Global Intelligent Platform WBR3D Datasheet Product Manual Tuya WBR3D Wi-Fi Module Version: 1.0 Date: 2019-08-23 No.: 0000000001 1. Product Overview WBR3D is a low-power embedded Wi-Fi and Bluetooth module that Tuya has developed. It consists of a highly integrated RF chip (RTL8720DN) and several peripheral components, with an embedded Wi-Fi network protocol stack, Bluetooth network protocol, and robust library functions. WBR3D is embedded with a low-power 32-bit CPU, 512 KB static random-access memory (SRAM), and 4 MB flash memory, and has extensive peripherals. WBR3D is an RTOS platform that integrates all function libraries of the Wi-Fi MAC and TCP/IP protocols. You can develop embedded Wi-Fi products as required. Embedded low-power 32-bit CPU, which can also function as an application 1.1 Features processor Dominant frequency: up to 200 MHz Working voltage: 3.0 V to 3.6 V and one analog-to-digital converter (ADC) Wi-Fi connectivity Peripherals: eight GPIOs, one universal asynchronous receiver/transmitter (UART), 802.11a/b/g/n 1T1R, 2.4 GHz and 5 GHz capable Channels 1 to 14 at 2.4 GHz and channels 36 to 177 at 5 GHz WPA and WPA2 security modes Up to +19 dBm output power in 802.11b mode and up to +16 dBm in 802.11a mode STA, AP, and STA+AP working modes 1 Smart and AP network configuration modes for Android and iOS devices Onboard PCB antenna with 2 dBi at 2.4 GHz and 2.6 dBi at 5 GHz Working temperature: 20C to +85C WBR3D Datasheet Smart household and home appliances 1.2 Applications Intelligent building Smart socket and light Industrial wireless control Baby monitor Network camera Intelligent bus 2 WBR3D Datasheet Change History No. Date Change Description Version After Change 1 2019-08-30 This is the first release. 1.0.0 3 WBR3D Datasheet Contents 1. Product Overview........................................................................................................................ 1 1.1 Features.............................................................................................................................. 1 1.2 Applications........................................................................................................................ 2 2. WBR3D Label...............................................................................................................................6 3. Module Interfaces........................................................................................................................ 7 3.1 Dimensions and Footprint................................................................................................ 7 3.2 Interface Pin Definition..................................................................................................... 8 3.3 Test Pin Definition..............................................................................................................9 4. Electrical Parameters................................................................................................................10 4.1 Absolute Electrical Parameters.....................................................................................10 4.2 Electrical Conditions....................................................................................................... 10 4.3 RF Current........................................................................................................................ 11 4.4 Working Current...............................................................................................................11 5. RF Features................................................................................................................................12 5.1 Basic RF Features.......................................................................................................... 12 5.2 TX Performance.............................................................................................................. 12 5.3 RX Performance..............................................................................................................14 6. Antenna Information.................................................................................................................. 14 6.1 Antenna Type................................................................................................................... 14 6.2 Antenna Interference Reduction................................................................................... 14 6.3 Antenna Connector Specifications............................................................................... 15 7. Packaging Information and Production Instructions............................................................16 7.1 Mechanical Dimensions................................................................................................. 16 7.2 Recommended PCB Encapsulation............................................................................ 17 7.3 Production Instructions...................................................................................................18 7.4 Recommended Oven Temperature Curve.................................................................. 20 7.5 Storage Conditions.................................................................................................... 21 4 8 Reference Circuit........................................................................................................................ 22 WBR3D Datasheet 8.1 Circuit Schematic Diagram............................................................................................22 Appendix: Statement.................................................................................................................... 24 Tables Table 3-1 WBR3D interface pins....................................................................................................8 Table 3-2 WBR3D test pins.............................................................................................................9 Table 4-1 Absolute electrical parameters...................................................................................10 Table 4-2 Normal electrical conditions....................................................................................... 10 Table 4-3 Current during constant transmission....................................................................... 11 Table 4-4 WBR3D working current..............................................................................................11 Table 5-1 Basic RF features.........................................................................................................12 Table 5-2 Performance during constant transmission at 2.4 GHz.........................................12 Table 5-3 Performance during constant transmission at 5 GHz............................................ 13 Table 5-4 RX sensitivity................................................................................................................ 14 Figure 3-1 WBR3D front and rear views...................................................................................... 7 Figure 6-1 Antenna placement.................................................................................................... 15 Figure 7-1 WBR3D mechanical dimensions............................................................................. 16 Figure 7-2 Side view......................................................................................................................17 Figure 7-3 WBR3D pins................................................................................................................17 Figure 7-4 PCB encapsulation diagram of WBR3D.................................................................18 Figure 7-5 HIC for WBR3D.......................................................................................................... 19 Figure 7-6 Oven temperature curve........................................................................................... 20 Figures 5 2. WBR3D Label WBR3D Datasheet Model: module model P/N: product number S/N: serial number CE: European Conformity marking RoHS: RoHS compliance logo 6 WBR3D Datasheet 3. Module Interfaces 3.1 Dimensions and Footprint WBR3D has two rows of pins with a 2 mm pin spacing. The WBRD3 dimensions (H x W x D) are 3.5 mm x 16 mm x 24 mm. Figure 3-1 shows the front and rear views. Figure 3-1 WBR3D front and rear views Note:
The common appearance tolerance is 0.3 mm. The tolerance of positions that involve plug-in assembly is 0.1 mm. The thickness tolerance of a 1 mm thick PCB is 0.1 mm. 7 3.2 Interface Pin Definition WBR3D Datasheet 1 2 3 4 5 6 7 8 9 Table 3-1 WBR3D interface pins Pin No. Symbol I/O Type Function RST I/O Hardware reset pin (The module has an internal pull-up resistor, and the reset pin is active at a low level.) ADC AI 10-bit precision SAR ADC (See the following Note 2.) EN Input Module enabling pin, which is connected to 3.3 V for normal use GPIO_16, which needs to be connected to a 10-kiloohm pull-up resistor when being used GPIO16 I/O GPIO14 GPIO12 GPIO13 VCC GND I/O I/O I/O P P GPIO_14 GPIO_12 GPIO_13 8 Power supply pin (3.3 V) Power supply reference ground pin 10 GPIO15 Output GPIO_15 (used during module power-on and initialization; use it with caution) Pin No. Symbol I/O Type Function GPIO2 Output UART0_TXD (used to display the module internal information) WBR3D Datasheet I/O I/O I/O I/O GPIO0 GPIO4 GPIO5 RXD0 TXD0 GPIO_0 (used during module power-on and initialization; use it with caution) GPIO_04 GPIO_05 UART0_RXD (See the following Note 3.) Output UART0_TXD (See the following Note 3.) 11 12 13 14 15 16 Note:
1. P indicates power supply pins, I/O indicates input/output pins, and AI indicates analog input pins. RST is only a hardware reset pin and cannot clear the Wi-Fi network configuration. 2. This pin can only function as an ADC input and not a common I/O. If this pin is not used, it must be disconnected. When this pin is used as the ADC input, the input voltage range is 0 V to 1.0 V. 3. UART0 is a user-side serial interface, which generates information when the module is powered on and starts. 3.3 Test Pin Definition Table 3-2 WBR3D test pins Pin No. Symbol I/O Type Function N/A TEST Input Used for the module production test Note:
Test pins are not recommended. 9 4. Electrical Parameters 4.1 Absolute Electrical Parameters WBR3D Datasheet Table 4-1 Absolute electrical parameters Parameter Description Minimum Maximum Unit Value Value Ts VCC Static electricity voltage
(human body model) Static electricity voltage
(machine model) Storage temperature Power supply voltage 20 0.3 Tamb = 25C N/A Tamb = 25C N/A 85 3.6 2 0.5 4.2 Electrical Conditions Table 4-2 Normal electrical conditions Parameter Description Minimum Maximum Unit Value Value Typical Value Ta VCC VIL VIH VOL Working temperature Power supply voltage I/O low-level input I/O high-level input I/O low-level output 20 3.0 N/A 85 C 3.3 3.6 0.3 N/A VCC x 0.25 VCC x 0.75 N/A VCC N/A N/A VCC x 0.1 10 C V kV kV V V V V Parameter Description Minimum Maximum Unit Value Value Typical Value WBR3D Datasheet VOH Imax I/O high-level output I/O drive current VCC x 0.8 N/A VCC N/A N/A 12 4.3 RF Current Working Status TX at 2.4 GHz TX at 5 GHz Table 4-3 Current during constant transmission and receiving Parameter Typical Value Unit Mode Rate TX Power/Receiving 802.11b 11 Mbit/s
+18 dBm 802.11g 54 Mbit/s
+17 dBm 802.11n HT20 MCS7
+16 dBm 802.11n HT40 MCS7
+16 dBm 802.11g 54 Mbit/s
+15 dBm 802.11n HT20 MCS0
+15 dBm 802.11n HT20 MCS7
+14 dBm 250 180 170 150 300 230 220 4.4 Working Current Table 4-4 WBR3D working current Working Mode Working Status (Ta = 25C) Maximum Unit Average Value Value EZ AP The module is in EZ mode, and the Wi-Fi indicator blinks quickly. The module is in AP mode, and the Wi-Fi indicator blinks slowly. 11 V mA mA mA mA mA mA mA mA mA mA Working Status (Ta = 25C) Maximum Unit Average Value Value WBR3D Datasheet Working Mode Connected Disconnected The module is connected to the network, and the Wi-Fi indicator is steady on. The module is disconnected from the network, and the Wi-Fi indicator is steady off. mA mA 5. RF Features 5.1 Basic RF Features Table 5-1 Basic RF features Parameter Description Frequency band 2.412 GHz to 2.484 GHz; 5.18 GHz to 5.825 GHz Wi-Fi standard IEEE 802.11a/b/g/n (Channels 1 to 14 and 36 to 177) Data transmission rate 802.11a/g: 6, 9, 12, 18, 24, 36, 48, or 54 (Mbit/s)
(Ch 1-13 for CE, Ch 1-11 for FCC ) 802.11b: 1, 2, 5.5, or 11 (Mbit/s) 802.11n: HT20 MCS0 to MCS7 802.11n: HT40 MCS0 to MCS7 Antenna type PCB antenna with a gain of 2 dBi at 2.4 GHz and 2.6 dBi at 5 GHz 5.2 TX Performance Table 5-2 Performance during constant transmission at 2.4 GHz Parameter Minimum Value Typical Value Value Maximum Unit Average RF output power, 802.11b CCK mode 11 Mbit/s N/A 17 N/A dBm 12 WBR3D Datasheet Parameter Minimum Value Typical Value Value Maximum Unit 54 Mbit/s N/A N/A dBm MCS7 N/A N/A dBm MCS7 N/A N/A dBm Average RF output power, 802.11g OFDM mode Average RF output power, 802.11n HT20 mode Average RF output power, 802.11n HT40 mode Frequency error EVM under 802.11b CCK, 11 Mbit/s, 17.5 dBm EVM under 802.11g OFDM, 54 Mbit/s, 15.0 dBm EVM under 802.11n OFDM, MCS7, 14.0 dBm 10 N/A N/A N/A N/A
+10 16.5 N/A 33.1 N/A 32.2 N/A Table 5-3 Performance during constant transmission at 5 GHz Parameter Minimum Value Typical Value Value Maximum Unit 54 Mbit/s N/A N/A dBm MCS7 N/A N/A dBm MCS7 N/A N/A dBm 16 15 14 14 13 12 Average RF output power, 802.11a OFDM mode Average RF output power, 802.11n HT20 mode Average RF output power, 802.11n HT40 mode Frequency error EVM under 802.11b CCK, 11 Mbit/s, 17.5 dBm EVM under 802.11g OFDM, 54 Mbit/s, 15.0 dBm EVM under 802.11n OFDM, MCS7, 14.0 dBm ppm dB dB dB ppm dB dB dB N/A
+10 16.5 N/A 33.1 N/A 32.2 N/A 10 N/A N/A N/A 13 WBR3D Datasheet 5.3 RX Performance Table 5-4 RX sensitivity Parameter Minimum Value Typical Value Maximum Value Unit 11 Mbit/s N/A 91 N/A dBm 54 Mbit/s N/A 75 N/A dBm HT20 MCS7 N/A 72 N/A dBm PER < 8%, 802.11b CCK mode PER < 10%, 802.11a/g OFDM mode PER < 10%, 802.11n OFDM mode 6. Antenna Information 6.1 Antenna Type WBR3D uses an onboard PCB antenna. 6.2 Antenna Interference Reduction To ensure optimal Wi-Fi performance when the Wi-Fi module uses an onboard PCB antenna, it is recommended that the antenna be at least 15 mm away from other metal parts. To prevent adverse impact on the antenna radiation performance, avoid copper or traces along the antenna area on the PCB. Ensure that there are no substrate media above or below the antenna and that copper is at a certain distance away from the antenna to maximize the antenna radiation performance. 14 WBR3D Datasheet Figure 6-1 Antenna placement For details about the onboard PCB antenna area on WBR3D, see Figure 7-1. 6.3 Antenna Connector Specifications WBR3D does not use an antenna connector. 15 7. Packaging Information and Production Instructions WBR3D Datasheet 7.1 Mechanical Dimensions Figure 7-1 WBR3D mechanical dimensions 16 WBR3D Datasheet Figure 7-2 Side view The default dimensional tolerance is 0.3 mm. If a customer has other requirements, clearly specify them in the datasheet after communication. 7.2 Recommended PCB Encapsulation Figure 7-3 WBR3D pins 17 WBR3D Datasheet Figure 7-4 PCB encapsulation diagram of WBR3D 7.3 Production Instructions 1. Use an SMT placement machine to mount components to the stamp hole module that Tuya produces within 24 hours after the module is unpacked and the firmware is burned. If not, vacuum pack the module again. Bake the module before mounting components to the module.
(1) SMT placement equipment i. Reflow soldering machine ii. Automated optical inspection (AOI) equipment iii. Nozzle with a 6 mm to 8 mm diameter 18 WBR3D Datasheet
(2) Baking equipment i. Cabinet oven ii. Anti-static heat-resistant trays iii. Anti-static heat-resistant gloves 2. Storage conditions for a delivered module are as follows:
(1) The moisture-proof bag is placed in an environment where the temperature is below 30C and the relative humidity is lower than 70%.
(2) The shelf life of a dry-packaged product is six months from the date when the product is packaged and sealed.
(3) The package contains a humidity indicator card (HIC). Figure 7-5 HIC for WBR3D 3. Bake a module based on HIC status as follows when you unpack the module package:
(1) If the 30%, 40%, and 50% circles are blue, bake the module for 2 consecutive hours.
(2) If the 30% circle is pink, bake the module for 4 consecutive hours.
(3) If the 30% and 40% circles are pink, bake the module for 6 consecutive hours.
(4) If the 30%, 40%, and 50% circles are pink, bake the module for 12 consecutive hours. 4. Baking settings:
(1) Baking temperature: 1255C
(2) Alarm temperature: 130C
(3) SMT placement ready temperature after natural cooling: < 36C
(4) Number of drying times: 1 19 WBR3D Datasheet
(5) Rebaking condition: The module is not soldered within 12 hours afterbaking. 5. Do not use SMT to process modules that have unpacked for over three months. Electroless nickel immersion gold (ENIG) is used for the PCBs. If the solder pads are exposed to the air for over three months, they will be oxidized severely and dry joints or solder skips may occur. Tuya is not liable for such problems and consequences. 6. Before SMT placement, take electrostatic discharge (ESD) protectivemeasures. 7. To reduce the reflow defect rate, draw 10% of the products for visual inspection and AOI before first SMT placement to determine a proper oven temperature and component placement method. Draw 5 to 10 modules every hour from subsequent batches for visual inspection and AOI. 7.4 Recommended Oven Temperature Curve Perform SMT placement based on the following reflow oven temperature curve. The highest temperature is 245C. Figure 7-6 Oven temperature curve 20 7.5 Storage Conditions WBR3D Datasheet 21 WBR3D Datasheet Appendix: Statement Federal Communications Commission (FCC) Declaration of Conformity FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate this equipment. This device complies with Part 15 of the FCC Rules.Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Note: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules.These limits are designed to provide reasonable protection against harmful installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:
Reorient or relocate the receiving antenna. Increase the separation between the equipment and receiver. Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. Consult the dealer or an experienced radio/TV technician for help. this equipment does cause harmful interference in a residential If Radiation Exposure Statement:
This equipment complies with FCC radiation exposure limits set forth for an uncontrolled rolled environment. This equipment should be installed and operated with minimum distance 20cm between the radiator and your body. The final end product must be labeled in a visible area with the following: Contains Transmitter Module 2ANDL-WBR3D This radio module must not installed to co-locate and operating simultaneously with other radios in host system except in accordance with FCC multi-transmitter product procedures. Additional testing and equipment authorization may be required to operating simultaneously with other radio. The availability of some specific channels and/or operational frequency bands are country dependent and are firmware programmed at the factory to match the intended destination. The firmware setting is not accessible by the end user. The host product manufacturer is responsible for compliance to any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. The final requires Part 15 Subpart B compliance testing with the modular host product still transmitter required regulatory information/warning as shown in this manual, including: This product must be installed and operated with a minimum distance of 20 cm between the radiator and user body. installed. The end user manual shall include all 22 Declaration of Conformity European notice WBR3D Datasheet Hereby, Hangzhou Tuya Information Technology Co., Ltd. declares that product of Directive 2014/53/EU. A copy of https://www.tuya.com. this module relevant provisions the Declaration of conformity can be found at is in compliance with essential requirements and other The device is restricted to indoor use only when operating in the 5150 to 5350 MHz frequency range. AT EE IT PT BE FI LV RO BG FR LT SK HR DE LU SI CY EL MT ES CZ HU NL SE DK IE PL UK This product must not be disposed of as normal household waste, in accordance with EU directive for waste electrical and electronic equipment (WEEE- 2012/19/EU). Instead it should be disposed of by returning it to the point of sale, or to a municipal recycling collection point. 23