FCC ID: QIPTX62-W Global LTE Cat.M1/LTE Cat.NB2 Data-Only Module

 

Cinterion TX62/TX82 Hardware Interface Description Version:

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00.022a TX62-W_TX62-W-B_TX82-W_HID_v00.022a Cinterion TX62-W(-B)/TX82-W Hardware Interface Description Page 2 of 144 2 Document Name: Cinterion TX62-W(-B)/TX82-W Hardware Interface Description Version:

00.022a 2020-11-18 Date:

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Status TX62-W_TX62-W-B_TX82-W_HID_v00.022a Confidential / Draft GENERAL NOTE THE USE OF THE PRODUCT INCLUDING THE SOFTWARE AND DOCUMENTATION (THE "PROD-

UCT") IS SUBJECT TO THE RELEASE NOTE PROVIDED TOGETHER WITH PRODUCT. IN ANY EVENT THE PROVISIONS OF THE RELEASE NOTE SHALL PREVAIL. THIS DOCUMENT CONTAINS INFORMATION ON THALES DIS AIS DEUTSCHLAND GMBH (THALES) PRODUCTS. THE SPECIFI-

CATIONS IN THIS DOCUMENT ARE SUBJECT TO CHANGE AT THALES'S DISCRETION. THALES GRANTS A NON-EXCLUSIVE RIGHT TO USE THE PRODUCT. THE RECIPIENT SHALL NOT TRANS-

FER, COPY, MODIFY, TRANSLATE, REVERSE ENGINEER, CREATE DERIVATIVE WORKS; DISAS-

SEMBLE OR DECOMPILE THE PRODUCT OR OTHERWISE USE THE PRODUCT EXCEPT AS SPECIFICALLY AUTHORIZED. THE PRODUCT AND THIS DOCUMENT ARE PROVIDED ON AN "AS IS" BASIS ONLY AND MAY CONTAIN DEFICIENCIES OR INADEQUACIES. TO THE MAXIMUM EXTENT PERMITTED BY APPLICABLE LAW, THALES DISCLAIMS ALL WARRANTIES AND LIABILI-

TIES. THE RECIPIENT UNDERTAKES FOR AN UNLIMITED PERIOD OF TIME TO OBSERVE SECRECY REGARDING ANY INFORMATION AND DATA PROVIDED TO HIM IN THE CONTEXT OF THE DELIVERY OF THE PRODUCT. THIS GENERAL NOTE SHALL BE GOVERNED AND CON-

STRUED ACCORDING TO GERMAN LAW. Copyright Transmittal, reproduction, dissemination and/or editing of this document as well as utilization of its con-

tents and communication thereof to others without express authorization are prohibited. Offenders will be held liable for payment of damages. All rights created by patent grant or registration of a utility model or design patent are reserved. Copyright 2020, THALES DIS AIS Deutschland GmbH Trademark Notice Thales, the Thales logo, are trademarks and service marks of Thales and are registered in certain coun-

tries. Microsoft and Windows are either registered trademarks or trademarks of Microsoft Corporation in the United States and/or other countries. All other registered trademarks or trademarks mentioned in this document are property of their respective owners. t TX62-W_TX62-W-B_TX82-W_HID_v00.022a 2020-11-18 Confidential / Draft Cinterion TX62-W(-B)/TX82-W Hardware Interface Description Contents 144 Page 3 of 144 Contents 1 2 Introduction ................................................................................................................. 9 Product Variants ................................................................................................ 9 1.1 Key Features at a Glance .................................................................................. 9 1.2 TX62/TX82 System Overview.......................................................................... 14 1.3 Circuit Concept ................................................................................................ 15 1.4 Interface Characteristics .......................................................................................... 18 Application Interface ........................................................................................ 18 2.1 Pad Assignment.................................................................................. 18 2.1.1 Signal Properties................................................................................. 22 2.1.2 2.1.2.1 Absolute Maximum Ratings ................................................ 29 2.1.3 USB Interface...................................................................................... 30 Serial Interface ASC0 ......................................................................... 31 2.1.4 2.1.5 Serial Interface ASC1 ......................................................................... 33 2.1.6 UICC/SIM/USIM Interface................................................................... 35 2.1.6.1 Enhanced ESD Protection for SIM Interface ....................... 37 2.1.7 eUICC Interface .................................................................................. 38 2.1.8 GPIO ................................................................................................... 39 2.1.8.1 GPIOs Available with Embedded Processing Option .......... 40 I2C Interface ........................................................................................ 41 2.1.9 2.1.10 SPI Interface ....................................................................................... 42 2.1.11 PWM Interfaces .................................................................................. 43 2.1.12 Pulse Counter ..................................................................................... 43 2.1.13 Control Signals.................................................................................... 44 2.1.13.1 Status LED .......................................................................... 44 2.1.13.2 Power Indication Circuit ...................................................... 44 2.1.13.3 Fast Shutdown .................................................................... 45 2.1.13.4 SIM Switch .......................................................................... 46 2.1.13.5 SUSPEND Mode Indicator .................................................. 47 RF Antenna Interface....................................................................................... 48 2.2.1 Antenna Interface Specifications ........................................................ 48 Antenna Installation ............................................................................ 54 2.2.2 2.2.3 RF Line Routing Design...................................................................... 55 2.2.3.1 Line Arrangement Examples ............................................... 55 2.2.3.2 Routing Example................................................................. 60 GNSS Interface................................................................................................ 61 2.3.1 GNSS Receiver................................................................................... 61 2.3.2 GNSS Antenna ................................................................................... 61 2.3.3 GNSS Antenna Interface Characteristics (TBD.) ................................ 62 Sample Application .......................................................................................... 63 Sample Level Conversion Circuit........................................................ 65 2.4.1 2.2 2.3 2.4 t TX62-W_TX62-W-B_TX82-W_HID_v00.022a 2020-11-18 Confidential / Draft Cinterion TX62-W(-B)/TX82-W Hardware Interface Description Contents 144 Page 4 of 144 3 4 3.3 3.2.5 3.2.3 3.2.4 Operating Characteristics ........................................................................................ 66 Operating Modes ............................................................................................. 66 3.1 Power Up/Power Down Scenarios ................................................................... 67 3.2 Turn on TX62/TX82 ............................................................................ 67 3.2.1 3.2.1.1 Switch on TX62/TX82 Using ON Signal .............................. 67 3.2.2 Restart TX62/TX82 ............................................................................. 69 3.2.2.1 Restart TX62/TX82 via AT+CFUN Command ..................... 69 3.2.2.2 Restart TX62/TX82 Using EMERG_RST ............................ 69 Signal States after Startup .................................................................. 70 Turn off TX62/TX82 ............................................................................ 71 3.2.4.1 Switch off TX62/TX82 Using AT Command......................... 71 Automatic Shutdown ........................................................................... 72 Thermal Shutdown .............................................................. 72 3.2.5.1 3.2.5.2 Undervoltage Shutdown...................................................... 73 3.2.5.3 Overvoltage Shutdown........................................................ 73 Power Saving................................................................................................... 74 Low Power Modes .............................................................................. 75 3.3.1 3.3.1.1 SLEEP Mode....................................................................... 76 3.3.1.2 SUSPEND Mode................................................................. 77 Power Saving while Attached to GSM Networks (TX82-W only) ........ 79 3.3.2.1 DRX (Standard Configuration) ............................................ 79 3.3.2.2 eDRX (Extended DRX Configuration) ................................. 79 Power Saving while Attached to LTE M1 NB1/2 Networks ................. 80 3.3.3.1 DRX (Standard Configuration) ............................................ 80 eDRX (Extended DRX Configuration) ................................. 81 3.3.3.2 3GPP PSM Configuration.................................................... 82 3.3.3.3 Power Supply................................................................................................... 83 3.4.1 Power Supply Ratings (TBD.) ............................................................. 83 3.4.2 Minimizing Power Losses ................................................................... 99 3.4.3 Measuring the Supply Voltage (VBATT+) ........................................... 99 3.4.4 Monitoring Power Supply by AT Command ...................................... 100 Operating Temperatures................................................................................ 100 Electrostatic Discharge .................................................................................. 101 ESD Protection for RF Antenna Interface ......................................... 101 3.6.1 Blocking against RF on Interface Lines ......................................................... 102 Reliability Characteristics ............................................................................... 104 3.5 3.6 3.7 3.8 3.3.2 3.3.3 3.4 Mechanical Dimensions, Mounting and Packaging............................................. 105 Mechanical Dimensions of TX62-W ............................................................... 105 4.1 Mechanical Dimensions of TX82-W and TX62-W-B ...................................... 107 4.2 Mounting TX62/TX82 onto the Application Platform ...................................... 109 4.3 SMT PCB Assembly ......................................................................... 109 4.3.1 4.3.1.1 Land Pattern and Stencil................................................... 109 4.3.1.2 Board Level Characterization.............................................111 4.3.2 Moisture Sensitivity Level ................................................................. 112 t TX62-W_TX62-W-B_TX82-W_HID_v00.022a 2020-11-18 Confidential / Draft Cinterion TX62-W(-B)/TX82-W Hardware Interface Description Contents 144 Page 5 of 144 4.3.3 Soldering Conditions and Temperature ............................................ 113 4.3.3.1 Reflow Profile .................................................................... 113 4.3.3.2 Maximum Temperature and Duration ................................ 114 4.3.4 Durability and Mechanical Handling.................................................. 115 4.3.4.1 Storage Conditions............................................................ 115 4.3.4.2 Processing Life.................................................................. 116 4.3.4.3 Baking ............................................................................... 116 4.3.4.4 Electrostatic Discharge ..................................................... 116 Packaging ...................................................................................................... 117 Tape and Reel .................................................................................. 117 4.4.1 4.4.1.1 Orientation......................................................................... 117 4.4.1.2 Barcode Label ................................................................... 118 Shipping Materials ............................................................................ 120 4.4.2.1 Moisture Barrier Bag ......................................................... 120 4.4.2.2 Transportation Box ............................................................ 123 Trays (TBD) ...................................................................................... 124 4.4.3 4.4.2 4.4 5 6 7 Regulatory and Type Approval Information ......................................................... 126 Directives and Standards (TBD.) ................................................................... 126 5.1 SAR requirements specific to portable mobiles ............................................. 129 5.2 Reference Equipment for Type Approval ....................................................... 130 5.3 Compliance with FCC and ISED Rules and Regulations............................... 131 5.4 Document Information............................................................................................ 133 Revision History ............................................................................................. 133 6.1 Related Documents ....................................................................................... 135 6.2 Terms and Abbreviations ............................................................................... 136 6.3 Safety Precaution Notes ................................................................................ 139 6.4 Appendix.................................................................................................................. 140 List of Parts and Accessories......................................................................... 140 7.1 Module Label Information .............................................................................. 143 7.2 t TX62-W_TX62-W-B_TX82-W_HID_v00.022a 2020-11-18 Confidential / Draft Cinterion TX62-W(-B)/TX82-W Hardware Interface Description Tables 144 Page 6 of 144 Tables Table 1:

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Overview: Pad assignments TX82-W and TX62-W-B additional pads .......... 18 Overview: Pad assignments common to TX62/TX82 .................................... 19 Signal properties ............................................................................................ 22 Absolute maximum ratings............................................................................. 29 Signals of the SIM interface (SMT application interface) ............................... 35 Signals of the eUICC interface option (SMT application interface) ................ 38 GPIO lines and alternative assignments ........................................................ 40 Return loss in the active band........................................................................ 48 RF Antenna interface GSM / LTE of TX82-W, and TX62-W .......................... 48 RF Antenna interface LTE of TX62-W-B........................................................ 52 GNSS properties ............................................................................................ 62 Overview of operating modes ........................................................................ 66 Signal states................................................................................................... 70 Temperature dependent behavior.................................................................. 72 Power saving features.................................................................................... 74 Voltage supply ratings.................................................................................... 83 Current consumption ratings General and GSM (TX82-W only).................... 84 Current consumption typical ratings Cat M1 .................................................. 87 Current consumption typical ratings Cat NB1/2 ............................................. 92 Board temperature ....................................................................................... 100 Ambient temperature.................................................................................... 100 Electrostatic values ...................................................................................... 101 EMI measures on the application interface .................................................. 103 Summary of reliability test conditions........................................................... 104 Reflow temperature ratings .......................................................................... 113 Storage conditions ....................................................................................... 115 VP Box label information.............................................................................. 123 Directives ..................................................................................................... 126 Standards of North American type approval ................................................ 126 Standards of European type approval.......................................................... 126 Requirements of quality ............................................................................... 127 Standards of the Ministry of Information Industry of the Peoples Republic of China .......................................................................... 127 Toxic or hazardous substances or elements with defined concentration limits ............................................................................................................. 128 List of parts and accessories........................................................................ 140 Molex sales contacts (subject to change) .................................................... 142 TX62/TX82 label information........................................................................ 143 Date code table ............................................................................................ 143 t TX62-W_TX62-W-B_TX82-W_HID_v00.022a 2020-11-18 Confidential / Draft Cinterion TX62-W(-B)/TX82-W Hardware Interface Description Figures 144 Page 7 of 144 Figures Figure 1:

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TX62/TX82 system overview ......................................................................... 14 TX82-W block diagram................................................................................... 15 TX62-W block diagram................................................................................... 16 TX62-W-B block diagram ............................................................................... 17 TX62/TX82 top view: Pad assignments ......................................................... 20 TX62/TX82 bottom view: Pad assignments ................................................... 21 USB circuit ..................................................................................................... 30 Serial interface ASC0..................................................................................... 31 ASC0 startup behavior ................................................................................... 32 Serial interface ASC1..................................................................................... 33 ASC1 startup behavior ................................................................................... 34 External UICC/SIM/USIM card holder circuit ................................................. 36 SIM interface - enhanced ESD protection...................................................... 37 eUICC interface.............................................................................................. 38 GPIO start up behavior .................................................................................. 39 I2C interface connected to V180 .................................................................... 41 Characteristics of SPI modes......................................................................... 42 Status signaling with LED driver .................................................................... 44 Power indication circuit .................................................................................. 45 Fast shutdown timing ..................................................................................... 46 SIM switch circuit ........................................................................................... 46 Antenna pads (top view) ................................................................................ 54 Embedded Stripline with 65m prepreg (1080) and 710m core .................. 55 Micro-Stripline on 1.0mm Standard FR4 2-layer PCB - example 1................ 56 Micro-Stripline on 1.0mm Standard FR4 2-layer PCB - example 2................ 57 Micro-Stripline on 1.5mm Standard FR4 2-layer PCB - example 1................ 58 Micro-Stripline on 1.5mm Standard FR4 2-layer PCB - example 2................ 59 Routing to applications RF connector - top view ........................................... 60 Sample supply voltage circuit for active GNSS antenna................................ 61 Schematic diagram of TX62/TX82 sample application .................................. 64 Sample level conversion circuit...................................................................... 65 Sample ON circuit .......................................................................................... 67 ON startup timing ........................................................................................... 68 Emergency restart timing ............................................................................... 69 Switch off behavior......................................................................................... 71 Low power modes with state transitions ........................................................ 75 Wake-up via RTS0 ......................................................................................... 76 Handshake for entering the modules SUSPEND mode ................................ 77 Handshake for module wake up via ON signal .............................................. 78 Handshake for module wake up after eDRX/PSM timer expiry ..................... 78 DRX based paging and power saving (SLEEP) in GSM networks ................ 79 DRX based paging and power saving (SLEEP) in LTE Cat M1 and Cat NB1/2 networks ....................................................................................... 80 eDRX based paging and power saving in LTE Cat M1 and Cat NB1/2 networks ....................................................................................... 81 eDRX/PSM based paging and power saving in LTE Cat M1 or Cat NB1/2 networks ....................................................................................... 82 Power supply limits during transmit burst....................................................... 99 Position of reference points BATT+ and GND ............................................... 99 ESD protection for RF antenna interface ..................................................... 101 t TX62-W_TX62-W-B_TX82-W_HID_v00.022a 2020-11-18 Confidential / Draft Cinterion TX62-W(-B)/TX82-W Hardware Interface Description Figures 144 Page 8 of 144 Figure 48:

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EMI circuits................................................................................................... 102 TX62-W top and bottom view..................................................................... 105 Dimensions of TX62-W (all dimensions in mm) ........................................... 106 Dimensions of area for possible markings TX62-W (bottom view) .............. 106 TX82-W top and bottom view..................................................................... 107 Dimensions of TX82-W and TX62-W-B (all dimensions in mm) .................. 108 Dimensions of area for possible markings TX82-W and TX62-W-B

(bottom view)................................................................................................ 108 Land pattern TX62-W (top view) .................................................................. 109 Land pattern TX82-W and TX62-W-B (top view) ......................................... 110 Recommended design for 110m thick stencil for TX62-W (top view) ........ 111 Recommended design for 110m thick stencil for TX82-W and TX62-W-B

(top view)...................................................................................................... 111 Reflow Profile ............................................................................................... 113 Carrier tape .................................................................................................. 117 Reel direction ............................................................................................... 118 Barcode label on tape reel ........................................................................... 118 Barcode label on tape reel - layout .............................................................. 119 Moisture barrier bag (MBB) with imprint....................................................... 120 Moisture Sensitivity Label ............................................................................ 121 Humidity Indicator Card - HIC ...................................................................... 122 Sample of VP box label................................................................................ 123 Small quantity tray........................................................................................ 124 Tray to ship odd module amounts................................................................ 124 Trays with packaging materials.................................................................... 124 Tray dimensions (TBD.) ............................................................................... 125 Reference equipment for type approval ....................................................... 130 TX62/TX82 label .......................................................................................... 143 t TX62-W_TX62-W-B_TX82-W_HID_v00.022a 2020-11-18 Confidential / Draft Cinterion TX62-W(-B)/TX82-W Hardware Interface Description 1 Introduction 17 Page 9 of 144 1 Introduction This document1 describes the hardware of the Cinterion TX62/TX82 module variants opti-

mized for global coverage as they support a comprehensive set of bands required for global deployment. It helps you quickly retrieve interface specifications, electrical and mechanical de-

tails and information on the requirements to be considered for integrating further components. Note: This Hardware Interface Description is an early draft version and as such subject to change depending on further implementation and measurements. 1.1 Product Variants This document applies to the following Thales module variants:

Cinterion TX62-W (as of v00.020) Cinterion TX62-W-B (as of v00.022) Cinterion TX82-W (as of v00.018) Note: The TX62/TX82 variants differ in that TX82-W does support GSM (2G) whereas TX62-

W and TX62-W-B do not support GSM (2G). TX62-W and TX62-W-B differ in their RF output power. Also, TX82-W and TX62-W-B have a different (larger) footprint then TX62-W. Wherever necessary a note is made to differentiate between the product variants. 1.2 Key Features at a Glance Feature General Implementation Frequency bands

(see Section 2.2.1) GSM (TX82-W only):

850/900/1800/1900 LTE Cat M1:

700 (Bd12, Bd13, Bd28, Bd85), 800 (Bd18, Bd19, Bd20, Bd26, Bd27), 850

(Bd5), 900 (Bd8), AWS-3 (Bd66), AWS-1 (Bd4), 1800 (Bd3), 1900 (Bd2, Bd25), 2100 (Bd1) LTE Cat NB1/2:

600 (Bd71), 700 (Bd12, Bd13, Bd28, Bd85), 800 (Bd18, Bd19, Bd20, Bd26), 850 (Bd5), 900 (Bd8), AWS-3 (Bd66), AWS-1 (Bd4), 1800 (Bd3), 1900

(Bd2, Bd25), 2100 (Bd1) GSM class Small MS Output power (according to Release 7) GSM/GPRS (TX82-W only):

Class 4 (+33dBm 2dB) for GSM850 and GSM900 Class 1 (+30dBm 2dB) for GSM1800 and GSM1900 Class E2 (+27dBm 3dB) for GSM850 8-PSK and GSM 900 8-PSK Class E2 (+26dBm +3 /-4dB) for GSM 1800 8-PSK and GSM1900 8-PSK 1. The document is effective only if listed in the appropriate Release Notes as part of the technical docu-

mentation delivered with your Thales product. t TX62-W_TX62-W-B_TX82-W_HID_v00.022a 2020-11-18 Confidential / Draft Cinterion TX62-W(-B)/TX82-W Hardware Interface Description 1.2 Key Features at a Glance 17 Page 10 of 144 Feature Implementation Output power (according to 3GPP Release 13) TX62-W and TX82-W:

LTE Cat M1:

Class 5 (+20dBm 2dB) for all supported LTE Cat M1 bands LTE Cat NB1/2:

Class 5 (+20dBm 2dB) for all supported LTE Cat NB1/2 bands TX62-W-B:

LTE Cat M1:

Class 3 (+23dBm 2dB) for all supported LTE Cat M1 bands LTE Cat NB1/2:

Class 3 (+23dBm 2dB) for all supported LTE Cat NB1/2 bands Power supply

(see Section 2.1.2 and Section 3.4) TX82-W:

LTE and GSM: 3.1V to 4.6V LTE with GSM deactivated: 2.8V to 4.6V Operating temperature

(board temperature)

(see Section 3.5) Physical

(see Section 4.1) RoHS

(see Section 5.1) LTE features 3GPP Release 14 TX62-W:

LTE: 2.55V to 4.8V TX62-W-B:

LTE: 2.5V to 4.5V Normal operation: -30C to +85C Extended operation: -40C to +90C Dimensions:

TX62-W:

15.3 mm x 15.3 mm x 2.9 mm TX82-W and TX62-W-B:

15.3 mm x 20.9 mm x 2.28 mm Weight: approx. 2.5g LTE Cat M1 (HD-FDD) DL: max. 300kbps, UL: max. 1.1Mbps LTE Cat NB1 (HD-FDD) DL: max. 27kbps, UL: max. 63kbps LTE Cat NB2 (HD-FDD) DL: max. 124kbps, UL: max. 158kbps All hardware components fully compliant with EU RoHS Directive t TX62-W_TX62-W-B_TX82-W_HID_v00.022a 2020-11-18 Confidential / Draft Cinterion TX62-W(-B)/TX82-W Hardware Interface Description 1.2 Key Features at a Glance 17 Page 11 of 144 Feature Implementation GSM/GPRS/EGPRS features Data transfer EDGE E2 power class for 8 PSK GPRS (TX82-W only):

Multislot Class 10 Full PBCCH support Mobile Station Class B Coding Scheme 1 4 EGPRS (TX82-W only):

Multislot Class 10 Downlink coding schemes CS 1-4, MCS 1-9 Uplink coding schemes CS 1-4, MCS 1-9 SRB loopback and test mode B 8-bit, 11-bit RACH PBCCH support 1 phase/2 phase access procedures Link adaptation and IR NACC, extended UL TBF Mobile Station Class B Standalone GNSS (GPS, GLONASS, BeiDou, Galileo) NMEA (for GNSS related sentences) Automatic power saving modes Hayes 3GPP TS 27.007, TS 27.005, Thales AT commands for RIL compatibility SMS Point-to-point MT and MO Text and PDU mode Storage: SIM card plus SMS locations in mobile equipment GNSS Features Modes

(see Section 2.3) Protocol General Software AT commands Interfaces Module interface Embedded processing platform (optional) Embedded processing option with API. Memory space available for embedded applications is 512KB for applica-

tion code, 512KB min for File System and 768KB min for RAM. Please take into account that the application code is copied into RAM. For more details, please consult software documentation. SIM Application Toolkit SAT Release 99 Firmware update Firmware update from external application over ASC0 and ASC1 interface. Surface mount device with solderable connection pads (SMT application interface). Land grid array (LGA) technology ensures high solder joint reli-

ability and allows the use of an optional module mounting socket. For more information on how to integrate SMT modules see also [4]. This application note comprises chapters on mounting and application layout issues as well as on additional SMT application development equipment. USB

(see Section 2.1.3) USB 2.0 High Speed (480Mbit/s) device interface, Full Speed (12Mbit/s) compliant The USB interface is used for tracing purposes only. t TX62-W_TX62-W-B_TX82-W_HID_v00.022a 2020-11-18 Confidential / Draft Cinterion TX62-W(-B)/TX82-W Hardware Interface Description 1.2 Key Features at a Glance 17 Page 12 of 144 Feature Implementation 2 serial interfaces

(see Section 2.1.4 and Section 2.1.5) ASC0:

ASC1:

8-wire modem interface with status and control lines, unbalanced, asyn-

chronous Adjustable baud rates: 300bps to 921,600bps Supports RTS0/CTS0 hardware flow control (as configuration option). 4-wire, unbalanced asynchronous modem interface Adjustable baud rates: 300bps to 921,600bps Supports RTS1/CTS1 hardware flow control (as configuration option). Supported SIM/USIM cards: 1.8V Supports embedded MFF-XS UICC interface (as an option). TX62-W:

6 I/O pins of the application interface programmable as GPIO. Programming can be done via AT commands. TX82-W and TX62-W-B:

7 I/O pins of the application interface programmable as GPIO. Programming can be done via AT commands. With the embedded processing option 17 (TX62-W) or 18 (TX82-W and TX62-W-B) I/O pads are programmable as GPIOs and may be shared with other functions (ASC0, ASC1/SPI, PWM, fast shutdown, counter, and sta-

tus). Supports status indication LED. Supports fast shutdown interrupt signal. ADC Input Analog-to-Digital Converter with one unbalanced analog inputs Supports signal to switch between two externally connected SIMs. 50. GSM/LTE Main antenna, GNSS antenna I2C interface only available with embedded processing option. SPI interface only available with embedded processing option. PWM interface

(see Section 2.1.11) Pulse width modulation interface only available with embedded processing option. Pulse counter interface only available with embedded processing option. Switch-on by hardware signal ON Switch-off by AT command and hardware signal FST_SHDN Automatic switch-off in case of critical voltage conditions Reset Orderly shutdown and reset by AT command Emergency reset by hardware signal EMERG_RST t TX62-W_TX62-W-B_TX82-W_HID_v00.022a 2020-11-18 Confidential / Draft UICC interface

(see Section 2.1.6) eUICC interface

(see Section 2.1.7 GPIO interface

(see Section 2.1.8) Status

(see Section 2.1.13.1) Fast shutdown

(see Section 2.1.13.3) SIM switch

(see Section 2.1.13.4) Antenna interface pads

(see Section 2.2) I2C interface

(see Section 2.1.9) SPI interface

(see Section 2.1.10) Counter

(see Section 2.1.12) Power on/off, Reset Power on/off Cinterion TX62-W(-B)/TX82-W Hardware Interface Description 1.2 Key Features at a Glance 17 Page 13 of 144 Feature Implementation Special features Approval

(see Section 5) Phonebook Cinterion IoT Suite ser-

vices RED, CE, FCC, ISED, UL, EuP, RoHS, and REACH compliant GCF, PTCRB SIM and phone

(Optionally) supports an IoT Suite client based on the LWM2M protocol. The client can be configured to collect diagnostic information about the module and cellular network and to send it periodically to the Cinterion IoT Suite server platform, where it can be visualized for further analysis. Communication to Thales Device Management Hub is realized using a resource-efficient protocol specifically designed by Thales in order to keep the energy and data usage to a minimum. The protocol behavior may be influenced by means of configuration. Additionally, the service provides device control functionality. This includes remote flash file system management, module firmware over-the-air updates (FOTA) and remote configuration. The Cinterion IoT Suite also generates alarms when a specific module or network parameter changes or exceeds a threshold. Alarms can be sent to the platform as soon as possible disregarding the connection interval. For more information, please refer to [6]. Evaluation kit (For ordering information see Section 7.1) LGA DevKit Evaluation module DSB75 LGA DevKit designed to test Thales LGA modules. For more information see also LGA DevKit. TX62/TX82 module soldered onto a dedicated PCB that can be connected to the an approval adapter in order to be mounted onto the DSB75 or DSB-

Mini. DSB75 Development Support Board designed to test and type approve Thales modules and provide a sample configuration for application engi-

neering. A special adapter is required to connect the TX62/TX82 evaluation module to the DSB75. t TX62-W_TX62-W-B_TX82-W_HID_v00.022a 2020-11-18 Confidential / Draft Cinterion TX62-W(-B)/TX82-W Hardware Interface Description 1.3 TX62/TX82 System Overview 17 Page 14 of 144 1.3 TX62/TX82 System Overview M odule Application A S C0 lin e s A S C1 lin e s U S B lin e s S T A T U S F S T_ S H D N S IM _S W IT C H S IM in te rfa ce

(with S IM d ete ctio n ) M IM in te rfa c e

(M F F -X S UICC) C O N T R OL S U S P E N D_ M ON A D C G P IO I2 C P OW E R A N T E N N A G N S S 8 4 3 1 1 1 1 5 5 1 1 1 1 17 18 2 1 1 1 S e ria l m o d e m in te rfa c e lin e s S e ria l m o d e m in te rfa c e lin e s U S B in te rfa c e T ra c in g o n ly S ta tu s L E D F a s t s h u td o w n S IM s w itch S IM ca rd M IM (o p tio n) O N E m e rg e n c y re s e t A D C1 S U S P E N D m o d e in d ic a tio n G P IO s

(17 for TX 62 -W , 18 for TX62 -W -B and TX 82 -W ) I2 C P o w e r s u p p ly L T E a n te n n a GN S S a n te n n a Figure 1: TX62/TX82 system overview Please note that the I2C function and some GPIO lines are available with the embedded pro-

cessing option only. Also, some GPIO lines may be shared with further functions that are also only available with the embedded processing option. For details see Section 2.1, and Section 2.1.8.1. t TX62-W_TX62-W-B_TX82-W_HID_v00.022a 2020-11-18 Confidential / Draft Cinterion TX62-W(-B)/TX82-W Hardware Interface Description 1.4 Circuit Concept 17 Page 15 of 144 1.4 Circuit Concept Figure 2, Figure 3, and Figure 4 show block diagrams for the TX62/TX82 module variants, and illustrate the major functional components:

Power Supply LGA Pads s d a P A G L a n n e t n A GSM/

LTE F R _

T T A B RF Part HWIDs BATT+

GPIO EN USB_VDDA _3P3 IN OUT LDO GSMPA +ASM 2 REFE 2_CLK_DATA GPIOs REFE 1...2_ CLK_DATA 4 GPDATA STMR_SYNC RF Transceiver LTE PA+ASM SDR_ TX_LB_GSM SDR_ TX_ MB_ GSM SDR_ ASM _AN T TX_PA 1 (LTE_LB) R X_LB_GSM RX_MB_GSM LB LPF LB LPF M B LPF Match ing B71_RX SDR_GNSS GNSS RF GNSS SAW filter GSM/CatM1/CatNB Baseband controller with integrated memory t p u r r e n t I t e s e R z H M 2 9 1

. z H k 8 6 7 2 3

. D L O H _ S P e c a f r e n t i l o r t n o C Power Management IC

) 2 x 2

l s a n g s

Q i

I Power Supply 1 K L C _ F R X-tal:

19.2MHz with Temp.Sensor ADC 8 4 3 3 5 2 4 2 Serial (ASC0/GPIO) Serial (ASC1/GPIO) USB 2.0 (tracing only) USIM CCIN FST_SHDN (GPIO) STATUS (GPIO) SUSPEND_MON SIM_SWITCH or COUNTER (GPIO) GPIO (not shared) I2C SPI (GPIO) PWM (GPIO) VUSIM ADC1 EMERG_RST ON V180 VCORE BATT+

BATT+_RF BATT+RF BATT+BB MIM

(MFF-XS eUICC) 5 MIM (optional) Figure 2: TX82-W block diagram t TX62-W_TX62-W-B_TX82-W_HID_v00.022a 2020-11-18 Confidential / Draft Cinterion TX62-W(-B)/TX82-W Hardware Interface Description 1.4 Circuit Concept 17 Page 16 of 144 Power Supply LGA Pads HWIDs RF Part GPIO EN USB_VDDA _3P3 IN OUT LDO s d a P A G L a n n e n A t LTE Coupler SDR_ASM_ANT RF Transceiver LTE PA+ASM GSM/CatM1/CatNB Baseband controller with integrated memory BATT+

GPIOs REFE 1...2_ CLK_DATA 4 GPDATA STMR_SYNC

) 2 x 2

l s a n g s

Q i

I TX_PA1(LTE_LB) LB LPF Matching B71_RX SDR_GNSS GNSS RF GNSS SAW filter 8 4 3 3 5 2 4 Serial (ASC0/GPIO) Serial (ASC1(GPIO) USB 2.0 (tracing only) USIM CCIN FST_SHDN (GPIO) STATUS (GPIO) SUSPEND_MON SIM_SWITCH or COUNTER (GPIO) GPIOs (not shared) I2C SPI (GPIO) PWM (GPIO) t p u r r e t n I t e s e R e c a f r e t n i l o r t n o C z H M 2

. 9 1 z H k 8 6 7

. 2 3 D L O H _ S P Power Management IC Power Supply 1 K L C _ F R X-tal:

19.2MHz with Temp.Sensor ADC VUSIM ADC1 EMERG_RST ON V180 VCORE BATT+

BATT+_RF BATT+RF BATT+BB MIM

(MFF-XS eUICC) 5 MIM (optional) Figure 3: TX62-W block diagram t TX62-W_TX62-W-B_TX82-W_HID_v00.022a 2020-11-18 Confidential / Draft Cinterion TX62-W(-B)/TX82-W Hardware Interface Description 1.4 Circuit Concept 17 Page 17 of 144 Power Supply s d a P A G L a n n e t n A LTE F R _

T T A B RF Part HWIDs BATT+

GPIO USB_VDDA _3P3 EN IN OUT LDO LTE PA + PAM 2 REFE 2_CLK_DATA GPIOs SDR_ TX_L B_ L TE SDR_ TX_ MB_ L TE SDR _RX_ L TE RF Transceiver GSM/CatM1/CatNB Baseband controller with integrated memory LGA Pads Serial (ASC0/GPIO) Serial (ASC1/GPIO) USB 2.0 (tracing only) USIM CCIN FST_SHDN (GPIO) STATUS (GPIO) SUSPEND_MON SIM_SWITCH or COUNTER (GPIO) GPIO (not shared) I2C SPI (GPIO) PWM (GPIO) 8 4 3 3 5 2 4 2 REFE 1...2_ CLK_DATA 4 GPDATA STMR_SYNC

) 2 x 2

l s a n g s

Q i

I Power Supply 1 K L C _ F R X-tal:

19.2MHz with Temp.Sensor ADC t p u r r e t n I t e s e R e c a f r e t n i l o r t n o C z H M 2

. 9 1 z H k 8 6 7

. 2 3 D L O H _ S P Power Management IC VUSIM ADC1 EMERG_RST ON V180 VCORE BATT+

BATT+_RF BATT+RF BATT+BB MIM

(MFF-XS eUICC) 5 MIM (optional) Ma tch in g B71_RX SDR_GNSS GNSS RF GN SS SAW filte r Figure 4: TX62-W-B block diagram Please note that the I2C function and some GPIO lines are available with the embedded pro-

cessing option only. Also, some GPIO lines may be shared with further functions that are also only available with the embedded processing option. For details see Section 2.1, and Section 2.1.8.1. t TX62-W_TX62-W-B_TX82-W_HID_v00.022a 2020-11-18 Confidential / Draft Cinterion TX62-W(-B)/TX82-W Hardware Interface Description 2 Interface Characteristics 65 Page 18 of 144 2 Interface Characteristics TX62/TX82 is equipped with an SMT application interface that connects to the external appli-

cation. The SMT application interface incorporates the various application interfaces as well as the RF antenna interface. 2.1 Application Interface 2.1.1 Pad Assignment The SMT application interface on the TX62/TX82 provides connecting pads to integrate the module into external applications. The pads listed in Table 1 apply only to TX82-W and TX62-

W-B. Table 2 lists the common pads of TX62/TX82. Figure 6 (bottom view) and Figure 5 (top view) show the connecting pads numbering plan of TX62-W (pads inside dark violet rectangle) as well as TX82-W and TX62-W-B (pads inside light violet rectangle). As a rule all pads should be soldered for mechanical stability and heat dissipation. Signal pads that are not used, i.e., marked as rfu or nc, need to be soldered, but should not have an electrical connection to the external application or GND. Also, pads marked as rfu are further qualified as either (dnu = do not use) or (<name>), indicating that they are either not used at all, or may be assigned to a named signal for a future product release. In addition, pads mentioned in squared brackets (I2CDAT and I2CCLK pads, SPI, PWM, and Counter pads as well as shared GPIO pads) are available with the embedded processing option only. Please note that the reference voltages listed in Table 3 are the values measured directly on the TX62/TX82 module. They do not apply to the accessories connected. Note: Thales strongly recommends to provide test points for certain signal lines to and from the module while developing SMT applications for debug, test and/or trace purposes during the manufacturing process. In this way it is possible to detect soldering (and other) problems. Please refer to [4] and [5] for more information on test points and how to implement them. The signal lines for which test points should be provided for are marked as Test point recommend-

ed in Table 3. Table 1: Overview: Pad assignments TX82-W and TX62-W-B additional pads1 Pad no. Signal name B5 B6 B18 B19 C5 C6 C18 C19 E5 E6 GND rfu (nc) rfu (nc) GND rfu (nc) rfu (nc) rfu (nc) rfu (nc) rfu (nc) GPIO6 [PWM2]2 Pad no. Signal name E18 E19 G5 G6 G18 G19 J5 J6 J18 J19 rfu (nc) rfu (nc) rfu (nc) rfu (dnu) rfu (nc) rfu (nc) rfu (nc) rfu (nc) rfu (nc) rfu (nc) Pad no. Signal name L5 L6 L18 L19 M5 M6 M18 M19 rfu (nc) rfu (nc) rfu (nc) rfu (nc) GND rfu (nc) rfu (nc) GND 1. rfu = reserved for future use; dnu = do not use; nc = internally not connected 2. PWM2 pad mentioned in squared brackets is available with the embedded processing option only. t TX62-W_TX62-W-B_TX82-W_HID_v00.022a 2020-11-18 Confidential / Draft Cinterion TX62-W(-B)/TX82-W Hardware Interface Description 2.1 Application Interface 65 Page 19 of 144 Table 2: Overview: Pad assignments common to TX62/TX821 2 Signal name Signal name Signal name Pad no. B7 B8 B9 B10 B11 B12 B13 B14 B15 B16 B17 C7 C8 C9 C10 C11 C12 C13 C14 C15 C16 C17 D7 D8 D9 D10 D11 D12 D13 D14 D15 D16 D17 E7 E8 E9 E10 E11 GND GND GNSS_ANT GND GND RF_OUT GND GND rfu (dnu) GND GND rfu (dnu) SIM_SWITCH

[GPIO8/COUNTER]

GND GND GND GND GND GND GND GND rfu (nc) rfu (dnu) GPIO22 rfu (nc) GND GND GND GND GND ON rfu (nc) rfu (nc) GPIO7 [PWM1]

GPIO21 rfu (GNSS_LNA_EN) GND rfu (dnu) Pad no. E12 E13 E14 E15 E16 E17 F7 F8 F9 F10 F11 F12 F13 F14 F15 F16 F17 G7 G8 G9 G10 G14 G15 G16 G17 H7 H8 H9 H10 H14 H15 H16 H17 J7 J8 J9 J10 J14 rfu (dnu) rfu (dnu) GND EMERG_RST VCORE rfu (nc) GND GPIO25 SUSPEND_MON GND rfu (dnu) rfu (dnu) rfu (dnu) Pad no. J15 J16 J17 K7 K8 K9 K10 K11 K12 K13 K14 K15 K16 K17 GND L7 ADC1 L8 rfu (nc) L9 GND L10 rfu (nc) L11 GPIO20 L12 rfu (nc) L13 GND L14 GND L15 rfu (nc) L16 rfu (nc) L17 rfu (nc) M7 rfu (nc) M8 GPIO23

[I2CDAT]3 M9

[I2CCLK]2 M10 M11 GND M12 BATT+BB M13 BATT+BB M14 rfu (nc) M15 rfu (nc) CTS1 [GPIO19/SPI_CLK] M16 RXD1 [GPIO16/MOSI]2 M17 GND2 rfu (dnu) V180 GND CC2_VPP rfu (nc) RTS1 [GPIO18/SPI_CS]

STATUS [GPIO5]

FAST_SHDN [GPIO4]

rfu (nc) RING0 [GPIO24]

DTR0 [GPIO1]

DCD0 [GPIO2]

CCCLK rfu (dnu) CC2_CLK rfu (nc) TXD1 [GPIO17/MISO]

VUSB_IN rfu (dnu) DSR0 [GPIO3]

RTS0 CTS0 CCVCC CCRST CC2_VCC CC2_RST GND GND USB_DP USB_DN GND RXD0 TXD0 CCIO CCIN CC2_IO GND 1. rfu = reserved for future use; dnu = do not use; nc = internally not connected 2. Pads mentioned in squared brackets (I2CDAT and I2CCLK pads, SPI, PWM1, and Counter pads as well as shared GPIO pads) are available with the embedded processing option only. 3. Only for TX62-W Rev.A1 the following pads are swapped:

H10: I2CCLK J10: GND and H9: I2CDAT J9: RXD1 t TX62-W_TX62-W-B_TX82-W_HID_v00.022a 2020-11-18 Confidential / Draft Cinterion TX62-W(-B)/TX82-W Hardware Interface Description 2.1 Application Interface 65 Page 20 of 144 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 GND rfu (nc) GND CC2_IO CCIN CCIO TXD0 RXD0 GND USB_DN USB_DP GND GND rfu (nc) GND rfu (nc) rfu (nc) CC2_RST CC2_VCC CCRST CCVCC CTS0 RST0 rfu (dnu) rfu (nc) rfu (nc) rfu (nc) DSR0

[GPIO3]

VUSB _IN CC2_CLK rfu (dnu) CCCLK DCD0

[GPIO2]

DTR0

[GPIO1]

RING0

[GPIO24]

rfu (nc) FST_SHDN

[GPIO4]

STATUS

[GPIO5]

rfu (nc) rfu (nc) rfu (nc) CC2_VPP GND V180 rfu (nc) Reserved for future use GND RXD1

[GPIO16/

MOSI]

CTS1

[GPIO19/

SPI_CLK]

rfu (nc) rfu (nc) rfu (nc) rfu (nc) BATT+BB BATT+BB GND

[I2CCLK]

[I2CDAT]

GPIO23 rfu (nc) TXD1

[GPIO17/

MISO]

RTS1

[GPIO18/

SPI_CS]

rfu (nc) rfu (nc) rfu (nc) BATT+RF BATT+RF GND Marking GND rfu (nc) GPIO20 rfu (nc) GND rfu (nc) ADC1 GND rfu (dnu) rfu (dnu) rfu (dnu) GND GPIO25 GND rfu (nc) rfu (nc) rfu (nc) VCORE GND rfu (dnu) rfu (dnu) rfu (dnu) GND EMERG_ RST GPIO21 GPIO7

[PWM1]

GPIO6

[PWM2]

rfu (nc) rfu (nc) rfu (nc) ON GND GND GND GND GND rfu (nc) GPIO22 rfu (dnu) rfu (nc) rfu (nc) rfu (nc) GND GND GND GND GND GND GND GND rfu (dnu) rfu (nc) rfu (nc) SIM_SWITCH

[GPIO8/CNTR.]

GND rfu (dnu) GND GND rfu (nc) GND GND RF_OUT GND GND GND GND rfu (nc) GND SUSPEND _MON rfu

(GNSS_LNA_EN) GNSS _ANT M L K J H G F E D C B Figure 5: TX62/TX82 top view: Pad assignments t TX62-W_TX62-W-B_TX82-W_HID_v00.022a Confidential / Draft 2020-11-18 Cinterion TX62-W(-B)/TX82-W Hardware Interface Description 2.1 Application Interface 65 Page 21 of 144 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 GND rfu (nc) GND GND USB_DP USB_DN GND RXD0 TXD0 CCIO CCIN CC2_IO GND rfu (nc) GND rfu (nc) rfu (nc) rfu (nc) RST0 CTS0 CCVCC CCRST CC2_VCC CC2_RST rfu (nc) rfu (nc) VUSB _IN rfu (dnu) DSR0

[GPIO3]

rfu (nc) STATUS

[GPIO5]

FST_SHDN

[GPIO4]

rfu (nc) RING0

[GPIO24]

DTR0

[GPIO1]

DCD0

[GPIO2]

CCCLK rfu (dnu) CC2_CLK rfu (nc) rfu (nc) rfu (nc) CTS1

[GPIO19/

SPI_CLK]

RXD1

[GPIO16/

MOSI]

GND Reserved for future use rfu (nc) V180 GND CC2_VPP rfu (nc) rfu (nc) rfu (nc) GPIO23

[I2CDAT]

[I2CCLK]

GND BATT+BB BATT+BB rfu (nc) TXD1

[GPIO17/

MISO]

RTS1

[GPIO18/

SPI_CS]

rfu (nc) rfu (dnu) rfu (nc) GPIO20 rfu (nc) GND Marking GND BATT+RF BATT+RF rfu (nc) GND GPIO25 GND rfu (dnu) rfu (dnu) rfu (dnu) GND ADC1 rfu (nc) GND rfu (nc) GPIO6

[PWM2]

GPIO7

[PWM1]

GPIO21 GND rfu (dnu) rfu (dnu) rfu (dnu) GND VCORE rfu (nc) rfu (nc) rfu (nc) EMERG_ RST rfu (dnu) GPIO22 rfu (nc) GND GND GND GND GND ON rfu (nc) rfu (nc) rfu (nc) rfu (nc) rfu (dnu) GND GND GND GND GND GND GND GND rfu (nc) rfu (nc) rfu (nc) SIM_SWITCH

[GPIO8/CNTR.]

GND rfu (nc) GND GND GND GND RF_OUT GND GND rfu (nc) GND GND ADC2 GND SUSPEND _MON rfu

(GNSS_LNA_EN) GNSS _ANT M L K J H G F E D C B Figure 6: TX62/TX82 bottom view: Pad assignments t TX62-W_TX62-W-B_TX82-W_HID_v00.022a Confidential / Draft 2020-11-18 Cinterion TX62-W(-B)/TX82-W Hardware Interface Description 2.1 Application Interface 65 Page 22 of 144 2.1.2 Signal Properties Table 3: Signal properties Function Signal name IO Signal form and level Comment Power supply BATT+BB I Voltage ranges:

TX82-W only:

LTE and GSM:

VImin = 3.1 V...VImax = 4.6V LTE with GSM deactivated VImin = 2.8 V...VImax = 4.6V TX62 only:

LTE:

VImin = 2.55 V...VImax = 4.8V TX62-W-B only:

LTE:

VImin = 2.5 V...VImax = 4.5V TX62-W, TX62-W-B and TX82-W:

VInorm = 3.8V IPower Down = 14A VImax = 4.6V VInorm = 3.8V VImin = 3.1 V during Tx burst on board Imax 2.16A, during Tx burst (GSM) __||____||__ N Tx = n * 577s peak current every 4.616ms BATT+RF GSM activated I Lines of BATT+ and GND must be connected in parallel for supply pur-

poses because higher peak currents may occur. BATT+BB at solder pads needs an additional low ESR 47F capacitor (e.g, X7R MLCC, taking DCbias into account). BATT+RF is only required if GSM is used. In this case BATT+RF at solder pads needs an additional low ESR 150F capacitor

(e.g, X7R MLCC, taking DCbias into account). A minimum ESR value

<70m is recommended. Minimum voltage must not fall below 3.1V

(LTE+GSM, TX82-W) or 2.55V (LTE w/o GSM, TX62-W) or 2.5V (LTE w/

o GSM, TX62-W-B) including GSM drops, rip-

ple, spikes. Else the mod-

ule may perform an uncontrolled shutdown. If using the extended volt-

age range, i.e., down to 2.5V or up to 4.8V, the module remains fully functional and safe while possibly no longer being fully compliant with 3GPP or other wireless stan-

dards. Please note that the module is in this case switched on at a voltage of >2.65V. Please note that if both voltage domains and power supply lines are referred to - i.e., BATT+BB and BATT+RF - BATT+ is used throughout the doc-

ument. t TX62-W_TX62-W-B_TX82-W_HID_v00.022a 2020-11-18 Confidential / Draft Cinterion TX62-W(-B)/TX82-W Hardware Interface Description 2.1 Application Interface 65 Page 23 of 144 Function Signal name IO Signal form and level Comment Ground Application Ground Table 3: Signal properties GND V180 Power supply External supply voltage O Normal operation:

VOnorm = 1.80V 2%

IOmax = 10mA SLEEP mode Operation:

VOSleep = 1.80V 3.7%

IOmax = 10mA V180 has to be used for the power indication cir-

cuit. V180 can also be used to supply level shifters at the interfaces. SUSPEND mode Operation:

VOSuspend = 0V Test point recom-

mended1. VCORE Test point recommended. Clmax = 1F O Normal Operation:

VOnom = 1.128V 2%

IOmax = 10mA SLEEP Mode Operation:

VOsleep = 0.5V...1.304V 3%

IOmax = 10mA SUSPEND Mode Operation:

VOsuspend = 0V Clmax = 100nF VIHmax = BATT+BB VIHmin = 1.3V VILmax = 0.5V rising edge followed by high > 1ms ON ___|

Ignition ON I Status STATUS O VOLmax = 0.45V at I = 4.5 mA VOHmin = 1.20V at I = 2.5 mA VOHmax = 1.95V Fast shut-

down FST_SHDN I VILmax = 0.5V VIHmin = 1.3V VIHmax = 1.95V This signal switches the module on. The ON signal is rising edge triggered. Rise time should be <1ms. Test point recommended. If unused keep lines open. With the embedded pro-

cessing option this line is also available as GPIO:

STATUS --> GPIO5 If unused keep lines open. Fast shutdown period

<15ms. With the embedded pro-

cessing option this line is also available as GPIO:

FST_SHDN --> GPIO4 t TX62-W_TX62-W-B_TX82-W_HID_v00.022a 2020-11-18 Confidential / Draft Cinterion TX62-W(-B)/TX82-W Hardware Interface Description 2.1 Application Interface 65 Page 24 of 144 Table 3: Signal properties Function Signal name Emergency reset EMERG_RST I IO Signal form and level RI 1k, CI 1nF VIHmin = 1.3V VILmax = 0.5V at ~1A

|___| low impulse width > 800ms USB VUSB_IN I VImin = 3V VImax = 5.25V Active and suspend current:

Imax < 100A USB_DN USB_DP I/O Full and high speed signal characteris-

tics according USB 2.0 Specification. Serial Modem Interface ASC0 O VOLmax = 0.45V at I = 4.5 mA VOHmin = 1.20V at I = 2.5 mA VOHmax = 1.95V O RXD0 CTS0 DSR0 DCD0 RING0 TXD0 RTS0 DTR0 O O O I I I VILmax = 0.5V VIHmin = 1.3V VIHmax = 1.95V Serial Modem Interface ASC1 RXD1 CTS1 TXD1 RTS1 O VOLmax = 0.45V at I = 4.5 mA VOHmin = 1.20V at I = 2.5 mA VOHmax = 1.95V O I I VILmax = 0.5V VIHmin = 1.3V VIHmax = 1.95V Comment This line must be driven low by an open drain or open collector driver con-

nected to GND. If unused keep lines open. Test point recommended. All electrical characteris-

tics according to USB Implementers' Forum, USB 2.0 Specification. If unused keep lines open. Used for tracing pur-

poses only. Test points recommended. If unused keep lines open. RTS0 can be used to wakeup the module from SLEEP mode, but not from SUSPEND/PSM mode. Test points recommended for RXD0, TXD0, RTS0, and CTS0. With embedded process-

ing option some ASC0 lines are shared with GPIOs, see Section 2.1.8. If unused keep lines open. Test points recommended for RXD1, TXD1, RTS1, and CTS1. With embedded process-

ing option ASC1 lines are shared with GPIOs, see Section 2.1.8. t TX62-W_TX62-W-B_TX82-W_HID_v00.022a 2020-11-18 Confidential / Draft Cinterion TX62-W(-B)/TX82-W Hardware Interface Description 2.1 Application Interface 65 Page 25 of 144 Table 3: Signal properties Function Signal name IO Signal form and level Comment SIM card detection CCIN I Internal pull down resistor: 100k RI 110k CCIN = High, SIM card inserted. CCVCC 1.8V SIM Card Inter-

face VILmax = 0.5V VIHmin = 1.3V VIHmax = 1.95V O VOmin = 1.5V VOtyp = 1.8V VOmax = 2V IOmax = -60mA CCRST CCCLK CCIO O O VOLmax = 0.45V at I = 4.5 mA VOHmin = 1.20V at I = 2.5 mA VOHmax = 1.95V I/O VOLmax = 0.45V at I = 4.5 mA VOHmin = 1.20V at I = 2.5 mA VOHmax = 1.95V VILmax = 0.5V VIHmin = 1.3V VIHmax = 1.95V If unused keep line open. Maximum cable length or copper track to SIM card holder should not exceed 100mm. For more information on how to connect the SIM interface pads including possible external capaci-

tors and ESD protection please refer to Section 2.1.6. t TX62-W_TX62-W-B_TX82-W_HID_v00.022a 2020-11-18 Confidential / Draft Cinterion TX62-W(-B)/TX82-W Hardware Interface Description 2.1 Application Interface 65 Page 26 of 144 Table 3: Signal properties Function Signal name IO Signal form and level Comment 1.8V eUICC interface CC2_VPP

Used for single wire protocol (SWP NFC) in MFF-XS eUICC. SWP NFC is currently not supported and deacti-

vated for the eUICC. Thus, there are two options:

If an external SWP mas-

ter is connected never-

theless (or for future use) the CC2_VPP line should be pulled up by an exter-

nal 10k resistor to VCC. If there is no plan to use SWP the CC2_VPP line can be grounded. Maximum cable length or copper track should be no longer as 100mm to eUICC interface. The signals CC2_RST, CC2_IO, CC2_CLK and CC2_VCC are protected against ESD with a spe-

cial diode array. If unused keep lines open. CC2_VCC CC2_CLK CC2_RST I I I VImin = 1.62V VItyp = 1.8V VImax = 1.98V VILmax = 0.2*CC2_VCC (at IOLmax = -200A) VILmin = -0.3V (at IOL max = -200A) VIHmax=CC2_VCC+0.3V (at IOHmax =

+20A) VIHmin = 0.8*CC2_VCC (at IOHmax =

+20A) VILmax = 0.2*CC2_VCC (at IOLmax = -20A) VILmin = -0.3V (at IOL max = -20A) VIHmax=CC2_VCC+0.3V (at IOHmax =

+20A) VIHmin = 0.7*CC2_VCC (at IOHmax =

+20A)

+1mA/+20A) VILmin = -0.3V (at IIH = +1mA/+20 A) VIHmin = 0.7*CC2_VCC (at IIH = -20/

+20A) VIHmax = CC2_VCC+0.3V (at IIH = -20/

+20A) VOLmax = 0.15*CC2_VCC

(at IOL = -1mA) VOHmin = 0.7*CC2_VCC (at IIH = -20/

+20A) VOHmax = CC2_VCC+0.3V

(at IIH = -20/+20A) CC2_IO I/O VILmax = 0.2*CC2_VCC (at IIH =

SIM switch SIM_SWITCH O VOLmax = 0.45V at I = 4.5 mA VOHmin = 1.20V at I = 2.5 mA VOHmax = 1.95V If unused keep lines open. With embedded process-

ing option SIM_SWITCH is shared with GPIO8 and COUNTER, see Section 2.1.8. t TX62-W_TX62-W-B_TX82-W_HID_v00.022a 2020-11-18 Confidential / Draft Cinterion TX62-W(-B)/TX82-W Hardware Interface Description 2.1 Application Interface 65 Page 27 of 144 Table 3: Signal properties Function I2C Signal name IO Signal form and level Comment I2CDAT I2CCLK I/O Internal pull up Resistors O I2CCLK = 2k2 I2CDAT = 2k2 VOLmax = 0.45V at Imax = -4.5mA VOHmax = 1.95V VILmax = 0.5V VIHmin = 1.3V VIHmax = 1.95V Note: Imax = I max external + I pull up If unused keep lines open. Compatible with I2C Bus Specification Version 5.0 The value of the pull-up depends on the capaci-

tive load of the whole sys-

tem (I2C Slave + lines). The maximum sink cur-

rent of I2CDAT and I2CCLK is TBD.mA. Only available with embedded processing option. If unused keep lines open. GPIO6 only available on TX82-W and TX62-W-B. Further GPIOs shared with other functions are available with embedded processing option (see Section 2.1.8). Shared with GPIO:

SPI_MOSI --> GPIO16 SPI_MISO --> GPIO17 SPI_CS --> GPIO18 SPI_CLK --> GPIO19 Also shared with ASC1 function (see Section 2.1.8). Only available with embedded process-

ing option. Only available with embedded processing option. Shared with GPIO:

COUNTER --> GPIO8 Only available with embedded processing option. GPIO GPIO6-GPIO7, GPIO20-GPIO23, GPIO25 I/O VOLmax = 0.45V at I = 4.5 mA VOHmin = 1.20V at I = 2.5 mA VOHmax = 1.95V VILmax = 0.5V VIHmin = 1.3V VIHmax = 1.95V SPI SPI_CLK SPI_MOSI SPI_MISO SPI_CS O VOLmax = 0.45V at I = 4.5mA VOHmin = 1.20V at I = 2.5mA VOHmax = 1.95V O I O VILmax = 0.5V VIHmin = 1.3V VIHmax = 1.95V Pulse width modulation interface PWM1 PWM2 O VOLmax = 0.45V at I = 4.5 mA VOHmin = 1.20V at I = 2.5 mA VOHmax = 1.95V Shared with GPIO:

PWM1 --> GPIO7 PWM2 --> GPIO6 Pulse counter COUNTER I Internal up resistor active VILmax = 0.6V at < -30A VIHmin = 1.22V VIHmax = 1.87V t TX62-W_TX62-W-B_TX82-W_HID_v00.022a 2020-11-18 Confidential / Draft Cinterion TX62-W(-B)/TX82-W Hardware Interface Description 2.1 Application Interface 65 Page 28 of 144 Function Signal name IO Signal form and level Comment ADC1 I If unused keep line open. Table 3: Signal properties ADC

(Analog-to-

Digital Con-

verter) RI = 10M VI = 0.1V ... 1.875V (valid range) VIH max = 1.910V Resolution 64.979uV SUSPEND mode indi-

cator SUSPEND_ MON O VOLmax = 0.45V at I = 4.5 mA VOHmin = 1.20V at I = 2.5 mA VOHmax = 1.95V High=Normal mode, Low=SUSPEND mode. If unused keep lines open. 1. Thales strongly recommends to provide test points for certain signal lines to and from the module while developing SMT applications for debug, test and/or trace purposes during the manufacturing process. In this way it is possible to detect soldering (and other) problems. Please refer to [4] and [5] for more in-

formation on test points and how to implement them. The signal lines for which test points should be pro-

vided for are marked as Test point recommended in the above table. t TX62-W_TX62-W-B_TX82-W_HID_v00.022a 2020-11-18 Confidential / Draft Cinterion TX62-W(-B)/TX82-W Hardware Interface Description 2.1 Application Interface 65 Page 29 of 144 2.1.2.1 Absolute Maximum Ratings The absolute maximum ratings stated in Table 4 are stress ratings under any conditions. Stresses beyond any of these limits will cause permanent damage to TX62/TX82. Table 4: Absolute maximum ratings Parameter Supply voltage BATT+BB (no service) Supply voltage BATT+RF (TX82-W only; no service) Voltage at all digital lines in Power Down mode Voltage at digital lines 1.8V domain in normal operation1 Current at digital lines in normal operation Voltage at SIM interface, CCVCC 1.8V in normal operation Current at SIM interface in normal 1.8V operation Voltage at ADC line in normal operation V180 in normal operation Current at V180 in normal operation VCORE in normal operation Current at VCORE in normal operation Voltage at USB lines Min

-0.5

-0.5

-0.5

-0.3

-5

-0.3

-0.5

-0.3

+0.5

-0.5 Max

+6.0

+6.0

+0.5

+2.09

+5

+2.0

-600

+1.910

+2.09

-600

+1.304

-1200 5.75 Unit V V V V V V V V V mA mA mA mA 1. A maximum rating of 1.95V (for VIHmax) is recommended for all digital lines. Exceeding this value how-

ever will not necessarily harm the module as long as the rating remains below the absolute maximum rating of 1.95+0.14V, but it will decrease the safety margin in case of short spikes or ripple. t TX62-W_TX62-W-B_TX82-W_HID_v00.022a 2020-11-18 Confidential / Draft Cinterion TX62-W(-B)/TX82-W Hardware Interface Description 2.1 Application Interface 65 Page 30 of 144 2.1.3 USB Interface TX62/TX82 supports a USB 2.0 High Speed (480Mbit/s) device interface that is Full Speed

(12Mbit/s) compliant. Note: The USB interface is intended for use as a trace interface only. The external application is responsible for supplying the VUSB_IN line. This line is used for ca-

ble detection only. The USB part (driver and transceiver) is supplied by means of BATT+. This is because TX62/TX82 is designed as a self-powered device compliant with the Universal Se-

rial Bus Specification Revision 2.01. Module SMT VREG (3V075) lin. reg. USB part1) VBUS DP DN Detection only RS RS BATT+

GND VUSB_IN USB_DP2) USB_DN2) 1) All serial (including RS) and pull-up resistors for data lines are implemented. 2) If the USB interface is operated in High Speed mode (480MHz), it is recommended to take special care routing the data lines USB_DP and USB_DN. Application layout should in this case implement a differential impedance of 90 ohms for proper signal integrity. Figure 7: USB circuit To properly connect the module's USB interface to the external application, a USB 2.0 compat-

ible connector and cable or hardware design is required. For more information on the USB re-

lated signals see Table 3. Furthermore, the USB modem driver distributed with TX62/TX82 needs to be installed. 1. The specification is ready for download on https://www.usb.org/document-library/usb-20-specification t TX62-W_TX62-W-B_TX82-W_HID_v00.022a 2020-11-18 Confidential / Draft Cinterion TX62-W(-B)/TX82-W Hardware Interface Description 2.1 Application Interface 65 Page 31 of 144 2.1.4 Serial Interface ASC0 TX62/TX82 offers an 8-wire unbalanced, asynchronous modem interface ASC0 conforming to ITU-T V.24 protocol DCE signaling. The electrical characteristics do not comply with ITU-T V.28. The significant levels are 0V (for low data bit or active state) and 1.8V (for high data bit or inactive state). For electrical characteristics please refer to Table 3. For an illustration of the interface lines startup behavior see Figure 9. TX62/TX82 is designed for use as a DCE. Based on the conventions for DCE-DTE connections it communicates with the customer application (DTE) using the following signals:

Port TXD @ application sends data to the modules TXD0 signal line Port RXD @ application receives data from the modules RXD0 signal line Figure 8: Serial interface ASC0 Features:

Includes the data lines TXD0 and RXD0, the status lines RTS0 and CTS0 and, in addition, the modem control lines DTR0, DSR0, DCD0 and RING0. The RING0 signal serves to indicate incoming calls and other types of URCs (Unsolicited Result Code). It can also be used to send pulses to the host application, for example to wake up the application from power saving state. By default configured to 8 data bits, no parity and 1 stop bit. ASC0 can be operated at fixed bit rates from 300bps up to 921,600bps. Supports RTS0/CTS0 hardware flow control as a configuration option (see [1]). The hard-

ware hand shake line RTS0 has an internal pull down resistor causing a low level signal, if the line is not used and open. Although hardware flow control is recommended, this allows communication by using only RXD and TXD lines. Wake up from SLEEP mode by RTS0 activation (high to low transition; see Section 3.3.1.1). t TX62-W_TX62-W-B_TX82-W_HID_v00.022a 2020-11-18 Confidential / Draft Cinterion TX62-W(-B)/TX82-W Hardware Interface Description 2.1 Application Interface 65 Page 32 of 144 The following figure shows the startup behavior of the asynchronous serial interface ASC0. Start up Power supply active Reset state Firmware initialization Command interface initialization Interface active ON VCORE V180 EMERG_RST TXD0 RXD0 RTS0 CTS0 DTR0 DSR0 DCD0 RING0 PD PD PU PD PD PD PD PD PD PD PD For pull-up and pull-down values see Table 13. Figure 9: ASC0 startup behavior t TX62-W_TX62-W-B_TX82-W_HID_v00.022a 2020-11-18 Confidential / Draft Cinterion TX62-W(-B)/TX82-W Hardware Interface Description 2.1 Application Interface 65 Page 33 of 144 2.1.5 Serial Interface ASC1 TX62/TX82 provides a 4-wire unbalanced, asynchronous modem interface ASC1 conforming to ITU-T V.24 protocol DCE signaling. The electrical characteristics do not comply with ITU-T V.28. The significant levels are 0V (for low data bit or active state) and 1.8V (for high data bit or inactive state). For electrical characteristics please refer to Table 3. For an illustration of the interface lines startup behavior see Figure 11. TX62/TX82 is designed for use as a DCE. Based on the conventions for DCE-DTE connections it communicates with the customer application (DTE) using the following signals:

Port TXD @ application sends data to modules TXD1 signal line Port RXD @ application receives data from the modules RXD1 signal line Figure 10: Serial interface ASC1 Features Includes only the data lines TXD1 and RXD1 plus RTS1 and CTS1 for hardware hand-

shake. Configured for 8 data bits, no parity and 1 or 2 stop bits. ASC1 can be operated at fixed bit rates from 300bps to 921,600bps. Supports RTS1/CTS1 hardware flow as a configuration option (see [1]). The hardware hand shake line RTS0 has an internal pull down resistor causing a low level signal, if the line is not used and open. Although hardware flow control is recommended, this allows communi-

cation by using only RXD and TXD lines. t TX62-W_TX62-W-B_TX82-W_HID_v00.022a 2020-11-18 Confidential / Draft Cinterion TX62-W(-B)/TX82-W Hardware Interface Description 2.1 Application Interface 65 Page 34 of 144 The following figure shows the startup behavior of the asynchronous serial interface ASC1. Start up Power supply active Reset state Firmware initialization Command interface initialization Interface active EMERG_RST ON VCORE V180 TXD1 RXD1 RTS1 CTS1 PD PD PD PD PD PD

*) For pull-down values see Table 13. Figure 11: ASC1 startup behavior t TX62-W_TX62-W-B_TX82-W_HID_v00.022a 2020-11-18 Confidential / Draft Cinterion TX62-W(-B)/TX82-W Hardware Interface Description 2.1 Application Interface 65 Page 35 of 144 2.1.6 UICC/SIM/USIM Interface TX62/TX82 has an integrated UICC/SIM/USIM interface compatible with the 3GPP 31.102 and ETSI 102 221. This is wired to the host interface in order to be connected to an external SIM card holder. Five pads on the SMT application interface are reserved for the SIM interface. The UICC/SIM/USIM interface supports 1.8V SIM cards. Please refer to Table 3 for electrical specifications of the UICC/SIM/USIM interface lines. The CCIN signal serves to detect whether a tray (with SIM card) is present in the card holder. Using the CCIN signal is mandatory for compliance with the GSM 11.11 recommendation if the mechanical design of the host application allows the user to remove the SIM card during oper-

ation. To take advantage of this feature, an appropriate SIM card detect switch is required on the card holder. For example, this is true for the model supplied by Molex, which has been test-

ed to operate with TX62/TX82 and is part of the Thales reference equipment submitted for type approval. See Section 7.1 for Molex ordering numbers. Table 5: Signals of the SIM interface (SMT application interface) Signal Description GND Separate ground connection for SIM card to improve EMC. Thales recommends to use pad J16 or pad M17 as ground connection. CCCLK UICC clock CCVCC SIM supply voltage. CCIO Serial data line, input and output. CCRST UICC reset CCIN Input on the baseband processor for detecting a SIM card tray in the holder. If the SIM is removed during operation the SIM interface is shut down immediately to prevent destruc-

tion of the SIM. The CCIN signal is by default low and must change to high level if a SIM card is inserted. The CCIN signal is mandatory for applications that allow the user to remove the SIM card during operation. The CCIN signal is solely intended for use with a SIM card. It must not be used for any other purposes. Failure to comply with this requirement may invalidate the type approval of TX62/TX82. Note: No guarantee can be given, nor any liability accepted, if loss of data is encountered after removing the SIM card during operation. Also, no guarantee can be given for properly initializ-

ing any SIM card that the user inserts after having removed the SIM card during operation. In this case, the application must restart TX62/TX82. t TX62-W_TX62-W-B_TX82-W_HID_v00.022a 2020-11-18 Confidential / Draft Cinterion TX62-W(-B)/TX82-W Hardware Interface Description 2.1 Application Interface 65 Page 36 of 144 The figure below shows a circuit to connect an external SIM card holder. V180 CCIN CCVCC CCRST CCIO CCCLK SIM 220nF2 1nF2 10pF1 ,2 10pF1,2 1 = Optional 10pF for SIM protection for RF blocking (internal antenna) 2 = Capacitors should be placed near to the SIM connector or eUICC Figure 12: External UICC/SIM/USIM card holder circuit The total cable length between the SMT application interface pads on TX62/TX82 and the pads of the external SIM card holder must not exceed 100mm in order to meet the specifications of 3GPP TS 51.010-1 and to satisfy the requirements of EMC compliance. To avoid possible cross-talk from the CCCLK signal to the CCIO signal be careful that both lines are not placed closely next to each other. A useful approach is using a GND line to shield the CCIO line from the CCCLK line. An example for an optimized ESD protection for the SIM interface is shown in Section 2.1.6.1. It is possible to connect the UICC/USIM/SIM interface lines to an external SIM card multiplexer controlled by the modules SIM_SWITCH signal. Thus, it becomes possible to switch between two networks/subscriptions each with its own UICC, and maybe different connection speeds. See also Section 2.1.13.4. t TX62-W_TX62-W-B_TX82-W_HID_v00.022a 2020-11-18 Confidential / Draft Cinterion TX62-W(-B)/TX82-W Hardware Interface Description 2.1 Application Interface 65 Page 37 of 144 2.1.6.1 Enhanced ESD Protection for SIM Interface To optimize ESD protection for the SIM interface it is possible to add ESD diodes (e.g., NUP4114) to the SIM interface lines as shown in the example given in Figure 13. The example was designed to meet ESD protection according ETSI EN 301 489-1/7: Contact discharge: 4kV, air discharge: 8kV. Module CCRST CCCLK CCIO CCVCC CCIN SIM_RST SIM_CLK SIM_IO 6 5 4 1 2 3 GND SIM_VCC SIM_DET Keep SIM lines low capacitative Figure 13: SIM interface - enhanced ESD protection The capacitors shown in Figure 12 must be placed close to the SIM Connector. t TX62-W_TX62-W-B_TX82-W_HID_v00.022a 2020-11-18 Confidential / Draft Cinterion TX62-W(-B)/TX82-W Hardware Interface Description 2.1 Application Interface 65 Page 38 of 144 2.1.7 eUICC Interface As an option TX62/TX82 supports an eUICC in MFF-XS format. This MFF-XS eUICC is located under the shielding, is only connected to specific module pads, and has no physical connec-

tions with other circuits inside the module. Figure 14 shows an example of how to connect the eUICC to the modules SIM interface lines as well as a switch to select whether to use the in-

ternal MFF-XS eUICC or an external plug-in SIM card. Max. distance 10cm SIM card holder Alternatively SIM switch can be bridged 4 4 Module SIM ESD protection

(see 2.1.6.1) SIM lines serial resistors , CCIO pull down resistor, VSIM capacitor 220nF are mounted on the module SIM inserted =>

Switch closed SIMSELECT CC2_VCC capacitor 220nF mounted on the module 4 x 0R SIM switch If 2 If 1 Common FSA2567 VSIM CCIO CCRST CCCLK eUICC CC2_VPP CC2_VCC CC2_IO CC2_RST CC2_CLK SIM_SWITCH to drive SIMSELECT SIM_SWITCH = Low => SIMSELECT = High: SIM connected SIM_SWITCH = High => SIMSELECT = Low: MIM connected VBATT 10k 22k 100k CCIN (Application):

low = > card inserted high => card removed 100k CCIN (Module):

high = > card inserted low => card removed 100k 100p 10k CCIN 100k V180 Figure 14: eUICC interface The eUICC interface comprises five lines (plus ground) as listed below in Table 6. Table 6: Signals of the eUICC interface option (SMT application interface) Signal CC2_RST CC2_CLK CC2_IO CC2_VPP CC2_VCC GND Description Chip Card Reset Chip Card Clock Chip Card I/O (data line)

Operation voltage for SIM Card (=1.8V) eUICC Ground t TX62-W_TX62-W-B_TX82-W_HID_v00.022a 2020-11-18 Confidential / Draft Cinterion TX62-W(-B)/TX82-W Hardware Interface Description 2.1 Application Interface 65 Page 39 of 144 2.1.8 GPIO TX82-W and TX62-W-B have 7 GPIOs (GPIO6-7,20-23,25) and TX62-W has 6 GPIOs

(GPIO7,20-23,25) for external hardware devices. Each GPIO can be configured for use as in-

put or output. All settings are AT command controlled. The configuration is non-volatile and available after module restart. The IO port driver has to be opened before using and configuring GPIOs. Before changing the configuration of a GPIO pin (e.g. input to output) the pin has to be closed. If the GPIO pins are not configured or the pins/driver were closed, the GPIO pins are high-Z with pull down resistor. If a GPIO is configured to input, the pin has high-Z without pull resistor. The following figure shows the start up behavior of the GPIOs interface. Start up Power supply active Reset State Firmware Initialization Command Interface Initialization ON VCORE V180 EMERG_RST CTS0 GPIO6,7,20-23,25 PD High-Z/PD Figure 15: GPIO start up behavior With the embedded processing option of TX62/TX82 additional GPIOs are provided and can be used - see below Section 2.1.8.1. t TX62-W_TX62-W-B_TX82-W_HID_v00.022a 2020-11-18 Confidential / Draft Cinterion TX62-W(-B)/TX82-W Hardware Interface Description 2.1 Application Interface 65 Page 40 of 144 2.1.8.1 GPIOs Available with Embedded Processing Option The embedded processing option of TX62/TX82 provides a GPIO interface with 18 GPIO lines. Most GPIO lines are shared with other interfaces or functions, and are shown in the following table with their default assignments being marked green. Table 7: GPIO lines and alternative assignments Fast Shutdown Status LED PWM Pulse Counter ASC0 ASC1 SPI Sim Switch GPIO4 FST_SHDN Status LED PWM2 PWM1 COUNTER SIM_SWITCH RXD1 MOSI TXD1 MISO RTS1 SPI_CS CTS1 SPI_CLK DTR0 DCD0 DSR0 RING0 GPIO GPIO1 GPIO2 GPIO3 GPIO5 GPIO61 GPIO7 GPIO8 GPIO16 GPIO17 GPIO18 GPIO19 GPIO20 GPIO21 GPIO22 GPIO23 GPIO24 GPIO25 1. Only available with TX82-W and TX62-W-B. After startup, the above mentioned alternative GPIO line assignments can be configured through embedded applications (see [7]). The configuration is non-volatile and available after module restart. t TX62-W_TX62-W-B_TX82-W_HID_v00.022a 2020-11-18 Confidential / Draft Cinterion TX62-W(-B)/TX82-W Hardware Interface Description 2.1 Application Interface 65 Page 41 of 144 2.1.9 I2C Interface The embedded processing option of TX62/TX82 provides an inter-integrated circuit interface. I2C is a serial, 8-bit oriented data transfer bus for bit rates up to 400kbps in Fast mode. It con-

sists of two lines, the serial data line I2CDAT and the serial clock line I2CCLK. The module acts as a single master device, e.g. the clock I2CCLK is driven by the module. I2CDAT is a bi-direc-

tional line. Each device connected to the bus is software addressable by a unique 7-bit ad-

dress, and simple master/slave relationships exist at all times. The module operates as master-

transmitter or as master-receiver. The customer application transmits or receives data only on request of the module. The I2C bus can be configured and activated via embedded application. For more information see [7]. The I2C interface can be powered via the V180 line of TX62/TX82. If connected to the V180 line, the I2C interface will properly shut down when the module enters the Power Down mode. In the application I2CDAT and I2CCLK lines need to be connected to a positive supply voltage via a pull-up resistor. For electrical characteristics please refer to Table 3. Module V180 I2CCLK I2CDAT GND Application p u l l u p R p u l l u p R I2CCLK I2CDAT GND Figure 16: I2C interface connected to V180 Note 1: Good care should be taken when creating the PCB layout of the host application: The traces of I2CCLK and I2CDAT should be equal in length and as short as possible. t TX62-W_TX62-W-B_TX82-W_HID_v00.022a 2020-11-18 Confidential / Draft Cinterion TX62-W(-B)/TX82-W Hardware Interface Description 2.1 Application Interface 65 Page 42 of 144 2.1.10 SPI Interface The embedded processing option of TX62/TX82 provides an SPI interface where four GPIO interface lines can be configured as Serial Peripheral Interface (SPI). The SPI is a synchronous serial interface allowing the module to control external sensors or components. The SPI inter-

face supports only master mode. The transmission rates are up to 6.5Mbit/s. The SPI interface comprises the two data lines MOSI and MISO, the clock line SPI_CLK a well as the chip select line SPI_CS. The GPIO lines are also shared with the ASC1 signal lines as shown in Section 2.1.8.1. The SPI interface can be configured and activated via embedded application. For more infor-

mation see [7]. In general, SPI supports four operation modes. The modes are different in clock phase and clock polarity. The modules SPI mode can be configured via embedded processing option. Make sure the module and the connected slave device works with the same SPI mode. Figure 17 shows the characteristics of the four SPI modes. The SPI modes 0 and 3 are the most common used modes. For electrical characteristics please refer to Table 3. Clock phase SPI MODE 0 SPI MODE 1 l y t i r a o p k c o C l SPI_CS SPI_CLK MOSI MISO SPI_CS SPI_CLK MOSI MISO SPI_CS SPI_CLK MOSI MISO SPI_CS SPI_CLK MOSI MISO Sample Sample SPI MODE 2 SPI MODE 3 Sample Sample Figure 17: Characteristics of SPI modes t TX62-W_TX62-W-B_TX82-W_HID_v00.022a 2020-11-18 Confidential / Draft Cinterion TX62-W(-B)/TX82-W Hardware Interface Description 2.1 Application Interface 65 Page 43 of 144 2.1.11 PWM Interfaces The embedded processing option of TX62/TX82 provides a PWM interface where the GPIO6 and GPIO7 lines can be configured as pulse width modulation lines PWM1 and PWM2. The PWM interface lines can be used, for example, to connect buzzers. The PWM1 line is shared with GPIO7 and the PWM2 line is shared with GPIO6 (for GPIOs see Section 2.1.8.1). GPIO and PWM functionality are mutually exclusive. 2.1.12 Pulse Counter The embedded processing option of TX62/TX82 provides a pulse counter the GPIO8 line can be configured as pulse counter line COUNTER. The pulse counter interface can be used, for example, as a clock (for GPIOs see Section 2.1.8.1). t TX62-W_TX62-W-B_TX82-W_HID_v00.022a 2020-11-18 Confidential / Draft Cinterion TX62-W(-B)/TX82-W Hardware Interface Description 2.1 Application Interface 65 Page 44 of 144 2.1.13 Control Signals 2.1.13.1 Status LED The STATUS line can be configured to drive a status LED that indicates different operating modes of the module. For details on how to configure status signaling please refer to [1]. To take advantage of this function connect an LED to the STATUS line as shown in Figure 18. The sample circuit is not optimized for low current consumption. VCC LED R3 BC847 Based on VCC and current requirement of LED. R1 22k STATUS R2 100k GND GND Figure 18: Status signaling with LED driver 2.1.13.2 Power Indication Circuit In Power Down mode the maximum voltage at any digital or analog interface line must not ex-

ceed +0.3V (see also Section 2.1.2.1). Exceeding this limit for any length of time might cause permanent damage to the module. It is therefore recommended to implement a power indication signal that reports the modules power state and shows whether it is active or in Power Down mode. While the module is in Power Down mode all signals with a high level from an external application need to be set to low state or high impedance state. The sample power indication circuit illustrated in Figure 19 denotes the modules active state with a low signal and the modules Power Down mode with a high signal or high impedance state. The sample circuit is not optimized for low current con-

sumption. t TX62-W_TX62-W-B_TX82-W_HID_v00.022a 2020-11-18 Confidential / Draft Cinterion TX62-W(-B)/TX82-W Hardware Interface Description 2.1 Application Interface 65 Page 45 of 144 k 0 1 External power supply Power indication 22k V180 k 0 0 1 Figure 19: Power indication circuit 2.1.13.3 Fast Shutdown The FST_SHDN line is an active low control signal and must be applied for at least 15 millisec-

onds. It is recommended to keep the FST_SHDN line low until the module has shut down. If unused this line can be left open because of a configured internal pull-up resistor. Before set-

ting the FST_SHDN line to low, the ON signal should be set to low (see Figure 20). Otherwise there might be back powering at the ON line in Power Down mode. A low impulse on the FST_SHDN line starts the fast shutdown procedure (see Figure 20). The fast shutdown procedure still finishes any data activities on the module's flash file system, thus ensuring data integrity, but will no longer deregister gracefully from the network, thus saving the time required for network deregistration. The fast shutdown procedure takes less than 15 milliseconds. A low level of the V180 signal indicates that the module has entered the Power Down mode.No shutdown URCs will be issued with a fast shutdown. t TX62-W_TX62-W-B_TX82-W_HID_v00.022a 2020-11-18 Confidential / Draft Cinterion TX62-W(-B)/TX82-W Hardware Interface Description 2.1 Application Interface 65 Page 46 of 144 BATT+

ON EMERG_RST Fast Shut Down V180

< 15ms Figure 20: Fast shutdown timing Please note that the normal software controlled shutdown via AT^SMSO can also be config-

ured as a fast shutdown, i.e., without network deregistration. For details see [1]. 2.1.13.4 SIM Switch The UICC/USIM/SIM interface lines may be connected to an external SIM card multiplexer con-

trolled by the SIM_SWITCH signal as shown in Figure 21. Thus, it becomes possible to switch between two networks/subscriptions each with their own UICC, and maybe different connec-

tion speeds. Please note that hot SIM insert/removal is only possible on the first SIM interface. Also note that the SIM_SWITCH can be used to switch between a SIM and the embedded op-

tional eUICC interface as described in Section 2.1.7. The SIM_SWITCH signal is controlled by AT command (see [1]).

Figure 21: SIM switch circuit t TX62-W_TX62-W-B_TX82-W_HID_v00.022a 2020-11-18 Confidential / Draft Cinterion TX62-W(-B)/TX82-W Hardware Interface Description 2.1 Application Interface 65 Page 47 of 144 2.1.13.5 SUSPEND Mode Indicator When all conditions for entering into SUSPEND mode are fulfilled, the SUSPEND_MON signal changes from high to low, indicating that the module has entered its SUSPEND mode. When leaving the SUSPEND mode, the URC ^SYSRESUME is triggered, and the SUS-

PEND_MON signal is set to high again. SUSPEND_MON usage can be enabled/disabled by AT command (see [1]: AT^SCFG GPIO/

Mode/Suspend). t TX62-W_TX62-W-B_TX82-W_HID_v00.022a 2020-11-18 Confidential / Draft Cinterion TX62-W(-B)/TX82-W Hardware Interface Description 2.2 RF Antenna Interface 65 Page 48 of 144 2.2 RF Antenna Interface The RF interface has an impedance of 50. TX62/TX82 is capable of sustaining a total mis-

match at the antenna line without any damage, even when transmitting at maximum RF power. The external antenna must be matched properly to achieve best performance regarding radi-

ated power, modulation accuracy and harmonic suppression. Antenna matching networks are not included on the TX62/TX82 module and should be placed in the host application if the an-

tenna does not have an impedance of 50. Regarding the return loss TX62/TX82 provides the following values in the active band:

Table 8: Return loss in the active band State of module Return loss of module Recommended return loss of application Receive Transmit Idle not applicable

> 8dB 5dB

> 12dB

> 12dB not applicable 2.2.1 Antenna Interface Specifications Table 9: RF Antenna interface GSM / LTE1 of TX82-W, and TX62-W Parameter Conditions Min. Typical Max. Unit LTE connectivity (Cat M1) Band 1, 2, 3, 4, 5, 8, 12, 13, 18, 19, 20, 25, 26, 27, 28, 66, 85 TX62-W TX82-W LTE Cat M1:

Receiver Input Sensitivity

@NTNV BW: 5 MHz, UL: Modulation: QPSK; NRB=6;

DL: Modulation: QPSK; NRB=4;

LTE 2100 Band 1 LTE 1800 Band 2 LTE 1900 Band 3

-103

-101

-100 LTE AWS-1 Band 4 -103

-107

-107

-107

-107 LTE 850 Band 5

-101.5 -107.5 LTE 900 Band 8

-100.5 -107 LTE 700 Band 12 LTE 700 Band 13 LTE 800 Band 18 LTE 800 Band 19

-100

-100

-103

-103

-107

-107

-107.5

-107.5 LTE 800 Band 20

-100.5 -107 LTE 1900 Band 25

-101

-107.5 LTE 800 Band 26

-101

-107.5 LTE 800 Band 27

-101.5 -107.5 LTE 700 Band 28

-101.5 -107.5 LTE AWS-3 Band 66 -99 LTE 700 Band 85

-99.2

-107

-107

-106

-106

-105.5

-106

-106

-106.5

-106.3

-106.3

-106.2

-106

-106

-106.2

-106.3

-106

-106

-106

-106 dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm t TX62-W_TX62-W-B_TX82-W_HID_v00.022a 2020-11-18 Confidential / Draft Cinterion TX62-W(-B)/TX82-W Hardware Interface Description 2.2 RF Antenna Interface 65 Page 49 of 144 Table 9: RF Antenna interface GSM / LTE1 of TX82-W, and TX62-W Parameter Conditions Min. Typical Max. Unit TX62-W TX82-W LTE Cat M1:

Power @ ARP with 50 Load, NTNV BW: 5 MHz, UL: Modulation: QPSK; NRB=1;

LTE 2100 Band 1 LTE 1800 Band 2 LTE 1900 Band 3 LTE AWS-1 Band 4 +18

+18

+18

+18

+18

+18

+18

+18

+18

+18

+18

+18

+18

+18

+18

+20

+20

+20

+20

+20

+20

+20

+20

+20

+20

+20

+20

+20

+20

+20

+20

+20 LTE 850 Band 5 LTE 900 Band 8 LTE 700 Band 12 LTE 700 Band 13 LTE 800 Band 18 LTE 800 Band 19 LTE 800 Band 20 LTE 1900 Band 25 LTE 800 Band 26 LTE 800 Band 27 LTE 700 Band 28 LTE AWS-3 Band 66 +18 LTE 700 Band 85

+18 LTE 2100 Band 1

-108.2 -115 LTE 1800 Band 2

-108.2 -115.5 LTE 1900 Band 3

-108.2 -114.5 LTE AWS-1 Band 4 -108.2 -115 LTE 900 Band 8

-108.2 -115.5 LTE 700 Band 12

-108.2 -116 LTE 700 Band 13

-108.2 -116 LTE 800 Band 18

-108.2 -115.5 LTE 850 Band 5

-108.2 -116

-114.5 LTE 800 Band 19

-108.2 -115.5

-114.5 LTE 800 Band 20

-108.2 -115.5

-115 LTE 1900 Band 25

-108.2 -115.5

-114.5 LTE 800 Band 26

-108.2 -116 LTE 700 Band 28

-108.2 -116 LTE AWS-3 Band 66 -108.2 -115.5 LTE 600 Band 71

-108.2 -116 LTE 700 Band 85

-108.2 -116

-115.5

+20

+20

+20

+20

+20

+20

+20

+20

+20

+20

+20

+20

+20

+20

+20

+20

+20

-114

-114

-114

-114

-115

-115

-115

-115

-115

-115

-114

-115 dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm LTE connectivity (Cat NB1/2) Band 1, 2, 3, 4, 5, 8, 12, 13, 18, 19, 20, 25, 26, 28, 66, 71, 85 LTE Cat NB1/2:

Receiver Input Sensitivity

@NTNV DL: Modulation: QPSK; Subcar-

riers: 12;

UL: Modulation: BPSK; Subcar-

rier spacing: 15KHz; Ntones: 1@0 t TX62-W_TX62-W-B_TX82-W_HID_v00.022a 2020-11-18 Confidential / Draft Cinterion TX62-W(-B)/TX82-W Hardware Interface Description 2.2 RF Antenna Interface 65 Page 50 of 144 Table 9: RF Antenna interface GSM / LTE1 of TX82-W, and TX62-W Parameter Conditions Min. Typical Max. Unit TX62-W TX82-W LTE Cat NB1/2:

Power @ ARP with 50 Load, NTNV Configuration ID: 1, UL: Modulation: BPSK; Subcar-

rier: 1;Subcarrier space: 3.75 kHz; Ntones: 1@0 LTE AWS-1 Band 4 +18 LTE 2100 Band 1 LTE 1800 Band 2 LTE 1900 Band 3 LTE 850 Band 5 LTE 900 Band 8 LTE 700 Band 12 LTE 700 Band 13 LTE 800 Band 18 LTE 800 Band 19 LTE 800 Band 20 LTE 1900 Band 25 LTE 800 Band 26 LTE 700 Band 28 LTE AWS-3 Band 66 +18 LTE 600 Band 71 LTE 700 Band 85

+18

+18

+18

+18

+18

+18

+18

+18

+18

+18

+18

+18

+18

+18

+18

+20

+20

+20

+20

+20

+20

+20

+20

+20

+20

+20

+20

+20

+20

+20

+20

+20 GPRS coding schemes Class 10, CS1 to CS4 EGPRS GSM Class Class 10, MCS1 to MCS9 Small MS GPRS Static Receiver input Sensitivity @ PDTCH/CS-1 GSM 850/900 GSM 1800/1900

-104

-104 GSM 850/900 GPRS, 1 TX RF Power @

ARP with 50 Load,

(ROPR = 4, i.e. no reduction) GSM 1800/1900 GPRS, 1 TX GPRS, 2 TX EDGE, 1 TX EDGE, 2TX GPRS, 2 TX EDGE, 1 TX EDGE, 2TX

+20

+20

+20

+20

+20

+20

+20

+20

+20

+20

+20

+20

+20

+20

+20

+20

+20

-110

-109 32.5 32.5 27.0 27.0 29.5 29.5 26.0 26.0 dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm t TX62-W_TX62-W-B_TX82-W_HID_v00.022a 2020-11-18 Confidential / Draft Cinterion TX62-W(-B)/TX82-W Hardware Interface Description 2.2 RF Antenna Interface 65 Page 51 of 144 Table 9: RF Antenna interface GSM / LTE1 of TX82-W, and TX62-W Parameter Conditions Min. Typical Max. Unit TX62-W TX82-W GSM 850/900 GPRS, 1 TX RF Power @

ARP with 50 Load,

(ROPR = 5) GSM 1800/1900 GPRS, 1 TX GSM 850/900 GPRS, 1 TX RF Power @

ARP with 50 Load,

(ROPR = 6) GSM 1800/1900 GPRS, 1 TX GSM 850/900 GPRS, 1 TX RF Power @

ARP with 50 Load,

(ROPR = 7) GSM 1800/1900 GPRS, 1 TX RF Power @

ARP with 50 Load,

(ROPR = 8, i.e. maximum reduction) GSM 850/900 GPRS, 1 TX GSM 1800/1900 GPRS, 1 TX GPRS, 2 TX EDGE, 1 TX EDGE, 2TX GPRS, 2 TX EDGE, 1 TX EDGE, 2TX GPRS, 2 TX EDGE, 1 TX EDGE, 2TX GPRS, 2 TX EDGE, 1 TX EDGE, 2TX GPRS, 2 TX EDGE, 1 TX EDGE, 2TX GPRS, 2 TX EDGE, 1 TX EDGE, 2TX GPRS, 2 TX EDGE, 1 TX EDGE, 2TX GPRS, 2 TX EDGE, 1 TX EDGE, 2TX 1. GSM (2G) only supported by TX82-W. 32.5 23.5 27.0 27.0 29.5 29.5 26.0 26.0 32.5 31.5 27.0 27.0 29.5 28.5 26.0 26.0 32.5 29.5 27.0 27.0 29.5 26.5 26.0 26.0 32.5 29.5 27.0 24.0 29.5 26.5 26.0 23.0 dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm t TX62-W_TX62-W-B_TX82-W_HID_v00.022a 2020-11-18 Confidential / Draft Cinterion TX62-W(-B)/TX82-W Hardware Interface Description 2.2 RF Antenna Interface 65 Page 52 of 144 Table 10: RF Antenna interface LTE of TX62-W-B Parameter Conditions Min. Typical Max. Unit LTE connectivity (Cat M1) Band 1, 2, 3, 4, 5, 8, 12, 13, 18, 19, 20, 25, 26, 27, 28, 66, 85 LTE Cat M1:

Receiver Input Sensitivity

@NTNV BW: 5 MHz, UL: Modulation: QPSK; NRB=6;

DL: Modulation: QPSK; NRB=4;

LTE 2100 Band 1 LTE 1800 Band 2 LTE 1900 Band 3 LTE AWS-1 Band 4 LTE 850 Band 5 LTE 900 Band 8 LTE 700 Band 12 LTE 700 Band 13 LTE 800 Band 18 LTE 800 Band 19 LTE 800 Band 20 LTE 1900 Band 25 LTE 800 Band 26 LTE 800 Band 27 LTE 700 Band 28 LTE AWS-3 Band 66 LTE 700 Band 85 LTE 2100 Band 1 LTE 1800 Band 2 LTE 1900 Band 3 LTE AWS-1 Band 4 LTE 850 Band 5 LTE 900 Band 8 LTE 700 Band 12 LTE 700 Band 13 LTE 800 Band 18 LTE 800 Band 19 LTE 800 Band 20 LTE 1900 Band 25 LTE 800 Band 26 LTE 800 Band 27 LTE 700 Band 28 LTE AWS-3 Band 66 LTE 700 Band 85

-103

-101

-100

-103

-100

-100

-103

-103

-101

-101

+21

+21

+21

+21

+21

+21

+21

+21

+21

+21

+21

+21

+21

+21

+21

+21

+21

-101.5

-106.5

-100.5

-106.3

-100.5

-105.5

-101.5

-106.4

-101.5

-105.8

-99

-99.2

-106.2

-105.6

-106.5

-106.3

-105.7

-106.3

-105.7

-106

-106.5

-106.5

-106.2

-106.5

+23

+23

+23

+23

+23

+23

+23

+23

+23

+23

+23

+23

+23

+23

+23

+23

+23 dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm LTE Cat M1:

Power @ ARP with 50 Load, NTNV BW: 5 MHz, UL: Modulation: QPSK; NRB=1;

t TX62-W_TX62-W-B_TX82-W_HID_v00.022a 2020-11-18 Confidential / Draft Cinterion TX62-W(-B)/TX82-W Hardware Interface Description 2.2 RF Antenna Interface 65 Page 53 of 144 Table 10: RF Antenna interface LTE of TX62-W-B Parameter Conditions Min. Typical Max. Unit LTE connectivity (Cat NB1/2) Band 1, 2, 3, 4, 5, 8, 12, 13, 18, 19, 20, 25, 26, 28, 66, 71, 85 LTE Cat NB1/2:

Receiver Input Sensitivity

@NTNV DL: Modulation: QPSK; Subcar-

riers: 12;

UL: Modulation: BPSK; Subcar-

rier spacing: 15KHz; Ntones: 1@0 LTE AWS-1 Band 4

-108.2

-114.5 LTE 2100 Band 1 LTE 1800 Band 2 LTE 1900 Band 3 LTE 850 Band 5 LTE 900 Band 8 LTE 700 Band 12 LTE 700 Band 13 LTE 800 Band 18 LTE 800 Band 19 LTE 800 Band 20 LTE 1900 Band 25 LTE 800 Band 26 LTE 700 Band 28 LTE AWS-3 Band 66 LTE 600 Band 71 LTE 700 Band 85 LTE 2100 Band 1 LTE 1800 Band 2 LTE 1900 Band 3 LTE AWS-1 Band 4 LTE 850 Band 5 LTE 900 Band 8 LTE 700 Band 12 LTE 700 Band 13 LTE 800 Band 18 LTE 800 Band 19 LTE 800 Band 20 LTE 1900 Band 25 LTE 800 Band 26 LTE 700 Band 28 LTE AWS-3 Band 66 LTE 600 Band 71 LTE 700 Band 85

-108.2

-114

-108.2

-114.3

-108.2

-114

-108.2

-108.2

-115

-115

-108.2

-115.5

-108.2

-115.5

-108.2

-115.5

-108.2

-108.2

-108.2

-108.2

-108.2

-108.2

-108.2

-108.2

+21

+21

+21

+21

+21

+21

+21

+21

+21

+21

+21

+21

+21

+21

+21

+21

+21

-115

-115

-115

-114

-115

-114

-115

-115

+23

+23

+23

+23

+23

+23

+23

+23

+23

+23

+23

+23

+23

+23

+23

+23

+23 dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm LTE Cat NB1/2:

Power @ ARP with 50 Load, NTNV Configuration ID: 1, UL: Modulation: BPSK; Subcar-

rier: 1;Subcarrier space: 3.75 kHz; Ntones: 1@0 t TX62-W_TX62-W-B_TX82-W_HID_v00.022a 2020-11-18 Confidential / Draft Cinterion TX62-W(-B)/TX82-W Hardware Interface Description 2.2 RF Antenna Interface 65 Page 54 of 144 2.2.2 Antenna Installation The antennas is connected by soldering the antenna pads (RF_OUT, ANT_GNSS) and its neighboring ground pads directly to the applications PCB. Marking GND GND GND GND RF_OUT ANT_GNSS Figure 22: Antenna pads (top view) The distance between the antenna pads and their neighboring GND pads has been optimized for best possible impedance. On the application PCB, special attention should be paid to these pads, in order to prevent mismatch. The wiring of the antenna connection line, starting from the antenna pad to the application an-

tenna should result in a 50 line impedance. Line width and distance to the GND plane needs to be optimized with regard to the PCBs layer stack. Some examples are given in Section 2.2.3. To prevent receiver desensitization due to interferences generated by fast transients like high speed clocks on the application PCB, it is recommended to realize the antenna connection line using embedded Stripline rather than Micro-Stripline technology. Please see Section 2.2.3.1 for an example.1 For type approval purposes, the use of a 50 coaxial antenna connector (U.FL-R-SMT) might be necessary. In this case the U.FL-R-SMT connector should be placed as close as possible to TX62/TX82s antenna pad. 1. Please note that because of KDB 447498.GNSS, it is required to get a dedicated FCC ID, if using a PCB printed antenna. t TX62-W_TX62-W-B_TX82-W_HID_v00.022a 2020-11-18 Confidential / Draft Cinterion TX62-W(-B)/TX82-W Hardware Interface Description 2.2 RF Antenna Interface 65 Page 55 of 144 2.2.3 RF Line Routing Design 2.2.3.1 Line Arrangement Examples Several dedicated tools are available to calculate line arrangements for specific applications and PCB materials - for example from http://www.polarinstruments.com/ (commercial software) or from http://web.awrcorp.com/Usa/Products/Optional-Products/TX-Line/ (free software). Embedded Stripline This figure below shows a line arrangement example for embedded stripline with 65m FR4 prepreg (type: 1080) and 710m FR4 core (4-layer PCB). Figure 23: Embedded Stripline with 65m prepreg (1080) and 710m core t TX62-W_TX62-W-B_TX82-W_HID_v00.022a 2020-11-18 Confidential / Draft Cinterion TX62-W(-B)/TX82-W Hardware Interface Description 2.2 RF Antenna Interface 65 Page 56 of 144 Micro-Stripline This section gives two line arrangement examples for micro-stripline. Micro-Stripline on 1.0mm Standard FR4 2-Layer PCB The following two figures show examples with different values for D1 (ground strip separa-

tion). Application board Ground line Antenna line Ground line Figure 24: Micro-Stripline on 1.0mm Standard FR4 2-layer PCB - example 1 t TX62-W_TX62-W-B_TX82-W_HID_v00.022a 2020-11-18 Confidential / Draft Cinterion TX62-W(-B)/TX82-W Hardware Interface Description 2.2 RF Antenna Interface 65 Page 57 of 144 Application board Ground line Antenna line Ground line Figure 25: Micro-Stripline on 1.0mm Standard FR4 2-layer PCB - example 2 t TX62-W_TX62-W-B_TX82-W_HID_v00.022a 2020-11-18 Confidential / Draft Cinterion TX62-W(-B)/TX82-W Hardware Interface Description 2.2 RF Antenna Interface 65 Page 58 of 144 Micro-Stripline on 1.5mm Standard FR4 2-Layer PCB The following two figures show examples with different values for D1 (ground strip separa-

tion). Application board Ground line Antenna line Ground line Figure 26: Micro-Stripline on 1.5mm Standard FR4 2-layer PCB - example 1 t TX62-W_TX62-W-B_TX82-W_HID_v00.022a 2020-11-18 Confidential / Draft Cinterion TX62-W(-B)/TX82-W Hardware Interface Description 2.2 RF Antenna Interface 65 Page 59 of 144 Application board Ground line Antenna line Ground line Figure 27: Micro-Stripline on 1.5mm Standard FR4 2-layer PCB - example 2 t TX62-W_TX62-W-B_TX82-W_HID_v00.022a 2020-11-18 Confidential / Draft Cinterion TX62-W(-B)/TX82-W Hardware Interface Description 2.2 RF Antenna Interface 65 Page 60 of 144 2.2.3.2 Routing Example Interface to RF Connector Figure 28 shows the connection of the modules antenna pad with an application PCBs coaxial antenna connector. Please note that the TX62/TX82 bottom plane appears mirrored, since it is viewed from TX62/TX82 top side. By definition the top of customer's board shall mate with the bottom of the TX62/TX82 module. Figure 28: Routing to applications RF connector - top view t TX62-W_TX62-W-B_TX82-W_HID_v00.022a 2020-11-18 Confidential / Draft Cinterion TX62-W(-B)/TX82-W Hardware Interface Description 2.3 GNSS Interface 65 Page 61 of 144 2.3 GNSS Interface 2.3.1 GNSS Receiver TX62/TX82 integrates a GNSS receiver that offers the full performance of GPS/GLONASS/Bei-

Dou/Galileo technology. The GNSS receiver is able to continuously track all satellites in view, thus providing accurate satellite position data. The integrated GNSS receiver supports the NMEA protocol via ASC0 interface. NMEA is a combined electrical and data specification for communication between various (marine) elec-

tronic devices including GNSS receivers. It has been defined and controlled by the US based National Marine Electronics Association. For more information on the NMEA Standard please refer to http://www.nmea.org. Depending on the receivers knowledge of last position, current time and ephemeris data, the receivers startup time (i.e., TTFF = Time-To-First-Fix) may vary: If the receiver has no knowl-

edge of its last position or time, a startup takes considerably longer than if the receiver still has knowledge of its last position, time and almanac or has still access to valid ephemeris data and the precise time. For more information see Section 2.3.3. Often, 2D measurements will be used over 3D depending on space vehicle (SV) locations as this will be just as accurate and faster. By default, the GNSS receiver is switched off. It has to be switched on and configured using AT commands (AT^SGPSC; see [1]). Please note that concurrent GNSS and GSM/LTE oper-

ations are not supported (AT^SCFG= "MEopMode/RscMgmt/Rrc"; see [1]). 2.3.2 GNSS Antenna In addition to the RF antenna interface TX62/TX82 also has a GNSS antenna interface. See Section 2.1.1 to find out where the GNSS antenna pad is located. The GNSS installation is the same as for the RF antenna interface - see Section 2.2.2. It is possible to connect active or passive GNSS antennas. In either case the antennas must have 50 impedance. Please note that if an active GNSS antenna is selected, the voltage for it has to be supplied by the external application, and a capacitor must be added to avoid voltage back-feeding (see Figure 29). If a passive GNSS antenna is selected, this capacitor is optional. Module Application GNSS Receiver Antenna Matching GNSS_ANT RF DC DC LNA Active GNSS Antenna 10n 47p Active GNSS antenna power supply

(Voltage depends on antenna type) Figure 29: Sample supply voltage circuit for active GNSS antenna t TX62-W_TX62-W-B_TX82-W_HID_v00.022a 2020-11-18 Confidential / Draft Cinterion TX62-W(-B)/TX82-W Hardware Interface Description 2.3 GNSS Interface 65 Page 62 of 144 2.3.3 GNSS Antenna Interface Characteristics (TBD.) Table 11: GNSS properties Parameter Conditions Min. Typical Max. Unit Horizontal accuracy 50% CEP, open sky Maximal update rate Frequency Tracking Sensitivity 3 1 m Hz 1573.397 1575.420 1576.443 MHz 1598.563 1602.563 1606.563 1559.052 1561.098 1563.144 1573.397 1575.420 1576.443

-162 dBm Acquisition Sensitivity

-159. dBm Time-to-First-Fix (TTFF)1 Hot (average at -130dBm) Cold (average at -130dBm) 3 35 s s 1. Test conditions: open sky environment GPS GLONASS Beidou Galileo Open sky Active antenna or LNA Passive antenna:

GPS GLONASS Beidou Galileo Open sky Active antenna or LNA Passive antenna:

GPS GLONASS Beidou Galileo t TX62-W_TX62-W-B_TX82-W_HID_v00.022a 2020-11-18 Confidential / Draft Cinterion TX62-W(-B)/TX82-W Hardware Interface Description 2.4 Sample Application 65 Page 63 of 144 2.4 Sample Application Figure 30 shows a typical example of how to integrate a TX62/TX82 module with an applica-

tion. Usage of the various host interfaces depends on the desired features of the application. Note that the sample application is not optimized for low current consumption. Because of the very low power consumption design, current flowing from any other source into the module circuit must be avoided, for example reverse current from high state external control lines. Therefore, the controlling application must be designed to prevent reverse current flow. Otherwise there is the risk of undefined states of the module during startup and shutdown or even of damaging the module. Because of the high RF field density inside the module, it cannot be guaranteed that no self interference might occur, depending on frequency and the applications grounding concept. The potential interferers may be minimized by placing small capacitors (47pF) at suspected lines

(e.g. RXD0, TXD0, and ON). While developing SMT applications it is strongly recommended to provide test points for certain signals, i.e., lines to and from the module - for debug and/or test purposes. The SMT application should allow for an easy access to these signals. For details on how to implement test points see [4] and [5]. Possible test points are mentioned in Sec-

tion 2.1.2. The EMC measures are best practice recommendations. In fact, an adequate EMC strategy for an individual application is very much determined by the overall layout and, especially, the po-

sition of components. For example, mounting the internal acoustic transducers directly on the PCB eliminates the need to use the ferrite beads shown in the sample schematic. Depending on the micro controller used by an external application TX62/TX82s digital input and output lines may require level conversion. Section 2.4.1 shows a possible sample level conversion circuit. Disclaimer No warranty, either stated or implied, is provided on the sample schematic diagram shown in Figure 30 and the information detailed in this section. Functionality and compliance with nation-

al regulations depend to a great amount on the used electronic components, and the individual application layout manufacturers are required to ensure adequate design and operating safe-

guards for their products using TX62/TX82 modules. Because of the number of frequencies used it is recommended to involve antenna vendors already quite early to maximize perfor-

mance of the external applications layout. t TX62-W_TX62-W-B_TX82-W_HID_v00.022a 2020-11-18 Confidential / Draft Cinterion TX62-W(-B)/TX82-W Hardware Interface Description 2.4 Sample Application 65 Page 64 of 144 BATT+BB 150K 22K RF*

ON TXx2-W GND RF_OUT ESD**

GND GND GND ANT_GNSS ESD**

Main antenna GNSS antenna RF*

100K EMERG_RST BATT+RF PWR_IND RF*

RF*

V180 VCORE 22k 100k BATT+BB BEAD*

33pF Power supply 33pF 150F , Low ESR!

47F, Low ESR!

Low ESR!, e.g., X7R MLCC BEAD*: It is recommended toadd the BEAD as shown to theBATT+BB line. The purpose ofthis is to mitigate noise from baseband power supply. Note 1: BLM15PD121SN1D MURATA Ind Chip Bead(120Ohm 25% 100MHz Ferrite 1.3A) is recom-

mended in thiscase. For details please visit www.murata.com. Note 2: The Bead should beplaced as close as possible tothe module. FST_SHDWN STATUS SUSPEND_MON GPIO6,7,20-23,25 l i B o c k n g

LED 3 4 8 USB ASC1 ASC0 Blocking****

Blocking****

MIM

(optional ) CC2_VPP CC2_VCC CC2_IO CC2_RST CC2_CLK CCIN VSIM CCIO CCRST CCCLK

***** Add optional 10pF for SIM protection against RF (internal Antenna) V180 10pF***** 10pF*****

SIM 220nF 1nF All SIM components should be close to card holder. GND Keep SIM wires low capacitive. Enhanced ESD ***

RF* = Optional 47pF against self-interference. See also Section 3.7 for measures against RF interference ESD** = ESD protection for RF antenna interface. For more details see Section 3.6.1 Enhanced ESD*** = Enhanced ESD protection for SIM interface. For more details see Section 2.1.6.1 Blocking**** = For more details see Section 3.7 Figure 30: Schematic diagram of TX62/TX82 sample application t TX62-W_TX62-W-B_TX82-W_HID_v00.022a 2020-11-18 Confidential / Draft Cinterion TX62-W(-B)/TX82-W Hardware Interface Description 2.4 Sample Application 65 Page 65 of 144 2.4.1 Sample Level Conversion Circuit Depending on the micro controller used by an external application TX62/TX82s digital input and output lines (i.e., ASC0, ASC1) may require level conversion. The following Figure 31 shows a sample circuit with recommended level shifters for an external applications micro con-

troller (with VLOGIC between 3.0V...3.6V). The level shifters can be used for digital input and output lines with VOHmax=1.85V or VIHmax =1.85V. The sample circuit is not optimized for low current consumption. External application VLOGIC

(3.0V...3.6V) Input lines, e.g., RXD, CTS VCC Low level input Low level input Low level input VCC Micro controller E.g., 74VHC1GT50 74LV1T34 Output lines, e.g., TXD, RTS Wireless module Digital output lines, e.g., RXDx, CTSx V180 (1.8V) Digital input lines, e.g., TXDx, RTSx 5V tolerarant 5V tolerant E.g., 74LVC2G34 NC7WZ16 Figure 31: Sample level conversion circuit t TX62-W_TX62-W-B_TX82-W_HID_v00.022a 2020-11-18 Confidential / Draft Cinterion TX62-W(-B)/TX82-W Hardware Interface Description 3 Operating Characteristics 104 Page 66 of 144 3 Operating Characteristics 3.1 Operating Modes The table below briefly summarizes the various operating modes referred to throughout the document. Table 12: Overview of operating modes Mode Function Normal operation Data transfer Idle SLEEP1 GSM/(E)GPRS/LTE M1 NB1/2 data transfer in progress. Software and interfaces are active and ready to send and receive, but no GSM/(E)GPRS/LTE M1 NB1/2 data transfer is currently in progress. Low power mode when no call is in progress and there is no active communication on any serial interface (ASC0, ASC1). During SLEEP mode, the module is in a low power consumption state depending on paging cycles based on network defined DRX values, and optionally network negotiated eDRX (extended DRX) as well as 3GPP PSM values. The firmware is active to a minimum extent, and preserves the state it was in before entering the SLEEP mode. The module stays registered to the network. SLEEP mode option can be enabled/disabled by AT command (see : AT^SCFG parameter MEopMode/PwrSave). SUSPEND1 Low power mode when almost all components are switched off - except for the internal RTC and interrupt triggered wake up mechanisms. The module keeps reg-

istered to the network. The module is in its lowest power consumption state. The module can only be woken up by the ON or EMERG_RST signal, or it may wake up and be reachable again after expiration of a 3GPP PSM (Power Saving Mode) periodic TAU cycle (i.e., network timer) that may include DRX and/or eDRX paging cycles for a certain inactivity period. The module wakes up with its signal states being the same as for the first startup configuration, and does not preserve the sig-

nal states it had in before entering SUSPEND mode. The SUSPEND mode option can be enabled/disabled by AT commands (see MEopMode/PowerMgmt/Suspend). Airplane Restricted operating mode where the modules radio part is shut down, causing the module to log off from the GSM/(E)GPRS/LTE M1 NB1/2 network, and to disable all AT commands whose execution requires a radio connection. Airplane mode can be controlled by AT command (see : AT+CFUN). POWER DOWN State after normal shutdown by sending the switch off command (see : AT^SMSO). Software is not active. Interfaces are not accessible. Operating voltage remains applied. 1. For details on the modules low power modes and their configuration, please refer to Section 3.3. t TX62-W_TX62-W-B_TX82-W_HID_v00.022a 2020-11-18 Confidential / Draft Cinterion TX62-W(-B)/TX82-W Hardware Interface Description 3.2 Power Up/Power Down Scenarios 104 Page 67 of 144 3.2 Power Up/Power Down Scenarios Do not turn on TX62/TX82 while it is beyond the safety limits of voltage stated in Section 2.1.2.1. TX62/TX82 immediately switches off after having started and detected these inappro-

priate conditions. In extreme cases this can cause permanent damage to the module. 3.2.1 Turn on TX62/TX82 TX62/TX82 can be turned on as described in the following sections:

Hardware driven switch on by ON signal: Starts Normal mode (see Section 3.2.1.1). After startup or restart, a high level of the V180 and VCORE lines, as well as the URC ^SYS-

START send by the module indicate that the module has started up (again). The URC notifies the host application that the first AT command can be sent to the module (see also [1]). 3.2.1.1 Switch on TX62/TX82 Using ON Signal The ON signal switches the module on, if the module is in POWER DOWN mode (or in SUS-

PEND mode - see Section 3.3.1). This signal is a rising edge sensitive signal. The maximum input voltage can be BATT+. The module starts in the operating mode with a rising edge signal at the ON signal. The following Figure 32 and Figure 33 show the recommended power on circuit and the start-

up timings if ON valid. VBATT+

R1 R2 ON IGT Figure 32: Sample ON circuit t TX62-W_TX62-W-B_TX82-W_HID_v00.022a 2020-11-18 Confidential / Draft Cinterion TX62-W(-B)/TX82-W Hardware Interface Description 3.2 Power Up/Power Down Scenarios 104 Page 68 of 144 BATT+

ON VCORE V180 EMERG_RST

~22ms

~21ms

>1ms

>1ms Only rising edge starts up the module Figure 33: ON startup timing t TX62-W_TX62-W-B_TX82-W_HID_v00.022a 2020-11-18 Confidential / Draft Cinterion TX62-W(-B)/TX82-W Hardware Interface Description 3.2 Power Up/Power Down Scenarios 104 Page 69 of 144 3.2.2 Restart TX62/TX82 After startup TX62/TX82 can be re-started as described in the following sections:

Software controlled reset by AT+CFUN command: Starts Normal mode (see Section 3.2.2.1). Hardware controlled reset by EMERG_RST line: Starts Normal mode (see Section 3.2.2.2) 3.2.2.1 Restart TX62/TX82 via AT+CFUN Command To reset and restart the TX62/TX82 module use the command AT+CFUN. See for details. 3.2.2.2 Restart TX62/TX82 Using EMERG_RST The EMERG_RST signal is internally connected to the central processor. A low level >800ms sets the processor and all signals to their respective reset states, and thus restarts the module. The reset state is described in Section 3.2.3 as well as in the figures showing the startup be-

havior of an interface. Please note that if the EMERG_RST signal is not released, i.e., changed from low to high, after a restart, the module will be repeatedly restarted. Ignition System started Reset State System started again BATT+

ON VCORE V180 EMERG_RST

~800ms

>800ms Figure 34: Emergency restart timing It is strongly recommended to control this EMERG_RST line with an open collector transistor or an open drain field-effect transistor. Caution: Use the EMERG_RST line only when, due to serious problems, the software is not responding for more than 5 seconds. Pulling the EMERG_RST line causes the loss of all infor-

mation stored in the volatile memory. Therefore, this procedure is intended only for use in case of emergency, e.g. if TX62/TX82 does not respond, if reset or shutdown via AT command fails. t TX62-W_TX62-W-B_TX82-W_HID_v00.022a 2020-11-18 Confidential / Draft Cinterion TX62-W(-B)/TX82-W Hardware Interface Description 3.2 Power Up/Power Down Scenarios 104 Page 70 of 144 3.2.3 Signal States after Startup Table 13 describes various states interface signals pass through after startup until the system is active. Signals are in an initial state while the module is initializing. Once the startup initialization has completed, i.e. when the software is running, all signals are in a defined state, the module is ready to receive and transmit data. The state of some signals may change again once a re-

spective interface is activated or configured by AT command. For details on certain other signal state changes during startup see also Section 3.2.1 (ON, VCORE, V180), Section 3.2.2

(EMERG_RST), and Section 2.1.4 (ASC0 signals). Table 13: Signal states Signal name Reset state First start up configuration CCIO CCRST CCCLK CCIN RXD0 TXD0 CTS0 RTS0 DTR0 DCD0 DSR0 RING0 RXD1 TXD1 CTS1 RTS1 STATUS FST_SHDN I2CDAT1 I2CCLK1 SIM_SWITCH SUSPEND_MON GPIO6,7,20-23,25 PD PD PD PD PD PD PD PD PD PD PD PD PD PD PD PD PD PD PD PD PD PD PD O / L O / L O / L I / PD O / H I / PD O / H I / PD I / PU O / H O / H O / H O / H I / PD O / H I / PD I / PD I / PU OD OD I / PD I / PD High-Z / PD 1. Available with embedded processing option only. Abbreviations used in above Table 13:

L = Low level H = High level High-Z = High Impedance I = Input O = Output OD = Open Drain PD = Pull down, 55k ~390k PU = Pull up, 55k ~390k t TX62-W_TX62-W-B_TX82-W_HID_v00.022a 2020-11-18 Confidential / Draft Cinterion TX62-W(-B)/TX82-W Hardware Interface Description 3.2 Power Up/Power Down Scenarios 104 Page 71 of 144 3.2.4 Turn off TX62/TX82 To switch the module off the following procedures may be used:

Software controlled shutdown procedure: Software controlled by sending an AT command over the serial application interface. See Section 3.2.4.1. Hardware controlled shutdown procedure: Hardware controlled by setting the FST_SHDN line to low. See Section 2.1.13.3. Automatic shutdown (software controlled): See Section 3.2.5

- Takes effect if TX62/TX82 board temperature exceeds a critical limit, or if

- Undervoltage or overvoltage is detected. 3.2.4.1 Switch off TX62/TX82 Using AT Command The best and safest approach to powering down the module is to issue the AT^SMSO com-

mand. This procedure lets the module log off from the network and allows the software to enter into a secure state and to save data before disconnecting the power supply. The shutdown pro-

cedure will be an active process for about 2 seconds (depending on environmental conditions such as network states) until the module switches off. AT^SMSO Switch off procedure Power Down mode 2 seconds BATT+

ON EMERG_RST V180 Figure 35: Switch off behavior A low level of the V180 signal as well as the URC "^SHUTDOWN" indicate that the switch off procedure has completed and the module has entered the Power Down mode. t TX62-W_TX62-W-B_TX82-W_HID_v00.022a 2020-11-18 Confidential / Draft Cinterion TX62-W(-B)/TX82-W Hardware Interface Description 3.2 Power Up/Power Down Scenarios 104 Page 72 of 144 3.2.5 Automatic Shutdown Automatic shutdown takes effect if the following event occurs:

The TX62/TX82 board is exceeding the critical limits of overtemperature or undertempera-

ture (see Section 3.2.5.1) Undervoltage or overvoltage is detected (see Section 3.2.5.2 and Section 3.2.5.3) The automatic shutdown procedure is equivalent to the power-down initiated with an AT com-

mand, i.e. TX62/TX82 logs off from the network and the software enters a secure state avoiding loss of data. 3.2.5.1 Thermal Shutdown The board temperature is constantly monitored by an internal NTC resistor located on the PCB. The values detected by the NTC resistor are measured directly on the board and therefore, are not fully identical with the ambient temperature. Each time the board temperature goes out of range or back to normal, TX62/TX82 instantly dis-

plays an alert (if enabled). URCs indicating the level "1" or "-1" allow the user to take appropriate precautions, such as protecting the module from exposure to extreme conditions. The presentation of the URCs depends on the settings selected with the AT^SCTM write command (for details see ):

AT^SCTM=1: Presentation of URCs is always enabled. AT^SCTM=0 (default): Presentation of URCs is enabled during the 2 minute guard period after start-up of TX62/TX82. After expiry of the 2 minute guard period, the presentation of URCs will be disabled, i.e. no URCs with alert levels "1" or ''-1" will be generated. URCs indicating the level "2" or "-2" are followed by an orderly shutdown after 5 seconds unless the temperature returns to a valid operating level ("1", "0", "-1") or or the shutdown ability was disabled with AT^SCFG, "MEopMode/ShutdownOnCritTemp",<sdoct>. The pre-

sentation of these URCs is always enabled, i.e. they will be output even though the factory setting AT^SCTM=0 was never changed. The maximum temperature ratings are stated in Section 3.5. Refer to Table 14 for the associ-

ated URCs. Table 14: Temperature dependent behavior Sending temperature alert (2min after module start-up, otherwise only if URC presentation enabled)

^SCTM_B: 1 Board close to overtemperature limit.

^SCTM_B: -1 Board close to undertemperature limit.

^SCTM_B: 0 Board back to non-critical temperature range. Automatic shutdown after 5 seconds (URC appears no matter whether presentation was enabled or not)

^SCTM_B: 2 Alert: Board equal or beyond overtemperature limit. TX62/TX82 switches off.

^SCTM_B: -2 Alert: Board equal or below undertemperature limit. TX62/TX82 switches off. t TX62-W_TX62-W-B_TX82-W_HID_v00.022a 2020-11-18 Confidential / Draft Cinterion TX62-W(-B)/TX82-W Hardware Interface Description 3.2 Power Up/Power Down Scenarios 104 Page 73 of 144 3.2.5.2 Undervoltage Shutdown The undervoltage shutdown threshold is the specified minimum supply voltage VBATT+ given in Table 3. When the average supply voltage measured by TX62/TX82 approaches the undervolt-

age shutdown threshold (i.e., 0.05V offset) the module will send the following URC:

^SBC: Undervoltage If the undervoltage persists the module will send the URC several times before switching off automatically. This type of URC does not need to be activated by the user. It will be output automatically when fault conditions occur. Note: For battery powered applications it is strongly recommended to implement a BATT+ con-

necting circuit in order to not only be able save power, but also to restart the module after an undervoltage shutdown where the battery is deeply discharged. Also note that the undervolt-

age threshold is calculated for max. 400mV voltage drops during transmit burst. Power supply sources for external applications should be designed to tolerate 400mV voltage drops without crossing the lower limit of 3.3V. For external applications operating at the limit of the allowed tolerance the default undervoltage threshold may be adapted by subtracting an offset. For de-

tails see [1]: AT^SCFG= "MEShutdown/sVsup/threshold". 3.2.5.3 Overvoltage Shutdown The overvoltage shutdown threshold is the specified maximum supply voltage VBATT+ given in Table 3. When the average supply voltage measured by TX62/TX82 approaches the overvolt-

age shutdown threshold (i.e., 0.05V offset) the module will send the following URC:

^SBC: Overvoltage Warning The overvoltage warning is sent only once - until the next time the module is close to the over-

voltage shutdown threshold. If the voltage continues to rise above the specified overvoltage shutdown threshold, the module will send the following URC:

^SBC: Overvoltage Shutdown This alert is sent only once before the module shuts down cleanly without sending any further messages. This type of URC does not need to be activated by the user. It will be output automatically when fault conditions occur. Keep in mind that several TX62/TX82 components are directly linked to BATT+ and, therefore, the supply voltage remains applied at major parts of TX62/TX82. Especially the power amplifier linked to BATT+RF is sensitive to high voltage and might even be destroyed. t TX62-W_TX62-W-B_TX82-W_HID_v00.022a 2020-11-18 Confidential / Draft Cinterion TX62-W(-B)/TX82-W Hardware Interface Description 3.3 Power Saving 104 3.3 Power Saving Page 74 of 144 TX62/TX82 can control its power consumption through specific features as summarized in Table 15, and further detailed in the following sections. The mentioned operating modes are detailed in Section 3.1. For typical power supply ratings during power saving please refer to Section 3.4.1. Table 15: Power saving features Module operation mode Network actions Power Saving Features Normal operation (network connected) Data transfer Active transfer Radio Output Power Reduction (ROPR) for GSM only IDLE DRX paging Paging cycles based on DRX values provided by network eDRX paging Paging cycles based on eDRX values negotiated with network 3GPP PSM paging Paging cycles based on 3GPP PSM values negotiated with network Low power operation (network connected) SLEEP DRX paging Serial interface (ASC0, ASC1) shut down - except for RTS0/1 available as possible wakeup signal Paging cycles based on DRX values provided by network eDRX paging Serial interface (ASC0, ASC1) shut down - except for RTS0/1 available as possible wakeup signal Paging cycles based on provided DRX and negotiated eDRX values 3GPP PSM paging Serial interface (ASC0, ASC1) shut down - except for RTS0/1 available as possible wakeup signal Paging cycles based on provided DRX, negotiated optional eDRX, as well as 3GPP PSM values SUSPEND DRX paging All components shut down - except for RTC and certain signal triggered wake-up mechanisms Paging cycles based on DRX values provided by network eDRX paging All components shut down - except for RTC and certain signal triggered wake-up mechanisms Paging cycles based on provided DRX and negotiated eDRX values 3GPP PSM paging All components shut down - except for RTC and certain signal triggered wake-up mechanisms Paging cycles based on provided DRX, negotiated optional eDRX, as well as 3GPP PSM values No network connection Airplane POWER DOWN Power off t

Module radio part shut down Module switched off. Standby state with BATT+ connected Module switched off. BATT+ not connected TX62-W_TX62-W-B_TX82-W_HID_v00.022a Confidential / Draft 2020-11-18 Cinterion TX62-W(-B)/TX82-W Hardware Interface Description 3.3 Power Saving 104 Page 75 of 144 3.3.1 Low Power Modes There are two specific low power modes available that can be configured to allow TX62/TX82 to save power - SLEEP mode (Section 3.3.1.1) and SUSPEND mode (Section 3.3.1.2). Figure 36 illustrates how the module transits between its operating modes including SLEEP and SUSPEND modes. RTS0assertion

(+URCanddata) Datatransfer RING0toggle

(+URCand/ordata) Nodataavailable RRCrelease Dataavailable Seriali/finactive

(+AT^SCFGMeOpMode/

PwrSaveenabled,optional:

AT+CPSMS/AT+CEDRXS) SLEEP SerialI/finactive

(+AT^SCFGMeOpMode/

PowerMgmt/Suspendenabled, required:AT+CPSMS/AT+CEDRXS) SUSPEND Idling

(IDLE) Seriali/factive ONsignal AT^SMSO ONsignal POWERDOWN Figure 36: Low power modes with state transitions Notes:

When all serial interfaces (i.e. ASC0, and ASC1) are idle, the module can enter SLEEP or SUSPEND mode depending on additional configuration settings. The serial interfaces are not idle if there is any response message not read out from any of them. t TX62-W_TX62-W-B_TX82-W_HID_v00.022a 2020-11-18 Confidential / Draft Cinterion TX62-W(-B)/TX82-W Hardware Interface Description 3.3 Power Saving 104 Page 76 of 144 3.3.1.1 SLEEP Mode SLEEP mode is a modules low power mode when no call is in progress and there is no active communication on any serial interface (ASC0, ASC1). During SLEEP mode, the serial interfac-

es are shut down except for RTS0 that may be used to wake up TX62/TX82 from SLEEP mode

(see below). The module is in a low power consumption state depending on paging cycles based on network defined DRX values, and possibly network negotiated eDRX (extended DRX) as well as 3GPP PSM values - if configured. The firmware is active to a minimum extent, and preserves the state it was in before entering the SLEEP mode. The module stays registered to the network. For details on the network based DRX values see Section 3.3.2.1 (GSM/(E)GPRS) and Section 3.3.3.1 (LTE M1 NB1/2). For details on the network negotiated eDRX values see Section 3.3.3.2, for network negotiated 3GPP PSM values see Section 3.3.3.3. The SLEEP mode option an be enabled/disabled by AT command (see [1]: AT^SCFG param-

eter MEopMode/PwrSave). RTS0 can be used to wake up TX62/TX82 from SLEEP mode between paging cycles. Asser-

tion of RTS0 (i.e., toggle from inactive high to active low) serves as wake up event, thus allow-

ing an external application to almost immediately terminate power saving. After RTS0 assertion, the CTS0 line signals module wake up, i.e., readiness of the AT command interface. It is therefore recommended to enable RTS/CTS flow control (default setting). Figure 37 shows the described RTS0 wake up mechanism. RTS assertion (falling edge) RTS back Wake up from SLEEP mode Return to SLEEP mode RTS0 CTS0 TXD0 RXD0 AT command Reply URC Figure 37: Wake-up via RTS0 t TX62-W_TX62-W-B_TX82-W_HID_v00.022a 2020-11-18 Confidential / Draft Cinterion TX62-W(-B)/TX82-W Hardware Interface Description 3.3 Power Saving 104 Page 77 of 144 3.3.1.2 SUSPEND Mode In contrast to SLEEP mode, SUSPEND mode is a modules low power mode with almost all components switched off - except for the internal RTC and interrupt triggered wake up mech-

anisms. The module stays registered to the network, and the RRC connection is released. The module is in its lowest power consumption state. Once the SUSPEND mode is enabled via AT command (see MEopMode/PowerMgmt/Sus-

pend), and the appropriate SUSPEND mode indicators are enabled (see PSM and possible eDRX settings need to be negotiated with the network. eDRX and PSM network settings are described in more detail in Section 3.3.3.2 and Section 3.3.3.3. If the PSM settings are agreed upon with the network, TX62/TX82 is able to enter SUSPEND mode, and the following AT^SIND URC is generated:

+CIEV: suspendAvailable,1

+CIEV: "suspendReady",1 In addition, if there is no further communication with the network, and the module is ready to enter SUSPEND mode, the following AT^SIND URC is generated:

Also, the SUSPEND_MON signal will turn low as soon as the module enters SUSPEND mode

(see Section 2.1.13.5). Figure 38 shows the handshake between external application, module and the network for en-

tering SUSPEND mode or possibly SLEEP mode depending on configuration and network re-

sponse. External Application RequestPSMandoptionaleDRX withdesiredtimers Module NetworkconfirmsPSMand/or optionaleDRX andassignstimers Network EnableSUSPENDmode

(AT^SCFGMEopMode /

PowerMgmt/Suspend) RequestPSMtimers

(AT+CPSMS) Optional:RequesteDRXtimers

(AT+CEDRXS/AT+SEDRXS) SUSPENDmodepossible

(+CIEV:suspendAvailable,1) ReadyforSUSPENDmode

(+CIEV:suspendReady,1) Interfacesinactive SUSPENDoroptionallySLEEP modereached Figure 38: Handshake for entering the modules SUSPEND mode t TX62-W_TX62-W-B_TX82-W_HID_v00.022a 2020-11-18 Confidential / Draft Cinterion TX62-W(-B)/TX82-W Hardware Interface Description 3.3 Power Saving 104 Page 78 of 144 From SUSPEND mode the module can only be woken up by the ON or EMERG_RST signals, or it may wake up and be reachable again after expiration of a negotiated 3GPP PSM periodic TAU cycle (i.e., network timer) that may include DRX as well as eDRX paging cycles for an inactivity period (see Section 3.3.3.3 for details). The module wakes up with its signal states being the same as the first startup configuration

(see Section 3.2.3), and does not preserve the signal states it had in before entering SUSPEND mode. Figure 39 shows the handshake between external application, module and network for waking up the module via ON/EMERG_RST signal. ON/EMERG_RSTsignaltriggered External Application

^SYSRESUME ATcommands

(e.g.,AT^SISO;AT^SISW Module Network RRCconnectionrequest Figure 39: Handshake for module wake up via ON signal Figure 40 shows the handshake between external application, module and network for waking up the module after expiry of the 3GPP PSM periodic TAU cycle (Tracking Area Update). In this case the module automatically wakes up, and is reachable by the network to receive data (e.g., an SMS). The module wakeup can be indicated to the external application by tog-

gling the RING0 line. See [1] for the AT^SGPICFG command to control the RING0 logic level. The external application should now activate the appropriate communication interfaces to wake up the module from SUSPEND mode, to receive the ^SYSRESUME URC, and to be able to transfer data. Timer(TAU)expiry/update Data/SMS Module Network External Application RING0toggle Interfacesactive

^SYSRESUME OtherURCs,Data,SMS Figure 40: Handshake for module wake up after eDRX/PSM timer expiry t TX62-W_TX62-W-B_TX82-W_HID_v00.022a 2020-11-18 Confidential / Draft Cinterion TX62-W(-B)/TX82-W Hardware Interface Description 3.3 Power Saving 104 Page 79 of 144 3.3.2 Power Saving while Attached to GSM Networks (TX82-W only) Power saving while attached to GSM networks is based on standard DRX values defined for the network (see Section 3.3.2.1). Apart from network based power saving it is possible to use the AT command AT^SCFG="Ra-

dio/OutputPowerReduction" for the module in (E)GPRS multislot scenarios to reduce its output power according to 3GPP 45.005. By default a maximum power reduction is enabled. For de-

tails on this AT command see [1]. 3.3.2.1 DRX (Standard Configuration) The power saving possibilities while attached to a GSM network depend on the paging timing cycle of the base station. The duration of a power saving interval can be calculated using the following formula:

t = 4.615 ms (TDMA frame duration) * 51 (number of frames) * DRX value. DRX (Discontinuous Reception) is a value from 2 to 9, resulting in paging intervals between 0.47 and 2.12 seconds. The DRX value of the base station is assigned by the GSM network operator. In the pauses between listening to paging messages, the module resumes power saving, i.e., SLEEP mode, as shown in Figure 41. DRXpagingcycle 0.472.12seconds DRXpagingcycle 0.472.12seconds DRXpagingcycle 0.472.12seconds Paging Powersaving(SLEEP) Paging Powersaving(SLEEP) Paging Powersaving(SLEEP) Paging Figure 41: DRX based paging and power saving (SLEEP) in GSM networks The varying pauses explain the different potential for power saving during SLEEP mode. The longer the pause the less power is consumed. Generally, power saving depends on the modules application scenario and may differ from the above mentioned normal operation. The power saving interval may be shorter than 0.47 sec-

onds or longer than 2.12 seconds. 3.3.2.2 eDRX (Extended DRX Configuration) Note: eDRX support for GSM networks is disabled. eDRX support is only available for LTE Cat M1 and Cat NB1/2 networks (see Section 3.3.3.2). t TX62-W_TX62-W-B_TX82-W_HID_v00.022a 2020-11-18 Confidential / Draft Cinterion TX62-W(-B)/TX82-W Hardware Interface Description 3.3 Power Saving 104 Page 80 of 144 3.3.3 Power Saving while Attached to LTE M1 NB1/2 Networks This section describes the power saving possibilities in LTE Cat M1 and LTE Cat NB1/2 net-

works through DRX (see Section 3.3.3.1) values, as well as configurable eDRX (see Section 3.3.3.2), and 3GPP PSM (see Section 3.3.3.3) timers. 3.3.3.1 DRX (Standard Configuration) TX62/TX82 can be enabled to use DRX (Discontinuous Reception) in RRC idle mode to reduce power consumption (see also Section 3.3.1.1). The power saving possibilities while attached to an LTE Cat M1 or LTE Cat NB1/2 network depend on the paging timing cycle of the base station. During normal operation, i.e., the module is connected to an LTE Cat M1 or LTE Cat NB1/2 network, the duration of power saving period varies. It may be calculated using the following formula:

t = DRX Cycle Value * 10 ms DRX cycle value in LTE Cat M1 or LTE Cat NB1/2 networks is any of the four values: 128, 256, 512 and 1024, thus resulting power saving intervals between 1.28 and 10.24 seconds. The DRX cycle value of the base station is assigned by the network operator. In the pauses between listening to paging messages, the module resumes power saving, as shown in Figure 42. DRXpagingcycle DRXpagingcycle DRXpagingcycle 1.2810.24seconds 1.2810.24seconds 1.2810.24seconds Paging Powersaving(SLEEP) Paging Powersaving(SLEEP) Paging Powersaving(SLEEP) Paging Figure 42: DRX based paging and power saving (SLEEP) in LTE Cat M1 and Cat NB1/2 networks The varying pauses explain the different potential for power saving (SLEEP mode). The longer the pause the less power is consumed. t TX62-W_TX62-W-B_TX82-W_HID_v00.022a 2020-11-18 Confidential / Draft Cinterion TX62-W(-B)/TX82-W Hardware Interface Description 3.3 Power Saving 104 Page 81 of 144 3.3.3.2 eDRX (Extended DRX Configuration) TX62/TX82 and the network may negotiate the use of eDRX (extended DRX) to reduce power consumption, while being available for mobile terminating data and/or network originated pro-

cedures within a certain delay dependent on the network negotiated eDRX cycle value (see also Section 3.3.1.2). If the network supports eDRX, the module monitors the paging messages during a periodic Paging Time Window (PTW) configured for TX62/TX82. The possible eDRX paging cycle length (PCL) ranges from 5.12s up to a maximum of 10485.76s (almost 3 hours). The PTW length can be calculated using the following formula:

t_ptw = (PTW value +1)* 2560 ms Figure 43 shows the eDRX timings, with the module listening to paging messages during a pag-

ing time window (PTW). PCL PCL PCL PCL PTW eDRXSLEEPmode

(Deepsleep) eDRXSLEEPmode

(Deepsleep) eDRXSLEEPmode

(Deepsleep) eDRXSLEEPmode

(Deepsleep) eDRXSUSPENDmode eDRXSUSPENDmode eDRXSUSPENDmode eDRXSUSPENDmode Default Paging Cycle

(DRX) P1 P2 P3 P4 DRXSLEEPmode PCL PTW DefaultPagingCycle PagingCycleLengtheDRX(5.12...10485 .76seconds) PagingTimeWindoweDRX(2.56...40.96seconds) PagingCycleDRX(1.28...10.24seconds) Figure 43: eDRX based paging and power saving in LTE Cat M1 and Cat NB1/2 networks The eDRX timer can be configured with AT+CEDRXS (or AT^SEDRXS with a PTW timer request) that negotiates the eDRX settings with the network. The dynamic parameters are readable with AT+CEDRXRDP. For more information on these AT commands see [1]. Note 1: If SUSPEND mode is enabled in addition to SLEEP mode and eDRX settings, the mod-

ule is able to reduce its current consumption even further during the eDRX paging cycle (see Figure 43). This optional so-called eDRX SUSPEND mode can be enabled with the AT^SCFG command Radio/Suspend,<suspendmode>. However, the module will in this case not longer be able to change into the regular 3GPP PSM SUSPEND mode. Note 2: eDRX can be configured together with 3GPP PSM (AT+CPSMS) as it will not only affect SLEEP mode (deep sleep) and eDRX SUSPEND mode, but also the 3GPP PSM SUS-

PEND mode - see Section 3.3.3.3. t TX62-W_TX62-W-B_TX82-W_HID_v00.022a 2020-11-18 Confidential / Draft Cinterion TX62-W(-B)/TX82-W Hardware Interface Description 3.3 Power Saving 104 Page 82 of 144 3.3.3.3 3GPP PSM Configuration TX62/TX82 can be configured to use 3GPP PSM to reduce power consumption. PSM is similar to power off, while TX62/TX82 remains registered with the network. There is no need to re-

attach or re-establish PDN connections. TX62/TX82 in PSM is not immediately reachable for mobile terminating services (see also SUSPEND mode in Section 3.3.1.2) The network accepts and negotiates the use of PSM by providing specific values for periodic TAU cycles (T3412) as well as an active timer (T3324). Upon expiry of the active timer, or if the value provided by the network is zero, TX62/TX82 may activate PSM. Note: If TX62/TX82 negotiates to enable both PSM (requesting an active timer and possibly a periodic TAU cycle value) as well as eDRX (requesting a specific extended idle mode DRX cycle value and possibly a paging time window), it is up to the network to decide whether to:

1. Enable only PSM, i.e. not accept the request for eDRX. 2. Enable only eDRX, i.e. not accept the request for an active timer. 3. Enable both PSM (i.e. negotiate and provide requested PSM timers) and eDRX (i.e. negoti-

ate and provide extended DRX parameters). Figure 44 shows the modules eDRX and PSM timings for the third case where module and network negotiate PSM and eDRX simultaneously (for eDRX see also Section 3.3.3.2). For the second case the module will not reach SUSPEND mode and will continue with the eDRX pag-

ing cycles. For the first case the module will not extend the DRX paging cycles, but will continue with the DRX paging cycles until the active timer (T3324) expires. PeriodicTAUcycle (T 3412) Activetime (T3324) PCL PCL PT W e DRXSLEEPm ode

(de e psle e p) e DRXSLEEPm ode

(de e psle e p) e DRXSUSPENDm ode e DRXSUSPENDm ode 3GPPPSM m ode

(SUSPEND) De fault Paging Cycle

( DRX) P1 P2 P3 P4 DRXSLEEP m ode PeriodicTAUcycle Activetime PCL PTW DefaultPagingCycle 3GPPPSM T3412 T3324 PagingCycleLengtheDRX (5.12...10485.76seconds) PagingTimeWindoweDRX (2.56...40.96seconds) PagingCycleDRX (1.28...10.24seconds ) 3GPPPowerSavingMode Figure 44: eDRX/PSM based paging and power saving in LTE Cat M1 or Cat NB1/2 networks TX62/TX82 monitors paging message only while the active timer (T3324) has not expired. If the module has uplink data or signal, it will not change to PSM. The active timer (T3324) and periodic tracking area update (TAU) timer (T3412) can be nego-

tiated/requested with AT+CPSMS. For more information on this AT command see [1]. t TX62-W_TX62-W-B_TX82-W_HID_v00.022a 2020-11-18 Confidential / Draft Cinterion TX62-W(-B)/TX82-W Hardware Interface Description 3.4 Power Supply 104 Page 83 of 144 3.4 Power Supply TX62/TX82 needs to be connected to a power supply at the SMT application interface - 2 lines BATT+, and GND. There are two separate voltage domains for BATT+:

BATT+BB with a line mainly for the baseband power supply. BATT+RF with a line for the GSM power amplifier supply. Please note that this line needs only be connected for GSM (2G/3G) availability. Please note that BATT+ in this document refers to both voltage domains and power supply lines - BATT+BB and BATT+RF. The power supply of TX62/TX82 has to be a single voltage source at BATT+BB and BATT+RF. It should be of type PS1, according to IEC 62368-1, and must be able to provide the peak cur-

rent during the uplink transmission. Suitable low ESR capacitors should be placed as close as possible to the BATT+ pads, e.g., X7R MLCC (see also Section 2.1.2). All key functions for supplying power to the device are handled by the power management IC. It provides the following features:

Stabilizes the supply voltages for the baseband using low drop linear voltage regulators and a DC-DC step down switching regulator. Switches the module's power voltages for the power-up and -down procedures. SIM switch to provide SIM power supply. 3.4.1 Power Supply Ratings (TBD.) Table 16, Table 17, Table 18, and Table 19 assemble various voltage supply and current con-

sumption ratings (GSM, Cat M1 and Cat NB1/2) of the module. Table 16: Voltage supply ratings Description Conditions Min Typ Max Unit BATT+

TX82-W Supply voltage

(LTE and GSM) TX82-W Supply voltage

(GSM deactivated) Directly measured at Module. Voltage must stay within the min/max values, including voltage drop, ripple, spikes 3.1 2.8 TX62-W Supply voltage Directly measured at Module. 2.55 4.6 4.6 4.8 V V V TX62-W-B Supply volt-

age Maximum allowed volt-

age drop during transmit burst Voltage ripple

(TX82-W only) Voltage must stay within the min/max values, including voltage drop, ripple, spikes Directly measured at Module. Voltage must stay within the min/max values, including voltage drop, ripple, spikes Normal condition, power control level for Pout max Normal condition, power control level for Pout max

@ f <= 250 kHz

@ f > 250 kHz 2.5 4.5 V 400 mV 70 20 mVpp mVpp t TX62-W_TX62-W-B_TX82-W_HID_v00.022a 2020-11-18 Confidential / Draft Cinterion TX62-W(-B)/TX82-W Hardware Interface Description 3.4 Power Supply 104 Page 84 of 144 Table 17: Current consumption ratings General and GSM (TX82-W only) Description Conditions 1 IBATT+

(i.e., sum of BATT+BB and BATT+RF) OFF State supply current POWER DOWN UART active UART inactive Airplane mode Boot2 GSM Cell search Cell search No coverage3 UART inactive TBD. Initial cell search4 Fast Search Full Search Average GSM supply current

(GNSS off) SLEEP5@DRX=9 (no communication via UART) SLEEP5@DRX=5 (no communication via UART) SLEEP5@DRX=2 (no communication via UART) GPRS Data transfer GSM850;

PCL=5,1Tx/4RX ROPR=8

(max. reduction) Typical rating Unit TBD. A TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. mA mA mA mA mA mA mA mA mA mA GPRS Data transfer GSM850;

PCL=5; 2Tx/3Rx ROPR=8

(max. reduction) TBD. mA EDGE Data transfer GSM850;

PCL=5; 1Tx/4Rx ROPR=8

(max. reduction) TBD. mA ROPR=4

(no reduction) TBD. mA ROPR=4

(no reduction) TBD. mA ROPR=4

(no reduction) TBD. mA ROPR=4

(no reduction) TBD. mA ROPR=4

(no reduction) TBD. mA ROPR=4

(no reduction) TBD. mA ROPR=4

(no reduction) TBD. mA EDGE Data transfer GSM850;

PCL=5; 2Tx/3Rx ROPR=8

(max. reduction) TBD. mA GPRS Data transfer GSM900;

PCL=5,1Tx/4RX ROPR=8

(max. reduction) TBD. mA GPRS Data transfer GSM900;

PCL=5; 2Tx/3Rx ROPR=8

(max. reduction) TBD. mA EDGE Data transfer GSM900;

PCL=5; 1Tx/4Rx ROPR=8

(max. reduction) TBD. mA t TX62-W_TX62-W-B_TX82-W_HID_v00.022a 2020-11-18 Confidential / Draft Cinterion TX62-W(-B)/TX82-W Hardware Interface Description 3.4 Power Supply 104 Page 85 of 144 Table 17: Current consumption ratings General and GSM (TX82-W only) Description Conditions EDGE Data transfer GSM900;

PCL=5; 2Tx/3Rx ROPR=8

(max. reduction) Typical rating Unit TBD. mA 1 IBATT+

(i.e., sum of BATT+BB and BATT+RF) Average GSM supply current

(GNSS off) GPRS Data transfer GSM1800;

PCL=5,1Tx/4RX ROPR=8

(max. reduction) TBD. mA ROPR=4

(no reduction) TBD. mA ROPR=4

(no reduction) TBD. mA ROPR=4

(no reduction) TBD. mA ROPR=4

(no reduction) TBD. mA ROPR=4

(no reduction) TBD. mA ROPR=4

(no reduction) TBD. mA ROPR=4

(no reduction) TBD. mA ROPR=4

(no reduction) TBD. mA ROPR=4

(no reduction) TBD. mA GPRS Data transfer GSM1800;

PCL=5; 2Tx/3Rx ROPR=8

(max. reduction) TBD. mA EDGE Data transfer GSM1800;

PCL=5; 1Tx/4Rx ROPR=8

(max. reduction) TBD. mA EDGE Data transfer GSM1800;

PCL=5; 2Tx/3Rx ROPR=8

(max. reduction) TBD. mA GPRS Data transfer GSM1900;

PCL=5,1Tx/4RX ROPR=8

(max. reduction) TBD. mA GPRS Data transfer GSM1900;

PCL=5; 2Tx/3Rx ROPR=8

(max. reduction) TBD. mA EDGE Data transfer GSM1900;

PCL=5; 1Tx/4Rx ROPR=8

(max. reduction) TBD. mA EDGE Data transfer GSM1900;

PCL=5; 2Tx/3Rx ROPR=8

(max. reduction) TBD. mA Peak current during GSM transmit burst

@ 3.8V GPRS Data transfer GSM850; PCL=5; 2Tx/3Rx GPRS Data transfer GSM900; PCL=5; 2Tx/3Rx GPRS Data transfer GSM1800; PCL=0; 2Tx/3Rx GPRS Data transfer GSM1900; PCL=0; 2Tx/3Rx TBD. TBD. TBD. TBD. A A A A t TX62-W_TX62-W-B_TX82-W_HID_v00.022a 2020-11-18 Confidential / Draft Cinterion TX62-W(-B)/TX82-W Hardware Interface Description 3.4 Power Supply 104 Page 86 of 144 Table 17: Current consumption ratings General and GSM (TX82-W only) Description Conditions 1 IBATT+

(i.e., sum of BATT+BB and BATT+RF) Peak current during GSM transmit burst

@ 3.1V GPRS Data transfer GSM850; PCL=5; 2Tx/3Rx GPRS Data transfer GSM900; PCL=5; 2Tx/3Rx GPRS Data transfer GSM1800; PCL=0; 2Tx/3Rx GPRS Data transfer GSM1900; PCL=0; 2Tx/3Rx Average GSM IDLE supply current

(GNSS on) GPRS active (UART active) @ DRX=2 GNSS NMEA output off GPRS active (UART active) @ DRX=2 GNSS NMEA output on Typical rating Unit TBD. TBD. TBD. TBD. TBD. A A A A mA TBD. mA 1. With an impedance of ZLOAD=50 at the antenna connector, Measured at 25C at 3.8V. 2. The boot procedure from ON pin pulse to ^SYSSTART URC. 3. No network coverage, SLEEP mode, measured 3 minutes after power on for 10 minutes. 4. The procedure from activation of full functionality (AT+CFUN=1) to registered state on the network, Full Search: without assigned frequency band. Fast Search: with assigned frequency band 5. Measurements start 6 minutes after switching ON the module, Averaging times:

OFF mode: 3 minutes SLEEP and IDLE mode - 10 minutes Transfer modes - 3 minutes Communication tester settings: no neighbor cells, no cell re-selection etc,, RMC (reference measurement channel), SLEEP mode is enabled via AT command t TX62-W_TX62-W-B_TX82-W_HID_v00.022a 2020-11-18 Confidential / Draft Cinterion TX62-W(-B)/TX82-W Hardware Interface Description 3.4 Power Supply 104 Page 87 of 144 Table 18: Current consumption typical ratings Cat M1 Description Conditions TX62-W TX62-W-B TX82-W Unit IBATT+BB 1 Average LTE Cat M1 sup-

ply current Cat M1 Cell search Initial cell search2 Fast Search Full Search TBD. TBD. 3GPP Power saving mode TBD. SUSPEND

(PSM) RRC idle

(SLEEP)3 TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. mA mA uA mA mA mA mA TBD. TBD. TBD. TBD. TBD. TBD. TBD. mA TBD. TBD. TBD. mA TBD. TBD. TBD. mA DRX =256 DRX =128 DRX =64 20,48s eDRX 81,92s eDRX 163,84s eDRX 163,84s eDRX 3,84s paging window (DRX

= 1,28s) 2,56s paging window (DRX

= 1,28s) 3,84s paging window (DRX

= 1,28s) 10,24s paging window (DRX

= 1,28s) Connected DRX4 Short C-DRX Long C-DRX TBD. TBD. TBD. TBD. TBD. TBD. mA mA t TX62-W_TX62-W-B_TX82-W_HID_v00.022a 2020-11-18 Confidential / Draft Cinterion TX62-W(-B)/TX82-W Hardware Interface Description 3.4 Power Supply 104 Page 88 of 144 Table 18: Current consumption typical ratings Cat M1 Description Conditions TX62-W TX62-W-B TX82-W Unit IBATT+BB 1 Average LTE Cat M1 sup-

ply current RRC con-

nected Active Transmis-

sion4 TX62-W-B only Band1, 23dBm Band2, 23dBm Band3 , 23dBm Band4 , 23dBm Band5, 23dBm Band8, 23dBm Band12, 23dBm Band13, 23dBm Band18, 23dBm Band19, 23dBm Band20, 23dBm Band25, 23dBm Band26, 23dBm Band27, 23dBm Band28, 23dBm Band66, 23dBm Band85, 23dBm Band1, 20dBm Band2, 20dBm Band3 , 20dBm Band4 , 20dBm Band5, 20dBm Band8, 20dBm Band12, 20dBm Band13, 20dBm Band18, 20dBm Band19, 20dBm Band20, 20dBm Band25, 20dBm Band26, 20dBm Band27, 20dBm Band28, 20dBm Band66, 20dBm Band85, 20dBm TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA RRC con-

nected Active Transmis-

sion4 t TX62-W_TX62-W-B_TX82-W_HID_v00.022a 2020-11-18 Confidential / Draft Cinterion TX62-W(-B)/TX82-W Hardware Interface Description 3.4 Power Supply 104 Page 89 of 144 Table 18: Current consumption typical ratings Cat M1 Description Conditions TX62-W TX62-W-B TX82-W Unit IBATT+BB 1 Average LTE Cat M1 sup-

ply current RRC con-

nected Active Transmis-

sion4 Band1, 0dBm Band2, 0dBm Band3, 0dBm Band4, 0dBm Band5, 0dBm Band8, 0dBm Band12, 0dBm Band13, 0dBm Band18, 0dBm Band19, 0dBm Band20, 0dBm Band25, 0dBm Band26, 0dBm Band27, 0dBm Band28, 0dBm Band66, 0dBm Band85, 0dBm Band1, 23dBm Band2, 23dBm Band3 , 23dBm Band4 , 23dBm Band5, 23dBm Band8, 23dBm Band12, 23dBm Band13, 23dBm Band18, 23dBm Band19, 23dBm Band20, 23dBm Band25, 23dBm Band26, 23dBm Band27, 23dBm Band28, 23dBm Band66, 23dBm Band85, 23dBm TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD.

mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA Peak Current @ RRC con-

nected Active Transmis-

sion4 Vbatt = 3.8V TX62-W-B only t TX62-W_TX62-W-B_TX82-W_HID_v00.022a 2020-11-18 Confidential / Draft Cinterion TX62-W(-B)/TX82-W Hardware Interface Description 3.4 Power Supply 104 Page 90 of 144 Table 18: Current consumption typical ratings Cat M1 Description Conditions TX62-W TX62-W-B TX82-W Unit IBATT+BB 1 Peak Current @ RRC con-

nected Active Transmis-

sion4 Vbatt = 3.8V Band1, 20dBm Band2, 20dBm Band3 , 20dBm Band4 , 20dBm Band5, 20dBm Band8, 20dBm Band12, 20dBm Band13, 20dBm Band18, 20dBm Band19, 20dBm Band20, 20dBm Band25, 20dBm Band26, 20dBm Band27, 20dBm Band28, 20dBm Band66, 20dBm Band85, 20dBm Band1, 23dBm Band2, 23dBm Band3, 23dBm Band4, 23dBm Band5, 23dBm Band8, 23dBm Band12, 23dBm Band13, 23dBm Band18, 23dBm Band19, 23dBm Band20, 23dBm Band25, 23dBm Band26, 23dBm Band27, 23dBm Band28, 23dBm Band66, 23dBm Band85, 23dBm TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD.

mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA Peak Current @ RRC con-

nected Active Transmis-

sion4 Vbatt = 2.55V TX62-W-B only t TX62-W_TX62-W-B_TX82-W_HID_v00.022a 2020-11-18 Confidential / Draft Cinterion TX62-W(-B)/TX82-W Hardware Interface Description 3.4 Power Supply 104 Page 91 of 144 Table 18: Current consumption typical ratings Cat M1 Description Conditions TX62-W TX62-W-B TX82-W Unit IBATT+BB 1 Peak Current @ RRC con-

nected Active Transmis-

sion4 Vbatt = 2.55V Band1, 20dBm Band2, 20dBm Band3, 20dBm Band4, 20dBm Band5, 20dBm Band8, 20dBm Band12, 20dBm Band13, 20dBm Band18, 20dBm Band19, 20dBm Band20, 20dBm Band25, 20dBm Band26, 20dBm Band27, 20dBm Band28, 20dBm Band66, 20dBm Band85, 20dBm TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA Average IDLE supply cur-

rent

(GNSS on) Cat M1 active (UART active) @ DRX=128 GNSS NMEA output off Cat M1 active (UART active) @ DRX=128 GNSS NMEA output on TBD. TBD. TBD. mA 1. With an impedance of ZLOAD=50 at the antenna connector, Measured at 25C at 3.8V. 2. The procedure from activation of full functionality (AT+CFUN=1) to registered state on the network, Full Search: without assigned frequency band. Fast Search: with assigned frequency band 3. Measurements start 6 minutes after switching ON the module, Averaging times:

PSM mode: 3 minutes (T3324 = 3s, T3412 = 14400s) SLEEP mode: 10 minutes, (PSM disabled, eDRX disabled) Idle eDRX mode: 30 minutes, (PSM disabled, eDRX enabled) Connected DRX mode: 10 minutes, RRC connected modes: 3 minutes, Communication tester settings: no neighbor cells, no cell re-selection etc, RMC (reference measurement channel), PSM mode is enabled via AT command 4. Communication tester settings:

Cat M1 Channel Bandwidth: 5MHz Modulation: QPSK. RB setting: 4 UL RBs, 6 DL RBs, Half Duplex t TX62-W_TX62-W-B_TX82-W_HID_v00.022a 2020-11-18 Confidential / Draft Cinterion TX62-W(-B)/TX82-W Hardware Interface Description 3.4 Power Supply 104 Page 92 of 144 Table 19: Current consumption typical ratings Cat NB1/2 Description Conditions TX62-W TX62-W-B TX82-W Unit Fast Search TBD. TBD. TBD. mA IBATT+BB 1 Average LTE NB1/2 sup-

ply current NB1/2 cell search Initial cell search2 Full Search TBD. 3GPP Power saving mode TBD. SUSPEND

(PSM) RRC idle

(SLEEP)3 DRX =1024 DRX =512 DRX =256 DRX =128 TBD. TBD. TBD. TBD. TBD. 20,48s eDRX 81,92s eDRX 163,84s eDRX 163,84s eDRX 3,84s paging window (DRX

= 1,28s) 2,56s paging window (DRX

= 1,28s) 3,84s paging window (DRX

= 1,28s) 10,24s paging window (DRX

= 1,28s) TBD. TBD. TBD. mA TBD. TBD. TBD. mA TBD. TBD. TBD. mA TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD.

mA uA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA RRC con-

nected Active Transmis-

sion DL RMC4 TX62-W-B only Band1, 23dBm Band2, 23dBm Band3, 23dBm Band4, 23dBm Band5, 23dBm Band8, 23dBm Band12, 23dBm Band13, 23dBm Band18, 23dBm Band19, 23dBm Band20, 23dBm Band25, 23dBm Band26, 23dBm Band28, 23dBm Band66, 23dBm Band71, 23dBm Band85, 23dBm t TX62-W_TX62-W-B_TX82-W_HID_v00.022a 2020-11-18 Confidential / Draft Cinterion TX62-W(-B)/TX82-W Hardware Interface Description 3.4 Power Supply 104 Page 93 of 144 Table 19: Current consumption typical ratings Cat NB1/2 Description Conditions TX62-W TX62-W-B TX82-W Unit IBATT+BB 1 Average LTE NB1/2 sup-

ply current RRC con-

nected Active Transmis-

sion DL RMC4 Band1, 20dBm Band2, 20dBm Band3, 20dBm Band4, 20dBm Band5, 20dBm Band8, 20dBm Band12, 20dBm Band13, 20dBm Band18, 20dBm Band19, 20dBm Band20, 20dBm Band25, 20dBm Band26, 20dBm Band28, 20dBm Band66, 20dBm Band71, 20dBm Band85, 20dBm Band1, 0dBm Band2, 0dBm Band3, 0dBm Band4, 0dBm Band5, 0dBm Band8, 0dBm Band12, 0dBm Band13, 0dBm Band18, 0dBm Band19, 0dBm Band20, 0dBm Band25, 0dBm Band26, 0dBm Band28, 0dBm Band66, 0dBm Band71, 0dBm Band85, 0dBm TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA t TX62-W_TX62-W-B_TX82-W_HID_v00.022a 2020-11-18 Confidential / Draft Cinterion TX62-W(-B)/TX82-W Hardware Interface Description 3.4 Power Supply 104 Page 94 of 144 Table 19: Current consumption typical ratings Cat NB1/2 Description IBATT+BB 1 Average LTE NB1/2 sup-

ply current TX62-W TX62-W-B TX82-W Unit Conditions RRC con-

nected Active Transmis-

sion UL RMC, sin-

gle tone mode

(1subcar-

rier),15KHz spacing4 TX62-W-B only RRC con-

nected Active Transmis-

sion UL RMC, sin-

gle tone mode

(1subcar-

rier),15KHz spacing4 Band1, 23dBm Band2, 23dBm Band3, 23dBm Band4, 23dBm Band5, 23dBm Band8, 23dBm Band12, 23dBm Band13, 23dBm Band18, 23dBm Band19, 23dBm Band20, 23dBm Band25, 23dBm Band26, 23dBm Band28, 23dBm Band66, 23dBm Band71, 23dBm Band85, 23dBm Band1, 20dBm Band2, 20dBm Band3, 20dBm Band4, 20dBm Band5, 20dBm Band8, 20dBm Band12, 20dBm Band13, 20dBm Band18, 20dBm Band19, 20dBm Band20, 20dBm Band25, 20dBm Band26, 20dBm Band28, 20dBm Band66, 20dBm Band71, 20dBm Band85, 20dBm TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD.

TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. t TX62-W_TX62-W-B_TX82-W_HID_v00.022a 2020-11-18 Confidential / Draft Cinterion TX62-W(-B)/TX82-W Hardware Interface Description 3.4 Power Supply 104 Page 95 of 144 Table 19: Current consumption typical ratings Cat NB1/2 Description IBATT+BB 1 Average LTE NB1/2 sup-

ply current TX62-W TX62-W-B TX82-W Unit Conditions RRC con-

nected Active Transmis-

sion UL RMC, sin-

gle tone mode

(1subcar-

rier),15KHz spacing4 RRC con-

nected Active Transmis-

sion UL RMC, multi- tone mode (12 subcar-

rier),15KHz spacing4 TX62-W-B only Band1, 0dBm Band2, 0dBm Band3, 0dBm Band4, 0dBm Band5, 0dBm Band8, 0dBm Band12, 0dBm Band13, 0dBm Band18, 0dBm Band19, 0dBm Band20, 0dBm Band25, 0dBm Band26, 0dBm Band28, 0dBm Band66, 0dBm Band71, 0dBm Band85, 0dBm Band1, 23dBm Band2, 23dBm Band3, 23dBm Band4, 23dBm Band5, 23dBm Band8, 23dBm Band12, 23dBm Band13, 23dBm Band18, 23dBm Band19, 23dBm Band20, 23dBm Band25, 23dBm Band26, 23dBm Band28, 23dBm Band66, 23dBm Band71, 23dBm Band85, 23dBm TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD.

mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA t TX62-W_TX62-W-B_TX82-W_HID_v00.022a 2020-11-18 Confidential / Draft Cinterion TX62-W(-B)/TX82-W Hardware Interface Description 3.4 Power Supply 104 Page 96 of 144 TX62-W TX62-W-B TX82-W Unit Table 19: Current consumption typical ratings Cat NB1/2 Description IBATT+BB 1 Average LTE NB1/2 sup-

ply current Conditions RRC con-

nected Active Transmis-

sion UL RMC, multi- tone mode (12 subcar-

rier),15KHz spacing4 Band1, 20dBm Band2, 20dBm Band3, 20dBm Band4, 20dBm Band5, 20dBm Band8, 20dBm Band12, 20dBm Band13, 20dBm Band18, 20dBm Band19, 20dBm Band20, 20dBm Band25, 20dBm Band26, 20dBm Band28, 20dBm Band66, 20dBm Band71, 20dBm Band85, 20dBm Band1, 23dBm Band2, 23dBm Band3, 23dBm Band4, 23dBm Band5, 23dBm Band8, 23dBm Band12, 23dBm Band13, 23dBm Band18, 23dBm Band19, 23dBm Band20, 23dBm Band25, 23dBm Band26, 23dBm Band28, 23dBm Band66, 23dBm Band71, 23dBm Band85, 23dBm TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD.

mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA Peak Current @ RRC con-

nected Active Transmission UL RMC, single tone mode

(1subcarrier),15KHz spac-

ing4 Vbatt = 3.8V TX62-W-B only t TX62-W_TX62-W-B_TX82-W_HID_v00.022a 2020-11-18 Confidential / Draft Cinterion TX62-W(-B)/TX82-W Hardware Interface Description 3.4 Power Supply 104 Page 97 of 144 TX62-W TX62-W-B TX82-W Unit Table 19: Current consumption typical ratings Cat NB1/2 Description Conditions 1 Peak Current @ RRC con-

IBATT+BB nected Active Transmission UL RMC, single tone mode

(1subcarrier),15KHz spac-

ing4 Vbatt = 3.8V Band1, 20dBm Band2, 20dBm Band3, 20dBm Band4, 20dBm Band5, 20dBm Band8, 20dBm Band12, 20dBm Band13, 20dBm Band18, 20dBm Band19, 20dBm Band20, 20dBm Band25, 20dBm Band26, 20dBm Band28, 20dBm Band66, 20dBm Band71, 20dBm Band85, 20dBm Band1, 23dBm Band2, 23dBm Band3, 23dBm Band4, 23dBm Band5, 23dBm Band8, 23dBm Band12, 23dBm Band13, 23dBm Band18, 23dBm Band19, 23dBm Band20, 23dBm Band25, 23dBm Band26, 23dBm Band28, 23dBm Band66, 23dBm Band71, 23dBm Band85, 23dBm TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD.

mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA Peak Current @ RRC con-

nected Active Transmission UL RMC, single tone mode

(1subcarrier),15KHz spac-

ing4 Vbatt = 3.0V TX62-W-B only t TX62-W_TX62-W-B_TX82-W_HID_v00.022a 2020-11-18 Confidential / Draft Cinterion TX62-W(-B)/TX82-W Hardware Interface Description 3.4 Power Supply 104 Page 98 of 144 Table 19: Current consumption typical ratings Cat NB1/2 Description Conditions 1 Peak Current @ RRC con-

IBATT+BB nected Active Transmission UL RMC, single tone mode

(1subcarrier),15KHz spac-

ing4 Vbatt = 3.0V Band1, 20dBm Band2, 20dBm Band3, 20dBm Band4, 20dBm Band5, 20dBm Band8, 20dBm Band12, 20dBm Band13, 20dBm Band18, 20dBm Band19, 20dBm Band20, 20dBm Band25, 20dBm Band26, 20dBm Band28, 20dBm Band66, 20dBm Band71, 20dBm Band85, 20dBm TX62-W TX62-W-B TX82-W Unit TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA Average IDLE supply cur-

rent

(GNSS on) NB1/2 active (UART active) @ DRX=128 GNSS NMEA output off NB1/2 active (UART active) @ DRX=128 GNSS NMEA output on TBD. TBD. TBD. mA 1. With an impedance of ZLOAD=50 at the antenna connector, Measured at 25C at 3.8V. 2. The procedure from activation of full functionality (AT+CFUN=1) to registered state on the network, Full Search: without assigned frequency band. Fast Search: with assigned frequency band 3. Measurements start 6 minutes after switching ON the module, Averaging times:

PSM mode: 3 minutes (T3324 = 3s, T3412 = 14400s) SLEEP mode: 10 minutes, (PSM disabled, eDRX disabled) Idle eDRX mode: 30 minutes, (PSM disabled, eDRX enabled) Connected DRX mode: 10 minutes, RRC connected modes: 3 minutes, Communication tester settings: no neighbor cells, no cell re-selection etc,, RMC (reference measurement channel), PSM mode is enabled via AT command 4. Communication tester settings:

Cat NB1/2 Channel Bandwidth: 5MHz Modulation: BPSK for 1 sub-carrier mode, QPSK for multi-sub-carrier mode. t TX62-W_TX62-W-B_TX82-W_HID_v00.022a 2020-11-18 Confidential / Draft Cinterion TX62-W(-B)/TX82-W Hardware Interface Description 3.4 Power Supply 104 Page 99 of 144 3.4.2 Minimizing Power Losses For TX82-W only: When designing the power supply for your application (and with GSM en-

abled) please pay specific attention to power losses. Ensure that the input voltage VBATT+ never drops below 3.1V on the TX82-W board, not even in a GSM transmit burst where current con-

sumption can rise (for peak values see the power supply ratings listed in Section 3.4.1). Transmit burst Transmit burst BATT+

Min. 3.1V Ripple Drop Figure 45: Power supply limits during transmit burst 3.4.3 Measuring the Supply Voltage (VBATT+) To measure the supply voltage VBATT+ it is possible to define two reference points GND and BATT+. GND and BATT+ should be a test pad on the external application the module is mount-

ed on. The eternal GND reference point has to be connected to and positioned close to the SMT application interfaces GND pad F17 and the external BATT+ reference point has to be connected to and positioned close to the SMT application interfaces BATT+ pads G15 and G16 (BATT+RF) or H15 and H16 (BATT+BB) as shown in Figure 46. External application Reference point BATT+:

External test pad connected to and positioned closely to BATT+

pad G15, H15, H16 or G16. Reference point GND:

External test pad connected to and positioned closely to GND pad F17 Figure 46: Position of reference points BATT+ and GND t TX62-W_TX62-W-B_TX82-W_HID_v00.022a 2020-11-18 Confidential / Draft Cinterion TX62-W(-B)/TX82-W Hardware Interface Description 3.5 Operating Temperatures 104 Page 100 of 144 3.4.4 Monitoring Power Supply by AT Command To monitor the supply voltage you can also use the AT^SBV command which returns the value related to the reference points BATT+ and GND. The module continuously measures the voltage at intervals depending on the operating mode of the RF interface. The duration of measuring ranges from 0.5 seconds in TALK/DATA mode to 50 seconds when TX62/TX82 is in IDLE mode or Limited Service (deregistered). The dis-

played voltage (in mV) is averaged over the last measuring period before the AT^SBV com-

mand was executed. If the measured voltage drops below or rises above the voltage shutdown thresholds, the mod-

ule will send an "^SBC" URC and shut down (for details see Section 3.2.5). 3.5 Operating Temperatures Please note that the modules lifetime, i.e., the MTTF (mean time to failure) may be reduced, if operated outside the extended temperature range. Table 20: Board temperature Parameter Normal operation Extended operation1 Automatic shutdown2 Min

-30

-40 Typ Max

+85

+90 Unit C C C Temperature measured on TX62/TX82 board

<-40

>+90 1. Extended operation allows normal mode speech calls or data transmission for limited time. Within the extended temperature range (outside the normal operating temperature range) the specified electrical characteristics may be in- or decreased. 2. Due to temperature measurement uncertainty, a tolerance of 3C on the thresholds may occur. See also Section 3.2.5 for information about the NTC for on-board temperature measurement, automatic thermal shutdown and alert messages. Note: Within the specified operating temperature ranges the board temperature may vary to a great extent depending on operating mode, used frequency band, radio output power and cur-

rent supply voltage. The below Table 21 lists the ambient temperature ranges the TX62/TX82 is able to operate in. Table 21: Ambient temperature Parameter Normal operation (GSM) Normal operation (LTE) Min

-40

-40 Typ Max

+60

+70 Unit C C t TX62-W_TX62-W-B_TX82-W_HID_v00.022a 2020-11-18 Confidential / Draft Cinterion TX62-W(-B)/TX82-W Hardware Interface Description 3.6 Electrostatic Discharge 104 Page 101 of 144 3.6 Electrostatic Discharge The module is not protected against Electrostatic Discharge (ESD) in general. Consequently, it is subject to ESD handling precautions that typically apply to ESD sensitive components. Proper ESD handling and packaging procedures must be applied throughout the processing, handling and operation of any application that incorporates a TX62/TX82 module. Special ESD protection provided on TX62/TX82:

Main antenna interface: Inductor/capacitor BATT+: Inductor/capacitor An example for an enhanced ESD protection for the SIM interface is given in Section 2.1.6.1. TX62/TX82 has been tested according to group standard ETSI EN 301 489-1 (see Table 30). Electrostatic values can be gathered from the following table. Specification/Requirements Contact discharge Air discharge Table 22: Electrostatic values ETSI EN 301 489-1 Main antenna interface BATT+

All other interfaces 4kV 4kV 1kV 8kV 8kV n.a. JEDEC JESD22-A114D (Human Body Model, Test conditions: 1.5 k, 100 pF) Note: The values may vary with the individual application design. For example, it matters whether or not the application platform is grounded over external devices like a computer or other equipment, such as the Thales reference application described in Chapter 5. 3.6.1 ESD Protection for RF Antenna Interface The following Figure 47 shows how to implement an external ESD protection for the RF anten-

na interface with either a T pad or PI pad attenuator circuit (for RF line routing design see also Section 2.2.3). T pad attenuator circuit PI pad attenuator circuit Main Antenna Main Antenna 18pF 18pF 4.7pF ANT_GSM

(Pad 59) ANT_GSM

(Pad 59) 22nH 18nH 18nH Figure 47: ESD protection for RF antenna interface Recommended inductor types for the above sample circuits: Size 0402 SMD from Panasonic ELJRF series (22nH and 18nH inductors) or Murata LQW15AN18NJ00 (18nH inductors only). t TX62-W_TX62-W-B_TX82-W_HID_v00.022a 2020-11-18 Confidential / Draft Cinterion TX62-W(-B)/TX82-W Hardware Interface Description 3.7 Blocking against RF on Interface Lines 104 Page 102 of 144 3.7 Blocking against RF on Interface Lines To reduce EMI issues there are serial resistors, or capacitors to GND, implemented on the module for the ignition, emergency restart, and SIM interface lines (cp. Section 2.4). However, all other signal lines have no EMI measures on the module and there are no blocking measures at the modules interface to an external application. Dependent on the specific application design, it might be useful to implement further EMI mea-

sures on some signal lines at the interface between module and application. These measures are described below. There are five possible variants of EMI measures (A-E) that may be implemented between module and external application depending on the signal line (see Figure 48 and Table 23). Pay attention not to exceed the maximum input voltages and prevent voltage overshots if using in-

ductive EMC measures. The maximum value of the serial resistor should be lower than 1k on the signal line. The max-

imum value of the capacitor should be lower than 50pF on the signal line. Please observe the electrical specification of the modules SMT application interface and the external applications interface. SMT Application SMT Application EMI measures A EMI measures B C SMT Application SMT Application EMI measures C EMI measures D GND L R R L C C GND GND SMT Application EMI measures E Figure 48: EMI circuits Note: In case the application uses an internal GSM/LTE antenna that is implemented close to the TX62/TX82 module, Thales strongly recommends sufficient EMI measures, e.g. of type B or C, for each digital input or output. t TX62-W_TX62-W-B_TX82-W_HID_v00.022a 2020-11-18 Confidential / Draft Cinterion TX62-W(-B)/TX82-W Hardware Interface Description 3.7 Blocking against RF on Interface Lines 104 Page 103 of 144 The following table lists for each signal line at the modules SMT application interface the EMI measures that may be implemented. Table 23: EMI measures on the application interface Signal name EMI measures Remark A C E The external capacitor should be not higher than 1nF. The value of the capacitor depends on the external application and should be placed close to SIM connector/

eUICC. The external capacitor should be not higher than 10pF. The value of the capacitor depends on the external application and should be placed close to SIM connector/

eUICC. CCIN CCRST CCIO CCCLK VUSB RXD0 TXD0 CTS0 RTS0 DTR0 DCD0 DSR0 RXD1 TXD1 RTS1 CTS1 RING0 FST_SHDN STATUS SIM_SWITCH SUSPEND_MON GPIO6,7,20-23,25 I2CDAT1 I2CCLK1 V180 BATT+RF (pad G15, G16) BATT+BB (pad H15, H16) D x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x B x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x 1. Available with embedded processing option only. The rising signal edge is reduced with an additional capacitor. Measures required if BATT+RF is close to internal GSM antenna -

e.g., 39pF blocking capacitor to ground t TX62-W_TX62-W-B_TX82-W_HID_v00.022a 2020-11-18 Confidential / Draft Cinterion TX62-W(-B)/TX82-W Hardware Interface Description 3.8 Reliability Characteristics 104 Page 104 of 144 3.8 Reliability Characteristics The test conditions stated below are an extract of the complete test specifications. Table 24: Summary of reliability test conditions Type of test Conditions Vibration Frequency range: 10-20Hz; acceleration: 5g Frequency range: 20-500Hz; acceleration: 20g Duration: 20h per axis; 3 axes Standard DIN IEC 60068-2-61 Shock half-sinus DIN IEC 60068-2-27 Acceleration: 500g Shock duration: 1ms 1 shock per axis 6 positions ( x, y and z) Dry heat Temperature change (shock) Damp heat cyclic Temperature: +70 2C Test duration: 16h Humidity in the test chamber: < 50%

Low temperature: -40C 2C High temperature: +85C 2C Changeover time: < 30s (dual chamber system) Test duration: 1h Number of repetitions: 100 High temperature: +55C 2C Low temperature: +25C 2C Humidity: 93% 3%

Number of repetitions: 6 Test duration: 12h + 12h Cold (constant exposure) Temperature: -40 2C Test duration: 16h EN 60068-2-2 Bb ETS 300 019-2-7 DIN IEC 60068-2-14 Na ETS 300 019-2-7 DIN IEC 60068-2-30 Db ETS 300 019-2-5 DIN IEC 60068-2-1 1. For reliability tests in the frequency range 20-500Hz the Standards acceleration reference value was increased to 20g. t TX62-W_TX62-W-B_TX82-W_HID_v00.022a 2020-11-18 Confidential / Draft Cinterion TX62-W(-B)/TX82-W Hardware Interface Description 4 Mechanical Dimensions, Mounting and Packaging 125 Page 105 of 144 4 Mechanical Dimensions, Mounting and Packaging 4.1 Mechanical Dimensions of TX62-W Figure 49 shows the top and bottom view of TX62-W and provides an overview of the board's mechanical dimensions. For further details see Figure 50. Figure 51 shows the area at the modules bottom side where possible markings might be printed. Product label Top view Bottom view Figure 49: TX62-W top and bottom view t TX62-W_TX62-W-B_TX82-W_HID_v00.022a 2020-11-18 Confidential / Draft Cinterion TX62-W(-B)/TX82-W Hardware Interface Description 4.1 Mechanical Dimensions of TX62-W 125 Page 106 of 144 Figure 50: Dimensions of TX62-W (all dimensions in mm) Restricted Area Do not put any solder resist opening marks or pencil line inside this area, and keep at least 0.42mm clearance from specified marks to LGA pads Figure 51: Dimensions of area for possible markings TX62-W (bottom view) t TX62-W_TX62-W-B_TX82-W_HID_v00.022a 2020-11-18 Confidential / Draft Cinterion TX62-W(-B)/TX82-W Hardware Interface Description 4.2 Mechanical Dimensions of TX82-W and TX62-W-B 125 Page 107 of 144 4.2 Mechanical Dimensions of TX82-W and TX62-W-B Figure 52 shows the top and bottom view of TX82-W and TX62-W-B, and provides an overview of the board's mechanical dimensions. For further details see Figure 53. Figure 54 shows the area at the modules bottom side where possible markings might be printed. Product label Top view Bottom view Figure 52: TX82-W top and bottom view t TX62-W_TX62-W-B_TX82-W_HID_v00.022a 2020-11-18 Confidential / Draft Cinterion TX62-W(-B)/TX82-W Hardware Interface Description 4.2 Mechanical Dimensions of TX82-W and TX62-W-B 125 Page 108 of 144 Figure 53: Dimensions of TX82-W and TX62-W-B (all dimensions in mm) Restricted Area Do not put any solder resist opening marks or pencil line inside this area, and keep at least 0.42mm clearance from specified marks to LGA pads Figure 54: Dimensions of area for possible markings TX82-W and TX62-W-B (bottom view) t TX62-W_TX62-W-B_TX82-W_HID_v00.022a 2020-11-18 Confidential / Draft Cinterion TX62-W(-B)/TX82-W Hardware Interface Description 4.3 Mounting TX62/TX82 onto the Application Platform 125 Page 109 of 144 4.3 Mounting TX62/TX82 onto the Application Platform This section describes how to mount TX62/TX82 onto the PCBs, including land pattern and stencil design, board-level characterization, soldering conditions, durability and mechanical handling. For more information on issues related to SMT module integration see also [4]. Note: To avoid short circuits between signal tracks on an external application's PCB and vari-

ous markings at the bottom side of the module (see Figure 51 and Figure 54), it is recommend-

ed not to route the signal tracks on the top layer of an external PCB directly under the module, or at least to ensure that signal track routes are sufficiently covered with solder resist. 4.3.1 SMT PCB Assembly 4.3.1.1 Land Pattern and Stencil The land pattern and stencil design as shown below is based on Thales characterizations for lead-free solder paste on a four-layer test PCB and a 110 micron thick stencil. The land pattern given in Figure 55 and Figure 56 reflects the modules pad layout, including signal pads and ground pads (for pad assignment see Section 2.1.1). Figure 55: Land pattern TX62-W (top view) t TX62-W_TX62-W-B_TX82-W_HID_v00.022a 2020-11-18 Confidential / Draft Cinterion TX62-W(-B)/TX82-W Hardware Interface Description 4.3 Mounting TX62/TX82 onto the Application Platform 125 Page 110 of 144

. Figure 56: Land pattern TX82-W and TX62-W-B (top view) The stencil design illustrated in Figure 57 and Figure 58 is recommended by Thales as a result of extensive tests with Thales Daisy Chain modules. The central ground pads are primarily intended for stabilizing purposes, and may show some more voids than the application interface pads at the module's rim. This is acceptable, since they are electrically irrelevant. t TX62-W_TX62-W-B_TX82-W_HID_v00.022a 2020-11-18 Confidential / Draft Cinterion TX62-W(-B)/TX82-W Hardware Interface Description 4.3 Mounting TX62/TX82 onto the Application Platform 125 Page 111 of 144 Figure 57: Recommended design for 110m thick stencil for TX62-W (top view) Figure 58: Recommended design for 110m thick stencil for TX82-W and TX62-W-B (top view) 4.3.1.2 Board Level Characterization Board level characterization issues should also be taken into account if devising an SMT pro-

cess. Characterization tests should attempt to optimize the SMT process with regard to board level reliability. This can be done by performing the following physical tests on sample boards: Peel test, bend test, tensile pull test, drop shock test and temperature cycling. Sample surface mount checks are described in [4]. t TX62-W_TX62-W-B_TX82-W_HID_v00.022a 2020-11-18 Confidential / Draft Cinterion TX62-W(-B)/TX82-W Hardware Interface Description 4.3 Mounting TX62/TX82 onto the Application Platform 125 Page 112 of 144 It is recommended to characterize land patterns before an actual PCB production, taking indi-

vidual processes, materials, equipment, stencil design, and reflow profile into account. For land and stencil pattern design recommendations see also Section 4.3.1.1. Optimizing the solder stencil pattern design and print process is necessary to ensure print uniformity, to decrease sol-

der voids, and to increase board level reliability. Daisy chain modules for SMT characterization are available on request. For details refer to [4]. Generally, solder paste manufacturer recommendations for screen printing process parame-

ters and reflow profile conditions should be followed. Maximum ratings are described in Section 4.3.3. 4.3.2 Moisture Sensitivity Level TX62/TX82 comprises components that are susceptible to damage induced by absorbed mois-

ture. Thaless TX62/TX82 module complies with the latest revision of the IPC/JEDEC J-STD-020 Standard for moisture sensitive surface mount devices and is classified as MSL 4. For additional moisture sensitivity level (MSL) related information see Section 4.3.4 and Sec-

tion 4.4.2. t TX62-W_TX62-W-B_TX82-W_HID_v00.022a 2020-11-18 Confidential / Draft Cinterion TX62-W(-B)/TX82-W Hardware Interface Description 4.3 Mounting TX62/TX82 onto the Application Platform 125 4.3.3 Soldering Conditions and Temperature Page 113 of 144 4.3.3.1 Reflow Profile tP tL TP TL e r u t a r e p m e T TSmax TSmin tS Preheat t to maximum Time Figure 59: Reflow Profile Table 25: Reflow temperature ratings1 Profile Feature Pb-Free Assembly Preheat & Soak Temperature Minimum (TSmin) Temperature Maximum (TSmax) Time (tSmin to tSmax) (tS) Average ramp up rate (TSmax to TP) Liquidous temperature (TL) Time at liquidous (tL) 150C 180C 60-120 seconds 3K/second max. 217C 50-90 seconds 245C +0/-5C 30 seconds max. Peak package body temperature (TP) Time (tP) within 5 C of the peak package body temperature (TP) Average ramp-down rate (TP to TL) 1 K/second max. Time 25C to maximum temperature 8 minutes max. 1. Please note that the reflow profile features and ratings listed above are based on the joint industry stan-

dard IPC/JEDEC J-STD-020D.1, and are as such meant as a general guideline. For more information on reflow profiles and their optimization please refer to [4]. t TX62-W_TX62-W-B_TX82-W_HID_v00.022a 2020-11-18 Confidential / Draft Cinterion TX62-W(-B)/TX82-W Hardware Interface Description 4.3 Mounting TX62/TX82 onto the Application Platform 125 Page 114 of 144 4.3.3.2 Maximum Temperature and Duration The following limits are recommended for the SMT board-level soldering process to attach the module:

A maximum module temperature of 240C. This specifies the temperature as measured at the modules top side. A maximum duration of 15 seconds at this temperature. Please note that while the solder paste manufacturers' recommendations for best temperature and duration for solder reflow should generally be followed, the limits listed above must not be exceeded. TX62/TX82 is specified for one soldering cycle only. Once TX62/TX82 is removed from the ap-

plication, the module will very likely be destroyed and cannot be soldered onto another appli-

cation. t TX62-W_TX62-W-B_TX82-W_HID_v00.022a 2020-11-18 Confidential / Draft Cinterion TX62-W(-B)/TX82-W Hardware Interface Description 4.3 Mounting TX62/TX82 onto the Application Platform 125 Page 115 of 144 4.3.4 Durability and Mechanical Handling 4.3.4.1 Storage Conditions TX62/TX82 modules, as delivered in tape and reel carriers, must be stored in sealed, moisture barrier anti-static bags. The conditions stated below are only valid for modules in their original packed state in weather protected, non-temperature-controlled storage locations. Normal stor-

age time under these conditions is 12 months maximum. Table 26: Storage conditions Type Condition Unit Reference Air temperature: Low High Humidity relative: Low High Air pressure: Low High 10 90 at 40C

-25

+40 70 106 1.0 IPC/JEDEC J-STD-033A IPC/JEDEC J-STD-033A IEC TR 60271-3-1: 1K4 IEC TR 60271-3-1: 1K4 IEC TR 60271-3-1: 1K4 C

kPa m/s

Movement of surrounding air Water: rain, dripping, icing and frosting Not allowed

Radiation:

Solar Heat 1120 600 W/m2 ETS 300 019-2-1: T1.2, IEC 60068-2-2 Bb ETS 300 019-2-1: T1.2, IEC 60068-2-2 Bb Chemically active substances IEC TR 60271-3-1: 1C1L Mechanically active substances Not IEC TR 60271-3-1: 1S1 Not recommended recommended 1.5 5 2-9 9-200 mm m/s2 Hz semi-sinusoidal 1 50 ms m/s2 IEC TR 60271-3-1: 1M2 IEC 60068-2-27 Ea Vibration sinusoidal:

Displacement Acceleration Frequency range Shocks:

Shock spectrum Duration Acceleration t TX62-W_TX62-W-B_TX82-W_HID_v00.022a 2020-11-18 Confidential / Draft Cinterion TX62-W(-B)/TX82-W Hardware Interface Description 4.3 Mounting TX62/TX82 onto the Application Platform 125 Page 116 of 144 4.3.4.2 Processing Life TX62/TX82 must be soldered to an application within 72 hours after opening the moisture bar-

rier bag (MBB) it was stored in. As specified in the IPC/JEDEC J-STD-033 Standard, the manufacturing site processing the modules should have ambient temperatures below 30C and a relative humidity below 60%. 4.3.4.3 Baking Baking conditions are specified on the moisture sensitivity label attached to each MBB (see Figure 65 for details):

It is not necessary to bake TX62/TX82, if the conditions specified in Section 4.3.4.1 and Section 4.3.4.2 were not exceeded. It is necessary to bake TX62/TX82, if any condition specified in Section 4.3.4.1 and Section 4.3.4.2 was exceeded. If baking is necessary, the modules must be put into trays that can be baked to at least 125C. Devices should not be baked in tape and reel carriers at any temperature. 4.3.4.4 Electrostatic Discharge Electrostatic discharge (ESD) may lead to irreversible damage for the module. It is therefore advisable to develop measures and methods to counter ESD and to use these to control the electrostatic environment at manufacturing sites. Please refer to Section 3.6 for further information on electrostatic discharge. t TX62-W_TX62-W-B_TX82-W_HID_v00.022a 2020-11-18 Confidential / Draft Cinterion TX62-W(-B)/TX82-W Hardware Interface Description 4.4 Packaging 125 Page 117 of 144 4.4 Packaging 4.4.1 Tape and Reel 4.4.1.1 Orientation The single-feed tape carrier for TX62/TX82 is illustrated in Figure 60. The figure also shows the proper part orientation. The tape width is 24mm and the TX62/TX82 modules are placed on the tape with a 22mm pitch. The reels are 330mm in diameter with a core diameter of 99.50mm. Each reel contains 500 modules. A0: 15.80mm B0: 15.80mm K0: 2.80mm F: 11.50mm W: 24.00mm T: 0.30mm D0: 1.50mm P: 20.00mm D1: 1.5mm P0: 4.00mm E: 1.75mm P2: 2.00mm TBD. A: 2.50mm T: 2.30mm B: 11.00mm C1: 330mm D: 99.50mm H: 24.50mm Figure 60: Carrier tape t TX62-W_TX62-W-B_TX82-W_HID_v00.022a 2020-11-18 Confidential / Draft Cinterion TX62-W(-B)/TX82-W Hardware Interface Description 4.4 Packaging 125 Page 118 of 144 Figure 61: Reel direction 4.4.1.2 Barcode Label A barcode label provides detailed information on the tape and its contents. It is attached to the reel. Barcode label Figure 62: Barcode label on tape reel t TX62-W_TX62-W-B_TX82-W_HID_v00.022a 2020-11-18 Confidential / Draft Cinterion TX62-W(-B)/TX82-W Hardware Interface Description 4.4 Packaging 125 Page 119 of 144 Figure 63: Barcode label on tape reel - layout Variables on the label are explained in Table 27. t TX62-W_TX62-W-B_TX82-W_HID_v00.022a 2020-11-18 Confidential / Draft Cinterion TX62-W(-B)/TX82-W Hardware Interface Description 4.4 Packaging 125 Page 120 of 144 4.4.2 Shipping Materials TX62/TX82 is distributed in tape and reel carriers. The tape and reel carriers used to distribute TX62/TX82 are packed as described below, including the following required shipping materials:

Moisture barrier bag, including desiccant and humidity indicator card Transportation box 4.4.2.1 Moisture Barrier Bag The tape reels are stored inside a moisture barrier bag (MBB), together with a humidity indica-

tor card and desiccant pouches - see Figure 64. The bag is ESD protected and delimits mois-

ture transmission. It is vacuum-sealed and should be handled carefully to avoid puncturing or tearing. The bag protects the TX62/TX82 modules from moisture exposure. It should not be opened until the devices are ready to be soldered onto the application. Figure 64: Moisture barrier bag (MBB) with imprint The label shown in Figure 65 summarizes requirements regarding moisture sensitivity, includ-

ing shelf life and baking requirements. It is attached to the outside of the moisture barrier bag. Variables on the label are explained in Table 27. t TX62-W_TX62-W-B_TX82-W_HID_v00.022a 2020-11-18 Confidential / Draft Cinterion TX62-W(-B)/TX82-W Hardware Interface Description 4.4 Packaging 125 Page 121 of 144 Figure 65: Moisture Sensitivity Label t TX62-W_TX62-W-B_TX82-W_HID_v00.022a 2020-11-18 Confidential / Draft Cinterion TX62-W(-B)/TX82-W Hardware Interface Description 4.4 Packaging 125 Page 122 of 144 MBBs contain one or more desiccant pouches to absorb moisture that may be in the bag. The humidity indicator card described below should be used to determine whether the enclosed components have absorbed an excessive amount of moisture. The desiccant pouches should not be baked or reused once removed from the MBB. The humidity indicator card is a moisture indicator and is included in the MBB to show the ap-

proximate relative humidity level within the bag. Sample humidity cards are shown in Figure 66. If the components have been exposed to moisture above the recommended limits, the units will have to be rebaked. Figure 66: Humidity Indicator Card - HIC A baking is required if the humidity indicator inside the bag indicates 10% RH or more. t TX62-W_TX62-W-B_TX82-W_HID_v00.022a 2020-11-18 Confidential / Draft Cinterion TX62-W(-B)/TX82-W Hardware Interface Description 4.4 Packaging 125 Page 123 of 144 4.4.2.2 Transportation Box Tape and reel carriers are distributed in a box, marked with a barcode label for identification purposes. A box contains two reels with 500 modules each. 1 2 4 5 6 7 12 13 1 2 3 4 5 6 7 8 9 10 11 12 13 14 3 8 9 10 11 14 Figure 67: Sample of VP box label Table 27: VP Box label information No. Information Cinterion logo Product name Product ordering number Package ID number of VP box (format may vary depending on the product) Package ID barcode (Code 128) Package ID Reel 1 (format may vary depending on the product) Package ID Reel 2 (format may vary depending on the product) Quantity of the modules inside the VP box (max. 1000 pcs) Country of production Der Grne Punkt (Green Dot) symbol Chinese RoHS symbol (see Table 32) CE logo (CE mark on VP box label is present only for modules with CE imprinted on the shielding) European Article Number (EAN-13) barcode European Article Number, consists of 13 digits (EAN-13) t TX62-W_TX62-W-B_TX82-W_HID_v00.022a 2020-11-18 Confidential / Draft Cinterion TX62-W(-B)/TX82-W Hardware Interface Description 4.4 Packaging 125 Page 124 of 144 4.4.3 Trays (TBD) If small module quantities are required, e.g., for test and evaluation purposes, TX62/TX82 may be distributed in trays (for dimensions see Figure 71). The small quantity trays are an alternative to the single-feed tape carriers normally used. However, the trays are not designed for machine processing. They contain modules to be (hand) soldered onto an external application 1:1,5 Figure 68: Small quantity tray Trays are packed and shipped in the same way as tape carriers, including a moisture barrier bag with desiccant and humidity indicator card as well as a transportation box (see also Section 4.4.2). Figure 69: Tray to ship odd module amounts Figure 70: Trays with packaging materials t TX62-W_TX62-W-B_TX82-W_HID_v00.022a 2020-11-18 Confidential / Draft Cinterion TX62-W(-B)/TX82-W Hardware Interface Description 4.4 Packaging 125 Page 125 of 144 T.B.D. Figure 71: Tray dimensions (TBD.) t TX62-W_TX62-W-B_TX82-W_HID_v00.022a 2020-11-18 Confidential / Draft Cinterion TX62-W(-B)/TX82-W Hardware Interface Description 5 Regulatory and Type Approval Information 132 Page 126 of 144 5 Regulatory and Type Approval Information 5.1 Directives and Standards (TBD.) TX62/TX82 is designed to comply with the directives and standards listed below. It is the responsibility of the application manufacturer to ensure compliance of the final product with all provisions of the applicable directives and standards as well as with the technical spec-

ifications provided in the "Cinterion TX62-W(-B)/TX82-W Hardware Interface Description".1 Table 28: Directives 2014/53/EU Directive of the European Parliament and of the Council of 16 April 2014 on the harmonisation of the laws of the Member States relating to the mak-

ing available on the market of radio equipment and repealing Directive 1999/5/EC. The product is labeled with the CE conformity mark 2002/95/EC (RoHS 1) 2011/65/EC (RoHS 2) Directive of the European Parliament and of the Council of 27 January 2003 (and revised on 8 June 2011) on the restriction of the use of certain hazardous substances in electrical and electronic equipment (RoHS) Table 29: Standards of North American type approval CFR Title 47 Code of Federal Regulations, Part 22 and Part 24 (Telecommunications, PCS); US Equipment Authorization FCC OET Bulletin 65

(Edition 97-01) Evaluating Compliance with FCC Guidelines for Human Exposure to Radiofrequency Electromagnetic Fields UL 60 950-1 Product Safety Certification (Safety requirements) NAPRD.03 V5.35 Overview of PCS Type certification review board Mobile Equipment Type Certification and IMEI control PCS Type Certification Review board (PTCRB) RSS132 (Issue2) RSS133 (Issue5) Canadian Standard Table 30: Standards of European type approval 3GPP TS 51.010-1 Digital cellular telecommunications system (Release 7); Mobile Station

(MS) conformance specification;

GCF-CC V3.71 Global Certification Forum - Certification Criteria ETSI EN 301 511 V12.5.1 Global System for Mobile communications (GSM); Mobile Stations (MS) equipment; Harmonized Standard covering the essential requirements of article 3.2 of Directive 2014/53/EU ETSI EN 301 908-1 V11.1.1 IMT cellular networks; Harmonised Standard covering the essential require-

ments of article 3.2 of the Directive 2014/53/EU; Part 1: Introduction and common requirements 1. Manufacturers of applications which can be used in the US shall ensure that their applications have a PTCRB approval. For this purpose they can refer to the PTCRB approval of the respective module. t TX62-W_TX62-W-B_TX82-W_HID_v00.022a 2020-11-18 Confidential / Draft Cinterion TX62-W(-B)/TX82-W Hardware Interface Description 5.1 Directives and Standards (TBD.) 132 Page 127 of 144 Table 30: Standards of European type approval ETSI EN 301 908-2 V11.1.2 ETSI EN 301 489-52 V1.1.0 Draft ETSI EN 301 489-

01 V2.2.0 ETSI EN 301489-19 V2.1.0 ETSI EN 303 413 V1.1.1 EN 60950-1: 2006

+A11:2009+A1:2010+A 12:2011+A2:2013 IMT cellular networks; Harmonised Standard covering the essential require-

ments of article 3.2 of the Directive 2014/53/EU; Part 2: CDMA Direct Spread (UTRA FDD) User Equipment (UE) Electromagnetic Compatibility (EMC) standard for radio equipment and ser-

vices; Part 52: Specific conditions for Cellular Communication Mobile and portable (UE) radio and ancillary equipment; Harmonized Standard cover-

ing the essential requirements of article 3.1(b) of Directive 2014/53/EU ElectroMagnetic Compatibility (EMC) standard for radio equipment and ser-

vices; Part 1: Common technical requirements; Harmonized Standard cov-

ering the essential requirements of article 3.1(b) of Directive 2014/53/EU and the essential requirements of article 6 of Directive 2014/30/EU ElectroMagnetic Compatibility (EMC) standard for radio equipment and ser-

vices; Part 19: Specific conditions for Receive Only Mobile Earth Stations

(ROMES) operating in the 1,5 GHz band providing data communications and GNSS receivers operating in the RNSS band (ROGNSS) providing positioning, navigation, and timing data; Harmonised Standard covering the essential requirements of article 3.1(b) of Directive 2014/53/EU Satellite Earth Stations and Systems (SES); Global Navigation Satellite System (GNSS) receivers; Radio equipment operating in the 1 164 MHz to 1 300 MHz and 1 559 MHz to 1 610 MHz frequency bands; Harmonised Standard covering the essential requirements of article 3.2 of Directive 2014/53/EU Safety of information technology equipment Table 31: Requirements of quality IEC 60068 Environmental testing DIN EN 60529 IP codes EN 62311:2008 Assessment of electronic and electrical equipment related to human expo-

sure restrictions for electromagnetic fields (0 Hz - 300 GHz) Table 32: Standards of the Ministry of Information Industry of the Peoples Republic of China SJ/T 11363-2006 SJ/T 11364-2006 Requirements for Concentration Limits for Certain Hazardous Sub-

stances in Electronic Information Products (2006-06). Marking for Control of Pollution Caused by Electronic Information Products (2006-06). According to the Chinese Administration on the Control of Pollution caused by Electronic Information Products

(ACPEIP) the EPUP, i.e., Environmental Protection Use Period, of this product is 20 years as per the symbol shown here, unless otherwise marked. The EPUP is valid only as long as the product is operated within the operating limits described in the Thales Hardware Interface Description. Please see Table 33 for an overview of toxic or hazardous substances or elements that might be contained in product parts in concentrations above the limits defined by SJ/T 11363-2006. t TX62-W_TX62-W-B_TX82-W_HID_v00.022a 2020-11-18 Confidential / Draft Cinterion TX62-W(-B)/TX82-W Hardware Interface Description 5.1 Directives and Standards (TBD.) 132 Page 128 of 144 Table 33: Toxic or hazardous substances or elements with defined concentration limits t TX62-W_TX62-W-B_TX82-W_HID_v00.022a 2020-11-18 Confidential / Draft Cinterion TX62-W(-B)/TX82-W Hardware Interface Description 5.2 SAR requirements specific to portable mobiles 132 Page 129 of 144 5.2 SAR requirements specific to portable mobiles Mobile phones, PDAs or other portable transmitters and receivers incorporating a module must be in accordance with the guidelines for human exposure to radio frequency energy. This re-

quires the Specific Absorption Rate (SAR) of portable TX62/TX82 based applications to be evaluated and approved for compliance with national and/or international regulations. Since the SAR value varies significantly with the individual product design manufacturers are advised to submit their product for approval if designed for portable use. For European and USmarkets the relevant directives are mentioned below. It is the responsibility of the manufac-

turer of the final product to verify whether or not further standards, recommendations or direc-

tives are in force outside these areas. Products intended for sale on US markets ES 59005/ANSI C95.1 Considerations for evaluation of human exposure to Electromagnetic Fields (EMFs) from Mobile Telecommunication Equipment (MTE) in the frequency range 30MHz - 6GHz Products intended for sale on European markets EN 50360 EN 62311:2008 Product standard to demonstrate the compliance of mobile phones with the basic restrictions related to human exposure to electromagnetic fields (300MHz - 3GHz) Assessment of electronic and electrical equipment related to human expo-sure restrictions for electromagnetic fields (0 Hz - 300 GHz) Please note that SAR requirements are specific only for portable devices and not for mobile devices as defined below:

Portable device:

A portable device is defined as a transmitting device designed to be used so that the radi-

ating structure(s) of the device is/are within 20 centimeters of the body of the user. Mobile device:

A mobile device is defined as a transmitting device designed to be used in other than fixed locations and to generally be used in such a way that a separation distance of at least 20 centimeters is normally maintained between the transmitter's radiating structure(s) and the body of the user or nearby persons. In this context, the term ''fixed location'' means that the device is physically secured at one location and is not able to be easily moved to another location. t TX62-W_TX62-W-B_TX82-W_HID_v00.022a 2020-11-18 Confidential / Draft Cinterion TX62-W(-B)/TX82-W Hardware Interface Description 5.3 Reference Equipment for Type Approval 132 Page 130 of 144 5.3 Reference Equipment for Type Approval The Thales reference setup submitted to type approve TX62/TX82 (including a special approv-

al adapter for the DSB75) is shown in the following figure1:

LTE/GSM BaseStation GNSS Antenna Main Antenna ASC0 ASC1 PC Power Supply DSB75Adapter SIMCard SMA SMA SMA USB DSB75 Eval_Board Eval_Board TX62/TX82 TX62/TX82 Figure 72: Reference equipment for type approval 1. For RF performance tests a mini-SMT/U.FL to SMA adapter with attached 6dB coaxial attenuator is cho-

sen to connect the evaluation module directly to the LTE/GSM/GNSS test equipment instead of employ-

ing the SMA antenna connectors on the TX62/TX82-DSB75 adapter as shown in Figure 72. The following products are recommended:

Hirose SMA-Jack/U.FL-Plug conversion adapter HRMJ-U.FLP(40)

(for details see http://www.hirose-connectors.com/ or http://www.farnell.com/

Aeroflex Weinschel Fixed Coaxial Attenuator Model 3T/4T

(for details see http://www.aeroflex.com/ams/weinschel/pdfiles/wmod3&4T.pdf) t TX62-W_TX62-W-B_TX82-W_HID_v00.022a 2020-11-18 Confidential / Draft Cinterion TX62-W(-B)/TX82-W Hardware Interface Description 5.4 Compliance with FCC and ISED Rules and Regulations 132 Page 131 of 144 5.4 Compliance with FCC and ISED Rules and Regulations The Equipment Authorization Certification for the Thales reference application described in Section 5.3 will be registered under the following identifiers:

FCC Identifier: QIPTX82-W (not granted yet) ISED Certification Number: 7830A-TX82W (not granted yet) Granted to THALES DIS AIS Deutschland GmbH FCC Identifier: QIPTX62-W (not granted yet) ISED Certification Number: 7830A-TX62W (not granted yet) Granted to THALES DIS AIS Deutschland GmbH FCC Identifier: QIPTX62-W-B (not granted yet) ISED Certification Number: 7830A-TX62WB (not granted yet) Granted to THALES DIS AIS Deutschland GmbH Manufacturers of mobile or fixed devices incorporating TX62/TX82 modules are authorized to use the FCC Grants and ISED Certificates of the TX62/TX82 modules for their own final prod-

ucts according to the conditions referenced in these documents. In this case, an FCC/ IC label of the module shall be visible from the outside, or the host device shall bear a second label stat-

ing "Contains FCC ID: QIPTX82-W" or "Contains FCC ID: QIPTX62-W", and accordingly Con-

tains IC: 7830A-TX82W or Contains IC: 7830A-TX62W. The integration is limited to fixed or mobile categorized host devices, where a separation distance between the antenna and any person of min. 20cm can be assured during normal operating conditions. For mobile and fixed operation configurations the antenna gain, including cable loss, must not exceed the limits TBD. dBi (850MHz) and TBD. dBi (1900MHz). IMPORTANT:

Manufacturers of portable applications incorporating TX62/TX82 modules are required to have their final product certified and apply for their own FCC Grant and ISED Certificate related to the specific portable mobile. This is mandatory to meet the SAR requirements for portable mo-

biles (see Section 5.2 for detail). Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. Note: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules and with ISED license-exempt RSS standard(s). These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interfer-

ence to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or televi-

sion reception, which can be determined by turning the equipment off and on, the user is en-

couraged to try to correct the interference by one or more of the following measures:

Reorient or relocate the receiving antenna. Connect the equipment into an outlet on a circuit different from that to which the receiver is Increase the separation between the equipment and receiver. connected. Consult the dealer or an experienced radio/TV technician for help. t TX62-W_TX62-W-B_TX82-W_HID_v00.022a 2020-11-18 Confidential / Draft Cinterion TX62-W(-B)/TX82-W Hardware Interface Description 5.4 Compliance with FCC and ISED Rules and Regulations 132 Page 132 of 144 This Class B digital apparatus complies with Canadian ICES-003. If Canadian approval is requested for devices incorporating TX62/TX82 modules the below notes will have to be provided in the English and French language in the final user documen-

tation. Manufacturers/OEM Integrators must ensure that the final user documentation does not contain any information on how to install or remove the module from the final product. Notes (ISED):

(EN) This Class B digital apparatus complies with Canadian ICES-003 and RSS-210. Opera-

tion is subject to the following two conditions: (1) this device may not cause interference, and

(2) this device must accept any interference, including interference that may cause undesired operation of the device.

(FR) Cet appareil numrique de classe B est conforme aux normes canadiennes ICES-003 et RSS-210. Son fonctionnement est soumis aux deux conditions suivantes: (1) cet appareil ne doit pas causer d'interfrence et (2) cet appareil doit accepter toute interfrence, notamment les interfrences qui peuvent affecter son fonctionnement.

(EN) Radio frequency (RF) Exposure Information The radiated output power of the Wireless Device is below the Innovation, Science and Eco-

nomic Development Canada (ISED) radio frequency exposure limits. The Wireless Device should be used in such a manner such that the potential for human contact during normal op-

eration is minimized. This device has also been evaluated and shown compliant with the ISED RF Exposure limits under mobile exposure conditions. (antennas are greater than 20cm from a persons body).

(FR) Informations concernant l'exposltion aux frquences radio (RF) La puissance de sortie mise par l'appareil de sans fiI est infrieure la limite d'exposition aux frquences radio dInnovation, Sciences et Dveloppement conomique Canada (ISDE). Utili-

sez l'appareil de sans fil de faon minimiser les contacts humains lors du fonctionnement nor-

mal. Ce priphrique a galement t valu et dmontr conforme aux limites d'exposition aux RF d'ISDE dans des conditions d'exposition des appareils mobiles (les antennes se situent moins de 20cm du corps d'une personne). t TX62-W_TX62-W-B_TX82-W_HID_v00.022a 2020-11-18 Confidential / Draft Cinterion TX62-W(-B)/TX82-W Hardware Interface Description 6 Document Information 139 Page 133 of 144 6 Document Information 6.1 Revision History Preceding document: Cinterion TXx2-W Hardware Interface Description" v00.022 New document: "Cinterion TX62-W(-B)/TX82-W Hardware Interface Description" v00.022a Chapter What is new Adapted GSM voltage range (3.1V...4.6V) Throughout document 1.4 2.1.4 2.2.1 Revised block diagrams Figure 2, Figure 3, and Figure 4. Revised Figure 9, and changed Table 13 accordingly. Revised receiver input sensitivity ratings in Table 9 and Table 10. 3.2.2.2 Revised Figure 34. Preceding document: Cinterion TXx2-W Hardware Interface Description" v00.016 New document: "Cinterion TX62-W(-B)/TX82-W Hardware Interface Description" v00.022 Chapter What is new Throughout document Added details about the embedded processing option. Revised supported footprint for TX62-W-B. Replaced MIM with eUICC. 2.1.2 2.1.4 Revised Figure 9. Added signal properties for eUICC interface lines. 4.3.1.1 Revised stencil shown in Figure 58. 7.1 Updated ordering information. Preceding document: Cinterion TXx2-W Hardware Interface Description" v00.002 New document: "Cinterion TXx2-W Hardware Interface Description" v00.016 Chapter What is new Throughout document Added product TX82-W and TX62-W-B Added GPIO to Key Feature at a Glance 1.2 2.1.1 2.1.1 2.1.2 2.1.8 2.4 3.2.3 3.7 6.1 Added Table 1 for Pad Assignment of additional Pads of TX82-W Revised Pad Assignment regarding GPIO in Table 1, Table 2, Figure 5 and Figure 6 Revised Signal Properties regarding GPIO in Table 3 Added new chapter for GPIO Revised Sample Application regarding GPIO and USB in Figure 30 Revised Table 13 regarding GPIO, corrected some signal states Revised Table 23 regarding GPIO, removed USB signals Revised changes for document version 00.002 t TX62-W_TX62-W-B_TX82-W_HID_v00.022a 2020-11-18 Confidential / Draft Cinterion TX62-W(-B)/TX82-W Hardware Interface Description 6.1 Revision History 139 Page 134 of 144 Preceding document: Cinterion TXx2-W Hardware Interface Description" v00.200a New document: "Cinterion TXx2-W Hardware Interface Description" v00.002 Chapter What is new Throughout document 1.2, 2.1.2, 3.4.1 Removed product TX82-W, thus the document version number restarted to 00.002 Changed minimum BATT+BB from 2.5V to 2.55V in Table 3 and Table 16 1.2, 4.1 Changed hight of the module in Feature at a Glance and in Figure 49 and Figure 50 Revised ON signal description in Table 3 Added in Figure 12 hint where to place the capacitors 2.1.6.1 Added hint where to place the capacitors Revised Figure 14 added reference to chapter 2.1.6.1 Updated Table 9 Revised Figure 24, Figure 25, Figure 26, Figure 27 and Figure 28 according to the foot-

print of TX62-W Revised chapter and Figure 46 regarding GND reference point Added placement of capacitors in Table 23 for SIM interface signals Revised Figure 51 Changed Stencil thickness to 110m and Stencil pattern in Figure 57 Revised Figure 60 and Figure 61 Preceding document: "Cinterion TXx2-W Hardware Interface Description" v00.200 New document: "Cinterion TXx2-W Hardware Interface Description" v00.200a Chapter What is new Removed extended voltage range and changed eUICC size MFF2 to MFF-XS Revised Figure 1 regarding eUICC size Removed in Figure 2 signal ADC2 Removed extended voltage range in Table 3 Removed in Figure 30 wrong PAD numbers Removed extended voltage range in Table 16 Revised Figure 52 2.1.2 2.1.6 2.1.7 2.2.1 2.2.3 3.4.3 3.7 4.1 4.3.1.1 4.4.1.1 1.2 1.3 1.4 2.1.2 2.4 3.4.1 4.2 Preceding document: "Cinterion TXx2-W Hardware Interface Description" v00.038 New document: "Cinterion TXx2-W Hardware Interface Description" v00.200 Chapter What is new

New document layout Throughout document Removed LTE Bd14. Renamed LTE Bd4 (AWS --> AWS-1), LTE Bd66 (1700MHz --> AWS-3). t TX62-W_TX62-W-B_TX82-W_HID_v00.022a 2020-11-18 Confidential / Draft Cinterion TX62-W(-B)/TX82-W Hardware Interface Description 6.2 Related Documents 139 Page 135 of 144 Chapter What is new Throughout document Added support for optional eUICC interface. 1.2 1.2 2.1.1 2.1.2 2.1.2.1 2.1.7 2.3.1 2.3.2 2.3.3 2.4 3.2.3 3.4.1 4.2 Added references from key feature list to appropriate document sections. Added support for Cinterion IoT Module services (MODS) as key feature. Revised Note 2 of Table 2 Revised Table 3 related to power supply Added absolute maximum ratings for digital lines in normal operation. New section eUICC Interface. 2.1.13.2 Adapted power indication circuit shown in Figure 19. 2.1.13.3 Revised fast shutdown description. Added note that concurrent GNSS and GSM/LTE operations are not supported. Revised description for active GNSS antenna and Figure 29 Revised Table 11 listing GNSS antenna interface characteristics. Revised Figure 30 Revised section Signal States after Startup including Table 11. Revised Table 16 related to power supply New section Mechanical Dimensions of TX82-W and TX62-W-B 4.3.1.1 Added Land pattern and Stencil for TX82-W New document: "Cinterion TX62-W/TX82-W Hardware Interface Description" v00.022a Chapter What is new

Initial document setup. 6.2 Related Documents

[1] TX62/TX82 AT Command Set

[2] TX62/TX82 Release Note

[3] Universal Serial Bus Specification Revision 2.0, April 27, 2000

[4] Application Note 48: SMT Module Integration

[5] Differences between Selected Cinterion Modules, Hardware Migration Guide, v11

[6] Cinterion IoT Module Services User Guide, v01

[7] Cinterion IoT SDK User Guide, v01 t TX62-W_TX62-W-B_TX82-W_HID_v00.022a 2020-11-18 Confidential / Draft Cinterion TX62-W(-B)/TX82-W Hardware Interface Description 6.3 Terms and Abbreviations 139 Page 136 of 144 6.3 Terms and Abbreviations Abbreviation Description Analog-to-digital converter Automatic Gain Control American National Standards Institute ARFCN Absolute Radio Frequency Channel Number ARP Antenna Reference Point Thermistor Constant Bit Error Rate Base Transceiver Station CB or CBM Cell Broadcast Message Conformit Europene (European Conformity) Challenge Handshake Authentication Protocol ASC0/ASC1 Asynchronous Controller. Abbreviations used for first and second serial interface of TX62/TX82 Central Processing Unit Coding Scheme Circuit Switched Data Clear to Send Digital-to-Analog Converter Digital Audio Interface Discontinuous Reception Development Support Box Digital Signal Processor Data Set Ready Data Terminal Ready Discontinuous Transmission Enhanced Full Rate Digital level, 3.14dBm0 corresponds to full scale, see ITU G.711, A-law Data Communication Equipment (typically modems, e.g. Thales module) DCS 1800 Digital Cellular System, also referred to as PCN Data Terminal Equipment (typically computer, terminal, printer or, for example, GSM application) EGSM Enhanced GSM Equivalent Isotropic Radiated Power Electromagnetic Compatibility Electromagnetic Interference Effective Radiated Power t TX62-W_TX62-W-B_TX82-W_HID_v00.022a 2020-11-18 Confidential / Draft ADC AGC ANSI B BER BTS CE CHAP CPU CS CSD CTS DAC DAI dBm0 DCE DRX DSB DSP DSR DTE DTR DTX EFR EIRP EMC EMI ERP Cinterion TX62-W(-B)/TX82-W Hardware Interface Description 6.3 Terms and Abbreviations 139 Page 137 of 144 Abbreviation Description ESD ETS FCC FDMA FR GMSK GPRS GSM HiZ HR I/O IC IMEI ISO ITU kbps LED LPM Mbps MMI MO MS MT NTC OEM PA PAP PCB PCL PCM PCN PDU PLL Electrostatic Discharge European Telecommunication Standard Federal Communications Commission (U.S.) Frequency Division Multiple Access Full Rate Gaussian Minimum Shift Keying General Packet Radio Service Global Standard for Mobile Communications High Impedance Half Rate Input/Output Integrated Circuit International Mobile Equipment Identity International Standards Organization International Telecommunications Union kbits per second Light Emitting Diode Lithium-Ion Link Power Management Mbits per second Man Machine Interface Mobile Originated Mobile Terminated Negative Temperature Coefficient Original Equipment Manufacturer Power Amplifier Password Authentication Protocol Printed Circuit Board Power Control Level Pulse Code Modulation Protocol Data Unit Phase Locked Loop Li-Ion/Li+

Li battery Rechargeable Lithium Ion or Lithium Polymer battery Mobile Station (GSM module), also referred to as TE MSISDN Mobile Station International ISDN number PBCCH Packet Switched Broadcast Control Channel Personal Communications Network, also referred to as DCS 1800 t TX62-W_TX62-W-B_TX82-W_HID_v00.022a 2020-11-18 Confidential / Draft Cinterion TX62-W(-B)/TX82-W Hardware Interface Description 6.3 Terms and Abbreviations 139 Page 138 of 144 Abbreviation Description Restriction of the use of certain hazardous substances in electrical and electronic equipment. PPP PSK PSU PWM R&TTE RAM RF RLS RMS RoHS ROM RTC RTS Rx SAR SAW SELV SIM SMD SMS SMT SPI SRAM TA TDMA TE TLS Tx UART URC USSD VSWR Radio and Telecommunication Terminal Equipment Point-to-point protocol Phase Shift Keying Power Supply Unit Pulse Width Modulation Random Access Memory Radio Frequency Radio Link Stability Root Mean Square (value) Read-only Memory Real Time Clock Request to Send Receive Direction Specific Absorption Rate Surface Acoustic Wave Safety Extra Low Voltage Subscriber Identification Module Surface Mount Device Short Message Service Surface Mount Technology Serial Peripheral Interface Static Random Access Memory Terminal adapter (e.g. GSM module) Time Division Multiple Access Terminal Equipment, also referred to as DTE Transport Layer Security Transmit Direction Universal asynchronous receiver-transmitter Unsolicited Result Code Unstructured Supplementary Service Data Voltage Standing Wave Ratio t TX62-W_TX62-W-B_TX82-W_HID_v00.022a 2020-11-18 Confidential / Draft Cinterion TX62-W(-B)/TX82-W Hardware Interface Description 6.4 Safety Precaution Notes 139 Page 139 of 144 6.4 Safety Precaution Notes The following safety precautions must be observed during all phases of the operation, usage, service or repair of any cellular terminal or mobile incorporating TX62/TX82. Manufacturers of the cellular terminal are advised to convey the following safety information to users and oper-

ating personnel and to incorporate these guidelines into all manuals supplied with the product. Failure to comply with these precautions violates safety standards of design, manufacture and intended use of the product. Thales assumes no liability for customers failure to comply with these precautions. When in a hospital or other health care facility, observe the restrictions on the use of mobiles. Switch the cellular terminal or mobile off, if instructed to do so by the guide-

lines posted in sensitive areas. Medical equipment may be sensitive to RF energy. The operation of cardiac pacemakers, other implanted medical equipment and hear-

ing aids can be affected by interference from cellular terminals or mobiles placed close to the device. If in doubt about potential danger, contact the physician or the manufac-

turer of the device to verify that the equipment is properly shielded. Pacemaker patients are advised to keep their hand-held mobile away from the pacemaker, while it is on. Switch off the cellular terminal or mobile before boarding an aircraft. Make sure it can-

not be switched on inadvertently. The operation of wireless appliances in an aircraft is forbidden to prevent interference with communications systems. Failure to observe these instructions may lead to the suspension or denial of cellular services to the offender, legal action, or both. Do not operate the cellular terminal or mobile in the presence of flammable gases or fumes. Switch off the cellular terminal when you are near petrol stations, fuel depots, chemical plants or where blasting operations are in progress. Operation of any elec-

trical equipment in potentially explosive atmospheres can constitute a safety hazard. Your cellular terminal or mobile receives and transmits radio frequency energy while switched on. Remember that interference can occur if it is used close to TV sets, radios, computers or inadequately shielded equipment. Follow any special regulations and always switch off the cellular terminal or mobile wherever forbidden, or when you suspect that it may cause interference or danger. Road safety comes first! Do not use a hand-held cellular terminal or mobile when driv-

ing a vehicle, unless it is securely mounted in a holder for speakerphone operation. Before making a call with a hand-held terminal or mobile, park the vehicle. Speakerphones must be installed by qualified personnel. Faulty installation or opera-

tion can constitute a safety hazard. IMPORTANT!

Cellular terminals or mobiles operate using radio signals and cellular networks. Because of this, connection cannot be guaranteed at all times under all conditions. Therefore, you should never rely solely upon any wireless device for essential com-

munications, for example emergency calls. Remember, in order to make or receive calls, the cellular terminal or mobile must be switched on and in a service area with adequate cellular signal strength. Some networks do not allow for emergency calls if certain network services or phone features are in use (e.g. lock functions, fixed dialing etc.). You may need to deactivate those features before you can make an emergency call. Some networks require that a valid SIM card be properly inserted in the cellular termi-

nal or mobile. t TX62-W_TX62-W-B_TX82-W_HID_v00.022a 2020-11-18 Confidential / Draft Cinterion TX62-W(-B)/TX82-W Hardware Interface Description 7 Appendix 143 Page 140 of 144 7 Appendix 7.1 List of Parts and Accessories Table 34: List of parts and accessories Description TX62-W Thales Supplier Ordering information TX62-W-B Thales TX82-W Thales Standard module Thales IMEI:

Packaging unit (ordering) number: L30960-N6300-A100 Module label number1: S30960-S6300-A100-1. Standard module with embedded MFF-XS eUICC Thales IMEI:

Packaging unit (ordering) number: L30900-N6307-A100 Module label number1: S30900-S6307-A100-1 Customer IMEI mode:

Packaging unit (ordering) number: L30960-N6305-A100 Module label number1: S30960-S6305-A100-1. Standard module Thales IMEI:

Packaging unit (ordering) number: L30960-N6650-A100 Module label number1: S30960-S6650-A100-1. Standard module with embedded MFF-XS eUICC Thales IMEI:

Packaging unit (ordering) number: L30900-N6657-A100 Module label number1: S30900-S6657-A100-1 Customer IMEI mode:

Packaging unit (ordering) number: L30960-N6655-A100 Module label number1: S30960-S6655-A100-1. Standard module Thales IMEI:

Packaging unit (ordering) number: L30960-N6600-A100 Module label number1: S30960-S6600-A100-1. Standard module with embedded MFF-XS eUICC Thales IMEI:

Packaging unit (ordering) number: L30900-N6607-A100 Module label number1: S30900-S6607-A100-1 Customer IMEI mode:

Packaging unit (ordering) number: L30960-N6605-A100 Module label number1: S30960-S6605-A100-1. TX62-W Evaluation Module Thales Standard module Ordering number: L30900-N6301-A100 Standard module with embedded MFF-XS eUICC Ordering number: L30900-N6308-A100 t TX62-W_TX62-W-B_TX82-W_HID_v00.022a 2020-11-18 Confidential / Draft Cinterion TX62-W(-B)/TX82-W Hardware Interface Description 7.1 List of Parts and Accessories 143 Page 141 of 144 Table 34: List of parts and accessories Description Supplier Ordering information TX62-W-B Evaluation Module Thales Standard module Ordering number: L30900-N6651-A100 Standard module with embedded MFF-XS eUICC Ordering number: L30900-N6658-A100 TX82-W Evaluation Module Thales Standard module Ordering number: L30900-N6601-A100 Standard module with embedded MFF-XS eUICC Ordering number: L30900-N6608-A100 DSB75 Evaluation Kit Ordering number: L36880-N8811-A100 DSB Mini Compact Evaluation Board Thales Thales Ordering number: L30960-N0030-A100 LGA DevKit Thales LGA DevKit consists of Cinterion LGA DevKit T Base PCB:

Ordering number: L30960-N0113-A100 Cinterion LGA DevKit Socket T:

Ordering number: L30960-N0114-A100 EVAL DSB Adapter for mounting TX62/TX82 eval-

uation modules onto DSB75 Thales Ordering number: L30960-N0100-A100 SIM card holder incl. push button ejector and slide-in tray Molex Ordering numbers: 91228 91236 Sales contacts are listed in Table 35. 1. Note: At the discretion of Thales, module label information can either be laser engraved on the modules shielding or be printed on a label adhered to the modules shielding. t TX62-W_TX62-W-B_TX82-W_HID_v00.022a 2020-11-18 Confidential / Draft Cinterion TX62-W(-B)/TX82-W Hardware Interface Description 7.1 List of Parts and Accessories 143 Page 142 of 144 Table 35: Molex sales contacts (subject to change) Molex For further information please click:

http://www.molex.com Molex China Distributors Beijing, Room 1311, Tower B, COFCO Plaza No. 8, Jian Guo Men Nei Street, 100005 Beijing P.R. China Phone: +86-10-6526-9628 Fax: +86-10-6526-9730 Molex Deutschland GmbH Otto-Hahn-Str. 1b 69190 Walldorf Germany Phone: +49-6227-3091-0 Fax: +49-6227-3091-8100 Email: mxgermany@molex.com Molex Singapore Pte. Ltd. 110, International Road Jurong Town, Singapore 629174 American Headquarters Lisle, Illinois 60532 U.S.A. Phone: +1-800-78MOLEX Fax: +1-630-969-1352 Molex Japan Co. Ltd. 1-5-4 Fukami-Higashi, Yamato-City, Kanagawa, 242-8585 Japan Phone: +65-6-268-6868 Fax: +65-6-265-6044 Phone: +81-46-265-2325 Fax: +81-46-265-2365 t TX62-W_TX62-W-B_TX82-W_HID_v00.022a 2020-11-18 Confidential / Draft Cinterion TX62-W(-B)/TX82-W Hardware Interface Description 7.2 Module Label Information 143 Page 143 of 144 7.2 Module Label Information The label engraved on the top of TX62/TX82 comprises the following information1. 1 4 5 6 7 Made in Text S Model: TX62-W S30960-S6300-A100-1 not for sale 358009 09 000216 2 L7 Figure 73: TX62/TX82 label 2 3 8 Table 36: TX62/TX82 label information No. 1 2 3 4 5 6 7 8 Cinterion logo Factory code Manufacturing country (e.g., Made in China) Product name/variant (e.g., TX62-W) Product order code Manufacturer 2D barcode Product IMEI 2-digit date code of product production (for decoding see Table 37 below) Table 37: Date code table Date Code Code L Code 1 M 2 N 3 P 4 R 5 S 6 T 7 U 8 V 9 W O X N A D Year 2019 2020 2021 2022 2023 2024 2025 2026 2027 2028 2029 2030 Month Jan. Feb. Mar. Apr. May June July Aug. Sept. Oct. Nov. Dec. 1. To be continued - full label information will be available with a next document version. t TX62-W_TX62-W-B_TX82-W_HID_v00.022a 2020-11-18 Confidential / Draft 144 THALES DIS AIS Deutschland GmbH Werinherstrasse 81 81541 Munich Germany i

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THALES DIS AIS Deutschland GmbH Siemensdamm 50 13629 Berlin Germany Federal Communications Commission Equipment Authorization Division, Application Processing Branch 7435 Oakland Mills Road Columbia MD 21046 USA THALES DIS AIS Deutschland GmbH Siemensdamm 50 13629 Berlin Germany Contact person: Axel Heike E-mail: axel.heike@thalesgroup.com Tel: +49 30 31102-8146 06 January 2021 SHORT-TERM CONFIDENTIALITY REQUEST TO WHOM IT MAY CONCERN Pursuant to Paragraphs 0.457 and 0.459 of the Commissions Rules (47 C.F.R.) and Section 552(b)(4) of the Freedom of Information Act, THALES DIS AIS Deutschland GmbH requests confidentiality for the following product:

FCC ID Number Product Title/Model QIPTX62-W TX62-W For the product stated above, we request that the following information be held confidential:

1. Test Setup Photos 2. User Manual 3. External and Internal Photographs THALES DIS AIS Deutschland GmbH requests this confidentiality on the basis of ensuring that business sensitive information remains confidential until the actual marketing of our new device, which is planned tor 30th of May 2021. If you have any questions, please feel free to contact us at the address shown above. Sincerely, X Axel Heike Certification Project Manager Signed by: HEIKE Axel 08.01.2021 07/01/2021 X Leandro Wan-Dall Head of Certification Management Signed by: WAN-DALL Leandro THALES DIS AIS Deutschland GmbH Registered Office: M nchen - Amtsgericht M nchen, HRB 172715 WEEE-Reg.-Nr. DE 58893809 Managing Director: Andreas Haegele

 

 

THALES DIS AIS Deutschland GmbH Siemensdamm 50 13629 Berlin Germany Federal Communications Commission Equipment Authorization Division, Application Processing Branch 7435 Oakland Mills Road Columbia MD 21046 USA THALES DIS AIS Deutschland GmbH Siemensdamm 50 13629 Berlin Germany Contact person: Axel Heike E-mail: axel.heike@thalesgroup.com Tel: +49 30 31102-8146 06 January 2021 LONG-TERM CONFIDENTIALITY REQUEST TO WHOM lT MAY CONCERN Pursuant to Paragraphs 0.457 and 0.459 of the Commissions Rules (47 C.F.R.) and Section 552(b)(4) of the Freedom of Information Act, THALES DIS AIS Deutschland GmbH requests confidentiality for the following product:

FCC ID Number Product Title/Model QIPTX62-W TX62-W For the product stated above, we request that the following information be held confidential:

1. Block Diagram 2. Schematic Diagram 3. Part List / Tune Up Procedure 4. Operational Description These items contain detailed system and equipment description and related information about the product which THALES DIS AIS Deutschland GmbH considers to be proprietary, confidential and a custom design which otherwise would only be released to qualified tech and is not released to the general public. Since this design is a basis from which future technological product will evolve, THALES DIS AIS Deutschland GmbH also feels that this information would be of benefit to its competitors, and that the disclosure of the information in these exhibits would give our competitors an unfair advantage in the market. Sincerely, X HEIKE Axel Certification Project Manager Signed by: HEIKE Axel 08.01.2021 07/01/2021 X Leandro Wan-Dall Head of Certification Management Signed by: WAN-DALL Leandro THALES DIS AIS Deutschland GmbH Registered Office: M nchen - Amtsgericht M nchen, HRB 172715 WEEE-Reg.-Nr. DE 58893809 Managing Director: Andreas Haegele

 

 

 

 

 

 

THALES DIS AIS Deutschland GmbH Siemensdamm 50 13629 Berlin Germany Federal Communications Commission Equipment Authorization Division, Application Processing Branch 7435 Oakland Mills Road Columbia MD 21046 USA THALES DIS AIS Deutschland GmbH Siemensdamm 50 13629 Berlin Germany Contact person: Axel Heike E-mail: axel.heike@thalesgroup.com Tel: +49 30 31102-8146 06 January 2021 Ref: FCC Modular approval letter for FCC ID: QIPTX62-W TO WHOM lT MAY CONCERN The following attestation addresses the requirements to support modular approval pursuant to 15.212 of the Commissions Rules:

Modular approval requirement

(i) The radio elements of the modular transmitter must have their own shielding. The physical crystal and tuning capacitors may be located external to the shielded radio elements.

(ii) The modular transmitter must have buffered modulation/data inputs (if such in-

puts are provided) to ensure that the module will comply with part 15 requirements under conditions of excessive data rates or over-modulation.

(iii) The modular transmitter must have its own power supply regulation.

(iv) The modular transmitter must comply with the antenna and transmission system requirements of 1 5.203, 1 5.204(b) and 15.204(c). The antenna must either be permanently attached or employ a unique antenna coupler (at all connections be-

tween the module and the antenna, including the cable). The professional installa-

tion provision of 1 5.203 is not applicable to modules but can apply to limited mod-

ular approvals under paragraph (b) of this section.

(v) The modular transmitter must be tested in a stand-alone configuration, i.e., the module must not be inside another device during testing for compliance with part 15 requirements. Unless the transmitter module will be battery powered, it must comply with the AC line conducted requirements found in 1 5.207. AC or DC power lines and data input/output lines connected to the module must not contain ferrites, unless they will be marketed with the module (see 15.27(a)). The length of these lines shall be the length typical of actual use or, if that length is unknown, at least 10 cen-

timeters to insure that there is no coupling between the case of the module and sup-

porting equipment. Any accessories, peripherals, or support equipment connected to Yes No*

X X X X X THALES DIS AIS Deutschland GmbH Registered Office: M nchen - Amtsgericht M nchen, HRB 172715 WEEE-Reg.-Nr. DE 58893809 Managing Director: Andreas Haegele the module during testing shall be unmodified and commercially available (see 15.31(i)).

(vi) The modular transmitter must be equipped with either a permanently affixed la-

bel or must be capable of electronically displaying its FCC identification number.

(vii) The modular transmitter must comply with any specific rules or operating re-

quirements that ordinarily apply to a complete transmitter and the manufacturer must provide adequate instructions along with the module to explain any such re-

quirements. A copy of these instructions must be included in the application for equipment authorization.

(viii) The modular transmitter must comply with any applicable RF exposure require-

ments in its final configuration.

* Shall provide a detailed explanation if the answer is No. If you have any questions, please feel free to contact us at the address shown above. X X X Sincerely, X Axel Heike Certification Project Manager Signed by: HEIKE Axel 08.01.2021 07/01/2021 X Leandro Wan-Dall Head of Certification Management Signed by: WAN-DALL Leandro

 

 

THALES DIS AIS Deutschland GmbH Siemensdamm 50 13629 Berlin Germany Federal Communications Commission Equipment Authorization Division, Application Processing Branch 7435 Oakland Mills Road Columbia MD 21046 USA THALES DIS AIS Deutschland GmbH Siemensdamm 50 13629 Berlin Germany Contact person: Axel Heike E-mail: axel.heike@thalesgroup.com Tel: +49 30 31102-8146 06 January 2021 Ref: Agent letter for FCC ID: QIPTX62-W We, hereby authorize Shenzhen UnionTrust Quality and Technology Co., Ltd. Add: 161F, Block A, Building 6, Baoneng Science and Technology Park, Qingxiang Road No.1, THALES DIS AIS Deutschland GmbH Siemensdamm 50 13629 Berlin Germany Longhua New District, Shenzhen, China Billy Li Tel: +86-755-28230888 to act as our agent in the preparation of this application for equipment certification, including the signing of all documents relating to these matters. The present authorization considers the development of documents on behalf of the client, written under his own letterhead and related to the necessary information to be provided on his behalf to complete the certification process. We declare that our authorized agent is allowed to forward all information related to the approval and certification of equipment to the regulatory agencies as required and to discuss any issues concerning the approval application. Any and all acts carried out by our authorized agent on our behalf shall have the same effect as acts of our own. This agreement expires one year from the current date. Sincerely, 07.01.2021 06/01/2021 X Axel Heike Certification Project Manager Signed by: HEIKE Axel THALES DIS AIS Deutschland GmbH Registered Office: M nchen - Amtsgericht M nchen, HRB 172715 WEEE-Reg.-Nr. DE 58893809 Managing Director: Andreas Haegele X Leandro Wan-Dall Head of Certification Management Signed by: WAN-DALL Leandro