FCC ID: X8WBC40 Bluetooth 5.1 Module

 

BLE 5.1, Modules, BC40C, BC40M, BC40P

Ver 0.90 May 2021

BluNor BC40C is a powerful, highly flexible, ultra low power Bluetooth Low Energy (BLE) using Nordic

nRF5340 SoC. With a dual core ARM CortexTM M33 MCU, embedded 2.4GHz multi-protocol transceiver, and

an integrated PCB trace antenna or a chip antenna. It allows faster time to market with reduced development

cost.

No external component needed to minimize host PCB area: Both 32 MHz and 32.768 KHz, -40oC to +105oC,

20 PPM crystals are integrated. DCDC inductors for VDD and VDDH are integrated.

Specifications:

nRF5340 CLAA, dual core ARM® Cortex M33

Application Core

• 128/64 MHz Cortex M33 with FPU and DSP

instructions

• 1MB flash, 512KB RAM

• 8KB 2-way set associate cache

• ARM® TrustZone® Cryptocell-312 co-processor

Network core:

• 64 MHz Cortex M33 with 2KB instruction cache

• 256KB flash, 64KB RAM

• 2.6 mA in RX and 3.2 mA in 0dBm TX

• Receiver Sensitivity: -98 dBm at 1Mbps

• TX power: programmable +3dBm to -20dBm

• BLE 5.1 data rate: 2Mbps, 1Mbps, 500kbps, 125kbps.

•

•

DC-DC converter, inductors for VDD, VDDH on

Direct powered by Lithium batteries or USB supply (up

board.

to 5.5V)

Serial Wire Debug (SWD)

Model Summaries

module

SoC

Size

32 MHz and 32.768 kHz crystals

DC converter inductors, VDD,VDDH

BC40C

nRF5340 CLAA

8.4x11.5x1.5 mm

Integrated

Integrated

Nordic SoftDevice Ready

Over-the-Air (OTA) firmware update

48 General purpose I/O pins

USB 2.0 full speed (12 Mbps) controller

QSPI interface

Type 2 NFC-A tag with wake-on field, Touch-to-pair

support

Programmable peripheral interconnect (PPI)

12 bit/200 Ksps ADC, 8 configurable channels with

programmable gain

Temperature sensor

Up to 3x pulse width modulator (PWM)

Audio peripherals: I2S, digital microphone interface

(PDM)

5 x 32 bit timers with counter mode

Up to 3x SPI masters/3x SPI slaves

Up to 2x I2C compatible 2-wire masters/slaves

2x UART (CTS/RTS)

Quadrature Demodulator (QDEC)

2x real time counters (RTC)

LGA pins: 64.

Both 32 MHz and 32.768KHz crystals on board

Integrated PCB trace or chip antenna

Operation voltage: 1.7V to 5.5V

Q D I D :

BC40P

nRF5340 CLAA

8.4x9x1.5mm

Integrated

Integrated

BC40M

nRF5340 CLAA

8.4(10.1)x12.7x1.5mm

Integrated

Integrated

PCB trace

Note: can only used with the

identical trace as approved,

and designed in the manual.

Modification of the trace

requires class II of the

antenna changes.

BT Antenna

Chip

Pads for external

Max TX

Operating temp.

Availability

-40oC to +105oC

Sample 05/2021

-40oC to +105oC

Sample 05/2021

-40oC to +105oC

Sample 06/2021

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Table Of Contents

Specifications: ...................................................................................................................................................... 1

Model Summaries ................................................................................................................................................ 1

1. Introduction ........................................................................................................................................................ 3

BC40C Block Diagram ......................................................................................................................................... 3

BC40C...................................................................................................................................................................... 3

BC40M ..................................................................................................................................................................... 3

BC40P ...................................................................................................................................................................... 3

2. Codes Development Using Nordic Tools .......................................................................................................... 4

Over-The-Air DFU ................................................................................................................................................ 4

nRF Connect SDK ................................................................................................................................................ 4

Development Tools .............................................................................................................................................. 4

3. Product Descriptions ......................................................................................................................................... 5

Block Diagram of nRF5340 .................................................................................................................................. 6

Mechanical Drawings ........................................................................................................................................... 8

Pin Assignments of BC40C ............................................................................................................................... 11

Pin Function ....................................................................................................................................................... 14

Mounting BC40M and BC40C on the Host PCB ............................................................................................... 15

Host Board Design for Low Cost or Long Range .............................................................................................. 16

4. BC40C Evaluation Board................................................................................................................................. 17

EV-BC40C and EV-BC40M Evaluation Board Schematics .............................................................................. 18

EV-BC40P Evaluation Board Schematics ......................................................................................................... 19

Nordic Development Tools ................................................................................................................................ 20

Android OS Apps ............................................................................................................................................... 20

iOS Apps ............................................................................................................................................................ 20

EV-BC40C EvaluationBoard Schematics ......................................................................................................... 21

Suggestion for Battery Power Application ......................................................................................................... 21

5. Miscellaneous .................................................................................................................................................. 22

Soldering Temperature-Time Profile for Re-Flow Soldering ............................................................................. 22

Cautions, Design Notes, and Installation Notes ................................................................................................ 22

Packaging and Lot Number ............................................................................................................................... 26

FCC LABEL ......................................................................................................................................................... 26

Revision History ..................................................................................................................................................... 27

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1. Introduction

BluNor BC40C Series are powerful, highly flexible, ultra low power wireless modules using Nordic nRF5340

SoCs. With a dual core ARM CortexTM M33 MCU, embedded 2.4GHz multi-protocol transceiver, and an

integrated antenna, it allows faster time to market with reduced development cost.

BC40C Block Diagram

The following is a block diagram of BC40C. Antenna circuit and main clock are integrated. All 48 GPIOs of

nRF5340 can be accessed from main board. For lower power consumption at idle state, a 32.768 kHz crystal

can be added on the host board.

There are 2 modules in the BC40C Series.

BC40C

• Uses an nRF5340 CLAA with dual core Cortex M33 MCU

•

Integrated chip antenna.

• Size: 8.4x11.5x1.5mm

BC40M

• Uses an nRF5340 CLAA with dual core Cortex M33 MCU

•

Integrated PCB trace antenna.

• Size: 8.4 (10.1)x12.7x1.5mm, L shape.

BC40P

• Uses an nRF5340 CLAA with dual core Cortex M33 MCU

• Pads for an external antenna.

• Size: 8.4x9.0x1.5mm.

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2. Codes Development Using Nordic Tools

Development tools from Nordic and other third party development tools recommended by Nordic should be

used.

Over-The-Air DFU

The nRF52840 is supported by an Over-The-Air Device Firmware Upgrade (OTA DFU) feature. This allows for

in the field updates of application software and SoftDevice.

nRF Connect SDK

nRF Connect SDK is a scalable and unified software development kit for building products based on all our nRF52,

nRF53 and nRF91 Series wireless devices. It offers developers an extensible framework for building size-optimized

software for memory-constrained devices as well as powerful and complex software for more advanced devices and

applications. It integrates the Zephyr RTOS and a wide range of samples, application protocols, protocol stacks, libraries

and hardware drivers.

For developing Bluetooth Low Energy, Thread and Zigbee products, the nRF Connect SDK contains all needed software,

including protocol stacks. For developing cellular IoT products it contains everything except the LTE modem firmware

that must be downloaded separately from the nRF9160 SiP product page. See the cellular IoT software for more details.

nRF Connect SDK also offers an unique integration of HomeKit Accessory Development Kit for developing products

using both HomeKit over Thread and HomeKit over Bluetooth Low Energy. It is a highly optimized solution that enables

battery-powered products with both the HomeKit Accessory Protocol (HAP) and application firmware running on a single

chip. MFi licensees can get access to the HomeKit repository by contacting us via Nordic DevZone private ticket.

nRF Connect SDK offers a single code base for all our devices and software components. It simplifies porting modules,

libraries and drivers from one application to another, thus reducing development time. By enabling developers to pick and

choose the essential software components for their application, high memory efficiency is guaranteed.

nRF Connect SDK is publicly hosted on GitHub, offers source code management with Git and has free SEGGER

Embedded Studio IDE support. Nordic runs continuous integration tests on the nRF Connect SDK code to ensure robust

and secure production quality code.

Development Tools

Nordic Semiconductor provides a complete range of hardware and software development tools for the nRF53 Series

devices. nRF53 DK board is recommended for firmware development.

Nordic software development tools can be downloaded.

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3. Product Descriptions

Brief description of nRF5340 SoC is provided. For full description of the SoC, please download from Nordic

Semiconductor website.

https://www.nordicsemi.com/eng/Products/Bluetooth-low-energy

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Block Diagram of nRF5340

The following is a block diagram of Nordic nRF5340 Bluetooth Low Energy (BLE) SoC. Arrows with white

heads indicate signals that share physical pins with other signals.

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nRF5340 is a wireless ultra-low power multiple core System on Chip (SoC) integrating two fully programmable

Arm Cortex M33 processors, advanced security features, a range of peripherals, and a multi protocol 2.4 GHz

transceiver. transceiver supports Bluetooth low energy.

The two Arm Cortex M33 processors share the power, clock, and peripheral architecture with Nordic

Semiconductor nRF51, nRF52, and nRF91 Series of PAN/LAN SoCs, ensuring minimal porting efforts. The

application core is a full-featured Arm Cortex M33 processor including DSP instructions and FPU and running

at up to 128 MHz with 1MB of flash and 512 KB of RAM. The option to run the application processor at 64 MHz

allows the CPU to increase energy efficiency. The network core is an Arm Cortex M33 processor with a

reduced feature set, designed for ultra-low power operation. It runs at a fixed 64 MHz frequency and contains

256 KB of flash and 64 KB of RAM.

The peripheral set offers a variety of analog and digital functionality enabling single chip implementation of a

wide range of applications. Arm trustZone technology, Arm cryptoCell-312, and supporting blocks for ysytem

protection and key management are embedded for the advanced security needed for IoT applications.

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Mechanical Drawings

Soldering pads are identical for BC40C, BC40M, and BC40P. All modules have 64 LGA (Land Grid Array) pins.

Antenna areas are different. Mechanical drawings are different.

BC40C

drawings, top

size is

mechanical

view. Module

8.4x11.5x1.5mm.

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BC40M

mechanical drawings, top view. Module size is 8.4 (10.1) x 12.7 x 1.5mm, L-shape.

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mechanical

view. Module

8.4x9.0x1.5mm.

BC40P

drawings, top

size is

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Pin Assignments of BC40C

The followings are BC40C and BC40M pin assignment. Pin functions are in a table in next section. Please refer

to Nordic nRF5340 Product Specifications for detailed descriptions and features supported.

https://infocenter.nordicsemi.com/index.jsp?topic=%2Fstruct_nrf53%2Fstruct%2Fnrf5340.html&cp=3_0

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BC40P pin assignment is below. It has two additional pins for external antenna connection.

BC40C/M/P BC40P

pin#

A0

A1

A2

A3

A4

A5

A6

A7

B0

B1

B2

B3

B4

B5

B6

B7

C0

C1

Only

1

2

nRF5340

pin#

H2

K3

K5

L7

L9

K10

L3

J3

L1

K2

K4

K7

K9

K8

J10

J6

H1

J2

pin name

ANT

GND

P109

P104

P020

P017/QSPI_CLK

P015/QSPI2

P013/QSPI0

P105

P106

P025/AIN4

P024

P022

P018/QSPI_CS

P014/QSPI1

P016/QSPI3

P007/AIN3

P012

P027/AIN6

P026/AIN5

Descriptions

Connection to an external antenna, BC40P only.

Ground for an external antenna.

GPIO

GPIO

GPIO

GPIO, Quad Serial Peripheral Interface, clock

GPIO, Quad Serial Peripheral Interface, IO2

GPIO, Quad Serial Peripheral Interface, IO0

GPIO

GPIO

GPIO, Analog input

GPIO

GPIO

GPIO, Quad Serial Peripheral Interface, chip select

GPIO, Quad Serial Peripheral Interface, IO1

GPIO, Quad Serial Peripheral Interface, IO3

GPIO, Analog input

GPIO, High speed SPI_DCX

GPIO, Analog input

GPIO, Analog input

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C2

C3

C4

C5

C6

C7

D0

D1

D2

D3

D4

D5

D6

D7

E0

E1

E2

E3

E4

E5

E6

E7

F0

F1

F2

F3

F4

F5

F6

F7

G0

G1

G2

G3

G4

G5

G6

G7

H0

H1

J4

J5

J9

J11

H12

L12

F1

F2

G2

A5

F10

G10

H3

H10

A5

E2

G3

C5

E10

D10

K12

J7

A5

E3

F3

C7

A5

B11

B12

G11

A5

C4

E4

C8

B10

A11

J8

A5

A5

P021

P019

P009

P102/I2C

P003/NFC2

P008

SWDIO

SWDCLK

/RESET

VSS

P005/AIN1

P004/AIN0

P023

P006/AIN2

GND

P029

P107

P031

P101

P100

P103/I2C

P011

GND

P028/AIN7

P108

P112

GND

VBUS

VDDH

VSS

P030

P110

P113

VDD

D-

NC

P010

GND

GND

GPIO

GPIO

GPIO, High speed SPI_MOSI

GPIO, I2C interface

GPIO, NFC antenna connection

GPIO, High speed SPI clock

Serial wire debug data for debug and programming

Serial wire debug clock for debug and programming

Reset, active low with internal pull up

Ground

GPIO, Analog input

GPIO, Analog input

GPIO

GPIO, Analog input

Ground

GPIO

GPIO

GPIO

GPIO

GPIO

GPIO, I2C interface

GPIO, High speed SPI chip select

Ground

GPIO, Analog input

GPIO

GPIO

Ground

5V input for USB 3.3V regulator

Ground

GPIO

GPIO

GPIO

DC power supply, 1.7V to 3.6V

USB data

No Connect

GPIO, high speed SPI MISO

Ground

Ground

13

High voltage DC power supply, 2.5V to 5.5V

P002/NFC1

GPIO, NFC antenna connection

BLE 5.1, Modules, BC40C, BC40M, BC40P

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C6

C9

C10

A12

A5

P111

P114

P115

D+

NC

VSS

GPIO

GPIO

GPIO

USB data

No Connect

Ground

H2

H3

H4

H5

H6

H7

Pin Function

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Mounting BC40M and BC40C on the Host PCB

The following figure shows recommended mounting of BC40M module on the host PCB.

• For the best Bluetooth range performance, the antenna area of module shall extend 4.4 mm outside the

edge of host PCB board, or 4.4 mm outside the edge of a ground plane.

• The next choice is to place a module on a corner of host PCB, the antenna area shall extend 4.4 mm from

the edge of ground plane. Ground plane shall be at least 5 mm from the edge of the antenna area of

module.

• We don’t recommend mounting BC40M module in the middle of a host PCB.

The

following figure shows recommended mounting of BC40C module on the host PCB.

• For the best Bluetooth range performance, the antenna area of module shall extend 3.2 mm outside the

edge of host PCB board, or 3.2 mm outside the edge of a ground plane.

• The next choice is to place a module on a corner of host PCB, the antenna area shall extend 3.2 mm from

the edge of ground plane. Ground plane shall be at least 5 mm from the edge of the antenna area of

module.

• We don’t recommend mounting BC40C module in the middle of a host PCB.

BC40P shall be mounted near the external connector for an antenna.

For the best Bluetooth range performance, keep all external metal at least 30mm from the antenna area.

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Host Board Design for Low Cost or Long Range

On nRF53 series SoCs, Nordic offers various memory options and protocol supports. Fanstel offers various

antenna and power amplifier options. A host board can be designed to accommodate these nRF53 modules.

Our suggestions for host PCB design:

If your main goal is minimum PCB cost,

• use a 2-sided PCB.

If you main goal is maximum wireless range,

• use a 4 or more layers PCB.

• Use library component from EV-BC40C Gerber files. They can be downloaded from

http://www.fanstel.com/download-document/. BC40C library component can be used. However, signal

routing can be difficult on a 2-sided PCB.

• Use library component from EV-C40C Gerber files. They can be downloaded from

http://www.fanstel.com/download-document/.

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4. BC40C Evaluation Board

An evaluation board consists of the followings:

• Mini USB cable

• Evaluation board

• 10-conductor cable for connection to Nordic nRF53 DK (DK is not included)

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EV-BC40C and EV-BC40M Evaluation Board Schematics

BC40C and

evaluation board

schematics can be

the EV-BC40P

schematics on the

BC40M

this one or

next page.

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EV-BC40P Evaluation Board Schematics

BC40P module has two additional pins for an external antenna. They are connected to an u.FL connector on the evaluation

board.

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Nordic Development Tools

A Nordic nRF53 DK is recommended for programming this evaluation board. Nordic development tools can be

downloaded from:

https://infocenter.nordicsemi.com/index.jsp?topic=%2Fstruct_nrf53%2Fstruct%2Fnrf5340.html

Many application examples can be downloaded from Nordic website.

Some firmware, Android OS, and iOS app codes can be downloaded from Bluetooth 5 Codes section of this

Fanstel webpage.

http://www.fanstel.com/download-document/

BC40 firmware can be used in all nRF5340 modules without power amplifier, e.g., BC40C, BC40M, and

BC40P.

Android OS Apps

The following Android OS apps are available for download from Google Play Store:

BlueNor nrf5x: to use with Bluetooth 5 stacks, AT commands, or Slave firmware. Master firmware does not

connect to a smartphone. Source codes can be downloaded from http://www.fanstel.com/download-document/

BlueNor Mesh: to use with BlueNor mesh firmware to send command to any node in a mesh. Node number is

displayed when acknowledgement is received. Source codes will be uploaded to Fanstel website when

supporting Bluetooth 5.

iOS Apps

The following iOS apps can be downloaded from Apple APP Store.

BlueNor Mesh: to use with BlueNor mesh firmware to send command to any node in a mesh. Node number is

displayed when acknowledgement is received.

BlueNor nrf5x firmware, apps, and source codes will be uploaded when ready.

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EV-BC40C EvaluationBoard Schematics

Evaluation board schematics and Gerber files can be downloaded from

http://www.fanstel.com/download-document/

Evaluation board can be used as a reference design for using modules. EV-BC40C is designed for the BC40C

soldering pads with 64 pins. This EV board can also be used for BC40M and BC40P modules. An external

antenna required but not included in EV-BC40P.

Suggestion for Battery Power Application

Standby current consumption is important for battery-powered product. To reduce host board area, the

followings are embedded in modules:

• 32 MHz, 20PPM main crystal and load capacitors.

• 32.768 KHz, 20PPM sleep crystal and load capacitors.

• Inductors and capacitors required for VDD power supply DC to DC converter.

• Inductors and capacitors required for VDDH power supply DC to DC converter.

The external sleep crystal shall be used to have a precise sleep clock frequency. DCDC converter shall be

enabled to reduce power consumption.

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5. Miscellaneous

Soldering Temperature-Time Profile for Re-Flow Soldering

Maximum number of cycles for re-flow is 2. No opposite side re-flow is allowed due to module weight.

Cautions, Design Notes, and Installation Notes

Failure to follow the guidelines set forth in this document may result in degrading of the product’s

functions and damage to the product.

Design Notes 

(1) Follow the conditions written in this specification, especially the control signals of this module.

(2) The supply voltage has to be free of AC ripple voltage (for example from a battery or a low noise

regulator output). For noisy supply voltages, provide a decoupling circuit (for example a ferrite in

series connection and a bypass capacitor to ground of at least 47uF directly at the module).

(3) This product should not be mechanically stressed when installed.

(4) Keep this product away from heat. Heat is the major cause of decreasing the life of these

products.

spikes.

(5) Avoid assembly and use of the target equipment in conditions where the products' temperature

may exceed the maximum tolerance.

(6) The supply voltage should not be exceedingly high or reversed. It should not carry noise and/or

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(7) this product away from other high frequency circuits.

Notes on Antenna and PCB Layout 

(1) Don’t use a module with internal antenna inside a metal case.

(2) For PCB layout:

• Avoid running any signal line below module whenever possible,

• No ground plane below antenna,

•

If possible, cut-off the portion of main board PCB below antenna.

Installation Notes

(1) Reflow soldering is possible twice based on the time-temperature profile in this data sheets. Set up

the temperature at the soldering portion of this product according to this reflow profile.

(2) Carefully position the products so that their heat will not burn into printed circuit boards or affect

the other components that are susceptible to heat.

(3) Carefully locate these products so that their temperatures will not increase due to the effects of

heat generated by neighboring components.

(4) If a vinyl-covered wire comes into contact with the products, then the cover will melt and generate

toxic gas, damaging the insulation. Never allow contact between the cover and these products to

occur.

(5) This product should not be mechanically stressed or vibrated when reflowed.

(6) If you want to repair your board by hand soldering, please keep the conditions of this chapter.

(7) Do not wash this product.

(8) Refer to the recommended pattern when designing a board.

(9) Pressing on parts of the metal cover or fastening objects to the metal will cause damage to the

unit.

Usage Condition Notes  

(1)Take measures to protect the unit against static electricity. If pulses or other transient loads (a

large load applied in a short time) are applied to the products, check and evaluate their operation

before assembly on the final products.

(2)Do not use dropped products.

(3)Do not touch, damage or soil the pins.

(4) Follow the recommended condition ratings about the power supply applied to this product.

(5)Electrode peeling strength: Do not add pressure of more than 4.9N when soldered on PCB

(6) Pressing on parts of the metal cover or fastening objects to the metal cover will cause damage.

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(7) These products are intended for general purpose and standard use in general electronic

equipment, such as home appliances, office equipment, information and communication

equipment.

Storage Notes 

(1)The module should not be stressed mechanically during storage.

(2)Do not store these products in the following conditions or the performance characteristics of the

product, such as RF performance will be adversely affected:

• Storage in salty air or in an environment with a high concentration of corrosive gas.

• Storage in direct sunlight

• Storage in an environment where the temperature may be outside the range specified.

• Storage of the products for more than one year after the date of delivery storage period.

(3) Keep this product away from water, poisonous gas and corrosive gas.

(4) This product should not be stressed or shocked when transported.

(5) Follow the specification when stacking packed crates (max. 10).

Safety Conditions  

These specifications are intended to preserve the quality assurance of products and individual

components. Before use, check and evaluate the operation when mounted on your products. Abide by

these specifications, without deviation when using the products. These products may short-circuit. If

electrical shocks, smoke, fire, and/or accidents involving human life are anticipated when a short

circuit occurs, then provide the following failsafe functions, as a minimum.

(1)Ensure the safety of the whole system by installing a protection circuit and a protection device.

(2)Ensure the safety of the whole system by installing a redundant circuit or another system to

prevent a dual fault causing an unsafe status.

Other Cautions  

(1)This specification sheet is copyrighted. Reproduction of this data sheets is permissible only if

reproduction is without alteration and is accompanied by all associated warranties, conditions,

limitations, and notices.

(2)Do not use the products for other purposes than those listed.

(3)Be sure to provide an appropriate failsafe function on your product to prevent an additional damage

that may be caused by the abnormal function or the failure of the product.

(4)This product has been manufactured without any ozone chemical controlled under the Montreal

Protocol.

(5)These products are not intended for other uses, other than under the special conditions shown

below. Before using these products under such special conditions, check their performance and

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reliability under the said special conditions carefully to determine whether or not they can be used

in such a manner.

In liquid, such as water, salt water, oil, alkali, or organic solvent, or in places where liquid may

splash.

•

•

•

•

In direct sunlight, outdoors, or in a dusty environment

In an environment where condensation occurs.

In an environment with a high concentration of harmful gas.

(6) If an abnormal voltage is applied due to a problem occurring in other components or circuits,

replace these products with new products because they may not be able to provide normal

performance even if their electronic characteristics and appearances appear satisfactory.

(7) When you have any question or uncertainty, contact Fanstel.

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Packaging and Lot Number

Production modules are delivered in reel, 1000 modules in each reel. Lot number for modules made

after May 2019, can be used to track silicon version of SoC, module PCB version, and production test

code version.

FCC LABEL

The Original Equipment Manufacturer (OEM) must ensure that the OEM modular transmitter must be labeled

with its own FCC ID number. This includes a clearly visible label on the outside of the final product enclosure

that displays the contents shown below. If the FCC ID is not visible when the equipment is installed inside

another device, then the outside of the device into which the equipment is installed must also display a label

referring to the enclosed equipment

The end product with this module may subject to perform FCC part 15 unintentional emission test requirement

and be properly authorized.

This device is intended for OEM integrator only.

26

BLE 5.1, Modules, BC40C, BC40M, BC40P

Ver 0.90 May 2021

ÉTIQUETTE CI

Le fabricant d'équipement d'origine (OEM) doit s'assurer que le transmetteur modulaire OEM doit être étiqueté

avec son propre numéro IC. Cela comprend une étiquette clairement visible à l'extérieur de l'enceinte du produit

final qui affiche le contenu indiqué ci-dessous. Si le CI n'est pas visible lorsque l'équipement est installé à

l'intérieur d'un autre appareil, l'extérieur de l'appareil dans lequel l'équipement est installé doit également

afficher une étiquette faisant référence à l'équipement fourni. Le produit final avec ce module peut être soumis à

l'exigence de test d'émission non intentionnelle ISDE et être dûment autorisé. Cet appareil est destiné

uniquement aux intégrateurs OEM.

Revision History

• April 2021, Ver. 0.80: Initial draft release

• May 2021, Ver. 0.90: Draft

27

BLE 5.1, Modules, BC40C, BC40M, BC40P

Ver 0.90 May 2021

Contact Us

United States:

Fanstel Corp.

7466 E. Monte Ctisto Ave. Scottsdale AZ 85260

Tel. 1 480-948-4928

Fax. 1-480-948-5459

Email: module@fanstel.com

Website: www.fanstel.com

Taiwan:

Fanstel Corp.

10F-10, 79 Xintai Wu Road

Xizhu, New Taipei City, Taiwan 22101

泛世公司

臺灣省新北市汐止區新臺五路 79 號 10 樓之 10, 22101

Tel. 886-2-2698-9328

Fax. 886-2-2698-4813

Email: tp@fanstel.com

Website: www.fanstel.com

China:

Fanstel Technologies Corp.

11 Jiale Street

Ping-Dih, Long-Gang, Shen Zhen, GD 518117

泛世康科技(深圳)有限公司

廣東省深圳市龍崗區坪地鎮佳樂街 11 號

Tel. 86-755-8409-0928

Fax. 86-755-8409-0973

QQ. 3076221086

Email: sz@fanstel.com

Website: www.fanstel.com

Federal Communications Commission (FCC) Statement

28

BLE 5.1, Modules, BC40C, BC40M, BC40P

Ver 0.90 May 2021

You are cautioned that changes or modifications not expressly approved by the part responsible for

compliance could void the user’s authority to operate the equipment.

This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to

part 15 of the FCC rules. These limits are designed to provide reasonable protection against harmful

interference in a residential installation. This equipment generates, uses and can radiate radio frequency

energy and, if not installed and used in accordance with the instructions, may cause harmful interference to

radio communications. However, there is no guarantee that interference will not occur in a particular

installation. If this equipment does cause harmful interference to radio or television reception, which can be

determined by turning the equipment off and on, the user is encouraged to try to correct the interference by

one or more of the following measures:

-Reorient or relocate the receiving antenna.

-Increase the separation between the equipment and receiver.

(1)-Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.

-Consult the dealer or an experienced radio/TV technician for help.

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:

1) this device may not cause harmful interference, and

2) this device must accept any interference received, including interference that may cause undesired

operation of the device.

FCC RF Radiation Exposure Statement:

This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. End

users must follow the specific operating instructions for satisfying RF exposure compliance. This transmitter

must not be co-located or operating in conjunction with any other antenna or transmitter.

29

BLE 5.1, Modules, BC40C, BC40M, BC40P

Ver 0.90 May 2021

Industry Canada (IC) Statement

This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to the

following two conditions: (1) this device may not cause interference, and (2) this device must accept any

interference, including interference that may cause undesired operation of the device.

Canada, avis d’Industry Canada (IC)

Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de

licence. L'exploitation est autorisée aux deux conditions suivantes:

(1) l'appareil ne doit pas produire de brouillage, et

(2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le

brouillage est susceptible d'en compromettre le fonctionnement.

Note: The end product shall has the words “Contains Transmitter Module FCC ID: X8WBC40，contient IC: 

4100A‐BC40” 

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BLE 5.1, Modules, BC40C, BC40M, BC40P

Ver 0.90 May 2021

Information for the OEM and Integrators

The following statement must be included with all versions of this document supplied to an OEM or integrator,

but should not be distributed to the end user.

(1) This device is intended for OEM integrators only.

(2) Please see the full Grant of Equipment document for other restrictions.

BC40C: Chip Antenna, 1 dBi BC40M: PCB trace Antenna, 1.53 dBi; BC40P: Pads for external Antenna, 0.54dBi

Must use the device only in host devices that meet the FCC/ISED RF exposure category of mobile, which means 

the device is installed and used at distances of at least 20cm from persons.  

The end user manual shall include FCC Part 15 /ISED RSS GEN compliance statements related to the transmitter 

as show in this manual.  

Host manufacturer is responsible for compliance of the host system with module installed with all other 

applicable requirements for the system such as Part 15 B, ICES 003.  

Host manufacturer is strongly recommended to confirm compliance with FCC/ISED requirements for the 

transmitter when the module is installed in the host.  

Must have on the host device a label showing Contains FCC ID: X8WBC40，contient IC: 4100A‐BC40  

The use condition limitations extend to professional users, then instructions must state that this information 

also extends to the host manufacturer’s instruction manual.  

 

This module is stand‐alone modular. If the end product will involve the Multiple simultaneously transmitting 

condition or different operational conditions for a stand‐alone modular transmitter in a host, host 

manufacturer have to consult with module manufacturer for the installation method in end system.  

 

l'hôte doit utiliser l'instrument uniquement dans des dispositifs qui répondent à la fcc / (catégorie d'exposition 

rf mobile, ce qui signifie le dispositif est installé et utilisé à une distance d'au moins 20 cm de personnes.  

le manuel de l'utilisateur final doit inclure la partie 15 / (fac rss gen déclarations de conformité relatives à 

l'émetteur que de montrer dans ce manuel.  

le fabricant est responsable de la conformité de l'hôte, le système d'accueil avec le module installé avec toutes 

les autres exigences applicables du système comme la partie 15 b, ices ‐ 003.  

accueillir le fabricant est fortement recommandé de confirmer la conformité avec les exigences de la fcc / 

(émetteur lorsque le module est installé dans l'hôte. le dispositif d'accueil doivent avoir une étiquette 

indiquant contient FCC ID: X8WBC40，contient IC: 4100A‐BC40

The installation to host depends on the platform of the usage, and may requires further evaluation related to 

RF exposure. 

31



 

 

 

 

 

 

 

 

 

 

 

 

 

 

FCC, Request for non-disclosure

RF_501, Issue 8

Date: 21-Nov-2018

Page 1 of 1

Company Name: Fanstel Corporation, Taipei

Address:

City:

Country:

10F-10, No. 79, Sec. 1, Hsin Tai Wu Rd., Hsi-Chih,

New Taipei City 221

Taiwan

Edisonstraat 12A

6902 PK ZEVENAAR

The Netherlands

To: Telefication B.V., Dept. FCC TCB

Subject: Request for confidentiality FCC ID: X8WBT40F

Reference number: ######

Dear FCC TCB,

1. Long-Term Confidentiality

Pursuant to 47 CFR Section 0.459(a) & (b), we hereby requests non-disclosure and confidential treatment

of the following materials submitted in support of FCC certification application:

Bill(s) of Material

Block Diagrams

Operational Description

Schematic Diagrams

Tune-up Procedure

Above materials contain secrets, proprietary and technical information, which would customarily be

guarded from competitors under 47 CFR, section 0.457(d)(2). Disclosure or publication or any portion of

this company confidential material to other parties could cause substantial competitive harm and provide

unjustified benefits for competitors.

2. Short-Term Confidentiality (STC)

Justification:

Pursuant to Public Notice DA 04-1705 of the Commission’s policy, in order to comply with the marketing

regulations in 47 CFR §2.803 and the importation rules in 47 CFR §2.1204, applicant hereby requests

Short-Term Confidential treatment of the following materials (See notes below):

Internal Photos

User’s Manual

Test Set-up Photos

External Photos

Name and signature of applicant: Paudy Tung

Date: 2021/04/20

Notes:

1) A document or type of document can only have ONE type of confidentiality!

2) Short-Term confidentiality is in principle for 45 days from date of grant; it can be extended max 3 times (total time 180 days max.)!

The planned date should stated in the RF731 application form.

3) FCC must be informed when marketing begins earlier.

4) Release takes place automatically thus extension must be requested in time. Telefication does not remind you of this!

5) Request for extension or for release must be received by Telefication at least 7 days before date of actual marketing or before

expiration of the STC period

FCC, Request for non-disclosure

RF_501, Issue 8

Date: 21-Nov-2018

Page 1 of 1



 

 

RF_160, Issue 04

International Standards Laboratory Corp.

No. 120, Lane 180, Hsin Ho Rd., Lung-Tan Dist.,

Tao Yuan City 325

Taiwan.

Fanstel Corporation, Taipei

10F-10, No. 79, Sec. 1, Hsin Tai Wu Rd., Hsi-Chih,

New Taipei City 221

Taiwan

Declaration of Authorization

We

Name:

Address:

City:

Country:

Declare that:

Name Representative of agent: …………. (1)

Agent Company name:

Address:

City:

Country

is authorized to apply for Certification of the following product(s):

Product description: Bluetooth 5.1 Module

Type designation: BC40C; BC40M; BC40P

Trademark:

Validity/ expiry date

on our behalf.

Date:

City:

Name:

Function:

Signature:

New Taipei City

Paudy Tung

2021/07/26

Engineer

Fanstel

Notes:

(1): Required for FCC application

(2): For FCC it must be the Grantee Code “owner” or the authorized agent.



 

 

RF_734_02

04 April 16

Modular Approval Request FCC (KDB 996369 D01 & Part 15.212)

FCC ID: X8WBC40

Items to be covered by Single modular transmitters.

1. The modular transmitter must have its own RF shielding.

2. The modular transmitter must have buffered modulation/data inputs (if such inputs

are provided) to ensure that the module will comply with Part 15 requirements

under conditions of excessive data rates or over-modulation.

3. The modular transmitter must have its own power supply regulation.

4. The modular transmitter must comply with the antenna requirements of Section

15.203 and 15.204(b)(c). The antenna must either be permanently attached or

employ a “unique” antenna coupler (at all connections between the module and the

antenna, including the cable).

5. The modular transmitter must be tested in a stand-alone configuration, i.e., the

module must not be inside another device during testing. This is intended to

demonstrate that the module is capable of complying with Part 15 emission limits

regardless of the device into which it is eventually installed.

8.

there are very strict operational and

7. The modular transmitter must comply with any specific rule or operating

requirements applicable to the transmitter and the manufacturer must provide

adequate instructions along with the module to explain any such requirements. A

copy of these instructions must be included in the application for equipment

authorization. For example,

timing

requirements that must be met before a transmitter is authorized for operation under

Section 15.231. For instance, data transmission is prohibited, except for operation

under Section 15.231(e), in which case there are separate field strength level and

timing requirements. Compliance with these requirements must be assured.

The modular transmitter must comply with any applicable RF exposure

requirements. For example, FCC Rules in Sections 1.1310, 2.1091, 2.1093, and

specific Sections of Part 15, including 15.319(i), 15.407(f), 15.253(f) and

15.255(g), require that Unlicensed PCS, UNII and millimeter wave devices

perform routine environmental evaluation for RF Exposure to demonstrate

compliance. In addition, spread spectrum transmitters operating under Section

15.247 are required to address RF Exposure compliance. Modular transmitters

approved under other Sections of Part 15, when necessary, may also need to

address certain RF Exposure concerns, typically by providing specific

installation and operating instructions for users, installers and other interested

parties to ensure compliance.

Answer from applicant

Yes. The modular transmitter

has its own RF shielding.

Yes. The module has buffered

modulation/data inputs to

ensure that the device will

comply with Part 15

requirements with any type of

input signal.

Yes. The module contains

power supply regulation.

There are LDO and DCDC

Regulator in chip nRF5340-

QKAA. Please refer to chip

spec.

Yes. The module contains a

unique antenna connector, per

Sections 15.203, 5.204(c)

Yes. The demonstrates

compliance in a stand-alone

configuration

Yes. The module complies

with all specific rules

applicable to the transmitter

including all the conditions

provided in the integration

instructions by the grantee.

Yes. The module complies

with RF exposure

requirements.

6. The modular transmitter must be equipped with either a permanently affixed label

or must be capable of electronically displaying its FCC identification number in

accordance with 15.212 (a)(1)(vi)(A) / (B).

Yes. The module is labelled

with its permanently affixed

FCC ID label.



RF_734_02

04 April 16

Answer from applicant

Items to be covered by Split modular transmitters.

1. The modular transmitter must comply with all requirements of a single modular

transmitter except for items (1) & (5) of the above single modular approval

requirements.

2. Only the radio front end must be shielded. The physical crystal and tuning

capacitors may be located external to the shielded radio elements. The interface

between the split sections of the modular system must be digital with a minimum

signalling amplitude of 150 mV peak-to-peak.

3. Control information and other data may be exchanged between the transmitter

control elements and radio front end.

4. The sections of a split modular transmitter must be tested installed in a host

device(s) similar to that which is representative of the platform(s) intended for use.

5. Manufacturers must ensure that only transmitter control elements and radio front

end components that have been approved together are capable of operating together.

The transmitter module must not operate unless it has verified that the installed

transmitter control elements and radio front end have been authorized together.

Manufacturers may use means including, but not limited to, coding in hardware and

electronic signatures in software to meet these requirements, and must describe the

methods in their application for equipment authorization.

Note: A limited modular approval (LMA) may be granted for single or split modular transmitters

that comply partially with the requirements above.

Name and surname of applicant (or authorized representative): Paudy Tung / Engineer

Date: 2021/07/26

Signature: