Product Manual Product Manual Global Intelligent Platform WR3N Datasheet Tuya WR3N Wi-Fi Module Version: 1.0.1 Date: 2020-03-19 No.: 0000000001 1 Product Overview WR3N is a low-power embedded Wi-Fi module that Tuya has developed. It consists of a highly integrated RF chip (RTL8710BN) and an external flash chip, with an embedded Wi-Fi network protocol stack and robust library functions. WR3N also contains a low-power Arm Cortex-M4F microcontroller unit (MCU), WLAN MAC protocol, 1T1R WLAN module, 256 KB static random-access memory (SRAM), 2 MB flash memory, and extensive peripherals. WR3N also contains N32S032 security chip, embeded with hardware algorithm co-processor to provide excellent performance DES / 3DES, AES, SHA, RSA, ECC and national commercial passwords SM1 / SM2 / SM3 / SM4 and other security algorithm modules. WR3N is an RTOS platform that integrates all function libraries of the Wi-Fi MAC and TCP/IP protocols. You can develop embedded Wi-Fi products as required. Embedded low-power 32-bit CPU, which can also function as an application 1.1 Features processor Clock rate: 125 MHz Working voltage: 3.0 V to 3.6 V Peripherals: 7GPIOs, 2UART, 1ADC Wi-Fi connectivity 802.11b/g/n20/n40 Channels 1 to 14 at 2.4 GHz WPA and WPA2 security modes Up to +20 dBm output power in 802.11b mode STA, AP, and STA+AP working modes 1 WR3N Datasheet Smart and AP network configuration modes for Android and iOS devices Onboard PCB antenna Working temperature: 20C to +85C Smart household and home appliances 1.2 Applications Intelligent building Smart socket and light Industrial wireless control Network camera Intelligent bus 2 WR3N Datasheet Change History No. Date Change Description 2019-12-28 This is the first release. 2020-03-19 Update RF Current Consumption Version After Change 1.0.0 1.0.1 1 2 3 WR3N Datasheet Contents 1 Product Overview ......................................................................................................... 1 1.1 Features ............................................................................................................ 1 1.2 Applications....................................................................................................... 2 Change History .................................................................................................................... 3 2 Module Interfaces ......................................................................................................... 5 2.1 Dimensions and Footprint ................................................................................. 5 2.2 Interface Pin Definition...................................................................................... 5 2.3 Test Pin Definition ............................................ 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Bookmark not defined. 3 Electrical Parameters ................................................................................................... 7 3.1 Absolute Electrical Parameters ........................................................................ 7 3.2 Electrical Conditions ......................................................................................... 7 3.3 RF Current Consumption .................................................................................. 8 3.4 Working Current ................................................................................................ 8 4 RF Features ................................................................................................................ 10 4.1 Basic RF Features .......................................................................................... 10 4.2 TX Performance .............................................................................................. 10 4.3 RX Performance ............................................................................................. 11 5 Antenna Information ................................................................................................... 11 5.1 Antenna Type .................................................................................................. 11 5.2 Antenna Interference Reduction ..................................................................... 11 6 Packaging Information and Production Instructions................................................... 12 6.1 Mechanical Dimensions .................................................................................. 12 6.2 Recommended PCB Layout ........................................................................... 13 6.3 Production Instructions ................................................................................... 14 6.4 Recommended Oven Temperature Curve ...................................................... 15 6.5 Storage Conditions ......................................................................................... 17 4 WR3N Datasheet 2 Module Interfaces 2.1 Dimensions and Footprint WR3N has two rows of pins (2 x 8 ) with a 2 mm pin spacing. The WR3N dimensions (W x D x H) are 160.35 mm x 240.35 mm x 2.90.15 mm. The PCB thickness is 0.80.1 mm. The shield cover height is 2.00.05 mm. 2.2 Interface Pin Definition Table 2-1 WR3N interface pins Pin No. Symbol I/O Type Function 1 2 3 RST ADC
AI Reset ADC pin with the maximum output voltage of 5 V CHIP_EN I/O Function has been disabled by software, users can disconnect it 5 WR3N Datasheet Pin No. Symbol I/O Type Function 4 GPIOA_29 I/O UART_Log_RXD, which is used for printing the module internal information and can be configured as a common GPIO (The pin has been pulled up and cannot be set to be triggered at a high level.) 5 6 7 8 9 12 13 GPIOA_14 I/O GPIOA_14, hardware PWM pin, which is connected to pin 13 on the internal IC GPIOA_15 I/O GPIOA_15, hardware PWM pin, which is connected to pin 14 on the internal IC GPIOA_0 I/O GPIOA_0, hardware PWM pin, which is connected to pin 16 on the internal IC (The pin cannot be pulled up during power-on and can be configured after power-on. VCC GND Power supply pin (3.3 V) Power supply reference ground pin P P
10 NC NC 11 TX0 I/O UART_Log_TXD, which is used for printing the module internal information and can be configured as a common GPIO NC
NC GPIOA_5 I/O GPIOA_5, hardware PWM pin, which is connected to pin 28 on the internal IC 14 GPIOA_12 I/O GPIOA_12, hardware PWM pin, which is connected to pin 17 on the internal IC 15 RXD I/O UART0_RXD, which is used as a user-side serial interface pin 16 TXD I/O UART0_TXD, which is used as a user-side serial interface pin Note:
P indicates power supply pins I/O indicates input/output pins AI indicates analog input pins. 6 WR3N Datasheet 3 Electrical Parameters 3.1 Absolute Electrical Parameters Table 3-1 Absolute electrical parameters Parameter Description Minimum Maximum Unit Ts VDD Value Value 40 105 C 0.3 3.6 V Storage temperature Power supply voltage Static electricity voltage
(human body model) Static electricity voltage
(machine model) Tamb = 25C N/A 2 Tamb = 25C N/A 0.5 kV kV 3.2 Electrical Conditions Table 3-2 Normal electrical conditions Parameter Description Minimum Maximum Unit Value Value Typical Value Ta Working temperature 20 VDD Working voltage 3.0 I/O low-level input 0.3 3V3*0.25 I/O high-level input 3V3*0.75 I/O low-level output N/A 3V3*0.1 I/O high-level output 3V3*0.8 N/A N/A N/A N/A N/A N/A N/A 2 85 3.6 3.6 3V3 12 N/A C V V V V V mA pF VIL VIH VOL VOH Imax Cpad I/O drive current IO input pin capacitance N/A N/A 7 WR3N Datasheet 3.3 RF Current Consumption Table 3-3 Power consumption during constant transmission and receiving Parameter Working Status Mode Rate Typical Value Unit TX Power/
Receiving TX 802.11b 11 Mbit/s
+17.5 dBm 350 802.11g 54 Mbit/s
+14.5 dBm 320 802.11n MCS0
+13.5 dBm 350 802.11n MCS7
+13.5 dBm 300 802.11b 11 Mbit/s 137 mA mA mA mA mA RX 802.11g 54 Mbit/s 137 mA 802.11n MCS7 137 mA Constant receiving Constant receiving Constant receiving EZ AP Network connect without operation 3.4 Working Current Table 3-4 WR3N working current Working Mode Working Status (Ta = 25C) Typical Value Peak Value*
Unit 177 418 mA The module is in EZ mode, and the Wi-Fi indicator blinks quickly. The module is in AP mode, and the Wi-Fi indicator blinks slowly. 168 434 mA The internet is connected, and the Wi-Fi indicator always blinks. 155 430 mA Network connect with operation The internet is connected, and the Wi-Fi indicator always blinks. 154 430 mA 8 WR3N Datasheet Working Mode Working Status (Ta = 25C) Network disconnect The internet is disconnected, and the Wi-Fi indicator not blink. Typical Value Peak Value*
Unit 155 414 mA 9 WR3N Datasheet 4 RF Features 4.1 Basic RF Features Table 4-1 Basic RF features Parameter Description Frequency band 2.412 GHz to 2.4835 GHz Wi-Fi standard IEEE 802.11b/g/n (channels 1 to 14) Data transmission rate 802.11b: 1, 2, 5.5, or 11 (Mbit/s) 802.11g: 6, 9, 12, 18, 24, 36, 48, or 54 (Mbit/s) 802.11n: HT20 MCS0 to MCS7 802.11n: HT40 MCS0 to MCS7 Antenna type Onbiard PCB antenna 4.2 TX Performance Table 4-2 Performance during constant transmission Parameter Minimum Value Typical Value Value Maximum Unit 1 Mbit/s N/A 17.5 N/A dBm 54 Mbit/s N/A 14.5 N/A dBm MCS7 N/A 13.5 N/A dBm Average RF output power, 802.11b CCK mode Average RF output power, 802.11g OFDM mode Average RF output power, 802.11n OFDM mode Frequency error 20
+20 ppm EVM under 802.11b CCK, 11 Mbit/s, 17.5 dBm EVM under 802.11g OFDM, 54 Mbit/s, 15.0 dBm EVM under 802.11n OFDM, MCS7, 14.0 dBm N/A 16 30 31 dB dB dB 10 WR3N Datasheet 4.3 RX Performance Table 4-3 RX sensitivity Parameter Minimum Value Typical Value Maximum Value PER < 8%, 802.11b CCK mode 1 Mbit/s N/A 91 N/A PER < 10%, 802.11g OFDM mode 54 Mbit/s N/A 75 N/A PER < 10%, 802.11n OFDM mode MCS7 N/A 72 N/A Unit dBm dBm dBm 5 Antenna Information 5.1 Antenna Type WR3N uses an onboard PCB antenna(default way). 5.2 Antenna Interference Reduction To ensure optimal Wi-Fi performance when the Wi-Fi module uses an onboard PCB antenna, it is recommended that the antenna be at least 15 mm away from other metal parts. To prevent adverse impact on the antenna radiation performance, avoid copper or traces along the antenna area on the PCB. Ensure that there are no substrate media above or below the antenna and that copper is at a certain distance away from the antenna to maximize the antenna radiation performance. 11 WR3N Datasheet 6 Packaging Information and Production Instructions 6.1 Mechanical Dimensions 12 WR3N Datasheet 6.2 Recommended PCB Layout 13 WR3N Datasheet 6.3 Production Instructions 1. Use an SMT placement machine to mount the stamp hole module that Tuya produces onto the PCB within 24 hours after the module is unpacked and the firmware is burned. If not, vacuum pack the module again. Bake the module before mounting it onto the PCB.
(1) SMT placement equipment i. Reflow soldering machine ii. Automated optical inspection (AOI) equipment iii. Nozzle with a 6 mm to 8 mm diameter
(2) Baking equipment i. Cabinet oven ii. Anti-static heat-resistant trays iii. Anti-static heat-resistant gloves 2. Storage conditions for a delivered module are as follows:
(1) The moisture-proof bag is placed in an environment where the temperature is below 30C and the relative humidity is lower than 70%.
(2) The shelf life of a dry-packaged product is six months from the date when the product is packaged and sealed.
(3) The package contains a humidity indicator card (HIC). package:
hours. 3. Bake a module based on HIC status as follows when you unpack the module
(1) If the 30%, 40%, and 50% circles are blue, bake the module for 2 consecutive
(2) If the 30% circle is pink, bake the module for 4 consecutive hours. 14 WR3N Datasheet
(3) If the 30% and 40% circles are pink, bake the module for 6 consecutive hours.
(4) If the 30%, 40%, and 50% circles are pink, bake the module for 12 consecutive hours. 4. Baking settings:
(1) Baking temperature: 1255C
(2) Alarm temperature: 130C
(3) SMT placement ready temperature after natural cooling: < 36C
(4) Number of drying times: 1
(5) Rebaking condition: The module is not soldered within 12 hours after baking. 5. Do not use SMT to process modules that have been unpacked for over three months. Electroless nickel immersion gold (ENIG) is used for the PCBs. If the solder pads are exposed to the air for over three months, they will be oxidized severely and dry joints or solder skips may occur. Tuya is not liable for such problems and consequences. 6. Before SMT placement, take electrostatic discharge (ESD) protective measures. 7. To reduce the reflow defect rate, draw 10% of the products for visual inspection and AOI before first SMT placement to determine a proper oven temperature and component placement method. Draw 5 to 10 modules every hour from subsequent batches for visual inspection and AOI. 6.4 Recommended Oven Temperature Curve Perform SMT placement based on the following reflow oven temperature curve. The highest temperature is 245C. Based on the IPC/JEDEC standard, perform reflow soldering on a module at most twice. 15 WR3N Datasheet 16 WR3N Datasheet 6.5 Storage Conditions Appendix: Statement Federal Communications Commission (FCC) Declaration of Conformity FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate this equipment. This device complies with Part 15 of the FCC Rules.Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Note: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules.These limits are designed to provide reasonable protection against harmful interference in a residential installation. This 17 WR3N Datasheet equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:
Reorient or relocate the receiving antenna. Increase the separation between the equipment and receiver. Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. Consult the dealer or an experienced radio/TV technician for help. Radiation Exposure Statement This equipment complies with FCC radiation exposure limits set forth for an uncontrolled rolled environment. This equipment should be installed and operated with minimum distance 20cm between the radiator and your body. Important Note This radio module must not installed to co-locate and operating simultaneously with other radios in host system except in accordance with FCC multi-transmitter product procedures. Additional to operating simultaneously with other radio. testing and equipment authorization may be required The availability of some specific channels and/or operational frequency bands are country dependent and are firmware programmed at the factory to match the intended destination. The firmware setting is not accessible by the end user. The host product manufacturer is responsible for compliance to any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. The final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed. The end user manual shall include all required regulatory information/warning as shown in this manual, including: This product must be installed and operated with a minimum distance of 20 cm between the radiator and user body. This device have got a FCC ID2ANDL-WR3N.The final end product must be labeled in a visible area with the following: Contains Transmitter Module FCC ID:2ANDL-WR3N This device is intended only for OEM integrators under the following conditions:
1) The antenna must be installed such that 20cm is maintained between the antenna and users, and 18 WR3N Datasheet 2) The transmitter module may not be co-located with any other transmitter or antenna. As long as 2 conditions above are met, further transmitter test will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed. Declaration of Conformity European notice Hereby, Hangzhou Tuya Information Technology Co., Ltd declares that this module product is in compliance with essential requirements and other relevant provisions of Directive 2014/53/EU,2011/65/EU.A copy of the Declaration of conformity can be found at https://www.tuya.com This product must not be disposed of as normal household waste, in accordance with EU directive for waste electrical and electronic equipment (WEEE- 2012/19/EU). Insteadit should be disposed of by returning it to the point of sale, or to a municipal recycling collection point. The device could be used with a separation distance of 20cm to the human body. 19