIO26) line is done via AT command, is non-volatile, and available after the next module restart. External Application Module SIM1A ESD protection IF1 Sim Switch COMMON SIMSELECT FSA2567 ESD protection IF2 SIM1B VBAT 10k 22k 100k VSIM1 CCCLK1 CCIO1 CCRST1 SIM_ SWITCH CCIN1 Figure 11: Sample circuit for SIM interface connection via SIM switch t PLSx3_HID_v01.003 2021-03-12 Public / Released GPIO GPIO1 GPIO2 GPIO3 GPIO4 GPIO5 GPIO6 GPIO7 GPIO8 GPIO11 GPIO12 GPIO13 GPIO14 GPIO15 GPIO16 GPIO17 GPIO18 GPIO19 GPIO20 GPIO21 GPIO24 GPIO25 GPIO26 Cinterion PLSx3 Hardware Interface Description 2.1 Application Interface 60 Page 35 of 121 2.1.7 GPIO Interface PLSx3 offers a GPIO interface with 22 GPIO lines. The GPIO lines are shared with other inter-

faces or functions: Fast shutdown (see Section 2.1.10.3), Status LED (see Section 2.1.10.1), ASC0 (see Section 2.1.4), ASC1 (see Section 2.1.5) and SIM Switch (see Section 2.1.6.2) The following table shows the configuration variants for the GPIO pads. All variants are mutu-

ally exclusive, i.e. a pad configured for instance as Status LED is locked for alternative usage. Table 6: GPIO lines and possible alternative assignment Fast Shutdown Status LED ASC0 ASC1 SIM SWITCH DAI DTR0 DCD0 DSR0 FST_SHDN Status LED RXD1 TXD1 RTS1 CTS1 RING0 DOUT DIN SIM_SWITCH 2.1.8 Digital Audio Interface PLSx3 supports the digital audio interface that can be deployed as PCM or Inter_IC Sound

(I2S). t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 2.1 Application Interface 60 2.1.8.1 Pulse Code Modulation Interface Page 36 of 121 PLSx3s PCM interface can be used to connect audio devices capable of pulse code modulation. The PCM functionality is limited to the use of wideband codec with 16kHz sample rate only. The PCM interface runs at 16 kHz sample rate (62.5s frame length), while the signal processing maintains this rate in a wideband AMR call or samples automatically down to 8kHz in a narrowband call. Therefore, the PCM sample rate is independent of the audio bandwidth of the call. The PCM interface has the following characteristics:

Master mode Table 7 lists the available PCM interface signals. Long frame synchronization 16kHz/8kHz sample rate 256, 512, 1024 and 4096kHz bit clock at 16kHz sample rate 256, 512, and 2048kHz bit clock at 8kHz sample rate Table 7: Overview of PCM pin functions Signal name Signal direction master Description DOUT DIN FSC BCLK MCLK O I O O

PCM Data from PLSx3 to external codec. PCM Data from external codec to PLSx3. Frame synchronization signal to external codec. Bit clock to external codec. Note: If the BCLK signal is permanently provided (AT^SAIC parameter <clk_mode> = 0), the module will no longer enter its power save (SLEEP) state. Audio master clock. Be synchronous to BCLK to use in external codec. Can be switched on and off. Note: PCM data is always formatted as 16-bit uncompressed twos complement. Also, all PCM data and frame synchronization signals are written to the PCM bus on the rising clock edge and read on the falling edge. 2.1.8.2 Inter-IC Sound Interface The I2S Interface is a standardized bidirectio zonal I2S based digital audio interface for trans-

mission of mono voice signals for telephony services. The I2S properties and capabilities comply with the requirements lay out in the Phillips I2S Bus Specifications, revised June 5, 1996. The I2S interface has the following characteristics:

Bit clock mode: Master Sampling rate: 8kHz (narrowband), 16kHz (wideband) 256kHz bit clock at 8kHz sample rate 512kHz bit clock at 16kHz sample rate Table 8 lists the available I2S interface signals t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 2.1 Application Interface 60 Page 37 of 121

. Table 8: Overview of I2S pin functions Signal name on SMT application interface Signal configura-

tion inactive Signal direction Master Description DOUT DIN FSC BCLK PD PD PD PD O I O O I2S data from PLSx3 to external codec I2S data from external codec to PLSx3 Frame synchronization signal to external codec Word alignment

(WS) Bit clock to external codec. BCLK signal low/high time varies between 45% and 55% of its clock period. 2.1.9 Analog-to-Digital Converter (ADC) PLSx3 provides three unbalanced ADC input line: ADC[1...3]_IN. They can be used to mea-

sure three independent, externally connected DC voltages in the range of 0.1V to 1.7V. They can be used especially for antenna diagnosing. The AT^SRADC command can be employed to select the ADC line, set the measurement mode and read out the measurement results. 2.1.10 Control Signals 2.1.10.1 Status LED The GPIO5 interface line can be configured to drive a status LED that indicates different oper-

ating mode (for GPIOs see 2.1.7). GPIO and LED functionality are mutually exclusive. To take advantage of this function connect an LED to the GPIO5/STATUS line as shown in Figure 12 VCC LED R3 STATUS R1 R2 GND GND Figure 12: Status signaling with LED driver t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 2.1 Application Interface 60 Page 38 of 121 2.1.10.2 Power Indication The power indication signal PWR_IND notifies the on/off state of the module. High state of PWR_IND indicates that the module is switched off. The state of PWR_IND immediately changes to low when IGT is pulled low. For state detection an external pull-up resistor is re-

quired. Module Power supply On/Off

(open drain driver) e.g. BATT+

e c a f r e t n i T M S PWR_IND Figure 13: Power indication signal t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 2.1 Application Interface 60 Page 39 of 121 2.1.10.3 Fast Shutdown The GPIO4 interface line can be configured as fast shutdown signal line FST_SHDN. The con-

figured FST_SHDN line is an active low control signal and must be applied for at least 1 milli-

seconds. If unused this line can be left open because of a configured internal pull-up resistor. Before setting the FST_SHDN line to low, the IGT signal should be set to high (see Figure 14). The fast shutdown feature can be triggered using the AT command AT^SMSO=<fso>. For de-

tails see [1]. If triggered, a low impulse >1 milliseconds on the FST_SHDN line starts the fast shutdown. The fast shutdown procedure still finishes any data activities on the module's flash file system, thus ensuring data integrity, but will no longer deregister gracefully from the network, thus saving the time required for network deregistration. Switch off procedure fast shut down BATT+BB BATT+RF IGT EMERG_RST Internal Reset V180 PWR_IND GPIO4/AT^SMSO=<fso>

(Fast Shut Down)

< 15ms Active low Open Collector High Z Figure 14: Fast shutdown timing Please note that the normal software controlled shutdown using AT^SMSO will allow option for a fast shutdown by parameter <fso>, i.e., without network deregistration. However, in this case no URCs including shutdown URCs will be provided by the AT^SMSO command. Please also note that the fast shutdown operation does not allow the module deregister from the network, therefore, this practice is not recommended, and should not be conducted on reg-

ular basis. If it is used for energy saving reason, for instance, used in battery-driven solutions that require prompt system shutdown before battery depletion, discretion is advised in such case. t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 2.1 Application Interface 60 Page 40 of 121 2.1.10.4 Remote Wakeup If no call, data or message transfer is in progress, the external host application may shut down its own module interfaces or other components in order to save power. If a call, data, or other request (URC) arrives, the external application can be notified of this event and be woken up again by a state transition of a configurable remote wakeup line. Available as remote wakeup lines are some GPIO signals (recommended is GPIO24). Please refer to [1]: AT^SCFG: "Re-

moteWakeUp/..." for details on how to configure these lines for defined wakeup events on specified device interfaces. Possible states are listed in Table 9. If no line is specifically configured as remote wakeup signal, the remote USB suspend and re-

sume mechanism as specified in the Universal Serial Bus Specification Revision 2.0 applies for the USB interface (see Section 2.1.3). Possible states for the remote wakeup GPIO lines are listed in Table 9. Table 9: Remote wakeup lines Signal GPIOx I/O/P O Description Inactive to active high transition:

0 = No wake up request 1 = The host shall wake up t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 2.2 RF Antenna Interface 60 2.2 RF Antenna Interface Page 41 of 121 The PLSx3 GSM/UMTS/LTE antenna interface comprises a GSM/UMTS/LTE main antenna as well as a UMTS/LTE Rx diversity antenna to improve signal reliability and quality1. The RF in-

terface has an impedance of 50. PLSx3 is capable of sustaining a total mismatch at the an-

tenna line without any damage, even when transmitting at maximum RF power. The external antenna must be matched properly to achieve best performance regarding radi-

ated power, modulation accuracy and harmonic suppression. Antenna matching networks are not included on the PLSx3 module and should be placed in the host application if the antenna does not have an impedance of 50. Regarding the return loss PLSx3 provides the following values in the active band:

Table 10: Return loss in the active band State of module Return loss of module Recommended return loss of application Receive Transmit

> 8dB not applicable

> 12dB

> 12dB 1. By delivery default the UMTS/LTE Rx diversity antenna is configured as available for the module since its usage is mandatory for LTE. Please refer to [1] for details on how to configure antenna settings. t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 2.2 RF Antenna Interface 60 2.2.1 Antenna Interface Specifications Page 42 of 121 Table 11: RF Antenna interface GSM/UMTS/LTE Parameter Conditions Min. Typical Max. Unit LTE connectivity Band 1,2,3,4,5,7,8,12,13,14,17,18,19,20,25,26,28,38,40,41,66,71 Receiver Input Sensitivity

@ARP, Main Antenna, Channel BW at 5 MHz

@25C, 3.8V LTE FDD 2100 Band 1 LTE FDD 1900 Band 2 LTE FDD 1800 Band 3 LTE FDD 2100 Band 4 LTE FDD 850 Band 5 LTE FDD 2600 Band 7 LTE FDD 900 Band 8 LTE FDD 700 Band 12 LTE FDD 700 Band 13 LTE FDD 700 Band 14 LTE FDD 700 Band 17 LTE FDD 850 Band 18 LTE FDD 850 Band 19 LTE FDD 800 Band 20 LTE FDD 1900 Band 25 LTE FDD 850 Band 26 LTE FDD 700 Band 28 LTE TDD 2600 Band 38 LTE TDD 2300 Band 40 LTE TDD 2500 Band 41 LTE FDD 2100 Band 66 LTE FDD 600 Band 71 TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 2.2 RF Antenna Interface 60 Page 43 of 121 Table 11: RF Antenna interface GSM/UMTS/LTE Parameter Conditions Min. Typical Max. Receiver Input Sensitivity

@ARP, Diversity Antenna, Channel BW at 5 MHz

@25C, 3.8V LTE FDD 2100 Band 1 LTE FDD 1900 Band 2 LTE FDD 1800 Band 3 LTE FDD 2100 Band 4 LTE FDD 850 Band 5 LTE FDD 2600 Band 7 LTE FDD 900 Band 8 LTE FDD 700 Band 12 LTE FDD 700 Band 13 LTE FDD 700 Band 14 LTE FDD 700 Band 17 LTE FDD 850 Band 18 LTE FDD 850 Band 19 LTE FDD 800 Band 20 LTE FDD 1900 Band 25 LTE FDD 850 Band 26 LTE FDD 700 Band 28 LTE TDD 2600 Band 38 LTE TDD 2300 Band 40 LTE TDD 2500 Band 41 LTE FDD 2100 Band 66 LTE FDD 600 Band 71 TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD Unit dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 2.2 RF Antenna Interface 60 Page 44 of 121 Table 11: RF Antenna interface GSM/UMTS/LTE Parameter Conditions Min. Typical Max. RF Power @ARP with 50 Load (Board temperature<85C, 5 MHz BW, 1RB Position Low) LTE FDD 2100 Band 1 LTE FDD 1900 Band 2 LTE FDD 1800 Band 3 LTE FDD 2100 Band 4 LTE FDD 850 Band 5 LTE FDD 2600 Band 7 LTE FDD 900 Band 8 LTE FDD 700 Band 12 LTE FDD 700 Band 13 LTE FDD 700 Band 14 LTE FDD 700 Band 17 LTE FDD 850 Band 18 LTE FDD 850 Band 19 LTE FDD 800 Band 20 LTE FDD 1900 Band 25 LTE FDD 850 Band 26 LTE FDD 700 Band 28 LTE TDD 2600 Band 38 LTE TDD 2300 Band 40 LTE TDD 2500 Band 41 LTE FDD 2100 Band 66 LTE FDD 600 Band 71

+21

+21

+21

+21

+21

+21

+21

+21

+21

+21

+21

+21

+21

+21

+21

+21

+21

+21

+21

+21

+21

+21

+23.0

+23.0

+23.0

+23.0

+23.0

+22.5

+23.0

+23.0

+23.0

+23.0

+23.0

+23.0

+23.0

+23.0

+23.0

+23.0

+23.0

+23.0

+23.0

+23.0

+23.0

+23.0 Unit dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 2.2 RF Antenna Interface 60 Page 45 of 121 Table 11: RF Antenna interface GSM/UMTS/LTE Parameter Conditions Min. Typical Max. Unit UMTS connectivity Band I,II,III, IV,V,VI,VIII,XIX Receiver Input Main Sensi-

tivity @ ARP @25C, 3.8V UMTS 2100 Band I UMTS 1900 Band II UMTS 1800 Band III UMTS 1700 Band IV UMTS 850 Band V UMTS 850 Band VI UMTS 900 Band VIII UMTS 850 Band XIX UMTS 1800 Band III UMTS 1700 Band IV UMTS 850 Band V UMTS 850 Band VI UMTS 900 Band VIII UMTS 850 Band XIX UMTS 2100 Band I UMTS 1900 Band II UMTS 1800 Band III UMTS 1700 Band IV UMTS 850 Band V UMTS 850 Band VI UMTS 900 Band VIII UMTS 850 Band XIX Small MS GSM 850 E-GSM 900 DCS 1800 PCS 1900 GSM 850 E-GSM 900 DCS 1800 PCS 1900 TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD

+23.5

+23.5

+23.5

+23.5

+23.5

+23.5

+23.5

+23.5 TBD TBD TBD TBD 33 33 30 30

+21

+21

+21

+21

+21

+21

+21

+21 Receiver Input Diversity Sensitivity @ ARP @25C, 3.8V UMTS 2100 Band I UMTS 1900 Band II RF Power @ ARP with 50Ohm Load Board temperature < 85C GPRS coding schemes Class 12, CS1 to CS4 Class 12, MCS1 to MCS9 EGPRS GSM Class Static Receiver input Sensi-

tivity @ ARP RF Power @ ARP with 50Ohm Load Board temperature < 85C dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 2.2 RF Antenna Interface 60 Page 46 of 121 Table 11: RF Antenna interface GSM/UMTS/LTE Parameter Conditions Min. Typical Max. RF Power @ ARP with 50Ohm Load,

(ROPR = 4, i.e. no reduction) GPRS, 1 TX GSM 850 EDGE, 1 TX GSM 850 GPRS, 2 TX GSM 850 EDGE, 2 TX GSM 850 GPRS, 3 TX GSM 850 EDGE, 3 TX GSM 850 GPRS, 4 TX GSM 850 E-GSM 900 DCS 1800 PCS 1900 E-GSM 900 DCS 1800 PCS 1900 E-GSM 900 DCS 1800 PCS 1900 E-GSM 900 DCS 1800 PCS 1900 E-GSM 900 DCS 1800 PCS 1900 E-GSM 900 DCS 1800 PCS 1900 E-GSM 900 DCS 1800 PCS 1900 E-GSM 900 DCS 1800 PCS 1900 EDGE, 4 TX GSM 850 33 33 30 30 27 27 26 26 33 33 30 30 27 27 26 26 33 33 30 30 27 27 26 26 33 33 30 30 27 27 26 26 Unit dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 2.2 RF Antenna Interface 60 Page 47 of 121 Table 11: RF Antenna interface GSM/UMTS/LTE Parameter Conditions Min. Typical Max. RF Power @ ARP with 50Ohm Load,

(ROPR =5, i.e. partial reduc-

tion) GPRS, 1 TX GSM 850 EDGE, 1 TX GSM 850 GPRS, 2 TX GSM 850 EDGE, 2 TX GSM 850 GPRS, 3 TX GSM 850 EDGE, 3 TX GSM 850 GPRS, 4 TX GSM 850 EDGE, 4 TX GSM 850 E-GSM 900 DCS 1800 PCS 1900 E-GSM 900 DCS 1800 PCS 1900 E-GSM 900 DCS 1800 PCS 1900 E-GSM 900 DCS 1800 PCS 1900 E-GSM 900 DCS 1800 PCS 1900 E-GSM 900 DCS 1800 PCS 1900 E-GSM 900 DCS 1800 PCS 1900 E-GSM 900 DCS 1800 PCS 1900 33 33 30 30 27 27 26 26 33 33 30 30 27 27 26 26 27 27 26 26 31 31 28 28 27 27 26 26 32.2 32.2 29.2 29.2 Unit dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 2.2 RF Antenna Interface 60 Page 48 of 121 Table 11: RF Antenna interface GSM/UMTS/LTE Parameter Conditions Min. Typical Max. RF Power @ ARP with 50Ohm Load,

(ROPR = 6, i.e. partial reduc-

tion) GPRS, 1 TX GSM 850 EDGE, 1 TX GSM 850 GPRS, 2 TX GSM 850 EDGE, 2 TX GSM 850 GPRS, 3 TX GSM 850 EDGE, 3 TX GSM 850 GPRS, 4 TX GSM 850 EDGE, 4 TX GSM 850 E-GSM 900 DCS 1800 PCS 1900 E-GSM 900 DCS 1800 PCS 1900 E-GSM 900 DCS 1800 PCS 1900 E-GSM 900 DCS 1800 PCS 1900 E-GSM 900 DCS 1800 PCS 1900 E-GSM 900 DCS 1800 PCS 1900 E-GSM 900 DCS 1800 PCS 1900 E-GSM 900 DCS 1800 PCS 1900 33 33 30 30 27 27 26 26 32 32 29 29 27 27 26 26 27 27 26 26 29 29 26 26 27 27 26 26 30.2 30.2 27.2 27.2 Unit dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 2.2 RF Antenna Interface 60 Page 49 of 121 Table 11: RF Antenna interface GSM/UMTS/LTE Parameter Conditions Min. Typical Max. RF Power @ ARP with 50Ohm Load,

(ROPR = 7, i.e. partial reduc-

tion) GPRS, 1 TX GSM 850 EDGE, 1 TX GSM 850 GPRS, 2 TX GSM 850 EDGE, 2 TX GSM 850 GPRS, 3 TX GSM 850 EDGE, 3 TX GSM 850 GPRS, 4 TX GSM 850 EDGE, 4 TX GSM 850 E-GSM 900 DCS 1800 PCS 1900 E-GSM 900 DCS 1800 PCS 1900 E-GSM 900 DCS 1800 PCS 1900 E-GSM 900 DCS 1800 PCS 1900 E-GSM 900 DCS 1800 PCS 1900 E-GSM 900 DCS 1800 PCS 1900 E-GSM 900 DCS 1800 PCS 1900 E-GSM 900 DCS 1800 PCS 1900 33 33 30 30 27 27 26 26 30 30 27 27 27 27 26 26 27 27 26 26 27 27 24 24 27 27 26 26 28.2 28.2 25.2 25.2 Unit dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 2.2 RF Antenna Interface 60 Page 50 of 121 Table 11: RF Antenna interface GSM/UMTS/LTE Parameter Conditions Min. Typical Max. RF Power @ ARP with 50Ohm Load,

(ROPR = 8, i.e. max reduc-

tion) GPRS, 1 TX GSM 850 EDGE, 1 TX GSM 850 GPRS, 2 TX GSM 850 EDGE, 2 TX GSM 850 GPRS, 3 TX GSM 850 EDGE, 3 TX GSM 850 GPRS, 4 TX GSM 850 EDGE, 4 TX GSM 850 E-GSM 900 DCS 1800 PCS 1900 E-GSM 900 DCS 1800 PCS 1900 E-GSM 900 DCS 1800 PCS 1900 E-GSM 900 DCS 1800 PCS 1900 E-GSM 900 DCS 1800 PCS 1900 E-GSM 900 DCS 1800 PCS 1900 E-GSM 900 DCS 1800 PCS 1900 E-GSM 900 DCS 1800 PCS 1900 33 33 30 30 27 27 26 26 30 30 27 27 24 24 23 23 28.2 28.2 25.2 25.2 22.2 22.2 21.2 21.2 27 27 24 24 21 21 20 20 Unit dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 2.2 RF Antenna Interface 60 Page 51 of 121 Table 12: RF Antenna interface LTE for -J variant (at operating temperature range) Parameter Condition Min. Typical Max. Unit LTE connectivity Band 1,3,8,18,19,26 Receiver Input Sensitivity

@ARP, Combiner Antenna, Channel BW at 10MHz

@25C, 3.8V LTE FDD 2100 Band 1 LTE FDD 1800 Band 3 LTE FDD 900 Band 8 LTE FDD 850 Band 18 LTE FDD 850 Band 19 LTE FDD 850 Band 26

-102.2

-102.2

-101.9

-101

-100.3

-100.8 dBm dBm dBm dBm dBm dBm t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 2.2 RF Antenna Interface 60 Page 52 of 121 2.2.2 Antenna Installation The antenna is connected by soldering the antenna pads (ANT_MAIN, ANT_DRX and ANT_GNSS) and their neighboring ground pads directly to the applications PCB. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 K ANT_ MAIN GND GND GND E ANT_ GNSS GND P N M L J H G F D C B A GND ANT_ DRX GND Figure 15: Antenna pads (bottom view) The distance between the antenna pads and their neighboring GND pads has been optimized for best possible impedance. To prevent mismatch, special attention should be paid to these pads on the application PCB. The wiring of the antenna connection, starting from the antenna pad to the applications anten-

na should result in a 50 line impedance. Line width and distance to the GND plane need to be optimized with regard to the PCBs layer stack. Some examples are given in Section 2.2.3. To prevent receiver desensitization due to interferences generated by fast transients like high speed clocks on the external application PCB, it is recommended to realize the antenna con-

nection line using embedded Stripline rather than Micro-Stripline technology. Please see Sec-

tion 2.2.3 for examples of how to design the antenna connection in order to achieve the required 50 line impedance. For type approval purposes, the use of a 50 coaxial antenna connector (U.FL-R-SMT) might be necessary. In this case the U.FL-R-SMT connector should be placed as close as possible to PLSx3s antenna pad. t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 2.2 RF Antenna Interface 60 2.2.3 RF Line Routing Design 2.2.3.1 Line Arrangement Examples Page 53 of 121 Several dedicated tools are available to calculate line arrangements for specific applications and PCB materials - for example from http://www.polarinstruments.com/ (commercial software) or from http:www.awr.com/awr-software/options/tx-line/ (free software). Embedded Stripline This figure below shows a line arrangement example for embedded stripline. Figure 16: Embedded stripline arrangement example t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 2.2 RF Antenna Interface 60 Page 54 of 121 Micro-Stripline This section gives two line arrangement examples for micro-stripline. Figure 17: Micro-Stripline arrangement example t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 2.2 RF Antenna Interface 60 Page 55 of 121 2.2.3.2 Routing Example Interface to RF Connector Figure 18 and Figure show a sample connection of a modules antenna pad at the bottom layer of the module PCB with an application PCBs coaxial antenna connector. Line impedance de-

pends on line width, but also on other PCB characteristics like dielectric, height and layer gap. The sample stripline width of 0.33mm/0.8mm and the space of 0.625mm/0.173mm are only recommended for an application with a PCB layer stack resembling the one of the PLSx3 evaluation board, and with layer 2 as well as layer 3 cut clear. For different layer stacks the stripline width will have to follow stripline routing rules, avoiding 90 degree comers and using the shortest distance to the PCBs coaxial antenna connector. G N D G N D e.g. ANT_ TRX1 Stripline (50 ohms) on top layer of evaluation board from antenna pad to module edge Width = 0.33 mm Ground connection Edge of module PCB 50 ohms microstrip line E.g., U.FL antenna connector G N D G N D Figure 18: Routing to applications RF connector t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 2.2 RF Antenna Interface 60 Page 56 of 121 RF track under module:

Line/space: /m Module RF track outside module: Line/space:

0/m Figure 19: Routing Detail t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 2.3 GNSS Antenna Interface 60 2.3 GNSS Antenna Interface Page 57 of 121 In addition to the RF antenna interface PLSx3 also has a GNSS antenna interface. See Section 2.1.1 to find out where the GNSS antenna pad is located. The GNSS pads shape is the same as for the RF antenna interface (see Section 2.2.2). It is possible to connect active or passive GNSS antennas. In either case they must have 50 impedance. The simultaneous operation of GSM/UMTS/LTE and GNSS is implemented. For electrical characteristics see Section 2.2. PLSx3 provides the signal VGNSS to enable an active GNSS antenna power supply. Figure 20 shows the flexibility in realizing the power supply for an active GNSS antenna by giving a sam-

ple circuit realizing the supply voltage for an active GNSS antenna. Module Application:

GNSS Receiver Antenna Matching ANT_GNSS ANT_GNSS_DC RF DC DC LNA Active GNSS Antenna BATT+

VGNSS

(3.2V) VGNSS IN OUT EN LDO LP3985IM5-3.2 Rs Is 1R0 Rv 100

Io Current Sensor FAN4010 Io Rg 3k3 ADCx_IN Si1023X_1 10k 1u ESD Protection Si1023X_2 10k Ug Figure 20: Supply voltage for active GNSS antenna t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 2.3 GNSS Antenna Interface 60 Page 58 of 121 Figure 21 shows a sample circuit realizing ESD protection for a passive GNSS antenna. Con-

necting the input ANT_GNSS_DC to GND prevents ESD from coupling into the module. Module SMT interface VGNSS Not used 100nF ANT_GNSS_DC 12nH ANT_GNSS To GNSS receiver

(Optional) ESD protection 0R Passive GNSS antenna Figure 21: ESD protection for passive GNSS antenna 2.3.1 GNSS Antenna Diagnostic GNSS antenna diagnosis does require an external detection circuit. The antenna DC supply current can be measured via ADCx_IN. The ADCx_IN input voltage (Ug) may be generated by a sample circuit shown in Figure 20. The circuit allows to check the presence and the connec-

tion status of an active GNSS antenna. Passive GNSS antennas cannot be detected. There-

fore, GNSS antenna detection is only available in active GNSS antenna mode. This mode is configured by the AT command: AT^SGPSC (for details see [1]) Having enabled the active GNSS antenna mode the presence and connection status of an ac-

tive GNSS antenna can be checked using the AT command AT^SRADC to monitor ADCx_IN. The following table lists sample current ranges for possible antenna states as well as sample voltage ranges as possible decision thresholds to distinguish between the antenna connection states. Please refer to [1] for more information on the command AT^SRADC. Table 13: Sample ranges of the GNSS antenna diagnostic measurements and their possible meaning Antenna connection status Antenna not connected Decision threshold Antenna connected Decision threshold Current ranges (IS)1

<1.4mA Voltage ranges (UG) 2.2mA...20mA 59mV 20%

825mV 20%

Antenna short circuited to ground

>30mA GNSS antenna detection is not possible because GNSS antenna power supply is switched off.

1. Please note that the mA ranges 1.4mA...2.2mA and 20mA...30mAare tolerance ranges. The decision threshold should be defined within these ranges. t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 2.4 Sample Application 60 Page 59 of 121 2.4 Sample Application Figure 22 shows a typical example of how to integrate a PLSx3 module with an application. Usage of the various host interfaces depends on the desired features of the application. Because of the very low power consumption design, current flowing from any other source into the module circuit must be avoided, for example reverse current from high state external control lines. Therefore, the controlling application must be designed to prevent reverse current flow. Otherwise there is the risk of undefined states of the module during startup and shutdown or even of damaging the module. Because of the high RF field density inside the module, it cannot be guaranteed that no self interference might occur, depending on frequency and the applications grounding concept. The potential interferers may be minimized by placing small capacitors (47pF) at suspected lines

(e.g. RXD0, VDDLP, and ON). While developing SMT applications it is strongly recommended to provide test points for certain signals, i.e., lines to and from the module - for debug and/or test purposes. The SMT application should allow for an easy access to these signals. For details on how to implement test points see [4]. The EMC measures are best practice recommendations. In fact, an adequate EMC strategy for an individual application is very much determined by the overall layout and, especially, the po-

sition of components. For example, mounting the internal acoustic transducers directly on the PCB eliminates the need to use the ferrite beads shown in the sample schematic. Disclaimer No warranty, either stated or implied, is provided on the sample schematic diagram shown in Figure 22 and the information detailed in this section. As functionality and compliance with na-

tional regulations depend to a great amount on the used electronic components and the indi-

vidual application layout manufacturers are required to ensure adequate design and operating safeguards for their products using PLSx3 modules. t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 2.4 Sample Application 60 Page 60 of 121 BATT+_DSB 0R

100F, Low ESR!

100F, Low ESR!

220nF 47F 10F 4.7F 22pF 0R 0R

100F, Low ESR!

V180 PLSx3 2 2 BATT+BB BATT+RF V180 EMERG_RST Main antenna Diversity antenna GNSS antenna ANT_MAIN ANT_DRX GND GND GND GND GND GND ANT_GNSS GND IGT ANT_GNSS_DC ANT_GNSS_DC

*For more details see Section 5.2 GNSS Antenna Interface 47k

47k

GND E.g., VBATT E.g., 100k Power Indicator PWR_IND CCVCC1 USB USB interface*

*For more details see Section 2.1.3 USB Interface 3 8 4 5 3 ACS0 ACS1 ADC Status Serial Interface Serial Interface ADC input interface Status LED CCIO1 Digital Audio PCM(I2S) Interface&MCLK CCVCC1 k 0 1 CCCLK1 CCRST1 CCIN1 SIM1 GND SIM2 GND F n 1 F p 0 1 F p 0 1 F n 0 2 2 GND GND GND GND CCV CC2 k 0 1 CCVCC1 CCIO1 CCCLK1 CCRST1 CCIN1 F n 1 F p 0 1 F p 0 1 F n 0 2 2 GND GND GND GND GND FST_SHDN Fast shutdown SIM_SWITCH SIM Switch GPIO GPIO*

V180 k 2 2

. k 2 2

. I2CCLK I2CDAT GND Figure 22: Schematic diagram of PLSx3 sample application

*When has the function of GPIO multiplexing PADs, used as GPIO function, need through the SW switch command. t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 3 Operating Characteristics 82 3 Operating Characteristics 3.1 Operating Modes Page 61 of 121 The table below briefly summarizes the various operating modes referred to throughout the document. Table 14: Overview of operating modes Mode Function Normal operation GSM /

GPRS / UMTS /

HSPA / LTE SLEEP GSM /

GPRS / UMTS /

HSPA / LTE IDLE GSM TALK/

GSM DATA GPRS DATA EGPRS DATA UMTS TALK/

UMTS DATA HSPA DATA Power saving set automatically when no call is in progress and the USB connection is suspended by host or not present and no active commu-

nication via ASC0. Power saving disabled or an USB connection not suspended, but no call in progress. Connection between two subscribers is in progress. Power consump-

tion depends on the GSM network coverage and several connection settings (e.g. DTX off/on, FR/EFR/HR, hopping sequences and antenna connection). The following applies when power is to be mea-

sured in TALK_GSM mode: DTX off, FR and no frequency hopping. GPRS data transfer in progress. Power consumption depends on net-

work settings (e.g. power control level), uplink / downlink data rates and GPRS configuration (e.g. used multislot settings). EGPRS data transfer in progress. Power consumption depends on net-

work settings (e.g. power control level), uplink / downlink data rates and EGPRS configuration (e.g. used multislot settings). UMTS data transfer in progress. Power consumption depends on net-

work settings (e.g. TPC Pattern) and data transfer rate. HSPA data transfer in progress. Power consumption depends on net-

work settings (e.g. TPC Pattern) and data transfer rate. LTE TALK/

LTE DATA LTE data transfer in progress. Power consumption depends on network settings (e.g. TPC Pattern) and data transfer rate. Power Down Normal shutdown after sending the power down command. Only a voltage regulator is active for powering the RTC. Software is not active. Interfaces are not accessible. Operat-

ing voltage remains applied. Airplane mode Airplane mode shuts down the radio part of the module, causes the module to log off from the network and disables all AT commands whose execution requires a radio connection. Airplane mode can be controlled by AT command (see [1]). t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 3.2 Power Up/Power Down Scenarios 82 3.2 Power Up/Power Down Scenarios Page 62 of 121 In general, be sure not to turn on PLSx3 while it is beyond the safety limits of voltage and tem-

perature stated in Section 2.1.2.1. PLSx3 immediately switches off after having started and de-

tected these inappropriate conditions. In extreme cases this can cause permanent damage to the module. 3.2.1 Turn on PLSx3 After the operating voltage BATT+ is applied, PLSx3 can be switched on by means of the IGT signal. The IGT signal turns on the module if the module is in power down mode. The IGT signal is low level triggered. The module starts in the operating mode with a continuous low level signal. It is recommended to pull the IGT sinal to GND directly when powering on. The low pulse width must be longer than 300ms as shown in Figure 23. When a automatic power-on is needed, IGT can always be connected to GND.

>300 ms BATT+

IGT V180 EMERG_RST 3.2.2 Restart PLSx3 Figure 23: IGT timing To switch the module off the following procedures may be used:

Software controlled restart procedure: Software controlled by sending an AT command over the serial application interface. See Section 3.2.2.1. Hardware controlled restart procedure: Hardware controlled by using the EMERG_RST line (see Section 3.2.2.2). 3.2.2.1 Restart PLSx3 Using Restart Command After startup PLSx3 can be re-started using the AT+CFUN command. For details see [1]

t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 3.2 Power Up/Power Down Scenarios 82 3.2.2.2 Restart PLSx3 Using EMERG_RST Page 63 of 121 The EMERG_RST signal is internally connected to the baseband processor. A low level >2 00ms sets the processor and all signals to the reset states, and thus restart the module. Please note that if the EMERG_RST signal is not released, i.e., changed from low to high, after a restart, the module will be repeatedly restarted. When the timer of the EMERG_RST signal is more than 8000ms, the module will be switched off directly. It is strongly recommended to control this EMERG_RST line with an open collector transistor or an open drain field-effect transistor. Caution: Use the EMERG_RST line only when, due to serious problems, the software is not responding for more than 5 seconds. Pulling the EMERG_RST line causes the loss of all information stored in the volatile memory. Therefore, this procedure is intended only for use in case of emergency, e.g. if PLSx3 does not respond, if reset or shutdown via AT command fails. t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 3.2 Power Up/Power Down Scenarios 82 3.2.3 Signal States after Startup Page 64 of 121 Table 15 lists the states each interface signal passes through during reset phase and the first firmware initialization. For further firmware startup initializations the values may differ because of different GPIO line configurations. After the reset state has been reached the firmware initialization state begins. The firmware ini-

tialization is completed as soon as the ASC0 interface lines CTS0, DSR0 and RING0 have turned low (see Section 2.1.4 and Section 2.1.5). Now, the module is ready to receive and transmit data. Table 15: Pull-up and Pull-down Values Signal name Reset state First start up configuration RXD0 TXD0 RTS0 CTS0 STATUS/GPIO5 DSR0/GPIO3 DCD0/GPIO2 RING0/GPIO24 RXD1/GPIO16 TXD1/GPIO17 RTS1/GPIO18 CTS1/GPIO19 GPIO6-8 GPIO11-13 GPIO14-15 GPIO25 DOUT/GPIO20 DIN/GPIO21 SIM_SWITCH/GPIO26 FAST_SHDN/GPIO4 PD PD PD PD PD PD PD PD PD PD O/H PD PD I PD PD PD PD O/H PD O/L PD O/L O/H O/H O/H PD PD O/H PD PD I PD O/H PD PD Note: the values above are stored as non- volatile, any changes of the value will take effect after next power-cycle and remain effective before any change happens again. Abbreviations used in above Table 15:

L = Low level H = High level T = Tristate I = Input O = Output OD = Open Drain PD = Pull down, 200A at 1.9V PU = Pull up, -240A at 0V t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 3.2 Power Up/Power Down Scenarios 82 Page 65 of 121 3.2.4 Turn off PLSx3 To switch the module off the following procedures may be used:

Software controlled shutdown procedure: Software controlled by sending an AT command over the serial application interface. See Section 3.2.4.1 Hardware controlled shutdown procedure: Hardware controlled by setting the FST_SHDN line to low. See Section 2.1.10.3 Automatic shutdown (software controlled): See Section 3.2.5

- Take effect if PLSx3 board temperature exceeds a critical limit, or if

- Undervoltage or overvlotage is detected. 3.2.4.1 Switch off PLSx3 Using AT Command The best and safest approach to powering down the module is to issue the AT^SMSO com-

mand. This procedure lets the module log off from the network and allows the software to enter into a secure state and to save data before disconnecting the power supply. The shutdown pro-

cedure will be an active process for about 2 seconds (depending on environmental conditions such as network states) until the module switches off. A low level of the V180 signal as well as the URC "^SHUTDOWN" indicate that the switch off procedure has completed and the module has entered the Power Down mode. 3.2.5 Automatic Shutdown Automatic shutdown takes effect if the following event occurs:

PLSx3 board is exceeding the critical limits of overtemperature or undertemperature (see Section 3.2.5.1) Undervoltage or overvoltage is detected (see Section 3.2.5.2 and Section 3.2.5.3) The automatic shutdown procedure is equivalent to the power-down initiated with an AT com-

mand, i.e. PLSx3 logs off from the network and the software enters a secure state avoiding loss of data. 3.2.5.1 Thermal Shutdown The board temperature is constantly monitored by an internal NTC resistor located on the PCB. The values detected by the NTC resistor are measured directly on the board and therefore, are not fully identical with the ambient temperature. Each time the board temperature goes out of range or back to normal, PLSx3 instantly displays an alert (if enabled). URCs indicating the level "1" or "-1" allow the user to take appropriate precautions, such as protecting the module from exposure to extreme conditions. The presentation of the URCs depends on the settings selected with the AT^SCTM write command (for details see [1]):

AT^SCTM=1: Presentation of URCs is always enabled. AT^SCTM=0 (default): Presentation of URCs is enabled during the 2 minute guard period after start-up of PLSx3. After expiry of the 2 minute guard period, the presentation of URCs will be disabled, i.e. no URCs with alert levels "1" or ''-1" will be generated. URCs indicating the level "2" or "-2" are instantly followed by an orderly shutdown after 5 seconds unless the temperature returns to a valid operating level ("1", "0", "-1") or the shut-

down ability was disabled with AT^SCFG, "MEopMode/ShutdownOnCritTemp",<sdoct>. The presentation of these URCs is always enabled, i.e. they will be output even though the t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 3.2 Power Up/Power Down Scenarios 82 factory setting AT^SCTM=0 was never changed. Page 66 of 121 The maximum temperature ratings are stated in Section 3.6. Refer to Table 16 for the associ-

ated URCs. Table 16: Temperature associated URCs Sending temperature alert (2min after PLSx3 start-up, otherwise only if URC presentation enabled)

^SCTM_B: 1 Board close to overtemperature limit.

^SCTM_B: -1 Board close to undertemperature limit.

^SCTM_B: 0 Board back to non-critical temperature range. Automatic shutdown (URC appears no matter whether or not presentation was enabled)

^SCTM_B: 2 Alert: Board equal or beyond overtemperature limit. PLSx3 switches off.

^SCTM_B: -2 Alert: Board equal or below undertemperature limit. PLSx3 switches off. t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 3.2 Power Up/Power Down Scenarios 82 3.2.5.2 Undervoltage Shutdown Page 67 of 121 The undervoltage shutdown threshold is the specified minimum supply voltage VBATT+ given in Table 3. When the average supply voltage measured by PLSx3 approaches the undervolt-

age shutdown threshold (i.e., 0.05V offset) the module will send the following URC:

^SBC: Undervoltage Shutdown If the undervoltage persists the module will send the URC several times before switching off automatically. This type of URC does not need to be activated by the user. It will be output automatically when fault conditions occur. 3.2.5.3 Overvoltage Shutdown The overvoltage shutdown threshold is the specified maximum supply voltage VBATT+ given in Table 3. When the supply voltage approaches the overvoltage shutdown threshold, the mod-

ule will send the following URC:

^SBC: Overvoltage Shutdown The overvoltage warning is sent only once before the module is close to the overvoltage shut-

down threshold again. This type of URC does not need to be activated by the user. It will be output automatically when fault conditions occur. Keep in mind that several PLSx3 components are directly linked to BATT+ and, therefore, the supply voltage remains applied at major parts of PLSx3, even if the module is switched off. Es-

pecially the power amplifier is very sensitive to high voltage and might even be destroyed t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 3.3 Power Saving 82 Page 68 of 121 3.2.5.4 Deferred Shutdown at Extreme Temperature Condition In the following cases, automatic shutdown will be deferred if a critical temperature limit is ex-

ceeded:

While an emergency call is in progress. During a two minute guard period after power-up. This guard period has been introduced in order to allow for the user to make an emergency call. The start of any one of these calls extends the guard period until the end of the call. Any other network activity may be terminated by shutdown upon expiry of the guard time. While in a "deferred shutdown" situation, PLSx3 continues to measure the temperature and to deliver alert messages, but deactivates the shutdown functionality. Once the 2 minute guard period is expired or the call is terminated, full temperature control will be resumed. If the tem-

perature is still out of range, PLSx3 switches off immediately (without another alert message). Caution: Automatic shutdown is a safety feature intended to prevent damage to the module. Extended usage of the deferred shutdown facilities provided may result in damage to the mod-

ule, and possibly other severe consequences. 3.3 Power Saving PLSx3 is able to reduce its functionality to a minimum (during the so-called SLEEP mode and SUSPEND mode) in order to minimize its current consumption. The following sections explain the modules network dependent power saving behavior. The power saving behavior is further configurable by AT command:

When all serial interfaces (i.e. ASC0, and ASC1) are idle, the module can enter SLEEP mode by additional configuration settings (i.e. AT^SPOW=2.3000,255). AT^SCFG= "MEopMode/ExpectDTR": Power saving will take effect only if there is no trans-

mission data pending on any of the modules USB ports. The expect DTR AT command ensures that data becoming pending on any USB port before an external application has signaled its readiness to receive the data is discarded. By default this behavior is enabled for all available USB CDC ACM. Using the AT command AT^SCFG="Radio/OutputPowerReduction" it is possible for the module in GPRS multislot scenarios to reduce its output power according to 3GPP 45.005 section. 3.3.1 Power Saving while Attached to GSM Networks The power saving possibilities while attached to a GSM network depend on the paging timing cycle of the base station. The duration of a power saving interval can be calculated using the following formula:

t = 4.615 ms (TDMA frame duration) * 51 (number of frames) * DRX value. DRX (Discontinuous Reception) is a value from 2 to 9, resulting in paging intervals between 0.47 and 2.12 seconds. The DRX value of the base station is assigned by the GSM network operator. t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 3.3 Power Saving 82 Page 69 of 121 Now, a paging timing cycle consists of the actual fixed length paging plus a variable length pause before the next paging. In the pauses between listening to paging messages, the module resumes power saving, as shown in Figure 24. Figure 24: Power saving and paging in GSM networks The varying pauses explain the different potential for power saving. The longer the pause the less power is consumed. Generally, power saving depends on the modules application scenario and may differ from the above mentioned normal operation. The power saving interval may be shorter than 0.47 sec-

onds or longer than 2.12 seconds. 3.3.2 Power Saving while Attached to WCDMA Networks The power saving possibilities while attached to a WCDMA network depend on the paging tim-

ing cycle of the base station. During normal WCDMA operation, i.e., the module is connected to a WCDMA network, the duration of a power saving period varies. It may be calculated using the following formula:

t = 2DRX value * 10 ms (WCDMA frame duration). DRX (Discontinuous Reception) in WCDMA networks is a value between 6 and 9, thus result-

ing in power saving intervals between 0.64 and 5.12 seconds. The DRX value of the base sta-

tion is assigned by the WCDMA network operator. Now, a paging timing cycle consists of the actual fixed length paging plus a variable length pause before the next paging. In the pauses between listening to paging messages, the module resumes power saving, as shown in Figure 25. Figure 25: Power saving and paging in WCDMA networks The varying pauses explain the different potential for power saving. The longer the pause the less power is consumed. t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 3.3 Power Saving 82 Page 70 of 121 Generally, power saving depends on the modules application scenario and may differ from the above mentioned normal operation. The power saving interval may be shorter than 0.64 sec-

onds or longer than 5.12 seconds. 3.3.3 Power Saving while Attached to LTE Networks The power saving possibilities while attached to an LTE network depend on the paging timing cycle of the base station. During normal LTE operation, i.e., the module is connected to an LTE network, the duration of a power saving period varies. It may be calculated using the following formula:

t = DRX Cycle Value * 10 ms DRX cycle value in LTE networks is any of the four values: 32, 64, 128 and 256, thus resulting in power saving intervals between 0.32 and 2.56 seconds. The DRX cycle value of the base station is assigned by the LTE network operator. Now, a paging timing cycle consists of the actual fixed length paging plus a variable length pause before the next paging.In the pauses between listening to paging messages, the module resumes power saving, as shown in Figure 26. Figure 26: Power saving and paging in LTE networks The varying pauses explain the different potential for power saving. The longer the pause the less power is consumed. Generally, power saving depends on the modules application scenario and may differ from the above mentioned normal operation. The power saving interval may be shorter than 0.32 sec-

onds or longer than 2.56 seconds. t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 3.3 Power Saving 82 Page 71 of 121 3.3.4 Wake-up via RTS0 RTS0 can be used to wake up PLSx3 from SLEEP mode configured with AT^SPOW. Assertion of RTS0 (i.e., toggle from inactive high to active low) serves as wake up event, thus allowing an external application to almost immediately terminate power saving. After RTS0 assertion, the CTS0 line signals module wake up, i.e., readiness of the AT command interface. It is there-

fore recommended to enable RTS/CTS flow control (default setting). Figure 27 shows the described RTS0 wake up mechanism. R T S 0 C T S 0 T X D 0 R X D 0 R T S a s s e r t io n ( f a llin g e d g e ) R T S b a c k W a k e u p f r o m S L E E P m o d e R e t u r n t o S L E E P m o d e A T c o m m a n d R e p ly U R C Figure 27: Wake-up via RTS0 t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 3.4 Power Supply 82 Page 72 of 121 3.4 Power Supply PLSx3 needs to be connected to a power supply at the SMT application interface - 4 lines BATT+, and GND. There are two separate voltage domains for BATT+:

BATT+BB with two lines for the general power management. BATT+RF with two lines for the RF. Please note that throughout the document BATT+ refers to both voltage domains and power supply lines - BATT+BB and BATT+RF. The main power supply from an external application has to be a single voltage source and has to be expanded to sub paths (star structure). 150F capacitors should be placed as close as possible to the BATT+ pads. Figure 28 shows a sample circuit for decoupling capacitors for BATT+. Module SMT interface BATT+BB BATT+RF 2 2 150F low ESR capacitors 150F low ESR capacitors BATT+

GND Figure 28: Decoupling capacitor(s) for BATT+

The power supply of PLSx3 must be able to provide the peak current during the uplink trans-

mission. All the key functions for supplying power to the device are handled by the power management section of the analog controller. This IC provides the following features:

Stabilizes the supply voltages for the baseband using low drop linear voltage regulators and DC-DC step down switching regulators. Switches the module's power voltages for the power-up and -down procedures. SIM switch to provide SIM power supply. t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 3.4 Power Supply 82 3.4.1 Power Supply Ratings Page 73 of 121 The tables in this section assemble various voltage supply and current consumption ratings of the module. Table 17: Supply Ratings Description Conditions BATT+

Supply voltage Min Typ Max Unit 3.0 3.8 4.5 V Normal Range

(Directly measured at Module. Volt-

age must stay within the min/max values, including voltage drop, ripple, spikes.) The module shall work with supply voltages between 3.0 and 4.5V as normal voltage range. Normal condition, power control level for Pout max Normal condition, power control level for Pout max

@ f < 250 kHz

@ f > 250 kHz Maximum allowed voltage drop during transmit burst Voltage ripple 400 mV 120 90 mVpp mVpp t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 3.4 Power Supply 82 Page 74 of 121 Table 18: Current Consumption Ratings -GSM1 Description Conditions OFF State supply current POWER DOWN 2 IBATT+

(i.e., sum of BATT+BB and BATT+RF) GSM SLEEP State supply current SLEEP3 @ DRX=9

(no communication via UART) SLEEP3 @ DRX=5

(no communication via UART) SLEEP3 @ DRX=2

(no communication via UART) USB disconnected USB suspended USB disconnected USB suspended USB disconnected USB suspended GSM IDLE4 State supply current IDLE @ DRX=2

(UART active, but no communication) USB disconnected USB active Average GSM850 supply current5 GPRS Data transfer GSM850;

PCL=5; 1Tx/4Rx Typical rating

(W,EP,LA,J, I) Unit TBD TBD TBD TBD TBD TBD TBD TBD TBD 306 300 450 551 600 1005 187 189 270 330 418 583 A mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA ROPR=8

(max. reduction) ROPR=4

(no reduction) ROPR=8

(max. reduction) ROPR=4

(no reduction) ROPR=8

(max. reduction) ROPR=4

(no reduction) ROPR=8

(max. reduction) ROPR=4

(no reduction) ROPR=8

(max. reduction) ROPR=4

(no reduction) ROPR=8

(max. reduction) ROPR=4

(no reduction) GPRS Data transfer GSM850;

PCL=5; 2Tx/3Rx GPRS Data transfer GSM850;

PCL=5; 4Tx/1Rx EDGE Data transfer GSM850;

PCL=5; 1Tx/4Rx EDGE Data transfer GSM850;

PCL=5; 2Tx/3Rx EDGE Data transfer GSM850;

PCL=5; 4Tx/1Rx t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 3.4 Power Supply 82 Page 75 of 121 Table 18: Current Consumption Ratings -GSM1 Description Conditions 2 IBATT+

(i.e., sum of BATT+BB and BATT+RF) Average GSM900 supply current5 GPRS Data transfer GSM900;

PCL=5; 1Tx/4Rx Typical rating

(W,EP,LA,J, I) Unit 287 287 425 530 613 985 180 179 272 315 422 565 mA mA mA mA mA mA mA mA mA mA mA mA ROPR=8

(max. reduction) ROPR=4

(no reduction) ROPR=8

(max. reduction) ROPR=4

(no reduction) ROPR=8

(max. reduction) ROPR=4

(no reduction) ROPR=8

(max. reduction) ROPR=4

(no reduction) ROPR=8

(max. reduction) ROPR=4

(no reduction) ROPR=8

(max. reduction) ROPR=4

(no reduction) GPRS Data transfer GSM900;

PCL=5; 2Tx/3Rx GPRS Data transfer GSM900;

PCL=5; 4Tx/1Rx EDGE Data transfer GSM900;

PCL=5; 1Tx/4Rx EDGE Data transfer GSM900;

PCL=5; 2Tx/3Rx EDGE Data transfer GSM900;

PCL=5; 4Tx/1Rx t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 3.4 Power Supply 82 Page 76 of 121 Table 18: Current Consumption Ratings -GSM1 Description Conditions 2 IBATT+

(i.e., sum of BATT+BB and BATT+RF) Average GSM1800 supply current5 GPRS Data transfer GSM1800; PCL=0;

1Tx/4Rx Typical rating

(W,EP,LA,J, I) Unit 194 194 279 346 418 625 141 143 220 246 372 443 mA mA mA mA mA mA mA mA mA mA mA mA ROPR=8

(max. reduction) ROPR=4

(no reduction) ROPR=8

(max. reduction) ROPR=4

(no reduction) ROPR=8

(max. reduction) ROPR=4

(no reduction) ROPR=8

(max. reduction) ROPR=4

(no reduction) ROPR=8

(max. reduction) ROPR=4

(no reduction) ROPR=8

(max. reduction) ROPR=4

(no reduction) GPRS Data transfer GSM1800; PCL=0;

2Tx/3Rx GPRS Data transfer GSM1800; PCL=0;

4Tx/1Rx EDGE Data transfer GSM1800; PCL=0;

1Tx/4Rx EDGE Data transfer GSM1800; PCL=0;

2Tx/3Rx EDGE Data transfer GSM1800; PCL=0;

4Tx/1Rx t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 3.4 Power Supply 82 Page 77 of 121 Table 18: Current Consumption Ratings -GSM1 Description Conditions 2 IBATT+

(i.e., sum of BATT+BB and BATT+RF) Average GSM1900 supply current5 GPRS Data transfer GSM1900; PCL=0;

1Tx/4Rx ROPR=8

(max. reduction) ROPR=4

(no reduction) ROPR=8

(max. reduction) ROPR=4

(no reduction) ROPR=8

(max. reduction) ROPR=4

(no reduction) ROPR=8

(max. reduction) ROPR=4

(no reduction) ROPR=8

(max. reduction) ROPR=4

(no reduction) ROPR=8

(max. reduction) ROPR=4

(no reduction) GPRS Data transfer GSM1900; PCL=0;

2Tx/3Rx GPRS Data transfer GSM1900; PCL=0;

4Tx/1Rx EDGE Data transfer GSM1900; PCL=0;

1Tx/4Rx EDGE Data transfer GSM1900; PCL=0;

2Tx/3Rx EDGE Data transfer GSM1900; PCL=0;

4Tx/1Rx GPRS Data transfer GSM850; PCL=5; 1Tx/

1Rx @ 50 GPRS Data transfer GSM900; PCL=5; 1Tx/

1Rx @ 50 GPRS Data transfer DCS1800; PCL=0; 1Tx/

1Rx @ 50 GPRS Data transfer PCS1900; PCL=0; 1Tx/

1Rx @ 50 GPRS Data transfer GMS850; PCL=5; 1Tx/

1Rx @ total mismatch GPRS Data transfer GMS900; PCL=5; 1Tx/

1Rx @ total mismatch GPRS Data transfer DCS1800; PCL=0; 1Tx/

1Rx @ total mismatch GPRS Data transfer DCS1900; PCL=0; 1Tx/

1Rx @ total mismatch Typical rating

(W,EP,LA,J, I) Unit 190 185 270 332 410 615 139 142 216 246 372 448 2.2 2.2 1.4 1.4 2.8 2.9 1.7 1.8 mA mA mA mA mA mA mA mA mA mA mA mA A A A A A A A A Peak current during GSM transmit burst5 1. Note: Current consumption ratings are based on measurements done in a laboratory test environment, and deviations may occur from the given typical ratings. Under real life conditions however, with e.g., vary-

ing network quality, location changes, or changing supply currents, the deviations from these typical rat-

ings may be even bigger, and will have to be taken into account for actual power supply solutions. For more details on power supply design see [3]. 2. With an impedance of ZLOAD=50 at the antenna pad. Measured at 25C and 3.8V. t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 3.4 Power Supply 82 Page 78 of 121 3. Measurements start 6 minutes after switching ON the module, averaging times: SLEEP mode 3 minutes, transfer modes 1.5 minutes Communication tester settings:no neighbor cells, no cell reselection etc., RMC (Reference Measurement Channel) SLEEP mode is enabled via AT command AT^SPOW=2, 1000, 3 4. The power save mode is disabled via AT command AT^SPOW=1,0,0 5. The communication tester settings of Channel: Mid Channel Table 19: Current Consumption Ratings - UMTS1 Description Conditions 2 IBATT+

(i.e., sum of BATT+BB and BATT+RF) OFF State supply current UMTS SLEEP State supply current Typical rating

(W,EP,L A,J,I) Typical rating

(X, X2, X3, X4) Unit POWER DOWN TBD TBD A SLEEP3 @ DRX=9

(no communication via UART) SLEEP3 @ DRX=8

(no communication via UART) SLEEP3 @ DRX=6

(no communication via UART) USB disconnected USB suspended USB disconnected USB suspended USB disconnected USB suspended USB disconnected USB active UMTS IDLE4 State supply current IDLE @ DRX=6

(UART active, but no communication) UMTS average supply current 5 UMTS Data transfer Band I UMTS Data transfer Band II UMTS Data transfer Band III UMTS Data transfer Band IV UMTS Data transfer Band V UMTS Data transfer Band VI UMTS Data transfer Band VIII UMTS Data transfer Band XIX TBD TBD mA TBD TBD mA TBD TBD mA TBD TBD mA TBD TBD mA TBD TBD mA TBD TBD mA TBD TBD mA 560 530 480 530 500 500 530 485 600 710 690 mA mA mA mA mA mA mA mA 1. Note: Current consumption ratings are based on measurements done in a laboratory test environment, and deviations may occur from the given typical ratings. Under real life conditions however, with e.g., varying network quality, location changes, or changing supply currents, the deviations from these typical ratings may be even bigger, and will have to be taken into account for actual power supply solutions. For more details on power supply design see [3]. 2. With an impedance of ZLOAD=50 at the antenna pad. Measured at 25C and 3.8V. 3. Measurements start 6 minutes after switching ON the module, averaging times: SLEEP mode 3 minutes, transfer modes 1.5 minutes Communication tester settings:no neighbor cells, no cell reselection etc., RMC (Reference Measurement Channel) SLEEP mode is enabled via AT command AT^SPOW=2, 1000, 3 t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 3.4 Power Supply 82 Page 79 of 121 4. The power save mode is disabled via AT command AT^SPOW=1,0,0 5. The communication tester settings of Channel: Mid Channel The value is based on the latest test result and may have update in the future releases. t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 3.4 Power Supply 82 Page 80 of 121 Table 20: Current Consumption Ratings - LTE1 Description Conditions Unit Typical rating

(W,EP, LA,J,I) Typical rating

(X,X2,X 3,X4) OFF State supply current LTE SLEEP State supply current 2 IBATT+

(i.e., sum of BATT+

BB and BATT+

RF) POWER DOWN SLEEP3 @ Paging Cycles =

256

(no communication via UART) SLEEP3 @ Paging Cycles =

128

(no communication via UART) SLEEP3 @ Paging Cycles =

64

(no communication via UART) SLEEP3 @ Paging Cycles =

32

(no communication via UART) USB disconnected USB suspended USB disconnected USB suspended USB disconnected USB suspended USB disconnected USB suspended LTE IDLE4 State supply current LTE average supply cur-

rent5 IDLE (USB disconnected) IDLE (USB active) LTE Data transfer Band 1 LTE Data transfer Band 2 LTE Data transfer Band 3 LTE Data transfer Band 4 LTE Data transfer Band 5 LTE Data transfer Band 7(-W) LTE Data transfer Band 7(-EP, LA) TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD 600 610 550 560 540 750 610 660 640 615 630 515 545 615 620 600 385 380 385 615 A mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA 595 660 580 580 585 520 600 LTE Data transfer Band 8 LTE Data transfer Band 12 LTE Data transfer Band 13 LTE Data transfer Band 14 LTE Data transfer Band 17 LTE Data transfer Band 18 LTE Data transfer Band 19 LTE Data transfer Band 20 LTE Data transfer Band 25 LTE Data transfer Band 26 LTE Data transfer Band 28 LTE Data transfer Band 38 LTE Data transfer Band 40 LTE Data transfer Band 41 LTE Data transfer Band 66 LTE Data transfer Band 71 t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 3.4 Power Supply 82 Page 81 of 121 1. Note: Current consumption ratings are based on measurements done in a laboratory test environment, and deviations may occur from the given typical ratings. Under real life conditions however, with e.g., varying net-

work quality, location changes, or changing supply currents, the deviations from these typical ratings may be even bigger, and will have to be taken into account for actual power supply solutions. For more details on power supply design see [3]. 2. With an impedance of ZLOAD=50 at the antenna pad. Measured at 25C and 3.8V. 3. Measurements start 6 minutes after switching ON the module, averaging times: SLEEP mode 3 minutes, transfer modes 1.5 minutes Communication tester settings:no neighbor cells, no cell reselection etc., RMC (Reference Measurement Channel) SLEEP mode is enabled via AT command AT^SPOW=2, 1000, 3 4. The power save mode is disabled via AT command AT^SPOW=1,0,0 5. Communication tester setting:

Channel: Mid Channel Channel Bandwidth: 5MHz Number of Resource Blocks: 25 (DL), 1 (UL), RB position: Low Modulation: QPSK The value is based on the latest test result and may have update in the future releases. 3.4.2 Minimizing Power Losses If the module supports GSM, when designing the power supply for your application, please pay specific attention to power losses. Ensure that the input voltage VBATT+, never drops below 3.0V on the PLSx3 board, not even in a transmit burst where current consumption can rise to typical peaks. Any voltage drops that may occur in a transmit burst should not exceed 400mV to en-

sure the expected RF performance in 2G networks. For example, VImin=3.0V, Dmax=0.4V VBATTmin= VImin+Dmax=3.4V Figure 29: Power supply limits during transmit burst 3.4.3 Monitoring Power Supply by AT Command To monitor the supply voltage, you can use the AT^SBV command which returns the current value of the supply voltage using AT interface. t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 3.5 Operating Temperatures 82 3.5 Operating Temperatures Page 82 of 121 Table 21: Board Temperature Parameter Operating temperature range Restricted temperature range1 Automatic shutdown2 Typ Min

-30

-40

<-40 Max

+85

+95

+95 Unit C C C Temperature measured on PLSx3 board 1. Restricted operation allows normal mode data transmissions for limited time until automatic thermal shutdown takes effect. Within the restricted temperature range (outside the operating temperature range) the specified electrical characteristics may be in- or decreased. 2. Due to temperature measurement uncertainty, a tolerance on the stated shutdown thresholds may oc-

cur. The possible deviation is in the range of TBD C at the over temperature limit. Note: Within the specified operating temperature ranges the board temperature may vary to a great extent depending on operating mode, used frequency band, radio output power and current supply voltage. 3.6 Electrostatic Discharge The module is not protected against Electrostatic Discharge (ESD) in general. Consequently, it is subject to ESD handling precautions that typically apply to ESD sensitive components. Proper ESD handling and packaging procedures must be applied throughout the processing, handling and operation of any application that incorporates a PLSx3 module. An example for an enhanced ESD protection for the SIM interface is given in Section 2.1.6.1. PLSx3 has been tested according to the following standards. Electrostatic values can be gath-

ered from the following table. Table 22: Electrostatic values Specification/Requirement Contact discharge Air discharge ANSI/ESDA/JEDEC JS-001-2017 (Human Body Model) All LGA pads 1.0kV (HBM) JS-002-2018 (Charged Device Model) All LGA pads 250V (CDM) ETSI EN 301 489-1/7 BATT+

Antenna pads TBD TBD n.a. n.a. TBD 8kV t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 4 Mechanical Dimensions, Mounting and Packaging 99 Page 83 of 121 4 Mechanical Dimensions, Mounting and Packaging 4.1 Mechanical Dimensions of PLSx3 Figure 30 shows the top and bottom view of PLSx3 and provides an overview of the board's mechanical dimensions. For further details see Figure 31. t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 4.1 Mechanical Dimensions of PLSx3 99 Page 84 of 121 Top view Bottom View Figure 30: PLSx3 top and bottom view t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 4.1 Mechanical Dimensions of PLSx3 99 Page 85 of 121 Top view Figure 31: Dimensions of PLSx3 (all dimensions in mm) t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 4.1 Mechanical Dimensions of PLSx3 99 Page 86 of 121 Figure 32: Dimensions of PLSx3 (keepout area recommended) t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 4.2 Mounting PLSx3 onto the Application Platform 99 Page 87 of 121 4.2 Mounting PLSx3 onto the Application Platform This section describes how to mount PLSx3 onto the PCBs, including land pattern and stencil design, board-level characterization, soldering conditions, durability and mechanical handling. Note: To avoid short circuits between signal tracks on an external application's PCB and vari-

ous markings at the bottom side of the module, it is recommended not to route the signal tracks on the top layer of an external PCB directly under the module, or at least to ensure that signal track routes are sufficiently covered with solder resist. 4.2.1 SMT PCB Assembly 4.2.1.1 Land Pattern and Stencil The land pattern and stencil design as shown below is based on Thales characterizations for lead-free solder paste on a four-layer test PCB and a 110 respectively 150 micron thick stencil. The land pattern given in Figure 33 reflects the modules pad layout, including signal pads and ground pads (for pad assignment see Section 2.1.1). Figure 33: Land pattern (top view) The stencil designs illustrated in Figure 34 and Figure 35 are recommended by Thales as a re-

sult of extensive tests with Thales Daisy Chain modules. t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 4.2 Mounting PLSx3 onto the Application Platform 99 Page 88 of 121 Figure 34: Recommended design for 110 micron thick stencil (top view) Figure 35: Recommended design for 150 micron thick stencil (top view) t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 4.2 Mounting PLSx3 onto the Application Platform 99 4.2.1.2 Board Level Characterization Page 89 of 121 Board level characterization issues should also be taken into account if devising an SMT pro-

cess. Characterization tests should attempt to optimize the SMT process with regard to board level reliability. This can be done by performing the following physical tests on sample boards: Peel test, bend test, tensile pull test, drop shock test and temperature cycling. It is recommended to characterize land patterns before an actual PCB production, taking indi-

vidual processes, materials, equipment, stencil design, and reflow profile into account. For land and stencil pattern design recommendations see also Section 4.2.1.1. Optimizing the solder stencil pattern design and print process is necessary to ensure print uniformity, to decrease sol-

der voids, and to increase board level reliability. Generally, solder paste manufacturer recommendations for screen printing process parame-

ters and reflow profile conditions should be followed. Maximum ratings are described in Section 4.2.3. 4.2.2 Moisture Sensitivity Level PLSx3 comprises components that are susceptible to damage induced by absorbed moisture. Thaless PLSx3 module complies with the latest revision of the IPC/JEDEC J-STD-020 Stan-

dard for moisture sensitive surface mount devices and is classified as MSL 4. For additional moisture sensitivity level (MSL) related information see Section 4.2.4 and Sec-

tion 4.3.2. t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 4.2 Mounting PLSx3 onto the Application Platform 99 Page 90 of 121 4.2.3 Soldering Conditions and Temperature 4.2.3.1 Reflow Profile tP tL TP TL e r u t a r e p m e T TSmax TSmin tS Preheat t to maximum Time Table 23: Reflow temperature ratings1 Figure 36: Reflow Profile Profile Feature Pb-Free Assembly Preheat & Soak Temperature Minimum (TSmin) Temperature Maximum (TSmax) Time (tSmin to tSmax) (tS) Average ramp up rate (TL to TP) Liquidous temperature (TL) Time at liquidous (tL) 150C 200C 60-120 seconds 3K/second max.2 217C 50-90 seconds 245C 5C 30 seconds max. Peak package body temperature (TP) Time (tP) within 5 C of the peak package body tem-

perature (TP) Average ramp-down rate

- Limited ramp-down rate between 225C and 200C 6K/second max.2 3K/second max.2 Time 25C to maximum temperature 8 minutes max. 1. Please note that the reflow profile features and ratings listed above are based on the joint industry stan-

dard IPC/JEDEC J-STD-020D.1, and are as such meant as a general guideline. t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 4.2 Mounting PLSx3 onto the Application Platform 99 2. Temperatures measured on shielding at each corner. See also [3]. Page 91 of 121 Module 1 3 2 4 Temperature sensors (1-4) 4.2.3.2 Maximum Temperature and Duration The following limits are recommended for the SMT board-level soldering process to attach the module:

A maximum module temperature of 245C. This specifies the temperature as measured at the modules top side. A maximum duration of 30 seconds at this temperature. Ramp-down rate from TP to 200C should be controlled in order to reduce thermally induced stress during the solder solidification phase (see Table 23 - limited ramp-down rate). There-

fore, a cool-down step in the ovens temperature program between 200C and 180C should be considered. Please note that while the solder paste manufacturers' recommendations for best temperature and duration for solder reflow should generally be followed, the limits listed above must not be exceeded. PLSx3 is specified for one soldering cycle only. Once PLSx3 is removed from the application, the module will very likely be destroyed and cannot be soldered onto another application. t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 4.2 Mounting PLSx3 onto the Application Platform 99 4.2.4 Durability and Mechanical Handling 4.2.4.1 Storage Conditions Page 92 of 121 PLSx3 modules, as delivered in tape and reel carriers, must be stored in sealed, moisture barrier anti-static bags. The conditions stated below are only valid for modules in their original packed state in weather protected, non-temperature-controlled storage locations. Normal storage time under these conditions is 12 months maximum. Table 24: Storage conditions Type Condition Unit Reference Air temperature: Low High Humidity relative: Low High Air pressure: Low High 10 90 at 40C

-25

+40 70 106 1.0 IPC/JEDEC J-STD-033A IPC/JEDEC J-STD-033A IEC TR 60271-3-1: 1K4 IEC TR 60271-3-1: 1K4 IEC TR 60271-3-1: 1K4 C

kPa m/s

Movement of surrounding air Water: rain, dripping, icing and frosting Not allowed

Radiation:

Solar Heat 1120 600 W/m2 ETS 300 019-2-1: T1.2, IEC 60068-2-2 Bb ETS 300 019-2-1: T1.2, IEC 60068-2-2 Bb Chemically active substances IEC TR 60271-3-1: 1C1L Mechanically active substances Not IEC TR 60271-3-1: 1S1 Not recommended recommended 1.5 5 2-9 9-200 mm m/s2 Hz semi-sinusoidal 1 50 ms m/s2 IEC TR 60271-3-1: 1M2 IEC 60068-2-27 Ea Vibration sinusoidal:

Displacement Acceleration Frequency range Shocks:

Shock spectrum Duration Acceleration t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 4.2 Mounting PLSx3 onto the Application Platform 99 Page 93 of 121 4.2.4.2 Processing Life PLSx3 must be soldered to an application within 72 hours after opening the moisture barrier bag (MBB) it was stored in. As specified in the IPC/JEDEC J-STD-033 Standard, the manufacturing site processing the modules should have ambient temperatures below 30C and a relative humidity below 60%. 4.2.4.3 Baking Baking conditions are specified on the moisture sensitivity label attached to each MBB (see Figure 42 for details):

It is not necessary to bake PLSx3, if the conditions specified in Section 4.2.4.1 and Section 4.2.4.2 were not exceeded. It is necessary to bake PLSx3, if any condition specified in Section 4.2.4.1 and Section 4.2.4.2 was exceeded. If baking is necessary, the modules must be put into trays that can be baked to at least 125C. Devices should not be baked in tape and reel carriers at any temperature. 4.2.4.4 Electrostatic Discharge Electrostatic discharge (ESD) may lead to irreversable damage for the module. It is therefore advisable to develop measures and methods to counter ESD and to use these to control the electrostatic environment at manufacturing sites. Please refer to Section 3.6 for further information on electrostatic discharge. t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 4.3 Packaging 99 Page 94 of 121 4.3 Packaging 4.3.1 Tape and Reel 4.3.1.1 Orientation The single-feed tape carrier for PLSx3 is illustrated in Figure 37. The figure also shows the proper part orientation. The tape width is 44mm and the PLSx3 modules are placed on the tape with a 40mm pitch. The reels are 330mm in diameter with 100mm hubs. Each reel contains 400 modules. Figure 37: Carrier tape Figure 38: Reel direction t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 4.3 Packaging 99 Page 95 of 121 4.3.1.2 Barcode Label A barcode label provides detailed information on the tape and its contents. It is attached to the reel. Barcode label Figure 39: Barcode label on tape reel Figure 40: Barcode label on tape reel - layout Variables on the label are explained in Table 23. t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 4.3 Packaging 99 Page 96 of 121 4.3.2 Shipping Materials PLSx3 is distributed in tape and reel carriers. The tape and reel carriers used to distribute PLSx3 are packed as described below, including the following required shipping materials:

Moisture barrier bag, including desiccant and humidity indicator card Transportation box 4.3.2.1 Moisture Barrier Bag The tape reels are stored inside a moisture barrier bag (MBB), together with a humidity indica-

tor card and desiccant pouches - see Figure 41. The bag is ESD protected and delimits mois-

ture transmission. It is vacuum-sealed and should be handled carefully to avoid puncturing or tearing. The bag protects the PLSx3 modules from moisture exposure. It should not be opened until the devices are ready to be soldered onto the application. Figure 41: Moisture barrier bag (MBB) with imprint The label shown in Figure 42 summarizes requirements regarding moisture sensitivity, includ-

ing shelf life and baking requirements. It is attached to the outside of the moisture barrier bag. t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 4.3 Packaging 99 Page 97 of 121 Figure 42: Moisture Sensitivity Label t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 4.3 Packaging 99 Page 98 of 121 MBBs contain one or more desiccant pouches to absorb moisture that may be in the bag. The humidity indicator card described below should be used to determine whether the enclosed components have absorbed an excessive amount of moisture. The desiccant pouches should not be baked or reused once removed from the MBB. The humidity indicator card is a moisture indicator and is included in the MBB to show the ap-

proximate relative humidity level within the bag. Sample humidity cards are shown in Figure 43. If the components have been exposed to moisture above the recommended limits, the units will have to be rebaked. Figure 43: Humidity Indicator Card - HIC A baking is required if the humidity indicator inside the bag indicates 10% RH or more. t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 4.3 Packaging 99 4.3.2.2 Transportation Box Page 99 of 121 Tape and reel carriers are distributed in a box, marked with a barcode label for identification purposes. A box contains two reels with 400 (TBD for -X variant) modules each. 1 2 4 5 6 7 12 13 1 2 3 4 5 6 7 8 9 10 11 12 13 14 3 8 9 10 11 14 Figure 44: Sample of VP box label Table 25: VP Box label information No. Information Cinterion logo Product name Product ordering number Package ID number of VP box (format may vary depending on the product) Package ID barcode (Code 128) Package ID Reel 1 (format may vary depending on the product) Package ID Reel 2 (format may vary depending on the product) Quantity of the modules inside the VP box (max. 1000 pcs) Country of production Der Grne Punkt (Green Dot) symbol Chinese RoHS symbol (see Table 31) CE logo (CE mark on VP box label is present only for modules with CE imprinted on the shielding) European Article Number (EAN-13) barcode European Article Number, consists of 13 digits (EAN-13) t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 5 Regulatory and Type Approval Information 111 Page 100 of 121 5 Regulatory and Type Approval Information 5.1 Directives and Standards PLSx3 is designed to comply with the directives and standards listed below. It is the responsibility of the application manufacturer to ensure compliance of the final product with all provisions of the applicable directives and standards as well as with the technical spec-

ifications provided in the "PLSx3 Hardware Interface Description.1 Table 26: Directives 2014/53/EU Directive of the European Parliament and of the council of 16 April 2014 on the harmonization of the laws of the Member States relating to the making available on the market of radio equipment and repealing Directive 1999/

05/EC. 2002/95/EC (RoHS 1) 2011/65/EC (RoHS 2) The product is labeled with the CE conformity mark. Directive of the European Parliament and of the Council of 27 January 2003 (and revised on 8 June 2011) on the restriction of the use of certain hazardous substances in electrical and electronic equipment (RoHS) 1907/2006/EC (REACH) Regulation (EC) No 1907/2006 of the European Parliament and of the Council of 18 December 2006 concerning the Registration, Evaluation, Authorization and Restriction of Chemicals (REACH), establishing a Euro-

pean Chemicals Agency, amending Directive 1999/45/EC and repealing Council Regulation (EEC) No 793/93 and Commission Regulation (EC) No 1488/94 as well as Council Directive 76/769/EEC and Commission Direc-

tive 91/155/EEC, 93/67/EC and 2000/21/EC. Cinterion module comply with the REACH regulation that specifies a con-

tent of less than 0.1% per substance mentioned in the SVHC candidate list

(Release 16.06.2014) Table 27: Standards of North American type approval CFR Title 47 Code of Federal Regulations, Part 22, Part 24; US Equipment Authorization FCC OET Bulletin 65

(Edition 97-01) Evaluating Compliance with FCC Guidelines for Human Exposure to Radio frequency Electromagnetic Fields UL 60 950-1 Product Safety Certification (Safety requirements) NAPRD.03 V6.01 Overview of PCS Type certification review board Mobile Equipment Type Certification and IMEI control PCS Type Certification Review board (PTCRB) RSS132 (Issue2) RSS133 (Issue5) Canadian Standard 1. Manufacturers of applications which can be used in the US shall ensure that their applications have a PTCRB approval. For this purpose they can refer to the PTCRB approval of the respective module. t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 5.1 Directives and Standards 111 Page 101 of 121 Table 28: Standards of European type approval 3GPP TS 51.010-1 Digital cellular telecommunications system (Release 7); Mobile Station

(MS) conformance specification;

GCF-CC V3.79 Global Certification Forum - Certification Criteria ETSI EN 301 511 V12.5.1 Global System for Mobile communications (GSM); Mobile Stations (MS) equipment; Harmonized Standard covering the essential requirements of article 3.2 of Directive 2014/53/EU ETSI EN 301 908-01 V13.1.1 IMT cellular networks; Harmonized Standard covering the essential require-

ments of article 3.2 of the Directive 2014/53/EU; Part 1: Introduction and common requirements ETSI EN 301 908-02 V11.1.2 IMT cellular networks; Harmonized Standard covering the essential require-

ments of article 3.2 of the Directive 2014/53/EU; Part 2: CDMA Direct Spread (UTRA FDD) User Equipment (UE) ETSI EN 301 489-52 V1.1.0 Electromagnetic Compatibility (EMC) standard for radio equipment and ser-

vices; Part 52: Specific conditions for Cellular Communication Mobile and portable (UE) radio and ancillary equipment; Harmonized Standard cover-

ing the essential requirements of article 3.1(b) of Directive 2014/53/EU ETSI EN 301 908-13 V13.1.1 IMT cellular networks; Harmonized Standard covering the essential require-

ments of article 3.2 of the Directive 2014/53/EU; Part 13: evolved Universal Terrestrial Radio Access (E-UTRA) User Equipment (UE). Draft ETSI EN 301 489-

01 V2.2.3 ETSI EN 301489-19 V2.1.0 ETSI EN 303 413 V1.1.1 IEC 62368-1

(EN 62368-1, UL 62368-

1) Electromagnetic Compatibility (EMC) standard for radio equipment and ser-

vices; Part 1: Common technical requirements; Harmonized Standard cov-

ering the essential requirements of article 3.1(b) of Directive 2014/53/EU and the essential requirements of article 6 of Directive 2014/30/EU ElectroMagnetic Compatibility (EMC) standard for radio equipment and ser-

vices; Part 19: Specific conditions for Receive Only Mobile Earth Stations

(ROMES) operating in the 1,5 GHz band providing data communications and GNSS receivers operating in the RNSS band (ROGNSS) providing positioning, navigation, and timing data; Harmonised Standard covering the essential requirements of article 3.1(b) of Directive 2014/53/EU Satellite Earth Stations and Systems (SES); Global Navigation Satellite System (GNSS) receivers; Radio equipment operating in the 1 164 MHz to 1 300 MHz and 1 559 MHz to 1 610 MHz frequency bands; Harmonised Standard covering the essential requirements of article 3.2 of Directive 2014/53/EU Audio/video, information and communication technology equipment - Part 1: Safety requirements

(for details see Section 5.1.1) Table 29: Requirements of quality IEC 60068 Environmental testing DIN EN 60529 IP codes EN 62311:2008 Assessment of electronic and electrical equipment related to human expo-

sure restrictions for electromagnetic fields (0 Hz - 300 GHz) Table 30: Standards of the Ministry of Information Industry of the Peoples Republic of China SJ/T 11363-2006 Requirements for Concentration Limits for Certain Hazardous Sub-

stances in Electronic Information Products (2006-06). t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 5.1 Directives and Standards 111 Page 102 of 121 Table 30: Standards of the Ministry of Information Industry of the Peoples Republic of China SJ/T 11364-2006 Marking for Control of Pollution Caused by Electronic Information Products (2006-06). According to the Chinese Administration on the Control of Pollution caused by Electronic Information Products

(ACPEIP) the EPUP, i.e., Environmental Protection Use Period, of this product is 20 years as per the symbol shown here, unless otherwise marked. The EPUP is valid only as long as the product is operated within the operating limits described in the Thales Hardware Interface Description. Please see Table 31 for an overview of toxic or hazardous substances or elements that might be contained in product parts in concentrations above the limits defined by SJ/T 11363-2006. Table 31: Toxic or hazardous substances or elements with defined concentration limits t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 5.1 Directives and Standards 111 5.1.1 IEC 62368-1 Classification Page 103 of 121 With respect to the safety requirements for audio/video, information and communication tech-

nology equipment defined by the hazard based product safety standard for ICT and AV equip-

ment - i.e., IEC-62368-1 (EN 62368-1, UL 62368-1) - Cinterion modules are classified as shown below:

Standalone operation of the modules is not possible. Modules will always be incorporated in an external application (Customer Product). Customer understands and is responsible that the product incorporating the Cinterion module must be designed to be compliant with IEC-62368-1 (EN 62368-1, UL 62368-1) to ensure pro-

tection against hazards and injuries. When operating the Cinterion module the external appli-

cation (Customer Product) must provide safeguards not to exceed the power limits given by classification to Power Source Class 1 (15 Watts) under normal operating conditions, abnormal conditions, or in the presence of a single fault. When using a battery power supply the external application must provide safeguards not to exceed the limits defined by PS-1, as well. The ex-

ternal application (Customer Product) must take measures to limit the power, the voltage or the current, respectively, if required, and must provide safeguards to protect ordinary persons against pain or injury caused by the voltage/current. In case of a usage of the Cinterion module not in accordance with the specifications or in sin-

gle fault condition the external application (Customer Product) must be capable to withstand levels according to ES-1 / PS-1 also on all ports that are initially intended for signalling or audio, e.g., USB, RS-232, GPIOs, SPI, earphone and microphone interfaces. In addition, the external application (Customer Product) must be designed in a way to distribute thermal energy generated by the intended operation of the Cinterion module. In case of high temperature operation, the external application must provide safeguards to protect ordinary persons against pain or injury caused by the heat. Table 32: IEC 62368-1 Classification Source of Energy Electrical energy source Class ES-1 Limits The Cinterion modules contain no electrical energy source - especially no battery. The electri-

cal components and circuits have to be externally power supplied:

DC either smaller 60 V Or less than 2 mA AC up to 1kHz smaller 30 V-rms or 42.4 V peak AC above 100kHz smaller 70 V rms Power source provided by the external application must not exceed 15W, even under worst case and any single fault condition defined by IEC-62368-1:

Section 6.2.2.3. Power Source

(potential ignition source caus-

ing fire) PS-1 t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 5.1 Directives and Standards 111 Page 104 of 121 Table 32: IEC 62368-1 Classification Source of Energy Hazardous Substances, Chemical reaction Class

Limits Under regular conditions, the Cinterion modules does not contain any chemically reactive sub-

stances, and no chemical energy source, espe-

cially no battery. Module is compliant with RoHS and REACH. In very rare cases however - under abnormal con-

ditions 9i.e. wrong supply voltage, burned module) or in the presence of single electrical component faults (i.e. shortcut) - health hazardous sub-

stances might be released if the worst comes to the worst. The Cinterion modules have no sharp edges and corners, no moving parts, no loosing, exploding or imploding parts. The mass is well below 1kg. Under normal operating conditions, abnormal operating conditions or single fault conditions the temperature does not exceed +100C on the metal surface (shielding) The Cinterion module does not contain a radiant energy source, any lasers, lamps, LEDs, X-Ray emitting components or acoustic couplers. Kinetic / mechanical energy source MS-1 Thermal energy source TS-2 Note: Valid only for Cinterion modules with dimensions larger than 50mm and operating board temperatures higher than

+80C. Radiated energy source RS-1 Thermal energy source TS-3 Special safeguards required. t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 5.2 SAR requirements specific to portable mobiles 111 Page 105 of 121 5.2 SAR requirements specific to portable mobiles Mobile phones, PDAs or other portable transmitters and receivers incorporating a GSM/UMTS module must be in accordance with the guidelines for human exposure to radio frequency en-

ergy. This requires the Specific Absorption Rate (SAR) of portable PLSx3 based applications to be evaluated and approved for compliance with national and/or international regulations. Since the SAR value varies significantly with the individual product design manufacturers are advised to submit their product for approval if designed for portable use. For European/US/Aus-

tralian-markets the relevant directives are mentioned below. The manufacturer of the end de-

vice is in the responsibility to provide clear installation and operating instructions for the user, including the minimum separation distance required to maintain compliance with SAR and/or RF field strength limits, as well as any special usage conditions required to do so, such as a required accessory, the proper orientation of the device, the max antenna gain for detachable antennas, or other relevant criteria. It is the responsibility of the manufacturer of the final prod-

uct to verify whether or not further standards, recommendations or directives are in force out-

side these areas. Products intended for sale on US markets ES 59005/ANSI C95.1 Considerations for evaluation of human exposure to Electromagnetic Fields (EMFs) from Mobile Telecommunication Equipment (MTE) in the frequency range 30MHz - 6GHz Products intended for sale on European markets EN 50360 EN 62311:2008 Product standard to demonstrate the compliance of mobile phones with the basic restrictions related to human exposure to electromagnetic fields (300MHz - 3GHz) Assessment of electronic and electrical equipment related to human expo-sure restrictions for electromagnetic fields (0 Hz - 300 GHz) Please note that SAR requirements are specific only for portable devices and not for mobile devices as defined below:

Portable device:

A portable device is defined as a transmitting device designed to be used so that the radi-

ating structure(s) of the device is/are within 20 centimeters of the body of the user. Mobile device:

A mobile device is defined as a transmitting device designed to be used in other than fixed locations and to generally be used in such a way that a separation distance of at least 20 centimeters is normally maintained between the transmitter's radiating structure(s) and the body of the user or nearby persons. In this context, the term ''fixed location'' means that the device is physically secured at one location and is not able to be easily moved to another location. t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 5.3 Reference Equipment for Type Approval 111 Page 106 of 121 5.3 Reference Equipment for Type Approval The Thales reference setup submitted to type approve PLSx3 (including a special approval adapter for the DSB75) is shown in the following figure1:

LTE/GPRS/UMTS BaseStation Diversity Antenna Main Antenna USB ASC0 PC Power Supply AH6Adapter SIMCard SMA SMA SMA USB DSB75 Eval_Board Eval_Board PLS6x3 PLS6x3 Figure 45: Reference equipment for Type Approval 1. For RF performance tests a mini-SMT/U.FL to SMA adapter with attached 6dB coaxial attenuator is cho-

sen to connect the evaluation module directly to the GSM/UMTS test equipment instead of employing the SMA antenna connectors on the PLSx3-DSB75 adapter as shown in Figure 45. The following prod-

ucts are recommended:

Hirose SMA-Jack/U.FL-Plug conversion adapter HRMJ-U.FLP(40)

(for details see http://www.hirose-connectors.com/ or http://www.farnell.com/

Aeroflex Weinschel Fixed Coaxial Attenuator Model 3T/4T

(for details see http://www.aeroflex.com/ams/weinschel/pdfiles/wmod3&4T.pdf) t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 5.4 Compliance with FCC and ISED Rules and Regulations 111 Page 107 of 121 5.4 Compliance with FCC and ISED Rules and Regulations The Equipment Authorization Certification for the Thales reference application described in Section 5.3 will be registered under the following identifiers:

FCC Identifier: QIPPLS63-W Industry Canada Certification Number: 7830A-PLS63W Granted to THALES DIS AIS Deutschland GmbH FCC Identifier: QIPPLS83-W Industry Canada Certification Number: 7830A-PLS83W Granted to THALES DIS AIS Deutschland GmbH FCC Identifier: QIPPLS63-X Industry Canada Certification Number: 7830A-PLS63X Granted to THALES DIS AIS Deutschland GmbH FCC Identifier: QIPPLS83-X Industry Canada Certification Number: 7830A-PLS83X Granted to THALES DIS AIS Deutschland GmbH FCC Identifier: QIPPLS63-X2 Industry Canada Certification Number: 7830A-PLS63X2 Granted to THALES DIS AIS Deutschland GmbH FCC Identifier: QIPPLS83-X2 Industry Canada Certification Number: 7830A-PLS83X2 Granted to THALES DIS AIS Deutschland GmbH FCC Identifier: QIPPLS63-X3 Industry Canada Certification Number: 7830A-PLS63X3 Granted to THALES DIS AIS Deutschland GmbH FCC Identifier: QIPPLS83-X3 Industry Canada Certification Number: 7830A-PLS83X3 Granted to THALES DIS AIS Deutschland GmbH FCC Identifier: QIPPLS63-X4 Industry Canada Certification Number: 7830A-PLS63X4 Granted to THALES DIS AIS Deutschland GmbH FCC Identifier: QIPPLS83-X4 Industry Canada Certification Number: 7830A-PLS83X4 Granted to THALES DIS AIS Deutschland GmbH Manufacturers of mobile or fixed devices incorporating PLSx3 modules are authorized to use the FCC Grants and ISED Certificates of the PLSx3 modules for their own final products ac-

cording to the conditions referenced in these documents. In this case, an FCC/IC label of the module shall be visible from the outside, or the host device shall bear a second label stating

"Contains FCC ID: QIPPLS63-W, "Contains FCC ID: QIPPLS83-W, "Contains FCC ID: QIP-

PLS63-X, "Contains FCC ID: QIPPLS83-X, "Contains FCC ID: QIPPLS63-X2, "Contains FCC ID: QIPPLS83-X2, "Contains FCC ID: QIPPLS63-X3, "Contains FCC ID: QIPPLS83-X3, "Con-

t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 5.4 Compliance with FCC and ISED Rules and Regulations 111 Page 108 of 121 tains FCC ID: QIPPLS63-X4, "Contains FCC ID: QIPPLS83-X4, and accordingly Contains IC:

7830A-PLS63W, Contains IC: 7830A-PLS83W, Contains IC: 7830A-PLS63X, Contains IC:

7830A-PLS83X, Contains IC: 7830A-PLS63X2, Contains IC: 7830A-PLS83X2, Contains IC: 7830A-PLS63X3, Contains IC: 7830A-PLS83X3, Contains IC: 7830A-PLS63X4, Contains IC: 7830A-PLS83X4. The integration is limited to fixed or mobile categorized host devices, where a separation distance between the antenna and any person of min. 20cm can be assured during normal operating conditions. For mobile and fixed operation configuration the antenna gain, including cable loss, must not exceed the limits listed in the following Table 33 and Table 34 for FCC and ISED. Table 33: Antenna gain limits for FCC and ISED (for W and EP variants) Operation band FCC limit ISED limit Unit 8.60 10.20 5.30 10.20 Maximum gain in GSM/GPRS 850 Maximum gain in PCS 1900 Maximum gain in WCDMA Band 2 Maximum gain in WCDMA Band 4 Maximum gain in WCDMA Band 5 Maximum gain in LTE Band 2 Maximum gain in LTE Band 4 Maximum gain in LTE Band 5 Maximum gain in LTE Band 7 Maximum gain in LTE Band 12 Maximum gain in LTE Band 13 Maximum gain in LTE Band 26 Maximum gain in LTE Band 38 Maximum gain in LTE Band 41 Maximum gain in WCDMA Band 2 Maximum gain in WCDMA Band 4 Maximum gain in WCDMA Band 5 Maximum gain in LTE Band 2 Maximum gain in LTE Band 4 Maximum gain in LTE Band 5 Maximum gain in LTE Band 12 Maximum gain in LTE Band 13 Maximum gain in LTE Band 14 Maximum gain in LTE Band 25 8.01 5.00 9.40 8.01 5.00 9.40 8.01 8.70 9.16 9.30 8.01 8.01 8.01 5.00 9.40 8.01 5.00 9.40 8.70 9.16 9.23 8.01 dBi dBi dBi dBi dBi dBi dBi dBi dBi dBi dBi dBi dBi dBi dBi dBi dBi dBi dBi dBi dBi dBi dBi dBi dBi 8.01 5.00 6.10 8.01 5.00 6.10 8.01 5.61 5.93 6.10 8.01 8.01 8.01 5.00 6.10 8.01 5.00 6.10 5.61 5.93 N.A. 8.01 Maximum gain in LTE Band 66 5.00 Table 34: Antenna gain limits for FCC and ISED (for X, X2, X3, X4 variants) 5.00 Operation band FCC limit ISED limit Unit t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 5.4 Compliance with FCC and ISED Rules and Regulations 111 Page 109 of 121 Table 34: Antenna gain limits for FCC and ISED (for X, X2, X3, X4 variants) Operation band FCC limit ISED limit Maximum gain in LTE Band 26 Maximum gain in LTE Band 66 Maximum gain in LTE Band 71 9.30 5.00 8.48 6.10 5.00 5.45 Unit dBi dBi dBi IMPORTANT:

Manufacturers of portable applications incorporating PLSx3 modules are required to have their final product certified and apply for their own FCC Grant and ISED Certificate related to the specific portable mobile. This is mandatory to meet the SAR requirements for portable mobiles

(see Section Table 31: for detail). Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. Note: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules and with ISED license-exempt RSS standard(s). These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interfer-

ence to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or televi-

sion reception, which can be determined by turning the equipment off and on, the user is en-

couraged to try to correct the interference by one or more of the following measures:

Reorient or relocate the receiving antenna. Connect the equipment into an outlet on a circuit different from that to which the receiver is Increase the separation between the equipment and receiver. connected. Consult the dealer or an experienced radio/TV technician for help. This Class B digital apparatus complies with Canadian ICES-003. FCC Part 15.19 Warning Statement THIS DEVICE COMPLIES WITH PART 15 OF THE FCC RULES. OPERATION IS SUBJECT TO THE FOLLOWING TWO CONDITIONS: (1) THIS DEVICE MAY NOT CAUSE HARMFUL INTERFERENCE, AND (2) THIS DEVICE MUST ACCEPT ANY INTERFERENCE RECEIVED, INCLUDING INTERFERENCE THAT MAY CAUSE UNDESIRED OPERATION. If Canadian approval is requested for devices incorporating PLSx3 modules the below notes will have to be provided in the English and French language in the final user documentation. Manufacturers/OEM Integrators must ensure that the final user documentation does not con-

tain any information on how to install or remove the module from the final product. t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 5.4 Compliance with FCC and ISED Rules and Regulations 111 Page 110 of 121 Notes (ISED):

(EN) This Class B digital apparatus complies with Canadian ICES-003 and RSS-210. Opera-

tion is subject to the following two conditions: (1) this device may not cause interference, and

(2) this device must accept any interference, including interference that may cause undesired operation of the device.

(FR) Cet appareil numrique de classe B est conforme aux normes canadiennes ICES-003 et RSS-210. Son fonctionnement est soumis aux deux conditions suivantes: (1) cet appareil ne doit pas causer d'interfrence et (2) cet appareil doit accepter toute interfrence, notamment les interfrences qui peuvent affecter son fonctionnement.

(EN) Radio frequency (RF) Exposure Information The radiated output power of the Wireless Device is below the Innovation, Science and Economic Development Canada (ISED) radio frequency exposure limits. The Wireless Device should be used in such a manner such that the potential for human contact during normal operation is minimized. This device has also been evaluated and shown compliant with the ISED RF Exposure limits under mobile exposure conditions. (antennas at least 20cm from a persons body).

(FR) Informations concernant l'exposltion aux frquences radio (RF) La puissance de sortie mise par l'appareil de sans fiI est infrieure la limite d'exposition aux frquences radio dInnovation, Sciences et Dveloppement conomique Canada (ISDE). Utili-

sez l'appareil de sans fil de faon minimiser les contacts humains lors du fonctionnement nor-

mal. Ce priphrique a galement t valu et dmontr conforme aux limites d'exposition aux RF d'IC dans des conditions d'exposition des appareils mobiles (les antennes se situent moins de 20cm du corps d'une personne). t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 5.5 Compliance with Japanese Rules and Regulations 111 Page 111 of 121 5.5 Compliance with Japanese Rules and Regulations The PLSx3 reference application described in Section 5.3 complies with the requirements of the Japanese "Telecommunications Business Law" and "Ordinance Concerning Technical Regulations Conformity Certification of Specified Radio Equipment" as well as with the require-

ments of the Japanese "Radio Law" and "Ordinance Concerning Technical Conditions Compli-

ance Approval and Certification of the Type for Terminal Equipment". The certificate granted in accordance with the "Telecommunications Business Law" has the identifier:

AD204118217 (for -J) AD210086217 (for -W) 217-204182 (for -J) 217-210086 (for -W) The certificate granted in accordance with the "Radio Law" has the identifier:

Please refer to Figure 47 for the JATE/TELEC mark with identifiers:

Figure 46: JATE/TELEC mark for -J Figure 47: JATE/TELEC mark for -W t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 6 Document Information 117 6 Document Information 6.1 Revision History Page 111 of Proceeding document New document: "Cinterion PLSx3-W Hardware Interface Description"

Version 01.002 New document: "Cinterion PLSx3 Hardware Interface Description" Version 01.003 Chapter What is new 2.2 2.1.2 3.2.2.2 3.2.3 5.4 Updated Table 12. Updated the low level impulse. Updated Table 15 and added a note. Added Table 33 and Table 34. Proceeding document New document: "Cinterion PLSx3-W Hardware Interface Description"

Version 00.906a New document: "Cinterion PLSx3 Hardware Interface Description" Version 01.002 Chapter What is new Updated the supported product in the list. Added new products and the supported bands in Table 1. Added this section. Updated Table 19 and Table 20. Added this section. Updated Figure 23. New chapter regarding IEC 62368-1 Classification Added the supported products in Table 35. 1.1 1.2.1 3.4.2 3.4.1 3.3.4 3.2.1 5.1.1 7 Proceeding document New document: "Cinterion PLSx3-W Hardware Interface Description"

Version 00.906 New document: "Cinterion PLSx3 Hardware Interface Description" Version 00.906a Chapter What is new 1.2 Updated the extended operating temperature. Proceeding document New document: "Cinterion PLSx3-W Hardware Interface Description"

Version 00.024 New document: "Cinterion PLSx3 Hardware Interface Description" Version 00.906 Chapter What is new t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 6.1 Revision History 117 Page 112 of 2.1.3.1 2.1.9 2.1.10.3, 2.1.10.4 3.1 3.2.5 3.3 3.6 4.3.1.2 4.3.2.2 5 7.2 3.2.1 2.1.2 Add Reducing Power Consumption section. Added Analog-to-Digital Converter (ADC) section. Added Fast shutdown and Remove Wakeup sections. Added Operation Mode section. Added Automatic shutdown with sub sections. Added Power Saving section. Added Electrostatic Discharge section. Added Figure 40. Added Figure 44 and Table 25. Added chapter 6 Regulatory and Type Approval Information. Added Module Label Information section. Updated Figure 23 and the description of IGT signal. Updated Ignition signal description in Table 3. Proceeding document New document: "Cinterion PLSx3-W Hardware Interface Description"

Version 00.012 New document: "Cinterion PLSx3 Hardware Interface Description" Version 00.024 Chapter What is new Added new variants of -X, -EP, -LA and -J as well as their supported bands. Update the height of the module. Updated the pad assignment. Update the number of GPIO to 22. Updated Figure 8. Added the following chapters: 2.1.10.1, 2.2, 2.3, 2.4. Added Automatic Shutdown section. Updated power consumption. Added Operating Temperatures section. Removed TX-activity. Proceeding document New document: "Cinterion PLSx3-W Hardware Interface Description"

Version 00.002 New document: "Cinterion PLSx3-W Hardware Interface Description" Version 00.012 Chapter What is new Added the following new sections: 2.1.7, 2.1.8.1, 2.1.10, 2.1.6.1 Added the following new sections: 3.2.2, 3.2.4, 3.2.2 Added the following new sections: 4.2.4, 4.3 Updated the pad assignment Updated Figure 1 t PLSx3_HID_v01.003 2021-03-12 Public / Released

2 2.1.1 2.1.6 3.2.5 3.4.1 3.5

2 3 4 2.1.1 1.3 Cinterion PLSx3 Hardware Interface Description 6.2 Related Documents 117 Page 113 of Updated company name and logo.

Proceeding document New document: "Cinterion PLSx3-W Hardware Interface Description"

Version 00.001 New document: "Cinterion PLSx3-W Hardware Interface Description" Version 00.002 Chapter What is new Updated the Figure 2. 1.4 2.1 3 Added the following new sections: 2.1.3, 2.1.4 2.1.5, 2.1.6 Added section 3.2 New document: "Cinterion PLSx3-W Hardware Interface Description" Version 00.001 Chapter What is new

Initial document setup. 6.2 Related Documents

[1] PLSx3 AT Command Set

[2] PLSx3 Release Note

[3] Universal Serial Bus Specification Revision 2.0, April 27, 2000

[4] Application Note 48: SMT Module Integration

[5] Differences between Selected Cinterion Modules, Hardware Migration Guide 6.3 Terms and Abbreviations Abbreviation Description Analog-to-digital converter Automatic Gain Control American National Standards Institute ARFCN Absolute Radio Frequency Channel Number ARP Antenna Reference Point Thermistor Constant Bit Error Rate Bearer Independent Protocol Base Transceiver Station CB or CBM Cell Broadcast Message Conformit Europene (European Conformity) Challenge Handshake Authentication Protocol ADC AGC ANSI B BER BIP BTS CE CHAP ASC0/ASC1 Asynchronous Controller. Abbreviations used for first and second serial interface of PLSx3 t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 6.3 Terms and Abbreviations 117 Page 114 of Abbreviation Description dBm0 Digital level, 3.14dBm0 corresponds to full scale, see ITU G.711, A-law Data Communication Equipment (typically modems, e.g. Thales module) CPU CS CSD CTS DAC DCE DRX DSB DSP DSR DTR DTX EFR EIRP EMC ERP ESD ETS ETSI FCC FDMA FR GMSK GPIO HiZ HR I/O IC IMEI ISO ITU kbps LED Central Processing Unit Coding Scheme Circuit Switched Data Clear to Send Digital-to-Analog Converter Discontinuous Reception Development Support Box Digital Signal Processor Data Set Ready Data Terminal Ready Discontinuous Transmission Enhanced Full Rate Equivalent Isotropic Radiated Power Electromagnetic Compatibility Effective Radiated Power Electrostatic Discharge European Telecommunication Standard European Telecommunication Standards Institute Federal Communications Commission (U.S.) Frequency Division Multiple Access Full Rate Gaussian Minimum Shift Keying General Purpose Input/Output High Impedance Half Rate Input/Output Integrated Circuit International Mobile Equipment Identity International Standards Organization International Telecommunications Union kbits per second Light Emitting Diode Lithium-Ion Li-Ion/Li+

Li battery LPM Rechargeable Lithium Ion or Lithium Polymer battery Link Power Management t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 6.3 Terms and Abbreviations 117 Page 115 of Abbreviation Description Mbits per second Man Machine Interface Mobile Originated Mobile Station ( module), also referred to as TE MSISDN Mobile Station International ISDN number PBCCH Packet Switched Broadcast Control Channel Mbps MMI MO MS MT NTC OEM PA PAP PCB PCL PDU PLL PPP PSK PSU RAM RF RLS RMS RoHS ROM RTC RTS Rx SAR SAW SELV SIM SMD SMS SMT SPI PWM R&TTE Mobile Terminated Negative Temperature Coefficient Original Equipment Manufacturer Power Amplifier Password Authentication Protocol Printed Circuit Board Power Control Level Protocol Data Unit Phase Locked Loop Point-to-point protocol Phase Shift Keying Power Supply Unit Pulse Width Modulation Random Access Memory Radio Frequency Radio Link Stability Root Mean Square (value) Read-only Memory Real Time Clock Request to Send Receive Direction Specific Absorption Rate Surface Accoustic Wave Safety Extra Low Voltage Subscriber Identification Module Surface Mount Device Short Message Service Surface Mount Technology Serial Peripheral Interface Radio and Telecommunication Terminal Equipment Restriction of the use of certain hazardous substances in electrical and electronic equipment. t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 6.3 Terms and Abbreviations 117 Page 116 of Abbreviation Description SRAM TA TDMA TE TLS Tx UART URC USSD VSWR Static Random Access Memory Terminal adapter (e.g. module) Time Division Multiple Access Terminal Equipment, also referred to as DTE Transport Layer Security Transmit Direction Universal asynchronous receiver-transmitter Unsolicited Result Code Unstructured Supplementary Service Data Voltage Standing Wave Ratio t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 6.4 Safety Precaution Notes 117 6.4 Safety Precaution Notes Page 117 of The following safety precautions must be observed during all phases of the operation, usage, service or repair of any cellular terminal or mobile incorporating PLSx3. Manufacturers of the cellular terminal are advised to convey the following safety information to users and operating personnel and to incorporate these guidelines into all manuals supplied with the product. Fail-

ure to comply with these precautions violates safety standards of design, manufacture and in-

tended use of the product. Thales assumes no liability for customers failure to comply with these precautions. When in a hospital or other health care facility, observe the restrictions on the use of mobiles. Switch the cellular terminal or mobile off, if instructed to do so by the guide-

lines posted in sensitive areas. Medical equipment may be sensitive to RF energy. The operation of cardiac pacemakers, other implanted medical equipment and hear-

ing aids can be affected by interference from cellular terminals or mobiles placed close to the device. If in doubt about potential danger, contact the physician or the manufac-

turer of the device to verify that the equipment is properly shielded. Pacemaker patients are advised to keep their hand-held mobile away from the pacemaker, while it is on. Switch off the cellular terminal or mobile before boarding an aircraft. Make sure it can-

not be switched on inadvertently. The operation of wireless appliances in an aircraft is forbidden to prevent interference with communications systems. Failure to observe these instructions may lead to the suspension or denial of cellular services to the offender, legal action, or both. Do not operate the cellular terminal or mobile in the presence of flammable gases or fumes. Switch off the cellular terminal when you are near petrol stations, fuel depots, chemical plants or where blasting operations are in progress. Operation of any elec-

trical equipment in potentially explosive atmospheres can constitute a safety hazard. Your cellular terminal or mobile receives and transmits radio frequency energy while switched on. Remember that interference can occur if it is used close to TV sets, radios, computers or inadequately shielded equipment. Follow any special regulations and always switch off the cellular terminal or mobile wherever forbidden, or when you suspect that it may cause interference or danger. Road safety comes first! Do not use a hand-held cellular terminal or mobile when driv-

ing a vehicle, unless it is securely mounted in a holder for speakerphone operation. Before making a call with a hand-held terminal or mobile, park the vehicle. Speakerphones must be installed by qualified personnel. Faulty installation or opera-

tion can constitute a safety hazard. IMPORTANT!

Cellular terminals or mobiles operate using radio signals and cellular networks. Because of this, connection cannot be guaranteed at all times under all conditions. Therefore, you should never rely solely upon any wireless device for essential com-

munications, for example emergency calls. Remember, in order to make or receive calls, the cellular terminal or mobile must be switched on and in a service area with adequate cellular signal strength. Some networks do not allow for emergency calls if certain network services or phone features are in use (e.g. lock functions, fixed dialing etc.). You may need to deactivate those features before you can make an emergency call. Some networks require that a valid SIM card be properly inserted in the cellular termi-

nal or mobile. t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 7 Appendix Page 117 of 121 7 Appendix 7.1 List of Parts and Accessories Table 35: List of parts and accessories Description PLS63-X Supplier Ordering information Thales PLS83-X Thales PLS63-W Thales PLS83-W Thales PLS63-LA Thales PLS83-LA Thales PLS63-EP Thales PLS83-EP Thales PLS63-J Thales PLS83-J Thales PLS63-X2 Thales Standard module Thales IMEI:

Packaging unit (ordering) number: L30960-N6500-A100 Module label number: S30960-S6500-A100-11 Standard module Thales IMEI:

Packaging unit (ordering) number: L30960-N6510-A100 Module label number: S30960-S6510-A100-1 Standard module Thales IMEI:

Packaging unit (ordering) number: L30960-N6520-A100 Module label number: S30960-S6520-A100-1 Standard module Thales IMEI:

Packaging unit (ordering) number: L30960-N6530-A100 Module label number1: S30960-S6530-A100-1 Standard module Thales IMEI:

Packaging unit (ordering) number: L30960-N6540-A100 Module label number: S30960-S6540-A100-1 Standard module Thales IMEI:

Packaging unit (ordering) number: L30960-N6550-A100 Module label number: S30960-S6550-A100-1 Standard module Thales IMEI:

Packaging unit (ordering) number: L30960-N6560-A100 Module label number: S30960-S6560-A100-1 Standard module Thales IMEI:

Packaging unit (ordering) number: L30960-N6570-A100 Module label number: S30960-S6570-A100-1 Standard module Thales IMEI:

Packaging unit (ordering) number: L30960-N6580-A100 Module label number: S30960-S6580-A100-1 Standard module Thales IMEI:

Packaging unit (ordering) number: L30960-N6590-A100 Module label number: S30960-S6590-A100-1 Standard module Thales IMEI:

Packaging unit (ordering) number: L30960-N6506-A100 Module label number: S30960-S6506-A100-1 t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 7.1 List of Parts and Accessories Page 118 of 121 Table 35: List of parts and accessories Description PLS83-X2 Supplier Ordering information Thales PLS63-X3 Thales PLS83-X3 Thales PLS63-X4 Thales PLS83-X4 Thales PLS63-I Thales PLS83-I Thales Standard module Thales IMEI:

Packaging unit (ordering) number: L30960-N6516-A100 Module label number: S30960-S6516-A100-1 Standard module Thales IMEI:

Packaging unit (ordering) number: L30960-N6508-A100 Module label number: S30960-S6508-A100-1 Standard module Thales IMEI:

Packaging unit (ordering) number: L30960-N6518-A100 Module label number: S30960-S6518-A100-1 Standard module Thales IMEI:

Packaging unit (ordering) number: L30960-N6512-A100 Module label number: S30960-S6512-A100-1 Standard module Thales IMEI:

Packaging unit (ordering) number: L30960-N6522-A100 Module label number: S30960-S6522-A100-1 Standard module Thales IMEI:

Packaging unit (ordering) number: L30960-N6526-A100 Module label number: S30960-S6526-A100-1 Standard module Thales IMEI:

Packaging unit (ordering) number: L30960-N6536-A100 Module label number: S30960-S6536-A100-1 PLS63-X Evaluation Module Thales Ordering number: L30960-N6501-A100 PLS83-X Evaluation Module Thales Ordering number: L30960-N6511-A100 PLS63-W Evaluation Module Thales Ordering number: L30960-N6521-A100 PLS83-W Evaluation Module Thales Ordering number: L30960-N6531-A100 PLS63-LA Evaluation Module Thales Ordering number: L30960-N6541-A100 PLS83-LA Evaluation Module Thales Ordering number: L30960-N6551-A100 PLS63-EP Evaluation Module Thales Ordering number: L30960-N6561-A100 PLS83-EP Evaluation Module Thales Ordering number: L30960-N6571-A100 PLS63-J Evaluation Module Thales Ordering number: L30960-N6581-A100 PLS83-J Evaluation Module Thales Ordering number: L30960-N6591-A100 PLS63-X2 Evaluation Module Thales Ordering number: L30960-N6507-A100 PLS83-X2 Evaluation Module Thales Ordering number: L30960-N6517-A100 PLS63-X3 Evaluation Module Thales Ordering number: L30960-N6509-A100 PLS83-X3 Evaluation Module Thales Ordering number: L30960-N6519-A100 PLS63-X4 Evaluation Module Thales Ordering number: L30960-N6513-A100 PLS83-X4 Evaluation Module Thales Ordering number: L30960-N6523-A100 t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 7.1 List of Parts and Accessories Page 119 of 121 Table 35: List of parts and accessories Description Supplier Ordering information PLS63-I Evaluation Module Thales Ordering number: L30960-N6527-A100 PLS83-I Evaluation Module Thales Ordering number: L30960-N6537-A100 DSB-mini Ordering number: L30960-N0030-A100 DSB75 Evaluation Kit Ordering number: L36880-N8811-A100 Ordering number: L30960-N0100-A100 Thales Thales Thales EVAL DSB Adapter for mounting PLSx3 evaluation modules onto DSB75 LGA DevKit Thales LGA DevKit consists of Cinterion LGA DevKit L Base PCB:

Ordering number: L30960-N0112-A100 Cinterion LGA DevKit Socket SML:

Ordering number: L30960-N0110-A100 1. Note: At the discretion of Thales, module label information can either be laser engraved on the modules shielding or be printed on a label adhered to the modules shielding. Table 36: Molex sales contacts (subject to change) Molex For further information please click:

http://www.molex.com Molex China Distributors Beijing, Room 1311, Tower B, COFCO Plaza No. 8, Jian Guo Men Nei Street, 100005 Beijing P.R. China Phone: +86-10-6526-9628 Fax: +86-10-6526-9730 Molex Deutschland GmbH Otto-Hahn-Str. 1b 69190 Walldorf Germany Phone: +49-6227-3091-0 Fax: +49-6227-3091-8100 Email: mxgermany@molex.com Molex Singapore Pte. Ltd. 110, International Road Jurong Town, Singapore 629174 American Headquarters Lisle, Illinois 60532 U.S.A. Phone: +1-800-78MOLEX Fax: +1-630-969-1352 Molex Japan Co. Ltd. 1-5-4 Fukami-Higashi, Yamato-City, Kanagawa, 242-8585 Japan Phone: +65-6-268-6868 Fax: +65-6-265-6044 Phone: +81-46-265-2325 Fax: +81-46-265-2365 t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 7.2 Module Label Information Page 120 of 121 7.2 Module Label Information The label engraved on the top of PLSx3 comprises the following information. 4 8 1 5 2 3 6 7 Table 37: PLSx3 label information Figure 48: PLSx3 Label No. 1 2 3 4 5 6 7 8 Cinterion logo Manufacturing country (e.g., Made in China) Factory Code Product name/variant Product order code Manufacturer 2D barcode Product IMEI 2-digital date code of product production (for decoding see Table below) Table 38: Date code table Code L Code 1 M 2 N 3 P 4 Date Code R 5 S 6 T 7 U 8 V 9 W O X N A D Year 2019 2020 2021 2022 2023 2024 2025 2026 2027 2028 2029 2030 Month Jan. Feb. Mar. Apr. May June July Aug. Sept. Oct. Nov. Dec. t PLSx3_HID_v01.003 2021-03-12 Public / Released 122 122 THALES DIS AIS Deutschland GmbH Werinherstrasse 81 81541 Munich Germany i

. s e i r t n u o c n a t r e c n i d e r e t s g e r e r a d n a s e a h T i l i f o s k r a m e c v r e s d n a s k r a m e d a r t e r a

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CINTERION IS30960-S6518-A100-1 Model: PLS83-X3|

Made in China S De ies cSAL us

[i IC: 7830A-PLS83X3 FCC ID:QIPPLS83-x3

$L1111111 222222 3 eg

 

 

THALES DIS AIS Deutschland GmbH Siemensdamm 50 13629 Berlin Germany Federal Communications Commission Equipment Authorization Division, Application Processing Branch 7435 Oakland Mills Road Columbia MD 21046 USA THALES DIS AIS Deutschland GmbH Siemensdamm 50 13629 Berlin Germany Contact person: Axel Heike E-mail: axel.heike@thalesgroup.com Tel: +49 30 31102-8146 10 March 2021 LONG-TERM CONFIDENTIALITY REQUEST TO WHOM lT MAY CONCERN Pursuant to Paragraphs 0.457 and 0.459 of the Commissions Rules (47 C.F.R.) and Section 552(b)(4) of the Freedom of Information Act, THALES DIS AIS Deutschland GmbH requests confidentiality for the following product:

FCC ID Number Product Title/Model PLS83-X3 QIPPLS83-X3 For the product stated above, we request that the following information be held confidential:

1. Block Diagram 2. Schematic Diagram 3. Part List / Tune Up Procedure These items contain detailed system and equipment description and related information about the product which THALES DIS AIS Deutschland GmbH considers to be proprietary, confidential and a custom design which otherwise would only be released to qualified tech and is not released to the general public. Since this design is a basis from which future technological product will evolve, THALES DIS AIS Deutschland GmbH also feels that this information would be of benefit to its competitors, and that the disclosure of the information in these exhibits would give our competitors an unfair advantage in the market. Sincerely, X HEIKE Axel Certification Project Manager Signed by: HEIKE Axel 11.03.2021 11/03/2021 X Leandro Wan-Dall Head of Certification Management Signed by: WAN-DALL Leandro THALES DIS AIS Deutschland GmbH Registered Office: M nchen - Amtsgericht M nchen, HRB 172715 WEEE-Reg.-Nr. DE 58893809 Managing Director: Andreas Haegele

 

 

THALES DIS AIS Deutschland GmbH Siemensdamm 50 13629 Berlin Germany Federal Communications Commission Equipment Authorization Division, Application Processing Branch 7435 Oakland Mills Road Columbia MD 21046 USA THALES DIS AIS Deutschland GmbH Siemensdamm 50 13629 Berlin Germany Contact person: Axel Heike E-mail: axel.heike@thalesgroup.com Tel: +49 30 31102-8146 11 March 2021 SHORT-TERM CONFIDENTIALITY REQUEST TO WHOM IT MAY CONCERN Pursuant to Paragraphs 0.457 and 0.459 of the Commissions Rules (47 C.F.R.) and Section 552(b)(4) of the Freedom of Information Act, THALES DIS AIS Deutschland GmbH requests confidentiality for the following product:

FCC ID Number Product Title/Model PLS83-X3 QIPPLS83-X3 For the product stated above, we request that the following information be held confidential:

1. Test Setup Photos 2. External and Internal Photographs THALES DIS AIS Deutschland GmbH requests this confidentiality on the basis of ensuring that business sensitive information remains confidential until the actual marketing of our new device, which is planned tor 31th of Aug 2021. If you have any questions, please feel free to contact us at the address shown above. Sincerely, X Axel Heike Certification Project Manager Signed by: HEIKE Axel 11.03.2021 11/03/2021 X Leandro Wan-Dall Head of Certification Management Signed by: WAN-DALL Leandro THALES DIS AIS Deutschland GmbH Registered Office: M nchen - Amtsgericht M nchen, HRB 172715 WEEE-Reg.-Nr. DE 58893809 Managing Director: Andreas Haegele

 

 

THALES DIS AIS Deutschland GmbH Siemensdamm 50 13629 Berlin Germany Federal Communications Commission Equipment Authorization Division, Application Processing Branch 7435 Oakland Mills Road Columbia MD 21046 USA THALES DIS AIS Deutschland GmbH Siemensdamm 50 13629 Berlin Germany Contact person: Axel Heike E-mail: axel.heike@thalesgroup.com Tel: +49 30 31102-8146 08 March 2021 Ref: FCC Modular approval letter for FCC ID: QIPPLS83-X3 TO WHOM lT MAY CONCERN The following attestation addresses the requirements to support modular approval pursuant to 15.212 of the Commissions Rules:

Modular approval requirement

(i) The radio elements of the modular transmitter must have their own shielding. The physical crystal and tuning capacitors may be located external to the shielded radio elements.

(ii) The modular transmitter must have buffered modulation/data inputs (if such in-

puts are provided) to ensure that the module will comply with part 15 requirements under conditions of excessive data rates or over-modulation.

(iii) The modular transmitter must have its own power supply regulation.

(iv) The modular transmitter must comply with the antenna and transmission system requirements of 1 5.203, 1 5.204(b) and 15.204(c). The antenna must either be permanently attached or employ a unique antenna coupler (at all connections be-

tween the module and the antenna, including the cable). The professional installa-

tion provision of 1 5.203 is not applicable to modules but can apply to limited mod-

ular approvals under paragraph (b) of this section.

(v) The modular transmitter must be tested in a stand-alone configuration, i.e., the module must not be inside another device during testing for compliance with part 15 requirements. Unless the transmitter module will be battery powered, it must comply with the AC line conducted requirements found in 1 5.207. AC or DC power lines and data input/output lines connected to the module must not contain ferrites, unless they will be marketed with the module (see 15.27(a)). The length of these lines shall be the length typical of actual use or, if that length is unknown, at least 10 cen-

timeters to insure that there is no coupling between the case of the module and sup-

porting equipment. Any accessories, peripherals, or support equipment connected to Yes No*

X X X X X THALES DIS AIS Deutschland GmbH Registered Office: M nchen - Amtsgericht M nchen, HRB 172715 WEEE-Reg.-Nr. DE 58893809 Managing Director: Andreas Haegele the module during testing shall be unmodified and commercially available (see 15.31(i)).

(vi) The modular transmitter must be equipped with either a permanently affixed la-

bel or must be capable of electronically displaying its FCC identification number.

(vii) The modular transmitter must comply with any specific rules or operating re-

quirements that ordinarily apply to a complete transmitter and the manufacturer must provide adequate instructions along with the module to explain any such re-

quirements. A copy of these instructions must be included in the application for equipment authorization.

(viii) The modular transmitter must comply with any applicable RF exposure require-

ments in its final configuration.

* Shall provide a detailed explanation if the answer is No. If you have any questions, please feel free to contact us at the address shown above. X X X Sincerely, X Axel Heike Certification Project Manager Signed by: HEIKE Axel 11.03.2021 11/03/2021 X Leandro Wan-Dall Head of Certification Management Signed by: WAN-DALL Leandro

 

 

Cinterion PLSx3 Hardware Interface Description Version:

DocId:

01.003 PLSx3_HID_v01.003 Cinterion PLSx3 Hardware Interface Description Page 2 of 121 2 Document Name: Cinterion PLSx3 Hardware Interface Description Version:

01.003 Date:

DocId:

Status 2021-03-12 PLSx3_HID_v01.003 Public / Released GENERAL NOTE THIS DOCUMENT CONTAINS INFORMATION ON THALES DIS AIS DEUTSCHLAND GMBH

(THALES) PRODUCTS. THALES RESERVES THE RIGHT TO MAKE CHANGES TO THE PROD-

UCTS DESCRIBED HEREIN. THE SPECIFICATIONS IN THIS DOCUMENT ARE SUBJECT TO CHANGE AT THE DISCRETION OF THALES. THE PRODUCT AND THIS DOCUMENT ARE PRO-

VIDED ON AN "AS IS" BASIS ONLY AND MAY CONTAIN DEFICIENCIES OR INADEQUACIES. THALES DOES NOT ASSUME ANY LIABILITY FOR INFORMATION PROVIDED IN THE DOCUMENT OR ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT DESCRIBED HEREIN. THALES GRANTS A NON-EXCLUSIVE RIGHT TO USE THE DOCUMENT. THE RECIPIENT SHALL NOT COPY, MODIFY, DISCLOSE OR REPRODUCE THE DOCUMENT EXCEPT AS SPECIFICALLY AUTHORIZED BY THALES. Copyright 2021, THALES DIS AIS Deutschland GmbH Trademark Notice Thales, the Thales logo, are trademarks and service marks of Thales and are registered in certain coun-

tries. Microsoft and Windows are either registered trademarks or trademarks of Microsoft Corporation in the United States and/or other countries. All other registered trademarks or trademarks mentioned in this document are property of their respective owners. t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description Contents 122 Page 3 of 122 Contents 1 2 Introduction ................................................................................................................. 8 Product Variants ................................................................................................ 8 1.1 Key Features at a Glance .................................................................................. 8 1.2 1.2.1 Supported Frequency Bands .............................................................. 13 PLSx3 System Overview ................................................................................. 15 Circuit Concept ................................................................................................ 16 1.3 1.4 Interface Characteristics .......................................................................................... 17 Application Interface ........................................................................................ 17 2.1 Pad Assignment.................................................................................. 17 2.1.1 Signal Properties................................................................................. 21 2.1.2 2.1.2.1 Absolute Maximum Ratings ................................................ 26 2.1.3 USB Interface...................................................................................... 27 2.1.3.1 Reducing Power Consumption............................................ 28 Serial Interface ASC0 ......................................................................... 29 2.1.4 2.1.5 Serial Interface ASC1 ......................................................................... 30 2.1.6 UICC/SIM/USIM Interface................................................................... 31 2.1.6.1 Enhanced ESD Protection for SIM Interface ....................... 33 2.1.6.2 SIM_SWITCH Line.............................................................. 34 2.1.7 GPIO Interface .................................................................................... 35 2.1.8 Digital Audio Interface......................................................................... 35 2.1.8.1 Pulse Code Modulation Interface ........................................ 36 2.1.8.2 Inter-IC Sound Interface...................................................... 36 2.1.9 Analog-to-Digital Converter (ADC)...................................................... 37 2.1.10 Control Signals.................................................................................... 37 2.1.10.1 Status LED .......................................................................... 37 2.1.10.2 Power Indication.................................................................. 38 2.1.10.3 Fast Shutdown .................................................................... 39 2.1.10.4 Remote Wakeup.................................................................. 40 RF Antenna Interface....................................................................................... 41 2.2.1 Antenna Interface Specifications ........................................................ 42 Antenna Installation ............................................................................ 52 2.2.2 2.2.3 RF Line Routing Design...................................................................... 53 2.2.3.1 Line Arrangement Examples ............................................... 53 2.2.3.2 Routing Example................................................................. 55 GNSS Antenna Interface ................................................................................. 57 2.3.1 GNSS Antenna Diagnostic.................................................................. 58 Sample Application .......................................................................................... 59 2.2 2.3 2.4 3 Operating Characteristics ........................................................................................ 61 Operating Modes ............................................................................................. 61 3.1 Power Up/Power Down Scenarios ................................................................... 62 3.2 3.2.1 Turn on PLSx3 .................................................................................... 62 3.2.2 Restart PLSx3..................................................................................... 62 t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description Contents 122 Page 4 of 122 3.3 3.4 3.5 3.6 4 3.2.5 3.2.3 3.2.4 3.2.2.1 Restart PLSx3 Using Restart Command............................. 62 3.2.2.2 Restart PLSx3 Using EMERG_RST.................................... 63 Signal States after Startup .................................................................. 64 Turn off PLSx3 .................................................................................... 65 3.2.4.1 Switch off PLSx3 Using AT Command ................................ 65 Automatic Shutdown ........................................................................... 65 Thermal Shutdown .............................................................. 65 3.2.5.1 3.2.5.2 Undervoltage Shutdown...................................................... 67 3.2.5.3 Overvoltage Shutdown........................................................ 67 3.2.5.4 Deferred Shutdown at Extreme Temperature Condition...... 68 Power Saving................................................................................................... 68 Power Saving while Attached to GSM Networks ................................ 68 3.3.1 Power Saving while Attached to WCDMA Networks .......................... 69 3.3.2 3.3.3 Power Saving while Attached to LTE Networks .................................. 70 3.3.4 Wake-up via RTS0.............................................................................. 71 Power Supply................................................................................................... 72 Power Supply Ratings......................................................................... 73 3.4.1 3.4.2 Minimizing Power Losses ................................................................... 81 3.4.3 Monitoring Power Supply by AT Command ........................................ 81 Operating Temperatures.................................................................................. 82 Electrostatic Discharge .................................................................................... 82 Mechanical Dimensions, Mounting and Packaging............................................... 83 Mechanical Dimensions of PLSx3 ................................................................... 83 4.1 Mounting PLSx3 onto the Application Platform................................................ 87 4.2 SMT PCB Assembly ........................................................................... 87 4.2.1 Land Pattern and Stencil..................................................... 87 4.2.1.1 4.2.1.2 Board Level Characterization.............................................. 89 4.2.2 Moisture Sensitivity Level ................................................................... 89 Soldering Conditions and Temperature .............................................. 90 4.2.3 4.2.3.1 Reflow Profile ...................................................................... 90 4.2.3.2 Maximum Temperature and Duration .................................. 91 4.2.4 Durability and Mechanical Handling.................................................... 92 4.2.4.1 Storage Conditions.............................................................. 92 4.2.4.2 Processing Life.................................................................... 93 4.2.4.3 Baking ................................................................................. 93 4.2.4.4 Electrostatic Discharge ....................................................... 93 Packaging ........................................................................................................ 94 Tape and Reel .................................................................................... 94 4.3.1 4.3.1.1 Orientation........................................................................... 94 4.3.1.2 Barcode Label ..................................................................... 95 Shipping Materials .............................................................................. 96 4.3.2.1 Moisture Barrier Bag ........................................................... 96 Transportation Box .............................................................. 99 4.3.2.2 4.3.2 4.3 t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description Contents 122 Page 5 of 122 5 6 7 Regulatory and Type Approval Information ......................................................... 100 Directives and Standards............................................................................... 100 5.1 IEC 62368-1 Classification................................................................ 102 5.1.1 SAR requirements specific to portable mobiles ............................................. 104 Reference Equipment for Type Approval ....................................................... 105 Compliance with FCC and ISED Rules and Regulations............................... 106 Compliance with Japanese Rules and Regulations ....................................... 109 5.2 5.3 5.4 5.5 Document Information............................................................................................ 110 Revision History ............................................................................................. 110 6.1 Related Documents ....................................................................................... 112 6.2 Related Documents ....................................................................................... 112 6.3 Terms and Abbreviations ............................................................................... 112 6.4 Safety Precaution Notes ................................................................................ 116 6.5 Appendix.................................................................................................................. 117 List of Parts and Accessories......................................................................... 117 7.1 Module Label Information .............................................................................. 120 7.2 t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description Tables Page 6 of 122 Tables Table 1:

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Supported frequency bands for each PLSx3 variant...................................... 13 Overview: Pad assignments........................................................................... 18 Signal properties ............................................................................................ 21 Absolute maximum ratings............................................................................. 26 Signals of the SIM interface (SMT application interface) ............................... 31 GPIO lines and possible alternative assignment............................................ 35 Overview of PCM pin functions ...................................................................... 36 Overview of I2S pin functions ......................................................................... 37 Remote wakeup lines..................................................................................... 40 Return loss in the active band........................................................................ 41 RF Antenna interface GSM/UMTS/LTE ......................................................... 42 RF Antenna interface LTE for -J variant (at operating temperature range).... 51 Sample ranges of the GNSS antenna diagnostic measurements and their possible meaning ........................................................................................... 58 Overview of operating modes ........................................................................ 61 Pull-up and Pull-down Values ........................................................................ 64 Temperature associated URCs...................................................................... 66 Supply Ratings ............................................................................................... 73 Current Consumption Ratings -GSM ............................................................. 74 Current Consumption Ratings - UMTS .......................................................... 78 Current Consumption Ratings - LTE .............................................................. 80 Board Temperature ........................................................................................ 82 Electrostatic values ........................................................................................ 82 Reflow temperature ratings ............................................................................ 90 Storage conditions ......................................................................................... 92 VP Box label information................................................................................ 99 Directives ..................................................................................................... 100 Standards of North American type approval ................................................ 100 Standards of European type approval.......................................................... 101 Requirements of quality ............................................................................... 101 Standards of the Ministry of Information Industry of the Peoples Republic of China .......................................................................... 101 Toxic or hazardous substances or elements with defined concentration limits ............................................................................................................. 102 IEC 62368-1 Classification........................................................................... 103 Antenna gain limits for FCC and ISED (for W and EP variants) .................. 107 Antenna gain limits for FCC and ISED (for X, X2, X3, X4 variants) ............. 107 List of parts and accessories........................................................................ 118 Molex sales contacts (subject to change) .................................................... 120 PLSx3 label information ............................................................................... 121 Date code table ............................................................................................ 121 t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description Figures Page 7 of 122 Figures Figure 1:

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Figure 47:

Figure 48:

PLSx3 system overview ................................................................................. 15 PLSx3 block diagram ..................................................................................... 16 PLSx3 bottom view: Pad assignments........................................................... 19 PLSx3 top view: Pad assignments................................................................. 20 USB circuit ..................................................................................................... 27 Serial interface ASC0..................................................................................... 29 Serial interface ASC1..................................................................................... 30 Modules two UICC/SIM/USIM interfaces ...................................................... 32 UICC/SIM/USIM interfaces connected........................................................... 32 SIM interface - enhanced ESD protection...................................................... 33 External UICC/SIM/USIM switch.................................................................... 34 Sample circuit for SIM interface connection via SIM switch........................... 34 Status signaling with LED driver .................................................................... 37 Power indication signal .................................................................................. 38 Fast shutdown timing ..................................................................................... 39 Antenna pads (bottom view) .......................................................................... 52 Embedded stripline arrangement example .................................................... 53 Micro-Stripline arrangement example ............................................................ 54 Routing to applications RF connector ........................................................... 55 Routing Detail................................................................................................. 56 Supply voltage for active GNSS antenna....................................................... 57 ESD protection for passive GNSS antenna ................................................... 58 Schematic diagram of PLSx3 sample application .......................................... 60 IGT timing....................................................................................................... 62 Power saving and paging in GSM networks .................................................. 69 Power saving and paging in WCDMA networks............................................. 69 Power saving and paging in LTE networks .................................................... 70 Wake-up via RTS0 ......................................................................................... 71 Decoupling capacitor(s) for BATT+................................................................ 72 Power supply limits during transmit burst....................................................... 81 PLSx3 top and bottom view ......................................................................... 84 Dimensions of PLSx3 (all dimensions in mm)................................................ 85 Dimensions of PLSx3 (keepout area recommended) .................................... 86 Land pattern (top view) .................................................................................. 87 Recommended design for 110 micron thick stencil (top view) ....................... 88 Recommended design for 150 micron thick stencil (top view) ....................... 88 Reflow Profile ................................................................................................ 90 Carrier tape .................................................................................................... 94 Reel direction ................................................................................................. 94 Barcode label on tape reel ............................................................................. 95 Barcode label on tape reel - layout ................................................................ 95 Moisture barrier bag (MBB) with imprint......................................................... 96 Moisture Sensitivity Label .............................................................................. 97 Humidity Indicator Card - HIC ........................................................................ 98 Sample of VP box label.................................................................................. 99 Reference equipment for Type Approval ..................................................... 105 JATE/TELEC mark for -J.............................................................................. 109 JATE/TELEC mark for -W ............................................................................ 109 PLSx3 Label................................................................................................. 120 t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 1 Introduction 16 Page 8 of 122 1 Introduction This document1 describes the hardware of the Cinterion PLSx3 module. It helps you quickly retrieve interface specifications, electrical and mechanical details and information on the re-

quirements to be considered for integrating further components. Note: This Hardware Interface Description is a preliminary version and as such subject to change depending on further implementation and measurements. 1.1 Product Variants This document applies to the following Thales module variants:

Cinterion PLS63-W Module Cinterion PLS63-EP Module Cinterion PLS63-LA Module Cinterion PLS63-J Module CinterionPLS63-X Module CinterionPLS63-X2 Module CinterionPLS63-X3 Module CinterionPLS63-X4 Module CinterionPLS63-I Module Cinterion Cinterion Cinterion Cinterion Cinterion Cinterion Cinterion Cinterion Cinterion PLS83-W Module PLS83-EP Module PLS83-LA Module PLS83-J Module PLS83-X Module PLS83-X2 Module PLS83-X3 Module PLS83-X4 Module PLS83-I Module Note: The PLSx3 variants differ in the fact that PLS63 supports UE CAT 1 (DL 10Mbps, UL 5Mbps) whereas PLS83 supports UE CAT 4(DL 150Mbps, UL 50Mbps). Wherever necessary a note is made to differentiate between the product variants. 1.2 Key Features at a Glance Feature General Frequency bands Implementation PLSx3 integrates all the bands required to have a global coverage across the world (NORAM / LATAM / EMEA /APAC). Please refer to Section 1.2.1 for an overview of the frequency bands supported by each PLSx3 product variant. 1. The document is effective only if listed in the appropriate Release Notes as part of the technical docu-

mentation delivered with your Thales product. t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 1.2 Key Features at a Glance 16 Page 9 of 122 Feature GSM class Implementation Small MS Output power (according to release 99) Output power (according to Release 99) Output power (according to Release 8) Class 4 (+33dBm 2dB) for GSM850 Class 4 (+33dBm 2dB) for GSM900 Class 1 (+30dBm 2dB) for GSM1800 Class 1 (+30dBm 2dB) for GSM1900 Class E2 (+27dBm 3dB) for GSM 850 8-PSK Class E2 (+27dBm 3dB) for GSM 900 8-PSK Class E2 (+26dBm +3 /-4dB) for GSM 1800 8-PSK Class E2 (+26dBm +3 /-4dB) for GSM 1900 8-PSK Class 3 (+24dBm +1/-3dB) for UMTS 850, WCDMA FDD BdXIX Class 3 (+24dBm +1/-3dB) for UMTS 850, WCDMA FDD BdVI Class 3 (+24dBm +1/-3dB) for UMTS 850, WCDMA FDD BdV Class 3 (+24dBm +1/-3dB) for UMTS 900, WCDMA FDD BdVIII Class 3 (+24dBm +1/-3dB) for UMTS 1700, WCDMA FDD BdIII Class 3 (+24dBm +1/-3dB) for UMTS 1900, WCDMA FDD BdII Class 3 (+24dBm +1/-3dB) for UMTS 2100, WCDMA FDD BdIV Class 3 (+24dBm +1/-3dB) for UMTS 2100, WCDMA FDD BdI Class 3 (+23dBm 2dB) for LTE 600, LTE FDD Bd71 Class 3 (+23dBm 2dB) for LTE 700, LTE FDD Bd12 <MFBI Bd17>

Class 3 (+23dBm 2dB) for LTE 700, LTE FDD Bd13 Class 3 (+23dBm 2dB) for LTE 700, LTE FDD Bd14 Class 3 (+23dBm+2/-2.5dB) for LTE 700, LTE FDD Bd28 Class 3 (+23dBm 2dB) for LTE 850, LTE FDD Bd26 Class 3 (+23dBm 2dB) for LTE 850, LTE FDD Bd18 Class 3 (+23dBm 2dB) for LTE 850, LTE FDD Bd19 Class 3 (+23dBm 2dB) for LTE 800, LTE FDD Bd20 Class 3 (+23dBm 2dB) for LTE 850, LTE FDD Bd5 Class 3 (+23dBm 2dB) for LTE 900, LTE FDD Bd8 Class 3 (+23dBm 2dB) for LTE 1800, LTE FDD Bd3 Class 3 (+23dBm 2dB) for LTE 1900, LTE FDD Bd2 Class 3 (+23dBm 2dB) for LTE 1900, LTE FDD Bd25 Class 3 (+23dBm 2dB) for LTE 2100, LTE FDD Bd1 Class 3 (+23dBm 2dB) for LTE 2100, LTE FDD Bd4 Class 3 (+23dBm 2dB) for LTE 2100, LTE FDD Bd66 Class 3 (+23dBm 2dB) for LTE 2600, LTE FDD Bd7 Class 3 (+23dBm 2dB) for LTE 2300, LTE TDD Bd40 Class 3 (+23dBm 2dB) for LTE 2500, LTE TDD Bd41 Class 3 (+23dBm 2dB) for LTE 2600, LTE TDD Bd38 Power supply

(see Section 2.1.2, and Section 3.4) Normal operation:

3.0V < VBATT+ < 4.5V Typ value is 3.8V Operating temperature

(board temperature)

(see Section 3.5) Normal operation: -30C to +85C Extended operation: -40C to -30C, +85C to +95C;

Dimensions: 33mm x 29mm x 2.5mm Weight: approx. 4.8g All hardware components fully compliant with EU RoHS Directive UE CAT 1 for PLS63 (DL 10Mbps, UL 5Mbps) UE CAT 4 for PLS83 (DL 150Mbps, UL 50Mbps) Physical

(see Section 4.1) RoHS

(see Section 5.1) LTE features 3GPP Release 10 HSPA feature t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 1.2 Key Features at a Glance 16 Page 10 of 122 Feature Implementation 3GPP Release 7 UE CAT. 8, 6 for PLS63 HSDPA DL 7.2Mbps HSUPA UL 5.7Mbps UE CAT. 14, 6 for PLS83 HSPA+ DL 21Mbps HSUPA UL 5.7Mbps UMTS features 3GPP Release 4 GSM/GPRS/EGPRS features Data transfer Compressed mode (CM) supported according to 3GPP TS25.212 PS data rate 384 kbps DL / 384 kbps UL CS data rate 64 kbps DL / 64 kbps UL EDGE E2 power class for 8 PSK GPRS:

Multislot Class 12 Mobile Station Class B Coding Scheme 1 4 EGPRS:

Multislot Class 12 Downlink coding schemes CS 1-4, MCS 1-9 Uplink coding schemes CS 1-4, MCS 1-9 SRB loopback and test mode B 8-bit, 11-bit RACH 1 phase/2 phase access procedures Link adaptation and IR NACC, extended UL TBF Mobile Station Class B SMS Point-to-point MT and MO Cell broadcast Text and PDU mode Storage: SIM card plus SMS locations in mobile equipment GNSS Features Protocol NMEA Modes

(see Section 2.3) General Software Standalone GNSS (GPS, GLONASS, Beidou, Galileo) Automatic power saving modes. DC feed bridge and control of power supply for active antenna AT commands Hayes 3GPP TS 27.007, TS 27.005, Thales SIM Application Toolkit Default (Network) bearer support for BIP Firmware update Generic update from host application over USB modem t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 1.2 Key Features at a Glance 16 Page 11 of 122 Feature Interfaces Module interface Implementation USB

(see Section 2.1.3) USB 2.0 High Speed (480Mbit/s) device interface. Full Speed (12Mbit/s) compliant. Surface mount device with solderable connection pads (SMT application interface). Land grid array (LGA) technology ensures high solder joint reli-

ability and allows the use of an optional module mounting socket. For more information on how to integrate SMT modules see also [4].This application note comprises chapters on module mounting and application layout issues as well as on additional SMT application development equip-

ment. ASC0 (in parts shared with GPIO lines):

8-wire modem interface with status and control lines, unbalanced, asyn-

chronous Fixed baud rates: 300bps to 921,600bps Supports RTS0/CTS0 hardware flow control. ASC1 (shared with GPIO lines):

4-wire, unbalanced asynchronous interface Fixed baud rates: 300bps to 921,600bps and 3Mbps Supports RTS1/CTS1 hardware flow control Supported chip cards: UICC/SIM/USIM 3V, 1.8V 22 GPIO lines comprising:

13 lines shared with ASC0, ASC1 lines, with network status indication, fast shutdown and SIM switch 9 GPIO lines not shared Supports I2C serial interface. 1 digital interface can be configured as PCM or I2S. RING0 Support RING0 to wake up host from power saving state. Antenna interface pads

(see Section 2.1) 50. UMTS/GSM/LTE main antenna, UMTS/LTE Rx Diversity antenna, GNSS antenna. ADC inputs

(see Section 2.1.9) Analog-to-Digital Converter with unbalanced analog inputs, for example, for the (external) antenna diagnosis Switch on by hardware signal IGT Switch off by AT command Switch off by hardware signal FST_SHDN instead of AT command Automatic switch off in case of critical temperature or voltage conditions Orderly reset by AT command Reset by emergency reset signal EMERG_RST. Real time clock Timer functions via AT commands. LGA DevKit designed to test Thales LGA modules. t PLSx3_HID_v01.003 2021-03-12 Public / Released 2 serial interfaces

(see Section 2.1.4, and Section 2.1.5) 2 UICC interfaces

(switchable)

(see Section 2.1.6) GPIO interface

(see Section 2.1.7) I2C interface Digital audio interface

(see Section 2.1.8) Power on/off, Reset Power on/off Reset Special features Evaluation kit LGA DevKit Cinterion PLSx3 Hardware Interface Description 1.2 Key Features at a Glance 16 Page 12 of 122 Feature Implementation Evaluation module PLSx3 module soldered onto a dedicated PCB that can be connected to an adapter in order to be mounted onto the DSB75 or DSB mini. DSB-mini DSB75 DSB-mini Development Support Board designed to test and type approve. It is the cost optimized development board alternative to DSB75. DSB75 Development Support Board designed to test and type approve Thales modules and provide a sample configuration for application engi-

neering. A special adapter is required to connect the PLSx3 evaluation module to the DSB75. t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 1.2 Key Features at a Glance 16 1.2.1 Supported Frequency Bands Page 13 of 122 The following table lists the supported frequency bands for each of the PLSx3 product variants mentioned in Section 1.1. Table 1: Supported frequency bands for each PLSx3 variant Band PLSx3-W PLSx3-X PLSx3-EP PLSx3-LA PLSx3-J PLSx3-X2 PLSx3-X3 PLSx3-X4 PLSx3-I GSM/GPRS/EDGE 850MHz 900MHz 1800MHz 1900MHz WCDMA Bd.1 (2100MHz) Bd.2 (1900MHz) Bd.3 (1800MHz) Bd.4 (2100MHz) Bd.5 (850MHz) Bd.6 (850MHz) Bd.8 (900MHz) Bd.19 (850MHz) LTE-FDD Bd.1 (2100MHz) Bd.2 (1900MHz) Bd.3 (1800MHz) Bd.4 (2100MHz) Bd.5 (850MHz) t x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x PLSx3_HID_v01.003 Public / Released x x x x x x x x x x x x x Cinterion PLSx3 Hardware Interface Description 1.2 Key Features at a Glance 16 Table 1: Supported frequency bands for each PLSx3 variant Page 14 of 122 Band PLSx3-W PLSx3-X PLSx3-EP PLSx3-LA PLSx3-J PLSx3-X2 PLSx3-X3 PLSx3-X4 PLSx3-I Bd.7 (2600MHz) Bd.8 (900MHz) Bd.12 (700MHz) Bd.13 (700MHz)1 Bd.14(700MHz) Bd.17 (700 MHz) Bd.18 (850MHz) Bd.19 (850MHz) Bd.20 (800MHz) Bd.25(1900MHz) Bd.26 (850MHz) Bd.28 (700MHz) Bd.66(2100MHz) Bd.71(600MHz) LTE-TDD Bd.38 (2600MHz) Bd.40 (2300MHz) Bd.41 (2500MHz) x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x 1. For -W variant module, a sensitivity issue will occur in GNSS when transmitting in band 13, to avoid this issue, it is suggested to use -X variant module. t PLSx3_HID_v01.003 Public / Released Cinterion PLSx3 Hardware Interface Description 1.3 PLSx3 System Overview 16 1.3 PLSx3 System Overview Page 15 of 122 Application Module GPIO Digital Audio STATUS SIM_SWITCH FST_SHDN ASC1/GPIO ASC0/GPIO PWR_IND ASC0/GPIO I2C USB ADC SIM1 interface(with SIM card detection) SIM2 interface(with SIM card detection) CONTROL Power Supply RF_Main_Path Diversity_RX GNSS_Path 2 9 1 1 1 4 4 1 4 2 3 3 3 1 5 1 5 1 1 1 1 1 1 1 1 GPIO PCM(I2S)/GPIO STATUS/GPIO SIM_SWITCH/GPIO Fast Shutdown/GPIO Serial Interface/GPIO Serial Interface/GPIO Power Indicator Serial Interface 0 I2C USB ADC SIM1 Card SIM2 Card IGT EMERG_RST VGNSS Base Band Power RF Power Main Antenna Diversity Antenna GNSS Antenna Digital Audio PCM(I2S) Interface&MCLK 1 GNSS_DC Figure 1: PLSx3 system overview t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 1.4 Circuit Concept 16 Page 16 of 122 1.4 Circuit Concept Figure 2 shows block diagrams of the PLSx3 module and illustrate the major functional com-

ponents:

BATT+BB EMERG_RST IGT ADC_IN XTAL STATUS MCLK SIM_SWITCH FAST_SHDN USB ASC0 ASC1 GPIO PWR_IND I2C I2S/PCM UIM1 UIM2 PMU VGNSS V180 C o n tro l P o w e r Power BUS Control Memory SOC ANT RF Figure 2: PLSx3 block diagram t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 2 Interface Characteristics 60 2 Interface Characteristics Page 17 of 121 PLSx3 is equipped with an SMT application interface that connects to the external application. The SMT application interface incorporates the various application interfaces as well as the RF antenna interface. 2.1 Application Interface 2.1.1 Pad Assignment The SMT application interface on the PLSx3 provides land grid array pads to integrate the mod-

ule into external applications. Table 2 lists the pad assignment. Figure 3 shows the pin mapping on the LGA footprint. Please note that a number of connecting pads are marked as reserved for future use (rfu) and further qualified as either (dnu), (GND) or (nc):

Pads marked "rfu" and qualified as "dnu" (do not use) shall be soldered but electrically not connected. Pads marked "rfu" and qualified as "nc" (not connected) are internally not connected with PLSx3 modules, but shall be soldered. Thales strongly recommends to solder all connecting pads for mechanical stability and heat dissipation. t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 2.1 Application Interface 60 Page 18 of 121 ANT_DRX Signal Name Table 2: Overview: Pad assignments Pad No. rfu (nc) A4 GND A5 A6 GND A7 GND GND A8 A9 GND A10 GND A11 GND A12 A13 GND rfu (nc) B3 B4 GND B5 GND GND B6 B7 GND B8 GND GND B9 B10 GND B11 GND B12 GND B13 GND B14 GPIO5/STATUS C2 GND GND C3 C4 GND C5 GND GND C6 C7 GND GND C8 C9 GND C10 GND C11 GND C12 C13 C14 C15 GND GND D1 GND D2 GND D3 GND D4 ANT_GNSS_DC D5 GND D6 GND D7 GND D8 D9 GND D10 GND D11 GND D12 D13 D14 D15 D16 E1 CCIN2 rfu (nc) CCCLK2 rfu (dnu) rfu (dnu) ANT_GNSS rfu (nc) rfu (dnu) rfu (dnu) Signal Name GND GND GND GND GND GND GND GND rfu (dnu) Pad No. E2 E3 E4 E5 E12 CCIO2 E13 CCRST2 rfu (nc) E14 rfu (dnu) E15 rfu (dnu) E16 GND F1 GND F2 GND F3 F4 GND F13 GND I2CCLK F14 I2CDAT F15 F16 GPIO25 G1 G2 G3 G4 G13 G14 GPIO7 G15 GPIO8 G16 GPIO11 H1 H2 H3 H4 H13 H14 GPIO4/FST_SHDN H15 GPIO12 H16 GPIO6 GND J1 GND J2 GND J3 J4 GND J13 GND J14 GPIO15 J15 GPIO14 J16 GPIO13 K1 K2 K3 K4 K5 K12 K13 K14 CCIO1 K15 CCVCC1 K16 L1 ANT_MAIN GND GND GND GND rfu (nc) rfu (dnu) GND GND GND GND rfu (dnu) VGNSS GND Pad No. L2 L3 L4 L5 L6 L7 L8 L9 L10 L11 L12 L13 L14 L15 L16 M2 M3 M4 M5 M6 M7 M8 M9 M10 M11 M12 M13 M14 M15 N3 N4 N5 N6 N7 N8 N9 N10 N11 N12 N13 N14 P4 P5 P6 P7 P8 P9 P10 P11 P12 P13 Signal Name GND GND GND rfu (nc) CCVCC2 MCLK rfu (nc) rfu (nc) rfu (nc) SIM_SWITCH/GPIO26 rfu (nc) rfu (dnu) CCRST1 CCCLK1 IGT GND GND PWR_IND V180 GND GPIO21/DIN BCLK FSC GPIO20/DOUT ADC3_IN ADC2_IN ADC1_IN CCIN1 rfu (nc) BATT+RF BATT+RF VUSB_IN GPIO19/CTS1 GPIO18/RTS1 CTS0 DCD0/GPIO2 RTS0 GND rfu (dnu) BATT+BB EMERG_RST USB_DP USB_DN GPIO16/RXD1 GPIO17/TXD1 DTR0/GPIO1 DSR0/GPIO3 RING0/GPIO24 RXD0 TXD0 BATT+BB t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 2.1 Application Interface 60 Page 19 of 121 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 USB_DP USB_DN GPIO16

/RXD1 GPIO17

/TXD1 DTR0

/GPIO1 DSR0

/GIPO3 RXD0 TXD0 BATT+BB RING0

GPIO24 BATT+RF BATT+RF VUSB_ IN GPIO19

/CTS1 GPIO18

/RTS1 CTS0 DCD0

/GPIO2 RTS0 GND rfu

(dnu) BATT+BB EMERG_ RST GND GND PWR_IND V180 GND BCLK FSC GPIO21

/DIN GPIO20

/DOUT ADC3_ IN ADC2_ IN ADC1_ IN CCIN1 rfu

(nc) GND GND GND GND rfu (nc) CCVC C2 MCLK rfu

(nc) rfu

(nc) rfu

(nc) K ANT_ MAIN GND GND GND GND SIM_ SWITCH

/GPIO26 rfu

(nc) rfu

(nc) rfu

(dnu) rfu

(dnu) CCRST1 CCCLK1 IGT CCIO1 CCVCC1 VGNSS GND GND GND GND GND GPIO15 GPIO14 GPIO13 GND GND GND GND GPIO12 GPIO6 GND GND GND GND GPIO7 GPIO8 GPIO11 GND GND GND GND GND I2CCLK I2CDAT GPIO25 E ANT_ GNSS GND GND GND GND rfu: Reserved for future use (should not be connected to external application)

(nc): Internally not connected (may be ar-

bitrarily connected to external GND)

(dnu): Do not use GPIO4

FST_SH DN rfu

(dnu) rfu

(dnu) CCIO2 CCRST2 rfu

(nc) rfu

(nc) rfu

(nc) rfu

(dnu) rfu

(dnu) GPIO5

/STATUS rfu

(dnu) rfu

(dnu) rfu

(dnu) rfu

(dnu) GND rfu

(nc) GND GND GND GND GND GND GND GND GND GND rfu

(nc) GND GND GND GND GND GND GND GND ANT_ DRX P N M L J H G F D C B A GND GND GND GND GND GND GND GND GND GND CCIN2 CCCLK2 ANT_GN SS_DC GND GND GND GND GND GND GND GND GND GND For internal use:

Not to be soldered Figure 3: PLSx3 bottom view: Pad assignments PLSx3_HID_v01.003 Public / Released 2021-03-12 Position marker t Cinterion PLSx3 Hardware Interface Description 2.1 Application Interface 60 Page 20 of 121 P N M L K J H G F E D C A For internal B use: Not to be soldered t 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 BATT+BB TXD0 RXD0 GPIO17

/TXD1 GPIO16

/RXD1 USB_DN USB_DP RING0

GPIO24 DSR0

/GPIO3 DCD0

/GPIO2 DTR0

/GPIO1 CTS0 EMERG_ RST BATT+BB rfu

(dnu) GND RTS0 GPIO18

/RTS1 GPIO19

/CTS1 VUSB_ IN BATT+RF BATT+RF rfu

(nc) CCIN1 ADC1_ IN ADC2_ IN ADC3_ IN GPIO20/

DOUT GPIO21

/DIN FSC BCLK GND V180 PWR_IND GND GND IGT CCCLK1 CCRST1 rfu

(dnu) rfu

(nc) SIM_SWITC H//GPIO26 rfu

(nc) rfu

(nc) rfu

(nc) MCLK CCVC C2 rfu

(nc) GND GND GND GND VNGSS CCVCC1 CCIO1 rfu

(dnu) rfu

(nc) GND GND GND GND ANT_ MAIN GPIO13 GPIO14 GPIO15 GND GND GND GND GND GPIO6 GPIO12 GPIO4/

FST_SHD N GPIO11 GPIO8 GPIO7 rfu

(dun) rfu

(dnu) GPIO25 I2CDAT I2CCLK GND GND GND GND GND GND GND GND GND GND GND GND GND rfu

(dnu) rfu

(dnu) rfu

(nc) CCRST2 CCIO2 GND GND GND GND ANT_ GNSS rfu

(dnu) rfu

(dnu) rfu

(nc) CCCLK2 CCIN2 GND GND GND GND GND GND GND GND GND GND ANT_GN SS_DC rfu: Reserved for future use (should not be connected to external application)

(nc): Internally not connected (may be ar-

bitrarily connected to external GND)

(dnu): Do not use GND rfu

(dnu) rfu

(dnu) rfu

(nc) GND GND GND GND GND GND GND GND GND GND Position marker GPIO5/

STATUS GND GND GND GND GND GND GND GND GND GND GND ANT_ DRX GND GND GND GND GND GND GND rfu

(nc) rfu

(nc) Figure 3: PLSx3 top view: Pad assignments PLSx3_HID_v01.003 Public / Released 2021-03-12 Cinterion PLSx3 Hardware Interface Description 2.1 Application Interface 60 Page 21 of 121 Function Signal name IO Signal form and level Comment 2.1.2 Signal Properties Table 3: Signal properties (Sheet 1 of 5) Power supply BATT+BB BATT+RF I GSM activated:

VImax = 4.5V VInorm = 3.8V VImin = 3.0V Imax= see Table 18 ___||____________||___ n Tx = n x 577s peak current every 4.616ms WCDMA activated:

VImax = 4.5V VInorm = 3.8V VImin = 3.0V during Transmit active. Imax = see Table 19 LTE activated:

VImax = 4.5V VInorm = 3.8V VImin = 3.0V during Transmit active. Imax = see Table 20 V180 O Normal operation:

External supply voltage VOnorm = 1.80V 2%

IOmax = 10mA SLEEP mode Operation:

VOSleep = 1.80V 4%

IOmax = 10mA CImax = 100nF VGNSS O CLmax=2.2 VO=3V2%@IO =-10mA IOmax = 10mA VImax_6V The input current has to be limited to 50mA(antenna short circuit protection) ANT_GNS-

S_DC I Supply volt-

age for active GNSS antenna Lines of BATT+ and GND must be connected in par-

allel for supply purposes because higher peak cur-

rents may occur. Minimum voltage must not fall below 3.0V including drop, ripple, spikes and not rise above 4.5V. BATT+BB and BATT+RF require an ultra low ESR capacitor respectively of 150F. If using Multilayer Ceramic Chip Capacitors

(MLCC) please take DC-

bias into account. Note that minimum ESR value is advised at <70m. Note: The modules nor-

mal voltage range for oper-

ation lies between 3.0V and 4.5V. For USB opera-

tion, 3.0V-4.5V is also rec-

ommended. V180 should be used to supply level shifters at the interfaces. Note: V180 is not back powering protected. Wrong usage may back power the module which is forbidden. If unused keep line open. Test point recommended. Available when GNSS antenna DC power is enabled. If unused connect to GND t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 2.1 Application Interface 60 Page 22 of 121 Table 3: Signal properties (Sheet 2 of 5) Ignition IGT I Function Signal name IO Signal form and level Comment Do not add any voltage on it. There is a built-in pull up resister, you can test about 0.8V voltage on it.

|___| low impulse width > 300ms This signal switches the module on. The IGT signal characteristic is:

Power on triggered and low level triggered. Fall time should be <1ms. Note: To turn on the mod-

ule please use an open-

drain/collector circuit. Test point recommended. If unused keep line open. This line must be driven low by an open drain or open collector driver con-

nected to GND. If unused keep line open. Test point recommended. This line must be driven low. If unused keep line open. Note that the fast shut-

down line is originally available as GPIO line. If configured as fast shut-

down, the GPIO line is assigned as follows:

GPIO4 --> FST_SHDN All electrical characteris-

tics according to USB Implementers' Forum, USB 2.0 Specification. If unused keep lines open. Test points recommended. Status signaling STATUS Emer-

gency reset EMERG_RST I O VOImax = 0.45V at I = 1mA VOHmin = 1.35V at I = 1mA VOHmax = 1.8V Do not add any voltage on it. There is a built-in pull up resistor to pull to GND when Reset.

|___| low impulse width > 200ms Fast shut-

down FST_SHDN I VILmax = 0.63V VIHmin = 1.17V VIHmax = 1.8V

|___| low impulse width > 1ms USB VUSB_IN I VINmin = 3V VINmax = 5.25V Active and suspend current:

Imax<100A USB_DN I/O Full and high speed signal characteris-

USB_DP tics according to USB 2.0 Specifica-

tion. t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 2.1 Application Interface 60 Page 23 of 121 Table 3: Signal properties (Sheet 3 of 5) Function Signal name IO Signal form and level Comment Serial Interface ASC0 O VOLmax = 0.45V VOHmin = 1.35V If unused keep lines open. Test points recommended for RXD0, TXD0, RTS0, and CTS0. RXD0 CTS0 DSR0 DCD0 RING0 TXD0 RTS0 DTR0 RXD1 CTS1 TXD1 RTS1 CCIN Serial Inter-

face ASC1 SIM card detection I I I I I I VILmax = 0.63V VIHmin = 1.17V VILmax = 0.63V VIHmin = 1.17V VILmax = 0.63V VIHmin = 1.17V O VOLmax = 0.45V VOHmin = 1.35V O VILmax = 0.63V VIHmin = 1.17V VILmax = 0.63V VIHmin = 1.17V VIHmin = 1.17V VIHmax = 1.97V VILmax = 0.63V 3V SIM Card Inter-

face CCRST1 CCRST2 O VOLmax = 0.4V VOHmin = 2.2V VOHmax = 3.04V CCIO1 CCIO2 CCCLK1 CCCLK2 CCVCC1 CCVCC2 I/O VILmax = 0.55V VIHmin = 2.128V VIHmax = 3.05V VOLmax = 0.4V VOHmin = 2.2V VOHmax = 3.04V O VOLmax = 0.4V VOHmin = 2.2V VOHmax = 3.04V O VOmin = 2.75V VOtyp = 2.85V VOmax = 3.04V IOmax = -30mA If unused keep lines open Test points recommended for RXD1, TXD1, RTS1, and CTS1. CCIN = low, SIM card inserted. CCIN= high, SIM card removed. If unused keep line open. Maximum cable length or copper track to SIM card holder should not exceed 100mm. CCIO2 should add 10k pull-up to CCVCC2 t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 2.1 Application Interface 60 Page 24 of 121 Table 3: Signal properties (Sheet 4 of 5) Function Signal name IO Signal form and level Comment 1.8V SIM Card Inter-

face CCRST1 CCRST2 O VOLmax = 0.4V VOHmin = 1.36V VOHmax = 1.93V Maximum cable length or copper track to SIM card holder should not exceed 100mm. CCIO2 should add 10k pull-up to CCVCC2 CCIO1 CCIO2 CCCLK1 CCCLK2 CCVCC1 CCVCC2 I/O VILmax = 0.334V VIHmin = 1.351V VIHmax = 1.97V VOLmax = 0.4V VOHmin = 1.336V VOHmax = 1.93V O VOLmax = 0.4V VOHmin = 1.336V VOHmax = 1.93V O VOmin = 1.67V VOtyp = 1.80V VOmax = 1.93V IOmax = -30mA GPIO interface GPIO1-

GPIO8, GPIO11-

GPIO21 GPIO24-

GPIO26 IO VILmax = 0.334V VIHmin = 1.351V VIHmax = 1.97V VOLmax = 0.4V VOHmin = 1.336V VOHmax = 1.93V Digital Audio Interface BCLK DIN DOUT FSC O I O O VOLmax = 0.45V VOHmin = 1.35V VOHmax = 1.8V VILmax = 0.63V VIHmin = 1.17V VIHmax = 1.8V MCLK O Freq=12.288MHz I2C I2CCLK I2CDAT O Internal no pull up Resistors Open Drain Output. IO VOLmax = 0.36V@2mA VILmax = 0.54V VIHmin = 1.26V External pull-up resistors is required. The maximum load is 680Ohm. If lines are unused keep lines open. If unused keep line open. Please note that most GPIO lines can be config-

ured by AT command for alternative functions or are by default configured with an alternative functionality:

GPIO4: Fast Shut Down

(Input) GPIO5: LED status GPIO26: SIM switch If unused keep line open. t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 2.1 Application Interface 60 Page 25 of 121 Table 3: Signal properties (Sheet 5 of 5) Function Signal name IO Signal form and level Comment ADC_IN

(Analog-to-

Digital Con-

verter) ADC1 ADC2 ADC3 I RI = 10Mohm VI = 0.1V ... 1.7V (valid range) VIH max = 1.7V If unused keep line open. GPO Inter-

face ANT_SW O VOLmax = 0.4 If unused keep line open. SIM Switch SIM_SWITCH O VOLmax = 0.4V If unused keep line open. Resolution 15 Bits Offset error 1%

VOHmin = 1.336V VOHmax = 1.93V VOHmin = 1.336V VOHmax = 1.93V Power indicator PWR_IND O VIHmax = 5.5V VOLmax = 0.4V at Imax = 2mA PWR_IND (Power Indica-

tor) notifies the modules on/off state (see Section 2.1.10). PWR_IND is an open col-

lector that needs to be connected to an external pullup resistor. Low state of the open collector indi-

cates that the module is on. Vice versa, high level notifies the power-down mode. Therefore, the sig-

nal may be used to enable external voltage regulators which supply an external logic for communication with the module, e.g. level converters. Do not connect to V180. t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 2.1 Application Interface 60 2.1.2.1 Absolute Maximum Ratings Page 26 of 121 The absolute maximum ratings stated in Table 4 are stress ratings under any conditions. Stresses beyond any of these limits will cause permanent damage to PLSx3. Voltage at digital pins 1.8V domain in normal operation V180 + 0.2 V Table 4: Absolute maximum ratings Parameter Supply voltage BATT+ (no service) Voltage at all digital pins in POWER DOWN mode Voltage at SIM interface, CCVCC 1.8V in normal Operation Voltage at SIM interface, CCVCC 2.85V in normal Operation Current at SIM interface in 1.8V and 2.85V operation Voltage at ADC pin in normal operation V180 in normal operation USB-Pins Min

-0.3

-0.3

-0.2 0 0 0.1

+1.7

-0.3 Max

+5.5

+0.3

+2.16

+3.25

-145

+1.7*

+1.9 3.63 Unit V V V V V V V mA t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 2.1 Application Interface 60 Page 27 of 121 2.1.3 USB Interface PLSx3 supports a USB 2.0 High Speed (480Mbit/s) device interface that is Full Speed (12Mbit/

s) compliant. The impedances, serial and pull up resistors are implemented according to Uni-

versal Serial Bus Specification Revision 2.01, No further additional components are required. The external application is responsible for supplying the VUSB_IN line. This line is used for ca-

ble detection only. The USB part (driver and transceiver) is supplied by means of BATT+. This is because PLSx3 is designed as a self-powered device compliant with the Universal Serial Bus Specification Revision 2.0. Module SMT VREG (3V075) lin. reg. USB part1) VBUS DP DN Detection only RS RS BATT+

GND VUSB_IN USB_DP2) USB_DN2) 1) All serial (including RS) and pull-up resistors for data lines are implemented. 2) If the USB interface is operated in High Speed mode (480MHz), it is recommended to take special care routing the data lines USB_DP and USB_DN. Application layout should in this case implement a differential impedance of 90 ohms for proper signal integrity. Figure 4: USB circuit To properly connect the module's USB interface to the external application, a USB 2.0 compat-

ible connector and cable or hardware design is required. For more information on the USB re-

lated signals see Table 3. Furthermore, the USB modem driver distributed with PLSx3 needs to be installed. While a USB connection is active, the module will never switch to SLEEP mode. Only if the USB interface is in Suspend mode, the module is able to switch to SLEEP mode. 1. The specification is ready for download on http://www.usb.org/developers/docs/

t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 2.1 Application Interface 60 2.1.3.1 Reducing Power Consumption Page 28 of 121 While a USB connection is active, the module will never switch into SLEEP mode. Only if the USB interface is in Suspended state or Detached (i.e., VUSB_IN = 0) is the module able to switch into SLEEP mode thereby saving power. There are two possibilities to enable power re-

duction mechanisms:

Recommended implementation of USB Suspend/Resume/Remote Wakeup:

The USB host should be able to bring its USB interface into the Suspended state as described in the Universal Serial Bus Specification Revision 2.01. For this functionality to work, the VUSB_IN line should always be kept enabled. On incoming calls and other events PLSx3 will then generate a Remote Wakeup request to resume the USB host controller. See also [3] (USB Specification Revision 2.0, Section 10.2.7, p.282):

"If USB System wishes to place the bus in the Suspended state, it commands the Host Con-

troller to stop all bus traffic, including SOFs. This causes all USB devices to enter the Sus-

pended state. In this state, the USB System may enable the Host Controller to respond to bus wakeup events. This allows the Host Controller to respond to bus wakeup signaling to restart the host system."

Implementation for legacy USB applications not supporting USB Suspend/Resume:

As an alternative to the regular USB suspend and resume mechanism it is possible to employ the RING0 line to wake up the host application in case of incoming calls or events signalized by URCs while the USB interface is in Detached state (i.e., VUSB_IN = 0). Every wakeup event will force a new USB enumeration. Therefore, the external application has to carefully consider the enumeration timings to avoid loosing any signaled events. For details on this host wakeup functionality see Section 2.1.10.4. To prevent existing data call con-

nections from being disconnected while the USB interface is in detached state (i.e., VUS-

B_IN=0) it is possible to call AT&D0, thus ignoring the status of the DTR line (see also [1]). 1. The specification is ready for download on http://www.usb.org/developers/docs/

t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 2.1 Application Interface 60 2.1.4 Serial Interface ASC0 Page 29 of 121 PLSx3 offers an 8-wire unbalanced, asynchronous modem interface ASC0 conforming to ITU-

T V.24 protocol DCE signaling. The electrical characteristics do not comply with ITU-T V.28. The significant levels are 0V (for low data bit or active state) and 1.8V (for high data bit or in-

active state). For electrical characteristics please refer to Table 3. PLSx3 is designed for use as a DCE. Based on the conventions for DCE-DTE connections it communicates with the customer application (DTE) using the following signals:

Port TXD @ application sends data to the modules TXD0 signal line Port RXD @ application receives data from the modules RXD0 signal line Figure 5: Serial interface ASC0 Features:

Includes the data lines TXD0 and RXD0, the status lines RTS0 and CTS0 and, in addition, the modem control lines DTR0, DSR0, DCD0 and RING0. The RING0 signal serves to indicate incoming calls and other types of URCs (Unsolicited Result Code). It can also be used to send pulses to the host application, for example to wake up the application from power saving state. Configured for 8 data bits, no parity and 1 stop bit. ASC0 can be operated at fixed bit rates from 300bps up to 921600bps. Supports RTS0/CTS0 hardware flow control. The hardware hand shake line RTS0 has an internal pull down resistor causing a low level signal, if the line is not used and open. Although hardware flow control is recommended, this allows communication by using only RXD and TXD lines. Wake up from SLEEP mode by RTS0 activation (high to low transition; see Section 3.3.4) Note: The ASC0 modem control lines DTR0, DCD0, DSR0 and RING0 can also be configured as GPIO lines. If configured as GPIO lines, these GPIO lines are assigned as follows:

GPIO1-->DTR0 GPIO2-->DCD0 GPIO3-->DSR0 GPIO24-->RING0 Configuration is done by AT command (see [1]). The configuration is non-volatile and becomes active after a module restart. t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 2.1 Application Interface 60 Page 30 of 121 Notes: No data must be sent over the ASC0 interface before the interface is active and ready to receive data (see Section 3.2.1). 2.1.5 Serial Interface ASC1 Four PLSx3 GPIO lines can be configured as ASC1 interface signals to provide a 4-wire unbal-

anced, asynchronous modem interface ASC1 conforming to ITU-T V.24 protocol DCE signal-

ling. The electrical characteristics do not comply with ITU-T V.28. The significant levels are 0V

(for low data bit or active state) and 1.8V (for high data bit or inactive state). For electrical char-

acteristics please refer to Table 3. PLSx3 is designed for use as a DCE. Based on the conventions for DCE-DTE connections it communicates with the customer application (DTE) using the following signals:

Port TXD @ application sends data to modules TXD1 signal line Port RXD @ application receives data from the modules RXD1 signal line Figure 6: Serial interface ASC1 Features Includes only the data lines TXD1 and RXD1 plus RTS1 and CTS1 for hardware hand-

shake. On ASC1 no RING line is available. Configured for 8 data bits, no parity and 1 or 2 stop bits. ASC1 can be operated at fixed bit rates from 300 bps to 921,600bps. Supports RTS1/CTS1 hardware flow. The hardware hand shake line RTS1 has an internal pull down resistor causing a low level signal, if the line is not used and open. Although hard-

ware flow control is recommended, this allows communication by using only RXD and TXD lines. Notes: The ASC1 interface lines are originally available as GPIO lines. If configured as ASC1 lines, the GPIO lines are assigned as follows:

GPIO16-->RXD1 GPIO17-->TXD1 GPIO18-->RTS1 GPIO19-->CTS1 Configuration is done by AT command (see [1]). The configuration is non-volatile and becomes active after a module restart. t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 2.1 Application Interface 60 2.1.6 UICC/SIM/USIM Interface Page 31 of 121 PLSx3 has two UICC/SIM/USIM interfaces (includes eSIM interface) compatible with the 3GPP 31.102 and ETSI 102 221. These are wired to the host interface in order to be connected to an external SIM card holder. Five pads on the SMT application interface are reserved for each of the two SIM interfaces. The UICC/SIM/USIM interface supports 3V and 1.8V SIM cards. Please refer to Table 3 for electrical specifications of the UICC/SIM/USIM interface lines depending on whether a 3V or 1.8V SIM card is used. The CCINx signal serves to detect whether a tray (with SIM card) is present in the card holder. Using the CCINx signal is mandatory for compliance with the GSM 11.11 recommendation if the mechanical design of the host application allows the user to remove the SIM card during operation. To take advantage of this feature, an appropriate SIM card detect switch is required on the card holder. See Chapter 7.1 as example for a card holder with an internal switch. Table 5: Signals of the SIM interface (SMT application interface) Signal Description Ground connection for SIM interfaces. Optionally a separate SIM ground line using e.g., pad N11, may be used to improve EMC. Chipcard clock lines for 1st and 2nd SIM interface. SIM supply voltage lines for 1st and 2nd SIM interface. Serial data lines for 1st and 2nd SIM interface, input and output. Chipcard reset lines for 1st and 2nd SIM interface. Input on the baseband processor for detecting a SIM card tray in the holder. If the SIM is removed during operation the SIM interface is shut down immediately to prevent destruc-

tion of the SIM. The CCINx signal is active low. The CCINx signal is mandatory for applications that allow the user to remove the SIM card during operation. The CCINx signal is solely intended for use with a SIM card. It must not be used for any other purposes. Failure to comply with this requirement may invalidate the type approval of PLSx3. Note: No guarantee can be given, nor any liability accepted, if loss of data is encountered after removing the SIM card during operation. Also, no guarantee can be given for properly initializ-

ing any SIM card that the user inserts after having removed the SIM card during operation. In this case, the application must restart PLSx3. By default, only the modules 1st SIM interface is available and can be used. The usage of the modules 2nd SIM interface has to be configured by AT command. As an alternative to connecting the modules two SIM interfaces and switching between these via AT command, it is possible to connect the first of the modules SIM interfaces via an external SIM switch that in turn provides access to a further SIM interface. For details see Section 2.1.6.2. GND CCCLK1 CCCLK2 CCVCC1 CCVCC2 CCIO1 CCIO2 CCRST1 CCRST2 CCIN1 CCIN2 t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 2.1 Application Interface 60 Page 32 of 121 Module 1st SIMinterface 2nd SIMinterface SIM1 SIM2

. Figure 7: Modules two UICC/SIM/USIM interfaces Figure 8: UICC/SIM/USIM interfaces connected The total cable length between the SMT application interface pads on PLSx3 and the pads of the external SIM card holder must not exceed 100mm in order to meet the specifications of 3GPP TS 51.010-1 and to satisfy the requirements of EMC compliance. To avoid possible cross-talk from the CCCLKx signal to the CCIOx signal be careful that both lines are not placed closely next to each other. A useful approach is using the GND line to shield the CCIOx line from the CCCLKx line. t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 2.1 Application Interface 60 Page 33 of 121 2.1.6.1 Enhanced ESD Protection for SIM Interface To optimize ESD protection for the SIM interface it is possible to add ESD diodes (eg. NUP4114) to the SIM interface lines as shown in the example given in Figure 9. Please place the ESD protection close to the SIM connector. It is suggested that the cload of diode be less than 3pF. The example was designed to meet ESD protection according ETSI EN 301 489-1/7: Contact discharge: 4kV, air discharge: 8kV. Module CCRST CCVCC CCIO CCCLK CCIN SIM_RST SIM_VCC SIM_IO 6 5 4 1 2 3 GND SIM_CLK SIM_DET Keep SIM lines low capacitative Figure 9: SIM interface - enhanced ESD protection t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 2.1 Application Interface 60 Page 34 of 121 2.1.6.2 SIM_SWITCH Line As an alternative to connecting the modules two SIM interfaces and switching between these interfaces by means of AT command, it is possible to connect the first of the modules SIM in-

terfaces via an external SIM switch that in turn provides access to a further SIM interface. Module 1st SIMinterface GPIO26/

SIM_SWITCH Switch SIM1A SIM1B Figure 10: External UICC/SIM/USIM switch The modules GPIO26 line can in this case be configured as SIM_SWITCH line in order to con-

trol the external SIM switch as shown in the sample circuit in Figure 11. A low state would then indicate the usage of the first SIM interface (SIM1A), a high state would indicate the usage of the second interface (SIM1B). The configuration of the SIM_SWITCH (GPIO26) line is done via AT command, is non-volatile, and available after the next module restart. External Application Module SIM1A ESD protection IF1 Sim Switch COMMON SIMSELECT FSA2567 ESD protection IF2 SIM1B VBAT 10k 22k 100k VSIM1 CCCLK1 CCIO1 CCRST1 SIM_ SWITCH CCIN1 Figure 11: Sample circuit for SIM interface connection via SIM switch t PLSx3_HID_v01.003 2021-03-12 Public / Released GPIO GPIO1 GPIO2 GPIO3 GPIO4 GPIO5 GPIO6 GPIO7 GPIO8 GPIO11 GPIO12 GPIO13 GPIO14 GPIO15 GPIO16 GPIO17 GPIO18 GPIO19 GPIO20 GPIO21 GPIO24 GPIO25 GPIO26 Cinterion PLSx3 Hardware Interface Description 2.1 Application Interface 60 Page 35 of 121 2.1.7 GPIO Interface PLSx3 offers a GPIO interface with 22 GPIO lines. The GPIO lines are shared with other inter-

faces or functions: Fast shutdown (see Section 2.1.10.3), Status LED (see Section 2.1.10.1), ASC0 (see Section 2.1.4), ASC1 (see Section 2.1.5) and SIM Switch (see Section 2.1.6.2) The following table shows the configuration variants for the GPIO pads. All variants are mutu-

ally exclusive, i.e. a pad configured for instance as Status LED is locked for alternative usage. Table 6: GPIO lines and possible alternative assignment Fast Shutdown Status LED ASC0 ASC1 SIM SWITCH DAI DTR0 DCD0 DSR0 FST_SHDN Status LED RXD1 TXD1 RTS1 CTS1 RING0 DOUT DIN SIM_SWITCH 2.1.8 Digital Audio Interface PLSx3 supports the digital audio interface that can be deployed as PCM or Inter_IC Sound

(I2S). t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 2.1 Application Interface 60 2.1.8.1 Pulse Code Modulation Interface Page 36 of 121 PLSx3s PCM interface can be used to connect audio devices capable of pulse code modulation. The PCM functionality is limited to the use of wideband codec with 16kHz sample rate only. The PCM interface runs at 16 kHz sample rate (62.5s frame length), while the signal processing maintains this rate in a wideband AMR call or samples automatically down to 8kHz in a narrowband call. Therefore, the PCM sample rate is independent of the audio bandwidth of the call. The PCM interface has the following characteristics:

Master mode Table 7 lists the available PCM interface signals. Long frame synchronization 16kHz/8kHz sample rate 256, 512, 1024 and 4096kHz bit clock at 16kHz sample rate 256, 512, and 2048kHz bit clock at 8kHz sample rate Table 7: Overview of PCM pin functions Signal name Signal direction master Description DOUT DIN FSC BCLK MCLK O I O O

PCM Data from PLSx3 to external codec. PCM Data from external codec to PLSx3. Frame synchronization signal to external codec. Bit clock to external codec. Note: If the BCLK signal is permanently provided (AT^SAIC parameter <clk_mode> = 0), the module will no longer enter its power save (SLEEP) state. Audio master clock. Be synchronous to BCLK to use in external codec. Can be switched on and off. Note: PCM data is always formatted as 16-bit uncompressed twos complement. Also, all PCM data and frame synchronization signals are written to the PCM bus on the rising clock edge and read on the falling edge. 2.1.8.2 Inter-IC Sound Interface The I2S Interface is a standardized bidirectio zonal I2S based digital audio interface for trans-

mission of mono voice signals for telephony services. The I2S properties and capabilities comply with the requirements lay out in the Phillips I2S Bus Specifications, revised June 5, 1996. The I2S interface has the following characteristics:

Bit clock mode: Master Sampling rate: 8kHz (narrowband), 16kHz (wideband) 256kHz bit clock at 8kHz sample rate 512kHz bit clock at 16kHz sample rate Table 8 lists the available I2S interface signals t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 2.1 Application Interface 60 Page 37 of 121

. Table 8: Overview of I2S pin functions Signal name on SMT application interface Signal configura-

tion inactive Signal direction Master Description DOUT DIN FSC BCLK PD PD PD PD O I O O I2S data from PLSx3 to external codec I2S data from external codec to PLSx3 Frame synchronization signal to external codec Word alignment

(WS) Bit clock to external codec. BCLK signal low/high time varies between 45% and 55% of its clock period. 2.1.9 Analog-to-Digital Converter (ADC) PLSx3 provides three unbalanced ADC input line: ADC[1...3]_IN. They can be used to mea-

sure three independent, externally connected DC voltages in the range of 0.1V to 1.7V. They can be used especially for antenna diagnosing. The AT^SRADC command can be employed to select the ADC line, set the measurement mode and read out the measurement results. 2.1.10 Control Signals 2.1.10.1 Status LED The GPIO5 interface line can be configured to drive a status LED that indicates different oper-

ating mode (for GPIOs see 2.1.7). GPIO and LED functionality are mutually exclusive. To take advantage of this function connect an LED to the GPIO5/STATUS line as shown in Figure 12 VCC LED R3 STATUS R1 R2 GND GND Figure 12: Status signaling with LED driver t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 2.1 Application Interface 60 Page 38 of 121 2.1.10.2 Power Indication The power indication signal PWR_IND notifies the on/off state of the module. High state of PWR_IND indicates that the module is switched off. The state of PWR_IND immediately changes to low when IGT is pulled low. For state detection an external pull-up resistor is re-

quired. Module Power supply On/Off

(open drain driver) e.g. BATT+

e c a f r e t n i T M S PWR_IND Figure 13: Power indication signal t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 2.1 Application Interface 60 Page 39 of 121 2.1.10.3 Fast Shutdown The GPIO4 interface line can be configured as fast shutdown signal line FST_SHDN. The con-

figured FST_SHDN line is an active low control signal and must be applied for at least 1 milli-

seconds. If unused this line can be left open because of a configured internal pull-up resistor. Before setting the FST_SHDN line to low, the IGT signal should be set to high (see Figure 14). The fast shutdown feature can be triggered using the AT command AT^SMSO=<fso>. For de-

tails see [1]. If triggered, a low impulse >1 milliseconds on the FST_SHDN line starts the fast shutdown. The fast shutdown procedure still finishes any data activities on the module's flash file system, thus ensuring data integrity, but will no longer deregister gracefully from the network, thus saving the time required for network deregistration. Switch off procedure fast shut down BATT+BB BATT+RF IGT EMERG_RST Internal Reset V180 PWR_IND GPIO4/AT^SMSO=<fso>

(Fast Shut Down)

< 15ms Active low Open Collector High Z Figure 14: Fast shutdown timing Please note that the normal software controlled shutdown using AT^SMSO will allow option for a fast shutdown by parameter <fso>, i.e., without network deregistration. However, in this case no URCs including shutdown URCs will be provided by the AT^SMSO command. Please also note that the fast shutdown operation does not allow the module deregister from the network, therefore, this practice is not recommended, and should not be conducted on reg-

ular basis. If it is used for energy saving reason, for instance, used in battery-driven solutions that require prompt system shutdown before battery depletion, discretion is advised in such case. t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 2.1 Application Interface 60 Page 40 of 121 2.1.10.4 Remote Wakeup If no call, data or message transfer is in progress, the external host application may shut down its own module interfaces or other components in order to save power. If a call, data, or other request (URC) arrives, the external application can be notified of this event and be woken up again by a state transition of a configurable remote wakeup line. Available as remote wakeup lines are some GPIO signals (recommended is GPIO24). Please refer to [1]: AT^SCFG: "Re-

moteWakeUp/..." for details on how to configure these lines for defined wakeup events on specified device interfaces. Possible states are listed in Table 9. If no line is specifically configured as remote wakeup signal, the remote USB suspend and re-

sume mechanism as specified in the Universal Serial Bus Specification Revision 2.0 applies for the USB interface (see Section 2.1.3). Possible states for the remote wakeup GPIO lines are listed in Table 9. Table 9: Remote wakeup lines Signal GPIOx I/O/P O Description Inactive to active high transition:

0 = No wake up request 1 = The host shall wake up t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 2.2 RF Antenna Interface 60 2.2 RF Antenna Interface Page 41 of 121 The PLSx3 GSM/UMTS/LTE antenna interface comprises a GSM/UMTS/LTE main antenna as well as a UMTS/LTE Rx diversity antenna to improve signal reliability and quality1. The RF in-

terface has an impedance of 50. PLSx3 is capable of sustaining a total mismatch at the an-

tenna line without any damage, even when transmitting at maximum RF power. The external antenna must be matched properly to achieve best performance regarding radi-

ated power, modulation accuracy and harmonic suppression. Antenna matching networks are not included on the PLSx3 module and should be placed in the host application if the antenna does not have an impedance of 50. Regarding the return loss PLSx3 provides the following values in the active band:

Table 10: Return loss in the active band State of module Return loss of module Recommended return loss of application Receive Transmit

> 8dB not applicable

> 12dB

> 12dB 1. By delivery default the UMTS/LTE Rx diversity antenna is configured as available for the module since its usage is mandatory for LTE. Please refer to [1] for details on how to configure antenna settings. t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 2.2 RF Antenna Interface 60 2.2.1 Antenna Interface Specifications Page 42 of 121 Table 11: RF Antenna interface GSM/UMTS/LTE Parameter Conditions Min. Typical Max. Unit LTE connectivity Band 1,2,3,4,5,7,8,12,13,14,17,18,19,20,25,26,28,38,40,41,66,71 Receiver Input Sensitivity

@ARP, Main Antenna, Channel BW at 5 MHz

@25C, 3.8V LTE FDD 2100 Band 1 LTE FDD 1900 Band 2 LTE FDD 1800 Band 3 LTE FDD 2100 Band 4 LTE FDD 850 Band 5 LTE FDD 2600 Band 7 LTE FDD 900 Band 8 LTE FDD 700 Band 12 LTE FDD 700 Band 13 LTE FDD 700 Band 14 LTE FDD 700 Band 17 LTE FDD 850 Band 18 LTE FDD 850 Band 19 LTE FDD 800 Band 20 LTE FDD 1900 Band 25 LTE FDD 850 Band 26 LTE FDD 700 Band 28 LTE TDD 2600 Band 38 LTE TDD 2300 Band 40 LTE TDD 2500 Band 41 LTE FDD 2100 Band 66 LTE FDD 600 Band 71 TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 2.2 RF Antenna Interface 60 Page 43 of 121 Table 11: RF Antenna interface GSM/UMTS/LTE Parameter Conditions Min. Typical Max. Receiver Input Sensitivity

@ARP, Diversity Antenna, Channel BW at 5 MHz

@25C, 3.8V LTE FDD 2100 Band 1 LTE FDD 1900 Band 2 LTE FDD 1800 Band 3 LTE FDD 2100 Band 4 LTE FDD 850 Band 5 LTE FDD 2600 Band 7 LTE FDD 900 Band 8 LTE FDD 700 Band 12 LTE FDD 700 Band 13 LTE FDD 700 Band 14 LTE FDD 700 Band 17 LTE FDD 850 Band 18 LTE FDD 850 Band 19 LTE FDD 800 Band 20 LTE FDD 1900 Band 25 LTE FDD 850 Band 26 LTE FDD 700 Band 28 LTE TDD 2600 Band 38 LTE TDD 2300 Band 40 LTE TDD 2500 Band 41 LTE FDD 2100 Band 66 LTE FDD 600 Band 71 TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD Unit dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 2.2 RF Antenna Interface 60 Page 44 of 121 Table 11: RF Antenna interface GSM/UMTS/LTE Parameter Conditions Min. Typical Max. RF Power @ARP with 50 Load (Board temperature<85C, 5 MHz BW, 1RB Position Low) LTE FDD 2100 Band 1 LTE FDD 1900 Band 2 LTE FDD 1800 Band 3 LTE FDD 2100 Band 4 LTE FDD 850 Band 5 LTE FDD 2600 Band 7 LTE FDD 900 Band 8 LTE FDD 700 Band 12 LTE FDD 700 Band 13 LTE FDD 700 Band 14 LTE FDD 700 Band 17 LTE FDD 850 Band 18 LTE FDD 850 Band 19 LTE FDD 800 Band 20 LTE FDD 1900 Band 25 LTE FDD 850 Band 26 LTE FDD 700 Band 28 LTE TDD 2600 Band 38 LTE TDD 2300 Band 40 LTE TDD 2500 Band 41 LTE FDD 2100 Band 66 LTE FDD 600 Band 71

+21

+21

+21

+21

+21

+21

+21

+21

+21

+21

+21

+21

+21

+21

+21

+21

+21

+21

+21

+21

+21

+21

+23.0

+23.0

+23.0

+23.0

+23.0

+22.5

+23.0

+23.0

+23.0

+23.0

+23.0

+23.0

+23.0

+23.0

+23.0

+23.0

+23.0

+23.0

+23.0

+23.0

+23.0

+23.0 Unit dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 2.2 RF Antenna Interface 60 Page 45 of 121 Table 11: RF Antenna interface GSM/UMTS/LTE Parameter Conditions Min. Typical Max. Unit UMTS connectivity Band I,II,III, IV,V,VI,VIII,XIX Receiver Input Main Sensi-

tivity @ ARP @25C, 3.8V UMTS 2100 Band I UMTS 1900 Band II UMTS 1800 Band III UMTS 1700 Band IV UMTS 850 Band V UMTS 850 Band VI UMTS 900 Band VIII UMTS 850 Band XIX UMTS 1800 Band III UMTS 1700 Band IV UMTS 850 Band V UMTS 850 Band VI UMTS 900 Band VIII UMTS 850 Band XIX UMTS 2100 Band I UMTS 1900 Band II UMTS 1800 Band III UMTS 1700 Band IV UMTS 850 Band V UMTS 850 Band VI UMTS 900 Band VIII UMTS 850 Band XIX Small MS GSM 850 E-GSM 900 DCS 1800 PCS 1900 GSM 850 E-GSM 900 DCS 1800 PCS 1900 TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD

+23.5

+23.5

+23.5

+23.5

+23.5

+23.5

+23.5

+23.5 TBD TBD TBD TBD 33 33 30 30

+21

+21

+21

+21

+21

+21

+21

+21 Receiver Input Diversity Sensitivity @ ARP @25C, 3.8V UMTS 2100 Band I UMTS 1900 Band II RF Power @ ARP with 50Ohm Load Board temperature < 85C GPRS coding schemes Class 12, CS1 to CS4 Class 12, MCS1 to MCS9 EGPRS GSM Class Static Receiver input Sensi-

tivity @ ARP RF Power @ ARP with 50Ohm Load Board temperature < 85C dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 2.2 RF Antenna Interface 60 Page 46 of 121 Table 11: RF Antenna interface GSM/UMTS/LTE Parameter Conditions Min. Typical Max. RF Power @ ARP with 50Ohm Load,

(ROPR = 4, i.e. no reduction) GPRS, 1 TX GSM 850 EDGE, 1 TX GSM 850 GPRS, 2 TX GSM 850 EDGE, 2 TX GSM 850 GPRS, 3 TX GSM 850 EDGE, 3 TX GSM 850 GPRS, 4 TX GSM 850 E-GSM 900 DCS 1800 PCS 1900 E-GSM 900 DCS 1800 PCS 1900 E-GSM 900 DCS 1800 PCS 1900 E-GSM 900 DCS 1800 PCS 1900 E-GSM 900 DCS 1800 PCS 1900 E-GSM 900 DCS 1800 PCS 1900 E-GSM 900 DCS 1800 PCS 1900 E-GSM 900 DCS 1800 PCS 1900 EDGE, 4 TX GSM 850 33 33 30 30 27 27 26 26 33 33 30 30 27 27 26 26 33 33 30 30 27 27 26 26 33 33 30 30 27 27 26 26 Unit dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 2.2 RF Antenna Interface 60 Page 47 of 121 Table 11: RF Antenna interface GSM/UMTS/LTE Parameter Conditions Min. Typical Max. RF Power @ ARP with 50Ohm Load,

(ROPR =5, i.e. partial reduc-

tion) GPRS, 1 TX GSM 850 EDGE, 1 TX GSM 850 GPRS, 2 TX GSM 850 EDGE, 2 TX GSM 850 GPRS, 3 TX GSM 850 EDGE, 3 TX GSM 850 GPRS, 4 TX GSM 850 EDGE, 4 TX GSM 850 E-GSM 900 DCS 1800 PCS 1900 E-GSM 900 DCS 1800 PCS 1900 E-GSM 900 DCS 1800 PCS 1900 E-GSM 900 DCS 1800 PCS 1900 E-GSM 900 DCS 1800 PCS 1900 E-GSM 900 DCS 1800 PCS 1900 E-GSM 900 DCS 1800 PCS 1900 E-GSM 900 DCS 1800 PCS 1900 33 33 30 30 27 27 26 26 33 33 30 30 27 27 26 26 27 27 26 26 31 31 28 28 27 27 26 26 32.2 32.2 29.2 29.2 Unit dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 2.2 RF Antenna Interface 60 Page 48 of 121 Table 11: RF Antenna interface GSM/UMTS/LTE Parameter Conditions Min. Typical Max. RF Power @ ARP with 50Ohm Load,

(ROPR = 6, i.e. partial reduc-

tion) GPRS, 1 TX GSM 850 EDGE, 1 TX GSM 850 GPRS, 2 TX GSM 850 EDGE, 2 TX GSM 850 GPRS, 3 TX GSM 850 EDGE, 3 TX GSM 850 GPRS, 4 TX GSM 850 EDGE, 4 TX GSM 850 E-GSM 900 DCS 1800 PCS 1900 E-GSM 900 DCS 1800 PCS 1900 E-GSM 900 DCS 1800 PCS 1900 E-GSM 900 DCS 1800 PCS 1900 E-GSM 900 DCS 1800 PCS 1900 E-GSM 900 DCS 1800 PCS 1900 E-GSM 900 DCS 1800 PCS 1900 E-GSM 900 DCS 1800 PCS 1900 33 33 30 30 27 27 26 26 32 32 29 29 27 27 26 26 27 27 26 26 29 29 26 26 27 27 26 26 30.2 30.2 27.2 27.2 Unit dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 2.2 RF Antenna Interface 60 Page 49 of 121 Table 11: RF Antenna interface GSM/UMTS/LTE Parameter Conditions Min. Typical Max. RF Power @ ARP with 50Ohm Load,

(ROPR = 7, i.e. partial reduc-

tion) GPRS, 1 TX GSM 850 EDGE, 1 TX GSM 850 GPRS, 2 TX GSM 850 EDGE, 2 TX GSM 850 GPRS, 3 TX GSM 850 EDGE, 3 TX GSM 850 GPRS, 4 TX GSM 850 EDGE, 4 TX GSM 850 E-GSM 900 DCS 1800 PCS 1900 E-GSM 900 DCS 1800 PCS 1900 E-GSM 900 DCS 1800 PCS 1900 E-GSM 900 DCS 1800 PCS 1900 E-GSM 900 DCS 1800 PCS 1900 E-GSM 900 DCS 1800 PCS 1900 E-GSM 900 DCS 1800 PCS 1900 E-GSM 900 DCS 1800 PCS 1900 33 33 30 30 27 27 26 26 30 30 27 27 27 27 26 26 27 27 26 26 27 27 24 24 27 27 26 26 28.2 28.2 25.2 25.2 Unit dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 2.2 RF Antenna Interface 60 Page 50 of 121 Table 11: RF Antenna interface GSM/UMTS/LTE Parameter Conditions Min. Typical Max. RF Power @ ARP with 50Ohm Load,

(ROPR = 8, i.e. max reduc-

tion) GPRS, 1 TX GSM 850 EDGE, 1 TX GSM 850 GPRS, 2 TX GSM 850 EDGE, 2 TX GSM 850 GPRS, 3 TX GSM 850 EDGE, 3 TX GSM 850 GPRS, 4 TX GSM 850 EDGE, 4 TX GSM 850 E-GSM 900 DCS 1800 PCS 1900 E-GSM 900 DCS 1800 PCS 1900 E-GSM 900 DCS 1800 PCS 1900 E-GSM 900 DCS 1800 PCS 1900 E-GSM 900 DCS 1800 PCS 1900 E-GSM 900 DCS 1800 PCS 1900 E-GSM 900 DCS 1800 PCS 1900 E-GSM 900 DCS 1800 PCS 1900 33 33 30 30 27 27 26 26 30 30 27 27 24 24 23 23 28.2 28.2 25.2 25.2 22.2 22.2 21.2 21.2 27 27 24 24 21 21 20 20 Unit dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 2.2 RF Antenna Interface 60 Page 51 of 121 Table 12: RF Antenna interface LTE for -J variant (at operating temperature range) Parameter Condition Min. Typical Max. Unit LTE connectivity Band 1,3,8,18,19,26 Receiver Input Sensitivity

@ARP, Combiner Antenna, Channel BW at 10MHz

@25C, 3.8V LTE FDD 2100 Band 1 LTE FDD 1800 Band 3 LTE FDD 900 Band 8 LTE FDD 850 Band 18 LTE FDD 850 Band 19 LTE FDD 850 Band 26

-102.2

-102.2

-101.9

-101

-100.3

-100.8 dBm dBm dBm dBm dBm dBm t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 2.2 RF Antenna Interface 60 Page 52 of 121 2.2.2 Antenna Installation The antenna is connected by soldering the antenna pads (ANT_MAIN, ANT_DRX and ANT_GNSS) and their neighboring ground pads directly to the applications PCB. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 K ANT_ MAIN GND GND GND E ANT_ GNSS GND P N M L J H G F D C B A GND ANT_ DRX GND Figure 15: Antenna pads (bottom view) The distance between the antenna pads and their neighboring GND pads has been optimized for best possible impedance. To prevent mismatch, special attention should be paid to these pads on the application PCB. The wiring of the antenna connection, starting from the antenna pad to the applications anten-

na should result in a 50 line impedance. Line width and distance to the GND plane need to be optimized with regard to the PCBs layer stack. Some examples are given in Section 2.2.3. To prevent receiver desensitization due to interferences generated by fast transients like high speed clocks on the external application PCB, it is recommended to realize the antenna con-

nection line using embedded Stripline rather than Micro-Stripline technology. Please see Sec-

tion 2.2.3 for examples of how to design the antenna connection in order to achieve the required 50 line impedance. For type approval purposes, the use of a 50 coaxial antenna connector (U.FL-R-SMT) might be necessary. In this case the U.FL-R-SMT connector should be placed as close as possible to PLSx3s antenna pad. t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 2.2 RF Antenna Interface 60 2.2.3 RF Line Routing Design 2.2.3.1 Line Arrangement Examples Page 53 of 121 Several dedicated tools are available to calculate line arrangements for specific applications and PCB materials - for example from http://www.polarinstruments.com/ (commercial software) or from http:www.awr.com/awr-software/options/tx-line/ (free software). Embedded Stripline This figure below shows a line arrangement example for embedded stripline. Figure 16: Embedded stripline arrangement example t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 2.2 RF Antenna Interface 60 Page 54 of 121 Micro-Stripline This section gives two line arrangement examples for micro-stripline. Figure 17: Micro-Stripline arrangement example t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 2.2 RF Antenna Interface 60 Page 55 of 121 2.2.3.2 Routing Example Interface to RF Connector Figure 18 and Figure show a sample connection of a modules antenna pad at the bottom layer of the module PCB with an application PCBs coaxial antenna connector. Line impedance de-

pends on line width, but also on other PCB characteristics like dielectric, height and layer gap. The sample stripline width of 0.33mm/0.8mm and the space of 0.625mm/0.173mm are only recommended for an application with a PCB layer stack resembling the one of the PLSx3 evaluation board, and with layer 2 as well as layer 3 cut clear. For different layer stacks the stripline width will have to follow stripline routing rules, avoiding 90 degree comers and using the shortest distance to the PCBs coaxial antenna connector. G N D G N D e.g. ANT_ TRX1 Stripline (50 ohms) on top layer of evaluation board from antenna pad to module edge Width = 0.33 mm Ground connection Edge of module PCB 50 ohms microstrip line E.g., U.FL antenna connector G N D G N D Figure 18: Routing to applications RF connector t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 2.2 RF Antenna Interface 60 Page 56 of 121 RF track under module:

Line/space: /m Module RF track outside module: Line/space:

0/m Figure 19: Routing Detail t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 2.3 GNSS Antenna Interface 60 2.3 GNSS Antenna Interface Page 57 of 121 In addition to the RF antenna interface PLSx3 also has a GNSS antenna interface. See Section 2.1.1 to find out where the GNSS antenna pad is located. The GNSS pads shape is the same as for the RF antenna interface (see Section 2.2.2). It is possible to connect active or passive GNSS antennas. In either case they must have 50 impedance. The simultaneous operation of GSM/UMTS/LTE and GNSS is implemented. For electrical characteristics see Section 2.2. PLSx3 provides the signal VGNSS to enable an active GNSS antenna power supply. Figure 20 shows the flexibility in realizing the power supply for an active GNSS antenna by giving a sam-

ple circuit realizing the supply voltage for an active GNSS antenna. Module Application:

GNSS Receiver Antenna Matching ANT_GNSS ANT_GNSS_DC RF DC DC LNA Active GNSS Antenna BATT+

VGNSS

(3.2V) VGNSS IN OUT EN LDO LP3985IM5-3.2 Rs Is 1R0 Rv 100

Io Current Sensor FAN4010 Io Rg 3k3 ADCx_IN Si1023X_1 10k 1u ESD Protection Si1023X_2 10k Ug Figure 20: Supply voltage for active GNSS antenna t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 2.3 GNSS Antenna Interface 60 Page 58 of 121 Figure 21 shows a sample circuit realizing ESD protection for a passive GNSS antenna. Con-

necting the input ANT_GNSS_DC to GND prevents ESD from coupling into the module. Module SMT interface VGNSS Not used 100nF ANT_GNSS_DC 12nH ANT_GNSS To GNSS receiver

(Optional) ESD protection 0R Passive GNSS antenna Figure 21: ESD protection for passive GNSS antenna 2.3.1 GNSS Antenna Diagnostic GNSS antenna diagnosis does require an external detection circuit. The antenna DC supply current can be measured via ADCx_IN. The ADCx_IN input voltage (Ug) may be generated by a sample circuit shown in Figure 20. The circuit allows to check the presence and the connec-

tion status of an active GNSS antenna. Passive GNSS antennas cannot be detected. There-

fore, GNSS antenna detection is only available in active GNSS antenna mode. This mode is configured by the AT command: AT^SGPSC (for details see [1]) Having enabled the active GNSS antenna mode the presence and connection status of an ac-

tive GNSS antenna can be checked using the AT command AT^SRADC to monitor ADCx_IN. The following table lists sample current ranges for possible antenna states as well as sample voltage ranges as possible decision thresholds to distinguish between the antenna connection states. Please refer to [1] for more information on the command AT^SRADC. Table 13: Sample ranges of the GNSS antenna diagnostic measurements and their possible meaning Antenna connection status Antenna not connected Decision threshold Antenna connected Decision threshold Current ranges (IS)1

<1.4mA Voltage ranges (UG) 2.2mA...20mA 59mV 20%

825mV 20%

Antenna short circuited to ground

>30mA GNSS antenna detection is not possible because GNSS antenna power supply is switched off.

1. Please note that the mA ranges 1.4mA...2.2mA and 20mA...30mAare tolerance ranges. The decision threshold should be defined within these ranges. t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 2.4 Sample Application 60 Page 59 of 121 2.4 Sample Application Figure 22 shows a typical example of how to integrate a PLSx3 module with an application. Usage of the various host interfaces depends on the desired features of the application. Because of the very low power consumption design, current flowing from any other source into the module circuit must be avoided, for example reverse current from high state external control lines. Therefore, the controlling application must be designed to prevent reverse current flow. Otherwise there is the risk of undefined states of the module during startup and shutdown or even of damaging the module. Because of the high RF field density inside the module, it cannot be guaranteed that no self interference might occur, depending on frequency and the applications grounding concept. The potential interferers may be minimized by placing small capacitors (47pF) at suspected lines

(e.g. RXD0, VDDLP, and ON). While developing SMT applications it is strongly recommended to provide test points for certain signals, i.e., lines to and from the module - for debug and/or test purposes. The SMT application should allow for an easy access to these signals. For details on how to implement test points see [4]. The EMC measures are best practice recommendations. In fact, an adequate EMC strategy for an individual application is very much determined by the overall layout and, especially, the po-

sition of components. For example, mounting the internal acoustic transducers directly on the PCB eliminates the need to use the ferrite beads shown in the sample schematic. Disclaimer No warranty, either stated or implied, is provided on the sample schematic diagram shown in Figure 22 and the information detailed in this section. As functionality and compliance with na-

tional regulations depend to a great amount on the used electronic components and the indi-

vidual application layout manufacturers are required to ensure adequate design and operating safeguards for their products using PLSx3 modules. t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 2.4 Sample Application 60 Page 60 of 121 BATT+_DSB 0R

100F, Low ESR!

100F, Low ESR!

220nF 47F 10F 4.7F 22pF 0R 0R

100F, Low ESR!

V180 PLSx3 2 2 BATT+BB BATT+RF V180 EMERG_RST Main antenna Diversity antenna GNSS antenna ANT_MAIN ANT_DRX GND GND GND GND GND GND ANT_GNSS GND IGT ANT_GNSS_DC ANT_GNSS_DC

*For more details see Section 5.2 GNSS Antenna Interface 47k

47k

GND E.g., VBATT E.g., 100k Power Indicator PWR_IND CCVCC1 USB USB interface*

*For more details see Section 2.1.3 USB Interface 3 8 4 5 3 ACS0 ACS1 ADC Status Serial Interface Serial Interface ADC input interface Status LED CCIO1 Digital Audio PCM(I2S) Interface&MCLK CCVCC1 k 0 1 CCCLK1 CCRST1 CCIN1 SIM1 GND SIM2 GND F n 1 F p 0 1 F p 0 1 F n 0 2 2 GND GND GND GND CCV CC2 k 0 1 CCVCC1 CCIO1 CCCLK1 CCRST1 CCIN1 F n 1 F p 0 1 F p 0 1 F n 0 2 2 GND GND GND GND GND FST_SHDN Fast shutdown SIM_SWITCH SIM Switch GPIO GPIO*

V180 k 2 2

. k 2 2

. I2CCLK I2CDAT GND Figure 22: Schematic diagram of PLSx3 sample application

*When has the function of GPIO multiplexing PADs, used as GPIO function, need through the SW switch command. t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 3 Operating Characteristics 82 3 Operating Characteristics 3.1 Operating Modes Page 61 of 121 The table below briefly summarizes the various operating modes referred to throughout the document. Table 14: Overview of operating modes Mode Function Normal operation GSM /

GPRS / UMTS /

HSPA / LTE SLEEP GSM /

GPRS / UMTS /

HSPA / LTE IDLE GSM TALK/

GSM DATA GPRS DATA EGPRS DATA UMTS TALK/

UMTS DATA HSPA DATA Power saving set automatically when no call is in progress and the USB connection is suspended by host or not present and no active commu-

nication via ASC0. Power saving disabled or an USB connection not suspended, but no call in progress. Connection between two subscribers is in progress. Power consump-

tion depends on the GSM network coverage and several connection settings (e.g. DTX off/on, FR/EFR/HR, hopping sequences and antenna connection). The following applies when power is to be mea-

sured in TALK_GSM mode: DTX off, FR and no frequency hopping. GPRS data transfer in progress. Power consumption depends on net-

work settings (e.g. power control level), uplink / downlink data rates and GPRS configuration (e.g. used multislot settings). EGPRS data transfer in progress. Power consumption depends on net-

work settings (e.g. power control level), uplink / downlink data rates and EGPRS configuration (e.g. used multislot settings). UMTS data transfer in progress. Power consumption depends on net-

work settings (e.g. TPC Pattern) and data transfer rate. HSPA data transfer in progress. Power consumption depends on net-

work settings (e.g. TPC Pattern) and data transfer rate. LTE TALK/

LTE DATA LTE data transfer in progress. Power consumption depends on network settings (e.g. TPC Pattern) and data transfer rate. Power Down Normal shutdown after sending the power down command. Only a voltage regulator is active for powering the RTC. Software is not active. Interfaces are not accessible. Operat-

ing voltage remains applied. Airplane mode Airplane mode shuts down the radio part of the module, causes the module to log off from the network and disables all AT commands whose execution requires a radio connection. Airplane mode can be controlled by AT command (see [1]). t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 3.2 Power Up/Power Down Scenarios 82 3.2 Power Up/Power Down Scenarios Page 62 of 121 In general, be sure not to turn on PLSx3 while it is beyond the safety limits of voltage and tem-

perature stated in Section 2.1.2.1. PLSx3 immediately switches off after having started and de-

tected these inappropriate conditions. In extreme cases this can cause permanent damage to the module. 3.2.1 Turn on PLSx3 After the operating voltage BATT+ is applied, PLSx3 can be switched on by means of the IGT signal. The IGT signal turns on the module if the module is in power down mode. The IGT signal is low level triggered. The module starts in the operating mode with a continuous low level signal. It is recommended to pull the IGT sinal to GND directly when powering on. The low pulse width must be longer than 300ms as shown in Figure 23. When a automatic power-on is needed, IGT can always be connected to GND.

>300 ms BATT+

IGT V180 EMERG_RST 3.2.2 Restart PLSx3 Figure 23: IGT timing To switch the module off the following procedures may be used:

Software controlled restart procedure: Software controlled by sending an AT command over the serial application interface. See Section 3.2.2.1. Hardware controlled restart procedure: Hardware controlled by using the EMERG_RST line (see Section 3.2.2.2). 3.2.2.1 Restart PLSx3 Using Restart Command After startup PLSx3 can be re-started using the AT+CFUN command. For details see [1]

t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 3.2 Power Up/Power Down Scenarios 82 3.2.2.2 Restart PLSx3 Using EMERG_RST Page 63 of 121 The EMERG_RST signal is internally connected to the baseband processor. A low level >2 00ms sets the processor and all signals to the reset states, and thus restart the module. Please note that if the EMERG_RST signal is not released, i.e., changed from low to high, after a restart, the module will be repeatedly restarted. When the timer of the EMERG_RST signal is more than 8000ms, the module will be switched off directly. It is strongly recommended to control this EMERG_RST line with an open collector transistor or an open drain field-effect transistor. Caution: Use the EMERG_RST line only when, due to serious problems, the software is not responding for more than 5 seconds. Pulling the EMERG_RST line causes the loss of all information stored in the volatile memory. Therefore, this procedure is intended only for use in case of emergency, e.g. if PLSx3 does not respond, if reset or shutdown via AT command fails. t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 3.2 Power Up/Power Down Scenarios 82 3.2.3 Signal States after Startup Page 64 of 121 Table 15 lists the states each interface signal passes through during reset phase and the first firmware initialization. For further firmware startup initializations the values may differ because of different GPIO line configurations. After the reset state has been reached the firmware initialization state begins. The firmware ini-

tialization is completed as soon as the ASC0 interface lines CTS0, DSR0 and RING0 have turned low (see Section 2.1.4 and Section 2.1.5). Now, the module is ready to receive and transmit data. Table 15: Pull-up and Pull-down Values Signal name Reset state First start up configuration RXD0 TXD0 RTS0 CTS0 STATUS/GPIO5 DSR0/GPIO3 DCD0/GPIO2 RING0/GPIO24 RXD1/GPIO16 TXD1/GPIO17 RTS1/GPIO18 CTS1/GPIO19 GPIO6-8 GPIO11-13 GPIO14-15 GPIO25 DOUT/GPIO20 DIN/GPIO21 SIM_SWITCH/GPIO26 FAST_SHDN/GPIO4 PD PD PD PD PD PD PD PD PD PD O/H PD PD I PD PD PD PD O/H PD O/L PD O/L O/H O/H O/H PD PD O/H PD PD I PD O/H PD PD Note: the values above are stored as non- volatile, any changes of the value will take effect after next power-cycle and remain effective before any change happens again. Abbreviations used in above Table 15:

L = Low level H = High level T = Tristate I = Input O = Output OD = Open Drain PD = Pull down, 200A at 1.9V PU = Pull up, -240A at 0V t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 3.2 Power Up/Power Down Scenarios 82 Page 65 of 121 3.2.4 Turn off PLSx3 To switch the module off the following procedures may be used:

Software controlled shutdown procedure: Software controlled by sending an AT command over the serial application interface. See Section 3.2.4.1 Hardware controlled shutdown procedure: Hardware controlled by setting the FST_SHDN line to low. See Section 2.1.10.3 Automatic shutdown (software controlled): See Section 3.2.5

- Take effect if PLSx3 board temperature exceeds a critical limit, or if

- Undervoltage or overvlotage is detected. 3.2.4.1 Switch off PLSx3 Using AT Command The best and safest approach to powering down the module is to issue the AT^SMSO com-

mand. This procedure lets the module log off from the network and allows the software to enter into a secure state and to save data before disconnecting the power supply. The shutdown pro-

cedure will be an active process for about 2 seconds (depending on environmental conditions such as network states) until the module switches off. A low level of the V180 signal as well as the URC "^SHUTDOWN" indicate that the switch off procedure has completed and the module has entered the Power Down mode. 3.2.5 Automatic Shutdown Automatic shutdown takes effect if the following event occurs:

PLSx3 board is exceeding the critical limits of overtemperature or undertemperature (see Section 3.2.5.1) Undervoltage or overvoltage is detected (see Section 3.2.5.2 and Section 3.2.5.3) The automatic shutdown procedure is equivalent to the power-down initiated with an AT com-

mand, i.e. PLSx3 logs off from the network and the software enters a secure state avoiding loss of data. 3.2.5.1 Thermal Shutdown The board temperature is constantly monitored by an internal NTC resistor located on the PCB. The values detected by the NTC resistor are measured directly on the board and therefore, are not fully identical with the ambient temperature. Each time the board temperature goes out of range or back to normal, PLSx3 instantly displays an alert (if enabled). URCs indicating the level "1" or "-1" allow the user to take appropriate precautions, such as protecting the module from exposure to extreme conditions. The presentation of the URCs depends on the settings selected with the AT^SCTM write command (for details see [1]):

AT^SCTM=1: Presentation of URCs is always enabled. AT^SCTM=0 (default): Presentation of URCs is enabled during the 2 minute guard period after start-up of PLSx3. After expiry of the 2 minute guard period, the presentation of URCs will be disabled, i.e. no URCs with alert levels "1" or ''-1" will be generated. URCs indicating the level "2" or "-2" are instantly followed by an orderly shutdown after 5 seconds unless the temperature returns to a valid operating level ("1", "0", "-1") or the shut-

down ability was disabled with AT^SCFG, "MEopMode/ShutdownOnCritTemp",<sdoct>. The presentation of these URCs is always enabled, i.e. they will be output even though the t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 3.2 Power Up/Power Down Scenarios 82 factory setting AT^SCTM=0 was never changed. Page 66 of 121 The maximum temperature ratings are stated in Section 3.6. Refer to Table 16 for the associ-

ated URCs. Table 16: Temperature associated URCs Sending temperature alert (2min after PLSx3 start-up, otherwise only if URC presentation enabled)

^SCTM_B: 1 Board close to overtemperature limit.

^SCTM_B: -1 Board close to undertemperature limit.

^SCTM_B: 0 Board back to non-critical temperature range. Automatic shutdown (URC appears no matter whether or not presentation was enabled)

^SCTM_B: 2 Alert: Board equal or beyond overtemperature limit. PLSx3 switches off.

^SCTM_B: -2 Alert: Board equal or below undertemperature limit. PLSx3 switches off. t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 3.2 Power Up/Power Down Scenarios 82 3.2.5.2 Undervoltage Shutdown Page 67 of 121 The undervoltage shutdown threshold is the specified minimum supply voltage VBATT+ given in Table 3. When the average supply voltage measured by PLSx3 approaches the undervolt-

age shutdown threshold (i.e., 0.05V offset) the module will send the following URC:

^SBC: Undervoltage Shutdown If the undervoltage persists the module will send the URC several times before switching off automatically. This type of URC does not need to be activated by the user. It will be output automatically when fault conditions occur. 3.2.5.3 Overvoltage Shutdown The overvoltage shutdown threshold is the specified maximum supply voltage VBATT+ given in Table 3. When the supply voltage approaches the overvoltage shutdown threshold, the mod-

ule will send the following URC:

^SBC: Overvoltage Shutdown The overvoltage warning is sent only once before the module is close to the overvoltage shut-

down threshold again. This type of URC does not need to be activated by the user. It will be output automatically when fault conditions occur. Keep in mind that several PLSx3 components are directly linked to BATT+ and, therefore, the supply voltage remains applied at major parts of PLSx3, even if the module is switched off. Es-

pecially the power amplifier is very sensitive to high voltage and might even be destroyed t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 3.3 Power Saving 82 Page 68 of 121 3.2.5.4 Deferred Shutdown at Extreme Temperature Condition In the following cases, automatic shutdown will be deferred if a critical temperature limit is ex-

ceeded:

While an emergency call is in progress. During a two minute guard period after power-up. This guard period has been introduced in order to allow for the user to make an emergency call. The start of any one of these calls extends the guard period until the end of the call. Any other network activity may be terminated by shutdown upon expiry of the guard time. While in a "deferred shutdown" situation, PLSx3 continues to measure the temperature and to deliver alert messages, but deactivates the shutdown functionality. Once the 2 minute guard period is expired or the call is terminated, full temperature control will be resumed. If the tem-

perature is still out of range, PLSx3 switches off immediately (without another alert message). Caution: Automatic shutdown is a safety feature intended to prevent damage to the module. Extended usage of the deferred shutdown facilities provided may result in damage to the mod-

ule, and possibly other severe consequences. 3.3 Power Saving PLSx3 is able to reduce its functionality to a minimum (during the so-called SLEEP mode and SUSPEND mode) in order to minimize its current consumption. The following sections explain the modules network dependent power saving behavior. The power saving behavior is further configurable by AT command:

When all serial interfaces (i.e. ASC0, and ASC1) are idle, the module can enter SLEEP mode by additional configuration settings (i.e. AT^SPOW=2.3000,255). AT^SCFG= "MEopMode/ExpectDTR": Power saving will take effect only if there is no trans-

mission data pending on any of the modules USB ports. The expect DTR AT command ensures that data becoming pending on any USB port before an external application has signaled its readiness to receive the data is discarded. By default this behavior is enabled for all available USB CDC ACM. Using the AT command AT^SCFG="Radio/OutputPowerReduction" it is possible for the module in GPRS multislot scenarios to reduce its output power according to 3GPP 45.005 section. 3.3.1 Power Saving while Attached to GSM Networks The power saving possibilities while attached to a GSM network depend on the paging timing cycle of the base station. The duration of a power saving interval can be calculated using the following formula:

t = 4.615 ms (TDMA frame duration) * 51 (number of frames) * DRX value. DRX (Discontinuous Reception) is a value from 2 to 9, resulting in paging intervals between 0.47 and 2.12 seconds. The DRX value of the base station is assigned by the GSM network operator. t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 3.3 Power Saving 82 Page 69 of 121 Now, a paging timing cycle consists of the actual fixed length paging plus a variable length pause before the next paging. In the pauses between listening to paging messages, the module resumes power saving, as shown in Figure 24. Figure 24: Power saving and paging in GSM networks The varying pauses explain the different potential for power saving. The longer the pause the less power is consumed. Generally, power saving depends on the modules application scenario and may differ from the above mentioned normal operation. The power saving interval may be shorter than 0.47 sec-

onds or longer than 2.12 seconds. 3.3.2 Power Saving while Attached to WCDMA Networks The power saving possibilities while attached to a WCDMA network depend on the paging tim-

ing cycle of the base station. During normal WCDMA operation, i.e., the module is connected to a WCDMA network, the duration of a power saving period varies. It may be calculated using the following formula:

t = 2DRX value * 10 ms (WCDMA frame duration). DRX (Discontinuous Reception) in WCDMA networks is a value between 6 and 9, thus result-

ing in power saving intervals between 0.64 and 5.12 seconds. The DRX value of the base sta-

tion is assigned by the WCDMA network operator. Now, a paging timing cycle consists of the actual fixed length paging plus a variable length pause before the next paging. In the pauses between listening to paging messages, the module resumes power saving, as shown in Figure 25. Figure 25: Power saving and paging in WCDMA networks The varying pauses explain the different potential for power saving. The longer the pause the less power is consumed. t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 3.3 Power Saving 82 Page 70 of 121 Generally, power saving depends on the modules application scenario and may differ from the above mentioned normal operation. The power saving interval may be shorter than 0.64 sec-

onds or longer than 5.12 seconds. 3.3.3 Power Saving while Attached to LTE Networks The power saving possibilities while attached to an LTE network depend on the paging timing cycle of the base station. During normal LTE operation, i.e., the module is connected to an LTE network, the duration of a power saving period varies. It may be calculated using the following formula:

t = DRX Cycle Value * 10 ms DRX cycle value in LTE networks is any of the four values: 32, 64, 128 and 256, thus resulting in power saving intervals between 0.32 and 2.56 seconds. The DRX cycle value of the base station is assigned by the LTE network operator. Now, a paging timing cycle consists of the actual fixed length paging plus a variable length pause before the next paging.In the pauses between listening to paging messages, the module resumes power saving, as shown in Figure 26. Figure 26: Power saving and paging in LTE networks The varying pauses explain the different potential for power saving. The longer the pause the less power is consumed. Generally, power saving depends on the modules application scenario and may differ from the above mentioned normal operation. The power saving interval may be shorter than 0.32 sec-

onds or longer than 2.56 seconds. t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 3.3 Power Saving 82 Page 71 of 121 3.3.4 Wake-up via RTS0 RTS0 can be used to wake up PLSx3 from SLEEP mode configured with AT^SPOW. Assertion of RTS0 (i.e., toggle from inactive high to active low) serves as wake up event, thus allowing an external application to almost immediately terminate power saving. After RTS0 assertion, the CTS0 line signals module wake up, i.e., readiness of the AT command interface. It is there-

fore recommended to enable RTS/CTS flow control (default setting). Figure 27 shows the described RTS0 wake up mechanism. R T S 0 C T S 0 T X D 0 R X D 0 R T S a s s e r t io n ( f a llin g e d g e ) R T S b a c k W a k e u p f r o m S L E E P m o d e R e t u r n t o S L E E P m o d e A T c o m m a n d R e p ly U R C Figure 27: Wake-up via RTS0 t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 3.4 Power Supply 82 Page 72 of 121 3.4 Power Supply PLSx3 needs to be connected to a power supply at the SMT application interface - 4 lines BATT+, and GND. There are two separate voltage domains for BATT+:

BATT+BB with two lines for the general power management. BATT+RF with two lines for the RF. Please note that throughout the document BATT+ refers to both voltage domains and power supply lines - BATT+BB and BATT+RF. The main power supply from an external application has to be a single voltage source and has to be expanded to sub paths (star structure). 150F capacitors should be placed as close as possible to the BATT+ pads. Figure 28 shows a sample circuit for decoupling capacitors for BATT+. Module SMT interface BATT+BB BATT+RF 2 2 150F low ESR capacitors 150F low ESR capacitors BATT+

GND Figure 28: Decoupling capacitor(s) for BATT+

The power supply of PLSx3 must be able to provide the peak current during the uplink trans-

mission. All the key functions for supplying power to the device are handled by the power management section of the analog controller. This IC provides the following features:

Stabilizes the supply voltages for the baseband using low drop linear voltage regulators and DC-DC step down switching regulators. Switches the module's power voltages for the power-up and -down procedures. SIM switch to provide SIM power supply. t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 3.4 Power Supply 82 3.4.1 Power Supply Ratings Page 73 of 121 The tables in this section assemble various voltage supply and current consumption ratings of the module. Table 17: Supply Ratings Description Conditions BATT+

Supply voltage Min Typ Max Unit 3.0 3.8 4.5 V Normal Range

(Directly measured at Module. Volt-

age must stay within the min/max values, including voltage drop, ripple, spikes.) The module shall work with supply voltages between 3.0 and 4.5V as normal voltage range. Normal condition, power control level for Pout max Normal condition, power control level for Pout max

@ f < 250 kHz

@ f > 250 kHz Maximum allowed voltage drop during transmit burst Voltage ripple 400 mV 120 90 mVpp mVpp t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 3.4 Power Supply 82 Page 74 of 121 Table 18: Current Consumption Ratings -GSM1 Description Conditions OFF State supply current POWER DOWN 2 IBATT+

(i.e., sum of BATT+BB and BATT+RF) GSM SLEEP State supply current SLEEP3 @ DRX=9

(no communication via UART) SLEEP3 @ DRX=5

(no communication via UART) SLEEP3 @ DRX=2

(no communication via UART) USB disconnected USB suspended USB disconnected USB suspended USB disconnected USB suspended GSM IDLE4 State supply current IDLE @ DRX=2

(UART active, but no communication) USB disconnected USB active Average GSM850 supply current5 GPRS Data transfer GSM850;

PCL=5; 1Tx/4Rx Typical rating

(W,EP,LA,J, I) Unit TBD TBD TBD TBD TBD TBD TBD TBD TBD 306 300 450 551 600 1005 187 189 270 330 418 583 A mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA ROPR=8

(max. reduction) ROPR=4

(no reduction) ROPR=8

(max. reduction) ROPR=4

(no reduction) ROPR=8

(max. reduction) ROPR=4

(no reduction) ROPR=8

(max. reduction) ROPR=4

(no reduction) ROPR=8

(max. reduction) ROPR=4

(no reduction) ROPR=8

(max. reduction) ROPR=4

(no reduction) GPRS Data transfer GSM850;

PCL=5; 2Tx/3Rx GPRS Data transfer GSM850;

PCL=5; 4Tx/1Rx EDGE Data transfer GSM850;

PCL=5; 1Tx/4Rx EDGE Data transfer GSM850;

PCL=5; 2Tx/3Rx EDGE Data transfer GSM850;

PCL=5; 4Tx/1Rx t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 3.4 Power Supply 82 Page 75 of 121 Table 18: Current Consumption Ratings -GSM1 Description Conditions 2 IBATT+

(i.e., sum of BATT+BB and BATT+RF) Average GSM900 supply current5 GPRS Data transfer GSM900;

PCL=5; 1Tx/4Rx Typical rating

(W,EP,LA,J, I) Unit 287 287 425 530 613 985 180 179 272 315 422 565 mA mA mA mA mA mA mA mA mA mA mA mA ROPR=8

(max. reduction) ROPR=4

(no reduction) ROPR=8

(max. reduction) ROPR=4

(no reduction) ROPR=8

(max. reduction) ROPR=4

(no reduction) ROPR=8

(max. reduction) ROPR=4

(no reduction) ROPR=8

(max. reduction) ROPR=4

(no reduction) ROPR=8

(max. reduction) ROPR=4

(no reduction) GPRS Data transfer GSM900;

PCL=5; 2Tx/3Rx GPRS Data transfer GSM900;

PCL=5; 4Tx/1Rx EDGE Data transfer GSM900;

PCL=5; 1Tx/4Rx EDGE Data transfer GSM900;

PCL=5; 2Tx/3Rx EDGE Data transfer GSM900;

PCL=5; 4Tx/1Rx t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 3.4 Power Supply 82 Page 76 of 121 Table 18: Current Consumption Ratings -GSM1 Description Conditions 2 IBATT+

(i.e., sum of BATT+BB and BATT+RF) Average GSM1800 supply current5 GPRS Data transfer GSM1800; PCL=0;

1Tx/4Rx Typical rating

(W,EP,LA,J, I) Unit 194 194 279 346 418 625 141 143 220 246 372 443 mA mA mA mA mA mA mA mA mA mA mA mA ROPR=8

(max. reduction) ROPR=4

(no reduction) ROPR=8

(max. reduction) ROPR=4

(no reduction) ROPR=8

(max. reduction) ROPR=4

(no reduction) ROPR=8

(max. reduction) ROPR=4

(no reduction) ROPR=8

(max. reduction) ROPR=4

(no reduction) ROPR=8

(max. reduction) ROPR=4

(no reduction) GPRS Data transfer GSM1800; PCL=0;

2Tx/3Rx GPRS Data transfer GSM1800; PCL=0;

4Tx/1Rx EDGE Data transfer GSM1800; PCL=0;

1Tx/4Rx EDGE Data transfer GSM1800; PCL=0;

2Tx/3Rx EDGE Data transfer GSM1800; PCL=0;

4Tx/1Rx t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 3.4 Power Supply 82 Page 77 of 121 Table 18: Current Consumption Ratings -GSM1 Description Conditions 2 IBATT+

(i.e., sum of BATT+BB and BATT+RF) Average GSM1900 supply current5 GPRS Data transfer GSM1900; PCL=0;

1Tx/4Rx ROPR=8

(max. reduction) ROPR=4

(no reduction) ROPR=8

(max. reduction) ROPR=4

(no reduction) ROPR=8

(max. reduction) ROPR=4

(no reduction) ROPR=8

(max. reduction) ROPR=4

(no reduction) ROPR=8

(max. reduction) ROPR=4

(no reduction) ROPR=8

(max. reduction) ROPR=4

(no reduction) GPRS Data transfer GSM1900; PCL=0;

2Tx/3Rx GPRS Data transfer GSM1900; PCL=0;

4Tx/1Rx EDGE Data transfer GSM1900; PCL=0;

1Tx/4Rx EDGE Data transfer GSM1900; PCL=0;

2Tx/3Rx EDGE Data transfer GSM1900; PCL=0;

4Tx/1Rx GPRS Data transfer GSM850; PCL=5; 1Tx/

1Rx @ 50 GPRS Data transfer GSM900; PCL=5; 1Tx/

1Rx @ 50 GPRS Data transfer DCS1800; PCL=0; 1Tx/

1Rx @ 50 GPRS Data transfer PCS1900; PCL=0; 1Tx/

1Rx @ 50 GPRS Data transfer GMS850; PCL=5; 1Tx/

1Rx @ total mismatch GPRS Data transfer GMS900; PCL=5; 1Tx/

1Rx @ total mismatch GPRS Data transfer DCS1800; PCL=0; 1Tx/

1Rx @ total mismatch GPRS Data transfer DCS1900; PCL=0; 1Tx/

1Rx @ total mismatch Typical rating

(W,EP,LA,J, I) Unit 190 185 270 332 410 615 139 142 216 246 372 448 2.2 2.2 1.4 1.4 2.8 2.9 1.7 1.8 mA mA mA mA mA mA mA mA mA mA mA mA A A A A A A A A Peak current during GSM transmit burst5 1. Note: Current consumption ratings are based on measurements done in a laboratory test environment, and deviations may occur from the given typical ratings. Under real life conditions however, with e.g., vary-

ing network quality, location changes, or changing supply currents, the deviations from these typical rat-

ings may be even bigger, and will have to be taken into account for actual power supply solutions. For more details on power supply design see [3]. 2. With an impedance of ZLOAD=50 at the antenna pad. Measured at 25C and 3.8V. t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 3.4 Power Supply 82 Page 78 of 121 3. Measurements start 6 minutes after switching ON the module, averaging times: SLEEP mode 3 minutes, transfer modes 1.5 minutes Communication tester settings:no neighbor cells, no cell reselection etc., RMC (Reference Measurement Channel) SLEEP mode is enabled via AT command AT^SPOW=2, 1000, 3 4. The power save mode is disabled via AT command AT^SPOW=1,0,0 5. The communication tester settings of Channel: Mid Channel Table 19: Current Consumption Ratings - UMTS1 Description Conditions 2 IBATT+

(i.e., sum of BATT+BB and BATT+RF) OFF State supply current UMTS SLEEP State supply current Typical rating

(W,EP,L A,J,I) Typical rating

(X, X2, X3, X4) Unit POWER DOWN TBD TBD A SLEEP3 @ DRX=9

(no communication via UART) SLEEP3 @ DRX=8

(no communication via UART) SLEEP3 @ DRX=6

(no communication via UART) USB disconnected USB suspended USB disconnected USB suspended USB disconnected USB suspended USB disconnected USB active UMTS IDLE4 State supply current IDLE @ DRX=6

(UART active, but no communication) UMTS average supply current 5 UMTS Data transfer Band I UMTS Data transfer Band II UMTS Data transfer Band III UMTS Data transfer Band IV UMTS Data transfer Band V UMTS Data transfer Band VI UMTS Data transfer Band VIII UMTS Data transfer Band XIX TBD TBD mA TBD TBD mA TBD TBD mA TBD TBD mA TBD TBD mA TBD TBD mA TBD TBD mA TBD TBD mA 560 530 480 530 500 500 530 485 600 710 690 mA mA mA mA mA mA mA mA 1. Note: Current consumption ratings are based on measurements done in a laboratory test environment, and deviations may occur from the given typical ratings. Under real life conditions however, with e.g., varying network quality, location changes, or changing supply currents, the deviations from these typical ratings may be even bigger, and will have to be taken into account for actual power supply solutions. For more details on power supply design see [3]. 2. With an impedance of ZLOAD=50 at the antenna pad. Measured at 25C and 3.8V. 3. Measurements start 6 minutes after switching ON the module, averaging times: SLEEP mode 3 minutes, transfer modes 1.5 minutes Communication tester settings:no neighbor cells, no cell reselection etc., RMC (Reference Measurement Channel) SLEEP mode is enabled via AT command AT^SPOW=2, 1000, 3 t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 3.4 Power Supply 82 Page 79 of 121 4. The power save mode is disabled via AT command AT^SPOW=1,0,0 5. The communication tester settings of Channel: Mid Channel The value is based on the latest test result and may have update in the future releases. t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 3.4 Power Supply 82 Page 80 of 121 Table 20: Current Consumption Ratings - LTE1 Description Conditions Unit Typical rating

(W,EP, LA,J,I) Typical rating

(X,X2,X 3,X4) OFF State supply current LTE SLEEP State supply current 2 IBATT+

(i.e., sum of BATT+

BB and BATT+

RF) POWER DOWN SLEEP3 @ Paging Cycles =

256

(no communication via UART) SLEEP3 @ Paging Cycles =

128

(no communication via UART) SLEEP3 @ Paging Cycles =

64

(no communication via UART) SLEEP3 @ Paging Cycles =

32

(no communication via UART) USB disconnected USB suspended USB disconnected USB suspended USB disconnected USB suspended USB disconnected USB suspended LTE IDLE4 State supply current LTE average supply cur-

rent5 IDLE (USB disconnected) IDLE (USB active) LTE Data transfer Band 1 LTE Data transfer Band 2 LTE Data transfer Band 3 LTE Data transfer Band 4 LTE Data transfer Band 5 LTE Data transfer Band 7(-W) LTE Data transfer Band 7(-EP, LA) TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD 600 610 550 560 540 750 610 660 640 615 630 515 545 615 620 600 385 380 385 615 A mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA 595 660 580 580 585 520 600 LTE Data transfer Band 8 LTE Data transfer Band 12 LTE Data transfer Band 13 LTE Data transfer Band 14 LTE Data transfer Band 17 LTE Data transfer Band 18 LTE Data transfer Band 19 LTE Data transfer Band 20 LTE Data transfer Band 25 LTE Data transfer Band 26 LTE Data transfer Band 28 LTE Data transfer Band 38 LTE Data transfer Band 40 LTE Data transfer Band 41 LTE Data transfer Band 66 LTE Data transfer Band 71 t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 3.4 Power Supply 82 Page 81 of 121 1. Note: Current consumption ratings are based on measurements done in a laboratory test environment, and deviations may occur from the given typical ratings. Under real life conditions however, with e.g., varying net-

work quality, location changes, or changing supply currents, the deviations from these typical ratings may be even bigger, and will have to be taken into account for actual power supply solutions. For more details on power supply design see [3]. 2. With an impedance of ZLOAD=50 at the antenna pad. Measured at 25C and 3.8V. 3. Measurements start 6 minutes after switching ON the module, averaging times: SLEEP mode 3 minutes, transfer modes 1.5 minutes Communication tester settings:no neighbor cells, no cell reselection etc., RMC (Reference Measurement Channel) SLEEP mode is enabled via AT command AT^SPOW=2, 1000, 3 4. The power save mode is disabled via AT command AT^SPOW=1,0,0 5. Communication tester setting:

Channel: Mid Channel Channel Bandwidth: 5MHz Number of Resource Blocks: 25 (DL), 1 (UL), RB position: Low Modulation: QPSK The value is based on the latest test result and may have update in the future releases. 3.4.2 Minimizing Power Losses If the module supports GSM, when designing the power supply for your application, please pay specific attention to power losses. Ensure that the input voltage VBATT+, never drops below 3.0V on the PLSx3 board, not even in a transmit burst where current consumption can rise to typical peaks. Any voltage drops that may occur in a transmit burst should not exceed 400mV to en-

sure the expected RF performance in 2G networks. For example, VImin=3.0V, Dmax=0.4V VBATTmin= VImin+Dmax=3.4V Figure 29: Power supply limits during transmit burst 3.4.3 Monitoring Power Supply by AT Command To monitor the supply voltage, you can use the AT^SBV command which returns the current value of the supply voltage using AT interface. t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 3.5 Operating Temperatures 82 3.5 Operating Temperatures Page 82 of 121 Table 21: Board Temperature Parameter Operating temperature range Restricted temperature range1 Automatic shutdown2 Typ Min

-30

-40

<-40 Max

+85

+95

+95 Unit C C C Temperature measured on PLSx3 board 1. Restricted operation allows normal mode data transmissions for limited time until automatic thermal shutdown takes effect. Within the restricted temperature range (outside the operating temperature range) the specified electrical characteristics may be in- or decreased. 2. Due to temperature measurement uncertainty, a tolerance on the stated shutdown thresholds may oc-

cur. The possible deviation is in the range of TBD C at the over temperature limit. Note: Within the specified operating temperature ranges the board temperature may vary to a great extent depending on operating mode, used frequency band, radio output power and current supply voltage. 3.6 Electrostatic Discharge The module is not protected against Electrostatic Discharge (ESD) in general. Consequently, it is subject to ESD handling precautions that typically apply to ESD sensitive components. Proper ESD handling and packaging procedures must be applied throughout the processing, handling and operation of any application that incorporates a PLSx3 module. An example for an enhanced ESD protection for the SIM interface is given in Section 2.1.6.1. PLSx3 has been tested according to the following standards. Electrostatic values can be gath-

ered from the following table. Table 22: Electrostatic values Specification/Requirement Contact discharge Air discharge ANSI/ESDA/JEDEC JS-001-2017 (Human Body Model) All LGA pads 1.0kV (HBM) JS-002-2018 (Charged Device Model) All LGA pads 250V (CDM) ETSI EN 301 489-1/7 BATT+

Antenna pads TBD TBD n.a. n.a. TBD 8kV t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 4 Mechanical Dimensions, Mounting and Packaging 99 Page 83 of 121 4 Mechanical Dimensions, Mounting and Packaging 4.1 Mechanical Dimensions of PLSx3 Figure 30 shows the top and bottom view of PLSx3 and provides an overview of the board's mechanical dimensions. For further details see Figure 31. t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 4.1 Mechanical Dimensions of PLSx3 99 Page 84 of 121 Top view Bottom View Figure 30: PLSx3 top and bottom view t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 4.1 Mechanical Dimensions of PLSx3 99 Page 85 of 121 Top view Figure 31: Dimensions of PLSx3 (all dimensions in mm) t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 4.1 Mechanical Dimensions of PLSx3 99 Page 86 of 121 Figure 32: Dimensions of PLSx3 (keepout area recommended) t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 4.2 Mounting PLSx3 onto the Application Platform 99 Page 87 of 121 4.2 Mounting PLSx3 onto the Application Platform This section describes how to mount PLSx3 onto the PCBs, including land pattern and stencil design, board-level characterization, soldering conditions, durability and mechanical handling. Note: To avoid short circuits between signal tracks on an external application's PCB and vari-

ous markings at the bottom side of the module, it is recommended not to route the signal tracks on the top layer of an external PCB directly under the module, or at least to ensure that signal track routes are sufficiently covered with solder resist. 4.2.1 SMT PCB Assembly 4.2.1.1 Land Pattern and Stencil The land pattern and stencil design as shown below is based on Thales characterizations for lead-free solder paste on a four-layer test PCB and a 110 respectively 150 micron thick stencil. The land pattern given in Figure 33 reflects the modules pad layout, including signal pads and ground pads (for pad assignment see Section 2.1.1). Figure 33: Land pattern (top view) The stencil designs illustrated in Figure 34 and Figure 35 are recommended by Thales as a re-

sult of extensive tests with Thales Daisy Chain modules. t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 4.2 Mounting PLSx3 onto the Application Platform 99 Page 88 of 121 Figure 34: Recommended design for 110 micron thick stencil (top view) Figure 35: Recommended design for 150 micron thick stencil (top view) t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 4.2 Mounting PLSx3 onto the Application Platform 99 4.2.1.2 Board Level Characterization Page 89 of 121 Board level characterization issues should also be taken into account if devising an SMT pro-

cess. Characterization tests should attempt to optimize the SMT process with regard to board level reliability. This can be done by performing the following physical tests on sample boards: Peel test, bend test, tensile pull test, drop shock test and temperature cycling. It is recommended to characterize land patterns before an actual PCB production, taking indi-

vidual processes, materials, equipment, stencil design, and reflow profile into account. For land and stencil pattern design recommendations see also Section 4.2.1.1. Optimizing the solder stencil pattern design and print process is necessary to ensure print uniformity, to decrease sol-

der voids, and to increase board level reliability. Generally, solder paste manufacturer recommendations for screen printing process parame-

ters and reflow profile conditions should be followed. Maximum ratings are described in Section 4.2.3. 4.2.2 Moisture Sensitivity Level PLSx3 comprises components that are susceptible to damage induced by absorbed moisture. Thaless PLSx3 module complies with the latest revision of the IPC/JEDEC J-STD-020 Stan-

dard for moisture sensitive surface mount devices and is classified as MSL 4. For additional moisture sensitivity level (MSL) related information see Section 4.2.4 and Sec-

tion 4.3.2. t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 4.2 Mounting PLSx3 onto the Application Platform 99 Page 90 of 121 4.2.3 Soldering Conditions and Temperature 4.2.3.1 Reflow Profile tP tL TP TL e r u t a r e p m e T TSmax TSmin tS Preheat t to maximum Time Table 23: Reflow temperature ratings1 Figure 36: Reflow Profile Profile Feature Pb-Free Assembly Preheat & Soak Temperature Minimum (TSmin) Temperature Maximum (TSmax) Time (tSmin to tSmax) (tS) Average ramp up rate (TL to TP) Liquidous temperature (TL) Time at liquidous (tL) 150C 200C 60-120 seconds 3K/second max.2 217C 50-90 seconds 245C 5C 30 seconds max. Peak package body temperature (TP) Time (tP) within 5 C of the peak package body tem-

perature (TP) Average ramp-down rate

- Limited ramp-down rate between 225C and 200C 6K/second max.2 3K/second max.2 Time 25C to maximum temperature 8 minutes max. 1. Please note that the reflow profile features and ratings listed above are based on the joint industry stan-

dard IPC/JEDEC J-STD-020D.1, and are as such meant as a general guideline. t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 4.2 Mounting PLSx3 onto the Application Platform 99 2. Temperatures measured on shielding at each corner. See also [3]. Page 91 of 121 Module 1 3 2 4 Temperature sensors (1-4) 4.2.3.2 Maximum Temperature and Duration The following limits are recommended for the SMT board-level soldering process to attach the module:

A maximum module temperature of 245C. This specifies the temperature as measured at the modules top side. A maximum duration of 30 seconds at this temperature. Ramp-down rate from TP to 200C should be controlled in order to reduce thermally induced stress during the solder solidification phase (see Table 23 - limited ramp-down rate). There-

fore, a cool-down step in the ovens temperature program between 200C and 180C should be considered. Please note that while the solder paste manufacturers' recommendations for best temperature and duration for solder reflow should generally be followed, the limits listed above must not be exceeded. PLSx3 is specified for one soldering cycle only. Once PLSx3 is removed from the application, the module will very likely be destroyed and cannot be soldered onto another application. t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 4.2 Mounting PLSx3 onto the Application Platform 99 4.2.4 Durability and Mechanical Handling 4.2.4.1 Storage Conditions Page 92 of 121 PLSx3 modules, as delivered in tape and reel carriers, must be stored in sealed, moisture barrier anti-static bags. The conditions stated below are only valid for modules in their original packed state in weather protected, non-temperature-controlled storage locations. Normal storage time under these conditions is 12 months maximum. Table 24: Storage conditions Type Condition Unit Reference Air temperature: Low High Humidity relative: Low High Air pressure: Low High 10 90 at 40C

-25

+40 70 106 1.0 IPC/JEDEC J-STD-033A IPC/JEDEC J-STD-033A IEC TR 60271-3-1: 1K4 IEC TR 60271-3-1: 1K4 IEC TR 60271-3-1: 1K4 C

kPa m/s

Movement of surrounding air Water: rain, dripping, icing and frosting Not allowed

Radiation:

Solar Heat 1120 600 W/m2 ETS 300 019-2-1: T1.2, IEC 60068-2-2 Bb ETS 300 019-2-1: T1.2, IEC 60068-2-2 Bb Chemically active substances IEC TR 60271-3-1: 1C1L Mechanically active substances Not IEC TR 60271-3-1: 1S1 Not recommended recommended 1.5 5 2-9 9-200 mm m/s2 Hz semi-sinusoidal 1 50 ms m/s2 IEC TR 60271-3-1: 1M2 IEC 60068-2-27 Ea Vibration sinusoidal:

Displacement Acceleration Frequency range Shocks:

Shock spectrum Duration Acceleration t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 4.2 Mounting PLSx3 onto the Application Platform 99 Page 93 of 121 4.2.4.2 Processing Life PLSx3 must be soldered to an application within 72 hours after opening the moisture barrier bag (MBB) it was stored in. As specified in the IPC/JEDEC J-STD-033 Standard, the manufacturing site processing the modules should have ambient temperatures below 30C and a relative humidity below 60%. 4.2.4.3 Baking Baking conditions are specified on the moisture sensitivity label attached to each MBB (see Figure 42 for details):

It is not necessary to bake PLSx3, if the conditions specified in Section 4.2.4.1 and Section 4.2.4.2 were not exceeded. It is necessary to bake PLSx3, if any condition specified in Section 4.2.4.1 and Section 4.2.4.2 was exceeded. If baking is necessary, the modules must be put into trays that can be baked to at least 125C. Devices should not be baked in tape and reel carriers at any temperature. 4.2.4.4 Electrostatic Discharge Electrostatic discharge (ESD) may lead to irreversable damage for the module. It is therefore advisable to develop measures and methods to counter ESD and to use these to control the electrostatic environment at manufacturing sites. Please refer to Section 3.6 for further information on electrostatic discharge. t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 4.3 Packaging 99 Page 94 of 121 4.3 Packaging 4.3.1 Tape and Reel 4.3.1.1 Orientation The single-feed tape carrier for PLSx3 is illustrated in Figure 37. The figure also shows the proper part orientation. The tape width is 44mm and the PLSx3 modules are placed on the tape with a 40mm pitch. The reels are 330mm in diameter with 100mm hubs. Each reel contains 400 modules. Figure 37: Carrier tape Figure 38: Reel direction t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 4.3 Packaging 99 Page 95 of 121 4.3.1.2 Barcode Label A barcode label provides detailed information on the tape and its contents. It is attached to the reel. Barcode label Figure 39: Barcode label on tape reel Figure 40: Barcode label on tape reel - layout Variables on the label are explained in Table 23. t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 4.3 Packaging 99 Page 96 of 121 4.3.2 Shipping Materials PLSx3 is distributed in tape and reel carriers. The tape and reel carriers used to distribute PLSx3 are packed as described below, including the following required shipping materials:

Moisture barrier bag, including desiccant and humidity indicator card Transportation box 4.3.2.1 Moisture Barrier Bag The tape reels are stored inside a moisture barrier bag (MBB), together with a humidity indica-

tor card and desiccant pouches - see Figure 41. The bag is ESD protected and delimits mois-

ture transmission. It is vacuum-sealed and should be handled carefully to avoid puncturing or tearing. The bag protects the PLSx3 modules from moisture exposure. It should not be opened until the devices are ready to be soldered onto the application. Figure 41: Moisture barrier bag (MBB) with imprint The label shown in Figure 42 summarizes requirements regarding moisture sensitivity, includ-

ing shelf life and baking requirements. It is attached to the outside of the moisture barrier bag. t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 4.3 Packaging 99 Page 97 of 121 Figure 42: Moisture Sensitivity Label t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 4.3 Packaging 99 Page 98 of 121 MBBs contain one or more desiccant pouches to absorb moisture that may be in the bag. The humidity indicator card described below should be used to determine whether the enclosed components have absorbed an excessive amount of moisture. The desiccant pouches should not be baked or reused once removed from the MBB. The humidity indicator card is a moisture indicator and is included in the MBB to show the ap-

proximate relative humidity level within the bag. Sample humidity cards are shown in Figure 43. If the components have been exposed to moisture above the recommended limits, the units will have to be rebaked. Figure 43: Humidity Indicator Card - HIC A baking is required if the humidity indicator inside the bag indicates 10% RH or more. t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 4.3 Packaging 99 4.3.2.2 Transportation Box Page 99 of 121 Tape and reel carriers are distributed in a box, marked with a barcode label for identification purposes. A box contains two reels with 400 (TBD for -X variant) modules each. 1 2 4 5 6 7 12 13 1 2 3 4 5 6 7 8 9 10 11 12 13 14 3 8 9 10 11 14 Figure 44: Sample of VP box label Table 25: VP Box label information No. Information Cinterion logo Product name Product ordering number Package ID number of VP box (format may vary depending on the product) Package ID barcode (Code 128) Package ID Reel 1 (format may vary depending on the product) Package ID Reel 2 (format may vary depending on the product) Quantity of the modules inside the VP box (max. 1000 pcs) Country of production Der Grne Punkt (Green Dot) symbol Chinese RoHS symbol (see Table 31) CE logo (CE mark on VP box label is present only for modules with CE imprinted on the shielding) European Article Number (EAN-13) barcode European Article Number, consists of 13 digits (EAN-13) t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 5 Regulatory and Type Approval Information 111 Page 100 of 121 5 Regulatory and Type Approval Information 5.1 Directives and Standards PLSx3 is designed to comply with the directives and standards listed below. It is the responsibility of the application manufacturer to ensure compliance of the final product with all provisions of the applicable directives and standards as well as with the technical spec-

ifications provided in the "PLSx3 Hardware Interface Description.1 Table 26: Directives 2014/53/EU Directive of the European Parliament and of the council of 16 April 2014 on the harmonization of the laws of the Member States relating to the making available on the market of radio equipment and repealing Directive 1999/

05/EC. 2002/95/EC (RoHS 1) 2011/65/EC (RoHS 2) The product is labeled with the CE conformity mark. Directive of the European Parliament and of the Council of 27 January 2003 (and revised on 8 June 2011) on the restriction of the use of certain hazardous substances in electrical and electronic equipment (RoHS) 1907/2006/EC (REACH) Regulation (EC) No 1907/2006 of the European Parliament and of the Council of 18 December 2006 concerning the Registration, Evaluation, Authorization and Restriction of Chemicals (REACH), establishing a Euro-

pean Chemicals Agency, amending Directive 1999/45/EC and repealing Council Regulation (EEC) No 793/93 and Commission Regulation (EC) No 1488/94 as well as Council Directive 76/769/EEC and Commission Direc-

tive 91/155/EEC, 93/67/EC and 2000/21/EC. Cinterion module comply with the REACH regulation that specifies a con-

tent of less than 0.1% per substance mentioned in the SVHC candidate list

(Release 16.06.2014) Table 27: Standards of North American type approval CFR Title 47 Code of Federal Regulations, Part 22, Part 24; US Equipment Authorization FCC OET Bulletin 65

(Edition 97-01) Evaluating Compliance with FCC Guidelines for Human Exposure to Radio frequency Electromagnetic Fields UL 60 950-1 Product Safety Certification (Safety requirements) NAPRD.03 V6.01 Overview of PCS Type certification review board Mobile Equipment Type Certification and IMEI control PCS Type Certification Review board (PTCRB) RSS132 (Issue2) RSS133 (Issue5) Canadian Standard 1. Manufacturers of applications which can be used in the US shall ensure that their applications have a PTCRB approval. For this purpose they can refer to the PTCRB approval of the respective module. t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 5.1 Directives and Standards 111 Page 101 of 121 Table 28: Standards of European type approval 3GPP TS 51.010-1 Digital cellular telecommunications system (Release 7); Mobile Station

(MS) conformance specification;

GCF-CC V3.79 Global Certification Forum - Certification Criteria ETSI EN 301 511 V12.5.1 Global System for Mobile communications (GSM); Mobile Stations (MS) equipment; Harmonized Standard covering the essential requirements of article 3.2 of Directive 2014/53/EU ETSI EN 301 908-01 V13.1.1 IMT cellular networks; Harmonized Standard covering the essential require-

ments of article 3.2 of the Directive 2014/53/EU; Part 1: Introduction and common requirements ETSI EN 301 908-02 V11.1.2 IMT cellular networks; Harmonized Standard covering the essential require-

ments of article 3.2 of the Directive 2014/53/EU; Part 2: CDMA Direct Spread (UTRA FDD) User Equipment (UE) ETSI EN 301 489-52 V1.1.0 Electromagnetic Compatibility (EMC) standard for radio equipment and ser-

vices; Part 52: Specific conditions for Cellular Communication Mobile and portable (UE) radio and ancillary equipment; Harmonized Standard cover-

ing the essential requirements of article 3.1(b) of Directive 2014/53/EU ETSI EN 301 908-13 V13.1.1 IMT cellular networks; Harmonized Standard covering the essential require-

ments of article 3.2 of the Directive 2014/53/EU; Part 13: evolved Universal Terrestrial Radio Access (E-UTRA) User Equipment (UE). Draft ETSI EN 301 489-

01 V2.2.3 ETSI EN 301489-19 V2.1.0 ETSI EN 303 413 V1.1.1 IEC 62368-1

(EN 62368-1, UL 62368-

1) Electromagnetic Compatibility (EMC) standard for radio equipment and ser-

vices; Part 1: Common technical requirements; Harmonized Standard cov-

ering the essential requirements of article 3.1(b) of Directive 2014/53/EU and the essential requirements of article 6 of Directive 2014/30/EU ElectroMagnetic Compatibility (EMC) standard for radio equipment and ser-

vices; Part 19: Specific conditions for Receive Only Mobile Earth Stations

(ROMES) operating in the 1,5 GHz band providing data communications and GNSS receivers operating in the RNSS band (ROGNSS) providing positioning, navigation, and timing data; Harmonised Standard covering the essential requirements of article 3.1(b) of Directive 2014/53/EU Satellite Earth Stations and Systems (SES); Global Navigation Satellite System (GNSS) receivers; Radio equipment operating in the 1 164 MHz to 1 300 MHz and 1 559 MHz to 1 610 MHz frequency bands; Harmonised Standard covering the essential requirements of article 3.2 of Directive 2014/53/EU Audio/video, information and communication technology equipment - Part 1: Safety requirements

(for details see Section 5.1.1) Table 29: Requirements of quality IEC 60068 Environmental testing DIN EN 60529 IP codes EN 62311:2008 Assessment of electronic and electrical equipment related to human expo-

sure restrictions for electromagnetic fields (0 Hz - 300 GHz) Table 30: Standards of the Ministry of Information Industry of the Peoples Republic of China SJ/T 11363-2006 Requirements for Concentration Limits for Certain Hazardous Sub-

stances in Electronic Information Products (2006-06). t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 5.1 Directives and Standards 111 Page 102 of 121 Table 30: Standards of the Ministry of Information Industry of the Peoples Republic of China SJ/T 11364-2006 Marking for Control of Pollution Caused by Electronic Information Products (2006-06). According to the Chinese Administration on the Control of Pollution caused by Electronic Information Products

(ACPEIP) the EPUP, i.e., Environmental Protection Use Period, of this product is 20 years as per the symbol shown here, unless otherwise marked. The EPUP is valid only as long as the product is operated within the operating limits described in the Thales Hardware Interface Description. Please see Table 31 for an overview of toxic or hazardous substances or elements that might be contained in product parts in concentrations above the limits defined by SJ/T 11363-2006. Table 31: Toxic or hazardous substances or elements with defined concentration limits t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 5.1 Directives and Standards 111 5.1.1 IEC 62368-1 Classification Page 103 of 121 With respect to the safety requirements for audio/video, information and communication tech-

nology equipment defined by the hazard based product safety standard for ICT and AV equip-

ment - i.e., IEC-62368-1 (EN 62368-1, UL 62368-1) - Cinterion modules are classified as shown below:

Standalone operation of the modules is not possible. Modules will always be incorporated in an external application (Customer Product). Customer understands and is responsible that the product incorporating the Cinterion module must be designed to be compliant with IEC-62368-1 (EN 62368-1, UL 62368-1) to ensure pro-

tection against hazards and injuries. When operating the Cinterion module the external appli-

cation (Customer Product) must provide safeguards not to exceed the power limits given by classification to Power Source Class 1 (15 Watts) under normal operating conditions, abnormal conditions, or in the presence of a single fault. When using a battery power supply the external application must provide safeguards not to exceed the limits defined by PS-1, as well. The ex-

ternal application (Customer Product) must take measures to limit the power, the voltage or the current, respectively, if required, and must provide safeguards to protect ordinary persons against pain or injury caused by the voltage/current. In case of a usage of the Cinterion module not in accordance with the specifications or in sin-

gle fault condition the external application (Customer Product) must be capable to withstand levels according to ES-1 / PS-1 also on all ports that are initially intended for signalling or audio, e.g., USB, RS-232, GPIOs, SPI, earphone and microphone interfaces. In addition, the external application (Customer Product) must be designed in a way to distribute thermal energy generated by the intended operation of the Cinterion module. In case of high temperature operation, the external application must provide safeguards to protect ordinary persons against pain or injury caused by the heat. Table 32: IEC 62368-1 Classification Source of Energy Electrical energy source Class ES-1 Limits The Cinterion modules contain no electrical energy source - especially no battery. The electri-

cal components and circuits have to be externally power supplied:

DC either smaller 60 V Or less than 2 mA AC up to 1kHz smaller 30 V-rms or 42.4 V peak AC above 100kHz smaller 70 V rms Power source provided by the external application must not exceed 15W, even under worst case and any single fault condition defined by IEC-62368-1:

Section 6.2.2.3. Power Source

(potential ignition source caus-

ing fire) PS-1 t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 5.1 Directives and Standards 111 Page 104 of 121 Table 32: IEC 62368-1 Classification Source of Energy Hazardous Substances, Chemical reaction Class

Limits Under regular conditions, the Cinterion modules does not contain any chemically reactive sub-

stances, and no chemical energy source, espe-

cially no battery. Module is compliant with RoHS and REACH. In very rare cases however - under abnormal con-

ditions 9i.e. wrong supply voltage, burned module) or in the presence of single electrical component faults (i.e. shortcut) - health hazardous sub-

stances might be released if the worst comes to the worst. The Cinterion modules have no sharp edges and corners, no moving parts, no loosing, exploding or imploding parts. The mass is well below 1kg. Under normal operating conditions, abnormal operating conditions or single fault conditions the temperature does not exceed +100C on the metal surface (shielding) The Cinterion module does not contain a radiant energy source, any lasers, lamps, LEDs, X-Ray emitting components or acoustic couplers. Kinetic / mechanical energy source MS-1 Thermal energy source TS-2 Note: Valid only for Cinterion modules with dimensions larger than 50mm and operating board temperatures higher than

+80C. Radiated energy source RS-1 Thermal energy source TS-3 Special safeguards required. t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 5.2 SAR requirements specific to portable mobiles 111 Page 105 of 121 5.2 SAR requirements specific to portable mobiles Mobile phones, PDAs or other portable transmitters and receivers incorporating a GSM/UMTS module must be in accordance with the guidelines for human exposure to radio frequency en-

ergy. This requires the Specific Absorption Rate (SAR) of portable PLSx3 based applications to be evaluated and approved for compliance with national and/or international regulations. Since the SAR value varies significantly with the individual product design manufacturers are advised to submit their product for approval if designed for portable use. For European/US/Aus-

tralian-markets the relevant directives are mentioned below. The manufacturer of the end de-

vice is in the responsibility to provide clear installation and operating instructions for the user, including the minimum separation distance required to maintain compliance with SAR and/or RF field strength limits, as well as any special usage conditions required to do so, such as a required accessory, the proper orientation of the device, the max antenna gain for detachable antennas, or other relevant criteria. It is the responsibility of the manufacturer of the final prod-

uct to verify whether or not further standards, recommendations or directives are in force out-

side these areas. Products intended for sale on US markets ES 59005/ANSI C95.1 Considerations for evaluation of human exposure to Electromagnetic Fields (EMFs) from Mobile Telecommunication Equipment (MTE) in the frequency range 30MHz - 6GHz Products intended for sale on European markets EN 50360 EN 62311:2008 Product standard to demonstrate the compliance of mobile phones with the basic restrictions related to human exposure to electromagnetic fields (300MHz - 3GHz) Assessment of electronic and electrical equipment related to human expo-sure restrictions for electromagnetic fields (0 Hz - 300 GHz) Please note that SAR requirements are specific only for portable devices and not for mobile devices as defined below:

Portable device:

A portable device is defined as a transmitting device designed to be used so that the radi-

ating structure(s) of the device is/are within 20 centimeters of the body of the user. Mobile device:

A mobile device is defined as a transmitting device designed to be used in other than fixed locations and to generally be used in such a way that a separation distance of at least 20 centimeters is normally maintained between the transmitter's radiating structure(s) and the body of the user or nearby persons. In this context, the term ''fixed location'' means that the device is physically secured at one location and is not able to be easily moved to another location. t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 5.3 Reference Equipment for Type Approval 111 Page 106 of 121 5.3 Reference Equipment for Type Approval The Thales reference setup submitted to type approve PLSx3 (including a special approval adapter for the DSB75) is shown in the following figure1:

LTE/GPRS/UMTS BaseStation Diversity Antenna Main Antenna USB ASC0 PC Power Supply AH6Adapter SIMCard SMA SMA SMA USB DSB75 Eval_Board Eval_Board PLS6x3 PLS6x3 Figure 45: Reference equipment for Type Approval 1. For RF performance tests a mini-SMT/U.FL to SMA adapter with attached 6dB coaxial attenuator is cho-

sen to connect the evaluation module directly to the GSM/UMTS test equipment instead of employing the SMA antenna connectors on the PLSx3-DSB75 adapter as shown in Figure 45. The following prod-

ucts are recommended:

Hirose SMA-Jack/U.FL-Plug conversion adapter HRMJ-U.FLP(40)

(for details see http://www.hirose-connectors.com/ or http://www.farnell.com/

Aeroflex Weinschel Fixed Coaxial Attenuator Model 3T/4T

(for details see http://www.aeroflex.com/ams/weinschel/pdfiles/wmod3&4T.pdf) t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 5.4 Compliance with FCC and ISED Rules and Regulations 111 Page 107 of 121 5.4 Compliance with FCC and ISED Rules and Regulations The Equipment Authorization Certification for the Thales reference application described in Section 5.3 will be registered under the following identifiers:

FCC Identifier: QIPPLS63-W Industry Canada Certification Number: 7830A-PLS63W Granted to THALES DIS AIS Deutschland GmbH FCC Identifier: QIPPLS83-W Industry Canada Certification Number: 7830A-PLS83W Granted to THALES DIS AIS Deutschland GmbH FCC Identifier: QIPPLS63-X Industry Canada Certification Number: 7830A-PLS63X Granted to THALES DIS AIS Deutschland GmbH FCC Identifier: QIPPLS83-X Industry Canada Certification Number: 7830A-PLS83X Granted to THALES DIS AIS Deutschland GmbH FCC Identifier: QIPPLS63-X2 Industry Canada Certification Number: 7830A-PLS63X2 Granted to THALES DIS AIS Deutschland GmbH FCC Identifier: QIPPLS83-X2 Industry Canada Certification Number: 7830A-PLS83X2 Granted to THALES DIS AIS Deutschland GmbH FCC Identifier: QIPPLS63-X3 Industry Canada Certification Number: 7830A-PLS63X3 Granted to THALES DIS AIS Deutschland GmbH FCC Identifier: QIPPLS83-X3 Industry Canada Certification Number: 7830A-PLS83X3 Granted to THALES DIS AIS Deutschland GmbH FCC Identifier: QIPPLS63-X4 Industry Canada Certification Number: 7830A-PLS63X4 Granted to THALES DIS AIS Deutschland GmbH FCC Identifier: QIPPLS83-X4 Industry Canada Certification Number: 7830A-PLS83X4 Granted to THALES DIS AIS Deutschland GmbH Manufacturers of mobile or fixed devices incorporating PLSx3 modules are authorized to use the FCC Grants and ISED Certificates of the PLSx3 modules for their own final products ac-

cording to the conditions referenced in these documents. In this case, an FCC/IC label of the module shall be visible from the outside, or the host device shall bear a second label stating

"Contains FCC ID: QIPPLS63-W, "Contains FCC ID: QIPPLS83-W, "Contains FCC ID: QIP-

PLS63-X, "Contains FCC ID: QIPPLS83-X, "Contains FCC ID: QIPPLS63-X2, "Contains FCC ID: QIPPLS83-X2, "Contains FCC ID: QIPPLS63-X3, "Contains FCC ID: QIPPLS83-X3, "Con-

t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 5.4 Compliance with FCC and ISED Rules and Regulations 111 Page 108 of 121 tains FCC ID: QIPPLS63-X4, "Contains FCC ID: QIPPLS83-X4, and accordingly Contains IC:

7830A-PLS63W, Contains IC: 7830A-PLS83W, Contains IC: 7830A-PLS63X, Contains IC:

7830A-PLS83X, Contains IC: 7830A-PLS63X2, Contains IC: 7830A-PLS83X2, Contains IC: 7830A-PLS63X3, Contains IC: 7830A-PLS83X3, Contains IC: 7830A-PLS63X4, Contains IC: 7830A-PLS83X4. The integration is limited to fixed or mobile categorized host devices, where a separation distance between the antenna and any person of min. 20cm can be assured during normal operating conditions. For mobile and fixed operation configuration the antenna gain, including cable loss, must not exceed the limits listed in the following Table 33 and Table 34 for FCC and ISED. Table 33: Antenna gain limits for FCC and ISED (for W and EP variants) Operation band FCC limit ISED limit Unit 8.60 10.20 5.30 10.20 Maximum gain in GSM/GPRS 850 Maximum gain in PCS 1900 Maximum gain in WCDMA Band 2 Maximum gain in WCDMA Band 4 Maximum gain in WCDMA Band 5 Maximum gain in LTE Band 2 Maximum gain in LTE Band 4 Maximum gain in LTE Band 5 Maximum gain in LTE Band 7 Maximum gain in LTE Band 12 Maximum gain in LTE Band 13 Maximum gain in LTE Band 26 Maximum gain in LTE Band 38 Maximum gain in LTE Band 41 Maximum gain in WCDMA Band 2 Maximum gain in WCDMA Band 4 Maximum gain in WCDMA Band 5 Maximum gain in LTE Band 2 Maximum gain in LTE Band 4 Maximum gain in LTE Band 5 Maximum gain in LTE Band 12 Maximum gain in LTE Band 13 Maximum gain in LTE Band 14 Maximum gain in LTE Band 25 8.01 5.00 9.40 8.01 5.00 9.40 8.01 8.70 9.16 9.30 8.01 8.01 8.01 5.00 9.40 8.01 5.00 9.40 8.70 9.16 9.23 8.01 dBi dBi dBi dBi dBi dBi dBi dBi dBi dBi dBi dBi dBi dBi dBi dBi dBi dBi dBi dBi dBi dBi dBi dBi dBi 8.01 5.00 6.10 8.01 5.00 6.10 8.01 5.61 5.93 6.10 8.01 8.01 8.01 5.00 6.10 8.01 5.00 6.10 5.61 5.93 N.A. 8.01 Maximum gain in LTE Band 66 5.00 Table 34: Antenna gain limits for FCC and ISED (for X, X2, X3, X4 variants) 5.00 Operation band FCC limit ISED limit Unit t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 5.4 Compliance with FCC and ISED Rules and Regulations 111 Page 109 of 121 Table 34: Antenna gain limits for FCC and ISED (for X, X2, X3, X4 variants) Operation band FCC limit ISED limit Maximum gain in LTE Band 26 Maximum gain in LTE Band 66 Maximum gain in LTE Band 71 9.30 5.00 8.48 6.10 5.00 5.45 Unit dBi dBi dBi IMPORTANT:

Manufacturers of portable applications incorporating PLSx3 modules are required to have their final product certified and apply for their own FCC Grant and ISED Certificate related to the specific portable mobile. This is mandatory to meet the SAR requirements for portable mobiles

(see Section Table 31: for detail). Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. Note: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules and with ISED license-exempt RSS standard(s). These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interfer-

ence to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or televi-

sion reception, which can be determined by turning the equipment off and on, the user is en-

couraged to try to correct the interference by one or more of the following measures:

Reorient or relocate the receiving antenna. Connect the equipment into an outlet on a circuit different from that to which the receiver is Increase the separation between the equipment and receiver. connected. Consult the dealer or an experienced radio/TV technician for help. This Class B digital apparatus complies with Canadian ICES-003. FCC Part 15.19 Warning Statement THIS DEVICE COMPLIES WITH PART 15 OF THE FCC RULES. OPERATION IS SUBJECT TO THE FOLLOWING TWO CONDITIONS: (1) THIS DEVICE MAY NOT CAUSE HARMFUL INTERFERENCE, AND (2) THIS DEVICE MUST ACCEPT ANY INTERFERENCE RECEIVED, INCLUDING INTERFERENCE THAT MAY CAUSE UNDESIRED OPERATION. If Canadian approval is requested for devices incorporating PLSx3 modules the below notes will have to be provided in the English and French language in the final user documentation. Manufacturers/OEM Integrators must ensure that the final user documentation does not con-

tain any information on how to install or remove the module from the final product. t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 5.4 Compliance with FCC and ISED Rules and Regulations 111 Page 110 of 121 Notes (ISED):

(EN) This Class B digital apparatus complies with Canadian ICES-003 and RSS-210. Opera-

tion is subject to the following two conditions: (1) this device may not cause interference, and

(2) this device must accept any interference, including interference that may cause undesired operation of the device.

(FR) Cet appareil numrique de classe B est conforme aux normes canadiennes ICES-003 et RSS-210. Son fonctionnement est soumis aux deux conditions suivantes: (1) cet appareil ne doit pas causer d'interfrence et (2) cet appareil doit accepter toute interfrence, notamment les interfrences qui peuvent affecter son fonctionnement.

(EN) Radio frequency (RF) Exposure Information The radiated output power of the Wireless Device is below the Innovation, Science and Economic Development Canada (ISED) radio frequency exposure limits. The Wireless Device should be used in such a manner such that the potential for human contact during normal operation is minimized. This device has also been evaluated and shown compliant with the ISED RF Exposure limits under mobile exposure conditions. (antennas at least 20cm from a persons body).

(FR) Informations concernant l'exposltion aux frquences radio (RF) La puissance de sortie mise par l'appareil de sans fiI est infrieure la limite d'exposition aux frquences radio dInnovation, Sciences et Dveloppement conomique Canada (ISDE). Utili-

sez l'appareil de sans fil de faon minimiser les contacts humains lors du fonctionnement nor-

mal. Ce priphrique a galement t valu et dmontr conforme aux limites d'exposition aux RF d'IC dans des conditions d'exposition des appareils mobiles (les antennes se situent moins de 20cm du corps d'une personne). t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 5.5 Compliance with Japanese Rules and Regulations 111 Page 111 of 121 5.5 Compliance with Japanese Rules and Regulations The PLSx3 reference application described in Section 5.3 complies with the requirements of the Japanese "Telecommunications Business Law" and "Ordinance Concerning Technical Regulations Conformity Certification of Specified Radio Equipment" as well as with the require-

ments of the Japanese "Radio Law" and "Ordinance Concerning Technical Conditions Compli-

ance Approval and Certification of the Type for Terminal Equipment". The certificate granted in accordance with the "Telecommunications Business Law" has the identifier:

AD204118217 (for -J) AD210086217 (for -W) 217-204182 (for -J) 217-210086 (for -W) The certificate granted in accordance with the "Radio Law" has the identifier:

Please refer to Figure 47 for the JATE/TELEC mark with identifiers:

Figure 46: JATE/TELEC mark for -J Figure 47: JATE/TELEC mark for -W t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 6 Document Information 117 6 Document Information 6.1 Revision History Page 111 of Proceeding document New document: "Cinterion PLSx3-W Hardware Interface Description"

Version 01.002 New document: "Cinterion PLSx3 Hardware Interface Description" Version 01.003 Chapter What is new 2.2 2.1.2 3.2.2.2 3.2.3 5.4 Updated Table 12. Updated the low level impulse. Updated Table 15 and added a note. Added Table 33 and Table 34. Proceeding document New document: "Cinterion PLSx3-W Hardware Interface Description"

Version 00.906a New document: "Cinterion PLSx3 Hardware Interface Description" Version 01.002 Chapter What is new Updated the supported product in the list. Added new products and the supported bands in Table 1. Added this section. Updated Table 19 and Table 20. Added this section. Updated Figure 23. New chapter regarding IEC 62368-1 Classification Added the supported products in Table 35. 1.1 1.2.1 3.4.2 3.4.1 3.3.4 3.2.1 5.1.1 7 Proceeding document New document: "Cinterion PLSx3-W Hardware Interface Description"

Version 00.906 New document: "Cinterion PLSx3 Hardware Interface Description" Version 00.906a Chapter What is new 1.2 Updated the extended operating temperature. Proceeding document New document: "Cinterion PLSx3-W Hardware Interface Description"

Version 00.024 New document: "Cinterion PLSx3 Hardware Interface Description" Version 00.906 Chapter What is new t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 6.1 Revision History 117 Page 112 of 2.1.3.1 2.1.9 2.1.10.3, 2.1.10.4 3.1 3.2.5 3.3 3.6 4.3.1.2 4.3.2.2 5 7.2 3.2.1 2.1.2 Add Reducing Power Consumption section. Added Analog-to-Digital Converter (ADC) section. Added Fast shutdown and Remove Wakeup sections. Added Operation Mode section. Added Automatic shutdown with sub sections. Added Power Saving section. Added Electrostatic Discharge section. Added Figure 40. Added Figure 44 and Table 25. Added chapter 6 Regulatory and Type Approval Information. Added Module Label Information section. Updated Figure 23 and the description of IGT signal. Updated Ignition signal description in Table 3. Proceeding document New document: "Cinterion PLSx3-W Hardware Interface Description"

Version 00.012 New document: "Cinterion PLSx3 Hardware Interface Description" Version 00.024 Chapter What is new Added new variants of -X, -EP, -LA and -J as well as their supported bands. Update the height of the module. Updated the pad assignment. Update the number of GPIO to 22. Updated Figure 8. Added the following chapters: 2.1.10.1, 2.2, 2.3, 2.4. Added Automatic Shutdown section. Updated power consumption. Added Operating Temperatures section. Removed TX-activity. Proceeding document New document: "Cinterion PLSx3-W Hardware Interface Description"

Version 00.002 New document: "Cinterion PLSx3-W Hardware Interface Description" Version 00.012 Chapter What is new Added the following new sections: 2.1.7, 2.1.8.1, 2.1.10, 2.1.6.1 Added the following new sections: 3.2.2, 3.2.4, 3.2.2 Added the following new sections: 4.2.4, 4.3 Updated the pad assignment Updated Figure 1 t PLSx3_HID_v01.003 2021-03-12 Public / Released

2 2.1.1 2.1.6 3.2.5 3.4.1 3.5

2 3 4 2.1.1 1.3 Cinterion PLSx3 Hardware Interface Description 6.2 Related Documents 117 Page 113 of Updated company name and logo.

Proceeding document New document: "Cinterion PLSx3-W Hardware Interface Description"

Version 00.001 New document: "Cinterion PLSx3-W Hardware Interface Description" Version 00.002 Chapter What is new Updated the Figure 2. 1.4 2.1 3 Added the following new sections: 2.1.3, 2.1.4 2.1.5, 2.1.6 Added section 3.2 New document: "Cinterion PLSx3-W Hardware Interface Description" Version 00.001 Chapter What is new

Initial document setup. 6.2 Related Documents

[1] PLSx3 AT Command Set

[2] PLSx3 Release Note

[3] Universal Serial Bus Specification Revision 2.0, April 27, 2000

[4] Application Note 48: SMT Module Integration

[5] Differences between Selected Cinterion Modules, Hardware Migration Guide 6.3 Terms and Abbreviations Abbreviation Description Analog-to-digital converter Automatic Gain Control American National Standards Institute ARFCN Absolute Radio Frequency Channel Number ARP Antenna Reference Point Thermistor Constant Bit Error Rate Bearer Independent Protocol Base Transceiver Station CB or CBM Cell Broadcast Message Conformit Europene (European Conformity) Challenge Handshake Authentication Protocol ADC AGC ANSI B BER BIP BTS CE CHAP ASC0/ASC1 Asynchronous Controller. Abbreviations used for first and second serial interface of PLSx3 t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 6.3 Terms and Abbreviations 117 Page 114 of Abbreviation Description dBm0 Digital level, 3.14dBm0 corresponds to full scale, see ITU G.711, A-law Data Communication Equipment (typically modems, e.g. Thales module) CPU CS CSD CTS DAC DCE DRX DSB DSP DSR DTR DTX EFR EIRP EMC ERP ESD ETS ETSI FCC FDMA FR GMSK GPIO HiZ HR I/O IC IMEI ISO ITU kbps LED Central Processing Unit Coding Scheme Circuit Switched Data Clear to Send Digital-to-Analog Converter Discontinuous Reception Development Support Box Digital Signal Processor Data Set Ready Data Terminal Ready Discontinuous Transmission Enhanced Full Rate Equivalent Isotropic Radiated Power Electromagnetic Compatibility Effective Radiated Power Electrostatic Discharge European Telecommunication Standard European Telecommunication Standards Institute Federal Communications Commission (U.S.) Frequency Division Multiple Access Full Rate Gaussian Minimum Shift Keying General Purpose Input/Output High Impedance Half Rate Input/Output Integrated Circuit International Mobile Equipment Identity International Standards Organization International Telecommunications Union kbits per second Light Emitting Diode Lithium-Ion Li-Ion/Li+

Li battery LPM Rechargeable Lithium Ion or Lithium Polymer battery Link Power Management t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 6.3 Terms and Abbreviations 117 Page 115 of Abbreviation Description Mbits per second Man Machine Interface Mobile Originated Mobile Station ( module), also referred to as TE MSISDN Mobile Station International ISDN number PBCCH Packet Switched Broadcast Control Channel Mbps MMI MO MS MT NTC OEM PA PAP PCB PCL PDU PLL PPP PSK PSU RAM RF RLS RMS RoHS ROM RTC RTS Rx SAR SAW SELV SIM SMD SMS SMT SPI PWM R&TTE Mobile Terminated Negative Temperature Coefficient Original Equipment Manufacturer Power Amplifier Password Authentication Protocol Printed Circuit Board Power Control Level Protocol Data Unit Phase Locked Loop Point-to-point protocol Phase Shift Keying Power Supply Unit Pulse Width Modulation Random Access Memory Radio Frequency Radio Link Stability Root Mean Square (value) Read-only Memory Real Time Clock Request to Send Receive Direction Specific Absorption Rate Surface Accoustic Wave Safety Extra Low Voltage Subscriber Identification Module Surface Mount Device Short Message Service Surface Mount Technology Serial Peripheral Interface Radio and Telecommunication Terminal Equipment Restriction of the use of certain hazardous substances in electrical and electronic equipment. t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 6.3 Terms and Abbreviations 117 Page 116 of Abbreviation Description SRAM TA TDMA TE TLS Tx UART URC USSD VSWR Static Random Access Memory Terminal adapter (e.g. module) Time Division Multiple Access Terminal Equipment, also referred to as DTE Transport Layer Security Transmit Direction Universal asynchronous receiver-transmitter Unsolicited Result Code Unstructured Supplementary Service Data Voltage Standing Wave Ratio t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 6.4 Safety Precaution Notes 117 6.4 Safety Precaution Notes Page 117 of The following safety precautions must be observed during all phases of the operation, usage, service or repair of any cellular terminal or mobile incorporating PLSx3. Manufacturers of the cellular terminal are advised to convey the following safety information to users and operating personnel and to incorporate these guidelines into all manuals supplied with the product. Fail-

ure to comply with these precautions violates safety standards of design, manufacture and in-

tended use of the product. Thales assumes no liability for customers failure to comply with these precautions. When in a hospital or other health care facility, observe the restrictions on the use of mobiles. Switch the cellular terminal or mobile off, if instructed to do so by the guide-

lines posted in sensitive areas. Medical equipment may be sensitive to RF energy. The operation of cardiac pacemakers, other implanted medical equipment and hear-

ing aids can be affected by interference from cellular terminals or mobiles placed close to the device. If in doubt about potential danger, contact the physician or the manufac-

turer of the device to verify that the equipment is properly shielded. Pacemaker patients are advised to keep their hand-held mobile away from the pacemaker, while it is on. Switch off the cellular terminal or mobile before boarding an aircraft. Make sure it can-

not be switched on inadvertently. The operation of wireless appliances in an aircraft is forbidden to prevent interference with communications systems. Failure to observe these instructions may lead to the suspension or denial of cellular services to the offender, legal action, or both. Do not operate the cellular terminal or mobile in the presence of flammable gases or fumes. Switch off the cellular terminal when you are near petrol stations, fuel depots, chemical plants or where blasting operations are in progress. Operation of any elec-

trical equipment in potentially explosive atmospheres can constitute a safety hazard. Your cellular terminal or mobile receives and transmits radio frequency energy while switched on. Remember that interference can occur if it is used close to TV sets, radios, computers or inadequately shielded equipment. Follow any special regulations and always switch off the cellular terminal or mobile wherever forbidden, or when you suspect that it may cause interference or danger. Road safety comes first! Do not use a hand-held cellular terminal or mobile when driv-

ing a vehicle, unless it is securely mounted in a holder for speakerphone operation. Before making a call with a hand-held terminal or mobile, park the vehicle. Speakerphones must be installed by qualified personnel. Faulty installation or opera-

tion can constitute a safety hazard. IMPORTANT!

Cellular terminals or mobiles operate using radio signals and cellular networks. Because of this, connection cannot be guaranteed at all times under all conditions. Therefore, you should never rely solely upon any wireless device for essential com-

munications, for example emergency calls. Remember, in order to make or receive calls, the cellular terminal or mobile must be switched on and in a service area with adequate cellular signal strength. Some networks do not allow for emergency calls if certain network services or phone features are in use (e.g. lock functions, fixed dialing etc.). You may need to deactivate those features before you can make an emergency call. Some networks require that a valid SIM card be properly inserted in the cellular termi-

nal or mobile. t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 7 Appendix Page 117 of 121 7 Appendix 7.1 List of Parts and Accessories Table 35: List of parts and accessories Description PLS63-X Supplier Ordering information Thales PLS83-X Thales PLS63-W Thales PLS83-W Thales PLS63-LA Thales PLS83-LA Thales PLS63-EP Thales PLS83-EP Thales PLS63-J Thales PLS83-J Thales PLS63-X2 Thales Standard module Thales IMEI:

Packaging unit (ordering) number: L30960-N6500-A100 Module label number: S30960-S6500-A100-11 Standard module Thales IMEI:

Packaging unit (ordering) number: L30960-N6510-A100 Module label number: S30960-S6510-A100-1 Standard module Thales IMEI:

Packaging unit (ordering) number: L30960-N6520-A100 Module label number: S30960-S6520-A100-1 Standard module Thales IMEI:

Packaging unit (ordering) number: L30960-N6530-A100 Module label number1: S30960-S6530-A100-1 Standard module Thales IMEI:

Packaging unit (ordering) number: L30960-N6540-A100 Module label number: S30960-S6540-A100-1 Standard module Thales IMEI:

Packaging unit (ordering) number: L30960-N6550-A100 Module label number: S30960-S6550-A100-1 Standard module Thales IMEI:

Packaging unit (ordering) number: L30960-N6560-A100 Module label number: S30960-S6560-A100-1 Standard module Thales IMEI:

Packaging unit (ordering) number: L30960-N6570-A100 Module label number: S30960-S6570-A100-1 Standard module Thales IMEI:

Packaging unit (ordering) number: L30960-N6580-A100 Module label number: S30960-S6580-A100-1 Standard module Thales IMEI:

Packaging unit (ordering) number: L30960-N6590-A100 Module label number: S30960-S6590-A100-1 Standard module Thales IMEI:

Packaging unit (ordering) number: L30960-N6506-A100 Module label number: S30960-S6506-A100-1 t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 7.1 List of Parts and Accessories Page 118 of 121 Table 35: List of parts and accessories Description PLS83-X2 Supplier Ordering information Thales PLS63-X3 Thales PLS83-X3 Thales PLS63-X4 Thales PLS83-X4 Thales PLS63-I Thales PLS83-I Thales Standard module Thales IMEI:

Packaging unit (ordering) number: L30960-N6516-A100 Module label number: S30960-S6516-A100-1 Standard module Thales IMEI:

Packaging unit (ordering) number: L30960-N6508-A100 Module label number: S30960-S6508-A100-1 Standard module Thales IMEI:

Packaging unit (ordering) number: L30960-N6518-A100 Module label number: S30960-S6518-A100-1 Standard module Thales IMEI:

Packaging unit (ordering) number: L30960-N6512-A100 Module label number: S30960-S6512-A100-1 Standard module Thales IMEI:

Packaging unit (ordering) number: L30960-N6522-A100 Module label number: S30960-S6522-A100-1 Standard module Thales IMEI:

Packaging unit (ordering) number: L30960-N6526-A100 Module label number: S30960-S6526-A100-1 Standard module Thales IMEI:

Packaging unit (ordering) number: L30960-N6536-A100 Module label number: S30960-S6536-A100-1 PLS63-X Evaluation Module Thales Ordering number: L30960-N6501-A100 PLS83-X Evaluation Module Thales Ordering number: L30960-N6511-A100 PLS63-W Evaluation Module Thales Ordering number: L30960-N6521-A100 PLS83-W Evaluation Module Thales Ordering number: L30960-N6531-A100 PLS63-LA Evaluation Module Thales Ordering number: L30960-N6541-A100 PLS83-LA Evaluation Module Thales Ordering number: L30960-N6551-A100 PLS63-EP Evaluation Module Thales Ordering number: L30960-N6561-A100 PLS83-EP Evaluation Module Thales Ordering number: L30960-N6571-A100 PLS63-J Evaluation Module Thales Ordering number: L30960-N6581-A100 PLS83-J Evaluation Module Thales Ordering number: L30960-N6591-A100 PLS63-X2 Evaluation Module Thales Ordering number: L30960-N6507-A100 PLS83-X2 Evaluation Module Thales Ordering number: L30960-N6517-A100 PLS63-X3 Evaluation Module Thales Ordering number: L30960-N6509-A100 PLS83-X3 Evaluation Module Thales Ordering number: L30960-N6519-A100 PLS63-X4 Evaluation Module Thales Ordering number: L30960-N6513-A100 PLS83-X4 Evaluation Module Thales Ordering number: L30960-N6523-A100 t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 7.1 List of Parts and Accessories Page 119 of 121 Table 35: List of parts and accessories Description Supplier Ordering information PLS63-I Evaluation Module Thales Ordering number: L30960-N6527-A100 PLS83-I Evaluation Module Thales Ordering number: L30960-N6537-A100 DSB-mini Ordering number: L30960-N0030-A100 DSB75 Evaluation Kit Ordering number: L36880-N8811-A100 Ordering number: L30960-N0100-A100 Thales Thales Thales EVAL DSB Adapter for mounting PLSx3 evaluation modules onto DSB75 LGA DevKit Thales LGA DevKit consists of Cinterion LGA DevKit L Base PCB:

Ordering number: L30960-N0112-A100 Cinterion LGA DevKit Socket SML:

Ordering number: L30960-N0110-A100 1. Note: At the discretion of Thales, module label information can either be laser engraved on the modules shielding or be printed on a label adhered to the modules shielding. Table 36: Molex sales contacts (subject to change) Molex For further information please click:

http://www.molex.com Molex China Distributors Beijing, Room 1311, Tower B, COFCO Plaza No. 8, Jian Guo Men Nei Street, 100005 Beijing P.R. China Phone: +86-10-6526-9628 Fax: +86-10-6526-9730 Molex Deutschland GmbH Otto-Hahn-Str. 1b 69190 Walldorf Germany Phone: +49-6227-3091-0 Fax: +49-6227-3091-8100 Email: mxgermany@molex.com Molex Singapore Pte. Ltd. 110, International Road Jurong Town, Singapore 629174 American Headquarters Lisle, Illinois 60532 U.S.A. Phone: +1-800-78MOLEX Fax: +1-630-969-1352 Molex Japan Co. Ltd. 1-5-4 Fukami-Higashi, Yamato-City, Kanagawa, 242-8585 Japan Phone: +65-6-268-6868 Fax: +65-6-265-6044 Phone: +81-46-265-2325 Fax: +81-46-265-2365 t PLSx3_HID_v01.003 2021-03-12 Public / Released Cinterion PLSx3 Hardware Interface Description 7.2 Module Label Information Page 120 of 121 7.2 Module Label Information The label engraved on the top of PLSx3 comprises the following information. 4 8 1 5 2 3 6 7 Table 37: PLSx3 label information Figure 48: PLSx3 Label No. 1 2 3 4 5 6 7 8 Cinterion logo Manufacturing country (e.g., Made in China) Factory Code Product name/variant Product order code Manufacturer 2D barcode Product IMEI 2-digital date code of product production (for decoding see Table below) Table 38: Date code table Code L Code 1 M 2 N 3 P 4 Date Code R 5 S 6 T 7 U 8 V 9 W O X N A D Year 2019 2020 2021 2022 2023 2024 2025 2026 2027 2028 2029 2030 Month Jan. Feb. Mar. Apr. May June July Aug. Sept. Oct. Nov. Dec. t PLSx3_HID_v01.003 2021-03-12 Public / Released 122 122 THALES DIS AIS Deutschland GmbH Werinherstrasse 81 81541 Munich Germany i

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HW Differences between Cinterion PLSx3-X and PLSx3-X3 Products Delta Report Version:

DocID:

01 plsx3-x_plsx3-x3_rev22_hw_delta_v01 HW Differences between Cinterion PLSx3-X and PLSx3-X3 Products Page 2 of 12 Document Name: HW Differences between Cinterion PLSx3-X and PLSx3-X3 Products Version:

Date:

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01 December 03, 2020 plsx3-x_plsx3-x3_rev22_hw_delta_v01 Confidential / Released GENERAL NOTES THE PRODUCT INCLUDING THE SOFTWARE PROVIDED BY THALES DIS AIS DEUTSCHLAND GMBH

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the Cinterion PLSx3-X and PLSx3-X3 hardware design

- Changes from PLSx3-X Rev. 2.2 to PLSx3-X3 Rev. 2.2

- Differences between PLS83-X/X3 Rev. 2.2 and PLS63-X/X3 Rev. 2.2 As US operator projects, PLSx3-X3 variants support different bands from base variants PLSx3-X, as shown in below Table 1. Both variants use the same footprint and PCB layout. Different hardware IDs are implemented to identify different variants. Table 1: Supported frequent bands Variants Technology 2 4 12 13 14 25 26 66 71 PLS63/83-X LTE

(base variants) WCDMA PLS63/83-X3 LTE WCDMA x x x x x x 5 x x x x x x x x x x x x t plsx3-x_plsx3-x3_rev22_hw_delta_v01 Confidential / Released 2020-12-03 HW Differences between Cinterion PLSx3-X and PLSx3-X3 Products Page 6 of 12 2 Baseband Hardware Differences between PLSx3-X Rev. 2.2 and PLSx3-X3 Rev. 2.2 This section describes the differences on the baseband part. Schematic Differences The following section highlights the schematic differences on baseband between PLSx3-X Rev. 2.2 and PLSx3-X3 Rev. 2.2. Different hardware IDs are implemented to identify different variants. Note: Components in black are populated, components in blue are not populated. PLS83-X Rev. 2.2 PLS83-X3 Rev. 2.2 PLS63-X Rev. 2.2 PLS63-X3 Rev. 2.2 t plsx3-x_plsx3-x3_rev22_hw_delta_v01 Confidential / Released 2020-12-03 HW Differences between Cinterion PLSx3-X and PLSx3-X3 Products Page 7 of 12 PLS83-X/X3 Rev. 2.2 is designed with a Cat. 4 processor, while PLS63-X/X3 is based on a Cat. 1 processor, the two processors are pin-pin compatible. PLS83-X/X3 Rev. 2.2 Cat. 4 processor U100: 600000001376 PLS63-X/X3 Rev. 2.2 Cat. 1 processor U100: 600000001377 t plsx3-x_plsx3-x3_rev22_hw_delta_v01 Confidential / Released 2020-12-03 HW Differences between Cinterion PLSx3-X and PLSx3-X3 Products Page 8 of 12 3 RF Hardware Differences between PLSx3-X Rev. 2.2 and PLSx3-X3 Rev. 2.2 This section describes the differences on the RF part. Schematic Differences The following section highlights the schematic differences on RF between PLSx3-X Rev. 2.2 and PLSx3-X3 Rev. 2.2. The non-supporting bands are disabled in schematic RF part. Note: Components in black are populated, components in blue are not populated. PLS83/63-X Rev. 2.2 PLS83/63-X3 Rev. 2.2 t plsx3-x_plsx3-x3_rev22_hw_delta_v01 Confidential / Released 2020-12-03 HW Differences between Cinterion PLSx3-X and PLSx3-X3 Products Page 9 of 12 t plsx3-x_plsx3-x3_rev22_hw_delta_v01 Confidential / Released 2020-12-03 HW Differences between Cinterion PLSx3-X and PLSx3-X3 Products Page 10 of 12 t plsx3-x_plsx3-x3_rev22_hw_delta_v01 Confidential / Released 2020-12-03 HW Differences between Cinterion PLSx3-X and PLSx3-X3 Products Page 11 of 12 t plsx3-x_plsx3-x3_rev22_hw_delta_v01 Confidential / Released 2020-12-03 HW Differences between Cinterion PLSx3-X and PLSx3-X3 Products Page 12 of 12 i

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THALES DIS AIS Deutschland GmbH Siemensdamm 50 13629 Berlin Germany THALES DIS AIS Deutschland GmbH Federal Communications Commission Equipment Authorization Division, Application Processing Branch 7435 Oakland Mills Road Columbia MD 21046 USA Siemensdamm 50 13629 Berlin Germany Contact person: Axel Heike E-mail: axel.heike@thalesgroup.com Tel: +49 30 31102-8146 08 March 2021 Ref: Agent letter for FCC ID: QIPPLS83-X3 We, hereby authorize THALES DIS AIS Deutschland GmbH Siemensdamm 50 13629 Berlin Germany Shenzhen UnionTrust Quality and Technology Co., Ltd. Add: 16/F, Block A, Building 6, Baoneng Science and Technology Park, Qingxiang Road No.1, Longhua New District, Shenzhen, China Billy Li Tel: +86-755-28230888 to act as our agent in the preparation of this application for equipment certification, including the signing of all documents relating to these matters. The present authorization considers the development of documents on behalf of the client, written under his own letterhead and related to the necessary information to be provided on his behalf to complete the certification process. We declare that our authorized agent is allowed to forward all information related to the approval and certification of equipment to the regulatory agencies as required and to discuss any issues concerning the approval application. Any and all acts carried out by our authorized agent on our behalf shall have the same effect as acts of our own. This agreement expires one year from the current date. Sincerely, X Axel Heike Certification Project Manager Signed by: HEIKE Axel THALES DIS AIS Deutschland GmbH Registered Office: M nchen - Amtsgericht M nchen, HRB 172715 WEEE-Reg.-Nr. DE 58893809 Managing Director: Andreas Haegele 11.03.2021 11/03/2021 X Leandro Wan-Dall Head of Certification Management Signed by: WAN-DALL Leandro