ZS24-U Module Datasheet Version: 20230221 Online Version Contents Contents 1 Product overview 2 1.1 Features . 2 1.2 Applications . 2 2 Module interfaces 3 2.1 Dimensions and footprint
. 3 2.2 Pin definition . 4 3 Electrical parameters 9
. 9 3.1 Absolute electrical parameters 3.2 Normal working conditions
. 9 3.3 TX and RX power consumption . 10
. 10 3.4 Working current 4 RF parameters 12 4.1 Basic RF features
. 12 4.2 TX performance . 12 4.3 RX performance . 12 5 Antenna information 14 5.1 Antenna type . 14 5.2 Antenna interference reduction . 14 6 Packaging information and production instructions 17 6.1 Mechanical dimensions
. 17 6.2 Side view . 19
. 20 6.3 Schematic diagram of footprint 6.4 Recommended footprint . 21 6.5 Production instructions
. 21 6.6 Recommended oven temperature curve . 24 6.7 Storage conditions . 27 7 MOQ and packaging information 8 Appendix: Statement 28 29 I Contents ZS24-U is a Zigbee module that Tuya has developed. It consists of a highly inte-
grated RF processing chip EFR32MG24, a few peripherals, a built-in 802.15.4 PHY/-
MAC network protocol stack, and rich library functions. 1 / 31 1 Product overview 1 Product overview ZS24-U is embedded with a low-power 32-bit ARM Cortex-M33 core, 1024-KB flash program memory, 128-KB RAM, and abundant peripheral resources. It integrates all function libraries of the MAC and TCP/IP. You can develop embedded Zigbee products as required. 1.1 Features Embedded ARM Cortex-M33 processor having a low-power 32-bit CPU and DSP instructions and floating-point units, which can also function as an application processor. Clock rate: 78 MHz Wide operating voltage: 2.0 to 3.8 V Peripherals: 9 GPIOs, 1 UART, 2 ADCs, and 5 PWMs Zigbee connectivity Support 802.15.4 MAC/PHY Working channels 11 to 26 @2.400 to 2.483 GHz, air interface rate: 250 Kbps Up to +10dBm output power 35 A/MHz power consumption during running; 5-A sleep current PCB antenna inside Onboard antenna with a gain of 1.1 dBi Operating temperature: -40C to 105C Support hardware encryption and AES 128/256 1.2 Applications Intelligent building Smart household and home appliances Smart socket and light Industrial wireless control Baby monitor Network camera Intelligent bus 2 / 31 2 Module interfaces 2 Module interfaces 2.1 Dimensions and footprint ZS24-U has 3 lines of pins. The spacing of pins at the two sides is 1.40.1 mm, and the spacing of pins at the bottom is 1.80.1 mm. The dimensions of the ZS24-U are 20.30.35 mm (L) 15.80.35 mm (W) 2.50.1 mm (H). The dimensions of ZS24-U are as follows:
3 / 31 2.2 Pin definition 2 Module interfaces 4 / 31 2 Module interfaces Function Common I/O pin, which corresponds to PB04 on the internal IC Common I/O pin, which corresponds to PB03 on the internal IC Burning pin, SWDIO, which corresponds to PA02 on the internal IC Burning pin, SWCLK, which corresponds to PA01 on the internal IC ADC pin, which corresponds to PB02 on the internal IC Common I/O pin, which corresponds to PA00 on the internal IC Common I/O pin, which corresponds to PB00 on the internal IC Pin number Symbol 1 2 3 4 5 6 7 PB4 PB3 PA2 Type I/O I/O I/O PA1 I/O PB2 I PA0 PB0 I/O I/O 5 / 31 2 Module interfaces Function Support hardware PWM and correspond to PC02 on the internal IC Support hardware PWM and correspond to PC01 on the internal IC Support hardware PWM and correspond to PA04 on the internal IC Support hardware PWM and correspond to PA05 on the internal IC Support hardware PWM and correspond to PA06 on the internal IC Power supply reference ground Power supply pin
(3.3V) Pin number Symbol PC2 Type I/O 8 9 10 11 12 13 14 PC1 I/O PA4 I/O PA5 I/O PA6 I/O GND VCC P P 6 / 31 2 Module interfaces Function UART_TXD0, burning authorization pin, which corresponds to PD03 on the internal IC UART_RXD0, burning authorization pin, which corresponds to PD02 on the internal IC ADC pin, which corresponds to PA08 on the internal IC Reset pin, low active, which corresponds to RESETn on the internal IC Common I/O pin, which corresponds to PA07 on the internal IC Common I/O pin, which corresponds to PA03 on the internal IC Common I/O pin, which corresponds to PB01 on the internal IC Pin number Symbol TX0 Type I/O 15 16 17 18 19 20 21
:::info RX0 I/O PA8 I RST I/O PA7 PA3 PB1 I/O I/O I/O 7 / 31 2 Module interfaces P indicates a power supply pin and I/O indicates an input/output pin. Pin 3, 4, 13, 14, and 18 are burning pins, which are not exposed by default. During routing, customers should bypass them.
8 / 31 3 Electrical parameters 3 Electrical parameters 3.1 Absolute electrical parameters Parameter Description Minimum value Maximum value Unit Storage temperature Power supply voltage TAMB-25 TAMB-25
-50 2.0
Ts VBAT ESD voltage
(human body model) ESD voltage
(machine model) 3.2 Normal working conditions 150 3.8 2 0.5 C V KV KV Parameter Description Minimum value Typical value Maximum value Ta VCC VIL VIH VOL Operating tempera-
ture Operating voltage
-40
105 2.0 3.3 3.6 VDD*0.3
VDD*0.2 I/O low level input
I/O high level input VDD*0.7
I/O low level output
9 / 31 Unit C V V V V 3 Electrical parameters Parameter Description Minimum value Typical value Maximum value VOH I/O high level output VDD*0.8
Unit V 3.3 TX and RX power consumption Working status Transmit Transmit Receive Mode Rate Transmit power/re-
ceive Average value
250 Kbps +10 dBm 19.3 250 Kbps +0 dBm 9.3 250Kbps Constantly receive 5.9 Peak value
(Typical value) 20.6 11.6 7.9 Unit mA mA mA 3.4 Working current Working mode EZ mode Working status, Ta =
25C The module is in fast network connection state. Maximum value
(Typical value) Average value 2.27 19.3 Remark Unit mA 10 / 31 Working status, Ta =
25C Average value Maximum value
(Typical value) 2.05 18.6 3 Electrical parameters Remark Unit mA Working mode Connected and busy Connected and idle The module is connected to the network and in running state. The module is connected to the network and in idle state. 3.5 Deep sleep mode Deep sleep mode 3.54 Low Power Firmware
A A 11 / 31 4 RF parameters 4 RF parameters 4.1 Basic RF features Parameter Description Working frequency Zigbee standard Data transmission rate 2.405 to 2.480 GHz IEEE 802.15.4 250 Kbps Antenna type PCB antenna with a gain of 1.1 dBi 4.2 TX performance TX performance Parameter Minimum value Typical value Maximum value 15 0.5
-31 10 1
Unit dBm dBm dBc Output power
(250Kbps)
-30
Output power adjustment stepping Output spectrum adjacent channel suppression Frequency error
-15
15 ppm 4.3 RX performance RX sensitivity 12 / 31 4 RF parameters Minimum value Typical value Maximum value
-105
-105
-104 Unit dBm Parameter PER<8%, RX sensitivity
(250 Kbps) 13 / 31 5 Antenna information 5 Antenna information 5.1 Antenna type ZS24-U uses the PCB antenna. 5.2 Antenna interference reduction To ensure optimal RF performance when the Zigbee module uses a PCB antenna, it is recommended that the antenna be at least 15 mm away from other metal parts. To prevent adverse impact on the antenna radiation performance, avoid copper or traces within the antenna area on the PCB. 14 / 31 5 Antenna information 15 / 31 5 Antenna information 16 / 31 6 Packaging information and production instructions 6 Packaging information and production instructions 6.1 Mechanical dimensions The PCB dimensions are 20.30.35 mm (W) 15.80.35 mm (L) 1.00.1 mm
(H). 17 / 31 6 Packaging information and production instructions 18 / 31 6 Packaging information and production instructions 6.2 Side view 19 / 31 6 Packaging information and production instructions 6.3 Schematic diagram of footprint 20 / 31 6 Packaging information and production instructions 6.4 Recommended footprint 6.5 Production instructions 1. For the modules that can be packaged with the SMT or in an in-line way, you can select either of them according to the PCB design solutions of customers. If a PCB is designed to be SMT-packaged, package the module with the SMT. If a PCB is designed to be in-line-packaged, package the module in an in-line way. After being unpacked, the module must be soldered within 24 hours. Otherwise, it 21 / 31 6 Packaging information and production instructions needs to be put into the drying cupboard where the relative humidity is not greater than 10%; or it needs to be packaged again under vacuum and the exposure time needs to be recorded (the total exposure time cannot exceed 168 hours).
(SMT process) SMT devices:
Mounter SPI Reflow soldering machine Thermal profiler Automated optical inspection (AOI) equipment
(Wave soldering process) Wave soldering devices Wave soldering equipment Wave soldering fixture Constant-temperature soldering iron Tin bar, tin wire, and flux Thermal profiler Baking devices:
Cabinet oven Anti-electrostatic and heat-resistant trays Anti-electrostatic and heat-resistant gloves 2. Storage conditions for a delivered module:
The moisture-proof bag must be placed in an environment in which the temperature is below 40C and the relative humidity is lower than 90%. The shelf life of a dry-packaged product is 12 months from the date when the product is packaged and sealed. There is a humidity indicator card (HIC) in the packaging bag. Figure 1: HIC-SMT and in-line module.png 22 / 31 6 Packaging information and production instructions 3. The module needs to be baked in the following cases:
The packaging bag is damaged before unpacking. There is no humidity indicator card (HIC) in the packaging bag. After unpacking, circles of 10% and above on the HIC become pink. The total exposure time has lasted for over 168 hours since unpacking. More than 12 months have passed since the sealing of the bag. 4. Baking settings:
Temperature: 40C and 5% RH for reel package and 125C and 5%
RH for tray package (please use the heat-resistant tray rather than plastic container) Time: 168 hours for reel package and 12 hours for tray package Alarm temperature: 50C for reel package and 135C for tray package Production-ready temperature after natural cooling: < 36C Re-baking situation: If a module remains unused for over 168 hours after being baked, it needs to be baked again. If a batch of modules is not baked within 168 hours, do not use reflow soldering or wave soldering to solder them. Because these modules are Level-3 moisture-sensitive devices, they are very likely to get damp when exposed beyond the allowable time. In this case, if they are soldered at high temperatures, it may result in device failure or poor soldering. 5. In the whole production process, take electrostatic discharge (ESD) protective measures. 6. To guarantee the passing rate, it is recommended that you use the SPI and AOI to monitor the quality of solder paste printing and mounting. 7. Due to the built-in crystal of the product, ordinary detergent or ultrasonic clean-
ing can be used in general, but in some cases, the vibration generated by the ultrasonic cleaning machine may cause damage to the internal structure of the crystal. If ultrasonic cleaning is used, it needs to be verified in advance to en-
sure that the internal crystal of the module will not be damaged after ultrasonic cleaning. 8. Try to avoid using ultrasonic welding to install or process products. This pro-
cessing method may cause excessive crystal vibration in the module and lead to crystal failure. 23 / 31 6 Packaging information and production instructions 6.6 Recommended oven temperature curve Select a proper soldering manner according to the process. For the SMT process, please refer to the recommended oven temperature curve of reflow soldering. For the wave soldering process, please refer to the recommended oven temperature curve of wave soldering. There are some differences between the set temperatures and the actual temperatures. All the temperatures shown in this module datasheet are obtained through actual measurements. Manner 1: SMT process (Recommended oven temperature curve of reflow soldering) Set oven temperatures according to the following curve. A: Temperature axis B: Time axis C: Liquidus temperature: 217 to 220C D: Ramp-up slope: 1 to 3C/s E: Duration of constant temperature: 60 to 120s; the range of constant tem-
perature: 150 to 200C 24 / 31 6 Packaging information and production instructions F: Duration above the liquidus: 50 to 70s G: Peak temperature: 235 to 245C H: Ramp-down slope: 1 to 4C/s
:::important The above curve is just an example of the solder paste SAC305. For more details about other solder pastes, please refer to Recommended oven temper-
ature curve in the solder paste specifications.
Manner 2: Wave soldering process (Oven temperature curve of wave sol-
dering) Set oven temperatures according to the following temperature curve of wave sol-
dering. The peak temperature is 260C5C. 25 / 31 6 Packaging information and production instructions Suggestions on oven temperature curve of wave soldering Suggestions on manual soldering temperature Preheat temperature 80 to 130 C Soldering temperature 36020C Preheat time 75 to 100s Soldering time 3s/point Peak contact time 3 to 5s Temperature of tin cylinder 2605C Ramp-up slope 2C/s Ramp-down slope 6C/s NA NA NA NA NA NA NA NA 26 / 31 6 Packaging information and production instructions 6.7 Storage conditions 27 / 31 7 MOQ and packaging information 7 MOQ and packaging information Product model MOQ (pcs) Packing method Modules per reel Reels per carton ZS24-U 4400 Tape reel 1100 4 28 / 31 8 Appendix: Statement 8 Appendix: Statement FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the users authority to operate this device. The module is limited to installation in mobile or fixed applications. This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause un-
desired operation. Note: This device has been tested and found to comply with the limits for a Class B digital device, according to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential instal-
lation. This device generates, uses, and can radiate radio frequency energy and, if not installed and used following the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this device does cause harmful interference to radio or television reception, which can be determined by turning the device off and on, the user is encouraged to try to correct the interference by one or more of the following measures:
Reorient or relocate the receiving antenna. Increase the separation between the device and receiver. Connect the device to an outlet on a circuit different from that to which the receiver is connected. Consult the dealer or an experienced radio/TV technician for help. Radiation Exposure Statement This device complies with FCC radiation exposure limits set forth for an uncontrolled rolled environment. This device should be installed and operated with a minimum distance of 20cm between the radiator and your body. The OEM integrator is re-
sponsible for ensuring that the end-user has no manual instructions to remove or install the module. Important Note This radio module must not be installed to co-locate and operate simultaneously with other radios in the host system except following FCC multi-transmitter product procedures. Additional testing and device authorization may be required to operate simultaneously with other radios. 29 / 31 8 Appendix: Statement The availability of some specific channels and/or operational frequency bands are country dependent and are firmware programmed at the factory to match the in-
tended destination. The firmware setting is not accessible to the end-user. The host product manufacturer is responsible for compliance with any other FCC rules that apply to the host not covered by the modular transmitter grant of certifi-
cation. The final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed. The separate approval is required for all other op-
erating configurations including portable configurations with respect to Part 2.1093 and different antenna configuration. The end-user manual shall include all required regulatory information/warnings as shown in this manual, including This product must be installed and operated with a minimum distance of 20 cm between the radiator and user body. This device has got an FCC ID: 2ANDL-ZS24-U. The end product must be labeled in a visible area with the following: Contains Transmitter Module FCC ID: 2ANDL-ZS24-
U. This device is intended only for OEM integrators under the following conditions:
The antenna must be installed such that 20cm is maintained between the antenna and users, and the transmitter module may not be co-located with any other trans-
mitter or antenna. As long as the 2 conditions above are met, further transmitter tests will not be re-
quired. However, the OEM integrator is still responsible for testing their end product for any additional compliance requirements required with this module installed. Declaration of Conformity European Notice Hereby, Hangzhou Tuya Information Technology Co., Ltd declares that this module product is in compliance with essential requirements and other relevant provisions of Directive 2014/53/EU, 2011/65/EU. A copy of the Declaration of conformity can be found at https://www.tuya.com. 30 / 31 8 Appendix: Statement This product must not be disposed of as normal household waste, in accordance with the EU directive for waste electrical and electronic equipment (WEEE-2012/19/EU). Instead, it should be disposed of by returning it to the point of sale, or to a municipal recycling collection point. The device could be used with a separation distance of 20cm from the hu-
man body. 31 / 31