FCC ID: 2ANDL-BT3L-A BLE Module

Global Intelligent Platform BT3L-A Datasheet Product Manual Tuya BT3L-A BLE Module Version: 1.0.0 Date: 2019-10-24 No.: 0000000001 1 Product Overview BT3L-A is an embedded Bluetooth Low Energy (BLE) module that Tuya has developed. It consists of a highly integrated Bluetooth chip (TLSR8250F512AT32) and several peripheral circuits, with an embedded Bluetooth network protocol stack and robust library functions. BT3L-A also contains a low-power 32-bit multipoint control unit (MCU), BLE 5.0 or 2.4 GHz radio, 4 MB flash memory, 48 KB static random-access memory (SRAM), and nine multiplexing I/O pins. 1.1 Features Embedded low-power 32-bit MCU, which can also function as an application processor Clock rate: 48 MHz Working voltage: 1.8 V to 3.6 V (Under 1.8 V to 2.7 V, the module can start but the RF performance is not guaranteed. Under 2.8 V to 3.6 V, the module performance is normal.) Peripherals: nine pulse width modulation (PWM) pins BLE RF features Compatible with BLE 5.0 Up to 2 Mbit/s RF data rate TX power: +10 dBm RX sensitivity: 94.5 dBm at BLE 1 Mbit/s Embedded Advanced Encryption Standard (AES) hardware encryption Onboard PCB antenna Working temperature: 20C to +105C 1 BT3L-A Datasheet 1.2 Applications Smart LED lights Smart households Smart low-power sensors 2 BT3L-A Datasheet Change History No. 1 Date Change Description Version After Change 2019-10-24 This is the first release. 1.0.0 3 BT3L-A Datasheet Contents 1 Product Overview.....................................................................................................................1 1.1 1.2 Features.........................................................................................................................1 Applications...................................................................................................................2 2 Module Interfaces.....................................................................................................................6 2.1 2.2 Dimensions and Footprint...........................................................................................6 Interface Pin Definition................................................................................................6 3 Electrical Parameters.............................................................................................................. 9 3.1 3.2 3.3 Absolute Electrical Parameters................................................................................. 9 Electrical Conditions....................................................................................................9 Power Consumption..................................................................................................10 4 RF Features............................................................................................................................ 11 4.1 4.2 4.3 Basic RF Features..................................................................................................... 11 RF TX Power...............................................................................................................11 RF RX Sensitivity.......................................................................................................12 5 Antenna Information.............................................................................................................. 12 5.1 5.2 Antenna Type..............................................................................................................12 Antenna Interference Reduction............................................................................. 12 6 Packaging Information and Production Instructions........................................................ 13 6.1 Mechanical Dimensions and Rear Solder Pad Dimensions...............................13 6.2 6.3 6.4 Production Instructions............................................................................................. 13 Recommended Oven Temperature Curve.............................................................15 Storage Conditions....................................................................................................16 7 MOQ and Packing Information............................................................................................ 17 8 Appendix: Statement.............................................................................................................17 4 BT3L-A Datasheet Figures Figure 2-1 BT3L-A front and rear views............................................................................... 6 Figure 6-1 BT3L-A mechanical dimensions and rear solder pad dimensions.............13 Figure 6-2 HIC for BT3L-A................................................................................................... 14 Figure 6-3 Oven temperature curve................................................................................... 15 Tables Table 2-1 BT3L-A interface pins............................................................................................ 6 Table 3-1 Absolute electrical parameters.............................................................................9 Table 3-2 Normal electrical conditions..................................................................................9 Table 3-3 Power consumption in different working modes............................................. 10 Table 4-1 Basic RF features.................................................................................................11 Table 4-2 Power during constant transmission................................................................. 11 Table 4-3 RX sensitivity.........................................................................................................12 5 BT3L-A Datasheet 2 Module Interfaces 2.1 Dimensions and Footprint BT3L-A has two rows of pins with a 2 mm pin spacing. The BT3L-A dimensions (H x W x D) are 3.30.15 mm x 160.35 mm x 240.35 mm. The PCB thickness is 0.80.1 mm. Figure 2-1 shows the BT3L-A front and rear views. Figure 2-1 BT3L-A front and rear views 2.2 Interface Pin Definition Table 2-1 BT3L-A interface pins Function Symbol Pin No. I/O Type 1 2 3 RST I/O ADC AI Hardware reset pin, which is active at a low level and is connected to the RESETB pin on the internal IC 12-bit ADC pin, which is connected to the TL_C4 pin on the internal IC NC I/O NC 6 Symbol Pin No. I/O Type Function BT3L-A Datasheet 4 5 6 7 8 9 10 11 12 13 TL_D7 I/O TL_D2 I/O TL_C3 I/O TL_C2 I/O VDD_ BAT GND P P TL_C0 I/O GPIO, which is connected to the TL_D7 pin on the internal IC Common I/O pin, which can be used as a PWM output of the LED drive and is connected to the TL_D2 pin on the internal IC Common I/O pin, which can be used as a PWM output of the LED drive and is connected to the TL_C3 pin on the internal IC Common I/O pin, which can be used as a PWM output of the LED drive and is connected to the TL_C2 pin on the internal IC Power supply pin (3.3 V) Power supply reference ground pin GPIO, which is connected to the TL_C0 pin on the internal IC SWS Input Programming pin, which is connected to the TL_D4 pin on the internal IC TL_A0 I/O TL_B4 I/O 14 TL_B5 I/O 15 16 TL_B7 I/O TL_B1 I/O GPIO, which is connected to the TL_A0 pin on the internal IC Common I/O pin, which can be used as a PWM output of the LED drive and is connected to the TL_B4 pin on the internal IC Common I/O pin, which can be used as a PWM output of the LED drive and is connected to the TL_B5 pin on the internal IC Serial interface receiving pin (UART RX), which is connected to the TL_B7 pin on the internal IC Serial interface transmission pin (UART TX), which is connected to the TL_B1 pin on the internal IC 7 BT3L-A Datasheet Note:

1. P indicates power supply pins, I/O indicates input/output pins, and AI indicates analog input pins. 2. If you have special requirements for light colors controlled by PWM outputs, contact Tuya business personnel. 8 BT3L-A Datasheet 3 Electrical Parameters 3.1 Absolute Electrical Parameters Table 3-1 Absolute electrical parameters Parameter Description Minimum Maximum Unit Value Value Ts VCC Static electricity voltage

(human body model) Static electricity voltage

(machine model) Storage temperature Power supply voltage 65 0.3 Tamb = 25C N/A Tamb = 25C N/A 150 3.9 2 0.5 C V kV kV 3.2 Electrical Conditions Table 3-2 Normal electrical conditions Parameter Description Minimum Value Typical Value Maximum Unit Value Ta VCC VIL VIH VOL VOH Working temperature Working voltage I/O low-level input 40 2.8 VSS I/O high-level input VCC x 0.7 I/O low-level output VSS I/O high-level output VCC x 0.9 N/A 3.3 N/A N/A N/A N/A 105 3.6 VCC x 0.3 VCC VCC x 0.1 VCC C V V V V V 9 3.3 Power Consumption BT3L-A Datasheet Table 3-3 Power consumption in different working modes Symbol Description Typical Value Unit Itx Irx IDC Ideepsleep1 Ideepsleep2 Constant transmission, 0 dBm output power Constant receiving Connected to a mesh network Deep sleep mode 1

(16 KB RAM is reserved.) Deep sleep mode 2

(No RAM is reserved.) 6.6 6.3 7.3 1.2 0.4 mA mA mA A A 10 BT3L-A Datasheet 4 RF Features 4.1 Basic RF Features Table 4-1 Basic RF features Parameter Description Frequency band 2.4 GHz ISM band Wireless standard BLE 4.2 or 5.0 Data transmission rate 1 Mbit/s or 2 Mbit/s Antenna type Onboard PCB antenna 4.2 RF TX Power Table 4-2 Power during constant transmission Parameter Minimum Value Typical Value Maximum Unit Value Average RF output power 20 dB modulation signal bandwidth

(1 Mbit/s) 20 dB modulation signal bandwidth

(2 Mbit/s) 22 N/A N/A 10 2500 10.5 N/A 1400 N/A dBm kHz kHz 11 BT3L-A Datasheet 4.3 RF RX Sensitivity Table 4-3 RX sensitivity Parameter RX sensitivity Frequency offset error 1 Mbit/s 2 Mbit/s 1 Mbit/s 2 Mbit/s Co-channel interference suppression N/A Minimum Value N/A N/A 250 300 N/A Typical Value 94.5 91 N/A N/A 10 Maximum Value N/A N/A

+300

+200 N/A Unit dB m kHz dB 5 Antenna Information 5.1 Antenna Type BT3L-A uses an onboard PCB antenna. 5.2 Antenna Interference Reduction To ensure optimal RF performance, it is recommended that the antenna be at least 15 mm away from other metal parts. If metal materials are wrapped around the antenna, the wireless signals will be reduced greatly, deteriorating the RF performance. As a dual in-line package (DIP), BT3L-A is through-hole mounted onto the PCB. Sufficient space needs to be reserved for the antenna. 12 6 Packaging Information and Production Instructions 6.1 Mechanical Dimensions and Rear Solder Pad Dimensions BT3L-A Datasheet Figure 6-1 BT3L-A mechanical dimensions and rear solder pad dimensions Note: The default dimensional tolerance is 0.35 mm, and the tolerance for some measurements is 0.1 mm. If a customer has other requirements, clearly specify them in the datasheet after communication. 6.2 Production Instructions 1. Use an SMT placement machine to mount the stamp hole module that Tuya produces onto the PCB within 24 hours after the module is unpacked and the firmware is burned. If not, vacuum pack the module again. Bake the module before mounting it onto the PCB.

(1) SMT placement equipment i. Reflow soldering machine 13 BT3L-A Datasheet ii. Automated optical inspection (AOI) equipment iii. Nozzle with a 6 mm to 8 mm diameter

(2) Baking equipment i. Cabinet oven ii. Anti-static heat-resistant trays iii. Anti-static heat-resistant gloves 2. Storage conditions for a delivered module are as follows:

(1) The moisture-proof bag is placed in an environment where the temperature is below 30C and the relative humidity is lower than 70%.

(2) The shelf life of a dry-packaged product is six months from the date when the product is packaged and sealed.

(3) The package contains a humidity indicator card (HIC). Figure 6-2 HIC for BT3L-A 3. Bake a module based on HIC status as follows when you unpack the module package:

(1) If the 30%, 40%, and 50% circles are blue, bake the module for 2 consecutive hours.

(2) If the 30% circle is pink, bake the module for 4 consecutive hours.

(3) If the 30% and 40% circles are pink, bake the module for 6 consecutive hours.

(4) If the 30%, 40%, and 50% circles are pink, bake the module for 12 consecutive hours. 4. Baking settings:

(1) Baking temperature: 1255C

(2) Alarm temperature: 130C 14 BT3L-A Datasheet

(3) SMT placement ready temperature after natural cooling: < 36C

(4) Number of drying times: 1

(5) Rebaking condition: The module is not soldered within 12 hours after baking. 5. Do not use SMT to process modules that have been unpacked for over three months. Electroless nickel immersion gold (ENIG) is used for the PCBs. If the solder pads are exposed to the air for over three months, they will be oxidized severely and dry joints or solder skips may occur. Tuya is not liable for such problems and consequences. 6. Before SMT placement, take electrostatic discharge (ESD) protective measures. 7. To reduce the reflow defect rate, draw 10% of the products for visual inspection and AOI before first SMT placement to determine a proper oven temperature and component placement method. Draw 5 to 10 modules every hour from subsequent batches for visual inspection and AOI. 6.3 Recommended Oven Temperature Curve Perform SMT placement based on the following reflow oven temperature curve. The highest temperature is 245C. Based on the IPC/JEDEC standard, perform reflow soldering on a module at most twice. Figure 6-3 Oven temperature curve 15 6.4 Storage Conditions BT3L-A Datasheet 16 7 MOQ and Packing Information BT3L-A Datasheet MOQ and packing information Product Model MOQ Packing Method Number of Modules in Each Reel Pack Number of Reel Packs in Each Box BT3L-A 3600 Carrier tape and reel packing 900 4 8 Appendix: Statement Federal Communications Commission (FCC) Declaration of Conformity FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate this equipment. This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. This device and its antenna(s) must not be co-located or operating in conjunction with any other antenna or transmitter. 15.105 Information to the user.

(b) For a Class B digital device or peripheral, the instructions furnished the user shall include the following or similar statement, placed in a prominent location in the text of the manual:

Note: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful 17 BT3L-A Datasheet interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

Reorient or relocate the receiving antenna. Increase the separation between the equipment and receiver. Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. Consult the dealer or an experienced radio/TV technician for help. This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20 cm between the radiator and your body. Radiation Exposure Statement:

This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. The availability of some specific channels and/or operational frequency bands are country dependent and are firmware programmed at the factory to match the intended destination. The firmware setting is not accessible by the end user. The final end product must be labeled in a visible area with the following:

"Contains Transmitter Module FCC ID:2ANDL-BT3L-A"

This radio module must not installed to co-locate and operating simultaneously with other radios in host system, additional testing and equipment authorization may be required to operating simultaneously with other radio. Declaration of Conformity European notice 18 BT3L-A Datasheet Hereby, Hangzhou Tuya Information Technology Co., Ltd declares that this Bluetooth module product is in compliance with essential requirements and other relevant provisions of Directive 2014/53/EU. A copy of the Declaration of conformity can be found at https://www.tuya.com. 19

Company: Hangzhou Tuya Information Technology Co.,Ltd Address: Room701,Building3,More Center,No.87 GuDun Road, Hangzhou,Zhejiang, China Tel: 86-571-86581786 Fax: 86-571-86581786 1a 00 re) Date (05/06/2019) TUV SUD BABT TCB Octagon House, Segensworth Road, Fareham, Hampshire, PO15 5RL Dear Sir or Madam, We, (Hangzhou Tuya Information Technology Co., Ltd ,; Room701, Building3, More Center,No.87 GuDun Road, Hangzhou, Zhejiang, China), matters. This authorization expires on (Dec. 31, 2019). sow ay Sho Sincerely, Company Officer: XiaoDong Shou Telephone Number: 86-571-86581 786 Email: mikeshou@tuya.com

Company: Hangzhou Tuya Information Technology Co.,Ltd Address: Room701,Building3,More Center,No.87 GuDun Road, Hangzhou,Zhejiang, China Tel: 86-571-86581786 Fax: 86-571-86581786 Date (12/13/2019) TUV SUD BABT TCB Octagon House, Segensworth Road, Fareham, Hampshire, PO15 5RL Confidentiality Request FCC ID: 2ANDL-BT3L-A Pursuant to Sections 0.457(d)(1)(ii) and 0.459 of the Commissions Rules, (Hangzhou Tuya Information Technology Co.,Ltd) hereby requests permanent confidential treatment of information accompanying this application as outlined below:

Schematics Bill of Materials/Parts List Block Diagrams Theory of Operation The above materials contain trade secrets and proprietary information not customarily released to the public. The public disclosure of these matters might be harmful to the Applicant and provide unjustified benefits to its competitors. The Applicant understands that pursuant to Rule 0.457(d)(1)(ii), disclosure of this Application and all accompanying materials will not be made before the date of the Grant for this Application. Yours sincerely, Company Officer:

Telephone Number:

Email:

86-571-86581786 mikeshou@tuya.com

Company: Hangzhou Tuya Information Technology Co.,Ltd Address: Room701,Building3,More Center,No.87 GuDun Road, Hangzhou,Zhejiang, China Tel: 86-571-86581786 Fax: 86-571-86581786 Date (12/13/2019) Federal Communications Commission Equipment Authorization Branch 7435 Oakland Mills Road Columbia, MD 21046 Modular Approval Request FCC ID: 2ANDL-BT3L-A The following attestation addresses the requirements to support modular approval:

Modular approval requirement Yes (provide brief statement) No *

(a) The radio elements must have the radio frequency circuitry shielded. Physical components and tuning capacitor(s) may be located external to the shield, but must be on the module assembly The module has a metal shied. Refer to the external photo of EUT.

(b) The module must have buffered modulation/data inputs to ensure that the device will comply with Part 15 requirements with any type of input signal Data to the modulation circuit is buffered as described in the operational description provided with the application.

(c) The module must contain power supply regulation on the module The module contains its own power supply regulation. Please refer to schematic filed with this application.

(d) The module must contain a permanently attached antenna, or The module has a PCB antenna and which permanently attached Company: Hangzhou Tuya Information Technology Co.,Ltd Address: Room701,Building3,More Center,No.87 GuDun Road, Hangzhou,Zhejiang, China Tel: 86-571-86581786 Fax: 86-571-86581786 contain a unique antenna connector, and be marketed and operated only with specific antenna(s), per Sections 15.203, 15.204(b), 15.204(c), 15.212(a), 2.929(b)

(e) The module must demonstrate compliance in a stand-alone configuration

(f) The module must be labelled with its permanently affixed FCC ID label, or use an electronic display (See KDB Publication 784748 about labelling requirements)

(g) The module must comply with all specific rules applicable to the transmitter. The grantee must provide comprehensive instructions to explain compliance requirements the module. Refer to the photo of EUT. The module was tested stand-

alone as shown in test setup photographs filed with this application. The FCC ID is printed on the label of the module.Refer to the label of EUT. The module comply with all specific rules.Refer to the datasheet. Modular approval requirement Yes (provide brief statement)

(h) The module must comply with RF exposure requirements The module meets Portable exclusion levels as shown in the RF exposure information filed with this application.

* Please provide a detailed explanation if the answer is No. Yours sincerely, Name:

Title:

General Manager No *