BT2S Module Datasheet Device Development > Module > Bluetooth Module Version: 20200420 Online Version BT2S Module Datasheet Contents Contents 1.1 Features . 1 1.2 Applications . 1 1 Product Overview 2 Change History 3 Module Interfaces 3.1 Dimensions and Footprint
. 3 3.2 Interface Pin Denition . 4 4 Electrical Parameters 4.1 Absolute Electrical Parameters
. 7 4.2 Electrical Conditions . 7 4.3 Working Current . 8 5 RF Features 5.1 Basic RF Features . 10 5.2 RF Output Power . 10 5.3 RF RX Sensitivity . 10 6 Antenna Information 6.1 Antenna Type . 12 6.2 Antenna Interference Reduction . 12 7 Packaging Information and Production Instructions 7.1 Mechanical Dimensions . 13 7.2 Production Instructions
. 13 7.3 Recommended Oven Temperature Curve . 15 7.4 Storage Conditions . 18 8 MOQ and Packing Information 9 Appendix: Statement 1 2 3 7 10 12 13 19 20 i BT2S Module Datasheet 1 PRODUCT OVERVIEW 1 Product Overview BT2S is an embedded Bluetooth low energy (BLE) module that Tuya has developed. It consists of a highly integrated Bluetooth chip (TLSR8250F512ET32) and several peripheral components, with an embedded Bluetooth network protocol stack and robust library functions. BT2S also contains a low-power 32-bit multipoint control unit (MCU), BLE 5.0 component, 2.4 GHz radio component, 4 Mbits ash memory, 48 KB static random-access memory (SRAM). 1.1 Features Embedded low-power 32-bit MCU, which can also function as an application processor - Dominant frequency: 48 MHz Working voltage: 1.8 V to 3.6 V (Under 1.8 V to 2.7 V, the module can start but the RF performance is not guaranteed. Under 2.8 V to 3.6 V, the module performance is normal.) Peripherals: 5GPIOs, 1UART, 1ADC BLE RF features Compatible with BLE 5.0 Up to 2 Mbit/s RF data rate TX power: +10 dBm RX sensitivity: 94 dBm at BLE 1 Mbit/s Embedded advanced encryption standard (AES) hardware encryption Working temperature: 20C to +85C 1.2 Applications Smart LED lights Smart households Smart low-power sensors 1 / 21 BT2S Module Datasheet 2 CHANGE HISTORY 2 Change History Date Change Description Version After Change 2020/04/20This is the rst release. V1.0.0 2 / 21 BT2S Module Datasheet 3 MODULE INTERFACES 3 Module Interfaces 3.1 Dimensions and Footprint BT2S has two rows of pins with a 2 mm pin spacing. The BT2S dimensions are 150.35mm (W)180.35mm (L) 2.90.15mm(H),The PCB thickness is 0.80.1 mm. The BT2S pins show as below Figure 1: BT2S .png 3 / 21 BT2S Module Datasheet 3 MODULE INTERFACES Figure 2: BT2S .png 3.2 Interface Pin Definition Pin No. Symbol I/O Type Function 1 2 3 3V3 C2 P I/O GND P Power supply pin Common I/O, which can be used as a PWM output of the LED drive and is connected to pin PC2 on the IC Power supply reference ground pin 4 / 21 BT2S Module Datasheet 3 MODULE INTERFACES Pin No. Symbol I/O Type Function C3 I/O Common I/O, which 4 5 6 7 8 9 I/O Common I/O, which can be used as a PWM output of the LED drive and is connected to pin PC3 on the IC UART_RX and is connected to pin PB7 on the IC can be used as a PWM output of the LED drive and is connected to pin PD2 on the IC UART_TX and is connected to pin PB1 on the IC SAR ADC Input, and is connected to pin PC4 on the IC can be used as a PWM output of the LED drive and is connected to pin PB5 on the IC connected to pin 25 on the IC I/O Common I/O, which I/O I/O I/O B7 D2 B1 C4 B5 5 / 21 10 RST 1/O Reset,and is BT2S Module Datasheet 3 MODULE INTERFACES Pin No. Symbol I/O Type Function 11 B4 I/O Common I/O, which can be used as a PWM output of the LED drive and is connected to pin PB4 on the IC Note: 1. P indicates power supply pins, I/O indicates input/output pins, and AI in-
dicates analog input pins. 2. If you have special requirements for light colors con-
trolled by PWM outputs, contact Tuya business personnel. 6 / 21 BT2S Module Datasheet 4 ELECTRICAL PARAMETERS 4 Electrical Parameters 4.1 Absolute Electrical Parameters Parameter Description Minimum Value Maximum Value Unit Ts Storage temperature VCC Power supply voltage Static TAMB-25 150 3.9 2 V KV Static TAMB-25 0.5 KV
-65
-0.3
electricity voltage
(human body model) electricity voltage
(machine model) 4.2 Electrical Conditions Ta VCC Working tempera-
ture Working voltage input Parameter Description Value Typical Value Value Unit Minimum Maximum
-20 85 VIL I/O low-level VSS VCC*0.3 1.8 3.3 3.6 V V
7 / 21 BT2S Module Datasheet 4 ELECTRICAL PARAMETERS Parameter Description Value Typical Value Value Unit Minimum Maximum VIH I/O VCC*0.7 VCC VOL I/O low-level VSS VOH I/O VCC*0.9 VCC*0.1 VCC Symbol Condition Minimum Value(Typical) Itx Constant 23.5 high-level input output high-level output 4.3 Working Current Irx IDC Connected to a IDC Connected to a transmission, 10dBm output power Constant receiving mesh net-
work(Average) mesh network(Peak) mode 1 (16 KB RAM is reserved.) Ideepsleep1 Deep sleep
6.5 6.59 24.9 1.2 8 / 21 V V V Unit mA mA mA mA uA BT2S Module Datasheet 4 ELECTRICAL PARAMETERS Symbol Condition Minimum Value(Typical) Ideepsleep2 0.4 Unit uA Deep sleep mode 2 (No RAM is reserved.) 9 / 21 BT2S Module Datasheet 5 RF FEATURES Parameter Description Frequency band Wireless standard Data transmission rate 2.4GHz ISM band BLE 4.2/5.0 1Mbps2Mbps Antenna type Onboard PCB antenna Parameter Minimum Value Typical Value Maximum Value Unit Average RF
-21 10 11.5 dBm
2500 1400
KHz KHz 5 RF Features 5.1 Basic RF Features 5.2 RF Output Power output power 20 dB modulation signal bandwidth
(1 Mbit/s) 20 dB modulation signal bandwidth
(2 Mbit/s) 5.3 RF RX Sensitivity 10 / 21 BT2S Module Datasheet 5 RF FEATURES Parameter Minimum Value Typical Value Maximum Value Unit Frequency
-250
+300 KHz Frequency
-300
+200 KHz
-94
-91
-10
dBm dBm dB sensitivity 1Mbps RX RX sensitivity 2Mbps oset 1Mbps oset 2Mbps Co-channel interference suppression
11 / 21 BT2S Module Datasheet 6 ANTENNA INFORMATION 6 Antenna Information 6.1 Antenna Type BT2S uses an onboard PCB antenna. 6.2 Antenna Interference Reduction To ensure optimal RF performance, it is recommended that the antenna be at least 15 mm away from other metal parts. If metal materials are wrapped around the antenna, the wireless signals will be reduced greatly, deteriorating the RF perfor-
mance. Because BT2S is inserted to the PCB, sucient space needs to be reserved for the antenna. 12 / 21 7 Packaging Information and Production Instructions 7 Packaging Information and Production Instructions 7.1 Mechanical Dimensions Figure 3: BT2S .png Note: The default dimensional tolerance is 0.35 mm, and the tolerance for some measurements is 0.1 mm. If a customer has other requirements, clearly specify them in the datasheet after communication. 7.2 Production Instructions 1. Use an SMT placement machine to mount components to the stamp hole mod-
ule that Tuya produces within 24 hours after the module is unpacked and the 13 / 21 7 Packaging Information and Production Instructions rmware is burned. If not, vacuum pack the module again. Bake the module before mounting components to the module. A. SMT placement equipment a) Reow soldering machine b) Automated optical inspection (AOI) equipment c) Nozzle with a 6 mm to 8 mm diameter B. Baking equipment d) Cabinet oven e) Anti-static heat-resistant trays f) Anti-static heat-resistant gloves 2. Storage conditions for a delivered module are as follows:
1 A. The moisture - proof bag is placed in an environment where the temperature is below 30 C and the relative humidity is lower than 70%. 2 B. The shelf life of a dry - packaged product is six months from the date when the product is packaged and sealed . 3 C. The package contains a humidity indicator card (HIC). Figure 4: image.png package 3. Bake a module based on HIC status as follows when you unpack the module A. If the 30%, 40%, and 50% circles are blue, bake the module for 2 consecu-
tive hours. B. If the 30% circle is pink, bake the module for 4 consecutive hours. C. If the 30% and 40% circles are pink, bake the module for 6 consecutive 14 / 21 7 Packaging Information and Production Instructions hours. D. If the 30%, 40%, and 50% circles are pink, bake the module for 12 consecu-
tive hours. 4. Baking settings:
A. Baking temperature: 1255C B. Alarm temperature: 130C C. SMT placement ready temperature after natural cooling: < 36C D. Number of drying times: 1 E. Rebaking condition: The module is not soldered within 12 hours after baking. 5. Do not use SMT to process modules that have unpacked for over three months. Electroless nickel immersion gold (ENIG) is used for the PCBs. If the solder pads are exposed to the air for over three months, they will be oxidized severely and dry joints or solder skips may occur. Tuya is not liable for such problems and consequences. 6. Before SMT placement, take electrostatic discharge (ESD) protective measures. 7. To reduce the reow defect rate, draw 10% of the products for visual inspection and AOI before rst SMT placement to determine a proper oven temperature and component placement method. Draw 5 to 10 modules every hour from subsequent batches for visual inspection and AOI. 7.3 Recommended Oven Temperature Curve Please refer to the recommended temperature of wave soldering furnace for setting the furnace temperature. The peak temperature is 2605. The curve of wave soldering temperature is shown in the following gure:
15 / 21 7 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS Figure 5: image.png Recommended welding temperature:
16 / 21 7 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS Figure 6: image.png 17 / 21 7 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS 7.4 Storage Conditions Figure 7: .png 18 / 21 BT2S Module Datasheet 8 MOQ AND PACKING INFORMATION 8 MOQ and Packing Information Product Model MOQ pcs Packing Method Number of Modules in Number of Reel Packs Each Reel Pack in Each Box BT2S
4 Carrier tape and reel packing 19 / 21 BT2S Module Datasheet 9 APPENDIX: STATEMENT 9 Appendix: Statement FCC Caution: Any changes or modications not expressly approved by the party re-
sponsible for compliance could void the users authority to operate this equipment. This device complies with Part 15 of the FCC Rules.Operation is subject to the fol-
lowing two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Note: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules.These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment o and on, the user is encour-
aged to try to correct the interference by one or more of the following measures:
Reorient or relocate the receiving antenna. Increase the separation between the equipment and receiver. Connect the equipment into an outlet on a circuit dierent from that to which the receiver is connected. Consult the dealer or an experienced radio/TV technician for help. Radiation Exposure Statement This equip-
ment complies with FCC radiation exposure limits set forth for an uncontrolled rolled environment. This equipment should be installed and operated with minimum dis-
tance 20cm between the radiator and your body. Important Note This radio module must not installed to co-locate and operating simultaneously with other radios in host system except in accordance with FCC multi-transmitter product procedures. Additional testing and equipment authorization may be required to operating simul-
taneously with other radio. The availability of some specic channels and/or opera-
tional frequency bands are country dependent and are rmware programmed at the factory to match the intended destination. The rmware setting is not accessible by the end user. The host product manufacturer is responsible for compliance to any other FCC rules that apply to the host not covered by the modular transmitter grant of certication. The nal host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed. The end user manual shall include all required regulatory information/warning as shown in this manual, including: This product must be installed and operated with a minimum distance of 20 cm between the radiator and user body. This device have got a FCC ID2ANDL-BT2S.The nal 20 / 21 BT2S Module Datasheet 9 APPENDIX: STATEMENT end product must be labeled in a visible area with the following: Contains Transmit-
ter Module FCC ID: 2ANDL-BT2S This device is intended only for OEM integrators under the following conditions: 1)The antenna must be installed such that 20cm is maintained between the antenna and users, and 2) The transmitter module may not be co-located with any other transmitter or antenna. As long as 2 conditions above are met, further transmitter test will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compli-
ance requirements required with this module installed. Declaration of Conformity European notice Figure 8: CE.png Hereby, Hangzhou Tuya Information Technology Co., Ltd declares that this module product is in compliance with essential requirements and other relevant provisions of Directive 2014/53/EU,2011/65/EU.A copy of the Declaration of conformity can be found at https://www.tuya.com Figure 9: .png This product must not be disposed of as normal household waste, in accordance with EU directive for waste electrical and electronic equipment (WEEE- 2012/19/EU). Insteadit should be disposed of by returning it to the point of sale, or to a municipal recycling collection point. The device could be used with a separation distance of 20cm to the human body. 21 / 21