WXU Module Datasheet Version: 20230206 Online Version Contents Contents 1 Overview 2 1.1 Features . 2 1.2 Applications . 2 2 Module interfaces 3 2.1 Dimensions and package . 3 2.2 Pin definition . 3 3 Electrical parameters 9
. 9 3.1 Absolute electrical parameters 3.2 Working conditions
. 9 3.3 RF power consumption . 10 3.4 Working power consumption . 11 4 RF parameters 14 4.1 Basic RF features
. 14 4.2 TX performance . 14 5 Antenna information 18 5.1 Antenna type . 18 5.2 Antenna interference reduction . 18 6 Packaging information and production instructions 19 6.1 Mechanical dimensions
. 19 6.2 Recommended PCB packaging . 23 6.3 Production instructions
. 25 6.4 Recommended oven temperature curve . 27 6.5 Storage conditions . 30 7 MOQ and packaging information 8 Appendix: Statement 31 32 I Contents WXU is a low-power embedded Wi-Fi+Bluetooth module that Tuya has developed. Embedded with the Wi-Fi network protocol stack and rich library functions, it consists of a highly integrated RF chip (T103C-HL). 1 / 34 1 Overview 1 Overview With the maximum CPU clock rate of 160 MHz, WXU also contains a low-power ARMv8 MCU, a WLAN MAC, a 1T1R WLAN, a 320-KB SRAM, a 2-MB flash memory, and extensive peripherals. WXU is an RTOS platform that integrates all function libraries of the Wi-Fi MAC and TCP/IP protocol. You can develop embedded Wi-Fi products as required. 1.1 Features Embedded low-power ARMv8 MCU, which can also function as an application processor Main clock rate: 160 MHz Working voltage: 2.5 to 5.5V Peripherals: 13 GPIOs, 1 Data UART, 1 log UART, and 1ADC Wi-Fi and Bluetooth connectivity 802.11 b/g/n20 Channels 1 to 14@2.4 GHz (CH1 to 11 for US/CA and CH1 to 13 for EU/CN) Support WEP, WPA, WPA2, and WPA2 PSK (AES) security modes Support Bluetooth Low Energy 5.0 Up to + 20 dBm output power in 802.11b mode Support the SmartConfig function for Android and iOS devices Onboard PCB antenna Passed CE and FCC certifications Working temperature: -40C to 85C 1.2 Applications Intelligent building Smart household and home appliances Smart socket and light Industrial wireless control Baby monitor Network camera Intelligent bus 2 / 34 2 Module interfaces 2 Module interfaces 2.1 Dimensions and package WXU has 3 rows of pins. The spacing of pins at the two sides is 1.4 mm, and the spacing of pins at the bottom is 1.8 mm. The dimensions of WXU are 15.80.35 mm (W) 20.30.35 mm (L) 2.50.15 mm (H). The dimensions of WXU are as follows:
2.2 Pin definition 3 / 34 Pin number Symbol II/O type Function 2 Module interfaces 1 2 3 4 5 PB07 I/O PB04 I/O RX1 I/O TX1 I/O ADC I/O 4 / 34 GPIOB_7, common GPIO, which can be reused as SPI_SCK and corresponds to Pin 23 of the IC GPIOB_4, common GPIO, which can be reused as SPI_MOSI and corresponds to Pin 22 of the IC GPIOB_15, common GPIO, UART1_RXD (user serial interface), which corresponds to Pin 26 of the IC GPIOB_14, common GPIO, UART1_TXD (user serial interface), which corresponds to Pin 27 of the IC GPIOA_11, common GPIO, which can be used as ADC. The range of input voltage is 0 to 2.5V. Correspond to Pin 4 of the IC. Pin number Symbol II/O type Function 2 Module interfaces 6 7 8 9 10 11 RX2 I/O TX2 I/O PB03 PA20 PA19 PA13 I/O I/O I/O I/O 5 / 34 GPIOA_21, UART2_Log_RXD
(used to receive the external logs of the module), which can be configured as a common GPIO GPIOA_22, UART2_Log_TXD
(used to send the internal logs of the module), which can be configured as a common GPIO GPIOB_03, hardware PWM, which corresponds to Pin 24 of the IC GPIOA_20, hardware PWM, which corresponds to Pin 8 of the IC GPIOA_19, hardware PWM, which corresponds to Pin 7 of the IC GPIOA_13, hardware PWM, which corresponds to Pin 6 of the IC Pin number Symbol II/O type Function 2 Module interfaces 12 PA23 I/O 13 14 15 16 GND VBAT TX0 RX0 P P I/O I/O GPIOA_23, common GPIO, which corresponds to Pin 11 of the IC. PA23 is not recommended to pull up. If a high level is detected during power on startup or reset, it will enter the test mode. Power supply reference ground Power supply pin
(Typical 3.3V) GPIOB_00, UART0_TXD (user serial interface) GPIOB_01, UART0_RXD (user serial interface) 6 / 34 Pin number Symbol II/O type Function 2 Module interfaces 17 PB02 I/O 18 RSTN I/O 19 20 PA12 PB05 I/O I/O 7 / 34 GPIOB_02, common GPIO, which corresponds to Pin 25 of the IC. PB02 is not recommended to pull down. If a low level is detected during power on startup or reset, it will enter the firmware burning mode. Enabling pin, active at the low level. The module has been pulled to a high level and the user can control the pin externally GPIOA_12, hardware PWM, which corresponds to Pin 5 of the IC GPIOB_5, common GPIO, which can be reused as SPI_MISO and corresponds to Pin 21 of the IC Pin number Symbol II/O type Function 2 Module interfaces 21 PB06 I/O GPIOB_6, common GPIO, which can be reused as SPI_CS and corresponds to Pin 20 of the IC Note: P indicates a power supply pin and I/O indicates an input/output pin. 8 / 34 3 Electrical parameters 3 Electrical parameters 3.1 Absolute electrical parameters Parameter Description Minimum value Maximum value Unit Storage temperature Power supply voltage TAMB-25C TAMB-25C
-55
-0.3
Ts VBAT ESD voltage
(human body model) ESD voltage
(machine model) 3.2 Working conditions 125 5.5 2 0.5 C V KV KV Parameter Description Minimum value Typical value Maximum value Ta VBAT VIL VIH VOL
-40 2.5
-0.3 2.06
-0.3 Working tempera-
ture Working voltage I/O low level input I/O high level input I/O low level output
9 / 34 85 5.5 1.32 3.6 0.4 Unit C V V V V 3 Electrical parameters Unit V mA pF Unit mA mA mA mA mA mA Parameter Description Minimum value Typical value Maximum value
2 3.6 30
VOH Imax Cpad 2.9
I/O high level output I/O drive current Input pin capaci-
tance 3.3 RF power consumption TX power consumption:
Symbol Mode Power Average value Peak value
(Typical value) IRF IRF IRF IRF IRF IRF 280 284 276 284 276 268 11b 1Mbps 17 dBm 11b 11Mbps 17 dBm 11g 6Mbps 16 dBm 16 dBm 141 135 137 174 11g 54Mbps 11n BW20 MCS0 11n BW20 MCS7 16 dBm 140 15 dBm 126 10 / 34 RX power consumption:
Symbol Mode Average value Peak value
(Typical value) Unit 3 Electrical parameters mA mA mA mA mA mA Unit mA IRF IRF IRF IRF IRF IRF 11B 1M 11B 11M 11G 6M 11G 54M 11N HT20 MCS0 11N HT20 MCS7 40 41 40 40 40 40 56 56 56 56 56 56 3.4 Working power consumption Working mode Quick network connection state
(Bluetooth) Quick network connection state (AP) Working status, Ta =
25C The module is in the fast network connection state and the Wi-Fi indicator flashes fast The module is in the hotspot network connection state and the Wi-Fi indicator flashes slowly Maximum value (Typical value) Average value 46 400 55 412 mA 11 / 34 3 Electrical parameters Maximum value (Typical value) Average value 47 408 Unit mA 12 310 mA 34 372 mA 39 378 mA Working mode Quick network connection state (EZ) No operation during network connection Operations are being performed during network connection Weakly connected Working status, Ta =
25C The module is in the fast network connection state and the Wi-Fi indicator flashes fast The module is connected to the network and the Wi-Fi indicator is always on The module is connected to the network and the Wi-Fi indicator is always on The module and the hotspot are weakly connected and the Wi-Fi indicator light is always on 12 / 34 3 Electrical parameters Maximum value (Typical value) Average value 57 420 Unit mA 23 20 mA 230
A Working mode Disconnected Module disabled DTIM10 Working status, Ta =
25C The module is in a disconnected state and the Wi-Fi indicator light is always off The EN pin of the module is connected to the ground. The module is in low power consumption mode and wakes up once every 1000 ms Note: When the module is powered on, started/reset, and works normally, there is a high instantaneous peak current. It is recommended that the customers backplane add two 22F/withstand voltage 25V/0805 packaged large capacitors at the power input of the module. The above test data is based on adding two 22F capacitors. The recommended current is greater than 500mA during normal operation. 13 / 34 4 RF parameters 4 RF parameters 4.1 Basic RF features Parameter Description Frequency range Wi-Fi standard 2.400 to 2.4835 GHz IEEE 802.11b/g/n (channels 1 to 14) Bluetooth standard Bluetooth 5.0: 1/2Mbps Data transmission rate 11b: 1, 2, 5.5, 11 (Mbps) Data transmission rate 11g: 6, 9, 12, 18, 24, 36, 48, 54 (Mbps) Data transmission rate 11n: HT20 MCS0 to 7 Antenna type PCB antenna with a gain of 1.01 dBi 4.2 TX performance TX performance:
Parameter Average RF output power, 802.11b CCK Mode 1M Average RF output power, 802.11b CCK Mode 11M Average RF output power, 802.11g OFDM Mode 6M Minimum value Typical value Maximum value
17 17 16
14 / 34 Unit dBm dBm dBm Minimum value Typical value Maximum value Parameter Average RF output power, 802.11g OFDM Mode 54M Average RF output power, 802.11n OFDM Mode MCS0 Average RF output power, 802.11n OFDM Mode MCS7 Average RF output power, Bluetooth 5.0 1M
Frequency error
-20
EVM@802.11b CCK 11 Mbps Mode 17 dBm EVM@802.11g OFDM 54 Mbps Mode 16 dBm EVM@802.11n OFDM MCS7 Mode 15 dBm 16 16 15 7
4 RF parameters Unit dBm dBm dBm dBm ppm dB dB
20
-17
-29
-30 dB 15 / 34 4 RF parameters Unit dBm dBm dBm dBm dBm dBm dBm RX Performance:
Parameter PER<8%, RX sensitivity, 802.11b CCK Mode 1M PER<8%, RX sensitivity, 802.11b CCK Mode 11M PER<10%, RX sensitivity, 802.11g OFDM Mode 6M PER<10%, RX sensitivity, 802.11g OFDM Mode 54M PER<10%, RX sensitivity, 802.11n OFDM Mode MCS0 PER<10%, RX sensitivity, 802.11n OFDM Mode MCS7 PER<10%, RX sensitivity, Bluetooth 5.0 1M Minimum Value Typical Value Maximum Value
-96
-90
-91
-75
-91
-72
-95 16 / 34 4 RF parameters Minimum Value Typical Value Maximum Value
-93
Unit dBm Parameter PER<10%, RX sensitivity, Bluetooth 5.0 2M 17 / 34 5 Antenna information 5 Antenna information 5.1 Antenna type WXU uses only the onboard PCB antenna with a gain of 1.01 dBi. 5.2 Antenna interference reduction To ensure optimal Wi-Fi performance when the Wi-Fi module uses an onboard PCB antenna, it is recommended that the antenna be at least 15 mm away from other metal parts. 18 / 34 6 Packaging information and production instructions 6 Packaging information and production instructions 6.1 Mechanical dimensions The mechanical dimensions of the PCB of WXU are 15.80.35 mm (W) 20.30.35 mm (L) 1.00.1 mm (H). The following figure shows the mechanical dimensions of WXU:
19 / 34 6 Packaging information and production instructions 20 / 34 6 Packaging information and production instructions 21 / 34 6 Packaging information and production instructions 22 / 34 6 Packaging information and production instructions Note: The default dimensional tolerance is 0.35 mm. If customers have spe-
cific requirements on dimensions, they should make them clear in the module datasheet after communication. 6.2 Recommended PCB packaging The following figure is the schematic diagram of WXU:
The following figure is the diagram of PCB packaging:
23 / 34 6 Packaging information and production instructions 24 / 34 6 Packaging information and production instructions 6.3 Production instructions 1. For the modules that can be packaged with the SMT or in an in-line way, you can select either of them according to the PCB design solutions of customers. If a PCB is designed to be SMT-packaged, package the module with the SMT. If a PCB is designed to be in-line-packaged, package the module in an in-line way. After being unpacked, the module must be soldered within 24 hours. Otherwise, it needs to be put into the drying cupboard where the relative humidity is not greater than 10%; or it needs to be packaged again under vacuum and the exposure time needs to be recorded (the total exposure time cannot exceed 168 hours).
(SMT process) SMT devices:
Mounter SPI Reflow soldering machine Thermal profiler Automated optical inspection (AOI) equipment
(Wave soldering process) Wave soldering devices:
Wave soldering equipment Wave soldering fixture Constant-temperature soldering iron Tin bar, tin wire, and flux Thermal profiler Baking devices:
Cabinet oven Anti-electrostatic and heat-resistant trays Anti-electrostatic and heat-resistant gloves 2. Storage conditions for a delivered module:
The moisture-proof bag must be placed in an environment where the tem-
perature is below 40C and the relative humidity is lower than 90%. The shelf life of a dry-packaged product is 12 months from the date when the product is packaged and sealed. There is a humidity indicator card (HIC) in the packaging bag. 25 / 34 6 Packaging information and production instructions Figure 1: HIC-SMT and in-line module.png 3. The module needs to be baked in the following cases:
The packaging bag is damaged before unpacking. There is no humidity indicator card (HIC) in the packaging bag. After unpacking, circles of 10% and above on the HIC become pink. The total exposure time has lasted for over 168 hours since unpacking. More than 12 months have passed since the sealing of the bag. 4. Baking settings:
Temperature: 40C and 5% RH for reel package and 125C and 5%
RH for tray package (please use the heat-resistant tray rather than plastic container) Time: 168 hours for reel package and 12 hours for tray package Alarm temperature: 50C for reel package and 135C for tray package Production-ready temperature after natural cooling: < 36C Re-baking situation: If a module remains unused for over 168 hours after being baked, it needs to be baked again. If a batch of modules is not baked within 168 hours, do not use wave soldering to solder them. Because these modules are Level-3 moisture-
sensitive devices, they are very likely to get damp when exposed beyond the allowable time. In this case, if they are soldered at high temperatures, it may result in device failure or poor soldering. 5. In the whole production process, take electrostatic discharge (ESD) protective measures. 6. To guarantee the passing rate, it is recommended that you use the SPI and AOI to monitor the quality of solder paste printing and mounting. 26 / 34 6 Packaging information and production instructions 6.4 Recommended oven temperature curve Select a proper soldering manner according to the process. For the SMT process, please refer to the recommended oven temperature curve of reflow soldering. For the wave soldering process, please refer to the recommended oven temperature curve of wave soldering. There are some differences between the set temperatures and the actual temperatures. All the temperatures shown in this module datasheet are obtained through actual measurements. Manner 1: SMT process (Recommended oven temperature curve of reflow soldering) Set oven temperatures according to the following curve. A: Temperature axis B: Time axis C: Liquidus temperature: 217 to 220C D: Ramp-up slope: 1 to 3C/s E: Duration of constant temperature: 60 to 120s; the range of constant tem-
perature: 150 to 200C 27 / 34 6 Packaging information and production instructions F: Duration above the liquidus: 50 to 70s G: Peak temperature: 235 to 245C H: Ramp-down slope: 1 to 4C/s Note: The above curve is just an example of the solder paste SAC305. For more details about other solder pastes, please refer to Recommended oven temperature curve in the solder paste specifications. Manner 2: Wave soldering process (Oven temperature curve of wave sol-
dering) Set oven temperatures according to the following temperature curve of wave sol-
dering. The peak temperature is 260C5C. 28 / 34 6 Packaging information and production instructions Suggestions on oven temperature curve of wave soldering Suggestions on manual soldering temperature Preheat temperature 80 to 130 C Soldering temperature 36020C Preheat time 75 to 100s Soldering time 3s/point Peak contact time 3 to 5s Temperature of tin cylinder 2605C Ramp-up slope 2C/s Ramp-down slope 6C/s NA NA NA NA NA NA NA NA 29 / 34 6 Packaging information and production instructions 6.5 Storage conditions 30 / 34 7 MOQ and packaging information 7 MOQ and packaging information Product number MOQ (pcs) Packing method The number of modules per reel The number of reels per carton WXU 4400 Tape reel 1100 4 31 / 34 8 Appendix: Statement 8 Appendix: Statement FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the users authority to operate this device. The module is limited to installation in mobile or fixed applications. This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and
(2) this device must accept any interference received, including interference that may cause undesired operation. Note: This device has been tested and found to comply with the limits for a Class B digital device, according to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential instal-
lation. This device generates, uses, and can radiate radio frequency energy and, if not installed and used following the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this device does cause harmful interference to radio or television reception, which can be determined by turning the device off and on, the user is encouraged to try to correct the interference by one or more of the following measures:
Reorient or relocate the receiving antenna. Increase the separation between the device and receiver. Connect the device to an outlet on a circuit different from that to which the receiver is connected. Consult the dealer or an experienced radio/TV technician for help. Radiation Exposure Statement This device complies with FCC radiation exposure limits set forth for an uncontrolled rolled environment. This device should be installed and operated with a minimum distance of 20cm between the radiator and your body. Important Note This radio module must not be installed to co-locate and operate simultaneously with other radios in the host system except by following FCC multi-transmitter prod-
uct procedures. Additional testing and device authorization may be required to operate simultaneously with other radios. The availability of some specific channels and/or operational frequency bands are 32 / 34 8 Appendix: Statement country dependent and are firmware programmed at the factory to match the in-
tended destination. The firmware setting is not accessible to the end-user. The host product manufacturer is responsible for compliance with any other FCC rules that apply to the host not covered by the modular transmitter grant of certifi-
cation. The final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed. The separate approval is required for all other op-
erating configurations including portable configurations with respect to Part 2.1093 and different antenna configuration. The end-user manual shall include all required regulatory information/warnings as shown in this manual, including This product must be installed and operated with a minimum distance of 20 cm between the radiator and user body. The OEM integrator is responsible for ensuring that the end-user has no manual instructions to remove or install module. This device has got an FCC ID: 2ANDL-WXU. The end product must be labeled in a visible area with the following: Contains Transmitter Module FCC ID: 2ANDL-WXU
. This device is intended only for OEM integrators under the following conditions:
The antenna must be installed such that 20cm is maintained between the antenna and users, and the transmitter module may not be co-located with any other trans-
mitter or antenna. As long as the 2 conditions above are met, further transmitter tests will not be re-
quired. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed. Declaration of Conformity European Notice Hereby, Hangzhou Tuya Information Technology Co., Ltd declares that this module product is in compliance with essential requirements and other relevant provisions of Directive 2014/53/EU, 2011/65/EU. A copy of the Declaration of conformity can be found at https://www.tuya.com. 33 / 34 8 Appendix: Statement This product must not be disposed of as normal household waste, in accordance with the EU directive for waste electrical and electronic equipment (WEEE-2012/19/EU). Instead, it should be disposed of by returning it to the point of sale, or to a municipal recycling collection point. The device could be used with a separation distance of 20cm from the hu-
man body. 34 / 34