FCC ID: XPYTOBYL210 UMTS/GSM//LTE data module

TOBY-L2 and MPCI-L2 series LTE/DC-HSPA+/EGPRS modules System Integration Manual Abstract This document describes the features and the system integration of TOBY-L2 and MPCI-L2 series multi-mode cellular modules. These modules are a complete and cost efficient LTE/3G/2G solution offering up to 150 Mb/s download and 50 Mb/s upload data rates, covering up to six LTE bands, up to five WCDMA/DC-HSPA+ bands and four GSM/EGPRS bands in the compact TOBY LGA form factor of TOBY-L2 modules or in the industry standard PCI Express Mini Card form factor of MPCI-L2 modules. TOBY-L2 series MPCI-L2 series www.u-blox.com UBX-13004618 - R04 TOBY-L2 and MPCI-L2 series - System Integration Manual Document Information Title Subtitle TOBY-L2 and MPCI-L2 series LTE/DC-HSPA+/EGPRS modules Document type System Integration Manual Document number UBX-13004618 Revision and date R04 30-Sep-2014 Document status Advance Information Document status explanation Objective Specification Document contains target values. Revised and supplementary data will be published later. Advance Information Document contains data based on early testing. Revised and supplementary data will be published later. Early Production Information Document contains data from product verification. Revised and supplementary data may be published later. Production Information Document contains the final product specification. This document applies to the following products:

Name TOBY-L200 TOBY-L210 MPCI-L200 MPCI-L210 Type number Firmware version PCN / IN TOBY-L200-00S-00 TOBY-L210-00S-00 MPCI-L200-00S-00 MPCI-L210-00S-00 09.40 09.40 09.34 09.34 UBX-14040967 UBX-14040967 UBX-14040967 UBX-14040967 u-blox reserves all rights to this document and the information contained herein. Products, names, logos and designs described herein may in whole or in part be subject to intellectual property rights. Reproduction, use, modification or disclosure to third parties of this document or any part thereof without the express permission of u-blox is strictly prohibited. The information contained herein is provided as is and u-blox assumes no liability for the use of the information. No warranty, either express or implied, is given, including but not limited, with respect to the accuracy, correctness, reliability and fitness for a particular purpose of the information. This document may be revised by u-blox at any time. For most recent documents, please visit www.u-blox.com. Copyright 2014, u-blox AG u-blox is a registered trademark of u-blox Holding AG in the EU and other countries. PCI, PCI Express, PCIe, and PCI-SIG are trademarks or registered trademarks of PCI-SIG. Microsoft and Windows are either registered trademarks or trademarks of Microsoft Corporation in the United States and/or other countries. ARM is a registered trademark of ARM Limited in the EU and other countries. All other registered trademarks or trademarks mentioned in this document are property of their respective owners. UBX-13004618 - R04 Page 2 of 141 TOBY-L2 and MPCI-L2 series - System Integration Manual Preface u-blox Technical Documentation As part of our commitment to customer support, u-blox maintains an extensive volume of technical documentation for our products. In addition to our product-specific technical data sheets, the following manuals are available to assist u-blox customers in product design and development. AT Commands Manual: This document provides the description of the AT commands supported by the u-blox cellular modules. System Integration Manual: This document provides the description of u-blox cellular modules system from the hardware and the software point of view, it provides hardware design guidelines for the optimal integration of the cellular modules in the application device and it provides information on how to set up production and final product tests on application devices integrating the cellular modules. Application Note: These documents provide guidelines and information on specific hardware and/or software topics on u-blox cellular modules. See Related documents for a list of Application Notes related to your Cellular Module. How to use this Manual The TOBY-L2 and MPCI-L2 series System Integration Manual provides the necessary information to successfully design and configure the u-blox cellular modules. This manual has a modular structure. It is not necessary to read it from the beginning to the end. The following symbols are used to highlight important information within the manual:

An index finger points out key information pertaining to module integration and performance. A warning symbol indicates actions that could negatively impact or damage the module. Questions If you have any questions about u-blox Cellular Integration:

Read this manual carefully. Contact our information service on the homepage http://www.u-blox.com/

Technical Support Worldwide Web Our website (http://www.u-blox.com/) is a rich pool of information. Product information, technical documents can be accessed 24h a day. By E-mail Contact the closest Technical Support office by email. Use our service pool email addresses rather than any personal email address of our staff. This makes sure that your request is processed as soon as possible. You will find the contact details at the end of the document. Helpful Information when Contacting Technical Support When contacting Technical Support, have the following information ready:

Module type (TOBY-L200) and firmware version Module configuration Clear description of your question or the problem A short description of the application Your complete contact details UBX-13004618 - R04 Advance Information Preface Page 3 of 141 TOBY-L2 and MPCI-L2 series - System Integration Manual Contents Preface ................................................................................................................................ 3 Contents .............................................................................................................................. 4 1.7 1.6 1.3 1.2.1 1 System description ....................................................................................................... 8 1.1 Overview .............................................................................................................................................. 8 1.2 Architecture ........................................................................................................................................ 10 Internal blocks ............................................................................................................................. 11 Pin-out ............................................................................................................................................... 12 TOBY-L2 series pin assignment .................................................................................................... 12 1.3.1 1.3.2 MPCI-L2 series pin assignment .................................................................................................... 16 1.4 Operating modes ................................................................................................................................ 18 Supply interfaces ................................................................................................................................ 20 1.5 1.5.1 Module supply input (VCC or 3.3Vaux) ....................................................................................... 20 RTC supply input/output (V_BCKP) .............................................................................................. 27 1.5.2 1.5.3 Generic digital interfaces supply output (V_INT) ........................................................................... 28 System function interfaces .................................................................................................................. 29 1.6.1 Module power-on ....................................................................................................................... 29 1.6.2 Module power-off ....................................................................................................................... 31 1.6.3 Module reset ............................................................................................................................... 33 1.6.4 Module configuration selection by host processor ....................................................................... 33 Antenna interface ............................................................................................................................... 34 Antenna RF interfaces (ANT1 / ANT2) .......................................................................................... 34 Antenna detection interface (ANT_DET) ...................................................................................... 37 SIM interface ...................................................................................................................................... 37 SIM interface ............................................................................................................................... 37 SIM detection interface ............................................................................................................... 37 Data communication interfaces .......................................................................................................... 38 Universal Serial Bus (USB) ............................................................................................................ 38 Asynchronous serial interface (UART)........................................................................................... 42 DDC (I2C) interface ...................................................................................................................... 44 Secure Digital Input Output interface (SDIO) ................................................................................ 45 Audio .............................................................................................................................................. 45 1.10.1 Digital audio over I2S interface ..................................................................................................... 45 General Purpose Input/Output ........................................................................................................ 46 Mini PCIe specific signals (W_DISABLE#, LED_WWAN#) .................................................................. 47 Reserved pins (RSVD) ...................................................................................................................... 47 Not connected pins (NC) ................................................................................................................. 47 System features............................................................................................................................... 48 1.15.1 Network indication ...................................................................................................................... 48 1.15.2 Antenna supervisor ..................................................................................................................... 48 1.11 1.12 1.13 1.14 1.15 1.9.1 1.9.2 1.9.3 1.9.4 1.7.1 1.7.2 1.8.1 1.8.2 1.10 1.8 1.9 UBX-13004618 - R04 Advance Information Contents Page 4 of 141 TOBY-L2 and MPCI-L2 series - System Integration Manual Jamming detection ...................................................................................................................... 48 1.15.3 1.15.4 IP modes of operation ................................................................................................................. 49 1.15.5 Dual stack IPv4/IPv6 ..................................................................................................................... 49 1.15.6 TCP/IP and UDP/IP ....................................................................................................................... 49 1.15.7 FTP and FTPS ............................................................................................................................... 49 1.15.8 HTTP and HTTPS .......................................................................................................................... 50 1.15.9 SSL .............................................................................................................................................. 50 AssistNow clients and GNSS integration ................................................................................... 50 1.15.10 Hybrid positioning and CellLocate .......................................................................................... 50 1.15.11 1.15.12 Firmware update Over AT (FOAT)............................................................................................. 53 Firmware update Over The Air (FOTA) ...................................................................................... 53 1.15.13 In-band Modem (eCall / ERA-GLONASS) .................................................................................. 54 1.15.14 1.15.15 SIM Access Profile (SAP) ........................................................................................................... 54 Smart temperature management ............................................................................................. 56 1.15.16 1.15.17 Power saving ........................................................................................................................... 58 2.5 2.4 2.3 2.4.1 2.4.2 2 Design-in ..................................................................................................................... 59 2.1 Overview ............................................................................................................................................ 59 Supply interfaces ................................................................................................................................ 60 2.2 2.2.1 Module supply (VCC or 3.3Vaux)................................................................................................. 60 RTC supply output (V_BCKP) ....................................................................................................... 72 2.2.2 2.2.3 Generic digital interfaces supply output (V_INT) ........................................................................... 74 System functions interfaces ................................................................................................................ 75 2.3.1 Module power-on (PWR_ON) ...................................................................................................... 75 2.3.2 Module reset (RESET_N or PERST#) .............................................................................................. 76 2.3.3 Module configuration selection by host processor ....................................................................... 77 Antenna interface ............................................................................................................................... 78 Antenna RF interfaces (ANT1 / ANT2) .......................................................................................... 78 Antenna detection interface (ANT_DET) ...................................................................................... 86 SIM interface ...................................................................................................................................... 88 Guidelines for SIM circuit design.................................................................................................. 88 Guidelines for SIM layout design ................................................................................................. 94 Data communication interfaces .......................................................................................................... 95 Universal Serial Bus (USB) ............................................................................................................ 95 Asynchronous serial interface (UART)........................................................................................... 97 DDC (I2C) interface .................................................................................................................... 101 Secure Digital Input Output interface (SDIO) .............................................................................. 105 Audio interface ................................................................................................................................. 106 Digital audio interface ............................................................................................................... 106 2.8 General Purpose Input/Output .......................................................................................................... 108 2.9 Mini PCIe specific signals (W_DISABLE#, LED_WWAN#) .................................................................... 109 Reserved pins (RSVD) .................................................................................................................... 110 2.10 2.11 Module placement ........................................................................................................................ 111 TOBY-L2 series module footprint and paste mask ......................................................................... 112 2.12 2.6.1 2.6.2 2.6.3 2.6.4 2.5.1 2.5.2 2.7.1 2.7 2.6 UBX-13004618 - R04 Advance Information Contents Page 5 of 141 TOBY-L2 and MPCI-L2 series - System Integration Manual 2.13 2.14 2.15 MPCI-L2 series module installation ................................................................................................ 113 Thermal guidelines ........................................................................................................................ 115 ESD guidelines .............................................................................................................................. 116 2.15.1 ESD immunity test overview ...................................................................................................... 116 2.15.2 ESD immunity test of TOBY-L2 and MPCI-L2 series reference designs ........................................ 117 2.15.3 ESD application circuits .............................................................................................................. 117 Schematic for TOBY-L2 and MPCI-L2 series module integration .................................................... 118 Design-in checklist ........................................................................................................................ 120 2.17.1 Schematic checklist ................................................................................................................... 120 2.17.2 Layout checklist ......................................................................................................................... 121 2.17.3 Antenna checklist ...................................................................................................................... 121 2.16 2.17 3.1 3.2 3.3 3 Handling and soldering ........................................................................................... 122 Packaging, shipping, storage and moisture preconditioning ............................................................. 122 Handling ........................................................................................................................................... 122 Soldering .......................................................................................................................................... 123 Soldering paste.......................................................................................................................... 123 3.3.1 Reflow soldering ....................................................................................................................... 123 3.3.2 Optical inspection ...................................................................................................................... 124 3.3.3 Cleaning .................................................................................................................................... 124 3.3.4 3.3.5 Repeated reflow soldering ......................................................................................................... 125 3.3.6 Wave soldering.......................................................................................................................... 125 3.3.7 Hand soldering .......................................................................................................................... 125 Rework ...................................................................................................................................... 125 3.3.8 3.3.9 Conformal coating .................................................................................................................... 125 3.3.10 Casting ...................................................................................................................................... 125 3.3.11 Grounding metal covers ............................................................................................................ 125 3.3.12 Use of ultrasonic processes ........................................................................................................ 125 4.1 4.2 4 Approvals .................................................................................................................. 126 Product certification approval overview ............................................................................................. 126 Federal Communications Commission and Industry Canada notice ................................................... 127 Safety warnings review the structure ......................................................................................... 127 4.2.1 4.2.2 Declaration of Conformity United States only ......................................................................... 127 4.2.3 Modifications ............................................................................................................................ 127 R&TTED and European Conformance CE mark ................................................................................. 129 4.3 5.1 5.2 5 Product testing ......................................................................................................... 130 u-blox in-series production test ......................................................................................................... 130 Test parameters for OEM manufacturer ............................................................................................ 131 Go/No go tests for integrated devices .................................................................................... 131 RF functional tests ..................................................................................................................... 131 5.2.1 5.2.2 Appendix ........................................................................................................................ 133 UBX-13004618 - R04 Advance Information Contents Page 6 of 141 TOBY-L2 and MPCI-L2 series - System Integration Manual A Glossary .................................................................................................................... 133 B Migration between TOBY-L1 and TOBY-L2 ............................................................ 135 B.1 Overview .......................................................................................................................................... 135 Pin-out comparison between TOBY-L1 and TOBY-L2 ........................................................................ 136 B.2 B.3 Schematic for TOBY-L1 and TOBY-L2 integration .............................................................................. 138 Related documents......................................................................................................... 139 Revision history .............................................................................................................. 140 Contact ............................................................................................................................ 141 UBX-13004618 - R04 Advance Information Contents Page 7 of 141 TOBY-L2 and MPCI-L2 series - System Integration Manual 1 System description 1.1 Overview TOBY-L2 and MPCI-L2 series comprises LTE/3G/2G multi-mode modules supporting up to six LTE bands, up to five UMTS/DC-HSPA+ bands and four GSM/(E)GPRS bands for voice and/or data transmission as following:

TOBY-L200 and MPCI-L200 are designed primarily for operation in America TOBY-L210 and MPCI-L210 are designed primarily for operation in Europe, Asia and other countries TOBY-L2 and MPCI-L2 series are designed in two different form-factors suitable for applications as following:

TOBY-L2 modules are designed in the small TOBY 152-pin Land Grid Array form-factor (35.6 x 24.8 mm), easy to integrate in compact designs and form-factor compatible with the u-blox cellular module families:

this allows customers to take the maximum advantage of their hardware and software investments, and provides very short time-to-market. MPCI-L2 modules are designed in the industry standard PCI Express Full-Mini Card form-factor (51 x 30 mm) easy to integrate into industrial and consumer applications and also ideal for manufacturing of small series. With LTE Category 4 data rates at up to 150 Mb/s (down-link) and 50 Mb/s (up-link), the modules are ideal for applications requiring the highest data-rates and high-speed internet access. TOBY-L2 and MPCI-L2 series modules are the perfect choice for consumer fixed-wireless terminals, mobile routers and gateways, and applications requiring video streaming. They are also optimally suited for industrial (M2M) applications, such as remote access to video cameras, digital signage, telehealth, and security and surveillance systems. Table 1 summarizes the TOBY-L2 and MPCI-L2 series main features and interfaces. Module LTE UMTS GSM Positioning Interfaces Audio Features y r o g e t a c E T L s d n a B y r o g e t a c A P D S H y r o g e t a c A P U S H s d n a B l s s a c t o l s

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S R P G s d n a B TOBY-L200 4 2,4,5, 7,17 24 6 850/900/AWS 1900/2100 12 Quad TOBY-L210 4 1,3,5, 7,8,20 24 6 850/900 1900/2100 12 Quad MPCI-L200 4 2,4,5, 7,17 24 6 850/900/AWS 1900/2100 12 Quad MPCI-L210 4 1,3,5, 7,8,20 24 6 850/900 1900/2100 12 Quad F = will be supported in future product version 01 i r e v e c e r S S N G Table 1: TOBY-L2 and MPCI-L2 series main features summary y t i s r e v D x R i

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4 v P I k c a t s l a u D e r a w t f o S w o N t s i s s A m e d o M a V S S N G i F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F UBX-13004618 - R04 Advance Information System description Page 8 of 141 TOBY-L2 and MPCI-L2 series - System Integration Manual Table 2 reports a summary of LTE, 3G and 2G cellular radio access technologies characteristics and features of the TOBY-L2 and MPCI-L2 series modules. 4G LTE 3G UMTS/HSDPA/HSUPA 2G GSM/GPRS/EDGE 3GPP Release 9 Long Term Evolution (LTE) Evolved Uni.Terrestrial Radio Access (E-UTRA) Frequency Division Duplex (FDD) DL Multi-Input Multi-Output (MIMO) 2 x 2 3GPP Release 8 Dual-Cell HS Packet Access (DC-HSPA+) UMTS Terrestrial Radio Access (UTRA) Frequency Division Duplex (FDD) DL Rx diversity 3GPP Release 8 Enhanced Data rate GSM Evolution (EDGE) GSM EGPRS Radio Access (GERA) Time Division Multiple Access (TDMA) DL Advanced Rx Performance (DARP) Phase 1 Band support:

Band support:

TOBY-L200 / MPCI-L200:

Band 17 (700 MHz) Band 5 (850 MHz) Band 4 (1700 MHz) Band 2 (1900 MHz) Band 7 (2600 MHz) TOBY-L210 / MPCI-L210:

Band 20 (800 MHz) Band 5 (850 MHz) Band 8 (900 MHz) Band 3 (1800 MHz) Band 1 (2100 MHz) Band 7 (2600 MHz) TOBY-L200 / MPCI-L200:

Band 5 (850 MHz) Band 8 (900 MHz) Band 4 (AWS, 1700 MHz) Band 2 (1900 MHz) Band 1 (2100 MHz) TOBY-L210 / MPCI-L210:

Band 5 (850 MHz) Band 8 (900 MHz) Band 2 (1900 MHz) Band 1 (2100 MHz) LTE Power Class Power Class 3 (23 dBm) for LTE mode WCDMA/HSDPA/HSUPA Power Class Power Class 3 (24 dBm) for UMTS/HSDPA/HSUPA mode Data rate LTE category 4:

up to 150 Mb/s DL, 50 Mb/s UL Data rate HSDPA cat.14, up to 21 Mb/s DL1 HSUPA cat.6, up to 5.6 Mb/s UL TOBY-L200 / MPCI-L200:

TOBY-L210 / MPCI-L210:

HSDPA cat.24, up to 42 Mb/s DL HSUPA cat.6, up to 5.6 Mb/s UL Band support TOBY-L200 / MPCI-L200:

GSM 850 MHz E-GSM 900 MHz DCS 1800 MHz PCS 1900 MHz TOBY-L210 / MPCI-L210:

GSM 850 MHz E-GSM 900 MHz DCS 1800 MHz PCS 1900 MHz GSM/GPRS Power Class Power Class 4 (33 dBm) for GSM/E-GSM bands Power Class 1 (30 dBm) for DCS/PCS bands EDGE Power Class Power Class E2 (27 dBm) for GSM/E-GSM bands Power Class E2 (26 dBm) for DCS/PCS bands Data rate2 GPRS multi-slot class 123, CS1-CS4, up to 85.6 kb/s DL/UL EDGE multi-slot class 123, MCS1-MCS9 up to 236.8 kb/s DL/UL Table 2: TOBY-L2 and MPCI-L2 series LTE, 3G and 2G characteristics summary 1 HSDPA category 24 capable 2 GPRS/EDGE multi-slot class determines the number of timeslots available for upload and download and thus the speed at which data can be transmitted and received, with higher classes typically allowing faster data transfer rates. 3 GPRS/EDGE multi-slot class 12 implies a maximum of 4 slots in DL (reception) and 4 slots in UL (transmission) with 5 slots in total. UBX-13004618 - R04 Advance Information System description Page 9 of 141 TOBY-L2 and MPCI-L2 series - System Integration Manual 1.2 Architecture Figure 1 summarizes the internal architecture of TOBY-L2 series modules. Figure 1: TOBY-L2 series block diagram As described in the Figure 2, each MPCI-L2 series module integrates one TOBY-L2 series module:

The MPCI-L200 integrates a TOBY-L200 module The MPCI-L210 integrates a TOBY-L210 module The TOBY-L2 module represents the core of the device, providing the related LTE/3G/2G modem and processing functionalities. Additional signal conditioning circuitry is implemented for PCI Express Mini Card compliance, and two UF.L connectors are available for easy antenna integration. Figure 2: MPCI-L2 series block diagram UBX-13004618 - R04 Advance Information System description Page 10 of 141 CellularBase-bandProcessorMemoryPower Management Unit26 MHz32.768 kHzANT1RF TransceiverANT2V_INT (I/O)V_BCKP (RTC)VCC (Supply)SIMUSBGPIOPower OnExternal ResetPAsLNAsFiltersFiltersDuplexerFiltersPAsLNAsFiltersFiltersDuplexerFiltersLNAsFiltersFiltersLNAsFiltersFiltersSwitchSwitchDDC(I2C)SDIOUARTDigital audio (I2S)ANT_DETHost SelectANT1SIMUSBW_DISABLE#TOBY-L2seriesSignal ConditioningANT2PERST#LED_WWAN#U.FLU.FL3.3Vaux (Supply)Boost ConverterVCC TOBY-L2 and MPCI-L2 series - System Integration Manual 1.2.1 Internal blocks As described in Figure 2, each MPCI-L2 series module integrates one TOBY-L2 series module, which consists of the following internal sections: RF, baseband and power management. RF section The RF section is composed of RF transceiver, PAs, LNAs, crystal oscillator, filters, duplexers and RF switches. Tx signal is pre-amplified by RF transceiver, then output to the primary antenna input/output port (ANT1) of the module via power amplifier (PA), SAW band pass filters band, specific duplexer and antenna switch. Dual receiving paths are implemented according to LTE Down-Link MIMO 2 x 2 and 3G Receiver Diversity radio technologies supported by the modules as LTE category 4 and HSDPA category 24 User Equipments: incoming signals are received through the primary (ANT1) and the secondary (ANT2) antenna input ports which are connected to the RF transceiver via specific antenna switch, diplexer, duplexer, LNA, SAW band pass filters. RF transceiver performs modulation, up-conversion of the baseband I/Q signals for Tx, down-conversion and demodulation of the dual RF signals for Rx. The RF transceiver contains:

Automatically gain controlled direct conversion Zero-IF receiver, Highly linear RF demodulator / modulator capable GMSK, 8-PSK, QPSK, 16-QAM, 64-QAM, Fractional-N Sigma-Delta RF synthesizer, VCO. Power Amplifiers (PA) amplify the Tx signal modulated by the RF transceiver RF switches connect primary (ANT1) and secondary (ANT2) antenna ports to the suitable Tx / Rx path Low Noise Amplifiers (LNA) enhance the received sensitivity SAW duplexers separate the Tx and Rx signal paths and provide RF filtering SAW band pass filters enhance the rejection of out-of-band signals 26 MHz crystal oscillator generates the clock reference in active-mode or connected-mode. Baseband and power management section The Baseband and Power Management section is composed of the following main elements:

A mixed signal ASIC, which integrates Microprocessor for control functions DSP core for LTE/3G/2G Layer 1 and digital processing of Rx and Tx signal paths Memory interface controller Dedicated peripheral blocks for control of the USB, SIM and GPIO digital interfaces Analog front end interfaces to RF transceiver ASIC Memory system, which includes NAND flash and LPDDR Voltage regulators to derive all the subsystem supply voltages from the module supply input VCC Voltage sources for external use: V_BCKP and V_INT (not available on MPCI-L2 series modules) Hardware power on Hardware reset Low power idle-mode support 32.768 kHz crystal oscillator to provide the clock reference in the low power idle-mode, which can be set by enable power saving configuration using the AT+UPSV command. UBX-13004618 - R04 Advance Information System description Page 11 of 141 TOBY-L2 and MPCI-L2 series - System Integration Manual 1.3 Pin-out 1.3.1 TOBY-L2 series pin assignment Table 3 lists the pin-out of the TOBY-L2 series modules, with pins grouped by function. Function Pin Name Pin No I/O Description Remarks Power VCC 70,71,72 I Module supply input VCC pins are internally connected each other. GND V_BCKP V_INT N/A Ground 2, 30, 32, 44, 46, 69, 73, 74, 76, 78, 79, 80, 82, 83, 85, 86, 88-90, 92-152 3 5 I/O RTC supply input/output O Generic digital interfaces supply output VCC supply circuit affects the RF performance and compliance of the device integrating the module with applicable required certification schemes. See section 1.5.1 for functional description and requirements for the VCC module supply. See section 2.2.1 for external circuit design-in. GND pins are internally connected each other. External ground connection affects the RF and thermal performance of the device. See section 1.5.1 for functional description. See section 2.2.1 for external circuit design-in. V_BCKP = 3.0 V (typical) generated by internal regulator when valid VCC supply is present. See section 1.5.2 for functional description. See section 2.2.2 for external circuit design-in. V_INT = 1.8 V (typical) generated by internal regulator when the module is switched on. See section 1.5.3 for functional description. See section 2.2.3 for external circuit design-in. System PWR_ON 20 RESET_N 23 HOST_SELECT0 26 HOST_SELECT1 62 I I I I Power-on input External reset input Internal active pull-up to the VCC enabled. See section 1.6.1 for functional description. See section 2.3.1 for external circuit design-in. Internal active pull-up to the VCC enabled. See section 1.6.3 for functional description. See section 2.3.2 for external circuit design-in. Selection of module configuration by the host processor Note: Not supported by TOBY-L2x0-00S product version See section 1.6.4 for functional description. See section 2.3.3 for external circuit design-in. Selection of module configuration by the host processor Note: Not supported by TOBY-L2x0-00S product version See section 1.6.4 for functional description. See section 2.3.3 for external circuit design-in. Antennas ANT1 81 I/O Primary antenna ANT2 87 I Secondary antenna ANT_DET 75 I Antenna detection Main Tx / Rx antenna interface. 50 nominal characteristic impedance. Antenna circuit affects the RF performance and application device compliance with required certification schemes. See section 1.7 for functional description / requirements. See section 2.4 for external circuit design-in. Rx only for MIMO 2x2 and Rx diversity. 50 nominal characteristic impedance. Antenna circuit affects the RF performance and application device compliance with required certification schemes. See section 1.7 for functional description / requirements See section 2.4 for external circuit design-in. Note: antenna detection not supported by TOBY-L2x0-00S. See section 1.7.2 for functional description. See section 2.4.2 for external circuit design-in. UBX-13004618 - R04 Advance Information System description Page 12 of 141 TOBY-L2 and MPCI-L2 series - System Integration Manual Function Pin Name Pin No I/O Description Remarks SIM VSIM 59 O SIM supply output SIM_IO 57 I/O SIM data SIM_CLK 56 O SIM clock SIM_RST 58 O SIM reset USB VUSB_DET 4 I USB detect input USB_D-

27 I/O USB Data Line D-

USB_D+

28 I/O USB Data Line D+

UART RXD 17 O UART data output TXD 16 I UART data input CTS 15 O UART clear to send output RTS 14 I UART ready to send input VSIM = 1.8 V / 3 V automatically generated according to the connected SIM type. See section 1.8 for functional description. See section 2.5 for external circuit design-in. Data input/output for 1.8 V / 3 V SIM Internal 4.7 k pull-up to VSIM. See section 1.8 for functional description. See section 2.5 for external circuit design-in. 3.25 MHz clock output for 1.8 V / 3 V SIM See section 1.8 for functional description. See section 2.5 for external circuit design-in. Reset output for 1.8 V / 3 V SIM See section 1.8 for functional description. See section 2.5 for external circuit design-in. Input for VBUS (5 V typical) USB supply sense. See section 1.9.1 for functional description. See section 2.6.1 for external circuit design-in. USB interface for AT commands, data communication, FOAT, FW update by u-blox EasyFlash tool and diagnostic. 90 nominal differential impedance (Z0) 30 nominal common mode impedance (ZCM) Pull-up or pull-down resistors and external series resistors as required by the USB 2.0 specifications [4] are part of the USB pad driver and need not be provided externally. See section 1.9.1 for functional description. See section 2.6.1 for external circuit design-in. USB interface for AT commands, data communication, FOAT, FW update by u-blox EasyFlash tool and diagnostic. 90 nominal differential impedance (Z0) 30 nominal common mode impedance (ZCM) Pull-up or pull-down resistors and external series resistors as required by the USB 2.0 specifications [4] are part of the USB pad driver and need not be provided externally. See section 1.9.1 for functional description. See section 2.6.1 for external circuit design-in. Note: UART not supported by TOBY-L2x0-00S. 1.8 V output, Circuit 104 (RXD) in ITU-T V.24, for AT command, data communication, FOAT. Add Test-Point and series 0 to access for diagnostic. See section 1.9.2 for functional description. See section 2.6.2 for external circuit design-in. Note: UART not supported by TOBY-L2x0-00S. 1.8 V input, Circuit 103 (TXD) in ITU-T V.24, for AT command, data communication, FOAT. Add Test-Point and series 0 to access for diagnostic. See section 1.9.2 for functional description. See section 2.6.2 for external circuit design-in. Note: UART not supported by TOBY-L2x0-00S. 1.8 V output, Circuit 106 (CTS) in ITU-T V.24. Add Test-Point and series 0 to access for diagnostic. See section 1.9.2 for functional description. See section 2.6.2 for external circuit design-in. Note: UART not supported by TOBY-L2x0-00S. 1.8 V input, Circuit 105 (RTS) in ITU-T V.24. Add Test-Point and series 0 to access for diagnostic. See section 1.9.2 for functional description. See section 2.6.2 for external circuit design-in. UBX-13004618 - R04 Advance Information System description Page 13 of 141 TOBY-L2 and MPCI-L2 series - System Integration Manual Function Pin Name Pin No I/O Description Remarks DSR 10 O /

I/O UART data set ready output / GPIO RI 11 O /

I/O UART ring indicator output / GPIO DTR 13 I /

I/O UART data terminal ready input / GPIO DCD 12 O /

I/O UART data carrier detect output / GPIO DDC SCL 54 O I2C bus clock line SDA 55 I/O I2C bus data line SDIO SDIO_D0 66 I/O SDIO serial data [0]

SDIO_D1 68 I/O SDIO serial data [1]

SDIO_D2 63 I/O SDIO serial data [2]

SDIO_D3 67 I/O SDIO serial data [3]

SDIO_CLK 64 O SDIO serial clock Note: UART / GPIO not supported by TOBY-L2x0-00S. 1.8 V, Circuit 107 in ITU-T V.24, configurable as GPIO. Add Test-Point and series 0 to access for diagnostic. See section 1.9.2 and 1.11 for functional description. See section 2.6.2 and 2.8 for external circuit design-in. Note: UART / GPIO not supported by TOBY-L2x0-00S. 1.8 V, Circuit 125 in ITU-T V.24, configurable as GPIO. Add Test-Point and series 0 to access for diagnostic. See section 1.9.2 and 1.11 for functional description. See section 2.6.2 and 2.8 for external circuit design-in. Note: UART / GPIO not supported by TOBY-L2x0-00S. 1.8 V, Circuit 108/2 in ITU-T V.24, configurable as GPIO. Add Test-Point and series 0 to access for diagnostic. See section 1.9.2 and 1.11 for functional description. See section 2.6.2 and 2.8 for external circuit design-in. Note: UART / GPIO not supported by TOBY-L2x0-00S. 1.8 V, Circuit 109 in ITU-T V.24, configurable as GPIO. Add Test-Point and series 0 to access for diagnostic. See section 1.9.2 and 1.11 for functional description. See section 2.6.2 and 2.8 for external circuit design-in. Note: I2C not supported by TOBY-L2x0-00S. 1.8 V open drain, for communication with u-blox GNSS receivers and other I2C-slave devices as an audio codec. External pull-up required. See section 1.9.3 for functional description. See section 2.6.3 for external circuit design-in. Note: I2C not supported by TOBY-L2x0-00S. 1.8 V open drain, for communication with u-blox GNSS receivers and other I2C-slave devices as an audio codec. External pull-up required. See section 1.9.3 for functional description. See section 2.6.3 for external circuit design-in. Note: SDIO not supported by TOBY-L2x0-00S. SDIO interface for communication with external Wi-Fi chip See section 1.9.4 for functional description. See section 2.6.4 for external circuit design-in. Note: Not supported by TOBY-L2x0-00S. SDIO interface for communication with external Wi-Fi chip See section 1.9.4 for functional description. See section 2.6.4 for external circuit design-in. Note: SDIO not supported by TOBY-L2x0-00S. SDIO interface for communication with external Wi-Fi chip See section 1.9.4 for functional description. See section 2.6.4 for external circuit design-in. Note: SDIO not supported by TOBY-L2x0-00S. SDIO interface for communication with external Wi-Fi chip See section 1.9.4 for functional description. See section 2.6.4 for external circuit design-in. Note: SDIO not supported by TOBY-L2x0-00S. SDIO interface for communication with external Wi-Fi chip See section 1.9.4 for functional description. See section 2.6.4 for external circuit design-in. UBX-13004618 - R04 Advance Information System description Page 14 of 141 TOBY-L2 and MPCI-L2 series - System Integration Manual Function Pin Name Pin No I/O Description Remarks SDIO_CMD 65 I/O SDIO command Audio I2S_TXD 51 O /

I/O I2S transmit data /

GPIO I2S_RXD 53 I /

I/O I2S receive data /

GPIO I2S_CLK 52 I/O /

I/O I2S clock /

GPIO I2S_WA 50 I/O /

I/O I2S word alignment /

GPIO GPIO GPIO1 21 I/O GPIO GPIO2 22 I/O GPIO GPIO3 24 I/O GPIO GPIO4 25 I/O GPIO GPIO5 60 I/O GPIO GPIO6 61 I/O GPIO Reserved RSVD 6 N/A Reserved pin Note: SDIO not supported by TOBY-L2x0-00S. SDIO interface for communication with external Wi-Fi chip See section 1.9.4 for functional description. See section 2.6.4 for external circuit design-in. Note: I2S and GPIO not supported by TOBY-L2x0-00S. I2S transmit data output, alternatively configurable as GPIO. See sections 1.10 and 1.11 for functional description. See sections 2.7 and 2.8 for external circuit design-in. Note: I2S and GPIO not supported by TOBY-L2x0-00S. I2S receive data input, alternatively configurable as GPIO. See sections 1.10 and 1.11 for functional description. See sections 2.7 and 2.8 for external circuit design-in. Note: I2S and GPIO not supported by TOBY-L2x0-00S. I2S serial clock, alternatively configurable as GPIO. See sections 1.10 and 1.11 for functional description. See sections 2.7 and 2.8 for external circuit design-in. Note: I2S and GPIO not supported by TOBY-L2x0-00S. I2S word alignment, alternatively configurable as GPIO. Note: I2S not supported by TOBY-L2x0-00S. See sections 1.10 and 1.11 for functional description. See sections 2.7 and 2.8 for external circuit design-in. Note: GPIO not supported by TOBY-L2x0-00S except for Wireless Network status indication configured on GPIO1. 1.8 V GPIO with alternatively configurable functions See section 1.11 for functional description. See section 2.8 for external circuit design-in. Note: GPIO not supported by TOBY-L2x0-00S. 1.8 V GPIO with alternatively configurable functions See section 1.11 for functional description. See section 2.8 for external circuit design-in. Note: GPIO not supported by TOBY-L2x0-00S. 1.8 V GPIO with alternatively configurable functions See section 1.11 for functional description. See section 2.8 for external circuit design-in. Note: GPIO not supported by TOBY-L2x0-00S. 1.8 V GPIO with alternatively configurable functions See section 1.11 for functional description. See section 2.8 for external circuit design-in. Note: GPIO not supported by TOBY-L2x0-00S. 1.8 V GPIO with alternatively configurable functions See section 1.11 for functional description. See section 2.8 for external circuit design-in. Note: GPIO not supported by TOBY-L2x0-00S. 1.8 V GPIO See section 1.11 for functional description. See section 2.8 for external circuit design-in. This pin must be connected to ground. See section 2.10 RSVD 1, 7-9, 18, 19, 29, 31, 33-43, 45, 47-49, 77, 84, 91 N/A Reserved pin Leave unconnected. See section 2.10 Table 3: TOBY-L2 series module pin definition, grouped by function UBX-13004618 - R04 Advance Information System description Page 15 of 141 TOBY-L2 and MPCI-L2 series - System Integration Manual 1.3.2 MPCI-L2 series pin assignment Table 4 lists the pin-out of the MPCI-L2 series modules, with pins grouped by function. Function Pin Name Pin No I/O Description Remarks Power 3.3Vaux 2, 24, 39, 41, 52 I Module supply input GND N/A Ground 4, 9, 15, 18, 21, 26, 27, 29, 34, 35, 37, 40, 43, 50 Auxiliary Signals PERST#

22 I External reset input Antennas ANT1 U.FL I/O Primary antenna ANT2 U.FL I Secondary antenna SIM UIM_PWR 8 O SIM supply output UIM_DATA 10 I/O SIM data UIM_CLK 12 O SIM clock UIM_RESET 14 O SIM reset 3.3Vaux pins are internally connected each other. 3.3Vaux supply circuit affects the RF performance and compliance of the device integrating the module with applicable required certification schemes. See section 1.5.1 for functional description and requirements for the 3.3Vaux module supply. See section 2.2.1 for external circuit design-in. GND pins are internally connected each other. External ground connection affects the RF and thermal performance of the device. See section 1.5.1 for functional description. See section 2.2.1 for external circuit design-in. Internal 45 k pull-up to 3.3 V supply. See section 1.6.3 for functional description. See section 2.3.2 for external circuit design-in. Main Tx / Rx antenna interface. 50 nominal characteristic impedance. Antenna circuit affects the RF performance and compliance of the device integrating the module with applicable required certification schemes. See section 1.7 for functional description / requirements. See section 2.4 for external circuit design-in. Rx only for MIMO 2x2 and Rx diversity. 50 nominal characteristic impedance. Antenna circuit affects the RF performance and compliance of the device integrating the module with applicable required certification schemes. See section 1.7 for functional description / requirements See section 2.4 for external circuit design-in. UIM_PWR = 1.8 V / 3 V automatically generated according to the connected SIM type. See section 1.8 for functional description. See section 2.5 for external circuit design-in. Data input/output for 1.8 V / 3 V SIM Internal 4.7 k pull-up to UIM_PWR. See section 1.8 for functional description. See section 2.5 for external circuit design-in. 3.25 MHz clock output for 1.8 V / 3 V SIM See section 1.8 for functional description. See section 2.5 for external circuit design-in. Reset output for 1.8 V / 3 V SIM See section 1.8 for functional description. See section 2.5 for external circuit design-in. UBX-13004618 - R04 Advance Information System description Page 16 of 141 TOBY-L2 and MPCI-L2 series - System Integration Manual Function Pin Name Pin No I/O Description Remarks USB USB_D-

36 I/O USB Data Line D-

USB_D+

38 I/O USB Data Line D+

USB interface for AT commands, data communication, FOAT, FW update by u-blox EasyFlash tool and diagnostic. 90 nominal differential impedance (Z0) 30 nominal common mode impedance (ZCM) Pull-up or pull-down resistors and external series resistors as required by the USB 2.0 specifications [4] are part of the USB pad driver and need not be provided externally. See section 1.9.1 for functional description. See section 2.6.1 for external circuit design-in. USB interface for AT commands, data communication, FOAT, FW update by u-blox EasyFlash tool and diagnostic. 90 nominal differential impedance (Z0) 30 nominal common mode impedance (ZCM) Pull-up or pull-down resistors and external series resistors as required by the USB 2.0 specifications [4] are part of the USB pad driver and need not be provided externally. See section 1.9.1 for functional description. See section 2.6.1 for external circuit design-in. Specific Signals LED_WWAN#

42 O LED indicator output Open drain active low output. W_DISABLE#

20 I Wireless radio disable input See section 1.12 for functional description. See section 2.9 for external circuit design-in. Internal 22 k pull-up to 3.3Vaux. See section 1.12 for functional description. See section 2.9 for external circuit design-in. Not Connected NC 1, 3, 5-7, 11, 13, 16, 17, 19, 23, 25, 28, 30-33, 44-46, 47-49, 51 N/A Not connected Internally not connected. See section 1.14 for the description. Table 4: MPCI-L2 series module pin definition, grouped by function UBX-13004618 - R04 Advance Information System description Page 17 of 141 TOBY-L2 and MPCI-L2 series - System Integration Manual 1.4 Operating modes TOBY-L2 and MPCI-L2 series modules have several operating modes. The operating modes are defined in Table 5 and described in detail in Table 6, providing general guidelines for operation. General Status Operating Mode Definition Power-down Not-Powered Mode VCC or 3.3Vaux supply not present or below operating range: module is switched off. Power-Off Mode VCC or 3.3Vaux supply within operating range and module is switched off. Normal Operation Idle-Mode Module processor core runs with 32 kHz reference generated by the internal oscillator. Active-Mode Module processor core runs with 26 MHz reference generated by the internal oscillator. Connected-Mode RF Tx/Rx data connection enabled and processor core runs with 26 MHz reference. Table 5: TOBY-L2 and MPCI-L2 series modules operating modes definition Operating Mode Description Transition between operating modes Not-Powered Mode Module is switched off. Application interfaces are not accessible. Power-Off Mode Idle-Mode Active-Mode Module is switched off: normal shutdown by an appropriate power-off event (see 1.6.2). Application interfaces are not accessible. MPCI-L2 modules do not support Power-Off Mode but halt mode (see 1.6.2 and u-blox AT Commands Manual [3], AT+CFUN=127 command). Module is switched on with application interfaces disabled or suspended: the module is temporarily not ready to communicate with an external device by means of the application interfaces as configured to reduce the current consumption. The module enters the low power idle-mode whenever possible if power saving is enabled by AT+UPSV (see u-blox AT Commands Manual [3]) reducing current consumption (see 1.5.1.5). Power saving configuration is not enabled by default:

it can be enabled by the AT+UPSV command (see the u-blox AT Commands Manual [3]). Module is switched on with application interfaces enabled or not suspended: the module is ready to communicate with an external device by means of the application interfaces unless power saving configuration is enabled by AT+UPSV (see 1.9.1.4, 1.9.2.4 and u-blox AT Commands Manual [3]). When VCC or 3.3Vaux supply is removed, the modules enter not-powered mode. When in not-powered mode, TOBY-L2 modules cannot be switched on by PWR_ON, RESET_N or RTC alarm and enter active-mode after applying VCC supply (see 1.6.1). When in not-powered mode, MPCI-L2 modules cannot be switched on by RTC alarm and enter active-mode after applying 3.3Vaux supply (see 1.6.1). When the modules are switched off by an appropriate power-off event (see 1.6.2), the modules enter power-off mode from active-mode. When in power-off mode, TOBY-L2 modules can be switched on by PWR_ON, RESET_N or an RTC alarm. When in power-off mode, TOBY-L2 modules enter the not-powered mode after removing VCC supply. The modules automatically switch from active-mode to low power idle-mode whenever possible if power saving is enabled (see sections 1.5.1.5, 1.9.1.4, 1.9.2.4 and u-blox AT Commands Manual [3], AT+UPSV). The modules wake up from idle-mode to active-mode in the following events:

Automatic periodic monitoring of the paging channel for the paging block reception according to network conditions (see 1.5.1.5) The connected USB host forces a remote wakeup of the module as USB device (see 1.9.1.4) A preset RTC alarm occurs (see u-blox AT Commands Manual [3], AT+CALA) When the modules are switched on by an appropriate power-on event (see 1.6.1), the module enter active-mode from power-off mode. If power saving configuration is enabled by the AT+UPSV command, the module automatically switches from active to idle-mode whenever possible and the module wakes up from idle to active-mode in the events listed above (see idle-mode to active-mode transition description above). When a RF Tx/Rx data connection is initiated or when RF Tx/Rx is required due to a connection previously initiated, the module switches from active to connected-mode. UBX-13004618 - R04 Advance Information System description Page 18 of 141 TOBY-L2 and MPCI-L2 series - System Integration Manual Operating Mode Description Transition between operating modes Connected-Mode RF Tx/Rx data connection is in progress. The module is prepared to accept data signals from an external device unless power saving configuration is enabled by AT+UPSV (see sections 1.9.1.4, 1.9.2.4 and u-blox AT Commands Manual [3]). When a data connection is initiated, the module enters connected-mode from idle-mode. If power saving configuration is enabled by the AT+UPSV command, the module automatically switches from connected to active and then idle-mode whenever possible and the module wakes up from idle to active and then connected mode if RF Transmission/Reception is necessary. When a data connection is terminated, the module returns to the active-mode. Table 6: TOBY-L2 and MPCI-L2 series modules operating modes description Figure 3 describes the transition between the different operating modes. Figure 3: TOBY-L2 and MPCI-L2 series modules operating modes transition UBX-13004618 - R04 Advance Information System description Page 19 of 141 TOBY-L2 Switch ON:Apply VCCMPCI-L2 Switch ON:Apply 3.3VauxIf power saving is enabled and there is no activity for a defined time intervalAny wake up event described in the module operating modes summary table aboveIncoming/outgoing call or other dedicated device network communicationNo RF Tx/Rx in progress, Call terminated, Communication droppedTOBY-L2x0 Switch ON:PWR_ONRESET_NRTC alarmNot poweredPower offActiveConnectedIdleTOBY-L2x0 Switch OFF:AT+CPWROFFRESET_NMPCI-L2:Remove 3.3VauxTOBY-L2:Remove VCC TOBY-L2 and MPCI-L2 series - System Integration Manual 1.5 Supply interfaces 1.5.1 Module supply input (VCC or 3.3Vaux) TOBY-L2 modules are supplied via the three VCC pins, and MPCI-L2 modules are supplied via the five 3.3Vaux pins. All supply voltages used inside the modules are generated from the VCC or the 3.3Vaux supply input by integrated voltage regulators, including the V_BCKP RTC supply, the V_INT generic digital interface supply, and the VSIM or UIM_PWR SIM interface supply. The current drawn by the TOBY-L2 and MPCI-L2 series modules through the VCC or 3.3Vaux pins can vary by several orders of magnitude depending on radio access technology, operation mode and state. It is important that the supply source is able to support both the high peak of current consumption during 2G transmission at maximum RF power level (as described in the section 1.5.1.2) and the high average current consumption during 3G and LTE transmission at maximum RF power level (as described in the sections 1.5.1.3 and 1.5.1.4). 1.5.1.1 VCC or 3.3Vaux supply requirements Table 7 summarizes the requirements for the VCC or 3.3Vaux modules supply. See section 2.2.1 for suggestions to properly design a VCC or 3.3Vaux supply circuit compliant with the requirements listed in Table 7. The supply circuit affects the RF compliance of the device integrating TOBY-L2 and MPCI-L2 series modules with applicable required certification schemes as well as antenna circuit design. Compliance is guaranteed if the requirements summarized in the Table 7 are fulfilled. Item Requirement Remark VCC or 3.3Vaux nominal voltage VCC or 3.3Vaux voltage during normal operation VCC or 3.3Vaux average current Within VCC or 3.3Vaux normal operating range:

See Supply/Power pins section in the TOBY-L2 Data Sheet [1] or in the MPCI-L2 Data Sheet [2]. Within VCC or 3.3Vaux extended operating range:

See Supply/Power pins section in the TOBY-L2 Data Sheet [1] or in the MPCI-L2 Data Sheet [2]. Support with adequate margin the highest averaged current consumption value in connected-mode conditions specified for VCC in TOBY-L2 Data Sheet [1]

or specified for 3.3Vaux in MPCI-L2 Data Sheet [2]. The modules cannot be switched on if the supply voltage is below the normal operating range minimum limit. The modules may switch off if the supply voltage drops below the extended operating range minimum limit. The maximum average current consumption can be greater than the specified value according to the actual antenna mismatching, temperature and supply voltage. Sections 1.5.1.2, 1.5.1.3 and 1.5.1.4 describe current consumption profiles in 2G, 3G and LTE connected-mode. VCC or 3.3Vaux peak current Support with margin the highest peak current consumption value in 2G connected-mode conditions specified for VCC in TOBY-L2 Data Sheet [1] or specified for 3.3Vaux in MPCI-L2 Data Sheet [2]. The specified maximum peak of current consumption occurs during GSM single transmit slot in 850/900 MHz connected-mode, in case of mismatched antenna. Section 1.5.1.2 describes 2G Tx peak/pulse current. VCC or 3.3Vaux voltage drop during 2G Tx slots Lower than 400 mV VCC or 3.3Vaux voltage ripple during RF transmission Noise in the supply has to be minimized VCC or 3.3Vaux under/over-shoot at start/end of Tx slots Absent or at least minimized Table 7: Summary of VCC or 3.3Vaux modules supply requirements Supply voltage drop values greater than recommended during 2G TDMA transmission slots directly affect the RF compliance with applicable certification schemes. Figure 5 describes supply voltage drop during 2G Tx slots. High supply voltage ripple values during LTE/3G/2G RF transmissions in connected-mode directly affect the RF compliance with applicable certification schemes. Figure 5 describes supply voltage ripple during RF Tx. Supply voltage under-shoot or over-shoot at the start or the end of 2G TDMA transmission slots directly affect the RF compliance with applicable certification schemes. Figure 5 describes supply voltage under/over-shoot UBX-13004618 - R04 Advance Information System description Page 20 of 141 TOBY-L2 and MPCI-L2 series - System Integration Manual 1.5.1.2 VCC or 3.3Vaux current consumption in 2G connected-mode When a GSM call is established, the VCC or 3.3Vaux module current consumption is determined by the current consumption profile typical of the GSM transmitting and receiving bursts. The peak of current consumption during a transmission slot is strictly dependent on the RF transmitted power, which is regulated by the network. The transmitted power in the transmit slot is also the more relevant factor for determining the average current consumption. If the module is transmitting in 2G single-slot mode in the 850 or 900 MHz bands, at the maximum RF power level (approximately 2 W or 33 dBm in the allocated transmit slot/burst) the current consumption can reach an high peak (see the Current consumption section in the TOBY-L2 Data Sheet [1] or the MPCI-L2 Data Sheet [2]) for 576.9 s (width of the transmit slot/burst) with a periodicity of 4.615 ms (width of 1 frame = 8 slots/burst), so with a 1/8 duty cycle according to GSM TDMA (Time Division Multiple Access). If the module is transmitting in 2G single-slot mode in the 1800 or 1900 MHz bands, the current consumption figures are quite less high than the one in the low bands, due to 3GPP transmitter output power specifications. During a GSM call, current consumption is not so significantly high in receiving or in monitor bursts and is low in the inactive unused bursts. Figure 4 shows an example of the module current consumption profile versus time in 2G single-slot mode. Figure 4: VCC or 3.3Vaux current consumption profile versus time during a 2G single-slot call (1 TX slot, 1 RX slot) Figure 5 illustrates VCC or 3.3Vaux voltage profile versus time during a 2G single-slot call, according to the relative VCC or 3.3Vaux current consumption profile described in Figure 4. Figure 5: VCC or 3.3Vaux voltage profile versus time during a 2G single-slot call (1 TX slot, 1 RX slot) UBX-13004618 - R04 Advance Information System description Page 21 of 141 Time [ms]RX slotunused slotunused slotTX slotunused slotunused slotMON slotunused slotRX slotunused slotunused slotTX slotunused slotunused slotMON slotunused slotGSM frame 4.615 ms (1 frame = 8 slots)Current [A]200 mA60-120 mA1900 mAPeak current depends on TX power and actual antenna loadGSM frame 4.615 ms (1 frame = 8 slots)60-120 mA10-40 mA0.01.51.00.52.02.5Time [ms]undershootovershootrippledropVoltage [mV]3.8 V (typ)RX slotunused slotunused slotTX slotunused slotunused slotMON slotunused slotRX slotunused slotunused slotTX slotunused slotunused slotMON slotunused slotGSM frame 4.615 ms (1 frame = 8 slots)GSM frame 4.615 ms (1 frame = 8 slots) TOBY-L2 and MPCI-L2 series - System Integration Manual When a GPRS connection is established, more than one slot can be used to transmit and/or more than one slot can be used to receive. The transmitted power depends on network conditions, which set the peak current consumption, but following the 3GPP specifications the maximum Tx RF power is reduced if more than one slot is used to transmit, so the maximum peak of current is not as high as can be in case of a 2G single-slot call. If the module transmits in GPRS class 12 in the 850 or 900 MHz bands, at the maximum RF power control level, the current consumption can reach a quite high peak but lower than the one achievable in 2G single-slot mode. This happens for 2.307 ms (width of the 4 transmit slots/bursts) with a periodicity of 4.615 ms (width of 1 frame

= 8 slots/bursts), so with a 1/2 duty cycle, according to 2G TDMA. If the module is in GPRS connected mode in the 1800 or 1900 MHz bands, the current consumption figures are quite less high than the one in the low bands, due to 3GPP transmitter output power specifications. Figure 6 reports the current consumption profiles in GPRS class 12 connected mode, in the 850 or 900 MHz bands, with 4 slots used to transmit and 1 slot used to receive. Figure 6: VCC or 3.3Vaux current consumption profile during a 2G GPRS/EDGE multi-slot connection (4 TX slots, 1 RX slot) In case of EDGE connections the VCC current consumption profile is very similar to the GPRS current profile, so the image shown in Figure 6, representing the current consumption profile in GPRS class 12 connected mode, is valid for the EDGE class 12 connected mode as well. UBX-13004618 - R04 Advance Information System description Page 22 of 141 Time [ms]RX slotunused slotTX slotTX slotTX slotTX slotMON slotunused slotRX slotunused slotTX slotTX slotTX slotTX slotMON slotunused slotGSM frame 4.615 ms (1 frame = 8 slots)Current [A]200mA60-130mAPeak current depends on TX power and actual antenna loadGSM frame 4.615 ms (1 frame = 8 slots)1600 mA0.01.51.00.52.02.5 TOBY-L2 and MPCI-L2 series - System Integration Manual 1.5.1.3 VCC or 3.3Vaux current consumption in 3G connected mode During a 3G connection, the module can transmit and receive continuously due to the Frequency Division Duplex

(FDD) mode of operation with the Wideband Code Division Multiple Access (WCDMA). The current consumption depends again on output RF power, which is always regulated by network commands. These power control commands are logically divided into a slot of 666 s, thus the rate of power change can reach a maximum rate of 1.5 kHz. There are no high current peaks as in the 2G connection, since transmission and reception are continuously enabled due to FDD WCDMA implemented in the 3G that differs from the TDMA implemented in the 2G case. In the worst scenario, corresponding to a continuous transmission and reception at maximum output power

(approximately 250 mW or 24 dBm), the average current drawn by the module at the VCC pins is high (see the Current consumption section in TOBY-L2 Data Sheet [1] or in MPCI-L2 Data Sheet [2]). Even at lowest output RF power (approximately 0.01 W or -50 dBm), the current is still not so low due to module baseband processing and transceiver activity. Figure 7 shows an example of current consumption profile of the module in 3G WCDMA/DC-HSPA+ continuous transmission mode. Figure 7: VCC or 3.3Vaux current consumption profile versus time during a 3G connection (TX and RX continuously enabled) UBX-13004618 - R04 Advance Information System description Page 23 of 141 Time [ms]3G frame 10 ms (1 frame = 15 slots)Current [mA]Current consumption value depends on TX power and actual antenna load170 mA1 slot 666 s850 mA0300200100500400600700800 TOBY-L2 and MPCI-L2 series - System Integration Manual 1.5.1.4 VCC or 3.3Vaux current consumption in LTE connected-mode During a LTE connection, the module can transmit and receive continuously due to LTE radio access technology. The current consumption is strictly dependent on the transmitted RF output power, which is always regulated by network commands. These power control commands are logically divided into a slot of 0.5 ms (time length of one Resource Block), thus the rate of power change can reach a maximum rate of 2 kHz. Figure 8 shows an example of the module current consumption profile versus time in LTE connected-mode. Detailed current consumption values can be found in TOBY-L2 Data Sheet [1] and in MPCI-L2 Data Sheet [2]. Figure 8: VCC or 3.3Vaux current consumption profile versus time during LTE connection (TX and RX continuously enabled) UBX-13004618 - R04 Advance Information System description Page 24 of 141 Time [ms]Current [mA]Current consumption value depends on TX power and actual antenna load1 Slot1 Resource Block (0.5 ms)1 LTE Radio Frame (10 ms)0300200100500400600700800 TOBY-L2 and MPCI-L2 series - System Integration Manual 1.5.1.5 VCC or 3.3Vaux current consumption in cyclic idle/active mode (power saving enabled) The power saving configuration is by default disabled, but it can be enabled using the AT+UPSV command (see the u-blox AT Commands Manual [3]). When power saving is enabled, the module automatically enters the low power idle-mode whenever possible, reducing current consumption. During low power idle-mode, the module processor runs with 32 kHz reference clock frequency. When the power saving configuration is enabled and the module is registered or attached to a network, the module automatically enters the low power idle-mode whenever possible, but it must periodically monitor the paging channel of the current base station (paging block reception), in accordance to the 2G/3G/LTE system requirements, even if connected-mode is not enabled by the application. When the module monitors the paging channel, it wakes up to the active-mode, to enable the reception of paging block. In between, the module switches to low power idle-mode. This is known as discontinuous reception (DRX). The module processor core is activated during the paging block reception, and automatically switches its reference clock frequency from 32 kHz to the 26 MHz used in active-mode. The time period between two paging block receptions is defined by the network. This is the paging period parameter, fixed by the base station through broadcast channel sent to all users on the same serving cell. In case of 2G radio access technology, the paging period can vary from 470.76 ms (DRX = 2, length of 2 x 51 2G frames = 2 x 51 x 4.615 ms) up to 2118.42 ms (DRX = 9, length of 9 x 51 2G frames = 9 x 51 x 4.615 ms). In case of 3G radio access technology, the paging period can vary from 640 ms (DRX = 6, i.e. length of 2 6 3G frames = 64 x 10 ms) up to 5120 ms (DRX = 9, length of 29 3G frames = 512 x 10 ms). In case of LTE radio access technology, the paging period can vary from 320 ms (DRX = 5, length of 25 LTE frames = 32 x 10 ms) up to 2560 ms (DRX = 8, length of 28 LTE frames = 256 x 10 ms). Figure 9 illustrates a typical example of the module current consumption profile when power saving is enabled. The module is registered with network, automatically enters the low power idle-mode and periodically wakes up to active-mode to monitor the paging channel for the paging block reception. Detailed current consumption values can be found in TOBY-L2 Data Sheet [1] and in MPCI-L2 Data Sheet [2]. Figure 9: VCC or 3.3Vaux current consumption profile with power saving enabled and module registered with the network:

the module is in idle-mode and periodically wakes up to active-mode to monitor the paging channel for paging block reception UBX-13004618 - R04 Advance Information System description Page 25 of 141

~50 msIDLE MODEACTIVE MODEIDLE MODEActive Mode EnabledIdle Mode Enabled2G case: 0.44-2.09 s 3G case: 0.61-5.09 s LTE case: 0.27-2.51 sIDLE MODE~50 msACTIVE MODETime [s]Current [mA]Time [ms]Current [mA]RX Enabled01000100 TOBY-L2 and MPCI-L2 series - System Integration Manual 1.5.1.6 VCC or 3.3Vaux current consumption in fixed active-mode (power saving disabled) When power saving is disabled, the module does not automatically enter the low power idle-mode whenever possible: the module remains in active-mode. Power saving configuration is by default disabled. It can also be disabled using the AT+UPSV command (see u-blox AT Commands Manual [3] for detail usage). The module processor core is activated during idle-mode, and the 26 MHz reference clock frequency is used. It would draw more current during the paging period than that in the power saving mode. Figure 10 illustrates a typical example of the module current consumption profile when power saving is disabled. In such case, the module is registered with the network and while active-mode is maintained, the receiver is periodically activated to monitor the paging channel for paging block reception. Figure 10: VCC or 3.3Vaux current consumption profile with power saving disabled and module registered with the network:

active-mode is always held and the receiver is periodically activated to monitor the paging channel for paging block reception UBX-13004618 - R04 Advance Information System description Page 26 of 141 ACTIVE MODE2G case: 0.44-2.09 s 3G case: 0.61-5.09 sLTE case: 0.32-2.56 sPaging periodTime [s]Current [mA]Time [ms]Current [mA]RX Enabled01000100 TOBY-L2 and MPCI-L2 series - System Integration Manual 1.5.2 RTC supply input/output (V_BCKP) The RTC supply V_BCKP pin is not available on MPCI-L2 series modules. The V_BCKP pin of TOBY-L2 series modules connects the supply for the Real Time Clock (RTC). A linear LDO regulator integrated in the Power Management Unit internally generates this supply, as shown in Figure 11, with low current capability (see the TOBY-L2 series Data Sheet [1]). The output of this regulator is always enabled when the main module voltage supply applied to the VCC pins is within the valid operating range. Figure 11: TOBY-L2 series RTC supply (V_BCKP) simplified block diagram The RTC provides the module time reference (date and time) that is used to set the wake-up interval during the low power idle-mode periods, and is able to make available the programmable alarm functions. The RTC functions are available also in power-down mode when the V_BCKP voltage is within its valid range

(specified in the Input characteristics of Supply/Power pins table in TOBY-L2 series Data Sheet [1]). The RTC can be supplied from an external back-up battery through the V_BCKP, when the main module voltage supply is not applied to the VCC pins. This lets the time reference (date and time) run until the V_BCKP voltage is within its valid range, even when the main supply is not provided to the module. Consider that the module cannot switch on if a valid voltage is not present on VCC even when the RTC is supplied through V_BCKP (meaning that VCC is mandatory to switch on the module). The RTC has very low current consumption, but is highly temperature dependent. For example, V_BCKP current consumption at the maximum operating temperature can be higher than the typical value at 25 C specified in the Input characteristics of Supply/Power pins table in the TOBY-L2 series Data Sheet [1]. If V_BCKP is left unconnected and the module main supply is not applied to the VCC pins, the RTC is supplied from the bypass capacitor mounted inside the module. However, this capacitor is not able to provide a long buffering time: within few milliseconds the voltage on V_BCKP will go below the valid range (1.4 V min). This has no impact on cellular connectivity, as all the module functionalities do not rely on date and time setting. UBX-13004618 - R04 Advance Information System description Page 27 of 141 Baseband Processor70VCC71VCC72VCC3V_BCKPLinear LDOPower ManagementTOBY-L2 series32 kHzRTC TOBY-L2 and MPCI-L2 series - System Integration Manual 1.5.3 Generic digital interfaces supply output (V_INT) The generic digital interfaces supply V_INT pin is not available on MPCI-L2 series modules. The V_INT output pin of the TOBY-L2 series modules is connected to an internal 1.8 V supply with current capability specified in the TOBY-L2 series Data Sheet [1]. This supply is internally generated by a switching step-

down regulator integrated in the Power Management Unit and it is internally used to source the generic digital I/O interfaces of the TOBY-L2 module, as described in Figure 12. The output of this regulator is enabled when the module is switched on and it is disabled when the module is switched off. Figure 12: TOBY-L2 series generic digital interfaces supply output (V_INT) simplified block diagram The switching regulator operates in Pulse Width Modulation (PWM) mode for greater efficiency at high output loads and it automatically switches to Pulse Frequency Modulation (PFM) power save mode for greater efficiency at low output loads. The V_INT output voltage ripple is specified in the TOBY-L2 series Data Sheet [1]. UBX-13004618 - R04 Advance Information System description Page 28 of 141 Baseband Processor70VCC71VCC72VCC5V_INTSwitchingStep-DownPower ManagementTOBY-L2 seriesDigital I/O TOBY-L2 and MPCI-L2 series - System Integration Manual 1.6 System function interfaces 1.6.1 Module power-on The PWR_ON input pin is not available on MPCI-L2 series modules. When the TOBY-L2 and MPCI-L2 series modules are in the not-powered mode (switched off, i.e. the VCC or 3.3Vaux module supply is not applied), they can be switched on as following:

Rising edge on the VCC or 3.3Vaux supply input to a valid voltage for module supply, so that the module switches on applying a proper VCC or 3.3Vaux supply within the normal operating range. Alternately, the RESET_N or PERST# pin can be held to the low level during the VCC or 3.3Vaux rising edge, so that the module switches on releasing the RESET_N or PERST# pin when the VCC or 3.3Vaux module supply voltage stabilizes at its proper nominal value within the normal operating range. The status of the PWR_ON input pin of TOBY-L2 modules while applying the VCC module supply is not relevant:

during this phase the PWR_ON pin can be set high or low by the external circuit. When the TOBY-L2 modules are in the power-off mode (i.e. switched off with valid VCC module supply applied), they can be switched on as following:

Low level on the PWR_ON pin, which is normally set high by an internal pull-up, for a valid time period. Low level on the RESET_N pin, which is normally set high by an internal pull-up, for a valid time period. RTC alarm, i.e. pre-programmed alarm by AT+CALA command (see u-blox AT Commands Manual [3]). As described in Figure 13, the TOBY-L2 series PWR_ON input is equipped with an internal active pull-up resistor to the VCC module supply: the PWR_ON input voltage thresholds are different from the other generic digital interfaces. Detailed electrical characteristics are described in TOBY-L2 series Data Sheet [1]. Figure 13: TOBY-L2 series PWR_ON input description For more pin information and electrical characteristics, see the TOBY-L2 Data Sheet [1] and MPCI-L2 Data Sheet [2]. UBX-13004618 - R04 Advance Information System description Page 29 of 141 Baseband Processor20PWR_ONTOBY-L2 seriesVCCPower-onPower ManagementPower-on50k TOBY-L2 and MPCI-L2 series - System Integration Manual Figure 14 shows the module power-on sequence from the not-powered mode, describing the following phases:

The external supply is applied to the VCC or 3.3Vaux module supply inputs, representing the start-up event. The PWR_ON and the RESET_N or PERST# pins suddenly rise to high logic level due to internal pull-ups. The V_BCKP RTC supply output is suddenly enabled by the module as VCC reaches a valid voltage value. All the generic digital pins of the module are tri-stated until the switch-on of their supply source (V_INT). The internal reset signal is held low: the baseband core and all the digital pins are held in the reset state. The reset state of all the digital pins is reported in the pin description table of TOBY-L2 Series Data Sheet [1]. When the internal reset signal is released, any digital pin is set in a proper sequence from the reset state to the default operational configured state. The duration of this pins configuration phase differs within generic digital interfaces and the USB interface due to host / device enumeration timings (see section 1.9.1). The module is fully ready to operate after all interfaces are configured. Figure 14: TOBY-L2 and MPCI-L2 series power-on sequence description The Internal Reset signal is not available on a module pin, but the host application can monitor:

The V_INT pin to sense the start of the TOBY-L2 module power-on sequence. The USB interface to sense the start of the MPCI-L2 module power-on sequence: the module, as USB device, informs the host of the attach event via a reply on its status change pipe for proper bus enumeration process according to Universal Serial Bus Revision 2.0 specification [6]. Before the switch-on of the generic digital interface supply source (V_INT) of the module, no voltage driven by an external application should be applied to any generic digital interface of TOBY-L2 module. Before the TOBY-L2 and MPCI-L2 series module is fully ready to operate, the host application processor should not send any AT command over the AT communication interfaces (USB, UART) of the module. UBX-13004618 - R04 Advance Information System description Page 30 of 141 VCC or 3.3VauxV_BCKPPWR_ONRESET_N or PERST#V_INTInternal ResetSystem StateBB Pads StateInternal Reset OperationalOperationalTristate / Floating Internal ResetOFFON0 ms~10ms~20sStart of interface configurationModule interfaces are configuredStart-up event~5 ms TOBY-L2 and MPCI-L2 series - System Integration Manual 1.6.2 Module power-off TOBY-L2 series can be properly switched off by:

AT+CPWROFF command (see u-blox AT Commands Manual [3]). The current parameter settings are saved in the modules non-volatile memory and a proper network detach is performed. The MPCI-L2 series modules do not switch off by the AT+CPWROFF command as the TOBY-L2 modules, but the AT+CPWROFF command causes a reset (reboot) of the module due to the MPCI-L2 modules internal configuration: the command stores the actual parameter settings in the non-volatile memory of MPCI-L2 modules and performs a network detach, with a subsequent reset (reboot) of the module. An abrupt under-voltage shutdown occurs on TOBY-L2 and MPCI-L2 series modules when the VCC or 3.3Vaux module supply is removed. If this occurs, it is not possible to perform the storing of the current parameter settings in the modules non-volatile memory or to perform the proper network detach. It is highly recommended to avoid an abrupt removal of the VCC supply during TOBY-L2 modules normal operations: the power off procedure must be started by the AT+CPWROFF command, waiting the command response for a proper time period (see u-blox AT Commands Manual [3]), and then a proper VCC supply has to be held at least until the end of the modules internal power off sequence, which occurs when the generic digital interfaces supply output (V_INT) is switched off by the module. It is highly recommended to avoid an abrupt removal of the 3.3Vaux supply during MPCI-L2 modules normal operations: the power off procedure must be started by setting the MPCI-L2 module in the halt mode by the AT+CFUN=127 command (which stores the actual parameter settings in the non-volatile memory of the module and performs a network detach), waiting the command response for a proper time period (see the u-blox AT Commands Manual [3]), and then the 3.3Vaux supply can be removed. An abrupt hardware shutdown occurs on TOBY-L2 series modules when a low level is applied on the RESET_N pin for a specific time period. In this case, the current parameter settings are not saved in the modules non-volatile memory and a proper network detach is not performed. It is highly recommended to avoid an abrupt hardware shutdown of the module by forcing a low level on the RESET_N input pin during module normal operation: the RESET_N line should be set low only if reset or shutdown via AT commands fails or if the module does not reply to a specific AT command after a time period longer than the one defined in the u-blox AT Commands Manual [3]. An over-temperature or an under-temperature shutdown occurs on TOBY-L2 and MPCI-L2 series modules when the temperature measured within the cellular module reaches the dangerous area, if the optional Smart Temperature Supervisor feature is enabled and configured by the dedicated AT command. For more details see u-blox AT Commands Manual [3], +USTS AT command. The Smart Temperature Supervisor feature is not supported by the TOBY-L2x0-00S and MPCI-L2x0-00S product versions. UBX-13004618 - R04 Advance Information System description Page 31 of 141 TOBY-L2 and MPCI-L2 series - System Integration Manual Figure 15 describes the TOBY-L2 power-off sequence by means of AT+CPWROFF with the following phases:

When the +CPWROFF AT command is sent, the module starts the switch-off routine. The module replies OK on the AT interface: the switch-off routine is in progress. At the end of the switch-off routine, all the digital pins are tri-stated and all the internal voltage regulators are turned off, including the generic digital interfaces supply (V_INT), except the RTC supply (V_BCKP). Then, the module remains in power-off mode as long as a switch on event does not occur (e.g. applying a proper low level to the PWR_ON input, or applying a proper low level to the RESET_N input), and enters not-powered mode if the supply is removed from the VCC pins. Figure 15: TOBY-L2 series power-off sequence description The Internal Reset signal is not available on a module pin, but the application can monitor the V_INT pin to sense the end of the power-off sequence. Figure 16 describes the MPCI-L2 power-off procedure with the following phases:

When the AT+CFUN=127 command is issued, the module starts the halt mode setting routine. The module replies OK on the AT interface: after this, the module is set in the halt mode. Then, the module remains in the Halt mode and enters not-powered mode if the supply is removed from the 3.3Vaux pins. Figure 16: MPCI-L2 series power-off procedure description The duration of each phase in the TOBY-L2 and MPCI-L2 series modules switch-off routines can largely vary depending on the application / network settings and the concurrent module activities. UBX-13004618 - R04 Advance Information System description Page 32 of 141 VCC V_BCKPPWR_ONRESET_N V_INTInternal ResetSystem StateBB Pads StateOperationalOFFTristate / FloatingONOperational TristateAT+CPWROFFsent to the module0 s~2.5 s~5 sOKreplied by the moduleVCC can be removed3.3VauxPERST#Internal ResetSystem StateBB Pads StateOFFONTristate / FloatingOperationalAT+CFUN=127sent to the module0 s~2.5 s~5 sOKreplied by the module3.3Vaux can be removed TOBY-L2 and MPCI-L2 series - System Integration Manual 1.6.3 Module reset TOBY-L2 and MPCI-L2 series modules can be properly reset (rebooted) by:

AT+CFUN command (see u-blox AT Commands Manual [3]). MPCI-L2 series modules can be additionally properly reset (rebooted) by:

AT+CPWROFF command (see u-blox AT Commands Manual [3]): the behavior differs than TOBY-L2 series, as MPCI-L2 modules will reboot rather than remain switched off due to modules internal configuration. In the cases listed above an internal or software reset of the module is executed: the current parameter settings are saved in the modules non-volatile memory and a proper network detach is performed. An abrupt hardware reset occurs on TOBY-L2 and MPCI-L2 series modules when a low level is applied on the RESET_N or PERST# input pin for a specific time period. In this case, the current parameter settings are not saved in the modules non-volatile memory and a proper network detach is not performed. It is highly recommended to avoid an abrupt hardware reset of the module by forcing a low level on the RESET_N or PERST# input during modules normal operation: the RESET_N or PERST# line should be set low only if reset or shutdown via AT commands fails or if the module does not provide a reply to a specific AT command after a time period longer than the one defined in the u-blox AT Commands Manual [3]. As described in Figure 17, the RESET_N and PERST# input pins are equipped with an internal pull-up to the VCC supply in the TOBY-L2 series and to the 3.3 V in the MPCI-L2 series. Figure 17: TOBY-L2 and MPCI-L2 series RESET_N and PERST# input equivalent circuit description For more electrical characteristics details see TOBY-L2 Data Sheet [1] and MPCI-L2 Data Sheet [2]. 1.6.4 Module configuration selection by host processor The HOST_SELECT0 and HOST_SELECT1 pins are not available on MPCI-L2 series modules. The functionality of the HOST_SELECT0 and HOST_SELECT1 pins is not supported by TOBY-L2x0-00S. TOBY-L2 series modules include two input pins (HOST_SELECT0 and HOST_SELECT1) for the selection of the module configuration by the host application processor. UBX-13004618 - R04 Advance Information System description Page 33 of 141 Baseband Processor23RESET_NTOBY-L2 seriesVCCResetPower ManagementReset50kBaseband Processor22PERST#MPCI-L2 seriesResetPower ManagementReset45k3.3 V TOBY-L2 and MPCI-L2 series - System Integration Manual 1.7 Antenna interface 1.7.1 Antenna RF interfaces (ANT1 / ANT2) TOBY-L2 and MPCI-L2 series modules provide two RF interfaces for connecting the external antennas:

The ANT1 represents the primary RF input/output for transmission and reception of LTE/3G/2G RF signals. The ANT1 pin of TOBY-L2 series modules has a nominal characteristic impedance of 50 and must be connected to the primary Tx / Rx antenna through a 50 transmission line to allow proper RF transmission and reception. The ANT1 Hirose U.FL-R-SMT coaxial connector receptacle of MPCI-L2 series modules has a nominal characteristic impedance of 50 and must be connected to the primary Tx / Rx antenna through a mated RF plug with a 50 coaxial cable assembly to allow proper RF transmission and reception. The ANT2 represents the secondary RF input for the reception of the LTE RF signals for the Down-Link MIMO 2 x 2 radio technology supported by TOBY-L2 and MPCI-L2 series modules as required feature for LTE category 4 UEs, and for the reception of the 3G RF signals for the Down-Link Rx diversity radio technology supported by TOBY-L2 and MPCI-L2 series modules as additional feature for 3G DC-HSDPA category 24 UEs. The ANT2 pin of TOBY-L2 series modules has a nominal characteristic impedance of 50 and must be connected to the secondary Rx antenna through a 50 transmission line to allow proper RF reception. The ANT2 Hirose U.FL-R-SMT coaxial connector receptacle of MPCI-L2 series modules has a nominal characteristic impedance of 50 and must be connected to the secondary Rx antenna through a mated RF plug with a 50 coaxial cable assembly to allow proper RF reception. The Multiple Input Multiple Output (MIMO) radio technology is an essential component of LTE radio systems based on the use of multiple antennas at both the transmitter and receiver sides to improve communication performance and achieve highest possible bit rate. A MIMO m x n system consists of m transmit and n receive antennas, where the data to be transmitted is divided into m independent data streams. Note that the terms Input and Output refer to the radio channel carrying the signal, not to the devices having antennas, so that in the Down-Link MIMO 2 x 2 system supported by TOBY-L2 and MPCI-L2 series modules:

The LTE data stream is divided into 2 independent streams by the Tx-antennas of the base station The cellular modules, at the receiver side, receives both LTE data streams by 2 Rx-antennas (ANT1 / ANT2) Figure 18: Description of the LTE Down-Link MIMO 2 x 2 radio technology supported by TOBY-L2 and MPCI-L2 series modules TOBY-L2 and MPCI-L2 series modules support the LTE MIMO 2 x 2 radio technology in the Down-Link path only

(from the base station to the module): the ANT1 port is the only one RF interface that is used by the module to transmit the RF signal in the Up-Link path (from the module to the base station). UBX-13004618 - R04 Advance Information System description Page 34 of 141 Base StationTx-1 AntennaTx-2 AntennaTOBY-L2 seriesMPCI-L2 seriesANT1Rx-1 AntennaANT2Rx-2 AntennaData Stream 1Data Stream 2 TOBY-L2 and MPCI-L2 series - System Integration Manual 1.7.1.1 Antenna RF interfaces requirements Table 8, Table 9 and Table 10 summarize the requirements for the antennas RF interfaces (ANT1 / ANT2). See section 2.4.1 for suggestions to properly design antennas circuits compliant with these requirements. The antenna circuits affect the RF compliance of the device integrating TOBY-L2 and MPCI-L2 series modules with applicable required certification schemes (for more details see section 4). Compliance is guaranteed if the antenna RF interfaces (ANT1 / ANT2) requirements summarized in Table 8, Table 9 and Table 10 are fulfilled. Item Requirements Remarks Impedance 50 nominal characteristic impedance Frequency Range See the TOBY-L2 series Data Sheet [1] and the MPCI-L2 series Data Sheet [2]

Return Loss S11 < -10 dB (VSWR < 2:1) recommended S11 < -6 dB (VSWR < 3:1) acceptable Efficiency

> -1.5 dB ( > 70% ) recommended

> -3.0 dB ( > 50% ) acceptable Maximum Gain According to radiation exposure limits Input Power

> 33 dBm ( > 2 W ) The impedance of the antenna RF connection must match the 50 impedance of the ANT1 port. The required frequency range of the antenna connected to ANT1 port depends on the operating bands of the used cellular module and the used mobile network. The Return loss or the S11, as the VSWR, refers to the amount of reflected power, measuring how well the primary antenna RF connection matches the 50 characteristic impedance of the ANT1 port. The impedance of the antenna termination must match as much as possible the 50 nominal impedance of the ANT1 port over the operating frequency range, reducing as much as possible the amount of reflected power. The radiation efficiency is the ratio of the radiated power to the power delivered to antenna input: the efficiency is a measure of how well an antenna receives or transmits. The radiation efficiency of the antenna connected to the ANT1 port needs to be enough high over the operating frequency range to comply with the Over-The-Air (OTA) radiated performance requirements, as Total Radiated Power (TRP) and the Total Isotropic Sensitivity (TIS), specified by applicable related certification schemes. The power gain of an antenna is the radiation efficiency multiplied by the directivity: the gain describes how much power is transmitted in the direction of peak radiation to that of an isotropic source. The maximum gain of the antenna connected to ANT1 port must not exceed the herein stated value to comply with regulatory agencies radiation exposure limits. For additional info see the section 4.2.2. The antenna connected to the ANT1 port must support with adequate margin the maximum power transmitted by the modules. Table 8: Summary of primary Tx/Rx antenna RF interface (ANT1) requirements UBX-13004618 - R04 Advance Information System description Page 35 of 141 TOBY-L2 and MPCI-L2 series - System Integration Manual Item Requirements Remarks Impedance 50 nominal characteristic impedance Frequency Range See the TOBY-L2 series Data Sheet [1] and the MPCI-L2 series Data Sheet [2]

Return Loss S11 < -10 dB (VSWR < 2:1) recommended S11 < -6 dB (VSWR < 3:1) acceptable Efficiency

> -1.5 dB ( > 70% ) recommended

> -3.0 dB ( > 50% ) acceptable The impedance of the antenna RF connection must match the 50 impedance of the ANT2 port. The required frequency range of the antennas connected to ANT2 port depends on the operating bands of the used cellular module and the used Mobile Network. The Return loss or the S11, as the VSWR, refers to the amount of reflected power, measuring how well the secondary antenna RF connection matches the 50 characteristic impedance of the ANT2 port. The impedance of the antenna termination must match as much as possible the 50 nominal impedance of the ANT2 port over the operating frequency range, reducing as much as possible the amount of reflected power. The radiation efficiency is the ratio of the radiated power to the power delivered to antenna input: the efficiency is a measure of how well an antenna receives or transmits. The radiation efficiency of the antenna connected to the ANT2 port needs to be enough high over the operating frequency range to comply with the Over-The-Air (OTA) radiated performance requirements, as the TIS, specified by applicable related certification schemes. Table 9: Summary of secondary Rx antenna RF interface (ANT2) requirements Item Requirements Remarks Efficiency imbalance < 0.5 dB recommended

< 1.0 dB acceptable Envelope Correlation Coefficient

< 0.4 recommended

< 0.5 acceptable Isolation

> 15 dB recommended

> 10 dB acceptable The radiation efficiency imbalance is the ratio of the primary (ANT1) antenna efficiency to the secondary

(ANT2) antenna efficiency: the efficiency imbalance is a measure of how much better an antenna receives or transmits compared to the other antenna. The radiation efficiency of the secondary antenna needs to be roughly the same of the radiation efficiency of the primary antenna for good RF performance. The Envelope Correlation Coefficient (ECC) between the primary (ANT1) and the secondary (ANT2) antenna is an indicator of 3D radiation pattern similarity between the two antennas: low ECC results from antenna patterns with radiation lobes in different directions. The ECC between primary and secondary antenna needs to be enough low to comply with radiated performance requirements specified by related certification schemes. The antenna to antenna isolation is the loss between the primary (ANT1) and the secondary (ANT2) antenna: high isolation results from low coupled antennas. The isolation between primary and secondary antenna needs to be high for good RF performance. Table 10: Summary of primary (ANT1) and secondary (ANT2) antennas relationship requirements UBX-13004618 - R04 Advance Information System description Page 36 of 141 TOBY-L2 and MPCI-L2 series - System Integration Manual 1.7.2 Antenna detection interface (ANT_DET) Antenna detection interface (ANT_DET) is not available on MPCI-L2 series modules. Antenna detection interface (ANT_DET) is not supported by the TOBY-L2x0-00S product version. The antenna detection is based on ADC measurement. The ANT_DET pin is an Analog to Digital Converter

(ADC) provided to sense the antenna presence. The antenna detection function provided by ANT_DET pin is an optional feature that can be implemented if the application requires it. The antenna detection is forced by the +UANTR AT command. See the u-blox AT Commands Manual [3] for more details on this feature. The ANT_DET pin generates a DC current (for detailed characteristics see the TOBY-L2 series Data Sheet [1]) and measures the resulting DC voltage, thus determining the resistance from the antenna connector provided on the application board to GND. So, the requirements to achieve antenna detection functionality are the following:

an RF antenna assembly with a built-in resistor (diagnostic circuit) must be used an antenna detection circuit must be implemented on the application board See section 2.4.2 for antenna detection circuit on application board and diagnostic circuit on antenna assembly design-in guidelines. 1.8 SIM interface 1.8.1 SIM interface TOBY-L2 and MPCI-L2 series modules provide high-speed SIM/ME interface including automatic detection and configuration of the voltage required by the connected SIM card or chip. Both 1.8 V and 3 V SIM types are supported. Activation and deactivation with automatic voltage switch from 1.8 V to 3 V are implemented, according to ISO-IEC 7816-3 specifications. The VSIM or UIM_PWR supply output provides internal short circuit protection to limit start-up current and protect the SIM to short circuits. The SIM driver supports the PPS (Protocol and Parameter Selection) procedure for baud-rate selection, according to the values determined by the SIM card or chip. 1.8.2 SIM detection interface SIM detection interface (GPIO5) is not available on MPCI-L2 series modules. SIM detection interface (GPIO5) is not supported by the TOBY-L2x0-00S product version. The GPIO5 pin is by default configured to detect the SIM card mechanical / physical presence. The pin is configured as input with an internal active pull-down enabled, and it can sense SIM card presence only if properly connected to the mechanical switch of a SIM card holder as described in section 2.5:

Low logic level at GPIO5 input pin is recognized as SIM card not present High logic level at GPIO5 input pin is recognized as SIM card present The SIM card detection function provided by GPIO5 pin is an optional feature that can be implemented / used or not according to the application requirements: an Unsolicited Result Code (URC) is generated each time that there is a change of status (for more details see the u-blox AT Commands Manual [3]). The optional function SIM card hot insertion/removal can be additionally enabled on the GPIO5 pin by specific AT command (see the u-blox AT Commands Manual [3]). UBX-13004618 - R04 Advance Information System description Page 37 of 141 TOBY-L2 and MPCI-L2 series - System Integration Manual 1.9 Data communication interfaces TOBY-L2 and MPCI-L2 series modules provide the following serial communication interface:

USB interface: High-Speed USB 2.0 compliant interface available for the communication with an external host application processor, for AT commands, data communication, FW upgrade by means of the FOAT feature, FW upgrade by means of the u-blox EasyFlash tool and for diagnostic purpose (see section 1.9.1 for functional description) TOBY-L2 series modules additionally provide the following serial communication interfaces:

UART interface: asynchronous serial interface available for the communication with an external host application processor, for AT commands, data communication, FW upgrade by means of the FOAT feature

(see section 1.9.2 for functional description) DDC interface: I2C bus compatible interface available for the communication with u-blox GNSS positioning chips/modules and with external I2C devices as an audio codec (see section 1.9.3 for functional description) SDIO interface: Secure Digital Input Output interface available for the communication with an external Wi-Fi chip or module (see section 1.9.4 for functional description) 1.9.1 Universal Serial Bus (USB) 1.9.1.1 USB features TOBY-L2 and MPCI-L2 series modules include a High-Speed USB 2.0 compliant interface with maximum data rate of 480 Mb/s, representing the main interface for transferring high speed data with a host application processor: the USB interface is available for AT commands, data communication, FW upgrade by means of the FOAT feature, FW upgrade by means of the u-blox EasyFlash tool and for diagnostic purpose.The module itself acts as a USB device and can be connected to a USB host such as a Personal Computer or an embedded application microprocessor equipped with compatible drivers. The USB_D+ / USB_D- lines carry the USB serial bus data and signaling, providing all the functionalities for the bus attachment, configuration, enumeration, suspension or remote wakeup according to the Universal Serial Bus Revision 2.0 specification [6]

The additional VUSB_DET input pin is available on TOBY-L2 series modules as optional feature to sense the USB VBUS supply (5.0 V typical) from the host, providing the complete bus detach functionality for further reduction of the module current consumption in particular during low-power idle mode with power saving enabled:

TOBY-L2 series modules disable the USB interface when a low logic level is sensed after a high-to-low logic level transition on the VUSB_DET input pin, reducing the current consumption. The VUSB_DET pin is not available on MPCI-L2 series modules. The USB interface is controlled and operated with:

AT commands according to 3GPP TS 27.007 [8], 3GPP TS 27.005 [9], 3GPP TS 27.010 [10]

u-blox AT commands For the complete list of supported AT commands and their syntax see u-blox AT Commands Manual [3]. UBX-13004618 - R04 Advance Information System description Page 38 of 141 TOBY-L2 and MPCI-L2 series - System Integration Manual TOBY-L2 and MPCI-L2 modules provide by default the following USB profile with the listed set of USB functions:

1 RNDIS for Ethernet-over-USB connection 1 CDC-ACM for AT commands and data communication The USB profile of TOBY-L2 and MPCI-L2 modules identifies itself by its VID (Vendor ID) and PID (Product ID) combination, included in the USB device descriptor according to the USB 2.0 specifications [6]. The VID and PID of the default USB profile configuration with the set of functions described above (1 RNDIS for Ethernet-over-USB and 1 CDC-ACM for AT commands and data) are the following:

VID = 0x1546 PID = 0x1146 Figure 19 summarizes the USB end-points available with the default USB profile configuration. Figure 19: TOBY-L2 and MPCI-L2 series USB End-Points summary for the default USB profile configuration The USB of the modules can be configured by the AT+UUSBCONF command (for more details see the u-blox AT Commands Manual [3]) to select different sets of USB functions available in mutually exclusive way, selecting the active USB profile consisting of a specific set of functions with various capabilities and purposes, such as:

CDC-ACM for AT commands and data CDC-ACM for GNSS tunneling CDC-ACM for SIM Access Profile (SAP) CDC-ACM for diagnostic RNDIS for Ethernet-over-USB CDC-ECM for Ethernet-over-USB CDC-NCM for Ethernet-over-USB MBIM for Ethernet-over-USB CDC-ACM for GNSS tunneling, CDC-ACM for SIM Access Profile (SAP), and CDC-NCM and MBIM functions are not supported by the TOBY-L2x0-00S and MPCI-L2x0-00S product versions. UBX-13004618 - R04 Advance Information System description Page 39 of 141 Default profile configurationInterface 0Wireless Controller Remote NDISInterface 1Communication DataEndPointTransfer: InterruptEndPointTransfer: BulkEndPointTransfer: BulkInterface 2Communication Control AT commandsEndPointTransfer: InterruptInterface 3Communication DataEndPointTransfer: BulkEndPointTransfer: BulkFunction RNDISFunction CDC Serial TOBY-L2 and MPCI-L2 series - System Integration Manual For example, the default USB profile configuration which provides 2 functions (1 RNDIS for Ethernet-over-USB and 1 CDC-ACM for AT commands and data) can be changed by means of the AT+UUSBCONF command switching to a USB profile configuration which provides the following 6 functions:

3 CDC-ACM for AT commands and data 1 CDC-ACM for GNSS tunneling 1 CDC-ACM for SIM Access Profile (SAP) 1 CDC-ACM for diagnostic As each USB profile of TOBY-L2 and MPCI-L2 modules identifies itself by its specific VID and PID combination included in the USB device descriptor according to the USB 2.0 specifications [6], the VID and PID combination changes as following by switching the active USB profile configuration to the set of 6 functions described above:

VID = 0x1546 PID = 0x1141 Alternatively, as another example, the USB profile configuration can be changed by means of the AT+UUSBCONF command switching to a USB profile configuration which provides the following 4 functions:

1 CDC-ECM for Ethernet-over-USB 3 CDC-ACM for AT commands and data In case of this USB profile with the set of 4 functions described above, the VID and PID are the following:

VID = 0x1546 PID = 0x1143 The switch of the active USB profile selected by the AT+UUSBCONF command is not performed immediately. The settings are saved in the non-volatile memory of the module at the power off, and the new configuration is effective at the subsequent reboot of the module. If the USB is connected to the host before the module is switched on, or if the module is reset (rebooted) with the USB connected to the host, the VID and PID are automatically updated during the boot of the module. First, VID and PID are the following:

VID = 0x1546 PID = 0x1140 This VID and PID combination identifies a USB profile where no USB function described above is available: AT commands must not be sent to the module over the USB profile identified by this VID and PID combination. Then, after a time period (roughly 20 s, depending on the host / device enumeration timings), the VID and PID are updated to the ones related to the USB profile selected by the AT+UUSBCONF command. For more details regarding the TOBY-L2 and MPCI-L2 series modules USB configurations and capabilities, see the u-blox AT Commands Manual [3], +UUSBCONF AT command. UBX-13004618 - R04 Advance Information System description Page 40 of 141 TOBY-L2 and MPCI-L2 series - System Integration Manual 1.9.1.2 USB in Windows The USB drivers (INF files) are provided for Windows systems and should be installed properly by following the step-by-step instruction in EVK-L20 / EVK-L21 User Guide [4]. USB drivers are available for the following operating system platforms:

Windows Vista Windows 7 Windows 8 Windows 8.1 Windows Embedded Compact 7 The module firmware can be upgraded over the USB interface by means of the FOAT feature, or using the u-blox EasyFlash tool (for more details see Firmware Update Application Note [4]). 1.9.1.3 USB in Linux/Android It is not required to install a specific driver for each Linux-based or Android-based operating system (OS) to use the module USB interface, which is compatible with standard Linux/Android USB kernel drivers. The full capability and configuration of the module USB interface can be reported by running lsusb v or an equivalent command available in the host operating system when the module is connected. 1.9.1.4 USB and power saving If power saving is enabled by the AT+UPSV command, the modules automatically enter the USB suspended state when the device has observed no bus traffic for a specific time period according to the USB 2.0 specification [6]. In suspended state, the module maintains any USB internal status as device. In addition, the module enters the suspended state when the hub port it is attached to is disabled. This is referred to as USB selective suspend. The module exits suspend mode when there is bus activity. If the USB is connected and not suspended, the module is forced to stay in active-mode, therefore the AT+UPSV settings are overruled but they have effect on the power saving configuration of the other interfaces. The modules are capable of USB remote wake-up signaling: i.e. it may request the host to exit suspend mode or selective suspend by using electrical signaling to indicate remote wake-up. This notifies the host that it should resume from its suspended mode, if necessary, and service the external event. Remote wake-up is accomplished using electrical signaling described in the USB 2.0 specifications [6]. For the module current consumption description with power saving enabled and USB suspended, or with power saving disabled and USB not suspended, see the sections 1.5.1.5, 1.5.1.6 and the TOBY-L2 Data Sheet [1] or the MPCI-L2 Data Sheet [2]. The additional VUSB_DET input pin available on TOBY-L2 series modules provides the complete bus detach functionality: the modules disable the USB interface when a low logic level is sensed after a high-to-low logic level transition on the VUSB_DET input pin. This allows a further reduction of the module current consumption, in particular as compared to the USB suspended status during low-power idle mode with power saving enabled. UBX-13004618 - R04 Advance Information System description Page 41 of 141 TOBY-L2 and MPCI-L2 series - System Integration Manual 1.9.2 Asynchronous serial interface (UART) The UART interface is not available on MPCI-L2 series modules. The UART interface is not supported by the TOBY-L2x0-00S product version. 1.9.2.1 UART features The UART interface is a 9-wire 1.8 V unbalanced asynchronous serial interface (UART) that can be connected to an application host processor for AT commands and data communication. The module firmware can be upgraded over the UART interface by means of the Firmware upgrade over AT

(FOAT) feature only: for more details see section 1.15 and Firmware update application note [4]. UART interface provides RS-232 functionality conforming to the ITU-T V.24 Recommendation (more details available in ITU Recommendation [7]), with CMOS compatible signal levels: 0 V for low data bit or ON state, and 1.8 V for high data bit or OFF state. For detailed electrical characteristics see TOBY-L2 Data Sheet [1]. TOBY-L2 modules are designed to operate as LTE/3G/2G cellular modems, i.e. the data circuit-terminating equipment (DCE) is according to the ITU-T V.24 Recommendation [7]. A customer application processor connected to the module through the UART interface represents the data terminal equipment (DTE). The signal names of the UART interface of the TOBY-L2 series modules conform to the ITU-T V.24 Recommendation [7]: e.g. TXD line represents the data transmitted by the DTE (application processor data output) and received by the DCE (module data input). The UART interface is controlled and operated with:

AT commands according to 3GPP TS 27.007 [8], 3GPP TS 27.005 [9], 3GPP TS 27.010 [10]

u-blox AT commands For the complete list of supported AT commands and their syntax see u-blox AT Commands Manual [3]. 1.9.2.2 UART interface configuration The UART interface of TOBY-L2 series modules is configured as described in Table 11 (for information about further settings, see the u-blox AT Commands Manual [3]). Interface AT Settings Comments UART interface AT interface: enabled AT command interface is enabled by default on the UART physical interface MUX protocol: disabled Multiplexing mode is disabled by default and it can be enabled by AT+CMUX command. For more details, see the Mux Implementation Application Note [11]. The following virtual channels are defined:

Channel 0: Control channel Channel 1 5: AT commands / data connection Channel 6: GNSS tunneling Channel 7: SIM Access Profile Table 11: Default UART interface configuration UBX-13004618 - R04 Advance Information System description Page 42 of 141 TOBY-L2 and MPCI-L2 series - System Integration Manual 1.9.2.3 UART signals behavior At the module switch-on, before the UART interface initialization (as described in the power-on sequence reported in Figure 14), each pin is first tri-stated and then is set to its relative internal reset state. At the end of the boot sequence, the UART interface is initialized, the module is by default in active-mode, and the UART interface is enabled. 1.9.2.4 UART and power-saving The power saving configuration is controlled by the AT+UPSV command (for the complete description, see the u-blox AT Commands Manual [3]). When power saving is enabled, the module automatically enters low power idle-mode whenever possible, and otherwise the active-mode is maintained by the module (see section 1.4 for definition and description of module operating modes referred to in this section). The AT+UPSV command configures both the module power saving and also the UART behavior in relation to the power saving. The conditions for the module entering low power idle-mode also depend on the UART power saving configuration, as the module does not enter the low power idle-mode according to any required activity related to the network (within or outside an active call) or any other required concurrent activity related to the functions and interfaces of the module, including the UART interface. 1.9.2.5 UART multiplexer protocol TOBY-L2 series modules have a software layer with multiplexer functionality as per 3GPP TS 27.010 Multiplexer Protocol [10], available on the UART physical link. This is a data link protocol (layer 2 of OSI model) which uses HDLC-like framing and operates between the module (DCE) and the application processor (DTE) and allows a number of simultaneous sessions over the used physical link (the UART interface): the user can concurrently use AT command interface on one MUX channel and data communication on another multiplexer channel. The following virtual channels are defined:

Channel 0: control channel Channel 1 5: AT commands / data connection Channel 6: GNSS tunneling Channel 7: SIM Access Profile For more details, see Mux implementation Application Note [11]. UBX-13004618 - R04 Advance Information System description Page 43 of 141 TOBY-L2 and MPCI-L2 series - System Integration Manual 1.9.3 DDC (I2C) interface The I2C bus compatible Display Data Channel interface is not available on the MPCI-L2 series modules, as AssistNow embedded GNSS positioning aiding, CellLocate positioning through cellular information and custom functions over GPIOs for the integration with u-blox positioning chips / modules. The I2C bus compatible Display Data Channel interface is not supported by the TOBY-L2x0-00S product version, as AssistNow embedded GNSS positioning aiding, CellLocate positioning through cellular information and custom functions over GPIOs for the integration with u-blox positioning chips / modules. The SDA and SCL pins of TOBY-L2 series modules represent an I2C bus compatible Display Data Channel (DDC) interface for the communication with u-blox GNSS receivers and with other external I2C devices as audio codecs:

an I2C master can communicate with more I2C slaves in accordance to the I2C bus specifications [12]. The DDC (I2C) interface is the only one interface dedicated for communication between u-blox cellular module and u-blox positioning receivers. The AT commands interface is not available on the DDC (I2C) interface. The DDC (I2C) interface pads of the module, serial data (SDA) and serial clock (SCL), are open drain output and external pull up resistors must be used conforming to the I2C bus specifications [12]. u-blox has implemented special features in the cellular modules to ease the design effort for the integration of a u-blox cellular module with a u-blox GNSS receiver (details in GNSS Implementation Application Note [13]). Combining a u-blox cellular module with a u-blox GNSS receiver allows designers to full access the GNSS receiver directly via the cellular module: it relays control messages to the GNSS receiver via a dedicated DDC (I 2C) interface. A 2nd interface connected to the GNSS receiver is not necessary: AT commands via the AT interfaces of the cellular module (UART, USB) allows a full control of the GNSS receiver from any host processor. u-blox cellular modules feature embedded GNSS aiding that is a set of specific features developed by u-blox to enhance GNSS performance, decreasing Time To First Fix (TTFF), thus allowing to calculate the position in a shorter time with higher accuracy. Additional custom functions over GPIO pins are designed to improve the integration with u-blox GNSS receivers:

GNSS receiver power-on/off: GNSS supply enable function over the GPIO2 pin improves the positioning receiver power consumption. When the GNSS functionality is not required, the positioning receiver can be completely switched off by the cellular module controlled by the application processor over AT commands The wake up from idle-mode when the GNSS receiver is ready to send data: GNSS data ready function over the GPIO3 pin improves the cellular module power consumption. When power saving is enabled in the cellular module by the AT+UPSV command and the GNSS receiver does not send data by the DDC (I2C) interface, the module automatically enters idle-mode whenever possible. With the GNSS data ready function the GNSS receiver can indicate to the cellular module that it is ready to send data: the positioning receiver can wake up the cellular module to avoid data loss even if power saving is enabled. The RTC synchronization signal to the GNSS receiver: GNSS RTC sharing function over the GPIO4 pin improves GNSS receiver performance, decreasing the Time To First Fix (TTFF), and thus allowing to calculate the position in a shorter time with higher accuracy. When GNSS local aiding is enabled, the cellular module automatically uploads data such as position, time, ephemeris, almanac, health and ionospheric parameter from the positioning receiver into its local memory, and restores this to the GNSS receiver at the next power up of the positioning receiver UBX-13004618 - R04 Advance Information System description Page 44 of 141 TOBY-L2 and MPCI-L2 series - System Integration Manual 1.9.4 Secure Digital Input Output interface (SDIO) Secure Digital Input Output interface is not available on MPCI-L2 series modules. Secure Digital Input Output interface is not supported by the TOBY-L2x0-00S product version. TOBY-L2 series modules include a 4-bit Secure Digital Input Output interface (SDIO_D0, SDIO_D1, SDIO_D2, SDIO_D3, SDIO_CLK, SDIO_CMD) designed to communicate with an external Wi-Fi chip. 1.10 Audio 1.10.1 Digital audio over I2S interface Digital audio over I2S interface is not available on MPCI-L2 series modules. Digital audio over I2S interface is not supported by the TOBY-L2x0-00S product version. TOBY-L2 series modules include a 4-wire I2S digital audio interface (I2S_TXD, I2S_RXD, I2S_CLK, I2S_WA) that can be configured by AT command to transfer digital audio data with an external device as an audio codec (for more details see u-blox AT Commands Manual [3]). UBX-13004618 - R04 Advance Information System description Page 45 of 141 TOBY-L2 and MPCI-L2 series - System Integration Manual 1.11 General Purpose Input/Output General Purpose Input / Output pins are not supported by the TOBY-L2x0-00S product version except for the Wireless Wide Area Network status indication configured on the GPIO1 pin. General Purpose Input / Output pins are not available on MPCI-L2 series modules. TOBY-L2 series modules include 14 pins (GPIO1-GPIO6, I2S_TXD, I2S_RXD, I2S_CLK, I2S_WA, DTR, DSR, DCD, RI) that can be configured as General Purpose Input/Output or to provide custom functions via u-blox AT commands (see the u-blox AT Commands Manual [3]), as summarized in Table 12. Function Description Default GPIO Configurable GPIOs GPIO1 GPIO2 GPIO3 GPIO4 GPIO5 GPIO5 Network status indication Network status: registered home network, registered roaming, data transmission, no service GNSS supply enable Enable/disable the supply of u-blox GNSS receiver connected to cellular module GPIO1 GPIO2 GNSS data ready GNSS RTC sharing Sense when u-blox GNSS receiver connected to the module is ready for sending data by the DDC (I2C) GPIO3 Real Time Clock synchronization signal to u-blox GNSS receiver connected to cellular module GPIO4 GPIO5

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SIM card detection SIM card physical presence detection SIM card hot insertion/removal SIM card hot insertion/removal I2S digital audio interface I2S digital audio interface 26 MHz clock output 26 MHz clock output for an external audio codec or an external Wi-Fi chip/module Wi-Fi enable Wi-Fi data ready Enable/disable the supply of the external Wi-Fi chip or module connected to the cellular module Sense when the external Wi-Fi chip/module connected to the cellular module is ready for sending data by the SDIO, waking up the cellular module from low power idle mode Wi-Fi reset Reset the external Wi-Fi chip or module connected to the cellular module Wi-Fi power saving Enable/disable the low power mode of the external Wi-Fi chip/module connected to the cellular module 32 kHz clock output 32 kHz clock output for an external Wi-Fi chip or module Antenna tuning 4-bit tunable antenna control signals mapping the actual operating RF band over a 4-pin interface provided for the implementation of external antenna tuning solutions DSR DTR DCD RI UART data set ready output UART data terminal ready input UART data carrier detect output UART ring indicator output General purpose input Input to sense high or low digital level General purpose output Output to set the high or the low digital level Pin disabled Tri-state with an internal active pull-down enabled Table 12: TOBY-L2 series GPIO custom functions configuration I2S_RXD, I2S_TXD, I2S_CLK, I2S_WA I2S_RXD, I2S_TXD, I2S_CLK, I2S_WA GPIO6 GPIO6

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DSR DTR DCD RI

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GPIO1, GPIO4, DSR GPIO3, DTR GPIO3, DCD GPIO2, RI GPIO4 I2S_RXD, I2S_TXD, I2S_CLK, I2S_WA DSR, DTR, DCD, RI DSR DTR DCD RI All All All UBX-13004618 - R04 Advance Information System description Page 46 of 141 TOBY-L2 and MPCI-L2 series - System Integration Manual 1.12 Mini PCIe specific signals (W_DISABLE#, LED_WWAN#) Mini PCI Express specific signals (W_DISABLE#, LED_WWAN#) are not available on TOBY-L2 series. MPCI-L2 series modules include the W_DISABLE# active-low input signal to disable the radio operations as specified by the PCI Express Mini Card Electromechanical Specification [14]. As described in Figure 20, the W_DISABLE# input is equipped with an internal pull-up to the 3.3Vaux supply. The W_DISABLE# input detailed electrical characteristics are described in the MPCI-L2 series Data Sheet [2]. Figure 20: MPCI-L2 series modules W_DISABLE# input circuit description MPCI-L2 series modules include the LED_WWAN# active-low open drain output to provide the Wireless Wide Area Network status indication as specified by the PCI Express Mini Card Electromechanical Specification [14]. For more electrical characteristics details see the MPCI-L2 Data Sheet [2]. 1.13 Reserved pins (RSVD) Pins reserved for future use, marked as RSVD, are not available on MPCI-L2 series. TOBY-L2 series modules have pins reserved for future use, marked as RSVD: they can all be left unconnected on the application board, except the RSVD pin number 6 that must be externally connected to ground. 1.14 Not connected pins (NC) Pins internally not connected, marked as NC, are not available on TOBY-L2 series. MPCI-L2 series modules have pins internally not connected, marked as NC: they can be left unconnected or they can be connected on the application board according to any application requirement, given that none function is provided by the modules over these pins. UBX-13004618 - R04 Advance Information System description Page 47 of 141 Baseband Processor20W_DISABLE#MPCI-L2 series3.3VauxW_DISABLE#22k TOBY-L2 and MPCI-L2 series - System Integration Manual 1.15 System features 1.15.1 Network indication Network status indication over GPIO1 is not available on MPCI-L2 series modules which include the LED_WWAN# active-low open drain output to provide the Wireless Wide Area Network status indication as specified by the PCI Express Mini Card Electromechanical Specification [14]. General Purpose Input / Output pins are not supported by the TOBY-L2x0-00S product version except for the Wireless Wide Area Network status indication configured on the GPIO1 pin. The GPIO1 can be configured by the AT+UGPIOC command to indicate network status as described below:

No service (no network coverage or not registered) Registered 2G / 3G / LTE home network Registered 2G / 3G / LTE visitor network (roaming) Call enabled (RF data transmission / reception) For the detailed description of the network status indication configuration, see u-blox AT Commands Manual [3], GPIO commands. 1.15.2 Antenna supervisor Antenna supervisor (i.e. antenna detection) is not available on MPCI-L2 series. Antenna supervisor (i.e. antenna detection) is not supported by the TOBY-L2x0-00S product version. The antenna detection function provided by the ANT_DET pin is based on an ADC measurement as optional feature that can be implemented if the application requires it. The antenna supervisor is forced by the +UANTR AT command (see the u-blox AT Commands Manual [3] for more details). The requirements to achieve antenna detection functionality are the following:

an RF antenna assembly with a built-in resistor (diagnostic circuit) must be used an antenna detection circuit must be implemented on the application board See section 1.7.2 for detailed antenna detection interface functional description and see section 2.4.2 for detection circuit on application board and diagnostic circuit on antenna assembly design-in guidelines. 1.15.3 Jamming detection Congestion detection (i.e. jamming detection) is not supported by TOBY-L2x0-00S and MPCI-L2x0-00S. In real network situations modules can experience various kind of out-of-coverage conditions: limited service conditions when roaming to networks not supporting the specific SIM, limited service in cells which are not suitable or barred due to operators choices, no cell condition when moving to poorly served or highly interfered areas. In the latter case, interference can be artificially injected in the environment by a noise generator covering a given spectrum, thus obscuring the operators carriers entitled to give access to the LTE/3G/2G service. The congestion (i.e. jamming) detection feature can be enabled and configured by the +UCD AT command: the feature consists of detecting an anomalous source of interference and signaling the start and stop of such conditions to the host application processor with an unsolicited indication, which can react appropriately by e.g. switching off the radio transceiver of the module (i.e. configuring the module in airplane mode by means of the +CFUN AT command) in order to reduce power consumption and monitoring the environment at constant periods (for more details see the u-blox AT Commands Manual [3]). UBX-13004618 - R04 Advance Information System description Page 48 of 141 TOBY-L2 and MPCI-L2 series - System Integration Manual 1.15.4 IP modes of operation IP modes of operation refer to the TOBY-L2 and MPCI-L2 series modules configuration related to the network IP termination and network interfaces settings in general. IP modes of operation are the following:

Bridge mode: In bridge mode the module acts as a cellular modem dongle connected to the host over serial interface (USB). The IP termination of the network is placed on the host IP stack. The module is configured as a bridge which means the network IP address is assigned to the host (host IP termination). Router mode: In router mode the module acts as a cellular modem router which means the IP termination of the network is placed on the internal IP stack of the module (on-target IP termination). In particular, in this configuration the application processor belongs to a private network and is not aware of the mobile connectivity setup of the module. For more details about IP modes of operation see the u-blox AT Commands Manual [3]. 1.15.5 Dual stack IPv4/IPv6 TOBY-L2 and MPCI-L2 series support both Internet Protocol version 4 and Internet Protocol version 6 in parallel. For more details about dual stack IPv4/IPv6 see the u-blox AT Commands Manual [3]. 1.15.6 TCP/IP and UDP/IP Embedded TCP/IP and UDP/IP stack as well as Direct Link mode are not supported by the TOBY-L2x0-00S and MPCI-L2x0-00S product versions. TOBY-L2 and MPCI-L2 series modules provide embedded TCP/IP and UDP/IP protocol stack: a PDP context can be configured, established and handled via the data connection management packet switched data commands. TOBY-L2 and MPCI-L2 series modules provide Direct Link mode to establish a transparent end-to-end communication with an already connected TCP or UDP socket via serial interfaces (USB, UART). In Direct Link mode, data sent to the serial interface from an external application processor is forwarded to the network and vice-versa. For more details about embedded TCP/IP and UDP/IP functionalities see the u-blox AT Commands Manual [3]. 1.15.7 FTP and FTPS Embedded FTP and FTPS services as well as Direct Link mode are not supported by the TOBY-L2x0-00S and MPCI-L2x0-00S product versions. TOBY-L2 and MPCI-L2 series provide embedded File Transfer Protocol (FTP) and Secure File Transfer Protocol

(FTPS, i.e. FTP with SSL encryption) services. Files are read and stored in the local file system of the module. FTP files can also be transferred using FTP Direct Link:

FTP download: data coming from the FTP server is forwarded to the host processor via USB / UART serial interfaces (for FTP without Direct Link mode the data is always stored in the modules Flash File System) FTP upload: data coming from the host processor via USB / UART serial interface is forwarded to the FTP server (for FTP without Direct Link mode the data is read from the modules Flash File System) When Direct Link is used for a FTP file transfer, only the file content pass through USB / UART serial interface, whereas all the FTP commands handling is managed internally by the FTP application. For more details about embedded FTP and FTPS functionalities see u-blox AT Commands Manual [3]. UBX-13004618 - R04 Advance Information System description Page 49 of 141 TOBY-L2 and MPCI-L2 series - System Integration Manual 1.15.8 HTTP and HTTPS Embedded HTTP and HTTPS services are not supported by TOBY-L2x0-00S and MPCI-L2x0-00S. TOBY-L2 and MPCI-L2 series modules provide the embedded Hyper-Text Transfer Protocol (HTTP) and the Secure Hyper-Text Transfer Protocol (HTTPS, i.e. HTTP with TLS / SSL encryption) services via AT commands for sending requests to a remote HTTP server, receiving the server response and transparently storing it in the modules Flash File System (FFS). For more details about embedded HTTP and HTTPS functionalities see the u-blox AT Commands Manual [3]. 1.15.9 SSL Embedded Transport Layer Security (TLS) / Secure Sockets Layer (SSL) protocols are not supported by the TOBY-L2x0-00S and MPCI-L2x0-00S product versions. TOBY-L2 and MPCI-L2 series modules provide the Transport Layer Security (TLS) / Secure Sockets Layer (SSL) encryption protocols to enable security over the FTP and HTTP protocols via AT commands. For more details about embedded TLS / SSL functionalities see the u-blox AT Commands Manual [3]. 1.15.10 AssistNow clients and GNSS integration AssistNow clients and u-blox GNSS receiver integration are not available on MPCI-L2 series. AssistNow clients and u-blox GNSS receiver integration are not supported by TOBY-L2x0-00S. For customers using u-blox GNSS receivers, TOBY-L2 series cellular modules feature embedded AssistNow clients. AssistNow A-GPS provides better GNSS performance and faster Time-To-First-Fix. The clients can be enabled and disabled with an AT command (see the u-blox AT Commands Manual [3]). TOBY-L2 series cellular modules act as a stand-alone AssistNow client, making AssistNow available with no additional requirements for resources or software integration on an external host micro controller. Full access to u-blox GNSS receivers is available via the TOBY-L2 series cellular module, through the DDC (I2C) interface, while the available GPIOs can handle the positioning chipset / module power-on/off. This means that cellular module and GNSS receiver can be controlled through a single serial port from any host processor. 1.15.11 Hybrid positioning and CellLocate Hybrid positioning and CellLocate are not available on MPCI-L2 series. Hybrid positioning and CellLocate are not supported by the TOBY-L2x0-00S product version. Although GNSS is a widespread technology, its reliance on the visibility of extremely weak GNSS satellite signals means that positioning is not always possible. Especially difficult environments for GNSS are indoors, in enclosed or underground parking garages, as well as in urban canyons where GNSS signals are blocked or jammed by multipath interference. The situation can be improved by augmenting GNSS receiver data with cellular network information to provide positioning information even when GNSS reception is degraded or absent. This additional information can benefit numerous applications. UBX-13004618 - R04 Advance Information System description Page 50 of 141 TOBY-L2 and MPCI-L2 series - System Integration Manual Positioning through cellular information: CellLocate u-blox CellLocate enables the estimation of device position based on the parameters of the mobile network cells visible to the specific device. To estimate its position the u-blox cellular module sends the CellLocate server the parameters of network cells visible to it using a UDP connection. In return the server provides the estimated position based on the CellLocate database. The u-blox cellular module can either send the parameters of the visible home network cells only (normal scan) or the parameters of all surrounding cells of all mobile operators

(deep scan). The CellLocate database is compiled from the position of devices which observed, in the past, a specific cell or set of cells (historical observations) as follows:

1. Several devices reported their position to the CellLocate server when observing a specific cell (the As in the picture represent the position of the devices which observed the same cell A) 2. CellLocate server defines the area of Cell A visibility UBX-13004618 - R04 Advance Information System description Page 51 of 141 TOBY-L2 and MPCI-L2 series - System Integration Manual If a new device reports the observation of Cell A CellLocate is able to provide the estimated position from the area of visibility 3. 4. The visibility of multiple cells provides increased accuracy based on the intersection of areas of visibility. CellLocate is implemented using a set of two AT commands that allow configuration of the CellLocate service

(AT+ULOCCELL) and requesting position according to the user configuration (AT+ULOC). The answer is provided in the form of an unsolicited AT command including latitude, longitude and estimated accuracy. The accuracy of the position estimated by CellLocate depends on the availability of historical observations in the specific area. Hybrid positioning With u-blox Hybrid positioning technology, u-blox cellular devices can be triggered to provide their current position using either a u-blox GNSS receiver or the position estimated from CellLocate. The choice depends on which positioning method provides the best and fastest solution according to the user configuration, exploiting the benefit of having multiple and complementary positioning methods. Hybrid positioning is implemented through a set of three AT commands that allow configuration of the GNSS receiver (AT+ULOCGNSS), configuration of the CellLocate service (AT+ULOCCELL), and requesting the position according to the user configuration (AT+ULOC). The answer is provided in the form of an unsolicited AT command including latitude, longitude and estimated accuracy (if the position has been estimated by CellLocate), and additional parameters if the position has been computed by the GNSS receiver. The configuration of mobile network cells does not remain static (e.g. new cells are continuously added or existing cells are reconfigured by the network operators). For this reason, when a Hybrid positioning method has been triggered and the GNSS receiver calculates the position, a database self-learning mechanism has been implemented so that these positions are sent to the server to update the database and maintain its accuracy. UBX-13004618 - R04 Advance Information System description Page 52 of 141 TOBY-L2 and MPCI-L2 series - System Integration Manual The use of hybrid positioning requires a connection via the DDC (I2C) bus between the TOBY-L2 series cellular module and the u-blox GNSS receiver (see sections 1.9.3 and 2.6.3). See GNSS Implementation Application Note [13] for the complete description of the feature. u-blox is extremely mindful of user privacy. When a position is sent to the CellLocate server u-blox is unable to track the SIM used or the specific device. 1.15.12 Firmware update Over AT (FOAT) This feature allows upgrading the module firmware over USB / UART serial interfaces, using AT commands. The +UFWUPD AT command triggers a reboot followed by the upgrade procedure at specified a baud rate A special boot loader on the module performs firmware installation, security verifications and module reboot Firmware authenticity verification is performed via a security signature during the download. The firmware is then installed, overwriting the current version. In case of power loss during this phase, the boot loader detects a fault at the next wake-up, and restarts the firmware download. After completing the upgrade, the module is reset again and wakes-up in normal boot For more details about Firmware update Over AT procedure see the Firmware Update Application Note [4] and the u-blox AT Commands Manual [3], +UFWUPD AT command. 1.15.13 Firmware update Over The Air (FOTA) Firmware update Over The Air (FOTA) is not supported by TOBY-L2x0-00S and MPCI-L2x0-00S. This feature allows upgrading the module firmware over the LTE/3G/2G air interface. The main idea with updating Firmware over the air is to reduce the amount of data required for transmission to the module. This is achieved by downloading only a delta file instead of the full firmware. The delta contains only the differences between the two firmware versions (old and new), and is compressed. For more details about Firmware update Over The Air procedure see the Firmware Update Application Note [4]

and the u-blox AT Commands Manual [3], +UFOTA AT command. UBX-13004618 - R04 Advance Information System description Page 53 of 141 TOBY-L2 and MPCI-L2 series - System Integration Manual 1.15.14 In-band Modem (eCall / ERA-GLONASS) In-band modem for eCall / ERA-GLONASS emergency applications is not supported by TOBY-L2x0-00S and MPCI-L2 series. In-band Modem solution for eCall and ERA-GLONASS emergency call applications over cellular networks is implemented according to 3GPP TS 26.267 [15], BS EN 16062:2011 [16] and ETSI TS 122 101 [17] specifications. eCall (European) and ERA-GLONASS (Russian) are initiatives to combine mobile communications and satellite positioning to provide rapid assistance to motorists in the event of a collision, implementing automated emergency response system based the first on GPS the latter on GLONASS positioning system. When activated, the in-vehicle systems (IVS) automatically initiate an emergency call carrying both voice and data

(including location data) directly to the nearest Public Safety Answering Point (PSAP) to determine whether rescue services should be dispatched to the known position. Figure 21: eCall and ERA-GLONASS automated emergency response systems diagram flow For more details regarding the In-band Modem solution for the European eCall and the Russian ERA-GLONASS emergency call applications, see the u-blox eCall / ERA-GLONASS Application Note [18]. 1.15.15 SIM Access Profile (SAP) SIM Access Profile (SAP) is not supported by TOBY-L2x0-00S and MPCI-L2 series. SIM access profile (SAP) feature allows accessing and using a remote SIM card / chipping instead of the local SIM directly connected to the module SIM interface. A dedicated SAP channel over USB and a dedicated multiplexed SAP channel over UART are implemented for communication with the remote SIM card/chip. Communication between TOBY-L2 series module and the remote SIM is conformed to client-server paradigm:

The module is the SAP client establishing a connection and performing data exchange to a SAP server directly connected to the remote SIM that is used by the module for LTE/3G/2G network-related operations. The SAP communication protocol is based on the SIM Access Profile Interoperability Specification [19]. A typical application using the SAP feature is the scenario where a device such as an embedded car-phone with an integrated TOBY-L2 series module uses a remote SIM included in an external user device (e.g. a simple SIM card reader or a portable phone), which is brought into the car. The car-phone accesses the LTE/3G/2G network using the remote SIM in the external device. UBX-13004618 - R04 Advance Information System description Page 54 of 141 TOBY-L2 and MPCI-L2 series - System Integration Manual TOBY-L2 series modules, acting as an SAP client, can be connected to an SAP server by a completely wired connection, as shown in Figure 22. Figure 22: Remote SIM access via completely wired connection As stated in the SIM Access Profile Interoperability Specification [19], the SAP client can be connected to the SAP server by means of a Bluetooth wireless link, using additional Bluetooth transceivers. In this case, the application processor wired to TOBY-L2 series module establishes and controls the Bluetooth connection using the SAP profile, and routes data received over a serial interface channel to data transferred over a Bluetooth interface and vice versa, as shown in Figure 23. Figure 23: Remote SIM access via Bluetooth and wired connection The application processor can start an SAP connection negotiation between TOBY-L2 series module SAP client and an SAP server using custom AT command (for more details see u-blox AT Commands Manual [3]). While the connection with the SAP server is not fully established, the TOBY-L2 series module continues to operate with the attached (local) SIM, if present. Once the connection is established and negotiated, the module performs a detach operation from the local SIM followed by an attach operation to the remote one. Then the remotely attached SIM is used for any LTE/3G/2G network operation. URC indications are provided to inform the user about the state of both the local and remote SIM. The insertion and the removal of the local SIM card are notified if a proper card presence detection circuit using the GPIO5 of TOBY-L2 series modules is implemented as shown in section 2.5, and if the related SIM card detection and SIM hot insertion/removal functions described in section 1.8.2 are enabled by AT commands (for more details see u-blox AT Commands Manual [3]). Upon SAP deactivation, the TOBY-L2 series modules perform a detach operation from the remote SIM followed by an attach operation to the local one, if present. UBX-13004618 - R04 Advance Information System description Page 55 of 141 Device including TOBY-L2LTE/3G/2G InterfaceLocal SIM(optional)TOBY-L2SAP ClientApplicationProcessorDevice including SIMSAP Serial InterfaceRemote SIMMobileEquipmentSAP ServerSAP Serial Interface(SAP channel over USB or UART)Device including TOBY-L2SAP Serial Interface(SAP channel over USB or UART)LTE/3G/2G InterfaceLocal SIM(optional)TOBY-L2SAP ClientApplicationProcessorSAP Bluetooth InterfaceBluetoothTransceiverDevice including SIMRemote SIMMobileEquipmentSAP ServerBluetoothTransceiver TOBY-L2 and MPCI-L2 series - System Integration Manual 1.15.16 Smart temperature management Smart temperature management is not supported by TOBY-L2x0-00S and MPCI-L2x0-00S. Cellular modules independent of the specific model always have a well defined operating temperature range. This range should be respected to guarantee full device functionality and long life span. Nevertheless there are environmental conditions that can affect operating temperature, e.g. if the device is located near a heating/cooling source, if there is/isnt air circulating, etc. The module itself can also influence the environmental conditions; such as when it is transmitting at full power. In this case its temperature increases very quickly and can raise the temperature nearby. The best solution is always to properly design the system where the module is integrated. Nevertheless an extra check/security mechanism embedded into the module is a good solution to prevent operation of the device outside of the specified range. Smart Temperature Supervisor (STS) The Smart Temperature Supervisor is activated and configured by a dedicated AT+USTS command. See the u-blox AT Commands Manual [3] for more details. The cellular module measures the internal temperature (Ti) and its value is compared with predefined thresholds to identify the actual working temperature range. Temperature measurement is done inside the cellular module: the measured value could be different from the environmental temperature (Ta). Figure 24: Temperature range and limits The entire temperature range is divided into sub-regions by limits (see Figure 24) named t-2, t-1, t+1 and t+2. Within the first limit, (t-1 < Ti < t+1), the cellular module is in the normal working range, the Safe Area In the Warning Area, (t-2 < Ti < t.1) or (t+1 < Ti < t+2), the cellular module is still inside the valid temperature range, but the measured temperature approaches the limit (upper or lower). The module sends a warning to the user (through the active AT communication interface), which can take, if possible, the necessary actions to return to a safer temperature range or simply ignore the indication. The module is still in a valid and good working condition Outside the valid temperature range, (Ti < t-2) or (Ti > t+2), the device is working outside the specified range and represents a dangerous working condition. This condition is indicated and the device shuts down to avoid damage For security reasons the shutdown is suspended in case an emergency call in progress. In this case the device will switch off at call termination. The user can decide at anytime to enable/disable the Smart Temperature Supervisor feature. If the feature is disabled there is no embedded protection against disallowed temperature conditions. UBX-13004618 - R04 Advance Information System description Page 56 of 141 Warningareat-1t+1t+2t-2Valid temperature rangeSafeareaDangerousarea Dangerousarea Warningarea TOBY-L2 and MPCI-L2 series - System Integration Manual Figure 25 shows the flow diagram implemented for the Smart Temperature Supervisor. Figure 25: Smart Temperature Supervisor (STS) flow diagram UBX-13004618 - R04 Advance Information System description Page 57 of 141 IF STS enabledRead temperatureIF(t-1<Ti<t+1)IF(t-2<Ti<t+2)Send notification (warning)Send notification(dangerous)WaitemergencycallterminationIFemerg. call in progressShut the device downYesNoYesYesNoNoNoYesSend shutdownnotificationFeature enabled (full logic or indication only)IF Full Logic EnabledFeature disabled: no actionTemperature is within normal operating rangeYesTempetature is within warning areaTempetature is outside valid temperature rangeNoFeatuere enabled in full logic modeFeature enabled in indication only mode:no further actionsSend notification (safe)Previously outside of Safe AreaTempetature is back to safe areaNoNo furtheractionsYes TOBY-L2 and MPCI-L2 series - System Integration Manual Threshold Definitions When the application of cellular module operates at extreme temperatures with Smart Temperature Supervisor enabled, the user should note that outside the valid temperature range the device will automatically shut down as described above. The input for the algorithm is always the temperature measured within the cellular module (Ti, internal). This value can be higher than the working ambient temperature (Ta, ambient), as (for example) during transmission at maximum power a significant fraction of DC input power is dissipated as heat This behavior is partially compensated by the definition of the upper shutdown threshold (t+2) that is slightly higher than the declared environmental temperature limit. The sensor measures board temperature inside the shields, which can differ from ambient temperature. 1.15.17 Power saving The power saving configuration is by default disabled, but it can be enabled using the AT+UPSV command (for the complete description of the AT+UPSV command, see the u-blox AT Commands Manual [3]). When power saving is enabled, the module automatically enters the low power idle-mode whenever possible, reducing current consumption (see section 1.5.1.5, TOBY-L2 Data Sheet [1] and MPCI-L2 Data Sheet [2]). During the low power idle-mode, the module is not ready to communicate with an external device, as it is configured to reduce power consumption. The module wakes up from low power idle-mode to active-mode in the following events:

Automatic periodic monitoring of the paging channel for the reception of the paging block sent by the base station according to network conditions (see section 1.5.1.5) The connected USB host forces a remote wakeup of the module as USB device (see section 1.9.1.4) A preset RTC alarm occurs (see u-blox AT Commands Manual [3], AT+CALA) For the definition and the description of TOBY-L2 and MPCI-L2 series modules operating modes, including the events forcing transitions between the different operating modes, see the section 1.4. UBX-13004618 - R04 Advance Information System description Page 58 of 141 TOBY-L2 and MPCI-L2 series - System Integration Manual 2 Design-in 2.1 Overview For an optimal integration of TOBY-L2 and MPCI-L2 series modules in the final application board follow the design guidelines stated in this section. Every application circuit must be properly designed to guarantee the correct functionality of the relative interface, however a number of points require high attention during the design of the application device. The following list provides a rank of importance in the application design, starting from the highest relevance:

1. Module antenna connection: ANT1, ANT2 and ANT_DET. Antenna circuit directly affects the RF compliance of the device integrating a TOBY-L2 and MPCI-L2 series module with applicable certification schemes. Very carefully follow the suggestions provided in the relative section 2.4 for schematic and layout design. 2. Module supply: VCC or 3.3Vaux and GND pins. The supply circuit affects the RF compliance of the device integrating a TOBY-L2 and MPCI-L2 series module with applicable required certification schemes as well as antenna circuit design. Very carefully follow the suggestions provided in the relative section 2.2.1 for schematic and layout design. 3. USB interface: USB_D+, USB_D- pins. Accurate design is required to guarantee USB 2.0 high-speed interface functionality. Carefully follow the suggestions provided in the relative section 2.6.1 for schematic and layout design. 4. SIM interface: VSIM, SIM_CLK, SIM_IO, SIM_RST or UIM_PWR, UIM_DATA, UIM_CLK, UIM_RESET pins. Accurate design is required to guarantee SIM card functionality reducing the risk of RF coupling. Carefully follow the suggestions provided in the relative section 2.5 for schematic and layout design. 5. SDIO interface: SDIO_D0, SDIO_D1, SDIO_D2, SDIO_D3, SDIO_CLK, SDIO_CMD pins. Accurate design is required to guarantee SDIO interface functionality. Carefully follow the suggestions provided in the relative section 2.6.4 for schematic and layout design. 6. System functions: RESET_N or PERST#, PWR_ON pins. Accurate design is required to guarantee that the voltage level is well defined during operation. Carefully follow the suggestions provided in the relative section 2.3 for schematic and layout design. 7. Other supplies: V_BCKP RTC supply and V_INT generic digital interfaces supply. Accurate design is required to guarantee proper functionality. Follow the suggestions provided in the corresponding sections 2.2.2 and 2.2.3 for schematic and layout design. 8. Other digital interfaces: UART, I2C, I2S, Host Select, GPIOs, Mini PCIe specific signals and Reserved pins. Accurate design is required to guarantee proper functionality. Follow the suggestions provided in sections 2.6.2, 2.6.3, 2.7.1, 2.3.3, 2.8, 2.9 and 2.10 for schematic and layout design. UBX-13004618 - R04 Advance Information Design-in Page 59 of 141 TOBY-L2 and MPCI-L2 series - System Integration Manual 2.2 Supply interfaces 2.2.1 Module supply (VCC or 3.3Vaux) 2.2.1.1 General guidelines for VCC or 3.3Vaux supply circuit selection and design VCC or 3.3Vaux pins are internally connected. Application design shall connect all the available pads to the external supply to minimize the power loss due to series resistance. GND pins are internally connected. Application design shall connect all the available pads to solid ground on the application board, since a good (low impedance) connection to external ground can minimize power loss and improve RF and thermal performance. TOBY-L2 and MPCI-L2 series modules must be sourced through the VCC or the 3.3Vaux pins with a proper DC power supply that should meet the following prerequisites to comply with the modules VCC or 3.3Vaux requirements summarized in Table 7. The proper DC power supply can be selected according to the application requirements (see Figure 26) between the different possible supply sources types, which most common ones are the following:

Switching regulator Low Drop-Out (LDO) linear regulator Rechargeable Lithium-ion (Li-Ion) or Lithium-ion polymer (Li-Pol) battery, for TOBY-L2 series only Primary (disposable) battery, for TOBY-L2 series only Figure 26: VCC supply concept selection The switching step-down regulator is the typical choice when the available primary supply source has a nominal voltage much higher (e.g. greater than 5 V) than the operating supply voltage of TOBY-L2 and MPCI-L2 series. The use of switching step-down provides the best power efficiency for the overall application and minimizes current drawn from the main supply source. See 2.2.1.2, 2.2.1.6, 2.2.1.9, 2.2.1.10 for specific design-in. The use of an LDO linear regulator becomes convenient for a primary supply with a relatively low voltage (e.g. less or equal than 5 V). In this case the typical 90% efficiency of the switching regulator diminishes the benefit of voltage step-down and no true advantage is gained in input current savings. On the opposite side, linear regulators are not recommended for high voltage step-down as they dissipate a considerable amount of energy in thermal power. See 2.2.1.3, 2.2.1.6, 2.2.1.9, 2.2.1.10 for specific design-in. If TOBY-L2 modules are deployed in a mobile unit where no permanent primary supply source is available, then a battery will be required to provide VCC. A standard 3-cell Li-Ion or Li-Pol battery pack directly connected to VCC is the usual choice for battery-powered devices. During charging, batteries with Ni-MH chemistry typically reach a maximum voltage that is above the maximum rating for VCC, and should therefore be avoided. See 2.2.1.4, 2.2.1.6, 2.2.1.9, 2.2.1.10 for specific design-in. Keep in mind that the use of rechargeable batteries requires the implementation of a suitable charger circuit which is not included in the modules. The charger circuit has to be designed to prevent over-voltage on VCC pins of the module, and it should be selected according to the application requirements: a DC/DC switching UBX-13004618 - R04 Advance Information Design-in Page 60 of 141 Main Supply Available?BatteryLi-Ion 3.7 VLinear LDO RegulatorMain Supply Voltage > 5V?Switching Step-Down RegulatorNo, portable deviceNo, less than 5 VYes, greater than 5 VYes, always available TOBY-L2 and MPCI-L2 series - System Integration Manual charger is the typical choice when the charging source has an high nominal voltage (e.g. ~12 V), whereas a linear charger is the typical choice when the charging source has a relatively low nominal voltage (~5 V). If both a permanent primary supply / charging source (e.g. ~12 V) and a rechargeable back-up battery (e.g. 3.7 V Li-Pol) are available at the same time in the application as possible supply source, then a proper charger / regulator with integrated power path management function can be selected to supply the module while simultaneously and independently charging the battery. See 2.2.1.7, 2.2.1.8 and 2.2.1.6, 2.2.1.9, 2.2.1.10 for specific design-in. The use of a primary (not rechargeable) battery is in general uncommon, but appropriate parts can be selected given that the most cells available are seldom capable of delivering the maximum current specified in TOBY-L2 series Data Sheet [1] during connected-mode. Carefully evaluate the usage of super-capacitors as supply source since aging and temperature conditions significantly affect the actual capacitor characteristics. See 2.2.1.5 and 2.2.1.6, 2.2.1.9, 2.2.1.10 for specific design-in. Rechargeable 3-cell Li-Ion or Li-Pol and Ni-MH chemistry batteries reach a maximum voltage that is above the maximum rating for the 3.3Vaux supply of MPCI-L2 modules, and should therefore be avoided. The use of rechargeable, not-rechargeable battery or super-capacitors is very uncommon for Mini PCI Express applications, so that these supply sources types are not considered for MPCI-L2 modules. The usage of more than one DC supply at the same time should be carefully evaluated: depending on the supply source characteristics, different DC supply systems can result as mutually exclusive. The following sections highlight some design aspects for each of the supplies listed above providing application circuit design-in compliant with the module VCC requirements summarized in Table 7. 2.2.1.2 Guidelines for VCC or 3.3Vaux supply circuit design using a switching regulator The use of a switching regulator is suggested when the difference from the available supply rail to the VCC or the 3.3Vaux value is high, since switching regulators provide good efficiency transforming a 12 V or greater voltage supply to the typical 3.8 V value of the VCC supply or the typical 3.3 V value of the 3.3Vaux supply. The characteristics of the switching regulator connected to VCC or 3.3Vaux pins should meet the following prerequisites to comply with the module VCC or 3.3Vaux requirements summarized in Table 7:

Power capability: the switching regulator with its output circuit must be capable of providing a voltage value to the VCC or 3.3Vaux pins within the specified operating range and must be capable of delivering to VCC or 3.3Vaux pins the maximum peak / pulse current consumption during Tx burst at maximum Tx power specified in the TOBY-L2 series Data Sheet [1] or in the MPCI-L2 series Data Sheet [2]. Low output ripple: the switching regulator together with its output circuit must be capable of providing a clean (low noise) VCC or 3.3Vaux voltage profile. High switching frequency: for best performance and for smaller applications it is recommended to select a switching frequency 600 kHz (since L-C output filter is typically smaller for high switching frequency). The use of a switching regulator with a variable switching frequency or with a switching frequency lower than 600 kHz must be carefully evaluated since this can produce noise in the VCC or 3.3Vaux voltage profile and therefore negatively impact LTE/3G/2G modulation spectrum performance. An additional L-C low-pass filter between the switching regulator output to VCC or 3.3Vaux supply pins can mitigate the ripple at the input of the module, but adds extra voltage drop due to resistive losses on series inductors. PWM mode operation: it is preferable to select regulators with Pulse Width Modulation (PWM) mode. While in connected-mode, the Pulse Frequency Modulation (PFM) mode and PFM/PWM modes transitions must be avoided to reduce the noise on the VCC or 3.3Vaux voltage profile. Switching regulators can be used that are able to switch between low ripple PWM mode and high ripple PFM mode, provided that the mode transition occurs when the module changes status from the idle/active-modes to connected-mode. It is permissible to use a regulator that switches from the PWM mode to the burst or PFM mode at an appropriate current threshold. UBX-13004618 - R04 Advance Information Design-in Page 61 of 141 TOBY-L2 and MPCI-L2 series - System Integration Manual Figure 27 and Table 13 show an example of a high reliability power supply circuit, where the module VCC or 3.3Vaux input is supplied by a step-down switching regulator capable of delivering maximum current with low output ripple and with fixed switching frequency in PWM mode operation greater than 1 MHz. Figure 27: Example of high reliability VCC and 3.3Vaux supply application circuit using a step-down regulator Reference Description Part Number - Manufacturer C1 C2 C3 C4 C5 C6 C7 C8 D1 L1 R1 R2 R3 R4 R5 R6 U1 10 F Capacitor Ceramic X7R 5750 15% 50 V C5750X7R1H106MB - TDK 10 nF Capacitor Ceramic X7R 0402 10% 16 V GRM155R71C103KA01 - Murata 680 pF Capacitor Ceramic X7R 0402 10% 16 V GRM155R71H681KA01 - Murata 22 pF Capacitor Ceramic C0G 0402 5% 25 V GRM1555C1H220JZ01 - Murata 10 nF Capacitor Ceramic X7R 0402 10% 16 V GRM155R71C103KA01 - Murata 470 nF Capacitor Ceramic X7R 0603 10% 25 V GRM188R71E474KA12 - Murata 22 F Capacitor Ceramic X5R 1210 10% 25 V GRM32ER61E226KE15 - Murata 330 F Capacitor Tantalum D_SIZE 6.3 V 45 m T520D337M006ATE045 - KEMET Schottky Diode 40 V 3 A MBRA340T3G - ON Semiconductor 10 H Inductor 744066100 30% 3.6 A 744066100 - Wurth Electronics 470 k Resistor 0402 5% 0.1 W 15 k Resistor 0402 5% 0.1 W 22 k Resistor 0402 5% 0.1 W 390 k Resistor 0402 1% 0.063 W 100 k Resistor 0402 5% 0.1 W 330 k Resistor 0402 1% 0.063 W 2322-705-87474-L - Yageo 2322-705-87153-L - Yageo 2322-705-87223-L - Yageo RC0402FR-07390KL - Yageo 2322-705-70104-L - Yageo RC0402FR-07330KL - Yageo Step-Down Regulator MSOP10 3.5 A 2.4 MHz LT3972IMSE#PBF - Linear Technology Table 13: Components for high reliability VCC and 3.3Vaux supply application circuit using a step-down regulator UBX-13004618 - R04 Advance Information Design-in Page 62 of 141 12VC5R3C4R2C2C1R1VINRUNVCRTPGSYNCBDBOOSTSWFBGND671095C61238114C7C8D1R4R5L1C3U1TOBY-L2series71VCC72VCC70VCCGND12VC5R3C4R2C2C1R1VINRUNVCRTPGSYNCBDBOOSTSWFBGND671095C61238114C7C8D1R6R5L1C3U1MPCI-L2series243.3Vaux393.3Vaux23.3VauxGND413.3Vaux523.3Vaux TOBY-L2 and MPCI-L2 series - System Integration Manual Figure 28 and the components listed in Table 14 show an example of a low cost power supply circuit, where the VCC module supply is provided by a step-down switching regulator capable of delivering to VCC pins the specified maximum peak / pulse current, transforming a 12 V supply input. Figure 28: Example of low cost VCC and 3.3Vaux supply application circuit using step-down regulator Reference Description Part Number - Manufacturer C1 C2 C3 C4 C5 C6 D1 L1 R1 R2 R3 R4 R5 R6 R7 U1 22 F Capacitor Ceramic X5R 1210 10% 25 V GRM32ER61E226KE15 Murata 100 F Capacitor Tantalum B_SIZE 20% 6.3V 15m T520B107M006ATE015 Kemet 5.6 nF Capacitor Ceramic X7R 0402 10% 50 V GRM155R71H562KA88 Murata 6.8 nF Capacitor Ceramic X7R 0402 10% 50 V GRM155R71H682KA88 Murata 56 pF Capacitor Ceramic C0G 0402 5% 50 V GRM1555C1H560JA01 Murata 220 nF Capacitor Ceramic X7R 0603 10% 25 V GRM188R71E224KA88 Murata Schottky Diode 25V 2 A STPS2L25 STMicroelectronics 5.2 H Inductor 30% 5.28A 22 m 4.7 k Resistor 0402 1% 0.063 W 910 Resistor 0402 1% 0.063 W 82 Resistor 0402 5% 0.063 W 8.2 k Resistor 0402 5% 0.063 W 39 k Resistor 0402 5% 0.063 W 1.5 k Resistor 0402 1% 0.063 W 330 Resistor 0402 1% 0.063 W MSS1038-522NL Coilcraft RC0402FR-074K7L Yageo RC0402FR-07910RL Yageo RC0402JR-0782RL Yageo RC0402JR-078K2L Yageo RC0402JR-0739KL Yageo RC0402FR-071K5L Yageo RC0402FR-07330RL Yageo Step-Down Regulator 8-VFQFPN 3 A 1 MHz L5987TR ST Microelectronics Table 14: Components for low cost VCC and 3.3Vaux supply application circuit using a step-down regulator UBX-13004618 - R04 Advance Information Design-in Page 63 of 141 TOBY-L2 series12VR5C6C1VCCINHFSWSYNCOUTGND263178C3C2D1R1R2L1U1GNDFBCOMP54R3C4R4C571VCC72VCC70VCC12VR5C6C1VCCINHFSWSYNCOUTGND263178C3C2D1R6R7L1U1GNDFBCOMP54R3C4R4C5MPCI-L2series243.3Vaux393.3Vaux23.3Vaux413.3Vaux523.3Vaux TOBY-L2 and MPCI-L2 series - System Integration Manual 2.2.1.3 Guidelines for VCC or 3.3Vaux supply circuit design using a Low Drop-Out linear regulator The use of a linear regulator is suggested when the difference from the available supply rail and the VCC or the 3.3Vaux value is low. The linear regulators provide high efficiency when transforming a 5 VDC supply to a voltage value within the module VCC or 3.3Vaux normal operating range. The characteristics of the Low Drop-Out (LDO) linear regulator connected to VCC or 3.3Vaux pins should meet the following prerequisites to comply with the module VCC or 3.3Vaux requirements summarized in Table 7:

Power capabilities: the LDO linear regulator with its output circuit must be capable of providing a voltage value to the VCC or 3.3Vaux pins within the specified operating range and must be capable of delivering to VCC or 3.3Vaux pins the maximum peak / pulse current consumption during Tx burst at maximum Tx power specified in TOBY-L2 series Data Sheet [1] or in MPCI-L2 series Data Sheet [2]. Power dissipation: the power handling capability of the LDO linear regulator must be checked to limit its junction temperature to the maximum rated operating range (i.e. check the voltage drop from the max input voltage to the minimum output voltage to evaluate the power dissipation of the regulator). Figure 29 and the components listed in Table 15 show an example of a power supply circuit, where the VCC or 3.3Vaux module supply is provided by an LDO linear regulator capable of delivering the required current, with proper power handling capability. It is recommended to configure the LDO linear regulator to generate a voltage supply value slightly below the maximum limit of the module VCC or 3.3Vaux normal operating range (e.g. ~4.1 V for the VCC and ~3.44 V for the 3.3Vaux as in the circuits described in Figure 29 and Table 15). This reduces the power on the linear regulator and improves the thermal design of the circuit. Figure 29: Suggested schematic design for the VCC and 3.3Vaux supply application circuit using an LDO linear regulator Reference Description Part Number - Manufacturer C1, C2 10 F Capacitor Ceramic X5R 0603 20% 6.3 V GRM188R60J106ME47 - Murata C3 R1 R2 R3 R4 R5 U1 330 F Capacitor Tantalum D_SIZE 6.3 V 45 m T520D337M006ATE045 - KEMET 47 k Resistor 0402 5% 0.1 W 9.1 k Resistor 0402 5% 0.1 W 3.9 k Resistor 0402 5% 0.1 W 3.3 k Resistor 0402 5% 0.1 W 1.8 k Resistor 0402 5% 0.1 W LDO Linear Regulator ADJ 3.0 A RC0402JR-0747KL - Yageo Phycomp RC0402JR-079K1L - Yageo Phycomp RC0402JR-073K9L - Yageo Phycomp RC0402JR-073K3L - Yageo Phycomp RC0402JR-071K8L - Yageo Phycomp LT1764AEQ#PBF - Linear Technology Table 15: Suggested components for VCC and 3.3Vaux supply application circuit using an LDO linear regulator UBX-13004618 - R04 Advance Information Design-in Page 64 of 141 5VC1R1INOUTADJGND12453C2R2R3U1SHDNTOBY-L2series71VCC72VCC70VCCGNDC35VC1R1INOUTADJGND12453C2R4R5U1SHDNMPCI-L2seriesGNDC3243.3Vaux393.3Vaux23.3Vaux413.3Vaux523.3Vaux TOBY-L2 and MPCI-L2 series - System Integration Manual Figure 30 and the components listed in Table 16 show an example of a low cost power supply circuit, where the VCC module supply is provided by an LDO linear regulator capable of delivering the specified highest peak /

pulse current, with proper power handling capability. The regulator described in this example supports a limited input voltage range and it includes internal circuitry for current and thermal protection. It is recommended to configure the LDO linear regulator to generate a voltage supply value slightly below the maximum limit of the module VCC normal operating range (e.g. ~4.1 V as in the circuit described in Figure 30 and Table 16). This reduces the power on the linear regulator and improves the whole thermal design of the supply circuit. Figure 30: Suggested schematic design for the VCC and 3.3Vaux supply application circuit using an LDO linear regulator Reference Description Part Number - Manufacturer C1, C2 10 F Capacitor Ceramic X5R 0603 20% 6.3 V GRM188R60J106ME47 - Murata C3 R1 R2 R3 R4 U1 330 F Capacitor Tantalum D_SIZE 6.3 V 45 m T520D337M006ATE045 - KEMET 27 k Resistor 0402 5% 0.1 W 4.7 k Resistor 0402 5% 0.1 W 12 k Resistor 0402 5% 0.1 W 2.7 k Resistor 0402 5% 0.1 W LDO Linear Regulator ADJ 3.0 A RC0402JR-0727KL - Yageo Phycomp RC0402JR-074K7L - Yageo Phycomp RC0402JR-0712KL - Yageo Phycomp RC0402JR-072K7L - Yageo Phycomp LP38501ATJ-ADJ/NOPB - Texas Instrument Table 16: Suggested components for VCC voltage supply application circuit using an LDO linear regulator 2.2.1.4 Guidelines for VCC supply circuit design using a rechargeable Li-Ion or Li-Pol battery Rechargeable Li-Ion or Li-Pol batteries connected to the VCC pins should meet the following prerequisites to comply with the module VCC requirements summarized in Table 7:

Maximum pulse and DC discharge current: the rechargeable Li-Ion battery with its related output circuit connected to the VCC pins must be capable of delivering a pulse current as the maximum peak current consumption during Tx burst at maximum Tx power specified in TOBY-L2 series Data Sheet [1] and must be capable of extensively delivering a DC current as the maximum average current consumption specified in TOBY-L2 series Data Sheet [1]. The maximum discharge current is not always reported in battery data sheets, but the maximum DC discharge current is typically almost equal to the battery capacity in Amp-hours divided by 1 hour. DC series resistance: the rechargeable Li-Ion battery with its output circuit must be capable of avoiding a VCC voltage drop below the operating range summarized in Table 7 during transmit bursts. UBX-13004618 - R04 Advance Information Design-in Page 65 of 141 5VC1INOUTADJGND12453C2R1R2U1ENTOBY-L2series71VCC72VCC70VCCGNDC35VC1INOUTADJGND12453C2R3R4U1ENMPCI-L2seriesGNDC3243.3Vaux393.3Vaux23.3Vaux413.3Vaux523.3Vaux TOBY-L2 and MPCI-L2 series - System Integration Manual 2.2.1.5 Guidelines for VCC supply circuit design using a primary (disposable) battery The characteristics of a primary (non-rechargeable) battery connected to VCC pins should meet the following prerequisites to comply with the module VCC requirements summarized in Table 7:

Maximum pulse and DC discharge current: the non-rechargeable battery with its related output circuit connected to the VCC pins must be capable of delivering a pulse current as the maximum peak current consumption during Tx burst at maximum Tx power specified in TOBY-L2 series Data Sheet [1] and must be capable of extensively delivering a DC current as the maximum average current consumption specified in TOBY-L2 series Data Sheet [1]. The maximum discharge current is not always reported in battery data sheets, but the maximum DC discharge current is typically almost equal to the battery capacity in Amp-hours divided by 1 hour. DC series resistance: the non-rechargeable battery with its output circuit must be capable of avoiding a VCC voltage drop below the operating range summarized in Table 7 during transmit bursts. 2.2.1.6 Additional guidelines for VCC or 3.3Vaux supply circuit design To reduce voltage drops, use a low impedance power source. The series resistance of the power supply lines

(connected to the modules VCC / 3.3Vaux and GND pins) on the application board and battery pack should also be considered and minimized: cabling and routing must be as short as possible to minimize power losses. Three pins are allocated to VCC supply and five pins to 3.3Vaux supply. Several pins are designated for GND connection. Even if all the VCC / 3.3Vaux pins and all the GND pins are internally connected within the module, it is recommended to properly connect all of them to supply the module to minimize series resistance losses. To avoid voltage drop undershoot and overshoot at the start and end of a transmit burst during a GSM call

(when current consumption on the VCC or 3.3Vaux supply can rise up as specified in TOBY-L2 series Data Sheet [1] or in MPCI-L2 series Data Sheet [2]), place a bypass capacitor with large capacitance (at least 100 F) and low ESR near the VCC pins, for example:

330 F capacitance, 45 m ESR (e.g. KEMET T520D337M006ATE045, Tantalum Capacitor) To reduce voltage ripple and noise, improving RF performance especially if the application device integrates an internal antenna, place the following bypass capacitors near the VCC / 3.3Vaux pins:

68 pF capacitor with Self-Resonant Frequency in the 800/900 MHz range (e.g. Murata GRM1555C1H680J) to filter EMI in the RF low frequencies bands 15 pF capacitor with Self-Resonant Frequency in 1800/1900 MHz range (e.g. Murata GRM1555C1E150J) to filter EMI in the RF high frequencies bands 8.2 pF capacitor with Self-Resonant Frequency in 2500/2600 MHz range (e.g. Murata GRM1555C1H8R2D) to filter EMI in the RF very high frequencies band 10 nF capacitor (e.g. Murata GRM155R71C103K) to filter digital logic noise from clocks and data sources 100 nF capacitor (e.g. Murata GRM155R61C104K) to filter digital logic noise from clocks and data sources A suitable series ferrite bead can be properly placed on the VCC / 3.3Vaux line for additional noise filtering if required by the specific application according to the whole application board design. The necessity of each part depends on the specific design, but it is recommended to provide all the bypass capacitors described in Figure 31 / Table 17 if the application device integrates an internal antenna. UBX-13004618 - R04 Advance Information Design-in Page 66 of 141 TOBY-L2 and MPCI-L2 series - System Integration Manual Figure 31: Suggested schematic for the VCC / 3.3Vaux bypass capacitors to reduce ripple / noise on supply voltage profile Reference Description Part Number - Manufacturer C1 C2 C3 C4 C5 C6 68 pF Capacitor Ceramic C0G 0402 5% 50 V GRM1555C1H680JA01 - Murata 15 pF Capacitor Ceramic C0G 0402 5% 50 V GRM1555C1H150JA01 - Murata 8.2 pF Capacitor Ceramic C0G 0402 5% 50 V GRM1555C1H8R2DZ01 - Murata 10 nF Capacitor Ceramic X7R 0402 10% 16 V GRM155R71C103KA01 - Murata 100 nF Capacitor Ceramic X7R 0402 10% 16 V GRM155R71C104KA01 - Murata 330 F Capacitor Tantalum D_SIZE 6.3 V 45 m T520D337M006ATE045 - KEMET Table 17: Suggested components to reduce ripple / noise on VCC / 3.3Vaux ESD sensitivity rating of the VCC / 3.3Vaux supply pins is 1 kV (HBM according to JESD22-A114). Higher protection level can be required if the line is externally accessible on the application board, e.g. if accessible battery connector is directly connected to the supply pins. Higher protection level can be achieved by mounting an ESD protection (e.g. EPCOS CA05P4S14THSG varistor) close to accessible point. UBX-13004618 - R04 Advance Information Design-in Page 67 of 141 C2GNDC3C4TOBY-L2 series71VCC72VCC70VCCC1C5C63V8C2GNDC3C4MPCI-L2 seriesC1C5C63V3243.3Vaux393.3Vaux23.3Vaux413.3Vaux523.3Vaux TOBY-L2 and MPCI-L2 series - System Integration Manual 2.2.1.7 Guidelines for external battery charging circuit TOBY-L2 modules do not have an on-board charging circuit. Figure 32 provides an example of a battery charger design, suitable for applications that are battery powered with a Li-Ion (or Li-Polymer) cell. In the application circuit, a rechargeable Li-Ion (or Li-Polymer) battery cell, that features proper pulse and DC discharge current capabilities and proper DC series resistance, is directly connected to the VCC supply input of TOBY-L2 module. Battery charging is completely managed by the STMicroelectronics L6924U Battery Charger IC that, from a USB power source (5.0 V typ.), charges as a linear charger the battery, in three phases:

Pre-charge constant current (active when the battery is deeply discharged): the battery is charged with a low current, set to 10% of the fast-charge current Fast-charge constant current: the battery is charged with the maximum current, configured by the value of an external resistor to a value suitable for USB power source (~500 mA) Constant voltage: when the battery voltage reaches the regulated output voltage (4.2 V), the L6924U starts to reduce the current until the charge termination is done. The charging process ends when the charging current reaches the value configured by an external resistor to ~15 mA or when the charging timer reaches the value configured by an external capacitor to ~9800 s Using a battery pack with an internal NTC resistor, the L6924U can monitor the battery temperature to protect the battery from operating under unsafe thermal conditions. Alternatively the L6924U, providing input voltage range up to 12 V, can charge from an AC wall adapter. When a current-limited adapter is used, it can operate in quasi-pulse mode, reducing power dissipation. Figure 32: Li-Ion (or Li-Polymer) battery charging application circuit Reference Description Part Number - Manufacturer B1 C1, C4 C2, C6 C3 C5 C7 C8 C9 C10 D1 R1, R2 R3 R4 U1 Li-Ion (or Li-Polymer) battery pack with 470 NTC Various manufacturer 1 F Capacitor Ceramic X7R 0603 10% 16 V GRM188R71C105KA12 - Murata 10 nF Capacitor Ceramic X7R 0402 10% 16 V GRM155R71C103KA01 - Murata 1 nF Capacitor Ceramic X7R 0402 10% 50 V GRM155R71H102KA01 - Murata 330 F Capacitor Tantalum D_SIZE 6.3 V 45 m T520D337M006ATE045 - KEMET 100 nF Capacitor Ceramic X7R 0402 10% 16 V GRM155R61A104KA01 - Murata 68 pF Capacitor Ceramic C0G 0402 5% 50 V GRM1555C1H680JA01 - Murata 15 pF Capacitor Ceramic C0G 0402 5% 50 V GRM1555C1H150JA01 - Murata 8.2 pF Capacitor Ceramic C0G 0402 5% 50 V GRM1555C1H8R2DZ01 - Murata Low Capacitance ESD Protection 24 k Resistor 0402 5% 0.1 W 3.3 k Resistor 0402 5% 0.1 W 1.0 k Resistor 0402 5% 0.1 W USB0002RP or USB0002DP - AVX RC0402JR-0724KL - Yageo Phycomp RC0402JR-073K3L - Yageo Phycomp RC0402JR-071K0L - Yageo Phycomp Single Cell Li-Ion (or Li-Polymer) Battery Charger IC L6924U - STMicroelectronics Table 18: Suggested components for Li-Ion (or Li-Polymer) battery charging application circuit UBX-13004618 - R04 Advance Information Design-in Page 68 of 141 C5C8C7C6C9GNDTOBY-L2 series71VCC72VCC70VCC+USB SupplyC3R4U1IUSBIACIENDTPRGSDVINVINSNSMODEISELC2C15V0THGNDVOUTVOSNSVREFR1R2R3Li-Ion/Li-Pol Battery PackD1B1C4Li-Ion/Li-Polymer Battery Charger ICC10 TOBY-L2 and MPCI-L2 series - System Integration Manual 2.2.1.8 Guidelines for external battery charging and power path management circuit Application devices where both a permanent primary supply / charging source (e.g. ~12 V) and a rechargeable back-up battery (e.g. 3.7 V Li-Pol) are available at the same time as possible supply source should implement a suitable charger / regulator with integrated power path management function to supply the module and the whole device while simultaneously and independently charging the battery. Figure 33 reports a simplified block diagram circuit showing the working principle of a charger / regulator with integrated power path management function. This component allows the system to be powered by a permanent primary supply source (e.g. ~12 V) using the integrated regulator which simultaneously and independently recharges the battery (e.g. 3.7 V Li-Pol) that represents the back-up supply source of the system: the power path management feature permits the battery to supplement the system current requirements when the primary supply source is not available or cannot deliver the peak system currents. A power management IC should meet the following prerequisites to comply with the module VCC requirements summarized in Table 7:

High efficiency internal step down converter, compliant with the performances specified in section 2.2.1.2 Low internal resistance in the active path Vout Vbat, typically lower than 50 m High efficiency switch mode charger with separate power path control Figure 33: Charger / regulator with integrated power path management circuit block diagram Figure 34 and the components listed in Table 19 provide an application circuit example where the MPS MP2617 switching charger / regulator with integrated power path management function provides the supply to the cellular module while concurrently and autonomously charging a suitable Li-Ion (or Li-Polymer) battery with proper pulse and DC discharge current capabilities and proper DC series resistance according to the rechargeable battery recommendations described in section 2.2.1.4. The MP2617 IC constantly monitors the battery voltage and selects whether to use the external main primary supply / charging source or the battery as supply source for the module, and starts a charging phase accordingly. The MP2617 IC normally provides a supply voltage to the module regulated from the external main primary source allowing immediate system operation even under missing or deeply discharged battery: the integrated switching step-down regulator is capable to provide up to 3 A output current with low output ripple and fixed 1.6 MHz switching frequency in PWM mode operation. The module load is satisfied in priority, then the integrated switching charger will take the remaining current to charge the battery. Additionally, the power path control allows an internal connection from battery to the module with a low series internal ON resistance (40 m typical), in order to supplement additional power to the module when the current demand increases over the external main primary source or when this external source is removed. UBX-13004618 - R04 Advance Information Design-in Page 69 of 141 GNDPower path management ICVoutVinLi-Ion/Li-Pol Battery PackGNDSystem12 V Primary SourceCharge controllerDC/DC converter and battery FET control logicVbat TOBY-L2 and MPCI-L2 series - System Integration Manual Battery charging is managed in three phases:

Pre-charge constant current (active when the battery is deeply discharged): the battery is charged with a low current, set to 10% of the fast-charge current Fast-charge constant current: the battery is charged with the maximum current, configured by the value of an external resistor to a value suitable for the application Constant voltage: when the battery voltage reaches the regulated output voltage (4.2 V), the current is progressively reduced until the charge termination is done. The charging process ends when the charging current reaches the 10% of the fast-charge current or when the charging timer reaches the value configured by an external capacitor Using a battery pack with an internal NTC resistor, the MP2617 can monitor the battery temperature to protect the battery from operating under unsafe thermal conditions. Several parameters as the charging current, the charging timings, the input current limit, the input voltage limit, the system output voltage can be easily set according to the specific application requirements, as the actual electrical characteristics of the battery and the external supply / charging source: proper resistors or capacitors have to be accordingly connected to the related pins of the IC. Figure 34: Li-Ion (or Li-Polymer) battery charging and power path management application circuit Reference Description Part Number - Manufacturer B1 C1, C5, C6 C2, C4, C11 C3 C7, C13 C8, C14 C9, C15 C10 C12 D1, D2 R1, R3, R5 R2 R4 L1 U1 Li-Ion (or Li-Polymer) battery pack with 10 k NTC Various manufacturer 22 F Capacitor Ceramic X5R 1210 10% 25 V GRM32ER61E226KE15 - Murata 100 nF Capacitor Ceramic X7R 0402 10% 16 V GRM155R61A104KA01 - Murata 1 F Capacitor Ceramic X7R 0603 10% 25 V GRM188R71E105KA12 - Murata 68 pF Capacitor Ceramic C0G 0402 5% 50 V GRM1555C1H680JA01 - Murata 15 pF Capacitor Ceramic C0G 0402 5% 25 V GRM1555C1E150JA01 - Murata 8.2 pF Capacitor Ceramic C0G 0402 5% 50 V GRM1555C1H8R2DZ01 - Murata 330 F Capacitor Tantalum D_SIZE 6.3 V 45 m T520D337M006ATE045 - KEMET 10 nF Capacitor Ceramic X7R 0402 10% 16 V GRM155R71C103KA01 - Murata Low Capacitance ESD Protection 10 k Resistor 0402 5% 1/16 W 1.0 k Resistor 0402 5% 0.1 W 22 k Resistor 0402 5% 1/16 W 1.2 H Inductor 6 A 21 m 20%

CG0402MLE-18G - Bourns RC0402JR-0710KL - Yageo Phycomp RC0402JR-071K0L - Yageo Phycomp RC0402JR-0722KL - Yageo Phycomp 7447745012 - Wurth Li-Ion/Li-Polymer Battery DC/DC Charger / Regulator with integrated Power Path Management function MP2617 - Monolithic Power Systems (MPS) Table 19: Suggested components for Li-Ion (or Li-Polymer) battery charging and power path management application circuit UBX-13004618 - R04 Advance Information Design-in Page 70 of 141 C10C13GNDC12C11C14TOBY-L2 series71VCC72VCC70VCC+Primary SourceR3U1ENILIMISETTMRAGNDVINC2C112VNTCPGNDSWSYSBATC4R1R2D1Li-Ion/Li-Pol Battery PackB1C5Li-Ion/Li-Polymer Battery Charger / Regulator with Power Path ManagmentVCCC3C6L1BSTD2VLIMR4R5C7C8C9C15 TOBY-L2 and MPCI-L2 series - System Integration Manual 2.2.1.9 Guidelines for VCC or 3.3Vaux supply layout design Good connection of the module VCC or 3.3Vaux pins with DC supply source is required for correct RF performance. Guidelines are summarized in the following list:

All the available VCC / 3.3Vaux pins must be connected to the DC source VCC / 3.3Vaux connection must be as wide as possible and as short as possible Any series component with Equivalent Series Resistance (ESR) greater than few milliohms must be avoided VCC / 3.3Vaux connection must be routed through a PCB area separated from RF lines / parts, sensitive analog signals and sensitive functional units: it is good practice to interpose at least one layer of PCB ground between the VCC / 3.3Vaux track and other signal routing Coupling between VCC / 3.3Vaux and digital lines, especially USB, must be avoided. The tank bypass capacitor with low ESR for current spikes smoothing described in section 2.2.1.6 should be placed close to the VCC / 3.3Vaux pins. If the main DC source is a switching DC-DC converter, place the large capacitor close to the DC-DC output and minimize VCC / 3.3Vaux track length. Otherwise consider using separate capacitors for DC-DC converter and module tank capacitor The bypass capacitors in the pF range described in Figure 31 and Table 17 should be placed as close as possible to the VCC / 3.3Vaux pins. This is highly recommended if the application device integrates an internal antenna Since VCC / 3.3Vaux input provide the supply to RF Power Amplifiers, voltage ripple at high frequency may result in unwanted spurious modulation of transmitter RF signal. This is more likely to happen with switching DC-DC converters, in which case it is better to select the highest operating frequency for the switcher and add a large L-C filter before connecting to the TOBY-L2 and MPCI-L2 series modules in the worst case If VCC / 3.3Vaux is protected by transient voltage suppressor to ensure that the voltage maximum ratings are not exceeded, place the protecting device along the path from the DC source toward the module, preferably closer to the DC source (otherwise protection functionality may be compromised) 2.2.1.10 Guidelines for grounding layout design Good connection of the module GND pins with application board solid ground layer is required for correct RF performance. It significantly reduces EMC issues and provides a thermal heat sink for the module. Connect each GND pin with application board solid GND layer. It is strongly recommended that each GND pad surrounding VCC pins have one or more dedicated via down to the application board solid ground layer The VCC supply current flows back to main DC source through GND as ground current: provide adequate return path with suitable uninterrupted ground plane to main DC source It is recommended to implement one layer of the application board as ground plane as wide as possible If the application board is a multilayer PCB, then all the board layers should be filled with GND plane as much as possible and each GND area should be connected together with complete via stack down to the main ground layer of the board If the whole application device is composed by more than one PCB, then it is required to provide a good and solid ground connection between the GND areas of all the different PCBs Good grounding of GND pads also ensures thermal heat sink. This is critical during connection, when the real network commands the module to transmit at maximum power: proper grounding helps prevent module overheating. UBX-13004618 - R04 Advance Information Design-in Page 71 of 141 TOBY-L2 and MPCI-L2 series - System Integration Manual 2.2.2 RTC supply output (V_BCKP) The RTC supply V_BCKP pin is not available on MPCI-L2 series modules. 2.2.2.1 Guidelines for V_BCKP circuit design TOBY-L2 series modules provide the V_BCKP RTC supply input/output, which can be mainly used to:

Provide RTC back-up when VCC supply is removed If RTC timing is required to run for a time interval of T [s] when VCC supply is removed, place a capacitor with a nominal capacitance of C [F] at the V_BCKP pin. Choose the capacitor using the following formula:

C [F] = (Current_Consumption [A] x T [s]) / Voltage_Drop [V]

= 1.25 x T [s]

For example, a 100 F capacitor can be placed at V_BCKP to provide RTC backup holding the V_BCKP voltage within its valid range for around 80 s at 25 C, after the VCC supply is removed. If a longer buffering time is required, a 70 mF super-capacitor can be placed at V_BCKP, with a 4.7 k series resistor to hold the V_BCKP voltage within its valid range for approximately 15 hours at 25 C, after the VCC supply is removed. The purpose of the series resistor is to limit the capacitor charging current due to the large capacitor specifications, and also to let a fast rise time of the voltage value at the V_BCKP pin after VCC supply has been provided. These capacitors allow the time reference to run during battery disconnection. Figure 35: Real time clock supply (V_BCKP) application circuits: (a) using a 100 F capacitor to let the RTC run for ~80 s after VCC removal; (b) using a 70 mF capacitor to let RTC run for ~15 hours after VCC removal; (c) using a non-rechargeable battery Reference Description Part Number - Manufacturer C1 R2 C2 100 F Tantalum Capacitor GRM43SR60J107M - Murata 4.7 k Resistor 0402 5% 0.1 W RC0402JR-074K7L - Yageo Phycomp 70 mF Capacitor XH414H-IV01E - Seiko Instruments Table 20: Example of components for V_BCKP buffering If very long buffering time is required to allow the RTC time reference to run during a disconnection of the VCC supply, then an external battery can be connected to V_BCKP pin. The battery should be able to provide a proper nominal voltage and must never exceed the maximum operating voltage for V_BCKP (specified in the Input characteristics of Supply/Power pins table in TOBY-L2 series Data Sheet [1]). The connection of the battery to V_BCKP should be done with a suitable series resistor for a rechargeable battery, or with an appropriate series diode for a non-rechargeable battery. The purpose of the series resistor is to limit the battery charging current due to the battery specifications, and also to allow a fast rise time of the voltage value at the V_BCKP pin after the VCC supply has been provided. The purpose of the series diode is to avoid a current flow from the module V_BCKP pin to the non-rechargeable battery. UBX-13004618 - R04 Advance Information Design-in Page 72 of 141 TOBY-L2 seriesC1(a)3V_BCKPR2TOBY-L2 seriesC2(superCap)(b)3V_BCKPD3TOBY-L2 seriesB3(c)3V_BCKP TOBY-L2 and MPCI-L2 series - System Integration Manual If the RTC timing is not required when the VCC supply is removed, it is not needed to connect the V_BCKP pin to an external capacitor or battery. In this case the date and time are not updated when VCC is disconnected. If VCC is always supplied, then the internal regulator is supplied from the main supply and there is no need for an external component on V_BCKP. Combining a cellular module with a u-blox GNSS positioning receiver, the positioning receiver VCC supply is controlled by the cellular module by means of the GNSS supply enable function provided by the GPIO2 of the cellular module. In this case the V_BCKP supply output of the cellular module can be connected to the V_BCKP backup supply input pin of the GNSS receiver to provide the supply for the positioning real time clock and backup RAM when the VCC supply of the cellular module is within its operating range and the VCC supply of the GNSS receiver is disabled. This enables the u-blox GNSS receiver to recover from a power breakdown with either a hot start or a warm start (depending on the duration of the positioning VCC outage) and to maintain the configuration settings saved in the backup RAM. See section 2.6.3 for more details regarding the application circuit with a u-blox GNSS receiver. V_BCKP supply output pin provides internal short circuit protection to limit start-up current and protect the device in short circuit situations. No additional external short circuit protection is required. Do not apply loads which might exceed the limit for maximum available current from V_BCKP supply (see TOBY-L2 series Data Sheet [1]) as this can cause malfunctions in internal circuitry. ESD sensitivity rating of the V_BCKP supply pin is 1 kV (Human Body Model according to JESD22-A114). Higher protection level could be required if the line is externally accessible and it can be achieved by mounting an ESD protection (e.g. EPCOS CA05P4S14THSG varistor array) close to the accessible point. 2.2.2.2 Guidelines for V_BCKP layout design V_BCKP supply requires careful layout: avoid injecting noise on this voltage domain as it may affect the stability of the internal circuitry. UBX-13004618 - R04 Advance Information Design-in Page 73 of 141 TOBY-L2 and MPCI-L2 series - System Integration Manual 2.2.3 Generic digital interfaces supply output (V_INT) The generic digital interfaces supply V_INT pin is not available on MPCI-L2 series modules. 2.2.3.1 Guidelines for V_INT circuit design TOBY-L2 series provide the V_INT generic digital interfaces 1.8 V supply output, which can be mainly used to:

Indicate when the module is switched on (as described in sections 1.6.1, 1.6.2) Pull-up SIM detection signal (see section 2.5 for more details) Supply voltage translators to connect 1.8 V module generic digital interfaces to 3.0 V devices (e.g. see 2.6.2) Pull-up DDC (I2C) interface signals (see section 2.6.3 for more details) Supply a 1.8 V u-blox 6 or subsequent u-blox GNSS receiver generation (see section 2.6.3 for more details) V_INT supply output pin provides internal short circuit protection to limit start-up current and protect the device in short circuit situations. No additional external short circuit protection is required. Do not apply loads which might exceed the limit for maximum available current from V_INT supply (see the TOBY-L2 series Data Sheet [1]) as this can cause malfunctions in internal circuitry. Since the V_INT supply is generated by an internal switching step-down regulator, the V_INT voltage ripple can range as specified in the TOBY-L2 series Data Sheet [1]: it is not recommended to supply sensitive analog circuitry without adequate filtering for digital noise. V_INT can only be used as an output: do not connect any external supply source on V_INT. ESD sensitivity rating of the V_INT supply pin is 1 kV (Human Body Model according to JESD22-A114). Higher protection level could be required if the line is externally accessible and it can be achieved by mounting an ESD protection (e.g. EPCOS CA05P4S14THSG varistor array) close to the accessible point. It is recommended to provide direct access to the V_INT pin on the application board by means of an accessible test point directly connected to the V_INT pin. 2.2.3.2 Guidelines for V_INT layout design V_INT supply output is generated by an integrated switching step-down converter. Because of this, it can be a source of noise: avoid coupling with sensitive signals. UBX-13004618 - R04 Advance Information Design-in Page 74 of 141 TOBY-L2 and MPCI-L2 series - System Integration Manual 2.3 System functions interfaces 2.3.1 Module power-on (PWR_ON) The PWR_ON input pin is not available on MPCI-L2 series modules. 2.3.1.1 Guidelines for PWR_ON circuit design TOBY-L2 series PWR_ON input is equipped with an internal active pull-up resistor to the VCC module supply as described in Figure 36: an external pull-up resistor is not required and should not be provided. If connecting the PWR_ON input to a push button, the pin will be externally accessible on the application device. According to EMC/ESD requirements of the application, an additional ESD protection should be provided close to the accessible point, as described in Figure 36 and Table 21. ESD sensitivity rating of the PWR_ON pin is 1 kV (Human Body Model according to JESD22-A114). Higher protection level can be required if the line is externally accessible on the application board, e.g. if an accessible push button is directly connected to PWR_ON pin, and it can be achieved by mounting an ESD protection (e.g. EPCOS CA05P4S14THSG varistor) close to the accessible point. An open drain or open collector output is suitable to drive the PWR_ON input from an application processor as PWR_ON input is equipped with an internal active pull-up resistor to the VCC supply, as described in Figure 36. A compatible push-pull output of an application processor can also be used. In any case, take care to set the proper level in all the possible scenarios to avoid an inappropriate module switch-on. Figure 36: PWR_ON application circuits using a push button and an open drain output of an application processor Reference Description Remarks ESD CT0402S14AHSG - EPCOS Varistor array for ESD protection Table 21: Example ESD protection component for the PWR_ON application circuit It is recommended to provide direct access to the PWR_ON pin on the application board by means of an accessible test point directly connected to the PWR_ON pin. 2.3.1.2 Guidelines for PWR_ON layout design The power-on circuit (PWR_ON) requires careful layout since it is the sensitive input available to switch on the TOBY-L2 modules. It is required to ensure that the voltage level is well defined during operation and no transient noise is coupled on this line, otherwise the module might detect a spurious power-on request. UBX-13004618 - R04 Advance Information Design-in Page 75 of 141 TOBY-L2 series50 kVCC20PWR_ONPower-on push buttonESDOpen Drain OutputApplication ProcessorTOBY-L2 series50 kVCC20PWR_ONTPTP TOBY-L2 and MPCI-L2 series - System Integration Manual 2.3.2 Module reset (RESET_N or PERST#) 2.3.2.1 Guidelines for RESET_N and PERST# circuit design The TOBY-L2 series RESET_N is equipped with an internal pull-up to the VCC supply and the MPCI-L2 series PERST# is equipped with an internal pull-up to the 3.3 V rail, as described in Figure 37. An external pull-up resistor is not required and should not be provided. If connecting the RESET_N or PERST# input to a push button, the pin will be externally accessible on the application device. According to EMC/ESD requirements of the application, an additional ESD protection device

(e.g. the EPCOS CA05P4S14THSG varistor) should be provided close to accessible point on the line connected to this pin, as described in Figure 37 and Table 22. ESD sensitivity rating of the RESET_N and PERST# pins is 1 kV (HBM according to JESD22-A114). Higher protection level can be required if the line is externally accessible on the application board, e.g. if an accessible push button is directly connected to the RESET_N or PERST# pin, and it can be achieved by mounting an ESD protection (e.g. EPCOS CA05P4S14THSG varistor) close to accessible point. An open drain output is suitable to drive the RESET_N and PERST# inputs from an application processor as they are equipped with an internal pull-up to VCC supply and to the 3.3 V rail respectively, as described in Figure 37. A compatible push-pull output of an application processor can also be used. In any case, take care to set the proper level in all the possible scenarios to avoid an inappropriate module reset, switch-on or switch-off. Figure 37: RESET_N and PERST# application circuits using a push button and an open drain output of an application processor Reference Description Remarks ESD Varistor for ESD protection CT0402S14AHSG - EPCOS Table 22: Example of ESD protection component for the RESET_N and PERST# application circuits If the external reset function is not required by the customer application, the RESET_N input pin can be left unconnected to external components, but it is recommended providing direct access on the application board by means of an accessible test point directly connected to the RESET_N pin. UBX-13004618 - R04 Advance Information Design-in Page 76 of 141 TOBY-L2 seriesVCC23RESET_NPower-on push buttonESDOpen Drain OutputApplication ProcessorTOBY-L2 seriesVCC23RESET_NTPTP50 k50 kMPCI-L2 series22PERST#Power-on push buttonESDOpen Drain OutputApplication ProcessorMPCI-L2 series22PERST#45 k45 k3V33V3 TOBY-L2 and MPCI-L2 series - System Integration Manual 2.3.2.2 Guidelines for RESET_N and PERST# layout design The RESET_N and PERST# circuits require careful layout due to the pin function: ensure that the voltage level is well defined during operation and no transient noise is coupled on this line, otherwise the module might detect a spurious reset request. It is recommended to keep the connection line to RESET_N and PERST# pins as short as possible. 2.3.3 Module configuration selection by host processor The HOST_SELECT0 and HOST_SELECT1 pins are not available on MPCI-L2 series modules. 2.3.3.1 Guidelines for HOST_SELECTx circuit design is not supported by the The functionality of the HOST_SELECT0 and HOST_SELECT1 pins TOBY-L2x0-00S product version: the two input pins should be not driven by the host application processor. TOBY-L2 series modules include two input pins (HOST_SELECT0 and HOST_SELECT1) for the selection of the module configuration by the host application processor. Guidelines for HOST_SELECT0 and HOST_SELECT1 pins circuit design will be described in detail in a successive release of the document. Do not apply voltage to HOST_SELECT0 and HOST_SELECT1 pins before the switch-on of their supply source (V_INT), to avoid latch-up of circuits and allow a proper boot of the module. If the external signals connected to the cellular module cannot be tri-stated or set low, insert a multi channel digital switch (e.g. TI SN74CB3Q16244, TS5A3159, or TS5A63157) between the two-circuit connections and set to high impedance before V_INT switch-on. ESD sensitivity rating of the HOST_SELECT0 and HOST_SELECT1 pins is 1 kV (HBM as per JESD22-A114). Higher protection level could be required if the lines are externally accessible and it can be achieved by mounting an ESD protection (e.g. EPCOS CA05P4S14THSG varistor array) close to accessible points If the HOST_SELECT0 and HOST_SELECT1 pins are not used, they can be left unconnected on the application board. 2.3.3.2 Guidelines for HOST_SELECTx layout design The input pins for the selection of the module configuration by the host application processor (HOST_SELECT0 and HOST_SELECT1) are generally not critical for layout. UBX-13004618 - R04 Advance Information Design-in Page 77 of 141 TOBY-L2 and MPCI-L2 series - System Integration Manual 2.4 Antenna interface TOBY-L2 and MPCI-L2 series modules provide two RF interfaces for connecting the external antennas:

The ANT1 pin represents the primary RF input/output for LTE/3G/2G RF signals transmission and reception. The ANT2 pin represents the secondary RF input for LTE MIMO 2 x 2 or 3G Rx diversity RF signals reception. Both the ANT1 and the ANT2 pins have a nominal characteristic impedance of 50 and must be connected to the related antenna through a 50 transmission line to allow proper transmission / reception of RF signals. Two antennas (one connected to ANT1 pin and one connected to ANT2 pin) must be used to support the Down-Link MIMO 2 x 2 radio technology. This is a required feature for LTE category 4 User Equipments

(up to 150 Mb/s Down-Link data rate) according to 3GPP specifications. 2.4.1 Antenna RF interfaces (ANT1 / ANT2) 2.4.1.1 General guidelines for antenna selection and design The antenna is the most critical component to be evaluated. Designers must take care of the antennas from all perspective at the very start of the design phase when the physical dimensions of the application board are under analysis/decision, since the RF compliance of the device integrating TOBY-L2 and MPCI-L2 series modules with all the applicable required certification schemes depends on antennas radiating performance. LTE/3G/2G antennas are typically available in the types of linear monopole or PCB antennas such as patches or ceramic SMT elements. External antennas (e.g. linear monopole) o o o External antennas basically do not imply physical restriction to the design of the PCB where the TOBY-L2 and MPCI-L2 series module is mounted. The radiation performance mainly depends on the antennas. It is required to select antennas with optimal radiating performance in the operating bands. RF cables should be carefully selected to have minimum insertion losses. Additional insertion loss will be introduced by low quality or long cable. Large insertion loss reduces both transmit and receive radiation performance. o A high quality 50 RF connector provides proper PCB-to-RF-cable transition. It is recommended to strictly follow the layout and cable termination guidelines provided by the connector manufacturer. Integrated antennas (e.g. patch-like antennas):

o Internal integrated antennas imply physical restriction to the design of the PCB:

Integrated antenna excites RF currents on its counterpoise, typically the PCB ground plane of the device that becomes part of the antenna: its dimension defines the minimum frequency that can be radiated. Therefore, the ground plane can be reduced down to a minimum size that should be similar to the quarter of the wavelength of the minimum frequency that has to be radiated, given that the orientation of the ground plane relative to the antenna element must be considered. The isolation between the primary and the secondary antennas has to be as high as possible and the correlation between the 3D radiation patterns of the two antennas has to be as low as possible. In general, a separation of at least a quarter wavelength between the two antennas is required to achieve a good isolation and low pattern correlation. As numerical example, the physical restriction to the PCB design can be considered as following:

Frequency = 750 MHz Wavelength = 40 cm Minimum GND plane size = 10 cm UBX-13004618 - R04 Advance Information Design-in Page 78 of 141 TOBY-L2 and MPCI-L2 series - System Integration Manual o o o o Radiation performance depends on the whole PCB and antenna system design, including product mechanical design and usage. Antennas should be selected with optimal radiating performance in the operating bands according to the mechanical specifications of the PCB and the whole product. It is recommended to select a pair of custom antennas designed by an antennas manufacturer if the required ground plane dimensions are very small (e.g. less than 6.5 cm long and 4 cm wide). The antenna design process should begin at the start of the whole product design process It is highly recommended to strictly follow the detailed and specific guidelines provided by the antenna manufacturer regarding correct installation and deployment of the antenna system, including PCB layout and matching circuitry Further to the custom PCB and product restrictions, antennas may require tuning to obtain the required performance for compliance with all the applicable required certification schemes. It is recommended to consult the antenna manufacturer for the design-in guidelines for antenna matching relative to the custom application In both of cases, selecting external or internal antennas, these recommendations should be observed:

Select antennas providing optimal return loss (or V.S.W.R.) figure over all the operating frequencies. Select antennas providing optimal efficiency figure over all the operating frequencies. Select antennas providing similar efficiency for both the primary (ANT1) and the secondary (ANT2) antenna. Select antennas providing appropriate gain figure (i.e. combined antenna directivity and efficiency figure) so that the electromagnetic field radiation intensity do not exceed the regulatory limits specified in some countries (e.g. by FCC in the United States, as reported in the section 4.2.2). Select antennas capable to provide low Envelope Correlation Coefficient between the primary (ANT1) and the secondary (ANT2) antenna: the 3D antenna radiation patterns should have lobes in different directions. 2.4.1.2 Guidelines for antenna RF interface design Guidelines for TOBY-L2 series ANT1 / ANT2 pins RF connection design Proper transition between ANT1 / ANT2 pads and the application board PCB must be provided, implementing the following design-in guidelines for the layout of the application PCB close to the ANT1 / ANT2 pads:

On a multilayer board, the whole layer stack below the RF connection should be free of digital lines Increase GND keep-out (i.e. clearance, a void area) around the ANT1 / ANT2 pads, on the top layer of the application PCB, to at least 250 m up to adjacent pads metal definition and up to 400 m on the area below the module, to reduce parasitic capacitance to ground, as described in the left picture in Figure 38 Add GND keep-out (i.e. clearance, a void area) on the buried metal layer below the ANT1 / ANT2 pads if the top-layer to buried layer dielectric thickness is below 200 m, to reduce parasitic capacitance to ground, as described in the right picture in Figure 38 Figure 38: GND keep-out area on top layer around ANT1 / ANT2 pads and on very close buried layer below ANT1 / ANT2 pads UBX-13004618 - R04 Advance Information Design-in Page 79 of 141 Min. 250 mMin. 400 mGNDANT1GND clearance on very close buried layerbelow ANT1 padGND clearance on top layer around ANT1 padMin. 250 mMin. 400 mGNDANT2GND clearance on very close buried layerbelow ANT2 padGND clearance on top layer around ANT2 pad TOBY-L2 and MPCI-L2 series - System Integration Manual Guidelines for MPCI-L2 series ANT1 / ANT2 receptacles RF connection design The Hirose U.FL-R-SMT RF receptacles implemented on the MPCI-L2 series modules for ANT1 / ANT2 ports require a suitable mated RF plug from the same connector series. Due to its wide usage in the industry, several manufacturers offer compatible equivalents. Table 23 lists some RF connector plugs that fit MPCI-L2 series modules RF connector receptacles, based on the declaration of the respective manufacturers. Only the Hirose has been qualified for the MPCI-L2 series modules;

contact other producers to verify compatibility. Manufacturer Series Remarks Hirose I-PEX Tyco U.FL Ultra Small Surface Mount Coaxial Connector Recommended MHF Micro Coaxial Connector UMCC Ultra-Miniature Coax Connector Amphenol RF AMC Amphenol Micro Coaxial Lighthorse Technologies, Inc IPX ultra micro-miniature RF connector Table 23: MPCI-L2 series U.FL compatible plug connector Typically the RF plug is available as a cable assembly: several kinds are available and the user should select the cable assembly best suited to the application. The key characteristics are:

RF plug type: select U.FL or equivalent Nominal impedance: 50 Cable thickness: typically from 0.8 mm to 1.37 mm. Select thicker cables to minimize insertion loss Cable length: standard length is typically 100 mm or 200 mm, custom lengths may be available on request. Select shorter cables to minimize insertion loss RF connector on the other side of the cable: for example another U.FL (for board-to-board connection) or SMA (for panel mounting) For applications requiring an internal integrated SMT antenna, it is suggested to use a U-FL-to-U.FL cable to provide RF path from the MPCI-L2 series module to PCB strip line or micro strip connected to antenna pads as shown in Figure 39. Take care that the PCB-to-RF-cable transition, strip line and antenna pads must be designed so that the characteristic impedance is as close as possible to 50 : see the following subsections for specific guidelines regarding RF transmission line design and RF termination design. If an external antenna is required, consider that the connector is typically rated for a limited number of insertion cycles. In addition, the RF coaxial cable may be relatively fragile compared to other types of cables. To increase application ruggedness, connect U.FL to a more robust connector (e.g. SMA or MMCX) fixed on panel or on flange as shown in Figure 39. Figure 39: Example of RF connections, U.FL-to-U.FL cable for internal antenna and U.FL-to-SMA for external antenna UBX-13004618 - R04 Advance Information Design-in Page 80 of 141 MPCI-L2 seriesBaseboardStripline/MicrostripInternal AntennaBaseboardApplication ChassisConnector to External AntennaMPCI-L2 seriesLatch for Mini PCIeLatch for Mini PCIe TOBY-L2 and MPCI-L2 series - System Integration Manual Guidelines for RF transmission line design Any RF transmission line, such as the ones from the ANT1 and ANT2 pads up to the related antenna connector or up to the related internal antenna pad, must be designed so that the characteristic impedance is as close as possible to 50 . RF transmission lines can be designed as a micro strip (consists of a conducting strip separated from a ground plane by a dielectric material) or a strip line (consists of a flat strip of metal which is sandwiched between two parallel ground planes within a dielectric material). The micro strip, implemented as a coplanar waveguide, is the most common configuration for printed circuit board. Figure 40 and Figure 41 provide two examples of proper 50 coplanar waveguide designs. The first example of RF transmission line can be implemented in case of 4-layer PCB stack-up herein described, and the second example of RF transmission line can be implemented in case of 2-layer PCB stack-up herein described. Figure 40: Example of 50 coplanar waveguide transmission line design for the described 4-layer board layup Figure 41: Example of 50 coplanar waveguide transmission line design for the described 2-layer board layup If the two examples do not match the application PCB stack-up the 50 characteristic impedance calculation can be made using the HFSS commercial finite element method solver for electromagnetic structures from Ansys Corporation, or using freeware tools like AppCAD from Agilent (www.agilent.com) or TXLine from Applied Wave Research (www.mwoffice.com), taking care of the approximation formulas used by the tools for the impedance computation. To achieve a 50 characteristic impedance, the width of the transmission line must be chosen depending on:

the thickness of the transmission line itself (e.g. 35 m in the example of Figure 40 and Figure 41) the thickness of the dielectric material between the top layer (where the transmission line is routed) and the inner closer layer implementing the ground plane (e.g. 270 m in Figure 40, 1510 m in Figure 41) the dielectric constant of the dielectric material (e.g. dielectric constant of the FR-4 dielectric material in Figure 40 and Figure 41) UBX-13004618 - R04 Advance Information Design-in Page 81 of 141 35 m35 m35 m35 m270 m270 m760 mL1 CopperL3 CopperL2 CopperL4 CopperFR-4 dielectricFR-4 dielectricFR-4 dielectric380 m500 m500 m35 m35 m1510 mL2 CopperL1 CopperFR-4 dielectric1200 m400 m400 m TOBY-L2 and MPCI-L2 series - System Integration Manual the gap from the transmission line to the adjacent ground plane on the same layer of the transmission line

(e.g. 500 m in Figure 40, 400 m in Figure 41) If the distance between the transmission line and the adjacent GND area (on the same layer) does not exceed 5 times the track width of the micro strip, use the Coplanar Waveguide model for the 50 calculation. Additionally to the 50 impedance, the following guidelines are recommended for transmission lines design:

Minimize the transmission line length: the insertion loss should be minimized as much as possible, in the order of a few tenths of a dB, Add GND keep-out (i.e. clearance, a void area) on buried metal layers below any pad of component present on the RF transmission lines, if top-layer to buried layer dielectric thickness is below 200 m, to reduce parasitic capacitance to ground, The transmission lines width and spacing to GND must be uniform and routed as smoothly as possible: avoid abrupt changes of width and spacing to GND, Add GND stitching vias around transmission lines, as described in Figure 42, Ensure solid metal connection of the adjacent metal layer on the PCB stack-up to main ground layer, providing enough vias on the adjacent metal layer, as described in Figure 42, Route RF transmission lines far from any noise source (as switching supplies and digital lines) and from any sensitive circuit (as USB), Avoid stubs on the transmission lines, Avoid signal routing in parallel to transmission lines or crossing the transmission lines on buried metal layer, Do not route microstrip lines below discrete component or other mechanics placed on top layer An example of proper RF circuit design is reported in Figure 42. In this case, the ANT1 and ANT2 pins are directly connected to SMA connectors by means of proper 50 transmission lines, designed with proper layout. Figure 42: Suggested circuit and layout for antenna RF circuits on application board UBX-13004618 - R04 Advance Information Design-in Page 82 of 141 SMA Connector Primary AntennaSMA Connector Secondary AntennaTOBY-L2 series TOBY-L2 and MPCI-L2 series - System Integration Manual Guidelines for RF termination design RF terminations must provide a characteristic impedance of 50 as well as the RF transmission lines up to the RF terminations themselves, to match the characteristic impedance of the ANT1 / ANT2 ports of the modules. However, real antennas do not have perfect 50 load on all the supported frequency bands. Therefore, to reduce as much as possible performance degradation due to antennas mismatch, RF terminations must provide optimal return loss (or V.S.W.R.) figure over all the operating frequencies, as summarized in Table 8 and Table 9. If external antennas are used, the antenna connectors represent the RF termination on the PCB:

Use suitable 50 connectors providing proper PCB-to-RF-cable transition. Strictly follow the connector manufacturers recommended layout, for example:

o SMA Pin-Through-Hole connectors require GND keep-out (i.e. clearance, a void area) on all the layers around the central pin up to annular pads of the four GND posts, as shown in Figure 42 o U.FL surface mounted connectors require no conductive traces (i.e. clearance, a void area) in the area below the connector between the GND land pads. Cut out the GND layer under RF connectors and close to buried vias, to remove stray capacitance and thus keep the RF line 50 , e.g. the active pad of UFL connectors needs to have a GND keep-out (i.e. clearance, a void area) at least on first inner layer to reduce parasitic capacitance to ground. If integrated antennas are used, the RF terminations are represented by the integrated antennas themselves. The following guidelines should be followed:

Use antennas designed by an antenna manufacturer, providing the best possible return loss (or V.S.W.R.). Provide a ground plane large enough according to the relative integrated antenna requirements. The ground plane of the application PCB can be reduced down to a minimum size that must be similar to one quarter of wavelength of the minimum frequency that has to be radiated. As numerical example, Frequency = 750 MHz Wavelength = 40 cm Minimum GND plane size = 10 cm It is highly recommended to strictly follow the detailed and specific guidelines provided by the antenna manufacturer regarding correct installation and deployment of the antenna system, including PCB layout and matching circuitry. Further to the custom PCB and product restrictions, antennas may require a tuning to comply with all the applicable required certification schemes. It is recommended to consult the antenna manufacturer for the design-in guidelines for the antenna matching relative to the custom application. Additionally, these recommendations regarding the antenna system placement must be followed:

Do not place antennas within closed metal case. Do not place the antennas in close vicinity to end user since the emitted radiation in human tissue is limited by regulatory requirements. Place the antennas far from sensitive analog systems or employ countermeasures to reduce EMC issues. Take care of interaction between co-located RF systems since the LTE/3G/2G transmitted power may interact or disturb the performance of companion systems. Place the two LTE/3G antennas providing low Envelope Correlation Coefficient (ECC) between primary

(ANT1) and secondary (ANT2) antenna: the antenna 3D radiation patterns should have lobes in different directions. The ECC between primary and secondary antenna needs to be enough low to comply with the radiated performance requirements specified by related certification schemes, as indicated in Table 10. Place the two LTE/3G antennas providing enough high isolation (see Table 10) between primary (ANT1) and secondary (ANT2) antenna. The isolation depends on the distance between antennas (separation of at least a quarter wavelength required for good isolation), antenna type (using antennas with different polarization improves isolation), antenna 3D radiation patterns (uncorrelated patterns improve isolation). UBX-13004618 - R04 Advance Information Design-in Page 83 of 141 TOBY-L2 and MPCI-L2 series - System Integration Manual Examples of antennas Table 24 lists some examples of possible internal on-board surface-mount antennas. Manufacturer Part Number Product Name Description Taoglas PCS.06.A Havok Taoglas PA.710.A Warrior GSM / WCDMA / LTE SMD Antenna 698..960 MHz, 1710..2170 MHz, 2500..2690 MHz 42.0 x 10.0 x 3.0 mm 700..960 MHz, 1710..2170 MHz GSM / WCDMA / LTE SMD Antenna 698..960 MHz, 1710..2170 MHz, 2300..2400 MHz, 2490..2690 MHz 40.0 x 6.0 x 5.0 mm Table 24: Examples of internal surface-mount antennas Table 25 lists some examples of possible internal off-board PCB-type antennas with cable and connector. Manufacturer Part Number Product Name Description Taoglas FXUB63.07.0150C Taoglas FXUB66.07.0150C Maximus Taoglas FXUB70.A.07.C.001 Ethertronics 5001537 Prestta EAD FSQS35241-UF-10 SQ7 GSM / WCDMA / LTE PCB Antenna with cable and U.FL 698..960 MHz, 1575.42 MHz, 1710..2170 MHz, 2400..2690 MHz 96.0 x 21.0 mm GSM / WCDMA / LTE PCB Antenna with cable and U.FL 698..960 MHz, 1390..1435 MHz, 1575.42 MHz, 1710..2170 MHz, 2400..2700 MHz, 3400..3600 MHz, 4800..6000 MHz 120.2 x 50.4 mm GSM / WCDMA / LTE PCB MIMO Antenna with cables and U.FL 698..960 MHz, 1575.42 MHz, 1710..2170 MHz, 2400..2690 MHz 182.2 x 21.2 mm GSM / WCDMA / LTE PCB Antenna with cable 704..960 MHz, 1710..2170 MHz, 2300..2400 MHz, 2500..2690 MHz 80.0 x 18.0 mm GSM / WCDMA / LTE PCB Antenna with cable and U.FL 690..960 MHz, 1710..2170 MHz, 2500..2700 MHz 110.0 x 21.0 mm Table 25: Examples of internal antennas with cable and connector UBX-13004618 - R04 Advance Information Design-in Page 84 of 141 TOBY-L2 and MPCI-L2 series - System Integration Manual Table 26 lists some examples of possible external antennas. Manufacturer Part Number Product Name Description Taoglas GSA.8827.A.101111 Phoenix Taoglas TG.30.8112 Laird Tech. TRA6927M3PW-001 Laird Tech. CMS69273 Laird Tech. OC69271-FNM Laird Tech. CMD69273-30NM Pulse Electronics WA700/2700SMA Table 26: Examples of external antennas GSM / WCDMA / LTE adhesive-mount Antenna with cable and SMA(M) 698..960 MHz, 1575.42 MHz, 1710..2170 MHz, 2490..2690 MHz 105 x 30 x 7.7 mm GSM / WCDMA / LTE swivel dipole Antenna with SMA(M) 698..960 MHz, 1575.42 MHz, 1710..2170 MHz, 2400..2700 MHz 148.6 x 49 x 10 mm GSM / WCDMA / LTE screw-mount Antenna with N-type(F) 698..960 MHz, 1710..2170 MHz, 2300..2700 MHz 83.8 x 36.5 mm GSM / WCDMA / LTE ceiling-mount Antenna with cable and N-type(F) 698..960 MHz, 1575.42 MHz, 1710..2700 MHz 86 x 199 mm GSM / WCDMA / LTE pole-mount Antenna with N-type(M) 698..960 MHz, 1710..2690 MHz 248 x 24.5 mm GSM / WCDMA / LTE ceiling-mount MIMO Antenna with cables & N-type(M) 698..960 MHz, 1710..2700 MHz 43.5 x 218.7 mm GSM / WCDMA / LTE clip-mount MIMO antenna with cables and SMA(M) 698..960 MHz,1710..2700 MHz 149 x 127 x 5.1 mm UBX-13004618 - R04 Advance Information Design-in Page 85 of 141 TOBY-L2 and MPCI-L2 series - System Integration Manual 2.4.2 Antenna detection interface (ANT_DET) Antenna detection interface (ANT_DET) is not available on MPCI-L2 series modules. Antenna detection interface (ANT_DET) is not supported by the TOBY-L2x0-00S product version. 2.4.2.1 Guidelines for ANT_DET circuit design Figure 43 and Table 27 describe the recommended schematic / components for the antennas detection circuit that must be provided on the application board and for the diagnostic circuit that must be provided on the antennas assembly to achieve primary and secondary antenna detection functionality. Figure 43: Suggested schematic for antenna detection circuit on application board and diagnostic circuit on antennas assembly Reference Description Part Number - Manufacturer C1 C2, C3 D1 L1, L2 R1 J1, J2 C4, C5 L3, L4 R2, R3 27 pF Capacitor Ceramic C0G 0402 5% 50 V GRM1555C1H270J - Murata 33 pF Capacitor Ceramic C0G 0402 5% 50 V GRM1555C1H330J - Murata Very Low Capacitance ESD Protection PESD0402-140 - Tyco Electronics 68 nH Multilayer Inductor 0402 (SRF ~1 GHz) LQG15HS68NJ02 - Murata 10 k Resistor 0402 1% 0.063 W RK73H1ETTP1002F - KOA Speer SMA Connector 50 Through Hole Jack SMA6251A1-3GT50G-50 - Amphenol 22 pF Capacitor Ceramic C0G 0402 5% 25 V GRM1555C1H220J - Murata 68 nH Multilayer Inductor 0402 (SRF ~1 GHz) LQG15HS68NJ02 - Murata 15 k Resistor for Diagnostic Various Manufacturers Table 27: Suggested components for antenna detection circuit on application board and diagnostic circuit on antennas assembly The antenna detection circuit and diagnostic circuit suggested in Figure 43 and Table 27 are explained here:

When antenna detection is forced by AT+UANTR command, ANT_DET generates a DC current measuring the resistance (R2 // R3) from antenna connectors (J1, J2) provided on the application board to GND. DC blocking capacitors are needed at the ANT1 / ANT2 pins (C2, C3) and at the antenna radiating element

(C4, C5) to decouple the DC current generated by the ANT_DET pin. Choke inductors with a Self Resonance Frequency (SRF) in the range of 1 GHz are needed in series at the ANT_DET pin (L1, L2) and in series at the diagnostic resistor (L3, L4), to avoid a reduction of the RF performance of the system, improving the RF isolation of the load resistor. Additional components (R1, C1 and D1 in Figure 43) are needed at the ANT_DET pin as ESD protection The ANT1 / ANT2 pins must be connected to the antenna connector by means of a transmission line with nominal characteristics impedance as close as possible to 50 . UBX-13004618 - R04 Advance Information Design-in Page 86 of 141 Application BoardAntenna CableTOBY-L2 series81ANT175ANT_DETR1C1D1C2J1Z0= 50 ohmZ0= 50 ohmZ0= 50 ohmPrimary Antenna AssemblyR2C4L3Radiating ElementDiagnostic CircuitL2L1Antenna Cable87ANT2C3J2Z0= 50 ohmZ0= 50 ohmZ0= 50 ohmSecondary Antenna AssemblyR3C5L4Radiating ElementDiagnostic Circuit TOBY-L2 and MPCI-L2 series - System Integration Manual The DC impedance at RF port for some antennas may be a DC open (e.g. linear monopole) or a DC short to reference GND (e.g. PIFA antenna). For those antennas, without the diagnostic circuit of Figure 43, the measured DC resistance is always at the limits of the measurement range (respectively open or short), and there is no means to distinguish between a defect on antenna path with similar characteristics (respectively: removal of linear antenna or RF cable shorted to GND for PIFA antenna). Furthermore, any other DC signal injected to the RF connection from ANT connector to radiating element will alter the measurement and produce invalid results for antenna detection. It is recommended to use an antenna with a built-in diagnostic resistor in the range from 5 k to 30 k to assure good antenna detection functionality and avoid a reduction of module RF performance. The choke inductor should exhibit a parallel Self Resonance Frequency (SRF) in the range of 1 GHz to improve the RF isolation of load resistor. For example:

Consider an antenna with built-in DC load resistor of 15 k. Using the +UANTR AT command, the module reports the resistance value evaluated from the antenna connector provided on the application board to GND:

Reported values close to the used diagnostic resistor nominal value (i.e. values from 13 k to 17 k if a 15 k diagnostic resistor is used) indicate that the antenna is properly connected. Values close to the measurement range maximum limit (approximately 50 k) or an open-circuit over range report (see u-blox AT Commands Manual [3]) means that that the antenna is not connected or the RF cable is broken. Reported values below the measurement range minimum limit (1 k) highlights a short to GND at antenna or along the RF cable. Measurement inside the valid measurement range and outside the expected range may indicate an improper connection, damaged antenna or wrong value of antenna load resistor for diagnostic. Reported value could differ from the real resistance value of the diagnostic resistor mounted inside the antenna assembly due to antenna cable length, antenna cable capacity and the used measurement method. If the primary / secondary antenna detection function is not required by the customer application, the ANT_DET pin can be left not connected and the ANT1 / ANT2 pins can be directly connected to the related antenna connector by means of a 50 transmission line as described in Figure 42. 2.4.2.1 Guidelines for ANT_DET layout design The recommended layout for the primary antenna detection circuit to be provided on the application board to achieve the primary antenna detection functionality, implementing the recommended schematic described in Figure 43 and Table 27, is explained here:

The ANT1 / ANT2 pins have to be connected to the antenna connector by means of a 50 transmission line, implementing the design guidelines described in section 2.4.1 and the recommendations of the SMA connector manufacturer. DC blocking capacitor at ANT1 / ANT2 pins (C2, C3) has to be placed in series to the 50 RF line. The ANT_DET pin has to be connected to the 50 transmission line by means of a sense line. Choke inductors in series at the ANT_DET pin (L1, L2) have to be placed so that one pad is on the 50 transmission line and the other pad represents the start of the sense line to the ANT_DET pin. The additional components (R1, C1 and D1) on the ANT_DET line have to be placed as ESD protection. UBX-13004618 - R04 Advance Information Design-in Page 87 of 141 TOBY-L2 and MPCI-L2 series - System Integration Manual 2.5 SIM interface SIM detection interface (GPIO5) is not available on MPCI-L2 series modules. SIM detection interface (GPIO5) is not supported by the TOBY-L2x0-00S product version: the pin should not be driven by any external device. 2.5.1 Guidelines for SIM circuit design Guidelines for SIM cards, SIM connectors and SIM chips selection The ISO/IEC 7816, the ETSI TS 102 221 and the ETSI TS 102 671 specifications define the physical, electrical and functional characteristics of Universal Integrated Circuit Cards (UICC), which contains the Subscriber Identification Module (SIM) integrated circuit that securely stores all the information needed to identify and authenticate subscribers over the LTE/3G/2G network. Removable UICC / SIM card contacts mapping is defined by ISO/IEC 7816 and ETSI TS 102 221 as follows:

Contact C1 = VCC (Supply) Contact C2 = RST (Reset) Contact C3 = CLK (Clock) Contact C4 = AUX1 (Auxiliary contact) Contact C5 = GND (Ground) Contact C6 = VPP (Programming supply) Contact C7 = I/O (Data input/output) Contact C8 = AUX2 (Auxiliary contact) It must be connected to VSIM or UIM_PWR It must be connected to SIM_RST or UIM_RESET It must be connected to SIM_CLK or UIM_CLK It must be left not connected It must be connected to GND It must be connected to VSIM or UIM_PWR It must be connected to SIM_IO or UIM_DATA It must be left not connected A removable SIM card can have 6 contacts (C1, C2, C3, C5, C6, C7) or 8 contacts, also including the auxiliary contacts C4 and C8 . Only 6 contacts are required and must be connected to the module SIM interface. Removable SIM cards are suitable for applications requiring a change of SIM card during the product lifetime. A SIM card holder can have 6 or 8 positions if a mechanical card presence detector is not provided, or it can have 6+2 or 8+2 positions if two additional pins relative to the normally-open mechanical switch integrated in the SIM connector for the mechanical card presence detection are provided. Select a SIM connector providing 6+2 or 8+2 positions if the optional SIM detection feature (not available on MPCI-L2 series) is required by the custom application, otherwise a connector without integrated mechanical presence switch can be selected. Solderable UICC / SIM chip contact mapping (M2M UICC Form Factor) is defined by ETSI TS 102 671 as:

Case Pin 8 = UICC Contact C1 = VCC (Supply) It must be connected to VSIM or UIM_PWR Case Pin 7 = UICC Contact C2 = RST (Reset) It must be connected to SIM_RST or UIM_RESET Case Pin 6 = UICC Contact C3 = CLK (Clock) It must be connected to SIM_CLK or UIM_CLK Case Pin 5 = UICC Contact C4 = AUX1 (Aux.contact) It must be left not connected Case Pin 1 = UICC Contact C5 = GND (Ground) It must be connected to GND Case Pin 2 = UICC Contact C6 = VPP (Progr. supply) It must be connected to VSIM or UIM_PWR Case Pin 3 = UICC Contact C7 = I/O (Data I/O) It must be connected to SIM_IO or UIM_DATA Case Pin 4 = UICC Contact C8 = AUX2 (Aux. contact) It must be left not connected A solderable SIM chip has 8 contacts and can also include the auxiliary contacts C4 and C8 for other uses, but only 6 contacts are required and must be connected to the module SIM card interface as described above. Solderable SIM chips are suitable for M2M applications where it is not required to change the SIM once installed. UBX-13004618 - R04 Advance Information Design-in Page 88 of 141 TOBY-L2 and MPCI-L2 series - System Integration Manual Guidelines for single SIM card connection without detection A removable SIM card placed in a SIM card holder must be connected to the SIM card interface of TOBY-L2 and MPCI-L2 series modules as described in Figure 44, where the optional SIM detection feature is not implemented. Follow these guidelines to connect the module to a SIM connector without SIM presence detection:

Connect the UICC / SIM contacts C1 (VCC) and C6 (VPP) to the VSIM / UIM_PWR pin of the module. Connect the UICC / SIM contact C7 (I/O) to the SIM_IO / UIM_DATA pin of the module. Connect the UICC / SIM contact C3 (CLK) to the SIM_CLK / UIM_CLK pin of the module. Connect the UICC / SIM contact C2 (RST) to the SIM_RST / UIM_RESET pin of the module. Connect the UICC / SIM contact C5 (GND) to ground. Provide a 100 nF bypass capacitor (e.g. Murata GRM155R71C104K) on SIM supply line, close to the relative pad of the SIM connector, to prevent digital noise. Provide a bypass capacitor of about 22 pF to 47 pF (e.g. Murata GRM1555C1H470J) on each SIM line, very close to each related pad of the SIM connector, to prevent RF coupling especially in case the RF antenna is placed closer than 10 - 30 cm from the SIM card holder. Provide a very low capacitance (i.e. less than 10 pF) ESD protection (e.g. Tyco PESD0402-140) on each externally accessible SIM line, close to each relative pad of the SIM connector. ESD sensitivity rating of the SIM interface pins is 1 kV (HBM). So that, according to EMC/ESD requirements of the custom application, higher protection level can be required if the lines are externally accessible on the application device. Limit capacitance and series resistance on each SIM signal to match the SIM requirements (27.7 ns is the maximum allowed rise time on clock line, 1.0 s is the maximum allowed rise time on data and reset lines). Figure 44: Application circuits for the connection to a single removable SIM card, with SIM detection not implemented Reference Description Part Number - Manufacturer C1, C2, C3, C4 47 pF Capacitor Ceramic C0G 0402 5% 50 V GRM1555C1H470JA01 - Murata C5 100 nF Capacitor Ceramic X7R 0402 10% 16 V GRM155R71C104KA01 - Murata D1, D2, D3, D4 Very Low Capacitance ESD Protection PESD0402-140 - Tyco Electronics J1 SIM Card Holder, 6 p, without card presence switch Various manufacturers, as C707 10M006 136 2 - Amphenol Table 28: Example of components for the connection to a single removable SIM card, with SIM detection not implemented UBX-13004618 - R04 Advance Information Design-in Page 89 of 141 TOBY-L2 series59VSIM57SIM_IO56SIM_CLK58SIM_RSTSIM CARD HOLDERC5C6C7C1C2C3SIM Card Bottom View (contacts side)C1VPP (C6)VCC (C1)IO (C7)CLK (C3)RST (C2)GND (C5)C2C3C5J1C4D1D2D3D4C8C4MPCI-L2 series8UIM_PWR10UIM_DATA12UIM_CLK14UIM_RESETSIM CARD HOLDERC5C6C7C1C2C3SIM Card Bottom View (contacts side)C1VPP (C6)VCC (C1)IO (C7)CLK (C3)RST (C2)GND (C5)C2C3C5J1C4D1D2D3D4C8C4 TOBY-L2 and MPCI-L2 series - System Integration Manual Guidelines for single SIM chip connection A solderable SIM chip (M2M UICC Form Factor) must be connected the SIM card interface of TOBY-L2 and MPCI-L2 series modules as described in Figure 45. Follow these guidelines to connect the module to a solderable SIM chip without SIM presence detection:

Connect the UICC / SIM contacts C1 (VCC) and C6 (VPP) to the VSIM / UIM_PWR pin of the module. Connect the UICC / SIM contact C7 (I/O) to the SIM_IO / UIM_DATA pin of the module. Connect the UICC / SIM contact C3 (CLK) to the SIM_CLK / UIM_CLK pin of the module. Connect the UICC / SIM contact C2 (RST) to the SIM_RST / UIM_RESET pin of the module. Connect the UICC / SIM contact C5 (GND) to ground. Provide a 100 nF bypass capacitor (e.g. Murata GRM155R71C104K) at the SIM supply line close to the relative pad of the SIM chip, to prevent digital noise. Provide a bypass capacitor of about 22 pF to 47 pF (e.g. Murata GRM1555C1H470J) on each SIM line, to prevent RF coupling especially in case the RF antenna is placed closer than 10 - 30 cm from the SIM lines. Limit capacitance and series resistance on each SIM signal to match the SIM requirements (27.7 ns is the maximum allowed rise time on clock line, 1.0 s is the maximum allowed rise time on data and reset lines). Figure 45: Application circuits for the connection to a single solderable SIM chip, with SIM detection not implemented Reference Description Part Number - Manufacturer C1, C2, C3, C4 47 pF Capacitor Ceramic C0G 0402 5% 50 V GRM1555C1H470JA01 - Murata C5 U1 100 nF Capacitor Ceramic X7R 0402 10% 16 V GRM155R71C104KA01 - Murata SIM chip (M2M UICC Form Factor) Various Manufacturers Table 29: Example of components for the connection to a single solderable SIM chip, with SIM detection not implemented UBX-13004618 - R04 Advance Information Design-in Page 90 of 141 TOBY-L2 series59VSIM57SIM_IO56SIM_CLK58SIM_RSTSIM CHIPSIM ChipBottom View (contacts side)C1VPP (C6)VCC (C1)IO (C7)CLK (C3)RST (C2)GND (C5)C2C3C5U1C4283671C1C5C2C6C3C7C4C887651234MPCI-L2 series8UIM_PWR10UIM_DATA12UIM_CLK14UIM_RESETSIM CHIPSIM ChipBottom View (contacts side)C1VPP (C6)VCC (C1)IO (C7)CLK (C3)RST (C2)GND (C5)C2C3C5U1C4283671C1C5C2C6C3C7C4C887651234 TOBY-L2 and MPCI-L2 series - System Integration Manual Guidelines for single SIM card connection with detection A removable SIM card placed in a SIM card holder must be connected to the SIM card interface of TOBY-L2 modules as described in Figure 46, where the optional SIM card detection feature is implemented. Follow these guidelines to connect the module to a SIM connector implementing SIM presence detection:

Connect the UICC / SIM contacts C1 (VCC) and C6 (VPP) to the VSIM pin of the module. Connect the UICC / SIM contact C7 (I/O) to the SIM_IO pin of the module. Connect the UICC / SIM contact C3 (CLK) to the SIM_CLK pin of the module. Connect the UICC / SIM contact C2 (RST) to the SIM_RST pin of the module. Connect the UICC / SIM contact C5 (GND) to ground. Connect one pin of the mechanical switch integrated in the SIM connector (e.g. the SW2 pin as described in Figure 46) to the GPIO5 input pin of the module. Connect the other pin of the mechanical switch integrated in the SIM connector (e.g. the SW1 pin as described in Figure 46) to the V_INT 1.8 V supply output of the module by means of a strong (e.g. 1 k) pull-up resistor, as the R1 resistor in Figure 46. Provide a weak (e.g. 470 k) pull-down resistor at the SIM detection line, as the R2 resistor in Figure 46 Provide a 100 nF bypass capacitor (e.g. Murata GRM155R71C104K) at the SIM supply line, close to the related pad of the SIM connector, to prevent digital noise. Provide a bypass capacitor of about 22 pF to 47 pF (e.g. Murata GRM1555C1H470J) on each SIM line, very close to each related pad of the SIM connector, to prevent RF coupling especially in case the RF antenna is placed closer than 10 - 30 cm from the SIM card holder. Provide a very low capacitance (i.e. less than 10 pF) ESD protection (e.g. Tyco PESD0402-140) on each externally accessible SIM line, close to each related pad of the SIM connector: ESD sensitivity rating of the SIM interface pins is 1 kV (HBM), so that, according to the EMC/ESD requirements of the custom application, higher protection level can be required if the lines are externally accessible on the application device. Limit capacitance and series resistance on each SIM signal to match the SIM requirements (27.7 ns is the maximum allowed rise time on clock line, 1.0 s is the maximum allowed rise time on data and reset lines). Figure 46: Application circuit for the connection to a single removable SIM card, with SIM detection implemented Reference Description Part Number - Manufacturer C1, C2, C3, C4 47 pF Capacitor Ceramic C0G 0402 5% 50 V GRM1555C1H470JA01 - Murata C5 100 nF Capacitor Ceramic X7R 0402 10% 16 V GRM155R71C104KA01 - Murata D1, , D6 Very Low Capacitance ESD Protection PESD0402-140 - Tyco Electronics R1 R2 J1 1 k Resistor 0402 5% 0.1 W 470 k Resistor 0402 5% 0.1 W RC0402JR-071KL - Yageo Phycomp RC0402JR-07470KL- Yageo Phycomp SIM Card Holder, 6 + 2 p, with card presence switch Various manufacturers, as CCM03-3013LFT R102 - C&K Table 30: Example of components for the connection to a single removable SIM card, with SIM detection implemented UBX-13004618 - R04 Advance Information Design-in Page 91 of 141 TOBY-L2 series5V_INT60GPIO5SIM CARD HOLDERC5C6C7C1C2C3SIM Card Bottom View (contacts side)C1VPP (C6)VCC (C1)IO (C7)CLK (C3)RST (C2)GND (C5)C2C3C5J1C4SW1SW2D1D2D3D4D5D6R2R1C8C4TP59VSIM57SIM_IO56SIM_CLK58SIM_RST TOBY-L2 and MPCI-L2 series - System Integration Manual Guidelines for dual SIM card / chip connection Two SIM card / chip can be connected to the SIM interface of TOBY-L2 and MPCI-L2 series modules as described in the application circuits of Figure 47. TOBY-L2 and MPCI-L2 series modules do not support the usage of two SIM at the same time, but two SIM can be populated on the application board, providing a proper switch to connect only the first or only the second SIM at a time to the SIM interface of the modules, as described in Figure 47. TOBY-L2x0-00S and MPCI-L2 modules do not support SIM hot insertion / removal: the physical connection between the external SIM and the module has to be provided before the module boot and then held for normal operation. Switching from one SIM to another can only be properly done within one of these two time periods:

after module switch-off by the AT+CPWROFF and before module switch-on by PWR_ON after network deregistration by AT+COPS=2 and before module reset by AT+CFUN=16 TOBY-L2 modules (except TOBY-L2x0-00S) support SIM hot insertion / removal on the GPIO5 pin: if the feature is enabled using the specific AT commands (see sections 1.8.2 and 1.11, and u-blox AT Commands Manual [3],

+UGPIOC, +UDCONF commands), the switch from first SIM to the second SIM can be properly done when a Low logic level is present on the GPIO5 pin (SIM not inserted = SIM interface not enabled), without the necessity of a module re-boot, so that the SIM interface will be re-enabled by the module to use the second SIM when a high logic level is re-applied on the GPIO5 pin. In the application circuit example represented in Figure 47, the application processor will drive the SIM switch using its own GPIO to properly select the SIM that is used by the module. Another GPIO may be used to handle the SIM hot insertion / removal function of TOBY-L2 modules, which can also be handled by other external circuits or by the cellular module GPIO according to the application requirements. The dual SIM connection circuit described in Figure 47 can be implemented for SIM chips as well, providing proper connection between SIM switch and SIM chip as described in Figure 45. If it is required to switch between more than 2 SIM, a circuit similar to the one described in Figure 47 can be implemented: in case of 4 SIM circuit, using proper 4-throw switch instead of the suggested 2-throw switches. Follow these guidelines to connect the module to two external SIM connectors:

Use a proper low on resistance (i.e. few ohms) and low on capacitance (i.e. few pF) 2-throw analog switch

(e.g. Fairchild FSA2567) as SIM switch to ensure high-speed data transfer according to SIM requirements. Connect the contacts C1 (VCC) and C6 (VPP) of the two UICC / SIM to the VSIM / UIM_PWR pin of the module by means of a proper 2-throw analog switch (e.g. Fairchild FSA2567). Connect the contact C7 (I/O) of the two UICC / SIM to the SIM_IO / UIM_DATA pin of the module by means of a proper 2-throw analog switch (e.g. Fairchild FSA2567). Connect the contact C3 (CLK) of the two UICC / SIM to the SIM_CLK / UIM_CLK pin of the module by means of a proper 2-throw analog switch (e.g. Fairchild FSA2567). Connect the contact C2 (RST) of the two UICC / SIM to the SIM_RST / UIM_RESET pin of the module by means of a proper 2-throw analog switch (e.g. Fairchild FSA2567). Connect the contact C5 (GND) of the two UICC / SIM to ground. Provide a 100 nF bypass capacitor (e.g. Murata GRM155R71C104K) at the SIM supply (VSIM / UIM_PWR), close to the related pad of the two SIM connectors, to prevent digital noise. Provide a bypass capacitor of about 22 pF to 47 pF (e.g. Murata GRM1555C1H470J) on each SIM line, very close to each related pad of the two SIM connectors, to prevent RF coupling especially in case the RF antenna is placed closer than 10 - 30 cm from the SIM card holders. Provide a very low capacitance (i.e. less than 10 pF) ESD protection (e.g. Tyco Electronics PESD0402-140) on each externally accessible SIM line, close to each pad of the two SIM connectors, according to the EMC/ESD requirements of the custom application. Limit capacitance and series resistance on each SIM signal to match the SIM requirements (27.7 ns is the maximum allowed rise time on clock line, 1.0 s is the maximum allowed rise time on data and reset lines). UBX-13004618 - R04 Advance Information Design-in Page 92 of 141 TOBY-L2 and MPCI-L2 series - System Integration Manual Figure 47: Application circuit for the connection to two removable SIM cards, with SIM detection not implemented Reference Description Part Number Manufacturer C1 C4, C6 C9 33 pF Capacitor Ceramic C0G 0402 5% 25 V GRM1555C1H330JZ01 Murata C5, C10, C11 100 nF Capacitor Ceramic X7R 0402 10% 16 V GRM155R71C104KA01 Murata D1 D8 Very Low Capacitance ESD Protection PESD0402-140 - Tyco Electronics R1 J1, J2 U1 47 k Resistor 0402 5% 0.1 W RC0402JR-0747KL- Yageo Phycomp SIM Card Holder, 6 + 2 p., with card presence switch CCM03-3013LFT R102 - C&K Components 4PDT Analog Switch, with Low On-Capacitance and Low On-Resistance FSA2567 - Fairchild Semiconductor Table 31: Example of components for the connection to two removable SIM cards, with SIM detection not implemented UBX-13004618 - R04 Advance Information Design-in Page 93 of 141 TOBY-L2 seriesC1FIRST SIM CARDVPP (C6)VCC (C1)IO (C7)CLK (C3)RST (C2)GND (C5)C2C3C5J1C4D1D2D3D4GNDU159VSIMVSIM1VSIM2VSIMVCCC114PDT Analog Switch3V857SIM_IODAT1DAT2DAT56SIM_CLKCLK1CLK2CLK58SIM_RSTRST1RST2RSTSELSECOND SIM CARDVPP (C6)VCC (C1)IO (C7)CLK (C3)RST (C2)GND (C5)J2C6C7C8C10C9D5D6D7D8Application ProcessorGPIOR1MPCI-L2 seriesC1FIRST SIM CARDVPP (C6)VCC (C1)IO (C7)CLK (C3)RST (C2)GND (C5)C2C3C5J1C4D1D2D3D4GNDU18UIM_PWRVSIM1VSIM2VSIMVCCC114PDT Analog Switch3V810UIM_DATADAT1DAT2DAT12UIM_CLKCLK1CLK2CLK14UIM_RESETRST1RST2RSTSELSECOND SIM CARDVPP (C6)VCC (C1)IO (C7)CLK (C3)RST (C2)GND (C5)J2C6C7C8C10C9D5D6D7D8Application ProcessorGPIOR1 TOBY-L2 and MPCI-L2 series - System Integration Manual 2.5.2 Guidelines for SIM layout design The layout of the SIM card interface lines (VSIM, SIM_CLK, SIM_IO, SIM_RST or UIM_PWR, UIM_DATA, UIM_CLK, UIM_RESET) may be critical if the SIM card is placed far away from the TOBY-L2 and MPCI-L2 series modules or in close proximity to the RF antenna: these two cases should be avoided or at least mitigated as described below. In the first case, the long connection can cause the radiation of some harmonics of the digital data frequency as any other digital interface. It is recommended to keep the traces short and avoid coupling with RF line or sensitive analog inputs. In the second case, the same harmonics can be picked up and create self-interference that can reduce the sensitivity of LTE/3G/2G receiver channels whose carrier frequency is coincidental with harmonic frequencies. It is strongly recommended to place the RF bypass capacitors suggested in Figure 44 near the SIM connector. In addition, since the SIM card is typically accessed by the end user, it can be subjected to ESD discharges. Add adequate ESD protection as suggested to protect module SIM pins near the SIM connector. Limit capacitance and series resistance on each SIM signal to match the SIM specifications. The connections should always be kept as short as possible. Avoid coupling with any sensitive analog circuit, since the SIM signals can cause the radiation of some harmonics of the digital data frequency. UBX-13004618 - R04 Advance Information Design-in Page 94 of 141 TOBY-L2 and MPCI-L2 series - System Integration Manual 2.6 Data communication interfaces 2.6.1 Universal Serial Bus (USB) 2.6.1.1 Guidelines for USB circuit design The USB_D+ and USB_D- lines carry the USB serial data and signaling. The lines are used in single ended mode for full speed signaling handshake, as well as in differential mode for high speed signaling and data transfer. USB pull-up or pull-down resistors and external series resistors on USB_D+ and USB_D- lines as required by the USB 2.0 specification [6] are part of the module USB pin driver and do not need to be externally provided. The additional VUSB_DET input pin can be optionally connected the USB VBUS supply (5.0 V typical) provided by the host, to allow the complete bus detach functionality for further reduction of the current consumption: the module disables the USB interface after a high-to-low logic level transition on the VUSB_DET input pin. Routing the USB pins to a connector, they will be externally accessible on the application device. According to EMC/ESD requirements of the application, an additional ESD protection device with very low capacitance should be provided close to accessible point on the line connected to this pin, as described in Figure 48 and Table 32. The USB interface pins ESD sensitivity rating is 1 kV (Human Body Model according to JESD22-A114F). Higher protection level could be required if the lines are externally accessible and it can be achieved by mounting a very low capacitance (i.e. less or equal to 1 pF) ESD protection (e.g. Tyco Electronics PESD0402-140 ESD protection device) on the lines connected to these pins, close to accessible points. The USB_D+ and USB_D- pins of the modules can be directly connected to the USB host application processor without additional ESD protections if they are not externally accessible or according to EMC/ESD requirements. Figure 48: USB Interface application circuits Reference Description Part Number - Manufacturer C1 100 nF Capacitor Ceramic X7R 0402 10% 16 V GRM155R61A104KA01 - Murata D1, D2, D3 Very Low Capacitance ESD Protection PESD0402-140 - Tyco Electronics Table 32: Component for USB application circuits UBX-13004618 - R04 Advance Information Design-in Page 95 of 141 D+D-GND28USB_D+27USB_D-GNDUSB DEVICE CONNECTORVBUSD+D-GND28USB_D+27USB_D-GNDUSB HOST PROCESSORD+D-GND38USB_D+36USB_D-GNDUSB DEVICE CONNECTORVBUSTOBY-L2 series TOBY-L2 series MPCI-L2 series MPCI-L2 series D+D-GND38USB_D+36USB_D-GNDUSB HOST PROCESSORVBUS4VUSB_DET4VUSB_DETD1D2C1D3D1D2C1 TOBY-L2 and MPCI-L2 series - System Integration Manual 2.6.1.2 Guidelines for USB layout design The USB_D+ / USB_D- lines require accurate layout design to achieve reliable signaling at the high speed data rate (up to 480 Mb/s) supported by the USB serial interface. The characteristic impedance of the USB_D+ / USB_D- lines is specified by the Universal Serial Bus Revision 2.0 specification [6]. The most important parameter is the differential characteristic impedance applicable for the odd-mode electromagnetic field, which should be as close as possible to 90 differential. Signal integrity may be degraded if PCB layout is not optimal, especially when the USB signaling lines are very long. Use the following general routing guidelines to minimize signal quality problems:

Route USB_D+ / USB_D- lines as a differential pair Route USB_D+ / USB_D- lines as short as possible Ensure the differential characteristic impedance (Z0) is as close as possible to 90 Ensure the common mode characteristic impedance (ZCM) is as close as possible to 30 Consider design rules for USB_D+ / USB_D- similar to RF transmission lines, being them coupled differential micro-strip or buried stripline: avoid any stubs, abrupt change of layout, and route on clear PCB area Figure 49 and Figure 50 provide two examples of coplanar waveguide designs with differential characteristic impedance close to 90 and common mode characteristic impedance close to 30 . The first transmission line can be implemented in case of 4-layer PCB stack-up herein described, the second transmission line can be implemented in case of 2-layer PCB stack-up herein described. Figure 49: Example of USB line design, with Z0 close to 90 and ZCM close to 30 , for the described 4-layer board layup Figure 50: Example of USB line design, with Z0 close to 90 and ZCM close to 30 , for the described 2-layer board layup UBX-13004618 - R04 Advance Information Design-in Page 96 of 141 35 m35 m35 m35 m270 m270 m760 mL1 CopperL3 CopperL2 CopperL4 CopperFR-4 dielectricFR-4 dielectricFR-4 dielectric350 m400 m400 m350 m400 m35 m35 m1510 mL2 CopperL1 CopperFR-4 dielectric740 m410 m410 m740 m410 m TOBY-L2 and MPCI-L2 series - System Integration Manual 2.6.2 Asynchronous serial interface (UART) The UART interface is not available on MPCI-L2 series modules. 2.6.2.1 Guidelines for UART circuit design The UART is not supported by TOBY-L2x0-00S: the pins should be not driven by any external device. Providing the full RS-232 functionality (using the complete V.24 link) If RS-232 compatible signal levels are needed, two different external voltage translators can be used to provide full RS-232 (9 lines) functionality: e.g. using the Texas Instruments SN74AVC8T245PW for the translation from 1.8 V to 3.3 V, and the Maxim MAX3237E for the translation from 3.3 V to RS-232 compatible signal level. If a 1.8 V host processor is used, for complete RS-232 functionality, the complete UART interface of the module

(DCE) must be connected to a 1.8 V application processor (DTE) as described in Figure 51. Figure 51: UART interface application circuit with complete V.24 link in DTE/DCE serial communication (1.8V DTE) If a 3.0 V Application Processor is used, appropriate unidirectional voltage translators must be provided using the module V_INT output as 1.8 V supply, as described in Figure 52. Figure 52: UART interface application circuit with complete V.24 link in DTE/DCE serial communication (3.0 V DTE) Reference Description Part Number - Manufacturer C1, C2, C3, C4 100 nF Capacitor Ceramic X7R 0402 10% 16 V GRM155R61A104KA01 - Murata U1, U2 Unidirectional Voltage Translator SN74AVC4T774 - Texas Instruments Table 33: Component for UART application circuit with complete V.24 link in DTE/DCE serial communication (3.0 V DTE) UBX-13004618 - R04 Advance Information Design-in Page 97 of 141 TxDApplication Processor(1.8V DTE)RxDRTSCTSDTRDSRRIDCDGNDTOBY-L2 series (1.8V DCE)16TXD13DTR17RXD14RTS15CTS10DSR11RI12DCDGND0TP0TP0TP0TP0TP0TP0TP0TP5V_INTTxDApplication Processor(3.0V DTE)RxDRTSCTSDTRDSRRIDCDGNDTOBY-L2 series (1.8V DCE)16TXD13DTR17RXD14RTS15CTS10DSR11RI12DCDGND1V8B1 A1GNDU1B3A3VCCBVCCAUnidirectionalVoltage TranslatorC1C23V0DIR3DIR2OEDIR1VCCB2 A2B4A4DIR41V8B1 A1GNDU2B3A3VCCBVCCAUnidirectionalVoltage TranslatorC3C43V0DIR1DIR3OEB2 A2B4A4DIR4DIR2TP0TP0TP0TP0TP0TP0TP0TP0TP TOBY-L2 and MPCI-L2 series - System Integration Manual Providing the TXD, RXD, RTS and CTS lines only (not using the complete V.24 link) If the functionality of the DSR, DCD, RI and DTR lines is not required in, or the lines are not available:

Connect the module DTR input line to GND using a 0 series resistor, since the module requires DTR active Leave DSR, DCD and RI lines of the module unconnected and floating If RS-232 compatible signal levels are needed, the Maxim 13234E voltage level translator can be used. This chip translates voltage levels from 1.8 V (module side) to the RS-232 standard. If a 1.8 V Application Processor is used, the circuit should be implemented as described in Figure 53. Figure 53: UART interface application circuit with partial V.24 link (5-wire) in the DTE/DCE serial communication (1.8V DTE) If a 3.0 V Application Processor is used, appropriate unidirectional voltage translators must be provided using the module V_INT output as 1.8 V supply, as described in Figure 54. Figure 54: UART interface application circuit with partial V.24 link (5-wire) in DTE/DCE serial communication (3.0 V DTE) Reference Description Part Number - Manufacturer C1, C2 U1 100 nF Capacitor Ceramic X7R 0402 10% 16 V GRM155R61A104KA01 - Murata Unidirectional Voltage Translator SN74AVC4T774 - Texas Instruments Table 34: Component for UART application circuit with partial V.24 link (5-wire) in DTE/DCE serial communication (3.0 V DTE) UBX-13004618 - R04 Advance Information Design-in Page 98 of 141 TxDApplication Processor(1.8V DTE)RxDRTSCTSDTRDSRRIDCDGNDTOBY-L2 series (1.8V DCE)16TXD13DTR17RXD14RTS15CTS10DSR11RI12DCDGND0TP0TP0TP0TP0TPTPTPTP5V_INTTxDApplication Processor(3.0V DTE)RxDRTSCTSDTRDSRRIDCDGNDTOBY-L2 series (1.8V DCE)16TXD13DTR17RXD14RTS15CTS10DSR11RI12DCDGND1V8B1 A1GNDU1B3A3VCCBVCCAUnidirectionalVoltage TranslatorC1C23V0DIR3DIR2OEDIR1VCCB2 A2B4A4DIR4TP0TP0TP0TP0TP0TPTPTPTP TOBY-L2 and MPCI-L2 series - System Integration Manual Providing the TXD and RXD lines only (not using the complete V24 link) If the functionality of the CTS, RTS, DSR, DCD, RI and DTR lines is not required in the application, or the lines are not available, the circuit with a 1.8 V Application Processor should be implemented as described in Figure 55:

Connect the module RTS input line to GND or to the CTS output line of the module: since the module requires RTS active (low electrical level) if HW flow-control is enabled (AT&K3, that is the default setting), the pin can be connected using a 0 series resistor to GND or to the active-module CTS (low electrical level) when the module is in active-mode, the UART interface is enabled and the HW flow-control is enabled Connect the module DTR input line to GND using a 0 series resistor, as the module requires DTR active Leave DSR, DCD and RI lines of the module unconnected and floating Figure 55: UART interface application circuit with partial V.24 link (3-wire) in the DTE/DCE serial communication (1.8V DTE) If a 3.0 V Application Processor is used, appropriate unidirectional voltage translators must be provided using the module V_INT output as 1.8 V supply, as described in Figure 56. Figure 56: UART interface application circuit with partial V.24 link (3-wire) in DTE/DCE serial communication (3.0 V DTE) Reference Description Part Number - Manufacturer C1, C2 U1 100 nF Capacitor Ceramic X7R 0402 10% 16 V GRM155R61A104KA01 - Murata Unidirectional Voltage Translator SN74AVC2T245 - Texas Instruments Table 35: Component for UART application circuit with partial V.24 link (3-wire) in DTE/DCE serial communication (3.0 V DTE) UBX-13004618 - R04 Advance Information Design-in Page 99 of 141 TxDApplication Processor(1.8V DTE)RxDRTSCTSDTRDSRRIDCDGNDTOBY-L2 series (1.8V DCE)16TXD13DTR17RXD14RTS15CTS10DSR11RI12DCDGND0TP0TP0TPTP0TPTPTPTP5V_INTTxDApplication Processor(3.0V DTE)RxDDTRDSRRIDCDGNDTOBY-L2 series (1.8V DCE)16TXD13DTR17RXD10DSR11RI12DCDGND1V8B1 A1GNDU1VCCBVCCAUnidirectionalVoltage TranslatorC1C23V0DIR1DIR2OEVCCB2 A2RTSCTS14RTS15CTSTP0TP0TP0TPTP0TPTPTPTP TOBY-L2 and MPCI-L2 series - System Integration Manual Additional considerations Do not apply voltage to any UART interface pin before the switch-on of the UART supply source (V_INT), to avoid latch-up of circuits and allow a proper boot of the module. If the external signals connected to the cellular module cannot be tri-stated or set low, insert a multi channel digital switch (e.g. TI SN74CB3Q16244, TS5A3159, or TS5A63157) between the two-circuit connections and set to high impedance before V_INT switch-on. ESD sensitivity rating of UART interface pins is 1 kV (Human Body Model according to JESD22-A114). Higher protection level could be required if the lines are externally accessible and it can be achieved by mounting an ESD protection (e.g. EPCOS CA05P4S14THSG varistor array) close to accessible points. If the UART interface pins are not used, they can be left unconnected on the application board, but it is recommended providing accessible test points directly connected to all the UART pins (TXD, RXD, RTS, CTS, DTR, DSR, DCD, RI) for diagnostic purpose, in particular providing a 0 series jumper on each line to detach each UART pin of the module from the DTE application processor. 2.6.2.2 Guidelines for UART layout design The UART serial interface requires the same consideration regarding electro-magnetic interference as any other digital interface. Keep the traces short and avoid coupling with RF line or sensitive analog inputs, since the signals can cause the radiation of some harmonics of the digital data frequency. UBX-13004618 - R04 Advance Information Design-in Page 100 of 141 TOBY-L2 and MPCI-L2 series - System Integration Manual 2.6.3 DDC (I2C) interface The I2C bus compatible Display Data Channel interface is not available on MPCI-L2 series modules. 2.6.3.1 Guidelines for DDC (I2C) circuit design I2C bus function is not supported by TOBY-L2x0-00S: the pins should be not driven by any external device. General considerations The DDC I2C-bus master interface can be used to communicate with u-blox GNSS receivers and other external I2C-bus slaves as an audio codec. Beside the general considerations reported below, see:

the following parts of this section for specific guidelines for the connection to u-blox GNSS receivers the section 2.7.1 for an application circuit example with an external audio codec I2C-bus slave To be compliant with the I2C bus specifications, the module bus interface pads are open drain output and pull up resistors must be mounted externally. Resistor values must conform to I2C bus specifications [12]: for example, 4.7 k resistors can be commonly used. Pull-ups must be connected to a supply voltage of 1.8 V (typical), since this is the voltage domain of the DDC pins which are not tolerant to higher voltage values (e.g. 3.0 V). Connect the DDC (I2C) pull-ups to the V_INT 1.8 V supply source, or another 1.8 V supply source enabled after V_INT (e.g., as the GNSS 1.8 V supply present in Figure 57 application circuit), as any external signal connected to the DDC (I2C) interface must not be set high before the switch-on of the V_INT supply of DDC pins, to avoid latch-up of circuits and let a proper boot of the module. The signal shape is defined by the values of the pull-up resistors and the bus capacitance. Long wires on the bus will increase the capacitance. If the bus capacitance is increased, use pull-up resistors with nominal resistance value lower than 4.7 k, to match the I2C bus specifications [12] regarding rise and fall times of the signals. Capacitance and series resistance must be limited on the bus to match the I2C specifications (1.0 s is the maximum allowed rise time on the SCL and SDA lines): route connections as short as possible. If the pins are not used as DDC bus interface, they can be left unconnected. ESD sensitivity rating of the DDC (I2C) pins is 1 kV (Human Body Model according to JESD22-A114). Higher protection level could be required if the lines are externally accessible and it can be achieved by mounting an ESD protection (e.g. EPCOS CA05P4S14THSG varistor array) close to accessible points. UBX-13004618 - R04 Advance Information Design-in Page 101 of 141 TOBY-L2 and MPCI-L2 series - System Integration Manual Connection with u-blox 1.8 V GNSS receivers Figure 57 shows an application circuit for connecting TOBY-L2 cellular modules to a u-blox 1.8 V GNSS receiver. SDA / SCL pins of the TOBY-L2 cellular module are directly connected to the relative I2C pins of the u-blox 1.8 V GNSS receiver, with appropriate pull-up resistors connected to the 1.8 V GNSS supply enabled after the V_INT supply of the I2C pins of the TOBY-L2 cellular module. GPIO3 and GPIO4 pins are directly connected respectively to the TxD1 and EXTINT0 pins of the u-blox 1.8 V GNSS receiver to provide GNSS data ready and GNSS RTC sharing functions. A pull-down resistor is mounted on GPIO2 line to avoid an improper switch on of the u-blox GNSS receiver. The V_BCKP output of the cellular module is connected to the V_BCKP input pin of the GNSS receiver to provide the supply for the GNSS RTC and backup RAM when the VCC supply of the cellular module is within its operating range and the VCC supply of the GNSS receiver is disabled. This enables the u-blox GNSS receiver to recover from a power breakdown with either a hot start or a warm start (depending on the duration of the GNSS VCC outage) and to maintain the configuration settings saved in the backup RAM. Figure 57: Application circuit for connecting TOBY-L2 modules to u-blox 1.8 V GNSS receivers Reference Description R1, R2 R3 U1 4.7 k Resistor 0402 5% 0.1 W 47 k Resistor 0402 5% 0.1 W Part Number - Manufacturer RC0402JR-074K7L - Yageo Phycomp RC0402JR-0747KL - Yageo Phycomp Voltage Regulator for GNSS receiver See GNSS receiver Hardware Integration Manual Table 36: Components for connecting TOBY-L2 modules to u-blox 1.8 V GNSS receivers Figure 58 illustrates an alternative application circuit solution in which the TOBY-L2 supplies a u-blox 1.8 V GNSS receiver. The V_INT 1.8 V regulated supply output of a TOBY-L2 module can be used as supply source for a u-blox 1.8 V GNSS receiver (u-blox 6 generation receiver or newer) instead of using an external voltage regulator, as shown in Figure 57. The V_INT supply is able to support the maximum current consumption of these positioning receivers. The internal switching step-down regulator that generates the V_INT supply is set to 1.8 V (typical) when the cellular module is switched on and it is disabled when the module is switched off. The supply of the u-blox 1.8 V GNSS receiver can be switched off using an external p-channel MOS controlled by the GPIO2 pin of TOBY-L2 cellular modules by means of a proper inverting transistor as shown in Figure 58, implementing the GNSS supply enable function. If this feature is not required, the V_INT supply output can be directly connected to the u-blox 1.8 V GNSS receiver, so that it will switch on when V_INT output is enabled. UBX-13004618 - R04 Advance Information Design-in Page 102 of 141 TOBY-L2 series (except TOBY-L2x0-00S)R1INOUTGNDGNSS LDORegulatorSHDNu-bloxGNSS1.8 V receiverSDA2SCL2R21V81V8VMAIN1V8U122GPIO2SDASCLC1TxD1EXTINT0GPIO3GPIO455542425VCCR3V_BCKPV_BCKP3GNSS data readyGNSS RTC sharingGNSS supply enabled TOBY-L2 and MPCI-L2 series - System Integration Manual According to the V_INT supply output voltage ripple characteristic specified in the TOBY-L2 Data Sheet [1]:

Additional filtering may be needed to properly supply an external LNA, depending on the characteristics of the used LNA, adding a series ferrite bead and a bypass capacitor (e.g. the Murata BLM15HD182SN1 ferrite bead and the Murata GRM1555C1H220J 22 pF capacitor) at the input of the external LNA supply line Figure 58: Application circuit for connecting TOBY-L2 modules to u-blox 1.8 V GNSS receivers using V_INT as supply Reference Description Part Number - Manufacturer R1, R2 4.7 k Resistor 0402 5% 0.1 W 47 k Resistor 0402 5% 0.1 W 10 k Resistor 0402 5% 0.1 W 100 k Resistor 0402 5% 0.1 W RC0402JR-074K7L - Yageo Phycomp RC0402JR-0747KL - Yageo Phycomp RC0402JR-0710KL - Yageo Phycomp RC0402JR-07100KL - Yageo Phycomp P-Channel MOSFET Low On-Resistance IRLML6401 - International Rectifier or NTZS3151P - ON Semi NPN BJT Transistor BC847 - Infineon 100 nF Capacitor Ceramic X7R 0402 10% 16 V GRM155R71C104KA01 - Murata R3 R4 R5 T1 T2 C1 Table 37: Components for connecting TOBY-L2 modules to u-blox 1.8 V GNSS receivers using V_INT as supply For additional guidelines regarding the design of applications with u-blox 1.8 V GNSS receivers see the GNSS Implementation Application Note [13] and the Hardware Integration Manual of the u-blox GNSS receivers. UBX-13004618 - R04 Advance Information Design-in Page 103 of 141 u-blox GNSS1.8 V receiverTxD1EXTINT0V_BCKPV_BCKP3SDA2SCL2VCC1V8C1R35V_INTR5R4TPT2T1R1R21V81V8GNSS data readyGNSS RTC sharingGNSS supply enabledTOBY-L2 series (except TOBY-L2x0-00S)22GPIO2SDASCLGPIO3GPIO455542425 TOBY-L2 and MPCI-L2 series - System Integration Manual Connection with u-blox 3.0 V GNSS receivers Figure 59 shows an application circuit for connecting TOBY-L2 cellular modules to a u-blox 3.0 V GNSS receiver:

As the SDA and SCL pins of the TOBY-L2 cellular module are not tolerant up to 3.0 V, the connection to the related I2C pins of the u-blox 3.0 V GNSS receiver must be provided using a proper I2C-bus Bidirectional Voltage Translator with proper pull-up resistors (e.g. the TI TCA9406 additionally provides the partial power down feature so that the GNSS 3.0 V supply can be ramped up before the V_INT 1.8 V cellular supply). As the GPIO3 and GPIO4 pins of the TOBY-L2 cellular module are not tolerant up to 3.0 V, the connection to the related pins of the u-blox 3.0 V GNSS receiver must be provided using a proper Unidirectional General Purpose Voltage Translator (e.g. TI SN74AVC2T245, which additionally provides the partial power down feature so that the 3.0 V GNSS supply can be also ramped up before the V_INT 1.8 V cellular supply). A pull-down resistor is mounted on GPIO2 line to avoid an improper switch on of the u-blox GNSS receiver. The V_BCKP supply output of the cellular module can be directly connected to the V_BCKP backup supply input pin of the GNSS receiver as in the application circuit for a u-blox 1.8 V GNSS receiver. Figure 59: Application circuit for connecting TOBY-L2 modules to u-blox 3.0 V GNSS receivers Reference Description R1, R2, R4, R5 4.7 k Resistor 0402 5% 0.1 W R3 47 k Resistor 0402 5% 0.1 W Part Number - Manufacturer RC0402JR-074K7L - Yageo Phycomp RC0402JR-0747KL - Yageo Phycomp C2, C3, C4, C5 100 nF Capacitor Ceramic X5R 0402 10% 10V GRM155R71C104KA01 - Murata U1, C1 U2 U3 Voltage Regulator for GNSS receiver and capacitor related output bypass See GNSS receiver Hardware Integration Manual I2C-bus Bidirectional Voltage Translator TCA9406DCUR - Texas Instruments Generic Unidirectional Voltage Translator SN74AVC2T245 - Texas Instruments Table 38: Components for connecting TOBY-L2 modules to u-blox 3.0 V GNSS receivers For additional guidelines regarding the design of applications with u-blox 3.0 V GNSS receivers see the GNSS Implementation Application Note [13] and the Hardware Integration Manual of the u-blox GNSS receivers. UBX-13004618 - R04 Advance Information Design-in Page 104 of 141 TOBY-L2 series (except TOBY-L2x0-00S)u-blox GNSS 3.0 V receiver24GPIO325GPIO41V8B1 A1GNDU3B2A2VCCBVCCAUnidirectionalVoltage TranslatorC4C53V0TxD1EXTINT0R1INOUTGNDGNSS LDORegulatorSHDNR2VMAIN3V0U122GPIO255SDA54SCLR4R51V8SDA_A SDA_BGNDU2SCL_ASCL_BVCCAVCCBI2C-bus Bidirectional Voltage Translator2V_INTC1C2C3R3SDA2SCL2VCCDIR1DIR23V_BCKPV_BCKPOEOEGNSS data readyGNSS RTC sharingGNSS supply enabled TOBY-L2 and MPCI-L2 series - System Integration Manual 2.6.3.2 Guidelines for DDC (I2C) layout design The DDC (I2C) serial interface requires the same consideration regarding electro-magnetic interference as any other digital interface. Keep the traces short and avoid coupling with RF line or sensitive analog inputs, since the signals can cause the radiation of some harmonics of the digital data frequency. 2.6.4 Secure Digital Input Output interface (SDIO) The SDIO Secure Digital Input Output interface is not available on MPCI-L2 series modules. 2.6.4.1 Guidelines for SDIO circuit design The functionality of the SDIO_D0, SDIO_D1, SDIO_D2, SDIO_D3, SDIO_CLK, SDIO_CMD pins is not supported by TOBY-L2x0-00S: the pins should be not driven improperly by any external device. TOBY-L2 series modules include a 4-bit Secure Digital Input Output interface (SDIO_D0, SDIO_D1, SDIO_D2, SDIO_D3, SDIO_CLK, SDIO_CMD) available to communicate with an external Wi-Fi chip. Guidelines for SDIO circuit design will be described in detail in a successive release of the document. Do not apply voltage to any SDIO interface pin before the switch-on of SDIO interface supply source

(V_INT), to avoid latch-up of circuits and allow a proper boot of the module. If the external signals connected to the cellular module cannot be tri-stated or set low, insert a multi channel digital switch (e.g. TI SN74CB3Q16244, TS5A3159, or TS5A63157) between the two-circuit connections and set to high impedance before V_INT switch-on. ESD sensitivity rating of SDIO interface pins is 1 kV (Human Body Model according to JESD22-A114). Higher protection level could be required if the lines are externally accessible and it can be achieved by mounting a very low capacitance ESD protection (e.g. Tyco Electronics PESD0402-140 ESD), close to accessible points. If the SDIO interface pins are not used, they can be left unconnected on the application board. 2.6.4.2 Guidelines for SDIO layout design The SDIO serial interface requires the same consideration regarding electro-magnetic interference as any other high speed digital interface. Keep the traces short and avoid coupling with RF lines / parts or sensitive analog inputs, since the signals can cause the radiation of some harmonics of the digital data frequency. Consider the usage of low value series damping resistors to avoid reflections and other losses in signal integrity, which may create ringing and loss of a square wave shape. However, the resistor value should not be so high that the rise / fall time requirements are violated: for example, 22 or 33 resistor may be sufficient to slow the signal and remove the ringing problem. UBX-13004618 - R04 Advance Information Design-in Page 105 of 141 TOBY-L2 and MPCI-L2 series - System Integration Manual 2.7 Audio interface 2.7.1 Digital audio interface The I2S interface is not available on MPCI-L2 series modules. 2.7.1.1 Guidelines for digital audio circuit design The I2S interface is not supported by TOBY-L2x0-00S: the pins should be not driven by any external device. I2S digital audio interface can be connected to an external digital audio device for voice applications. The external digital audio device must be properly configured according to the cellular module configuration, with the opposite role, the same mode, the same sample rate and voltage level. Any external digital audio device compliant with the configuration of the digital audio interface of the TOBY-L2 cellular module can be used. Examples of compatible audio codec parts, suitable to provide analog audio voice capability on the application device, are the following:

Marvell 88PM805 Maxim MAX9860 Maxim MAX9867 Maxim MAX9880A An appropriate specific application circuit has to be implemented and configured according to the particular external digital audio device or audio codec used and according to the application requirements. Figure 60 and Table 39 describe an application circuit for the I2S digital audio interface providing voice capability using an external audio voice codec. DAC and ADC integrated in the external audio codec respectively converts an incoming digital data stream to analog audio output through a mono amplifier and converts the microphone input signal to the digital bit stream over the digital audio interface. The modules I2S interface (I2S master) is connected to the related pins of the external audio codec (I2S slave). The GPIO6 of the TOBY-L2 series module (that provides a suitable digital output clock) is connected to the clock input of the external audio codec to provide clock reference. The external audio codec is controlled by the wireless module using the DDC (I2C) interface: this interface can be concurrently used to communicate with u-blox GNSS receivers and to control an external audio codec. The V_INT output supplies the external audio codec, defining proper digital interfaces voltage level. Additional components are provided for EMC and ESD immunity conformity: a 10 nF bypass capacitor and a series chip ferrite bead noise/EMI suppression filter provided on each microphone line input and speaker line output of the external codec as described in Figure 60 and Table 39. The necessity of these or other additional parts for EMC improvement may depend on the specific application board design. As various external audio codecs other than the one described in Figure 60 / Table 39 can be used to provide voice capability, the appropriate specific application circuit has to be implemented and configured according to the particular external digital audio device or audio codec used and according to the application requirements. UBX-13004618 - R04 Advance Information Design-in Page 106 of 141 TOBY-L2 and MPCI-L2 series - System Integration Manual Figure 60: I2S interface application circuit with an external audio codec to provide voice capability Reference Description Part Number Manufacturer C1 100 nF Capacitor Ceramic X5R 0402 10% 10V GRM155R71C104KA01 Murata C2, C4, C5, C6 1 F Capacitor Ceramic X5R 0402 10% 6.3 V GRM155R60J105KE19 Murata C3 10 F Capacitor Ceramic X5R 0603 20% 6.3 V GRM188R60J106ME47 Murata C7, C8, C9, C10 27 pF Capacitor Ceramic COG 0402 5% 25 V GRM1555C1H270JZ01 Murata C11, C12, C13, C14 10 nF Capacitor Ceramic X5R 0402 10% 50V GRM155R71C103KA88 Murata D1, D2 Low Capacitance ESD Protection USB0002RP or USB0002DP AVX EMI1, EMI2, EMI3, EMI4 Chip Ferrite Bead Noise/EMI Suppression Filter 1800 Ohm at 100 MHz, 2700 Ohm at 1 GHz BLM15HD182SN1 Murata J1 J2 MIC R1, R2 R3 R4, R5 SPK U1 Microphone Connector Speaker Connector 2.2 k Electret Microphone 4.7 k Resistor 0402 5% 0.1 W 10 k Resistor 0402 5% 0.1 W 2.2 k Resistor 0402 5% 0.1 W 32 Speaker 16-Bit Mono Audio Voice Codec Various manufacturers Various manufacturers Various manufacturers RC0402JR-074K7L - Yageo Phycomp RC0402JR-0710KL - Yageo Phycomp RC0402JR-072K2L Yageo Phycomp Various manufacturers MAX9860ETG+ - Maxim Table 39: Example of components for audio voice codec application circuit Do not apply voltage to any I2S pin before the switch-on of I2S supply source (V_INT), to avoid latch-up of circuits and allow a proper boot of the module. If the external signals connected to the cellular module cannot be tri-stated or set low, insert a multi channel digital switch (e.g. TI SN74CB3Q16244, TS5A3159, or TS5A63157) between the two-circuit connections and set to high impedance before V_INT switch-on. ESD sensitivity rating of I2S interface pins is 1 kV (Human Body Model according to JESD22-A114). Higher protection level could be required if the lines are externally accessible and it can be achieved by mounting a general purpose ESD protection (e.g. EPCOS CA05P4S14THSG varistor array) close to accessible points. If the I2S digital audio pins are not used, they can be left unconnected on the application board. 2.7.1.2 Guidelines for digital audio layout design I2S interface and clock output lines require the same consideration regarding electro-magnetic interference as any other high speed digital interface. Keep the traces short and avoid coupling with RF lines / parts or sensitive analog inputs, since the signals can cause the radiation of some harmonics of the digital data frequency. UBX-13004618 - R04 Advance Information Design-in Page 107 of 141 R2R1BCLKGNDU1LRCLKTOBY-L2 series (except TOBY-L2x0-00S)Audio CodecSDINSDOUT55SDA54SCLSDASCL61GPIO6MCLKGNDIRQnR3C3C2C15V_INTVDD1V8MICBIASC4R4C5C6EMI1MICLNMICLPD1Microphone ConnectorEMI2MICC12C11J1MICGNDR5C8C7D2SPKSpeaker ConnectorOUTPOUTNJ2C10C9C14C13EMI3EMI452I2S_CLK50I2S_WA51I2S_TXD53I2S_RXD TOBY-L2 and MPCI-L2 series - System Integration Manual 2.8 General Purpose Input/Output GPIOs are not supported by the TOBY-L2x0-00S product version except for the Wireless Wide Area Network status indication configured on the GPIO1 pin: the pins should be not driven by any external device. GPIOs are not available on MPCI-L2 series modules. 2.8.1.1 Guidelines for TOBY-L2 series GPIO circuit design A typical usage of TOBY-L2 modules GPIOs can be the following:

Network indication provided over GPIO1 pin (see Figure 61 / Table 40 below) GNSS supply enable provided over GPIO2 (see Figure 57 / Table 36 or Figure 59 / Table 38 in section 2.6.3) GNSS data ready provided over GPIO3 (see Figure 57 / Table 36 or Figure 59 / Table 38 in section 2.6.3) GNSS RTC sharing provided over GPIO4 (see Figure 57 / Table 36 or Figure 59 / Table 38 in section 2.6.3) SIM card detection provided over GPIO5 (see Figure 46 / Table 30 or Figure 47 / Table 31 in section 2.5) Clock output provided over GPIO6 (see Figure 60 / Table 39 in section 2.7.1) Figure 61: Application circuit for network indication provided over GPIO1 Reference Description Part Number - Manufacturer R1 R2 R3 DL1 T1 10 k Resistor 0402 5% 0.1 W 47 k Resistor 0402 5% 0.1 W 820 Resistor 0402 5% 0.1 W LED Red SMT 0603 NPN BJT Transistor Various manufacturers Various manufacturers Various manufacturers LTST-C190KRKT - Lite-on Technology Corporation BC847 - Infineon Table 40: Components for network indication application circuit Use transistors with at least an integrated resistor in the base pin or otherwise put a 10 k resistor on the board in series to the GPIO of TOBY-L2 modules. Do not apply voltage to any GPIO of TOBY-L2 before the switch-on of the GPIOs supply (V_INT), to avoid latch-up of circuits and allow a proper module boot. If the external signals connected to the module cannot be tri-stated or set low, insert a multi channel digital switch (e.g. TI SN74CB3Q16244, TS5A3159, TS5A63157) between the two-circuit connections and set to high impedance before V_INT switch-on. ESD sensitivity rating of the GPIO pins is 1 kV (Human Body Model according to JESD22-A114). Higher protection level could be required if the lines are externally accessible and it can be achieved by mounting an ESD protection (e.g. EPCOS CA05P4S14THSG varistor array) close to accessible points. If the GPIO pins are not used, they can be left unconnected on the application board. 2.8.1.2 Guidelines for general purpose input/output layout design The general purpose inputs / outputs pins are generally not critical for layout. UBX-13004618 - R04 Advance Information Design-in Page 108 of 141 TOBY-L2 seriesGPIO1R1R33V8Network IndicatorR221DL1T1 TOBY-L2 and MPCI-L2 series - System Integration Manual 2.9 Mini PCIe specific signals (W_DISABLE#, LED_WWAN#) Mini PCI Express specific signals (W_DISABLE#, LED_WWAN#) are not available on TOBY-L2 series. 2.9.1.1 Guidelines for W_DISABLE# circuit design As described in Figure 62, the MPCI-L2 series modules W_DISABLE# wireless disable input is equipped with an internal pull-up to the 3.3Vaux supply: an external pull-up resistor is not required and should not be provided. If connecting the W_DISABLE# input to a push button, the pin will be externally accessible on the application device. According to EMC/ESD requirements of the application, an additional ESD protection device should be provided close to accessible point, as described in Figure 62 and Table 41. ESD sensitivity rating of the W_DISABLE# pin is 1 kV (HBM according to JESD22-A114). Higher protection level can be required if the line is externally accessible on the application board, e.g. if an accessible push button is directly connected to the W_DISABLE# pin, and it can be achieved by mounting an ESD protection (e.g. EPCOS CA05P4S14THSG varistor) close to accessible point. An open drain output is suitable to drive the W_DISABLE# input from an application processor as it is equipped with an internal pull-up to the 3.3Vaux supply as described in Figure 62. A compatible push-pull output of an application processor can also be used. In any case, take care to set the proper level in all the possible scenarios to avoid an inappropriate disabling of the radio operations. Figure 62: W_DISABLE# application circuit using a push button and an open drain output of an application processor Reference Description Remarks ESD Varistor for ESD protection CT0402S14AHSG - EPCOS Table 41: Example of ESD protection component for the W_DISABLE# application circuit If the W_DISABLE# functionality is not required by the application, the pin can be left unconnected. UBX-13004618 - R04 Advance Information Design-in Page 109 of 141 MPCI-L2 series3.3Vaux20W_DISABLE#Power-on push buttonESDOpen Drain OutputApplication ProcessorMPCI-L2 series3.3Vaux20W_DISABLE#TPTP22 k22 k TOBY-L2 and MPCI-L2 series - System Integration Manual 2.9.1.2 Guidelines for LED_WWAN# circuit design As described in Figure 63 and Table 42, the MPCI-L2 series modules LED_WWAN# active-low open drain output can be directly connected to a system-mounted LED to provide the Wireless Wide Area Network status indication as specified by the PCI Express Mini Card Electromechanical Specification [14]. Figure 63: LED_WWAN# application circuit Reference Description Remarks DL R LED Green SMT 0603 LTST-C190KGKT - Lite-on Technology Corporation 470 Resistor 0402 5% 0.1 W Various manufacturers Table 42: Example of components for the LED_WWAN# application circuit ESD sensitivity rating of the LED_WWAN# pin is 1 kV (Human Body Model according to JESD22-A114). Higher protection level could be required if the line is externally accessible and it can be achieved by mounting an ESD protection (e.g. EPCOS CA05P4S14THSG varistor) close to accessible point. If the LED_WWAN# functionality is not required by the application, the pin can be left unconnected. 2.9.1.3 Guidelines for W_DISABLE# and LED_WWAN# layout design The W_DISABLE# and LED_WWAN# circuits are generally not critical for layout. 2.10 Reserved pins (RSVD) Pins reserved for future use, marked as RSVD, are not available on MPCI-L2 series. TOBY-L2 series modules have pins reserved for future use. All the RSVD pins are to be left unconnected on the application board except the RSVD pin number 6 which must be connected to ground as described in Figure 64. Figure 64: Application circuit for the reserved pins (RSVD) UBX-13004618 - R04 Advance Information Design-in Page 110 of 141 Open Drain OutputR3V3DL42LED_WWAN#MPCI-L2 seriesTOBY-L2 seriesRSVD6RSVD TOBY-L2 and MPCI-L2 series - System Integration Manual 2.11 Module placement An optimized placement allows a minimum RF lines length and closer path from DC source for VCC / 3.3Vaux. Make sure that the module, analog parts and RF circuits are clearly separated from any possible source of radiated energy. In particular, digital circuits can radiate digital frequency harmonics, which can produce Electro-

Magnetic Interference that affects the module, analog parts and RF circuits performance. Implement proper countermeasures to avoid any possible Electro-Magnetic Compatibility issue. Make sure that the module, RF and analog parts / circuits, and high speed digital circuits are clearly separated from any sensitive part / circuit which may be affected by Electro-Magnetic Interference, or employ countermeasures to avoid any possible Electro-Magnetic Compatibility issue. Provide enough clearance between the module and any external part. The heat dissipation during continuous transmission at maximum power can significantly raise the temperature of the application base-board below the TOBY-L2 and MPCI-L2 series modules: avoid placing temperature sensitive devices close to the module. UBX-13004618 - R04 Advance Information Design-in Page 111 of 141 TOBY-L2 and MPCI-L2 series - System Integration Manual 2.12 TOBY-L2 series module footprint and paste mask Figure 65 and Table 43 describe the suggested footprint (i.e. copper mask) layout for TOBY-L2 series modules. The proposed land pattern layout slightly reflects the modules pads layout, with most of the lateral pads designed wider on the application board (1.8 x 0.8 mm) than on the module (1.5 x 0.8 mm). Figure 65: TOBY-L2 series module suggest footprint (application board top view) Parameter A B D E F1 F2 G Value 35.6 mm 24.8 mm 2.40 mm 2.25 mm 1.45 mm 1.30 mm 1.10 mm Parameter H I1 I2 J K L M1 Value 0.80 mm 1.50 mm 1.80 mm 0.30 mm 3.15 mm 7.15 mm 1.80 mm Parameter M2 M3 N O P1 P2 P3 Value 5.20 mm 4.50 mm 2.10 mm 1.10 mm 1.10 mm 1.25 mm 2.85 mm Table 43: TOBY-L2 series module suggest footprint dimensions The Non Solder Mask Defined (NSMD) pad type is recommended over the Solder Mask Defined (SMD) pad type, implementing the solder mask opening 50 m larger per side than the corresponding copper pad. The suggested paste mask layout for TOBY-L2 series modules slightly reflects the copper mask layout described in Figure 65 and Table 43, as different stencil apertures layout for any specific pad is recommended:

Blue marked pads: Paste layout reduced circumferentially about 0.025 mm to Copper layout Green marked pads: Paste layout enlarged circumferentially about 0.025 mm to Copper layout Purple marked pads: Paste layout one to one to Copper layout The recommended solder paste thickness is 150 m, according to application production process requirements. These are recommendations only and not specifications. The exact mask geometries, distances and stencil thicknesses must be adapted to the specific production processes (e.g. soldering etc.) of the customer. UBX-13004618 - R04 Advance Information Design-in Page 112 of 141 I1AGHJ1DF2KM1M1M2P2BGHJOOLNM1M1M3I1I1OHJJJEP3F1P1HI1OI2I2F2Module placement outline TOBY-L2 and MPCI-L2 series - System Integration Manual 2.13 MPCI-L2 series module installation MPCI-L2 series modules are fully compliant with the 52-pin PCI Express Full-Mini Card Type F2 form factor, i.e., top-side and bottom-side keep-out areas, 50.95 mm nominal length, 30 mm nominal width, and all the other dimensions as defined by the PCI Express Mini Card Electromechanical Specification [14], except for the card thickness (which nominal value is 3.7 mm), as described in Figure 66. Figure 66: MPCI-L2 series mechanical description (top, side and bottom views) MPCI-L2 series modules are fully compliant with the 52-pin PCI Express Full-Mini card edge type system connector as defined by the PCI Express Mini Card Electromechanical Specification [14]. Table 44 describes some examples of 52-pin mating system connectors for the MPCI-L2 series PCI Express Full-Mini card modules. Manufacturer JAE Electronics Molex TE Connectivity / AMP FCI Part Number MM60 series 67910 series 2041119 series 10123824 series Description 52-circuit, 0.8 mm pitch, PCI Express Mini card edge female connector 52-circuit, 0.8 mm pitch, PCI Express Mini card edge female connector 52-circuit, 0.8 mm pitch, PCI Express Mini card edge female connector 52-circuit, 0.8 mm pitch, PCI Express Mini card edge female connector Table 44: MPCI-L2 series PCI Express Full-Mini card compatible connector It is recommended to use the two mounting holes described in Figure 66 to fix (ground) the MPCI-L2 module to the main ground of the application board with suitable screws and fasteners. Follow the recommendations provided by the connector manufacturer and the guidelines available in the PCI Express Mini Card Electromechanical Specification [14] for the development of the footprint (i.e. the copper mask) PCB layout for the mating edge system connector. The exact geometries, distances and stencil thicknesses should be adapted to the specific production processes (e.g. soldering etc.). Follow the recommendations provided by the connector manufacturer to properly insert and remove the MPCI-L2 series modules. UBX-13004618 - R04 Advance Information Design-in Page 113 of 141 3.7 mmSide ViewPin 1Pin 51ANT1ANT2Top ViewHoleGNDHoleGND30 mmPin 52Pin 2Bottom ViewHoleGNDHoleGND50.95 mm TOBY-L2 and MPCI-L2 series - System Integration Manual MPCI-L2 series modules are equipped with two Hirose U.FL-R-SMT RF receptacles for ANT1 / ANT2 ports, which require a suitable mated RF plug from the same connector series as the examples listed in Table 23. To mate the connectors, the mating axes of both connectors must be aligned. The "click" will confirm the fully mated connection. Do not attempt to insert on an extreme angle: insert the RF plug connectors vertically into the ANT1 / ANT2 RF receptacles of the modules, as described in Figure 67. Figure 67: Precautions during RF connector mating To unplug the RF cable assembly it is encouraged to use a suitable extraction tool for the RF connector, such as the Hirose U.FL-LP-N or the Hirose U.FL-LP(V)-N extraction jig, according to the RF cable assembly type used. Hook the end portion of the extraction jig onto the connector cover and pull off vertically in the direction of the connector mating axis, as described in Figure 68. Figure 68: Precautions during RF connector extraction Any attempt to unplug the RF connectors by pulling on the cable assembly without using a suitable extraction tool may result in damage and affect the RF performance. Do not forcefully twist, deform, or apply any excessive pull force to the RF cables or damage the RF connectors, otherwise the RF performance may be reduced. UBX-13004618 - R04 Advance Information Design-in Page 114 of 141 CorrectWrongExtraction JigRF Cable AssemblyU.FL Receptacle TOBY-L2 and MPCI-L2 series - System Integration Manual 2.14 Thermal guidelines Modules operating temperature range is specified in TOBY-L2 Data Sheet [1] and MPCI-L2 Data Sheet [2]. The most critical condition concerning module thermal performance is the uplink transmission at maximum power (data upload in connected-mode), when the baseband processor runs at full speed, radio circuits are all active and the RF power amplifier is driven to higher output RF power. This scenario is not often encountered in real networks; however the application should be correctly designed to cope with it. During transmission at maximum RF power the TOBY-L2 and MPCI-L2 series modules generate thermal power that can exceed 3 W: this is an indicative value since the exact generated power strictly depends on operating condition such as the number of allocated TX resource blocks, transmitting frequency band, etc. The generated thermal power must be adequately dissipated through the thermal and mechanical design of the application. The spreading of the Module-to-Ambient thermal resistance (Rth,M-A) depends on the module operating condition. The overall temperature distribution is influenced by the configuration of the active components during the specific mode of operation and their different thermal resistance toward the case interface. The Module-to-Ambient thermal resistance value and the relative increase of module temperature will differ according to the specific mechanical deployments of the module, e.g. application PCB with different dimensions and characteristics, mechanical shells enclosure, or forced air flow. The increase of the thermal dissipation, i.e. the reduction of the Module-to-Ambient thermal resistance, will decrease the temperature of the modules internal circuitry for a given operating ambient temperature. This improves the device long-term reliability in particular for applications operating at high ambient temperature. A few hardware techniques may be used to reduce the Module-to-Ambient thermal resistance in the application:

Connect each GND pin with solid ground layer of the application board and connect each ground area of the multilayer application board with complete thermal via stacked down to main ground layer. Use the two mounting holes described in Figure 66 to fix (ground) the MPCI-L2 modules to the main ground of the application board with suitable screws and fasteners. Provide a ground plane as wide as possible on the application board. Optimize antenna return loss, to optimize overall electrical performance of the module including a decrease of module thermal power. Optimize the thermal design of any high-power components included in the application, such as linear regulators and amplifiers, to optimize overall temperature distribution in the application device. Select the material, the thickness and the surface of the box (i.e. the mechanical enclosure) of the application device that integrates the module so that it provides good thermal dissipation. Force ventilation air-flow within mechanical enclosure. Provide a heat sink component attached to the module top side, with electrically insulated / high thermal conductivity adhesive, or on the backside of the application board, below the cellular module. Follow the thermal guidelines for integrating wireless wide area network mini card add-in cards, such as the MPCI-L2 series modules, as provided in the PCI Express Mini Card Electromechanical Specification [14]

For example, the Module-to-Ambient thermal resistance (Rth,M-A) is strongly reduced with forced air ventilation and a heat-sink installed on the back of the application board, decreasing the module temperature variation. Beside the reduction of the Module-to-Ambient thermal resistance implemented by proper application hardware design, the increase of module temperature can be moderated by proper application software implementation:

Enable module connected-mode for a given time period and then disable it for a time period enough long to properly mitigate temperature increase. UBX-13004618 - R04 Advance Information Design-in Page 115 of 141 TOBY-L2 and MPCI-L2 series - System Integration Manual 2.15 ESD guidelines The sections 2.15.1 and 2.15.2 are related to EMC / ESD immunity. The modules are ESD sensitive devices. The ESD sensitivity for each pin (as Human Body Model according to JESD22-A114F) is specified in TOBY-L2 series Data Sheet [1] or MPCI-L2 series Data Sheet [2]. Special precautions are required when handling the pins; for ESD handling guidelines see section 3.2. 2.15.1 ESD immunity test overview The immunity of devices integrating TOBY-L2 and MPCI-L2 series modules to Electro-Static Discharge (ESD) is part of the Electro-Magnetic Compatibility (EMC) conformity which is required for products bearing the CE marking, compliant with the R&TTE Directive (99/5/EC), the EMC Directive (89/336/EEC) and the Low Voltage Directive (73/23/EEC) issued by the Commission of the European Community. Compliance with these directives implies conformity to the following European Norms for device ESD immunity:

ESD testing standard CENELEC EN 61000-4-2 [20] and the radio equipment standards ETSI EN 301 489-1 [21], ETSI EN 301 489-7 [22], ETSI EN 301 489-24 [23], which requirements are summarized in Table 45. The ESD immunity test is performed at the enclosure port, defined by ETSI EN 301 489-1 [21] as the physical boundary through which the electromagnetic field radiates. If the device implements an integral antenna, the enclosure port is seen as all insulating and conductive surfaces housing the device. If the device implements a removable antenna, the antenna port can be separated from the enclosure port. The antenna port includes the antenna element and its interconnecting cable surfaces. The applicability of ESD immunity test to the whole device depends on the device classification as defined by ETSI EN 301 489-1 [21]. Applicability of ESD immunity test to the relative device ports or the relative interconnecting cables to auxiliary equipment, depends on device accessible interfaces and manufacturer requirements, as defined by ETSI EN 301 489-1 [21]. Contact discharges are performed at conductive surfaces, while air discharges are performed at insulating surfaces. Indirect contact discharges are performed on the measurement setup horizontal and vertical coupling planes as defined in CENELEC EN 61000-4-2 [20]. For the definition of integral antenna, removable antenna, antenna port and device classification see ETSI EN 301 489-1 [21]. For the contact / air discharges definitions see CENELEC EN 61000-4-2 [20]. Application Category Immunity Level All exposed surfaces of the radio equipment and ancillary equipment in a representative configuration Contact Discharge Air Discharge 4 kV 8 kV Table 45: EMC / ESD immunity requirements as defined by CENELEC EN 61000-4-2 and ETSI EN 301 489-1, 301 489-7, 301 489-24 UBX-13004618 - R04 Advance Information Design-in Page 116 of 141 TOBY-L2 and MPCI-L2 series - System Integration Manual 2.15.2 ESD immunity test of TOBY-L2 and MPCI-L2 series reference designs Although EMC / ESD certification is required for customized devices integrating TOBY-L2 and MPCI-L2 series modules for R&TTED and European Conformance CE mark, EMC certification (including ESD immunity) has been successfully performed on TOBY-L2 and MPCI-L2 series modules reference design according to European Norms summarized in Table 45. The EMC / ESD approved u-blox reference designs consist of a TOBY-L2 and MPCI-L2 series module installed onto a motherboard which provides supply interface, SIM card and communication port. External LTE/3G/2G antennas are connected to the provided connectors. Since external antennas are used, the antenna port can be separated from the enclosure port. The reference design is not enclosed in a box so that the enclosure port is not identified with physical surfaces. Therefore, some test cases cannot be applied. Only the antenna port is identified as accessible for direct ESD exposure. u-blox TOBY-L2 and MPCI-L2 series reference designs ESD immunity test results will be described in a successive release of the document. 2.15.3 ESD application circuits The application circuits described in this section are recommended and should be implemented in the device integrating TOBY-L2 and MPCI-L2 series modules, according to the application device classification (see ETSI EN 301 489-1 [21]), to satisfy the requirements for ESD immunity test summarized in Table 45. ESD application circuits will be described in a successive release of the document. UBX-13004618 - R04 Advance Information Design-in Page 117 of 141 TOBY-L2 and MPCI-L2 series - System Integration Manual 2.16 Schematic for TOBY-L2 and MPCI-L2 series module integration Figure 69 is an example of a schematic diagram where a TOBY-L2x0-00S module is integrated into an application board, using all the available interfaces and functions of the module. Figure 69: Example of schematic diagram to integrate a TOBY-L2x0-00S module in an application board, using all the interfaces UBX-13004618 - R04 Advance Information Design-in Page 118 of 141 3V8GND330uF100nF10nFTOBY-L2x0-00S71VCC72VCC70VCC3V_BCKP23RESET_NApplication ProcessorOpen Drain Output20PWR_ONOpen Drain Output68pF47pFSIM Card ConnectorCCVCC (C1)CCVPP (C6)CCIO (C7)CCCLK (C3)CCRST (C2)GND (C5)47pF47pF100nF59VSIM57SIM_IO56SIM_CLK58SIM_RST47pFESDESDESDESD81ANT187ANT2Primary AntennaTPTPSecondary Antenna61GPIO622GPIO224GPIO325GPIO460GPIO55V_INT21GPIO1TP15pF8.2pF+330uF+75ANT_DETGNDRTC back-up65SDIO_CMD66SDIO_D068SDIO_D163SDIO_D267SDIO_D364SDIO_CLK26HOST_SELECT062HOST_SELECT1SDASCL2627RSVDRSVD653I2S_RXD51I2S_TXD52I2S_CLK50I2S_WA3V8WWANIndicatorGNDGNDUSB 2.0 HostD-D+27USB_D-28USB_D+16RSVD / TXD17RSVD / RXD12RSVD / DCD14RSVD / RTS15RSVD / CTS13RSVD / DTR10RSVD / DSR11RSVD / RITPTPTPTPTPTPTPTPVBUS4VUSB_DET100nF TOBY-L2 and MPCI-L2 series - System Integration Manual Figure 70 is an example of a schematic diagram where a MPCI-L2 series module is integrated into an application board, using all the available interfaces and functions of the module. Figure 70: Example of schematic diagram to integrate a MPCI-L2 series module in an application board, using all the interfaces UBX-13004618 - R04 Advance Information Design-in Page 119 of 141 3V3GND330uF100nF10nFMPCI-L2 seriesApplication ProcessorOpen Drain Output22PERST #GNDGNDUSB 2.0 HostD-D+27USB_D-28USB_D+68pFPrimary AntennaSecondary Antenna42LED_WWAN#15pF8.2pF+20W_DISABLE #Open Drain Output243.3Vaux393.3Vaux23.3Vaux413.3Vaux523.3Vaux3V3NC47pFSIM Card ConnectorCCVCC (C1)CCVPP (C6)CCIO (C7)CCCLK (C3)CCRST (C2)GND (C5)47pF47pF100nF8UIM_PWR10UIM_DATA12UIM_CLK14UIM_RESET47pFESDESDESDESD TOBY-L2 and MPCI-L2 series - System Integration Manual 2.17 Design-in checklist This section provides a design-in checklist. 2.17.1 Schematic checklist The following are the most important points for a simple schematic check:

DC supply must provide a nominal voltage at VCC / 3.3Vaux pin within the operating range limits. DC supply must be capable of supporting both the highest peak and the highest averaged current consumption values in connected-mode, as specified in the TOBY-L2 series Data Sheet [1] or in the MPCI-L2 series Data Sheet [2]. VCC / 3.3Vaux voltage supply should be clean, with very low ripple/noise: provide the suggested bypass capacitors, in particular if the application device integrates an internal antenna. Do not apply loads which might exceed the limit for maximum available current from V_INT supply. Check that voltage level of any connected pin does not exceed the relative operating range. Check USB_D+ / USB_D- signal lines as well as very low capacitance ESD protections if accessible. Capacitance and series resistance must be limited on each SIM signal to match the SIM specifications. Insert the suggested capacitors on each SIM signal and low capacitance ESD protections if accessible. Check UART signals direction, as the TOBY-L2 signal names follow the ITU-T V.24 Recommendation [7]. Provide accessible test points directly connected to the following pins of the TOBY-L2 series modules:

V_INT, PWR_ON and RESET_N for diagnostic purpose. Provide accessible test points directly connected to all the UART pins of the TOBY-L2 series modules

(TXD, RXD, RTS, CTS, DTR, DSR, DCD, RI) for diagnostic purpose, in particular providing a 0 series jumper on each line to detach each UART pin of the module from the DTE application processor. Provide proper precautions for EMC / ESD immunity as required on the application board. Do not apply voltage to any generic digital interface pin of TOBY-L2 series modules before the switch-on of the generic digital interface supply source (V_INT). All unused pins can be left unconnected except the RSVD pin number 6 of TOBY-L2 series modules, which must be connected to GND. UBX-13004618 - R04 Advance Information Design-in Page 120 of 141 TOBY-L2 and MPCI-L2 series - System Integration Manual 2.17.2 Layout checklist The following are the most important points for a simple layout check:

Check 50 nominal characteristic impedance of the RF transmission line connected to the ANT1 and the ANT2 ports (antenna RF interfaces). Ensure no coupling occurs between the RF interface and noisy or sensitive signals (primarily USB signals, digital input/output signals, SIM signals, high-speed digital lines such as address and data lines). Optimize placement for minimum length of RF line. VCC / 3.3Vaux line should be wide and as short as possible. Route VCC / 3.3Vaux supply line away from RF lines / parts and other sensitive analog lines / parts. The VCC / 3.3Vaux bypass capacitors in the picoFarad range should be placed as close as possible to the VCC / 3.3Vaux pins, in particular if the application device integrates an internal antenna. Ensure proper grounding. Keep routing short and minimize parasitic capacitance on the SIM lines to preserve signal integrity. USB_D+ / USB_D- traces should meet the characteristic impedance requirement (90 differential and 30 common mode) and should not be routed close to any RF line / part. 2.17.3 Antenna checklist Antenna termination should provide 50 characteristic impedance with V.S.W.R at least less than 3:1

(recommended 2:1) on operating bands in deployment geographical area. Follow the recommendations of the antenna producer for correct antenna installation and deployment

(PCB layout and matching circuitry). Follow the additional guidelines for products marked with the FCC logo (United States only) reported in section 4.2.2. Ensure high and similar efficiency for both the primary (ANT1) and the secondary (ANT2) antenna. Ensure high isolation between the primary (ANT1) and the secondary (ANT2) antenna. Ensure low Envelope Correlation Coefficient between the primary (ANT1) and the secondary (ANT2) antenna: the 3D antenna radiation patterns should have radiation lobes in different directions. UBX-13004618 - R04 Advance Information Design-in Page 121 of 141 TOBY-L2 and MPCI-L2 series - System Integration Manual 3 Handling and soldering No natural rubbers, no hygroscopic materials or materials containing asbestos are employed. 3.1 Packaging, shipping, storage and moisture preconditioning For information pertaining to TOBY-L2 series reels / tapes, MPCI-L2 series trays, Moisture Sensitivity levels (MSD), shipment and storage information, as well as drying for preconditioning, see the TOBY-L2 series Data Sheet [1], the MPCI-L2 series Data Sheet [2] and the u-blox Package Information Guide [29]. 3.2 Handling The TOBY-L2 and MPCI-L2 series modules are Electro-Static Discharge (ESD) sensitive devices. Ensure ESD precautions are implemented during handling of the module. Electrostatic discharge (ESD) is the sudden and momentary electric current that flows between two objects at different electrical potentials caused by direct contact or induced by an electrostatic field. The term is usually used in the electronics and other industries to describe momentary unwanted currents that may cause damage to electronic equipment. The ESD sensitivity for each pin of TOBY-L2 and MPCI-L2 series modules (as Human Body Model according to JESD22-A114F) is specified in the TOBY-L2 series Data Sheet [1] or the MPCI-L2 series Data Sheet [2]. ESD prevention is based on establishing an Electrostatic Protective Area (EPA). The EPA can be a small working station or a large manufacturing area. The main principle of an EPA is that there are no highly charging materials near ESD sensitive electronics, all conductive materials are grounded, workers are grounded, and charge build-up on ESD sensitive electronics is prevented. International standards are used to define typical EPA and can be obtained for example from International Electrotechnical Commission (IEC) or American National Standards Institute (ANSI). In addition to standard ESD safety practices, the following measures should be taken into account whenever handling the TOBY-L2 and MPCI-L2 series modules:

Unless there is a galvanic coupling between the local GND (i.e. the work table) and the PCB GND, then the first point of contact when handling the PCB must always be between the local GND and PCB GND. Before mounting an antenna patch, connect ground of the device. When handling the module, do not come into contact with any charged capacitors and be careful when contacting materials that can develop charges (e.g. patch antenna, coax cable, soldering iron,). To prevent electrostatic discharge through the RF pin, do not touch any exposed antenna area. If there is any risk that such exposed antenna area is touched in non ESD protected work area, implement proper ESD protection measures in the design. When soldering the module and patch antennas to the RF pin, make sure to use an ESD safe soldering iron. For more robust designs, employ additional ESD protection measures on the application device integrating the TOBY-L2 and MPCI-L2 series modules, as described in section 2.15.3. UBX-13004618 - R04 Advance Information Handling and soldering Page 122 of 141 TOBY-L2 and MPCI-L2 series - System Integration Manual 3.3 Soldering 3.3.1 Soldering paste

"No Clean" soldering paste is strongly recommended for TOBY-L2 series modules, as it does not require cleaning after the soldering process has taken place. The paste listed in the example below meets these criteria. Soldering Paste:

OM338 SAC405 / Nr.143714 (Cookson Electronics) Alloy specification:

95.5% Sn / 3.9% Ag / 0.6% Cu (95.5% Tin / 3.9% Silver / 0.6% Copper) 95.5% Sn / 4.0% Ag / 0.5% Cu (95.5% Tin / 4.0% Silver / 0.5% Copper) Melting Temperature: 217 C Stencil Thickness:

150 m for base boards The final choice of the soldering paste depends on the approved manufacturing procedures. The paste-mask geometry for applying soldering paste should meet the recommendations in section 2.12. The quality of the solder joints on the connectors (half vias) should meet the appropriate IPC specification. 3.3.2 Reflow soldering A convection type-soldering oven is strongly recommended for TOBY-L2 series modules over the infrared type radiation oven. Convection heated ovens allow precise control of the temperature and all parts will be heated up evenly, regardless of material properties, thickness of components and surface color. Consider the IPC-7530 Guidelines for temperature profiling for mass soldering (reflow and wave) processes, published 2001. Reflow profiles are to be selected according to the following recommendations. Failure to observe these recommendations can result in severe damage to the device!

Preheat phase Initial heating of component leads and balls. Residual humidity will be dried out. Note that this preheat phase will not replace prior baking procedures. Temperature rise rate: max 3 C/s Time: 60 120 s End Temperature: 150 - 200 C Heating/ reflow phase If the temperature rise is too rapid in the preheat phase it may cause excessive slumping. If the preheat is insufficient, rather large solder balls tend to be generated. Conversely, if performed excessively, fine balls and large balls will be generated in clusters. If the temperature is too low, non-melting tends to be caused in areas containing large heat capacity. The temperature rises above the liquidus temperature of 217 C. Avoid a sudden rise in temperature as the slump of the paste could become worse. Limit time above 217 C liquidus temperature: 40 - 60 s Peak reflow temperature: 245 C Cooling phase A controlled cooling avoids negative metallurgical effects (solder becomes more brittle) of the solder and possible mechanical tensions in the products. Controlled cooling helps to achieve bright solder fillets with a good shape and low contact angle. Temperature fall rate: max 4 C/s UBX-13004618 - R04 Advance Information Handling and soldering Page 123 of 141 TOBY-L2 and MPCI-L2 series - System Integration Manual To avoid falling off, modules should be placed on the topside of the motherboard during soldering. The soldering temperature profile chosen at the factory depends on additional external factors like choice of soldering paste, size, thickness and properties of the base board, etc. Exceeding the maximum soldering temperature and the maximum liquidus time limit in the recommended soldering profile may permanently damage the module. Figure 71: Recommended soldering profile The modules must not be soldered with a damp heat process. 3.3.3 Optical inspection After soldering the TOBY-L2 series modules, inspect the modules optically to verify that the module is properly aligned and centered. 3.3.4 Cleaning Cleaning the modules is not recommended. Residues underneath the modules cannot be easily removed with a washing process. Cleaning with water will lead to capillary effects where water is absorbed in the gap between the baseboard and the module. The combination of residues of soldering flux and encapsulated water leads to short circuits or resistor-like interconnections between neighboring pads. Water will also damage the sticker and the ink-

jet printed text. Cleaning with alcohol or other organic solvents can result in soldering flux residues flooding into the two housings, areas that are not accessible for post-wash inspections. The solvent will also damage the sticker and the ink-jet printed text. Ultrasonic cleaning will permanently damage the module, in particular the quartz oscillators. For best results use a "no clean" soldering paste and eliminate the cleaning step after the soldering. UBX-13004618 - R04 Advance Information Handling and soldering Page 124 of 141 PreheatHeatingCooling[C]Peak Temp. 245C[C]250250Liquidus Temperature21721720020040 - 60 sEnd Temp.max 4C/s150 - 200C150150max 3C/s60 - 120 s100Typical Leadfree100Soldering Profile5050Elapsed time [s]TOBY-L2 and MPCI-L2 series - System Integration Manual 3.3.5 Repeated reflow soldering Only a single reflow soldering process is encouraged for boards with a module populated on it. 3.3.6 Wave soldering Boards with combined through-hole technology (THT) components and surface-mount technology (SMT) devices require wave soldering to solder the THT components. Only a single wave soldering process is encouraged for boards populated with the modules. 3.3.7 Hand soldering Hand soldering is not recommended. 3.3.8 Rework Rework is not recommended. Never attempt a rework on the module itself, e.g. replacing individual components. Such actions immediately terminate the warranty. 3.3.9 Conformal coating Certain applications employ a conformal coating of the PCB using HumiSeal or other related coating products. These materials affect the HF properties of the cellular modules and it is important to prevent them from flowing into the module. The RF shields do not provide 100% protection for the module from coating liquids with low viscosity, therefore care is required in applying the coating. Conformal Coating of the module will void the warranty. 3.3.10 Casting If casting is required, use viscose or another type of silicon pottant. The OEM is strongly advised to qualify such processes in combination with the cellular modules before implementing this in the production. Casting will void the warranty. 3.3.11 Grounding metal covers Attempts to improve grounding by soldering ground cables, wick or other forms of metal strips directly onto the EMI covers is done at the customer's own risk. The numerous ground pins should be sufficient to provide optimum immunity to interferences and noise. u-blox gives no warranty for damages to the cellular modules caused by soldering metal cables or any other forms of metal strips directly onto the EMI covers. 3.3.12 Use of ultrasonic processes The cellular modules contain components which are sensitive to Ultrasonic Waves. Use of any Ultrasonic Processes (cleaning, welding etc.) may cause damage to the module. u-blox gives no warranty against damages to the cellular modules caused by any Ultrasonic Processes. UBX-13004618 - R04 Advance Information Handling and soldering Page 125 of 141 TOBY-L2 and MPCI-L2 series - System Integration Manual 4 Approvals For the complete list of all the certification schemes approvals of TOBY-L2 and MPCI-L2 series modules and the corresponding declarations of conformity, see the u-blox web-site (http://www.u-blox.com/). 4.1 Product certification approval overview Product certification approval is the process of certifying that a product has passed all tests and criteria required by specifications, typically called certification schemes that can be divided into three distinct categories:

Regulatory certification o Country specific approval required by local government in most regions and countries, such as:

CE (Conformit Europenne) marking for European Union FCC (Federal Communications Commission) approval for United States Industry certification o Telecom industry specific approval verifying the interoperability between devices and networks:

GCF (Global Certification Forum), partnership between European device manufacturers and network operators to ensure and verify global interoperability between devices and networks PTCRB (PCS Type Certification Review Board), created by United States network operators to ensure and verify interoperability between devices and North America networks Operator certification o Operator specific approval required by some mobile network operator, such as:

AT&T network operator in United States Even if TOBY-L2 and MPCI-L2 series modules are approved under all major certification schemes, the application device that integrates TOBY-L2 and MPCI-L2 series modules must be approved under all the certification schemes required by the specific application device to be deployed in the market. The required certification scheme approvals and relative testing specifications differ depending on the country or the region where the device that integrates TOBY-L2 and MPCI-L2 series modules must be deployed, on the relative vertical market of the device, on type, features and functionalities of the whole application device, and on the network operators where the device must operate. The certification of the application device that integrates a TOBY-L2 module and the compliance of the application device with all the applicable certification schemes, directives and standards are the sole responsibility of the application device manufacturer. TOBY-L2 and MPCI-L2 series modules are certified according to all capabilities and options stated in the Protocol Implementation Conformance Statement document (PICS) of the module. The PICS, according to the 3GPP TS 51.010-2 [24], 3GPP TS 34.121-2 [25], 3GPP TS 36.521-2 [26] and 3GPP TS 36.523-2 [27], is a statement of the implemented and supported capabilities and options of a device. The PICS document of the application device integrating TOBY-L2 and MPCI-L2 series modules must be updated from the module PICS statement if any feature stated as supported by the module in its PICS document is not implemented or disabled in the application device. For more details regarding the AT commands settings that affect the PICS, see the u-blox AT Commands Manual [3]. Check the specific settings required for mobile network operators approvals as they may differ from the AT commands settings defined in the module as integrated in the application device. UBX-13004618 - R04 Advance Information Approvals Page 126 of 141 TOBY-L2 and MPCI-L2 series - System Integration Manual 4.2 Federal Communications Commission and Industry Canada notice Federal Communications Commission (FCC) IDs:

XPYTOBYL200 XPYTOBYL210 Industry Canada (IC) Certification Numbers:

8595A-TOBYL200 8595A-TOBYL210 4.2.1 Safety warnings review the structure Equipment for building-in. The requirements for fire enclosure must be evaluated in the end product The clearance and creepage current distances required by the end product must be withheld when the module is installed The cooling of the end product shall not negatively be influenced by the installation of the module Excessive sound pressure from earphones and headphones can cause hearing loss No natural rubbers, hygroscopic materials, or materials containing asbestos are employed 4.2.2 Declaration of Conformity This device complies with Part 15 of the FCC rules. Operation is subject to the following two conditions:

this device may not cause harmful interference this device must accept any interference received, including interference that may cause undesired operation Radiofrequency radiation exposure Information: this equipment complies with FCC radiation exposure limits prescribed for an uncontrolled environment for fixed and mobile use conditions. This equipment should be installed and operated with a minimum distance of 20 cm between the radiator and the body of the user or nearby persons. This transmitter must not be co-

located or operating in conjunction with any other antenna or transmitter except as authorized in the certification of the product. The gain of the system antenna(s) used for the TOBY-L2 and MPCI-L2 series modules (i.e. the combined transmission line, connector, cable losses and radiating element gain) must not exceed 9.8 dBi (700 MHz), 4.3 dBi (850 MHz), 2.8 dBi (1900 MHz), 5.5 dBi (1700 MHz), 6.0 dBi

(2500 MHz), 6.30 dBi (900 MHz), 9.35 dBi (1800 MHz), 11.92 dBi (FDD1), 9.03 dBi (FDD8), for mobile and fixed or mobile operating configurations. 4.2.3 Modifications The FCC requires the user to be notified that any changes or modifications made to this device that are not expressly approved by u-blox could void the user's authority to operate the equipment. Manufacturers of mobile or fixed devices incorporating the TOBY-L2 and MPCI-L2 series modules are authorized to use the FCC Grants and Industry Canada Certificates of the TOBY-L2 and MPCI-L2 series modules for their own final products according to the conditions referenced in the certificates. UBX-13004618 - R04 Advance Information Approvals Page 127 of 141 TOBY-L2 and MPCI-L2 series - System Integration Manual The FCC Label shall in the above case be visible from the outside, or the host device shall bear a second label stating:

"Contains FCC ID: XPYTOBYL200" resp.

"Contains FCC ID: XPYTOBYL210" resp. The IC Label shall in the above case be visible from the outside, or the host device shall bear a second label stating:

"Contains IC: 8595A-TOBYL200" resp.

"Contains IC: 8595A-TOBYL210" resp. Canada, Industry Canada (IC) Notices This Class B digital apparatus complies with Canadian CAN ICES-3(B) / NMB-3(B) and RSS-210. Operation is subject to the following two conditions:

o o this device may not cause interference this device must accept any interference, including interference that may cause undesired operation of the device Radio Frequency (RF) Exposure Information The radiated output power of the u-blox Cellular Module is below the Industry Canada (IC) radio frequency exposure limits. The u-blox Cellular Module should be used in such a manner such that the potential for human contact during normal operation is minimized. This device has been evaluated and shown compliant with the IC RF Exposure limits under mobile exposure conditions (antennas are greater than 20 cm from a person's body). This device has been certified for use in Canada. Status of the listing in the Industry Canadas REL (Radio Equipment List) can be found at the following web address:

http://www.ic.gc.ca/app/sitt/reltel/srch/nwRdSrch.do?lang=eng Additional Canadian information on RF exposure also can be found at the following web address: http://www.ic.gc.ca/eic/site/smt-gst.nsf/eng/sf08792.html IMPORTANT: Manufacturers of portable applications incorporating the TOBY-L2 and MPCI-L2 series modules are required to have their final product certified and apply for their own FCC Grant and Industry Canada Certificate related to the specific portable device. This is mandatory to meet the SAR requirements for portable devices. Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. Canada, avis d'Industrie Canada (IC) Cet appareil numrique de classe B est conforme aux normes canadiennes CAN ICES-3(B) /

NMB-3(B) et RSS-210. Son fonctionnement est soumis aux deux conditions suivantes:

o o cet appareil ne doit pas causer d'interfrence cet appareil doit accepter toute interfrence, notamment les interfrences qui peuvent affecter son fonctionnement Informations concernant l'exposition aux frquences radio (RF) La puissance de sortie mise par lappareil de sans fil u-blox Cellular Module est infrieure la limite d'exposition aux frquences radio d'Industrie Canada (IC). Utilisez lappareil de sans fil u-blox Cellular Module de faon minimiser les contacts humains lors du fonctionnement normal. Ce priphrique a t valu et dmontr conforme aux limites d'exposition aux frquences radio (RF) d'IC lorsqu'il est install dans des produits htes particuliers qui fonctionnent dans des conditions d'exposition des appareils mobiles (les antennes se situent plus de 20 centimtres du corps d'une personne). UBX-13004618 - R04 Advance Information Approvals Page 128 of 141 TOBY-L2 and MPCI-L2 series - System Integration Manual Ce priphrique est homologu pour l'entre correspondant lappareil dans la liste d'quipement radio (REL - Radio Equipment List) d'Industrie Canada rendez-vous sur:

l'utilisation au Canada. Pour consulter http://www.ic.gc.ca/app/sitt/reltel/srch/nwRdSrch.do?lang=fra Pour des informations supplmentaires concernant l'exposition aux RF au Canada rendez-vous sur: http://www.ic.gc.ca/eic/site/smt-gst.nsf/fra/sf08792.html IMPORTANT: les fabricants d'applications portables contenant les modules TOBY-L2 and MPCI-L2 series doivent faire certifier leur produit final et dposer directement leur candidature pour une certification FCC ainsi que pour un certificat Industrie Canada dlivr par l'organisme charg de ce type d'appareil portable. Ceci est obligatoire afin d'tre en accord avec les exigences SAR pour les appareils portables. Tout changement ou modification non expressment approuv par la partie responsable de la certification peut annuler le droit d'utiliser l'quipement. 4.3 R&TTED and European Conformance CE mark The modules have been evaluated against the essential requirements of the 1999/5/EC Directive. In order to satisfy the essential requirements of the 1999/5/EC Directive, the modules are compliant with the following standards:

Radio Frequency spectrum use (R&TTE art. 3.2):

o o o o EN 301 511 V9.0.2 EN 301 908-1 V6.2.1 EN 301 908-2 V6.2.1 EN 301 908-13 (v5.2.1) EN 301 908-13 (v5.2.1)Electromagnetic Compatibility (R&TTE art. 3.1b):

o o o EN 301 489-1 V1.9.2 EN 301 489-7 V1.3.1 EN 301 489-24 V1.5.1 Health and Safety (R&TTE art. 3.1a) o o EN 60950-1:2006 + A11:2009 + A1:2010+A12:2011+A2: 2013 EN 62311:2008 The conformity assessment procedure for the modules, referred to in Article 10 and detailed in Annex IV of Directive 1999/5/EC, has been followed with the involvement of the following Notified Body number: 1588 Thus, the following marking is included in the product:

1588 UBX-13004618 - R04 Advance Information Approvals Page 129 of 141 TOBY-L2 and MPCI-L2 series - System Integration Manual 5 Product testing 5.1 u-blox in-series production test u-blox focuses on high quality for its products. All units produced are fully tested automatically in production line. Stringent quality control process has been implemented in the production line. Defective units are analyzed in detail to improve the production quality. This is achieved with automatic test equipment (ATE) in production line, which logs all production and measurement data. A detailed test report for each unit can be generated from the system. Figure 72 illustrates typical automatic test equipment (ATE) in a production line. The following typical tests are among the production tests. Digital self-test (firmware download, Flash firmware verification, IMEI programming) Measurement of voltages and currents Adjustment of ADC measurement interfaces Functional tests (USB interface communication, SIM card communication) Digital tests (GPIOs and other interfaces) Measurement and calibration of RF characteristics in all supported bands (such as receiver S/N verification, frequency tuning of reference clock, calibration of transmitter and receiver power levels, etc.) Verification of RF characteristics after calibration (i.e. modulation accuracy, power levels, spectrum, etc. are checked to ensure they are all within tolerances when calibration parameters are applied) Figure 72: Automatic test equipment for module tests UBX-13004618 - R04 Advance Information Product testing Page 130 of 141 TOBY-L2 and MPCI-L2 series - System Integration Manual 5.2 Test parameters for OEM manufacturer Because of the testing done by u-blox (with 100% coverage), an OEM manufacturer does not need to repeat firmware tests or measurements of the module RF performance or tests over analog and digital interfaces in their production test. However, an OEM manufacturer should focus on:

Module assembly on the device; it should be verified that:

o Soldering and handling process did not damage the module components o All module pins are well soldered on device board o There are no short circuits between pins Component assembly on the device; it should be verified that:

o Communication with host controller can be established o The interfaces between module and device are working o Overall RF performance test of the device including antenna Dedicated tests can be implemented to check the device. For example, the measurement of module current consumption when set in a specified status can detect a short circuit if compared with a Golden Device result. In addition, module AT commands can be used to perform functional tests (communication with host controller, check SIM interface, GPIOs, etc.) and to perform RF performance tests: see the following two sections for details. 5.2.1 Go/No go tests for integrated devices A Go/No go test is typically to compare the signal quality with a Golden Device in a location with excellent network coverage and known signal quality. This test should be performed after data connection has been established. AT+CSQ is the typical AT command used to check signal quality in term of RSSI. See the u-blox AT Commands Manual [3] for detail usage of the AT command. These kinds of test may be useful as a go/no go test but not for RF performance measurements. This test is suitable to check the functionality of communication with host controller, SIM card as well as power supply. It is also a means to verify if components at antenna interface are well soldered. 5.2.2 RF functional tests The overall RF functional test of the device including the antenna can be performed with basic instruments such as a spectrum analyzer (or an RF power meter) and a signal generator with the assistance of AT+UTEST command over AT command user interface. The AT+UTEST command provides a simple interface to set the module to Rx or Tx test modes ignoring the LTE/3G/2G signaling protocol. The command can set the module into:

transmitting mode in a specified channel and power level in all supported modulation schemes and bands receiving mode in a specified channel to returns the measured power level in all supported bands See the u-blox AT Commands Manual [3] and the End user test Application Note [24], for the AT+UTEST command syntax description and detail guide of usage. UBX-13004618 - R04 Advance Information Product testing Page 131 of 141 TOBY-L2 and MPCI-L2 series - System Integration Manual This feature allows the measurement of the transmitter and receiver power levels to check component assembly related to the module antenna interface and to check other device interfaces from which depends the RF performance. To avoid module damage during transmitter test, a proper antenna according to module specifications or a 50 termination must be connected to ANT1 port. To avoid module damage during receiver test the maximum power level received at ANT1 and ANT2 ports must meet module specifications. The AT+UTEST command sets the module to emit RF power ignoring LTE/3G/2G signaling protocol. This emission can generate interference that can be prohibited by law in some countries. The use of this feature is intended for testing purpose in controlled environments by qualified user and must not be used during the normal module operation. Follow instructions suggested in u-blox documentation. u-blox assumes no responsibilities for the inappropriate use of this feature. Figure 73 illustrates a typical test setup for such RF functional test. Figure 73: Setup with spectrum analyzer or power meter and signal generator for radiated measurements UBX-13004618 - R04 Advance Information Product testing Page 132 of 141 Application BoardTOBY-L2 seriesMPCI-L2 seriesANT1Application ProcessorAT commandsCellular antennaSpectrumAnalyzerorPowerMeterINWideband antennaTXApplication BoardTOBY-L2 seriesMPCI-L2 seriesANT1Application ProcessorAT commandsCellular antennasSignalGeneratorOUTWideband antennaRXANT2 TOBY-L2 and MPCI-L2 series - System Integration Manual Appendix A Glossary 3GPP 8-PSK 16QAM 64QAM ACM ADC AP ASIC AT CSFB DC DCE DDC DL DRX DSP DTE ECM EDGE EMC EMI ESD ESR 3rd Generation Partnership Project 8 Phase-Shift Keying modulation 16-state Quadrature Amplitude Modulation 64-state Quadrature Amplitude Modulation Abstract Control Model Analog to Digital Converter Application Processor Application-Specific Integrated Circuit AT Command Interpreter Software Subsystem, or attention Circuit Switched Fall-Back Direct Current Data Communication Equipment Display Data Channel interface Down-Link (Reception) Discontinuous Reception Digital Signal Processing Data Terminal Equipment Ethernet networking Control Model Enhanced Data rates for GSM Evolution Electro-Magnetic Compatibility Electro-Magnetic Interference Electro-Static Discharge Equivalent Series Resistance E-UTRA Evolved Universal Terrestrial Radio Access FDD FEM FOAT FOTA FTP FW GND GNSS GPIO GPRS GPS HBM HSIC HSDPA HSUPA HTTP HW I/Q I2C I2S IP Frequency Division Duplex Front End Module Firmware Over AT commands Firmware Over The Air File Transfer Protocol Firmware Ground Global Navigation Satellite System General Purpose Input Output General Packet Radio Service Global Positioning System Human Body Model High Speed Inter Chip High Speed Downlink Packet Access High Speed Uplink Packet Access HyperText Transfer Protocol Hardware In phase and Quadrature Inter-Integrated Circuit interface Inter IC Sound interface Internet Protocol UBX-13004618 - R04 Advance Information Appendix Page 133 of 141 TOBY-L2 and MPCI-L2 series - System Integration Manual LDO LGA LNA LPDDR LTE M2M MBIM MIMO N/A N.A. NCM OTA PA PCM Low-Dropout Land Grid Array Low Noise Amplifier Low Power Double Data Rate synchronous dynamic RAM memory Long Term Evolution Machine-to-Machine Mobile Broadband Interface Model Multi-Input Multi-Output Not Applicable Not Available Network Control Model Over The Air Power Amplifier Pulse Code Modulation PCN / IN Product Change Notification / Information Note PCS PFM PMU PWM QPSK RF RMII RNDIS RSE RTC SAW SDIO SIM SMS SPI SRF SSL TBD TCP TDD TDMA TIS TP TRP UART UDP UICC UL UMTS USB VCO VoLTE VSWR Personal Communications Service Pulse Frequency Modulation Power Management Unit Pulse Width Modulation Quadrature Phase Shift Keying Radio Frequency Reduced Media Independent Interface Remote Network Driver Interface Specification Radiated Spurious Emission Real Time Clock Surface Acoustic Wave Secure Digital Input Output Subscriber Identification Module Short Message Service Serial Peripheral Interface Self Resonant Frequency Secure Socket Layer To Be Defined Transmission Control Protocol Time Division Duplex Time Division Multiple Access Total Isotropic Sensitivity Test-Point Total Radiated Power Universal Asynchronous Receiver-Transmitter User Datagram Protocol Universal Integrated Circuit Card Up-Link (Transmission) Universal Mobile Telecommunications System Universal Serial Bus Voltage Controlled Oscillator Voice over LTE Voltage Standing Wave Ratio UBX-13004618 - R04 Advance Information Appendix Page 134 of 141 TOBY-L2 and MPCI-L2 series - System Integration Manual B Migration between TOBY-L1 and TOBY-L2 B.1 Overview TOBY-L1 and TOBY-L2 series cellular modules have exactly the same TOBY form factor (35.6 x 24.8 mm LGA) with exactly the same 152-pad layout as described in Figure 74, so that the modules can be alternatively mounted on a single application board using exactly the same copper mask, solder mask and paste mask. Figure 74: TOBY-L1 and TOBY-L2 series modules pad layout and pin assignment Table 46 summarizes the interfaces provided: TOBY-L2 series modules make available additional interfaces over pins remarked as reserved on TOBY-L1 series modules (highlighted in blue in Figure 74). Module Radio Access Technology Power System SIM Serial Audio GPIO y r o g e t a c E T L s d n a b E T L y r o g e t a c A P D S H y r o g e t a c A P U S H TOBY-L100 3 4, 13 s d n a b G 3 TOBY-L200 4 TOBY-L210 4 2,4,5, 7,17 1,3,5, 7,8,20 24 6 24 6 1,2,4, 5,8 1,2, 5,8 y t i s r e v d i x R

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. s O P G I l l e b a n e y p p u s S S N G y d a e r a t a d x T S S N G g n i r a h s C T R S S N G t u p t u o k c o C l l o r t n o c i F i W i g n n u t a n n e t n A i o d u a g o a n A l 12 Quad F F F F F F 12 Quad F F F F F F F F F F F F F F F F F F F F F F F F = will be supported in future product version 01 Table 46: Summary of TOBY-L1 series and TOBY-L2 series modules interfaces UBX-13004618 - R04 Advance Information Appendix Page 135 of 141 11107542121191816151312292726242386322201714282596566697172747555575860616364474950525368707354565962485167RSVDRSVDGNDVCCVCCGNDRSVDRSVDSIM_IOSIM_RSTGPIO5GPIO6RSVDRSVDRSVDRSVDRSVDRSVDRSVDRSVDVCCGNDRSVDSIM_CLKVSIMRSVDRSVDRSVDRSVDRSVDRSVDRSVDV_INTRSVDGNDRSVDGPIO1RSVDRSVDRSVDRSVDRSVDRSVDRSVDUSB_D-RSVDGPIO3RESET_NRSVDRSVDV_BCKPGPIO2PWR_ONRSVDRSVDUSB_D+GPIO4RSVD909192787776931007980838586888982848781GNDRSVDGNDGNDRSVDGNDGNDGNDGNDGNDGNDGNDGNDGNDRSVDANT2ANT13231304445461451524342393736343340383541GNDRSVDGNDGNDRSVDGNDRSVDRSVDRSVDRSVDRSVDRSVDRSVDRSVDRSVDRSVDRSVD999897969594106105104103102101108107124123130129128127126125136135134133132131138137144143142141140139151150149148147146114113112111110109120119118117116115122121Pin 93-152: GNDTOBY-L1Top view11107542121191816151312292726242386322201714282596566697172747555575860616364474950525368707354565962485167SDIO_CMDSDIO_D0GNDVCCVCCGNDANT_DETSDASIM_IOSIM_RSTGPIO5GPIO6SDIO_D2SDIO_CLKRSVDRSVDI2S_WAI2S_CLKI2S_RXDSDIO_D1VCCGNDSCLSIM_CLKVSIMHOST_SELECT1RSVDI2S_TXDSDIO_D3RIDSRRSVDV_INTVUSB_DETGNDRSVDGPIO1RSVDRSVDTXDCTSDTRDCDRSVDUSB_D-HOST_SELECT0GPIO3RESET_NRSVDRSVDV_BCKPGPIO2PWR_ONRXDRTSUSB_D+GPIO4RSVD909192787776931007980838586888982848781GNDRSVDGNDGNDRSVDGNDGNDGNDGNDGNDGNDGNDGNDGNDRSVDANT2ANT13231304445461451524342393736343340383541GNDRSVDGNDGNDRSVDGNDRSVDRSVDRSVDRSVDRSVDRSVDRSVDRSVDRSVDRSVDRSVD999897969594106105104103102101108107124123130129128127126125136135134133132131138137144143142141140139151150149148147146114113112111110109120119118117116115122121Pin 93-152: GNDTOBY-L2Top view TOBY-L2 and MPCI-L2 series - System Integration Manual B.2 Pin-out comparison between TOBY-L1 and TOBY-L2 TOBY-L1 Pin No Pin Name Description RSVD GND V_BCKP RSVD V_INT 1 2 3 4 5 6 Interfaces Supply Output 1.8 V output RSVD Reserved Reserved Ground RTC Supply Output 2.5 V output only RTC backup function not available TOBY-L2 Pin Name RSVD GND V_BCKP Description Reserved Ground RTC Supply Input/Output 3.0 V output 1.4 V 4.2 V input (RTC backup) Remarks for migration RTC back-up: No Yes Reserved VUSB_DET VBUS USB supply (5 V) detection Reserved VBUS USB detection 7-9 10 RSVD RSVD Reserved Reserved 11 12 13 14 15 16 17 RSVD Reserved RSVD Reserved RSVD Reserved RSVD Reserved RSVD Reserved RSVD Reserved RSVD Reserved 18-19 RSVD Reserved V_INT RSVD RSVD DSR RI DCD DTR RTS CTS TXD RXD RSVD PWR_ON GPIO1 Interfaces Supply Output 1.8 V output Reserved This pin must be connected to GND No functional difference No connect Connect to GND Reserved UART DSR Output / GPIO Not supported by TOBY-L2x0-00S UART RI Output / GPIO Not supported by TOBY-L2x0-00S UART DCD Output / GPIO Not supported by TOBY-L2x0-00S UART DTR Input / GPIO Not supported by TOBY-L2x0-00S UART RTS Input Not supported by TOBY-L2x0-00S UART CTS Output Not supported by TOBY-L2x0-00S UART Data Input Not supported by TOBY-L2x0-00S UART Data Output Not supported by TOBY-L2x0-00S Reserved UART / GPIO Reserved UART / GPIO Reserved UART / GPIO Reserved UART / GPIO Reserved UART Reserved UART Reserved UART Reserved UART Reserved Power-on Input Internal 50k pull-up to VCC GPIO Not supported by TOBY-L2x0-00S except WWAN Status Indication Pull-up: External Internal No functional difference 20 21 22 23 24 25 26 27 28 29 30 31 32 33-43 44 45 46 47-49 GPIO Not supported by TOBY-L100-00S GPIO2 GPIO Not supported by TOBY-L2x0-00S PWR_ON GPIO1 GPIO2 RESET_N GPIO3 GPIO4 Power-on Input No internal pull-up GPIO Not supported by TOBY-L100-00S except Network Status Indication Reset signal Input Internal 10k pull-up to V_BCKP Switch-off function only GPIO Not supported by TOBY-L100-00S GPIO Not supported by TOBY-L100-00S RESET_N GPIO3 GPIO4 RSVD Reserved HOST_SELECT0 Reset signal Input Internal 50k pull-up to VCC Reset, Switch-on, Switch-off GPIO Not supported by TOBY-L2x0-00S GPIO Not supported by TOBY-L2x0-00S Input for selection of module configuration by the host Not supported by TOBY-L2x0-00S Internal pull-up: V_BCKP VCC Switch-off Reset, Switch-on/off Reserved HOST_SELECT0 USB_D-

USB_D+

USB Data I/O (D-) USB Data I/O (D+) USB_D-

USB_D+

USB Data I/O (D-) USB Data I/O (D+) No functional difference No functional difference RSVD GND RSVD GND RSVD GND RSVD GND RSVD Reserved Ground Reserved Ground Reserved Ground Reserved Ground Reserved RSVD GND RSVD GND RSVD GND RSVD GND RSVD Reserved Ground Reserved Ground Reserved Ground Reserved Ground Reserved UBX-13004618 - R04 Advance Information Appendix Page 136 of 141 RSVD Reserved HOST_SELECT1 GPIO6 GPIO 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70-72 73-74 75 76 77 78-80 81 TOBY-L1 Pin No Pin Name Description RSVD Reserved RSVD Reserved RSVD Reserved RSVD Reserved RSVD Reserved RSVD Reserved SIM_CLK SIM_IO SIM_RST VSIM GPIO5 GPIO6 SIM Clock Output SIM Data I/O SIM Reset Output SIM Supply Output GPIO Not supported by TOBY-L100-00S GPIO Not supported by TOBY-L100-00S RSVD Reserved RSVD Reserved RSVD Reserved RSVD Reserved RSVD Reserved RSVD Reserved GND VCC GND RSVD GND RSVD GND ANT1 Ground Module Supply Input 3.40 V 4.50 V normal range No 2G current pulses No switch-on applying VCC Ground Reserved Ground Reserved Ground RF Antenna Input/Output Two LTE bands No 3G bands No 2G bands Ground Reserved Ground RF Antenna Input LTE MIMO 2x2 No 3G Rx diversity 82-83 84 85-86 87 GND RSVD GND ANT2 88-90 91 GND RSVD 92-152 GND Ground Reserved Ground TOBY-L2 and MPCI-L2 series - System Integration Manual TOBY-L2 Pin Name I2S_WA I2S_TXD I2S_CLK I2S_RXD SCL SDA SIM_CLK SIM_IO SIM_RST VSIM GPIO5 SDIO_D2 SDIO_CLK SDIO_CMD SDIO_D0 SDIO_D3 SDIO_D1 GND VCC Description I2S Word Alignment / GPIO Not supported by TOBY-L2x0-00S I2S Data Output / GPIO Not supported by TOBY-L2x0-00S I2S Clock / GPIO Not supported by TOBY-L2x0-00S I2S Data Input / GPIO Not supported by TOBY-L2x0-00S I2C Clock Output Not supported by TOBY-L2x0-00S I2C Data I/O Not supported by TOBY-L2x0-00S SIM Clock Output SIM Data I/O SIM Reset Output SIM Supply Output GPIO SIM detection Input for selection of module configuration by the host Not supported by TOBY-L2x0-00S SDIO serial data [2]

Not supported by TOBY-L2x0-00S SDIO serial clock Not supported by TOBY-L2x0-00S SDIO command Not supported by TOBY-L2x0-00S SDIO serial data [0]

Not supported by TOBY-L2x0-00S SDIO serial data [3]

Not supported by TOBY-L2x0-00S SDIO serial data [1]

Not supported by TOBY-L2x0-00S Remarks for migration Reserved I2S / GPIO Reserved I2S / GPIO Reserved I2S / GPIO Reserved I2S / GPIO Reserved I2C Reserved I2C No functional difference No functional difference No functional difference No functional difference Reserved HOST_SELECT1 Reserved SDIO Reserved SDIO Reserved SDIO Reserved SDIO Reserved SDIO Reserved SDIO Ground Module Supply Input 3.40 V 4.35 V normal range High 2G current pulses Switch-on applying VCC No VCC functional difference GND ANT_DET Ground Antenna Detection Input Not supported by TOBY-L2x0-00S Reserved ANT_DET GND RSVD GND ANT1 GND RSVD GND ANT2 GND RSVD GND Ground Reserved Ground RF Antenna Input/Output Up to six LTE bands Up to five 3G bands Four 2G bands Ground Reserved Ground RF Antenna Input LTE MIMO 2x2 3G Rx diversity Ground Reserved Ground No RF functional difference Different operating bands support No RF functional difference Different operating bands support Table 47: TOBY-L1 and TOBY-L2 pin assignment with remarks for migration UBX-13004618 - R04 Advance Information Appendix Page 137 of 141 TOBY-L2 and MPCI-L2 series - System Integration Manual B.3 Schematic for TOBY-L1 and TOBY-L2 integration Figure 75 shows an example of schematic diagram where a TOBY-L100-00S or TOBY-L2x0-00S module can be integrated into the same application board, using all the available interfaces and functions of the modules. The different mounting options for the external parts are highlighted in different colors as described in the legend, according to the interfaces supported by the relative modules. Figure 75: Example of complete schematic diagram to integrate TOBY-L100-00S / TOBY-L2x0-00S on the same application board UBX-13004618 - R04 Advance Information Appendix Page 138 of 141 3V8GND330uF100nF10nFTOBY-L100-00S / TOBY-L2x0-00S71VCC72VCC70VCC3V_BCKP23RESET_NApplication ProcessorOpen Drain Output20PWR_ONOpen Drain OutputGNDGNDUSB 2.0 HostD-D+27USB_D-28USB_D+68pF47pFSIM Card ConnectorCCVCC (C1)CCVPP (C6)CCIO (C7)CCCLK (C3)CCRST (C2)GND (C5)47pF47pF100nF47pFESDESDESDESDPrimary AntennaTPTPSecondary Antenna3V8Network Indicator21GPIO160GPIO525GPIO424GPIO322GPIO2TP15pF8.2pF+330uF+GNDRTC back-up16RSVD / TXD17RSVD / RXD12RSVD / DCD14RSVD / RTS15RSVD / CTS13RSVD / DTR10RSVD / DSR11RSVD / RITPTPTPTPTPTPTPTP26RSVD / HOST_SELECT062RSVD / HOST_SELECT1100k059VSIM57SIM_IO56SIM_CLK58SIM_RST81ANT187ANT25V_INT61GPIO675RSVD / ANT_DET65RSVD / SDIO_CMD66RSVD / SDIO_D068RSVD / SDIO_D163RSVD / SDIO_D267RSVD / SDIO_D364RSVD / SDIO_CLKRSVD / SDARSVD / SCL2627RSVDRSVD653RSVD / I2S_RXD51RSVD / I2S_TXD52RSVD / I2S_CLK50RSVD / I2S_WARSVD49TPMount for TOBY-L2Mount for TOBY-L1Mount for TOBY-L1 and TOBY-L2LEGENDVBUS4VUSB_DET100nF0 TOBY-L2 and MPCI-L2 series - System Integration Manual Related documents

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[3]

[4]

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[7]

[8]

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u-blox TOBY-L2 series Data Sheet, Docu No UBX-13004573 u-blox MPCI-L2 series Data Sheet, Docu No UBX-13004749 u-blox AT Commands Manual, Docu No UBX-13002752 u-blox EVK-L20 / EVK-L21 User Guide, Docu No UBX-14000422 u-blox Firmware Update Application Note, Docu No UBX-13001845 Universal Serial Bus Revision 2.0 specification, http://www.usb.org/developers/docs/usb20_docs/

ITU-T Recommendation V.24 - 02-2000 - List of definitions for interchange circuits between the Data Terminal Equipment (DTE) and the Data Circuit-terminating Equipment (DCE), http://www.itu.int/rec/T-REC-V.24-200002-I/en 3GPP TS 27.007 - AT command set for User Equipment (UE) 3GPP TS 27.005 - Use of Data Terminal Equipment - Data Circuit terminating; Equipment (DTE - DCE) interface for Short Message Service (SMS) and Cell Broadcast Service (CBS) 3GPP TS 27.010 - Terminal Equipment to User Equipment (TE-UE) multiplexer protocol u-blox Mux Implementation Application Note, Docu No UBX-13001887 I2C-bus specification and user manual - Rev. 5 - 9 October 2012 - NXP Semiconductors, http://www.nxp.com/documents/user_manual/UM10204.pdf u-blox GNSS Implementation Application Note, Docu No UBX-13001849 PCI Express Mini Card Electromechanical Specification, Revision 2.0, April 21, 2012 3GPP TS 26.267 eCall Data Transfer; In-band modem solution; General description BS EN 16062:2011 Intelligent transport systems eSafety eCall high level application requirements ETSI TS 122 101 Service aspects; Service principles (3GPP TS 22.101) u-blox eCall / ERA-GLONASS Application Note, Docu No UBX-13001924 SIM Access Profile Interoperability Specification, http://www.bluetooth.org/

CENELEC EN 61000-4-2 (2001): "Electromagnetic compatibility (EMC) Part 4-2: Testing and measurement techniques Electrostatic discharge immunity test". ETSI EN 301 489-1 V1.8.1: Electromagnetic compatibility and Radio spectrum Matters (ERM); EMC standard for radio equipment and services; Part 1: Common technical requirements ETSI EN 301 489-7 V1.3.1 Electromagnetic compatibility and Radio spectrum Matters (ERM); EMC standard for radio equipment and services; Part 7: Specific conditions for mobile and portable radio and ancillary equipment of digital cellular radio telecommunications systems ETSI EN 301 489-24 V1.4.1 "Electromagnetic compatibility and Radio spectrum Matters (ERM); EMC standard for radio equipment and services; Part 24: Specific conditions for IMT-2000 CDMA Direct Spread (UTRA) for Mobile and portable (UE) radio and ancillary equipment"

3GPP TS 51.010-2 - Technical Specification Group GSM/EDGE Radio Access Network; Mobile Station (MS) conformance specification; Part 2: Protocol Implementation Conformance Statement (PICS) 3GPP TS 34.121-2 - Technical Specification Group Radio Access Network; User Equipment (UE) conformance specification; Radio transmission and reception (FDD); Part 2: Implementation Conformance Statement (ICS) 3GPP TS 36.521-2 - Evolved Universal Terrestrial Radio Access (E-UTRA); User Equipment conformance specification; Radio transmission and reception; Part 2: Implementation Conformance Statement (ICS) 3GPP TS 36.523-2 - Evolved Universal Terrestrial Radio Access (E-UTRA) and Evolved Packet Core (EPC); User Equipment conformance specification; Part 2: Implementation Conformance Statement (ICS) u-blox End user test Application Note, Docu No UBX-13001922 u-blox Package Information Guide, Docu No UBX-14001652 Some of the above documents can be downloaded from u-blox web-site (http://www.u-blox.com/). UBX-13004618 - R04 Advance Information Related documents Page 139 of 141 TOBY-L2 and MPCI-L2 series - System Integration Manual Revision history Revision Date Name Status / Comments R01 R02 R03 R04 R05 20-Dec-2013 21-Mar-2014 sses sses 23-Jul-2014 sses Initial release for TOBY-L2 series Initial release including MPCI-L2 series UART and GPIOs remarked as not supported by TOBY-L2x0-00S Advance Information document status Updated MPCI-L2 descriptions Updated USB description and design-in, including VUSB_DET pin previously RSVD Updated MPCI-L2 thickness and installation guidelines Updated MPCI-L2 power-off procedure Updated MPCI-L2 pins 3, 5, 44, 46 definition: Not Connected instead of GPI/GPO Updated GPIOs definition and description Additional design-in examples, minor corrections and improvements 30-Sep-2014 lpah Updated FW version for Engineering Samples Additional design-in and minor corrections 17-Oct-2014 lpah Corrected MPCI-L2 pinout UBX-13004618 - R04 Advance Information Revision history Page 140 of 141 TOBY-L2 and MPCI-L2 series - System Integration Manual Contact For complete contact information visit us at http://www.u-blox.com/

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