FCC ID: QIPTN23-W LTE Cat NB1/2 Data-Only Module

 

Cinterion TN23-W Hardware Interface Description Version:

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00.028 TN23-W_HID_v00.028 Cinterion TN23-W Hardware Interface Description Page 2 of 100 2 Document Name: Cinterion TN23-W Hardware Interface Description Version:

00.028 Date:

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Status 2022-07-14 TN23-W_HID_v00.028 Confidential / Preliminary GENERAL NOTE THE USE OF THE PRODUCT INCLUDING THE SOFTWARE AND DOCUMENTATION (THE "PROD-

UCT") IS SUBJECT TO THE RELEASE NOTE PROVIDED TOGETHER WITH PRODUCT. IN ANY EVENT THE PROVISIONS OF THE RELEASE NOTE SHALL PREVAIL. THIS DOCUMENT CONTAINS INFORMATION ON THALES DIS AIS DEUTSCHLAND GMBH (THALES) PRODUCTS. THE SPECIFI-

CATIONS IN THIS DOCUMENT ARE SUBJECT TO CHANGE AT THALES'S DISCRETION. THALES GRANTS A NON-EXCLUSIVE RIGHT TO USE THE PRODUCT. THE RECIPIENT SHALL NOT TRANS-

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TIES. THE RECIPIENT UNDERTAKES FOR AN UNLIMITED PERIOD OF TIME TO OBSERVE SECRECY REGARDING ANY INFORMATION AND DATA PROVIDED TO HIM IN THE CONTEXT OF THE DELIVERY OF THE PRODUCT. THIS GENERAL NOTE SHALL BE GOVERNED AND CON-

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tents and communication thereof to others without express authorization are prohibited. Offenders will be held liable for payment of damages. All rights created by patent grant or registration of a utility model or design patent are reserved. Copyright 2022, THALES DIS AIS Deutschland GmbH Trademark Notice Thales, the Thales logo, are trademarks and service marks of Thales and are registered in certain coun-

tries. Microsoft and Windows are either registered trademarks or trademarks of Microsoft Corporation in the United States and/or other countries. All other registered trademarks or trademarks mentioned in this document are property of their respective owners. t TN23-W_HID_v00.028 Confidential / Preliminary 2022-07-14 Cinterion TN23-W Hardware Interface Description Contents 100 Page 3 of 100 Contents 1 2 3 Introduction ................................................................................................................. 9 Product Variants ................................................................................................ 9 1.1 Key Features at a Glance .................................................................................. 9 1.2 TN23-W System Overview............................................................................... 12 1.3 Circuit Concept ................................................................................................ 13 1.4 Interface Characteristics .......................................................................................... 14 Application Interface ........................................................................................ 14 2.1 Pad Assignment.................................................................................. 14 2.1.1 Signal Properties................................................................................. 18 2.1.2 2.1.2.1 Absolute Maximum Ratings ................................................ 23 Serial Interface ASC0 ......................................................................... 24 2.1.3 2.1.4 Serial Interface ASC1 ......................................................................... 25 2.1.5 UICC/SIM/USIM Interface................................................................... 26 2.1.5.1 Enhanced ESD Protection for SIM Interface ....................... 28 2.1.6 eUICC Interface .................................................................................. 29 2.1.7 GPIO Interface .................................................................................... 31 I2C Interface ........................................................................................ 32 2.1.8 2.1.9 SPI Interface ....................................................................................... 33 2.1.10 Control Signals.................................................................................... 34 2.1.10.1 Status LED .......................................................................... 34 2.1.10.2 Power Indication Circuit ...................................................... 34 2.1.10.3 Fast Shutdown .................................................................... 35 2.1.10.4 SIM Switch .......................................................................... 36 RF Antenna Interface....................................................................................... 37 Antenna Interface Specifications ........................................................ 38 2.2.1 2.2.2 Antenna Installation ............................................................................ 39 2.2.3 RF Line Routing Design...................................................................... 40 2.2.3.1 Line Arrangement Examples ............................................... 40 2.2.3.2 Routing Example................................................................. 45 Sample Application .......................................................................................... 46 Sample Level Conversion Circuit........................................................ 48 2.3.1 2.2 2.3 Operating Characteristics ........................................................................................ 49 Operating Modes ............................................................................................. 49 3.1 Power Up/Power Down Scenarios ................................................................... 50 3.2 Turn on TN23-W ................................................................................. 50 3.2.1 3.2.1.1 Switch on TN23-W Using ON Signal................................... 50 3.2.1.2 Automatic On Timing........................................................... 51 3.2.2 Restart TN23-W .................................................................................. 52 3.2.2.1 Restart TN23-W via AT+CFUN Command .......................... 52 3.2.2.2 Restart TN23-W Using EMERG_RST................................. 52 Signal States after Startup .................................................................. 53 3.2.3 t TN23-W_HID_v00.028 Confidential / Preliminary 2022-07-14 Cinterion TN23-W Hardware Interface Description Contents 100 Page 4 of 100 3.2.5 3.2.4 Turn off TN23-W ................................................................................. 54 3.2.4.1 Switch off TN23-W Using AT Command.............................. 54 Automatic Shutdown ........................................................................... 55 3.2.5.1 Thermal Shutdown .............................................................. 55 3.2.5.2 Undervoltage Shutdown...................................................... 55 3.2.5.3 Overvoltage Shutdown........................................................ 56 Power Saving................................................................................................... 56 Power Supply................................................................................................... 57 3.4.1 Power Supply Ratings......................................................................... 57 3.4.2 Measuring the Supply Voltage (VBATT+) ........................................... 61 Operating Temperatures.................................................................................. 62 Electrostatic Discharge .................................................................................... 63 ESD Protection for RF Antenna Interface ........................................... 63 3.6.1 Blocking against RF on Interface Lines ........................................................... 64 Reliability Characteristics ................................................................................. 66 3.3 3.4 3.5 3.6 3.7 3.8 4 5 Mechanical Dimensions, Mounting and Packaging............................................... 67 Mechanical Dimensions of TN23-W................................................................. 67 4.1 Mounting TN23-W onto the Application Platform ............................................. 69 4.2 SMT PCB Assembly ........................................................................... 69 4.2.1 Land Pattern and Stencil..................................................... 69 4.2.1.1 4.2.1.2 Board Level Characterization.............................................. 71 4.2.2 Moisture Sensitivity Level ................................................................... 71 Soldering Conditions and Temperature .............................................. 72 4.2.3 4.2.3.1 Reflow Profile ...................................................................... 72 4.2.3.2 Maximum Temperature and Duration .................................. 73 4.2.4 Durability and Mechanical Handling.................................................... 74 4.2.4.1 Storage Conditions.............................................................. 74 4.2.4.2 Processing Life.................................................................... 75 4.2.4.3 Baking ................................................................................. 75 4.2.4.4 Electrostatic Discharge ....................................................... 75 Packaging ........................................................................................................ 76 Tape and Reel .................................................................................... 76 4.3.1 4.3.1.1 Orientation........................................................................... 76 4.3.1.2 Barcode Label ..................................................................... 77 Shipping Materials .............................................................................. 79 4.3.2.1 Moisture Barrier Bag ........................................................... 79 4.3.2.2 Transportation Box .............................................................. 82 Trays ................................................................................................... 83 4.3.2 4.3.3 4.3 Regulatory and Type Approval Information ........................................................... 84 Directives and Standards................................................................................. 84 5.1 5.1.1 IEC 62368-1 Classification.................................................................. 85 SAR requirements specific to portable mobiles ............................................... 87 Reference Equipment for Type Approval ......................................................... 88 Compliance with FCC Rules and Regulations ................................................. 89 5.2 5.3 5.4 t TN23-W_HID_v00.028 Confidential / Preliminary 2022-07-14 Cinterion TN23-W Hardware Interface Description Contents 100 Page 5 of 100 6 7 Document Information.............................................................................................. 91 Revision History ............................................................................................... 91 6.1 Related Documents ......................................................................................... 92 6.2 Terms and Abbreviations ................................................................................. 92 6.3 Safety Precaution Notes .................................................................................. 96 6.4 Appendix.................................................................................................................... 97 List of Parts and Accessories........................................................................... 97 7.1 Module Label Information ................................................................................ 99 7.2 t TN23-W_HID_v00.028 Confidential / Preliminary 2022-07-14 Cinterion TN23-W Hardware Interface Description Tables 100 Page 6 of 100 Tables Table 1:

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Overview: Pad assignments common to TN23-W ........................................ 15 Signal properties ............................................................................................ 18 Absolute maximum ratings............................................................................. 23 Signals of the SIM interface (SMT application interface) ............................... 26 Signals of the eUICC interface option (SMT application interface) ................ 29 GPIO lines and alternative assignments ........................................................ 31 Return loss in the active band........................................................................ 37 RF Antenna Interface LTE NB1/2 .................................................................. 38 Overview of operating modes ........................................................................ 49 Signal states................................................................................................... 53 Voltage supply ratings TN23-W ..................................................................... 57 Current consumption ratings TN23-W............................................................ 58 Board temperature ......................................................................................... 62 Ambient temperature...................................................................................... 62 Electrostatic values ........................................................................................ 63 EMI measures on the application interface (TBD.) ........................................ 65 Summary of reliability test conditions............................................................. 66 Reflow temperature ratings ............................................................................ 72 Storage conditions ......................................................................................... 74 VP Box label information................................................................................ 82 Directives ....................................................................................................... 84 Standards of North American type approval .................................................. 84 Standards of European type approval............................................................ 84 Requirements of quality ................................................................................. 85 IEC 62368-1 Classification............................................................................. 86 Antenna gain limits for FCC for TN23-W........................................................ 89 List of parts and accessories.......................................................................... 97 Molex sales contacts (subject to change) ...................................................... 98 TN23-W label information .............................................................................. 99 Date code table .............................................................................................. 99 t TN23-W_HID_v00.028 Confidential / Preliminary 2022-07-14 Cinterion TN23-W Hardware Interface Description Figures 100 Page 7 of 100 Figures Figure 1:

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TN23-W system overview .............................................................................. 12 TN23-W block diagram .................................................................................. 13 TN23-W top view: Pad assignments .............................................................. 16 TN23-W bottom view: Pad assignments ........................................................ 17 Serial interface ASC0..................................................................................... 24 ASC0 startup behavior ................................................................................... 24 Serial interface ASC1..................................................................................... 25 ASC1 startup behavior ................................................................................... 25 External UICC/SIM/USIM card holder circuit ................................................. 27 SIM interface - enhanced ESD protection...................................................... 28 eUICC interface with switch for external SIM................................................. 29 eUICC interface without SIM switch............................................................... 30 I2C interface connected to V180 .................................................................... 32 Characteristics of SPI modes......................................................................... 33 Status signaling with LED driver .................................................................... 34 Power indication circuit .................................................................................. 35 Fast shutdown timing ..................................................................................... 35 SIM switch circuit ........................................................................................... 36 Antenna pads (top view) ................................................................................ 39 Embedded Stripline with 65m prepreg (1080) and 710m core .................. 40 Micro-Stripline on 1.0mm Standard FR4 2-layer PCB - example 1................ 41 Micro-Stripline on 1.0mm Standard FR4 2-layer PCB - example 2................ 42 Micro-Stripline on 1.5mm Standard FR4 2-layer PCB - example 1................ 43 Micro-Stripline on 1.5mm Standard FR4 2-layer PCB - example 2................ 44 Routing to applications RF connector - top view ........................................... 45 Schematic diagram of TN23-W sample application ....................................... 47 Sample level conversion circuit...................................................................... 48 Sample ON circuit .......................................................................................... 50 ON startup timing ........................................................................................... 51 ON startup timing (automatic) ........................................................................ 51 Emergency restart timing ............................................................................... 52 Switch off behavior......................................................................................... 54 Position of reference points BATT+ and GND ............................................... 61 ESD protection for RF antenna interface ....................................................... 63 EMI circuits..................................................................................................... 64 TN23-W top and bottom view....................................................................... 67 Dimensions of TN23-W (all dimensions in mm) ............................................. 68 Dimensions of area for possible markings TN23-W (bottom view) ................ 68 Land pattern TN23-W (top view) .................................................................... 69 Recommended design for 110m thick stencil for TN23-W (top view) .......... 70 Reflow Profile ................................................................................................. 72 Carrier tape .................................................................................................... 76 Reel direction ................................................................................................. 77 Barcode label on tape reel (generic photo) .................................................... 77 Barcode label on tape reel - layout ................................................................ 78 Moisture barrier bag (MBB) with imprint......................................................... 79 Moisture Sensitivity Label .............................................................................. 80 t TN23-W_HID_v00.028 Confidential / Preliminary 2022-07-14 Cinterion TN23-W Hardware Interface Description Figures 100 Page 8 of 100 Figure 48:

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Humidity Indicator Card - HIC ........................................................................ 81 Sample of VP box label.................................................................................. 82 Tray to ship odd module amounts.................................................................. 83 Reference equipment for type approval ......................................................... 88 TN23-W label ................................................................................................. 99 t TN23-W_HID_v00.028 Confidential / Preliminary 2022-07-14 Cinterion TN23-W Hardware Interface Description 1 Introduction 13 Page 9 of 100 1 Introduction This document1 describes the hardware of the Cinterion TN23-W module optimized for global coverage as they support a comprehensive set of bands required for global deployment. It helps you quickly retrieve interface specifications, electrical and mechanical details and infor-

mation on the requirements to be considered for integrating further components. Note: This Hardware Interface Description is an early draft version and as such subject to change depending on further implementation and measurements. 1.1 Product Variants This document applies to the following Thales module variant:

Cinterion TN23-W 1.2 Key Features at a Glance Feature General Frequency bands

(see Section 2.2.1) Implementation LTE Cat NB1/2:

700 (Bd12, Bd13, Bd17, Bd28, Bd85), 800 (Bd18, Bd19, Bd20, Bd26), 850 (Bd5), 900 (Bd8), AWS-3 (Bd66), AWS-1 (Bd4), 1800 (Bd3), 1900

(Bd2, Bd25), 2100 (Bd1) Note: For each frequency band TN23-Ws firmware locks the channel clos-

est to the edge of the frequency band in order to meet the standard require-

ments of different countries and regions. The provided modules will thus not support the channel closest to the edge of each band. The available fre-

quency ranges have been tested and verified to meet the standard require-

ments of the corresponding countries and regions. Output power (according to 3GPP Release 13) LTE Cat NB1/2:

Class 3 (+23dBm 2dB) for all supported LTE Cat NB1/2 bands Power supply

(see Section 2.1.2 and Section 3.4) Operating temperature

(board temperature)

(see Section 3.5) Physical

(see Section 4.1) RoHS

(see Section 5.1) Normal range: 3.0V to 4.5V Extended range: 2.8V to 4.5V Normal range: -30C to +85C Extended range: -40C to +85C Dimensions: 15.3 mm x 15.3 mm x 2.9 mm Weight: 1.0g All hardware components fully compliant with EU RoHS Directive 1. The document is effective only if listed in the appropriate Release Notes as part of the technical docu-

mentation delivered with your Thales product. t TN23-W_HID_v00.028 Confidential / Preliminary 2022-07-14 Cinterion TN23-W Hardware Interface Description 1.2 Key Features at a Glance 13 Page 10 of 100 Feature LTE features 3GPP Release 14 SMS Software AT commands Embedded processing platform (optional) Firmware update Interfaces Module interface 2 serial interfaces

(see Section 2.1.3 and Section 2.1.4) Implementation LTE Cat NB1 (HD-FDD) DL: max. 27.2kbps, UL: max. 62.5kbps LTE Cat NB2 (HD-FDD) DL: max. 127kbps, UL: max. 158kbps SMS over NAS Hayes 3GPP TS 27.007, TS 27.005, Thales AT commands Embedded processing option with API. Memory space available for embedded applications is TBD.KB for applica-

tion code, TBD.KB min for File System and TBD.KB min for RAM. Please take into account that the application code is copied into RAM. For more details, please consult software documentation. SWUP and IoT Suite based FOTA. Incremental FW upgrade and full FW update. Updatable bootloader. Optimized FOTA package size. Surface mount device with solderable connection pads (SMT application interface). Land grid array (LGA) technology ensures high solder joint reli-

ability and allows the use of an optional module mounting socket. For more information on how to integrate SMT modules see also [4]. This application note comprises chapters on mounting and application layout issues as well as on additional SMT application development equipment. ASC0:

ASC1:

8-wire modem interface with status and control lines, unbalanced, asyn-

chronous Adjustable baud rates: 300bps to 921,600bps Supports RTS0/CTS0 hardware flow control (as configuration option). 4-wire, unbalanced asynchronous modem interface Adjustable baud rates: 300bps to 921,600bps Supports RTS1/CTS1 hardware flow control (as configuration option). UICC interface

(see Section 2.1.5) eUICC interface

(see Section 2.1.6 Status

(see Section 2.1.10.1) Fast shutdown

(see Section 2.1.10.3) Supported SIM/USIM cards: 1.8V Supports embedded MFF-XS UICC interface (as an option). Supports status indication LED. Supports fast shutdown interrupt signal. ADC Input Analog-to-Digital Converter with one unbalanced analog inputs t TN23-W_HID_v00.028 Confidential / Preliminary 2022-07-14 Cinterion TN23-W Hardware Interface Description 1.2 Key Features at a Glance 13 Page 11 of 100 Feature Implementation SIM switch

(see Section 2.1.10.4) GPIO interface

(see Section 2.1.7) I2C interface

(see Section 2.1.8) SPI interface

(see Section 2.1.9) Antenna interface pads

(see Section 2.2) Power on/off, Reset Power on/off Reset Special features Supports signal to switch between two externally connected SIMs. With the embedded processing option 3 pads are programmable as GPIOs. I2C interface only available with embedded processing option. SPI interface only available with embedded processing option. 50. LTE main antenna Switch-on / Wakeup by hardware signal ON Automatic power on after connecting module to the power supply. Switch-off by AT command and hardware signal FST_SHDN Automatic switch-off in case of critical voltage conditions Orderly shutdown and reset by AT command Emergency reset by hardware signal EMERG_RST Phonebook SIM and phone Evaluation kit (For ordering information see Section 7.1) LGA DevKit Evaluation module DSB75 LGA DevKit designed to test Thales LGA modules. For more information see also LGA DevKit. TN23-W module soldered onto a dedicated PCB that can be connected to the an approval adapter in order to be mounted onto the DSB75 or DSB-Mini. DSB75 Development Support Board designed to test and type approve Thales modules and provide a sample configuration for application engi-

neering. A special adapter is required to connect the TN23-W evaluation module to the DSB75. t TN23-W_HID_v00.028 Confidential / Preliminary 2022-07-14 Cinterion TN23-W Hardware Interface Description 1.3 TN23-W System Overview 13 1.3 TN23-W System Overview Page 12 of 100 Module ASC0 lines ASC1 lines STATUS FST_SHDN Application Serial modem interface lines Serial modem interface lines Status LED Fast shutdown SIM_SWITCH SIM switch SIM interface eUICC interface

(MFF-XS UICC) CONTROL SIM card eUICC (option) ON Emergency reset ADC ADC1 POWER ANTENNA Power supply LTE antenna Figure 1: TN23-W system overview Please note that with the embedded processing option some ASC0/ASC1 lines as well as the STATUS, FST_SHDN, and SIM_SWITCH lines are programmable as GPIOs, I2C or SPI inter-

face lines. For details see Section 2.1, and Section 2.1.7. t TN23-W_HID_v00.028 Confidential / Preliminary 2022-07-14 Cinterion TN23-W Hardware Interface Description 1.4 Circuit Concept 13 Page 13 of 100 1.4 Circuit Concept The figure below shows block diagrams for the TN23-W module variants, and illustrate the ma-

jor functional components:

V180 HWIDs NOR Flash s d a P A G L a n n e t n A LTE MB LPF VBAT_FEM RF part LTE PA TX_OUT_LB_LTE LB LP F TX_OUT_MB_LTE 8 3 4 GPIOs 4 VFlash RF_CTRL 3 RF_PD_IN TX_LB_LTE TX_MB_LTE CatNB1/NB2/GPRS Baseband Controller with integrated PMU and tranceiver RX_MB RX_LB MB BALUN LB BALUN LB LPF RF_CTRL 2 z H M 6 2 z H k 8 6 7

. 2 3 26MHz 32.768KHz TCXO X-tal V D D _ R F BATT+

eUICC

(MFF-XS) 5 VBAT_FEM Load Switch VO UT ON VIN Figure 2: TN23-W block diagram LGA Pads Serial (ASC0) STATUS USIM Serial (ASC1) FAST_SHDN SIM_SWITCH ADC EMERG_RST ON V180 VFlash CCVCC VBAT_FEM BATT+

eUICC (optional) BATT+_RF Please note that with the embedded processing option some ASC0/ASC1 lines as well as the STATUS, FST_SHDN, and SIM_SWITCH lines are programmable as GPIOs, I2C or SPI inter-

face lines. For details see Section 2.1, and Section 2.1.7. t TN23-W_HID_v00.028 Confidential / Preliminary 2022-07-14 Cinterion TN23-W Hardware Interface Description 2 Interface Characteristics 48 2 Interface Characteristics Page 14 of 100 TN23-W is equipped with an SMT application interface that connects to the external applica-

tion. The SMT application interface incorporates the various application interfaces as well as the RF antenna interface. 2.1 Application Interface 2.1.1 Pad Assignment The SMT application interface on the TN23-W provides connecting pads to integrate the mod-

ule into external applications. As a rule all pads should be soldered for mechanical stability and heat dissipation. Signal pads that are not used, i.e., marked as rfu, need to be soldered, but should not have an electrical connection to the external application or GND. Also, pads mentioned in squared brackets (I2CDAT and I2CCLK pads, SPI pads as well as shared GPIO pads) are available with the embedded processing option only. Please note that the reference voltages listed in Table 2 are the values measured directly on the TN23-W module. They do not apply to the accessories connected. Note: Thales strongly recommends to provide test points for certain signal lines to and from the module while developing SMT applications for debug, test and/or trace purposes during the manufacturing process. In this way it is possible to detect soldering (and other) problems. Please refer to [4] and [5] for more information on test points and how to implement them. The signal lines for which test points should be provided for are marked as Test point recommend-

ed in Table 2. t TN23-W_HID_v00.028 Confidential / Preliminary 2022-07-14 Cinterion TN23-W Hardware Interface Description 2.1 Application Interface 48 Table 1: Overview: Pad assignments common to TN23-W1 2 Pad no. Signal name GND GND rfu GND GND RF_OUT GND GND rfu GND Pad no. E12 E13 E14 E15 E16 E17 F7 F8 F9 Signal name rfu rfu GND EMERG_RST VFLASH VBAT_FEM GND rfu rfu F10 GND GND rfu SIM_SWITCH [GPIO8] F13 F11 F12 GND GND GND GND GND GND GND GND rfu rfu rfu rfu GND GND GND GND GND ON rfu rfu rfu rfu rfu GND rfu F14 F15 F16 F17 G7 G8 G9 G10 G14 G15 G16 G17 H7 H8 H9 H10 H14 H15 H16 H17 J7 J8 J9 J10 J14 rfu rfu rfu GND ADC1 rfu GND rfu rfu rfu GND GND BATT+RF BATT+RF rfu rfu rfu RTS13 [I2CDAT]

CTS14 [I2CCLK]

GND BATT+BB BATT+BB rfu rfu rfu RXD1 GND rfu B7 B8 B9 B10 B11 B12 B13 B14 B15 B16 B17 C7 C8 C9 C10 C11 C12 C13 C14 C15 C16 C17 D7 D8 D9 D10 D11 D12 D13 D14 D15 D16 D17 E7 E8 E9 E10 E11 Page 15 of 100 Pad no. Signal name J15 J16 J17 K7 K8 K9 K10 K11 K12 K13 K14 K15 K16 K17 L7 L8 L9 L10 L11 L12 L13 L14 L15 L16 L17 M7 M8 M9 M10 M11 M12 M13 M14 M15 M16 M17 V180 GND CC2_VPP rfu rfu STATUS [GPIO5]

FST_SHDN [GPIO4]

rfu RING0 [SPI_CS]

DTR0 [MISO]

DCD0 [SPI_CLK]

CCCLK rfu CC2_CLK rfu TXD1 rfu rfu DSR0 [MOSI]

RTS0 CTS0 CCVCC CCRST CC2_VCC CC2_RST GND GND rfu rfu GND RXD0 TXD0 CCIO rfu CC2_IO GND 1. rfu = reserved for future use, i.e., currently not supported. 2. Pads mentioned in squared brackets (I2CDAT and I2CCLK pads, SPI pads as well as shared GPIO pads) are available with the embedded processing option only. 3. For engineering samples (A1.1) only: H9 is rfu, and K8: RTS1 [I2CDAT]. 4. For engineering samples (A1.1) only: H10 is rfu, and J8 is CTS1 [I2CCLK]. t TN23-W_HID_v00.028 Confidential / Preliminary 2022-07-14 Cinterion TN23-W Hardware Interface Description 2.1 Application Interface 48 Page 16 of 100 8 7 GND GND M L K J H G F E D C B 17 16 15 14 13 12 11 GND CC2_IO rfu CCIO TXD0 RXD0 GND CC2_RST CC2_VCC CCRST CCVCC CTS0 RST0 DSR0 10 rfu rfu 9 rfu rfu CC2_CLK rfu CCCLK DCD0 DTR0 RING0 rfu FST_SHDN STATUS/

rfu CC2_VPP GND V180 rfu rfu BATT+BB BATT+BB GND Reserved for future use GND RXD1 rfu CTS1 RTS1 rfu BATT+RF BATT+RF GND Marking GND rfu GND rfu ADC1 GND rfu VBAT_F EM VFLASH EMERG_ RST GND rfu rfu rfu rfu GND rfu rfu GND rfu rfu GND rfu rfu ON GND GND GND GND GND rfu rfu GND GND GND GND GND GND GND GND GND GND rfu GND GND RF_OUT GND GND rfu GND GND Figure 3: TN23-W top view: Pad assignments TXD1 rfu rfu rfu rfu rfu rfu rfu rfu rfu SIM_ SWITCH rfu rfu rfu t TN23-W_HID_v00.028 Confidential / Preliminary 2022-07-14 Cinterion TN23-W Hardware Interface Description 2.1 Application Interface 48 Page 17 of 100 7 8 M GND GND rfu TXD1 9 rfu rfu 10 rfu 11 12 13 14 15 16 17 GND RXD0 TXD0 CCIO rfu CC2_IO GND rfu DSR0 RST0 CTS0 CCVCC CCRST CC2_VCC CC2_RST rfu rfu rfu rfu rfu STATUS/

FST_SHDN rfu RING0 DTR0 DCD0 CCCLK rfu CC2_CLK rfu rfu rfu RXD1 GND RTS1 CTS1 Reserved for future use rfu V180 GND CC2_VPP GND BATT+BB BATT+BB rfu rfu GND Marking GND BATT+RF BATT+RF rfu GND rfu rfu GND rfu rfu GND rfu rfu rfu rfu GND ADC1 rfu GND rfu GND EMERG_ RST VFLASH VBAT_F EM rfu GND GND GND GND GND ON rfu rfu GND GND GND GND GND GND GND GND rfu rfu rfu rfu rfu rfu SIM_ SWITCH GND GND rfu GND GND RF_OUT GND GND rfu GND GND Figure 4: TN23-W bottom view: Pad assignments L K J H G F E D C B t TN23-W_HID_v00.028 Confidential / Preliminary 2022-07-14 Cinterion TN23-W Hardware Interface Description 2.1 Application Interface 48 Page 18 of 100 2.1.2 Signal Properties Table 2: Signal properties Function Signal name IO Signal form and level Comment Power supply BATT+BB BATT+RF I Voltage ranges:

VImax = 4.5V VInom = 3.8V VImin = 3.0V Slew rate < 25mV/s Power supply GND Ground Lines of BATT+ and GND must be connected in parallel for supply pur-

poses because higher peak currents may occur. For TN23-W minimum voltage must not fall below 3.0V (LTE) includ-

ing drop, ripple, spikes. BATT+BB and BATT+RF require an ultra-low ESR capacitor:

BATT+BB --> 47F BATT+RF --> 150F If using Multilayer Ceramic Chip Capacitors

(MLCC) please take DCbias into account. Note that minimum ESR value is advised at

<70m. BATT+BB must be dis-

charged below 0.3V to assure a safe power up. Please note that the TN23-W lower voltage range can be extended to 2.8V, remaining fully functional and safe while no longer being fully com-

pliant with 3GPP or other wireless standards. Please note that if both voltage domains and power supply lines are referred to - i.e., BATT+BB and BATT+RF

- BATT+ is used through-

out the document. Application Ground t TN23-W_HID_v00.028 Confidential / Preliminary 2022-07-14 Cinterion TN23-W Hardware Interface Description 2.1 Application Interface 48 Page 19 of 100 Table 2: Signal properties Function Signal name IO Signal form and level Comment External supply voltage V180 O Normal Operation:

VOnorm = 1.80V 3%

IOmax = 10mA Sleep Mode Operation:

VOsleep = 1.80V 3%

IOmax = 1mA Suspend Mode Operation:

VOsuspend = 0V Clmax = 1F V180 can be used to supply level shifter at the interfaces. V180 can be used for the power indication circuit. VFLASH O Normal Operation:

Test point recommended. VOnom = 1.80V 3%

IOmax = 10mA Sleep Mode Operation:

VOsleep = TBD. IOmax = 1mA Suspend Mode Operation:

VOsuspend = 0V Clmax = 100nF VIHmax=VBATT VIHmin = 2.8V VILmax = 0.6V High level pulse width > 100s ON ___|~~~~~~~~~~~~|___ Ignition ON I Status sig-

naling STATUS O VOLmax = 0.2*V180 VOHmin = 0.8*V180 VOHmax = 1.9V Fast shut-

down FST_SHDN I VILmax = 0.3*V180 VIHmin = 0.7*V180 VIHmax = 1.9V This signal switches the module on. The ON signal is high level sensitive triggered. Note: For engineering samples (A1.1), the maxi-

mum allowed input volt-

age level is 1.8V. The module might get dam-

aged if VBATT is used. If unused keep pin open. With the embedded pro-

cessing option this line is also available as GPIO:

STATUS --> GPIO5 If unused keep pin open. With the embedded pro-

cessing option this line is also available as GPIO:

STATUS --> GPIO4 t TN23-W_HID_v00.028 Confidential / Preliminary 2022-07-14 Cinterion TN23-W Hardware Interface Description 2.1 Application Interface 48 Page 20 of 100 Table 2: Signal properties Function Signal name IO Signal form and level Comment Emergency reset EMERG_RST I Internal pull up resistor is 620K VOHmax = 1.8V VIHmin = 1.3V VILmax = 0.3V

~~~~|___|~~~~ low impulse width > 100s Serial Modem Interface ASC0 Serial Modem Interface ASC1 RXD0 CTS0 DSR0 DCD0 RING0 TXD0 RTS0 DTR0 RXD1 CTS1 TXD1 RTS1 CCVCC 1.8V SIM Card Inter-

face CCRST CCCLK CCIO O VOLmax = 0.2*V180 VOHmin = 0.8*V180 VOHmax = 1.9V O O O O I I I VILmax = 0.3*V180 VIHmin = 0.7*V180 VIHmax = 1.9V O VOLmax = 0.2*V180 VOHmin = 0.8*V180 VOHmax = 1.9V O I I VILmax = 0.3*V180 VIHmin = 0.7*V180 VIHmax = 1.9V O VOmin = 1.5V VOtyp = 1.8V VOmax = 2V IOmax = -60mA O O VOLmax = 0.2*V180 VOHmin = 0.8*V180 VOHmax = 1.9V I/O VOLmax = 0.2*V180 VOHmin = 0.8*V180 VOHmax = 1.9V VILmax = 0.3*V180 VIHmin = 0.7*V180 VIHmax = 1.9V This line must be driven low by an open drain or open collector driver con-

nected to GND. If unused keep pin open. If unused keep pin open. With the embedded pro-

cessing option ASC0 lines are also available as SPI lines. See also Sec-

tion 2.1.9. If unused keep pin open. With the embedded pro-

cessing option ASC1 lines are also available as I2C lines. See also Sec-

tion 2.1.8. Maximum cable length or copper track to SIM card holder should not exceed 100mm. The signals CCRST, CCIO, CCCLK and CCVCC are protected against ESD with a spe-

cial diode array. t TN23-W_HID_v00.028 Confidential / Preliminary 2022-07-14 Cinterion TN23-W Hardware Interface Description 2.1 Application Interface 48 Page 21 of 100 Table 2: Signal properties Function Signal name IO Signal form and level Comment SWP NFC is currently not supported and deacti-

vated for the eUICC. Thus, there are two options:

If an external SWP mas-

ter is connected never-

theless (or for future use) the CC2_VPP line should be pulled up by an exter-

nal 10k resistor to VCC. If there is no plan to use SWP the CC2_VPP line can be grounded. Maximum cable length or copper track should be no longer as 100mm to eUICC interface. The signals CC2_RST, CC2_IO, CC2_CLK and CC2_VCC are protected against ESD with a spe-

cial diode array. If unused keep pin open. 1.8V MIM interface CC2_VPP

Used for single wire protocol (SWP NFC) in MFF-XS eUICC. CC2_VCC CC2_CLK CC2_RST I I I VImin = 1.62V VItyp = 1.8V VImax = 1.98V VILmax = 0.2*CC2_VCC at IOLmax = -20A VILmin = -0.3V at IOLmax = -20A VIHmax=CC2_VCC+0.3V at IOHmax =+20A VIHmin = 0.7*CC2_VCC at IOH max=+20A VILmax = 0.2*CC2_VCC at IOL max = -200A VILmin = -0.3V at IOL max = -200A VIHmax=CC2_VCC+0.3V at IOHmax =+20A VIHmin = 0.8*CC2_VCC at IOH max=+20A CC2_IO I/O VILmax = 0.2*CC2_VCC at IIH = +1mA/+20 A VILmin = -0.3V at IIH = +1mA/+20 A VIHmin = 0.7*CC2_VCC at IIH = -20/+20 A VIHmax = CC2_VCC+0.3V at IIH = -20/+20 A VOLmax =0.15*CC2_VCC at IOL=-1mA VOHmin = 0.7*CC2_VCC at IIH = -20/+20 A VOHmax = CC2_VCC+0.3V at IIH = -20/+20 A t TN23-W_HID_v00.028 Confidential / Preliminary 2022-07-14 Cinterion TN23-W Hardware Interface Description 2.1 Application Interface 48 Page 22 of 100 Table 2: Signal properties Function Signal name IO Signal form and level Comment SIM switch SIM_SWITCH O VOLmax = 0.2*V180 VOHmin = 0.8*V180 VOHmax = 1.9V I2C I2CCLK I2CDAT O TBD. IO SPI SPI_CLK O TBD. SPI_MOSI SPI_MISO SPI_CS O I O GPIO4 GPIO5 GPIO8 ADC1 GPIO interface ADC

(Analog-to-

Digital Con-

verter) IO TBD. IO IO I RI = 0.5Kohm,C I=2.6pF VI = 0.1V 1.8V (valid range) Resolution: 12bit max If unused keep lines open. With the embedded pro-

cessing option this line is also available as GPIO:

STATUS --> GPIO8 Only available with the embedded processing option. See also Section 2.1.8. If unused keep lines open. Only available with the embedded processing option. See also Section 2.1.9. If unused keep lines open. Only available with the embedded processing option. See also Section 2.1.7. If unused keep lines open. If unused keep pin open. t TN23-W_HID_v00.028 Confidential / Preliminary 2022-07-14 Cinterion TN23-W Hardware Interface Description 2.1 Application Interface 48 2.1.2.1 Absolute Maximum Ratings Page 23 of 100 The absolute maximum ratings stated in Table 3 are stress ratings under any conditions. Stresses beyond any of these limits will cause permanent damage to TN23-W. Table 3: Absolute maximum ratings Parameter Supply voltage BATT+BB (no service) Voltage at all digital pins in POWER DOWN mode Voltage at digital pins 1.8V domain in normal operation Current at digital pins in normal operation (totally for all IOs) Voltage at SIM interface, CCVCC 1.8V in normal Operation Current at SIM interface in 1.8V operation Voltage at ADC pin in normal operation V180 in normal operation Current at V180 in normal operation VFLASH in normal operation Current at VFLASH in normal operation Min

-0.2 0

-0.2

1.5

0 1.5

1.5

Max

+4.5 0 Unit V V V180+0.2 V

-50 2.12

-50 1.8 2.12

-50 2.12

-50 mA V mA V V mA V mA t TN23-W_HID_v00.028 Confidential / Preliminary 2022-07-14 Cinterion TN23-W Hardware Interface Description 2.1 Application Interface 48 2.1.3 Serial Interface ASC0 Page 24 of 100 TN23-W offers an 8-wire unbalanced, asynchronous modem interface ASC0 conforming to ITU-T V.24 protocol DCE signaling. The electrical characteristics do not comply with ITU-T V.28. The significant levels are 0V (for low data bit or active state) and 1.8V (for high data bit or inactive state). For electrical characteristics please refer to Table 2. For an illustration of the interface lines startup behavior see Figure 6. TN23-W is designed for use as a DCE. Based on the conventions for DCE-DTE connections it communicates with the customer application (DTE) using the following signals:

Port TXD @ application sends data to the modules TXD0 signal line Port RXD @ application receives data from the modules RXD0 signal line Figure 5: Serial interface ASC0 Features:

Includes the data lines TXD0 and RXD0, the status lines RTS0 and CTS0 and, in addition, the modem control lines DTR0, DSR0, DCD0 and RING0. The RING0 signal serves to indicate incoming calls and other types of URCs (Unsolicited Result Code). It can also be used to send pulses to the host application, for example to wake up the application from power saving state. By default configured to 8 data bits, no parity and 1 stop bit. ASC0 can be operated at fixed bit rates from 300bps up to 921,600bps. Supports RTS0/CTS0 hardware flow control as a configuration option (see [1]). Although hardware flow control is recommended, this allows communication by using only RXD and TXD lines. The following figure shows the startup behavior of the asynchronous serial interface ASC0. TBD. Dotted lines indicate possible alternative signal states - depending on externally provided signal states. For pull-up and pull-down values see Table 10. Figure 6: ASC0 startup behavior t TN23-W_HID_v00.028 Confidential / Preliminary 2022-07-14 Cinterion TN23-W Hardware Interface Description 2.1 Application Interface 48 2.1.4 Serial Interface ASC1 Page 25 of 100 TN23-W provides a 4-wire unbalanced, asynchronous modem interface ASC1 conforming to ITU-T V.24 protocol DCE signaling. The electrical characteristics do not comply with ITU-T V.28. The significant levels are 0V (for low data bit or active state) and 1.8V (for high data bit or inactive state). For electrical characteristics please refer to Table 2. For an illustration of the interface lines startup behavior see Figure 8. TN23-W is designed for use as a DCE. Based on the conventions for DCE-DTE connections it communicates with the customer application (DTE) using the following signals:

Port TXD @ application sends data to modules TXD1 signal line Port RXD @ application receives data from the modules RXD1 signal line Figure 7: Serial interface ASC1 Features Includes only the data lines TXD1 and RXD1 plus RTS1 and CTS1 for hardware hand-

shake. Configured for 8 data bits, no parity and 1 or 2 stop bits. ASC1 can be operated at fixed bit rates from 300bps to 921,600bps. Supports RTS1/CTS1 hardware flow as a configuration option (see [1]). Although hardware flow control is recommended, this allows communication by using only RXD and TXD lines. The following figure shows the startup behavior of the asynchronous serial interface ASC1. TBD. Figure 8: ASC1 startup behavior t TN23-W_HID_v00.028 Confidential / Preliminary 2022-07-14 Cinterion TN23-W Hardware Interface Description 2.1 Application Interface 48 2.1.5 UICC/SIM/USIM Interface Page 26 of 100 TN23-W has an integrated UICC/SIM/USIM interface compatible with the 3GPP 31.102 and ETSI 102 221. This is wired to the host interface in order to be connected to an external SIM card holder. Four pads on the SMT application interface are reserved for the SIM interface. The UICC/SIM/USIM interface supports 1.8V SIM cards. Please refer to Table 2 for electrical specifications of the UICC/SIM/USIM interface lines. Table 4: Signals of the SIM interface (SMT application interface) Signal Description GND Separate ground connection for SIM card to improve EMC. Thales recommends to use pad J16 or pad M17 as ground connection. CCCLK UICC clock CCVCC SIM supply voltage. CCIO Serial data line, input and output. CCRST UICC reset Note: No guarantee can be given, nor any liability accepted, if loss of data is encountered after removing the SIM card during operation. Also, no guarantee can be given for properly initializ-

ing any SIM card that the user inserts after having removed the SIM card during operation. In this case, the application must restart TN23-W. t TN23-W_HID_v00.028 Confidential / Preliminary 2022-07-14 Cinterion TN23-W Hardware Interface Description 2.1 Application Interface 48 Page 27 of 100 The figure below shows a circuit to connect an external SIM card holder. CCVCC CCRST CCIO CCCLK SIM 220nF2 1nF2 10pF1 ,2 10pF1,2 1 = Optional 10pF for SIM protection for RF blocking (internal antenna) 2 = Capacitors should be placed near to the SIM connector or eUICC Figure 9: External UICC/SIM/USIM card holder circuit The total cable length between the SMT application interface pads on TN23-W and the pads of the external SIM card holder must not exceed 100mm in order to meet the specifications of 3GPP TS 51.010-1 and to satisfy the requirements of EMC compliance. To avoid possible cross-talk from the CCCLK signal to the CCIO signal be careful that both lines are not placed closely next to each other. A useful approach is using a GND line to shield the CCIO line from the CCCLK line. An example for an optimized ESD protection for the SIM interface is shown in Section 2.1.5.1. It is possible to connect the UICC/USIM/SIM interface lines to an external SIM card multiplexer controlled by the modules SIM_SWITCH signal. Thus, it becomes possible to switch between two networks/subscriptions each with its own UICC, and maybe different connection speeds. See also Section 2.1.10.4. t TN23-W_HID_v00.028 Confidential / Preliminary 2022-07-14 Cinterion TN23-W Hardware Interface Description 2.1 Application Interface 48 Page 28 of 100 2.1.5.1 Enhanced ESD Protection for SIM Interface To optimize ESD protection for the SIM interface it is possible to add ESD diodes (e.g., NUP4114) to the SIM interface lines as shown in the example given in Figure 10. The example was designed to meet ESD protection according ETSI EN 301 489-1/7: Contact discharge: 4kV, air discharge: 8kV. Module CCRST CCCLK CCIO SIM_RST SIM_CLK SIM_IO 6 5 4 CCVCC SIM_VCC 1 2 3 GND Keep SIM lines low capacitative Figure 10: SIM interface - enhanced ESD protection The capacitors shown in Figure 9 must be placed close to the SIM Connector. t TN23-W_HID_v00.028 Confidential / Preliminary 2022-07-14 Cinterion TN23-W Hardware Interface Description 2.1 Application Interface 48 Page 29 of 100 2.1.6 eUICC Interface As an option TN23-W supports an eUICC in MFF-XS format. This MFF-XS eUICC is located under the shielding, is only connected to specific module pads, and has no physical connec-

tions with other circuits inside the module. Figure 11 shows an example of how to connect the eUICC to the modules SIM interface lines as well as a switch to select whether to use the in-

ternal MFF-XS eUICC or an external plug-in SIM card. Figure 12 shows an example for a direct connection to the modules SIM interface lines. Max. distance 10cm SIM card holder Alternatively SIM switch can be bridged SIM ESD protection 4 4 x 0R SIM switch If 2 Common If 1 FSA2567 Module 4 CCIO pull up resistor and CCVCC capacitor 470nF are mounted on the module SIMSELECT CC2_VCC capacitor 100F mounted on the module SIM_SWITCH = Low => SIMSELECT = High: SIM connected SIM_SWITCH = High => SIMSELECT = Low: eUICC connected VBATT 10k 22k 100k CCVCC CCIO CCRST CCCLK eUICC CC2_VPP CC2_VCC CC2_IO CC2_RST CC2_CLK SIM_SWITCH to drive SIMSELECT Figure 11: eUICC interface with switch for external SIM The eUICC interface comprises five lines (plus ground) as listed below in Table 5. Table 5: Signals of the eUICC interface option (SMT application interface) Signal CC2_RST CC2_CLK CC2_IO CC2_VPP CC2_VCC GND Description Chip Card Reset Chip Card Clock Chip Card I/O (data line)

Operation voltage for SIM Card (=1.8V) eUICC Ground t TN23-W_HID_v00.028 Confidential / Preliminary 2022-07-14 Cinterion TN23-W Hardware Interface Description 2.1 Application Interface 48 Page 30 of 100 The below Figure 12 shows a direct connection of the internal eUICC to the modules SIM in-

terface lines. Baseband controller CCVCC CCIO CCRST CCCLK Module CCIO pull up resistor and CCVCC capacitor 470nF are mounted on the module CC2_VPP CC2_VCC CC2_IO CC2_RST CC2_CLK eUICC Figure 12: eUICC interface without SIM switch t TN23-W_HID_v00.028 Confidential / Preliminary 2022-07-14 Cinterion TN23-W Hardware Interface Description 2.1 Application Interface 48 Page 31 of 100 2.1.7 GPIO Interface The embedded processing option of TN23-W provides a GPIO interface with 3 GPIO lines. The GPIO lines are shared with other interfaces or functions: Status LED (see Section 2.1.10.1), fast shutdown (see Section 2.1.10.3), and SIM switch (see Section 2.1.10.4). The following table lists the GPIOs with their default assignments being marked green. Table 6: GPIO lines and alternative assignments GPIO GPIO4 GPIO5 GPIO8 Status LED Fast Shutdown SIM switch STATUS FST_SHDN SIM_SWITCH After startup, the above mentioned alternative GPIO line assignments can be configured through embedded applications. The alternative assignments are mutually exclusive, i.e. a pad used for instance as GPIO5 by an embedded application is locked for alternative usage. t TN23-W_HID_v00.028 Confidential / Preliminary 2022-07-14 Cinterion TN23-W Hardware Interface Description 2.1 Application Interface 48 Page 32 of 100 2.1.8 I2C Interface The embedded processing option of TN23-W provides an inter-integrated circuit interface. I2C is a serial, 8-bit oriented data transfer bus for bit rates up to 400kbps in Fast mode. It consists of two lines, the serial data line I2CDAT and the serial clock line I2CCLK. The module acts as a single master device, e.g. the clock I2CCLK is driven by the module. I2CDAT is a bi-direc-

tional line. Each device connected to the bus is software addressable by a unique 7-bit ad-

dress, and simple master/slave relationships exist at all times. The module operates as master-

transmitter or as master-receiver. The customer application transmits or receives data only on request of the module. The I2C lines are shared with two ASC1 lines: CTS1 --> I2CCLK, and RTS1 --> I2CDAT. The I2C bus can be configured and activated via embedded application, and in this case the ASC1 lines are no longer available. For more information see [7]. The I2C interface can be powered via the V180 line of TN23-W. If connected to the V180 line, the I2C interface will properly shut down when the module enters the Power Down mode. In the application I2CDAT and I2CCLK lines need to be connected to a positive supply voltage via a pull-up resistor. For electrical characteristics please refer to Table 2. Module V180 I2CCLK I2CDAT GND Application p u l l u p R p u l l u p R I2CCLK I2CDAT GND Figure 13: I2C interface connected to V180 Note: Good care should be taken when creating the PCB layout of the host application: The traces of I2CCLK and I2CDAT should be equal in length and as short as possible. t TN23-W_HID_v00.028 Confidential / Preliminary 2022-07-14 Cinterion TN23-W Hardware Interface Description 2.1 Application Interface 48 Page 33 of 100 2.1.9 SPI Interface The embedded processing option of TN23-W provides an SPI interface where four TN23-W in-

terface lines can be configured as Serial Peripheral Interface (SPI). The SPI is a synchronous serial interface for control and data transfer between TN23-W and the external application. Only one application can be connected to the SPI and the interface supports only master mode. The transmission rates are up to 6.5Mbit/s. The SPI interface comprises the two data lines MOSI and MISO, the clock line SPI_CLK a well as the chip select line SPI_CS. The SPI lines are shared with four ASC0 lines: DTR0 --> MISO, DSR0 --> MOSI, DCD0 -->

SPI_CLK, and RING0 --> SPI_CS. The SPI interface can be configured and activated via em-

bedded application, and in this case the ASC0 lines are no longer available. For more informa-

tion see [7]. In general, SPI supports four operation modes. The modes are different in clock phase and clock polarity. The modules SPI mode can be configured via embedded processing option. Make sure the module and the connected slave device works with the same SPI mode. Figure 14 shows the characteristics of the four SPI modes. The SPI modes 0 and 3 are the most common used modes. For electrical characteristics please refer to Table 2. Clock phase SPI MODE 0 SPI MODE 1 l y t i r a o p k c o C l SPI_CS SPI_CLK MOSI MISO SPI_CS SPI_CLK MOSI MISO SPI_CS SPI_CLK MOSI MISO Sample Sample SPI MODE 2 SPI MODE 3 SPI_CS SPI_CLK MOSI MISO Sample Sample Figure 14: Characteristics of SPI modes t TN23-W_HID_v00.028 Confidential / Preliminary 2022-07-14 Cinterion TN23-W Hardware Interface Description 2.1 Application Interface 48 Page 34 of 100 2.1.10 Control Signals 2.1.10.1 Status LED The STATUS line can be configured to drive a status LED that indicates different operating modes of the module. For details on how to configure status signaling please refer to [1]. To take advantage of this function connect an LED to the STATUS line as shown in Figure 15. With the embedded processing option the STATUS signal can also be programmed as GPIO5

(see Section 2.1.7). The sample circuit is not optimized for low current consumption. R1 22k STATUS VCC LED R3 BC847 Based on VCC and current requirement of LED. R2 100k GND GND Figure 15: Status signaling with LED driver 2.1.10.2 Power Indication Circuit In Power Down mode the maximum voltage at any digital or analog interface line must not ex-

ceed +0.3V (see also Section 2.1.2.1). Exceeding this limit for any length of time might cause permanent damage to the module. It is therefore recommended to implement a power indication signal that reports the modules power state and shows whether it is active or in Power Down mode. While the module is in Power Down mode all signals with a high level from an external application need to be set to low state or high impedance state. The sample power indication circuit illustrated in Figure 16 denotes the modules active state with a low signal and the modules Power Down mode with a high signal or high impedance state. The sample circuit is not optimized for low current con-

sumption. t TN23-W_HID_v00.028 Confidential / Preliminary 2022-07-14 Cinterion TN23-W Hardware Interface Description 2.1 Application Interface 48 Page 35 of 100 k 0 1 External power supply Power indication 22k V180 k 0 0 1 Figure 16: Power indication circuit 2.1.10.3 Fast Shutdown The FST_SHDN line is an active low control signal and must be applied for at least TBD. milli-

seconds. It is recommended to keep the FST_SHDN line low until the module has shut down. If unused this line can be left open because of a configured internal pull-up resistor. Before set-

ting the FST_SHDN line to low, the ON signal should be set to low (see Figure 17). Otherwise there might be back powering at the ON line in Power Down mode. A low impulse on the FST_SHDN line starts the fast shutdown procedure (see Figure 17). The fast shutdown procedure still finishes any data activities on the module's flash file system, thus ensuring data integrity, but will no longer deregister gracefully from the network, thus saving the time required for network deregistration. The fast shutdown procedure takes less than 15 milliseconds. A low level of the V180 signal indicates that the module has entered the Power Down mode.No shutdown URCs will be issued with a fast shutdown. With the embedded processing option the FST_SHDN signal can also be programmed as GPIO4 (see Section 2.1.7). TBD. Figure 17: Fast shutdown timing t TN23-W_HID_v00.028 Confidential / Preliminary 2022-07-14 Cinterion TN23-W Hardware Interface Description 2.1 Application Interface 48 Page 36 of 100 2.1.10.4 SIM Switch The UICC/USIM/SIM interface lines may be connected to an external SIM card multiplexer con-

trolled by the SIM_SWITCH signal as shown in Figure 18. Thus, it becomes possible to switch between two networks/subscriptions each with their own UICC, and maybe different connec-

tion speeds. Please note that hot SIM insert/removal is only possible on the first SIM interface. Also note that the SIM_SWITCH can be used to switch between a SIM and the embedded op-

tional eUICC interface as described in Section 2.1.6. The SIM_SWITCH signal is controlled by AT command (see [1]). With the embedded processing option the SIM_SWITCH signal can also be programmed as GPIO8 (see Section 2.1.7).

Figure 18: SIM switch circuit t TN23-W_HID_v00.028 Confidential / Preliminary 2022-07-14 Cinterion TN23-W Hardware Interface Description 2.2 RF Antenna Interface 48 2.2 RF Antenna Interface Page 37 of 100 The RF interface has an impedance of 50. TN23-W is capable of sustaining a total mismatch at the antenna line without any damage, even when transmitting at maximum RF power. The external antenna must be matched properly to achieve best performance regarding radi-

ated power, modulation accuracy and harmonic suppression. Antenna matching networks are not included on the TN23-W module and should be placed in the host application if the antenna does not have an impedance of 50. Regarding the return loss TN23-W provides the following values in the active band:

Table 7: Return loss in the active band State of module Return loss of module Recommended return loss of application Receive Transmit Idle

> 8dB not applicable 5dB

> 12dB

> 12dB not applicable t TN23-W_HID_v00.028 Confidential / Preliminary 2022-07-14 Cinterion TN23-W Hardware Interface Description 2.2 RF Antenna Interface 48 2.2.1 Antenna Interface Specifications Page 38 of 100 Table 8: RF Antenna Interface LTE NB1/2 Parameter Conditions Min Typical Unit LTE connectivity (Cat NB1/2 Band: 1, 2, 3, 4, 5, 8, 12, 13, 17, 18, 19, 20, 25, 26, 28, 66, 85 Receiver Input Sensitivity

@NTNV Configuration ID:1;

DL: Modulation: QPSK; Sub-

carriers: 12;

UL: Modulation: BPSK; Sub-

carrier spacing: 15KHz;

Ntones: 1@0 Power @ ARP with 50Ohm Load, NTNV Configuration ID:1;

UL: Modulation: BPSK; Sub-

carrier: 1;Subcarrier space:

3.75 kHz; Ntones: 1@0 LTE Band 1 LTE Band 2 LTE Band 3 LTE Band 4 LTE Band 5 LTE Band 8 LTE Band 12 LTE Band 13 LTE Band 17 LTE Band 18 LTE Band 19 LTE Band 20 LTE Band 25 LTE Band 26 LTE Band 28 LTE Band 66 LTE Band 85 LTE Band 1 LTE Band 2 LTE Band 3 LTE Band 4 LTE Band 5 LTE Band 8 LTE Band 12 LTE Band 13 LTE Band 17 LTE Band 18 LTE Band 19 LTE Band 20 LTE Band 25 LTE Band 26 LTE Band 28 LTE Band 66 LTE Band 85

-108.2

-108.2

-108.2

-108.2

-108.2

-108.2

-108.2

-108.2

-108.2

-108.2

-108.2

-108.2

-108.2

-108.2

-108.2

-108.2

-108.2

+21

+21

+21

+21

+21

+21

+21

+21

+21

+21

+21

+21

+21

+21

+21

+21

+21

-114

-114

-114

-114

-114

-114

-113

-113

-114

-113.5

-113.5

-113.5

-114

-114

-113

-114

-114

+23.0

+23.0

+23.0

+23.0

+23.0

+23.0

+23.0

+23.0

+23.0

+23.0

+23.0

+23.0

+23.0

+23.0

+23.0

+23.0

+23.0 dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm t TN23-W_HID_v00.028 Confidential / Preliminary 2022-07-14 Cinterion TN23-W Hardware Interface Description 2.2 RF Antenna Interface 48 2.2.2 Antenna Installation Page 39 of 100 The antennas is connected by soldering the antenna pads (RF_OUT) and its neighboring ground pads directly to the applications PCB. Marking GND GND GND GND RF_OUT Figure 19: Antenna pads (top view) The distance between the antenna pads and their neighboring GND pads has been optimized for best possible impedance. On the application PCB, special attention should be paid to these pads, in order to prevent mismatch. The wiring of the antenna connection line, starting from the antenna pad to the application an-

tenna should result in a 50 line impedance. Line width and distance to the GND plane needs to be optimized with regard to the PCBs layer stack. Some examples are given in Section 2.2.3. To prevent receiver desensitization due to interferences generated by fast transients like high speed clocks on the application PCB, it is recommended to realize the antenna connection line using embedded Stripline rather than Micro-Stripline technology. Please see Section 2.2.3.1 for an example.1 For type approval purposes, the use of a 50 coaxial antenna connector (U.FL-R-SMT) might be necessary. In this case the U.FL-R-SMT connector should be placed as close as possible to TN23-Ws antenna pad. 1. Please note that because of KDB 447498.GNSS, it is required to get a dedicated FCC ID, if using a PCB printed antenna. t TN23-W_HID_v00.028 Confidential / Preliminary 2022-07-14 Cinterion TN23-W Hardware Interface Description 2.2 RF Antenna Interface 48 2.2.3 RF Line Routing Design 2.2.3.1 Line Arrangement Examples Page 40 of 100 Several dedicated tools are available to calculate line arrangements for specific applications and PCB materials - for example from http://www.polarinstruments.com/ (commercial software) or from http://web.awrcorp.com/Usa/Products/Optional-Products/TX-Line/ (free software). Embedded Stripline This figure below shows a line arrangement example for embedded stripline with 65m FR4 prepreg (type: 1080) and 710m FR4 core (4-layer PCB). Figure 20: Embedded Stripline with 65m prepreg (1080) and 710m core t TN23-W_HID_v00.028 Confidential / Preliminary 2022-07-14 Cinterion TN23-W Hardware Interface Description 2.2 RF Antenna Interface 48 Page 41 of 100 Micro-Stripline This section gives two line arrangement examples for micro-stripline. Micro-Stripline on 1.0mm Standard FR4 2-Layer PCB The following two figures show examples with different values for D1 (ground strip separa-

tion). Application board Ground line Antenna line Ground line Figure 21: Micro-Stripline on 1.0mm Standard FR4 2-layer PCB - example 1 t TN23-W_HID_v00.028 Confidential / Preliminary 2022-07-14 Cinterion TN23-W Hardware Interface Description 2.2 RF Antenna Interface 48 Page 42 of 100 Application board Ground line Antenna line Ground line Figure 22: Micro-Stripline on 1.0mm Standard FR4 2-layer PCB - example 2 t TN23-W_HID_v00.028 Confidential / Preliminary 2022-07-14 Cinterion TN23-W Hardware Interface Description 2.2 RF Antenna Interface 48 Page 43 of 100 Micro-Stripline on 1.5mm Standard FR4 2-Layer PCB The following two figures show examples with different values for D1 (ground strip separa-

tion). Application board Ground line Antenna line Ground line Figure 23: Micro-Stripline on 1.5mm Standard FR4 2-layer PCB - example 1 t TN23-W_HID_v00.028 Confidential / Preliminary 2022-07-14 Cinterion TN23-W Hardware Interface Description 2.2 RF Antenna Interface 48 Page 44 of 100 Application board Ground line Antenna line Ground line Figure 24: Micro-Stripline on 1.5mm Standard FR4 2-layer PCB - example 2 t TN23-W_HID_v00.028 Confidential / Preliminary 2022-07-14 Cinterion TN23-W Hardware Interface Description 2.2 RF Antenna Interface 48 2.2.3.2 Routing Example Page 45 of 100 Interface to RF Connector Figure 25 shows the connection of the modules antenna pad with an application PCBs coaxial antenna connector. Please note that the TN23-W bottom plane appears mirrored, since it is viewed from TN23-W top side. By definition the top of customer's board shall mate with the bot-

tom of the TN23-W module. Figure 25: Routing to applications RF connector - top view t TN23-W_HID_v00.028 Confidential / Preliminary 2022-07-14 Cinterion TN23-W Hardware Interface Description 2.3 Sample Application 48 2.3 Sample Application Page 46 of 100 Figure 26 shows a typical example of how to integrate a TN23-W module with an application. Usage of the various host interfaces depends on the desired features of the application. Note that the sample application is not optimized for low current consumption. Because of the very low power consumption design, current flowing from any other source into the module circuit must be avoided, for example reverse current from high state external control lines. Therefore, the controlling application must be designed to prevent reverse current flow. Otherwise there is the risk of undefined states of the module during startup and shutdown or even of damaging the module. Because of the high RF field density inside the module, it cannot be guaranteed that no self interference might occur, depending on frequency and the applications grounding concept. The potential interferers may be minimized by placing small capacitors (47pF) at suspected lines

(e.g. RXD0, TXD0, and ON). While developing SMT applications it is strongly recommended to provide test points for certain signals, i.e., lines to and from the module - for debug and/or test purposes. The SMT applica-

tion should allow for an easy access to these signals. For details on how to implement test points see [4]. Possible test points are mentioned in Section 2.1.2. The EMC measures are best practice recommendations. In fact, an adequate EMC strategy for an individual application is very much determined by the overall layout and, especially, the po-

sition of components. For example, mounting the internal acoustic transducers directly on the PCB eliminates the need to use the ferrite beads shown in the sample schematic. Depending on the micro controller used by an external application TN23-Ws digital input and output lines may require level conversion. Section 2.3.1 shows a possible sample level conver-

sion circuit. Disclaimer No warranty, either stated or implied, is provided on the sample schematic diagram shown in Figure 26 and the information detailed in this section. Functionality and compliance with nation-

al regulations depend to a great amount on the used electronic components, and the individual application layout manufacturers are required to ensure adequate design and operating safe-

guards for their products using TN23-W modules. Because of the number of frequencies used it is recommended to involve antenna vendors already quite early to maximize performance of the external applications layout. t TN23-W_HID_v00.028 Confidential / Preliminary 2022-07-14 Cinterion TN23-W Hardware Interface Description 2.3 Sample Application 48 Page 47 of 100 For engineering samples (A1.1): 1.8V BATT+BB 150k 22k GND ANT_MAIN GND TN23-W ON Main antenna 100k EMERG_RST PWR_IND 22k 100k V180 VFLASH Blocking**

4 ASC1 Blocking**

8 ASC0 G15&G16 BATT+RF BATT+BB H15&H16 BEAD*

150F, Low ESR!

33pF 33pF Power supply 47F, Low ESR!

BEAD*: It is recommended to add the BEAD as shown to the BATT+BB line. The purpose of this is to mitigate noise from baseband power supply. Note 1: BLM15PD121SN1D MURATA Ind Chip Bead

(120Ohm 25% 100MHz Ferrite 1.3A) is recommended in this case. For details please visit www.murata.com. Note 2: The Bead should be placed as close as possible to the module. l B o c k n g

i LED eUICC interface (optional) Add optional 10pF for SIM protection against RF (internal Antenna) 10pF 10pF FST_SHDN STATUS SIM_SWITCH eUICC CC2_VCC CC2_IO CC2_RST CC2_CLK CC2_VPP SIM 220nF 1nF CCVCC CCIO CCRST CCCLK All SIM components should be close to card holder. Keep SIM wires low capacitive. GND Blocking** = For more details see Section 3.7 eUICC*** = For more details see Section 2.1.6 Figure 26: Schematic diagram of TN23-W sample application t TN23-W_HID_v00.028 Confidential / Preliminary 2022-07-14 Cinterion TN23-W Hardware Interface Description 2.3 Sample Application 48 2.3.1 Sample Level Conversion Circuit Page 48 of 100 Depending on the micro controller used by an external application TN23-Ws digital input and output lines (i.e., ASC0, ASC1) may require level conversion. The following Figure 27 shows a sample circuit with recommended level shifters for an external applications micro controller

(with VLOGIC between 3.0V...3.6V). The level shifters can be used for digital input and output lines with VOHmax=1.85V or VIHmax =1.85V. The sample circuit is not optimized for low current consumption. External application VLOGIC

(3.0V...3.6V) Input lines, e.g., RXD, CTS VCC Low level input Low level input Low level input Micro controller E.g., 74VHC1GT50 74LV1T34 VCC Output lines, e.g., TXD, RTS 5V tolerarant 5V tolerant E.g., 74LVC2G34 NC7WZ16 Figure 27: Sample level conversion circuit Wireless module Digital output lines, e.g., RXDx, CTSx V180 (1.8V) Digital input lines, e.g., TXDx, RTSx t TN23-W_HID_v00.028 Confidential / Preliminary 2022-07-14 Cinterion TN23-W Hardware Interface Description 3 Operating Characteristics 66 3 Operating Characteristics 3.1 Operating Modes Page 49 of 100 The table below briefly summarizes the various operating modes referred to throughout the document. Table 9: Overview of operating modes Mode Function Normal operation Data transfer LTE NB1/2 software is active to minimum extent. SLEEP1 Airplane Idle Software and interfaces are active and ready to send and receive, but no LTE NB1/2 data transfer is currently in progress. If the module was registered to the LTE NB1/2 network in IDLE mode, it is regis-

tered and paging in SLEEP mode, too. Power consumption in this state is extremely dependent on the current LTE NB1/2 network coverage. Restricted operating mode where the modules radio part is shut down, causing the module to log off from the LTE NB1/2 network, and to disable all AT commands whose execution requires a radio connection. Airplane mode can be controlled by AT command (see AT+CFUN). POWER DOWN State after normal shutdown by sending the switch off command. Software is not active. Interfaces are not accessible. Operating voltage remains applied. 1. For details on the modules low power modes and their configuration, please refer to Section 3.3. t TN23-W_HID_v00.028 Confidential / Preliminary 2022-07-14 Cinterion TN23-W Hardware Interface Description 3.2 Power Up/Power Down Scenarios 66 3.2 Power Up/Power Down Scenarios Page 50 of 100 Do not turn on TN23-W while it is beyond the safety limits of voltage stated in Section 2.1.2.1. TN23-W immediately switches off after having started and detected these inappropriate condi-

tions. In extreme cases this can cause permanent damage to the module. 3.2.1 Turn on TN23-W TN23-W can be turned on as described in the following sections:

Hardware driven switch on by ON signal: Starts Normal mode (see Section 3.2.1.1). Hardware driven automatic switch on via BATT+ signal: Starts Normal mode (see Section 3.2.1.2). After startup or restart, a high level of the V180 line, as well as the URC(s) send by the module indicate that the module has started up (again). The URC notifies the host application that the first AT command can be sent to the module (see also [1]). 3.2.1.1 Switch on TN23-W Using ON Signal The ON signal starts up/wakes up the module if the module is in low power state. This signal is an active high signal and allowed only the input voltage level of BATT power supply. The module starts in the operating mode, with a high-level signal at the ON signal. Please note that for engineering samples (A1.1), the input voltage level must not exceed 1.8V. Otherwise, or if VBAT is used as input level, the module might get damaged. The following figures shows the recommended power on circuits and the start-up timings if ON is valid. BATT+BB For engineering samples (A1.1): 1.8V R1 R2 IGT ON Figure 28: Sample ON circuit t TN23-W_HID_v00.028 Confidential / Preliminary 2022-07-14 Cinterion TN23-W Hardware Interface Description 3.2 Power Up/Power Down Scenarios 66 Page 51 of 100 BATT+BB

>100s ON Wakeup active high V180

~600s VFLASH

~800s EMERG_RST Figure 29: ON startup timing 3.2.1.2 Automatic On Timing Module switch on is automatically initiated after connecting TN23-W to BATT+. The automatic startup timing is shown in Figure 30. 40s~340s BATT+BB ON V180 305s~1050s VFLASH EMERG_RST Figure 30: ON startup timing (automatic) t TN23-W_HID_v00.028 Confidential / Preliminary 2022-07-14 Cinterion TN23-W Hardware Interface Description 3.2 Power Up/Power Down Scenarios 66 3.2.2 Restart TN23-W Page 52 of 100 After startup TN23-W can be re-started as described in the following sections:

Software controlled reset by AT+CFUN command: Starts Normal mode (see Section 3.2.2.1). Hardware controlled reset by EMERG_RST line: Starts Normal mode (see Section 3.2.2.2) 3.2.2.1 Restart TN23-W via AT+CFUN Command To reset and restart the TN23-W module use the command AT+CFUN. See [1] for details. 3.2.2.2 Restart TN23-W Using EMERG_RST The EMERG_RST signal is internally connected to the central processor. A low level phase

>100s triggers the module restart process, and sets the processor and all signals to their re-

spective reset states. The reset state is described in Section 3.2.3 as well as in the figures showing the startup behavior of an interface. Ignition System started Reset State System started again BATT+BB ON V180 VFLASH EMERG_RST

>1ms

>100s

>100ms Figure 31: Emergency restart timing It is strongly recommended to control this EMERG_RST line with an open collector transistor or an open drain field-effect transistor. Caution: Use the EMERG_RST line only when, due to serious problems, the software is not responding for more than 5 seconds. Pulling the EMERG_RST line causes the loss of all infor-

mation stored in the volatile memory. Therefore, this procedure is intended only for use in case of emergency, e.g. if TN23-W does not respond, if reset or shutdown via AT command fails. t TN23-W_HID_v00.028 Confidential / Preliminary 2022-07-14 Cinterion TN23-W Hardware Interface Description 3.2 Power Up/Power Down Scenarios 66 3.2.3 Signal States after Startup Page 53 of 100 Table 10 describes various states interface signals pass through after startup until the system is active. Signals are in an initial state while the module is initializing. Once the startup initialization has completed, i.e. when the software is running, all signals are in a defined state, the module is ready to receive and transmit data. The state of some signals may change again once a re-

spective interface is activated or configured by AT command. For details on certain other signal state changes during startup see also Section 3.2.1 (ON, V180), Section 3.2.2 (EMERG_RST), and Section 2.1.3 (ASC0 signals). Table 10: Signal states Signal name CCIO CCRST CCCLK RXD0 TXD0 CTS0 RTS0 DTR0 / MISO DCD0 / SPI_CLK DSR0 / MOSI RING0 / SPI_CS RXD1 TXD1 CTS1 / I2CCLK RTS1 / I2CDAT FST_SHDN / GPIO4 STATUS / GPIO5 SIM_SWITCH / GPIO8 Reset state First start up configuration PD PD PD PU PU PU PU PD PD PD PD PU PU PU PU PD PU PU TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. TBD. Abbreviations used in above Table 10:

I = Input L = Low level O = Output OD = Open Drain H = High level PD = Pull down, 13.6k ~45k L/H = Low or high level PU = Pull up, 13k ~45k T = Tristate t TN23-W_HID_v00.028 Confidential / Preliminary 2022-07-14 Cinterion TN23-W Hardware Interface Description 3.2 Power Up/Power Down Scenarios 66 3.2.4 Turn off TN23-W Page 54 of 100 To switch the module off the following procedures may be used:

Software controlled shutdown procedure: Software controlled by sending an AT command over the serial application interface. See Section 3.2.4.1. Hardware controlled shutdown procedure: Hardware controlled by setting the FST_SHDN line to low. See Section 2.1.10.3. Automatic shutdown (software controlled): See Section 3.2.5

- Takes effect if TN23-W board temperature exceeds a critical limit, or if

- Undervoltage or overvoltage is detected. 3.2.4.1 Switch off TN23-W Using AT Command The best and safest approach to powering down the module is to issue the AT^SMSO com-

mand. This procedure lets the module log off from the network and allows the software to enter into a secure state and to save data before disconnecting the power supply. The shutdown pro-

cedure will be an active process for about 2 seconds (depending on environmental conditions such as network states) until the module switches off. It cannot be specified how long the shut-

down procedure may take at the worst. AT^SMSO Shutdown URC Switch off procedure and shut down BATT+

ON EMERG_RST

~300s V180 Network dependent

~1.2S TXD0 RXD0 PWR_IND Active low Open Collector High Z Figure 32: Switch off behavior A low level of the V180 signal as well as the URC "^SHUTDOWN" indicate that the switch off procedure has completed and the module has entered the Power Down mode. t TN23-W_HID_v00.028 Confidential / Preliminary 2022-07-14 Cinterion TN23-W Hardware Interface Description 3.2 Power Up/Power Down Scenarios 66 3.2.5 Automatic Shutdown Page 55 of 100 Automatic shutdown takes effect if the following event occurs:

TN23-W board is exceeding the critical limits of overtemperature or undertemperature (see Section 3.2.5.1) Undervoltage or overvoltage is detected (see Section 3.2.5.2 and Section 3.2.5.3) The automatic shutdown procedure is equivalent to the power-down initiated with an AT com-

mand, i.e. TN23-W logs off from the network and the software enters a secure state avoiding loss of data. 3.2.5.1 Thermal Shutdown TBD. 3.2.5.2 Undervoltage Shutdown The undervoltage shutdown threshold is the specified minimum supply voltage VBATT+ given in Table 2. When the average supply voltage measured by TN23-W approaches the undervoltage shutdown threshold (i.e., 0.05V offset) the module will send the following URC:

^SBC: Undervoltage If the undervoltage persists the module will send the URC several times before switching off automatically. This type of URC does not need to be activated by the user. It will be output automatically when fault conditions occur. Note: For battery powered applications it is strongly recommended to implement a BATT+ con-

necting circuit in order to not only be able save power, but also to restart the module after an undervoltage shutdown where the battery is deeply discharged. Also note that the undervolt-

age threshold is calculated for max. 400mV voltage drops during transmit burst. Power supply sources for external applications should be designed to tolerate 400mV voltage drops without crossing the lower limit of 3.3V. For external applications operating at the limit of the allowed tolerance the default undervoltage threshold may be adapted by subtracting an offset. For de-

tails see [1]: AT^SCFG= "MEShutdown/sVsup/threshold". t TN23-W_HID_v00.028 Confidential / Preliminary 2022-07-14 Cinterion TN23-W Hardware Interface Description 3.3 Power Saving 66 3.2.5.3 Overvoltage Shutdown Page 56 of 100 The overvoltage shutdown threshold is the specified maximum supply voltage VBATT+ given in Table 2. When the average supply voltage measured by TN23-W approaches the overvoltage shutdown threshold (i.e., 0.05V offset) the module will send the following URC:

^SBC: Overvoltage Warning The overvoltage warning is sent only once - until the next time the module is close to the over-

voltage shutdown threshold. If the voltage continues to rise above the specified overvoltage shutdown threshold, the module will send the following URC:

^SBC: Overvoltage Shutdown This alert is sent only once before the module shuts down cleanly without sending any further messages. This type of URC does not need to be activated by the user. It will be output automatically when fault conditions occur. Keep in mind that several TN23-W components are directly linked to BATT+ and, therefore, the supply voltage remains applied at major parts of TN23-W. Especially the power amplifier linked to BATT+RF is sensitive to high voltage and might even be destroyed. Power Saving 3.3 TBD. t TN23-W_HID_v00.028 Confidential / Preliminary 2022-07-14 Cinterion TN23-W Hardware Interface Description 3.4 Power Supply 66 Page 57 of 100 3.4 Power Supply TN23-W needs to be connected to a power supply at the SMT application interface - 2 lines BATT+, and GND. There are two separate voltage domains for BATT+:

BATT+BB with a line mainly for the baseband power supply. BATT+RF with a line for the power amplifier supply. Please note that BATT+ in this document refers to both voltage domains and power supply lines - BATT+BB and BATT+RF. The power supply of TN23-W has to be a single voltage source at BATT+BB and BATT+RF. It should be of type PS1, according to IEC 62368-1, and must be able to provide the peak current during the uplink transmission. Suitable low ESR capacitors should be placed as close as possible to the BATT+ pads, e.g., X7R MLCC (see also Section 2.1.2). All key functions for supplying power to the device are handled by the power management IC. It provides the following features:

Stabilizes the supply voltages for the baseband using low drop linear voltage regulators and a DC-DC step down switching regulator. Switches the module's power voltages for the power-up and -down procedures. SIM switch to provide SIM power supply. 3.4.1 Power Supply Ratings Table 11 and Table 12 assemble various voltage supply and current consumption ratings (Cat NB1/2) of the module. Table 11: Voltage supply ratings TN23-W Description Conditions Min Typ Max Unit BATT+

Supply voltage Directly measured at Module. 3.0 3.8 4.5 V Voltage must stay within the min/

max values, including voltage drop, ripple, spikes t TN23-W_HID_v00.028 Confidential / Preliminary 2022-07-14 Cinterion TN23-W Hardware Interface Description 3.4 Power Supply 66 Page 58 of 100 Table 12: Current consumption ratings TN23-W Description Conditions 1 IBATT+

(i.e., sum of BATT+BB and BATT+RF) Average LTE NB1/2 supply current Power Save Mode

(PSM) Base current T3412 12 hours, T3324 2s, DRX 2.56s RRC idle

(Sleep) 2 RRC connected Active Transmission DL RMC3 DRX =1024 DRX =512 DRX =256 DRX =128 20,48s eDRX 40.96s eDRX 81.92s eDRX PTW = 2,56s DRX = 1,28s PTW = 2,56s DRX = 1,28s PTW = 2,56s DRX = 1,28s 163,84s eDRX PTW = 10,24s DRX = 1,28s Band1, 23dBm Band2, 23dBm Band3, 23dBm Band4, 23dBm Band5, 23dBm Band8, 23dBm Band12, 23dBm Band13, 23dBm Band17, 23dBm Band18, 23dBm Band19, 23dBm Band20, 23dBm Band25, 23dBm Band26, 23dBm Band28, 23dBm Band66, 23dBm Band85, 23dBm Typical 1.6 8.0 0.354 0.523 0.876 1.565 0.207 0.120 0.078 0.066 67 65 57 57 55 62 65 60 65 54 55 56 68 55 66 57 65 Unit uA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA t TN23-W_HID_v00.028 Confidential / Preliminary 2022-07-14 Cinterion TN23-W Hardware Interface Description 3.4 Power Supply 66 Table 12: Current consumption ratings TN23-W Average LTE NB1/2 supply current Description 1 IBATT+

(i.e., sum of BATT+BB and BATT+RF) Conditions RRC connected Active Transmission UL RMC, single tone mode

(1subcarrier),15KHz spacing 3 Band1, 23dBm Band2, 23dBm Band3, 23dBm Band4, 23dBm Band5, 23dBm Band8, 23dBm Band12, 23dBm Band13, 23dBm Band17, 23dBm Band18, 23dBm Band19, 23dBm Band20, 23dBm Band25, 23dBm Band26, 23dBm Band28, 23dBm Band66, 23dBm Band85, 23dBm Page 59 of 100 Typical Unit 239 249 182 182 171 215 232 211 234 167 172 176 251 169 234 182 231 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA t TN23-W_HID_v00.028 Confidential / Preliminary 2022-07-14 Cinterion TN23-W Hardware Interface Description 3.4 Power Supply 66 Table 12: Current consumption ratings TN23-W Page 60 of 100 Conditions Typical Unit Peak Current @ RRC connected Active Transmission UL RMC, single tone mode (1subcarrier),15KHz spacing Vbatt = 3.8V3 Description 1 IBATT+

(i.e., sum of BATT+BB and BATT+RF) Band1, 23dBm Band2, 23dBm Band3, 23dBm Band4, 23dBm Band5, 23dBm Band8, 23dBm Band12, 23dBm Band13, 23dBm Band17, 23dBm Band18, 23dBm Band19, 23dBm Band20, 23dBm Band25, 23dBm Band26, 23dBm Band28, 23dBm Band66, 23dBm Band85, 23dBm 482 507 362 361 337 443 492 437 502 331 341 348 508 334 501 361 490 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA 1. With an impedance of ZLOAD=50Ohm at the antenna connector, measured at 25C at 3,8V 2. Measurements start 6 minutes after switching ON the module, Averaging times:

SLEEP mode: 10 minutes, (PSM disabled, eDRX disabled) RRC connected modes: 3 minutes, Communication tester settings: no neighbor cells, no cell re-selection etc,, RMC (reference measure-

ment channel), Sleep/suspend (power save) mode is enabled via AT command 3. Communication tester settings:

RSRP -80dBm, 10MHz cell bandwidth, HD-FDD and no neighbor cells configured is assumed. Modulation: BPSK for 1 UL sub-carrier mode, QPSK for multi-sub-carrier mode. t TN23-W_HID_v00.028 Confidential / Preliminary 2022-07-14 Cinterion TN23-W Hardware Interface Description 3.4 Power Supply 66 Page 61 of 100 3.4.2 Measuring the Supply Voltage (VBATT+) To measure the supply voltage VBATT+ it is possible to define two reference points GND and BATT+. GND and BATT+ should be a test pad on the external application the module is mount-

ed on. The external GND reference point has to be connected to and positioned close to the SMT application interfaces GND pad F17 and the external BATT+ reference point has to be connected to and positioned close to the SMT application interfaces BATT+ pads G15 and G16 (BATT+RF) or H15 and H16 (BATT+BB) as shown in Figure 33. Reference point BATT+:

External test pad connected to and positioned closely to BATT+

pad H15, H16. Reference point GND:

External test pad connected to and positioned closely to GND pad F17 External application Figure 33: Position of reference points BATT+ and GND t TN23-W_HID_v00.028 Confidential / Preliminary 2022-07-14 Cinterion TN23-W Hardware Interface Description 3.5 Operating Temperatures 66 3.5 Operating Temperatures Page 62 of 100 Please note that the modules lifetime, i.e., the MTTF (mean time to failure) may be reduced, if operated outside the extended temperature range. Table 13: Board temperature Parameter Normal operation Extended operation1 Automatic shutdown2 Temperature measured on TN23-W board Min

-30

-40 Typ Max

+85

+85 TBD.

TBD. Unit C C C 1. Extended operation allows normal mode speech calls or data transmission for limited time. Within the extended temperature range (outside the normal operating temperature range) the specified electrical characteristics may be in- or decreased. 2. Due to temperature measurement uncertainty, a tolerance of 3C on the thresholds may occur. See also Section 3.2.5 for information about the NTC for on-board temperature measurement, automatic thermal shutdown and alert messages. Note: Within the specified operating temperature ranges the board temperature may vary to a great extent depending on operating mode, used frequency band, radio output power and cur-

rent supply voltage. The below Table 14 lists the ambient temperature ranges the TN23-W is able to operate in. Table 14: Ambient temperature Parameter Normal operation (LTE) Min

-40 Typ Max

+70 Unit C t TN23-W_HID_v00.028 Confidential / Preliminary 2022-07-14 Cinterion TN23-W Hardware Interface Description 3.6 Electrostatic Discharge 66 3.6 Electrostatic Discharge Page 63 of 100 The module is not protected against Electrostatic Discharge (ESD) in general. Consequently, it is subject to ESD handling precautions that typically apply to ESD sensitive components. Proper ESD handling and packaging procedures must be applied throughout the processing, handling and operation of any application that incorporates a TN23-W module. Special ESD protection provided on TN23-W:

Main antenna interface: Inductor/capacitor BATT+: Inductor/capacitor An example for an enhanced ESD protection for the SIM interface is given in Section 2.1.5.1. TN23-W has been tested according to group standard ETSI EN 301 489-1. Electrostatic values can be gathered from the following table. Table 15: Electrostatic values Specification/Requirements Contact discharge Air discharge ETSI EN 301 489-1 Main antenna interface BATT+

4kV 4kV 8kV 8kV JEDEC JESD22-A114D (Human Body Model, Test conditions: 1.5 k, 100 pF) All other interfaces TBD n.a. Note: The values may vary with the individual application design. For example, it matters whether or not the application platform is grounded over external devices like a computer or other equipment, such as the Thales reference application described in Chapter 5. 3.6.1 ESD Protection for RF Antenna Interface The following Figure 34 shows how to implement an external ESD protection for the RF anten-

na interface with either a T pad or PI pad attenuator circuit (for RF line routing design see also Section 2.2.3). T pad attenuator circuit Main Antenna PI pad attenuator circuit Main Antenna 18pF 18pF 4.7pF RF_OUT

(Pad B12) RF_OUT

(Pad B12) 22nH 18nH 18nH Figure 34: ESD protection for RF antenna interface Recommended inductor types for the above sample circuits: Size 0402 SMD from Panasonic ELJRF series (22nH and 18nH inductors) or Murata LQW15AN18NJ00 (18nH inductors only). t TN23-W_HID_v00.028 Confidential / Preliminary 2022-07-14 Cinterion TN23-W Hardware Interface Description 3.7 Blocking against RF on Interface Lines 66 Page 64 of 100 3.7 Blocking against RF on Interface Lines To reduce EMI issues there are serial resistors, or capacitors to GND, implemented on the module for the ignition, emergency restart, and SIM interface lines (cp. Section 2.3). However, all other signal lines have no EMI measures on the module and there are no blocking measures at the modules interface to an external application. Dependent on the specific application design, it might be useful to implement further EMI mea-

sures on some signal lines at the interface between module and application. These measures are described below. There are five possible variants of EMI measures (A-E) that may be implemented between module and external application depending on the signal line (see Figure 35 and Table 16). Pay attention not to exceed the maximum input voltages and prevent voltage overshots if using in-

ductive EMC measures. The maximum value of the serial resistor should be lower than 1k on the signal line. The max-

imum value of the capacitor should be lower than 50pF on the signal line. Please observe the electrical specification of the modules SMT application interface and the external applications interface. TBD. Figure 35: EMI circuits Note: In case the application uses an internal LTE antenna that is implemented close to the TN23-W module, Thales strongly recommends sufficient EMI measures, e.g. of type B or C, for each digital input or output. t TN23-W_HID_v00.028 Confidential / Preliminary 2022-07-14 Cinterion TN23-W Hardware Interface Description 3.7 Blocking against RF on Interface Lines 66 Page 65 of 100 The following table lists for each signal line at the modules SMT application interface the EMI measures that may be implemented. Table 16: EMI measures on the application interface (TBD.) Signal name EMI measures Remark A B C D E CCRST CCIO CCCLK RXD0 TXD0 CTS0 RTS0 RING0 DTR0 RXD1 TXD1 CTS1 RTS1 V180 VFLASH STATUS FST_SHDN BATT+RF (pad G15, G16) BATT+BB (pad H15, H16) t TN23-W_HID_v00.028 Confidential / Preliminary 2022-07-14 Cinterion TN23-W Hardware Interface Description 3.8 Reliability Characteristics 66 3.8 Reliability Characteristics Page 66 of 100 The test conditions stated below are an extract of the complete test specifications. Table 17: Summary of reliability test conditions Type of test Conditions Vibration Shock half-sinus Dry heat Temperature change (shock) Damp heat cyclic Frequency range: 10-20Hz; acceleration: 5g Frequency range: 20-500Hz; acceleration: 20g Duration: 20h per axis; 3 axes Acceleration: 500g Shock duration: 1ms 1 shock per axis 6 positions ( x, y and z) Temperature: +70 2C Test duration: 16h Humidity in the test chamber: < 50%

Low temperature: -40C 2C High temperature: +85C 2C Changeover time: < 30s (dual chamber system) Test duration: 1h Number of repetitions: 100 High temperature: +55C 2C Low temperature: +25C 2C Humidity: 93% 3%

Number of repetitions: 6 Test duration: 12h + 12h Cold (constant exposure) Temperature: -40 2C Test duration: 16h Standard DIN IEC 60068-2-61 DIN IEC 60068-2-27 EN 60068-2-2 Bb ETS 300 019-2-7 DIN IEC 60068-2-14 Na ETS 300 019-2-7 DIN IEC 60068-2-30 Db ETS 300 019-2-5 DIN IEC 60068-2-1 1. For reliability tests in the frequency range 20-500Hz the Standards acceleration reference value was increased to 20g. t TN23-W_HID_v00.028 Confidential / Preliminary 2022-07-14 Cinterion TN23-W Hardware Interface Description 4 Mechanical Dimensions, Mounting and Packaging 83 Page 67 of 100 4 Mechanical Dimensions, Mounting and Packaging 4.1 Mechanical Dimensions of TN23-W Figure 36 shows the top and bottom view of TN23-W and provides an overview of the board's mechanical dimensions. For further details see Figure 37. Figure 38 shows the area at the modules bottom side where possible markings might be printed. Product label Top view Bottom view Figure 36: TN23-W top and bottom view t TN23-W_HID_v00.028 Confidential / Preliminary 2022-07-14 Cinterion TN23-W Hardware Interface Description 4.1 Mechanical Dimensions of TN23-W 83 Page 68 of 100 Figure 37: Dimensions of TN23-W (all dimensions in mm) Restricted Area Do not put any solder resist opening marks or pencil line inside this area, and keep at least 0.42mm clearance from specified marks to LGA pads Figure 38: Dimensions of area for possible markings TN23-W (bottom view) t TN23-W_HID_v00.028 Confidential / Preliminary 2022-07-14 Cinterion TN23-W Hardware Interface Description 4.2 Mounting TN23-W onto the Application Platform 83 Page 69 of 100 4.2 Mounting TN23-W onto the Application Platform This section describes how to mount TN23-W onto the PCBs, including land pattern and stencil design, board-level characterization, soldering conditions, durability and mechanical handling. For more information on issues related to SMT module integration see also [4]. Note: To avoid short circuits between signal tracks on an external application's PCB and vari-

ous markings at the bottom side of the module (see Figure 38 and Figure 4.2), it is recommend-

ed not to route the signal tracks on the top layer of an external PCB directly under the module, or at least to ensure that signal track routes are sufficiently covered with solder resist. Note: Do not place external components or devices that might cause any pressure on the modules shielding. See [3] and [4] for further details of thermal and integration guidance. 4.2.1 SMT PCB Assembly 4.2.1.1 Land Pattern and Stencil The land pattern and stencil design as shown below is based on Thales characterizations for lead-free solder paste on a four-layer test PCB and a 110 micron thick stencil. The land pattern given in Figure 39 reflects the modules pad layout, including signal pads and ground pads (for pad assignment see Section 2.1.1). Figure 39: Land pattern TN23-W (top view) t TN23-W_HID_v00.028 Confidential / Preliminary 2022-07-14 Cinterion TN23-W Hardware Interface Description 4.2 Mounting TN23-W onto the Application Platform 83 Page 70 of 100 The stencil design illustrated in Figure 40 s recommended by Thales as a result of extensive tests with Thales Daisy Chain modules. The central ground pads are primarily intended for stabilizing purposes, and may show some more voids than the application interface pads at the module's rim. This is acceptable, since they are electrically irrelevant. Figure 40: Recommended design for 110m thick stencil for TN23-W (top view) t TN23-W_HID_v00.028 Confidential / Preliminary 2022-07-14 Cinterion TN23-W Hardware Interface Description 4.2 Mounting TN23-W onto the Application Platform 83 4.2.1.2 Board Level Characterization Page 71 of 100 Board level characterization issues should also be taken into account if devising an SMT pro-

cess. Characterization tests should attempt to optimize the SMT process with regard to board level reliability. This can be done by performing the following physical tests on sample boards: Peel test, bend test, tensile pull test, drop shock test and temperature cycling. Sample surface mount checks are described in [4]. It is recommended to characterize land patterns before an actual PCB production, taking indi-

vidual processes, materials, equipment, stencil design, and reflow profile into account. For land and stencil pattern design recommendations see also Section 4.2.1.1. Optimizing the solder stencil pattern design and print process is necessary to ensure print uniformity, to decrease sol-

der voids, and to increase board level reliability. Daisy chain modules for SMT characterization are available on request. For details refer to [4]. Generally, solder paste manufacturer recommendations for screen printing process parame-

ters and reflow profile conditions should be followed. Maximum ratings are described in Section 4.2.3. 4.2.2 Moisture Sensitivity Level TN23-W comprises components that are susceptible to damage induced by absorbed mois-

ture. Thaless TN23-W module complies with the latest revision of the IPC/JEDEC J-STD-020 Stan-

dard for moisture sensitive surface mount devices and is classified as MSL 4. For additional moisture sensitivity level (MSL) related information see Section 4.2.4 and Sec-

tion 4.3.2. t TN23-W_HID_v00.028 Confidential / Preliminary 2022-07-14 Cinterion TN23-W Hardware Interface Description 4.2 Mounting TN23-W onto the Application Platform 83 Page 72 of 100 4.2.3 Soldering Conditions and Temperature 4.2.3.1 Reflow Profile TP TL e r u t a r e p m e T tL TSmax TSmin tS Preheat t to maximum Time Figure 41: Reflow Profile Table 18: Reflow temperature ratings1 Profile Feature Pb-Free Assembly Preheat & Soak Temperature Minimum (TSmin) Temperature Maximum (TSmax) Time (tSmin to tSmax) (tS) Average ramp up rate (TSmax to TP) Liquidous temperature (TL) Time at liquidous (tL) Peak package body temperature (TP) Time (tP) within 5 C of the peak package body temperature (TP) 150C 180C 60-120 seconds 3K/second max. 217C 50-90 seconds 245C +0/-5C 30 seconds max. Limited ramp-down rate (Tp-200C) Average ramp-down rate from 200C 1K/second max. 3K-6K/second max. Time 25C to maximum temperature 8 minutes max. 1. Please note that the reflow profile features and ratings listed above are based on the joint industry stan-

dard IPC/JEDEC J-STD-020D.1, and are as such meant as a general guideline. For more information on reflow profiles and their optimization please refer to [4]. t TN23-W_HID_v00.028 Confidential / Preliminary 2022-07-14 Cinterion TN23-W Hardware Interface Description 4.2 Mounting TN23-W onto the Application Platform 83 Page 73 of 100 4.2.3.2 Maximum Temperature and Duration The following limits are recommended for the SMT board-level soldering process to attach the module:

A maximum module temperature of 245C. This specifies the temperature as measured at the modules top side. A maximum duration of 15 seconds at this temperature. Please note that while the solder paste manufacturers' recommendations for best temperature and duration for solder reflow should generally be followed, the limits listed above must not be exceeded. TN23-W is specified for one soldering cycle only. Once TN23-W is removed from the applica-

tion, the module will very likely be destroyed and cannot be soldered onto another application. t TN23-W_HID_v00.028 Confidential / Preliminary 2022-07-14 Cinterion TN23-W Hardware Interface Description 4.2 Mounting TN23-W onto the Application Platform 83 4.2.4 Durability and Mechanical Handling 4.2.4.1 Storage Conditions Page 74 of 100 TN23-W modules, as delivered in tape and reel carriers, must be stored in sealed, moisture bar-

rier anti-static bags. The conditions stated below are only valid for modules in their original packed state in weather protected, non-temperature-controlled storage locations. Normal stor-

age time under these conditions is 12 months maximum. Table 19: Storage conditions Type Condition Unit Reference Air temperature: Low High Humidity relative: Low High

-25

+40 10 90 at 40C Air pressure: Low High Movement of surrounding air 70 106 1.0 Water: rain, dripping, icing and frosting Not allowed C

kPa m/s

IPC/JEDEC J-STD-033A IPC/JEDEC J-STD-033A IEC TR 60271-3-1: 1K4 IEC TR 60271-3-1: 1K4 IEC TR 60271-3-1: 1K4

Radiation:

Solar Heat 1120 600 W/m2 ETS 300 019-2-1: T1.2, IEC 60068-2-2 Bb ETS 300 019-2-1: T1.2, IEC 60068-2-2 Bb Chemically active substances Not recommended IEC TR 60271-3-1: 1C1L Mechanically active substances Not IEC TR 60271-3-1: 1S1 Vibration sinusoidal:

Displacement Acceleration Frequency range Shocks:

Shock spectrum Duration Acceleration recommended 1.5 5 2-9 9-200 mm m/s2 Hz semi-sinusoidal 1 50 ms m/s2 IEC TR 60271-3-1: 1M2 IEC 60068-2-27 Ea t TN23-W_HID_v00.028 Confidential / Preliminary 2022-07-14 Cinterion TN23-W Hardware Interface Description 4.2 Mounting TN23-W onto the Application Platform 83 4.2.4.2 Processing Life Page 75 of 100 TN23-W must be soldered to an application within 72 hours after opening the moisture barrier bag (MBB) it was stored in. As specified in the IPC/JEDEC J-STD-033 Standard, the manufacturing site processing the modules should have ambient temperatures below 30C and a relative humidity below 60%. 4.2.4.3 Baking Baking conditions are specified on the moisture sensitivity label attached to each MBB (see Figure 47 for details):

It is not necessary to bake TN23-W, if the conditions specified in Section 4.2.4.1 and Sec-

tion 4.2.4.2 were not exceeded. It is necessary to bake TN23-W, if any condition specified in Section 4.2.4.1 and Section 4.2.4.2 was exceeded. If baking is necessary, the modules must be put into trays that can be baked to at least 125C. Devices should not be baked in tape and reel carriers at any temperature. 4.2.4.4 Electrostatic Discharge Electrostatic discharge (ESD) may lead to irreversible damage for the module. It is therefore advisable to develop measures and methods to counter ESD and to use these to control the electrostatic environment at manufacturing sites. Please refer to Section 3.6 for further information on electrostatic discharge. t TN23-W_HID_v00.028 Confidential / Preliminary 2022-07-14 Cinterion TN23-W Hardware Interface Description 4.3 Packaging 83 Page 76 of 100 4.3 Packaging 4.3.1 Tape and Reel The single-feed tape carrier for TN23-W is illustrated in Figure 42. The figure also shows the proper part orientation. The tape width is 32mm and the TN23-W modules are placed on the tape with a 20mm pitch. The reels are 330mm in diameter with a core diameter of 77.50mm. Each reel contains 900 modules. 4.3.1.1 Orientation E:

P1:

P0:

P2:

D0:

F

W

0 S D1:

D1:

A0:

K0:

0 B T:

Figure 42: Carrier tape t TN23-W_HID_v00.028 Confidential / Preliminary 2022-07-14 Cinterion TN23-W Hardware Interface Description 4.3 Packaging 83 Page 77 of 100 Reel direction of the completely equipped tape Direction into SMD machine View direction Pad B7 Pad B7 32 mm 330 mm Figure 43: Reel direction 4.3.1.2 Barcode Label A barcode label provides detailed information on the tape and its contents. It is attached to the reel. Barcode label Figure 44: Barcode label on tape reel (generic photo) t TN23-W_HID_v00.028 Confidential / Preliminary 2022-07-14 Cinterion TN23-W Hardware Interface Description 4.3 Packaging 83 Page 78 of 100 Figure 45: Barcode label on tape reel - layout Variables on the label are explained in Table 20. t TN23-W_HID_v00.028 Confidential / Preliminary 2022-07-14 Cinterion TN23-W Hardware Interface Description 4.3 Packaging 83 4.3.2 Shipping Materials Page 79 of 100 TN23-W is distributed in tape and reel carriers. The tape and reel carriers used to distribute TN23-W are packed as described below, including the following required shipping materials:

Moisture barrier bag, including desiccant and humidity indicator card Transportation box 4.3.2.1 Moisture Barrier Bag The tape reels are stored inside a moisture barrier bag (MBB), together with a humidity indica-

tor card and desiccant pouches - see Figure 46. The bag is ESD protected and delimits mois-

ture transmission. It is vacuum-sealed and should be handled carefully to avoid puncturing or tearing. The bag protects the TN23-W modules from moisture exposure. It should not be opened until the devices are ready to be soldered onto the application. Figure 46: Moisture barrier bag (MBB) with imprint The label shown in Figure 47 summarizes requirements regarding moisture sensitivity, includ-

ing shelf life and baking requirements. It is attached to the outside of the moisture barrier bag. Variables on the label are explained in Table 20. t TN23-W_HID_v00.028 Confidential / Preliminary 2022-07-14 Cinterion TN23-W Hardware Interface Description 4.3 Packaging 83 Page 80 of 100 Figure 47: Moisture Sensitivity Label t TN23-W_HID_v00.028 Confidential / Preliminary 2022-07-14 Cinterion TN23-W Hardware Interface Description 4.3 Packaging 83 Page 81 of 100 MBBs contain one or more desiccant pouches to absorb moisture that may be in the bag. The humidity indicator card described below should be used to determine whether the enclosed components have absorbed an excessive amount of moisture. The desiccant pouches should not be baked or reused once removed from the MBB. The humidity indicator card is a moisture indicator and is included in the MBB to show the ap-

proximate relative humidity level within the bag. Sample humidity cards are shown in Figure 48. If the components have been exposed to moisture above the recommended limits, the units will have to be rebaked. Figure 48: Humidity Indicator Card - HIC A baking is required if the humidity indicator inside the bag indicates 10% RH or more. t TN23-W_HID_v00.028 Confidential / Preliminary 2022-07-14 Cinterion TN23-W Hardware Interface Description 4.3 Packaging 83 4.3.2.2 Transportation Box Page 82 of 100 Tape and reel carriers are distributed in a box, marked with a barcode label for identification purposes. A box contains two reels with 500 modules each. 1 2 4 5 6 7 12 13 3 8 9 10 11 14 Figure 49: Sample of VP box label Table 20: VP Box label information No. Information 1 2 3 4 5 6 7 8 9 10 11 12 13 14 Cinterion logo Product name Product ordering number Package ID number of VP box (format may vary depending on the product) Package ID barcode (Code 128) Package ID Reel 1 (format may vary depending on the product) Package ID Reel 2 (format may vary depending on the product) Quantity of the modules inside the VP box (max. 1800 pcs) Country of production Der Grne Punkt (Green Dot) symbol Chinese RoHS symbol CE logo (CE mark on VP box label is present only for modules with CE imprinted on the shielding) European Article Number (EAN-13) barcode European Article Number, consists of 13 digits (EAN-13) t TN23-W_HID_v00.028 Confidential / Preliminary 2022-07-14 Cinterion TN23-W Hardware Interface Description 4.3 Packaging 83 Page 83 of 100 4.3.3 Trays If small module quantities are required, e.g., for test and evaluation purposes, TN23-W may be distributed in trays (see Figure 50). The small quantity trays are an alternative to the single-feed tape carriers normally used. However, the trays are not designed for machine processing. They contain modules to be (hand) soldered onto an external application Trays are packed and shipped in the same way as tape carriers, including a moisture barrier bag with desiccant and humidity indicator card as well as a transportation box (see also Section 4.3.2). Figure 50: Tray to ship odd module amounts t TN23-W_HID_v00.028 Confidential / Preliminary 2022-07-14 Cinterion TN23-W Hardware Interface Description 5 Regulatory and Type Approval Information 90 Page 84 of 100 5 Regulatory and Type Approval Information 5.1 Directives and Standards TN23-W is designed to comply with the directives and standards listed below. It is the responsibility of the application manufacturer to ensure compliance of the final product with all provisions of the applicable directives and standards as well as with the technical spec-

ifications provided in the "Cinterion TN23-W Hardware Interface Description".1 Table 21: Directives 2014/53/EU Directive of the European Parliament and of the Council of 16 April 2014 on the harmonisation of the laws of the Member States relating to the mak-

ing available on the market of radio equipment and repealing Directive 1999/5/EC. The product is labeled with the CE conformity mark 2002/95/EC (RoHS 1) 2011/65/EC (RoHS 2) 2015/863/EC (RoHS 3) Directive of the European Parliament and of the Council of 27 January 2003 (revised on 8 June 2011, and amended on 4 June 2015) on the restriction of the use of certain haz-

ardous substances in electrical and electronic equipment

(RoHS) 1907/2006/EC (REACH) Regulation (EC) No 1907/2006 of the European Parliament and of the Council of 18 December 2006 concerning the Registration, Evaluation, Authorisation and Restriction of Chemicals (REACH), establishing a Euro-

pean Chemicals Agency, amending Directive 1999/45/EC and repealing Council Regulation (EEC) No 793/93 and Commission Regulation (EC) No 1488/94 as well as Council Directive 76/769/EEC and Commission Direc-

tives 91/155/EEC, 93/67/EEC, 93/105/EC and 2000/21/EC. Cinterion modules comply with the REACH regulation that specifies a content of less than 0.1% per substance mentioned in the SVHC candidate list (Release 16.06.2014). Table 22: Standards of North American type approval CFR Title 47 Code of Federal Regulations, Part 22, Part 24, Part 27, and Part 90;

US Equipment Authorization FCC OET Bulletin 65

(Edition 97-01) Evaluating Compliance with FCC Guidelines for Human Exposure to Radiofrequency Electromagnetic Fields Table 23: Standards of European type approval ETSI EN 301 908-1 V13.1.1 IMT cellular networks; Harmonised Standard for access to radio spectrum;

Part 1: Introduction and common requirements; 2019-11 ETSI EN 301 908-13 V13.1.1 IMT cellular networks; Harmonised Standard for access to radio spectrum;

Part 13: Evolved Universal Terrestrial Radio Access (E-UTRA); User Equip-

ment (UE); 2019-11 ETSI EN 301 489-1 V2.2.3 ElectroMagnetic Compatibility (EMC) standard for radio equipment and ser-

vices; Part 1: Common technical requirements; Harmonised Standard for ElectroMagnetic Compatibility; 2019-11 1. Manufacturers of applications which can be used in the US shall ensure that their applications have a PTCRB approval. t TN23-W_HID_v00.028 Confidential / Preliminary 2022-07-14 Cinterion TN23-W Hardware Interface Description 5.1 Directives and Standards 90 Table 23: Standards of European type approval Page 85 of 100 ETSI EN 301489-17 V3.2.4 ElectroMagnetic Compatibility (EMC) standard for radio equipment and ser-

vices; Part 17: Specific conditions for Broadband Data Transmission Sys-

tems; Harmonised Standard for ElectroMagnetic Compatibility; 2020-09 EN 62368-1:2014

+A11:2017 Audio/video, information and communication technology equipment - Part 1: Safety requirements Table 24: Requirements of quality IEC 60068 Environmental testing DIN EN 60529 IP codes EN IEC 62311:2020 Assessment of electronic and electrical equipment related to human expo-

sure restrictions for electromagnetic fields (0 Hz - 300 GHz) 5.1.1 IEC 62368-1 Classification With respect to the safety requirements for audio/video, information and communication tech-

nology equipment defined by the hazard based product safety standard for ICT and AV equip-

ment - i.e., IEC-62368-1 (EN 62368-1, UL 62368-1) - Cinterion modules are classified as shown below:

Standalone operation of the modules is not possible. Modules will always be incorporated in an external application (Customer Product). Customer understands and is responsible that the product incorporating the Cinterion module must be designed to be compliant with IEC-62368-1 (EN 62368-1, UL 62368-1) to ensure pro-

tection against hazards and injuries. When operating the Cinterion module the external appli-

cation (Customer Product) must provide safeguards not to exceed the power limits given by classification to Power Source Class 1 (15 Watts) under normal operating conditions, abnormal conditions, or in the presence of a single fault. When using a battery power supply the external application must provide safeguards not to exceed the limits defined by PS-1, as well. The ex-

ternal application (Customer Product) must take measures to limit the power, the voltage or the current, respectively, if required, and must provide safeguards to protect ordinary persons against pain or injury caused by the voltage/current. In case of a usage of the Cinterion module not in accordance with the specifications or in sin-

gle fault condition the external application (Customer Product) must be capable to withstand levels according to ES-1 / PS-1 also on all ports that are initially intended for signaling or audio, e.g., USB, RS-232, GPIOs, SPI, earphone and microphone interfaces. In addition, the external application (Customer Product) must be designed in a way to distribute thermal energy generated by the intended operation of the Cinterion module. In case of high temperature operation, the external application must provide safeguards to protect ordinary persons against pain or injury caused by the heat. t TN23-W_HID_v00.028 Confidential / Preliminary 2022-07-14 Cinterion TN23-W Hardware Interface Description 5.1 Directives and Standards 90 Page 86 of 100 Table 25: IEC 62368-1 Classification Source of Energy Electrical energy source Class ES-1 Power Source

(potential ignition source caus-

ing fire) PS-1 Hazardous Substances, Chemical reaction

Kinetic / mechanical energy source MS-1 Thermal energy source TS-2 Radiated energy source RS-1 Limits The Cinterion modules contain no electrical energy source - especially no battery. The electri-

cal components and circuits have to be externally power supplied:

DC either smaller 60 V Or less than 2 mA AC up to 1kHz smaller 30 V-rms or 42.4 V peak AC above 100kHz smaller 70 V rms Power source provided by the external application must not exceed 15W, even under worst case and any single fault condition defined by IEC-62368-1:

Section 6.2.2.3. Under regular conditions, the Cinterion module does not contain any chemically reactive sub-

stances, and no chemical energy source, espe-

cially no battery. Module is compliant with RoHS and REACH (see above). In very rare cases however - under abnormal con-

ditions (i.e. wrong supply voltage, burned module) or in the presence of single electrical component faults (i.e. shortcut) - health hazardous sub-

stances might be released if the worst comes to the worst. The Cinterion modules have no sharp edges and corners, no moving parts, no loosing, exploding or imploding parts. The mass is well below 1kg. Under normal operating conditions, abnormal operating conditions or single fault conditions the temperature does not exceed +100C on the metal surface (shielding) The Cinterion module does not contain a radiant energy source, any lasers, lamps, LEDs, X-Ray emitting components or acoustic couplers. t TN23-W_HID_v00.028 Confidential / Preliminary 2022-07-14 Cinterion TN23-W Hardware Interface Description 5.2 SAR requirements specific to portable mobiles 90 Page 87 of 100 5.2 SAR requirements specific to portable mobiles Mobile phones, PDAs or other portable transmitters and receivers incorporating a module must be in accordance with the guidelines for human exposure to radio frequency energy. This re-

quires the Specific Absorption Rate (SAR) of portable TN23-W based applications to be eval-

uated and approved for compliance with national and/or international regulations. Since the SAR value varies significantly with the individual product design manufacturers are advised to submit their product for approval if designed for portable use. For European and US markets the relevant directives are mentioned below. The manufacturer of the end device is in the responsibility to provide clear installation and operating instructions for the user, including the minimum separation distance required to maintain compliance with SAR and/or RF field strength limits, as well as any special usage conditions required to do so, such as a required accessory, the proper orientation of the device, the max antenna gain for detachable antennas, or other relevant criteria. It is the responsibility of the manufacturer of the final product to verify whether or not further standards, recommendations or directives are in force outside these ar-

eas. Products intended for sale on US markets ES 59005/ANSI C95.1 Considerations for evaluation of human exposure to Electromagnetic Fields (EMFs) from Mobile Telecommunication Equipment (MTE) in the frequency range 30MHz - 6GHz Products intended for sale on European markets EN 50360 Product standard to demonstrate the compliance of mobile phones with the basic restrictions related to human exposure to electromagnetic fields (300MHz - 3GHz) EN 62311:2020 Assessment of electronic and electrical equipment related to human expo-sure restrictions for electromagnetic fields (0 Hz - 300 GHz) Please note that SAR requirements are specific only for portable devices and not for mobile devices as defined below:

Portable device:

A portable device is defined as a transmitting device designed to be used so that the radi-

ating structure(s) of the device is/are within 20 centimeters of the body of the user. Mobile device:

A mobile device is defined as a transmitting device designed to be used in other than fixed locations and to generally be used in such a way that a separation distance of at least 20 centimeters is normally maintained between the transmitter's radiating structure(s) and the body of the user or nearby persons. In this context, the term ''fixed location'' means that the device is physically secured at one location and is not able to be easily moved to another location. t TN23-W_HID_v00.028 Confidential / Preliminary 2022-07-14 Cinterion TN23-W Hardware Interface Description 5.3 Reference Equipment for Type Approval 90 Page 88 of 100 5.3 Reference Equipment for Type Approval The Thales reference setup submitted to type approve TN23-W (including a special approval adapter for the DSB75) is shown in the following figure:

LTE Base Station Main Antenna ASC0 ASC1 PC Power Supply DSB75 Adapter SIM Card SMA SMA SMA USB DSB75 Eval_Board Eval_Board TN23W TN23W Figure 51: Reference equipment for type approval t TN23-W_HID_v00.028 Confidential / Preliminary 2022-07-14 Cinterion TN23-W Hardware Interface Description 5.4 Compliance with FCC Rules and Regulations 90 Page 89 of 100 5.4 Compliance with FCC Rules and Regulations The Equipment Authorization Certification for the Thales reference application described in Section 5.3 will be registered under the following identifiers:

FCC Identifier: QIPTN23-W Granted to THALES DIS AIS Deutschland GmbH Note: Manufacturers of mobile or fixed devices incorporating TN23-W modules are authorized to use the FCC Grant of the TN23-W modules for their own final products according to the con-

ditions referenced in these documents. In this case, an FCC label of the module shall be visible from the outside, or the host device shall bear a second label stating "Contains FCC ID:

QIPTN23-W". The integration is limited to fixed or mobile categorized host devices, where a sep-

aration distance between the antenna and any person of min. 20cm can be assured during nor-

mal operating conditions. For mobile and fixed operation configurations the antenna gain, including cable loss, must not exceed the limits listed in the following Table 26 for FCC. Table 26: Antenna gain limits for FCC for TN23-W Maximum gain in operating band FCC limit Unit LTE Cat NB1/2 Band 2 LTE Cat NB1/2 Band 4 LTE Cat NB1/2 Band 5 LTE Cat NB1/2 Band 12 LTE Cat NB1/2 Band 13 LTE Cat NB1/2 Band 17 LTE Cat NB1/2 Band 18 LTE Cat NB1/2 Band 19 LTE Cat NB1/2 Band 25 LTE Cat NB1/2 Band 26 LTE Cat NB1/2 Band 66 LTE Cat NB1/2 Band 71 9.78 6.64 10.94 10.19 10.87 9.78 10.30 10.42 9.78 10.80 6.55 10.26 dBi dBi dBi dBi dBi dBi dBi dBi dBi dBi dBi dBi t TN23-W_HID_v00.028 Confidential / Preliminary 2022-07-14 Cinterion TN23-W Hardware Interface Description 5.4 Compliance with FCC Rules and Regulations 90 Page 90 of 100 IMPORTANT:

Manufacturers of portable applications incorporating TN23-W modules are required to have their final product certified and apply for their own FCC Grant related to the specific portable mobile. This is mandatory to meet the SAR requirements for portable mobiles (see Section 5.2 for detail). Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. Manufactures/OEM integrators must ensure that the final user documentation does not contain any information on how to install or remove the module from final product. The manufactures/

OEM user manual shall include all required regulatory information/warnings as shown in this manual. Note: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. The final product (i.e., host/module combination) may also need to be evaluated against the FCC Part 15B criteria for unintentional radiators in order to be properly authorized for operation as a Part 15 digital device. These limits are de-

signed to provide reasonable protection against harmful interference in a residential installa-

tion. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

Reorient or relocate the receiving antenna. Connect the equipment into an outlet on a circuit different from that to which the receiver is Increase the separation between the equipment and receiver. connected. Consult the dealer or an experienced radio/TV technician for help. FCC Part 15.19 Warning Statement THIS DEVICE COMPLIES WITH PART 15 OF THE FCC RULES. OPERATION IS SUBJECT TO THE FOLLOWING TWO CONDITIONS: (1) THIS DEVICE MAY NOT CAUSE HARMFUL INTERFERENCE, AND (2) THIS DEVICE MUST ACCEPT ANY INTERFERENCE RE-

CEIVED, INCLUDING INTERFERENCE THAT MAY CAUSE UNDESIRED OPERATION. t TN23-W_HID_v00.028 Confidential / Preliminary 2022-07-14 Cinterion TN23-W Hardware Interface Description 6 Document Information 96 6 Document Information 6.1 Revision History Page 91 of 100 Preceding document: "Cinterion TN23-W Hardware Interface Description" v00.003 New document: "Cinterion TN23-W Hardware Interface Description" v00.028 Chapter What is new Throughout document Removed support for PSM Indicator/SUSPEND_MON signal. 1.2 Added note regarding channel support for LTE Cat NB1/2 bands. 3.2.4.1 Added Figure 32 showing switch off timing behavior. 3.4.1 3.8 4.2.3.1 4.3.1.1 4.3.3 5.1 5.3 5.4 Revised PSM current consumption rating in Table 12. Updated Table 17 listing reliability characteristics. Revised reflow profile. Revised section on tape&reel orientation. Revised section on trays. Added directives and standards TN23-W complies with. Added Figure 51 showing reference equipment for TN23-W Updated section describing compliance with FCC rules and regulations. Preceding document: "Cinterion TN23-W Hardware Interface Description" v00.002 New document: "Cinterion TN23-W Hardware Interface Description" v00.003 Chapter What is new 1.2 1.4 2.1.8 3.2.1 3.2.2.2 3.4.1 3.5 3.6 3.6.1 7.1 Revised module weight. Updated operating temperature range. Added remark regarding discharging of BATT+BB. Revised Figure 2 (block diagram). Revised Figure 13 (I2C interface). Revised ON timings shown in Figure 29 and Figure 30. Revised Figure 31 (emergency restart timing). Added power supply ratings. Updated operating temperature range. Updated Table 15 (ESD values). Completed Figure 34 (ESD protection for RF interface). Updated ordering information. t TN23-W_HID_v00.028 Confidential / Preliminary 2022-07-14 Cinterion TN23-W Hardware Interface Description 6.2 Related Documents 96 Page 92 of 100 Preceding document: "Cinterion TN23-W Hardware Interface Description" v00.001 New document: "Cinterion TN23-W Hardware Interface Description" v00.002 Chapter What is new 4.2 Added note regarding placement of external components. New document: "Cinterion TN23-W Hardware Interface Description" v00.001 Chapter What is new

Initial document setup. 6.2 Related Documents

[1] TN23-W AT Command Set

[2] TN23-W Release Note

[3] Application Note 40: Thermal Solutions - TBD.

[4] Application Note 48: SMT Module Integration - TBD.

[5] Differences between Selected Cinterion Modules, Hardware Migration Guide - TBD.

[6] Cinterion IoT Module Services User Guide - TBD.

[7] Cinterion IoT SDK User Guide - TBD. 6.3 Terms and Abbreviations Abbreviation Description ADC AGC ANSI Analog-to-digital converter Automatic Gain Control American National Standards Institute ARFCN Absolute Radio Frequency Channel Number ARP Antenna Reference Point ASC0/ASC1 Asynchronous Controller. Abbreviations used for first and second serial interface of TN23-W B BER BTS Thermistor Constant Bit Error Rate Base Transceiver Station CB or CBM Cell Broadcast Message CE CHAP CPU CS Conformit Europene (European Conformity) Challenge Handshake Authentication Protocol Central Processing Unit Coding Scheme t TN23-W_HID_v00.028 Confidential / Preliminary 2022-07-14 Cinterion TN23-W Hardware Interface Description 6.3 Terms and Abbreviations 96 Page 93 of 100 Abbreviation Description CSD CTS DAC DAI dBm0 DCE Circuit Switched Data Clear to Send Digital-to-Analog Converter Digital Audio Interface Digital level, 3.14dBm0 corresponds to full scale, see ITU G.711, A-law Data Communication Equipment (typically modems, e.g. Thales module) DCS 1800 Digital Cellular System, also referred to as PCN DRX DSB DSP DSR DTE DTR DTX EFR EGSM EIRP EMC EMI ERP ESD ETS FCC FDMA FR GMSK GPRS GSM HiZ HR I/O IC IMEI ISO ITU kbps LED Discontinuous Reception Development Support Box Digital Signal Processor Data Set Ready Data Terminal Equipment (typically computer, terminal, printer or, for example, GSM application) Data Terminal Ready Discontinuous Transmission Enhanced Full Rate Enhanced GSM Equivalent Isotropic Radiated Power Electromagnetic Compatibility Electromagnetic Interference Effective Radiated Power Electrostatic Discharge European Telecommunication Standard Federal Communications Commission (U.S.) Frequency Division Multiple Access Full Rate Gaussian Minimum Shift Keying General Packet Radio Service Global Standard for Mobile Communications High Impedance Half Rate Input/Output Integrated Circuit International Mobile Equipment Identity International Standards Organization International Telecommunications Union kbits per second Light Emitting Diode t TN23-W_HID_v00.028 Confidential / Preliminary 2022-07-14 Cinterion TN23-W Hardware Interface Description 6.3 Terms and Abbreviations 96 Page 94 of 100 Abbreviation Description Li-Ion/Li+

Li battery LPM Mbps MMI MO MS Lithium-Ion Rechargeable Lithium Ion or Lithium Polymer battery Link Power Management Mbits per second Man Machine Interface Mobile Originated Mobile Station (GSM module), also referred to as TE MSISDN Mobile Station International ISDN number MT NTC OEM PA PAP Mobile Terminated Negative Temperature Coefficient Original Equipment Manufacturer Power Amplifier Password Authentication Protocol PBCCH Packet Switched Broadcast Control Channel PCB PCL PCM PCN PDU PLL PPP PSK PSU Printed Circuit Board Power Control Level Pulse Code Modulation Personal Communications Network, also referred to as DCS 1800 Protocol Data Unit Phase Locked Loop Point-to-point protocol Phase Shift Keying Power Supply Unit R&TTE Radio and Telecommunication Terminal Equipment RAM RF RLS RMS RoHS ROM RTC RTS Rx SAR SELV SIM SMD Random Access Memory Radio Frequency Radio Link Stability Root Mean Square (value) Restriction of the use of certain hazardous substances in electrical and electronic equipment. Read-only Memory Real Time Clock Request to Send Receive Direction Specific Absorption Rate Safety Extra Low Voltage Subscriber Identification Module Surface Mount Device t TN23-W_HID_v00.028 Confidential / Preliminary 2022-07-14 Cinterion TN23-W Hardware Interface Description 6.3 Terms and Abbreviations 96 Page 95 of 100 Abbreviation Description SMS SMT SPI Short Message Service Surface Mount Technology Serial Peripheral Interface SRAM Static Random Access Memory TA TE TLS Tx UART URC Terminal adapter (e.g. GSM module) Terminal Equipment, also referred to as DTE Transport Layer Security Transmit Direction Universal asynchronous receiver-transmitter Unsolicited Result Code t TN23-W_HID_v00.028 Confidential / Preliminary 2022-07-14 Cinterion TN23-W Hardware Interface Description 6.4 Safety Precaution Notes 96 6.4 Safety Precaution Notes Page 96 of 100 The following safety precautions must be observed during all phases of the operation, usage, service or repair of any cellular terminal or mobile incorporating TN23-W. Manufacturers of the cellular terminal are advised to convey the following safety information to users and operating personnel and to incorporate these guidelines into all manuals supplied with the product. Fail-

ure to comply with these precautions violates safety standards of design, manufacture and in-

tended use of the product. Thales assumes no liability for customers failure to comply with these precautions. When in a hospital or other health care facility, observe the restrictions on the use of mobiles. Switch the cellular terminal or mobile off, if instructed to do so by the guide-

lines posted in sensitive areas. Medical equipment may be sensitive to RF energy. The operation of cardiac pacemakers, other implanted medical equipment and hear-

ing aids can be affected by interference from cellular terminals or mobiles placed close to the device. If in doubt about potential danger, contact the physician or the manufac-

turer of the device to verify that the equipment is properly shielded. Pacemaker patients are advised to keep their hand-held mobile away from the pacemaker, while it is on. Switch off the cellular terminal or mobile before boarding an aircraft. Make sure it can-

not be switched on inadvertently. The operation of wireless appliances in an aircraft is forbidden to prevent interference with communications systems. Failure to observe these instructions may lead to the suspension or denial of cellular services to the offender, legal action, or both. Do not operate the cellular terminal or mobile in the presence of flammable gases or fumes. Switch off the cellular terminal when you are near petrol stations, fuel depots, chemical plants or where blasting operations are in progress. Operation of any elec-

trical equipment in potentially explosive atmospheres can constitute a safety hazard. Your cellular terminal or mobile receives and transmits radio frequency energy while switched on. Remember that interference can occur if it is used close to TV sets, radios, computers or inadequately shielded equipment. Follow any special regulations and always switch off the cellular terminal or mobile wherever forbidden, or when you suspect that it may cause interference or danger. Road safety comes first! Do not use a hand-held cellular terminal or mobile when driv-

ing a vehicle, unless it is securely mounted in a holder for speakerphone operation. Before making a call with a hand-held terminal or mobile, park the vehicle. Speakerphones must be installed by qualified personnel. Faulty installation or opera-

tion can constitute a safety hazard. IMPORTANT!

Cellular terminals or mobiles operate using radio signals and cellular networks. Because of this, connection cannot be guaranteed at all times under all conditions. Therefore, you should never rely solely upon any wireless device for essential com-

munications, for example emergency calls. Remember, in order to make or receive calls, the cellular terminal or mobile must be switched on and in a service area with adequate cellular signal strength. Some networks do not allow for emergency calls if certain network services or phone features are in use (e.g. lock functions, fixed dialing etc.). You may need to deactivate those features before you can make an emergency call. Some networks require that a valid SIM card be properly inserted in the cellular termi-

nal or mobile. t TN23-W_HID_v00.028 Confidential / Preliminary 2022-07-14 Cinterion TN23-W Hardware Interface Description 7 Appendix 99 Page 97 of 100 7 Appendix 7.1 List of Parts and Accessories Table 27: List of parts and accessories Description TN23-W Supplier Ordering information Thales Standard module Thales IMEI:

Packaging unit (ordering) number: L30960-N7200-A100. Module label number1: S30960-S7200-A100 Customer IMEI mode:

Packaging unit (ordering) number: L30960-N7200-A100. Module label number1: S30960-S7200-A100 DSB75 Evaluation Kit DSB Mini Compact Evaluation Board Thales Thales Ordering number: L36880-N8811-A100 Ordering number: L30960-N0030-A100 LGA DevKit Thales LGA DevKit consists of Cinterion LGA DevKit T Base PCB:

Ordering number: L30960-N0113-A100 Cinterion LGA DevKit Socket T:

Ordering number: L30960-N0114-A100 EVAL DSB Adapter for mounting TN23-W evalua-

tion modules onto DSB75 Thales TBD. SIM card holder incl. push button ejector and slide-in tray Molex Ordering numbers: 91228 91236 Sales contacts are listed in Table 28. 1. Note: At the discretion of Thales, module label information can either be laser engraved on the modules shielding or be printed on a label adhered to the modules shielding. t TN23-W_HID_v00.028 Confidential / Preliminary 2022-07-14 Cinterion TN23-W Hardware Interface Description 7.1 List of Parts and Accessories 99 Table 28: Molex sales contacts (subject to change) Page 98 of 100 Molex For further information please click:

http://www.molex.com Molex China Distributors Beijing, Room 1311, Tower B, COFCO Plaza No. 8, Jian Guo Men Nei Street, 100005 Beijing P.R. China Phone: +86-10-6526-9628 Fax: +86-10-6526-9730 Molex Deutschland GmbH Otto-Hahn-Str. 1b 69190 Walldorf Germany Phone: +49-6227-3091-0 Fax: +49-6227-3091-8100 Email: mxgermany@molex.com Molex Singapore Pte. Ltd. 110, International Road Jurong Town, Singapore 629174 American Headquarters Lisle, Illinois 60532 U.S.A. Phone: +1-800-78MOLEX Fax: +1-630-969-1352 Molex Japan Co. Ltd. 1-5-4 Fukami-Higashi, Yamato-City, Kanagawa, 242-8585 Japan Phone: +65-6-268-6868 Fax: +65-6-265-6044 Phone: +81-46-265-2325 Fax: +81-46-265-2365 t TN23-W_HID_v00.028 Confidential / Preliminary 2022-07-14 Cinterion TN23-W Hardware Interface Description 7.2 Module Label Information 99 7.2 Module Label Information Page 99 of 100 The label engraved on the top of TN23-W comprises the following information1. 1 4 5 6 7 Made in China S30960-S7200-A100-1 Model: TN23-W Not For Sale 11111111 222222 3 DC Figure 52: TN23-W label 2 3 8 Table 29: TN23-W label information No. 1 2 3 4 5 6 7 8 Cinterion logo Manufacturing country (e.g., Made in China) Factory code Product name/variant (e.g., TN23-W) Product order code Manufacturer 2D barcode Product IMEI 2-digit date code of product production (for decoding see Table 30 below) Table 30: Date code table Date Code Code L M N P R S T U V W X A Year 2019 2020 2021 2022 2023 2024 2025 2026 2027 2028 2029 2030 Code 1 2 3 4 5 6 7 8 9 O N D Month Jan. Feb. Mar. Apr. May June July Aug. Sept. Oct. Nov. Dec. 1. To be continued - Revised full label information will be available with a next document version. t TN23-W_HID_v00.028 Confidential / Preliminary 2022-07-14 100 THALES DIS AIS Deutschland GmbH Werinherstrasse 81 81541 Munich Germany

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THALES DIS AIS Deutschland GmbH Siemensdamm 50 13629 Berlin Germany THALES DIS AIS Deutschland GmbH Federal Communications Commission Equipment Authorization Division, Application Processing Branch 7435 Oakland Mills Road Columbia MD 21046 USA Siemensdamm 50 13629 Berlin Germany Contact person: Axel Heike E-mail: axel.heike@thalesgroup.com Tel: +49 30 31102-8146 16 March 2022 Ref: Agent letter for FCC ID: QIPTN23-W We, hereby authorize THALES DIS AIS Deutschland GmbH Siemensdamm 50 13629 Berlin Germany DEKRA Testing and Certification (Suzhou) Co., Ltd. No.99 Hongye Rd., Suzhou Industrial Park, Suzhou, 215006, Jiangsu, China Tim Cao E-mail: tim.cao@dekra.com, Tel: +86 15062691634 to act as our agent in the preparation of this application for equipment certification, including the signing of all documents relating to these matters. The present authorization considers the development of documents on behalf of the client, written under his own letterhead and related to the necessary information to be provided on his behalf to complete the certification process. We declare that our authorized agent is allowed to forward all information related to the approval and certification of equipment to the regulatory agencies as required and to discuss any issues concerning the approval application. Any and all acts carried out by our authorized agent on our behalf shall have the same effect as acts of our own. This agreement expires one year from the current date. THALES DIS AIS Deutschland GmbH Registered Office: Mnchen - Amtsgericht Mnchen, HRB 172715 WEEE-Reg.-Nr. DE 58893809 Managing Directors: Christoph Caselitz, Akhan Urgun Sincerely, X Axel Heike Certification Project Manager Signed by: HEIKE Axel 16.03.2022 16/03/2022 X Leandro Wan-Dall Head of Certification Management Signed by: WAN-DALL Leandro

 

 

MiniMag &Sputnik MiniMag 1140.24 combined with Sputnik excellent for people on the move MiniMag magnet mount antenna combined with the por-

table ground plane Sputnik, is an excellent solution for people on the move, for rental cars, taxis etc. Very small and light, takes minimum space in your briefcase or pock-et. For frequencies up to 2500 MHz. Improves the signal to ensure the best possible coverage for the phone. Extremely easy to mount: just place it on the car roof. Stays on safely at speeds of over 200 km/h (125 MPH). Or place it on Sputnik ground plane with its suction cup that allows mount on any clean and vertical surface. MiniMag has an attractive and discreet design and is available in complete sets, to facilitate your choice and ordering process. MiniMag Designed for reliable magnet mounting Operates in frequency range 4502500 MHz Combine with Smarteqs unique Sputnik pocket size ground plane to maximize reception quality and usage areas Strain relief on cable Sputnik Designed ground plane with suction cup Portable, pocket sized, all-in-one solution Combine Sputnik with Smarteqs MiniMag Works in all situations e.g. cars, boats, trains,offices, cottages and at home www.smarteq.com Electrical and Mechanical data for MiniMag & Sputnik magnet mount antenna Electrical Frequency 617-803/824-960/1710-2170MHz Impedance Nominal 50 Polarization Linear vertical VSWR 2:1 @ specied freq. Gain Low band: 3.17dBi;Middle band: 5.17dBi;

High band: 2.17dBi Max Power 10 W Mechanical Dimension 27 x 20 (xH) mm Heigth with radiator 300 mm Weight 73 g Material Base: ABS Colour Black Environmental Temperature Storage: -40C +80C Operating: -25C +70C Other Cable Connector ISO9001 Certified Mini Low Loss 2.5 m FME (female) Smarteqs business concept is to use the latest technology to develop products in the field of wireless telecommunications. The business is focused on the development and sale of products for the end market and the OEM market. Smarteq reserves the right to change specications without prior notice. MiniMag & Sputnik F/UK Smarteq Wireless AB P.O. Box 4064 SE-182 04 Enebyberg Sweden Tbyvgen 27 Tby-Stockholm info@smarteq.se www.smarteq.com

 

 

THALES DIS AIS Deutschland GmbH Siemensdamm 50 13629 Berlin Germany THALES DIS AIS Deutschland GmbH Federal Communications Commission Equipment Authorization Division, Application Processing Branch 7435 Oakland Mills Road Columbia MD 21046 USA Siemensdamm 50 13629 Berlin Germany Contact person: Axel Heike E-mail: axel.heike@thalesgroup.com Tel: +49 30 31102-8146 16 March 2022 LONG-TERM CONFIDENTIALITY REQUEST TO WHOM lT MAY CONCERN Pursuant to Paragraphs 0.457 and 0.459 of the Commissions Rules (47 C.F.R.) and Section 552(b)(4) of the Freedom of Information Act, THALES DIS AIS Deutschland GmbH requests confidentiality for the following product:

FCC ID Number Product Title/Model QIPTN23-W TN23-W For the product stated above, we request that the following information be held confidential:

1. Block Diagram 2. Schematic Diagram 3. Part List / Tune Up Procedure 4. Operational Description These items contain detailed system and equipment description and related information about the product which THALES DIS AIS Deutschland GmbH considers to be proprietary, confidential and a custom design which otherwise would only be released to qualified tech and is not released to the general public. Since this design is a basis from which future technological product will evolve, THALES DIS AIS Deutschland GmbH also feels that this information would be of benefit to its competitors, and that the disclosure of the information in these exhibits would give our competitors an unfair advantage in the market. Sincerely, X HEIKE Axel Certification Project Manager Signed by: HEIKE Axel 16.03.2022 16/03/2022 X Leandro Wan-Dall Head of Certification Management Signed by: WAN-DALL Leandro THALES DIS AIS Deutschland GmbH Registered Office: Mnchen - Amtsgericht Mnchen, HRB 172715 WEEE-Reg.-Nr. DE 58893809 Managing Directors: Christoph Caselitz, Akhan Urgun

 

 

THALES DIS AIS Deutschland GmbH Siemensdamm 50 13629 Berlin Germany THALES DIS AIS Deutschland GmbH Federal Communications Commission Equipment Authorization Division, Application Processing Branch 7435 Oakland Mills Road Columbia MD 21046 USA Siemensdamm 50 13629 Berlin Germany Contact person: Axel Heike E-mail: axel.heike@thalesgroup.com Tel: +49 30 31102-8146 16 March 2022 SHORT-TERM CONFIDENTIALITY REQUEST TO WHOM IT MAY CONCERN Pursuant to Paragraphs 0.457 and 0.459 of the Commissions Rules (47 C.F.R.) and Section 552(b)(4) of the Freedom of Information Act, THALES DIS AIS Deutschland GmbH requests confidentiality for the following product:

FCC ID Number Product Title/Model QIPTN23-W TN23-W For the product stated above, we request that the following information be held confidential:

1. Test Setup Photos 2. User Manual 3. External and Internal Photographs THALES DIS AIS Deutschland GmbH requests this confidentiality on the basis of ensuring that business sensitive information remains confidential until the actual marketing of our new device, which is planned tor 30th of Sep.2022. If you have any questions, please feel free to contact us at the address shown above. Sincerely, X Axel Heike Certification Project Manager Signed by: HEIKE Axel 16.03.2022 16/03/2022 X Leandro Wan-Dall Head of Certification Management Signed by: WAN-DALL Leandro THALES DIS AIS Deutschland GmbH Registered Office: Mnchen - Amtsgericht Mnchen, HRB 172715 WEEE-Reg.-Nr. DE 58893809 Managing Directors: Christoph Caselitz, Akhan Urgun

 

 

THALES DIS AIS Deutschland GmbH Siemensdamm 50 13629 Berlin Germany THALES DIS AIS Deutschland GmbH Federal Communications Commission Equipment Authorization Division, Application Processing Branch 7435 Oakland Mills Road Columbia MD 21046 USA Siemensdamm 50 13629 Berlin Germany Contact person: Axel Heike E-mail: axel.heike@thalesgroup.com Tel: +49 30 31102-8146 16 March 2022 Ref: FCC Modular approval letter for FCC ID: QIPTN23-W TO WHOM lT MAY CONCERN The following attestation addresses the requirements to support modular approval pursuant to 15.212 of the Commissions Rules:

Modular approval requirement

(i) The radio elements of the modular transmitter must have their own shielding. The physical crystal and tuning capacitors may be located external to the shielded radio elements.

(ii) The modular transmitter must have buffered modulation/data inputs (if such in-

puts are provided) to ensure that the module will comply with part 15 requirements under conditions of excessive data rates or over-modulation.

(iii) The modular transmitter must have its own power supply regulation.

(iv) The modular transmitter must comply with the antenna and transmission system requirements of 1 5.203, 1 5.204(b) and 15.204(c). The antenna must either be permanently attached or employ a unique antenna coupler (at all connections be-

tween the module and the antenna, including the cable). The professional installa-

tion provision of 1 5.203 is not applicable to modules but can apply to limited mod-

ular approvals under paragraph (b) of this section.

(v) The modular transmitter must be tested in a stand-alone configuration, i.e., the module must not be inside another device during testing for compliance with part 15 requirements. Unless the transmitter module will be battery powered, it must comply with the AC line conducted requirements found in 1 5.207. AC or DC power lines and data input/output lines connected to the module must not contain ferrites, unless they will be marketed with the module (see 15.27(a)). The length of these lines shall be the length typical of actual use or, if that length is unknown, at least 10 cen-

Yes No*

X X X X X THALES DIS AIS Deutschland GmbH Registered Office: Mnchen - Amtsgericht Mnchen, HRB 172715 WEEE-Reg.-Nr. DE 58893809 Managing Directors: Christoph Caselitz, Akhan Urgun timeters to insure that there is no coupling between the case of the module and sup-

porting equipment. Any accessories, peripherals, or support equipment connected to the module during testing shall be unmodified and commercially available (see 15.31(i)).

(vi) The modular transmitter must be equipped with either a permanently affixed la-

bel or must be capable of electronically displaying its FCC identification number.

(vii) The modular transmitter must comply with any specific rules or operating re-

quirements that ordinarily apply to a complete transmitter and the manufacturer must provide adequate instructions along with the module to explain any such re-

quirements. A copy of these instructions must be included in the application for equipment authorization.

(viii) The modular transmitter must comply with any applicable RF exposure require-

ments in its final configuration. X X X

* Shall provide a detailed explanation if the answer is No. If you have any questions, please feel free to contact us at the address shown above. Sincerely, X Axel Heike Certification Project Manager Signed by: HEIKE Axel 16.03.2022 16/03/2022 X Leandro Wan-Dall Head of Certification Management Signed by: WAN-DALL Leandro