FCC ID: 2ANDL-BF8H-N Bluetooth Module

BF8H-N Module Datasheet Version: 20220303 Online Version Contents Contents 1 Product overview 1.1 Features . 2 1.2 Applications . 2 1.3 Change history . 2

. 3 2.1 Dimensions and footprint 2.2 Pin definition . 4 2 Module interfaces 3 Electrical parameters 3.1 Absolute electrical parameters

. 11 3.2 Operating conditions . 11 3.3 Power consumption in operating mode . 12 4 RF parameters 4.1 Basic RF features

. 13 4.2 RF output power . 13 4.3 RF receiving sensitivity . 13 5 Audio CODEC parameters 5.1 Digital to analog converter (single channel) . 14 5.2 Analog to digital converter (single channel) . 14 6 Antenna information 6.1 Antenna type . 16 6.2 Interference reduction . 16 7 Packaging information and production instructions

. 18 7.1 Mechanical dimensions

. 23 7.2 Production instructions 7.3 Recommended oven temperature curve . 25 7.4 Storage conditions . 26 2 3 11 13 14 16 18 27 28 8 MOQ and packaging information 9 Appendix: Statement I Contents BF8H-N is a low-power embedded Bluetooth audio module that Tuya has developed. It mainly consists of a highly integrated Bluetooth chip (FR8018HA) and a few pe-

ripheral circuits with the Bluetooth communication protocol stack and rich library functions inside. 1 / 30 1 Product overview BF8H-N includes an ARM Cortex M3 32-bit processor, a Bluetooth LE 5.0/2.4G radio, a 512-KB flash memory, a 48-KB SRAM, 30 reusable I/O ports, charging management for a lithium battery, and a 16-bit single-channel audio CODEC. 1 Product overview 1.1 Features 32-bit processor with the ARM Cortex M3 inside Operating voltage: 1.8 to 4.3V. If the voltage is between 1.8 and 2.4V, the module can start, but the optimal RF performance cannot be ensured. If the voltage is between 2.5 and 3.6V, the overall performance will be normal. Peripherals: 6 PWMs, 4 ADCs, 30 GPIOs, 2 UARTs, 1 SPI, 1 MIC, and 1 speaker Support Li-Ion/Li-Polymer battery, programmable charging current, current up to 200mA for fast charging Bluetooth RF features:

Bluetooth LE 5.0 The RF data rate can be up to 2 Mbps. Transmit power: +4 dBm Receiving sensitivity: -93 dBm@ 1 Mbps Support hardware encryption (AES/CCM) PCB antenna with a gain of 1.4 dBi Operating temperature: -20 to +85 1.2 Applications Outdoor Smart home 1.3 Change history Update date Updated content Version after update Feb. 14, 2022 This is the first release. V1.0.0 2 / 30 2 Module interfaces 2 Module interfaces 2.1 Dimensions and footprint The dimensions of BF8H-N are 250.35 mm (L)180.35 mm (W) 2.80.15 mm

(H). The thickness of the PCB is 0.80.1 mm, which are shown below:

3 / 30 2 Module interfaces 2.2 Pin definition The definitions of pins are shown in the following table:

Pin number Symbol Pin type Function 1 2 PA5 PA4 Common I/O interface, which corresponds to Pin 8 of the IC Common I/O interface, which corresponds to Pin 7 of the IC I/O I/O 4 / 30 Pin number Symbol Pin type Function 2 Module interfaces Common I/O interface, which corresponds to Pin 6 of the IC Common I/O interface, which corresponds to Pin 5 of the IC Common I/O interface, which corresponds to Pin 42 of the IC Common I/O interface, which corresponds to Pin 43 of the IC Common I/O interface, which corresponds to Pin 44 of the IC Common I/O interface, which corresponds to Pin 41 of the IC Common I/O interface, which corresponds to Pin 40 of the IC Common I/O interface, which corresponds to Pin 39 of the IC 3 4 5 6 7 8 9 PA6 PA7 PB4 PB6 PB7 PD0 PD1 10 PD2 I/O I/O I/O I/O I/O I/O I/O I/O 5 / 30 Pin number Symbol Pin type Function PD3 RX0 I/O I/O 13 TX0 I/O 11 12 14 15 BIAS AO MIC AI 6 / 30 2 Module interfaces Common I/O interface, which corresponds to Pin 38of the IC Serial port UART0_RX, which can also be used a common I/O interface and corresponds to Pin 4 of the IC chip Serial port UART0_TX, which can also be used a common I/O interface and corresponds to Pin 3 of the IC chip. It can used to output logs. MIC_BIAS, power supply for microphone, correspond to Pin 13 of the IC. MIC_IN, microphone input, correspond to Pin 14 of the IC. You should reserve an earth filter capacitor for the external microphone. 2 Module interfaces AOUT_P, audio differential output

(positive), correspond to Pin 16 of the IC AOUT_N, audio differential output

(negative), correspond to Pin 17 of the IC Hardware reset pin

(high active), correspond to Pin 18 of the IC Charger, pin for charging, which corresponds to Pin 19 of the IC. It can be used to charge the external batteries Common I/O interface PD4, which can be configured to be 10 bit/s and corresponds to Pin 29 of the IC Common I/O interface, which corresponds to Pin 28 of the IC Pin number Symbol Pin type Function AO-P AO 16 17 18 19 AO-N AO RST VCHG AI P 20 ADC0 I/O 21 PD5 I/O 7 / 30 Pin number Symbol Pin type Function 2 Module interfaces Common I/O interface, which corresponds to P 27 of the IC Common I/O interface, which corresponds to Pin 26 of the IC Power supply reference ground Power supply pin VCC (Typical value:

3.3V) Default burning serial port, transmitting pin UART1_TX, which can also be used as a common I/O interface and corresponds to pin 1 of the IC Default burning serial port, receiving pin UART1_RX, which can also be used as a common I/O interface and corresponds to Pin 2 of the IC 22 23 24 25 26 PD6 PD7 GND VCC I/O I/O P P TX1 I/O 27 RX1 I/O 8 / 30 Pin number Symbol Pin type Function 2 Module interfaces Common I/O interface, which corresponds to Pin 30 of the IC Common I/O interface, which corresponds to Pin 31 of the IC Common I/O interface, which corresponds to P32 of the IC Common I/O interface, which corresponds to Pin 34 of the IC Common I/O interface, which corresponds to Pin 35 of the IC Common I/O interface, which corresponds to Pin 36 of the IC Common I/O interface, which corresponds to Pin 37 of the IC Common I/O interface, which corresponds to Pin 45 of the IC 28 29 30 31 32 33 34 35 PC7 PC6 PC5 PC3 PC2 PC1 PC0 PB5 I/O I/O I/O I/O I/O I/O I/O I/O 9 / 30 Pin number Symbol Pin type Function PB1 PB2 PB3 I/O I/O I/O 2 Module interfaces Common I/O interface, which corresponds to Pin 46 of the IC Common I/O interface, which corresponds to Pin 47 of the IC Common I/O interface, which corresponds to Pin 48 of the IC The recommended voltage is 3.3V. The RF performance will be instable if the operating voltage is under 2.5V. P indicates a power supply pin, I/O indicates an input/output pin, and AI/AO indicates an analog input/output pin. If you have any special requirements on the light color controlled by the PWM output, please contact Tuya business personnel. The peripheral circuit of Charger is shown below for reference:

36 37 38

:::info

10 / 30 Parameter Description Minimum value Maximum value Unit 3 Electrical parameters 120 3.3 4.3 2 2 V V KV KV 3 Electrical parameters 3.1 Absolute electrical parameters I/O voltage ALDO_OUT Storage temperature Power supply voltage TAMB-25 TAMB-25

-40 1.6 1.8

Ts VCC ESD voltage

(human body model) ESD voltage

(machine model) 3.2 Operating conditions Parameter Description Minimum value Typical value Maximum value

-20 85 Ta VCC VCHG VIL V~IH Operating tempera-

ture Operating voltage Voltage for charger Voltage low input Voltage high input Unit V V 1.8 3.3 4.3 4.75

-0.3 5.25 0.3* VDDIO V 0.7*VDDIO VDDIO+0.3 V

5

11 / 30 3 Electrical parameters Parameter Description Minimum value Typical value Maximum value Unit Voltage low output

Voltage high output 1.8

0.33

V V The test condition for the above high/low voltage input/output is: VDDI/O = 3.3V. 3.3 Power consumption in operating mode Symbol Conditions Maximum value

(Typical value) VOL VOH Itx Irx IDC IDC Ideepsleep Unit mA mA mA mA uA 14.3 Constantly transmit with the output power of 40 dBm Constantly receive 15.7 Average value in mesh networking state Peak value in mesh networking state Average value in deep sleep state

(reserve RAM) 5 21.2 6.2 12 / 30 4 RF parameters 4 RF parameters 4.1 Basic RF features Wireless standard Data transmission rate Antenna type 4.2 RF output power Parameter Description Operating frequency 2.4 GHz ISM band Bluetooth LE 5.0 1 Mbps, 2 Mbps PCB antenna Parameter Typical value Maximum value Minimum value

-20

4 2500 5

4.3 RF receiving sensitivity Average RF output power Bandwidth of 20-dB modulation signal (1M) Parameter Receiving sensitivity 1 Mbps Frequency offset error 1 Mbps Minimum value Typical value Maximum value

-96

-250

+300 KHz 13 / 30 Unit dBm KHz Unit dBm 5 Audio CODEC parameters Unit Bits V dB dB dB mV V uA uA uA uA uA uA 5 Audio CODEC parameters 5.1 Digital to analog converter (single channel) Parameter Condition Minimum value Typical value Maximum value SNR

92 Conversion precision

Sampling rate (Fs)*

8 Synchronous clock signal 1/48dB

-48 3dB 0 65 Digital gain Analog gain Full-scale output voltage Stopband attenua-

tion

VDDA=2.9V-

1500 16 48 32 30

:::info The test condition for sampling rate (Fs):

Fin=1kHz B/W=20Hz20KHz A-Weighted THD_N<0.01%

Fs (8K, 16K, 32K, 44.1K, 48K) :::

5.2 Analog to digital converter (single channel) 14 / 30 5 Audio CODEC parameters Parameter Condition Minimum value Typical value Maximum value Conversion precision

Sampling rate (Fs)*

SNR Digital gain Analog gain

8 Synchronous clock signal Weighted/non-

weighted

1/48dB

-48 3dB 0

79 16 48

32 30 Unit Bits V dB dB dB uA uA uA uA 15 / 30 6 Antenna information 6 Antenna information 6.1 Antenna type 6.2 Interference reduction BF8H-N uses the PCB antenna with a gain of 1.4 dBi. To ensure the best RF performance, it is recommended that the antenna be at least If metal materials are wrapped around the 15 mm away from other metal parts. antenna, the wireless signal will be greatly attenuated, thereby deteriorating the RF performance. When designing the finished product, please leave enough space for the antenna. 16 / 30 6 Antenna information 17 / 30 7 Packaging information and production instructions 7 Packaging information and production instructions 7.1 Mechanical dimensions 18 / 30 7 Packaging information and production instructions 19 / 30 7 Packaging information and production instructions The following is a schematic diagram of BF8H-N which shows how pins correspond to each other:

20 / 30 7 Packaging information and production instructions Recommended PCB footprint 21 / 30 7 Packaging information and production instructions The default outline dimension tolerance is 0.35 mm, and the critical dimension 22 / 30 7 Packaging information and production instructions tolerance is 0.1 mm. them clearly in the datasheet after communication. If you have specific requirements on dimensions, specify 7.2 Production instructions 1. The Tuya SMT module should be mounted by the SMT device. After being un-

packed, it should be soldered within 24 hours. Otherwise, it should be put into the drying cupboard where the RH is not greater than 10%; or it needs to be packaged under vacuum again and the exposure time needs to be recorded

(the total exposure time cannot exceed 168 hours). SMT devices:

Mounter SPI Reflow soldering machine Thermal profiler Automated optical inspection (AOI) equipment Baking devices:

Cabinet oven Anti-electrostatic and heat-resistant trays Anti-electrostatic and heat-resistant gloves 2. Storage conditions for a delivered module:

The moisture-proof bag must be placed in an environment where the tem-

perature is below 40C and the relative humidity is lower than 90%. The shelf life of a dry-packaged product is 12 months from the date when the product is packaged and sealed. There is a humidity indicator card (HIC) in the packaging bag. 23 / 30 7 Packaging information and production instructions 3. The module needs to be baked in the following cases:

The packaging bag is damaged before unpacking. There is no HIC in the packaging bag. After unpacking, circles of 10% and above on the HIC become pink. The total exposure time has lasted for over 168 hours since unpacking. More than 12 months has passed since the sealing of the bag. 4. Baking settings:

Temperature: 60C and 5% RH for reel package and 125C and 5%

RH for tray package (please use the heat-resistant tray rather than plastic container) Time: 48 hours for reel package and 12 hours for tray package Alarm temperature: 65C for reel package and 135C for tray package Production-ready temperature after natural cooling: < 36C Re-baking situation: If a module remains unused for over 168 hours after being baked, it needs to be baked again. If a batch of modules is not baked within 168 hours, do not use the reflow soldering to solder them. Because these modules are Level-3 moisture-

sensitive devices, they are very likely to get damp when exposed beyond the allowable time. In this case, if they are soldered at high temperatures, it may result in device failure or poor soldering. 5. In the whole production process, take electrostatic discharge (ESD) protective 24 / 30 7 Packaging information and production instructions measures. 6. To guarantee the passing rate, it is recommended that you use the SPI and AOI to monitor the quality of solder paste printing and mounting. 7.3 Recommended oven temperature curve Set oven temperatures according to the following temperature curve of reflow sol-

dering. The peak temperature is 245C. A: Temperature axis B: Time axis C: Liquidus temperature: 217 to 220C D: Ramp-up slope: 1 to 3C/s E: Duration of constant temperature: 60 to 120s; the range of constant tem-

perature: 150 to 200C F: Duration above the liquidus: 50 to 70s G: Peak temperature: 235 to 245C H: Ramp-down slope: 1 to 4C/s The above curve is just an example of the solder paste SAC305. For more details about other solder pastes, please refer to Recommended oven temperature curve 25 / 30 7 Packaging information and production instructions in the solder paste specifications. 7.4 Storage conditions 26 / 30 8 MOQ and packaging information 8 MOQ and packaging information Product model MOQ (pcs) Packaging method The number of modules per reel The number of reels per carton BF8H-N 4000 Tape reel 1000 4 27 / 30 9 Appendix: Statement 9 Appendix: Statement FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the users authority to operate this device. This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and

(2) this device must accept any interference received, including interference that may cause undesired operation. This device has been tested and found to comply with the limits for a Class B digital device, according to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This device generates, uses, and can radiate radio frequency energy and, if not installed and used following the instructions, may cause harmful interference to radio com-

munications. However, there is no guarantee that interference will not occur in a particular installation. If this device does cause harmful interference to radio or television reception, which can be determined by turning the device off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

Reorient or relocate the receiving antenna. Increase the separation between the device and receiver. Connect the device into an outlet on a circuit different from that to which the receiver is connected. Consult the dealer or an experienced radio/TV technician for help. Radiation Exposure Statement This device complies with FCC radiation exposure limits set forth for an uncontrolled rolled environment. This device should be installed and operated with a minimum distance of 20cm between the radiator and your body. Important Note This radio module must not be installed to co-locate and operating simultaneously with other radios in the host system except following FCC multi-transmitter product procedures. Additional testing and device authorization may be required to operate simultaneously with other radios. The availability of some specific channels and/or operational frequency bands are country dependent and are firmware programmed at the factory to match the in-

tended destination. The firmware setting is not accessible by the end-user. 28 / 30 9 Appendix: Statement The host product manufacturer is responsible for compliance with any other FCC rules that apply to the host not covered by the modular transmitter grant of certi-

fication. The final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed. The end-user manual shall include all required regulatory information/warnings as shown in this manual, including This product must be installed and operated with a minimum distance of 20 cm between the radiator and user body. This device has got an FCC ID: 2ANDL-BF8H-N. The end product must be labeled in a visible area with the following: Contains Transmitter Module FCC ID: 2ANDL-BF8H-

N. This device is intended only for OEM integrators under the following conditions:

The antenna must be installed such that 20cm is maintained between the antenna and users, and the transmitter module may not be co-located with any other trans-

mitter or antenna. As long as the 2 conditions above are met, further transmitter tests will not be re-

quired. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed. Declaration of Conformity European Notice Hereby, Hangzhou Tuya Information Technology Co., Ltd declares that this module product is in compliance with essential requirements and other relevant provisions of Directive 2014/53/EU, 2011/65/EU. A copy of the Declaration of conformity can be found at https://www.tuya.com. 29 / 30 9 Appendix: Statement This product must not be disposed of as normal household waste, in accordance with the EU directive for waste electrical and electronic equipment (WEEE-2012/19/EU). Instead, it should be disposed of by returning it to the point of sale, or a municipal recycling collection point. The device could be used with a separation distance of 20cm to the human body. 30 / 30

Company: Hangzhou Tuya Information Technology Co.,Ltd Address: Room701,Building3,More Center,No.87 GuDun Road, Hangzhou,Zhejiang, China Tel: 86-571-86581786 Fax: 86-571-86581786 Date (12/01/2022) TUV SUD America Inc. 10 Centennial Drive Peabody, MA 01960, USA Dear Sir or Madam, We, (Hangzhou Tuya Information Technology Co.,Ltd), hereby authorize Jiaxi Xu rom TV SD Certification and Testing (China) Co., Ltd. Shanghai Branch 3-13, No.151 Heng Tong Road Shanghai 201108 P.R. China, to act as our agent in all matters relating to applications for equipment authorization, including the signing of all documents relating to these matters. Yours sincerely, Name:

Title: Manager

Company: Hangzhou Tuya Information Technology Co.,Ltd Address: Room701,Building3,More Center,No.87 GuDun Road, Hangzhou,Zhejiang, China Tel: 86-571-86581786 Fax: 86-571-86581786 Date (12/01/2022) Federal Communications Commission Equipment Authorization Branch 7435 Oakland Mills Road Columbia, MD 21046 Confidentiality Request FCC ID: 2ANDL-BF8H-N Pursuant to Sections 0.457(d)(1)(ii) and 0.459 of the Commissions Rules, (Hangzhou Tuya Information Technology Co.,Ltd) hereby requests permanent confidential treatment of information accompanying this application as outlined below:

Schematics Block Diagrams Theory of Operation The above materials contain trade secrets and proprietary information not customarily released to the public. The public disclosure of these matters might be harmful to the Applicant and provide unjustified benefits to its competitors. The Applicant understands that pursuant to Rule 0.457(d)(1)(ii), disclosure of this Application and all accompanying materials will not be made before the date of the Grant for this Application. Yours sincerely, Name:

Title: Manager

Company: Hangzhou Tuya Information Technology Co.,Ltd Address: Room701,Building3,More Center,No.87 GuDun Road, Hangzhou,Zhejiang, China Tel: 86-571-86581786 Fax: 86-571-86581786 Date (12/01/2022) Federal Communications Commission Equipment Authorization Branch 7435 Oakland Mills Road Columbia, MD 21046 Modular Approval Request FCC ID: 2ANDL-BF8H-N The following attestation addresses the requirements to support modular approval:

Modular approval requirement Yes (provide brief statement) No *

(a) The radio elements must have the radio frequency circuitry shielded. Physical components and tuning capacitor(s) may be located external to the shield, but must be on the module assembly

(b) The module must have buffered modulation/data inputs to ensure that the device will comply with Part 15 requirements with any type of input signal

(c) The module must contain power supply regulation on the module

(d) The module must contain a permanently attached antenna, or contain a unique antenna connector, and be marketed and operated only with specific antenna(s), per Sections 15.203, 15.204(b), 15.204(c), 15.212(a), 2.929(b) The module has a metal shied. Refer to the external photo of EUT. Data to the modulation circuit is buffered as described in the operational description provided with the application. The module contains its own power supply regulation. Please refer to schematic filed with this application. The module has a PCB antenna and which permanently attached the module. Refer to the photo of EUT.

(e) The module must demonstrate compliance in a stand-alone configuration The module was tested stand-alone as shown in test setup photographs filed with this application. The FCC ID is printed on the label of the module. Refer to the label of EUT.

(f) The module must be labelled with its permanently affixed FCC ID label, or use an electronic display (See KDB Publication 784748 about labelling requirements)

(g) The module must comply with all specific rules applicable to the transmitter. The grantee must provide comprehensive instructions to explain compliance requirements The module comply with all specific rules.Refer to the datasheet. Modular approval requirement Yes (provide brief statement)

(h) The module must comply with RF exposure requirements Please refer exhibition RF Exposure for the compliance of MPE RF exposure rule.

* Please provide a detailed explanation if the answer is No. Yours sincerely, Name:

Title:

Manager