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Users Manual | Users Manual | 1.93 MiB | December 07 2016 / August 01 2017 | |||
1 2 | Cover Letter(s) | December 07 2016 | ||||||
1 2 | External Photos | December 07 2016 / August 01 2017 | ||||||
1 2 | ID Label/Location Info | December 07 2016 | ||||||
1 2 | Internal Photos | December 07 2016 / August 01 2017 | ||||||
1 2 | ID Label/Location Info | December 07 2016 | ||||||
1 2 | RF Exposure Info | December 07 2016 | ||||||
1 2 | Cover Letter(s) | December 07 2016 | ||||||
1 2 | Cover Letter(s) | December 07 2016 | ||||||
1 2 | Cover Letter(s) | December 07 2016 | ||||||
1 2 | Test Report | December 07 2016 | ||||||
1 2 | Test Report | December 07 2016 | ||||||
1 2 | Test Setup Photos | December 07 2016 / August 01 2017 | ||||||
1 2 | Test Report | December 07 2016 |
1 2 | Users Manual | Users Manual | 1.93 MiB | December 07 2016 / August 01 2017 |
MC2261_V2 HARDWARE DEVELOPMENT GUIDE OF MODULE PRODUCT Version: V2.1 Date: 2016-04-18 CDMA Module Series Website: www.ztewelink.com E-mail: ztewelink@zte.com.cn LEGAL INFORMATION MC2261 Hardware Development Guide of Module Product By receiving the document from Shenzhen ZTEWelink Technology Co., Ltd (shortly referred to as ZTEWelink), you are deemed to have agreed to the following terms. If you dont agree to the following terms, please stop using the document. Copyright 2015 Shenzhen ZTEWelink Technology Co., Ltd. All rights reserved. The document contains ZTEWelinks proprietary information. Without the prior written permission of ZTEWelink, no entity or individual is allowed to reproduce, transfer, distribute, use and disclose this document or any image, table, data or other information contained in this document. is the registered trademark of ZTEWelink. The name and logo of ZTEWelink are ZTEWelinks trademark or registered trademark. Meanwhile, ZTEWelink is granted to use ZTE Corporations registered trademark. The other products or company names mentioned in this document are the trademark or registered trademark of their respective owner. Without the prior written permission of ZTEWelink or the third-party oblige, no one is allowed to read this document. The product meets the design requirements of environmental protection and personal security. The storage, use or disposal of products should abide by the product manual, relevant contract or the laws and regulations of relevant country. ZTEWelink reserves the right to make modifications on the product described in this document without prior notice, and keeps the right to revise or retrieve the document any time. If you have any question about the manual, please consult the company or its distributors promptly. Copyright ZTEWeLink Technology Co., LTD, All rights reserved. All Rights reserved, No Spreading abroad without Permission I REVISION HISTORY Version Date Description MC2261 Hardware Development Guide of Module Product V1.0 V1.1 V1.2 V1.3 V1.4 V1.5 V1.6 V1.7 V1.8 V1.9 2010-11-30 First published 2010-12-20 Modify Table 2-1 2011-02-22 Update image 2011-02-25 Change Operational Temperature Range 2011-03-07 Modify Table 2-1 and power management 2011-03-29 Modify content of 3.1 power management and 5.2.5 antenna matching 2011-04-25 Modify 2.1 (add note), 3.5(add new content) 2011-06-15 Modify the email for supports. 2011-11-25 Define pin 57 MO_RI 2014-09-25 Update the format and template of module Add the name of all the Figures and Tables Update the picture of the module Update the Figure 4-1 of NMM22-5017 connector Update chapter 3.1 of power Update the pins of 35&36 V2.0 2014-09-28 Update chapter 3.1 of power Update the pins of 35 V2.1 2016-04-18 Add PID information in chapter 1.1 All Rights reserved, No Spreading abroad without Permission II MC2261 Hardware Development Guide of Module Product ABOUT THIS DOCUMENT A. Application Range R&D personnel using CDMA modules to make the second development B. Reading Note The symbols below are the reading notes you should pay attention on:
: Warning or Attention
: Note or Remark CONTACT INFORMATION Post 9/F, Tower A, Hans Innovation Mansion, North Ring Rd., No.9018, Hi-Tech Industrial Park, Web Phone E-Mail Nanshan District, Shenzhen. www.ztewelink.com
+86-755-26902600 ztewelink@zte.com.cn Note: Consult our website for up-to-date product descriptions, documentation, application notes, firmware upgrades, troubleshooting tips, and press releases Besides, ZTEWelink provides various technical support ways to the customers, such as support by phone, website, instant messaging, E-mail and on-site. All Rights reserved, No Spreading abroad without Permission III SAFETY INFORMATION MC2261 Hardware Development Guide of Module Product The following safety precautions must be observed during all phases of the operation, such as usage, service or repair of any cellular terminal or mobile incorporating ME3610 module. Manufacturers of the cellular terminal should send the following safety information to users and operating personnel and to incorporate these guidelines into all manuals supplied with the product. If not so, ZTEWelink does not take on any liability for customer failure to comply with these precautions. Full attention must be given to driving at all times in order to reduce the risk of an accident. Using a mobile while driving (even with a hands free kit) cause distraction and can lead to an accident. You must comply with laws and regulations restricting the use of wireless devices while driving. Switch off the cellular terminal or mobile before boarding an aircraft. Make sure it switched off. The operation of wireless appliances in an aircraft is forbidden to prevent interference with communication systems. Consult the airline staff about the use of wireless devices on boarding the aircraft, if your device offers a Airplane Mode which must be enabled prior to boarding an aircraft. Switch off your wireless device when in hospitals or clinics or other health care facilities. These requests are designed to prevent possible interference with sensitive medical equipment. GSM cellular terminals or mobiles operate over radio frequency signal and cellular network and cannot be guaranteed to connect in all conditions, for example no mobile fee or an invalid SIM card. While you are in this condition and need emergent help, please remember using emergency call. In order to make or receive call, the cellular terminal or mobile must be switched on and in a service area with adequate cellular signal strength. Your cellular terminal or mobile contains a transmitter and receiver. When it is on, it receives and transmits radio frequency energy. RF interference can occur if it is used close to TV set, radio, computer or other electric equipment. In locations with potentially explosive atmospheres, obey all posted signs to turn off wireless devices such as your phone or other cellular terminals. Areas with potentially explosive atmospheres including fuelling areas, below decks on boats, fuel or chemical transfer or storage facilities, areas where the air contains chemicals or particles such as grain, dust or metal powders. All Rights reserved, No Spreading abroad without Permission IV Federal Communication Commission Interference Statement MC2261 Hardware Development Guide of Module Product This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one of the following measures:
Reorient or relocate the receiving antenna. Increase the separation between the equipment and receiver. Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. Consult the dealer or an experienced radio/TV technician for help. FCC Caution:
Any changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate this equipment. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. Radiation Exposure Statement:
This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20cm between the radiator & your body. This device is intended only for OEM integrators under the following conditions:
1) The antenna must be installed such that 20 cm is maintained between the antenna and users, and the maximum antenna gain allowed for use with this device is 4.8 dBi. 2) The transmitter module may not be co-located with any other transmitter or antenna. As long as 2 conditions above are met, further transmitter test will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed IMPORTANT NOTE: In the event that these conditions can not be met (for example certain laptop configurations or co-location with another transmitter), then the FCC authorization is no longer considered valid and the FCC ID can not be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC authorization. End Product Labeling This transmitter module is authorized only for use in device where the antenna may be installed such that 20 cm may be maintained between the antenna and users. The final end product must be labeled in a visible area with the following: Contains FCC ID:
Q78-ZTEMC2261. The grantee's FCC ID can be used only when all FCC compliance requirements are met. All Rights reserved, No Spreading abroad without Permission V MC2261 Hardware Development Guide of Module Product Manual Information To the End User The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the users manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual. All Rights reserved, No Spreading abroad without Permission VI CONTENTS MC2261 Hardware Development Guide of Module Product 1. Mechanical Interface ............................................................................................................................................... 11 1.1. Physical Features ........................................................................................................................................................................ 11 1.2. Mechanical size .......................................................................................................................................................................... 11 2. Electrical Interface ................................................................................................................................................... 14 2.1. Pin Assignments ......................................................................................................................................................................... 14 2.2. Digital logic characteristics ......................................................................................................................................................... 16 3. Applications 17 3.2. GPIO 3.1. Power Management ................................................................................................................................................................... 17
................................................................................................................................................................................. 17
................................................................................................................................................................................. 17
................................................................................................................................................................................. 18 3.5. Powering the Module Using the MDB ........................................................................................................................................ 19 3.4. UART 3.3. USB 4. Antenna Interface .................................................................................................................................................... 21 4.1. Antenna Installation ................................................................................................................................................................... 21 4.2. Antenna Pad ............................................................................................................................................................................... 21 4.3. Antenna connector ..................................................................................................................................................................... 22 5. RF Interface 5.1. Overview
........................................................................................................................................................ 24
................................................................................................................................................................................. 24 5.2. Antenna Subsystem .................................................................................................................................................................... 25 5.2.1. Antenna Specifications .................................................................................................................................................... 25 5.2.2. Cable Loss ........................................................................................................................................................................ 25 5.2.3. Antenna Gain Minimum Requirements ........................................................................................................................... 25 5.2.4. Antenna Gain Maximum Requirements........................................................................................................................... 25 5.2.5. Antenna Matching ........................................................................................................................................................... 25 5.2.6. PCB Design Considerations .............................................................................................................................................. 26 5.2.7. Other Precautions ............................................................................................................................................................ 26 5.2.8. Grounding ........................................................................................................................................................................ 26 6. Test Capabilities ....................................................................................................................................................... 27 6.1. Test Description ......................................................................................................................................................................... 27 6.2. CDMA Test Equipment and Tools ............................................................................................................................................... 29 6.3. RF Performance Requirements .................................................................................................................................................. 30 6.3.1. CDMA2000 1X RF Rx Specification ................................................................................................................................... 30 6.3.2. CDMA2000 1X RF Tx Specification: .................................................................................................................................. 30 6.4. Environmental Reliability Requirement ..................................................................................................................................... 31 6.4.1. High Temperature Operation Test ................................................................................................................................... 31 6.4.2. Low Temperature Operation Test .................................................................................................................................... 31 6.4.3. High Temperature Storage Test ....................................................................................................................................... 32 All Rights reserved, No Spreading abroad without Permission VII MC2261 Hardware Development Guide of Module Product 6.4.4. Low Temperature Storage Test ........................................................................................................................................ 32 6.4.5. High Temperature High Humidity Operation Test ........................................................................................................... 32 6.4.6. Temperature Concussion Test ......................................................................................................................................... 32 6.5. Electro Magnetic Compatibility .................................................................................................................................................. 33 6.5.1. ESD Immunity Test ........................................................................................................................................................... 33 6.5.2. Radiated Emissions Test ................................................................................................................................................... 33 All Rights reserved, No Spreading abroad without Permission VIII TABLES MC2261 Hardware Development Guide of Module Product Table 11 Major Technical Parameters ................................................................................................................................................ 11 Table 21 MC2261 Module 68-pin Electrical Interface ........................................................................................................................ 14 Table 22 Baseband digital I/O characteristics for VDD_PX = 1.8 V nominal ....................................................................................... 16 Table 23 Baseband digital I/O characteristics for VDD_PX = 2.85 V nominal ..................................................................................... 16 Table 31 Input Power Characteristics ................................................................................................................................................. 17 Table 41 Return Loss in the Active Band ............................................................................................................................................. 21 Table 42 Product specifications of NMM22-5017 connector ............................................................................................................. 22 Table 43 Product specifications of SSMB-50TKE-10 connector .......................................................................................................... 23 Table 51 The requirement of dual band antenna ............................................................................................................................... 25 Table 61 CDMA2000 1X RF Rx Specification ....................................................................................................................................... 30 Table 62 CDMA2000 1X RF Tx Specification ....................................................................................................................................... 30 Table 63 High Temperature Operation Test ....................................................................................................................................... 31 Table 64 Low Temperature Operation Test ........................................................................................................................................ 31 Table 65 High Temperature Storage Test ........................................................................................................................................... 32 Table 66 Low Temperature Storage Test ............................................................................................................................................ 32 Table 67 High Temperature High Humidity Operation Test ............................................................................................................... 32 Table 68 Temperature Concussion Test ............................................................................................................................................. 32 Table 69 ESD Immunity Test ............................................................................................................................................................... 33 Table 610 Radiated Emissions Test ..................................................................................................................................................... 33 All Rights reserved, No Spreading abroad without Permission IX FIGURES MC2261 Hardware Development Guide of Module Product Figure 11 MC2261 TOP SIDE ............................................................................................................................................................... 12 Figure 12: MC2261 BOTTOM SIDE ......................................................................................................................................................... 12 Figure 13 MC2261 Module Illustration ............................................................................................................................................... 13 Figure 31 Powered by VBAT and VPH_PWR pin ................................................................................................................................. 17 Figure 32 USB Typical Circuit .............................................................................................................................................................. 18 Figure 33 Wire serial level conversion circuit ..................................................................................................................................... 18 Figure 34 wire serial level conversion circuit ...................................................................................................................................... 18 Figure 35 wire serial level conversion circuit .................................................................................................................................... 19 Figure 36 Module Development Board Illustration ............................................................................................................................ 19 Figure 37 First method to connect the module to RF test equipment ............................................................................................... 20 Figure 38 Second method to connect the module to RF test equipment ........................................................................................... 20 Figure 41 Specification of NMM22-5017 connector ........................................................................................................................... 22 Figure 42 Specification of SSMB-50TKE-10 ......................................................................................................................................... 23 Figure 51 CDMA Connector ................................................................................................................................................................ 24 Figure 52 CDMA Connector on daughter board ................................................................................................................................. 24 Figure 53 Antenna Matching Circuit ................................................................................................................................................... 26 Figure 61 CDMA Connector ................................................................................................................................................................ 27 Figure 62 Module Development Board Illustration ............................................................................................................................ 27 Figure 63 First method to connect the module to RF test equipment ............................................................................................... 28 Figure 64 Second method to connect the module to RF test equipment ........................................................................................... 28 Figure 65 First method to connect the module to RF antenna ........................................................................................................... 29 Figure 66 Second method to connect the module to RF antenna ...................................................................................................... 29 All Rights reserved, No Spreading abroad without Permission X 1. MECHANICAL INTERFACE 1.1. PHYSICAL FEATURES MC2261 Hardware Development Guide of Module Product Table 11 Major Technical Parameters Item Specifications Dimensions & Weight Length: 34.4 mm Width: 30 mm Thickness: 3.3 mm Weight: 8 g Operational Temperature Range
-30 to +75 Storage Temperature Range
-40 to +80 ROHS Yes Antenna Connectors 50-Ohm ANT connectors for CDMA Power Supply Current CELL BAND Powered by the VPH_PWR pin (+3.3V~ +4.2V, typical value3.8V) Idle current: 5mA @-75dBm, Powered by the VPH_PWR call current: 156mA @-75dBm, Powered by the VPH_PWR max current: 535mA @-104dBm, Powered by the VPH_PWR PID V1CP: 800M/1.9G PID V2CP: 800M/1.9G 1.2. MECHANICAL SIZE NOTE:
1. All dimensions shown in the drawing below are in the unit of mm. 2. Default dimensions tolerance is +/-0.1mm. All Rights reserved, No Spreading abroad without Permission 11 Figure 11 MC2261 TOP SIDE Hardware Development Guide of Module Product MC2261 Figure 12: MC2261 BOTTOM SIDE All Rights reserved, No Spreading abroad without Permission 12 Figure 13 MC2261 Module Illustration Hardware Development Guide of Module Product MC2261 NOTE: The picture above is just for reference, please take the actual product as the referece. All Rights reserved, No Spreading abroad without Permission 13 2. ELECTRICAL INTERFACE 2.1. PIN ASSIGNMENTS MC2261 Hardware Development Guide of Module Product Table 21 MC2261 Module 68-pin Electrical Interface Signal Type Input/output Description Typical Default (Internal Comments No. Signal Name GND_RF RF_ANT Analog GND_RF 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 GPIO0 GPIO1 GPIO2 GPIO3 GPIO4 GPIO9 GPIO8 GPIO7 GPIO6 GPIO5 GND MSM_CTS 16 MSM_RTS 17 MSM_RXD 18 MSM_TXD 19 20 21 22 23 24 25 26 27 28 29 GND NA NA NA NA GND NA NA GND NA NA Digital Digital Digital Digital Digital Digital Digital Digital Digital Digital I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I O I O Value PU/PD) Ground Connect 50ohm antenna or feed Ground Connect 50ohm antenna or feed GPIO GPIO GPIO GPIO GPIO GPIO GPIO GPIO GPIO GPIO Ground Clear to send Ready to send Transmitting data Receiving data Ground Ground Ground 1.8V 1.8V 1.8V 1.8V 1.8V 1.8V 1.8V 1.8V 1.8V 1.8V 0Output PD 1.8V Level 0Output PD 1.8V Level 0Output PD 1.8V Level 0Output PD 1.8V Level 0Output PD 1.8V Level 1.8VInput PU 1.8V Level 1.8VInput PU 1.8V Level 1.8VInput PU 1.8V Level 1.8VInput PU 1.8V Level 1.8VInput PU 1.8V Level UART Port 1.8V Level UART Port 1.8V Level UART Port 1.8V Level UART Port 1.8V Level Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved All Rights reserved, No Spreading abroad without Permission 14 30 31 32 33 NA NA GND VPH_PWR 34 VPH_PWR 35 36 37 38 39 40 41 42 43 44 45 46 NC VBAT NA GND NA NA ON NA NA NA NA VREG_MS ME2 47 VREG_MS ME1 NA GND USB_VBUS USB_DP Digital USB_DM Digital GND NA NA NA MO_RI Digital O 48 49 50 51 52 53 54 55 56 57 58 59 O O I B B Ground P (input) Main power 3.8 P (input) Main power 3.8 Not connected P (input) Used for 3.8 modules power supply Ground Power button Digital power 2.85V Digital power 1.8V Ground USB power 5V Send D+ to USB Send D- to USB Ground MSG arrival indication MC2261 Hardware Development Guide of Module Product Reserved Reserved Power range:
3.3V-4.2V Power range:
3.3V-4.2V Power range:
3.3V-4.2V Reserved Reserved Reserved Power button Reserved Reserved Reserved Reserved Reserved USB_D+ signal USB_D- signal Reserved Reserved Reserved Output PU 2.85Vnormal 300ms high-level impulse when MSG arrival 2.85V, low active UART Port, DCD DTR O O Carrier detect 2.85V Data Terminal 2.85V All Rights reserved, No Spreading abroad without Permission 15 60 DSR NA GND USE_LED NA NA GPIO42 Digital GPIO43 Digital GND I O I/O I/O MC2261 Hardware Development Guide of Module Product Connect to DCD, 2.85V Level UART Port, Connect to DTR, 2.85V Level Reserved LED ON as the level is high. 2.85V Level Reserved Reserved 1.8V 1.8V 0Iutput PD 1.8V Level 0Iutput PD 1.8V Level Ready Data Set Ready 2.85V Ground In-use LED GPIO GPIO Ground NOTE:
1 All the pin can be left open ,when they are not used. 2 I/O stands for Inupt/Output, P stands for Power, B stands for Bi-Directional. 3 PU/PD stands for Pull-up/Pull-down. 4 The unit of Min, Typ, Max is V. 2.2. DIGITAL LOGIC CHARACTERISTICS Specifications for the digital I/Os of the baseband functions depend upon the pad voltage being used. The MC2261 I/O uses two pad voltages: 1.8 and 2.85 V. Digital I/O specifications under both pad voltage conditions are presented in Table 2-2 and Table Parameter VIH VIL Parameter VIH VIL Table 22 Baseband digital I/O characteristics for VDD_PX = 1.8 V nominal Min Typ Max Unit High-level input voltage 0.65VDD_PX Low-level input voltage
-0.3 VOH High-level output voltage4 VDD_PX-0.45 VOL Low-level output voltage 4 0
-
-
-
-
VDD_PX+0.3 0.35VDD_PX VDD_PX 0.45 V V V V Table 23 Baseband digital I/O characteristics for VDD_PX = 2.85 V nominal Min Typ Max Unit High-level input voltage 0.65VDD_PX Low-level input voltage
-0.3 VOH High-level output voltage4 VDD_PX-0.45 VOL Low-level output voltage 4 0
-
-
-
-
VDD_PX+0.3 0.35VDD_PX VDD_PX 0.45 V V V V 61 62 63 64 65 66 67 68 2-3 All Rights reserved, No Spreading abroad without Permission 16 3. APPLICATIONS 3.1. POWER MANAGEMENT MC2261 Hardware Development Guide of Module Product The module could work under the conditions as follows:
Connect VPH_PWR and VBAT pins together, and then connect to the power as shown in Figure 3-1. Figure 31 Powered by VBAT and VPH_PWR pin Refer to Table 3-1 for the modules input power characteristics. If the input voltage is not in the range, it must be converted to the voltage below:
Table 31 Input Power Characteristics Status Max. Value Typical Volute Min. Value Power voltage
+4.2V DC
+3.8V DC
+3.3V DC supply Power current
< 3mA (Average
--
800mA (Depending on the network supply value) signal condition) When powered, the module will be automatically powered on. 3.2. GPIO The Module have 12 GPIO,,The GPIO level is 1.8V, the logic-level voltage refer to the Table 2-2. The GPIO input and output functions can be set by software. When the GPIO is set to output, the output drive current are 2~16mA. in the range of 2~16mA current value can be set by software. When the GPIO is set to input, it can be set to pull-up or pull-down by software. NOTE: The AT commands now do not support setting the GPIO functions. If you want AT commands to support the functions, the software must be revised. 3.3. USB The module provides a USB2.0 full-speed interface. The ESD protector and RC circuit are required to restrain EMI for USB port. Please see Figure 3-2 for USB port. The USB port could be used for AT commandsoftware upgrade, RF calibration and mobile station test. All Rights reserved, No Spreading abroad without Permission 17 Figure 32 USB Typical Circuit Hardware Development Guide of Module Product MC2261 3.4. UART Pins of MSM_CTS, MSM_RTS, MSM_RXD and MSM_TXD are 1.8V level respectively for the external interface, when connecting with level circuit which is not 1.8V will need the level switch connection. Pins of MO_RI, DCD, DTR and DSR are the level of 2.85V respectively for the external interface, when connecting with level circuit which is not 2.85V will need the level switch connection. Otherwise, UART will be unstable or module will be damaged because of the unmatched level. Figure 3-3, 3-4 and 3-5 are the references:
NOTES:
1UART must be led out[only requires the connection with RXD or TXD] for upgrading when use the module to do whole device design, USB for software upgrading is the first choice. 2IO level is 1.8V or 2.85V. Level switch connection must be needed when 1.8V level is connected with the logic circuit which is not 1.8V[such as MCU, RS232 or driver IC MAX3238], or when 2.85V level is connected with the logic circuit which is not 2.85V[for example, RS232 or driver IC MAX3238]. Otherwise, level will be unstable or module will be damaged because of the unmatched level 3Only RXD and TXD are needed to be connected under the condition of no flow control. RXD, TXD, /CTS and /RTS are needed to be used when selecting hardware flow control to connect other processors. All IO signal should be connected when the module is used as Modem to connect with PC. 4Module wont be hibernated if RxD is high level. Figure 33 Wire serial level conversion circuit Figure 34 wire serial level conversion circuit All Rights reserved, No Spreading abroad without Permission 18 Figure 35 wire serial level conversion circuit Hardware Development Guide of Module Product MC2261 3.5. POWERING THE MODULE USING THE MDB Place the module on the MDB (Module Development Board), then plugging one end of USB cable in PC and another in MDB, if the power supplied by the USB port, the X3 doesnt supplied the power. If not use the USB port, the X3 can supplied the power
(DC5V), when the users power the modules development board, the module will be automatically powered on. The users could power the modules development board in the following two methods:
i. Supplied by USB_VBUS_5V. ii. Supplied by X3 (DC5V). Operating instructions Figure 36 Module Development Board Illustration All Rights reserved, No Spreading abroad without Permission 19 MC2261 Connect the sector to access terminal antenna connectors as shown in the following Figure 3-8 or Figure 3-9. Figure 37 First method to connect the module to RF test equipment Hardware Development Guide of Module Product Figure 38 Second method to connect the module to RF test equipment All Rights reserved, No Spreading abroad without Permission 20 4. ANTENNA INTERFACE MC2261 Hardware Development Guide of Module Product The RF interface of the MC2261 Module has an impedance of 50 ohm. The module is capable of sustaining a total mismatch at the antenna connector or pad without any damage, even when transmitting at maximum RF power. The external antenna must be matched properly to achieve best performance regarding radiated power, DC-power consumption, modulation accuracy and harmonic suppression. Antenna matching networks are not included on the MC2261 Module PCB and should be placed in the host application. Regarding the return loss, the Module provides the following values in the active band:
Table 41 Return Loss in the Active Band State of Module Return Loss of Module Recommended Return Loss of Application Receive Transmit 8dB not applicable 12dB 12dB The connection of the antenna or other equipment must be de coupled from DC voltage. This is necessary because the antenna connector is DC coupled to ground via an inductor for ESD protection. 4.1. ANTENNA INSTALLATION To suit the physical design of individual applications, the MC2261 offers two alternatives approached to connecting the antenna:
Recommended approach: CS-G2-SS1S-1.6S antenna connector manufactured by Percsson assembled on the daughter board. See Section 4.3 for details. CS-G2-SS1S-1.6D antenna connector manufactured by Percsson assembled on the component side of the PCB (top view on Module). See Section 4.3 for details. Antenna pad and grounding plane placed on the bottom side. See Section 4.2 for details. The SSMB-50TKE-10 and NMM22-5017 connectors have been chosen as antenna reference point (ARP) for the ZTE reference equipment submitted to type approve the MC2261 Module. All RF data specified throughout this manual are related to the ARP. For compliance with the test results of the ZTE type approval you are advised to give priority to the connector, rather than using the antenna pad. NOTE: Both solutions can be applied alternatively. This means, if the antenna is connected to the pad, then the connector on the Module must be left empty. If the antenna is connected to daughter board, the connector on the Module must be left empty too. And when the antenna is connected to the Module connector, the pad is useless. 4.2. ANTENNA PAD The antenna pad of the module is soldered to the board on the customer design to connect with RF line. For proper grounding connect the RF line to the ground plane on the bottom of the MC2261 Module which must be connected to the ground plane of the application. Consider that according to CDMA recommendations as 50 connector is mandatory for type approval measurements. It must be ensured that the RF line which is connected to antenna pad should be controlled on 50. Notes on soldering To prevent damage to the Module and to obtain long-term solder joint properties, you are advised to maintain the standards of good engineering practice for soldering. All Rights reserved, No Spreading abroad without Permission 21 MC2261 Hardware Development Guide of Module Product Material Properties MC2261 Module PCB: FR4 Antenna pad: Gold plated pad 4.3. ANTENNA CONNECTOR The MC2261 Module uses a microwave coaxial connector supplied by Murata Ltd. The product name is NMM22-5017. The position of the antenna connector on the Module PCB can be seen in Figure 5-1. Figure 41 Specification of NMM22-5017 connector Table 42 Product specifications of NMM22-5017 connector Rated Contact With Insulation Durability Frequency TEMP Voltage Resistance standing Resistance
(cycles) Rating Range
(V)
(ohm) Voltage
(M ohm)
(GHz)
(degree C) VSWR Center Outer Insulator Contact Contact
(rms) 300 (AC) 500 min. 500 DC - 6.0
-40~+90 1.2 Copper Copper Engineeri max. Alloy Alloy ng plastic
(DC~3 Gold Silver GHz) plated plated 250 0.05 max. Impedance: 50 ohm All Rights reserved, No Spreading abroad without Permission 22 MC2261 The daughter board of MC2261 Module uses a microwave coaxial connector supplied by CNT Ltd. The product name is Hardware Development Guide of Module Product SSMB-50TKE-10. The position of the antenna connector on the daughter PCB can be seen in Figure 5-2. Figure 42 Specification of SSMB-50TKE-10 Table 43 Product specifications of SSMB-50TKE-10 connector Rated Contact Withstanding Insulation Durability Frequency Temperature Voltage Resistance Voltage Resistance
(cycles) Rating Range
(V) 250
(ohm)
(rms)
(M ohm)
(GHz)
(degree C) 0.05 max. 300 (AC) 1000 min. 5000 DC - 3.0
-55~+155 VSWR Center Outer Insulator Contact Contact Copper Copper 1.35 max. Alloy
(DC~3 Gold Alloy Silver Engineerin g plastic Impedance: 50 ohm GHz) plated plated All Rights reserved, No Spreading abroad without Permission 23 5. RF INTERFACE 5.1. OVERVIEW MC2261 Hardware Development Guide of Module Product A 50 ohm coaxial RF connector is provided for Module testing. However, we advise customers lead from the antenna pad at the RF line to the antenna. Figure 51 CDMA Connector Another 50 ohm coaxial RF connector on daughter board is provided for Module testing and customer showing. Figure 52 CDMA Connector on daughter board The integrator must provide a suitable antenna that works in the desired frequency band of operation. The Antenna connected to the CDMA connector should be a dual band antenna supporting the US PCS and Cellular bands. All Rights reserved, No Spreading abroad without Permission 24 Band PCS Cellular MC2261 Hardware Development Guide of Module Product Table 51 The requirement of dual band antenna TX Frequency RX Frequency 1850-1910 MHz 1930-1990 MHz 824-849 MHz 869-894 MHz NOTE: TX refers to the transmit from the module into the antenna (Reverse Link of the CDMA system), and RX refers to the receive from the antenna into the module (Forward Link of the CDMA system). 5.2. ANTENNA SUBSYSTEM The antenna sub-system and its design is a major part of the final product integration. Special attention and care should be taken in adhering to the following guidelines. 5.2.1. ANTENNA SPECIFICATIONS Choice of the antenna cable (type, length, performance, RF loss, etc) and antenna connector (type + losses) can have a major impact on the success of the design. 5.2.2. CABLE LOSS All cables have RF losses. Minimizing the length of the cable between the antenna and the RF connectors on the module will help obtain superior performance. High Quality/Low loss co-axial cables should be used to connect the antenna to the RF connectors. Contact the antenna vendor for the specific type of cable that interfaces with their antenna and ask them to detail the RF losses of the cables supplied along with the antenna. Typically, the cable length should be such that they have no more than 1-2dB of loss. Though the system will work with longer (lossy) cables, this will degrade CDMA system performance. Care should also be taken to ensure that the cable end connectors/terminations are well assembled to minimize losses and to offer a reliable, sturdy connection to the Module sub-system. This is particularly important for applications where the module is mounted on a mobile or portable environment where it is subject to shock and vibration. 5.2.3. ANTENNA GAIN MINIMUM REQUIREMENTS It is recommended that the antenna chosen have at least 2 dBi gain in the cellular band and 4 dBi in the PCS band. The Antenna subsystem shall also have at least 8 dB of return loss at the input with respect to a 50-ohm system. 5.2.4. ANTENNA GAIN MAXIMUM REQUIREMENTS Our FCC Grant imposes a maximum gain for the antenna subsystem: 7 dBi for the Cellular band and 13dBi for the PCS band. Warning: Excessive gain could damage sensitive RF circuits and void the warranty. 5.2.5. ANTENNA MATCHING The modules RF connectors are designed to work with a 50-ohm subsystem. It is assumed that the antenna chosen has matching internal to it to match between the 50-ohm RF connectors and the antenna impedance. All Rights reserved, No Spreading abroad without Permission 25 Figure 53 Antenna Matching Circuit Hardware Development Guide of Module Product MC2261
. 5.2.6. PCB DESIGN CONSIDERATIONS The antenna subsystem should be treated like any other RF system or component. It should be isolated as much as possible from any noise generating circuitry including the interface signals via filtering and shielding. As a general recommendation all components or chips operating at high frequencies such as micro controllers, memory, DC/DC converts and other RF components should not be placed too close to the module. When such cases exist, correct supply and ground de-coupling areas should be designed and validated. Avoid placing the components around the RF connection and close to the RF line between the RF antenna and the module. RF lines and cables should be as short as possible. If using coaxial cable it should not be placed close to devices operating at low frequencies. Signals like charger circuits may require some EMI/RFI decoupling such as filter capacitors or ferrite beads. Adding external impedance matching to improve the match to your cable and antenna assemblies is optional. Please contact the antenna vendor for matching requirements. For better ESD protection one can implement a shock coil to ground and place it close to the RF connector. 5.2.7. OTHER PRECAUTIONS V_MAIN_3V7 are used to supply the module. The module internally regulates these to obtain regulated voltages to supply both the baseband and RF parts of the Module. V_MAIN_3V7 directly supplies the RDF components with 3.7V. It is essential to keep the voltage ripple to a minimum at this connection in order to avoid phase error. Insufficient power supply voltage can dramatically affect some RF performance such as TX power, modulation spectrum EMC performance, and spurious emissions and frequency error. The RF connections are 50-ohm impedance systems and are a DC short to ground. Best effort should be made to provide low insertion loss and shielding between the external antenna and RF connections over the frequency band of interest. 5.2.8. GROUNDING On terminals including the antenna, poor shielding can dramatically affect the sensitivity of the terminal. Moreover the power emitted through the antenna can affect the application. All Rights reserved, No Spreading abroad without Permission 26 MC2261 Hardware Development Guide of Module Product 6. TEST CAPABILITIES 6.1. TEST DESCRIPTION 1) MC2261 RF Connectors are shown in Figure 5-1 Figure 61 CDMA Connector 2) Operating instructions Figure 62 Module Development Board Illustration Connect the sector to access terminal antenna connectors as shown in the following Figure 6-3 or Figure 6-4:
All Rights reserved, No Spreading abroad without Permission 27 MC2261 Figure 63 First method to connect the module to RF test equipment Hardware Development Guide of Module Product Figure 64 Second method to connect the module to RF test equipment Connect the RF antenna to terminal antenna connectors as shown in the following Figure 6-5 or Figure 6-6:
All Rights reserved, No Spreading abroad without Permission 28 Figure 65 First method to connect the module to RF antenna Hardware Development Guide of Module Product MC2261 Figure 66 Second method to connect the module to RF antenna 6.2. CDMA TEST EQUIPMENT AND TOOLS Lease or purchase of test equipment is available from vendors who provide this equipment for CDMA over the-air simulation. Some suggested products include:
Agilent 8960 Series 10 E5515C CDMA Mobile Station Tester Agilent E4440A Spectrum analyzer Agilent E4438C Signal Generator Agilent E4438C Signal Generator Programmable Temperature-Humidity Testor Programmable Temperature Concussion Testor All Rights reserved, No Spreading abroad without Permission 29 6.3. RF PERFORMANCE REQUIREMENTS 6.3.1. CDMA2000 1X RF RX SPECIFICATION MC2261 Hardware Development Guide of Module Product Table 61 CDMA2000 1X RF Rx Specification Frequency range 869~894MHz/1930~1990MHZ Rx. Sensitivity
-104 dBm(FER0.5) Rx. Signal Range
-25 dBm~ -104dBm(FER0.5) Immunity FER1.0(-101dBm/BW , 30dBm@900KHz) (800MHz) FER1.0(-101dBm/BW ,-40dBm@1250KHz) (1900MHz) Inter-modulation spurious FER1.0(Test1: -101dBm/BW ,+900/+1700KHz, -43dBm) emissions FER1.0(Test1: -101dBm/BW ,+1250/+2050KHz, -43dBm) FER1.0(Test 2: -101dBm/BW ,-900/-1700KHz, -43dBm) FER1.0(Test 2: -101dBm/BW,-1250/-2050KHz, -43dBm) Conductive spurious
<-76dBm/1MHz(1930~1990MHz ; 869~894MHz) emissions
< - 61dBm/1MHz(1850~1910MHz ; 824~849MHz)
< - 47dBm/30KHz(other frequency) Demodulation of forward FER3.0(Test 1: Rate Group 1(9600bps) traffic channel in AWGN FER1.0(Test 2: Rate Group 1(9600bps) FER0.5(Test 3: Rate Group 1(9600bps) FER1.0(Test 4: Rate Group 1(4800bps) FER1.0(Test 5: Rate Group 1(2400bps) FER1.0(Test 6: Rate Group 1(1200bps) FER3.0(Test 7: Rate Group 2(14400bps) FER1.0(Test 8: Rate Group 2(14400bps) FER0.5(Test 9: Rate Group 2(14400bps) FER1.0(Test 10: Rate Group 2(7200bps) FER1.0(Test 11: Rate Group 2(3600bps) FER1.0(Test 12: Rate Group 2(1800bps) 6.3.2. CDMA2000 1X RF TX SPECIFICATION:
Table 62 CDMA2000 1X RF Tx Specification Max. frequency tolerance 824~849MHz/1850~1910MHz Max. Tx. Power 300Hz/150Hz Min. output power 800MHz: 23dBm ~ 30dBm@-105.5 dBm Standby output power
< -50dBm@-25 dBm 1900MHz: 18dBm ~ 27dBm@-105.5 dBm All Rights reserved, No Spreading abroad without Permission 30 MC2261 Hardware Development Guide of Module Product Code domain power
<-61dBm Transmitter time error Waveform quality factor 1.0s
>0.944 Open loop power control
(Test 1: -25dBm/1.23MHz)-48dBm/1.23MHz9.5dBm
(Test 2: -65dBm/1.23MHz)-8dBm/1.23MHz9.5dBm
(Test 1: -25dBm/1.23MHz)-51dBm/1.23MHz9.5dBm
(Test 2: -65dBm/1.23MHz)-11dBm/1.23MHz9.5dBm
(Test 3: -93.5dBm/1.23MHz)+20dBm/1.23MHz9.5dBm Close loop power control
(Test 3: -91.3dBm/1.23MHz)+15dBm/1.23MHz9.5dBm 24dB(9600bps data rate) 24dB(4800bps data rate) 24dB(2400bps data rate) 24dB(1200bps data rate) Conductive spurious emissions
-42dBc/30KHz or -54dBm/1.23MHz(|f|: 1.25MHz~1.98MHz)
-54dBc/30KHz or -54dBm/1.23MHz(|f|: 1.98MHz~4.00MHz)
< -13dBm/1KHz(f> 4MHz, 9KHz < f < 150KHz,)
< -13dBm/10KHz(f > 4MHz, 150KHz <f < 30MHz)
< -13dBm/100KHz(f > 4MHz, 30MHz < f < 1GHz)
< -13dBm/1MHz(f> 4MHz, 1GHz < f < 10GHz) Remarks: RF technical specification conforms to the following standards:
3GPP2 C.S0011-C V2.0 Recommended Minimum Performance Standards for cdma2000 Spread Spectrum Mobile Stations 3GPP2 C.S0033-0 V2.0 Recommended Minimum Performance Standards for cmda2000 High Rate Packet Data Access Terminal 6.4. ENVIRONMENTAL RELIABILITY REQUIREMENT 6.4.1. HIGH TEMPERATURE OPERATION TEST EUT Status Temperature Duration Table 63 High Temperature Operation Test Power-on 70 16h 6.4.2. LOW TEMPERATURE OPERATION TEST EUT Status Temperature Duration Table 64 Low Temperature Operation Test Power-on
-25 16h All Rights reserved, No Spreading abroad without Permission 31 MC2261 Hardware Development Guide of Module Product 6.4.3. HIGH TEMPERATURE STORAGE TEST EUT Status Temperature Duration 6.4.4. LOW TEMPERATURE STORAGE TEST EUT Status Temperature Duration Table 65 High Temperature Storage Test Power-off 85 24h Table 66 Low Temperature Storage Test Power-off
-45 24h 6.4.5. HIGH TEMPERATURE HIGH HUMIDITY OPERATION TEST Table 67 High Temperature High Humidity Operation Test EUT Status Temperature Humidity Duration Power-on 55 93%
48h 6.4.6. TEMPERATURE CONCUSSION TEST Table 68 Temperature Concussion Test EUT Status High Temperature High Temperature Duration Low Temperature Low Temperature Duration Cycle Times Power-off 85 1h
-45 1h 10 All Rights reserved, No Spreading abroad without Permission 32 6.5. ELECTRO MAGNETIC COMPATIBILITY 6.5.1. ESD IMMUNITY TEST EUT Status Test Voltage Reference Standard 6.5.2. RADIATED EMISSIONS TEST MC2261 Hardware Development Guide of Module Product Table 69 ESD Immunity Test Idle mode and traffic mode Air 8KV; Contact 6KV IEC 61000-4-2 : 2001 EUT Status Idle mode and traffic mode Table 610 Radiated Emissions Test Limits for radiated disturbance Reference Standard Class B ITE FCC Part15 All Rights reserved, No Spreading abroad without Permission 33
frequency | equipment class | purpose | ||
---|---|---|---|---|
1 | 2016-07-19 | 1850.2 ~ 1909.8 | PCB - PCS Licensed Transmitter | Original Equipment |
2 | JBP - Part 15 Class B Computing Device Peripheral |
app s | Applicant Information | |||||
---|---|---|---|---|---|---|
1 2 | Effective |
2016-07-19
|
||||
1 2 | Applicant's complete, legal business name |
ZTE Corporation
|
||||
1 2 | FCC Registration Number (FRN) |
0009043175
|
||||
1 2 | Physical Address |
ZTE Plaza, Hi-tech Park, Nanshan District
|
||||
1 2 |
Shenzhen, Guangdong, N/A 518057
|
|||||
1 2 |
China
|
|||||
app s | TCB Information | |||||
1 2 | TCB Application Email Address |
c******@telefication.com
|
||||
1 2 | TCB Scope |
B1: Commercial mobile radio services equipment in the following 47 CFR Parts 20, 22 (cellular), 24,25 (below 3 GHz) & 27
|
||||
1 2 |
A1: Low Power Transmitters below 1 GHz (except Spread Spectrum), Unintentional Radiators, EAS (Part 11) & Consumer ISM devices
|
|||||
app s | FCC ID | |||||
1 2 | Grantee Code |
Q78
|
||||
1 2 | Equipment Product Code |
ZTEMC2261
|
||||
app s | Person at the applicant's address to receive grant or for contact | |||||
1 2 | Name |
Y****** X****
|
||||
1 2 | Title |
Product Certification Manager
|
||||
1 2 | Telephone Number |
0086-********
|
||||
1 2 | Fax Number |
0086-********
|
||||
1 2 |
x******@zte.com.cn
|
|||||
app s | Technical Contact | |||||
1 2 | Firm Name |
BV 7Layers Communication Technology (Shenzhen) Co.
|
||||
1 2 | Name |
W**** C******
|
||||
1 2 | Physical Address |
No.B102, Dazu Chuangxin Mansion, North of Beihuan
|
||||
1 2 |
China
|
|||||
1 2 | Telephone Number |
86755********
|
||||
1 2 | Fax Number |
86755********
|
||||
1 2 |
w******@tw.bureauveritas.com
|
|||||
app s | Non Technical Contact | |||||
1 2 | Firm Name |
BV 7Layers Communication Technology (Shenzhen) Co.
|
||||
1 2 | Name |
A******** Q********
|
||||
1 2 | Physical Address |
No.B102, Dazu Chuangxin Mansion, North of Beihuan
|
||||
1 2 |
China
|
|||||
1 2 | Telephone Number |
86755********
|
||||
1 2 | Fax Number |
86755********
|
||||
1 2 |
a******@tw.bureauveritas.com
|
|||||
app s | Confidentiality (long or short term) | |||||
1 2 | Does this application include a request for confidentiality for any portion(s) of the data contained in this application pursuant to 47 CFR § 0.459 of the Commission Rules?: | Yes | ||||
1 2 | Long-Term Confidentiality Does this application include a request for confidentiality for any portion(s) of the data contained in this application pursuant to 47 CFR § 0.459 of the Commission Rules?: | Yes | ||||
1 2 | If so, specify the short-term confidentiality release date (MM/DD/YYYY format) | 01/08/2017 | ||||
if no date is supplied, the release date will be set to 45 calendar days past the date of grant. | ||||||
app s | Cognitive Radio & Software Defined Radio, Class, etc | |||||
1 2 | Is this application for software defined/cognitive radio authorization? | No | ||||
1 2 | Equipment Class | PCB - PCS Licensed Transmitter | ||||
1 2 | JBP - Part 15 Class B Computing Device Peripheral | |||||
1 2 | Description of product as it is marketed: (NOTE: This text will appear below the equipment class on the grant) | CDMA 1X Module | ||||
1 2 | Related OET KnowledgeDataBase Inquiry: Is there a KDB inquiry associated with this application? | No | ||||
1 2 | Modular Equipment Type | Single Modular Approval | ||||
1 2 | Purpose / Application is for | Original Equipment | ||||
1 2 | Composite Equipment: Is the equipment in this application a composite device subject to an additional equipment authorization? | Yes | ||||
1 2 | Related Equipment: Is the equipment in this application part of a system that operates with, or is marketed with, another device that requires an equipment authorization? | No | ||||
1 2 | Grant Comments | Output power is ERP for Part 22 and EIRP for Part 24. This grant is valid only when the module is sold to OEM integrators and must be installed by the OEM or OEM integrators. The antenna(s) used for this transmitter must be used to provide a separation distance of at least 20 cm from all persons and must not be co-located or operating in conjunction with any other antenna or transmitter. OEM integrators and end-users must be provided with antenna installation instructions and transmitter operating conditions for satisfying RF exposure compliance. This device contains functions that are not operational in U.S. Territories. This filing is only applicable for U.S. operations. | ||||
1 2 | Is there an equipment authorization waiver associated with this application? | No | ||||
1 2 | If there is an equipment authorization waiver associated with this application, has the associated waiver been approved and all information uploaded? | No | ||||
app s | Test Firm Name and Contact Information | |||||
1 2 | Firm Name |
Bureau Veritas Shenzhen Co., Ltd. Dongguan Branch
|
||||
1 2 | Name |
A******** H******
|
||||
1 2 | Telephone Number |
86-76******** Extension:
|
||||
1 2 | Fax Number |
86-76********
|
||||
1 2 |
a******@cn.bureauveritas.com
|
|||||
Equipment Specifications | |||||||||||||||||||||||||||||||||||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Line | Rule Parts | Grant Notes | Lower Frequency | Upper Frequency | Power Output | Tolerance | Emission Designator | Microprocessor Number | |||||||||||||||||||||||||||||||||
1 | 1 | 22H | 824.2 | 849 | 0.217 | 0.0128 ppm | 1M27F9W | ||||||||||||||||||||||||||||||||||
1 | 2 | 24E | 1850.2 | 1909.8 | 0.245 | 0.0059 ppm | 1M27F9W | ||||||||||||||||||||||||||||||||||
Line | Rule Parts | Grant Notes | Lower Frequency | Upper Frequency | Power Output | Tolerance | Emission Designator | Microprocessor Number | |||||||||||||||||||||||||||||||||
2 | 1 | 15B |
some individual PII (Personally Identifiable Information) available on the public forms may be redacted, original source may include additional details
This product uses the FCC Data API but is not endorsed or certified by the FCC