FCC ID: ZMOFG621LA LTE Module (LTE/WCDMA)

by: Fibocom Wireless Inc. latest update: 2021-03-14 model: FG621LA

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1	User Manual	Users Manual	pdf	3.17 MiB	March 11 2021 / September 08 2021	delayed release
1	Internal Photos	Internal Photos	pdf	881.81 KiB	March 11 2021 / September 08 2021	delayed release
1	External Photos	External Photos	pdf	380.68 KiB	March 11 2021 / September 08 2021	delayed release
1	Label Location	ID Label/Location Info	pdf	18.91 KiB	March 11 2021 / March 14 2021
1	label	ID Label/Location Info	pdf	38.47 KiB	March 11 2021 / March 14 2021
1	BOM	Parts List/Tune Up Info	pdf		March 11 2021	confidential
1	Block Diagram	Block Diagram	pdf		March 11 2021	confidential
1	DeclarationLetter LTEBand40 disabled	Cover Letter(s)	pdf	602.18 KiB	March 11 2021 / March 14 2021
1	FG621-LA TestRpt MPE	RF Exposure Info	pdf	651.29 KiB	March 11 2021 / March 14 2021
1	Long-term Confidentiality	Cover Letter(s)	pdf	427.91 KiB	March 11 2021 / March 14 2021
1	ModularApproval 15.212requirements	Cover Letter(s)	pdf	333.97 KiB	March 11 2021 / March 14 2021
1	Operational Description	Operational Description	pdf		March 11 2021	confidential
1	Power of Attorney Letter	Cover Letter(s)	pdf	512.41 KiB	March 11 2021 / March 14 2021
1	Schematic	Schematics	pdf		March 11 2021	confidential
1	Short-term Confidentiality	Cover Letter(s)	pdf	445.68 KiB	March 11 2021 / March 14 2021
1	TestRpt PCE LTE-1	Test Report	pdf	5.52 MiB	March 11 2021 / March 14 2021
1	TestRpt PCE LTE-2	Test Report	pdf	5.52 MiB	March 11 2021 / March 14 2021
1	TestRpt PCE LTE-3	Test Report	pdf	5.63 MiB	March 11 2021 / March 14 2021
1	TestRpt PCE LTE-4	Test Report	pdf	5.65 MiB	March 11 2021 / March 14 2021
1	TestRpt PCE LTE-5	Test Report	pdf	5.60 MiB	March 11 2021 / March 14 2021
1	TestRpt PCE LTE-6	Test Report	pdf	5.65 MiB	March 11 2021 / March 14 2021
1	TestRpt PCE LTE-7	Test Report	pdf	3.55 MiB	March 11 2021 / March 14 2021
1	TestRpt PCE WCDMA	Test Report	pdf	3.27 MiB	March 11 2021 / March 14 2021
1	Tsup PCB LTE	Test Setup Photos	pdf	292.87 KiB	March 11 2021 / September 08 2021	delayed release
1	Tsup PCB WCDMA	Test Setup Photos	pdf	198.08 KiB	March 11 2021 / September 08 2021	delayed release
1	Tune up procedure	Parts List/Tune Up Info	pdf		March 11 2021	confidential

exhibit
download
text

User Manual

Users Manual

pdf

3.17 MiB

March 11 2021 / September 08 2021

delayed release

FIBOCOM FG621-LA Series

Hardware Guide

Version: V0.0.1

Date: 2020-09-29

Applicability Type

No.

Product Model

Description

FG621-LA-00

DIV_ANT

LPDDR2 1Gb, SPI NAND 1Gb，support MAIN_ANT、

FIBOCOM FG621-LA Series Hardware Guide

Page 2 of 57

Notice

guarantee.

Trademark

Change History

Without the prior written permission of the copyright holder, any company or individual is prohibited to

excerpt, copy any part of or the entire document, or transmit the document in any form.

The document is subject to update from time to time owing to the product version upgrade or other

reasons. Unless otherwise specified, the document only serves as the user guide. All the statements,

information and suggestions contained in the document do not constitute any explicit or implicit

The trademark is registered and owned by Fibocom Wireless Inc.

Version

Author

Reviewer Approver Update Date Description

V0.0.1

Tan Lefan

Liu Ke

2020-09-29

Initial version

V0.0.2

Hu wenkai

Liu Ke

2021-01-22

CA Combo

Hu Wenkai

Jin Haibo

Tan Lefan

Jin Haibo

FIBOCOM FG621-LA Series Hardware Guide

Page 3 of 57

Contents

1 Foreword ........................................................................................................................... 7

1.1 Document Introduction ......................................................................................................... 7

1.2 Safety Precautions ............................................................................................................... 7

2 Product Overview ............................................................................................................. 9

2.1 Product Introduction ............................................................................................................. 9

2.2 Product Specification ............................................................................................................ 9

2.3 Functional Diagram ............................................................................................................ 11

2.4 Development Board ........................................................................................................... 12

3 Pin Description ............................................................................................................... 13

3.1 Pin Distribution ................................................................................................................... 13

3.2 Pin Function ....................................................................................................................... 14

4 Electrical Characteristics ............................................................................................... 21

4.1 Power ................................................................................................................................. 21

4.2 Power Supply ..................................................................................................................... 21

4.3 Power Output ..................................................................................................................... 23

4.4 Power Consumption ........................................................................................................... 23

5 Functional Interface........................................................................................................ 26

5.1 Control Interface................................................................................................................. 26

5.1.1 Power-on/Off ....................................................................................................................... 26

5.1.1.1 Power-on ........................................................................................................................................ 26

5.1.1.2 Shutdown ....................................................................................................................................... 27

5.1.2 Reset................................................................................................................................... 28

5.2 Network Status Indication Interface .................................................................................... 29

5.3 (U)SIM Card Interface ........................................................................................................ 31

5.3.1 (U)SIM Pin Definition .......................................................................................................... 31

5.3.2 (U)SIM Interface Circuit ...................................................................................................... 31

5.3.2.1 (U)SIM Card Connector with Card Detection Signal ....................................................................... 31

5.3.2.2 (U)SIM Card Connector without Detection Signal .......................................................................... 33

5.3.3 (U)SIM Hot Plug.................................................................................................................. 33

5.3.4 (U)SIM Design Requirements ............................................................................................ 34

5.4 USB Interface ..................................................................................................................... 34

5.5 UART Interface .................................................................................................................. 35

FIBOCOM FG621-LA Series Hardware Guide

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5.6 ADC Interface ..................................................................................................................... 35

5.7 I2C Interface ...................................................................................................................... 35

5.8 PCM Digital Audio Interface ............................................................................................... 36

5.8.1 Support Model .................................................................................................................... 36

5.8.2 PCM Interface Definition..................................................................................................... 36

5.8.3 PCM Interface Description.................................................................................................. 36

5.8.4 PCM Signal Description ...................................................................................................... 37

5.9 SD Interface ....................................................................................................................... 38

5.9.1 SD Pin Definition................................................................................................................. 38

5.9.2 SD Interface Routing Rules ................................................................................................ 38

5.9.3 SD Interface Application Circuit .......................................................................................... 38

5.10 SPI Interface .................................................................................................................... 39

5.11 GPIO Interface ................................................................................................................. 39

6 Low Power Consumption ............................................................................................... 41

6.1 Flight Mode ........................................................................................................................ 41

6.2 Sleep Mode ........................................................................................................................ 41

7 RF Interface ..................................................................................................................... 42

7.1 Operating Bands ................................................................................................................ 42

7.2 Transmission Power ........................................................................................................... 42

7.3 Receiving Sensitivity .......................................................................................................... 43

7.4 Antenna Design .................................................................................................................. 43

7.4.1 Antenna Indexes ................................................................................................................. 43

7.4.2 Antenna Reference Design ................................................................................................ 45

8 Reliability ......................................................................................................................... 47

8.1 Limiting Voltage Range ...................................................................................................... 47

8.1.1 Absolute Limiting Voltage ................................................................................................... 47

8.1.2 Operating Limiting Voltage ................................................................................................. 47

8.2 Ambient Temperature Range .............................................................................................. 47

8.3 Environmental Reliability Requirements ............................................................................. 48

8.4 ESD Characteristics ........................................................................................................... 48

9 Structure Specification................................................................................................... 50

9.1 Product Appearance ........................................................................................................... 50

9.2 Structural Dimension .......................................................................................................... 50

9.3 PCB Soldering Pad and Stencil Design .............................................................................. 51

FIBOCOM FG621-LA Series Hardware Guide

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9.4 SMT Patch ......................................................................................................................... 51

9.5 Packaging and Storage ...................................................................................................... 51

10 Certification ................................................................................................................... 52

11 OEM/Integrators Installation Manual ........................................................................... 52

12 Appendix ....................................................................................................................... 55

12.1 Terms and Abbreviations .................................................................................................. 55

12.2 Related Documents .......................................................................................................... 56

12.3 Reference Standards........................................................................................................ 57

12.4 Contact............................................................................................................................. 57

FIBOCOM FG621-LA Series Hardware Guide

Page 6 of 57

1 Foreword

1.1 Document Introduction

The document describes the electrical characteristics, RF performance, dimensions, and application

environment, etc. of FG621-LA series wireless module. With the assistance of the document and other

instructions, the developers can quickly understand the hardware functions of FG621-LA series module

and develop products.

1.2 Safety Precautions

By following the safety guidelines below, you can ensure your personal safety and help protect the

product and work environment from potential damage. Product manufacturers need to communicate the

following safety instructions to end users. In case of failure to comply with these safety rules, Fibocom will

not be responsible for the consequences caused by the user’s misuse.

Road safety first! When you drive, do not use the handheld devices even if it has a

hand-free feature. Please stop and call!

Please turn off the mobile device before boarding. The wireless feature of the mobile

device is not allowed on the aircraft to prevent interference with the aircraft

communication system. Ignoring this note may result in flight safety issue or even

violate the law.

When in a hospital or health care facility, please be aware of restrictions on the use of

mobile devices. Radio frequency interference may cause medical equipment to

malfunction, so it may be necessary to turn off the mobile device.

The mobile device does not guarantee that an effective connection can be made under

any circumstances, for example, when there is no prepayment for the mobile device or

the (U)SIM is invalid. When you encounter the above situation in an emergency,

remember to use an emergency call, while keeping your device turned on and in areas

where signal is strong.

Your mobile device receives and transmits RF signals when it is powered on. Radio

FIBOCOM FG621-LA Series Hardware Guide

Page 7 of 57

interference occurs when it is near televisions, radios, computers, or other electronic

devices.

explosive area.

Keep the mobile device away from flammable gases. Turn off the mobile device when

you get near to gas stations, oil depots, chemical plants or explosive workplaces. There

are potential safety hazards when operating electronic equipment in any potentially

FIBOCOM FG621-LA Series Hardware Guide

Page 8 of 57

2 Product Overview

2.1 Product Introduction

Fibocom FG621-LA series module is a CAT6 module designed based on UNISOC SL8563 platform and

can support CA network architecture. FG621-LA series module integrates core devices such as

Baseband, Memory, PMIC, Transceiver, and PA, and supports multi-format long-distance communication

modes including FDD-LTE, TDD-LTE, and WCDMA. It supports the maximum downlink rate of 300Mbps

and the maximum uplink rate of 50Mbps in CA mode. FG621-LA is designed with LGA package and is

applicable for various scenarios such as CPE, VR/AR, gateway, internet TV set-top box, and intelligent

monitoring.

2.2 Product Specification

Table 2-1 Product specification

Specification

Operating

frequency

LTE FDD: Band2,4,5,7,12,13,28,66

FG621-LA-00

LTE TDD: Band40

WCDMA/HSPA+: Band2,4,5

Intra-band

CA_2C / CA_5B / CA_7C / CA_7B / CA_12B / CA_B40C

contiguous

CA_66B / CA_66C

Intra-band

CA_2A-2A / CA_4A-4A / CA_5A-5A / CA_7A-7A / CA_12A-12A

non-contiguous

CA_B40A-B40A / CA_66A-66A

2xCA

combination

CA_B2-B4/B5/B7/B12/B13/B28/B66

CA_B4-B5/B7/B12/B13/B28

Inter-band

CA_B5-B7/B66

CA_B7-B12/B28/B66

CA_B12-B66

300Mbps DL, 50Mbps UL

260Mbps DL, 30Mbps UL

HSPA/HSPA+: 42Mbps DL, 11Mbps UL

UMTS: 384 kbps DL/384 kbps UL

Data

transmission

LTE FDD

LTE TDD

WCDMA

Power

3.4V~4.3V (3.8V recommended)

FIBOCOM FG621-LA Series Hardware Guide

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Specification

Temperature

Normal operation: -30°C~+75°C①

Extended operation: -40°C~+85°C②

Storage: -40°C~+85°C③

Power-off leakage current: ≤ 100uA

Power

consumption

(TBD)

Base current: ≤ 2.5mA

Sleep mode: ≤ 4.5mA

Idle mode: ≤ 50mA

Physical

Package: LGA 299Pin

characteristic

Size: 39.5mm×37mm×2.6 mm

Interface

Weight: About 8.3g

Antenna

Antenna: Main×1, DIV×1

(U)SIM 3.0V/1.8V

USB 2.0×1

Status Indicator

Function

interface

ADC×2

Software

Protocol stack

IPV4 and IPV6

Firmware

update

USB

UART×4, PCM, I2C, SDIO, SPI, GPIOs, RESET_N, PWRKEY

AT command

3GPP TS 27.007 and 27.005, and proprietary FIBOCOM AT

Voice service VoLTE, AMR, DTMF and caller ID

SMS service

Point-to-point MO, MT, Text and PDU modes

Note:

①

indicates that the module works normally within this temperature range, and the related

performance meets the requirements of 3GPP standards.

② indicates that the module works normally within this temperature range, and the baseband

and RF functions are normal, but some indicators may exceed the range specified in 3GPP

standards. While the temperature returns to the normal operating range of the module, all the

indicators of the module meet the requirements of 3GPP standards.

FIBOCOM FG621-LA Series Hardware Guide

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③

indicates the range of the

temperature where the module can perform storage without being

damaged or powered on.

2.3 Functional Diagram

Functional diagram shows the main hardware features of FG621-LA series module, including baseband

 USB, (U)SIM, PCM, I2C, SPI, UART, SDIO, GPIOs, ADCs

 WCDMA /LTE TDD/LTE FDD controller

and RF features.

Baseband includes:

 CPU

 PMIC



LPDDR2

 NAND

RF includes:

 RF Transceiver

 RF PA

 RF Switch

 RF filter

 Antenna

FIBOCOM FG621-LA Series Hardware Guide

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VBAT_RF

VBAT_BB

PWRKEY

RESET_N

ADCs

and use.

ANT_MAIN

ANT_DIV

TRX Blocks

26M

Transceiver

LPDDR2

NAND

Control

PMIC

Control

Baseband

VDD_EXT

USB (U)SIM PCM I2C

SPI

UART

SDIO GPIOs

STATUS

Figure 2-1 Functional diagram

2.4 Development Board

Fibocom provides EVK-FG150-00, ADP-FG621-LA-00 development board to facilitate module’s debug

FIBOCOM FG621-LA Series Hardware Guide

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3 Pin Description

3.1 Pin Distribution

FG621-LA series module is available with a total of 299 LGA pins. The top view of the pin distribution is

shown in the figure below:

Figure 3-1 Pin distribution (top view)

FIBOCOM FG621-LA Series Hardware Guide

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3.2 Pin Function

The pin function description of FG621-LA series module is shown in the following table:

Table 3-1 Pin function description

Pin#

Pin Name

I/O

Level

Description

RESET_N

PWRKEY

BT_EN*

VILmin=-0.3V

VILmax=0.5V

VIHmax=VBAT_BB

VILmin=-0.3V

VILmax=0.5V

VIHmax=VBAT_BB

VOLmax=0.45V

VOHmin=1.35V

WLAN_PWR_EN

VOHmin=1.35V

VOLmax=0.45V

USIM_GND

USIM_DET

USIM_VDD

Module reset signal,

active low, no need pull

up externally

Module power-on/off

signal, active low, no

need pull up externally

BT function enabling pin,

Reserved

WLAN power supply

enabling, Reserved

(U)SIM ground signal,

directly connected to the

main ground

Detect (U)SIM for

hot-swap

(U)SIM power supply,

the module automatically

identifies 1.8V or 3.0V

(U)SIM

USIM_CLK

(U)SIM clock signal line

USIM_RST

(U)SIM reset signal line

VILmin=-0.3V

VILmax=0.6V

VIHmin=1.2V

VIHmax=2.0V

For 1.8V (U)SIM:

Vmax=1.9V

Vmin=1.7V

For 3.0V (U)SIM:

Vmax=2.95V

Vmin=2.75V

IOmax=50mA

VOLmax=0.45V

VOHmin=1.35V

VILmin=-0.3V

VILmax=0.5V

VIHmin=1.3V

VIHmax=2.0V

For 1.8V (U)SIM:

VOLmax=0.45V

VOHmin=1.35V

For 3.0V (U)SIM:

VOLmax=0.45V

VOHmin=2.55V

For 1.8V (U)SIM:

VILmax=0.5V

VIHmin=1.3V

VOLmax=0.45V

USIM_DATA

DIO

(U)SIM data signal line

FIBOCOM FG621-LA Series Hardware Guide

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Pin#

USB_VBUS

USB plug detection

Pin Name

I/O

Description

Level

VOHmin=1.35V

For3.0V (U)SIM:

VILmax=1.0V

VIHmin=1.95V

VOLmax=0.45V

VOHmin=2.55V

Vmax=5.25V

Vmin=3.0V

Vnorm=5.0V

Conform to USB2.0

specification

Conform to USB2.0

specification

VILmin=-0.3V

VILmax=0.6V

VIHmin=1.2V

VIHmax=2.0V

USB_DM

DIO

standard

USB_DP

DIO

standard

USB_ID*

I2C_SDA

1.8V domain

pulled up inside the

I2C_SCL

1.8V domain

signal, pulled up inside

SD_VDD

SD card power supply

USB differential data

signal (-)

USB differential data

signal (+)

OTG identification

signal, Reserved

I2C interface data signal,

module

I2C interface clock

the module

SD card data signal

SD card command

signal

SD card clock signal

For 1.8V SD:

Vmax=1.9V

Vmin=1.75V

For 3.0V SD:

Vmax=3.15V

Vmin=2.75V

IOmax=400mA

For1.8V SD:

VOLmax=0.45V

VOHmin=1.4V

VILmin=-0.3V

VILmax=0.58V

VIHmin=1.3V

VIHmax=2.0V

For 3.0V SD:

VOLmax=0.35V

VOHmin=2.15V

VILmin=-0.3V

VILmax=0.7V

VIHmin=1.8V

VIHmax=3.15V

SD_DATA2

DIO

SD_DATA3

DIO

SD_DATA0

DIO

SD_DATA1

DIO

SD_CMD

SD_CLK

FIBOCOM FG621-LA Series Hardware Guide

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Pin#

Pin Name

I/O

Description

SD_ DETECT

SD card hot-swap

detection signal

VOLmax=0.45V

VOHmin=1.35V

Request to send data,

Reserved

RTS

CTS

RXD

DCD

TXD

DTR

Clear to send, Reserved

Module Receive data,

Reserved

Module output carrier

detection, Reserved

Module Transmit data,

Reserved

Module output ring

indicator

Ready, sleep mode

control, Reserved

PCM synchronization

signal

Level

VILmin=-0.3V

VILmax=0.6V

VIHmin=1.2V

VIHmax=2.0V

VILmin=-0.3V

VILmax=0.6V

VIHmin=1.2V

VIHmax=2.0V

VILmin=-0.3V

VILmax=0.6V

VIHmin=1.2V

VIHmax=2.0V

VOLmax=0.45V

VOHmin=1.35V

VOLmax=0.45V

VOHmin=1.35V

VOLmax=0.45V

VOHmin=1.35V

VILmin=-0.3V

VILmax=0.6V

VIHmin=1.2V

VIHmax=2.0V

VOLmax=0.45V

VOHmin=1.35V

VILmin=-0.3V

VILmax=0.6V

VIHmin=1.2V

VIHmax=2.0V

VILmin=-0.3V

VILmax=0.6V

VIHmin=1.2V

VIHmax=2.0V

VOLmax=0.45V

VOHmin=1.35V

VILmin=-0.3V

VILmax=0.6V

VIHmin=1.2V

VIHmax=2.0V

VOLmax=0.45V

VOHmin=1.35V

VOLmax=0.45V

VOHmin=1.35V

VOLmax=0.45V

VOHmin=1.35V

VILmin=-0.3V

VILmax=0.6V

PCM_SYNC

DIO

PCM_IN

PCM input signal

PCM_CLK

PCM clock signal

PCM_OUT

RFFE_CLK

RFFE_DATA

DIO

PCM output signal

RF MIPI clock signal,

Reserved

RF MIPI data signal,

Reserved

FIBOCOM FG621-LA Series Hardware Guide

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Pin#

107

127

136

137

138

139

140

143

144

145

Pin Name

I/O

Description

SPI_MOSI

SPI output signal

SPI_MISO

SPI input signal

85~88

VBAT_RF

SPI_CS

SPI_CLK

ANT_MAIN

ANT_DIV

DBG_RXD

AIO

DBG_TXD

SPI Chip Selection

signal

SPI clock signal

RF power input

(3.4V~4.3V)

Main antenna

Diversity antenna

DEBUG serial port

receiving

DEBUG serial port

sending

GPIO_1

DIO

GPIO

GPIO_2

DIO

GPIO

USB_BOOT

OTG_PWR_EN* DO

SLEEP_IND

COEX_UART_T

VOLmax=0.45V

VOHmin=1.35V

Emergency download,

active low,

recommended to reserve

test point

Reserved

OTG power enabling,

Sleep status indicator

LTE/WLAN shared serial

port sending signal line,

FIBOCOM FG621-LA Series Hardware Guide

Page 17 of 57

Level

VIHmin=1.2V

VIHmax=2.0V

VOLmax=0.45V

VOHmin=1.35V

VILmin=-0.3V

VILmax=0.6V

VIHmin=1.2V

VIHmax=2.0V

VOLmax=0.45V

VOHmin=1.35V

VOLmax=0.45V

VOHmin=1.35V

Vmax=4.3V

Vmin=3.4V

Vnorm=3.8V

VILmin=-0.3V

VILmax=0.6V

VIHmin=1.2V

VIHmax=2.0V

VOLmax=0.45V

VOHmin=1.35V

VOLmax=0.45V

VOHmin=1.35V

VILmin=-0.3V

VILmax=0.6V

VIHmin=1.2V

VIHmax=2.0V

VOLmax=0.45V

VOHmin=1.35V

VILmin=-0.3V

VILmax=0.6V

VIHmin=1.2V

VIHmax=2.0V

VILmin=-0.3V

VILmax=0.6V

VIHmin=1.2V

VIHmax=2.0V

VOLmax=0.45V

VOHmin=1.35V

VOLmax=0.45V

VOHmin=1.35V

Pin Name

I/O

Level

Description

Pin#

146

147

149

150

151

152

159

160

161

162

163

COEX_UART_R

NET_MODE

WLAN_EN*

WAKEUP_IN

W_DISABLE#

Reserved

LTE/WLAN shared serial

port sending signal line,

Reserved

indicate

Reserved

Module network state

Wake up WLAN module,

External device wakeup

module, active low by

default, configurable by

software

Module flight mode

control, pull up by

default, low level can

make the module enter

flight mode

Baseband power input

(3.4V~4.3V)

VILmin=-0.3V

VILmax=0.6V

VIHmin=1.2V

VIHmax=2.0V

VOLmax=0.45V

VOHmin=1.35V

VOLmax=0.45V

VOHmin=1.35V

VILmin=-0.3V

VILmax=0.6V

VIHmin=1.2V

VIHmax=2.0V

VILmin=-0.3V

VILmax=0.6V

VIHmin=1.2V

VIHmax=2.0V

VOLmax=0.45V

VOHmin=1.35V

Vmax=4.3V

Vmin=3.4V

Vnorm=3.8V

VOLmax=0.45V

VOHmin=1.35V

VILmin=-0.3V

VILmax=0.6V

VIHmin=1.2V

VIHmax=2.0V

VILmin=-0.3V

VILmax=0.6V

VIHmin=1.2V

VIHmax=2.0V

VOLmax=0.45V

VOHmin=1.35V

VILmin=-0.3V

VILmax=0.6V

VIHmin=1.2V

VIHmax=2.0V

Vnorm=2.8V

IOmax=200mA

VOLmax=0.45V

VOHmin=1.35V

I2S_MCLK

I2S output clock signal

155,156

VBAT_BB

GPIO_3

DIO

GPIO

WAKE_ON_WIR

ELESS*

WLAN chip wakeup

signal for the module,

Reserved

GPIO_4

DIO

GPIO

VDD_2V8

BT_TXD*

2.8V voltage output

Bluetooth serial port

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Pin#

164

165

166

168

169

170

171

172

173

175

Pin Name

I/O

Level

Description

BT_RTS*

VOLmax=0.45V

VOHmin=1.35V

BT_RXD*

BT_CTS*

VDD_EXT

WLAN_SLP_CL

NET_STATUS

STATUS

GPIO_5

DIO

ADC0

VILmin=-0.3V

VILmax=0.6V

VIHmin=1.2V

VIHmax=2.0V

VILmin=-0.3V

VILmax=0.6V

VIHmin=1.2V

VIHmax=2.0V

Vnorm=1.85V

IOmax=50mA

VOLmax=0.45V

VOHmin=1.35V

VOLmax=0.45V

VOHmin=1.35V

VOLmax=0.45V

VOHmin=1.35V

VOLmax=0.45V

VOHmin=1.35V

VILmin=-0.3V

VILmax=0.6V

VIHmin=1.2V

VIHmax=2.0V

Input voltage

ranged from 0 to

1.2V

Input voltage

1.2V

ADC1

ranged from 0 to

sends data signal,

Reserved

Bluetooth serial port

requests to send data

signal, Reserved

Bluetooth serial port

receives data signal,

Reserved

Bluetooth serial port

clears to send data

signal, Reserved

1.85V power output

WLAN sleep clock

signal, Reserved

Module network state

indicate (by default).

Module network state

indicate

GPIO

Analog to digital

converter input port 0

Analog to digital

converter input port 1

GND

Ground

10,13,16,17,24,30,31,35,

39,44,45,54,55,63,64,69,

70,75,76,81~84,89,90,92

~94,96~100,102~106,10

8~112,114,116~118,120

~126,128~133,141,142,1

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Pin Name

I/O

Level

Description

Pin#

48,153,154,157,158,167,

174,177,178,181,184,18

7,191,196,202~208,214~

299

4,6~9,11,12,14,15,18~23

,37,38,40,41,72,74,91,95

,101,113,115,119,134,13

5,176,179,180,182,183,1

85,186,188~190,192~19

5,197~201,209~213

Note:

Keep the unused pins floating.

Table 3-2 I/O parameter description

Type

DIO

AIO

Description

Power input

Power output

Digital input

Digital output

Digital input/output

Analog input

Analog output

Analog input/output

Open drain

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Description

Module power supply, 3.4V~4.3V,

nominal value 3.8V

Module power supply, 3.4V~4.3V,

nominal value 3.8V

Module digital level, 1.85V output,

50mA

Level output to external circuit,

2.8V output, 200mA

4 Electrical Characteristics

The following table shows the power interface of FG621-LA series module.

4.1 Power

Table 4-1 Power interface

Name

I/O

Pin#

VBAT_RF PI

85,86,87,88

VBAT_BB PI

155,156

VDD_EX

VDD_2V

168

162

4~299

Note:

VBAT_BB must be consistent.

4.2 Power Supply

GND

All GND pins must be grounded

10,13,16,17,24,30,31,35,39,44,45,54,55,63,

64,69,70,75,76,81~84,89,90,92~94,96~100,

102~106,108~112,114,116~118,120~126,12

8~133,141,142,148,153,154,157,158,167,17

4,177,178,181,184,187,191,196,202~208,21

In this document, VBAT includes VBAT_RF and VBAT_BB. The supply voltage of VBAT_RF and

FG621-LA series module needs to be powered by the VBAT pin. The recommended power design is

shown in Figure 4-1:

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Figure 4-1 Recommended power design

Power filter capacitor design is shown in the following table:

Table 4-2 Filter capacitors design of power supply

Recommended

Capacitor

Application

Description

220uF x 2

Regulating capacitor

the total capacitance should not be less than

Reduce power fluctuations during module

operation, low ESR Capacitor is required, and

440uF. The current driving capacity of VBAT

must be not less than 2.0A.

1uF,100nF

Digital signal noise

Filter clock and digital signal interference

33pF

8.2pF

850MHz/900 MHz bands

Filter low band RF interference

1800/1900/2100/2300/2500/2600

MHz bands

Filter middle/high band RF interference

The power stability can ensure the normal operation of FG621-LA series module. Special attention

requires when designing circuit that the power supply ripple limit for the module is no more than 300mV

(the circuit ESR < 100mΩ). When the module is operating in maximum power consumption, the power

voltage needs to be at least 3.4V. Otherwise, the module may power off or restart. When the module is

operating in Burst transmit state, the power limit is shown in Figure 4-2:

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Figure 4-2 Power limit

4.3 Power Output

FG621-LA series module outputs a 1.85V voltage through the VDD_EXT for the use of the internal digital

circuit of module. The voltage is the logic level of the module and can be used to indicate module

power-on/off, or for external low current (< 50mA) circuits. FG621-LA series module outputs a 2.8V level

through the VDD_2V8 for the use of the internal RF or other circuits, with an output current of < 200mA.

Leave the signal floating if no use. The logic level of VDD_EXT and VDD_2V8 is defined as follows:

Table 4-3 VDD_EXT and VDD_2V8 logic level

Parameter

VDD_EXT

VDD_2V8

Min

1.75

2.7

Typ

1.85

2.8

Max

1.95

2.9

Unit

4.4 Power Consumption

The power consumption of FG621-LA series module measured at 3.8V power supply is shown in the

following table. For AT commands used for USB sleep and wakeup, please refer to section 6.2:

Table 4-4 Power consumption

Parameter

Mode

Condition

Ioff

Power off

Power-off

Isleep

WCDMA

DRX8(USB sleep)

FDD-LTE

Paging Cycle #64(USB sleep)

FDD-LTE

Paging Cycle #256(USB sleep)

TDD-LTE

Paging Cycle #64(USB sleep)

(mA)

0.085

2.9

4.2

2.7

4.2

Average Current Typ.

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Average Current Typ.

(mA)

2.7

Parameter

Mode

Condition

TDD-LTE

Paging Cycle #256(USB sleep)

Radio Off

AT+CFUN=0(USB sleep)

DRX6(USB wakeup)

WCDMA

DRX8(USB wakeup)

Iidle

Paging Cycle #128(USB wakeup)

FDD-LTE

DRX9(USB wakeup)

Paging Cycle #32(USB wakeup)

Paging Cycle #64(USB wakeup)

Paging Cycle #256(USB wakeup)

Paging Cycle #32(USB wakeup)

Paging Cycle #64(USB wakeup)

Paging Cycle #128 USB wakeup)

Paging Cycle #256(USB wakeup)

Band2 @+23.5dBm

TDD-LTE

IWCDMA-RMS

WCDMA

Band4 @+23.5dBm

ILTE-RMS (10MHz

FDD-LTE

Band7 @+23dBm

1RB)

Band5 @+23.5dBm

Band2 @+23dBm

Band4 @+23dBm

Band5 @+23dBm

Band12 @+23dBm

Band13 @+23dBm

Band28 @+23dBm

TDD-LTE

Band40 @+23dBm

700

650

800

750

700

850

800

700

750

400

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2A-4A

4A-7A

5A-7A

7A-2A

12A-7A

13A-7A

28A-7A

40C

In 2CA mode, The maximum power consumption combination of fg621 under the maximum bandwidth is

shown in the table below.

Table 4-5 2CA power consumption

2CA Typical Combination

Condition (Tx band FRB)

Data Transfer

Typical

Current (mA)

Band 2 @+21dBm

Band 4 @+21dBm

Band 5 @+21dBm

Band 7 @+21dBm

Band 12 @+21dBm

Band 13 @+21dBm

Band 28 @+21dBm

Band 40 @+21dBm

750

700

800

750

330

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5 Functional Interface

5.1 Control Interface

following table:

Table 5-1 Control signal

Pin Name

I/O Pin#

Description

Two control signals are used to open, shut down and reset the module. Pin definition is shown in the

RESET_N

least 2.1s (3s-8s recommended), and then release it, the module is

When the module is in operating mode, pull down RESET_N for at

PWRKEY

power on, when the module is in operating mode, pull down

reset. Internally pulled up.

When the module is in power-off mode, pull down PWRKEY for at

least 1.6s (2s-3s recommended), and then release it, the module will

PWRKEY for at least 2.1s (3s-8s recommended), and then release

it, the module will power off.

5.1.1 Power-on/Off

5.1.1.1 Power-on

When FG621-LA series module is in power-off mode, pull down PWRKEY pin for at least 1.6s, the module

will power on, it is recommended to use OC/OD drive circuit to control PWRKEY pin. The OC drive

reference circuit is shown as follows:

Figure 5-1 OC drive power-on reference circuit

The other way to control PWRKEY pin is to use a button switch, a TVS (ESD9X5VL-2/TR recommended)

should be located close to the button for ESD protection. The reference circuit is shown in Figure 5-2:

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Figure 5-2 Button switch power-on reference circuit

The power-on timing is shown in the following figure:

Figure 5-3 Power-on timing

Before pulling down PWRKEY pin, make sure the VBAT voltage is stable. It is recommended that the time

interval between powering up VBAT and pulling down PWRKEY pin should be not less than 30ms. It

takes about 30s to power-on, Other operations such as power-off, reset, etc. can be performed only after

Note:

the complete power-on.

5.1.1.2 Shutdown

The module supports three shutdown modes as shown in Table 5-2.

Table 5-2 Shutdown modes

Shutdown

Mode

Shutdown Method

Low voltage

When VBAT voltage is too low or powers

shutdown

down, the module will shut down

Applicable Scenario

The module does not shut down through

normal process, i.e. does not log out from the

base station

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Shutdown Method

Applicable Scenario

Hardware

Pull down PWRKEY for at least 2.1s,

shutdown

3s~8s recommended

Hardware normal shutdown

command

AT+CPWROFF

Software normal shutdown

Shutdown

Mode

shutdown

Note:

1. When the module is working properly, do not cut off the power of the module immediately to

avoid damaging internal flash. It is strongly recommended to shut down the module by

PWRKEY pin or AT command before cutting off the power supply.

2. When using the AT command to shut down the module, make sure that the PWRKEY pin is

always at the high level after the shutdown command is executed, otherwise the module will

automatically power on again.

3. During the shutdown process, it takes about 6 seconds from the release of PWRKEY to the

complete power-off of VDD_EXT. Other operations such as power-on, reset, etc. can be

performed only after the complete power-off.

The shutdown timing is shown as follows:

Figure 5-4 Shutdown timing

5.1.2 Reset

FG621-LA series module can be reset by hardware and software.

Table 5-3 Reset modes

Reset Mode

Reset Method

Hardware reset

recommended

Software reset

Send AT command AT+CFUN=15

Pull down RESET_N pin for more than 2s, then release it, 3s~8s

Clients can control RESET_N pin by OC/OD drive circuits and button switch. The reference circuits are

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shown in Figure 5-5 and Figure 5-6, respectively:

Figure 5-5 OC driven reset reference circuit

The reset timing is shown as follows:

Figure 5-6 Button reset reference circuit

Figure 5-7 Reset timing

RESET_N is a sensitive signal, so it is recommended to add a regulator capacitor close to the

module. The PCB layout should be kept away from the RF interference and protected by Ground.

At the same time, avoid routing on the edge and surface of PCB (to avoid module reset caused

Note:

by ESD).

5.2 Network Status Indication Interface

FG621-LA series module provides three network status indicate pins. Pin 170 is network status indicator

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by default, AT commands AT+LEDCFG can switch to pin147 or pin171, table 5-4 is the pin definition.

Table 5-4 Network status indication

Pin Name

STATUS

NET_MODE

NET_STATUS

I/O

Pin#

171

147

170

Description

Network status indicator

Network status indicator(by default)

Network status indicator

Status indicator driven by network status indicator interface is used to describe the network status of the

module. FG621-LA series module network indicator is described as follow table:

Table 5-5 Network indicator light work status

Mode

Module Network Indicator

Pin Level Status

Indicator Light On/Off

Status

600ms High / 600ms Low

Quick flashing

SIM PIN

600ms on / 600ms off

Registering network (T<15S)

Description

No SIM card

Low

High

3000ms High / 75ms Low

Standby

75ms High / 75ms Low

Data link established

Slow flashing

3000ms on / 75ms off

Speed flashing

75ms on / 75ms off

Off

Voice call

Sleep

FG621-LA series modules’ network status indicator reference circuit is shown in the following figure:

Figure 5-8 Network indication light reference circuit

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FG621-LA series module has built-in (U)SIM card interface, and supports 1.8V and 3.0V (U)SIM card.

5.3 (U)SIM Card Interface

5.3.1 (U)SIM Pin Definition

(U) SIM pin definition is shown in the following table:

Table 5-6 (U)SIM pin definition

Pin Name

USIM_DET

USIM_VDD

USIM_DATA

USIM_CLK

USIM_RST

I/O

Pin#

Description

Detect (U)SIM card for Hot-plug

(U)SIM Power

(U)SIM data signal

(U)SIM clock signal

(U)SIM reset signal

5.3.2 (U)SIM Interface Circuit

5.3.2.1 (U)SIM Card Connector with Card Detection Signal

(U)SIM card connector should be selected for (U)SIM design. It is recommended to use (U)SIM card

connector with hot plug detection function (Recommended model: SIM016-8P-220P).

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Figure 5-9 (U)SIM card connector (SIM016-8P-220P)

SIM016-8P-220P card connector, DET and POL are short connected when the card is inserted, DET and

POL are disconnected when there is no card. The following is the reference design circuit. When (U)SIM

card is inserted, USIM_DET pin is in high level, when (U)SIM card is removed, USIM_DET pin is in low

level.

Figure 5-10 (U)SIM card connector with detection signal reference circuit

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5.3.2.2 (U)SIM Card Connector without Detection Signal

When using an (U)SIM card connector without detection signal, USIM_DET pin must be left floating, and

at the same time, the hot plug function should be disabled using AT command. The reference circuit is

shown in the figure below.

Figure 5-11 (U)SIM card connector without detection signal reference circuit

5.3.3 (U)SIM Hot Plug

FG621-LA series module supports (U)SIM hot plug function, and it determines the insertion and removal

of (U)SIM card by detecting the USIM_DET pin state.

The (U)SIM hot plug function can be configured by the “AT+MSMPD” command, and the AT commands

are shown in the following table:

Table 5-7 (U)SIM hot plug function configuration

AT command

Function description

(U)SIM hot plug

detection

AT+MSMPD=1 Enabled

(U)SIM hot plug detection is enabled by default.

AT+MSMPD=0 Disabled

reads the (U)SIM card upon power-on, and does not detect

(U)SIM hot plug detection function is disabled. The module

the USIM_DET state.

After the hot plug detection function of the (U)SIM card is enabled, if USIM_DET is in high level, the

module will detect the (U)SIM card insertion and execute card initialization program. After reading the

(U)SIM card information, the module will register network. When the USIM_DET is in low level, the

module detects (U)SIM card removal, and it will not read the (U)SIM card.

Note:

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The USIM_DET pin is active high by default, and can be switched to active low by AT command.

Table 5-8 USIM_DET effective level switched

AT command

Function description

AT+GTSET=”SIMPHASE”,1

Default, high level detection

AT+GTSET=”SIMPHASE”,0

Low level detection

5.3.4 (U)SIM Design Requirements

(U)SIM card circuit design should meet EMC standards and ESD requirements, and at the same time,

should improve anti-interference ability to ensure that the (U)SIM card can work stably. The design needs

to strictly follow the following rules:



(U)SIM card connector is placed as close to the module as possible, away from the RF antenna,

DCDC power, clock signal lines and other strong interference sources.



It is recommended to use (U)SIM card connector with metal shielding shell to improve



The length of signal line from the module to the (U)SIM card connector should not exceed 100mm.

anti-interference ability.

Longer signal line reduces signal quality.

 USIM_CLK and USIM_DATA signals should be ground protected to avoid mutual interference. If it is

difficult to do so, (U)SIM signals need to be ground protected as a set.



The filter capacitor and ESD device of (U)SIM card signal line should be placed close to the (U)SIM

card connector.



The total capacitance of ESD equivalent capacitor and parallel capacitor should be less than 47pF.

 USIM_DATA should be pulled up to USIM_VDD with a 10K resistor.

5.4 USB Interface

FG621-LA series modules support USB2.0, and are compatible with USB High-Speed (480Mbits/s) and

USB Full-Speed (12Mbits/s). Refer to the “Universal Serial Bus Specification 2.0” for USB Bus timing and

electrical characteristics of modules. USB pin definition is as follow:

Table 5-9 USB pin definition

I/O

Pin#

Pin Name

USB_DP

USB_DM

USB_VBUS

Note:

For more information about the USB 2.0 specification, please visit http://www.usb.org/home.

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Description

USB differential data +

USB differential data -

USB Plug detect

Since the module supports USB 2.0 High-Speed, TVS equivalent capacitance on the USB_DM/DP

differential signal line is required to be less than 1pF, and a 0.5pF TVS is recommended. It is

recommended to connect a 0Ω resistor to USB_DM/DP differential line in series.

USB_DM and USB_DP are high-speed differential signal lines, which can achieve the maximum

transmission rate of 480Mbits/s, and must follow the rules below in PCB Layout:



The impedance of USB_DM and USB_DP signal line should be controlled in 90Ω.

 USB_DM and USB_DP signal lines shall be parallel and equal in length, and avoid the

 USB_DM and USB_DP signal lines are routed on the signal layer closest to the ground layer,

right-angle route.

and the lines shall be grounded.

5.5 UART Interface

FG621-LA series module provides debug serial port, which supports 115200bps baud rate for debugging

and problem analysis. The following table is the description of debug serial port pins:

Table 5-10 Pin definition of debug serial port

Pin Name

DBG_RXD

DBG_TXD

I/O

Pin#

136

137

5.6 ADC Interface

Description

Module Receive data

Module Transmit data

FG621-LA series module supports two-channel ADC interface, 12 bit. The use of AT+MMAD command

can read the value of ADC interface. The voltage range of ADC interface is 0V~1.2V.

Table 5-11 ADC pin definition

Pin Name

ADC0

ADC1

I/O

Pin#

173

175

Description

Analog to digital converter interface 0

Analog to digital converter interface 1

Ground isolation is recommended for ADC layout to improve ADC voltage measurement

Note:

accuracy.

5.7 I2C Interface

FG621-LA series module supports one I2C interface, applying the standard I2C Specification, version 3.0.

The I2C signal has been pulled up inside the chip, so there is no need to pull it up outside.

Table 5-12 I2C pin definition

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Pin Name

I2C_SDA

I2C_SCL

I/O

Pin#

DIO

Description

I2C interface data signal, pulled up inside the module

5.8 PCM Digital Audio Interface

FG621-LA series module provides a digital audio interface (PCM) for communication with digital audio

devices such as an external Codec.

5.8.1 Support Model

Table 5-13 Support model of PCM

Product Model

Description

FG621-LA-00 series

Support

5.8.2 PCM Interface Definition

The interface signals include the transmission clock PCM_CLK, the frame synchronization signal

PCM_SYNC, and the input and output PCM_DIN/PCM_DOUT.

Table 5-14 PCM interface definition

Pin Name

PCM_SYNC

PCM_IN

PCM_CLK

PCM_OUT

I/O

5.8.3 PCM Interface Description

Table 5-15 PCM interface description

Pin#

Description

PCM data synchronization signal

PCM data input

PCM clock

PCM data output

Pin Name

Frequency Duty Cycle Coded Format Operating Mode Description

PCM_CLK

2.048MHz

50%

PCM_OUT

PCM_IN

Module serves as

PCM clock

master,

PCM data output

supporting PCM

PCM data input

as slave

PCM data

16bit

Linermono

PCM_SYNC 8KHz

Short pulse

synchronization

signal (falling edge

sampling)

FG621-LA series module adopts the above configuration by default. For any adjustment, please contact

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Fibocom technical support.

5.8.4 PCM Signal Description

(488ns).

FG621-LA series module provides PCM signal using domestic mainstream European E1 standard.

PCM_CLK is encoded by 2.048MHz clock and 16bit linear format. PCM_SYNC is an 8kHz short pulse

Figure 5-12 PCM_SYNC timing

Figure 5-13 PCM_CODEC to FG621-LA timing

Figure 5-14 FG621-LA to PCM_CODEC timing

Table 5-16 CODEC Timing Parameters

Timing

t(sync)

PCM_SYNC cycle

t(synca)

PCM_SYNC high level time

Min

–

Typ

125

488

Max

Unit

–

μs

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Timing

Min

Typ

Max

Unit

t(syncd)

PCM_SYNC low level time

124.5

t(clk)

PCM_CLK cycle

t(clkh)

PCM_CLK high level time

t(clkl)

PCM_CLK low level time

t(susync) PCM_SYNC setup time

t(sudin)

PCM_DIN setup time

t(hdin)

PCM_DIN hold time

t(pdout)

PCM_DOUT setup start time

t(zdout)

PCM_DOUT hold end time

5.9 SD Interface

–

488

244

122

–

160

–

μs

FG621-AE-00 module supports one-channel SD interface. The standard is as follows:

Physical Layer Specification version 3.0, SDIO Card Specification version 3.0

5.9.1 SD Pin Definition

SD pin definition is shown in the following table:

Table 5-17 SD pin definition

Pin Name

SD_VDD

SD_DATA0

SD_DATA1

SD_DATA2

SD_DATA3

SD_CMD

SD_CLK

SD_ DETEC

I/O

Pin#

Description

SDIO power supply, 3V by default

SDIO data signal bit0

SDIO data signal bit1

SDIO data signal bit2

SDIO data signal bit3

SDIO command signal

SDIO clock signal

SDIO hot plug detection signal

5.9.2 SD Interface Routing Rules

The length of signal lines should be equal to or less than 50mm, and the difference in the length of clock

signal and data signal lines should be equal to or less than 2mm.

5.9.3 SD Interface Application Circuit

For SD application circuit, please refer to the following figure. SD card connector detect pin is floating

when no card is inserted, and is short connected to ground when a card is inserted. Detect SD card

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insertion at low level.

Figure 5-15 FG621-LA SD reference circuit

The FG150-AE module supports 1 SPI interface, works in master mode, and the clock supports up to

I/O

Pin#

Description

SPI output signal

SPI input signal

SPI Chip Selection signal

SPI clock signal

5.10 SPI Interface

Table 5-18 SPI interface definition

50MHz.

Pin Name

SPI_MOSI

SPI_CS

SPI_CLK

5.11 GPIO Interface

shown in the following table:

Table 5-19 GPIO pin definition

FG621-AE-00 module reserves five GPIO interfaces for clients, with a voltage domain of 1.8V. Clients can

use the interfaces as needed and simply leave them floating when not in use. GPIO pin definition is

Pin Name

I/O

Pin#

Description

Instructions for Use

GPIO_1

GPIO_2

138

139

General-Purpose

I/O

Input pull-down

inside

the

Port 1

chip by default

General-Purpose

I/O

Input pull-down

inside

the

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Pin Name

I/O

Pin#

Description

Instructions for Use

GPIO_3

159

GPIO_4

161

GPIO_5

172

General-Purpose

I/O

Input pull-up inside the chip

General-Purpose

I/O

Input pull-down

inside

the

General-Purpose

I/O

Input pull-down

inside

the

chip by default

by default

chip by default

Port 2

Port 3

Port 4

Port 5

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6 Low Power Consumption

6.1 Flight Mode

Table 6-1 W_DISABLE# pin description

Pin Name

I/O

Pin#

Description

W_DISABLE#

151

up by default)

FG621-LA series module supports two ways to enter flight mode:

Table 6-2 Ways of entering flight mode

Module flight mode control (disabled and internal pulled

Hardware I/O interface button

function. Pull up or float W_DISABLE# pin (pull up by

control

default), then the module enters normal mode, pull it down,

Send “AT+GTFMODE=1” to enable flight mode control

then the module enters flight mode.

AT+CFUN=0--module enters flight mode

AT+CFUN=1--module enters normal mode

AT command control

6.2 Sleep Mode

sleep mode:

AT commands and WAKEUP_IN signal are used to set the module into sleep mode and wake up.

Sent AT+GTLPMMODE=1,X Set the effective level of the WAKEUP_IN signal that sets the module into

sleep mode. Command is effective after resetting module.

(X=0, when WAKEUP_IN pin is high level, module will enter sleep mode;

X=1, when WAKEUP_IN pin is low level, module will enter sleep mode)

AT+CSCLK=1 Enable sleep mode function.

Wake up:

module into sleep.

(X=1, when WAKEUP_IN pin is high level, module will be waked up;

X=0, when WAKEUP_IN pin is low level, module will be waked up)

The module will also be waked up by the incoming call or SMS.

The module will be waked up when the pin level of WAKEUP_IN is opposite to the level that set the

FIBOCOM FG621-LA Series Hardware Guide

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7 RF Interface

Table 7-1 Antenna interface

Pin Name

ANT_DIV

ANT_MAIN

I/O

Pin#

127

107

7.1 Operating Bands

Table 7-2 Operating band

FG621-LA series module provides two antenna interfaces, i.e., main antenna interface and diversity

antenna interface. The pin definition is shown in the following table:

Description

Diversity antenna

Main antenna

Mode

Tx (MHz)

LTE FDD/WCDMA

1850- 1910

LTE FDD/WCDMA

1710-1755

LTE FDD/WCDMA

824-849

LTE FDD

LTE TDD

698-716

777-787

703-748

1710-1780

2300-2400

Rx (MHz)

1930-1990

2110-2155

869-894

728-746

746-756

758-803

2110 - 2200

2500-2570

2620-2690

7.2 Transmission Power

The RF output power of FG621-LA series module is shown as follows:

Table 7-3 Transmission power

Mode

Tx Power (dBm)

Description

Band

Band 2

Band 4

Band 5

Band 2

Band 4

23.5±2

23±2

UL 10MHz Bandwidth, 1 RB

FIBOCOM FG621-LA Series Hardware Guide

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Band

Band 2

Band 4

Band 5

Band 7

Band 12

Band 13

Band 28

Band 66

Band 40

WCDMA

LTE FDD

Mode

Tx Power (dBm)

Description

Band

Band 5

Band 7

Band 12

Band 13

Band 28

Band 66

23±2

LTE TDD

Band 40

7.3 Receiving Sensitivity

UL 10MHz Bandwidth, 1 RB

Table 7-4 Receiving sensitivity

Mode

Band

Typical Sensitivity

Value of Main

Antenna (dBm)

Typical Sensitivity

Value of Diversity

Antenna (dBm)

Description

Band 2

-110

WCDMA

Band 4

-109.5

-110

-109

-111

-99

-98

-100

-98

-99

UL 10MHz Bandwidth, 50RB

UL 10MHz Bandwidth, 25RB,High

UL 10MHz Bandwidth, 50RB

UL 10MHz Bandwidth, 25RB,High

UL 10MHz Bandwidth, 20RB,Low

UL 10MHz Bandwidth, 25RB,High

UL 10MHz Bandwidth, 50RB

Band 5

-110.5

Band 2

-98

Band 4

-98

Band 5

-99

Band 7

-97.5

Band 12

-98

Band 13

-98

Band 28

-99

Band 66

-99

Band 40

-98

LTE

FDD

LTE

TDD

7.4 Antenna Design

7.4.1 Antenna Indexes

 Antenna Efficiency

FIBOCOM FG621-LA Series Hardware Guide

Page 43 of 57

Antenna efficiency is the ratio of antenna input power to radiated power. Due to the antenna’s return loss,

material loss, and coupling loss, the radiated power is always lower than the input power. Antenna

S11 indicates that the matching degree of the antenna’s 50Ω impedance, which affects the antenna

efficiency to a certain extent. This indicator can be measured using VSWR test. S11<-10dB is

efficiency >40% (-4dB) is recommended.

 S11 or VSWR

recommended.

 Polarization

Linear polarization is recommended.

 Radiation Pattern

Polarization is the rotation direction of the electric field in the maximum radiation direction of the antenna.

Radiation pattern refers to the antenna’s electromagnetic field strength in the far field in all directions.

Half-wave dipole antenna is the most suitable terminal antenna. For built-in antenna, PIFA antennas or

IFA antennas are recommended:

Antenna area: 6mm high*10mm wide*100mm long.

Antenna radiation direction: Omni_directional (omnidirectional).

 Gain and Directivity

Gain is a collection of antenna benefits and antenna directivity.

Recommended antenna gain ≤2.5dBi.



Interference

Antenna directivity refers to the electromagnetic field strength of electromagnetic wave in all directions.

In addition to the antenna performance, other interferences on the PCB also may affect the performance

of the module. In order to ensure the high performance of the module, interference must be controlled.

Suggestions: For example, LCD, CP, FPC routing, audio circuit, power supply should be as far from the

antenna as possible, and make the appropriate isolation and shielding, or filtering on the path.

It must use the most suitable antenna to adapt to the relevant frequency



Antenna Index Requirements

Table 7-5 Main antenna requirements

FG621-LA series module Main Antenna Requirements

Frequency range

band

WCDMA band 2 (1900): 140 MHz

Bandwidth (WCDMA)

WCDMA Band 4(2100): 450 MHz

WCDMA band 5 (850): 70 MHz

Bandwidth (LTE)

LTE band 2(1900): 140 MHz

FIBOCOM FG621-LA Series Hardware Guide

Page 44 of 57

FG621-LA series module Main Antenna Requirements

LTE Band 4(2100): 450 MHz

LTE Band 5(850): 70 MHz

LTE Band 7(2600): 190 MHz

LTE Band 12(700): 48 MHz

LTE Band 13(800): 21 MHz

LTE Band 28(700):100 MHz

LTE Band 66(2100): 490 MHz

LTE Band 40(2300): 100 MHz

Input power

> 25dBm average power for WCDMA & LTE

Impedance

Standing wave ratio

≤ 2:1

recommended

7.4.2 Antenna Reference Design

The antenna is a sensitive device and is easily affected by the external environment. For example, the

position of the antenna, the space it occupies, and the surrounding ground all may affect antenna

performance. In addition, the RF cable connecting the antenna, and the position of the fixed antenna also

may affect antenna performance. The three-way antenna of FG621-LA series module adopts the pad-out

way. It is recommended that clients use the U.FL-R-SMT-1 antenna connector and the matching RF

adapter cable. Figure 7-1 is the reference circuit design for the main and diversity antennas:

ANT_MAIN

Module

ANT_DIV

1.5nH

0Ω

Main Antenna

DIV Antenna

Figure 7-1 Reference circuit for main and diversity antennas

Note:

transmission cable is 50Ω.

 All matches must be placed close to the antenna to make sure the characteristic impedance of

FIBOCOM FG621-LA Series Hardware Guide

Page 45 of 57

 Since the antenna cable loss should be less than 0.3dB, keep PCB routing as short as possible.

 PCB LAYOUT should be as straight as possible to avoid vias and layers, and avoid right-angle

 PCB routing should have a good reference ground to avoid other signal line from approaching

and acute-angle routing.

the antenna.

 A complete ground level is recommended as a reference ground.

 Strengthen the connection between the ground around the antenna and the main ground.

 The equivalent capacitance of the TVS should be less than 0.5pF.

 Refer to FIBOCOM Design Guide_RF Antenna for specific design details.

FIBOCOM FG621-LA Series Hardware Guide

Page 46 of 57

8 Reliability

8.1 Limiting Voltage Range

which the module will have an abnormal performance.

8.1.1 Absolute Limiting Voltage

Table 8-1 Absolute limiting voltage range

Parameter Description

VBAT

Power supply

Level power supply voltage of digital

GPIO

I/O

8.1.2 Operating Limiting Voltage

Table 8-2 Operating limiting voltage

The limiting voltage includes the absolute limiting voltage and the operating limiting voltage. The absolute

limiting voltage is the maximum voltage that the module can bear, beyond which the module may be

damaged. The operating limiting voltage is the normal operating voltage range of the module, beyond

The absolute limiting voltage range of FG621-LA series module is shown as follow.

Min

-0.3

Typ

3.8

Max

4.7

-0.3

1.85

2.05

Unit

Logic low level

Logic high level

Signal

Min

Digital input

-0.3

Digital output -

Parameter

I/O

VBAT

Max

0.6

0.45

Min

3.4

Min

1.2

1.35

Typ

3.8

Max

2.1

Max

4.3

USIM_VDD

1.7/2.75

1.8/2.85

1.9/3.05

8.2 Ambient Temperature Range

Unit

The FG621-LA series module is recommended to operate at -30 ~+75 ambient temperature. When

℃

the module is operating within the limited operating temperature range, some RF indexes may exceed the

limit, so the module application terminal should consider temperature control measures. The module

application terminal is recommended to be stored in certain temperature conditions. Modules may not

operate or may be damaged beyond this range.

FIBOCOM FG621-LA Series Hardware Guide

Page 47 of 57

Table 8-3 Ambient temperature range

Temperature

Operating temperature

Min

-30

Limited operating temperature

-40

Storage temperature

-40

Typ

Max

Unit

℃

8.3 Environmental Reliability Requirements

The module is required to be able to power-on, the function is normal, and the performance meets the

standard, after the following test items.

Table 8-4 Environmental reliability requirements

Test Item

Test Condition

Rapid temperature change test

85/-40 ,15 /min,500C

℃ ℃

Sinusoidal vibration test

5-500Hz,3g

Salt spray test

Neutral salt spray,24Hr

Temperature shock test

85/-40 ,500C℃

Alternating test

25-70 ,93%,24H

℃

r,14C

Random vibration test

5-500Hz,4Grms

Mechanical shock test

High temperature operating test

Low temperature operating test

100G,11ms

85 ,72H℃

-40 ,72H℃

Connector life test

Power offset test

HT/HH/HV->HT/LH/HV->LT/HV->HT/HH/LV->HT/LH/LV ->LT/LV

Umin Oper(3min)/Umax Oper(3min), 1000 C

High temperature and humidity test 85 ,85%rh,1000H

℃

8.4 ESD Characteristics

Although the design of FG621-LA series module has considered the ESD issues and provided ESD

protection, the ESD issue may occur in the transport and secondary development, so developers should

consider ESD protection for the final product. In addition to considering anti-static treatment for packaging,

please refer to the recommended circuit for interface design in the document for client’s application.

Refer to the following table for the ESD allowable discharge range of FG621-LA series module:

FIBOCOM FG621-LA Series Hardware Guide

Page 48 of 57

Table 8-5 ESD allowable discharge range

Part

VBAT, GND

Antenna interface

Other interface

±10KV

±8KV

±1KV

Air Discharge

Contact Discharge

±5KV

±4KV

±0.5KV

FIBOCOM FG621-LA Series Hardware Guide

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9 Structure Specification

9.1 Product Appearance

The product appearance of FG621-LA series module is shown in Figure 9-1:

Figure 9-1 Product appearance

9.2 Structural Dimension

The structural dimension of FG621-LA series module is shown in Figure 9-2:

Figure 9-2 Structural dimension (in mm)

FIBOCOM FG621-LA Series Hardware Guide

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9.3 PCB Soldering Pad and Stencil Design

For PCB soldering pad and stencil design, please refer to FIBOCOM FG621 Series SMT Design Guide.

For SMT production process parameters and related requirements, please refer to FIBOCOM FG621

9.4 SMT Patch

Series SMT Design Guide.

9.5 Packaging and Storage

For packaging and storage, please refer to FIBOCOM FG621 Series SMT Design Guide.

FIBOCOM FG621-LA Series Hardware Guide

Page 51 of 57

10 Certification

FG621-LA series module certification is shown as follow:

Table 10-1 Certification

Certificate

HF, ROHS, FCC

FG621-LA Series Module

FG621-LA-00

For more information, please visit Fibocom website: http://www.fibocom.com/

11 OEM/Integrators Installation Manual

Important Notice to OEM integrators

1. This module is limited to OEM installation ONLY.

2. This module is limited to installation in fixed applications, according to Part 2.1091(b).

3. The separate approval is required for all other operating configurations, including portable

configurations with respect to Part 2.1093 and different antenna configurations

4. For FCC Part 15.31 (h) and (k): The host manufacturer is responsible for additional testing to verify

compliance as a composite system. When testing the host device for compliance with Part

15 Subpart B, the host manufacturer is required to show compliance with Part 15 Subpart B while the

transmitter module(s) are installed and operating. The modules should be transmitting and the evaluation

should confirm that the module's intentional emissions are compliant (i.e. fundamental and out of band

emissions). The host manufacturer must verify that there are no additional unintentional emissions other

than what is permitted in Part 15 Subpart B or emissions are complaint with the transmitter(s) rule(s).

The Grantee will provide guidance to the host manufacturer for Part 15 B requirements if needed.

Important Note

notice that any deviation(s) from the defined parameters of the antenna trace, as described by the

instructions, require that the host product manufacturer must notify to Fibocom that they wish to change

the antenna trace design. In this case, a Class II permissive change application is required to be filed

by the USI, or the host manufacturer can take responsibility through the change in FCC ID (new

application) procedure followed by a Class II permissive change application.

End Product Labeling

When the module is installed in the host device, the FCC ID label must be visible through a window on the

final device or it must be visible when an access panel, door or cover is easily re-moved. If not, a second

label must be placed on the outside of the final device that contains the following text:

FIBOCOM FG621-LA Series Hardware Guide

Page 52 of 57

“Contains FCC ID: ZMOFG621LA”

The FCC ID can be used only when all FCC compliance requirements are met.

Antenna Installation

(1) The antenna must be installed such that 20 cm is maintained between the antenna and users,

(2) The transmitter module may not be co-located with any other transmitter or antenna.

(3) Only antennas of the same type and with equal or less gains as shown below may be used with this

module. Other types of antennas and/or higher gain antennas may require additional authorization for

operation.

Antenna

WCDMA

LTE

LTE B7 LTE B12 LTE

LTE

type

Fixed

Internal

1.0 dBi

1.1 dBi

-1.0 dBi

1.0

-1.0

2.1 dBi

-1.0 dBi

-0.8

-0.9

1.1

dBi

B13

B28

B40

B66

dBi

2.9

dBi

1.1

dBi

In the event that these conditions cannot be met (for example certain laptop configurations or co-location

with another transmitter), then the FCC authorization is no longer considered valid and the FCC ID cannot

be used on the final product. In these circumstances, the OEM integrator will be responsible for

re-evaluating the end product (including the transmitter) and obtaining a separate FCC authorization.

Manual Information to the End User

The OEM integrator has to be aware not to provide information to the end user regarding how to install or

remove this RF module in the user’s manual of the end product which integrates this module. The end

user manual shall include all required regulatory information/warning as show in this manual.

Federal Communication Commission Interference Statement

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:

(1) This device may not cause harmful interference, and (2) this device must accept any interference

received, including interference that may cause undesired operation.

This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant

to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful

interference in a residential installation. This equipment generates, uses and can radiate radio frequency

energy and, if not installed and used in accordance with the instructions, may cause harmful interference

to radio communications. However, there is no guarantee that interference will not occur in a particular

installation. If this equipment does cause harmful interference to radio or television reception, which can

be determined by turning the equipment off and on, the user is encouraged to try to correct the

FIBOCOM FG621-LA Series Hardware Guide

Page 53 of 57

interference by one of the following measures:

- Reorient or relocate the receiving antenna.

- Increase the separation between the equipment and receiver.

- Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.

- Consult the dealer or an experienced radio/TV technician for help.

Any changes or modifications not expressly approved by the party responsible for compliance could void

the user's authority to operate this equipment. This transmitter must not be co-located or operating in

conjunction with any other antenna or transmitter.

List of applicable FCC rules

Approval.

This module has been tested and found to comply with part 22, part 24, part 27 requirements for Modular

The modular transmitter is only FCC authorized for the specific rule parts (i.e., FCC transmitter

rules) listed on the grant, and that the host product manufacturer is responsible for compliance to

any other FCC rules that apply to the host not covered by the modular transmitter grant of

certification. If the grantee markets their product as being Part 15 Subpart B compliant (when it also

contains unintentional-radiator digital circuity), then the grantee shall provide a notice stating that

the final host product still requires Part 15 Subpart B compliance testing with the modular

transmitter installed.

This device is intended only for OEM integrators under the following

conditions: (For module device use)

1) The antenna must be installed such that 20 cm is maintained between the antenna and users, and

2) The transmitter module may not be co-located with any other transmitter or antenna.

As long as 2 conditions above are met, further transmitter test will not be required. However, the

OEM integrator is still responsible for testing their end-product for any additional compliance

requirements required with this module installed.

Radiation Exposure Statement

This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment.

This equipment should be installed and operated with minimum distance 20 cm between the radiator &

your body.

FIBOCOM FG621-LA Series Hardware Guide

Page 54 of 57

HSDPA

High Speed Down Link Packet Access

12 Appendix

12.1 Terms and Abbreviations

Table 12-1 Terms and abbreviation

Abbreviation

Definition

AMR

bps

EGSM

DRX

FDD

Imax

LED

LTE

PCB

PDU

RMS

RTC

SMS

Adaptive Multi-rate

Bits Per Second

Extended GSM900 Band

Discontinuous Reception

Frequency Division Duplexing

Maximum Load Current

Light Emitting Diode

Long Term Evolution

Mobile Equipment

Mobile Station

Mobile Terminated

Printed Circuit Board

Protocol Data Unit

Radio Frequency

Root Mean Square

Real Time Clock

Receive

Short Message Service

Terminal Equipment

FIBOCOM FG621-LA Series Hardware Guide

Page 55 of 57

TDD

UART

UMTS

Vmax

Vnorm

Vmin

VIHmin

VILmax

VILmin

VImax

VImin

Abbreviation

Definition

Transmitting Direction

Time Division Duplexing

Universal Asynchronous Receiver & Transmitter

Universal Mobile Telecommunications System

(U)SIM

(Universal) Subscriber Identity Module

VIHmax

Maximum Input High Level Voltage Value

Maximum Voltage Value

Normal Voltage Value

Minimum Voltage Value

Minimum Input High Level Voltage Value

Maximum Input Low Level Voltage Value

Minimum Input Low Level Voltage Value

Absolute Maximum Input Voltage Value

Absolute Minimum Input Voltage Value

VOHmax

Maximum Output High Level Voltage Value

VOHmin

Minimum Output High Level Voltage Value

VOLmax

Maximum Output Low Level Voltage Value

VOLmin

Minimum Output Low Level Voltage Value

VSWR

Voltage Standing Wave Ratio

WCDMA

Wideband Code Division Multiple Access

12.2 Related Documents

 FIBOCOM Design Guide_RF Antenna

 FIBOCOM ADP-FG621 User Guide

 FIBOCOM FG621 Series AT Commands

FIBOCOM FG621-LA Series Hardware Guide

Page 56 of 57

 FIBOCOM EVK-FG150-00 User Guide

 FIBOCOM FG621 Series SMT Design Guide

12.3 Reference Standards

The design of this product complies with the following standards:

 3GPP TS 51.010-1 V10.5.0: Mobile Station (MS) conformance specification, Part 1: Conformance

 3GPP TS 34.121-1 V10.8.0: User Equipment (UE) conformance specification, Radio transmission

and reception (FDD), Part 1: Conformance specification

 3GPP TS 34.122 V10.1.0: Technical Specification Group Radio Access Network, Radio transmission

specification

and reception (TDD)

 3GPP TS 36.521-1 V10.6.0: User Equipment (UE) conformance specification, Radio transmission

and reception, Part 1: Conformance testing

 3GPP TS 21.111 V10.0.0: USIM and IC card requirements

 3GPP TS 51.011 V4.15.0: Specification of the Subscriber Identity Module -Mobile Equipment

 3GPP TS 31.102 V10.11.0: Characteristics of the Universal Subscriber Identity Module (USIM)

 3GPP TS 31.11 V10.16.0: Universal Subscriber Identity Module (USIM) Application Toolkit (USAT)

 3GPP TS 36.124 V10.3.0: Electro Magnetic Compatibility (EMC) requirements for mobile terminals

(SIM-ME) interface

application

and ancillary equipment

 3GPP TS 27.007 V10.0.8: AT command set for User Equipment (UE)

 3GPP TS 27.005 V10.0.1: Use of Data Terminal Equipment - Data Circuit terminating Equipment

(DTE - DCE) interface for Short Message Service (SMS) and Cell Broadcast Service (CBS)

12.4 Contact

Fibocom website: http://www.fibocom.com/

Community, Xili Street, Nanshan District, Shenzhen

TEL: +86 755-26733555

Fax: +86 755-26520841

HQ Address: 10-14th Floor, Building A, Building 6, Shenzhen International Innovation Valley, Xili

FIBOCOM FG621-LA Series Hardware Guide

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Applicant/Grantee FCC ID:

Fibocom Wireless Inc. /ZMO ZMOFG621LA Request for Modular Approval Request for Limited Modular Approval Section 15.212 Modular Transmitters Requirements EUT Conditions Comply (Y/N) Single Modular Approval Requirements The radio portion of this module is shielded, please see exhibition external photos. The module has buffer modulation/data inputs. The module has its own power supply regulation. Please see the schem.pdf The requirements of antenna connector and spurious emission have been fulfilled. Please refer to the Test Report exhibition. Please refer to the Setup Photo exhibition for the stand-alone test configuration. Y Y Y Y Y 1 2 3 4 5 The radio elements of the modular transmitter must have their own shielding. The physical crystal and tuning capacitors may be located external to the shielded radio elements. The modular transmitter must have buffered modulation/data inputs (if such inputs are provided) to ensure that the module will comply with Part 15 requirements under conditions of excessive data rates or over-modulation. The modular transmitter must have its own power supply regulation. The modular transmitter must comply with the antenna and transmission system requirements of Sections 15.203, 15.204(b) and 15.204(c). The antenna must either be permanently attached or employ a unique antenna coupler (at all connections between the module and the antenna, including the cable). The professional installation provision of Section 15.203 is not applicable to modules but can apply to limited modular approvals under paragraph (b) of this section. The modular transmitter must be tested in a stand-alone configuration, i.e., the module must not be inside another device during testing for compliance with Part 15 requirements. Unless the transmitter module will be battery powered, it must comply with the AC line conducted requirements found in Section 15.207. AC or DC power lines and data input/output lines connected to the module must not contain ferrites, unless they will be marketed with the module (see Section 15.27(a)). The length of these lines shall be the length typical of actual use or, if that length is unknown, at least 10 centimeters to insure that there is no coupling between the case of the module and supporting 6 7 equipment. Any accessories, peripherals, or support equipment connected to the module during testing shall be unmodified and commercially available

(see Section 15.31(i)). The modular transmitter must be equipped with either a permanently affixed label or must be capable of electronically displaying its FCC identification number.

(A) If using a permanently affixed label, the modular transmitter must be labeled with its own FCC identification number, and, if the FCC identification number is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. This exterior label can use wording such as the following: Contains Transmitter Module FCC ID: XYZMODEL1 or Contains FCC ID:

XYZMODEL1. Any similar wording that expresses the same meaning may be used. The Grantee may either provide such a label, an example of which must be included in the application for equipment authorization, or, must provide adequate instructions along with the module which explain this requirement. In the latter case, a copy of these instructions must be included in the application for equipment authorization.

(B) If the modular transmitter uses an electronic display of the FCC identification number, the information must be readily accessible and visible on the modular transmitter or on the device in which it is installed. If the module is installed inside another device, then the outside of the device into which the module is installed must display a label referring to the enclosed module. This exterior label can use wording such as the following:

Contains FCC certified transmitter module(s). Any similar wording that expresses the same meaning may be used. The user manual must include instructions on how to access the electronic display. A copy of these instructions must be included in the application for equipment authorization. The modular transmitter must comply with any specific rules or operating requirements that ordinarily apply to a complete transmitter and the manufacturer must provide adequate instructions along with the module to explain any such requirements. A copy of these instructions must be included in the application for equipment authorization. The Module will be labeled with its own FCC ID, and the instruction on the labeling rule of the end product has been stated in the User Manual of this module. Please refer to the Label and User Manual exhibition. Y The required FCC rule has been fulfilled and all the instructions for maintaining compliance have been clearly stated in the User Manual. Y 8 The modular transmitter must comply with any applicable RF exposure requirements in its final configuration. Please refer exhibition RF Exposure for the compliance of MPE RF exposure rule. Y _________________________________ Contact Person: Lucy Liu E-mail: lucy.liu@fibocom.com

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text

TestRpt PCE LTE-6

Test Report

pdf

5.65 MiB

March 11 2021 / March 14 2021

exhibit
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text

TestRpt PCE LTE-7

Test Report

pdf

3.55 MiB

March 11 2021 / March 14 2021

exhibit
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text

TestRpt PCE WCDMA

Test Report

pdf

3.27 MiB

March 11 2021 / March 14 2021

exhibit
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text

Tsup PCB LTE

Test Setup Photos

pdf

292.87 KiB

March 11 2021 / September 08 2021

delayed release

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Tsup PCB WCDMA

Test Setup Photos

pdf

198.08 KiB

March 11 2021 / September 08 2021

delayed release

		frequency	equipment class	purpose
1	2021-03-14	2510 ~ 2560	PCB - PCS Licensed Transmitter	Original Equipment

Application Forms

app s	Applicant Information
1	Effective	2021-03-14
1	Applicant's complete, legal business name	Fibocom Wireless Inc.
1	FCC Registration Number (FRN)	0020891057
1	Physical Address	1101,Tower A, Building 6, Shenzhen International
1		ShenZhen, N/A
1		China

app s	TCB Information
1	TCB Application Email Address	b******@phoenix-testlab.de
1	TCB Scope	B1: Commercial mobile radio services equipment in the following 47 CFR Parts 20, 22 (cellular), 24,25 (below 3 GHz) & 27

app s	FCC ID
1	Grantee Code	ZMO
1	Equipment Product Code	FG621LA

app s	Person at the applicant's address to receive grant or for contact
1	Name	L****** L******
1	Title	Certification Manager
1	Telephone Number	+8675********
1	Fax Number	+86-7********
1	E-mail	l******@fibocom.com

app s	Technical Contact
		n/a

app s	Non Technical Contact
		n/a

app s	Confidentiality (long or short term)
1	Does this application include a request for confidentiality for any portion(s) of the data contained in this application pursuant to 47 CFR § 0.459 of the Commission Rules?:	Yes
1	Long-Term Confidentiality Does this application include a request for confidentiality for any portion(s) of the data contained in this application pursuant to 47 CFR § 0.459 of the Commission Rules?:	Yes
1	If so, specify the short-term confidentiality release date (MM/DD/YYYY format)	09/08/2021
	if no date is supplied, the release date will be set to 45 calendar days past the date of grant.

app s	Cognitive Radio & Software Defined Radio, Class, etc
1	Is this application for software defined/cognitive radio authorization?	No
1	Equipment Class	PCB - PCS Licensed Transmitter
1	Description of product as it is marketed: (NOTE: This text will appear below the equipment class on the grant)	LTE Module (LTE/WCDMA)
1	Related OET KnowledgeDataBase Inquiry: Is there a KDB inquiry associated with this application?	No
1	Modular Equipment Type	Single Modular Approval
1	Purpose / Application is for	Original Equipment
1	Composite Equipment: Is the equipment in this application a composite device subject to an additional equipment authorization?	Yes
1	Related Equipment: Is the equipment in this application part of a system that operates with, or is marketed with, another device that requires an equipment authorization?	No
1	Grant Comments	Single Module approval is filing. Output power Listed is maximum RMS Conducted Power. Module supports WCDMA Band 2/4/5 and LTE (QPSK, 16QAM) Band 2/4/5/7/12/13/66. This module is designed for fixed device application and only documented Antenna and permitted gain can be used in OEM installation. Use of additional antenna(s) are subject to the requirements of 15.204(c)(4). Modular Approval for mobile RF Exposure conditions. OEM integrators must be provided with antenna installation instructions to satisfy RF exposure compliance. the antenna(s) used for this transmitter must be installed to provide a separation distance of at least 20cm from all persons. This grant is valid only when the device is sold to OEM integrators and the OEM integrators are instructed to ensure that the end user has no manual instructions to remove or install the device. The Maximum antenna gain 2.1 dBi.
1	Is there an equipment authorization waiver associated with this application?	No
1	If there is an equipment authorization waiver associated with this application, has the associated waiver been approved and all information uploaded?	No

app s	Test Firm Name and Contact Information
1	Firm Name	Sporton International (Kunshan) Inc.
1	Name	J**** T**
1	Telephone Number	+86 0********
1	E-mail	J******@sporton.com.tw

Equipment Specifications
	Line	Rule Parts	Grant Notes	Lower Frequency	Upper Frequency	Power Output	Tolerance	Emission Designator	Microprocessor Number
1	1	22H		826.4	846.6	0.2084	0.0016 ppm	4M15F9W
1	2	22H		829	844	0.1923	0.0011 ppm	9M07G7D
1	3	22H		829	844	0.1746	0.0011 ppm	9M05W7D
1	4	24E		1852.4	1907.6	0.2254	0.0012 ppm	4M15F9W
1	5	24E		1860	1900	0.2065	0.0027 ppm	17M9G7D
1	6	24E		1855	1905	0.1841	0.0027 ppm	9M05W7D
1	7	27		1712.4	1752.6	0.227	0.0008 ppm	4M15F9W
1	8	27		1711.5	1753.5	0.1986	0.0191 ppm	2M73W7D
1	9	27		2510	2560	0.2113	0.0056 ppm	17M9W7D
1	1	27		2510	2560	0.173	0.0056 ppm	17M9W7D
1	11	27		2507.5	2562.5	0.1841	0.0056 ppm	13M5W7D
1	12	27		704	711	0.1928	0.0165 ppm	9M09G7D
1	13	27		704	711	0.1687	0.0165 ppm	9M05W7D
1	14	27		700.5	714.5	0.1718	0.0165 ppm	2M73W7D
1	15	27		782	782	0.1986	0.0066 ppm	8M97G7D
1	16	27		782	782	0.1824	0.0066 ppm	8M99W7D
1	17	27		1720	1770	0.2113	0.0191 ppm	17M9G7D
1	18	24E		1860	1900	0.1629	0.0027 ppm	18M0W7D
1	19	27		1720	1770	0.169	0.0191 ppm	18M0W7D
1	2	27		1711.5	1778.5	0.1986	0.0191 ppm	2M73W7D
1	21	27		1720	1745	0.2113	0.0191 ppm	17M9G7D
1	22	27		1720	1745	0.1629	0.0191 ppm	18M0W7D

some individual PII (Personally Identifiable Information) available on the public forms may be redacted, original source may include additional details