Global Intelligent Platform Product Manual WB8P Wi-Fi and Bluetooth Module Version: 1.0.0 Date: 2020-3-30 No.: 0000000001 1 Product Overview WB8P is a low-power embedded Wi-Fi module that Tuya has developed. It consists of a highly integrated RF chip (BK7231T) and several peripheral components, with an embedded Wi-Fi network protocol stack, Bluetooth network protocol, and robust library functions. WB8P also contains a low-power Arm Cortex-M4 MCU, 1T1R WLAN module, 256 KB static random-access memory (SRAM), and 2 MB flash memory, and has extensive peripherals. WB8P is an RTOS platform that integrates all function libraries of the Wi-Fi MAC and TCP/IP protocols. You can develop embedded Wi-Fi products as required. Embedded low-power 32-bit CPU, which can also function as an application 1.1 Features processor Clock rate: 120 MHz Working voltage: 3.0 V to 3.6 V analog-to-digital converter (ADC) Wi-Fi connectivity 802.11b/g/n Channels 1 to 14 at 2.4 GHz WPA and WPA2 security modes Smart network configuration for Android and iOS devices Onboard PCB antenna with a gain of 2 dBi Working temperature: 20C to +105C 1 Peripherals: eight GPIOs, one universal asynchronous receiver/transmitter (UART), and one Bluetooth connectivity Support Bluetooth V4.2 Onboard PCB antenna with a gain of 2 dBi Working temperature: 20C to +105C 2 Smart household and home appliances 1.2 Applications Intelligent building Smart socket and light Industrial wireless control Baby monitor Network camera Intelligent bus 2 Change History No. Date Change Description Version After Change 1 2020-3-30 This is the first release. 1.0.0 3 Contents 1 Product Overview ............................................................................................................. 1 1.1 Features ................................................................................................................. 1 1.2 Applications ............................................................................................................ 2 2 Module Interfaces ............................................................................................................. 6 2.1 Dimensions and Footprint ...................................................................................... 6 2.2 Interface Pin Definition ........................................................................................... 6 2.3 Test Pin Definition ................................................................................................... 7 3 Electrical Parameters ....................................................................................................... 8 3.1 Absolute Electrical Parameters .............................................................................. 8 3.2 Electrical Conditions ............................................................................................... 9 3.3 RF Current Consumption ....................................................................................... 9 3.4 Working Current ................................................................................................... 10 4 RF Features .................................................................................................................... 10 4.1 Basic RF Features ................................................................................................ 10 4.2 TX Performance ................................................................................................... 11 4.3 RX Performance ................................................................................................... 11 5 Antenna Information ....................................................................................................... 12 5.1 Antenna Type.................................................................................................................. 12 5.2 Antenna Interference Reduction .......................................................................... 12 5.3 Antenna Connector Specifications ....................................................................... 12 6 Packaging Information and Production Instructions....................................................... 13 6.1 Mechanical Dimensions ....................................................................................... 13 6.2 Recommended PCB Layout ................................................................................. 14 6.3 Production Instructions ......................................................................................... 14 6.4 Recommended Oven Temperature Curve ........................................................... 16 6.5 Storage Conditions ............................................................................................... 17 6.6 Appendix - declaration .......................................................................................... 17 4 Figure 2-1 WB8P front and rear views ......................................................................... 6 Figure 5-1 Antenna clearance part ............................................................................. 12 Figure 6-1 WB8P mechanical dimensions ................................................................. 13 Figure 6-2 Side view ................................................................................................... 13 Figure 6-3 Layout of the PCB to which WB8P applies ............................................... 14 Figure 6-4 HIC for WB8P ............................................................................................ 15 Figure 6-5 Oven temperature curve ........................................................................... 16 Table 2-1 WB8P interface pins ..................................................................................... 7 Table 2-2 WB8P test pins ............................................................................................. 7 Table 3-1 Absolute electrical parameters ..................................................................... 8 Table 3-2 Normal electrical conditions .......................................................................... 9 Table 3-3 Current consumption during constant transmission and receiving .............. 9 Table 3-4 WB8P working current ................................................................................ 10 Table 4-1 Basic RF features ....................................................................................... 10 Table 4-2 Performance during constant transmission ................................................ 11 Table 4-3 RX sensitivity .............................................................................................. 11 Figures Tables 5 WB8P Datesheet 2 Module Interfaces 2.1 Dimensions and Footprint WB8P has one row of pins with a 1.270.1 mm pin spacing. The WB8P dimensions (H x W x D) are 3.5 mm x 16 mm x 24.8 mm. Figure 2-1 shows the WB8P front and rear views. Note: The default dimensional tolerance is 0.3 mm. If a customer has other requirements, clearly specify them in the datasheet after communication. Figure 2-1 WB8P front and rear views 2.2 Interface Pin Definition 6 Pin No. 1 2 3 Symbol I/O Type VCC GND P P PWM1 I/O 4 PWM2 I/O 5 PWM3 I/O 6 PWM4 I/O 7 PWM5 I/O 8 9 TXD1 I/O 10 RXD1 I/O WB8P Datesheet Table 2-1 WB8P interface pins Function Power supply pin (3.3 V) Power supply reference ground pin Common I/O pin, which can be used as a hardware PWM pin and is connected to the P7 pin on the internal IC Common I/O pin, which can be used as a hardware PWM pin and is connected to the P8 pin on the internal IC Common I/O pin, which can be used as a hardware PWM pin and is connected to the P9 pin on the internal IC Common I/O pin, which can be used as a hardware PWM pin and is connected to the P24 pin on the internal IC Common I/O pin, which can be used as a hardware PWM pin and is connected to the P26 pin on the internal IC UART1_TXD, which is used as a user-side serial interface pin and connected to the P11 pin on the internal IC UART1_RXD, which is used as a user-side serial interface pin and connected to the P10 pin on the internal IC ADC AI ADC pin, which is connected to the P23 pin on the internal IC Note:
1. P indicates power supply pins, I/O indicates input/output pins, and AI indicates analog input pins. 2. CEN is only a hardware reset pin and cannot clear the Wi-Fi network configuration. 2.3 Test Pin Definition Table 2-2 WB8P test pins Pin No. Symbol I/O Type Function TP5 SO I/O Data output pin when data is downloaded from 7 WB8P Datesheet Pin No. Symbol I/O Type Function TP4 SI I/O TP3 CS I/O TP2 SCK I/O TP6 TXD2 I/O TP7 RXD2 I/O TP8 CEN I/O the flash memory, which is used for module production and firmware burning and is connected to the P23 or ADC3 pin on the internal IC Data input pin when data is downloaded from the flash memory, which is used for module production and firmware burning and is connected to the P22 pin on the internal IC Chip selection pin when data is downloaded from the flash memory, which is used for module production and firmware burning and is connected to the P21 pin on the internal IC Clock pin when data is downloaded from the flash memory, which is used for module production and firmware burning and is connected to the P20 pin on the internal IC UART2_TXD, which is used for displaying the module internal information and is connected to the P0 pin on the internal IC UART2_TXD, which is used for displaying the module internal information and is connected to the P0 pin on the internal IC Chip enabling pin, which is active at a low level and is connected to the CEN pin on the internal IC Note: Test pins are not recommended. 3 Electrical Parameters 3.1 Absolute Electrical Parameters Table 3-1 Absolute electrical parameters Parameter Description Minimum Maximum Unit Value Value 20 150 3.0 3.6 C V Ts VCC Storage temperature Power supply voltage 8 Static electricity voltage
(human body model) Static electricity voltage
(machine model) WB8P Datesheet Tamb = 25C N/A 2 Tamb = 25C N/A 0.5 kV kV 3.2 Electrical Conditions Table 3-2 Normal electrical conditions Parameter Description Minimum Value Typical Value Maximum Unit Value Ta VCC VIL VIH VOL VOH Imax Working temperature Power supply voltage 20 3.0 N/A 105 C 3.3 3.6 I/O low-level input 0.3 N/A I/O high-level input VCC x 0.75 N/A VCC I/O low-level output N/A VCC x 0.1 I/O high-level output VCC x 0.8 I/O drive current N/A VCC x 0.25 VCC 12 N/A N/A N/A V V V V V mA 3.3 RF Current Consumption Table 3-3 Current consumption during constant transmission and receiving Working Status Mode TX Power TX at 2.4 GHz 802.11b
+16 dBm 802.11g
+14 dBm 802.11n HT20
+12 dBm 802.11n HT40
+12 dBm BLE
+6 dBm 9 WB8P Datesheet 3.4 Working Current Table 3-4 WB8P working current Working Mode Working Status (Ta = 25C) Typical Value Peak Value*
Unit The module is in quick connected mode, and the BT indicator blinks quickly. 100 250 The module is connected to the network, and the Wi-Fi indicator is steady on. 50 245 Quick Connected(BT mode) Quick Connected(WIFI mode) EZ The module is in EZ mode, and the Wi-Fi indicator blinks quickly. Connected and idle The module is connected to the network, and the Wi-Fi indicator is steady on. Connected and operating The module is connected to the network, and the Wi-Fi indicator is steady on. 80 40 42 270 110 256 mA mA mA mA mA 4 RF Features 4.1 Basic RF Features Table 4-1 Basic RF features Parameter Description Frequency band BT:2.400GHz to 2.4835GHz WIFI:2.412 GHz to 2.484 GHz;
WIFI standard IEEE 802.11a/b/g/n (channels 1 to 14, channels 1 to 11 for US, channels 1 to 13 for EU) BT standard BT Version 4.2 Data transmission rate 802.11b: 1, 2, 5.5, or 11 (Mbit/s) 802.11g: 6, 9, 12, 18, 24, 36, 48, or 54 (Mbit/s) 10 WB8P Datesheet 802.11n: HT20 MCS0 to MCS7 802.11n: HT40 MCS0 to MCS7 Bluetooth: 1Mbps, 2Mbps Antenna type Onboard PCB antenna with a gain of 2 dBi 4.2 TX Performance Table 4-2 Performance during constant transmission Parameter Minimum Value Typical Value Maximum Value Unit Average RF output power, 802.11b CCK mode Average RF output power, 802.11g OFDM mode Average RF output power, 802.11n OFDM mode Frequency error 11 Mbit/s N/A 54 Mbit/s N/A MCS7 N/A EVM under 802.11b CCK, 11 Mbit/s, 16 dBm EVM under 802.11g OFDM, 54 Mbit/s, 14 dBm 2 30 16 14 12 N/A 18 29 N/A N/A N/A
+2 25 EVM under 802.11n OFDM, MCS7, 13 dBm 31 28 27 dBm dBm dBm ppm dB dB dB 4.3 RX Performance Table 4-3 RX sensitivity Parameter Minimum Value Typical Value Maximum Value Unit PER < 8%, 802.11b CCK mode PER < 10%, 802.11g OFDM mode PER < 10%, 802.11n OFDM mode PER < 10%, BT mode 11 Mbit/s N/A 89 N/A dBm 54 Mbit/s N/A 75 N/A dBm MCS7 N/A 68 N/A dBm 1M N/A
-95 N/A dBm 11 WB8P Datesheet 5 Antenna Information 5.1 Antenna Type WB8P uses an on board PCB antenna. 5.2 Antenna Interference Reduction To ensure optimal Wi-Fi performance when the Wi-Fi module uses an on board PCB antenna, it is recommended that the antenna be at least 15 mm away from other metal parts. To prevent adverse impact on the antenna radiation performance, avoid copper or traces along the antenna area on the PCB. Deploy the antenna based on the antenna placement solutions shown in the following figures. Figure 5-1 Antenna clearance part 5.3 Antenna Connector Specifications WB8P does not use an antenna connector. 12 6 Packaging Information and Production Instructions WB8P Datesheet 6.1 Mechanical Dimensions Figure 6-1 WB8P mechanical dimensions Figure 6-2 Side view Note: The default dimensional tolerance is 0.3 mm. If a customer has other requirements, clearly specify them in the data-sheet after communication. 13 6.2 Recommended PCB Layout WB8P Datesheet Figure 6-3 Layout of the PCB to which WB8P applies Note: The default dimensional tolerance is 0.3 mm. If a customer has other requirements, clearly specify them in the datasheet after communication. 6.3 Production Instructions 1. Use an SMT placement machine to mount the stamp hole module that Tuya produces onto the PCB within 24 hours after the module is unpacked and the firmware is burned. If not, vacuum pack the module again. Bake the module before mounting it onto the PCB.
(1) SMT placement equipment i. Reflow soldering machine ii. Automated optical inspection (AOI) equipment iii. Nozzle with a 6 mm to 8 mm diameter
(2) Baking equipment i. Cabinet oven ii. Anti-static heat-resistant trays iii. Anti-static heat-resistant gloves 14 WB8P Datesheet 2. Storage conditions for a delivered module are as follows:
(1) The moisture-proof bag is placed in an environment where the temperature is below 30C and the relative humidity is lower than 85%.
(2) The shelf life of a dry-packaged product is 12 months from the date when the product is packaged and sealed.
(3) The package contains a humidity indicator card (HIC). Figure 6-4 HIC for WB8P 3. Bake a module based on HIC status as follows when you unpack the module package:
(1) If the 30%, 40%, and 50% circles are blue, bake the module for 2 consecutive hours.
(2) If the 30% circle is pink, bake the module for 4 consecutive hours.
(3) If the 30% and 40% circles are pink, bake the module for 6 consecutive hours.
(4) If the 30%, 40%, and 50% circles are pink, bake the module for 12 consecutive hours. 4. Baking settings:
(1) Baking temperature: 1255C
(2) Alarm temperature: 130C
(3) SMT placement ready temperature after natural cooling: < 36C
(4) Number of drying times: 1
(5) Rebaking condition: The module is not soldered within 12 hours after baking. 5. Do not use SMT to process modules that have been unpacked for over three months. Electroless nickel immersion gold (ENIG) is used for the PCBs. If the solder pads are exposed to the air for over three months, they will be oxidized severely and dry joints or solder skips may occur. Tuya is not liable for such problems and consequences. 6. Before SMT placement, take electrostatic discharge (ESD) protective measures. 7. To reduce the reflow defect rate, draw 10% of the products for visual inspection and AOI before first SMT placement to determine a proper oven temperature and component placement method. Draw 5 to 10 modules every hour from subsequent batches for visual inspection and AOI. 15 6.4 Recommended Oven Temperature Curve WB8P Datesheet 1. Perform SMT placement based on the following reflow oven temperature curve. The highest temperature is 245C. Figure 6-5 Oven temperature curve 16 6.5 Storage Conditions WB8P datesheet 6.6 Appendix - declaration Federal Communications Commission (FCC) Declaration of Conformity FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate this equipment. This device complies with Part 15 of the FCC Rules.Operation is subject to the following two conditions:
(1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Note: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can 17 WB8P datesheet radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:
Reorient or relocate the receiving antenna. Increase the separation between the equipment and receiver. Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. Consult the dealer or an experienced radio/TV technician for help. This equipment complies with FCC radiation exposure limits set forth for an uncontrolled rolled environment. This equipment should be installed and operated with minimum distance 20cm between Radiation Exposure Statement the radiator and your body. Important Note This radio module must not installed to co-locate and operating simultaneously with other radios in host system except in accordance with FCC multi-transmitter product procedures. Additional testing and equipment authorization may be required to operating simultaneously with other radio. The availability of some specific channels and/or operational frequency bands are country dependent and are firmware programmed at the factory to match the intended destination. The firmware setting is not accessible by the end user. The host product manufacturer is responsible for compliance to any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. The final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed. This device have got a FCC ID2ANDL-WB8P.The final end product must be labeled in a visible area with the following: Contains Transmitter Module FCC ID: 2ANDL-WB8P 18 This device is intended only for OEM integrators under the following conditions:
WB8P datesheet 1The antenna must be installed such that 20cm is maintained between the antenna and users, and 2) The transmitter module may not be co-located with any other transmitter or antenna. As long as 2 conditions above are met, further transmitter test will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed. ISED Compliance This device contains licence-exempt transmitter(s)/receiver(s) that comply with Innovation, Science and Economic Development Canadas licence-exempt RSS(s). Operation is subject to the following two conditions:
1) This device may not cause interference. 2) This device must accept any interference, including interference that may cause undesired operation of the device. Lmetteur/rcepteur exempt de licence contenu dans le prsent appareil est conforme aux CNR dInnovation, Sciences et Dveloppement conomique Canada applicables aux appareils radio exempts de licence. Lexploitation est autorise aux deux conditions suivantes :
1) Lappareil ne doit pas produire de brouillage;
2) Lappareil doit accepter tout brouillage radiolectrique subi, mme si le brouillage est susceptible den compromettre le fonctionnement. ISED 20cm RF Exposure and your body. corps. The device should be installed and operated with a minimum distance of 20 cm between the radiator L'appareil doit tre install et utilis avec une distance minimale de 20 cm entre le radiateur et votre This device have got a IC23243-WB8P.The final end product must be labeled in a visible area with the following: Contains Transmitter Module IC23243-WB8P 19 WB8P datesheet Please notice that if the ISED certification number is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. This exterior label can use wording such as the following:
Contains IC:23243-WB8P any similar wording that expresses the same meaning may be used. l'appareil hte doit porter une tiquette donnant le numro de certification du module d'Industrie Canada, prcd des mots Contient un module d'mission , du mot IC:23243-WB8P ou d'une formulation similaire exprimant le mme sens Declaration of Conformity European notice Hereby, Hangzhou Tuya Information Technology Co., Ltd declares that this module product is in compliance with essential requirements and other relevant provisions of Directive 2014/53/EU,2011/65/EU.A copy of the Declaration of conformity can be found at https://www.tuya.com The device could be used with a separation distance of 20cm to the human body 20