FCC ID: SU5-MSR-RTWAVE MSR Radio Module

 

Advance Product Information April 27, 2005 2 Watt 802.11a Packaged Amplifier TGA2922-SG 4.9 - 6 GHz Application Frequency Range 11 dB Nominal Gain @ 8V 480mA 34 dBm Nominal P1dB @ 8V 480mA 2.5% EVM at 25dBm output power IMD3 -50dBc @ 22dBm SCL, Typical Bias Conditions: 7-9 V @ 480 mA (Quiescent) 0.5 m m HFET Technology 2 lead Cu base SMT package Key Features Primary Applications 802.11a WLAN Bridge Amplifiers U-NII Band HPA C-Band Pt-Pt and Pt-Multi Pt Radio Product Description The TGA2922-SG HPA provides 11dB of gain, 2 W of output power across 4.9 - 6 GHz and 2.5% EVM at 25 dBm output power. The device is ideally suited for high linearity, high power wireless data applications such as 802.11a WLAN Bridge Amplifiers, U-NII and Point-

to-Point or Point-to-Multi Point Non-

Line of Sight radios. The package has a high thermal conductivity copper base. Internal partial matching simplifies system board layout by requiring a minimum of external components. Lead-Free & RoHS compliant. Evaluation Boards are available. Fixtured Measured Performance Bias Conditions: Vd = 8 V, Idq =480 mA Performance data taken @ in a 5.75GHz application circuit 15 12 9 6 3 0

-3

-6

-9 Gain Input Output

-12 4 4.5 40 36 32 28 24 20 16 12 8 4 0 Pout IDS Gain

) B d

n a G i

) B d

n i a G

) m B d

t u o P 25 20 15 10 5 0

-5

-10

-15

-20

) B d

s s o L n r u t e R 5 5.5 6 Frequency (GHz) 6.5 7 800 700 600 500 400 300

) A m

S D I 9 11 13 15 17 19 21 23 25 27 29 31 Pin (dBm) Note: This device is early in the characterization process prior to finalizing all electrical specifications. Specifications are subject to change without notice. TriQuint Semiconductor Texas Phone: (972)994-8465 Fax: (972)994 8504 Email: info-mmw@tqs.com Web: www.triquint.com 1 Advance Product Information April 27, 2005 TGA2922-SG TABLE I MAXIMUM RATINGS 1/

Symbol Parameter Vd Vg Idq

| Ig |

PIN PD TCH TM TSTG Drain Supply Voltage Gate Supply Voltage Range Drain Supply Current (Quiescent) Gate Current Input Continuous Wave Power Power Dissipation Operating Channel Temperature Mounting Temperature (30 Seconds) Storage Temperature Notes 2/

2/

2/

2/, 3/

4/

Value 10 V 0 V to -5 V 1 A 19 mA 30 dBm 4.1 W 175 C 260 C

-65 to 150 C 1/

These ratings represent the maximum operable values for this device. Combinations of supply voltage, supply current, input power, and output power shall not exceed PD. 2/

3/ When operated at this bias condition with a base plate temperature of 85 C, the MTTF life is 2 E+8 hours. 4/ Junction operating temperature will directly affect the device median time to failure (TM). For maximum life, it is recommended that junction temperatures be maintained at the lowest possible levels. TriQuint Semiconductor Texas Phone: (972)994-8465 Fax: (972)994 8504 Email: info-mmw@tqs.com Web: www.triquint.com 2 Advance Product Information April 27, 2005 TGA2922-SG TABLE II RF CHARACTERIZATION TABLE

(TA = 25qC, Nominal)

(Vd = 8 V, Idq = 480 mA) SYMBOL PARAMETER Gain IRL ORL Small Signal Gain Input Return Loss Output Return Loss TEST CONDITION F = 5.75 GHz F = 5.75 GHz F = 5.75 GHz P1dB Output Power @ P1dB F = 5.75 GHz TYPICAL UNITS 11 7 7 34 dB dB dB dBm TABLE III THERMAL INFORMATION Parameter Test Conditions Rq JC Thermal Resistance

(channel to backside of package) Vd = 8 V ID = 480 mA (Quiescent) Pdiss = 3.8 W TCH

(oC) 168 RTJC

(qC/W) 22 TM

(HRS) 4 E+8 Note: Package backside SnPb soldered to carrier at 85 C baseplate temperature. At saturated output power, the DC power consumption is 5.8 W with 2 W RF power delivered to the load. Power dissipated is 3.8 W and the temperature rise in the channel is 84 C. TriQuint Semiconductor Texas Phone: (972)994-8465 Fax: (972)994 8504 Email: info-mmw@tqs.com Web: www.triquint.com 3 Advance Product Information April 27, 2005 TGA2922-SG Measured Fixtured Data Application Circuit tuned to 5.75 GHz

) B d

n i a G

) B d

n a G

i

) m B d

t u o P

) c B d

3 D M I

) B d

s s o L n r u t e R

) A m

S D I Bias Conditions: Vd = 7 V, Idq = 480 mA 15 12 9 6 3 0

-3

-6

-9 Gain Input Output

-12 4 4.5 40 36 32 28 24 20 16 12 8 4 0 Pout IDS Gain 5.5 5 6 Frequency (GHz) 6.5 7 25 20 15 10 5 0

-5

-10

-15

-20 800 700 600 500 400 300 9 11 13 15 17 19 21 23 25 27 29 31 Pin (dBm) 65 60 55 50 45 40 35 30 25 20 15 10 5.6GHz 5.7GHz 5.8GHz 5.9GHz 6.0GHz 16 18 20 22 24 26 28 30 Output Power per tone (dBm) TriQuint Semiconductor Texas Phone: (972)994-8465 Fax: (972)994 8504 Email: info-mmw@tqs.com Web: www.triquint.com 4 Advance Product Information April 27, 2005 TGA2922-SG Measured Fixtured Data Application Circuit tuned to 5.75 GHz Bias Conditions: Vd = 8 V, Idq = 480 mA 15 12 9 6 3 0

-3

-6

-9

) B d

n a G i Gain Input Output

-12 4 4.5 5 5.5 6 Frequency (GHz) 6.5 7 Pout IDS Gain 9 11 13 15 17 19 21 23 25 27 29 31 Pin (dBm)

) B d

s s o L n r u t e R

) A m

S D I 25 20 15 10 5 0

-5

-10

-15

-20 800 700 600 500 400 300 5.6GHz 5.7GHz 5.8GHz 5.9GHz 6.0GHz 16 18 20 22 24 26 28 30 Output Power per tone (dBm)

) B d

n i a G

) m B d

t u o P

) c B d

3 D M I 40 36 32 28 24 20 16 12 8 4 0 65 60 55 50 45 40 35 30 25 20 15 TriQuint Semiconductor Texas Phone: (972)994-8465 Fax: (972)994 8504 Email: info-mmw@tqs.com Web: www.triquint.com 5 Advance Product Information April 27, 2005 TGA2922-SG Measured Fixtured Data Application Circuit tuned to 5.75 GHz Bias Conditions: Vd = 8 V, Idq = 480 mA 15 12 9 6 3 0

-3

-6

-9 Gain Input Outpu t

) B d

n a G i

-12

) B d

n i a G

) m B d

t u o P 4 40 36 32 28 24 20 16 12 8 4 0 4.5 5 5.5 6 6.5 7 Frequency (GHz) Pout IDS Gain 9 11 13 15 17 19 21 23 25 27 29 31 Pin (dBm)

) B d

s s o L n r u t e R

) A m

S D I 25 20 15 10 5 0

-5

-10

-15

-20 800 700 600 500 400 300 65 60 55 50 45 40 35 30 25 20 15

) c B d

3 D M I 5.6GHz 5.7GHz 5.8GHz 5.9GHz 6.0GHz 16 18 20 22 24 26 28 30 Output Power per tone (dBm) TriQuint Semiconductor Texas Phone: (972)994-8465 Fax: (972)994 8504 Email: info-mmw@tqs.com Web: www.triquint.com 6 Advance Product Information April 27, 2005 TGA2922-SG Measured Fixtured Data Application Circuit tuned to 5.75 GHz Bias Conditions: Vd = 8 V, Idq = 480 mA OFDM 64 QAM 5.65 GHz 5.7 GHz 5.75 GHz 5.8 GHz 5.85 GHz

M V E 9 8 7 6 5 4 3 2 1 0 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 Output Power (dBm) TriQuint Semiconductor Texas Phone: (972)994-8465 Fax: (972)994 8504 Email: info-mmw@tqs.com Web: www.triquint.com 7 Advance Product Information April 27, 2005 TGA2922-SG S-Parameter Data Bias Conditions: Vd = 8V, Idq = 480 mA Frequency GHz S11 S21 S12 S22 Mag (dB) Deg Mag (dB) Deg Mag (dB) Deg Mag (dB) Deg 2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6 3.8 4 4.2 4.4 4.6 4.8 5 5.2 5.4 5.6 5.8 6 6.2 6.4 6.6 6.8 7 7.2 7.4 7.6 7.8 8 8.2 8.4 8.6 8.8 9

-1.064

-1.097

-1.121

-1.158

-1.148

-1.187

-1.256

-1.308

-1.319

-1.349

-1.367

-1.291

-1.299

-1.318

-1.192

-1.182

-1.235

-1.247

-1.312

-1.572

-2.144

-3.929

-16.53

-3.064

-0.629

-0.265

-0.219

-0.317

-1.162

-0.616

-0.392

-0.402

-0.367

-0.286

-0.23

-0.108 159.46 152.93 146.43 139.91 133.37 126.29 118.87 111.87 104.46 96.508 88.673 80.496 72.709 65.357 58.18 51.453 45.268 39.194 33.505 27.224 18.052 0.706

-70.915 107.16 77.321 65.853 59.846 56.083 54.327 60.535 60.121 61.336 64.333 68.382 73.502 79.406 8.711 7.986 7.341 6.781 6.261 5.795 5.41 5.055 4.757 4.499 4.273 4.131 3.994 3.845 3.784 3.838 3.87 4.068 4.469 5.407 7.048 9.007 11.343 8.577 2.49

-3.052

-8.546

-14.725

-15.078

-16.014

-22.085

-27.313

-32.49

-35.569

-32.658

-31.547 24.329 16.119 7.38

-0.744

-9.122

-17.347

-25.881

-34.21

-42.632

-51.255

-60.27

-69.363

-78.577

-88.02

-97.07

-106.89

-116.75

-127.04

-137.12

-147.36

-163.92 173.85 131.87 71.657 37.621 18.739 6.741 4.867 45.009

-9.842

-26.956

-38.375

-62.676

-110.66

-144.4

-167.6

-30.877

-30.802

-31.149

-31.068

-31.133

-31.547

-31.602

-30.933

-31.724

-30.792

-31.334

-31.513

-31.395

-31.303

-32.059

-31.656

-32.521

-32.507

-32.851

-32.677

-33.493

-36.037

-47.443

-34.576

-33.05

-33.513

-34.784

-35.404

-33.594

-31.155

-31.923

-32.698

-31.776

-31.509

-30.737

-29.564

-37.657

-40.661

-47.878

-51.566

-60.217

-62.038

-67.517

-72.012

-75.875

-84.39

-89.74

-97.338

-103.45

-107.77

-114.7

-120.07

-123.03

-131.7

-133.64

-145.33

-158.52

-172.13

-136.43

-106.6

-128.44

-143.12

-146.11

-151.89

-123.56

-155.16

-159.11

-159.63

-162.16

-164.23

-164.75

-168.44

-5.692

-5.391

-5.193

-5

-4.851

-4.653

-4.47

-4.386

-4.268

-4.26

-4.279

-4.206

-4.239

-4.261

-4.288

-4.515

-4.643

-4.746

-4.955

-5.109

-4.447

-4.587

-4.953

-4.3

-3.285

-2.722

-2.165

-1.72

-1.219

-0.837

-0.663

-0.497

-0.396

-0.278

-0.249

-0.325 164.69 161.15 157.74 154.45 150.4 146.75 143.06 140.23 136.38 132.8 128.97 124.8 120.77 116.11 110.84 105.45 99.838 94.391 88.582 84.622 82.265 75.642 73.309 78.064 76.841 75.552 75.642 76.43 78.725 79.245 81.487 83.83 86.319 88.199 89.022 88.608

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&TCKP 52CTCOGVGT 4GHGTGPEG2NCPG TriQuint Semiconductor Texas Phone: (972)994-8465 Fax: (972)994 8504 Email: info-mmw@tqs.com Web: www.triquint.com 8 Advance Product Information April 27, 2005 TGA2922-SG Packaged Dimensional Drawing TGA2922 - SG

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Top View Side View Bias Procedure 1. Ensure no RF power is applied to the device. 2. Pinch off device by setting Vg to 3V. 3. 4. 5. Apply RF power. Increase Vd to 8.0V while monitoring drain current. Increase Vg until drain current reaches 480 mA. GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should be observed during handling, assembly and test. TriQuint Semiconductor Texas Phone: (972)994-8465 Fax: (972)994 8504 Email: info-mmw@tqs.com Web: www.triquint.com 9 Advance Product Information April 27, 2005 TGA2922-SG 5.8 GHz Application Circuit Schematic PCB is 20 mil thick Rogers 4003 substrate. The schematic is for small signal approach only TriQuint Semiconductor Texas Phone: (972)994-8465 Fax: (972)994 8504 Email: info-mmw@tqs.com Web: www.triquint.com 10 Advance Product Information April 27, 2005 TGA2922-SG Typical Evaluation Board Layout *

VG VD C3 C2 C5 C6 INPUT OUTPUT C1 C4

*The layout is a general purpose drawing that needs to be tuned for the specific application. PCB is RO4003 20 mil thickness, 0.5 oz standard copper cladding, with Er = 3.38. External Component Listing Part Type Reference Description Capacitor Capacitor Capacitor Capacitor Capacitor Capacitor Resistor C1 C2 C3 C4 C5 C6 R1 AVX06035J3R9BBT, 3.9 pF AVX06035J1R2BBT, 1.2 pF 1uF AVX06035J3R9BBT, 3.9 pF 4.7 uF AVX06035J1R2BBT, 1.2 pF 0805, 10 W Contact TriQuint Applications Engineering for additional info TriQuint Semiconductor Texas Phone: (972)994-8465 Fax: (972)994 8504 Email: info-mmw@tqs.com Web: www.triquint.com 11 Advance Product Information April 27, 2005 TGA2922-SG Recommended Surface Mount Package Assembly Proper ESD precautions must be followed while handling packages. Clean the board with acetone. Rinse with alcohol. Allow the circuit to fully dry. TriQuint recommends using a conductive solder paste for attachment. Follow solder paste and reflow oven vendors recommendations when developing a solder reflow profile. Typical solder reflow profiles are listed in the table below. Hand soldering is not recommended. Solder paste can be applied using a stencil printer or dot placement. The volume of solder paste depends on PCB and component layout and should be well controlled to ensure consistent mechanical and electrical performance. Clean the assembly with alcohol. Typical Solder Reflow Profiles Reflow Profile Ramp-up Rate Activation Time and Temperature SnPb 3 C/sec Pb Free 3 C/sec 60 120 sec @ 140 160 C 60 180 sec @ 150 200 C Time above Melting Point 60 150 sec Max Peak Temperature Time within 5 C of Peak Temperature Ramp-down Rate 240 C 10 20 sec 4 6 C/sec 60 150 sec 260 C 10 20 sec 4 6 C/sec Ordering Information Part Package Style TGA2922-SG SMT Gull Wing (Formed Leads) TriQuint Semiconductor Texas Phone: (972)994-8465 Fax: (972)994 8504 Email: info-mmw@tqs.com Web: www.triquint.com 12

 

 

INSTALLATION MANUAL MSR RADIO MODULE FOR THE All Models Are Designed and Operate In A Point To-Point Configuration Only 1 FCC REGULATORY COMPLIANCE INTEGRATION AND USE INFORMATION INTEGRATION AND INSTALLATION REQUIREMENTS The MSR RADIO MODULE is designed exclusively for use in the VideoComm RTWave family of wireless video systems. The MSR RADIO MODULE will not function in any other system. However, there are certain criteria relative to integrating the radio into the RTWAVE system that must be considered to ensure continued compliance with FCC compliance requirements The MSR module was tested and certified to meet FCC Parts 15 in a stand-alone configuration. This demonstrates that the MSR module complies with Part 15 emission limits regardless of the system into which it may be installed. To simplify system integration of the same Radio Module into different systems and to help keep costs down on future systems using the same module, The MSR RADIO was FCC approved under the LIMITED MODULAR APPROVAL process for a radio transmitter. The Requirements as outlined in FCC Public Notice DA 00-131407 released June 26, 2000 are intended to afford relief to equipment manufacturers by eliminating the requirement for obtaining a new equipment authorization for the same transmitter when installed in a new device. This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instruction manual, may cause harmful interference to radio communications. Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to correct the interference at his own expense. VideoComm as the SYSTEM integrator of the module must follow all installation instructions and cautionary information necessary to comply with FCC RF exposure requirements. In order to use the MSR RADIO MODULE without additional FCC certification approvals, the installation must meet the following conditions. Otherwise, additional FCC approvals must be obtained. VideoComm specifies many SYSTEM models with different power levels and antenna gains. These are provided as part of this manual

(see included exhibits for FCC test results) System Labeling will match the specific system as it is assembled. INDUSTRY CANADA REGULATORY COMPLIANCE INTEGRATION AND USE INFORMATION INTEGRATION AND INSTALLATION REQUIREMENTS This device has been designed to operate with the antennas listed herein and having a maximum gain of 32dB. Antennas not included in the list herein or having a gain greater than 32dB are strictly prohibited for use with this device. The required antenna impedance is 50Ohms Operation is subject to the following two conditions:

(1)

(2) This device may not cause harmful interference, and This device must accept any interference, including interference that may cause undesired operation of the device To reduce potential radio interference to other users, the antenna type and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that permitted for successful communication 2 Fixed and mobile applications POINT ONLY. 1. See Tables for models specific to the FIXED and MOBILE applications, ALL SYSTEMS ARE POINT TO PEAK POWER 26.59 dBm 29.04 dBm ANTENNA GAIN 3dBi Ducky 3dBi Ducky SEPARATION DISTANCE 20cm (7.9 Inches) 20cm (7.9 Inches) This device has been designed to operate with the antennas listed below, and having a maximum gain of 32 dB. Antennas not included in this list or having a gain greater than 32 dB are strictly prohibited for use with this device. The required antenna impedance is 50 ohms OUTDOOR ALL WEATHER SYSTEMS ALL INSTALLED AS FIXED POINT TO POINT ONLY Rubber Duck Family 5.8 GHz SYSTEM MODEL AMPLIFIER NO RT-L1R5803 RT-X1R5803 YES Antennas Tested By TCB Panel Antenna Family 5.8 GHz SYSTEM MODEL AMPLIFIER NO RT-L1R5807 YES RT-X1R5807 NO RT-L1R5814 YES RT-X1R5814 NO RT-L1R5821 RT-X1R5821 YES Antennas Tested By TCB Parabolic Antenna Family 5.8 GHz SYSTEM MODEL AMPLIFIER NO RT-L1R5829 YES RT-X1R5829 NO RT-L1R5832 RT-X1R5832 YES Antennas Tested By TCB Rubber Duck ANTENNA FAMILY 2.4 GHZ SYSTEM MODEL AMPLIFIER RT-L2R2403 PANEL ANTENNA FAMILY 2.4 GHZ SYSTEM MODEL AMPLIFIER RT-WR2L245 Antennas Tested By TCB SEPARATION DISTANCE 20cm (7.9 Inches) 20cm (7.9 Inches) 30.19 cm (11.9 Inches) 40.03 cm (15.8 Inches) 67.59 cm (26.6 Inches) 89.62 cm (35.3 Inches) SEPARATION DISTANCE 169.79 cm (66.8 Inches) 225.11 cm (88.6 Inches) 239.83 cm (94.4 Inches) 317.98 cm (125.2 Inches) ANTENNA GAIN 7dBi Embedded 7dBi Embedded 14dBi Embedded 14 dBi Embedded 21 dBi External 21dBi Embedded PEAK POWER 26.59 dBm 29.04 dBm 26.59 dBm 29.04 dBm 26.59 dBm 29.04 dBm ANTENNA GAIN 29 dBi 29 dBi 32 dBi 32 dBi PEAK POWER 26.59 dBm 29.04 dBm 26.59 dBm 29.04 dBm SEPARATION DISTANCE 20cm (7.9 Inches) SEPARATION DISTANCE 34.71 cm (13.7 Inches) ANTENNA GAIN 3dBi Ducky ANTENNA GAIN 15 dBi PEAK POWER 26.80 dBm PEAK POWER 26.80 dBm NO NO RPS AMPLIFIER PEAK POWER INDOOR DESKTOP SYSTEMS POINT TO POINT ONLY INDOOR DESKTOP SYSTEMS 5.8 GHz MOBILE APPLICATIONS POINT TO POINT ONLY SYSTEM MODEL XRT-L1R583 XRT-L1R588 XRT-X1R583 INDOOR DESKTOP FAMILY 2.4 GHZ MOBILE APPLICATIONS POINT TO POINT ONLY SYSTEM MODEL XRT-L2R243 XRT-L2R248 YES YES

(RPS= Reverse polarity SMA Connector) 3 dBi Ducky 8 dBi Magnetic panel 3dBi Ducky 8 dBi Magnetic panel 3dBi Ducky PEAK POWER ANTENNA GAIN 26.59 dBm 26.59 dBm 29.04 dBm 26.80 dBm 26.80 dBm ANTENNA GAIN AMPLIFIER YES YES YES NO NO YES NO NO RPS 20cm (7.9 Inches) 20cm (7.9 Inches) 20cm (7.9 Inches) SEPARATION DISTANCE 20cm (7.9 Inches) 20cm (7.9 Inches) SEPARATION DISTANCE 3 2. 6. 7. If used with a desktop or other application where the antenna can be easily relocated to meet the 20 cm criteria, then this is considered a mobile application. If used in a "mobile" application where the antenna is normally separated at least 20 cm (7.9 in) from the human body during device operation, then an appropriate warning label must be placed on the host unit adjacent to the antenna. 3. The label will contain a statement such as the following:

WARNING RF exposure: Keep at least 20 cm

(7.9 in) separation distance from the antenna and the human body. 4. The MSR RADIO MODULE or associated SYSTEM will not be used as a portable device. 5. Host unit user manuals and other documentation must also include appropriate caution and warning statements and information. If the FCC ID for the MSR Radio is not visible when installed in the host platform, then a permanently attached or marked label must be displayed on the host unit referring to the enclosed radio. For example, the label should contain wording such as:

Contains MSR Radio transmitter module FCC ID: SU5-MSR-RTWAVE This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:

(1) This device may not cause harmful interference, and (2) This device must accept any interference received, including interference that may cause undesired operation 4 Or Contains FCC ID: SU5-MSR-RTWAVE This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:

(1) This device may not cause harmful interference, and (2) This device must accept any interference received, including interference that may cause undesired operation. 8. All supplied antennas have been tested to comply with FCC requirements 7. The transmitter and antenna must not be co-located or operating in conjunction with any other antenna or transmitter. Violation of this would allow a user to plug another transmitter in to the product and potentially create an RF exposure condition. WARNING The transmitter and antenna must not be colocated or operating in conjunction with any other antenna or transmitter. Failure to observe this warning could produce an RF exposure condition. 5 PROFESSIONAL INSTALLATION The MSR RADIO MODULE will be installed into its system only by VideoComm. The system once assembled will be knows as an RT Wave (family of products) The RTWAVE wireless system is designed and marketed for professional installation. This is ensured by VideoComm through the very nature of its marketing strategies and distribution network. All of VideoComms marketing and sales are directed to the professionals within the many industries we supply. These include Law enforcement, Government, Military, Industry, Manufacturing, Education and Industrial to name a few. VideoComm sells its products to Master Distributors and Dealers only. These dealers and distributors sell only to industry professionals who have experience in the installation of products like those manufactured by VideoComm. VideoComms distributors do not sell to the general public. These distributors are generally trade only. Please contact us if you have any additional questions. Best Regards Jeff Johnson President VideoComm Technologies 6 MSR MODULE INSTALLATION INSTRUCTIONS The MSR radio will be packaged in a pink anti-static plastic bag. It is critical that it only be opened at an ESD safe work station and the technician be properly instructed on how to handle ESD devices and be grounded with an approved tested wrist strap. The Module will be accompanied by a MASTER BUILD SHEET when removed from inventory and given to a technician for assembly into a SYSTEM. The Radio MODULE will be marked externally with its SERIAL number and this number must be copied to the master build sheet for the system. Additional Serial number labels will also accompany the MODULE to be attached to the outside of the SYSTEM enclosure. As the technician installing the module you must clearly indicate on the build sheet your ID number for QC purposes. The radio will be packaged with the following accessories to complete the installation. (This may vary with SYSTEM model being assembled, see BUILD SHEET) 1. Any necessary U_FL (IPEX)-SMA shielded jumper cables (depending on the SYSTEM model). 2. 1 piece of (foam center) 2 sided mounting tape to help secure the module within the MINI PCI connector. 3. 1 set of FCC labels to be installed on the approved MODULE. 4. 1 set of FCC labels to be installed on the outside of the finished SYSTEM. 5. 1 amplifier assembly (depending on SYSTEM model). 6. Antenna or antennas configured for the SYSTEM on the build sheet. 7. 6 tie wraps to secure wiring. 7 Installation is as follows:

1. First attach the 2 sided foam tape within the marked area on the PCB shown on the master build sheet. Trial fit the radio module on the PCB and ensure it locks in place. (Adjust the PCI fingers to ensure a good fit if needed). Release the Radio and peel off the 2nd protective layer of the 2 sided tape and install the RADIO MODULE (press to make good contact with the tape). 2. Attach the U_FL (IPEX) jumper cables to the module (follow the build sheet) using the special U_FL (IPEX) installation tool. Attach the other end to where the build sheet indicates (amplifier, antenna or antennas). Follow wiring diagram very carefully. 3. Confirm all cables are connected as indicated on your build sheet. 4. Attach the MAIN SYSTEM PCB (with the module installed) on the metal mounting plate (be careful not to get any wires caught on the mounting studs. Put in the 3 pieces of 4-40 screws. Tighten with torque set screwdriver until it clicks. 5. Route the antenna wires to their appropriate place indicated on the build sheet. Secure with Tie Wraps 6. (if build sheet indicates amplifier) the amplifier comes attached to a heatsink with its power supply attached but not connected. Attach wires as indicated in the diagram. (see attached exhibits) 7. Route power wires from main PCB to the mounting plate connections. Secure any loose wiring with Tie Wraps. 8. Install any RCA cable jumpers from the main PCB to the mounting plate. Secure any loose wires with Tie Wraps. 9. Confirm all wiring is connected as described on the build sheet and there is no loose wiring. 10. Initial to confirm all wiring steps. 11. Install the mounting plate with attached PCB and module into the enclosure. Secure with 3 screws and ensure they are snug only. Dont over tighten or you will strip the plastic threads. 12. Pass the system to the test bench. 8 9 10 11 TEST BENCH PROCEDURES Test bench will complete the following tests. Based on the model on the build sheet, the tests will involve RSSI visual test with the system in link ready mode. Both MASTER server/client will be connected to the setup computer to load software MAC and configure the HARDCODED SSID number and WEP CODE. (USER cannot change codes) SSID and WEP are created by the software using a date code algorithm that will essentially never be repeated. Check build sheet in case customer ordered 128 BIT WEP. If yes, check the code book for next unused code. NOTE: Systems with amplifier. The external heat sink is NOT attached at this point; DO NOT leave the system running for more than 5 minutes during software loading or damage to the amplifier may occur. 1. Attach antenna cable (cables) to antenna (antennas). (critical if amplifier is installed) 2. Connect 1 channel of the LAB power supply set at 9 VDC to server (dont turn on) connect the second channel also set at 9VDC to the client. (dont turn on yet) 3. Attach an RS232 cable with adapter to the client and server motherboards as indicated on the setup photograph. 4. Make sure the computer is running and that 2 copies of Comdebugger software are loaded. One set to COM 7 and the other to COM 8 5. Turn on the Lab Power Supply, verify the current draw meets minimum and maximum requirements for the system being tested. 6. Test Technician must load the correct MAC configured for the system as indicated on the build sheet.

(Incorrect software may damage the amplifier or other components). 7. After the COM software provides confirmation of a successful software load, turn off the Lab Power supply. 8. The technician must complete the following QC tests. 9. Confirm power supply is off. 10. Connect client PCB to the video monitor. 11. Connect server PCB to video source. 12 NOTE: Systems with amplifier. The external heat sink is NOT attached at this point; DO NOT leave the system running for more than 5 minutes during system testing or damage to the amplifier may occur. 12. Turn on the server and client power supplies and verify a link is established. 13. Observe the video latency, link rate and current consumption of each system; observe the quality of the video picture. Note your findings on the build sheet. 14. Turn off the 2 systems and disconnect the power supplies 15. Recheck all connections and confirm all loose wires are secure, all connectors (Power and RF) are snug. Note any errors on the build sheet. 16. For the Omni Antenna versions (Rubber Duck), leave the antennas loose to be packed in the box. For IP

(internal Patch) antennas, secure the antenna to the internal mounting plate making sure the screws are secure and SMA connectors are securely attached to its mating cable or amplifier (as per the build sheet). 17. Close the top of the enclosure and attach all necessary identification labels as indicated. Attach the FCC labels as indicated on the back of the enclosure (See Below). 18. Wrap the front face of the enclosure with low tack protective sticky plastic. 19. Pass the system (PAIR) and any accessories to the packaging department with the serial number labels to be placed on the outside of the box and hand in the build sheet. 20. FCC & IC Label for Exterior Placement VideoComm Technologies Model: MSR RT-WAVE Contains FCC ID: SU5-MSR-RTWAVE Contains IC: 3667A- MSR-RTWAVE 13

 

 

MSR RADIO External Amplifier The Amplifier portion of the EUT has the following Specifications:

IC module is manufactured by Triquint Semiconductor. Description:

The TGA2922-SG HPA provides 11dB of gain, 2 W of output power across 4.9 -

6 GHz and 2.5% EVM at 25 dBm output power. The device is ideally suited for high linearity, high power wireless data applications such as 802.11a WLAN Bridge Amplifiers, U-NII and Point to-Point or Point-to-Multi Point Non-

Line of Sight radios. 4.9-6.0 GHz frequency range 11 db Gain (Nominal) (@8V 480 ma) 34 dbm nominal P1dB @ 8V 480 ma Bias Conditions 7-9 VDC @ 480 mA (Quiescent) Primary applications:

802.11a WLAN bridge amplifier U-NII Band HPA The amplifier power supply included with the system as tested with the EUT is included and manufactured by VideoComm. The Amplifier tested with the EUT is manufactured by VideoComm. 1 MSR RADIO External Amplifier Installation Instructions Follow installation of the main RTWAVE system with the following additions:

1. Install the heat sink plate assembly to the enclosure. Install heat sink to mounting plate on the outside the enclosure. 2. Attach the power supply to the inside mounting plate. 3. Attach the Amplifier PCB to the inside mounting plate. 4. Connect the MSR radio transmitter output to the Amplifier input connector using the supplied SMA connectors 5. Connect the Amplifier output connector to the transmitter antenna using the correct cable to match the included antenna. 6. Connect the receiver 7. Connect the power supply to the amplifier PCB (solder the connections) 8. Route the wires for the power supplies to the Amplifier power supply and System PCBs. Connect the wires. 9. Attach the antenna (internal model or rubber ducks) (external or parabolic need not be connected 10. Send to test bench for software load, testing and conformity checks. Adjust as necessary. 11. Apply necessary labels to the system. 12. Send to shipping for packaging. 2