Product specification UMC-6055QV User Guide Wistron NeWeb Corp. CONFIDENTIAL THIS DOCUMENT CONTAINS PROPRIETARY TECHNICAL INFORMATION, WHICH IS THE PROPERTY OF THE WISTRON NEWEB CORPORATION AND SHALL NOT BE DISCLOSED TO OTHERS IN WHOLE OR IN PART, REPRODUCED, COPIED, OR USED AS THE BASIS FOR DESIGN, MANUFACTURING, OR SALE OF APPARATUS WITHOUT WRITTEN PERMISSION OF WISTRON NEWEB CORPORATION. 1 Product specification CONTENTS 2. 3. 3.1.1 CONTENTS .......................................................................................................................................................................... 2 INTRODUCTION ...................................................................................................................................................... 3 1. PRODUCT CONCEPT ........................................................................................................................................ 3 1.1 STANDARDS ....................................................................................................................................................... 3 1.2 TERMS AND ABBREVIATION ......................................................................................................................... 4 1.3 1.4 CONVENTIONS ................................................................................................................................................... 4 PRODUCT FEATURES OVERVIEW ............................................................................................................... 4 1.5 BLOCK DIAGRAM & PIN ASSIGNMENT ........................................................................................................... 7 RF AIR INTERFACES AND PERFORMANCE ................................................................................................ 14 3.1 RF AIR INTERFACE AND BAND CONFIGURATION ................................................................................ 14 Air interfaces ............................................................................................................................................. 14 3.2 RF PERFORMANCE ......................................................................................................................................... 14 TRANSMITTER POWER CLASS ................................................................................................................... 14 3.3 OPERATING CONDITIONS ................................................................................................................................ 15 4.1 ABSOLUTE MAXIMUM RATINGS ................................................................................................................. 15 4.2 RECOMMENDED OPERATING CONDITION .............................................................................................. 16 CURRENT CONSUMPTION ................................................................................................................................ 17 APPLCATION DESIGN NOTES ......................................................................................................................... 18 LAYOUT NOTES .................................................................................................................................. 18 6.1 6.2 RF PIN INPUT IMPEDANCE MATCHING ........................................................................................... 18 6.3 HANDING REQUIREMENTS .......................................................................................................................... 18 SOLDING REQUIREMENTS ........................................................................................................................... 18 6.4 MECHANICAL REQUIREMENTS ...................................................................................................................... 20 7.1 MODULE DIMENSION AND FOOTPRINT.................................................................................................... 20 CERTIFICATION REQUIREMENTS ................................................................................................................ 22 8.1 CARRIER CERTIFICATION REQUIREMENTS ........................................................................................... 22 8.2 REGULATORY COMPLIANCE ..................................................................................................................... 22 FCC WARNING STATEMENT ........................................................................................................................ 22 8.3 5. 6. 4. 7. 8. Revision history Revision V1.0 V2.0 Date April 7 2014 May 13 2014 Description Initial release Modify recommended operating condition 2 Product specification INTRODUCTION 1. This document describes the hardware interface of the WNC Small Form Factor (SFF) module used to connect the device application and the air interface. Two versions of Small Form Factor (SFF) module are described in this specification document as follows:
UMC-6055QV - CDMA2000 1X 1.1 PRODUCT CONCEPT The SFF module is one of the smallest available CDMA2000 1X modules of the market. The target application is the Machine to Machine (M2M) market including automotive, AMM (Automatic Metering Management), tracking system, Alarm, Healthcare/monitoring, Telematics etc. Despite its small size and cost, In addition to its size it has the following outstanding characteristics:
Minimum low power consumption in idle mode: 1.4mA High input voltage range: 3.4 V to 4.2 V USB High Speed Digital Audio PCM Full set of AT commands as well as analogue and Digital audio interface. In addition to the module, a complete development kit can be provided for customers. 1.2 STANDARDS This product, together with its evaluation board, is in compliance with the directives and standards listed below:
Directives FCC RF : FCC Part 22H (850 Band ) FCC Part 24E (for 1900 Band) EMI: FCC Part 15B SAR(MPE) : OET65C FCC Part 22 Subpart H:
Cellular Radiotelephone Service; Subpart I: Offshore Radiotelephone Service;
FCC Part 24 E: Personal Communications Service; Subpart E:
Broadband PCS. Subpart B - Radio frequency devices subpart B Unintentional Radiators 3 Product specification TERMS AND ABBREVIATION 1.3 ADC CODEC CLIP COLP CLIR COLR CTS CSD CS DSR ENS EONS ESD ETS FAX IC IEEE I/O ISO ITU JTAG Kbps LCD LED Mbps PCB PCM PCS PWM RAM RF RI RMS RTS RX SMS TBC TBD TX UART USB USSD Analog to Digital Converter Coder-Decoder Calling Line Identification Presentation Connected Line Identification Presentation Calling Line Identification Restriction Connected Line Identification Restriction Clear To Send Circuit Switched Data Codec Scheme Data Set Ready Enhanced network selection Enhanced operator name string Electrostatic Discharge European Telecommunication Standard Facsimile Integrated Circuit Institute of Electrical and Electronics Engineers Input / Output International Standards Organization International Telecommunication Union Joint Test Action Group kilobit per second Liquid Crystal Display Light Emitting Diode Megabit per second Printed Circuit Board Pulse Code Modulation Personal Communication System Pulse Width Modulation Random Access Memory Radio Frequency Ring Indication Root Mean Square Ready To Send Reception Short Message Service To Be Confirmed To Be Defined Transmission Universal Asynchronous Receiver and Transmitter Universal Serial Bus Unstructured Supplementary Service Data 1.4 CONVENTIONS Throughout this document, DTE (data terminal equipment) indicates the equipment which masters and controls the module device by sending AT commands via its serial interface. DCE (data communication equipment) indicates the module device. 1.5 PRODUCT FEATURES OVERVIEW Temperature range Operation Temperature: -25C to +85C Storage: -40C to +85C 6 g (typ.) ESD protection >= 2 kV Weight ESD 4 Product specification Physical dimensions Connection Power supply Power consumption*
Antenna /RF interface Frequency bands Transmit power PWM Digital audio link Data/command multiplexing USB 22.1 x 25.1 x 2.65 mm (typical) 141 pin LGA type 3.4V to 4.2V range, 3.8V nominal Off mode: 50 A typical Registered idle mode:
CDMA2000: 1.3 mA Peak Current CDMA2000: up to 700 mA Both GPS and transmitter/receiver RF are LGA Pad. UMC-6055QV module supports CDMA2000 BC0/BC1 Class 3 for CDMA2000 BC0/BC1 Signal for LED, vibrating device and Buzzer management is provided on the PWM pin A digital audio interface PCM bus is provided. Master mode with 16 bits and a frequency of 2048 KHz. Software management of data/command multiplexing on the serial link UART. Supports USB High speed 480Mbps and full speed 12Mbps, with 3 logical Channels. Battery charging is achieved through USB Module Hardware Configuration The SFF LGA module will support the QSC6055 chipset with the configuration described below. For UMC-6055QV module:
Key Features Compliant with 3GPP for CDMA 1xRTT Max. Data Rate : 153kbps FL; 153kbps RL Support OS: Brew Mobile Platform ARM9 operating at 192Mhz maximum frequency Data interface: USB2.0 Host High Speed Form Factor: LGA module Specification Communication Interface: (I2C x1/UART x1/USB2.0 x1/SDIO x1) Supported SIM cards (3V and 1.8V SIM cards) General purpose I/O pins ( x25 ) Audio Interface (PCM/ I2S) MCP (DDR 512Mb + 1Gb NAND) Support GPS RF interface: 2 RF pads for CDMA TX/RX, and GPS. CDMA2000 Support Bands Band BC0
* The power consumption is highly dependent on the customers product design and the module environment. 5 Product specification Band BC1 6 Product specification 2. BLOCK DIAGRAM & PIN ASSIGNMENT Pin Definition 4 This section is intended to capture the final LGA pin out for the SFF Module. The interfaces with a SFF module are all through a 141-pin surface LGA pad, as shown in Figure 2-1. 7 Product specification For UMC-6055QV module:
Figure 2-1: UMC-6055QV module 8 Pin number Category 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 RF GND GPIO GPIO GPIO GPIO I2C PCM PCM PCM PCM GPIO NC NC GND GND RF GND GPIO GND GPIO GPIO GPIO NC NC SDIO1 SDIO1 SDIO1 Product specification pin name CDMA_AN T GND GPIO9 GPIO2 GPIO5 GPIO8 I2C_SCL 1.8V 1.8V PCM_BCLK 1.8V PCM_SYNC 1.8V Pad group Pad type Description AI,AO CDMA antenna signal GND Ground. I/O, PD Configurable I/O. I/O, PD Configurable I/O. I/O, PD Configurable I/O. I/O, PD Configurable I/O. I/O Serial bus clock. DO PCM clock for external DO PCM sync to external Bluetooth DI PCM data from external DO PCM data to external Bluetooth I/O, PU Configurable I/O. Bluetooth module. Bluetooth module. module. module. 1.8V GND Ground. GND Ground. GND Ground. AI GPS antenna signal. I/O, PU Configurable I/O. GND Ground. 1.8V 1.8V 1.8V 1.8V 1.8V 1.8V 1.8V 1.8V 1.8V 2.6V PCM_DIN PCM_DOU T GPS_LNA_ EN GND GND GPS_ANT GND GPIO21 GND GPIO20 GPIO16 GPIO17 D SDCC1_CM SDCC1_DA TA3 2.6V SDCC1_DA 2.6V I/O, PU Configurable I/O. I/O, PU Configurable I/O. I/O, PU Configurable I/O. I/O SD command. I/O SD data bit 3. I/O SD data bit 2. 9 Drivn capacity 2-16mA 2-16mA 2-16mA 2-16mA 2-16mA 2-16mA 2-16mA 2-16mA 2-16mA 2-8mA 2-8mA 2-8mA Product specification TA2 GPIO GND SIM NC GPIO10 GND 1.8V I/O, PU Configurable I/O. GND Ground. USIM_CLK 1.8V/2.8 5V DO UIM clock. P Input power for BB section, could connect this pin with VBAT_RF. voltage or as an analog output that sources trickle-charging current for the battery. power input/output VBAT_BB 3.7V~4. 2V JTAG JTAG JTAG SIM K 2.6V JTAG_TMS 2.6V DI, PU Test mode select. JTAG_RTC DO Return clock. JTAG_TCK 2.6V DI, PU Clock input. USIM_DAT 1.8V/2.8 5V I/O UIM data. 38 power input USB_VBUS power output USIM_VRE 1.8V/2.8 P This pin is configured as an analog input or an analog output, depending upon the type of peripheral device connected. P RUIM circuits and interface. G GND GND ME1 GND 5V GND Ground. GND Ground. 1.8V 300m A GND Ground. GND GND NC NC GND power input/output GND ADC in other GND ADC in GND power output VREG_MS EBI circuits and external memory, pads. VCOIN P Used as an analog input from the 3 V coin cell for SMPL, RTC, and crystal oscillator backup. PON_REST GND MPP3 _N GND BATT_THE RM GND microphone MIC_P microphone MIC_M GND GND GND Ground. 1.8V AO Multipurpose pin. DO logic low causes the baseband circuits to reset. GND Ground. GND Ground. GND Ground. AI Connect to battery package thermal pin. AI Microphone #1 input (+). AI Microphone #1 input (-). 29 30 31 32 33 34 35 36 37 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 10 2-16mA 150mA Product specification GPIO GPIO GPIO GPIO GND GPIO GPIO GPIO GPIO4 GPIO6 GPIO11 GPIO24 GND GPIO18 GPIO15 GPIO7 1.8V 1.8V 1.8V 1.8V 1.8V 1.8V 1.8V GPIO I2C UART UART UART UART 1.8V GPIO1 1.8V I2C_SDA UART_TX 1.8V UART_RFR 1.8V UART_RX 1.8V UART_CTS 1.8V power input VBAT_RF 3.7V~4. 2V power input VBAT_RF 3.7V~4. 2V I/O, PD Configurable I/O. I/O, PU Configurable I/O. I/O, PD Configurable I/O. I/O, PD Configurable I/O. GND Ground. I/O, PD Configurable I/O. I/O, PD Configurable I/O. I/O, PD Configurable I/O. I/O, PD Configurable I/O. I/O I2C serial bus data. DO UART1 bits: receive serial data DO UART Ready to receive flow. DI UART1 bits: receive serial data DI UART Clear to send flow. Input power for RF section, could connect this pin with VBAT_BB. Input power for RF section, could connect this pin with VBAT_BB. input. input. P P NC NC GND GND GND GND GND GPIO GPIO GPIO GPIO NC NC GND GND GND GND GND GPIO22 GPIO23 GPIO19 GPIO14 GND Ground. GND Ground. GND Ground. GND Ground. GND Ground. 1.8V 1.8V 1.8V 1.8V I/O, PU Configurable I/O. I/O, PU Configurable I/O. I/O, PU Configurable I/O. I/O, PU Configurable I/O. 11 2-16mA 2-16mA 2-16mA 2-16mA 2-16mA 2-16mA 2-16mA 2-16mA 2-16mA 2-16mA 2-16mA 2-16mA 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 Product specification NC NC SDIO1 SDIO1 SDIO1 SDCC1_DA SDCC1_DA TA0 TA1 K SDCC1_CL 2.6V I/O SD data bit 0. 2.6V I/O SD data bit 1. 2.6V 1.8V DO SD clock. I/O, PU Configurable I/O. GPIO3 GND GND Ground. USIM_RST 1.8V/2.8 5V JTAG_TDO 2.6V JTAG_TDI power output VREG_MS JTAG_TRS DO UIM reset. Z Test data output. 2.6V DI, PU Test data input. 2.6V MP 2.6V DI, PD Reset. Pad voltage for digital I/Os. T_N GND USB_D_M USB_D_P GND GND Ground. AI,AO USB differential data I/O, (-) AI,AO USB differential data I/O, (+) GND Ground. side. side. 1.8V AI.PU Connect to the keypad power button. GPIO GND NC SIM JTAG JTAG JTAG NC NC GND USB USB GND power on key MSM_PON ADC in MPP4 other GND GND Speaker Speaker D2D_PS_H OLD GND GND SPKR_OUT SPKR_OUT _P _M NC NC ADC in MPP2 current sink VIB_DRV_ N AI Multipurpose pin. DI Baseband circuits drive this input high to keep power on, low to shut down. GND Ground. GND Ground. Connect directly to the speaker. AO Speaker driver (+) output. AO Speaker driver (-) output. AI Multipurpose pin. Connect directly to the speaker. Connect to the vibration motor (-
) terminal. The (+) terminal of the AO 12 2-8mA 2-8mA 2-16mA 2-16mA 300mA 500mW 500mW 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 101 102 103 104 105 106 107 108 109 110 111 112 113 114 Product specification motor connects to VDD. ADC in PA_THERM current sink LCD_DRV_ AI Connect to thermistor for PA. AO LCD backlight current driver. GND Ground. N GND GPIO13 GPIO0 1.8V 1.8V I/O, PD Configurable I/O. I/O, PD Configurable I/O. I/O, PD Configurable I/O. 1.8V GPIO12 GP_PDM_0 1.8V DO,P D
"Backlight"12-bit PDM;XO/4 clock. GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND Ground. GND Ground. GND Ground. GND Ground. GND Ground. GND Ground. GND Ground. GND Ground. GND Ground. GND Ground. GND Ground. GND Ground. GND Ground. GND Ground. GND Ground. GND Ground. GND Ground. GND Ground. GND Ground. GND Ground. GND GPIO GPIO GPIO PWM GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND 150mA 2-16mA 2-16mA 2-16mA 2-16mA 13 115 116 117 118 119 120 121 122 123 124 125 126 127 128 129 130 131 132 133 134 135 136 137 138 139 140 141 Product specification 3. RF AIR INTERFACES AND PERFORMANCE 3.1 RF AIR INTERFACE AND BAND CONFIGURATION 3.1.1 Air interfaces UMC-6055QV module supports CDMA 1xRTT and GPS RF PERFORMANCE 3.2 The UMC-6055QV modules RF transmitter/receiver is fully compliant with the applicable standards. The sensitivity and max output power are listed in Table 3-2-1 and Table 3-2-2 Specification CDMA2000 1X Sensitivity BC1 (1930-1990MHz Rx) BC0 (869-894MHz Rx) Min
-104.7
-106.7 Units dBm dBm Typ
-108
-110 GPS Sensitivity Specification CDMA2000 1X Output Power BC1 (1850-1910MHz Tx) BC0 (824-849MHz Tx) GPS Sensitivity Table 3-2-1 Conducted Receiver Sensitivity
-155 Min Typ 23.5 23.5
-155 Table 3-2-2 Conducted Transmitter Max Output Power Max Max dBm Units dBm dBm dBm TRANSMITTER POWER CLASS 3.3 The UMC-6055QV Modules support the power classes listed in Table 3-3 Mode CDMA2000 1X Table 3-3 Supported Power Classes Power Class BC1/BC0 Band 3 14 Product specification 4. OPERATING CONDITIONS 4.1 ABSOLUTE MAXIMUM RATINGS Operating UMC-6055QV Modules under conditions beyond its absolute maximum ratings (Table 4-1) may damage the device. Absolute maximum ratings are limiting values to be considered individually when all other parameters are within their specified operating ranges. Functional operation and specification compliance under any absolute maximum condition, or after exposure to any of these conditions, is not guaranteed or implied. Exposure may affect device reliability. Symbol Ts USB_VBUS VBAT Max 85 5.5 4.2 Unit C V V Min
-40 4.5 3.4 Parameter Storage temperature DC power supply voltage Battery input voltage Eletrostatic discharging voltage rating
(human body model) Electrostatic discharge voltage rating
(charge device model) VESD_HBM VESD_CDM 10 RH_Operating Operating humidity range RH_Non-OP 5
*NOTE: ESD protection should be provided external to the module. Nonoperating humidity range Table 4-1 : Absolute maximum ratings
*
*
90 95 V V
%
%
15 Product specification 4.2 RECOMMENDED OPERATING CONDITION The devices meet all performance specifications when used within the recommended operating conditions as described in Table 4-2 Symbol T Parameter Max
+85 Min
-25 Typ. Operating Temperature Normal operating temperature range See section 4.2.1 Extended operating temperature range 1 See section 4.2.2 Extended operating temperature range 2 See section 4.2.3 USB_VBUS DC Power Supply Voltage VBAT (Battery) DC Power Supply Voltage
-20
-25
+65 4.75 3.4 5 3.8
+65
-20
+85 5.25 4.2 Unit V V Table 4-2 4.2.1 Normal operating temperature range The wireless module is fully functional and meets the 3GPP specification across the specified temperature range. 4.2.2 Extended operating temperature range 1 The wireless module is fully functional across the specified temperature range. Occasional deviations from the 3GPP specification may occur. 4.2.3 Extended operating temperature range 2 The wireless module is functional across the specified temperature range. Occasional deviations from the 3GPP specification may occur. Thermal protection including automatic shutdown is implemented for protection against overheating. 16 Product specification 5. CURRENT CONSUMPTION The specified supply currents in Table 5-1 are based operation at room temperature. Current measurements are taken with default parameter settings, nominal supply voltage. The DUT is mounted on a module test board and the accelerometer on, unless otherwise noted. Operating Modes Description Conditions Power Down(OFF) VBAT voltage applied Power Down*1,2 CDMA2000 1X Between Rx wakeups Sleep*1,2 Rx awake current Average Sleep and Rx Standby*3 Average GPS only Rx Idle Average GPS only TX/RX (0dBm) Tx/Rx (23.5dBm) Table 5-1 Typical Power Consumption Note 1 Measurement taken without Test Board Note 2 Measurement taken without Accelerometer Note 3 Value calculated from measured IUSB_AVG subtacted from ITOTAL_GPS_AVG, I-GPS = I-Total_GPS_AVG IUSB_AVG 17 Average Current Min Typ Max 22 1 70 1.4 42 180 550 Unit A mA mA mA mA mA mA Product specification 6. APPLICATION DESIGN NOTES 6.1 Layout Notes 6.2 RF Pin Input Impedance Matching Applications utilizing the module must ensure that a 50 controlled impedance trace is used. Shown in the accompanying table are example calculations for a four- layer FR4 stack up and the resulting trace width for Bluetooth RF input. The figure below illustrates the layer stack up for a four- layer board according to the Description column in the table below. Layer Material Type Dielectric Thickness Trace Width Copper Thickness Dielectric Constant Char. Impedance Description Conductive Dielectric Conductive Dielectric Conductive Dielectric Conductive
-
16
-
20
-
16
-
27
-
-
-
-
27 2.1
-
1.4 1.4
-
2.1
-
4.3 4.3
-
4.3
-
50 Microstrip
- Prepreg
- Plane
- Prepreg
- Plane
- Prepreg 50 Microstrip Table 6-1-1-1 Application Board Characteristic Impedance 1 2 3 4 Figure 6-1-1-1 Application Board Layer Stack Up 6.3 Handling Requirements DO NOT TOUCH ANY Pad OF BTI MODULE WHILE ASSEMBLYING. 6.4 Soldering Requirements Soldering Iron Soldering Solder Temperature: 350oC Immersion Duration: 2 ~ 3 seconds 18 Product specification 6.1.3 Reflow Profile 19 Product specification 7. MECHANICAL REQUIREMENTS 7.1 Module Dimension and Footprint The dimension of this module:
Figure 7-1-1 Dimension of SFF Module 20 Product specification Figure 7-1-2 Recommended Footprint of SFF Module 21 Product specification 8 Certification Requirements 8.1 Carrier Certification Requirements The SFF Development Kit will be used to demonstrate Safe for Network (SFN) compliance for the SFF module on selected cellular carriers. 8.2 Regulatory Compliance 5 8.3 FCC warning statement FCC Regulations:
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one of the following measures:
- Reorient or relocate the receiving antenna.
-
- Connect the equipment into an outlet on a circuit different from that Increase the separation between the equipment and receiver. to which the receiver is connected.
- Consult the dealer or an experienced radio/TV technician for help. FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate this equipment. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. 22 Product specification Radiation Exposure Statement:
This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20cm between the radiator & your body. This device is intended only for OEM integrators under the following conditions:
1) and gain allowed for use with this device is type: fixed external; max. gain: 2dBi. The antenna must be installed such that 20 cm is maintained between the antenna and users, and the antenna type 2) The transmitter module may not be co-located with any other transmitter or antenna. As long as 2 conditions above are met, further transmitter test will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed IMPORTANT NOTE: In the event that these conditions can not be met (for example certain laptop configurations or co-
location with another transmitter), then the FCC authorization is no longer considered valid and the FCC ID can not be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product
(including the transmitter) and obtaining a separate FCC authorization. End Product Labeling This transmitter module is authorized only for use in device where the antenna may be installed such that 20 cm may be maintained between the antenna and users. The final end product must be labeled in a visible area with the following:
Contains FCC ID: NKRUMC-6055Q. The grantee's FCC ID can be used only when all FCC compliance requirements are met. Manual Information To the End User The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the users manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual. 23