ESP32-WROOM-32E User Manual Version 0.1 Espressif Systems Copyright 2019 www.espressif.com About This Document This document provides the specifications for the ESP32-WROOM-32E modules with PCB antenna. Revision History For revision history of this document, please refer to the last page. Y Y Y R R R A A A Documentation Change Notification Espressif provides email notifications to keep customers updated on changes to technical documentation. Please subscribe at www.espressif.com/en/subscribe. Certification Download certificates for Espressif products from www.espressif.com/en/certificates. L I M I N L I M I N L I M I N Disclaimer and Copyright Notice Information in this document, including URL references, is subject to change without notice. THIS DOCUMENT IS PROVIDED AS IS WITH NO WARRANTIES WHATSOEVER, INCLUDING ANY WARRANTY OF MERCHANTABIL-ITY, NON-INFRINGEMENT, FITNESS FOR ANY PARTICULAR PURPOSE, OR ANY WARRANTY OTHERWISE ARISING OUT OF ANY PROPOSAL, SPECIFICATION OR SAMPLE. All liability, including liability for infringement of any proprietary rights, relating to use of information in this docu-
ment is disclaimed. No licenses express or implied, by estoppel or otherwise, to any intellectual property rights are granted herein. The Wi-Fi Alliance Member logo is a trademark of the Wi-Fi Alliance. The Bluetooth logo is a registered trademark of Bluetooth SIG. All trade names, trademarks and registered trademarks mentioned in this document are property of their E E E respective owners, and are hereby acknowledged. Copyright 2019 Espressif Inc. All rights reserved. P R P R P R 1. Overview 1. Overview Y ESP32-WROOM-32E is a powerful, generic WiFi-BT-BLE MCU module that targets a wide variety of applications, ranging from low-power sensor networks to the most demanding tasks, such as voice encoding, music streaming and MP3 decoding. This is a SMD Module with 2.4 GHz PCB antenna on board. It reserves tuning circuit for antenna impedance matching. It is with all GPIOs on the pin-out except the ones already used for connecting flash. The Module's working voltage can be range from 3.0 V to 3.6 V. Frequency range is 2400 MHz to 2483.5 MHz. External 40 MHz as clock source for system. There is also a 4 MB SPI flash for storing user programs and data. The ordering information of ESP32-WROOM-32E is listed as follows:
Table 1: ESP32-WROOM-32E Ordering Information Module Chip embedded Flash PSRAM Module dimensions (mm) ESP32-WROOM-32E ESP32-D0WD-
V3 4 MB 1
(18.00 0.10) X (25.50 0.10) X
(3.10 0.10) mm (including metallic shield) Notes:
1. ESP32-WROOM-32E (PCB) with 8 MB flash or 16 MB flash is available for custom order. 2. For detailed ordering information, please see Espressif Product Ordering Information. 3. For dimensions of the IPEX connector, please see Chapter 10. R A At the core of the module is the ESP32-D0WD-V3 chip*. The chip embedded is designed to be scalable and adaptive. There are two CPU cores that can be individually controlled, and the CPU clock frequency is adjustable from 80 MHz to 240 MHz. The user may also power off the CPU and make use of the low-power co-processor to constantly monitor the peripherals for changes or crossing of thresholds. ESP32 integrates a rich set of peripherals, ranging from capacitive touch sensors, Hall sensors, SD card interface, Ethernet, high-speed SPI, UART, IS and IC. L I M I N Note:
* For details on the part numbers of the ESP32 family of chips, please refer to the document ESP32 Datasheet. The integration of Bluetooth, Bluetooth LE and Wi-Fi ensures that a wide range of applications can be targeted, and that the module is all-around: using Wi-Fi allows a large physical range and direct connection to the Internet through a Wi-Fi router, while using Bluetooth allows the user to conveniently connect to the phone or broadcast low energy beacons for its detection. The sleep current of the ESP32 chip is less than 5 A, making it suitable for battery powered and wearable electronics applications. The module supports a data rate of up to 150 Mbps, As such the module does offer industry-leading specifications and the best performance for electronic integration, range, power consumption, and connectivity. E P R The operating system chosen for ESP32 is freeRTOS with LwIP; TLS 1.2 with hardware acceleration is built in as well. Secure (encrypted) over the air (OTA) upgrade is also supported, so that users can upgrade their products even after their release, at minimum cost and effort. Table 2 provides the specifications of ESP32-WROOM-32E. Espressif Systems 1 ESP32-WROOM-32E User Manual 1. Overview Table 2: ESP32-WROOM-32E Specifications Categories Items Specifications Test Reliablity HTOL/HTSL/uHAST/TCT/ESD 802.11 b/g/n20/n40 A-MPDU and A-MSDU aggregation and 0.4 s guard in-
terval support 2.412 GHz ~ 2.462GHz Bluetooth v4.2 BR/EDR and BLE specification NZIF receiver with 97 dBm sensitivity Class-1, class-2 and class-3 transmitter AFH CVSD and SBC SD card, UART, SPI, SDIO, I2C, LED PWM, Motor PWM, I2S, IR, pulse counter, GPIO, capacitive touch sensor, ADC, DAC Y R A
(18.000.10) mm (31.400.10) mm (3.300.10) mm Wi-Fi Protocols Frequency range Protocols Bluetooth Radio Audio Hardware Integrated PSRAM Operating voltage/Power supply 3.0 V ~ 3.6 V Minimum current delivered by Module interfaces On-chip sensor Integrated crystal Integrated SPI flash 40 MHz crystal Hall sensor 4 MB
L I M I N 40 C ~ 85 C 500 mA Recommended operating tem-
power supply perature range Package size E Moisture sensitivity level (MSL) Level 3 P R Espressif Systems V0.1 2 ESP32-WROOM-32E User Manual 2. Pin Definitions 2. Pin Definitions 2.1 Pin Layout Figure 1: Pin Layout of ESP32-WROOM-32E (Top View) Espressif Systems 3 ESP32-WROOM-32E Datasheet 2. Pin Definitions 2.2 Pin Description ESP32-WROOM-32E has 38 pins. See pin definitions in Table 3. Table 3: Pin Definitions No. 1 Type P P Function Ground Power supply Name GND 3V3 EN SENSOR_VP 4 SENSOR_VN 5 Module-enable signal. Active high. GPIO36, ADC1_CH0, RTC_GPIO0 GPIO39, ADC1_CH3, RTC_GPIO3 GPIO34, ADC1_CH6, RTC_GPIO4 GPIO35, ADC1_CH7, RTC_GPIO5 Y R A GPIO32, XTAL_32K_P (32.768 kHz crystal oscillator input), ADC1_CH4, TOUCH9, RTC_GPIO9 GPIO33, XTAL_32K_N (32.768 kHz crystal oscillator output), GPIO12, ADC2_CH5, TOUCH5, RTC_GPIO15, MTDI, HSPIQ, GPIO25, DAC_1, ADC2_CH8, RTC_GPIO6, EMAC_RXD0 GPIO26, DAC_2, ADC2_CH9, RTC_GPIO7, EMAC_RXD1 GPIO27, ADC2_CH7, TOUCH7, RTC_GPIO17, EMAC_RX_DV GPIO14, ADC2_CH6, TOUCH6, RTC_GPIO16, MTMS, HSPICLK, ADC1_CH5, TOUCH8, RTC_GPIO8 HS2_CLK, SD_CLK, EMAC_TXD2 L I M I N Ground
HS2_DATA2, SD_DATA2, EMAC_TXD3 HS2_DATA3, SD_DATA3, EMAC_RX_ER GPIO13, ADC2_CH4, TOUCH4, RTC_GPIO14, MTCK, HSPID, 2 3 6 7 8 9 10 11 12 13 14 15 16 26 27 28 29 30 I I I I I I/O I/O I/O I/O I/O I/O I/O I/O P
E
I/O I/O I/O I/O I/O I/O 20 19 17 18 P R 21 22 23
IO34 IO35 IO32 IO33 IO25 IO26 IO27 IO14 IO12 GND IO13 NC NC NC NC NC NC IO15 IO2 IO0 IO4 IO16 IO17 IO5 IO18 GPIO15, ADC2_CH3, TOUCH3, MTDO, HSPICS0, RTC_GPIO13, HS2_CMD, SD_CMD, EMAC_RXD3 GPIO2, ADC2_CH2, TOUCH2, RTC_GPIO12, HSPIWP, HS2_DATA0, 24 I/O 25 I/O SD_DATA0 EMAC_TX_CLK GPIO0, ADC2_CH1, TOUCH1, RTC_GPIO11, CLK_OUT1, GPIO4, ADC2_CH0, TOUCH0, RTC_GPIO10, HSPIHD, HS2_DATA1, SD_DATA1, EMAC_TX_ER GPIO16, HS1_DATA4, U2RXD, EMAC_CLK_OUT GPIO17, HS1_DATA5, U2TXD, EMAC_CLK_OUT_180 -
GPIO5, VSPICS0, HS1_DATA6, EMAC_RX_CLK GPIO18, VSPICLK, HS1_DATA7 Espressif Systems 4 ESP32-WROOM-32E User Manual 2. Pin Definitions Name IO19 NC IO21 RXD0 TXD0 IO22 IO23 GND Notice:
No. 31 Type I/O Function GPIO19, VSPIQ, U0CTS, EMAC_TXD0 32 33 34 35 36 37 38
I/O I/O I/O I/O I/O P
GPIO21, VSPIHD, EMAC_TX_EN GPIO3, U0RXD, CLK_OUT2 GPIO1, U0TXD, CLK_OUT3, EMAC_RXD2 GPIO22, VSPIWP, U0RTS, EMAC_TXD1 GPIO23, VSPID, HS1_STROBE Ground
* GPIO6 to GPIO11 are connected to the SPI flash integrated on the module and are not connected out. Y R A 2.3 Strapping Pins ESP32 has five strapping pins, which can be seen in Chapter 6 Schematics:
L I M I N Software can read the values of these five bits from register GPIO_STRAPPING. During the chips system reset release (power-on-reset, RTC watchdog reset and brownout reset), the latches of the strapping pins sample the voltage level as strapping bits of 0 or 1, and hold these bits until the chip is powered down or shut down. The strapping bits configure the devices boot mode, the operating voltage of VDD_SDIO and other initial system settings. Each strapping pin is connected to its internal pull-up/pull-down during the chip reset. Consequently, if a strapping pin is unconnected or the connected external circuit is high-impedance, the internal weak pull-up/pull-
down will determine the default input level of the strapping pins. To change the strapping bit values, users can apply the external pull-down/pull-up resistances, or use the host MCUs GPIOs to control the voltage level of these pins when powering on ESP32. After reset release, the strapping pins work as normal-function pins. Refer to Table 4 for a detailed boot-mode configuration by strapping pins. E MTDI GPIO0 GPIO2 MTDO GPIO5 P R Table 4: Strapping Pins Voltage of Internal LDO
(VDD_SDIO) Pin Default MTDI Pull-down 3.3 V 0 1.8 V 1 Espressif Systems 5 ESP32-WROOM-32E UserManual Booting Mode Download Boot 2. Pin Definitions Pin Default GPIO0 Pull-up GPIO2 Pull-down Pin Default MTDO Pull-up SPI Boot Dont-care 1 1 Enabling/Disabling Debugging Log Print over U0TXD During Booting U0TXD Active U0TXD Silent Timing of SDIO Slave Pin Default MTDO Pull-up GPIO5 Pull-up 0 Falling-edge Sampling Falling-edge Sampling Rising-edge Sampling Rising-edge Sampling Falling-edge Output 0 Rising-edge Output 0 Falling-edge Output 1 Rising-edge Output 1 1 0 1 0 0 0 Y Note:
Firmware can configure register bits to change the settings of Voltage of Internal LDO (VDD_SDIO) and Timing of SDIO Slave after booting. Internal pull-up resistor (R9) for MTDI is not populated in the module, as the flash and SRAM in ESP32-
WROOM-32E only support a power voltage of 3.3 V (output by VDD_SDIO) R A L I M I N E P R Espressif Systems 6 ESP32-WROOM-32E User Manual 3. Functional Description 3. Functional Description This chapter describes the modules and functions integrated in ESP32-WROOM-32E. 3.1 CPU and Internal Memory ESP32-D0WD-V3 contains two low-power Xtensa 32-bit LX6 microprocessors. The internal memory includes:
448 KB of ROM for booting and core functions. 520 KB of on-chip SRAM for data and instructions. 8 KB of SRAM in RTC, which is called RTC FAST Memory and can be used for data storage; it is accessed by the main CPU during RTC Boot from the Deep-sleep mode. 8 KB of SRAM in RTC, which is called RTC SLOW Memory and can be accessed by the co-processor during the Deep-sleep mode. 1 Kbit of eFuse: 256 bits are used for the system (MAC address and chip configuration) and the remaining 768 bits are reserved for customer applications, including flash-encryption and chip-ID. R A Y 3.2 External Flash and SRAM ESP32 supports multiple external QSPI flash and SRAM chips. More details can be found in Chapter SPI in the ESP32 Technical Reference Manual. ESP32 also supports hardware encryption/decryption based on AES to pro-tect developers programs and data in flash. ESP32 can access the external QSPI flash and SRAM through high-speed caches. The external flash can be mapped into CPU instruction memory space and read-only memory space L I M I N When external flash is mapped into CPU instruction memory space, up to 11 MB + 248 KB can be mapped at a time. Note that if more than 3 MB + 248 KB are mapped, cache performance will be reduced due to speculative reads by the CPU. When external flash is mapped into read-only data memory space, up to 4 MB can be mapped at a time. 8-bit, 16-bit and 32-bit reads are supported. External SRAM can be mapped into CPU data memory space. Up to 4 MB can be mapped at a time. 8-
bit, 16-bit and 32-bit reads and writes are supported. ESP32-WROOM-32E integrates a 4 MB SPI flash more memory space. E simul-taneously. P R 3.3 Crystal Oscillators The module uses a 40-MHz crystal oscillator. Espressif Systems 7 ESP32-WROOM-32E User Manual 3. Functional Description 3.4 RTC and Low-Power Management With the use of advanced power-management technologies, ESP32 can switch between different power modes. For details on ESP32s power consumption in different power modes, please refer to section RTC and Low-
Power Management in ESP32 User Manual. Y R A L I M I N E P R Espressif Systems V0.1 8 ESP32-WROOM-32E User Manual 4. Peripherals and Sensors 4. Peripherals and Sensors Please refer to Section Peripherals and Sensors in ESP32 User Manual. Note:
External connections can be made to any GPIO except for GPIOs in the range 6-11, 16, or 17. GPIOs 6-11 are connected to the modules integrated SPI flash. For details, please see Section 6 Schematics. Y R A L I M I N E P R Espressif Systems 9 ESP32-WROOM-32E User Manual 5. Electrical Characteristics 5. Electrical Characteristics 5.1 Absolute Maximum Ratings R A Stresses beyond the absolute maximum ratings listed in the table below may cause permanent damage to the device. These are stress ratings only, and do not refer to the functional operation of the device that should follow the recommended operating conditions. Table 5: Absolute Maximum Ratings 1. The module worked properly after a 24-hour test in ambient temperature at 25 C, and the IOs in three domains
(VDD3P3_RTC, VDD3P3_CPU, VDD_SDIO) output high logic level to ground. 2. Please see Appendix IO_MUX of ESP32 Datasheet for IOs power domain. Y 5.2 Recommended Operating Conditions Table 6: Recommended Operating Conditions Parameter Power supply voltage Current delivered by external power supply Operating temperature Min 3.0 0.5 40 Typical 3.3
Max 3.6
85 Unit V A C L I M I N 5.3 DC Characteristics (3.3 V, 25 C) Table 7: DC Characteristics (3.3 V, 25 C) Parameter Min Typ Max Low-level input current Low-level output voltage High-level output voltage
0.8VDD1
VDD3P3_CPU power domain 1; 2 -
High-level source current
(VDD1 = 3.3 V, VOH >= 2.64 V, VDD3P3_RTC power domain 1; 2 -
output drive strength set to the VDD_SDIO power domain 1; 3
maximum) 2
0.75VDD1 -
0.3
VDD1+0.3 V 0.25VDD1 V 50 50
V 0.1VDD1 V
Unit pF nA nA mA mA mA
40 40 20
E Pin capacitance High-level input voltage Low-level input voltage High-level input current Symbol VDD33 I V DD T P R IL IN IH Symbol C V V I IH I IL V V OH OL I OH Espressif Systems 10 ESP32-WROOM-32E User Manual 5. Electrical Characteristics Symbol Parameter Min Typ Max Unit Low-level sink current
(VDD1 = 3.3 V, VOL = 0.495 V, output drive strength set to the maximum) Resistance of internal pull-up resistor Resistance of internal pull-down resistor IL_nRST Low-level input voltage of CHIP_PU to power off the chip I OL R R V P U P D Notes:
28 45 45
0.6 mA k k V 1. Please see Appendix IO_MUX of ESP32 Datasheet for IOs power domain. VDD is the I/O voltage for a particular power domain of pins. 2. For VDD3P3_CPU and VDD3P3_RTC power domain, per-pin current sourced in the same domain is gradually reduced from around 40 mA to around 29 mA, VOH>=2.64 V, as the number of current-source pins increases. 3. Pins occupied by flash and/or PSRAM in the VDD_SDIO power domain were excluded from the test. 5.4 Wi-Fi Radio RF Power Sensitivity Adjacent channel rejection Table 8: Wi-Fi Radio Characteristics Parameter Operating frequency range note1
Condition Min 2412 Typical
Max 2462 802.11b:26dBm 802.11g:25.42dBm 802.11n20:25.48dBm 802.11n40:25.78dBm 11b, 1 Mbps 11b, 11 Mbps 11g, 6 Mbps 11g, 54 Mbps 11n, HT20, MCS0 11n, HT20, MCS7 11n, HT40, MCS0 11n, HT40, MCS7 11g, 6 Mbps 11g, 54 Mbps 11n, HT20, MCS0 11n, HT20, MCS7
98 89 92 74 91 71 89 69 31 14 31 13
Unit MHz dBm dBm dBm dBm dBm dBm dBm dBm dBm dB dB dB dB 1. Device should operate in the frequency range allocated by regional regulatory authorities. Target operating frequency range is configurable by software. 2. Target TX power is configurable based on device or certification requirements. Espressif Systems 11 ESP32-WROOM-32E User Manual 5. Electrical Characteristics 5.5 Bluetooth/BLE Radio 5.5.1 Receiver Parameter Sensitivity @30.8% PER Maximum received signal @30.8% PER Co-channel C/I Adjacent channel selectivity C/I Out-of-band blocking performance Intermodulation 5.5.2 Transmitter E RF power control range Parameter RF Frequency Gain control step P R f1avg f2 max f2avg/ f1avg ICFT Drift rate Drift Table 9: Receiver Characteristics Bluetooth/BLE Conditions
F = F0 + 1 MHz F = F0 1 MHz F = F0 + 2 MHz F = F0 2 MHz F = F0 + 3 MHz F = F0 3 MHz Min
0
A Typ 97
+10 R 5 5 25 35 25 45
Unit dBm dBm dB
Max
Y
dB dB dB dB
dB dB dBm dBm dBm dBm dBm 30 MHz ~ 2000 MHz 10 2000 MHz ~ 2400 MHz 27 2500 MHz ~ 3000 MHz 27 3000 MHz ~ 12.5 GHz 10
36 L I M I N Conditions
Table 10: Transmitter Characteristics Bluetooth/BLE
Min 2402
12
247 Typ
3
52 58 60
0.92 10 0.7 2 Max 2480
+10
265
Unit MHz dBm dBm dBm dBm dBm kHz kHz
kHz kHz/50 s kHz Adjacent channel transmit power F = F0 3 MHz F = F0 2 MHz F = F0 > 3 MHz Espressif Systems 12 ESP32-WROOM-32E User Manual 5. Electrical Characteristics 5.6 Reflow Profile e r u t a r e p m e T
250 217 200 100 50 25 0 Ramp-up zone 1 ~ 3/s E P R Preheating zone 150 ~ 200 60 ~ 120s Reflow zone
!217 60 ~ 90s Cooling zone
-1 ~ -5/s Peak Temp. 235 ~ 250 Soldering time
> 30s Y R Time (sec.) 0 50 200 250 Ramp-up zone Temp.: <150 Time: 60 ~ 90s Ramp-up rate: 1 ~ 3/s Preheating zone Temp.: 150 ~ 200 Time: 60 ~ 120s Ramp-up rate: 0.3 ~ 0.8/s Reflow zone Temp.: >217 7LPH60 ~ 90s; Peak Temp.: 235 ~ 250 (<245 recommended) Time: 30 ~ 70s Cooling zone Peak Temp. ~ 180 Ramp-down rate: -1 ~ -5/s Solder Sn&Ag&Cu Lead-free solder (SAC305) A 150 100 L I M I N Figure 2: Reflow Profile Espressif Systems 13 ESP32-WROOM-32E UserManual 6. Antenna Specifications 6 Antenna Specifications 6.1. 1 PCB Antenna Model: ESP ANT B Assembly: PTH Gain:
3.40 Espressif Systems 14 ESP32-WROOM-32E UserManual 6. Antenna Specifications Dimensions:
Pattern Plots:
ONFID E Espressif Systems 15 ESP32-WROOM-32E UserManual 6. Antenna Specifications ONFID E Espressif Systems 16 ESP32-WROOM-32E UserManual 6. Antenna Specifications Revision History be required as specified by 2.1093. Date Version Release notes 2020.02 V0.1 Preliminary release for certification CE& FCC OEM Guidance 1. Applicable FCC rules This module is granted by Single Modular Approval. It complies to the requirements of FCC part 15C, section 15.247 rules. 2. The specific operational use conditions This module can be used in IoT devices. The input voltage to the module is nominally 3.3V-3.6 V DC. The operational ambient temperature of the module is -30 to 85 degree C. Only the embedded PCB antenna is allowed. Any other external antenna is prohibited. 3. Limited module procedures 4. Trace antenna design N/A N/A 5. RF exposure considerations The equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20cm between the radiator and your body. If the equipment built into a host as a portable usage, the additional RF exposure evaluation may be required as specified by 2.1093. 6. Antenna Antenna type: PCB antenna; Peak gain: 3.40dBi 7. Label and compliance information An exterior label on OEMs end product can use wording such as the following:
Contains Transmitter Module FCC ID: 2AC7Z-ESP32WROOM32E or Contains FCC ID: 2AC7Z-ESP32WROOM32E. 8. Information on test modes and additional testing requirements a)The modular transmitter has been fully tested by the module grantee on the required number of channels,modulation types, and modes, it should not be necessary for the host installer to re-test all the available transmitter modes or settings. It is recommended that the host product manufacturer, installing the modular transmitter,perform some investigative measurements to confirm that the resulting composite system does not exceed the spurious emissions limits or band edge limits (e.g., where a different antenna may be causing additional emissions). b)The testing should check for emissions that may occur due to the intermixing of emissions with the other transmitters, digital circuitry, or due to physical properties of the host product
(enclosure). This investigation is especially important when integrating multiple modular transmitters where the certification is based on testing each of them in a stand-alone configuration. It is important to note that host product manufacturers should not assume that because the modular transmitter is certified that they do not have any responsibility for final product compliance. c)If the investigation indicates a compliance concern the host product manufacturer is obligated to mitigate the issue. Host products using a modular transmitter are subject to all the applicable individual technical rules as well as to the general conditions of operation in Sections 15.5, 15.15, and 15.29 to not cause interference. The operator of the host product will be obligated to stop operating the device until the interference have been corrected . 9. Additional testing, Part 15 Sub part B disclaimer The final host / module combination need to be evaluated against the FCC Part 15B criteria for unintentional radiators in order to be properly authorized for operation as a Part 15 digital device. The host integrator installing this module into their product must ensure that the final composite product complies with the FCC requirements by a technical assessment or evaluation to the FCC rules, including the transmitter operation and should refer to guidance in KDB 996369. For host products with certified modular transmitter, the frequency range of investigation of the composite system is specified by rule in Sections 15.33(a)(1) through
(a)(3), or the range applicable to the digital device, as shown in Section 15.33(b)(1), whichever is the higher frequency range of investigation When testing the host product, all the transmitters must be operating.The transmitters can be enabled by using publicly-
available drivers and turned on, so the transmitters are active. In certain conditions it might be appropriate to use a technology-specific call box (test set) where accessory 50 devices or drivers are not available. When testing for emissions from the unintentional radiator, the transmitter shall be placed in the receive mode or idle mode, if possible. If receive mode only is not possible then, the radio shall be passive (preferred) and/or active scanning. In these cases, this would need to enable activity on the communication BUS (i.e., PCIe, SDIO, USB) to ensure the unintentional radiator circuitry is enabled. Testing laboratories may need to add attenuation or filters depending on the signal strength of any active beacons (if applicable) from the enabled radio(s). See ANSI C63.4, ANSI C63.10 and ANSI C63.26 for further general testing details. The product under test is set into a link/association with a partnering device, as per the normal intended use of the product. To ease testing, the product under test is set to transmit at a high duty cycle, such as by sending a file or streaming some media content. FCC Warning:
Any Changes or modifications not expressly approved by the party responsible for compliance could void the users authority to operate the equipment. This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) This device must accept any interference received, including interference that may cause undesired operation