FCC ID: QIPPLS63-W Module

 

Cinterion® PLSx3

Hardware Interface Description

Version:

DocId:

01.002d

PLSx3_HID_v01.002d

Cinterion® PLSx3 Hardware Interface Description

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2

Document Name: Cinterion® PLSx3 Hardware Interface Description

Version:

01.002d

Date:

DocId:

Status

2021-08-24

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GENERAL NOTE

THIS DOCUMENT CONTAINS INFORMATION ON THALES DIS AIS DEUTSCHLAND GMBH

(“THALES”) PRODUCTS. THALES RESERVES THE RIGHT TO MAKE CHANGES TO THE PROD-

UCTS DESCRIBED HEREIN. THE SPECIFICATIONS IN THIS DOCUMENT ARE SUBJECT TO

CHANGE AT THE DISCRETION OF THALES. THE PRODUCT AND THIS DOCUMENT ARE PRO-

VIDED ON AN "AS IS" BASIS ONLY AND MAY CONTAIN DEFICIENCIES OR INADEQUACIES.

THALES DOES NOT ASSUME ANY LIABILITY FOR INFORMATION PROVIDED IN THE DOCUMENT

OR ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT DESCRIBED HEREIN.

THALES GRANTS A NON-EXCLUSIVE RIGHT TO USE THE DOCUMENT. THE RECIPIENT SHALL

NOT COPY, MODIFY, DISCLOSE OR REPRODUCE THE DOCUMENT EXCEPT AS SPECIFICALLY

AUTHORIZED BY THALES.

Copyright © 2021, THALES DIS AIS Deutschland GmbH

Trademark Notice

Thales, the Thales logo, are trademarks and service marks of Thales and are registered in certain coun-

tries. Microsoft and Windows are either registered trademarks or trademarks of Microsoft Corporation in

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document are property of their respective owners.

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Contents

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Contents

1

2

Introduction ................................................................................................................. 9

Product Variants ................................................................................................ 9

1.1

Key Features at a Glance .................................................................................. 9

1.2

1.2.1

Supported Frequency Bands .............................................................. 14

PLSx3 System Overview ................................................................................. 16

Circuit Concept ................................................................................................ 17

1.3

1.4

Interface Characteristics .......................................................................................... 18

Application Interface ........................................................................................ 18

2.1

Pad Assignment.................................................................................. 18

2.1.1

Signal Properties................................................................................. 22

2.1.2

2.1.2.1 Absolute Maximum Ratings ................................................ 27

2.1.3 USB Interface...................................................................................... 28

2.1.3.1 Reducing Power Consumption............................................ 29

Serial Interface ASC0 ......................................................................... 30

2.1.4

2.1.5

Serial Interface ASC1 ......................................................................... 32

2.1.6 UICC/SIM/USIM Interface................................................................... 34

2.1.6.1 Enhanced ESD Protection for SIM Interface ....................... 36

2.1.6.2 SIM_SWITCH Line.............................................................. 37

2.1.7 GPIO Interface .................................................................................... 38

2.1.8 Digital Audio Interface......................................................................... 40

2.1.8.1 Pulse Code Modulation Interface ........................................ 40

2.1.8.2

Inter-IC Sound Interface...................................................... 41

2.1.9

Analog-to-Digital Converter (ADC)...................................................... 42

2.1.10 Control Signals.................................................................................... 42

2.1.10.1 Status LED .......................................................................... 42

2.1.10.2 Power Indication.................................................................. 43

2.1.10.3 Fast Shutdown .................................................................... 44

2.1.10.4 Remote Wakeup.................................................................. 45

RF Antenna Interface....................................................................................... 46

2.2.1

Antenna Interface Specifications ........................................................ 47

Antenna Installation ............................................................................ 56

2.2.2

2.2.3 RF Line Routing Design...................................................................... 57

2.2.3.1

Line Arrangement Examples ............................................... 57

2.2.3.2 Routing Example................................................................. 59

GNSS Antenna Interface ................................................................................. 61

2.3.1 GNSS Receiver................................................................................... 61

2.3.2 GNSS Antenna ................................................................................... 61

2.3.3 GNSS Antenna Diagnostic.................................................................. 63

2.3.4 GNSS Antenna Interface Characteristics............................................ 64

Sample Application .......................................................................................... 65

2.2

2.4

2.3

3

Operating Characteristics ........................................................................................ 67

Operating Modes ............................................................................................. 67

3.1

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3.2

3.3

3.4

3.5

3.6

3.7

3.2.5

3.2.3

3.2.4

Power Up/Power Down Scenarios ................................................................... 68

3.2.1

Turn on PLSx3 .................................................................................... 68

3.2.2 Restart PLSx3..................................................................................... 68

3.2.2.1 Restart PLSx3 Using Restart Command............................. 68

3.2.2.2 Restart PLSx3 Using EMERG_RST.................................... 69

Signal States after Startup .................................................................. 70

Turn off PLSx3 .................................................................................... 71

3.2.4.1 Switch off PLSx3 Using AT Command ................................ 71

Automatic Shutdown ........................................................................... 71

Thermal Shutdown .............................................................. 71

3.2.5.1

3.2.5.2 Undervoltage Shutdown...................................................... 73

3.2.5.3 Overvoltage Shutdown........................................................ 73

3.2.5.4 Deferred Shutdown at Extreme Temperature Condition...... 74

Power Saving................................................................................................... 74

Power Saving while Attached to GSM Networks ................................ 74

3.3.1

3.3.2

Power Saving while Attached to WCDMA Networks .......................... 75

Power Saving while Attached to LTE Networks .................................. 76

3.3.3

3.3.4 Wake-up via RTS0.............................................................................. 77

Power Supply................................................................................................... 78

Power Supply Ratings......................................................................... 79

3.4.1

3.4.2 Minimizing Power Losses ................................................................... 87

3.4.3 Monitoring Power Supply by AT Command ........................................ 87

Operating Temperatures.................................................................................. 88

Electrostatic Discharge .................................................................................... 88

Reliability Characteristics ................................................................................. 89

Mechanical Dimensions, Mounting and Packaging............................................... 90

Mechanical Dimensions of PLSx3 ................................................................... 90

4.1

Mounting PLSx3 onto the Application Platform................................................ 93

4.2

SMT PCB Assembly ........................................................................... 93

4.2.1

4.2.1.1

Land Pattern and Stencil..................................................... 93

4.2.1.2 Board Level Characterization.............................................. 95

4.2.2 Moisture Sensitivity Level ................................................................... 95

Soldering Conditions and Temperature .............................................. 96

4.2.3

4.2.3.1 Reflow Profile ...................................................................... 96

4.2.3.2 Maximum Temperature and Duration .................................. 97

4.2.4 Durability and Mechanical Handling.................................................... 98

4.2.4.1 Storage Conditions.............................................................. 98

4.2.4.2 Processing Life.................................................................... 99

4.2.4.3 Baking ................................................................................. 99

4.2.4.4 Electrostatic Discharge ....................................................... 99

Packaging ...................................................................................................... 100

Tape and Reel .................................................................................. 100

4.3.1

4.3.1.1 Orientation......................................................................... 100

4.3.1.2 Barcode Label ................................................................... 101

4.3

4

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4.3.2

Shipping Materials ............................................................................ 102

4.3.2.1 Moisture Barrier Bag ......................................................... 102

Transportation Box ............................................................ 105

4.3.2.2

5

6

7

Regulatory and Type Approval Information ......................................................... 106

Directives and Standards............................................................................... 106

5.1

IEC 62368-1 Classification................................................................ 109

5.1.1

SAR requirements specific to portable mobiles ............................................. 111

Reference Equipment for Type Approval ....................................................... 112

Compliance with FCC and ISED Rules and Regulations............................... 113

Compliance with Japanese Rules and Regulations ....................................... 117

5.2

5.3

5.4

5.5

Document Information............................................................................................ 118

Revision History ............................................................................................. 118

6.1

Related Documents ....................................................................................... 121

6.2

Terms and Abbreviations ............................................................................... 121

6.3

Safety Precaution Notes ................................................................................ 124

6.4

Appendix.................................................................................................................. 125

List of Parts and Accessories......................................................................... 125

7.1

Module Label Information .............................................................................. 128

7.2

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Tables

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Tables

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Supported frequency bands for each PLSx3 variant...................................... 14

Overview: Pad assignments........................................................................... 19

Signal properties ............................................................................................ 22

Absolute maximum ratings............................................................................. 27

Signals of the SIM interface (SMT application interface) ............................... 34

GPIO lines and possible alternative assignment............................................ 38

Overview of PCM pin functions ...................................................................... 40

Overview of I2S pin functions ......................................................................... 41

Remote wakeup lines..................................................................................... 45

Return loss in the active band........................................................................ 46

RF Antenna interface GSM/UMTS/LTE ......................................................... 47

RF Antenna interface LTE for -J variant (at operating temperature range).... 55

Sample ranges of the GNSS antenna diagnostic measurements and their

possible meaning ........................................................................................... 63

GNSS properties ............................................................................................ 64

Overview of operating modes ........................................................................ 67

Pull-up and Pull-down Values ........................................................................ 70

Temperature associated URCs...................................................................... 72

Supply Ratings ............................................................................................... 79

Current Consumption Ratings -GSM ............................................................. 80

Current Consumption Ratings - UMTS .......................................................... 85

Current Consumption Ratings - LTE .............................................................. 86

Board Temperature ........................................................................................ 88

Electrostatic values ........................................................................................ 88

Summary of reliability test conditions............................................................. 89

Reflow temperature ratings ............................................................................ 96

Storage conditions ......................................................................................... 98

VP Box label information.............................................................................. 105

Directives ..................................................................................................... 106

Standards of North American type approval ................................................ 106

Standards of European type approval.......................................................... 107

Requirements of quality ............................................................................... 107

Standards of the Ministry of Information Industry of the

People’s Republic of China .......................................................................... 107

Toxic or hazardous substances or elements with defined concentration

limits ............................................................................................................. 108

IEC 62368-1 Classification........................................................................... 109

Antenna gain limits for FCC and ISED (for W and EP variants) .................. 114

Antenna gain limits for FCC and ISED (for X, X2, X3, X4 variants) ............. 114

List of parts and accessories........................................................................ 125

Molex sales contacts (subject to change) .................................................... 127

PLSx3 label information ............................................................................... 128

Date code table ............................................................................................ 128

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Figures

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Figure 49:

PLSx3 system overview ................................................................................. 16

PLSx3 block diagram ..................................................................................... 17

PLSx3 bottom view: Pad assignments........................................................... 20

PLSx3 top view: Pad assignments................................................................. 21

USB circuit ..................................................................................................... 28

Serial interface ASC0..................................................................................... 30

ASC0 startup behavior ................................................................................... 31

Serial interface ASC1..................................................................................... 32

ASC1 startup behavior ................................................................................... 33

Module’s two UICC/SIM/USIM interfaces ...................................................... 35

UICC/SIM/USIM interfaces connected........................................................... 35

SIM interface - enhanced ESD protection...................................................... 36

External UICC/SIM/USIM switch.................................................................... 37

Sample circuit for SIM interface connection via SIM switch........................... 37

GPIO startup behavior ................................................................................... 39

PCM timing short frame ................................................................................. 41

Status signaling with LED driver .................................................................... 42

Power indication signal .................................................................................. 43

Fast shutdown timing ..................................................................................... 44

Antenna pads (bottom view) .......................................................................... 56

Embedded stripline arrangement example .................................................... 57

Micro-Stripline arrangement example ............................................................ 58

Routing to application‘s RF connector ........................................................... 59

Routing Detail................................................................................................. 60

Supply voltage for active GNSS antenna....................................................... 62

ESD protection for passive GNSS antenna ................................................... 63

Schematic diagram of PLSx3 sample application .......................................... 66

IGT timing....................................................................................................... 68

Power saving and paging in GSM networks .................................................. 75

Power saving and paging in WCDMA networks............................................. 75

Power saving and paging in LTE networks .................................................... 76

Wake-up via RTS0 ......................................................................................... 77

Decoupling capacitor(s) for BATT+................................................................ 78

Power supply limits during transmit burst....................................................... 87

PLSx3– top and bottom view ......................................................................... 90

Dimensions of PLSx3 (all dimensions in mm)................................................ 91

Dimensions of PLSx3 (keepout area recommended) .................................... 92

Land pattern (top view) .................................................................................. 93

Recommended design for 110 micron thick stencil (top view) ....................... 94

Recommended design for 150 micron thick stencil (top view) ....................... 94

Reflow Profile ................................................................................................ 96

Carrier tape .................................................................................................. 100

Reel direction ............................................................................................... 100

Barcode label on tape reel ........................................................................... 101

Barcode label on tape reel - layout .............................................................. 101

Moisture barrier bag (MBB) with imprint....................................................... 102

Moisture Sensitivity Label ............................................................................ 103

Humidity Indicator Card - HIC ...................................................................... 104

Sample of VP box label................................................................................ 105

Reference equipment for Type Approval ..................................................... 112

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Figure 50:

Figure 51:

Figure 52:

JATE/TELEC mark for -J.............................................................................. 117

JATE/TELEC mark for -W ............................................................................ 117

PLSx3 Label................................................................................................. 128

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1 Introduction

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1

Introduction

This document1 describes the hardware of the Cinterion® PLSx3 module. It helps you quickly

retrieve interface specifications, electrical and mechanical details and information on the re-

quirements to be considered for integrating further components.

Note: This Hardware Interface Description is a preliminary version and as such subject to

change depending on further implementation and measurements.

1.1

Product Variants

This document applies to the following Thales module variants:

• Cinterion®

PLS63-W Module

• Cinterion®

PLS63-EP Module

• Cinterion®

PLS63-LA Module

• Cinterion®

PLS63-J Module

• Cinterion®PLS63-X Module

• Cinterion®PLS63-X2 Module

• Cinterion®PLS63-X3 Module

• Cinterion®PLS63-X4 Module

• Cinterion®PLS63-I Module

• Cinterion®

• Cinterion®

• Cinterion®

• Cinterion®

• Cinterion®

• Cinterion®

• Cinterion®

• Cinterion®

• Cinterion®

PLS83-W Module

PLS83-EP Module

PLS83-LA Module

PLS83-J Module

PLS83-X Module

PLS83-X2 Module

PLS83-X3 Module

PLS83-X4 Module

PLS83-I Module

Note: The PLSx3 variants differ in the fact that PLS63 supports UE CAT 1 (DL 10Mbps, UL

5Mbps) whereas PLS83 supports UE CAT 4(DL 150Mbps, UL 50Mbps). Wherever necessary

a note is made to differentiate between the product variants.

1.2

Key Features at a Glance

Feature

General

Frequency bands

Implementation

PLSx3 integrates all the bands required to have a global coverage across

the world (NORAM / LATAM / EMEA /APAC).

Please refer to Section 1.2.1 for an overview of the frequency bands

supported by each PLSx3 product variant.

1. The document is effective only if listed in the appropriate Release Notes as part of the technical docu-

mentation delivered with your Thales product.

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Feature

GSM class

Implementation

Small MS

Output power (according

to release 99)

Output power (according

to Release 99)

Output power (according

to Release 8)

Class 4 (+33dBm ±2dB) for GSM850

Class 4 (+33dBm ±2dB) for GSM900

Class 1 (+30dBm ±2dB) for GSM1800

Class 1 (+30dBm ±2dB) for GSM1900

Class E2 (+27dBm ± 3dB) for GSM 850 8-PSK

Class E2 (+27dBm ± 3dB) for GSM 900 8-PSK

Class E2 (+26dBm +3 /-4dB) for GSM 1800 8-PSK

Class E2 (+26dBm +3 /-4dB) for GSM 1900 8-PSK

Class 3 (+24dBm +1/-3dB) for UMTS 850, WCDMA FDD BdXIX

Class 3 (+24dBm +1/-3dB) for UMTS 850, WCDMA FDD BdVI

Class 3 (+24dBm +1/-3dB) for UMTS 850, WCDMA FDD BdV

Class 3 (+24dBm +1/-3dB) for UMTS 900, WCDMA FDD BdVIII

Class 3 (+24dBm +1/-3dB) for UMTS 1700, WCDMA FDD BdIII

Class 3 (+24dBm +1/-3dB) for UMTS 1900, WCDMA FDD BdII

Class 3 (+24dBm +1/-3dB) for UMTS 2100, WCDMA FDD BdIV

Class 3 (+24dBm +1/-3dB) for UMTS 2100, WCDMA FDD BdI

Class 3 (+23dBm ±2dB) for LTE 600, LTE FDD Bd71

Class 3 (+23dBm ±2dB) for LTE 700, LTE FDD Bd12 <MFBI Bd17>

Class 3 (+23dBm ±2dB) for LTE 700, LTE FDD Bd13

Class 3 (+23dBm ±2dB) for LTE 700, LTE FDD Bd14

Class 3 (+23dBm+2/-2.5dB) for LTE 700, LTE FDD Bd28

Class 3 (+23dBm ±2dB) for LTE 850, LTE FDD Bd26

Class 3 (+23dBm ±2dB) for LTE 850, LTE FDD Bd18

Class 3 (+23dBm ±2dB) for LTE 850, LTE FDD Bd19

Class 3 (+23dBm ±2dB) for LTE 800, LTE FDD Bd20

Class 3 (+23dBm ±2dB) for LTE 850, LTE FDD Bd5

Class 3 (+23dBm ±2dB) for LTE 900, LTE FDD Bd8

Class 3 (+23dBm ±2dB) for LTE 1800, LTE FDD Bd3

Class 3 (+23dBm ±2dB) for LTE 1900, LTE FDD Bd2

Class 3 (+23dBm ±2dB) for LTE 1900, LTE FDD Bd25

Class 3 (+23dBm ±2dB) for LTE 2100, LTE FDD Bd1

Class 3 (+23dBm ±2dB) for LTE 2100, LTE FDD Bd4

Class 3 (+23dBm ±2dB) for LTE 2100, LTE FDD Bd66

Class 3 (+23dBm ±2dB) for LTE 2600, LTE FDD Bd7

Class 3 (+23dBm ±2dB) for LTE 2300, LTE TDD Bd40

Class 3 (+23dBm ±2dB) for LTE 2500, LTE TDD Bd41

Class 3 (+23dBm ±2dB) for LTE 2600, LTE TDD Bd38

Power supply

(see Section 2.1.2, and

Section 3.4)

Normal operation:

3.0V < VBATT+ < 4.5V

Typ value is 3.8V

Operating temperature

(board temperature)

(see Section 3.5)

Normal operation: -30°C to +85°C

Extended operation: -40°C to -30°C, +85°C to +95°C;

Dimensions: 33mm x 29mm x 2.5mm

Weight: approx. 4.8g

All hardware components fully compliant with EU RoHS Directive

UE CAT 1 for PLS63 (DL 10Mbps, UL 5Mbps)

UE CAT 4 for PLS83 (DL 150Mbps, UL 50Mbps)

Physical

(see Section 4.1)

RoHS

(see Section 5.1)

LTE features

3GPP Release 10

HSPA feature

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Feature

Implementation

3GPP Release 7

UE CAT. 8, 6 for PLS63

HSDPA – DL 7.2Mbps

HSUPA – UL 5.7Mbps

UE CAT. 14, 6 for PLS83

HSPA+ – DL 21Mbps

HSUPA – UL 5.7Mbps

UMTS features

3GPP Release 4

GSM/GPRS/EGPRS features

Data transfer

Compressed mode (CM) supported according to 3GPP TS25.212

PS data rate – 384 kbps DL / 384 kbps UL

CS data rate – 64 kbps DL / 64 kbps UL

EDGE E2 power class for 8 PSK

GPRS:

• Multislot Class 12

• Mobile Station Class B

• Coding Scheme 1 – 4

EGPRS:

• Multislot Class 12

•

• Downlink coding schemes – CS 1-4, MCS 1-9

• Uplink coding schemes – CS 1-4, MCS 1-9

SRB loopback and test mode B

•

8-bit, 11-bit RACH

•

1 phase/2 phase access procedures

•

•

Link adaptation and IR

• NACC, extended UL TBF

• Mobile Station Class B

SMS

Point-to-point MT and MO

Cell broadcast

Text and PDU mode

Storage: SIM card plus SMS locations in mobile equipment

GNSS Features

Protocol

NMEA

Modes

(see Section 2.3)

General

Software

Standalone GNSS (GPS, GLONASS, Beidou, Galileo)

Automatic power saving modes.

DC feed bridge and control of power supply for active antenna

AT commands

Hayes 3GPP TS 27.007, TS 27.005, Thales

SIM Application Toolkit

Default (Network) bearer support for BIP

Firmware update

Generic update from host application over USB modem

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Feature

Interfaces

Module interface

Implementation

Surface mount device with solderable connection pads (SMT application

interface). Land grid array (LGA) technology ensures high solder joint reli-

ability and allows the use of an optional module mounting socket.

For more information on how to integrate SMT modules see also [4].This

application note comprises chapters on module mounting and application

layout issues as well as on additional SMT application development equip-

ment.

USB

(see Section 2.1.3)

USB 2.0 High Speed (480Mbit/s) device interface. Full Speed (12Mbit/s)

compliant.

2 serial interfaces

(see Section 2.1.4, and

Section 2.1.5)

2 UICC interfaces

(switchable)

(see Section 2.1.6)

GPIO interface

(see Section 2.1.7)

Digital audio interface

(see Section 2.1.8)

ASC0 (in parts shared with GPIO lines):

•

8-wire modem interface with status and control lines, unbalanced, asyn-

chronous

Fixed baud rates: 300bps to 921,600bps

Supports RTS0/CTS0 hardware flow control.

•

•

ASC1 (shared with GPIO lines):

•

•

•

4-wire, unbalanced asynchronous interface

Fixed baud rates: 300bps to 921,600bps and 3Mbps

Supports RTS1/CTS1 hardware flow control

Supported chip cards: UICC/SIM/USIM 3V, 1.8V

22 GPIO lines comprising:

13 lines shared with ASC0, ASC1 lines, with network status indication, fast

shutdown and SIM switch

9 GPIO lines not shared

1 digital interface can be configured as PCM or I2S.

RING0

Support RING0 to wake up host from power saving state.

Antenna interface pads

(see Section 2.1)

50Ω. UMTS/GSM/LTE main antenna, UMTS/LTE Rx Diversity antenna,

GNSS antenna.

ADC inputs

(see Section 2.1.9)

Analog-to-Digital Converter with unbalanced analog inputs, for example, for

the (external) antenna diagnosis

Power on/off, Reset

Power on/off

Reset

Special features

Evaluation kit

LGA DevKit

Evaluation module

Switch on by hardware signal IGT

Switch off by AT command

Switch off by hardware signal FST_SHDN instead of AT command

Automatic switch off in case of critical temperature or voltage conditions

Orderly reset by AT command

Reset by emergency reset signal EMERG_RST.

Real time clock

Timer functions via AT commands.

LGA DevKit designed to test Thales LGA modules.

PLSx3 module soldered onto a dedicated PCB that can be connected to an

adapter in order to be mounted onto the DSB75 or DSB mini.

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Feature

DSB-mini

DSB75

Implementation

DSB-mini Development Support Board designed to test and type approve.

It is the cost optimized development board alternative to DSB75.

DSB75 Development Support Board designed to test and type approve

Thales modules and provide a sample configuration for application engi-

neering. A special adapter is required to connect the PLSx3 evaluation

module to the DSB75.

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1.2.1

Supported Frequency Bands

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The following table lists the supported frequency bands for each of the PLSx3 product variants mentioned in Section 1.1.

Table 1: Supported frequency bands for each PLSx3 variant

Band

PLSx3-W

PLSx3-X

PLSx3-EP

PLSx3-LA

PLSx3-J

PLSx3-X2

PLSx3-X3

PLSx3-X4

PLSx3-I

GSM/GPRS/EDGE

850MHz

900MHz

1800MHz

1900MHz

WCDMA

Bd.1 (2100MHz)

Bd.2 (1900MHz)

Bd.3 (1800MHz)

Bd.4 (2100MHz)

Bd.5 (850MHz)

Bd.6 (850MHz)

Bd.8 (900MHz)

Bd.19 (850MHz)

LTE-FDD

Bd.1 (2100MHz)

Bd.2 (1900MHz)

Bd.3 (1800MHz)

Bd.4 (2100MHz)

Bd.5 (850MHz)

t

x

x

x

x

x

x

x

x

x

x

x

x

x

x

x

x

x

x

x

x

x

x

x

x

x

x

x

x

x

x

x

x

x

x

x

x

x

x

x

x

x

x

x

x

x

x

x

x

x

x

x

x

x

x

PLSx3_HID_v01.002d

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x

x

x

x

x

x

x

x

x

x

x

x

Cinterion® PLSx3 Hardware Interface Description

1.2 Key Features at a Glance

17

Table 1: Supported frequency bands for each PLSx3 variant

Page 15 of 129

Band

PLSx3-W

PLSx3-X

PLSx3-EP

PLSx3-LA

PLSx3-J

PLSx3-X2

PLSx3-X3

PLSx3-X4

PLSx3-I

Bd.7 (2600MHz)

Bd.8 (900MHz)

Bd.12 (700MHz)

Bd.13 (700MHz)1

Bd.14(700MHz)

Bd.17 (700 MHz)

Bd.18 (850MHz)

Bd.19 (850MHz)

Bd.20 (800MHz)

Bd.25(1900MHz)

Bd.26 (850MHz)

Bd.28 (700MHz)

Bd.66(2100MHz)

Bd.71(600MHz)

LTE-TDD

Bd.38 (2600MHz)

Bd.40 (2300MHz)

Bd.41 (2500MHz)

x

x

x

x

x

x

x

x

x

x

x

x

x

x

x

x

x

x

x

x

x

x

x

x

x

x

x

x

x

x

x

x

x

x

x

x

x

x

x

x

x

x

x

x

x

1. For -W variant module, a sensitivity issue will occur in GNSS when transmitting in band 13, to avoid this issue, it is suggested to use -X variant module.

2. For Band 41 (LTE-TDD), the frequency range are partially supported (2535MHz...2675MHz).

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1.3 PLSx3 System Overview

17

1.3

PLSx3 System Overview

Page 16 of 129

Application

Module

GPIO

Digital Audio

STATUS

SIM_SWITCH

FST_SHDN

ASC1/GPIO

ASC0/GPIO

PWR_IND

ASC0/GPIO

USB

ADC

Digital Audio

SIM1 interface(with

SIM card detection)

SIM2 interface(with

SIM card detection)

CONTROL

Power Supply

RF_Main_Path

Diversity_RX

GNSS_Path

2

9

1

1

1

4

4

1

4

3

3

3

1

5

1

5

1

1

1

1

1

1

1

1

GPIO

PCM(I2S)/GPIO

STATUS/GPIO

SIM_SWITCH/GPIO

Fast Shutdown/GPIO

Serial Interface/GPIO

Serial Interface/GPIO

Power Indicator

Serial Interface 0

USB

ADC

PCM(I2S) Interface&MCLK

SIM1 Card

SIM2 Card

IGT

EMERG_RST

VGNSS

Base Band Power

RF Power

Main Antenna

Diversity Antenna

GNSS Antenna

1

GNSS_DC

Figure 1: PLSx3 system overview

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1.4 Circuit Concept

17

Page 17 of 129

1.4

Circuit Concept

Figure 2 shows block diagrams of the PLSx3 module and illustrate the major functional com-

ponents:

BATT+BB

EMERG_RST

IGT

ADC_IN

XTAL

STATUS

MCLK

SIM_SWITCH

FAST_SHDN

USB

ASC0

ASC1

GPIO

PWR_IND

I2S/PCM

UIM1

UIM2

PMU

VGNSS

V180

C

o

n

t

r

o

l

P

o

w

e

r

Power

SOC

BUS

Control

Memory

ANT

RF

Figure 2: PLSx3 block diagram

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2 Interface Characteristics

66

2

Interface Characteristics

Page 18 of 129

PLSx3 is equipped with an SMT application interface that connects to the external application.

The SMT application interface incorporates the various application interfaces as well as the RF

antenna interface.

2.1

Application Interface

2.1.1

Pad Assignment

The SMT application interface on the PLSx3 provides land grid array pads to integrate the mod-

ule into external applications. Table 2 lists the pad assignment. Figure 3 shows the pin mapping

on the LGA footprint.

Please note that a number of connecting pads are marked as reserved for future use (rfu) and

further qualified as either (dnu), (GND) or (nc):

• Pads marked "rfu" and qualified as "dnu" (do not use) shall be soldered but electrically not

connected.

• Pads marked "rfu" and qualified as "nc" (not connected) are internally not connected with

PLSx3 modules, but shall be soldered.

Thales strongly recommends to solder all connecting pads for mechanical stability and heat

dissipation.

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Page 19 of 129

ANT_DRX

Signal Name

Table 2: Overview: Pad assignments

Pad

No.

rfu (nc)

A4

GND

A5

A6

GND

A7

GND

GND

A8

A9

GND

A10 GND

A11 GND

A12

A13 GND

rfu (nc)

B3

B4

GND

B5

GND

GND

B6

B7

GND

B8

GND

GND

B9

B10 GND

B11 GND

B12 GND

B13 GND

B14 GPIO5/STATUS

C2

GND

GND

C3

C4

GND

C5

GND

GND

C6

C7

GND

GND

C8

C9

GND

C10 GND

C11 GND

C12

C13

C14

C15 GND

GND

D1

GND

D2

GND

D3

GND

D4

ANT_GNSS_DC

D5

GND

D6

GND

D7

GND

D8

D9

GND

D10 GND

D11 GND

D12

D13

D14

D15

D16

E1

CCIN2

rfu (nc)

CCCLK2

rfu (dnu)

rfu (dnu)

ANT_GNSS

rfu (nc)

rfu (dnu)

rfu (dnu)

Signal Name

GND

GND

GND

GND

GND

GND

GND

GND

rfu (dnu)

Pad

No.

E2

E3

E4

E5

E12 CCIO2

E13 CCRST2

rfu (nc)

E14

rfu (dnu)

E15

rfu (dnu)

E16

GND

F1

GND

F2

GND

F3

F4

GND

F13 GND

rfu (dnu)

F14

rfu (dnu)

F15

F16 GPIO25

G1

G2

G3

G4

G13

G14 GPIO7

G15 GPIO8

G16 GPIO11

H1

H2

H3

H4

H13

H14 GPIO4/FST_SHDN

H15 GPIO12

H16 GPIO6

GND

J1

GND

J2

GND

J3

J4

GND

J13 GND

J14 GPIO15

J15 GPIO14

J16 GPIO13

K1

K2

K3

K4

K5

K12

K13

K14 CCIO1

K15 CCVCC1

K16

L1

ANT_MAIN

GND

GND

GND

GND

rfu (nc)

rfu (dnu)

GND

GND

GND

GND

rfu (dnu)

VGNSS

GND

Pad

No.

L2

L3

L4

L5

L6

L7

L8

L9

L10

L11

L12

L13

L14

L15

L16

M2

M3

M4

M5

M6

M7

M8

M9

M10

M11

M12

M13

M14

M15

N3

N4

N5

N6

N7

N8

N9

N10

N11

N12

N13

N14

P4

P5

P6

P7

P8

P9

P10

P11

P12

P13

Signal Name

GND

GND

GND

rfu (nc)

CCVCC2

MCLK

rfu (nc)

rfu (nc)

rfu (nc)

SIM_SWITCH/GPIO26

rfu (nc)

rfu (dnu)

CCRST1

CCCLK1

IGT

GND

GND

PWR_IND

V180

GND

GPIO21/DIN

BCLK

FSC

GPIO20/DOUT

ADC3_IN

ADC2_IN

ADC1_IN

CCIN1

rfu (nc)

BATT+RF

BATT+RF

VUSB_IN

GPIO19/CTS1

GPIO18/RTS1

CTS0

DCD0/GPIO2

RTS0

GND

rfu (dnu)

BATT+BB

EMERG_RST

USB_DP

USB_DN

GPIO16/RXD1

GPIO17/TXD1

DTR0/GPIO1

DSR0/GPIO3

RING0/GPIO24

RXD0

TXD0

BATT+BB

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2.1 Application Interface

66

Page 20 of 129

1

2

3

4

5

6

7

8

9

10

11

12

13

14

15

16

USB_DP

USB_DN GPIO16

/RXD1

GPIO17

/TXD1

DTR0

/GPIO1

DSR0

/GIPO3

RXD0

TXD0

BATT+BB

RING0

/

GPIO24

BATT+RF

BATT+RF

VUSB_

IN

GPIO19

/CTS1

GPIO18

/RTS1

CTS0

DCD0

/GPIO2

RTS0

GND

rfu

(dnu)

BATT+BB EMERG_

RST

GND

GND

PWR_IND

V180

GND

BCLK

FSC

GPIO21

/DIN

GPIO20

/DOUT

ADC3_

IN

ADC2_

IN

ADC1_

IN

CCIN1

rfu

(nc)

GND

GND

GND

GND

rfu (nc)

CCVC

C2

MCLK

rfu

(nc)

rfu

(nc)

rfu

(nc)

K ANT_

MAIN

GND

GND

GND

GND

SIM_

SWITCH

/GPIO26

rfu

(nc)

rfu

(nc)

rfu

(dnu)

rfu

(dnu)

CCRST1 CCCLK1

IGT

CCIO1

CCVCC1

VGNSS

GND

GND

GND

GND

GND

GPIO15

GPIO14

GPIO13

GND

GND

GND

GND

GPIO12

GPIO6

GND

GND

GND

GND

GPIO7

GPIO8

GPIO11

GND

GND

GND

GND

rfu: Reserved for future use (should not

be connected to external application)

(nc): Internally not connected (may be ar-

bitrarily connected to external GND)

(dnu): Do not use

E ANT_

GNSS

GND

GND

GND

GND

CCIO2 CCRST2

GPIO4

/

FST_SH

DN

rfu

(dnu)

rfu

(nc)

rfu

(dnu)

rfu

(dnu)

GND

rfu

(nc)

rfu

(nc)

rfu

(dnu)

rfu

(dnu)

GPIO5

/STATUS

GPIO25

rfu

(dnu)

rfu

(dnu)

rfu

(dnu)

rfu

(dnu)

rfu

(dnu)

GND

rfu

(nc)

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

rfu

(nc)

GND

GND

GND

GND

GND

GND

GND

GND

ANT_

DRX

P

N

M

L

J

H

G

F

D

C

B

A

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

CCIN2

CCCLK2

ANT_GN

SS_DC

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

For internal use:

Not to be soldered

Figure 3: PLSx3 bottom view: Pad assignments

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Cinterion® PLSx3 Hardware Interface Description

2.1 Application Interface

66

Page 21 of 129

P

N

M

L

K

J

H

G

F

E

D

C

A

For internal

B

use: Not to

be soldered

t

16

15

14

13

12

11

10

9

8

7

6

5

4

3

2

1

BATT+BB

TXD0

RXD0

GPIO17

/TXD1

GPIO16

/RXD1

USB_DN

USB_DP

RING0

/

GPIO24

DSR0

/GPIO3

DCD0

/GPIO2

DTR0

/GPIO1

CTS0

EMERG_

RST

BATT+BB

rfu

(dnu)

GND

RTS0

GPIO18

/RTS1

GPIO19

/CTS1

VUSB_

IN

BATT+RF

BATT+RF

rfu

(nc)

CCIN1

ADC1_

IN

ADC2_

IN

ADC3_

IN

GPIO20/

DOUT

GPIO21

/DIN

FSC

BCLK

GND

V180

PWR_IND

GND

GND

IGT

CCCLK1

CCRST1

rfu

(dnu)

rfu

(nc)

SIM_SWITC

H//GPIO26

rfu

(nc)

rfu

(nc)

rfu

(nc)

MCLK

CCVC

C2

rfu

(nc)

GND

GND

GND

GND

VNGSS CCVCC1

CCIO1

rfu

(dnu)

rfu

(nc)

GND

GND

GND

GND

ANT_

MAIN

GPIO13

GPIO14

GPIO15

GND

GND

GND

GND

GND

GPIO6

GPIO12

GPIO4/

FST_SHD

N

GPIO11

GPIO8

GPIO7

GPIO25

rfu

(dnu)

rfu

(dnu)

rfu

(dun)

rfu

(dnu)

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

rfu

(dnu)

rfu

(dnu)

rfu

(nc)

CCRST2 CCIO2

GND

GND

GND

GND

ANT_

GNSS

rfu

(dnu)

rfu

(dnu)

rfu

(nc)

CCCLK2

CCIN2

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

ANT_GN

SS_DC

rfu: Reserved for future use (should not

be connected to external application)

(nc): Internally not connected (may be ar-

bitrarily connected to external GND)

(dnu): Do not use

GND

rfu

(dnu)

rfu

(dnu)

rfu

(nc)

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

Position

marker

GPIO5/

STATUS

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

GND

ANT_

DRX

GND

GND

GND

GND

GND

GND

GND

rfu

(nc)

rfu

(nc)

Figure 3: PLSx3 top view: Pad assignments

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2.1 Application Interface

66

Page 22 of 129

Function

Signal name

IO Signal form and level

Comment

2.1.2

Signal Properties

Table 3: Signal properties (Sheet 1 of 5)

Power

supply

BATT+BB

BATT+RF

I

GSM activated:

VImax = 4.5V

VInorm = 3.8V

VImin = 3.0V

Imax= see Table 19

___|¯¯|____________|¯¯|___

n Tx = n x 577µs peak current every

4.616ms

WCDMA activated:

VImax = 4.5V

VInorm = 3.8V

VImin = 3.0V during Transmit active.

Imax = see Table 20

LTE activated:

VImax = 4.5V

VInorm = 3.8V

VImin = 3.0V during Transmit active.

Imax = see Table 21

V180

O Normal operation:

External

supply

voltage

VOnorm = 1.80V ±2%

IOmax = 10mA

SLEEP mode Operation:

VOSleep = 1.80V ±4%

IOmax = 10mA

CImax = 100nF

VGNSS

O CLmax=2.2μ

VO=3V±2%@IO =-10mA

IOmax = 10mA

VImax_6V

The input current has to be limited to

50mA(antenna short circuit protection)

ANT_GNS-

S_DC

I

Supply volt-

age for

active

GNSS

antenna

Lines of BATT+ and GND

must be connected in par-

allel for supply purposes

because higher peak cur-

rents may occur.

Minimum voltage must not

fall below 3.0V including

drop, ripple, spikes and not

rise above 4.5V.

Note: The module’s nor-

mal voltage range for oper-

ation lies between 3.0V

and 4.5V. For USB opera-

tion, 3.0V-4.5V is also rec-

ommended.

V180 should be used to

supply level shifters at the

interfaces.

Note: V180 is not back

powering protected.

Wrong usage may back

power the module which is

forbidden.

If unused keep line open.

Test point recommended.

Available when GNSS

antenna DC power is

enabled.

If unused connect to GND

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Page 23 of 129

Table 3: Signal properties (Sheet 2 of 5)

Ignition

IGT

I

Function

Signal name

IO Signal form and level

Comment

Do not add any voltage on it. There is

a built-in pull up resister, you can test

about 0.8V voltage on it.

¯¯|___|¯¯ low impulse width > 300ms

This signal switches the

module on. The IGT signal

characteristic is:

Power on triggered and

low level triggered. Fall

time should be <1ms.

Note: To turn on the mod-

ule please use an open-

drain/collector circuit.

Test point recommended.

If unused keep line open.

This line must be driven

low by an open drain or

open collector driver con-

nected to GND.

If unused keep line open.

Test point recommended.

This line must be driven

low.

If unused keep line open.

Note that the fast shut-

down line is originally

available as GPIO line. If

configured as fast shut-

down, the GPIO line is

assigned as follows:

GPIO4 --> FST_SHDN

All electrical characteris-

tics according to USB

Implementers' Forum,

USB 2.0 Specification.

If unused keep lines open.

Test points recommended.

Status

signaling

STATUS

Emer-

gency reset

EMERG_RST I

O VOImax = 0.45V at I = 1mA

VOHmin = 1.35V at I = 1mA

VOHmax = 1.8V

Do not add any voltage on it. There is

a built-in pull up resistor to pull to GND

when Reset.

¯¯|___|¯¯ low impulse width > 200ms

Fast shut-

down

FST_SHDN

I

VILmax = 0.63V

VIHmin = 1.17V

VIHmax = 1.8V

¯¯|___|¯¯ low impulse width > 1ms

USB

VUSB_IN

I

VINmin = 3V

VINmax = 5.25V

Active and suspend current:

Imax<100µA

USB_DN

I/O Full and high speed signal characteris-

USB_DP

tics according to USB 2.0 Specifica-

tion.

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Page 24 of 129

Table 3: Signal properties (Sheet 3 of 5)

Function

Signal name

IO Signal form and level

Comment

Serial

Interface

ASC0

O VOLmax = 0.45V

VOHmin = 1.35V

If unused keep lines open.

Test points recommended

for RXD0, TXD0, RTS0,

and CTS0.

RXD0

CTS0

DSR0

DCD0

RING0

TXD0

RTS0

DTR0

RXD1

CTS1

TXD1

RTS1

Serial Inter-

face ASC1

SIM card

detection

CCIN1

CCIN2

I

I

I

I

I

I

VILmax = 0.63V

VIHmin = 1.17V

VILmax = 0.63V

VIHmin = 1.17V

VILmax = 0.63V

VIHmin = 1.17V

O VOLmax = 0.45V

VOHmin = 1.35V

O

VILmax = 0.63V

VIHmin = 1.17V

VILmax = 0.63V

VIHmin = 1.17V

VIHmin = 1.17V

VILmax = 0.63V

3V SIM

Card Inter-

face

CCRST1

CCRST2

O VOLmax = 0.4V

VOHmin = 2.2V

VOHmax = 3.04V

CCIO1

CCIO2

CCCLK1

CCCLK2

CCVCC1

CCVCC2

I/O VILmax = 0.55V

VIHmin = 2.128V

VIHmax = 3.05V

VOLmax = 0.4V

VOHmin = 2.2V

VOHmax = 3.04V

O VOLmax = 0.4V

VOHmin = 2.2V

VOHmax = 3.04V

O VOmin = 2.75V

VOtyp = 2.85V

VOmax = 3.04V

IOmax = -30mA

If unused keep lines open

Test points recommended

for RXD1, TXD1, RTS1,

and CTS1.

CCIN = low, SIM card

inserted.

CCIN= high, SIM card

removed.

If unused keep line open.

Maximum cable length or

copper track to SIM card

holder should not exceed

100mm.

CCIO2 should add 10k

pull-up to CCVCC2

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Table 3: Signal properties (Sheet 4 of 5)

Function

Signal name

IO Signal form and level

Comment

1.8V SIM

Card Inter-

face

CCRST1

CCRST2

O VOLmax = 0.4V

VOHmin = 1.36V

VOHmax = 1.93V

Maximum cable length or

copper track to SIM card

holder should not exceed

100mm.

CCIO2 should add 10k

pull-up to CCVCC2

CCIO1

CCIO2

CCCLK1

CCCLK2

CCVCC1

CCVCC2

GPIO1-

GPIO8,

GPIO11-

GPIO21

GPIO24-

GPIO26

GPIO

interface

Digital

Audio

Interface

ADC_IN

(Analog-to-

Digital Con-

verter)

BCLK

DIN

DOUT

FSC

MCLK

ADC1

ADC2

ADC3

I/O VILmax = 0.334V

VIHmin = 1.351V

VIHmax = 1.97V

VOLmax = 0.4V

VOHmin = 1.336V

VOHmax = 1.93V

O VOLmax = 0.4V

VOHmin = 1.336V

VOHmax = 1.93V

O VOmin = 1.67V

VOtyp = 1.80V

VOmax = 1.93V

IOmax = -30mA

IO VILmax = 0.334V

VIHmin = 1.351V

VIHmax = 1.97V

VOLmax = 0.4V

VOHmin = 1.336V

VOHmax = 1.93V

VOLmax = 0.45V

VOHmin = 1.35V

VOHmax = 1.8V

VILmax = 0.63V

VIHmin = 1.17V

VIHmax = 1.8V

Freq=12.288MHz

O

I

O

O

O

I

Resolution 15 Bits

Offset error ±1%

VOHmin = 1.336V

VOHmax = 1.93V

RI = 10Mohm

VI = 0.1V ... 1.7V (valid range)

VIH max = 1.7V

If unused keep line open.

SIM Switch SIM_SWITCH O VOLmax = 0.4V

If unused keep line open.

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If unused keep line open.

Please note that most

GPIO lines can be config-

ured by AT command for

alternative functions or are

by default configured with

an alternative functionality:

GPIO4: Fast Shut Down

(Input)

GPIO5: LED status

GPIO26: SIM switch

If unused keep line open.

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Page 26 of 129

Table 3: Signal properties (Sheet 5 of 5)

Function

Signal name

IO Signal form and level

Comment

Power

indicator

PWR_IND

O VIHmax = 5.5V

VOLmax = 0.4V at Imax = 2mA

PWR_IND (Power Indica-

tor) notifies the module’s

on/off state (see Section

2.1.10).

PWR_IND is an open col-

lector that needs to be

connected to an external

pullup resistor. Low state

of the open collector indi-

cates that the module is

on. Vice versa, high level

notifies the power-down

mode. Therefore, the sig-

nal may be used to enable

external voltage regulators

which supply an external

logic for communication

with the module, e.g. level

converters.

Do not connect to V180.

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2.1.2.1

Absolute Maximum Ratings

Page 27 of 129

The absolute maximum ratings stated in Table 4 are stress ratings under any conditions.

Stresses beyond any of these limits will cause permanent damage to PLSx3.

Voltage at digital pins 1.8V domain in normal operation

V180 + 0.2 V

Table 4: Absolute maximum ratings

Parameter

Supply voltage BATT+ (no service)

Voltage at all digital pins in POWER DOWN mode

Voltage at SIM interface, CCVCC 1.8V in normal Operation

Voltage at SIM interface, CCVCC 2.85V in normal Operation

Current at SIM interface in 1.8V and 2.85V operation

Voltage at ADC pin in normal operation

V180 in normal operation

USB-Pins

Min

-0.3

-0.3

-0.2

0

0

0.1

+1.7

-0.3

Max

+5.5

+0.3

+2.16

+3.25

-145

+1.7*

+1.9

3.63

Unit

V

V

V

V

V

V

V

mA

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Page 28 of 129

2.1.3

USB Interface

PLSx3 supports a USB 2.0 High Speed (480Mbit/s) device interface that is Full Speed (12Mbit/

s) compliant. The impedances, serial and pull up resistors are implemented according to “Uni-

versal Serial Bus Specification Revision 2.0”1, No further additional components are required.

The external application is responsible for supplying the VUSB_IN line. This line is used for ca-

ble detection only. The USB part (driver and transceiver) is supplied by means of BATT+. This

is because PLSx3 is designed as a self-powered device compliant with the “Universal Serial

Bus Specification Revision 2.0”.

Module

SMT

VREG (3V075)

lin. reg.

USB part1)

VBUS

DP

DN

Detection only

RS

RS

BATT+

GND

VUSB_IN

USB_DP2)

USB_DN2)

1) All serial (including RS) and pull-up resistors for data lines are implemented.

2) If the USB interface is operated in High Speed mode (480MHz), it is recommended to take

special care routing the data lines USB_DP and USB_DN. Application layout should in this

case implement a differential impedance of 90 ohms for proper signal integrity.

Figure 4: USB circuit

To properly connect the module's USB interface to the external application, a USB 2.0 compat-

ible connector and cable or hardware design is required. For more information on the USB re-

lated signals see Table 3. Furthermore, the USB modem driver distributed with PLSx3 needs

to be installed.

While a USB connection is active, the module will never switch to SLEEP mode. Only if the USB

interface is in Suspend mode, the module is able to switch to SLEEP mode.

1. The specification is ready for download on http://www.usb.org/developers/docs/

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2.1.3.1

Reducing Power Consumption

Page 29 of 129

While a USB connection is active, the module will never switch into SLEEP mode. Only if the

USB interface is in Suspended state or Detached (i.e., VUSB_IN = 0) is the module able to

switch into SLEEP mode thereby saving power. There are two possibilities to enable power re-

duction mechanisms:

• Recommended implementation of USB Suspend/Resume/Remote Wakeup:

The USB host should be able to bring its USB interface into the Suspended state as

described in the “Universal Serial Bus Specification Revision 2.0“1. For this functionality to

work, the VUSB_IN line should always be kept enabled. On incoming calls and other events

PLSx3 will then generate a Remote Wakeup request to resume the USB host controller.

See also [3] (USB Specification Revision 2.0, Section 10.2.7, p.282):

"If USB System wishes to place the bus in the Suspended state, it commands the Host Con-

troller to stop all bus traffic, including SOFs. This causes all USB devices to enter the Sus-

pended state. In this state, the USB System may enable the Host Controller to respond to

bus wakeup events. This allows the Host Controller to respond to bus wakeup signaling to

restart the host system."

•

Implementation for legacy USB applications not supporting USB Suspend/Resume:

As an alternative to the regular USB suspend and resume mechanism it is possible to

employ the RING0 line to wake up the host application in case of incoming calls or events

signalized by URCs while the USB interface is in Detached state (i.e., VUSB_IN = 0). Every

wakeup event will force a new USB enumeration. Therefore, the external application has to

carefully consider the enumeration timings to avoid loosing any signaled events. For details

on this host wakeup functionality see Section 2.1.10.4. To prevent existing data call con-

nections from being disconnected while the USB interface is in detached state (i.e., VUS-

B_IN=0) it is possible to call AT&D0, thus ignoring the status of the DTR line (see also [1]).

1. The specification is ready for download on http://www.usb.org/developers/docs/

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2.1.4

Serial Interface ASC0

Page 30 of 129

PLSx3 offers an 8-wire unbalanced, asynchronous modem interface ASC0 conforming to ITU-

T V.24 protocol DCE signaling. The electrical characteristics do not comply with ITU-T V.28.

The significant levels are 0V (for low data bit or active state) and 1.8V (for high data bit or in-

active state). For electrical characteristics please refer to Table 3.

PLSx3 is designed for use as a DCE. Based on the conventions for DCE-DTE connections it

communicates with the customer application (DTE) using the following signals:

• Port TXD @ application sends data to the module’s TXD0 signal line

• Port RXD @ application receives data from the module’s RXD0 signal line

Figure 5: Serial interface ASC0

Features:

•

Includes the data lines TXD0 and RXD0, the status lines RTS0 and CTS0 and, in addition,

the modem control lines DTR0, DSR0, DCD0 and RING0.

• The RING0 signal serves to indicate incoming calls and other types of URCs (Unsolicited

Result Code). It can also be used to send pulses to the host application, for example to

wake up the application from power saving state.

• Configured for 8 data bits, no parity and 1 stop bit.

• ASC0 can be operated at fixed bit rates from 300bps up to 921600bps.

• Supports RTS0/CTS0 hardware flow control. The hardware hand shake line RTS0 has an

internal pull down resistor causing a low level signal, if the line is not used and open.

Although hardware flow control is recommended, this allows communication by using only

RXD and TXD lines.

• Wake up from SLEEP mode by RTS0 activation (high to low transition; see Section 3.3.4)

Note: The ASC0 modem control lines DTR0, DCD0, DSR0 and RING0 can also be configured

as GPIO lines. If configured as GPIO lines, these GPIO lines are assigned as follows:

GPIO1-->DTR0

GPIO2-->DCD0

GPIO3-->DSR0

GPIO24-->RING0

Configuration is done by AT command (see [1]). The configuration is non-volatile and becomes

active after a module restart.

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Notes: No data must be sent over the ASC0 interface before the interface is active and ready

to receive data (see Section 3.2.1).

The following figure shows the startup behavior of the asynchronous serial interface ASC0.

Start up

Power supply active

Reset

state

Firmware

initialization

Command interface

initialization

Interface

active

ON

VCORE

V180

EMERG_RST

Internal RST

TXD0

RXD0

RTS0

CTS0

DTR0

DSR0

DCD0

RING0

PD

PD

PD

PD

PD

PD

PD

For pull-up and pull-down values see Table 16.

Figure 6: ASC0 startup behavior

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2.1.5

Serial Interface ASC1

Page 32 of 129

Four PLSx3 GPIO lines can be configured as ASC1 interface signals to provide a 4-wire unbal-

anced, asynchronous modem interface ASC1 conforming to ITU-T V.24 protocol DCE signal-

ling. The electrical characteristics do not comply with ITU-T V.28. The significant levels are 0V

(for low data bit or active state) and 1.8V (for high data bit or inactive state). For electrical char-

acteristics please refer to Table 3.

PLSx3 is designed for use as a DCE. Based on the conventions for DCE-DTE connections it

communicates with the customer application (DTE) using the following signals:

• Port TXD @ application sends data to module’s TXD1 signal line

• Port RXD @ application receives data from the module’s RXD1 signal line

Figure 7: Serial interface ASC1

Features

•

Includes only the data lines TXD1 and RXD1 plus RTS1 and CTS1 for hardware hand-

shake.

• On ASC1 no RING line is available.

• Configured for 8 data bits, no parity and 1 or 2 stop bits.

• ASC1 can be operated at fixed bit rates from 300 bps to 921,600bps.

• Supports RTS1/CTS1 hardware flow. The hardware hand shake line RTS1 has an internal

pull down resistor causing a low level signal, if the line is not used and open. Although hard-

ware flow control is recommended, this allows communication by using only RXD and TXD

lines.

Notes: The ASC1 interface lines are originally available as GPIO lines. If configured as ASC1

lines, the GPIO lines are assigned as follows:

GPIO16-->RXD1

GPIO17-->TXD1

GPIO18-->RTS1

GPIO19-->CTS1

Configuration is done by AT command (see [1]). The configuration is non-volatile and becomes

active after a module restart.

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The following figure shows the startup behavior of the asynchronous serial interface ASC1.

Start up

Power supply active

Reset

state

Firmware

initialization

Command interface

initialization

Interface

active

IGT

VCORE

V180

EMERG_RST

Internal RST

TXD1

RXD1

RTS1

CTS1

PD

PD

PD

OH

For pull-down values see Table 16.

Figure 8: ASC1 startup behavior

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2.1.6

UICC/SIM/USIM Interface

Page 34 of 129

PLSx3 has two UICC/SIM/USIM interfaces (includes eSIM interface) compatible with the 3GPP

31.102 and ETSI 102 221. These are wired to the host interface in order to be connected to an

external SIM card holder. Five pads on the SMT application interface are reserved for each of

the two SIM interfaces.

The UICC/SIM/USIM interface supports 3V and 1.8V SIM cards. Please refer to Table 3 for

electrical specifications of the UICC/SIM/USIM interface lines depending on whether a 3V or

1.8V SIM card is used.

The CCINx signal serves to detect whether a tray (with SIM card) is present in the card holder.

Using the CCINx signal is mandatory for compliance with the GSM 11.11 recommendation if

the mechanical design of the host application allows the user to remove the SIM card during

operation. To take advantage of this feature, an appropriate SIM card detect switch is required

on the card holder. See Chapter 7.1 as example for a card holder with an internal switch.

Table 5: Signals of the SIM interface (SMT application interface)

Signal

Description

Ground connection for SIM interfaces. Optionally a separate SIM ground line using e.g.,

pad N11, may be used to improve EMC.

Chipcard clock lines for 1st and 2nd SIM interface.

SIM supply voltage lines for 1st and 2nd SIM interface.

Serial data lines for 1st and 2nd SIM interface, input and output.

Chipcard reset lines for 1st and 2nd SIM interface.

Input on the baseband processor for detecting a SIM card tray in the holder. If the SIM is

removed during operation the SIM interface is shut down immediately to prevent destruc-

tion of the SIM. The CCINx signal is active low.

The CCINx signal is mandatory for applications that allow the user to remove the SIM card

during operation.

The CCINx signal is solely intended for use with a SIM card. It must not be used for any

other purposes. Failure to comply with this requirement may invalidate the type approval of

PLSx3.

Note: No guarantee can be given, nor any liability accepted, if loss of data is encountered after

removing the SIM card during operation. Also, no guarantee can be given for properly initializ-

ing any SIM card that the user inserts after having removed the SIM card during operation. In

this case, the application must restart PLSx3.

By default, only the module’s 1st SIM interface is available and can be used. The usage of the

module’s 2nd SIM interface has to be configured by AT command.

As an alternative to connecting the module’s two SIM interfaces and switching between these via

AT command, it is possible to connect the first of the module’s SIM interfaces via an external SIM

switch that in turn provides access to a further SIM interface. For details see Section 2.1.6.2.

GND

CCCLK1

CCCLK2

CCVCC1

CCVCC2

CCIO1

CCIO2

CCRST1

CCRST2

CCIN1

CCIN2

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Module

1st SIM interface

2nd SIM interface

SIM1

SIM2

.

Figure 9: Module’s two UICC/SIM/USIM interfaces

Figure 10: UICC/SIM/USIM interfaces connected

The total cable length between the SMT application interface pads on PLSx3 and the pads of

the external SIM card holder must not exceed 100mm in order to meet the specifications of

3GPP TS 51.010-1 and to satisfy the requirements of EMC compliance.

To avoid possible cross-talk from the CCCLKx signal to the CCIOx signal be careful that both

lines are not placed closely next to each other. A useful approach is using the GND line to

shield the CCIOx line from the CCCLKx line.

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2.1.6.1

Enhanced ESD Protection for SIM Interface

To optimize ESD protection for the SIM interface it is possible to add ESD diodes (eg.

NUP4114) to the SIM interface lines as shown in the example given in Figure 11. Please place

the ESD protection close to the SIM connector. It is suggested that the cload of diode be less

than 3pF.

The example was designed to meet ESD protection according ETSI EN 301 489-1/7: Contact

discharge: ± 4kV, air discharge: ± 8kV.

Module

CCRST

CCVCC

CCIO

CCCLK

CCIN

SIM_RST

SIM_VCC

SIM_IO

6

5

4

1

2

3

GND

SIM_CLK

SIM_DET

Keep SIM lines low capacitative

Figure 11: SIM interface - enhanced ESD protection

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2.1.6.2

SIM_SWITCH Line

As an alternative to connecting the module’s two SIM interfaces and switching between these

interfaces by means of AT command, it is possible to connect the first of the module’s SIM in-

terfaces via an external SIM switch that in turn provides access to a further SIM interface.

Module

1st SIM interface

GPIO26/

SIM_SWITCH

Switch

SIM1A

SIM1B

Figure 12: External UICC/SIM/USIM switch

The module’s GPIO26 line can in this case be configured as SIM_SWITCH line in order to con-

trol the external SIM switch as shown in the sample circuit in Figure 13. A low state would then

indicate the usage of the first SIM interface (SIM1A), a high state would indicate the usage of

the second interface (SIM1B).

The configuration of the SIM_SWITCH (GPIO26) line is done via AT command, is non-volatile,

and available after the next module restart.

External Application

Module

SIM1A

ESD

protection

IF1

Sim Switch

COMMON

SIMSELECT

FSA2567

ESD

protection

IF2

SIM1B

VBAT

10k

22k

100k

VSIM1

CCCLK1

CCIO1

CCRST1

SIM_

SWITCH

CCIN1

Figure 13: Sample circuit for SIM interface connection via SIM switch

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2.1.7

GPIO Interface

PLSx3 offers a GPIO interface with 22 GPIO lines. The GPIO lines are shared with other inter-

faces or functions: Fast shutdown (see Section 2.1.10.3), Status LED (see Section 2.1.10.1),

ASC0 (see Section 2.1.4), ASC1 (see Section 2.1.5) and SIM Switch (see Section 2.1.6.2)

The following table shows the configuration variants for the GPIO pads. All variants are mutu-

ally exclusive, i.e. a pad configured for instance as Status LED is locked for alternative usage.

Table 6: GPIO lines and possible alternative assignment

Fast

Shutdown

Status LED

ASC0

ASC1

SIM

SWITCH

DAI

DTR0

DCD0

DSR0

FST_SHDN

Status LED

RXD1

TXD1

RTS1

CTS1

RING0

DOUT

DIN

SIM_SWITCH

GPIO

GPIO1

GPIO2

GPIO3

GPIO4

GPIO5

GPIO6

GPIO7

GPIO8

GPIO11

GPIO12

GPIO13

GPIO14

GPIO15

GPIO16

GPIO17

GPIO18

GPIO19

GPIO20

GPIO21

GPIO24

GPIO25

GPIO26

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The following figure shows the startup behavior of the GPIO interface.

Start up

Power supply active

Reset State

Firmware

Initialization

Command Interface

Initialization

Interface Active

IGT

VCORE

V180

EMERG_RST

Internal Reset

GPIO1,4,5,6

GPIO3

GPIO2,16

GPIO7,8,11-15

GPIO17-18

GPIO19

GPIO20,26

GPIO21,24

PD

Low

PD

PD

PD

OH

PU

PD

Figure 14: GPIO startup behavior

PD

PD

PD

PD

PD

PD

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2.1.8

Digital Audio Interface

Page 40 of 129

PLSx3 supports the digital audio interface that can be deployed as PCM or Inter_IC Sound

(I2S).

2.1.8.1

Pulse Code Modulation Interface

PLSx3’s PCM interface can be used to connect audio devices capable of pulse code

modulation. The PCM functionality is limited to the use of wideband codec with 16kHz sample

rate only. The PCM interface runs at 16 kHz sample rate (62.5μs frame length), while the

signal processing maintains this rate in a wideband AMR call or samples automatically down

to 8kHz in a narrowband call. Therefore, the PCM sample rate is independent of the audio

bandwidth of the call.

The PCM interface has the following characteristics:

• Master mode

•

•

•

•

Table 7 lists the available PCM interface signals.

Long frame synchronization

16kHz/8kHz sample rate

256, 512, 1024 and 4096kHz bit clock at 16kHz sample rate

256, 512, and 2048kHz bit clock at 8kHz sample rate

Table 7: Overview of PCM pin functions

Signal name

Signal direction

master

Description

DOUT

DIN

FSC

BCLK

MCLK

O

I

O

O

-

PCM Data from PLSx3 to external codec.

PCM Data from external codec to PLSx3.

Frame synchronization signal to external codec.

Bit clock to external codec. Note: If the BCLK signal is

permanently

provided (AT^SAIC parameter <clk_mode> = 0), the

module will no

longer enter its power save (SLEEP) state.

Audio master clock. Be synchronous to BCLK to use in

external codec. Can be switched on and off.

Note: PCM data is always formatted as 16-bit uncompressed two’s complement. Also, all

PCM data and frame synchronization signals are written to the PCM bus on the rising clock

edge and read on the falling edge.

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The following figure shows an example of short frame PCM timing at 8kHz sample rate and

2048kHz PCM_CLK in the master mode:

125 µs

PCMx_CLK

PCMx_SYNC

PCMx_OUT

MSB

14

13

12

PCMx_IN

MSB

14

13

12

2

2

1

1

LSB

LSB

MSB

MSB

Figure 15: PCM timing short frame

2.1.8.2

Inter-IC Sound Interface

The I2S Interface is a standardized bidirectio zonal I2S based digital audio interface for trans-

mission of mono voice signals for telephony services.

The I2S properties and capabilities comply with the requirements lay out in the Phillips I2S

Bus Specifications, revised June 5, 1996.

The I2S interface has the following characteristics:

• Bit clock mode: Master

• Sampling rate: 8kHz (narrowband), 16kHz (wideband)

•

•

256kHz bit clock at 8kHz sample rate

512kHz bit clock at 16kHz sample rate

Table 8 lists the available I2S interface signals

.

Table 8: Overview of I2S pin functions

Signal name on

SMT application

interface

Signal configura-

tion inactive

Signal direction

Master

Description

DOUT

DIN

FSC

BCLK

PD

PD

PD

PD

O

I

O

O

I2S data from PLSx3 to external

codec

I2S data from external codec to

PLSx3

Frame synchronization signal to

external codec Word alignment

(WS)

Bit clock to external codec.

BCLK signal low/high time varies

between 45% and 55% of its clock

period.

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2.1.9

Analog-to-Digital Converter (ADC)

Page 42 of 129

PLSx3 provides three unbalanced ADC input line: ADC[1...3]_IN. They can be used to mea-

sure three independent, externally connected DC voltages in the range of 0.1V to 1.7V. They

can be used especially for antenna diagnosing.

The AT^SRADC command can be employed to select the ADC line, set the measurement

mode and read out the measurement results.

2.1.10 Control Signals

2.1.10.1

Status LED

The GPIO5 interface line can be configured to drive a status LED that indicates different oper-

ating mode (for GPIOs see 2.1.7). GPIO and LED functionality are mutually exclusive.

To take advantage of this function connect an LED to the GPIO5/STATUS line as shown in

Figure 16

VCC

LED

R3

STATUS

R1

R2

GND

GND

Figure 16: Status signaling with LED driver

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2.1.10.2

Power Indication

The power indication signal PWR_IND notifies the on/off state of the module. High state of

PWR_IND indicates that the module is switched off. The state of PWR_IND immediately

changes to low when IGT is pulled low. For state detection an external pull-up resistor is re-

quired.

Module

Power supply

On/Off

(open drain

driver)

e.g. BATT+

e

c

a

f

r

e

t

n

i

T

M

S

PWR_IND

Figure 17: Power indication signal

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2.1.10.3

Fast Shutdown

The GPIO4 interface line can be configured as fast shutdown signal line FST_SHDN. The con-

figured FST_SHDN line is an active low control signal and must be applied for at least 1 milli-

seconds. If unused this line can be left open because of a configured internal pull-up resistor.

Before setting the FST_SHDN line to low, the IGT signal should be set to high (see Figure 18).

The fast shutdown feature can be triggered using the AT command AT^SMSO=<fso>. For de-

tails see [1].

If triggered, a low impulse >1 milliseconds on the FST_SHDN line starts the fast shutdown. The

fast shutdown procedure still finishes any data activities on the module's flash file system, thus

ensuring data integrity, but will no longer deregister gracefully from the network, thus saving

the time required for network deregistration.

Switch off procedure

fast shut down

BATT+BB

BATT+RF

IGT

EMERG_RST

Internal Reset

V180

PWR_IND

GPIO4/AT^SMSO=<fso>

(Fast Shut Down)

< 15ms

Active low

Open Collector

High Z

Figure 18: Fast shutdown timing

Please note that the normal software controlled shutdown using AT^SMSO will allow option for

a fast shutdown by parameter <fso>, i.e., without network deregistration. However, in this case

no URCs including shutdown URCs will be provided by the AT^SMSO command.

Please also note that the fast shutdown operation does not allow the module deregister from

the network, therefore, this practice is not recommended, and should not be conducted on reg-

ular basis. If it is used for energy saving reason, for instance, used in battery-driven solutions

that require prompt system shutdown before battery depletion, discretion is advised in such

case.

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2.1.10.4

Remote Wakeup

If no call, data or message transfer is in progress, the external host application may shut down

its own module interfaces or other components in order to save power. If a call, data, or other

request (URC) arrives, the external application can be notified of this event and be woken up

again by a state transition of a configurable remote wakeup line. Available as remote wakeup

lines are some GPIO signals (recommended is GPIO24). Please refer to [1]: AT^SCFG: "Re-

moteWakeUp/..." for details on how to configure these lines for defined wakeup events on

specified device interfaces. Possible states are listed in Table 9.

If no line is specifically configured as remote wakeup signal, the remote USB suspend and re-

sume mechanism as specified in the “Universal Serial Bus Specification Revision 2.0” applies

for the USB interface (see Section 2.1.3). Possible states for the remote wakeup GPIO lines

are listed in Table 9.

Table 9: Remote wakeup lines

Signal

GPIOx

I/O/P

O

Description

Inactive to active high transition:

0 = No wake up request

1 = The host shall wake up

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2.2

RF Antenna Interface

Page 46 of 129

The PLSx3 GSM/UMTS/LTE antenna interface comprises a GSM/UMTS/LTE main antenna as

well as a UMTS/LTE Rx diversity antenna to improve signal reliability and quality1. The RF in-

terface has an impedance of 50Ω. PLSx3 is capable of sustaining a total mismatch at the an-

tenna line without any damage, even when transmitting at maximum RF power.

The external antenna must be matched properly to achieve best performance regarding radi-

ated power, modulation accuracy and harmonic suppression. Antenna matching networks are

not included on the PLSx3 module and should be placed in the host application if the antenna

does not have an impedance of 50Ω.

Regarding the return loss PLSx3 provides the following values in the active band:

Table 10: Return loss in the active band

State of module

Return loss of module

Recommended return loss of application

Receive

Transmit

> 8dB

not applicable

> 12dB

> 12dB

1. By delivery default the UMTS/LTE Rx diversity antenna is configured as available for the module since

its usage is mandatory for LTE. Please refer to [1] for details on how to configure antenna settings.

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2.2.1

Antenna Interface Specifications

Page 47 of 129

Table 11: RF Antenna interface GSM/UMTS/LTE

Parameter

Conditions

Min.

Typical Max.

Unit

LTE connectivity

Band 1,2,3,4,5,7,8,12,13,14,17,18,19,20,25,26,28,38,40,41,66,71

Receiver Input Sensitivity

@ARP, Combined Antenna,

Channel BW at 5 MHz

@25°C, 3.8V

LTE FDD 1900 Band 2

LTE FDD 1800 Band 3

LTE FDD 2100 Band 1

-100.0

-104.3

LTE FDD 2100 Band 4

-100.0

-104.1

-98.0

-97.0

-98.0

-98.0

-97.0

-97.0

-97.0

TBD

-97.0

-98.0

-104.7

-104.3

-103.4

-102.2

-104.1

-104.8

-105.0

TBD

-104.4

-103.3

LTE FDD 850 Band 5

LTE FDD 2600 Band 7

LTE FDD 900 Band 8

LTE FDD 700 Band 12

LTE FDD 700 Band 13

LTE FDD 700 Band 14

LTE FDD 700 Band 17

LTE FDD 850 Band 18

LTE FDD 850 Band 19

-100.0

-102.7

LTE FDD 800 Band 20

-97.0

-104.5

LTE FDD 1900 Band 25

TBD

TBD

LTE FDD 850 Band 26

LTE FDD 700 Band 28

-98.0

-98.5

-103.1

-104.9

LTE TDD 2600 Band 38

-100.0

-103.6

LTE TDD 2300 Band 40

-100.0

-104.6

LTE TDD 2500 Band 41

-98.0

LTE FDD 2100 Band 66

-99.5

-103.5

-104.0

LTE FDD 600 Band 71

TBD

TBD

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

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Table 11: RF Antenna interface GSM/UMTS/LTE

Parameter

Conditions

Min.

Typical Max.

RF Power @ARP with 50Ω

Load (Board

temperature<85°C, 5 MHz

BW, 1RB Position Low)

LTE FDD 2100 Band 1

LTE FDD 1900 Band 2

LTE FDD 1800 Band 3

LTE FDD 2100 Band 4

LTE FDD 850 Band 5

LTE FDD 2600 Band 7

LTE FDD 900 Band 8

LTE FDD 700 Band 12

LTE FDD 700 Band 13

LTE FDD 700 Band 14

LTE FDD 700 Band 17

LTE FDD 850 Band 18

LTE FDD 850 Band 19

LTE FDD 800 Band 20

LTE FDD 1900 Band 25

LTE FDD 850 Band 26

LTE FDD 700 Band 28

LTE TDD 2600 Band 38

LTE TDD 2300 Band 40

LTE TDD 2500 Band 41

LTE FDD 2100 Band 66

LTE FDD 600 Band 71

+21

+21

+21

+21

+21

+21

+21

+21

+21

+21

+21

+21

+21

+21

+21

+21

+21

+21

+21

+21

+21

+21

+23.0

+23.0

+23.0

+23.0

+23.0

+22.5

+23.0

+23.0

+23.0

+23.0

+23.0

+23.0

+23.0

+23.0

+23.0

+23.0

+23.0

+23.0

+23.0

+23.0

+23.0

+23.0

Unit

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

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Table 11: RF Antenna interface GSM/UMTS/LTE

Parameter

Conditions

Min.

Typical Max.

Unit

UMTS connectivity

Band I,II,III, IV,V,VI,VIII,XIX

Receiver Input Main Sensi-

tivity @ ARP @25°C, 3.8V

UMTS 2100 Band I

-106.7

-110.2

UMTS 1900 Band II

-104.7

-111.3

Receiver Input Diversity

Sensitivity @ ARP @25°C,

3.8V

RF Power @ ARP with

50Ohm Load

Board temperature < 85°C

UMTS 1800 Band III

-103.7

-110.6

UMTS 2100 Band IV

-106.7

-110.3

UMTS 850 Band V

-104.7

-110.9

UMTS 850 Band VI

-106.7

-110.2

UMTS 900 Band VIII

-103.7

-110.5

UMTS 850 Band XIX

-106.7

-110.5

UMTS 2100 Band I

-106.7

-111.5

UMTS 1900 Band II

-104.7

-111.6

UMTS 1800 Band III

-103.7

-112.1

UMTS 2100 Band IV

-106.7

-111.8

UMTS 850 Band V

-104.7

-112.0

UMTS 850 Band VI

-106.7

-111.3

UMTS 900 Band VIII

-103.7

-111.8

UMTS 850 Band XIX

-106.7

-111.1

UMTS 2100 Band I

UMTS 1900 Band II

UMTS 1800 Band III

UMTS 1700 Band IV

UMTS 850 Band V

UMTS 850 Band VI

UMTS 900 Band VIII

UMTS 850 Band XIX

Small MS

GSM 850

E-GSM 900

DCS 1800

PCS 1900

GSM 850

E-GSM 900

DCS 1800

PCS 1900

+21

+21

+21

+21

+21

+21

+21

+21

+23.5

+23.5

+23.5

+23.5

+23.5

+23.5

+23.5

+23.5

-102.0

-108.6

-102.0

-108.9

-102.0

-109.6

-102.0

-109.6

33

33

30

30

GPRS coding schemes

Class 12, CS1 to CS4

Class 12, MCS1 to MCS9

EGPRS

GSM Class

Static Receiver input Sensi-

tivity @ ARP

RF Power @ ARP

with 50Ohm Load

Board temperature < 85°C

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

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Table 11: RF Antenna interface GSM/UMTS/LTE

Parameter

Conditions

Min.

Typical Max.

RF Power @ ARP

with 50Ohm Load,

(ROPR = 4, i.e. no reduction)

GPRS, 1 TX GSM 850

EDGE, 1 TX

GSM 850

GPRS, 2 TX GSM 850

EDGE, 2 TX

GSM 850

GPRS, 3 TX GSM 850

EDGE, 3 TX

GSM 850

GPRS, 4 TX GSM 850

E-GSM 900

DCS 1800

PCS 1900

E-GSM 900

DCS 1800

PCS 1900

E-GSM 900

DCS 1800

PCS 1900

E-GSM 900

DCS 1800

PCS 1900

E-GSM 900

DCS 1800

PCS 1900

E-GSM 900

DCS 1800

PCS 1900

E-GSM 900

DCS 1800

PCS 1900

E-GSM 900

DCS 1800

PCS 1900

EDGE, 4 TX

GSM 850

33

33

30

30

27

27

26

26

33

33

30

30

27

27

26

26

33

33

30

30

27

27

26

26

33

33

30

30

27

27

26

26

Unit

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

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Table 11: RF Antenna interface GSM/UMTS/LTE

Parameter

Conditions

Min.

Typical Max.

RF Power @ ARP

with 50Ohm Load,

(ROPR =5, i.e. partial reduc-

tion)

GPRS, 1 TX GSM 850

EDGE, 1 TX

GSM 850

GPRS, 2 TX GSM 850

EDGE, 2 TX

GSM 850

GPRS, 3 TX GSM 850

EDGE, 3 TX

GSM 850

GPRS, 4 TX GSM 850

EDGE, 4 TX

GSM 850

E-GSM 900

DCS 1800

PCS 1900

E-GSM 900

DCS 1800

PCS 1900

E-GSM 900

DCS 1800

PCS 1900

E-GSM 900

DCS 1800

PCS 1900

E-GSM 900

DCS 1800

PCS 1900

E-GSM 900

DCS 1800

PCS 1900

E-GSM 900

DCS 1800

PCS 1900

E-GSM 900

DCS 1800

PCS 1900

33

33

30

30

27

27

26

26

33

33

30

30

27

27

26

26

27

27

26

26

31

31

28

28

27

27

26

26

32.2

32.2

29.2

29.2

Unit

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

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Table 11: RF Antenna interface GSM/UMTS/LTE

Parameter

Conditions

Min.

Typical Max.

RF Power @ ARP

with 50Ohm Load,

(ROPR = 6, i.e. partial reduc-

tion)

GPRS, 1 TX GSM 850

EDGE, 1 TX

GSM 850

GPRS, 2 TX GSM 850

EDGE, 2 TX

GSM 850

GPRS, 3 TX GSM 850

EDGE, 3 TX

GSM 850

GPRS, 4 TX GSM 850

EDGE, 4 TX

GSM 850

E-GSM 900

DCS 1800

PCS 1900

E-GSM 900

DCS 1800

PCS 1900

E-GSM 900

DCS 1800

PCS 1900

E-GSM 900

DCS 1800

PCS 1900

E-GSM 900

DCS 1800

PCS 1900

E-GSM 900

DCS 1800

PCS 1900

E-GSM 900

DCS 1800

PCS 1900

E-GSM 900

DCS 1800

PCS 1900

33

33

30

30

27

27

26

26

32

32

29

29

27

27

26

26

27

27

26

26

29

29

26

26

27

27

26

26

30.2

30.2

27.2

27.2

Unit

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

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Table 11: RF Antenna interface GSM/UMTS/LTE

Parameter

Conditions

Min.

Typical Max.

RF Power @ ARP

with 50Ohm Load,

(ROPR = 7, i.e. partial reduc-

tion)

GPRS, 1 TX GSM 850

EDGE, 1 TX

GSM 850

GPRS, 2 TX GSM 850

EDGE, 2 TX

GSM 850

GPRS, 3 TX GSM 850

EDGE, 3 TX

GSM 850

GPRS, 4 TX GSM 850

EDGE, 4 TX

GSM 850

E-GSM 900

DCS 1800

PCS 1900

E-GSM 900

DCS 1800

PCS 1900

E-GSM 900

DCS 1800

PCS 1900

E-GSM 900

DCS 1800

PCS 1900

E-GSM 900

DCS 1800

PCS 1900

E-GSM 900

DCS 1800

PCS 1900

E-GSM 900

DCS 1800

PCS 1900

E-GSM 900

DCS 1800

PCS 1900

33

33

30

30

27

27

26

26

30

30

27

27

27

27

26

26

27

27

26

26

27

27

24

24

27

27

26

26

28.2

28.2

25.2

25.2

Unit

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

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Table 11: RF Antenna interface GSM/UMTS/LTE

Parameter

Conditions

Min.

Typical Max.

RF Power @ ARP

with 50Ohm Load,

(ROPR = 8, i.e. max reduc-

tion)

GPRS, 1 TX GSM 850

EDGE, 1 TX

GSM 850

GPRS, 2 TX GSM 850

EDGE, 2 TX

GSM 850

GPRS, 3 TX GSM 850

EDGE, 3 TX

GSM 850

GPRS, 4 TX GSM 850

EDGE, 4 TX

GSM 850

E-GSM 900

DCS 1800

PCS 1900

E-GSM 900

DCS 1800

PCS 1900

E-GSM 900

DCS 1800

PCS 1900

E-GSM 900

DCS 1800

PCS 1900

E-GSM 900

DCS 1800

PCS 1900

E-GSM 900

DCS 1800

PCS 1900

E-GSM 900

DCS 1800

PCS 1900

E-GSM 900

DCS 1800

PCS 1900

33

33

30

30

27

27

26

26

30

30

27

27

24

24

23

23

28.2

28.2

25.2

25.2

22.2

22.2

21.2

21.2

27

27

24

24

21

21

20

20

Unit

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

dBm

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Table 12: RF Antenna interface LTE for -J variant (at operating temperature range)

Parameter

Condition

Min.

Typical Max.

Unit

LTE connectivity

Band 1,3,8,18,19,26

Receiver Input Sensitivity

@ARP, Combined Antenna,

Channel BW at 10MHz

@25°C, 3.8V

LTE FDD 2100 Band 1

LTE FDD 1800 Band 3

LTE FDD 900 Band 8

LTE FDD 850 Band 18

LTE FDD 850 Band 19

LTE FDD 850 Band 26

-102.2

-102.2

-101.9

-101

-100.3

-100.8

dBm

dBm

dBm

dBm

dBm

dBm

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2.2.2

Antenna Installation

The antenna is connected by soldering the antenna pads (ANT_MAIN, ANT_DRX and

ANT_GNSS) and their neighboring ground pads directly to the application’s PCB.

1

2

3

4

5

6

7

8

9

10

11

12

13

14

15

16

K ANT_

MAIN

GND

GND

GND

E ANT_

GNSS

GND

P

N

M

L

J

H

G

F

D

C

B

A

GND

ANT_

DRX

GND

Figure 19: Antenna pads (bottom view)

The distance between the antenna pads and their neighboring GND pads has been optimized

for best possible impedance. To prevent mismatch, special attention should be paid to these

pads on the application’ PCB.

The wiring of the antenna connection, starting from the antenna pad to the application’s anten-

na should result in a 50Ω line impedance. Line width and distance to the GND plane need to

be optimized with regard to the PCB’s layer stack. Some examples are given in Section 2.2.3.

To prevent receiver desensitization due to interferences generated by fast transients like high

speed clocks on the external application PCB, it is recommended to realize the antenna con-

nection line using embedded Stripline rather than Micro-Stripline technology. Please see Sec-

tion 2.2.3 for examples of how to design the antenna connection in order to achieve the

required 50Ω line impedance.

For type approval purposes, the use of a 50Ω coaxial antenna connector (U.FL-R-SMT) might

be necessary. In this case the U.FL-R-SMT connector should be placed as close as possible

to PLSx3‘s antenna pad.

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2.2.3

RF Line Routing Design

2.2.3.1

Line Arrangement Examples

Page 57 of 129

Several dedicated tools are available to calculate line arrangements for specific applications

and PCB materials - for example from http://www.polarinstruments.com/ (commercial software)

or from http:www.awr.com/awr-software/options/tx-line/ (free software).

Embedded Stripline

This figure below shows a line arrangement example for embedded stripline.

Figure 20: Embedded stripline arrangement example

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Micro-Stripline

This section gives two line arrangement examples for micro-stripline.

Figure 21: Micro-Stripline arrangement example

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2.2.3.2

Routing Example

Interface to RF Connector

Figure 22 and Figure show a sample connection of a module‘s antenna pad at the bottom layer

of the module PCB with an application PCB‘s coaxial antenna connector. Line impedance de-

pends on line width, but also on other PCB characteristics like dielectric, height and layer gap.

The sample stripline width of 0.33mm/0.8mm and the space of 0.625mm/0.173mm are

only recommended for an application with a PCB layer stack resembling the one of the PLSx3

evaluation board, and with layer 2 as well as layer 3 cut clear. For different layer stacks the

stripline width will have to follow stripline routing rules, avoiding 90 degree comers and using

the shortest distance to the PCB’s coaxial antenna connector.

G N D

G N D

e.g.

ANT_

TRX1

Stripline (50 ohms) on top

layer of evaluation board from

antenna pad to module edge

Width = 0.33 mm

Ground connection

Edge of module PCB

50 ohms microstrip line

E.g., U.FL antenna

connector

G N D

G N D

Figure 22: Routing to application‘s RF connector

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Figure 23: Routing Detail

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2.3

GNSS Antenna Interface

2.3.1

GNSS Receiver

PLSx3 integrates a GNSS receiver that offers the full performance of GPS/GLONASS/BeiDou/

Galileo technology. The GNSS receiver is able to continuously track all satellites in view, thus

providing accurate satellite position data.

The integrated GNSS receiver supports the NMEA protocol. NMEA is a combined electrical

and data specification for communication between various (marine) electronic devices includ-

ing GNSS receivers. It has been defined and controlled by the US based National Marine Elec-

tronics Association. For more information on the NMEA Standard please refer to http://

www.nmea.org.

Depending on the receiver’s knowledge of last position, current time and ephemeris data, the

receiver’s startup time (i.e., TTFF = Time-To-First-Fix) may vary: If the receiver has no knowl-

edge of its last position or time, a startup takes considerably longer than if the receiver still has

knowledge of its last position, time and almanac or has still access to valid ephemeris data and

the precise time. For more information see Section 2.3.4. Often, 2D measurements will be used

over 3D depending on space vehicle (SV) locations as this will be just as accurate and faster.

By default, the GNSS receiver is switched off. It has to be switched on and configured using

AT commands (AT^SGPSC; see[1]).

2.3.2

GNSS Antenna

In addition to the RF antenna interface PLSx3 also has a GNSS antenna interface. See Section

2.1.1 to find out where the GNSS antenna pad is located. The GNSS pad’s shape is the same

as for the RF antenna interface (see Section 2.2.2).

It is possible to connect active or passive GNSS antennas. In either case they must have 50Ω

impedance. The simultaneous operation of GSM/UMTS/LTE and GNSS is implemented. For

electrical characteristics see Section 2.2.

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PLSx3 provides the signal VGNSS to enable an active GNSS antenna power supply. Figure 24

shows the flexibility in realizing the power supply for an active GNSS antenna by giving a sam-

ple circuit realizing the supply voltage for an active GNSS antenna.

Module

Application:

GNSS

Receiver

Antenna

Matching

ANT_GNSS

ANT_GNSS_DC

RF

DC

DC

LNA

Active GNSS

Antenna

BATT+

VGNSS

(3.2V)

VGNSS

IN OUT

EN

LDO

LP3985IM5-3.2

Rs

Is

1R0

Rv

100

-

+

Io

Current Sensor

FAN4010

Io

Rg

3k3

ADCx_IN

Si1023X_1

10k

1u

ESD

Protection

Si1023X_2

10k

Ug

Figure 24: Supply voltage for active GNSS antenna

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Figure 25 shows a sample circuit realizing ESD protection for a passive GNSS antenna. Con-

necting the input ANT_GNSS_DC to GND prevents ESD from coupling into the module.

Module

SMT interface

VGNSS

Not used

100nF

22pF

ANT_GNSS_DC

12nH

ANT_GNSS

To GNSS

receiver

(Optional)

ESD

protection

0R

Passive

GNSS

antenna

Figure 25: ESD protection for passive GNSS antenna

2.3.3

GNSS Antenna Diagnostic

GNSS antenna diagnosis does require an external detection circuit. The antenna DC supply

current can be measured via ADCx_IN. The ADCx_IN input voltage (Ug) may be generated by

a sample circuit shown in Figure 24. The circuit allows to check the presence and the connec-

tion status of an active GNSS antenna. Passive GNSS antennas cannot be detected. There-

fore, GNSS antenna detection is only available in active GNSS antenna mode. This mode is

configured by the AT command: AT^SGPSC (for details see [1])

Having enabled the active GNSS antenna mode the presence and connection status of an ac-

tive GNSS antenna can be checked using the AT command AT^SRADC to monitor ADCx_IN.

The following table lists sample current ranges for possible antenna states as well as sample

voltage ranges as possible decision thresholds to distinguish between the antenna connection

states. Please refer to [1] for more information on the command AT^SRADC.

Table 13: Sample ranges of the GNSS antenna diagnostic measurements and their possible meaning

Antenna connection status

Antenna not connected

Decision threshold

Antenna connected

Decision threshold

Current ranges (IS)1

<1.4mA

Voltage ranges (UG)

2.2mA...20mA

59mV ±20%

825mV ±20%

Antenna short circuited to ground

>30mA

GNSS antenna detection is not possible because

GNSS antenna power supply is switched off.

--

1. Please note that the mA ranges 1.4mA...2.2mA and 20mA...30mA are tolerance ranges. The decision

threshold should be defined within these ranges.

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2.3.4

GNSS Antenna Interface Characteristics

Table 14: GNSS properties

Parameter

Frequency

Conditions

GPS

GLONASS

Tracking Sensitivity

Open sky (active antenna or LNA):

Min.

Typical Max.

1574.4

1575.42

1576.4

1597.5

1602

1605.9

Acquisition Sensitivity Open sky (active antenna or LNA):

GPS

GPS

GPS

GPS

Open sky (active antenna or LAN):

GLONASS

Open sky (passive antenna):

Open sky (passive antenna):

GLONASS

Open sky (active antenna or LNA):

GLONASS

Open sky (passive antenna):

Open sky (passive antenna):

GLONASS

Warm (average at -130dBm)

Cold (average at -130dBm)

-159

-158

-156

-156

-147

-146

-145

-144

28

32

Time-to-First-Fix

(TTFF)1

1. Open sky environment

Note: For PLSx3-W modules, if GNSS works together with LTE Band13 in the field, to avoid

Band13 second harmonic interfere GNSS sensitivity in the worst LET network condition,

please design the GNSS antenna at least 20dB decoupling with LTE main antenna and use

the extra LNA for GNSS.

Unit

MHz

dBm

dBm

s

s

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2.4

Sample Application

Figure 26 shows a typical example of how to integrate a PLSx3 module with an application.

Usage of the various host interfaces depends on the desired features of the application.

Because of the very low power consumption design, current flowing from any other source into

the module circuit must be avoided, for example reverse current from high state external control

lines. Therefore, the controlling application must be designed to prevent reverse current flow.

Otherwise there is the risk of undefined states of the module during startup and shutdown or

even of damaging the module.

Because of the high RF field density inside the module, it cannot be guaranteed that no self

interference might occur, depending on frequency and the applications grounding concept. The

potential interferers may be minimized by placing small capacitors (47pF) at suspected lines

(e.g. RXD0, VDDLP, and ON).

While developing SMT applications it is strongly recommended to provide test points

for certain signals, i.e., lines to and from the module - for debug and/or test purposes.

The SMT application should allow for an easy access to these signals. For details on

how to implement test points see [4].

The EMC measures are best practice recommendations. In fact, an adequate EMC strategy for

an individual application is very much determined by the overall layout and, especially, the po-

sition of components. For example, mounting the internal acoustic transducers directly on the

PCB eliminates the need to use the ferrite beads shown in the sample schematic.

Disclaimer

No warranty, either stated or implied, is provided on the sample schematic diagram shown in

Figure 26 and the information detailed in this section. As functionality and compliance with na-

tional regulations depend to a great amount on the used electronic components and the indi-

vidual application layout manufacturers are required to ensure adequate design and operating

safeguards for their products using PLSx3 modules.

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BATT+_DSB

0R

(cid:39)(cid:72)(cid:70)(cid:82)(cid:88)(cid:83)(cid:79)(cid:76)(cid:81)(cid:74)(cid:3)

(cid:70)(cid:68)(cid:83)(cid:68)(cid:70)(cid:76)(cid:87)(cid:82)(cid:85)(cid:86)

(cid:72)(cid:17)(cid:74)(cid:17)(cid:3)(cid:20)(cid:19)(cid:19)(cid:541)(cid:41)(cid:3)(cid:48)(cid:47)(cid:38)(cid:38)

(cid:59)(cid:24)(cid:53)

V180

(cid:39)(cid:72)(cid:70)(cid:82)(cid:88)(cid:83)(cid:79)(cid:76)(cid:81)(cid:74)(cid:3)

(cid:70)(cid:68)(cid:83)(cid:68)(cid:70)(cid:76)(cid:87)(cid:82)(cid:85)(cid:86)

(cid:72)(cid:17)(cid:74)(cid:17)(cid:3)(cid:20)(cid:19)(cid:19)(cid:541)(cid:41)(cid:3)(cid:48)(cid:47)(cid:38)(cid:38)

(cid:59)(cid:24)(cid:53)

PLSx3

BATT+BB

BATT+RF

V180

EMERG_RST

Main antenna

Diversity antenna

GNSS antenna

ANT_MAIN

ANT_DRX

GND

GND

GND

GND

GND

GND

ANT_GNSS

GND

IGT

ANT_GNSS_DC

ANT_GNSS_DC

*For more details see

Section 5.2 GNSS Antenna Interface

100nF

47k

47k

2

2

33pF

(cid:37)(cid:38)(cid:27)(cid:23)(cid:26)

(cid:37)(cid:38)(cid:27)(cid:23)(cid:26)

GND

E.g., VBATT

E.g., 100k

Power Indicator

PWR_IND

CCVCC1

USB

USB interface*

*For more details

see(cid:3)Section 2.1.3

USB Interface

3

8

4

5

3

ACS0

ACS1

ADC

Status

Serial Interface

Serial Interface

ADC input interface

Status

LED

CCIO1

Digital Audio

PCM(I2S) Interface&MCLK

CCVCC1

k

0

1

CCCLK1

CCRST1

CCIN1

SIM1

GND

SIM2

GND

F

n

1

F

p

0

1

F

p

0

1

F

n

0

2

2

GND

GND

GND

GND

CCVCC2

k

0

1

CCVCC2

CCIO2

CCCLK2

CCRST2

CCIN2

F

n

1

F

p

0

1

F

p

0

1

F

n

0

2

2

GND

GND

GND

GND

GND

FST_SHDN

Fast shutdown

SIM_SWITCH

SIM Switch

GPIO

GPIO*

V180

k

2

.

2

k

2

.

2

I2CCLK

I2CDAT

GND

*When has the

function(cid:3)of GPIO

multiplexing PADs,

used as GPIO(cid:3)function,

need through the SW

switch(cid:3)command.

Figure 26: Schematic diagram of PLSx3 sample application

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3

Operating Characteristics

3.1

Operating Modes

Page 67 of 129

The table below briefly summarizes the various operating modes referred to throughout the

document.

Table 15: Overview of operating modes

Mode

Function

Normal

operation

GSM /

GPRS / UMTS /

HSPA / LTE

SLEEP

GSM /

GPRS / UMTS /

HSPA / LTE

IDLE

GSM TALK/

GSM DATA

GPRS DATA

EGPRS DATA

UMTS TALK/

UMTS DATA

HSPA DATA

Power saving set automatically when no call is in progress and the USB

connection is suspended by host or not present and no active commu-

nication via ASC0.

Power saving disabled or an USB connection not suspended, but no

call in progress.

Connection between two subscribers is in progress. Power consump-

tion depends on the GSM network coverage and several connection

settings (e.g. DTX off/on, FR/EFR/HR, hopping sequences and

antenna connection). The following applies when power is to be mea-

sured in TALK_GSM mode: DTX off, FR and no frequency hopping.

GPRS data transfer in progress. Power consumption depends on net-

work settings (e.g. power control level), uplink / downlink data rates and

GPRS configuration (e.g. used multislot settings).

EGPRS data transfer in progress. Power consumption depends on net-

work settings (e.g. power control level), uplink / downlink data rates and

EGPRS configuration (e.g. used multislot settings).

UMTS data transfer in progress. Power consumption depends on net-

work settings (e.g. TPC Pattern) and data transfer rate.

HSPA data transfer in progress. Power consumption depends on net-

work settings (e.g. TPC Pattern) and data transfer rate.

LTE TALK/

LTE DATA

LTE data transfer in progress. Power consumption depends on network

settings (e.g. TPC Pattern) and data transfer rate.

Power

Down

Normal shutdown after sending the power down command. Only a voltage regulator is

active for powering the RTC. Software is not active. Interfaces are not accessible. Operat-

ing voltage remains applied.

Airplane

mode

Airplane mode shuts down the radio part of the module, causes the module to log off from

the network and disables all AT commands whose execution requires a radio connection.

Airplane mode can be controlled by AT command (see [1]).

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3.2

Power Up/Power Down Scenarios

Page 68 of 129

In general, be sure not to turn on PLSx3 while it is beyond the safety limits of voltage and tem-

perature stated in Section 2.1.2.1. PLSx3 immediately switches off after having started and de-

tected these inappropriate conditions. In extreme cases this can cause permanent damage to

the module.

3.2.1

Turn on PLSx3

After the operating voltage BATT+ is applied, PLSx3 can be switched on by means of the IGT

signal.

The IGT signal turns on the module if the module is in power down mode. The IGT signal is

low level triggered. The module starts in the operating mode with a continuous low level signal.

It is recommended to pull the IGT sinal to GND directly when powering on. The low pulse width

must be longer than 300ms as shown in Figure 27.

When a automatic power-on is needed, IGT can always be connected to GND.

>300 ms

BATT+

IGT

V180

EMERG_RST

3.2.2

Restart PLSx3

Figure 27: IGT timing

To switch the module off the following procedures may be used:

• Software controlled restart procedure: Software controlled by sending an AT command

over the serial application interface. See Section 3.2.2.1.

• Hardware controlled restart procedure: Hardware controlled by using the EMERG_RST

line (see Section 3.2.2.2).

3.2.2.1

Restart PLSx3 Using Restart Command

After startup PLSx3 can be re-started using the AT+CFUN command. For details see [1]

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3.2.2.2

Restart PLSx3 Using EMERG_RST

Page 69 of 129

The EMERG_RST signal is internally connected to the baseband processor. A low level >2

00ms sets the processor and all signals to the reset states, and thus restart the module.

Please note that if the EMERG_RST signal is not released, i.e., changed from low to high, after

a restart, the module will be repeatedly restarted. When the timer of the EMERG_RST signal

is more than 8000ms, the module will be switched off directly.

It is strongly recommended to control this EMERG_RST line with an open collector transistor

or an open drain field-effect transistor.

Caution: Use the EMERG_RST line only when, due to serious problems, the software is not

responding for more than 5 seconds. Pulling the EMERG_RST line causes the loss of all

information stored in the volatile memory. Therefore, this procedure is intended only for use in

case of emergency, e.g. if PLSx3 does not respond, if reset or shutdown via AT command

fails.

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3.2.3

Signal States after Startup

Page 70 of 129

Table 16 lists the states each interface signal passes through during reset phase and the first

firmware initialization. For further firmware startup initializations the values may differ because

of different GPIO line configurations.

After the reset state has been reached the firmware initialization state begins. The firmware ini-

tialization is completed as soon as the ASC0 interface lines CTS0, DSR0 and RING0 have

turned low (see Section 2.1.4 and Section 2.1.5). Now, the module is ready to receive and

transmit data.

Table 16: Pull-up and Pull-down Values

Signal name

Reset state

First start up configuration

RXD0

TXD0

RTS0

CTS0

STATUS/GPIO5

DSR0/GPIO3

DCD0/GPIO2

RING0/GPIO24

RXD1/GPIO16

TXD1/GPIO17

RTS1/GPIO18

CTS1/GPIO19

GPIO6-8

GPIO11-13

GPIO14-15

GPIO25

DOUT/GPIO20

DIN/GPIO21

SIM_SWITCH/GPIO26

FAST_SHDN/GPIO4

PD

PD

PD

PD

PD

PD

PD

PD

PD

PD

O/H

PD

PD

I

PD

PD

PD

PD

O/H

PD

O/L

PD

O/L

O/H

O/H

O/H

PD

PD

O/H

PD

PD

I

PD

O/H

PD

PD

Note: the values above are stored as non- volatile, any changes of the value will take effect

after next power-cycle and remain effective before any change happens again.

Abbreviations used in above Table 16:

L = Low level

H = High level

T = Tristate

I = Input

O = Output

OD = Open Drain

PD = Pull down, 200µA at 1.9V

PU = Pull up, -240µA at 0V

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3.2.4

Turn off PLSx3

To switch the module off the following procedures may be used:

• Software controlled shutdown procedure: Software controlled by sending an AT command

over the serial application interface. See Section 3.2.4.1

• Hardware controlled shutdown procedure: Hardware controlled by setting the FST_SHDN

line to low. See Section 2.1.10.3

• Automatic shutdown (software controlled): See Section 3.2.5

- Take effect if PLSx3 board temperature exceeds a critical limit, or if

- Undervoltage or overvlotage is detected.

3.2.4.1

Switch off PLSx3 Using AT Command

The best and safest approach to powering down the module is to issue the AT^SMSO com-

mand. This procedure lets the module log off from the network and allows the software to enter

into a secure state and to save data before disconnecting the power supply. The shutdown pro-

cedure will be an active process for about 2 seconds (depending on environmental conditions

such as network states) until the module switches off.

A low level of the V180 signal as well as the URC "^SHUTDOWN" indicate that the switch off

procedure has completed and the module has entered the Power Down mode.

3.2.5

Automatic Shutdown

Automatic shutdown takes effect if the following event occurs:

• PLSx3 board is exceeding the critical limits of overtemperature or undertemperature (see

Section 3.2.5.1)

• Undervoltage or overvoltage is detected (see Section 3.2.5.2 and Section 3.2.5.3)

The automatic shutdown procedure is equivalent to the power-down initiated with an AT com-

mand, i.e. PLSx3 logs off from the network and the software enters a secure state avoiding loss

of data.

3.2.5.1

Thermal Shutdown

The board temperature is constantly monitored by an internal NTC resistor located on the PCB.

The values detected by the NTC resistor are measured directly on the board and therefore, are

not fully identical with the ambient temperature.

Each time the board temperature goes out of range or back to normal, PLSx3 instantly displays

an alert (if enabled).

• URCs indicating the level "1" or "-1" allow the user to take appropriate precautions, such as

protecting the module from exposure to extreme conditions. The presentation of the URCs

depends on the settings selected with the AT^SCTM write command (for details see [1]):

AT^SCTM=1: Presentation of URCs is always enabled.

AT^SCTM=0 (default): Presentation of URCs is enabled during the 2 minute guard period

after start-up of PLSx3. After expiry of the 2 minute guard period, the presentation of URCs

will be disabled, i.e. no URCs with alert levels "1" or ''-1" will be generated.

• URCs indicating the level "2" or "-2" are instantly followed by an orderly shutdown after 5

seconds unless the temperature returns to a valid operating level ("1", "0", "-1") or the shut-

down ability was disabled with AT^SCFG, "MEopMode/ShutdownOnCritTemp",<sdoct>.

The presentation of these URCs is always enabled, i.e. they will be output even though the

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factory setting AT^SCTM=0 was never changed.

Page 72 of 129

The maximum temperature ratings are stated in Section 3.6. Refer to Table 17 for the associ-

ated URCs.

Table 17: Temperature associated URCs

Sending temperature alert (2min after PLSx3 start-up, otherwise only if URC presentation enabled)

^SCTM_B: 1

Board close to overtemperature limit.

^SCTM_B: -1

Board close to undertemperature limit.

^SCTM_B: 0

Board back to non-critical temperature range.

Automatic shutdown (URC appears no matter whether or not presentation was enabled)

^SCTM_B: 2

Alert: Board equal or beyond overtemperature limit. PLSx3 switches off.

^SCTM_B: -2

Alert: Board equal or below undertemperature limit. PLSx3 switches off.

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3.2.5.2

Undervoltage Shutdown

Page 73 of 129

The undervoltage shutdown threshold is the specified minimum supply voltage VBATT+ given

in Table 3. When the average supply voltage measured by PLSx3 approaches the undervolt-

age shutdown threshold (i.e., 0.05V offset) the module will send the following URC:

^SBC: Undervoltage Shutdown

If the undervoltage persists the module will send the URC several times before switching off

automatically.

This type of URC does not need to be activated by the user. It will be output automatically when

fault conditions occur.

3.2.5.3

Overvoltage Shutdown

The overvoltage shutdown threshold is the specified maximum supply voltage VBATT+ given

in Table 3. When the supply voltage approaches the overvoltage shutdown threshold, the mod-

ule will send the following URC:

^SBC: Overvoltage Shutdown

The overvoltage warning is sent only once before the module is close to the overvoltage shut-

down threshold again.

This type of URC does not need to be activated by the user. It will be output automatically when

fault conditions occur.

Keep in mind that several PLSx3 components are directly linked to BATT+ and, therefore, the

supply voltage remains applied at major parts of PLSx3, even if the module is switched off. Es-

pecially the power amplifier is very sensitive to high voltage and might even be destroyed

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Page 74 of 129

3.2.5.4

Deferred Shutdown at Extreme Temperature Condition

In the following cases, automatic shutdown will be deferred if a critical temperature limit is ex-

ceeded:

• While an emergency call is in progress.

• During a two minute guard period after power-up. This guard period has been introduced in

order to allow for the user to make an emergency call. The start of any one of these calls

extends the guard period until the end of the call. Any other network activity may be terminated

by shutdown upon expiry of the guard time.

While in a "deferred shutdown" situation, PLSx3 continues to measure the temperature and to

deliver alert messages, but deactivates the shutdown functionality. Once the 2 minute guard

period is expired or the call is terminated, full temperature control will be resumed. If the tem-

perature is still out of range, PLSx3 switches off immediately (without another alert message).

Caution: Automatic shutdown is a safety feature intended to prevent damage to the module.

Extended usage of the deferred shutdown facilities provided may result in damage to the mod-

ule, and possibly other severe consequences.

3.3

Power Saving

PLSx3 is able to reduce its functionality to a minimum (during the so-called SLEEP mode and

SUSPEND mode) in order to minimize its current consumption. The following sections explain

the module’s network dependent power saving behavior. The power saving behavior is further

configurable by AT command:

• When all serial interfaces (i.e. ASC0, and ASC1) are idle, the module can enter SLEEP

mode by additional configuration settings (i.e. AT^SPOW=2.3000,255).

• AT^SCFG= "MEopMode/ExpectDTR": Power saving will take effect only if there is no trans-

mission data pending on any of the module’s USB ports. The expect DTR AT command

ensures that data becoming pending on any USB port before an external application has

signaled its readiness to receive the data is discarded. By default this behavior is enabled

for all available USB CDC ACM.

• Using the AT command AT^SCFG="Radio/OutputPowerReduction" it is possible for the

module in GPRS multislot scenarios to reduce its output power according to 3GPP 45.005

section.

3.3.1

Power Saving while Attached to GSM Networks

The power saving possibilities while attached to a GSM network depend on the paging timing

cycle of the base station. The duration of a power saving interval can be calculated using the

following formula:

t = 4.615 ms (TDMA frame duration) * 51 (number of frames) * DRX value.

DRX (Discontinuous Reception) is a value from 2 to 9, resulting in paging intervals between

0.47 and 2.12 seconds. The DRX value of the base station is assigned by the GSM network

operator.

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Page 75 of 129

Now, a paging timing cycle consists of the actual fixed length paging plus a variable length

pause before the next paging. In the pauses between listening to paging messages, the module

resumes power saving, as shown in Figure 28.

Figure 28: Power saving and paging in GSM networks

The varying pauses explain the different potential for power saving. The longer the pause the

less power is consumed.

Generally, power saving depends on the module’s application scenario and may differ from the

above mentioned normal operation. The power saving interval may be shorter than 0.47 sec-

onds or longer than 2.12 seconds.

3.3.2

Power Saving while Attached to WCDMA Networks

The power saving possibilities while attached to a WCDMA network depend on the paging tim-

ing cycle of the base station.

During normal WCDMA operation, i.e., the module is connected to a WCDMA network, the

duration of a power saving period varies. It may be calculated using the following formula:

t = 2DRX value * 10 ms (WCDMA frame duration).

DRX (Discontinuous Reception) in WCDMA networks is a value between 6 and 9, thus result-

ing in power saving intervals between 0.64 and 5.12 seconds. The DRX value of the base sta-

tion is assigned by the WCDMA network operator.

Now, a paging timing cycle consists of the actual fixed length paging plus a variable length

pause before the next paging. In the pauses between listening to paging messages, the module

resumes power saving, as shown in Figure 29.

Figure 29: Power saving and paging in WCDMA networks

The varying pauses explain the different potential for power saving. The longer the pause the

less power is consumed.

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Generally, power saving depends on the module’s application scenario and may differ from the

above mentioned normal operation. The power saving interval may be shorter than 0.64 sec-

onds or longer than 5.12 seconds.

3.3.3

Power Saving while Attached to LTE Networks

The power saving possibilities while attached to an LTE network depend on the paging timing

cycle of the base station.

During normal LTE operation, i.e., the module is connected to an LTE network, the duration of

a power saving period varies. It may be calculated using the following formula:

t = DRX Cycle Value * 10 ms

DRX cycle value in LTE networks is any of the four values: 32, 64, 128 and 256, thus resulting

in power saving intervals between 0.32 and 2.56 seconds. The DRX cycle value of the base

station is assigned by the LTE network operator.

Now, a paging timing cycle consists of the actual fixed length paging plus a variable length

pause before the next paging.In the pauses between listening to paging messages, the module

resumes power saving, as shown in Figure 30.

Figure 30: Power saving and paging in LTE networks

The varying pauses explain the different potential for power saving. The longer the pause the

less power is consumed.

Generally, power saving depends on the module’s application scenario and may differ from the

above mentioned normal operation. The power saving interval may be shorter than 0.32 sec-

onds or longer than 2.56 seconds.

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3.3.4 Wake-up via RTS0

RTS0 can be used to wake up PLSx3 from SLEEP mode configured with AT^SPOW. Assertion

of RTS0 (i.e., toggle from inactive high to active low) serves as wake up event, thus allowing

an external application to almost immediately terminate power saving. After RTS0 assertion,

the CTS0 line signals module wake up, i.e., readiness of the AT command interface. It is there-

fore recommended to enable RTS/CTS flow control (default setting).

Figure 31 shows the described RTS0 wake up mechanism.

R T S 0

C T S 0

T X D 0

R X D 0

R T S a s s e r t io n ( f a llin g e d g e )

R T S b a c k

W a k e u p f r o m S L E E P m o d e

R e t u r n t o S L E E P m o d e

A T c o m m a n d

R e p ly

U R C

Figure 31: Wake-up via RTS0

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3.4

Power Supply

PLSx3 needs to be connected to a power supply at the SMT application interface - 4 lines

BATT+, and GND. There are two separate voltage domains for BATT+:

• BATT+BB with two lines for the general power management.

• BATT+RF with two lines for the RF.

Please note that throughout the document BATT+ refers to both voltage domains and power

supply lines - BATT+BB and BATT+RF.

The main power supply from an external application has to be a single voltage source and has

to be expanded to sub paths (star structure). BATT+RF must be decoupled by application with

low ESR capacitors(≥ 2x100μF MLCC X5R@BATT+RF ) as close as possible to LGA pads. Fig-

ure 32 shows a sample circuit for decoupling capacitors for BATT+.

Module

SMT interface

BATT+BB

BATT+RF

2

2

Decoupling capacitors

e.g. 100μF MLCC X5R

2x

Figure 32: Decoupling capacitor(s) for BATT+

BATT+

GND

The power supply of PLSx3 must be able to provide the peak current during the uplink trans-

mission.

All the key functions for supplying power to the device are handled by the power management

section of the analog controller. This IC provides the following features:

• Stabilizes the supply voltages for the baseband using low drop linear voltage regulators and

DC-DC step down switching regulators.

• Switches the module's power voltages for the power-up and -down procedures.

• SIM switch to provide SIM power supply.

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3.4.1

Power Supply Ratings

Page 79 of 129

The tables in this section assemble various voltage supply and current consumption ratings of

the module.

Table 18: Supply Ratings

Description

Conditions

BATT+

Supply voltage

Min

Typ Max Unit

3.0

3.8

4.5

V

Normal Range

(Directly measured at Module. Volt-

age must stay within the min/max

values, including voltage drop, ripple,

spikes.)

The module shall work with supply

voltages between 3.0 and 4.5V as

normal voltage range.

Normal condition, power control level

for Pout max

Normal condition, power control level

for Pout max

@ f < 250 kHz

@ f > 250 kHz

Maximum allowed

voltage drop

during transmit

burst

Voltage ripple

400 mV

120

90

mVpp

mVpp

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Typical rating

(W,EP,LA,J, I)

Unit

Table 19: Current Consumption Ratings -GSM1

Description

Conditions

2

IBATT+

(i.e., sum of

BATT+BB and

BATT+RF)

GSM SLEEP

State

supply current

USB disconnected

USB suspended

USB disconnected

USB suspended

USB disconnected

USB suspended

SLEEP3 @ DRX=9

(no communication via

UART)

SLEEP3 @ DRX=5

(no communication via

UART)

SLEEP3 @ DRX=2

(no communication via

UART)

IDLE @ DRX=2

(UART active, but no

communication)

GSM IDLE4 State

supply current

USB disconnected

USB active

12.083

27.706

Average

GSM850

supply current5

GPRS Data transfer

GSM850;

PCL=5; 1Tx/4Rx

2.365

2.690

2.534

2.839

2.992

3.296

1049

315

315

455

566

631

203

206

303

349

486

615

mA

mA

mA

mA

mA

mA

mA

mA

mA

mA

mA

mA

mA

mA

mA

mA

mA

mA

mA

mA

ROPR=8

(max. reduction)

ROPR=4

(no reduction)

ROPR=8

(max. reduction)

ROPR=4

(no reduction)

ROPR=8

(max. reduction)

ROPR=4

(no reduction)

ROPR=8

(max. reduction)

ROPR=4

(no reduction)

ROPR=8

(max. reduction)

ROPR=4

(no reduction)

ROPR=8

(max. reduction)

ROPR=4

(no reduction)

GPRS Data transfer

GSM850;

PCL=5; 2Tx/3Rx

GPRS Data transfer

GSM850;

PCL=5; 4Tx/1Rx

EDGE Data transfer

GSM850;

PCL=5; 1Tx/4Rx

EDGE Data transfer

GSM850;

PCL=5; 2Tx/3Rx

EDGE Data transfer

GSM850;

PCL=5; 4Tx/1Rx

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Table 19: Current Consumption Ratings -GSM1

Description

Conditions

2

IBATT+

(i.e., sum of

BATT+BB and

BATT+RF)

Average

GSM900

supply current5

GPRS Data transfer

GSM900;

PCL=5; 1Tx/4Rx

Typical rating

(W,EP,LA,J, I)

Unit

1009

307

307

446

554

638

198

201

301

340

487

607

mA

mA

mA

mA

mA

mA

mA

mA

mA

mA

mA

mA

ROPR=8

(max. reduction)

ROPR=4

(no reduction)

ROPR=8

(max. reduction)

ROPR=4

(no reduction)

ROPR=8

(max. reduction)

ROPR=4

(no reduction)

ROPR=8

(max. reduction)

ROPR=4

(no reduction)

ROPR=8

(max. reduction)

ROPR=4

(no reduction)

ROPR=8

(max. reduction)

ROPR=4

(no reduction)

GPRS Data transfer

GSM900;

PCL=5; 2Tx/3Rx

GPRS Data transfer

GSM900;

PCL=5; 4Tx/1Rx

EDGE Data transfer

GSM900;

PCL=5; 1Tx/4Rx

EDGE Data transfer

GSM900;

PCL=5; 2Tx/3Rx

EDGE Data transfer

GSM900;

PCL=5; 4Tx/1Rx

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Table 19: Current Consumption Ratings -GSM1

Description

Conditions

2

IBATT+

(i.e., sum of

BATT+BB and

BATT+RF)

Average

GSM1800

supply current5

GPRS Data transfer

GSM1800; PCL=0;

1Tx/4Rx

Typical rating

(W,EP,LA,J, I)

Unit

209

209

295

359

433

640

163

163

250

269

420

471

mA

mA

mA

mA

mA

mA

mA

mA

mA

mA

mA

mA

ROPR=8

(max. reduction)

ROPR=4

(no reduction)

ROPR=8

(max. reduction)

ROPR=4

(no reduction)

ROPR=8

(max. reduction)

ROPR=4

(no reduction)

ROPR=8

(max. reduction)

ROPR=4

(no reduction)

ROPR=8

(max. reduction)

ROPR=4

(no reduction)

ROPR=8

(max. reduction)

ROPR=4

(no reduction)

GPRS Data transfer

GSM1800; PCL=0;

2Tx/3Rx

GPRS Data transfer

GSM1800; PCL=0;

4Tx/1Rx

EDGE Data transfer

GSM1800; PCL=0;

1Tx/4Rx

EDGE Data transfer

GSM1800; PCL=0;

2Tx/3Rx

EDGE Data transfer

GSM1800; PCL=0;

4Tx/1Rx

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Table 19: Current Consumption Ratings -GSM1

Description

Conditions

2

IBATT+

(i.e., sum of

BATT+BB and

BATT+RF)

Average

GSM1900

supply current5

GPRS Data transfer

GSM1900; PCL=0;

1Tx/4Rx

ROPR=8

(max. reduction)

ROPR=4

(no reduction)

ROPR=8

(max. reduction)

ROPR=4

(no reduction)

ROPR=8

(max. reduction)

ROPR=4

(no reduction)

ROPR=8

(max. reduction)

ROPR=4

(no reduction)

ROPR=8

(max. reduction)

ROPR=4

(no reduction)

ROPR=8

(max. reduction)

ROPR=4

(no reduction)

GPRS Data transfer

GSM1900; PCL=0;

2Tx/3Rx

GPRS Data transfer

GSM1900; PCL=0;

4Tx/1Rx

EDGE Data transfer

GSM1900; PCL=0;

1Tx/4Rx

EDGE Data transfer

GSM1900; PCL=0;

2Tx/3Rx

EDGE Data transfer

GSM1900; PCL=0;

4Tx/1Rx

GPRS Data transfer GSM850; PCL=5; 1Tx/

1Rx @ 50Ω

GPRS Data transfer GSM900; PCL=5; 1Tx/

1Rx @ 50Ω

GPRS Data transfer DCS1800; PCL=0; 1Tx/

1Rx @ 50Ω

GPRS Data transfer PCS1900; PCL=0; 1Tx/

1Rx @ 50Ω

GPRS Data transfer GMS850; PCL=5; 1Tx/

1Rx @ total mismatch

GPRS Data transfer GMS900; PCL=5; 1Tx/

1Rx @ total mismatch

GPRS Data transfer DCS1800; PCL=0; 1Tx/

1Rx @ total mismatch

GPRS Data transfer DCS1900; PCL=0; 1Tx/

1Rx @ total mismatch

Typical rating

(W,EP,LA,J, I)

Unit

210

208

295

358

433

643

162

163

249

272

417

476

2.3

2.2

1.4

1.4

2.7

2.8

1.7

1.8

mA

mA

mA

mA

mA

mA

mA

mA

mA

mA

mA

mA

A

A

A

A

A

A

A

A

Peak current

during GSM

transmit burst5

1. Note: Current consumption ratings are based on measurements done in a laboratory test environment,

and deviations may occur from the given typical ratings. Under real life conditions however, with e.g., vary-

ing network quality, location changes, or changing supply currents, the deviations from these typical rat-

ings may be even bigger, and will have to be taken into account for actual power supply solutions. For

more details on power supply design see [3].

2. With an impedance of ZLOAD=50Ω at the antenna pad. Measured at 25°C and 3.8V.

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3. Measurements start 6 minutes after switching ON the module,

averaging times: SLEEP mode – 3 minutes, transfer modes – 1.5 minutes

Communication tester settings:no neighbor cells, no cell reselection etc.,

RMC (Reference Measurement Channel)

SLEEP mode is enabled via AT command AT^SPOW=2, 1000, 3

4. The power save mode is disabled via AT command AT^SPOW=1,0,0

5. The communication tester settings of Channel: Mid Channel

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Table 20: Current Consumption Ratings - UMTS1

Description

Conditions

UMTS SLEEP State

supply current

SLEEP3 @ DRX=9

(no communication

via UART)

2

IBATT+

(i.e., sum of

BATT+BB

and

BATT+RF)

SLEEP3 @ DRX=8

(no communication

via UART)

SLEEP3 @ DRX=6

(no communication

via UART)

UMTS IDLE4 State

supply current

IDLE @ DRX=6

(UART active, but no

communication)

UMTS average

supply current 5

UMTS Data transfer Band I

UMTS Data transfer Band II

UMTS Data transfer Band III

UMTS Data transfer Band IV

UMTS Data transfer Band V

UMTS Data transfer Band VI

UMTS Data transfer Band VIII

UMTS Data transfer Band XIX

USB

disconnected

USB

suspended

USB

disconnected

USB

suspended

USB

disconnected

USB

suspended

USB

disconnected

USB active

Typical

rating

(W,EP,L

A,J,I)

Typical

rating

(X, X2,

X3, X4)

Unit

2.336

2.698

2.431

2.778

2.864

3.196

11.785

26.138

606

713

542

560

550

502

570

516

516

534

507

mA

mA

mA

mA

mA

mA

mA

mA

mA

mA

mA

mA

mA

mA

mA

mA

1. Note: Current consumption ratings are based on measurements done in a laboratory test environment,

and deviations may occur from the given typical ratings. Under real life conditions however, with e.g.,

varying network quality, location changes, or changing supply currents, the deviations from these typical

ratings may be even bigger, and will have to be taken into account for actual power supply solutions. For

more details on power supply design see [3].

2. With an impedance of ZLOAD=50Ω at the antenna pad. Measured at 25°C and 3.8V.

3. Measurements start 6 minutes after switching ON the module,

averaging times: SLEEP mode – 3 minutes, transfer modes – 1.5 minutes

Communication tester settings:no neighbor cells, no cell reselection etc.,

RMC (Reference Measurement Channel)

SLEEP mode is enabled via AT command AT^SPOW=2, 1000, 3

4. The power save mode is disabled via AT command AT^SPOW=1,0,0

5. The communication tester settings of Channel: Mid Channel

The value is based on the latest test result and may have update in the future releases.

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Table 21: Current Consumption Ratings - LTE1

Description

Conditions

LTE SLEEP

State supply

current

2

IBATT+

(i.e.,

sum of

BATT+

BB and

BATT+

RF)

SLEEP3 @ “Paging Cycles =

256”

(no communication via UART)

SLEEP3 @ “Paging Cycles =

128”

(no communication via UART)

SLEEP3 @ “Paging Cycles =

64”

(no communication via UART)

SLEEP3 @ “Paging Cycles =

32”

(no communication via UART)

USB disconnected

USB suspended

USB disconnected

USB suspended

USB disconnected

USB suspended

USB disconnected

USB suspended

LTE IDLE4

State supply

current

LTE average

supply cur-

rent5

Unit

Typical

rating

(W,EP,

LA,J,I)

Typical

rating

(X,X2,X

3,X4)

2.496

2.793

2.740

3.098

3.291

3.623

4.399

4.717

12.991

28.465

604

622

557

570

564

758

658

669

641

640

520

561

634

636

630

397

405

399

650

596

674

535

565

579

520

600

529

675

594

mA

mA

mA

mA

mA

mA

mA

mA

mA

mA

mA

mA

mA

mA

mA

mA

mA

mA

mA

mA

mA

mA

mA

mA

mA

mA

mA

mA

mA

mA

mA

mA

IDLE (USB disconnected)

IDLE (USB active)

LTE Data transfer Band 1

LTE Data transfer Band 2

LTE Data transfer Band 3

LTE Data transfer Band 4

LTE Data transfer Band 5

LTE Data transfer Band 7(-W)

LTE Data transfer Band 8

LTE Data transfer Band 12

LTE Data transfer Band 13

LTE Data transfer Band 14

LTE Data transfer Band 17

LTE Data transfer Band 18

LTE Data transfer Band 19

LTE Data transfer Band 20

LTE Data transfer Band 25

LTE Data transfer Band 26

LTE Data transfer Band 28

LTE Data transfer Band 38

LTE Data transfer Band 40

LTE Data transfer Band 41

LTE Data transfer Band 66

LTE Data transfer Band 71

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1. Note: Current consumption ratings are based on measurements done in a laboratory test environment, and

deviations may occur from the given typical ratings. Under real life conditions however, with e.g., varying net-

work quality, location changes, or changing supply currents, the deviations from these typical ratings may be

even bigger, and will have to be taken into account for actual power supply solutions. For more details on

power supply design see [3].

2. With an impedance of ZLOAD=50Ω at the antenna pad. Measured at 25°C and 3.8V.

3. Measurements start 6 minutes after switching ON the module,

averaging times: SLEEP mode – 3 minutes, transfer modes – 1.5 minutes

Communication tester settings:no neighbor cells, no cell reselection etc.,

RMC (Reference Measurement Channel)

SLEEP mode is enabled via AT command AT^SPOW=2, 1000, 3

4. The power save mode is disabled via AT command AT^SPOW=1,0,0

5. Communication tester setting:

Channel: Mid Channel

Channel Bandwidth: 5MHz

Number of Resource Blocks: 25 (DL), 1 (UL), RB position: Low

Modulation: QPSK

3.4.2

Minimizing Power Losses

If the module supports GSM, when designing the power supply for your application, please pay

specific attention to power losses. Ensure that the input voltage VBATT+, never drops below 3.0V

on the PLSx3 board, not even in a transmit burst where current consumption can rise to typical

peaks. Any voltage drops that may occur in a transmit burst should not exceed 400mV to en-

sure the expected RF performance in 2G networks.

For example,

VImin=3.0V, Dmax=0.4V

VBATTmin= VImin+Dmax=3.4V

Figure 33: Power supply limits during transmit burst

3.4.3

Monitoring Power Supply by AT Command

To monitor the supply voltage, you can use the AT^SBV command which returns the current

value of the supply voltage using AT interface.

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3.5

Operating Temperatures

Page 88 of 129

Table 22: Board Temperature

Parameter

Operating temperature range

Restricted temperature range1

Automatic shutdown2

Typ

Min

-30

-40

<-40

Max

+85

+95

+95

Unit

°C

°C

°C

Temperature measured on PLSx3 board

1. Restricted operation allows normal mode data transmissions for limited time until automatic thermal

shutdown takes effect. Within the restricted temperature range (outside the operating temperature

range) the specified electrical characteristics may be in- or decreased.

2. Due to temperature measurement uncertainty, a tolerance on the stated shutdown thresholds may oc-

cur. The possible deviation is in the range of TBD °C at the over temperature limit.

Note: Within the specified operating temperature ranges the board temperature may vary to a

great extent depending on operating mode, used frequency band, radio output power and

current supply voltage.

3.6

Electrostatic Discharge

The module is not protected against Electrostatic Discharge (ESD) in general. Consequently,

it is subject to ESD handling precautions that typically apply to ESD sensitive components.

Proper ESD handling and packaging procedures must be applied throughout the processing,

handling and operation of any application that incorporates a PLSx3 module.

An example for an enhanced ESD protection for the SIM interface is given in Section 2.1.6.1.

PLSx3 has been tested according to the following standards. Electrostatic values can be gath-

ered from the following table.

Table 23: Electrostatic values

Specification/Requirement

Contact discharge

Air discharge

ANSI/ESDA/JEDEC JS-001-2017 (Human Body Model)

All LGA pads

±1.0kV (HBM)

JS-002-2018 (Charged Device Model)

All LGA pads

±250V (CDM)

ETSI EN 301 489-1/7

BATT+

Antenna pads

TBD

TBD

n.a.

n.a.

TBD

±8kV

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3.7

Reliability Characteristics

Page 89 of 129

The test conditions stated below are an extract of the complete test specifications.

Table 24: Summary of reliability test conditions

Type of test

Conditions

Vibration

Frequency range: 10-20Hz; acceleration: 5g

Frequency range: 20-500Hz; acceleration: 20g

Duration: 20h per axis; 3 axes

Standard

DIN IEC 60068-2-61

Shock half-sinus

DIN IEC 60068-2-27

Acceleration: 500g

Shock duration: 1ms

1 shock per axis

6 positions (± x, y and z)

Dry heat

Temperature

change (shock)

Damp heat cyclic

Temperature: +70 ±2°C

Test duration: 16h

Humidity in the test chamber: < 50%

Low temperature: -40°C ±2°C

High temperature: +85°C ±2°C

Changeover time: < 30s (dual chamber system)

Test duration: 1h

Number of repetitions: 100

High temperature: +55°C ±2°C

Low temperature: +25°C ±2°C

Humidity: 93% ±3%

Number of repetitions: 6

Test duration: 12h + 12h

Cold (constant

exposure)

Temperature: -40 ±2°C

Test duration: 16h

EN 60068-2-2 Bb

ETS 300 019-2-7

DIN IEC 60068-2-14 Na

ETS 300 019-2-7

DIN IEC 60068-2-30 Db

ETS 300 019-2-5

DIN IEC 60068-2-1

1. For reliability tests in the frequency range 20-500Hz the Standard’s acceleration reference value was

increased to 20g.

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Page 90 of 129

4

Mechanical Dimensions, Mounting and Packaging

4.1

Mechanical Dimensions of PLSx3

Figure 34 shows the top and bottom view of PLSx3 and provides an overview of the board's

mechanical dimensions. For further details see Figure 35.

Top view

Bottom View

Figure 34: PLSx3– top and bottom view

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Top view

Figure 35: Dimensions of PLSx3 (all dimensions in mm)

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Figure 36: Dimensions of PLSx3 (keepout area recommended)

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4.2

Mounting PLSx3 onto the Application Platform

This section describes how to mount PLSx3 onto the PCBs, including land pattern and stencil

design, board-level characterization, soldering conditions, durability and mechanical handling.

Note: To avoid short circuits between signal tracks on an external application's PCB and vari-

ous markings at the bottom side of the module, it is recommended not to route the signal tracks

on the top layer of an external PCB directly under the module, or at least to ensure that signal

track routes are sufficiently covered with solder resist.

4.2.1

SMT PCB Assembly

4.2.1.1

Land Pattern and Stencil

The land pattern and stencil design as shown below is based on Thales characterizations for

lead-free solder paste on a four-layer test PCB and a 110 respectively 150 micron thick stencil.

The land pattern given in Figure 37 reflects the module‘s pad layout, including signal pads and

ground pads (for pad assignment see Section 2.1.1).

Figure 37: Land pattern (top view)

The stencil designs illustrated in Figure 38 and Figure 39 are recommended by Thales as a re-

sult of extensive tests with Thales Daisy Chain modules.

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Figure 38: Recommended design for 110 micron thick stencil (top view)

Figure 39: Recommended design for 150 micron thick stencil (top view)

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4.2.1.2

Board Level Characterization

Page 95 of 129

Board level characterization issues should also be taken into account if devising an SMT pro-

cess.

Characterization tests should attempt to optimize the SMT process with regard to board level

reliability. This can be done by performing the following physical tests on sample boards: Peel

test, bend test, tensile pull test, drop shock test and temperature cycling.

It is recommended to characterize land patterns before an actual PCB production, taking indi-

vidual processes, materials, equipment, stencil design, and reflow profile into account. For land

and stencil pattern design recommendations see also Section 4.2.1.1. Optimizing the solder

stencil pattern design and print process is necessary to ensure print uniformity, to decrease sol-

der voids, and to increase board level reliability.

Generally, solder paste manufacturer recommendations for screen printing process parame-

ters and reflow profile conditions should be followed. Maximum ratings are described in Section

4.2.3.

4.2.2

Moisture Sensitivity Level

PLSx3 comprises components that are susceptible to damage induced by absorbed moisture.

Thales’s PLSx3 module complies with the latest revision of the IPC/JEDEC J-STD-020 Stan-

dard for moisture sensitive surface mount devices and is classified as MSL 4.

For additional moisture sensitivity level (MSL) related information see Section 4.2.4 and Sec-

tion 4.3.2.

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4.2.3

Soldering Conditions and Temperature

4.2.3.1

Reflow Profile

tP

tL

TP

TL

e

r

u

t

a

r

e

p

m

e

T

TSmax

TSmin

tS

Preheat

t to maximum

Time

Table 25: Reflow temperature ratings1

Figure 40: Reflow Profile

Profile Feature

Pb-Free Assembly

Preheat & Soak

Temperature Minimum (TSmin)

Temperature Maximum (TSmax)

Time (tSmin to tSmax) (tS)

Average ramp up rate (TL to TP)

Liquidous temperature (TL)

Time at liquidous (tL)

150°C

200°C

60-120 seconds

3K/second max.2

217°C

50-90 seconds

245°C ±5°C

30 seconds max.

Peak package body temperature (TP)

Time (tP) within 5 °C of the peak package body tem-

perature (TP)

Average ramp-down rate

- Limited ramp-down rate between 225°C and 200°C

6K/second max.2

3K/second max.2

Time 25°C to maximum temperature

8 minutes max.

1. Please note that the reflow profile features and ratings listed above are based on the joint industry stan-

dard IPC/JEDEC J-STD-020D.1, and are as such meant as a general guideline.

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2. Temperatures measured on shielding at each corner. See also [3].

Page 97 of 129

Module

1

3

2

4

Temperature sensors (1-4)

4.2.3.2

Maximum Temperature and Duration

The following limits are recommended for the SMT board-level soldering process to attach the

module:

• A maximum module temperature of 245°C. This specifies the temperature as measured at

the module’s top side.

• A maximum duration of 30 seconds at this temperature.

• Ramp-down rate from TP to 200°C should be controlled in order to reduce thermally induced

stress during the solder solidification phase (see Table 25 - limited ramp-down rate). There-

fore, a cool-down step in the oven’s temperature program between 200°C and 180°C

should be considered.

Please note that while the solder paste manufacturers' recommendations for best temperature

and duration for solder reflow should generally be followed, the limits listed above must not be

exceeded.

PLSx3 is specified for one soldering cycle only. Once PLSx3 is removed from the application,

the module will very likely be destroyed and cannot be soldered onto another application.

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4.2.4

Durability and Mechanical Handling

4.2.4.1

Storage Conditions

Page 98 of 129

PLSx3 modules, as delivered in tape and reel carriers, must be stored in sealed, moisture barrier

anti-static bags. The conditions stated below are only valid for modules in their original packed

state in weather protected, non-temperature-controlled storage locations. Normal storage time

under these conditions is 12 months maximum.

Table 26: Storage conditions

Type

Condition

Unit

Reference

Air temperature: Low

High

Humidity relative: Low

High

Air pressure: Low

High

10

90 at 40°C

-25

+40

70

106

1.0

IPC/JEDEC J-STD-033A

IPC/JEDEC J-STD-033A

IEC TR 60271-3-1: 1K4

IEC TR 60271-3-1: 1K4

IEC TR 60271-3-1: 1K4

°C

%

kPa

m/s

---

Movement of surrounding air

Water: rain, dripping, icing and

frosting

Not allowed

---

Radiation:

Solar

Heat

1120

600

W/m2 ETS 300 019-2-1: T1.2, IEC 60068-2-2 Bb

ETS 300 019-2-1: T1.2, IEC 60068-2-2 Bb

Chemically active substances

IEC TR 60271-3-1: 1C1L

Mechanically active substances Not

IEC TR 60271-3-1: 1S1

Not

recommended

recommended

1.5

5

2-9 9-200

mm

m/s2

Hz

semi-sinusoidal

1

50

ms

m/s2

IEC TR 60271-3-1: 1M2

IEC 60068-2-27 Ea

Vibration sinusoidal:

Displacement

Acceleration

Frequency range

Shocks:

Shock spectrum

Duration

Acceleration

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4.2.4.2

Processing Life

PLSx3 must be soldered to an application within 72 hours after opening the moisture barrier

bag (MBB) it was stored in.

As specified in the IPC/JEDEC J-STD-033 Standard, the manufacturing site processing the

modules should have ambient temperatures below 30°C and a relative humidity below 60%.

4.2.4.3

Baking

Baking conditions are specified on the moisture sensitivity label attached to each MBB (see

Figure 46 for details):

•

It is not necessary to bake PLSx3, if the conditions specified in Section 4.2.4.1 and Section

4.2.4.2 were not exceeded.

It is necessary to bake PLSx3, if any condition specified in Section 4.2.4.1 and Section

4.2.4.2 was exceeded.

•

If baking is necessary, the modules must be put into trays that can be baked to at least 125°C.

Devices should not be baked in tape and reel carriers at any temperature.

4.2.4.4

Electrostatic Discharge

Electrostatic discharge (ESD) may lead to irreversable damage for the module. It is therefore

advisable to develop measures and methods to counter ESD and to use these to control the

electrostatic environment at manufacturing sites.

Please refer to Section 3.6 for further information on electrostatic discharge.

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4.3

Packaging

4.3.1

Tape and Reel

4.3.1.1

Orientation

The single-feed tape carrier for PLSx3 is illustrated in Figure 41. The figure also shows the

proper part orientation. The tape width is 44mm and the PLSx3 modules are placed on the tape

with a 40mm pitch. The reels are 330mm in diameter with 100mm hubs. Each reel contains 400

modules.

Figure 41: Carrier tape

Figure 42: Reel direction

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4.3.1.2

Barcode Label

A barcode label provides detailed information on the tape and its contents. It is attached to the

reel.

Barcode label

Figure 43: Barcode label on tape reel

Figure 44: Barcode label on tape reel - layout

Variables on the label are explained in Table 27.

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4.3.2

Shipping Materials

PLSx3 is distributed in tape and reel carriers. The tape and reel carriers used to distribute

PLSx3 are packed as described below, including the following required shipping materials:

• Moisture barrier bag, including desiccant and humidity indicator card

• Transportation box

4.3.2.1

Moisture Barrier Bag

The tape reels are stored inside a moisture barrier bag (MBB), together with a humidity indica-

tor card and desiccant pouches - see Figure 45. The bag is ESD protected and delimits mois-

ture transmission. It is vacuum-sealed and should be handled carefully to avoid puncturing or

tearing. The bag protects the PLSx3 modules from moisture exposure. It should not be opened

until the devices are ready to be soldered onto the application.

Figure 45: Moisture barrier bag (MBB) with imprint

The label shown in Figure 46 summarizes requirements regarding moisture sensitivity, includ-

ing shelf life and baking requirements. It is attached to the outside of the moisture barrier bag.

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Figure 46: Moisture Sensitivity Label

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MBBs contain one or more desiccant pouches to absorb moisture that may be in the bag. The

humidity indicator card described below should be used to determine whether the enclosed

components have absorbed an excessive amount of moisture.

The desiccant pouches should not be baked or reused once removed from the MBB.

The humidity indicator card is a moisture indicator and is included in the MBB to show the ap-

proximate relative humidity level within the bag. Sample humidity cards are shown in Figure 47.

If the components have been exposed to moisture above the recommended limits, the units will

have to be rebaked.

Figure 47: Humidity Indicator Card - HIC

A baking is required if the humidity indicator inside the bag indicates 10% RH or more.

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4.3.2.2

Transportation Box

Tape and reel carriers are distributed in a box, marked with a barcode label for identification

purposes. A box contains two reels with 400 (TBD for -X variant) modules each.

1

2

4

5

6

7

12

13

1

2

3

4

5

6

7

8

9

10

11

12

13

14

3

8

9

10

11

14

Figure 48: Sample of VP box label

Table 27: VP Box label information

No.

Information

Cinterion logo

Product name

Product ordering number

Package ID number of VP box (format may vary depending on the product)

Package ID barcode (Code 128)

Package ID Reel 1 (format may vary depending on the product)

Package ID Reel 2 (format may vary depending on the product)

Quantity of the modules inside the VP box (max. 1000 pcs)

Country of production

Der Grüne Punkt (Green Dot) symbol

Chinese RoHS symbol (see Table 31)

CE logo (CE mark on VP box label is present only for modules with CE imprinted on the

shielding)

European Article Number (EAN-13) barcode

European Article Number, consists of 13 digits (EAN-13)

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5

Regulatory and Type Approval Information

5.1

Directives and Standards

PLSx3 is designed to comply with the directives and standards listed below.

It is the responsibility of the application manufacturer to ensure compliance of the final product

with all provisions of the applicable directives and standards as well as with the technical spec-

ifications provided in the "PLSx3 Hardware Interface Description”.1

Table 28: Directives

2014/53/EU

Directive of the European Parliament and of the council of 16 April 2014 on

the harmonization of the laws of the Member States relating to the making

available on the market of radio equipment and repealing Directive 1999/

05/EC.

2002/95/EC (RoHS 1)

2011/65/EC (RoHS 2)

The product is labeled with the CE conformity mark.

Directive of the European Parliament and of the Council of

27 January 2003 (and revised on 8 June 2011) on the

restriction of the use of certain hazardous substances in

electrical and electronic equipment (RoHS)

1907/2006/EC (REACH) Regulation (EC) No 1907/2006 of the European Parliament and of the

Council of 18 December 2006 concerning the Registration, Evaluation,

Authorization and Restriction of Chemicals (REACH), establishing a Euro-

pean Chemicals Agency, amending Directive 1999/45/EC and repealing

Council Regulation (EEC) No 793/93 and Commission Regulation (EC) No

1488/94 as well as Council Directive 76/769/EEC and Commission Direc-

tive 91/155/EEC, 93/67/EC and 2000/21/EC.

Cinterion® module comply with the REACH regulation that specifies a con-

tent of less than 0.1% per substance mentioned in the SVHC candidate list

(Release 16.06.2014)

Table 29: Standards of North American type approval

CFR Title 47

OET Bulletin 65

(Edition 97-01)

UL 62368-1

Code of Federal Regulations, Part 22, Part 24; US Equipment Authorization

FCC

Evaluating Compliance with FCC Guidelines for Human Exposure to Radio

frequency Electromagnetic Fields

Audio/video, information and communication technology

equipment - Part1: Safety requirements (for details see

Section 5.1.1)

NAPRD.03 V6.01

Overview of PCS Type certification review board Mobile Equipment Type

Certification and IMEI control

PCS Type Certification Review board (PTCRB)

RSS132 (Issue2)

RSS133 (Issue5)

Canadian Standard

1. Manufacturers of applications which can be used in the US shall ensure that their applications have a

PTCRB approval. For this purpose they can refer to the PTCRB approval of the respective module.

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Table 30: Standards of European type approval

3GPP TS 51.010-1

Digital cellular telecommunications system (Release 7); Mobile Station

(MS) conformance specification;

GCF-CC V3.79

Global Certification Forum - Certification Criteria

ETSI EN 301 511

V12.5.1

Global System for Mobile communications (GSM); Mobile Stations (MS)

equipment; Harmonized Standard covering the essential requirements of

article 3.2 of Directive 2014/53/EU

ETSI EN 301 908-01

V13.1.1

IMT cellular networks; Harmonized Standard covering the essential require-

ments of article 3.2 of the Directive 2014/53/EU; Part 1: Introduction and

common requirements

ETSI EN 301 908-02

V11.1.2

IMT cellular networks; Harmonized Standard covering the essential require-

ments of article 3.2 of the Directive 2014/53/EU; Part 2: CDMA Direct

Spread (UTRA FDD) User Equipment (UE)

ETSI EN 301 489-52

V1.1.0

Electromagnetic Compatibility (EMC) standard for radio equipment and ser-

vices; Part 52: Specific conditions for Cellular Communication Mobile and

portable (UE) radio and ancillary equipment; Harmonized Standard cover-

ing the essential requirements of article 3.1(b) of Directive 2014/53/EU

ETSI EN 301 908-13

V13.1.1

IMT cellular networks; Harmonized Standard covering the essential require-

ments of article 3.2 of the Directive 2014/53/EU; Part 13: evolved Universal

Terrestrial Radio Access (E-UTRA) User Equipment (UE).

Draft ETSI EN 301 489-

01 V2.2.3

ETSI EN 301489-19

V2.1.0

ETSI EN 303 413

V1.1.1

IEC 62368-1

(EN 62368-1, UL 62368-

1)

Electromagnetic Compatibility (EMC) standard for radio equipment and ser-

vices; Part 1: Common technical requirements; Harmonized Standard cov-

ering the essential requirements of article 3.1(b) of Directive 2014/53/EU

and the essential requirements of article 6 of Directive 2014/30/EU

ElectroMagnetic Compatibility (EMC) standard for radio equipment and ser-

vices; Part 19: Specific conditions for Receive Only Mobile Earth Stations

(ROMES) operating in the 1,5 GHz band providing data communications

and GNSS receivers operating in the RNSS band (ROGNSS) providing

positioning, navigation, and timing data; Harmonised Standard covering the

essential requirements of article 3.1(b) of Directive 2014/53/EU

Satellite Earth Stations and Systems (SES); Global Navigation Satellite

System (GNSS) receivers; Radio equipment operating in the 1 164 MHz to

1 300 MHz and 1 559 MHz to 1 610 MHz frequency bands; Harmonised

Standard covering the essential requirements of article 3.2 of Directive

2014/53/EU

Audio/video, information and communication technology equipment - Part

1: Safety requirements (for details see Section 5.1.1)

Table 31: Requirements of quality

IEC 60068

Environmental testing

DIN EN 60529

IP codes

EN 62311:2008

Assessment of electronic and electrical equipment related to human expo-

sure restrictions for electromagnetic fields (0 Hz - 300 GHz)

Table 32: Standards of the Ministry of Information Industry of the People’s Republic of China

SJ/T 11363-2006

“Requirements for Concentration Limits for Certain Hazardous Sub-

stances in Electronic Information Products” (2006-06).

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Table 32: Standards of the Ministry of Information Industry of the People’s Republic of China

SJ/T 11364-2006

“Marking for Control of Pollution Caused by Electronic

Information Products” (2006-06).

According to the “Chinese Administration on the Control

of Pollution caused by Electronic Information Products”

(ACPEIP) the EPUP, i.e., Environmental Protection Use

Period, of this product is 20 years as per the symbol

shown here, unless otherwise marked. The EPUP is valid only as long as

the product is operated within the operating limits described in the Thales

Hardware Interface Description.

Please see Table 33 for an overview of toxic or hazardous substances or

elements that might be contained in product parts in concentrations

above the limits defined by SJ/T 11363-2006.

Table 33: Toxic or hazardous substances or elements with defined concentration limits

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5.1.1

IEC 62368-1 Classification

Page 109 of 129

With respect to the safety requirements for audio/video, information and communication tech-

nology equipment defined by the hazard based product safety standard for ICT and AV equip-

ment - i.e., IEC-62368-1 (EN 62368-1, UL 62368-1) - Cinterion® modules are classified as

shown below:

Standalone operation of the modules is not possible. Modules will always be incorporated in an

external application (Customer Product).

Customer understands and is responsible that the product incorporating the Cinterion® module

must be designed to be compliant with IEC-62368-1 (EN 62368-1, UL 62368-1) to ensure pro-

tection against hazards and injuries. When operating the Cinterion® module the external appli-

cation (Customer Product) must provide safeguards not to exceed the power limits given by

classification to Power Source Class 1 (15 Watts) under normal operating conditions, abnormal

conditions, or in the presence of a single fault. When using a battery power supply the external

application must provide safeguards not to exceed the limits defined by PS-1, as well. The ex-

ternal application (Customer Product) must take measures to limit the power, the voltage or the

current, respectively, if required, and must provide safeguards to protect ordinary persons

against pain or injury caused by the voltage/current.

In case of a usage of the Cinterion® module not in accordance with the specifications or in sin-

gle fault condition the external application (Customer Product) must be capable to withstand

levels according to ES-1 / PS-1 also on all ports that are initially intended for signalling or audio,

e.g., USB, RS-232, GPIOs, SPI, earphone and microphone interfaces.

In addition, the external application (Customer Product) must be designed in a way to distribute

thermal energy generated by the intended operation of the Cinterion® module. In case of high

temperature operation, the external application must provide safeguards to protect ordinary

persons against pain or injury caused by the heat.

Table 34: IEC 62368-1 Classification

Source of Energy

Electrical energy source

Class

ES-1

Limits

The Cinterion® modules contain no electrical

energy source - especially no battery. The electri-

cal components and circuits have to be externally

power supplied:

DC either smaller 60 V

Or less than 2 mA

AC up to 1kHz smaller 30 V-rms or 42.4 V peak

AC above 100kHz smaller 70 V rms

Power source provided by the external application

must not exceed 15W, even under worst case and

any single fault condition defined by IEC-62368-1:

Section 6.2.2.3.

Power Source

(potential ignition source caus-

ing fire)

PS-1

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Table 34: IEC 62368-1 Classification

Source of Energy

Hazardous Substances,

Chemical reaction

Class

-

Limits

Under regular conditions, the Cinterion® modules

does not contain any chemically reactive sub-

stances, and no chemical energy source, espe-

cially no battery.

Module is compliant with RoHS and REACH.

In very rare cases however - under abnormal con-

ditions 9i.e. wrong supply voltage, burned module)

or in the presence of single electrical component

faults (i.e. shortcut) - health hazardous sub-

stances might be released if the worst comes to

the worst.

The Cinterion® modules have no sharp edges and

corners, no moving parts, no loosing, exploding or

imploding parts.

The mass is well below 1kg.

Under normal operating conditions, abnormal

operating conditions or single fault conditions the

temperature does not exceed +100°C on the

metal surface (shielding)

The Cinterion® module does not contain a radiant

energy source, any lasers, lamps, LEDs, X-Ray

emitting components or acoustic couplers.

Kinetic / mechanical energy

source

MS-1

Thermal energy source

TS-2

Note: Valid only for Cinterion®

modules with dimensions larger

than 50mm and operating

board temperatures higher than

+80°C.

Radiated energy source

RS-1

Thermal energy source

TS-3

Special safeguards required.

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5.2

SAR requirements specific to portable mobiles

Mobile phones, PDAs or other portable transmitters and receivers incorporating a GSM/UMTS

module must be in accordance with the guidelines for human exposure to radio frequency en-

ergy. This requires the Specific Absorption Rate (SAR) of portable PLSx3 based applications

to be evaluated and approved for compliance with national and/or international regulations.

Since the SAR value varies significantly with the individual product design manufacturers are

advised to submit their product for approval if designed for portable use. For European/US/Aus-

tralian-markets the relevant directives are mentioned below. The manufacturer of the end de-

vice is in the responsibility to provide clear installation and operating instructions for the user,

including the minimum separation distance required to maintain compliance with SAR and/or

RF field strength limits, as well as any special usage conditions required to do so, such as a

required accessory, the proper orientation of the device, the max antenna gain for detachable

antennas, or other relevant criteria. It is the responsibility of the manufacturer of the final prod-

uct to verify whether or not further standards, recommendations or directives are in force out-

side these areas.

Products intended for sale on US markets

ES 59005/ANSI C95.1 Considerations for evaluation of human exposure to Electromagnetic

Fields (EMFs) from Mobile Telecommunication Equipment (MTE) in the

frequency range 30MHz - 6GHz

Products intended for sale on European markets

EN 50360

EN 62311:2008

Product standard to demonstrate the compliance of mobile phones with

the basic restrictions related to human exposure to electromagnetic

fields (300MHz - 3GHz)

Assessment of electronic and electrical equipment related to human

expo-sure restrictions for electromagnetic fields (0 Hz - 300 GHz)

Please note that SAR requirements are specific only for portable devices and not for mobile

devices as defined below:

• Portable device:

A portable device is defined as a transmitting device designed to be used so that the radi-

ating structure(s) of the device is/are within 20 centimeters of the body of the user.

• Mobile device:

A mobile device is defined as a transmitting device designed to be used in other than fixed

locations and to generally be used in such a way that a separation distance of at least 20

centimeters is normally maintained between the transmitter's radiating structure(s) and the

body of the user or nearby persons. In this context, the term ''fixed location'' means that the

device is physically secured at one location and is not able to be easily moved to another

location.

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5.3

Reference Equipment for Type Approval

The Thales reference setup submitted to type approve PLSx3 (including a special approval

adapter for the DSB75) is shown in the following figure1:

LTE / GPRS / UMTS

Base Station

Diversity

Antenna

Main

Antenna

USB

ASC0

PC

Power

Supply

AH6-Adapter

SIM Card

SMA

SMA

SMA

USB

DSB75

Eval_Board

Eval_Board

PLS6x3

PLS6x3

Figure 49: Reference equipment for Type Approval

1. For RF performance tests a mini-SMT/U.FL to SMA adapter with attached 6dB coaxial attenuator is cho-

sen to connect the evaluation module directly to the GSM/UMTS test equipment instead of employing

the SMA antenna connectors on the PLSx3-DSB75 adapter as shown in Figure 49. The following prod-

ucts are recommended:

Hirose SMA-Jack/U.FL-Plug conversion adapter HRMJ-U.FLP(40)

(for details see http://www.hirose-connectors.com/ or http://www.farnell.com/

Aeroflex Weinschel Fixed Coaxial Attenuator Model 3T/4T

(for details see http://www.aeroflex.com/ams/weinschel/pdfiles/wmod3&4T.pdf)

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5.4

Compliance with FCC and ISED Rules and Regulations

The Equipment Authorization Certification for the Thales reference application described in

Section 5.3 will be registered under the following identifiers:

FCC Identifier: QIPPLS63-W

Industry Canada Certification Number: 7830A-PLS63W

Granted to THALES DIS AIS Deutschland GmbH

FCC Identifier: QIPPLS83-W

Industry Canada Certification Number: 7830A-PLS83W

Granted to THALES DIS AIS Deutschland GmbH

FCC Identifier: QIPPLS63-X

Industry Canada Certification Number: 7830A-PLS63X

Granted to THALES DIS AIS Deutschland GmbH

FCC Identifier: QIPPLS83-X

Industry Canada Certification Number: 7830A-PLS83X

Granted to THALES DIS AIS Deutschland GmbH

FCC Identifier: QIPPLS63-X2

Industry Canada Certification Number: 7830A-PLS63X2

Granted to THALES DIS AIS Deutschland GmbH

FCC Identifier: QIPPLS83-X2

Industry Canada Certification Number: 7830A-PLS83X2

Granted to THALES DIS AIS Deutschland GmbH

FCC Identifier: QIPPLS63-X3

Industry Canada Certification Number: 7830A-PLS63X3

Granted to THALES DIS AIS Deutschland GmbH

FCC Identifier: QIPPLS83-X3

Industry Canada Certification Number: 7830A-PLS83X3

Granted to THALES DIS AIS Deutschland GmbH

FCC Identifier: QIPPLS63-X4

Industry Canada Certification Number: 7830A-PLS63X4

Granted to THALES DIS AIS Deutschland GmbH

FCC Identifier: QIPPLS83-X4

Industry Canada Certification Number: 7830A-PLS83X4

Granted to THALES DIS AIS Deutschland GmbH

Manufacturers of mobile or fixed devices incorporating PLSx3 modules are authorized to use

the FCC Grants and ISED Certificates of the PLSx3 modules for their own final products ac-

cording to the conditions referenced in these documents. In this case, an FCC/IC label of the

module shall be visible from the outside, or the host device shall bear a second label stating

"Contains FCC ID: QIPPLS63-W”, "Contains FCC ID: QIPPLS83-W”, "Contains FCC ID: QIP-

PLS63-X”, "Contains FCC ID: QIPPLS83-X”, "Contains FCC ID: QIPPLS63-X2”, "Contains FCC

ID: QIPPLS83-X2”, "Contains FCC ID: QIPPLS63-X3”, "Contains FCC ID: QIPPLS83-X3”, "Con-

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tains FCC ID: QIPPLS63-X4”, "Contains FCC ID: QIPPLS83-X4”, and accordingly “Contains IC:

7830A-PLS63W“, “Contains IC: 7830A-PLS83W“, “Contains IC: 7830A-PLS63X“, “Contains IC:

7830A-PLS83X“, “Contains IC: 7830A-PLS63X2“, “Contains IC: 7830A-PLS83X2“, “Contains IC:

7830A-PLS63X3“, “Contains IC: 7830A-PLS83X3“, “Contains IC: 7830A-PLS63X4“, “Contains

IC: 7830A-PLS83X4“.

The integration is limited to fixed or mobile categorized host devices, where a separation distance

between the antenna and any person of min. 20cm can be assured during normal operating

conditions.

For mobile and fixed operation configuration the antenna gain, including cable loss, must not

exceed the limits listed in the following Table 35 and Table 36 for FCC and ISED.

.

Table 35: Antenna gain limits for FCC and ISED (for W and EP variants)

Operation band

FCC limit

ISED limit

Unit

8.60

10.20

5.30

10.20

Maximum gain in GSM/GPRS 850

Maximum gain in PCS 1900

Maximum gain in WCDMA Band 2

Maximum gain in WCDMA Band 4

Maximum gain in WCDMA Band 5

Maximum gain in LTE Band 2

Maximum gain in LTE Band 4

Maximum gain in LTE Band 5

Maximum gain in LTE Band 7

Maximum gain in LTE Band 8

Maximum gain in LTE Band 12

Maximum gain in LTE Band 13

Maximum gain in LTE Band 26

Maximum gain in LTE Band 38

Maximum gain in LTE Band 41

Maximum gain in WCDMA Band 2

Maximum gain in WCDMA Band 4

Maximum gain in WCDMA Band 5

Maximum gain in LTE Band 2

Maximum gain in LTE Band 4

Maximum gain in LTE Band 5

Maximum gain in LTE Band 12

Maximum gain in LTE Band 13

Maximum gain in LTE Band 14

8.01

5.00

9.40

8.01

5.00

9.40

8.01

9.70

8.70

9.16

9.30

8.01

8.01

8.01

5.00

9.40

8.01

5.00

9.40

8.70

9.16

9.23

dBi

dBi

dBi

dBi

dBi

dBi

dBi

dBi

dBi

dBi

dBi

dBi

dBi

dBi

dBi

dBi

dBi

dBi

dBi

dBi

dBi

dBi

dBi

dBi

dBi

8.01

5.00

6.10

8.01

5.00

6.10

8.01

-

5.61

5.93

6.10

8.01

8.01

8.01

5.00

6.10

8.01

5.00

6.10

5.61

5.93

N.A.

Maximum gain in LTE Band 66

5.00

Table 36: Antenna gain limits for FCC and ISED (for X, X2, X3, X4 variants)

5.00

Operation band

FCC limit

ISED limit

Unit

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Table 36: Antenna gain limits for FCC and ISED (for X, X2, X3, X4 variants)

Operation band

FCC limit

ISED limit

Unit

Maximum gain in LTE Band 25

Maximum gain in LTE Band 26

Maximum gain in LTE Band 66

Maximum gain in LTE Band 71

8.01

9.30

5.00

8.48

8.01

6.10

5.00

5.45

dBi

dBi

dBi

dBi

IMPORTANT:

Manufacturers of portable applications incorporating PLSx3 modules are required to have their

final product certified and apply for their own FCC Grant and ISED Certificate related to the

specific portable mobile. This is mandatory to meet the SAR requirements for portable mobiles

(see Section Table 33: for detail).

Changes or modifications not expressly approved by the party responsible for compliance

could void the user's authority to operate the equipment.

Note: This equipment has been tested and found to comply with the limits for a Class B digital

device, pursuant to part 15 of the FCC Rules and with ISED license-exempt RSS standard(s).

These limits are designed to provide reasonable protection against harmful interference in a

residential installation. This equipment generates, uses and can radiate radio frequency energy

and, if not installed and used in accordance with the instructions, may cause harmful interfer-

ence to radio communications. However, there is no guarantee that interference will not occur

in a particular installation. If this equipment does cause harmful interference to radio or televi-

sion reception, which can be determined by turning the equipment off and on, the user is en-

couraged to try to correct the interference by one or more of the following measures:

• Reorient or relocate the receiving antenna.

•

• Connect the equipment into an outlet on a circuit different from that to which the receiver is

Increase the separation between the equipment and receiver.

connected.

• Consult the dealer or an experienced radio/TV technician for help.

This Class B digital apparatus complies with Canadian ICES-003.

FCC Part 15.19 Warning Statement

THIS DEVICE COMPLIES WITH PART 15 OF THE FCC RULES. OPERATION IS SUBJECT TO THE

FOLLOWING TWO CONDITIONS: (1) THIS DEVICE MAY NOT CAUSE HARMFUL INTERFERENCE,

AND (2) THIS DEVICE MUST ACCEPT ANY INTERFERENCE RECEIVED, INCLUDING

INTERFERENCE THAT MAY CAUSE UNDESIRED OPERATION.

If Canadian approval is requested for devices incorporating PLSx3 modules the below notes

will have to be provided in the English and French language in the final user documentation.

Manufacturers/OEM Integrators must ensure that the final user documentation does not con-

tain any information on how to install or remove the module from the final product.

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Notes (ISED):

(EN) This Class B digital apparatus complies with Canadian ICES-003 and RSS-210. Opera-

tion is subject to the following two conditions: (1) this device may not cause interference, and

(2) this device must accept any interference, including interference that may cause undesired

operation of the device.

(FR) Cet appareil numérique de classe B est conforme aux normes canadiennes ICES-003 et

RSS-210. Son fonctionnement est soumis aux deux conditions suivantes: (1) cet appareil ne

doit pas causer d'interférence et (2) cet appareil doit accepter toute interférence, notamment

les interférences qui peuvent affecter son fonctionnement.

(EN) Radio frequency (RF) Exposure Information

The radiated output power of the Wireless Device is below the Innovation, Science and

Economic Development Canada (ISED) radio frequency exposure limits. The Wireless Device

should be used in such a manner such that the potential for human contact during normal

operation is minimized.

This device has also been evaluated and shown compliant with the ISED RF Exposure limits

under mobile exposure conditions. (antennas at least 20cm from a person‘s body).

(FR) Informations concernant l'exposltion aux fréquences radio (RF)

La puissance de sortie émise par l'appareil de sans fiI est inférieure à la limite d'exposition aux

fréquences radio d‘Innovation, Sciences et Développement économique Canada (ISDE). Utili-

sez l'appareil de sans fil de façon à minimiser les contacts humains lors du fonctionnement nor-

mal.

Ce périphérique a également été évalué et démontré conforme aux limites d'exposition aux RF

d'IC dans des conditions d'exposition à des appareils mobiles (les antennes se situent à moins

de 20cm du corps d'une personne).

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5.5

Compliance with Japanese Rules and Regulations

The PLSx3 reference application described in Section 5.3 complies with the requirements of

the Japanese "Telecommunications Business Law" and "Ordinance Concerning Technical

Regulations Conformity Certification of Specified Radio Equipment" as well as with the require-

ments of the Japanese "Radio Law" and "Ordinance Concerning Technical Conditions Compli-

ance Approval and Certification of the Type for Terminal Equipment".

• The certificate granted in accordance with the "Telecommunications Business Law" has the

identifier:

AD204118217 (for -J)

AD210086217 (for -W)

217-204182 (for -J)

217-210086 (for -W)

• The certificate granted in accordance with the "Radio Law" has the identifier:

Please refer to Figure 51 for the JATE/TELEC mark with identifiers:

:

Figure 50: JATE/TELEC mark for -J

Figure 51: JATE/TELEC mark for -W

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6 Document Information

125

6

Document Information

6.1

Revision History

Page 118 of 129

Proceeding document: "Cinterion® PLSx3-W Hardware Interface Description" Version 01.002c

New document: "Cinterion® PLSx3 Hardware Interface Description" Version 01.002d

Chapter

What is new

2.1.2

Updated CCIN to CCIN1 and CCIN2.

2.4

3.4

5.4

Updated Figure 26.

Updated Figure 32.

Added LET Band8 in Table 35.

Proceeding document: "Cinterion® PLSx3-W Hardware Interface Description" Version 01.002b

New document: "Cinterion® PLSx3 Hardware Interface Description" Version 01.002c

Chapter

What is new

2.4

Updated Figure 26.

Proceeding document: "Cinterion® PLSx3-W Hardware Interface Description" Version 01.002a

New document: "Cinterion® PLSx3 Hardware Interface Description" Version 01.002b

Chapter

What is new

Deleted GPO interface in Table 3.

Added Figure 6.

Added Figure 7.

Added Figure 14.

2.1.8.1

Added Figure 15.

2.1.2

2.1.4

2.1.5

2.1.7

2.2.1

2.3.2

2.3.4

2.4

3.4

3.7

-

Updated Table 11 and Table 12.

Update Figure 25.

Added new chapter for GNSS Antenna Interface Characteristics.

Updated Figure 26 for Sample Application.

Updated Table 19, Table 20, and Table 21.

Added new chapter Reliability Characteristics.

Remove I2C.

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125

Page 119 of 129

Proceeding document: "Cinterion® PLSx3-W Hardware Interface Description" Version 01.002

New document: "Cinterion® PLSx3 Hardware Interface Description" Version 01.002a

Proceeding document: "Cinterion® PLSx3-W Hardware Interface Description" Version 00.906a

New document: "Cinterion® PLSx3 Hardware Interface Description" Version 01.002

1.2.1

2.2

2.2.3.2

2.1.2

3.2.2.2

3.2.3

5.1

5.1.1

5.2

5.4

7.2

1.1

1.2.1

3.4.2

3.4.1

3.3.4

3.2.1

5.1.1

7

Chapter

What is new

Added a note to Table 1.

Updated Table 12.

Updated Figure 23.

Updated the low level impulse.

Updated Table 16 and added a note.

Added 1907/2006/EC (REACH) in Table 28.

New chapter regarding IEC 62368-1 Classification

Updated SAR requirement.

Added Table 35 and Table 36.

Updated Figure 52.

Chapter

What is new

Updated the supported product in the list.

Added new products and the supported bands in Table 1.

Added this section.

Updated Table 20 and Table 21.

Added this section.

Updated Figure 27.

New chapter regarding IEC 62368-1 Classification

Added the supported products in Table 37.

Chapter

What is new

2.1.3.1

2.1.9

2.1.10.3,

2.1.10.4

3.1

3.2.5

3.3

Add Reducing Power Consumption section.

Added Analog-to-Digital Converter (ADC) section.

Added Fast shutdown and Remove Wakeup sections.

Added Operation Mode section.

Added Automatic shutdown with sub sections.

Added Power Saving section.

Proceeding document: "Cinterion® PLSx3-W Hardware Interface Description" Version 00.024

New document: "Cinterion® PLSx3 Hardware Interface Description" Version 00.906

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3.6

4.3.1.2

4.3.2.2

5

7.2

3.2.1

2.1.2

--

--

2

2.1.1

2.1.6

3.2.5

3.4.1

3.5

--

2

3

4

2.1.1

1.3

-

1.4

2.1

3

Cinterion® PLSx3 Hardware Interface Description

6.1 Revision History

125

Page 120 of 129

Added Electrostatic Discharge section.

Added Figure 44.

Added Figure 48 and Table 27.

Added chapter 6 Regulatory and Type Approval Information.

Added Module Label Information section.

Updated Figure 27 and the description of IGT signal.

Updated Ignition signal description in Table 3.

Proceeding document: "Cinterion® PLSx3-W Hardware Interface Description" Version 00.012

New document: "Cinterion® PLSx3 Hardware Interface Description" Version 00.024

Chapter

What is new

Added new variants of -X, -EP, -LA and -J as well as their supported bands.

Update the height of the module.

Updated the pad assignment. Update the number of GPIO to 22.

Updated Figure 10.

Added the following chapters: 2.1.10.1, 2.2, 2.3, 2.4.

Added Automatic Shutdown section.

Updated power consumption.

Added Operating Temperatures section.

Removed TX-activity.

Proceeding document: "Cinterion® PLSx3-W Hardware Interface Description" Version 00.002

New document: "Cinterion® PLSx3-W Hardware Interface Description" Version 00.012

Chapter

What is new

Added the following new sections: 2.1.7, 2.1.8.1, 2.1.10, 2.1.6.1

Added the following new sections: 3.2.2, 3.2.4

Added the following new sections: 4.2.4, 4.3

Updated the pad assignment

Updated Figure 1

Updated company name and logo.

Proceeding document: "Cinterion® PLSx3-W Hardware Interface Description" Version 00.001

New document: "Cinterion® PLSx3-W Hardware Interface Description" Version 00.002

Chapter

What is new

Updated the Figure 2.

Added the following new sections: 2.1.3, 2.1.4 2.1.5, 2.1.6

Added section 3.2

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New document: "Cinterion® PLSx3-W Hardware Interface Description" Version 00.001

Chapter

What is new

--

Initial document setup.

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6.2

Related Documents

[1] PLSx3 AT Command Set

[2] PLSx3 Release Note

[3] Universal Serial Bus Specification Revision 2.0, April 27, 2000

[4] Application Note 48: SMT Module Integration

[5] Differences between Selected Cinterion® Modules, Hardware Migration Guide

6.3

Terms and Abbreviations

Abbreviation Description

Analog-to-digital converter

Automatic Gain Control

American National Standards Institute

ARFCN

Absolute Radio Frequency Channel Number

ARP

Antenna Reference Point

ASC0/ASC1

Asynchronous Controller. Abbreviations used for first and second serial interface of

PLSx3

CB or CBM

Cell Broadcast Message

Conformité Européene (European Conformity)

Challenge Handshake Authentication Protocol

ADC

AGC

ANSI

B

BER

BIP

BTS

CE

CHAP

CPU

CS

CSD

CTS

DAC

DCE

DRX

DSB

DSP

DSR

DTR

DTX

EFR

Thermistor Constant

Bit Error Rate

Bearer Independent Protocol

Base Transceiver Station

Central Processing Unit

Coding Scheme

Circuit Switched Data

Clear to Send

Digital-to-Analog Converter

Discontinuous Reception

Development Support Box

Digital Signal Processor

Data Set Ready

Data Terminal Ready

Discontinuous Transmission

Enhanced Full Rate

dBm0

Digital level, 3.14dBm0 corresponds to full scale, see ITU G.711, A-law

Data Communication Equipment (typically modems, e.g. Thales module)

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Abbreviation Description

Equivalent Isotropic Radiated Power

Electromagnetic Compatibility

Effective Radiated Power

Electrostatic Discharge

European Telecommunication Standard

European Telecommunication Standards Institute

Federal Communications Commission (U.S.)

Frequency Division Multiple Access

Full Rate

Gaussian Minimum Shift Keying

General Purpose Input/Output

High Impedance

Half Rate

Input/Output

Integrated Circuit

International Mobile Equipment Identity

International Standards Organization

International Telecommunications Union

kbits per second

Light Emitting Diode

Lithium-Ion

Link Power Management

Mbits per second

Man Machine Interface

Mobile Originated

Mobile Terminated

Negative Temperature Coefficient

Original Equipment Manufacturer

Power Amplifier

Password Authentication Protocol

Printed Circuit Board

Power Control Level

Protocol Data Unit

Li-Ion/Li+

Li battery

Rechargeable Lithium Ion or Lithium Polymer battery

Mobile Station ( module), also referred to as TE

MSISDN

Mobile Station International ISDN number

EIRP

EMC

ERP

ESD

ETS

ETSI

FCC

FDMA

FR

GMSK

GPIO

HiZ

HR

I/O

IC

IMEI

ISO

ITU

kbps

LED

LPM

Mbps

MMI

MO

MS

MT

NTC

OEM

PA

PAP

PCB

PCL

PDU

PBCCH

Packet Switched Broadcast Control Channel

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Abbreviation Description

Restriction of the use of certain hazardous substances in electrical and electronic

equipment.

PLL

PPP

PSK

PSU

PWM

R&TTE

RAM

RF

RFFE

RLS

RMS

RoHS

ROM

RTC

RTS

Rx

SAR

SAW

SD

SDC

SGMII

SELV

SIM

SMD

SMS

SMT

SPI

SRAM

TA

TDMA

TE

TLS

Tx

UART

URC

USSD

VSWR

Radio and Telecommunication Terminal Equipment

Phase Locked Loop

Point-to-point protocol

Phase Shift Keying

Power Supply Unit

Pulse Width Modulation

Random Access Memory

Radio Frequency

RF front-end

Radio Link Stability

Root Mean Square (value)

Read-only Memory

Real Time Clock

Request to Send

Receive Direction

Specific Absorption Rate

Surface Accoustic Wave

Secure Digital

Secure Digital Controller

Serial Gigabit Media Independent Interface

Safety Extra Low Voltage

Subscriber Identification Module

Surface Mount Device

Short Message Service

Surface Mount Technology

Serial Peripheral Interface

Static Random Access Memory

Terminal adapter (e.g. module)

Time Division Multiple Access

Terminal Equipment, also referred to as DTE

Transport Layer Security

Transmit Direction

Universal asynchronous receiver-transmitter

Unsolicited Result Code

Unstructured Supplementary Service Data

Voltage Standing Wave Ratio

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6.4

Safety Precaution Notes

Page 125 of 129

The following safety precautions must be observed during all phases of the operation, usage,

service or repair of any cellular terminal or mobile incorporating PLSx3. Manufacturers of the

cellular terminal are advised to convey the following safety information to users and operating

personnel and to incorporate these guidelines into all manuals supplied with the product. Fail-

ure to comply with these precautions violates safety standards of design, manufacture and in-

tended use of the product. Thales assumes no liability for customer’s failure to comply with

these precautions.

When in a hospital or other health care facility, observe the restrictions on the use of

mobiles. Switch the cellular terminal or mobile off, if instructed to do so by the guide-

lines posted in sensitive areas. Medical equipment may be sensitive to RF energy.

The operation of cardiac pacemakers, other implanted medical equipment and hear-

ing aids can be affected by interference from cellular terminals or mobiles placed close

to the device. If in doubt about potential danger, contact the physician or the manufac-

turer of the device to verify that the equipment is properly shielded. Pacemaker

patients are advised to keep their hand-held mobile away from the pacemaker, while

it is on.

Switch off the cellular terminal or mobile before boarding an aircraft. Make sure it can-

not be switched on inadvertently. The operation of wireless appliances in an aircraft is

forbidden to prevent interference with communications systems. Failure to observe

these instructions may lead to the suspension or denial of cellular services to the

offender, legal action, or both.

Do not operate the cellular terminal or mobile in the presence of flammable gases or

fumes. Switch off the cellular terminal when you are near petrol stations, fuel depots,

chemical plants or where blasting operations are in progress. Operation of any elec-

trical equipment in potentially explosive atmospheres can constitute a safety hazard.

Your cellular terminal or mobile receives and transmits radio frequency energy while

switched on. Remember that interference can occur if it is used close to TV sets,

radios, computers or inadequately shielded equipment. Follow any special regulations

and always switch off the cellular terminal or mobile wherever forbidden, or when you

suspect that it may cause interference or danger.

Road safety comes first! Do not use a hand-held cellular terminal or mobile when driv-

ing a vehicle, unless it is securely mounted in a holder for speakerphone operation.

Before making a call with a hand-held terminal or mobile, park the vehicle.

Speakerphones must be installed by qualified personnel. Faulty installation or opera-

tion can constitute a safety hazard.

IMPORTANT!

Cellular terminals or mobiles operate using radio signals and cellular networks.

Because of this, connection cannot be guaranteed at all times under all conditions.

Therefore, you should never rely solely upon any wireless device for essential com-

munications, for example emergency calls.

Remember, in order to make or receive calls, the cellular terminal or mobile must be

switched on and in a service area with adequate cellular signal strength.

Some networks do not allow for emergency calls if certain network services or phone

features are in use (e.g. lock functions, fixed dialing etc.). You may need to deactivate

those features before you can make an emergency call.

Some networks require that a valid SIM card be properly inserted in the cellular termi-

nal or mobile.

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7 Appendix

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7

Appendix

7.1

List of Parts and Accessories

Table 37: List of parts and accessories

Description

PLS63-X

Supplier

Ordering information

Thales

PLS83-X

Thales

PLS63-W

Thales

PLS83-W

Thales

PLS63-LA

Thales

PLS83-LA

Thales

PLS63-EP

Thales

PLS83-EP

Thales

PLS63-J

Thales

PLS83-J

Thales

PLS63-X2

Thales

Standard module

Thales IMEI:

Packaging unit (ordering) number: L30960-N6500-A100

Module label number: S30960-S6500-A100-11

Standard module

Thales IMEI:

Packaging unit (ordering) number: L30960-N6510-A100

Module label number: S30960-S6510-A100-1

Standard module

Thales IMEI:

Packaging unit (ordering) number: L30960-N6520-A100

Module label number: S30960-S6520-A100-1

Standard module

Thales IMEI:

Packaging unit (ordering) number: L30960-N6530-A100

Module label number1: S30960-S6530-A100-1

Standard module

Thales IMEI:

Packaging unit (ordering) number: L30960-N6540-A100

Module label number: S30960-S6540-A100-1

Standard module

Thales IMEI:

Packaging unit (ordering) number: L30960-N6550-A100

Module label number: S30960-S6550-A100-1

Standard module

Thales IMEI:

Packaging unit (ordering) number: L30960-N6560-A100

Module label number: S30960-S6560-A100-1

Standard module

Thales IMEI:

Packaging unit (ordering) number: L30960-N6570-A100

Module label number: S30960-S6570-A100-1

Standard module

Thales IMEI:

Packaging unit (ordering) number: L30960-N6580-A100

Module label number: S30960-S6580-A100-1

Standard module

Thales IMEI:

Packaging unit (ordering) number: L30960-N6590-A100

Module label number: S30960-S6590-A100-1

Standard module

Thales IMEI:

Packaging unit (ordering) number: L30960-N6506-A100

Module label number: S30960-S6506-A100-1

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Table 37: List of parts and accessories

Description

PLS83-X2

Supplier

Ordering information

Thales

PLS63-X3

Thales

PLS83-X3

Thales

PLS63-X4

Thales

PLS83-X4

Thales

PLS63-I

Thales

PLS83-I

Thales

Standard module

Thales IMEI:

Packaging unit (ordering) number: L30960-N6516-A100

Module label number: S30960-S6516-A100-1

Standard module

Thales IMEI:

Packaging unit (ordering) number: L30960-N6508-A100

Module label number: S30960-S6508-A100-1

Standard module

Thales IMEI:

Packaging unit (ordering) number: L30960-N6518-A100

Module label number: S30960-S6518-A100-1

Standard module

Thales IMEI:

Packaging unit (ordering) number: L30960-N6512-A100

Module label number: S30960-S6512-A100-1

Standard module

Thales IMEI:

Packaging unit (ordering) number: L30960-N6522-A100

Module label number: S30960-S6522-A100-1

Standard module

Thales IMEI:

Packaging unit (ordering) number: L30960-N6526-A100

Module label number: S30960-S6526-A100-1

Standard module

Thales IMEI:

Packaging unit (ordering) number: L30960-N6536-A100

Module label number: S30960-S6536-A100-1

PLS63-X Evaluation Module

Thales

Ordering number: L30960-N6501-A100

PLS83-X Evaluation Module

Thales

Ordering number: L30960-N6511-A100

PLS63-W Evaluation Module Thales

Ordering number: L30960-N6521-A100

PLS83-W Evaluation Module Thales

Ordering number: L30960-N6531-A100

PLS63-LA Evaluation Module Thales

Ordering number: L30960-N6541-A100

PLS83-LA Evaluation Module Thales

Ordering number: L30960-N6551-A100

PLS63-EP Evaluation Module Thales

Ordering number: L30960-N6561-A100

PLS83-EP Evaluation Module Thales

Ordering number: L30960-N6571-A100

PLS63-J Evaluation Module

Thales

Ordering number: L30960-N6581-A100

PLS83-J Evaluation Module

Thales

Ordering number: L30960-N6591-A100

PLS63-X2 Evaluation Module Thales

Ordering number: L30960-N6507-A100

PLS83-X2 Evaluation Module Thales

Ordering number: L30960-N6517-A100

PLS63-X3 Evaluation Module Thales

Ordering number: L30960-N6509-A100

PLS83-X3 Evaluation Module Thales

Ordering number: L30960-N6519-A100

PLS63-X4 Evaluation Module Thales

Ordering number: L30960-N6513-A100

PLS83-X4 Evaluation Module Thales

Ordering number: L30960-N6523-A100

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Table 37: List of parts and accessories

Description

Supplier

Ordering information

PLS63-I Evaluation Module

Thales

Ordering number: L30960-N6527-A100

PLS83-I Evaluation Module

Thales

Ordering number: L30960-N6537-A100

DSB-mini

Ordering number: L30960-N0030-A100

DSB75 Evaluation Kit

Ordering number: L36880-N8811-A100

Ordering number: L30960-N0100-A100

Thales

Thales

Thales

EVAL DSB Adapter for

mounting PLSx3 evaluation

modules onto DSB75

LGA DevKit

Thales

LGA DevKit consists of

Cinterion® LGA DevKit L Base PCB:

Ordering number: L30960-N0112-A100

Cinterion® LGA DevKit Socket SML:

Ordering number: L30960-N0110-A100

1. Note: At the discretion of Thales, module label information can either be laser engraved on the module’s

shielding or be printed on a label adhered to the module’s shielding.

Table 38: Molex sales contacts (subject to change)

Molex

For further information please click:

http://www.molex.com

Molex China Distributors

Beijing,

Room 1311, Tower B, COFCO Plaza

No. 8, Jian Guo Men Nei Street, 100005

Beijing

P.R. China

Phone: +86-10-6526-9628

Fax: +86-10-6526-9730

Molex Deutschland GmbH

Otto-Hahn-Str. 1b

69190 Walldorf

Germany

Phone: +49-6227-3091-0

Fax: +49-6227-3091-8100

Email: mxgermany@molex.com

Molex Singapore Pte. Ltd.

110, International Road

Jurong Town,

Singapore 629174

American Headquarters

Lisle, Illinois 60532

U.S.A.

Phone: +1-800-78MOLEX

Fax: +1-630-969-1352

Molex Japan Co. Ltd.

1-5-4 Fukami-Higashi,

Yamato-City,

Kanagawa, 242-8585

Japan

Phone: +65-6-268-6868

Fax: +65-6-265-6044

Phone: +81-46-265-2325

Fax: +81-46-265-2365

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7.2

Module Label Information

The label engraved on the top of PLSx3 comprises the following information.

4

8

1

5

2

3

6

7

No.

1

2

3

4

5

6

7

8

Table 39: PLSx3 label information

Figure 52: PLSx3 Label

Cinterion logo

Factory Code

Manufacturing country (e.g., “Made in China”)

Product name/variant (e.g. “PLS83-W”)

Product order code

Manufacturer 2D barcode

Product IMEI

2-digital date code of product production (for decoding see Table below)

Table 40: Date code table

Code

L

Code

1

M

2

N

3

P

4

Date Code

R

5

S

6

T

7

U

8

V

9

W

O

X

N

A

D

Year

2019

2020

2021

2022

2023

2024

2025

2026

2027

2028

2029

2030

Month Jan.

Feb. Mar.

Apr. May

June

July

Aug.

Sept. Oct.

Nov. Dec.

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129

THALES DIS AIS Deutschland GmbH

Werinherstrasse 81

81541 Munich

Germany

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