FCC ID: QIPTX62-W-B Global LTE Cat.M1/lte Cat.nb2 Data-only Module

 

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01.000 TX62-W_TX62-W-x_TX82-W_HID_v01.000 Cinterion TX62-W(-B/-C)/TX82-W Hardware Interface Description Page 2 of 154 Document Name: Cinterion TX62-W(-B/-C)/TX82-W Hardware Interface Description Version:

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Status 2021-10-05 TX62-W_TX62-W-x_TX82-W_HID_v01.000 Confidential / Preliminary GENERAL NOTE THE USE OF THE PRODUCT INCLUDING THE SOFTWARE AND DOCUMENTATION (THE "PROD-

UCT") IS SUBJECT TO THE RELEASE NOTE PROVIDED TOGETHER WITH PRODUCT. IN ANY EVENT THE PROVISIONS OF THE RELEASE NOTE SHALL PREVAIL. THIS DOCUMENT CONTAINS INFORMATION ON THALES DIS AIS DEUTSCHLAND GMBH (THALES) PRODUCTS. THE SPECIFI-

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SEMBLE OR DECOMPILE THE PRODUCT OR OTHERWISE USE THE PRODUCT EXCEPT AS SPECIFICALLY AUTHORIZED. THE PRODUCT AND THIS DOCUMENT ARE PROVIDED ON AN "AS IS" BASIS ONLY AND MAY CONTAIN DEFICIENCIES OR INADEQUACIES. TO THE MAXIMUM EXTENT PERMITTED BY APPLICABLE LAW, THALES DISCLAIMS ALL WARRANTIES AND LIABILI-

TIES. THE RECIPIENT UNDERTAKES FOR AN UNLIMITED PERIOD OF TIME TO OBSERVE SECRECY REGARDING ANY INFORMATION AND DATA PROVIDED TO HIM IN THE CONTEXT OF THE DELIVERY OF THE PRODUCT. THIS GENERAL NOTE SHALL BE GOVERNED AND CON-

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tents and communication thereof to others without express authorization are prohibited. Offenders will be held liable for payment of damages. All rights created by patent grant or registration of a utility model or design patent are reserved. Copyright 2021, THALES DIS AIS Deutschland GmbH Trademark Notice Thales, the Thales logo, are trademarks and service marks of Thales and are registered in certain coun-

tries. Microsoft and Windows are either registered trademarks or trademarks of Microsoft Corporation in the United States and/or other countries. All other registered trademarks or trademarks mentioned in this document are property of their respective owners. t TX62-W_TX62-W-x_TX82-W_HID_v01.000 2021-10-05 Confidential / Preliminary Cinterion TX62-W(-B/-C)/TX82-W Hardware Interface Description Contents 154 Page 3 of 154 Contents 1 2 Introduction ................................................................................................................. 9 Product Variants ................................................................................................ 9 1.1 Key Features at a Glance ................................................................................ 10 1.2 TX62/TX82 System Overview.......................................................................... 15 1.3 Circuit Concept ................................................................................................ 16 1.4 Interface Characteristics .......................................................................................... 20 Application Interface ........................................................................................ 20 2.1 Pad Assignment.................................................................................. 20 2.1.1 Signal Properties................................................................................. 24 2.1.2 2.1.2.1 Absolute Maximum Ratings ................................................ 30 2.1.3 USB Interface...................................................................................... 31 Serial Interface ASC0 ......................................................................... 32 2.1.4 2.1.5 Serial Interface ASC1 ......................................................................... 34 2.1.6 UICC/SIM/USIM Interface................................................................... 36 2.1.6.1 Enhanced ESD Protection for SIM Interface ....................... 38 2.1.7 eUICC Interface .................................................................................. 39 2.1.8 GPIO ................................................................................................... 41 2.1.8.1 GPIOs Available with Embedded Processing Option .......... 42 I2C Interface ........................................................................................ 43 2.1.9 2.1.10 SPI Interface ....................................................................................... 44 2.1.11 Control Signals.................................................................................... 45 2.1.11.1 Status LED .......................................................................... 45 2.1.11.2 Power Indication Circuit ...................................................... 45 2.1.11.3 Fast Shutdown .................................................................... 46 2.1.11.4 SIM Switch .......................................................................... 47 2.1.11.5 SUSPEND Mode Indicator .................................................. 48 RF Antenna Interface....................................................................................... 49 Antenna Interface Specifications ........................................................ 49 2.2.1 2.2.2 Antenna Installation ............................................................................ 58 2.2.3 RF Line Routing Design...................................................................... 59 Line Arrangement Examples ............................................... 59 2.2.3.1 2.2.3.2 Routing Example................................................................. 64 GNSS Interface................................................................................................ 65 2.3.1 GNSS Receiver................................................................................... 65 2.3.2 GNSS Antenna ................................................................................... 65 2.3.3 GNSS Antenna Interface Characteristics (TBD.) ................................ 66 Sample Application .......................................................................................... 67 Sample Level Conversion Circuit........................................................ 69 2.4.1 2.2 2.4 2.3 t TX62-W_TX62-W-x_TX82-W_HID_v01.000 2021-10-05 Confidential / Preliminary Cinterion TX62-W(-B/-C)/TX82-W Hardware Interface Description Contents 154 Page 4 of 154 3 3.3 3.2.5 3.2.3 3.2.4 Operating Characteristics ........................................................................................ 70 Operating Modes ............................................................................................. 70 3.1 Power Up/Power Down Scenarios ................................................................... 71 3.2 Turn on TX62/TX82 ............................................................................ 71 3.2.1 3.2.1.1 Switch on TX62/TX82 Using ON Signal .............................. 71 3.2.1.2 Automatic Power On ........................................................... 73 3.2.2 Restart TX62/TX82 ............................................................................. 74 3.2.2.1 Restart TX62/TX82 via AT+CFUN Command ..................... 74 3.2.2.2 Restart TX62/TX82 Using EMERG_RST ............................ 74 Signal States after Startup .................................................................. 75 Turn off TX62/TX82 ............................................................................ 76 3.2.4.1 Switch off TX62/TX82 Using AT Command......................... 76 Automatic Shutdown ........................................................................... 77 3.2.5.1 Thermal Shutdown .............................................................. 77 3.2.5.2 Undervoltage Shutdown...................................................... 78 3.2.5.3 Overvoltage Shutdown........................................................ 78 Power Saving................................................................................................... 79 Low Power Modes .............................................................................. 80 3.3.1 3.3.1.1 SLEEP Mode....................................................................... 81 3.3.1.2 SUSPEND Mode................................................................. 82 Power Saving while Attached to GSM Networks (TX82-W only) ........ 84 3.3.2.1 DRX (Standard Configuration) ............................................ 84 eDRX (Extended DRX Configuration) ................................. 84 3.3.2.2 Power Saving while Attached to LTE M1 NB1/2 Networks ................. 85 3.3.3.1 DRX (Standard Configuration) ............................................ 85 eDRX (Extended DRX Configuration) ................................. 86 3.3.3.2 3GPP PSM Configuration.................................................... 87 3.3.3.3 Power Supply................................................................................................... 88 3.4.1 Power Supply Ratings......................................................................... 88 3.4.2 Minimizing Power Losses ................................................................. 105 3.4.3 Measuring the Supply Voltage (VBATT+) ......................................... 105 3.4.4 Monitoring Power Supply by AT Command ...................................... 106 Operating Temperatures................................................................................ 106 Electrostatic Discharge .................................................................................. 107 3.6.1 ESD Protection for RF Antenna Interface ......................................... 107 Blocking against RF on Interface Lines ......................................................... 108 Reliability Characteristics ............................................................................... 110 3.5 3.6 3.7 3.8 3.3.2 3.3.3 3.4 t TX62-W_TX62-W-x_TX82-W_HID_v01.000 2021-10-05 Confidential / Preliminary Cinterion TX62-W(-B/-C)/TX82-W Hardware Interface Description Contents 154 Page 5 of 154 4 5 6 7 Mechanical Dimensions, Mounting and Packaging............................................. 111 Mechanical Dimensions of TX62-W ............................................................... 111 4.1 Mechanical Dimensions of TX82-W, TX62-W-B and TX62-W-C ................... 113 4.2 Mounting TX62/TX82 onto the Application Platform ...................................... 115 4.3 SMT PCB Assembly ......................................................................... 115 4.3.1 4.3.1.1 Land Pattern and Stencil................................................... 115 4.3.1.2 Board Level Characterization............................................ 117 4.3.2 Moisture Sensitivity Level ................................................................. 118 Soldering Conditions and Temperature ............................................ 119 4.3.3 4.3.3.1 Reflow Profile .................................................................... 119 4.3.3.2 Maximum Temperature and Duration ................................ 120 4.3.4 Durability and Mechanical Handling.................................................. 121 4.3.4.1 Storage Conditions............................................................ 121 4.3.4.2 Processing Life.................................................................. 122 4.3.4.3 Baking ............................................................................... 122 4.3.4.4 Electrostatic Discharge ..................................................... 122 Packaging ...................................................................................................... 123 Tape and Reel .................................................................................. 123 4.4.1 4.4.1.1 Orientation......................................................................... 123 4.4.1.2 Barcode Label ................................................................... 124 Shipping Materials ............................................................................ 126 4.4.2.1 Moisture Barrier Bag ......................................................... 126 Transportation Box ............................................................ 129 4.4.2.2 Trays (TBD) ...................................................................................... 130 4.4.2 4.4.3 4.4 Regulatory and Type Approval Information ......................................................... 132 Directives and Standards............................................................................... 132 5.1 5.1.1 IEC 62368-1 Classification................................................................ 135 SAR requirements specific to portable mobiles ............................................. 137 Reference Equipment for Type Approval ....................................................... 138 Compliance with FCC and ISED Rules and Regulations............................... 139 5.2 5.3 5.4 Document Information............................................................................................ 142 Revision History ............................................................................................. 142 6.1 Related Documents ....................................................................................... 145 6.2 Terms and Abbreviations ............................................................................... 146 6.3 Safety Precaution Notes ................................................................................ 149 6.4 Appendix.................................................................................................................. 150 List of Parts and Accessories......................................................................... 150 7.1 Module Label Information .............................................................................. 153 7.2 t TX62-W_TX62-W-x_TX82-W_HID_v01.000 2021-10-05 Confidential / Preliminary Cinterion TX62-W(-B/-C)/TX82-W Hardware Interface Description Tables 154 Page 6 of 154 Tables Table 1:

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Overview: Pad assignments TX82-W, TX62-W-B and TX62-W-C additional pads ............................................................................................... 20 Overview: Pad assignments common to TX62/TX82 .................................... 21 Signal properties ............................................................................................ 24 Absolute maximum ratings............................................................................. 30 Signals of the SIM interface (SMT application interface) ............................... 36 Signals of the eUICC interface option (SMT application interface) ................ 39 GPIO lines and alternative assignments ........................................................ 42 Return loss in the active band........................................................................ 49 RF Antenna interface GSM / LTE of TX82-W, and TX62-W .......................... 49 RF Antenna interface LTE of TX62-W-B........................................................ 53 RF Antenna interface LTE of TX62-W-C........................................................ 55 GNSS properties ............................................................................................ 66 Overview of operating modes ........................................................................ 70 Signal states................................................................................................... 75 Temperature dependent behavior.................................................................. 77 Power saving features.................................................................................... 79 Voltage supply ratings.................................................................................... 88 General current consumption ratings (TX62/TX82) ....................................... 89 Current consumption ratings Cat M1 (TX62/TX82)........................................ 89 Current consumption ratings Cat NB1/2 (TX62/TX82)................................... 94 Current consumption ratings General and GSM (TX82-W only).................. 102 Board temperature ....................................................................................... 106 Ambient temperature.................................................................................... 106 Electrostatic values ...................................................................................... 107 EMI measures on the application interface .................................................. 109 Summary of reliability test conditions........................................................... 110 Reflow temperature ratings .......................................................................... 119 Storage conditions ....................................................................................... 121 VP Box label information.............................................................................. 129 Directives ..................................................................................................... 132 Standards of North American type approval ................................................ 132 Standards of European type approval.......................................................... 133 Requirements of quality ............................................................................... 133 Standards of the Ministry of Information Industry of the Peoples Republic of China .......................................................................... 134 Toxic or hazardous substances or elements with defined concentration limits ............................................................................................................. 134 IEC 62368-1 Classification........................................................................... 135 Antenna gain limits for FCC and ISED for TX82-W ..................................... 139 Antenna gain limits for FCC and ISED for TX62-W ..................................... 140 Antenna gain limits for FCC and ISED for TX62-W-B.................................. 140 List of parts and accessories........................................................................ 150 Molex sales contacts (subject to change) .................................................... 152 TX62/TX82 label information........................................................................ 153 Date code table ............................................................................................ 153 t TX62-W_TX62-W-x_TX82-W_HID_v01.000 2021-10-05 Confidential / Preliminary Cinterion TX62-W(-B/-C)/TX82-W Hardware Interface Description Figures 154 Page 7 of 154 Figures Figure 1:

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TX62/TX82 system overview ......................................................................... 15 TX82-W block diagram................................................................................... 16 TX62-W block diagram................................................................................... 17 TX62-W-B block diagram ............................................................................... 18 TX62-W-C block diagram............................................................................... 19 TX62/TX82 top view: Pad assignments ......................................................... 22 TX62/TX82 bottom view: Pad assignments ................................................... 23 USB circuit ..................................................................................................... 31 Serial interface ASC0..................................................................................... 32 ASC0 startup behavior ................................................................................... 33 Serial interface ASC1..................................................................................... 34 ASC1 startup behavior ................................................................................... 35 External UICC/SIM/USIM card holder circuit ................................................. 37 SIM interface - enhanced ESD protection...................................................... 38 eUICC interface with switch for external SIM................................................. 39 eUICC interface without SIM switch............................................................... 40 GPIO start up behavior .................................................................................. 41 I2C interface connected to V180 .................................................................... 43 Characteristics of SPI modes......................................................................... 44 Status signaling with LED driver .................................................................... 45 Power indication circuit .................................................................................. 46 Fast shutdown timing ..................................................................................... 47 SIM switch circuit ........................................................................................... 47 Antenna pads (top view) ................................................................................ 58 Embedded Stripline with 65m prepreg (1080) and 710m core .................. 59 Micro-Stripline on 1.0mm Standard FR4 2-layer PCB - example 1................ 60 Micro-Stripline on 1.0mm Standard FR4 2-layer PCB - example 2................ 61 Micro-Stripline on 1.5mm Standard FR4 2-layer PCB - example 1................ 62 Micro-Stripline on 1.5mm Standard FR4 2-layer PCB - example 2................ 63 Routing to applications RF connector - top view ........................................... 64 Sample supply voltage circuit for active GNSS antenna................................ 65 Schematic diagram of TX62/TX82 sample application .................................. 68 Sample level conversion circuit...................................................................... 69 Sample ON circuit .......................................................................................... 71 ON startup timing ........................................................................................... 72 Automatic switch ON circuit sample............................................................... 73 Emergency restart timing ............................................................................... 74 Switch off behavior......................................................................................... 76 Low power modes with state transitions ........................................................ 80 Wake-up via RTS0 ......................................................................................... 81 Handshake for entering the modules SUSPEND mode ................................ 82 Handshake for module wake up via ON signal .............................................. 83 Handshake for module wake up after eDRX/PSM timer expiry ..................... 83 DRX based paging and power saving (SLEEP) in GSM networks ................ 84 DRX based paging and power saving (SLEEP) in LTE Cat M1 and Cat NB1/2 networks ....................................................................................... 85 eDRX based paging and power saving in LTE Cat M1 and Cat NB1/2 networks ....................................................................................... 86 eDRX/PSM based paging and power saving in LTE Cat M1 or Cat NB1/2 networks ....................................................................................... 87 t TX62-W_TX62-W-x_TX82-W_HID_v01.000 2021-10-05 Confidential / Preliminary Cinterion TX62-W(-B/-C)/TX82-W Hardware Interface Description Figures 154 Page 8 of 154 Figure 48:

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Power supply limits during transmit burst..................................................... 105 Position of reference points BATT+ and GND ............................................. 105 ESD protection for RF antenna interface ..................................................... 107 EMI circuits................................................................................................... 108 TX62-W top and bottom view..................................................................... 111 Dimensions of TX62-W (all dimensions in mm) ........................................... 112 Dimensions of area for possible markings TX62-W (bottom view) .............. 112 TX82-W top and bottom view..................................................................... 113 Dimensions of TX82-W, TX62-W-B and TX62-W-C (all dimensions in mm) 114 Dimensions of area for possible markings TX82-W, TX62-W-B and TX62-W-C (bottom view).............................................................................. 114 Land pattern TX62-W (top view) .................................................................. 115 Land pattern TX82-W, TX62-W-B and TX62-W-C (top view) ...................... 116 Recommended design for 110m thick stencil for TX62-W (top view) ........ 117 Recommended design for 110m thick stencil for TX82-W, TX62-W-B and TX62-W-C (top view).................................................................................... 117 Reflow Profile ............................................................................................... 119 Carrier tape (TX62-W only) .......................................................................... 123 Reel direction (TX62-W only) ....................................................................... 124 Barcode label on tape reel ........................................................................... 124 Barcode label on tape reel - layout .............................................................. 125 Moisture barrier bag (MBB) with imprint....................................................... 126 Moisture Sensitivity Label ............................................................................ 127 Humidity Indicator Card - HIC ...................................................................... 128 Sample of VP box label................................................................................ 129 Small quantity tray........................................................................................ 130 Tray to ship odd module amounts................................................................ 130 Trays with packaging materials.................................................................... 130 Tray dimensions (TBD.) ............................................................................... 131 Reference equipment for type approval ....................................................... 138 TX62/TX82 label .......................................................................................... 153 t TX62-W_TX62-W-x_TX82-W_HID_v01.000 2021-10-05 Confidential / Preliminary Cinterion TX62-W(-B/-C)/TX82-W Hardware Interface Description 1 Introduction 19 Page 9 of 154 1 Introduction This document1 describes the hardware of the Cinterion TX62/TX82 module variants opti-

mized for global coverage as they support a comprehensive set of bands required for global deployment. It helps you quickly retrieve interface specifications, electrical and mechanical de-

tails and information on the requirements to be considered for integrating further components. Note: This Hardware Interface Description is an early draft version and as such subject to change depending on further implementation and measurements. 1.1 Product Variants This document applies to the following Thales module variants:

Cinterion TX62-W (as of v01.000) Cinterion TX62-W-B (as of v01.000) Cinterion TX62-W-C (as of v00.168 Engineering Samples) Cinterion TX82-W (as of v01.000) Note: The TX62/TX82 variants differ in that TX82-W does support GSM (2G) whereas TX62-

W, TX62-W-B and TX62-W-C do not support GSM (2G). TX62-W and TX62-W-B/TX62-W-C dif-

fer in their RF output power. TX62-W-C supports additional 450MHz bands compared to TX62-

W-B. Also, TX82-W, TX62-W-B and TX62-W-C have a different (larger) footprint then TX62-W. Wherever necessary a note is made to differentiate between the product variants. 1. The document is effective only if listed in the appropriate Release Notes as part of the technical docu-

mentation delivered with your Thales product. t TX62-W_TX62-W-x_TX82-W_HID_v01.000 2021-10-05 Confidential / Preliminary Cinterion TX62-W(-B/-C)/TX82-W Hardware Interface Description 1.2 Key Features at a Glance 19 Page 10 of 154 1.2 Key Features at a Glance Feature General Implementation Frequency bands

(see Section 2.2.1) GSM (TX82-W only):

850/900/1800/1900 LTE Cat M1 (TX82-W, TX62-W, TX62-W-B ):

700 (Bd12, Bd13, Bd28, Bd85), 800 (Bd18, Bd19, Bd20, Bd26, Bd27), 850

(Bd5), 900 (Bd8), AWS-3 (Bd66), AWS-1 (Bd4), 1800 (Bd3), 1900 (Bd2, Bd25), 2100 (Bd1) LTE Cat NB1/2: (TX82-W, TX62-W, TX62-W-B):

600 (Bd71), 700 (Bd12, Bd13, Bd28, Bd85), 800 (Bd18, Bd19, Bd20, Bd26), 850 (Bd5), 900 (Bd8), AWS-3 (Bd66), AWS-1 (Bd4), 1800 (Bd3), 1900

(Bd2, Bd25), 2100 (Bd1) LTE Cat M1 (TX62-W-C):

450 (Bd31, Bd72), 700 (Bd12, Bd13, Bd28, Bd85), 800 (Bd18, Bd19, Bd20, Bd26, Bd27), 850 (Bd5), 900 (Bd8), AWS-3 (Bd66), AWS-1 (Bd4), 1800

(Bd3), 1900 (Bd2, Bd25), 2100 (Bd1) LTE Cat NB1/2 (TX62-W-C):

450 (Bd31, Bd72), 700 (Bd12, Bd13, Bd28, Bd85), 800 (Bd18, Bd19, Bd20, Bd26), 850 (Bd5), 900 (Bd8), AWS-3 (Bd66), AWS-1 (Bd4), 1800 (Bd3), 1900 (Bd2, Bd25), 2100 (Bd1) GSM class Small MS Output power (according to Release 7) GSM/GPRS (TX82-W only):

Class 4 (+33dBm 2dB) for GSM850 and GSM900 Class 1 (+30dBm 2dB) for GSM1800 and GSM1900 Class E2 (+27dBm 3dB) for GSM850 8-PSK and GSM 900 8-PSK Class E2 (+26dBm +3 /-4dB) for GSM 1800 8-PSK and GSM1900 8-PSK Output power (according to 3GPP Release 13) TX62-W and TX82-W:

LTE Cat M1:

Class 5 (+20dBm 2dB) for all supported LTE Cat M1 bands LTE Cat NB1/2:

Class 5 (+20dBm 2dB) for all supported LTE Cat NB1/2 bands TX62-W-B:

LTE Cat M1:

Class 3 (+23dBm 2dB) for all supported LTE Cat M1 bands LTE Cat NB1/2:

Class 3 (+23dBm 2dB) for all supported LTE Cat NB1/2 bands TX62-W-C:

LTE Cat M1:

Class 2 (+26dBm 2dB) for LTE CAT M1 bands Bd31, Bd72 Class 3 (+23dBm 2dB) for all other supported LTE Cat M1 bands LTE Cat NB1/2:

Class 3 (+23dBm 2dB) for all supported LTE Cat NB1/2 bands t TX62-W_TX62-W-x_TX82-W_HID_v01.000 2021-10-05 Confidential / Preliminary Cinterion TX62-W(-B/-C)/TX82-W Hardware Interface Description 1.2 Key Features at a Glance 19 Page 11 of 154 Feature Implementation Power supply

(see Section 2.1.2 and Section 3.4) TX82-W:

LTE and GSM: 3.1V to 4.6V LTE with GSM deactivated: 2.8V to 4.6V Operating temperature

(board temperature)

(see Section 3.5) Physical

(see Section 4.1) RoHS

(see Section 5.1) LTE features 3GPP Release 14 TX62-W:

LTE: 2.55V to 4.8V TX62-W-B:

LTE: 2.5V to 4.5V TX62-W-C:

LTE: 3.2V to 4.2V Normal operation: -30C to +85C Extended operation: -40C to +90C Dimensions:

TX62-W:

15.3 mm x 15.3 mm x 2.9 mm TX82-W, TX62-W-B and TX62-W-C:

15.3 mm x 20.9 mm x 2.28 mm Weight: approx. 2.5g All hardware components fully compliant with EU RoHS Directive LTE Cat M1 (HD-FDD) DL: max. 300kbps, UL: max. 1.1Mbps LTE Cat NB1 (HD-FDD) DL: max. 27kbps, UL: max. 63kbps LTE Cat NB2 (HD-FDD) DL: max. 124kbps, UL: max. 158kbps t TX62-W_TX62-W-x_TX82-W_HID_v01.000 2021-10-05 Confidential / Preliminary Cinterion TX62-W(-B/-C)/TX82-W Hardware Interface Description 1.2 Key Features at a Glance 19 Page 12 of 154 Feature Implementation GSM/GPRS/EGPRS features Data transfer EDGE E2 power class for 8 PSK GPRS (TX82-W only):

Multislot Class 10 Full PBCCH support Mobile Station Class B Coding Scheme 1 4 EGPRS (TX82-W only):

Multislot Class 10 Downlink coding schemes CS 1-4, MCS 1-9 Uplink coding schemes CS 1-4, MCS 1-9 SRB loopback and test mode B 8-bit, 11-bit RACH PBCCH support 1 phase/2 phase access procedures Link adaptation and IR NACC, extended UL TBF Mobile Station Class B SMS Point-to-point MT and MO Text and PDU mode Storage: SIM card plus SMS locations in mobile equipment GNSS Features Modes

(see Section 2.3) Protocol General Software AT commands Standalone GNSS (GPS, GLONASS, BeiDou, Galileo) NMEA (for GNSS related sentences) Automatic power saving modes Hayes 3GPP TS 27.007, TS 27.005, Thales AT commands for RIL compatibility Embedded processing platform (optional) Embedded processing option with API. Memory space available for embedded applications is 512KB for applica-

tion code, 512KB for File System and 672KB for RAM. Please take into account that the application code is copied into RAM. For more details, please consult software documentation. SIM Application Toolkit SAT Release 99 Firmware update Firmware update from external application over ASC0 and ASC1 interface. Interfaces Module interface Surface mount device with solderable connection pads (SMT application interface). Land grid array (LGA) technology ensures high solder joint reli-

ability and allows the use of an optional module mounting socket. For more information on how to integrate SMT modules see also [5]. This application note comprises chapters on mounting and application layout issues as well as on additional SMT application development equipment. USB

(see Section 2.1.3) USB 2.0 High Speed (480Mbit/s) device interface, Full Speed (12Mbit/s) compliant t TX62-W_TX62-W-x_TX82-W_HID_v01.000 2021-10-05 Confidential / Preliminary Cinterion TX62-W(-B/-C)/TX82-W Hardware Interface Description 1.2 Key Features at a Glance 19 Page 13 of 154 Feature Implementation 2 serial interfaces

(see Section 2.1.4 and Section 2.1.5) ASC0:

ASC1:

8-wire modem interface with status and control lines, unbalanced, asyn-

chronous Adjustable baud rates: 300bps to 921,600bps Supports RTS0/CTS0 hardware flow control (as configuration option). 4-wire, unbalanced asynchronous modem interface Adjustable baud rates: 300bps to 921,600bps Supports RTS1/CTS1 hardware flow control (as configuration option). UICC interface

(see Section 2.1.6) eUICC interface

(see Section 2.1.7 GPIO interface

(see Section 2.1.8) Supported SIM/USIM cards: 1.8V Supports embedded MFF-XS UICC interface (as an option). TX62-W:

6 I/O pins of the application interface programmable as GPIO. Programming can be done via AT commands. TX82-W, TX62-W-B and TX62-W-C:

7 I/O pins of the application interface programmable as GPIO. Programming can be done via AT commands. With the embedded processing option 12 (TX62-W) or 13 (TX82-W, TX62-

W-B and TX62-W-C) I/O pads are programmable as GPIOs and may be shared with other functions (ASC0, ASC1/SPI, fast shutdown, and status). Status

(see Section 2.1.11.1) Fast shutdown

(see Section 2.1.11.3) Supports status indication LED. Supports fast shutdown interrupt signal. ADC Input Analog-to-Digital Converter with one unbalanced analog inputs SIM switch

(see Section 2.1.11.4) Antenna interface pads

(see Section 2.2) I2C interface

(see Section 2.1.9) SPI interface

(see Section 2.1.10) Power on/off, Reset Power on/off Supports signal to switch between two externally connected SIMs. 50. GSM/LTE Main antenna, GNSS antenna I2C interface only available with embedded processing option. SPI interface only available with embedded processing option. Switch-on by hardware signal ON Switch-off by AT command and hardware signal FST_SHDN Automatic switch-off in case of critical voltage conditions Reset Orderly shutdown and reset by AT command Emergency reset by hardware signal EMERG_RST t TX62-W_TX62-W-x_TX82-W_HID_v01.000 2021-10-05 Confidential / Preliminary Cinterion TX62-W(-B/-C)/TX82-W Hardware Interface Description 1.2 Key Features at a Glance 19 Page 14 of 154 Feature Implementation Special features Approval

(see Section 5) Phonebook Cinterion IoT Suite ser-

vices RED, CE, FCC, ISED, UL, RoHS, and REACH compliant GCF, PTCRB SIM and phone

(Optionally) supports an IoT Suite client based on the LWM2M protocol. The client can be configured to collect diagnostic information about the module and cellular network and to send it periodically to the Cinterion IoT Suite server platform, where it can be visualized for further analysis. Communication to Thales Device Management Hub is realized using a resource-efficient protocol specifically designed by Thales in order to keep the energy and data usage to a minimum. The protocol behavior may be influenced by means of configuration. Additionally, the service provides device control functionality. This includes remote flash file system management, module firmware over-the-air updates (FOTA) and remote configuration. The Cinterion IoT Suite also generates alarms when a specific module or network parameter changes or exceeds a threshold. Alarms can be sent to the platform as soon as possible disregarding the connection interval. For more information, please refer to [7]. Evaluation kit (For ordering information see Section 7.1) LGA DevKit Evaluation module DSB75 LGA DevKit designed to test Thales LGA modules. For more information see also LGA DevKit. TX62/TX82 module soldered onto a dedicated PCB that can be connected to the an approval adapter in order to be mounted onto the DSB75 or DSB-

Mini. DSB75 Development Support Board designed to test and type approve Thales modules and provide a sample configuration for application engi-

neering. A special adapter is required to connect the TX62/TX82 evaluation module to the DSB75. t TX62-W_TX62-W-x_TX82-W_HID_v01.000 2021-10-05 Confidential / Preliminary Cinterion TX62-W(-B/-C)/TX82-W Hardware Interface Description 1.3 TX62/TX82 System Overview 19 Page 15 of 154 1.3 TX62/TX82 System Overview ASC 0 lines ASC 1 lines USB lines STATUS FST_SHDN SIM_SWITCH SIM Interface

(with SIM detection) eUICC interface

(MFF_XS UICC)

CONTROL ADC SUSPEND_MON GPIO 2 I C POWER ANTENNA GNSS Serialmodem interfacelines Serialmodem interfacelines USB interface Status LED Fast shutdown SIM switch SIM c ard eUICC (option) ON Emergency reset ADC 1 SUSPEND mode indication GPIOs

(12forTX62W,13for TX62WB/CandTX82W) I2C Power supply LTE antenna GNSS antenna Figure 1: TX62/TX82 system overview Please note that the I2C function and some GPIO lines are available with the embedded pro-

cessing option only. Also, some GPIO lines may be shared with further functions that are also only available with the embedded processing option. For details see Section 2.1, and Section 2.1.8.1. t TX62-W_TX62-W-x_TX82-W_HID_v01.000 2021-10-05 Confidential / Preliminary Cinterion TX62-W(-B/-C)/TX82-W Hardware Interface Description 1.4 Circuit Concept 19 Page 16 of 154 1.4 Circuit Concept Figure 2, Figure 3, Figure 4 and Figure 5 show block diagrams for the TX62/TX82 module vari-

ants, and illustrate the major functional components:

Power Supply LGA Pads s d a P A G L a n n e t n A GSM/

LTE F R _

T T A B RF Part HWIDs BATT+

GPIO USB_VDDA _3P3 EN IN OUT LDO GSMPA +ASM 2 REFE 2_CLK_DATA GPIOs REFE 1...2_ CLK_DATA 4 GPDATA STMR_SYNC RF Transceiver LTE PA+ASM GSM/CatM1/CatNB Baseband controller with integrated memory SDR_ TX_LB_GSM SDR_ TX_ MB_ GSM SDR_ ASM _AN T TX_PA 1 (LTE_LB) R X_LB_GSM RX_MB_GSM LB LPF LB LPF M B LPF Match ing B71_RX

I GNSS RF GNSS SAW filter SDR_GNSS l s a n g s

Q i

) 2 x 2

t p u r r e n t I t e s e R z H M 2 9 1

. z H k 8 6 7 2 3

. D L O H _ S P e c a f r e n t i l o r t n o C 8 4 3 3 7 2 4 Serial (ASC0) Serial (ASC1/GPIO) USB 2.0 USIM CCIN FST_SHDN STATUS (GPIO) SUSPEND_MON SIM_SWITCH(GPIO) GPIO (not shared) I2C SPI (GPIO) Power Supply 1 K L C _ F R X-tal:

19.2MHz with Temp.Sensor ADC Power Management IC VUSIM ADC1 EMERG_RST ON V180 VCORE BATT+

BATT+_RF BATT+RF BATT+BB eUICC

(MFF-XS eUICC) 5 eUICC (optional) Figure 2: TX82-W block diagram t TX62-W_TX62-W-x_TX82-W_HID_v01.000 2021-10-05 Confidential / Preliminary Cinterion TX62-W(-B/-C)/TX82-W Hardware Interface Description 1.4 Circuit Concept 19 Page 17 of 154 Power Supply LGA Pads s d a P A G L a n n e n A t LTE HWIDs RF Part Coupler SDR_ASM_ANT RF Transceiver LTE PA+ASM BATT+

GPIOs REFE 1...2_ CLK_DATA 4 GPDATA STMR_SYNC GPIO USB_VDDA _3P3 EN IN OUT LDO GSM/CatM1/CatNB Baseband controller with integrated memory TX_PA1(LTE_LB) LB LPF Matching B71_RX SDR_GNSS GNSS RF GNSS SAW filter

) 2 x 2

l s a n g s

Q i

I Power Supply t p u r r e t n I t e s e R e c a f r e t n i l o r t n o C z H M 2

. 9 1 z H k 8 6 7

. 2 3 D L O H _ S P Power Management IC 1 K L C _ F R X-tal:

19.2MHz with Temp.Sensor ADC 8 4 3 3 6 2 4 Serial (ASC0) Serial (ASC1/GPIO) USB 2.0 USIM CCIN FST_SHDN STATUS (GPIO) SUSPEND_MON SIM_SWITCH (GPIO) GPIO (not shared) I2C SPI (GPIO) VUSIM ADC1 EMERG_RST ON V180 VCORE BATT+

BATT+_RF BATT+RF BATT+BB eUICC

(MFF-XS eUICC) 5 eUICC (optional) Figure 3: TX62-W block diagram t TX62-W_TX62-W-x_TX82-W_HID_v01.000 2021-10-05 Confidential / Preliminary Cinterion TX62-W(-B/-C)/TX82-W Hardware Interface Description 1.4 Circuit Concept 19 Page 18 of 154 Power Supply F R _

T T A B RF Part HWIDs BATT+

GPIO USB_VDDA _3P3 EN IN OUT LDO LTE PA + PAM 2 REFE 2_CLK_DATA GPIOs SDR_ TX_L B_ L TE SDR_ TX_ MB_ L TE SDR _RX_ L TE REFE 1...2_ CLK_DATA 4 GPDATA STMR_SYNC RF Transceiver GSM/CatM1/CatNB Baseband controller with integrated memory s d a P A G L a n n e t n A LTE LGA Pads Serial (ASC0) Serial (ASC1/GPIO) USB 2.0 USIM CCIN FST_SHDN STATUS (GPIO) SUSPEND_MON SIM_SWITCH (GPIO) GPIO (not shared) I2C SPI (GPIO) 8 4 3 3 7 2 4

) 2 x 2

l s a n g s

Q i Ma tch in g B71_RX

I GNSS RF GN SS SAW filte r SDR_GNSS Power Supply 1 K L C _ F R X-tal:

19.2MHz with Temp.Sensor ADC t p u r r e t n I t e s e R e c a f r e t n i l o r t n o C z H M 2

. 9 1 z H k 8 6 7

. 2 3 D L O H _ S P Power Management IC VUSIM ADC1 EMERG_RST ON V180 VCORE BATT+

BATT+_RF BATT+RF BATT+BB eUICC

(MFF-XS eUICC) 5 eUICC (optional) Figure 4: TX62-W-B block diagram t TX62-W_TX62-W-x_TX82-W_HID_v01.000 2021-10-05 Confidential / Preliminary Cinterion TX62-W(-B/-C)/TX82-W Hardware Interface Description 1.4 Circuit Concept 19 Page 19 of 154 Power Supply F R _ T T A B RF Part LTE PC3 PA

+ASM HWIDs BATT+

GPIO USB_VDDA _3P3 EN IN OUT LDO REFE 2_CLK_DATA GPIO s 2 s d a P A G L a n n e t n A LTE TX_LB_LTE TX_MB_LTE RX_LTE RF Transceiver L B L P F B31/72 filter B31/72_RX B31/72 PA HDET B31/72_DA_OUT PA_CTRL 2 GNSS REFE 1...2_ CLK_DATA 4 GPDATA STMR_SYNC

) 2 x 2

s l i a n g s

Q

I GNSS RF GNSS SAW filter Power Supply 1 K L C _ F R X-tal:

19.2MHz with Temp.Sensor ADC GSM/CatM1/CatNB Baseband Controller With Integrated Memory t p u r r e t n I t e s e R e c a f r e t n i l o r t n o C z H M 2

. 9 1 z H k 8 6 7

. 2 3 D L O H _ S P Power Management IC LGA Pads ASC0 ASC1 USB 2.0 USIM CCIN FAST_SHDN STATUS (GPIO) SUSPEND_MON SIM_SWITCH (GPIO) GPIO (not shared) I2C SPI (GPIO) 8 4 2 3 7 2 4 VUSIM ADC1 EMERG_RST ON V180 VCORE BATT+

BATT+_RF BATT+RF BATT+BB eUICC

(MFF-XS eUICC ) 5 eUICC (optional) Figure 5: TX62-W-C block diagram Please note that the I2C function and some GPIO lines are available with the embedded pro-

cessing option only. Also, some GPIO lines may be shared with further functions that are also only available with the embedded processing option. For details see Section 2.1, and Section 2.1.8.1. t TX62-W_TX62-W-x_TX82-W_HID_v01.000 2021-10-05 Confidential / Preliminary Cinterion TX62-W(-B/-C)/TX82-W Hardware Interface Description 2 Interface Characteristics 69 Page 20 of 154 2 Interface Characteristics TX62/TX82 is equipped with an SMT application interface that connects to the external appli-

cation. The SMT application interface incorporates the various application interfaces as well as the RF antenna interface. 2.1 Application Interface 2.1.1 Pad Assignment The SMT application interface on the TX62/TX82 provides connecting pads to integrate the module into external applications. The pads listed in Table 1 apply only to TX82-W and TX62-

W-B and TX62-W-C. Table 2 lists the common pads of TX62/TX82. Figure 7 (bottom view) and Figure 6 (top view) show the connecting pads numbering plan of TX62-W (pads inside dark violet rectangle) as well as TX82-W, TX62-W-B and TX62-W-C (pads inside light violet rectan-

gle). As a rule all pads should be soldered for mechanical stability and heat dissipation. Signal pads that are not used, i.e., marked as rfu (reserved for future use) or nc (not con-

nected), need to be soldered, but should not have an electrical connection to the external ap-

plication or GND. Also, pads marked as rfu are further qualified as dnu (do not use), indicating that they are currently not supported, but internally connected for possible future us-

age. In addition, pads mentioned in squared brackets (I2CDAT and I2CCLK pads, SPI pads, as well as shared GPIO pads) are available with the embedded processing option only. Please note that the reference voltages listed in Table 3 are the values measured directly on the TX62/TX82 module. They do not apply to the accessories connected. Note: Thales strongly recommends to provide test points for certain signal lines to and from the module while developing SMT applications for debug, test and/or trace purposes during the manufacturing process. In this way it is possible to detect soldering (and other) problems. Please refer to [5] and [6] for more information on test points and how to implement them. The signal lines for which test points should be provided for are marked as Test point recommend-

ed in Table 3. Table 1: Overview: Pad assignments TX82-W, TX62-W-B and TX62-W-C additional pads1 Pad no. Signal name B5 B6 B18 B19 C5 C6 C18 C19 E5 E6 GND nc nc GND nc nc nc nc nc GPIO6 Pad no. Signal name nc E18 nc E19 nc G5 rfu (dnu) G6 nc G18 nc G19 nc J5 nc J6 nc J18 nc J19 Pad no. Signal name nc L5 nc L6 nc L18 nc L19 GND M5 nc M6 nc M18 GND M19 1. rfu = reserved for future use, i.e., currently not supported; dnu = do not use; nc = internally not connected t TX62-W_TX62-W-x_TX82-W_HID_v01.000 2021-10-05 Confidential / Preliminary Cinterion TX62-W(-B/-C)/TX82-W Hardware Interface Description 2.1 Application Interface 69 Page 21 of 154 Table 2: Overview: Pad assignments common to TX62/TX821 2 Pad no. B7 B8 B9 B10 B11 B12 B13 B14 B15 B16 B17 C7 C8 C9 C10 C11 C12 C13 C14 C15 C16 C17 D7 D8 D9 D10 D11 D12 D13 D14 D15 D16 D17 E7 E8 E9 E10 E11 Signal name GND GND GNSS_ANT GND GND RF_OUT GND GND rfu (dnu) GND GND rfu (dnu) SIM_SWITCH

[GPIO8]

GND GND GND GND GND GND GND GND nc rfu (dnu) GPIO22 nc GND GND GND GND GND ON nc nc GPIO7 GPIO21 rfu (dnu) GND rfu (dnu) Pad no. E12 E13 E14 E15 E16 E17 F7 F8 F9 F10 F11 F12 F13 F14 F15 F16 F17 G7 G8 G9 G10 G14 G15 G16 G17 H7 H8 H9 H10 H14 H15 H16 H17 J7 J8 J9 J10 J14 Signal name rfu (dnu) rfu (dnu) GND EMERG_RST VCORE nc GND GPIO25 SUSPEND_MON GND rfu (dnu) rfu (dnu) rfu (dnu) Pad no. J15 J16 J17 K7 K8 K9 K10 K11 K12 K13 K14 K15 K16 Signal name V180 GND CC2_VPP nc RTS1 [GPIO18/SPI_CS]

STATUS [GPIO5]

FST_SHDN nc RING0 DTR0 DCD0 CCCLK rfu (dnu) 3 3 K17 GND L7 ADC1 L8 nc L9 GND L10 nc L11 GPIO20 L12 nc L13 GND L14 GND L15 BATT+RF L16 BATT+RF L17 nc M7 nc M8 GPIO23 M9

[I2CDAT]

M10

[I2CCLK]

M11 GND M12 BATT+BB M13 BATT+BB M14 nc M15 nc CTS1 [GPIO19/SPI_CLK] M16 RXD1 [GPIO16/MOSI]

M17 GND rfu (dnu) CC2_CLK nc TXD1 [GPIO17/MISO]

VUSB_IN rfu (dnu) DSR0 RTS0 CTS0 CCVCC CCRST CC2_VCC CC2_RST GND GND USB_DP USB_DN GND RXD0 TXD0 CCIO CCIN CC2_IO GND 1. rfu = reserved for future use, i.e., currently not supported; dnu = do not use; nc = internally not connected 2. Pads mentioned in squared brackets (I2CDAT and I2CCLK pads, SPI pads as well as shared GPIO pads) are available with the embedded processing option only. 3. Available with TX82-W, TX62-W-B, TX62-W-C. Internally not connected with TX62-W. t TX62-W_TX62-W-x_TX82-W_HID_v01.000 2021-10-05 Confidential / Preliminary Page 22 of 154 6 nc nc 5 GND nc nc nc Cinterion TX62-W(-B/-C)/TX82-W Hardware Interface Description 2.1 Application Interface 69 19 M GND 18 nc 17 16 15 14 13 12 11 10 9 8 7 GND CC2_IO CCIN CCIO TXD0 RXD0 GND USB_DN USB_DP GND GND L K J H G F E D C B nc nc CC2_RST CC2_VCC CCRST CCVCC CTS0 RST0 DSR0 rfu (dnu) VUSB _IN CC2_CLK rfu (dnu) CCCLK DCD0 DTR0 RING0 nc FST_SHDN STATUS

[GPIO5]

TXD1

[GPIO17/

MISO]

RTS1

[GPIO18/

SPI_CS]

nc nc CC2_VPP GND V180 nc Reserved for future use GND RXD1

[GPIO16/

MOSI]

CTS1

[GPIO19/

SPI_CLK]

nc nc BATT+BB BATT+BB GND

[I2CCLK]

[I2CDAT]

GPIO23 BATT+RF BATT+RF GND Marking GND nc GPIO20 nc nc nc nc nc nc nc nc nc nc nc nc nc nc GND nc ADC1 GND rfu (dnu) rfu (dnu) rfu (dnu) GND SUSPEND _MON GPIO25 GND VCORE EMERG_ RST GND rfu (dnu) rfu (dnu) rfu (dnu) GND rfu (dnu) GPIO21 GPIO7 GPIO6 nc ON GND GND GND GND GND nc GPIO22 rfu (dnu) GND GND GND GND GND GND GND GND SIM_SWITCH

[GPIO8]

rfu (dnu) GND rfu (dnu) GND GND nc GND GND RF_OUT GND GND GNSS _ANT GND GND Figure 6: TX62/TX82 top view: Pad assignments nc nc GND nc nc t TX62-W_TX62-W-x_TX82-W_HID_v01.000 Confidential / Preliminary 2021-10-05 Page 23 of 154 18 nc 19 GND Cinterion TX62-W(-B/-C)/TX82-W Hardware Interface Description 2.1 Application Interface 69 5 M GND nc 6 nc nc L K J H G F E D C B nc nc nc rfu (dnu) nc nc GND nc nc 7 8 9 10 11 12 13 14 15 16 17 GND GND USB_DP USB_DN GND RXD0 TXD0 CCIO CCIN CC2_IO GND nc nc nc nc nc TXD1

[GPIO17/

MISO]

RTS1

[GPIO18/

SPI_CS]

VUSB _IN rfu (dnu) DSR0 RST0 CTS0 CCVCC CCRST CC2_VCC CC2_RST nc nc STATUS

[GPIO5]

FST_SHDN nc RING0 DTR0 DCD0 CCCLK rfu (dnu) CC2_CLK CTS1

[GPIO19/

SPI_CLK]

RXD1

[GPIO16/

MOSI]

GND Reserved for future use nc V180 GND CC2_VPP nc nc GPIO23

[I2CDAT]

[I2CCLK]

GND BATT+BB BATT+BB GPIO20 nc GND Marking GND BATT+RF BATT+RF nc nc GND GPIO25 SUSPEND _MON GND rfu (dnu) rfu (dnu) rfu (dnu) GND ADC1 nc GND GPIO6 GPIO7 GPIO21 rfu (dnu) GND rfu (dnu) rfu (dnu) rfu (dnu) GND EMERG_ RST VCORE rfu (dnu) GPIO22 nc GND GND GND GND GND ON nc rfu (dnu) SIM_SWITCH

[GPIO8]

GND GND GND GND GND GND GND GND nc nc nc nc nc nc nc GND GND GNSS _ANT GND GND RF_OUT GND GND nc nc GND GND ADC2 GND Figure 7: TX62/TX82 bottom view: Pad assignments t TX62-W_TX62-W-x_TX82-W_HID_v01.000 Confidential / Preliminary 2021-10-05 Cinterion TX62-W(-B/-C)/TX82-W Hardware Interface Description 2.1 Application Interface 69 Page 24 of 154 2.1.2 Signal Properties Table 3: Signal properties Function Signal name IO Signal form and level Comment Power supply BATT+BB BATT+RF I Normal voltage range:

TX82-W (LTE and GSM):

VImin = 3.1 V...VImax = 4.6V during Tx burst on board Imax 2A, during Tx burst (GSM) __||____||__ N Tx = n * 577s peak current every 4.616ms TX82-W (LTE with GSM deactivated):

VImin = 2.8 V...VImax = 4.6V TX62-W (LTE):

VImin = 2.55 V...VImax = 4.8V TX62-W-B (LTE):

VImin = 2.5 V...VImax = 4.5V Lines of BATT+ and GND must be connected in parallel for supply pur-

poses because higher peak currents may occur. BATT+BB at solder pads needs an additional low ESR 47F capacitor (e.g, X7R MLCC, taking DCbias into account). BATT+RF at solder pads needs an additional low ESR 150F capacitor

(e.g, X7R MLCC, taking DCbias into account) -

except for TX62-W, as in this case BATT+RF is internally not connected. TX62-W-C (LTE):

VImin = 3.2 V...VImax = 4.2V A minimum ESR value

<70m is recommended. All products:

VInorm = 3.8V IPower Down = 14A Extended voltage range:

All products:

VImin = 2.5 V...VImax = 4.8V Power supply GND Ground Minimum voltage must not fall below the speci-

fied normal minimum voltage including drops, ripple, spikes. Else the module may perform an uncontrolled shutdown. However, if using the extended voltage range, i.e., down to 2.5V or up to 4.8V, the module remains fully functional and safe while possibly no longer being fully compliant with 3GPP or other wireless standards. Please note that the module is in this case switched on at a voltage of >2.65V. Please note that if both voltage domains and power supply lines are referred to - i.e., BATT+BB and BATT+RF - BATT+ is used throughout the doc-

ument. Application Ground t TX62-W_TX62-W-x_TX82-W_HID_v01.000 2021-10-05 Confidential / Preliminary Cinterion TX62-W(-B/-C)/TX82-W Hardware Interface Description 2.1 Application Interface 69 Page 25 of 154 Table 3: Signal properties Function Signal name IO Signal form and level Comment External supply voltage V180 O Normal operation:

VOnorm = 1.80V 2%

IOmax = 10mA SLEEP mode Operation:

VOSleep = 1.80V 3.7%

IOmax = 10mA V180 has to be used for the power indication cir-

cuit. V180 can also be used to supply level shifters at the interfaces. SUSPEND mode Operation:

VOSuspend = 0V Test point recom-

mended1. VCORE Clmax = 1F O Normal Operation:

VOnom = 1.128V 2%

IOmax = 10mA Test point recommended. Ignition ON I SLEEP Mode Operation:

VOsleep = 0.5V...1.304V 3%

IOmax = 10mA SUSPEND Mode Operation:

VOsuspend = 0V Clmax = 100nF VIHmax = BATT+BB VIHmin = 1.3V VILmax = 0.5V High level pulse width > 30ms ON ___|

Status STATUS O VOLmax = 0.45V at I = 4.5 mA VOHmin = 1.20V at I = 2.5 mA VOHmax = 1.95V Fast shut-

down FST_SHDN I VILmax = 0.5V VIHmin = 1.3V VIHmax = 1.95V This signal switches the module on. The ON signal is low to high edge sensitive trig-

gered, and requires a 10k pull down resistor. Test point recommended. If unused keep lines open. With the embedded pro-

cessing option this line is also available as GPIO:

STATUS --> GPIO5 If unused keep lines open. Fast shutdown period

<15ms. t TX62-W_TX62-W-x_TX82-W_HID_v01.000 2021-10-05 Confidential / Preliminary Cinterion TX62-W(-B/-C)/TX82-W Hardware Interface Description 2.1 Application Interface 69 Page 26 of 154 Table 3: Signal properties Function Signal name IO Signal form and level Comment Emergency reset EMERG_RST I RI 1k, CI 1nF (internal low pass filter) VIHmin = 1.3V VILmax = 0.5V at ~1A This line must be driven low by an open drain or open collector driver con-

nected to GND.

|___| low impulse width > 800ms USB VUSB_IN I VImin = 3V VImax = 5.25V Active and suspend current:

Imax < 100A USB_DN USB_DP I/O Full and high speed signal characteris-

tics according USB 2.0 Specification. Serial Modem Interface ASC0 Serial Modem Interface ASC1 RXD0 CTS0 DSR0 DCD0 RING0 TXD0 RTS0 DTR0 RXD1 CTS1 TXD1 RTS1 O VOLmax = 0.45V at I = 4.5 mA VOHmin = 1.20V at I = 2.5 mA VOHmax = 1.95V O O O O I I I VILmax = 0.5V VIHmin = 1.3V VIHmax = 1.95V O VOLmax = 0.45V at I = 4.5 mA VOHmin = 1.20V at I = 2.5 mA VOHmax = 1.95V O I I VILmax = 0.5V VIHmin = 1.3V VIHmax = 1.95V If unused keep lines open. Test point recommended. All electrical characteris-

tics according to USB Implementers' Forum, USB 2.0 Specification. If unused keep lines open. Used for tracing pur-

poses only. Test points recommended. If unused keep lines open. RTS0 can be used to wakeup the module from SLEEP mode, but not from SUSPEND/PSM mode. Test points recommended for RXD0, TXD0, RTS0, and CTS0. If unused keep lines open. Test points recommended for RXD1, TXD1, RTS1, and CTS1. With embedded process-

ing option ASC1 lines are shared with SPI interface lines, see Section 2.1.8. t TX62-W_TX62-W-x_TX82-W_HID_v01.000 2021-10-05 Confidential / Preliminary Cinterion TX62-W(-B/-C)/TX82-W Hardware Interface Description 2.1 Application Interface 69 Page 27 of 154 Table 3: Signal properties Function Signal name IO Signal form and level Comment SIM card detection CCIN I Internal pull down resistor: 100k RI 110k CCIN = High, SIM card inserted. CCVCC 1.8V SIM Card Inter-

face VILmax = 0.5V VIHmin = 1.3V VIHmax = 1.95V O VOmin = 1.5V VOtyp = 1.8V VOmax = 2V IOmax = -60mA CCRST CCCLK CCIO O O VOLmax = 0.45V at I = 4.5 mA VOHmin = 1.20V at I = 2.5 mA VOHmax = 1.95V I/O VOLmax = 0.45V at I = 4.5 mA VOHmin = 1.20V at I = 2.5 mA VOHmax = 1.95V VILmax = 0.5V VIHmin = 1.3V VIHmax = 1.95V If unused keep line open. Maximum cable length or copper track to SIM card holder should not exceed 100mm. For more information on how to connect the SIM interface pads including possible external capaci-

tors and ESD protection please refer to Section 2.1.6. t TX62-W_TX62-W-x_TX82-W_HID_v01.000 2021-10-05 Confidential / Preliminary Cinterion TX62-W(-B/-C)/TX82-W Hardware Interface Description 2.1 Application Interface 69 Page 28 of 154 Table 3: Signal properties Function Signal name IO Signal form and level Comment SWP NFC is currently not supported and deacti-

vated for the eUICC. Thus, there are two options:

If an external SWP mas-

ter is connected never-

theless (or for future use) the CC2_VPP line should be pulled up by an exter-

nal 10k resistor to VCC. If there is no plan to use SWP the CC2_VPP line can be grounded. Maximum cable length or copper track should be no longer as 100mm to eUICC interface. The signals CC2_RST, CC2_IO, CC2_CLK and CC2_VCC are protected against ESD with a spe-

cial diode array. If unused keep lines open. 1.8V eUICC interface CC2_VPP

Used for single wire protocol (SWP NFC) in MFF-XS eUICC. CC2_VCC CC2_CLK CC2_RST CC2_IO I I I VImin = 1.62V VItyp = 1.8V VImax = 1.98V VILmax = 0.2*CC2_VCC (at IOLmax = -200A) VILmin = -0.3V (at IOL max = -200A) VIHmax=CC2_VCC+0.3V (at IOHmax =

+20A) VIHmin = 0.8*CC2_VCC (at IOHmax =

+20A) VILmax = 0.2*CC2_VCC (at IOLmax = -20A) VILmin = -0.3V (at IOL max = -20A) VIHmax=CC2_VCC+0.3V (at IOHmax =

+20A) VIHmin = 0.7*CC2_VCC (at IOHmax =

+20A) I/O VILmax = 0.2*CC2_VCC (at IIH =

+1mA/+20A) VILmin = -0.3V (at IIH = +1mA/+20 A) VIHmin = 0.7*CC2_VCC (at IIH = -20/

+20A) VIHmax = CC2_VCC+0.3V (at IIH = -20/

+20A) VOLmax = 0.15*CC2_VCC

(at IOL = -1mA) VOHmin = 0.7*CC2_VCC (at IIH = -20/

+20A) VOHmax = CC2_VCC+0.3V

(at IIH = -20/+20A) SIM switch SIM_SWITCH O VOLmax = 0.45V at I = 4.5 mA VOHmin = 1.20V at I = 2.5 mA VOHmax = 1.95V If unused keep lines open. With embedded process-

ing option SIM_SWITCH is shared with GPIO8, see Section 2.1.8. t TX62-W_TX62-W-x_TX82-W_HID_v01.000 2021-10-05 Confidential / Preliminary Cinterion TX62-W(-B/-C)/TX82-W Hardware Interface Description 2.1 Application Interface 69 Page 29 of 154 Table 3: Signal properties Signal name IO Signal form and level Comment Function I2C I2CDAT I2CCLK I/O No internal pull up resistors O VOLmax = 0.45V at Imax = -4.5mA VOHmax = 1.95V VILmax = 0.5V VIHmin = 1.3V VIHmax = 1.95V Note: Imax = I max external + I pull up If unused keep lines open. Compatible with I2C Bus Specification Version 5.0. Multimaster is not sup-

ported. The value of the pull-up depends on the capaci-

tive load of the whole sys-

tem (I2C Slave + lines). Only available with embedded processing option. If unused keep lines open. GPIO6 only available on TX82-W, TX62-W-B and TX62-W-C. Further GPIOs shared with other functions are available with embedded processing option (see Section 2.1.8). Shared with ASC1 func-

tion (see Section 2.1.8). Only available with embedded processing option. If unused keep line open. High=Normal mode, Low=SUSPEND mode. If unused keep lines open. GPIO GPIO6-GPIO7, GPIO20-GPIO23, GPIO25 I/O VOLmax = 0.45V at I = 4.5 mA VOHmin = 1.20V at I = 2.5 mA VOHmax = 1.95V VILmax = 0.5V VIHmin = 1.3V VIHmax = 1.95V SPI SPI_CLK SPI_MOSI SPI_MISO SPI_CS ADC1 ADC

(Analog-to-

Digital Con-

verter) O VOLmax = 0.45V at I = 4.5mA VOHmin = 1.20V at I = 2.5mA VOHmax = 1.95V O I O I VILmax = 0.5V VIHmin = 1.3V VIHmax = 1.95V RI = 10M VI = 0.1V ... 1.875V (valid range) VIH max = 1.910V Resolution 64.979uV SUSPEND mode indi-

cator SUSPEND_ MON O VOLmax = 0.45V at I = 4.5 mA VOHmin = 1.20V at I = 2.5 mA VOHmax = 1.95V 1. Thales strongly recommends to provide test points for certain signal lines to and from the module while developing SMT applications for debug, test and/or trace purposes during the manufacturing process. In this way it is possible to detect soldering (and other) problems. Please refer to [5] and [6] for more in-

formation on test points and how to implement them. The signal lines for which test points should be pro-

vided for are marked as Test point recommended in the above table. t TX62-W_TX62-W-x_TX82-W_HID_v01.000 2021-10-05 Confidential / Preliminary Cinterion TX62-W(-B/-C)/TX82-W Hardware Interface Description 2.1 Application Interface 69 Page 30 of 154 2.1.2.1 Absolute Maximum Ratings The absolute maximum ratings stated in Table 4 are stress ratings under any conditions. Stresses beyond any of these limits will cause permanent damage to TX62/TX82. Table 4: Absolute maximum ratings Parameter Supply voltage BATT+BB (no service) Supply voltage BATT+RF

(not available with TX62-W)

(TX82-W; no service)

(TX62-W-B; no service)

(TX62-W-C; no service) Voltage at all digital lines in Power Down mode Voltage at digital lines 1.8V domain in normal operation1 Current at digital lines in normal operation Voltage at SIM interface, CCVCC 1.8V in normal operation Current at SIM interface in normal 1.8V operation Voltage at ADC line in normal operation V180 in normal operation Current at V180 in normal operation VCORE in normal operation Current at VCORE in normal operation Voltage at USB lines Min

-0.5

-0.5

-0.5

-0.5

-0.5

-0.3

-5

-0.3

-0.5

-0.3

+0.5

-0.5 Max

+6.0

+6.0

+6.0

+5.0

+0.5

+2.09

+5

+2.0

-600

+1.910

+2.09

-600

+1.304

-1200 5.75 Unit V V V V V V mA V mA V V mA V mA V 1. A maximum rating of 1.95V (for VIHmax) is recommended for all digital lines. Exceeding this value how-

ever will not necessarily harm the module as long as the rating remains below the absolute maximum rating of 1.95+0.14V, but it will decrease the safety margin in case of short spikes or ripple. t TX62-W_TX62-W-x_TX82-W_HID_v01.000 2021-10-05 Confidential / Preliminary Cinterion TX62-W(-B/-C)/TX82-W Hardware Interface Description 2.1 Application Interface 69 Page 31 of 154 2.1.3 USB Interface TX62/TX82 supports a USB 2.0 High Speed (480Mbit/s) device interface that is Full Speed

(12Mbit/s) compliant. The external application is responsible for supplying the VUSB_IN line. This line is used for ca-

ble detection only. The USB part (driver and transceiver) is supplied by means of BATT+. This is because TX62/TX82 is designed as a self-powered device compliant with the Universal Se-

rial Bus Specification Revision 2.01. Module SMT VREG (3V075) lin. reg. USB part1) VBUS DP DN Detection only RS RS BATT+

GND VUSB_IN USB_DP2) USB_DN2) 1) All serial (including RS) and pull-up resistors for data lines are implemented. 2) If the USB interface is operated in High Speed mode (480MHz), it is recommended to take special care routing the data lines USB_DP and USB_DN. Application layout should in this case implement a differential impedance of 90 ohms for proper signal integrity. Figure 8: USB circuit To properly connect the module's USB interface to the external application, a USB 2.0 compat-

ible connector and cable or hardware design is required. For more information on the USB re-

lated signals see Table 3. Furthermore, the USB modem driver distributed with TX62/TX82 needs to be installed. 1. The specification is ready for download on https://www.usb.org/document-library/usb-20-specification t TX62-W_TX62-W-x_TX82-W_HID_v01.000 2021-10-05 Confidential / Preliminary Cinterion TX62-W(-B/-C)/TX82-W Hardware Interface Description 2.1 Application Interface 69 Page 32 of 154 2.1.4 Serial Interface ASC0 TX62/TX82 offers an 8-wire unbalanced, asynchronous modem interface ASC0 conforming to ITU-T V.24 protocol DCE signaling. The electrical characteristics do not comply with ITU-T V.28. The significant levels are 0V (for low data bit or active state) and 1.8V (for high data bit or inactive state). For electrical characteristics please refer to Table 3. For an illustration of the interface lines startup behavior see Figure 10. TX62/TX82 is designed for use as a DCE. Based on the conventions for DCE-DTE connections it communicates with the customer application (DTE) using the following signals:

Port TXD @ application sends data to the modules TXD0 signal line Port RXD @ application receives data from the modules RXD0 signal line Figure 9: Serial interface ASC0 Features:

Includes the data lines TXD0 and RXD0, the status lines RTS0 and CTS0 and, in addition, the modem control lines DTR0, DSR0, DCD0 and RING0. The RING0 signal serves to indicate incoming calls and other types of URCs (Unsolicited Result Code). It can also be used to send pulses to the host application, for example to wake up the application from power saving state. By default configured to 8 data bits, no parity and 1 stop bit. ASC0 can be operated at fixed bit rates from 300bps up to 921,600bps. Supports RTS0/CTS0 hardware flow control as a configuration option (see [1]). The hard-

ware hand shake line RTS0 has an internal pull down resistor causing a low level signal, if the line is not used and open. Although hardware flow control is recommended, this allows communication by using only RXD and TXD lines. Wake up from SLEEP mode by RTS0 activation (high to low transition; see Section 3.3.1.1). t TX62-W_TX62-W-x_TX82-W_HID_v01.000 2021-10-05 Confidential / Preliminary Cinterion TX62-W(-B/-C)/TX82-W Hardware Interface Description 2.1 Application Interface 69 Page 33 of 154 The following figure shows the startup behavior of the asynchronous serial interface ASC0. Start up Power supply active Reset state Firmware initialization Command interface initialization Interface active ON VCORE V180 EMERG_RST TXD0 RXD0 RTS0 CTS0 DTR0 DSR0 DCD0 RING0 PD PD PU PD PD PD PD PD PD PD PD Dotted lines indicate possible alternative signal states - depending on externally provided signal states. For pull-up and pull-down values see Table 14. Figure 10: ASC0 startup behavior t TX62-W_TX62-W-x_TX82-W_HID_v01.000 2021-10-05 Confidential / Preliminary Cinterion TX62-W(-B/-C)/TX82-W Hardware Interface Description 2.1 Application Interface 69 Page 34 of 154 2.1.5 Serial Interface ASC1 TX62/TX82 provides a 4-wire unbalanced, asynchronous modem interface ASC1 conforming to ITU-T V.24 protocol DCE signaling. The electrical characteristics do not comply with ITU-T V.28. The significant levels are 0V (for low data bit or active state) and 1.8V (for high data bit or inactive state). For electrical characteristics please refer to Table 3. For an illustration of the interface lines startup behavior see Figure 12. TX62/TX82 is designed for use as a DCE. Based on the conventions for DCE-DTE connections it communicates with the customer application (DTE) using the following signals:

Port TXD @ application sends data to modules TXD1 signal line Port RXD @ application receives data from the modules RXD1 signal line Figure 11: Serial interface ASC1 Features Includes only the data lines TXD1 and RXD1 plus RTS1 and CTS1 for hardware hand-

shake. Configured for 8 data bits, no parity and 1 or 2 stop bits. ASC1 can be operated at fixed bit rates from 300bps to 921,600bps. Supports RTS1/CTS1 hardware flow as a configuration option (see [1]). The hardware hand shake line RTS0 has an internal pull down resistor causing a low level signal, if the line is not used and open. Although hardware flow control is recommended, this allows communi-

cation by using only RXD and TXD lines. t TX62-W_TX62-W-x_TX82-W_HID_v01.000 2021-10-05 Confidential / Preliminary Cinterion TX62-W(-B/-C)/TX82-W Hardware Interface Description 2.1 Application Interface 69 Page 35 of 154 The following figure shows the startup behavior of the asynchronous serial interface ASC1. Start up Power supply active Reset state Firmware initialization Command interface initialization Interface active ON VCORE V180 EMERG_RST TXD1 RXD1 RTS1 CTS1 PD PD PD PD PD PD Dotted lines indicate possible alternative signal states - depending on externally provided signal states.

*) For pull-down values see Table 14. Figure 12: ASC1 startup behavior t TX62-W_TX62-W-x_TX82-W_HID_v01.000 2021-10-05 Confidential / Preliminary Cinterion TX62-W(-B/-C)/TX82-W Hardware Interface Description 2.1 Application Interface 69 Page 36 of 154 2.1.6 UICC/SIM/USIM Interface TX62/TX82 has an integrated UICC/SIM/USIM interface compatible with the 3GPP 31.102 and ETSI 102 221. This is wired to the host interface in order to be connected to an external SIM card holder. Five pads on the SMT application interface are reserved for the SIM interface. The UICC/SIM/USIM interface supports 1.8V SIM cards. Please refer to Table 3 for electrical specifications of the UICC/SIM/USIM interface lines. The CCIN signal serves to detect whether a tray (with SIM card) is present in the card holder. Using the CCIN signal is mandatory for compliance with the GSM 11.11 recommendation if the mechanical design of the host application allows the user to remove the SIM card during oper-

ation. To take advantage of this feature, an appropriate SIM card detect switch is required on the card holder. For example, this is true for the model supplied by Molex, which has been test-

ed to operate with TX62/TX82 and is part of the Thales reference equipment submitted for type approval. See Section 7.1 for Molex ordering numbers. Table 5: Signals of the SIM interface (SMT application interface) Signal Description GND Separate ground connection for SIM card to improve EMC. Thales recommends to use pad J16 or pad M17 as ground connection. CCCLK UICC clock CCVCC SIM supply voltage. CCIO Serial data line, input and output. CCRST UICC reset CCIN Input on the baseband processor for detecting a SIM card tray in the holder. If the SIM is removed during operation the SIM interface is shut down immediately to prevent destruc-

tion of the SIM. The CCIN signal is by default low and must change to high level if a SIM card is inserted. The CCIN signal is mandatory for applications that allow the user to remove the SIM card during operation. The CCIN signal is solely intended for use with a SIM card. It must not be used for any other purposes. Failure to comply with this requirement may invalidate the type approval of TX62/TX82. Note: No guarantee can be given, nor any liability accepted, if loss of data is encountered after removing the SIM card during operation. Also, no guarantee can be given for properly initializ-

ing any SIM card that the user inserts after having removed the SIM card during operation. In this case, the application must restart TX62/TX82. t TX62-W_TX62-W-x_TX82-W_HID_v01.000 2021-10-05 Confidential / Preliminary Cinterion TX62-W(-B/-C)/TX82-W Hardware Interface Description 2.1 Application Interface 69 Page 37 of 154 The figure below shows a circuit to connect an external SIM card holder. V180 CCIN CCVCC CCRST CCIO CCCLK SIM 220nF2 1nF2 10pF1 ,2 10pF1,2 1 = Optional 10pF for SIM protection for RF blocking (internal antenna) 2 = Capacitors should be placed near to the SIM connector or eUICC Figure 13: External UICC/SIM/USIM card holder circuit The total cable length between the SMT application interface pads on TX62/TX82 and the pads of the external SIM card holder must not exceed 100mm in order to meet the specifications of 3GPP TS 51.010-1 and to satisfy the requirements of EMC compliance. To avoid possible cross-talk from the CCCLK signal to the CCIO signal be careful that both lines are not placed closely next to each other. A useful approach is using a GND line to shield the CCIO line from the CCCLK line. An example for an optimized ESD protection for the SIM interface is shown in Section 2.1.6.1. It is possible to connect the UICC/USIM/SIM interface lines to an external SIM card multiplexer controlled by the modules SIM_SWITCH signal. Thus, it becomes possible to switch between two networks/subscriptions each with its own UICC, and maybe different connection speeds. See also Section 2.1.11.4. t TX62-W_TX62-W-x_TX82-W_HID_v01.000 2021-10-05 Confidential / Preliminary Cinterion TX62-W(-B/-C)/TX82-W Hardware Interface Description 2.1 Application Interface 69 Page 38 of 154 2.1.6.1 Enhanced ESD Protection for SIM Interface To optimize ESD protection for the SIM interface it is possible to add ESD diodes (e.g., NUP4114) to the SIM interface lines as shown in the example given in Figure 14. The example was designed to meet ESD protection according ETSI EN 301 489-1/7: Contact discharge: 4kV, air discharge: 8kV. Module CCRST CCCLK CCIO CCVCC CCIN SIM_RST SIM_CLK SIM_IO SIM_VCC SIM_DET 6 5 4 1 2 3 GND Figure 14: SIM interface - enhanced ESD protection Keep SIM lines low capacitative The capacitors shown in Figure 13 must be placed close to the SIM Connector. t TX62-W_TX62-W-x_TX82-W_HID_v01.000 2021-10-05 Confidential / Preliminary Cinterion TX62-W(-B/-C)/TX82-W Hardware Interface Description 2.1 Application Interface 69 Page 39 of 154 2.1.7 eUICC Interface As an option TX62/TX82 supports an eUICC in MFF-XS format. This MFF-XS eUICC is located under the shielding, is only connected to specific module pads, and has no physical connec-

tions with other circuits inside the module. Figure 15 shows an example of how to connect the eUICC to the modules SIM interface lines as well as a switch to select whether to use the in-

ternal MFF-XS eUICC or an external plug-in SIM card. Figure 16 shows an example for a direct connection to the modules SIM interface lines. Max. distance 10cm SIM card holder Alternatively SIM switch can be bridged SIM ESD protection

(see 2.1.6.1) SIM inserted =>

Switch closed 4 4 x 0R SIM switch If 2 Common If 1 FSA2567 Module 4 CCIO pull up resistor and VSIM capacitor 2.2F are mounted on the module SIMSELECT CC2_VCC capacitor 2.2F mounted on the module SIM_SWITCH = Low => SIMSELECT = High: SIM connected SIM_SWITCH = High => SIMSELECT = Low: eUICC connected VBATT 10k 22k 100k VSIM CCIO CCRST CCCLK eUICC CC2_VPP CC2_VCC CC2_IO CC2_RST CC2_CLK SIM_SWITCH to drive SIMSELECT CCIN (Application):

low = > card inserted high => card removed 100k CCIN (Module):

high = > card inserted low => card removed 100k 100p 10k CCIN 100k V180 Figure 15: eUICC interface with switch for external SIM The eUICC interface comprises five lines (plus ground) as listed below in Table 6. Table 6: Signals of the eUICC interface option (SMT application interface) Signal CC2_RST CC2_CLK CC2_IO CC2_VPP CC2_VCC GND Description Chip Card Reset Chip Card Clock Chip Card I/O (data line)

Operation voltage for SIM Card (=1.8V) eUICC Ground t TX62-W_TX62-W-x_TX82-W_HID_v01.000 2021-10-05 Confidential / Preliminary Cinterion TX62-W(-B/-C)/TX82-W Hardware Interface Description 2.1 Application Interface 69 Page 40 of 154 The below Figure 16 shows a direct connection of the internal eUICC to the modules SIM in-

terface lines. Module Baseband controller VSIM CCIO CCRST CCCLK CCIO pull up resistor and VSIM capacitor 2.2F Are mounted on the module CC2_VPP CC2_VCC CC2_IO CC2_RST CC2_CLK eUICC CCIN Figure 16: eUICC interface without SIM switch t TX62-W_TX62-W-x_TX82-W_HID_v01.000 2021-10-05 Confidential / Preliminary Cinterion TX62-W(-B/-C)/TX82-W Hardware Interface Description 2.1 Application Interface 69 Page 41 of 154 2.1.8 GPIO TX82-W, TX62-W-B and TX62-W-C have 7 GPIOs (GPIO6-7,20-23,25) and TX62-W has 6 GPIOs (GPIO7,20-23,25) for external hardware devices. Each GPIO can be configured for use as input or output. All settings are AT command controlled. The configuration is non-volatile and available after module restart. The IO port driver has to be opened before using and configuring GPIOs. Before changing the configuration of a GPIO pin (e.g. input to output) the pin has to be closed. If the GPIO pins are not configured or the pins/driver were closed, the GPIO pins are high-Z with pull down resistor. If a GPIO is configured to input, the pin has high-Z without pull resistor. The following figure shows the start up behavior of the GPIOs interface. Start up Power supply active Reset State Firmware Initialization Command Interface Initialization ON VCORE V180 EMERG_RST GPIO6,7,20-23,25 PD High-Z/PD CTS0 Figure 17: GPIO start up behavior With the embedded processing option of TX62/TX82 additional GPIOs are provided and can be used - see below Section 2.1.8.1. t TX62-W_TX62-W-x_TX82-W_HID_v01.000 2021-10-05 Confidential / Preliminary Cinterion TX62-W(-B/-C)/TX82-W Hardware Interface Description 2.1 Application Interface 69 Page 42 of 154 2.1.8.1 GPIOs Available with Embedded Processing Option The embedded processing option of TX62/TX82 provides a GPIO interface with 13 configu-

rable GPIO lines. Some GPIO lines are shared with other interfaces or functions, and are shown in the following table with their default assignments being marked green. Table 7: GPIO lines and alternative assignments GPIO Status LED ASC1 SPI SIM Switch STATUS GPIO5 GPIO61 GPIO7 GPIO8

(GPIO16)2

(GPIO17)2

(GPIO18)2

(GPIO19)2 GPIO20 GPIO21 GPIO22 GPIO23 GPIO25 SIM_SWITCH RXD1 TXD1 RTS1 CTS1 MOSI MISO SPI_CS SPI_CLK 1. Only available with TX82-W, TX62-W-B and TX62-W-C. 2. Not configurable as GPIO line with the embedded processing option. After startup, the above mentioned alternative GPIO line assignments can be configured through embedded applications (see [8]), or in the case of GPIO5 and GPIO8 also through AT command. The configuration is non-volatile and available after module restart. t TX62-W_TX62-W-x_TX82-W_HID_v01.000 2021-10-05 Confidential / Preliminary Cinterion TX62-W(-B/-C)/TX82-W Hardware Interface Description 2.1 Application Interface 69 Page 43 of 154 2.1.9 I2C Interface The embedded processing option of TX62/TX82 provides an inter-integrated circuit interface. I2C is a serial, 8-bit oriented data transfer bus for bit rates up to 400kbps in Fast mode. It con-

sists of two lines, the serial data line I2CDAT and the serial clock line I2CCLK. The module acts as a single master device, e.g. the clock I2CCLK is driven by the module. I2CDAT is a bi-direc-

tional line. Each device connected to the bus is software addressable by a unique 7-bit ad-

dress, and simple master/slave relationships exist at all times. The module operates as master-

transmitter or as master-receiver. The customer application transmits or receives data only on request of the module. The I2C bus can be configured and activated via embedded application. For more information see [8]. The I2C interface can be powered via the V180 line of TX62/TX82. If connected to the V180 line, the I2C interface will properly shut down when the module enters the Power Down mode. In the application I2CDAT and I2CCLK lines need to be connected to a positive supply voltage via a pull-up resistor. For electrical characteristics please refer to Table 3. Module V180 I2CCLK I2CDAT GND Application p u l l u p R p u l l u p R I2CCLK I2CDAT GND Figure 18: I2C interface connected to V180 Note 1: Good care should be taken when creating the PCB layout of the host application: The traces of I2CCLK and I2CDAT should be equal in length and as short as possible. t TX62-W_TX62-W-x_TX82-W_HID_v01.000 2021-10-05 Confidential / Preliminary Cinterion TX62-W(-B/-C)/TX82-W Hardware Interface Description 2.1 Application Interface 69 Page 44 of 154 2.1.10 SPI Interface The embedded processing option of TX62/TX82 provides an SPI interface where four GPIO interface lines can be configured as Serial Peripheral Interface (SPI). The SPI is a synchronous serial interface allowing the module to control external sensors or components. The SPI inter-

face supports only master mode. The transmission rates are up to 6.5Mbit/s. The SPI interface comprises the two data lines MOSI and MISO, the clock line SPI_CLK a well as the chip select line SPI_CS. The GPIO lines are also shared with the ASC1 signal lines as shown in Section 2.1.8.1. The SPI interface can be configured and activated via embedded application. For more infor-

mation see [8]. In general, SPI supports four operation modes. The modes are different in clock phase and clock polarity. The modules SPI mode can be configured via embedded processing option. Make sure the module and the connected slave device works with the same SPI mode. Figure 19 shows the characteristics of the four SPI modes. The SPI modes 0 and 3 are the most common used modes. For electrical characteristics please refer to Table 3. Clock phase SPI MODE 0 SPI MODE 1 l y t i r a o p k c o C l SPI_CS SPI_CLK MOSI MISO SPI_CS SPI_CLK MOSI MISO SPI_CS SPI_CLK MOSI MISO Sample Sample SPI MODE 2 SPI MODE 3 SPI_CS SPI_CLK MOSI MISO Sample Sample Figure 19: Characteristics of SPI modes t TX62-W_TX62-W-x_TX82-W_HID_v01.000 2021-10-05 Confidential / Preliminary Cinterion TX62-W(-B/-C)/TX82-W Hardware Interface Description 2.1 Application Interface 69 Page 45 of 154 2.1.11 Control Signals 2.1.11.1 Status LED The STATUS line can be configured to drive a status LED that indicates different operating modes of the module. For details on how to configure status signaling please refer to [1]. To take advantage of this function connect an LED to the STATUS line as shown in Figure 20. The sample circuit is not optimized for low current consumption. VCC LED R3 BC847 Based on VCC and current requirement of LED. R1 22k STATUS R2 100k GND GND Figure 20: Status signaling with LED driver 2.1.11.2 Power Indication Circuit In Power Down mode the maximum voltage at any digital or analog interface line must not ex-

ceed +0.3V (see also Section 2.1.2.1). Exceeding this limit for any length of time might cause permanent damage to the module. It is therefore recommended to implement a power indication signal that reports the modules power state and shows whether it is active or in Power Down mode. While the module is in Power Down mode all signals with a high level from an external application need to be set to low state or high impedance state. The sample power indication circuit illustrated in Figure 21 denotes the modules active state with a low signal and the modules Power Down mode with a high signal or high impedance state. The sample circuit is not optimized for low current con-

sumption. t TX62-W_TX62-W-x_TX82-W_HID_v01.000 2021-10-05 Confidential / Preliminary Cinterion TX62-W(-B/-C)/TX82-W Hardware Interface Description 2.1 Application Interface 69 Page 46 of 154 k 0 1 External power supply Power indication 22k V180 k 0 0 1 Figure 21: Power indication circuit 2.1.11.3 Fast Shutdown The FST_SHDN line is an active low control signal and must be applied for at least 15 millisec-

onds. It is recommended to keep the FST_SHDN line low until the module has shut down. If unused this line can be left open because of a configured internal pull-up resistor. Before set-

ting the FST_SHDN line to low, the ON signal should be set to low (see Figure 22). Otherwise there might be back powering at the ON line in Power Down mode. A low impulse on the FST_SHDN line starts the fast shutdown procedure (see Figure 22). The fast shutdown procedure still finishes any data activities on the module's flash file system, thus ensuring data integrity, but will no longer deregister gracefully from the network, thus saving the time required for network deregistration. The fast shutdown procedure takes less than 15 milliseconds. A low level of the V180 signal indicates that the module has entered the Power Down mode.No shutdown URCs will be issued with a fast shutdown. t TX62-W_TX62-W-x_TX82-W_HID_v01.000 2021-10-05 Confidential / Preliminary Cinterion TX62-W(-B/-C)/TX82-W Hardware Interface Description 2.1 Application Interface 69 Page 47 of 154 BATT+

ON EMERG_RST Fast Shut Down V180

< 15ms Figure 22: Fast shutdown timing Please note that the normal software controlled shutdown via AT^SMSO can also be config-

ured as a fast shutdown, i.e., without network deregistration. For details see [1]. 2.1.11.4 SIM Switch The UICC/USIM/SIM interface lines may be connected to an external SIM card multiplexer con-

trolled by the SIM_SWITCH signal as shown in Figure 23. Thus, it becomes possible to switch between two networks/subscriptions each with their own UICC, and maybe different connec-

tion speeds. Please note that hot SIM insert/removal is only possible on the first SIM interface. Also note that the SIM_SWITCH can be used to switch between a SIM and the embedded op-

tional eUICC interface as described in Section 2.1.7. The SIM_SWITCH signal is controlled by AT command (see [1]).

Figure 23: SIM switch circuit t TX62-W_TX62-W-x_TX82-W_HID_v01.000 2021-10-05 Confidential / Preliminary Cinterion TX62-W(-B/-C)/TX82-W Hardware Interface Description 2.1 Application Interface 69 Page 48 of 154 2.1.11.5 SUSPEND Mode Indicator When all conditions for entering into SUSPEND mode are fulfilled, the SUSPEND_MON signal changes from high to low, indicating that the module has entered its SUSPEND mode. When leaving the SUSPEND mode, the URC ^SYSRESUME is triggered, and the SUS-

PEND_MON signal is set to high again. SUSPEND_MON usage can be enabled/disabled by AT command (see [1]: AT^SCFG GPIO/

Mode/Suspend). t TX62-W_TX62-W-x_TX82-W_HID_v01.000 2021-10-05 Confidential / Preliminary Cinterion TX62-W(-B/-C)/TX82-W Hardware Interface Description 2.2 RF Antenna Interface 69 Page 49 of 154 2.2 RF Antenna Interface The RF interface has an impedance of 50. TX62/TX82 is capable of sustaining a total mis-

match at the antenna line without any damage, even when transmitting at maximum RF power. The external antenna must be matched properly to achieve best performance regarding radi-

ated power, modulation accuracy and harmonic suppression. Antenna matching networks are not included on the TX62/TX82 module and should be placed in the host application if the an-

tenna does not have an impedance of 50. Regarding the return loss TX62/TX82 provides the following values in the active band:

Table 8: Return loss in the active band State of module Return loss of module Recommended return loss of application Receive Transmit Idle

> 8dB not applicable 5dB

> 12dB

> 12dB not applicable 2.2.1 Antenna Interface Specifications Table 9: RF Antenna interface GSM / LTE1 of TX82-W, and TX62-W Parameter Conditions Min.2 Typical Unit LTE connectivity (Cat M1) Band 1, 2, 3, 4, 5, 8, 12, 13, 18, 19, 20, 25, 26, 27, 28, 66, 85 TX62-W TX82-W LTE Cat M1:

Receiver Input Sensitivity

@NTNV BW: 5 MHz, UL: Modulation: QPSK; NRB=6;

DL: Modulation: QPSK; NRB=4;

LTE 2100 Band 1 LTE 1800 Band 2 LTE 1900 Band 3

-103

-101

-100 LTE AWS-1 Band 4 -103 LTE 850 Band 5 LTE 900 Band 8

-101.5

-100.5 LTE 700 Band 12 LTE 700 Band 13 LTE 800 Band 18 LTE 800 Band 19

-100

-100

-103

-103 LTE 800 Band 20

-100.5 LTE 1900 Band 25

-101 LTE 800 Band 26

-101 LTE 800 Band 27

-101.5 LTE 700 Band 28

-101.5 LTE AWS-3 Band 66 -99 LTE 700 Band 85

-99.2

-107

-107

-107

-107

-107.5

-107

-107

-107

-107.5

-107.5

-107

-107.5

-107.5

-107.5

-107.5

-107

-107

-106

-106

-105.5

-106

-106

-106.5

-106.3

-106.3

-106.2

-106

-106

-106.2

-106.3

-106

-106

-106

-106 dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm t TX62-W_TX62-W-x_TX82-W_HID_v01.000 2021-10-05 Confidential / Preliminary Cinterion TX62-W(-B/-C)/TX82-W Hardware Interface Description 2.2 RF Antenna Interface 69 Page 50 of 154 Table 9: RF Antenna interface GSM / LTE1 of TX82-W, and TX62-W Parameter Conditions Min.2 Typical Unit TX62-W TX82-W LTE Cat M1:

Power @ ARP with 50 Load, NTNV BW: 5 MHz, UL: Modulation: QPSK; NRB=1;

LTE 2100 Band 1 LTE 1800 Band 2 LTE 1900 Band 3

+18

+18

+18 LTE AWS-1 Band 4 +18 LTE 850 Band 5 LTE 900 Band 8 LTE 700 Band 12 LTE 700 Band 13 LTE 800 Band 18 LTE 800 Band 19 LTE 800 Band 20 LTE 1900 Band 25 LTE 800 Band 26 LTE 800 Band 27 LTE 700 Band 28

+18

+18

+18

+18

+18

+18

+18

+18

+18

+18

+18 LTE AWS-3 Band 66 +18 LTE 700 Band 85

+18

+20

+20

+20

+20

+20

+20

+20

+20

+20

+20

+20

+20

+20

+20

+20

+20

+20

+20

+20

+20

+20

+20

+20

+20

+20

+20

+20

+20

+20

+20

+20

+20

+20

+20 dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm LTE connectivity (Cat NB1/2) Band 1, 2, 3, 4, 5, 8, 12, 13, 18, 19, 20, 25, 26, 28, 66, 71, 85 LTE Cat NB1/2:

Receiver Input Sensitivity

@NTNV DL: Modulation: QPSK; Subcar-

riers: 12;

UL: Modulation: BPSK; Subcar-

rier spacing: 15KHz; Ntones: 1@0 LTE 2100 Band 1

-108.2 LTE 1800 Band 2

-108.2 LTE 1900 Band 3

-108.2 LTE AWS-1 Band 4 -108.2 LTE 850 Band 5 LTE 900 Band 8

-108.2

-108.2 LTE 700 Band 12

-108.2 LTE 700 Band 13

-108.2 LTE 800 Band 18

-108.2 LTE 800 Band 19

-108.2 LTE 800 Band 20

-108.2 LTE 1900 Band 25

-108.2 LTE 800 Band 26

-108.2 LTE 700 Band 28

-108.2

-115

-115.5

-114.5

-115

-116

-115.5

-116

-116

-115.5

-115.5

-115.5

-115.5

-116

-116 LTE AWS-3 Band 66 -108.2

-115.5 LTE 600 Band 71

-108.2 LTE 700 Band 85

-108.2

-116

-116

-114

-114

-114

-114

-114.5

-115

-115

-115

-115

-114.5

-115

-114.5

-115

-115

-114

-115

-115.5 dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm t TX62-W_TX62-W-x_TX82-W_HID_v01.000 2021-10-05 Confidential / Preliminary Cinterion TX62-W(-B/-C)/TX82-W Hardware Interface Description 2.2 RF Antenna Interface 69 Page 51 of 154 Table 9: RF Antenna interface GSM / LTE1 of TX82-W, and TX62-W Parameter Conditions Min.2 Typical Unit TX62-W TX82-W LTE Cat NB1/2:

Power @ ARP with 50 Load, NTNV Configuration ID: 1, UL: Modulation: BPSK; Subcar-

rier: 1;Subcarrier space: 3.75 kHz; Ntones: 1@0 LTE 2100 Band 1 LTE 1800 Band 2 LTE 1900 Band 3

+18

+18

+18 LTE AWS-1 Band 4 +18 LTE 850 Band 5 LTE 900 Band 8 LTE 700 Band 12 LTE 700 Band 13 LTE 800 Band 18 LTE 800 Band 19 LTE 800 Band 20 LTE 1900 Band 25 LTE 800 Band 26 LTE 700 Band 28

+18

+18

+18

+18

+18

+18

+18

+18

+18

+18 LTE AWS-3 Band 66 +18 LTE 600 Band 71 LTE 700 Band 85

+18

+18

+20

+20

+20

+20

+20

+20

+20

+20

+20

+20

+20

+20

+20

+20

+20

+20

+20 GPRS coding schemes Class 10, CS1 to CS4 EGPRS GSM Class GPRS Static Receiver input Sensitivity @ PDTCH/CS-1 Class 10, MCS1 to MCS9 Small MS GSM 850/900 GSM 1800/1900

-104

-104 RF Power @

ARP with 50 Load,

(ROPR = 4, i.e. no reduction) GSM 850/900 GPRS, 1 TX GPRS, 2 TX EDGE, 1 TX EDGE, 2TX GSM 1800/1900 GPRS, 1 TX GPRS, 2 TX EDGE, 1 TX EDGE, 2TX

+20

+20

+20

+20

+20

+20

+20

+20

+20

+20

+20

+20

+20

+20

+20

+20

+20

-110

-109 32.5 32.5 27.0 27.0 29.5 29.5 26.0 26.0 dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm t TX62-W_TX62-W-x_TX82-W_HID_v01.000 2021-10-05 Confidential / Preliminary Cinterion TX62-W(-B/-C)/TX82-W Hardware Interface Description 2.2 RF Antenna Interface 69 Page 52 of 154 Table 9: RF Antenna interface GSM / LTE1 of TX82-W, and TX62-W Parameter Conditions Min.2 Typical Unit TX62-W TX82-W RF Power @

ARP with 50 Load,

(ROPR = 5) GSM 850/900 GPRS, 1 TX GPRS, 2 TX EDGE, 1 TX EDGE, 2TX GSM 1800/1900 GPRS, 1 TX GPRS, 2 TX EDGE, 1 TX EDGE, 2TX RF Power @

ARP with 50 Load,

(ROPR = 6) GSM 850/900 GPRS, 1 TX GPRS, 2 TX EDGE, 1 TX EDGE, 2TX GSM 1800/1900 GPRS, 1 TX GPRS, 2 TX EDGE, 1 TX EDGE, 2TX RF Power @

ARP with 50 Load,

(ROPR = 7) GSM 850/900 GPRS, 1 TX GPRS, 2 TX EDGE, 1 TX EDGE, 2TX GSM 1800/1900 GPRS, 1 TX RF Power @

ARP with 50 Load,

(ROPR = 8, i.e. maximum reduction) GPRS, 2 TX EDGE, 1 TX EDGE, 2TX GSM 850/900 GPRS, 1 TX GPRS, 2 TX EDGE, 1 TX EDGE, 2TX GSM 1800/1900 GPRS, 1 TX GPRS, 2 TX EDGE, 1 TX EDGE, 2TX 1. GSM (2G) only supported by TX82-W. 2. Min. signifies 3GPP limit in case of Receiver Input Sensitivity. 32.5 23.5 27.0 27.0 29.5 29.5 26.0 26.0 32.5 31.5 27.0 27.0 29.5 28.5 26.0 26.0 32.5 29.5 27.0 27.0 29.5 26.5 26.0 26.0 32.5 29.5 27.0 24.0 29.5 26.5 26.0 23.0 dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm t TX62-W_TX62-W-x_TX82-W_HID_v01.000 2021-10-05 Confidential / Preliminary Cinterion TX62-W(-B/-C)/TX82-W Hardware Interface Description 2.2 RF Antenna Interface 69 Page 53 of 154 Table 10: RF Antenna interface LTE of TX62-W-B Parameter Conditions Min.1 Typical Unit LTE connectivity (Cat M1) Band 1, 2, 3, 4, 5, 8, 12, 13, 18, 19, 20, 25, 26, 27, 28, 66, 85 LTE Cat M1:

Receiver Input Sensitivity

@NTNV BW: 5 MHz, UL: Modulation: QPSK; NRB=6;

DL: Modulation: QPSK; NRB=4;

LTE Cat M1:

Power @ ARP with 50 Load, NTNV BW: 5 MHz, UL: Modulation: QPSK; NRB=1;

LTE 2100 Band 1 LTE 1800 Band 2 LTE 1900 Band 3 LTE AWS-1 Band 4 LTE 850 Band 5 LTE 900 Band 8 LTE 700 Band 12 LTE 700 Band 13 LTE 800 Band 18 LTE 800 Band 19 LTE 800 Band 20 LTE 1900 Band 25 LTE 800 Band 26 LTE 800 Band 27 LTE 700 Band 28 LTE AWS-3 Band 66 LTE 700 Band 85 LTE 2100 Band 1 LTE 1800 Band 2 LTE 1900 Band 3 LTE AWS-1 Band 4 LTE 850 Band 5 LTE 900 Band 8 LTE 700 Band 12 LTE 700 Band 13 LTE 800 Band 18 LTE 800 Band 19 LTE 800 Band 20 LTE 1900 Band 25 LTE 800 Band 26 LTE 800 Band 27 LTE 700 Band 28 LTE AWS-3 Band 66 LTE 700 Band 85

-103

-101

-100

-103

-101.5

-100.5

-100

-100

-103

-103

-100.5

-101

-101

-101.5

-101.5

-99

-99.2

+21

+21

+21

+21

+21

+21

+21

+21

+21

+21

+21

+21

+21

+21

+21

+21

+21

-106.5

-106.3

-105.7

-106.3

-106.5

-106.3

-105.7

-106

-106.5

-106.5

-105.5

-106.2

-106.5

-106.4

-105.8

-106.2

-105.6

+23

+23

+23

+23

+23

+23

+23

+23

+23

+23

+23

+23

+23

+23

+23

+23

+23 dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm t TX62-W_TX62-W-x_TX82-W_HID_v01.000 2021-10-05 Confidential / Preliminary Cinterion TX62-W(-B/-C)/TX82-W Hardware Interface Description 2.2 RF Antenna Interface 69 Page 54 of 154 Table 10: RF Antenna interface LTE of TX62-W-B Parameter Conditions Min.1 Typical Unit LTE connectivity (Cat NB1/2) Band 1, 2, 3, 4, 5, 8, 12, 13, 18, 19, 20, 25, 26, 28, 66, 71, 85 LTE Cat NB1/2:

Receiver Input Sensitivity

@NTNV DL: Modulation: QPSK; Subcar-

riers: 12;

UL: Modulation: BPSK; Subcar-

rier spacing: 15KHz; Ntones: 1@0 LTE Cat NB1/2:

Power @ ARP with 50 Load, NTNV Configuration ID: 1, UL: Modulation: BPSK; Subcar-

rier: 1;Subcarrier space: 3.75 kHz; Ntones: 1@0 LTE 2100 Band 1 LTE 1800 Band 2 LTE 1900 Band 3 LTE AWS-1 Band 4 LTE 850 Band 5 LTE 900 Band 8 LTE 700 Band 12 LTE 700 Band 13 LTE 800 Band 18 LTE 800 Band 19 LTE 800 Band 20 LTE 1900 Band 25 LTE 800 Band 26 LTE 700 Band 28 LTE AWS-3 Band 66 LTE 600 Band 71 LTE 700 Band 85 LTE 2100 Band 1 LTE 1800 Band 2 LTE 1900 Band 3 LTE AWS-1 Band 4 LTE 850 Band 5 LTE 900 Band 8 LTE 700 Band 12 LTE 700 Band 13 LTE 800 Band 18 LTE 800 Band 19 LTE 800 Band 20 LTE 1900 Band 25 LTE 800 Band 26 LTE 700 Band 28 LTE AWS-3 Band 66 LTE 600 Band 71 LTE 700 Band 85

-108.2

-108.2

-108.2

-108.2

-108.2

-108.2

-108.2

-108.2

-108.2

-108.2

-108.2

-108.2

-108.2

-108.2

-108.2

-108.2

-108.2

+21

+21

+21

+21

+21

+21

+21

+21

+21

+21

+21

+21

+21

+21

+21

+21

+21

-114

-114.3

-114

-114.5

-115

-115

-115.5

-115.5

-115

-115

-115

-114

-115

-115.5

-114

-115

-115

+23

+23

+23

+23

+23

+23

+23

+23

+23

+23

+23

+23

+23

+23

+23

+23

+23 dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm 1. Min. signifies 3GPP limit in case of Receiver Input Sensitivity. t TX62-W_TX62-W-x_TX82-W_HID_v01.000 2021-10-05 Confidential / Preliminary Cinterion TX62-W(-B/-C)/TX82-W Hardware Interface Description 2.2 RF Antenna Interface 69 Page 55 of 154 Table 11: RF Antenna interface LTE of TX62-W-C Parameter Conditions Min.1 Typical Unit LTE connectivity (Cat M1) Band 1, 2, 3, 4, 5, 8, 12, 13, 18, 19, 20, 25, 26, 27, 28, 31, 66, 72, 85 LTE Cat M1:

Receiver Input Sensitivity

@NTNV BW: 5 MHz, UL: Modulation: QPSK; NRB=6;

DL: Modulation: QPSK; NRB=4;

LTE 2100 Band 1 LTE 1800 Band 2 LTE 1900 Band 3 LTE AWS-1 Band 4 LTE 850 Band 5 LTE 900 Band 8 LTE 700 Band 12 LTE 700 Band 13 LTE 800 Band 18 LTE 800 Band 19 LTE 800 Band 20 LTE 1900 Band 25 LTE 800 Band 26 LTE 800 Band 27 LTE 700 Band 28 LTE 450 Band 31 LTE AWS-3 Band 66 LTE 450 Band 72 LTE 700 Band 85

-103

-101

-100

-103

-101.5

-100.5

-100

-100

-103

-103

-100.5

-101

-101

-101.5

-101.5

-97.3

-99

-97.3

-100 dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm t TX62-W_TX62-W-x_TX82-W_HID_v01.000 2021-10-05 Confidential / Preliminary Cinterion TX62-W(-B/-C)/TX82-W Hardware Interface Description 2.2 RF Antenna Interface 69 Page 56 of 154 Table 11: RF Antenna interface LTE of TX62-W-C Parameter LTE Cat M1:

Power @ ARP with 50 Load, NTNV BW: 5 MHz, UL: Modulation: QPSK; NRB=1;

Conditions LTE 2100 Band 1 LTE 1800 Band 2 LTE 1900 Band 3 LTE AWS-1 Band 4 LTE 850 Band 5 LTE 900 Band 8 LTE 700 Band 12 LTE 700 Band 13 LTE 800 Band 18 LTE 800 Band 19 LTE 800 Band 20 LTE 1900 Band 25 LTE 800 Band 26 LTE 800 Band 27 LTE 700 Band 28 LTE 450 Band 31 LTE AWS-3 Band 66 LTE 450 Band 72 LTE 700 Band 85 Min.1 Typical

+21

+21

+21

+21

+21

+21

+21

+21

+21

+21

+21

+21

+21

+21

+20.5

+24

+21

+24

+21

+23

+23

+23

+23

+23

+23

+23

+23

+23

+23

+23

+23

+23

+23

+23

+26

+23

+25

+23 Unit dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm t TX62-W_TX62-W-x_TX82-W_HID_v01.000 2021-10-05 Confidential / Preliminary Cinterion TX62-W(-B/-C)/TX82-W Hardware Interface Description 2.2 RF Antenna Interface 69 Page 57 of 154 Table 11: RF Antenna interface LTE of TX62-W-C Parameter Conditions Min.1 Typical Unit LTE connectivity (Cat NB1/2) Band 1, 2, 3, 4, 5, 8, 12, 13, 18, 19, 20, 25, 26, 28, 31, 66, 72, 85 LTE Cat NB1/2:

Receiver Input Sensitivity

@NTNV DL: Modulation: QPSK; Subcar-

riers: 12;

UL: Modulation: BPSK; Subcar-

rier spacing: 15KHz; Ntones: 1@0 LTE Cat NB1/2:

Power @ ARP with 50 Load, NTNV Configuration ID: 1, UL: Modulation: BPSK; Subcar-

rier: 1;Subcarrier space: 3.75 kHz; Ntones: 1@0 LTE 2100 Band 1 LTE 1800 Band 2 LTE 1900 Band 3 LTE AWS-1 Band 4 LTE 850 Band 5 LTE 900 Band 8 LTE 700 Band 12 LTE 700 Band 13 LTE 800 Band 18 LTE 800 Band 19 LTE 800 Band 20 LTE 1900 Band 25 LTE 800 Band 26 LTE 700 Band 28 LTE 450 Band 31 LTE AWS-3 Band 66 LTE 450 Band 72 LTE 700 Band 85 LTE 2100 Band 1 LTE 1800 Band 2 LTE 1900 Band 3 LTE AWS-1 Band 4 LTE 850 Band 5 LTE 900 Band 8 LTE 700 Band 12 LTE 700 Band 13 LTE 800 Band 18 LTE 800 Band 19 LTE 800 Band 20 LTE 1900 Band 25 LTE 800 Band 26 LTE 700 Band 28 LTE 450 Band 31 LTE AWS-3 Band 66 LTE 450 Band 72 LTE 700 Band 85

-108.2

-108.2

-108.2

-108.2

-108.2

-108.2

-108.2

-108.2

-108.2

-108.2

-108.2

-108.2

-108.2

-108.2

-108.2

-108.2

-108.2

-108.2

+21

+21

+21

+21

+21

+21

+21

+21

+21

+21

+21

+21

+21

+21

+21

+21

+21

+21 dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm

+23

+23

+23

+23

+23

+23

+23

+23

+23

+23

+23

+23

+23

+23

+23

+23

+23

+23 1. Min. signifies 3GPP limit in case of Receiver Input Sensitivity. t TX62-W_TX62-W-x_TX82-W_HID_v01.000 2021-10-05 Confidential / Preliminary Cinterion TX62-W(-B/-C)/TX82-W Hardware Interface Description 2.2 RF Antenna Interface 69 Page 58 of 154 2.2.2 Antenna Installation The antennas is connected by soldering the antenna pads (RF_OUT, ANT_GNSS) and its neighboring ground pads directly to the applications PCB. Marking GND GND GND GND RF_OUT ANT_GNSS Figure 24: Antenna pads (top view) The distance between the antenna pads and their neighboring GND pads has been optimized for best possible impedance. On the application PCB, special attention should be paid to these pads, in order to prevent mismatch. The wiring of the antenna connection line, starting from the antenna pad to the application an-

tenna should result in a 50 line impedance. Line width and distance to the GND plane needs to be optimized with regard to the PCBs layer stack. Some examples are given in Section 2.2.3. To prevent receiver desensitization due to interferences generated by fast transients like high speed clocks on the application PCB, it is recommended to realize the antenna connection line using embedded Stripline rather than Micro-Stripline technology. Please see Section 2.2.3.1 for an example.1 For type approval purposes, the use of a 50 coaxial antenna connector (U.FL-R-SMT) might be necessary. In this case the U.FL-R-SMT connector should be placed as close as possible to TX62/TX82s antenna pad. 1. Please note that because of KDB 447498.GNSS, it is required to get a dedicated FCC ID, if using a PCB printed antenna. t TX62-W_TX62-W-x_TX82-W_HID_v01.000 2021-10-05 Confidential / Preliminary Cinterion TX62-W(-B/-C)/TX82-W Hardware Interface Description 2.2 RF Antenna Interface 69 Page 59 of 154 2.2.3 RF Line Routing Design 2.2.3.1 Line Arrangement Examples Several dedicated tools are available to calculate line arrangements for specific applications and PCB materials - for example from http://www.polarinstruments.com/ (commercial software) or from http://web.awrcorp.com/Usa/Products/Optional-Products/TX-Line/ (free software). Embedded Stripline This figure below shows a line arrangement example for embedded stripline with 65m FR4 prepreg (type: 1080) and 710m FR4 core (4-layer PCB). Figure 25: Embedded Stripline with 65m prepreg (1080) and 710m core t TX62-W_TX62-W-x_TX82-W_HID_v01.000 2021-10-05 Confidential / Preliminary Cinterion TX62-W(-B/-C)/TX82-W Hardware Interface Description 2.2 RF Antenna Interface 69 Page 60 of 154 Micro-Stripline This section gives two line arrangement examples for micro-stripline. Micro-Stripline on 1.0mm Standard FR4 2-Layer PCB The following two figures show examples with different values for D1 (ground strip separa-

tion). Application board Ground line Antenna line Ground line Figure 26: Micro-Stripline on 1.0mm Standard FR4 2-layer PCB - example 1 t TX62-W_TX62-W-x_TX82-W_HID_v01.000 2021-10-05 Confidential / Preliminary Cinterion TX62-W(-B/-C)/TX82-W Hardware Interface Description 2.2 RF Antenna Interface 69 Page 61 of 154 Application board Ground line Antenna line Ground line Figure 27: Micro-Stripline on 1.0mm Standard FR4 2-layer PCB - example 2 t TX62-W_TX62-W-x_TX82-W_HID_v01.000 2021-10-05 Confidential / Preliminary Cinterion TX62-W(-B/-C)/TX82-W Hardware Interface Description 2.2 RF Antenna Interface 69 Page 62 of 154 Micro-Stripline on 1.5mm Standard FR4 2-Layer PCB The following two figures show examples with different values for D1 (ground strip separa-

tion). Application board Ground line Antenna line Ground line Figure 28: Micro-Stripline on 1.5mm Standard FR4 2-layer PCB - example 1 t TX62-W_TX62-W-x_TX82-W_HID_v01.000 2021-10-05 Confidential / Preliminary Cinterion TX62-W(-B/-C)/TX82-W Hardware Interface Description 2.2 RF Antenna Interface 69 Page 63 of 154 Application board Ground line Antenna line Ground line Figure 29: Micro-Stripline on 1.5mm Standard FR4 2-layer PCB - example 2 t TX62-W_TX62-W-x_TX82-W_HID_v01.000 2021-10-05 Confidential / Preliminary Cinterion TX62-W(-B/-C)/TX82-W Hardware Interface Description 2.2 RF Antenna Interface 69 Page 64 of 154 2.2.3.2 Routing Example Interface to RF Connector Figure 30 shows the connection of the modules antenna pad with an application PCBs coaxial antenna connector. Please note that the TX62/TX82 bottom plane appears mirrored, since it is viewed from TX62/TX82 top side. By definition the top of customer's board shall mate with the bottom of the TX62/TX82 module. Figure 30: Routing to applications RF connector - top view t TX62-W_TX62-W-x_TX82-W_HID_v01.000 2021-10-05 Confidential / Preliminary Cinterion TX62-W(-B/-C)/TX82-W Hardware Interface Description 2.3 GNSS Interface 69 Page 65 of 154 2.3 GNSS Interface 2.3.1 GNSS Receiver TX62/TX82 integrates a GNSS receiver that offers the full performance of GPS/GLONASS/Bei-

Dou/Galileo technology. The GNSS receiver is able to continuously track all satellites in view, thus providing accurate satellite position data. The integrated GNSS receiver supports the NMEA protocol via ASC0 interface. NMEA is a combined electrical and data specification for communication between various (marine) elec-

tronic devices including GNSS receivers. It has been defined and controlled by the US based National Marine Electronics Association. For more information on the NMEA Standard please refer to http://www.nmea.org. Depending on the receivers knowledge of last position, current time and ephemeris data, the receivers startup time (i.e., TTFF = Time-To-First-Fix) may vary: If the receiver has no knowl-

edge of its last position or time, a startup takes considerably longer than if the receiver still has knowledge of its last position, time and almanac or has still access to valid ephemeris data and the precise time. For more information see Section 2.3.3. Often, 2D measurements will be used over 3D depending on space vehicle (SV) locations as this will be just as accurate and faster. By default, the GNSS receiver is switched off. It has to be switched on and configured using AT commands (AT^SGPSC; see [1]). Please note that concurrent GNSS and GSM/LTE oper-

ations are not supported (AT^SCFG= "MEopMode/RscMgmt/Rrc"; see [1]). 2.3.2 GNSS Antenna In addition to the RF antenna interface TX62/TX82 also has a GNSS antenna interface. See Section 2.1.1 to find out where the GNSS antenna pad is located. The GNSS installation is the same as for the RF antenna interface - see Section 2.2.2. It is possible to connect active or passive GNSS antennas. In either case the antennas must have 50 impedance. Please note that if an active GNSS antenna is selected, the voltage for it has to be supplied by the external application, and a capacitor must be added to avoid voltage back-feeding (see Figure 31). If a passive GNSS antenna is selected, this capacitor is optional. Module Application GNSS Receiver Antenna Matching GNSS_ANT RF DC DC LNA Active GNSS Antenna Active GNSS antenna power supply

(Voltage depends on antenna type) 10n 47p Figure 31: Sample supply voltage circuit for active GNSS antenna t TX62-W_TX62-W-x_TX82-W_HID_v01.000 2021-10-05 Confidential / Preliminary Cinterion TX62-W(-B/-C)/TX82-W Hardware Interface Description 2.3 GNSS Interface 69 Page 66 of 154 2.3.3 GNSS Antenna Interface Characteristics (TBD.) Table 12: GNSS properties Parameter Conditions Min. Typical Max. Unit Horizontal accuracy 50% CEP, open sky Maximal update rate Frequency Tracking Sensitivity Acquisition Sensitivity GPS GLONASS Beidou Galileo Open sky Active antenna or LNA Passive antenna:

GPS GLONASS Beidou Galileo Open sky Active antenna or LNA Passive antenna:

GPS GLONASS Beidou Galileo 3 1 m Hz 1573.397 1575.420 1576.443 MHz 1598.563 1602.563 1606.563 1559.052 1561.098 1563.144 1573.397 1575.420 1576.443

-162 dBm

-159. dBm Time-to-First-Fix (TTFF)1 Hot (average at -130dBm) Cold (average at -130dBm) 3 35 s s 1. Test conditions: open sky environment t TX62-W_TX62-W-x_TX82-W_HID_v01.000 2021-10-05 Confidential / Preliminary Cinterion TX62-W(-B/-C)/TX82-W Hardware Interface Description 2.4 Sample Application 69 Page 67 of 154 2.4 Sample Application Figure 32 shows a typical example of how to integrate a TX62/TX82 module with an applica-

tion. Usage of the various host interfaces depends on the desired features of the application. Note that the sample application is not optimized for low current consumption. Because of the very low power consumption design, current flowing from any other source into the module circuit must be avoided, for example reverse current from high state external control lines. Therefore, the controlling application must be designed to prevent reverse current flow. Otherwise there is the risk of undefined states of the module during startup and shutdown or even of damaging the module. Because of the high RF field density inside the module, it cannot be guaranteed that no self interference might occur, depending on frequency and the applications grounding concept. The potential interferers may be minimized by placing small capacitors (47pF) at suspected lines

(e.g. RXD0, TXD0, and ON). While developing SMT applications it is strongly recommended to provide test points for certain signals, i.e., lines to and from the module - for debug and/or test purposes. The SMT application should allow for an easy access to these signals. For details on how to implement test points see [5] and [6]. Possible test points are mentioned in Sec-

tion 2.1.2. The EMC measures are best practice recommendations. In fact, an adequate EMC strategy for an individual application is very much determined by the overall layout and, especially, the po-

sition of components. For example, mounting the internal acoustic transducers directly on the PCB eliminates the need to use the ferrite beads shown in the sample schematic. Depending on the micro controller used by an external application TX62/TX82s digital input and output lines may require level conversion. Section 2.4.1 shows a possible sample level conversion circuit. Disclaimer No warranty, either stated or implied, is provided on the sample schematic diagram shown in Figure 32 and the information detailed in this section. Functionality and compliance with nation-

al regulations depend to a great amount on the used electronic components, and the individual application layout manufacturers are required to ensure adequate design and operating safe-

guards for their products using TX62/TX82 modules. Because of the number of frequencies used it is recommended to involve antenna vendors already quite early to maximize perfor-

mance of the external applications layout. t TX62-W_TX62-W-x_TX82-W_HID_v01.000 2021-10-05 Confidential / Preliminary Cinterion TX62-W(-B/-C)/TX82-W Hardware Interface Description 2.4 Sample Application 69 Page 68 of 154 For switch on circuit see Section 3.2.1 BATT+BB 150K 22K EXSx2-W Main antenna ON 10K GND RF_OUT GND GND ANT_GNSS GND ESD **

ESD **

GNSS antenna 100K RF *

RF *

EMERG_RST BATT+RF 33pF 150F, Low ESR!

Power indication 22K 100K V180 BATT+BB 0K 33pF Power supply 47F, Low ESR!

Low ESR!, e.g., X7 R MLCC VCORE GPIO20...23 GPIO25 ASC1 ASC0 USB Blocking****

Blocking****

Blocking****

5 4 8 3 FST_SHDN STATUS GPIO6...7 SIM_SWITCH LED i l B o c k n g

Add optional 10pF for SIM protection against RF (internal Antenna) V180 10pF 10pF SIM 220nF 1nF CCIN VSIM CCIO CCRST CCCLK eUICC CC2_VCC CC2_IO CC2_RST CC2_CLK CC2_VPP eUICC interface (optional ) *****

All SIM components should be close to card holder. GND Keep SIM wires low capacitive. Enhanced ESD***

RF* = Optional 47pF against self-interference. See also Section 3.6 for measures against RF interference ESD** = ESD protection for RF antenna interface. For more details see Section 3.6.1 Enhanced ESD*** = Enhanced ESD protection for SIM interface. For more details see Section 2.1.6.1 Blocking**** = For more details see Section 3.6 eUICC interface***** = For more details see Section 2.1.7 Figure 32: Schematic diagram of TX62/TX82 sample application t TX62-W_TX62-W-x_TX82-W_HID_v01.000 2021-10-05 Confidential / Preliminary Cinterion TX62-W(-B/-C)/TX82-W Hardware Interface Description 2.4 Sample Application 69 Page 69 of 154 2.4.1 Sample Level Conversion Circuit Depending on the micro controller used by an external application TX62/TX82s digital input and output lines (i.e., ASC0, ASC1) may require level conversion. The following Figure 33 shows a sample circuit with recommended level shifters for an external applications micro con-

troller (with VLOGIC between 3.0V...3.6V). The level shifters can be used for digital input and output lines with VOHmax=1.85V or VIHmax =1.85V. The sample circuit is not optimized for low current consumption. External application VLOGIC

(3.0V...3.6V) Input lines, e.g., RXD, CTS VCC Low level input Low level input Low level input Micro controller E.g., 74VHC1GT50 74LV1T34 VCC Output lines, e.g., TXD, RTS 5V tolerarant 5V tolerant E.g., 74LVC2G34 NC7WZ16 Figure 33: Sample level conversion circuit Wireless module Digital output lines, e.g., RXDx, CTSx V180 (1.8V) Digital input lines, e.g., TXDx, RTSx t TX62-W_TX62-W-x_TX82-W_HID_v01.000 2021-10-05 Confidential / Preliminary Cinterion TX62-W(-B/-C)/TX82-W Hardware Interface Description 3 Operating Characteristics 110 Page 70 of 154 3 Operating Characteristics 3.1 Operating Modes The table below briefly summarizes the various operating modes referred to throughout the document. Table 13: Overview of operating modes Mode Function Normal operation Data transfer Idle GSM/(E)GPRS/LTE M1 NB1/2 data transfer in progress. Software and interfaces are active and ready to send and receive, but no GSM/(E)GPRS/LTE M1 NB1/2 data transfer is currently in progress. SLEEP1 Low power mode when no call is in progress and there is no active communication on any serial interface (ASC0, ASC1). During SLEEP mode, the module is in a low power consumption state depending on paging cycles based on network defined DRX values, and optionally network negotiated eDRX (extended DRX) as well as 3GPP PSM values. The firmware is active to a minimum extent, and preserves the state it was in before entering the SLEEP mode. The module stays registered to the network. SLEEP mode option can be enabled/disabled by AT command (see : AT^SCFG parameter MEopMode/PwrSave). SUSPEND1 Low power mode when almost all components are switched off - except for the internal RTC and interrupt triggered wake up mechanisms. The module keeps reg-

istered to the network. The module is in its lowest power consumption state. The module can only be woken up by the ON or EMERG_RST signal, or it may wake up and be reachable again after expiration of a 3GPP PSM (Power Saving Mode) periodic TAU cycle (i.e., network timer) that may include DRX and/or eDRX paging cycles for a certain inactivity period. The module wakes up with its signal states being the same as for the first startup configuration, and does not preserve the sig-

nal states it had in before entering SUSPEND mode. The SUSPEND mode option can be enabled/disabled by AT commands (see MEopMode/PowerMgmt/Suspend). Airplane Restricted operating mode where the modules radio part is shut down, causing the module to log off from the GSM/(E)GPRS/LTE M1 NB1/2 network, and to disable all AT commands whose execution requires a radio connection. Airplane mode can be controlled by AT command (see : AT+CFUN). POWER DOWN State after normal shutdown by sending the switch off command (see : AT^SMSO). Software is not active. Interfaces are not accessible. Operating voltage remains applied. 1. For details on the modules low power modes and their configuration, please refer to Section 3.3. t TX62-W_TX62-W-x_TX82-W_HID_v01.000 2021-10-05 Confidential / Preliminary Cinterion TX62-W(-B/-C)/TX82-W Hardware Interface Description 3.2 Power Up/Power Down Scenarios 110 Page 71 of 154 3.2 Power Up/Power Down Scenarios Do not turn on TX62/TX82 while it is beyond the safety limits of voltage stated in Section 2.1.2.1. TX62/TX82 immediately switches off after having started and detected these inappro-

priate conditions. In extreme cases this can cause permanent damage to the module. 3.2.1 Turn on TX62/TX82 TX62/TX82 can be turned on as described in the following sections:

Hardware driven switch on by ON signal: Starts Normal mode (see Section 3.2.1.1 as well as Section 3.2.1.2 (for automatic power on)). After startup or restart, a high level of the V180 and VCORE lines, as well as the URC ^SYS-

START send by the module indicate that the module has started up (again). The URC notifies the host application that the first AT command can be sent to the module (see also [1]). 3.2.1.1 Switch on TX62/TX82 Using ON Signal The ON signal switches the module on, if the module is in POWER DOWN mode (or in SUS-

PEND mode - see Section 3.3.1). This signal is a rising edge sensitive signal. The maximum input voltage can be BATT+. The module starts in the operating mode with a rising edge signal at the ON signal. The following Figure 34 and Figure 35 show the recommended power on circuit and the start-

up timings if ON valid. R1 R2 VBATT+

R1 = 150k R2 = 22k R3 = 10k IGT ON R3 Figure 34: Sample ON circuit t TX62-W_TX62-W-x_TX82-W_HID_v01.000 2021-10-05 Confidential / Preliminary Cinterion TX62-W(-B/-C)/TX82-W Hardware Interface Description 3.2 Power Up/Power Down Scenarios 110 Page 72 of 154 BATT+

ON VCORE V180 EMERG_RST

~52ms

~51ms

>1ms

>30ms Only rising edge starts up the module Figure 35: ON startup timing t TX62-W_TX62-W-x_TX82-W_HID_v01.000 2021-10-05 Confidential / Preliminary Cinterion TX62-W(-B/-C)/TX82-W Hardware Interface Description 3.2 Power Up/Power Down Scenarios 110 Page 73 of 154 3.2.1.2 Automatic Power On When an automatic power on circuit is required for the module application, the ON pulse must be generated after BATT+ is applied. To achieve this, it is recommend to add a monoflop circuit. With the initial switch on after BATT+ was applied, the pulse of the ON signal must be longer than 1ms. Afterwards, and if the module was already turned off at least once by AT^SMSO, the pulse of the ON signal to switch the module on must be longer than 30ms. Figure 36 shows a suitable sample circuit. Figure 36: Automatic switch ON circuit sample For the sample voltage detector circuit it is recommended to use the voltage detector NCP803SN232T1G from ON Semiconductor, and the monoflop 74LVC1G123 from Nexperia. t TX62-W_TX62-W-x_TX82-W_HID_v01.000 2021-10-05 Confidential / Preliminary Cinterion TX62-W(-B/-C)/TX82-W Hardware Interface Description 3.2 Power Up/Power Down Scenarios 110 Page 74 of 154 3.2.2 Restart TX62/TX82 After startup TX62/TX82 can be re-started as described in the following sections:

Software controlled reset by AT+CFUN command: Starts Normal mode (see Section 3.2.2.1). Hardware controlled reset by EMERG_RST line: Starts Normal mode (see Section 3.2.2.2) 3.2.2.1 Restart TX62/TX82 via AT+CFUN Command To reset and restart the TX62/TX82 module use the command AT+CFUN. See [1] for details. 3.2.2.2 Restart TX62/TX82 Using EMERG_RST The EMERG_RST signal is internally connected to the central processor. A low level phase

>800ms triggers the module restart process, and sets the processor and all signals to their re-

spective reset states. With a low level phase <800ms no module restart is triggered, and the module state remains unchanged. The reset state is described in Section 3.2.3 as well as in the figures showing the startup behavior of an interface. Please note that if the EMERG_RST signal is not released, i.e., changed from low to high, after a restart, the module will be repeatedly restarted. Ignition System started Reset State System started again BATT+

ON VCORE V180 EMERG_RST

~800ms

>800ms Figure 37: Emergency restart timing It is strongly recommended to control this EMERG_RST line with an open collector transistor or an open drain field-effect transistor. Caution: Use the EMERG_RST line only when, due to serious problems, the software is not responding for more than 5 seconds. Pulling the EMERG_RST line causes the loss of all infor-

mation stored in the volatile memory. Therefore, this procedure is intended only for use in case of emergency, e.g. if TX62/TX82 does not respond, if reset or shutdown via AT command fails. t TX62-W_TX62-W-x_TX82-W_HID_v01.000 2021-10-05 Confidential / Preliminary Cinterion TX62-W(-B/-C)/TX82-W Hardware Interface Description 3.2 Power Up/Power Down Scenarios 110 Page 75 of 154 3.2.3 Signal States after Startup Table 14 describes various states interface signals pass through after startup until the system is active. Signals are in an initial state while the module is initializing. Once the startup initialization has completed, i.e. when the software is running, all signals are in a defined state, the module is ready to receive and transmit data. The state of some signals may change again once a re-

spective interface is activated or configured by AT command. For details on certain other signal state changes during startup see also Section 3.2.1 (ON, VCORE, V180), Section 3.2.2

(EMERG_RST), and Section 2.1.4 (ASC0 signals). Table 14: Signal states Signal name Reset state First start up configuration CCIO CCRST CCCLK CCIN RXD0 TXD0 CTS0 RTS0 DTR0 DCD0 DSR0 RING0 RXD1 TXD1 CTS1 RTS1 STATUS FST_SHDN I2CDAT1 I2CCLK1 SIM_SWITCH SUSPEND_MON GPIO6,7,20-23,25 PD PD PD PD PD PD PD PD PD PD PD PD PD PD PD PD PD PD PD PD PD PD PD O / L O / L O / L I / PD O / H I / PD O / H I / PD I / PU O / H O / H O / H O / H I / PD O / H I / PD I / PD I / PU OD OD I / PD I / PD High-Z / PD 1. Available with embedded processing option only. Abbreviations used in above Table 14:

L = Low level H = High level High-Z = High Impedance I = Input O = Output OD = Open Drain PD = Pull down, 55k ~390k PU = Pull up, 55k ~390k t TX62-W_TX62-W-x_TX82-W_HID_v01.000 2021-10-05 Confidential / Preliminary Cinterion TX62-W(-B/-C)/TX82-W Hardware Interface Description 3.2 Power Up/Power Down Scenarios 110 Page 76 of 154 3.2.4 Turn off TX62/TX82 To switch the module off the following procedures may be used:

Software controlled shutdown procedure: Software controlled by sending an AT command over the serial application interface. See Section 3.2.4.1. Hardware controlled shutdown procedure: Hardware controlled by setting the FST_SHDN line to low. See Section 2.1.11.3. Automatic shutdown (software controlled): See Section 3.2.5

- Takes effect if TX62/TX82 board temperature exceeds a critical limit, or if

- Undervoltage or overvoltage is detected. 3.2.4.1 Switch off TX62/TX82 Using AT Command The best and safest approach to powering down the module is to issue the AT^SMSO com-

mand. This procedure lets the module log off from the network and allows the software to enter into a secure state and to save data before disconnecting the power supply. The shutdown pro-

cedure will be an active process for about 2 seconds (depending on environmental conditions such as network states) until the module switches off. It cannot be specified how long the shut-

down procedure may take at the worst. AT^SMSO Switch off procedure Power Down mode 2 seconds BATT+

ON EMERG_RST V180 Figure 38: Switch off behavior A low level of the V180 signal as well as the URC "^SHUTDOWN" indicate that the switch off procedure has completed and the module has entered the Power Down mode. t TX62-W_TX62-W-x_TX82-W_HID_v01.000 2021-10-05 Confidential / Preliminary Cinterion TX62-W(-B/-C)/TX82-W Hardware Interface Description 3.2 Power Up/Power Down Scenarios 110 Page 77 of 154 3.2.5 Automatic Shutdown Automatic shutdown takes effect if the following event occurs:

The TX62/TX82 board is exceeding the critical limits of overtemperature or undertempera-

ture (see Section 3.2.5.1) Undervoltage or overvoltage is detected (see Section 3.2.5.2 and Section 3.2.5.3) The automatic shutdown procedure is equivalent to the power-down initiated with an AT com-

mand, i.e. TX62/TX82 logs off from the network and the software enters a secure state avoiding loss of data. 3.2.5.1 Thermal Shutdown The board temperature is constantly monitored by an internal NTC resistor located on the PCB. The values detected by the NTC resistor are measured directly on the board and therefore, are not fully identical with the ambient temperature. Each time the board temperature goes out of range or back to normal, TX62/TX82 instantly dis-

plays an alert (if enabled). URCs indicating the level "1" or "-1" allow the user to take appropriate precautions, such as protecting the module from exposure to extreme conditions. The presentation of the URCs depends on the settings selected with the AT^SCTM write command (for details see ):

AT^SCTM=1: Presentation of URCs is always enabled. AT^SCTM=0 (default): Presentation of URCs is enabled during the 2 minute guard period after start-up of TX62/TX82. After expiry of the 2 minute guard period, the presentation of URCs will be disabled, i.e. no URCs with alert levels "1" or ''-1" will be generated. URCs indicating the level "2" or "-2" are followed by an orderly shutdown after 5 seconds unless the temperature returns to a valid operating level ("1", "0", "-1") or or the shutdown ability was disabled with AT^SCFG, "MEopMode/ShutdownOnCritTemp",<sdoct>. The pre-

sentation of these URCs is always enabled, i.e. they will be output even though the factory setting AT^SCTM=0 was never changed. The maximum temperature ratings are stated in Section 3.5. Refer to Table 15 for the associ-

ated URCs. Table 15: Temperature dependent behavior Sending temperature alert (2min after module start-up, otherwise only if URC presentation enabled)

^SCTM_B: 1 Board close to overtemperature limit.

^SCTM_B: -1 Board close to undertemperature limit.

^SCTM_B: 0 Board back to non-critical temperature range. Automatic shutdown after 5 seconds (URC appears no matter whether presentation was enabled or not)

^SCTM_B: 2 Alert: Board equal or beyond overtemperature limit. TX62/TX82 switches off.

^SCTM_B: -2 Alert: Board equal or below undertemperature limit. TX62/TX82 switches off. t TX62-W_TX62-W-x_TX82-W_HID_v01.000 2021-10-05 Confidential / Preliminary Cinterion TX62-W(-B/-C)/TX82-W Hardware Interface Description 3.2 Power Up/Power Down Scenarios 110 Page 78 of 154 3.2.5.2 Undervoltage Shutdown The undervoltage shutdown threshold is the specified minimum supply voltage VBATT+ given in Table 3. When the average supply voltage measured by TX62/TX82 approaches the undervolt-

age shutdown threshold (i.e., 0.05V offset) the module will send the following URC:

^SBC: Undervoltage If the undervoltage persists the module will send the URC several times before switching off automatically. This type of URC does not need to be activated by the user. It will be output automatically when fault conditions occur. Note: For battery powered applications it is strongly recommended to implement a BATT+ con-

necting circuit in order to not only be able save power, but also to restart the module after an undervoltage shutdown where the battery is deeply discharged. Also note that the undervolt-

age threshold is calculated for max. 400mV voltage drops during transmit burst. Power supply sources for external applications should be designed to tolerate 400mV voltage drops without crossing the lower limit of 3.3V. For external applications operating at the limit of the allowed tolerance the default undervoltage threshold may be adapted by subtracting an offset. For de-

tails see [1]: AT^SCFG= "MEShutdown/sVsup/threshold". 3.2.5.3 Overvoltage Shutdown The overvoltage shutdown threshold is the specified maximum supply voltage VBATT+ given in Table 3. When the average supply voltage measured by TX62/TX82 approaches the overvolt-

age shutdown threshold (i.e., 0.05V offset) the module will send the following URC:

^SBC: Overvoltage Warning The overvoltage warning is sent only once - until the next time the module is close to the over-

voltage shutdown threshold. If the voltage continues to rise above the specified overvoltage shutdown threshold, the module will send the following URC:

^SBC: Overvoltage Shutdown This alert is sent only once before the module shuts down cleanly without sending any further messages. This type of URC does not need to be activated by the user. It will be output automatically when fault conditions occur. Keep in mind that several TX62/TX82 components are directly linked to BATT+ and, therefore, the supply voltage remains applied at major parts of TX62/TX82. Especially the power amplifier linked to BATT+RF is sensitive to high voltage and might even be destroyed. t TX62-W_TX62-W-x_TX82-W_HID_v01.000 2021-10-05 Confidential / Preliminary Cinterion TX62-W(-B/-C)/TX82-W Hardware Interface Description 3.3 Power Saving 110 3.3 Power Saving Page 79 of 154 TX62/TX82 can control its power consumption through specific features as summarized in Table 16, and further detailed in the following sections. The mentioned operating modes are detailed in Section 3.1. For typical power supply ratings during power saving please refer to Section 3.4.1. Table 16: Power saving features Module operation mode Network actions Power Saving Features Normal operation (network connected) Data transfer Active transfer Radio Output Power Reduction (ROPR) for GSM only IDLE DRX paging Paging cycles based on DRX values provided by network eDRX paging Paging cycles based on eDRX values negotiated with network 3GPP PSM paging Paging cycles based on 3GPP PSM values negotiated with network Low power operation (network connected) SLEEP DRX paging Serial interface (ASC0, ASC1) shut down - except for RTS0/1 available as possible wakeup signal Paging cycles based on DRX values provided by network eDRX paging Serial interface (ASC0, ASC1) shut down - except for RTS0/1 available as possible wakeup signal Paging cycles based on provided DRX and negotiated eDRX values 3GPP PSM paging Serial interface (ASC0, ASC1) shut down - except for RTS0/1 available as possible wakeup signal Paging cycles based on provided DRX, negotiated optional eDRX, as well as 3GPP PSM values SUSPEND DRX paging All components shut down - except for RTC and certain signal triggered wake-up mechanisms Paging cycles based on DRX values provided by network eDRX paging All components shut down - except for RTC and certain signal triggered wake-up mechanisms Paging cycles based on provided DRX and negotiated eDRX values 3GPP PSM paging All components shut down - except for RTC and certain signal triggered wake-up mechanisms Paging cycles based on provided DRX, negotiated optional eDRX, as well as 3GPP PSM values No network connection Airplane POWER DOWN Power off t

Module radio part shut down Module switched off. Standby state with BATT+ connected Module switched off. BATT+ not connected TX62-W_TX62-W-x_TX82-W_HID_v01.000 Confidential / Preliminary 2021-10-05 Cinterion TX62-W(-B/-C)/TX82-W Hardware Interface Description 3.3 Power Saving 110 Page 80 of 154 3.3.1 Low Power Modes There are two specific low power modes available that can be configured to allow TX62/TX82 to save power - SLEEP mode (Section 3.3.1.1) and SUSPEND mode (Section 3.3.1.2). Figure 39 illustrates how the module transits between its operating modes including SLEEP and SUSPEND modes. RTS0assertion

(+URCanddata) Datatransfer RING0toggle

(+URCand/ordata) Nodataavailable RRCrelease Dataavailable Seriali/finactive

(+AT^SCFGMeOpMode/

PwrSaveenabled,optional:

AT+CPSMS/AT+CEDRXS) SLEEP SerialI/finactive

(+AT^SCFGMeOpMode/

PowerMgmt/Suspendenabled, required:AT+CPSMS/AT+CEDRXS) SUSPEND Idling

(IDLE) Seriali/factive ONsignal AT^SMSO ONsignal POWERDOWN Figure 39: Low power modes with state transitions Notes:

When all serial interfaces (i.e. ASC0, and ASC1) are idle, the module can enter SLEEP or SUSPEND mode depending on additional configuration settings. The serial interfaces are not idle if there is any response message not read out from any of them. t TX62-W_TX62-W-x_TX82-W_HID_v01.000 2021-10-05 Confidential / Preliminary Cinterion TX62-W(-B/-C)/TX82-W Hardware Interface Description 3.3 Power Saving 110 Page 81 of 154 3.3.1.1 SLEEP Mode SLEEP mode is a modules low power mode when no call is in progress and there is no active communication on any serial interface (ASC0, ASC1). During SLEEP mode, the serial interfac-

es are shut down except for RTS0 that may be used to wake up TX62/TX82 from SLEEP mode

(see below). The module is in a low power consumption state depending on paging cycles based on network defined DRX values, and possibly network negotiated eDRX (extended DRX) as well as 3GPP PSM values - if configured. The firmware is active to a minimum extent, and preserves the state it was in before entering the SLEEP mode. The module stays registered to the network. For details on the network based DRX values see Section 3.3.2.1 (GSM/(E)GPRS) and Section 3.3.3.1 (LTE M1 NB1/2). For details on the network negotiated eDRX values see Section 3.3.3.2, for network negotiated 3GPP PSM values see Section 3.3.3.3. The SLEEP mode option an be enabled/disabled by AT command (see [1]: AT^SCFG param-

eter MEopMode/PwrSave). RTS0 can be used to wake up TX62/TX82 from SLEEP mode between paging cycles. Asser-

tion of RTS0 (i.e., toggle from inactive high to active low) serves as wake up event, thus allow-

ing an external application to almost immediately terminate power saving. After RTS0 assertion, the CTS0 line signals module wake up, i.e., readiness of the AT command interface. It is therefore recommended to enable RTS/CTS flow control (default setting). Figure 40 shows the described RTS0 wake up mechanism. RTS0 CTS0 TXD0 RXD0 RTS assertion (falling edge) RTS back Wake up from SLEEP mode Return to SLEEP mode AT command Reply URC Figure 40: Wake-up via RTS0 t TX62-W_TX62-W-x_TX82-W_HID_v01.000 2021-10-05 Confidential / Preliminary Cinterion TX62-W(-B/-C)/TX82-W Hardware Interface Description 3.3 Power Saving 110 Page 82 of 154 3.3.1.2 SUSPEND Mode In contrast to SLEEP mode, SUSPEND mode is a modules low power mode with almost all components switched off - except for the internal RTC and interrupt triggered wake up mech-

anisms. The module stays registered to the network, and the RRC connection is released. The module is in its lowest power consumption state. Once the SUSPEND mode is enabled via AT command (see MEopMode/PowerMgmt/Sus-

pend), and the appropriate SUSPEND mode indicators are enabled (see PSM and possible eDRX settings need to be negotiated with the network. eDRX and PSM network settings are described in more detail in Section 3.3.3.2 and Section 3.3.3.3. If the PSM settings are agreed upon with the network, TX62/TX82 is able to enter SUSPEND mode, and the following AT^SIND URC is generated:

+CIEV: suspendAvailable,1 In addition, if there is no further communication with the network, and the module is ready to enter SUSPEND mode, the following AT^SIND URC is generated:

+CIEV: "suspendReady",1 Also, the SUSPEND_MON signal will turn low as soon as the module enters SUSPEND mode

(see Section 2.1.11.5). Figure 41 shows the handshake between external application, module and the network for en-

tering SUSPEND mode or possibly SLEEP mode depending on configuration and network re-

sponse. External Application EnableSUSPENDmode

(AT^SCFGMEopMode /

PowerMgmt/Suspend) RequestPSMtimers

(AT+CPSMS) Optional:RequesteDRXtimers

(AT+CEDRXS/AT+SEDRXS) SUSPENDmodepossible

(+CIEV:suspendAvailable,1) ReadyforSUSPENDmode

(+CIEV:suspendReady,1) Interfacesinactive SUSPENDoroptionallySLEEP modereached RequestPSMandoptionaleDRX withdesiredtimers Module NetworkconfirmsPSMand/or optionaleDRX andassignstimers Network Figure 41: Handshake for entering the modules SUSPEND mode t TX62-W_TX62-W-x_TX82-W_HID_v01.000 2021-10-05 Confidential / Preliminary Cinterion TX62-W(-B/-C)/TX82-W Hardware Interface Description 3.3 Power Saving 110 Page 83 of 154 From SUSPEND mode the module can only be woken up by the ON or EMERG_RST signals, or it may wake up and be reachable again after expiration of a negotiated 3GPP PSM periodic TAU cycle (i.e., network timer) that may include DRX as well as eDRX paging cycles for an inactivity period (see Section 3.3.3.3 for details). The module wakes up with its signal states being the same as the first startup configuration

(see Section 3.2.3), and does not preserve the signal states it had in before entering SUSPEND mode. Figure 42 shows the handshake between external application, module and network for waking up the module via ON/EMERG_RST signal. ON/EMERG_RSTsignaltriggered External Application

^SYSRESUME ATcommands

(e.g.,AT^SISO;AT^SISW Module Network RRCconnectionrequest Figure 42: Handshake for module wake up via ON signal Figure 43 shows the handshake between external application, module and network for waking up the module after expiry of the 3GPP PSM periodic TAU cycle (Tracking Area Update). In this case the module automatically wakes up, and is reachable by the network to receive data (e.g., an SMS). The module wakeup can be indicated to the external application by tog-

gling the RING0 line. See [1] for the AT^SGPICFG command to control the RING0 logic level. The external application should now activate the appropriate communication interfaces to wake up the module from SUSPEND mode, to receive the ^SYSRESUME URC, and to be able to transfer data. Timer(TAU)expiry/update Data/SMS Module Network External Application RING0toggle Interfacesactive

^SYSRESUME OtherURCs,Data,SMS Figure 43: Handshake for module wake up after eDRX/PSM timer expiry t TX62-W_TX62-W-x_TX82-W_HID_v01.000 2021-10-05 Confidential / Preliminary Cinterion TX62-W(-B/-C)/TX82-W Hardware Interface Description 3.3 Power Saving 110 Page 84 of 154 3.3.2 Power Saving while Attached to GSM Networks (TX82-W only) Power saving while attached to GSM networks is based on standard DRX values defined for the network (see Section 3.3.2.1). Apart from network based power saving it is possible to use the AT command AT^SCFG="Ra-

dio/OutputPowerReduction" for the module in (E)GPRS multislot scenarios to reduce its output power according to 3GPP 45.005. By default a maximum power reduction is enabled. For de-

tails on this AT command see [1]. 3.3.2.1 DRX (Standard Configuration) The power saving possibilities while attached to a GSM network depend on the paging timing cycle of the base station. The duration of a power saving interval can be calculated using the following formula:

t = 4.615 ms (TDMA frame duration) * 51 (number of frames) * DRX value. DRX (Discontinuous Reception) is a value from 2 to 9, resulting in paging intervals between 0.47 and 2.12 seconds. The DRX value of the base station is assigned by the GSM network operator. In the pauses between listening to paging messages, the module resumes power saving, i.e., SLEEP mode, as shown in Figure 44. DRXpagingcycle 0.472.12seconds DRXpagingcycle 0.472.12seconds DRXpagingcycle 0.472.12seconds Paging Powersaving(SLEEP) Paging Powersaving(SLEEP) Paging Powersaving(SLEEP) Paging Figure 44: DRX based paging and power saving (SLEEP) in GSM networks The varying pauses explain the different potential for power saving during SLEEP mode. The longer the pause the less power is consumed. Generally, power saving depends on the modules application scenario and may differ from the above mentioned normal operation. The power saving interval may be shorter than 0.47 sec-

onds or longer than 2.12 seconds. 3.3.2.2 eDRX (Extended DRX Configuration) Note: eDRX support for GSM networks is disabled. eDRX support is only available for LTE Cat M1 and Cat NB1/2 networks (see Section 3.3.3.2). t TX62-W_TX62-W-x_TX82-W_HID_v01.000 2021-10-05 Confidential / Preliminary Cinterion TX62-W(-B/-C)/TX82-W Hardware Interface Description 3.3 Power Saving 110 Page 85 of 154 3.3.3 Power Saving while Attached to LTE M1 NB1/2 Networks This section describes the power saving possibilities in LTE Cat M1 and LTE Cat NB1/2 net-

works through DRX (see Section 3.3.3.1) values, as well as configurable eDRX (see Section 3.3.3.2), and 3GPP PSM (see Section 3.3.3.3) timers. 3.3.3.1 DRX (Standard Configuration) TX62/TX82 can be enabled to use DRX (Discontinuous Reception) in RRC idle mode to reduce power consumption (see also Section 3.3.1.1). The power saving possibilities while attached to an LTE Cat M1 or LTE Cat NB1/2 network depend on the paging timing cycle of the base station. During normal operation, i.e., the module is connected to an LTE Cat M1 or LTE Cat NB1/2 network, the duration of power saving period varies. It may be calculated using the following formula:

t = DRX Cycle Value * 10 ms DRX cycle value in LTE Cat M1 or LTE Cat NB1/2 networks is any of the four values: 128, 256, 512 and 1024, thus resulting power saving intervals between 1.28 and 10.24 seconds. The DRX cycle value of the base station is assigned by the network operator. In the pauses between listening to paging messages, the module resumes power saving, as shown in Figure 45. DRXpagingcycle DRXpagingcycle DRXpagingcycle 1.2810.24seconds 1.2810.24seconds 1.2810.24seconds Paging Powersaving(SLEEP) Paging Powersaving(SLEEP) Paging Powersaving(SLEEP) Paging Figure 45: DRX based paging and power saving (SLEEP) in LTE Cat M1 and Cat NB1/2 networks The varying pauses explain the different potential for power saving (SLEEP mode). The longer the pause the less power is consumed. t TX62-W_TX62-W-x_TX82-W_HID_v01.000 2021-10-05 Confidential / Preliminary Cinterion TX62-W(-B/-C)/TX82-W Hardware Interface Description 3.3 Power Saving 110 Page 86 of 154 3.3.3.2 eDRX (Extended DRX Configuration) TX62/TX82 and the network may negotiate the use of eDRX (extended DRX) to reduce power consumption, while being available for mobile terminating data and/or network originated pro-

cedures within a certain delay dependent on the network negotiated eDRX cycle value (see also Section 3.3.1.2). If the network supports eDRX, the module monitors the paging messages during a periodic Paging Time Window (PTW) configured for TX62/TX82. The possible eDRX paging cycle length (PCL) ranges from 5.12s up to a maximum of 10485.76s (almost 3 hours). The PTW length can be calculated using the following formula:

t_ptw = (PTW value +1)* 2560 ms Figure 46 shows the eDRX timings, with the module listening to paging messages during a pag-

ing time window (PTW). PCL PCL PCL PCL PTW eDRXSLEEPmode

(Deepsleep) eDRXSLEEPmode

(Deepsleep) eDRXSLEEPmode

(Deepsleep) eDRXSLEEPmode

(Deepsleep) eDRXSUSPENDmode eDRXSUSPENDmode eDRXSUSPENDmode eDRXSUSPENDmode Default Paging Cycle

(DRX) P1 P2 P3 P4 DRXSLEEPmode PCL PTW DefaultPagingCycle PagingCycleLengtheDRX(5.12...10485 .76seconds) PagingTimeWindoweDRX(2.56...40.96seconds) PagingCycleDRX(1.28...10.24seconds) Figure 46: eDRX based paging and power saving in LTE Cat M1 and Cat NB1/2 networks The eDRX timer can be configured with AT+CEDRXS (or AT^SEDRXS with a PTW timer request) that negotiates the eDRX settings with the network. The dynamic parameters are readable with AT+CEDRXRDP. For more information on these AT commands see [1]. Note 1: If SUSPEND mode is enabled in addition to SLEEP mode and eDRX settings, the mod-

ule is able to reduce its current consumption even further during the eDRX paging cycle (see Figure 46). This optional so-called eDRX SUSPEND mode can be enabled with the AT^SCFG command Radio/Suspend,<suspendmode>. However, the module will in this case not longer be able to change into the regular 3GPP PSM SUSPEND mode. Note 2: eDRX can be configured together with 3GPP PSM (AT+CPSMS) as it will not only affect SLEEP mode (deep sleep) and eDRX SUSPEND mode, but also the 3GPP PSM SUS-

PEND mode - see Section 3.3.3.3. t TX62-W_TX62-W-x_TX82-W_HID_v01.000 2021-10-05 Confidential / Preliminary Cinterion TX62-W(-B/-C)/TX82-W Hardware Interface Description 3.3 Power Saving 110 Page 87 of 154 3.3.3.3 3GPP PSM Configuration TX62/TX82 can be configured to use 3GPP PSM to reduce power consumption. PSM is similar to power off, while TX62/TX82 remains registered with the network. There is no need to re-

attach or re-establish PDN connections. TX62/TX82 in PSM is not immediately reachable for mobile terminating services (see also SUSPEND mode in Section 3.3.1.2) The network accepts and negotiates the use of PSM by providing specific values for periodic TAU cycles (T3412) as well as an active timer (T3324). Upon expiry of the active timer, or if the value provided by the network is zero, TX62/TX82 may activate PSM. Note: If TX62/TX82 negotiates to enable both PSM (requesting an active timer and possibly a periodic TAU cycle value) as well as eDRX (requesting a specific extended idle mode DRX cycle value and possibly a paging time window), it is up to the network to decide whether to:

1. Enable only PSM, i.e. not accept the request for eDRX. 2. Enable only eDRX, i.e. not accept the request for an active timer. 3. Enable both PSM (i.e. negotiate and provide requested PSM timers) and eDRX (i.e. negoti-

ate and provide extended DRX parameters). Figure 47 shows the modules eDRX and PSM timings for the third case where module and network negotiate PSM and eDRX simultaneously (for eDRX see also Section 3.3.3.2). For the second case the module will not reach SUSPEND mode and will continue with the eDRX pag-

ing cycles. For the first case the module will not extend the DRX paging cycles, but will continue with the DRX paging cycles until the active timer (T3324) expires. PeriodicTAUcycle (T 3412) Activetime (T3324) PCL PCL PT W e DRXSLEEPm ode

(de e psle e p) e DRXSLEEPm ode

(de e psle e p) e DRXSUSPENDm ode e DRXSUSPENDm ode 3GPPPSM m ode

(SUSPEND) De fault Paging Cycle

( DRX) P1 P2 P3 P4 DRXSLEEP m ode PeriodicTAUcycle Activetime PCL PTW DefaultPagingCycle 3GPPPSM T3412 T3324 PagingCycleLengtheDRX (5.12...10485.76seconds) PagingTimeWindoweDRX (2.56...40.96seconds) PagingCycleDRX (1.28...10.24seconds ) 3GPPPowerSavingMode Figure 47: eDRX/PSM based paging and power saving in LTE Cat M1 or Cat NB1/2 networks TX62/TX82 monitors paging message only while the active timer (T3324) has not expired. If the module has uplink data or signal, it will not change to PSM. The active timer (T3324) and periodic tracking area update (TAU) timer (T3412) can be nego-

tiated/requested with AT+CPSMS. For more information on this AT command see [1]. t TX62-W_TX62-W-x_TX82-W_HID_v01.000 2021-10-05 Confidential / Preliminary Cinterion TX62-W(-B/-C)/TX82-W Hardware Interface Description 3.4 Power Supply 110 Page 88 of 154 3.4 Power Supply TX62/TX82 needs to be connected to a power supply at the SMT application interface - 2 lines BATT+, and GND. There are two separate voltage domains for BATT+:

BATT+BB with a line mainly for the baseband power supply. BATT+RF with a line for the GSM/LTE power amplifier supply. Please note that this line does not have to be connected with TX62-W. Please note that BATT+ in this document refers to both voltage domains and power supply lines - BATT+BB and BATT+RF. The power supply of TX62/TX82 has to be a single voltage source at BATT+BB and BATT+RF. It should be of type PS1, according to IEC 62368-1, and must be able to provide the peak cur-

rent during the uplink transmission. Suitable low ESR capacitors should be placed as close as possible to the BATT+ pads, e.g., X7R MLCC (see also Section 2.1.2). All key functions for supplying power to the device are handled by the power management IC. It provides the following features:

Stabilizes the supply voltages for the baseband using low drop linear voltage regulators and a DC-DC step down switching regulator. Switches the module's power voltages for the power-up and -down procedures. SIM switch to provide SIM power supply. 3.4.1 Power Supply Ratings Table 17, Table 18, Table 19, Table 20, and Table 21 assemble various voltage supply and current consumption ratings (GSM, Cat M1 and Cat NB1/2) of the module. Table 17: Voltage supply ratings Description Conditions Min Typ Max Unit BATT+

TX82-W Supply voltage

(LTE and GSM) Directly measured at Module. TX82-W Supply voltage

(GSM deactivated) TX62-W Supply voltage TX62-W-B Supply voltage TX62-W-C Supply voltage Voltage must stay within the min/

max values, including voltage drop, ripple, spikes For every BATT+ transition/reinser-

tion from 0V, BATT+ should be at least 2.65V to power on the module. Maximum allowed voltage drop during transmit burst Normal condition, power control level for Pout max Voltage ripple Normal condition, power control level for Pout max

@ f <= 250 kHz

@ f > 250 kHz 3.1 2.8 2.55 2.5 3.2 4.6 4.6 4.8 4.5 4.2 V V V V V 400 mV 70 20 mVpp mVpp t TX62-W_TX62-W-x_TX82-W_HID_v01.000 2021-10-05 Confidential / Preliminary Cinterion TX62-W(-B/-C)/TX82-W Hardware Interface Description 3.4 Power Supply 110 Page 89 of 154 Table 18: General current consumption ratings (TX62/TX82) Description Conditions Typical rating Unit 1 IBATT+

(i.e., sum of BATT+BB and BATT+RF 2 ) OFF state supply cur-

rent State after initially connecting VBATT+ and/or after a fast shutdown triggered via FST_SHDN 14 B 14 TX62-W TX62-W-

TX62-W-

C TX82-W 14 14 A State after switching a running module off via AT^SMSO 4.5 4.5 4.7 4.5 Airplane mode

(CFUN = 4) UART (RTS) active UART (RTS) inactive 12 12 12 12 0.55 0.54 0.54 0.49 mA mA 1. With an impedance of ZLOAD=50 at the antenna connector, Measured at 25C at 3.8V. 2. BATT+RF is available with TX82-W only. Table 19: Current consumption ratings Cat M1 (TX62/TX82) Description Conditions Typical rating Unit 1 IBATT+

(i.e., only BATT+BB ) Average LTE CAT-

M1 supply current SUSPEND2 Power save mode RRC idle

(SLEEP)2 DRX=256 DRX=128 DRX=64 20,48s eDRX 81,92s eDRX 3,84s paging win-

dow (DRX=1.28s) 2,56s paging win-

dow (DRX=1.28s) 163,84s eDRX 3,84s paging win-

dow (DRX=1.28s) 163,84s eDRX 10,24s paging win-

dow (DRX=1.28s) 81,92s eDRX 2,56s paging win-

dow (DRX=1.28s) 163,84s eDRX 3,84s paging win-

dow (DRX=1.28s) 163,84s eDRX 10,24s paging win-

dow (DRX=1.28s) RRC idle

(SUS-

PEND)2 TX62-W TX62-W-

B 4.5 0.93 1.40 2.28 0.69 3.8 0.90 1.34 2.21 0.65 TX62-W-

C TX82-W 4.5 0.93 4.5 0.97 1.44 2.30 0.70 A mA mA mA mA 0.44 0.48 0.49 mA 0.43 0.46 0.69 0.47 mA 0.46 0.50 0.51 mA 0.62 0.64 0.66 mA 0.33 0.34 0.34 0.35 mA 0.39 0.41 0.42 mA Connected DRX3 Short C-DRX Long C-DRX 40 10 44 13 45 14 mA mA t TX62-W_TX62-W-x_TX82-W_HID_v01.000 2021-10-05 Confidential / Preliminary Cinterion TX62-W(-B/-C)/TX82-W Hardware Interface Description 3.4 Power Supply 110 Page 90 of 154 Table 19: Current consumption ratings Cat M1 (TX62/TX82) Description Conditions Typical rating Unit 1 IBATT+

(i.e., only BATT+BB ) Average LTE CAT-

M1 supply current RRC con-

nected Active Transmis-

sion3 TX62-W-B and TX62-

W-C only Band1, 23dBm Band2, 23dBm Band3, 23dBm Band4, 23dBm Band5, 23dBm Band8, 23dBm Band12, 23dBm Band13, 23dBm Band18, 23dBm Band19, 23dBm Band20, 23dBm Band25, 23dBm Band26, 23dBm Band27, 23dBm Band28, 23dBm Band31, 26dBm (TX62-W-C) Band66, 23dBm Band72, 26dBm (TX62-W-C) RRC con-

nected Active Transmis-

sion3 Band85, 23dBm Band1, 20dBm Band2, 20dBm Band3, 20dBm Band4, 20dBm Band5, 20dBm Band8, 20dBm Band12, 20dBm Band13, 20dBm Band18, 20dBm Band19, 20dBm Band20, 20dBm Band25, 20dBm Band26, 20dBm Band27, 20dBm Band28, 20dBm Band66, 20dBm Band85, 20dBm TX62-W TX62-W-

B 226 224 230 235 228 235 208 220 216 224 225 226 226 213 214

231

201

168 177 167 167 175 180 173 183 179 180 179 176 183 181 170 166 168 TX62-W-

C 226 TX82-W

177 171 172 169 187 180 164 185 184 186 185 173 180 183 185 169 164 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA t TX62-W_TX62-W-x_TX82-W_HID_v01.000 2021-10-05 Confidential / Preliminary Cinterion TX62-W(-B/-C)/TX82-W Hardware Interface Description 3.4 Power Supply 110 Page 91 of 154 Table 19: Current consumption ratings Cat M1 (TX62/TX82) Description Conditions Typical rating Unit 1 IBATT+

(i.e., only BATT+BB ) Average LTE CAT-

M1 supply current RRC con-

nected Active Transmis-

sion3 Peak Current @ RRC connected Active Trans-

mission3 VBATT = 3.8V TX62-W-B and TX62-W-

C only Band1, 0dBm Band2, 0dBm Band3, 0dBm Band4, 0dBm Band5, 0dBm Band8, 0dBm Band12, 0dBm Band13, 0dBm Band18, 0dBm Band19, 0dBm Band20, 0dBm Band25, 0dBm Band26, 0dBm Band27, 0dBm Band28, 0dBm Band66, 0dBm Band85, 0dBm Band1, 23dBm Band2, 23dBm Band3, 23dBm Band4, 23dBm Band5, 23dBm Band8, 23dBm Band12, 23dBm Band13, 23dBm Band18, 23dBm Band19, 23dBm Band20, 23dBm Band25, 23dBm Band26, 23dBm Band27, 23dBm Band28, 23dBm Band31, 26dBm (TX62-W-C) Band66, 23dBm Band72, 26dBm (TX62-W-C) Band85, 23dBm TX62-W TX62-W-

B 131 123 120 121 129 135 126 135 130 130 130 124 130 130 127 121 117 576 564 576 576 552 588 516 552 528 552 552 564 552 516 516

564

504 103 102 103 103 102 103 102 102 103 102 103 103 103 103 103 103 103

TX62-W-

C 131 576 TX82-W 105 105 105 105 105 105 104 105 105 106 106 105 105 105 105 106 105

mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA t TX62-W_TX62-W-x_TX82-W_HID_v01.000 2021-10-05 Confidential / Preliminary Cinterion TX62-W(-B/-C)/TX82-W Hardware Interface Description 3.4 Power Supply 110 Page 92 of 154 Table 19: Current consumption ratings Cat M1 (TX62/TX82) Description Conditions Typical rating Unit TX62-W TX62-W-

B TX62-W-

C TX82-W 1 IBATT+

(i.e., only BATT+BB ) Peak Current @ RRC connected Active Trans-

mission3 VBATT = 3.8V Peak Current @ RRC connected Active Trans-

mission3 VBATT = 2.5V TX62-W-B and TX62-W-

C only Band1, 20dBm Band2, 20dBm Band3, 20dBm Band4, 20dBm Band5, 20dBm Band8, 20dBm Band12, 20dBm Band13, 20dBm Band18, 20dBm Band19, 20dBm Band20, 20dBm Band25, 20dBm Band26, 20dBm Band27, 20dBm Band28, 20dBm Band66, 20dBm Band85, 20dBm Band1, 23dBm Band2, 23dBm Band3, 23dBm Band4, 23dBm Band5, 23dBm Band8, 23dBm Band12, 23dBm Band13, 23dBm Band18, 23dBm Band19, 23dBm Band20, 23dBm Band25, 23dBm Band26, 23dBm Band27, 23dBm Band28, 23dBm Band31, 26dBm (TX62-W-C) Band66, 23dBm Band72, 26dBm (TX62-W-C) Band85, 23dBm 412 396 388 376 396 452 388 420 432 440 448 388 420 440 404 368 384

624 648 636 624 660 612 564 648 624 612 648 612 612 588 624

648

588 408 388 376 396 456 428 372 452 452 456 452 400 436 444 404 384 372

mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA t TX62-W_TX62-W-x_TX82-W_HID_v01.000 2021-10-05 Confidential / Preliminary Cinterion TX62-W(-B/-C)/TX82-W Hardware Interface Description 3.4 Power Supply 110 Page 93 of 154 Table 19: Current consumption ratings Cat M1 (TX62/TX82) Description Conditions Typical rating Unit TX62-W TX62-W-

B TX62-W-

C TX82-W 1 IBATT+

(i.e., only BATT+BB ) Peak Current @ RRC connected Active Trans-

mission3 VBATT = 2.55V (TX62-

W) VBATT = 2.8V (TX82-

W) Band1, 20dBm Band2, 20dBm Band3, 20dBm Band4, 20dBm Band5, 20dBm Band8, 20dBm Band12, 20dBm Band13, 20dBm Band18, 20dBm Band19, 20dBm Band20, 20dBm Band25, 20dBm Band26, 20dBm Band27, 20dBm Band28, 20dBm Band66, 20dBm Band85, 20dBm Average idle supply cur-

rent

(GNSS on) CAT-M1 active (UART active) @ DRX=128 GNSS NMEA output off 572 556 564 528 576 656 548 604 624 632 636 556 604 640 588 520 556 65

66 528 516 492 500 608 556 476 592 596 588 580 516 560 596 508 496 496 64 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA GPRS active (UART active)

@ DRX=128 GNSS NMEA output on 64 66 64 mA 1. With an impedance of ZLOAD=50 at the antenna connector, Measured at 25C at 3.8V. 2. Measurements start 6 minutes after switching ON the module, Averaging times:

SUSPEND mode: 3 minutes (T3324 = 3s, T3412 = 14400s) SLEEP mode: 10 minutes, (PSM disabled, eDRX disabled) Idle eDRX mode: 30 minutes, (PSM disabled, eDRX enabled) Connected DRX mode: 10 minutes, RRC connected modes: 3 minutes, Communication tester settings: no neighbor cells, no cell re-selection etc, RMC (reference measurement channel), SUSPEND/SLEEP (with PSM/eDRX) is enabled via AT command 3. Communication tester settings:

RMC mode, Half Duplex, Cat M1 Channel Bandwidth: 10MHz Modulation: QPSK. RB setting: 1 UL RBs, 4 DL RBs t TX62-W_TX62-W-x_TX82-W_HID_v01.000 2021-10-05 Confidential / Preliminary Cinterion TX62-W(-B/-C)/TX82-W Hardware Interface Description 3.4 Power Supply 110 Page 94 of 154 Table 20: Current consumption ratings Cat NB1/2 (TX62/TX82) Description Conditions Typical rating Unit 1 IBATT+

(i.e., only BATT+BB ) Average LTE NB1/2 supply current SUSPEND2 Power save mode RRC idle

(SLEEP)2 DRX=1024 DRX=512 DRX=256 DRX=128 RRC idle

(SUS-

PEND)2 RRC con-

nected Active Transmis-

sion DL RMC3 TX62-W-B and TX62-

W-C only 20,48s eDRX 81,92s eDRX 2,56s paging win-

dow (DRX=1.28s) 2,56s paging win-

dow (DRX=1.28s) 163,84s eDRX 2,56s paging win-

dow (DRX=1.28s) 163,84s eDRX 10,24s paging win-

dow (DRX=1.28s) 81,92s eDRX 2,56s paging win-

dow (DRX=1.28s) 163,84s eDRX 2,56s paging win-

dow (DRX=1.28s) 163,84s eDRX 10,24s paging win-

dow (DRX=1.28s) Band1, 23dBm Band2, 23dBm Band3, 23dBm Band4, 23dBm Band5, 23dBm Band8, 23dBm Band12, 23dBm Band13, 23dBm Band18, 23dBm Band19, 23dBm Band20, 23dBm Band25, 23dBm Band26, 23dBm Band28, 23dBm Band31, 26dBm (TX62-W-C) Band66, 23dBm Band71, 23dBm (TX62-W-B) Band72, 26dBm (TX62-W-C) Band85, 23dBm TX62-W TX62-W-

B 4.5 0.79 1.09 0.86 1.26 1.14 3.8 0.77 1.08 0.85 1.23 1.15 TX62-W-

C TX82-

W 4.5 4.5 A 0.88 mA 1.17 mA 0.86 0.94 mA 1.35 mA 1.19 mA 0.49 0.49 0.55 mA 0.45 0.44 0.44 0.50 mA 0.51 0.50 0.59 mA 0.62 0.66 0.66 mA 0.31 0.33 0.33 0.34 mA 0.38 0.40 0.40 mA

77 78 77 76 76 79 74 76 75 76 77 77 75 74

78 73

74 232

mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA t TX62-W_TX62-W-x_TX82-W_HID_v01.000 2021-10-05 Confidential / Preliminary Cinterion TX62-W(-B/-C)/TX82-W Hardware Interface Description 3.4 Power Supply 110 Page 95 of 154 Table 20: Current consumption ratings Cat NB1/2 (TX62/TX82) Description Conditions Typical rating Unit TX62-W TX62-W-

B TX62-W-

C TX82-

W 1 IBATT+

(i.e., only BATT+BB ) Average LTE NB1/2 supply current RRC con-

nected Active Transmis-

sion DL RMC3 Band1, 20dBm Band2, 20dBm Band3, 20dBm Band4, 20dBm Band5, 20dBm Band8, 20dBm Band12, 20dBm Band13, 20dBm Band18, 20dBm Band19, 20dBm Band20, 20dBm Band25, 20dBm Band26, 20dBm Band28, 20dBm Band66, 20dBm Band71, 20dBm Band85, 20dBm Band1, 0dBm Band2, 0dBm Band3, 0dBm Band4, 0dBm Band5, 0dBm Band8, 0dBm Band12, 0dBm Band13, 0dBm Band18, 0dBm Band19, 0dBm Band20, 0dBm Band25, 0dBm Band26, 0dBm Band28, 0dBm Band66, 0dBm Band71, 0dBm Band85, 0dBm 63 62 62 61 65 66 63 66 66 66 66 63 66 64 62 61 63 44 43 44 44 44 44 44 44 44 44 44 44 44 44 44 43 44

57 55 54 54 57 58 56 58 57 57 56 55 57 56 54 55 56 65 64 63 63 70 68 64 69 69 69 70 65 69 68 63 62 64 45 45 45 44 45 45 44 45 45 45 45 44 45 45 45 43 44 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA t TX62-W_TX62-W-x_TX82-W_HID_v01.000 2021-10-05 Confidential / Preliminary Cinterion TX62-W(-B/-C)/TX82-W Hardware Interface Description 3.4 Power Supply 110 Page 96 of 154 Table 20: Current consumption ratings Cat NB1/2 (TX62/TX82) Description Conditions Typical rating Unit 1 IBATT+

(i.e., only BATT+BB ) Average LTE NB1/2 supply current RRC con-

nected Active Transmis-

sion UL RMC, sin-

gle tone mode

(1subcar-

rier),15KHz spacing3 TX62-W-B and TX62-

W-C only Band1, 23dBm Band2, 23dBm Band3, 23dBm Band4, 23dBm Band5, 23dBm Band8, 23dBm Band12, 23dBm Band13, 23dBm Band18, 23dBm Band19, 23dBm Band20, 23dBm Band25, 23dBm Band26, 23dBm Band28, 23dBm Band31, 26dBm (TX62-W-C) Band66, 23dBm Band71, 23dBm (TX62-W-B) Band72, 26dBm (TX62-W-C) RRC con-

nected Active Transmis-

sion UL RMC, sin-

gle tone mode

(1subcar-

rier),15KHz spacing3 Band85, 23dBm Band1, 20dBm Band2, 20dBm Band3, 20dBm Band4, 20dBm Band5, 20dBm Band8, 20dBm Band12, 20dBm Band13, 20dBm Band18, 20dBm Band19, 20dBm Band20, 20dBm Band25, 20dBm Band26, 20dBm Band28, 20dBm Band66, 20dBm Band71, 20dBm Band85, 20dBm TX62-W TX62-W-

B 232 237 228 221 219 240 207 218 217 223 224 235 219 207

258 203

208

178 172 166 164 183 191 168 191 186 187 189 180 192 175 167 164 173 TX62-W-

C TX82-

W

186 180 170 168 203 196 171 202 200 203 203 182 200 190 166 169 169 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA t TX62-W_TX62-W-x_TX82-W_HID_v01.000 2021-10-05 Confidential / Preliminary Cinterion TX62-W(-B/-C)/TX82-W Hardware Interface Description 3.4 Power Supply 110 Page 97 of 154 Table 20: Current consumption ratings Cat NB1/2 (TX62/TX82) Description Conditions Typical rating Unit 1 IBATT+

(i.e., only BATT+BB ) Average LTE NB1/2 supply current RRC con-

nected Active Transmis-

sion UL RMC, sin-

gle tone mode

(1subcar-

rier),15KHz spacing3 Band1, 0dBm Band2, 0dBm Band3, 0dBm Band4, 0dBm Band5, 0dBm Band8, 0dBm Band12, 0dBm Band13, 0dBm Band18, 0dBm Band19, 0dBm Band20, 0dBm Band25, 0dBm Band26, 0dBm Band28, 0dBm Band66, 0dBm Band71, 0dBm Band85, 0dBm TX62-W TX62-W-

B 111 98 93 92 107 116 102 116 107 107 107 98 107 103 92 101 102 61 61 61 61 60 60 58 60 60 60 60 61 60 60 61 58 58 TX62-W-

C TX82-

W 111 62 61 61 61 60 61 59 60 60 61 61 61 60 60 62 58 59 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA t TX62-W_TX62-W-x_TX82-W_HID_v01.000 2021-10-05 Confidential / Preliminary Cinterion TX62-W(-B/-C)/TX82-W Hardware Interface Description 3.4 Power Supply 110 Page 98 of 154 Table 20: Current consumption ratings Cat NB1/2 (TX62/TX82) Description Conditions Typical rating Unit 1 IBATT+

(i.e., only BATT+BB ) Average LTE NB1/2 supply current RRC con-

nected Active Transmis-

sion UL RMC, multi-

tone mode

(12 subcar-

rier),15kHz spacing3 TX62-W-B and TX62-

W-C only Band1, 23dBm Band2, 23dBm Band3, 23dBm Band4, 23dBm Band5, 23dBm Band8, 23dBm Band12, 23dBm Band13, 23dBm Band18, 23dBm Band19, 23dBm Band20, 23dBm Band25, 23dBm Band26, 23dBm Band28, 23dBm Band31, 26dBm (TX62-W-C) Band66, 23dBm Band71, 23dBm (TX62-W-B) Band72, 26dbm (TX62-W-C) RRC con-

nected Active Transmis-

sion UL RMC, multi-

tone mode

(12 subcar-

rier),15kHz spacing3 Band85, 23dBm Band1, 20dBm Band2, 20dBm Band3, 20dBm Band4, 20dBm Band5, 20dBm Band8, 20dBm Band12, 20dBm Band13, 20dBm Band18, 20dBm Band19, 20dBm Band20, 20dBm Band25, 20dBm Band26, 20dBm Band28, 20dBm Band66, 20dBm Band71, 20dBm Band85, 20dBm TX62-W TX62-W-

B 71 72 72 71 70 73 69 71 70 71 72 72 70 70

72 68

70

57 56 57 56 58 60 56 58 59 59 59 56 58 58 55 54 58 TX62-W-

C TX82-

W

59 58 58 57 62 61 58 62 61 62 62 59 62 61 59 57 59 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA t TX62-W_TX62-W-x_TX82-W_HID_v01.000 2021-10-05 Confidential / Preliminary Cinterion TX62-W(-B/-C)/TX82-W Hardware Interface Description 3.4 Power Supply 110 Page 99 of 154 Table 20: Current consumption ratings Cat NB1/2 (TX62/TX82) Description Conditions Typical rating Unit 1 IBATT+

(i.e., only BATT+BB ) Average LTE NB1/2 supply current RRC con-

nected Active Transmis-

sion UL RMC, multi-

tone mode

(12 subcar-

rier),15kHz spacing3 Peak Current @ RRC connected Active Transmission UL RMC, single tone mode

(1subcarrier),15KHz spacing3 VBATT=3.8V TX62-W-B and TX62-

W-C only Band1, 0dBm Band2, 0dBm Band3, 0dBm Band4, 0dBm Band5, 0dBm Band8, 0dBm Band12, 0dBm Band13, 0dBm Band18, 0dBm Band19, 0dBm Band20, 0dBm Band25, 0dBm Band26, 0dBm Band28, 0dBm Band66, 0dBm Band71, 0dBm Band85, 0dBm Band1, 23dBm Band2, 23dBm Band3, 23dBm Band4, 23dBm Band5, 23dBm Band8, 23dBm Band12, 23dBm Band13, 23dBm Band18, 23dBm Band19, 23dBm Band20, 23dBm Band25, 23dBm Band26, 23dBm Band28, 23dBm Band31, 26dBm (TX62-W-C) Band66, 23dBm Band71, 23dBm (TX62-W-B) Band72, 26dBm (TX62-W-C) Band85, 23dBm TX62-W TX62-W-

B 57 55 55 55 57 58 56 58 57 57 57 56 57 57 55 55 57 576 588 588 588 588 600 540 576 576 588 588 576 588 552

588 540

552 45 45 46 45 46 46 45 46 45 45 46 45 46 46 46 44 46

TX62-W-

C TX82-

W 46 46 46 46 46 46 46 46 46 46 47 46 46 47 48 45 47

mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA 576

t TX62-W_TX62-W-x_TX82-W_HID_v01.000 2021-10-05 Confidential / Preliminary Cinterion TX62-W(-B/-C)/TX82-W Hardware Interface Description 3.4 Power Supply 110 Page 100 of 154 Table 20: Current consumption ratings Cat NB1/2 (TX62/TX82) Description Conditions Typical rating Unit TX62-W TX62-W-

B TX62-W-

C TX82-

W 1 IBATT+

(i.e., only BATT+BB ) Peak Current @ RRC connected Active Transmission UL RMC, single tone mode

(1subcarrier),15KHz spacing3 VBATT=3.8V Peak Current @ RRC connected Active Transmission UL RMC, single tone mode

(1subcarrier),15KHz spacing3 VBATT =2.5V TX62-W-B and TX62-

W-C only Band1, 20dBm Band2, 20dBm Band3, 20dBm Band4, 20dBm Band5, 20dBm Band8, 20dBm Band12, 20dBm Band13, 20dBm Band18, 20dBm Band19, 20dBm Band20, 20dBm Band25, 20dBm Band26, 20dBm Band28, 20dBm Band66, 20dBm Band71, 20dBm Band85, 20dBm Band1, 23dBm Band2, 23dBm Band3, 23dBm Band4, 23dBm Band5, 23dBm Band8, 23dBm Band12, 23dBm Band13, 23dBm Band18, 23dBm Band19, 23dBm Band20, 23dBm Band25, 23dBm Band26, 23dBm Band28, 23dBm Band31, 26dBm (TX62-W-C) Band66, 23dBm Band71, 23dBm (TX62-W-B) Band72, 26dBm (TX62-W-C) Band85, 23dBm 388 396 380 352 416 436 388 444 420 420 428 396 436 396 376 372 388

624 612 612 612 624 648 576 624 624 624 648 612 624 588

624 576

588

380 372 364 368 448 432 376 436 436 440 440 376 428 408 368 368 368

mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA t TX62-W_TX62-W-x_TX82-W_HID_v01.000 2021-10-05 Confidential / Preliminary Cinterion TX62-W(-B/-C)/TX82-W Hardware Interface Description 3.4 Power Supply 110 Page 101 of 154 Table 20: Current consumption ratings Cat NB1/2 (TX62/TX82) Description Conditions Typical rating Unit TX62-W TX62-W-

B TX62-W-

C TX82-

W 1 IBATT+

(i.e., only BATT+BB ) Peak Current @ RRC connected Active Transmission UL RMC, single tone mode

(1subcarrier),15KHz spacing3 VBATT = 2.55V (TX62-

W) VBATT = 2.8V (TX82-

W) Band1, 20dBm Band2, 20dBm Band3, 20dBm Band4, 20dBm Band5, 20dBm Band8, 20dBm Band12, 20dBm Band13, 20dBm Band18, 20dBm Band19, 20dBm Band20, 20dBm Band25, 20dBm Band26, 20dBm Band28, 20dBm Band66, 20dBm Band71, 20dBm Band85, 20dBm Average idle supply cur-

rent

(GNSS on) LTE NB1/2 active (UART active) @ DRX=128 GNSS NMEA output off 560 564 544 504 608 620 548 628 600 600 612 572 628 560 536 532 560 57

65 512 496 480 484 604 572 488 588 584 588 584 504 576 548 488 488 488 64 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA LTE NB1/2 active (UART active) @ DRX=128 GNSS NMEA output on 57 66 64 mA 1. With an impedance of ZLOAD=50 at the antenna connector, Measured at 25C at 3.8V. 2. Measurements start 6 minutes after switching ON the module, Averaging times:

SUSPEND mode: 3 minutes (T3324 = 3s, T3412 = 14400s) SLEEP mode: 10 minutes, (PSM disabled, eDRX disabled) Idle eDRX mode: 30 minutes, (PSM disabled, eDRX enabled) Connected DRX mode: 10 minutes, RRC connected modes: 3 minutes, Communication tester settings: no neighbor cells, no cell re-selection etc, RMC (reference measurement channel), SUSPEND/SLEEP (with PSM/eDRX) is enabled via AT command 3. Communication tester settings:

Cat NB1/2 Channel Bandwidth: 10MHz Modulation: BPSK for 1 UL subcarrier mode, QPSK for multi-subcarrier mode t TX62-W_TX62-W-x_TX82-W_HID_v01.000 2021-10-05 Confidential / Preliminary Cinterion TX62-W(-B/-C)/TX82-W Hardware Interface Description 3.4 Power Supply 110 Page 102 of 154 Table 21: Current consumption ratings General and GSM (TX82-W only) Description Conditions Typical rating Unit 1 IBATT+

(i.e., sum of BATT+BB and BATT+RF) Average GSM supply current

(GNSS off) SLEEP2@DRX=9 (no communication via UART) SLEEP2@DRX=5 (no communication via UART) SLEEP2@DRX=2 (no communication via UART) 0.78 0.95 1.58 SLEEP3@DRX=2 (no communication via UART) 13 GPRS Data transfer GSM850;

PCL=5,1Tx/4RX ROPR=8

(max. reduction) ROPR=4

(no reduction) GPRS Data transfer GSM850;

PCL=5; 2Tx/3Rx ROPR=8

(max. reduction) ROPR=4

(no reduction) EDGE Data transfer GSM850;

PCL=5; 1Tx/4Rx ROPR=8

(max. reduction) ROPR=4

(no reduction) EDGE Data transfer GSM850;

PCL=5; 2Tx/3Rx ROPR=8

(max. reduction) ROPR=4

(no reduction) GPRS Data transfer GSM900;

PCL=5,1Tx/4RX ROPR=8

(max. reduction) ROPR=4

(no reduction) GPRS Data transfer GSM900;

PCL=5; 2Tx/3Rx ROPR=8

(max. reduction) ROPR=4

(no reduction) EDGE Data transfer GSM900;

PCL=5; 1Tx/4Rx ROPR=8

(max. reduction) ROPR=4

(no reduction) 230 232 323 407 155 156 231 259 260 259 328 464 153 152 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA t TX62-W_TX62-W-x_TX82-W_HID_v01.000 2021-10-05 Confidential / Preliminary Cinterion TX62-W(-B/-C)/TX82-W Hardware Interface Description 3.4 Power Supply 110 Page 103 of 154 Table 21: Current consumption ratings General and GSM (TX82-W only) Description Conditions Typical rating Unit 1 IBATT+

(i.e., sum of BATT+BB and BATT+RF) Average GSM supply current

(GNSS off) EDGE Data transfer GSM900;

PCL=5; 2Tx/3Rx ROPR=8

(max. reduction) ROPR=4

(no reduction) GPRS Data transfer GSM1800;

PCL=5,1Tx/4RX ROPR=8

(max. reduction) ROPR=4

(no reduction) GPRS Data transfer GSM1800;

PCL=5; 2Tx/3Rx ROPR=8

(max. reduction) ROPR=4

(no reduction) EDGE Data transfer GSM1800;

PCL=5; 1Tx/4Rx ROPR=8

(max. reduction) ROPR=4

(no reduction) EDGE Data transfer GSM1800;

PCL=5; 2Tx/3Rx ROPR=8

(max. reduction) ROPR=4

(no reduction) GPRS Data transfer GSM1900;

PCL=5,1Tx/4RX ROPR=8

(max. reduction) ROPR=4

(no reduction) GPRS Data transfer GSM1900;

PCL=5; 2Tx/3Rx ROPR=8

(max. reduction) ROPR=4

(no reduction) EDGE Data transfer GSM1900;

PCL=5; 1Tx/4Rx ROPR=8

(max. reduction) ROPR=4

(no reduction) EDGE Data transfer GSM1900;

PCL=5; 2Tx/3Rx ROPR=8

(max. reduction) ROPR=4

(no reduction) Peak current during GSM transmit burst

@ 3.8V GPRS Data transfer GSM850; PCL=5; 2Tx/3Rx GPRS Data transfer GSM900; PCL=5; 2Tx/3Rx GPRS Data transfer GSM1800; PCL=0; 2Tx/3Rx GPRS Data transfer GSM1900; PCL=0; 2Tx/3Rx 229 256 182 183 248 310 147 145 226 244 185 184 250 315 149 147 229 247 1.79 1.99 1.26 1.29 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA A A A A t TX62-W_TX62-W-x_TX82-W_HID_v01.000 2021-10-05 Confidential / Preliminary Cinterion TX62-W(-B/-C)/TX82-W Hardware Interface Description 3.4 Power Supply 110 Page 104 of 154 Table 21: Current consumption ratings General and GSM (TX82-W only) Description Conditions 1 IBATT+

(i.e., sum of BATT+BB and BATT+RF) Peak current during GSM transmit burst

@ 3.0V GPRS Data transfer GSM850; PCL=5; 2Tx/3Rx GPRS Data transfer GSM900; PCL=5; 2Tx/3Rx GPRS Data transfer GSM1800; PCL=0; 2Tx/3Rx GPRS Data transfer GSM1900; PCL=0; 2Tx/3Rx Average GSM IDLE supply current

(GNSS on) GPRS active (UART active) @ DRX=2 GNSS NMEA output off GPRS active (UART active) @ DRX=2 GNSS NMEA output on Typical rating Unit 1.76 1.76 1.23 1.26 68 68 A A A A mA mA 1. With an impedance of ZLOAD=50 at the antenna connector, Measured at 25C at 3.8V. 2. Measurements start 6 minutes after switching ON the module, Averaging times:

OFF mode: 3 minutes SLEEP and IDLE mode - 10 minutes Transfer modes - 3 minutes Communication tester settings: no neighbor cells, no cell re-selection etc,, RMC (reference measurement channel), SLEEP mode is enabled via AT command 3. The power save mode (PSM) is disabled via AT command t TX62-W_TX62-W-x_TX82-W_HID_v01.000 2021-10-05 Confidential / Preliminary Cinterion TX62-W(-B/-C)/TX82-W Hardware Interface Description 3.4 Power Supply 110 Page 105 of 154 3.4.2 Minimizing Power Losses For TX82-W only: When designing the power supply for your application (and with GSM en-

abled) please pay specific attention to power losses. Ensure that the input voltage VBATT+ never drops below 3.1V on the TX82-W board, not even in a GSM transmit burst where current con-

sumption can rise (for peak values see the power supply ratings listed in Section 3.4.1). Transmit burst Transmit burst BATT+

Min. 3.1V Ripple Drop Figure 48: Power supply limits during transmit burst 3.4.3 Measuring the Supply Voltage (VBATT+) To measure the supply voltage VBATT+ it is possible to define two reference points GND and BATT+. GND and BATT+ should be a test pad on the external application the module is mount-

ed on. The eternal GND reference point has to be connected to and positioned close to the SMT application interfaces GND pad F17 and the external BATT+ reference point has to be connected to and positioned close to the SMT application interfaces BATT+ pads G15 and G16 (BATT+RF) or H15 and H16 (BATT+BB) as shown in Figure 49. Reference point BATT+:

External test pad connected to and positioned closely to BATT+

pad G15, H15, H16 or G16. Reference point GND:

External test pad connected to and positioned closely to GND pad F17 External application Figure 49: Position of reference points BATT+ and GND t TX62-W_TX62-W-x_TX82-W_HID_v01.000 2021-10-05 Confidential / Preliminary Cinterion TX62-W(-B/-C)/TX82-W Hardware Interface Description 3.5 Operating Temperatures 110 Page 106 of 154 3.4.4 Monitoring Power Supply by AT Command To monitor the supply voltage you can also use the AT^SBV command which returns the value related to the reference points BATT+ and GND. The module continuously measures the voltage at intervals depending on the operating mode of the RF interface. The duration of measuring ranges from 0.5 seconds in TALK/DATA mode to 50 seconds when TX62/TX82 is in IDLE mode or Limited Service (deregistered). The dis-

played voltage (in mV) is averaged over the last measuring period before the AT^SBV com-

mand was executed. If the measured voltage drops below or rises above the voltage shutdown thresholds, the mod-

ule will send an "^SBC" URC and shut down (for details see Section 3.2.5). 3.5 Operating Temperatures Please note that the modules lifetime, i.e., the MTTF (mean time to failure) may be reduced, if operated outside the extended temperature range. Table 22: Board temperature Parameter Normal operation Extended operation1 Automatic shutdown2 Min

-30

-40 Typ Max

+85

+90 Temperature measured on TX62/TX82 board

<-40

>+90 Unit C C C 1. Extended operation allows normal mode speech calls or data transmission for limited time. Within the extended temperature range (outside the normal operating temperature range) the specified electrical characteristics may be in- or decreased. 2. Due to temperature measurement uncertainty, a tolerance of 3C on the thresholds may occur. See also Section 3.2.5 for information about the NTC for on-board temperature measurement, automatic thermal shutdown and alert messages. Note: Within the specified operating temperature ranges the board temperature may vary to a great extent depending on operating mode, used frequency band, radio output power and cur-

rent supply voltage. The below Table 23 lists the ambient temperature ranges the TX62/TX82 is able to operate in. Table 23: Ambient temperature Parameter Normal operation (GSM) Normal operation (LTE) Min

-40

-40 Typ Max

+60

+70 Unit C C t TX62-W_TX62-W-x_TX82-W_HID_v01.000 2021-10-05 Confidential / Preliminary Cinterion TX62-W(-B/-C)/TX82-W Hardware Interface Description 3.6 Electrostatic Discharge 110 Page 107 of 154 3.6 Electrostatic Discharge The module is not protected against Electrostatic Discharge (ESD) in general. Consequently, it is subject to ESD handling precautions that typically apply to ESD sensitive components. Proper ESD handling and packaging procedures must be applied throughout the processing, handling and operation of any application that incorporates a TX62/TX82 module. Special ESD protection provided on TX62/TX82:

Main antenna interface: Inductor/capacitor BATT+: Inductor/capacitor An example for an enhanced ESD protection for the SIM interface is given in Section 2.1.6.1. TX62/TX82 has been tested according to group standard ETSI EN 301 489-1 (see Table 32). Electrostatic values can be gathered from the following table. Table 24: Electrostatic values Specification/Requirements Contact discharge Air discharge ETSI EN 301 489-1 Main antenna interface BATT+

4kV 4kV 8kV 8kV JEDEC JESD22-A114D (Human Body Model, Test conditions: 1.5 k, 100 pF) All other interfaces 1kV n.a. Note: The values may vary with the individual application design. For example, it matters whether or not the application platform is grounded over external devices like a computer or other equipment, such as the Thales reference application described in Chapter 5. 3.6.1 ESD Protection for RF Antenna Interface The following Figure 50 shows how to implement an external ESD protection for the RF anten-

na interface with either a T pad or PI pad attenuator circuit (for RF line routing design see also Section 2.2.3). T pad attenuator circuit Main Antenna PI pad attenuator circuit Main Antenna 18pF 18pF 4.7pF ANT_GSM

(Pad 59) ANT_GSM

(Pad 59) 22nH 18nH 18nH Figure 50: ESD protection for RF antenna interface Recommended inductor types for the above sample circuits: Size 0402 SMD from Panasonic ELJRF series (22nH and 18nH inductors) or Murata LQW15AN18NJ00 (18nH inductors only). t TX62-W_TX62-W-x_TX82-W_HID_v01.000 2021-10-05 Confidential / Preliminary Cinterion TX62-W(-B/-C)/TX82-W Hardware Interface Description 3.7 Blocking against RF on Interface Lines 110 Page 108 of 154 3.7 Blocking against RF on Interface Lines To reduce EMI issues there are serial resistors, or capacitors to GND, implemented on the module for the ignition, emergency restart, and SIM interface lines (cp. Section 2.4). However, all other signal lines have no EMI measures on the module and there are no blocking measures at the modules interface to an external application. Dependent on the specific application design, it might be useful to implement further EMI mea-

sures on some signal lines at the interface between module and application. These measures are described below. There are five possible variants of EMI measures (A-E) that may be implemented between module and external application depending on the signal line (see Figure 51 and Table 25). Pay attention not to exceed the maximum input voltages and prevent voltage overshots if using in-

ductive EMC measures. The maximum value of the serial resistor should be lower than 1k on the signal line. The max-

imum value of the capacitor should be lower than 50pF on the signal line. Please observe the electrical specification of the modules SMT application interface and the external applications interface. R R L SMT EMI measures A SMT EMI measures C SMT EMI measures E C C GND GND Application SMT Application EMI measures B C GND L Application SMT Application EMI measures D Application Figure 51: EMI circuits Note: In case the application uses an internal GSM/LTE antenna that is implemented close to the TX62/TX82 module, Thales strongly recommends sufficient EMI measures, e.g. of type B or C, for each digital input or output. t TX62-W_TX62-W-x_TX82-W_HID_v01.000 2021-10-05 Confidential / Preliminary Cinterion TX62-W(-B/-C)/TX82-W Hardware Interface Description 3.7 Blocking against RF on Interface Lines 110 Page 109 of 154 The following table lists for each signal line at the modules SMT application interface the EMI measures that may be implemented. Table 25: EMI measures on the application interface Signal name EMI measures Remark CCIN CCRST CCIO CCCLK VUSB RXD0 TXD0 CTS0 RTS0 DTR0 DCD0 DSR0 RXD1 TXD1 RTS1 CTS1 RING0 FST_SHDN STATUS SIM_SWITCH SUSPEND_MON GPIO6,7,20-23,25 I2CDAT1 I2CCLK1 V180 BATT+RF (pad G15, G16) BATT+BB (pad H15, H16) A B x C E D x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x 1. Available with embedded processing option only. The external capacitor should be not higher than 1nF. The value of the capacitor depends on the external application and should be placed close to SIM connector/

eUICC. The external capacitor should be not higher than 10pF. The value of the capacitor depends on the external application and should be placed close to SIM connector/

eUICC. The rising signal edge is reduced with an additional capacitor. Measures required if BATT+RF is close to internal GSM antenna -

e.g., 39pF blocking capacitor to ground t TX62-W_TX62-W-x_TX82-W_HID_v01.000 2021-10-05 Confidential / Preliminary Cinterion TX62-W(-B/-C)/TX82-W Hardware Interface Description 3.8 Reliability Characteristics 110 Page 110 of 154 3.8 Reliability Characteristics The test conditions stated below are an extract of the complete test specifications. Table 26: Summary of reliability test conditions Type of test Conditions Vibration Shock half-sinus Dry heat Temperature change (shock) Damp heat cyclic Frequency range: 10-20Hz; acceleration: 5g Frequency range: 20-500Hz; acceleration: 20g Duration: 20h per axis; 3 axes Acceleration: 500g Shock duration: 1ms 1 shock per axis 6 positions ( x, y and z) Temperature: +70 2C Test duration: 16h Humidity in the test chamber: < 50%

Low temperature: -40C 2C High temperature: +85C 2C Changeover time: < 30s (dual chamber system) Test duration: 1h Number of repetitions: 100 High temperature: +55C 2C Low temperature: +25C 2C Humidity: 93% 3%

Number of repetitions: 6 Test duration: 12h + 12h Cold (constant exposure) Temperature: -40 2C Test duration: 16h Standard DIN IEC 60068-2-61 DIN IEC 60068-2-27 EN 60068-2-2 Bb ETS 300 019-2-7 DIN IEC 60068-2-14 Na ETS 300 019-2-7 DIN IEC 60068-2-30 Db ETS 300 019-2-5 DIN IEC 60068-2-1 1. For reliability tests in the frequency range 20-500Hz the Standards acceleration reference value was increased to 20g. t TX62-W_TX62-W-x_TX82-W_HID_v01.000 2021-10-05 Confidential / Preliminary Cinterion TX62-W(-B/-C)/TX82-W Hardware Interface Description 4 Mechanical Dimensions, Mounting and Packaging 131 Page 111 of 154 4 Mechanical Dimensions, Mounting and Packaging 4.1 Mechanical Dimensions of TX62-W Figure 52 shows the top and bottom view of TX62-W and provides an overview of the board's mechanical dimensions. For further details see Figure 53. Figure 54 shows the area at the modules bottom side where possible markings might be printed. Product label Top view Bottom view Figure 52: TX62-W top and bottom view t TX62-W_TX62-W-x_TX82-W_HID_v01.000 2021-10-05 Confidential / Preliminary Cinterion TX62-W(-B/-C)/TX82-W Hardware Interface Description 4.1 Mechanical Dimensions of TX62-W 131 Page 112 of 154 Figure 53: Dimensions of TX62-W (all dimensions in mm) Restricted Area Do not put any solder resist opening marks or pencil line inside this area, and keep at least 0.42mm clearance from specified marks to LGA pads Figure 54: Dimensions of area for possible markings TX62-W (bottom view) t TX62-W_TX62-W-x_TX82-W_HID_v01.000 2021-10-05 Confidential / Preliminary Cinterion TX62-W(-B/-C)/TX82-W Hardware Interface Description 4.2 Mechanical Dimensions of TX82-W, TX62-W-B and TX62-W-C 131 Page 113 of 154 4.2 Mechanical Dimensions of TX82-W, TX62-W-B and TX62-W-C Figure 55 shows the top and bottom view of TX82-W, and TX62-W-B, and provides an over-

view of the board's mechanical dimensions. For further details see Figure 56. Figure 57 shows the area at the modules bottom side where possible markings might be printed. Note: With TX62-W-C the module height is TBD. The below mentioned height dimensions ap-

ply therefore only to TX82-W, and TX62-W-B. Product label Top view Bottom view Figure 55: TX82-W top and bottom view t TX62-W_TX62-W-x_TX82-W_HID_v01.000 2021-10-05 Confidential / Preliminary Cinterion TX62-W(-B/-C)/TX82-W Hardware Interface Description 4.2 Mechanical Dimensions of TX82-W, TX62-W-B and TX62-W-C 131 Page 114 of 154 Figure 56: Dimensions of TX82-W, TX62-W-B and TX62-W-C (all dimensions in mm) Restricted Area Do not put any solder resist opening marks or pencil line inside this area, and keep at least 0.42mm clearance from specified marks to LGA pads Figure 57: Dimensions of area for possible markings TX82-W, TX62-W-B and TX62-W-C (bottom view) t TX62-W_TX62-W-x_TX82-W_HID_v01.000 2021-10-05 Confidential / Preliminary Cinterion TX62-W(-B/-C)/TX82-W Hardware Interface Description 4.3 Mounting TX62/TX82 onto the Application Platform 131 Page 115 of 154 4.3 Mounting TX62/TX82 onto the Application Platform This section describes how to mount TX62/TX82 onto the PCBs, including land pattern and stencil design, board-level characterization, soldering conditions, durability and mechanical handling. For more information on issues related to SMT module integration see also [5]. Note: To avoid short circuits between signal tracks on an external application's PCB and vari-

ous markings at the bottom side of the module (see Figure 54 and Figure 57), it is recommend-

ed not to route the signal tracks on the top layer of an external PCB directly under the module, or at least to ensure that signal track routes are sufficiently covered with solder resist. Note: Do not place external components or devices that might cause any pressure on the mod-

ules shielding. See [4] and [5] for further details of thermal and integration guidance. 4.3.1 SMT PCB Assembly 4.3.1.1 Land Pattern and Stencil The land pattern and stencil design as shown below is based on Thales characterizations for lead-free solder paste on a four-layer test PCB and a 110 micron thick stencil. The land pattern given in Figure 58 and Figure 59 reflects the modules pad layout, including signal pads and ground pads (for pad assignment see Section 2.1.1). Figure 58: Land pattern TX62-W (top view) t TX62-W_TX62-W-x_TX82-W_HID_v01.000 2021-10-05 Confidential / Preliminary Cinterion TX62-W(-B/-C)/TX82-W Hardware Interface Description 4.3 Mounting TX62/TX82 onto the Application Platform 131 Page 116 of 154

. Figure 59: Land pattern TX82-W, TX62-W-B and TX62-W-C (top view) The stencil design illustrated in Figure 60 and Figure 61 is recommended by Thales as a result of extensive tests with Thales Daisy Chain modules. The central ground pads are primarily intended for stabilizing purposes, and may show some more voids than the application interface pads at the module's rim. This is acceptable, since they are electrically irrelevant. t TX62-W_TX62-W-x_TX82-W_HID_v01.000 2021-10-05 Confidential / Preliminary Cinterion TX62-W(-B/-C)/TX82-W Hardware Interface Description 4.3 Mounting TX62/TX82 onto the Application Platform 131 Page 117 of 154 Figure 60: Recommended design for 110m thick stencil for TX62-W (top view) Figure 61: Recommended design for 110m thick stencil for TX82-W, TX62-W-B and TX62-W-C (top view) 4.3.1.2 Board Level Characterization Board level characterization issues should also be taken into account if devising an SMT pro-

cess. Characterization tests should attempt to optimize the SMT process with regard to board level reliability. This can be done by performing the following physical tests on sample boards: Peel test, bend test, tensile pull test, drop shock test and temperature cycling. Sample surface mount checks are described in [5]. t TX62-W_TX62-W-x_TX82-W_HID_v01.000 2021-10-05 Confidential / Preliminary Cinterion TX62-W(-B/-C)/TX82-W Hardware Interface Description 4.3 Mounting TX62/TX82 onto the Application Platform 131 Page 118 of 154 It is recommended to characterize land patterns before an actual PCB production, taking indi-

vidual processes, materials, equipment, stencil design, and reflow profile into account. For land and stencil pattern design recommendations see also Section 4.3.1.1. Optimizing the solder stencil pattern design and print process is necessary to ensure print uniformity, to decrease sol-

der voids, and to increase board level reliability. Generally, solder paste manufacturer recommendations for screen printing process parame-

ters and reflow profile conditions should be followed. Maximum ratings are described in Section 4.3.3. 4.3.2 Moisture Sensitivity Level TX62/TX82 comprises components that are susceptible to damage induced by absorbed mois-

ture. Thaless TX62/TX82 module complies with the latest revision of the IPC/JEDEC J-STD-020 Standard for moisture sensitive surface mount devices and is classified as MSL 4. For additional moisture sensitivity level (MSL) related information see Section 4.3.4 and Sec-

tion 4.4.2. t TX62-W_TX62-W-x_TX82-W_HID_v01.000 2021-10-05 Confidential / Preliminary Cinterion TX62-W(-B/-C)/TX82-W Hardware Interface Description 4.3 Mounting TX62/TX82 onto the Application Platform 131 4.3.3 Soldering Conditions and Temperature Page 119 of 154 4.3.3.1 Reflow Profile tP tL TP TL e r u t a r e p m e T TSmax TSmin tS Preheat t to maximum Time Figure 62: Reflow Profile Table 27: Reflow temperature ratings1 Profile Feature Pb-Free Assembly Preheat & Soak Temperature Minimum (TSmin) Temperature Maximum (TSmax) Time (tSmin to tSmax) (tS) Average ramp up rate (TSmax to TP) Liquidous temperature (TL) Time at liquidous (tL) Peak package body temperature (TP) Time (tP) within 5 C of the peak package body temperature (TP) 150C 180C 60-120 seconds 3K/second max. 217C 50-90 seconds 245C +0/-5C 30 seconds max. Average ramp-down rate (TP to TL) 1 K/second max. Time 25C to maximum temperature 8 minutes max. 1. Please note that the reflow profile features and ratings listed above are based on the joint industry stan-

dard IPC/JEDEC J-STD-020D.1, and are as such meant as a general guideline. For more information on reflow profiles and their optimization please refer to [5]. t TX62-W_TX62-W-x_TX82-W_HID_v01.000 2021-10-05 Confidential / Preliminary Cinterion TX62-W(-B/-C)/TX82-W Hardware Interface Description 4.3 Mounting TX62/TX82 onto the Application Platform 131 Page 120 of 154 4.3.3.2 Maximum Temperature and Duration The following limits are recommended for the SMT board-level soldering process to attach the module:

A maximum module temperature of 240C. This specifies the temperature as measured at the modules top side. A maximum duration of 15 seconds at this temperature. Please note that while the solder paste manufacturers' recommendations for best temperature and duration for solder reflow should generally be followed, the limits listed above must not be exceeded. TX62/TX82 is specified for one soldering cycle only. Once TX62/TX82 is removed from the ap-

plication, the module will very likely be destroyed and cannot be soldered onto another appli-

cation. t TX62-W_TX62-W-x_TX82-W_HID_v01.000 2021-10-05 Confidential / Preliminary Cinterion TX62-W(-B/-C)/TX82-W Hardware Interface Description 4.3 Mounting TX62/TX82 onto the Application Platform 131 Page 121 of 154 4.3.4 Durability and Mechanical Handling 4.3.4.1 Storage Conditions TX62/TX82 modules, as delivered in tape and reel carriers, must be stored in sealed, moisture barrier anti-static bags. The conditions stated below are only valid for modules in their original packed state in weather protected, non-temperature-controlled storage locations. Normal stor-

age time under these conditions is 12 months maximum. Table 28: Storage conditions Type Condition Unit Reference Air temperature: Low High Humidity relative: Low High

-25

+40 10 90 at 40C Air pressure: Low High Movement of surrounding air 70 106 1.0 Water: rain, dripping, icing and frosting Not allowed C

kPa m/s

IPC/JEDEC J-STD-033A IPC/JEDEC J-STD-033A IEC TR 60271-3-1: 1K4 IEC TR 60271-3-1: 1K4 IEC TR 60271-3-1: 1K4

Radiation:

Solar Heat 1120 600 W/m2 ETS 300 019-2-1: T1.2, IEC 60068-2-2 Bb ETS 300 019-2-1: T1.2, IEC 60068-2-2 Bb Chemically active substances Not recommended IEC TR 60271-3-1: 1C1L Mechanically active substances Not IEC TR 60271-3-1: 1S1 Vibration sinusoidal:

Displacement Acceleration Frequency range Shocks:

Shock spectrum Duration Acceleration recommended 1.5 5 2-9 9-200 mm m/s2 Hz semi-sinusoidal 1 50 ms m/s2 IEC TR 60271-3-1: 1M2 IEC 60068-2-27 Ea t TX62-W_TX62-W-x_TX82-W_HID_v01.000 2021-10-05 Confidential / Preliminary Cinterion TX62-W(-B/-C)/TX82-W Hardware Interface Description 4.3 Mounting TX62/TX82 onto the Application Platform 131 Page 122 of 154 4.3.4.2 Processing Life TX62/TX82 must be soldered to an application within 72 hours after opening the moisture bar-

rier bag (MBB) it was stored in. As specified in the IPC/JEDEC J-STD-033 Standard, the manufacturing site processing the modules should have ambient temperatures below 30C and a relative humidity below 60%. 4.3.4.3 Baking Baking conditions are specified on the moisture sensitivity label attached to each MBB (see Figure 68 for details):

It is not necessary to bake TX62/TX82, if the conditions specified in Section 4.3.4.1 and Section 4.3.4.2 were not exceeded. It is necessary to bake TX62/TX82, if any condition specified in Section 4.3.4.1 and Section 4.3.4.2 was exceeded. If baking is necessary, the modules must be put into trays that can be baked to at least 125C. Devices should not be baked in tape and reel carriers at any temperature. 4.3.4.4 Electrostatic Discharge Electrostatic discharge (ESD) may lead to irreversible damage for the module. It is therefore advisable to develop measures and methods to counter ESD and to use these to control the electrostatic environment at manufacturing sites. Please refer to Section 3.6 for further information on electrostatic discharge. t TX62-W_TX62-W-x_TX82-W_HID_v01.000 2021-10-05 Confidential / Preliminary Cinterion TX62-W(-B/-C)/TX82-W Hardware Interface Description 4.4 Packaging 131 Page 123 of 154 4.4 Packaging 4.4.1 Tape and Reel The single-feed tape carrier for TX62/TX82 is illustrated in Figure 63. The figure also shows the proper part orientation. The tape width is 24mm and the TX62/TX82 modules are placed on the tape with a 22mm pitch. The reels are 330mm in diameter with a core diameter of 99.50mm. Each reel contains 500 modules. 4.4.1.1 Orientation A0: 15.80mm B0: 15.80mm K0: 2.80mm F: 11.50mm W: 24.00mm T: 0.30mm D0: 1.50mm P: 20.00mm D1: 1.5mm P0: 4.00mm E: 1.75mm P2: 2.00mm TBD. A: 2.50mm T: 2.30mm B: 11.00mm C1: 330mm D: 99.50mm H: 24.50mm Figure 63: Carrier tape (TX62-W only) t TX62-W_TX62-W-x_TX82-W_HID_v01.000 2021-10-05 Confidential / Preliminary Cinterion TX62-W(-B/-C)/TX82-W Hardware Interface Description 4.4 Packaging 131 Page 124 of 154 Figure 64: Reel direction (TX62-W only) 4.4.1.2 Barcode Label A barcode label provides detailed information on the tape and its contents. It is attached to the reel. Barcode label Figure 65: Barcode label on tape reel t TX62-W_TX62-W-x_TX82-W_HID_v01.000 2021-10-05 Confidential / Preliminary Cinterion TX62-W(-B/-C)/TX82-W Hardware Interface Description 4.4 Packaging 131 Page 125 of 154 Figure 66: Barcode label on tape reel - layout Variables on the label are explained in Table 29. t TX62-W_TX62-W-x_TX82-W_HID_v01.000 2021-10-05 Confidential / Preliminary Cinterion TX62-W(-B/-C)/TX82-W Hardware Interface Description 4.4 Packaging 131 Page 126 of 154 4.4.2 Shipping Materials TX62/TX82 is distributed in tape and reel carriers. The tape and reel carriers used to distribute TX62/TX82 are packed as described below, including the following required shipping materials:

Moisture barrier bag, including desiccant and humidity indicator card Transportation box 4.4.2.1 Moisture Barrier Bag The tape reels are stored inside a moisture barrier bag (MBB), together with a humidity indica-

tor card and desiccant pouches - see Figure 67. The bag is ESD protected and delimits mois-

ture transmission. It is vacuum-sealed and should be handled carefully to avoid puncturing or tearing. The bag protects the TX62/TX82 modules from moisture exposure. It should not be opened until the devices are ready to be soldered onto the application. Figure 67: Moisture barrier bag (MBB) with imprint The label shown in Figure 68 summarizes requirements regarding moisture sensitivity, includ-

ing shelf life and baking requirements. It is attached to the outside of the moisture barrier bag. Variables on the label are explained in Table 29. t TX62-W_TX62-W-x_TX82-W_HID_v01.000 2021-10-05 Confidential / Preliminary Cinterion TX62-W(-B/-C)/TX82-W Hardware Interface Description 4.4 Packaging 131 Page 127 of 154 Figure 68: Moisture Sensitivity Label t TX62-W_TX62-W-x_TX82-W_HID_v01.000 2021-10-05 Confidential / Preliminary Cinterion TX62-W(-B/-C)/TX82-W Hardware Interface Description 4.4 Packaging 131 Page 128 of 154 MBBs contain one or more desiccant pouches to absorb moisture that may be in the bag. The humidity indicator card described below should be used to determine whether the enclosed components have absorbed an excessive amount of moisture. The desiccant pouches should not be baked or reused once removed from the MBB. The humidity indicator card is a moisture indicator and is included in the MBB to show the ap-

proximate relative humidity level within the bag. Sample humidity cards are shown in Figure 69. If the components have been exposed to moisture above the recommended limits, the units will have to be rebaked. Figure 69: Humidity Indicator Card - HIC A baking is required if the humidity indicator inside the bag indicates 10% RH or more. t TX62-W_TX62-W-x_TX82-W_HID_v01.000 2021-10-05 Confidential / Preliminary Cinterion TX62-W(-B/-C)/TX82-W Hardware Interface Description 4.4 Packaging 131 Page 129 of 154 4.4.2.2 Transportation Box Tape and reel carriers are distributed in a box, marked with a barcode label for identification purposes. A box contains two reels with 500 modules each. 1 2 4 5 6 7 12 13 3 8 9 10 11 14 Figure 70: Sample of VP box label Table 29: VP Box label information No. Information 1 2 3 4 5 6 7 8 9 10 11 12 13 14 Cinterion logo Product name Product ordering number Package ID number of VP box (format may vary depending on the product) Package ID barcode (Code 128) Package ID Reel 1 (format may vary depending on the product) Package ID Reel 2 (format may vary depending on the product) Quantity of the modules inside the VP box (max. 1000 pcs) Country of production Der Grne Punkt (Green Dot) symbol Chinese RoHS symbol (see Table 34) CE logo (CE mark on VP box label is present only for modules with CE imprinted on the shielding) European Article Number (EAN-13) barcode European Article Number, consists of 13 digits (EAN-13) t TX62-W_TX62-W-x_TX82-W_HID_v01.000 2021-10-05 Confidential / Preliminary Cinterion TX62-W(-B/-C)/TX82-W Hardware Interface Description 4.4 Packaging 131 Page 130 of 154 4.4.3 Trays (TBD) If small module quantities are required, e.g., for test and evaluation purposes, TX62/TX82 may be distributed in trays (for dimensions see Figure 74). The small quantity trays are an alternative to the single-feed tape carriers normally used. However, the trays are not designed for machine processing. They contain modules to be (hand) soldered onto an external application 1:1,5 Figure 71: Small quantity tray Trays are packed and shipped in the same way as tape carriers, including a moisture barrier bag with desiccant and humidity indicator card as well as a transportation box (see also Section 4.4.2). Figure 72: Tray to ship odd module amounts Figure 73: Trays with packaging materials t TX62-W_TX62-W-x_TX82-W_HID_v01.000 2021-10-05 Confidential / Preliminary Cinterion TX62-W(-B/-C)/TX82-W Hardware Interface Description 4.4 Packaging 131 Page 131 of 154 T.B.D. Figure 74: Tray dimensions (TBD.) t TX62-W_TX62-W-x_TX82-W_HID_v01.000 2021-10-05 Confidential / Preliminary Cinterion TX62-W(-B/-C)/TX82-W Hardware Interface Description 5 Regulatory and Type Approval Information 141 Page 132 of 154 5 Regulatory and Type Approval Information 5.1 Directives and Standards TX62/TX82 is designed to comply with the directives and standards listed below. It is the responsibility of the application manufacturer to ensure compliance of the final product with all provisions of the applicable directives and standards as well as with the technical spec-

ifications provided in the "Cinterion TX62-W(-B/-C)/TX82-W Hardware Interface Description".1 Table 30: Directives 2014/53/EU Directive of the European Parliament and of the Council of 16 April 2014 on the harmonisation of the laws of the Member States relating to the mak-

ing available on the market of radio equipment and repealing Directive 1999/5/EC. The product is labeled with the CE conformity mark 2002/95/EC (RoHS 1) 2011/65/EC (RoHS 2) Directive of the European Parliament and of the Council of 27 January 2003 (and revised on 8 June 2011) on the restriction of the use of certain hazardous substances in electrical and electronic equipment (RoHS) 1907/2006/EC (REACH) Regulation (EC) No 1907/2006 of the European Parliament and of the Council of 18 December 2006 concerning the Registration, Evaluation, Authorisation and Restriction of Chemicals (REACH), establishing a Euro-

pean Chemicals Agency, amending Directive 1999/45/EC and repealing Council Regulation (EEC) No 793/93 and Commission Regulation (EC) No 1488/94 as well as Council Directive 76/769/EEC and Commission Direc-

tives 91/155/EEC, 93/67/EEC, 93/105/EC and 2000/21/EC. Cinterion modules comply with the REACH regulation that specifies a content of less than 0.1% per substance mentioned in the SVHC candidate list (Release 16.06.2014). Table 31: Standards of North American type approval CFR Title 47 OET Bulletin 65

(Edition 97-01) UL 62368-1 NAPRD.03 V5.35 Code of Federal Regulations, Part 22 and Part 24 (Telecommunications, PCS); US Equipment Authorization FCC Evaluating Compliance with FCC Guidelines for Human Exposure to Radiofrequency Electromagnetic Fields Audio/video, information and communication technology equipment - Part 1: Safety requirements (for details see Section 5.1.1) Overview of PCS Type certification review board Mobile Equipment Type Certification and IMEI control PCS Type Certification Review board (PTCRB) RSS132 (Issue2) RSS133 (Issue5) Canadian Standard 1. Manufacturers of applications which can be used in the US shall ensure that their applications have a PTCRB approval. For this purpose they can refer to the PTCRB approval of the respective module. t TX62-W_TX62-W-x_TX82-W_HID_v01.000 2021-10-05 Confidential / Preliminary Cinterion TX62-W(-B/-C)/TX82-W Hardware Interface Description 5.1 Directives and Standards 141 Page 133 of 154 Table 32: Standards of European type approval 3GPP TS 51.010-1 Digital cellular telecommunications system (Release 7); Mobile Station

(MS) conformance specification;

GCF-CC V3.71 Global Certification Forum - Certification Criteria ETSI EN 301 511 V12.5.1 Global System for Mobile communications (GSM); Mobile Stations (MS) equipment; Harmonized Standard covering the essential requirements of article 3.2 of Directive 2014/53/EU ETSI EN 301 908-1 V11.1.1 IMT cellular networks; Harmonised Standard covering the essential require-

ments of article 3.2 of the Directive 2014/53/EU; Part 1: Introduction and common requirements ETSI EN 301 908-2 V11.1.2 ETSI EN 301 489-52 V1.1.0 Draft ETSI EN 301 489-

01 V2.2.0 ETSI EN 301489-19 V2.1.0 ETSI EN 303 413 V1.1.1 IMT cellular networks; Harmonised Standard covering the essential require-

ments of article 3.2 of the Directive 2014/53/EU; Part 2: CDMA Direct Spread (UTRA FDD) User Equipment (UE) Electromagnetic Compatibility (EMC) standard for radio equipment and ser-

vices; Part 52: Specific conditions for Cellular Communication Mobile and portable (UE) radio and ancillary equipment; Harmonized Standard cover-

ing the essential requirements of article 3.1(b) of Directive 2014/53/EU ElectroMagnetic Compatibility (EMC) standard for radio equipment and ser-

vices; Part 1: Common technical requirements; Harmonized Standard cov-

ering the essential requirements of article 3.1(b) of Directive 2014/53/EU and the essential requirements of article 6 of Directive 2014/30/EU ElectroMagnetic Compatibility (EMC) standard for radio equipment and ser-

vices; Part 19: Specific conditions for Receive Only Mobile Earth Stations

(ROMES) operating in the 1,5 GHz band providing data communications and GNSS receivers operating in the RNSS band (ROGNSS) providing positioning, navigation, and timing data; Harmonised Standard covering the essential requirements of article 3.1(b) of Directive 2014/53/EU Satellite Earth Stations and Systems (SES); Global Navigation Satellite System (GNSS) receivers; Radio equipment operating in the 1 164 MHz to 1 300 MHz and 1 559 MHz to 1 610 MHz frequency bands; Harmonised Standard covering the essential requirements of article 3.2 of Directive 2014/53/EU IEC 62368-1

(EN 62368-1, UL 62368-1) Audio/video, information and communication technology equipment - Part 1: Safety requirements

(for details see Section 5.1.1) Table 33: Requirements of quality IEC 60068 Environmental testing DIN EN 60529 IP codes EN 62311:2008 Assessment of electronic and electrical equipment related to human expo-

sure restrictions for electromagnetic fields (0 Hz - 300 GHz) t TX62-W_TX62-W-x_TX82-W_HID_v01.000 2021-10-05 Confidential / Preliminary Cinterion TX62-W(-B/-C)/TX82-W Hardware Interface Description 5.1 Directives and Standards 141 Page 134 of 154 Table 34: Standards of the Ministry of Information Industry of the Peoples Republic of China SJ/T 11363-2006 SJ/T 11364-2006 Requirements for Concentration Limits for Certain Hazardous Sub-

stances in Electronic Information Products (2006-06). Marking for Control of Pollution Caused by Electronic Information Products (2006-06). According to the Chinese Administration on the Control of Pollution caused by Electronic Information Products

(ACPEIP) the EPUP, i.e., Environmental Protection Use Period, of this product is 20 years as per the symbol shown here, unless otherwise marked. The EPUP is valid only as long as the product is operated within the operating limits described in the Thales Hardware Interface Description. Please see Table 35 for an overview of toxic or hazardous substances or elements that might be contained in product parts in concentrations above the limits defined by SJ/T 11363-2006. Table 35: Toxic or hazardous substances or elements with defined concentration limits t TX62-W_TX62-W-x_TX82-W_HID_v01.000 2021-10-05 Confidential / Preliminary Cinterion TX62-W(-B/-C)/TX82-W Hardware Interface Description 5.1 Directives and Standards 141 Page 135 of 154 5.1.1 IEC 62368-1 Classification With respect to the safety requirements for audio/video, information and communication tech-

nology equipment defined by the hazard based product safety standard for ICT and AV equip-

ment - i.e., IEC-62368-1 (EN 62368-1, UL 62368-1) - Cinterion modules are classified as shown below:

Standalone operation of the modules is not possible. Modules will always be incorporated in an external application (Customer Product). Customer understands and is responsible that the product incorporating the Cinterion module must be designed to be compliant with IEC-62368-1 (EN 62368-1, UL 62368-1) to ensure pro-

tection against hazards and injuries. When operating the Cinterion module the external appli-

cation (Customer Product) must provide safeguards not to exceed the power limits given by classification to Power Source Class 1 (15 Watts) under normal operating conditions, abnormal conditions, or in the presence of a single fault. When using a battery power supply the external application must provide safeguards not to exceed the limits defined by PS-1, as well. The ex-

ternal application (Customer Product) must take measures to limit the power, the voltage or the current, respectively, if required, and must provide safeguards to protect ordinary persons against pain or injury caused by the voltage/current. In case of a usage of the Cinterion module not in accordance with the specifications or in sin-

gle fault condition the external application (Customer Product) must be capable to withstand levels according to ES-1 / PS-1 also on all ports that are initially intended for signaling or audio, e.g., USB, RS-232, GPIOs, SPI, earphone and microphone interfaces. In addition, the external application (Customer Product) must be designed in a way to distribute thermal energy generated by the intended operation of the Cinterion module. In case of high temperature operation, the external application must provide safeguards to protect ordinary persons against pain or injury caused by the heat. Table 36: IEC 62368-1 Classification Source of Energy Electrical energy source Class ES-1 Power Source

(potential ignition source caus-

ing fire) PS-1 Limits The Cinterion modules contain no electrical energy source - especially no battery. The electri-

cal components and circuits have to be externally power supplied:

DC either smaller 60 V Or less than 2 mA AC up to 1kHz smaller 30 V-rms or 42.4 V peak AC above 100kHz smaller 70 V rms Power source provided by the external application must not exceed 15W, even under worst case and any single fault condition defined by IEC-62368-1:

Section 6.2.2.3. t TX62-W_TX62-W-x_TX82-W_HID_v01.000 2021-10-05 Confidential / Preliminary Cinterion TX62-W(-B/-C)/TX82-W Hardware Interface Description 5.1 Directives and Standards 141 Page 136 of 154 Table 36: IEC 62368-1 Classification Source of Energy Hazardous Substances, Chemical reaction Class

Kinetic / mechanical energy source MS-1 Thermal energy source TS-2 Radiated energy source RS-1 Limits Under regular conditions, the Cinterion module does not contain any chemically reactive sub-

stances, and no chemical energy source, espe-

cially no battery. Module is compliant with RoHS and REACH (see above). In very rare cases however - under abnormal con-

ditions (i.e. wrong supply voltage, burned module) or in the presence of single electrical component faults (i.e. shortcut) - health hazardous sub-

stances might be released if the worst comes to the worst. The Cinterion modules have no sharp edges and corners, no moving parts, no loosing, exploding or imploding parts. The mass is well below 1kg. Under normal operating conditions, abnormal operating conditions or single fault conditions the temperature does not exceed +100C on the metal surface (shielding) The Cinterion module does not contain a radiant energy source, any lasers, lamps, LEDs, X-Ray emitting components or acoustic couplers. t TX62-W_TX62-W-x_TX82-W_HID_v01.000 2021-10-05 Confidential / Preliminary Cinterion TX62-W(-B/-C)/TX82-W Hardware Interface Description 5.2 SAR requirements specific to portable mobiles 141 Page 137 of 154 5.2 SAR requirements specific to portable mobiles Mobile phones, PDAs or other portable transmitters and receivers incorporating a module must be in accordance with the guidelines for human exposure to radio frequency energy. This re-

quires the Specific Absorption Rate (SAR) of portable TX62/TX82 based applications to be evaluated and approved for compliance with national and/or international regulations. Since the SAR value varies significantly with the individual product design manufacturers are advised to submit their product for approval if designed for portable use. For European and US markets the relevant directives are mentioned below. The manufacturer of the end device is in the responsibility to provide clear installation and operating instructions for the user, including the minimum separation distance required to maintain compliance with SAR and/or RF field strength limits, as well as any special usage conditions required to do so, such as a required accessory, the proper orientation of the device, the max antenna gain for detachable antennas, or other relevant criteria. It is the responsibility of the manufacturer of the final product to verify whether or not further standards, recommendations or directives are in force outside these ar-

eas. Products intended for sale on US markets ES 59005/ANSI C95.1 Considerations for evaluation of human exposure to Electromagnetic Fields (EMFs) from Mobile Telecommunication Equipment (MTE) in the frequency range 30MHz - 6GHz Products intended for sale on European markets EN 50360 EN 62311:2008 Product standard to demonstrate the compliance of mobile phones with the basic restrictions related to human exposure to electromagnetic fields (300MHz - 3GHz) Assessment of electronic and electrical equipment related to human expo-sure restrictions for electromagnetic fields (0 Hz - 300 GHz) Please note that SAR requirements are specific only for portable devices and not for mobile devices as defined below:

Portable device:

A portable device is defined as a transmitting device designed to be used so that the radi-

ating structure(s) of the device is/are within 20 centimeters of the body of the user. Mobile device:

A mobile device is defined as a transmitting device designed to be used in other than fixed locations and to generally be used in such a way that a separation distance of at least 20 centimeters is normally maintained between the transmitter's radiating structure(s) and the body of the user or nearby persons. In this context, the term ''fixed location'' means that the device is physically secured at one location and is not able to be easily moved to another location. t TX62-W_TX62-W-x_TX82-W_HID_v01.000 2021-10-05 Confidential / Preliminary Cinterion TX62-W(-B/-C)/TX82-W Hardware Interface Description 5.3 Reference Equipment for Type Approval 141 Page 138 of 154 5.3 Reference Equipment for Type Approval The Thales reference setup submitted to type approve TX62/TX82 (including a special approv-

al adapter for the DSB75) is shown in the following figure1:

LTE/GSM BaseStation GNSS Antenna Main Antenna ASC0 ASC1 PC Power Supply DSB75Adapter SIMCard SMA SMA SMA USB DSB75 Eval_Board Eval_Board TX62/TX82 TX62/TX82 Figure 75: Reference equipment for type approval 1. For RF performance tests a mini-SMT/U.FL to SMA adapter with attached 6dB coaxial attenuator is cho-

sen to connect the evaluation module directly to the LTE/GSM/GNSS test equipment instead of employ-

ing the SMA antenna connectors on the TX62/TX82-DSB75 adapter as shown in Figure 75. The following products are recommended:

Hirose SMA-Jack/U.FL-Plug conversion adapter HRMJ-U.FLP(40)

(for details see http://www.hirose-connectors.com/ or http://www.farnell.com/

Aeroflex Weinschel Fixed Coaxial Attenuator Model 3T/4T

(for details see http://www.aeroflex.com/ams/weinschel/pdfiles/wmod3&4T.pdf) t TX62-W_TX62-W-x_TX82-W_HID_v01.000 2021-10-05 Confidential / Preliminary Cinterion TX62-W(-B/-C)/TX82-W Hardware Interface Description 5.4 Compliance with FCC and ISED Rules and Regulations 141 Page 139 of 154 5.4 Compliance with FCC and ISED Rules and Regulations The Equipment Authorization Certification for the Thales reference application described in Section 5.3 will be registered under the following identifiers:

FCC Identifier: QIPTX82-W ISED Certification Number: 7830A-TX82W Granted to THALES DIS AIS Deutschland GmbH FCC Identifier: QIPTX62-W ISED Certification Number: 7830A-TX62W Granted to THALES DIS AIS Deutschland GmbH FCC Identifier: QIPTX62-W-B ISED Certification Number: 7830A-TX62WB Granted to THALES DIS AIS Deutschland GmbH Manufacturers of mobile or fixed devices incorporating TX62/TX82 modules are authorized to use the FCC Grants and ISED Certificates of the TX62/TX82 modules for their own final prod-

ucts according to the conditions referenced in these documents. In this case, an FCC/ IC label of the module shall be visible from the outside, or the host device shall bear a second label stat-

ing "Contains FCC ID: QIPTX82-W" or "Contains FCC ID: QIPTX62-W" or "Contains FCC ID:

QIPTX62-W-B", and accordingly Contains IC: 7830A-TX82W or Contains IC: 7830A-TX62W or Contains IC: 7830A-TX62WB. The integration is limited to fixed or mobile categorized host devices, where a separation distance between the antenna and any person of min. 20cm can be assured during normal operating conditions. For mobile and fixed operation configurations the antenna gain, including cable loss, must not exceed the limits listed in the following Table 37, Table 38, and Table 39 for FCC and/or ISED. Table 37: Antenna gain limits for FCC and ISED for TX82-W Maximum gain in operating band FCC limit ISED limit All limits Unit LTE Band 2 LTE Band 4 LTE Band 5 LTE Band 12 LTE Band 13 LTE Band 25 LTE Band 26 LTE Band 66 LTE Band 71 GSM850 PCS1900 11.01 8.00 12.41 11.70 12.16 11.01 12.41 8.00 11.47 8.60 10.20 11.01 11.01 8.00 9.10 8.61 8.93 11.01 9.10 8.00 8.45 5.30 10.20 8.00 9.10 8.61 8.93 11.01 9.10 8.00 8.45 5.30 10.20 dBi dBi dBi dBi dBi dBi dBi dBi dBi dBi dBi t TX62-W_TX62-W-x_TX82-W_HID_v01.000 2021-10-05 Confidential / Preliminary Cinterion TX62-W(-B/-C)/TX82-W Hardware Interface Description 5.4 Compliance with FCC and ISED Rules and Regulations 141 Page 140 of 154 Table 38: Antenna gain limits for FCC and ISED for TX62-W Maximum gain in operating band FCC limit ISED limit All limits Unit LTE Band 2 LTE Band 4 LTE Band 5 LTE Band 12 LTE Band 13 LTE Band 25 LTE Band 26 LTE Band 66 LTE Band 71 11.01 8.00 12.41 11.70 12.16 11.01 12.41 8.00 11.47 11.01 11.01 8.00 9.10 8.61 8.93 11.01 9.10 8.00 8.45 8.00 9.10 8.61 8.93 11.01 9.10 8.00 8.45 dBi dBi dBi dBi dBi dBi dBi dBi dBi Table 39: Antenna gain limits for FCC and ISED for TX62-W-B Maximum gain in operating band FCC limit ISED limit All limits Unit LTE Band 2 LTE Band 4 LTE Band 5 LTE Band 8 LTE Band 12 LTE Band 13 LTE Band 25 LTE Band 26 LTE Band 66 LTE Band 71 8.01 5.00 9.41 9.70 8.70 9.16 8.01 9.41 5.00 8.47 8.01 5.00 6.10

5.61 5.93 8.01 6.10 5.00 5.45 8.01 5.00 6.10 9.70 5.61 5.93 8.01 6.10 5.00 5.45 dBi dBi dBi dBi dBi dBi dBi dBi dBi dBi IMPORTANT:

Manufacturers of portable applications incorporating TX62/TX82 modules are required to have their final product certified and apply for their own FCC Grant and ISED Certificate related to the specific portable mobile. This is mandatory to meet the SAR requirements for portable mo-

biles (see Section 5.2 for detail). Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. Note: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules and with ISED license-exempt RSS standard(s). These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interfer-

ence to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or televi-

t TX62-W_TX62-W-x_TX82-W_HID_v01.000 2021-10-05 Confidential / Preliminary Cinterion TX62-W(-B/-C)/TX82-W Hardware Interface Description 5.4 Compliance with FCC and ISED Rules and Regulations 141 Page 141 of 154 sion reception, which can be determined by turning the equipment off and on, the user is en-

couraged to try to correct the interference by one or more of the following measures:

Reorient or relocate the receiving antenna. Connect the equipment into an outlet on a circuit different from that to which the receiver is Increase the separation between the equipment and receiver. connected. Consult the dealer or an experienced radio/TV technician for help. This Class B digital apparatus complies with Canadian ICES-003. If Canadian approval is requested for devices incorporating TX62/TX82 modules the below notes will have to be provided in the English and French language in the final user documen-

tation. Manufacturers/OEM Integrators must ensure that the final user documentation does not contain any information on how to install or remove the module from the final product. Notes (ISED):

(EN) This Class B digital apparatus complies with Canadian ICES-003 and RSS-210. Opera-

tion is subject to the following two conditions: (1) this device may not cause interference, and

(2) this device must accept any interference, including interference that may cause undesired operation of the device.

(FR) Cet appareil numrique de classe B est conforme aux normes canadiennes ICES-003 et RSS-210. Son fonctionnement est soumis aux deux conditions suivantes: (1) cet appareil ne doit pas causer d'interfrence et (2) cet appareil doit accepter toute interfrence, notamment les interfrences qui peuvent affecter son fonctionnement.

(EN) Radio frequency (RF) Exposure Information The radiated output power of the Wireless Device is below the Innovation, Science and Eco-

nomic Development Canada (ISED) radio frequency exposure limits. The Wireless Device should be used in such a manner such that the potential for human contact during normal op-

eration is minimized. This device has also been evaluated and shown compliant with the ISED RF Exposure limits under mobile exposure conditions. (antennas are greater than 20cm from a persons body).

(FR) Informations concernant l'exposltion aux frquences radio (RF) La puissance de sortie mise par l'appareil de sans fiI est infrieure la limite d'exposition aux frquences radio dInnovation, Sciences et Dveloppement conomique Canada (ISDE). Utili-

sez l'appareil de sans fil de faon minimiser les contacts humains lors du fonctionnement nor-

mal. Ce priphrique a galement t valu et dmontr conforme aux limites d'exposition aux RF d'ISDE dans des conditions d'exposition des appareils mobiles (les antennes se situent moins de 20cm du corps d'une personne). t TX62-W_TX62-W-x_TX82-W_HID_v01.000 2021-10-05 Confidential / Preliminary Cinterion TX62-W(-B/-C)/TX82-W Hardware Interface Description 6 Document Information 149 Page 142 of 154 6 Document Information 6.1 Revision History Preceding document: Cinterion TX62-W(-B)/TX82-W Hardware Interface Description" v00.026b New document: "Cinterion TX62-W(-B/-C)/TX82-W Hardware Interface Description" v01.000 Chapter What is new

2.1.2, 3.2.1.1 2.4 3.2.1.1 3.2.1.2 4.3 5.4 Added new Variant: TX62-W-C. Revised high level pulse width for ON signal (1ms --> 30ms). Revised Figure 32. Added pull-down resistor in Figure 34. New section Automatic Power On. Added note regarding placement of external components. Added Table 37, Table 38, and Table 39 with FCC and ISED antenna gain limits. Preceding document: Cinterion TX62-W(-B)/TX82-W Hardware Interface Description" v00.026a New document: "Cinterion TX62-W(-B)/TX82-W Hardware Interface Description" v00.026b Chapter What is new 2.1.1 2.1.2 Revised G15/G16 pad assignments, and removed superfluous footnote in Table 2. Revised Table 3: No internal pull up resistors for I2C lines. 2.1.4, 2.1.5 Added note below Figure 10 and Figure 12 explaining dotted lines. 2.1.7 2.1.8.1 2.2.1 3.2.2.2 3.2.4.1 3.4.1 5.1 5.1.1 5.2 Revised Figure 15. Added Figure 16 showing how to connect eUICC to modules SIM interface lines. Revised GPIO availability with embedded processing option, and adapted whole docu-

ment accordingly. Removed Max. column from Table 9 and Table 10. Revised description of the emergency restart process. Added note that worst fast shutdown time cannot be specified. Added power supply ratings for TX62-W-B and TX82-W. Replaced UL 60950 with UL 62368-1 in Table 31. Completed Table 36 regarding hazardous substances, chemical reaction. Added remark regarding responsibility of the end device manufacturer. Preceding document: Cinterion TX62-W(-B)/TX82-W Hardware Interface Description" v00.026 New document: "Cinterion TX62-W(-B)/TX82-W Hardware Interface Description" v00.026a Chapter What is new 3.4.1 Added power supply ratings for TX62-W. t TX62-W_TX62-W-x_TX82-W_HID_v01.000 2021-10-05 Confidential / Preliminary Cinterion TX62-W(-B/-C)/TX82-W Hardware Interface Description 6.1 Revision History 149 Page 143 of 154 Preceding document: Cinterion TX62-W(-B)/TX82-W Hardware Interface Description" v00.022a New document: "Cinterion TX62-W(-B)/TX82-W Hardware Interface Description" v00.026 Chapter What is new 1.1 2.1.8 5.1 5.1 5.1.1 7.1 Revised version of TX62-W-B Revised Figure 17 Added REACH directive to Table 30 Change Safety Standard to IEC 62368-1 in Table 32 New chapter regarding IEC 62368-1 Classification Revised ordering and module label numbers inn Table 40 Preceding document: Cinterion TX62-W(-B)/TX82-W Hardware Interface Description" v00.022 New document: "Cinterion TX62-W(-B)/TX82-W Hardware Interface Description" v00.022a Chapter What is new Throughout document 1.4 2.1.4 2.2.1 Adapted GSM voltage range (3.1V...4.6V) Revised block diagrams Figure 2, Figure 3, and Figure 4. Revised Figure 10, and changed Table 14 accordingly. Revised receiver input sensitivity ratings in Table 9 and Table 10. 3.2.2.2 Revised Figure 37. Preceding document: Cinterion TXx2-W Hardware Interface Description" v00.016 New document: "Cinterion TX62-W(-B)/TX82-W Hardware Interface Description" v00.022 Chapter What is new Throughout document Added details about the embedded processing option. Revised supported footprint for TX62-W-B. Replaced MIM with eUICC. 2.1.2 2.1.4 Added signal properties for eUICC interface lines. Revised Figure 10. 4.3.1.1 Revised stencil shown in Figure 61. 7.1 Updated ordering information. Preceding document: Cinterion TXx2-W Hardware Interface Description" v00.002 New document: "Cinterion TXx2-W Hardware Interface Description" v00.016 Chapter What is new Throughout document 1.2 2.1.1 2.1.1 Added product TX82-W and TX62-W-B Added GPIO to Key Feature at a Glance Added Table 1 for Pad Assignment of additional Pads of TX82-W Revised Pad Assignment regarding GPIO in Table 1, Table 2, Figure 6 and Figure 7 t TX62-W_TX62-W-x_TX82-W_HID_v01.000 2021-10-05 Confidential / Preliminary Cinterion TX62-W(-B/-C)/TX82-W Hardware Interface Description 6.1 Revision History 149 Page 144 of 154 Chapter What is new 2.1.2 2.1.8 2.4 3.2.3 3.7 6.1 Revised Signal Properties regarding GPIO in Table 3 Added new chapter for GPIO Revised Sample Application regarding GPIO and USB in Figure 32 Revised Table 14 regarding GPIO, corrected some signal states Revised Table 25 regarding GPIO, removed USB signals Revised changes for document version 00.002 Preceding document: Cinterion TXx2-W Hardware Interface Description" v00.200a New document: "Cinterion TXx2-W Hardware Interface Description" v00.002 Chapter What is new Throughout document 1.2, 2.1.2, 3.4.1 Removed product TX82-W, thus the document version number restarted to 00.002 Changed minimum BATT+BB from 2.5V to 2.55V in Table 3 and Table 17 1.2, 4.1 Changed hight of the module in Feature at a Glance and in Figure 52 and Figure 53 2.1.2 2.1.6 Revised ON signal description in Table 3 Added in Figure 13 hint where to place the capacitors 2.1.6.1 Added hint where to place the capacitors 2.1.7 2.2.1 2.2.3 3.4.3 3.7 4.1 4.3.1.1 4.4.1.1 Revised Figure 15 added reference to chapter 2.1.6.1 Updated Table 9 Revised Figure 26, Figure 27, Figure 28, Figure 29 and Figure 30 according to the foot-

print of TX62-W Revised chapter and Figure 49 regarding GND reference point Added placement of capacitors in Table 25 for SIM interface signals Revised Figure 54 Changed Stencil thickness to 110m and Stencil pattern in Figure 60 Revised Figure 63 and Figure 64 Preceding document: "Cinterion TXx2-W Hardware Interface Description" v00.200 New document: "Cinterion TXx2-W Hardware Interface Description" v00.200a Chapter What is new 1.2 1.3 1.4 2.1.2 2.4 3.4.1 4.2 Removed extended voltage range and changed eUICC size MFF2 to MFF-XS Revised Figure 1 regarding eUICC size Removed in Figure 2 signal ADC2 Removed extended voltage range in Table 3 Removed in Figure 32 wrong PAD numbers Removed extended voltage range in Table 17 Revised Figure 55 t TX62-W_TX62-W-x_TX82-W_HID_v01.000 2021-10-05 Confidential / Preliminary Cinterion TX62-W(-B/-C)/TX82-W Hardware Interface Description 6.2 Related Documents 149 Page 145 of 154 Preceding document: "Cinterion TXx2-W Hardware Interface Description" v00.038 New document: "Cinterion TXx2-W Hardware Interface Description" v00.200 Chapter What is new

New document layout Throughout document Removed LTE Bd14. Renamed LTE Bd4 (AWS --> AWS-1), LTE Bd66 (1700MHz --> AWS-3). Throughout document Added support for optional eUICC interface. 1.2 1.2 2.1.1 2.1.2 2.1.2.1 2.1.7 Added references from key feature list to appropriate document sections. Added support for Cinterion IoT Module services (MODS) as key feature. Revised Note 2 of Table 2 Revised Table 3 related to power supply Added absolute maximum ratings for digital lines in normal operation. New section eUICC Interface. 2.1.11.2 Adapted power indication circuit shown in Figure 21. 2.1.11.3 Revised fast shutdown description. 2.3.1 2.3.2 2.3.3 2.4 3.2.3 3.4.1 4.2 Added note that concurrent GNSS and GSM/LTE operations are not supported. Revised description for active GNSS antenna and Figure 31 Revised Table 12 listing GNSS antenna interface characteristics. Revised Figure 32 Revised section Signal States after Startup including Table 11. Revised Table 17 related to power supply New section Mechanical Dimensions of TX82-W, TX62-W-B and TX62-W-C 4.3.1.1 Added Land pattern and Stencil for TX82-W New document: "Cinterion TX62-W/TX82-W Hardware Interface Description" v00.038 Chapter What is new

Initial document setup. 6.2 Related Documents

[1] TX62/TX82 AT Command Set

[2] TX62/TX82 Release Note

[3] Universal Serial Bus Specification Revision 2.0, April 27, 2000

[4] Application Note 40: Thermal Solutions for Cinterion TXx2-W Applications

[5] Application Note 48: SMT Module Integration

[6] Differences between Selected Cinterion Modules, Hardware Migration Guide, v11

[7] Cinterion IoT Module Services User Guide, v01

[8] Cinterion IoT SDK User Guide, v01 t TX62-W_TX62-W-x_TX82-W_HID_v01.000 2021-10-05 Confidential / Preliminary Cinterion TX62-W(-B/-C)/TX82-W Hardware Interface Description 6.3 Terms and Abbreviations 149 Page 146 of 154 6.3 Terms and Abbreviations Abbreviation Description ADC AGC ANSI Analog-to-digital converter Automatic Gain Control American National Standards Institute ARFCN Absolute Radio Frequency Channel Number ARP Antenna Reference Point ASC0/ASC1 Asynchronous Controller. Abbreviations used for first and second serial interface of TX62/TX82 B BER BTS Thermistor Constant Bit Error Rate Base Transceiver Station CB or CBM Cell Broadcast Message CE CHAP CPU CS CSD CTS DAC DAI dBm0 DCE Conformit Europene (European Conformity) Challenge Handshake Authentication Protocol Central Processing Unit Coding Scheme Circuit Switched Data Clear to Send Digital-to-Analog Converter Digital Audio Interface Digital level, 3.14dBm0 corresponds to full scale, see ITU G.711, A-law Data Communication Equipment (typically modems, e.g. Thales module) DCS 1800 Digital Cellular System, also referred to as PCN DRX DSB DSP DSR DTE DTR DTX EFR EGSM EIRP EMC Discontinuous Reception Development Support Box Digital Signal Processor Data Set Ready Data Terminal Equipment (typically computer, terminal, printer or, for example, GSM application) Data Terminal Ready Discontinuous Transmission Enhanced Full Rate Enhanced GSM Equivalent Isotropic Radiated Power Electromagnetic Compatibility t TX62-W_TX62-W-x_TX82-W_HID_v01.000 2021-10-05 Confidential / Preliminary Cinterion TX62-W(-B/-C)/TX82-W Hardware Interface Description 6.3 Terms and Abbreviations 149 Page 147 of 154 Abbreviation Description EMI ERP ESD ETS FCC FDMA FR GMSK GPRS GSM HiZ HR I/O IC IMEI ISO ITU kbps LED Li-Ion/Li+

Li battery LPM Mbps MMI MO MS Electromagnetic Interference Effective Radiated Power Electrostatic Discharge European Telecommunication Standard Federal Communications Commission (U.S.) Frequency Division Multiple Access Full Rate Gaussian Minimum Shift Keying General Packet Radio Service Global Standard for Mobile Communications High Impedance Half Rate Input/Output Integrated Circuit International Mobile Equipment Identity International Standards Organization International Telecommunications Union kbits per second Light Emitting Diode Lithium-Ion Rechargeable Lithium Ion or Lithium Polymer battery Link Power Management Mbits per second Man Machine Interface Mobile Originated Mobile Station (GSM module), also referred to as TE MSISDN Mobile Station International ISDN number MT NTC OEM PA PAP Mobile Terminated Negative Temperature Coefficient Original Equipment Manufacturer Power Amplifier Password Authentication Protocol PBCCH Packet Switched Broadcast Control Channel PCB PCL PCM PCN Printed Circuit Board Power Control Level Pulse Code Modulation Personal Communications Network, also referred to as DCS 1800 t TX62-W_TX62-W-x_TX82-W_HID_v01.000 2021-10-05 Confidential / Preliminary Cinterion TX62-W(-B/-C)/TX82-W Hardware Interface Description 6.3 Terms and Abbreviations 149 Page 148 of 154 Abbreviation Description PDU PLL PPP PSK PSU Protocol Data Unit Phase Locked Loop Point-to-point protocol Phase Shift Keying Power Supply Unit R&TTE Radio and Telecommunication Terminal Equipment RAM RF RLS RMS RoHS ROM RTC RTS Rx SAR SAW SELV SIM SMD SMS SMT SPI SRAM TA TDMA TE TLS Tx UART URC USSD VSWR Random Access Memory Radio Frequency Radio Link Stability Root Mean Square (value) Restriction of the use of certain hazardous substances in electrical and electronic equipment. Read-only Memory Real Time Clock Request to Send Receive Direction Specific Absorption Rate Surface Acoustic Wave Safety Extra Low Voltage Subscriber Identification Module Surface Mount Device Short Message Service Surface Mount Technology Serial Peripheral Interface Static Random Access Memory Terminal adapter (e.g. GSM module) Time Division Multiple Access Terminal Equipment, also referred to as DTE Transport Layer Security Transmit Direction Universal asynchronous receiver-transmitter Unsolicited Result Code Unstructured Supplementary Service Data Voltage Standing Wave Ratio t TX62-W_TX62-W-x_TX82-W_HID_v01.000 2021-10-05 Confidential / Preliminary Cinterion TX62-W(-B/-C)/TX82-W Hardware Interface Description 6.4 Safety Precaution Notes 149 Page 149 of 154 6.4 Safety Precaution Notes The following safety precautions must be observed during all phases of the operation, usage, service or repair of any cellular terminal or mobile incorporating TX62/TX82. Manufacturers of the cellular terminal are advised to convey the following safety information to users and oper-

ating personnel and to incorporate these guidelines into all manuals supplied with the product. Failure to comply with these precautions violates safety standards of design, manufacture and intended use of the product. Thales assumes no liability for customers failure to comply with these precautions. When in a hospital or other health care facility, observe the restrictions on the use of mobiles. Switch the cellular terminal or mobile off, if instructed to do so by the guide-

lines posted in sensitive areas. Medical equipment may be sensitive to RF energy. The operation of cardiac pacemakers, other implanted medical equipment and hear-

ing aids can be affected by interference from cellular terminals or mobiles placed close to the device. If in doubt about potential danger, contact the physician or the manufac-

turer of the device to verify that the equipment is properly shielded. Pacemaker patients are advised to keep their hand-held mobile away from the pacemaker, while it is on. Switch off the cellular terminal or mobile before boarding an aircraft. Make sure it can-

not be switched on inadvertently. The operation of wireless appliances in an aircraft is forbidden to prevent interference with communications systems. Failure to observe these instructions may lead to the suspension or denial of cellular services to the offender, legal action, or both. Do not operate the cellular terminal or mobile in the presence of flammable gases or fumes. Switch off the cellular terminal when you are near petrol stations, fuel depots, chemical plants or where blasting operations are in progress. Operation of any elec-

trical equipment in potentially explosive atmospheres can constitute a safety hazard. Your cellular terminal or mobile receives and transmits radio frequency energy while switched on. Remember that interference can occur if it is used close to TV sets, radios, computers or inadequately shielded equipment. Follow any special regulations and always switch off the cellular terminal or mobile wherever forbidden, or when you suspect that it may cause interference or danger. Road safety comes first! Do not use a hand-held cellular terminal or mobile when driv-

ing a vehicle, unless it is securely mounted in a holder for speakerphone operation. Before making a call with a hand-held terminal or mobile, park the vehicle. Speakerphones must be installed by qualified personnel. Faulty installation or opera-

tion can constitute a safety hazard. IMPORTANT!

Cellular terminals or mobiles operate using radio signals and cellular networks. Because of this, connection cannot be guaranteed at all times under all conditions. Therefore, you should never rely solely upon any wireless device for essential com-

munications, for example emergency calls. Remember, in order to make or receive calls, the cellular terminal or mobile must be switched on and in a service area with adequate cellular signal strength. Some networks do not allow for emergency calls if certain network services or phone features are in use (e.g. lock functions, fixed dialing etc.). You may need to deactivate those features before you can make an emergency call. Some networks require that a valid SIM card be properly inserted in the cellular termi-

nal or mobile. t TX62-W_TX62-W-x_TX82-W_HID_v01.000 2021-10-05 Confidential / Preliminary Cinterion TX62-W(-B/-C)/TX82-W Hardware Interface Description 7 Appendix 153 Page 150 of 154 7 Appendix 7.1 List of Parts and Accessories Table 40: List of parts and accessories Description TX62-W Supplier Ordering information Thales Standard module Thales IMEI:

Packaging unit (ordering) number: L30960-N6300-A100 Module label number1: S30960-S6300-A100-1 TX62-W-B Thales TX62-W-C Thales Standard module with embedded MFF-XS eUICC Thales IMEI:

Packaging unit (ordering) number: L30960-N6307-A100 Module label number1: S30960-S6307-A100-1 Customer IMEI mode:

Packaging unit (ordering) number: L30960-N6305-A100 Module label number1: S30960-S6305-A100-1 Standard module Thales IMEI:

Packaging unit (ordering) number: L30960-N6650-A100 Module label number1: S30960-S6650-A100-1 Standard module with embedded MFF-XS eUICC Thales IMEI:

Packaging unit (ordering) number: L30960-N6657-A100 Module label number1: S30960-S6657-A100-1 Customer IMEI mode:

Packaging unit (ordering) number: L30960-N6655-A100 Module label number1: S30960-S6655-A100-1 Standard module Thales IMEI:

Packaging unit (ordering) number: t.b.d Module label number1: t.b.d Standard module with embedded MFF-XS eUICC Thales IMEI:

Packaging unit (ordering) number: t.b.d. Module label number1: t.b.d Customer IMEI mode:

Packaging unit (ordering) number: t.b.d Module label number1: t.b.d. t TX62-W_TX62-W-x_TX82-W_HID_v01.000 2021-10-05 Confidential / Preliminary Cinterion TX62-W(-B/-C)/TX82-W Hardware Interface Description 7.1 List of Parts and Accessories 153 Page 151 of 154 Table 40: List of parts and accessories Description TX82-W Supplier Ordering information Thales Standard module Thales IMEI:

Packaging unit (ordering) number: L30960-N6600-A100 Module label number1: S30960-S6600-A100-1. Standard module with embedded MFF-XS eUICC Thales IMEI:

Packaging unit (ordering) number: L30960-N6607-A100 Module label number1: S30960-S6607-A100-1 Customer IMEI mode:

Packaging unit (ordering) number: L30960-N6605-A100 Module label number1: S30960-S6605-A100-1. TX62-W Evaluation Module Thales Standard module Ordering number: L30960-N6301-A100 Standard module with embedded MFF-XS eUICC Ordering number: L30960-N6308-A100 TX62-W-B Evaluation Module Thales Standard module Ordering number: L30960-N6651-A100 Standard module with embedded MFF-XS eUICC Ordering number: L30960-N6658-A100 TX62-W-C Evaluation Module Thales Standard module Ordering number: t.b.d TX82-W Evaluation Module Thales Standard module Ordering number: L30960-N6601-A100 Standard module with embedded MFF-XS eUICC Ordering number: t.b.d. DSB75 Evaluation Kit DSB Mini Compact Evaluation Board Thales Thales Standard module with embedded MFF-XS eUICC Ordering number: L30960-N6608-A100 Ordering number: L36880-N8811-A100 Ordering number: L30960-N0030-A100 LGA DevKit Thales LGA DevKit consists of Cinterion LGA DevKit T Base PCB:

Ordering number: L30960-N0113-A100 Cinterion LGA DevKit Socket T:

Ordering number: L30960-N0114-A100 EVAL DSB Adapter for mounting TX62/TX82 eval-

uation modules onto DSB75 Thales Ordering number: L30960-N0100-A100 SIM card holder incl. push button ejector and slide-in tray Molex Ordering numbers: 91228 91236 Sales contacts are listed in Table 41. 1. Note: At the discretion of Thales, module label information can either be laser engraved on the modules shielding or be printed on a label adhered to the modules shielding. t TX62-W_TX62-W-x_TX82-W_HID_v01.000 2021-10-05 Confidential / Preliminary Cinterion TX62-W(-B/-C)/TX82-W Hardware Interface Description 7.1 List of Parts and Accessories 153 Page 152 of 154 Table 41: Molex sales contacts (subject to change) Molex For further information please click:

http://www.molex.com Molex China Distributors Beijing, Room 1311, Tower B, COFCO Plaza No. 8, Jian Guo Men Nei Street, 100005 Beijing P.R. China Phone: +86-10-6526-9628 Fax: +86-10-6526-9730 Molex Deutschland GmbH Otto-Hahn-Str. 1b 69190 Walldorf Germany Phone: +49-6227-3091-0 Fax: +49-6227-3091-8100 Email: mxgermany@molex.com Molex Singapore Pte. Ltd. 110, International Road Jurong Town, Singapore 629174 American Headquarters Lisle, Illinois 60532 U.S.A. Phone: +1-800-78MOLEX Fax: +1-630-969-1352 Molex Japan Co. Ltd. 1-5-4 Fukami-Higashi, Yamato-City, Kanagawa, 242-8585 Japan Phone: +65-6-268-6868 Fax: +65-6-265-6044 Phone: +81-46-265-2325 Fax: +81-46-265-2365 t TX62-W_TX62-W-x_TX82-W_HID_v01.000 2021-10-05 Confidential / Preliminary Cinterion TX62-W(-B/-C)/TX82-W Hardware Interface Description 7.2 Module Label Information 153 Page 153 of 154 7.2 Module Label Information The label engraved on the top of TX62/TX82 comprises the following information1. 1 4 5 6 7 Made in Text S Model: TX62-W S30960-S6300-A100-1 not for sale 358009 09 000216 2 L7 Figure 76: TX62/TX82 label 2 3 8 Table 42: TX62/TX82 label information No. 1 2 3 4 5 6 7 8 Cinterion logo Manufacturing country (e.g., Made in China) Factory code Product name/variant (e.g., TX62-W) Product order code Manufacturer 2D barcode Product IMEI 2-digit date code of product production (for decoding see Table 43 below) Table 43: Date code table Date Code Code L M N P R S T U V W X A Year 2019 2020 2021 2022 2023 2024 2025 2026 2027 2028 2029 2030 Code 1 2 3 4 5 6 7 8 9 O N D Month Jan. Feb. Mar. Apr. May June July Aug. Sept. Oct. Nov. Dec. 1. To be continued - full label information will be available with a next document version. t TX62-W_TX62-W-x_TX82-W_HID_v01.000 2021-10-05 Confidential / Preliminary 154 THALES DIS AIS Deutschland GmbH Werinherstrasse 81 81541 Munich Germany

. s e i r t n u o c n a t r e c i n i i d e r e t s g e r e r a d n a s e a h T l f o s k r a m e c v r e s d n a i s k r a m e d a r t e r a

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14.30 1.30 19,90 1.30 4.0 CINTERION S30960-S6650-A100-1 Model:TX62-W-B SAL US Made in China H c FCC ID: QIPTX62-W-B IC: 7830A-TX 11111111 222222 62WB 3 ies pc 5.0 2.0

 

 

WARNING:pdfminer.pdfpage:The PDF <_io.BufferedReader name='/Volumes/Scratch/Incoming/eg-scratch/5490847.pdf'> contains a metadata field indicating that it should not allow text extraction. Ignoring this field and proceeding. Use the check_extractable if you want to raise an error in this case THALES DIS AIS Deutschland GmbH Siemensdamm 50 13629 Berlin Germany Thales DIS AIS Deutschland GmbH Federal Communications Commission Equipment Authorization Division, Application Processing Branch Mills Road 7435 Oakland Columbia MD 21046 USA Siemensdamm 50 13629 Berlin Germany Contact person: Axel Heike E-mail: axel.heike@thalesgroup.com Tel: +49 30 31102-8146 24 September 2021 Request for a Class II Permissive Change Dear Madam or Sir, This is to request a Class II permission change to the following product:

FCC ID Number Product Title/Model TX62-W-B QIPTX62-W-B This request is for the addition of LTE Band 8 operation over the range 897.5-900.5 MHz paired with 936.5- 939.5 MHz as set out in the Review of the Commissions Rules Governing the 896-901/935-

940 MHz Band, WT Docket No. 17-200, and part 27 Subpart P Regulations Governing Licensing and Use of 900 MHz Broadband Service in the 897.5-900.5 MHz and 936.5-939.5 MHz Bands. THALES DIS AIS Deutschland GmbH attests that the inclusion of Band 8 is software change only and that no changes to the transmitter, modulation or filtering circuitry or any circuitry that may adversely affect TX62-W-B device output and EMC compliance has occurred. If you have any questions, please feel free to contact us at the address shown above. Best regards THALES DIS AIS Deutschland GmbH THALES DIS AIS Deutschland GmbH Registered Office: Mnchen - Amtsgericht Mnchen, HRB 172715 WEEE-Reg.-Nr. DE 58893809 Managing Director: Akhan Urgun

 

 

THALES DIS AIS Deutschland GmbH Siemensdamm 50 13629 Berlin Germany Federal Communications Commission Equipment Authorization Division, Application Processing Branch 7435 Oakland Mills Road Columbia MD 21046 USA THALES DIS AIS Deutschland GmbH Siemensdamm 50 13629 Berlin Germany Contact person: Axel Heike E-mail: axel.heike@thalesgroup.com Tel: +49 30 31102-8146 22 March 2021 LONG-TERM CONFIDENTIALITY REQUEST TO WHOM lT MAY CONCERN Pursuant to Paragraphs 0.457 and 0.459 of the Commissions Rules (47 C.F.R.) and Section 552(b)(4) of the Freedom of Information Act, THALES DIS AIS Deutschland GmbH requests confidentiality for the following product:

FCC ID Number Product Title/Model TX62-W-B QIPTX62-W-B For the product stated above, we request that the following information be held confidential:

1. Block Diagram 2. Schematic Diagram 3. Part List / Tune Up Procedure 4. Operational Description These items contain detailed system and equipment description and related information about the product which THALES DIS AIS Deutschland GmbH considers to be proprietary, confidential and a custom design which otherwise would only be released to qualified tech and is not released to the general public. Since this design is a basis from which future technological product will evolve, THALES DIS AIS Deutschland GmbH also feels that this information would be of benefit to its competitors, and that the disclosure of the information in these exhibits would give our competitors an unfair advantage in the market. Sincerely, X HEIKE Axel Certification Project Manager Signed by: HEIKE Axel 22.03.2021 22.03.2021 X Leandro Wan-Dall Head of Certification Management Signed by: WAN-DALL Leandro THALES DIS AIS Deutschland GmbH Registered Office: M nchen - Amtsgericht M nchen, HRB 172715 WEEE-Reg.-Nr. DE 58893809 Managing Director: Andreas Haegele

 

 

THALES DIS AIS Deutschland GmbH Siemensdamm 50 13629 Berlin Germany Federal Communications Commission Equipment Authorization Division, Application Processing Branch 7435 Oakland Mills Road Columbia MD 21046 USA THALES DIS AIS Deutschland GmbH Siemensdamm 50 13629 Berlin Germany Contact person: Axel Heike E-mail: axel.heike@thalesgroup.com Tel: +49 30 31102-8146 22 March 2021 Ref: Agent letter for FCC ID: QIPTX62-W-B We, THALES DIS AIS Deutschland GmbH Siemensdamm 50 13629 Berlin Germany hereby authorize Shenzhen UnionTrust Quality and Technology Co., Ltd. Add: 161F, Block A, Building 6, Baoneng Science and Technology Park, Qingxiang Road No.1, Longhua New District, Shenzhen, China Billy Li Tel: +86-755-28230888 to act as our agent in the preparation of this application for equipment certification, including the signing of all documents relating to these matters. The present authorization considers the development of documents on behalf of the client, written under his own letterhead and related to the necessary information to be provided on his behalf to complete the certification process. We declare that our authorized agent is allowed to forward all information related to the approval and certification of equipment to the regulatory agencies as required and to discuss any issues concerning the approval application. Any and all acts carried out by our authorized agent on our behalf shall have the same effect as acts of our own. This agreement expires one year from the current date. Sincerely, 22.03.2021 22/03/2021 X Axel Heike Certification Project Manager Signed by: HEIKE Axel THALES DIS AIS Deutschland GmbH Registered Office: M nchen - Amtsgericht M nchen, HRB 172715 WEEE-Reg.-Nr. DE 58893809 Managing Director: Andreas Haegele X Leandro Wan-Dall Head of Certification Management Signed by: WAN-DALL Leandro

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

THALES DIS AIS Deutschland GmbH Siemensdamm 50 13629 Berlin Germany Federal Communications Commission Equipment Authorization Division, Application Processing Branch 7435 Oakland Mills Road Columbia MD 21046 USA THALES DIS AIS Deutschland GmbH Siemensdamm 50 13629 Berlin Germany Contact person: Axel Heike E-mail: axel.heike@thalesgroup.com Tel: +49 30 31102-8146 22 March 2021 SHORT-TERM CONFIDENTIALITY REQUEST TO WHOM IT MAY CONCERN Pursuant to Paragraphs 0.457 and 0.459 of the Commissions Rules (47 C.F.R.) and Section 552(b)(4) of the Freedom of Information Act, THALES DIS AIS Deutschland GmbH requests confidentiality for the following product:

FCC ID Number Product Title/Model TX62-W-B QIPTX62-W-B For the product stated above, we request that the following information be held confidential:

1. Test Setup Photos 2. User Manual 3. External and Internal Photographs THALES DIS AIS Deutschland GmbH requests this confidentiality on the basis of ensuring that business sensitive information remains confidential until the actual marketing of our new device, which is planned tor 30th of Aug 2021. If you have any questions, please feel free to contact us at the address shown above. Sincerely, X Axel Heike Certification Project Manager Signed by: HEIKE Axel 22.03.2021 22.03.2021 X Leandro Wan-Dall Head of Certification Management Signed by: WAN-DALL Leandro THALES DIS AIS Deutschland GmbH Registered Office: M nchen - Amtsgericht M nchen, HRB 172715 WEEE-Reg.-Nr. DE 58893809 Managing Director: Andreas Haegele

 

 

THALES DIS AIS Deutschland GmbH Siemensdamm 50 13629 Berlin Germany Federal Communications Commission Equipment Authorization Division, Application Processing Branch 7435 Oakland Mills Road Columbia MD 21046 USA THALES DIS AIS Deutschland GmbH Siemensdamm 50 13629 Berlin Germany Contact person: Axel Heike E-mail: axel.heike@thalesgroup.com Tel: +49 30 31102-8146 22 March 2021 Ref: FCC Modular approval letter for FCC ID: QIPTX62-W-B TO WHOM lT MAY CONCERN The following attestation addresses the requirements to support modular approval pursuant to 15.212 of the Commissions Rules:

Modular approval requirement

(i) The radio elements of the modular transmitter must have their own shielding. The physical crystal and tuning capacitors may be located external to the shielded radio elements.

(ii) The modular transmitter must have buffered modulation/data inputs (if such in-

puts are provided) to ensure that the module will comply with part 15 requirements under conditions of excessive data rates or over-modulation.

(iii) The modular transmitter must have its own power supply regulation.

(iv) The modular transmitter must comply with the antenna and transmission system requirements of 1 5.203, 1 5.204(b) and 15.204(c). The antenna must either be permanently attached or employ a unique antenna coupler (at all connections be-

tween the module and the antenna, including the cable). The professional installa-

tion provision of 1 5.203 is not applicable to modules but can apply to limited mod-

ular approvals under paragraph (b) of this section.

(v) The modular transmitter must be tested in a stand-alone configuration, i.e., the module must not be inside another device during testing for compliance with part 15 requirements. Unless the transmitter module will be battery powered, it must comply with the AC line conducted requirements found in 1 5.207. AC or DC power lines and data input/output lines connected to the module must not contain ferrites, unless they will be marketed with the module (see 15.27(a)). The length of these lines shall be the length typical of actual use or, if that length is unknown, at least 10 cen-

timeters to insure that there is no coupling between the case of the module and sup-

porting equipment. Any accessories, peripherals, or support equipment connected to Yes No*

X X X X X THALES DIS AIS Deutschland GmbH Registered Office: M nchen - Amtsgericht M nchen, HRB 172715 WEEE-Reg.-Nr. DE 58893809 Managing Director: Andreas Haegele the module during testing shall be unmodified and commercially available (see 15.31(i)).

(vi) The modular transmitter must be equipped with either a permanently affixed la-

bel or must be capable of electronically displaying its FCC identification number.

(vii) The modular transmitter must comply with any specific rules or operating re-

quirements that ordinarily apply to a complete transmitter and the manufacturer must provide adequate instructions along with the module to explain any such re-

quirements. A copy of these instructions must be included in the application for equipment authorization.

(viii) The modular transmitter must comply with any applicable RF exposure require-

ments in its final configuration.

* Shall provide a detailed explanation if the answer is No. If you have any questions, please feel free to contact us at the address shown above. X X X Sincerely, X Axel Heike Certification Project Manager Signed by: HEIKE Axel 22.03.2021 22.03.2021 X Leandro Wan-Dall Head of Certification Management Signed by: WAN-DALL Leandro