Intelligent module product specification PRODUCT SPECIFICATION Type: VZS2R1 Version: 2020224 Version number V 1.2 V 2.0 V 2.1 Release time change 2020.02.25 issue Changed person Chen jiatao 2021.08.24 Adjust content Chen jiatao 2022.02.24 Update naming rules Chen jiatao catalogue 1 Product introduction .............................................................................................................................................................................. 2 II. Overview of Intelligent Module Products .................................................................................................................................... 2 2 Technical parameters of products .......................................................................................................................................................... 2 3 application area ...................................................................................................................................................................................... 3 4 naming rule ............................................................................................................................................................................................ 3 III. Module Interface ................................................................................................................................................................................. 4 1 Package size ........................................................................................................................................................................................... 4 1.1 VZS2R1 ..................................................................................................................................................................................... 4 2 IO pin interface definition of module .................................................................................................................................................... 6 3 DEBUG function ................................................................................................................................................................................... 7 IV. RF parameters ..................................................................................................................................................................................... 8 1 Basic radio frequency characteristics ..................................................................................................................................................... 8 2 Launch performance .............................................................................................................................................................................. 8 3 receptivity .............................................................................................................................................................................................. 8 1 Information ............................................................................................................................................................................................ 9 V. Antenna information .................................................................................................................................................................... 9 2 Reduce antenna interference .................................................................................................................................................................. 9 1 Mechanical dimensions ........................................................................................................................................................................ 10 VI. Packaging Information and Design Reference ......................................................................................................................... 10 2 side view .............................................................................................................................................................................................. 10 2.1VZS2R1- with shielding cover .................................................................................................................................................. 10 3 Reference drawing ............................................................................................................................................................................... 11 4 schematic circuit diagram .................................................................................................................................................................... 11 5 PCB package diagram -SMT ............................................................................................................................................................... 12 5.1 VZS2R1- with shielding cover ................................................................................................................................................. 12 VII. Matters needing attention in production .................................................................................................................................. 13 VIII. MOQ of Module and Packaging Information ................................................................................................................................. 13 IX. Basic information .............................................................................................................................................................................. 14 1 copyright statement .............................................................................................................................................................................. 14 2 disclaimer ............................................................................................................................................................................................. 14 3 Trademark declaration ......................................................................................................................................................................... 14 400-829-9797 .......................................................................................................................................................................................... 14 www.vensi.cn I intelligent module VZS2R1 products www.vensi.cn 1 14 II Overview of Intelligent Module Products 1 Product introduction VZS2R1 is a ZigBee wireless communication intelligent module developed by Westphalia, which supports ZigBee3.0. Adopting the highly integrated wireless RF processor chip EFR32MG21A020 series of Silicon Labs, it has the advantages and characteristics of high wireless transmission power, strong receiving sensitivity, low power consumption and strong networking ability, which provides a perfect solution for ZigBee connection. 2 Technical parameters of products technical parameter parameter value Chip model master control Flash RAM Support agreement Working frequency Output power receiving sensitivity modulation system operating voltage Sending current Receiving current quiescent current Standard security Working temperature ambient humidity Technical certification EFR32MG21A020F512IM32-B EFR32MG21A020F768IM32-B High performance 32-bit 80MHz ARM Cortex-
M33 512kB / 768kB 64kB ZigBee 3.0 2400 ~ 2480 MHz Max20dBm Max-102.5dBm DSSS QPSK 2.0 V ~ 3.6 V Max27mA00dBm Max63mA10dBm Max182mA20dBm Max10.91mA250Kbps 4.5mA (idle EM0) 6.2uA (sleep EM2) AES 128/256
-40 ~ +85 10% ~ 90% no condensation. FCC & CE & SRRC www.vensi.cn 2 14 3 application area Wisdom lighting, illumination Wisdom campus Wisdom building Wisdom home furnishing Wisdom household appliances Wisdom socket Wisdom for the aged 4 naming rule Note: Take the model of VZS2R1 module as an example:
V Z S2 R 1 Figure 2-1 Naming Rules Section 5 package pins: 1-30pin(R1-30pin) Section 4 Packaging Series: R-R Series Section 3 Chip Platform: S2- Core EFR32MG21 Section 2 communication type: Z-ZigBee Section 1 Manufacturer: V- Westphalia Vensi www.vensi.cn 3 14 1 Package size 1.1 VZS2R1 III. Module Interface VZS2R1 has three rows of pins with a pitch of 1.27mm Dimensions of VZS2R1: 15 0.4mm (L) x 18 0.4mm (W) x 2.8 0.2mm (H) The dimensions of vzs2R1 are shown in the figure:
Figure 3-1 Front view of module with shielding cover Figure 3-2 Back view of module with shielding cover www.vensi.cn 4 14 www.vensi.cn 5 14 2 IO pin interface definition of module Pin number Chip function Module function 1 GND GND/PAVSS GND ground connection function declarati on 2 NULL PB01(GPIO) NULL Use as GPIO 3 NULL PB00(GPIO) NULL Use as GPIO 4r NULL PA00(GPIO) NULL Use as GPIO 5 NULL PA03(GPIO) NULL Use as GPIO 6 NULL PA04(GPIO) NULL Use as GPIO 7 NULL PA05(GPIO) NULL Use as GPIO 8 NULL PA06(GPIO) NULL Use as GPIO 9 NULL PD04(GPIO) NULL Use as GPIO 10 NULL PD03(GPIO) NULL Use as GPIO 11 NULL PD02(GPIO) NULL Use as GPIO 12 13 14
15 RES Hardware RESET RESET 16 NULL PC01(GPIO) NULL The system RESET signal is triggered at low level, and it is pulled up. Use as GPIO 17 NULL PC00(GPIO) NULL Use as GPIO 18 SWCK DC/PA01 DEBUG CLOCK 19 SWDIO DD/PA02 DEBUG DATA 20 PA02 DD/PA02 DEBUG DATA 21 PA01 DC/PA01 DEBUG CLOCK DC DD DD DC 22 NULL PD01(GPIO) NULL Use as GPIO www.vensi.cn 6 14 23 NULL PD00(GPIO) NULL Use as GPIO 24 NULL PC02(GPIO) NULL Use as GPIO 25 NULL PC03(GPIO) NULL Use as GPIO 26 NULL PC04(GPIO) NULL Use as GPIO 27 NULL PC05(GPIO) NULL Use as GPIO 28 GND GND GND ground connection 29 VCC PAVDD/RFVDD VDD DC power supply (1.85~3.6V) 30 VCC PAVDD/RFVDD VDD DC power supply (1.85~3.6V) 31 ANT Antenna Antenna aerial Table 3-1 Pin Function Definition 3 DEBUG function Pin burning function adopts pins 1, 15, 18, 19 and 30 (see Table 3-2 for functional description). Pin number one 15 18 19 30 Chip function Hardware RESET GND DC DD VDD function declaration ground connection Low level trigger, pull-up DEBUG CLOCK DEBUG DATA Power supply
(3.3V) Table 3-2 Function of burning firmware www.vensi.cn 7 14 1 Basic radio frequency characteristics IV. RF parameters Parameter item Working frequency ZigBee standard rate of data signalling Detailed description 2.405~2.480GHz IEEE 802.15.4 250Kbps 2 Launch performance Table 4-1 Basic RF Characteristics Param eter item Maximum output power 250Kbps Minimum output power 250Kbps 3 receptivity Parameter item RX sensitivity 250Kbps minim um value
typical value maxim um 19.3
-15.2
unit dBm dBm minimum value
-102.5 typical value
-102.3 maxim um unit
-102 dBm Table 4-2 Launch Performance Table 4-3 Receiving Performance www.vensi.cn 8 14 V. Antenna information 1 Information The antenna of this module can be IPEX antenna, Pin antenna, etc. 2 Reduce antenna interference W h e n u s i n g P C B a n t e n n a o n Z i g B e e m o d u l e , i n o r d e r t o e n s u r e t h e o p t i m i z a t i o n o f Z i g B e e p e r f o r m a n c e , i t i s r e c o m m e n d e d t h a t t h e d i s t a n c e b e t w e e n t h e a n t e n n a p a r t o f t h e m o d u l e a n d o t h e r m e t a l p a r t s s h o u l d b e a t l e a s t 2 4 . 5 m m T h e u s e r P C B s h o u l d n o t b e w i r e d o r e v e n c o p p e r - c l a d i n t h e a n t e n n a a r e a .
(Green marks are copper-clad areas, as shown in Figure 4-1), so as not to affect the antenna performance. www.vensi.cn 9 14 Figure 5-1 Antenna Interference Area VI. Packaging Information and Design Reference 1 Mechanical dimensions The module size is: 15 x 18mm. Module size and pad size are shown in the figure. The dimension tolerance of the following modules is 0.4mm Figure 6-1 Mechanical dimension drawing 2 side view 2.1 VZS2R1- with shielding cover Figure 6-2 Side view of module with shielding cover Figure 6-3 Side view of module without shield www.vensi.cn 10 14 3 Reference drawing 4 schematic circuit diagram Figure 6-4 Design Reference Diagram Figure 6-5 Circuit Schematic Diagram www.vensi.cn 11 14 5 PCB package diagram -SMT 5.1 VZS2R1- with shielding cover Figure 6-6 Front view of PCB package Figure 6-7 Back view of mechanical dimensions 5.2 VZS2R1 series-without shield Figure 6-8 Front view of PCB package Figure 6-9 Back view of mechanical dimensions www.vensi.cn 12 14 VII. Matters needing attention in production 1 Shelf life of modules a) Shelf life: 12 months, storage environment: temperature < 40, humidity < 90% R.H b) Inventory control: the principle of "first in, first out"
2 Time limit for SMT assembly after the module is unpacked a) Check the humidity card (as shown in Figure 6-1): the displayed value should be less than 20% (blue); If > 30% (red), it means that the module has absorbed moisture. Figure 7-1 Humidity Card Inspection b) Temperature and humidity control of SMT workshop environment: work at a temperature of 25
(4) and a humidity of 60% r.h (20%). c) After baking, it can be used in SMT production immediately, or put in a proper amount of desiccant, then sealed and packaged, and stored in a drying cabinet. 3 Unpacked module, if not used up within 48 hours. a) The module must be baked again to remove the moisture absorption problem of the module. b) Baking temperature and time condition Baking temperature: 60 in reel packaging; Packing tray at 60 Baking time: 8 hours in reel packaging; Pack the tray for 4 hours. If the exposure time after baking is more than 168 hours, please bake again. VIII. MOQ of Module and Packaging Information product model MOQPCS Packaging method of blister tray Number of Number of VZS2R1 1K 25 1000PCS disk 80PCS modules per trays per box modules per Packing method Number of disk www.vensi.cn 13 14 FCC STATEMENT conditions:
Table 8-1 Package Information of Module 1. This device complies with Part 15 of the FCC Rules. Operation is subject to the following two
(1) This device may not cause harmful interference.
(2) This device must accept any interference received, including interference that may cause undesired operation. 2. any Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:
Reorient or relocate the receiving antenna. Increase the separation between the equipment and receiver. Connect the equipment into an outlet on a circuit different from that to which the receiver is Consult the dealer or an experienced radio/TV technician for help. FCC Radiation Exposure Statement This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20cm between the radiator connected.
& your body www.vensi.cn 14 14 IX. Basic information 1 copyright statement The copyright of this manual belongs to Guangzhou Vistara Intelligent Technology Co., Ltd., and all rights of technical patents, specifications and definitions involved in all documents are reserved. Without the consent of Vistara Intelligent, no unit or individual is allowed to extract the contents of this manual without authorization. 2 disclaimer Due to product iteration, some content will be changed due to product iteration. Please contact our company in time for any understanding problems caused by product iteration. We will cooperate with customers to solve the problems encountered, but we will not be responsible for compensation for the increase of time and cost caused to customers. As some parameters come from the laboratory, some technical parameters involved in the content do not constitute a guarantee or backing guarantee in any practical application. 3 Trademark declaration It is the trademark of Guangzhou Vistara Intelligent Technology Co., Ltd.. 400-829-9797 Guangzhou Wei Shi Dan Li Intelligent Technology Co., Ltd. Guangzhou Core Building, No.18 Kexue Avenue, Huangpu District, Guangzhou http://www.vensi.cn www.vensi.cn 15 14