IMS2 module user manual Project Name: IMS2 Author: Wistron NeWeb Corporation Revision: 1.1 Revision Date: 2017/09/13 Normal Internal Use Confidential Restricted Confidential 1 / 26 Product datasheet Contact Information Technical Support Website Company Website https://SupportIoT.wnc.com.tw www.wnc.com.tw Revision History Rev. #
Author Summary of Changes 1.0 1.1 WNC WNC First release Add FCC statement and manual information to the end user in the user manual Date 2017/07/14 2017/09/13 Normal Internal Use Confidential Restricted Confidential 2 / 29 Product datasheet Wistron NeWeb Corporation THIS DOCUMENT AND THE INFORMATION CONTAINED HEREIN IS PROPRIETARY AND IS THE EXCLUSIVE PROPERTY OF WNC AND SHALL NOT BE DISTRIBUTED, REPRODUCED, OR DISCLOSED IN WHOLE OR IN PART WITHOUT PRIOR WRITTEN PERMISSION FROM WNC. LIMITATION OF LIABILITY THIS DOCUMENT AND THE INFORMATION CONTAINED HEREIN IS PURELY FOR DESIGN REFERENCE AND SUBJECT TO REVISION BY WNC AT ANY TIME. NOTHING IN THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY WARRANTY OR RIGHT TO USE THE MATERIAL CONTAINED HEREIN WITHOUT WNCS PRIOR EXPRESS WRITTEN CONSENT. WNC SHALL NOT BE LIABLE FOR ANY USE, APPLICATION OR DEVELOPMENT DERIVED FROM THE MATERIAL WITHOUT SUCH PRIOR EXPRESS WRITTEN CONSENT. FCC Statement Please notice that if the FCC identification number is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. This exterior label can use wording such as the following: Contains FCC ID:NKRIMS2. Any similar wording that expresses the same meaning may be used. Manual Information to the End User The module is limited to OEM installation ONLY. The OEM integrator is responsible for ensuring that the end-user has no manual instruction to remove or install module. The module is limited to installation in mobile application; a separate approval is required for all other operating configurations, including portable configurations with respect to Part 2.1093 and difference antenna configurations. This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with a minimum distance of 20cm between the radiator & your body. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. Normal Internal Use Confidential Restricted Confidential 3 / 29 Contents Product datasheet 3 2 Contact Information .......................................................................................................................... 2 Revision History ............................................................................................................................... 2 Product Features ...................................................................................................................... 6 1 1.1 Features Description ........................................................................................................... 6 Pin Definitions ......................................................................................................................... 8 2.1 LGA Module Pin Diagram .................................................................................................. 8 2.2 LGA Module Pin Definitions .............................................................................................. 8 Electrical Specifications ......................................................................................................... 12 3.1 Electrical Operating Conditions ........................................................................................ 12 3.1.1 Detailed Information .............................................................................................. 12 3.1.2 Power Tree ............................................................................................................. 12 3.2 Control Interfaces .............................................................................................................. 13 3.2.1 Power-on Signal (TBD) ......................................................................................... 13 3.2.2 Wake-up Interface (TBD) ...................................................................................... 13 3.2.3 Reset Signal ............................................................................................................ 14 3.3 UART Interface ................................................................................................................. 14 3.4 UIM Interface .................................................................................................................... 15 3.5 I/O Characteristics ............................................................................................................. 15 3.6 JTAG Interface .................................................................................................................. 17 3.7 Power Consumption .......................................................................................................... 17 3.8 RF Performance ................................................................................................................ 18 3.8.1 RF Pad Design ....................................................................................................... 18 3.8.2 RF Matching Guide ................................................................................................ 21 3.8.3 Interference and Sensitivity .................................................................................... 21 3.8.4 Band Support .......................................................................................................... 22 3.8.5 Bandwidth Support................................................................................................. 22 3.8.6 RF Transmission Specifications ............................................................................. 22 3.8.7 RF Receiver Specifications .................................................................................... 23 3.9 Temperature ...................................................................................................................... 23 3.10 LTE Power Saving Mode ................................................................................................ 23 3.11 Serial Number and IMEI ................................................................................................. 23 4 Mechanical Information ......................................................................................................... 25 4.1 Physical Dimensions ......................................................................................................... 25 4.2 Pin Dimensions ................................................................................................................. 25 4.3 Marking Information ......................................................................................................... 27 Packing Information............................................................................................................... 28 5.1 Packing Information .......................................................................................................... 28 5.2 Storage Conditions ............................................................................................................ 28 PCB Mounting Guidelines ..................................................................................................... 28 6.1 Mounting Considerations .................................................................................................. 28 Regulatory and Industry Approval ......................................................................................... 28 7.1 Certification Testing ......................................................................................................... 28 5 6 7 Normal Internal Use Confidential Restricted Confidential 4 / 29 7.2 GP Compliance ................................................................................................................. 28 Initialisms ........................................................................................................................................ 29 Product datasheet Normal Internal Use Confidential Restricted Confidential 5 / 29 1 Product Features 1.1 Features Description The WNC IMS2 module includes the Sequans SQN3330 Cat. M1 baseband, a complete three LTE band (2/4/12) RF front-end, memory, and required circuitry to fulfill 3GPP E-UTRA (Long Term Evolution - LTE, Release 13 specifications) and AT&T Wireless LTE Cat. M1 UE specifications. The architecture block diagram of the IMS2 is presented in Figure 1-1 below. Figure 1-1. IMS2 block diagram General interfaces Supported frequency bands Table 1-1. General features of the IMS2 JTAG USIM GPIO UART LTE Band 2 LTE Band 4 LTE Band 12 VCC (range from 3.3 V to 4.2 V) LGA module 104 pads (21.5 mm 16.5 mm 2.3 mm) RoHS compliant 3GPP compliant: 20 C to +60 C (ambient) Operational: 40 C to +85 C (functional) Operating temperature Operating voltage Packaging Normal Internal Use Confidential Restricted Confidential 6 / 26 Product datasheet Table 1-2. LTE-related features of the IMS2 Standards compliance 3GPP E-UTRA Release 13 One UL and one DL transceiver Supports HD-FDD Duplexing Category M1 UE Normal cyclic prefix Supports MPDCCH Modulation
- DL: QPSK, 16QAM
- UL: QPSK, 16QAM All coding schemes corresponding to modulations All channel coding (turbo-coding with inter-leaver, tail biting convolutional coding, block and repetition coding) and CRC lengths All power control schemes and DL power allocation schemes UEPCOP (from 3GPP Release 12) Power Saving Mode Random access procedure in normal sub-frames Scheduling request, buffer status reporting, and power headroom reporting Discontinuous reception (DRX, eDRX) with long and short cycles Fast scanning IPv4, IPv6 ARQ modes: UM, AM, and TM Ciphering and deciphering: NULL, AES, SNOW 3G Integrity and protection: AES, SNOW 3G MIB and new SIB1bis Supports up to eight data radio bearers NAS SMS over SG LWM2M client PHY MAC RLC PDCP RRC NAS and above Normal Internal Use Confidential Restricted Confidential 7 / 29 Product datasheet 2 Pin Definitions 2.1 LGA Module Pin Diagram The IMS2 LGA module pin layout is illustrated below. Figure 2-1. IMS2 LGA module pin layout 2.2 LGA Module Pin Definitions The signals and all the related details are listed in the below table. Table 2-1. IMS2 module pin definition Pin No. Name 7 8 9 10 11 12 13 14 GND GND NC GND GND GND GND GND Description Ground Ground Not connected Ground Ground Ground Ground Ground Normal Internal Use Confidential Restricted Confidential 8 / 29 Product datasheet 15 Main antenna 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 80 81 82 83 84 85 GND GND GND GND GND NC GND GND GND GND GND NC GND GND GND Power Power Power Power Power Power NC GND GND GPIO46 GPIO47 GPIO48 GPIO49 GND GND GPIO01 GPIO02 UART1_CTS UART1_RTS UART1_Rx UART1_Tx GND GND Main antenna port Ground Ground Ground Ground Ground Not connected Ground Ground Ground Ground Ground Not connected Ground Ground Ground Power Power Power Power Power Power Not connected Ground Ground General purpose input/output General purpose input/output General purpose input/output General purpose input/output Ground Ground General purpose input/output General purpose input/output Clear to send for UART 1 Request to send for UART 1 Receive for UART 1 Transmit for UART 1 Ground Ground Normal Internal Use Confidential Restricted Confidential 9 / 29 Product datasheet 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 NC NC NC GND GND GND UART0_CTS UART0_TX UART2_TX UART0_RX UART2_RX UART0_RTS UART2_RTS UART2_CTS FFF/FFH mode switch RFDATA5 RFDATA6 RFDATA7 ADC ADC Not connected Not connected Not connected Ground Ground Ground Clear to send for UART 0 Transmit for UART 0 Transmit for UART 2 Receive for UART 0 Receive for UART 2 Request to send for UART 0 Request to send for UART 2 Clear to send for UART 2 FFF/FFH mode switch; FFF is normal mode; FFH is for design mode. RF control interface RF control interface RF control interface Analog-to-digital converter Analog-to-digital converter General purpose input/output SIM card power SIM card data line SIM card clock line SIM card reset line SIM card detect line Not connected Ground Ground 101 102 103 130 131 132 GPIO08 133 UIM_VCC 134 UIM DATA 135 UIM CLK 136 UIM RESET 137 UIM DETECT 138 NC 139 GND 140 GND 141 WWAN_STATE Wireless WAN radio state 142 143 WAKEUP_OUT 144 WAKEUP_IN 145 146 201 202 203 RESET VREF JTAG TCK JTAG TDI JTAG TDO Power on the module Module wakes up host. Host wakes up module. Main reset line Reference logic voltage (1.8 V voltage) JTAG TCK JTAG TDI JTAG TDO Power on Normal Internal Use Confidential Restricted Confidential 10 / 29 Product datasheet JTAG_TMS JTAG_SRST_N 204 205 206 NC 208 GND 209 GND 210 GND 211 GND 212 GND 213 GND 214 GND 215 GND 216 GND 217 GND 218 GND 219 GND 220 GND 221 GND 222 GND 223 GND JTAG_TMS JTAG_SRST_N Not connected Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Ground Normal Internal Use Confidential Restricted Confidential 11 / 29 Product datasheet 3 Electrical Specifications 3.1 Electrical Operating Conditions 3.1.1 Detailed Information Table 3-1. Electrical operating conditions for the IMS2. VCC IMS2 includes an integrated Power Manager enabling single and direct voltage supply from the battery and reducing the overall bill of materials. Direction Minimum Typical Maximum 4.2 V 3.3 V 3.8 V In Layout Suggestion: Each power trace should possess sufficient line width to withstand its respective current listed in Table 3-2 below. Table 3-2. Power supply reference currency Net Name VCC(16) total UIM_VCC VREF Current Value TBD TBD TBD Note: Routing under a 1 A design is desired as it will result in more stable power. 3.1.2 Power Tree Figure 3-1 provides a representation of the power tree of the IMS2 LGA module Figure 3-1. IMS2 power tree Normal Internal Use Confidential Restricted Confidential 12 / 29 Product datasheet 3.2 Control Interfaces This section describes the power-on/off, wake-up, and reset interface for controlling the module. 3.2.1 Power-on Signal (TBD) The POWER_ON signal is an active low input signal used to enable or disable the module. Do not toggle the PERST# pin during power-on. This signal has the highest priority among the wakeup, the alarm signal, and the digital control pins. There are three possible states of the module:
Module Off: VCC is not present. Module Enabled: VCC is supplied, and the module is enabled. Module Disabled: VCC is supplied, and the module is disabled. The state transitions are defined as follows:
When voltage is applied to VCC, the module shall enter the Module Disabled state. An input to the POWER_ON pin shall trigger the transition from the Module Disabled to the Module Enabled state. See Figure 6; a low pulse (tlow > 0s) on the POWER_ON pad will enable the module after VCC is applied. 3.2.2 Wake-up Interface (TBD) In applications where power consumption is a major factor in performance metrics
(such as battery-operated sensors that are based on an IOT/M2M modem solution and also include a third-party host), definitions are necessary for a simple interface that will enable both the modem and the host to enter low-power states whenever possible and the other side to wake it up once required. For example, if the host has no data to transmit or any other tasks, it may enter a low-power state according to its own capabilities and configurations. If during that period the host is in a low-power state and the modem suddenly receives data, it must wake-up the host. A similar requirement exists in the reverse case. For example, if the modem is in a low-power state and suddenly the host must transmit data, it must be able to wake-
up the modem. The interface consists of two signals: One is triggered by the host and received by the modem; the other is triggered by the modem and received by the host. Each side can wake the other by toggling a wakeup signal high and enabling the Normal Internal Use Confidential Restricted Confidential 13 / 29 other side to activate sleep mode when not needed by toggling it low. Product datasheet WAKEUP_IN (Host: Output, Modem: Input):
LOW: SoC does not require the MODEM (allowing it to sleep). HIGH: SoC requires the MODEM or acknowledges it is ready following a wakeup request from the MODEM. WAKEUP_OUT (Host: Input, Modem: Output):
LOW: The MODEM does not require the Host (allowing it to sleep). HIGH: The MODEM requires the Host or acknowledges it is ready following a wakeup request from the SoC. When the IMS2 module functions as a modem, keep WAKEUP_IN high before the system boot process is complete. After the system boot, maintain WAKEUP_IN in a low state. The WAKEUP_IN and WAKEUP_OUT operation in host mode will be discussed according to product specifications. 3.2.3 Reset Signal The Reset Signal is a hardware reset signal to control the system reset directly. The user can connect it to a key or a control signal. A low pulse after power on will reset the module. 3.3 UART Interface There are three UART interfaces; these interfaces are 4 bit for high-speed data transfer, and the UART definitions of IMS2 are shown in Figure 3-2. 1. UART0 for data 2. UART1 for debugging the DM tool and software upgrade 3. UART2 for the console Figure 3-2. UART connection (example) Normal Internal Use Confidential Restricted Confidential 14 / 29 Product datasheet 3.4 UIM Interface IMS2 modules provide a UIM_DETECT input pin for UIM connectors to detect a UIM card. When a UIM card is present, UIM_DETECT should be high (1.8 V). If the UIM card is absent, UIM_DETECT should be low. This is required to pull UIM_DETECT to VREF with a 470 k resistor. A 0.1 F and a 33 pF capacitor are recommended to place between UIM_VCC and Ground in parallel. We recommend placing a 33 pF capacitor between UIM_RESET, UIM_CLK, and UIM_DATA and Ground in parallel.
(Refer to Figure 5.) An electrostatic discharge (ESD) protection circuit is also recommended to place near the UIM socket as close as possible, and the Ground pin of the ESD protection component must be well connected to the Ground plane. The following figure configuration is active high. illustrates an example UIM card circuit. The default Figure 3-3. Example UIM card circuit 3.5 I/O Characteristics The voltage and current characteristics of the various IO pads of the IMS2 versus IO bank supply voltage are illustrated in Table 3-3 below. Table 3-3. DC characteristics for digital IOs, voltage 1.8 V - BIDIR and IN types Parameter VIL Input low voltage VIH Input high voltage Drive Strength Min. Nom. Max. Unit VSS 0.7 PVDD_1V8 0.3 PVDD_1V8 PVDD_1V8 V V Normal Internal Use Confidential Restricted Confidential 15 / 29 VOL Output low voltage VOH Output high voltage IRPU Input pull-up resistor current RPU Input pull-up resistance IRPD Input pull-down resistor current RPD Input pull-down resistance VH Input hysteresis IPAD Input leakage current, non-
tolerant IOZ Off-state leakage current IOL Sink current at VOL (max) IOH Source current at VOH (max) Product datasheet VSS 0.2 PVDD_1V8 V 0.8 PVDD_1V8 PVDD_1V8 V 15 15 A 32.4 k A 32.4 0.1 PVDD_1V8 2 mA 4 mA 8 mA 12 mA 2 mA 4 mA 8 mA 12 mA 1 1.11 2.25 4.48 6.72 1.1 2.2 4.4 1 1 6
. 6 k V A A mA mA mA mA mA mA mA m A Normal Internal Use Confidential Restricted Confidential 16 / 29 3.6 JTAG Interface Product datasheet The IMS2 series contains one JTAG interface; leave JTAG pins floating if they are not used. Figure 3-4. JTAG schematic 3.7 Power Consumption This section describes the typical power consumption of the IMS2 (for reference). Table 3-4. LTE power consumption Working Mode Airplane mode Conditions Result Only the module; no other devices Power saving mode TBD TBD TBD LTE Band2 working mode TBD LTE Band4 working mode TBD LTE Band12 working mode TBD Powering on Conditions Peak power consumption Power consumption peak when the module is powering on TBD TBD TBD TBD TBD TBD TBD Result TBD Normal Internal Use Confidential Restricted Confidential 17 / 29 Power off Conditions Power off consumption The module is powered off. 3.8 RF Performance Product datasheet Result TBD Each IMS2 module has only one RF pad; developers must connect it via 50 traces to the main board. Main antenna pad (Pin15) Primary RX/TX path 3.8.1 RF Pad Design We recommended that a ground not be present under the surface of the RF pads in the layout. Details are included below. Layer2 has the same exclusion area as Layer1. Figure 3-5. Sample RF pad layout Normal Internal Use Confidential Restricted Confidential 18 / 29 The RF trace between RF pads and antenna should as shorter as possible with 50ohm characteristic impedance. The characteristic impedance depends on the dielectric of PCB, the track width and the ground plane spacing. Microstrip type is required. The detail simulation as below. Product datasheet Normal Internal Use Confidential Restricted Confidential 19 / 29 Product datasheet The antenna should be 50ohm characteristic impedance with the return loss of better than -10dB at the operation band. The antenna gain would affect the radiated power and regulator test result. Normal Internal Use Confidential Restricted Confidential 20 / 29 3.8.2 RF Matching Guide Product datasheet Figure 3-6. RF matching guide 3.8.3 Interference and Sensitivity This section includes tips to help developers identify interferences that may affect the IMS2 module when used in systems. Interference from other wireless devices Harmonics, inter-modulated signals generated from wireless devices within the RX ranges of the modules may result in degraded RX performance. We highly recommend checking the RX performance of entire systems within the shielding environment. Interference from the host interface High-speed signal-switching elements in systems can easily couple noise into the module (ex.: DDR memory, LCD modules, DC-DC converters, PCM signals). Methods to avoid sources of interference Antenna location is important; we recommend directing the antenna away from high-speed switching signals. Furthermore, the trace from the module to the antenna should be as short as possible and must be shielded by complete grounding. The IMS2 module is well shielded; high-speed elements (Ex.: DDR memory, LCD modules, DC-to-DC converters, PCM signals) on a system should have shielding reserved during the early stages of development. Normal Internal Use Confidential Restricted Confidential 21 / 29 IMS2 modulePrimary AntennaPin15 RF_1Antenna matchingRF connector1. Reserve the matching circuit as depicted in the topological structure below.2. The matching circuit should be as close to the module as possible.The impedance (S11) should be close to 50 , VSWR < 1.5. Product datasheet Uplink (MHz) Downlink (MHz) 1,8501,910 1,7101,755 699716 1,9301,990 2,1102,155 729746 3.8.4 Band Support Table 3-5. Band support Band LTE Band 2 LTE Band 4 LTE Band 12 3.8.5 Bandwidth Support Table 3-6. Bandwidth support Band LTE Band 2 LTE Band 4 LTE Band 12 Bandwidth 1.4 MHz 3 MHz 5 MHz 10 MHz 15 MHz 20 MHz
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Note: The IMS2 supports 1.4 MHz and 3 MHz (not default settings). 3.8.6 RF Transmission Specifications Table 3-7. Conductive Tx output power Band Items Parameter Unit Min. Typ. Max. LTE Band 2 Max. TX Power 20 MHz 1 RBs/QPSK dBm 20.3 LTE Band 4 Max. TX Power 20 MHz 1 RBs/QPSK dBm 20.3 LTE Band 12 Max. TX Power 10 MHz 1 RBs/QPSK dBm 20.3 23 23 23 25.7 25.7 25.7 Notes: 1.The RF transmission specification is defined at the LGA pad. 2. IMS2 fulfills 3GPP test standards. Normal Internal Use Confidential Restricted Confidential 22 / 29 3.8.7 RF Receiver Specifications Table 3-7. Conductive Rx sensitivity-3GPP Band Items Parameter Product datasheet Unit Min. Typ. Max. 99.5 d B m 101.5 98.5 L T E B a n d 2 5 M Hz wit h 4 RB s R X S e n s i t i v i t y LTE Band 4 RX Sensitivity 5 MHz with 4 RBs LTE Band 12 RX Sensitivity 5 MHz with 4 RBs dBm dBm Notes: 1. The RF receiver specification is defined at the LGA pad. 2. IMS2 fulfills 3GPP test standards. 3.9 Temperature 3GPP compliance: 20 C to +60 C (ambient) Functional: 40 C to +85 C Storage: 40 C to +85 C 3.10 LTE Power Saving Mode Note: Details will be provided in a future revision of this document. 3.11 Serial Number and IMEI Serial number and IMEI data can be written to the module only once; these two data Normal Internal Use Confidential Restricted Confidential 23 / 29 Product datasheet points cannot be rewritten on the SQN3330 platform. Normal Internal Use Confidential Restricted Confidential 24 / 29 4 Mechanical Information Product datasheet 4.1 Physical Dimensions Device dimensions illustrated in Figure 4-1 and Figure 4-2 below. Figure 4-1. Top view Figure 4-2. Right view 4.2 Pin Dimensions The dimensions are illustrated in Figure 4-3, Figure 4-4, and Figure 4-5 below. Figure 4-3. PIN dimensions (bottom view) Normal Internal Use Confidential Restricted Confidential 25 / 29 Product datasheet Figure 4-4. PIN dimensions Figure 4-5. PIN dimensions Normal Internal Use Confidential Restricted Confidential 26 / 29 Product datasheet 4.3 Marking Information Note: Details will be provided in a future version of this document. Normal Internal Use Confidential Restricted Confidential 27 / 29 Product datasheet 5 Packing Information 5.1 Packing Information The module is delivered in tape-and-reel based on MPQ. Note: Module packing details will be provided in a future revision of this document. 5.2 Storage Conditions Note: Details will be provided in a future revision of this document. 6 PCB Mounting Guidelines 6.1 Mounting Considerations This section details the recommended reflow profile when the module is mounted onto other boards. Note: Details will be provided in a future revision of this document. 7 Regulatory and Industry Approval 7.1 Certification Testing PTCRB, FCC, and AT&T TA 7.2 GP Compliance RoHS (2011/65/EU) Normal Internal Use Confidential Restricted Confidential 28 / 29 Product datasheet Initialisms Initialisms and Definitions Initialism AC DC ETSI GND GPIO I/O IoT I2C LGA LTE N/A OS PIN SIM SPI UART UIM USB Vref WNC Definition Alternating Current Direct Current European Telecommunications Standards Institute Ground General Purpose Input Output Input/Output Internet of Things Inter-Integrated Circuit Land Grid Array Long Term Evolution Not/Applicable Operating System Personal Identification Number Subscriber Identity Module Serial Peripheral Interface Universal Asynchronous Receiver-Transmitter User Identity Module Universal Serial Bus Voltage reference Wistron NeWeb Corporation Normal Internal Use Confidential Restricted Confidential 29 / 29