Integrated Transceiver Modules for WLAN 802.11 b/g/n, Bluetooth, Bluetooth Low Energy (BLE), and ANT TRANSCEIVER MODULE USER MANUAL FEATURES IEEE 802.11b,g,n,d,e,i compliant Typical WLAN Transmit Power:
o 20.0dBm, 11 Mbps,CCK (b) o 14.5dBm, 54 Mbps,OFDM (g) o 12.5dBm, 65 Mbps,OFDM (n) Typical WLAN Sensitivity:
o -89dBm, 8% PER, 11 Mbps o -76dBm, 10% PER, 54 Mbps o -73dBm, 10% PER, 65 Mbps Bluetooth 2.1+EDR, Power Class 1.5 Full support for BLE 4.0 and ANT Miniature footprint: 18 mm x 13 mm Low height profile: 1.9 mm U.FL connector for external antenna Terminal for PCB/Chip antenna feeds Compact design based on Texas Integrated band-pass filter Instruments WL1271L Transceiver DESCRIPTION The module is a high performance 2.4 GHz IEEE 802.11 b/g/n, Bluetooth 2.1+EDR, and Bluetooth Low Energy (BLE) 4.0 radio in a cost effective, pre-certified footprint. The module realizes the necessary PHY/MAC layers to support WLAN applications in conjunction with a host processor over a SDIO interface. The module also provides a Bluetooth platform through the HCI transport layer. Both WLAN and Bluetooth share the same antenna port. Seamless integration with TI OMAP application processors SDIO Host data path interfaces Bluetooth Advanced Audio Interfaces Low power operation mode RoHS compliant Page1of29 TRANSCEIVER MODULE USER MANUAL TIWI-BLEATA MODULE FOOTPRINT AND PIN DEFINITIONS To apply the module, it is important to use the module pins in your application as they are designated in below and in the corresponding pin definition table found on pages 3 and 4. Not all the pins on the module may be used, as some are reserved for future functionality. Figure 2 Pinout (Top View) Page2of29 PIN DESCRIPTIONS ModulePin 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 Name VBAT BT_FUNC5 WL_UART_DBG WLAN_IRQ BT_EN FM_EN WL_RS232_RX WL_RS232_TX FM_I2S_FSYNC WL_EN VIO GND SDIO_D3 SDIO_D2 SDIO_D1 SDIO_D0 SDIO_CMD SDIO_CLK SLOW_CLK FM_IRQ FM_SDA FM_SCL FM_I2S_CLK FM_I2S_DI FM_I2S_DO FM_AUD_RIN FM_AUD_LIN FMRFOUT FMRFIN GND FM_AUD_ROUT TRANSCEIVER MODULE USER MANUAL I/O Type Buffer Type Logic Level Description PI DO DIO DO DI DI DI DO DO DI PI GND DIO DIO DIO DIO DIO DI DI DO DO DO DO DI DO AI AI AO AI GND AO
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-
Battery Voltage 3.6 VDC Nominal (3.0-4.8 VDC) 4 mA 1.8 VDC HOST_WU (*) 4 mA 1.8 VDC WL_UART_DBG 4 mA 1.8 VDC WLAN Interrupt Request
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-
1.8 VDC Bluetooth Enable 1.8 VDC NOT SUPPORTED, CONNECT TO GND 1.8 VDC WLAN TEST UART RX (*) 4 mA 1.8 VDC WLAN TEST UART TX (*) 4 mA 1.8 VDC NOT SUPPORTED, NO CONNECT
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1.8 VDC WLAN Enable
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POWER SUPPLY FOR 1.8 VDC DIGITAL DOMAIN Ground 8 mA 1.8 VDC SDIO INTERFACE, HOST PULL UP 8 mA 1.8 VDC SDIO INTERFACE, HOST PULL UP 8 mA 1.8 VDC SDIO INTERFACE, HOST PULL UP 8 mA 1.8 VDC SDIO INTERFACE, HOST PULL UP 8 mA 1.8 VDC HOST PULL UP 1.8 VDC HOST PULL UP 1.8 VDC SLEEP CLOCK (32 kHz)
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4 mA 1.8 VDC NOT SUPPORTED, NO CONNECT 4 mA 1.8 VDC NOT SUPPORTED, NO CONNECT 4 mA 1.8 VDC NOT SUPPORTED, NO CONNECT 4 mA 1.8 VDC NOT SUPPORTED, NO CONNECT 4 mA 1.8 VDC NOT SUPPORTED, CONNECT TO GND 4 mA 1.8 VDC NOT SUPPORTED, NO CONNECT
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NOT SUPPORTED, CONNECT TO GND NOT SUPPORTED, CONNECT TO GND NOT SUPPORTED, NO CONNECT NOT SUPPORTED, CONNECT TO GND Ground NOT SUPPORTED, NO CONNECT Page3of29 ModulePin Name I/O Type Buffer Type Logic Level Description TRANSCEIVER MODULE USER MANUAL 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 FM_AUD_LOUT AUD_FSYNC HCI_RX HCI_RTS HCI_TX AUD_CLK AUD_OUT HCI_CTS AUD_IN AO DIO DI DO DIO DO DO DI DI DI DO VDD_LDO_CLASS_1P5 NC GND GND GND GND BT_FUNC2 BT_FUNC4 GND GND GND GND ANT GND GND GND GND RF GND GND GND GND
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NOT SUPPORTED, NO CONNECT 4 mA 1.8 VDC PCM I/F 8 mA 1.8 VDC Bluetooth HCI UART RX (*) 4 mA 1.8 VDC Bluetooth HCI UART RTS (*) 8 mA 1.8 VDC Bluetooth HCI UART TX 4 mA 1.8 VDC PCM I/F (*) 4 mA 1.8 VDC PCM I/F (*) 4 mA 1.8 VDC Bluetooth HCI UART CTS (*) 4 mA 1.8 VDC PCM I/F (*) 4 mA 1.8 VDC Bluetooth Wakeup[DI] / DC2DC mode[DO](*) 4 mA 1.8 VDC BT_UARTD (DEBUG) (*)
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VBAT VOLTAGE PRESENT, NO CONNECT Ground Ground Ground Ground Antenna terminal for WLAN and Bluetooth (Note
[1]) Ground Ground Ground Ground PI = Power Input AI = Analog Input PO = Power Output AO = Analog Output DI = Digital Input (1.8 VDC Logic Level) AIO = Analog Input/Output RF = RF Port GND = Ground DO=Digital Output (1.8 VDC Logic Level) Note[1]: Antenna terminal presents d.c. short circuit to ground.
(*) indicates that pin is capable of bidirectional operation, but is used as the type shown. Table 1 Module Pin Descriptions All digital I/O signals use 1.8V logic. If the host microcontroller does not support 1.8V logic, then level shifters MUST be used. Page4of29 TRANSCEIVER MODULE USER MANUAL ELECTRICAL SPECIFICATIONS The majority of these characteristics are based on controlling and conditioning the tests using the control software application. Other control conditions may require these values to be re- characterized by the customer. Absolute Maximum Ratings Parameter Power supply voltage (VBAT)(4)(5) Digital supply voltage (VIO) Voltage on any GPIO Voltage on any Analog Pins(3) RF input power, antenna port Operating temperature(6) Storage temperature Min
-0.5
-0.5
-0.5
-0.5
-40
-55 Max
+5.5 2.1 VIO + 0.5 2.1
+10
+85
+125 Unit V V V V dBm C C 1. Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device and are not covered by the warranty. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-
maximum-rated conditions for extended periods may affect device reliability. 2. All parameters are measured as follows unless stated otherwise: VDD_IN=1.8V, VDDIO_1.8V=1.8V, VDD_LDO_CLASS1P5=3.6V 3. Analog pins: XTALP, XTALM, RFIOBT, DRPWRXBM, DRPWRXBP, DRPWTXB, and also FMRFINP, FMRFINM, FMRFINM, FMAUDLIN, FMAUDRIN, FMAUDLOUT, FMAUDROUT 4. The following signals are from the VBAT group, PMS_VBAT and VDD_LDO_CLASS1P5 (if BT class 1.5 direct VBAT is 5. Maximum allowed depends on accumulated time at that voltage; 4.8V for 7 years lifetime, 5.5V for 6 hours cumulative. 6. The device can be reliably operated for 5,000 active-WLAN cumulative hours at TA of 85oC. used). Table 2 Absolute Maximum Ratings Recommended Operating Conditions Parameter VBAT VIO VIH VIL VOH @ 4, 8 mA VOL @ 4, 8 mA Ambient temperature range Min 3.0 1.62 0.65 x VIO 0 VIO - 0.45 0
-40 Typ 3.6 1.8
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25 Max 4.8 1.92 VIO 0.35 x VIO VIO 0.45 85 Unit V V V V V V C Table 3 Recommended Operating Conditions Page5of29 General Characteristics Parameter WLAN RF frequency range WLAN RF data rate BT RF frequency Range Min 2412 1 2402 Typ 802.11 b/g/n rates supported Table 4 General Characteristics Test Conditions Min Power Consumption - WLAN Parameter CCK (802.11b) TX Current OFDM (802.11g) TX Current OFDM (802.11n) TX Current CCK (802.11b) RX Current OFDM (802.11g) RX Current OFDM (802.11n) RX Current Dynamic Mode [1]
2437 MHz, VBAT =3.6V, Tamb=+25C Po=20dBm, 11 Mbps CCK L=1200 bytes, tdelay (idle)=4 S 2437 MHz, VBAT =3.6V, Tamb=+25C Po=14.5 dBm, 54 Mbps OFDM L=1200 bytes, tdelay (idle)=4S 2437 MHz, VBAT =3.6V, Tamb=+25C Po=12.5dBm, 65 Mbps OFDM L=1200 bytes, tdelay (idle)=4S
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TRANSCEIVER MODULE USER MANUAL Max 2472 65 Unit MHz Mbps 2480 MHz Typ 280 185 165 100 100 100
<1.2 Max Unit
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mA mA mA mA mA mA mA
[1] Total Current from VBAT for reception of Beacons with DTIM=1 TBTT=100 mS, Beacon duration 1.6ms, 1 Mbps beacon reception in Listen Mode. Table 5 WLAN Power Consumption Page6of29 TRANSCEIVER MODULE USER MANUAL Power Consumption - Bluetooth Parameter Test Conditions Min Typ GFSK TX Current EDR TX Current GFSK RX Current EDR RX Current Deep Sleep Current Constant Transmit, DH5, PRBS9 Constant Transmit, 2DH5,3DH5, PRBS9 Constant Receive, DH1 Constant Receive, 2DH5, 3DH5 Deep Sleep Mode
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45 43 35 41 70 Table 6 Bluetooth Power Consumption DC Characteristics General Purpose I/O Parameter Test Conditions Min Typ VIO Current Logic input low, VIL Logic input high, VIH Logic output low, VOL
(Full Drive) Logic output low, VOL
(Reduced Drive) Logic output high, VOH
(Full Drive) Logic output high, VOH
(Reduced Drive) 0 0.65 x VIO Iout = 8 mA Iout = 4 mA Iout = 1 mA
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Table 7 DC Characteristics General Purpose I/O Iout = 0.09 mA Iout = -8 mA Iout = -4 mA Iout = -1 mA Iout = -0.3 mA VIO - 0.45 VIO - 0.45 VIO - 0.112 VIO - 0.033 0 0 0 0 Max Unit
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Max 16 0.35 x VIO VIO 0.45 0.45 0.112 0.01 VIO VIO VIO VIO mA mA mA mA A Unit mA V V V V V V V V V V Page7of29 TRANSCEIVER MODULE USER MANUAL WLAN RF Characteristics WLAN Transmitter Characteristics
(TA=25C, VBAT=3.6 V) Parameter Test Conditions Min Typ 11 Mbps CCK (802.11b) TX Output Power 9 Mbps OFDM (802.11g) TX Output Power 54 Mbps OFDM (802.11g) TX Output Power 6.5 Mbps OFDM (802.11n) TX Output Power 65 Mbps OFDM (802.11n) TX Output Power 11 Mbps CCK , 802.11(b) Mask Compliance, 35% EVM RMS power over TX packet 9 Mbps OFDM , 802.11(g) Mask Compliance, -8 dB EVM RMS power over TX packet 54 Mbps OFDM, 802.11(g) Mask Compliance, -25 dB EVM RMS power over TX packet 6.5 Mbps OFDM, 802.11(n) Mask Compliance, -5 dB EVM RMS power over TX packet 65 Mbps OFDM, 802.11(n) Mask Compliance, -28 dB EVM RMS power over TX packet
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20 19 14.5 19 12.5 Max Unit
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dBm dBm dBm dBm dBm Table 8 WLAN Transmitter RF Characteristics Page8of29 TRANSCEIVER MODULE USER MANUAL WLAN Receiver Characteristics
(TA=25C, VBAT=3.6 V) [1]
Parameter 1 Mbps CCK (802.11b) RX Sensitivity 11 Mbps CCK (802.11b) RX Sensitivity 9 Mbps OFDM (802.11g) RX Sensitivity 54 Mbps OFDM (802.11g) RX Sensitivity 6.5 Mbps OFDM (802.11n) RX Sensitivity 65 Mbps OFDM (802.11n) RX Sensitivity 11 Mbps CCK (802.11b) RX Overload Level 6 Mbps OFDM (802.11g) RX Overload Level 54 Mbps OFDM (802.11g) RX Overload Level. 65 Mbps OFDM (802.11n) RX Overload Level Test Conditions Min Typ 8% PER 8% PER 10% PER 10% PER 10% PER 10% PER 8% PER 10% PER 10% PER 10% PER
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-97
-89
-90
-76
-91
-73
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Max
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--
-10
-20
-20
-20 Unit dBm dBm dBm dBm dBm dBm dBm dBm dBm dBm
[1] Up to 2 dB degradation at Channel 13 for 11g/n modes and up to 2 dB degradation at Channel 14 for 11b/g/n modes. Table 9 WLAN Receiver RF Characteristics Page9of29 TRANSCEIVER MODULE USER MANUAL Bluetooth RF Characteristics Bluetooth Transmitter GFSK Characteristics, Class 1.5
(TA=25C, VBAT=3.6 V) Test Conditions Min Typ Max Bluetooth Spec Unit Parameter GFSK RF Output Power EDR RF Output Power Power Control Step Size EDR Relative Power 9.5 7 4
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2
-2
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8 1
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2-8
-4/+1 Table 10 Bluetooth Transmitter RF Characteristics Bluetooth Receiver Characteristics
(TA=25C, VBAT=3.6 V) Parameter GFSK Sensitivity EDR 2 Mbps Sensitivity EDR 3 Mbps Sensitivity GFSK Maximum Input Level EDR 2 Maximum Input Level EDR 3 Maximum Input Level Test Conditions BER=0.1%
BER=0.01%
BER=0.01%
BER=0.1%
BER=0.1%
BER=0.1%
Min Typ Max Bluetooth Spec
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-92
-91
-82
-5
-10
-10
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-70
-70
-70
-20
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Table 11 Bluetooth Receiver RF Characteristics Page10of29 dBm dBm dB dB Unit dBm dBm dBm dBm dBm
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TRANSCEIVER MODULE USER MANUAL Bluetooth Low Energy RF Characteristics Bluetooth BLE Transmitter GMSK and EDR Characteristics, Class 1.5
(TA=25C, VBAT=3.6 V) Parameter GMSK RF Output Power Power Control Step Size Test Conditions Min Typ Max BT Spec
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2 10 4
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8
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2-8 Unit dBm dB
(1) BLE spec = 10dBm max can be achieved using normal system losses due to filters etc, or by reducing value through VS command. Table 12 Bluetooth Low Energy Transmitter RF Characteristics Bluetooth BLE Receiver Characteristics
(TA=25C, VBAT=3.6 V) Parameter GMSK Sensitivity GMSK Maximum Input Level Test Conditions PER = 30.8%
PER = 30.8%
Min
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Typ
-92
-5 Max BT Spec
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-70
-20 Unit dBm dBm Table 13 Bluetooth Low Energy Receiver RF Characteristics Page11of29 TRANSCEIVER MODULE USER MANUAL WLAN POWER-UP SEQUENCE The following sequence describes device power-up from shutdown. Only the WLAN Core is enabled; the Bluetooth and FM cores are disabled. Figure 3 Power-up Sequence Requirements 1. No signals are allowed on the IO pins if no IO power is supplied, because the IOs are not 'failsafe. Exceptions are CLK_REQ_OUT, SLOWCLK, XTALP, and AUD_xxx, which are failsafe and can tolerate external voltages with no VDDS and DC2DC". 2. VBAT, VIO, and SLOWCLK must be available before WL_EN. 3. Twakeup = T1 + T2 The duration of T1 is defined as the time from WL_EN=high until Fref is valid for the SoC. T1=~55ms The duration of T2 depends on:
Operating system Host enumeration for the SDIO/WSPI PLL configuration Firmware download Releasing the core from reset Firmware initialization Page12of29 WLAN POWER-DOWN SEQUENCE TRANSCEIVER MODULE USER MANUAL Notes:
1. The DC2DC(1.8V) signal can be monitored on BT_FUNC2 Module Pin (#41) 2. DC_REQ and CLK_REQ are internal signals shown for reference only Figure 4 Module Power-down Sequence Requirements 1. DC_REQ will go low only if WLAN is the only core working. Otherwise if another core is working (e.g BT) it will stay high. 2. CLK_REQ will go low only if WLAN is the only core working. Otherwise if another core is working and using the FREF (e.g BT) it will stay high. 3. If WLAN is the only core that is operating, WL_EN must remain de-asserted for at least 64sec before it is re-asserted. Page13of29 TRANSCEIVER MODULE USER MANUAL BLUETOOTH POWER-UP SEQUENCE The following sequence describes device power up from shutdown. Only the Bluetooth core is enabled;
the WLAN core is disabled.
(A) After this sequence is completed, the device is in the low VIO-leakage state while in shutdown Notes:
1. 2. The DC2DC(1.8V) signal can be monitored on BT_FUNC2 Module Pin (#41) 3. DC_REQ, CLK_REQ, and FREF are internal signals shown for reference only Figure 5 Bluetooth Power-up Sequence Power up requirements:
1. No signals are allowed on the IO pins if no IO power supplied, because the IOs are not 'failsafe'. Exceptions are CLK_REQ_OUT, SLOWCLK, XTALP, and AUD_xxx, which are failsafe and can tolerate external voltages with no VDDS and DC2DC. 2. VDDS and SLOWCLK must be stable before releasing BT_EN. 3. Fast clock must be stable maximum 55 ms after BT_EN goes HIGH. Page14of29 BLUETOOTH POWER-DOWN SEQUENCE TRANSCEIVER MODULE USER MANUAL Notes:
1. The DC2DC(1.8V) signal can be monitored on BT_FUNC2 Module Pin (#41) 2. DC_REQ and CLK_REQ are internal signals shown for reference only Figure 6 Bluetooth Power-down Sequence The module indicates completion of Bluetooth power up sequence by asserting HCI_RTS low. This occurs up to 100 ms after BT_EN goes high. Page15of29 TRANSCEIVER MODULE USER MANUAL ENABLE SCHEME The module has 3 enable pins, one for each core: WL_EN, and BT_EN and FM_EN. Presently, there are 2 modes of active operation now supported: WLAN and Bluetooth. It is recommended that the FM_EN pin be grounded to disable the FM section. It is also recommended that the FM section be disabled by Bluetooth HCI commands. 1. Each core is operated independently by asserting each EN signal to Logic '1'. In this mode it is possible to control each core asynchronously and independently. 2. Bluetooth mode operation. WLAN will be operated through WL_EN asynchronously and independently of Bluetooth. IRQ OPERATION 1. The default state of the WLAN_IRQ prior to firmware initialization is 0. 2. During firmware initialization, the WLAN_IRQ is configured by the SDIO module; a WLAN_IRQ changes its state to 1. 3. A WLAN firmware interrupt is handled as follows:
a. The WLAN firmware creates an Interrupt-to-Host, indicated by a 1-to-0 transition on the WLAN_IRQ line (host must be configured as active-low or falling-edge detect). b. After the host is available, depending on the interrupt priority and other host tasks, it masks the firmware interrupt. The WLAN_IRQ line returns to 1 (0-to-1 transition on the WLAN_IRQ line). c. The host reads the internal register status to determine the interrupt sources - the register is cleared after the read. d. The host processes in sequence all the interrupts read from this register e. The host unmasks the firmware interrupts. 4. The host is ready to receive another interrupt from the WLAN device. Page16of29 TRANSCEIVER MODULE USER MANUAL SLOW (32 KHZ) CLOCK SOURCE REQUIREMENTS The slow clock is always supplied from an external source. It is input on the SLOW_CLK pin, and can be a digital signal in the range of VIO only. For slow clock frequency and accuracy refer to Table 14. The external slow clock must be stable before the system exits from shut down mode. Parameter [1]
Input slow clock frequency Input slow clock accuracy Input transition time Tr/Tf 10% to 90%
Frequency input duty cycle Input voltage limits VIL Input impedance Input capacitance Rise and fall time Phase noise Condition Symbol Min Tr/Tf VIH WLAN, BT Square wave, DC coupled 0 1 kHz 30 0.65 x VDDS 0.35 x VDDS 1 Typ 32768 50
-125 Max
+/-250 100 70 VDDS 5 100 Unit Hz ppm ns
%
Vpeak MW pF ns dBc/Hz
[1] Slow clock is a fail safe input Table 14 Slow Clock Source Requirements Page17of29 TRANSCEIVER MODULE USER MANUAL BLUETOOTH HCI UART Figure 7 Bluetooth UART Timing Table 15 Bluetooth UART Timing Page18of29 TRANSCEIVER MODULE USER MANUAL Figure 8 Bluetooth UART Data Frame Table 16 Bluetooth UART Data Frame Page19of29 TRANSCEIVER MODULE USER MANUAL SDIO INTERFACE TIMING Table 17 SDIO Interface Read (see Figure 9) Figure 9 SDIO Single Block Read Table 18 SDIO Interface Write (see Figure 10) Figure 10 SDIO Single Block Write Page20of29 TRANSCEIVER MODULE USER MANUAL SDIO CLOCK TIMING Table 19 SDIO Clock Timing Figure 11 SDIO Clock Timing Page21of29 SOLDERING RECOMMENDATIONS Recommended Reflow Profile for Lead Free Solder TRANSCEIVER MODULE USER MANUAL Note: The quality of solder joints on the castellations (half vias) where they contact the host board should meet the appropriate IPC Specification. See IPC-A-610-D Acceptability of Electronic Assemblies, section 8.2.4 Castellated Terminations. Figure 12 Reflow Profile Page22of29 TRANSCEIVER MODULE USER MANUAL HANDLING, AND STORAGE Shipping Handling The modules contain a highly sensitive electronic circuitry. Handling without proper ESD protection may destroy or damage the module permanently. ESD protection may destroy or damage the module permanently. Moisture Sensitivity Level (MSL) Per J-STD-020, devices rated as MSL 4 and not stored in a sealed bag with desiccant pack should be baked prior to use. After opening packaging, devices that will be subjected to reflow must be mounted within 72 hours of factory conditions (<30C and 60%
RH) or stored at <10% RH. Bake devices for 48 hours at 125C. Storage Please use this product within 6 months after receipt. Any product used after 6 months of receipt needs to have solderability confirmed before use. The product shall be stored without opening the packing under the ambient temperature from 5 to 35deg.C and humidity from 20 to 70%RH.
(Packing materials, in particular, may be deformed at the temperatures above this range.) Do not store in salty air or in an environment with a high concentration of corrosive gas, such as Cl2, H2S, NH3, SO2, or NOX. Do not store in direct sunlight. The product should not be subject to excessive mechanical shock. CLEANING In general, cleaning the populated modules is strongly discouraged. Residuals under the module cannot be easily removed with any cleaning process. Cleaning with water can lead to capillary effects where water is absorbed into the gap between the host board and the module. The combination of soldering flux residuals and encapsulated water could lead to short circuits between neighboring pads. Water could also damage any stickers or labels. Cleaning with alcohol or a similar organic solvent will likely flood soldering flux residuals into the RF shield, which is not accessible for post-washing inspection. The solvent could also damage any stickers or labels. Ultrasonic cleaning could damage the module permanently. OPTICAL INSPECTION After soldering the Module to the host board, consider optical inspection to check the following:
Proper alignment and centering of the module over the pads. Proper solder joints on all pads. Excessive solder or contacts to neighboring pads, or vias. REWORK The module can be unsoldered from the host board if the Moisture Sensitivity Level (MSL) requirements are met as described in this datasheet. Never attempt a rework on the module replacing individual components. Such actions will terminate warranty coverage. e.g. itself, Page23of29 TRANSCEIVER MODULE USER MANUAL Repeating Reflow Soldering Only a single reflow soldering process is encouraged for host boards. Page24of29 TRANSCEIVER MODULE USER MANUAL AGENCY CERTIFICATIONS FCC ID: F9O-BLEATA, 15.247. IC: 10268B-BLEATA MODEL: BLEATA AGENCY STATEMENTS Federal Communication Commission Interference Statement This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one of the following measures:
Reorient or relocate the receiving antenna. Connect the equipment into an outlet on a circuit different from that to which the receiver is Increase the separation between the equipment and receiver. connected. Consult the dealer or an experienced radio/TV technician for help. This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. FCC CAUTION: Any changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate this equipment. Page25of29 TRANSCEIVER MODULE USER MANUAL Industry Canada Statements This device complies with Industry Canada License-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device. To reduce potential radio interference to other users, the antenna type and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that permitted for successful communication. This device has been designed to operate with the antenna(s) listed below, and having a maximum gain of 1.3dBi (Johnason Chip). Antennas not included in this list or having a gain greater than 1.3 dBi are strictly prohibited for use with this device. The required antenna impedance is 50 ohms. List of all Antennas Acceptable for use with the Transmitter 1) Johanson 2450AT43B100 chip antenna. Cet appareil est conforme aux normes d'Industrie Canada exempts de licence RSS (s). L'opration est soumise aux deux conditions suivantes: (1) cet appareil ne peut pas provoquer d'interfrences et (2) cet appareil doit accepter toute interfrence, y compris les interfrences qui peuvent causer un mauvais fonctionnement de l'appareil. Pour rduire le risque d'interfrence aux autres utilisateurs, le type d'antenne et son gain doiventtre choisis de manire que la puissance isotrope rayonne quivalente (PIRE) ne dpasse pascelle permise pour une communication russie. Cet appareil a t conu pour fonctionner avec l'antenne (s) ci-dessous, et ayant un gain maximal de 1.3dBi (Johnason Chip). Antennes pas inclus dans cette liste ou prsentant un gain suprieur 1,3 dBi sont strictement interdits pour une utilisation avec cet appareil. L'impdance d'antenne requise est de 50 ohms. Liste de toutes les antennes acceptables pour une utilisation avec l'metteur 1) Antenne Johanson puce 2450AT43B100. Page26of29 TRANSCEIVER MODULE USER MANUAL OEM RESPONSIBILITIES TO COMPLY WITH FCC AND INDUSTRY CANADA REGULATIONS The Module has been certified for integration into products only by OEM integrators under the following conditions:
This device is granted for use in Mobile only configurations in which the antennas used for this transmitter must be installed to provide a separation distance of at least 20cm from all person and not be co-located with any other transmitters except in accordance with FCC and Industry Canada multi-
transmitter product procedures. As long as the two conditions above are met, further transmitter testing will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed (for example, digital device emissions, PC peripheral requirements, etc.). IMPORTANT NOTE: In the event that these conditions cannot be met (for certain configurations or co-location with another transmitter), then the FCC and Industry Canada authorizations are no longer considered valid and the FCC ID and IC Certification Number cannot be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC and Industry Canada authorization. Le module de a t certifi pour l'intgration dans des produits uniquement par des intgrateurs OEM dans les conditions suivantes:
Ce dispositif est accord pour une utilisation dans des configurations mobiles seul dans lequel les antennes utilises pour cet metteur doit tre install pour fournir une distance de sparation d'au moins 20cm de toute personne et ne pas tre colocaliss avec les autres metteurs, sauf en conformit avec la FCC et de l'Industrie Canada, multi-metteur procdures produit. Tant que les deux conditions prcites sont runies, les tests de transmetteurs supplmentaires ne seront pas tenus. Toutefois, l'intgrateur OEM est toujours responsable de tester leur produit final pour toutes les exigences de conformit supplmentaires requis avec ce module install (par exemple, les missions appareil numrique, les exigences de priphriques PC, etc.) NOTE IMPORTANTE: Dans le cas o ces conditions ne peuvent tre satisfaites (pour certaines configurations ou de co-implantation avec un autre metteur), puis la FCC et Industrie autorisations Canada ne sont plus considrs comme valides et l'ID de la FCC et IC numro de certification ne peut pas tre utilis sur la produit final. Dans ces circonstances, l'intgrateur OEM sera charg de rvaluer le produit final (y compris l'metteur) et l'obtention d'un distincte de la FCC et Industrie Canada l'autorisation. Page27of29 OEM LABELING REQUIREMENTS FOR END-PRODUCT TRANSCEIVER MODULE USER MANUAL The module is labeled with its own FCC ID and IC Certification Number. The FCC ID and IC certification numbers are not visible when the module is installed inside another device, as such the end device into which the module is installed must display a label referring to the enclosed module. The final end product must be labeled in a visible area with the following:
Contains Transmitter Module FCC ID: F9O-BLEATA Contains Transmitter Module IC: 10268B-BLEATA or Contains FCC ID: F9O-BLEATA Contains IC: 10268B-BLEATA The OEM of the Module must only use the approved antenna(s) listed above, which have been certified with this module. Le module de est tiquet avec son propre ID de la FCC et IC numro de certification. L'ID de la FCC et IC numros de certification ne sont pas visibles lorsque le module est install l'intrieur d'un autre appareil, comme par exemple le terminal dans lequel le module est install doit afficher une etiquette faisant rfrence au module ci-joint. Le produit final doit tre tiquet dans un endroit visible par le suivant:
Contient Module metteur FCC ID: F9O-BLEATA Contient Module metteur IC: 10268B-BLEATA ou Contient FCC ID: F9O-BLEATA Contient IC: 10268B-BLEATA LOEM du module ne doit utiliser l'antenne approuve (s) ci-dessus, qui ont t certifis avec ce module. Page28of29 TRANSCEIVER MODULE USER MANUAL OEM END PRODUCT USER MANUAL STATEMENTS The OEM integrator should not provide information to the end user regarding how to install or remove this RF module or change RF related parameters in the user manual of the end product. The user manual for the end product must include the following information in a prominent location:
This device is granted for use in Mobile only configurations in which the antennas used for this transmitter must be installed to provide a separation distance of at least 20cm from all person and not be co-located with any other transmitters except in accordance with FCC and Industry Canada multi-
transmitter product procedures. Other user manual statements may apply. L'intgrateur OEM ne devrait pas fournir des informations l'utilisateur final en ce qui concerne la faon d'installer ou de retirer ce module RF ou modifier les paramtres RF connexes dans le manuel utilisateur du produit final. Le manuel d'utilisation pour le produit final doit comporter les informations suivantes dans unendroit bien en vue:
Ce dispositif est accord pour une utilisation dans des configurations mobiles seule dans laquelle les antennes utilises pour cet metteur doit tre install pour fournir une distance de sparation d'au moins 20cm de toute personne et ne pas tre co-localiss avec les autres metteurs, sauf en conformit avec FCC et Industrie Canada, multi-metteur procdures produit. Autres dclarations manuel de l'utilisateur peuvent s'appliquer. Page29of29