FCC ID: XPYNINAW106 NINA-W1

NINA-W1 series Stand-alone Wi-Fi, Bluetooth and multiradio modules User Manual Abstract This document describes the system integration of NINA-W1 series stand-alone modules, which includes the NINA-W13 (Wi-Fi) and NINA-W10 and NINA-W15 series (multiradio) and NINA-B2

(Bluetooth) modules. These modules feature a number of useful embedded security features, including secure boot that ensures that only authenticated software can run on the module. NINA-

W1 modules are ideal for critical IoT applications where security is important. The modules connect to a host system using UART, high-speed RMII, or GPIO interfaces. www.u-blox.com NINA-W1 series - User Manual Document Information Title Subtitle NINA-W1 series Stand-alone Wi-Fi, Bluetooth and multiradio modules Document type User Manual This document applies to the following products:

Product name NINA-W106 NINA-W136 NINA-W156 NINA-B226 u-blox or third parties may hold intellectual property rights in the products, names, logos and designs included in this document. Copying, reproduction, modification or disclosure to third parties of this document or any part thereof is only permitted with the express written permission of u-blox. The information contained herein is provided as is and u-blox assumes no liability for its use. No warranty, either express or implied, is given, including but not limited to, with respect to the accuracy, correctness, reliability and fitness for a particular purpose of the information. This document may be revised by u-blox at any time without notice. For the most recent documents, visit www.u-blox.com. Copyright u-blox AG. NINA-W1 series - User Manual Contents Document Information ................................................................................................................................ 2 Contents .......................................................................................................................................................... 3 System description ............................................................................................................................... 5 1.1 Overview ........................................................................................................................................................ 5 1.2 CPU................................................................................................................................................................. 6 1.3 Operating modes ......................................................................................................................................... 6 1.3.1 Power modes ....................................................................................................................................... 6 1.4 Supply interfaces ........................................................................................................................................ 6 1.4.1 Module supply design (VCC) ............................................................................................................. 6 1.4.2 Digital I/O interfaces reference voltage (VCC_IO) ........................................................................ 6 1.4.3 VCC application circuits .................................................................................................................... 6 1.5 System function interfaces ...................................................................................................................... 7 1.5.1 Boot strapping pins ............................................................................................................................ 7 1.6 Data interfaces ............................................................................................................................................ 7 1.6.1 Universal asynchronous serial interface (UART) ......................................................................... 7 1.6.2 Ethernet (RMII+SMI) .......................................................................................................................... 8 1.7 W1x6 integrated antennas ...................................................................................................................... 10 1.8 Reserved pins (RSVD) .............................................................................................................................. 10 1.9 GND pins ..................................................................................................................................................... 10 Software .................................................................................................................................................. 11 2.1 NINA-W13 and NINA-W15 u-connectXpress software ....................................................................... 11 2.2 SDK for open-CPU modules .....................................................................................................................12 2.3 Flashing stand-alone modules with s-center .......................................................................................12 2.4 Updating u-connectXpress software with s-center .......................................................................... 13 2.5 Developing and flashing NINA-W10 open-CPU software .................................................................. 14 2.5.1 Setup the ESP-IDF v3 toolchain..................................................................................................... 14 2.5.2 Get ESP-IDF v3 .................................................................................................................................. 14 2.5.3 Setup path to ESP-IDF ..................................................................................................................... 16 2.5.4 Building and flashing ESP-IDF v3 .................................................................................................. 16 2.5.5 Using ESP-IDF v4 .............................................................................................................................. 19 2.5.6 Automatic bootloader on NINA-W10 EVK .................................................................................... 19 2.6 Arduino support for NINA-W10 .............................................................................................................. 19 2.6.1 Downloading the Arduino IDE ......................................................................................................... 20 2.6.2 Downloading from the GIT repository ........................................................................................... 20 2.6.3 Downloading the toolchain ..............................................................................................................21 2.6.4 Output power configuration ........................................................................................................... 24 2.6.5 NINA-W10 series ............................................................................................................................... 24 2.6.6 NINA-W13/W15 series ...................................................................................................................... 26 Design-in ................................................................................................................................................. 27 3.1 Overview ...................................................................................................................................................... 27 3.2 Supply interfaces ...................................................................................................................................... 27 NINA-W1 series - User Manual 3.2.1 Module supply (VCC) design ........................................................................................................... 27 3.2.2 Digital I/O interfaces reference voltage (VCC_IO) ...................................................................... 27 3.3 Antenna interface ..................................................................................................................................... 28 3.3.1 On-board antenna design ............................................................................................................... 28 3.4 Data communication interfaces ............................................................................................................ 29 3.4.1 Asynchronous serial interface (UART) design ............................................................................ 29 3.4.2 Ethernet (RMII+SMI) ........................................................................................................................30 3.5 General High Speed layout guidelines ..................................................................................................30 3.5.1 General considerations for schematic design and PCB floor-planning .................................30 3.5.2 Module placement ............................................................................................................................30 3.5.3 Layout and manufacturing .............................................................................................................30 3.6 Module footprint and paste mask ......................................................................................................... 31 3.7 Thermal guidelines ................................................................................................................................... 31 3.8 ESD guidelines ........................................................................................................................................... 31 Handling and soldering ..................................................................................................................... 33 4.1 Packaging, shipping, storage and moisture preconditioning .......................................................... 33 4.2 Handling ...................................................................................................................................................... 33 4.3 Soldering ..................................................................................................................................................... 33 4.3.1 Reflow soldering process ................................................................................................................ 33 4.3.2 Cleaning .............................................................................................................................................. 34 4.3.3 Other remarks ................................................................................................................................... 35 Approvals ............................................................................................................................................... 36 5.1 European Union regulatory compliance ............................................................................................... 36 5.1.1 Radio Equipment Directive (RED) 2014/53/EU ........................................................................... 36 5.1.2 Compliance with the RoHS directive ............................................................................................ 36 5.2 United States (FCC) ................................................................................................................................. 36 5.2.1 Labeling and user information requirements ............................................................................. 37 5.2.2 RF exposure ....................................................................................................................................... 37 5.2.3 Module statement ............................................................................................................................ 38 5.2.4 End-product compliance ................................................................................................................. 38 5.3 Canada (ISED) ............................................................................................................................................ 39 5.3.1 Labeling and user information requirements ............................................................................. 39 5.3.2 RF exposure ....................................................................................................................................... 39 5.4 Japan radio equipment compliance ...................................................................................................... 40 Product testing .................................................................................................................................... 41 6.1 u-blox In-Series production test ............................................................................................................. 41 6.2 OEM manufacturer production test ..................................................................................................... 41 Go/No go tests for integrated devices ...................................................................................... 42 Appendix ....................................................................................................................................................... 43 6.2.1 A Glossary ................................................................................................................................................. 43 NINA-W1 series - User Manual System description 1.1 Overview The NINA-W1 series of wireless and multiradio MCU IoT is suitable for industrial markets where security is important. NINA-W1 includes the following stand-alone modules:

Model Description NINA-W13 series NINA-W10 series Multiradio MCU modules Wireless MCU modules integrate a powerful microcontroller (MCU) and a Wi-Fi radio for wireless communication. NINA-W13x modules come with pre-flashed application software and support 802.11b/g/n in the 2.4 GHz ISM band. Host systems set up and control the modules through an AT command interface to reduce the time and complexity of including Wi-Fi connectivity into your application designs. NINA-

W13x modules offer top-grade security with secure boot functionality that ensures that applications start only with the original u-blox software, u-connectXpress. integrate a powerful microcontroller (MCU) and radio for wireless communication. With open CPU architecture, NINA-W10 series modules are ideal for advanced applications that run on dual core 32-bit MCUs. The radio provides support for Wi-Fi 802.11b/g/n in the 2.4 GHz ISM band, Bluetooth BR/EDR, and Bluetooth low energy communication. Leveraging integrated cryptographic hardware accelerators, NINA-W10 series modules offer top-grade security with secure boot functionality that ensures that applications start only with the original u-blox software, u-connectXpress. NINA-W15 series NINA-W15x modules have similar performance as NINA-W10x modules, but come with pre-flashed application software. Serving as a multiradio gateway, these modules provide support for Wi-Fi 802.11b/g/n and dual-mode Bluetooth (Bluetooth BR/EDR low energy v4.2). Host systems set up and control the modules through an AT command interface to reduce the time and complexity of including Wi-

Fi connectivity into your application designs. NINA-W15x series modules offer top-grade security with secure boot functionality that ensures that applications start only with the original u-blox software, u-connectXpress. NINA-B2 series The NINA-B2 series are small stand-alone dual-mode Bluetooth modules designed for ease-of-use and integration in professional applications where security is important. The modules are delivered with u-blox connectivity software, which provides support for both peripheral and central roles, Serial Port Profile, GATT client and server, beacons, u-blox Bluetooth low energy Serial Port Service all configurable from a host using AT commands. NINA-W106, NINA-W136, NINA-W156 and NINA-B226 approvals are currently pending. NINA-W1 series - User Manual 1.2 CPU NINA-W1 series modules use a dual-core system that includes two Harvard Architecture Xtensa LX6 CPUs with maximum 240 MHz internal clock frequency. The internal memory of NINA-W1 supports:

448 kB ROM for booting and core functions 520 kB SRAM for data and instruction 16 or 32 Mbit FLASH memory for code storage, including hardware encryption to protect programs and data. 1 kbit EFUSE (non- erasable memory) for MAC addresses, module configuration, flash-

encryption, and Chip-ID. Open CPU variants (NINA-W10) also support external FLASH and SRAM memory through a Quad SPI interface. 1.3 Operating modes 1.3.1 Power modes NINA-W1 series modules are power efficient devices capable of operating in different power saving modes and configurations. Different sections of the modules can be powered off when they are not needed, and complex wake up events can be generated from different external and internal inputs. For the lowest current consumption modes an external LPO clock is required (interface available for NINA-W10 series modules and NINA-W156). 1.4 Supply interfaces 1.4.1 Module supply design (VCC) NINA-W1 series modules include an integrated Linear Voltage converter that transforms the supply voltage. The output of the converter, presented at the VCC pin, provides a stable system voltage. 1.4.2 Digital I/O interfaces reference voltage (VCC_IO) NINA-W1 series modules include an additional voltage supply input for setting the I/O voltage level. A separate VCC_IO pin enables module integration in many applications with different voltage supply levels (1.8 V or 3.3 V for example) without level converters. NINA-W1 series modules currently support 3.3 V IO levels only. The power for NINA-W1 series modules is applied through the VCC pins. These supplies are taken from either of the following sources:

1.4.3 VCC application circuits Switching Mode Power Supply (SMPS) Low Drop Out (LDO) regulator An SMPS is the ideal design choice when the available primary supply source is of a higher value than the operating supply voltage of the module. This offers the best power efficiency for the application design and minimizes the amount of current drawn from the main supply source. NINA-W1 series - User Manual When taking VCC supplies from an SMPS make sure that the AC ripple voltage is kept as low as possible at the switching frequency. Design layouts should focus on minimizing the impact of any high-frequency ringing. Use an LDO linear regulator for primary VCC supplies that have a relatively low voltage. As LDO linear regulators dissipate a considerable amount of energy, LDOs are not recommended for the step down of high voltages. DC/DC efficiency should be regarded as a trade-off between the active and idle duty cycles of an application. Although some DC/DC devices achieve high efficiency at light loads, these efficiencies typically degrade as soon as the idle current drops below a few milliamps. This can have a negative impact on the life of the battery. If decoupling capacitors are needed on the supply rails, it is best practice to position these as close as possible to the NINA-W1 series module. The power routing of some host system designs makes decoupling capacitance unnecessary. For electrical specifications, see the NINA-W1 series Data Sheets. 1.5 System function interfaces 1.5.1 Boot strapping pins For normal operation, several boot configuration pins must be in their default state during the module boot. Left unconnected in the application design, the default state of these pins is automatically chosen with internal pull-up or pull-down resistors in the module. See data sheet for more information. Care must be taken if an RMII interface is to be included in the application design. Pin 25 and pin 27 connect to the RMII. It is important that both of these pins are in the correct state during the module boot and before the RMII interface turns on. For connection information, see section 1.6.2.1. On NINA-W13/W15 modules, pin 25 and pin 27 must be in default state during the boot. On NINA-W10 modules, pin 27 is used to enter the ESP bootloader. Consequently, this pin must be exposed on a pin header (or similar) to flash the module. Pin 32 is used to control the Universal Asynchronous Serial Interface (UART) debug printout. With this pin left unconnected, NINA-W1 prints some short debug information when it boots before the module software starts up. For u-connectXpress software, this means before +STARTUP. To disable the printout, this pin must be pulled low during start-up. 1.6 Data interfaces 1.6.1 Universal asynchronous serial interface (UART) For data communication and firmware upgrade, NINA-W1 series modules support an interface comprised of three UARTs. Each UART supports the following signals:

Data lines (RXD as input, TXD as output) Hardware flow control lines (CTS as input, RTS as output) DSR and DTS set and indicate the system modes You can use the UARTs in 4-wire mode with hardware flow control, or in 2-wire mode with TXD and RXD only. In 2-wire mode, CTS must be connected to the GND on the NINA-W1 module. For further information, see chapter 2. The u-connectXpress software adds the DSR and DTR pins to the UART interface. Not used as they were originally intended, these pins are used to control the state of NINA modules. NINA-W1 series - User Manual Depending on the configuration, DSR can be used to:

Enter command mode Disconnect and/or toggle connectable status Enable/disable the rest of the UART interface Enter/wake up from sleep mode The functionality of the DSR and DTR pins are configured by AT commands. For further information about these commands, see the u-blox Short Range Modules AT commands manual. Table 1 shows the default settings of UART ports when using u-connectXpress software. Interface Default configuration UART interface 115200 baud, 8 data bits, no parity, 1 stop bit, hardware flow control Table 1: UART port default settings It is advisable to make UART0 available either for test points or connect it to a header for firmware upgrade. The IO level of the UART follows VCC_IO. For information about UART interface characteristics, see the NINA-W1 series Data Sheets. 1.6.2 Ethernet (RMII+SMI) On NINA-W13, RMII is supported from software version 2.0.0 onwards. On NINA-W15, direct MAC to MAC connection will be supported when the module reaches Engineering Sample status. NINA-W1 series modules include a full RMII for Ethernet MAC to PHY communication using the included Station Management Interface (SMI). The RMII and SMI uses nine signals in total. The interface requires an external 50 MHz clock source either from a compatible PHY chip or from an external oscillator. The two-wire SMI is used to configure the PHY chip. It uses a clock line and a data line to setup the internal registers on PHY chip. The pin multiplexing of the RMII interface imposes limitations in the functionality of NINA-W13/W15 series module when using the interface. The following functions are turned off when RMII communication is initiated:

Red, Green and Blue LEDs are disabled UART is run without flow control as CTS and RTS functionality is disabled DSR and DTR functionality is disabled A 1.5 k pull up resistor must be added to MDIO pin. 1.6.2.1 Startup precautions To ensure that the boot mode is not entered inadvertently, the RMII_CLK input (GPIO27) is multiplexed with the ESP boot pin and must be held high 1.2 ms after the reset signal is released. EVK-NINA-W1 uses two buffers and a low pass filter to delay the reset signal going to the PHY circuit, as shown in Figure . This delays the clock so that it starts a short time after the module is released from reset. NINA-W1 series - User Manual Figure 1: RMII clock delay circuit u-connectXpress software senses the RMII_CLK input (GPIO27) at startup. If an RMII clock is discovered, then Ethernet communication is initiated. During startup of NINA-W1 series modules the RMII clock must be started within 100 us, but not before an initial delay of 1.2 ms. 1.6.2.2 MAC to PHY connection When connecting NINA-W1 series modules to an external PHY circuit, both the RMII and SMI interfaces must be connected. The default PHY address (0x1) must be configured on the PHY side. Follow the recommendations of your chosen PHY chip supplier for implementation details. An example of a PHY implementation is shown in Figure . PHY KSZ8081 is recommended and used on the EVK-NINA-W1. Figure 2: EVK-NINA-W1 Ethernet PHY implementation 1.6.2.3 MAC to MAC connection When connecting NINA-W1 series modules using a direct MAC to MAC connection, the SMI interface can be left unconnected. Depending on the routing of the RMII interface on the host PCB, termination resistors can also be needed. An external 50 MHz oscillator is needed while running an MAC to MAC connection. NINA-W1 series - User Manual 1.7 W1x6 integrated antennas To simplify integration, W1x6 modules are equipped with an integrated antenna. An integrated antenna design means there is no need for an RF trace design on the host PCB. This means less effort is required in the test lab. The NINA-W1x6 modules are equipped with a PCB trace antenna that is based on technology licensed from Proant AB. 1.8 Reserved pins (RSVD) Do not connect the reserved (RSVD) pin. Reserved pins are allocated for future interfaces and functionality. 1.9 GND pins Good electrical connection of module GND pins, using solid ground layer of the host application board, is required for correct RF performance. Firm connections provide a thermal heat sink for the module and significantly reduce EMC issues. NINA-W1 series - User Manual Software 2.1 NINA-W13 and NINA-W15 u-connectXpress software NINA-W13/W15 stand-alone modules are delivered with embedded u-connectXpress software. Using industry-standard AT commands, this is the software that manages the combination of Bluetooth, Bluetooth low energy and Wi-Fi connectivity supported in NINA-W13 and NINA-W15 standalone modules, specifically:

Wi-Fi (NINA-W13 and NINA-W15) Bluetooth (NINA-W15) Bluetooth low energy (NINA-W15) For information about the features, capabilities and use of u-connectXpress software, see the u-blox Short range modules AT commands manual. Typical examples of the applications and use cases supported by NINA-W13 and NINA-W15 series modules include:

Gateway connection of Bluetooth low energy sensors to the cloud over Wi-Fi or Ethernet Bridge communication over serial, Wi-Fi, PPP, or Ethernet interfaces Wi-Fi hotspot connection using Local Area Network or Tethering Device configuration using Bluetooth or Wi-Fi connected smartphones Secure cloud connection using TLS and MQTT protocols Figure shows the structure of the embedded u-connectXpress software delivered in NINA-W13 and NINA-W15 standalone modules. Figure 3: NINA-W13/W15u-connectXpress software structure NINA-W1 series - User Manual 2.2 SDK for open-CPU modules As NINA-W10 open-CPU modules are delivered without flashed software, you develop your application design using the utilities and device-level APIs supported by the module chipset supplier. The ESP-IDF Software Development Kit is available from the Expressif website. It bundles the Wi-Fi stack and the broad range of drivers and libraries necessary for building your development environment. See also section 2.5. Figure shows the architecture of NINA-W10 open-CPU software in relation to the MCU, transceiver and ESP-IDF SDK. Figure 4: NINA-W10 open CPU software 2.3 Flashing stand-alone modules with s-center ublox s-center client software provides a convenient tool with which to configure u-blox standalone modules. It runs on PCs running Windows XP onwards (x86 and x64) with Net Framework 4.5 or later and is available for download from www.u-blox.com. For further information about how to use this tool, see the s-center user guide. You use s-center to upgrade the embedded u-connectXpress software in NINA-W13 and NINA-W15 stand-alone modules. The s-center client connects to ublox standalone modules using the XMODEM protocol using the s-center tool. For the purpose of upgrading the connectivity software, the following pins are exposed as either headers or test points:

NINA-W13 and NINA-W15 Mandatory:

o UART (RXD, TXD, CTS, RTS) Additionally recommended:

o RESET_N o SWITCH_1 and SWITCH_2 NINA-W1 series - User Manual NINA-W10 header Mandatory:

o SWD o ESP_BOOT (GPIO27) Additionally recommended:

o RESET_N 2.4 Updating u-connectXpress software with s-center The u-connectXpress software, flashed into NINA-W13/W15 modules prior to delivery, is used to validate the hardware, bootloader, and the binary image. The u-connectXpress software runs only on validated hardware. Updates of the u-connectXpress software is available for download from www.u-blox.com. The software is delivered in a zip container file, for example, NINA-W1xX_SW1.0.0.zip. To upload the latest u-connectXpress software to the module:

1. Download and unpack the zip container, NINA-W1xX_SW1.0.0.zip, to your Windows workstation. 2. Open the s-center client software. 3. From the client, navigate to the .json file in the unpacked u-connect archive and select Update. The s-center handles the download using information contained in the *.json file without any further interaction is needed from the user. See also Figure 5. Figure 5: Software Update using s-center Secure boot functionality is supported in u-connect v4.7 and above. Updating To manually start the download using a software without using s-center, enter the following AT commands to start updating the NINA-W13/W15 u-connectXpress:

AT+UFWUPD=<mode>,<baud>,<image id>,<image size>,<base64 encoded signature>,<image name>,<flags>

Sample parameters that can be used while doing the flash update is provided below:

AT+UFWUPD=0,115200,0,651840,jzlRIkg37ir/pVpDKVrPot2ZdsaNvUtSYP2pDAUVJc7iQI9yzIo8V Fv8C1olP/9I4UJ4WmgC5oRay4AC0V8jRJSFFX/wop6x/sBJGOeDEu7yC/s0+Oj7CLs4TzNbiRqK0zLwKR iHohgVyzWqhwKFpmcxcDXphjkCTIvpffY8TwDLzkowuuD59R+sQCueJtBHBg9KDB3TOs8bsXLaVtT2x1r LfMg8/pb+BPQEK9NcNB4hbp693ATivYE3cmxzWykIjEje819SIRGhHFt0wAsqh7WFgSJYNgDi5cLdOYz+

r1+j7+l4RqrMl/A/QYyWS9z0Q15QcJ3GlAJlXYa5v/ISjA==,nina-w1-debug,rwx NINA-W1 series - User Manual When a C character is received from NINA-W13/W15, the XMODEM download is ready to begin from the host. For more information about the parameters, see the Software update +UFWUPD command in u-blox Short Range Modules AT Commands Manual. 2.5 Developing and flashing NINA-W10 open-CPU software As the u-connectXpress software embedded in NINA-W13/15 series modules is not available for use with the NINA-W10 open CPU series, you use Expressif SDK utilities and device-level APIs to develop your application hardware. For the started/index.html. latest Espressif SDK documentation, see http://esp-idf.readthedocs.io/en/latest/get-

This URL provides information on how to set up the software environment using the hardware based on the Espressif ESP32 such as NINA-W10 and also how to use the latest ESP-IDF (Espressif IoT Development Framework), which might have been changed since the publication of this document. The following must be setup in order to compile, flash, and execute a program on NINA-W10:

Setup Toolchain Get ESP-IDF o Windows, Mac, and Linux is supported o Download the GIT repository provided by Espressif Setup Path to ESP-IDF Build and Flash o The toolchain program can access the ESP-IDF using IDF_PATH environment variable o Start a Project, Connect, Configure, Build and Flash a program More information about this is available at - http://esp-idf.readthedocs.io/en/latest/index.html 2.5.1 Setup the ESP-IDF v3 toolchain ESP-IDF v3 toolchain can be used on NINA-W101/NINA-W102, but has not been verified on NINA-

W106. On NINA-W106, use the ESP-IDF v4 toolchain. To start development with ESP32, it is recommended to use a prebuilt toolchain. Currently, Windows, Mac, and Linux is supported. The example in this document will use a Toolchain for running Windows, that is, a bash shell window. The toolchain contains all programs and compiler to build an application. The toolchain for Windows can be downloaded from https://dl.espressif.com/dl/esp32_win32_msys2_environment_and_toolchain-20170918.zip Unzip the file to c:\ msys32. This path is assumed in the following examples, but it can be located in another folder as well. The file size is around 500 MB. Start the bash shell using the mingw32.exe (mingw64.exe is currently not supported). If you encounter any issues, use the autorebase.bat and the msys2_shell.cmd shortcuts. This will reset the path variable with a Cygwin installation on some computers, which can have problems with the path to the compiler or the python tool. 2.5.2 Get ESP-IDF v3 ESP-IDF v3 can be used on NINA-W101/NINA-W102, but has not been verified on NINA-W106. On NINA-W106, use the ESP-IDF v4. NINA-W1 series - User Manual source The https://github.com/espressif/esp-idf. files for Espressif ESP-IDF repository is located on github at To download the files, open the mingw32.exe, navigate to the directory where you want to have the ESP-IDF (like c:\git), and clone it using git clone command. Use the --recursive parameter In this example, the esp-idf repository will be created in the c:\git folder. git clone --recursive https://github.com/espressif/esp-idf.git git clone https://github.com/espressif/esp-idf.git esp-idf-v3.1 cd esp-idf-v3.1/

git checkout v3.1 git submodule update --init --recursive To checkout a specific tag such as v3.1, use the following command as shown in the example below:

Figure 6: Example of the git clone of ESP-IDF Go to the new folder by typing cd esp-idf and then type ls to show the folder content. cd esp-idf ls Figure 7: Verification of all the downloaded files NINA-W1 series - User Manual 2.5.3 Setup path to ESP-IDF The toolchain for the ESP-IDF uses the IDF_PATH environment variable. This variable must be set up for building the projects. export IDF_PATH="C:/git/esp-idf"

Figure 8: Setting up the PATH variable 2.5.4 Building and flashing ESP-IDF v3 The environment is now ready to build and flash a project. In this case, we use hello world as a sample project. This project will print out Hello World ten times on the UART and then reboot. To build this sample project, go to the hello world folder using the following command:

cd examples/get-started/hello_world Plug in NINA-W10 to the PC and note down the com port number with which it is connected. In this example, the com port number is assumed to be COM10. Now enter make menuconfig to open the ESP-IDF configuration window. You can select and modify a lot of configuration options about the environment using this tool; in this example, only the com port that is used to flash NINA-W10 is modified. make menuconfig Use the arrow keys to navigate and select the Serial flasher config as shown in Figure Figure 9: Screenshot that shows selection of Serial flasher config Enter the com port name; in this case, enter COM10, and click OK. Figure 10: Screenshot that shows selection of the sample com port number ("COM10") Save the sdkconfig by entering a filename to which this configuration should be saved as shown in Figure . NINA-W1 series - User Manual Figure 11: Screenshot after entering the filename for the sdkconfig Make sure your configuration is saved first and then enter Exit to exit the console. NINA-W1 series - User Manual Now the project is ready to build, but before building and flashing, NINA-W10 should be prepared to accept the downloaded file. This is done by holding the BOOT button while resetting or powering on the board. Then, enter make flash to build and flash the NINA-W10 as shown below:

make flash Figure 12: Compiling of the example application Now, reset the NINA-W10 by clicking the RESET button. Then, enter make monitor to open a serial port monitor program to the NINA-W10. make monitor make flash monitor You could also enter make flash monitor to build and flash and then start the serial port monitor program using only one command. Figure 131: Hello world example as displayed on the monitor NINA-W1 series - User Manual 2.5.5 Using ESP-IDF v4 ESP-IDF v4 is mandatory for NINA-W106. To use ESP-IDF v4, follow the applicable instructions for your development environment on https://docs.espressif.com/projects/esp-idf/en/latest/esp32/get-started/windows-setup.html https://docs.espressif.com/projects/esp-idf/en/latest/esp32/get-started/linux-setup.html https://docs.espressif.com/projects/esp-idf/en/latest/esp32/get-started/macos-setup.html Get the latest toolchain and installation instructions by using applicable path above. After the toolchain has been installed, get and install the ESP-IDF by using the below link and following the given instructions. The toolchain for the ESP-IDF uses the IDF_PATH environment variable. This variable must be set up for building the projects by following the given instructions. https://docs.espressif.com/projects/esp-idf/en/latest/esp32/get-started/index.html#step-2-get-

esp-idf source The https://github.com/espressif/esp-idf. files for Espressif ESP-IDF repository is located on github at Building and flashing the examples is basically done the same way as for ESP-IDF v3, but instead of make, the idf.py shall be invoked. The same command-line parameters applies. However, some differences exist:

For NINA-W101/NINA-W102, during idf.py make menuconfig also set the configuration flag CONFIG_SPI_FLASH_USE_LEGACY_IMPL flag to Y, otherwise the application will fail to start. NINA-W106, during idf.py make menuconfig also set the CONFIG_BOOTLOADER_VDDSDIO_BOOST_1_9V and CONFIG_SPI_FLASH_SUPPORT_ISSI_CHIP configuration flags to Y. On NINA-W106, it may be required to add the --no-stub parameter to esptool.py when flashing the software and make a manual verification using a second invocation of esptool.py in case flashing and verification fails. 2.5.6 Automatic bootloader on NINA-W10 EVK The esptool.py flash tool supports automatic entry to the bootloader on the NINA-W10 EVK without pressing the BOOT button and RESET the module. To use this functionality, you need to connect the following pins:

RESET to IO19 (CTS) IO0 (IO zero) to IO26 (DSR) The jumpers CTS (J14-8) and DSR (J14-7) should also be removed so that they do not interfere. It is not possible to use the Hardware Flow control or the DSR signals on the UART while using this setup. More information about the esptool is available at - https://github.com/espressif/esptool 2.6 Arduino support for NINA-W10 It is possible to use Arduino electronics platform on the NINA-W10. The Arduino platform and open source community provides the possibility to access a lot of third party hardware such as displays and sensors. 2.6.1 Downloading the Arduino IDE Windows, Mac, and Linux environment are supported. The example below uses the Windows environment. Download the Arduino IDE using the URL - https://www.arduino.cc/en/Main/Software. NINA-W1 series - User Manual Figure 14: Screenshot during installation of the Arduino IDE Click Install button in the dialog box that pops up during installation as shown in the screenshots below:

Open the Arduino IDE - "C:\Program Files (x86)\Arduino\arduino.exe" and then close the program again. Do this to ensure that the folder is created correctly before downloading the Arduino files as mentioned in the next step. The Arduino IDE user folder is typically located in C:\Users\user_name\Documents\Arduino 2.6.2 Downloading from the GIT repository Download from the URL - https://github.com/espressif/arduino-esp32.git The files should be placed in C:\Users\user_name\Documents\Arduino\hardware\espressif\esp32 Open the mingw32.exe located in c:\msys32. The Arduino user folder is normally stored at C:\Users\user_name\Documents\Arduino Check if the hardware folder exists. If not, create the same by entering the following command:

mkdir hardware cd hardware NINA-W1 series - User Manual Check if the espressif folder exists; if not, create the same by entering the following command:

mkdir espressif cd espressif Now clone the repository to the folder esp32 folder. git clone --recursive https://github.com/espressif/arduino-esp32.git esp32 Figure 2: Cloning the Arduino Esp32 repository 2.6.3 Downloading the toolchain Go to the folder - C:\Users\user_name\Documents\Arduino\hardware\espressif\esp32\tools to execute the program get.exe. Double click on the get.exe to start the download. This will download the toolchain that is needed to build and flash the project. All the files are extracted on successful download. Figure 3: Screenshot after selecting "get.exe"

Normally, it takes around 15-30 minutes to download this program. NINA-W1 series - User Manual Figure 17: Sample screenshot during download Open the Arduino application again from the following

(x86)\Arduino\arduino.exe"

location

- "C:\Program Files In the Tools -> Board menu, select ESP32 Dev Module and then select the following;

Flash Mode: DIO Flash Frequency: 40 MHz Flash Size: 2 MB (16 Mb) Upload Speed 921600 Core Debug Level Debug (optional) Figure 184: Screenshot that depicts selection of the ESP32 Dev Module u-blox NINA-W10 module will soon be added to the list of supported boards. Until then, use the ESP32 Dev Module. NINA-W1 series - User Manual Start the WiFiScan example, which is available at the following folder:

C:\Users\ user_name

\Documents\Arduino\hardware\espressif\esp32\libraries\WiFi\examples\WiFiScan Press the -> (arrow) button, as shown highlighted in red in the below screenshot (Figure ), to start the upload to NINA-W10. Figure 19: Screenshot that depicts the arrow at the top Select "Serial Monitor" from the Tools menu as shown in Figure to view the events. Figure 20: Screenshot that depicts selection of the Serial Monitor The Wi-Fi scan starts and displays the results, as shown in Figure . NINA-W1 series - User Manual Figure 21: Sample screenshot of the Wi-Fi scan 2.6.4 Output power configuration 2.6.5 NINA-W10 series To operate within the regulatory output power limits, the integrator must configure the module as per the instructions in the following subsections. The following power configurations for Wi-Fi, Bluetooth BR/EDR and Bluetooth low energy are only valid for the official esp-idf git repositories. 2.6.5.1 Wi-Fi output power configuration for version v2.1 The original file (phy_init.c) is located in the folder ...\esp-idf\components\esp32\ in the official v2.1 esp-idf git repository. Update this file with the values provided below:

const esp_phy_init_data_t* esp_phy_get_init_data()

int8_t *init_data = malloc(sizeof(esp_phy_init_data_t));

memcpy(init_data, &phy_init_data, sizeof(esp_phy_init_data_t));

init_data[44] = 56;//target power 0 init_data[45] = 58;//target power 1 init_data[46] = 54;//target power 2 init_data[47] = 47;//target power 3 init_data[48] = 44;//target power 4 init_data[49] = 37;//target power 5 init_data[50] = 0; //msc0 init_data[51] = 0; //msc1 init_data[52] = 0; //msc2 init_data[53] = 0; //msc3 init_data[54] = 0; //msc4 init_data[55] = 2; //msc5 init_data[56] = 4; //msc6 init_data[57] = 5; //msc7 init_data[58] = 1; //11B special rate enable init_data[59] = 3; //11B 1m, 2m init_data[60] = 3; //11B 5.5, 11m init_data[61] = 1; //channel backoff enable init_data[62] = 18; //backoff channel 1 init_data[63] = 4;//backoff channel 2 init_data[64] = 2;//backoff channel 3 init_data[65] = 2;//backoff channel 4 init_data[66] = 2;//backoff channel 5 init_data[67] = 0;//backoff channel 6 NINA-W1 series - User Manual init_data[68] = 0;//backoff channel 7 init_data[69] = 0;//backoff channel 8 init_data[70] = 0;//backoff channel 9 init_data[71] = 0;//backoff channel 10 init_data[72] = 14;//backoff channel 11 init_data[73] = 26;//backoff channel 12 init_data[74] = 255;//backoff channel 13 init_data[75] = 255;//backoff channel 14 init_data[76] = 15; //backoff rate on channel 1 init_data[77] = 15; //backoff rate on channel 2 init_data[78] = 8; //backoff rate on channel 3 init_data[79] = 8; //backoff rate on channel 4 init_data[80] = 8; //backoff rate on channel 5 init_data[81] = 0; //backoff rate on channel 6 init_data[82] = 0; //backoff rate on channel 7 init_data[83] = 0; //backoff rate on channel 8 init_data[84] = 0; //backoff rate on channel 9 init_data[85] = 0; //backoff rate on channel 10 init_data[86] = 7; //backoff rate on channel 11 init_data[87] = 63; //backoff rate on channel 12 init_data[88] = 63; //backoff rate on channel 13 init_data[89] = 63; //backoff rate on channel 14 apply_rf_frequency_calibration(init_data);

ESP_LOGD(TAG, "loading PHY init data from application binary");

return (esp_phy_init_data_t*)init_data;

2.6.5.2 Wi-Fi output power configuration for versions v3.1, v3.2 and v4.0 The original file (phy_init.c) is located in the folder ...\esp-idf\components\esp32\ in the official git repositories for the applicable esp-idf. Update the file with the values provided below:

const esp_phy_init_data_t* esp_phy_get_init_data()

int8_t *init_data = malloc(sizeof(esp_phy_init_data_t));

memcpy(init_data, &phy_init_data, sizeof(esp_phy_init_data_t));

init_data[44] = 56;//target power 0 init_data[45] = 54;//target power 1 init_data[46] = 48;//target power 2 init_data[47] = 46;//target power 3 init_data[48] = 42;//target power 4 init_data[49] = 36;//target power 5 init_data[50] = 0; //msc0 init_data[51] = 0; //msc1 init_data[52] = 0; //msc2 init_data[53] = 0; //msc3 init_data[54] = 0; //msc4 init_data[55] = 1; //msc5 init_data[56] = 3; //msc6 init_data[57] = 4; //msc7 init_data[58] = 1; //11B special rate enable init_data[59] = 2; //11B 1m, 2m init_data[60] = 2; //11B 5.5, 11m init_data[61] = 2; //fcc enable 2: enable 62-80 bytes to set maximum power init_data[62] = 0x53; //channel 1 init_data[63] = 0x52;//channel 2 init_data[64] = 0x30;//channel 3 init_data[65] = 0x20;//channel 4 init_data[66] = 0x20;//channel 5 init_data[67] = 0x20;//channel 6 init_data[68] = 0x20;//channel 7 init_data[69] = 0x20;//channel 8 init_data[70] = 0x20;//channel 9 init_data[71] = 0x20;//channel 10 init_data[72] = 0x22;//channel 11 init_data[73] = 0x10;//channel 12 NINA-W1 series - User Manual init_data[74] = 0x10;//channel 13 init_data[75] = 0xAA;//channel 14 init_data[76] = 0x44; //channel 3, 4 init_data[77] = 0x44; //channel 5, 6 init_data[78] = 0x44; //channel 7, 8 init_data[79] = 0x44; //channel 9, 10 init_data[80] = 0x44; //channel 11 apply_rf_frequency_calibration(init_data);

ESP_LOGD(TAG, "loading PHY init data from application binary");

return (esp_phy_init_data_t*)init_data;

2.6.5.3 Bluetooth BR/EDR output power configuration No output power configuration for Bluetooth BR/EDR is required. With default settings, the module will operate at ~6 dBm, which is within the regulatory limit for NINA-W1. 2.6.5.4 Bluetooth low energy output power configuration No output power configuration for Bluetooth low energy is required. With default settings, the module will operate at ~6 dBm, which is within the regulatory limit for NINA-W1. 2.6.6 NINA-W13/W15 series No output power configuration required by the integrator. Using the u-connectXpress guarantees operation within regulatory limits. NINA-W1 series - User Manual Design-in 3.1 Overview For an optimal integration of NINA-W1 series modules in the final application board, it is recommended to follow the design guidelines stated in this chapter. Every application circuit must be properly designed to guarantee the correct functionality of the related interface, however a number of points require high attention during the design of the application device. The following list provides important points sorted by rank of importance in the application design, starting from the highest relevance:

1. Module antenna connection: Ant pad Antenna circuit affects the RF compliance of the device integrating NINA-W1x1 modules with applicable certification schemes. Follow the recommendations provided in section 3.3 for schematic and layout design. 2. Module supply: VCC, VCC_IO, and GND pins The supply circuit affects the performance of the device integrating NINA-W1 series module. Follow the recommendations provided in section 3.2 for schematic and layout design. 3. High speed interfaces: UART pins High speed interfaces can be a source of radiated noise and can affect compliance with regulatory standards for radiated emissions. Follow the recommendations provided in section 3.4.1 for schematic and layout design. 4. System functions: RESET_N, GPIO and other System input and output pins Accurate design is required to guarantee that the voltage level is well defined during module boot. 5. Other pins:

Accurate design is required to guarantee proper functionality. 3.2 Supply interfaces 3.2.1 Module supply (VCC) design Good connection of the modules VCC pin with DC supply source is required for correct RF performance. The guidelines are summarized below:

The VCC connection must be as wide and short as possible. The VCC connection must be routed through a PCB area separated from sensitive analog signals and sensitive functional units. It is a good practice to interpose at least one layer of the PCB ground between VCC track and other signal routing. There is no strict requirement of adding bypass capacitance to the supply net close to the module. However, depending on the layout of the supply net and other consumers on the same net, bypass capacitors might still be beneficial. Though the GND pins are internally connected, connect all the available pins to solid ground on the application board, as a good (low impedance) connection to an external ground can minimize power loss and improve RF and thermal performance. 3.2.2 Digital I/O interfaces reference voltage (VCC_IO) Good connection of the modules VCC_IO pin with DC supply source is required for correct performance. The guidelines are summarized below:

NINA-W1 series - User Manual The VCC_IO connection must be as wide and short as possible. The VCC_IO connection must be routed through a PCB area separated from sensitive analog signals and sensitive functional units. It is a good practice to interpose at least one layer of PCB ground between VCC_IO track and other signal routing. There is no strict requirement of adding bypass capacitance to the supply net close to the module. However, depending on the layout of the supply net and other consumers on the same net, bypass capacitors might still be beneficial. Though the GND pins are internally connected, connect all the available pins to solid ground on the application board, as a good (low impedance) connection to an external ground can minimize power loss and improve RF and thermal performance. 3.3 Antenna interface As the unit cannot be mounted arbitrarily, the placement should be chosen with consideration so that it does not interfere with radio communication. The W1x6 modules with a PCB trace antenna cannot be mounted in a metal enclosure. No metal casing or plastics using metal flakes should be used. Avoid metallic based paint or lacquer as well. 3.3.1 On-board antenna design If a plastic enclosure is used, it is possible to use NINA-W1 with the embedded antenna. In order to reach an optimum operating performance, follow the instructions provided in the sections below. 3.3.1.1 NINA-W1x6 PCB trace antenna The module shall be placed in the center of an edge of the host PCB. A large ground plane on the host PCB is a prerequisite for good antenna performance. It is recommended to have the ground plane extending at least 10 mm on the three non-edge sides of the module. See Figure. The host PCB shall include a full GND plane underneath the entire module, with a ground cut out under the PCB trace antenna according to the description in Figure . The NINA-W1x6 has four extra GND pads under the antenna that need to be connected for a good antenna performance. Detailed measurements of the footprint including this extra GND pads can be found in the NINA-W1 series data sheets. High / large parts including metal shall not be placed closer than 10 mm to the modules antenna. At least 10 mm clearance between the antenna and the casing is recommended. If the clearance is less than 10 mm, the antenna performance can be adversely affected. The module shall be placed such that the antenna faces outwards from the product and is not obstructed by any external items in close vicinity of the products intended use case. NINA-W1 series - User Manual Figure 31: GND plane guard area enclosing the NINA-W1x6 module Figure 32: Size of the GND cut out for the NINA-W1x6 modules PCB trace antenna 3.4 Data communication interfaces 3.4.1 Asynchronous serial interface (UART) design The layout of the UART bus should be done so that noise injection and cross talk are avoided. It is recommended to use the hardware flow control with RTS/CTS to prevent temporary UART buffer overrun. The flow control signals RTS/CTS are active low thus a 0 (ON state =low level) will allow the UART to transmit. NINA-W1 series - User Manual CTS is an input to the NINA-W1 module and if the host applies a 0 (ON state = low level), then the RTS is an output off the NINA-W1 module and the module will apply a 0 (ON state = low level) module is allowed to transmit. when it is ready to receive transmission. 3.4.2 Ethernet (RMII+SMI) It is recommended to route all signals in the RMII bus with the same length and have appropriate grounding in the surrounding layers; total bus length should also be minimized. The layout of the RMII bus should be done so that crosstalk with other parts of the circuit is minimized providing adequate isolation between the signals, the clock and the surrounding busses/traces. Termination resistors are recommended for the RX and TX lines on the RMII bus. Pull-up resistor is required for MDIO. The General High Speed layout guidelines in section 3.5 apply for the RMII and the SMI bus. 3.5 General High Speed layout guidelines These general design guidelines are considered as best practices and are valid for any bus present in the NINA-W1 series modules; the designer should prioritize the layout of higher speed busses. Low frequency signals are generally not critical for layout. One exception is represented by High Impedance traces (such as signals driven by weak pull resistors) that may be affected by crosstalk. For those traces, a supplementary isolation of 4w from other busses is recommended. 3.5.1 General considerations for schematic design and PCB floor-planning Verify which signal bus requires termination and add series resistor terminations to the schematics. processor. Carefully consider the placement of the module with respect to antenna position and host Verify with PCB manufacturer allowable stack-ups and controlled impedance dimensioning. Verify that the power supply design and power sequence are compliant with the specification of NINA-W1 series module. 3.5.2 Module placement Accessory parts like bypass capacitors should be placed as close as possible to the module to improve filtering capability, prioritizing the placement of the smallest size capacitor close to module pads. Particular care should be taken not to place components close to the antenna area. The designer should carefully follow the recommendations from the antenna manufacturer about the distance of the antenna vs. other parts of the system. The designer should also maximize the distance of the antenna to Hi-frequency busses like DDRs and related components or consider an optional metal shield to reduce interferences that could be picked up by the antenna thus reducing the modules sensitivity. An optimized module placement allows better RF performance. See section 3.3 for more information on antenna consideration during module placement. 3.5.3 Layout and manufacturing Avoid stubs on high speed signals. Even through-hole vias may have an impact on signal quality. NINA-W1 series - User Manual Verify the recommended maximum signal skew for differential pairs and length matching of buses. Minimize the routing length; longer traces will degrade signal performance. Ensure that maximum allowable length for high speed busses is not exceeded. Ensure that you track your impedance matched traces. Consult with your PCB manufacturer early in the project for proper stack-up definition. RF and digital sections should be clearly separated on the board. Ground splitting is not allowed below the module. Minimize bus length to reduce potential EMI issues from digital busses. All traces (including low speed or DC traces) must couple with a reference plane (GND or power);

Hi-speed busses should be referenced to the ground plane. In this case, if the designer needs to change the ground reference, an adequate number of GND vias must be added in the area of transition to provide a low impedance path between the two GND layers for the return current. Hi-Speed busses are not allowed to change reference plane. If a reference plane change is unavoidable, some capacitors should be added in the area to provide a low impedance return path through the different reference planes. Trace routing should keep a distance greater than 3W from the ground plane routing edge. Power planes should keep a distance from the PCB edge sufficient to route a ground ring around the PCB, the ground ring must then be connected to other layers through vias. 3.6 Module footprint and paste mask The mechanical outline of the NINA-W1 series modules can be found in the NINA-W1 series Data Sheets.The proposed land pattern layout reflects the pads layout of the module. The Non Solder Mask Defined (NSMD) pad type is recommended over the Solder Mask Defined

(SMD) pad type, which implements the solder mask opening 50 m larger per side than the corresponding copper pad. The suggested paste mask layout for the NINA-W1 series modules is to follow the copper mask layout as described in the NINA-W1 series Data Sheets. These are recommendations only and not specifications. The exact mask geometries, distances and stencil thicknesses must be adapted to the specific production processes of the customer. The NINA-W1 series modules have been successfully tested in -40 C to +85 C. A good grounding should be observed for temperature relief during high ambient temperature. 3.7 Thermal guidelines 3.8 ESD guidelines The immunity of devices integrating NINA-W1 modules to Electro-Static Discharge (ESD) is part of the Electro-Magnetic Compatibility (EMC) conformity, which is required for products bearing the CE marking, compliant with the R&TTE Directive (99/5/EC), the EMC Directive (89/336/EEC) and the Low Voltage Directive (73/23/EEC) issued by the Commission of the European Community. Compliance with these directives implies conformity to the following European Norms for device ESD immunity: ESD testing standard CENELEC EN 61000-4-2 and the radio equipment standards ETSI EN 301 489-1, ETSI EN 301 489-7, ETSI EN 301 489-24, the requirements of which are summarized in Table 2. The ESD immunity test is performed at the enclosure port, defined by ETSI EN 301 489-1 as the physical boundary through which the electromagnetic field radiates. If the device implements an integral antenna, the enclosure port is seen as all insulating and conductive surfaces housing the NINA-W1 series - User Manual device. If the device implements a removable antenna, the antenna port can be separated from the enclosure port. The antenna port includes the antenna element and its interconnecting cable surfaces. The applicability of ESD immunity test to the whole device depends on the device classification as defined by ETSI EN 301 489-1. Applicability of ESD immunity test to the related device ports or the related interconnecting cables to auxiliary equipment, depends on the device accessible interfaces and manufacturer requirements, as defined by the ETSI EN 301 489-1. Contact discharges are performed at conductive surfaces, while air discharges are performed at insulating surfaces. Indirect contact discharges are performed on the measurement setup horizontal and vertical coupling planes as defined in the CENELEC EN 61000-4-2. For the definition of integral antenna, removable antenna, antenna port, and device classification, refer to the ETSI EN 301 489-1. For the contact and air discharges definitions, refer to CENELEC EN 61000-4-2. Parameter Min. Typical Max. Unit Remarks 8*

kV Indirect discharge according to IEC 61000-4-2 2.5 kV Human body model according to JEDEC JS001 ESD immunity. All exposed surfaces of the radio equipment and ancillary equipment in a representative configuration ESD sensitivity, tested for all pins except ANT and RSVD pins #11, #15, #33

* Tested on EVK-NINA-W1 evaluation board. Table 2: Electro-Magnetic Compatibility ESD immunity requirements as defined by CENELEC EN 61000-4-2, ETSI EN 301 489-1, ETSI EN 301 489-7, ETSI EN 301 489-24 NINA-W1 is manufactured taking into account specific standards to minimize the occurrence of ESD events; the highly automated process complies with the IEC61340-5-1 (STM5.2-1999 Class M1 devices) standard. Thus, the designer should implement proper measures to protect from ESD events on any pin that may be exposed to the end user. Compliance with standard protection level specified in the EN61000-4-2 can be achieved by including the ESD protections in parallel to the line, close to areas accessible by the end user. NINA-W1 series - User Manual Handling and soldering No natural rubbers, hygroscopic materials or materials containing asbestos are employed. 4.1 Packaging, shipping, storage and moisture preconditioning For information pertaining to reels, tapes or trays, moisture sensitivity levels (MSL), shipment and storage, as well as drying for preconditioning refer to NINA-W1 series Data Sheets, and u-blox Package Information Guide. 4.2 Handling The NINA-W1 series modules are Electro-Static Discharge (ESD) sensitive devices and require special precautions during handling. Particular care must be exercised when handling patch antennas, due to the risk of electrostatic charges. In addition to standard ESD safety practices, the following measures should be taken into account whenever handling the receiver:

Unless there is a galvanic coupling between the local GND (i.e. the work table) and the PCB GND, then the first point of contact when handling the PCB must always be between the local GND and PCB GND. Before mounting an antenna patch, connect ground of the device When handling the RF pin, do not come into contact with any charged capacitors and be careful when contacting materials that can develop charges (e.g. patch antenna ~10 pF, coax cable ~50-80 pF/m, soldering iron, ) To prevent electrostatic discharge through the RF input, do not touch any exposed antenna area. If there is any risk that such exposed antenna area is touched in non ESD protected work area, implement proper ESD protection measures in the design. When soldering RF connectors and patch antennas to the receivers RF pin, make sure to use an ESD safe soldering iron (tip). 4.3 Soldering 4.3.1 Reflow soldering process The NINA-W1 series modules are surface mount modules supplied on a FR4-type PCB with gold plated connection pads and are produced in a lead-free process with a lead-free soldering paste. The bow and twist of the PCB is maximum 0.75% according to IPC-A-610E. The thickness of solder resist between the host PCB top side and the bottom side of the NINA-W1 series module must be considered for the soldering process. The module is compatible with industrial reflow profile for RoHS solders. Use of "No Clean" soldering paste is strongly recommended. The reflow profile used is dependent on the thermal mass of the entire populated PCB, heat transfer efficiency of the oven, and particular type of solder paste used. The optimal soldering profile used has to be trimmed for each case depending on the specific process and PCB layout. Process parameter Pre-heat Ramp up rate to TSMIN TSMIN TSMAX tS (from +25 C) tS (Pre-heat) TL tL (time above TL) TP (absolute max) Ramp-down from TL Allowed soldering cycles Peak Cooling Table 3: Recommended reflow profile NINA-W1 series - User Manual Value 3 150 200 150 217 245 4 1 60 to 120 40 to 60 Unit K/s C C s s C s C K/s

Figure 5: Reflow profile Lower value of TP and slower ramp down rate (2 3 C/sec) is preferred. After reflow soldering, optical inspection of the modules is recommended to verify proper alignment. Target values in Table 3 should be taken as general guidelines for a Pb-free process. Refer to JEDEC J-STD-020C standard for further information. 4.3.2 Cleaning Cleaning the modules is not recommended. Residues underneath the modules cannot be easily removed with a washing process. Cleaning with water will lead to capillary effects where water is absorbed in the gap between the baseboard and the module. The combination of residues of soldering flux and encapsulated water leads to short circuits or resistor-like interconnections between neighboring pads. Water will also damage the sticker and the ink-jet printed text. Cleaning with alcohol or other organic solvents can result in soldering flux residues flooding into the two housings, areas that are not accessible for post-wash inspections. The solvent will also damage the sticker and the ink-jet printed text. Ultrasonic cleaning will permanently damage the module, in particular the crystal oscillators. For best results, use a "no clean" soldering paste and eliminate the cleaning step after the soldering process. NINA-W1 series - User Manual 4.3.3 Other remarks Only a single reflow soldering process is allowed for boards with a module populated on it. Boards with combined through-hole technology (THT) components and surface-mount technology (SMT) devices may require wave soldering to solder the THT components. Only a single wave soldering process is allowed for boards populated with the modules. Miniature Wave Selective Solder process is preferred over traditional wave soldering process. Hand soldering is not recommended. Rework is not recommended. Conformal coating may affect the performance of the module, it is important to prevent the liquid from flowing into the module. The RF shields do not provide protection for the module from coating liquids with low viscosity, therefore care is required in applying the coating. Conformal coating of the module will void the warranty. Grounding metal covers: attempts to improve grounding by soldering ground cables, wick or other forms of metal strips directly onto the EMI covers is done at the customer's own risk and will void the warranty of the module. The numerous ground pins are adequate to provide optimal immunity to interferences. The module contains components that are sensitive to Ultrasonic Waves. Use of any ultrasonic processes such as cleaning, welding etc., may damage the module. Use of ultrasonic processes on an end product integrating this module will also void the warranty. NINA-W1 series - User Manual Approvals Country approval for NINA-W106, NINA-W136, NINA-W156 and NINA-B226 is pending. 5.1 European Union regulatory compliance Approval for NINA-W106, NINA-W136, NINA-W156 and NINA-B226 is pending. Information about regulatory compliance of the European Union for NINA-W10 series modules is available in the NINA-W10 Declaration of Conformity.. 5.1.1 Radio Equipment Directive (RED) 2014/53/EU The NINA-W106, NINA-W136, NINA-W156 and NINA-B226 modules comply with the essential requirements and other relevant provisions of the Radio Equipment Directive (RED) 2014/53/EU. 5.1.2 Compliance with the RoHS directive The NINA-W1 series modules complies with the Directive 2011/65/EU (EU RoHS 2) and its amendment Directive (EU) 2015/863 (EU RoHS 3). 5.2 United States (FCC) The NINA-W106, NINA-W136, NINA-W156 and NINA-B226 modules have received Federal Communications Commission (FCC) CFR47 Telecommunications, Part 15 Subpart C Intentional Radiators modular approval in accordance with Part 15.247 Modular Transmitter approval. The modular approval allows the end user to integrate the module into a finished product without obtaining subsequent and separate FCC approvals for intentional radiation, provided no changes or modifications are made to the module circuitry. Changes or modifications could void the users authority to operate the equipment. The end user must comply with all of the instructions provided by the Grantee, which indicate installation and/or operating conditions necessary for compliance. The finished product is required to comply with all applicable FCC equipment authorizations regulations, requirements and equipment functions not associated with the transmitter module portion. For example, compliance must be demonstrated to regulations for other transmitter components within the host product; to requirements for unintentional radiators (Part 15 Subpart B Unintentional Radiators), such as digital devices, computer peripherals, radio receivers, etc.; and to additional authorization requirements for the non-transmitter functions on the transmitter module

(i.e., Verification, or Declaration of Conformity) (e.g., transmitter modules may also contain digital logic functions) as appropriate.

(OEM) Integrator has to assure compliance of the entire end-product incl. the integrated RF Module. For 15 B (15.107 and if applicable 15.109) compliance, the host manufacturer is required to show compliance with 15 while the module is installed and operating. Furthermore the module should be transmitting and the evaluation should confirm that the module's intentional emissions (15C) are compliant (fundamental / out-of-band). Finally the integrator has to apply the appropriate equipment authorization (e.g. Verification) for the new host device per definition in 15.101. Integrator is reminded to assure that these installation instructions will not be made available to the end-user of the final host device. NINA-W1 series - User Manual 5.2.1 Labeling and user information requirements The NINA-W106, NINA-W136, NINA-W156 and NINA-B226 modules are assigned FCC ID: XPYNINAW106 The final host device, into which this RF Module is integrated" has to be labeled with an auxiliary label stating the FCC ID of the RF Module, such as:

Contains FCC ID: XPYNINAW106 This device is acting as slave and operating in the 2.4 GHz (2412 ~2462 MHz) band.

"This device complies with part 15 of the FCC rules. Operation is subject to the following two conditions:

1. This device may not cause harmful interference, and 2. This device must accept any interference received, including interference that may cause undesired operation.

"Changes or modifications to this unit not expressly approved by the party responsible for compliance could void the users authority to operate the equipment."

This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

Reorient or relocate the receiving antenna. Connect the equipment into an outlet on a circuit different from that to which the receiver is Increase the separation between the equipment and receiver. connected. Consult the dealer or an experienced radio/TV technician for help. Model NINA-W106 NINA-W136 NINA-W156 NINA-B226 FCC ID FCC ID: XPYNINAW106 FCC ID: XPYNINAW106 FCC ID: XPYNINAW106 FCC ID: XPYNINAW106 Table 04: FCC ID for NINA-W106, NINA-W136, NINA-W156 and NINA-B226 5.2.2 RF exposure The Integrator will be responsible to satisfy SAR/ RF Exposure requirements, when the module integrated into the host device. This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. Having a separation distance of minimum 45 mm between the user and/or bystander and the antenna and /or radiating element ensures that the maximum output power of NINA-W106, NINA-

W136, NINA-W156 and NINA-B226 is below the SAR test exclusion limits presented in KDB 447498 D01v06. NINA-W1 series - User Manual All transmitters regulated by FCC must comply with RF exposure requirements. KDB 447498 General RF Exposure Guidance provides guidance in determining whether proposed or existing transmitting facilities, operations or devices comply with limits for human exposure to Radio Frequency (RF) fields adopted by the Federal Communications Commission (FCC). This module is approved for installation into mobile and/or portable host platforms and must not be co-located or operating in conjunction with any other antenna or transmitter except in accordance with FCC multi-transmitter guidelines. End users must be provided with transmitter operating conditions for satisfying RF Exposure compliance. KDB996369 D03 section 2.4 (limited module procedures) and 2.5 (trace antenna designs) are not applicable to the NINA-W106, NINA-W136, NINA-W156 and NINA-B226 modules. 5.2.3 Module statement The single-modular transmitter is a self-contained, physically delineated, component for which compliance can be demonstrated independent of the host operating conditions, and which complies with all eight requirements of 15.212(a)(1) as summarized below. 1) The radio elements have the radio frequency circuitry shielded. 2) The module has buffered modulation/data inputs to ensure that the device will comply with Part 15 requirements with any type of input signal. 3) The module contains power supply regulation on the module. 4) The module contains a permanently attached antenna. 5) The module demonstrates compliance in a stand-alone configuration. 6) The module is labeled with its permanently affixed FCC ID label. 7) The module complies with all specific rules applicable to the transmitter, including all the conditions provided in the integration instructions by the grantee. 8) The module complies with RF exposure requirements. 5.2.4 End-product compliance The modular transmitter approval of NINA-W106, NINA-W136, NINA-W156 and NINA-B226, or any other radio module, does not exempt the end product from being evaluated against applicable regulatory demands. The evaluation of the end product shall be performed with the NINA-W106, NINA-W136, NINA-W156 or NINA-B226 INA-B3 module installed and operating in a way that reflects the intended end product use case. The upper frequency measurement range of the end product evaluation is the 5th harmonic of 2.4 GHz as declared in 47 CFR Part 15.33 (b)(1). The following requirements apply to all products that integrate a radio module:

Subpart B - UNINTENTIONAL RADIATORS To verify that the composite device of host and module comply with the requirements of FCC part 15B, the integrator shall perform sufficient measurements using ANSI 63.4-2014. Subpart C - INTENTIONAL RADIATORS It is required that the integrator carries out sufficient verification measurements using ANSI 63.10-2013 to validate that the fundamental and out of band emissions of the transmitter part of the composite device complies with the requirements of FCC part 15C. When the items listed above are fulfilled, the end product manufacturer can use the authorization procedures as mentioned in Table 1 of 47 CFR Part 15.101, before marketing the end product. This means the customer has to either market the end product under a Suppliers Declaration of Conformity (SDoC) or to certify the product using an accredited test lab. NINA-W1 series - User Manual 5.3 Canada (ISED) The NINA-W106, NINA-W136, NINA-W156 and NINA-B226 modules are certified for use in Canada under Innovation, Science and Economic Development Canada (ISED) Radio Standards Specification

(RSS) RSS-247 Issue 2 and RSSGen. 5.3.1 Labeling and user information requirements The final host device, into which this RF Module is integrated has to be labeled with an auxiliary label stating the IC of the RF Module, such as:

Contains transmitter module IC: 8595A-NINAW106 This device contains licence-exempt transmitter(s)/receiver(s) that comply with Innovation, Science and Economic Development Canadas licence-exempt RSS(s). Operation is subject to the following two conditions:

1. This device may not cause interference. 2. This device must accept any interference, including interference that may cause undesired operation of the device. Le priphrique hte final, dans lequel ce module RF est intgr "doit tre tiquet avec une tiquette auxiliaire indiquant le CI du module RF, tel que"

Contient le module metteur IC: 8595A-NINAW106 Lmetteur/rcepteur exempt de licence contenu dans le prsent appareil est conforme aux CNR dInnovation, Sciences et Dveloppement conomique Canada applicables aux appareils radio exempts de licence. Lexploitation est autorise aux deux conditions suivantes :

1. Lappareil ne doit pas produire de brouillage;

a. Lappareil doit accepter tout brouillage radiolectrique subi, mme si le brouillage est susceptible den compromettre le fonctionnement. Model NINA-W106 NINA-W136 NINA-W156 NINA-B226 IC IC: 8595A-NINAW106 IC: 8595A-NINAW106 IC: 8595A-NINAW106 IC: 8595A-NINAW106 Table 05: IC for NINA-W106, NINA-W136, NINA-W156 and NINA-B226 5.3.2 RF exposure This equipment complies with the requirements of IC RSS-102 issue 5 radiation exposure limits set forth for an uncontrolled environment. Having a separation distance of minimum 40 mm between the user and/or bystander and the antenna and /or radiating element ensures that the output power (e.i.r.p.) of NINA-W106, NINA-

W136, NINA-W156 and NINA-B226 is below the SAR evaluation Exemption limits defined in RSS-102 issue 5. All transmitters regulated by ISED must comply with RF exposure requirements listed in RSS-102 -

Radio Frequency (RF) Exposure Compliance of Radiocommunication Apparatus (All Frequency Bands). This module is approved for installation into mobile and/or portable host platforms and must not be co-located or operating in conjunction with any other antenna or transmitter except in accordance with Industry Canada's multi-transmitter guidelines. End users must be provided with transmitter operating conditions for satisfying RF Exposure compliance. NINA-W1 series - User Manual 5.4 Japan radio equipment compliance Approval for NINA-W106, NINA-W136, NINA-W156 and NINA-B226 is pending. When a product integrating a NINA-W106, NINA-W136, NINA-W156 or NINA-B226 module is placed on the Japanese market the product must be affixed with a label with the Giteki marking as shown in Figure 6. The marking must be visible for inspection. xxx-yyyyyy Figure 6: Giteki mark, R and the MIC certification number NINA-W1 series - User Manual Product testing 6.1 u-blox In-Series production test u-blox focuses on high quality for its products. All units produced are fully tested automatically in production line. Stringent quality control process has been implemented in the production line. Defective units are analyzed in detail to improve the production quality. This is achieved with automatic test equipment (ATE) in production line, which logs all production and measurement data. A detailed test report for each unit can be generated from the system. Figure 7 shows typical automatic test equipment (ATE) in a production line. The following tests are performed as part of the production tests:

Digital self-test (firmware download, MAC address programming) Measurement of currents Functional tests Digital I/O tests Measurement and verification of RF characteristics in all supported bands. For example, measurements of receiver RSSI and transmitter power levels and frequency tuning of the reference clock. Figure 7: Automatic test equipment for module test 6.2 OEM manufacturer production test As the testing is already done by u-blox, an OEM manufacturer does not need to repeat firmware tests or measurement of the modules RF performance or tests over analog and digital interfaces in their production test. However, an OEM manufacturer should focus on:

Module assembly on the device: It should be verified that:

o Soldering and handling process did not damage the module components o All module pins are well soldered on device board o There are no short circuits between the pins Component assembly on the device: It should be verified that:

o Communication with the host controller can be established o The interfaces between the module and device are working o Overall RF performance test of the device including antenna NINA-W1 series - User Manual Dedicated tests can be implemented to check the device. For example, the measurement of module current consumption when set in a specified state can detect a short circuit if compared with a Golden Device result. The standard operational module firmware and test software on the host can be used to perform functional tests (communication with the host controller, check interfaces) and to perform basic RF performance tests. 6.2.1 Go/No go tests for integrated devices A Go/No go test compares the signal quality with a Golden Device in a location with known signal quality. This test can be performed after establishing a connection with an external device. A very simple test can be performed by just scanning for a known Bluetooth low energy device and checking the signal level. These kinds of test may be useful as a go/no go test but not for RF performance measurements. This test is suitable to check the functionality of the communication with the host controller and the power supply. It is also a means to verify if the components are well soldered. A basic RF functional test of the device including the antenna can be performed with standard Bluetooth low energy devices as remote stations. The device containing the NINA-W1 series module and the antennas should be arranged in a fixed position inside an RF shield box to prevent interferences from other possible radio devices to get stable test results. NINA-W1 series - User Manual Appendix A Glossary Abbreviation Definition Automotive Electronics Council Access Point Arm (Advanced RISC Machines) Holdings American Standard Code for Information Interchange AEC AP ARM ASCII ATE BBR BER BP BPF BT CAN CPU CPU CTS DC DC DCE DDC DDR DL DRX DSR DTE DTR EIRP EMC EMI ESD GND IoT ISM LED LPO LTE MAC MCS MCU MSL NSMD OEM PCB Data Circuit-terminating Equipment* / Data Communication Equipment*

Automatic Test Equipment Battery Backed RAM Bit Error Rate Band Pass Band Pass Filter Bluetooth Controller Area Network Central Processing Unit Central Processing Unit Clear To Send Direct Current Direct Current Display Data Channel Double Data Rate Down Link (Reception) Discontinuous Reception Data Set Ready Data Terminal Equipment Data Terminal Ready Equivalent Isotropically Radiated Power Electro-magnetic Compatibility Electromagnetic Interference Electro-Static Discharge Ground Internet of Things Industrial, Scientific, and Medical radio Light-Emitting Diode Low Power Oscillator Long-Term Evolution Media Access Control Modulation Coding Scheme Microcontroller Moisture Sensitivity Level Non Solder Mask Defined Original Equipment Manufacturer Printed Circuit Board NINA-W1 series - User Manual Abbreviation Definition Radio Frequency Reduced Media-independent Interface Read-only Memory Received Signal Strength Indicator Real-Time Clock Software Development Kit SubMiniature version A Static random-access memory To be Defined Through-hole Technology RF RMII ROM RSSI RTC SDK SMA SRAM TBD THT UART UTC Universal Asynchronous Receiver-Transmitter Coordinated Universal Time Table 6: Explanation of the abbreviations and terms used

Registered office:

u-blox AG Zuercherstrasse 68, Thalwil, Ch-8800, Switzerland Company number: CH-020.3.020.161-7 info@u-blox.com support@u-blox.com RE: Certification Application Model: NINA-W106, NINA-W136, NINA-W156, NINA-B226 IC :

8595A-NINAW106 FCC ID: XPYNINAW106 Label location information for the NINA-W106, NINA-W136, NINA-

W156, NINA-B226 modules The product label is affixed on to the module shield cover as shown in Figure 1. The size of the label is 7.5 x 7.5 mm and contains the following information:

A Data Matrix formatted bar code, with a unique serial number Date of unit production formatted YY/WW (year/week) Major and minor product version info Product marketing name (e.g. NINA-W106, NINA-W136, NINA-W156, NINA-B226) u-blox logo, the red dot of the logo also indicates the location of module pin-1. Figure 1: Label location of the NINA-W106, NINA-W136, NINA-W156, NINA-B226 modules Figure 2: Actual size of the NINA-W106, NINA-W136, NINA-W156, NINA-B226 identifier marking (7.5 x 7.5 mm) The modules are SMT components shipped to the OEM-integrator on Tape&Reel packed in a sealed Dry-Pac bag and mounted onto the host board by automatic Pick&Place machines. As the module is a surface mount device that is soldered onto the host it is not possible to place the label on the secondary side of the module. To be able to fit the FCC/IC certification number on the label the font size has to be smaller than 4 points. Using such small font size makes the certification number too small to be readable. Therefore in accordance with CFR 47 2.925 (f) the FCC IDs is not printed on the label but instead placed in the user manual and placed on the device packaging (e.g. Dry-Pac bag). The user manual also contains instruction on how to attach an auxiliary label on the end-product in compliance with the modular approval guidelines. The instructions will call attention to place the auxiliary label on an exterior surface of the device such that it will be visible upon inspection. The auxiliary label will have at least the information shown in Figure 3. This device contains FCC ID: XPYNINAW106 IC: 8595A-NINAW106 Figure 3: Auxiliary label of NINA-W106, NINA-W136, NINA-W156, NINA-B226 NINA-W106, NINA-W136, NINA-W156, NINA-B226 batch label for Dry-

Pac and Box:

Figure 4: NINA-W106, NINA-W136, NINA-W156, NINA-B226 batch label

Doc ID: UBX-16015789

@Pbiox ae Authorization Letter Date: 01/08/2019 Power of Attorney Issued by u-blox AG Zurcherstrasse 68 CH-8800 Thalwil / Switzerland Phone: +41 44722 7444 Fax: +41 447227447 info@u-blox.com Subject: Authorization letter for FCC/IC signatures To Whom It May Concern:

1am Giulio Comar, Certification Manager and responsible for FCC and IC applications within u-blox.

| hereby authorise the following u-blox employees to sign all application forms, documents and cover letters on my behalf:

Piero Laudicina Jake Bascon Olof Viklund Filip Kruzela Cam Nichols Sincerely, pk Italia S.p.A. is a wholly owned subsidiary of u-blox AG

v Author Giulio Comar Department: cert Page: 1/1 Filename FCC_IC_signature_Authorization_Letter.docx M102 Ret Copyright 2013 u-biox Italia S.p.A. All rights reserved Confidential

Zuercherstrasse 68, Thalwil, Ch-8800, Switzerland u-blox AG Nov. 19, 2020 Federal Communication Commission Authorization and Evaluation Division FCC ID: XPYNINAW106 Re: Confidentiality Request 1: Block Diagram 2: Schematics 3: Operational Description Pursuant to Sections 0.457 and 0.459 of the Commissions Rules, the applicant hereby requests confidential treatment of information applied this application as outlined below:

The above materials contain trade secrets and proprietary information not customarily released to the public. The public disclosure of these matters might be harmful to the applicant and provide unjustified benefits to its competitors. The Applicant understands that pursuant to Rules 0.457, disclosure of this Application and all accompanying documentation will not be made before the date of the Grant for this application. Sincerely, u-blox AG Contact person: Filip Kruzela Title: Certification Manager

Zuercherstrasse 68, Thalwil, Ch-8800, Switzerland u-blox AG Limited Agency Agreement u-blox AG FCC ID: XPYNINAW106

[Nov. 19, 2020]

Federal Communications Commission 445 12th Street SW Washington, DC 20554 Subject:

To Whom It May Concern:

We, u-blox AG hereby authorized Intertek Testing Services to act as our Agent for the purpose of preparing application for FCC ID number (XPYNINAW106) under all applicable parts of the FCC rules and regulations. The effective date of this limited agency agreement is (2020-11-19). The Limited Agency Agreement expires until further notice, unless sooner terminated or extended by written notice to Intertek Testing Services and the Federal Communications Commission. This is to advise that we are in full compliance with the Anti-Drug Abuse Act. The applicant is not subject to a denial of federal benefits pursuant to Section 5301 of the Anti-Drug Act of 1988, 21 U.S.C. 862, and no party to the application is subject to a denial of federal benefits pursuant to that section. If you have any questions or comments, please do not hesitate to contact me. Sincerely,

[Signature]

u-blox AG Contact person: Filip Kruzela Title: Certification Manager