FCC ID: 2ANDL-BTFM-G Bluetooth Module

Global Intelligent Platform Product Manual Tuya BTFM-G01 BLE Module Version: 1.0.0 Date: 2013-01-14 No.: 0000000001 1 Product Overview BTFM-G01 is a low-power embedded Bluetooth module developed by Tuya Smart that supports Apple's Find My function. It consists of a highly integrated radio frequency chip, a three-axis acceleration sensor chip and peripheral devices, and has a built-in Bluetooth network communication protocol stack and rich library functions. BTFM-G01 includes low-power ARM Cortex CPU, Bluetooth 5.1 protocol stack, 512KB Flash, 128KB RAM and 10 I/O ports with specific functions. 1.1 Features Built-in low-power ARM Cortex microprocessor, supporting floating-point operations Main frequency up to 64MHz Power Consumption 30uA/MHz Working voltage: 2.2V-3.6V Peripherals: 6GPIOs, 1Data UART, 1Log UART and 1ADC BLE RF features Compatible with BLE 5.1 Up to 2 Mbit/s RF data rate TX power: +7 dBm RX sensitivity: 97 dBm at BLE 1 Mbit/s TX transmit current: 3.05mA @0dBm,1Mbps RX receive current: 3.9mA @1Mbps Onboard PCB antenna with 1.61 dBi gain Working temperature: 20C to +65C BTFM-G01 Datasheet 1.2 Applications Smart Outdoor Products Consumer products requiring anti-lost functionalitySmart households 2 Datasheet Change History BTFM-G01 No. Date Change Description Version After Change 1 2023-0114 This is the first release. 1.0.0 3 Datasheet BTFM-G01 Contents 1 Product Overview ...............................................................................................................1 1.1 Features ...................................................................................................................1 1.2 Applications ..............................................................................................................2 Change History ..................................................................................................................... 3 2 Module Interfaces .............................................................................................................. 5 2.1 Dimensions and Footprint ....................................................................................... 5 2.2 Interface Pin Definition ............................................................................................ 6 3 Electrical Parameters .........................................................................................................8 3.1 Absolute Electrical Parameters ............................................................................... 8 3.2 Electrical Conditions ................................................................................................8 4 RF Features ..................................................................................................................... 10 4.1 Basic RF Features .................................................................................................10 4.2 RF Output Power ...................................................................................................10 4.3 RF RX Sensitivity .................................................................................................. 10 5 Antenna Information .........................................................................................................12 5.1 Antenna Type .........................................................................................................12 5.2 Antenna Interference Reduction ........................................................................... 12 6 Packaging Information and Production Instructions...........................................................14 6.1 Mechanical Dimensions ........................................................................................ 14 6.2 Production Instructions ..........................................................................................15 6.3 Recommended Oven Temperature Curve ............................................................17 6.4 Storage Conditions ................................................................................................18 7 Appendix: Statement ........................................................................................................19 4 BTFM-G01 Datasheet 2 Module Interfaces 2.1 Dimensions and Footprint BTFM-G01 has two rows of pins with a 1.5mm pin spacing. The BTFM-G01 dimensions are 15mm0.35 (W)21mm0.35 (L)2.85mm(H). Figure 2-1 shows the BTFM-G01 pins. Figure 2-1 BTFM-G01 pins 5 Datasheet 2.2 Interface Pin Definition BTFM-G01 Table 2-1 BTFM-G01 interface pins Pin No. Symbol I/O Type Function 1 2 3 4 5 6 7 8 9 10 11 12 IO7 Output Serial port UART1_TX, corresponding to P11 of IC, for log printout IO31 Output Audio square wave signal output, frequency is, corresponding to P34 of IC IO17 Output Control the EN2 pin of DC009S, corresponding to P33 of IC IO16 Output Control the EN1 pin of DC009S, corresponding to P32 of IC AIO3 Output Used to indicate the working status of the module, corresponding to P28 of the IC AIO1 Output Used to drive the LED indicator light of the status of the display module, corresponding to the IC P27 AIO0 Input For key detection, corresponding to P26 of IC 3V3 P Power supply pin (3.3 V) IO0 Output Serial port UART0_TX, corresponding to P4 of the IC, is used as the serial port for user docking IO1 Input Serial port UART0_RX, corresponding to P5 of the IC, is used as the users docking serial port GND P Power supply reference ground pin ADC Input ADC port, 13 bits, used for battery voltage 6 Datasheet BTFM-G01 Symbol I/O Type Function detection, corresponding to P24 of IC CEN Input Hardware reset pin (active low), corresponding to IC's CHIPEN GND P Power supply reference ground pin Pin No. 13 14 Note:

1. P indicates power supply pins, I/O indicates input/output pins. 7 BTFM-G01 Datasheet 3 Electrical Parameters 3.1 Absolute Electrical Parameters Table 3-1 Absolute electrical parameters Parameter Description Minimum Value Maximum Value Unit Ts VBAT Storage temperature Power supply voltage 20 65 C 0.3 3.6 V Static electricity voltage

(human body model) Static electricity voltage

(machine model) Tamb - 25C N/A 2 kV Tamb - 25C N/A 0.5 kV 3.2 Electrical Conditions Table 3-2 Normal electrical conditions Parameter Description Minimum Value Typical Value Maximum Value Unit Ta VCC VIL Working temperature Working voltage I/O low-level 20 N/A 65 C 2.2 3.3 3.6 V VSS N/A 0.3VBAT V 8 Datasheet BTFM-G01 Parameter Description Minimum Value Typical Value Maximum Value Unit input I/O high-level input I/O low-level output I/O high-level output IO drive current VIH VOL VOH Imax 0.7VBAT N/A VBAT V VSS N/A VSS+0.4 V VBAT-0.4 N/A VBAT V N/A N/A 2.5 mA 9 BTFM-G01 Datasheet 4 RF Features 4.1 Basic RF Features Table 4-1 Basic RF features Parameter Description Frequency band 2.4 GHz ISM band Wireless standard BLE 5.1 Data transmission rate 1 Mbps,2 Mbps,500 kbps,125 kbps Antenna type Onboard PCB antenna 4.2 RF Output Power Table 4-2 Power during constant transmission Parameter Minimum Value Typical Value Maximum Value Unit Average RF output power 20 0 7 dBm 4.3 RF RX Sensitivity Table 4-3 RX sensitivity Parameter Minimum Value Typical Value Maximum Value Unit RX sensitivity 1 Mbit/s N/A 97 N/A dBm 10 Datasheet BTFM-G01 Parameter Minimum Value Typical Value Maximum Value Unit 2 Mbit/s N/A 93 N/A 11 BTFM-G01 Datasheet 5 Antenna Information 5.1 Antenna Type BTFM-G01 uses an onboard PCB antenna. 5.2 Antenna Interference Reduction To ensure optimal RF performance, it is recommended that the antenna be at least 15 mm away from other metal parts. If metal materials are wrapped around the antenna, the wireless signals will be reduced greatly, deteriorating the RF performance. Because BTFM-G01 is inserted to the PCB, sufficient space needs to be reserved for the antenna. 12 Datasheet BTFM-G01 13 Datasheet 6 Packaging Information and Production Instructions BTFM-G01 6.1 Mechanical Dimensions Figure 6-1 BTFM-G01 mechanical dimensions Note:

The default dimensional tolerance is 0.35 mm, and the tolerance for some measurements is 0.1 mm. If a customer has other requirements, clearly specify them in the datasheet after communication. 14 Datasheet Recommended footprint BTFM-G01 6.2 Production Instructions 1. Use an SMT placement machine to mount components to the stamp hole module that Tuya produces within 24 hours after the module is unpacked and the firmware is burned. If not, vacuum pack the module again. Bake the module before mounting components to the module.

(1) SMT placement equipment i. Reflow soldering machine ii. Automated optical inspection (AOI) equipment iii. Nozzle with a 6 mm to 8 mm diameter

(2) Baking equipment i. Cabinet oven ii. Anti-static heat-resistant trays iii. Anti-static heat-resistant gloves 2. Storage conditions for a delivered module are as follows:

15 Datasheet BTFM-G01

(1) The moisture-proof bag is placed in an environment where the temperature is below 30C and the relative humidity is lower than 70%.

(2) The shelf life of a dry-packaged product is six months from the date when the product is packaged and sealed.

(3) The package contains a humidity indicator card (HIC). Figure 6-2 HIC for BTFM-G01 3. Bake a module based on HIC status as follows when you unpack the module package:

(1) If the 30%, 40%, and 50% circles are blue, bake the module for 2 consecutive hours.

(2) If the 30% circle is pink, bake the module for 4 consecutive hours.

(3) If the 30% and 40% circles are pink, bake the module for 6 consecutive hours.

(4) If the 30%, 40%, and 50% circles are pink, bake the module for 12 consecutive hours. 4. Baking settings:

(1) Baking temperature: 1255C

(2) Alarm temperature: 130C

(3) SMT placement ready temperature after natural cooling: < 36C

(4) Number of drying times: 1

(5) Rebaking condition: The module is not soldered within 12 hours after baking. 5. Do not use SMT to process modules that have unpacked for over three months. Electroless nickel immersion gold (ENIG) is used for the PCBs. If the solder pads are exposed to the air for over three months, they will be oxidized severely and dry joints or solder skips may occur. Tuya is not liable for such problems and consequences. 16 Datasheet BTFM-G01 6. Before SMT placement, take electrostatic discharge (ESD) protective measures. 7. To reduce the reflow defect rate, draw 10% of the products for visual inspection and AOI before first SMT placement to determine a proper oven temperature and component placement method. Draw 5 to 10 modules every hour from subsequent batches for visual inspection and AOI. 6.3 Recommended Oven Temperature Curve Perform SMT placement based on the following reflow oven temperature curve. The highest temperature is 245C. Based on the IPC/JEDEC standard, perform reflow soldering on a module at most twice. Figure 6-3 Oven temperature curve 17 Datasheet 6.4 Storage Conditions BTFM-G01 18 8 Appendix: Statement 7 Appendix: Statement FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the users authority to operate this device. The module is limited to installation in mobile or fixed applications. This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and

(2) this device must accept any interference received, including interference that may cause undesired operation. Note: This device has been tested and found to comply with the limits for a Class B digital device, according to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential instal- lation. This device generates, uses, and can radiate radio frequency energy and, if not installed and used following the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this device does cause harmful interference to radio or television reception, which can be determined by turning the device off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

Reorient or relocate the receiving antenna. Increase the separation between the device and receiver. Connect the device to an outlet on a circuit different from that to which the receiver is connected. Consult the dealer or an experienced radio/TV technician for help. Radiation Exposure Statement This device complies with FCC radiation exposure limits set forth for an uncontrolled rolled environment. This device should be installed and operated with a minimum distance of 20cm between the radiator and your body. Important Note This radio module must not be installed to co-locate and operate simultaneously with other radios in the host system except by following FCC multi-transmitter prod- uct procedures. Additional testing and device authorization may be required to operate simultaneously with other radios. The availability of some specific channels and/or operational frequency bands are 19 8 Appendix: Statement country dependent and are firmware programmed at the factory to match the in- tended destination. The firmware setting is not accessible to the end-user. The host product manufacturer is responsible for compliance with any other FCC rules that apply to the host not covered by the modular transmitter grant of certifi- cation. The final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed. The separate approval is required for all other op- erating configurations including portable configurations with respect to Part 2.1093 and different antenna configuration. The end-user manual shall include all required regulatory information/warnings as shown in this manual, including This product must be installed and operated with a minimum distance of 20 cm between the radiator and user body. The OEM integrator is responsible for ensuring that the end-user has no manual instructions to remove or install module. This device has got an FCC ID: 2ANDL-BTFM-G. The end product must be labeled in a visible area with the following: Contains Transmitter Module FCC ID: 2ANDL-BTFM-G. This device is intended only for OEM integrators under the following conditions:

The antenna must be installed such that 20cm is maintained between the antenna and users, and the transmitter module may not be co-located with any other trans- mitter or antenna. As long as the 2 conditions above are met, further transmitter tests will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed. Declaration of Conformity European Notice Hereby, Hangzhou Tuya Information Technology Co., Ltd declares that this module product is in compliance with essential requirements and other relevant provisions of Directive 2014/53/EU, 2011/65/EU. A copy of the Declaration of conformity can be found at https://www.tuya.com. 20 8 Appendix: Statement This product must not be disposed of as normal household waste, in accordance with the EU directive for waste electrical and electronic equipment (WEEE-2012/19/EU). Instead, it should be disposed of by returning it to the point of sale, or to a municipal recycling collection point. The device could be used with a separation distance of 20cm from the human body. 21

Hangzhou Tuya Information Technology Co.,Ltd. Federal Communications Commission Authorization and Evaluation Division 7435 Oakland Mills Road Columbia, MD 21046 USA Date: 2023/6/16 Ref: Attestation Statements Part 2.911(d)(7) Filing FCC ID: 2ANDL-BTFM-G Hangzhou Tuya Information Technology Co.,Ltd. certifies that, as of the date of the filing of the application, Eric Shen is our designated U.S. agent for service of process for the above referenced FCC ID:

2ANDL-BTFM-G accepts to maintain an agent for no less than one year after the grantee has terminated all marketing and importation or the conclusion of any Commission-related proceeding involving the equipment. Eric Shen accepts, as of the date of the filing of the application, the obligation of the designated U.S. agent for service of process for the above referenced FCC ID. Designated U.S. Agent Information:

Name: Tuya Global Inc. Address: 333 West San Carlos Street Suite 600 San Jose, CA 95110 Contact Person: Eric Shen Tel.: 626-215-3367 Email: eric.shen@tuya.com Sincerely, Hangzhou Tuya Information Technology Co.,Ltd. Linyun Li Tuya Global Inc. Eric Shen Rev 1/26/2023

Company: Hangzhou Tuya Information Technology Co.,Ltd Address: Room701,Building3,More Center,No.87 GuDun Road, Hangzhou,Zhejiang, China Tel: 86-571-86581786 Fax: 86-571-86581786 Date: 07-02-2023 To: Federal Communications Commission Authorization and Evaluation Division 7435 Oakland Mills Road Columbia, MD 21046 USA Ref: Attestation Statements Part 2.911(d)(5)(i) and Part 2.911(d)(5)(ii) Filing Re. KDB 986446 D01 FCC ID: 2ANDL-BTFM-G Dear Sir or Madam, Hangzhou Tuya Information Technology Co.,Ltd certifies that the equipment for which authorization is sought is not covered equipment prohibited from receiving an equipment authorization pursuant to section 2.903 of the FCC rules. We also certify that, Hangzhou Tuya Information Technology Co.,Ltd certifies that, as of the date of the filing of the application, the applicant is not identified on the Covered List ( as a specifically named entity or any of its subsidiaries or affiliates) as an entity producing covered equipment . If you have any questions, please contact us. Sincerely, Contact name: Linyun Li Company name: Hangzhou Tuya Information Technology Co.,Ltd Address: Room701,Building3,More Center,No.87 GuDun Road, Hangzhou,Zhejiang, China E-mail: lily@tuya.com

Company: Hangzhou Tuya Information Technology Co.,Ltd Address: Room701,Building3,More Center,No.87 GuDun Road, Hangzhou,Zhejiang, China Tel: 86-571-86581786 Fax: 86-571-86581786 Difference Declaration We,Hangzhou Tuya Information Technology Co.,Ltd. certifies that,model(s):

BTFM-G02 is the same as BTFM-G01 except model name and software.The difference between model name and software does not affect EMC and RF tests. Sincerely, Signature:

Name:Lily Li Title: Senior Certification Expert Email: lily@tuya.com

Company: Hangzhou Tuya Information Technology Co.,Ltd Address: Room701,Building3,More Center,No.87 GuDun Road, Hangzhou,Zhejiang, China Tel: 86-571-86581786 Fax: 86-571-86581786 Date (06/06/2023) TUV SUD BABT UNLIMITED TCB Octagon House, Segensworth North, Fareham, Hampshire, PO15 5RL, United Kingdom Dear Sir or Madam, We, (Hangzhou Tuya Information Technology Co.,Ltd Room701,Building3,More Center,No.87 GuDun Road, Hangzhou, Zhejiang, China), hereby authorize Jiaxi XU from TV SD Certification and Testing (China) Co., Ltd. Shanghai Branch 3-13, No.151 Heng Tong Road Shanghai 201108 P.R. China to act as our agent in all matters relating to applications for equipment authorization, including the signing of all documents relating to these matters. This authorization expires on (Dec. 30, 2023). Sincerely, Company Officer:

Linyun Li

Company: Hangzhou Tuya Information Technology Co.,Ltd Address: Room701,Building3,More Center,No.87 GuDun Road, Hangzhou,Zhejiang, China Tel: 86-571-86581786 Fax: 86-571-86581786 Date (06/06/2023) TUV SUD BABT UNLIMITED TCB Octagon House, Segensworth North, Fareham, Hampshire, PO15 5RL, United Kingdom Confidentiality Request FCC ID: 2ANDL-BTFM-G Pursuant to Sections 0.457(d)(1)(ii) and 0.459 of the Commissions Rules, (Hangzhou Tuya Information Technology Co.,Ltd) hereby requests permanent confidential treatment of information accompanying this application as outlined below:

Schematics Block Diagrams Theory of Operation The above materials contain trade secrets and proprietary information not customarily released to the public. The public disclosure of these matters might be harmful to the Applicant and provide unjustified benefits to its competitors. The Applicant understands that pursuant to Rule 0.457(d)(1)(ii), disclosure of this Application and all accompanying materials will not be made before the date of the Grant for this Application. Yours sincerely, Company Officer:

Company Officer:

Linyun Li

Company: Hangzhou Tuya Information Technology Co.,Ltd Address: Room701,Building3,More Center,No.87 GuDun Road, Hangzhou,Zhejiang, China Tel: 86-571-86581786 Fax: 86-571-86581786 Date (06/06/2023) Federal Communications Commission Equipment Authorization Branch 7435 Oakland Mills Road Columbia, MD 21046 Modular Approval Request FCC ID: 2ANDL-BTFM-G The following attestation addresses the requirements to support modular approval:

Modular approval requirement Yes (provide brief statement) No *

(a) The radio elements must have the radio frequency circuitry shielded. Physical components and tuning capacitor(s) may be located external to the shield, but must be on the module assembly

(b) The module must have buffered modulation/data inputs to ensure that the device will comply with Part 15 requirements with any type of input signal

(c) The module must contain power supply regulation on the module The module has a metal shied. Refer to the external photo of EUT. Data to the modulation circuit is buffered as described in the operational description provided with the application. The module contains its own power supply regulation. Please refer to schematic filed with this application.

(d) The module must contain a permanently attached antenna, or The module has a PCB antenna and which permanently attached Company: Hangzhou Tuya Information Technology Co.,Ltd Address: Room701,Building3,More Center,No.87 GuDun Road, Hangzhou,Zhejiang, China Tel: 86-571-86581786 Fax: 86-571-86581786 contain a unique antenna connector, and be marketed and operated only with specific antenna(s), per Sections 15.203, 15.204(b), 15.204(c), 15.212(a), 2.929(b)

(e) The module must demonstrate compliance in a stand-alone configuration

(f) The module must be labelled with its permanently affixed FCC ID label, or use an electronic display (See KDB Publication 784748 about labelling requirements)

(g) The module must comply with all specific rules applicable to the transmitter. The grantee must provide comprehensive instructions to explain compliance requirements the module. Refer to the photo of EUT. The module was tested stand-

alone as shown in test setup photographs filed with this application. The FCC ID is printed on the label of the module. Refer to the label of EUT. The module comply with all specific rules. Refer to the datasheet. Modular approval requirement Yes (provide brief statement) No *

(h) The module must comply with RF exposure requirements Please refer exhibition RF Exposure for the compliance of MPE RF exposure rule.

* Please provide a detailed explanation if the answer is No. Yours sincerely, Name:

Title:

Manager

WARNING:pdfminer.pdfpage:The PDF <_io.BufferedReader name='/Volumes/Scratch/Incoming/eg-scratch/6722072.pdf'> contains a metadata field indicating that it should not allow text extraction. Ignoring this field and proceeding. Use the check_extractable if you want to raise an error in this case Report No: 709502303484-00B MPE Calculation Applicant:

Address:

Hangzhou Tuya Information Technology Co.,Ltd Room701,Building3,More Center,No.87 GuDun Road,Hangzhou,Zhejiang China Product:

Bluetooth Module FCC ID:

2ANDL-BTFM-G Model No.: BTFM-G01, BTFM-G02 Reference RF report #

709502303484-00A According to subpart 15.247(i) and subpart 1.1307(b)(1), systems operating under the provisions of this section shall be operated in a manner that ensures that the public is not exposed to radio frequency energy level in excess of the Commissions guidelines. Limits for Maximum Permissible Exposure (MPE) (1.1310, 2.1091)

(B) Limits for General Population/Uncontrolled Exposure Frequency Range

(MHz) Electric Field Strength (V/m) Magnetic Field Strength (A/m) Power Density

(mW/cm2) Averaging Time

(minutes) 0.31.34 1.3430 30300 3001,500 1,500100,000 614 824/f 27.5

1.63 2.19/f 0.073

*(100)

*(180/f) 0.2 f/1500 1.0 30 30 30 30 30 f = frequency in MHz; * = Plane-wave equivalent power density;

According to 1.1310 and 2.1091 RF exposure is calculated. Calculated Formulary:

Predication of MPE limit at a given distance S = PG/4R = power density (in appropriate units, e.g. mW/cm2);

P = power input to the antenna (in appropriate units, e.g., mW);

G = power gain of the antenna in the direction of interest relative to an isotropic radiator, the power gain factor, is normally numeric gain;

R = distance to the center of radiation of the antenna (appropriate units, e.g., cm);

EMC_SHA_F_R_02.06E TV SD Certification and Testing (China) Co., Ltd. Shanghai Branch 3-13, No.151, Heng Tong Road, Shanghai, 200070, P.R. China Phone: +86 21 61410123, Fax:+86 21 61408600 Page 1 of 2 Rev. 20.00 Report No: 709502303484-00B Calculated Data: onboard PCB Antenna For 2.4GHz BLE (Report number: 709502303484-00A) Maximum peak output power at antenna input terminal (dBm):

Maximum peak output power at antenna input terminal (mW):

Prediction distance (cm):

Antenna Gain, typical (dBi):

Maximum Antenna Gain (numeric):

The worst case is power density at predication frequency at 20 cm (mW/cm2):

MPE limit for general population exposure at prediction frequency (mW/cm2):

The max power density 0.0016 (mW/cm2) < 1 (mW/cm2) Result: Compliant

- TV SD Certification and Testing (China) Co., Ltd. Shanghai Branch Reviewed by:

Prepared by:

Tested by:

7.57 5.71 20 1.61 1.45 0.0016 1.00 _____________________ _____________________ ______________________ Hui TONG Wenqiang LU Yiquan WANG EMC Section Manager EMC Project Engineer EMC Test Engineer Date: 08-09, 2023 Date: 08-09, 2023 Date: 08-09, 2023 EMC_SHA_F_R_02.06E TV SD Certification and Testing (China) Co., Ltd. Shanghai Branch 3-13, No.151, Heng Tong Road, Shanghai, 200070, P.R. China Phone: +86 21 61410123, Fax:+86 21 61408600 Page 2 of 2 Rev. 20.00