www.sziton.com
RB1762-25
Ver0.1 -July., 2021
RB1762-25
Bluetooth Module
DISCLAIMER AND COPYRIGHT NOTICE
Information in this document, including URL references, is subject to change without notice.
This document is provided “As if” with no whatsoever, including any warranty of merchantability, noninfringement, fitness for any
purpose, or any warranty otherwise arising out of any proposal, specification or samples.
All liability, including liability for infringement of any proprietary rights, relating to use of information in this document is disclaimed. No
licenses express or implied, by estoppel or otherwise, to any intellectual property rights are granted herein.
All trade names, trademarks and registered trademarks mentioned in this document are property of their respective owners, and are
The Bluetooth logo and symbol belong to the Bluetooth SIG Inc.
The Wi-Fi Alliance Member Logo is a trademark of the Wi-Fi Alliance.
hereby acknowledged.
Copyright by ITON Technology Corp. All rights reserved.
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Table of Contents
RB1762-25
Ver0.1 - July, 2021
Table of Contents....................................................................................................................... 2
1 Device Overview...................................................................................................................... 3
1.1 Features............................................................................................................................................3
1.2 Applications.................................................................................................................................... 3
1.3 Description...................................................................................................................................... 3
1.4 Functional Block Diagram........................................................................................................... 4
2 Pin Configuration and Functions........................................................................................4
2.1 Module Pin Diagram...................................................................................................................... 4
2.2 Pin Functions..................................................................................................................................5
3 Specifications...........................................................................................................................7
3.1 Absolute Maximum Rating.......................................................................................................... 7
3.2 Power Consumption..................................................................................................................... 8
3.3 RF Characteristics......................................................................................................................... 8
4 Application, Implementation, and Layout.......................................................................10
4.1 Application Diagram................................................................................................................... 10
4.2 Typical Application Circuit........................................................................................................11
4.3 Layout Guideline..........................................................................................................................11
5 Mechanical and Package.....................................................................................................12
5.1 Mechanical Dimension............................................................................................................... 12
5.2 Package Information...................................................................................................................12
6 Thermal Reflow......................................................................................................................13
7 Ordering Information............................................................................................................13
8 Revision History.................................................................................................................... 13
ITON Technology Corp.
Page 2 of 13
RB1762-25
Ver0.1 - July, 2021
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1 Device Overview
1.1 Features
Ultra-low consumption with intelligent PMU
Supports Bluetooth 5 core specification
Supports 2Mbps LE
LE advertising Extensions
LE Long Range
Additional Adv channel
High Duty Cycle Non-Connectable Adv
Supports multiple level Low Energy states
Supports LE L2CAP Connection Oriented Channel Support
Supports GAP,ATT/GATT,SMP,L2CAP
Supports LE low duty directed advertising
Supports LE data length extension feature
Support OTA programming mechanism for firmware upgrade
1.2 Applications
Mesh LED
Home automation
Mice and wireless keyboard
Sensor network devices
Game controllers & joysticks
Amazon gadgets
Voice remote controls
Smart lighting/appliances
1.3 Description
The Module is designed base on the Realtek RTL8762CMF that is an ultra-low power system on-chip
solution for Bluetooth 5.0 low energy applications.
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2.2 Pin Functions
Pin
Name
Type
Description
Table 1. Pin Attributes of RB1762-25
1,2,8,9,25
GND
Ground
Ground
RB1762-25
Ver0.1 - July, 2021
3
4
5
6
7
10
11
P3_1
P3_0
P0_3
P1_1
P1_0
RESET
P0_6
12
P0_5
13
P0_4
14
P0_2
15
P0_1
16
P0_0
I/O
I/O
I/O
I/O
I/O
I
I/O
I/O
I/O
I/O
I/O
I/O
17
P2_2
I/O
General purpose IO;refer to the Pin Multiplexer Table
8mA driving capability With wakeup function
With inter strong/weak pull-up and pull-down
HCI_UART_RX(default)
General purpose IO;refer to the Pin Multiplexer Table
8mA driving capability With wakeup function
With inter strong/weak pull-up and pull-down
HCI_UART_TX(default)
LOG_UART_TX
Power on trap:Pull-up for normal operation
Pull-down to bypass executing program code in flash
General purpose IO;refer to the Pin Multiplexer Table
8mA driving capability With wakeup function
With inter strong/weak pull-up and pull-down
SWDCLK(default)
General purpose IO;refer to the Pin Multiplexer Table
8mA driving capability With wakeup function
With inter strong/weak pull-up and pull-down
SWDIO(default)
Hardware reset pin,low active
General purpose IO
8mA driving capability
With wakeup function
With inter strong/weak pull-up and pull-down
General purpose IO
8mA driving capability
With wakeup function
With inter strong/weak pull-up and pull-down
General purpose IO
8mA driving capability
With wakeup function
With inter strong/weak pull-up and pull-down
General purpose IO
8mA driving capability
With wakeup function
With inter strong/weak pull-up and pull-down
General purpose IO
8mA driving capability
With wakeup function
With inter strong/weak pull-up and pull-down
General purpose IO
8mA driving capability
With wakeup function
With inter strong/weak pull-up and pull-down
General purpose IO
8mA driving capability
With wakeup function
With inter strong/weak pull-up and pull-down
AUXADC input 2
ITON Technology Corp.
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RB1762-25
Ver0.1 - July, 2021
18
P2_3
I/O
19
P2_4
I/O
20
P2_5
I/O
21
P2_6
I/O
P2_7
I/O
22
23
24
General purpose IO
8mA driving capability
With wakeup function
With inter strong/weak pull-up and pull-down
AUXADC input 3
General purpose IO
8mA driving capability
With wakeup function
With inter strong/weak pull-up and pull-down
AUXADC input 4
General purpose IO
8mA driving capability
With wakeup function
With inter strong/weak pull-up and pull-down
AUXADC input 5
General purpose IO
8mA driving capability
With wakeup function
With inter strong/weak pull-up and pull-down
AUXADC input 6
General purpose IO
8mA driving capability
With wakeup function
With inter strong/weak pull-up and pull-down
AUXADC input 7
P5_0
VDD
Ground
Ground
Power Supply
Supply 1.8V~3.3V
ITON Technology Corp.
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RB1762-25
Ver0.1 - July, 2021
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Note:Pin Multiplexer
All GPINote:Pin Multiplexer
All GPIO pins are configurable via the built-in pin multiplexer(PINMUX), The table shows all GPIO pin
configurations.All pins have an internal pull-up pull-down resistor for controlling GPIO_PU and GPIO_PD.O
pins are configurable via the built-in pin multiplexer(PINMUX), The table shows all GPIO pin
configurations.All pins have an internal pull-up pull-down resistor for controlling GPIO_PU and GPIO_PD.
Pin Multiplexer Table
3 Specifications
3.1 Absolute Maximum Rating
1) Power supply voltage :
VDD:1.8V~3.3V
2) Operation temperature range: -30℃~+85℃
3) Storage temperature range: -40℃~+115℃
ITON Technology Corp.
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RB1762-25
Ver0.1 - July, 2021
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3.2 Power Consumption:
Condition: VDD=3V, ambient temperature: 25C
1) Low Power Mode
Power Mode Always on
32k
Retention
CPU Wakeup
Current
Registers
RCOSC/XTAL
SRAM
Method
Consumption(Typical)
Power down ON
OFF
OFF
OFF Wakeup by GPIO 450nA
Condition:VDD=3V,ambient temperature:25℃
Current Consumption(Typical)
2)Active Mode
Power Mode
Active RX mode
Active TX mode(TX power:0dBm)
Active TX mode(TX power:4dBm)
Active TX mode(TX power:7.5dBm)
11.3mA
7.3mA
7.9mA
9.6mA
3.3 RF Characteristics
1) Receiver RF Specifications
Parameter
Condition
Frequency Range(MHz)
Sensitivity(dBm)
PER≤30.8%
Maximum Input Level(dBm)
PER≤30.8%
C/I
C/Ico-channel(dB)
C/I+1MHz(dB)
C/I-1MHz(dB)
C/I+2MHz(dB)
C/I-2MHz(dB)
C/I+3MHz(dB)
C/IImage(dB)
C/IImage+1MHz(dB)
C/IImage-1MHz(dB)
Min.
Typ.
Max.
2402
2480
-90
-1
21
15
15
-17
-15
-27
-9
-15
-15
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Blocker Power(dBm)
30~2000MHz,
Wanted signal level=-67dBm
2003~2399MHz,
Wanted signal level=-67dBm
2484~2997MHz,
Wanted signal level=-67dBm
3000MHz~12.75GHz,
Wanted signal level=-67dBm
Max PER Report Integrity
Wanted signal:-30dBm
50%
Max Intermodulation level
Wanted signal(f0):-64dBm
(dBm)
Worst intermodulation
level@2f1-f2=f0,
|f1-f2|=nMHz,n=3,4,5…
Note1:Does not include spur channel
Note2:Depends on PCB design and registers setting
RB1762-25
Ver0.1 - July, 2021
-30
-35
-35
-30
-50
Parameter
Condition
Min.
Typ.
Max.
2) Transmitter RF Specifications
Maximum Output Power(dBm)
Adjacent Channel Power
Ratio (dBm)
-
+2MHz
-2MHz
≥+3MHz
≤-3MHz
Modulation Characteristics
Δf1avg(kHz)
Δf2max(kHz)
185
Δf2max
Δf2maxPassRate(%)
Carrier Frequency Offset
Average Fn(kHz)
and Drift
Drift Rate(kHz/50us)
Avg Rate(kHz/50us)
Max Rate(kHz/50us)
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
250
100
0.88
12.5
10
10
10
8
-20
-20
-30
-30
-
-
-
-
-
-
-
-
ITON Technology Corp.
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5 Mechanical and Package
5.1 Mechanical Dimension
PCB thickness:0.8mm . Product thickness 2.70mm±0.3mm
RB1762-25
Ver0.1 - July, 2021
Figure 6. Mechanical Dimension
Note:Unit is mm. Size tolerance:±0.13mm.
5.2 Package Information
Figure 8. Packaging Information
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6 Thermal Reflow
Referred to IPC/JEDEC standard.
Peak temperature: <250°C
Number of times: 6≤2
RB1762-25
Ver0.1 - July, 2021
Figure 9. Recommended Reflow for Lead Free Solder
Note:Suggest the module can't be go through the reflow furnace again.
7 Ordering Information
Part NO.
Working Voltage
ANT
Shielding cover
Remark
RB1762-25
VDD:1.8V~3.3V
PCB ANT
included
8 Revision History
Date
Version No.
Description
2020.07.19
V0.1
Initial version
Author
Vin
ITON Technology Corp.
Page 13 of 13
FCC Regulatory notices
Modification statement
Haier US Appliance Solutions, Inc. has not approved any changes or modifications to this device
by the user. Any changes or modifications could void the user’s authority to operate the equipment.
Interference statement
This device complies with Part 15 of the FCC Rules and Industry Canada licence-exempt RSS
standard(s). Operation is subject to the following two conditions: (1) this device may not cause
interference, and (2) this device must accept any interference, including interference that may cause
undesired operation of the device.
RF exposure
This equipment complies with FCC and ISED radiation exposure limits set forth for an
uncontrolled environment. The antenna should be installed and operated with minimum distance of
5mm between the radiator and your body. Antenna gain must be below 0dBi.
This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter.
The host end product must include a user manual that clearly defines operating requirements and
conditions that must be observed to ensure compliance with current FCC RF exposure guidelines.
For portable devices, in addition to above, a separate approval is required to satisfy the SAR
requirements of FCC Part 2.1093.
If the device is used for other equipment that separate approval is required for all other operating
configurations, including portable configurations with respect to 2.1093 and different antenna
configurations.
FCC Class B digital device notice
Changes or modifications not expressly approved by the party responsible for compliance could
void the user’s authority to operate the equipment.This equipment has been tested and found to comply
with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are
designed to provide reasonable protection against harmful interference in a residential installation. This
equipment generates, uses and can radiate radio frequency energy and, if not installed and used in
accordance with the instructions, may cause harmful interference to radio communications. However,
there is no guarantee that interference will not occur in a particular installation. If this equipment does
cause harmful interference to radio or television reception, which can be determined by turning the
equipment off and on, the user is encouraged to try to correct the interference by one or more of the
following measures:
• Reorient or relocate the receiving antenna.
• Increase the separation between the equipment and receiver.
• Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
• Consult the dealer or an experienced radio/TV technician for help.
Labelling Requirements for the Host device
The host device shall be properly labelled to identify the modules within the host device. The certification
label of the module shall be clearly visible at all times when installed in the host device, otherwise the
host device must be labelled to display the FCC ID and ISED of the module, preceded by the words
"Contains transmitter module", or the word "Contains", or similar wording expressing the same meaning,
as follows:
ISED Canada Statement:
This device contains licence-exempt tasmittre(s)/receiver(s)/ that comply with Innovation Science and
Economic Development Canada 's licence-exempt RSS(s).
Operation is subject to the following two conditions:
1) this device may not cause interference and
2) this device must accept any interference, including interference that may cause undesired operation
of the device.
Radiation Exposure: This equipment complies with Canada radiation exposure limits set forth for an
uncontrolled environment
RF Exposure Statement
To maintain compliance with IC's RF Exposure guidelincs, This cquipment should be.installed and
operated with minimum distance of 5mm the radiator your body. This device and its antenna(s) must not
be co-located or operation in conjunction with any other antenna or transmitter
Déclaration de l'ISED Canada :
Cet appareil contient des tasmittre (s) / récepteur (s) sans licence / conformes à l'innovationRSS
exemptes de licence de Sciences et Développement économique Canada. L'opération est sous réserve
des deux conditions
suivantes :
1) cet appareil ne peut pas causer d'interférences et
2) ce dispositif doit accepter toute interférence, y compris peut provoquer le fonctionnement
indésirable de l'appareil.
Exposition aux rayonnements : Cet équipement est conforme aux radiations du Canada limites
d'exposition pour un environnement incontrôlé
noncé d'exposition RF
Pour maintenir le respect des guides d'exposition RF d'IC, cquipment doit être.installé et actionné avec
une distance minimale de 5mm le radiateur de votre corps. Cet appareil et ses antennes ne doivent pas être
co-localisé ou en opération en conjonction avec toute autre antenne ou émetteur
OEM Statement
a. The module manufacturer must show how compliance can be demonstrated only for
specific host or hosts
b. The module manufacturer must limit the applicable operating conditions in which t
transmitter will be used, and
c. The module manufacturer must disclose that only the module grantee can make the te
evaluation that the module is compliant in the host. When the module grantee either refuses to
make this evaluation, or does not think it is necessary, the module certification is rendered
invalid for use in the host, and the host manufacturer has no choice other than to use a different
module, or take responsibility (§ 2.929) and obtain a new FCC ID for the product.
d. The module manufacturer must provide the host manufacturer with the followi
requirements:
i. The host manufacturer is responsible for additional testing to verify compliance as
composite system. When testing the host device for compliance with Part 15 Subpart B, the host
manufacturer is required to show compliance with Part 15 Subpart B while the transmitter
module(s) are installed and operating. The modules should be transmitting and the evaluation
should confirm that the module’s intentional emissions are compliant (i.e. fundamental and out of
band emissions).
2.2 List of applicable FCC rules
List the FCC rules that are applicable to the modular transmitter. These are the rules that specifically
establish the bands of operation, the power, spurious emissions, and operating fundamental
frequencies.
DO NOT list compliance to unintentional-radiator rules (Part 15 Subpart B) since that is not a
condition
of a module grant that is extended to a host manufacturer. See also Section 2.10 below concerning the
need to notify host manufacturers that further testing is required.3
Explanation: This module meets the requirements of Part 15 Subpart C Section 15.247
2.3 Summarize the specific operational use conditions
Describe use conditions that are applicable to the modular transmitter, including for example any
limits on antennas, etc. For example, if point-to-point antennas are used that require reduction in
power or compensation for cable loss, then this information must be in the instructions. If the use
condition limitations extend to professional users, then instructions must state that this information
also extends to the host manufacturer’s instruction manual. In addition, certain information may
also be needed, such as peak gain per frequency band and minimum gain, specifically for master
devices in 5 GHz DFS bands.
Explanation: The EUT uses PCB Antenna, antenna gain: 0dBi. There is no restriction on
the installation method.
2.4 Limited module procedures
If a modular transmitter is approved as a “limited module,” then the module manufacturer is
responsible
for approving the host environment that the limited module is used with. The manufacturer of a
limited
module must describe, both in the filing and in the installation instructions, the alternative means that
the
limited module manufacturer uses to verify that the host meets the necessary requirements to satisfy
the
module limiting conditions.
A limited module manufacturer has the flexibility to define its alternative method to address the
conditions that limit the initial approval, such as: shielding, minimum signaling amplitude, buffered
modulation/data inputs, or power supply regulation. The alternative method could include that the
limited
module manufacturer reviews detailed test data or host designs prior to giving the host manufacturer
approval.
This limited module procedure is also applicable for RF exposure evaluation when it is necessary to
demonstrate compliance in a specific host. The module manufacturer must state how control of the
product into which the modular transmitter will be installed will be maintained such that full
compliance
of the product is always ensured. For additional hosts other than the specific host originally granted
with a
limited module, a Class II permissive change is required on the module grant to register the additional
host as a specific host also approved with the module.
Explanation: The module is not a limited mnodule
2.5 Trace antenna designs
For a modular transmitter with trace antenna designs, see the guidance in Question 11 of KDB
Publication 996369 D02 FAQ – Modules for Micro-Strip Antennas and traces. The integration
information shall include for the TCB review the integration instructions for the following aspects: layout
of trace design, parts list (BOM), antenna, connectors, and isolation requirements.4
a) Information that includes permitted variances (e.g., trace boundary limits, thickness, length,
width, shape(s), dielectric constant, and impedance as applicable for each type of antenna);
b) Each design shall be considered a different type (e.g., antenna length in multiple(s) of frequency,
the wavelength, and antenna shape (traces in phase) can affect antenna gain and must be
considered);
c) The parameters shall be provided in a manner permitting host manufacturers to design the printed
circuit (PC) board layout;
d) Appropriate parts by manufacturer and specifications;
e) Test procedures for design verification; and
f) Production test procedures for ensuring compliance.
The module grantee shall provide a notice that any deviation(s) from the defined parameters of the
antenna trace, as described by the instructions, require that the host product manufacturer must notify
the
module grantee that they wish to change the antenna trace design. In this case, a Class II permissive
change application is required to be filed by the grantee, or the host manufacturer can take responsibility
through the change in FCC ID (new application) procedure followed by a Class II permissive change
application.
Explanation: This module does not use Trace antenna designs.
2.6 RF exposure considerations
It is essential for module grantees to clearly and explicitly state the RF exposure conditions that permit a
host product manufacturer to use the module. Two types of instructions are required for RF exposure
information: (1) to the host product manufacturer, to define the application conditions (mobile,
portable –
xx cm from a person’s body); and (2) additional text needed for the host product manufacturer to
provide
to end users in their end-product manuals. If RF exposure statements and use conditions are not
provided,
then the host product manufacturer is required to take responsibility of the module through a change in
FCC ID (new application).
Explanation: This module complies with FCC RF radiation exposure limits set forth for an uncontrolled
environment.
2.7 Antennas
A list of antennas included in the application for certification must be provided in the instructions. For
modular transmitters approved as limited modules, all applicable professional installer instructions must
be included as part of the information to the host product manufacturer. The antenna list shall also
identify the antenna types (monopole, PIFA, dipole, etc. (note that for example an “omni-directional
antenna” is not considered to be a specific “antenna type”)).
For situations where the host product manufacturer is responsible for an external connector, for
example
with an RF pin and antenna trace design, the integration instructions shall inform the installer that
unique
antenna connector must be used on the Part 15 authorized transmitters used in the host product. The
module manufacturers shall provide a list of acceptable unique connectors.
Explanation: The EUT uses PCB Antenna, antenna gain: 0dBi.
2.8 Label and compliance information
Grantees are responsible for the continued compliance of their modules to the FCC rules. This includes
advising host product manufacturers that they need to provide a physical or e-label stating “Contains
FCC
ID” with their finished product. See Guidelines for Labeling and User Information for RF Devices –
KDB Publication 784748.
Explanation:The host system using this module, should have label in a visible area indicated he
following texts: "Contains FCC ID: ZKJ-BLEA004
2.9 Information on test modes and additional testing requirements5
Additional guidance for testing host products is given in KDB Publication 996369 D04 Module
Integration Guide. Test modes should take into consideration different operational conditions for a
standalone
modular transmitter in a host, as well as for multiple simultaneously transmitting modules or other
transmitters in a host product.
The grantee should provide information on how to configure test modes for host product evaluation
for
different operational conditions for a stand-alone modular transmitter in a host, versus with multiple,
simultaneously transmitting modules or other transmitters in a host.
Grantees can increase the utility of their modular transmitters by providing special means, modes, or
instructions that simulates or characterizes a connection by enabling a transmitter. This can greatly
simplify a host manufacturer’s determination that a module as installed in a host complies with FCC
requirements.
Explanation: Data transfer module demo board can control the EUT work in RF test mode at spcified
test channel
2.10 Additional testing, Part 15 Subpart B disclaimer
The grantee should include a statement that the modular transmitter is only FCC authorized for the
specific rule parts (i.e., FCC transmitter rules) listed on the grant, and that the host product
manufacturer is responsible for compliance to any other FCC rules that apply to the host not covered
by the modular transmitter grant of certification. If the grantee markets their product as being Part 15
Subpart B compliant (when it also contains unintentional-radiator digital circuity), then the grantee
shall provide a notice stating that the final host product still requires Part 15 Subpart B compliance
testing with the modular transmitter installed.
Explanation: The module without unintentional-radiator digital circuity, so the module does not
require an evaluation by FCC Part 15 Subpart B. The host shoule be evaluated by the FCC Subpart B