FCC ID: 2AL99-TECV4 3rd Eye Cam

 

V0.5|7/2017 Installation Instructions 3EC With External Cam & Viewing Monitor Installation Required Tools...pg.1 Wiring Connection/Descriptionspg.8,9 Hardware. pg.1 Component Connectionpg.10 Pre-Installation Checklist... pg.2 Safety Information....... pg.2 Installation Diagrams...pg.2,3 Location Recommendations..pg.3,4 Installation Instructions..pg.5,6,7,8 Required Tools Drill (Cordless) Wire Strippers Crimper Plier Driving Bit Set Magnetic Drive Guide Burr Tool Additional Items (optional) Wire Connectors Zip Ties Wire (18 Gauge) Replacement Fuses (5,10,15,20 amp) Star Washers Hardware UDU WU Power Cable HDMI DVI Cable Expansion Window Unit (WU) Under Dash Unit (UDU) Step Drill Bits (3/16 in.-7/8 In.) Digital Multimeter Plastic Antenna Tool Panel Popper End Wire Brush (3/4 In.) Magnetic Tray Grease Marker Tamper Seal Alcohol Wipes Self-Tapping Screws Event Button 10 ft. Extension AV Splitter Cable External Cam & Monitor Antenna (MA240.LBI.012) [Length=15feet]

Installation guides available online @ www.awti.com 1 | P a g e FCC Caution:

FCC Compliance statements:

This equipment complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and

(2) this device must accept any interference received, including interference that may cause undesired operation. CAUTION:

The changes or modifications not expressly approved by the party responsible for Compliance could void the users authority to operate the equipment and The antennas for this transmitter must be installed to provide a separation distance of 20cm from all persons and must not be co-located or operating in conjunction with any other antenna or transmitter. Canadian Notice:

IC Compliance statements:

This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device. This equipment complies with radio frequency exposure limits set forth by Industry Canada for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20cm between the device and the user or bystanders. CAUTION:

Any changes or modifications not expressly approved by the party responsible for compliance could void the users authority to operate the equipment. Dclarations de conformit IC:

Cet appareil est conforme aux normes RSS exonres de licence d'Industrie Canada. L'opration est soumise En suivant deux conditions: (1) cet appareil ne doit pas provoquer d'interfrence, et (2) cet appareil doit accepter tout Les interfrences, y compris les interfrences susceptibles de provoquer un fonctionnement indsirable de l'appareil. Cet quipement est conforme aux limites d'exposition aux frquences radio tablies par Industrie Canada pour une incontrle environnement. Cet quipement doit tre install et utilis avec une distance minimale de 20 cm entre le L'appareil et l'utilisateur ou les spectateurs. ATTENTION:

Toute modification ou modification non expressment approuve par la partie responsable de la conformit pourrait annuler l'autorisation de l'utilisateur d'utiliser l'quipement. Antenna must be mounted on glass surface only for the compliance with FCC and IC standards. Installation on a different surface is prohibited. L'antenne doit tre monte sur la surface de verre uniquement pour la conformit aux FCC et IC normes. L'installation sur une surface diffrente est interdite. Installation guides available online @ www.awti.com 2 | P a g e Pre-installation Checklist:

The 3rd Eye Cam is programmed by serial number/mac address to a specific vehicle. Prior to installation, the following steps should be taken for proper documentation of equipment. 1. Open the box with a 3rd Eye Cam kit. 2. Gather all necessary hardware listed above. 3. Take photo of vehicle ID #, it will be located on the chassis as well as body of the vehicle. 4. Record Vehicle body or truck ID number and Vehicle Identification Number (VIN) 5. Record installer name Safety Information The 3rd Eye Cam installation requires attentiveness. Please be sure to abide by the following guidelines. Failure to do so may result in property damage and or personal injury. Precaution prior to installation of the 3rd Eye Cam system:

1. Turn off the engine before installing the system. 2. Remove all power to all areas where wires will be connected. 3. Install the product in a location where Wi-Fi and GPS signals can transmit effectively (not blocked by solid material other than windshield glass). 4. Before permanently mounting the camera, make sure the camera interior view is not blocked by the rearview mirror or other objects located inside vehicle. 5. The customer must approve the camera mounting location. 6. The unit must be installed level both horizontally and vertically for best results. 7. The on-site mechanic or vehicle manufacturer must approve wiring connections. Installation Diagrams DS3 Diagram Installation guides available online @ www.awti.com 3 | P a g e Cam/Monitor Diagram Location Recommendations Installing the Under Dash Unit The UDU (under dash unit) can be mounted in various places inside the cab such as, under the cabs bench seating, in the overhead compartment above the windshield, in the console, or under the vehicles dash. UDU under bench seating With a step drill bit, drill a hole into the back of the bench base so that wires may be run directly to the UDU. Tip: Always check your surroundings and look twice then drill once. Use a burr tool or insert a rubber grommet into the hole so that the edges will not remain sharp. Feed all wire connections to the UDU under the floor side paneling leading to the back of the bench seat where the drill hole is located. Connect all necessary cabling and mount the UDU to the floorboard under the bench seat. Position of antenna should be high on the windshield surface. UDU in overhead compartment Disassemble panel between the headliner and windshield. Feed cabling through the A pillar between the windshield and the door. Using a step drill, drill a hole and insert a rubber grommet in the corner of the overhead unit between the windshield and side paneling. Feed cabling through the hole and make all necessary connections to the UDU. Be sure to mount the UDU so that it is secure against the head compartment. Position of antenna should be high on the windshield surface. Installation guides available online @ www.awti.com 4 | P a g e UDU in Dog House center console Disassemble the middle paneling that contains controls (i.e. parking brake). Run all cabling from under the dash through the bottom of the center console. Make all necessary connections to the UDU. When installing the UDU under the console, it is not crucial to have a completely secure mount. Attempt to find an area within the console where either one screw can mount the UDU or can be zip tied to an existing brace. Position of antenna should be high on the windshield surface. UDU under the vehicles dash Locate an area under the dash were the UDU can be securely mounted. Tip: Often the best place for this is on the drivers side behind the axel of the steering wheel near the J-1939 factory outlet. After making all connections securely mount the UDU so that it is flush against the under dash wall. Position of antenna should be high on the windshield surface. Installing the Window Unit WU Diagram The window unit must be mounted in a location that provides an unobstructed view of the interior and exterior (front) of the vehicle. Verify that the placement does not block the drivers primary field of view. The camera lens facing the interior should capture an internal view from the outside shoulder of the driver to the outside shoulder of a front-seat passenger. Sedans, pickups, and light-duty trucks usually have a traditional rear-view mirror. Position the window unit so that the outer ring of the camera lens is visible when the mirror is adjusted to its lowest position. Remember that the mirror usually pivots on two points: one on the glass and one on the back of the mirror. Buses and large trucks often have nonstandard windshields and mirrors. Choosing a location too high on the windshield can keep the driver out of view, cause a loss of vision in front of the vehicle, and push the units accelerometers further away from the vehicles center of mass. Look for potential obstructions such as windshield wipers, tinted window, sun visors, circulation fans, and the rear-view mirror itself when it is in its lowest position. Aftermarket window tint may not support the weight of the 3rd Eye unit and may result in separation from the glass. Position of the antenna should be high on the windshield surface. Installation guides available online @ www.awti.com 5 | P a g e Installation Instructions This section provides installation instructions to 3rd Eye Cam, along with operation verification. 1. Disassembling Side Floorboard Paneling The vehicles side floorboard panels need to be disassembled in order to gain easy access to needed areas during the installation. Using a cordless drill, disassemble both the driver and passenger side floorboard panels. Place paneling and screws in magnetic tray for reassembling. 2. Disassembling the Dash Board The vehicles dashboard needs to be disassembled in order to prepare for wiring of the Under Dash Unit

(UDU) installation. Using a cordless drill disassemble the dashboard along with any plating to allow for complete access. Place all dashboard parts and screws in a safe place for reassembling. 3. Disassembling Button Paneling The button paneling is located under the dashboard in the center of the cab. Remove parking brake and place in magnetic tray to reattach later. Carefully remove all screws in order to take off paneling using an electric drill. Once all screws have been removed, pull paneling away from dash and let it hang in a relaxed position to prevent any strain on the existing wiring. 4. Event Button Finding a suitable event button location. The button paneling that has been detached from the vehicles dashboard is where the Red Event Button is recommended to be installed. Choose a spot on the vehicles button paneling where the driver will have easy access to the panic button in case of emergency. Using a Step Drill create a 5/8 hole in the spot you have chosen for the event button. The event button that has been provided with the system contains black and red wiring. Take the end of the cable that is not attached to the panic button and feed it through the 5/8hole. Once the wire has been fed all the way through the hole, the face of the red button should be able to fit flush against the front face of the dash. Now that the button is ready to be secured against the dash panel, locate the (spec.) washer and

(spec.) nut for the panic button. Starting at the end of the wire, slide the (spec.) washer with the (spec.) nut through to the back of the button. Once the two pieces have reached the back side of the event button behind the dash paneling rotate the (spec.) nut and (spec.) washer clockwise until both are firmly flush against the back of the button paneling. The event button should now be securely in place on the dash panel. Locate expansion cable. Connect red and black wires on event button to green and white wires (Discrete Input 4) on the expansion cable. (See below image). Installation guides available online @ www.awti.com 6 | P a g e Event Button Diagram 5. Connecting 3rd Eye Cam Window Unit DVI Cable Connection Locate the hinge door on the top side of the window unit which contains the HDMI connection. Connecting the HDMI to the WU (widow unit) socket may be difficult at times. Be sure not to put too Insert the HDMI cable into the top of the window unit until it is plugged into the outlet. much force on the connection to avoid damaging the socket. Close the hinge door to secure the HDMI connection. Match the security screw that is attached to the door hinge with the pre-made hole that is directly below the hinge. Use the appropriate spanner drive to fasten the U-screw into the threaded hole. Do not over tighten. 6. Mounting Window Unit Once an area for mounting has been chosen, clean desired area with alcohol wipes and allow to dry for proper adhesion of the window unit bracket. Once area is dry, slowly peel away the plastic lining protecting the adhesive on the back of the window unit bracket. The cameras position must be vertical and pointing straight back. Apply window unit to glass and continue applying pressure for a minimum of 30 seconds for proper adhesion to the glass. Once the Window Unit has been mounted, mount the antennas. The antenna needs to be mounted one on either side of the windshield as high on the glass as possible for minimal interference. 7. Connecting Window Unit to UDU After attaching the 3rd Eye Cam to the windshield be sure to hide any extra wire that may obstruct the view of the driver and window unit. If extra wire length is present, loop excess wire in small 4 diameter loops and zip tie together. Insert the DVI cable into headliner and run it across the edge until it reaches the A pillars. Slightly pull the edge of the interior headliner down and insert the excess wire. Disassemble the desired A pillar paneling and run DVI cable behind it. Disassemble the desired kick panel if needed to route DVI cable (depending on UDU location). Run the DVI cable behind all the paneling guiding it to the Under Dash Unit. Insert the DVI cable with UDU outlet using mounting screws on DVI cable overmold. Installation guides available online @ www.awti.com 7 | P a g e 8. Connecting Antenna to UDU After attaching antenna to appropriate position on Windshield, connect 15 feet long antenna cable with UDU as per instruction below:

As shown in above image, o Connect antenna MIMO1 cable with MIMO1 location (Transmit Port) indicated on antenna door o Connect antenna MIMO2 cable with MIMO2 location (Rx Diversity Port) indicated on antenna door o Connect GPS cable with GPS location indicated on antenna door Installation guides available online @ www.awti.com 8 | P a g e 9. Connecting to Power Source The V3 requires the new power board in order to provide clean power for optimum performance. Connect the power cable to the input side of the power board unit and connect the jumper cable to the output of the power board directly to the UDU. Power Cable Side Power Cable w/Backup Battery Power Cable w/Backup Battery

(Top)

(Front) The power wires consist of multiple intertwined wires that are individually colored red, black, black/yellow and orange. Connector P2 (see below) with wire colors blue, pink and grey are for the battery backup system (not supplied/optional). Color Code Diagram In order to reach a power source these wires need to reach from the UDU to the exterior of the truck where the battery is located. Note: To make it easier while maneuvering the wires through the dash do not separate the wires from one another. Starting with the bare wire ends insert the wires below the dash on desired side

(passenger/driver). Tip: Applying electrical tape near the end of the wires makes it easier to keep them all together while maneuvering through the dash. Once the wires are near either kick panel look for a point of entry, preferably with a rubber grommet, leading to the exterior of the vehicle. If no grommet is present, find a discrete location away from other major wiring or mechanical components to drill a pass through whole. Tip: Remember to look twice and drill once before drilling into any surface to avoid property damage or personal injury. Once a hole has been made, use burr tool to eliminate any sharp edges and insert rubber grommet. Feed the wires through the opening. Note: Leave black/yellow, orange, and green/yellow braided wires leading into the interior of the vehicle. Once wires have been passed through, locate the wires on the exterior of vehicle. Without losing the ability to connect the other end to the UDU gain a comfortable amount of slack so the wires can be worked on. Installation guides available online @ www.awti.com 9 | P a g e Begin unbraiding the wires from one another while keeping them intertwined in the cab. Now that the wires are individualized outside the cab into three separate red, black, and orange wires add appropriate diameter wire loom to each pair. This wire loom should start from the point of wire separation up to 3 to 4 inches from end. Be sure to wrap all the wire loom ends to the wire with electrical tape to avoid displacement. Wiring Connection/Descriptions Note: Wires are in order of required connection. Black/Yellow Wire The black/yellow wire needs to be connected to the chassis ground. Locate black/yellow wire in interior of vehicle. (wire end was left in interior) Since chassis ground is susceptible to corrosion from exterior elements, it is best to find chassis ground on interior of vehicle. Locate an empty area of chassis. The wire can be grounded to several parts of the vehicle as long as it is mounted to a large all metal part. The vehicles frame, firewall, or chassis are all appropriate places for grounding. If all is clear, using an end wire brush, strip desired grounding point of paint or oxidation. Verify that there are no moving components or electrical wiring on either side. Using the appropriate ring terminals, crimp a ring terminal to the end of the wire. Using a self-tapping screw and star washers ground ring terminal to chassis. Note: When grounding, use a star washer below the ring terminal. Doing this will provide multiple grounding points instead of a single point in case oxidation ever does become an issue. Black Wire The black wire needs to be connected to battery ground because electrical currents will leak into a non-

insulated metal part of the vehicle and cause a serious electrical shock. Remove the negative battery post clamp. Using the appropriate ring terminals, crimp a ring terminal to the end of the wire and attach securely to the battery post clamp. Re-connect the positive clamp to the positive post. Secure wire to existing positive wire with a zip tie to avoid movement and possible loose connections in the future. Orange Wire The orange wire power needs to be connected to a true ignition source in the vehicle along with an inline fuse leading to the UDU. Locate the orange wire in interior of vehicle. Using a digital multimeter locate a true ignition source. Tip: The steering column will be the easiest place to find a true ignition. Warning: A digital multimeter is the ONLY appropriate tool for testing wires in any vehicle. Test lights and or test probes are prohibited. Failure to use a digital multimeter can cause extensive damage to the onboard computers in a vehicle and or cause personal injury. Installation guides available online @ www.awti.com 10 | P a g e Note: A true ignition source will only show 12v when the key is in the ACC and ON position. 12v will not be present when the vehicle is cranking. Using the appropriate size wire tap, install the wire tap to end of orange wire. Tap the orange wire to the ignition wire that was located. 3 to 4 inches away from the end of orange wire place a zip tie and fasten to existing vehicle harness to avoid movement and possible loose connections in the future. Red Wire The red power wire needs to be connected directly to the battery of the vehicle in order for the 3rd Eye Unit to maintain a constant 12v source. Remove the positive battery post clamp. Using the appropriate ring terminals, crimp a ring terminal to the end of the wire and attach securely to the battery post clamp. Re-connect the positive clamp to the positive post. Secure the wire to an existing positive wire with a zip tie to avoid movement and possible loose connections in the future. Green & Yellow Wires 9 Locate the green and yellow braided wires (J1939 Data) on power cable. Locate the J-1939 Y-Splitter. (See below) Connect the vehicles J-1939 connector to the stem of the J-1939 Y Splitter. (This is usually in the upper dog house center console area). There will be a dead end terminating resistor. Unplug the terminating resistor and install the 3EC1939Y-M1 or 3EC1939Y-AUTOCAR cable. Install the terminating resistor back into the 1939Y cable. Connect the green & yellow wires from power cable to the green and yellow wires on the J1939-Y Splitter (color to color) using appropriate connectors. Once connections have been made, do a U loop on the green and yellow wires and zip tie both ends to give the wires stress relief to avoid movement and possible loose connections in the future. J1939 Diagram Installation guides available online @ www.awti.com 11 | P a g e Component Connection At this point of the installation all components have been mounted and wire connections made. Next, connect all the components to the UDU in the following order. o Expansion o AV Splitter Cable o HDMI to Monitor o DVI to WU o Power Cable Locate the disconnect switch on the exterior of vehicle (normally near battery) Turn disconnect switch to ON position. Turn ignition to ON and RUNNING position. The 3rd Eye unit normally takes 45-90 seconds to boot up from a cold boot. Allow this amount of time to generate a 3G lock solid orange and GPS lock solid green Once locks are generated, visit http://awti.3rdeyecam.com/tem/installer/search?t=1da77663-a9b5-

46ae-8cae-f01519d4d67f from your mobile device and follow the steps provided in the Micro-Site Guide. Once all the steps have been followed call the 3rd Eye Hotline @ (281) 977-0858 to receive the final All Systems Up confirmation. Once confirmation has been received, all the panels in the vehicle can be reassembled. Installation Completion Complete a vehicle walk-through to make sure all panels have been reassembled correctly. Check for any loose or extra screws. Make sure no tools have been left behind. Make sure all notes and pictures of the install have been uploaded to the micro-site before exiting vehicle. This 3rd Eye Cam equipped vehicle is now ready for monitoring. Additional Information 3rd Eye Cam support is available 24 hours/7 days @ (281) 977-0858 for any 3rd Eye related product needs. You can also reach us @ drivesupport@awti.net End of Document Installation guides available online @ www.awti.com 12 | P a g e

 

 

Cinterion PLS8-X/PLS8-V Hardware Interface Description Version: 03.016 DocId: PLS8-X_PLS8-V_HD_v03.016 M2M.GEMALTO.COM Cinterion PLS8-X/PLS8-V Hardware Interface Description Page 2 of 105 2 Document Name:

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Status Cinterion PLS8-X/PLS8-V Hardware Interface Description 03.016 2015-12-09 PLS8-X_PLS8-V_HD_v03.016 Confidential / Released GENERAL NOTE THE USE OF THE PRODUCT INCLUDING THE SOFTWARE AND DOCUMENTATION (THE "PROD-

UCT") IS SUBJECT TO THE RELEASE NOTE PROVIDED TOGETHER WITH PRODUCT. IN ANY EVENT THE PROVISIONS OF THE RELEASE NOTE SHALL PREVAIL. THIS DOCUMENT CONTAINS INFORMATION ON GEMALTO M2M PRODUCTS. THE SPECIFICATIONS IN THIS DOCUMENT ARE SUBJECT TO CHANGE AT GEMALTO M2M'S DISCRETION. GEMALTO M2M GMBH GRANTS A NON-

EXCLUSIVE RIGHT TO USE THE PRODUCT. THE RECIPIENT SHALL NOT TRANSFER, COPY, MODIFY, TRANSLATE, REVERSE ENGINEER, CREATE DERIVATIVE WORKS; DISASSEMBLE OR DECOMPILE THE PRODUCT OR OTHERWISE USE THE PRODUCT EXCEPT AS SPECIFICALLY AUTHORIZED. THE PRODUCT AND THIS DOCUMENT ARE PROVIDED ON AN "AS IS" BASIS ONLY AND MAY CONTAIN DEFICIENCIES OR INADEQUACIES. TO THE MAXIMUM EXTENT PERMITTED BY APPLICABLE LAW, GEMALTO M2M GMBH DISCLAIMS ALL WARRANTIES AND LIABILITIES. THE RECIPIENT UNDERTAKES FOR AN UNLIMITED PERIOD OF TIME TO OBSERVE SECRECY REGARDING ANY INFORMATION AND DATA PROVIDED TO HIM IN THE CONTEXT OF THE DELIV-

ERY OF THE PRODUCT. THIS GENERAL NOTE SHALL BE GOVERNED AND CONSTRUED ACCORDING TO GERMAN LAW. Copyright Transmittal, reproduction, dissemination and/or editing of this document as well as utilization of its con-

tents and communication thereof to others without express authorization are prohibited. Offenders will be held liable for payment of damages. All rights created by patent grant or registration of a utility model or design patent are reserved. Copyright 2015, Gemalto M2M GmbH, a Gemalto Company Trademark Notice Gemalto, the Gemalto logo, are trademarks and service marks of Gemalto and are registered in certain countries. Microsoft and Windows are either registered trademarks or trademarks of Microsoft Corpora-

tion in the United States and/or other countries. All other registered trademarks or trademarks mentioned in this document are property of their respective owners. PLS8-X_PLS8-V_HD_v03.016 Confidential / Released 2015-12-09 Cinterion PLS8-X/PLS8-V Hardware Interface Description Contents 105 Page 3 of 105 Contents 0 1 2 3 3.3 Document History ....................................................................................................... 8 Introduction ................................................................................................................. 9 Supported Products ........................................................................................... 9 1.1 Related Documents ........................................................................................... 9 1.2 1.3 Terms and Abbreviations ................................................................................... 9 Regulatory and Type Approval Information ..................................................... 12 1.4 1.4.1 Directives and Standards.................................................................... 12 1.4.2 SAR requirements specific to portable mobiles .................................. 14 SELV Requirements ........................................................................... 15 1.4.3 1.4.4 Safety Precautions.............................................................................. 15 Product Concept ....................................................................................................... 16 Key Features at a Glance ................................................................................ 16 2.1 PLS8-X/PLS8-V System Overview .................................................................. 19 2.2 2.3 Circuit Concept ................................................................................................ 20 Application Interface................................................................................................. 21 Operating Modes ............................................................................................. 22 3.1 Power Supply................................................................................................... 23 3.2 3.2.1 Minimizing Power Losses ................................................................... 24 3.2.2 Monitoring Power Supply by AT Command ........................................ 24 Power-Up / Power-Down Scenarios ................................................................ 25 3.3.1 Turn on PLS8-X/PLS8-V..................................................................... 25 Signal States after Startup .................................................................. 26 3.3.2 Turn off PLS8-X/PLS8-V Using AT Command ................................... 27 3.3.3 Turn off PLS8-X/PLS8-V Using IGT Line............................................ 28 3.3.4 3.3.5 Automatic Shutdown ........................................................................... 29 3.3.5.1 Thermal Shutdown .............................................................. 29 3.3.5.2 Deferred Shutdown at Extreme Temperature Conditions.... 30 3.3.5.3 Undervoltage Shutdown...................................................... 31 3.3.5.4 Overvoltage Shutdown........................................................ 31 3.3.6 Turn off PLS8-X/PLS8-V in Case of Emergency ................................ 32 Power Saving................................................................................................... 33 3.4.1 Wake-up via RTS0.............................................................................. 34 RTC Backup..................................................................................................... 35 USB Interface................................................................................................... 36 3.6.1 Reducing Power Consumption (TBD.)................................................ 37 Serial Interface ASC0 ...................................................................................... 38 UICC/SIM/USIM Interface................................................................................ 40 3.8.1 Enhanced ESD Protection for SIM Interface....................................... 42 Digital Audio Interface...................................................................................... 43 3.9.1 Pulse Code Modulation Interface (PCM) ............................................ 43 Inter IC Sound Interface (I2S)........................................................................... 43 3.10 3.11 Analog-to-Digital Converter (ADC)................................................................... 44 3.12 GPIO Interface ................................................................................................. 44 3.5 3.6 3.7 3.8 3.9 3.4 PLS8-X_PLS8-V_HD_v03.016 Confidential / Released 2015-12-09 Cinterion PLS8-X/PLS8-V Hardware Interface Description Contents 105 Page 4 of 105 4 5 6 7 6.3 6.4 3.13 Control Signals................................................................................................. 45 3.13.1 PWR_IND Signal ................................................................................ 45 3.13.2 Behavior of the RING0 Line ................................................................ 45 3.13.3 Remote Wakeup ................................................................................. 46 3.13.4 Low Current Indicator (LCI)................................................................. 47 3.13.5 Network Connectivity and Technology Status Signals........................ 48 3.13.6 700MHz Antenna Switch Control ........................................................ 49 GNSS Receiver.......................................................................................................... 50 Antenna Interfaces.................................................................................................... 51 5.1 GSM/UMTS/LTE Antenna Interface................................................................. 51 5.1.1 Antenna Installation ............................................................................ 52 5.1.2 RF Line Routing Design...................................................................... 53 5.1.2.1 Line Arrangement Examples............................................... 53 5.1.2.2 Routing Example................................................................. 55 5.2 GNSS Antenna Interface ................................................................................. 56 Electrical, Reliability and Radio Characteristics.................................................... 58 Absolute Maximum Ratings ............................................................................. 58 6.1 Operating Temperatures.................................................................................. 59 6.2 6.2.1 Temperature Allocation Model ............................................................ 60 Storage Conditions .......................................................................................... 60 Reliability Characteristics................................................................................. 61 6.4.1 Bending Tests ..................................................................................... 62 6.5 Pad Assignment and Signal Description.......................................................... 63 6.6 Power Supply Ratings...................................................................................... 72 6.7 RF Antenna Interface Characteristics .............................................................. 76 6.8 GNSS Interface Characteristics ....................................................................... 80 6.9 Electrostatic Discharge .................................................................................... 81 Mechanics, Mounting and Packaging ..................................................................... 82 Mechanical Dimensions of PLS8-X/PLS8-V .................................................... 82 7.1 7.2 Mounting PLS8-X/PLS8-V onto the Application Platform ................................ 84 SMT PCB Assembly ........................................................................... 84 7.2.1 7.2.1.1 Land Pattern and Stencil ..................................................... 84 7.2.1.2 Board Level Characterization.............................................. 86 7.2.2 Moisture Sensitivity Level ................................................................... 86 Soldering Conditions and Temperature .............................................. 87 7.2.3 7.2.3.1 Reflow Profile ...................................................................... 87 7.2.3.2 Maximum Temperature and Duration.................................. 88 7.2.4 Durability and Mechanical Handling.................................................... 89 7.2.4.1 Storage Life ......................................................................... 89 7.2.4.2 Processing Life.................................................................... 89 7.2.4.3 Baking ................................................................................. 89 7.2.4.4 Electrostatic Discharge........................................................ 89 PLS8-X_PLS8-V_HD_v03.016 Confidential / Released 2015-12-09 Cinterion PLS8-X/PLS8-V Hardware Interface Description Contents 105 Page 5 of 105 7.3 7.3.2 Packaging ........................................................................................................ 90 Tape and Reel .................................................................................... 90 7.3.1 7.3.1.1 Orientation........................................................................... 90 7.3.1.2 Barcode Label ..................................................................... 91 Shipping Materials .............................................................................. 92 7.3.2.1 Moisture Barrier Bag ........................................................... 92 7.3.2.2 Transportation Box .............................................................. 94 Sample Application................................................................................................... 95 8.1 Sample Level Conversion Circuit..................................................................... 97 Reference Approval .................................................................................................. 98 Reference Equipment for Type Approval......................................................... 98 9.1 9.2 Compliance with FCC and IC Rules and Regulations ..................................... 99 Appendix.................................................................................................................. 101 10.1 List of Parts and Accessories......................................................................... 101 10.2 Mounting Advice Sheet .................................................................................. 103 8 9 10 PLS8-X_PLS8-V_HD_v03.016 Confidential / Released 2015-12-09 Cinterion PLS8-X/PLS8-V Hardware Interface Description Tables 105 Page 6 of 105 Tables Table 1:

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Directives ....................................................................................................... 12 Standards of North American type approval .................................................. 12 Requirements of quality ................................................................................. 12 Standards of the Ministry of Information Industry of the Peoples Republic of China............................................................................ 13 Toxic or hazardous substances or elements with defined concentration limits............................................................................................................... 13 Overview of operating modes ........................................................................ 22 Signal states................................................................................................... 26 Temperature dependent behavior.................................................................. 29 DCE-DTE wiring of ASC0 .............................................................................. 39 Signals of the SIM interface (SMT application interface) ............................... 40 Overview of PCM pin functions...................................................................... 43 Overview of I2S pin functions ......................................................................... 43 Host wakeup lines.......................................................................................... 46 Low current indicator line ............................................................................... 47 Return loss in the active band........................................................................ 51 Absolute maximum ratings............................................................................. 58 Board temperature ......................................................................................... 59 Temperature allocation model........................................................................ 60 Storage conditions ......................................................................................... 60 Summary of reliability test conditions............................................................. 61 Overview: Pad assignments........................................................................... 64 Signal description........................................................................................... 67 Voltage supply ratings.................................................................................... 72 Current consumption ratings.......................................................................... 72 RF Antenna interface GSM / UMTS/LTE (at operating temperature range) .. 76 GNSS properties............................................................................................ 80 Power supply for active GNSS antenna......................................................... 80 Electrostatic values ........................................................................................ 81 Reflow temperature ratings............................................................................ 87 Antenna gain limits for FCC and IC................................................................ 99 List of parts and accessories........................................................................ 101 Molex sales contacts (subject to change) .................................................... 102 Hirose sales contacts (subject to change) ................................................... 102 PLS8-X_PLS8-V_HD_v03.016 Confidential / Released 2015-12-09 Cinterion PLS8-X/PLS8-V Hardware Interface Description Figures 105 Page 7 of 105 Figures Figure 1:

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Figure 43:

Figure 44:

PLS8-X/PLS8-V system overview.................................................................. 19 PLS8-X/PLS8-V block diagram...................................................................... 20 Decoupling capacitor(s) for BATT+................................................................ 23 Power supply limits during transmit burst....................................................... 24 Power-on with IGT ......................................................................................... 25 Signal states during turn-off procedure.......................................................... 27 Timing of IGT if used as ON/OFF switch ....................................................... 28 Shutdown by EMERG_OFF signal................................................................. 32 Wake-up via RTS0......................................................................................... 34 RTC supply variants....................................................................................... 35 USB circuit ..................................................................................................... 36 Serial interface ASC0..................................................................................... 38 First UICC/SIM/USIM interface ...................................................................... 41 Second UICC/SIM/USIM interface................................................................. 41 SIM interface - enhanced ESD protection...................................................... 42 PWR_IND signal ............................................................................................ 45 Low current indication timing (still to be confirmed) ....................................... 47 LED circuit (example)..................................................................................... 48 Antenna pads (bottom view) .......................................................................... 52 Embedded Stripline line arrangement............................................................ 53 Micro-Stripline line arrangement samples...................................................... 54 Routing to applications RF connector ........................................................... 55 PLS8-X/PLS8-V evaluation board layer table ................................................ 55 Supply voltage for active GNSS antenna....................................................... 56 ESD protection for passive GNSS antenna ................................................... 57 Board and ambient temperature differences.................................................. 59 Bending test setup ......................................................................................... 62 PLS8-X/PLS8-V bottom view: Pad assignments............................................ 65 PLS8-X/PLS8-V top view: Pad assignments.................................................. 66 PLS8-X/PLS8-V top and bottom view ......................................................... 82 Dimensions of PLS8-X/PLS8-V (all dimensions in mm)................................. 83 Land pattern (top layer).................................................................................. 84 Recommended design for 110 micron thick stencil (top layer) ...................... 85 Recommended design for 150 micron thick stencil (top layer) ...................... 85 Reflow Profile................................................................................................. 87 Carrier tape .................................................................................................... 90 Roll direction .................................................................................................. 90 Barcode label on tape reel ............................................................................. 91 Moisture barrier bag (MBB) with imprint......................................................... 92 Moisture Sensitivity Label .............................................................................. 93 Humidity Indicator Card - HIC ........................................................................ 94 PLS8-X/PLS8-V sample application............................................................... 96 Sample level conversion circuit...................................................................... 97 Reference equipment for type approval......................................................... 98 PLS8-X_PLS8-V_HD_v03.016 Confidential / Released 2015-12-09 Cinterion PLS8-X/PLS8-V Hardware Interface Description 0 Document History 8 Page 8 of 105 Document History 0 Preceding document: "Cinterion PLS8-X/PLS8-V Hardware Interface Description" v02.510 New document: "Cinterion PLS8-X/PLS8-V Hardware Interface Description" Version 03.016 Chapter Throughout document 1.4 What is new Added information on dead reckoning synchronization line. Removed ECE-R 10 directive from Table 1. Updated NAPRD version in Table 2. Added USAT as supported feature. Revised section including Figure 7. Revised description of power save mode and removed previous sections 3.4.1, 3.4.2, and 3.4.2. Shortened section, because PLS8-X and PLS8-V are data only modules, and the mod-

ules digital audio interface therefore only supports local tones. Revised section to mention VCC C in PWR_IND circuit. Revised description of remote host wakeup functionality. Updated other sections accordingly. New section 700MHz Antenna Switch Control. Revised ratings for VGNSS in Figure 24. Revised temperature allocation model given in Table 18. Host wakeup functionality added for GPIOs in Table 22. Revised ramp down rate given in Table 29. Revised maximum antenna gain limits - added Table 30. 2.1 3.3.4 3.4 3.9 3.13.1 3.13.3 3.13.6 5.2 6.2.1 6.5 7.2.3.1 9.2 Preceding document: "Cinterion PLS8-X/PLS8-V Hardware Interface Description" v02.502 New document: "Cinterion PLS8-X/PLS8-V Hardware Interface Description" Version 02.510 Chapter Throughout document 2.3 3.5 6.5 6.6 What is new Added real time clock (RTC) information. Added VDDLP line information. Revised Figure 2 to differentiate between PLS8-X and PLS8-V. New section RTC Backup. Added characteristics for VDDLP line (RTC backup) in Table 22. Revised current consumption ratings for IDLE mode in Table 24. Added current consumption rating for GPRS data transfer (4Tx/1Rx @ total mismatch). Revised average GSM/UMTS/LTE current consumption ratings while GNSS is ON. Revised description for average ramp up and ramp down rates in Table 29. 7.2.3.1 New document: "Cinterion PLS8-X/PLS8-V Hardware Interface Description" Version 02.502 Chapter

--

What is new Initial document setup. PLS8-X_PLS8-V_HD_v03.016 Confidential / Released 2015-12-09 Cinterion PLS8-X/PLS8-V Hardware Interface Description 1 Introduction 15 Page 9 of 105 1 Introduction The document1 describes the hardware of the two Cinterion modules variants PLS8-V and PLS8-X, designed to connect to a cellular device application and the air interface. It helps you quickly retrieve interface specifications, electrical and mechanical details and information on the requirements to be considered for integrating further components. The product variants differ in their radio access technology support:

PLS8-X is available for operation in LTE, UMTS and GSM radio networks - for supported frequency bands please refer to Section 2.1. Connected to this, the module has two sepa-

rate firmware images on board that can be activated based on the used (U)SIM card. Employing the modules two (U)SIM interfaces, it is thus possible to switch between firm-

ware images on the fly - making PLS8-X a multi carrier/provider module. PLS8-V in contrast is available for operation in LTE radio networks only - for supported fre-

quency bands please refer to Section 2.1. It has only a single firmware image on board that can be activated by (U)SIM card - making it a single carrier/provider module. If not otherwise mentioned, this document applies to both product variants. Where necessary a note is made to differentiate between the variants. 1.1 Supported Products This document applies to the following Gemalto M2M products:

Cinterion PLS8-V module Cinterion PLS8-X module 1.2 Related Documents

[1] AT Command Set for your Gemalto M2M product

[2] Release Notes for your Gemalto M2M product

[3] Application Note 48: SMT Module Integration

[4] Universal Serial Bus Specification Revision 2.0, April 27, 2000 1.3 Terms and Abbreviations Abbreviation ANSI ARP CE CS CS CSD DCS Description American National Standards Institute Antenna Reference Point Conformit Europene (European Conformity) Coding Scheme Circuit Switched Circuit Switched Data Digital Cellular System 1. The document is effective only if listed in the appropriate Release Notes as part of the technical documentation delivered with your Gemalto M2M product. PLS8-X_PLS8-V_HD_v03.016 Confidential / Released 2015-12-09 Cinterion PLS8-X/PLS8-V Hardware Interface Description 1.3 Terms and Abbreviations 15 Page 10 of 105 Abbreviation DL dnu DRX DSB DTX EDGE EGSM EMC ESD ETS ETSI FCC FDD GPRS GSM HiZ HSDPA I/O IMEI ISO ITU kbps LCI LED LGA LTE MBB Mbps MCS MIMO MLCC MO MS MSL MT nc Description Download Do not use Discontinuous Reception Development Support Board Discontinuous Transmission Enhanced Data rates for GSM Evolution Extended GSM Electromagnetic Compatibility Electrostatic Discharge European Telecommunication Standard European Telecommunications Standards Institute Federal Communications Commission (U.S.) Frequency Division Duplex General Packet Radio Service Global Standard for Mobile Communications High Impedance High Speed Downlink Packet Access Input/Output International Mobile Equipment Identity International Standards Organization International Telecommunications Union kbits per second Low Current Indicator Light Emitting Diode Land Grid Array Long term evolution Moisture barrier bag Mbits per second Modulation and Coding Scheme Multiple Input Multiple Output Multi Layer Ceramic Capacitor Mobile Originated Mobile Station, also referred to as TE Moisture Sensitivity Level Mobile Terminated Not connected PLS8-X_PLS8-V_HD_v03.016 Confidential / Released 2015-12-09 Cinterion PLS8-X/PLS8-V Hardware Interface Description 1.3 Terms and Abbreviations 15 Page 11 of 105 Abbreviation NTC PCB PCL PCS PD PDU PS PSK PU QAM R&TTE RF rfu ROPR RTC Rx SAR SELV SIM SMD SMS SMT SRAM SRB TE TPC TS Tx UL UMTS URC USB UICC USIM WB-AMR WCDMA Description Negative Temperature Coefficient Printed Circuit Board Power Control Level Personal Communication System, also referred to as GSM 1900 Pull Down resistor Protocol Data Unit Packet Switched Phase Shift Keying Pull Up resistor Quadrature Amplitude Modulation Radio and Telecommunication Terminal Equipment Radio Frequency Reserved for future use Radio Output Power Reduction Real Time Clock Receive Direction Specific Absorption Rate Safety Extra Low Voltage Subscriber Identification Module Surface Mount Device Short Message Service Surface Mount Technology Static Random Access Memory Signalling Radio Bearer Terminal Equipment Transmit Power Control Technical Specification Transmit Direction Upload Universal Mobile Telecommunications System Unsolicited Result Code Universal Serial Bus USIM Integrated Circuit Card UMTS Subscriber Identification Module Wideband Adaptive Multirate Wideband Code Division Multiple Access PLS8-X_PLS8-V_HD_v03.016 Confidential / Released 2015-12-09 Cinterion PLS8-X/PLS8-V Hardware Interface Description 1.4 Regulatory and Type Approval Information 15 Page 12 of 105 1.4 Regulatory and Type Approval Information Directives and Standards 1.4.1 PLS8-X/PLS8-V has been designed to comply with the directives and standards listed below. It is the responsibility of the application manufacturer to ensure compliance of the final product with all provisions of the applicable directives and standards as well as with the technical spec-

ifications provided in the "PLS8-X/PLS8-V Hardware Interface Description".1 Table 1: Directives 2002/95/EC (RoHS 1) 2011/65/EC (RoHS 2) Directive of the European Parliament and of the Council of 27 January 2003 (and revised on 8 June 2011) on the restriction of the use of certain hazardous substances in electrical and electronic equipment (RoHS) Table 2: Standards of North American type approval CFR Title 47 Code of Federal Regulations, Part 22, Part 24 and Part 27; US Equipment Authorization FCC Evaluating Compliance with FCC Guidelines for Human Exposure to Radio-

frequency Electromagnetic Fields Product Safety Certification (Safety requirements) Overview of PCS Type certification review board Mobile Equipment Type Certification and IMEI control PCS Type Certification Review board (PTCRB) Canadian Standard OET Bulletin 65

(Edition 97-01) UL 60 950-1 NAPRD.03 V5.23 RSS132, RSS133, RSS139 Table 3: Requirements of quality IEC 60068 DIN EN 60529 Environmental testing IP codes 1. Manufacturers of applications which can be used in the US shall ensure that their applications have a PTCRB approval. For this purpose they can refer to the PTCRB approval of the respective module. PLS8-X_PLS8-V_HD_v03.016 Confidential / Released 2015-12-09 Cinterion PLS8-X/PLS8-V Hardware Interface Description 1.4 Regulatory and Type Approval Information 15 Page 13 of 105 Table 4: Standards of the Ministry of Information Industry of the Peoples Republic of China SJ/T 11363-2006 Requirements for Concentration Limits for Certain Hazardous Substances in Electronic Information Products (2006-06). Marking for Control of Pollution Caused by Electronic Information Products (2006-06). SJ/T 11364-2006 According to the Chinese Administration on the Control of Pollution caused by Electronic Information Products

(ACPEIP) the EPUP, i.e., Environmental Protection Use Period, of this product is 20 years as per the symbol shown here, unless otherwise marked. The EPUP is valid only as long as the product is operated within the operating limits described in the Hardware Interface Description. Please see Table 5 for an overview of toxic or hazardous substances or ele-

ments that might be contained in product parts in concentrations above the limits defined by SJ/T 11363-2006. Table 5: Toxic or hazardous substances or elements with defined concentration limits PLS8-X_PLS8-V_HD_v03.016 Confidential / Released 2015-12-09 Cinterion PLS8-X/PLS8-V Hardware Interface Description 1.4 Regulatory and Type Approval Information 15 Page 14 of 105 1.4.2 SAR requirements specific to portable mobiles Mobile phones, PDAs or other portable transmitters and receivers incorporating a GSM module must be in accordance with the guidelines for human exposure to radio frequency energy. This requires the Specific Absorption Rate (SAR) of portable PLS8-X/PLS8-V based applications to be evaluated and approved for compliance with national and/or international regulations. Since the SAR value varies significantly with the individual product design manufacturers are advised to submit their product for approval if designed for portable use. For US markets the relevant directives are mentioned below. It is the responsibility of the manufacturer of the final product to verify whether or not further standards, recommendations or directives are in force outside these areas. Products intended for sale on US markets ES 59005/ANSI C95.1 Considerations for evaluation of human exposure to electromagnetic fields (EMFs) from mobile telecommunication equipment (MTE) in the frequency range 30MHz - 6GHz IMPORTANT:

Manufacturers of portable applications based on PLS8-X/PLS8-V modules are required to have their final product certified and apply for their own FCC Grant and Industry Canada Cer-

tificate related to the specific portable mobile. PLS8-X_PLS8-V_HD_v03.016 Confidential / Released 2015-12-09 Cinterion PLS8-X/PLS8-V Hardware Interface Description 1.4 Regulatory and Type Approval Information 15 Page 15 of 105 1.4.3 SELV Requirements The power supply connected to the PLS8-X/PLS8-V module shall be in compliance with the SELV requirements defined in EN 60950-1. Safety Precautions 1.4.4 The following safety precautions must be observed during all phases of the operation, usage, service or repair of any cellular terminal or mobile incorporating PLS8-X/PLS8-V. Manufactur-

ers of the cellular terminal are advised to convey the following safety information to users and operating personnel and to incorporate these guidelines into all manuals supplied with the product. Failure to comply with these precautions violates safety standards of design, manu-

facture and intended use of the product. Gemalto M2M assumes no liability for customers fail-

ure to comply with these precautions. When in a hospital or other health care facility, observe the restrictions on the use of mobiles. Switch the cellular terminal or mobile off, if instructed to do so by the guide-

lines posted in sensitive areas. Medical equipment may be sensitive to RF energy. The operation of cardiac pacemakers, other implanted medical equipment and hearing aids can be affected by interference from cellular terminals or mobiles placed close to the device. If in doubt about potential danger, contact the physician or the manufac-

turer of the device to verify that the equipment is properly shielded. Pacemaker patients are advised to keep their hand-held mobile away from the pacemaker, while it is on. Switch off the cellular terminal or mobile before boarding an aircraft. Make sure it can-

not be switched on inadvertently. The operation of wireless appliances in an aircraft is forbidden to prevent interference with communications systems. Failure to observe these instructions may lead to the suspension or denial of cellular services to the offender, legal action, or both. Do not operate the cellular terminal or mobile in the presence of flammable gases or fumes. Switch off the cellular terminal when you are near petrol stations, fuel depots, chemical plants or where blasting operations are in progress. Operation of any electri-

cal equipment in potentially explosive atmospheres can constitute a safety hazard. Your cellular terminal or mobile receives and transmits radio frequency energy while switched on. Remember that interference can occur if it is used close to TV sets, radios, computers or inadequately shielded equipment. Follow any special regulations and always switch off the cellular terminal or mobile wherever forbidden, or when you suspect that it may cause interference or danger. IMPORTANT!

Cellular terminals or mobiles operate using radio signals and cellular networks. Because of this, connection cannot be guaranteed at all times under all conditions. Therefore, you should never rely solely upon any wireless device for essential com-

munications, for example emergency calls. Remember, in order to make or receive calls, the cellular terminal or mobile must be switched on and in a service area with adequate cellular signal strength. Some networks do not allow for emergency calls if certain network services or phone features are in use (e.g. lock functions, fixed dialing etc.). You may need to deactivate those features before you can make an emergency call. Some networks require that a valid SIM card be properly inserted in the cellular termi-

nal or mobile. PLS8-X_PLS8-V_HD_v03.016 Confidential / Released 2015-12-09 Cinterion PLS8-X/PLS8-V Hardware Interface Description 2 Product Concept 20 Page 16 of 105 2 2.1 Product Concept Key Features at a Glance Feature General Frequency bands GSM class Output power (according to Release 99) Implementation PLS8-X:

GSM/GPRS/EDGE: Quad band, 850/900/1800/1900MHz UMTS/HSPA+: Triple band, 850 (BdV) / AWS (BdIV) / 1900MHz (BdII) LTE: Five band, 700 (Bd13) / 700 (Bd17) / 850 (Bd5) / AWS (Bd4) /

1900MHz (Bd2) PLS8-V:

LTE: Triple band, 700 (Bd13) / AWS (Bd4) / 1900MHz (Bd2) Small MS Class 4 (+33dBm 2dB) for EGSM850 Class 4 (+33dBm 2dB) for EGSM900 Class 1 (+30dBm 2dB) for GSM1800 Class 1 (+30dBm 2dB) for GSM1900 Class E2 (+27dBm 3dB) for GSM 850 8-PSK Class E2 (+27dBm 3dB) for GSM 900 8-PSK Class E2 (+26dBm +3 /-4dB) for GSM 1800 8-PSK Class E2 (+26dBm +3 /-4dB) for GSM 1900 8-PSK Class 3 (+24dBm +1/-3dB) for UMTS 1900,WCDMA FDD BdII Class 3 (+24dBm +1/-3dB) for UMTS AWS, WCDMA FDD BdIV Class 3 (+24dBm +1/-3dB) for UMTS 850, WCDMA FDD BdV Output power (according to Release 8) Class 3 (+23dBm +-2dB) for LTE 1900, LTE FDD Bd2 Class 3 (+23dBm +-2dB) for LTE AWS, LTE FDD Bd4 Class 3 (+23dBm +-2dB) for LTE 850, LTE FDD Bd5 Class 3 (+23dBm +-2dB) for LTE 700, LTE FDD Bd13 Class 3 (+23dBm +-2dB) for LTE 700, LTE FDD Bd17 Power supply Operating temperature

(board temperature) 3.3V < VBATT+ < 4.2V Normal operation: -30C to +85C Extended operation: -40C to +95C Physical RoHS LTE features 3GPP Release 9 HSPA features 3GPP Release 8 Dimensions: 33mm x 29mm x 2.95mm Weight: approx. 4.5g All hardware components fully compliant with EU RoHS Directive UE CAT 3 supported DL 100Mbps, UL 50Mbps 2x2 MIMO in DL direction UE CAT. 14, 24 DC-HSPA+ DL 42Mbps HSUPA UL 5.76Mbps Compressed mode (CM) supported according to 3GPP TS25.212 PLS8-X_PLS8-V_HD_v03.016 Confidential / Released 2015-12-09 Cinterion PLS8-X/PLS8-V Hardware Interface Description 2.1 Key Features at a Glance 20 Page 17 of 105 Feature UMTS features 3GPP Release 8 Implementation PS data rate 384 kbps DL / 384 kbps UL GSM / GPRS / EGPRS features Data transfer EDGE E2 power class for 8 PSK GPRS:

Multislot Class 12 Mobile Station Class B Coding Scheme 1 4 EGPRS:

Multislot Class 12 Downlink coding schemes CS 1-4, MCS 1-9 Uplink coding schemes CS 1-4, MCS 1-9 NACC, extended UL TBF Mobile Station Class B Point-to-point MT and MO Cell broadcast Text and PDU mode SRB loopback and test mode B 8-bit, 11-bit RACH 1 phase/2 phase access procedures Link adaptation and IR SMS Software AT commands Firmware update U/SIM application toolkit GNSS Features Protocol Modes General Interfaces Module interface Antenna Hayes, 3GPP TS 27.007 and 27.005, and proprietary Gemalto M2M com-

mands Generic update from host application over USB and ASC0 USAT letter c; with BIP NMEA Standalone GNSS Assisted GNSS

- Control plane - E911

- User plane - gpsOneXTRA Power saving modes Power supply for active antenna Surface mount device with solderable connection pads (SMT application interface). Land grid array (LGA) technology ensures high solder joint reliability and provides the possibility to use an optional module mounting socket. For more information on how to integrate SMT modules see also [3]. This application note comprises chapters on module mounting and application layout issues as well as on additional SMT application development equipment. 50. GSM/UMTS/LTE main antenna, UMTS/LTE Diversity/MIMO antenna, (active/passive) GNSS antenna PLS8-X_PLS8-V_HD_v03.016 Confidential / Released 2015-12-09 Cinterion PLS8-X/PLS8-V Hardware Interface Description 2.1 Key Features at a Glance 20 Page 18 of 105 Feature USB Serial interface UICC interface Audio Status RING0 Power on/off, Reset Power on/off Reset Implementation USB 2.0 High Speed (480Mbit/s) device interface ASC0:

8-wire modem interface with status and control lines, unbalanced, asynchronous Adjustable baud rate of 115,200bps to 921,600bps Supports RTS0/CTS0 hardware flow control 2 UICC interfaces (switchable) Supported chip cards: UICC/SIM/USIM 3V, 1.8V 1 digital interface (PCM or I2S) Signal line to indicate network connectivity state Signal line to indicate incoming calls and other types of URCs Switch-on by hardware signal IGT Switch-off by AT command (AT^SMSO) or IGT Automatic switch-off in case of critical temperature or voltage conditions Orderly shutdown and reset by AT command Emergency-off Emergency-off by hardware signal EMERG_OFF if IGT is not active Special Features Antenna GPIO ADC inputs Evaluation kit Evaluation module DSB75 SAIC (Single Antenna Interference Cancellation) / DARP (Downlink Advanced Receiver Performance) Rx Diversity (receiver type 3i - 64-QAM) / MIMO 10 I/O pins of the application interface programmable as GPIO. GPIOs can be configured as low current indicator (LCI). GPIO1 can be configured as dead reckoning synchronization signal. GPIO2 can be configured as 700MHz antenna switch control signal. GPIOs can be configured as remote host wakeup lines. Programming is done via AT commands. Analog-to-Digital Converter with three unbalanced analog inputs. PLS8-X/PLS8-V module soldered onto a dedicated PCB that can be con-

nected to an adapter in order to be mounted onto the DSB75. DSB75 Development Support Board designed to test and type approve Gemalto M2M modules and provide a sample configuration for applica-

tion engineering. A special adapter is required to connect the PLS8-X/

PLS8-V evaluation module to the DSB75. PLS8-X_PLS8-V_HD_v03.016 Confidential / Released 2015-12-09 Cinterion PLS8-X/PLS8-V Hardware Interface Description 2.2 PLS8-X/PLS8-V System Overview 20 Page 19 of 105 2.2 PLS8-X/PLS8-V System Overview GNSS antenna GSM/UMTS/LTE Antenna diversity 1 2 GNSS active antenna supply, current limiter Power supply GNSS GSM/UMTS/LTE Application Module USB Serial ASC0 ADC GPIO UICC Digital audio Power supply RTC IGT, Emergency Off Net state/

status e c a f r e n t i m e d o M SIM card Host application SIM card PCM or I2S codec

) T X E V

(

) I D N _ R W P

(

n o i t i a c d n i r e w o P n o i t a c i l p p a r o f r e w o P or On/Off Figure 1: PLS8-X/PLS8-V system overview PLS8-X_PLS8-V_HD_v03.016 Confidential / Released 2015-12-09 Cinterion PLS8-X/PLS8-V Hardware Interface Description 2.3 Circuit Concept 20 Page 20 of 105 2.3 Circuit Concept Figure 2 shows a block diagram of the PLS8-X/PLS8-V module and illustrates the major func-

tional components:

Baseband block:

GSM/UMTS/LTE controller/transceiver/power supply Stacked Flash/RAM memory with multiplexed address data bus Application interface (SMT with connecting pads) RF section:

RF transceiver RF power amplifier/frontend RF filter GNSS receiver/Front end Antenna pad LGA Pads VEXT USB GPIO 1..10 DAI/PCM/I2S 2x USIM Serial (ASC0) s d a p a n n e n A t GSM/

UMTS/

LTE UMTS/

LTE Diversity/MIMO Power supply Flash /

DDR RAM F R _

+

T T A B 2x 2x 5x 3x 5x 3x SP10T 5x 3x SP5T RF Part Power Supply s O P G I HW-

IDs GSM-TX GSM-RX LTE/UMTS-RX LTE/

UMTS-TX HDET

/

C A D

/

h s a F l

/

C A D

/

M A R GSM/UMTS/LTE

* Baseband controller

* RF transceiver GNSS

* receiver MIMO Control Blue: PLS8-X only Red: PLS8-V only S S N G F R l y p p u s r e w o P t p u r r e t n I t e s e R e c a f r e t n i l o r t n o C z H M 2

. 9 1 z H k 8 6 7

. 2 3 l y p p u s B S U GNSS RF DC RF DC X-tals:

32.768kHz 19.2MHz Temp. Sensor NTC Power management IC ADC BATT+

VDDLP PWR_IND EMERG_OFF STATUS 3xADC IGT VGNSS GND BATT+_RF 2 2 BATT+_RF BATT+

ANT_GNSS_DC Figure 2: PLS8-X/PLS8-V block diagram PLS8-X_PLS8-V_HD_v03.016 Confidential / Released 2015-12-09 Cinterion PLS8-X/PLS8-V Hardware Interface Description 3 Application Interface 50 Page 21 of 105 3 Application Interface PLS8-X/PLS8-V is equipped with an SMT application interface (LGA pads) that connects to the external application. The host interface incorporates several sub-interfaces described in the fol-

lowing sections:

Operating modes - see Section 3.1 Power supply - see Section 3.2 RTC backup - see Section 3.5 Serial interface USB - see Section 3.6 Serial interface ASC0 - Section 3.7 UICC/SIM/USIM interface - see Section 3.8 Digital audio interface (PCM or I2S) - see Section 3.9 ADC interface - Section 3.11 GPIO interface - Section 3.12 Control and status lines: PWR_IND, STATUS, RING0, STATUS, LCI - see Section 3.13 PLS8-X_PLS8-V_HD_v03.016 Confidential / Released 2015-12-09 Cinterion PLS8-X/PLS8-V Hardware Interface Description 3.1 Operating Modes 50 Page 22 of 105 3.1 Operating Modes The table below briefly summarizes the various operating modes referred to in the following chapters. Table 6: Overview of operating modes Mode Normal operation Function GSM / GPRS /

UMTS / HSPA /

LTE SLEEP GSM / GPRS /

UMTS / HSPA /

LTE IDLE GPRS DATA Power saving set automatically when no call is in progress and the USB connection is detached and no active communication via ASC0. Also, the GNSS active antenna mode has to be turned off or set to "auto". Power saving disabled or an USB connection active, but no data trans-

fer in progress. GPRS data transfer in progress. Power consumption depends on net-

work settings (e.g. power control level), uplink / downlink data rates and GPRS configuration (e.g. used multislot settings). EGPRS data transfer in progress. Power consumption depends on net-

work settings (e.g. power control level), uplink / downlink data rates and EGPRS configuration (e.g. used multislot settings). UMTS data transfer in progress. Power consumption depends on net-

work settings (e.g. TPC Pattern) and data transfer rate. HSPA data transfer in progress. Power consumption depends on net-

work settings (e.g. TPC Pattern) and data transfer rate. LTE data transfer in progress. Power consumption depends on network settings (e.g. TPC Pattern) and data transfer rate. EGPRS DATA UMTS DATA HSPA DATA LTE DATA Power Down Airplane mode Normal shutdown after sending the AT^SMSO command. Only a voltage regulator is active for powering the RTC. Software is not active. Interfaces are not accessible. Operating volt-

age (connected to BATT+) remains applied. Airplane mode shuts down the radio part of the module, causes the module to log off from the GSM/GPRS network and disables all AT commands whose execution requires a radio connection. Airplane mode can be controlled by AT command (see [1]). PLS8-X_PLS8-V_HD_v03.016 Confidential / Released 2015-12-09 Cinterion PLS8-X/PLS8-V Hardware Interface Description 3.2 Power Supply 50 Page 23 of 105 3.2 Power Supply PLS8-X/PLS8-V needs to be connected to a power supply at the SMT application interface - 4 lines BATT+, and GND. There are two separate voltage domains for BATT+:

BATT+_RF with 2 lines for the RF power amplifier supply BATT+ with 2 lines for the general power management. The main power supply from an external application has to be a single voltage source and has to be expanded to two sub paths (star structure). Each voltage domain must be decoupled by application with low ESR capacitors (> 47F MLCC @ BATT+; > 4x47F MLCC @ BATT+_RF) as close as possible to LGA pads. Figure 3 shows a sample circuit for decoupling capacitors for BATT+. Module SMT interface BATT+

BATT+_RF 2 2 1x 4x Decoupling capacitors e.g. 47F X5R MLCC Figure 3: Decoupling capacitor(s) for BATT+

BATT+

GND In addition, the VDDLP pad may be connected to an external capacitor or a battery to backup the RTC (see Section 3.5). Please note that for proper module startup the voltage at BATT+

should be higher than at VDDLP. The power supply of PLS8-X/PLS8-V must be able to provide the peak current during the uplink transmission. All key functions for supplying power to the device are handled by the power management IC. It provides the following features:

Stabilizes the supply voltages for the baseband using switching regulators and low drop lin-

ear voltage regulators. Switches the module's power voltages for the power-up and -down procedures. Delivers, across the VEXT line, a regulated voltage for an external application. LDO to provide SIM power supply. PLS8-X_PLS8-V_HD_v03.016 Confidential / Released 2015-12-09 Cinterion PLS8-X/PLS8-V Hardware Interface Description 3.2 Power Supply 50 Page 24 of 105 3.2.1 Minimizing Power Losses When designing the power supply for your application please pay specific attention to power losses. Ensure that the input voltage VBATT+ never drops below 3.3V on the PLS8-X/PLS8-V board, not even in a transmit burst where current consumption can rise to typical peaks of 2A. It should be noted that PLS8-X/PLS8-V switches off when exceeding these limits. Any voltage drops that may occur in a transmit burst should not exceed 400mV to ensure the expected RF performance in 2G networks. The module switches off if the minimum battery voltage (VBATTmin) is reached. Example:

VImin = 3.3V Dmax = 0.4V VBATTmin = VImin + Dmax VBATTmin = 3.3V + 0.4V = 3.7V Figure 4: Power supply limits during transmit burst 3.2.2 Monitoring Power Supply by AT Command To monitor the supply voltage you can use the AT^SBV command which returns the averaged value related to BATT+ and GND at the SMT application interface. The module continuously measures the voltage at intervals depending on the operating mode of the RF interface. The duration of measuring ranges from 0.5 seconds in DATA mode to 50 seconds when PLS8-X/PLS8-V is in Limited Service (deregistered). The displayed voltage (in mV) is averaged over the last measuring period before the AT^SBV command was executed. PLS8-X_PLS8-V_HD_v03.016 Confidential / Released 2015-12-09 Cinterion PLS8-X/PLS8-V Hardware Interface Description 3.3 Power-Up / Power-Down Scenarios 50 Page 25 of 105 3.3 Power-Up / Power-Down Scenarios In general, be sure not to turn on PLS8-X/PLS8-V while it is beyond the safety limits of voltage and temperature stated in Section 6.1. PLS8-X/PLS8-V immediately switches off after having started and detected these inappropriate conditions. In extreme cases this can cause perma-

nent damage to the module. 3.3.1 Turn on PLS8-X/PLS8-V When the PLS8-X/PLS8-V module is in Power Down mode, it can be started to Normal mode by driving the IGT (ignition) line to ground. it is recommended to use an open drain/collector driver to avoid current flowing into this signal line. Pulling this signal low triggers a power-on sequence. To turn on PLS8-X/PLS8-V, IGT has to be kept active at least 100 milliseconds. After turning on PLS8-X/PLS8-V, IGT should be set inactive to prevent the module from turning on again after a shut down by AT command or EMERG_OFF. For details on signal states dur-

ing startup see also Section 3.3.2. Power supply active Firmware start up, command interface initialization Function active Module IGT BATT+

IGT PWR_IND VEXT EMERG_OFF ASC0 USB*

0ms

~36ms

~60ms

~5s

>100ms Initial state Undefined state Intermediate state

* USB interface may take up to 12s to reach its active state Figure 5: Power-on with IGT Note: After power up IGT should remain high. Also note that with a USB connection the USB host may take up to 12 seconds to set up the virtual COM port connection. After startup or mode change the following URCs are sent to every port able to receive AT com-

mands indicating the modules ready state:

"^SYSSTART" indicates that the module has entered Normal mode.

"^SYSSTART AIRPLANE MODE" indicates that the module has entered Airplane mode. These URCs notify the external application that the first AT command can be sent to the mod-

ule. If these URCs are not used to detect then the only way of checking the modules ready state is polling. To do so, try to send characters (e.g. at) until the module is responding. PLS8-X_PLS8-V_HD_v03.016 Confidential / Released 2015-12-09 Cinterion PLS8-X/PLS8-V Hardware Interface Description 3.3 Power-Up / Power-Down Scenarios 50 Page 26 of 105 3.3.2 Signal States after Startup Table 7 describes the various states each interface signal passes through after startup and dur-

ing operation. Signals are in an initial state while the module is initializing. Once the startup initialization has completed, i.e. when the software is running, all signals are in defined state. The state of sev-

eral signals will change again once the respective interface is activated or configured by AT command. Table 7: Signal states Signal name CCINx CCRSTx CCIOx CCCLKx CCVCCx Power on reset Startup phase Duration appr. 60ms PD and PU (24k) Not driven (similar PD) Not driven (similar PD) Duration appr. 4s PU(24k) PD(10k) PD(10k) Not driven (similar PD) Not driven (similar PD) Off Off RXD0 TXD0 CTS0 RTS0 DTR0 DCD0 DSR0 RING0 PCM_I2S_IN PCM_I2S_CLK PCM_I2S_FSC PCM_I2S_OUT I2S_MCLKOUT PWR_IND STATUS EMERG_OFF IGT GPIO1...104 PD PD PD PU and PD PD PD PD PD PU PD PD PD PD Z PD PU I, PU PD 1. If CCINx = High level 2. If CCINx = Low level 3. No external pull down allowed during this phase. 4. Please note that during its startup phase the GPIO8 signal will be in an active low state for appr. 80ms. PU PD PD PD PD PU3 PD O, H PD PD PD PD PD O, L PD I, PU I, PU PD L = Low level H = High level I = Input O = Output PD = Pull down resistor with appr. 100k1 PD(k) = Pull down resistor with ...k PU = Pull up resistor with appr. 100k PU(k) = Pull up resistor with ...k, Z = High impedance 1. Internal pulls are implemented using JFETs; strengths vary between devices, possible range: 55k390k PLS8-X_PLS8-V_HD_v03.016 Confidential / Released 2015-12-09 State after first firmware initialization After 4-5s I, PU(24k) O, L1 O, H2 PD(10k)1 PU(10k)2 O, L1 Clock2 Off1 1.8V/3V2 PU PD PD PD PD PD PD O, H PD PD PD PD PD O, L PD I, PU I, PU PD Cinterion PLS8-X/PLS8-V Hardware Interface Description 3.3 Power-Up / Power-Down Scenarios 50 Page 27 of 105 3.3.3 Turn off PLS8-X/PLS8-V Using AT Command The best and safest approach to powering down PLS8-X/PLS8-V is to issue the AT^SMSO command. This procedure lets PLS8-X/PLS8-V log off from the network and allows the soft-

ware to enter into a secure state and save data before disconnecting the power supply. The mode is referred to as Power Down mode. In this mode, only the RTC stays active. After send-

ing AT^SMSO do not enter any other AT commands. While powering down the module may still send some URCs. To verify that the module turned off it is possible to monitor the PWR_IND signal. A high state of the PWR_IND signal line indicates that the module is being switched off as shown in Figure 6. Be sure not to disconnect the supply voltage VBATT+ before the modules switch off procedure has been completed and the VEXT signal has gone low. Otherwise you run the risk of losing data. Signal states during switch off are shown in Figure 6. While PLS8-X/PLS8-V is in Power Down mode the application interface is switched off and must not be fed from any other source. Therefore, your application must be designed to avoid any current flow into any digital signal lines of the application interface. No special care is re-

quired for the USB interface which is protected from reverse current. AT^SMSO Deregister from network, system shut down Prepare to reset Reset state, power down procedure See Note 1 See Note 2 3s...25s 50...90s appr. 12ms

>6ms PWR_IND Digital outputs Reset state VEXT Inputs driven by application BATT+ driven by application Figure 6: Signal states during turn-off procedure Note 1:

Note 2:

Note 3:

Depending on capacitance load from host application The power supply voltage (BATT+) may be disconnected or switched off only after the VEXT went low. After module shutdown by means of AT command is completed, please allow for a time period of at least 1 second before restarting the module. PLS8-X_PLS8-V_HD_v03.016 Confidential / Released 2015-12-09 Cinterion PLS8-X/PLS8-V Hardware Interface Description 3.3 Power-Up / Power-Down Scenarios 50 3.3.4 Turn off PLS8-X/PLS8-V Using IGT Line Page 28 of 105 The IGT line can be configured for use in two different switching modes: You can set the IGT line to switch on the module only, or to switch it on and off. The switching mode is determined by the parameter "MEShutdown/OnIgnition" of the AT^SCFG command. This approach is use-

ful for external application manufacturers who wish to have an ON/OFF switch installed on the host device. By factory default, the ON/OFF switch mode of IGT is disabled:

at^scfg=meshutdown/onignition

^SCFG: "MEShutdown/OnIgnition","off"

OK

# Query the current status of IGT.

# IGT can be used only to switch on PLS8-X/

PLS8-V. IGT works as described in Section 3.3.1. To configure IGT for use as ON/OFF switch:

at^scfg=meshutdown/onignition

^SCFG: "MEShutdown/OnIgnition","on"

OK

# Enable the ON/OFF switch mode of IGT.

# IGT can be used to switch on and off PLS8-X/

PLS8-V. Take great care before changing the switching mode of the IGT line. To ensure that the IGT line works properly as ON/OFF switch it is of vital importance that the following conditions are met:

Switch-on condition:

If the PLS8-X/PLS8-V is off, the IGT line must be asserted for at least 100 milliseconds before being released. Switch-off condition: If the PLS8-X/PLS8-V is on, the IGT line must be asserted for at least 2.1 seconds before being released. The module switches off after the line is released. The switch-off routine is identical with the procedure initiated by AT^SMSO, i.e. the software performs an orderly shutdown as described in Section 3.3.3. Before switching off the module wait at least 12 seconds after startup. 1 IGT

>100ms

>5s 2

>2.1s 1TriggersswitchONroutine 2TriggersswitchOFFroutine Figure 7: Timing of IGT if used as ON/OFF switch PLS8-X_PLS8-V_HD_v03.016 Confidential / Released 2015-12-09 Cinterion PLS8-X/PLS8-V Hardware Interface Description 3.3 Power-Up / Power-Down Scenarios 50 Page 29 of 105 3.3.5 Automatic Shutdown Automatic shutdown takes effect if:

The PLS8-X/PLS8-V board is exceeding the critical limits of overtemperature or undertem-

perature Undervoltage or overvoltage is detected The automatic shutdown procedure is equivalent to the power down initiated with the AT^SMSO command, i.e. PLS8-X/PLS8-V logs off from the network and the software enters a secure state avoiding loss of data. Alert messages transmitted before the device switches off are implemented as Unsolicited Re-

sult Codes (URCs). The presentation of the temperature URCs can be enabled or disabled with the AT commands AT^SCTM. The URC presentation mode varies with the condition, please see Section 3.3.5.1 to Section 3.3.5.4 for details. For further instructions on AT commands refer to [1]. 3.3.5.1 Thermal Shutdown The board temperature is constantly monitored by an internal NTC resistor located on the PCB. The values detected by the NTC resistor are measured directly on the board and therefore, are not fully identical with the ambient temperature. Each time the board temperature goes out of range or back to normal, PLS8-X/PLS8-V instant-

ly displays an alert (if enabled). URCs indicating the level "1" or "-1" allow the user to take appropriate precautions, such as protecting the module from exposure to extreme conditions. The presentation of the URCs depends on the settings selected with the AT^SCTM write command:

AT^SCTM=1: Presentation of URCs is always enabled. AT^SCTM=0 (default): Presentation of URCs is enabled during the 2 minutes guard period after start-up of PLS8-X/PLS8-V. After expiry of the 2 minutes guard period, the presenta-

tion will be disabled, i.e. no URCs with alert levels "1" or ''-1" will be generated. URCs indicating the level "2" or "-2" are instantly followed by an orderly shutdown. The pre-

sentation of these URCs is always enabled, i.e. they will be output even though the factory setting AT^SCTM=0 was never changed. The maximum temperature ratings are stated in Section 6.2. Refer to Table 8 for the associated URCs. Table 8: Temperature dependent behavior Sending temperature alert (2 minutes after PLS8-X/PLS8-V start-up, otherwise only if URC presenta-

tion enabled)

^SCTM_B: 1 Caution: Board close to overtemperature limit, i.e., board is 5C below overtem-

perature limit. Caution: Board close to undertemperature limit, i.e., board is 5C above under-

temperature limit. Board back to uncritical temperature range, i.e., board is 6C below its over- or above its undertemperature limit.

^SCTM_B: -1

^SCTM_B: 0 PLS8-X_PLS8-V_HD_v03.016 Confidential / Released 2015-12-09 Cinterion PLS8-X/PLS8-V Hardware Interface Description 3.3 Power-Up / Power-Down Scenarios 50 Page 30 of 105 Table 8: Temperature dependent behavior Automatic shutdown (URC appears no matter whether or not presentation was enabled)

^SCTM_B: 2 Alert: Board equal or beyond overtemperature limit. PLS8-X/PLS8-V switches off. Alert: Board equal or below undertemperature limit. PLS8-X/PLS8-V switches off.

^SCTM_B: -2 The AT^SCTM command can also be used to check the present status of the board. Depending on the selected mode, the read command returns the current board temperature in degrees Celsius or only a value that indicates whether the board is within the safe or critical temperature range. See [1] for further instructions. 3.3.5.2 Deferred Shutdown at Extreme Temperature Conditions In the following cases, automatic shutdown will be deferred if a critical temperature limit is ex-

ceeded:

While an emergency call is in progress. During a two minute guard period after power-up. This guard period has been introduced in order to allow for the user to make an emergency call. The start of any one of these calls extends the guard period until the end of the call. Any other network activity may be termi-

nated by shutdown upon expiry of the guard time. While in a "deferred shutdown" situation, PLS8-X/PLS8-V continues to measure the tempera-

ture and to deliver alert messages, but deactivates the shutdown functionality. Once the 2 min-

ute guard period is expired or the call is terminated, full temperature control will be resumed. If the temperature is still out of range, PLS8-X/PLS8-V switches off immediately (without another alert message). CAUTION! Automatic shutdown is a safety feature intended to prevent damage to the module. Extended usage of the deferred shutdown facilities provided may result in damage to the mod-

ule, and possibly other severe consequences. PLS8-X_PLS8-V_HD_v03.016 Confidential / Released 2015-12-09 Cinterion PLS8-X/PLS8-V Hardware Interface Description 3.3 Power-Up / Power-Down Scenarios 50 Page 31 of 105 3.3.5.3 Undervoltage Shutdown If the measured battery voltage is no more sufficient to set up a call the following URC will be presented:

^SBC: Undervoltage. The URC indicates that the module is close to the undervoltage threshold. If undervoltage per-

sists the module keeps sending the URC several times before switching off automatically. This type of URC does not need to be activated by the user. It will be output automatically when fault conditions occur. 3.3.5.4 Overvoltage Shutdown The overvoltage shutdown threshold is 100mV above the maximum supply voltage VBATT+

specified in Table 22. When the supply voltage approaches the overvoltage shutdown threshold the module will send the following URC:

^SBC: Overvoltage warning This alert is sent once. When the overvoltage shutdown threshold is exceeded the module will send the following URC

^SBC: Overvoltage shutdown before it shuts down cleanly. This type of URC does not need to be activated by the user. It will be output automatically when fault conditions occur. Keep in mind that several PLS8-X/PLS8-V components are directly linked to BATT+ and, there-

fore, the supply voltage remains applied at major parts of PLS8-X/PLS8-V, even if the module is switched off. Especially the power amplifier is very sensitive to high voltage and might even be destroyed. PLS8-X_PLS8-V_HD_v03.016 Confidential / Released 2015-12-09 Cinterion PLS8-X/PLS8-V Hardware Interface Description 3.3 Power-Up / Power-Down Scenarios 50 Page 32 of 105 3.3.6 Turn off PLS8-X/PLS8-V in Case of Emergency Caution: Use the EMERG_OFF line only when, due to serious problems, the software is not responding for more than 5 seconds. Pulling the EMERG_OFF line causes the loss of all infor-

mation stored in the volatile memory. Therefore, this procedure is intended only for use in case of emergency, e.g. if PLS8-X/PLS8-V does not respond, if reset or shutdown via AT command fails. The EMERG_OFF line is available on the application interface and can be used to switch off the module. To control the EMERG_OFF line it is recommended to use an open drain / collector driver. To switch off, the EMERG_OFF line must be pulled to ground for longer than 40 milliseconds. After the 40 milliseconds and an additional delay period of 500 milliseconds the module shuts down as shown in Figure 8. BATT+

PWR_IND Shut Down EMERG_OFF

>40ms VEXT 536ms Figure 8: Shutdown by EMERG_OFF signal Note: The power supply voltage (BATT+) may be disconnected or switched off only after having reached Shut Down as indicated by the PWR_IND signal going high. The power supply has to be available (again) before the module is restarted. PLS8-X_PLS8-V_HD_v03.016 Confidential / Released 2015-12-09 Cinterion PLS8-X/PLS8-V Hardware Interface Description 3.4 Power Saving 50 Page 33 of 105 3.4 Power Saving PLS8-X/PLS8-V is able to reduce its functionality to a minimum (during the so-called SLEEP mode) in order to minimize its current consumption. This behavior is configurable by AT com-

mand:

AT^SCFG= "MEopMode/PwrSave": The power save mode is by default disabled. If enabled, the module will switch into a power saving (SLEEP) state while inactive, waking up only after one of the following events: Cyclically after expiry of a specified power saving period, sending a URC (incl. for incoming calls), toggling the RTS0 line (falling edge only), toggling the DTR0 line (both edges). See Section 3.4.1 for a description on how to immedi-

ately wake up PLS8-X/PLS8-V from SLEEP mode again using RTS0. AT^SCFG= "MEopMode/ExpectDTR": Power saving will take effect only if there is no trans-

mission data pending on any port. The expect DTR AT command ensures that data becom-

ing pending on any port before an external application has signalled its readiness to receive the data is discarded. By default this behavior is enabled for all ports. For this feature to work the external application should be able to trigger and control the DTR line. AT^SCFG="Radio/OutputPowerReduction": Output power reduction is possible for the module in GPRS multislot scenarios to reduce its output power according to 3GPP 45.005 section. Please refer to [1] for more information on the above AT commands used to configure the mod-

ules power saving behavior. The implementation of the USB host interface also influences the modules power saving behavior and therefore its current consumption. For more information see Section 3.6. Another feature influencing the current consumption is the configuration of the GNSS antenna interface. For details see Section 6.8. PLS8-X_PLS8-V_HD_v03.016 Confidential / Released 2015-12-09 Cinterion PLS8-X/PLS8-V Hardware Interface Description 3.4 Power Saving 50 Page 34 of 105 3.4.1 Wake-up via RTS0 RTS0 can be used to wake up PLS8-X/PLS8-V from SLEEP mode. Assertion of RTS0 (i.e., tog-

gle from inactive high to active low) serves as wake up event, thus allowing an external appli-

cation to almost immediately terminate power saving. After RTS0 assertion, the CTS0 line signals module wake up, i.e., readiness of the AT command interface. It is therefore recom-

mended to enable RTS/CTS flow control (default setting). Figure 9 shows the described RTS0 wake up mechanism. R T S 0 C T S 0 T X D 0 R X D 0 R T S a s s e rtio n (fa llin g e d g e ) R T S b a c k W a k e u p fro m S L E E P m o d e R e tu rn to S L E E P m o d e A T c o m m a n d R e p ly U R C Figure 9: Wake-up via RTS0 PLS8-X_PLS8-V_HD_v03.016 Confidential / Released 2015-12-09 Cinterion PLS8-X/PLS8-V Hardware Interface Description 3.5 RTC Backup 50 Page 35 of 105 3.5 RTC Backup The internal Real Time Clock of PLS8-X/PLS8-V is supplied from a separate voltage regulator in the power supply component which is also active when PLS8-X/PLS8-V is in Power Down mode and BATT+ is available. An alarm function is provided that allows to wake up PLS8-X/

PLS8-V. When the alarm time is reached the module wakes up to the functionality level

(AT+CFUN) that was valid before power down. For example, if the module was in Airplane mode before power down, the module will wake up without logging on to the GSM/UMTS net-

work. In addition, you can use the VDDLP pad on the SMT interface to backup the RTC from an ex-

ternal capacitor or a battery (rechargeable or non-chargeable). The capacitor is charged from the internal LDO of PLS8-X/PLS8-V. If the voltage supply at BATT+ is disconnected the RTC can be powered by the capacitor. The size of the capacitor determines the duration of buffering when no voltage is applied to PLS8-X/PLS8-V, i.e. the greater the capacitor the longer PLS8-

X/PLS8-V will save the date and time. It limits the output current of an empty capacitor or bat-

tery. Figure 10 show various sample configurations. Module Non chargeable battery BATT+

Chargeable battery Capacitor VDDLP e c a f r e or or t n i T M S 3.2V LDO 0.8k RC 1k GSM processor and power management RTC GND Figure 10: RTC supply variants PLS8-X_PLS8-V_HD_v03.016 Confidential / Released 2015-12-09 Cinterion PLS8-X/PLS8-V Hardware Interface Description 3.6 USB Interface 50 Page 36 of 105 3.6 USB Interface PLS8-X/PLS8-V supports a USB 2.0 High Speed (480Mbps) device interface. The USB inter-

face is primarily intended for use as command and data interface and for downloading firm-

ware. The USB host is responsible for supplying the VUSB_IN line. This line is for voltage detection only. The USB part (driver and transceiver) is supplied by means of BATT+. This is because PLS8-X/PLS8-V is designed as a self-powered device compliant with the Universal Serial Bus Specification Revision 2.01. Module VREG (3V075) lin. reg. SMT USB part1) VBUS DP DN Detection only Host wakeup 1F RS RS BATT+

GND VUSB_IN2) USB_DP3) USB_DN3) RING0 1) All serial (including RS) and pull-up resistors for data lines are implemented. 2) Since VUSB_IN is used for detection only it is recommended not to add any further blocking capacitors on the VUSB_IN line. 3) If the USB interface is operated in High Speed mode (480MHz), it is recommended to take special care routing the data lines USB _DP and USB_DN. Application layout should in this case implement a differential impedance of 90 ohms for proper signal integrity. Figure 11: USB circuit To properly connect the module's USB interface to the external application, a USB 2.0 compat-

ible connector and cable or hardware design is required. For more information on the USB re-

lated signals see Table 22. Furthermore, the USB modem driver distributed with PLS8-X/PLS8-

V needs to be installed. 1. The specification is ready for download on http://www.usb.org/developers/docs/

PLS8-X_PLS8-V_HD_v03.016 Confidential / Released 2015-12-09 Cinterion PLS8-X/PLS8-V Hardware Interface Description 3.6 USB Interface 50 Page 37 of 105 3.6.1 Reducing Power Consumption (TBD.) While a USB connection is active, the module will never switch into SLEEP mode. Only if the USB interface is in Suspended state or Detached (i.e., VUSB_IN = 0) is the module able to switch into SLEEP mode thereby saving power1. There are two possibilities to enable power reduction mechanisms:

Recommended implementation of USB Suspend/Resume/Remote Wakeup:

The USB host should be able to bring its USB interface into the Suspended state as described in the Universal Serial Bus Specification Revision 2.02. For this functionality to work, the VUSB_IN line should always be kept enabled. On incoming calls and other events PLS8-X/PLS8-V will then generate a Remote Wakeup request to resume the USB host con-

troller. See also [4] (USB Specification Revision 2.0, Section 10.2.7, p.282):

"If USB System wishes to place the bus in the Suspended state, it commands the Host Con-

troller to stop all bus traffic, including SOFs. This causes all USB devices to enter the Sus-

pended state. In this state, the USB System may enable the Host Controller to respond to bus wakeup events. This allows the Host Controller to respond to bus wakeup signaling to restart the host system."

Implementation for legacy USB applications not supporting USB Suspend/Resume:

As an alternative to the regular USB suspend and resume mechanism it is possible to employ a remote wakeup line (e.g., the RING0 line) to wake up the host application in case of incoming calls or events signalized by URCs while the USB interface is in Detached state

(i.e., VUSB_IN = 0). Every wakeup event will force a new USB enumeration. Therefore, the external application has to carefully consider the enumeration timings to avoid loosing any signalled events. For details on this host wakeup functionality see Section 3.13.3. To pre-

vent existing data call connections from being disconnected while the USB interface is in detached state (i.e., VUSB_IN=0) it is possible to call AT&D0, thus ignoring the status of the DTR line (see also [1]). 1. Please note that if the USB interface is employed, and a USB cable is connected, there should also be a terminal programm linked to the USB port in order to receive and process the initial SYSSTART URC after module startup. Otherwise, the SYSSTART URC remains pending in the USB driver's output buffer and this unprocessed data prevents the module from power saving. 2. The specification is ready for download on http://www.usb.org/developers/docs/

PLS8-X_PLS8-V_HD_v03.016 Confidential / Released 2015-12-09 Cinterion PLS8-X/PLS8-V Hardware Interface Description 3.7 Serial Interface ASC0 50 Page 38 of 105 3.7 Serial Interface ASC0 PLS8-X/PLS8-V offers an 8-wire unbalanced, asynchronous modem interface ASC0 conform-

ing to ITU-T V.24 protocol DCE signalling. The electrical characteristics do not comply with ITU-

T V.28. The significant levels are 0V (for low data bit or active state) and 1.8V (for high data bit or inactive state). For electrical characteristics please refer to Table 22. PLS8-X/PLS8-V is designed for use as a DCE. Based on the conventions for DCE-DTE con-

nections it communicates with the customer application (DTE) using the following signals:

Port TXD @ application sends data to the modules TXD0 signal line Port RXD @ application receives data from the modules RXD0 signal line Figure 12: Serial interface ASC0 Features:

Includes the data lines TXD0 and RXD0, the status lines RTS0 and CTS0 and, in addition, the modem control lines DTR0, DSR0, DCD0 and RING0. The RING0 signal serves to indicate incoming calls and other types of URCs (Unsolicited Result Code). It can also be used to send pulses to the host application, for example to wake up the application from power saving state. See [1] for details on how to configure the RING0 line by AT^SCFG. Configured for 8 data bits, no parity and 1 stop bit. ASC0 can be operated at fixed bit rates from 115,200bps up to 921,600bps. Supports RTS0/CTS0 hardware flow control. Wake up from SLEEP mode by RTS0 activation (high to low transition; see Section 3.4.1). Note: If the ASC0 serial interface is the applications only interface, it is suggested to connect test points on the USB signal lines as a potential tracing possibility. PLS8-X_PLS8-V_HD_v03.016 Confidential / Released 2015-12-09 Cinterion PLS8-X/PLS8-V Hardware Interface Description 3.7 Serial Interface ASC0 50 Page 39 of 105 Table 9: DCE-DTE wiring of ASC0 V.24 circuit DCE 103 104 105 106 108/2 107 109 125 Line function TXD0 RXD0 RTS0 CTS0 DTR0 DSR0 DCD0 RING0 Signal direction Input Output Input Output Input Output Output Output DTE Line function TXD RXD RTS CTS DTR DSR DCD RING Signal direction Output Input Output Input Output Input Input Input PLS8-X_PLS8-V_HD_v03.016 Confidential / Released 2015-12-09 Cinterion PLS8-X/PLS8-V Hardware Interface Description 3.8 UICC/SIM/USIM Interface 50 Page 40 of 105 3.8 UICC/SIM/USIM Interface PLS8-X/PLS8-V has two UICC/SIM/USIM interfaces compatible with the 3GPP 31.102 and ETSI 102 221. These are wired to the host interface in order to be connected to an external SIM card holder. Five pads on the SMT application interface are reserved for each of the two SIM interfaces. The UICC/SIM/USIM interfaces support 3V and 1.8V SIM cards. Please refer to Table 22 for electrical specifications of the UICC/SIM/USIM interface lines depending on whether a 3V or 1.8V SIM card is used. The CCINx signal serves to detect whether a tray (with SIM card) is present in the card holder. Using the CCINx signal is mandatory for compliance with the GSM 11.11 recommendation if the mechanical design of the host application allows the user to remove the SIM card during operation. To take advantage of this feature, an appropriate SIM card detect switch is required on the card holder. For example, this is true for the model supplied by Molex, which has been tested to operate with PLS8-X/PLS8-V and is part of the Gemalto M2M reference equipment submitted for type approval. See Chapter 10 for Molex ordering numbers. Table 10: Signals of the SIM interface (SMT application interface) Signal GND Description Ground connection for SIM interfaces. Optionally a separate SIM ground line using e.g., pad N11 may be used to improve EMC. Chipcard clock lines for 1st and 2nd SIM interface. CCCLK1 CCCLK2 CCVCC1 CCVCC2 CCIO1 CCIO2 CCRS1 CCRS2 CCIN1 CCIN2 SIM supply voltage lines for 1st and 2nd SIM interface. Serial data lines for 1st and 2nd SIM interface, input and output. Chipcard reset lines for 1st and 2nd SIM interface Input on the baseband processor for detecting a SIM card tray in the holder. If the SIM is removed during operation the SIM interface is shut down immediately to prevent destruc-

tion of the SIM. The CCINx signal is active low. The CCINx signal is mandatory for applications that allow the user to remove the SIM card during operation. The CCINx signal is solely intended for use with a SIM card. It must not be used for any other purposes. Failure to comply with this requirement may invalidate the type approval of PLS8-X/PLS8-V. Note: No guarantee can be given, nor any liability accepted, if loss of data is encountered after removing the SIM card during operation. Also, no guarantee can be given for properly initializ-

ing any SIM card that the user inserts after having removed the SIM card during operation. In this case, the application must restart PLS8-X/PLS8-V. PLS8-X_PLS8-V_HD_v03.016 Confidential / Released 2015-12-09 Cinterion PLS8-X/PLS8-V Hardware Interface Description 3.8 UICC/SIM/USIM Interface 50 Page 41 of 105 open: Card removed closed: Card inserted 1n SIM /

UICC CCIN1 CCRST1 CCCLK1 GND CCIO1 e c a f r e t n i n o i t a c i l p p a T M S Module CCVCC1 220n Figure 13: First UICC/SIM/USIM interface The total cable length between the SMT application interface pads on PLS8-X/PLS8-V and the pads of the external SIM card holder must not exceed 100mm in order to meet the specifica-

tions of 3GPP TS 51.010-1 and to satisfy the requirements of EMC compliance. To avoid possible cross-talk from the CCCLKx signal to the CCIOx signal be careful that both lines are not placed closely next to each other. A useful approach is using the GND line to shield the CCIOx line from the CCCLKx line. An example for an optimized ESD protection for the SIM interface is shown in Section 3.8.1. Note: Figure 13 shows how to connect a SIM card holder to the first SIM interface. With the second SIM interface some internally integrated components on the SIM circuit will have to be externally integrated as shown for the second SIM interface in Figure 14. Module e c a f r e t n i n o i t a c i l p p a T M S VEXT CCIN2 22k*

Open: Card removed Closed: Card inserted 2k2 100pF*

1nF SIM /

UICC CCRST2 CCCLK2 GND CCIO2 10k CCVCC2 220nF

*Should be placed as close as possible to SMT application interface Figure 14: Second UICC/SIM/USIM interface PLS8-X_PLS8-V_HD_v03.016 Confidential / Released 2015-12-09 Cinterion PLS8-X/PLS8-V Hardware Interface Description 3.8 UICC/SIM/USIM Interface 50 Page 42 of 105 3.8.1 Enhanced ESD Protection for SIM Interface To optimize ESD protection for the SIM interfaces it is possible to add ESD diodes to the inter-

face lines of the first and second SIM interface as shown in the example given in Figure 15. The example was designed to meet ESD protection according ETSI EN 301 489-1/7: Contact discharge: 4kV, air discharge: 8kV. Module CCRSTx CCCLKx CCIOx CCVCCx CCINx GND 51R 51R 51R 6 1 5 2 4 3 SIM_RST SIM_CLK SIM_IO 5-line transient voltage supressor array, e.g., NUP5120X6 or ESDA6V1-5P6 SIM_VCC SIM_DET SIM_GND Figure 15: SIM interface - enhanced ESD protection PLS8-X_PLS8-V_HD_v03.016 Confidential / Released 2015-12-09 Cinterion PLS8-X/PLS8-V Hardware Interface Description 3.9 Digital Audio Interface 50 Page 43 of 105 3.9 Digital Audio Interface PLS8-X/PLS8-V has a digital audio interface that can be employed either as pulse code mod-

ulation interface (see Section 3.9.1) or as inter IC sound interface (see Section 3.10). Operation can be configured by AT command (see [1]). Default setting is pulse code modulation. Note: As PLS8-X/PLS8-V is a data only module, the modules digital audio interface supports local tones only and is otherwise reserved for future use. 3.9.1 Pulse Code Modulation Interface (PCM) PLS8-X/PLS8-V's PCM interface can be used to connect audio devices capable of pulse code modulation. For the PCM interface configuration the parameters <clock>, <mode>,

<frame_mode>, <ext_clk_mode> and <sample_rate> of the AT^SAIC command can be con-

figured in any combination (for details on AT^SAIC see [1]). Table 11 lists the available PCM interface signals. Table 11: Overview of PCM pin functions Signal name on SMT application interface Signal configuration inactive PCM_I2S_OUT PCM_I2S_IN PCM_I2S_FSC PCM_I2S_CLK PD PD PD PD Signal direction:

Master O I O O Signal direction:

Slave O I I I Characteristics of Audio Modes PLS8-X/PLS8-V has various audio modes selectable with AT^SNFS (for details see [1]). Inter IC Sound Interface (I2S) 3.10 The I2S Interface is a standardized bidirectional I2S ("Inter-IC Sound Interface") based digital audio interface for transmission of mono audio signals. The I2S interface can be enabled and configured using the AT command AT^SAIC (see [1]). An activation is possible only out of tone presentation. The I2S properties and capabilities comply with the requirements layed out in the Phillips I2S Bus Specifications, revised June 5, 1996. The digital audio interface pads available for the PCM interface are also available for the I2S interface. In I2S mode they have the same electrical characteristics. For the master clock option there is a separate line (see Section 6.5 for more information on these lines). Table 12 lists the available I2S interface signals. Table 12: Overview of I2S pin functions Signal name on SMT application interface PCM_I2S_OUT PCM_I2S_IN PCM_I2S_FSC PCM_I2S_CLK I2S_MCLKOUT Signal configuration inactive Signal direction: Master PD PD PD PD PD O I O O O PLS8-X_PLS8-V_HD_v03.016 Confidential / Released 2015-12-09 Cinterion PLS8-X/PLS8-V Hardware Interface Description 3.11 Analog-to-Digital Converter (ADC) 50 Page 44 of 105 3.11 Analog-to-Digital Converter (ADC) PLS8-X/PLS8-V provides three unbalanced ADC input lines: ADC1_IN, ADC2_IN and ADC3_IN. They can be used to measure three independent, externally connected DC voltages in the range of 0.3V to 3.075V. The AT^SRADC command can be employed to select the ADC line, set the measurement mode and read out the measurment results. GPIO Interface 3.12 PLS8-X/PLS8-V has 10 GPIOs for external hardware devices. Each GPIO can be configured for use as input or output. All settings are AT command controlled. The IO port driver has to be open before using and configuring GPIOs. Before changing the configuration of a GPIO pin (e.g. input to output) the pin has to be closed. If the GPIO pins are not configured or the pins/driver were closed, the GPIO pins are high-Z with pull down resistor. If a GPIO is configured to input, the pin has high-Z without pull resistor. GPIO1 can be configured as dead reckoning synchronization line (see Chapter 4), GPIO2 can be configured as 700MHz antenna switch control signal (see Section 3.13.6), GPIO6 may be configured as low current indicator signal (see Section 3.13.4), and GPIOs may be set as re-

mote host wakeup lines (see Section 3.13.3). If the PLS8-X/PLS8-V stays in power save (SLEEP) mode a level state transition at GPIO1, GPIO3, GPIO4, GPIO5 and GPIO9 will wake up the module. To query the level state the AT^SCPOL command may be used. PLS8-X_PLS8-V_HD_v03.016 Confidential / Released 2015-12-09 Cinterion PLS8-X/PLS8-V Hardware Interface Description 3.13 Control Signals 50 Page 45 of 105 3.13 Control Signals 3.13.1 PWR_IND Signal PWR_IND notifies the on/off state of the module. For state detection an external pull-up resistor is required (cp. R1 in below Figure 16). As long as the feeding voltage is applied at the pull-up resistor, a high state of PWR_IND indicates that the module is switched off. Module Power supply On/Off

(open drain driver) For example:

VCC C or BATT+

e c a f r e n t i T M S Pull-up R1 PWR_IND Figure 16: PWR_IND signal 3.13.2 Behavior of the RING0 Line The RING0 line serves to indicate incoming calls and other types of URCs (Unsolicited Result Code). Although not mandatory for use in a host application, it is strongly suggested that you connect the RING0 line to an interrupt line of your application. In this case, the application can be de-

signed to receive an interrupt when a falling edge on RING0 occurs. This solution is most ef-

fective, particularly, for waking up an application from power saving. Therefore, utilizing the RING0 line provides an option to significantly reduce the overall current consumption of your application. The RING0 line behavior and usage can be configured by AT command. For details see [1]:

AT^SCFG. PLS8-X_PLS8-V_HD_v03.016 Confidential / Released 2015-12-09 Cinterion PLS8-X/PLS8-V Hardware Interface Description 3.13 Control Signals 50 Page 46 of 105 3.13.3 Remote Wakeup If no call, data or message transfer is in progress, the external host application may shut down its own module interfaces or other components in order to save power. If a call, data, or other request (URC) arrives, the external application can be notified of this event and be woken up again by a state transition of a configurable remote wakeup line. Available as remote wakeup lines are all GPIO signals as well as the RING0 line. Please refer to [1]: AT^SCFG: "Re-

moteWakeUp/..." for details on how to configure these lines for defined wakeup events on specified device interfaces. Possible states are listed in Table 13. If no line is specifically configured as remote wakeup signal, the remote USB suspend and re-

sume mechanism as specified in the Universal Serial Bus Specification Revision 2.01 applies for the USB interface (see Section 3.6), or the RING0 line may be employed with USB applica-

tions not supporting this mechanism (see also Section 3.6.1). This legacy behaviour of the RING0 line as remote host wakeup line has to be enabled and configured by AT command (see

[1]: AT^SCFG: "URC/Ringline"). Possible states are listed in Table 13. Table 13: Host wakeup lines Signal I/O/P O RING0 GPIOx O Description Inactive to active low transition:

0 = The host shall wake up 1 = No wake up request Inactive to active high transition:

0 = No wake up request 1 = The host shall wake up 1. The specification is ready for download on http://www.usb.org/developers/docs/

PLS8-X_PLS8-V_HD_v03.016 Confidential / Released 2015-12-09 Cinterion PLS8-X/PLS8-V Hardware Interface Description 3.13 Control Signals 50 Page 47 of 105 3.13.4 Low Current Indicator (LCI) A low current indication is optionally available over a GPIO line. By default, low current indica-

tion is disabled and the GPIO pads can be configured and employed as usual. For a GPIO pad to work as a low current indicator the feature has to be enabled by AT com-

mand (see [1]: AT^SCFG: MEopMode/PowerMgmt/LCI). By default, the GPIO6 pad is config-

ured as LCI signal. If enabled, the GPIOx/LCI signal is high when the module is sleeping. During its sleep the mod-

ule will for the most part be slow clocked with 32kHz RTC. Table 14: Low current indicator line Signal GPIOx/LCI I/O/P O Description Inactive to actice high transition:

0 = High current consumption The module draws its power via BATT+

1 = Low current consumption (only reached during SLEEP mode) The module draws only a low current via BATT+

GPIOx 1 0 IBATT+

ILCpk<150mA ILCmax <100mA tLC tLCpk<100s tLCru>

300s t t tLC tLCpk tLCru ILCpk ILCmax Figure 17: Low current indication timing (still to be confirmed) Time for the IBATT+ current consumption: ILCmax<100mA. Max. time duration for the inrush current peak at the end of the low current period. When the GPIOx signal becomes inactive (low) the current ramps up to the maximum low current value within tLCru. When the module turns from sleep to normal operation some internal supply voltages will be switched on. That causes a small inrush current peak. During the low current period tLC the current consumption does not exceed the ILCmax value. PLS8-X_PLS8-V_HD_v03.016 Confidential / Released 2015-12-09 Cinterion PLS8-X/PLS8-V Hardware Interface Description 3.13 Control Signals 50 Page 48 of 105 3.13.5 Network Connectivity and Technology Status Signals The STATUS line serves to indicate the modules network connectivity state or the underlying network technology (2G or 3G/4G) and can be used to control an externally connected LED as shown in Figure 18. To operate the LED a buffer, e.g. a transistor or gate, must be included in the external application. VCC LED STATUS 0 = LED off 1 = LED on GND Figure 18: LED circuit (example) For electrical characteristics of the STATUS line see Table 22. The network connectivity and technology signal function is volatile and has to be activated after module startup with AT^SLED. For details on the command as well as status and mode indications through blinking intervals see [1]. PLS8-X_PLS8-V_HD_v03.016 Confidential / Released 2015-12-09 Cinterion PLS8-X/PLS8-V Hardware Interface Description 3.13 Control Signals 50 Page 49 of 105 3.13.6 700MHz Antenna Switch Control To provide for an antenna optimization over a wide frequency range, the GPIO2

(ANT_SWITCH) line can be configured as a control signal for a possible external antenna switch that is able to change between an antenna covering the 700MHz band and an antenna covering all other bands - depending on the frequency band currently being used by the mod-

ule. If the control switch functionality is enabled, GPIO2 is set to "high" (1) if the module is employ-

ing frequencies in the 700 MHz range (i.e., LTE band 17) and "low" (0) for all other frequencies, including the 800/850 MHz frequency bands. A GPIO2 signal switch is triggered by all module internal activities involving a change of the used frequency, even if only temporary (e.g., inter-band scanning using compressed mode). The maximum delay/deviation between internal usage change of the frequency band, and the GPIO2 signal change is 10 microseconds. For electrical characteristics of the GPIO2 (ANT_SWITCH) line see Table 22. The antenna switch control is non-volatile and has to be activated after module startup with AT^SCFG="GPIO/

Mode/Antenna". For details on the command see [1]. PLS8-X_PLS8-V_HD_v03.016 Confidential / Released 2015-12-09 Cinterion PLS8-X/PLS8-V Hardware Interface Description 4 GNSS Receiver 50 Page 50 of 105 4 GNSS Receiver PLS8-X/PLS8-V integrates a GNSS receiver that offers the full performance of GPS/

GLONASS technology. The GNSS receiver is able to continuously track all satellites in view, thus providing accurate satellite position data. The integrated GNSS receiver supports the NMEA protocol via USB or ASC0 interface. NMEA is a combined electrical and data specification for communication between various (marine) electronic devices including GNSS receivers. It has been defined and controlled by the US based National Marine Electronics Association. For more information on the NMEA Standard please refer to http://www.nmea.org. Depending on the receivers knowledge of last position, current time and ephemeris data, the receivers startup time (i.e., TTFF = Time-To-First-Fix) may vary: If the receiver has no knowl-

edge of its last position or time, a startup takes considerably longer than if the receiver has still knowledge of its last position, time and almanac or has still access to valid ephimeris data and the precise time. For more information see Section 6.8. By default, the GNSS receiver is switched off. It has to be switched on and configured using AT commands. For more information on how to control the GNSS interface via the AT commands see [1]. Dead Reckoning Sync Line:

Dead reckoning solutions are used in (automotive) platforms to determine the (vehicles) loca-

tion even when there is no GPS signal available (e.g. in tunnels, basement garages or even between high buildings in cities). In addition to dead reckoning related NMEA sentences (for details see [1]: GNSS sentences), PLS8-X/PLS8-V provides a dead reckoning synchronization line (DR_SYNC line) to be employed in external dead reckoning applications. DR_SYNC is derived from the GPS signal clock as 1 pulse per second (1PPS) signal, with a frequency of 1Hz, an accuracy of +/-5 ms, and a high state pulse of 1ms. The DR_SYNC signal is provided as long as synchronized with the GPS satellite clock, and continues for approximately 6 minutes after GPS signal loss. DR_SYNC can be configured for the GPIO1 pad. DR_SYNC can be activated using the AT command AT^SGPSC. For more information on the command please refer to [1], for electrical characteristics see Table 22. PLS8-X_PLS8-V_HD_v03.016 Confidential / Released 2015-12-09 Cinterion PLS8-X/PLS8-V Hardware Interface Description 5 Antenna Interfaces 57 Page 51 of 105 5 5.1 Antenna Interfaces GSM/UMTS/LTE Antenna Interface The PLS8-X/PLS8-V GSM/UMTS/LTE antenna interface comprises a GSM/UMTS/LTE main antenna as well as a UMTS/LTE Rx diversity/MIMO antenna to improve signal reliability and quality1. The interface has an impedance of 50. PLS8-X/PLS8-V is capable of sustaining a total mismatch at the antenna interface without any damage, even when transmitting at maxi-

mum RF power. The external antennas must be matched properly to achieve best performance regarding radi-

ated power, modulation accuracy and harmonic suppression. Matching networks are not in-

cluded on the PLS8-X/PLS8-V PCB and should be placed in the host application, if the antenna does not have an impedance of 50. Regarding the return loss PLS8-X/PLS8-V provides the following values in the active band:

Table 15: Return loss in the active band State of module Receive Transmit Idle Return loss of module

> 8dB not applicable

< 5dB Recommended return loss of application

> 12dB

> 12dB not applicable 1. By delivery default the UMTS/LTE Rx diversity/MIMO antenna is configured as available for the module since its usage is mandatory for LTE. Please refer to [1] for details on how to configure antenna settings. PLS8-X_PLS8-V_HD_v03.016 Confidential / Released 2015-12-09 Cinterion PLS8-X/PLS8-V Hardware Interface Description 5.1 GSM/UMTS/LTE Antenna Interface 57 Page 52 of 105 5.1.1 Antenna Installation The antenna is connected by soldering the antenna pads (ANT_MAIN; ANT_DRX_MIMO) and their neighboring ground pads directly to the applications PCB. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 P N M L GND K ANT_ MAIN J H G F GND GND E ANT_ GNSS GND D C B A GND ANT_ DRX_ MIMO GND Figure 19: Antenna pads (bottom view) The distance between the antenna pads and their neighboring GND pads has been optimized for best possible impedance. To prevent mismatch, special attention should be paid to these pads on the application PCB. The wiring of the antenna connection, starting from the antenna pad to the applications anten-

na should result in a 50 line impedance. Line width and distance to the GND plane need to be optimized with regard to the PCBs layer stack. Some examples are given in Section 5.1.2. To prevent receiver desensitization due to interferences generated by fast transients like high speed clocks on the external application PCB, it is recommended to realize the antenna con-

nection line using embedded Stripline rather than Micro-Stripline technology. Please see Sec-

tion 5.1.2 for examples of how to design the antenna connection in order to achieve the required 50 line impedance. For type approval purposes, the use of a 50 coaxial antenna connector (U.FL-R-SMT) might be necessary. In this case the U.FL-R-SMT connector should be placed as close as possible to PLS8-X/PLS8-Vs antenna pad. PLS8-X_PLS8-V_HD_v03.016 Confidential / Released 2015-12-09 Cinterion PLS8-X/PLS8-V Hardware Interface Description 5.1 GSM/UMTS/LTE Antenna Interface 57 Page 53 of 105 5.1.2 RF Line Routing Design 5.1.2.1 Line Arrangement Examples Several dedicated tools are available to calculate line arrangements for specific applications and PCB materials - for example from http://www.polarinstruments.com/ (commercial software) or from http://web.awrcorp.com/Usa/Products/Optional-Products/TX-Line/ (free software). Embedded Stripline This below figure shows line arrangement examples for embedded stripline. Figure 20: Embedded Stripline line arrangement PLS8-X_PLS8-V_HD_v03.016 Confidential / Released 2015-12-09 Cinterion PLS8-X/PLS8-V Hardware Interface Description 5.1 GSM/UMTS/LTE Antenna Interface 57 Page 54 of 105 Micro-Stripline This section gives two line arrangement examples for micro-stripline. Figure 21: Micro-Stripline line arrangement samples PLS8-X_PLS8-V_HD_v03.016 Confidential / Released 2015-12-09 Cinterion PLS8-X/PLS8-V Hardware Interface Description 5.1 GSM/UMTS/LTE Antenna Interface 57 Page 55 of 105 Routing Example 5.1.2.2 Interface to RF Connector Figure 22 shows a sample connection of a modules antenna pad at the bottom layer of the module PCB with an application PCBs coaxial antenna connector. Line impedance depends on line width, but also on other PCB characteristics like dielectric, height and layer gap. The sample stripline width of 0.33mm is recommended for an application with a PCB layer stack resembling the one of the PLS8-X/PLS8-V evaluation board shown in Figure 23. For different layer stacks the stripline width will have to be adapted accordingly. G N D e.g. ANT_ MAIN G N D G N D G N D Stripline (50 ohms) on top layer of evaluation board from antenna pad to module edge Width = 0.33 mm Ground connection Edge of module PCB 50 ohms microstrip line E.g., U.FL antenna connector Figure 22: Routing to applications RF connector Figure 23: PLS8-X/PLS8-V evaluation board layer table PLS8-X_PLS8-V_HD_v03.016 Confidential / Released 2015-12-09 Cinterion PLS8-X/PLS8-V Hardware Interface Description 5.2 GNSS Antenna Interface 57 Page 56 of 105 5.2 GNSS Antenna Interface In addition to the RF antenna interface PLS8-X/PLS8-V also has a GNSS antenna interface. See Section 6.5 to find out where the GNSS antenna pad is located. The GNSS pad itself is the same as for the RF antenna interface (see Section 5.1.1). It is possible to connect active or passive GNSS antennas. In either case they must have 50 impedance. The simultaneous operation of GSM and GNSS is implemented. For electrical characteristics see Section 6.8. PLS8-X/PLS8-V provides the supply voltage VGNSS for the GNSS active antenna (3.05V). It has to be enabled by software when the GNSS receiver becomes active, otherwise VGNSS should be off (power saving). VGNSS is not short circuit protected. This will have to be provided for by an external application. The DC voltage should be fed back via ANT_GNSS_DC for cou-

pling into the GNSS antenna path. Figure 24 shows the flexibility in realizing the power supply for an active GNSS antenna by giving two sample circuits realizing the supply voltage for an active GNSS antenna - one with short circuit protection and one with an external LDO employed. Module SMT interface VGNSS 100nF ANT_GNSS_DC 10nH ANT_GNSS To GNSS receiver Module SMT interface VGNSS 100nF ANT_GNSS_DC 10nH ANT_GNSS To GNSS receiver typ 3.05V max. 50mA Not short circuit protected!

Short circuit protection

(Imax=50mA) 10k 1uF

(Optional) ESD protection Active GNSS antenna Supply with short circuit protection External voltage Active GNSS antenna Enable LDO 10k 1uF

(Optional) ESD protection Supply with external LDO employed Figure 24: Supply voltage for active GNSS antenna PLS8-X_PLS8-V_HD_v03.016 Confidential / Released 2015-12-09 Cinterion PLS8-X/PLS8-V Hardware Interface Description 5.2 GNSS Antenna Interface 57 Page 57 of 105 Figure 25 shows sample circuits realizing ESD protection for a passive GNSS antenna. Module SMT interface VGNSS Not used 100nF ANT_GNSS_DC 10nH ANT_GNSS To GNSS receiver

(Optional) ESD protection 0R Passive GNSS antenna Figure 25: ESD protection for passive GNSS antenna PLS8-X_PLS8-V_HD_v03.016 Confidential / Released 2015-12-09 Cinterion PLS8-X/PLS8-V Hardware Interface Description 6 Electrical, Reliability and Radio Characteristics 81 Page 58 of 105 6 6.1 Electrical, Reliability and Radio Characteristics Absolute Maximum Ratings The absolute maximum ratings stated in Table 16 are stress ratings under any conditions. Stresses beyond any of these limits will cause permanent damage to PLS8-X/PLS8-V. Table 16: Absolute maximum ratings Parameter Supply voltage BATT+

Voltage at all digital lines in Power Down mode Voltage at digital lines in normal operation Voltage at SIM/USIM interface, CCVCC 1.8V in normal operation Voltage at SIM/USIM interface, CCVCC 3.0V in normal operation VDDLP input voltage Voltage at ADC lines if the module is powered by BATT+

Voltage at ADC lines if the module is not powered VEXT maximum current shorted to GND VUSB_IN, USB_DN, USB_DP Voltage at PWR_IND line PWR_IND input current if PWR_IND= low Voltage at following signals:

IGT, EMERG_OFF GNSS antenna supply VGNSS Min

-0.5

-0.5

-0.5

-0.5

-0.5

-0.3

-0.5

-0.5

-0.3

-0.5

-0.5 Max

+6.0

+0.5

+2.3

+2.3

+3.4

+3.5

+3.5

+0.5

-300 5.75 5.5 2 2.5 300 Unit V V V V V V V V mA V V mA V mA PLS8-X_PLS8-V_HD_v03.016 Confidential / Released 2015-12-09 Cinterion PLS8-X/PLS8-V Hardware Interface Description 6.2 Operating Temperatures 81 Page 59 of 105 6.2 Operating Temperatures Table 17: Board temperature Parameter Operating temperature range1 Normal temperature range Extreme temperature range Extended temperature range2 Automatic shutdown3 Temperature measured on PLS8-X/PLS8-V board Min

+15

-30

-40 Typ

+25 Max

+55

+85

+95

<-40

---

>+95 Unit C C C C 1. Operating temperature range according to 3GPP type approval specification. 2. Extended operation allows normal mode data transmissions for limited time until automatic thermal shut-

down takes effect. Within the extended temperature range (outside the operating temperature range) there should not be any unrecoverable malfunctioning. General performance parameters like Pout or RX sensitivity however may be reduced in their values. The modules life time may also be affected, if deviating from a general temperature allocation model (for details see Section 6.2.1). 3. Due to temperature measurement uncertainty, a tolerance on the stated shutdown thresholds may occur. The possible deviation is in the range of 2C at the overtemperature and undertemperature limit. See also Section 3.3.5 for information about the NTC for on-board temperature measurement, automatic thermal shutdown and alert messages. Note that within the specified operating temperature ranges the board temperature may vary to a great extent depending on operating mode, used frequency band, radio output power and current supply voltage. Note also the differences and dependencies that usually exist between board (PCB) temperature and ambient temperature as shown in the following Figure 26. The possible ambient temperature range depends on the mechanical application design including the module and the PCB with its size and layout. A thermal solution will have to take these dif-

ferences into account and should therefore be an integral part of application design. Heat source Reference point PCB temperature Component LGA mounting Air gap Module Shielding Module PCB LGA mounting Application PCB Thermal conducting gap filler Heat sink Reference point ambient temperature Heat dissipation Figure 26: Board and ambient temperature differences PLS8-X_PLS8-V_HD_v03.016 Confidential / Released 2015-12-09 Cinterion PLS8-X/PLS8-V Hardware Interface Description 6.3 Storage Conditions 81 Page 60 of 105 6.2.1 Temperature Allocation Model The temperature allocation model shown in Table 18 assumes shares of a modules average lifetime of 10 years (given in %) during which the module is operated at certain temperatures. Table 18: Temperature allocation model Module lifetime share (in %)1 Module Temperature (in C) 1

-40 1

-30 5

-10 53 20 35 40 3 70 1 85 1 95 1. Based on an assumed average module lifetime of 10 years (=100%). Any deviations from the above temperature allocation model may reduce the modules life span, for example if the module is operated close to the maximum automatic shutdown tem-

perature not only for 1% but for 20% of its product life. 6.3 Storage Conditions The conditions stated below are only valid for modules in their original packed state in weather protected, non-temperature-controlled storage locations. Normal storage time under these conditions is 12 months maximum. The modules will be delivered in a packaging that meets the requirements according "IPD/JEDEC J-STD-033B.1" for Low Temperature Carriers. Table 19: Storage conditions Type Humidity relative: Low High Air pressure: Low High Movement of surrounding air Water: rain, dripping, icing and frosting Radiation:

Solar Heat Condition 10 90 at 40C 70 106 1.0 Not allowed 1120 600 Chemically active substances Not recom-

Unit Reference

%

CbIPC/JEDEC J-STD-033A kPa m/s

---

IEC TR 60271-3-1: 1K4 IEC TR 60271-3-1: 1K4 IEC TR 60271-3-1: 1K4

---

W/m2 ETS 300 019-2-1: T1.2, IEC 60068-2-2 Bb ETS 300 019-2-1: T1.2, IEC 60068-2-2 Bb IEC TR 60271-3-1: 1C1L Mechanically active sub-

stances Vibration sinusoidal:

Displacement Acceleration Frequency range Shocks:

Shock spectrum Duration Acceleration mended Not recom-

mended 1.5 5 2-9 9-200 Semi-sinusoidal 1 50 mm m/s2 Hz ms m/s2 IEC TR 60271-3-1: 1S1 IEC TR 60271-3-1: 1M2 IEC 60068-2-27 Ea PLS8-X_PLS8-V_HD_v03.016 Confidential / Released 2015-12-09 Cinterion PLS8-X/PLS8-V Hardware Interface Description 6.4 Reliability Characteristics 81 Page 61 of 105 6.4 Reliability Characteristics The test conditions stated below are an extract of the complete test specifications. Table 20: Summary of reliability test conditions Type of test Vibration Conditions Frequency range: 10-20Hz; acceleration: 5g Frequency range: 20-500Hz; acceleration: 20g Duration: 20hper axis; 3 axes Acceleration: 500g Shock duration: 1ms 1 shock per axis 6 positions ( x, y and z) Temperature: +70 2C Test duration: 16h Humidity in the test chamber: < 50%

Low temperature: -40C 2C High temperature: +85C 2C Changeover time: < 30s (dual chamber system) Test duration: 1h Number of repetitions: 100 High temperature: +55C 2C Low temperature: +25C 2C Humidity: 93% 3%

Number of repetitions: 6 Test duration: 12h + 12h Temperature: -40 2C Test duration: 16h Standard DIN IEC 60068-2-61 DIN IEC 60068-2-27 EN 60068-2-2 Bb ETS 300 019-2-7 DIN IEC 60068-2-14 Na ETS 300 019-2-7 DIN IEC 60068-2-30 Db ETS 300 019-2-5 DIN IEC 60068-2-1 Shock half-sinus Dry heat Temperature change (shock) Damp heat cyclic Cold (constant exposure) 1. For reliability tests in the frequency range 20-500Hz the Standards acceleration reference value was inc-

reased to 20g. PLS8-X_PLS8-V_HD_v03.016 Confidential / Released 2015-12-09 Cinterion PLS8-X/PLS8-V Hardware Interface Description 6.4 Reliability Characteristics 81 Page 62 of 105 6.4.1 Bending Tests From experience with other modules an elongation of up to 200m/m is acceptable for PLS8-X/

PLS8-V modules as a result of bending strains. Tests (based on EN 60068-2-21) showed that if applying a force of 10N at the middle of the module, i.e., the evaluation module with the actual PLS8-X/PLS8-V module soldered onto the evaluation PCB as shown in Figure 27, the possible elongation is clearly below the value of 200m/m. Therefore, a force of 10N is recommended as maximum force. Please note that these values only apply for a one-off short stress. The module will have to be mounted free of any strains and without being exposed to dynamic pressures. Figure 27: Bending test setup PLS8-X_PLS8-V_HD_v03.016 Confidential / Released 2015-12-09 Cinterion PLS8-X/PLS8-V Hardware Interface Description 6.5 Pad Assignment and Signal Description 81 6.5 Pad Assignment and Signal Description Page 63 of 105 The SMT application interface on the PLS8-X/PLS8-V provides connecting pads to integrate the module into external applications. Table 21 lists the pads assignments. Figure 28 (bottom view) and Figure 29 (top view) show the connecting pads numbering plan. Please note that pads marked "rfu" (reserved for future use) and further qualified as "dnu" (do not use) may be soldered but should not be connected to an external application. Pads marked

"rfu" and qualified as "GND" (ground) are assigned to ground with PLS8-X/PLS8-V modules, but may have different assignments with future Gemalto M2M products using the same pad lay-

out. Gemalto strongly recommends to solder all connecting pads for mechanical stability and heat dissipation. PLS8-X_PLS8-V_HD_v03.016 Confidential / Released 2015-12-09 Cinterion PLS8-X/PLS8-V Hardware Interface Description 6.5 Pad Assignment and Signal Description 81 Page 64 of 105 Signal Name Signal Name GND GND GND GND ANT_DRX_MIMO GND GND GND rfu (dnu) rfu (dnu) Table 21: Overview: Pad assignments1 Pad No. A4 nc GND A5 A6 GND A7 rfu (dnu) GND A8 A9 GND A10 GND A11 GND A12 A13 GND nc B3 B4 GND B5 GND GND B6 B7 GND B8 GND GND B9 B10 GND B11 GND B12 GND B13 GND B14 STATUS C2 GND GND C3 C4 GND C5 GND GND C6 C7 GND GND C8 C9 GND C10 GND C11 GND rfu (dnu) C12 rfu (dnu) C13 rfu (dnu) C14 rfu (dnu) C15 GND D1 GND D2 GND D3 GND D4 ANT_GNSS_DC D5 GND D6 GND D7 GND D8 D9 GND D10 GND D11 GND D12 D13 D14 D15 D16 E1 Pad No. E2 E3 E4 E5 E12 CCIO2 E13 CCRST2 rfu (dnu) E14 rfu (dnu) E15 rfu (dnu) E16 GND F1 F2 GND GND F3 GND F4 rfu (dnu) F13 F14 rfu (dnu) F15 rfu (dnu) F16 GPIO10 G1 G2 G3 G4 G13 G14 GPIO7 G15 GPIO8 G16 GPIO9 H1 H2 H3 H4 H13 H14 GPIO4 H15 GPIO5 H16 GPIO6 GND J1 GND J2 GND J3 J4 GND J13 GND J14 GPIO1 J15 GPIO2 J16 GPIO3 K1 K2 K3 K4 K5 K12 K13 K14 CCIO1 K15 CCVCC1 K16 VGNSS GND L1 CCIN2 rfu (dnu) CCCLK2 rfu (dnu) rfu (dnu) ANT_GNSS GND GND GND GND rfu (dnu) ANT_MAIN GND GND GND GND rfu (dnu) rfu (dnu) Pad No. L2 L3 L4 L5 L6 L7 L8 L9 L10 L11 L12 L13 L14 L15 L16 M2 M3 M4 M5 M6 M7 M8 M9 M10 M11 M12 M13 M14 M15 N3 N4 N5 N6 N7 N8 N9 N10 N11 N12 N13 N14 P4 P5 P6 P7 P8 P9 P10 P11 P12 P13 Signal Name GND GND GND rfu (dnu) CCVCC2 rfu (dnu) rfu (dnu) rfu (dnu) rfu (dnu) rfu (dnu) rfu (dnu) rfu (dnu) CCRST1 CCCLK1 IGT GND GND PWR_IND VEXT GND PCM_I2S_IN PCM_I2S_CLK PCM_I2S_FSC PCM_I2S_OUT ADC3_IN ADC2_IN ADC1_IN CCIN1 VDDLP BATT+_RF BATT+_RF VUSB_IN rfu (dnu) rfu (dnu) CTS0 DCD0 RTS0 GND rfu (dnu) BATT+

EMERG_OFF USB_DP USB_DN I2S_MCLKOUT rfu (dnu) DTR0 DSR0 RING0 RXD0 TXD0 BATT+

1. nc = not connected; rfu = reserved for future use; dnu = do not use PLS8-X_PLS8-V_HD_v03.016 Confidential / Released 2015-12-09 Cinterion PLS8-X/PLS8-V Hardware Interface Description 6.5 Pad Assignment and Signal Description 81 Page 65 of 105 1 2 3 4 USB_DP 5 USB_ DN BATT+_ RF BATT+_ RF VUSB_ IN 6 I2S_ MCLK-

OUT rfu

(dnu) GND GND PWR_IND VEXT GND GND GND GND GND rfu

(dnu) CCVCC2 7 rfu

(dnu) rfu

(dnu) PCM_ I2S_ IN rfu

(dnu) P N M L K ANT_ MAIN GND GND GND GND 8 9 DTR0 DSR0 10 RING0 11 RXD0 12 TXD0 13 BATT+

14 15 16 CTS0 DCD0 RTS0 GND rfu

(dnu) BATT+

EMERG_ OFF PCM_ I2S_ CLK rfu

(dnu) PCM_ I2S_ FSC rfu

(dnu) PCM_ I2S_ OUT rfu

(dnu) ADC3_ IN ADC2_ IN ADC1_ IN CCIN1 VDDLP rfu

(dnu) rfu

(dnu) rfu (dnu) CCRST1 CCCLK1 IGT rfu

(dnu) rfu (dnu) CCIO1 CCVCC1 VGNSS GND GPIO1 GPIO2 GPIO3 J H G F GND GND GND GND GND GND GND GND GND GND GND rfu

(dnu) GND GND GND GND E ANT_ GNSS GND GND GND GND rfu: Reserved for future use (should not be connected to external application) nc: Internally not connected (may be arbi-

trarily connected to external application)

(dnu): Do not use rfu

(dnu) rfu

(dnu) rfu

(dnu) CCIO2 CCRST2 rfu

(dnu) rfu

(dnu) GPIO4 GPIO5 GPIO6 GPIO7 GPIO8 GPIO9 D C B A Position marker GND GND GND GND ANT_ GNSS_ DC GND GND GND GND GND GND CCIN2 GND GND GND GND GND GND GND GND GND GND rfu

(dnu) rfu

(dnu) rfu

(dnu) CCCLK2 rfu

(dnu) nc GND GND GND GND GND GND GND GND GND GND STATUS nc GND GND rfu

(dnu) GND GND GND GND GND ANT_ DRX_ MIMO Figure 28: PLS8-X/PLS8-V bottom view: Pad assignments PLS8-X_PLS8-V_HD_v03.016 Confidential / Released GPIO10 rfu

(dnu) rfu

(dnu) rfu

(dnu) rfu

(dnu) rfu

(dnu) rfu

(dnu) For internal use:

Not to be soldered 2015-12-09 Cinterion PLS8-X/PLS8-V Hardware Interface Description 6.5 Pad Assignment and Signal Description 81 Page 66 of 105 P N M L K J H G F E D C B A For internal use: Not to be soldered 16 15 14 13 BATT+

12 TXD0 11 RXD0 10 RING0 9 8 DSR0 DTR0 EMERG_ OFF BATT+

rfu

(dnu) GND RTS0 DCD0 CTS0 VDDLP CCIN1 ADC1_ IN ADC2_ IN ADC3_ IN IGT CCCLK1 CCRST1 VGNSS CCVCC1 CCIO1 rfu

(dnu) rfu

(dnu) rfu

(dnu) rfu

(dnu) rfu

(dnu) GPIO3 GPIO2 GPIO1 GND PCM_ I2S_ OUT rfu

(dnu) PCM_ I2S_ FSC rfu

(dnu) PCM_ I2S_ CLK rfu

(dnu) 7 rfu

(dnu) rfu

(dnu) PCM_ I2S_ IN rfu

(dnu) 6 I2S_ MCLK-

OUT rfu

(dnu) 5 USB_ DN 4 USB_DP 3 2 1 VUSB_ IN BATT+_ RF BATT+_ RF GND VEXT PWR_IND GND GND CCVCC2 rfu

(dnu) GND GND GND GND GND GND GND GND ANT_ MAIN GND GND GND GND GPIO6 GPIO5 GPIO4 GPIO9 GPIO8 GPIO7 rfu

(dnu) rfu

(dnu) rfu

(dnu) CCRST2 CCIO2 rfu: Reserved for future use (should not be connected to external application) nc: Internally not connected (may be arbi-

trarily connected to external application)

(dnu): Do not use rfu

(dnu) rfu

(dnu) GPIO10 rfu

(dnu) rfu

(dnu) rfu

(dnu) rfu

(dnu) rfu

(dnu) rfu

(dnu) CCCLK2 rfu

(dnu) rfu

(dnu) rfu

(dnu) CCIN2 GND GND GND GND GND GND GND GND GND GND rfu

(dnu) GND GND GND GND GND GND GND GND GND GND GND ANT_ GNSS GND GND GND GND ANT_ GNSS_ DC rfu

(dnu) GND GND GND GND GND GND GND GND GND GND Position marker STATUS GND GND GND GND GND GND GND GND GND GND nc GND ANT_ DRX_ MIMO GND GND GND GND rfu

(dnu) GND GND nc Figure 29: PLS8-X/PLS8-V top view: Pad assignments PLS8-X_PLS8-V_HD_v03.016 Confidential / Released 2015-12-09 Cinterion PLS8-X/PLS8-V Hardware Interface Description 6.5 Pad Assignment and Signal Description 81 Page 67 of 105 Please note that the reference voltages listed in Table 22 are the values measured directly on the PLS8-X/PLS8-V module. They do not apply to the accessories connected. Table 22: Signal description Function Power sup-

ply Signal name IO Signal form and level BATT+_RF I VImax = 4.2V VInorm = 3.8V VImin = 3.3V during Tx burst on board Imax 2A, during Tx burst (GSM) BATT+

I n Tx = n x 577s peak current every 4.615ms VImax = 4.2V VInorm = 3.8V VImin = 3.3V during Tx burst on board Imax = 350mA Ground GND VEXT Power sup-

ply External supply volt-

age O CLmax = 1F VO = 1.80V +1% -5%

IOmax = -50mA VGNSS O CLmax = 2.2 VO = 3.05V 1%

@IO = -20mA IOmax = -50mA Supply volt-

age for active GNSS antenna

(Output) Supply volt-

age for active GNSS antenna

(Input) Ignition ANT_GNSS_ DC IGT I I I VImax = 6V The input curren has to be limited at 50mA (antenna short circuit protec-

tion) RPU 200k VOHmax=1.8V VIHmax =2.1V VIHmin = 1.17V VILmax = 300mV Low impulse width > 100ms RPU 40k VOHmax=1.8V VIHmax =2.1V VIHmin = 1.17V VILmax = 300mV

~~|___|~~ low impulse width > 40ms Emer-

gency off EMERG_ OFF Comment Lines of BATT+ and GND must be connected in paral-

lel for supply purposes because higher peak cur-

rents may occur. Minimum voltage must not fall below 3.3V including drop, ripple, spikes. For proper module power up the voltage at BATT+ must be greater than at VDDLP. Application Ground VEXT may be used for appli-

cation circuits. If unused keep line open. The external digital logic must not cause any spikes or glitches on voltage VEXT. Do not exeed IOmax Available if GNSS antenna DC power is enabled (con-

figurable by AT command;

see Section 6.8). If unused connect to GND. This signal switches the module ON. It is recommended to drive this line low by an open drain or open collector driver con-

nected to GND. It is recommended to drive this line low by an open drain or open collector driver con-

nected to GND. If unused keep line open. PLS8-X_PLS8-V_HD_v03.016 Confidential / Released 2015-12-09 Cinterion PLS8-X/PLS8-V Hardware Interface Description 6.5 Pad Assignment and Signal Description 81 Page 68 of 105 Comment If unused keep line open. Status signalling e.g. with ext. LED circuit CCINx = Low, SIM card inserted. If unused connect to GND. CCIN2: External pull-up required - for details please refer to Section 3.8. Maximum cable length or copper track should be not longer than 100mm to SIM card holder. CCIO2: External 10k pull-

up required - for details please refer to Section 3.8. Table 22: Signal description Function RTC backup Signal name IO Signal form and level VDDLP O VOmax = 3.20V while BATT+ =>3.3V I RI = 1.8k VI = 1.5V3.25V at Imax= 10A while BATT+ = 0V Connectiv-

ity status STATUS CCIN1 SIM card detection

(2x) CCIN2 3V SIM card inter-

face CCRST1 CCRST2 CCIO1 CCIO2 CCCLK1 CCCLK2 CCVCC1 CCVCC2 I O VOLmax = 0.45V at I = 2mA VOHmin = 1.35V at I = -2mA VOHmax = 1.85V RPU 24.2k VOHmax=1.9V VIHmin = 1.15V VIHmax= 1.9V VILmax = 0.4V VIHmin = 1.15V VIHmax= 2.1V VILmax = 0.63V IIHPD = 27.5A...97.5A I O VOLmax = 0.45V at I = 2mA VOHmin = 2.57V at I = -2mA VOHmax = 3.08V I/O RPU 4.8...9.5k VILmax = 0.76V VILmin = -0.3V VIHmin = 1.98V VIHmax = 3.35V VOLmax = 0.45V at I = 2mA VOHmin = 2.57V at I = -0.05mA VOHmax = 3.08V O VOLmax = 0.45V at I = 2mA VOHmin = 2.57V at I = -2mA VOHmax = 3.08V O VOmin = 3.0V VOtyp =3.05V VOmax = 3.08V IOmax = -50mA PLS8-X_PLS8-V_HD_v03.016 Confidential / Released 2015-12-09 Cinterion PLS8-X/PLS8-V Hardware Interface Description 6.5 Pad Assignment and Signal Description 81 Page 69 of 105 Table 22: Signal description Function 1.8V SIM card inter-

face Signal name IO Signal form and level CCRST1 CCRST2 CCIO1 CCIO2 CCCLK1 CCCLK2 CCVCC1 CCVCC2 RXD0 CTS0 DSR0 DCD0 RING0 TXD0 RTS0 DTR0 PWR_IND Serial Modem Interface ASC0 Power indi-

cator O VOLmax = 0.45V at I = 2mA VOHmin = 1.35V at I = -2mA VOHmax = 1.85V I/O RI 4.8...9.5k VILmax = 0.62V VILmin = -0.3V VIHmin = 1.20V VIHmax = 2.1V VOLmax = 0.45V at I = 2mA VOHmin = 1.32V at I = -0.05mA VOHmax = 1.82V O VOLmax = 0.45V at I = 2mA VOHmin = 1.32V at I = -2mA VOHmax = 1.82V O VOmin = 1.75V VOtyp = 1.80V VOmax = 1.82V IOmax = -50mA O VOLmax = 0.45V at I = 2mA VOHmin = 1.35V at I = -2mA O VOHmax = 1.85V O O O I I I O VIHmax = 5.5V VILmax = 0.6V at 30A VIHmin = 1.20V at -30A VIHmax = 2V VOLmax = 0.4V at Imax = 1mA Host wakeup RING0 O VOLmax = 0.45V at I = 2mA VOHmin = 1.35V at I = -2mA VOHmax = 1.85V Comment Maximum cable length or copper track should be not longer than 100mm to SIM card holder. CCIO2: External 10k pull-

up required - for details please refer to Section 3.8. If unused keep line open. PWR_IND (Power Indicator) notifies the modules on/off state. PWR_IND is an open collec-

tor that needs to be con-

nected to an external pull-up resistor. Low state of the open collector indicates that the module is on. Vice versa, high level notifies the Power Down mode. Therefore, signal may be used to enable external vol-

tage regulators that supply an external logic for commu-

nication with the module, e.g. level converters. If unused keep line open. PLS8-X_PLS8-V_HD_v03.016 Confidential / Released 2015-12-09 Cinterion PLS8-X/PLS8-V Hardware Interface Description 6.5 Pad Assignment and Signal Description 81 Page 70 of 105 Table 22: Signal description Function USB Signal name IO Signal form and level VUSB_IN I VINmin = 3.0V VINmax = 5.25V IItyp = 150A IImax = 200A Cin=1F In case of Vripple > 10mVpp (with f>300kHz), and VBUS_IN driven in the voltage range 4.08V...4.11V, use of an RC filter 1k/100nF is required. I/O All electrical characteristics according I/O to USB Implementers Forum, USB 2.0 High Speed Specification. USB_DN USB_DP VILmax = 0.6V at 30A VIHmin = 1.20V at -30A VIHmax = 2V VOLmax = 0.45V at I = 2mA VOHmin = 1.35V at I = -2mA VOHmax = 1.85V PCM_I2S_IN I PCM_I2S_ CLK PCM_I2S_ FSC PCM_I2S_ OUT I2S_ MCLKOUT I/O I/O O O VOLmax = 0.45V at I = 2mA VOHmin = 1.35V at I = -2mA VOHmax = 1.85V F=2048KHz (at 8KHz sample rate) F=4096KHz (at 16KHz sample rate) I/O VILmax = 0.6V at 30A VIHmin = 1.20V at -30A VIHmax = 2V VOLmax = 0.45V at I = 2mA VOHmin = 1.35V at I = -2mA VOHmax = 1.85V GPIO1 GPIO2 GPIO3 GPIO4 GPIO5 GPIO6 GPIO7 GPIO8 GPIO9 GPIO10 GPIO1

(DR_SYNC) O VOLmax = 0.45V at I = 2mA VOHmin = 1.35V at I = -2mA VOHmax = 1.85V GPIO2

(ANT_SWIT CH) O VOLmax = 0.45V at I = 2mA VOHmin = 1.35V at I = -2mA VOHmax = 1.85V Digital audio inter-

face

(PCM or I2S) GPIO interface Dead reckoning synchroni-

zation 700MHz antenna control switch Comment If the USB interface is not used please connect this line to GND. Since VUSB_IN is used for detection only it is recom-

mended not to add any fur-

ther blocking capacitors on the VUSB_IN line. Keep lines open if VUSB_IN connects to GND. USB High Speed mode operation requires a differ-

ential impedance of 90 PCM Master/Slave mode. I2S Master mode. If unused keep lines open. Available for local tones only

- see Section 3.9. Master clock option for audio codecs without PLL. If unused keep line open. If unused keep lines open. Following functions can be configured for GPIOs using AT commands:

GPIO1 --> Dead reckoning synchronization GPIO2 --> 700MHz antenna control switch Any GPIO --> Low current indication. By default GPIO6 is configured as LCI line. Any GPIO --> Remote host wakeup line 1 pulse per second dead reckoning synchronization signal for usage in external dead reckoning applications

(see Chapter 4). Line can be configured as a control signal for a possible external 700MHz antenna switch (see Section 3.13.6). PLS8-X_PLS8-V_HD_v03.016 Confidential / Released 2015-12-09 Cinterion PLS8-X/PLS8-V Hardware Interface Description 6.5 Pad Assignment and Signal Description 81 Page 71 of 105 Table 22: Signal description Function Low Current Indication Signal name IO Signal form and level GPIOx O VOLmax = 0.45V at I = 2mA VOHmin = 1.35V at I = -2mA VOHmax = 1.85V Remote host wakeup ADC interface GPIOx I VIHmax = 2V RPD= appr. 100k O VOLmax = 0.45V at I = 2mA VOHmin = 1.35V at I = -2mA VOHmax = 1.85V ADC1_IN, ADC2_IN, ADC3_IN I Full specification compliance range VImin>=0.3V VImax<=3.075V Degraded accuracy range VImin 0.05V ... 0.3V Ridc>1M Resolution: 12 Bit Offset error: <+-10mV Gain error: <1%

analog bandwidth: <16kHz conversation time: 853s Comment If the feature is enabled (see Section 3.13.4). If the feature is disabled

(see Section 3.13.4). If feature is enabled (see Section 3.13.3). If unused keep line open. PLS8-X_PLS8-V_HD_v03.016 Confidential / Released 2015-12-09 Cinterion PLS8-X/PLS8-V Hardware Interface Description 6.6 Power Supply Ratings 81 Page 72 of 105 6.6 Power Supply Ratings Table 23 and Table 24 assemble various voltage supply and current consumption ratings of the module. Table 23: Voltage supply ratings Description BATT+ Supply voltage Maximum allowed voltage drop dur-

ing transmit burst Voltage ripple Conditions Directly measured at Module. Voltage must stay within the min/max values, including voltage drop, ripple, spikes Normal condition, power control level for Pout max Normal condition, power control level for Pout max

@ f <= 250 kHz

@ f > 250 kHz Table 24: Current consumption ratings1 IVDDLP

@ 3V IBATT+

Description OFF State supply current 2 OFF State supply current Average GSM /

GPRS supply cur-

rent

(GNSS off) Conditions Power down Power Down SLEEP3 @ DRX=9

(no communication via UART) SLEEP3 @ DRX=5

(no communication via UART) SLEEP3 @ DRX=2

(no communication via UART) IDLE @ DRX=2 UART active, but no communica-

tion Voice call GSM850/900;

PCL=5 GPRS Data transfer GSM850/900; PCL=5; 1Tx/

4Rx GPRS Data transfer GSM850/900; PCL=5; 2Tx/

3Rx GPRS Data transfer GSM850/900; PCL=5; 4Tx/

1Rx USB disconnected USB disconnected USB disconnected USB disconnected USB active

@50 ROPR=8

(max. reduction) ROPR=4

(no reduction) ROPR=8

(max. reduction) ROPR=4

(no reduction) ROPR=8

(max. reduction) ROPR=4

(no reduction)

@ total mismatch Min Typ Max Unit 3.3 3.8 4.2 V 400 mV 120 90 mVpp mVpp Typical rating Unit A A mA mA mA mA mA mA mA mA mA 4 40 2.0 2.5 3.7 40 50 330 320 430 540 600 930 990 PLS8-X_PLS8-V_HD_v03.016 Confidential / Released 2015-12-09 Cinterion PLS8-X/PLS8-V Hardware Interface Description 6.6 Power Supply Ratings 81 Page 73 of 105 Table 24: Current consumption ratings1 IBATT+

Description 2 Average GSM /

GPRS supply cur-

rent

(GNSS off) Conditions EDGE Data transfer GSM850/900; PCL=5; 1Tx/

4Rx EDGE Data transfer GSM850/900; PCL=5; 2Tx/

3Rx EDGE Data transfer GSM850/900; PCL=5; 4Tx/

1Rx ROPR=8

(max. reduction) ROPR=4

(no reduction) ROPR=8

(max. reduction) ROPR=4

(no reduction) ROPR=8

(max. reduction) ROPR=4

(no reduction)

@50 Voice call GSM1800/1900;

PCL=0 GPRS Data transfer GSM1800/1900; PCL=0;

1Tx/4Rx EDGE Data transfer GSM1800/1900; PCL=0;

1Tx/4Rx GPRS Data transfer GSM1800/1900; PCL=0;

4Tx/1Rx GPRS Data transfer GSM1800/1900; PCL=0;

2Tx/3Rx ROPR=8

(max. reduction) ROPR=4

(no reduction) ROPR=8

(max. reduction) ROPR=4

(no reduction) ROPR=8

(max. reduction) ROPR=4

(no reduction) ROPR=8

(max. reduction) ROPR=4

(no reduction) ROPR=8

(max. reduction) ROPR=4

(no reduction) ROPR=8

(max. reduction) ROPR=4

(no reduction)

@50

@total mismatch

@50

@total mismatch GSM active (UART/USB active); @DRX=2 &

GNSS NMEA output off GSM active (UART/USB active); @DRX=2 &

GNSS NMEA output on4 EDGE Data transfer GSM1800/1900; PCL=0;

2Tx/3Rx EDGE Data transfer GSM1800/1900; PCL=0;

4Tx/1Rx Voice call GSM1800/1900;

PCL=0 Voice call GSM850/900;

PCL=5 Peak current dur-

ing GSM transmit burst IBATT+

2 Average GSM /

GNSS supply cur-

rent (GNSS on) Typical rating Unit mA 220 300 340 490 570 240 230 300 360 410 590 190 250 290 380 460 2.1 2.4 1.3 1.6 65 85 mA mA mA mA mA mA mA mA mA A A mA mA PLS8-X_PLS8-V_HD_v03.016 Confidential / Released 2015-12-09 Cinterion PLS8-X/PLS8-V Hardware Interface Description 6.6 Power Supply Ratings 81 Page 74 of 105 Table 24: Current consumption ratings1 Description IBATT+

2 Average UMTS supply current

(GNSS off) Voice calls and Data transfers measured

@maximum Pout Conditions SLEEP3 @ DRX=9 SLEEP3 @ DRX=8 SLEEP3 @ DRX=6 IDLE @ DRX=6 Voice call Band II USB disconnected USB disconnected USB disconnected USB disconnected USB active

@50

@total mismatch Average UMTS /

GNSS supply cur-

rent (GNSS on) Average LTE sup-

ply current5

(GNSS off) Data transfers measured

@maximum Pout Voice call Band IV Voice call Band V UMTS Data transfer Band II UMTS Data transfer Band IV UMTS Data transfer Band V HSPA Data transfer Band II HSPA Data transfer Band IV HSPA Data transfer Band V WCDMA active (UART / USB active); @DRX=6

& GNSS NMEA output off WCDMA active (UART / USB active); @DRX=6

& GNSS NMEA output on4 SLEEP3 @ "Paging Occa-

sions" = 256 SLEEP3 @ "Paging Occa-

sions" = 128 SLEEP3 @ "Paging Occa-

sions" = 64 SLEEP3 @ "Paging Occa-

sions" = 32 IDLE USB disconnected USB disconnected USB disconnected USB disconnected USB disconnected USB active LTE Data transfer Band 2 @ 50

@ total mismatch LTE Data transfer Band 4 LTE Data transfer Band 5 LTE Data transfer Band 13 LTE Data transfer Band 17 Typical rating Unit mA mA mA mA mA mA 1.8 2.1 3.3 30 40 580 700 490 470 580 520 490 590 540 510 65 85 2.3 2.7 3.5 5.4 35 45 620 740 540 550 570 550 mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA PLS8-X_PLS8-V_HD_v03.016 Confidential / Released 2015-12-09 Cinterion PLS8-X/PLS8-V Hardware Interface Description 6.6 Power Supply Ratings 81 Page 75 of 105 Table 24: Current consumption ratings1 Description IBATT+

2 Average LTE /

GNSS supply cur-

rent (GNSS on) Conditions LTE active (UART / USB active); @DRX=6 &

GNSS NMEA output off LTE active (UART / USB active); @DRX=6 &

GNSS NMEA output on4 Typical rating Unit mA 65 85 mA IVUSB_IN USB typical and maximum ratings are mentioned in Table 22: VUSB_IN. 1. Please note that the listed frequency bands apply as follows:

PLS8-X: LTE: Bd 2, 4, 5, 13 and 17; UMTS/HSPA+ Bd II. IV and V; GSM 850/900/1800/1900MHz PLS8-V: LTE: Bd 2, 4 and 13 2. With an impedance of ZLOAD=50 at the antenna pads. Measured at 25C and 4.2V - except for Power Down ratings that were measured at 3.4V. 3. Measurements start 6 minutes after switching ON the module, Averaging times: SLEEP mode - 3 minutes, transfer modes - 1.5 minutes Communication tester settings:no neighbour cells, no cell reselection etc, RMC (Reference Measurement Channel) 4. One fix per second. 5. Communication tester settings:

- Channel Bandwidth: 5MHz

- Number of Resource Blocks: 25 (DL), 1 (UL)

- Modulation: QPSK PLS8-X_PLS8-V_HD_v03.016 Confidential / Released 2015-12-09 Cinterion PLS8-X/PLS8-V Hardware Interface Description 6.7 RF Antenna Interface Characteristics 81 Page 76 of 105 6.7 RF Antenna Interface Characteristics Table 25: RF Antenna interface GSM / UMTS/LTE (at operating temperature range1)2 Parameter LTE connectivity3 Receiver Input Sensitivity @

ARP (ch. bandwidth 5MHz) Min. Typical Max. Conditions Band 2, 4, 5, 13 and 17 LTE 700 Band 17 LTE 700 Band 13 LTE 850 Band 5 LTE AWS Band 4 LTE 1900 Band 2 LTE 700 Band 17 LTE 700 Band 13 LTE 850 Band 5 LTE AWS Band 4 LTE 1900 Band 2 Band II, IV, V UMTS 850 Band V UMTS AWS Band IV UMTS 1900 Band II UMTS 850 Band V UMTS AWS Band IV UMTS 1900 Band II GNSS band Class 12, CS1 to CS4 Class 12, MCS1 to MCS9 Small MS GSM 850 / E-GSM 900 GSM 1800 / GSM 1900 GSM 850 / E-GSM 900 GSM 1800 / GSM 1900

-97 TBD.

-98

-100

-98

+21

+21

+21

+21

+21

-102 TBD.

-104

-103

-103

+23

+23

+23

+23

+23

-104.7

-110

-106.7

-104.7

+21

+21

+21

-102

-102

-110

-109

+24

+24

+24

-170

-111

-110 33 30

+25

+25

+25

+25

+25

+25

+25

+25 Unit dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm/Hz dBm dBm dBm dBm RF Power @ ARP with 50 Load UMTS/HSPA connectivity3 Receiver Input Sensitivity @

ARP RF Power @ ARP with 50 Load Tx noise @ ARP with max. RF power for UMTS:

Band 1 channel 9777 Band 2 channel 9477 GPRS coding schemes EGPRS GSM Class Static Receiver input Sensi-

tivity @ ARP RF Power @ ARP with 50 Load GSM PLS8-X_PLS8-V_HD_v03.016 Confidential / Released 2015-12-09 Cinterion PLS8-X/PLS8-V Hardware Interface Description 6.7 RF Antenna Interface Characteristics 81 Page 77 of 105 Conditions Table 25: RF Antenna interface GSM / UMTS/LTE (at operating temperature range1)2 Parameter RF Power @

ARP with 50 Load

(ROPR=4, i.e., no reduction) Min. GPRS, 1 TX GSM 850 / E-GSM 900 GSM 1800 / GSM 1900 EDGE, 1 TX GSM 850 / E-GSM 900 GSM 1800 / GSM 1900 GPRS, 2 TX GSM 850 / E-GSM 900 GSM 1800 / GSM 1900 EDGE, 2 TX GSM 850 / E-GSM 900 GSM 1800 / GSM 1900 GPRS, 3 TX GSM 850 / E-GSM 900 GSM 1800 / GSM 1900 EDGE, 3 TX GSM 850 / E-GSM 900 GSM 1800 / GSM 1900 GPRS, 4 TX GSM 850 / E-GSM 900 GSM 1800 / GSM 1900 EDGE, 4 TX GSM 850 / E-GSM 900 GSM 1800 / GSM 1900 GPRS, 1 TX GSM 850 / E-GSM 900 GSM 1800 / GSM 1900 EDGE, 1 TX GSM 850 / E-GSM 900 GSM 1800 / GSM 1900 GPRS, 2 TX GSM 850 / E-GSM 900 GSM 1800 / GSM 1900 EDGE, 2 TX GSM 850 / E-GSM 900 GSM 1800 / GSM 1900 GPRS, 3 TX GSM 850 / E-GSM 900 GSM 1800 / GSM 1900 EDGE, 3 TX GSM 850 / E-GSM 900 GSM 1800 / GSM 1900 GPRS, 4 TX GSM 850 / E-GSM 900 GSM 1800 / GSM 1900 EDGE, 4 TX GSM 850 / E-GSM 900 GSM 1800 / GSM 1900 RF Power @

ARP with 50 Load

(ROPR=5) Typical Max. 33 30 27 26 33 30 27 26 33 30 27 26 33 30 27 26 33 30 27 26 33 30 27 26 32.2 29.2 27 26 31 28 27 26 Unit dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm PLS8-X_PLS8-V_HD_v03.016 Confidential / Released 2015-12-09 Cinterion PLS8-X/PLS8-V Hardware Interface Description 6.7 RF Antenna Interface Characteristics 81 Page 78 of 105 Table 25: RF Antenna interface GSM / UMTS/LTE (at operating temperature range1)2 Parameter RF Power @

ARP with 50 Load

(ROPR=6) Conditions Min. GPRS, 1 TX GSM 850 / E-GSM 900 GSM 1800 / GSM 1900 EDGE, 1 TX GSM 850 / E-GSM 900 GSM 1800 / GSM 1900 GPRS, 2 TX GSM 850 / E-GSM 900 GSM 1800 / GSM 1900 EDGE, 2 TX GSM 850 / E-GSM 900 GSM 1800 / GSM 1900 GPRS, 3 TX GSM 850 / E-GSM 900 GSM 1800 / GSM 1900 EDGE, 3 TX GSM 850 / E-GSM 900 GSM 1800 / GSM 1900 GPRS, 4 TX GSM 850 / E-GSM 900 GSM 1800 / GSM 1900 EDGE, 4 TX GSM 850 / E-GSM 900 GSM 1800 / GSM 1900 GPRS, 1 TX GSM 850 / E-GSM 900 GSM 1800 / GSM 1900 EDGE, 1 TX GSM 850 / E-GSM 900 GSM 1800 / GSM 1900 GPRS, 2 TX GSM 850 / E-GSM 900 GSM 1800 / GSM 1900 EDGE, 2 TX GSM 850 / E-GSM 900 GSM 1800 / GSM 1900 GPRS, 3 TX GSM 850 / E-GSM 900 GSM 1800 / GSM 1900 EDGE, 3 TX GSM 850 / E-GSM 900 GSM 1800 / GSM 1900 GPRS, 4 TX GSM 850 / E-GSM 900 GSM 1800 / GSM 1900 EDGE, 4 TX GSM 850 / E-GSM 900 GSM 1800 / GSM 1900 RF Power @

ARP with 50 Load

(ROPR=7) Typical Max. 33 30 27 26 31 28 27 26 30.2 27.2 27 26 29 26 27 26 33 30 27 26 30 27 27 26 28.2 25.2 27 26 27 24 27 26 Unit dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm PLS8-X_PLS8-V_HD_v03.016 Confidential / Released 2015-12-09 Cinterion PLS8-X/PLS8-V Hardware Interface Description 6.7 RF Antenna Interface Characteristics 81 Page 79 of 105 Conditions Table 25: RF Antenna interface GSM / UMTS/LTE (at operating temperature range1)2 Parameter RF Power @

ARP with 50 Load

(ROPR=8, i.e., max. reduction) Min. GPRS, 1 TX GSM 850 / E-GSM 900 GSM 1800 / GSM 1900 EDGE, 1 TX GSM 850 / E-GSM 900 GSM 1800 / GSM 1900 GPRS, 2 TX GSM 850 / E-GSM 900 GSM 1800 / GSM 1900 EDGE, 2 TX GSM 850 / E-GSM 900 GSM 1800 / GSM 1900 GPRS, 3 TX GSM 850 / E-GSM 900 GSM 1800 / GSM 1900 EDGE, 3 TX GSM 850 / E-GSM 900 GSM 1800 / GSM 1900 GPRS, 4 TX GSM 850 / E-GSM 900 GSM 1800 / GSM 1900 EDGE, 4 TX GSM 850 / E-GSM 900 GSM 1800 / GSM 1900 Typical Max. 33 30 27 26 30 27 24 23 28.2 25.2 22.2 21.2 27 24 21 20 Unit dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm 1. At extended temperature range no active power reduction is implemented - any deviations are hardware related. 2. Please note that the listed frequency bands apply as follows:

PLS8-X: LTE: Bd 2, 4, 5, 13 and 17; UMTS/HSPA+ Bd II. IV and V; GSM 850/900/1800/1900MHz PLS8-V: LTE: Bd 2, 4 and 13 3. Applies also to UMTS/LTE Rx diversity/MIMO antenna. PLS8-X_PLS8-V_HD_v03.016 Confidential / Released 2015-12-09 Cinterion PLS8-X/PLS8-V Hardware Interface Description 6.8 GNSS Interface Characteristics 81 Page 80 of 105 6.8 GNSS Interface Characteristics The following tables list general characteristics of the GNSS interface. Table 26: GNSS properties Parameter Frequency Tracking Sensitivity Acquisition Sensitivity Conditions GPS GLONASS Open sky Active antenna or LNA Passive antenna Open sky Active antenna or LNA Passive antenna Min. 1597.551 Typical Max. 1575.42 1605.886

-159

-156 Unit MHz dBm Cold Start sensitivity1 Time-to-First-Fix (TTFF)2

-149

-145

-145 25 10 1. Test condition: Assumes 300 seconds timeout, QoS=1000m, and 50% yield. 2. Test condition: TTFF is defined for an open sky environment, i.e., with a clear view to the sky and a Cold3 Warm4 32 29 dBm dBm s s minimum signal level of -130dBm at the antenna for at least 34 satellites. This signal level represents C/No=42dB in an NMEA $GPGSV message. 3. For test purposes a cold start may be triggered by AT command: AT^SBNW="agps",-1 - see also [1]. 4. To optimize GPS start-up behavior, it is recommended to backup the modules internal real time clock via VDDLP line as described in Section 3.5. Through the external GNSS antenna DC feeding the module is able to supply an active GNSS antenna. The supply voltage level at the GNSS antenna interface depends on the GNSS con-

figuration done with AT command as shown in Table 27. Table 27: Power supply for active GNSS antenna Function GNSS active antenna supply Setting samples Supply voltage with:

GNSS receiver off Active antenna off IO Signal form and level O GNSS supply voltage level Supply voltage with:

GNSS receiver on Active antenna on SLEEP mode Supply voltage with:

GNSS receiver on Active antenna auto O O GNSS supply voltage level GNSS supply voltage level PLS8-X_PLS8-V_HD_v03.016 Confidential / Released 2015-12-09 Cinterion PLS8-X/PLS8-V Hardware Interface Description 6.9 Electrostatic Discharge 81 Page 81 of 105 6.9 Electrostatic Discharge The module is not protected against Electrostatic Discharge (ESD) in general. Consequently, it is subject to ESD handling precautions that typically apply to ESD sensitive components. Proper ESD handling and packaging procedures must be applied throughout the processing, handling and operation of any application that incorporates a PLS8-X/PLS8-V module. Special ESD protection provided on PLS8-X/PLS8-V:

BATT+: Inductor/capacitor An example for an enhanced ESD protection for the SIM interface is shown in Section 3.8.1. The remaining interfaces of PLS8-X/PLS8-V with the exception of the antenna interface are not accessible to the user of the final product (since they are installed within the device) and are therefore only protected according to the ANSI/ESDA/JEDEC JS-001-2011 requirements. PLS8-X/PLS8-V has been tested according to the following standards. Electrostatic values can be gathered from the following table. Table 28: Electrostatic values Specification / Requirements ANSI/ESDA/JEDEC JS-001-2011 All SMT interfaces JESD22-A114-F All SMT interfaces ETSI EN 301 489-1/7 BATT+

Contact discharge Air discharge 1kV Human Body Model n.a. 500V Charge Device Model (CDM) n.a. 4kV 8kV Note: The values may vary with the individual application design. For example, it matters whether or not the application platform is grounded over external devices like a computer or other equipment, such as the Gemalto M2M reference application described in Chapter 9. PLS8-X_PLS8-V_HD_v03.016 Confidential / Released 2015-12-09 Cinterion PLS8-X/PLS8-V Hardware Interface Description 7 Mechanics, Mounting and Packaging 94 7 Mechanics, Mounting and Packaging Page 82 of 105 Mechanical Dimensions of PLS8-X/PLS8-V 7.1 Figure 30 shows a 3D view1 of PLS8-X/PLS8-V and provides an overview of the board's me-

chanical dimensions. For further details see Figure 31. Length:

Width:

Height:

33mm 29mm 2.95mm Top view Bottom view Figure 30: PLS8-X/PLS8-V top and bottom view 1. The coloring of the 3D view does not reflect the modules real color. PLS8-X_PLS8-V_HD_v03.016 Confidential / Released 2015-12-09 Cinterion PLS8-X/PLS8-V Hardware Interface Description 7.1 Mechanical Dimensions of PLS8-X/PLS8-V 94 Page 83 of 105 Internal use;

Not to be soldered Figure 31: Dimensions of PLS8-X/PLS8-V (all dimensions in mm) PLS8-X_PLS8-V_HD_v03.016 Confidential / Released 2015-12-09 Cinterion PLS8-X/PLS8-V Hardware Interface Description 7.2 Mounting PLS8-X/PLS8-V onto the Application Platform 94 Page 84 of 105 7.2 Mounting PLS8-X/PLS8-V onto the Application Platform This section describes how to mount PLS8-X/PLS8-V onto the PCBs, including land pattern and stencil design, board-level characterization, soldering conditions, durability and mechani-

cal handling. For more information on issues related to SMT module integration see also [3]. Note: Gemalto strongly recommends to solder all connecting pads for mechanical stability and heat dissipation. Not only must all supply pads and signals be connected appropriately, but all pads denoted as Do not use should also be soldered (but not electrically connected). Note also that in order to avoid short circuits between signal tracks on an external application's PCB and various markings at the bottom side of the module, it is recommended not to route the sig-

nal tracks on the top layer of an external PCB directly under the module, or at least to ensure that signal track routes are sufficiently covered with solder resist. 7.2.1 7.2.1.1 Land Pattern and Stencil SMT PCB Assembly The land pattern and stencil design as shown below is based on Gemalto M2M characteriza-

tions for lead-free solder paste on a four-layer test PCB and a 110 as well as a 150 micron-thick stencil. The land pattern given in Figure 32 reflects the modules pad layout, including signal pads and ground pads (for pad assignment see Section 6.5). Besides these pads there are ground areas on the module's bottom side that must not be soldered, e.g., the position marker. To prevent short circuits, it has to be ensured that there are no wires on the external application side that may connect to these module ground areas. Figure 32: Land pattern (top layer) PLS8-X_PLS8-V_HD_v03.016 Confidential / Released 2015-12-09 Cinterion PLS8-X/PLS8-V Hardware Interface Description 7.2 Mounting PLS8-X/PLS8-V onto the Application Platform 94 Page 85 of 105 The stencil design illustrated in Figure 33 and Figure 34 is recommended by Gemalto M2M as a result of extensive tests with Gemalto M2M Daisy Chain modules. Figure 33: Recommended design for 110 micron thick stencil (top layer) Figure 34: Recommended design for 150 micron thick stencil (top layer) PLS8-X_PLS8-V_HD_v03.016 Confidential / Released 2015-12-09 Cinterion PLS8-X/PLS8-V Hardware Interface Description 7.2 Mounting PLS8-X/PLS8-V onto the Application Platform 94 Page 86 of 105 7.2.1.2 Board Level Characterization Board level characterization issues should also be taken into account if devising an SMT pro-

cess. Characterization tests should attempt to optimize the SMT process with regard to board level reliability. This can be done by performing the following physical tests on sample boards: Peel test, bend test, tensile pull test, drop shock test and temperature cycling. Sample surface mount checks are described in [3]. It is recommended to characterize land patterns before an actual PCB production, taking indi-

vidual processes, materials, equipment, stencil design, and reflow profile into account. For land and stencil pattern design recommendations see also Section 7.2.1.1. Optimizing the solder stencil pattern design and print process is necessary to ensure print uniformity, to decrease sol-

der voids, and to increase board level reliability. Daisy chain modules for SMT characterization are available on request. For details refer to [3]. Generally, solder paste manufacturer recommendations for screen printing process parame-

ters and reflow profile conditions should be followed. Maximum ratings are described in Section 7.2.3. 7.2.2 Moisture Sensitivity Level PLS8-X/PLS8-V comprises components that are susceptible to damage induced by absorbed moisture. Gemalto M2Ms PLS8-X/PLS8-V module complies with the latest revision of the IPC/JEDEC J-

STD-020 Standard for moisture sensitive surface mount devices and is classified as MSL 4. For additional moisture sensitivity level (MSL) related information see Section 7.2.4 and Sec-

tion 7.3.2. PLS8-X_PLS8-V_HD_v03.016 Confidential / Released 2015-12-09 Cinterion PLS8-X/PLS8-V Hardware Interface Description 7.2 Mounting PLS8-X/PLS8-V onto the Application Platform 94 7.2.3 Soldering Conditions and Temperature 7.2.3.1 Reflow Profile Page 87 of 105 Figure 35: Reflow Profile Table 29: Reflow temperature ratings1 Profile Feature Preheat & Soak Temperature Minimum (TSmin) Temperature Maximum (TSmax) Time (tSmin to tSmax) (tS) Average ramp up rate (TSmax to TP) Liquidous temperature (TL) Time at liquidous (tL) Peak package body temperature (TP) Time (tP) within 5 C of the peak package body temperature (TP) Average ramp-down rate (TP to TSmax) Time 25C to maximum temperature Pb-Free Assembly 150C 200C 60-120 seconds 3K/second max. 217C 60-90 seconds 245C +0/-5C 30 seconds max. TBD. 8 minutes max. 1. Please note that the reflow profile features and ratings listed above are based on the joint industry standard IPC/JEDEC J-STD-020D.1, and are as such meant as a general guideline. For more informa-

tion on reflow profiles and their optimization please refer to [3]. PLS8-X_PLS8-V_HD_v03.016 Confidential / Released 2015-12-09 Cinterion PLS8-X/PLS8-V Hardware Interface Description 7.2 Mounting PLS8-X/PLS8-V onto the Application Platform 94 7.2.3.2 Maximum Temperature and Duration Page 88 of 105 The following limits are recommended for the SMT board-level soldering process to attach the module:

A maximum module temperature of 245C. This specifies the temperature as measured at the modules top side. A maximum duration of 30 seconds at this temperature. Please note that while the solder paste manufacturers' recommendations for best temperature and duration for solder reflow should generally be followed, the limits listed above must not be exceeded. PLS8-X/PLS8-V is specified for one soldering cycle only. Once PLS8-X/PLS8-V is removed from the application, the module will very likely be destroyed and cannot be soldered onto an-

other application. PLS8-X_PLS8-V_HD_v03.016 Confidential / Released 2015-12-09 Cinterion PLS8-X/PLS8-V Hardware Interface Description 7.2 Mounting PLS8-X/PLS8-V onto the Application Platform 94 Page 89 of 105 7.2.4 Durability and Mechanical Handling Storage Life 7.2.4.1 PLS8-X/PLS8-V modules, as delivered in tape and reel carriers, must be stored in sealed, mois-

ture barrier anti-static bags. The shelf life in a sealed moisture bag is an estimated 12 months. However, such a life span requires a non-condensing atmospheric environment, ambient tem-

peratures below 40C and a relative humidity below 90%. Additional storage conditions are list-

ed in Table 22. 7.2.4.2 Processing Life PLS8-X/PLS8-V must be soldered to an application within 72 hours after opening the moisture barrier bag (MBB) it was stored in. As specified in the IPC/JEDEC J-STD-033 Standard, the manufacturing site processing the modules should have ambient temperatures below 30C and a relative humidity below 60%. 7.2.4.3 Baking Baking conditions are specified on the moisture sensitivity label attached to each MBB (see Figure 40 for details):

It is not necessary to bake PLS8-X/PLS8-V, if the conditions specified in Section 7.2.4.1 and Section 7.2.4.2 were not exceeded. It is necessary to bake PLS8-X/PLS8-V, if any condition specified in Section 7.2.4.1 and Section 7.2.4.2 was exceeded. If baking is necessary, the modules must be put into trays that can be baked to at least 125C. Devices should not be baked in tape and reel carriers at any temperature. Electrostatic Discharge 7.2.4.4 Electrostatic discharge (ESD) may lead to irreversible damage for the module. It is therefore advisable to develop measures and methods to counter ESD and to use these to control the electrostatic environment at manufacturing sites. Please refer to Section 6.9 for further information on electrostatic discharge. PLS8-X_PLS8-V_HD_v03.016 Confidential / Released 2015-12-09 Cinterion PLS8-X/PLS8-V Hardware Interface Description 7.3 Packaging 94 Page 90 of 105 7.3 Packaging Tape and Reel 7.3.1 The single-feed tape carrier for PLS8-X/PLS8-V is illustrated in Figure 36. The figure also shows the proper part orientation. The tape width is 44mm and the PLS8-X/PLS8-V modules are placed on the tape with a 40mm pitch. The reels are 330mm in diameter with 100mm hubs. Each reel contains 500 modules. 7.3.1.1 Orientation Figure 36: Carrier tape Figure 37: Roll direction PLS8-X_PLS8-V_HD_v03.016 Confidential / Released 2015-12-09 Cinterion PLS8-X/PLS8-V Hardware Interface Description 7.3 Packaging 94 Page 91 of 105 7.3.1.2 Barcode Label A barcode label provides detailed information on the tape and its contents. It is attached to the reel. Barcode label Figure 38: Barcode label on tape reel PLS8-X_PLS8-V_HD_v03.016 Confidential / Released 2015-12-09 Cinterion PLS8-X/PLS8-V Hardware Interface Description 7.3 Packaging 94 Page 92 of 105 7.3.2 Shipping Materials PLS8-X/PLS8-V is distributed in tape and reel carriers. The tape and reel carriers used to dis-

tribute PLS8-X/PLS8-V are packed as described below, including the following required ship-

ping materials:

Moisture barrier bag, including desiccant and humidity indicator card Transportation bag 7.3.2.1 Moisture Barrier Bag The tape reels are stored inside a moisture barrier bag (MBB), together with a humidity indica-

tor card and desiccant pouches - see Figure 39. The bag is ESD protected and delimits mois-

ture transmission. It is vacuum-sealed and should be handled carefully to avoid puncturing or tearing. The bag protects the PLS8-X/PLS8-V modules from moisture exposure. It should not be opened until the devices are ready to be soldered onto the application. Figure 39: Moisture barrier bag (MBB) with imprint The label shown in Figure 40 summarizes requirements regarding moisture sensitivity, includ-

ing shelf life and baking requirements. It is attached to the outside of the moisture barrier bag. PLS8-X_PLS8-V_HD_v03.016 Confidential / Released 2015-12-09 Cinterion PLS8-X/PLS8-V Hardware Interface Description 7.3 Packaging 94 Page 93 of 105 Figure 40: Moisture Sensitivity Label PLS8-X_PLS8-V_HD_v03.016 Confidential / Released 2015-12-09 Cinterion PLS8-X/PLS8-V Hardware Interface Description 7.3 Packaging 94 Page 94 of 105 MBBs contain one or more desiccant pouches to absorb moisture that may be in the bag. The humidity indicator card described below should be used to determine whether the enclosed components have absorbed an excessive amount of moisture. The desiccant pouches should not be baked or reused once removed from the MBB. The humidity indicator card is a moisture indicator and is included in the MBB to show the ap-

proximate relative humidity level within the bag. A sample humidity card is shown in Figure 41. If the components have been exposed to moisture above the recommended limits, the units will have to be rebaked. Figure 41: Humidity Indicator Card - HIC A baking is required if the humidity indicator inside the bag indicates 10% RH or more. 7.3.2.2 Transportation Box Tape and reel carriers are distributed in a box, marked with a barcode label for identification purposes. A box contains 2 reels with 500 modules each. PLS8-X_PLS8-V_HD_v03.016 Confidential / Released 2015-12-09 Cinterion PLS8-X/PLS8-V Hardware Interface Description 8 Sample Application 97 Page 95 of 105 8 Sample Application Figure 42 shows a typical example of how to integrate an PLS8-X/PLS8-V module with an ap-

plication. The PWR_IND line is an open collector that needs an external pull-up resistor which connects to the voltage supply VCC C of the microcontroller. Low state of the open collector pulls the PWR_IND signal low and indicates that the PLS8-X/PLS8-V module is active, high level notifies the Power Down mode. If the module is in Power Down mode avoid current flowing from any other source into the mod-

ule circuit, for example reverse current from high state external control lines. Therefore, the controlling application must be designed to prevent reverse flow. While developing SMT applications it is strongly recommended to provide test points for certain signals, i.e., lines to and from the module - for debug and/or test purposes. The SMT application should allow for an easy access to these signals. For details on how to implement test points see [3]. The EMC measures are best practice recommendations. In fact, an adequate EMC strategy for an individual application is very much determined by the overall layout and, especially, the po-

sition of components. Some LGA pads are connected to clocks or high speed data streams that might interfere with the modules antenna. The RF receiver would then be blocked at certain frequencies (self in-

terference). The external applications PCB tracks connected to these pads should therefore be well shielded or kept away from the antenna. This applies especially to the USB and UICC/

SIM interfaces. Depending on the micro controller used by an external application PLS8-X/PLS8-Vs digital in-

put and output lines may require level conversion. Section 8.1 shows a possible sample level conversion circuit. Disclaimer:

No warranty, either stated or implied, is provided on the sample schematic diagram shown in Figure 42 and the information detailed in this section. As functionality and compliance with na-

tional regulations depend to a great amount on the used electronic components and the indi-

vidual application layout manufacturers are required to ensure adequate design and operating safeguards for their products using PLS8-X/PLS8-V modules. PLS8-X_PLS8-V_HD_v03.016 Confidential / Released 2015-12-09 Cinterion PLS8-X/PLS8-V Hardware Interface Description 8 Sample Application 97 Page 96 of 105 PLS8x Current limiter

<60mA VGNSS VDDLP 10F

** See Section 3.8.1 for details on enhanced ESD protection Figure 42: PLS8-X/PLS8-V sample application PLS8-X_PLS8-V_HD_v03.016 Confidential / Released 2015-12-09 Cinterion PLS8-X/PLS8-V Hardware Interface Description 8.1 Sample Level Conversion Circuit 97 Page 97 of 105 8.1 Sample Level Conversion Circuit Depending on the micro controller used by an external application PLS8-X/PLS8-Vs digital in-

put and output lines (i.e., ASC0 lines) may require level conversion. The following Figure 43 shows a sample circuit with recommended level shifters for an external applications micro con-

troller (with VLOGIC between 3.0V...3.6V). The level shifters can be used for digital input and output lines with VOHmax=1.85V or VIHmax =1.85V. External application VLOGIC

(3.0V...3.6V) Input lines, e.g., RXD, CTS VCC Low level input Low level input Low level input Micro controller E.g., 74VHC1GT50 74LV1T34 VCC Output lines, e.g., TXD, RTS 5V tolerarant 5V tolerant E.g., 74LVC2G34 NC7WZ16 Figure 43: Sample level conversion circuit Wireless module Digital output lines, e.g., RXDx, CTSx VEXT (1.8V) Digital input lines, e.g., TXDx, RTSx PLS8-X_PLS8-V_HD_v03.016 Confidential / Released 2015-12-09 Cinterion PLS8-X/PLS8-V Hardware Interface Description 9 Reference Approval 100 Page 98 of 105 9 9.1 Reference Approval Reference Equipment for Type Approval The Gemalto M2M reference setup submitted to type approve PLS8-X/PLS8-V is shown in Fig-

ure 44. The module (i.e., the evaluation module) is connected to the DSB75 by means of a flex cable and a special DSB75 adapter. The GSM/UMTS/LTE test equipment is connected via edge mount SMA connectors soldered to the modules antenna pads. For ESD tests and evaluation purposes, it is also possible connect the module to the GSM/

UMTS/LTE test equipment through an SMA-to-Hirose-U.FL antenna cable and the SMA anten-

na connectors of the DSB75 adapter. A further option is to mount the evaluation module directly onto the DSB75 adapters 80-pin board-to-board connector and to connect the test equipment as shown below. Detail:

Edge mount SMA connectors manually soldered to antenna pads GNSS test equipm ent GSM /UM TS/LTE test equipm ent Evaluation m odule SMA to Hirose U.FL cable UM TS/LTE Rx Diversity/

M IM O GSM /UM TS/LTE USB cable Audio test equipment Votronic handset Uranus Evaluation module If using analog audio Standard 80 polig Flex USB SIM card holder ANT3 ANT2 ANT1 Audio Audio DSB75 adapter DSB75 COM1

(ASC0) Power GND PC Power supply Figure 44: Reference equipment for type approval PLS8-X_PLS8-V_HD_v03.016 Confidential / Released 2015-12-09 Cinterion PLS8-X/PLS8-V Hardware Interface Description 9.2 Compliance with FCC and IC Rules and Regulations 100 Page 99 of 105 9.2 Compliance with FCC and IC Rules and Regulations The Equipment Authorization Certification for the Gemalto M2M modules reference application described in Section 9.1 will be registered under the following identifiers:

PLS8-X:

PLS8-V:

FCC Identifier QIPPLS8-X Industry Canada Certification Number: 7830A-PLS8X Granted to Gemalto M2M GmbH FCC Identifier QIPPLS8-V Industry Canada Certification Number: 7830A-PLS8V Granted to Gemalto M2M GmbH Manufacturers of mobile or fixed devices incorporating PLS8-X/PLS8-V modules are autho-

rized to use the FCC Grants and Industry Canada Certificates of the PLS8-X/PLS8-V modules for their own final products according to the conditions referenced in these documents. In this case, the FCC label of the module shall be visible from the outside, or the host device shall bear a second label stating "Contains FCC ID: QIPPLS8-X" or "Contains FCC ID: QIPPLS8-V" and accordingly Contains IC: 7830A-PLS8X or Contains IC: 7830A-PLS8V. The integration is limited to fixed or mobile categorised host devices, where a separation distance between the antenna and any person of min. 20cm can be assured during normal operating conditions. For mobile and fixed operation configurations the antenna gain, including cable loss, must not exceed the limits listed in the following Table 30 for FCC and IC. Table 30: Antenna gain limits for FCC and IC Operational band1 Maximum gain in lower operational bands with f< 1GHz

(GSM850, WCDMA BdV, LTE Bd5 / Bd13 / Bd17 Maximum gain in higher operational bands with f=1700MHz

(WCDMA BdIV, LTE Bd4) Maximum gain in higher operational bands with f=1900MHz

(GSM1900, WCDMA BdII, LTE Band 2) FCC limit 3.25 IC limit 0.16 5.5 2.51 5.5 2.51 Unit dBi dBi dBi 1. Please note that the listed frequency bands apply as follows:

PLS8-X: LTE: Bd 2, 4, 5, 13 and 17; WCDMA Bd II, IV and V; GSM 850/1900MHz PLS8-V: LTE: Bd 2, 4 and 13 IMPORTANT:

Manufacturers of portable applications incorporating PLS8-X/PLS8-V modules are required to have their final product certified and apply for their own FCC Grant and Industry Canada Cer-

tificate related to the specific portable mobile. This is mandatory to meet the SAR requirements for portable mobiles (see Section 1.4 for detail). Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. PLS8-X_PLS8-V_HD_v03.016 Confidential / Released 2015-12-09 Cinterion PLS8-X/PLS8-V Hardware Interface Description 9.2 Compliance with FCC and IC Rules and Regulations 100 Page 100 of 105 Note: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules and with Industry Canada licence-exempt RSS standard(s). These limits are designed to provide reasonable protection against harmful inter-

ference in a residential installation. This equipment generates, uses and can radiate radio fre-

quency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

Reorient or relocate the receiving antenna. Connect the equipment into an outlet on a circuit different from that to which the receiver Increase the separation between the equipment and receiver. is connected. Consult the dealer or an experienced radio/TV technician for help. This Class B digital apparatus complies with Canadian ICES-003. If Canadian approval is requested for devices incorporating PLS8-X/PLS8-V modules the above note will have to be provided in the English and French language in the final user docu-

mentation. Manufacturers/OEM Integrators must ensure that the final user documentation does not contain any information on how to install or remove the module from the final product. PLS8-X_PLS8-V_HD_v03.016 Confidential / Released 2015-12-09 Cinterion PLS8-X/PLS8-V Hardware Interface Description 10 Appendix 104 Page 101 of 105 10 Appendix List of Parts and Accessories 10.1 Table 31: List of parts and accessories Description PLS8-X Supplier Gemalto M2M Standard module Ordering information Gemalto M2M IMEI:

Packaging unit (ordering) number: L30960-N3460-A300 Module label number: S30960-S3460-A300 PLS8-X Evaluation Module PLS8-V PLS8-V Evaluation Module DSB75 Support Box DSB75 adapter for mount-

ing the evaluation module Votronic handset for approval purposes Customer IMEI module Packaging unit (ordering) number: L30960-N3465-A300 Module label number: S30960-S3465-A300-1 Gemalto M2M Ordering number: L30960-N3461-A300 Gemalto M2M Standard module Gemalto M2M IMEI:

Packaging unit (ordering) number: L30960-N3470-A300 Module label number: S30960-S3470-A300-1 Gemalto M2M Ordering number: L30960-N3471-A300 Gemalto M2M Ordering number: L36880-N8811-A100 Gemalto M2M Ordering number: L30960-N2301-A100 Votronic /

Gemalto M2M Gemalto M2M ordering number: L36880-N8301-A107 Votronic ordering number: HH-SI-30.3/V1.1/0 Votronic Entwicklungs- und Produktionsgesellschaft fr elek-

tronische Gerte mbH Saarbrcker Str. 8 66386 St. Ingbert Germany Phone: +49-(0)6 89 4 / 92 55-0 Fax: +49-(0)6 89 4 / 92 55-88 Email: contact@votronic.com Ordering numbers: 91228 91236 Sales contacts are listed in Table 32. Sales contacts are listed in Table 32 and Table 33. SIM card holder incl. push button ejector and slide-in tray U.FL antenna connector Molex Hirose or Molex PLS8-X_PLS8-V_HD_v03.016 Confidential / Released 2015-12-09 Cinterion PLS8-X/PLS8-V Hardware Interface Description 10.1 List of Parts and Accessories 104 Page 102 of 105 Table 32: Molex sales contacts (subject to change) Molex For further information please click:

http://www.molex.com Molex China Distributors Beijing, Room 1311, Tower B, COFCO Plaza No. 8, Jian Guo Men Nei Street, 100005 Beijing P.R. China Phone: +86-10-6526-9628 Fax: +86-10-6526-9730 Molex Deutschland GmbH Otto-Hahn-Str. 1b 69190 Walldorf Germany Phone: +49-6227-3091-0 Fax: +49-6227-3091-8100 Email: mxgermany@molex.com Molex Singapore Pte. Ltd. 110, International Road Jurong Town, Singapore 629174 American Headquarters Lisle, Illinois 60532 U.S.A. Phone: +1-800-78MOLEX Fax: +1-630-969-1352 Molex Japan Co. Ltd. 1-5-4 Fukami-Higashi, Yamato-City, Kanagawa, 242-8585 Japan Phone: +65-6-268-6868 Fax: +65-6-265-6044 Phone: +81-46-265-2325 Fax: +81-46-265-2365 Table 33: Hirose sales contacts (subject to change) Hirose Ltd. For further information please click:

http://www.hirose.com Hirose Electric (U.S.A.) Inc 2688 Westhills Court Simi Valley, CA 93065 U.S.A. Phone: +1-805-522-7958 Fax: +1-805-522-3217 Hirose Electric Co., Ltd. 5-23, Osaki 5 Chome, Shinagawa-Ku Tokyo 141 Japan Hirose Electric Europe B.V. UK Branch:

First Floor, St. Andrews House, Caldecotte Lake Business Park, Milton Keynes MK7 8LE Great Britain Hirose Electric Europe B.V. German Branch:

Herzog-Carl-Strasse 4 73760 Ostfildern Germany Phone: +49-711-456002-1 Fax: +49-711-456002-299 Email: info@hirose.de Hirose Electric Europe B.V. Hogehillweg 8 1101 CC Amsterdam Z-O Netherlands Phone: +44-1908-369060 Fax: +44-1908-369078 Phone: +81-03-3491-9741 Fax: +81-03-3493-2933 Phone: +31-20-6557-460 Fax: +31-20-6557-469 PLS8-X_PLS8-V_HD_v03.016 Confidential / Released 2015-12-09 Cinterion PLS8-X/PLS8-V Hardware Interface Description 10.2 Mounting Advice Sheet 104 Page 103 of 105 10.2 Mounting Advice Sheet To prevent mechanical damage, be careful not to force, bend or twist the module. Be sure it is soldered flat against the host device (see also Section 7.2). The advice sheet on the next page shows a number of examples for the kind of bending that may lead to mechanical damage of the module (the module as part of an external application is integrated into a housing). PLS8-X_PLS8-V_HD_v03.016 Confidential / Released 2015-12-09 Cinterion PLS8-X/PLS8-V Hardware Interface Description 10.2 Mounting Advice Sheet 104 Page 104 of 105 PLS8-X_PLS8-V_HD_v03.016 Confidential / Released 2015-12-09 105 About Gemalto Gemalto (Euronext NL0000400653 GTO) is the world leader in digital security with 2014 annual revenues of 2.5 billion and blue-chip customers in over 180 countries. Our 14,000 employees operate out of 99 offices, 34 personalization and data centers, and 24 research and software development centers located in 46 countries. We are at the heart of the rapidly evolving digital society. Billions of people worldwide increasingly want the freedom to communicate, travel, shop, bank, entertain and work - anytime, everywhere

- in ways that are enjoyable and safe. Gemalto delivers on their expanding needs for personal mobile services, payment security, authenticated cloud access, identity and privacy protection, eHealthcare and eGovernment efficiency, convenient ticketing and dependable machine-to-

machine (M2M) applications. Gemalto develops secure embedded software and secure products which we design and personalize. Our platforms and services manage these secure products, the confidential data they contain and the trusted end-user services they enable. Our innovations enable our clients to offer trusted and convenient digital services to billions of individuals. Gemalto thrives with the growing number of people using its solutions to interact with the digital and wireless world. For more information please visit m2m.gemalto.com, www.facebook.com/gemalto, or Follow@gemaltom2m on twitter. Gemalto M2M GmbH St.-Martin-Str. 60 81541 Munich Germany M2M.GEMALTO.COM 3 1 0 2 l i r p A

. s e i r t n u o c i n a t r e c n i i d e r e t s g e r e r a d n a o t l a m e G f o s k r a m e c v r e s i d n a s k r a m e d a r t e r a

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. 0 2 SN#TECV4-XXYY-XXXXXX MAC#XX:XX:XX:XX:XX:XX FCC ID:2AL99-TECV4 IC:22779-TECV4 Artwork Location on product

 

 

Mr Brian Ham Principal Hardware Engineer 2030 Hamilton Place Blvd. Email: bham@doveresg.com The Heil Co. Suite 200 Chattanooga, TN 37421

(256) 304-2253 Date: 3-July-2017 Federal Communications Commission Authorization and Evaluation division Subject: Confidentiality Request for 3rd Eye Cam FCC ID: 2AL99-TECV4 Pursuant to 47 CRF 0.457(d) and 0.459, The Heil Co. requests that a part of the subject application be held confidential Type of Confidentiality requested Permanent Permanent Permanent Permanent Exhibit Type File name Block Diagram Schematic Diagrams Bill of Material Description of Circuit function Internal Photographs Users Manual Block Diagram_TECV4.pdf Schematic Diagrams_TECV4.pdf Bill of Material_TECV4.pdf Description of Circuit function_TECV4.pdf PICS_INTERNAL.zip 3EC Installation Manual V4.pdf Short-Term Short-Term The above materials contain proprietary information not customarily released to the public. The public disclosure of these matters might be harmful to the applicant and provide unjustified benefits to its competitors. Sincerely, The Heil Co. 2030 Hamilton Place Blvd. Suite 200 Chattanooga, TN 37421 United States Environmental Solutions Group 2030 Hamilton Place Blvd., Suite 200, Chattanooga, TN 37421 866.367.4345 Fax 423.855.3478

 

 

www.tuv.com Appendix 1 Prfbericht - Nr.:

Test Report No. 19660295 001 Seite 1 von 1 Page 1 of 1 Test Setup Test setup