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BMD-360 Stand-alone Bluetooth 5.1 low energy and IEEE 802.15.4 module Data sheet Abstract This technical data sheet describes the BMD-360 stand-alone Bluetooth low energy and IEEE 802.15.4 module. The OEMs can embed their own application on top of the integrated Bluetooth low energy stack using Nordic SDK integrated development environment (IDE). www.u-blox.com UBX-19039466 - R03 BMD-360 - Data sheet Document information Title Subtitle BMD-360 Stand-alone Bluetooth 5.1 low energy and IEEE 802.15.4 module Document type Data sheet Document number UBX-19039466 Revision and date R03 Disclosure restriction Product status Corresponding content status 21-Oct-2019 Functional sample Draft For functional testing. Revised and supplementary data will be published later. In development /
Prototype Objective specification Target values. Revised and supplementary data will be published later. Engineering sample Advance information Data based on early testing. Revised and supplementary data will be published later. Initial production Early production information Data from product verification. Revised and supplementary data may be published later. Production information Document contains the final product specification. Mass production /
End of life This document applies to the following products:
Product name Type number PCN reference BMD-360 BMD-360-A-R-00 N/A Product status Engineering Sample u-blox or third parties may hold intellectual property rights in the products, names, logos and designs included in this document. Copying, reproduction, modification or disclosure to third parties of this document or any part thereof is only permitted with the express written permission of u-blox. The information contained herein is provided as is and u-blox assumes no liability for its use. No warranty, either express or implied, is given, including but not limited to, with respect to the accuracy, correctness, reliability and fitness for a particular purpose of the information. This document may be revised by u-blox at any time without notice. For the most recent documents, visit www.u-blox.com. Copyright u-blox AG. UBX-19039466 - R03 Document information Page 2 of 31 BMD-360 - Data sheet Contents Document information ................................................................................................................................ 2 Contents .......................................................................................................................................................... 3 1 Functional description ......................................................................................................................... 5 1.1 Features ........................................................................................................................................................ 5 1.2 Applications ................................................................................................................................................. 5 1.3 Block diagram .............................................................................................................................................. 6 1.4 Radio performance ..................................................................................................................................... 6 2 Pin definition ........................................................................................................................................... 8 2.1 Pin assignment ............................................................................................................................................ 8 2.2 Peripheral pin assignments ...................................................................................................................... 9 3 Electrical specifications ................................................................................................................... 10 3.1 Absolute maximum ratings ....................................................................................................................10 3.2 Operating conditions ................................................................................................................................10 3.3 General purpose I/O ..................................................................................................................................10 3.4 Module reset ..............................................................................................................................................11 3.5 Debug and programming .........................................................................................................................11 3.6 Clocks ..........................................................................................................................................................11 3.6.1 32.768 kHz crystal (LFXO) (preliminary)......................................................................................12 3.6.2 32.768 kHz clock source comparison ...........................................................................................12 4 Firmware ................................................................................................................................................ 13 4.1 Factory image ............................................................................................................................................13 4.2 SoftDevices ................................................................................................................................................13 4.2.1 S113 ....................................................................................................................................................13 IEEE 802.15.4 (Thread and Zigbee) ..............................................................................................13 4.2.2 4.3 Bluetooth address .....................................................................................................................................13 5 Mechanical specifications ............................................................................................................... 14 5.1 Dimensions .................................................................................................................................................14 5.2 Recommended PCB land pads ...............................................................................................................14 5.3 Module marking .........................................................................................................................................15 6 RF design notes ................................................................................................................................... 16 6.1 Recommended RF layout and ground plane ........................................................................................16 6.2 Mechanical enclosure ...............................................................................................................................16 7 Antenna patterns ............................................................................................................................... 17 7.1 X-Y plane .....................................................................................................................................................17 7.2 Y-Z plane .....................................................................................................................................................18 7.3 Z-X plane .....................................................................................................................................................18 8 BMD-360 evaluation development kit ......................................................................................... 19 9 Qualification and approvals............................................................................................................. 20 9.1 United States (FCC) (pending approval) ..............................................................................................20 9.1.1 Labeling and user information requirements .............................................................................20 UBX-19039466 - R03 Contents Page 3 of 31 BMD-360 - Data sheet 9.1.2 RF exposure .......................................................................................................................................21 9.2 Canada (ISED) (pending approval) .........................................................................................................21 9.2.1 Labeling and user information requirements .............................................................................21 9.2.2 RF exposure .......................................................................................................................................22 9.3 Europe (CE-RED) (pending approval) ....................................................................................................22 9.3.1 Labeling and user information requirements .............................................................................22 9.4 Australia / New Zealand (RCM) (pending approval) ...........................................................................22 9.5 Bluetooth qualification (pending) ..........................................................................................................23 10 Environmental...................................................................................................................................... 24 10.1 RoHS ............................................................................................................................................................24 10.2 REACH .........................................................................................................................................................24 10.3 California proposition 65 (P65) ..............................................................................................................24 11 Product handling ................................................................................................................................. 25 11.1 Packaging ...................................................................................................................................................25 11.2 Reel packaging ...........................................................................................................................................25 11.3 Carrier tape dimensions ..........................................................................................................................25 11.4 Moisture sensitivity level .........................................................................................................................25 11.5 Reflow soldering ........................................................................................................................................26 12 Labeling and ordering information ............................................................................................... 27 12.1 Batch Label .................................................................................................................................................27 12.2 Multipack label...........................................................................................................................................27 12.3 Ordering information ................................................................................................................................28 13 Life support and other high-risk use warning ........................................................................... 29 Related documents ................................................................................................................................... 30 Revision history .......................................................................................................................................... 30 Contact .......................................................................................................................................................... 31 UBX-19039466 - R03 Contents Page 4 of 31 BMD-360 - Data sheet 1 Functional description
-40 C to +85 C Temperature Range IEEE 802.15.4 with Thread and Zigbee support The BMD-360 is a powerful, highly flexible, ultra-low power Bluetooth 5.1 and IEEE 802.15.4 (Thread and Zigbee) module based on the nRF52811 SoC from Nordic Semiconductor. With an Arm Cortex M4 CPU, embedded 2.4GHz transceiver, and integrated antenna, it provides a complete RF solution with no additional RF design, allowing faster time to market. Providing full use of the nRF52811s capabilities and peripherals, the BMD-360 can power demanding applications, while simplifying designs and reducing BOM costs. Angle of Arrival (AoA) and Angle of Departure (AoD) features of Bluetooth 5.1 are supported. With an internal DC-DC converter and intelligent power control, the BMD-360 provides class-leading power efficiency, enabling ultra-low power sensitive applications. Regulatory pre-approvals reduce the burden to enter the market. As a drop-in replacement for the BMD-300/301/330, the BMD-360 completes the BMD-300 Series lineup with an optimized peripheral set that is attractive for a wide range of cost-sensitive applications. 1.1 Features Based on the Nordic Semiconductor nRF52811 SoC Bluetooth 5.1 2M PHY, 1M PHY, Coded PHY (long range), CSA #2, AoA, AoD Complete RF solution with an integrated DC-DC converter Nordic Semiconductor SoftDevice ready Over-the-Air (OTA) firmware updates No external components required Arm Cortex-M4 32-bit processor 192 kB embedded flash memory 24 kB RAM 32 General Purpose I/O Pins 12-bit/200 KSPS ADC Serial Wire Debug (SWD) SPI Master/Slave (8 Mbps) 2-wire Master/Slave (I2C compatible) Footprint compatible with BMD-300, BMD-301, BMD-330, BMD-340, and BMD-341 UART (w/ CTS/RTS and DMA) Temperature sensor 20 channel CPU independent Programmable Peripheral Interconnect (PPI) Quadrature Demodulator (QDEC) 128-bit AES HW encryption 3 x 32 bit Timer / Counter 2 x 24 bit Real-Time Counter (RTC) Dimensions: 14 x 9.8 x 1.9mm 1.2 Applications Beacons iBeacon, Eddystone, AltBeacon, AoA, AoD Low-Power Sensors Fitness devices Wearables Climate Control Lighting Safety and Security Home Appliances UBX-19039466 - R03 Functional description Page 5 of 31 BMD-360 - Data sheet Interactive Entertainment Access Control Internet of Things Home Health Care Advanced Remote Controls Smart Energy Management Low-Power Sensor Networks Key Fobs Environmental Monitoring Hotel Automation Office Automation 1.3 Block diagram BMD-360 Bluetooth 5 Low Energy SoC Module nRF52811-QFAx 192kB Flash 24 kB RAM ARM Cortex-M4
@ 64MHz SWD Debug &
Programming Clock Management Real Time Counter x2 Accel Address Resolver AES ECB AES CCM Mode Encryption Random Number Gen Watchdog Timer Timer x3 TWI Master SPI Master UART TWI Slave SPI Slave 4ch PWM PDM Core LDO DC/DC Buck Regulator 2.4GHz Radio Multi-protocol l B a u n Matching Network Programmable Peripheral Interconnect GPIO Task Event Blocks Quadrature Decoder Temperature Sensor General Purpose Comparator 8-ch 12-bit ADC PCB Antenna DC-DC Inductor Bulk Capacitors Decoupling Capacitors GPIO x32
(Analog x8) 32 MHz Crystal Figure 1: Block diagram of BMD-360 1.4 Radio performance Detail Bluetooth Bluetooth version Description Bluetooth 5 Low Energy, Peripheral (S113), 2M PHY, 1M PHY, Coded PHY, CSA #2, AoA/AoD Bluetooth security AES-128 LE connections IEEE 802.15.4 Thread stack Thread security Zigbee stack Radio Frequency Concurrent peripheral roles (S113) OpenThread, Thread 1.1 compatible AES-128 Zigbee 3.0 compatible 2.360 GHz to 2.500 GHz UBX-19039466 - R03 Functional description Page 6 of 31 Detail Modulations Receiver sensitivity Antenna Current consumption BMD-360 - Data sheet Description GFSK at 1 Mbps and 2 Mbps, QPSK at 250 Kbps
-97 dBm (Bluetooth low energy 1M mode), -104 dBm (Coded PHY mode) Integrated (3 dBi peak) TX only @ +4 dBm, 0 dBm @ 3V, DCDC enabled 7.0 mA, 4.6 mA TX only @ +4 dBm, 0 dBm 15.4 mA, 10.1 mA RX only @ 1 Mbps @ 3V, DCDC enabled RX only @ 1 Mbps RX only @ 2 Mbps @ 3V, DCDC enabled RX only @ 2 Mbps CPU @ 64 MHz from flash, from RAM CPU @ 64 MHz from flash, from RAM @ 3 V, DCDC enabled System Off, On 4.6 mA 10.0 mA 5.2 mA 11.2 mA 4.2 mA, 4.0 mA 2.2 mA, 2.1 mA 0.3 A, 0.6 A Additional current for RAM retention 30 nA / 4 KB block Dimensions BMD-360 Hardware Interfaces Power supply Temperature range Certifications Length: 14.0 mm 0.3mm Width: 9.8 mm 0.3mm Height: 1.9 mm 0.1mm SPI Master/Slave x 2 UART Two-Wire Master/Slave (I2C) GPIO x 32 PWM PDM 1.7 V to 3.6 V
-40 C to +85 C USA (FCC) (Pending) Canada (IC) (Pending) Europe (CE) (Pending) Australia / New Zealand (RCM) (Pending) Bluetooth (Pending) FCC part 15.247 modular certification FCC ID: XPYBMD360 Industry Canada RSS-247 modular certification IC: 8595A-BMD360 EN 60950-1: A2:2013 3.1 (a): Health and Safety of the User EN 301 489-1 V2.1.1 & 3.1 (b): Electromagnetic Compatibility EN 301 489-17 V3.1.1 EN 300 328 V2.1.1 3.2: Effective use of spectrum allocated AS/NZS 4268:2017, Radio equipment and systems Short range devices BMD-360 BT5 RF-PHY Component (Tested) DID: Pending; QDID: Pending Export BMD-360 Nordic Semiconductor nRF52810 ECCN: 5A992.C, Exception 740.17(b)(1) HTS: 8473.30.1180 nRF52811 Product Specification nRF5 Software Development Kit UBX-19039466 - R03 Functional description Page 7 of 31 BMD-360 - Data sheet 2 Pin definition 2.1 Pin assignment The BMD-360 shares an identical pin-out with the BMD-300, BMD-301, and BMD-330. This pin-out is also a subset of the BMD-340/341 footprint, allowing a single design to support any of these modules. Figure 2: BMD-360 Pin assignment (Top view) No. Name I/O Description nRF52 pin Remarks Power Power Power Power Power Electrical Ground Electrical Ground Electrical Ground Electrical Ground Electrical Ground GPIO GPIO GPIO GPIO/AIN4 GPIO/AIN5 GPIO/AIN6 GPIO/AIN7 I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O 1 2 3 4 5 6 7 8 9 GND GND GND GND GND P0.25 P0.26 P0.27 P0.28 10 P0.29 11 12 13 14 15 16 17 P0.30 P0.31 P0.00 P0.01 P0.02 GND VCC P0.25 P0.26 P0.27 P0.28 P0.29 P0.30 P0.31 Standard drive, low frequency I/O only Standard drive, low frequency I/O only Standard drive, low frequency I/O only Pin is analog capable, standard drive, low frequency GPIO only Pin is analog capable, standard drive, low frequency GPIO only Pin is analog capable Pin is analog capable GPIO/XTAL1 (32.768 kHz) P0.00 GPIO/XTAL2 (32.768 kHz) P0.01 GPIO/AIN0 P0.02 Pin is analog capable Power Power Electrical Ground 1.7 V to 3.6 V VDD An internal 4.7 F bulk capacitor is included on the module. However, it is good design practice to add additional bulk capacitance as required for your application, i.e. those with heavy GPIO usage and/or current draw. 18 GND Power Electrical Ground UBX-19039466 - R03 Pin definition Page 8 of 31 No. Name 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 P0.03 P0.04 P0.05 P0.06 P0.07 P0.08 P0.09 P0.10 P0.11 P0.12 GND GND P0.13 P0.14 P0.15 P0.16 P0.17 P0.18 P0.19 P0.20 P0.21 P0.22 P0.23 P0.24 SWCLK SWDIO GND GND GND I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O Description GPIO/AIN1 GPIO/AIN2 GPIO/AIN3 GPIO GPIO GPIO GPIO GPIO GPIO GPIO Power Power Electrical Ground Electrical Ground I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I I/O GPIO GPIO GPIO GPIO GPIO GPIO GPIO GPIO GPIO/RESET_N GPIO GPIO GPIO SWD Clock SWD IO Power Power Power Electrical Ground Electrical Ground Electrical Ground BMD-360 - Data sheet nRF52 pin Remarks P0.03 P0.04 P0.05 P0.06 P0.07 P0.08 P0.09 P0.10 P0.11 P0.12 P0.13 P0.14 P0.15 P0.16 P0.17 P0.18 P0.19 P0.20 P0.21 P0.22 P0.23 P0.24 SWDCLK SWDIO Pin is analog capable Pin is analog capable Pin is analog capable Table 1: BMD-360 pin-out 2.2 Peripheral pin assignments The peripherals within the BMD-360 may be assigned to nearly any of the GPIO pins through the application. There are some restrictions called out by the nRF52811 product specification. See the Remarks in Table 1. Also note that certain peripherals are assigned to particular pins, such the analog inputs. UBX-19039466 - R03 Pin definition Page 9 of 31 BMD-360 - Data sheet 3 Electrical specifications Stressing the device above one or more of the ratings listed in the Absolute maximum rating section may cause permanent damage. These are stress ratings only. Operating the module at these or at any conditions other than those specified in the Operating conditions section of this document should be avoided. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Operating condition ranges define those limits within which the functionality of the device is guaranteed. Where application information is given, it is advisory only and does not form part of the specification. 3.1 Absolute maximum ratings Symbol VCC_MAX VIO_MAX VIO_MAX TS Description Voltage on supply pin Voltage on GPIO pins (VCC > 3.6V) Voltage on GPIO pins (VCC 3.6V) Storage Temperature Range Table 2: Absolute maximum ratings Min
-0.3
-0.3
-0.3
-40 Max 3.9 3.9 VCC + 0.3 V 125 Unit V V V C The product is not protected against overvoltage or reversed voltages. If necessary, voltage spikes exceeding the power supply voltage specification, given in table above, must be limited to values within the specified boundaries by using appropriate protection devices. 3.2 Operating conditions Unless otherwise specified, all operating condition specifications are at an ambient temperature of 25 C and a supply voltage of 3.3 V. Operation beyond the specified operating conditions is not recommended and extended exposure beyond them may affect device reliability. Symbol Parameter VCC TR_VCC TA Operating supply voltage Supply rise time (0 V to 1.7 V) Operating Ambient Temperature Range Table 3: Operating conditions Min 1.7
-
-40 Typ. 3.0
-
25 Max 3.6 60 85 Unit V ms C 3.3 General purpose I/O The general purpose I/O is organized as one port enabling access and control of the 32 available GPIO pins through one port. Each GPIO can be accessed individually with the following user configurable features:
Input/output direction Output drive strength Wake-up from high- or low-level triggers on all pins Trigger interrupt on all pins Internal pull-up and pull-down resistors UBX-19039466 - R03 Electrical specifications Page 10 of 31 BMD-360 - Data sheet All pins can be used by the PPI task/event system; the maximum number of pins that can be interfaced through the PPI at the same time is limited by the number of GPIOTE channels All pins can be individually configured to carry serial interface or quadrature demodulator signals Symbol Parameter Max. Unit Min. Typ. VIH VIL VOH VOL RPU RPD Table 4: GPIO Input High Voltage Input Low Voltage Output High Voltage Output Low Voltage Pull-up Resistance Pull-down Resistance 0.7 x VCC GND VCC 0.4 GND 11 11
-
-
-
-
13 13 VCC 0.3 x VCC VCC GND + 0.4 16 16 V V V V k k 3.4 Module reset GPIO pin P0.21 may be used for a hardware reset. In order to utilize P0.21 as a hardware reset, the UICR registers PSELRESET[0] and PSELRESET[1] must be set alike, to the value of 0x7FFFFF15. When P0.21 is programmed as RESET, the internal pull-up is automatically enabled. Nordic Semiconductor example applications and development kits program P0.21 as RESET. 3.5 Debug and programming The BMD-360 series supports the two pin Serial Wire Debug (SWD) interface and offers flexible and powerful mechanism for non-intrusive debugging of program code. Breakpoints, single stepping, and instruction trace capture of code execution flow are part of this support. The BMD-360 also supports ETM and ITM trace. The trace data from the ETM and the ITM is sent to an external debugger via a 4-bit wide parallel trace port. In addition to parallel trace, the TPIU supports serial trace via the Serial Wire Output (SWO) trace protocol. 3.6 Clocks The BMD-360 requires two clocks, a high frequency clock and a low frequency clock. The high frequency clock is provided on-module by a high-accuracy 32 MHz crystal as required by the nRF52811 for radio operation. The low frequency clock can be provided internally by an RC oscillator or synthesized from the fast clock, or externally by a 32.768 kHz crystal. An external crystal provides the lowest power consumption and greatest accuracy. Using the internal RC oscillator with calibration provides acceptable performance for Bluetooth low energy applications at a reduced cost and slight increase in power consumption. The ANT protocol requires the use of an external crystal. fTOL_LFXO_BLE and fTOL_LFXO_ANT are the maximum allowed for Bluetooth low energy and ANT applications. Actual tolerance depends on the crystal used. UBX-19039466 - R03 Electrical specifications Page 11 of 31 BMD-360 - Data sheet 3.6.1 32.768 kHz crystal (LFXO) (preliminary) Symbol Parameter FNOM_LFXO Crystal frequency FTOL_LFXO_BLE fTOL_LFXO_ANT CL_LFXO C0_LFXO RS_LFXO Cpin Frequency tolerance, Bluetooth low energy applications Frequency Tolerance, ANT applications Load Capacitance Shunt Capacitance Equivalent series resistance Input Capacitance on XL1 & XL2 pads Typ. Max. 32.768
-
-
-
-
-
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4 500 50 12.5 2 100
-
Unit kHz ppm ppm pF pF k pF Table 5: 32.768 kHz Crystal (LFXO) 3.6.2 32.768 kHz clock source comparison Symbol Parameter fTOL_LFXO_BLE Frequency Tolerance, 32.768 kHz Crystal Oscillator (Bluetooth low energy Stack) fTOL_LFXO_ANT Frequency Tolerance, 32.768 kHz Crystal Oscillator (ANT Stack) f TOL_LFRC Frequency Tolerance, 32.768 kHz RC Oscillator fTOL_CAL_LFRC Frequency tolerance, 32.768 kHz RC after calibration fTOL_LFSYNT Frequency Tolerance, 32.768 kHz Synthesized Oscillator Min. Typ.
-
-
-
-
-
-
-
-
-
-
Max. 250 50 2 500 8 Unit ppm ppm
%
ppm ppm Table 6 32.768 kHz Clock source comparison UBX-19039466 - R03 Electrical specifications Page 12 of 31 BMD-360 - Data sheet 4 Firmware u-blox recommends that projects for the BMD-360 utilize Nordic Semiconductors SDK, DFU, and examples and the nRF52811 tools for any new development. This will allow access to the very latest Bluetooth support from Nordic Semiconductor and provide an ongoing path as new features are released. 4.1 Factory image The BMD-360 module is not loaded with a factory firmware image. 4.2 SoftDevices Nordic Semiconductor protocol stacks are known as SoftDevices. SoftDevices are pre-compiled, pre-linked binary files. SoftDevices can be programmed in nRF52 series SoCs and are downloadable from the Nordic Semiconductor website. The BMD-360 with the nRF52811 SoC supports the S113
(Bluetooth low energy Peripheral) SoftDevices. 4.2.1 S113 The S113 SoftDevice is a Bluetooth low energy peripheral protocol stack solution. It supports up to four peripheral connections with an additional broadcaster role running concurrently. The S113 SoftDevice integrates a Bluetooth low energy Controller and Host and provides a full and flexible API for building Bluetooth low energy nRF52 System on Chip (SoC) solutions. 4.2.2 IEEE 802.15.4 based protocols, such as Thread and Zigbee, on the BMD-360 are not implemented using a SoftDevice. Nordic Semiconductor provides an IEEE 802.15.4 compliant MAC stack which does not require a SoftDevice to be loaded to operate. Nordic Semiconductor also provides pre-compiled Thread and Zigbee stacks. See the Nordic Semiconductor SDK for more information on developing applications that utilize IEEE 802.15.4. Both allow for concurrent operation with Bluetooth low energy SoftDevices. 4.3 Bluetooth address The BMD-360 modules are preprogrammed from the factory with a unique public Bluetooth address stored in the UICR. The Bluetooth address is the Organizationally Unique Identifier (94:54:93) combined with the six characters that are printed on a 2D barcode and in human-readable text on the module label, as described in section 5.3. IEEE 802.15.4 (Thread and Zigbee) UICR Register Address Description NRF_UICR + 0x80 0x10001080 Bluetooth_addr [0] (0xCC) NRF_UICR + 0x81 0x10001081 Bluetooth_addr [1] (0xBB) NRF_UICR + 0x82 0x10001082 Bluetooth_addr [2] (0xAA) NRF_UICR + 0x83 0x10001083 Bluetooth_addr [3] (0xEB) NRF_UICR + 0x84 0x10001084 Bluetooth_addr [4] (0x1D) NRF_UICR + 0x85 0x10001085 Bluetooth_addr [5] (0x6C) Table 7: Bluetooth address UBX-19039466 - R03 Firmware Page 13 of 31 BMD-360 - Data sheet 5 Mechanical specifications 5.1 Dimensions Figure 3: BMD-360 mechanical drawing 5.2 Recommended PCB land pads Figure 4: Recommended PCB land pads The RF Keep-out area extends vertically to the board edge. UBX-19039466 - R03 Mechanical specifications Page 14 of 31 BMD-360 - Data sheet 5.3 Module marking The labels of the BMD-360 modules include important product information as described in this section. Figure 5 illustrates the label of the BMD-360 modules, which includes the u-blox logo, product version, product name, Bluetooth address, and certification numbers. 2 1 3 4 Figure 5: Module marking Reference Description 1 2 3 4 Date of unit production (year/week) Product version Product name Data Matrix (QR code) with unique serial number of six alphanumeric symbols, also in human-readable form. The full Bluetooth address consists of the IEEE OUI (94:54:93) with the six symbols appended:
94:54:93:AA:BB:CC Table 8: BMD-360 label description UBX-19039466 - R03 Mechanical specifications Page 15 of 31 BMD-360 - Data sheet 6 RF design notes 6.1 Recommended RF layout and ground plane For the BMD-360, the integrated antenna requires a suitable ground plane to radiate effectively. The area under and extending out from the antenna portion of the module should be kept clear of copper and other metal. The module should be placed at the edge of the PCB with the antenna edge facing out. Reducing the ground plane from that shown in Figure 6 will reduce the effective radiated power. For example, a 27 mm x 29 mm board (about the size of a coin cell) has approximately 3dB lower output than the BMD-360 Evaluation Board. These RF guidelines for the BMD-360 are the same as the BMD-300 module. Designs incorporating the BMD-300 will have similar RF performance with the BMD-360 module. Figure 6: Recommended RF layout and ground plane for BMD-360 6.2 Mechanical enclosure Care should be taken when designing and placing the BMD-360 module into an enclosure. Metal should be kept clear from the antenna area, both above and below. Any metal around the module can negatively impact RF performance. The module is designed and tuned for the antenna and RF components to be in free air. Any potting, epoxy fill, plastic over-molding, or conformal coating can negatively impact RF performance and must be evaluated by the customer. UBX-19039466 - R03 RF design notes Page 16 of 31 BMD-360 - Data sheet 7 Antenna patterns Antenna patterns are based on the BMD-300 Evaluation Kit with a ground plane size of 82 mm x 56 mm. The BMD-300 module was replaced with a BMD-360 module. The X-Y-Z orientation is shown in Figure 7:
Figure 7: BMD-360 Evaluation kit X -Y-Z orientation 7.1 X-Y plane X Y Figure 8: X-Y Plane Antenna Pattern The outer-most ring is +5 dB. Each division is -5 dB UBX-19039466 - R03 Antenna patterns Page 17 of 31 7.2 Y-Z plane BMD-360 - Data sheet Y Z Figure 9: Y-Z Plane Antenna Pattern The outer-most ring is +5 dB. Each division is -5 dB. 7.3 Z-X plane Z X Figure 10: Z-X Plane Antenna Pattern The outer-most ring is +5 dB. Each division is -5 dB. UBX-19039466 - R03 Antenna patterns Page 18 of 31 BMD-360 - Data sheet 8 BMD-360 evaluation development kit The BMD-360-EVAL is a full featured evaluation board that provides a complete I/O pin out to headers, on-board programming and debugging, 32.768 kHz crystal, power & virtual COM port over USB, four user LEDs, and four user buttons. The evaluation boards also provide the option to be powered from a CR2032 coin cell battery and have current sense resistors and headers to allow for convenient current measurements. An Arduino Uno R3 style header is provided for easy prototyping of additional functions. The evaluation boards also support programming off-board BMD-300 Series modules. Figure 11: BMD-360 evaluation board UBX-19039466 - R03 BMD-360 evaluation development kit Page 19 of 31 BMD-360 - Data sheet 9 Qualification and approvals 9.1 United States (FCC) (pending approval) The BMD-360 module has received Federal Communications Commission
(FCC) CFR47 Telecommunications, Part 15 Subpart C Intentional Radiators modular approval in accordance with Parts 15.212 and 15.247. The modular approval allows the end user to integrate the module into a finished product without obtaining subsequent and separate FCC approvals for intentional radiation, provided no changes or modifications are made to the module circuitry. Changes or modifications could void the users authority to operate the equipment. The end user must comply with all of the instructions provided by the Grantee, which indicate installation and/or operating conditions necessary for compliance. The finished product is required to comply with all applicable FCC equipment authorizations regulations, requirements and equipment functions not associated with the transmitter module portion. For example, compliance must be demonstrated to regulations for other transmitter components within the host product; to requirements for unintentional radiators (Part 15 Subpart B Unintentional Radiators), such as digital devices, computer peripherals, radio receivers, etc.; and to additional authorization requirements for the non-transmitter functions on the transmitter module
(that is, Verification, or Declaration of Conformity) (for example, transmitter modules may also contain digital logic functions) as appropriate. Modification to this product will void the users authority to operate this equipment. The OEM is still responsible for verifying end product compliance with FCC Part 15, subpart B limits for unintentional radiators through an accredited test facility. KDB 996369 D03 sections 2.4 (limited module procedures) and 2.5 (trace antenna designs) are not applicable to the BMD-360. 9.1.1 Labeling and user information requirements The BMD-360 is assigned the FCC ID number: XPYBMD360 If the FCC ID is not visible when the module is installed inside another device, then the outside of the finished product into which the module is installed must also display a label referring to the enclosed module. This exterior label can use the following or similar wording:
Contains FCC ID: XPYBMD360 In addition to marking the product with the appropriate FCC ID, the end product shall bear the following statement in a conspicuous location on the device (FCC Rules, Title 47, Subchapter A, Part 15, Subpart B, Chapter 15.19):
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. When the device is so small or for such use that it is impracticable to label it with the statement specified above in a font that is four-point or larger, and the device does not have a display that can show electronic labeling, then the information required by this paragraph shall be placed in the user manual and must also either be placed on the device packaging or on a removable label attached to the device. The user manual may also require specific information based on the digital device classification. Refer to the FCC Rules, Title 47, Subchapter A, Part 15, Subpart B, Chapter 15.105 for specific wording of these notices. UBX-19039466 - R03 Qualification and approvals Page 20 of 31 BMD-360 - Data sheet 9.1.2 RF exposure All transmitters regulated by FCC must comply with RF exposure requirements. KDB 447498 General RF Exposure Guidance provides guidance in determining whether proposed or existing transmitting facilities, operations or devices comply with limits for human exposure to Radio Frequency (RF) fields adopted by the Federal Communications Commission (FCC). This module is approved for installation into mobile and/or portable host platforms and must not be co-located or operating in conjunction with any other antenna or transmitter except in accordance with FCC multi-transmitter guidelines. End users must be provided with transmitter operating conditions for satisfying RF Exposure compliance. 9.2 Canada (ISED) (pending approval) The BMD-360 module is certified for use in Canada under Innovation, Science and Economic Development Canada (ISED) Radio Standards Specification (RSS) RSS-247 Issue 2 and RSSGen. 9.2.1 Labeling and user information requirements The BMD-360 is assigned the IC ID number: 8595A-BMD360 Labeling Requirements for the Host Device (from Section 3.2.1, RSS-Gen, Issue 3, December 2010):
The host device shall be properly labeled to identify the module within the host device. The Industry Canada certification label of a module shall be clearly visible at all times when installed in the host device, otherwise the host device must be labeled to display the Industry Canada certification number of the module, preceded by the words Contains transmitter module, or the word Contains, or similar wording expressing the same meaning, as follows:
Contains transmitter module IC: 8595A-BMD360 User Manual Notice for License-Exempt Radio Apparatus (from Section 7.1.3 RSS-Gen, Issue 3, December 2010): User manuals for license-exempt radio apparatus shall contain the following or equivalent notice in a conspicuous location in the user manual or alternatively on the device or both:
This device contains licence-exempt transmitter(s)/receiver(s) that comply with Innovation, Science and Economic Development Canadas licence-exempt RSS(s). Operation is subject to the following two conditions:
1. This device may not cause interference. 2. This device must accept any interference, including interference that may cause undesired operation of the device. Lmetteur/rcepteur exempt de licence contenu dans le prsent appareil est conforme aux CNR dInnovation, Sciences et Dveloppement conomique Canada applicables aux appareils radio exempts de licence. Lexploitation est autorise aux deux conditions suivantes :
1. Lappareil ne doit pas produire de brouillage;
2. Lappareil doit accepter tout brouillage radiolectrique subi, mme si le brouillage est susceptible den compromettre le fonctionnement. Transmitter Antenna (from Section 7.1.2 RSS-Gen, Issue 3, December 2010): User manuals for transmitters shall display the following notice in a conspicuous location:
Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser) gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for successful communication. Conformment la rglementation d'Industrie Canada, le prsent metteur radio peut fonctionner avec une antenne d'un type et d'un gain maximal (ou infrieur) approuv pour l'metteur par Industrie Canada. Dans le but de rduire les risques de brouillage radiolectrique l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la UBX-19039466 - R03 Qualification and approvals Page 21 of 31 BMD-360 - Data sheet puissance isotrope rayonne quivalente (p.i.r.e.) ne dpasse pas l'intensit ncessaire l'tablissement d'une communication satisfaisante. 9.2.2 RF exposure All transmitters regulated by IC must comply with RF exposure requirements listed in RSS-102 - Radio Frequency (RF) Exposure Compliance of Radio communication Apparatus (All Frequency Bands). This module is approved for installation into mobile and/or portable host platforms and must not be co-
located or operating in conjunction with any other antenna or transmitter except in accordance with Industry Canada's multi-transmitter guidelines. End users must be provided with transmitter operating conditions for satisfying RF Exposure compliance. 9.3 Europe (CE-RED) (pending approval) The BMD-360 is a Radio Equipment Directive assessed radio module that is CE complaint and have been manufactured and tested with the intention of being integrated into a final product. The BMD-360 has been tested to current Radio Equipment Directives EN 60950-1: 2006 + A11: 2009 + A1: 2010 + A12: 2011 + A2: 2013 ETSI EN 300 328 V 2.1.1 ETSI EN 301 489-1 V2.1.1 ETSI EN 301 489-17 V3.1.1 The Radio Equipment Directive Compliance Association (RED-CA) provides guidance on modular devices at the RED-CA website: http://www.redca.eu/Pages/Documents%201.htm. 9.3.1 Labeling and user information requirements The label on the final products which contain a BMD-360 module must follow CE marking requirements. The R&TTE Compliance Association Technical Guidance Note 01 provides guidance on final product CE marking. 9.4 Australia / New Zealand (RCM) (pending approval) The BMD-360 has been tested to comply with the AS/NZS 4268:2017, Radio equipment and systems Short range devices Limits and methods of measurement. The report may be obtained from your local FAE, and may be used as evidence in obtaining permission to use the Regulatory Compliance Mark (RCM). Information on registration as a Responsible Party, license and labeling requirements may be found at the following websites:
Australia: http://www.acma.gov.au/theACMA/radiocommunications-short-range-devices-standard-
2004 New Zealand: http://www.rsm.govt.nz/compliance Only Australian-based and New Zealand-based companies who are registered may be granted permission to use the RCM. An Australian-based or New Zealand-based agent or importer may also register as a Responsible Party to use the RCM on behalf of a company not in Australia or New Zealand. UBX-19039466 - R03 Qualification and approvals Page 22 of 31 BMD-360 - Data sheet 9.5 Bluetooth qualification (pending) The Bluetooth SIG maintains the Bluetooth Specification, and ensures that products are properly tested and comply with the Bluetooth license agreements. Companies that list products with the Bluetooth SIG are required to be members of the SIG and submit the listed fees. Refer to this link for details: https://www.bluetooth.com/develop-with-bluetooth/qualification-listing The BMD-360 Bluetooth Low Energy module based on the Nordic Semiconductor nRF52811 is listed as a Tested Component, with Qualified Design IDs (QDID) (Pending). This allows an end-product based on a BMD-360 module to inherit the component listings without the need to run through all of the tests again. The end-product will often inherit several QDIDs, and are identified on a Declaration of Compliance. The BMD-360 primarily utilizes the 113 SoftDevice UBX-19039466 - R03 Qualification and approvals Page 23 of 31 BMD-360 - Data sheet 10 Environmental 10.1 RoHS The BMD-360 module is in compliance with Directive 2011/65/EU, 2015/863/EU of the European Parliament and the Council on the restriction of the use of certain hazardous substances in electrical and electronic equipment. 10.2 REACH Rigados modules listed below do not contain the 201 SVHC (Substance of Very High Concern), as defined by Directive EC/1907/2006 Article according to REACH Annex XVII. 10.3 California proposition 65 (P65) This product can expose you to Nickel (metallic), which is known to the State of California to cause cancer. For more information go to www.P65Warnings.ca.gov. Warnings are not required where the listed chemical is inaccessible to the average user of the end product. UBX-19039466 - R03 Environmental Page 24 of 31 BMD-360 - Data sheet 11 Product handling 11.1 Packaging 11.2 Reel packaging Modules are packaged on 330 mm reels loaded with 1000 modules. Each reel is placed in an antistatic bag with a desiccant pack and humidity card and placed in a 340 x 350 x 65 mm box. An antistatic warning and reel label are adhered to the outside of the bag. Figure 12 Reel cartons 11.3 Carrier tape dimensions Figure 13 Carrier tape dimensions 11.4 Moisture sensitivity level The BMD-360 is rated for MSL 3, 168-hour floor life after opening. UBX-19039466 - R03 Product handling Page 25 of 31 BMD-360 - Data sheet 11.5 Reflow soldering Figure 14: Reflow profile for lead free solder UBX-19039466 - R03 Product handling Page 26 of 31 BMD-360 - Data sheet 12 Labeling and ordering information 12.1 Batch Label Figure 15 shows an example of the layout and contents of the batch label. The label is affixed to reels, sealed bags, and individual packing cartons (inner cartons). Figure 15: Batch label example 12.2 Multipack label Figure 16 shows an example of the layout and contents of the multipack label. The label is affixed to shipping parcels (outer cartons). UBX-19039466 - R03 Labeling and ordering information Page 27 of 31 BMD-360 - Data sheet Figure 16: Multipack label example 12.3 Ordering information Ordering Code Product BMD-360-A-R BMD-360 module, Rev A, Tape & Reel, 1000 piece multiples BMD-360-Evaluation kit BMD-360 Evaluation Kit w/ SEGGER J-Link-OB debug probe Table 9: Product ordering codes UBX-19039466 - R03 Labeling and ordering information Page 28 of 31 BMD-360 - Data sheet 13 Life support and other high-risk use warning This product is not designed nor intended for use in a life support device or system, nor for use in other fault-intolerant, hazardous or other environments requiring fail-safe performance, such as any application in which the failure or malfunction of the product could lead directly or indirectly to death, bodily injury, or physical or property damage (collectively, High-Risk Environments). u-blox expressly disclaims any express or implied warranty of fitness for use in high-risk environments. The customer using this product in a High-Risk Environment agrees to indemnify and defend u-blox from and against any claims and damages arising out of such use. UBX-19039466 - R03 Life support and other high-risk use warning Page 29 of 31 BMD-360 - Data sheet Related documents
[1] Nordic Semiconductor, nRF52811 Product Specification
[2] Nordic Semiconductor, nRF5 Software Development Kit For regular updates to u-blox documentation and to receive product change notifications, register on our homepage (www.u-blox.com). Revision history Revision Date Name Comments 0.5 0.6 15-Apr-2019 01-Jul-2019 R03 21-Oct-2019 Preliminary release for engineering. Corrected typos. Updated Nordic Semiconductor documentation link. Updated images. Document converted from Rigado BMD-360 data sheet to u-blox BMD-360 data sheet. UBX-19039466 - R03 Related documents Page 30 of 31 Contact BMD-360 - Data sheet For complete contact information, visit us at www.u-blox.com. u-blox Offices North, Central and South America Headquarters Asia, Australia, Pacific Europe, Middle East, Africa u-blox AG Phone: +41 44 722 74 44 E-mail:
info@u-blox.com Support: support@u-blox.com u-blox America, Inc. Phone: +1 703 483 3180 E-mail:
info_us@u-blox.com Regional Office West Coast:
Phone: +1 408 573 3640 E-mail:
info_us@u-blox.com Technical Support:
Phone: +1 703 483 3185 E-mail: support@u-blox.com u-blox Singapore Pte. Ltd. Phone: +65 6734 3811 E-mail:
Support: support_ap@u-blox.com info_ap@u-blox.com Regional Office Australia:
Phone: +61 2 8448 2016 E-mail:
Support: support_ap@u-blox.com info_anz@u-blox.com Regional Office China (Beijing):
Phone: +86 10 68 133 545 E-mail:
Support: support_cn@u-blox.com info_cn@u-blox.com Regional Office China (Chongqing):
Phone: +86 23 6815 1588 E-mail:
Support: support_cn@u-blox.com info_cn@u-blox.com Regional Office China (Shanghai):
Phone: +86 21 6090 4832 E-mail:
Support: support_cn@u-blox.com info_cn@u-blox.com Regional Office China (Shenzhen):
Phone: +86 755 8627 1083 E-mail:
info_cn@u-blox.com Support: support_cn@u-blox.com Regional Office India:
Phone: +91 80 405 092 00 E-mail:
info_in@u-blox.com Support: support_in@u-blox.com Regional Office Japan (Osaka):
Phone: +81 6 6941 3660 E-mail:
Support: support_jp@u-blox.com info_jp@u-blox.com Regional Office Japan (Tokyo):
Phone: +81 3 5775 3850 E-mail:
Support: support_jp@u-blox.com info_jp@u-blox.com Regional Office Korea:
Phone: +82 2 542 0861 E-mail:
Support: support_kr@u-blox.com info_kr@u-blox.com Regional Office Taiwan:
Phone: +886 2 2657 1090 E-mail:
Support: support_tw@u-blox.com info_tw@u-blox.com UBX-19039466 - R03 Contact Page 31 of 31
1 | External Photos | External Photos | 574.32 KiB | November 12 2019 |
External Photos TOP VIEW OF EUT BOTTOM VIEW OF EUT FRONT VIEW OF EUT BACK VIEW OF EUT LEFT VIEW OF EUT RIGHT VIEW OF EUT
1 | Internal Photos | Internal Photos | 469.89 KiB | November 12 2019 |
Internal Photos OPEN VIEW OF EUT INTERNAL VIEW OF EUT-1 INTERNAL VIEW OF EUT-2 Antenna
frequency | equipment class | purpose | ||
---|---|---|---|---|
1 | 2019-12-11 | 2402 ~ 2480 | DTS - Digital Transmission System | Original Equipment |
app s | Applicant Information | |||||
---|---|---|---|---|---|---|
1 | Effective |
2019-12-11
|
||||
1 | Applicant's complete, legal business name |
u-blox AG
|
||||
1 | FCC Registration Number (FRN) |
0019077858
|
||||
1 | Physical Address |
Zuercherstrasse 68
|
||||
1 |
Thalwil, N/A
|
|||||
1 |
Switzerland
|
|||||
app s | TCB Information | |||||
1 | TCB Application Email Address |
T******@intertek.com
|
||||
1 | TCB Scope |
A4: UNII devices & low power transmitters using spread spectrum techniques
|
||||
app s | FCC ID | |||||
1 | Grantee Code |
XPY
|
||||
1 | Equipment Product Code |
BMD360
|
||||
app s | Person at the applicant's address to receive grant or for contact | |||||
1 | Name |
G******** C********
|
||||
1 | Title |
Certification Manager
|
||||
1 | Telephone Number |
+3904********
|
||||
1 | Fax Number |
+3904********
|
||||
1 |
g******@u-blox.com
|
|||||
app s | Technical Contact | |||||
1 | Firm Name |
Attestation of Global Compliance (SZ) Co., Ltd
|
||||
1 | Name |
Y**** Z******
|
||||
1 | Physical Address |
2F.,No.2 Bldg, Huafeng No.1 Technical Ind. Park
|
||||
1 |
Shenzhen
|
|||||
1 |
China
|
|||||
1 | Telephone Number |
86-75********
|
||||
1 | Fax Number |
86-75********
|
||||
1 |
c******@agc-cert.com
|
|||||
app s | Non Technical Contact | |||||
1 | Firm Name |
Attestation of Global Compliance (SZ) Co., Ltd
|
||||
1 | Name |
Y**** Z********
|
||||
1 | Physical Address |
2F.,No.2 Bldg, Huafeng No.1 Technical Ind. Park
|
||||
1 |
Shenzhen
|
|||||
1 |
China
|
|||||
1 | Telephone Number |
86-75********
|
||||
1 | Fax Number |
86-75********
|
||||
1 |
c******@agc-cert.com
|
|||||
app s | Confidentiality (long or short term) | |||||
1 | Does this application include a request for confidentiality for any portion(s) of the data contained in this application pursuant to 47 CFR § 0.459 of the Commission Rules?: | Yes | ||||
1 | Long-Term Confidentiality Does this application include a request for confidentiality for any portion(s) of the data contained in this application pursuant to 47 CFR § 0.459 of the Commission Rules?: | No | ||||
if no date is supplied, the release date will be set to 45 calendar days past the date of grant. | ||||||
app s | Cognitive Radio & Software Defined Radio, Class, etc | |||||
1 | Is this application for software defined/cognitive radio authorization? | No | ||||
1 | Equipment Class | DTS - Digital Transmission System | ||||
1 | Description of product as it is marketed: (NOTE: This text will appear below the equipment class on the grant) | BMD-360 | ||||
1 | Related OET KnowledgeDataBase Inquiry: Is there a KDB inquiry associated with this application? | No | ||||
1 | Modular Equipment Type | Single Modular Approval | ||||
1 | Purpose / Application is for | Original Equipment | ||||
1 | Composite Equipment: Is the equipment in this application a composite device subject to an additional equipment authorization? | No | ||||
1 | Related Equipment: Is the equipment in this application part of a system that operates with, or is marketed with, another device that requires an equipment authorization? | No | ||||
1 | Grant Comments | The output power listed is conducted. Co-location of this module with other transmitters that operate simultaneously are required to be evaluated using the FCC multi-transmitter procedures. The module grantee is responsible for providing the documentation to the system integrator on restrictions of use, for continuing compliance of the module. The host integrator installing this module into their product must follow the integration instructions provided by the module manufacturer and must ensure that the final composite product complies with the FCC requirements by a technical assessment or evaluation to the FCC rules, including the transmitter operation and should refer to guidance in KDB 996369. | ||||
1 | Is there an equipment authorization waiver associated with this application? | No | ||||
1 | If there is an equipment authorization waiver associated with this application, has the associated waiver been approved and all information uploaded? | No | ||||
app s | Test Firm Name and Contact Information | |||||
1 | Firm Name |
Attestation of Global Compliance (Shenzhen) Co., L
|
||||
1 | Name |
D**** L********
|
||||
1 | Telephone Number |
+86-7********
|
||||
1 |
d******@agc-cert.com
|
|||||
Equipment Specifications | |||||||||||||||||||||||||||||||||||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Line | Rule Parts | Grant Notes | Lower Frequency | Upper Frequency | Power Output | Tolerance | Emission Designator | Microprocessor Number | |||||||||||||||||||||||||||||||||
1 | 1 | 15C | 2402.00000000 | 2480.00000000 | 0.0016200 |
some individual PII (Personally Identifiable Information) available on the public forms may be redacted, original source may include additional details
This product uses the FCC Data API but is not endorsed or certified by the FCC