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1 2 3 4 5 | Users Manual | February 20 2021 / April 30 2021 | ||||||
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Users Manual rev1 | Users Manual | 1.15 MiB | February 20 2021 / April 30 2021 | |||
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Internal Photos | Internal Photos | 437.61 KiB | September 03 2023 | |||
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External Photos | External Photos | 490.47 KiB | September 03 2023 | |||
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Label & Location | ID Label/Location Info | 232.55 KiB | January 21 2021 | |||
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Attestation Statements part 2.911 d 5 i filing | Attestation Statements | 218.90 KiB | September 03 2023 | |||
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Attestation Statements part 2.911 d 5 ii filing | Attestation Statements | 216.64 KiB | September 03 2023 | |||
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C2PC Cover Letter | Cover Letter(s) | 225.74 KiB | September 03 2023 | |||
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CONF Letter | Cover Letter(s) | 239.23 KiB | September 03 2023 | |||
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Name Change | Cover Letter(s) | 186.26 KiB | September 03 2023 | |||
1 2 3 4 5 | Operation Description-1 | Operational Description | September 03 2023 | confidential | ||||
1 2 3 4 5 | Operation Description-2 | Operational Description | September 03 2023 | confidential | ||||
1 2 3 4 5 | Operation Description-3 | Operational Description | September 03 2023 | confidential | ||||
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Power of Attorney Letter | Cover Letter(s) | 223.56 KiB | September 03 2023 | |||
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Test Report | Test Report | 1.31 MiB | September 03 2023 | |||
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Test Setup Photos | Test Setup Photos | 719.16 KiB | September 03 2023 | |||
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US agent letter | Attestation Statements | 605.44 KiB | September 03 2023 | |||
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RF Exposure Info | RF Exposure Info | 761.63 KiB | September 03 2023 | |||
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Test Report 2/3G-1 | Test Report | 5.97 MiB | September 03 2023 | |||
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Test Report 4G-15 | Schematics | 5.37 MiB | September 03 2023 | |||
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Test Report 4G-16 | Test Report | 2.68 MiB | September 03 2023 | |||
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Test Report 4G-2 | Test Report | 5.91 MiB | September 03 2023 | |||
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Test Report 4G-9 | Test Report | 5.69 MiB | September 03 2023 | |||
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Confidentiality Letter | Cover Letter(s) | 355.78 KiB | August 30 2021 | |||
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LOA Letter | Cover Letter(s) | 355.38 KiB | August 30 2021 | |||
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RF Exposure | RF Exposure Info | 714.42 KiB | August 30 2021 | |||
1 2 3 4 5 |
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Test Report Part 27P (LTE B8) | Test Report | 3.74 MiB | August 30 2021 | |||
1 2 3 4 5 | BOM | Parts List/Tune Up Info | January 21 2021 | confidential | ||||
1 2 3 4 5 | Block Diagram | Block Diagram | January 21 2021 | confidential | ||||
1 2 3 4 5 | Cover Letter(s) | January 21 2021 | ||||||
1 2 3 4 5 | Cover Letter(s) | January 21 2021 | ||||||
1 2 3 4 5 | RF Exposure Info | 802.45 KiB | January 21 2021 | |||||
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MPE rev2 | RF Exposure Info | 1001.12 KiB | February 20 2021 / January 21 2021 | |||
1 2 3 4 5 | Cover Letter(s) | January 21 2021 | ||||||
1 2 3 4 5 | Operational Description | Operational Description | January 21 2021 | confidential | ||||
1 2 3 4 5 | PCB Layout | Schematics | January 21 2021 | confidential | ||||
1 2 3 4 5 | Cover Letter(s) | January 21 2021 | ||||||
1 2 3 4 5 | Schematics | Schematics | January 21 2021 | confidential | ||||
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Test Report LTE part1 | Test Report | 3.68 MiB | January 21 2021 | |||
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Test Report LTE part10 | Test Report | 5.16 MiB | January 21 2021 | |||
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Test report GSM WCDMA part3 | Test Report | 606.58 KiB | January 21 2021 | |||
1 2 3 4 5 | Tune-up Procedure | Parts List/Tune Up Info | January 21 2021 | confidential | ||||
1 2 3 4 5 | BOM List | Parts List/Tune Up Info | January 21 2021 | confidential | ||||
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Modular Approval | Cover Letter(s) | 381.53 KiB | January 21 2021 | |||
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long-term Confidentiality Request | Cover Letter(s) | 357.89 KiB | January 21 2021 | |||
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short-term Confidentiality Request Letter | Cover Letter(s) | 357.88 KiB | January 21 2021 |
1 2 3 4 5 | User Manual | Users Manual | 2.40 MiB | August 30 2021 |
Cinterion® PLSx3
Hardware Interface Description
Version:
DocId:
01.002d
PLSx3_HID_v01.002d
Cinterion® PLSx3 Hardware Interface Description
Page 2 of 129
2
Document Name: Cinterion® PLSx3 Hardware Interface Description
Version:
01.002d
Date:
DocId:
Status
2021-08-24
PLSx3_HID_v01.002d
Public / Released
GENERAL NOTE
THIS DOCUMENT CONTAINS INFORMATION ON THALES DIS AIS DEUTSCHLAND GMBH
(“THALES”) PRODUCTS. THALES RESERVES THE RIGHT TO MAKE CHANGES TO THE PROD-
UCTS DESCRIBED HEREIN. THE SPECIFICATIONS IN THIS DOCUMENT ARE SUBJECT TO
CHANGE AT THE DISCRETION OF THALES. THE PRODUCT AND THIS DOCUMENT ARE PRO-
VIDED ON AN "AS IS" BASIS ONLY AND MAY CONTAIN DEFICIENCIES OR INADEQUACIES.
THALES DOES NOT ASSUME ANY LIABILITY FOR INFORMATION PROVIDED IN THE DOCUMENT
OR ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT DESCRIBED HEREIN.
THALES GRANTS A NON-EXCLUSIVE RIGHT TO USE THE DOCUMENT. THE RECIPIENT SHALL
NOT COPY, MODIFY, DISCLOSE OR REPRODUCE THE DOCUMENT EXCEPT AS SPECIFICALLY
AUTHORIZED BY THALES.
Copyright © 2021, THALES DIS AIS Deutschland GmbH
Trademark Notice
Thales, the Thales logo, are trademarks and service marks of Thales and are registered in certain coun-
tries. Microsoft and Windows are either registered trademarks or trademarks of Microsoft Corporation in
the United States and/or other countries. All other registered trademarks or trademarks mentioned in this
document are property of their respective owners.
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Contents
1
2
Introduction ................................................................................................................. 9
Product Variants ................................................................................................ 9
1.1
Key Features at a Glance .................................................................................. 9
1.2
1.2.1
Supported Frequency Bands .............................................................. 14
PLSx3 System Overview ................................................................................. 16
Circuit Concept ................................................................................................ 17
1.3
1.4
Interface Characteristics .......................................................................................... 18
Application Interface ........................................................................................ 18
2.1
Pad Assignment.................................................................................. 18
2.1.1
Signal Properties................................................................................. 22
2.1.2
2.1.2.1 Absolute Maximum Ratings ................................................ 27
2.1.3 USB Interface...................................................................................... 28
2.1.3.1 Reducing Power Consumption............................................ 29
Serial Interface ASC0 ......................................................................... 30
2.1.4
2.1.5
Serial Interface ASC1 ......................................................................... 32
2.1.6 UICC/SIM/USIM Interface................................................................... 34
2.1.6.1 Enhanced ESD Protection for SIM Interface ....................... 36
2.1.6.2 SIM_SWITCH Line.............................................................. 37
2.1.7 GPIO Interface .................................................................................... 38
2.1.8 Digital Audio Interface......................................................................... 40
2.1.8.1 Pulse Code Modulation Interface ........................................ 40
2.1.8.2
Inter-IC Sound Interface...................................................... 41
2.1.9
Analog-to-Digital Converter (ADC)...................................................... 42
2.1.10 Control Signals.................................................................................... 42
2.1.10.1 Status LED .......................................................................... 42
2.1.10.2 Power Indication.................................................................. 43
2.1.10.3 Fast Shutdown .................................................................... 44
2.1.10.4 Remote Wakeup.................................................................. 45
RF Antenna Interface....................................................................................... 46
2.2.1
Antenna Interface Specifications ........................................................ 47
Antenna Installation ............................................................................ 56
2.2.2
2.2.3 RF Line Routing Design...................................................................... 57
2.2.3.1
Line Arrangement Examples ............................................... 57
2.2.3.2 Routing Example................................................................. 59
GNSS Antenna Interface ................................................................................. 61
2.3.1 GNSS Receiver................................................................................... 61
2.3.2 GNSS Antenna ................................................................................... 61
2.3.3 GNSS Antenna Diagnostic.................................................................. 63
2.3.4 GNSS Antenna Interface Characteristics............................................ 64
Sample Application .......................................................................................... 65
2.2
2.4
2.3
3
Operating Characteristics ........................................................................................ 67
Operating Modes ............................................................................................. 67
3.1
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3.2
3.3
3.4
3.5
3.6
3.7
3.2.5
3.2.3
3.2.4
Power Up/Power Down Scenarios ................................................................... 68
3.2.1
Turn on PLSx3 .................................................................................... 68
3.2.2 Restart PLSx3..................................................................................... 68
3.2.2.1 Restart PLSx3 Using Restart Command............................. 68
3.2.2.2 Restart PLSx3 Using EMERG_RST.................................... 69
Signal States after Startup .................................................................. 70
Turn off PLSx3 .................................................................................... 71
3.2.4.1 Switch off PLSx3 Using AT Command ................................ 71
Automatic Shutdown ........................................................................... 71
Thermal Shutdown .............................................................. 71
3.2.5.1
3.2.5.2 Undervoltage Shutdown...................................................... 73
3.2.5.3 Overvoltage Shutdown........................................................ 73
3.2.5.4 Deferred Shutdown at Extreme Temperature Condition...... 74
Power Saving................................................................................................... 74
Power Saving while Attached to GSM Networks ................................ 74
3.3.1
3.3.2
Power Saving while Attached to WCDMA Networks .......................... 75
Power Saving while Attached to LTE Networks .................................. 76
3.3.3
3.3.4 Wake-up via RTS0.............................................................................. 77
Power Supply................................................................................................... 78
Power Supply Ratings......................................................................... 79
3.4.1
3.4.2 Minimizing Power Losses ................................................................... 87
3.4.3 Monitoring Power Supply by AT Command ........................................ 87
Operating Temperatures.................................................................................. 88
Electrostatic Discharge .................................................................................... 88
Reliability Characteristics ................................................................................. 89
Mechanical Dimensions, Mounting and Packaging............................................... 90
Mechanical Dimensions of PLSx3 ................................................................... 90
4.1
Mounting PLSx3 onto the Application Platform................................................ 93
4.2
SMT PCB Assembly ........................................................................... 93
4.2.1
4.2.1.1
Land Pattern and Stencil..................................................... 93
4.2.1.2 Board Level Characterization.............................................. 95
4.2.2 Moisture Sensitivity Level ................................................................... 95
Soldering Conditions and Temperature .............................................. 96
4.2.3
4.2.3.1 Reflow Profile ...................................................................... 96
4.2.3.2 Maximum Temperature and Duration .................................. 97
4.2.4 Durability and Mechanical Handling.................................................... 98
4.2.4.1 Storage Conditions.............................................................. 98
4.2.4.2 Processing Life.................................................................... 99
4.2.4.3 Baking ................................................................................. 99
4.2.4.4 Electrostatic Discharge ....................................................... 99
Packaging ...................................................................................................... 100
Tape and Reel .................................................................................. 100
4.3.1
4.3.1.1 Orientation......................................................................... 100
4.3.1.2 Barcode Label ................................................................... 101
4.3
4
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4.3.2
Shipping Materials ............................................................................ 102
4.3.2.1 Moisture Barrier Bag ......................................................... 102
Transportation Box ............................................................ 105
4.3.2.2
5
6
7
Regulatory and Type Approval Information ......................................................... 106
Directives and Standards............................................................................... 106
5.1
IEC 62368-1 Classification................................................................ 109
5.1.1
SAR requirements specific to portable mobiles ............................................. 111
Reference Equipment for Type Approval ....................................................... 112
Compliance with FCC and ISED Rules and Regulations............................... 113
Compliance with Japanese Rules and Regulations ....................................... 117
5.2
5.3
5.4
5.5
Document Information............................................................................................ 118
Revision History ............................................................................................. 118
6.1
Related Documents ....................................................................................... 121
6.2
Terms and Abbreviations ............................................................................... 121
6.3
Safety Precaution Notes ................................................................................ 124
6.4
Appendix.................................................................................................................. 125
List of Parts and Accessories......................................................................... 125
7.1
Module Label Information .............................................................................. 128
7.2
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Tables
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Table 38:
Table 39:
Table 40:
Supported frequency bands for each PLSx3 variant...................................... 14
Overview: Pad assignments........................................................................... 19
Signal properties ............................................................................................ 22
Absolute maximum ratings............................................................................. 27
Signals of the SIM interface (SMT application interface) ............................... 34
GPIO lines and possible alternative assignment............................................ 38
Overview of PCM pin functions ...................................................................... 40
Overview of I2S pin functions ......................................................................... 41
Remote wakeup lines..................................................................................... 45
Return loss in the active band........................................................................ 46
RF Antenna interface GSM/UMTS/LTE ......................................................... 47
RF Antenna interface LTE for -J variant (at operating temperature range).... 55
Sample ranges of the GNSS antenna diagnostic measurements and their
possible meaning ........................................................................................... 63
GNSS properties ............................................................................................ 64
Overview of operating modes ........................................................................ 67
Pull-up and Pull-down Values ........................................................................ 70
Temperature associated URCs...................................................................... 72
Supply Ratings ............................................................................................... 79
Current Consumption Ratings -GSM ............................................................. 80
Current Consumption Ratings - UMTS .......................................................... 85
Current Consumption Ratings - LTE .............................................................. 86
Board Temperature ........................................................................................ 88
Electrostatic values ........................................................................................ 88
Summary of reliability test conditions............................................................. 89
Reflow temperature ratings ............................................................................ 96
Storage conditions ......................................................................................... 98
VP Box label information.............................................................................. 105
Directives ..................................................................................................... 106
Standards of North American type approval ................................................ 106
Standards of European type approval.......................................................... 107
Requirements of quality ............................................................................... 107
Standards of the Ministry of Information Industry of the
People’s Republic of China .......................................................................... 107
Toxic or hazardous substances or elements with defined concentration
limits ............................................................................................................. 108
IEC 62368-1 Classification........................................................................... 109
Antenna gain limits for FCC and ISED (for W and EP variants) .................. 114
Antenna gain limits for FCC and ISED (for X, X2, X3, X4 variants) ............. 114
List of parts and accessories........................................................................ 125
Molex sales contacts (subject to change) .................................................... 127
PLSx3 label information ............................................................................... 128
Date code table ............................................................................................ 128
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Figures
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Figure 49:
PLSx3 system overview ................................................................................. 16
PLSx3 block diagram ..................................................................................... 17
PLSx3 bottom view: Pad assignments........................................................... 20
PLSx3 top view: Pad assignments................................................................. 21
USB circuit ..................................................................................................... 28
Serial interface ASC0..................................................................................... 30
ASC0 startup behavior ................................................................................... 31
Serial interface ASC1..................................................................................... 32
ASC1 startup behavior ................................................................................... 33
Module’s two UICC/SIM/USIM interfaces ...................................................... 35
UICC/SIM/USIM interfaces connected........................................................... 35
SIM interface - enhanced ESD protection...................................................... 36
External UICC/SIM/USIM switch.................................................................... 37
Sample circuit for SIM interface connection via SIM switch........................... 37
GPIO startup behavior ................................................................................... 39
PCM timing short frame ................................................................................. 41
Status signaling with LED driver .................................................................... 42
Power indication signal .................................................................................. 43
Fast shutdown timing ..................................................................................... 44
Antenna pads (bottom view) .......................................................................... 56
Embedded stripline arrangement example .................................................... 57
Micro-Stripline arrangement example ............................................................ 58
Routing to application‘s RF connector ........................................................... 59
Routing Detail................................................................................................. 60
Supply voltage for active GNSS antenna....................................................... 62
ESD protection for passive GNSS antenna ................................................... 63
Schematic diagram of PLSx3 sample application .......................................... 66
IGT timing....................................................................................................... 68
Power saving and paging in GSM networks .................................................. 75
Power saving and paging in WCDMA networks............................................. 75
Power saving and paging in LTE networks .................................................... 76
Wake-up via RTS0 ......................................................................................... 77
Decoupling capacitor(s) for BATT+................................................................ 78
Power supply limits during transmit burst....................................................... 87
PLSx3– top and bottom view ......................................................................... 90
Dimensions of PLSx3 (all dimensions in mm)................................................ 91
Dimensions of PLSx3 (keepout area recommended) .................................... 92
Land pattern (top view) .................................................................................. 93
Recommended design for 110 micron thick stencil (top view) ....................... 94
Recommended design for 150 micron thick stencil (top view) ....................... 94
Reflow Profile ................................................................................................ 96
Carrier tape .................................................................................................. 100
Reel direction ............................................................................................... 100
Barcode label on tape reel ........................................................................... 101
Barcode label on tape reel - layout .............................................................. 101
Moisture barrier bag (MBB) with imprint....................................................... 102
Moisture Sensitivity Label ............................................................................ 103
Humidity Indicator Card - HIC ...................................................................... 104
Sample of VP box label................................................................................ 105
Reference equipment for Type Approval ..................................................... 112
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Figure 50:
Figure 51:
Figure 52:
JATE/TELEC mark for -J.............................................................................. 117
JATE/TELEC mark for -W ............................................................................ 117
PLSx3 Label................................................................................................. 128
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1 Introduction
17
Page 9 of 129
1
Introduction
This document1 describes the hardware of the Cinterion® PLSx3 module. It helps you quickly
retrieve interface specifications, electrical and mechanical details and information on the re-
quirements to be considered for integrating further components.
Note: This Hardware Interface Description is a preliminary version and as such subject to
change depending on further implementation and measurements.
1.1
Product Variants
This document applies to the following Thales module variants:
• Cinterion®
PLS63-W Module
• Cinterion®
PLS63-EP Module
• Cinterion®
PLS63-LA Module
• Cinterion®
PLS63-J Module
• Cinterion®PLS63-X Module
• Cinterion®PLS63-X2 Module
• Cinterion®PLS63-X3 Module
• Cinterion®PLS63-X4 Module
• Cinterion®PLS63-I Module
• Cinterion®
• Cinterion®
• Cinterion®
• Cinterion®
• Cinterion®
• Cinterion®
• Cinterion®
• Cinterion®
• Cinterion®
PLS83-W Module
PLS83-EP Module
PLS83-LA Module
PLS83-J Module
PLS83-X Module
PLS83-X2 Module
PLS83-X3 Module
PLS83-X4 Module
PLS83-I Module
Note: The PLSx3 variants differ in the fact that PLS63 supports UE CAT 1 (DL 10Mbps, UL
5Mbps) whereas PLS83 supports UE CAT 4(DL 150Mbps, UL 50Mbps). Wherever necessary
a note is made to differentiate between the product variants.
1.2
Key Features at a Glance
Feature
General
Frequency bands
Implementation
PLSx3 integrates all the bands required to have a global coverage across
the world (NORAM / LATAM / EMEA /APAC).
Please refer to Section 1.2.1 for an overview of the frequency bands
supported by each PLSx3 product variant.
1. The document is effective only if listed in the appropriate Release Notes as part of the technical docu-
mentation delivered with your Thales product.
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1.2 Key Features at a Glance
17
Page 10 of 129
Feature
GSM class
Implementation
Small MS
Output power (according
to release 99)
Output power (according
to Release 99)
Output power (according
to Release 8)
Class 4 (+33dBm ±2dB) for GSM850
Class 4 (+33dBm ±2dB) for GSM900
Class 1 (+30dBm ±2dB) for GSM1800
Class 1 (+30dBm ±2dB) for GSM1900
Class E2 (+27dBm ± 3dB) for GSM 850 8-PSK
Class E2 (+27dBm ± 3dB) for GSM 900 8-PSK
Class E2 (+26dBm +3 /-4dB) for GSM 1800 8-PSK
Class E2 (+26dBm +3 /-4dB) for GSM 1900 8-PSK
Class 3 (+24dBm +1/-3dB) for UMTS 850, WCDMA FDD BdXIX
Class 3 (+24dBm +1/-3dB) for UMTS 850, WCDMA FDD BdVI
Class 3 (+24dBm +1/-3dB) for UMTS 850, WCDMA FDD BdV
Class 3 (+24dBm +1/-3dB) for UMTS 900, WCDMA FDD BdVIII
Class 3 (+24dBm +1/-3dB) for UMTS 1700, WCDMA FDD BdIII
Class 3 (+24dBm +1/-3dB) for UMTS 1900, WCDMA FDD BdII
Class 3 (+24dBm +1/-3dB) for UMTS 2100, WCDMA FDD BdIV
Class 3 (+24dBm +1/-3dB) for UMTS 2100, WCDMA FDD BdI
Class 3 (+23dBm ±2dB) for LTE 600, LTE FDD Bd71
Class 3 (+23dBm ±2dB) for LTE 700, LTE FDD Bd12 <MFBI Bd17>
Class 3 (+23dBm ±2dB) for LTE 700, LTE FDD Bd13
Class 3 (+23dBm ±2dB) for LTE 700, LTE FDD Bd14
Class 3 (+23dBm+2/-2.5dB) for LTE 700, LTE FDD Bd28
Class 3 (+23dBm ±2dB) for LTE 850, LTE FDD Bd26
Class 3 (+23dBm ±2dB) for LTE 850, LTE FDD Bd18
Class 3 (+23dBm ±2dB) for LTE 850, LTE FDD Bd19
Class 3 (+23dBm ±2dB) for LTE 800, LTE FDD Bd20
Class 3 (+23dBm ±2dB) for LTE 850, LTE FDD Bd5
Class 3 (+23dBm ±2dB) for LTE 900, LTE FDD Bd8
Class 3 (+23dBm ±2dB) for LTE 1800, LTE FDD Bd3
Class 3 (+23dBm ±2dB) for LTE 1900, LTE FDD Bd2
Class 3 (+23dBm ±2dB) for LTE 1900, LTE FDD Bd25
Class 3 (+23dBm ±2dB) for LTE 2100, LTE FDD Bd1
Class 3 (+23dBm ±2dB) for LTE 2100, LTE FDD Bd4
Class 3 (+23dBm ±2dB) for LTE 2100, LTE FDD Bd66
Class 3 (+23dBm ±2dB) for LTE 2600, LTE FDD Bd7
Class 3 (+23dBm ±2dB) for LTE 2300, LTE TDD Bd40
Class 3 (+23dBm ±2dB) for LTE 2500, LTE TDD Bd41
Class 3 (+23dBm ±2dB) for LTE 2600, LTE TDD Bd38
Power supply
(see Section 2.1.2, and
Section 3.4)
Normal operation:
3.0V < VBATT+ < 4.5V
Typ value is 3.8V
Operating temperature
(board temperature)
(see Section 3.5)
Normal operation: -30°C to +85°C
Extended operation: -40°C to -30°C, +85°C to +95°C;
Dimensions: 33mm x 29mm x 2.5mm
Weight: approx. 4.8g
All hardware components fully compliant with EU RoHS Directive
UE CAT 1 for PLS63 (DL 10Mbps, UL 5Mbps)
UE CAT 4 for PLS83 (DL 150Mbps, UL 50Mbps)
Physical
(see Section 4.1)
RoHS
(see Section 5.1)
LTE features
3GPP Release 10
HSPA feature
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Page 11 of 129
Feature
Implementation
3GPP Release 7
UE CAT. 8, 6 for PLS63
HSDPA – DL 7.2Mbps
HSUPA – UL 5.7Mbps
UE CAT. 14, 6 for PLS83
HSPA+ – DL 21Mbps
HSUPA – UL 5.7Mbps
UMTS features
3GPP Release 4
GSM/GPRS/EGPRS features
Data transfer
Compressed mode (CM) supported according to 3GPP TS25.212
PS data rate – 384 kbps DL / 384 kbps UL
CS data rate – 64 kbps DL / 64 kbps UL
EDGE E2 power class for 8 PSK
GPRS:
• Multislot Class 12
• Mobile Station Class B
• Coding Scheme 1 – 4
EGPRS:
• Multislot Class 12
•
• Downlink coding schemes – CS 1-4, MCS 1-9
• Uplink coding schemes – CS 1-4, MCS 1-9
SRB loopback and test mode B
•
8-bit, 11-bit RACH
•
1 phase/2 phase access procedures
•
•
Link adaptation and IR
• NACC, extended UL TBF
• Mobile Station Class B
SMS
Point-to-point MT and MO
Cell broadcast
Text and PDU mode
Storage: SIM card plus SMS locations in mobile equipment
GNSS Features
Protocol
NMEA
Modes
(see Section 2.3)
General
Software
Standalone GNSS (GPS, GLONASS, Beidou, Galileo)
Automatic power saving modes.
DC feed bridge and control of power supply for active antenna
AT commands
Hayes 3GPP TS 27.007, TS 27.005, Thales
SIM Application Toolkit
Default (Network) bearer support for BIP
Firmware update
Generic update from host application over USB modem
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1.2 Key Features at a Glance
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Page 12 of 129
Feature
Interfaces
Module interface
Implementation
Surface mount device with solderable connection pads (SMT application
interface). Land grid array (LGA) technology ensures high solder joint reli-
ability and allows the use of an optional module mounting socket.
For more information on how to integrate SMT modules see also [4].This
application note comprises chapters on module mounting and application
layout issues as well as on additional SMT application development equip-
ment.
USB
(see Section 2.1.3)
USB 2.0 High Speed (480Mbit/s) device interface. Full Speed (12Mbit/s)
compliant.
2 serial interfaces
(see Section 2.1.4, and
Section 2.1.5)
2 UICC interfaces
(switchable)
(see Section 2.1.6)
GPIO interface
(see Section 2.1.7)
Digital audio interface
(see Section 2.1.8)
ASC0 (in parts shared with GPIO lines):
•
8-wire modem interface with status and control lines, unbalanced, asyn-
chronous
Fixed baud rates: 300bps to 921,600bps
Supports RTS0/CTS0 hardware flow control.
•
•
ASC1 (shared with GPIO lines):
•
•
•
4-wire, unbalanced asynchronous interface
Fixed baud rates: 300bps to 921,600bps and 3Mbps
Supports RTS1/CTS1 hardware flow control
Supported chip cards: UICC/SIM/USIM 3V, 1.8V
22 GPIO lines comprising:
13 lines shared with ASC0, ASC1 lines, with network status indication, fast
shutdown and SIM switch
9 GPIO lines not shared
1 digital interface can be configured as PCM or I2S.
RING0
Support RING0 to wake up host from power saving state.
Antenna interface pads
(see Section 2.1)
50Ω. UMTS/GSM/LTE main antenna, UMTS/LTE Rx Diversity antenna,
GNSS antenna.
ADC inputs
(see Section 2.1.9)
Analog-to-Digital Converter with unbalanced analog inputs, for example, for
the (external) antenna diagnosis
Power on/off, Reset
Power on/off
Reset
Special features
Evaluation kit
LGA DevKit
Evaluation module
Switch on by hardware signal IGT
Switch off by AT command
Switch off by hardware signal FST_SHDN instead of AT command
Automatic switch off in case of critical temperature or voltage conditions
Orderly reset by AT command
Reset by emergency reset signal EMERG_RST.
Real time clock
Timer functions via AT commands.
LGA DevKit designed to test Thales LGA modules.
PLSx3 module soldered onto a dedicated PCB that can be connected to an
adapter in order to be mounted onto the DSB75 or DSB mini.
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Feature
DSB-mini
DSB75
Implementation
DSB-mini Development Support Board designed to test and type approve.
It is the cost optimized development board alternative to DSB75.
DSB75 Development Support Board designed to test and type approve
Thales modules and provide a sample configuration for application engi-
neering. A special adapter is required to connect the PLSx3 evaluation
module to the DSB75.
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1.2 Key Features at a Glance
17
1.2.1
Supported Frequency Bands
Page 14 of 129
The following table lists the supported frequency bands for each of the PLSx3 product variants mentioned in Section 1.1.
Table 1: Supported frequency bands for each PLSx3 variant
Band
PLSx3-W
PLSx3-X
PLSx3-EP
PLSx3-LA
PLSx3-J
PLSx3-X2
PLSx3-X3
PLSx3-X4
PLSx3-I
GSM/GPRS/EDGE
850MHz
900MHz
1800MHz
1900MHz
WCDMA
Bd.1 (2100MHz)
Bd.2 (1900MHz)
Bd.3 (1800MHz)
Bd.4 (2100MHz)
Bd.5 (850MHz)
Bd.6 (850MHz)
Bd.8 (900MHz)
Bd.19 (850MHz)
LTE-FDD
Bd.1 (2100MHz)
Bd.2 (1900MHz)
Bd.3 (1800MHz)
Bd.4 (2100MHz)
Bd.5 (850MHz)
t
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
PLSx3_HID_v01.002d
Public / Released
x
x
x
x
x
x
x
x
x
x
x
x
x
Cinterion® PLSx3 Hardware Interface Description
1.2 Key Features at a Glance
17
Table 1: Supported frequency bands for each PLSx3 variant
Page 15 of 129
Band
PLSx3-W
PLSx3-X
PLSx3-EP
PLSx3-LA
PLSx3-J
PLSx3-X2
PLSx3-X3
PLSx3-X4
PLSx3-I
Bd.7 (2600MHz)
Bd.8 (900MHz)
Bd.12 (700MHz)
Bd.13 (700MHz)1
Bd.14(700MHz)
Bd.17 (700 MHz)
Bd.18 (850MHz)
Bd.19 (850MHz)
Bd.20 (800MHz)
Bd.25(1900MHz)
Bd.26 (850MHz)
Bd.28 (700MHz)
Bd.66(2100MHz)
Bd.71(600MHz)
LTE-TDD
Bd.38 (2600MHz)
Bd.40 (2300MHz)
Bd.41 (2500MHz)
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
1. For -W variant module, a sensitivity issue will occur in GNSS when transmitting in band 13, to avoid this issue, it is suggested to use -X variant module.
2. For Band 41 (LTE-TDD), the frequency range are partially supported (2535MHz...2675MHz).
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1.3 PLSx3 System Overview
17
1.3
PLSx3 System Overview
Page 16 of 129
Application
Module
GPIO
Digital Audio
STATUS
SIM_SWITCH
FST_SHDN
ASC1/GPIO
ASC0/GPIO
PWR_IND
ASC0/GPIO
USB
ADC
Digital Audio
SIM1 interface(with
SIM card detection)
SIM2 interface(with
SIM card detection)
CONTROL
Power Supply
RF_Main_Path
Diversity_RX
GNSS_Path
2
9
1
1
1
4
4
1
4
3
3
3
1
5
1
5
1
1
1
1
1
1
1
1
GPIO
PCM(I2S)/GPIO
STATUS/GPIO
SIM_SWITCH/GPIO
Fast Shutdown/GPIO
Serial Interface/GPIO
Serial Interface/GPIO
Power Indicator
Serial Interface 0
USB
ADC
PCM(I2S) Interface&MCLK
SIM1 Card
SIM2 Card
IGT
EMERG_RST
VGNSS
Base Band Power
RF Power
Main Antenna
Diversity Antenna
GNSS Antenna
1
GNSS_DC
Figure 1: PLSx3 system overview
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1.4 Circuit Concept
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1.4
Circuit Concept
Figure 2 shows block diagrams of the PLSx3 module and illustrate the major functional com-
ponents:
BATT+BB
EMERG_RST
IGT
ADC_IN
XTAL
STATUS
MCLK
SIM_SWITCH
FAST_SHDN
USB
ASC0
ASC1
GPIO
PWR_IND
I2S/PCM
UIM1
UIM2
PMU
VGNSS
V180
C
o
n
t
r
o
l
P
o
w
e
r
Power
SOC
BUS
Control
Memory
ANT
RF
Figure 2: PLSx3 block diagram
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2 Interface Characteristics
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2
Interface Characteristics
Page 18 of 129
PLSx3 is equipped with an SMT application interface that connects to the external application.
The SMT application interface incorporates the various application interfaces as well as the RF
antenna interface.
2.1
Application Interface
2.1.1
Pad Assignment
The SMT application interface on the PLSx3 provides land grid array pads to integrate the mod-
ule into external applications. Table 2 lists the pad assignment. Figure 3 shows the pin mapping
on the LGA footprint.
Please note that a number of connecting pads are marked as reserved for future use (rfu) and
further qualified as either (dnu), (GND) or (nc):
• Pads marked "rfu" and qualified as "dnu" (do not use) shall be soldered but electrically not
connected.
• Pads marked "rfu" and qualified as "nc" (not connected) are internally not connected with
PLSx3 modules, but shall be soldered.
Thales strongly recommends to solder all connecting pads for mechanical stability and heat
dissipation.
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ANT_DRX
Signal Name
Table 2: Overview: Pad assignments
Pad
No.
rfu (nc)
A4
GND
A5
A6
GND
A7
GND
GND
A8
A9
GND
A10 GND
A11 GND
A12
A13 GND
rfu (nc)
B3
B4
GND
B5
GND
GND
B6
B7
GND
B8
GND
GND
B9
B10 GND
B11 GND
B12 GND
B13 GND
B14 GPIO5/STATUS
C2
GND
GND
C3
C4
GND
C5
GND
GND
C6
C7
GND
GND
C8
C9
GND
C10 GND
C11 GND
C12
C13
C14
C15 GND
GND
D1
GND
D2
GND
D3
GND
D4
ANT_GNSS_DC
D5
GND
D6
GND
D7
GND
D8
D9
GND
D10 GND
D11 GND
D12
D13
D14
D15
D16
E1
CCIN2
rfu (nc)
CCCLK2
rfu (dnu)
rfu (dnu)
ANT_GNSS
rfu (nc)
rfu (dnu)
rfu (dnu)
Signal Name
GND
GND
GND
GND
GND
GND
GND
GND
rfu (dnu)
Pad
No.
E2
E3
E4
E5
E12 CCIO2
E13 CCRST2
rfu (nc)
E14
rfu (dnu)
E15
rfu (dnu)
E16
GND
F1
GND
F2
GND
F3
F4
GND
F13 GND
rfu (dnu)
F14
rfu (dnu)
F15
F16 GPIO25
G1
G2
G3
G4
G13
G14 GPIO7
G15 GPIO8
G16 GPIO11
H1
H2
H3
H4
H13
H14 GPIO4/FST_SHDN
H15 GPIO12
H16 GPIO6
GND
J1
GND
J2
GND
J3
J4
GND
J13 GND
J14 GPIO15
J15 GPIO14
J16 GPIO13
K1
K2
K3
K4
K5
K12
K13
K14 CCIO1
K15 CCVCC1
K16
L1
ANT_MAIN
GND
GND
GND
GND
rfu (nc)
rfu (dnu)
GND
GND
GND
GND
rfu (dnu)
VGNSS
GND
Pad
No.
L2
L3
L4
L5
L6
L7
L8
L9
L10
L11
L12
L13
L14
L15
L16
M2
M3
M4
M5
M6
M7
M8
M9
M10
M11
M12
M13
M14
M15
N3
N4
N5
N6
N7
N8
N9
N10
N11
N12
N13
N14
P4
P5
P6
P7
P8
P9
P10
P11
P12
P13
Signal Name
GND
GND
GND
rfu (nc)
CCVCC2
MCLK
rfu (nc)
rfu (nc)
rfu (nc)
SIM_SWITCH/GPIO26
rfu (nc)
rfu (dnu)
CCRST1
CCCLK1
IGT
GND
GND
PWR_IND
V180
GND
GPIO21/DIN
BCLK
FSC
GPIO20/DOUT
ADC3_IN
ADC2_IN
ADC1_IN
CCIN1
rfu (nc)
BATT+RF
BATT+RF
VUSB_IN
GPIO19/CTS1
GPIO18/RTS1
CTS0
DCD0/GPIO2
RTS0
GND
rfu (dnu)
BATT+BB
EMERG_RST
USB_DP
USB_DN
GPIO16/RXD1
GPIO17/TXD1
DTR0/GPIO1
DSR0/GPIO3
RING0/GPIO24
RXD0
TXD0
BATT+BB
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1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
USB_DP
USB_DN GPIO16
/RXD1
GPIO17
/TXD1
DTR0
/GPIO1
DSR0
/GIPO3
RXD0
TXD0
BATT+BB
RING0
/
GPIO24
BATT+RF
BATT+RF
VUSB_
IN
GPIO19
/CTS1
GPIO18
/RTS1
CTS0
DCD0
/GPIO2
RTS0
GND
rfu
(dnu)
BATT+BB EMERG_
RST
GND
GND
PWR_IND
V180
GND
BCLK
FSC
GPIO21
/DIN
GPIO20
/DOUT
ADC3_
IN
ADC2_
IN
ADC1_
IN
CCIN1
rfu
(nc)
GND
GND
GND
GND
rfu (nc)
CCVC
C2
MCLK
rfu
(nc)
rfu
(nc)
rfu
(nc)
K ANT_
MAIN
GND
GND
GND
GND
SIM_
SWITCH
/GPIO26
rfu
(nc)
rfu
(nc)
rfu
(dnu)
rfu
(dnu)
CCRST1 CCCLK1
IGT
CCIO1
CCVCC1
VGNSS
GND
GND
GND
GND
GND
GPIO15
GPIO14
GPIO13
GND
GND
GND
GND
GPIO12
GPIO6
GND
GND
GND
GND
GPIO7
GPIO8
GPIO11
GND
GND
GND
GND
rfu: Reserved for future use (should not
be connected to external application)
(nc): Internally not connected (may be ar-
bitrarily connected to external GND)
(dnu): Do not use
E ANT_
GNSS
GND
GND
GND
GND
CCIO2 CCRST2
GPIO4
/
FST_SH
DN
rfu
(dnu)
rfu
(nc)
rfu
(dnu)
rfu
(dnu)
GND
rfu
(nc)
rfu
(nc)
rfu
(dnu)
rfu
(dnu)
GPIO5
/STATUS
GPIO25
rfu
(dnu)
rfu
(dnu)
rfu
(dnu)
rfu
(dnu)
rfu
(dnu)
GND
rfu
(nc)
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
rfu
(nc)
GND
GND
GND
GND
GND
GND
GND
GND
ANT_
DRX
P
N
M
L
J
H
G
F
D
C
B
A
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
CCIN2
CCCLK2
ANT_GN
SS_DC
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
For internal use:
Not to be soldered
Figure 3: PLSx3 bottom view: Pad assignments
PLSx3_HID_v01.002d
Public / Released
2021-08-24
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marker
t
Cinterion® PLSx3 Hardware Interface Description
2.1 Application Interface
66
Page 21 of 129
P
N
M
L
K
J
H
G
F
E
D
C
A
For internal
B
use: Not to
be soldered
t
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
BATT+BB
TXD0
RXD0
GPIO17
/TXD1
GPIO16
/RXD1
USB_DN
USB_DP
RING0
/
GPIO24
DSR0
/GPIO3
DCD0
/GPIO2
DTR0
/GPIO1
CTS0
EMERG_
RST
BATT+BB
rfu
(dnu)
GND
RTS0
GPIO18
/RTS1
GPIO19
/CTS1
VUSB_
IN
BATT+RF
BATT+RF
rfu
(nc)
CCIN1
ADC1_
IN
ADC2_
IN
ADC3_
IN
GPIO20/
DOUT
GPIO21
/DIN
FSC
BCLK
GND
V180
PWR_IND
GND
GND
IGT
CCCLK1
CCRST1
rfu
(dnu)
rfu
(nc)
SIM_SWITC
H//GPIO26
rfu
(nc)
rfu
(nc)
rfu
(nc)
MCLK
CCVC
C2
rfu
(nc)
GND
GND
GND
GND
VNGSS CCVCC1
CCIO1
rfu
(dnu)
rfu
(nc)
GND
GND
GND
GND
ANT_
MAIN
GPIO13
GPIO14
GPIO15
GND
GND
GND
GND
GND
GPIO6
GPIO12
GPIO4/
FST_SHD
N
GPIO11
GPIO8
GPIO7
GPIO25
rfu
(dnu)
rfu
(dnu)
rfu
(dun)
rfu
(dnu)
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
rfu
(dnu)
rfu
(dnu)
rfu
(nc)
CCRST2 CCIO2
GND
GND
GND
GND
ANT_
GNSS
rfu
(dnu)
rfu
(dnu)
rfu
(nc)
CCCLK2
CCIN2
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
ANT_GN
SS_DC
rfu: Reserved for future use (should not
be connected to external application)
(nc): Internally not connected (may be ar-
bitrarily connected to external GND)
(dnu): Do not use
GND
rfu
(dnu)
rfu
(dnu)
rfu
(nc)
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
Position
marker
GPIO5/
STATUS
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
ANT_
DRX
GND
GND
GND
GND
GND
GND
GND
rfu
(nc)
rfu
(nc)
Figure 3: PLSx3 top view: Pad assignments
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Page 22 of 129
Function
Signal name
IO Signal form and level
Comment
2.1.2
Signal Properties
Table 3: Signal properties (Sheet 1 of 5)
Power
supply
BATT+BB
BATT+RF
I
GSM activated:
VImax = 4.5V
VInorm = 3.8V
VImin = 3.0V
Imax= see Table 19
___|¯¯|____________|¯¯|___
n Tx = n x 577µs peak current every
4.616ms
WCDMA activated:
VImax = 4.5V
VInorm = 3.8V
VImin = 3.0V during Transmit active.
Imax = see Table 20
LTE activated:
VImax = 4.5V
VInorm = 3.8V
VImin = 3.0V during Transmit active.
Imax = see Table 21
V180
O Normal operation:
External
supply
voltage
VOnorm = 1.80V ±2%
IOmax = 10mA
SLEEP mode Operation:
VOSleep = 1.80V ±4%
IOmax = 10mA
CImax = 100nF
VGNSS
O CLmax=2.2μ
VO=3V±2%@IO =-10mA
IOmax = 10mA
VImax_6V
The input current has to be limited to
50mA(antenna short circuit protection)
ANT_GNS-
S_DC
I
Supply volt-
age for
active
GNSS
antenna
Lines of BATT+ and GND
must be connected in par-
allel for supply purposes
because higher peak cur-
rents may occur.
Minimum voltage must not
fall below 3.0V including
drop, ripple, spikes and not
rise above 4.5V.
Note: The module’s nor-
mal voltage range for oper-
ation lies between 3.0V
and 4.5V. For USB opera-
tion, 3.0V-4.5V is also rec-
ommended.
V180 should be used to
supply level shifters at the
interfaces.
Note: V180 is not back
powering protected.
Wrong usage may back
power the module which is
forbidden.
If unused keep line open.
Test point recommended.
Available when GNSS
antenna DC power is
enabled.
If unused connect to GND
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Table 3: Signal properties (Sheet 2 of 5)
Ignition
IGT
I
Function
Signal name
IO Signal form and level
Comment
Do not add any voltage on it. There is
a built-in pull up resister, you can test
about 0.8V voltage on it.
¯¯|___|¯¯ low impulse width > 300ms
This signal switches the
module on. The IGT signal
characteristic is:
Power on triggered and
low level triggered. Fall
time should be <1ms.
Note: To turn on the mod-
ule please use an open-
drain/collector circuit.
Test point recommended.
If unused keep line open.
This line must be driven
low by an open drain or
open collector driver con-
nected to GND.
If unused keep line open.
Test point recommended.
This line must be driven
low.
If unused keep line open.
Note that the fast shut-
down line is originally
available as GPIO line. If
configured as fast shut-
down, the GPIO line is
assigned as follows:
GPIO4 --> FST_SHDN
All electrical characteris-
tics according to USB
Implementers' Forum,
USB 2.0 Specification.
If unused keep lines open.
Test points recommended.
Status
signaling
STATUS
Emer-
gency reset
EMERG_RST I
O VOImax = 0.45V at I = 1mA
VOHmin = 1.35V at I = 1mA
VOHmax = 1.8V
Do not add any voltage on it. There is
a built-in pull up resistor to pull to GND
when Reset.
¯¯|___|¯¯ low impulse width > 200ms
Fast shut-
down
FST_SHDN
I
VILmax = 0.63V
VIHmin = 1.17V
VIHmax = 1.8V
¯¯|___|¯¯ low impulse width > 1ms
USB
VUSB_IN
I
VINmin = 3V
VINmax = 5.25V
Active and suspend current:
Imax<100µA
USB_DN
I/O Full and high speed signal characteris-
USB_DP
tics according to USB 2.0 Specifica-
tion.
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Table 3: Signal properties (Sheet 3 of 5)
Function
Signal name
IO Signal form and level
Comment
Serial
Interface
ASC0
O VOLmax = 0.45V
VOHmin = 1.35V
If unused keep lines open.
Test points recommended
for RXD0, TXD0, RTS0,
and CTS0.
RXD0
CTS0
DSR0
DCD0
RING0
TXD0
RTS0
DTR0
RXD1
CTS1
TXD1
RTS1
Serial Inter-
face ASC1
SIM card
detection
CCIN1
CCIN2
I
I
I
I
I
I
VILmax = 0.63V
VIHmin = 1.17V
VILmax = 0.63V
VIHmin = 1.17V
VILmax = 0.63V
VIHmin = 1.17V
O VOLmax = 0.45V
VOHmin = 1.35V
O
VILmax = 0.63V
VIHmin = 1.17V
VILmax = 0.63V
VIHmin = 1.17V
VIHmin = 1.17V
VILmax = 0.63V
3V SIM
Card Inter-
face
CCRST1
CCRST2
O VOLmax = 0.4V
VOHmin = 2.2V
VOHmax = 3.04V
CCIO1
CCIO2
CCCLK1
CCCLK2
CCVCC1
CCVCC2
I/O VILmax = 0.55V
VIHmin = 2.128V
VIHmax = 3.05V
VOLmax = 0.4V
VOHmin = 2.2V
VOHmax = 3.04V
O VOLmax = 0.4V
VOHmin = 2.2V
VOHmax = 3.04V
O VOmin = 2.75V
VOtyp = 2.85V
VOmax = 3.04V
IOmax = -30mA
If unused keep lines open
Test points recommended
for RXD1, TXD1, RTS1,
and CTS1.
CCIN = low, SIM card
inserted.
CCIN= high, SIM card
removed.
If unused keep line open.
Maximum cable length or
copper track to SIM card
holder should not exceed
100mm.
CCIO2 should add 10k
pull-up to CCVCC2
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Table 3: Signal properties (Sheet 4 of 5)
Function
Signal name
IO Signal form and level
Comment
1.8V SIM
Card Inter-
face
CCRST1
CCRST2
O VOLmax = 0.4V
VOHmin = 1.36V
VOHmax = 1.93V
Maximum cable length or
copper track to SIM card
holder should not exceed
100mm.
CCIO2 should add 10k
pull-up to CCVCC2
CCIO1
CCIO2
CCCLK1
CCCLK2
CCVCC1
CCVCC2
GPIO1-
GPIO8,
GPIO11-
GPIO21
GPIO24-
GPIO26
GPIO
interface
Digital
Audio
Interface
ADC_IN
(Analog-to-
Digital Con-
verter)
BCLK
DIN
DOUT
FSC
MCLK
ADC1
ADC2
ADC3
I/O VILmax = 0.334V
VIHmin = 1.351V
VIHmax = 1.97V
VOLmax = 0.4V
VOHmin = 1.336V
VOHmax = 1.93V
O VOLmax = 0.4V
VOHmin = 1.336V
VOHmax = 1.93V
O VOmin = 1.67V
VOtyp = 1.80V
VOmax = 1.93V
IOmax = -30mA
IO VILmax = 0.334V
VIHmin = 1.351V
VIHmax = 1.97V
VOLmax = 0.4V
VOHmin = 1.336V
VOHmax = 1.93V
VOLmax = 0.45V
VOHmin = 1.35V
VOHmax = 1.8V
VILmax = 0.63V
VIHmin = 1.17V
VIHmax = 1.8V
Freq=12.288MHz
O
I
O
O
O
I
Resolution 15 Bits
Offset error ±1%
VOHmin = 1.336V
VOHmax = 1.93V
RI = 10Mohm
VI = 0.1V ... 1.7V (valid range)
VIH max = 1.7V
If unused keep line open.
SIM Switch SIM_SWITCH O VOLmax = 0.4V
If unused keep line open.
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If unused keep line open.
Please note that most
GPIO lines can be config-
ured by AT command for
alternative functions or are
by default configured with
an alternative functionality:
GPIO4: Fast Shut Down
(Input)
GPIO5: LED status
GPIO26: SIM switch
If unused keep line open.
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Table 3: Signal properties (Sheet 5 of 5)
Function
Signal name
IO Signal form and level
Comment
Power
indicator
PWR_IND
O VIHmax = 5.5V
VOLmax = 0.4V at Imax = 2mA
PWR_IND (Power Indica-
tor) notifies the module’s
on/off state (see Section
2.1.10).
PWR_IND is an open col-
lector that needs to be
connected to an external
pullup resistor. Low state
of the open collector indi-
cates that the module is
on. Vice versa, high level
notifies the power-down
mode. Therefore, the sig-
nal may be used to enable
external voltage regulators
which supply an external
logic for communication
with the module, e.g. level
converters.
Do not connect to V180.
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2.1.2.1
Absolute Maximum Ratings
Page 27 of 129
The absolute maximum ratings stated in Table 4 are stress ratings under any conditions.
Stresses beyond any of these limits will cause permanent damage to PLSx3.
Voltage at digital pins 1.8V domain in normal operation
V180 + 0.2 V
Table 4: Absolute maximum ratings
Parameter
Supply voltage BATT+ (no service)
Voltage at all digital pins in POWER DOWN mode
Voltage at SIM interface, CCVCC 1.8V in normal Operation
Voltage at SIM interface, CCVCC 2.85V in normal Operation
Current at SIM interface in 1.8V and 2.85V operation
Voltage at ADC pin in normal operation
V180 in normal operation
USB-Pins
Min
-0.3
-0.3
-0.2
0
0
0.1
+1.7
-0.3
Max
+5.5
+0.3
+2.16
+3.25
-145
+1.7*
+1.9
3.63
Unit
V
V
V
V
V
V
V
mA
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2.1.3
USB Interface
PLSx3 supports a USB 2.0 High Speed (480Mbit/s) device interface that is Full Speed (12Mbit/
s) compliant. The impedances, serial and pull up resistors are implemented according to “Uni-
versal Serial Bus Specification Revision 2.0”1, No further additional components are required.
The external application is responsible for supplying the VUSB_IN line. This line is used for ca-
ble detection only. The USB part (driver and transceiver) is supplied by means of BATT+. This
is because PLSx3 is designed as a self-powered device compliant with the “Universal Serial
Bus Specification Revision 2.0”.
Module
SMT
VREG (3V075)
lin. reg.
USB part1)
VBUS
DP
DN
Detection only
RS
RS
BATT+
GND
VUSB_IN
USB_DP2)
USB_DN2)
1) All serial (including RS) and pull-up resistors for data lines are implemented.
2) If the USB interface is operated in High Speed mode (480MHz), it is recommended to take
special care routing the data lines USB_DP and USB_DN. Application layout should in this
case implement a differential impedance of 90 ohms for proper signal integrity.
Figure 4: USB circuit
To properly connect the module's USB interface to the external application, a USB 2.0 compat-
ible connector and cable or hardware design is required. For more information on the USB re-
lated signals see Table 3. Furthermore, the USB modem driver distributed with PLSx3 needs
to be installed.
While a USB connection is active, the module will never switch to SLEEP mode. Only if the USB
interface is in Suspend mode, the module is able to switch to SLEEP mode.
1. The specification is ready for download on http://www.usb.org/developers/docs/
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2.1.3.1
Reducing Power Consumption
Page 29 of 129
While a USB connection is active, the module will never switch into SLEEP mode. Only if the
USB interface is in Suspended state or Detached (i.e., VUSB_IN = 0) is the module able to
switch into SLEEP mode thereby saving power. There are two possibilities to enable power re-
duction mechanisms:
• Recommended implementation of USB Suspend/Resume/Remote Wakeup:
The USB host should be able to bring its USB interface into the Suspended state as
described in the “Universal Serial Bus Specification Revision 2.0“1. For this functionality to
work, the VUSB_IN line should always be kept enabled. On incoming calls and other events
PLSx3 will then generate a Remote Wakeup request to resume the USB host controller.
See also [3] (USB Specification Revision 2.0, Section 10.2.7, p.282):
"If USB System wishes to place the bus in the Suspended state, it commands the Host Con-
troller to stop all bus traffic, including SOFs. This causes all USB devices to enter the Sus-
pended state. In this state, the USB System may enable the Host Controller to respond to
bus wakeup events. This allows the Host Controller to respond to bus wakeup signaling to
restart the host system."
•
Implementation for legacy USB applications not supporting USB Suspend/Resume:
As an alternative to the regular USB suspend and resume mechanism it is possible to
employ the RING0 line to wake up the host application in case of incoming calls or events
signalized by URCs while the USB interface is in Detached state (i.e., VUSB_IN = 0). Every
wakeup event will force a new USB enumeration. Therefore, the external application has to
carefully consider the enumeration timings to avoid loosing any signaled events. For details
on this host wakeup functionality see Section 2.1.10.4. To prevent existing data call con-
nections from being disconnected while the USB interface is in detached state (i.e., VUS-
B_IN=0) it is possible to call AT&D0, thus ignoring the status of the DTR line (see also [1]).
1. The specification is ready for download on http://www.usb.org/developers/docs/
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2.1.4
Serial Interface ASC0
Page 30 of 129
PLSx3 offers an 8-wire unbalanced, asynchronous modem interface ASC0 conforming to ITU-
T V.24 protocol DCE signaling. The electrical characteristics do not comply with ITU-T V.28.
The significant levels are 0V (for low data bit or active state) and 1.8V (for high data bit or in-
active state). For electrical characteristics please refer to Table 3.
PLSx3 is designed for use as a DCE. Based on the conventions for DCE-DTE connections it
communicates with the customer application (DTE) using the following signals:
• Port TXD @ application sends data to the module’s TXD0 signal line
• Port RXD @ application receives data from the module’s RXD0 signal line
Figure 5: Serial interface ASC0
Features:
•
Includes the data lines TXD0 and RXD0, the status lines RTS0 and CTS0 and, in addition,
the modem control lines DTR0, DSR0, DCD0 and RING0.
• The RING0 signal serves to indicate incoming calls and other types of URCs (Unsolicited
Result Code). It can also be used to send pulses to the host application, for example to
wake up the application from power saving state.
• Configured for 8 data bits, no parity and 1 stop bit.
• ASC0 can be operated at fixed bit rates from 300bps up to 921600bps.
• Supports RTS0/CTS0 hardware flow control. The hardware hand shake line RTS0 has an
internal pull down resistor causing a low level signal, if the line is not used and open.
Although hardware flow control is recommended, this allows communication by using only
RXD and TXD lines.
• Wake up from SLEEP mode by RTS0 activation (high to low transition; see Section 3.3.4)
Note: The ASC0 modem control lines DTR0, DCD0, DSR0 and RING0 can also be configured
as GPIO lines. If configured as GPIO lines, these GPIO lines are assigned as follows:
GPIO1-->DTR0
GPIO2-->DCD0
GPIO3-->DSR0
GPIO24-->RING0
Configuration is done by AT command (see [1]). The configuration is non-volatile and becomes
active after a module restart.
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Notes: No data must be sent over the ASC0 interface before the interface is active and ready
to receive data (see Section 3.2.1).
The following figure shows the startup behavior of the asynchronous serial interface ASC0.
Start up
Power supply active
Reset
state
Firmware
initialization
Command interface
initialization
Interface
active
ON
VCORE
V180
EMERG_RST
Internal RST
TXD0
RXD0
RTS0
CTS0
DTR0
DSR0
DCD0
RING0
PD
PD
PD
PD
PD
PD
PD
For pull-up and pull-down values see Table 16.
Figure 6: ASC0 startup behavior
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2.1.5
Serial Interface ASC1
Page 32 of 129
Four PLSx3 GPIO lines can be configured as ASC1 interface signals to provide a 4-wire unbal-
anced, asynchronous modem interface ASC1 conforming to ITU-T V.24 protocol DCE signal-
ling. The electrical characteristics do not comply with ITU-T V.28. The significant levels are 0V
(for low data bit or active state) and 1.8V (for high data bit or inactive state). For electrical char-
acteristics please refer to Table 3.
PLSx3 is designed for use as a DCE. Based on the conventions for DCE-DTE connections it
communicates with the customer application (DTE) using the following signals:
• Port TXD @ application sends data to module’s TXD1 signal line
• Port RXD @ application receives data from the module’s RXD1 signal line
Figure 7: Serial interface ASC1
Features
•
Includes only the data lines TXD1 and RXD1 plus RTS1 and CTS1 for hardware hand-
shake.
• On ASC1 no RING line is available.
• Configured for 8 data bits, no parity and 1 or 2 stop bits.
• ASC1 can be operated at fixed bit rates from 300 bps to 921,600bps.
• Supports RTS1/CTS1 hardware flow. The hardware hand shake line RTS1 has an internal
pull down resistor causing a low level signal, if the line is not used and open. Although hard-
ware flow control is recommended, this allows communication by using only RXD and TXD
lines.
Notes: The ASC1 interface lines are originally available as GPIO lines. If configured as ASC1
lines, the GPIO lines are assigned as follows:
GPIO16-->RXD1
GPIO17-->TXD1
GPIO18-->RTS1
GPIO19-->CTS1
Configuration is done by AT command (see [1]). The configuration is non-volatile and becomes
active after a module restart.
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The following figure shows the startup behavior of the asynchronous serial interface ASC1.
Start up
Power supply active
Reset
state
Firmware
initialization
Command interface
initialization
Interface
active
IGT
VCORE
V180
EMERG_RST
Internal RST
TXD1
RXD1
RTS1
CTS1
PD
PD
PD
OH
For pull-down values see Table 16.
Figure 8: ASC1 startup behavior
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2.1.6
UICC/SIM/USIM Interface
Page 34 of 129
PLSx3 has two UICC/SIM/USIM interfaces (includes eSIM interface) compatible with the 3GPP
31.102 and ETSI 102 221. These are wired to the host interface in order to be connected to an
external SIM card holder. Five pads on the SMT application interface are reserved for each of
the two SIM interfaces.
The UICC/SIM/USIM interface supports 3V and 1.8V SIM cards. Please refer to Table 3 for
electrical specifications of the UICC/SIM/USIM interface lines depending on whether a 3V or
1.8V SIM card is used.
The CCINx signal serves to detect whether a tray (with SIM card) is present in the card holder.
Using the CCINx signal is mandatory for compliance with the GSM 11.11 recommendation if
the mechanical design of the host application allows the user to remove the SIM card during
operation. To take advantage of this feature, an appropriate SIM card detect switch is required
on the card holder. See Chapter 7.1 as example for a card holder with an internal switch.
Table 5: Signals of the SIM interface (SMT application interface)
Signal
Description
Ground connection for SIM interfaces. Optionally a separate SIM ground line using e.g.,
pad N11, may be used to improve EMC.
Chipcard clock lines for 1st and 2nd SIM interface.
SIM supply voltage lines for 1st and 2nd SIM interface.
Serial data lines for 1st and 2nd SIM interface, input and output.
Chipcard reset lines for 1st and 2nd SIM interface.
Input on the baseband processor for detecting a SIM card tray in the holder. If the SIM is
removed during operation the SIM interface is shut down immediately to prevent destruc-
tion of the SIM. The CCINx signal is active low.
The CCINx signal is mandatory for applications that allow the user to remove the SIM card
during operation.
The CCINx signal is solely intended for use with a SIM card. It must not be used for any
other purposes. Failure to comply with this requirement may invalidate the type approval of
PLSx3.
Note: No guarantee can be given, nor any liability accepted, if loss of data is encountered after
removing the SIM card during operation. Also, no guarantee can be given for properly initializ-
ing any SIM card that the user inserts after having removed the SIM card during operation. In
this case, the application must restart PLSx3.
By default, only the module’s 1st SIM interface is available and can be used. The usage of the
module’s 2nd SIM interface has to be configured by AT command.
As an alternative to connecting the module’s two SIM interfaces and switching between these via
AT command, it is possible to connect the first of the module’s SIM interfaces via an external SIM
switch that in turn provides access to a further SIM interface. For details see Section 2.1.6.2.
GND
CCCLK1
CCCLK2
CCVCC1
CCVCC2
CCIO1
CCIO2
CCRST1
CCRST2
CCIN1
CCIN2
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Module
1st SIM interface
2nd SIM interface
SIM1
SIM2
.
Figure 9: Module’s two UICC/SIM/USIM interfaces
Figure 10: UICC/SIM/USIM interfaces connected
The total cable length between the SMT application interface pads on PLSx3 and the pads of
the external SIM card holder must not exceed 100mm in order to meet the specifications of
3GPP TS 51.010-1 and to satisfy the requirements of EMC compliance.
To avoid possible cross-talk from the CCCLKx signal to the CCIOx signal be careful that both
lines are not placed closely next to each other. A useful approach is using the GND line to
shield the CCIOx line from the CCCLKx line.
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2.1.6.1
Enhanced ESD Protection for SIM Interface
To optimize ESD protection for the SIM interface it is possible to add ESD diodes (eg.
NUP4114) to the SIM interface lines as shown in the example given in Figure 11. Please place
the ESD protection close to the SIM connector. It is suggested that the cload of diode be less
than 3pF.
The example was designed to meet ESD protection according ETSI EN 301 489-1/7: Contact
discharge: ± 4kV, air discharge: ± 8kV.
Module
CCRST
CCVCC
CCIO
CCCLK
CCIN
SIM_RST
SIM_VCC
SIM_IO
6
5
4
1
2
3
GND
SIM_CLK
SIM_DET
Keep SIM lines low capacitative
Figure 11: SIM interface - enhanced ESD protection
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2.1.6.2
SIM_SWITCH Line
As an alternative to connecting the module’s two SIM interfaces and switching between these
interfaces by means of AT command, it is possible to connect the first of the module’s SIM in-
terfaces via an external SIM switch that in turn provides access to a further SIM interface.
Module
1st SIM interface
GPIO26/
SIM_SWITCH
Switch
SIM1A
SIM1B
Figure 12: External UICC/SIM/USIM switch
The module’s GPIO26 line can in this case be configured as SIM_SWITCH line in order to con-
trol the external SIM switch as shown in the sample circuit in Figure 13. A low state would then
indicate the usage of the first SIM interface (SIM1A), a high state would indicate the usage of
the second interface (SIM1B).
The configuration of the SIM_SWITCH (GPIO26) line is done via AT command, is non-volatile,
and available after the next module restart.
External Application
Module
SIM1A
ESD
protection
IF1
Sim Switch
COMMON
SIMSELECT
FSA2567
ESD
protection
IF2
SIM1B
VBAT
10k
22k
100k
VSIM1
CCCLK1
CCIO1
CCRST1
SIM_
SWITCH
CCIN1
Figure 13: Sample circuit for SIM interface connection via SIM switch
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2.1.7
GPIO Interface
PLSx3 offers a GPIO interface with 22 GPIO lines. The GPIO lines are shared with other inter-
faces or functions: Fast shutdown (see Section 2.1.10.3), Status LED (see Section 2.1.10.1),
ASC0 (see Section 2.1.4), ASC1 (see Section 2.1.5) and SIM Switch (see Section 2.1.6.2)
The following table shows the configuration variants for the GPIO pads. All variants are mutu-
ally exclusive, i.e. a pad configured for instance as Status LED is locked for alternative usage.
Table 6: GPIO lines and possible alternative assignment
Fast
Shutdown
Status LED
ASC0
ASC1
SIM
SWITCH
DAI
DTR0
DCD0
DSR0
FST_SHDN
Status LED
RXD1
TXD1
RTS1
CTS1
RING0
DOUT
DIN
SIM_SWITCH
GPIO
GPIO1
GPIO2
GPIO3
GPIO4
GPIO5
GPIO6
GPIO7
GPIO8
GPIO11
GPIO12
GPIO13
GPIO14
GPIO15
GPIO16
GPIO17
GPIO18
GPIO19
GPIO20
GPIO21
GPIO24
GPIO25
GPIO26
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The following figure shows the startup behavior of the GPIO interface.
Start up
Power supply active
Reset State
Firmware
Initialization
Command Interface
Initialization
Interface Active
IGT
VCORE
V180
EMERG_RST
Internal Reset
GPIO1,4,5,6
GPIO3
GPIO2,16
GPIO7,8,11-15
GPIO17-18
GPIO19
GPIO20,26
GPIO21,24
PD
Low
PD
PD
PD
OH
PU
PD
Figure 14: GPIO startup behavior
PD
PD
PD
PD
PD
PD
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2.1.8
Digital Audio Interface
Page 40 of 129
PLSx3 supports the digital audio interface that can be deployed as PCM or Inter_IC Sound
(I2S).
2.1.8.1
Pulse Code Modulation Interface
PLSx3’s PCM interface can be used to connect audio devices capable of pulse code
modulation. The PCM functionality is limited to the use of wideband codec with 16kHz sample
rate only. The PCM interface runs at 16 kHz sample rate (62.5μs frame length), while the
signal processing maintains this rate in a wideband AMR call or samples automatically down
to 8kHz in a narrowband call. Therefore, the PCM sample rate is independent of the audio
bandwidth of the call.
The PCM interface has the following characteristics:
• Master mode
•
•
•
•
Table 7 lists the available PCM interface signals.
Long frame synchronization
16kHz/8kHz sample rate
256, 512, 1024 and 4096kHz bit clock at 16kHz sample rate
256, 512, and 2048kHz bit clock at 8kHz sample rate
Table 7: Overview of PCM pin functions
Signal name
Signal direction
master
Description
DOUT
DIN
FSC
BCLK
MCLK
O
I
O
O
-
PCM Data from PLSx3 to external codec.
PCM Data from external codec to PLSx3.
Frame synchronization signal to external codec.
Bit clock to external codec. Note: If the BCLK signal is
permanently
provided (AT^SAIC parameter <clk_mode> = 0), the
module will no
longer enter its power save (SLEEP) state.
Audio master clock. Be synchronous to BCLK to use in
external codec. Can be switched on and off.
Note: PCM data is always formatted as 16-bit uncompressed two’s complement. Also, all
PCM data and frame synchronization signals are written to the PCM bus on the rising clock
edge and read on the falling edge.
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The following figure shows an example of short frame PCM timing at 8kHz sample rate and
2048kHz PCM_CLK in the master mode:
125 µs
PCMx_CLK
PCMx_SYNC
PCMx_OUT
MSB
14
13
12
PCMx_IN
MSB
14
13
12
2
2
1
1
LSB
LSB
MSB
MSB
Figure 15: PCM timing short frame
2.1.8.2
Inter-IC Sound Interface
The I2S Interface is a standardized bidirectio zonal I2S based digital audio interface for trans-
mission of mono voice signals for telephony services.
The I2S properties and capabilities comply with the requirements lay out in the Phillips I2S
Bus Specifications, revised June 5, 1996.
The I2S interface has the following characteristics:
• Bit clock mode: Master
• Sampling rate: 8kHz (narrowband), 16kHz (wideband)
•
•
256kHz bit clock at 8kHz sample rate
512kHz bit clock at 16kHz sample rate
Table 8 lists the available I2S interface signals
.
Table 8: Overview of I2S pin functions
Signal name on
SMT application
interface
Signal configura-
tion inactive
Signal direction
Master
Description
DOUT
DIN
FSC
BCLK
PD
PD
PD
PD
O
I
O
O
I2S data from PLSx3 to external
codec
I2S data from external codec to
PLSx3
Frame synchronization signal to
external codec Word alignment
(WS)
Bit clock to external codec.
BCLK signal low/high time varies
between 45% and 55% of its clock
period.
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2.1.9
Analog-to-Digital Converter (ADC)
Page 42 of 129
PLSx3 provides three unbalanced ADC input line: ADC[1...3]_IN. They can be used to mea-
sure three independent, externally connected DC voltages in the range of 0.1V to 1.7V. They
can be used especially for antenna diagnosing.
The AT^SRADC command can be employed to select the ADC line, set the measurement
mode and read out the measurement results.
2.1.10 Control Signals
2.1.10.1
Status LED
The GPIO5 interface line can be configured to drive a status LED that indicates different oper-
ating mode (for GPIOs see 2.1.7). GPIO and LED functionality are mutually exclusive.
To take advantage of this function connect an LED to the GPIO5/STATUS line as shown in
Figure 16
VCC
LED
R3
STATUS
R1
R2
GND
GND
Figure 16: Status signaling with LED driver
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2.1.10.2
Power Indication
The power indication signal PWR_IND notifies the on/off state of the module. High state of
PWR_IND indicates that the module is switched off. The state of PWR_IND immediately
changes to low when IGT is pulled low. For state detection an external pull-up resistor is re-
quired.
Module
Power supply
On/Off
(open drain
driver)
e.g. BATT+
e
c
a
f
r
e
t
n
i
T
M
S
PWR_IND
Figure 17: Power indication signal
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2.1.10.3
Fast Shutdown
The GPIO4 interface line can be configured as fast shutdown signal line FST_SHDN. The con-
figured FST_SHDN line is an active low control signal and must be applied for at least 1 milli-
seconds. If unused this line can be left open because of a configured internal pull-up resistor.
Before setting the FST_SHDN line to low, the IGT signal should be set to high (see Figure 18).
The fast shutdown feature can be triggered using the AT command AT^SMSO=<fso>. For de-
tails see [1].
If triggered, a low impulse >1 milliseconds on the FST_SHDN line starts the fast shutdown. The
fast shutdown procedure still finishes any data activities on the module's flash file system, thus
ensuring data integrity, but will no longer deregister gracefully from the network, thus saving
the time required for network deregistration.
Switch off procedure
fast shut down
BATT+BB
BATT+RF
IGT
EMERG_RST
Internal Reset
V180
PWR_IND
GPIO4/AT^SMSO=<fso>
(Fast Shut Down)
< 15ms
Active low
Open Collector
High Z
Figure 18: Fast shutdown timing
Please note that the normal software controlled shutdown using AT^SMSO will allow option for
a fast shutdown by parameter <fso>, i.e., without network deregistration. However, in this case
no URCs including shutdown URCs will be provided by the AT^SMSO command.
Please also note that the fast shutdown operation does not allow the module deregister from
the network, therefore, this practice is not recommended, and should not be conducted on reg-
ular basis. If it is used for energy saving reason, for instance, used in battery-driven solutions
that require prompt system shutdown before battery depletion, discretion is advised in such
case.
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2.1.10.4
Remote Wakeup
If no call, data or message transfer is in progress, the external host application may shut down
its own module interfaces or other components in order to save power. If a call, data, or other
request (URC) arrives, the external application can be notified of this event and be woken up
again by a state transition of a configurable remote wakeup line. Available as remote wakeup
lines are some GPIO signals (recommended is GPIO24). Please refer to [1]: AT^SCFG: "Re-
moteWakeUp/..." for details on how to configure these lines for defined wakeup events on
specified device interfaces. Possible states are listed in Table 9.
If no line is specifically configured as remote wakeup signal, the remote USB suspend and re-
sume mechanism as specified in the “Universal Serial Bus Specification Revision 2.0” applies
for the USB interface (see Section 2.1.3). Possible states for the remote wakeup GPIO lines
are listed in Table 9.
Table 9: Remote wakeup lines
Signal
GPIOx
I/O/P
O
Description
Inactive to active high transition:
0 = No wake up request
1 = The host shall wake up
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2.2
RF Antenna Interface
Page 46 of 129
The PLSx3 GSM/UMTS/LTE antenna interface comprises a GSM/UMTS/LTE main antenna as
well as a UMTS/LTE Rx diversity antenna to improve signal reliability and quality1. The RF in-
terface has an impedance of 50Ω. PLSx3 is capable of sustaining a total mismatch at the an-
tenna line without any damage, even when transmitting at maximum RF power.
The external antenna must be matched properly to achieve best performance regarding radi-
ated power, modulation accuracy and harmonic suppression. Antenna matching networks are
not included on the PLSx3 module and should be placed in the host application if the antenna
does not have an impedance of 50Ω.
Regarding the return loss PLSx3 provides the following values in the active band:
Table 10: Return loss in the active band
State of module
Return loss of module
Recommended return loss of application
Receive
Transmit
> 8dB
not applicable
> 12dB
> 12dB
1. By delivery default the UMTS/LTE Rx diversity antenna is configured as available for the module since
its usage is mandatory for LTE. Please refer to [1] for details on how to configure antenna settings.
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2.2.1
Antenna Interface Specifications
Page 47 of 129
Table 11: RF Antenna interface GSM/UMTS/LTE
Parameter
Conditions
Min.
Typical Max.
Unit
LTE connectivity
Band 1,2,3,4,5,7,8,12,13,14,17,18,19,20,25,26,28,38,40,41,66,71
Receiver Input Sensitivity
@ARP, Combined Antenna,
Channel BW at 5 MHz
@25°C, 3.8V
LTE FDD 1900 Band 2
LTE FDD 1800 Band 3
LTE FDD 2100 Band 1
-100.0
-104.3
LTE FDD 2100 Band 4
-100.0
-104.1
-98.0
-97.0
-98.0
-98.0
-97.0
-97.0
-97.0
TBD
-97.0
-98.0
-104.7
-104.3
-103.4
-102.2
-104.1
-104.8
-105.0
TBD
-104.4
-103.3
LTE FDD 850 Band 5
LTE FDD 2600 Band 7
LTE FDD 900 Band 8
LTE FDD 700 Band 12
LTE FDD 700 Band 13
LTE FDD 700 Band 14
LTE FDD 700 Band 17
LTE FDD 850 Band 18
LTE FDD 850 Band 19
-100.0
-102.7
LTE FDD 800 Band 20
-97.0
-104.5
LTE FDD 1900 Band 25
TBD
TBD
LTE FDD 850 Band 26
LTE FDD 700 Band 28
-98.0
-98.5
-103.1
-104.9
LTE TDD 2600 Band 38
-100.0
-103.6
LTE TDD 2300 Band 40
-100.0
-104.6
LTE TDD 2500 Band 41
-98.0
LTE FDD 2100 Band 66
-99.5
-103.5
-104.0
LTE FDD 600 Band 71
TBD
TBD
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
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Table 11: RF Antenna interface GSM/UMTS/LTE
Parameter
Conditions
Min.
Typical Max.
RF Power @ARP with 50Ω
Load (Board
temperature<85°C, 5 MHz
BW, 1RB Position Low)
LTE FDD 2100 Band 1
LTE FDD 1900 Band 2
LTE FDD 1800 Band 3
LTE FDD 2100 Band 4
LTE FDD 850 Band 5
LTE FDD 2600 Band 7
LTE FDD 900 Band 8
LTE FDD 700 Band 12
LTE FDD 700 Band 13
LTE FDD 700 Band 14
LTE FDD 700 Band 17
LTE FDD 850 Band 18
LTE FDD 850 Band 19
LTE FDD 800 Band 20
LTE FDD 1900 Band 25
LTE FDD 850 Band 26
LTE FDD 700 Band 28
LTE TDD 2600 Band 38
LTE TDD 2300 Band 40
LTE TDD 2500 Band 41
LTE FDD 2100 Band 66
LTE FDD 600 Band 71
+21
+21
+21
+21
+21
+21
+21
+21
+21
+21
+21
+21
+21
+21
+21
+21
+21
+21
+21
+21
+21
+21
+23.0
+23.0
+23.0
+23.0
+23.0
+22.5
+23.0
+23.0
+23.0
+23.0
+23.0
+23.0
+23.0
+23.0
+23.0
+23.0
+23.0
+23.0
+23.0
+23.0
+23.0
+23.0
Unit
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
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Table 11: RF Antenna interface GSM/UMTS/LTE
Parameter
Conditions
Min.
Typical Max.
Unit
UMTS connectivity
Band I,II,III, IV,V,VI,VIII,XIX
Receiver Input Main Sensi-
tivity @ ARP @25°C, 3.8V
UMTS 2100 Band I
-106.7
-110.2
UMTS 1900 Band II
-104.7
-111.3
Receiver Input Diversity
Sensitivity @ ARP @25°C,
3.8V
RF Power @ ARP with
50Ohm Load
Board temperature < 85°C
UMTS 1800 Band III
-103.7
-110.6
UMTS 2100 Band IV
-106.7
-110.3
UMTS 850 Band V
-104.7
-110.9
UMTS 850 Band VI
-106.7
-110.2
UMTS 900 Band VIII
-103.7
-110.5
UMTS 850 Band XIX
-106.7
-110.5
UMTS 2100 Band I
-106.7
-111.5
UMTS 1900 Band II
-104.7
-111.6
UMTS 1800 Band III
-103.7
-112.1
UMTS 2100 Band IV
-106.7
-111.8
UMTS 850 Band V
-104.7
-112.0
UMTS 850 Band VI
-106.7
-111.3
UMTS 900 Band VIII
-103.7
-111.8
UMTS 850 Band XIX
-106.7
-111.1
UMTS 2100 Band I
UMTS 1900 Band II
UMTS 1800 Band III
UMTS 1700 Band IV
UMTS 850 Band V
UMTS 850 Band VI
UMTS 900 Band VIII
UMTS 850 Band XIX
Small MS
GSM 850
E-GSM 900
DCS 1800
PCS 1900
GSM 850
E-GSM 900
DCS 1800
PCS 1900
+21
+21
+21
+21
+21
+21
+21
+21
+23.5
+23.5
+23.5
+23.5
+23.5
+23.5
+23.5
+23.5
-102.0
-108.6
-102.0
-108.9
-102.0
-109.6
-102.0
-109.6
33
33
30
30
GPRS coding schemes
Class 12, CS1 to CS4
Class 12, MCS1 to MCS9
EGPRS
GSM Class
Static Receiver input Sensi-
tivity @ ARP
RF Power @ ARP
with 50Ohm Load
Board temperature < 85°C
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
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Table 11: RF Antenna interface GSM/UMTS/LTE
Parameter
Conditions
Min.
Typical Max.
RF Power @ ARP
with 50Ohm Load,
(ROPR = 4, i.e. no reduction)
GPRS, 1 TX GSM 850
EDGE, 1 TX
GSM 850
GPRS, 2 TX GSM 850
EDGE, 2 TX
GSM 850
GPRS, 3 TX GSM 850
EDGE, 3 TX
GSM 850
GPRS, 4 TX GSM 850
E-GSM 900
DCS 1800
PCS 1900
E-GSM 900
DCS 1800
PCS 1900
E-GSM 900
DCS 1800
PCS 1900
E-GSM 900
DCS 1800
PCS 1900
E-GSM 900
DCS 1800
PCS 1900
E-GSM 900
DCS 1800
PCS 1900
E-GSM 900
DCS 1800
PCS 1900
E-GSM 900
DCS 1800
PCS 1900
EDGE, 4 TX
GSM 850
33
33
30
30
27
27
26
26
33
33
30
30
27
27
26
26
33
33
30
30
27
27
26
26
33
33
30
30
27
27
26
26
Unit
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
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Table 11: RF Antenna interface GSM/UMTS/LTE
Parameter
Conditions
Min.
Typical Max.
RF Power @ ARP
with 50Ohm Load,
(ROPR =5, i.e. partial reduc-
tion)
GPRS, 1 TX GSM 850
EDGE, 1 TX
GSM 850
GPRS, 2 TX GSM 850
EDGE, 2 TX
GSM 850
GPRS, 3 TX GSM 850
EDGE, 3 TX
GSM 850
GPRS, 4 TX GSM 850
EDGE, 4 TX
GSM 850
E-GSM 900
DCS 1800
PCS 1900
E-GSM 900
DCS 1800
PCS 1900
E-GSM 900
DCS 1800
PCS 1900
E-GSM 900
DCS 1800
PCS 1900
E-GSM 900
DCS 1800
PCS 1900
E-GSM 900
DCS 1800
PCS 1900
E-GSM 900
DCS 1800
PCS 1900
E-GSM 900
DCS 1800
PCS 1900
33
33
30
30
27
27
26
26
33
33
30
30
27
27
26
26
27
27
26
26
31
31
28
28
27
27
26
26
32.2
32.2
29.2
29.2
Unit
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
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Table 11: RF Antenna interface GSM/UMTS/LTE
Parameter
Conditions
Min.
Typical Max.
RF Power @ ARP
with 50Ohm Load,
(ROPR = 6, i.e. partial reduc-
tion)
GPRS, 1 TX GSM 850
EDGE, 1 TX
GSM 850
GPRS, 2 TX GSM 850
EDGE, 2 TX
GSM 850
GPRS, 3 TX GSM 850
EDGE, 3 TX
GSM 850
GPRS, 4 TX GSM 850
EDGE, 4 TX
GSM 850
E-GSM 900
DCS 1800
PCS 1900
E-GSM 900
DCS 1800
PCS 1900
E-GSM 900
DCS 1800
PCS 1900
E-GSM 900
DCS 1800
PCS 1900
E-GSM 900
DCS 1800
PCS 1900
E-GSM 900
DCS 1800
PCS 1900
E-GSM 900
DCS 1800
PCS 1900
E-GSM 900
DCS 1800
PCS 1900
33
33
30
30
27
27
26
26
32
32
29
29
27
27
26
26
27
27
26
26
29
29
26
26
27
27
26
26
30.2
30.2
27.2
27.2
Unit
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
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Table 11: RF Antenna interface GSM/UMTS/LTE
Parameter
Conditions
Min.
Typical Max.
RF Power @ ARP
with 50Ohm Load,
(ROPR = 7, i.e. partial reduc-
tion)
GPRS, 1 TX GSM 850
EDGE, 1 TX
GSM 850
GPRS, 2 TX GSM 850
EDGE, 2 TX
GSM 850
GPRS, 3 TX GSM 850
EDGE, 3 TX
GSM 850
GPRS, 4 TX GSM 850
EDGE, 4 TX
GSM 850
E-GSM 900
DCS 1800
PCS 1900
E-GSM 900
DCS 1800
PCS 1900
E-GSM 900
DCS 1800
PCS 1900
E-GSM 900
DCS 1800
PCS 1900
E-GSM 900
DCS 1800
PCS 1900
E-GSM 900
DCS 1800
PCS 1900
E-GSM 900
DCS 1800
PCS 1900
E-GSM 900
DCS 1800
PCS 1900
33
33
30
30
27
27
26
26
30
30
27
27
27
27
26
26
27
27
26
26
27
27
24
24
27
27
26
26
28.2
28.2
25.2
25.2
Unit
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
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Table 11: RF Antenna interface GSM/UMTS/LTE
Parameter
Conditions
Min.
Typical Max.
RF Power @ ARP
with 50Ohm Load,
(ROPR = 8, i.e. max reduc-
tion)
GPRS, 1 TX GSM 850
EDGE, 1 TX
GSM 850
GPRS, 2 TX GSM 850
EDGE, 2 TX
GSM 850
GPRS, 3 TX GSM 850
EDGE, 3 TX
GSM 850
GPRS, 4 TX GSM 850
EDGE, 4 TX
GSM 850
E-GSM 900
DCS 1800
PCS 1900
E-GSM 900
DCS 1800
PCS 1900
E-GSM 900
DCS 1800
PCS 1900
E-GSM 900
DCS 1800
PCS 1900
E-GSM 900
DCS 1800
PCS 1900
E-GSM 900
DCS 1800
PCS 1900
E-GSM 900
DCS 1800
PCS 1900
E-GSM 900
DCS 1800
PCS 1900
33
33
30
30
27
27
26
26
30
30
27
27
24
24
23
23
28.2
28.2
25.2
25.2
22.2
22.2
21.2
21.2
27
27
24
24
21
21
20
20
Unit
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
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Table 12: RF Antenna interface LTE for -J variant (at operating temperature range)
Parameter
Condition
Min.
Typical Max.
Unit
LTE connectivity
Band 1,3,8,18,19,26
Receiver Input Sensitivity
@ARP, Combined Antenna,
Channel BW at 10MHz
@25°C, 3.8V
LTE FDD 2100 Band 1
LTE FDD 1800 Band 3
LTE FDD 900 Band 8
LTE FDD 850 Band 18
LTE FDD 850 Band 19
LTE FDD 850 Band 26
-102.2
-102.2
-101.9
-101
-100.3
-100.8
dBm
dBm
dBm
dBm
dBm
dBm
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2.2.2
Antenna Installation
The antenna is connected by soldering the antenna pads (ANT_MAIN, ANT_DRX and
ANT_GNSS) and their neighboring ground pads directly to the application’s PCB.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
K ANT_
MAIN
GND
GND
GND
E ANT_
GNSS
GND
P
N
M
L
J
H
G
F
D
C
B
A
GND
ANT_
DRX
GND
Figure 19: Antenna pads (bottom view)
The distance between the antenna pads and their neighboring GND pads has been optimized
for best possible impedance. To prevent mismatch, special attention should be paid to these
pads on the application’ PCB.
The wiring of the antenna connection, starting from the antenna pad to the application’s anten-
na should result in a 50Ω line impedance. Line width and distance to the GND plane need to
be optimized with regard to the PCB’s layer stack. Some examples are given in Section 2.2.3.
To prevent receiver desensitization due to interferences generated by fast transients like high
speed clocks on the external application PCB, it is recommended to realize the antenna con-
nection line using embedded Stripline rather than Micro-Stripline technology. Please see Sec-
tion 2.2.3 for examples of how to design the antenna connection in order to achieve the
required 50Ω line impedance.
For type approval purposes, the use of a 50Ω coaxial antenna connector (U.FL-R-SMT) might
be necessary. In this case the U.FL-R-SMT connector should be placed as close as possible
to PLSx3‘s antenna pad.
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2.2.3
RF Line Routing Design
2.2.3.1
Line Arrangement Examples
Page 57 of 129
Several dedicated tools are available to calculate line arrangements for specific applications
and PCB materials - for example from http://www.polarinstruments.com/ (commercial software)
or from http:www.awr.com/awr-software/options/tx-line/ (free software).
Embedded Stripline
This figure below shows a line arrangement example for embedded stripline.
Figure 20: Embedded stripline arrangement example
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Micro-Stripline
This section gives two line arrangement examples for micro-stripline.
Figure 21: Micro-Stripline arrangement example
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2.2.3.2
Routing Example
Interface to RF Connector
Figure 22 and Figure show a sample connection of a module‘s antenna pad at the bottom layer
of the module PCB with an application PCB‘s coaxial antenna connector. Line impedance de-
pends on line width, but also on other PCB characteristics like dielectric, height and layer gap.
The sample stripline width of 0.33mm/0.8mm and the space of 0.625mm/0.173mm are
only recommended for an application with a PCB layer stack resembling the one of the PLSx3
evaluation board, and with layer 2 as well as layer 3 cut clear. For different layer stacks the
stripline width will have to follow stripline routing rules, avoiding 90 degree comers and using
the shortest distance to the PCB’s coaxial antenna connector.
G N D
G N D
e.g.
ANT_
TRX1
Stripline (50 ohms) on top
layer of evaluation board from
antenna pad to module edge
Width = 0.33 mm
Ground connection
Edge of module PCB
50 ohms microstrip line
E.g., U.FL antenna
connector
G N D
G N D
Figure 22: Routing to application‘s RF connector
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Figure 23: Routing Detail
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2.3
GNSS Antenna Interface
2.3.1
GNSS Receiver
PLSx3 integrates a GNSS receiver that offers the full performance of GPS/GLONASS/BeiDou/
Galileo technology. The GNSS receiver is able to continuously track all satellites in view, thus
providing accurate satellite position data.
The integrated GNSS receiver supports the NMEA protocol. NMEA is a combined electrical
and data specification for communication between various (marine) electronic devices includ-
ing GNSS receivers. It has been defined and controlled by the US based National Marine Elec-
tronics Association. For more information on the NMEA Standard please refer to http://
www.nmea.org.
Depending on the receiver’s knowledge of last position, current time and ephemeris data, the
receiver’s startup time (i.e., TTFF = Time-To-First-Fix) may vary: If the receiver has no knowl-
edge of its last position or time, a startup takes considerably longer than if the receiver still has
knowledge of its last position, time and almanac or has still access to valid ephemeris data and
the precise time. For more information see Section 2.3.4. Often, 2D measurements will be used
over 3D depending on space vehicle (SV) locations as this will be just as accurate and faster.
By default, the GNSS receiver is switched off. It has to be switched on and configured using
AT commands (AT^SGPSC; see[1]).
2.3.2
GNSS Antenna
In addition to the RF antenna interface PLSx3 also has a GNSS antenna interface. See Section
2.1.1 to find out where the GNSS antenna pad is located. The GNSS pad’s shape is the same
as for the RF antenna interface (see Section 2.2.2).
It is possible to connect active or passive GNSS antennas. In either case they must have 50Ω
impedance. The simultaneous operation of GSM/UMTS/LTE and GNSS is implemented. For
electrical characteristics see Section 2.2.
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PLSx3 provides the signal VGNSS to enable an active GNSS antenna power supply. Figure 24
shows the flexibility in realizing the power supply for an active GNSS antenna by giving a sam-
ple circuit realizing the supply voltage for an active GNSS antenna.
Module
Application:
GNSS
Receiver
Antenna
Matching
ANT_GNSS
ANT_GNSS_DC
RF
DC
DC
LNA
Active GNSS
Antenna
BATT+
VGNSS
(3.2V)
VGNSS
IN OUT
EN
LDO
LP3985IM5-3.2
Rs
Is
1R0
Rv
100
-
+
Io
Current Sensor
FAN4010
Io
Rg
3k3
ADCx_IN
Si1023X_1
10k
1u
ESD
Protection
Si1023X_2
10k
Ug
Figure 24: Supply voltage for active GNSS antenna
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Figure 25 shows a sample circuit realizing ESD protection for a passive GNSS antenna. Con-
necting the input ANT_GNSS_DC to GND prevents ESD from coupling into the module.
Module
SMT interface
VGNSS
Not used
100nF
22pF
ANT_GNSS_DC
12nH
ANT_GNSS
To GNSS
receiver
(Optional)
ESD
protection
0R
Passive
GNSS
antenna
Figure 25: ESD protection for passive GNSS antenna
2.3.3
GNSS Antenna Diagnostic
GNSS antenna diagnosis does require an external detection circuit. The antenna DC supply
current can be measured via ADCx_IN. The ADCx_IN input voltage (Ug) may be generated by
a sample circuit shown in Figure 24. The circuit allows to check the presence and the connec-
tion status of an active GNSS antenna. Passive GNSS antennas cannot be detected. There-
fore, GNSS antenna detection is only available in active GNSS antenna mode. This mode is
configured by the AT command: AT^SGPSC (for details see [1])
Having enabled the active GNSS antenna mode the presence and connection status of an ac-
tive GNSS antenna can be checked using the AT command AT^SRADC to monitor ADCx_IN.
The following table lists sample current ranges for possible antenna states as well as sample
voltage ranges as possible decision thresholds to distinguish between the antenna connection
states. Please refer to [1] for more information on the command AT^SRADC.
Table 13: Sample ranges of the GNSS antenna diagnostic measurements and their possible meaning
Antenna connection status
Antenna not connected
Decision threshold
Antenna connected
Decision threshold
Current ranges (IS)1
<1.4mA
Voltage ranges (UG)
2.2mA...20mA
59mV ±20%
825mV ±20%
Antenna short circuited to ground
>30mA
GNSS antenna detection is not possible because
GNSS antenna power supply is switched off.
--
1. Please note that the mA ranges 1.4mA...2.2mA and 20mA...30mA are tolerance ranges. The decision
threshold should be defined within these ranges.
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2.3.4
GNSS Antenna Interface Characteristics
Table 14: GNSS properties
Parameter
Frequency
Conditions
GPS
GLONASS
Tracking Sensitivity
Open sky (active antenna or LNA):
Min.
Typical Max.
1574.4
1575.42
1576.4
1597.5
1602
1605.9
Acquisition Sensitivity Open sky (active antenna or LNA):
GPS
GPS
GPS
GPS
Open sky (active antenna or LAN):
GLONASS
Open sky (passive antenna):
Open sky (passive antenna):
GLONASS
Open sky (active antenna or LNA):
GLONASS
Open sky (passive antenna):
Open sky (passive antenna):
GLONASS
Warm (average at -130dBm)
Cold (average at -130dBm)
-159
-158
-156
-156
-147
-146
-145
-144
28
32
Time-to-First-Fix
(TTFF)1
1. Open sky environment
Note: For PLSx3-W modules, if GNSS works together with LTE Band13 in the field, to avoid
Band13 second harmonic interfere GNSS sensitivity in the worst LET network condition,
please design the GNSS antenna at least 20dB decoupling with LTE main antenna and use
the extra LNA for GNSS.
Unit
MHz
dBm
dBm
s
s
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2.4
Sample Application
Figure 26 shows a typical example of how to integrate a PLSx3 module with an application.
Usage of the various host interfaces depends on the desired features of the application.
Because of the very low power consumption design, current flowing from any other source into
the module circuit must be avoided, for example reverse current from high state external control
lines. Therefore, the controlling application must be designed to prevent reverse current flow.
Otherwise there is the risk of undefined states of the module during startup and shutdown or
even of damaging the module.
Because of the high RF field density inside the module, it cannot be guaranteed that no self
interference might occur, depending on frequency and the applications grounding concept. The
potential interferers may be minimized by placing small capacitors (47pF) at suspected lines
(e.g. RXD0, VDDLP, and ON).
While developing SMT applications it is strongly recommended to provide test points
for certain signals, i.e., lines to and from the module - for debug and/or test purposes.
The SMT application should allow for an easy access to these signals. For details on
how to implement test points see [4].
The EMC measures are best practice recommendations. In fact, an adequate EMC strategy for
an individual application is very much determined by the overall layout and, especially, the po-
sition of components. For example, mounting the internal acoustic transducers directly on the
PCB eliminates the need to use the ferrite beads shown in the sample schematic.
Disclaimer
No warranty, either stated or implied, is provided on the sample schematic diagram shown in
Figure 26 and the information detailed in this section. As functionality and compliance with na-
tional regulations depend to a great amount on the used electronic components and the indi-
vidual application layout manufacturers are required to ensure adequate design and operating
safeguards for their products using PLSx3 modules.
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BATT+_DSB
0R
(cid:39)(cid:72)(cid:70)(cid:82)(cid:88)(cid:83)(cid:79)(cid:76)(cid:81)(cid:74)(cid:3)
(cid:70)(cid:68)(cid:83)(cid:68)(cid:70)(cid:76)(cid:87)(cid:82)(cid:85)(cid:86)
(cid:72)(cid:17)(cid:74)(cid:17)(cid:3)(cid:20)(cid:19)(cid:19)(cid:541)(cid:41)(cid:3)(cid:48)(cid:47)(cid:38)(cid:38)
(cid:59)(cid:24)(cid:53)
V180
(cid:39)(cid:72)(cid:70)(cid:82)(cid:88)(cid:83)(cid:79)(cid:76)(cid:81)(cid:74)(cid:3)
(cid:70)(cid:68)(cid:83)(cid:68)(cid:70)(cid:76)(cid:87)(cid:82)(cid:85)(cid:86)
(cid:72)(cid:17)(cid:74)(cid:17)(cid:3)(cid:20)(cid:19)(cid:19)(cid:541)(cid:41)(cid:3)(cid:48)(cid:47)(cid:38)(cid:38)
(cid:59)(cid:24)(cid:53)
PLSx3
BATT+BB
BATT+RF
V180
EMERG_RST
Main antenna
Diversity antenna
GNSS antenna
ANT_MAIN
ANT_DRX
GND
GND
GND
GND
GND
GND
ANT_GNSS
GND
IGT
ANT_GNSS_DC
ANT_GNSS_DC
*For more details see
Section 5.2 GNSS Antenna Interface
100nF
47k
47k
2
2
33pF
(cid:37)(cid:38)(cid:27)(cid:23)(cid:26)
(cid:37)(cid:38)(cid:27)(cid:23)(cid:26)
GND
E.g., VBATT
E.g., 100k
Power Indicator
PWR_IND
CCVCC1
USB
USB interface*
*For more details
see(cid:3)Section 2.1.3
USB Interface
3
8
4
5
3
ACS0
ACS1
ADC
Status
Serial Interface
Serial Interface
ADC input interface
Status
LED
CCIO1
Digital Audio
PCM(I2S) Interface&MCLK
CCVCC1
k
0
1
CCCLK1
CCRST1
CCIN1
SIM1
GND
SIM2
GND
F
n
1
F
p
0
1
F
p
0
1
F
n
0
2
2
GND
GND
GND
GND
CCVCC2
k
0
1
CCVCC2
CCIO2
CCCLK2
CCRST2
CCIN2
F
n
1
F
p
0
1
F
p
0
1
F
n
0
2
2
GND
GND
GND
GND
GND
FST_SHDN
Fast shutdown
SIM_SWITCH
SIM Switch
GPIO
GPIO*
V180
k
2
.
2
k
2
.
2
I2CCLK
I2CDAT
GND
*When has the
function(cid:3)of GPIO
multiplexing PADs,
used as GPIO(cid:3)function,
need through the SW
switch(cid:3)command.
Figure 26: Schematic diagram of PLSx3 sample application
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3
Operating Characteristics
3.1
Operating Modes
Page 67 of 129
The table below briefly summarizes the various operating modes referred to throughout the
document.
Table 15: Overview of operating modes
Mode
Function
Normal
operation
GSM /
GPRS / UMTS /
HSPA / LTE
SLEEP
GSM /
GPRS / UMTS /
HSPA / LTE
IDLE
GSM TALK/
GSM DATA
GPRS DATA
EGPRS DATA
UMTS TALK/
UMTS DATA
HSPA DATA
Power saving set automatically when no call is in progress and the USB
connection is suspended by host or not present and no active commu-
nication via ASC0.
Power saving disabled or an USB connection not suspended, but no
call in progress.
Connection between two subscribers is in progress. Power consump-
tion depends on the GSM network coverage and several connection
settings (e.g. DTX off/on, FR/EFR/HR, hopping sequences and
antenna connection). The following applies when power is to be mea-
sured in TALK_GSM mode: DTX off, FR and no frequency hopping.
GPRS data transfer in progress. Power consumption depends on net-
work settings (e.g. power control level), uplink / downlink data rates and
GPRS configuration (e.g. used multislot settings).
EGPRS data transfer in progress. Power consumption depends on net-
work settings (e.g. power control level), uplink / downlink data rates and
EGPRS configuration (e.g. used multislot settings).
UMTS data transfer in progress. Power consumption depends on net-
work settings (e.g. TPC Pattern) and data transfer rate.
HSPA data transfer in progress. Power consumption depends on net-
work settings (e.g. TPC Pattern) and data transfer rate.
LTE TALK/
LTE DATA
LTE data transfer in progress. Power consumption depends on network
settings (e.g. TPC Pattern) and data transfer rate.
Power
Down
Normal shutdown after sending the power down command. Only a voltage regulator is
active for powering the RTC. Software is not active. Interfaces are not accessible. Operat-
ing voltage remains applied.
Airplane
mode
Airplane mode shuts down the radio part of the module, causes the module to log off from
the network and disables all AT commands whose execution requires a radio connection.
Airplane mode can be controlled by AT command (see [1]).
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3.2
Power Up/Power Down Scenarios
Page 68 of 129
In general, be sure not to turn on PLSx3 while it is beyond the safety limits of voltage and tem-
perature stated in Section 2.1.2.1. PLSx3 immediately switches off after having started and de-
tected these inappropriate conditions. In extreme cases this can cause permanent damage to
the module.
3.2.1
Turn on PLSx3
After the operating voltage BATT+ is applied, PLSx3 can be switched on by means of the IGT
signal.
The IGT signal turns on the module if the module is in power down mode. The IGT signal is
low level triggered. The module starts in the operating mode with a continuous low level signal.
It is recommended to pull the IGT sinal to GND directly when powering on. The low pulse width
must be longer than 300ms as shown in Figure 27.
When a automatic power-on is needed, IGT can always be connected to GND.
>300 ms
BATT+
IGT
V180
EMERG_RST
3.2.2
Restart PLSx3
Figure 27: IGT timing
To switch the module off the following procedures may be used:
• Software controlled restart procedure: Software controlled by sending an AT command
over the serial application interface. See Section 3.2.2.1.
• Hardware controlled restart procedure: Hardware controlled by using the EMERG_RST
line (see Section 3.2.2.2).
3.2.2.1
Restart PLSx3 Using Restart Command
After startup PLSx3 can be re-started using the AT+CFUN command. For details see [1]
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3.2.2.2
Restart PLSx3 Using EMERG_RST
Page 69 of 129
The EMERG_RST signal is internally connected to the baseband processor. A low level >2
00ms sets the processor and all signals to the reset states, and thus restart the module.
Please note that if the EMERG_RST signal is not released, i.e., changed from low to high, after
a restart, the module will be repeatedly restarted. When the timer of the EMERG_RST signal
is more than 8000ms, the module will be switched off directly.
It is strongly recommended to control this EMERG_RST line with an open collector transistor
or an open drain field-effect transistor.
Caution: Use the EMERG_RST line only when, due to serious problems, the software is not
responding for more than 5 seconds. Pulling the EMERG_RST line causes the loss of all
information stored in the volatile memory. Therefore, this procedure is intended only for use in
case of emergency, e.g. if PLSx3 does not respond, if reset or shutdown via AT command
fails.
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3.2.3
Signal States after Startup
Page 70 of 129
Table 16 lists the states each interface signal passes through during reset phase and the first
firmware initialization. For further firmware startup initializations the values may differ because
of different GPIO line configurations.
After the reset state has been reached the firmware initialization state begins. The firmware ini-
tialization is completed as soon as the ASC0 interface lines CTS0, DSR0 and RING0 have
turned low (see Section 2.1.4 and Section 2.1.5). Now, the module is ready to receive and
transmit data.
Table 16: Pull-up and Pull-down Values
Signal name
Reset state
First start up configuration
RXD0
TXD0
RTS0
CTS0
STATUS/GPIO5
DSR0/GPIO3
DCD0/GPIO2
RING0/GPIO24
RXD1/GPIO16
TXD1/GPIO17
RTS1/GPIO18
CTS1/GPIO19
GPIO6-8
GPIO11-13
GPIO14-15
GPIO25
DOUT/GPIO20
DIN/GPIO21
SIM_SWITCH/GPIO26
FAST_SHDN/GPIO4
PD
PD
PD
PD
PD
PD
PD
PD
PD
PD
O/H
PD
PD
I
PD
PD
PD
PD
O/H
PD
O/L
PD
O/L
O/H
O/H
O/H
PD
PD
O/H
PD
PD
I
PD
O/H
PD
PD
Note: the values above are stored as non- volatile, any changes of the value will take effect
after next power-cycle and remain effective before any change happens again.
Abbreviations used in above Table 16:
L = Low level
H = High level
T = Tristate
I = Input
O = Output
OD = Open Drain
PD = Pull down, 200µA at 1.9V
PU = Pull up, -240µA at 0V
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3.2.4
Turn off PLSx3
To switch the module off the following procedures may be used:
• Software controlled shutdown procedure: Software controlled by sending an AT command
over the serial application interface. See Section 3.2.4.1
• Hardware controlled shutdown procedure: Hardware controlled by setting the FST_SHDN
line to low. See Section 2.1.10.3
• Automatic shutdown (software controlled): See Section 3.2.5
- Take effect if PLSx3 board temperature exceeds a critical limit, or if
- Undervoltage or overvlotage is detected.
3.2.4.1
Switch off PLSx3 Using AT Command
The best and safest approach to powering down the module is to issue the AT^SMSO com-
mand. This procedure lets the module log off from the network and allows the software to enter
into a secure state and to save data before disconnecting the power supply. The shutdown pro-
cedure will be an active process for about 2 seconds (depending on environmental conditions
such as network states) until the module switches off.
A low level of the V180 signal as well as the URC "^SHUTDOWN" indicate that the switch off
procedure has completed and the module has entered the Power Down mode.
3.2.5
Automatic Shutdown
Automatic shutdown takes effect if the following event occurs:
• PLSx3 board is exceeding the critical limits of overtemperature or undertemperature (see
Section 3.2.5.1)
• Undervoltage or overvoltage is detected (see Section 3.2.5.2 and Section 3.2.5.3)
The automatic shutdown procedure is equivalent to the power-down initiated with an AT com-
mand, i.e. PLSx3 logs off from the network and the software enters a secure state avoiding loss
of data.
3.2.5.1
Thermal Shutdown
The board temperature is constantly monitored by an internal NTC resistor located on the PCB.
The values detected by the NTC resistor are measured directly on the board and therefore, are
not fully identical with the ambient temperature.
Each time the board temperature goes out of range or back to normal, PLSx3 instantly displays
an alert (if enabled).
• URCs indicating the level "1" or "-1" allow the user to take appropriate precautions, such as
protecting the module from exposure to extreme conditions. The presentation of the URCs
depends on the settings selected with the AT^SCTM write command (for details see [1]):
AT^SCTM=1: Presentation of URCs is always enabled.
AT^SCTM=0 (default): Presentation of URCs is enabled during the 2 minute guard period
after start-up of PLSx3. After expiry of the 2 minute guard period, the presentation of URCs
will be disabled, i.e. no URCs with alert levels "1" or ''-1" will be generated.
• URCs indicating the level "2" or "-2" are instantly followed by an orderly shutdown after 5
seconds unless the temperature returns to a valid operating level ("1", "0", "-1") or the shut-
down ability was disabled with AT^SCFG, "MEopMode/ShutdownOnCritTemp",<sdoct>.
The presentation of these URCs is always enabled, i.e. they will be output even though the
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factory setting AT^SCTM=0 was never changed.
Page 72 of 129
The maximum temperature ratings are stated in Section 3.6. Refer to Table 17 for the associ-
ated URCs.
Table 17: Temperature associated URCs
Sending temperature alert (2min after PLSx3 start-up, otherwise only if URC presentation enabled)
^SCTM_B: 1
Board close to overtemperature limit.
^SCTM_B: -1
Board close to undertemperature limit.
^SCTM_B: 0
Board back to non-critical temperature range.
Automatic shutdown (URC appears no matter whether or not presentation was enabled)
^SCTM_B: 2
Alert: Board equal or beyond overtemperature limit. PLSx3 switches off.
^SCTM_B: -2
Alert: Board equal or below undertemperature limit. PLSx3 switches off.
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3.2.5.2
Undervoltage Shutdown
Page 73 of 129
The undervoltage shutdown threshold is the specified minimum supply voltage VBATT+ given
in Table 3. When the average supply voltage measured by PLSx3 approaches the undervolt-
age shutdown threshold (i.e., 0.05V offset) the module will send the following URC:
^SBC: Undervoltage Shutdown
If the undervoltage persists the module will send the URC several times before switching off
automatically.
This type of URC does not need to be activated by the user. It will be output automatically when
fault conditions occur.
3.2.5.3
Overvoltage Shutdown
The overvoltage shutdown threshold is the specified maximum supply voltage VBATT+ given
in Table 3. When the supply voltage approaches the overvoltage shutdown threshold, the mod-
ule will send the following URC:
^SBC: Overvoltage Shutdown
The overvoltage warning is sent only once before the module is close to the overvoltage shut-
down threshold again.
This type of URC does not need to be activated by the user. It will be output automatically when
fault conditions occur.
Keep in mind that several PLSx3 components are directly linked to BATT+ and, therefore, the
supply voltage remains applied at major parts of PLSx3, even if the module is switched off. Es-
pecially the power amplifier is very sensitive to high voltage and might even be destroyed
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Page 74 of 129
3.2.5.4
Deferred Shutdown at Extreme Temperature Condition
In the following cases, automatic shutdown will be deferred if a critical temperature limit is ex-
ceeded:
• While an emergency call is in progress.
• During a two minute guard period after power-up. This guard period has been introduced in
order to allow for the user to make an emergency call. The start of any one of these calls
extends the guard period until the end of the call. Any other network activity may be terminated
by shutdown upon expiry of the guard time.
While in a "deferred shutdown" situation, PLSx3 continues to measure the temperature and to
deliver alert messages, but deactivates the shutdown functionality. Once the 2 minute guard
period is expired or the call is terminated, full temperature control will be resumed. If the tem-
perature is still out of range, PLSx3 switches off immediately (without another alert message).
Caution: Automatic shutdown is a safety feature intended to prevent damage to the module.
Extended usage of the deferred shutdown facilities provided may result in damage to the mod-
ule, and possibly other severe consequences.
3.3
Power Saving
PLSx3 is able to reduce its functionality to a minimum (during the so-called SLEEP mode and
SUSPEND mode) in order to minimize its current consumption. The following sections explain
the module’s network dependent power saving behavior. The power saving behavior is further
configurable by AT command:
• When all serial interfaces (i.e. ASC0, and ASC1) are idle, the module can enter SLEEP
mode by additional configuration settings (i.e. AT^SPOW=2.3000,255).
• AT^SCFG= "MEopMode/ExpectDTR": Power saving will take effect only if there is no trans-
mission data pending on any of the module’s USB ports. The expect DTR AT command
ensures that data becoming pending on any USB port before an external application has
signaled its readiness to receive the data is discarded. By default this behavior is enabled
for all available USB CDC ACM.
• Using the AT command AT^SCFG="Radio/OutputPowerReduction" it is possible for the
module in GPRS multislot scenarios to reduce its output power according to 3GPP 45.005
section.
3.3.1
Power Saving while Attached to GSM Networks
The power saving possibilities while attached to a GSM network depend on the paging timing
cycle of the base station. The duration of a power saving interval can be calculated using the
following formula:
t = 4.615 ms (TDMA frame duration) * 51 (number of frames) * DRX value.
DRX (Discontinuous Reception) is a value from 2 to 9, resulting in paging intervals between
0.47 and 2.12 seconds. The DRX value of the base station is assigned by the GSM network
operator.
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Page 75 of 129
Now, a paging timing cycle consists of the actual fixed length paging plus a variable length
pause before the next paging. In the pauses between listening to paging messages, the module
resumes power saving, as shown in Figure 28.
Figure 28: Power saving and paging in GSM networks
The varying pauses explain the different potential for power saving. The longer the pause the
less power is consumed.
Generally, power saving depends on the module’s application scenario and may differ from the
above mentioned normal operation. The power saving interval may be shorter than 0.47 sec-
onds or longer than 2.12 seconds.
3.3.2
Power Saving while Attached to WCDMA Networks
The power saving possibilities while attached to a WCDMA network depend on the paging tim-
ing cycle of the base station.
During normal WCDMA operation, i.e., the module is connected to a WCDMA network, the
duration of a power saving period varies. It may be calculated using the following formula:
t = 2DRX value * 10 ms (WCDMA frame duration).
DRX (Discontinuous Reception) in WCDMA networks is a value between 6 and 9, thus result-
ing in power saving intervals between 0.64 and 5.12 seconds. The DRX value of the base sta-
tion is assigned by the WCDMA network operator.
Now, a paging timing cycle consists of the actual fixed length paging plus a variable length
pause before the next paging. In the pauses between listening to paging messages, the module
resumes power saving, as shown in Figure 29.
Figure 29: Power saving and paging in WCDMA networks
The varying pauses explain the different potential for power saving. The longer the pause the
less power is consumed.
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Page 76 of 129
Generally, power saving depends on the module’s application scenario and may differ from the
above mentioned normal operation. The power saving interval may be shorter than 0.64 sec-
onds or longer than 5.12 seconds.
3.3.3
Power Saving while Attached to LTE Networks
The power saving possibilities while attached to an LTE network depend on the paging timing
cycle of the base station.
During normal LTE operation, i.e., the module is connected to an LTE network, the duration of
a power saving period varies. It may be calculated using the following formula:
t = DRX Cycle Value * 10 ms
DRX cycle value in LTE networks is any of the four values: 32, 64, 128 and 256, thus resulting
in power saving intervals between 0.32 and 2.56 seconds. The DRX cycle value of the base
station is assigned by the LTE network operator.
Now, a paging timing cycle consists of the actual fixed length paging plus a variable length
pause before the next paging.In the pauses between listening to paging messages, the module
resumes power saving, as shown in Figure 30.
Figure 30: Power saving and paging in LTE networks
The varying pauses explain the different potential for power saving. The longer the pause the
less power is consumed.
Generally, power saving depends on the module’s application scenario and may differ from the
above mentioned normal operation. The power saving interval may be shorter than 0.32 sec-
onds or longer than 2.56 seconds.
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3.3.4 Wake-up via RTS0
RTS0 can be used to wake up PLSx3 from SLEEP mode configured with AT^SPOW. Assertion
of RTS0 (i.e., toggle from inactive high to active low) serves as wake up event, thus allowing
an external application to almost immediately terminate power saving. After RTS0 assertion,
the CTS0 line signals module wake up, i.e., readiness of the AT command interface. It is there-
fore recommended to enable RTS/CTS flow control (default setting).
Figure 31 shows the described RTS0 wake up mechanism.
R T S 0
C T S 0
T X D 0
R X D 0
R T S a s s e r t io n ( f a llin g e d g e )
R T S b a c k
W a k e u p f r o m S L E E P m o d e
R e t u r n t o S L E E P m o d e
A T c o m m a n d
R e p ly
U R C
Figure 31: Wake-up via RTS0
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3.4
Power Supply
PLSx3 needs to be connected to a power supply at the SMT application interface - 4 lines
BATT+, and GND. There are two separate voltage domains for BATT+:
• BATT+BB with two lines for the general power management.
• BATT+RF with two lines for the RF.
Please note that throughout the document BATT+ refers to both voltage domains and power
supply lines - BATT+BB and BATT+RF.
The main power supply from an external application has to be a single voltage source and has
to be expanded to sub paths (star structure). BATT+RF must be decoupled by application with
low ESR capacitors(≥ 2x100μF MLCC X5R@BATT+RF ) as close as possible to LGA pads. Fig-
ure 32 shows a sample circuit for decoupling capacitors for BATT+.
Module
SMT interface
BATT+BB
BATT+RF
2
2
Decoupling capacitors
e.g. 100μF MLCC X5R
2x
Figure 32: Decoupling capacitor(s) for BATT+
BATT+
GND
The power supply of PLSx3 must be able to provide the peak current during the uplink trans-
mission.
All the key functions for supplying power to the device are handled by the power management
section of the analog controller. This IC provides the following features:
• Stabilizes the supply voltages for the baseband using low drop linear voltage regulators and
DC-DC step down switching regulators.
• Switches the module's power voltages for the power-up and -down procedures.
• SIM switch to provide SIM power supply.
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3.4.1
Power Supply Ratings
Page 79 of 129
The tables in this section assemble various voltage supply and current consumption ratings of
the module.
Table 18: Supply Ratings
Description
Conditions
BATT+
Supply voltage
Min
Typ Max Unit
3.0
3.8
4.5
V
Normal Range
(Directly measured at Module. Volt-
age must stay within the min/max
values, including voltage drop, ripple,
spikes.)
The module shall work with supply
voltages between 3.0 and 4.5V as
normal voltage range.
Normal condition, power control level
for Pout max
Normal condition, power control level
for Pout max
@ f < 250 kHz
@ f > 250 kHz
Maximum allowed
voltage drop
during transmit
burst
Voltage ripple
400 mV
120
90
mVpp
mVpp
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Typical rating
(W,EP,LA,J, I)
Unit
Table 19: Current Consumption Ratings -GSM1
Description
Conditions
2
IBATT+
(i.e., sum of
BATT+BB and
BATT+RF)
GSM SLEEP
State
supply current
USB disconnected
USB suspended
USB disconnected
USB suspended
USB disconnected
USB suspended
SLEEP3 @ DRX=9
(no communication via
UART)
SLEEP3 @ DRX=5
(no communication via
UART)
SLEEP3 @ DRX=2
(no communication via
UART)
IDLE @ DRX=2
(UART active, but no
communication)
GSM IDLE4 State
supply current
USB disconnected
USB active
12.083
27.706
Average
GSM850
supply current5
GPRS Data transfer
GSM850;
PCL=5; 1Tx/4Rx
2.365
2.690
2.534
2.839
2.992
3.296
1049
315
315
455
566
631
203
206
303
349
486
615
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
ROPR=8
(max. reduction)
ROPR=4
(no reduction)
ROPR=8
(max. reduction)
ROPR=4
(no reduction)
ROPR=8
(max. reduction)
ROPR=4
(no reduction)
ROPR=8
(max. reduction)
ROPR=4
(no reduction)
ROPR=8
(max. reduction)
ROPR=4
(no reduction)
ROPR=8
(max. reduction)
ROPR=4
(no reduction)
GPRS Data transfer
GSM850;
PCL=5; 2Tx/3Rx
GPRS Data transfer
GSM850;
PCL=5; 4Tx/1Rx
EDGE Data transfer
GSM850;
PCL=5; 1Tx/4Rx
EDGE Data transfer
GSM850;
PCL=5; 2Tx/3Rx
EDGE Data transfer
GSM850;
PCL=5; 4Tx/1Rx
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Page 81 of 129
Table 19: Current Consumption Ratings -GSM1
Description
Conditions
2
IBATT+
(i.e., sum of
BATT+BB and
BATT+RF)
Average
GSM900
supply current5
GPRS Data transfer
GSM900;
PCL=5; 1Tx/4Rx
Typical rating
(W,EP,LA,J, I)
Unit
1009
307
307
446
554
638
198
201
301
340
487
607
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
ROPR=8
(max. reduction)
ROPR=4
(no reduction)
ROPR=8
(max. reduction)
ROPR=4
(no reduction)
ROPR=8
(max. reduction)
ROPR=4
(no reduction)
ROPR=8
(max. reduction)
ROPR=4
(no reduction)
ROPR=8
(max. reduction)
ROPR=4
(no reduction)
ROPR=8
(max. reduction)
ROPR=4
(no reduction)
GPRS Data transfer
GSM900;
PCL=5; 2Tx/3Rx
GPRS Data transfer
GSM900;
PCL=5; 4Tx/1Rx
EDGE Data transfer
GSM900;
PCL=5; 1Tx/4Rx
EDGE Data transfer
GSM900;
PCL=5; 2Tx/3Rx
EDGE Data transfer
GSM900;
PCL=5; 4Tx/1Rx
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Table 19: Current Consumption Ratings -GSM1
Description
Conditions
2
IBATT+
(i.e., sum of
BATT+BB and
BATT+RF)
Average
GSM1800
supply current5
GPRS Data transfer
GSM1800; PCL=0;
1Tx/4Rx
Typical rating
(W,EP,LA,J, I)
Unit
209
209
295
359
433
640
163
163
250
269
420
471
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
ROPR=8
(max. reduction)
ROPR=4
(no reduction)
ROPR=8
(max. reduction)
ROPR=4
(no reduction)
ROPR=8
(max. reduction)
ROPR=4
(no reduction)
ROPR=8
(max. reduction)
ROPR=4
(no reduction)
ROPR=8
(max. reduction)
ROPR=4
(no reduction)
ROPR=8
(max. reduction)
ROPR=4
(no reduction)
GPRS Data transfer
GSM1800; PCL=0;
2Tx/3Rx
GPRS Data transfer
GSM1800; PCL=0;
4Tx/1Rx
EDGE Data transfer
GSM1800; PCL=0;
1Tx/4Rx
EDGE Data transfer
GSM1800; PCL=0;
2Tx/3Rx
EDGE Data transfer
GSM1800; PCL=0;
4Tx/1Rx
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Table 19: Current Consumption Ratings -GSM1
Description
Conditions
2
IBATT+
(i.e., sum of
BATT+BB and
BATT+RF)
Average
GSM1900
supply current5
GPRS Data transfer
GSM1900; PCL=0;
1Tx/4Rx
ROPR=8
(max. reduction)
ROPR=4
(no reduction)
ROPR=8
(max. reduction)
ROPR=4
(no reduction)
ROPR=8
(max. reduction)
ROPR=4
(no reduction)
ROPR=8
(max. reduction)
ROPR=4
(no reduction)
ROPR=8
(max. reduction)
ROPR=4
(no reduction)
ROPR=8
(max. reduction)
ROPR=4
(no reduction)
GPRS Data transfer
GSM1900; PCL=0;
2Tx/3Rx
GPRS Data transfer
GSM1900; PCL=0;
4Tx/1Rx
EDGE Data transfer
GSM1900; PCL=0;
1Tx/4Rx
EDGE Data transfer
GSM1900; PCL=0;
2Tx/3Rx
EDGE Data transfer
GSM1900; PCL=0;
4Tx/1Rx
GPRS Data transfer GSM850; PCL=5; 1Tx/
1Rx @ 50Ω
GPRS Data transfer GSM900; PCL=5; 1Tx/
1Rx @ 50Ω
GPRS Data transfer DCS1800; PCL=0; 1Tx/
1Rx @ 50Ω
GPRS Data transfer PCS1900; PCL=0; 1Tx/
1Rx @ 50Ω
GPRS Data transfer GMS850; PCL=5; 1Tx/
1Rx @ total mismatch
GPRS Data transfer GMS900; PCL=5; 1Tx/
1Rx @ total mismatch
GPRS Data transfer DCS1800; PCL=0; 1Tx/
1Rx @ total mismatch
GPRS Data transfer DCS1900; PCL=0; 1Tx/
1Rx @ total mismatch
Typical rating
(W,EP,LA,J, I)
Unit
210
208
295
358
433
643
162
163
249
272
417
476
2.3
2.2
1.4
1.4
2.7
2.8
1.7
1.8
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
A
A
A
A
A
A
A
A
Peak current
during GSM
transmit burst5
1. Note: Current consumption ratings are based on measurements done in a laboratory test environment,
and deviations may occur from the given typical ratings. Under real life conditions however, with e.g., vary-
ing network quality, location changes, or changing supply currents, the deviations from these typical rat-
ings may be even bigger, and will have to be taken into account for actual power supply solutions. For
more details on power supply design see [3].
2. With an impedance of ZLOAD=50Ω at the antenna pad. Measured at 25°C and 3.8V.
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3. Measurements start 6 minutes after switching ON the module,
averaging times: SLEEP mode – 3 minutes, transfer modes – 1.5 minutes
Communication tester settings:no neighbor cells, no cell reselection etc.,
RMC (Reference Measurement Channel)
SLEEP mode is enabled via AT command AT^SPOW=2, 1000, 3
4. The power save mode is disabled via AT command AT^SPOW=1,0,0
5. The communication tester settings of Channel: Mid Channel
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Table 20: Current Consumption Ratings - UMTS1
Description
Conditions
UMTS SLEEP State
supply current
SLEEP3 @ DRX=9
(no communication
via UART)
2
IBATT+
(i.e., sum of
BATT+BB
and
BATT+RF)
SLEEP3 @ DRX=8
(no communication
via UART)
SLEEP3 @ DRX=6
(no communication
via UART)
UMTS IDLE4 State
supply current
IDLE @ DRX=6
(UART active, but no
communication)
UMTS average
supply current 5
UMTS Data transfer Band I
UMTS Data transfer Band II
UMTS Data transfer Band III
UMTS Data transfer Band IV
UMTS Data transfer Band V
UMTS Data transfer Band VI
UMTS Data transfer Band VIII
UMTS Data transfer Band XIX
USB
disconnected
USB
suspended
USB
disconnected
USB
suspended
USB
disconnected
USB
suspended
USB
disconnected
USB active
Typical
rating
(W,EP,L
A,J,I)
Typical
rating
(X, X2,
X3, X4)
Unit
2.336
2.698
2.431
2.778
2.864
3.196
11.785
26.138
606
713
542
560
550
502
570
516
516
534
507
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
1. Note: Current consumption ratings are based on measurements done in a laboratory test environment,
and deviations may occur from the given typical ratings. Under real life conditions however, with e.g.,
varying network quality, location changes, or changing supply currents, the deviations from these typical
ratings may be even bigger, and will have to be taken into account for actual power supply solutions. For
more details on power supply design see [3].
2. With an impedance of ZLOAD=50Ω at the antenna pad. Measured at 25°C and 3.8V.
3. Measurements start 6 minutes after switching ON the module,
averaging times: SLEEP mode – 3 minutes, transfer modes – 1.5 minutes
Communication tester settings:no neighbor cells, no cell reselection etc.,
RMC (Reference Measurement Channel)
SLEEP mode is enabled via AT command AT^SPOW=2, 1000, 3
4. The power save mode is disabled via AT command AT^SPOW=1,0,0
5. The communication tester settings of Channel: Mid Channel
The value is based on the latest test result and may have update in the future releases.
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Table 21: Current Consumption Ratings - LTE1
Description
Conditions
LTE SLEEP
State supply
current
2
IBATT+
(i.e.,
sum of
BATT+
BB and
BATT+
RF)
SLEEP3 @ “Paging Cycles =
256”
(no communication via UART)
SLEEP3 @ “Paging Cycles =
128”
(no communication via UART)
SLEEP3 @ “Paging Cycles =
64”
(no communication via UART)
SLEEP3 @ “Paging Cycles =
32”
(no communication via UART)
USB disconnected
USB suspended
USB disconnected
USB suspended
USB disconnected
USB suspended
USB disconnected
USB suspended
LTE IDLE4
State supply
current
LTE average
supply cur-
rent5
Unit
Typical
rating
(W,EP,
LA,J,I)
Typical
rating
(X,X2,X
3,X4)
2.496
2.793
2.740
3.098
3.291
3.623
4.399
4.717
12.991
28.465
604
622
557
570
564
758
658
669
641
640
520
561
634
636
630
397
405
399
650
596
674
535
565
579
520
600
529
675
594
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
IDLE (USB disconnected)
IDLE (USB active)
LTE Data transfer Band 1
LTE Data transfer Band 2
LTE Data transfer Band 3
LTE Data transfer Band 4
LTE Data transfer Band 5
LTE Data transfer Band 7(-W)
LTE Data transfer Band 8
LTE Data transfer Band 12
LTE Data transfer Band 13
LTE Data transfer Band 14
LTE Data transfer Band 17
LTE Data transfer Band 18
LTE Data transfer Band 19
LTE Data transfer Band 20
LTE Data transfer Band 25
LTE Data transfer Band 26
LTE Data transfer Band 28
LTE Data transfer Band 38
LTE Data transfer Band 40
LTE Data transfer Band 41
LTE Data transfer Band 66
LTE Data transfer Band 71
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1. Note: Current consumption ratings are based on measurements done in a laboratory test environment, and
deviations may occur from the given typical ratings. Under real life conditions however, with e.g., varying net-
work quality, location changes, or changing supply currents, the deviations from these typical ratings may be
even bigger, and will have to be taken into account for actual power supply solutions. For more details on
power supply design see [3].
2. With an impedance of ZLOAD=50Ω at the antenna pad. Measured at 25°C and 3.8V.
3. Measurements start 6 minutes after switching ON the module,
averaging times: SLEEP mode – 3 minutes, transfer modes – 1.5 minutes
Communication tester settings:no neighbor cells, no cell reselection etc.,
RMC (Reference Measurement Channel)
SLEEP mode is enabled via AT command AT^SPOW=2, 1000, 3
4. The power save mode is disabled via AT command AT^SPOW=1,0,0
5. Communication tester setting:
Channel: Mid Channel
Channel Bandwidth: 5MHz
Number of Resource Blocks: 25 (DL), 1 (UL), RB position: Low
Modulation: QPSK
3.4.2
Minimizing Power Losses
If the module supports GSM, when designing the power supply for your application, please pay
specific attention to power losses. Ensure that the input voltage VBATT+, never drops below 3.0V
on the PLSx3 board, not even in a transmit burst where current consumption can rise to typical
peaks. Any voltage drops that may occur in a transmit burst should not exceed 400mV to en-
sure the expected RF performance in 2G networks.
For example,
VImin=3.0V, Dmax=0.4V
VBATTmin= VImin+Dmax=3.4V
Figure 33: Power supply limits during transmit burst
3.4.3
Monitoring Power Supply by AT Command
To monitor the supply voltage, you can use the AT^SBV command which returns the current
value of the supply voltage using AT interface.
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3.5
Operating Temperatures
Page 88 of 129
Table 22: Board Temperature
Parameter
Operating temperature range
Restricted temperature range1
Automatic shutdown2
Typ
Min
-30
-40
<-40
Max
+85
+95
+95
Unit
°C
°C
°C
Temperature measured on PLSx3 board
1. Restricted operation allows normal mode data transmissions for limited time until automatic thermal
shutdown takes effect. Within the restricted temperature range (outside the operating temperature
range) the specified electrical characteristics may be in- or decreased.
2. Due to temperature measurement uncertainty, a tolerance on the stated shutdown thresholds may oc-
cur. The possible deviation is in the range of TBD °C at the over temperature limit.
Note: Within the specified operating temperature ranges the board temperature may vary to a
great extent depending on operating mode, used frequency band, radio output power and
current supply voltage.
3.6
Electrostatic Discharge
The module is not protected against Electrostatic Discharge (ESD) in general. Consequently,
it is subject to ESD handling precautions that typically apply to ESD sensitive components.
Proper ESD handling and packaging procedures must be applied throughout the processing,
handling and operation of any application that incorporates a PLSx3 module.
An example for an enhanced ESD protection for the SIM interface is given in Section 2.1.6.1.
PLSx3 has been tested according to the following standards. Electrostatic values can be gath-
ered from the following table.
Table 23: Electrostatic values
Specification/Requirement
Contact discharge
Air discharge
ANSI/ESDA/JEDEC JS-001-2017 (Human Body Model)
All LGA pads
±1.0kV (HBM)
JS-002-2018 (Charged Device Model)
All LGA pads
±250V (CDM)
ETSI EN 301 489-1/7
BATT+
Antenna pads
TBD
TBD
n.a.
n.a.
TBD
±8kV
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3.7
Reliability Characteristics
Page 89 of 129
The test conditions stated below are an extract of the complete test specifications.
Table 24: Summary of reliability test conditions
Type of test
Conditions
Vibration
Frequency range: 10-20Hz; acceleration: 5g
Frequency range: 20-500Hz; acceleration: 20g
Duration: 20h per axis; 3 axes
Standard
DIN IEC 60068-2-61
Shock half-sinus
DIN IEC 60068-2-27
Acceleration: 500g
Shock duration: 1ms
1 shock per axis
6 positions (± x, y and z)
Dry heat
Temperature
change (shock)
Damp heat cyclic
Temperature: +70 ±2°C
Test duration: 16h
Humidity in the test chamber: < 50%
Low temperature: -40°C ±2°C
High temperature: +85°C ±2°C
Changeover time: < 30s (dual chamber system)
Test duration: 1h
Number of repetitions: 100
High temperature: +55°C ±2°C
Low temperature: +25°C ±2°C
Humidity: 93% ±3%
Number of repetitions: 6
Test duration: 12h + 12h
Cold (constant
exposure)
Temperature: -40 ±2°C
Test duration: 16h
EN 60068-2-2 Bb
ETS 300 019-2-7
DIN IEC 60068-2-14 Na
ETS 300 019-2-7
DIN IEC 60068-2-30 Db
ETS 300 019-2-5
DIN IEC 60068-2-1
1. For reliability tests in the frequency range 20-500Hz the Standard’s acceleration reference value was
increased to 20g.
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4
Mechanical Dimensions, Mounting and Packaging
4.1
Mechanical Dimensions of PLSx3
Figure 34 shows the top and bottom view of PLSx3 and provides an overview of the board's
mechanical dimensions. For further details see Figure 35.
Top view
Bottom View
Figure 34: PLSx3– top and bottom view
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Top view
Figure 35: Dimensions of PLSx3 (all dimensions in mm)
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Figure 36: Dimensions of PLSx3 (keepout area recommended)
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4.2
Mounting PLSx3 onto the Application Platform
This section describes how to mount PLSx3 onto the PCBs, including land pattern and stencil
design, board-level characterization, soldering conditions, durability and mechanical handling.
Note: To avoid short circuits between signal tracks on an external application's PCB and vari-
ous markings at the bottom side of the module, it is recommended not to route the signal tracks
on the top layer of an external PCB directly under the module, or at least to ensure that signal
track routes are sufficiently covered with solder resist.
4.2.1
SMT PCB Assembly
4.2.1.1
Land Pattern and Stencil
The land pattern and stencil design as shown below is based on Thales characterizations for
lead-free solder paste on a four-layer test PCB and a 110 respectively 150 micron thick stencil.
The land pattern given in Figure 37 reflects the module‘s pad layout, including signal pads and
ground pads (for pad assignment see Section 2.1.1).
Figure 37: Land pattern (top view)
The stencil designs illustrated in Figure 38 and Figure 39 are recommended by Thales as a re-
sult of extensive tests with Thales Daisy Chain modules.
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Page 94 of 129
Figure 38: Recommended design for 110 micron thick stencil (top view)
Figure 39: Recommended design for 150 micron thick stencil (top view)
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4.2.1.2
Board Level Characterization
Page 95 of 129
Board level characterization issues should also be taken into account if devising an SMT pro-
cess.
Characterization tests should attempt to optimize the SMT process with regard to board level
reliability. This can be done by performing the following physical tests on sample boards: Peel
test, bend test, tensile pull test, drop shock test and temperature cycling.
It is recommended to characterize land patterns before an actual PCB production, taking indi-
vidual processes, materials, equipment, stencil design, and reflow profile into account. For land
and stencil pattern design recommendations see also Section 4.2.1.1. Optimizing the solder
stencil pattern design and print process is necessary to ensure print uniformity, to decrease sol-
der voids, and to increase board level reliability.
Generally, solder paste manufacturer recommendations for screen printing process parame-
ters and reflow profile conditions should be followed. Maximum ratings are described in Section
4.2.3.
4.2.2
Moisture Sensitivity Level
PLSx3 comprises components that are susceptible to damage induced by absorbed moisture.
Thales’s PLSx3 module complies with the latest revision of the IPC/JEDEC J-STD-020 Stan-
dard for moisture sensitive surface mount devices and is classified as MSL 4.
For additional moisture sensitivity level (MSL) related information see Section 4.2.4 and Sec-
tion 4.3.2.
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4.2.3
Soldering Conditions and Temperature
4.2.3.1
Reflow Profile
tP
tL
TP
TL
e
r
u
t
a
r
e
p
m
e
T
TSmax
TSmin
tS
Preheat
t to maximum
Time
Table 25: Reflow temperature ratings1
Figure 40: Reflow Profile
Profile Feature
Pb-Free Assembly
Preheat & Soak
Temperature Minimum (TSmin)
Temperature Maximum (TSmax)
Time (tSmin to tSmax) (tS)
Average ramp up rate (TL to TP)
Liquidous temperature (TL)
Time at liquidous (tL)
150°C
200°C
60-120 seconds
3K/second max.2
217°C
50-90 seconds
245°C ±5°C
30 seconds max.
Peak package body temperature (TP)
Time (tP) within 5 °C of the peak package body tem-
perature (TP)
Average ramp-down rate
- Limited ramp-down rate between 225°C and 200°C
6K/second max.2
3K/second max.2
Time 25°C to maximum temperature
8 minutes max.
1. Please note that the reflow profile features and ratings listed above are based on the joint industry stan-
dard IPC/JEDEC J-STD-020D.1, and are as such meant as a general guideline.
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2. Temperatures measured on shielding at each corner. See also [3].
Page 97 of 129
Module
1
3
2
4
Temperature sensors (1-4)
4.2.3.2
Maximum Temperature and Duration
The following limits are recommended for the SMT board-level soldering process to attach the
module:
• A maximum module temperature of 245°C. This specifies the temperature as measured at
the module’s top side.
• A maximum duration of 30 seconds at this temperature.
• Ramp-down rate from TP to 200°C should be controlled in order to reduce thermally induced
stress during the solder solidification phase (see Table 25 - limited ramp-down rate). There-
fore, a cool-down step in the oven’s temperature program between 200°C and 180°C
should be considered.
Please note that while the solder paste manufacturers' recommendations for best temperature
and duration for solder reflow should generally be followed, the limits listed above must not be
exceeded.
PLSx3 is specified for one soldering cycle only. Once PLSx3 is removed from the application,
the module will very likely be destroyed and cannot be soldered onto another application.
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4.2.4
Durability and Mechanical Handling
4.2.4.1
Storage Conditions
Page 98 of 129
PLSx3 modules, as delivered in tape and reel carriers, must be stored in sealed, moisture barrier
anti-static bags. The conditions stated below are only valid for modules in their original packed
state in weather protected, non-temperature-controlled storage locations. Normal storage time
under these conditions is 12 months maximum.
Table 26: Storage conditions
Type
Condition
Unit
Reference
Air temperature: Low
High
Humidity relative: Low
High
Air pressure: Low
High
10
90 at 40°C
-25
+40
70
106
1.0
IPC/JEDEC J-STD-033A
IPC/JEDEC J-STD-033A
IEC TR 60271-3-1: 1K4
IEC TR 60271-3-1: 1K4
IEC TR 60271-3-1: 1K4
°C
%
kPa
m/s
---
Movement of surrounding air
Water: rain, dripping, icing and
frosting
Not allowed
---
Radiation:
Solar
Heat
1120
600
W/m2 ETS 300 019-2-1: T1.2, IEC 60068-2-2 Bb
ETS 300 019-2-1: T1.2, IEC 60068-2-2 Bb
Chemically active substances
IEC TR 60271-3-1: 1C1L
Mechanically active substances Not
IEC TR 60271-3-1: 1S1
Not
recommended
recommended
1.5
5
2-9 9-200
mm
m/s2
Hz
semi-sinusoidal
1
50
ms
m/s2
IEC TR 60271-3-1: 1M2
IEC 60068-2-27 Ea
Vibration sinusoidal:
Displacement
Acceleration
Frequency range
Shocks:
Shock spectrum
Duration
Acceleration
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4.2.4.2
Processing Life
PLSx3 must be soldered to an application within 72 hours after opening the moisture barrier
bag (MBB) it was stored in.
As specified in the IPC/JEDEC J-STD-033 Standard, the manufacturing site processing the
modules should have ambient temperatures below 30°C and a relative humidity below 60%.
4.2.4.3
Baking
Baking conditions are specified on the moisture sensitivity label attached to each MBB (see
Figure 46 for details):
•
It is not necessary to bake PLSx3, if the conditions specified in Section 4.2.4.1 and Section
4.2.4.2 were not exceeded.
It is necessary to bake PLSx3, if any condition specified in Section 4.2.4.1 and Section
4.2.4.2 was exceeded.
•
If baking is necessary, the modules must be put into trays that can be baked to at least 125°C.
Devices should not be baked in tape and reel carriers at any temperature.
4.2.4.4
Electrostatic Discharge
Electrostatic discharge (ESD) may lead to irreversable damage for the module. It is therefore
advisable to develop measures and methods to counter ESD and to use these to control the
electrostatic environment at manufacturing sites.
Please refer to Section 3.6 for further information on electrostatic discharge.
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4.3
Packaging
4.3.1
Tape and Reel
4.3.1.1
Orientation
The single-feed tape carrier for PLSx3 is illustrated in Figure 41. The figure also shows the
proper part orientation. The tape width is 44mm and the PLSx3 modules are placed on the tape
with a 40mm pitch. The reels are 330mm in diameter with 100mm hubs. Each reel contains 400
modules.
Figure 41: Carrier tape
Figure 42: Reel direction
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4.3.1.2
Barcode Label
A barcode label provides detailed information on the tape and its contents. It is attached to the
reel.
Barcode label
Figure 43: Barcode label on tape reel
Figure 44: Barcode label on tape reel - layout
Variables on the label are explained in Table 27.
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4.3.2
Shipping Materials
PLSx3 is distributed in tape and reel carriers. The tape and reel carriers used to distribute
PLSx3 are packed as described below, including the following required shipping materials:
• Moisture barrier bag, including desiccant and humidity indicator card
• Transportation box
4.3.2.1
Moisture Barrier Bag
The tape reels are stored inside a moisture barrier bag (MBB), together with a humidity indica-
tor card and desiccant pouches - see Figure 45. The bag is ESD protected and delimits mois-
ture transmission. It is vacuum-sealed and should be handled carefully to avoid puncturing or
tearing. The bag protects the PLSx3 modules from moisture exposure. It should not be opened
until the devices are ready to be soldered onto the application.
Figure 45: Moisture barrier bag (MBB) with imprint
The label shown in Figure 46 summarizes requirements regarding moisture sensitivity, includ-
ing shelf life and baking requirements. It is attached to the outside of the moisture barrier bag.
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Figure 46: Moisture Sensitivity Label
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MBBs contain one or more desiccant pouches to absorb moisture that may be in the bag. The
humidity indicator card described below should be used to determine whether the enclosed
components have absorbed an excessive amount of moisture.
The desiccant pouches should not be baked or reused once removed from the MBB.
The humidity indicator card is a moisture indicator and is included in the MBB to show the ap-
proximate relative humidity level within the bag. Sample humidity cards are shown in Figure 47.
If the components have been exposed to moisture above the recommended limits, the units will
have to be rebaked.
Figure 47: Humidity Indicator Card - HIC
A baking is required if the humidity indicator inside the bag indicates 10% RH or more.
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4.3.2.2
Transportation Box
Tape and reel carriers are distributed in a box, marked with a barcode label for identification
purposes. A box contains two reels with 400 (TBD for -X variant) modules each.
1
2
4
5
6
7
12
13
1
2
3
4
5
6
7
8
9
10
11
12
13
14
3
8
9
10
11
14
Figure 48: Sample of VP box label
Table 27: VP Box label information
No.
Information
Cinterion logo
Product name
Product ordering number
Package ID number of VP box (format may vary depending on the product)
Package ID barcode (Code 128)
Package ID Reel 1 (format may vary depending on the product)
Package ID Reel 2 (format may vary depending on the product)
Quantity of the modules inside the VP box (max. 1000 pcs)
Country of production
Der Grüne Punkt (Green Dot) symbol
Chinese RoHS symbol (see Table 31)
CE logo (CE mark on VP box label is present only for modules with CE imprinted on the
shielding)
European Article Number (EAN-13) barcode
European Article Number, consists of 13 digits (EAN-13)
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5
Regulatory and Type Approval Information
5.1
Directives and Standards
PLSx3 is designed to comply with the directives and standards listed below.
It is the responsibility of the application manufacturer to ensure compliance of the final product
with all provisions of the applicable directives and standards as well as with the technical spec-
ifications provided in the "PLSx3 Hardware Interface Description”.1
Table 28: Directives
2014/53/EU
Directive of the European Parliament and of the council of 16 April 2014 on
the harmonization of the laws of the Member States relating to the making
available on the market of radio equipment and repealing Directive 1999/
05/EC.
2002/95/EC (RoHS 1)
2011/65/EC (RoHS 2)
The product is labeled with the CE conformity mark.
Directive of the European Parliament and of the Council of
27 January 2003 (and revised on 8 June 2011) on the
restriction of the use of certain hazardous substances in
electrical and electronic equipment (RoHS)
1907/2006/EC (REACH) Regulation (EC) No 1907/2006 of the European Parliament and of the
Council of 18 December 2006 concerning the Registration, Evaluation,
Authorization and Restriction of Chemicals (REACH), establishing a Euro-
pean Chemicals Agency, amending Directive 1999/45/EC and repealing
Council Regulation (EEC) No 793/93 and Commission Regulation (EC) No
1488/94 as well as Council Directive 76/769/EEC and Commission Direc-
tive 91/155/EEC, 93/67/EC and 2000/21/EC.
Cinterion® module comply with the REACH regulation that specifies a con-
tent of less than 0.1% per substance mentioned in the SVHC candidate list
(Release 16.06.2014)
Table 29: Standards of North American type approval
CFR Title 47
OET Bulletin 65
(Edition 97-01)
UL 62368-1
Code of Federal Regulations, Part 22, Part 24; US Equipment Authorization
FCC
Evaluating Compliance with FCC Guidelines for Human Exposure to Radio
frequency Electromagnetic Fields
Audio/video, information and communication technology
equipment - Part1: Safety requirements (for details see
Section 5.1.1)
NAPRD.03 V6.01
Overview of PCS Type certification review board Mobile Equipment Type
Certification and IMEI control
PCS Type Certification Review board (PTCRB)
RSS132 (Issue2)
RSS133 (Issue5)
Canadian Standard
1. Manufacturers of applications which can be used in the US shall ensure that their applications have a
PTCRB approval. For this purpose they can refer to the PTCRB approval of the respective module.
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Table 30: Standards of European type approval
3GPP TS 51.010-1
Digital cellular telecommunications system (Release 7); Mobile Station
(MS) conformance specification;
GCF-CC V3.79
Global Certification Forum - Certification Criteria
ETSI EN 301 511
V12.5.1
Global System for Mobile communications (GSM); Mobile Stations (MS)
equipment; Harmonized Standard covering the essential requirements of
article 3.2 of Directive 2014/53/EU
ETSI EN 301 908-01
V13.1.1
IMT cellular networks; Harmonized Standard covering the essential require-
ments of article 3.2 of the Directive 2014/53/EU; Part 1: Introduction and
common requirements
ETSI EN 301 908-02
V11.1.2
IMT cellular networks; Harmonized Standard covering the essential require-
ments of article 3.2 of the Directive 2014/53/EU; Part 2: CDMA Direct
Spread (UTRA FDD) User Equipment (UE)
ETSI EN 301 489-52
V1.1.0
Electromagnetic Compatibility (EMC) standard for radio equipment and ser-
vices; Part 52: Specific conditions for Cellular Communication Mobile and
portable (UE) radio and ancillary equipment; Harmonized Standard cover-
ing the essential requirements of article 3.1(b) of Directive 2014/53/EU
ETSI EN 301 908-13
V13.1.1
IMT cellular networks; Harmonized Standard covering the essential require-
ments of article 3.2 of the Directive 2014/53/EU; Part 13: evolved Universal
Terrestrial Radio Access (E-UTRA) User Equipment (UE).
Draft ETSI EN 301 489-
01 V2.2.3
ETSI EN 301489-19
V2.1.0
ETSI EN 303 413
V1.1.1
IEC 62368-1
(EN 62368-1, UL 62368-
1)
Electromagnetic Compatibility (EMC) standard for radio equipment and ser-
vices; Part 1: Common technical requirements; Harmonized Standard cov-
ering the essential requirements of article 3.1(b) of Directive 2014/53/EU
and the essential requirements of article 6 of Directive 2014/30/EU
ElectroMagnetic Compatibility (EMC) standard for radio equipment and ser-
vices; Part 19: Specific conditions for Receive Only Mobile Earth Stations
(ROMES) operating in the 1,5 GHz band providing data communications
and GNSS receivers operating in the RNSS band (ROGNSS) providing
positioning, navigation, and timing data; Harmonised Standard covering the
essential requirements of article 3.1(b) of Directive 2014/53/EU
Satellite Earth Stations and Systems (SES); Global Navigation Satellite
System (GNSS) receivers; Radio equipment operating in the 1 164 MHz to
1 300 MHz and 1 559 MHz to 1 610 MHz frequency bands; Harmonised
Standard covering the essential requirements of article 3.2 of Directive
2014/53/EU
Audio/video, information and communication technology equipment - Part
1: Safety requirements (for details see Section 5.1.1)
Table 31: Requirements of quality
IEC 60068
Environmental testing
DIN EN 60529
IP codes
EN 62311:2008
Assessment of electronic and electrical equipment related to human expo-
sure restrictions for electromagnetic fields (0 Hz - 300 GHz)
Table 32: Standards of the Ministry of Information Industry of the People’s Republic of China
SJ/T 11363-2006
“Requirements for Concentration Limits for Certain Hazardous Sub-
stances in Electronic Information Products” (2006-06).
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Table 32: Standards of the Ministry of Information Industry of the People’s Republic of China
SJ/T 11364-2006
“Marking for Control of Pollution Caused by Electronic
Information Products” (2006-06).
According to the “Chinese Administration on the Control
of Pollution caused by Electronic Information Products”
(ACPEIP) the EPUP, i.e., Environmental Protection Use
Period, of this product is 20 years as per the symbol
shown here, unless otherwise marked. The EPUP is valid only as long as
the product is operated within the operating limits described in the Thales
Hardware Interface Description.
Please see Table 33 for an overview of toxic or hazardous substances or
elements that might be contained in product parts in concentrations
above the limits defined by SJ/T 11363-2006.
Table 33: Toxic or hazardous substances or elements with defined concentration limits
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5.1.1
IEC 62368-1 Classification
Page 109 of 129
With respect to the safety requirements for audio/video, information and communication tech-
nology equipment defined by the hazard based product safety standard for ICT and AV equip-
ment - i.e., IEC-62368-1 (EN 62368-1, UL 62368-1) - Cinterion® modules are classified as
shown below:
Standalone operation of the modules is not possible. Modules will always be incorporated in an
external application (Customer Product).
Customer understands and is responsible that the product incorporating the Cinterion® module
must be designed to be compliant with IEC-62368-1 (EN 62368-1, UL 62368-1) to ensure pro-
tection against hazards and injuries. When operating the Cinterion® module the external appli-
cation (Customer Product) must provide safeguards not to exceed the power limits given by
classification to Power Source Class 1 (15 Watts) under normal operating conditions, abnormal
conditions, or in the presence of a single fault. When using a battery power supply the external
application must provide safeguards not to exceed the limits defined by PS-1, as well. The ex-
ternal application (Customer Product) must take measures to limit the power, the voltage or the
current, respectively, if required, and must provide safeguards to protect ordinary persons
against pain or injury caused by the voltage/current.
In case of a usage of the Cinterion® module not in accordance with the specifications or in sin-
gle fault condition the external application (Customer Product) must be capable to withstand
levels according to ES-1 / PS-1 also on all ports that are initially intended for signalling or audio,
e.g., USB, RS-232, GPIOs, SPI, earphone and microphone interfaces.
In addition, the external application (Customer Product) must be designed in a way to distribute
thermal energy generated by the intended operation of the Cinterion® module. In case of high
temperature operation, the external application must provide safeguards to protect ordinary
persons against pain or injury caused by the heat.
Table 34: IEC 62368-1 Classification
Source of Energy
Electrical energy source
Class
ES-1
Limits
The Cinterion® modules contain no electrical
energy source - especially no battery. The electri-
cal components and circuits have to be externally
power supplied:
DC either smaller 60 V
Or less than 2 mA
AC up to 1kHz smaller 30 V-rms or 42.4 V peak
AC above 100kHz smaller 70 V rms
Power source provided by the external application
must not exceed 15W, even under worst case and
any single fault condition defined by IEC-62368-1:
Section 6.2.2.3.
Power Source
(potential ignition source caus-
ing fire)
PS-1
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Table 34: IEC 62368-1 Classification
Source of Energy
Hazardous Substances,
Chemical reaction
Class
-
Limits
Under regular conditions, the Cinterion® modules
does not contain any chemically reactive sub-
stances, and no chemical energy source, espe-
cially no battery.
Module is compliant with RoHS and REACH.
In very rare cases however - under abnormal con-
ditions 9i.e. wrong supply voltage, burned module)
or in the presence of single electrical component
faults (i.e. shortcut) - health hazardous sub-
stances might be released if the worst comes to
the worst.
The Cinterion® modules have no sharp edges and
corners, no moving parts, no loosing, exploding or
imploding parts.
The mass is well below 1kg.
Under normal operating conditions, abnormal
operating conditions or single fault conditions the
temperature does not exceed +100°C on the
metal surface (shielding)
The Cinterion® module does not contain a radiant
energy source, any lasers, lamps, LEDs, X-Ray
emitting components or acoustic couplers.
Kinetic / mechanical energy
source
MS-1
Thermal energy source
TS-2
Note: Valid only for Cinterion®
modules with dimensions larger
than 50mm and operating
board temperatures higher than
+80°C.
Radiated energy source
RS-1
Thermal energy source
TS-3
Special safeguards required.
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5.2
SAR requirements specific to portable mobiles
Mobile phones, PDAs or other portable transmitters and receivers incorporating a GSM/UMTS
module must be in accordance with the guidelines for human exposure to radio frequency en-
ergy. This requires the Specific Absorption Rate (SAR) of portable PLSx3 based applications
to be evaluated and approved for compliance with national and/or international regulations.
Since the SAR value varies significantly with the individual product design manufacturers are
advised to submit their product for approval if designed for portable use. For European/US/Aus-
tralian-markets the relevant directives are mentioned below. The manufacturer of the end de-
vice is in the responsibility to provide clear installation and operating instructions for the user,
including the minimum separation distance required to maintain compliance with SAR and/or
RF field strength limits, as well as any special usage conditions required to do so, such as a
required accessory, the proper orientation of the device, the max antenna gain for detachable
antennas, or other relevant criteria. It is the responsibility of the manufacturer of the final prod-
uct to verify whether or not further standards, recommendations or directives are in force out-
side these areas.
Products intended for sale on US markets
ES 59005/ANSI C95.1 Considerations for evaluation of human exposure to Electromagnetic
Fields (EMFs) from Mobile Telecommunication Equipment (MTE) in the
frequency range 30MHz - 6GHz
Products intended for sale on European markets
EN 50360
EN 62311:2008
Product standard to demonstrate the compliance of mobile phones with
the basic restrictions related to human exposure to electromagnetic
fields (300MHz - 3GHz)
Assessment of electronic and electrical equipment related to human
expo-sure restrictions for electromagnetic fields (0 Hz - 300 GHz)
Please note that SAR requirements are specific only for portable devices and not for mobile
devices as defined below:
• Portable device:
A portable device is defined as a transmitting device designed to be used so that the radi-
ating structure(s) of the device is/are within 20 centimeters of the body of the user.
• Mobile device:
A mobile device is defined as a transmitting device designed to be used in other than fixed
locations and to generally be used in such a way that a separation distance of at least 20
centimeters is normally maintained between the transmitter's radiating structure(s) and the
body of the user or nearby persons. In this context, the term ''fixed location'' means that the
device is physically secured at one location and is not able to be easily moved to another
location.
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5.3
Reference Equipment for Type Approval
The Thales reference setup submitted to type approve PLSx3 (including a special approval
adapter for the DSB75) is shown in the following figure1:
LTE / GPRS / UMTS
Base Station
Diversity
Antenna
Main
Antenna
USB
ASC0
PC
Power
Supply
AH6-Adapter
SIM Card
SMA
SMA
SMA
USB
DSB75
Eval_Board
Eval_Board
PLS6x3
PLS6x3
Figure 49: Reference equipment for Type Approval
1. For RF performance tests a mini-SMT/U.FL to SMA adapter with attached 6dB coaxial attenuator is cho-
sen to connect the evaluation module directly to the GSM/UMTS test equipment instead of employing
the SMA antenna connectors on the PLSx3-DSB75 adapter as shown in Figure 49. The following prod-
ucts are recommended:
Hirose SMA-Jack/U.FL-Plug conversion adapter HRMJ-U.FLP(40)
(for details see http://www.hirose-connectors.com/ or http://www.farnell.com/
Aeroflex Weinschel Fixed Coaxial Attenuator Model 3T/4T
(for details see http://www.aeroflex.com/ams/weinschel/pdfiles/wmod3&4T.pdf)
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5.4
Compliance with FCC and ISED Rules and Regulations
The Equipment Authorization Certification for the Thales reference application described in
Section 5.3 will be registered under the following identifiers:
FCC Identifier: QIPPLS63-W
Industry Canada Certification Number: 7830A-PLS63W
Granted to THALES DIS AIS Deutschland GmbH
FCC Identifier: QIPPLS83-W
Industry Canada Certification Number: 7830A-PLS83W
Granted to THALES DIS AIS Deutschland GmbH
FCC Identifier: QIPPLS63-X
Industry Canada Certification Number: 7830A-PLS63X
Granted to THALES DIS AIS Deutschland GmbH
FCC Identifier: QIPPLS83-X
Industry Canada Certification Number: 7830A-PLS83X
Granted to THALES DIS AIS Deutschland GmbH
FCC Identifier: QIPPLS63-X2
Industry Canada Certification Number: 7830A-PLS63X2
Granted to THALES DIS AIS Deutschland GmbH
FCC Identifier: QIPPLS83-X2
Industry Canada Certification Number: 7830A-PLS83X2
Granted to THALES DIS AIS Deutschland GmbH
FCC Identifier: QIPPLS63-X3
Industry Canada Certification Number: 7830A-PLS63X3
Granted to THALES DIS AIS Deutschland GmbH
FCC Identifier: QIPPLS83-X3
Industry Canada Certification Number: 7830A-PLS83X3
Granted to THALES DIS AIS Deutschland GmbH
FCC Identifier: QIPPLS63-X4
Industry Canada Certification Number: 7830A-PLS63X4
Granted to THALES DIS AIS Deutschland GmbH
FCC Identifier: QIPPLS83-X4
Industry Canada Certification Number: 7830A-PLS83X4
Granted to THALES DIS AIS Deutschland GmbH
Manufacturers of mobile or fixed devices incorporating PLSx3 modules are authorized to use
the FCC Grants and ISED Certificates of the PLSx3 modules for their own final products ac-
cording to the conditions referenced in these documents. In this case, an FCC/IC label of the
module shall be visible from the outside, or the host device shall bear a second label stating
"Contains FCC ID: QIPPLS63-W”, "Contains FCC ID: QIPPLS83-W”, "Contains FCC ID: QIP-
PLS63-X”, "Contains FCC ID: QIPPLS83-X”, "Contains FCC ID: QIPPLS63-X2”, "Contains FCC
ID: QIPPLS83-X2”, "Contains FCC ID: QIPPLS63-X3”, "Contains FCC ID: QIPPLS83-X3”, "Con-
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tains FCC ID: QIPPLS63-X4”, "Contains FCC ID: QIPPLS83-X4”, and accordingly “Contains IC:
7830A-PLS63W“, “Contains IC: 7830A-PLS83W“, “Contains IC: 7830A-PLS63X“, “Contains IC:
7830A-PLS83X“, “Contains IC: 7830A-PLS63X2“, “Contains IC: 7830A-PLS83X2“, “Contains IC:
7830A-PLS63X3“, “Contains IC: 7830A-PLS83X3“, “Contains IC: 7830A-PLS63X4“, “Contains
IC: 7830A-PLS83X4“.
The integration is limited to fixed or mobile categorized host devices, where a separation distance
between the antenna and any person of min. 20cm can be assured during normal operating
conditions.
For mobile and fixed operation configuration the antenna gain, including cable loss, must not
exceed the limits listed in the following Table 35 and Table 36 for FCC and ISED.
.
Table 35: Antenna gain limits for FCC and ISED (for W and EP variants)
Operation band
FCC limit
ISED limit
Unit
8.60
10.20
5.30
10.20
Maximum gain in GSM/GPRS 850
Maximum gain in PCS 1900
Maximum gain in WCDMA Band 2
Maximum gain in WCDMA Band 4
Maximum gain in WCDMA Band 5
Maximum gain in LTE Band 2
Maximum gain in LTE Band 4
Maximum gain in LTE Band 5
Maximum gain in LTE Band 7
Maximum gain in LTE Band 8
Maximum gain in LTE Band 12
Maximum gain in LTE Band 13
Maximum gain in LTE Band 26
Maximum gain in LTE Band 38
Maximum gain in LTE Band 41
Maximum gain in WCDMA Band 2
Maximum gain in WCDMA Band 4
Maximum gain in WCDMA Band 5
Maximum gain in LTE Band 2
Maximum gain in LTE Band 4
Maximum gain in LTE Band 5
Maximum gain in LTE Band 12
Maximum gain in LTE Band 13
Maximum gain in LTE Band 14
8.01
5.00
9.40
8.01
5.00
9.40
8.01
9.70
8.70
9.16
9.30
8.01
8.01
8.01
5.00
9.40
8.01
5.00
9.40
8.70
9.16
9.23
dBi
dBi
dBi
dBi
dBi
dBi
dBi
dBi
dBi
dBi
dBi
dBi
dBi
dBi
dBi
dBi
dBi
dBi
dBi
dBi
dBi
dBi
dBi
dBi
dBi
8.01
5.00
6.10
8.01
5.00
6.10
8.01
-
5.61
5.93
6.10
8.01
8.01
8.01
5.00
6.10
8.01
5.00
6.10
5.61
5.93
N.A.
Maximum gain in LTE Band 66
5.00
Table 36: Antenna gain limits for FCC and ISED (for X, X2, X3, X4 variants)
5.00
Operation band
FCC limit
ISED limit
Unit
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Table 36: Antenna gain limits for FCC and ISED (for X, X2, X3, X4 variants)
Operation band
FCC limit
ISED limit
Unit
Maximum gain in LTE Band 25
Maximum gain in LTE Band 26
Maximum gain in LTE Band 66
Maximum gain in LTE Band 71
8.01
9.30
5.00
8.48
8.01
6.10
5.00
5.45
dBi
dBi
dBi
dBi
IMPORTANT:
Manufacturers of portable applications incorporating PLSx3 modules are required to have their
final product certified and apply for their own FCC Grant and ISED Certificate related to the
specific portable mobile. This is mandatory to meet the SAR requirements for portable mobiles
(see Section Table 33: for detail).
Changes or modifications not expressly approved by the party responsible for compliance
could void the user's authority to operate the equipment.
Note: This equipment has been tested and found to comply with the limits for a Class B digital
device, pursuant to part 15 of the FCC Rules and with ISED license-exempt RSS standard(s).
These limits are designed to provide reasonable protection against harmful interference in a
residential installation. This equipment generates, uses and can radiate radio frequency energy
and, if not installed and used in accordance with the instructions, may cause harmful interfer-
ence to radio communications. However, there is no guarantee that interference will not occur
in a particular installation. If this equipment does cause harmful interference to radio or televi-
sion reception, which can be determined by turning the equipment off and on, the user is en-
couraged to try to correct the interference by one or more of the following measures:
• Reorient or relocate the receiving antenna.
•
• Connect the equipment into an outlet on a circuit different from that to which the receiver is
Increase the separation between the equipment and receiver.
connected.
• Consult the dealer or an experienced radio/TV technician for help.
This Class B digital apparatus complies with Canadian ICES-003.
FCC Part 15.19 Warning Statement
THIS DEVICE COMPLIES WITH PART 15 OF THE FCC RULES. OPERATION IS SUBJECT TO THE
FOLLOWING TWO CONDITIONS: (1) THIS DEVICE MAY NOT CAUSE HARMFUL INTERFERENCE,
AND (2) THIS DEVICE MUST ACCEPT ANY INTERFERENCE RECEIVED, INCLUDING
INTERFERENCE THAT MAY CAUSE UNDESIRED OPERATION.
If Canadian approval is requested for devices incorporating PLSx3 modules the below notes
will have to be provided in the English and French language in the final user documentation.
Manufacturers/OEM Integrators must ensure that the final user documentation does not con-
tain any information on how to install or remove the module from the final product.
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Notes (ISED):
(EN) This Class B digital apparatus complies with Canadian ICES-003 and RSS-210. Opera-
tion is subject to the following two conditions: (1) this device may not cause interference, and
(2) this device must accept any interference, including interference that may cause undesired
operation of the device.
(FR) Cet appareil numérique de classe B est conforme aux normes canadiennes ICES-003 et
RSS-210. Son fonctionnement est soumis aux deux conditions suivantes: (1) cet appareil ne
doit pas causer d'interférence et (2) cet appareil doit accepter toute interférence, notamment
les interférences qui peuvent affecter son fonctionnement.
(EN) Radio frequency (RF) Exposure Information
The radiated output power of the Wireless Device is below the Innovation, Science and
Economic Development Canada (ISED) radio frequency exposure limits. The Wireless Device
should be used in such a manner such that the potential for human contact during normal
operation is minimized.
This device has also been evaluated and shown compliant with the ISED RF Exposure limits
under mobile exposure conditions. (antennas at least 20cm from a person‘s body).
(FR) Informations concernant l'exposltion aux fréquences radio (RF)
La puissance de sortie émise par l'appareil de sans fiI est inférieure à la limite d'exposition aux
fréquences radio d‘Innovation, Sciences et Développement économique Canada (ISDE). Utili-
sez l'appareil de sans fil de façon à minimiser les contacts humains lors du fonctionnement nor-
mal.
Ce périphérique a également été évalué et démontré conforme aux limites d'exposition aux RF
d'IC dans des conditions d'exposition à des appareils mobiles (les antennes se situent à moins
de 20cm du corps d'une personne).
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5.5
Compliance with Japanese Rules and Regulations
The PLSx3 reference application described in Section 5.3 complies with the requirements of
the Japanese "Telecommunications Business Law" and "Ordinance Concerning Technical
Regulations Conformity Certification of Specified Radio Equipment" as well as with the require-
ments of the Japanese "Radio Law" and "Ordinance Concerning Technical Conditions Compli-
ance Approval and Certification of the Type for Terminal Equipment".
• The certificate granted in accordance with the "Telecommunications Business Law" has the
identifier:
AD204118217 (for -J)
AD210086217 (for -W)
217-204182 (for -J)
217-210086 (for -W)
• The certificate granted in accordance with the "Radio Law" has the identifier:
Please refer to Figure 51 for the JATE/TELEC mark with identifiers:
:
Figure 50: JATE/TELEC mark for -J
Figure 51: JATE/TELEC mark for -W
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6 Document Information
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6
Document Information
6.1
Revision History
Page 118 of 129
Proceeding document: "Cinterion® PLSx3-W Hardware Interface Description" Version 01.002c
New document: "Cinterion® PLSx3 Hardware Interface Description" Version 01.002d
Chapter
What is new
2.1.2
Updated CCIN to CCIN1 and CCIN2.
2.4
3.4
5.4
Updated Figure 26.
Updated Figure 32.
Added LET Band8 in Table 35.
Proceeding document: "Cinterion® PLSx3-W Hardware Interface Description" Version 01.002b
New document: "Cinterion® PLSx3 Hardware Interface Description" Version 01.002c
Chapter
What is new
2.4
Updated Figure 26.
Proceeding document: "Cinterion® PLSx3-W Hardware Interface Description" Version 01.002a
New document: "Cinterion® PLSx3 Hardware Interface Description" Version 01.002b
Chapter
What is new
Deleted GPO interface in Table 3.
Added Figure 6.
Added Figure 7.
Added Figure 14.
2.1.8.1
Added Figure 15.
2.1.2
2.1.4
2.1.5
2.1.7
2.2.1
2.3.2
2.3.4
2.4
3.4
3.7
-
Updated Table 11 and Table 12.
Update Figure 25.
Added new chapter for GNSS Antenna Interface Characteristics.
Updated Figure 26 for Sample Application.
Updated Table 19, Table 20, and Table 21.
Added new chapter Reliability Characteristics.
Remove I2C.
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Proceeding document: "Cinterion® PLSx3-W Hardware Interface Description" Version 01.002
New document: "Cinterion® PLSx3 Hardware Interface Description" Version 01.002a
Proceeding document: "Cinterion® PLSx3-W Hardware Interface Description" Version 00.906a
New document: "Cinterion® PLSx3 Hardware Interface Description" Version 01.002
1.2.1
2.2
2.2.3.2
2.1.2
3.2.2.2
3.2.3
5.1
5.1.1
5.2
5.4
7.2
1.1
1.2.1
3.4.2
3.4.1
3.3.4
3.2.1
5.1.1
7
Chapter
What is new
Added a note to Table 1.
Updated Table 12.
Updated Figure 23.
Updated the low level impulse.
Updated Table 16 and added a note.
Added 1907/2006/EC (REACH) in Table 28.
New chapter regarding IEC 62368-1 Classification
Updated SAR requirement.
Added Table 35 and Table 36.
Updated Figure 52.
Chapter
What is new
Updated the supported product in the list.
Added new products and the supported bands in Table 1.
Added this section.
Updated Table 20 and Table 21.
Added this section.
Updated Figure 27.
New chapter regarding IEC 62368-1 Classification
Added the supported products in Table 37.
Chapter
What is new
2.1.3.1
2.1.9
2.1.10.3,
2.1.10.4
3.1
3.2.5
3.3
Add Reducing Power Consumption section.
Added Analog-to-Digital Converter (ADC) section.
Added Fast shutdown and Remove Wakeup sections.
Added Operation Mode section.
Added Automatic shutdown with sub sections.
Added Power Saving section.
Proceeding document: "Cinterion® PLSx3-W Hardware Interface Description" Version 00.024
New document: "Cinterion® PLSx3 Hardware Interface Description" Version 00.906
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3.6
4.3.1.2
4.3.2.2
5
7.2
3.2.1
2.1.2
--
--
2
2.1.1
2.1.6
3.2.5
3.4.1
3.5
--
2
3
4
2.1.1
1.3
-
1.4
2.1
3
Cinterion® PLSx3 Hardware Interface Description
6.1 Revision History
125
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Added Electrostatic Discharge section.
Added Figure 44.
Added Figure 48 and Table 27.
Added chapter 6 Regulatory and Type Approval Information.
Added Module Label Information section.
Updated Figure 27 and the description of IGT signal.
Updated Ignition signal description in Table 3.
Proceeding document: "Cinterion® PLSx3-W Hardware Interface Description" Version 00.012
New document: "Cinterion® PLSx3 Hardware Interface Description" Version 00.024
Chapter
What is new
Added new variants of -X, -EP, -LA and -J as well as their supported bands.
Update the height of the module.
Updated the pad assignment. Update the number of GPIO to 22.
Updated Figure 10.
Added the following chapters: 2.1.10.1, 2.2, 2.3, 2.4.
Added Automatic Shutdown section.
Updated power consumption.
Added Operating Temperatures section.
Removed TX-activity.
Proceeding document: "Cinterion® PLSx3-W Hardware Interface Description" Version 00.002
New document: "Cinterion® PLSx3-W Hardware Interface Description" Version 00.012
Chapter
What is new
Added the following new sections: 2.1.7, 2.1.8.1, 2.1.10, 2.1.6.1
Added the following new sections: 3.2.2, 3.2.4
Added the following new sections: 4.2.4, 4.3
Updated the pad assignment
Updated Figure 1
Updated company name and logo.
Proceeding document: "Cinterion® PLSx3-W Hardware Interface Description" Version 00.001
New document: "Cinterion® PLSx3-W Hardware Interface Description" Version 00.002
Chapter
What is new
Updated the Figure 2.
Added the following new sections: 2.1.3, 2.1.4 2.1.5, 2.1.6
Added section 3.2
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New document: "Cinterion® PLSx3-W Hardware Interface Description" Version 00.001
Chapter
What is new
--
Initial document setup.
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6.2
Related Documents
[1] PLSx3 AT Command Set
[2] PLSx3 Release Note
[3] Universal Serial Bus Specification Revision 2.0, April 27, 2000
[4] Application Note 48: SMT Module Integration
[5] Differences between Selected Cinterion® Modules, Hardware Migration Guide
6.3
Terms and Abbreviations
Abbreviation Description
Analog-to-digital converter
Automatic Gain Control
American National Standards Institute
ARFCN
Absolute Radio Frequency Channel Number
ARP
Antenna Reference Point
ASC0/ASC1
Asynchronous Controller. Abbreviations used for first and second serial interface of
PLSx3
CB or CBM
Cell Broadcast Message
Conformité Européene (European Conformity)
Challenge Handshake Authentication Protocol
ADC
AGC
ANSI
B
BER
BIP
BTS
CE
CHAP
CPU
CS
CSD
CTS
DAC
DCE
DRX
DSB
DSP
DSR
DTR
DTX
EFR
Thermistor Constant
Bit Error Rate
Bearer Independent Protocol
Base Transceiver Station
Central Processing Unit
Coding Scheme
Circuit Switched Data
Clear to Send
Digital-to-Analog Converter
Discontinuous Reception
Development Support Box
Digital Signal Processor
Data Set Ready
Data Terminal Ready
Discontinuous Transmission
Enhanced Full Rate
dBm0
Digital level, 3.14dBm0 corresponds to full scale, see ITU G.711, A-law
Data Communication Equipment (typically modems, e.g. Thales module)
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125
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Abbreviation Description
Equivalent Isotropic Radiated Power
Electromagnetic Compatibility
Effective Radiated Power
Electrostatic Discharge
European Telecommunication Standard
European Telecommunication Standards Institute
Federal Communications Commission (U.S.)
Frequency Division Multiple Access
Full Rate
Gaussian Minimum Shift Keying
General Purpose Input/Output
High Impedance
Half Rate
Input/Output
Integrated Circuit
International Mobile Equipment Identity
International Standards Organization
International Telecommunications Union
kbits per second
Light Emitting Diode
Lithium-Ion
Link Power Management
Mbits per second
Man Machine Interface
Mobile Originated
Mobile Terminated
Negative Temperature Coefficient
Original Equipment Manufacturer
Power Amplifier
Password Authentication Protocol
Printed Circuit Board
Power Control Level
Protocol Data Unit
Li-Ion/Li+
Li battery
Rechargeable Lithium Ion or Lithium Polymer battery
Mobile Station ( module), also referred to as TE
MSISDN
Mobile Station International ISDN number
EIRP
EMC
ERP
ESD
ETS
ETSI
FCC
FDMA
FR
GMSK
GPIO
HiZ
HR
I/O
IC
IMEI
ISO
ITU
kbps
LED
LPM
Mbps
MMI
MO
MS
MT
NTC
OEM
PA
PAP
PCB
PCL
PDU
PBCCH
Packet Switched Broadcast Control Channel
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Abbreviation Description
Restriction of the use of certain hazardous substances in electrical and electronic
equipment.
PLL
PPP
PSK
PSU
PWM
R&TTE
RAM
RF
RFFE
RLS
RMS
RoHS
ROM
RTC
RTS
Rx
SAR
SAW
SD
SDC
SGMII
SELV
SIM
SMD
SMS
SMT
SPI
SRAM
TA
TDMA
TE
TLS
Tx
UART
URC
USSD
VSWR
Radio and Telecommunication Terminal Equipment
Phase Locked Loop
Point-to-point protocol
Phase Shift Keying
Power Supply Unit
Pulse Width Modulation
Random Access Memory
Radio Frequency
RF front-end
Radio Link Stability
Root Mean Square (value)
Read-only Memory
Real Time Clock
Request to Send
Receive Direction
Specific Absorption Rate
Surface Accoustic Wave
Secure Digital
Secure Digital Controller
Serial Gigabit Media Independent Interface
Safety Extra Low Voltage
Subscriber Identification Module
Surface Mount Device
Short Message Service
Surface Mount Technology
Serial Peripheral Interface
Static Random Access Memory
Terminal adapter (e.g. module)
Time Division Multiple Access
Terminal Equipment, also referred to as DTE
Transport Layer Security
Transmit Direction
Universal asynchronous receiver-transmitter
Unsolicited Result Code
Unstructured Supplementary Service Data
Voltage Standing Wave Ratio
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6.4
Safety Precaution Notes
Page 125 of 129
The following safety precautions must be observed during all phases of the operation, usage,
service or repair of any cellular terminal or mobile incorporating PLSx3. Manufacturers of the
cellular terminal are advised to convey the following safety information to users and operating
personnel and to incorporate these guidelines into all manuals supplied with the product. Fail-
ure to comply with these precautions violates safety standards of design, manufacture and in-
tended use of the product. Thales assumes no liability for customer’s failure to comply with
these precautions.
When in a hospital or other health care facility, observe the restrictions on the use of
mobiles. Switch the cellular terminal or mobile off, if instructed to do so by the guide-
lines posted in sensitive areas. Medical equipment may be sensitive to RF energy.
The operation of cardiac pacemakers, other implanted medical equipment and hear-
ing aids can be affected by interference from cellular terminals or mobiles placed close
to the device. If in doubt about potential danger, contact the physician or the manufac-
turer of the device to verify that the equipment is properly shielded. Pacemaker
patients are advised to keep their hand-held mobile away from the pacemaker, while
it is on.
Switch off the cellular terminal or mobile before boarding an aircraft. Make sure it can-
not be switched on inadvertently. The operation of wireless appliances in an aircraft is
forbidden to prevent interference with communications systems. Failure to observe
these instructions may lead to the suspension or denial of cellular services to the
offender, legal action, or both.
Do not operate the cellular terminal or mobile in the presence of flammable gases or
fumes. Switch off the cellular terminal when you are near petrol stations, fuel depots,
chemical plants or where blasting operations are in progress. Operation of any elec-
trical equipment in potentially explosive atmospheres can constitute a safety hazard.
Your cellular terminal or mobile receives and transmits radio frequency energy while
switched on. Remember that interference can occur if it is used close to TV sets,
radios, computers or inadequately shielded equipment. Follow any special regulations
and always switch off the cellular terminal or mobile wherever forbidden, or when you
suspect that it may cause interference or danger.
Road safety comes first! Do not use a hand-held cellular terminal or mobile when driv-
ing a vehicle, unless it is securely mounted in a holder for speakerphone operation.
Before making a call with a hand-held terminal or mobile, park the vehicle.
Speakerphones must be installed by qualified personnel. Faulty installation or opera-
tion can constitute a safety hazard.
IMPORTANT!
Cellular terminals or mobiles operate using radio signals and cellular networks.
Because of this, connection cannot be guaranteed at all times under all conditions.
Therefore, you should never rely solely upon any wireless device for essential com-
munications, for example emergency calls.
Remember, in order to make or receive calls, the cellular terminal or mobile must be
switched on and in a service area with adequate cellular signal strength.
Some networks do not allow for emergency calls if certain network services or phone
features are in use (e.g. lock functions, fixed dialing etc.). You may need to deactivate
those features before you can make an emergency call.
Some networks require that a valid SIM card be properly inserted in the cellular termi-
nal or mobile.
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7
Appendix
7.1
List of Parts and Accessories
Table 37: List of parts and accessories
Description
PLS63-X
Supplier
Ordering information
Thales
PLS83-X
Thales
PLS63-W
Thales
PLS83-W
Thales
PLS63-LA
Thales
PLS83-LA
Thales
PLS63-EP
Thales
PLS83-EP
Thales
PLS63-J
Thales
PLS83-J
Thales
PLS63-X2
Thales
Standard module
Thales IMEI:
Packaging unit (ordering) number: L30960-N6500-A100
Module label number: S30960-S6500-A100-11
Standard module
Thales IMEI:
Packaging unit (ordering) number: L30960-N6510-A100
Module label number: S30960-S6510-A100-1
Standard module
Thales IMEI:
Packaging unit (ordering) number: L30960-N6520-A100
Module label number: S30960-S6520-A100-1
Standard module
Thales IMEI:
Packaging unit (ordering) number: L30960-N6530-A100
Module label number1: S30960-S6530-A100-1
Standard module
Thales IMEI:
Packaging unit (ordering) number: L30960-N6540-A100
Module label number: S30960-S6540-A100-1
Standard module
Thales IMEI:
Packaging unit (ordering) number: L30960-N6550-A100
Module label number: S30960-S6550-A100-1
Standard module
Thales IMEI:
Packaging unit (ordering) number: L30960-N6560-A100
Module label number: S30960-S6560-A100-1
Standard module
Thales IMEI:
Packaging unit (ordering) number: L30960-N6570-A100
Module label number: S30960-S6570-A100-1
Standard module
Thales IMEI:
Packaging unit (ordering) number: L30960-N6580-A100
Module label number: S30960-S6580-A100-1
Standard module
Thales IMEI:
Packaging unit (ordering) number: L30960-N6590-A100
Module label number: S30960-S6590-A100-1
Standard module
Thales IMEI:
Packaging unit (ordering) number: L30960-N6506-A100
Module label number: S30960-S6506-A100-1
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Table 37: List of parts and accessories
Description
PLS83-X2
Supplier
Ordering information
Thales
PLS63-X3
Thales
PLS83-X3
Thales
PLS63-X4
Thales
PLS83-X4
Thales
PLS63-I
Thales
PLS83-I
Thales
Standard module
Thales IMEI:
Packaging unit (ordering) number: L30960-N6516-A100
Module label number: S30960-S6516-A100-1
Standard module
Thales IMEI:
Packaging unit (ordering) number: L30960-N6508-A100
Module label number: S30960-S6508-A100-1
Standard module
Thales IMEI:
Packaging unit (ordering) number: L30960-N6518-A100
Module label number: S30960-S6518-A100-1
Standard module
Thales IMEI:
Packaging unit (ordering) number: L30960-N6512-A100
Module label number: S30960-S6512-A100-1
Standard module
Thales IMEI:
Packaging unit (ordering) number: L30960-N6522-A100
Module label number: S30960-S6522-A100-1
Standard module
Thales IMEI:
Packaging unit (ordering) number: L30960-N6526-A100
Module label number: S30960-S6526-A100-1
Standard module
Thales IMEI:
Packaging unit (ordering) number: L30960-N6536-A100
Module label number: S30960-S6536-A100-1
PLS63-X Evaluation Module
Thales
Ordering number: L30960-N6501-A100
PLS83-X Evaluation Module
Thales
Ordering number: L30960-N6511-A100
PLS63-W Evaluation Module Thales
Ordering number: L30960-N6521-A100
PLS83-W Evaluation Module Thales
Ordering number: L30960-N6531-A100
PLS63-LA Evaluation Module Thales
Ordering number: L30960-N6541-A100
PLS83-LA Evaluation Module Thales
Ordering number: L30960-N6551-A100
PLS63-EP Evaluation Module Thales
Ordering number: L30960-N6561-A100
PLS83-EP Evaluation Module Thales
Ordering number: L30960-N6571-A100
PLS63-J Evaluation Module
Thales
Ordering number: L30960-N6581-A100
PLS83-J Evaluation Module
Thales
Ordering number: L30960-N6591-A100
PLS63-X2 Evaluation Module Thales
Ordering number: L30960-N6507-A100
PLS83-X2 Evaluation Module Thales
Ordering number: L30960-N6517-A100
PLS63-X3 Evaluation Module Thales
Ordering number: L30960-N6509-A100
PLS83-X3 Evaluation Module Thales
Ordering number: L30960-N6519-A100
PLS63-X4 Evaluation Module Thales
Ordering number: L30960-N6513-A100
PLS83-X4 Evaluation Module Thales
Ordering number: L30960-N6523-A100
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Table 37: List of parts and accessories
Description
Supplier
Ordering information
PLS63-I Evaluation Module
Thales
Ordering number: L30960-N6527-A100
PLS83-I Evaluation Module
Thales
Ordering number: L30960-N6537-A100
DSB-mini
Ordering number: L30960-N0030-A100
DSB75 Evaluation Kit
Ordering number: L36880-N8811-A100
Ordering number: L30960-N0100-A100
Thales
Thales
Thales
EVAL DSB Adapter for
mounting PLSx3 evaluation
modules onto DSB75
LGA DevKit
Thales
LGA DevKit consists of
Cinterion® LGA DevKit L Base PCB:
Ordering number: L30960-N0112-A100
Cinterion® LGA DevKit Socket SML:
Ordering number: L30960-N0110-A100
1. Note: At the discretion of Thales, module label information can either be laser engraved on the module’s
shielding or be printed on a label adhered to the module’s shielding.
Table 38: Molex sales contacts (subject to change)
Molex
For further information please click:
http://www.molex.com
Molex China Distributors
Beijing,
Room 1311, Tower B, COFCO Plaza
No. 8, Jian Guo Men Nei Street, 100005
Beijing
P.R. China
Phone: +86-10-6526-9628
Fax: +86-10-6526-9730
Molex Deutschland GmbH
Otto-Hahn-Str. 1b
69190 Walldorf
Germany
Phone: +49-6227-3091-0
Fax: +49-6227-3091-8100
Email: mxgermany@molex.com
Molex Singapore Pte. Ltd.
110, International Road
Jurong Town,
Singapore 629174
American Headquarters
Lisle, Illinois 60532
U.S.A.
Phone: +1-800-78MOLEX
Fax: +1-630-969-1352
Molex Japan Co. Ltd.
1-5-4 Fukami-Higashi,
Yamato-City,
Kanagawa, 242-8585
Japan
Phone: +65-6-268-6868
Fax: +65-6-265-6044
Phone: +81-46-265-2325
Fax: +81-46-265-2365
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7.2
Module Label Information
The label engraved on the top of PLSx3 comprises the following information.
4
8
1
5
2
3
6
7
No.
1
2
3
4
5
6
7
8
Table 39: PLSx3 label information
Figure 52: PLSx3 Label
Cinterion logo
Factory Code
Manufacturing country (e.g., “Made in China”)
Product name/variant (e.g. “PLS83-W”)
Product order code
Manufacturer 2D barcode
Product IMEI
2-digital date code of product production (for decoding see Table below)
Table 40: Date code table
Code
L
Code
1
M
2
N
3
P
4
Date Code
R
5
S
6
T
7
U
8
V
9
W
O
X
N
A
D
Year
2019
2020
2021
2022
2023
2024
2025
2026
2027
2028
2029
2030
Month Jan.
Feb. Mar.
Apr. May
June
July
Aug.
Sept. Oct.
Nov. Dec.
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129
THALES DIS AIS Deutschland GmbH
Werinherstrasse 81
81541 Munich
Germany
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1 2 3 4 5 | Users Manual | February 20 2021 / April 30 2021 |
1 2 3 4 5 | Users Manual rev1 | Users Manual | 1.15 MiB | February 20 2021 / April 30 2021 |
Cinterion PLS83-W Hardware Interface Overview Version:
DocId:
00.860 PLS83-W_HIO_v00.860 Cinterion PLS83-W Hardware Interface Overview Page 2 of 61 2 Document Name: Cinterion PLS83-W Hardware Interface Overview Version:
00.860 Date:
DocId:
Status 2021-02-18 PLS83-W_HIO_v00.860 Confidential / Preliminary GENERAL NOTE THE USE OF THE PRODUCT INCLUDING THE SOFTWARE AND DOCUMENTATION (THE "PROD-
UCT") IS SUBJECT TO THE RELEASE NOTE PROVIDED TOGETHER WITH PRODUCT. IN ANY EVENT THE PROVISIONS OF THE RELEASE NOTE SHALL PREVAIL. THIS DOCUMENT CONTAINS INFORMATION ON THALES DIS AIS DEUTSCHLAND GMBH (THALES) PRODUCTS. THE SPECIFI-
CATIONS IN THIS DOCUMENT ARE SUBJECT TO CHANGE AT THALES'S DISCRETION. THALES GRANTS A NON-EXCLUSIVE RIGHT TO USE THE PRODUCT. THE RECIPIENT SHALL NOT TRANS-
FER, COPY, MODIFY, TRANSLATE, REVERSE ENGINEER, CREATE DERIVATIVE WORKS; DISAS-
SEMBLE OR DECOMPILE THE PRODUCT OR OTHERWISE USE THE PRODUCT EXCEPT AS SPECIFICALLY AUTHORIZED. THE PRODUCT AND THIS DOCUMENT ARE PROVIDED ON AN "AS IS" BASIS ONLY AND MAY CONTAIN DEFICIENCIES OR INADEQUACIES. TO THE MAXIMUM EXTENT PERMITTED BY APPLICABLE LAW, THALES DISCLAIMS ALL WARRANTIES AND LIABILI-
TIES. THE RECIPIENT UNDERTAKES FOR AN UNLIMITED PERIOD OF TIME TO OBSERVE SECRECY REGARDING ANY INFORMATION AND DATA PROVIDED TO HIM IN THE CONTEXT OF THE DELIVERY OF THE PRODUCT. THIS GENERAL NOTE SHALL BE GOVERNED AND CON-
STRUED ACCORDING TO GERMAN LAW. Copyright Transmittal, reproduction, dissemination and/or editing of this document as well as utilization of its con-
tents and communication thereof to others without express authorization are prohibited. Offenders will be held liable for payment of damages. All rights created by patent grant or registration of a utility model or design patent are reserved. Copyright 2021, THALES DIS AIS Deutschland GmbH Trademark Notice Thales, the Thales logo, are trademarks and service marks of Thales and are registered in certain coun-
tries. Microsoft and Windows are either registered trademarks or trademarks of Microsoft Corporation in the United States and/or other countries. All other registered trademarks or trademarks mentioned in this document are property of their respective owners. t PLS83-W_HIO_v00.860 Confidential / Preliminary 2021-02-18 Cinterion PLS83-W Hardware Interface Overview Contents 61 Page 3 of 61 Contents 1 2 3 4 5 6 Introduction ................................................................................................................. 7 Product Variants ................................................................................................ 7 1.1 Key Features at a Glance .................................................................................. 7 1.2 PLS83-W System Overview............................................................................. 11 1.3 Interface Characteristics .......................................................................................... 12 Application Interface ........................................................................................ 12 2.1 2.1.1 USB Interface...................................................................................... 12 Serial Interface ASC0 ......................................................................... 13 2.1.2 2.1.3 Serial Interface ASC1 ......................................................................... 14 2.1.4 UICC/SIM/USIM Interface................................................................... 15 2.1.4.1 SIM_SWITCH Line.............................................................. 17 2.1.5 GPIO Interface .................................................................................... 18 2.1.6 Digital Audio Interface......................................................................... 18 2.1.6.1 Pulse Code Modulation Interface ........................................ 18 Inter-IC Sound Interface (TBD) ........................................... 19 2.1.6.2 2.1.7 Control Signals.................................................................................... 20 2.1.7.1 Status LED .......................................................................... 20 2.1.7.2 Power Indication.................................................................. 21 RF Antenna Interface....................................................................................... 22 2.2.1 Antenna Installation ............................................................................ 23 2.2.2 RF Line Routing Design...................................................................... 24 2.2.2.1 Line Arrangement Examples ............................................... 24 2.2.2.2 Routing Example................................................................. 29 GNSS Antenna Interface ................................................................................. 30 2.3.1 GNSS Antenna Diagnostic.................................................................. 31 2.2 2.3 Operating Characteristics ........................................................................................ 32 Power Supply................................................................................................... 32 3.1 Mechanical Dimensions, Mounting and Packaging............................................... 33 Mechanical Dimensions of PLS83-W............................................................... 33 4.1 Regulatory and Type Approval Information ........................................................... 37 Directives and Standards................................................................................. 37 5.1 SAR requirements specific to portable mobiles ............................................... 40 5.2 Reference Equipment for Type Approval ......................................................... 41 5.3 Compliance with FCC/IC/ISED Rules and Regulations ................................... 42 5.4 Document Information.............................................................................................. 45 Revision History ............................................................................................... 45 6.1 Related Documents ......................................................................................... 45 6.2 Terms and Abbreviations ................................................................................. 45 6.3 Safety Precaution Notes .................................................................................. 49 6.4 t PLS83-W_HIO_v00.860 Confidential / Preliminary 2021-02-18 Cinterion PLS83-W Hardware Interface Overview Contents 61 Page 4 of 61 7 Appendix.................................................................................................................... 50 List of Parts and Accessories........................................................................... 50 7.1 t PLS83-W_HIO_v00.860 Confidential / Preliminary 2021-02-18 Cinterion PLS83-W Hardware Interface Overview Tables Page 5 of 61 Tables Table 1:
Table 2:
Table 3:
Table 4:
Table 5:
Table 6:
Table 7:
Table 8:
Table 9:
Table 10:
Table 11:
Table 12:
Table 13:
Table 14:
Table 15:
Signals of the SIM interface (SMT application interface) ............................... 15 GPIO lines and possible alternative assignment............................................ 18 Overview of PCM pin functions ...................................................................... 19 Overview of I2S pin functions ......................................................................... 20 Return loss in the active band........................................................................ 22 Sample ranges of the GNSS antenna diagnostic measurements and their possible meaning ........................................................................................... 31 Directives ....................................................................................................... 37 Standards of North American type approval .................................................. 37 Standards of European type approval............................................................ 37 Requirements of quality ................................................................................. 38 Standards of the Ministry of Information Industry of the Peoples Republic of China ............................................................................ 38 Toxic or hazardous substances or elements with defined concentration limits ............................................................................................................... 39 Antenna gain limits for FCC and ISED........................................................... 42 List of parts and accessories.......................................................................... 50 Molex sales contacts (subject to change) ...................................................... 51 t PLS83-W_HIO_v00.860 Confidential / Preliminary 2021-02-18 Cinterion PLS83-W Hardware Interface Overview Figures Page 6 of 61 Figures Figure 1:
Figure 2:
Figure 3:
Figure 4:
Figure 5:
Figure 6:
Figure 7:
Figure 8:
Figure 9:
Figure 10:
Figure 11:
Figure 12:
Figure 13:
Figure 14:
Figure 15:
Figure 16:
Figure 17:
Figure 18:
Figure 19:
Figure 20:
Figure 21:
Figure 22:
Figure 23:
Figure 24:
Figure 25:
PLS83-W system overview ............................................................................ 11 USB circuit ..................................................................................................... 12 Serial interface ASC0..................................................................................... 13 Serial interface ASC1..................................................................................... 14 Modules two UICC/SIM/USIM interfaces ...................................................... 16 UICC/SIM/USIM interfaces connected........................................................... 16 External UICC/SIM/USIM switch.................................................................... 17 Sample circuit for SIM interface connection via SIM switch........................... 17 Status signaling with LED driver .................................................................... 20 Power indication signal .................................................................................. 21 Antenna pads (bottom view) .......................................................................... 23 Embedded Stripline with 65m prepreg (1080) and 710m core .................. 24 Micro-Stripline on 1.0mm standard FR4 2-layer PCB - example 1 ................ 25 Micro-Stripline on 1.0mm Standard FR4 PCB - example 2............................ 26 Micro-Stripline on 1.5mm Standard FR4 PCB - example 1............................ 27 Micro-Stripline on 1.5mm Standard FR4 PCB - example 2............................ 28 Routing to applications RF connector ........................................................... 29 PLS83-W evaluation board layer table........................................................... 29 Supply voltage for active GNSS antenna....................................................... 30 ESD protection for passive GNSS antenna ................................................... 31 Decoupling capacitor(s) for BATT+................................................................ 32 PLS83-W top and bottom view..................................................................... 34 Dimensions of PLS83-W (all dimensions in mm) ........................................... 35 Dimensions of PLS83-W (keepout area recommended)................................ 36 Reference equipment for Type Approval ....................................................... 41 t PLS83-W_HIO_v00.860 Confidential / Preliminary 2021-02-18 Cinterion PLS83-W Hardware Interface Overview 1 Introduction 11 Page 7 of 61 1 Introduction This document1 describes the hardware of the Cinterion PLS83-W module. It helps you quick-
ly retrieve interface specifications, electrical and mechanical details and information on the re-
quirements to be considered for integrating further components. 1.1 Product Variants This document applies to the following Thales module variants:
Cinterion PLS83-W Module Frequency bands PLS83-W integrates all the bands required to have a global coverage across the world (NORAM / LATAM / EMEA /APAC). 1.2 Key Features at a Glance Feature General Implementation GSM class Small MS Output power (according to release 99) Output power (according to Release 99) Class 4 (+33dBm 2dB) for GSM850 Class 4 (+33dBm 2dB) for GSM900 Class 1 (+30dBm 2dB) for GSM1800 Class 1 (+30dBm 2dB) for GSM1900 Class E2 (+27dBm 3dB) for GSM 850 8-PSK Class E2 (+27dBm 3dB) for GSM 900 8-PSK Class E2 (+26dBm +3 /-4dB) for GSM 1800 8-PSK Class E2 (+26dBm +3 /-4dB) for GSM 1900 8-PSK Class 3 (+24dBm +1/-3dB) for UMTS 850, WCDMA FDD BdXIX Class 3 (+24dBm +1/-3dB) for UMTS 850, WCDMA FDD BdVI Class 3 (+24dBm +1/-3dB) for UMTS 850, WCDMA FDD BdV Class 3 (+24dBm +1/-3dB) for UMTS 900, WCDMA FDD BdVIII Class 3 (+24dBm +1/-3dB) for UMTS 1700, WCDMA FDD BdIII Class 3 (+24dBm +1/-3dB) for UMTS 1900, WCDMA FDD BdII Class 3 (+24dBm +1/-3dB) for UMTS 2100, WCDMA FDD BdIV Class 3 (+24dBm +1/-3dB) for UMTS 2100, WCDMA FDD BdI 1. The document is effective only if listed in the appropriate Release Notes as part of the technical docu-
mentation delivered with your Thales product. t PLS83-W_HIO_v00.860 Confidential / Preliminary 2021-02-18 Cinterion PLS83-W Hardware Interface Overview 1.2 Key Features at a Glance 11 Page 8 of 61 Feature Implementation Output power (according to Release 8) Class 3 (+23dBm 2dB) for LTE 600, LTE FDD Bd71 Class 3 (+23dBm 2dB) for LTE 700, LTE FDD Bd12 <MFBI Bd17>
Class 3 (+23dBm 2dB) for LTE 700, LTE FDD Bd13 Class 3 (+23dBm 2dB) for LTE 700, LTE FDD Bd14 Class 3 (+23dBm+2/-2.5dB) for LTE 700, LTE FDD Bd28 Class 3 (+23dBm 2dB) for LTE 850, LTE FDD Bd26 Class 3 (+23dBm 2dB) for LTE 850, LTE FDD Bd18 Class 3 (+23dBm 2dB) for LTE 850, LTE FDD Bd19 Class 3 (+23dBm 2dB) for LTE 800, LTE FDD Bd20 Class 3 (+23dBm 2dB) for LTE 850, LTE FDD Bd5 Class 3 (+23dBm 2dB) for LTE 900, LTE FDD Bd8 Class 3 (+23dBm 2dB) for LTE 1800, LTE FDD Bd3 Class 3 (+23dBm 2dB) for LTE 1900, LTE FDD Bd2 Class 3 (+23dBm 2dB) for LTE 1900, LTE FDD Bd25 Class 3 (+23dBm 2dB) for LTE 2100, LTE FDD Bd1 Class 3 (+23dBm 2dB) for LTE 2100, LTE FDD Bd4 Class 3 (+23dBm 2dB) for LTE 2100, LTE FDD Bd66 Class 3 (+23dBm 2dB) for LTE 2600, LTE FDD Bd7 Class 3 (+23dBm 2dB) for LTE 2300, LTE TDD Bd40 Class 3 (+23dBm 2dB) for LTE 2500, LTE TDD Bd41 Class 3 (+23dBm 2dB) for LTE 2600, LTE TDD Bd38 Power supply Normal operation:
3.0V < VBATT+ < 4.5V Typ value is 3.8V Extended operation: TBD Operating temperature
(board temperature) Normal operation: -30C to +85C Extended operation: -40C to -30C, +85C to +90C Dimensions: 33mm x 29mm x 2.31mm Weight: approx. 4.8g All hardware components fully compliant with EU RoHS Directive Physical RoHS LTE features 3GPP Release 10 HSPA feature 3GPP Release 7 UMTS features 3GPP Release 4 UE CAT 4 for PLS83 (DL 150Mbps, UL 50Mbps) UE CAT. 14, 6 for PLS83 HSPA+ DL 21Mbps HSUPA UL 5.7Mbps Compressed mode (CM) supported according to 3GPP TS25.212 PS data rate 384 kbps DL / 384 kbps UL CS data rate 64 kbps DL / 64 kbps UL t PLS83-W_HIO_v00.860 Confidential / Preliminary 2021-02-18 Cinterion PLS83-W Hardware Interface Overview 1.2 Key Features at a Glance 11 Page 9 of 61 Feature Implementation GSM/GPRS/EGPRS features Data transfer EDGE E2 power class for 8 PSK GPRS:
Multislot Class 12 Mobile Station Class B Coding Scheme 1 4 EGPRS:
Multislot Class 12 Downlink coding schemes CS 1-4, MCS 1-9 Uplink coding schemes CS 1-4, MCS 1-9 SRB loopback and test mode B 8-bit, 11-bit RACH 1 phase/2 phase access procedures Link adaptation and IR NACC, extended UL TBF Mobile Station Class B Point-to-point MT and MO Cell broadcast Text and PDU mode Storage: SIM card plus SMS locations in mobile equipment Standalone GNSS (GPS, GLONASS, Beidou, Galileo) Automatic power saving modes. DC feed bridge and control of power supply for active antenna GNSS Features NMEA SMS Protocol Modes General Software Interfaces Module interface AT commands Hayes 3GPP TS 27.007, TS 27.005, Thales SIM Application Toolkit Default (Network) bearer support for BIP Firmware update Generic update from host application over USB modem Surface mount device with solderable connection pads (SMT application interface). Land grid array (LGA) technology ensures high solder joint reli-
ability and allows the use of an optional module mounting socket. For more information on how to integrate SMT modules see also [4].This application note comprises chapters on module mounting and application layout issues as well as on additional SMT application development equip-
ment. USB USB 2.0 High Speed (480Mbit/s) device interface. Full Speed (12Mbit/s) compliant. t PLS83-W_HIO_v00.860 Confidential / Preliminary 2021-02-18 Cinterion PLS83-W Hardware Interface Overview 1.2 Key Features at a Glance 11 Page 10 of 61 Feature Implementation 2 serial interfaces ASC0 (in parts shared with GPIO lines):
8-wire modem interface with status and control lines, unbalanced, asyn-
chronous Fixed baud rates: 300bps to 921,600bps Supports RTS0/CTS0 hardware flow control. ASC1 (shared with GPIO lines):
4-wire, unbalanced asynchronous interface Fixed baud rates: 300bps to 921,600bps and 3Mbps Supports RTS1/CTS1 hardware flow control Audio 1 digital interface (PCM), shared with GPIO lines Supported chip cards: UICC/SIM/USIM 3V, 1.8V 22 GPIO lines comprising:
13 lines shared with ASC0, ASC1 lines, with network status indication, fast shutdown and SIM switch 4 GPIO lines shared with PCM interface 9 GPIO lines not shared Supports I2C serial interface. 1 digital interface can be configured as PCM or I2S(TBD). RING0 Support RING0 to wake up host from power down modes Antenna interface pads 50. UMTS/GSM/LTE main antenna, UMTS/LTE Rx Diversity antenna, GNSS antenna. ADC inputs Analog-to-Digital Converter with unbalanced analog inputs, for example, for the (external) antenna diagnosis Real time clock Timer functions via AT commands. Switch on by hardware signal IGT Switch off by AT command Switch off by hardware signal FST_SHDN instead of AT command Automatic switch off in case of critical temperature or voltage conditions Orderly reset by AT command Reset by emergency reset signal EMERG_RST. LGA DevKit designed to test Thales LGA modules. PLS83-W module soldered onto a dedicated PCB that can be connected to an adapter in order to be mounted onto the DSB75 or DSB mini. DSB-mini Development Support Board designed to test and type approve. It is the cost optimized development board alternative to DSB75. DSB75 Development Support Board designed to test and type approve Thales modules and provide a sample configuration for application engi-
neering. A special adapter is required to connect the PLS83-W evaluation module to the DSB75. 2 UICC interfaces
(switchable) GPIO interface I2C interface Digital audio interface Power on/off, Reset Power on/off Reset Special features Evaluation kit LGA DevKit Evaluation module DSB-mini DSB75 t PLS83-W_HIO_v00.860 Confidential / Preliminary 2021-02-18 Cinterion PLS83-W Hardware Interface Overview 1.3 PLS83-W System Overview 11 1.3 PLS83-W System Overview Page 11 of 61 Application Module GPIO Digital Audio STATUS SIM_SWITCH FST_SHDN ASC1/GPIO ASC0/GPIO PWR_IND ASC0/GPIO I2C USB ADC SIM1 interface(with SIM card detection) SIM2 interface(with SIM card detection) CONTROL Power Supply RF_Main_Path Diversity_RX GNSS_Path 2 9 1 1 1 4 4 1 4 2 3 3 3 1 5 1 5 1 1 1 1 1 1 1 1 GPIO PCM/GPIO STATUS/GPIO SIM_SWITCH/GPIO Fast Shutdown/GPIO Serial Interface/GPIO Serial Interface/GPIO Power Indicator Serial Interface 0 I2C USB ADC SIM1 Card SIM2 Card IGT EMERG_RST VGNSS Base Band Power RF Power Main Antenna Diversity Antenna GNSS Antenna Digital Audio PCM(I2S) Interface&MCLK 1 GNSS_DC Figure 1: PLS83-W system overview t PLS83-W_HIO_v00.860 Confidential / Preliminary 2021-02-18 Cinterion PLS83-W Hardware Interface Overview 2 Interface Characteristics 31 2 Interface Characteristics Page 12 of 61 PLS83-W is equipped with an SMT application interface that connects to the external applica-
tion. The SMT application interface incorporates the various application interfaces as well as the RF antenna interface. 2.1 Application Interface 2.1.1 USB Interface PLS83-W supports a USB 2.0 High Speed (480Mbit/s) device interface that is Full Speed
(12Mbit/s) compliant. The USB I/O pins are capable of driving the signal at min 3.0V. The im-
pedances, serial and pull up resistors are implemented according to Universal Serial Bus Specification Revision 2.01, No further additional components are required. The external application is responsible for supplying the VUSB_IN line. This line is used for ca-
ble detection only. The USB part (driver and transceiver) is supplied by means of BATT+. This is because PLS83-W is designed as a self-powered device compliant with the Universal Serial Bus Specification Revision 2.0. Module SMT VREG (3V075) lin. reg. USB part1) VBUS DP DN Detection only RS RS BATT+
GND VUSB_IN USB_DP2) USB_DN2) 1) All serial (including RS) and pull-up resistors for data lines are implemented. 2) If the USB interface is operated in High Speed mode (480MHz), it is recommended to take special care routing the data lines USB_DP and USB_DN. Application layout should in this case implement a differential impedance of 90 ohms for proper signal integrity. Figure 2: USB circuit To properly connect the module's USB interface to the external application, a USB 2.0 compat-
ible connector and cable or hardware design is required. For more information on the USB re-
lated signals see Table 3. Furthermore, the USB modem driver distributed with PLS83-W needs to be installed. 1. The specification is ready for download on http://www.usb.org/developers/docs/
t PLS83-W_HIO_v00.860 Confidential / Preliminary 2021-02-18 Cinterion PLS83-W Hardware Interface Overview 2.1 Application Interface 31 Page 13 of 61 While a USB connection is active, the module will never switch to SLEEP mode. Only if the USB interface is in Suspend mode, the module is able to switch to SLEEP mode. 2.1.2 Serial Interface ASC0 PLS83-W offers an 8-wire unbalanced, asynchronous modem interface ASC0 conforming to ITU-T V.24 protocol DCE signaling. The electrical characteristics do not comply with ITU-T V.28. The significant levels are 0V (for low data bit or active state) and 1.8V (for high data bit or inactive state). For electrical characteristics please refer to Table 3. PLS83-W is designed for use as a DCE. Based on the conventions for DCE-DTE connections it communicates with the customer application (DTE) using the following signals:
Port TXD @ application sends data to the modules TXD0 signal line Port RXD @ application receives data from the modules RXD0 signal line Figure 3: Serial interface ASC0 Features:
Includes the data lines TXD0 and RXD0, the status lines RTS0 and CTS0 and, in addition, the modem control lines DTR0, DSR0, DCD0 and RING0. The RING0 signal serves to indicate incoming calls and other types of URCs (Unsolicited Result Code). It can also be used to send pulses to the host application, for example to wake up the application from power saving state. Configured for 8 data bits, no parity and 1 stop bit. ASC0 can be operated at fixed bit rates from 300bps up to 921600bps. Supports RTS0/CTS0 hardware flow control. The hardware hand shake line RTS0 has an internal pull down resistor causing a low level signal, if the line is not used and open. Although hardware flow control is recommended, this allows communication by using only RXD and TXD lines. Note: The ASC0 modem control lines DTR0, DCD0, DSR0 and RING0 can also be configured as GPIO lines. If configured as GPIO lines, these GPIO lines are assigned as follows:
GPIO1-->DTR0 GPIO2-->DCD0 GPIO3-->DSR0 GPIO24-->RING0 t PLS83-W_HIO_v00.860 Confidential / Preliminary 2021-02-18 Cinterion PLS83-W Hardware Interface Overview 2.1 Application Interface 31 Page 14 of 61 Configuration is done by AT command (see [1]). The configuration is non-volatile and becomes active after a module restart. Notes: No data must be sent over the ASC0 interface before the interface is active and ready to receive data (see Section 3.1.1). 2.1.3 Serial Interface ASC1 Four PLS83-W GPIO lines can be configured as ASC1 interface signals to provide a 4-wire un-
balanced, asynchronous modem interface ASC1 conforming to ITU-T V.24 protocol DCE sig-
nalling. The electrical characteristics do not comply with ITU-T V.28. The significant levels are 0V (for low data bit or active state) and 1.8V (for high data bit or inactive state). For electrical characteristics please refer to Table 3. PLS83-W is designed for use as a DCE. Based on the conventions for DCE-DTE connections it communicates with the customer application (DTE) using the following signals:
Port TXD @ application sends data to modules TXD1 signal line Port RXD @ application receives data from the modules RXD1 signal line Figure 4: Serial interface ASC1 Features Includes only the data lines TXD1 and RXD1 plus RTS1 and CTS1 for hardware hand-
shake. On ASC1 no RING line is available. Configured for 8 data bits, no parity and 1 or 2 stop bits. ASC1 can be operated at fixed bit rates from 300 bps to 921,600bps and 3Mbps Supports RTS1/CTS1 hardware flow. The hardware hand shake line RTS0 has an internal pull down resistor causing a low level signal, if the line is not used and open. Although hard-
ware flow control is recommended, this allows communication by using only RXD and TXD lines. Notes: The ASC1 interface lines are originally available as GPIO lines. If configured as ASC1 lines, the GPIO lines are assigned as follows:
GPIO16-->RXD1 GPIO17-->TXD1 GPIO18-->RTS1 GPIO19-->CTS1 Configuration is done by AT command (see [1]). The configuration is non-volatile and becomes active after a module restart. t PLS83-W_HIO_v00.860 Confidential / Preliminary 2021-02-18 Cinterion PLS83-W Hardware Interface Overview 2.1 Application Interface 31 2.1.4 UICC/SIM/USIM Interface Page 15 of 61 PLS83-W has two UICC/SIM/USIM interfaces (includes eSIM interface) compatible with the 3GPP 31.102 and ETSI 102 221. These are wired to the host interface in order to be connected to an external SIM card holder. Five pads on the SMT application interface are reserved for each of the two SIM interfaces. The UICC/SIM/USIM interface supports 3V and 1.8V SIM cards. Please refer to Table 1 for electrical specifications of the UICC/SIM/USIM interface lines depending on whether a 3V or 1.8V SIM card is used. The CCINx signal serves to detect whether a tray (with SIM card) is present in the card holder. Using the CCINx signal is mandatory for compliance with the GSM 11.11 recommendation if the mechanical design of the host application allows the user to remove the SIM card during operation. Table 1: Signals of the SIM interface (SMT application interface) Signal Description Ground connection for SIM interfaces. Optionally a separate SIM ground line using e.g., pad N11, may be used to improve EMC. Chipcard clock lines for 1st and 2nd SIM interface. SIM supply voltage lines for 1st and 2nd SIM interface. Serial data lines for 1st and 2nd SIM interface, input and output. Chipcard reset lines for 1st and 2nd SIM interface. Input on the baseband processor for detecting a SIM card tray in the holder. If the SIM is removed during operation the SIM interface is shut down immediately to prevent destruc-
tion of the SIM. The CCINx signal is active low. The CCINx signal is mandatory for applications that allow the user to remove the SIM card during operation. The CCINx signal is solely intended for use with a SIM card. It must not be used for any other purposes. Failure to comply with this requirement may invalidate the type approval of PLS83-W. Note: No guarantee can be given, nor any liability accepted, if loss of data is encountered after removing the SIM card during operation. Also, no guarantee can be given for properly initializ-
ing any SIM card that the user inserts after having removed the SIM card during operation. In this case, the application must restart PLS83-W. By default, only the modules 1st SIM interface is available and can be used. The usage of the modules 2nd SIM interface has to be configured by AT command. As an alternative to connecting the modules two SIM interfaces and switching between these via AT command, it is possible to connect the first of the modules SIM interfaces via an external SIM switch that in turn provides access to a further SIM interface. For details see Section 2.1.4.1. GND CCCLK1 CCCLK2 CCVCC1 CCVCC2 CCIO1 CCIO2 CCRST1 CCRST2 CCIN1 CCIN2 t PLS83-W_HIO_v00.860 Confidential / Preliminary 2021-02-18 Cinterion PLS83-W Hardware Interface Overview 2.1 Application Interface 31 Page 16 of 61 Module 1st SIMinterface 2nd SIMinterface SIM1 SIM2
. Figure 5: Modules two UICC/SIM/USIM interfaces Figure 6: UICC/SIM/USIM interfaces connected The total cable length between the SMT application interface pads on PLS83-W and the pads of the external SIM card holder must not exceed 100mm in order to meet the specifications of 3GPP TS 51.010-1 and to satisfy the requirements of EMC compliance. To avoid possible cross-talk from the CCCLKx signal to the CCIOx signal be careful that both lines are not placed closely next to each other. A useful approach is using the GND line to shield the CCIOx line from the CCCLKx line. t PLS83-W_HIO_v00.860 Confidential / Preliminary 2021-02-18 Cinterion PLS83-W Hardware Interface Overview 2.1 Application Interface 31 Page 17 of 61 2.1.4.1 SIM_SWITCH Line As an alternative to connecting the modules two SIM interfaces and switching between these interfaces by means of AT command, it is possible to connect the first of the modules SIM in-
terfaces via an external SIM switch that in turn provides access to a further SIM interface. Module 1st SIMinterface GPIO26/
SIM_SWITCH Switch SIM1A SIM1B Figure 7: External UICC/SIM/USIM switch The modules GPIO26 line can in this case be configured as SIM_SWITCH line in order to con-
trol the external SIM switch as shown in the sample circuit in Figure 8. A low state would then indicate the usage of the first SIM interface (SIM1A), a high state would indicate the usage of the second interface (SIM1B). The configuration of the SIM_SWITCH (GPIO26) line is done via AT command, is non-volatile, and available after the next module restart. External Application Module SIM1A ESD protection IF1 Sim Switch COMMON SIMSELECT FSA2567 ESD protection IF2 SIM1B VBAT 10k 22k 100k VSIM1 CCCLK1 CCIO1 CCRST1 SIM_ SWITCH CCIN1 Figure 8: Sample circuit for SIM interface connection via SIM switch t PLS83-W_HIO_v00.860 Confidential / Preliminary 2021-02-18 GPIO GPIO1 GPIO2 GPIO3 GPIO4 GPIO5 GPIO6 GPIO7 GPIO8 GPIO11 GPIO12 GPIO13 GPIO14 GPIO15 GPIO16 GPIO17 GPIO18 GPIO19 GPIO20 GPIO21 GPIO24 GPIO25 GPIO26 Cinterion PLS83-W Hardware Interface Overview 2.1 Application Interface 31 Page 18 of 61 2.1.5 GPIO Interface The following table shows the configuration variants for the GPIO pads. All variants are mutu-
ally exclusive, i.e. a pad configured for instance as Status LED is locked for alternative usage. Table 2: GPIO lines and possible alternative assignment Fast Shutdown Status LED ASC0 ASC1 SIM SWITCH DAI DTR0 DCD0 DSR0 FST_SHDN Status LED RXD1 TXD1 RTS1 CTS1 RING0 DOUT DIN SIM_SWITCH 2.1.6 Digital Audio Interface PLS83-W supports one digital audio interface that can be deployed as PCM. Inter_IC Sound
(I2S) interface is under development. 2.1.6.1 Pulse Code Modulation Interface PLS83-Ws PCM interface can be used to connect audio devices capable of pulse code modulation. The PCM functionality is limited to the use of wideband codec with 16kHz sample rate only. The PCM interface runs at 16kHz sample rate (62.5s frame length), while the signal processing maintains this rate in a wideband AMR call or samples automatically down t PLS83-W_HIO_v00.860 Confidential / Preliminary 2021-02-18 Cinterion PLS83-W Hardware Interface Overview 2.1 Application Interface 31 Page 19 of 61 to 8kHz in a narrowband call. Therefore, the PCM sample rate is independent of the audio bandwidth of the call. The PCM interface has the following characteristics:
Master mode Table 3 lists the available PCM interface signals. Long frame synchronization 16kHz/8kHz sample rate 512 kHz bit clock at 16kHz sample rate 256 kHz bit clock at 8kHz sample rate Table 3: Overview of PCM pin functions Signal name Signal direction master Description DOUT DIN FSC BCLK MCLK O I O O
PCM Data from PLS83-W to external codec. PCM Data from external codec to PLS83-W. Frame synchronization signal to external codec. Bit clock to external codec. Note: If the BCLK2 signal is permanently provided (AT^SAIC parameter <clk_mode> = 0), the module will no longer enter its power save (SLEEP) state. Audio master clock. Be synchronous to BCLK to use in external codec. Can be switched on and off. Note: PCM data is always formatted as 16-bit uncompressed twos complement. Also, all PCM data and frame synchronization signals are written to the PCM bus on the rising clock edge and read on the falling edge. 2.1.6.2 Inter-IC Sound Interface (TBD) The I2S Interface is a standardized bidirectio zonal I2S based digital audio interface for trans-
mission of mono voice signals for telephony services. The I2S properties and capabilities comply with the requirements lay out in the Phillips I2S Bus Specifications, revised June 5, 1996. The I2S interface has the following characteristics:
Bit clock mode: Master Sampling rate: 8kHz (narrowband), 16kHz (wideband) 256kHz bit clock at 8kHz sample rate 512kHz bit clock at 16kHz sample rate t PLS83-W_HIO_v00.860 Confidential / Preliminary 2021-02-18 Cinterion PLS83-W Hardware Interface Overview 2.1 Application Interface 31 Page 20 of 61 Table 4 lists the available I2S interface signals Table 4: Overview of I2S pin functions Signal name on SMT application interface Signal configura-
tion inactive Signal direction Master Description I2S data from PLS83-W to external codec I2S data from external codec to PLS83-W Frame synchronization signal to/
from external codec Word align-
ment (WS) Bit clock to external codec. BCLK signal low/high time varies between 45% and 55% of its clock period. DOUT DIN FSC BCLK PD PD PD PU O I O O 2.1.7 Control Signals 2.1.7.1 Status LED The GPIO5 interface line can be configured to drive a status LED that indicates different oper-
ating mode (for GPIOs see 2.1.5). GPIO and LED functionality are mutually exclusive. To take advantage of this function connect an LED to the GPIO5/STATUS line as shown in Figure 9 VCC LED R3 STATUS R1 R2 GND GND Figure 9: Status signaling with LED driver t PLS83-W_HIO_v00.860 Confidential / Preliminary 2021-02-18 Cinterion PLS83-W Hardware Interface Overview 2.1 Application Interface 31 Page 21 of 61 2.1.7.2 Power Indication The power indication signal PWR_IND notifies the on/off state of the module. High state of PWR_IND indicates that the module is switched off. The state of PWR_IND immediately changes to low when IGT is pulled low. For state detection an external pull-up resistor is re-
quired. Module Power supply On/Off
(open drain driver) e.g. BATT+
e c a f r e t n i T M S PWR_IND Figure 10: Power indication signal t PLS83-W_HIO_v00.860 Confidential / Preliminary 2021-02-18 Cinterion PLS83-W Hardware Interface Overview 2.2 RF Antenna Interface 31 Page 22 of 61 2.2 RF Antenna Interface The PLS83-W GSM/UMTS/LTE antenna interface comprises a GSM/UMTS/LTE main antenna as well as a UMTS/LTE Rx diversity antenna to improve signal reliability and quality1. The RF interface has an impedance of 50. PLS83-W is capable of sustaining a total mismatch at the antenna line without any damage, even when transmitting at maximum RF power. The external antenna must be matched properly to achieve best performance regarding radi-
ated power, modulation accuracy and harmonic suppression. Antenna matching networks are not included on the PLS83-W module and should be placed in the host application if the anten-
na does not have an impedance of 50. Regarding the return loss PLS83-W provides the following values in the active band:
Table 5: Return loss in the active band State of module Return loss of module Recommended return loss of application Receive Transmit
> 8dB not applicable
> 12dB
> 12dB 1. By delivery default the UMTS/LTE Rx diversity antenna is configured as available for the module since its usage is mandatory for LTE. Please refer to [1] for details on how to configure antenna settings. t PLS83-W_HIO_v00.860 Confidential / Preliminary 2021-02-18 Cinterion PLS83-W Hardware Interface Overview 2.2 RF Antenna Interface 31 Page 23 of 61 2.2.1 Antenna Installation The antenna is connected by soldering the antenna pads (ANT_MAIN, ANT_DRX and ANT_GNSS) and their neighboring ground pads directly to the applications PCB. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 K ANT_ MAIN GND GND GND E ANT_ GNSS GND P N M L J H G F D C B A GND ANT_ DRX GND Figure 11: Antenna pads (bottom view) The distance between the antenna pads and their neighboring GND pads has been optimized for best possible impedance. To prevent mismatch, special attention should be paid to these pads on the application PCB. The wiring of the antenna connection, starting from the antenna pad to the applications anten-
na should result in a 50 line impedance. Line width and distance to the GND plane need to be optimized with regard to the PCBs layer stack. Some examples are given in Section 2.2.2. To prevent receiver desensitization due to interferences generated by fast transients like high speed clocks on the external application PCB, it is recommended to realize the antenna con-
nection line using embedded Stripline rather than Micro-Stripline technology. Please see Sec-
tion 2.2.2 for examples of how to design the antenna connection in order to achieve the required 50 line impedance. For type approval purposes, the use of a 50 coaxial antenna connector (U.FL-R-SMT) might be necessary. In this case the U.FL-R-SMT connector should be placed as close as possible to PLS83-Ws antenna pad. t PLS83-W_HIO_v00.860 Confidential / Preliminary 2021-02-18 Cinterion PLS83-W Hardware Interface Overview 2.2 RF Antenna Interface 31 2.2.2 RF Line Routing Design 2.2.2.1 Line Arrangement Examples Page 24 of 61 Several dedicated tools are available to calculate line arrangements for specific applications and PCB materials - for example from http://www.polarinstruments.com/ (commercial software) or from http:www.awr.com/awr-software/options/tx-line/ (free software). Embedded Stripline This figure below shows a line arrangement example for embedded stripline with 65m FR4 prepreg (type: 1080) and 710m FR4 core (4-layer PCB). Figure 12: Embedded Stripline with 65m prepreg (1080) and 710m core t PLS83-W_HIO_v00.860 Confidential / Preliminary 2021-02-18 Cinterion PLS83-W Hardware Interface Overview 2.2 RF Antenna Interface 31 Page 25 of 61 Micro-Stripline This section gives two line arrangement examples for micro-stripline. Micro-Stripline on 1.0mm Standard FR4 2-Layer PCB The following two figures show examples with different values for D1 (ground strip separa-
tion). Application board Ground line Antenna line Ground line Figure 13: Micro-Stripline on 1.0mm standard FR4 2-layer PCB - example 1 t PLS83-W_HIO_v00.860 Confidential / Preliminary 2021-02-18 Cinterion PLS83-W Hardware Interface Overview 2.2 RF Antenna Interface 31 Page 26 of 61 Application board Ground line Antenna line Ground line Figure 14: Micro-Stripline on 1.0mm Standard FR4 PCB - example 2 t PLS83-W_HIO_v00.860 Confidential / Preliminary 2021-02-18 Cinterion PLS83-W Hardware Interface Overview 2.2 RF Antenna Interface 31 Page 27 of 61 Micro-Stripline on 1.5mm Standard FR4 2-Layer PCB The following two figures show examples with different values for D1 (ground strip separa-
tion). Application board Ground line Antenna line Ground line Figure 15: Micro-Stripline on 1.5mm Standard FR4 PCB - example 1 t PLS83-W_HIO_v00.860 Confidential / Preliminary 2021-02-18 Cinterion PLS83-W Hardware Interface Overview 2.2 RF Antenna Interface 31 Page 28 of 61 Application board Ground line Antenna line Ground line Figure 16: Micro-Stripline on 1.5mm Standard FR4 PCB - example 2 t PLS83-W_HIO_v00.860 Confidential / Preliminary 2021-02-18 Cinterion PLS83-W Hardware Interface Overview 2.2 RF Antenna Interface 31 Page 29 of 61 2.2.2.2 Routing Example Interface to RF Connector Figure 17 shows a sample connection of a modules antenna pad at the bottom layer of the module PCB with an application PCBs coaxial antenna connector. Line impedance depends on line width, but also on other PCB characteristics like dielectric, height and layer gap. The sample stripline width of 0.33mm is recommended for an application with a PCB layer stack resembling the one of the PLS83-W evaluation board shown in Figure 18. For different layer stacks the stripline width will have to be adapted accordingly. G N D G N D e.g. ANT_ MAIN Stripline (50 ohms) on top layer of evaluation board from antenna pad to module edge Width = 0.33 mm Ground connection Edge of module PCB 50 ohms microstrip line E.g., U.FL antenna connector G N D G N D Figure 17: Routing to applications RF connector Figure 18: PLS83-W evaluation board layer table t PLS83-W_HIO_v00.860 Confidential / Preliminary 2021-02-18 Cinterion PLS83-W Hardware Interface Overview 2.3 GNSS Antenna Interface 31 2.3 GNSS Antenna Interface Page 30 of 61 In addition to the RF antenna interface PLS83-W also has a GNSS antenna interface. The GNSS pads shape is the same as for the RF antenna interface (see Section 2.2.1). It is possible to connect active or passive GNSS antennas. In either case they must have 50 impedance. The simultaneous operation of GSM/UMTS/LTE and GNSS is implemented. PLS83-W provides the signal VGNSS to enable an active GNSS antenna power supply. Figure 19 shows the flexibility in realizing the power supply for an active GNSS antenna by giving a sample circuit realizing the supply voltage for an active GNSS antenna. Module Application:
GNSS Receiver Antenna Matching ANT_GNSS ANT_GNSS_DC RF DC DC LNA Active GNSS Antenna BATT+
VGNSS
(3.2V) VGNSS IN OUT EN LDO LP3985IM5-3.2 Rs Is 1R0 Rv 100
Io Current Sensor FAN4010 Io Rg 3k3 ADCx_IN Si1023X_1 10k 1u ESD Protection Si1023X_2 10k Ug Figure 19: Supply voltage for active GNSS antenna t PLS83-W_HIO_v00.860 Confidential / Preliminary 2021-02-18 Cinterion PLS83-W Hardware Interface Overview 2.3 GNSS Antenna Interface 31 Page 31 of 61 Figure 20 shows a sample circuit realizing ESD protection for a passive GNSS antenna. Con-
necting the input ANT_GNSS_DC to GND prevents ESD from coupling into the module. Module SMT interface VGNSS Not used 100nF 22p+
100n ANT_GNSS_DC 10nH ANT_GNSS To GNSS receiver
(Optional) ESD protection 0R Passive GNSS antenna Figure 20: ESD protection for passive GNSS antenna 2.3.1 GNSS Antenna Diagnostic GNSS antenna diagnosis does require an external detection circuit. The antenna DC supply current can be measured via ADCx_IN. The ADCx_IN input voltage (Ug) may be generated by a sample circuit shown in Figure 19. The circuit allows to check the presence and the connec-
tion status of an active GNSS antenna. Passive GNSS antennas cannot be detected. There-
fore, GNSS antenna detection is only available in active GNSS antenna mode. This mode is configured by the AT command: AT^SGPSC (for details see [1]) Having enabled the active GNSS antenna mode the presence and connection status of an ac-
tive GNSS antenna can be checked using the AT command AT^SRADC to monitor ADCx_IN. The following table lists sample current ranges for possible antenna states as well as sample voltage ranges as possible decision thresholds to distinguish between the antenna connection states. Please refer to [1] for more information on the command AT^SRADC. Table 6: Sample ranges of the GNSS antenna diagnostic measurements and their possible meaning Antenna connection status Antenna not connected Decision threshold Antenna connected Decision threshold Current ranges (IS)1
<1.4mA Voltage ranges (UG) 2.2mA...20mA 59mV 20%
825mV 20%
Antenna short circuited to ground
>30mA GNSS antenna detection is not possible because GNSS antenna power supply is switched off.
1. Please note that the mA ranges 1.4mA...2.2mA and 20mA...30mAare tolerance ranges. The decision threshold should be defined within these ranges. t PLS83-W_HIO_v00.860 Confidential / Preliminary 2021-02-18 Cinterion PLS83-W Hardware Interface Overview 3 Operating Characteristics 32 3 Operating Characteristics 3.1 Power Supply Page 32 of 61 PLS83-W needs to be connected to a power supply at the SMT application interface - 4 lines BATT+, and GND. There are two separate voltage domains for BATT+:
BATT+BB with two lines for the general power management. BATT+RF with two lines for the RF. Please note that throughout the document BATT+ refers to both voltage domains and power supply lines - BATT+BB and BATT+RF. The main power supply from an external application has to be a single voltage source and has to be expanded to sub paths (star structure). 150F capacitors should be placed as close as possible to the BATT+ pads. Figure 21 shows a sample circuit for decoupling capacitors for BATT+. Module SMT interface BATT+BB BATT+RF 2 2 150F low ESR capacitors BATT+
GND Figure 21: Decoupling capacitor(s) for BATT+
The power supply of PLS83-W must be able to provide the peak current during the uplink trans-
mission. All the key functions for supplying power to the device are handled by the power management section of the analog controller. This IC provides the following features:
Stabilizes the supply voltages for the baseband using low drop linear voltage regulators and DC-DC step down switching regulators. Switches the module's power voltages for the power-up and -down procedures. SIM switch to provide SIM power supply. t PLS83-W_HIO_v00.860 Confidential / Preliminary 2021-02-18 Cinterion PLS83-W Hardware Interface Overview 4 Mechanical Dimensions, Mounting and Packaging 36 Page 33 of 61 4 Mechanical Dimensions, Mounting and Packaging 4.1 Mechanical Dimensions of PLS83-W Figure 22 shows the top and bottom view of PLS83-W and provides an overview of the board's mechanical dimensions. For further details see Figure 22. t PLS83-W_HIO_v00.860 Confidential / Preliminary 2021-02-18 Cinterion PLS83-W Hardware Interface Overview 4.1 Mechanical Dimensions of PLS83-W 36 Page 34 of 61 Top view Bottom View Figure 22: PLS83-W top and bottom view t PLS83-W_HIO_v00.860 Confidential / Preliminary 2021-02-18 Cinterion PLS83-W Hardware Interface Overview 4.1 Mechanical Dimensions of PLS83-W 36 Page 35 of 61 Figure 23: Dimensions of PLS83-W (all dimensions in mm) t PLS83-W_HIO_v00.860 Confidential / Preliminary 2021-02-18 Cinterion PLS83-W Hardware Interface Overview 4.1 Mechanical Dimensions of PLS83-W 36 Page 36 of 61 Figure 24: Dimensions of PLS83-W (keepout area recommended) t PLS83-W_HIO_v00.860 Confidential / Preliminary 2021-02-18 Cinterion PLS83-W Hardware Interface Overview 5 Regulatory and Type Approval Information 44 Page 37 of 61 5 Regulatory and Type Approval Information 5.1 Directives and Standards PLS83-W is designed to comply with the directives and standards listed below. It is the responsibility of the application manufacturer to ensure compliance of the final product with all provisions of the applicable directives and standards as well as with the technical spec-
ifications provided in the "PLS83-W Hardware Interface Description.1 Table 7: Directives 2014/53/EU Directive of the European Parliament and of the council of 16 April 2014 on the harmonization of the laws of the Member States relating to the making available on the market of radio equipment and repealing Directive 1999/
05/EC. 2002/95/EC (RoHS 1) 2011/65/EC (RoHS 2) The product is labeled with the CE conformity mark. Directive of the European Parliament and of the Council of 27 January 2003 (and revised on 8 June 2011) on the restriction of the use of certain hazardous substances in electrical and electronic equipment (RoHS) Table 8: Standards of North American type approval CFR Title 47 Code of Federal Regulations, Part 22, Part 24; US Equipment Authorization FCC OET Bulletin 65
(Edition 97-01) Evaluating Compliance with FCC Guidelines for Human Exposure to Radiofrequency Electromagnetic Fields UL 60 950-1 Product Safety Certification (Safety requirements) NAPRD.03 V6.1 Overview of PCS Type certification review board Mobile Equipment Type Certification and IMEI control PCS Type Certification Review board (PTCRB) RSS132 (Issue2) RSS133 (Issue5) Canadian Standard Table 9: Standards of European type approval 3GPP TS 51.010-1 Digital cellular telecommunications system (Release 7); Mobile Station
(MS) conformance specification;
GCF-CC V3.79 Global Certification Forum - Certification Criteria ETSI EN 301 511 V12.5.1 Global System for Mobile communications (GSM); Mobile Stations (MS) equipment; Harmonized Standard covering the essential requirements of article 3.2 of Directive 2014/53/EU ETSI EN 301 908-01 V13.1.1 IMT cellular networks; Harmonized Standard covering the essential require-
ments of article 3.2 of the Directive 2014/53/EU; Part 1: Introduction and common requirements 1. Manufacturers of applications which can be used in the US shall ensure that their applications have a PTCRB approval. For this purpose they can refer to the PTCRB approval of the respective module. t PLS83-W_HIO_v00.860 Confidential / Preliminary 2021-02-18 Cinterion PLS83-W Hardware Interface Overview 5.1 Directives and Standards 44 Table 9: Standards of European type approval Page 38 of 61 ETSI EN 301 908-02 V11.1.2 IMT cellular networks; Harmonized Standard covering the essential require-
ments of article 3.2 of the Directive 2014/53/EU; Part 2: CDMA Direct Spread (UTRA FDD) User Equipment (UE) ETSI EN 301 489-52 V1.1.0 Electromagnetic Compatibility (EMC) standard for radio equipment and ser-
vices; Part 52: Specific conditions for Cellular Communication Mobile and portable (UE) radio and ancillary equipment; Harmonized Standard cover-
ing the essential requirements of article 3.1(b) of Directive 2014/53/EU ETSI EN 301 908-13 V13.1.1 IMT cellular networks; Harmonized Standard covering the essential require-
ments of article 3.2 of the Directive 2014/53/EU; Part 13: evolved Universal Terrestrial Radio Access (E-UTRA) User Equipment (UE). Draft ETSI EN 301 489-
01 V2.2.3 ETSI EN 301489-19 V2.1.1 ETSI EN 303 413 V1.1.1 Electromagnetic Compatibility (EMC) standard for radio equipment and ser-
vices; Part 1: Common technical requirements; Harmonized Standard cov-
ering the essential requirements of article 3.1(b) of Directive 2014/53/EU and the essential requirements of article 6 of Directive 2014/30/EU ElectroMagnetic Compatibility (EMC) standard for radio equipment and ser-
vices; Part 19: Specific conditions for Receive Only Mobile Earth Stations
(ROMES) operating in the 1,5 GHz band providing data communications and GNSS receivers operating in the RNSS band (ROGNSS) providing positioning, navigation, and timing data; Harmonised Standard covering the essential requirements of article 3.1(b) of Directive 2014/53/EU Satellite Earth Stations and Systems (SES); Global Navigation Satellite System (GNSS) receivers; Radio equipment operating in the 1 164 MHz to 1 300 MHz and 1 559 MHz to 1 610 MHz frequency bands; Harmonised Standard covering the essential requirements of article 3.2 of Directive 2014/53/EU EN 62368-1:2014 +
A11:2017 Audio/video, information and communication technology equipment -
Part 1: Safety requirements Table 10: Requirements of quality IEC 60068 Environmental testing DIN EN 60529 IP codes EN 62311:2008 Assessment of electronic and electrical equipment related to human expo-
sure restrictions for electromagnetic fields (0 Hz - 300 GHz) Table 11: Standards of the Ministry of Information Industry of the Peoples Republic of China SJ/T 11363-2006 SJ/T 11364-2006 Requirements for Concentration Limits for Certain Hazardous Sub-
stances in Electronic Information Products (2006-06). Marking for Control of Pollution Caused by Electronic Information Products (2006-06). According to the Chinese Administration on the Control of Pollution caused by Electronic Information Products
(ACPEIP) the EPUP, i.e., Environmental Protection Use Period, of this product is 20 years as per the symbol shown here, unless otherwise marked. The EPUP is valid only as long as the product is operated within the operating limits described in the Thales Hardware Interface Description. Please see Table 12 for an overview of toxic or hazardous substances or elements that might be contained in product parts in concentrations above the limits defined by SJ/T 11363-2006. t PLS83-W_HIO_v00.860 Confidential / Preliminary 2021-02-18 Cinterion PLS83-W Hardware Interface Overview 5.1 Directives and Standards 44 Page 39 of 61 Table 12: Toxic or hazardous substances or elements with defined concentration limits t PLS83-W_HIO_v00.860 Confidential / Preliminary 2021-02-18 Cinterion PLS83-W Hardware Interface Overview 5.2 SAR requirements specific to portable mobiles 44 Page 40 of 61 5.2 SAR requirements specific to portable mobiles Mobile phones, PDAs or other portable transmitters and receivers incorporating a GSM/UMTS module must be in accordance with the guidelines for human exposure to radio frequency en-
ergy. This requires the Specific Absorption Rate (SAR) of portable PLS83-W based applica-
tions to be evaluated and approved for compliance with national and/or international regulations. Since the SAR value varies significantly with the individual product design manufacturers are advised to submit their product for approval if designed for portable use. For European/US/Aus-
tralian-markets the relevant directives are mentioned below. It is the responsibility of the man-
ufacturer of the final product to verify whether or not further standards, recommendations or directives are in force outside these areas. Products intended for sale on US markets ES 59005/ANSI C95.1 Considerations for evaluation of human exposure to Electromagnetic Fields (EMFs) from Mobile Telecommunication Equipment (MTE) in the frequency range 30MHz - 6GHz Products intended for sale on European markets EN 50360 EN 62311:2008 Product standard to demonstrate the compliance of mobile phones with the basic restrictions related to human exposure to electromagnetic fields (300MHz - 3GHz) Assessment of electronic and electrical equipment related to human expo-sure restrictions for electromagnetic fields (0 Hz - 300 GHz) Please note that SAR requirements are specific only for portable devices and not for mobile devices as defined below:
Portable device:
A portable device is defined as a transmitting device designed to be used so that the radi-
ating structure(s) of the device is/are within 20 centimeters of the body of the user. Mobile device:
A mobile device is defined as a transmitting device designed to be used in other than fixed locations and to generally be used in such a way that a separation distance of at least 20 centimeters is normally maintained between the transmitter's radiating structure(s) and the body of the user or nearby persons. In this context, the term ''fixed location'' means that the device is physically secured at one location and is not able to be easily moved to another location. t PLS83-W_HIO_v00.860 Confidential / Preliminary 2021-02-18 Cinterion PLS83-W Hardware Interface Overview 5.3 Reference Equipment for Type Approval 44 Page 41 of 61 5.3 Reference Equipment for Type Approval The Thales reference setup submitted to type approve PLS83-W (including a special approval adapter for the DSB75) is shown in the following figure1:
LTE/GPRS/UMTS BaseStation Diversity Antenna Main Antenna USB ASC0 PC Power Supply AH6Adapter SIMCard SMA SMA SMA USB DSB75 Eval_Board Eval_Board PLSx3 PLSx3 Figure 25: Reference equipment for Type Approval 1. For RF performance tests a mini-SMT/U.FL to SMA adapter with attached 6dB coaxial attenuator is cho-
sen to connect the evaluation module directly to the GSM/UMTS test equipment instead of employing the SMA antenna connectors on the PLS83-W-DSB75 adapter as shown in Figure 25. The following products are recommended:
Hirose SMA-Jack/U.FL-Plug conversion adapter HRMJ-U.FLP(40)
(for details see http://www.hirose-connectors.com/ or http://www.farnell.com/
Aeroflex Weinschel Fixed Coaxial Attenuator Model 3T/4T
(for details see http://www.aeroflex.com/ams/weinschel/pdfiles/wmod3&4T.pdf) t PLS83-W_HIO_v00.860 Confidential / Preliminary 2021-02-18 Cinterion PLS83-W Hardware Interface Overview 5.4 Compliance with FCC/IC/ISED Rules and Regulations 44 Page 42 of 61 5.4 Compliance with FCC/IC/ISED Rules and Regulations The Equipment Authorization Certification for the Thales reference application described in Section 5.3 will be registered under the following identifiers:
FCC Identifier: QIPPLS83-W ISED Certification Number: 7830A-PLS83W Granted to THALES DIS AIS Deutschland GmbH Manufacturers of mobile or fixed devices incorporating PLS83-W modules are authorized to use the FCC Grants and ISED Certificates of the PLS83-W modules for their own final products according to the conditions referenced in these documents. In this case, an FCC/IC label of the module shall be visible from the outside, or the host device shall bear a second label stating
"Contains FCC ID: QIPPLS83-W, and accordingly Contains IC: 7830A-PLS83W. The integra-
tion is limited to fixed or mobile categorized host devices, where a separation distance between the antenna and any person of min. 20cm can be assured during normal operating conditions. For moble and fixed operation configurations the antenna gain, including cable loss, must not exceed the limits listed in the following Table 13 for FCC and ISED. Table 13: Antenna gain limits for FCC and ISED Operation band FCC limit ISED limit Unit Maximum gain in GSM/GPRS 850 Maximum gain in PCS 1900 Maximum gain in WCDMA Band 2 Maximum gain in WCDMA Band 4 Maximum gain in WCDMA Band 5 Maximum gain in LTE Band 2 Maximum gain in LTE Band 4 Maximum gain in LTE Band 5 Maximum gain in LTE Band 7 Maximum gain in LTE Band 12 Maximum gain in LTE Band 13 Maximum gain in LTE Band 26 Maximum gain in LTE Band 38 Maximum gain in LTE Band 41 Maximum gain in LTE Band 66 8.60 10.20 8.01 5.00 9.40 8.01 5.00 9.40 8.01 8.70 9.16 9.30 8.01 8.01 5.00 5.30 10.20 8.01 5.00 6.10 8.01 5.00 6.10 8.01 5.61 5.93 6.10 8.01 8.01 5.00 dBi dBi dBi dBi dBi dBi dBi dBi dBi dBi dBi dBi dBi dBi dBi IMPORTANT:
Manufacturers of portable applications incorporating PLS83-W modules are required to have their final product certified and apply for their own FCC Grant related to the specific portable mobile. This is mandatory to meet the SAR requirements for portable mobiles (see Section 5.2 for detail). Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. t PLS83-W_HIO_v00.860 Confidential / Preliminary 2021-02-18 Cinterion PLS83-W Hardware Interface Overview 5.4 Compliance with FCC/IC/ISED Rules and Regulations 44 Page 43 of 61 Note: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:
Reorient or relocate the receiving antenna. Connect the equipment into an outlet on a circuit different from that to which the receiver is Increase the separation between the equipment and receiver. connected. Consult the dealer or an experienced radio/TV technician for help. This Class B digital apparatus complies with Canadian ICES-003. FCC Part 15.19 Warning Statement THIS DEVICE COMPLIES WITH PART 15 OF THE FCC RULES. OPERATION IS SUBJECT TO THE FOLLOWING TWO CONDITIONS: (1) THIS DEVICE MAY NOT CAUSE HARMFUL INTERFERENCE, AND (2) THIS DEVICE MUST ACCEPT ANY INTERFERENCE RECEIVED, INCLUDING INTERFER-
ENCE THAT MAY CAUSE UNDESIRED OPERATION. If Canadian approval is requested for devices incorporating PLS83-W modules the below notes will have to be provided in the English and French language in the final user documentation. Manufacturers/OEM Integrators must ensure that the final user documentation does not con-
tain any information on how to install or remove the module from the final product. Notes (IC):
(EN) This Class B digital apparatus complies with Canadian ICES-003 and RSS-210. Opera-
tion is subject to the following two conditions: (1) this device may not cause interference, and
(2) this device must accept any interference, including interference that may cause undesired operation of the device.
(FR) Cet appareil numrique de classe B est conforme aux normes canadiennes ICES-003 et RSS-210. Son fonctionnement est soumis aux deux conditions suivantes: (1) cet appareil ne doit pas causer d'interfrence et (2) cet appareil doit accepter toute interfrence, notamment les interfrences qui peuvent affecter son fonctionnement.
(EN) Radio frequency (RF) Exposure Information The radiated output power of the Wireless Device is below the Industry Canada (IC) radio fre-
quency exposure limits. The Wireless Device should be used in such a manner such that the potential for human contact during normal operation is minimized. This device has also been evaluated and shown compliant with the IC RF Exposure limits un-
der mobile exposure conditions. (antennas at least 20cm from a persons body).
(FR) Informations concernant l'exposltion aux frquences radio (RF) La puissance de sortie mise par l'appareil de sans fiI est infrieure la limite d'exposition aux frquences radio dIndustry Canada (IC). Utilisez l'appareil de sans fil de faon minimiser les contacts humains lors du fonctionnement normal. Ce priphrique a galement t valu et dmontr conforme aux limites d'exposition aux RF t PLS83-W_HIO_v00.860 Confidential / Preliminary 2021-02-18 Cinterion PLS83-W Hardware Interface Overview 5.4 Compliance with FCC/IC/ISED Rules and Regulations 44 Page 44 of 61 d'IC dans des conditions d'exposition des appareils mobiles (les antennes se situent moins de 20cm du corps d'une personne). t PLS83-W_HIO_v00.860 Confidential / Preliminary 2021-02-18 Cinterion PLS83-W Hardware Interface Overview 6 Document Information 49 Page 45 of 61 New document: "Cinterion PLS83-W Hardware Interface Overview" Version 00.860 6 Document Information 6.1 Revision History Chapter What is new
Initial document setup. 6.2 Related Documents
[1] PLS83-W AT Command Set
[2] PLS83-W Release Note
[3] Universal Serial Bus Specification Revision 2.0, April 27, 2000
[4] Application Note 48: SMT Module Integration
[5] Differences between Selected Cinterion Modules, Hardware Migration Guide ASC0/ASC1 Asynchronous Controller. Abbreviations used for first and second serial interface of PLS83-W 6.3 Terms and Abbreviations Abbreviation Description Analog-to-digital converter Automatic Gain Control American National Standards Institute ARFCN Absolute Radio Frequency Channel Number ARP Antenna Reference Point CB or CBM Cell Broadcast Message Conformit Europene (European Conformity) Challenge Handshake Authentication Protocol Thermistor Constant Bit Error Rate Bearer Independent Protocol Base Transceiver Station Central Processing Unit Coding Scheme Circuit Switched Data Clear to Send Digital-to-Analog Converter ADC AGC ANSI B BER BIP BTS CE CHAP CPU CS CSD CTS DAC dBm0 Digital level, 3.14dBm0 corresponds to full scale, see ITU G.711, A-law t PLS83-W_HIO_v00.860 Confidential / Preliminary 2021-02-18 Cinterion PLS83-W Hardware Interface Overview 6.3 Terms and Abbreviations 49 Page 46 of 61 Abbreviation Description Data Communication Equipment (typically modems, e.g. Thales module) DCE DRX DSB DSP DSR DTR DTX EFR EIRP EMC ERP ESD ETS ETSI FCC FDMA FR GMSK GPIO HiZ HR I/O IC IMEI ISO ITU kbps LED LPM Mbps MMI MO MS Discontinuous Reception Development Support Box Digital Signal Processor Data Set Ready Data Terminal Ready Discontinuous Transmission Enhanced Full Rate Equivalent Isotropic Radiated Power Electromagnetic Compatibility Effective Radiated Power Electrostatic Discharge European Telecommunication Standard European Telecommunication Standards Institute Federal Communications Commission (U.S.) Frequency Division Multiple Access Full Rate Gaussian Minimum Shift Keying General Purpose Input/Output High Impedance Half Rate Input/Output Integrated Circuit International Mobile Equipment Identity International Standards Organization International Telecommunications Union kbits per second Light Emitting Diode Lithium-Ion Link Power Management Mbits per second Man Machine Interface Mobile Originated Li-Ion/Li+
Li battery Rechargeable Lithium Ion or Lithium Polymer battery Mobile Station ( module), also referred to as TE MSISDN Mobile Station International ISDN number MT Mobile Terminated t PLS83-W_HIO_v00.860 Confidential / Preliminary 2021-02-18 Cinterion PLS83-W Hardware Interface Overview 6.3 Terms and Abbreviations 49 Page 47 of 61 Abbreviation Description Negative Temperature Coefficient Original Equipment Manufacturer Power Amplifier Password Authentication Protocol PBCCH Packet Switched Broadcast Control Channel Radio and Telecommunication Terminal Equipment Restriction of the use of certain hazardous substances in electrical and electronic equipment. NTC OEM PA PAP PCB PCL PDU PLL PPP PSK PSU PWM R&TTE RAM RF RLS RMS RoHS ROM RTC RTS Rx SAR SAW SELV SIM SMD SMS SMT SPI SRAM TA TDMA TE TLS Tx Printed Circuit Board Power Control Level Protocol Data Unit Phase Locked Loop Point-to-point protocol Phase Shift Keying Power Supply Unit Pulse Width Modulation Random Access Memory Radio Frequency Radio Link Stability Root Mean Square (value) Read-only Memory Real Time Clock Request to Send Receive Direction Specific Absorption Rate Surface Accoustic Wave Safety Extra Low Voltage Subscriber Identification Module Surface Mount Device Short Message Service Surface Mount Technology Serial Peripheral Interface Static Random Access Memory Terminal adapter (e.g. module) Time Division Multiple Access Terminal Equipment, also referred to as DTE Transport Layer Security Transmit Direction t PLS83-W_HIO_v00.860 Confidential / Preliminary 2021-02-18 Cinterion PLS83-W Hardware Interface Overview 6.3 Terms and Abbreviations 49 Page 48 of 61 Abbreviation Description UART URC USSD VSWR Universal asynchronous receiver-transmitter Unsolicited Result Code Unstructured Supplementary Service Data Voltage Standing Wave Ratio t PLS83-W_HIO_v00.860 Confidential / Preliminary 2021-02-18 Cinterion PLS83-W Hardware Interface Overview 6.4 Safety Precaution Notes 49 6.4 Safety Precaution Notes Page 49 of 61 The following safety precautions must be observed during all phases of the operation, usage, service or repair of any cellular terminal or mobile incorporating PLS83-W. Manufacturers of the cellular terminal are advised to convey the following safety information to users and oper-
ating personnel and to incorporate these guidelines into all manuals supplied with the product. Failure to comply with these precautions violates safety standards of design, manufacture and intended use of the product. Thales assumes no liability for customers failure to comply with these precautions. When in a hospital or other health care facility, observe the restrictions on the use of mobiles. Switch the cellular terminal or mobile off, if instructed to do so by the guide-
lines posted in sensitive areas. Medical equipment may be sensitive to RF energy. The operation of cardiac pacemakers, other implanted medical equipment and hear-
ing aids can be affected by interference from cellular terminals or mobiles placed close to the device. If in doubt about potential danger, contact the physician or the manufac-
turer of the device to verify that the equipment is properly shielded. Pacemaker patients are advised to keep their hand-held mobile away from the pacemaker, while it is on. Switch off the cellular terminal or mobile before boarding an aircraft. Make sure it can-
not be switched on inadvertently. The operation of wireless appliances in an aircraft is forbidden to prevent interference with communications systems. Failure to observe these instructions may lead to the suspension or denial of cellular services to the offender, legal action, or both. Do not operate the cellular terminal or mobile in the presence of flammable gases or fumes. Switch off the cellular terminal when you are near petrol stations, fuel depots, chemical plants or where blasting operations are in progress. Operation of any elec-
trical equipment in potentially explosive atmospheres can constitute a safety hazard. Your cellular terminal or mobile receives and transmits radio frequency energy while switched on. Remember that interference can occur if it is used close to TV sets, radios, computers or inadequately shielded equipment. Follow any special regulations and always switch off the cellular terminal or mobile wherever forbidden, or when you suspect that it may cause interference or danger. Road safety comes first! Do not use a hand-held cellular terminal or mobile when driv-
ing a vehicle, unless it is securely mounted in a holder for speakerphone operation. Before making a call with a hand-held terminal or mobile, park the vehicle. Speakerphones must be installed by qualified personnel. Faulty installation or opera-
tion can constitute a safety hazard. IMPORTANT!
Cellular terminals or mobiles operate using radio signals and cellular networks. Because of this, connection cannot be guaranteed at all times under all conditions. Therefore, you should never rely solely upon any wireless device for essential com-
munications, for example emergency calls. Remember, in order to make or receive calls, the cellular terminal or mobile must be switched on and in a service area with adequate cellular signal strength. Some networks do not allow for emergency calls if certain network services or phone features are in use (e.g. lock functions, fixed dialing etc.). You may need to deactivate those features before you can make an emergency call. Some networks require that a valid SIM card be properly inserted in the cellular termi-
nal or mobile. t PLS83-W_HIO_v00.860 Confidential / Preliminary 2021-02-18 Cinterion PLS83-W Hardware Interface Overview 7 Appendix 51 Page 50 of 61 7 Appendix 7.1 List of Parts and Accessories Table 14: List of parts and accessories Description PLS83-W Supplier Ordering information Standard module Thales IMEI:
Packaging unit (ordering) number: L30960-N6530-A100 Module label number1: S30960-S6530-A100-1 Thales Thales Thales Thales PLS83-W Evaluation Module Thales Ordering number: L30960-N6531-A100 DSB-mini Ordering number: L30960-N0030-A100 DSB75 Evaluation Kit Ordering number: L36880-N8811-A100 Ordering number: L30960-N0100-A100 EVAL DSB Adapter for mounting PLSx3 evaluation modules onto DSB75 LGA DevKit Thales LGA DevKit consists of Cinterion LGA DevKit L Base PCB:
Ordering number: L30960-N0112-A100 Cinterion LGA DevKit Socket SML:
Ordering number: L30960-N0110-A100 t PLS83-W_HIO_v00.860 Confidential / Preliminary 2021-02-18 Cinterion PLS83-W Hardware Interface Overview 7.1 List of Parts and Accessories 51 Page 51 of 61 Table 15: Molex sales contacts (subject to change) Molex For further information please click:
http://www.molex.com Molex China Distributors Beijing, Room 1311, Tower B, COFCO Plaza No. 8, Jian Guo Men Nei Street, 100005 Beijing P.R. China Phone: +86-10-6526-9628 Fax: +86-10-6526-9730 Molex Deutschland GmbH Otto-Hahn-Str. 1b 69190 Walldorf Germany Phone: +49-6227-3091-0 Fax: +49-6227-3091-8100 Email: mxgermany@molex.com Molex Singapore Pte. Ltd. 110, International Road Jurong Town, Singapore 629174 American Headquarters Lisle, Illinois 60532 U.S.A. Phone: +1-800-78MOLEX Fax: +1-630-969-1352 Molex Japan Co. Ltd. 1-5-4 Fukami-Higashi, Yamato-City, Kanagawa, 242-8585 Japan Phone: +65-6-268-6868 Fax: +65-6-265-6044 Phone: +81-46-265-2325 Fax: +81-46-265-2365 t PLS83-W_HIO_v00.860 Confidential / Preliminary 2021-02-18 52 THALES DIS AIS Deutschland GmbH Werinherstrasse 81 81541 Munich Germany i
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1 2 3 4 5 | Label & Location | ID Label/Location Info | 232.55 KiB | January 21 2021 |
aS je $ tir CINTERION 330960-S6530-A100-1 Model: PLS83-W]
jade in ChinaS IC: 7830A-PLS83W. FCC ID:QIPPLS83-W|
ey ete ae nanan an stant mu. CE 1111111 222222 3 DC eg
= fd) OUUBUL 7 men A UU bos a L A ty 14 mA |
FRRARRRARARAAR RANA AN |
1 2 3 4 5 | Attestation Statements part 2.911 d 5 i filing | Attestation Statements | 218.90 KiB | September 03 2023 |
Telit Cinterion Deutschland GmbH Siemensdamm 50 13629 Berlin - Germany Telit Cinterion Deutschland GmbH Federal Communications Commission Equipment Authorization Division, Application Processing Branch 7435 Oakland Mills Road Columbia MD 21046 USA Siemensdamm 50 13629 Berlin Germany Contact person: Leandro Wan-Dall Office Phone: +49 30 166355178 Email Address: leandro.wan-dall@telit.com August 7, 2023 Ref: Attestation Statements Part 2.911(d)(5)(i) Filing FCC ID Number Product QIPPLS83-W Title/Model PLS83-W Telit Cinterion Deutschland GmbH (the applicant) certifies that the equipment for which authorization is sought is not covered equipment prohibited from receiving an equipment authorization pursuant to section 2.903 of the FCC rules. Sincerely, X Leandro Wan-Dall Head of Certification Management Telit Cinterion Deutschland GmbH Registered Office: Mnchen - Amtsgericht Mnchen, HRB 172715 WEEE-Reg.-Nr. DE 58893809 Managing Directors: Christoph Caselitz, Eyal Shefer telit.com/contact-us
1 2 3 4 5 | Attestation Statements part 2.911 d 5 ii filing | Attestation Statements | 216.64 KiB | September 03 2023 |
Telit Cinterion Deutschland GmbH Siemensdamm 50 13629 Berlin - Germany Federal Communications Commission Equipment Authorization Division, Application Processing Branch Mills Road 7435 Oakland Columbia MD 21046 USA Telit Cinterion Deutschland GmbH Siemensdamm 50 13629 Berlin Germany Contact person: Leandro Wan-Dall Office Phone: +49 30 166355178 Email Address: leandro.wan-dall@telit.com August 29, 2023 Ref: Attestation Statements Part 2.911(d)(5)(ii) Filing FCC ID Number Product QIPPLS83-W Title/Model PLS83-W Telit Cinterion Deutschland GmbH (the applicant) certifies that, as of the date of the filing of the application, the applicant is not identified on the Covered List (as a specifically named entity or any of its subsidiaries or affiliates) as an entity producing covered equipment. Best regards. Telit Cinterion Deutschland GmbH X Leandro Wan-Dall Head of Certification Management Telit Cinterion Deutschland GmbH Registered Office: Mnchen - Amtsgericht Mnchen, HRB 172715 WEEE-Reg.-Nr. DE 58893809 Managing Directors: Eyal Shefer, Jrg Erdmann telit.com/contact-us
1 2 3 4 5 | C2PC Cover Letter | Cover Letter(s) | 225.74 KiB | September 03 2023 |
Telit Cinterion Deutschland GmbH Siemensdamm 50 13629 Berlin - Germany Federal Communications Commission Equipment Authorization Division, Application Processing Branch Mills Road 7435 Oakland Columbia MD 21046 USA Telit Cinterion Deutschland GmbH Siemensdamm 50 13629 Berlin Germany Contact person: Leandro Wan-Dall Office Phone: +49 30 166355178 Email Address: leandro.wan-dall@telit.com August 14, 2023 Request for a Class II Permissive Change Dear Madam or Sir, This is to request a Class II permission change to the following product:
FCC ID Number Product QIPPLS83-W Title/Model PLS83-W This request is to add eSIM variant, which the only change is that add one eSIM component on the PCB and update the FW with eSIM function. Telit Cinterion Deutschland GmbH attests there is no changes to the transmitter, modulation or filtering circuitry or any circuitry that may adversely affect PLS83-W device output and EMC compliance has occurred. For detailed software update, please refer to documents:
plsx3_rev01200_to_rev01202_delta_v01 plsx3_rev01202_to_rev02100_delta_v01 plsx3_rev02100_to_rev02110_delta_v01. In addition, due to the change of the applicant's company name, we intend to update the new company information to the report. Telit Cinterion Deutschland GmbH Registered Office: Mnchen - Amtsgericht Mnchen, HRB 172715 WEEE-Reg.-Nr. DE 58893809 Managing Directors: Christoph Caselitz, Eyal Shefer telit.com/contact-us If you have any questions, please feel free to contact us at the address shown above. Best regards. Telit Cinterion Deutschland GmbH X Leandro Wan-Dall Head of Certification Management Telit Cinterion Deutschland GmbH Registered Office: Mnchen - Amtsgericht Mnchen, HRB 172715 WEEE-Reg.-Nr. DE 58893809 Managing Directors: Christoph Caselitz, Eyal Shefer telit.com/contact-us
1 2 3 4 5 | CONF Letter | Cover Letter(s) | 239.23 KiB | September 03 2023 |
Telit Cinterion Deutschland GmbH Siemensdamm 50 13629 Berlin - Germany Telit Cinterion Deutschland GmbH Federal Communications Commission Equipment Authorization Division, Application Processing Branch 7435 Oakland Mills Road Columbia MD 21046 USA Siemensdamm 50 13629 Berlin Germany Contact person: Leandro Wan-Dall Office Phone: +49 30 166355178 Email Address: leandro.wan-dall@telit.com August 7, 2023 LONG-TERM CONFIDENTIALITY REQUEST Pursuant to Paragraphs 0.457 and 0.459 of the Commissions Rules (47 C.F.R.) and Section 552(b)(4) of the Freedom of Information Act, Telit Cinterion Deutschland GmbH requests confidentiality for the following product:
FCC ID Number Product QIPPLS83-W Title/Model PLS83-W For the product stated above, we request that the following information be held confidential:
1. Operational Description These items contain detailed system and equipment description and related information about the product which Telit Cinterion Deutschland GmbH considers to be proprietary, confidential and a custom design which otherwise would only be released to qualified tech and is not released to the general public. Since this design is a basis from which future technological product will evolve, Telit Cinterion Deutschland GmbH also feels that this information would be of benefit to its competitors, and that the disclosure of the information in these exhibits would give our competitors an unfair advantage in the market. Sincerely, X Leandro Wan-Dall Head of Certification Management Telit Cinterion Deutschland GmbH Registered Office: Mnchen - Amtsgericht Mnchen, HRB 172715 WEEE-Reg.-Nr. DE 58893809 Managing Directors: Christoph Caselitz, Eyal Shefer telit.com/contact-us
1 2 3 4 5 | Name Change | Cover Letter(s) | 186.26 KiB | September 03 2023 |
As of 30/12/2022, Thales cellular IoT products business is part of Telit Cinterion: www.telit.com/telitcinterion Telit Cinterion Deutschland GmbH Werinherstr. 81 81541 Munich Germany January 25th 2023 Change of company name from Thales DIS AIS Deutschland GmbH to Telit Cinterion Deutschland GmbH Dear Business Partners, We would like to inform you that Thales DIS AIS Deutschland GmbH has legally changed its name to Telit Cinterion Deutschland GmbH The new name reflects Thales cellular IoT products business now being a part of Telit Cinterion. This change will not affect in any way the performance of the ongoing contract(s) between our companies. As of February 1, 2023 the changes are implemented in our systems and all invoices will be issued under our new name Telit Cinterion Deutschland GmbH. Please make sure that any notifications that may be required to affect payments to Telit Cinterion Deutschland GmbH are undertaken as needed Please note that Thales DIS AIS Deutschland GmbH renamed into Telit Cinterion Deutschland GmbH with the legal subject of this entity remaining unchanged. All other entity data like postal address, bank account, VAT ID, incorporation number, WEEE registration etc. remain valid. Our commitment to a mutually beneficial business relationship with you remains our top priority and your current point of contact remains at your disposal for any further information you may require. Regards, Telit Cinterion Deutschland GmbH Robert Antonitsch Managing Director Christoph Caselitz Managing Director Telit Cinterion Deutschland GmbH Registered Office: Mnchen - Amtsgericht Mnchen, HRB 172715 WEEE-Reg.-Nr. DE 58893809 Managing Directors: Robert Antonitsch, Christoph Caselitz, Eyal Shefer
1 2 3 4 5 | Power of Attorney Letter | Cover Letter(s) | 223.56 KiB | September 03 2023 |
Telit Cinterion Deutschland GmbH Siemensdamm 50 13629 Berlin - Germany Telit Cinterion Deutschland GmbH Federal Communications Commission Equipment Authorization Division, Application Processing Branch 7435 Oakland Mills Road Columbia MD 21046 USA Siemensdamm 50 13629 Berlin Germany Contact person: Leandro Wan-Dall Office Phone: +49 30 166355178 Email Address: leandro.wan-dall@telit.com August 7, 2023 Ref: Agent letter for FCC ID: QIPPLS83-W We, hereby authorize Telit Cinterion Deutschland GmbH Siemensdamm 50 13629 Berlin Germany Shenzhen UnionTrust Quality and Technology Co., Ltd. Add: Unit D/E of 9/F and 16/F, Block A, Building 6, Baoneng science and technology park, Longhua New District, Shenzhen, China Billy Li Tel: +86-755-28230888 to act as our agent in the preparation of this application for equipment certification, including the signing of all documents relating to these matters. The present authorization considers the development of documents on behalf of the client, written under his own letterhead and related to the necessary information to be provided on his behalf to complete the certification process. We declare that our authorized agent is allowed to forward all information related to the approval and certification of equipment to the regulatory agencies as required and to discuss any issues concerning the approval application. Any and all acts carried out by our authorized agent on our behalf shall have the same effect as acts of our own. Telit Cinterion Deutschland GmbH Registered Office: Mnchen - Amtsgericht Mnchen, HRB 172715 WEEE-Reg.-Nr. DE 58893809 Managing Directors: Christoph Caselitz, Eyal Shefer telit.com/contact-us This agreement expires one year from the current date. Sincerely, X Leandro Wan-Dall Head of Certification Management Telit Cinterion Deutschland GmbH Registered Office: Mnchen - Amtsgericht Mnchen, HRB 172715 WEEE-Reg.-Nr. DE 58893809 Managing Directors: Christoph Caselitz, Eyal Shefer telit.com/contact-us
1 2 3 4 5 | US agent letter | Attestation Statements | 605.44 KiB | September 03 2023 |
Federal Communications Commission Equipment Authorization Division, Application Processing Branch Mills Road 7435 Oakland Columbia MD 21046 USA Telit Cinterion Deutschland GmbH Siemensdamm 50 13629 Berlin Germany Berlin, 2023.08.16 U.S. AGENT FOR SERVICE OF PROCESS - LETTER OF ATTESTATION U.S. Designated Agent:
Company Name:
Mobilogix Inc. FRN:
0025512666 Contact Name:
Ramy Mourad, R&D Director Company Address:
5500 Trabuco Rd Suite 150 - Irvine CA - United States Telephone No.:
+1 949 540 1276 E-mail:
ramy.mourad@telit.com This letter is to confirm that we designate the above U.S. representative as agent for service of process for Telit Cinterion Deutschland GmbH as noted below, for all the future FCC submissions. Telit Cinterion Deutschland GmbH and Mobilogix Inc. are companies belonging to the same group Telit IoT Solutions Holding LTD. The applicant accepts and acknowledges the obligation to maintain an agent for no less than one year after the grantee has terminated all marketing and importation or the conclusion of any Commission-related proceeding involving the equipment. The agent is not affiliated with a test lab or TCB. Applicant:
Company Name:
Grantee Code:
FRN:
Company Address:
Contact Name:
Telephone No.:
E-mail:
Telit Cinterion Deutschland GmbH QIP 0007412448 Siemensdamm 50, Berlin 13629, Germany Leandro Wan-Dall
+49 30 166355178 leandro.wan-dall@telit.com Best Regards, ___________________________ Leandro Wan-Dall _______________________ Ramy Mourad Telit Cinterion Deutschland GmbH Registered Office: Mnchen - Amtsgericht Mnchen, HRB 172715 WEEE-Reg.-Nr. DE 58893809 Managing Directors: Eyal Shefer, Jrg Erdmann DocuSign Envelope ID: 358D879A-301D-47CC-BF5C-819911B3BEA3
1 2 3 4 5 | Confidentiality Letter | Cover Letter(s) | 355.78 KiB | August 30 2021 |
THALES DIS AIS Deutschland GmbH Siemensdamm 50 13629 Berlin Germany
Federal Communications Commission
Equipment Authorization Division, Application
Processing Branch
7435 Oakland Mills Road
Columbia MD 21046
USA
THALES DIS AIS Deutschland GmbH
Siemensdamm 50
13629 Berlin
Germany
Contact person: Axel Heike
E-mail: axel.heike@thalesgroup.com
Tel: +49 30 31102-8146
13 November 2020
LONG-TERM CONFIDENTIALITY REQUEST
TO WHOM lT MAY CONCERN
Pursuant to Paragraphs §0.457 and 0.459 of the Commission‘s Rules (47 C.F.R.) and Section
§552(b)(4) of the Freedom of Information Act, THALES DIS AIS Deutschland GmbH requests
confidentiality for the following product:
FCC ID Number Product Title/Model
QIPPLS83-W
PLS83-W
For the product stated above, we request that the following information be held confidential:
1. Block Diagram
2. Schematic Diagram
3. Part List / Tune Up Procedure
4. Operational Description
These items contain detailed system and equipment description and related information about the
product which THALES DIS AIS Deutschland GmbH considers to be proprietary, confidential and a
custom design which otherwise would only be released to qualified tech and is not released to the
general public. Since this design is a basis from which future technological product will evolve, THALES
DIS AIS Deutschland GmbH also feels that this information would be of benefit to its competitors, and
that the disclosure of the information in these exhibits would give our competitors an unfair advantage
in the market.
Sincerely,
X
HEIKE Axel
Certification Project Manager
Signed by: HEIKE Axel
05.01.2021
05/01/2021
X
Leandro Wan-Dall
Head of Certification Management
Signed by: WAN-DALL Leandro
THALES DIS AIS Deutschland GmbH
Registered Office: Mü nchen - Amtsgericht Mü nchen, HRB 172715
WEEE-Reg.-Nr. DE 58893809
Managing Director: Andreas Haegele
1 2 3 4 5 | LOA Letter | Cover Letter(s) | 355.38 KiB | August 30 2021 |
THALES DIS AIS Deutschland GmbH Siemensdamm 50 13629 Berlin Germany
Federal Communications Commission
Equipment Authorization Division, Application
Processing Branch
7435 Oakland Mills Road
Columbia MD 21046
USA
THALES DIS AIS Deutschland GmbH
Siemensdamm 50
13629 Berlin
Germany
Contact person: Axel Heike
E-mail: axel.heike@thalesgroup.com
Tel: +49 30 31102-8146
09 November 2020
Ref: Agent letter for FCC ID: QIPPLS83-W
We,
THALES DIS AIS Deutschland GmbH
Siemensdamm 50
13629 Berlin — Germany
hereby authorize
Shenzhen UnionTrust Quality and Technology Co., Ltd.
Add: 161F, Block A, Building 6, Baoneng Science and Technology Park, Qingxiang Road No.1,
Longhua New District, Shenzhen, China
Billy Li
Tel: +86-755-28230888
to act as our agent in the preparation of this application for equipment certification, including the signing
of all documents relating to these matters.
The present authorization considers the development of documents on behalf of the client, written under
his own letterhead and related to the necessary information to be provided on his behalf to complete
the certification process.
We declare that our authorized agent is allowed to forward all information related to the approval and
certification of equipment to the regulatory agencies as required and to discuss any issues concerning
the approval application. Any and all acts carried out by our authorized agent on our behalf shall have
the same effect as acts of our own.
This agreement expires one year from the current date.
Sincerely,
12.11.2020
09/11/2020
X
Axel Heike
Certification Project Manager
Signed by: HEIKE Axel
THALES DIS AIS Deutschland GmbH
Registered Office: Mü nchen - Amtsgericht Mü nchen, HRB 172715
WEEE-Reg.-Nr. DE 58893809
Managing Director: Andreas Haegele
X
Leandro Wan-Dall
Head of Certification Management
Signed by: WAN-DALL Leandro
1 2 3 4 5 | Modular Approval | Cover Letter(s) | 381.53 KiB | January 21 2021 |
THALES DIS AIS Deutschland GmbH Siemensdamm 50 13629 Berlin Germany Federal Communications Commission Equipment Authorization Division, Application Processing Branch 7435 Oakland Mills Road Columbia MD 21046 USA THALES DIS AIS Deutschland GmbH Siemensdamm 50 13629 Berlin Germany Contact person: Axel Heike E-mail: axel.heike@thalesgroup.com Tel: +49 30 31102-8146 09 November 2020 Ref: FCC Modular approval letter for FCC ID: QIPPLS83-W TO WHOM lT MAY CONCERN The following attestation addresses the requirements to support modular approval pursuant to 15.212 of the Commissions Rules:
Modular approval requirement
(i) The radio elements of the modular transmitter must have their own shielding. The physical crystal and tuning capacitors may be located external to the shielded radio elements.
(ii) The modular transmitter must have buffered modulation/data inputs (if such in-
puts are provided) to ensure that the module will comply with part 15 requirements under conditions of excessive data rates or over-modulation.
(iii) The modular transmitter must have its own power supply regulation.
(iv) The modular transmitter must comply with the antenna and transmission system requirements of 1 5.203, 1 5.204(b) and 15.204(c). The antenna must either be permanently attached or employ a unique antenna coupler (at all connections be-
tween the module and the antenna, including the cable). The professional installa-
tion provision of 1 5.203 is not applicable to modules but can apply to limited mod-
ular approvals under paragraph (b) of this section.
(v) The modular transmitter must be tested in a stand-alone configuration, i.e., the module must not be inside another device during testing for compliance with part 15 requirements. Unless the transmitter module will be battery powered, it must comply with the AC line conducted requirements found in 1 5.207. AC or DC power lines and data input/output lines connected to the module must not contain ferrites, unless they will be marketed with the module (see 15.27(a)). The length of these lines shall be the length typical of actual use or, if that length is unknown, at least 10 cen-
timeters to insure that there is no coupling between the case of the module and sup-
porting equipment. Any accessories, peripherals, or support equipment connected to Yes No*
X X X X X THALES DIS AIS Deutschland GmbH Registered Office: M nchen - Amtsgericht M nchen, HRB 172715 WEEE-Reg.-Nr. DE 58893809 Managing Director: Andreas Haegele the module during testing shall be unmodified and commercially available (see 15.31(i)).
(vi) The modular transmitter must be equipped with either a permanently affixed la-
bel or must be capable of electronically displaying its FCC identification number.
(vii) The modular transmitter must comply with any specific rules or operating re-
quirements that ordinarily apply to a complete transmitter and the manufacturer must provide adequate instructions along with the module to explain any such re-
quirements. A copy of these instructions must be included in the application for equipment authorization.
(viii) The modular transmitter must comply with any applicable RF exposure require-
ments in its final configuration.
* Shall provide a detailed explanation if the answer is No. If you have any questions, please feel free to contact us at the address shown above. X X X Sincerely, X Axel Heike Certification Project Manager Signed by: HEIKE Axel 12.11.2020 09/11/2020 X Leandro Wan-Dall Head of Certification Management Signed by: WAN-DALL Leandro
1 2 3 4 5 | long-term Confidentiality Request | Cover Letter(s) | 357.89 KiB | January 21 2021 |
THALES DIS AIS Deutschland GmbH Siemensdamm 50 13629 Berlin Germany Federal Communications Commission Equipment Authorization Division, Application Processing Branch 7435 Oakland Mills Road Columbia MD 21046 USA THALES DIS AIS Deutschland GmbH Siemensdamm 50 13629 Berlin Germany Contact person: Axel Heike E-mail: axel.heike@thalesgroup.com Tel: +49 30 31102-8146 13 November 2020 LONG-TERM CONFIDENTIALITY REQUEST TO WHOM lT MAY CONCERN Pursuant to Paragraphs 0.457 and 0.459 of the Commissions Rules (47 C.F.R.) and Section 552(b)(4) of the Freedom of Information Act, THALES DIS AIS Deutschland GmbH requests confidentiality for the following product:
FCC ID Number Product Title/Model QIPPLS83-W PLS83-W For the product stated above, we request that the following information be held confidential:
1. Block Diagram 2. Schematic Diagram 3. Part List / Tune Up Procedure 4. Operational Description These items contain detailed system and equipment description and related information about the product which THALES DIS AIS Deutschland GmbH considers to be proprietary, confidential and a custom design which otherwise would only be released to qualified tech and is not released to the general public. Since this design is a basis from which future technological product will evolve, THALES DIS AIS Deutschland GmbH also feels that this information would be of benefit to its competitors, and that the disclosure of the information in these exhibits would give our competitors an unfair advantage in the market. Sincerely, X HEIKE Axel Certification Project Manager Signed by: HEIKE Axel 05.01.2021 05/01/2021 X Leandro Wan-Dall Head of Certification Management Signed by: WAN-DALL Leandro THALES DIS AIS Deutschland GmbH Registered Office: M nchen - Amtsgericht M nchen, HRB 172715 WEEE-Reg.-Nr. DE 58893809 Managing Director: Andreas Haegele
1 2 3 4 5 | short-term Confidentiality Request Letter | Cover Letter(s) | 357.88 KiB | January 21 2021 |
THALES DIS AIS Deutschland GmbH Siemensdamm 50 13629 Berlin Germany Federal Communications Commission Equipment Authorization Division, Application Processing Branch 7435 Oakland Mills Road Columbia MD 21046 USA THALES DIS AIS Deutschland GmbH Siemensdamm 50 13629 Berlin Germany Contact person: Axel Heike E-mail: axel.heike@thalesgroup.com Tel: +49 30 31102-8146 09 November 2020 SHORT-TERM CONFIDENTIALITY REQUEST TO WHOM IT MAY CONCERN Pursuant to Paragraphs 0.457 and 0.459 of the Commissions Rules (47 C.F.R.) and Section 552(b)(4) of the Freedom of Information Act, THALES DIS AIS Deutschland GmbH requests confidentiality for the following product:
FCC ID Number Product Title/Model QIPPLS83-W PLS83-W For the product stated above, we request that the following information be held confidential:
1. Test Setup Photos 2. User Manual 3. External and Internal Photographs THALES DIS AIS Deutschland GmbH requests this confidentiality on the basis of ensuring that business sensitive information remains confidential until the actual marketing of our new device, which is planned tor 30th of April 2021. If you have any questions, please feel free to contact us at the address shown above. Sincerely, X Axel Heike Certification Project Manager Signed by: HEIKE Axel 05.01.2021 05/01/2021 X Leandro Wan-Dall Head of Certification Management Signed by: WAN-DALL Leandro THALES DIS AIS Deutschland GmbH Registered Office: M nchen - Amtsgericht M nchen, HRB 172715 WEEE-Reg.-Nr. DE 58893809 Managing Director: Andreas Haegele
frequency | equipment class | purpose | ||
---|---|---|---|---|
1 | 2023-09-03 | JBP - Part 15 Class B Computing Device Peripheral | Class II permissive change or modification of presently authorized equipment | |
2 | 2580 ~ 2610 | PCB - PCS Licensed Transmitter | ||
3 | 2021-08-30 | 2580 ~ 2610 | PCB - PCS Licensed Transmitter | Class II Permissive Change |
4 | 2021-01-21 | 2580 ~ 2610 | PCB - PCS Licensed Transmitter | Original Equipment |
5 | JBP - Part 15 Class B Computing Device Peripheral |
app s | Applicant Information | |||||
---|---|---|---|---|---|---|
1 2 3 4 5 | Effective |
2023-09-03
|
||||
1 2 3 4 5 |
2021-08-30
|
|||||
1 2 3 4 5 |
2021-01-21
|
|||||
1 2 3 4 5 | Applicant's complete, legal business name |
Telit Cinterion Deutschland GmbH
|
||||
1 2 3 4 5 |
THALES DIS AlS Deutschland GmbH
|
|||||
1 2 3 4 5 | FCC Registration Number (FRN) |
0007412448
|
||||
1 2 3 4 5 |
0019578749
|
|||||
1 2 3 4 5 | Physical Address |
Siemensdamm 50
|
||||
1 2 3 4 5 |
Berlin, N/A 13629
|
|||||
1 2 3 4 5 |
Berlin, N/A
|
|||||
1 2 3 4 5 |
Germany
|
|||||
app s | TCB Information | |||||
1 2 3 4 5 | TCB Application Email Address |
T******@timcoengr.com
|
||||
1 2 3 4 5 |
t******@timcoengr.com
|
|||||
1 2 3 4 5 | TCB Scope |
A1: Low Power Transmitters below 1 GHz (except Spread Spectrum), Unintentional Radiators, EAS (Part 11) & Consumer ISM devices
|
||||
1 2 3 4 5 |
B1: Commercial mobile radio services equipment in the following 47 CFR Parts 20, 22 (cellular), 24,25 (below 3 GHz) & 27
|
|||||
app s | FCC ID | |||||
1 2 3 4 5 | Grantee Code |
QIP
|
||||
1 2 3 4 5 | Equipment Product Code |
PLS83-W
|
||||
app s | Person at the applicant's address to receive grant or for contact | |||||
1 2 3 4 5 | Name |
L******** W********
|
||||
1 2 3 4 5 |
A**** H******
|
|||||
1 2 3 4 5 | Title |
Head of Certification Management
|
||||
1 2 3 4 5 |
Manager Certifications
|
|||||
1 2 3 4 5 | Telephone Number |
00490********
|
||||
1 2 3 4 5 |
00493********
|
|||||
1 2 3 4 5 | Fax Number |
00490********
|
||||
1 2 3 4 5 |
00493********
|
|||||
1 2 3 4 5 |
l******@telit.com
|
|||||
1 2 3 4 5 |
a******@thalesgroup.com
|
|||||
app s | Technical Contact | |||||
n/a | ||||||
app s | Non Technical Contact | |||||
n/a | ||||||
app s | Confidentiality (long or short term) | |||||
1 2 3 4 5 | Does this application include a request for confidentiality for any portion(s) of the data contained in this application pursuant to 47 CFR § 0.459 of the Commission Rules?: | Yes | ||||
1 2 3 4 5 | Long-Term Confidentiality Does this application include a request for confidentiality for any portion(s) of the data contained in this application pursuant to 47 CFR § 0.459 of the Commission Rules?: | No | ||||
1 2 3 4 5 | Yes | |||||
1 2 3 4 5 | If so, specify the short-term confidentiality release date (MM/DD/YYYY format) | 04/30/2021 | ||||
if no date is supplied, the release date will be set to 45 calendar days past the date of grant. | ||||||
app s | Cognitive Radio & Software Defined Radio, Class, etc | |||||
1 2 3 4 5 | Is this application for software defined/cognitive radio authorization? | No | ||||
1 2 3 4 5 | Equipment Class | JBP - Part 15 Class B Computing Device Peripheral | ||||
1 2 3 4 5 | PCB - PCS Licensed Transmitter | |||||
1 2 3 4 5 | Description of product as it is marketed: (NOTE: This text will appear below the equipment class on the grant) | Module | ||||
1 2 3 4 5 | Related OET KnowledgeDataBase Inquiry: Is there a KDB inquiry associated with this application? | No | ||||
1 2 3 4 5 | Modular Equipment Type | Single Modular Approval | ||||
1 2 3 4 5 | Does not apply | |||||
1 2 3 4 5 | Purpose / Application is for | Class II permissive change or modification of presently authorized equipment | ||||
1 2 3 4 5 | Class II Permissive Change | |||||
1 2 3 4 5 | Original Equipment | |||||
1 2 3 4 5 | Composite Equipment: Is the equipment in this application a composite device subject to an additional equipment authorization? | Yes | ||||
1 2 3 4 5 | Related Equipment: Is the equipment in this application part of a system that operates with, or is marketed with, another device that requires an equipment authorization? | No | ||||
1 2 3 4 5 | Grant Comments | C2PC: Add one eSIM component on the PCB and update the FW with eSIM function. | ||||
1 2 3 4 5 | C2PC: Add one eSIM component on the PCB and update the FW with eSIM function. Single Modular Approval. Approval is limited to OEM installation only. Compliance of this device in all final host configurations is the responsibility of the Grantee. This device is to be used only for mobile and fixed applications. OEM integrators must be provided labeling requirements for finished products. This grant is valid only when the device is sold to OEM integrators and the OEM integrators are instructed to ensure that the end user has no manual instructions to remove or install the device. Separate approval is required for all other operating configurations, including portable configurations with respect to 2.1093 and different antenna configurations. Output Power listed is the maximum conducted output power. The module antenna(s) must be installed to meet the RF exposure compliance separation distance of 20 cm and any additional testing and authorization process as required. Co-location of this module with other transmitters that operate simultaneously are required to be evaluated using the FCC multi-transmitter procedures. Users must be provided with instructions and transmitter operating conditions for satisfying RF exposure compliance. RF exposure compliance may need to be addressed at the time of licensing, as required by the responsible FCC bureau(s), including antenna co-location requirements of Part 1.1307(b)(3). The Antenna(s) used for this transmitter must not exceed a maximum gain as described in the filing. This device supports: LTE of 1.4, 3, 5, 10, 15, and 20 MHz bandwidth modes for FDD LTE Band 2, 4 and 66; LTE of 1.4, 3, 5, 10, and 15 MHz bandwidth modes for FDD LTE Band 26; LTE of 1.4, 3, 5 and 10 MHz bandwidth modes for FDD LTE Band 5, 12 and 26; LTE of 5 and 10 MHz bandwidth modes for FDD LTE band 13; LTE of 5, 10, 15, and 20 MHz bandwidth modes for FDD LTE Band 7; LTE of 5, 10, 15, and 20 MHz bandwidth modes for TDD LTE Band 38 and 41. This device contains functions that are not operational in U.S. Territories; this filing is applicable only for U.S. operations. | |||||
1 2 3 4 5 | Single Modular Approval. Approval is limited to OEM installation only. Compliance of this device in all final host configurations is the responsibility of the Grantee. This device is to be used only for mobile and fixed applications. OEM integrators must be provided labeling requirements for finished products. This grant is valid only when the device is sold to OEM integrators and the OEM integrators are instructed to ensure that the end user has no manual instructions to remove or install the device. Separate approval is required for all other operating configurations, including portable configurations with respect to 2.1093 and different antenna configurations. Output Power listed is the maximum conducted output power. The module antenna(s) must be installed to meet the RF exposure compliance separation distance of 20 cm and any additional testing and authorization process as required. Co-location of this module with other transmitters that operate simultaneously are required to be evaluated using the FCC multi-transmitter procedures. Users must be provided with instructions and transmitter operating conditions for satisfying RF exposure compliance. RF exposure compliance may need to be addressed at the time of licensing, as required by the responsible FCC bureau(s), including antenna co-location requirements of Part 1.1307(b)(3). The Antenna(s) used for this transmitter must not exceed a maximum gain as described in the filing. This device supports: LTE of 1.4, 3, 5, 10, 15, and 20 MHz bandwidth modes for FDD LTE Band 2, 4 and 66; LTE of 1.4, 3, 5, 10, and 15 MHz bandwidth modes for FDD LTE Band 26; LTE of 1.4, 3, 5 and 10 MHz bandwidth modes for FDD LTE Band 5, 12 and 26; LTE of 5 and 10 MHz bandwidth modes for FDD LTE band 13; LTE of 5, 10, 15, and 20 MHz bandwidth modes for FDD LTE Band 7; LTE of 5, 10, 15, and 20 MHz bandwidth modes for TDD LTE Band 38 and 41, and LTE of 1.4 and 3 MHz bandwidth modes for FDD LTE Band 8. This device contains functions that are not operational in U.S. Territories; this filing is applicable only for U.S. operations. C2PC: Addition of LTE Band 8 operation. | |||||
1 2 3 4 5 | Single Modular Approval. Approval is limited to OEM installation only. Compliance of this device in all final host configurations is the responsibility of the Grantee. This device is to be used only for mobile and fixed applications. OEM integrators must be provided labeling requirements for finished products. This grant is valid only when the device is sold to OEM integrators and the OEM integrators are instructed to ensure that the end user has no manual instructions to remove or install the device. Separate approval is required for all other operating configurations, including portable configurations with respect to 2.1093 and different antenna configurations. Output Power listed is the maximum conducted output power. The module antenna(s) must be installed to meet the RF exposure compliance separation distance of 20 cm and any additional testing and authorization process as required. Co-location of this module with other transmitters that operate simultaneously are required to be evaluated using the FCC multi-transmitter procedures. Users must be provided with instructions and transmitter operating conditions for satisfying RF exposure compliance. RF exposure compliance may need to be addressed at the time of licensing, as required by the responsible FCC bureau(s), including antenna co-location requirements of Part 1.1307(b)(3). The Antenna(s) used for this transmitter must not exceed a maximum gain as described in the filing. This device supports: LTE of 1.4, 3, 5, 10, 15, and 20 MHz bandwidth modes for FDD LTE Band 2, 4 and 66; LTE of 1.4, 3, 5, 10, and 15 MHz bandwidth modes for FDD LTE Band 26; LTE of 1.4, 3, 5 and 10 MHz bandwidth modes for FDD LTE Band 5, 12 and 26; LTE of 5 and 10 MHz bandwidth modes for FDD LTE band 13; LTE of 5, 10, 15, and 20 MHz bandwidth modes for FDD LTE Band 7; LTE of 5, 10, 15, and 20 MHz bandwidth modes for TDD LTE Band 38 and 41. This device contains functions that are not operational in U.S. Territories; this filing is applicable only for U.S. operations. | |||||
1 2 3 4 5 | Is there an equipment authorization waiver associated with this application? | No | ||||
1 2 3 4 5 | If there is an equipment authorization waiver associated with this application, has the associated waiver been approved and all information uploaded? | No | ||||
app s | Test Firm Name and Contact Information | |||||
1 2 3 4 5 | Firm Name |
Shenzhen UnionTrust Quality and Technology Co., Lt
|
||||
1 2 3 4 5 | Name |
G**** L********
|
||||
1 2 3 4 5 | Telephone Number |
+86-7********
|
||||
1 2 3 4 5 |
q******@uttlab.com
|
|||||
Equipment Specifications | |||||||||||||||||||||||||||||||||||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Line | Rule Parts | Grant Notes | Lower Frequency | Upper Frequency | Power Output | Tolerance | Emission Designator | Microprocessor Number | |||||||||||||||||||||||||||||||||
1 | 1 | 15B | |||||||||||||||||||||||||||||||||||||||
Line | Rule Parts | Grant Notes | Lower Frequency | Upper Frequency | Power Output | Tolerance | Emission Designator | Microprocessor Number | |||||||||||||||||||||||||||||||||
2 | 1 | 22H | 824.2 | 848.8 | 2.2751 | 0.0251 ppm | 245KGXW | ||||||||||||||||||||||||||||||||||
2 | 2 | 22H | 824.2 | 848.8 | 0.57412 | 0.0251 ppm | 243KG7W | ||||||||||||||||||||||||||||||||||
2 | 3 | 24E | 1850.2 | 1909.8 | 1.1885 | 0.0101 ppm | 244KGXW | ||||||||||||||||||||||||||||||||||
2 | 4 | 24E | 1850.2 | 1909.8 | 0.43351 | 0.0101 ppm | 246KG7W | ||||||||||||||||||||||||||||||||||
2 | 5 | 24E | 1852.4 | 1907.6 | 0.28314 | 0.0101 ppm | 4M14F9W | ||||||||||||||||||||||||||||||||||
2 | 6 | 27 | 1712.4 | 1752.6 | 0.26002 | 0.0104 ppm | 4M14F9W | ||||||||||||||||||||||||||||||||||
2 | 7 | 22H | 826.4 | 846.6 | 0.28379 | 0.0108 ppm | 4M15F9W | ||||||||||||||||||||||||||||||||||
2 | 8 | 24E | 1860 | 1900 | 0.23281 | 0.0037 ppm | 17M9G7D | ||||||||||||||||||||||||||||||||||
2 | 9 | 24E | 1860 | 1900 | 0.23121 | 0.0037 ppm | 18M0W7D | ||||||||||||||||||||||||||||||||||
2 | 1 | 27 | 1710.7 | 1754.3 | 0.20701 | 0.0052 ppm | 1M11G7D | ||||||||||||||||||||||||||||||||||
2 | 11 | 27 | 1720 | 1745 | 0.19999 | 0.19999 ppm | 18M0G7D | ||||||||||||||||||||||||||||||||||
2 | 12 | 27 | 1720 | 1745 | 0.17298 | 0.0052 ppm | 17M9W7D | ||||||||||||||||||||||||||||||||||
2 | 13 | 22H | 829 | 844 | 0.139 | 0.0084 ppm | 9M00G7D | ||||||||||||||||||||||||||||||||||
2 | 14 | 22H | 829 | 844 | 0.11885 | 0.0084 ppm | 9M00W7D | ||||||||||||||||||||||||||||||||||
2 | 15 | 27 | 2510 | 2560 | 0.19953 | 0.0036 ppm | 18M0G7D | ||||||||||||||||||||||||||||||||||
2 | 16 | 27 | 2502.5 | 2567.5 | 0.20654 | 0.0036 ppm | 4M53W7D | ||||||||||||||||||||||||||||||||||
2 | 17 | 27 | 2510 | 2560 | 0.18535 | 0.0036 ppm | 17M9W7D | ||||||||||||||||||||||||||||||||||
2 | 18 | 27 | 699.7 | 715.3 | 0.15066 | 0.0226 ppm | 1M10G7D | ||||||||||||||||||||||||||||||||||
2 | 19 | 27 | 704 | 711 | 0.14723 | 0.0226 ppm | 9M01G7D | ||||||||||||||||||||||||||||||||||
2 | 2 | 27 | 699.7 | 715.3 | 0.139 | 0.0226 ppm | 1M10W7D | ||||||||||||||||||||||||||||||||||
2 | 21 | 27 | 704 | 711 | 0.13772 | 0.0226 ppm | 8M98W7D | ||||||||||||||||||||||||||||||||||
2 | 22 | 22H | 782 | 782 | 0.13305 | 0.0166 ppm | 8M94G7D | ||||||||||||||||||||||||||||||||||
2 | 23 | 22H | 782 | 782 | 0.12474 | 0.0166 ppm | 8M96W7D | ||||||||||||||||||||||||||||||||||
2 | 24 | 22H | 831.5 | 841.5 | 0.13002 | 0.0227 ppm | 13M5G7D | ||||||||||||||||||||||||||||||||||
2 | 25 | 22H | 831.5 | 841.5 | 0.13459 | 0.0227 ppm | 13M5W7D | ||||||||||||||||||||||||||||||||||
2 | 26 | 9 | 814.7 | 823.3 | 0.12764 | 0.022 ppm | 1M11G7D | ||||||||||||||||||||||||||||||||||
2 | 27 | 9 | 819 | 819 | 0.13335 | 0.022 ppm | 8M95G7D | ||||||||||||||||||||||||||||||||||
2 | 28 | 9 | 815.5 | 822.5 | 0.11995 | 0.022 ppm | 2M69W7D | ||||||||||||||||||||||||||||||||||
2 | 29 | 9 | 819 | 819 | 0.1205 | 0.022 ppm | 2M69W7D | ||||||||||||||||||||||||||||||||||
2 | 3 | 27 | 2580 | 2610 | 0.19724 | 0.0046 ppm | 18M0G7D | ||||||||||||||||||||||||||||||||||
2 | 31 | 27 | 2580 | 2610 | 0.20845 | 0.0046 ppm | 18M0W7D | ||||||||||||||||||||||||||||||||||
2 | 32 | 27 | 2545 | 2645 | 0.22699 | 0.0039 ppm | 18M0G7D | ||||||||||||||||||||||||||||||||||
2 | 33 | 27 | 2545 | 2645 | 0.20989 | 0.0039 ppm | 18M0W7D | ||||||||||||||||||||||||||||||||||
2 | 34 | 27 | 1715 | 1775 | 0.23227 | 0.008 ppm | 8M99G7D | ||||||||||||||||||||||||||||||||||
2 | 35 | 27 | 1720 | 1770 | 0.20184 | 0.008 ppm | 17M9G7D | ||||||||||||||||||||||||||||||||||
2 | 36 | 27 | 1712.5 | 1777.5 | 0.22803 | 0.008 ppm | 4M54W7D | ||||||||||||||||||||||||||||||||||
2 | 37 | 27 | 1720 | 1770 | 0.19011 | 0.008 ppm | 17M9W7D | ||||||||||||||||||||||||||||||||||
2 | 38 | 27 | 898.2 | 899.8 | 0.26303 | 0.0004 ppm | 2M72G7W | ||||||||||||||||||||||||||||||||||
2 | 39 | 27 | 898.2 | 899.8 | 0.21281 | 0.0004 ppm | 2M70G7W | ||||||||||||||||||||||||||||||||||
Line | Rule Parts | Grant Notes | Lower Frequency | Upper Frequency | Power Output | Tolerance | Emission Designator | Microprocessor Number | |||||||||||||||||||||||||||||||||
3 | 1 | 22H | 824.2 | 848.8 | 2.2751 | 0.0251 ppm | 245KGXW | ||||||||||||||||||||||||||||||||||
3 | 2 | 22H | 824.2 | 848.8 | 0.57412 | 0.0251 ppm | 243KG7W | ||||||||||||||||||||||||||||||||||
3 | 3 | 24E | 1850.2 | 1909.8 | 1.1885 | 0.0101 ppm | 244KGXW | ||||||||||||||||||||||||||||||||||
3 | 4 | 24E | 1850.2 | 1909.8 | 0.43351 | 0.0101 ppm | 246KG7W | ||||||||||||||||||||||||||||||||||
3 | 5 | 24E | 1852.4 | 1907.6 | 0.28314 | 0.0101 ppm | 4M14F9W | ||||||||||||||||||||||||||||||||||
3 | 6 | 27 | 1712.4 | 1752.6 | 0.26002 | 0.0104 ppm | 4M14F9W | ||||||||||||||||||||||||||||||||||
3 | 7 | 22H | 826.4 | 846.6 | 0.28379 | 0.0108 ppm | 4M15F9W | ||||||||||||||||||||||||||||||||||
3 | 8 | 24E | 1860 | 1900 | 0.23281 | 0.0037 ppm | 17M9G7D | ||||||||||||||||||||||||||||||||||
3 | 9 | 24E | 1860 | 1900 | 0.23121 | 0.0037 ppm | 18M0W7D | ||||||||||||||||||||||||||||||||||
3 | 1 | 27 | 1710.7 | 1754.3 | 0.20701 | 0.0052 ppm | 1M11G7D | ||||||||||||||||||||||||||||||||||
3 | 11 | 27 | 1720 | 1745 | 0.19999 | 0.0052 ppm | 18M0G7D | ||||||||||||||||||||||||||||||||||
3 | 12 | 27 | 1720 | 1745 | 0.17298 | 0.0052 ppm | 17M9W7D | ||||||||||||||||||||||||||||||||||
3 | 13 | 22H | 829 | 844 | 0.139 | 0.0084 ppm | 9M00G7D | ||||||||||||||||||||||||||||||||||
3 | 14 | 22H | 829 | 844 | 0.11885 | 0.0084 ppm | 9M00W7D | ||||||||||||||||||||||||||||||||||
3 | 15 | 27 | 2510 | 2560 | 0.19953 | 0.0036 ppm | 18M0G7D | ||||||||||||||||||||||||||||||||||
3 | 16 | 27 | 2502.5 | 2567.5 | 0.20654 | 0.0036 ppm | 4M53W7D | ||||||||||||||||||||||||||||||||||
3 | 17 | 27 | 2510 | 2560 | 0.18535 | 0.0036 ppm | 17M9W7D | ||||||||||||||||||||||||||||||||||
3 | 18 | 27 | 699.7 | 715.3 | 0.15066 | 0.0226 ppm | 1M10G7D | ||||||||||||||||||||||||||||||||||
3 | 19 | 27 | 704 | 711 | 0.14723 | 0.0226 ppm | 9M01G7D | ||||||||||||||||||||||||||||||||||
3 | 2 | 27 | 699.7 | 715.3 | 0.139 | 0.0226 ppm | 1M10W7D | ||||||||||||||||||||||||||||||||||
3 | 21 | 27 | 704 | 711 | 0.13772 | 0.0226 ppm | 8M98W7D | ||||||||||||||||||||||||||||||||||
3 | 22 | 22H | 782 | 782 | 0.13305 | 0.0166 ppm | 8M94G7D | ||||||||||||||||||||||||||||||||||
3 | 23 | 22H | 782 | 782 | 0.12474 | 0.0166 ppm | 8M96W7D | ||||||||||||||||||||||||||||||||||
3 | 24 | 22H | 831.5 | 841.5 | 0.13002 | 0.0227 ppm | 13M5G7D | ||||||||||||||||||||||||||||||||||
3 | 25 | 22H | 831.5 | 841.5 | 0.13459 | 0.0227 ppm | 13M5W7D | ||||||||||||||||||||||||||||||||||
3 | 26 | 9 | 814.7 | 823.3 | 0.12764 | 0.022 ppm | 1M11G7D | ||||||||||||||||||||||||||||||||||
3 | 27 | 9 | 819 | 819 | 0.13335 | 0.022 ppm | 8M95G7D | ||||||||||||||||||||||||||||||||||
3 | 28 | 9 | 815.5 | 822.5 | 0.11995 | 0.022 ppm | 2M69W7D | ||||||||||||||||||||||||||||||||||
3 | 29 | 9 | 819 | 819 | 0.1205 | 0.022 ppm | 2M69W7D | ||||||||||||||||||||||||||||||||||
3 | 3 | 27 | 2580 | 2610 | 0.19724 | 0.0046 ppm | 18M0G7D | ||||||||||||||||||||||||||||||||||
3 | 31 | 27 | 2580 | 2610 | 0.20845 | 0.0046 ppm | 18M0W7D | ||||||||||||||||||||||||||||||||||
3 | 32 | 27 | 2545 | 2645 | 0.22699 | 0.0039 ppm | 18M0G7D | ||||||||||||||||||||||||||||||||||
3 | 33 | 27 | 2545 | 2645 | 0.20989 | 0.0039 ppm | 18M0W7D | ||||||||||||||||||||||||||||||||||
3 | 34 | 27 | 1715 | 1775 | 0.23227 | 0.008 ppm | 8M99G7D | ||||||||||||||||||||||||||||||||||
3 | 35 | 27 | 1720 | 1770 | 0.20184 | 0.008 ppm | 17M9G7D | ||||||||||||||||||||||||||||||||||
3 | 36 | 27 | 1712.5 | 1777.5 | 0.22803 | 0.008 ppm | 4M54W7D | ||||||||||||||||||||||||||||||||||
3 | 37 | 27 | 1720 | 1770 | 0.19011 | 0.008 ppm | 17M9W7D | ||||||||||||||||||||||||||||||||||
3 | 38 | 27 | 898.2 | 899.8 | 0.26303 | 0.0004 ppm | 2M72G7W | ||||||||||||||||||||||||||||||||||
3 | 39 | 27 | 898.2 | 899.8 | 0.21281 | 0.0004 ppm | 2M70D7W | ||||||||||||||||||||||||||||||||||
Line | Rule Parts | Grant Notes | Lower Frequency | Upper Frequency | Power Output | Tolerance | Emission Designator | Microprocessor Number | |||||||||||||||||||||||||||||||||
4 | 1 | 22H | 824.2 | 848.8 | 2.2751 | 0.0251 ppm | 245KGXW | ||||||||||||||||||||||||||||||||||
4 | 2 | 22H | 824.2 | 848.8 | 0.57412 | 0.0251 ppm | 243KG7W | ||||||||||||||||||||||||||||||||||
4 | 3 | 24E | 1850.2 | 1909.8 | 1.1885 | 0.0101 ppm | 244KGXW | ||||||||||||||||||||||||||||||||||
4 | 4 | 24E | 1850.2 | 1909.8 | 0.43351 | 0.0101 ppm | 246KG7W | ||||||||||||||||||||||||||||||||||
4 | 5 | 24E | 1852.4 | 1907.6 | 0.28314 | 0.0101 ppm | 4M14F9W | ||||||||||||||||||||||||||||||||||
4 | 6 | 27 | 1712.4 | 1752.6 | 0.26002 | 0.0104 ppm | 4M14F9W | ||||||||||||||||||||||||||||||||||
4 | 7 | 22H | 826.4 | 846.6 | 0.28379 | 0.0108 ppm | 4M15F9W | ||||||||||||||||||||||||||||||||||
4 | 8 | 24E | 1860 | 1900 | 0.23281 | 0.0037 ppm | 17M9G7D | ||||||||||||||||||||||||||||||||||
4 | 9 | 24E | 1860 | 1900 | 0.23121 | 0.0037 ppm | 18M0W7D | ||||||||||||||||||||||||||||||||||
4 | 1 | 27 | 1710.7 | 1754.3 | 0.20701 | 0.0052 ppm | 1M11G7D | ||||||||||||||||||||||||||||||||||
4 | 11 | 27 | 1720 | 1745 | 0.19999 | 0.0052 ppm | 18M0G7D | ||||||||||||||||||||||||||||||||||
4 | 12 | 27 | 1720 | 1745 | 0.17298 | 0.0052 ppm | 17M9W7D | ||||||||||||||||||||||||||||||||||
4 | 13 | 22H | 829 | 844 | 0.139 | 0.0084 ppm | 9M00G7D | ||||||||||||||||||||||||||||||||||
4 | 14 | 22H | 829 | 844 | 0.11885 | 0.0084 ppm | 9M00W7D | ||||||||||||||||||||||||||||||||||
4 | 15 | 27 | 2510 | 2560 | 0.19953 | 0.0036 ppm | 18M0G7D | ||||||||||||||||||||||||||||||||||
4 | 16 | 27 | 2502.5 | 2567.5 | 0.20654 | 0.0036 ppm | 4M53W7D | ||||||||||||||||||||||||||||||||||
4 | 17 | 27 | 2510 | 2560 | 0.18535 | 0.0036 ppm | 17M9W7D | ||||||||||||||||||||||||||||||||||
4 | 18 | 27 | 699.7 | 715.3 | 0.15066 | 0.0226 ppm | 1M10G7D | ||||||||||||||||||||||||||||||||||
4 | 19 | 27 | 704 | 711 | 0.14723 | 0.0226 ppm | 9M01G7D | ||||||||||||||||||||||||||||||||||
4 | 2 | 27 | 699.7 | 715.3 | 0.139 | 0.0226 ppm | 1M10W7D | ||||||||||||||||||||||||||||||||||
4 | 21 | 27 | 704 | 711 | 0.13772 | 0.0226 ppm | 8M98W7D | ||||||||||||||||||||||||||||||||||
4 | 22 | 22H | 782 | 782 | 0.13305 | 0.0166 ppm | 8M94G7D | ||||||||||||||||||||||||||||||||||
4 | 23 | 22H | 782 | 782 | 0.12474 | 0.0166 ppm | 8M96W7D | ||||||||||||||||||||||||||||||||||
4 | 24 | 22H | 831.5 | 841.5 | 0.13002 | 0.0227 ppm | 13M5G7D | ||||||||||||||||||||||||||||||||||
4 | 25 | 22H | 831.5 | 841.5 | 0.13459 | 0.0227 ppm | 13M5W7D | ||||||||||||||||||||||||||||||||||
4 | 26 | 9 | 814.7 | 823.3 | 0.12764 | 0.022 ppm | 1M11G7D | ||||||||||||||||||||||||||||||||||
4 | 27 | 9 | 819 | 819 | 0.13335 | 0.022 ppm | 8M95G7D | ||||||||||||||||||||||||||||||||||
4 | 28 | 9 | 815.5 | 822.5 | 0.11995 | 0.022 ppm | 2M69W7D | ||||||||||||||||||||||||||||||||||
4 | 29 | 9 | 819 | 819 | 0.1205 | 0.022 ppm | 2M69W7D | ||||||||||||||||||||||||||||||||||
4 | 3 | 27 | 2580 | 2610 | 0.19724 | 0.0046 ppm | 18M0G7D | ||||||||||||||||||||||||||||||||||
4 | 31 | 27 | 2580 | 2610 | 0.20845 | 0.0046 ppm | 18M0W7D | ||||||||||||||||||||||||||||||||||
4 | 32 | 27 | 2545 | 2645 | 0.22699 | 0.0039 ppm | 18M0G7D | ||||||||||||||||||||||||||||||||||
4 | 33 | 27 | 2545 | 2645 | 0.20989 | 0.0039 ppm | 18M0W7D | ||||||||||||||||||||||||||||||||||
4 | 34 | 27 | 1715 | 1775 | 0.23227 | 0.008 ppm | 8M99G7D | ||||||||||||||||||||||||||||||||||
4 | 35 | 27 | 1720 | 1770 | 0.20184 | 0.008 ppm | 17M9G7D | ||||||||||||||||||||||||||||||||||
4 | 36 | 27 | 1712.5 | 1777.5 | 0.22803 | 0.008 ppm | 4M54W7D | ||||||||||||||||||||||||||||||||||
4 | 37 | 27 | 1720 | 1770 | 0.19011 | 0.008 ppm | 17M9W7D | ||||||||||||||||||||||||||||||||||
Line | Rule Parts | Grant Notes | Lower Frequency | Upper Frequency | Power Output | Tolerance | Emission Designator | Microprocessor Number | |||||||||||||||||||||||||||||||||
5 | 1 | 15B |
some individual PII (Personally Identifiable Information) available on the public forms may be redacted, original source may include additional details
This product uses the FCC Data API but is not endorsed or certified by the FCC