CBU-IPEX Module Datasheet Hardware Product Development
Network Modules
Wi-Fi
BLE Dual Mode Module
CB Series Module Version:
20210226 Online Version Contents Contents 1 Overview 1.1 Features . 2 1.2 Applications . 2 1.3 Change history . 3 2.1 Dimensions and package . 3 2.2 Pin denition . 4 2 Module interfaces 3 Electrical parameters
. 8 3.1 Absolute electrical parameters
. 8 3.2 Normal working conditions 3.3 RF power consumption . 9
. 9 3.4 Working current 4 RF parameters 4.1 Basic RF features
. 10 4.2 Wi-Fi transmission performance . 11 4.3 Wi-Fi receiving performance . 12 4.4 BLE transmission performance . 12 4.5 BLE receiving performance . 13 5 Antenna information 5.1 Antenna type . 13 5.2 Antenna interference reduction . 13 6 Packaging information and production instructions 6.1 Mechanical dimensions
. 14
. 14 6.2 Production instructions 6.3 Recommended oven temperature curve . 16 2 3 8 10 13 14 17 17 7 MOQ and packaging information 8 Appendix: Statement i Contents a CBU-IPEX consists a highly AP the nection is of integrated STA manner. and low-power embedded Wi-Fi module that Tuya has developed. It RF chip BK7231N and dual-network-connection a few manner peripherals, but supports and the not BLE only supports con-
network 1 / 19 1 OVERVIEW is built-in with a 32-bit MCU with a running speed of up to 120 MHz, 256-KB and extended RAM, so instructions the support processing multi-cloud signals can and six decoding. PWM 32-bit has it makes rich peripherals, very chip the as to for Besides, output connection. eectively such as for suitable The MCUs implement PWM, UART, high-quality spe-
audio and LED low-power 32-bit CPU, which can also function as an application Embedded processor The clock Working Peripherals:
ceiver/transmitter Wi-Fi connectivity rate:
voltage:
6 120 3.0V MHz to width
(UART), pulse 3.6V modulations and serial 2
(PWM), peripheral 1 universal interface
(SPI) asynchronous re-
GHz 802.11 Channels Support Up
to Support Support and iOS b/g/n 1 14@2.4 to WPA/WPA2, WEP, 16 output STA/AP/STA+AP SmartCong devices dBm and WPA/WPA2 and in power 802.11b mode working network AP PSK mode FPC antenna with a gain of 3.3dBi Working
-40 temperature:
to 105
(AES) security modes conguration manners for Android 1 Overview CBU-IPEX 2Mbyte ash, cially encoding SPI. The control. 1.1 Features BLE connectivity dBm 6 Complete transmit power in Bluetooth Bluetooth coexistence mode interface FPC antenna with a gain of 3.3dBi 1.2 Applications Intelligent building 2 / 19 2 MODULE INTERFACES Smart household and home appliances Smart socket and light Industrial wireless control Baby monitor Network camera Intelligent bus 1.3 Change history Update date Updated content Version after update 10/16/2020 This is the rst release. V1.0.0 11/24/2020 Updated test data V1.0.1 2 Module interfaces 2.1 Dimensions and package dimensions are 15.80.35 mm
(L)20.30.35 mm
(W) 2.70.1 The mm The CBU-IPEX
(H). dimensions of CBU-IPEX are as follows:
3 / 19 2 MODULE INTERFACES 2.2 Pin definition Pin number Symbol I/O type Function 1 2 3 4 5 P14 P16 P20 P22 ADC Common GPIO, which can be reused as SPI_SCK Common GPIO, which can be reused as SPI_MOSI Common GPIO Common GPIO ADC, which corresponds to P23 on the internal IC I/O I/O I/O I/O I/O 4 / 19 Pin number Symbol I/O type Function 2 MODULE INTERFACES 6 7 8 9 10 11 12 13 14 15 RX2 TX2 P8 P7 P6 P26 P24 GND 3V3 TX1 I/O I/O I/O I/O I/O I/O I/O P P I/O 5 / 19 UART_RX2, which corresponds to P1 on the internal IC UART_TX2, which is used for outputting logs and corresponds to P0 of the internal IC Support hardware PWM Support hardware PWM Support hardware PWM Support hardware PWM Support hardware PWM Power supply reference ground Power supply 3V3 UART_TX1, which is used for transmitting user data and corresponds to P11 of the internal IC Pin number Symbol I/O type Function 16 RX1 I/O 17 18 19 20 21 P28 CEN P9 P17 P15 I/O I/O I/O I/O I/O 2 MODULE INTERFACES UART_RX1, which is used for receiving user data and corresponds to P10 of the internal IC Common GPIO Reset pin Support hardware PWM Common GPIO, which can be reused as SPI_MISO Common GPIO, which can be reused as SPI_CS 6 / 19 Pin number Symbol I/O type Function Test point CSN I/O 2 MODULE INTERFACES Mode selection pin. If connected to the ground before powered on, enter the rmware test mode. If not connected or connected to VCC before powered on, enter the rmware application mode Correspond to P21 on the internal IC. Note: P indicates a power supply pin and I/O indicates an input/output pin. 7 / 19 3 ELECTRICAL PARAMETERS 3 Electrical parameters 3.1 Absolute electrical parameters Parameter Description Minimum value Maximum value Storage temperature Power supply voltage
-55
-0.3 TAMB-25
-4 125 3.9 4 Unit V KV TAMB-25
-200 200 V Ts VBAT Static electricity discharge voltage
(human body model) Static electricity discharge voltage
(machine model) 3.2 Normal working conditions Parameter Description Minimum value Typical value Maximum value Ta
-40
105 Unit VBAT 3.0 3.3 3.6 V Working tempera-
ture Power supply voltage 8 / 19 3 ELECTRICAL PARAMETERS Parameter Description Minimum value Typical value Maximum value Unit VSS VSS+0.3 V VBAT-0. 3 VBAT V Imax
20 mA VOL VOH I/O low level output I/O high level output I/O drive current 3.3 RF power consumption
6 Working status Mode Rate Transmit power/re-
ceive Average value Peak value
(Typical value)) Transmit 11b 11Mbps
+16dBm 270 Transmit 11g 54Mbps
+15dBm 260 Transmit 11n MCS7
+14dBm 253 Receive 11b 11 Mbps Receive 11g 54 Mbps Receive 11n MCS 7 Constantly receive Constantly receive Constantly receive 73 75 75 304 280 273 82 82 82 Unit mA mA mA mA mA mA 3.4 Working current 9 / 19 4 RF PARAMETERS Working status, Ta =
25C Average value Maximum value (Typical value) 70 270 Unit mA Working mode Quick network connection state
(Bluetooth ) Quick network connection state (AP) Quick network connection state (EZ) Network connection state The module is in the fast network connection state and the Wi-Fi indicator ashes fast The module is in the hotspot network connection state and the Wi-Fi indicator ashes slowly The module is in the fast network connection state and the Wi-Fi indicator ashes fast The module is connected to the network and the Wi-Fi indicator is always on 4 RF parameters 4.1 Basic RF features 80 305 mA 87 380 mA 39 355 mA 10 / 19 4 RF PARAMETERS Parameter Description Working frequency 2.412 to 2.480 GHz Wi-Fi standard IEEE 802.11 b/g/n (channels 1 to 14) Data transmission rate 11b: 1, 2, 5.5, 11 (Mbps);
11g: 6, 9, 12, 18, 24, 36, 48, 54
(Mbps);
11n:
HT20 MCS0~7;
11n:
HT40 MCS 0 to 7 Antenna dBi type FPC antenna with a gain of 3.3 4.2 Wi-Fi transmission performance Parameter Typical value Minimum value Maximum value Unit dBm dBm dBm
Average RF output power, 802.11b CCK Mode 11M Average RF output power, 802.11g OFDM Mode 54M Average RF output power, 802.11n OFDM Mode MCS7 Frequency error 16 15 14
11 / 19
-20
20 ppm 4 RF PARAMETERS 4.3 Wi-Fi receiving performance Parameter Typical value Minimum value Maximum value
PER<8%, RX sensitivity, 802.11b DSSS Mode 11M PER<10%, RX sensitivity, 802.11g OFDM Mode 54M PER<10%, RX sensitivity, 802.11n OFDM Mode MCS7 PER<10%, RX sensitivity, BLE 1M Parameter Working frequency Air rate TX power 2402
-20 Unit dBm dBm dBm dBm Unit MHz Mbps dBm
2480
20
-88
-74
-72
-93
1 6 12 / 19 4.4 BLE transmission performance Minimum value Typical value Maximum value 5 ANTENNA INFORMATION Minimum value
-150 Parameter Frequency error Typical value Maximum value 150 Unit kHz 4.5 BLE receiving performance Parameter Typical value Minimum value Maximum value RX sensitivity
-93 Unit dBm dBm dBm dB
-23
10 Maximum RF signal input
-10
Inter-
modulation Co-channel suppression ratio 5 Antenna information 5.1 Antenna type The CBU-IPEX uses an only FPC antenna. 5.2 Antenna interference reduction recommended is It metal avoid parts. copper To or antenna that prevent traces the an within adverse the at be impact antenna 15 least on area the on mm antenna the PCB. away from radiation other performance, 13 / 19 6 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS 6 Packaging information and production instructions 6.1 Mechanical dimensions 6.2 Production instructions 1. Mount Tuyas stamp hole package module with an SMT machine within 24 hours after unpacking and burning the rmware. Otherwise, the module must be packaged again under vacuum. The module must be baked before mounting. SMT equipment:
Reow soldering machine 14 / 19 6 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS Automated optical inspection (AOI) equipment Nozzle with a 6 to 8 mm diameter Baking equipment:
Cabinet oven Anti-static heat-resistant trays Anti-static heat-resistant gloves 2. Storage conditions for a delivered module are as follows:
The moisture-proof bag must be placed in an environment where the tem-
perature is below 30C and the relative humidity is lower than 70%. The shelf life of a dry-packaged product is 6 months from the date when the product is packaged and sealed. The package contains a humidity indicator card (HIC). 3. Bake a module based on HIC status as follows when you unpack the module If the 30%, 40%, and 50% circles are blue, bake the module for 2 consec-
If the 30% circle is pink, bake the module for 4 consecutive hours. If the 30% and 40% circles are pink, bake the module for 6 consecutive If the 30%, 40%, and 50% circles are pink, bake the module for 12 consec-
package:
utive hours. hours. utive hours. 4. Baking settings:
Baking temperature: 1255C Alarm temperature: 130C SMT ready temperature: naturally cooling temperature: < 36C The number of drying times: 1 Rebaking condition: The module is not soldered within 12 hours after bak-
ing. 15 / 19 6 PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS 5. Do not use SMT to process modules that have been unpacked for more than 3 months, because electroless nickel/immersion gold (ENIG) is used for PCBs and they are seriously oxidized for over 3 months. SMT is very likely to cause pseudo and missing soldering. Tuya is not liable for such problems and conse-
quences. 6. Before using SMT, take electrostatic discharge (ESD) protective measures. 7. To reduce the reow defect rate, draw 10% of the products for visual inspection and AOI before the rst mounting, to determine the rationality of oven temper-
ature control and component attachment and placement manners. Draw 5 to 10 modules from subsequent batches each hour for visual inspection and AOI. 6.3 Recommended oven temperature curve Perform SMT based on the following reow oven temperature curve. The highest temperature is 245C. The reow temperature curve is as below:
16 / 19 7 MOQ and packaging information 8 APPENDIX: STATEMENT Product number MOQ (pcs) Shipping packaging method The number of modules per reel The number of reels per carton CBU-IPEX 3600 Tape reel 900 4 8 Appendix: Statement FCC Caution: Any changes or modications not expressly approved by the party responsible for compliance could void the users authority to operate this device. This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and
(2) this device must accept any interference received, including interference that may cause undesired operation. Note: This device has been tested and found to comply with the limits for a Class B digital device, according to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential instal-
lation. This device generates, uses, and can radiate radio frequency energy and, if not installed and used following the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this device does cause harmful interference to radio or television reception, which can be determined by turning the device o and on, the user is encouraged to try to correct the interference by one or more of the following measures:
Reorient or relocate the receiving antenna. Increase the separation between the device and receiver. Connect the device into an outlet on a circuit dierent from that to which the receiver is connected. Consult the dealer or an experienced radio/TV technician for help. Radiation Exposure Statement This device complies with FCC radiation exposure limits set forth for an uncontrolled 17 / 19 8 APPENDIX: STATEMENT rolled distance environment. of 20cm This between device the should radiator be and installed your body. and operated with a minimum Important Note radio other module radios This with procedures. simultaneously must the in Additional with other radios. installed to except not host testing be system and device co-locate following authorization and FCC operating multi-transmitter to simultaneously product operate required be may The availability of some specic channels and/or operational frequency bands are country dependent and are rmware programmed at the factory to match the in-
tended destination. The rmware setting is not accessible by the end-user. The host product manufacturer is responsible for compliance with any other FCC rules that apply to the host not covered by the modular transmitter grant of certi-
cation. The nal host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed. end-user this in The shown a minimum manual manual, of include shall including 20 all This between required product the regulatory be and must radiator cm distance installed user and body. information/warnings operated as with This device has got an FCC ID:
2ANDL-CBU-IPEX. The end product must be visible area with the following:
Contains Transmitter Module FCC ID:
This device is intended only for OEM integrators under the following conditions:
The antenna must be installed such that 20cm is maintained between the antenna and users, and the transmitter module may not be co-located with any other trans-
labeled in a 2ANDL-CBU-IPEX. mitter or antenna. long As quired. for any 2 the as However, additional conditions the OEM compliance above integrator met, still are is requirements further transmitter tests will responsible required for with testing this their module be not re-
end-product installed. Declaration of Conformity European Notice Hereby, Hangzhou Tuya Information Technology Co., Ltd declares that this module product is in compliance with essential requirements and other relevant provisions 18 / 19 of Directive 2014/53/EU,2011/65/EU. A copy of the Declaration of conformity can be found at https://www.tuya.com. 8 APPENDIX: STATEMENT This product must not be disposed of as normal household waste, in accordance with the EU directive for waste electrical and electronic equipment (WEEE-2012/19/EU). Instead, it should be disposed of by returning it to the point of sale, or to a municipal recycling collection point. The device could be used with a separation distance of 20cm to the human body. 19 / 19