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User Manual | Users Manual | 2.37 MiB | February 24 2023 / July 12 2023 | delayed release | ||
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Internal Photos | Internal Photos | 141.20 KiB | February 24 2023 / July 12 2023 | delayed release | ||
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Antenna Datasheet | RF Exposure Info | 2.07 MiB | February 24 2023 / February 27 2023 | |||
1 2 | Block Diagram | Block Diagram | February 24 2023 | confidential | ||||
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1 2 | Operational Description | Operational Description | February 24 2023 | confidential | ||||
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RF Exposure Report | RF Exposure Info | 288.40 KiB | February 24 2023 / February 27 2023 | |||
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RF Exposure | RF Exposure Info | 443.95 KiB | February 24 2023 / February 27 2023 |
1 2 | User Manual | Users Manual | 2.37 MiB | February 24 2023 / July 12 2023 | delayed release |
Datasheet DSU840 Module Rev 1.0
@Copyright 2023 Delphian Systems LLC., USA CONTENTS 1 2 3 4 5 1.1 1.2 2.1 3.1 3.2 3.3 4.1 4.2 5.1 5.2 5.3 5.4 5.5 5.6 5.7 5.8 3.2.1 3.2.2 Overview and Key Features ................................................................................................................................................... 4 Features and Benefits ................................................................................................................................................... 4 Application Areas .......................................................................................................................................................... 4 Specification ........................................................................................................................................................................... 4 Specification Summary ................................................................................................................................................. 4 Hardware Specifications ........................................................................................................................................................ 8 Pin Definitions ............................................................................................................................................................... 9 Electrical Specifications .............................................................................................................................................. 14 Absolute Maximum Ratings .................................................................................................................................. 14 Recommended Operating Parameters ................................................................................................................. 15 Programmability .......................................................................................................................................................... 18 3.3.1 DSU840 Special Function Pins in smartBASIC .................................................................................................... 18 Power Consumption ............................................................................................................................................................. 19 Power Consumption ................................................................................................................................................... 19 Peripheral Block Current Consumption ....................................................................................................................... 21 Functional Description ......................................................................................................................................................... 22 Power Management .................................................................................................................................................... 22 DSU840 Power Supply Options .................................................................................................................................. 22 Clocks and Timers ...................................................................................................................................................... 24 Clocks ................................................................................................................................................................... 24 Timers ................................................................................................................................................................... 24 Radio Frequency (RF) ................................................................................................................................................ 24 USB interface ............................................................................................................................................................. 25 SPI Bus ....................................................................................................................................................................... 25 I2C Interface ............................................................................................................................................................... 25 General Purpose I/O, ADC, PWM and FREQ ............................................................................................................. 26 GPIO ..................................................................................................................................................................... 26 ADC ...................................................................................................................................................................... 26 PWM Signal Output on up to 16 SIO Pins ............................................................................................................ 26 FREQ Signal Output on up to 16 SIO Pins ........................................................................................................... 27 nRESET pin ................................................................................................................................................................ 27 Two-Wire Interface JTAG ........................................................................................................................................... 27 DSU840 Wakeup ........................................................................................................................................................ 28 5.11.1 Waking Up DSU840 from Host ............................................................................................................................. 28 Low Power Modes ...................................................................................................................................................... 28 Temperature Sensor ................................................................................................................................................... 28 Security/Privacy .......................................................................................................................................................... 29 5.14.1 Random Number Generator ................................................................................................................................. 29 5.8.1 5.8.2 5.8.3 5.8.4 5.3.1 5.3.2 5.9 5.10 5.11 5.12 5.13 5.14
@Copyright 2023 Delphian Systems LLC., USA 2 6 5.15 7.1 7.2 6.1 6.2 6.3 5.14.2 AES Encryption/Decryption ................................................................................................................................... 29 5.14.3 ARM Cryptocell ..................................................................................................................................................... 29 5.14.4 Readback Protection ............................................................................................................................................. 29 5.14.5 Elliptic Curve Cryptography .................................................................................................................................. 29 Optional External 32.768 kHz crystal .......................................................................................................................... 29 Hardware Integration Suggestions ....................................................................................................................................... 31 Circuit ......................................................................................................................................................................... 31 PCB Layout on Host PCB - General ........................................................................................................................... 32 External Antenna Integration with the DSU840 .......................................................................................................... 32 7 Mechanical Details ............................................................................................................................................................... 33 DSU840 Mechanical Details ....................................................................................................................................... 33 Reflow Parameters ..................................................................................................................................................... 33 Reliability Tests .................................................................................................................................................................... 35 Regulatory............................................................................................................................................................................ 35 Certified Antennas ...................................................................................................................................................... 36 Documentation Requirements .................................................................................................................................... 36 FCC Regulatory .......................................................................................................................................................... 36 Antenna Information ................................................................................................................................................... 36 FCC Documentation Requirements ............................................................................................................................ 37 ISED (Canada) Regulatory .................................................................................................................................................. 38 Antenna Information ................................................................................................................................................... 38 10.1 Industry Canada Statement ...................................................................................................................................................... 38 ISED ICES-003 Issue 7 Compliance Declaration ....................................................................................................... 39 10.2 9.1 9.2 9.3 9.4 9.5 8 9 10
@Copyright 2023 Delphian Systems LLC., USA 3 OVERVIEW AND KEY FEATURES 1 Every DSU840 Series module is designed to simplify OEMs enablement of ANT and Bluetooth Low Energy (BLE) v5.1 to small, portable, power-conscious devices. The DSU840 provides engineers with considerable design flexibility in both hardware and software programming capabilities. Based on the world-leading Nordic Semiconductor nRF52840 chipset, the DSU840 modules provide ultra-low power consumption with outstanding wireless range via +8 dBm of transmit power and the Long Range
(CODED PHY) Bluetooth 5 feature. The DSU840 is programmable via Laird Connectivitys smartBASIC language or Nordics software development kit (SDK). smartBASIC is an event-driven programming language that is highly optimized for memory-constrained systems such as embedded modules. It was designed to make BLE development quicker and simpler, vastly cutting down time to market. The Nordic SDK, on the other hand, offers developers source code (in C) and precompiled libraries containing BLE and ANT+
device profiles, wireless communication, as well as application examples. Note:
DSU840 hardware provides all functionality of the nRF52840 chipset used in the module design. This is a hardware datasheet only it does not cover the software aspects of the DSU840. For customers using the Nordic SDK, refer to www.nordicsemi.com. 1.1 Features and Benefits Bluetooth v5.1 Single mode ANT External antennas Multiple programming options smartBASIC AT command set shim or Nordic SDK in C Compact footprint Programmable Tx power +8 dBm to -20 dBm, -40 dBm Rx sensitivity -95 dBm (1 Mbps), - 103 dBm (125 kbps) Ultra-low power consumption Tx 4.8 mA peak (at 0 dBm, DCDC on)
(See Note 1 in the Power Consumption section) Rx: 4.6 mA peak (DCDC on)
(See Note 1 in the Power Consumption section) 1.2 Application Areas Medical devices IoT Sensors Appcessories 2 SPECIFICATION 2.1 Specification Summary Categories/Feature Implementation Standby Doze 3.1 uA typical Deep Sleep 0.4 uA (See Note 4 in the Power Consumption section) UART, GPIO, ADC, PWM, FREQ output, timers, I2C, SPI, I2S, PDM, and USB interfaces Fast time-to-market FCC and ISED certified No external components required Industrial temperature range (-40 C to +85 C) Fitness sensors Location awareness Home automation Wireless Specification Bluetooth BT 5.1 Single mode 4x Range (CODED PHY support) BT 5.1
@Copyright 2023 Delphian Systems LLC., USA 4 Categories/Feature 2x Speed (2M PHY support) BT 5.1 LE Advertising Extensions BT 5.1 Implementation Concurrent master, slave BLE Mesh capabilities Diffie-Hellman based pairing (LE Secure Connections) BT 4.2 Data Packet Length Extension BT 4.2 Link Layer Privacy (LE Privacy 1.2) BT 4.2 LE Dual Mode Topology BT 4.1 LE Ping BT 4.1 79 selectable RF channels (2402 to 2480 MHz) Flexible network topologies: peer-to-peer, star, tree, high node count, mesh and more Broadcast, acknowledged, and burst data communication modes Built-in device search and pairing Built-in interference handling and radio coexistence management with application radio disable requests and application flash write/erase requests Enhanced ANT features:
Supports up to 15 logical channels each with configurable channel periods ANT Features
(5.2ms - 2s) Advanced burst data transfer modes (up to 60kbps) Optional channel encryption mode (AES-128) Supports up to 8 public, private and/or managed networks Advanced power management features to optimize application power consumption including Event Filtering and Selective Data Updates Fast channel initiation Asynchronous transmit channel High duty search Time synchronization Frequency 2.402 - 2.480 GHz Raw Data Rates Maximum Transmit Power Setting
(See Error! Reference source not found. in the Module Specification Notes) Minimum Transmit Power Setting 1 Mbps BLE (over-the-air) 2 Mbps BLE (over-the-air) 125 kbps BLE (over-the-air) 500 kbps BLE (over-the-air)
+8 dBm Conducted DSU840 (External antenna)
-40 dBm, -20 dBm (in 4 dB steps)
-16 dBm, -12 dBm, - 8 dBm, - 4 dBm, 0 dBm, 2 dBm, 4 dBm, 5 dBm, 6 dBm, 7 dBm, Receive Sensitivity (37byte packet) Link Budget (conducted) Host Interfaces and Peripherals BLE 1 Mbps (BER=1E-3)
-95 dBm typical BLE 2 Mbps BLE 125 kbps BLE 500 kbps
-92 dBm typical
-103 dBm typical
-99 dBm typical 103 dB 111 dB
@ BLE 1 Mbps
@ BLE 125 kbps Total 48 x multifunction I/O lines
@Copyright 2023 Delphian Systems LLC., USA 5 Categories/Feature Implementation 2 UARTs Tx, Rx, CTS, RTS UART USB DCD, RI, DTR, DSR (See Note 2Error! Reference source not found. in the Module Specification Notes) Default 115200, n, 8, 1 From 1,200 bps to 1 Mbps USB 2.0 FS (Full Speed, 12Mbps). CDC driver / Virtual UART (baud rate TBD) Other USB drivers available via Nordic SDK Up to 48, with configurable:
I/O direction, GPIO O/P drive strength (standard 0.5 mA or high 3mA/5 mA), Pull-up /pull-down Input buffer disconnect Eight 8/10/12-bit channels 0.6 V internal reference ADC Configurable 4, 2, 1, 1/2, 1/3, 1/4, 1/5 1/6(default) pre-scaling Configurable acquisition time 3uS, 5uS, 10uS (default), 15uS, 20uS, 40uS. PWM Output FREQ Output I2C SPI QSPI One-shot mode PWM outputs on 16 GPIO output pins. PWM output duty cycle: 0%-100%
PWM output frequency: Up to 500kHz FREQ outputs on 16 GPIO output pins. FREQ output frequency: 0 MHz-4MHz (50% duty cycle) Two I2C interface (up to 400 kbps) See Note 3 in the Module Specification Notes Four SPI Master Slave interface (up to 4 Mbps) One 32-MHz QSPI interface. Gives XIP (Execution in Place) capability. External serial flash IC must be fitted as per Nordic specifications. One temperature sensor. Temperature Sensor Temperature range equal to the operating temperature range. RSSI Detector 2 dB accuracy (valid over -90 to -20 dBm) Resolution 0.25 degrees. One RF received signal strength indicator I2S PDM One dB resolution One inter-IC sound interface One pulse density modulation interface Optional (External to the DSU840 module) External 32.768 kHz crystal For customer use, connect +/-20ppm accuracy crystal for more accurate protocol timing.
@Copyright 2023 Delphian Systems LLC., USA 6 Categories/Feature Implementation Profiles Services supported Programmability smartBASIC Central Mode Peripheral Mode Mesh (with custom models) Custom and adopted profiles FW upgrade via JTAG or UART Application download via UART or Via Over-the-Air (if SIO_02 pin is pulled high externally) Nordic SDK Via JTAG Operating Modes smartBASIC Self-contained Run mode Selected by nAutoRun pin status: LOW (0V). Then runs $autorun$ (smartBASIC application script) if it exists. Interactive/Development mode HIGH (VDD). Then runs via at+run (and file name of smartBASIC application script). Nordic SDK As per Nordic SDK Supply Voltage Supply (VDD or VDD_HV) options Normal voltage mode VDD 1.7- 3.6 V Internal DCDC converter or LDO
(See Note 4 in the Module Specification Notes) OR High voltage mode VDD_HV 2.5V-5.5V Internal DCDC converter or LDO
(See Note 4 and Note 5 in the Module Specification Notes) Power Consumption Active Modes Peak Current (for maximum Tx power +8 dBm) Radio only Active Modes Peak Current (for Tx power -40 dBm) Radio only 14.8 mA peak Tx (with DCDC) 4.6 mA peak Tx (with DCDC) Active Modes Average Current Depends on many factors, see Power Consumption Ultra-low Power Modes Standby Doze Deep Sleep 3.1 uA typical 0.4 uA Physical Dimensions Weight Environmental Operating Storage 15.0 mm x 10 mm x 2.2 mm Pad Pitch 0.8 mm Pad Type Two rows of pads
<1 gram
-40 C to +85 C
-40 C to +85 C
@Copyright 2023 Delphian Systems LLC., USA 7 Categories/Feature Implementation Miscellaneous Lead Free Module Specification Notes:
Lead-free and RoHS compliant Note 2 DSR, DTR, RI, and DCD can be implemented in the smartBASIC application or through the Nordic SDK. Note 3 With I2C interface selected, pull-up resistors on I2C SDA and I2C SCL must be connected externally as per I2C standard. Note 4 Use of the internal DCDC convertor or LDO is decided by the underlying BLE stack. Note 5 Nordic Errata 197 and 202 related to the use of VDD_HV DCDC convertor, for details refer to http://infocenter.nordicsemi.com/pdf/nRF52840_Rev_1_Errata_v1.1.pdf. Nordic Errata 202 means no external current draw (from VDD pin) is allowed during power up and VDD_HV rise time (to 3V) is below one mS. 3 HARDWARE SPECIFICATIONS Figure 1: Functional HW and SW block diagram for DSU840 series BLE module
@Copyright 2023 Delphian Systems LLC., USA 8 Figure 2: DSU840 module pin-out (top view). Outer row pads (long red line) and inner row pads (short red line) shown. 3.1 Pin Definitions Table 1: Pin definitions Pin
Pin Name Default Function Alternate Function In/
Out 0 1 2 3 4 5 6 7 8 GND
SWDIO SWDIO SIO_36 SIO_36 SWDCLK SWDCLK SIO_34 SIO_34
IN IN IN
SIO_35/
nAutoRUN nAutoRUN SIO_35 IN SIO_33 SIO_33 SIO_32 SIO_32 SIO_25 SIO_25 IN IN IN
Pull Up/
Down
PULL-
UP PULL-
UP PULL-
DOWN PULL-
UP PULL-
DOWN PULL-
UP PULL-
UP PULL-
UP nRF52840 QFN Pin nRF52840 QFN Name Comment
AC24 SWDIO U24 P1.04 AA24 SWDCLK W24 P1.02 V23 P1.03 Y23 P1.01 AD22 P1.00 AC21 PO.25
Laird Devkit: FTDI USB_DTR via jumper on J12pin1-2.
Laird Devkit:
BUTTON4
@Copyright 2023 Delphian Systems LLC., USA 9 Pin
Pin Name Default Function Alternate Function In/
Out 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 SIO_23 SIO_23 QSPI_DIO3 IN SIO_24 SIO_24 IN SIO_22 SIO_22 QSPI_DIO2 IN SIO_21 SIO_21 QSPI_DIO1 IN SIO_20 SIO_20 QSPI_DIO0 IN SIO_19 SIO_19 QSPI_CLK D+
D+
SIO_17 SIO_17 QSPI_CS D-
D-
SIO_15 SIO_15
nRESET nRESET SIO_18 SIO_13 SIO_13 SIO_16 SIO_16 SIO_14 SIO_14 GND VBUS VDD_HV GND
SIO_11 SIO_11 SIO_12 SIO_12
IN IN IN IN IN IN IN IN IN
IN IN SIO_08/
UART_RX SIO_08 UART_RX IN Pull Up/
Down PULL-
UP PULL-
UP PULL-
UP PULL-
UP PULL-
UP PULL-
UP PULL-
UP PULL-
UP PULL-
UP PULL-
UP PULL-
UP PULL-
UP
PULL-
UP PULL-
UP PULL-
UP nRF52840 QFN Pin nRF52840 QFN Name Comment AC19 PO.23
AD20 PO.24 AD18 PO.22 AC17 PO.21 AD16 AC15 AD6 AD12 AD4 AD10 PO.20 PO.19 D+
PO.17 D-
Laird Devkit:
BUTTON3
PO.15 Laird Devkit: LED3 AC13 PO.18 System Reset (Active Low) AD8 PO.13 Laird Devkit: LED1 AC11 PO.16 Laird Devkit: LED4 AC9 PO.14 Laird Devkit: LED2
T2 U1
PO.11
4.35V 5.5V 2.5V to 5.5V
Laird Devkit:
BUTTON1 PO.12 BUTTON2 N1 PO.08 30 SIO_41/
SPI_CLK SIO_41 SPI_CLK IN PULL-
UP R1 P1.09
@Copyright 2023 Delphian Systems LLC., USA 10 UARTCLOSE() selects DIO functionality. UARTOPEN() selects UART COMMS behavior Laird Devkit: SPI EEPROM. SPI_Eeprom_CLK, Output:
SPIOPEN() in smartBASIC selects SPI function, MOSI and CLK are outputs when in SPI master mode. Pin
31 Pin Name Default Function Alternate Function In/
Out Pull Up/
Down nRF52840 QFN Pin nRF52840 QFN Name Comment VDD
32 SIO_40/
SPI_MOSI SIO_40 SPI_MOSI IN PULL-
UP P2 P1.08 33 GND
34 SIO_04/
AIN2/
SPI_MISO SIO_04 AIN2/
SPI_MISO IN PULL-
UP J1 PO.04/AIN2 SIO_06/
UART_TX SIO_26/
I2C_SDA SIO_07/
UART_CTS SIO_27/
I2C_SCL SIO_05/
UART_RTS/
AIN3 SIO_06 UART_TX OUT SIO_26 I2C_SDA IN SIO_07 UART_CTS IN SIO_27 I2C_SCL IN SIO_05 UART_RTS/
AIN3 OUT Set High in FW PULL-
UP PULL-
DOWN PULL-
UP Set Low in FW L1 PO.06 G1 PO.26 M2 PO.07 H2 PO.27 K2 PO.05/AIN3 1.7V to 3.6V Laird Devkit: SPI EEPROM. SPI_Eeprom_MOSI, Output SPIOPEN() in smartBASIC selects SPI function, MOSI and CLK are outputs in SPI master.
Laird Devkit: SPI EEPROM. SPI_Eeprom_MISO, Input. SPIOPEN() in smartBASIC selects SPI function; MOSI and CLK are outputs when in SPI master mode UARTCLOSE() selects DIO functionality. UARTOPEN() selects UART COMMS behaviour Laird Devkit: I2C RTC chip. I2C data line. UARTCLOSE() selects DIO functionality. UARTOPEN() selects UART COMMS behaviour Laird Devkit: I2C RTC chip. I2C clock line. UARTCLOSE() selects DIO functionality. UARTOPEN() selects UART COMMS behaviour GND
SIO_01/
XL2 SIO_00/
XL1 SIO_01 XL2 IN SIO_00 XL1 IN PULL-
UP PULL-
UP F2 PO.01/XL2 D2 PO.00/XL1 Laird Devkit: Optional 32.768kHz crystal pad XL2 and associated load capacitor. Laird Devkit: Optional 32.768kHz crystal pad XL1 and associated
@Copyright 2023 Delphian Systems LLC., USA 11 35 36 37 38 39 40 41 42 Pin
Pin Name Default Function Alternate Function In/
Out 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 GND SIO_31/
AIN7 SIO_30/
AIN6 SIO_28/
AIN4 GND SIO_29/
AIN5 SIO_03/
AIN1 SIO_02/
AIN0
SIO_31 AIN7 SIO_30 AIN6 SIO_28 AIN4
SIO_29 AIN5 SIO_03 AIN1
IN IN IN
IN IN SIO_02 AIN0 IN SIO_46 SIO_46 GND
SIO_47 SIO_47 SIO_44 SIO_44 GND
SIO_45 SIO_45
NFC2/
SIO_10 GND NFC1/
SIO_09 NFC2 SIO_10
NFC1 SIO_09 SIO_43 SIO_43 SIO_37 SIO_37 SIO_42 SIO_42 SIO_38 N/C SIO_39 SIO_39 GND GND
IN
IN IN
IN IN
IN IN IN IN IN IN
Pull Up/
Down
PULL-
UP PULL-
UP PULL-
UP
PULL-
UP PULL-
UP PULL-
DOWN PULL-
UP
PULL-
UP PULL-
UP
PULL-
UP
PULL-
UP PULL-
UP PULL-
UP PULL-
UP PULL-
UP
nRF52840 QFN Pin nRF52840 QFN Name Comment load capacitor.
A8 B9
PO.31/AIN7 PO.30/AIN6 B11 PO.28/AIN4
A10 PO.29/AIN5 B13 PO.03/AIN1 A12 PO.02/AIN0 B15
A14 B17
A16 P1.14
P1.15 P1.12
P1.13 J24 PO.10/NFC2
L24 PO.09/NFC1 B19 T23 A20 P1.11 P1.05 P1.10
Laird Devkit: Temp Sens Analog Internal pull-down. Pull High externally to enter VSP (Virtual Serial Port) Service.
Laird Devkit: SPI EEPROM. SPI_Eeprom_CS, Input
R24 P1.06 Reserved for future use. Do not connect. P23 P1.07
@Copyright 2023 Delphian Systems LLC., USA 12 Pin
67 68 69 70 71 Pin Name Default Function Alternate Function In/
Out GND GND GND GND GND
Pull Up/
Down
Pin Definition Notes:
nRF52840 QFN Pin nRF52840 QFN Name Comment
Note 1 SIO = Signal Input or Output. Secondary function is selectable in smartBASIC application or via Nordic SDK. I/O voltage level tracks VDD. AIN = Analog Input. Note 2 At reset, all SIO lines are configured as the defaults shown above. SIO lines can be configured through the smartBASIC application script to be either inputs or outputs with pull-ups or pull-downs. When an alternative SIO function is selected (such as I2C or SPI), the firmware does not allow the setup of internal pull-up/pull-down. Therefore, when I2C interface is selected, pull-up resistors on I2C SDA and I2C SCL must be connected externally as per I2C standard. Note 3 JTAG (two-wire SWD interface), pin 1 (SWDIO) and pin 3 (SWDCLK). JTAG is required because Nordic SDK applications can only be loaded using JTAG (smartBASIC firmware can be loaded using the JTAG as well as UART). We recommend that you use JTAG (2-wire interface) to handle future DSU840 module smartBASIC firmware upgrades. You MUST wire out the JTAG (2-wire interface) on your host design (see Figure 2, where four lines (SWDIO, SWDCLK, GND and VDD) should be wired out. smartBASIC firmware upgrades can still be performed over the DSU840 UART interface, but this is slower (60 seconds using UART vs. 10 seconds when using JTAG) than using the DSU840 JTAG (2-wire interface). Upgrading smartBASIC firmware or loading the smartBASIC applications is done using the UART interface. Note 4 Pull the nRESET pin (pin 19) low for minimum 100 milliseconds to reset the DSU840. Note 5 The SIO_02 pin (pin 50) must be pulled high externally to enable VSP (Virtual Serial Port) which would allow OTA
(over-the-air) smartBASIC application download. Refer to the latest firmware release documentation for details. Note 6 Ensure that SIO_02 (pin 50) and AutoRUN (pin 5) are not both high (externally), in that state, the UART is bridged to Virtual Serial Port service; the DSU840 module does not respond to AT commands and cannot load smartBASIC application scripts. Note 7 Pin 5 (nAutoRUN) is an input, with active low logic. In the development kit it is connected so that the state is driven by the hosts DTR output line. The nAutoRUN pin must be externally held high or low to select between the following two DSU840 operating modes:
Self-contained Run mode (nAutoRUN pin held at 0V this is the default (internal pull-down enabled)) The smartBASIC firmware checks for the status of nAutoRUN during power-up or reset. If it is low and if there is a smartBASIC application script named $autorun$, then the smartBASIC firmware executes the application script automatically; hence the name Self-contained Run Mode. Interactive/Development mode (nAutoRUN pin held at VDD) Note 8 The smartBASIC firmware has SIO pins as Digital (Default Function) INPUT pins, which are set PULL-UP by default. This avoids floating inputs (which can cause current consumption to drive with time in low power modes
(such as Standby Doze). You can disable the PULL-UP through your smartBASIC application. All of the SIO pins (with a default function of DIO) are inputs (apart from SIO_05 and SIO_06, which are outputs):
SIO_06 (alternative function UART_TX) is an output, set High (in the firmware). SIO_05 (alternative function UART_RTS) is an output, set Low (in the firmware). SIO_08 (alternative function UART_RX) is an input, set with internal pull-up (in the firmware). SIO_07 (alternative function UART_CTS) is an input, set with internal pull-down (in the firmware). SIO_02 is an input set with internal pull-down (in the firmware). It is used for OTA downloading of
@Copyright 2023 Delphian Systems LLC., USA 13 Pin Definition Notes:
smartBASIC applications. Refer to the latest firmware extension documentation for details. UART_RX, UART_TX, and UART_CTS are 3.3 V level logic (if VDD is 3.3 V; such as SIO pin I/O levels track VDD). For example, when Rx and Tx are idle, they sit at 3.3 V (if VDD is 3.3 V). Conversely, handshaking pins CTS and RTS at 0V are treated as assertions. Note 9 DSU840 also allows as an option to connect an external higher accuracy (20 ppm) 32.768 kHz crystal to the DSU840 pins SIO_01/XL2 (pin 41) and SIO_00/XL1 (pin 42). This provides higher accuracy protocol timing and helps with radio power consumption in the system standby doze/deep sleep modes by reducing the time that the Rx window must be open. Note 10 Not required for DSU840 module normal operation. The on-chip 32.768kHz LFRC oscillator provides the standard accuracy of 500 ppm, with calibration required every 8seconds (default) to stay within 500 ppm. DSU840 power supply options:
Option 1 Normal voltage power supply mode entered when the external supply voltage is connected to both the VDD and VDD_HV pins (so that VDD equals VDD_HV). Connect external supply within range 1.7V to 3.6V range to DSU840 VDD and VDD_HV pins. OR Option 2 High voltage mode power supply mode (using DSU840 VDD_HV pin) entered when the external supply voltage in ONLY connected to the VDDH pin and the VDD pin is not connected to any external voltage supply. Connect external supply within range 2.5V to 5.5V range to DSU840 VDD_HV pin. DSU840 VDD pin left unconnected. Nordic Errata 197 and 202 related to the use of VDD_HV DCDC convertor, for details refer to http://infocenter.nordicsemi.com/pdf/nRF52840_Rev_1_Errata_v1.1.pdf. Nordic Errata 202 means no external current draw (from VDD pin) is allowed during power up and VDD_HV rise time (to 3V) is below one millisecond. For either option, if you use USB interface then the DSU840 VBUS pin must be connected to external supply within the range 4.35V to 5.5V. When using the DSU840 VBUS pin, you MUST externally fit a 4.7uF to ground. 3.2 Electrical Specifications 3.2.1 Absolute Maximum Ratings Absolute maximum ratings for supply voltage and voltages on digital and analogue pins of the module are listed below;
exceeding these values causes permanent damage. Table 2: Maximum current ratings Parameter Voltage at VDD pin Voltage at VDD_HV pin VBUS Voltage at GND pin Voltage at SIO pin (at VDD3.6V) Voltage at SIO pin (at VDD3.6V) Radio RF input level Environmental Storage temperature MSL (Moisture Sensitivity Level) ESD (as per EN301-489) Min
-0.3
-0.3
-0.3
-0.3
-0.3
-40
Max
+3.9 (Note 1)
+5.8
+5.8 0 VDD +0.3 3.9 10
+85 4 Unit V V V V V V dBm C
@Copyright 2023 Delphian Systems LLC., USA 14 Parameter Conductive Air Coupling Flash Memory (Endurance) (Note 2) Flash Memory (Retention) Maximum Ratings Notes:
Min
Max 4 8 Unit KV KV 10000 Write/erase cycles 10 years at 40C
Note 1 The absolute maximum rating for VDD_nRF pin (max) is 3.9V for the DSU840. Note 2 Wear levelling is used in file system. 3.2.2 Recommended Operating Parameters Table 3: Power supply operating parameters Parameter VDD (independent of DCDC)1 supply range VDD_HV (independent of DCDC) supply range VBUS USB supply range VDD Maximum ripple or noise2 VDD supply rise time (0V to 1.7V)3 Time in Power Min 1.7 2.5 4.35
VDD_HV supply rise time (0V to 3.7V) 3 Operating Temperature Range
-40 Recommended Operating Parameters Notes:
Typ 3.3 3.7 5
Max Unit 3.6 5.5 5.5 10 60 100
+85 V V V mV mS mS mS mS mS C Note 1 4.7 uF internal to module on VDD. The internal DCDC convertor or LDO is decided by the underlying BLE stack. Note 2 This is the maximum VDD or VDD_HV ripple or noise (at any frequency) that does not disturb the radio. Note 3 The on-board power-on reset circuitry may not function properly for rise times longer than the specified maximum. Note 4 DSU840 power supply options:
Option 1 Normal voltage power supply mode entered when the external supply voltage is connected to both the VDD and VDD_HV pins (so that VDD equals VDD_HV). Connect external supply within range 1.7V to 3.6V range to DSU840 VDD and VDD_HV pins. OR Option 2 High voltage mode power supply mode (using DSU840 VDD_HV pin) entered when the external supply voltage in ONLY connected to the VDD_HV pin and the VDD pin is not connected to any external voltage supply. Connect external supply within range 2.5V to 5.5V range to DSU840 VDD_HV pin. DSU840 VDD pin left unconnected. Nordic Errata 197 and 202 related to the use of VDD_HV DCDC convertor, for details refer to http://infocenter.nordicsemi.com/pdf/nRF52840_Rev_1_Errata_v1.1.pdf. Nordic Errata 202 means no external current draw (from VDD pin) is allowed during power up and VDD_HV rise time (to 3V) is below 1 millisecond. For either option, if you use USB interface then the DSU840 VBUS pin must be connected to external supply within the range 4.35V to 5.5V. When using the DSU840 VBUS pin, you MUST externally fit a 4.7uF to ground.
@Copyright 2023 Delphian Systems LLC., USA 15 Table 4: Signal levels for interface, SIO Parameter VIH Input high voltage VIL Input low voltage VOH Output high voltage
(std. drive, 0.5mA) (Note 1)
(high-drive, 3mA) (Note 1)
(high-drive, 5mA) (Note 2) VOL Output low voltage
(std. drive, 0.5mA) (Note 1)
(high-drive, 3mA) (Note 1)
(high-drive, 5mA) (Note 2) VOL Current at VSS+0.4V, Output set low
(std. drive, 0.5mA) (Note 1)
(high-drive, 3mA) (Note 1)
(high-drive, 5mA) (Note 2) VOL Current at VDD -0.4, Output set low
(std. drive, 0.5mA) (Note 1)
(high-drive, 3mA) (Note 1)
(high-drive, 5mA) (Note 2) Pull up resistance Pull down resistance Pad capacitance Pad capacitance at NFC pads Signal Levels Notes:
Min 0.7 VDD VSS VDD -0.4 VDD -0.4 VDD -0.4 VSS VSS VSS 1 3 6 1 3 6 11 11 Typ 2
10 2
9 13 13 3 4 Max VDD 0.3 x VDD VDD VDD VDD VSS+0.4 VSS+0.4 VSS+0.4 4
15 4
14 16 16 Unit V V V V V V mA mA mA mA mA mA k k pF pF Note 1 For VDD1.7V. The firmware supports high drive (3 mA, as well as standard drive). Note 2 For VDD2.7V. The firmware supports high drive (5 mA (since VDD2.7V), as well as standard drive). The GPIO (SIO) high reference voltage always equals the level on the VDD pin. Normal voltage mode The GPIO high level equals the voltage supplied to the VDD pin High voltage mode The GPIO high level equals the level specified (is configurable to 1.8V, 2.1V, 2.4V, 2.7V, 3.0V, and 3.3V. The default voltage is 1.8V). In High voltage mode, the VDD pin becomes an output voltage pin. The VDD output voltage and hence the GPIO is configurable from 1.8V to 3.3V with possible settings of 1.8V, 2.1V, 2.4V, 2.7V, 3.0V, and 3.3V. Refer to Table 15 for additional details.
@Copyright 2023 Delphian Systems LLC., USA 16 Table 5: SIO pin alternative function AIN (ADC) specification Parameter Maximum sample rate Min Typ ADC Internal reference voltage
-1.5%
0.6 V Max 200
+1.5%
ADC pin input internal selectable scaling ADC input pin (AIN) voltage maximum without damaging ADC w.r.t (see Note 1) VCC Prescaling 0V-VDD 4, 2, 1, , 1/3, , 1/5, 1/6 Configurable Resolution Configurable (see Note 2) Acquisition Time, source resistance 10k Acquisition Time, source resistance 40k Acquisition Time, source resistance 100k Acquisition Time, source resistance 200k Acquisition Time, source resistance 400k Acquisition Time, source resistance 800k Conversion Time (see Note 3) ADC input impedance (during operation) (see Note 3) Input Resistance Sample and hold capacitance at maximum gain Recommended Operating Parameters Notes:
4, 2, 1, 1/2, 1/3, 1/4, 1/5 1/6 VDD+0.3 8-bit mode 10-bit mode 12-bit mode 3 5 10 15 20 40
<2
>1 2.5 Unit kHz
scaling V bits uS uS uS uS uS uS uS MOhm pF Note 1 Stay within internal 0.6 V reference voltage with given pre-scaling on AIN pin and do not violate ADC maximum input voltage (for damage) for a given VCC, e.g. If VDD is 3.6V, you can only expose AIN pin to VDD+0.3 V. Default pre-scaling is 1/6 which configurable via smartBASIC. Note 2 Firmware allows configurable resolution (8-bit, 10-bit or 12-bit mode) and acquisition time. DSU840 ADC is a Successive Approximation type ADC (SSADC), as a result no external capacitor is needed for ADC operation. Configure the acquisition time according to the source resistance that customer has. The sampling frequency is limited by the sum of sampling time and acquisition time. The maximum sampling time is 2us. For acquisition time of 3us the total conversion time is therefore 5us, which makes maximum sampling frequency of 1/5us = 200kHz. Similarly, if acquisition time of 40us chosen, then the conversion time is 42us and the maximum sampling frequency is 1/42us = 23.8kHz. Note 3 ADC input impedance is estimated mean impedance of the ADC (AIN) pins.
@Copyright 2023 Delphian Systems LLC., USA 17 3.3 Programmability 3.4.1 DSU840 Default Firmware The DSU840 module comes loaded with smartBASIC firmware but does not come loaded with any smartBASIC application script (as that is dependent on customer-end application or use). Laird Connectivity provides many sample smartBASIC application scripts via a sample application folder on GitHub https://github.com/LairdCP/DSU840-Applications Therefore, it boots into AT command mode by default. 3.3.1 DSU840 Special Function Pins in smartBASIC Refer to the smartBASIC extension manual for details of functionality connected to this:
nAutoRUN pin (SIO_35), see Table 6 for default VSP pin (SIO_02), see Table 7 for default SIO_38 Reserved for future use. Do not connect. See Table 8 Table 6: nAutoRUN pin Signal Name Pin #
I/O Comments nAutoRUN /(SIO_35) 5 I Input with active low logic. Internal pull down (default). Operating mode selected by nAutoRun pin status:
Self-contained Run mode (nAutoRUN pin held at 0V). If Low (0V), runs $autorun$ if it exists Interactive/Development mode (nAutoRUN pin held at VCC). If High (VCC), runs via at+run (and file name of application) In the development board nAutoRUN pin is connected so that the state is driven by the hosts DTR output line. Table 7: VSP mode Signal Name Pin #
SIO_02 50 Table 8: SIO_38 Signal Name Pin #
SIO_38 63 I/O I I/O I Comments Internal pull down (default). VSP mode selected by externally pulling-up SIO_02 pin:
High (VCC), then OTA smart BASIC application download is possible. Comments Internal pull up (default). Reserved for future use. Do not connect if using smartBASIC FW.
@Copyright 2023 Delphian Systems LLC., USA 18 POWER CONSUMPTION 4 Data at VDD of 3.3 V with internal (to chipset) LDO ON or with internal (to chipset) DCDC ON (see Power Consumption Note 1) and 25C. 4.1 Power Consumption Table 9: Power consumption Parameter Min Typ Max Unit Active mode peak current (Note 1)
(Advertising or Connection) Tx only run peak current @ Txpwr = +8 dBm Tx only run peak current @ Txpwr = +4 dBm Tx only run peak current @ Txpwr = 0 dBm Tx only run peak current @ Txpwr = -4 dBm Tx only run peak current @ Txpwr = -8 dBm Tx only run peak current @ Txpwr = -12 dBm Tx only run peak current @ Txpwr = -16 dBm Tx only run peak current @ Txpwr = -20 dBm Tx only run peak current @ Txpwr = -40 dBm Active Mode Rx only peak current, BLE 1Mbps (Note 1) Rx only peak current, BLE 2Mbps (Note 2) Ultra-Low Power Mode 1 (Note 2) Standby Doze, 256k RAM retention Ultra-Low Power Mode 2 (Note 3) Deep Sleep (no RAM retention) Active Mode Average current (Note 4) Advertising Average Current draw Max, with advertising interval (min) 20 mS Min, with advertising interval (max) 10240 mS Connection Average Current draw Max, with connection interval (min) 7.5 mS Min, with connection interval (max) 4000 mS Power Consumption Notes:
With DCDC [with LDO]
14.8 [32.7]
9.6 [21.4]
4.8 [10.6]
3.1 [8.1]
3.3 [7.2]
3.0 [6.4]
2.8 [6.0]
2.7 [5.6]
2.3 [4.6]
4.6 [9.9]
5.2 [11.1]
3.1 0.4 Note4 Note4 Note4 Note4 mA mA mA mA mA mA mA mA mA mA mA uA uA uA uA uA uA Note 1 This is for Peak Radio Current only, but there is additional current due to the MCU. The internal DCDC convertor or LDO is decided by the underlying BLE stack. Note 2 DSU840 modules Standby Doze is 3.1 uA typical. When using smartBASIC firmware, Standby Doze is entered automatically (when a waitevent statement is encountered within a smartBASIC application script). In Standby Doze, all peripherals that are enabled stay on and may re-awaken the chip. Depending on active peripherals, current consumption ranges from 3.1 A to 370 uA (when UART is ON). See individual peripherals current consumption data in the Peripheral Block Current Consumption section. smartBASIC firmware has functionality to detect GPIO change with no current consumption cost, it is possible to close the UART and get to the 3.1 uA current consumption regime and still be able to
@Copyright 2023 Delphian Systems LLC., USA 19 Power Consumption Notes:
detect for incoming data and be woken up so that the UART can be re-opened at expense of losing that first character. The DSU840 Standby Doze current consists of the below nRF52840 blocks:
nRF52 System ON IDLE current (no RAM retention) (0.7 uA) This is the base current of the CPU LFRC (0.7 uA) and RTC (0.1uA) running as well as 256k RAM retention (1.4 uA) This adds to the total of 3.1 uA typical. The RAM retention is 20nA per 4k block, but this can vary to 30nA per 4k block which would make the total 3.7uA. Note 3 In Deep Sleep, everything is disabled and the only wake-up sources (including NFC to wakeup) are reset and changes on SIO or NFC pins on which sense is enabled. The current consumption seen is ~0.4 uA typical in DSU840 modules. Coming out from Deep Sleep to Standby Doze through the reset vector. Note 4 Average current consumption depends on several factors (including Tx power, VCC, accuracy of 32MHz and 32.768 kHz). With these factors fixed, the largest variable is the advertising or connection interval set. Advertising Interval range:
20 milliseconds to 10240 mS (10485759.375 mS in BT 5.1) in multiples of 0.625 milliseconds. For an advertising event:
The minimum average current consumption is when the advertising interval is large 10240 mS
(10485759.375 mS in BT 5.1) although this may cause long discover times (for the advertising event) by scanners The maximum average current consumption is when the advertising interval is small 20 mS Other factors that are also related to average current consumption include the advertising payload bytes in each advertising packet and whether its continuously advertising or periodically advertising. Connection Interval range (for a peripheral):
7.5 milliseconds to 4000 milliseconds in multiples of 1.25 milliseconds. For a connection event (for a peripheral device):
The minimum average current consumption is when the connection interval is large 4000 milliseconds The maximum average current consumption is with the shortest connection interval of 7.5 ms; no slave latency. Other factors that are also related to average current consumption include:
Number packets per connection interval with each packet payload size An inaccurate 32.768 kHz master clock accuracy would increase the average current consumption. Connection Interval range (for a central device):
2.5 milliseconds to 40959375 milliseconds in multiples of 1.25 milliseconds.
@Copyright 2023 Delphian Systems LLC., USA 20 4.2 Peripheral Block Current Consumption The values below are calculated for a typical operating voltage of 3V. Table 10: UART power consumption Typ Parameter Min WITH DCDC(REG1) WITH LDO(REG1) Max Unit UART Run current @ 115200 bps UART Run current @ 1200 bps Idle current for UART (no activity) UART Baud rate
1.2 Table 11: SPI power consumption 729 729 29
Typ 951 951 29
uA uA uA 1000 kbps Parameter Min WITHDCDC(REG1) WITH LDO(REG1) Max Unit SPI Master Run current @ 2 Mbps SPI Master Run current @ 8 Mbps Idle current for SPI (no activity) SPI bit rate
Table 12: I2C power consumption 803 803
<1
Typ 1040 1040
<1
8 uA uA uA Mbps Parameter Min WITH DCDC(REG1) WITH LDO(REG1) Max Unit I2C Run current @ 100 kbps I2C Run current @ 400 kbps Idle current for I2C (no activity) I2C Bit rate
100 Table 13: ADC power consumption 967 967 3.2
Typ 1250 1250 3.2
uA uA uA 400 kbps Parameter Min WITH DCDC(REG1) WITH LDO(REG1) Max Unit ADC current during conversion Idle current for ADC (no activity)
1640 0 2010 0
uA uA The above current consumption is for the given peripheral including the internal blocks that are needed for that peripheral for both the case when DCDC(REG1) is on and off. The peripheral Idle current is when the peripheral is enabled but not running
(not sending data or being used) and must be added to the StandByDoze current (Nordic System ON Idle current). In all cases radio is not turned on. For asynchronous interface, like the UART (asynchronous as the other end can communicate at any time), the UART on the DSU840 must be kept open (by a command in smartBASIC application script), resulting in the base current consumption penalty. For a synchronous interface like the I2C or SPI (since DSU840 side is the master), the interface can be closed and opened (by a command in smartBASIC application script) only when needed, resulting in current saving (no base current consumption penalty). Theres a similar argument for ADC (open ADC when needed).
@Copyright 2023 Delphian Systems LLC., USA 21 FUNCTIONAL DESCRIPTION 5 To provide the widest scope for integration, a variety of physical host interfaces/sensors are provided. The major DSU840 series module functional blocks described below. 5.1 Power Management Power management features:
System Standby Doze and Deep Sleep modes Open/Close peripherals (UART, SPI, QSPI, I2C, SIOs, ADC). Peripherals consume current when open; each peripheral can be individually closed to save power consumption smartBASIC command allows the supply voltage to be read (through the internal ADC) Use of the internal DCDC convertor or LDO is decided by the underlying BLE stack Pin wake-up system from deep sleep Power supply features:
Supervisor hardware to manage power during reset, brownout, or power fail. 1.7V to 3.6V supply range for normal power supply (VDD pin) using internal DCDC convertor or LDO decided by the underlying BLE stack. 2.5V to 5.5 supply range for High voltage power supply (VDD_HV pin) using internal DCDC convertor or LDO decided by the underlying BLE stack. 4.35V to 5.5V supply range for powering USB (VBUS pin) portion of DSU840 only. The remainder of the DSU840 module circuitry must still be powered through the VDD (or VDD_HV) pin. 5.2 DSU840 Power Supply Options The DSU840 module power supply internally contains the following two main supply regulator stages (Figure 1):
REG0 Connected to the VDD_HV pin REG1 Connected to the VDD pin The USB power supply is separate (connected to the VBUS pin). Figure 1: DSU840 power supply block diagram (adapted from the following resource:
http://infocenter.nordicsemi.com/pdf/nRF52840_PS_v1.0.pdf The DSU840 power supply system enters one of two supply voltage modes, normal or high voltage mode, depending on how the external supply voltage is connected to these pins.
@Copyright 2023 Delphian Systems LLC., USA 22 DSU840 power supply options:
Option 1 Normal voltage power supply mode entered when the external supply voltage is connected to both the VDD and VDD_HV pins (so that VDD equals VDD_HV). Connect external supply within range 1.7V to 3.6V range to DSU840 VDD and VDD_HV pins. OR Option 2 High voltage mode power supply mode (using DSU840 VDD_HV pin) entered when the external supply voltage in ONLY connected to the VDD_HV pin and the VDD pin is not connected to any external voltage supply. Connect external supply within range 2.5V to 5.5V range to DSU840 VDD_HV pin. DSU840 VDD pin left unconnected. Nordic Errata 197 and 202 related to the use of VDD_HV DCDC convertor, for details refer to http://infocenter.nordicsemi.com/pdf/nRF52840_Rev_1_Errata_v1.1.pdf. Nordic Errata 202 means no external current draw (from VDD pin) is allowed during power up and VDD_HV rise time (to 3V) is below 1mS. For either option, if you use USB interface then the DSU840 VBUS pin must be connected to external supply within the range 4.35V to 5.5V. When using the DSU840 VBUS pin, you MUST externally fit a 4.7uF to ground. Table 14 summarizes these power supply options. Table 14: DSU840 powering options Power Supply Pins and Operating Voltage Range OPTION1 Normal voltage mode operation connect?
VDD (pin31) 1.7V to 3.6V VDD_HV (pin25) 2.5V to 5.5V VBUS (pin24) 4.35V to 5.5V Yes
(Note 1) No No Power Supply Option Notes:
OPTION2 High voltage mode operation connect?
OPTION1 with USB peripheral, operation, and normal voltage connect?
OPTION2 with USB peripheral, operation, and high voltage connect?
No
(Note 2) Yes
(Note 3) Yes No Yes
(Note 4) No
(Note 2) Yes
(Note 5) Yes
(Note 4) Note 1 Option 1 External supply voltage is connected to BOTH the VDD and VDD_HV pins (so that VDD equals VDD_HV). Connect external supply within range 1.7V to 3.6V range to BOTH DSU840 VDD and VDD_HV pins. Note 2 Option 2 External supply within range 2.5V to 5.5V range to the DSU840 VDD_HV pin ONLY. DSU840 VDD pin left unconnected. In High voltage mode, the VDD pin becomes an output voltage pin. It can be used to supply external circuitry from the VDD pin. Before any current can be taken from the DSU840 VDD pin, this feature must be enabled in the DSU840. Additionally, the VDD output voltage is configurable from 1.8V to 3.3V with possible settings of 1.8V, 2.1V, 2.4V, 2.7V, 3.0V, and 3.3V. The default voltage is 1.8V. The supported DSU840 VDD pin output voltage range depends on the supply voltage provided on the DSU840 VDD_HV pin. The minimum difference between voltage supplied on the VDD_HV pin and the voltage output on the VDD pin is 0.3 V. The maximum output voltage of the VDD pin is VDDH 0.3V. Table4 shows the current that can be drawn by external circuitry from VDD pin in high voltage mode (supply on VDD_HV). Table 15: Current that can be drawn by external circuitry from VDD pin in High voltage mode (supply on VDD_HV) Parameter Min Typ Max Unit External current draw (from VDD pin) allowed in High Voltage mode
(supply on VDD_HV) during System OFF (DSU840 Deep Sleep) External current draw (from VDD pin) allowed in High Voltage mode
(supply on VDD_HV) when radio Tx RF power higher than 4dBm. 1 5 mA mA
@Copyright 2023 Delphian Systems LLC., USA 23 Power Supply Option Notes:
External current draw (from VDD pin) allowed in High Voltage mode
(supply on VDD_HV) when radio Tx RF power lower than 4dBm. Minimum difference between voltage supplied on VDD_HV pin and voltage on VDD pin 25 mA 0.3 V Note 3 External current draw is the sum of all GPIO currents and current being drawn from VDD. Depends on whether USB operation is required Note 4 When using the DSU840 VBUS pin, you must externally fit a 4.7uF capacitor to ground. Note 5 To use the DSU840 USB peripheral:
1. Connect the DSU840 VBUS pin to the external supply within the range 4.35V to 5.5V. When using the DSU840 VBUS pin, you MUST externally fit a 4.7uF to ground. 2. Connect the external supply to either the VDD (Option 1) or VDD_HV (Option 2) pin to operate the rest of DSU840 module. When using the DSU840 USB peripheral, the VBUS pin can be supplied from same source as VDD_HV
(within the operating voltage range of the VBUS pin and VDD_HV pin). 5.3 Clocks and Timers 5.3.1 Clocks The integrated high accuracy 32 MHz (10 ppm) crystal oscillator helps with radio operation and reducing power consumption in the active modes. The integrated on-chip 32.768 kHz LFRC oscillator (500 ppm) provides protocol timing and helps with radio power consumption in the system StandByDoze and Deep Sleep modes by reducing the time that the RX window needs to be open. To keep the on-chip 32.768 kHz LFRC oscillator within 500 ppm (which is needed to run the BLE stack) accuracy, RC oscillator needs to be calibrated (which takes 33 mS) regularly. The default calibration interval is eight seconds which is enough to keep within 500 ppm. The calibration interval ranges from 0.25 seconds to 31.75 seconds (in multiples of 0.25 seconds) and configurable via firmware 5.3.2 Timers When using smartBASIC, the timer subsystem enables applications to be written which allow future events to be generated based on timeouts. Regular Timer There are eight built-in timers (regular timers) derived from a single RTC clock which are controlled solely by smart BASIC functions. The resolution of the regular timer is 976 microseconds. Tick Timer A 31-bit free running counter that increments every (1) millisecond. The resolution of this counter is 488 microseconds. For timer utilization when using the Nordic SDK, refer to http://infocenter.nordicsemi.com/index.jsp. 5.4 Radio Frequency (RF) 24022480 MHz Bluetooth Low Energy radio BT 5.1 1 Mbps, 2 Mbps, and Long-range (125 kbps and 500 kbps) over-
the-air data rate. Tx output power of +8 dBm programmable down to 7 dBm, 6 dBm, 5 dBm, 4 dBm, 2 dBm, 0 dBm and further down to -20 dBm in steps of 4 dB and final TX power level of -40 dBm. Receiver (with integrated channel filters) to achieve maximum sensitivity -95 dBm @ 1 Mbps BLE, -92 dBm @2 Mbps, -
103 dBm @ 125 kbps long-range and -99 dBm @500kbps long-range). RF conducted interface available in the following two ways:
@Copyright 2023 Delphian Systems LLC., USA 24 DSU840: RF connected to on-board IPEX MH4 RF connector Antenna options:
External antenna connected with to IPEX MH4 RF connector on the DSU840 Received Signal Strength Indicator (RSSI) RSSI accuracy (valid range -90 to -20dBm) is 2dB typical RSSI resolution 1dB typical DSU840 can run the ANT and Bluetooth LE protocols concurrently. The radio time is time-sliced and shared between the protocols. The scheduling is autonomous and connections are maintained. Leverage the interoperability of Bluetooth LE stack and let a Bluetooth LE device, such as a smartphone, interact with the ANT network. 5.5 USB interface DSU840 has USB2.0 FS (Full Speed, 12Mbps) hardware capability. There is a CDC driver/Virtual UART as well as other USB drivers available via Nordic SDK such as: usb_audio, usb_hid, usb_generic, usb_msc (mass storage device). Table 16: USB interface Signal Name Pin No I/O D-
D+
VBUS I/O I/O 17 15 24 Comments When using the DSU840 VBUS pin (which is mandatory when USB interface is used), Customer MUST connect externally a 4.7uF capacitor to ground. Note: You MUST power the rest of DSU840 module circuitry through the VDD pin
(OPTION1) or VDD_HV pin (OPTION2). 5.6 SPI Bus The SPI interface is an alternate function on SIO pins. The module is a master device that uses terminals SPI_MOSI, SPI_MISO, and SPI_CLK. SPI_CS is implemented using any spare SIO digital output pins to allow for multi-dropping. The SPI interface enables full duplex synchronous communication between devices. It supports a 3-wire (SPI_MOSI, SPI_MISO, SPI_SCK,) bidirectional bus with fast data transfers to and from multiple slaves. Individual chip select signals are necessary for each of the slave devices attached to a bus, but control of these is left to the application through use of SIO signals. I/O data is double-buffered. The SPI peripheral supports SPI mode 0, 1, 2, and 3. Table 17: SPI interfaces Signal Name Pin No I/O Comments SIO_40/SPI_MOSI SIO_04/AIN2/SPI_MISO SIO_41/SPI_CLK 32 34 30 Any_SIO/SPI_CS 54 O I O I This interface is an alternate function configurable by smartBASIC. Default in the FW pin 56 and 53 are SIO inputs. SPIOPEN() in smartBASIC selects SPI function and changes pin 56 and 53 to outputs
(when in SPI master mode). SPI_CS is implemented using any spare SIO digital output pins to allow for multi-dropping. On Laird Connectivity devboard SIO_44 (pin54) used as SPI_CS. 5.7 I2C Interface The I2C interface is an alternate function on SIO pins. The two-wire interface can interface a bi-directional wired-OR bus with two lines (SCL, SDA) and has master /slave topology. The interface is capable of clock stretching. Data rates of 100 kbps and 400 kbps are supported.
@Copyright 2023 Delphian Systems LLC., USA 25 An I2C interface allows multiple masters and slaves to communicate over a shared wired-OR type bus consisting of two lines which normally sit at VDD. The SCL is the clock line which is always sourced by the master and SDA is a bi-directional data line which can be driven by any device on the bus. IMPORTANT:
It is essential to remember that pull-up resistors on both SCL and SDA lines are not provided in the module and MUST be provided external to the module. Table 18: I2C interface Signal Name Pin No SIO_26/I2C_SDA SIO_27/I2C_SCL 36 38 I/O I/O I/O Comments This interface is an alternate function on each pin, configurable by smartBASIC. I2COPEN() in smartBASIC selects I2C function. 5.8 General Purpose I/O, ADC, PWM and FREQ 5.8.1 GPIO The 19 SIO pins are configurable by smartBASIC application script or Nordic SDK. They can be accessed individually. Each has the following user configured features:
Input/output direction Output drive strength (standard drive 0.5 mA or high drive 5mA) Wake-up from high or low-level triggers on all pins Internal pull-up and pull-down resistors (13 K typical) or no pull-up/down or input buffer disconnect 5.8.2 ADC The ADC is an alternate function on SIO pins, configurable by smart BASIC or Nordic SDK. The DSU840 provides access to 8-channel 8/10/12-bit successive approximation ADC in one-shot mode. This enables sampling up to 8 external signals through a front-end MUX. The ADC has configurable input and reference pre-scaling and sample resolution (8, 10, and 12 bit). 5.8.2.1 Analog Interface (ADC) Table 19: Analog interface Signal Name Pin No I/O Comments SIO_05/UART_RTS/AIN3 Analog Input SIO_04/AIN2/SPI_MISO Analog Input SIO_03/AIN1 Analog Input SIO_02/AIN0 Analog Input SIO_31/AIN7 Analog Input SIO_30/AIN6 Analog Input SIO_29/AIN5 Analog Input SIO_28/AIN4 Analog Input 39 34 49 50 44 45 48 46 I I I I I I I I This interface is an alternate function on each pin, configurable by smartBASIC. AIN configuration selected using GpioSetFunc() function. Configurable 8, 10, 12-bit resolution. Configurable voltage scaling 4, 2, 1/1, 1/3, 1/3, 1/4, 1/5, 1/6(default). Configurable acquisition time 3uS, 5uS, 10uS(default), 15uS, 20uS, 40uS. Full scale input range (VDD) 5.8.3 PWM Signal Output on up to 16 SIO Pins The PWM output is an alternate function on ALL (GPIO) SIO pins, configurable by smartBASIC or the Nordic SDK. The PWM output signal has a frequency and duty cycle property. Frequency is adjustable (up to 1 MHz) and the duty cycle can be set over a range from 0% to 100%. PWM output signal has a frequency and duty cycle property. PWM output is generated using dedicated hardware in the chipset. There is a trade-off between PWM output frequency and resolution.
@Copyright 2023 Delphian Systems LLC., USA 26 For example:
PWM output frequency of 500 kHz (2 uS) results in resolution of 1:2. PWM output frequency of 100 kHz (10 uS) results in resolution of 1:10. PWM output frequency of 10 kHz (100 uS) results in resolution of 1:100. PWM output frequency of 1 kHz (1000 uS) results in resolution of 1:1000. 5.8.4 FREQ Signal Output on up to 16 SIO Pins The FREQ output is an alternate function on 16 (GPIO) SIO pins, configurable by smartBASIC or Nordic SDK. Note:
The frequency driving each of the 16 SIO pins is the same but the duty cycle can be independently set for each pin. FREQ output signal frequency can be set over a range of 0Hz to 4 MHz (with 50% mark-space ratio). 5.9 nRESET pin Table 20: nRESET pin Signal Name Pin No I/O Comments nRESET 19 I DSU840 HW reset (active low). Pull the nRESET pin low for minimum 100mS for the DSU840 to reset. 5.10 Two-Wire Interface JTAG smartBASIC runtime engine The DSU840 Firmware hex file consists of four elements:
Nordic Softdevice Master Bootloader Laird Connectivity DSU840 smartBASIC firmware (FW) image part numbers are referenced as w.x.y.z (ex. v29.x.y.z). The DSU840 smartBASIC runtime engine and Softdevice combined image can be upgraded by the customer over the UART interface. You also have the option to use the two-wire (JTAG) interface, during production, to clone the file system of a Golden preconfigured DSU840 to others using the Flash Cloning process. This is described in the following application note Flash Cloning for the DSU840. In this case the file system is also part of the .hex file. Signal Name Pin No SWDIO SWDCLK 1 3 I/O I/O I Internal pull-up resistor Internal pull-down resistor Comments The Laird Connectivity development board incorporates an on-board JTAG J-link programmer for this purpose. There is also the following JTAG connector which allows on-board JTAG J-link programmer signals to be routed off the development board. The only requirement is that you should use the following JTAG connector on the host PCB. The JTAG connector MPN is as follows:
Reference JP1 Part FTSH-105 Description and MPN (Manufacturers Part Number) Header, 1.27mm, SMD, 10-way, FTSH-105-01-L-DV Samtech Note:
Reference on the DSU840 development board schematic (Figure 2) shows the DVK development schematic wiring only for the JTAG connector and the DSU840 module JTAG pins.
@Copyright 2023 Delphian Systems LLC., USA 27 VDD_VSRC_nRF JP1 1 3 5 7 9 SWDIO_EXT SWDCLK_EXT SWO_EXT 2 4 6 8 10 nRESET_EXT PIN HEADER,1.27mm 2X5P GND Figure 2: DSU840 development board schematic Note: The DSU840 development board allows Laird Connectivity on-board JTAG J-link programmer signals to be routed off the development board by from connector JP1 JTAG is require because Nordic SDK applications can only be loaded using the JTAG (smartBASIC firmware can be loaded using JTAG as well as over the UART). We recommend that you use JTAG (2-wire SWD interface) to handle future DSU840 module firmware upgrades. You must wire out the JTAG (2-wire SWD interface) on your host design (see Figure 2, where the following four lines should be wired out SWDIO, SWDCLK, GND and VCC). smartBASIC firmware upgrades can still be performed over the DSU840 UART interface, but this is slower than using the DSU840 JTAG (2-wire SWD interface) (60 seconds using UART vs. 10 seconds when using JTAG). SWO (SIO_32) is a Trace output (called SWO, Serial Wire Output) and is not necessary for programming DSU840 over the SWD interface. nRESET_BLE is not necessary for programming DSU840 over the SWD interface. 5.11 DSU840 Wakeup 5.11.1 Waking Up DSU840 from Host Wake the DSU840 from the host using wake-up pins (any SIO pin). You may configure the DSU840s wakeup pins via smartBASIC to do any of the following:
Wake up when signal is low Wake up when signal is high Wake up when signal changes For DSU840 wake-up using the Nordic SDK, refer to Nordic infocenter.nordicsemi.com. 5.12 Low Power Modes The DSU840 has three power modes: Run, Standby Doze, and Deep Sleep. The module is placed automatically in Standby Doze if there are no pending events (when WAITEVENT statement is encountered within a customers smartBASIC script). The module wakes from Standby Doze via any interrupt (such as a received character on the UART Rx line). If the module receives a UART character from either the external UART or the radio, it wakes up. Deep sleep is the lowest power mode. Once awakened, the system goes through a system reset. For different Nordic power modes using the Nordic SDK, refer to Nordic infocenter.nordicsemi.com. 5.13 Temperature Sensor The on-silicon temperature sensor has a temperature range greater than or equal to the operating temperature of the device. Resolution is 0.25C degrees. The on-silicon temperature sensor accuracy is 5C. To read temperature from on-silicon temperature sensor (in tenth of centigrade, so 23.4C is output as 234) using smartBASIC:
In command mode, use ATI2024 or
@Copyright 2023 Delphian Systems LLC., USA 28 From running a smartBASIC application script, use SYSINFO(2024) 5.14 Security/Privacy 5.14.1 Random Number Generator Exposed via an API in smartBASIC (see smartBASIC documentation available from the DSU840 product page). The rand() function from a running smartBASIC application returns a value. For Nordic related functionality, visit Nordic infocenter.nordicsemi.com 5.14.2 AES Encryption/Decryption Exposed via an API in smartBASIC (see smartBASIC documentation available from the DSU840 product page). Function called aesencrypt and aesdecrypt. For Nordic related functionality, visit Nordic infocenter.nordicsemi.com 5.14.3 ARM Cryptocell ARM Cryptocell incorporates a true random generator (TRNG) and support for a wide range of asymmetric, symmetric and hashing cryptographic services for secure applications. For more information, please check the Nordic SDK. 5.14.4 Readback Protection The DSU840 supports readback protection capability that disallows the reading of the memory on the nrf52840 using a JTAG interface. Available via smartBASIC or the Nordic SDK. 5.14.5 Elliptic Curve Cryptography The DSU840 offers a range of functions for generating public/private keypair, calculating a shared secret, as well as generating an authenticated hash. Available via smartBASIC or the Nordic SDK. 5.15 Optional External 32.768 kHz crystal This is not required for normal DSU840 module operation. The DSU840 uses the on-chip 32.76 kHz RC oscillator (LFCLK) by default (which has an accuracy of 500 ppm) which requires regulator calibration (every eight seconds) to within 500 ppm. You can connect an optional external high accuracy (20 ppm) 32.768 kHz crystal (and associated load capacitors) to the DSU840SIO_01/XL2 (pin 41) and SIO_00/XL1 (pin 42) to provide improved protocol timing and to help with radio power consumption in the system standby doze/deep sleep modes by reducing the time that the RX window needs to be open. Table 21 compares the current consumption difference between RC and crystal oscillator. Table 21: Comparing current consumption difference between DSU840 on-chip RC 32.76 kHz oscillator and optional external crystal (32.768kHz) based oscillator DSU840 On-chip 32.768 kHz RC Oscillator
(500 ppm) LFRC Optional External Higher Accuracy (20 ppm) 32.768 kHz Crystal-based Oscillator LFXO Current Consumption of 32.768 kHz Block Standby Doze Current
(SYSTEM ON IDLE +full RAM retention +RTC run current + LFRC or LFXO) Calibration 0.7 uA 3.1 uA 0.23 uA 2.6 uA Calibration required regularly (default eight seconds interval). Not applicable
@Copyright 2023 Delphian Systems LLC., USA 29 DSU840 On-chip 32.768 kHz RC Oscillator
(500 ppm) LFRC Optional External Higher Accuracy (20 ppm) 32.768 kHz Crystal-based Oscillator LFXO Calibration takes 33 ms; with DCDC used, the total charge of a calibration event is 16 uC. The average current consumed by the calibration depends on the calibration interval and can be calculated using the following formula:
CAL_charge/CAL_interval The lowest calibration interval (0.25 seconds) provides an average current of (DCDC enabled):
16uC/0.25s = 64uA To get the 500-ppm accuracy, the BLE stack specification states that a calibration interval of eight seconds is enough. This gives an average current of:
16uC/8s = 2 uA Added to the LFRC run current and Standby Doze (IDLE) base current shown above results in a total average current of:
LFRC + CAL = 3.1 + 2 = 5.1 uA Total Summary 5.1 uA 2.6 uA Low current consumption Accuracy 500 ppm Lowest current consumption Needs external crystal High accuracy (depends on the crystal, usually 20 ppm) Table 22: Optional external 32.768 kHz crystal specification Optional external 32.768kHz crystal Min Typ Crystal Frequency Frequency tolerance requirement of BLE stack Load Capacitance Shunt Capacitance Equivalent series resistance Drive level Input capacitance on XL1 and XL2 pads Run current for 32.768 kHz crystal based oscillator Start-up time for 32.768 kHz crystal based oscillator
32.768 kHz
Max
500 ppm 12.5 pF 2 pF 100 kOhm 1 uW 4 pF 0.23 uA 0.25 seconds
Peak to peak amplitude for external low swing clock input signal must not be outside supply rails 200 mV
1000 mV Be sure to tune the load capacitors on the board design to optimize frequency accuracy (at room temperature) so it matches that of the same crystal standalone, Drive Level (so crystal operated within safe limits) and oscillation margin (Rneg is at least 3 to 5 times ESR) over the operating temperature range.
@Copyright 2023 Delphian Systems LLC., USA 30 6 HARDWARE INTEGRATION SUGGESTIONS 6.1 Circuit The DSU840 is easy to integrate, requiring no external components on your board apart from those which you require for development and in your end application. The following are suggestions for your design for the best performance and functionality. Checklist (for Schematic):
DSU840 power supply options:
Option 1 Normal voltage power supply mode entered when the external supply voltage is connected to both the VDD and VDDH pins (so that VDD equals VDD_HV). Connect external supply within range 1.7V to 3.6V range to DSU840 VDD and VDD_HV pins. OR Option 2 High voltage mode power supply mode (using DSU840 VDD_HV pin) entered when the external supply voltage in ONLY connected to the VDDH pin and the VDD pin is not connected to any external voltage supply. Connect external supply within range 2.5V to 5.5V range to DSU840 VDD_HV pin. DSU840 VDD pin left unconnected. Nordic Errata 197 and 202 related to the use of VDD_HV DCDC convertor, for details refer to http://infocenter.nordicsemi.com/pdf/nRF52840_Rev_1_Errata_v1.1.pdf. Nordic Errata 202 means no external current draw
(from VDD pin) is allowed during power up and VDD_HV rise time (to 3V) is below 1mS. For either option, if you use USB interface then the DSU840 VBUS pin must be connected to external supply within the range 4.35V to 5.5V. When using the DSU840 VBUS pin, you MUST externally fit a 4.7uF to ground. External power source should be within the operating range, rise time and noise/ripple specification of the DSU840. Add decoupling capacitors for filtering the external source. Power-on reset circuitry within DSU840 series module incorporates brown-out detector, thus simplifying your power supply design. Upon application of power, the internal power-on reset ensures that the module starts correctly. VDD and coin-cell operation With a built-in DCDC (operating range 1.7V to 3.6V), that reduces the peak current required from a coin-cell, making it easier to use with a coin-cell. AIN (ADC) and SIO pin IO voltage levels DSU840 SIO voltage levels are at VDD. Ensure input voltage levels into SIO pins are at VDD also (if VDD source is a battery whose voltage will drop). Ensure ADC pin maximum input voltage for damage is not violated. AIN (ADC) impedance and external voltage divider setup If you need to measure with ADC a voltage higher than 3.6V, you can connect a high impedance voltage divider to lower the voltage to the ADC input pin. JTAG This is REQUIRED as Nordic SDK applications can only be loaded using the JTAG (smartBASIC firmware can be loaded using the JTAG as well as the UART). Laird Connectivity recommends you use JTAG (2-wire interface) to handle future DSU840 module firmware upgrades. You MUST wire out the JTAG (2-wire interface) on your host design (see Figure 2, where four lines should be wired out, namely SWDIO, SWDCLK, GND and VCC). Firmware upgrades can still be performed over the DSU840 UART interface, but this is slower (60 seconds using UART vs. 10 seconds when using JTAG) than using the DSU840 JTAG (2-wire interface). JTAG may be used if you intend to use Flash Cloning during production to load smartBASIC scripts. UART Required for loading your smartBASIC application script during development (or for subsequent firmware upgrades (except JTAG for FW upgrades and/or Flash Cloning of the smartBASIC application script). Add connector to allow interfacing with UART via PC (UARTRS232 or UART-USB). UART_RX and UART_CTS SIO_08 (alternative function UART_RX) is an input, set with internal weak pull-up (in firmware). The pull-up prevents the module from going into deep sleep when UART_RX line is idling. SIO_07 (alternative function UART_CTS) is an input, set with internal weak pull-down (in firmware). This pull-down ensures the default state of the UART_CTS will be asserted which means can send data out of the UART_TX line. Laird Connectivity recommends that UART_CTS be connected.
@Copyright 2023 Delphian Systems LLC., USA 31 nAutoRUN pin and operating mode selection nAutoRUN pin needs to be externally held high or low to select between the two DSU840 operating modes at power-up:
Self-contained Run mode (nAutoRUN pin held at 0V). Interactive / development mode (nAutoRUN pin held at VDD). Make provision to allow operation in the required mode. Add jumper to allow nAutoRUN pin to be held high or low
(DSU840 has internal 13K pull-down by default) OR driven by host GPIO. I2C It is essential to remember that pull-up resistors on both I2C_SCL and I2C_SDA lines are not provided in the DSU840 module and MUST be provided external to the module as per I2C standard. SPI Implement SPI chip select using any unused SIO pin within your smartBASIC application script or Nordic application then SPI_CS is controlled from the software application allowing multi-dropping. SIO pin direction DSU840 modules shipped from production with smart BASIC FW, all SIO pins (with default function of DIO) are mostly digital inputs (see Pin Definitions Table2). Remember to change the direction SIO pin (in your smartBASIC application script) if that particular pin is wired to a device that expects to be driven by the DSU840 SIO pin configured as an output. Also, these SIO pins have the internal pull-up or pull-down resistor-enabled by default in firmware (see Pin Definitions Table 2). This was done to avoid floating inputs, which can cause current consumption in low power modes (e.g. StandbyDoze) to drift with time. You can disable the PULL-UP or Pull-down through their smartBASIC application. Note:
Internal pull-up, pull down will take current from VDD. SIO_02 pin and OTA smartBASIC application download feature SIO_02 is an input, set with internal pull-down (in FW). Refer to latest firmware release documentation on how SIO_02 is used for Over the Air smartBASIC application download feature. The SIO_02 pin must be pulled high externally to enable the feature. Decide if this feature is required in production. When SIO_02 is high, ensure nAutoRun is NOT high at same time; otherwise you cannot load the smartBASIC application script. nRESET pin (active low) Hardware reset. Wire out to push button or drive by host. By default module is out of reset when power applied to VCC pins. Optional External 32.768kHz crystal If the optional external 32.768kHz crystal is needed then use a crystal that meets specification and add load capacitors whose values should be tuned to meet all specification for frequency and oscillation margin. SIO_38 special function pin This is for future use by Laird Connectivity. It is currently a Do Not Connect pin if using the smartBASIC FW. 6.2 PCB Layout on Host PCB - General Checklist (for PCB):
MUST locate DSU840 module close to the edge of. Use solid GND plane on inner layer (for best EMC and RF performance). All module GND pins MUST be connected to host PCB GND. Place GND vias close to module GND pads as possible. Unused PCB area on surface layer can flooded with copper but place GND vias regularly to connect the copper flood to the inner GND plane. If GND flood copper is on the bottom of the module, then connect it with GND vias to the inner GND plane. Route traces to avoid noise being picked up on VDD, VDDH, VBUS supply and AIN (analogue) and SIO (digital) traces. Ensure no exposed copper is on the underside of the module (refer to land pattern of DSU840 development board). 6.3 External Antenna Integration with the DSU840 Please refer to the regulatory sections for FCC and ISED for details of use of DSU840-with external antennas in each regulatory region.
@Copyright 2023 Delphian Systems LLC., USA 32 The DSU840 family has been designed to operate with the below external antenna (with a maximum gain of 2.0 dBi). The required antenna impedance is 50 ohms. See Table 23. External antennas improve radiation efficiency. Table 23: External antennas for the DSU840 Manufacturer Model Laird Connectivity Part Number Type Connector Laird Connectivity FlexPIFA 001-0022 Patch IPEX MHF4 Peak Gain 2400-2480 MHz 2 dBi 7 MECHANICAL DETAILS 7.1 DSU840 Mechanical Details Rear View Figure 3: DSU840 mechanical drawing 7.2 Reflow Parameters Prior to any reflow, it is important to ensure the modules were packaged to prevent moisture absorption. New packages contain desiccate (to absorb moisture) and a humidity indicator card to display the level maintained during storage and shipment. If directed to bake units on the card, see Table 24 and follow instructions specified by IPC/JEDEC J-STD-033. A copy of this standard is available from the JEDEC website: http://www.jedec.org/sites/default/files/docs/jstd033b01.pdf Any modules not manufactured before exceeding their floor life should be re-packaged with fresh desiccate and a new humidity indicator card. Floor life for MSL (Moisture Sensitivity Level) four devices is 72 hours in ambient environment 30C/60%RH.
@Copyright 2023 Delphian Systems LLC., USA 33 Table 24: Recommended baking times and temperatures 125C Baking Temp. 90C/ 5%RH Baking Temp. 40C/ 5%RH Baking Temp. MSL Saturated
30C/85%
Floor Life Limit
+ 72 hours
@ 30C/60%
Saturated
30C/85%
Floor Life Limit
+ 72 hours
@ 30C/60%
Saturated
@ 30C/85%
Floor Life Limit
+ 72 hours @
30C/60%
4 11 hours 7 hours 37 hours 23 hours 15 days 9 days Surface mount modules are designed to be easily manufactured, including reflow soldering to a PCB. Ultimately it is the responsibility of the customer to choose the appropriate solder paste and to ensure oven temperatures during reflow meet the requirements of the solder paste. Surface mount modules conform to J-STD-020D1 standards for reflow temperatures. Important: During reflow, modules should not be above 260 and not for more than 30 seconds. In addition, we recommend that the DSU840 module does not go through the reflow process more than one time; otherwise the DSU840 internal component soldering may be impacted. Figure 4: Recommended reflow temperature Temperatures should not exceed the minimums or maximums presented in Table 25. Table 25: Recommended maximum and minimum temperatures Specification Temperature Inc./Dec. Rate (max) Temperature Decrease rate (goal) Soak Temp Increase rate (goal) Flux Soak Period (Min) Flux Soak Period (Max) Flux Soak Temp (Min) Flux Soak Temp (max) Time Above Liquidous (max) Time Above Liquidous (min) Time In Target Reflow Range (goal) Value 1~3 2-4
.5 - 1 70 120 150 190 70 50 30 Unit C / Sec C / Sec C / Sec Sec Sec C C Sec Sec Sec
@Copyright 2023 Delphian Systems LLC., USA 34 Specification Time At Absolute Peak (max) Liquidous Temperature (SAC305) Lower Target Reflow Temperature Upper Target Reflow Temperature Absolute Peak Temperature Value 5 218 240 250 260 Unit Sec C C C C RELIABILITY TESTS 8 The DSU840 module went through the below reliability tests and passed. Test Sequence 1 Test Item Vibration Test Test Limits and Pass JESD22-B103B Vibration, Variable frequency Test Conditions Sample: Unpowered. Sample number: 3. Vibration waveform: Sine waveform. Vibration frequency /Displacement: 20 to 80Hz /1.52mm. Vibration frequency /Acceleration: 80 to 2000Hz /20g. Cycle time: 4 minutes. Number of cycles: 4 cycles for each axis. Vibration axis: X, Y and Z (Rotating each axis on vertical vibration table). Mechanical Shock JESD22-B104C Sample: Unpowered. 2 3 Sample number: 3. Pulse shape: Half-sine waveform. Impact acceleration: 1500g. Pulse duration: 0.5ms. Number of shocks: 30 shocks (5 shocks for each face). Orientation: Bottom, top, left, right, front and rear faces. Sample: Unpowered. Sample number: 3. Temperature transition time: Less than 30 seconds. Temperature cycle: -40 (10 minutes), +85 (10 minutes). Number of cycles: 350. Thermal Shock JESD22-A104E Temperature cycling Before and after the testing, visual inspection showed no physical defect on samples. After Vibration test and Mechanical Shock testing, the samples were functionally tested, and all samples functioned as normal. Then after Thermal shock test, the samples were functionally tested, and all samples functioned as normal. 9 REGULATORY Current Regulatory Certifications The DSU840 holds current certifications in the following countries:
Country/Region USA (FCC) Canada (ISED) Regulatory ID 2AEHJDSU840 20053-DSU840
@Copyright 2023 Delphian Systems LLC., USA 35 9.1 Certified Antennas The antennas listed below were tested for use with the DSU840. The OEM can choose a different manufacturers antenna but must make sure it is of same type and that the gain is less than or equal to the antenna that is approved for use.*
*Note: Japan (MIC) lists applicable antennas on its certificates. If your antenna is not on the approved list, regardless of whether it is comparative, it must be added to the certificate before it can be used in Japan. Manufacturer Model Part Number Type Connector Peak Gain 2400-2480 MHz Laird Connectivity FlexPIFA 001-0022 PCB Dipole IPEX MHF4 2 dBi 9.2 Documentation Requirements To ensure regulatory compliance, when integrating the DSU840 into a host device, it is necessary to meet the documentation requirements set forth by the applicable regulatory agencies. The following sections (FCC and ISED Canada) outline the information that may be included in the users guide and external labels for the host devices into which the DSU840 is integrated. 9.3 FCC Regulatory Model DSU840 US/FCC 2AEHJDSU840 BLE 15.247 ANT 15.249 The DSU840 holds full modular approval. The OEM must follow the regulatory guidelines and warnings listed below to inherit the modular approval. Part #
DSU840 Form Factor Surface Mount Tx Outputs 8 dBm Antenna IPEX MHF4 9.4 Antenna Information The DSU840 family has been designed to operate with the antennas listed below with a maximum gain of 2 dBi. The required antenna impedance is 50 ohms. Manufacturer Model Part Number Type Connector Maximum Gain Laird Connectivity FlexPIFA 001-0022 PCB Dipole IPEX MHF4 2 dBi Note:
The OEM is free to choose another vendors antenna of like type and equal or lesser gain as an antenna appearing in the table and still maintain compliance. Reference FCC Part 15.204(c)(4) for further information on this topic. To reduce potential radio interference to other users, the antenna type and gain should be chosen so that the equivalent isotropic radiated power (EIRP) is not more than that permitted for successful communication.
@Copyright 2023 Delphian Systems LLC., USA 36 9.5 FCC Documentation Requirements Federal Communication Commission Interference Statement This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in an installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one of the following measures:
Reorient or relocate the receiving antenna. Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. Consult the dealer or an experienced radio/TV technician for help. Increase the separation between the equipment and receiver. FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate this equipment. This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:
1. This device may not cause harmful interference; and 2. This device must accept any interference received, including interference that may cause undesired operation. FCC Radiation Exposure Statement This product complies with the US portable RF exposure limit set forth for an uncontrolled environment and is safe for intended operation as described in this manual. Further RF exposure reduction can be achieved if the product is kept as far as possible from the user body or is set to a lower output power if such function is available. This transmitter must not be co-located or operated in conjunction with any other antenna or transmitter. This device is intended only for OEM integrators under the following condition:
1. The transmitter module may not be co-located with any other transmitter or antenna, If the condition above is met, further transmitter testing is not required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this installed module. IMPORTANT NOTE:
If this condition cannot be met (for example, certain laptop configurations or co-location with another transmitter), then the FCC authorization is no longer considered valid, and the FCC ID cannot be used on the final product. In these circumstances, the OEM integrator is responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC authorization. End-Product Labeling The end product must be labeled in a visible area with the following: Contains FCC ID: 2AEHJDSU840 Manual Information to the End User The OEM integrator must be aware not to provide information to the end user regarding how to install or remove this RF module in the users manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual.
@Copyright 2023 Delphian Systems LLC., USA 37 10 ISED (CANADA) REGULATORY Model DSU840 ISED (Canada) 20053-DSU840 10.1 Antenna Information BLE RSS-247 ANT RSS-210 This radio transmitter (IC: 20053-DSU840) was approved by Innovation, Science and Economic Development (ISED) Canada to operate with the antenna types listed below, with the maximum permissible gain indicated. Antenna types not included in this list that have a gain greater than the maximum gain indicated for any type listed are strictly prohibited for use with this device. Le prsent metteur radio (IC: 20053-DSU840) a t approuv par Innovation, Sciences et Dveloppement conomique Canada pour fonctionner avec les types d'antenne numrs ci-dessous et ayant un gain admissible maximal. Les types d'antenne non inclus dans cette liste, et dont le gain est suprieur au gain maximal indiqu pour tout type figurant sur la liste, sont strictement interdits pour l'exploitation de l'metteur. Manufacturer Model Part Number Type Connector Peak Gain 2400-2480 MHz Laird Connectivity FlexPIFA 001-0022 PCB Dipole IPEX MHF4 2 dBi Industry Canada Statement The end user manual shall include all required regulatory information/warning as shown in this manual. This device complies with Industry Canadas license-exempt RSSs. Operation is subject to the following two conditions:
1. This device may not cause interference; and 2. This device must accept any interference, including interference that may cause undesired operation of the device. Le prsent appareil est conforme aux CNR dIndustrie Canada applicables aux appareils radio exempts de licence. Lexploitation est autorise aux deux conditions suivantes:
1. lappareil ne doit pas produire de brouillage;
2. lutilisateur de lappareil doit accepter tout brouillage radiolectrique subi, mme si le brouillage est susceptible den compromettre le fonctionnement. Radiation Exposure Statement The product complies with the Canada portable RF exposure limit set forth for an uncontrolled environment and are safe for intended operation as described in this manual. The minimum separation distance for portable use is limited to 15mm assuming use of antenna with 2 dBi of gain. The further RF exposure reduction can be achieved if the product can be kept as far as possible from the user body or set the device to lower output power if such function is available. Dclaration d'exposition aux radiations:
Le produit est conforme aux limites d'exposition pour les appareils portables RF pour les Etats-Unis et le Canada tablies pour un environnement non contrl. La distance de sparation minimale pour l'utilisation portative est limite 15mm en supposant l'utilisation de l'antenne avec 2 dBi de gain. Le produit est sr pour un fonctionnement tel que dcrit dans ce manuel. La rduction aux expositions RF peut tre augmente si l'appareil peut tre conserv aussi loin que possible du corps de l'utilisateur ou que le dispositif est rgl sur la puissance de sortie la plus faible si une telle fonction est disponible. This device is intended only for OEM integrators under the following conditions:
1. The transmitter module may not be co-located with any other transmitter or antenna. If the condition above is met, further transmitter testing is not required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed. Cet appareil est conu uniquement pour les intgrateurs OEM dans les conditions suivantes:
@Copyright 2023 Delphian Systems LLC., USA 38 1. Le module metteur peut ne pas tre complant avec un autre metteur ou antenne. Tant que les 1 condition ci-dessus sont remplies, des essais supplmentaires sur l'metteur ne seront pas ncessaires. Toutefois, l'intgrateur OEM est toujours responsable des essais sur son produit final pour toutes exigences de conformit supplmentaires requis pour ce module install. IMPORTANT NOTE:
If this condition cannot be met (for example, certain laptop configurations or co-location with another transmitter), then the Canada authorization is no longer considered valid and the IC ID cannot be used on the final product. In these circumstances, the OEM integrator is responsible for re-evaluating the end product (including the transmitter) and obtaining a separate Canada authorization. NOTE IMPORTANTE:
Dans le cas o ces conditions ne peuvent tre satisfaites (par exemple pour certaines configurations d'ordinateur portable ou de certaines co-localisation avec un autre metteur), l'autorisation du Canada n'est plus considr comme valide et l'ID IC ne peut pas tre utilis sur le produit final. Dans ces circonstances, l'intgrateur OEM sera charg de rvaluer le produit final (y compris l'metteur) et l'obtention d'une autorisation distincte au Canada. End-Product Labeling The final end product must be labeled in a visible area with the following: Contains IC: 20053-DSU840 Plaque signaltique du produit final Le produit final doit tre tiquet dans un endroit visible avec l'inscription suivante: Contient des IC: 20053-DSU840 Manual Information to the End User The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the users manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual. Manuel d'information l'utilisateur final L'intgrateur OEM doit tre conscient de ne pas fournir des informations l'utilisateur final quant la faon d'installer ou de supprimer ce module RF dans le manuel de l'utilisateur du produit final qui intgre ce module. Le manuel de l'utilisateur final doit inclure toutes les informations rglementaires requises et avertissements comme indiqu dans ce manuel. 10.2 ISED ICES-003 Issue 7 Compliance Declaration This device was originally tested to the requirements of ICES-003 Issue 6, Information Technology Equipment (Including Digital Apparatus) Limits and Methods of Measurement; and evaluated to the updates published in ICES-003, Issue 7, Information Technology Equipment (Including Digital Apparatus). Based on this evaluation, this product continues to observe compliance to the requirements set forth by The Innovation, Science and Economic Development Canada (ISED), and complies with the updates published in ICES-003, Issue 7, Information Technology Equipment (Including Digital Apparatus).
@Copyright 2023 Delphian Systems LLC., USA 39
1 2 | Internal Photos | Internal Photos | 141.20 KiB | February 24 2023 / July 12 2023 | delayed release |
1 2 | External Photos | External Photos | 276.65 KiB | February 24 2023 / July 12 2023 | delayed release |
1 2 | Label and Location | ID Label/Location Info | 165.41 KiB | February 24 2023 / February 27 2023 |
P/N: DSU840 FCC ID: 2AEHJDSU840 IC: 20053-DSU840 Label material:
White BOPP labels are made with polypropylene material and have permanent adhesive. Resistant to oil, water and moisture, the white BOPP label material is ideal for any product that may be exposed to such elements. Delphian Systems, LLC | 720, Dartmouth Ln, Buffalo Grove, IL 60089 | P (847) 305-8078 | www.delphiansystems.net
1 2 | Agent Authorization | Cover Letter(s) | 946.38 KiB | February 24 2023 / February 27 2023 |
oevPHiaN a SYSTEMS SECUREMOTE i eal Manager Title:
Delphian Systems LLC. On behalf of: :
(Company Name) 312-304-2816 Telephone:
Delphian Systems, LLC | 720, Dartmouth Ln, Buffalo Grove, IL 60089 | P (847) 305-8078 | www.delphiansystems.net
1 2 | Confidentiality Letter | Cover Letter(s) | 244.25 KiB | February 24 2023 / February 27 2023 |
Request for Confidentiality Date: February 24, 2023 Subject: Confidentiality Request for: ___FCC ID:_2AEHJDSU840 and IC: 20053-DSU840 ______ Pursuant to FCC 47 CFR 0.457(d) and 0.459 and/or IC RSP-100, Section 12.4, the applicant requests that a part of the subject application(s) be held confidential. Type of Confidentiality Requested Short Term Short Term Short Term Short Term Short Term Short Term Short Term Exhibit Permanent Block Diagrams
--------------------------- External Photos Permanent *1 Internal Photos Permanent Operation Description/Theory of Operation Permanent Schematics
--------------------------- Test Setup Photos Permanent *1 Users Manual Delphian Systems LLC has spent substantial effort in developing this product and it is one of the first of its kind in industry. Having the subject information easily available to "competition" would negate the advantage they have achieved by developing this product. Not protecting the details of the design will result in financial hardship. Permanent Confidentiality:
The applicant requests the exhibits listed above as permanently confidential be permanently withheld from public review due to materials that contain trade secrets and proprietary information not customarily released to the public. Short-Term Confidentiality for FCC Applications:
1 - The asterisked items (*) require further information to be provided to ACB before permanent confidentiality will be extended to these exhibits. Please refer to FCC KDB 726920 and the specific Document link for D01 found at:
https://apps.fcc.gov/oetcf/kdb/forms/FTSSearchResultPage.cfm?switch=P&id=41731 and review section II, 3) regarding specific information that must accompany these requests. Delphian Systems, LLC | 720, Dartmouth Ln, Buffalo Grove, IL 60089 | P (847) 305-8078 | www.delphiansystems.net The applicant requests the exhibits selected above as short term confidential be withheld from public view for a period of 135 days from the date of the Grant of Equipment Authorization and prior to marketing. This is to avoid premature release of sensitive information prior to marketing or release of the product to the public. Applicant is also aware that they are responsible to notify ACB in the event information regarding the product or the product is made available to the public before the requested period has expired. ACB will then release the documents listed above for public disclosure pursuant to FCC Public Notice DA 04-1705. Short Term Confidentiality for Industry Canada Applications:
Starting May 2022, ISED will recognize short term confidentiality on certain exhibits until the intended date of marketing. The applicant requests the exhibits selected above as short term confidential be withheld from public view until: (03/30/2023) . Sincerely, By:
__________________________ ______George GarGarifalis_______
(Signature/Title)
(Print name) Delphian Systems, LLC | 720, Dartmouth Ln, Buffalo Grove, IL 60089 | P (847) 305-8078 | www.delphiansystems.net
1 2 | Covered List Attestation | Attestation Statements | 89.91 KiB | February 24 2023 / February 27 2023 |
DELPHIAN. SYSTEMS SECURE MOTE. Certification Application Attestation Statements Date: February 13, 2023 Certification Body, Inc. American 313 Park Avenue Suite 300 Falls Church, VA 22046 To Whom It May Concern:
Statement for 47 CFR section that as of the date of the application 2.911(d)(S)(i) the equipment for which 1 prohibited from receiving an equipment authorization to section
---"'- D-"-e=lp""'""h..;..;;ia'-'-n;....;:S;;.J.y..;;;;..st=e..:..:m..;..;;s;....;:L=L-=C ___ certifies is sought is not "covered"
equipment authorization 2.903 of the FC<; rules. pursuant If the equipment for which the applicant List, current explanation on why the equipment affiliates including Covered seeks authorization of the named
,or subsidiaries by any of the entities the applicant identified must include on the an companies, is produced is not "covered"
equipment. Additional Explanation:
<N/ A>
Statement for 47 CFR section 2.911(d)(S)(ii)
-is/ -is not on the Covered
---=- D-=e=lp..:..:h-=ia=n;._;:S'-'-y=-st=e=m=s;._;:L=L-=C ___ ("the applicant") the applicant identified Thank you, By:
List as an entity producing X
"covered"
equipment. George Garifalis name)
(Print 2)
(Signature Title:
Manager certifies that, as of the date of the filing of this application, Company:
Delphian LLC Systems Telephone: 312-304-2816 Delphian Systems, LLC I 1230 N. State Pkwy, Unit 9B Chicago IL 60610 I P 312-304-2816 I www .delphiansystems
.com 1 I Page
1 2 | Modular Approval Letter | Cover Letter(s) | 4.27 MiB | February 24 2023 / February 27 2023 |
Qoevpuian ~
SYoleMs SECUREMOTE a Request for Modular/Limited Modular Approval Date: December 21, 2022 Subject: Manufacturers Declaration for - Modular Approval L] - Split Modular Approval L] - Limited Modular Approval LJ - Limited Split Modular Approval Confidentiality Request for: 2AEHJDSU840 8 Basic Requirements FCC Part 15.212(a)(1) For Items Marked NO(*), the Limited Module Description Must be Filled Out on the Following Pages Modular Approval Requirement Redulrement Mer Met 1. The modular transmitter must have its own RF shielding. This is intended to ensure that the module does not have to rely upon the shielding provided by the device into which it is installed in order for all modular transmitter emissions to comply with FCC limits. It is also intended to prevent coupling between the RF circuitry of the module and any wires or circuits in the device into which the module is installed. Such coupling may result in non-compliant operation. The physical crystal and tuning capacitors may be located external to the shielded radio elements. 15.212(a)(1)(i)
- YES L] - No(*
Details: The module contains a metal shield which covers all RF components and circuitry. The shield is located on the top of the board next to antenna connector
. The modular transmitter must have buffered modulation/data inputs (if such inputs are provided) to ensure that the module will comply with FCC requirements under conditions of excessive data rates or over-modulation. 15.212(a)(1)(ii) L] - No(*) Details: Data to the modulation circuit is buffered as described in the operational description provided with the application
. The modular transmitter must have its own power supply regulation on the module. This is intended to ensure that the module will comply with FCC requirements regardless of the design of the power supplying circuitry in the device into which the module is installed. 15.212(a)(1)(iii) Details: The module contains its own power supply regulation. Please refer to schematic filed with this application
. The modular transmitter must comply with the antenna and transmission syst yuire s 15.203, 15.204(b), 15.204(c), 15.212(a), and 2.929(b). The antenna must either be permanently attached or employ a unique antenna coupler (at all connections between the module and the antenna, including the cable). The professional installation provision of 15.203 is not applicable to modules but can apply to limited modular approvals under paragraph 15.212(b). 15.212(a)(1)(iv) Delphian Systems, LLC | 720, Dartmouth Ln, Buffalo Grove, IL 60089 | P (847) 305-8078 | www.delphiansystems.net QoevPHian SYSTEMS SECUREMOTE i Details: The module connects to its antenna using an UFL connector which is considered a non-standard connector. A list of antennas tested and approved with this device may be found in users manual provided with the application
. The modular transmitter must be tested in a stand-alone configuration, i.e., the module must not be inside another device during testing. This is intended to demonstrate that the module is capable of complying with Part 15 emission limits regardless of the device into which it is eventually installed. Unless the transmitter module will be battery powered, it must comply with the AC line conducted requirements found in Section 15.207. AC or DC power lines and data input/output lines connected to the module must not contain ferrites, unless they will be marketed with the module (see Section 15.27(a)). The length of these lines shall be length typical of actual use or, if that length is unknown, at least 10 centimeters to insure that there is no coupling between the case of the module and supporting equipment. Any accessories, peripherals, or support equipment connected to the module during testing shall be unmodified or commercially available (see Section 15.31(i)). 15.212(a)(1)(v) Details: The module was tested stand-alone as shown in test setup photographs filed with this application Delphian Systems, LLC | 720, Dartmouth Ln, Buffalo Grove, IL 60089 | P (847) 305-8078 | www.delphiansystems.net QoevpHian a SYSTEMS SECUREMOTE a Modular Approval Requirement Requirement Met 6. The modular transmitter must be labeled with its own FCC ID number, or use an electron display (see KDB Publication 784748). If using a permanently affixed label with its own FCC ID number, if the FCC ID is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. This exterior label can use wording such as the following: Contains Transmitter Module FCC ID: XYZMODEL 1 or Contains FCC ID: XYZMODEL1. Any similar wording that expresses the same meaning may be used. The Grantee may either provide such a label, an example of which must be included in the application for equipment authorization, or, must provide adequate instructions along with the module which explain _ YES OO - no(*) this requirement. In the latter case, a copy of these instructions must be included in the application for equipment authorization. If the modular transmitter uses an electronic display of the FCC identification number, the information must be readily accessible and visible on the modular transmitter or on the device in which it is installed. If the module is installed inside another device, then the outside of the device into which the module is installed must display a label referring to the enclosed module. This exterior label can use wording such as the following: Contains FCC certified transmitter module(s). Any similar wording that expresses the same meaning may be used. The user manual must include instructions on how to access the electronic display. A copy of these instructions must be included in the application for equipment authorization. 15.212(a)(1)(vi) Details: There is a label on the module as shown in the labeling exhibit filed with this application. Host specific labeling instructions are shown in the installation manual .filed with this application. The modular transmitter must comply with all specific rule or operating requirements applicable to the transmitter, including all the conditions provided in the integration instructions by the grantee. copy of these instructions must be included in the application for equipment authorization. For example, there are very strict operational and timing requirements that must be met before a transmitter is authorized for operation under Section 15.231. For instance, data transmission is prohibited, except for operation under Section 15.231(e), in which case there are separate field strength level and timing requirements. Compliance with these requirements must be assured. 15.212(a)(1)(vii) Details: The module complies with FCC Part 15C requirements. Instructions to the OEM installer are provided in the installation manual filed with this application. The modular transmitter must comply with any applicable RF exposure requirements. For example, FCC Rules in Sections 2.1091, 2.1093 and specific Sections of Part 15, including 15.319(i), 15.407(f), 15.253(f) and 15.255(g), require that Unlicensed PCS, UNII and millimeter wave devices perform routine environmental evaluation for RF Exposure to demonstrate compliance. In addition, spread spectrum transmitters operating under Section 15.247 are required to address RF Exposure compliance in accordance with Section 15.247(b)(4). Modular transmitters approved under other Sections of Part 15, when necessary, may also need to address certain RF Exposure concerns, typically by providing specific installation and operating instructions for users, installers and other interested parties to ensure compliance. 15.212(a)(1)(viii) Details: The module meets Portable exclusion levels as shown in the RF exposure information filed with this application. Delphian Systems, LLC | 720, Dartmouth Ln, Buffalo Grove, IL 60089 | P (847) 305-8078 | www.delphiansystems.net ELPHIAN in SYSTEMS SECUREMOTE Sa al Limited Module Description When Applicable
* If a module does NOT meet one or more of the above 8 requirements, the applicant may request Limited Modular Approval (LMA). This Limited Modular Approval (LMA) is applied with the understanding that the applicant will demonstrate and will retain control over the final installation of the device, such that compliance of the end product is always assured. The operating condition(s) for the LMA; the module is only approved for use when installed in devices produced by grantee. A description regarding how control of the end product, into which the module will be installed, will be maintained by the applicant/manufacturer, such that full compliance of the end product is always ensured should be provided here. Details: NA Software Considerations KDB 594280 / KDB 442812 (One of the following 2 items must be applied) 1. For non-Software Defined Radio transmitter modules where software is used to - Provided in Separate ensure compliance of the device, technical description must be provided about how such control is implemented to ensure prevention of third-party modification; see KDB Publication 594280. Cover Letter Details: The Radio Apparatus module is controlled by proprietary firmware. The end product customer cannot adjust firmware to operate the device on any other regulatory frequency bands, modulation types, bandwidth, power, etc. outside of the FCC approved modes as granted. For Software Defined Radio (SDR) devices, transmitter module applications must CL] - Provided in Separate provide a software security description; see KDB Publication 442812. Cover Letter Details: N/A Split Modular Requirements Delphian Systems, LLC | 720, Dartmouth Ln, Buffalo Grove, IL 60089 | P (847) 305-8078 | www.delphiansystems.net QoecPHian oon, SYSTEMS SECUREMOTE 1. For split modular transmitters, specific descriptions for secure communications between front-end and control sections, including authentication and restrictions on third-party modifications; also, instructions to third-party integrators on how control is maintained. L] - Provided in Separate Cover Letter Details: N/A Delphian Systems, LLC | 720, Dartmouth Ln, Buffalo Grove, IL 60089 | P (847) 305-8078 | www.delphiansystems.net QoepHian ~
31 oles SECUREMOTE Ne OEM Integration Manual Guidance KDB 996369 DO3 Section 2 Clear and Specific Instructions Describing the Conditions, Limitations, and Procedures for third-parties to use and/or integrate the module into a host device. ae L]-No, If No, and LMA applies, the applicant can optionally choose to not make the following detailed info public. However there still needs to be basic integration instructions for a users manual and the information below must still be included in the operational description. If the applicant wishes to keep this info confidential, this will require a separate statement cover letter explaining the module is not for sale to third parties and that integration instructions are internal confidential documents. Is this module intended for sale to third parties?
Items required to be in the manual See KDB 996369 DO3, Section 2 As of May 1, 2019, the FCC requires ALL the following information to be in the installation manual. Modular transmitter applicants should include information in their instructions for all these items indicating clearly when they are not applicable. For example information on trace antenna design could indicate Not Applicable. Also if a module is limited to only a grantees own products and not intended for sale to third parties, the user instructions may not need to be detailed and the following items can be placed in the operational description, but this should include a cover letter as cited above. 1. List of applicable FCC rules. KDB 996369 D03, Section 2.2 a. Only list rules related to the transmitter. 2. Summarize the specific operational use conditions. KDB 996369 D03, Section 2.3 a. Conditions such as limits on antennas, cable loss, reduction of power for point to point the Modular Integration systems, professional installation info Guide (or UM) for Full 3. Limited Module Procedures. KDB 996369 D03, Section 2.4 Modular Approval (MA) a. Describe alternative means that the grantee uses to verify the host meets the necessary limiting conditions oN b. When RF exposure evaluation is necessary, state how control will be maintained such that compliance is ensured, such as Class II for new hosts, etc. 4. Trace antenna designs. KDB 996369 D03, Section 2.5 a. Layout of trace design, parts list, antenna, connectors, isolation requirements, tests for (1 - An LMA applies and design verification, and production test procedures for ensuring compliance. If is approved ONLY for confidential, the method used to keep confidential must be identified and information i provided in the operational description. use by the grantee in XX - All items shown to the left are provided in 5. RF exposure considerations. KDB 996369 D03, Section 2.6 their own products, and a. Clearly and explicitly state conditions that allow host manufacturers to use the module. not intended for sale to Two types of instructions are necessary: first to the host manufacturer to define 34 parties as provided conditions (mobile, portable xx cm from body) and second additional text needed to
; in a separate cover be provided to the end user in the host product manuals. E Delphian Systems, LLC | 720, Dartmouth Ln, Buffalo Grove, IL 60089 | P (847) 305-8078 | www.delphiansystems.net QoevpHian SYSTEMS
. Antennas. KDB 996369 D03, Section 2.7 a. List of antennas included in the application and all applicable professional installer instructions when applicable. The antenna list shall also identify the antenna types monopole, PIFA, dipole, etc note that omni-directional is not considered a
. Label and compliance information. KDB 996369 D03, Section 2.8 a. Advice to host integrators that they need to provide a physical or e-label stating Contains FCC ID: with their finished product
. Information on test modes and additional testing requirements. KDB 996369 D03, Section 2.9 a. Test modes that should be taken into consideration by host integrators including clarifications necessary for stand-alone and simultaneous configurations. b. _ Provide information on how to configure test modes for evaluation
. Additional testing, Part 15 Subpart B disclaimer. KDB 996369 D03, Section 2.10 Sincerely, a . SECUREMOTE bel letter. Therefore the information shown to the left is found in the theory of operation. aie Ahsstioen L7C32 CE Sein: Ley
(Signature/Title*) (Print name)
- Must be signed by applicant contact given for applicant on the FCC site, or by the authorized agent if an appropriate authorized agent letter has been provided. Letters should be placed on appropriate letterhead. Delphian Systems, LLC | 720, Dartmouth Ln, Buffalo Grove, IL 60089 | P (847) 305-8078 | www.delphiansystems.net
1 2 | Original Module Manufacturer Authorization | Cover Letter(s) | 161.31 KiB | February 24 2023 / February 27 2023 |
Laird Connectivity W66 N220 Commerce Ct. Cedarburg, Wisconsin 53012 February 23, 2023 Subject: Application for Equipment Authorization Cover Letter FCC ID: 2AEHJDSU840 IC: 20053-DSU840 Dear ACB:
Delphian Systems LLC is seeking equipment authorization for new modular equipment using BLE and ANT protocol. The module is based on the Laird Connectivity LLC BL654 authorized under FCC ID: SQGBL654 and IC ID:
3147A-BL654 using rule(s) 15.247 / RSS-247 for BLE protocol operation. The original test reports have been supplied with this application. The output power of the BLE radio has been verified to be consistent with the original application and the standards are current. In addition to BLE operation the ANT protocol operation under rule(s) 15.249 / RSS-210 test reports have been submitted for review and authorization. The BLE functionality is not impacted by the addition of the ANT operation. Furthermore, the Laird Flex PIFA antenna will be the only antenna used for both BLE and ANT operation. Please contact me if you have any questions regarding this application. Sincerely, Adam Alger Test Services Laboratory Manager W66N220 Commerce Ct. Cedarburg, WI 53012 USA T +1-262-387-3091 E Adam.Alger@lairdconnect.com lairdconnect.com 1
1 2 | Test Setup Photos | Test Setup Photos | 1.46 MiB | February 24 2023 / July 12 2023 | delayed release |
1 2 | US Agent of Service for Process Attestation | Attestation Statements | 60.70 KiB | February 24 2023 / February 27 2023 |
DELPHIAN SYSTEMS SEC UR EMOTE-
U.S. Agent Designation
(Applicant is Both Grantee for Service of Process and U.S. Agent) TO: American Certification Body, Inc. 313 Park Avenue Suite 300 Falls Church, VA 22046 ATTENTION: FCC Certification
- Section 2.911(d)(7) Information The Applicant acknowledges is to confirm that the Applicant This letter 47 CFR 2.911(d}(7}. after terminating all marketing involving the equipment. The Applicant the Designated U.S. Agent information
. further acknowledges changes. and importation that they must maintain OR the conclusion an agent for no less than one year proceeding of any Commission-related to inform the FCC whenever their responsibility will also serve as the U.S. Agent for Service of Process as required by Systems LLC Applicant Company name: Delphian Grantee Code: 2AEHJ Contact Name: George Garifalis Street Address:
720 Dartmouth City/Province/Z ip: Buffalo Telephone Email:
FRN: 0024471229 No: 312-304-2816 Ln Grove, IL 60089 George.garifalis@jvapartners.com Signature Applicant _-z.-----. Date: 02/13/2023 Signed by (Printed Name/Title):
George Garifalis/Manage r Delphian Systems, LLC I 1230 N. State Pkwy, Unit 9B Chicago IL 60610 I P 312-304-2816 I
. www.delphiansystems.c om 1 I Page
1 2 | Cover Letter(s) | February 24 2023 / February 27 2023 |
frequency | equipment class | purpose | ||
---|---|---|---|---|
1 | 2023-02-27 | 2402 ~ 2480 | DTS - Digital Transmission System | Original Equipment |
2 | 2402 ~ 2480 | DXX - Part 15 Low Power Communication Device Transmitter |
app s | Applicant Information | |||||
---|---|---|---|---|---|---|
1 2 | Effective |
2023-02-27
|
||||
1 2 | Applicant's complete, legal business name |
Delphian Systems LLC
|
||||
1 2 | FCC Registration Number (FRN) |
0024471229
|
||||
1 2 | Physical Address |
720 Dartmouth Ln
|
||||
1 2 |
buffalo grove, IL
|
|||||
1 2 |
United States
|
|||||
app s | TCB Information | |||||
1 2 | TCB Application Email Address |
h******@acbcert.com
|
||||
1 2 | TCB Scope |
A4: UNII devices & low power transmitters using spread spectrum techniques
|
||||
1 2 |
A2: Low Power Transmitters (except Spread Spectrum) and radar detectors operating above 1 GHz
|
|||||
app s | FCC ID | |||||
1 2 | Grantee Code |
2AEHJ
|
||||
1 2 | Equipment Product Code |
DSU840
|
||||
app s | Person at the applicant's address to receive grant or for contact | |||||
1 2 | Name |
G******** G********
|
||||
1 2 | Title |
Manager
|
||||
1 2 | Telephone Number |
+1312********
|
||||
1 2 | Fax Number |
+1847********
|
||||
1 2 |
g******@jvapartners.com
|
|||||
app s | Technical Contact | |||||
n/a | ||||||
app s | Non Technical Contact | |||||
n/a | ||||||
app s | Confidentiality (long or short term) | |||||
1 2 | Does this application include a request for confidentiality for any portion(s) of the data contained in this application pursuant to 47 CFR § 0.459 of the Commission Rules?: | Yes | ||||
1 2 | Long-Term Confidentiality Does this application include a request for confidentiality for any portion(s) of the data contained in this application pursuant to 47 CFR § 0.459 of the Commission Rules?: | Yes | ||||
1 2 | If so, specify the short-term confidentiality release date (MM/DD/YYYY format) | 07/12/2023 | ||||
if no date is supplied, the release date will be set to 45 calendar days past the date of grant. | ||||||
app s | Cognitive Radio & Software Defined Radio, Class, etc | |||||
1 2 | Is this application for software defined/cognitive radio authorization? | No | ||||
1 2 | Equipment Class | DTS - Digital Transmission System | ||||
1 2 | DXX - Part 15 Low Power Communication Device Transmitter | |||||
1 2 | Description of product as it is marketed: (NOTE: This text will appear below the equipment class on the grant) | Bluetooth Module | ||||
1 2 | Related OET KnowledgeDataBase Inquiry: Is there a KDB inquiry associated with this application? | No | ||||
1 2 | Modular Equipment Type | Single Modular Approval | ||||
1 2 | Purpose / Application is for | Original Equipment | ||||
1 2 | Composite Equipment: Is the equipment in this application a composite device subject to an additional equipment authorization? | Yes | ||||
1 2 | Related Equipment: Is the equipment in this application part of a system that operates with, or is marketed with, another device that requires an equipment authorization? | No | ||||
1 2 | Grant Comments | Single Modular Approval. Output power listed is conducted. This grant is valid only when the module is sold to OEM integrators and must be installed by the OEM or OEM integrators. This device meets the SAR test exemption threshold listed in KDB447498 and is authorized for portable or mobile operation. Co-location of this module with other transmitters that operate simultaneously are required to be evaluated using the FCC multi-transmitter procedures. The module grantee is responsible for providing the documentation to the system integrator on restrictions of use, for continuing compliance of the module. | ||||
1 2 | Single Modular Approval. This device meets the SAR test exemption threshold listed in KDB447498 and is authorized for portable or mobile operation. This grant is valid only when the module is sold to OEM integrators and must be installed by the OEM or OEM integrators. Co-location of this module with other transmitters that operate simultaneously are required to be evaluated using the FCC multi-transmitter procedures. The module grantee is responsible for providing the documentation to the system integrator on restrictions of use, for continuing compliance of the module. | |||||
1 2 | Is there an equipment authorization waiver associated with this application? | No | ||||
1 2 | If there is an equipment authorization waiver associated with this application, has the associated waiver been approved and all information uploaded? | No | ||||
app s | Test Firm Name and Contact Information | |||||
1 2 | Firm Name |
International Certification Corp.
|
||||
1 2 |
Laird Connectivity LLC
|
|||||
1 2 | Name |
F******** C********
|
||||
1 2 |
A******** A******
|
|||||
1 2 | Telephone Number |
886-3******** Extension:
|
||||
1 2 |
262 3********
|
|||||
1 2 | Fax Number |
886-3********
|
||||
1 2 |
262 3********
|
|||||
1 2 |
J******@icertifi.com.tw
|
|||||
1 2 |
a******@lairdconnect.com
|
|||||
Equipment Specifications | |||||||||||||||||||||||||||||||||||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Line | Rule Parts | Grant Notes | Lower Frequency | Upper Frequency | Power Output | Tolerance | Emission Designator | Microprocessor Number | |||||||||||||||||||||||||||||||||
1 | 1 | 15C | CC | 2402.00000000 | 2480.00000000 | 0.0060000 | |||||||||||||||||||||||||||||||||||
Line | Rule Parts | Grant Notes | Lower Frequency | Upper Frequency | Power Output | Tolerance | Emission Designator | Microprocessor Number | |||||||||||||||||||||||||||||||||
2 | 1 | 15C | CC | 2402.00000000 | 2480.00000000 |
some individual PII (Personally Identifiable Information) available on the public forms may be redacted, original source may include additional details
This product uses the FCC Data API but is not endorsed or certified by the FCC