AXY3S Module Datasheet Version: 20211102 Online Version Contents Contents 1.1 Features . 2 1.2 Applications . 2 2.1 Dimensions and footprint
. 3 2.2 Pin definition . 5
. 10 3.1 Absolute electrical parameters 3.2 Working conditions
. 10 3.3 RF power consumption . 11 3.4 Power consumption during working . 12 4.1 Basic RF features
. 14 4.2 TX performance . 14 1 Product overview 2 Module interfaces 3 Electrical parameters 4 RF parameters 5 Antenna information 5.1 Antenna type . 19 5.2 Antenna interference reduction . 19 6 Packaging information and production instructions
. 20 6.1 Mechanical dimensions
. 23 6.2 Recommended PCB footprint 6.3 Production instructions
. 26 6.4 Recommended oven temperature curve . 27 6.5 Storage conditions . 30 7 MOQ and packaging information 8 Appendix: Statement 2 3 10 14 19 20 31 32 I Contents AXY3S is a low-power-consumption embedded Wi-Fi 6+Bluetooth module that Tuya has developed. Embedded with the Wi-Fi network protocol stack and rich library functions, it consists of a highly integrated wireless RF chip (ECR6600-TS2D). 1 / 34 1 Product overview 1 Product overview With the maximum clock rate of 240 MHz, AXY3S also contains a low-power-
consumption Andes D10 MCU, a WLAN MAC, a 1T1R WLAN, a 292-KB SRAM, a 2-MB flash memory, and extensive peripherals. AXY3S is an RTOS platform that integrates all function libraries of the Wi-Fi MAC and TCP/IP. You can develop embedded Wi-Fi products as required. 1.1 Features Embedded with a low-power-consumption Andes D10 MCU, which can also func-
tion as an application processor Main clock rate: 240 MHz Operating voltage: 3.0 to 3.6 V Peripherals: 7 GPIOs, 1 Data UART, 1 Log UART, and 1 ADC Wi-Fi and Bluetooth connectivity:
802.11 B/G/N20/N40/AX20 Channels 1 to 14@2.4 GHz (CH1 to 11 for US/CA and CH1 to 13 for EU/CN) Support WEP, WPA, WPA2, and WPA2 PSK (AES) security modes Support Bluetooth Low Energy 5.1 Up to +20 dBm output power in 802.11b mode Support uplink/downlink MU-OFDMA Support fast network configuration via Wi-Fi for Android and iOS devices Onboard PCB antenna Certified by CE and FCC Operating temperature: -40 to 85 1.2 Applications Intelligent buildings Smart household and home appliances Smart socket and light Industrial wireless control Baby monitor Network camera Intelligent bus 2 / 34 2 Module interfaces 2 Module interfaces 2.1 Dimensions and footprint AXY3S has 2 lines of pins with a pin spacing of 2.0 mm. Each line has 8 pins. The dimensions of AXY3S are 16.000.35 mm (W)24.000.35 mm (L) 2.80.15 mm (H). The dimensions of AXY3S are as follows:
3 / 34 2 Module interfaces 4 / 34 2 Module interfaces 2.2 Pin definition 5 / 34 2 Module interfaces Reset pin, reset at a low level. The module has been pulled to a high level and the user can control the pin externally. Correspond to Pin 26 of the IC. GPIO_20, common GPIO, which can be used as ADC. The range of input voltage is 0 to 3.3V. Correspond to Pin 27 of the IC. Work as a reset pin, active at a low level. The module has been pulled to a high level and the user can control the pin externally. Correspond to Pin26 of the IC. GPIO_21, common GPIO, correspond to Pin 6 of the IC GPIOA_24, hardware PWM, correspond to Pin 8 of the IC Pin number Symbol Function RST Type I/O 1 2 3 4 5 ADC I/O EN I/O P21 P24 I/O I/O 6 / 34 Pin number Symbol 6 7 8 9 10 11 P25 P22 VBAT GND P00 L_TX 2 Module interfaces Function GPIOA_25, hardware PWM, Pin 7 of the IC GPIOA_22, hardware PWM, Pin 4 of the IC Power supply pin
(3.3V) Power supply reference ground GPIO_00, common GPIO, which can be reused as Pin 25 of the IC GPIO_13, UART_Log_TXD
(used to send information about the internal logs of the module), which can be configured as a common GPIO and corresponds to Pin 5 of the IC Type I/O I/O P P I/O I/O 7 / 34 2 Module interfaces GPIO_17, UART_Log_RXD
(used to receive information about the external logs of the module), which can be configured as a common GPIO and corresponds to Pin 9 of the IC GPIO_15, common GPIO, hardware PWM, correspond to Pin 28 on the internal IC GPIO_14, common GPIO, hardware PWM, correspond to Pin 29 on the internal IC GPIO_05, UART0_RXD (user serial interface), correspond to Pin 20 of the IC GPIO_06, UART0_TXD (user serial interface), correspond to Pin 19 of the IC Pin number Symbol Function 6 L_RX Type I/O 13 14 15 16 P15 I/O P14 I/O RXD I/O TXD I/O 8 / 34 Note: P indicates a power supply pin and I/O indicates an input/output pin. 2 Module interfaces 9 / 34 Parameter Description Minimum value Maximum value Unit 3 Electrical parameters 125 3.6 2 0.5 V KV KV Unit V V V V 85 3.6 0.3vdd vdd 0.1vdd 3 Electrical parameters 3.1 Absolute electrical parameters Storage temperature Power supply voltage TAMB-25 TAMB-25
-40
-0.3
Ts VDD ESD voltage
(human body model) ESD voltage
(machine model) 3.2 Working conditions Ta VDD VIL VIH VOL Operating tempera-
ture Operating voltage Voltage input low Voltage input high Voltage output low
-40 3.0 0
0.7vdd
10 / 34 Parameter Description Minimum value Typical value Maximum value Parameter Description Minimum value Typical value Maximum value 3 Electrical parameters Symbol Mode Power Average value Peak value
(Typical value) VOH Imax Cpad Voltage output high 0.9vdd Drive current Input pin capacitance
4 2 3.3 RF power consumption TX power consumption:
IRF IRF IRF IRF IRF IRF IRF IRF IRF IRF 11b 1Mbps 17dBm 11b 11Mbps 17dBm 11g 6Mbps 17dBm 11g 54Mbps 15dBm 17dBm 308 304 214 175 217 11n HT20 MCS0 11n HT20 MCS7 11n HT40 MCS0 11n HT40 MCS7 MCS0 11ax HE20 MCS7 14dBm 179 15dBm 191 13dBm 169 11ax HE20 17dBm 213 14dBm 179 11 / 34 Unit V mA pF Unit mA mA mA mA mA mA mA mA mA mA
310 305 215 176 218 180 192 170 214 180 3 Electrical parameters RX power consumption:
Symbol Mode Average value Peak value
(Typical value) Unit 32 32 33 34 33 34 37 38 32 32 mA mA mA mA mA mA mA mA mA mA IRF IRF IRF IRF IRF IRF IRF IRF IRF IRF 11B 1M 11B 11M 11G 6M 11G 54M 11N HT20 MCS0 11N HT20 MCS7 11N HT40 MCS0 11N HT40 MCS7 11AX HE20 MCS0 11AX HE20 MCS7 32 32 33 34 33 34 37 38 32 32 Working status, TA =
25C The module is in fast network configuration state and the Wi-Fi indicator flashes slowly 12 / 34 3.4 Power consumption during working Working mode Average value Peak value
(Typical value) Unit 40 210 mA Fast network configuration
(AP) 3 Electrical parameters Working mode Average value Peak value
(Typical value) Unit 40 197 mA Fast network configuration
(EZ) Fast network configuration
(Bluetooth) No operation during network connection Operations are being performed during network connection Disconnected state The router is not powered Working status, TA =
25C The module is in fast network configuration state and the Wi-Fi indicator flashes fast The module is in fast network configuration state and the Wi-Fi indicator flashes fast The module is connected to the network and the Wi-Fi indicator is always on The module is connected to the network and the Wi-Fi indicator is always on The module is disconnected and the Wi-Fi indicator is off The module is disconnected and the Wi-Fi indicator is off 41 184 mA 34 52 mA 36 61 mA 35 34 51 84 mA mA 13 / 34 4 RF parameters 4 RF parameters 4.1 Basic RF features Parameter Description Frequency range Wi-Fi standard 2.400 to 2.4835 GHz IEEE 802.11b/g/n/ax (channels 1 to 14) Bluetooth standard Bluetooth 5.1 Data transmission rate 11b: 1, 2, 5.5, and 11 (Mbps) Data transmission rate 11g: 6, 9, 12, 18, 24, 36, 48, 54 (Mbps) Data transmission rate 11n: HT20 MCS0 to 7 Data transmission rate 11n: HT40 MCS0 to 7 Data transmission rate 11ax: HE20 MCS0 to 7 Antenna type PCB antenna with a gain of 1.81 dBi Parameter Typical value Minimum value Maximum value 4.2 TX performance TX performance
Average RF output power, 802.11b CCK Mode 1M Average RF output power, 802.11b CCK Mode 11M Average RF output power, 802.11g OFDM Mode 6M Unit dBm dBm dBm
17 17 17 14 / 34 Parameter Typical value Minimum value Maximum value 4 RF parameters
Average RF output power, 802.11g OFDM Mode 54M Average RF output power, 802.11n HT20 OFDM Mode MCS0 Average RF output power, 802.11n HT20 OFDM Mode MCS7 Average RF output power, 802.11n HT40 OFDM Mode MCS0 Average RF output power, 802.11n HT40 OFDM Mode MCS7 Average RF output power, 802.11ax HE20 OFDMA Mode MCS0 Unit dBm dBm dBm dBm dBm dBm
15 17 14 15 13 17 15 / 34 Parameter Typical value Minimum value Maximum value 4 RF parameters Frequency error
-20
Average RF output power, 802.11ax HE20 OFDMA Mode MCS7 Average RF output power, Bluetooth 5.1 2M EVM@802.11b CCK 11Mbps Mode 17dBm EVM@802.11g OFDM 54Mbps Mode 15dBm EVM@802.11n HT20 OFDM MCS7 Mode 14dBm EVM@802.11n HT40 OFDM MCS7 Mode 13dBm EVM@802.11ax OFDMA MCS7 Mode 14dBm RX Performance
20
-10
-29
-30 Unit dBm dBm ppm dB dB dB
-30 dB
-32 dB 14 7
16 / 34 4 RF parameters Minimum value Typical value Maximum value
Parameter PER<8%RX sensitivity, 802.11b CCK Mode 1M PER<8%RX sensitivity, 802.11b CCK Mode 11M PER<10%, RX sensitivity, 802.11g OFDM Mode 6M PER<10%, RX sensitivity, 802.11g OFDM Mode 54M PER<10%RX sensitivity, 802.11n HT20 OFDM Mode MCS0 PER<10%RX sensitivity, 802.11n HT20 OFDM Mode MCS7 PER<10%RX sensitivity, 802.11n HT40 OFDM Mode MCS0 Unit dBm dBm dBm dBm dBm dBm dBm
-95
-86
-90
-74
-90
-71
-86 17 / 34 Parameter Typical value Minimum value Maximum value 4 RF parameters
PER<10%RX sensitivity, 802.11n HT40 OFDM Mode MCS7 PER<10%, RX sensitivity, 802.11ax OFDMA Mode MCS0 PER<10%, RX sensitivity, 802.11ax OFDMA Mode MCS7 PER<10%, RX sensitivity, Bluetooth 5.1 1M PER<10%, RX sensitivity, Bluetooth 5.1 2M Unit dBm dBm dBm dBm dBm
-68
-90
-70
-93
-91
18 / 34 5 Antenna information 5 Antenna information 5.1 Antenna type AXY3S uses only the onboard PCB antenna with a gain of 1.81 dBi. 5.2 Antenna interference reduction To ensure optimal Wi-Fi performance when the Wi-Fi module uses an onboard PCB antenna, it is recommended that the antenna be at least 15 mm away from other metal parts. 19 / 34 6 Packaging information and production instructions 6 Packaging information and production instructions 6.1 Mechanical dimensions The mechanical dimensions of the PCB of AXY3S are 16.00.35 mm (W)24.00.35 mm (L) 0.80.1 mm (H). The following figure shows the mechanical dimensions of AXY3S:
20 / 34 6 Packaging information and production instructions 21 / 34 6 Packaging information and production instructions 22 / 34 6 Packaging information and production instructions Note: The default dimensional tolerance is 0.35 mm. If customers have spe-
cific requirements on dimensions, they should make them clear in the module datasheet after communication. 6.2 Recommended PCB footprint Schematic diagram of AXY3S which shows how pins are located:
23 / 34 6 Packaging information and production instructions PCB footprint of AXY3S:
24 / 34 6 Packaging information and production instructions 25 / 34 6 Packaging information and production instructions 6.3 Production instructions 1. For the modules that can be packaged with the SMT or in an in-line way, you can select either of them according to the PCB design solutions of customers. If a PCB is designed to be SMT-packaged, package the module with the SMT. If a PCB is designed to be in-line-packaged, package the module in an in-line way. After being unpacked, the module must be soldered within 24 hours. Otherwise, it needs to be put into the drying cupboard where the relative humidity is not greater than 10%; or it needs to be packaged again under vacuum and the exposure time needs to be recorded (the total exposure time cannot exceed 168 hours).
(SMT process) SMT devices:
Mounter SPI Reflow soldering machine Thermal profiler Automated optical inspection (AOI) equipment
(Wave soldering process) Wave soldering devices Wave soldering equipment Wave soldering fixture Constant-temperature soldering iron Tin bar, tin wire and flux Thermal profiler Baking devices:
Cabinet oven Anti-electrostatic and heat-resistant trays Anti-electrostatic and heat-resistant gloves 2. Storage conditions for a delivered module:
The moisture-proof bag must be placed in an environment in which the temperature is below 40C and the relative humidity is lower than 90%. The shelf life of a dry-packaged product is 12 months from the date when the product is packaged and sealed. There is a humidity indicator card (HIC) in the packaging bag. 26 / 34 6 Packaging information and production instructions
![HIC -SMT and in -line module .png ]( https :// airtake -public -data -12541 1 2 53901. cos.ap - shanghai . myqcloud .com/goat /20210410/2 c61fd34d2a6464d8cb 3 ee05f63689786 .png) 3. The module needs to be baked in the following cases:
The packaging bag is damaged before unpacking. There is no humidity indicator card (HIC) in the packaging bag. After unpacking, circles of 10% and above on the HIC become pink. The total exposure time has lasted for over 168 hours since unpacking. More than 12 months has passed since sealing of the bag. 4. Baking settings:
Temperature: 60C and 5% RH for reel package and 125C and 5%
RH for tray package (please use the heat-resistant tray rather than plastic container) Time: 48 hours for reel package and 12 hours for tray package Alarm temperature: 65C for reel package and 135C for tray package Production-ready temperature after natural cooling: < 36C Re-baking situation: If a module remains unused for over 168 hours after being baked, it needs to be baked again. If a batch of modules is not baked within 168 hours, do not use the reflow soldering or wave soldering to solder them. Because these modules are Level-3 moisture-sensitive devices, they are very likely to get damp when exposed beyond the allowable time. In this case, if they are soldered at high temperatures, it may result in device failure or poor soldering. 5. In the whole production process, take electrostatic discharge (ESD) protective measures. 6. To guarantee the passing rate, it is recommended that you use the SPI and AOI to monitor the quality of solder paste printing and mounting. 6.4 Recommended oven temperature curve Select a proper soldering manner according to the process. For the SMT process, please refer to the recommended oven temperature curve of reflow soldering. For the wave soldering process, please refer to the recommended oven temperature curve of wave soldering. There are some differences between the set temperatures and the actual temperatures. All the temperatures shown in this module datasheet are obtained through actual measurements. 27 / 34 6 Packaging information and production instructions Manner 1: SMT process (Recommended oven temperature curve of reflow soldering) Set oven temperatures according to the following curve. A: Temperature axis B: Time axis C: Liquidus temperature: 217 to 220C D: Ramp-up slope: 1 to 3C/s perature: 150 to 200C F: Duration above the liquidus: 50 to 70s G: Peak temperature: 235 to 245C H: Ramp-down slope: 1 to 4C/s E: Duration of constant temperature: 60 to 120s; the range of constant tem-
Note: The above curve is just an example of the solder paste SAC305. For more details about other solder pastes, please refer to Recommended oven temperature curve in the solder paste specifications. Manner 2: Wave soldering process (Oven temperature curve of wave sol-
dering) 28 / 34 6 Packaging information and production instructions Set oven temperatures according to the following temperature curve of wave sol-
dering. The peak temperature is 260C5C. Suggestions on manual soldering temperature Soldering temperature 80 to 130 C 36020C Preheat time 75 to 100s Soldering time 3s/point Suggestions on oven temperature curve of wave soldering Preheat temperature Peak contact time 3 to 5s Temperature of tin cylinder 2605C Ramp-up slope 2C/s Ramp-down slope 6C/s NA NA NA NA NA NA NA NA 29 / 34 6 Packaging information and production instructions 6.5 Storage conditions 30 / 34 7 MOQ and packaging information 7 MOQ and packaging information Product model MOQ (pcs) Packaging method The number of modules per reel The number of reels per carton AXY3S 3600 Tape reel 900 4 31 / 34 8 Appendix: Statement 8 Appendix: Statement FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the users authority to operate this device. This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and
(2) this device must accept any interference received, including interference that may cause undesired operation. Note: This device has been tested and found to comply with the limits for a Class B digital device, according to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential instal-
lation. This device generates, uses, and can radiate radio frequency energy and, if not installed and used following the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this device does cause harmful interference to radio or television reception, which can be determined by turning the device off and on, the user is encouraged to try to correct the interference by one or more of the following measures:
Reorient or relocate the receiving antenna. Increase the separation between the device and receiver. Connect the device into an outlet on a circuit different from that to which the receiver is connected. Consult the dealer or an experienced radio/TV technician for help. Radiation Exposure Statement This device complies with FCC radiation exposure limits set forth for an uncontrolled rolled environment. This device should be installed and operated with a minimum distance of 20cm between the radiator and your body. Important Note This radio module must not be installed to co-locate and operate simultaneously with other radios in the host system except following FCC multi-transmitter product procedures. Additional testing and device authorization may be required to operate simultaneously with other radios. The availability of some specific channels and/or operational frequency bands are country dependent and are firmware programmed at the factory to match the in-
tended destination. The firmware setting is not accessible by the end-user. 32 / 34 8 Appendix: Statement The host product manufacturer is responsible for compliance with any other FCC rules that apply to the host not covered by the modular transmitter grant of certi-
fication. The final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed. The end-user manual shall include all required regulatory information/warnings as shown in this manual, including This product must be installed and operated with a minimum distance of 20 cm between the radiator and user body. This device has got an FCC ID: 2ANDL-AXY3S. The end product must be labelled in a visible area with the following:Contains Transmitter Module FCC ID: 2ANDL-AXY3S
. This device is intended only for OEM integrators under the following conditions:
The antenna must be installed such that 20cm is maintained between the antenna and users, and the transmitter module may not be co-located with any other trans-
mitter or antenna. As long as the 2 conditions above are met, further transmitter tests will not be re-
quired. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed. Declaration of Conformity European Notice Hereby, Hangzhou Tuya Information Technology Co., Ltd declares that this module product complies with essential requirements and other relevant provisions of Direc-
tive 2014/53/EU, 2011/65/EU. A copy of the Declaration of conformity can be found at https://www.tuya.com. 33 / 34 8 Appendix: Statement This product must not be disposed of as normal household waste, by the EU directive for waste electrical and electronic equipment (WEEE-2012/19/EU). Instead, it should be disposed of by returning it to the point of sale, or a municipal recycling collection point. The device could be used with a separation distance of 20cm. 34 / 34