CBU-NL Module Datasheet Version: 20220207 Online Version Contents Contents 1 Overview 1.1 Features . 2 1.2 Applications . 2 1.3 Change history . 3 2.1 Dimensions and package . 4 2.2 Pin definition . 4 2 Module interfaces 3 Electrical parameters
. 10 3.1 Absolute electrical parameters 3.2 Normal working conditions
. 10 3.3 RF power consumption . 11
. 11 3.4 Operating current 4 RF parameters
. 14 4.1 Basic RF features 4.2 Wi-Fi transmission performance . 14 4.3 Wi-Fi receiving performance . 15 4.4 Bluetooth LE transmission performance . 16 4.5 Bluetooth LE receiving performance . 16 5 Antenna information 5.1 Antenna type . 17 5.2 Antenna interference reduction . 17 6 Packaging information and production instructions
. 18 6.1 Mechanical dimensions 6.2 Production instructions
. 20 6.3 Recommended oven temperature curve . 22 6.4 Storage conditions . 25 2 4 10 14 17 18 26 27 7 MOQ and packaging information 8 Appendix: Statement I Contents CBU-NL is a low-power embedded Wi-Fi module that Tuya has developed. It consists of a highly integrated RF chip BK7231N and a few peripherals, and not only sup-
ports the AP and STA dual-network-connection manner but supports the Bluetooth LE network connection manner. 1 / 31 1 Overview 1 Overview is and specially CBU-NL flash, s audio and LED encoding The SPI. control. a with RAM, built-in 256-KB extended 32-bit so as MCU to instructions and decoding. PWM 32-bit five running Tuya a the processing has with support for Besides, output it makes rich the speed IoT signals of cloud can to 120 up connection. effectively MHz, 2Mbyte The MCU peripherals, very such suitable chip as for implement UART, PWM, high-quality low-power 32-bit CPU, which can also function as an application 1.1 Features Embedded processor The clock Operating Peripherals:
Wi-Fi connectivity 120 rate:
voltage:
MHz 2.3V 2 to 3.6V 5 PWMs, UARTs, and 1 SPI GHz dBm 802.11 Channels Support Up
to Support Support and iOS Onboard Operating b/g/n 1 14@2.4 to WPA/WPA2, WEP, 16 output STA/AP/STA+AP SmartConfig devices PCB antenna temperature:
and WPA/WPA2 and in power 802.11b mode working network AP PSK mode with a
-40 gain to of 85 2.21 dBi
(AES) security modes configuration manners for Android Bluetooth LE connectivity transmit power in Bluetooth Bluetooth coexistence dBm 6 Complete Onboard mode interface 2.21 of PCB antenna with a gain dBi 1.2 Applications Intelligent Smart building household and home appliances 2
31 1 Overview Smart socket and light Industrial wireless control Baby monitor Network camera Intelligent bus 1.3 Change history Update date Updated content Version after update 2/7/2022 This is the first release. V1.0.0 3 / 31 2 Module interfaces 2 Module interfaces 2.1 Dimensions and package The CBU-NL dimensions are 15.80.35 mm (W)20.30.35 mm (L) 2.70.15 mm
(H). The dimensions of CBU-NL are as follows:
2.2 Pin definition 4 / 31 2 Module interfaces Common GPIO, which can be reused as SPI_SCK
(Correspond to Pin 11 of the IC) Common GPIO, which can be reused as SPI_MOSI
(Correspond to Pin 12 of the IC) Common GPIO
(Correspond to Pin 20 of the IC) Common GPIO
(Correspond to Pin 18 of the IC) ADC, which corresponds to P23 on the internal IC (Correspond to Pin 17 of the IC) UART_RX2, which corresponds to P1 on the internal IC. Please do not use this pin.
(Correspond to Pin 28 of the IC) Pin number Symbol I/O type Function P14 I/O 1 2 3 4 5 6 P16 I/O P20 P22 ADC I/O I/O I/O RX2 I/O 5 / 31 2 Module interfaces UART_TX2, which is used for outputting logs and corresponds to P0 of the internal IC (Correspond to Pin 29 of the IC) Support hardware PWM (Correspond to Pin 24 of the IC) Support hardware PWM (Correspond to Pin 23 of the IC) Support hardware PWM (Correspond to Pin 22 of the IC) Support hardware PWM (Correspond to Pin 15 of the IC) Support hardware PWM (Correspond to Pin 16 of the IC) Power supply reference ground Power supply 3V3 Pin number Symbol I/O type Function TX2 I/O 7 8 9 10 11 12 13 14 P8 P7 P6 P26 P24 GND 3V3 I/O I/O I/O I/O I/O P P 6 / 31 2 Module interfaces UART_TX1, which is used for transmitting user data and corresponds to P11 of the internal IC. Do not connect it to the VCC. By default, the MCU serial port should be in low-level or high-impedance state (Correspond to Pin 27 of the IC). UART_RX1, which is used for receiving user data and corresponds to P10 of the internal IC. Do not connect it to the VCC. By default, the MCU serial port should be in low-level or high-impedance state (Correspond to Pin 26 of the IC). Common GPIO
(Correspond to Pin 10 of the IC) Pin number Symbol I/O type Function 15 TX1 I/O 16 RX1 I/O 17 P28 I/O 7 / 31 Pin number Symbol I/O type Function 18 CEN I/O 19 20 P9 P17 I/O I/O 21 P15 I/O 2 Module interfaces Reset pin,Low-level reset, high-level active (internally pulled high) Docking IC-CEN
(Correspond to Pin 21 of the IC) Common GPIO
(Correspond to Pin 25 of the IC) Common GPIO, which can be reused as SPI_MISO
(Correspond to Pin 14 of the IC) Common GPIO, which can be reused as SPI_CS
(Correspond to Pin 13 of the IC) 8 / 31 Pin number Symbol I/O type Function Test point CSN I/O 2 Module interfaces Mode selection pin. If it is connected to the ground before being powered on, enter the firmware test mode. If it is not connected or connected to VCC before being powered on, enter the firmware application mode. Correspond to P21 on the internal IC. Note: P indicates a power supply pin and I/O indicates an input/output pin. For the MCU solution, please refer to CBx Module. 9 / 31 3 Electrical parameters 3 Electrical parameters 3.1 Absolute electrical parameters Parameter Description Minimum value Maximum value Unit Storage temperature Power supply voltage
-55
-0.3 TAMB-25
-4 125 3.9 4 TAMB-25
-200 200 V KV V Ts VBAT ESD voltage
(human body model) ESD voltage
(machine model) 3.2 Normal working conditions Parameter Description Minimum value Typical value Maximum value Ta VBAT VOL VOH Operating tempera-
ture Power supply voltage I/O low level output VSS I/O high level output
-40 85 2.3 3.3 3.6 VSS+0.3 VBAT-0. 3 VBAT Unit V V V
10 / 31 3 Electrical parameters Parameter Description Minimum value Typical value Maximum value Imax
6 20 I/O drive current 3.3 RF power consumption Working status Mode Rate Transmit power/re-
ceive Average value Peak value
(Typical value) Transmit 11b 11Mbps
+16dBm 270 Transmit 11g 54Mbps
+15dBm 260 Transmit 11n MCS7
+14dBm 253 Receive 11b 11 Mbps Constantly receive Constantly receive Constantly receive 73 75 75 Receive 11g 54 Mbps Receive 11n MCS 7 3.4 Operating current 304 280 273 82 82 82 Unit mA Unit mA mA mA mA mA mA 11 / 31 3 Electrical parameters Working mode Average value Maximum value (Typical value) Unit mA 70 270 Quick network connection state
(Bluetooth) Quick network connection state (AP) Quick network connection state (EZ) Working status, Ta =
25C The module is in the fast network connection state and the Wi-Fi indicator flashes fast The module is in the hotspot network connection state and the Wi-Fi indicator flashes slowly The module is in the fast network connection state and the Wi-Fi indicator flashes fast The module is in connected state and the Wi-Fi indicator light is always on 80 305 mA 87 380 mA Connected 73 355 mA 12 / 31 3 Electrical parameters Working mode Average value Weakly connected 205 350 Maximum value (Typical value) Unit mA Disconnected 70 270 mA Module disabled 330
uA Working status, Ta =
25C The module and the hotspot are weakly connected and the Wi-Fi indicator light is always on The module is in disconnected state and the Wi-Fi indicator light is always off The CEN pin of the module is connected to the ground. 13 / 31 4 RF parameters 4 RF parameters 4.1 Basic RF features Parameter Description Working frequency Wi-Fi standard 2.412 to 2.484 GHz IEEE 802.11 b/g/n (channels 1 to 14) Data transmission rate 11b: 1, 2, 5.5, 11 (Mbps);
11g: 6, 9, 12, 18, 24, 36, 48, 54 (Mbps);
11n: HT20 MCS0~7;
Antenna type PCB antenna 4.2 Wi-Fi transmission performance Parameter Typical value Minimum value Maximum value Unit dBm dBm dBm
Average output power, 802.11b CCK Mode 11M Average output power, 802.11g OFDM Mode 54M Average output power, 802.11n OFDM Mode MCS7
(HT20) 16 15 14
14 / 31 Parameter Typical value Minimum value Maximum value 4 RF parameters
-20
20 ppm 4.3 Wi-Fi receiving performance Parameter Typical value Minimum value Maximum value
Average output power, 802.11n OFDM Mode MCS7
(HT40) Frequency error PER<8%, RX sensitivity, 802.11b DSSS Mode 11M PER<10%, RX sensitivity, 802.11g OFDM Mode 54M PER<10%, RX sensitivity, 802.11n OFDM Mode MCS7
(HT20) PER<10%, RX sensitivity, 802.11n OFDM Mode MCS7
(HT40)
13
-88
-74
-72
-68 15 / 31 Unit dBm Unit dBm dBm dBm dBm 4 RF parameters Unit dBm Unit MHz Mbps dBm kHz Unit dBm dBm dBm dB Parameter Typical value Minimum value Maximum value
-93
PER<10%, RX sensitivity, Bluetooth LE 1M 4.4 Bluetooth LE transmission performance Minimum value Typical value Maximum value 4.5 Bluetooth LE receiving performance Parameter Typical value Minimum value Maximum value Parameter Working frequency Air rate TX power Frequency error 2402
-20
-150
-10
RX sensitivity Maximum RF signal input Inter-
modulation Co-channel suppression ratio 2480
20 150
-23
1 6
-93
10 16 / 31 5 Antenna information 5 Antenna information 5.1 Antenna type The CBU-NL module uses the PCB antenna. 5.2 Antenna interference reduction To ensure optimal Wi-Fi performance when the Wi-Fi module uses an onboard PCB antenna, it is recommended that the antenna be at least 15 mm away from other metal parts. To prevent an adverse impact on the antenna radiation performance, avoid copper or traces within the antenna area on the PCB. 17 / 31 6 Packaging information and production instructions 6 Packaging information and production instructions 6.1 Mechanical dimensions The PCB dimensions are 15.80.35 mm (W)20.30.35 mm (L) 1.00.1 mm (H). 18 / 31 6 Packaging information and production instructions 19 / 31 6 Packaging information and production instructions Recommended CBU-NL footprint:
6.2 Production instructions 1. For the modules that can be packaged with the SMT or in the in-line way, you can select either of them according to the PCB design solutions of customers. If a PCB is designed to be SMT-packaged, package the module with the SMT. If a PCB is designed to be in-line-packaged, package the module in an in-line way. After being unpacked, the module must be soldered within 24 hours. Other-
wise, it needs to be put into the drying cupboard where the relative humidity is not greater than 10%; or it needs to be packaged again under vacuum and the exposure time needs to be recorded (the total exposure time cannot exceed 168 hours). 20 / 31 6 Packaging information and production instructions
(SMT process) SMT devices:
Mounter SPI Reflow soldering machine Thermal profiler Automated optical inspection (AOI) equipment
(Wave soldering process) Wave soldering devices:
Wave soldering equipment Wave soldering fixture Constant-temperature soldering iron Tin bar, tin wire, and flux Thermal profiler Baking devices:
Cabinet oven Anti-electrostatic and heat-resistant trays Anti-electrostatic and heat-resistant gloves 2. Storage conditions for a delivered module:
The moisture-proof bag must be placed in an environment where the tem-
perature is below 40C and the relative humidity is lower than 90%. The shelf life of a dry-packaged product is 12 months from the date when the product is packaged and sealed. There is a humidity indicator card (HIC) in the packaging bag.
![HIC -SMT and in -line module .png ]( https :// airtake -public -data -12541 1 2 53901. cos.ap - shanghai . myqcloud .com/goat /20210410/2 c61fd34d2a6464d8cb 3 ee05f63689786 .png) 3. The module needs to be baked in the following cases:
The packaging bag is damaged before unpacking. There is no humidity indicator card (HIC) in the packaging bag. After unpacking, circles of 10% and above on the HIC become pink. The total exposure time has lasted for over 168 hours since unpacking. More than 12 months have passed since the sealing of the bag. 4. Baking settings:
21 / 31 6 Packaging information and production instructions Temperature: 60C and 5% RH for reel package and 125C and 5%
RH for tray package (please use the heat-resistant tray rather than plastic container) Time: 48 hours for reel package and 12 hours for tray package Alarm temperature: 65C for reel package and 135C for tray package Production-ready temperature after natural cooling: < 36C Re-baking situation: If a module remains unused for over 168 hours after being baked, it needs to be baked again. If a batch of modules is not baked within 168 hours, do not use the reflow soldering or wave soldering to solder them. Because these modules are Level-3 moisture-sensitive devices, they are very likely to get damp when exposed beyond the allowable time. In this case, if they are soldered at high temperatures, it may result in device failure or poor soldering. 5. In the whole production process, take electrostatic discharge (ESD) protective measures. 6. To guarantee the passing rate, it is recommended that you use the SPI and AOI to monitor the quality of solder paste printing and mounting. 6.3 Recommended oven temperature curve Select a proper soldering manner according to the process. For the SMT process, please refer to the recommended oven temperature curve of reflow soldering. For the wave soldering process, please refer to the recommended oven temperature curve of wave soldering. There are some differences between the set temperatures and the actual temperatures. All the temperatures shown in this module datasheet are obtained through actual measurements. Manner 1: SMT process (Recommended oven temperature curve of reflow soldering) Set oven temperatures according to the following curve. 22 / 31 6 Packaging information and production instructions A: Temperature axis B: Time axis C: Liquidus temperature: 217 to 220C D: Ramp-up slope: 1 to 3C/s perature: 150 to 200C F: Duration above the liquidus: 50 to 70s G: Peak temperature: 235 to 245C H: Ramp-down slope: 1 to 4C/s E: Duration of constant temperature: 60 to 120s; the range of constant tem-
Note: The above curve is just an example of the solder paste SAC305. For more details about other solder pastes, please refer to Recommended oven temperature curve in the solder paste specifications. Manner 2: Wave soldering process (Oven temperature curve of wave sol-
dering) Set oven temperatures according to the following temperature curve of wave sol-
dering. The peak temperature is 260C5C. 23 / 31 6 Packaging information and production instructions Suggestions on oven temperature curve of wave soldering Preheat temperature Suggestions on manual soldering temperature Soldering temperature 80 to 130 C 36020C Preheat time 75 to 100s Soldering time 3s/point Peak contact time 3 to 5s Temperature of tin cylinder 2605C Ramp-up slope 2C/s Ramp-down slope 6C/s NA NA NA NA NA NA NA NA 24 / 31 6 Packaging information and production instructions 6.4 Storage conditions 25 / 31 7 MOQ and packaging information 7 MOQ and packaging information Product number MOQ (pcs) Shipping packaging method The number of modules per reel The number of reels per carton CBU-NL 4400 Tape reel 1100 4 26 / 31 8 Appendix: Statement 8 Appendix: Statement FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the users authority to operate this device. This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and
(2) this device must accept any interference received, including interference that may cause undesired operation. Note: This device has been tested and found to comply with the limits for a Class B digital device, according to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential instal-
lation. This device generates, uses, and can radiate radio frequency energy and, if not installed and used following the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this device does cause harmful interference to radio or television reception, which can be determined by turning the device off and on, the user is encouraged to try to correct the interference by one or more of the following measures:
Reorient or relocate the receiving antenna. Increase the separation between the device and receiver. Connect the device into an outlet on a circuit different from that to which the receiver is connected. Consult the dealer or an experienced radio/TV technician for help. Radiation Exposure Statement This device complies with FCC radiation exposure limits set forth for an uncontrolled rolled environment. This device should be installed and operated with a minimum distance of 20cm between the radiator and your body. Important Note This radio module must not be installed to co-locate and operating simultaneously with other radios in the host system except following FCC multi-transmitter product procedures. Additional testing and device authorization may be required to operate simultaneously with other radios. The availability of some specific channels and/or operational frequency bands are country dependent and are firmware programmed at the factory to match the in-
tended destination. The firmware setting is not accessible by the end-user. 27 / 31 8 Appendix: Statement The host product manufacturer is responsible for compliance with any other FCC rules that apply to the host not covered by the modular transmitter grant of certi-
fication. The final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed. The end-user manual shall include all required regulatory information/warnings as shown in this manual, including This product must be installed and operated with a minimum distance of 20 cm between the radiator and user body. This device has got an FCC ID: 2ANDL-CBU-NL. The end product must be labeled in a visible area with the following: Contains Transmitter Module FCC ID: 2ANDL-CBU-
NL. This device is intended only for OEM integrators under the following conditions:
The antenna must be installed such that 20cm is maintained between the antenna and users, and the transmitter module may not be co-located with any other trans-
mitter or antenna. As long as the 2 conditions above are met, further transmitter tests will not be re-
quired. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed. 28 / 31 Declaration of Conformity European Notice 8 Appendix: Statement Hereby, Hangzhou Tuya Information Technology Co., Ltd declares that this module product is in compliance with essential requirements and other relevant provisions of Directive 2014/53/EU,2011/65/EU. A copy of the Declaration of conformity can be found at https://www.tuya.com The device could be used with a separation distance of 20cm to the human body. 29 / 31
. 8 Appendix: Statement This product must not be disposed of as normal household waste, in accordance with the EU directive for waste electrical and electronic equipment (WEEE-2012/19/EU). Instead, it should be disposed of by returning it to the point of sale, or to a municipal recycling collection point. 3 0 / 31 8 Appendix: Statement 3 1 / 31