CB3SE Module Datasheet
Version: 20210611
Online Version
Contents
Contents
1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
1.2 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
1.3 Change history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1 Product overview
2 Module interfaces
2.1 Dimensions and footprint
. . . . . . . . . . . . . . . . . . . . . . . . 3
2.2 Pin definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
. . . . . . . . . . . . . . . . . . . . . . . . 7
2.3 Definitions on test points
3 Electrical parameters
. . . . . . . . . . . . . . . . . . . . . 8
3.1 Absolute electrical parameters
3.2 Normal working conditions
. . . . . . . . . . . . . . . . . . . . . . . 9
3.3 RF power consumption . . . . . . . . . . . . . . . . . . . . . . . . . 9
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
3.4 Working current
4 RF parameters
4.1 Basic RF features
. . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
4.2 Wi-Fi transmission performance . . . . . . . . . . . . . . . . . . . . . 12
4.3 Wi-Fi receiving performance . . . . . . . . . . . . . . . . . . . . . . . 13
4.4 Bluetooth transmission performance . . . . . . . . . . . . . . . . . . 14
4.5 Bluetooth receiving performance . . . . . . . . . . . . . . . . . . . . 14
5 Antenna information
5.1 Antenna type . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
5.2 Antenna interference reduction . . . . . . . . . . . . . . . . . . . . . 15
6 Packaging information and production instructions
. . . . . . . . . . . . . . . . . . . . . . . . . 18
6.1 Mechanical dimensions
6.2 Production instructions
. . . . . . . . . . . . . . . . . . . . . . . . . 22
6.3 Recommended oven temperature curve . . . . . . . . . . . . . . . . . 23
6.4 Storage conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
7 MOQ and packaging information
2
3
8
12
14
18
26
i
8 Appendix: Statement
Contents
26
ii
Contents
CB3SE is an embedded low-power Wi-Fi module that Tuya has developed. It consists
of a highly integrated RF chip BK7231N and a few peripherals. CB3SE not only
supports the Wi-Fi AP and STA modes, but also supports the Bluetooth LE.
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1 PRODUCT OVERVIEW
1 Product overview
CB3SE is built in with a 32-bit MCU whose running speed can be up to 120 MHz, 2-MB
flash memory, and 256-KB RAM, so as to support the Tuya IoT cloud connection. The
MCU instructions specially extended for signal processing can effectively implement
audio encoding and decoding.
Besides, it has rich peripherals, such as PWM and UART. There are six 32-bit PWM
outputs, making the chip very suitable for high-quality LED control.
• Built in with the low-power 32-bit CPU, which can also function as an application
1.1 Features
processor
• The clock rate: 120 MHz
• Working voltage: 3.0 to 3.6V
• Peripherals: 15 PWMs and 1 UART
• Wi-Fi connectivity
– 802.11 b/g/n
– Channels 1 to 14@2.4 GHz
– Support WEP, WPA/WPA2, and WPA/WPA2 PSK (AES) security modes
– Up to +16 dBm output power in 802.11b mode
– Support STA/AP/STA+AP working mode
– Support SmartConfig and AP network configuration manners for Android
and iOS devices
– Onboard PCB antenna with a gain of 1.3 dBi
– Working temperature: -40℃ to 85℃
• Bluetooth connectivity
– Support the transmit power of 6 dBm in the Bluetooth mode
– Complete Bluetooth coexistence interface
– Onboard PCB antenna with a gain of 1.3 dBi
1.2 Applications
• Intelligent building
• Smart household and home appliances
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2 MODULE INTERFACES
• Smart socket and light
• Industrial wireless control
• Baby monitor
• Network camera
• Intelligent bus
1.3 Change history
2 Module interfaces
2.1 Dimensions and footprint
Update date
Updated content
Version after update
06/10/2021
This is the first release.
V1.0.0
The dimensions of CB3SE are 16.00±0.35 mm (W)×24.00±0.35 mm (L) ×2.8±0.15
mm (H). The dimensions of CB3SE are as follows:
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2 MODULE INTERFACES
2.2 Pin definition
Pin number
Symbol
I/O type
Function
1
NC
I
Directly
connected to Pin
3. Low level
reset, high level
active (the pin
has been pulled
high internally),
correspond to
CEN of the IC
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Pin number
Symbol
I/O type
Function
2 MODULE INTERFACES
2
3
4
5
6
7
8
9
10
ADC3
CEN
P14
P26
P24
P6
3V3
P15
P22
AI
I
I/O
I/O
I/O
I/O
P
I/O
I/O
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ADC pin, which
corresponds to
P23 of the IC
Enabling pin,
which is pulled
high internally to
be compatible
with other
modules
A common GPIO
interface, which
corresponds to
P14 of the IC
GPIOP_26, which
corresponds to
P26 of the IC,
PWM 5
GPIOP_24, which
corresponds to
P24 of the IC,
PWM 4
GPIOP_6,which
corresponds to P6
of the IC, PWM 0
Power supply pin
(3.3V)
GPIOP_15, which
corresponds to
P15 of the IC
GPIOP_22, which
corresponds to
P22 of the IC
Pin number
Symbol
I/O type
Function
2 MODULE INTERFACES
11
12
13
14
15
16
17
18
19
GND
P20
P17
P16
GND
P9
TXD2
P
I/O
I/O
I/O
P
I/O
I/O
RXD2
I/O
P8
I/O
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Power supply
reference ground
GPIOP_20, which
corresponds to
P20 of the IC
GPIOP_17, which
corresponds to
P17 of the IC
GPIOP_16, which
corresponds to
P16 of the IC
Power supply
reference ground
GPIOP_9, which
corresponds to P9
of the IC, PWM 3
UART2_TXD (used
to display the
module internal
information),
which
corresponds to P0
of the IC
UART2_RXD,
which
corresponds to P1
on the internal IC
GPIOP_8, which
corresponds to P8
of the IC, PWM 2
Pin number
Symbol
I/O type
Function
20
21
P7
RXD1
I/O
I/O
2 MODULE INTERFACES
GPIOP_7, which
corresponds to P7
of the IC, PWM 1
UART1_RXD (User
serial port), which
corresponds to
P10 of the IC Do
not pull it up. By
default, the
docking serial
port of the MCU
needs to be in low
level state or high
impedance state.
UART1_TXD (User
serial port), which
corresponds to
P11 of the IC Do
not pull it up. By
default, the
docking serial
port of the MCU
needs to be in
low-level state or
high-impedance
state.
22
TXD1
I/O
2.3 Definitions on test points
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3 ELECTRICAL PARAMETERS
Pin number
Symbol
I/O type
Function
-
CSN
I/O
It’s a mode
selection pin. If it
is connected to
ground before
being powered
on, enter the
firmware test
mode. If it is not
connected or
connected to VCC
before being
powered on, enter
the firmware
application mode.
Correspond to
P21 of the IC
Note: P indicates a power supply pin, I/O indicates an input/output pin, and AI
indicates an analog input pin. For the MCU solution, please refer to CBx Module.
3 Electrical parameters
3.1 Absolute electrical parameters
Parameter
Description
Minimum
value
Maximum
value
Ts
VBAT
Storage
temperature
Power supply
voltage
-55
-0.3
125
3.9
Unit
℃
V
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3 ELECTRICAL PARAMETERS
Parameter
Description
Minimum
value
Maximum
value
TAMB-25℃
-4
4
Unit
KV
TAMB-25℃
-200
200
V
ESD voltage
(human body
model)
ESD voltage
(machine
model)
3.2 Normal working conditions
Parameter
Description
Minimum
value
Typical
value
Maximum
value
Ta
-40
85
Unit
℃
Working
tempera-
ture
Power
supply
voltage
I/O low
level
output
I/O high
level
output
I/O drive
current
VBAT
3
3.3
3.6
V
VOL
VOH
VSS
VSS+0.3
V
VBAT-0. 3
VBAT
V
Imax
-
6
20
mA
3.3 RF power consumption
-
-
-
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3 ELECTRICAL PARAMETERS
Working
status
Mode
Rate
Transmit
power/
Receive
Average
value
Peak
value
(Typical
value)
Transmit
11b
11Mbps
+16dBm 81
Transmit
11g
54Mbps
+15dBm 82
Transmit
11n
MCS7
+14dBm 85
Receive
11b
11Mbps
Receive
11g
54Mbps
Receive
11n
MCS7
Constantly
receive
Constantly
receive
Constantly
receive
73
75
75
3.4 Working current
Unit
mA
mA
mA
mA
mA
mA
240
238
234
82
82
82
Working
status, Ta =
25°C
Average
value
Maximum
value (Typical
value)
63
245
Unit
mA
Working
mode
Quick
network
connection
state
(Bluetooth)
Quick
network
connection
state (AP)
The module is
in fast
network
connection
state and the
Wi-Fi indicator
flashes fast
The module is
in hotspot
network
connection
state and the
Wi-Fi indicator
flashes slowly
80
270
mA
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3 ELECTRICAL PARAMETERS
Working
status, Ta =
25°C
Average
value
Maximum
value (Typical
value)
78
246
Unit
mA
Working
mode
Quick
network
connection
state (EZ)
Connected
25
342
mA
The module is
in fast
network
connection
state and the
Wi-Fi indicator
flashes fast
The module is
connected to
the network
and the Wi-Fi
indicator is
always on
The module
and the
hotspot are
weakly
connected
and the Wi-Fi
indicator is
always on
The module is
disconnected
and the Wi-Fi
indicator is
always off
The CEN pin
of the module
is connected
to the ground.
Weakly
connected
205
350
mA
Disconnected
63
242
mA
Module
disabled
330
-
uA
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4 RF PARAMETERS
4 RF parameters
4.1 Basic RF features
Parameter
Description
Working frequency
2.412 to 2.484 GHz
Wi-Fi standard
IEEE 802.11 b/g/n (channels 1 to 14)
Data transmission rate
11b: 1, 2, 5.5, 11 (Mbps);
11g: 6, 9, 12, 18, 24, 36, 48, 54
(Mbps);
11n: HT20 MCS 0 to 7;
11n: HT40 MCS 0 to 7
Antenna type
PCB antenna
4.2 Wi-Fi transmission performance
Parameter
Typical value
Minimum
value
Maximum
value
16
15
-
-
Unit
dBm
dBm
-
-
Average RF
output power,
802.11b CCK
Mode 11M
Average RF
output power,
802.11g
OFDM Mode
54M
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4 RF PARAMETERS
Parameter
Typical value
Minimum
value
Maximum
value
14
-
-20
-
20
ppm
4.3 Wi-Fi receiving performance
Parameter
Typical value
Minimum
value
Maximum
value
-
-
-
-
-
Average RF
output power,
802.11n
OFDM Mode
MCS7
Frequency
error
PER<8%, RX
sensitivity,
802.11b
DSSS Mode
11M
PER<10%, RX
sensitivity,
802.11g
OFDM Mode
54M
PER<10%, RX
sensitivity,
802.11n
OFDM Mode
MCS7
PER<10%, RX
sensitivity,
Bluetooth LE
1M
-
-
-
-
-88
-74
-73
-96
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Unit
dBm
Unit
dBm
dBm
dBm
dBm
5 ANTENNA INFORMATION
4.4 Bluetooth transmission performance
Minimum
value
Typical value
Maximum
value
150
KHz
Unit
MHz
Mbps
dBm
Unit
dBm
dBm
dBm
dB
2480
-
20
-
-
-
-23
4.5 Bluetooth receiving performance
Parameter
Typical value
Minimum
value
Maximum
value
-
-
1
6
-96
-
-
10
Parameter
Working
frequency
Air rate
Transmit
power
Frequency
error
2402
-
-20
-150
RX sensitivity
-
Maximum RF
signal input
-10
-
-
Inter-
modulation
Co-channel
suppression
ratio
5 Antenna information
5.1 Antenna type
CB3SE uses the PCB antenna with the gain of 1.3 dBi.
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5 ANTENNA INFORMATION
5.2 Antenna interference reduction
To ensure the optimal Wi-Fi performance when the Wi-Fi module uses an onboard
PCB antenna, it is recommended that the antenna be at least 15 mm away from
other metal parts.
To prevent adverse impact on the antenna radiation performance, avoid copper or
traces within the antenna area on the PCB.
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5 ANTENNA INFORMATION
16 / 28
5 ANTENNA INFORMATION
17 / 28
6 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS
6 Packaging information and production instructions
6.1 Mechanical dimensions
18 / 28
6 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS
19 / 28
6 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS
20 / 28
6 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS
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6 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS
6.2 Production instructions
1. The Tuya SMT module should be mounted by the SMT device. After being un-
packed, it should be soldered within 24 hours. Otherwise, it should be put into
the drying cupboard where the RH is not greater than 10%; or it needs to be
packaged under vacuum again and the exposure time needs to be recorded
(the total exposure time cannot exceed 168 hours).
• SMT devices:
– Mounter
– SPI
– Reflow soldering machine
– Thermal profiler
– Automated optical inspection (AOI) equipment
• Baking devices:
– Cabinet oven
– Anti-electrostatic and heat-resistant trays
– Anti-electrostatic and heat-resistant gloves
2. Storage conditions for a delivered module:
• The moisture-proof bag must be placed in an environment where the tem-
perature is below 40°C and the relative humidity is lower than 90%.
• The shelf life of a dry-packaged product is 12 months from the date when
the product is packaged and sealed.
• There is a humidity indicator card (HIC) in the packaging bag.
3. The module needs to be baked in the following cases:
• The packaging bag is damaged before unpacking.
• There is no HIC in the packaging bag.
• After unpacking, circles of 10% and above on the HIC become pink.
• The total exposure time has lasted for over 168 hours since unpacking.
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6 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS
• More than 12 months has passed since the sealing of the bag.
4. Baking settings:
• Temperature: 60°C and ≤ 5% RH for reel package and 125°C and ≤5%
RH for tray package (please use the heat-resistant tray rather than plastic
container)
• Time: 48 hours for reel package and 12 hours for tray package
• Alarm temperature: 65°C for reel package and 135°C for tray package
• Production-ready temperature after natural cooling: < 36°C
• Re-baking situation: If a module remains unused for over 168 hours after
being baked, it needs to be baked again.
• If a batch of modules is not baked within 168 hours, do not use the reflow
soldering to solder them. Because these modules are Level-3 moisture-
sensitive devices, they are very likely to get damp when exposed beyond
the allowable time. In this case, if they are soldered at high temperatures,
it may result in device failure or poor soldering.
5. In the whole production process, take electrostatic discharge (ESD) protective
measures.
6. To guarantee the passing rate, it is recommended that you use the SPI and AOI
to monitor the quality of solder paste printing and mounting.
6.3 Recommended oven temperature curve
Set oven temperatures according to the following temperature curve of reflow sol-
dering. The peak temperature is 245°C.
23 / 28
6 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS
• A: Temperature axis
• B: Time axis
• C: Liquidus temperature: 217 to 220°C
• D: Ramp-up slope: 1 to 3°C/s
perature: 150 to 200°C
• F: Duration above the liquidus: 50 to 70s
• G: Peak temperature: 235 to 245°C
• H: Ramp-down slope: 1 to 4°C/s
• E: Duration of constant temperature: 60 to 120s; the range of constant tem-
Note: The above curve is just an example of the solder paste SAC305.
For more details about other solder pastes, please refer to Recommended
oven temperature curve in the solder paste specifications.
24 / 28
6 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS
6.4 Storage conditions
25 / 28
7 MOQ and packaging information
8 APPENDIX: STATEMENT
Product
number
MOQ (pcs)
Shipping
packaging
method
The number
of modules
per reel
The number
of reels per
carton
CB3SE
3600
Tape reel
900
4
8 Appendix: Statement
FCC Caution: Any changes or modifications not expressly approved by the party
responsible for compliance could void the user’s authority to operate this device.
This device complies with Part 15 of the FCC Rules. Operation is subject to the
following two conditions: (1) This device may not cause harmful interference, and
(2) this device must accept any interference received, including interference that
may cause undesired operation.
Note: This device has been tested and found to comply with the limits for a Class
B digital device, according to part 15 of the FCC Rules. These limits are designed
to provide reasonable protection against harmful interference in a residential instal-
lation. This device generates, uses, and can radiate radio frequency energy and, if
not installed and used following the instructions, may cause harmful interference
to radio communications. However, there is no guarantee that interference will not
occur in a particular installation.
If this device does cause harmful interference to radio or television reception, which
can be determined by turning the device off and on, the user is encouraged to try
to correct the interference by one or more of the following measures:
• Reorient or relocate the receiving antenna.
• Increase the separation between the device and receiver.
• Connect the device into an outlet on a circuit different from that to which the
receiver is connected.
• Consult the dealer or an experienced radio/TV technician for help.
Radiation Exposure Statement
This device complies with FCC radiation exposure limits set forth for an uncontrolled
26 / 28
8 APPENDIX: STATEMENT
rolled environment. This device should be installed and operated with a minimum
distance of 20cm between the radiator and your body.
Important Note
This radio module must not be installed to co-locate and operating simultaneously
with other radios in the host system except following FCC multi-transmitter product
procedures. Additional testing and device authorization may be required to operate
simultaneously with other radios.
The availability of some specific channels and/or operational frequency bands are
country-dependent and are firmware programmed at the factory to match the in-
tended destination. The firmware setting is not accessible by the end-user.
The host product manufacturer is responsible for compliance with any other FCC
rules that apply to the host not covered by the modular transmitter grant of certi-
fication. The final host product still requires Part 15 Subpart B compliance testing
with the modular transmitter installed.
The end-user manual shall include all required regulatory information/warnings as
shown in this manual, including “This product must be installed and operated with
a minimum distance of 20 cm between the radiator and user body”.
This device has got an FCC ID: 2ANDL-CB3SE. The end product must be labeled
in a visible area with the following: “Contains Transmitter Module FCC ID: 2ANDL-
CB3SE”.
This device is intended only for OEM integrators under the following conditions:
The antenna must be installed such that 20cm is maintained between the antenna
and users, and the transmitter module may not be co-located with any other trans-
mitter or antenna.
As long as the 2 conditions above are met, further transmitter tests will not be re-
quired. However, the OEM integrator is still responsible for testing their end-product
for any additional compliance requirements required with this module installed.
Declaration of Conformity European Notice
Hereby, Hangzhou Tuya Information Technology Co., Ltd declares that this module
product is in compliance with essential requirements and other relevant provisions
27 / 28
of Directive 2014/53/EU, 2011/65/EU. A copy of the Declaration of conformity can
be found at https://www.tuya.com.
8 APPENDIX: STATEMENT
This product must not be disposed of as normal household waste, in accordance with
the EU directive for waste electrical and electronic equipment (WEEE-2012/19/EU).
Instead, it should be disposed of by returning it to the point of sale, or to a municipal
recycling collection point.
The device could be used with a separation distance of 20cm to the human body.
28 / 28