FCC ID: ZMOL860GL16 LTE Module

 

FIBOCOM L860-GL-16 Hardware Guide Version: 1.0.0 Date: 2020-09-28 Fibocom Confidential Applicability Type No. 1 Product Model Description L860-GL-16 NA Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. FIBOCOM L860-GL Series Hardware Guide Page 2 of 60 Fibocom Confidential Copyright Copyright 2019 Fibocom Wireless Inc. All rights reserved. Without the prior written permission of the copyright holder, any company or individual is prohibited to excerpt, copy any part of or the entire document, or distribute the document in any form. Notice The document is subject to update from time to time owing to the product version upgrade or other reasons. Unless otherwise specified, the document only serves as the user guide. All the statements, information and suggestions contained in the document do not constitute any explicit or implicit guarantee. Trademark The trademark is registered and owned by Fibocom Wireless Inc. FCC Conformance information Important Notice to OEM integrators 1. This module is limited to OEM installation ONLY. 2. This module is limited to installation in mobile applications, according to Part 2.1091(b). 3. The separate approval is required for all other operating configurations, including portable configurations with respect to Part 2.1093 and different antenna configurations 4. For FCC Part 15.31 (h) and (k): The host manufacturer is responsible for additional testing to verify compliance as a composite system. When testing the host device for compliance with Part 15 Subpart B, the host manufacturer is required to show compliance with Part 15 Subpart B while the transmitter module(s) are installed and operating. The modules should be transmitting and the evaluation should confirm that the module's intentional emissions are compliant (i.e. fundamental and out of band emissions). The host manufacturer must verify that there are no additional unintentional emissions other than what is permitted in Part 15 Subpart B or emissions are complaint with the transmitter(s) rule(s). The Grantee will provide guidance to the host manufacturer for Part 15 B requirements if needed. Important Note notice that any deviation(s) from the defined parameters of the antenna trace, as described by the instructions, require that the host product manufacturer must notify to Fibocom Wireless Inc.XXXX that they wish to change the antenna trace design. In this case, a Class II permissive change application is required to be filed by the USI, or the host manufacturer can take responsibility through the change in FCC ID (new application) procedure followed by a Class II permissive change application. Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. FIBOCOM L860-GL Series Hardware Guide Page 3 of 60 Fibocom Confidential End Product Labeling When the module is installed in the host device, the FCC/IC ID label must be visible through a window on the final device or it must be visible when an access panel, door or cover is easily re-moved. If not, a second label must be placed on the outside of the final device that contains the following text: Contains FCC ID: ZMOL860GL16 Contains IC: 21374-L860GL16 The FCC ID/IC ID can be used only when all FCC/IC compliance requirements are met. Antenna Installation

(1) The antenna must be installed such that 20 cm is maintained between the antenna and users,

(2) The transmitter module may not be co-located with any other transmitter or antenna.

(3) Only antennas of the same type and with equal or less gains as shown below may be used with this module. Other types of antennas and/or higher gain antennas may require additional authorization for operation. Antenna type PIFA Bands Peak Gain WCDMA B2 WCDMA B4 WCDMA B5 LTE B2 LTE B4 LTE B5 LTE B7 LTE B12 LTE B13 LTE B14 4 3 3 4 3 3 4 3 3 3 Antenna type PIFA Bands LTE B17 LTE B25 LTE B26 LTE B30 LTE B38 LTE B41 LTE B48 LTE B66 LTE B71 Peak Gain 3 4 3 1 4 4 1 3 3 In the event that these conditions cannot be met (for example certain laptop configurations or co-location with another transmitter), then the FCC/IC authorization is no longer considered valid and the FCC ID/IC ID cannot be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC/IC authorization. Manual Information to the End User Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. FIBOCOM L860-GL Series Hardware Guide Page 4 of 60 Fibocom Confidential The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the users manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual. Federal Communication Commission Interference Statement This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:

(1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one of the following measures:

- Reorient or relocate the receiving antenna.

- Increase the separation between the equipment and receiver.

- Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.

- Consult the dealer or an experienced radio/TV technician for help. Any changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate this equipment. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. List of applicable FCC rules This module has been tested and found to comply with part 22, part 24, part 27, part 90, 15.247 and 15.407 part 15B requirements for Modular Approval. The modular transmitter is only FCC authorized for the specific rule parts (i.e., FCC transmitter rules) listed on the grant, and that the host product manufacturer is responsible for compliance to any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. If the grantee markets their product as being Part 15 Subpart B compliant (when it also contains unintentional-radiator digital circuity), then the grantee shall provide a notice stating that the final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed. This device is intended only for OEM integrators under the following conditions: (For Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. FIBOCOM L860-GL Series Hardware Guide Page 5 of 60 Fibocom Confidential module device use) 1) The antenna must be installed such that 20 cm is maintained between the antenna and users, and 2) The transmitter module may not be co-located with any other transmitter or antenna. As long as 2 conditions above are met, further transmitter test will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed. Radiation Exposure Statement This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20 cm between the radiator &

your body. Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. FIBOCOM L860-GL Series Hardware Guide Page 6 of 60 Fibocom Confidential Change History Version Author Date Remark V1.0.0 Shu Ying 2020-09-28 Draft version Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. FIBOCOM L860-GL Series Hardware Guide Page 7 of 60 Fibocom Confidential Contents 1 Foreword ......................................................................................................................10 1.1 1.2 1.3 Introduction ................................................................................................................. 10 Reference Standard ................................................................................................... 10 Related Documents .................................................................................................... 10 2 Overview ...................................................................................................................... 11 2.1 2.2 2.3 2.4 2.5 2.6 Introduction ................................................................................................................. 11 Specification ............................................................................................................... 11 CA Combinations ........................................................................................................ 13 Application Framework ............................................................................................... 15 Hardware Block Diagram ............................................................................................ 15 Antenna Configuration ................................................................................................ 16 3 Application Interface ...................................................................................................17 3.1 M.2 Interface .............................................................................................................. 17 Pin Map ......................................................................................................................... 17 Pin Definition ................................................................................................................. 18 3.2 Power ......................................................................................................................... 22 Power Supply ................................................................................................................ 23 Logic Level .................................................................................................................... 24 Power Consumption ...................................................................................................... 25 3.3 Control Signal ............................................................................................................. 26 Module Start-Up ............................................................................................................ 27 3.3.1.1 Start-up Circuit ........................................................................................................................... 27 3.3.1.2 Start-up Timing Sequence ......................................................................................................... 27 Module Shutdown ......................................................................................................... 28 Module Reset ................................................................................................................ 29 PCIe Link State ............................................................................................................. 31 3.3.4.1 D0 L1.2 ...................................................................................................................................... 32 3.3.4.2 D3cold L2..................................................................................................................................... 32 Timing Application ......................................................................................................... 34 3.4 PCIe Interface ............................................................................................................ 34 PCIe Interface Definition ............................................................................................... 35 PCIe Interface Application ............................................................................................. 36 3.5 USIM Interface............................................................................................................ 37 USIM1 Pins ................................................................................................................... 38 USIM Interface Circuit ................................................................................................... 38 3.5.2.1 N.C. SIM Card Slot .................................................................................................................... 38 Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. FIBOCOM L860-GL Series Hardware Guide Page 8 of 60 Fibocom Confidential 3.5.2.2 N.O. SIM Card Slot .................................................................................................................... 39 USIM Hot-Plug .............................................................................................................. 39 USIM Design ................................................................................................................. 40 3.6 Status Indicator........................................................................................................... 40 LED#1 Signal ................................................................................................................ 40 WOWWAN# .................................................................................................................. 41 3.7 Interrupt Control .......................................................................................................... 42 W_DISABLE1# .............................................................................................................. 42 BODYSAR ..................................................................................................................... 42 ANT_CONFIG ............................................................................................................... 43 3.8 3.9 ANT Tunable Interface ................................................................................................ 43 Configuration Interface ............................................................................................... 44 3.10 I2C Interface ............................................................................................................... 44 I2C Pins ......................................................................................................................... 44 4 Radio Frequency .........................................................................................................45 4.1 RF Interface ................................................................................................................ 45 RF Interface Functionality ............................................................................................. 45 RF Connector Characteristic ......................................................................................... 45 RF Connector Dimension .............................................................................................. 45 RF Connector Assembly ............................................................................................... 47 4.2 4.3 4.4 4.5 4.6 Operating Band .......................................................................................................... 48 Transmitting Power ..................................................................................................... 49 Receiver Sensitivity .................................................................................................... 50 Dual Antennas Receiver Sensitivity .............................................................................. 50 Four Antennas Receiver Sensitivity .............................................................................. 51 GNSS ......................................................................................................................... 52 Antenna Design .......................................................................................................... 52 5 ESD Characteristics ....................................................................................................54 6 Structure Specification ...............................................................................................55 6.1 6.2 6.3 6.4 6.5 6.6 Product Appearance ................................................................................................... 55 Dimension of Structure ............................................................................................... 55 M.2 Interface Model .................................................................................................... 56 M.2 Connector ............................................................................................................ 57 Storage ....................................................................................................................... 58 Packing ...................................................................................................................... 58 Tray Package ................................................................................................................ 58 Tray Size ....................................................................................................................... 60 Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. FIBOCOM L860-GL Series Hardware Guide Page 9 of 60 Fibocom Confidential 1 Foreword 1.1 Introduction The document describes the electrical characteristics, RF performance, dimensions and application environment, etc. of L860-GL-GL (hereinafter referred to as L860). With the assistance of the document and other instructions, the developers can quickly understand the hardware functions of L860 modules and develop products. 1.2 Reference Standard The design of the product complies with the following standards:

3GPP TS 34.121-1 V8.11.0: User Equipment (UE) conformance specification; Radio transmission and reception (FDD); Part 1: Conformance specification 3GPP TS 34.122 V11.13.0: Technical Specification Group Radio Access Network; Radio transmission and reception (TDD) 3GPP TS 36.521-1 V13.4.0: User Equipment (UE) conformance specification; Radio transmission and reception; Part 1: Conformance testing 3GPP TS 21.111 V10.0.0: USIM and IC card requirements 3GPP TS 51.011 V4.15.0: Specification of the Subscriber Identity Module -Mobile Equipment (SIM-

ME) interface 3GPP TS 31.102 V10.11.0: Characteristics of the Universal Subscriber Identity Module (USIM) application 3GPP TS 31.11 V10.16.0: Universal Subscriber Identity Module (USIM) Application Toolkit (USAT) 3GPP TS 36.124 V10.3.0: Electro Magnetic Compatibility (EMC) requirements for mobile terminals and ancillary equipment 3GPP TS 27.007 V10.0.8: AT command set for User Equipment (UE) 3GPP TS 27.005 V10.0.1: Use of Data Terminal Equipment - Data Circuit terminating Equipment

(DTE-DCE) interface for Short Message Service (SMS) and Cell Broadcast Service (CBS) PCI Express M.2 Specification Rev1.2 1.3 Related Documents FIBOCOM Design Guide_RF Antenna FIBOCOM L860 Series AT Commands_V3.4.1 Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. FIBOCOM L860-GL Series Hardware Guide Page 10 of 60 Fibocom Confidential 2 Overview 2.1 Introduction L860 is a highly integrated 4G WWAN module which uses M.2 form factor interface. It supports LTE FDD/LTE TDD/WCDMA systems and can be applied to most cellular networks of mobile carrier in the world. 2.2 Specification Specification LTE FDD: Band 2, 4, 5, 7, 12, 13, 14, 17, 25, 26, 29, 30, 66, 71 LTE TDD: Band 38, 41(HPUE), 48 Operating Band LAA Band 46 Receiver only 4x4MIMO support: Band 2, 4, 7, 25, 30, 38, 41, 48, 66 WCDMA/HSPA+: Band 2, 4, 5 Support GPS, BDS, GLONASS, Galileo 3GPP Release 13 3GPP Release 12 GNSS LTE UMTS Data Transmission LTE FDD LTE FDD: 1Gbps DL (Cat 16)/50Mbps UL (Cat 13) LTE TDD LTE TDD: 756Mbps DL (Cat 16)/90Mbps UL (Cat 13) UMTS:384 kbps DL/384 kbps UL UMTS/HSPA+

DC-HSPA+:42 Mbps DL (Cat 24)/5.76 Mbps UL (Cat6) Carrier Aggregation 5CA Downlink /2*ULCA (Intra band) UL 64QAM Support Power Supply DC 3.135V-4.4V, Typical 3.3V Normal operating temperature: -10C-+55C Temperature Extended operating temperature: -20C-+65C Storage temperature: -40C-+85C Interface: M.2 Key-B Dimension30422.3mm Weight: About 6.2 g Physical Characteristics Interface Antenna Connector WWAN Antenna4 Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. FIBOCOM L860-GL Series Hardware Guide Page 11 of 60 Fibocom Confidential Specification Support 44 MIMO Dual SIM, 1.8V/3V PCIe 2.01 USB 2.0 (For debug) USB 3.0 (For debug) Function Interface W_Disable#

BodySAR LED Tunable antenna UART Software Protocol Stack IPV4/IPV6 AT Commands 3GPP TS 27.007 and 27.005 Firmware Update PCIe Multiple carrier Other Feature Windows MBIM support Windows update OS Windows10/Linux/Android Note:

B42 disabled as of FCC certification, support pending regulatory approval. When temperature goes beyond normal operating temperature range of -10C-+55C, RF performance of module may be slightly off 3GPP specifications. Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. FIBOCOM L860-GL Series Hardware Guide Page 12 of 60

2.3 CA Combinations UL CA Combination 2CA Intra-band DL CA Combination Inter-band 2CA Intra-band (non-contiguous) Intra-band (contiguous) Inter-band 3CA 2 intra-band (non-contiguous) plus inter-band 2 intra-band (contiguous) plus inter-band Intra-band (non-contiguous) Intra-band (contiguous) Inter-band 2 intra-band (non-contiguous) plus 2 inter-band 4CA 2 intra-band (contiguous) plus 2 inter-band 5B,7C,38C,41C,66B,66C 2+4, 5, 12, 13, 14, 29, 30, 46,48, 66,71 4+5, 12, 13, 29, 30, 46,48,71 5+7, 30, 46, 66,48 12+30, 66 13+46, 66,48 14+30, 66 25+26, 41, 46 26+41 29+30, 66 30+66 41+46 46+66 48+66 2, 4, 7, 25, 41,48, 66 2, 5, 7, 38, 41, 48, 66 2+4+5, 2+4+12, 2+4+13,2+4+71, 2+5+30 ,2+5+48, 2+12+30, 2+29+30, 2+5+66, 2+13+66, 2+14+30, 2+14+66, 2+30+66, 2+5+46, 2+13+46, 2+46+66, 2+12+66,2+13+48,2+66+71 4+5+30, 4+12+30, 4+29+30 5+30+66, 5+46+66,5+48+66 12+30+66, 13+46+66, 13+48+66,14+30+66, 29+30+66 2+2+5, 2+2+12, 2+2+13, 2+2+30, 2+2+66, 2+4+4, 2+46+46,2+66+66,2+2+4,2+2+14,2+2+71,2+2+46 4+4+5, 4+4+12, 4+4+13, 4+46+46, 5+66+66,4+4+7,5+5+66,5+48+48 12+66+66, 13+66+66, 46+46+66, 29+66+66, 30+66+66,13+48+48,14+66+66,46+66+66,48+48+66,66

+66+71 2+5+5, 2+46+46, 2+66+66 4+46+46, 5+5+30, 5+5+66, 5+46+46, 5+66+66, 4+5+5,5+48+48,5+66+66,5+5+46,7+7+46,7+46+46, 13+46+46, 13+66+66, 25+41+41, 26+41+41, 46+46+66,13+48+48,13+66+66, 48+66+66, 48+48+66,66+66+71 41, 66 41,48 2+5+30+66, 2+12+30+66, 2+14+30+66 2+2+5+66, 2+2+12+30, 2+2+12+66, 2+2+13+66, 2+5+66+66, 2+12+66+66, 2+13+66+66, 5+30+66+66, 29+30+66+66,1+1+3+7, 2+2+4+71,2+2+14+66,2+2+66+71,2+14+66+66,2+66+6 6+71, 2+5+5+30, 2+5+5+66, 2+5+46+46, 2+13+46+46, 2+46+46+46, 2+46+46+66, 2+5+66+66, 2+13+66+66, 2+66+66+71, Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. FIBOCOM L860-GL Series Hardware Guide Page 13 of 60 Fibocom Confidential DL CA Combination 2 intra-band (contiguous) plus 2 intra-band (contiguous) 2 intra-band (contiguous) plus 2 intra-band (non-contiguous) 3 intra-band (contiguous) plus inter-band 4+46+46+46, 5+5+30+66, 5+46+46+66, 13+46+46+66, 66+46+46+46, 13+48+66+66,13+48+48+66, 5+5+66+66,5+5+46+46,7+7+46+46,48+48+66+66, 5+5+66+66,2+2+46+46,46+46+66+66, 2+2+5+5,2+2+66+66,4+4+5+5,48+48+66+66, 2+46+46+46, 3+40+40+40, 4+46+46+46, 5+46+46+46, 13+46+46+46, 25+41+41+41, 66+46+46+46,7+46+46+46, Intra-band (non-contiguous) 41 Intra-band (contiguous) 2 intra-band (contiguous) plus 2 intra-band (contiguous) plus inter-band 2 intra-band (contiguous) plus 3 inter-band 2 intra-band (contiguous) plus 2 intra-band (non-contiguous) plus inter-band 48,41 2+46+46+46+46, 46+46+46+46+66,2+5+5+66+66,13+48+48+66+66,48+4 8+48+66+66 2+5+5+30+66 2+5+5+66+66 , 2+2+5+66+66, 2+2+13+66+66,13+48+48+66+66 3 intra-band (contiguous) plus 2 intra-band (non-contiguous) 2+2+46+46+46, 5CA 3 intra-band (contiguous) plus 2 inter-band 2+5+46+46+46, 2+13+46+46+46, 2+46+46+46+46, 2+46+46+46+66, 4+46+46+46+46, 5+46+46+46+66, 13+46+46+46+66, 46+46+46+46+66 3 intra-band (contiguous) plus 2 intra-band (contiguous) 46+46+46+66+66,5+5+46+46+46,7+7+46+46+46 4 intra-band (contiguous) plus inter-band 2+46+46+46+46, 5+46+46+46+46, 13+46+46+46+46, 46+46+46+46+66 Intra-band (contiguous) 41,48 Intra-band (non-contiguous) 41 Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. FIBOCOM L860-GL Series Hardware Guide Page 14 of 60 Fibocom Confidential 2.4 Application Framework The peripheral applications for L860 module are shown in Figure 2-1:

Figure 2-1 Application framework 2.5 Hardware Block Diagram The hardware block diagram in Figure 2-2 shows the main hardware functions of L860 module, including baseband and RF functions. Baseband contains the followings:

UMTS/LTE controller PMU NAND/internal LPDDR4 RAM Application interface RF contains the followings:

RF Transceiver RF Power/PA RF Front end RF Filter Antenna Connector Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. FIBOCOM L860-GL Series Hardware Guide Page 15 of 60 ModuleSIM1USB2.0Power SupplyON/OFF# RESET#ControlEINTIndicatorHost applicationD/G(AUX1) ANTMain ANTSIM CardPCIee-SIMM2(AUX3) ANTM1(AUX2) ANTFibocom Confidential Figure 2-2 Hardware block diagram 2.6 Antenna Configuration L860 module support four antennas and the configuration is as below table:

Antenna Connector Function Description Band Configuration M M1 M2 D/G Main ANT All supported bands transmit & receive MIMO1 ANT 44 MIMO supported bands receive MIMO2 ANT 44 MIMO supported bands receive Diversity & GNSS ANT All supported bands and GNSS receive Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. FIBOCOM L860-GL Series Hardware Guide Page 16 of 60 Baseband(LTE FDD/LTE TDD/UMTS controller)PMUM.2 Key-B 75pin interfaceRF TransceiverNANDTXMain RXDuplexerPA DCDCXB LNAUB PAMain MB FEMiDMain LB FEMiDRF SAWM (Main)ANTM1(AUX2) ANTM1(AUX3) ANTD/G(AUX1) ANTRF PartSAWGNSS SAWMain HB FEMiDTRX SAWXB LNACouplerTiplexerMB/HB FEM(44 MIMO)MB/HB FEM(44 MIMO)DivMB/HB/UB FEMDiv LB FEMGNSS LNARF SAWGNSS ExtractorTiplexerGNSS SAWDiv RX4th Div RX3rd Div RXSAWLPDDR4RAMDigRF RXTCXOVDD_IO_1V8GPIO+3.3VFULL_CARD_POWER_OFF#RESET#PCIeUSB2.0USB3.0USIM1EINTWOWWAN#LEDI2CMIPI_RFFEUART_TXUART_RXTunable ANTFibocom Confidential 3 Application Interface 3.1 M.2 Interface The L860 module applies standard M.2 Key-B interface, with a total of 75 pins. Pin Map Figure 3-1 Pin map Note:

Pin Notch represents the gap of the gold fingers. Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. FIBOCOM L860-GL Series Hardware Guide Page 17 of 60 747270686664626058565452504846444240108643836343230282624222NCI2C_IRQ#(1.8V)I2C_SDA(1.8V, I2C Slave/Master)I2C_SCL(1.8V, I2C Slave/Master)+3.3V+3.3V+3.3VANT_CONFIG(1.8V)SIM1_DETECT(1.8V)COEX_TXD(1.8V)COEX_RXD(1.8V)COEX3(1.8V)RFE_RFFE_SDATANotchLED1#(3.3V OD)W_DISABLE1#(3.3/1.8V)FULL_CARD_POWER_OFF#(3.3/1.8V)+3.3VPEWAKE# (3.3V)CLKREQ# (3.3V)PERST# (3.3V)NC20USB D+GNDGND+3.3VUIM1_RESETUART_RX(1.8V, mux for GPIO)W_DISABLE2#(3.3/1.8V)ANT_TUNER_1V8(1.8V, mux for GPIO)UART_TX(1.8V, mux for ANT_TUNER_CFG/GPIO)NotchUSB3.0-TxGNDDPR(3.3/1.8V)WOWWAN#(1.8V)CONFIG_0NotchNotchNotchUSB D-CONFIG_2VIO_CFGGNDCONFIG_1RESET#(1.8V)ANTCTL3(1.8V)ANTCTL2(1.8V)ANTCTL1(1.8V)ANTCTL0(1.8V)GNDREFCLKPREFCLKNGNDPERp0PERn0GNDPETp0PETn0GNDUSB3.0-Rx+USB3.0-RxGNDGNDCONFIG_375737169676563615957555351494745433411112123GPIO(1.8V)NotchNotchNotchUSB3.0-Tx+NCUIM1_PWRUIM1_DATAUIM1_CLKRFE_RFFE_SCLK9753937353331292725Fibocom Confidential Pin Definition The pin definition is as follows:

Pin Pin Name I/O Reset Value Pin Description Type 1 CONFIG_3 O NC the WWAN PCIe, USB3.0 interface NC, L860 M.2 module is configured as

+3.3V GND

+3.3V GND FULL_CARD_ POWER_OFF#

PI

PI

I

PU type Power input GND Power input GND Power enable, module power on input, internal pull up Power Supply Power Supply Power Supply Power Supply 3.3/1.8V USB D+

I/O USB data plus, only for debug 0.3---3V 2 3 4 5 6 7 8 W_DISABLE1#

I PD WWAN disable, active low 3.3/1.8V 9 USB D-

I/O USB data minus, only for debug 0.3---3V 3.3V Power Supply 10 LED1#

OD T System status LED, output open drain, CMOS 3.3V

11 GND 12 Notch 13 Notch 14 Notch 15 Notch 16 Notch 17 Notch 18 Notch 19 Notch GND Notch Notch Notch Notch Notch Notch Notch Notch 20 GPIO O PD GPIO(High-z) UART_RTS (Reserved) NC, L860 M.2 module is configured as 21 CONFIG_0 NC the WWAN PCIe, USB3.0 interface 22 UART_TX O PD type UART_TX, MUX for ANT_TUNER_CONFIG/GPIO(High-z) 1.8V 1.8V Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. FIBOCOM L860-GL Series Hardware Guide Page 18 of 60 Fibocom Confidential Pin Pin Name I/O Reset Value Pin Description 23 WOWWAN#

O PD 24 ANT_TUNER_1V8 25 DPR 26 W_DISABLE2#

27 GND 28 UART_RX PO IO I I

I PD PD PD

PD 29 USB3.0_TX-

O Wake up host, Reserved 1.8V output for ANT Tuner GPIO(High-z) UART_CTS (Reserved) Type 1.8V Power Supply

/1.8V BodySAR detect, active low 3.3/1.8V GNSS disable, active low, Reserved GND 3.3/1.8V Power Supply UART_RX, MUX for GPIO(High-z) 1.8V USB3.0 transmit data minus, only for debug 30 UIM_RESET O L SIM reset signal 1.8V/3V 31 USB3.0_TX+

32 UIM_CLK 33 GND O O

L

USB3.0 transmit data plus, only for debug SIM clock signal GND 1.8V/3V Power Supply 34 UIM_DATA I/O L SIM data input/output 1.8V/3V 35 USB3.0_RX-

36 UIM_PWR 37 USB3.0_RX+

38 NC 39 GND 40 I2C_SCL I O I

I 41 PETn0 O

PU USB3.0 receive data minus, only for debug SIM power supply, 1.8V/3V 1.8V/3V USB3.0 receive data plus, only for debug NC GND Power Supply Master I2C1 CLK 1.8V PCIe TX differential signal Negative 42 I2C_SDA I/O PU Master I2C1 DATA 1.8V 43 PETp0 O PCIe TX differential signal Positive 44 I2C_IRQ#

O PD I2C1 INT, Wake up I2C HOST 1.8V 45 GND

GND Power Supply Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. FIBOCOM L860-GL Series Hardware Guide Page 19 of 60 Fibocom Confidential Pin Pin Name I/O Reset Value Pin Description Type 46 NC 47 PERn0 48 NC 49 PERP0 I I NC PCIe RX differential signal Negative NC PCIe RX differential signal Positive Asserted to reset module PCIe interface default. If module went into 50 PERST#

I PU core dump, it will reset whole module, 3.3V not only PCIe interface. Active low, internal pull up (10K) 51 GND

GND Power Supply 52 CLKREQ#

O PU also used by L1 PM Sub states 3.3V Asserted by device to request a PCIe reference clock be available (active clock state) in order to transmit data. It 53 REFCLKN I mechanism, asserted by either host or device to initiate an L1 exit. Active low, internal pull up (10K) PCIe reference clock signal Negative Asserted to wake up system and reactivate PCIe link from L2 to L0, it depends on system whether supports 54 PEWAKE#

O L wake up functionality. 3.3V Active low, open drain output and should add external pull up (100K) on platform 55 REFCLKP I PCIe reference clock signal, Positive 56 RFFE_SCLK O PD 57 GND 58 RFFE_SDATA I/O PD MIPI interface tunable ANT, RFFE clock GND MIPI interface tunable ANT, RFFE data 1.8V Power Supply 1.8V Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. FIBOCOM L860-GL Series Hardware Guide Page 20 of 60 Fibocom Confidential Pin Pin Name I/O Reset Value Pin Description 59 ANTCTL0 O L Tunable ANT CTRL0 60 COEX3 I/O PD Wireless coexistence between WWAN and WIFI/BT modules, based on BT-SIG coexistence protocol. COEX_EXT_FTA, Reserved 61 ANTCTL1 O PD Tunable ANT CTRL1 62 COEX_RXD I T Wireless coexistence between WWAN and WIFI/BT modules, based on BT-SIG coexistence protocol. UART receive signal (WWAN module side), Reserved 63 ANTCTL2 O PD Tunable ANT CTRL2 64 COEX_TXD O T Wireless coexistence between WWAN and WIFI/BT modules, based on BT-SIG coexistence protocol. UART transmit signal (WWAN module side), Reserved 65 ANTCTL3 O PD Tunable ANT CTRL3 66 SIM1_DETECT 67 RESET#

I I PD PU SIM1 detect, internal pull up (390K), active high WWAN reset input, internal pull up

(10K), active low Host antenna configuration detect, Type 1.8V 1.8V 1.8V 1.8V 1.8V 1.8V 1.8V 1.8V 1.8V 68 ANT_CONFIG I PD internal pull up (100K), 1.8V 69 CONFIG_1 O GND as the WWAN PCIe, USB3.0

Reserved GND, L860 M.2 module is configured 70

+3.3V 71 GND 72

+3.3V PI

PI

73 VIO_CFG

interface type Power input GND Power input Power Supply Power Supply Power Supply Voltage indication of PCIe side band. GND, Support PCIe Interface 3.3V. NC, support 1.8V and compatible with

3.3V. 74

+3.3V PI

Power input Power Supply Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. FIBOCOM L860-GL Series Hardware Guide Page 21 of 60 Fibocom Confidential Pin Pin Name I/O Reset Value Pin Description Type 75 CONFIG_2 O NC the WWAN PCIe, USB3.0 interface

NC, L860 M.2 module is configured as Reset Value: The initial status after module reset, not the status when working. type H: High Voltage Level L: Low Voltage Level PD: Pull-Down PU: Pull-Up T: Tristate OD: Open Drain PI: Power Input PO: Power Output Note:

The unused pins can be left floating. 3.2 Power The power interface of L860 module is shown in the following table:

Pin Pin Name I/O Pin Description 2, 4, 70, 72, 74 +3.3V PI Power supply input DC Parameter (V) Minimum Typical Maximum Value 3.135 Value Value 3.3 4.4 36 48 UIM_PWR PO USIM power supply UIM2_PWR PO USIM power supply

1.8V/3V 1.8V/3V

L860 module uses PCIe interface. According to the PCIe specification, the PCIe Vmain should be used as the +3.3V power source, not the Vaux. The Vaux is the PCIe backup power source and it is not sufficient as the power supply. In addition, the DC/DC power supply other than PCIe ports should not be used as the external power cannot control the module status through the PCIe protocol. Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. FIBOCOM L860-GL Series Hardware Guide Page 22 of 60 Fibocom Confidential Power Supply The L860 module should be powered through the +3.3V pins, and the power supply design is shown in Figure 3-2:

Figure 3-2 Power supply design The filter capacitor design for power supply is shown in the following table:

Recommended Capacitance Application Description Reduce power fluctuations of the module in operation, requiring capacitors with low ESR. LDO or DC/DC power supply requires the capacitor of no less than 440uF The capacitor for battery power supply can be reduced to 100-200uF Filter out the interference generated from the clock and digital signals Filter out low frequency band RF interference 220uFx2 Voltage-stabilizing capacitors 1uF, 100nF Digital signal noise 700/800, 850/900 MHz frequency band 1500/1700/1800/1900, 39pF, 33pF 18pF, 10pF, 8.2pF, 6.8pF, 3.3pF 2100/2300, 2500/2600MHz, Filter out medium/high frequency band RF 3500/3700MHz, 5GHz frequency interference band Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. FIBOCOM L860-GL Series Hardware Guide Page 23 of 60 Fibocom Confidential The stable power supply can ensure the normal operation of L860 module. The ripple of the power supply should be less than 300mV in design. Because module support 5CA download. When module operates with the maximum data transfer throughput, the peak current can reach to upper 2500mA. It requests the power source voltage should not be lower than 3.135V, otherwise module may shut down or restart. The power supply requirement is shown in Figure 3-3:

Figure 3-3 Power supply requirement Logic Level The L860 module 1.8V logic level definition is shown in the following table:

Parameter Minimum Typical Maximum Unit 1.8V logic level VIH VIL 1.71 1.3

-0.3 1.8 1.8 0 1.89 1.89 0.3 V V V The L860 module 3.3V logic level definition is shown in the following table:

Parameter Minimum Typical Maximum Unit 3.3V logic level VIH VIL 3.135 2.3

-0.3 3.3 3.3 0 3.465 3.465 0.3 V V V Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. FIBOCOM L860-GL Series Hardware Guide Page 24 of 60 Burst transmitBurst transmitmin:3.135VPower supplyRipple300mVDrop VBAT3.135VFibocom Confidential Power Consumption In the condition of 3.3V power supply, the L860 power consumption is shown in the following table:

Parameter Mode Condition Typical Current (mA) Ioff Power off Power supply, module power off 0.02 DRX=6 WCDMA DRX=8 DRX=9 ISleep LTE FDD Paging cycle #128 frames (1.28s DRx cycle) LTE TDD Paging cycle #128 frames (1.28s DRx cycle) Radio Off AT+CFUN=4, flight mode WCDMA Data call Band 2 @+23.5dBm IWCDMA-RMS WCDMA WCDMA Data call Band 4 @+23.5dBm WCDMA Data call Band 5 @+23.5dBm LTE FDD Data call Band 2 @+23dBm LTE FDD Data call Band 4 @+23dBm LTE FDD Data call Band 5 @+23dBm LTE FDD Data call Band 7 @+23dBm LTE FDD Data call Band 12 @+23dBm LTE FDD Data call Band 13 @+23dBm ILTE-RMS LTE FDD LTE FDD Data call Band 14 @+23dBm LTE FDD Data call Band 17 @+23dBm LTE FDD Data call Band 25 @+23dBm LTE FDD Data call Band 26 @+23dBm 5.5 3.5 3.3 5.3 5.3 2.8 730 800 580 960 830 680 800 600 750 650 630 950 680 LTE FDD Data call Band 30 @+22dBm 1050 LTE FDD Data call Band 66 @+23dBm LTE FDD Data call Band 71 @+23dBm LTE TDD LTE TDD Data call Band 38 @+23dBm 850 750 980 Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. FIBOCOM L860-GL Series Hardware Guide Page 25 of 60 Fibocom Confidential Parameter Mode Condition LTE TDD Data call Band 41 @+23dBm LTE TDD Data call Band 48 @+21dBm Typical Current (mA) 620 400 Note The above data is the average value obtained by testing the sample for high/medium/low channels. In 5CA mode, the L860 power consumption is shown in the following table:

5CA Combination Condition Typical

(Max Data Transfer) Current (mA) 2+46+46+46+46, 46+46+46+46+66, 2+5+5+30+66, 2+5+5+66+66, 2+2+46+46+46, 2+5+46+46+46, 2+13+46+46+46, 2+46+46+46+46, Band 2 @+22dBm Band 5 @+22dBm Band 7 @+22dBm 2+46+46+46+66, 4+46+46+46+46, Band 13 @+22dBm 5+46+46+46+66, 13+46+46+46+66, 46+46+46+66+66, 2+46+46+46+46, 5+46+46+46+46, 13+46+46+46+46, 41+41+41+41+41 Band 30 @+22dBm Band 41 @+22dBm Band 66 @+22dBm 1650 1300 1600 1350 1350 1000 1500 Note The data above is an average value tested on some samples at 25C temperature. 3.3 Control Signal The L860 module provides two control signals for power on/off and reset operations. The pin is defined in the following table:

Pin Pin Name I/O Reset Value Function Type 6 FULL_CARD_POWER _OFF#

67 RESET#

I I PU PU Module power on/off input, internal pull up Power on: High/Floating Power off: Low 3.3/1.8V WWAN reset input, internal pull up

(10K), active low 1.8V Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. FIBOCOM L860-GL Series Hardware Guide Page 26 of 60 Fibocom Confidential Pin Pin Name I/O Reset Value Function Type 50 PERST#

I PU core dump, it will reset whole 3.3V Asserted to reset module PCIe interface default. If module went into module, not only PCIe interface. Active low, internal pull up (10K) Note RESET# and PERST# need to be controlled by independent GPIO, and not shared with other devices on the host. RESET# and PERST# are sensitive signals, so they should keep away from RF interference and be protected by GND. It should be neither near PCB edge nor route on surface layer to avoid module abnormal reset caused by ESD. Module Start-Up 3.3.1.1 Start-up Circuit The FCPO# ( FULL_CARD_POWER_OFF #) pin needs an external 3.3V or 1.8V pull up for booting up. AP (Application Processor) controls the module start-up. The recommended design is using a default PD port to control FCPO#. It also should reserve a 100K pull down resistor on AP side. The circuit design is shown in Figure3-4:

Figure 3-4 Circuit for module start-up controlled by AP 3.3.1.2 Start-up Timing Sequence When power supply is ready, the PMU of module will power on and start initialization process by pulling high FCPO# signal. After about 15s, module will complete initialization process. The start-up timing is shown in Figure 3-5:

Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. FIBOCOM L860-GL Series Hardware Guide Page 27 of 60 Fibocom Confidential Figure 3-5 Timing control for start-up Index Min. Recommended Max. Comment tpr 0ms

ton1 8ms 20ms ton2 50ms 100ms

The delay time of power supply rising from 0V up to 3.135V. If power supply always ready, it can be ignored RESET# should be de-asserted after FCPO#

The time delay of PERST# de-asserted after FCPO#, PERST# must always be the last to get de-asserted Module Shutdown The module can be shut down by the following controls:

Shutdown Control Action Condition Software Sending AT+CFUN=0 command Normal shutdown (recommend) Hardware Pull down FCPO# pin occurs and the software control cannot be Only used when a hardware exception used. Module can be shut down by sending AT+CFUN=0 command. When the module receives the software shutdown command, the module will start the finalization process (the reverse process of initialization), and it will be completed after tsd time (tsd is the time which AP receive OK of AT+CFUN=0, if there is no response, the max tsd is 5s). In the finalization process, the module will save the network, SIM card and some other parameters from memory, and then clear the memory and shut down PMU. The control timing is shown in Figure 3-6:

Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. FIBOCOM L860-GL Series Hardware Guide Page 28 of 60

+3.3VPERST#tprRESET#ton1Module StateInitializationActivation(AT Command Ready)FCPO#ton2typical 15sOFFFibocom Confidential Figure 3-6 Shutdown timing control Index Min. Recommended Max. Comment toff1 toff2 tpd 16ms 20ms 2ms 10ms 10ms 100ms

RESET# should be asserted after PERST#

FCPO# should be asserted after RESET#

+3.3V power supply goes down time. If power supply is always on, it can be ignored Module Reset The L860 module can reset to its initial status by pulling down the RESET# signal for more than 2ms (10ms is recommended), and module will restart after RESET# signal is released. When customer executes RESET# function, the PMU remains its power inside the module. The recommended circuit design is shown in the Figure 3-7:

Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. FIBOCOM L860-GL Series Hardware Guide Page 29 of 60

+3.3VPERST#tpdRESET#Module StateFinalizationActivationFCPO#toff1tsdOFFAT+CFUN=0toff2Fibocom Confidential Figure 3-7 Recommended design for reset circuit There are two reset control timings as below:

Reset timing 1st in Figure 3-8, PMU of module internal always on in reset sequence, recommend using in FW upgrade and module recovery;

Reset timing 2nd in Figure 3-9, PMU of module internal will be off in reset sequence (including whole power off and power on sequence, tsd can refer section 3.3.2), recommend using in system warm boot. Figure 3-8 Reset control timing1st Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. FIBOCOM L860-GL Series Hardware Guide Page 30 of 60

+3.3VPERST#RESET#Module StateInitializationActivationFCPO#typical 15sBaseband resetActivationtoff2Fibocom Confidential Figure 3-9 Reset control timing2nd Index Min. Recommended Max. Comment toff1 16ms 20ms toff2 2ms 10ms toff 500ms 500ms ton1 8ms 20ms ton2 50ms 100ms PCIe Link State

RESET# should be asserted after PERST#, refer section 3.3.2 FCPO# should be asserted after RESET#, refer section 3.3.2 Time to allow the WWAN module to fully discharge any residual voltages before the pin could be de-asserted again. This is required for both Pre-OS as well as Runtime flow RESET# should be de-asserted after FCPO#, refer section 3.3.1.2 The time delay of PERST# de-asserted after FCPO#, PERST# must always be the last to get de-asserted. refer section 3.3.1.2 Modem has the lowest power consumption in D0 L1.2 PCIe link state. D3cold L2 will increase extra about 0.5mA power consumption. CLKREQ# can assert or de-assert in D3cold L2, but CLKREQ# shouldnt be changed again during D3cold L2. When CLKREQ# asserts in D3cold L2, it will increase extra 0.3mA power consumption compared with CLKREQ# de-asserted in D3cold L2. We recommend keep CLKREQ# de-

asserted in D3cold L2. PCIe Link State PERST# CLKREQ#

D0 L1.2 D3cold L2 H L H H Power Consumption

(mA) Isleep Isleep+0.5 Description Refer 3.2.3 Power Consumption The extra 0.5mA is consumed on PERST# pull down Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. FIBOCOM L860-GL Series Hardware Guide Page 31 of 60

+3.3VPERST#RESET#Module StateInitializationActivationFCPO#typical 15sActivationtoffFinalizationOFFAT+CFUN=0toff2toff1ton1ton2tsdFibocom Confidential PCIe Link State PERST# CLKREQ#

Power Consumption

(mA) Description L L Isleep+0.8 The extra 0.3mA is consumed on CLKREQ# pull down 3.3.4.1 D0 L1.2 Module supports PCIe goes into D0 L1.2 state in Win10 system. The D0->D0 L1.2@S0/S0ix->D0 timing is shown in Figure 3-10:

Figure 3-10 D0 L1.2 timing 3.3.4.2 D3cold L2 Module supports PCIe goes into D3cold L2 state in Win10 system. The D0->D3cold L2@S0/S0ix

->D0 timing is shown in Figure 3-11 and Figure 3-12:

Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. FIBOCOM L860-GL Series Hardware Guide Page 32 of 60

+3.3VPERST#RESET#Module StateD0 L1.2@S0/S0ixD0 L0@S0/S0ixFCPO#D0 L0@S0/S0ixCLKREQ#Fibocom Confidential Figure 3-11 D3cold L2 timing (Host wakeup) Figure 3-12 D3cold L2 timing (Modem wakeup) Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. FIBOCOM L860-GL Series Hardware Guide Page 33 of 60

+3.3VPERST#RESET#Module StateD3cold L2@S0/S0ixD0 L0@S0/S0ixFCPO#D0 L0@S0/S0ixPEWAKE#Host assertHost de-assertCLKREQ#+3.3VPERST#RESET#Module StateD3cold L2@S0/S0ixD0 L0@S0/S0ixFCPO#D0 L0@S0/S0ixPEWAKE#Modem assertHost de-assertModem de-assertHost assertCLKREQ#Fibocom Confidential Timing Application The recommended timing application in Win10 OS is as below table:

System status Timing Application S0ix D0 L1.2 Refer to section 3.3.4.1 Figure 3-10 D0 L1.2 timing

(Modem standby) D3cold L2 Refer to section 3.3.4.2 Figure 3-11/3-12 D3cold L2 timing S3, S4, S5 Power on

(back to S0) Power off

(out of S0) Refer to section 3.3.1.2 Figure 3-5 Timing control for start-up Refer to section 3.3.2 Figure 3-6 Shutdown timing control G3 boot Power on Refer to section 3.3.1.2 Figure 3-5 Timing control for start-up Warm boot Refer to section 3.3.3 Figure 3-9 Reset control timing2nd Modem FW upgrade / Modem recovery Refer to section 3.3.3 Figure 3-8 Reset control timing1st Intel X86 platforms must follow the table above. AMD X86 platforms should follow the table above and meet the special request of platform itself. The recommended timing application in Chrome/Android/Linux OS is as below table:

System status Timing Application Power on Shut down Connect standby Restart Refer to section 3.3.1.2 Figure 3-5 Timing control for start-up Refer to section 3.3.2 Figure 3-6 Shutdown timing control Refer to section 3.3.4.1 Figure 3-10 D0 L1.2 timing /

section 3.3.4.2 Figure 3-11/12 D3cold L2 timing Refer to section 3.3.3 Figure 3-9 Reset control timing2nd Modem FW upgrade / Modem recovery Refer to section 3.3.3 Figure 3-8 Reset control timing1st 3.4 PCIe Interface L860 module supports PCIe Gen2, one lane for data transmission channel. It is also compatible with PCIe Gen1. After L860 module is inserted into PC, PCIe interface can work with the driver, and then map a MBIM port and a GNSS port in Win10 & Linux system. MBIM interface is used for initiating data service in Win10 & Linux system and GNSS interface is used for receiving GNSS data. Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. FIBOCOM L860-GL Series Hardware Guide Page 34 of 60 Fibocom Confidential PCIe Interface Definition Pin# Pin Name I/O Reset Value Description Type 41 PETn0 O

43 PETP0 O

47 PERn0 49 PERP0 I I

53 REFCLKN I

55 REFCLKP I

50 PERST#

I PU 52 CLKREQ#

I/O PU PCIe TX differential signal Negative PCIe TX differential signal Positive PCIe RX differential signal Negative PCIe RX differential signal Positive PCIe reference clock signal Negative PCIe reference clock signal Positive

Asserted to reset module PCIe interface default. If module went into coredump, it will reset whole module, not only PCIe interface. 3.3V Active low, internal pull up (10K) Asserted by device to request a PCIe reference clock be available (active clock state) in order to transmit data. It also used by L1 PM Sub states mechanism, asserted by either host or device to initiate an L1 exit. Active low, internal pull up (10K) Asserted to wake up system and reactivate PCIe link from L2 to L0, it depends on system 3.3V 54 PEWAKE# O L whether supports wake up functionality. 3.3V Active low, open drain output and should add external pull up (100K) on platform Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. FIBOCOM L860-GL Series Hardware Guide Page 35 of 60 Fibocom Confidential PCIe Interface Application The reference circuit is shown in Figure 3-12:

Figure 3-12 Reference circuit for PCIe interface L860 module supports PCIe Gen2 interface, including three differential pairs: transmit pair TXP/N, receiving pair RXP/N and clock pair CLKP/N. PCIe can achieve the maximum transmission rate of 5 GT/s, and must strictly follow the rules below in PCB Layout:

The differential signal pair lines should be parallel and equal in length. The differential signal pair lines should be short if possible and be controlled within 15 inches (380 mm) for AP end. The impedance of differential signal pair lines is recommended to be 100, and can be controlled to 80-120 in accordance with PCIe protocol. Try to avoid the discontinuous reference ground, such as segment and space;

When the differential signal lines go through different layers, the via hole of grounding signal should be in close to that of signal, and generally, each pair of signals require 1-3 grounding signal via holes and the lines should never cross the segment of plane. Try to avoid bended lines and avoid introducing common-mode noise in the system, which will influence the signal integrity and EMI of difference pair. As shown in Figure 3-13, the bending angle of all lines should be equal or greater than 135, the spacing between difference pair lines should be larger than 20mil, and the line caused by bending should be greater than 1.5 times line width at least. When a serpentine line is used for length match with another line, the bended length of each segment should be at least 3 times the line width ( 3W). The largest spacing between the bended part of the Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. FIBOCOM L860-GL Series Hardware Guide Page 36 of 60 Module sideAP sideAC CapsAC CapsPERST#CLKREQ#WAKE#PERST#(pin50)CLKREQ#(pin52)PEWAKE#(pin54)PERn0PERP0PETn0PETP0REFCLKNREFCLKPPETn0(pin41)PETP0(pin43)PERn0(pin47)PERP0(pin49)REFCLKN(pin53)REFCLKP(pin55)+3.3V/1.8V100K10KM.2 Key-B 75pin ConnectorFibocom Confidential serpentine line and another one of the differential lines must be less than 2 times the spacing of normal differential lines (S1 < 2S). Figure 3-13 Requirement of PCIe line The difference in length of two data lines in difference pair should be within 5mil, and the length match is required for all parts. When the length match is conducted for the differential lines, the designed position of correct match should be close to that of incorrect match, as shown in Figure 3-14. However, there is no specific requirements for the length match of transmit pair and receiving pair, which means the length match is only required by intra differential pair rather than inter differential pair. Figure 3-14 Length match design of PCIe differential pair 3.5 USIM Interface The L860 module support dual SIM card single standby, with one built-in USIM card interface, which supports 1.8V and 3V SIM cards. Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. FIBOCOM L860-GL Series Hardware Guide Page 37 of 60 PCIe Difference Pair 1WSS1<2S3W13520milPCIe Difference Pair 21.5WCorrect matchDismatched endIncorrect matchMatched endFibocom Confidential USIM1 Pins The USIM1 pins description is shown in the following table:

Pin Pin Name I/O Reset Value Description 36 UIM_PWR 30 UIM_RESET 32 UIM_CLK 34 UIM_DATA PO

O O L L I/O L 66 SIM_DETECT I PD USIM power supply USIM reset USIM clock Type 1.8V/3V 1.8V/3V 1.8V/3V USIM data, internal pull up (4.7K) 1.8V/3V USIM card detect, internal 390K pull-up. Active high, and high level indicates SIM card is inserted; and low level indicates 1.8V SIM card is detached. USIM Interface Circuit 3.5.2.1 N.C. SIM Card Slot The reference circuit design for N.C. (Normally Closed) SIM card slot is shown in Figure 3-15:

Figure 3-15 Reference circuit for N.C. SIM card slot The principles of the N.C.SIM card slot are described as follows:

When the SIM card is detached, it connects the short circuit between CD and SW pins, and drives the SIM_DETECT pin low. When the SIM card is inserted, it connects an open circuit between CD and SW pins, and drives the SIM_DETECT pin high. Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. FIBOCOM L860-GL Series Hardware Guide Page 38 of 60 Fibocom Confidential 3.5.2.2 N.O. SIM Card Slot The reference circuit design for N.O. (Normally Open) SIM card slot is shown in Figure 3-16:

Figure 3-16 Reference circuit for N.O. SIM card slot The principles of the N.O.SIM card slot are described as follows:

When the SIM card is detached, it connects an open circuit between CD and SW pins, and drives the SIM_DETECT pin low. When the SIM card is inserted, it connects the short circuit between CD and SW pins, and drives the SIM_DETECT pin high. USIM Hot-Plug The L860 module supports the SIM card hot-plug function, which determines whether the SIM card is inserted or detached by detecting the SIM_DETECT pin state of the SIM card slot. The SIM card hot-plug function can be configured by AT+MSMPD command, and the description for AT command is shown in the following table:

AT Command Hot-plug Detection Function Description AT+MSMPD=1 Enable Default value, the SIM card hot-plug detection function is enabled. The module can detect whether the SIM card is inserted or not through the SIM_DETECT pin state. The SIM card hot-plug detect function is disabled. AT+MSMPD=0 Disable The module reads the SIM card when starting up, and the SIM_DETECT status will not be detected. After the SIM card hot-plug detection function is enabled, the module detects that the SIM card is inserted Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. FIBOCOM L860-GL Series Hardware Guide Page 39 of 60 Fibocom Confidential when the SIM_DETECT pin is high, then executes the initialization program and finish the network registration after reading the SIM card information. When the SIM_DETECT pin is low, the module determines that the SIM card is detached and does not read the SIM card. Note:

SIM_DETECT is active high. It can be swapped to active low by AT CMD. USIM Design The SIM card circuit design should meet the EMC standards and ESD requirements with the improved capability to resist interference, to ensure that the SIM card can work stably. The following guidelines should be noted in design:

The SIM card slot should be placed as close as possible to the module, and away from the RF antenna, DC/DC power supply, clock signal lines, and other strong interference sources. The SIM card slot with a metal shielding housing can improve the anti-interference ability. The trace length between the SIM card slot and the module should not exceed 100mm, or it could reduce the signal quality. The UIM_CLK and UIM_DATA signal lines should be isolated by GND to avoid crosstalk interference. If it is difficult for the layout, the whole SIM signal lines should be wrapped with GND as a group at least. The filter capacitors and ESD devices for SIM card signals should be placed near to the SIM card slot, and the ESD devices with 22-33pF capacitance should be used. 3.6 Status Indicator The L860 module provides two signals to indicate the operating status of the module, and the status indicator pins are shown in the following table:

Pin Pin Name I/O Reset Value Pin Description Type 10 LED1#

23 WOWWAN#

O O T PD System status LED, drain output. 3.3V Module wakes up Host (AP), reserved 1.8V LED#1 Signal The LED#1 signal is used to indicate the operating status of the module, and the detailed description is shown in the following table:

Module Status LED1# Signal RF function ON Low level (LED on) RF function OFF High level (LED off) Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. FIBOCOM L860-GL Series Hardware Guide Page 40 of 60 Fibocom Confidential The LED driving circuit is shown in Figure 3-17:

Figure 3-17 LED driving circuit Note:

The resistance of LED current-limiting resistor is selected according to the driving voltage and the driving current. WOWWAN#

The WOWWAN# signal is used to wake the Host (AP) when there comes the data request. The definition of WOWWAN# signal is as follows:

Operating Mode WOWWAN# Signal SMS or data requests Pull low 1s then pull high (pulse signal). Idle/Sleep High level The WOWWAN# timing is shown in Figure 3-18:

Figure 3-18 WOWWAN# timing Note:

SMS wake-up host need send AT command: AT+GTSMSFILTERWUPEN=1 to enable this function. Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. FIBOCOM L860-GL Series Hardware Guide Page 41 of 60 WOWWAN#1SIdle/SleepCall/SMS/DataIdle/SleepStatusFibocom Confidential 3.7 Interrupt Control The L860 module provides four interrupt signals, and the pin definition is as follows:

Pin Pin Name I/O 8 W_DISABLE1#

25 DPR 26 W_DISABLE2#

68 ANT_CONFIG I I I I Reset Value PD PD PD PD W_DISABLE1#

Pin Description Type Enable/Disable RF network BodySAR detection GNSS disable signal Reserved Host antenna configuration detection Reserved 3.3/1.8V 3.3/1.8V 3.3/1.8V 1.8V The module provides a hardware pin to enable/disable WWAN RF function, and the function can also be controlled by the AT command. The module enters into the flight mode after the RF function is disabled. The definition of W_DISABLE1# signal is as below table:

W_DISABLE1# Signal Function High/Floating WWAN function is enabled, the module exits the flight mode. Low WWAN function is disabled, the module enters flight mode. Note The function of W_DISABLE1# is enabled by default. It can be disabled by customers request. BODYSAR The L860 module supports BodySAR function by detecting the DPR pin. The voltage level of DPR is high by default, and when the SAR sensor detects the closing human body, the DPR signal will be pulled down. As the result, the module then lowers down its emission power to its default threshold value, thus reducing the RF radiation on the human body. The threshold of emission power can be set by the AT Commands. The definition of DPR signal is shown in the following table:

DPR Signal Function High/Floating The module keeps the default emission power Low Lower the maximum emission power to the threshold value of the module. Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. FIBOCOM L860-GL Series Hardware Guide Page 42 of 60 Fibocom Confidential ANT_CONFIG L860 module can be configured to support dual antennas or 4 antennas by detecting the ANT_CONFIG pin. ANT_CONFIG is an input port which is pulled high internal in default. When ANT_CONFIG is high level, then module supports dual antennas (Main & D/G ANT). When module detects low level of ANT_CONFIG, then module will be configured to support 4 antennas. The definition of ANT_CONFIG signal is shown as below table:

ANT_CONFIG Signal Function High/Floating Support dual antennas (Main & D/G ANT)Reserved Low Support 4 antennas (Reserved) 3.8 ANT Tunable Interface The module supports ANT Tunable interfaces with two different control modes, i.e. MIPI interface and 4bit GPO interface. Through cooperating with external antenna adapter switch via ANT Tunable, it can flexibly configure the bands of LTE antenna to improve the antennas working efficiency and save space for the antenna. Pin Pin Name I/O Pin Description Type 56 RFFE_SCLK O 58 RFFE_SDATA I/O 59 ANTCTL0 61 ANTCTL1 63 ANTCTL2 65 ANTCTL3 O O O O Tunable ANT control, MIPI Interface, RFFE clock Tunable ANT control, MIPI Interface, RFFE data Tunable ANT control, GPO interface, Bit0 Tunable ANT control, GPO interface, bit1 Tunable ANT control, GPO interface, Bit2 Tunable ANT control, GPO interface, Bit3 1.8V 1.8V 1.8V 1.8V 1.8V 1.8V Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. FIBOCOM L860-GL Series Hardware Guide Page 43 of 60 Fibocom Confidential 3.9 Configuration Interface The L860 module provides four pins for the configuration as the WWAN-PCIe, type M.2 module:

Pin Pin Name I/O Reset Value Pin Description Type 1 CONFIG_3 21 CONFIG_0 69 CONFIG_1 75 CONFIG_2 O O O O

L

NC NC Internally connected to GND NC

The M.2 module configuration is shown in the following table:

Config_0 Config_1 Config_2 Config_3 Module Type and

(pin21)

(pin69)

(pin75)

(pin1) Main Host Interface Port Configuration NC GND NC NC WWAN - PCIe Gen2 Vendor defined Please refer to PCI Express M.2 Specification Rev1.2 for more details. 3.10 I2C Interface The L860 module support I2C interface. I2C Pins Pin Pin Name I/O Reset Value Description 40 I2C_SCL 42 I2C_SDA 44 I2C_IRQ#

I PU I/O PU O PD Master I2C1 CLK Master I2C1 DATA I2C1 INT, Wake up I2C HOST Type 1.8V 1.8V 1.8V Note: L860 works as a slave device. Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. FIBOCOM L860-GL Series Hardware Guide Page 44 of 60 Fibocom Confidential 4 Radio Frequency 4.1 RF Interface RF Interface Functionality The L860 module supports four RF connectors used for external antenna connection. As the Figure 4-1 shows, M is for Main antenna, which is used to receive and transmit RF signal; D/G is for Diversity antenna, which is used to receive the diversity RF signal. M1 and M2 are used for support 4x4 MIMO data transfer. Figure 4-1 RF connectors RF Connector Characteristic Rated Condition Environment Condition Frequency Range DC-6GHz Characteristic Impedance 50 Temperature Range: 40C-+85C RF Connector Dimension L860 module uses standard M.2 RF connectors. The RF connector part number is 818004607 manufactured by ECT corporation, and the size is 220.6mm. The connector dimension is shown as Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. FIBOCOM L860-GL Series Hardware Guide Page 45 of 60 Fibocom Confidential following picture:

Figure 4-2 RF connector dimensions Figure 4-3 0.81mm coaxial antenna dimensions Figure 4-4 Schematic diagram of 0.81mm coaxial antenna connected to the RF connector Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. FIBOCOM L860-GL Series Hardware Guide Page 46 of 60 Fibocom Confidential RF Connector Assembly Mate RF connector parallel refer Figure 4-5, do not slant mate with strong force. To avoid damage in RF connector unmating, it is recommended using pulling JIG as Figure 4-6, and the pulling JIG must be lifted up vertically to PCB surface (see Figure 4-7 and 4-8). Figure 4-5 Mate RF connector Figure 4-6 Pulling JIG Figure 4-7 Lift up pulling JIG Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. FIBOCOM L860-GL Series Hardware Guide Page 47 of 60 Fibocom Confidential Figure 4-8 Pulling direction 4.2 Operating Band The operating bands of L860 module are shown in the following table:

Operating Band Description Mode Tx (MHz) Rx (MHz) Band 2 Band 4 Band 5 Band 7 Band 12 Band 13 Band 14 Band 17 Band 25 Band 26 Band 29 Band 30 1900MHz LTE FDD/WCDMA 1850-1910 1930-1990 1700MHz LTE FDD/WCDMA 1710-1755 2110-2155 850MHz LTE FDD/WCDMA 824-849 869-894 2600Mhz LTE FDD 2500-2570 2620-2690 700MHz LTE FDD 700MHz LTE FDD 700MHz LTE FDD 700MHz LTE FDD 699-716 777-787 788-798 704-716 729-746 746-756 758-768 734-746 1900MHz LTE FDD 1850-1915 1930-1995 850MHz LTE FDD 814-849 700MHz LTE FDD N/A 859-894 716-728 2300MHz LTE FDD 2305-2315 2350-2360 Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. FIBOCOM L860-GL Series Hardware Guide Page 48 of 60 Fibocom Confidential Operating Band Description Mode Tx (MHz) Rx (MHz) Band 66 Band 71 Band 38 Band 41 Band 48 Band 46 GPS L1 GLONASS L1 BDS Galileo 1700MHz LTE FDD 1710-1780 2110-2200 680MHz LTE FDD 663-698 617-652 2600MHz LTE TDD 2570-2620 2500MHZ LTE TDD 2496-2690 3600MHZ LTE TDD 3550-3700 5200MHZ LTE TDD N/A 5150-5925

1575.421.023 1602.56254 1561.0982.046 1575.421.023 4.3 Transmitting Power The transmitting power for each band of L860 module is shown in the following table:

Mode Band 3GPP Requirement (dBm) Tx Power (dBm) Note Band 2 24+1.7/-3.7 WCDMA Band 4 24+1.7/-3.7 Band 5 24+1.7/-3.7 Band 2 232.7 Band 4 232.7 Band 5 232.7 Band 7 232.7 Band 12 232.7 LTE FDD Band 13 232.7 Band 14 232.7 Band 17 232.7 Band 25 232.7 Band 26 232.7 Band 30 232.7 23.51 23.51 23.51 231 231 23+2/-1 231 23+2/-1 23+2/-1 23+2/-1 23+2/-1 231 23+2/-1 221

10MHz Bandwidth, 1 RB 10MHz Bandwidth, 1 RB 10MHz Bandwidth, 1 RB 10MHz Bandwidth, 1 RB 10MHz Bandwidth, 1 RB 10MHz Bandwidth, 1 RB 10MHz Bandwidth, 1 RB 10MHz Bandwidth, 1 RB 10MHz Bandwidth, 1 RB 10MHz Bandwidth, 1 RB 10MHz Bandwidth, 1 RB Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. FIBOCOM L860-GL Series Hardware Guide Page 49 of 60 Fibocom Confidential Mode Band 3GPP Requirement (dBm) Tx Power (dBm) Note Band 66 232.7 Band 71 23+2.7/-3.2 Band 38 232.7 Band 41 232.7 Band 41 HPUE 262.7 Band 48 23+3/-4 LTE TDD 231 23+2/-1 231 231 25+2/-1 211 10MHz Bandwidth, 1 RB 10MHz Bandwidth, 1 RB 10MHz Bandwidth, 1 RB 10MHz Bandwidth, 1 RB 10MHz Bandwidth, 1 RB 10MHz Bandwidth, 1 RB 4.4 Receiver Sensitivity Dual Antennas Receiver Sensitivity All bands support dual antennas, the receiver sensitivity for each band of L860 module is shown in below table:

Mode Band 3GPP Requirement

(dBm) Rx Sensitivity (dBm) Typical Note Band 2

-104.7 WCDMA Band 4

-106.7 Band 5

-104.7 LTE FDD Band 2

-94.3 Band 4

-96.3 Band 5

-94.3 Band 7

-94.3 Band 12

-93.3 Band 13

-93.3 Band 14

-93.3 Band 17

-93.3 Band 25

-92.8 Band 26

-93.8 Band 29

-93.3 Band 30

-95.3

-110.6

-110

-111.4

-100.6

-101.5

-103.1

-99

-103.2

-103.1

-102.4

-103.5

-98.5

-103.0

-101

-101 BER < 0.1%

BER < 0.1%

BER < 0.1%

10MHz Bandwidth 10MHz Bandwidth 10MHz Bandwidth 10MHz Bandwidth 10MHz Bandwidth 10MHz Bandwidth 10MHz Bandwidth 10MHz Bandwidth 10MHz Bandwidth 10MHz Bandwidth 10MHz Bandwidth 10MHz Bandwidth Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. FIBOCOM L860-GL Series Hardware Guide Page 50 of 60 Fibocom Confidential Mode Band 3GPP Requirement

(dBm) Rx Sensitivity (dBm) Typical Note Band 66

-95.8 Band 71

-93.5 Band 38

-96.3 Band 41

-94.3 Band 46

-88.5 Band 48

-95 LTE TDD Note:

-101.5

-101.4

-100.2

-99.4

-95.5

-101.3 10MHz Bandwidth 10MHz Bandwidth 10MHz Bandwidth 10MHz Bandwidth 20MHz Bandwidth 10MHz Bandwidth The above values are measured in dual antennas condition (Main+Diversity). For single main antenna (without Diversity), the sensitivity will drop about 3dBm for each band of LTE. Four Antennas Receiver Sensitivity Some middle/high bands support four antennas. The receiver sensitivity for some middle/high bands of L860 module is shown in below table:

Mode Band Middle/High Band 3GPP Requirement

(dBm) Rx Sensitivity Typical (dBm) Note Band 2 Middle Band

-97 Band 4 Middle Band

-99 Band 7 High Band

-97 Band 25 Middle Band

-95.5 Band 30 High Band

-98 Band 66 Middle Band

-98.5 Band 41 High Band

-97 Band 48 High Band

-97.2 LTE FDD LTE TDD

-103.5

-103.5

-103

-103

-103

-103.5

-103

-103.8 10MHz Bandwidth 10MHz Bandwidth 10MHz Bandwidth 10MHz Bandwidth 10MHz Bandwidth 10MHz Bandwidth 10MHz Bandwidth 10MHz Bandwidth Note:

The above values are measured in four antennas condition (Main+Diversity+M1+M2). If only use dual antennas (Main+Diversity), the sensitivity will drop about 3dBm for each band of LTE. Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. FIBOCOM L860-GL Series Hardware Guide Page 51 of 60 Fibocom Confidential 4.5 GNSS L860 module supports GPS/GLONASS/BDS/Galileo and adopts RF Diversity and GNSS integrated antenna. Description Condition Test Result Max Typical GPS fixing 80mA @ -130dBm 65mA @ -130dBm GPS tracking 80mA@ -130dBm 65mA@ -130dBm GPS+GLONASS+

80mA @ -130dBm 65mA @ -130dBm BDS fixing Current GPS+GLONASS+

80mA @ -130dBm 65mA @ -130dBm BDS tracking GPS Sleep 3.5mA GPS+GLONASS+

3.5mA 2mA 2mA GPS TTFF BDS Sleep Cold start Warm start Hot Start Cold start GPS+GLONASS+BDS Warm start Hot Start 45s 45s 3s 45s 45s 3s 35s / -130dBm 33s / -130dBm 1s / -130dBm 35s /-130dBm 33s/-130dBm 1s/-130dBm GPS Sensitivity Tracking

-156dBm

-158dBm Acquisition

-144dBm

-148dBm GPS+GLONASS+BDS Tracking

-156dBm

-158dBm Acquisition

-144dBm

-148dBm Note:

GNSS current is tested with RF disabled at 25C temperature. 4.6 Antenna Design The L860 module provides main and diversity antenna interfaces, and the antenna design requirements are shown in the following table:

Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. FIBOCOM L860-GL Series Hardware Guide Page 52 of 60 Fibocom Confidential L860 Module Main Antenna Requirement Frequency range The most proper antenna to adapt the frequencies should be used. Bandwidth (WCDMA) WCDMA band 4 (1700): 445 MHz WCDMA band 2 (1900): 140 MHz WCDMA band 5 (850): 70 MHz LTE band 2 (1900): 140MHz LTE band 4 (1700): 445MHz LTE band 5 (850): 70 MHz LTE band 7 (2600): 190 MHz LTE Band 12 (700): 47 MHz LTE Band 13 (700): 41 MHz LTE Band 14 (700): 40 MHz LTE Band 17 (700): 42 MHz Bandwidth (LTE) LTE band 25 (1900):145 MHz LTE band 26 (850): 80 MHz LTE band 29 (700): 12 MHz LTE band 30 (2300): 55 MHz LTE band 66 (1700): 490MHz LTE band 38 (2600): 50 MHz LTE band 41 (2500): 194 MHz LTE band 48 (3600):150MHz LTE band 46 (5GHz): 775 MHz GPS: 2 MHz GLONASS: 8 MHz BDS: 4 MHz Galileo: 2 MHz 50

> 28 dBm average power WCDMA & LTE Bandwidth (GNSS) Impedance Input power Recommended standing-wave 2:1 ratio (SWR) Note:

ANT on B30 suggestion: Peak gain < 1dBi, for FCC EIRP requirement, Efficient > 50% for carrier TRP requirement. If integrator doesn't follow the instruction, may cause FCC EIRP or carrier TRP certification fail. Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. FIBOCOM L860-GL Series Hardware Guide Page 53 of 60 Fibocom Confidential 5 ESD Characteristics The module is generally not protected against Electrostatic Discharge (ESD). ESD handling precautions that apply to ESD sensitive components should be strictly followed. Proper ESD handling procedures must be applied throughout the processing, handling, assembly and operation of any application with module. The ESD characteristics are shown in the following table (Temperature: 25C, Relative Humidity:

40%). Interface GND Antenna Interface Golden Finger Note Contact Discharge Air Discharge 8 kV 8 kV 2 kV 15 kV NA NA ESD performance is based on EVB-M2 development board. Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. FIBOCOM L860-GL Series Hardware Guide Page 54 of 60 Fibocom Confidential 6 Structure Specification 6.1 Product Appearance The product appearance for L860 module is shown in Figure6-1:

Figure 6-1 Module appearance Note The label of each module is subject to the good shipped. 6.2 Dimension of Structure The structural dimension of the L860 module is shown in Figure 6-2:

Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. FIBOCOM L860-GL Series Hardware Guide Page 55 of 60 Fibocom Confidential Figure 6-2 Dimension of structure 6.3 M.2 Interface Model The L860 M.2 module adopts 75-pin gold finger as external interface, where 67 pins are signal pins and 8 pins are notch pins as shown in Figure 3-1. For module dimension, please refer to 6.2 Dimension of Structure. Based on the M.2 interface definition, L860 module adopts Type 3042-S3-B interface (30x42mm, the component maximum height on t top layer is 1.5mm, PCB thickness is 0.8mm, and KEY ID is B). Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. FIBOCOM L860-GL Series Hardware Guide Page 56 of 60 Fibocom Confidential Figure 6-3 M.2 interface model 6.4 M.2 Connector L860 module connects with host by M.2 connector which is built in host. The recommended part number is APCI0026-P001A manufactured by LOTES Corporation, and the dimension is shown in Figure 6-4. The package of connector, please refer to the specification. Figure 6-4 M.2 dimension of structure Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. FIBOCOM L860-GL Series Hardware Guide Page 57 of 60 Fibocom Confidential 6.5 Storage Storage Conditions (recommended): Temperature is 235C, relative humidity is less than RH 60%. Storage period: Under the recommended storage conditions, the storage life is 12 months. 6.6 Packing The L860 module uses the tray sealed packing, combined with the outer packing method using the hard cartoon box, so that the storage, transportation and the usage of modules can be protected to the greatest extent. Note The module is a precision electronic product, and may suffer permanent damage if no correct electrostatic protection measures are taken. Tray Package The L860 module uses tray package, 20 pcs are packed in each tray, with 5 trays including one empty tray on top in each box and 5 boxes in each case. Tray packaging process is shown in Figure 6-5:

Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. FIBOCOM L860-GL Series Hardware Guide Page 58 of 60 Fibocom Confidential Figure 6-5 Tray packaging process Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. FIBOCOM L860-GL Series Hardware Guide Page 59 of 60 Fibocom Confidential Tray Size The pallet size is 3151706.5mm, and is shown in Figure 6-6:

Figure 6-6 Tray size (unit: mm) ITEM DIM (Unit: mm) L W H T A B C D E F G 315.02.0 170.02.0 6.50.3 0.80.1 43.00.3 31.00.3 79.00.2 60.00.2 180.00.2 60.00.2 40.00.2 Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved. FIBOCOM L860-GL Series Hardware Guide Page 60 of 60 Fibocom Confidential

 

 

FIBOCOM L860-GL-16

Hardware Guide

Version: 1.0.0

Date: 2020-09-28

Fibocom ConfidentialApplicability Type

Product Model

Description

L860-GL-16

NA

No.

1

Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.

FIBOCOM L860-GL Series Hardware Guide

Page 2 of 60

Fibocom ConfidentialCopyright

Copyright © 2019 Fibocom Wireless Inc. All rights reserved.

Without the prior written permission of the copyright holder, any company or individual is prohibited to

excerpt, copy any part of or the entire document, or distribute the document in any form.

The document is subject to update from time to time owing to the product version upgrade or other reasons.

Unless otherwise specified, the document only serves as the user guide. All the statements, information

and suggestions contained in the document do not constitute any explicit or implicit guarantee.

Notice

Trademark

The trademark is registered and owned by Fibocom Wireless Inc.

FCC Conformance information

Important Notice to OEM integrators

1. This module is limited to OEM installation ONLY.

2. This module is limited to installation in mobile applications, according to Part 2.1091(b).

3. The separate approval is required for all other operating configurations, including portable

configurations with respect to Part 2.1093 and different antenna configurations

4. For FCC Part 15.31 (h) and (k): The host manufacturer is responsible for additional testing to verify

compliance as a composite system. When testing the host device for compliance with Part

15 Subpart B, the host manufacturer is required to show compliance with Part 15 Subpart B while the

transmitter module(s) are installed and operating. The modules should be transmitting and the evaluation

should confirm that the module's intentional emissions are compliant (i.e. fundamental and out of band

emissions). The host manufacturer must verify that there are no additional unintentional emissions other

than what is permitted in Part 15 Subpart B or emissions are complaint with the transmitter(s) rule(s).

The Grantee will provide guidance to the host manufacturer for Part 15 B requirements if needed.

Important Note

they wish to change

notice that any deviation(s) from the defined parameters of the antenna trace, as described by the

instructions, require that the host product manufacturer must notify to Fibocom Wireless Inc.XXXX that

the antenna trace design. In this case, a Class II permissive change application is required to be filed

by the USI, or the host manufacturer can take responsibility through the change in FCC ID (new

application) procedure followed by a Class II permissive change application.

Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.

FIBOCOM L860-GL Series Hardware Guide

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Fibocom Confidential

End Product Labeling

FCC ID: ZMOL860GL16”

“Contains IC: 21374-L860GL16 “

Antenna Installation

When the module is installed in the host device, the FCC/IC ID label must be visible through a window

on the final device or it must be visible when an access panel, door or cover is easily re-moved. If not, a

second label must be placed on the outside of the final device that contains the following text: “Contains

The FCC ID/IC ID can be used only when all FCC/IC compliance requirements are met.

(1) The antenna must be installed such that 20 cm is maintained between the antenna and users,

(2) The transmitter module may not be co-located with any other transmitter or antenna.

(3) Only antennas of the same type and with equal or less gains as shown below may be used with this

module. Other types of antennas and/or higher gain antennas may require additional authorization for

operation.

Antenna type

PIFA

Bands

Peak Gain

WCDMA B2

WCDMA B4

WCDMA B5

LTE B2

LTE B4

LTE B5

LTE B7

LTE B12

LTE B13

LTE B14

4

3

3

4

3

3

4

3

3

3

Antenna type

PIFA

Peak Gain

Bands

LTE B17

LTE B25

LTE B26

LTE B30

LTE B38

LTE B41

LTE B48

LTE B66

LTE B71

3

4

3

1

4

4

1

3

3

In the event that these conditions cannot be met (for example certain laptop configurations or co-location

with another transmitter), then the FCC/IC authorization is no longer considered valid and the FCC ID/IC

ID cannot be used on the final product. In these circumstances, the OEM integrator will be responsible

for re-evaluating the end product (including the transmitter) and obtaining a separate FCC/IC

authorization.

Manual Information to the End User

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FIBOCOM L860-GL Series Hardware Guide

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Fibocom Confidential

The OEM integrator has to be aware not to provide information to the end user regarding how to install

or remove this RF module in the user’s manual of the end product which integrates this module. The end

user manual shall include all required regulatory information/warning as show in this manual.

Federal Communication Commission Interference Statement

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:

(1) This device may not cause harmful interference, and (2) this device must accept any interference

received, including interference that may cause undesired operation.

This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant

to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful

interference in a residential installation. This equipment generates, uses and can radiate radio frequency

energy and, if not installed and used in accordance with the instructions, may cause harmful interference

to radio communications. However, there is no guarantee that interference will not occur in a particular

installation. If this equipment does cause harmful interference to radio or television reception, which

can be determined by turning the equipment off and on, the user is encouraged to try to correct the

interference by one of the following measures:

- Reorient or relocate the receiving antenna.

- Increase the separation between the equipment and receiver.

- Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.

- Consult the dealer or an experienced radio/TV technician for help.

Any changes or modifications not expressly approved by the party responsible for compliance could void

the user's authority to operate this equipment. This transmitter must not be co-located or operating in

conjunction with any other antenna or transmitter.

List of applicable FCC rules

This module has been tested and found to comply with part 22, part 24, part 27, part 90, 15.247 and

15.407 part 15B requirements for Modular Approval.

The modular transmitter is only FCC authorized for the specific rule parts (i.e., FCC transmitter

rules) listed on the grant, and that the host product manufacturer is responsible for compliance to

any other FCC rules that apply to the host not covered by the modular transmitter grant of

certification. If the grantee markets their product as being Part 15 Subpart B compliant (when it also

contains unintentional-radiator digital circuity), then the grantee shall provide a notice stating that

the final host product still requires Part 15 Subpart B compliance testing with the modular

transmitter installed.

This device is intended only for OEM integrators under the following conditions: (For

Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.

FIBOCOM L860-GL Series Hardware Guide

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Fibocom Confidential

module device use)

1) The antenna must be installed such that 20 cm is maintained between the antenna and users, and

2) The transmitter module may not be co-located with any other transmitter or antenna.

As long as 2 conditions above are met, further transmitter test will not be required. However, the

OEM integrator is still responsible for testing their end-product for any additional compliance

requirements required with this module installed.

Radiation Exposure Statement

This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment.

This equipment should be installed and operated with minimum distance 20 cm between the radiator &

your body.

Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.

FIBOCOM L860-GL Series Hardware Guide

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Fibocom Confidential

Change History

Version

Author

Date

Remark

V1.0.0

Shu Ying

2020-09-28 Draft version

Reproduction forbidden without Fibocom Wireless Inc. written authorization - All Rights Reserved.

FIBOCOM L860-GL Series Hardware Guide

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Fibocom Confidential

Contents

1.1

1.2

1.3

2.1

2.2

2.3

2.4

2.5

2.6

1 Foreword ......................................................................................................................10

Introduction ................................................................................................................. 10

Reference Standard ................................................................................................... 10

Related Documents .................................................................................................... 10

2 Overview ...................................................................................................................... 11

Introduction ................................................................................................................. 11

Specification ............................................................................................................... 11

CA Combinations ........................................................................................................ 13

Application Framework ............................................................................................... 15

Hardware Block Diagram ............................................................................................ 15

Antenna Configuration ................................................................................................ 16

3 Application Interface ...................................................................................................17

3.1

M.2 Interface .............................................................................................................. 17

Pin Map ......................................................................................................................... 17

Pin Definition ................................................................................................................. 18

3.2

Power ......................................................................................................................... 22

Power Supply ................................................................................................................ 23

Logic Level .................................................................................................................... 24

Power Consumption ...................................................................................................... 25

3.3

Control Signal ............................................................................................................. 26

Module Start-Up ............................................................................................................ 27

3.3.1.1

3.3.1.2

Start-up Circuit ........................................................................................................................... 27

Start-up Timing Sequence ......................................................................................................... 27

Module Shutdown ......................................................................................................... 28

Module Reset ................................................................................................................ 29

PCIe Link State ............................................................................................................. 31

3.3.4.1 D0 L1.2 ...................................................................................................................................... 32

3.3.4.2 D3cold L2..................................................................................................................................... 32

Timing Application ......................................................................................................... 34

3.4

PCIe Interface ............................................................................................................ 34

PCIe Interface Definition ............................................................................................... 35

PCIe Interface Application ............................................................................................. 36

3.5

USIM Interface............................................................................................................ 37

USIM1 Pins ................................................................................................................... 38

USIM Interface Circuit ................................................................................................... 38

3.5.2.1 N.C. SIM Card Slot .................................................................................................................... 38

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FIBOCOM L860-GL Series Hardware Guide

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Fibocom Confidential

3.5.2.2 N.O. SIM Card Slot .................................................................................................................... 39

USIM Hot-Plug .............................................................................................................. 39

USIM Design ................................................................................................................. 40

3.6

Status Indicator........................................................................................................... 40

LED#1 Signal ................................................................................................................ 40

WOWWAN# .................................................................................................................. 41

3.7

Interrupt Control .......................................................................................................... 42

W_DISABLE1# .............................................................................................................. 42

BODYSAR ..................................................................................................................... 42

ANT_CONFIG ............................................................................................................... 43

ANT Tunable Interface ................................................................................................ 43

Configuration Interface ............................................................................................... 44

3.10

I2C Interface ............................................................................................................... 44

I2C Pins ......................................................................................................................... 44

4 Radio Frequency .........................................................................................................45

4.1

RF Interface ................................................................................................................ 45

RF Interface Functionality ............................................................................................. 45

RF Connector Characteristic ......................................................................................... 45

RF Connector Dimension .............................................................................................. 45

RF Connector Assembly ............................................................................................... 47

Operating Band .......................................................................................................... 48

Transmitting Power ..................................................................................................... 49

Receiver Sensitivity .................................................................................................... 50

Dual Antennas Receiver Sensitivity .............................................................................. 50

Four Antennas Receiver Sensitivity .............................................................................. 51

GNSS ......................................................................................................................... 52

Antenna Design .......................................................................................................... 52

5 ESD Characteristics ....................................................................................................54

6 Structure Specification ...............................................................................................55

Product Appearance ................................................................................................... 55

Dimension of Structure ............................................................................................... 55

M.2 Interface Model .................................................................................................... 56

M.2 Connector ............................................................................................................ 57

Storage ....................................................................................................................... 58

Packing ...................................................................................................................... 58

Tray Package ................................................................................................................ 58

Tray Size ....................................................................................................................... 60

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FIBOCOM L860-GL Series Hardware Guide

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3.8

3.9

4.2

4.3

4.4

4.5

4.6

6.1

6.2

6.3

6.4

6.5

6.6

Fibocom Confidential

1 Foreword

1.1 Introduction

The document describes the electrical characteristics, RF performance, dimensions and application

environment, etc. of L860-GL-GL (hereinafter referred to as L860). With the assistance of the document

and other instructions, the developers can quickly understand the hardware functions of L860 modules

and develop products.

1.2 Reference Standard

The design of the product complies with the following standards:

 3GPP TS 34.121-1 V8.11.0: User Equipment (UE) conformance specification; Radio transmission

and reception (FDD); Part 1: Conformance specification

 3GPP TS 34.122 V11.13.0: Technical Specification Group Radio Access Network; Radio

transmission and reception (TDD)

 3GPP TS 36.521-1 V13.4.0: User Equipment (UE) conformance specification; Radio transmission

and reception; Part 1: Conformance testing

 3GPP TS 21.111 V10.0.0: USIM and IC card requirements

 3GPP TS 51.011 V4.15.0: Specification of the Subscriber Identity Module -Mobile Equipment (SIM-

 3GPP TS 31.102 V10.11.0: Characteristics of the Universal Subscriber Identity Module (USIM)

 3GPP TS 31.11 V10.16.0: Universal Subscriber Identity Module (USIM) Application Toolkit (USAT)

 3GPP TS 36.124 V10.3.0: Electro Magnetic Compatibility (EMC) requirements for mobile terminals

ME) interface

application

and ancillary equipment

 3GPP TS 27.007 V10.0.8: AT command set for User Equipment (UE)

 3GPP TS 27.005 V10.0.1: Use of Data Terminal Equipment - Data Circuit terminating Equipment

(DTE-DCE) interface for Short Message Service (SMS) and Cell Broadcast Service (CBS)

 PCI Express M.2 Specification Rev1.2

1.3 Related Documents

 FIBOCOM Design Guide_RF Antenna

 FIBOCOM L860 Series AT Commands_V3.4.1

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Fibocom Confidential

2 Overview

2.1 Introduction

world.

2.2 Specification

Specification

L860 is a highly integrated 4G WWAN module which uses M.2 form factor interface. It supports LTE

FDD/LTE TDD/WCDMA systems and can be applied to most cellular networks of mobile carrier in the

LTE FDD: Band 2, 4, 5, 7, 12, 13, 14, 17, 25, 26, 29, 30, 66, 71

LTE TDD: Band 38, 41(HPUE), 48

Operating Band

LAA Band 46 Receiver only

4x4MIMO support: Band 2, 4, 7, 25, 30, 38, 41, 48, 66

WCDMA/HSPA+: Band 2, 4, 5

Support GPS, BDS, GLONASS, Galileo

GNSS

LTE

UMTS

3GPP Release 13

3GPP Release 12

Data Transmission

LTE FDD

LTE FDD: 1Gbps DL (Cat 16)/50Mbps UL (Cat 13)

LTE TDD

LTE TDD: 756Mbps DL (Cat 16)/90Mbps UL (Cat 13)

UMTS/HSPA+

UMTS:384 kbps DL/384 kbps UL

DC-HSPA+:42 Mbps DL (Cat 24)/5.76 Mbps UL (Cat6)

Carrier Aggregation 5CA Downlink /2*ULCA (Intra band) UL 64QAM Support

Power Supply

DC 3.135V-4.4V, Typical 3.3V

Normal operating temperature: -10°C-+55°C

Temperature

Extended operating temperature: -20°C-+65°C

Storage temperature: -40°C-+85°C

Interface: M.2 Key-B

Dimension：30×42×2.3mm

Weight: About 6.2 g

Physical

Characteristics

Interface

Antenna Connector WWAN Antenna×4

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Fibocom Confidential

Specification

Function Interface

W_Disable#

Support 4×4 MIMO

Dual SIM, 1.8V/3V

PCIe 2.0×1

USB 2.0 (For debug)

USB 3.0 (For debug)

BodySAR

LED

Tunable antenna

UART

Software

Protocol Stack

IPV4/IPV6

AT Commands

3GPP TS 27.007 and 27.005

Firmware Update

PCIe

Other Feature

Windows MBIM support

Multiple carrier

Windows update

OS

Windows10/Linux/Android

Note:

 B42 disabled as of FCC certification, support pending regulatory approval.

 When temperature goes beyond normal operating temperature range of -10°C-+55°C, RF

performance of module may be slightly off 3GPP specifications.

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Fibocom Confidential

2.3 CA Combinations

UL CA Combination

2CA

Intra-band

DL CA Combination

Inter-band

2CA

Intra-band (non-contiguous)

Intra-band (contiguous)

Inter-band

3CA

2 intra-band (non-contiguous)

plus inter-band

2 intra-band (contiguous) plus

inter-band

Intra-band (non-contiguous)

Intra-band (contiguous)

Inter-band

2 intra-band (non-contiguous)

plus 2 inter-band

4CA

2 intra-band (contiguous) plus

2 inter-band

5B,7C,41C,66B,66C

2+4, 5, 12, 13, 14, 29, 30, 46,48, 66,71

4+5, 12, 13, 29, 30, 46,48,71

5+7, 30, 46, 66,48

12+30, 66

13+46, 66,48

14+30, 66

25+26, 41, 46

26+41

29+30, 66

30+66

41+46

46+66

48+66

2, 4, 7, 25, 41,48, 66

2, 5, 7, 38, 41, 48, 66

2+4+5, 2+4+12, 2+4+13,2+4+71, 2+5+30 ,2+5+48,

2+12+30, 2+29+30, 2+5+66, 2+13+66, 2+14+30,

2+14+66, 2+30+66, 2+5+46, 2+13+46, 2+46+66,

2+12+66,2+13+48,2+66+71

4+5+30, 4+12+30, 4+29+30

5+30+66, 5+46+66,5+48+66

12+30+66, 13+46+66, 13+48+66,14+30+66, 29+30+66

2+2+5, 2+2+12, 2+2+13, 2+2+30, 2+2+66, 2+4+4,

2+46+46,2+66+66,2+2+4,2+2+14,2+2+71,2+2+46

4+4+5, 4+4+12, 4+4+13, 4+46+46,

5+66+66,4+4+7,5+5+66,5+48+48

12+66+66, 13+66+66, 46+46+66, 29+66+66,

30+66+66,13+48+48,14+66+66,46+66+66,48+48+66,66

+66+71

2+5+5, 2+46+46, 2+66+66

4+46+46, 5+5+30, 5+5+66, 5+46+46, 5+66+66,

4+5+5,5+48+48,5+66+66,5+5+46,7+7+46,7+46+46,

13+46+46, 13+66+66, 25+41+41, 26+41+41,

46+46+66,13+48+48,13+66+66, 48+66+66,

48+48+66,66+66+71

41, 66

41,48

2+5+30+66, 2+12+30+66, 2+14+30+66

2+2+5+66, 2+2+12+30, 2+2+12+66, 2+2+13+66,

2+5+66+66, 2+12+66+66, 2+13+66+66, 5+30+66+66,

29+30+66+66,1+1+3+7,

2+2+4+71,2+2+14+66,2+2+66+71,2+14+66+66,2+66+6

6+71,

2+5+5+30, 2+5+5+66, 2+5+46+46, 2+13+46+46,

2+46+46+46, 2+46+46+66, 2+5+66+66, 2+13+66+66,

2+66+66+71,

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Fibocom Confidential

DL CA Combination

2 intra-band (contiguous) plus

2 intra-band (contiguous)

2 intra-band (contiguous) plus

2 intra-band (non-contiguous)

3 intra-band (contiguous) plus

inter-band

Intra-band (non-contiguous)

41

Intra-band (contiguous)

2 intra-band (contiguous) plus 2

intra-band (contiguous) plus

inter-band

2 intra-band (contiguous) plus 3

inter-band

2 intra-band (contiguous) plus 2

intra-band (non-contiguous)

plus inter-band

4+46+46+46, 5+5+30+66, 5+46+46+66, 13+46+46+66,

66+46+46+46, 13+48+66+66,13+48+48+66,

5+5+66+66,5+5+46+46,7+7+46+46,48+48+66+66,

5+5+66+66,2+2+46+46,46+46+66+66,

2+2+5+5,2+2+66+66,4+4+5+5,48+48+66+66,

2+46+46+46, 3+40+40+40, 4+46+46+46, 5+46+46+46,

13+46+46+46, 25+41+41+41,

66+46+46+46,7+46+46+46,

48,41

2+46+46+46+46,

46+46+46+46+66,2+5+5+66+66,13+48+48+66+66,48+4

8+48+66+66

2+5+5+30+66

2+5+5+66+66 , 2+2+5+66+66,

2+2+13+66+66,13+48+48+66+66

3 intra-band (contiguous) plus 2

intra-band (non-contiguous)

2+2+46+46+46,

5CA

3 intra-band (contiguous) plus 2

inter-band

2+5+46+46+46, 2+13+46+46+46, 2+46+46+46+46,

2+46+46+46+66, 4+46+46+46+46, 5+46+46+46+66,

13+46+46+46+66, 46+46+46+46+66

3 intra-band (contiguous) plus 2

intra-band (contiguous)

46+46+46+66+66,5+5+46+46+46,7+7+46+46+46

4 intra-band (contiguous) plus

inter-band

2+46+46+46+46, 5+46+46+46+46, 13+46+46+46+46,

46+46+46+46+66

Intra-band (contiguous)

41,48

Intra-band (non-contiguous)

41

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Fibocom Confidential

2.4 Application Framework

The peripheral applications for L860 module are shown in Figure 2-1:

Figure 2-1 Application framework

2.5 Hardware Block Diagram

The hardware block diagram in Figure 2-2 shows the main hardware functions of L860 module, including

baseband and RF functions.

Baseband contains the followings:

 UMTS/LTE controller

 PMU

 NAND/internal LPDDR4 RAM

 Application interface

RF contains the followings:

 RF Transceiver

 RF Power/PA

 RF Front end

 RF Filter

 Antenna Connector

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ModuleSIM1USB2.0Power SupplyON/OFF# RESET#ControlEINTIndicatorHost applicationD/G(AUX1) ANTMain ANTSIM CardPCIee-SIMM2(AUX3) ANTM1(AUX2) ANTFibocom Confidential

Figure 2-2 Hardware block diagram

2.6 Antenna Configuration

L860 module support four antennas and the configuration is as below table:

Antenna Connector

Function Description

Band Configuration

Main ANT

All supported bands transmit & receive

MIMO1 ANT

4×4 MIMO supported bands receive

MIMO2 ANT

4×4 MIMO supported bands receive

Diversity & GNSS ANT

All supported bands and GNSS receive

M

M1

M2

D/G

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Baseband(LTE FDD/LTE TDD/UMTS controller)PMUM.2 Key-B 75pin interfaceRF TransceiverNANDTXMain RXDuplexerPA DCDCXB LNAUB PAMain MB FEMiDMain LB FEMiDRF SAWM (Main)ANTM1(AUX2) ANTM1(AUX3) ANTD/G(AUX1) ANTRF PartSAWGNSS SAWMain HB FEMiDTRX SAWXB LNACouplerTiplexerMB/HB FEM(4×4 MIMO)MB/HB FEM(4×4 MIMO)DivMB/HB/UB FEMDiv LB FEMGNSS LNARF SAWGNSS ExtractorTiplexerGNSS SAWDiv RX4th Div RX3rd Div RXSAWLPDDR4RAMDigRF RXTCXOVDD_IO_1V8GPIO+3.3VFULL_CARD_POWER_OFF#RESET#PCIeUSB2.0USB3.0USIM1EINTWOWWAN#LEDI2CMIPI_RFFEUART_TXUART_RXTunable ANTFibocom Confidential

3 Application Interface

3.1 M.2 Interface

The L860 module applies standard M.2 Key-B interface, with a total of 75 pins.

Pin Map

Figure 3-1 Pin map

Note:

Pin “Notch” represents the gap of the gold fingers.

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747270686664626058565452504846444240108643836343230282624222NCI2C_IRQ#(1.8V)I2C_SDA(1.8V, I2C Slave/Master)I2C_SCL(1.8V, I2C Slave/Master)+3.3V+3.3V+3.3VANT_CONFIG(1.8V)SIM1_DETECT(1.8V)COEX_TXD(1.8V)COEX_RXD(1.8V)COEX3(1.8V)RFE_RFFE_SDATANotchLED1#(3.3V OD)W_DISABLE1#(3.3/1.8V)FULL_CARD_POWER_OFF#(3.3/1.8V)+3.3VPEWAKE# (3.3V)CLKREQ# (3.3V)PERST# (3.3V)NC20USB D+GNDGND+3.3VUIM1_RESETUART_RX(1.8V, mux for GPIO)W_DISABLE2#(3.3/1.8V)ANT_TUNER_1V8(1.8V, mux for GPIO)UART_TX(1.8V, mux for ANT_TUNER_CFG/GPIO)NotchUSB3.0-Tx‐GNDDPR(3.3/1.8V)WOWWAN#(1.8V)CONFIG_0NotchNotchNotchUSB D-CONFIG_2VIO_CFGGNDCONFIG_1RESET#(1.8V)ANTCTL3(1.8V)ANTCTL2(1.8V)ANTCTL1(1.8V)ANTCTL0(1.8V)GNDREFCLKPREFCLKNGNDPERp0PERn0GNDPETp0PETn0GNDUSB3.0-Rx+USB3.0-Rx‐GNDGNDCONFIG_375737169676563615957555351494745433411112123GPIO(1.8V)NotchNotchNotchUSB3.0-Tx+NCUIM1_PWRUIM1_DATAUIM1_CLKRFE_RFFE_SCLK9753937353331292725Fibocom Confidential

Pin Definition

The pin definition is as follows:

Pin Pin Name

I/O Reset Value

Pin Description

Type

1

CONFIG_3

O NC

the WWAN – PCIe, USB3.0 interface

NC, L860 M.2 module is configured as

Power input

Power input

type

GND

GND

PI

PI

-

-

I

-

-

-

-

PU

Power Supply

Power Supply

Power Supply

Power Supply

3.3/1.8V

FULL_CARD_

POWER_OFF#

Power enable, module power on input,

internal pull up

USB D+

I/O

USB data plus, only for debug

0.3---3V

8 W_DISABLE1#

I

PD

WWAN disable, active low

3.3/1.8V

9

USB D-

I/O

USB data minus, only for debug

0.3---3V

10

LED1#

OD T

-

-

System status LED, output open drain,

CMOS 3.3V

3.3V

Power Supply

GND

Notch

Notch

Notch

Notch

Notch

Notch

Notch

Notch

+3.3V

GND

+3.3V

GND

2

3

4

5

6

7

11 GND

12 Notch

13 Notch

14 Notch

15 Notch

16 Notch

17 Notch

18 Notch

19 Notch

20 GPIO

O

PD

21 CONFIG_0

NC

the WWAN – PCIe, USB3.0 interface

GPIO(High-z)

UART_RTS (Reserved)

1.8V

NC, L860 M.2 module is configured as

type

UART_TX, MUX for

22 UART_TX

O

PD

ANT_TUNER_CONFIG/GPIO(High-z)

1.8V

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Fibocom ConfidentialPO

IO

I

I

-

I

O

O

-

I

O

I

-

I

O

O

PD

PD

-

PD

L

-

-

PU

Pin Pin Name

I/O Reset Value

Pin Description

23 WOWWAN#

O

PD

24 ANT_TUNER_1V8

PD

GPIO(High-z)

25 DPR

BodySAR detect, active low

3.3/1.8V

26 W_DISABLE2#

27 GND

28 UART_RX

29 USB3.0_TX-

O

UART_RX, MUX for GPIO(High-z)

1.8V

USB3.0 transmit data minus,

only for debug

30 UIM_RESET

O

L

SIM reset signal

1.8V/3V

31 USB3.0_TX+

32 UIM_CLK

33 GND

35 USB3.0_RX-

37 USB3.0_RX+

38 NC

39 GND

40

I2C_SCL

41 PETn0

43 PETp0

34 UIM_DATA

I/O L

SIM data input/output

1.8V/3V

36 UIM_PWR

SIM power supply, 1.8V/3V

1.8V/3V

Master I2C1 CLK

1.8V

Power Supply

42

I2C_SDA

I/O PU

Master I2C1 DATA

1.8V

44

I2C_IRQ#

O

PD

I2C1 INT, Wake up I2C HOST

1.8V

45 GND

-

-

GND

Power Supply

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Wake up host,

Reserved

1.8V output for ANT Tuner

UART_CTS (Reserved)

GNSS disable, active low,

Reserved

GND

USB3.0 transmit data plus,

only for debug

SIM clock signal

GND

USB3.0 receive data minus,

only for debug

USB3.0 receive data plus,

only for debug

NC

GND

PCIe TX differential signal

Negative

PCIe TX differential signal

Positive

Type

1.8V

Power Supply

/1.8V

3.3/1.8V

Power Supply

1.8V/3V

Power Supply

Fibocom Confidential

I

I

I

Pin Pin Name

I/O Reset Value

Pin Description

Type

46 NC

47 PERn0

48 NC

49 PERP0

PCIe RX differential signal

NC

Negative

NC

Positive

PCIe RX differential signal

Asserted to reset module PCIe

interface default. If module went into

not only PCIe interface.

Active low, internal pull up (10KΩ)

Asserted by device to request a PCIe

reference clock be available (active

clock state) in order to transmit data. It

mechanism, asserted by either host or

device to initiate an L1 exit.

Active low, internal pull up (10KΩ)

PCIe reference clock signal

Negative

Asserted to wake up system and

reactivate PCIe link from L2 to L0, it

depends on system whether supports

Active low, open drain output and

should add external pull up (100KΩ) on

platform

50 PERST#

I

PU

core dump, it will reset whole module,

3.3V

51 GND

-

-

GND

Power Supply

52 CLKREQ#

O

PU

also used by L1 PM Sub states

3.3V

53 REFCLKN

I

54 PEWAKE#

O

L

wake up functionality.

3.3V

55 REFCLKP

PCIe reference clock signal, Positive

56 RFFE_SCLK

O

PD

MIPI interface tunable ANT,

57 GND

58 RFFE_SDATA

I/O PD

MIPI interface tunable ANT,

RFFE clock

GND

RFFE data

1.8V

1.8V

Power Supply

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I

I

Pin Pin Name

I/O Reset Value

Pin Description

59 ANTCTL0

O

L

Tunable ANT CTRL0

60 COEX3

I/O PD

61 ANTCTL1

O

PD

Tunable ANT CTRL1

62 COEX_RXD

I

T

63 ANTCTL2

O

PD

Tunable ANT CTRL2

65 ANTCTL3

O

PD

Tunable ANT CTRL3

64 COEX_TXD

O

T

66 SIM1_DETECT

PD

67 RESET#

PU

Type

1.8V

1.8V

1.8V

1.8V

1.8V

1.8V

1.8V

1.8V

1.8V

Wireless coexistence between WWAN

and WIFI/BT modules, based on BT-SIG

coexistence protocol. COEX_EXT_FTA,

Reserved

Wireless coexistence between WWAN

and WIFI/BT modules, based on BT-SIG

coexistence protocol. UART receive

signal (WWAN module side), Reserved

Wireless coexistence between WWAN

and WIFI/BT modules, based on BT-SIG

coexistence protocol. UART transmit

signal (WWAN module side), Reserved

SIM1 detect, internal pull up (390KΩ),

active high

WWAN reset input, internal pull up

(10KΩ), active low

Host antenna configuration detect,

Reserved

GND, L860 M.2 module is configured

68 ANT_CONFIG

I

PD

internal pull up (100KΩ),

1.8V

69 CONFIG_1

O GND

as the WWAN – PCIe, USB3.0

-

70

+3.3V

71 GND

72

+3.3V

PI

-

PI

-

-

-

73 VIO_CFG

-

-

interface type

Power input

GND

Power input

Power Supply

Power Supply

Power Supply

Voltage indication of PCIe side band.

GND, Support PCIe Interface 3.3V.

NC, support 1.8V and compatible with

-

3.3V.

74

+3.3V

PI

-

Power input

Power Supply

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Pin Pin Name

I/O Reset Value

Pin Description

Type

75 CONFIG_2

O NC

the WWAN – PCIe, USB3.0 interface

-

NC, L860 M.2 module is configured as

Reset Value: The initial status after module reset, not the status when working.

type

 H: High Voltage Level



L: Low Voltage Level

 PD: Pull-Down

 PU: Pull-Up



T: Tristate

 OD: Open Drain

 PI: Power Input

 PO: Power Output

Note:

3.2 Power

The unused pins can be left floating.

The power interface of L860 module is shown in the following table:

Pin

Pin Name

I/O

Pin Description

2, 4, 70, 72, 74 +3.3V

PI

Power supply input

DC Parameter (V)

Minimum

Typical

Maximum

Value

3.135

Value

Value

3.3

4.4

UIM_PWR

PO

USIM power supply

UIM2_PWR

PO

USIM power supply

-

-

1.8V/3V

1.8V/3V

-

-

L860 module uses PCIe interface. According to the PCIe specification, the PCIe Vmain should be used as

the +3.3V power source, not the Vaux. The Vaux is the PCIe backup power source and it is not sufficient

as the power supply. In addition, the DC/DC power supply other than PCIe ports should not be used as

the external power cannot control the module status through the PCIe protocol.

36

48

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Power Supply

Figure 3-2:

The L860 module should be powered through the +3.3V pins, and the power supply design is shown in

Figure 3-2 Power supply design

The filter capacitor design for power supply is shown in the following table:

Recommended

Capacitance

Application

Description

Reduce power fluctuations of the module in

operation, requiring capacitors with low ESR.

 LDO or DC/DC power supply requires the

capacitor of no less than 440uF

 The capacitor for battery power supply

can be reduced to 100-200uF

Filter out the interference generated from the

clock and digital signals

Filter out low frequency band RF interference

220uFx2

Voltage-stabilizing capacitors

1uF, 100nF

Digital signal noise

39pF, 33pF

band

700/800, 850/900 MHz frequency

1500/1700/1800/1900,

18pF, 10pF,

8.2pF, 6.8pF,

3.3pF

2100/2300, 2500/2600MHz,

Filter out medium/high frequency band RF

3500/3700MHz, 5GHz frequency

interference

band

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Fibocom Confidential

The stable power supply can ensure the normal operation of L860 module. The ripple of the power supply

should be less than 300mV in design. Because module support 5CA download. When module operates

with the maximum data transfer throughput, the peak current can reach to upper 2500mA. It requests the

power source voltage should not be lower than 3.135V, otherwise module may shut down or restart. The

power supply requirement is shown in Figure 3-3:

Figure 3-3 Power supply requirement

Logic Level

The L860 module 1.8V logic level definition is shown in the following table:

Parameter

Minimum

Typical

Maximum

Unit

The L860 module 3.3V logic level definition is shown in the following table:

Parameter

Minimum

Typical

Maximum

Unit

1.71

1.3

-0.3

3.135

2.3

-0.3

1.8

1.8

0

3.3

3.3

0

1.89

1.89

0.3

3.465

3.465

0.3

V

V

V

V

V

V

1.8V logic level

3.3V logic level

VIH

VIL

VIH

VIL

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Burst transmitBurst transmitmin:3.135VPower supplyRipple≤300mVDrop VBAT≥3.135VFibocom Confidential

Power Consumption

In the condition of 3.3V power supply, the L860 power consumption is shown in the following table:

Parameter Mode

Condition

Ioff

Power off

Power supply, module power off

0.02

Typical

Current (mA)

WCDMA

DRX=8

DRX=6

DRX=9

ISleep

LTE FDD

Paging cycle #128 frames (1.28s DRx cycle)

LTE TDD

Paging cycle #128 frames (1.28s DRx cycle)

Radio Off

AT+CFUN=4, flight mode

WCDMA Data call Band 2 @+23.5dBm

IWCDMA-RMS WCDMA

WCDMA Data call Band 4 @+23.5dBm

WCDMA Data call Band 5 @+23.5dBm

LTE FDD Data call Band 2 @+23dBm

LTE FDD Data call Band 4 @+23dBm

LTE FDD Data call Band 5 @+23dBm

LTE FDD Data call Band 7 @+23dBm

LTE FDD Data call Band 12 @+23dBm

LTE FDD Data call Band 13 @+23dBm

LTE FDD Data call Band 17 @+23dBm

LTE FDD Data call Band 25 @+23dBm

LTE FDD Data call Band 26 @+23dBm

LTE FDD

LTE FDD Data call Band 14 @+23dBm

ILTE-RMS

LTE FDD Data call Band 30 @+22dBm

1050

LTE FDD Data call Band 66 @+23dBm

LTE FDD Data call Band 71 @+23dBm

LTE TDD

LTE TDD Data call Band 38 @+23dBm

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5.5

3.5

3.3

5.3

5.3

2.8

730

800

580

960

830

680

800

600

750

650

630

950

680

850

750

980

Fibocom Confidential

Parameter Mode

Condition

LTE TDD Data call Band 41 @+23dBm

LTE TDD Data call Band 48 @+21dBm

Typical

Current (mA)

620

400

Note：

channels.

The above data is the average value obtained by testing the sample for high/medium/low

In 5CA mode, the L860 power consumption is shown in the following table:

5CA Combination

Condition

Typical

(Max Data Transfer)

Current (mA)

2+46+46+46+46, 46+46+46+46+66,

2+5+5+30+66, 2+5+5+66+66,

2+2+46+46+46, 2+5+46+46+46,

2+13+46+46+46, 2+46+46+46+46,

Band 2 @+22dBm

Band 5 @+22dBm

Band 7 @+22dBm

2+46+46+46+66, 4+46+46+46+46,

Band 13 @+22dBm

5+46+46+46+66, 13+46+46+46+66,

46+46+46+66+66, 2+46+46+46+46,

5+46+46+46+46, 13+46+46+46+46,

41+41+41+41+41

Band 30 @+22dBm

Band 41 @+22dBm

Band 66 @+22dBm

1650

1300

1600

1350

1350

1000

1500

Note：

The data above is an average value tested on some samples at 25°C temperature.

3.3 Control Signal

the following table:

The L860 module provides two control signals for power on/off and reset operations. The pin is defined in

Pin Pin Name

I/O

Reset Value Function

Type

6

FULL_CARD_POWER

_OFF#

67

RESET#

I

I

PU

PU

Module power on/off input,

internal pull up

Power on: High/Floating

Power off: Low

3.3/1.8V

WWAN reset input, internal pull up

(10KΩ), active low

1.8V

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Fibocom Confidential

Pin Pin Name

I/O

Reset Value Function

Type

50

PERST#

I

PU

core dump, it will reset whole

3.3V

Asserted to reset module PCIe

interface default. If module went into

module, not only PCIe interface.

Active low, internal pull up (10KΩ)

RESET# and PERST# need to be controlled by independent GPIO, and not shared with other

devices on the host. RESET# and PERST# are sensitive signals, so they should keep away from

RF interference and be protected by GND. It should be neither near PCB edge nor route on

surface layer to avoid module abnormal reset caused by ESD.

Note：

Module Start-Up

3.3.1.1 Start-up Circuit

The FCPO# ( FULL_CARD_POWER_OFF #) pin needs an external 3.3V or 1.8V pull up for booting up.

AP (Application Processor) controls the module start-up. The recommended design is using a default PD

port to control FCPO#. It also should reserve a 100K pull down resistor on AP side. The circuit design is

shown in Figure3-4:

Figure 3-4 Circuit for module start-up controlled by AP

3.3.1.2 Start-up Timing Sequence

When power supply is ready, the PMU of module will power on and start initialization process by pulling

high FCPO# signal. After about 15s, module will complete initialization process. The start-up timing is

shown in Figure 3-5:

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Fibocom Confidential

Figure 3-5 Timing control for start-up

Index Min.

Recommended Max.

Comment

tpr

0ms

-

The delay time of power supply rising from 0V up to

3.135V. If power supply always ready, it can be ignored

ton1

8ms

20ms

RESET# should be de-asserted after FCPO#

ton2

50ms

100ms

The time delay of PERST# de-asserted after FCPO#,

PERST# must always be the last to get de-asserted

-

-

-

Module Shutdown

The module can be shut down by the following controls:

Shutdown Control Action

Condition

Software

Sending AT+CFUN=0 command

Normal shutdown (recommend)

Hardware

Pull down FCPO# pin

occurs and the software control cannot be

Only used when a hardware exception

used.

Module can be shut down by sending AT+CFUN=0 command. When the module receives the software

shutdown command, the module will start the finalization process (the reverse process of initialization),

and it will be completed after tsd time (tsd is the time which AP receive OK of “AT+CFUN=0”, if there is no

response, the max tsd is 5s). In the finalization process, the module will save the network, SIM card and

some other parameters from memory, and then clear the memory and shut down PMU. The control

timing is shown in Figure 3-6:

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+3.3VPERST#tprRESET#ton1Module StateInitializationActivation(AT Command Ready)FCPO#ton2typical 15sOFFFibocom Confidential

Figure 3-6 Shutdown timing control

Index Min.

Recommended Max.

Comment

toff1

toff2

tpd

16ms

20ms

2ms

10ms

10ms

100ms

-

-

-

RESET# should be asserted after PERST#

FCPO# should be asserted after RESET#

+3.3V power supply goes down time. If power supply is

always on, it can be ignored

Module Reset

The L860 module can reset to its initial status by pulling down the RESET# signal for more than 2ms (10ms

is recommended), and module will restart after RESET# signal is released. When customer executes

RESET# function, the PMU remains its power inside the module. The recommended circuit design is

shown in the Figure 3-7:

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+3.3VPERST#tpdRESET#Module StateFinalizationActivationFCPO#toff1tsdOFFAT+CFUN=0toff2Fibocom Confidential

Figure 3-7 Recommended design for reset circuit

 Reset timing 1st in Figure 3-8, PMU of module internal always on in reset sequence, recommend

There are two reset control timings as below:

using in FW upgrade and module recovery;

 Reset timing 2nd in Figure 3-9, PMU of module internal will be off in reset sequence (including whole

power off and power on sequence, tsd can refer section 3.3.2), recommend using in system warm boot.

Figure 3-8 Reset control timing1st

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+3.3VPERST#RESET#Module StateInitializationActivationFCPO#typical 15sBaseband resetActivationtoff2Fibocom Confidential

Index Min.

Recommended Max.

Comment

Figure 3-9 Reset control timing2nd

toff1

16ms

20ms

toff2

2ms

10ms

toff

500ms 500ms

-

-

-

-

-

RESET# should be asserted after PERST#,

FCPO# should be asserted after RESET#,

refer section 3.3.2

refer section 3.3.2

Time to allow the WWAN module to fully discharge any

residual voltages before the pin could be de-asserted

again. This is required for both Pre-OS as well as Runtime

flow

RESET# should be de-asserted after FCPO#,

The time delay of PERST# de-asserted after FCPO#,

PERST# must always be the last to get de-asserted.

refer section 3.3.1.2

ton1

8ms

20ms

refer section 3.3.1.2

ton2

50ms

100ms

PCIe Link State

Modem has the lowest power consumption in D0 L1.2 PCIe link state. D3cold L2 will increase extra about

0.5mA power consumption. CLKREQ# can assert or de-assert in D3cold L2, but CLKREQ# shouldn’t be

changed again during D3cold L2. When CLKREQ# asserts in D3cold L2, it will increase extra 0.3mA power

consumption compared with CLKREQ# de-asserted in D3cold L2. We recommend keep CLKREQ# de-

asserted in D3cold L2.

PCIe Link State PERST# CLKREQ#

Description

Power Consumption

D0 L1.2

D3cold L2

H

L

H

H

(mA)

Isleep

Isleep+0.5

Refer 3.2.3 Power Consumption

The extra 0.5mA is consumed on

PERST# pull down

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+3.3VPERST#RESET#Module StateInitializationActivationFCPO#typical 15sActivationtoffFinalizationOFFAT+CFUN=0toff2toff1ton1ton2tsdFibocom Confidential

3.3.4.1 D0 L1.2

is shown in Figure 3-10:

PCIe Link State PERST# CLKREQ#

Description

Power Consumption

(mA)

L

L

Isleep+0.8

The extra 0.3mA is consumed on

CLKREQ# pull down

Module supports PCIe goes into D0 L1.2 state in Win10 system. The D0->D0 L1.2@S0/S0ix->D0 timing

Figure 3-10 D0 L1.2 timing

3.3.4.2 D3cold L2

Module supports PCIe goes into D3cold L2 state in Win10 system. The D0->D3cold L2@S0/S0ix

->D0 timing is shown in Figure 3-11 and Figure 3-12:

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+3.3VPERST#RESET#Module StateD0 L1.2@S0/S0ixD0 L0@S0/S0ixFCPO#D0 L0@S0/S0ixCLKREQ#Fibocom Confidential

Figure 3-11 D3cold L2 timing (Host wakeup)

Figure 3-12 D3cold L2 timing (Modem wakeup)

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+3.3VPERST#RESET#Module StateD3cold L2@S0/S0ixD0 L0@S0/S0ixFCPO#D0 L0@S0/S0ixPEWAKE#Host assertHost de-assertCLKREQ#+3.3VPERST#RESET#Module StateD3cold L2@S0/S0ixD0 L0@S0/S0ixFCPO#D0 L0@S0/S0ixPEWAKE#Modem assertHost de-assertModem de-assertHost assertCLKREQ#Fibocom Confidential

Timing Application

The recommended timing application in Win10 OS is as below table:

System status

Timing Application

S0ix

D0 L1.2

Refer to section 3.3.4.1 Figure 3-10 D0 L1.2 timing

(Modem standby)

D3cold L2

Refer to section 3.3.4.2 Figure 3-11/3-12 D3cold L2 timing

S3, S4, S5

Power on

(back to S0)

Power off

(out of S0)

Refer to section 3.3.1.2 Figure 3-5 Timing control for start-up

Refer to section 3.3.2 Figure 3-6 Shutdown timing control

G3 boot

Power on

Refer to section 3.3.1.2 Figure 3-5 Timing control for start-up

Warm boot

Refer to section 3.3.3 Figure 3-9 Reset control timing2nd

Modem FW upgrade / Modem

recovery

Refer to section 3.3.3 Figure 3-8 Reset control timing1st

Intel X86 platforms must follow the table above. AMD X86 platforms should follow the table above and

meet the special request of platform itself.

The recommended timing application in Chrome/Android/Linux OS is as below table:

System status

Timing Application

Refer to section 3.3.1.2 Figure 3-5 Timing control for start-up

Refer to section 3.3.2 Figure 3-6 Shutdown timing control

Refer to section 3.3.4.1 Figure 3-10 D0 L1.2 timing /

section 3.3.4.2 Figure 3-11/12 D3cold L2 timing

Refer to section 3.3.3 Figure 3-9 Reset control timing2nd

Modem FW upgrade / Modem

Refer to section 3.3.3 Figure 3-8 Reset control timing1st

Power on

Shut down

Connect standby

Restart

recovery

3.4 PCIe Interface

L860 module supports PCIe Gen2, one lane for data transmission channel. It is also compatible with PCIe

Gen1. After L860 module is inserted into PC, PCIe interface can work with the driver, and then map a

MBIM port and a GNSS port in Win10 & Linux system. MBIM interface is used for initiating data service in

Win10 & Linux system and GNSS interface is used for receiving GNSS data.

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Fibocom Confidential

PCIe Interface Definition

Pin# Pin Name

I/O Reset Value Description

Type

41

PETn0

O

-

PCIe TX differential signal

43

PETP0

O

-

PCIe TX differential signal

47

PERn0

49

PERP0

I

I

-

-

PCIe RX differential signal

PCIe RX differential signal

53

REFCLKN

I

-

PCIe reference clock signal

55

REFCLKP

I

-

PCIe reference clock signal

Negative

Positive

Negative

Positive

Negative

Positive

-

-

-

-

-

-

50

PERST#

I

PU

52

CLKREQ#

I/O PU

Asserted to reset module PCIe interface

default. If module went into coredump, it will

reset whole module, not only PCIe interface.

3.3V

Active low, internal pull up (10KΩ)

Asserted by device to request a PCIe

reference clock be available (active clock

state) in order to transmit data. It also used by

3.3V

L1 PM Sub states mechanism, asserted by

either host or device to initiate an L1 exit.

Active low, internal pull up (10KΩ)

Asserted to wake up system and reactivate

PCIe link from L2 to L0, it depends on system

Active low, open drain output and should add

external pull up (100KΩ) on platform

54

PEWAKE# O

L

whether supports wake up functionality.

3.3V

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Fibocom Confidential

PCIe Interface Application

The reference circuit is shown in Figure 3-12:

Figure 3-12 Reference circuit for PCIe interface

L860 module supports PCIe Gen2 interface, including three differential pairs: transmit pair TXP/N,

receiving pair RXP/N and clock pair CLKP/N.

PCIe can achieve the maximum transmission rate of 5 GT/s, and must strictly follow the rules below in

PCB Layout:





mm) for AP end.

The differential signal pair lines should be parallel and equal in length.

The differential signal pair lines should be short if possible and be controlled within 15 inches (380



The impedance of differential signal pair lines is recommended to be 100Ω, and can be controlled to

80-120Ω in accordance with PCIe protocol.



Try to avoid the discontinuous reference ground, such as segment and space;

 When the differential signal lines go through different layers, the via hole of grounding signal should

be in close to that of signal, and generally, each pair of signals require 1-3 grounding signal via holes

and the lines should never cross the segment of plane.



Try to avoid bended lines and avoid introducing common-mode noise in the system, which will

influence the signal integrity and EMI of difference pair. As shown in Figure 3-13, the bending angle

of all lines should be equal or greater than 135°, the spacing between difference pair lines should be

larger than 20mil, and the line caused by bending should be greater than 1.5 times line width at least.

When a serpentine line is used for length match with another line, the bended length of each segment

should be at least 3 times the line width (≥ 3W). The largest spacing between the bended part of the

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Module sideAP sideAC CapsAC CapsPERST#CLKREQ#WAKE#PERST#(pin50)CLKREQ#(pin52)PEWAKE#(pin54)PERn0PERP0PETn0PETP0REFCLKNREFCLKPPETn0(pin41)PETP0(pin43)PERn0(pin47)PERP0(pin49)REFCLKN(pin53)REFCLKP(pin55)+3.3V/1.8V100K10KM.2 Key-B 75pin ConnectorFibocom Confidential

differential lines (S1 < 2S).

serpentine line and another one of the differential lines must be less than 2 times the spacing of normal

Figure 3-13 Requirement of PCIe line

The difference in length of two data lines in difference pair should be within 5mil, and the length match is

required for all parts. When the length match is conducted for the differential lines, the designed position

of correct match should be close to that of incorrect match, as shown in Figure 3-14. However, there is no

specific requirements for the length match of transmit pair and receiving pair, which means the length

match is only required by intra differential pair rather than inter differential pair.

Figure 3-14 Length match design of PCIe differential pair

The L860 module support dual SIM card single standby, with one built-in USIM card interface, which

3.5 USIM Interface

supports 1.8V and 3V SIM cards.

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PCIe Difference Pair 1WSS1<2S≥3W≥135°≥20milPCIe Difference Pair 2≥1.5WCorrect matchDismatched endIncorrect matchMatched endFibocom Confidential

USIM1 Pins

The USIM1 pins description is shown in the following table:

Pin Pin Name

I/O Reset Value Description

36 UIM_PWR

30 UIM_RESET

32 UIM_CLK

34 UIM_DATA

PO

-

O

O

L

L

I/O L

USIM power supply

USIM reset

USIM clock

Type

1.8V/3V

1.8V/3V

1.8V/3V

USIM data, internal pull up (4.7KΩ)

1.8V/3V

USIM card detect, internal 390K pull-up.

Active high, and high level indicates SIM

card is inserted; and low level indicates

1.8V

SIM card is detached.

66

SIM_DETECT

I

PD

USIM Interface Circuit

3.5.2.1 N.C. SIM Card Slot

The reference circuit design for N.C. (Normally Closed) SIM card slot is shown in Figure 3-15:

Figure 3-15 Reference circuit for N.C. SIM card slot

The principles of the N.C.SIM card slot are described as follows:

 When the SIM card is detached, it connects the short circuit between CD and SW pins, and drives

 When the SIM card is inserted, it connects an open circuit between CD and SW pins, and drives the

the SIM_DETECT pin low.

SIM_DETECT pin high.

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Fibocom Confidential

3.5.2.2 N.O. SIM Card Slot

The reference circuit design for N.O. (Normally Open) SIM card slot is shown in Figure 3-16:

Figure 3-16 Reference circuit for N.O. SIM card slot

The principles of the N.O.SIM card slot are described as follows:

 When the SIM card is detached, it connects an open circuit between CD and SW pins, and drives

 When the SIM card is inserted, it connects the short circuit between CD and SW pins, and drives the

the SIM_DETECT pin low.

SIM_DETECT pin high.

USIM Hot-Plug

The L860 module supports the SIM card hot-plug function, which determines whether the SIM card is

inserted or detached by detecting the SIM_DETECT pin state of the SIM card slot.

The SIM card hot-plug function can be configured by “AT+MSMPD” command, and the description for AT

command is shown in the following table:

AT Command Hot-plug Detection Function Description

AT+MSMPD=1 Enable

enabled.

Default value, the SIM card hot-plug detection function is

The module can detect whether the SIM card is inserted or not

through the SIM_DETECT pin state.

The SIM card hot-plug detect function is disabled.

AT+MSMPD=0 Disable

The module reads the SIM card when starting up, and the

SIM_DETECT status will not be detected.

After the SIM card hot-plug detection function is enabled, the module detects that the SIM card is inserted

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Fibocom Confidentialwhen the SIM_DETECT pin is high, then executes the initialization program and finish the network

registration after reading the SIM card information. When the SIM_DETECT pin is low, the module

determines that the SIM card is detached and does not read the SIM card.

SIM_DETECT is active high. It can be swapped to active low by AT CMD.

Note:

USIM Design

The SIM card circuit design should meet the EMC standards and ESD requirements with the improved

capability to resist interference, to ensure that the SIM card can work stably. The following guidelines

should be noted in design:



The SIM card slot should be placed as close as possible to the module, and away from the RF antenna,

DC/DC power supply, clock signal lines, and other strong interference sources.

The SIM card slot with a metal shielding housing can improve the anti-interference ability.

The trace length between the SIM card slot and the module should not exceed 100mm, or it could



The UIM_CLK and UIM_DATA signal lines should be isolated by GND to avoid crosstalk interference.

If it is difficult for the layout, the whole SIM signal lines should be wrapped with GND as a group at

reduce the signal quality.

least.



The filter capacitors and ESD devices for SIM card signals should be placed near to the SIM card slot,

and the ESD devices with 22-33pF capacitance should be used.

3.6 Status Indicator

The L860 module provides two signals to indicate the operating status of the module, and the status

indicator pins are shown in the following table:

Pin

Pin Name

I/O

Reset Value Pin Description

Type

10

LED1#

System status LED, drain output.

3.3V

23 WOWWAN#

Module wakes up Host (AP), reserved

1.8V

O

O

T

PD





The LED#1 signal is used to indicate the operating status of the module, and the detailed description is

LED#1 Signal

shown in the following table:

Module Status

LED1# Signal

RF function ON

Low level (LED on)

RF function OFF

High level (LED off)

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Fibocom Confidential

The LED driving circuit is shown in Figure 3-17:

Figure 3-17 LED driving circuit

The resistance of LED current-limiting resistor is selected according to the driving voltage and

Note:

the driving current.

WOWWAN#

The WOWWAN# signal is used to wake the Host (AP) when there comes the data request. The definition

of WOWWAN# signal is as follows:

Operating Mode

WOWWAN# Signal

SMS or data requests

Pull low 1s then pull high (pulse signal).

Idle/Sleep

High level

The WOWWAN# timing is shown in Figure 3-18:

Figure 3-18 WOWWAN# timing

SMS wake-up host need send AT command: AT+GTSMSFILTERWUPEN=1 to enable this

Note:

function.

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WOWWAN#1SIdle/SleepCall/SMS/DataIdle/SleepStatusFibocom ConfidentialThe L860 module provides four interrupt signals, and the pin definition is as follows:

Pin Pin Name

I/O

Pin Description

Type

Enable/Disable RF network

BodySAR detection

GNSS disable signal

Reserved

Host antenna configuration

detection

Reserved

3.3/1.8V

3.3/1.8V

3.3/1.8V

1.8V

3.7 Interrupt Control

Reset

Value

PD

PD

PD

PD

8

W_DISABLE1#

25 DPR

26 W_DISABLE2#

68

ANT_CONFIG

I

I

I

I

W_DISABLE1#

The module provides a hardware pin to enable/disable WWAN RF function, and the function can also be

controlled by the AT command. The module enters into the flight mode after the RF function is disabled.

The definition of W_DISABLE1# signal is as below table:

W_DISABLE1# Signal Function

High/Floating

WWAN function is enabled, the module exits the flight mode.

Low

WWAN function is disabled, the module enters flight mode.

The function of W_DISABLE1# is enabled by default. It can be disabled by customer’s request.

Note：

BODYSAR

The L860 module supports BodySAR function by detecting the DPR pin. The voltage level of DPR is high

by default, and when the SAR sensor detects the closing human body, the DPR signal will be pulled down.

As the result, the module then lowers down its emission power to its default threshold value, thus reducing

the RF radiation on the human body. The threshold of emission power can be set by the AT Commands.

The definition of DPR signal is shown in the following table:

DPR Signal

Function

High/Floating

The module keeps the default emission power

Low

Lower the maximum emission power to the threshold value of the module.

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ANT_CONFIG

L860 module can be configured to support dual antennas or 4 antennas by detecting the ANT_CONFIG

pin. ANT_CONFIG is an input port which is pulled high internal in default. When ANT_CONFIG is high

level, then module supports dual antennas (Main & D/G ANT). When module detects low level of

ANT_CONFIG, then module will be configured to support 4 antennas. The definition of ANT_CONFIG

signal is shown as below table:

ANT_CONFIG Signal Function

High/Floating

Support dual antennas (Main & D/G ANT)，Reserved

Support 4 antennas (Reserved)

3.8 ANT Tunable Interface

The module supports ANT Tunable interfaces with two different control modes, i.e. MIPI interface and 4bit

GPO interface. Through cooperating with external antenna adapter switch via ANT Tunable, it can flexibly

configure the bands of LTE antenna to improve the antenna’s working efficiency and save space for the

Pin Pin Name

I/O

Pin Description

Type

56

RFFE_SCLK

O

Tunable ANT control, MIPI Interface,

58

RFFE_SDATA

I/O

Tunable ANT control, MIPI Interface,

RFFE clock

RFFE data

Tunable ANT control, GPO interface,

Tunable ANT control, GPO interface,

Tunable ANT control, GPO interface,

Tunable ANT control, GPO interface,

O

O

O

O

Bit0

bit1

Bit2

Bit3

1.8V

1.8V

1.8V

1.8V

1.8V

1.8V

Low

antenna.

59

ANTCTL0

61

ANTCTL1

63

ANTCTL2

65

ANTCTL3

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O

O

O

O

3.9 Configuration Interface

The L860 module provides four pins for the configuration as the WWAN-PCIe, type M.2 module:

Pin Pin Name

I/O Reset Value

Pin Description

Type

1

CONFIG_3

21 CONFIG_0

69 CONFIG_1

75 CONFIG_2

NC

NC

NC

Internally connected to GND

-

-

-

-

The M.2 module configuration is shown in the following table:

Config_0

Config_1

Config_2

Config_3

Module Type and

(pin21)

(pin69)

(pin75)

(pin1)

Main Host Interface

Port Configuration

NC

GND

NC

NC

WWAN - PCIe Gen2

Vendor defined

Please refer to PCI Express M.2 Specification Rev1.2” for more details.

3.10 I2C Interface

The L860 module support I2C interface.

I2C Pins

Pin Pin Name

I/O Reset Value

Description

40

I2C_SCL

42

I2C_SDA

44

I2C_IRQ#

I

PU

I/O PU

O

PD

Master I2C1 CLK

Master I2C1 DATA

I2C1 INT, Wake up I2C HOST

Type

1.8V

1.8V

1.8V

Note: L860 works as a slave device.

-

-

L

-

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4 Radio Frequency

4.1 RF Interface

RF Interface Functionality

The L860 module supports four RF connectors used for external antenna connection. As the Figure 4-1

shows, “M” is for Main antenna, which is used to receive and transmit RF signal; “D/G” is for Diversity

antenna, which is used to receive the diversity RF signal. “M1” and “M2” are used for support 4x4 MIMO

data transfer.

Figure 4-1 RF connectors

RF Connector Characteristic

Rated Condition

Environment Condition

Frequency Range

DC-6GHz

Characteristic Impedance

50Ω

Temperature Range: –40°C-+85°C

RF Connector Dimension

L860 module uses standard M.2 RF connectors. The RF connector part number is 818004607

manufactured by ECT corporation, and the size is 2×2×0.6mm. The connector dimension is shown as

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following picture:

Figure 4-2 RF connector dimensions

Figure 4-3 0.81mm coaxial antenna dimensions

Figure 4-4 Schematic diagram of 0.81mm coaxial antenna connected to the RF connector

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RF Connector Assembly

Mate RF connector parallel refer Figure 4-5, do not slant mate with strong force.

To avoid damage in RF connector unmating, it is recommended using pulling JIG as Figure 4-6, and the

pulling JIG must be lifted up vertically to PCB surface (see Figure 4-7 and 4-8).

Figure 4-5 Mate RF connector

Figure 4-6 Pulling JIG

Figure 4-7 Lift up pulling JIG

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Figure 4-8 Pulling direction

4.2 Operating Band

The operating bands of L860 module are shown in the following table:

Operating Band Description

Mode

Tx (MHz)

Rx (MHz)

Band 2

Band 4

Band 5

Band 7

Band 12

Band 13

Band 14

Band 17

Band 25

Band 26

Band 29

Band 30

1900MHz

LTE FDD/WCDMA

1850-1910

1930-1990

1700MHz

LTE FDD/WCDMA

1710-1755

2110-2155

850MHz

LTE FDD/WCDMA

824-849

869-894

2600Mhz

LTE FDD

2500-2570

2620-2690

700MHz

LTE FDD

700MHz

LTE FDD

700MHz

LTE FDD

700MHz

LTE FDD

699-716

777-787

788-798

704-716

1900MHz

LTE FDD

1850-1915

1930-1995

850MHz

LTE FDD

814-849

700MHz

LTE FDD

N/A

729-746

746-756

758-768

734-746

859-894

716-728

2300MHz

LTE FDD

2305-2315

2350-2360

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Operating Band Description

Mode

Tx (MHz)

Rx (MHz)

1700MHz

LTE FDD

1710-1780

2110-2200

680MHz

LTE FDD

663-698

617-652

2600MHz

LTE TDD

2570-2620

2500MHZ

LTE TDD

2496-2690

3600MHZ

LTE TDD

3550-3700

5200MHZ

LTE TDD

N/A

5150-5925

-

-

-

-

-

-

-

-

1575.42±1.023

1602.5625±4

1561.098±2.046

1575.42±1.023

Band 66

Band 71

Band 38

Band 41

Band 48

Band 46

GPS L1

BDS

Galileo

GLONASS L1

4.3 Transmitting Power

The transmitting power for each band of L860 module is shown in the following table:

Mode

Band

3GPP Requirement (dBm) Tx Power (dBm)

Note

-

-

-

-

23.5±1

23.5±1

23.5±1

23±1

23±1

23+2/-1

23±1

23+2/-1

23+2/-1

23+2/-1

23+2/-1

23±1

23+2/-1

22±1

-

-

-

10MHz Bandwidth, 1 RB

10MHz Bandwidth, 1 RB

10MHz Bandwidth, 1 RB

10MHz Bandwidth, 1 RB

10MHz Bandwidth, 1 RB

10MHz Bandwidth, 1 RB

10MHz Bandwidth, 1 RB

10MHz Bandwidth, 1 RB

10MHz Bandwidth, 1 RB

10MHz Bandwidth, 1 RB

10MHz Bandwidth, 1 RB

Band 2

24+1.7/-3.7

WCDMA

Band 4

24+1.7/-3.7

Band 5

24+1.7/-3.7

LTE FDD

Band 13 23±2.7

Band 2

23±2.7

Band 4

23±2.7

Band 5

23±2.7

Band 7

23±2.7

Band 12 23±2.7

Band 14 23±2.7

Band 17 23±2.7

Band 25 23±2.7

Band 26 23±2.7

Band 30 23±2.7

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Band

3GPP Requirement (dBm) Tx Power (dBm)

Note

23±1

23+2/-1

23±1

23±1

25+2/-1

21±1

10MHz Bandwidth, 1 RB

10MHz Bandwidth, 1 RB

10MHz Bandwidth, 1 RB

10MHz Bandwidth, 1 RB

10MHz Bandwidth, 1 RB

10MHz Bandwidth, 1 RB

4.4 Receiver Sensitivity

Dual Antennas Receiver Sensitivity

All bands support dual antennas, the receiver sensitivity for each band of L860 module is shown in below

Mode

Band

3GPP Requirement

(dBm)

Rx Sensitivity (dBm)

Typical

Note

Band 66 23±2.7

Band 71 23+2.7/-3.2

Band 38 23±2.7

Band 41 23±2.7

Band 41

HPUE

26±2.7

Band 48 23+3/-4

LTE TDD

table:

LTE FDD

Band 2

-104.7

WCDMA

Band 4

-106.7

Band 5

-104.7

Band 2

-94.3

Band 4

-96.3

Band 5

-94.3

Band 7

-94.3

Band 12

-93.3

Band 13

-93.3

Band 14

-93.3

Band 17

-93.3

Band 25

-92.8

Band 26

-93.8

Band 29

-93.3

Band 30

-95.3

-110.6

-110

-111.4

-100.6

-101.5

-103.1

-99

-103.2

-103.1

-102.4

-103.5

-98.5

-103.0

-101

-101

BER < 0.1%

BER < 0.1%

BER < 0.1%

10MHz Bandwidth

10MHz Bandwidth

10MHz Bandwidth

10MHz Bandwidth

10MHz Bandwidth

10MHz Bandwidth

10MHz Bandwidth

10MHz Bandwidth

10MHz Bandwidth

10MHz Bandwidth

10MHz Bandwidth

10MHz Bandwidth

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Band 66

-95.8

Band 71

-93.5

Band 38

-96.3

Band 41

-94.3

Band 46

-88.5

Band 48

-95

LTE TDD

Note:

Mode

Band

3GPP Requirement

(dBm)

Rx Sensitivity (dBm)

Typical

Note

-101.5

-101.4

-100.2

-99.4

-95.5

-101.3

10MHz Bandwidth

10MHz Bandwidth

10MHz Bandwidth

10MHz Bandwidth

20MHz Bandwidth

10MHz Bandwidth

The above values are measured in dual antennas condition (Main+Diversity). For single main

antenna (without Diversity), the sensitivity will drop about 3dBm for each band of LTE.

Four Antennas Receiver Sensitivity

Some middle/high bands support four antennas. The receiver sensitivity for some middle/high bands of

L860 module is shown in below table:

Mode

Band

Middle/High

Band

3GPP Requirement

(dBm)

Rx Sensitivity

Typical (dBm)

Note

Band 2

Middle Band

-97

Band 4

Middle Band

-99

Band 7

High Band

-97

Band 25

Middle Band

-95.5

Band 30

High Band

-98

Band 66

Middle Band

-98.5

Band 41

High Band

-97

Band 48

High Band

-97.2

LTE FDD

LTE TDD

-103.5

-103.5

-103

-103

-103

-103.5

-103

-103.8

10MHz Bandwidth

10MHz Bandwidth

10MHz Bandwidth

10MHz Bandwidth

10MHz Bandwidth

10MHz Bandwidth

10MHz Bandwidth

10MHz Bandwidth

Note:

The above values are measured in four antennas condition (Main+Diversity+M1+M2). If only use

dual antennas (Main+Diversity), the sensitivity will drop about 3dBm for each band of LTE.

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4.5 GNSS

antenna.

L860 module supports GPS/GLONASS/BDS/Galileo and adopts RF Diversity and GNSS integrated

Description

Condition

Test Result

Max

Typical

GPS fixing

80mA @ -130dBm 65mA @ -130dBm

GPS tracking

80mA@ -130dBm

65mA@ -130dBm

GPS+GLONASS+

80mA @ -130dBm 65mA @ -130dBm

GPS+GLONASS+

80mA @ -130dBm 65mA @ -130dBm

GPS Sleep

3.5mA

GPS+GLONASS+

3.5mA

2mA

2mA

BDS fixing

BDS tracking

BDS Sleep

Cold start

Warm start

Hot Start

Cold start

Hot Start

45s

45s

3s

45s

45s

3s

35s / -130dBm

33s / -130dBm

1s / -130dBm

35s /-130dBm

33s/-130dBm

1s/-130dBm

GPS+GLONASS+BDS

Warm start

Tracking

-156dBm

-158dBm

Acquisition

-144dBm

-148dBm

GPS+GLONASS+BDS

Tracking

-156dBm

-158dBm

Acquisition

-144dBm

-148dBm

Current

GPS

TTFF

GPS

Sensitivity

Note:

GNSS current is tested with RF disabled at 25°C temperature.

4.6 Antenna Design

are shown in the following table:

The L860 module provides main and diversity antenna interfaces, and the antenna design requirements

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L860 Module Main Antenna Requirement

Frequency range

The most proper antenna to adapt the frequencies should be used.

Bandwidth (WCDMA)

WCDMA band 4 (1700): 445 MHz

WCDMA band 2 (1900): 140 MHz

Bandwidth (LTE)

LTE band 25 (1900):145 MHz

WCDMA band 5 (850): 70 MHz

LTE band 2 (1900): 140MHz

LTE band 4 (1700): 445MHz

LTE band 5 (850): 70 MHz

LTE band 7 (2600): 190 MHz

LTE Band 12 (700): 47 MHz

LTE Band 13 (700): 41 MHz

LTE Band 14 (700): 40 MHz

LTE Band 17 (700): 42 MHz

LTE band 26 (850): 80 MHz

LTE band 29 (700): 12 MHz

LTE band 30 (2300): 55 MHz

LTE band 66 (1700): 490MHz

LTE band 38 (2600): 50 MHz

LTE band 41 (2500): 194 MHz

LTE band 48 (3600):150MHz

LTE band 46 (5GHz): 775 MHz

GPS: 2 MHz

GLONASS: 8 MHz

BDS: 4 MHz

Galileo: 2 MHz

50Ω

> 28 dBm average power WCDMA & LTE

Bandwidth (GNSS)

Impedance

Input power

Note:

Recommended standing-wave

≤ 2:1

ratio (SWR)

carrier TRP certification fail.

ANT on B30 suggestion: Peak gain < 1dBi, for FCC EIRP requirement, Efficient > 50% for

carrier TRP requirement. If integrator doesn't follow the instruction, may cause FCC EIRP or

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5 ESD Characteristics

The module is generally not protected against Electrostatic Discharge (ESD). ESD handling precautions

that apply to ESD sensitive components should be strictly followed. Proper ESD handling procedures

must be applied throughout the processing, handling, assembly and operation of any application with

module. The ESD characteristics are shown in the following table (Temperature: 25°C, Relative Humidity:

Contact Discharge

Air Discharge

±15 kV

NA

NA

40%).

Interface

GND

Antenna Interface

Golden Finger

Note：

±8 kV

±8 kV

±2 kV

ESD performance is based on EVB-M2 development board.

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6 Structure Specification

6.1 Product Appearance

The product appearance for L860 module is shown in Figure6-1:

Figure 6-1 Module appearance

Note

The label of each module is subject to the good shipped.

6.2 Dimension of Structure

The structural dimension of the L860 module is shown in Figure 6-2:

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Figure 6-2 Dimension of structure

6.3 M.2 Interface Model

The L860 M.2 module adopts 75-pin gold finger as external interface, where 67 pins are signal pins and 8

pins are notch pins as shown in Figure 3-1. For module dimension, please refer to 6.2 Dimension of

Structure. Based on the M.2 interface definition, L860 module adopts Type 3042-S3-B interface (30x42mm,

the component maximum height on t top layer is 1.5mm, PCB thickness is 0.8mm, and KEY ID is B).

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Figure 6-3 M.2 interface model

6.4 M.2 Connector

L860 module connects with host by M.2 connector which is built in host. The recommended part number

is APCI0026-P001A manufactured by LOTES Corporation, and the dimension is shown in Figure 6-4. The

package of connector, please refer to the specification.

Figure 6-4 M.2 dimension of structure

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Storage period: Under the recommended storage conditions, the storage life is 12 months.

6.5 Storage

6.6 Packing

Note：

Tray Package

extent.

The L860 module uses the tray sealed packing, combined with the outer packing method using the hard

cartoon box, so that the storage, transportation and the usage of modules can be protected to the greatest

The module is a precision electronic product, and may suffer permanent damage if no correct

electrostatic protection measures are taken.

The L860 module uses tray package, 20 pcs are packed in each tray, with 5 trays including one empty tray

on top in each box and 5 boxes in each case. Tray packaging process is shown in Figure 6-5:

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Figure 6-5 Tray packaging process

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Tray Size

The pallet size is 315×170×6.5mm, and is shown in Figure 6-6:

Figure 6-6 Tray size (unit: mm)

DIM (Unit: mm)

ITEM

L

W

H

T

A

B

C

D

E

F

G

315.0±2.0

170.0±2.0

6.5±0.3

0.8±0.1

43.0±0.3

31.0±0.3

79.0±0.2

60.0±0.2

180.0±0.2

60.0±0.2

40.0±0.2

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